K4B1G1646C-CF8中文资料
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3.1 x4 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls) ..........................................5 3.2 x8 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls) ..........................................6 3.3 x16 Package Pinout (Top view) : 112ball FBGA Package(96balls + 16 balls of support balls) ......................................7 3.4 FBGA Package Dimension (x4) ...................................................................................................................................8 3.5 FBGA Package Dimension (x8) ...................................................................................................................................9 3.6 FBGA Package Dimension (x16) ...............................................................................................................................10 4.0 Input/Output Functional Description ........................................................................................................................11 5.0 DDR3 SDRAM Addressing .........................................................................................................................................12 6.0 Absolute Maximum Ratings .......................................................................................................................................14 6.1 Absolute Maximum DC Ratings ................................................................................................................................14 6.2 DRAM Component Operating Temperature Range ....................................................................................................14 7.0 AC & DC Operating Conditions .................................................................................................................................14 7.1 Recommended DC operating Conditions (SSTL_1.5) .................................................................................................14 8.0 AC & DC Input Measurement Levels .........................................................................................................................15 8.1 AC and DC Logic input levels for single-ended signals .............................................................................................15 8.2 Differential swing requirement for differntial signals ................................................................................................16
元器件交易网www.cecb2b.com K4B1G04(08/16)46C
1Gb DDR3 SDRAM
1Gb C-die DDR3 SDRAM Specification
Revision 1.0 June 2007
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office.
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where Product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply.
8.2.1 Single-ended requirements for differential signals ............................................................................................17 8.3 AC and DC logic input levels for Differential Signals .................................................................................................18 8.4 Differential Input Cross Point Voltage .......................................................................................................................18 8.5 Slew rate definition for Single Ended Input Signals ...................................................................................................19
Revision History
Revision Month
0.0
January
Year 2007
0.1
June
ຫໍສະໝຸດ Baidu
2007
1.0
June
2007
History
- Revision 0.0 release
- Deleted 800Mbps 5-5-5 speed - Timing Parameters by Speed Grade (13.0) - Input/Output Capacitance (11.0)
* Samsung Electronics reserves the right to change products or specification without notice.
Page 1 of 63
Rev. 1.0 June 2007
元器件交易网www.cecb2b.com
K4B1G04(08/16)46C
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED
- Revision 1.0 specification release.
1Gb DDR3 SDRAM
Page 2 of 63
Rev. 1.0 June 2007
元器件交易网www.cecb2b.com
K4B1G04(08/16)46C
1Gb DDR3 SDRAM
Table Contents
1.0 Ordering Information ....................................................................................................................................................4 2.0 Key Features .................................................................................................................................................................4 3.0 Package pinout/Mechanical Dimension & Addressing .............................................................................................5
元器件交易网www.cecb2b.com K4B1G04(08/16)46C
1Gb DDR3 SDRAM
1Gb C-die DDR3 SDRAM Specification
Revision 1.0 June 2007
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office.
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where Product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply.
8.2.1 Single-ended requirements for differential signals ............................................................................................17 8.3 AC and DC logic input levels for Differential Signals .................................................................................................18 8.4 Differential Input Cross Point Voltage .......................................................................................................................18 8.5 Slew rate definition for Single Ended Input Signals ...................................................................................................19
Revision History
Revision Month
0.0
January
Year 2007
0.1
June
ຫໍສະໝຸດ Baidu
2007
1.0
June
2007
History
- Revision 0.0 release
- Deleted 800Mbps 5-5-5 speed - Timing Parameters by Speed Grade (13.0) - Input/Output Capacitance (11.0)
* Samsung Electronics reserves the right to change products or specification without notice.
Page 1 of 63
Rev. 1.0 June 2007
元器件交易网www.cecb2b.com
K4B1G04(08/16)46C
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED
- Revision 1.0 specification release.
1Gb DDR3 SDRAM
Page 2 of 63
Rev. 1.0 June 2007
元器件交易网www.cecb2b.com
K4B1G04(08/16)46C
1Gb DDR3 SDRAM
Table Contents
1.0 Ordering Information ....................................................................................................................................................4 2.0 Key Features .................................................................................................................................................................4 3.0 Package pinout/Mechanical Dimension & Addressing .............................................................................................5