1390-0;1390-2;中文规格书,Datasheet资料
ASP-134602-01;中文规格书,Datasheet资料
ITEM NO. 1 2 3
PART NUMBER SEAM-40-02.0-10-A NEW-SUB-T-1M36-02.0-S-2 K-DOT-.404-.500-.005
QUANTITY 1.0000 400.00 1.0000 1.0000
MATERIAL LCP UL 94 V0, COLOR: BLACK COPPER ALLOY / LEAD FREE SOLDER POLYIMIDE FILM CONDUCTIVE POLYMER
.060 1.52 REF
.044 1.12 REF
BY SIGNING THIS DOCUMENT YOU ARE ACCEPTING THE CONDITIONS SET WITHIN. YOUR REQUIREMENTS MUST BE LISTED WITHIN THIS DRAWING. WHERE NO DIRECTION FROM THE CUSTOMER IS IDENTIFIED SAMTEC'S PROCESS REQUIREMENTS WILL BE USED.
C1
2
1
.011 0.28 REF .009 [.23]
C7
.123 3.12 REF
2.196 55.78 REF
.002±.003 0.05±0.08 (SEE NOTE 5 & 6)
40
C2
1.9500 49.530 .0500 1.270 .404 10.25 (TYP)
"C"
01 A B C D E F G H J K
01
2.835 72.00 REF
4
40 "D" "D"
氢氧化钠
中文名: 氢氧化钠;烧碱;火碱;苛性钠英文名: Sodium hydroxide别名: Caustic soda分子结构:分子式: NaOH分子量: 40.00物理化学性质熔点:318ºC沸点:1390ºC水溶性:可溶密度:2.13性质描述:氢氧化钠(1310-73-2)的性状：1.白色半透明块状或粒状固体，无臭。
2.熔点318.4℃，沸点1390℃，相对密度2.13。
3.易溶于水、乙醇和甘油，不溶于乙醚、丙酮。
4.在水中的溶解度：0℃为42%，20℃为109%，100℃为347%。
5.溶于水时，放出大量的热。
6.在空气中极易潮解，并吸收CO2生成碳酸钠。
7.有强碱性和很强的腐蚀性，属于毒药，1.95g可使人致死，兔经口LD50 500mg/kg。
8.ADI不限(No limited，FAO/WHO，1994)。
有强烈的腐蚀性，有吸水性，可用作干燥剂，但是，不能干燥二氧化硫、二氧化碳和氯化氢气体。
且在空气中易潮解(因吸水而溶解的现象，属于物理变化)；溶于水，同时放出大量热。
其熔点为318.4℃。
除溶于水之外，氢氧化钠还易溶于乙醇、甘油；但不溶于乙醚、丙酮、液氨。
其液体是一种无色，有涩味和滑腻感的液体。
氢氧化钠在空气中可与二氧化碳反应而变质！2NaOH+CO2=Na2CO3+H2ONa元素与水反应(与水反应时，应用烧杯并在烧杯上加盖玻璃片，反应时钠块浮在水面上，熔成球状，游于水面，有"嘶嘶"的响声，并有生成物飞溅)，生成强碱性NaOH溶液，并放出氢气。
固体NaOH中OH以O-H共价键结合，Na与OH以强离子键结合，溶于水其解离度近乎100%，故其水溶液呈强碱性，可使无色的酚酞试液变成红色，或使PH试纸、紫色石蕊溶液等变蓝。
纯的无水氢氧化钠为白色半透明，结晶状固体。
氢氧化钠极易溶于水，溶解度随温度的升高而增大，溶解时能放出大量的热，288K时其饱和溶液浓度可达16.4mol/L(1:1)。
HP DesignJet T1600 打印机系列数据表说明书
DatasheetHP DesignJet T1600 Printer seriesDESIGNED TO DELIVER—Extraordinary performance to move projects forwardEXPERIENCE SIMPLICITY—At the high-endUNLEASH PERFORMANCE—To turn design into deliveryAdopt a smart workstyle with the easiest PDF Showcase design versatility from precise line drafts to boldly coloured 3D renders, with HP Bright Office Inks.Provide the highest accuracy and display the finest details with the unique Adobe PDF Print Engine.3Meet deadlines with the fastest speed up to 180D/hr , and dual roll option.Cut out unproductive tasks with integrated automatic print stacking, up to 100 pages.Rely on the best network protection withfeatures like HP Secure Boot and whitelisting.Control who accesses the printer and its confidential documents with secure user authentication.Keep your fleet secure at any time with HP JetAdvantage Security Manager.For more information, please visit /go/designjett1600Dynamic security enabled printer. Only intended to be used with cartridges using an HP original chip. Cartridges using a non-HP chip may not work, and those that work today may not work in the future. More at: /go/learnaboutsuppliesCompared to Canon Direct Print & Share and based on “One Click Print.” Once image is selected, one-click printing when printing the entire file without any modifications to the print settings. Applicable to PDF , JPEG, TIFF ,DWF , HP-GL/2 files.Based on comparable large-format inkjet printers under $12,000 (USD) as of December , 2018. IDC figures show that Canon, Epson, and HP combine for 98% share of this printing category worldwide as of Q3, 2018.Fastest print speed based on sustained printing speeds. Most compact footprint calculated using all devices in "Operation mode" with an Open Basket and the arm of the Screen (front panel) spread out to enable user interaction. Most quiet according to internal HP testing of sound pressure level during operating mode (plain paper , line drawing, Normal mode) compared to published specification of competitive printers. Percentage calculations of noise based on lineal units vs. Canon TX-3000 published spec of 51dB(A).Requires purchase of the HP DesignJet T1600 PostScript® models or optional HP DesignJet PostScript/PDF Upgrade Kit. Highest accuracy and finest details compared to printers without the embedded Adobe technology excluding RIP users, and based on internal HP testing with PDF files containing special fonts, PANTONE® colors, smooth shading, overprint, and transparencies that can only be reproduced using the Adobe PDF Print Engine. The Adobe PDF Print Engine (APPE) is Adobe’s high speed, high fidelity print platform. To learn more, visit /products/pdfprintengine.Requires purchase of the HP DesignJet T1600 PostScript® models or optional HP DesignJet PostScript/PDF Upgrade Kit. Highest accuracy and finest details compared to printers without the embedded Adobe technology excluding RIP users, and based on internal HP testing with PDF files containing special fonts, PANTONE® colours, smooth shading, overprint, and transparencies that can only be reproduced using the Adobe PDF Print Engine. The Adobe PDF Print Engine (APPE) is Adobe’s high speed, high fidelity print platform. To learn more, visit /products/pdfprintengine. Advanced embedded security features are based on HP review of 2019 published embedded security features of competitive printers, as of February 2019.SECURE—World's most secure large-format printer 51printing using HP Click software.Empower your workforce. Easily print and share jobs from the cloud with your mobile device and HP Smart app.Fits your workplace with the most compact footprint and most quiet operation, with up to 87% less noise.224512345Data sheet | HP DesignJet T1600 Printer series Technical specificationsUse Original HP inks and printheads, and HP large format printing materials, toexperience consistent high quality and reliable performance that enable lessdowntime. These critical components are designed and engineered together as anoptimi s ed printing system, and Original HP inks are designed to maxim ise the life ofHP printheads. Protect your HP printer investment by using Original HP inks for fullHP warranty protection. For more information, visit /go/OriginalHPinks.C6810AC6810A HP Bright White Inkjet Paper (FSC® certified) (recyclable) 914 mm x 91.4 m(36 in x 300 ft)C6980AC6980A HP Coated Paper (PEFC™ certified) (recyclable) 914 mm x 91.4 m (36 in x300 ft)L5C80AL5C80A HP Universal Heavyweight Coated Paper, 3-in Core (FSC® certified)(recyclable) 914 mm x 91.4 m (36 in x 300 ft)D9R28AD9R28A HP Everyday Matte Polypropylene, 3-in Core 914 mm x 61 m (36 in x 200 ft)Service and SupportFor the entire HP Large Format Printing Materials portfolio, please see.ECO highlightsSave paper with automatic print settings and image nestingENERGY STAR® certified and EPEAT® registeredFree, convenient HP ink cartridge recyclingFSC®-certified papers, recyclable HP media; some HP media eligible for take-back program45454512345Or dering inf orm a tionPr Productoduct3EK10A3EK11A3EK12A3EK13AHP DesignJet T1600 36-in PrinterHP DesignJet T1600 36-in PostScript PrinterHP DesignJet T1600dr 36-in PrinterHP DesignJet T1600dr 36-in PostScript PrinterA c c e s soriesories sOriginal HP printing supOriginal HP printing supplieplies sB3P06AP2V62AP2V63AP2V64A3ED43A3ED44A3ED45AP2V68AP2V69AP2V70A3ED49A3ED50A3ED51AHP 727 Designjet PrintheadHP 730 130-ml Cyan Ink CartridgeHP 730 130-ml Magenta Ink CartridgeHP 730 130-ml Yellow Ink CartridgeHP 730B 130ml Photo Black DesignJet Ink CartridgeHP 730B 130ml Gray DesignJet Ink CartridgeHP 730B 130ml Matte Black DesignJet Ink CartridgeHP 730 300-ml Cyan Ink CartridgeHP 730 300-ml Magenta Ink CartridgeHP 730 300-ml Yellow Ink CartridgeHP 730B 300ml Photo Black DesignJet Ink CartridgeHP 730B 300ml Gray DesignJet Ink CartridgeHP 730B 300ml Matte Black DesignJet Ink CartridgeUB8P0E (1-roll)/UB8T2E (2-roll) HP 3 year NBD Onsite HW Support with DMRUB8P1E (1-roll)/UB8T3E (2-roll) HP 4 year NBD Onsite HW Support with DMRUB8P2E (1-roll)/UB8T4E (2-roll) HP 5 year NBD Onsite HW Support with DMRUB8P3PE (1-roll)/UB8T5PE (2-roll) HP 1 year Post Warranty NBD Onsite HW Support with DMRUB8P4PE (1-roll)/UB8T6PE (2-roll)HP 2 year Post Warranty NBD Onsite HW Support with DMRU1XV4E HP Preventive Maintenance ServiceH4518E HP Installation Service with Network SetupU7VB9E HP Installation Service for DesignJet Series Moderate levelHP DesignJet Support Services offer installation, maintenance, and extended supportservices (e.g. 2,3, 4 and 5 years). For more information, please visit /go/cpcPrint resolution Up to 2400 x 1200 optimised dpiTechnology HP Thermal InkjetMargins Roll: 3 x 3 x 3 x 3 mmSheet: 3 x 22 x 3 x 3 mmInk types Dye-based (C, M, Y, pK, G); pigment-based (mK)Printheads 1 universal printheadLine accuracy±0.1%Handling Sheet feed, automatic front-loading roll feed, smart roll switching3, integrated output stacker, media bin, automatichorizontal cutterRoll size279 to 914 mmSheet size210 x 279 to 914 x 1219 mmStandard sheets A4, A3, A2, A1, A0Grammage60 to 328 g/m²Interfaces Gigabit Ethernet (1000Base-T), Wi-Fi (with optional Jetdirect accessory), supporting the following standards: TCP/IP,BootP/DHCP (IPv4 only), DHCPv6, TFTP (IPv4 only), SNMP (v1, v2c, v3), Apple Bonjour Compatible, WS Discovery,Embedded Web Server (HTTP, HTTPS), IPsec, SMTP (email), Raw IP printing (9100), LPD, IPP, WS print, NTLM v2, SMBv3,SSL/TLS, 802.1X authentication (LEAP, PEAP, EAP-TLS), DFSPrint languages (standard)PostScript Printer: Adobe PostScript 3, Adobe PDF 1.7, HP-GL/2, HP-RTL, TIFF, JPEG, CALS G4Non-PostScript Printer: HP-GL/2, HP-RTL, TIFF, JPEG, CALS G4Print languages (optional)Non-PostScript Printer: Adobe PostScript 3, Adobe PDF 1.7Printing paths Direct printing from USB flash drive, print from network shared folder, email printing, HP driver for Windows, HP PrintService for Android, Apple AirPrint driver for MacOS and for iOS, HP Print for Chrome OS, HP Click, HP Smart App for iOSand AndroidDrivers PostScript Printer: Raster, PostScript and PDF drivers for Windows, AirPrint for macOSJetAdvantage Security Manager compatible, Secure Disk erase (DoD 5220.22-M), Secure File erase, self-encrypting HDD,Printer1390 x 760 x 1080 mmWhat's in the box HP DesignJet T1600 Printer, printer stand and media bin, spindle(s)5, printheads, introductory ink cartridges, user guide,HP Software and solutions HP Click, HP mobile, ePrint and iOS/Android support plus the HP Smart app for mobile, HP Web Jetadmin, HP JetAdvantageOperating humidity20 to 80% RHStorage temperature-25 to 55ºCSound pressure42 dB(A) (operating), 32 dB(A) (idle), <17 dB(A) (sleep)Consumption100 W (printing); < 36 W (ready); < 1 W (< 10 W with embedded Digital Front End) (sleep); 0.3 W (off)Safety USA and Canada (CSA certified); EU (LVD and EN 60950-1 compliant); Russia, Belarus, Khazakstan (EAC); Ukraine (UA);Singapore (PSB); China (CCC); Argentina (IRAM); Mexico (NYCE); India (BIS)Electromagnetic Compliant with Class B requirements, including: USA (FCC rules), Canada (ICES), EU (EMC Directive), Australia (ACMA), NewZealand (RSM), China (CCC), Japan (VCCI), Korea (KCC)2Please recycle printing hardware and eligible printing supplies and prints. Find out how at our website:/ecosolutions1 ENERGY STAR and the ENERGY STAR mark are registered trademarks owned by the U.S. EnvironmentalProtection Agency.EPEAT® registered where applicable. EPEAT registration varies by country. See for registration status by country.Program availability varies. Please check /recycle for details.BMG trademark license code FSC®-C115319, see . HP trademark license codeFSC®-C017543, see . Not all FSC®-certified products are available in all regions. Forinformation about HP large format printing materials, please visit .Recyclable HP papers can be recycled through commonly available recycling programs, or according toregion-specific practices. Some HP media are eligible for return through the HP Large Format Mediatake-back program. Programs may not exist in your area. See/hp/ecosolutions for details.Mechanical printing time. Printed in Fast mode with Economode on, using HP Bright White Inkjet Paper(bond) and Original HP inks.±0.1% of the specified vector length or ±0.2 mm (whichever greater) at 23ºC (73ºF), 50-60% relativehumidity, on A0/E HP Matte Film in Best or Normal mode with Original HP inksApplicable for dual-roll printers only.Based on 4 GB RAM.Single-roll printers come with one spindle, dual-roll printers come with two spindles.BMG trademark license code FSC®-C115319, see . HP trademark license codeFSC®-C017543, see . BMG trademark license code PEFC™/29-31-261, see. HP trademark license code PEFC™/29-31-198, see . Not allFSC®- or PEFC™-certified products are available in all regions.Can be recycled through commonly available recycling programs.23451234567© Copyright 2020 HP Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services.Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.4AA7-5220EEP ap-en August 20203JN69A5NB95A5NB95AAEC0C66CCN538AG6H50BG6H51BL4R66AN7P47AAHP Jetdirect 3100w BLE/NFC/Wireless AccessoryHP SmartTracker USB for DesignJetHP SmartTracker for DesignJetHP DesignJet PostScript/PDF Upgrade KitHP DesignJet 3-in Core AdapterHP SD Pro 44-in ScannerHP HD Pro 42-in ScannerHP DesignJet 36-in SpindleHP USB 3.0 to Gigabit LAN Adapter。
LDEExxxx中文资料
Series Rated voltage (C = 50Vdc) Size code (D = 22.20) Capacitance = 0.47μF Tolerance (J = 5%) Dielectric (A = PEN) Version (5 = standard) Packing (N= Tape) Internal use
28.24
7.1
6.1
1000
40.30
10.2
7.6
1000
50.40
12.7
10.2
500
60.54
15.2
13.7
500
All dimensions are in mm. In accordance with IEC 60286-3. Material used: - Carrier tape: antistatic material - Cover tape: polyester + PE - Reel: recyclable polystyrene All parts in bulk or on reel are packed in hermetically sealed moisture barrier bag (MBB).
L
3.2 3.2 4.5 5.7
W
(mm) 1.6 2.5 3.2 5.1
H max
(mm) 1.1 1.5--2.0 1.7 2.3--2.6 2.3--2.7 3.3 4.2--4.4 3.5 4.5 5.4 3.6 4.5 5.4--5.6 3.6 4--4.5 5.5--5.7 3.6 4.5--4.9 5.5--5.7
浮油回收船全船技术规格书
目录1总体部分 (4)1.1总则 (4)1.2定义 (4)1.3概述 (5)1.4主要参数 (7)1.5总布置概述 (8)1.6主机 (8)1.7主要性能 (9)2船体结构部分 (18)2.1概述 (18)2.2主要构件尺寸 (18)2.3材料、工艺和检验 (18)2.4结构设计说明 (19)3船体舾装部分 (21)3.1概述 (21)3.2锚泊设备 (21)3.3系泊设备 (22)3.4起重设备 (23)3.5桅墙信号 (23)3.6金属门、窗、盖 (23)3.7梯、栏杆、扶手 (24)3.8救生设备 (25)3.9消防杂件 (25)3.10帆布罩 (26)3.11其它 (26)4舱室舾装部分 (27)4.1概述 (27)4.2舱室及舱室设备 (27)4.3小五金、纺织品及用品 (29)4.4舱室绝缘 (30)4.5甲板敷料 (31)4.6防火门与非金属门 (32)4.7贮藏室 (32)4.8航行设备 (32)4.9船舶标志 (33)4.10舱室舾装备品、供应品 (34)4.11油漆 (34)4.12防腐蚀锌板 (35)5轮机 (36)5.1概述 (36)5.2舱的分隔 (36)5.3主要设备 (37)5.4辅助设备 (41)5.5管系要求 (47)5.6动力系统 (49)5.7船舶系统 (51)5.8绝热和油漆 (56)5.9减振与降噪 (56)5.10机修设备及其它 (57)5.11监测报警 (57)6电气部分 (59)6.1总则 (59)6.2电源装置 (60)6.3配电装置 (61)6.4电缆 (63)6.5电力拖动与控制 (64)6.6照明 (64)6.7船内通信设备 (66)6.8船舶和乘员安全设备 (68)6.9航行设备 (70)6.10无线电设备 (73)6.11控制台 (74)6.12自动化系统 (75)6.13娱乐设备 (76)1总体部分1.1总则本说明书和轮机说明书、电气说明书及其附图的目的是叙述一艘双机双桨推进，可航行于近海航区的浮油回收船的设计、图纸审查、材料、结构、设备、工具、备件、建造、检验、试验、监督、下水、试航、交船等方面的技术说明和要求。
盐酸MSDS-安全技术说明书
盐酸 MSDS化-学品安全技术说明书第一部分：化学品名称化学品中文名称：盐酸化学品英文名称：hydrochloric acid中文名称2：氢氯酸英文名称2： chlorohydric acid技术说明书编码：995CAS No. ： 7647-01-0分子式： HCl分子量： 36.46第二部分：成分/ 组成信息有害物成分含量CAS No.盐酸36%7647-01-0第三部分：危险性概述危险性类别：侵入途径：健康危害：接触其蒸气或烟雾，可引起急性中毒，出现眼结膜炎，鼻及口腔粘膜有烧灼感，鼻衄、齿龈出血，气管炎等。
误服可引起消化道灼伤、溃疡形成，有可能引起胃穿孔、腹膜炎等。
眼和皮肤接触可致灼伤。
慢性影响：长期接触，引起慢性鼻炎、慢性支气管炎、牙齿酸蚀症及皮肤损害。
环境危害：对环境有危害，对水体和土壤可造成污染。
燃爆危险：本品不燃，具强腐蚀性、强刺激性，可致人体灼伤。
第四部分：急救措施皮肤接触：立即脱去污染的衣着，用大量流动清水冲洗至少15 分钟。
就医。
眼睛接触：立即提起眼睑，用大量流动清水或生理盐水彻底冲洗至少15 分钟。
就医。
吸入：迅速脱离现场至空气新鲜处。
保持呼吸道通畅。
如呼吸困难，给输氧。
如呼吸停止，立即进行人工呼吸。
就医。
食入：用水漱口，给饮牛奶或蛋清。
就医。
第五部分：消防措施危险特性：能与一些活性金属粉末发生反应,放出氢气。
遇氰化物能产生剧毒的氰化氢气体。
与碱发生中合反应，并放出大量的热。
具有较强的腐蚀性。
有害燃烧产物：氯化氢。
灭火方法：用碱性物质如碳酸氢钠、碳酸钠、消石灰等中和。
也可用大量水扑救。
第六部分：泄漏应急处理应急处理：迅速撤离泄漏污染区人员至安全区，并进行隔离，严格限制出入。
建议应急处理人员戴自给正压式呼吸器，穿防酸碱工作服。
不要直接接触泄漏物。
尽可能切断泄漏源。
小量泄漏：用砂土、干燥石灰或苏打灰混合。
也可以用大量水冲洗，洗水稀释后放入废水系统。
大量泄漏：构筑围堤或挖坑收容。
1435-2;1431-1;1431-2;1420-1;1420-2;中文规格书,Datasheet资料
M I C R O J A C K S98density packaging•Beryllium Copper multi-spring contact maintains retention after multiple insertions•Ideal for mounting transistors,re-sistors,diodes,IC’s and similar miniature components•Custom micro jacks manufactured to your specifications •Other platings available upon request.016 [0.41].083[2.11].055[1.40]L3-FINGER CLOSED ENTRY CONTACT.038[0.96].038[0.96]HEX ..020[0.50].130 [3.3].095 [2.4]L.072[1.9].045[1.14]4-FINGER CLOSED ENTRY CONTACT.056[1.42].049[1.24].041[1.04].063[1.60]4-FINGER CLOSED ENTRY CONTACT.205[5.2].089[2.23].248[6.3]4-FINGER CLOSED ENTRY CONTACT.120[3.1].259[6.6].233[5.9].060[1.52]DIA..014[0.4].077[2.0]DIA..015(.38)-.021(.53)PIN -SOLDER MOUNT.015(.38)-.021(.53)PIN -PRESS FIT.015(.38)-.025(.64)PIN -TAPER-FIT.022(.56)-.032(.81)PIN -SOLDER MOUNT.015(.38)-.025(.64)PIN -SOLDER MOUNT.015(.38)-.025(.64)PIN -SOLDER MOUNT.022(.56)-.034(.86)PIN -PRESS FIT.025(.64)-.037(.94)PIN -PRESS FIT.025(.64)-.037(.94)PIN -SOLDER MOUNT.055[1.39].072[1.83].016 [0.41]4-FINGER CLOSED ENTRY CONTACT.093 [2.36].142[3.6].161[4.1]RoHS NON-RoHS Mtg.GOLD/GOLD TIN/TIN TIN/GOLD L Hole CAT.NO.CAT.NO.CAT.NO.Length Dia.1411-11431-11420-1.140(3.6).0421411-21431-21420-2.170(4.3)(1.07)RoHS NON-RoHS Mtg.GOLD/GOLD TIN/TIN TIN/GOLD L Hole CAT.NO.CAT.NO.CAT.NO.Length Dia.1412-11432-11468-1.140(3.6).0401412-21432-21468-2.170(4.3)(1.02)1412-31432-31468-3.282(7.2)RoHS NON-RoHS Mtg.GOLD/GOLD TIN/TIN TIN/GOLD L Hole CAT.NO.CAT.NO.CAT.NO.Length Dia.1415-11435-11469-1.160(4.1).0551415-21435-21469-2.190(4.8)(1.40)RoHS NON-RoHS Mtg.GOLD/GOLD TIN/TIN TIN/GOLD Hole CAT.NO.CAT.NO.CAT.NO.Dia.169316941695.063(1.60)RoHS NON-RoHS Mtg.GOLD/GOLD TIN/TIN TIN/GOLD Hole CAT.NO.CAT.NO.CAT.NO.Dia.141314331470.059(1.50)RoHS NON-RoHS Mtg.GOLD/GOLD TIN/TIN TIN/GOLD Hole CAT.NO.CAT.NO.CAT.NO.Dia.160316061607.052(1.32).061 [1.55].015[0.38].028[0.71].091 [2.3].086[2.2].170[4.3].200[5.1].070 [1.78]KNURL6-FINGER CLOSEDENTRY CONTACT6-FINGER CLOSED ENTRY CONTACT.057[1.45].077[1.96].083[2.11].025[0.7]L.025(.64)-.037(.94)PIN -SOLDER MOUNTRoHS NON-RoHS Mtg.GOLD/GOLD TIN/TIN TIN/GOLD Hole CAT.NO.CAT.NO.CAT.NO.Dia.141614361471.067(1.70)RoHSNON-RoHS Mtg.GOLD/GOLD TIN/TIN TIN/GOLD L Hole CAT.NO.CAT.NO.CAT.NO.Length Dia.1626-11614-11619-1.095(2.4).0621626-21614-21619-2.105(2.7)(1.57)1626-31614-31619-3.155(3.9).045 [1.14].062[1.57].090[2.29]6-FINGER CLOSED ENTRY CONTACT.080 [2.03].083 [2.11].022(.56)-.034(.86)PIN -SOLDER MOUNTRoHS NON-RoHS Mtg.GOLD/GOLD TIN/TIN TIN/GOLD Hole CAT.NO.CAT.NO.CAT.NO.Dia.165816591673.065(1.65).128[3.3].168[4.3].040 [1.02].092 [2.34].065 [1.65]L.200[5.1].230[5.9]4-FINGER CLOSED ENTRY CONTACT.125 [3.2].032(.81)-.046(1.17)PIN -SWAGE MOUNTRoHS NON-RoHS Mtg.GOLD/GOLD TIN/TIN TIN/GOLD Hole CAT.NO.CAT.NO.CAT.NO.Dia.359035913592.065(1.65)RoHS NON-RoHS Mtg.GOLD/GOLD TIN/TIN TIN/GOLD Hole CAT.NO.CAT.NO.CAT.NO.Dia.169716981699.063(1.60)RoHSNON-RoHS Mtg.GOLD/GOLD TIN/TIN TIN/GOLD L Hole CAT.NO.CAT.NO.CAT.NO.Length Dia.1419-11439-11478-1.062(1.6).0691419-21439-21478-2.094(2.4)(1.75)PLATING OPTIONSCONTACT PLATING BODY SPRING RoHS Gold/Gold Gold Gold Compliant Tin/Tin Tin/Lead Tin/Lead Non-CompliantTin/GoldTin/LeadGoldBody:Brass,ASTM-B16Spring:Beryllium Copper(QQ-C-533).057[1.45]HEX.057[1.45]DIA..200[5.1].020[0.52].078[1.98]DIA.6-FINGER CLOSED ENTRY CONTACT.165[4.2].078[1.98].040[1.02].090[2.29].040[1.02].062[1.57].210[5.3].187[4.7].180[4.6]6-FINGER CLOSED ENTRY CONTACTRoHS Plating:Gold:.000010per MIL-G-45204(RoHS Compliant)Tin/Lead:.000200to.000300per MIL-T-10727,Type 1(Non-RoHS Compliant).038[0.96]3-FINGER CLOSED ENTRY CONTACTL .055[1.40].083[2.11].016[0.41]RoHS Tel (718)956-8900•Fax (718)956-9040(800)221-5510•kec@31-0720th Road –Astoria,NY 11105-2017RoHS COMPLIANT ~ISO 9001CERTIFIED®分销商库存信息:KEYSTONE-ELECTRONICS1435-21431-11431-2 1420-11420-21470 1411-11411-21435-1 1469-11469-21614-3 1468-11468-21607 16951619-31606 169414711699 1415-11415-21413 359116981659 359216031432-1 1432-21432-31673 1468-316581697 1614-214161619-1 1619-216933590 1626-11626-21626-3 1412-11412-21412-3 1439-11439-21478-2 1419-21419-1。
DPM02规格书
EM-1M12:Drawing No.Part Name :MARUWA CO., LTD.Y.Morikawa Drafting Decision T.Ikoma To ： Skyworth：Characteristics Specification ：Packaging Specification EM-2B09EM-2B10：SpecificationApproval D.FunoEM-1M13：Handling SpecificationNo.TEQ-2B08TECHNICAL REPORT2 in 1 type Inductor for Class-D audio power amplifier ICDate: Feb .22.2012DPM021.ApplicationThis specification applies to 2 in 1 type Inductor for Class-D audio power amplifier IC used for distortion percentage which is equal to the LC filter. These Products conform to the RoHS Directive.2.Part number system ・・・Product Series ・・・Running Numbers3.Part Number List ・ Specification4.Dimensions5.Equivalent circuit-40～+85℃Impedance (Ω at 100MHz)65±25%Rated Current(Adc)5DC resistance(mΩ)5Feb.22.2012Drafting DateCheckedApprovedPart number Type②DPM02①DPM 02Y.MorikawaT.Ikoma D.Funo①②DPM02Operating temp.6.Recommended P.C. board pattern7.SolderingSoldering (Reflow exclusive use)・As for the soldering, go to reference in the following temperature pattern.･ This part is a lead free solder corresponding product.Condition of the recommendation of the reflow soldering.8.Impedance frequency characteristicsunit ： mm℃501.Electrical PerformanceImpedance 65±25%Test Frequency：100MHz(|Z|)(at 100MHz)Insulation 10MΩRated voltage is applied for 1min.±5sec.Resistance (I.R.)DC Resistance 5mΩMeasuring Current：100mA max.(Rdc)Withstanding No damage or insulation breakdown.250% of rated voltage applied for to 5sec.Voltage1.11.41.2DPM02Drafting Y.Morikawa Checked1.3T.Ikoma DateFeb.22.2012ApprovedD.FunoNo.ItemSpecificationsTest methodTypeSolderabilityAt least 95% of the termination on Soldering temperature : 230℃±5℃(Terminal)each should becovered with solder.Immersion time : 3±1sec.Soldering heat 1.Visual : No mechanical damage.Soldering comdition (reflow)resistance2.Z change values ： within ±30%Temperature1.Visual : No mechanical damage.cycle2.Z change values ： within ±30%Temperature cycle specified in table below.This cycle is repeated 25 times.High temp. 1.Visual : No mechanical damage.Test temp： 85±3℃resistanceTest time ： 500, +24, -0hrs.2.Z change values ： within ±30%Humidity 1.Visual : No mechanical damage.Relative humidity ： 90～95%resistanceTest temp ： 40±2℃2.Z change values ： within ±30%Test time ： 500, +24, -0hrs.Solvent resistance1.Visual : No mechanical damage.Solvent ： IPASolvent temp ： 20～25℃2.Z change values ： within ±30%Dipping time ： 30±5secNo.Item SpecificationsTest methodTemperaturetime.2.72.92.8Minimum operating temp.Room temp.Maximum operating temp.330min.45min.Room temp.130min.25min.2.42.52.6Step1.ApplicationThis spacification applies to 2 in 1 type Inductor for Class-D audio power amplifier IC DPM03.2.Taping package2.1.Plastic carrier tape〔unit ： mm〕Drafting Y.Morikawa CheckedT.Ikoma DateDec.12.2011ApprovedD.FunoTypeDPM Series2.2.Plastic Reel Dimension2.3.Cover tape adhesion strengthWhen the cover tape is pulled off under the above conditions, the cover tape adhesion strength should be as follows.adhesion strength : 0.3～0.5NAB C TypeReel size E D DPM RRM16D φ330+0, -3φ80+2, -0φ21.0±0.8 2.0±0.5Type Reel size W1W2R DPMRRM16D17.5±1.021.5±1.01.0φ13.0±0.22.4.Taping standard①Taping must have a lead and empty segments as shown below.②Product adhesion to cover tapeProduct should not stick to either the tape or bottom cover tape③When the top cover tape is released, there should be no any difficulty in takingout the product from the tape because of clearance troubles. Also there should be no tape troubles that will cause nozzle clogging.④When the top cover tape is released, the adhesive should remain on the cover tape.2.5.Items described on labelShipping label・Customer's part number(Part No.)・Packaging quantity(Q'ty)・Order number(Ref. No.)2.6.Items described on shipping box・Customer name(Customer)・Part number(Item)・Customer's machine name(Model No.)・Packaging quantity(Q'ty)・Order number(Order No.)・Received order number(Ref. No.)・Customer's part number(Part No.)・Delivery date(Date) 2.7.Packaging quantityType Packaging quantityDPM1000pcs./reel■Notes of use1.Please use the voltage impressed to the capacitor below the ratings voltage.Moreover, the harmony of the cusp voltage value must become below the ratings voltagefor the voltage that the exchange voltage is superimposed to the direct current voltage.When the voltage is reduced and used, the failure rate can be greatly decreased.（Uw/UR）3 when using it by the rated voltage is decreased to three according to three multiplication rule of the electric field the failure rate when UR and doing because it is done Uw and the rated voltage of the working voltage.2.About the environment usedSurrounding environment(weather resistance)Is use in the environment that enters splashing of water or direct salt water to the inductor, and the state of the be dewy Short, and the capacitor and the circuit might be destroyed.Moreover, use in the environment with which the harmful gas (hydrogen sulfide, sulfurous acid, chlorine, and ammonia, etc.) is filled has the thing that the electrode of the inductor corrodes.Surrounding environment(impact)Please consult after presenting the condition when the vibration or the impact condition uses it in an extreme place where the stipulated range of the catalog or the product specification and the performance specifications is exceeded.3.About the circuit design(use temperature)The insulation resistance and impedance of the inductor might decrease when the catalog or the product specification and the highest use temperature of the performance specifications are exceeded and used and a rapid current increase and the short-circuit be generated.The inductor and there is as a factor that the temperature rises in the following cases.When the temperature outside the set rises (It is high)When heat in the set accumulates, and the temperature rises (It is high).The heat source is installed in the neighborhood of the inductor,and when you receive the heat emission and the conduction of heat from the heat source.4.About the substrate design(inductor arrangement of crack board substrate)Next, the example of recommending the inductor arrangement that the mechanical stress doesn't join the warp and the bend of the substrate as much as possible is shown.Please arrange parts in transverse forthe direction where the stress acts.b)a)b)c)Itema)TypeDPM Series Drafting Y.Morikawa CheckedT.Ikoma DateDec.12.2011ApprovedD.Funoa)Warp of substrateCase that wants to be avoidedImprovement case by pattern divisionThe mechanical stress changes by the installation position of the inductor in the vicinity of the crack board, and refer to the following figure, please.The size of the mechanical stress received to the capacitor comes to divide the substrate in order of pushback < slit <V ditch < perforated line, and consider the division method at the same time as arranging the inductor, please.5.About mounting(adjustment of mounting machine)Excessive power joins the inductor when mounting, it causes the crack, and use it referring to the following thing,please when the bottom dead center of the suck nozzle is too low.Please mend the warp of the substrate, and adjust the bottom dead center of the suck nozzle on the substrate.Please give the nozzle pressure when it mounts to me by static load as 1～3N.Please allot the support pin to the back of the substrate to reduce the bend of the substrate as much as possible by the impact of the suck nozzle, and suppress the bend of the substrate.Please note that it causes the crack when the substrate bends when Lead parts are inserted.d)One side mountingb)c)a)b)c)Case that wants to be avoidedRecommended caseItem6.About the substrate washing（Substrate washing）The inductor is selected, and please clarify the washing purpose (The flux of soldering, remove it though it adhered in other processes) and select the cleaning solutionwhen you wash the substrate after the installation.When the cleaning solution is improper, the performance of the inductor (especially, insulation resistance)might be deteriorated by the thing that the residue of flux and other foreign bodies adhere to the inductor.Please confirm the thing that there is no influence in the performance of the inductorby a real wet scrubber and decide the washing condition.When the condition is washing inapposite (inadequate cleaning and wash excessive),The performance of the inductor might be ruined.①In case of the inadequate cleaning1)The corrosion of the metal of the terminal electrode etc. might be caused bythe material of the halogen system in the flux residue.2)The material of the halogen system in the flux residue might adhere to the surface of the inductor,and the insulation resistance decrease.3)As for the water solubility flux, the tendency to (1) and (2) might be more remarkable than that of rosin system flux.②At the time of an excessive washingThe substrate resonates when the output is too large for the ultrasonic cleansing,the crack is generated by the vibration of the substrate in the main body and the solder of the inductor, and it goes on the following condition because strength of the terminal electrode might be decreased.Supersonic wave output：20W/L or lessUltrasonic frequency：40kHz or lessSupersonic wave washing time：5 min. or lessThe density such as the separating halogens might rise when the cleaning solution is polluted,and the result similar to the inadequate cleaning be invited.7.About soldering(selection of flux)The content of a halogen system material must use 0.1wt% (C・conversion) following for flux. Moreover, please do not use the one with strong acidity.Please make the flux when the inductor is soldered with the substrate a minimum requirement.Please avoid the use of the water solubility flux as much as possible.c)a)a)b)8.Recommended soldering conditionRecommended reflow soldering Please give hold time to me as time after the inductor surface temperature reachesat the above-mentioned temperature.The temperatures fluctuate of preheating and soldering（⊿T）must become permissible temperatures fluctuate in the table below.The temperature rise speed must become 2～5℃/the sec.The cooling speed must become 1～4℃/the sec.9.About storing and keepingPlease keep under the environment from 40℃ or less in indoor temperature to humidity 70%RH or less, and use the inductor within six months as much as possible.of the terminal electrode. Ping and Pakke. The performance deterioration such as Geng might be accelerated. Please use the one that the time limit passed after confirming soldering.Please avoid and keep the atmosphere of the harmful gas (hydrogen sulfide, sulfurous acid,chlorine, and ammonia, etc.) in the inductor.The reliability of the deterioration of soldering of the terminal electrode etc. might be remarkablydecreased with in the atmosphere or the harmful gas in atmosphere.Please do not keep the inductor in direct sunshine and the be dewy place.It is likely to become deterioration and the performance deteriorated of soldering from the be dewy by a terminal electrode by direct sunshine, a photochemical change of the exterior resin, and a rapid humidity change.Under high temperature high Shime environment, it decreases and Te soldered by the oxidationa)2)3)4)c)d)1)1)b)℃50■Precautions for Safety This product is designed and manufactured on the assumption of a general electronic equipment usage.It is the performance deteriorated and is likely to break down according to the usage.The main body of the inductor generates heat by an excessive current's flowing when breaking down because of a short mode, and circuit board might be damaged by a fire.An extremely advanced quality and reliability are demanded, and therefore, please the breakdown and the malfunction must threaten the life indirectly, and it is likely to reach the damage of the property etc.or consult our company beforehand the possibility of developing with social issues when use to a certain usage, equipment or device is examined might cause harm for the human body.①Airlines and space equipment②Bottom of the sea equipment(work equipment bottom of the sea transponder and in the sea etc.)③Nuclear power control system④Body equipment(The car accessories are included.)⑤Fuel control equipment⑥Other traffic and transport aircraft machine(car, airplane, railway, ship, and traffic signal machine, etc.)⑦Safety device⑧Medical equipment(life-support system etc.)⑨Power generation control equipment⑩Disaster prevention and crime prevention equipment⑪Usage for military affairs and the Defense Agency⑫Information processing equipment(communication infrastructure etc.)⑬Additionally, equipment that quality and reliability equal with the above-mentioned equipment are demanded It must consider enough to the fail safe design (The protection circuit is installed) that doesn't become not safe as a system, and the safety of the product must be secured when safety as end-products when this product breaks down is examined for the circuit design that uses this product, and this product single breaks down.■othersThe name of articles and the specification that has been described to this catalog might discontinue the change or manufacturing without a previous notice for the improvement. Please confirm the contentafter claiming the delivery specifications without fail when you use it.The content of the description of this catalog is a characteristic of the product unit and the one to warrant the quality. Please evaluate and confirm it while mounted on the product used before use.It is not warrantable of the occurring trouble by the use of the characteristic, ratings,and the range of the specification where this catalog has been described disregarding it.Although we have taken all possible measures to ensure the quality and reliability of our products, there is a possibility that accidents causing injury or death, fire or social damage may occur if products are not used as instructed. If you have any questions regarding how to use the products,please consult with our customer service personnel.If problem arises regarding a third party's industrial proprietary rights as a result of using this products, our company will have no liability for the problem except for those related toour products' structure and production method.3)4)5)2)1)2)1)。
SEP 1390 1996 焊缝的弯曲试验(中文版)
SEP 1390：1996焊接的弯曲试验狮子十之八九译1目的焊接弯曲试验是为了检查材料的对裂纹的止裂能力。
为此，应在被检材料试板上熔敷焊道。
然后对试板进行弯曲试验。
其目的是，检查最初出现在焊接金属中的裂纹是否在弯曲时在热影响区或母材区停止扩展。
2适用范围本标准适用于产品厚度等于或者大于30mm，屈服强度最小值235～355N/mm2的可焊接结构钢的焊接弯曲试验。
对于钢板按全厚度取样，对于型钢取翼缘厚度，对于其它产品试样截取位置的厚度作为产品厚度。
3试验单元一个炉批号作为一个试验单元，产品形状和同样热处理的产品按产品厚度≤50mm和>50mm区分。
4试验范围在每个试验单元都要进行焊接弯曲试验。
如果对同一炉批号，产品厚度>50mm，产品形状和同样热处理的试验单元进行了试验，可代替≤50mm单元的试验。
5试样截取根据表１规定尺寸制备试样，试件是在供货状态的产品端部提取，如果可能，根据适用的交货技术条件，在机械试验的试件旁边截取。
型钢试样必须包含一个翼缘的边缘。
在钢板上取样根据制造厂的选择还可以垂直于主轧制方向截取试样（横向试样）。
6试验准备6.1机械加工试样的长边应进行机加工，边缘应倒角或圆角。
突出件，例如型钢筋的残余要加工，那样取的最大厚度的平行的试样，此时必须保留一个轧制表面。
突出部分，如型钢腹板的残余部分，应机械加工去掉，以便形成具有最大可能厚度的平面平行试样。
但是，必须留下一个轧制表面。
如果产品厚度大于50 mm，则应将试样加工至50 mm的厚度。
但是，必须留下一个轧制表面。
也可使用厚度大于50 mm的钢制试样。
钢铁试样的其他要求不受影响。
如果是仲裁，则应使用厚度为50 mm的试样。
在轧制表面一侧，应根据图1制作凹槽。
6.2焊接根据条款6.1，在平焊位置，在图１和表１要求的凹槽中焊接熔敷金属。
如果满足下列条件，在焊接时，在弯曲时在焊道中或在热影响区发现裂纹，这是通常会出现的情况。
— 焊接方法：焊条电弧焊— 焊条型号：根据DIN EN 499，RR（厚药皮）金红石型或低韧性填充金属。
J130092中文资料
1
TO-220 2.Collector 3.Emitter
1.Base
Absolute Maximum Ratings*
Symbol
VCBO VCEO VEBO IC ICP IB PC TJ TSTG Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current (DC) Collector Current (Pulse) Base Current
hFE, DC CURRENT GAIN
1
VBE(sat)
10
0.1
VCE(sat)
1 0.1
1
10
100
0.01 0.1
1
10
100
IC[A], COLLECTOR CURRENT
IC[A], COLLECTOR CURRENT
Figure 1. DC current Gain
Figure 2. Base-Emitter Saturation Voltage Collector-Emitter Saturation Voltage
10.08 ±0.30
18.95MAX.
(3.70)
) (45°
0.50 –0.05
+0.10
2.40 ±0.20
10.00 ±0.20
Dimensions in Millimeters
5 FJP13009 Rev. B
元器件交易网
Conditions
IC = 10mA, IB = 0 VEB = 9V, IC = 0 VCE = 5V, IC = 5A (hFE1) VCE = 5V, IC = 8A IC = 5A, IB = 1A IC = 8A, IB = 1.6A IC = 12A, IB = 3A IC = 5A, IB = 1A IC = 8A, IB = 1.6A VCB = 10V, f = 0.1MHz VCE = 10V, IC = 0.5A VCC = 125V, IC = 8A IB1 = - IB2 = 1.6A, RL = 15,6Ω
AO8814;中文规格书,Datasheet资料
Symbol V DS V GSI DM T J , T STG SymbolTyp Max 648389120R θJL5370Junction and Storage Temperature Range AP D °CT A =70°CI D Pulsed Drain Current BPower Dissipation AT A =25°CContinuous Drain Current AUnits Parameter T A =25°C T A =70°CAbsolute Maximum Ratings T A =25°C unless otherwise noted V V Gate-Source Voltage Drain-Source Voltage °C/W Maximum Junction-to-Ambient A Steady-State °C/W W Maximum Junction-to-Lead CSteady-State°C/WThermal CharacteristicsParameterUnits Maximum Junction-to-Ambient A t ≤ 10sR θJA AO8814Common-Drain Dual N-Channel Enhancement Mode Field Effect TransistorG1S1S1D1/D2G2S2S2D1/D212348765TSSOP-8Top ViewGeneral DescriptionThe AO8814 uses advanced trench technology to provide excellent R DS(ON), low gate charge and operation with gate voltages as low as 1.8V while retaining a 12V V GS(MAX) rating. It is ESD protected.This device is suitable for use as a uni-directional or bi-directional load switch, facilitated by its common-drain configuration.SymbolMin TypMaxUnits BV DSS 20V 1T J =55°C 5I GSS 10µA BV GSO ±12V V GS(th)0.50.711V I D(ON)30A 101316T J =125°C14182211.51518m Ω1316.820m Ω151924m Ω202634m Ωg FS 30S V SD 0.741V I S2.5A C iss 1390pF C oss 190pF C rss 150pF R g1.5ΩQ g 15.4nC Q gs 1.4nC Q gd 4nC t D(on) 6.2ns t r 11ns t D(off)40.5ns t f 10ns t rr 15ns Q rr5.1nCTHIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,FUNCTIONS AND RELIABILITY WITHOUT NOTICE.Maximum Body-Diode Continuous CurrentInput Capacitance Output CapacitanceGate-Source Breakdown Voltage V DS =0V, I G =±250uA V GS =3.6V, I D =6A Turn-On DelayTime DYNAMIC PARAMETERSV GS =0V, V DS =10V, f=1MHz Gate Drain Charge Turn-On Rise Time Turn-Off DelayTime V GS =5V, V DS =10V, R L =1.3Ω,R GEN =3ΩGate resistanceV GS =0V, V DS =0V, f=1MHzTurn-Off Fall TimeSWITCHING PARAMETERS Total Gate Charge V GS =4.5V, V DS =10V, I D =7.5AGate Source Charge m ΩV GS =2.5V, I D =6A I S =1A,V GS =0VV DS =5V, I D =7.5A V GS =1.8V, I D =5AV GS =4.5V, I D =7A R DS(ON)Static Drain-Source On-ResistanceForward Transconductance Diode Forward VoltageI DSS µA Gate Threshold Voltage V DS =V GS I D =250µA V DS =16V, V GS =0VZero Gate Voltage Drain Current V DS =0V, V GS =±10V Gate-Body leakage current Electrical Characteristics (T J =25°C unless otherwise noted)STATIC PARAMETERSParameterConditions Body Diode Reverse Recovery TimeBody Diode Reverse Recovery Charge I F =7.5A, dI/dt=100A/µsDrain-Source Breakdown Voltage On state drain currentI D =250µA, V GS =0V V GS =4.5V, V DS =5V V GS =10V, I D =7.5AReverse Transfer Capacitance I F =7.5A, dI/dt=100A/µsA: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C.The value in any given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance rating.B: Repetitive rating, pulse width limited by junction temperature.C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.D. The static characteristics in Figures 1 to 6,12,14 are obtained using <300 µs pulses, duty cycle 0.5% max.E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The SOA curve provides a single pulse rating.Rev 5: Feb 2010分销商库存信息: AOSAO8814。
744710215;中文规格书,Datasheet资料
5.1 5.0 4.02012-06-272012-05-022009-06-30SStSStRStSStCZWürth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyTel. +49 (0) 79 42 945 - 0A Dimensions: [mm]F Typical Impedance Characteristics:H4: Classification Wave Soldering Profile:H5: Classification Wave ProfileProfile FeaturePreheat- Temperature Min (T smin )- Temperature Typical (T stypical ) - Temperature Max (T smax ) - Time (t s ) from (T smin to T smax )Δ preheat to max Temperature Peak temperature (T p )Time of actual peak temperature (t p )Ramp-down rate - Min - Typical - MaxTime 25°C to 25°C Pb-Free Assembly 100°C 120°C 130°C 70 seconds 150°C max.250°C - 260°C max. 10 secondsmax. 5 second each wave ~ 2 K/s ~ 3.5 K/s ~ 5 K/s 4 minutesSn-Pb Assembly 100°C 120°C 130°C 70 seconds 150°C max.235°C - 260°C max. 10 secondsmax. 5 second each wave ~ 2 K/s ~ 3.5 K/s ~ 5 K/s 4 minutesrefer to EN 61760-1:2006H Soldering Specifications:I Cautions and Warnings:The following conditions apply to all goods within the product series of WE-SDof Würth Elektronik eiSos GmbH & Co. KG:General:All recommendations according to the general technical specifications of the data-sheet have to be complied with.The disposal and operation of the product within ambient conditions which probably alloy or harm the wire isolation has to be avoided.If the product is potted in customer applications, the potting material might shrink during and after hardening. Accordingly to this the product is exposed to the pressure of the potting material with the effect that the core, wire and termination is possibly damaged by this pressure and so the electrical as well as the mechanical characteristics are endanger to be affected. After the potting material is cured, the core, wire and termination of the product have to be checked if any reduced electrical or mechanical functions or destructions have occurred.The responsibility for the applicability of customer specific products and use in a particular customer design is always within the authority of the customer. All technical specifications for standard products do also apply for customer specific products.Washing varnish agent that is used during the production to clean the application might damage or change the characteristics of the wire in-sulation, the marking or the plating. The washing varnish agent could have a negative effect on the long turn function of the product.Direct mechanical impact to the product shall be prevented as the ferrite material of the core could flake or in the worst case it could break. Product specific:Follow all instructions mentioned in the datasheet, especially:•The solder profile has to be complied with according to the technical wave soldering specification, otherwise no warranty will be sustai-ned.•All products are supposed to be used before the end of the period of 12 months based on the product date-code, if not a 100% solderabi-lity can´t be warranted.•Violation of the technical product specifications such as exceeding the nominal rated current will result in the loss of warranty.1. General Customer ResponsibilitySome goods within the product range of Würth Elektronik eiSos GmbH & Co. KG contain statements regarding general suitability for certain application areas. These statements about suitability are based on our knowledge and experience of typical requirements concerning the are-as, serve as general guidance and cannot be estimated as binding statements about the suitability for a customer application. The responsibi-lity for the applicability and use in a particular customer design is always solely within the authority of the customer. Due to this fact it is up to the customer to evaluate, where appropriate to investigate and decide whether the device with the specific product characteristics described in the product specification is valid and suitable for the respective customer application or not.2. Customer Responsibility related to Specific, in particular Safety-Relevant ApplicationsIt has to be clearly pointed out that the possibility of a malfunction of electronic components or failure before the end of the usual lifetime can-not be completely eliminated in the current state of the art, even if the products are operated within the range of the specifications.In certain customer applications requiring a very high level of safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health it must be ensured by most advanced technological aid of suitable design of the customer application that no injury or damage is caused to third parties in the event of malfunction or failure of an electronic component.3. Best Care and AttentionAny product-specific notes, warnings and cautions must be strictly observed.4. Customer Support for Product SpecificationsSome products within the product range may contain substances which are subject to restrictions in certain jurisdictions in order to serve spe-cific technical requirements. Necessary information is available on request. In this case the field sales engineer or the internal sales person in charge should be contacted who will be happy to support in this matter.5. Product R&DDue to constant product improvement product specifications may change from time to time. As a standard reporting procedure of the Product Change Notification (PCN) according to the JEDEC-Standard inform about minor and major changes. In case of further queries regarding the PCN, the field sales engineer or the internal sales person in charge should be contacted. The basic responsibility of the customer as per Secti-on 1 and 2 remains unaffected.6. Product Life CycleDue to technical progress and economical evaluation we also reserve the right to discontinue production and delivery of products. As a stan-dard reporting procedure of the Product Termination Notification (PTN) according to the JEDEC-Standard we will inform at an early stage about inevitable product discontinuance. According to this we cannot guarantee that all products within our product range will always be available. Therefore it needs to be verified with the field sales engineer or the internal sales person in charge about the current product availability ex-pectancy before or when the product for application design-in disposal is considered.The approach named above does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.7. Property RightsAll the rights for contractual products produced by Würth Elektronik eiSos GmbH & Co. KG on the basis of ideas, development contracts as well as models or templates that are subject to copyright, patent or commercial protection supplied to the customer will remain with Würth Elektronik eiSos GmbH & Co. KG.8. General Terms and ConditionsUnless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms and Conditions of Würth Elektronik eiSos Group”, last version available at .J Important Notes:The following conditions apply to all goods within the product range of Würth Elektronik eiSos GmbH & Co. KG:分销商库存信息: WURTH-ELECTRONICS 744710215。
三星贴片电容规格书08
�
America sales office
Irvine Office 92612 3345 Michelson Drive, Suite 350,Irvine, CA Te l:1- 949 - 797- 8047 E-mail:sh386.kim@
MULTILAYER CERAMIC CAPACITORS
65
Quality System Certification List
ISO / TS 16949 ISO 9001 (Product) TL 9000 (Product) ISO 14001 OSHAS 18001
Table 1:Certification list of Samsung Factory
January 2008
Passive components Sales Office
�
Head Office
206, Cheomdansaneop Road, Youngtong-gu, Suwon, Kyonggi Province 443-743, Korea Europe Te l: +82- 31- 210 - 6803 E-mail:wesley.roh@ America Te l: +82- 31- 210 - 6794 E-mail:randy.kim@ Asia Te l: +82 - 31- 210 - 5348 E-mail:koogi@ Domestic Te l: +82- 31- 210 - 3757 E-mail:southjoy@
�
Domestic Distributors
KORCHIP INC #219 - 8 Gasan - dong, Gumchun - gu, Seoul, Korea Te l: +82 - 2 - 838 - 5588 E-mail:hjh0064@ CHUNG HAN #16-96 Hangang - lo 3, Youngsan - Gu, Seoul, Korea Te l: +82-2-718-3322 E-mail:bu1230choi@ SAMT Daekyung Bldg.,Daechi-Dong, Gangnam- Gu, Seoul, Korea Te l: +82- 2- 3458- 9000 E-mail:info@ CHUNGMAC #53-5 Wonhyolo3 Youngsan- gu, Seoul, Korea Te l: +82- 2- 716 - 6428~9 E-mail:webmaster@anycam.co.kr APEXINT , Room #905. C- dong Woorimlion s, Valley 371-28, Gasan-dong, Guemcheon-Gu, Seoul, Korea Te l: +82- 2- 2026- 2610(2) E-mail:info@apexint.co.kr
10-89-4602;中文规格书,Datasheet资料
ENG. NO: A-70216-0391/0404
DIM. C DIM. E (REF.) FINISH CONNECTOR END PLATING DIM. D (MEASURE PT.) P.C. BOARD END PLATING DIM. F (MEASURE PT.) PACKAGING CKTS EDP NUMBER 04 10-89-4046 06 10-89-4066 08 10-89-4086 10 10-89-4106 12 10-89-4126 14 10-89-4146 16 10-89-4166 18 10-89-4186 20 10-89-4206 22 10-89-4226 24 10-89-4246 26 10-89-4266 28 10-89-4286 30 10-89-4306 (6.10)/.240 (2.79)/.110 30 GOLD GOLD (2.54)/.100 TIN (1.27)/.050 SEE NOTE 4 ON SHT. 1 ENG. NUMBER A-70216-0391 A-70216-0392 A-70216-0393 A-70216-0394 A-70216-0395 A-70216-0396 A-70216-0397 A-70216-0398 A-70216-0399 A-70216-0400 A-70216-0401 A-70216-0402 A-70216-0403 A-70216-0404
SHEET No.
-3APPROVED BY:
DOCUMENT NUMBER:
SD-70216-001
/
ADERR
FSMITH
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
片碱MSDS
片碱MSDS一、标识化学品中文名称：氢氧化钠；苛性钠；烧碱化学品英文名称：odiun hydroxide；Caustic soda二、成分/组成信息纯品■混合物□有害物成分：浓度 CASNo.：氢氧化钠 1310-73-2三、危险性概述危险性类别：第8.2类碱性腐蚀品侵入途径：吸入、食入健康危害：本品有强烈刺激和腐蚀性。
粉尘刺激眼和呼吸道，腐蚀鼻中隔；皮肤和眼直接接触可引起灼伤；误服可造成消化道灼伤，粘膜糜烂、出血和休克。
环境危害：对环境有害。
燃爆危险：不燃，无特殊燃爆特性。
四、急救措施皮肤接触：立即脱去污染的衣着，用大量流动清水冲洗20～30分钟。
如有不适感，就医。
眼睛接触：立即提起眼睑，用大量流动清水或生理盐水彻底冲洗10～15分钟。
如有不适感，就医。
吸入：迅速脱离现场至空气新鲜处。
保持呼吸道通畅。
如呼吸困难，给输氧。
呼吸、心跳停止，立即进行心肺复苏术。
就医。
食入：用水漱口，给饮牛奶或蛋清。
就医。
五、消防措施危险特性：与酸发生中和反应并放热。
遇潮时对铝、锌和锡有腐蚀性，并放出易燃易爆的氢气。
本品不会燃烧, 遇水和水蒸气大量放热,形成腐蚀性溶液。
具有强腐蚀性。
有害燃烧产物：无意义。
灭火方法及灭火剂：本品不燃。
根据着火原因选择适当灭火剂灭火。
灭火注意事项：消防人员必须穿全身耐酸碱消防服、佩戴空气呼吸器灭火。
尽可能将容器从火场移至空旷处。
喷水保持火场容器冷却，直至灭火结束。
六、泄漏应急处理应急处理：隔离泄漏污染区，限制出入。
建议应急处理人员戴防尘口罩，穿防酸碱服。
穿上适当的防护服前严禁接触破裂的容器和泄漏物。
尽可能切断泄漏源。
用塑料布覆盖泄漏物，减少飞散。
勿使水进入包装容器内。
用洁净的铲子收集泄漏物，置于干净、干燥、盖子较松的容器中，将容器移离泄漏区。
七、操作处置与储存操作注意事项：密闭操作。
操作人员必须经过专门培训，严格遵守操作规程。
建议操作人员佩戴头罩型电动送风过滤式防尘呼吸器，穿橡胶耐酸碱服，戴橡胶耐酸碱手套。
- 1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。
Pomona
®
All dimensions are in inches. Tolerances (except noted): .xx = ±.02” (,51 mm), .xxx = ± .005” (,127 mm). All specifications are to the latest revisions. Specifications are subject to change without notice. Registered trademarks are the property of their respective companies. Made in USA
6/9/99
Pomona ACCESS 90542 (800) 444-6785 or (425) 446-6010 SY/EH/LS
More drawings available at
Page 1 of 1
Model 1390
Banana Plug, Isolation
Sales: 800-490-2362 Fax: 888-403-3360 Technical Assistance: 800-241-2060
FEATURES:
• Provides two-terminal isolation.
• Top stack-up receptacles isolated from lower plug to permit addition of series resistors, diodes, etc.
• Ideal for computers, lab, circuit design and testing.
• Bright tin plated solder turret terminals for permanent noise-free connections. MATERIALS:
Upper Conn: Banana Jack Material: Brass per QQ-B-626, Alloy 360, ½ Hard. Finish: Nickel plated per QQ-N-290, Class 2, 200/300 microinches. Insulation: Polypropylene molded to banana jack and plug body. Color: See Ordering Information Marking: “Pomona 1390” Lower Conn: Banana Plug
Material: Spring – Beryllium Copper per QQ- Plug Body – Brass per QQ-B-626, Alloy 3 360, ½ Hard. Finish: Nickel plated per QQ-N-290, Class 2, 200/300 microinches. Turrets: Material: Brass per QQ-B-626, Alloy 360, ½ Hard. Finish: Bright tin plated per MIL-T-10727, Type I, 100/250 microinches. RATINGS:
Operating Temperature: +55º C. (+131º F.) Max. Operating Voltage: Hand-held Testing: 30VAC/60VDC Max.
Hands Free Testing in Controlled Voltage Environments: 2500WVDC Max. Current: 15 Amperes
ORDERING INFORMATION: Model 1390-* *=Color, -0 Black, -2 Red ,
Ordering example: 1390-2 Color is Red
/
分销商库存信息:
POMONA
1390-01390-2。