The Electronic Packaging Handbook_电子封装手册_Contents

“Frontmatter”The Electronic Packaging Handbook Ed. Blackwell, G.R.Boca Raton: CRC Press LLC, 2000Library of Congress Cataloging-in-Publication DataThe electronic packaging handbook/edited by Glenn R. Blackwell.p. cm. — (The electrical engineers handbook series)Includes bibliographical references.ISBN 0-8493-8591-1(alk. paper)1. Electronic packaging Handbooks, manuals, etc.I. Blackwell,Glenn R.II. Series.TK7870.15.E44 1999621.381′046—dc2199-41244CIP This book contains information obtained from authentic and highly regarded sources. Reprinted material is quoted with permission, and sources are indicated. A wide variety of references are listed. Reasonable efforts have been made to publish reliable data and information, but the author and the publisher cannot assume responsibility for the validity of all materials or for the consequences of their use.Neither this book nor any part may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying, microfilming, and recording, or by any information storage or retrieval system, without prior permission in writing from the publisher.All rights reserved. Authorization to photocopy items for internal or personal use, or the personal or internal use of specific clients, may be granted by CRC Press LLC, provided that $.50 per page photocopied is paid directly to Copyright Clearance Center, 222 Rosewood Drive, Danvers, MA 01923 USA. The fee code for users of the Transactional Reporting Service is ISBN 0-8493-8591-1/00/$0.00+$.50. The fee is subject to change without notice. For organizations that have been granted a photocopy license by the CCC, a separate system of payment has been arranged.The consent of CRC Press LLC does not extend to copying for general distribution, for promotion, for creating new works, or for resale. Specific permission must be obtained in writing from CRC Press LLC for such copying.Direct all inquiries to CRC Press LLC, 2000 N.W. Corporate Blvd., Boca Raton, Florida 33431.Trademark Notice: Product or corporate names may be trademarks or registered trademarks, and are used only for identification and explanation, without intent to infringe.© 2000 by CRC Press LLCNo claim to original U.S. Government worksInternational Standard Book Number 0-8493-8591-1Library of Congress Card Number 99-41244Printed in the United States of America 1 2 3 4 5 6 7 8 9 0Printed on acid-free paperPreface The Electronic Packaging Handbook is intended for engineers and technicians involved in the design, manufacturing, and testing of electronic assemblies. The handbook covers a range of applied technologies and concepts that are necessary to allow the user to follow reasonable steps to reach a defined goal. The user is encouraged to follow the steps of concurrent engineering, which considers aspects of design, manufacturing, and testing during the design phase of a project and/or product.Each chapter begins with an introduction, which includes a Where Else? section. Because the topics considered in this handbook are interactive, this section guides the reader of a particular chapter to other sections of the handbook where similar issues are discussed.The Electronic Packaging Handbook is the latest in a series of major electrical/electronics engineering handbooks from CRC Press, including several that are published jointly with the IEEE Press:•The Electronics Handbook, Jerry C. Whitaker•The Electrical Engineering Handbook, 2nd ed., Richard C. Dorf•The Circuits and Filters Handbook, Wai-Kai Chen•The Control Handbook, William S. Devine•The Mobile Communications Handbook, Jerry D. Gibson•The Transforms and Applications Handbook, Alexander D. PoularikasThis handbook covers a subset of the topics that exist in Whitaker’s The Electronics Handbook, and as such covers the included topics in more detail than that handbook, while restricting coverage to only topics directly related to electronics packaging. Electronics packaging continues to include expanding and evolving topics and technologies, as the demands for smaller, faster, and lighter products continue without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging, such as electronic, mechanical, and thermal designers, and manufacturing and test engineers, are all interdependent on each other’s knowledge. This handbook will assist each group in understanding other areas.OrganizationThe two introductory chapters of this handbook are intended to provide an overview to the topics of project management and quality, and to surface mount technology generally. Following chapters then present more detailed information about topics needed to successfully design, manufacture, and test the packaging for an electronic product:1.Fundamentals of the Design Process2.Surface Mount T echnology3.Integrated Circuit Packages© 2000 by CRC Press LLC4.Direct Chip Attach5.Circuit Boards6.EMC and Printed Circuit Board Design7.Hybrid Assemblies8.Interconnects9.Design for Test10.Adhesive and Its Application11.Thermal Management12.Testing13.Inspection14.Package/Enclosure15.Electronics Package Reliability and Failure Analysis16.Product Safety and Third-Party CertificationThe last two chapters cover reliability and failure analysis issues, which are necessary to understand both failure mechanisms, and also analysis of failed products and the safety issues that must be considered for any product that is intended to be sold to corporate or public consumers.The index is complete and was developed by the chapter authors. This index will be of great value to the reader in identifying areas of the book that cover the topics of interest.This handbook represents a multi-year effort by the authors. It is hoped that the reader will both benefit and learn from their work.Glenn R. Blackwell © 2000 by CRC Press LLCContributorsBruce C. Beihoff Rockwell AutomationAllen BradleyMilwaukee, WIGlenn R. Blackwell Purdue UniversityW. Lafayette, INConstantin Bolintineanu Digital Security Controls, Ltd. Toronto, Ontario, Canada Garry GrzelakTeradyne Telecommunications Deerfield, IL Steli LoznenThe Standards Institution of IsraelTel Aviv, IsraelJanet K. LumppUniversity of KentuckyLexington, KYVictor MeeldijkDiagnostic/Retrieval Systems Inc.Oakland, NJMark I. MontroseMontrose Compliance Services, Inc.Santa Clara, CARay PrasadRay Prasad Consultancy, Inc.Portland, ORMichael C. ShawDesign and ReliabilityDepartmentRockwell Science CenterThousand Oaks, CAPeter M. StipanRockwell AutomationAllen-BradleyMilwaukee, WI© 2000 by CRC Press LLCContents1Fundamentals of the Design ProcessGlenn R. Blackwell2Surface Mount TechnologyGlenn R. Blackwell3Integrated Circuit PackagesVictor Meeldijk4Direct Chip AttachGlenn R. Blackwell5Circuit BoardsGlenn R. Blackwell6EMC and Printed Circuit Board DesignMark I. Montrose7Hybrid AssembliesJanet K. Lumpp8InterconnectsGlenn R. Blackwell9Design for TestGlenn R. Blackwell10Adhesive and Its ApplicationRay Prasad11Thermal ManagementGlenn R. Blackwell12TestingGarry Grzelak and Glenn R. Blackwell© 2000 by CRC Press LLC13InspectionGlenn R. Blackwell14Package/EnclosureGlenn R. Blackwell15Electronics Package Reliability and Failure Analysis: A Micromechanics-Based ApproachPeter M. Stipan, Bruce C. Beihoff, and Michael C. Shaw16Product Safety and Third-Party Certification Constantin Bolintineanu and Steli LoznenAppendix A: Definitions© 2000 by CRC Press LLC。