S-AV17中文资料
Cessna 172 Aircraft检查清单说明书
Wing/Region Tail#Make Cur TTAF Inspection Date S/N Model Cur Tach Time Insp Name Insp CAP ID Insp Phone #Cur Hobbs Time Date Last Annual Tach Time TTAF ADs Validated Current?Date Last 100Hr Tach Time TTAF Date ADs Validated Date Last Oil Chg Tach Time TTAF Date C/W:Date Due ELT Batt Exp Date Date C/W Date Due Date C/W Date Due Y / N / NA Y / N / NA EP:Revision in Acft Y / N / NA Y / N / NA CAPF 71, APR 22 Previous Edition Will Not Be Used OPR/ROUTING: LGM H.Is a legible fireproof ID plate secured to the aircraft fuselage exterior? (CAPR 130-2)P.Aircraft Shoulder Harnesses Installed? (CAPR 130-2)3.Aircraft Exterior Remarks C.Navigation / Position D.Flashing Beacon E.Cabin / Panel F.Instruments E."Not for Hire” Placard Displayed (CAPR 130-2)O.Survival Kit (CAPR 130-2)CAP Aircraft Inspection Checklist Aircraft/Inspector Information 4.Exterior And Interior Lighting For Proper Operation (CFR 91.209)Remarks1.Aircraft Logbooks / Records, POH, AIF & AMRAD J.Serviceable Fire Extinguisher / with gauge Installed (CAPR 130-2)K.Carbon Monoxide Detector – Serviceability, Dated? (CAPR 130-2)L.Cessna Secondary Seat Stop Installed (All Cessnas Prior to 1997)M.Cargo Tie-Down or Net Installed (CFR 91.525, CAPR 130-2)N.Does Aircraft Have All Assigned Software? (CAPR 130-2)A.Is Aircraft Properly Chocked, Tied Down and are Tie downs in good condition? (CAPR 130-2)B.Is aircraft clean? Note obvious Defects, Leaks, Corrosion, ? (Acft Serv Manual, CAPR 130-2)C.Condition of Prop – Nicks, Dents, Leaks, Corrosion, Prop Strike (Acft Service Manual)3)Operating Handbook (Airplane Flight Manual / POH) (Ref: CFR 91.9)4)Current Weight & Balance Data (Ref: Acft Flight Manual / POH)5)Avionics Guide - If applicable to avionics (Cockpit Reference Guide)H.Operating Limits / Placards Displayed (CFR 91.9)I.Avionics or Control Lock Installed (CAPR 130-2)D.Appropriate CAP decals on wings, doors and vertical stabilizer (CAPP 130-2)E.Brakes - No Leaks, Wear, Cracked Pads or Obvious Defects (Acft Service Manual)F.Tires for Proper Air Pressure and Serviceability (Acft Service Manual/STC, CAPR 130-2)nding / Taxi / Pulse lite B.Anti-Collision Strobe A.Mid Cycle/100-Hour/Annual (CFR 91.417, CAPR 130-2)Remarks G .Do AMRAD open discrepancies accurately reflect current status of the aircraft?I . Does aircraft have a complete set of logbooks since new?J . AIF -Current version -Correct -Accurate 1)Current Version of Contents (CAPR 70-1, 9.1.3 & CAPS 72-4)2)All of the sections of the AIF are current (CAPS 72-4)3)Red "Aircraft Grounded" Placard is in the AIF (CAPS 72-4)4)VOR & Fire Extinguisher forms (CAPR 130-2 & CAPS 72-4)5)AIF cover sheet matches most current insp data in logs and AMRAD E.Was a SOAP sample taken at the last 100-hour/annual oil and filter change? (CAPR 130-2)F.Is the engine oil press ure switch within the manufacturer's time change? (CAPR130-2)C.Corrosion Control (CAPR 130-2)D.Alt/Pitot-Static/Transponder (CFR 91.411 & 413)B.ELT Check (CFR 91-207)C.POH Required Revision D.Is interior clean? Note O bvious Defects, Leaks, Corrosion, and Condition of Interior?Remarks A.Required Documents in Aircraft 1)Airworthiness Certificate (Ref: CFR 91.203)G.Engine Cowling for Proper Fit / Fasteners Serviceable and Secure (Acft Service Manual)F."SEAT SLIP WARNING" Placard Displayed (CAPR 130-2)G."Remove Towbar Before Engine Start" Placard Displayed (CAPR 130-2)B.CAP- checklist date NP:K .Weight and Balance - Current weight & balance data in POH (original), copy in AIF and both match maintenance records (POH, AIF & Logbooks)2.Aircraft Interior H .Do AMRAD Aircraft Mx Data entries match logbooks?2)Registration (Ref: CFR 91.203)Equip TypeMake Model S/N VIRB Camera Mount Installed?Audio Panel 1Tow Hook Installed?Audio Panel 2FLIR Installed?Auto-PilotAERONET Installed?COM/GPS 1Vacuum System Installed?COM/GPS 2Airborne Repeater Capable?DFELTID EngineType FM RadioLT MagnetoID RT MagnetoType MFD 1MFD 2PropellerProp GovernorSat PhoneSat Phone DialerCAPF 71, APR 22 Previous Edition Will Not Be Used OPR/ROUTING: LGM5. Installed Aircraft EquipmentGarmin System ID & Type (if equipped)6.Misc Aircraft Information Garmin System ID & Type (if equipped)Instructions for the CAP Aircraft Inspection Checklist1.Aircraft Logbooks / Records, POH, AIF & AMRADItem A. Annotate Date C/W, TACH and TTAF for the last mid cycle, 100hr and annual inspections as recorded in aircraft logbooks. Annotate if ADs were certified current in the logbook at last annual and the date of this validation. Item B.ELT Inspection in logbook: annotate Date C/W, Date Due and Date ELT Battery Expires.Item C. Annotate last corrosion control entry from aircraft logbook and when next corrosion control is due.Item D. Annotate the Altimeter/Pitot-Static/Transponder inspection dates from the logbook.Items E-H. Use AMRAD, aircraft condition and aircraft logbooks to answer these questions.Item I. Ensure aircraft has a complete set of logbooks since aircraft was new. Item J. See AIF and CAPS 72-4Item K. Ensure the weight and balance data in POH (original copy), AIF/ Foreflight match the logbooks.2.Aircraft Interior.Items A.1&2) Airworthiness Certificate and Registration are normally kept in a pouch attached to the sidewall of the aircraft, they must be legible and registration must be current. Ensure they are for the aircraft being inspected.Items A.3&4) Ensure a handbook (POH or AFM) matching the aircraft’s make, model and year is in the aircraft and that it contains the current original copy of the aircraft weight and balance data.Item A.5) Ensure an avionics guide for G1000 or other applicable installed avionics is in aircraft.Item B. CAP-approved checklists are located online in eServices and must match POH revision. NP- Normal Procedures EP - Emergency ProceduresItem C. Enter current required revision of POH and revision of POH in aircraft. The required revision can be found athttps:///TechnicalPublications, create a free account, login, go to Publications>Tech Manual Search and enter the S/N of the aircraft in question and select “AFM/POH/POM” from the manual type dropdown. This will give you a list showing the current POH Revision that is required.Item D. Check for obvious defects, leaks, corrosion, cleanliness, and condition of interior.Items E, F, G, & H Placards: Not for Hire/ Seat Slippage Warning/Remove Towbar/Operating Limits.Item I. Avionics and Control Locks Installed if equipped.Item J. Ensure fire extinguisher is serviceable and properly serviced.Item K. Inspect detectors for serviceability (change of indicator color) and valid expiration date (12 months).Item L. Secondary Seat Stop Installed on the right side of the pilot's seat (All Cessna Aircraft, Prior to 1997 Models).Item M. Cargo Tie-down/Cargo Net: CFR 91.525 requires cargo to be properly secured by a safety belt or other tie-down method.Item N. Does aircraft have all assigned software available for use?Item O. Ensure a survival kit is present and accessible.Item P. Are aircraft shoulder harnesses installed (required on both front seats)?3.Aircraft Exterior.Item A. Ensure tiedowns (if required) meet the requirements in CAPR 130-2 and aircraft is secured per manufacturer’s recommendations.Item B. Check for obvious defects, leaks, corrosion, cleanliness, and condition of paint. Look closely for corrosion and missing or chipped paint.Item C. Inspect propeller for damage and leaks, paying particular attention to nicks and evidence of propeller strike. Also check for excessive rubbing marks between spinner and cowling.Item D. Ensure appropriate decals are installed on wings, doors and vertical stabilizer. See CAPP 130-2.Item E. Check brakes/lines/pads for leaks, wear, cracks, defects.Item F. Tire pressures meet POH/AFM/STC limits and must be within the tolerances established by the manufacturer. Tires must be serviceable IAW manufacturer’s wear limits. Item G. Check the cowling for proper fit and contour. Check the condition of the fasteners holding it in place.Item H. CFR 45-11 requires a fireproof plate that is etched, stamped, or engraved with the builder's name, model designation, and serial number. It must be secured to the exterior of the aircraft near the tail surfaces or adjacent or just aft of the rear-most entrance door. If the aircraft was manufactured before March 7, 1988, the plate can be attached to an accessible interior or exterior location near an entrance; however, the model designation and serial number must also be displayed on the aircraft fuselage exterior.4.Exterior and Interior Lighting for Proper Operation.Items A, B, C, D, E, and F. Check all lights for operation.5.Installed Aircraft Equipment. Record the make, model and S/N for each requested item from the logbook. If the item has not been replaced since the aircraft was new then it will not be in the logbook. DO NOT REMOVE THE ITEM TO CHECK THE SERIAL NUMBER. Check the make, model and S/N of each recorded item that is installed against the ORMS installed equipment list for this aircraft. Contact CAP/LGM to have discrepancies updated.6.Misc Aircraft Information. Inspect aircraft to see if each requested item is installed and indicate the aircraft’s condition in the space provided. Record the Garmin system ID (if applicable), if more than one type MFD is installed then both system IDs should be recorded I.E. G500 and a GTN650 in the same aircraft.Most of the items on the checklist are self-explanatory. The dates and times for the aircraft annual, 100-hour inspections, and oil changes should be in the aircraft logbooks. Tach times should be used to determine when maintenance actions are required and time change items are due replacement.POC for this checklist is CAP/LGM, Maxwell AFB AL, 334-953-9096.。
RV17电位器
30°
FULL C.C.W POSITION
1
R1
3-Ø1+0.1 0 Holes
4.8
6.5
5
Ø6.7
3.2
3 0.8 5
4.35
MOUNTING SURFACE
4.35
1
2 3 (R1)
RV9415GO-TB
Vertical Type,Dual Unit
R2
电位器型号解释
POTENTIOMETER CODE EXPLANATION
特长： 本体宽度尺寸为8mm或9mm。 电位器碳片周围用玻纤材质成型， 提高机械寿命 用途： 主要用于各种无线电对讲机，业务 用无线设备等移动通信的电位控制 DVD, 汽车音响,普通音响等各种 AV 机器 用于汽车室内的座席加热,调光器, 乱水器等各种控制 用于住宅设备的各种控制
09型塑卦式金属轴电位器
09mm INSERT-MOLDING METAL SHAFT POTENTIOMETERS Model
RV9415NO-TB
Vertical Type,Single Unit 6.4
R1
Dimensions
9.5 L± 0.5 1.8 A
4
0 Ø6-0.1
Circuit/Features
6.5
Ø6.7
5
3.2
3 0.8 5
2.5 5 2.5 4.35
MOUNTING SURFACE
2.5 5 2.5 4.35
1
2 3 (R4)
1
2 3 (R3)
1
2 3 (R2)
1
2 3 (R1)
RV9416BO-TB
74AVC16T245DGGRG4资料
FEATURESDESCRIPTION/ORDERING INFORMATIONDGG OR DGV PACKAGE(TOP VIEW)1234567891011121314151617181920212223244847464544434241403938373635343332313029282726251DIR1B11B2GND1B31B4V CCB1B51B6GND1B71B82B12B2GND2B32B4V CCB2B52B6GND2B72B82DIR1OE1A11A2GND1A31A4V CCA1A51A6GND1A71A82A12A2GND2A32A4V CCA2A52A6GND2A72A82OEThe SN74AVC16T245is designed for asynchronous communication between data buses.The device transmitsSN74AVC16T24516-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND3-STATE OUTPUTSSCES551C–FEBRUARY2004–REVISED AUGUST2005•Control Inputs V IH/V IL Levels Are Referencedto V CCA Voltage•V CC Isolation Feature–If Either V CC Input Is atGND,Both Ports Are in the High-ImpedanceState•Overvoltage-Tolerant Inputs/Outputs AllowMixed-Voltage-Mode Data Communications•Fully Configurable Dual-Rail Design AllowsEach Port to Operate Over the Full1.2-V to3.6-V Power-Supply Range•I off Supports Partial-Power-Down ModeOperation•I/Os Are4.6-V Tolerant•Latch-Up Performance Exceeds100mA PerJESD78,Class II•ESD Protection Exceeds JESD22–8000-V Human-Body Model(A114-A)–200-V Machine Model(A115-A)–1000-V Charged-Device Model(C101)This16-bit noninverting bus transceiver uses twoseparate configurable power-supply rails.TheSN74AVC16T245is optimized to operate withV CCA/V CCB set at1.4V to3.6V.It is operational withV CCA/V CCB as low as1.2V.The A port is designed totrack V CCA.V CCA accepts any supply voltage from1.2V to3.6V.The B port is designed to track V CCB.V CCB accepts any supply voltage from1.2V to3.6V.This allows for universal low-voltage bidirectionaltranslation between any of the 1.2-V, 1.5-V, 1.8-V,2.5-V,and3.3-V voltage nodes.data from the A bus to the B bus or from the B bus to the A bus,depending on the logic level at the direction-control(DIR)input.The output-enable(OE)input can be used to disable the outputs so the buses effectively are isolated.The SN74AVC16T245is designed so that the control pins(1DIR,2DIR,1OE,and2OE)are supplied by V CCA.ORDERING INFORMATIONT A PACKAGE(1)ORDERABLE PART NUMBER TOP-SIDE MARKING TSSOP–DGG Tape and reel SN74AVC16T245DGGR AVC16T245TVSOP–DGV Tape and reel SN74AVC16T245DGVR WF245–40°C to85°CVFBGA–GQL SN74AVC16T245GQLRTape and reel WF245VFBGA–ZQL(Pb-free)SN74AVC16T245ZQLR(1)Package drawings,standard packing quantities,thermal data,symbolization,and PCB design guidelines are available at/sc/package.Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.PRODUCTION DATA information is current as of publication date.Copyright©2004–2005,Texas Instruments Incorporated Products conform to specifications per the terms of the TexasInstruments standard warranty.Production processing does notnecessarily include testing of all parameters.DESCRIPTION/ORDERING INFORMATION (CONTINUED)GQL OR ZQL PACKAGE(TOP VIEW)J H G F E D C B A 213465KTERMINAL ASSIGNMENTS (2)SN74AVC16T24516-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES551C–FEBRUARY 2004–REVISED AUGUST 2005This device is fully specified for partial-power-down applications using I off .The I off circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.The V CC isolation feature ensures that if either V CC input is at GND,both ports are in the high-impedance state.To ensure the high-impedance state during power up or power down,OE should be tied to V CC through a pullup resistor;the minimum value of the resistor is determined by the current-sinking capability of the driver.123456A 1DIR NC NC NC NC 1OE B 1B21B1GND GND 1A11A2C 1B41B3V CCB V CCA 1A31A4D 1B61B5GNDGND1A51A6E 1B81B71A71A8F 2B12B22A22A1G 2B32B4GND GND 2A42A3H 2B52B6V CCB V CCA 2A62A5J 2B72B8GND GND 2A82A7K2DIRNCNCNCNC2OE(2)NC –No internal connectionFUNCTION TABLE (EACH 8-BIT SECTION)INPUTS OPERATION OE DIR L L B data to A bus L H A data to B busHXIsolation2To Seven Other Channels 1DIR1A11B11OETo Seven Other Channels2DIR2A12B12OEAbsolute Maximum Ratings (1)SN74AVC16T24516-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES551C–FEBRUARY 2004–REVISED AUGUST 2005LOGIC DIAGRAM (POSITIVE LOGIC)over operating free-air temperature range (unless otherwise noted)MINMAX UNIT V CCA Supply voltage range–0.5 4.6VV CCB I/O ports (A port)–0.5 4.6V IInput voltage range (2)I/O ports (B port)–0.5 4.6V Control inputs–0.5 4.6A port –0.5 4.6Voltage range applied to any outputV O V in the high-impedance or power-off state (2)B port –0.5 4.6A port –0.5V CCA +0.5V O Voltage range applied to any output in the high or low state (2)(3)VB port –0.5V CCB +0.5I IK Input clamp current V I <0–50mA I OK Output clamp current V O <0–50mA I OContinuous output current±50mA Continuous current through each V CCA ,V CCB ,and GND±100mA DGG package70θJA Package thermal impedance (4)DGV package 58°C/W GQL/ZQL package42T stg Storage temperature range–65150°C (1)Stresses beyond those listed under "absolute maximum ratings"may cause permanent damage to the device.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)The input voltage and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.(3)The output positive-voltage rating may be exceeded up to 4.6V maximum if the output current rating is observed.(4)The package thermal impedance is calculated in accordance with JESD 51-7.3Recommended Operating Conditions (1)(2)(3)SN74AVC16T24516-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES551C–FEBRUARY 2004–REVISED AUGUST 2005V CCIV CCOMIN MAX UNIT V CCA Supply voltage 1.2 3.6V V CCB Supply voltage1.23.6V1.2V to 1.95VV CCI ×0.65High-level V IHData inputs (4)1.95V to2.7V 1.6Vinput voltage2.7V to3.6V 21.2V to 1.95VV CCI ×0.35Low-level V ILData inputs (4)1.95V to2.7V 0.7V input voltage2.7V to3.6V 0.81.2V to 1.95VV CCA ×0.65High-level DIRV IH1.95V to2.7V 1.6Vinput voltage(referenced to V CCA )(5)2.7V to3.6V 21.2V to 1.95VV CCA ×0.35Low-level DIRV IL 1.95V to 2.7V 0.7V input voltage (referenced to V CCA )(5)2.7V to3.6V0.8V I Input voltage 0 3.6V Active state 0V CCO V OOutput voltageV 3-state3.61.2V –31.4V to 1.6V–6I OHHigh-level output current1.65V to 1.95V –8mA2.3V to 2.7V –93V to3.6V –121.2V 31.4V to 1.6V6I OLLow-level output current1.65V to 1.95V 8mA2.3V to 2.7V 93V to3.6V12∆t/∆v Input transition rise or fall rate 5ns/V T A Operating free-air temperature–4085°C (1)V CCI is the V CC associated with the data input port.(2)V CCO is the V CC associated with the output port.(3)All unused data inputs of the device must be held at V CCI or GND to ensure proper device operation.Refer to the TI application report,Implications of Slow or Floating CMOS Inputs ,literature number SCBA004.(4)For V CCI values not specified in the data sheet,V IH min =V CCI ×0.7V,V IL max =V CCI ×0.3V.(5)For V CCA values not specified in the data sheet,V IH min =V CCA ×0.7V,V IL max =V CCA ×0.3V.4Electrical Characteristics(1)(2)SN74AVC16T245 16-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND3-STATE OUTPUTSSCES551C–FEBRUARY2004–REVISED AUGUST2005over recommended operating free-air temperature range(unless otherwise noted)T A=25°C–40°C to85°C PARAMETER TEST CONDITIONS V CCA V CCB UNITMIN TYP MAX MIN MAXI OH=–100µA 1.2V to3.6V 1.2V to3.6V V CCO–0.2I OH=–3mA 1.2V 1.2V0.95I OH=–6mA 1.4V 1.4V 1.05V OH V I=V IH VI OH=–8mA 1.65V 1.65V 1.2I OH=–9mA 2.3V 2.3V 1.75I OH=–12mA3V3V 2.3I OL=100µA 1.2V to3.6V 1.2V to3.6V0.2I OL=3mA 1.2V 1.2V0.15I OL=6mA 1.4V 1.4V0.35V OL V I=V IL VI OL=8mA 1.65V 1.65V0.45I OL=9mA 2.3V 2.3V0.55I OL=12mA3V3V0.7ControlI I V I=V CCA or GND 1.2V to3.6V 1.2V to3.6V±0.025±0.25±1µAinputsA or B0V0to3.6V±0.1±2.5±5 portI off V I or V O=0to3.6VµAA or B0to3.6V0V±0.5±2.5±5 portV O=V CCO or GND,A or BI OZ(3)V I=V CCI or GND, 3.6V 3.6V±0.5±2.5±5µAportOE=V IH1.2V to3.6V 1.2V to3.6V25V I=V CCI or GND,I CCA0V 3.6V–5µAI O=03.6V0V251.2V to3.6V 1.2V to3.6V25V I=V CCI or GND,I CCB0V 3.6V25µAI O=03.6V0V–5V I=V CCI or GND,I CCA+I CCB 1.2V to3.6V 1.2V to3.6V45µAI O=0ControlC i V I=3.3V or GND 3.3V 3.3V 3.5pFinputsA or BC io V O=3.3V or GND 3.3V 3.3V7pFport(1)V CCO is the V CC associated with the output port.(2)V CCI is the V CC associated with the input port.(3)For I/O ports,the parameter I OZ includes the input leakage current.5Switching CharacteristicsSwitching CharacteristicsSN74AVC16T24516-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES551C–FEBRUARY 2004–REVISED AUGUST 2005over recommended operating free-air temperature range,V CCA =1.2V (see Figure 11)V CCB =1.2VV CCB =1.5VV CCB =1.8VV CCB =2.5VV CCB =3.3VFROM TO PARAMETERUNIT (INPUT)(OUTPUT)TYP TYP TYP TYP TYP t PLH 4.1 3.33 2.8 3.2A B ns t PHL 4.1 3.33 2.8 3.2t PLH 4.44 3.8 3.6 3.5B A ns t PHL 4.44 3.8 3.6 3.5t PZH 6.4 6.4 6.4 6.4 6.4OE A ns t PZL 6.4 6.4 6.4 6.4 6.4t PZH 6 4.64 3.4 3.2OE B ns t PZL 6 4.64 3.4 3.2t PHZ 6.6 6.6 6.6 6.6 6.8OE A ns t PLZ 6.6 6.6 6.6 6.6 6.8t PHZ 6 4.9 4.9 4.2 5.3OEBnst PLZ64.94.94.25.3over recommended operating free-air temperature range,V CCA =1.5V ±0.1V (see Figure 11)V CCB =1.5V V CCB =1.8V V CCB =2.5V V CCB =3.3V V CCB =1.2VFROM TO ±0.1V ±0.15V ±0.2V ±0.3V PARAMETERUNIT(INPUT)(OUTPUT)TYP MIN MAX MIN MAX MIN MAX MIN MAX t PLH 3.60.5 6.20.5 5.20.5 4.10.5 3.7A B ns t PHL 3.60.5 6.20.5 5.20.5 4.10.5 3.7t PLH 3.30.5 6.20.5 5.90.5 5.60.5 5.5B A ns t PHL 3.30.5 6.20.5 5.90.5 5.60.5 5.5t PZH 4.3110.1110.1110.1110.1OE A ns t PZL 4.3110.1110.1110.1110.1t PZH 5.6110.10.58.10.5 5.90.5 5.2OE B ns t PZL 5.6110.10.58.10.5 5.90.5 5.2t PHZ 4.5 1.59.1 1.59.1 1.59.1 1.59.1OE A ns t PLZ 4.5 1.59.1 1.59.1 1.59.1 1.59.1t PHZ 5.5 1.58.7 1.57.51 6.51 6.3OEBns t PLZ5.51.58.71.57.516.516.36Switching Characteristics Switching CharacteristicsSN74AVC16T245 16-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND3-STATE OUTPUTSSCES551C–FEBRUARY2004–REVISED AUGUST2005over recommended operating free-air temperature range,VCCA=1.8V±0.15V(see Figure11)V CCB=1.5V V CCB=1.8V V CCB=2.5V V CCB=3.3VV CCB=1.2VFROM TO±0.1V±0.15V±0.2V±0.3V PARAMETER UNIT (INPUT)(OUTPUT)TYP MIN MAX MIN MAX MIN MAX MIN MAXt PLH 3.40.5 5.90.5 4.80.5 3.70.5 3.3A B nst PHL 3.40.5 5.90.5 4.80.5 3.70.5 3.3t PLH30.5 5.20.5 4.80.5 4.50.5 4.4B A nst PHL30.5 5.20.5 4.80.5 4.50.5 4.4t PZH 3.417.817.817.817.8 OE A ns t PZL 3.417.817.817.817.8t PZH 5.419.20.57.40.5 5.30.5 4.5 OE B ns t PZL 5.419.20.57.40.5 5.30.5 4.5t PHZ 4.2 1.57.7 1.57.7 1.57.7 1.57.7 OE A ns t PLZ 4.2 1.57.7 1.57.7 1.57.7 1.57.7t PHZ 5.2 1.58.4 1.57.11 5.91 5.7 OE B ns t PLZ 5.2 1.58.4 1.57.11 5.91 5.7over recommended operating free-air temperature range,VCCA=2.5V±0.2V(see Figure11)V CCB=1.5V V CCB=1.8V V CCB=2.5V V CCB=3.3VV CCB=1.2VFROM TO±0.1V±0.15V±0.2V±0.3V PARAMETER UNIT (INPUT)(OUTPUT)TYP MIN MAX MIN MAX MIN MAX MIN MAXt PLH 3.20.5 5.60.5 4.50.5 3.30.5 2.8A B nst PHL 3.20.5 5.60.5 4.50.5 3.30.5 2.8t PLH 2.60.5 4.10.5 3.70.5 3.30.5 3.2B A nst PHL 2.60.5 4.10.5 3.70.5 3.30.5 3.2t PZH 2.50.5 5.30.5 5.30.5 5.30.5 5.3 OE A ns t PZL 2.50.5 5.30.5 5.30.5 5.30.5 5.3t PZH 5.20.59.40.57.30.5 5.10.5 4.5 OE B ns t PZL 5.20.59.40.57.30.5 5.10.5 4.5t PHZ31 6.11 6.11 6.11 6.1 OE A ns t PLZ31 6.11 6.11 6.11 6.1t PHZ517.91 6.61 6.11 5.2 OE B ns t PLZ517.91 6.61 6.11 5.27Switching CharacteristicsOperating CharacteristicsSN74AVC16T24516-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES551C–FEBRUARY 2004–REVISED AUGUST 2005over recommended operating free-air temperature range,V CCA =3.3V ±0.3V (see Figure 11)V CCB =1.5V V CCB =1.8V V CCB =2.5V V CCB =3.3V V CCB =1.2VFROM TO ±0.1V ±0.15V ±0.2V ±0.3V PARAMETERUNIT(INPUT)(OUTPUT)TYP MIN MAX MIN MAX MIN MAX MIN MAX t PLH 3.20.5 5.50.5 4.40.5 3.20.5 2.7A B ns t PHL 3.20.5 5.50.5 4.40.5 3.20.5 2.7t PLH 2.80.5 3.70.5 3.30.5 2.80.5 2.7B A ns t PHL 2.80.5 3.70.5 3.30.5 2.80.5 2.7t PZH 2.20.5 4.30.5 4.20.5 4.10.54OE A ns t PZL 2.20.5 4.30.5 4.20.5 4.10.54t PZH 5.10.59.30.57.20.5 4.90.54OE B ns t PZL 5.10.59.30.57.20.5 4.90.54t PHZ 3.40.550.550.550.55OE A ns t PLZ 3.40.550.550.550.55t PHZ 4.917.71 6.51 5.20.55OEBns t PLZ4.917.716.515.20.55T A =25°CV CCA =V CCA =V CCA =V CCA =V CCA =TEST V CCB =1.2VV CCB =1.5VV CCB =1.8VV CCB =2.5VV CCB =3.3VPARAMETERUNITCONDITIONSTYP TYP TYP TYP TYP Outputs 11112enabled A to BOutputs 11111C L =0,disabled C pdA(1)f =10MHz,pFOutputs t r =t f =1ns 1313141516enabled B to AOutputs 11111disabled Outputs 1313141516enabled A to BOutputs 11111C L =0,disabled C pdB(1)f =10MHz,pFOutputs t r =t f =1ns 11112enabled B to AOutputs 11111disabled(1)Power dissipation capacitance per transceiver8SN74AVC16T24516-BIT DUAL-SUPPLY BUS TRANSCEIVER WITH CONFIGURABLE VOLTAGE TRANSLATION AND3-STATE OUTPUTSSCES551C–FEBRUARY2004–REVISED AUGUST2005 Table1.Typical Total Static Power Consumption(I CCA+I CCB)V CCAV CCB UNIT0V 1.2V 1.5V 1.8V 2.5V 3.3V0V0<0.5<0.5<0.5<0.5<0.51.2V<0.5<1<1<1<111.5V<0.5<1<1<1<11µA1.8V<0.5<1<1<1<1<12.5V<0.51<1<1<1<13.3V<0.51<1<1<1<19TYPICAL CHARACTERISTICS102030405060C L − Load Capacitance − pFt P L H − P r o p a g a t i o n D e l a y − n s654321C L − Load Capacitance − pF102030405060654321t P H L − P r o p a g a t i o n D e l a y − n sSN74AVC16T24516-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES551C–FEBRUARY 2004–REVISED AUGUST 2005Figure 1.Figure 2.10TYPICAL CHARACTERISTICSC L − Load Capacitance − pFt P L H − P r o p a g a t i o n D e l a y − n s102030405060654321102030405060654321t P H L − P r o p a g a t i o n D e l a y − n sC L − Load Capacitance − pFSN74AVC16T24516-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES551C–FEBRUARY 2004–REVISED AUGUST 2005Figure 3.Figure 4.TYPICAL CHARACTERISTICSt P L H − P r o p a g a t i o n D e l a y − n s102030405060654321C L − Load Capacitance − pFt P H L − P r o p a g a t i o n D e l a y − n s102030405060654321C L − Load Capacitance − pFSN74AVC16T24516-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES551C–FEBRUARY 2004–REVISED AUGUST 2005Figure 5.Figure 6.TYPICAL CHARACTERISTICSt P L H − P r o p a g a t i o n D e l a y − n s102030405060654321C L − Load Capacitance − pFC L − Load Capacitance − pFt P H L − P r o p a g a t i o n D e l a y − n s0102030405060654321SN74AVC16T24516-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES551C–FEBRUARY 2004–REVISED AUGUST 2005Figure 7.Figure 8.TYPICAL CHARACTERISTICS102030405060654321C L − Load Capacitance − pFt P L H − P r o p a g a t i o n D e l a y − n sC L − Load Capacitance − pF0102030405060654321t P H L − P r o p a g a t i o n D e l a y − n sSN74AVC16T24516-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES551C–FEBRUARY 2004–REVISED AUGUST 2005Figure 9.Figure 10.PARAMETER MEASUREMENT INFORMATIONV OH V OLLOAD CIRCUIT × V CCOOpenOutput Control (low-level enabling)Output Waveform 1S1 at 2 × V CCO (see Note B)Output Waveform 2S1 at GND (see Note B)0 V0 VV CCI0 VV CCAV CCOVOLTAGE WAVEFORMS PROPAGATION DELAY TIMESVOLTAGE WAVEFORMS PULSE DURATIONVOLTAGE WAVEFORMS ENABLE AND DISABLE TIMESInputt pd t PLZ /t PZL t PHZ /t PZHOpen 2 × V CCO GNDTEST S1NOTES: A.C L includes probe and jig capacitance.B.Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics: PRR v 10 MHz, Z O = 50 Ω, dv/dt ≥ 1 V/ns.D.The outputs are measured one at a time, with one transition per measurement.E.t PLZ and t PHZ are the same as t dis .F.t PZL and t PZH are the same as t en .G.t PLH and t PHL are the same as t pd .H.V CCI is the V CC associated with the input port.I.V CCO is the V CC associated with the output port.1.2 V 1.5 V ± 0.1 V 1.8 V ± 0.15 V2.5 V ± 0.2 V3.3 V ± 0.3 V2 k Ω2 k Ω2 k Ω2 k Ω2 k ΩV CCO R L 0.1 V 0.1 V 0.15 V 0.15 V 0.3 VV TP C L 15 pF 15 pF 15 pF 15 pF 15 pFSN74AVC16T24516-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES551C–FEBRUARY 2004–REVISED AUGUST 2005Figure 11.Load Circuit and Voltage WaveformsPACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)74AVC16T245DGGRE4ACTIVE TSSOP DGG 482000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74AVC16T245DGGRG4ACTIVE TSSOP DGG 482000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74AVC16T245DGVRE4ACTIVE TVSOP DGV 482000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74AVC16T245DGVRG4ACTIVE TVSOP DGV 482000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AVC16T245DGGR ACTIVE TSSOP DGG 482000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AVC16T245DGVR ACTIVE TVSOP DGV 482000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AVC16T245GQLRNRNDBGA MI CROSTA R JUNI OR GQL561000TBDSNPBLevel-1-240C-UNLIMSN74AVC16T245ZQLR ACTIVE BGA MI CROSTA R JUNI ORZQL 561000Green (RoHS &no Sb/Br)SNAGCU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die andleadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM27-Sep-2007TAPE AND REEL BOXINFORMATIONDevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74AVC16T245DGGR DGG 48SITE 41330248.615.8 1.81224Q1SN74AVC16T245DGVR DGV 48SITE 4133024 6.810.1 1.61224Q1SN74AVC16T245GQLR GQL 56SITE 3233016 4.87.3 1.45816Q1SN74AVC16T245GQLR GQL 56SITE 6033016 4.87.3 1.5816Q1SN74AVC16T245ZQLR ZQL 56SITE 3233016 4.87.3 1.45816Q1SN74AVC16T245ZQLRZQL56SITE 60330164.87.31.5816Q112-Jan-2008DevicePackage Pins Site Length (mm)Width (mm)Height (mm)SN74AVC16T245DGGR DGG 48SITE 41346.0346.041.0SN74AVC16T245DGVR DGV 48SITE 41346.0346.041.0SN74AVC16T245GQLR GQL 56SITE 32346.0346.033.0SN74AVC16T245GQLR GQL 56SITE 60342.9345.928.58SN74AVC16T245ZQLR ZQL 56SITE 32346.0346.033.0SN74AVC16T245ZQLRZQL56SITE 60342.9345.928.5812-Jan-2008IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not 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士兰微电子 SVDZ24NT 说明书 - 17A、55V N沟道增强型场效应管
17A 、55V N 沟道增强型场效应管描述SVDZ24NT N 沟道增强型功率MOS 场效应晶体管，采用士兰微电子新的平面VDMOS 工艺技术制造。
先进的工艺及条状的原胞设计结构使得该产品具有较低的导通电阻、优越的开关性能及很高的雪崩击穿耐量。
该产品可广泛应用于电子镇流器，低功率开关电源。
特点♦ 17A ，55V ，R DS(on)(典型值)=45m Ω@V GS =10V ♦ 低栅极电荷量 ♦ 低反向传输电容 ♦ 开关速度快 ♦提升了dv/dt 能力产品规格分类产 品 名 称 封装形式 打印名称 材料 包装 SVDZ24NTTO-220-3LSVDZ24NT无铅料管极限参数(除非特殊说明，T C =25°C)参 数符 号 参数范围 单位 漏源电压 V DS 55 V 栅源电压 V GS ±20 V 漏极电流 T C =25°C I D 17 A T C =100°C12 漏极脉冲电流 I DM 68 A 耗散功率（T C =25°C ） - 大于25°C 每摄氏度减少 P D 45 W 0.36 W/°C 单脉冲雪崩能量（注1） E AS 122 mJ 工作结温范围 T J -55～+175 °C 贮存温度范围T stg-55～+175°C热阻特性参 数符 号 参数范围 单位 芯片对管壳热阻 R θJC 2.78 °C/W 芯片对环境的热阻R θJA62.5°C/W电性参数(除非特殊说明，TC=25°C)参数符号测试条件最小值典型值最大值单位漏源击穿电压B VDSS V GS=0V，I D=250µA 55 -- -- V 漏源漏电流I DSS V DS=55V，V GS=0V -- -- 20 µA 栅源漏电流I GSS V GS=±20V，V DS=0V -- -- ±100 nA 栅极开启电压V GS(th)V GS= V DS，I D=250µA 2.0 -- 4.0 V 导通电阻R DS(on)V GS=10V，I D=10A -- 45 70 mΩ输入电容C issV DS=25V，V GS=0V，f=1.0MHz -- 400 --pF输出电容C oss-- 130 -- 反向传输电容C rss-- 12.5 --开启延迟时间t d(on)V DD=28V，V GS=10V，R G=25Ω，I D=10A(注2，3) -- 5.4 --ns开启上升时间t r-- 32.5 -- 关断延迟时间t d(off)-- 22.1 -- 关断下降时间t f-- 12.4 --栅极电荷量Q g V DD=44V，V GS=10V，I D=10A(注2，3) -- 10.5 --nC栅极-源极电荷量Q gs-- 2.5 --栅极-漏极电荷量Q gd-- 4.0 --源-漏二极管特性参数参数符号测试条件最小值典型值最大值单位源极电流I S MOS管中源极、漏极构成的反偏P-N结-- -- 17A源极脉冲电流I SM-- -- 68源-漏二极管压降V SD I S=10A，V GS=0V -- -- 1.3 V反向恢复时间T rr I S=10A，V GS=0V，dI F/dt=100A/µs（注2）-- 43 -- ns反向恢复电荷Q rr-- 0.05 -- μC 注：1. L=1mH，I AS=13A，V DD=25V，R G=25Ω，开始温度T J=25°C；2. 脉冲测试：脉冲宽度≤300μs，占空比≤2%；3. 基本上不受工作温度的影响。
SV110 使用手册说明书
SV110 user's manualSV 110PORTABLE VIBRATIONCALIBRATOR Warsaw, August 2016 Copyright © 2015 SVANTEK. All rights reserved.SV110 user's manualof its life. Instead, hand it in at an official collection point for recycling. By doing this you will help to preserve the environment.TrademarksMicrosoft and Windows are registered trademarks of Microsoft CorporationCopyright © 2015, SVANTEK sp. z o.o.All rights reserved. No part of this publication may be reproduced or distributed in any form, or by any means, without prior written consent from SVANTEK, Warsaw, PolandSV110 user's manualCONTENTS1. General safety summary (4)2. Calibration (4)3. Accuracy of calibration (5)4. SV110 model information (5)5. Unpacking and Inspecting the package contents (6)6. Getting started (7)7. Manual control of the calibrator (8)7.1. Turning on/off (8)7.2. Menu content (9)8. Calibration (11)9. General Care and Cleaning (13)10. Charging (14)11. Technical data (16)12. Recalibration of SV110 (14)Document history (17)SV110 user's manual1. General safety summaryReview the following safety precautions to avoid injury and prevent from damaging this product or other products connected with it. To avoid potential hazards, use this product only as specified. Qualified personnel should only perform the service procedures.Warnings, precautions and maintenance:Use a proper AC/DC adapter, specified for this product and certified for the country of its use.Keep the product’s surfaces clean and dry.Even when the device is not in use it is recommended to charge the battery once a month to keep it in good stateIt is recommended to carry out a technical inspection and recalibration of the device every 12 months to ensure accurate calibration levelRecalibration can be made by the calibration laboratory. If there is no possibility to recalibrate the device by calibration laboratory the device should be send to the manufacturer.All maintenance work and repairs can only be done by the personnel trained by the manufacturer.Handle with careSafety terms and symbols:2. CalibrationOne of the fundamental questions, that are most frequently asked while taking a measurement, is whether its result is accurate. Proceeding, with a measurement without having a positive answer to this question, may result in obtaining data of no practical use and wasting our time. However, we may easily obtain the answer by performing a calibration of the vibration level meter using vibration calibrator. This device should be used before every set of measurements.The vibration calibrator is a device, which produces the vibration of the defined levels and frequency. It allows to calibrate the vibration meter in comparative way.SV110 user's manualCalibration procedure is also the best way for the complete measuring system (Meter, Cable and Transducer connected together) check. This is an essential action for the reliable measurements performed in the field!3. Accuracy of calibrationEach measurement performed by any measurement device is burdened with an error. Result obtained from such measurement is only an estimate of the real value of the measured quantity. Hence, the purpose of calibration is to limit this inevitable error to a certain acceptable level. Maximum absolute value of the error of the generated vibration signals is called the tolerance and is strictly defined by the standard ISO8041:2005.4. SV110 model informationThe SV 110 is a hand-held vibration calibrator designed for verification of machine sensors as well as on-site checks of human vibration accelerometers in accordance to ISO 8041:2005.The two standard frequencies 79.58 and 159.2 Hz brings opportunity to calibrate wide range of an existing transducers with maximum load of 0.3 kg.Depending on the selected frequency, the user can select the level of the calibration from 1 m/s2 to 10 m/s2.Because of its own internal rechargeable battery, it is a truly mobile and flexible device designed to use either in a laboratory or during fieldwork.The light weight of the calibrator allows to perform transducers calibration in the field conditions keeping it in hands.Two diodes indicate the external vertical and horizontal vibration that can affect the tolerances specified by the ISO8041:2005.Accelerometers are conveniently attached using either a mounting stud, a mounting disc or a dedicated adapters. The calibrator has built-in rechargeable batteries that power it for 12 hours of continuous operation*.The calibrator has a robust casing with the leather cover forhand-arm in field use.*) In case of 79.58 Hz frequency and accelerometer weight less than 200g. For other frequency and/or accelerometer weight continuous operation time will be shorter.SV110 user's manual5. Unpacking and Inspecting the package contentsIf the device has been kept or transported in low temperature (below 0 °C), it is recommended to leave it for a few hours in room temperature before connecting it to the power supply. If any steam condensation appears, it is recommended not to connect the device to the mains electricity for 4 to 8 hours until the exterior surface is dry.Despite careful packing, the risk of the device damage cannot be entirely eliminated.Upon delivery, please make sure that the device is not damaged and verify that you received the ordered equipment and optional accessories (if ordered). In case of any problems, please contact an authorized Svantek representative, the service staff or the manufacturer directly.Before the first use of the device, in order to charge the battery completely, connect SA 54 AC/DC adapter plug to SV110 USB socket and then connect it to electrical mains.The complete set includes the following items:SV 110 – Portable Vibration CalibratorSA 54 – Charger/power supply for SV 110SC 56 - mini USB 2.0 cableSA 81 – leather coverCD with user manualBuilt-in rechargeable batteriesOptional adapters:SA 105A - adapter for SV 105A (option)SA 155 - adapter for SV150 and SV151 (option)SA 40 - adapter for SV 207A, Dytran 3233A, SV 39A, Dytran 3143M1 (option)SA 44 - adapter for SV 50, Dytran 3023M2 (option)SV110 user's manual6. Getting startedThe following figures show the SV 110 controls and ports:SV110 vibration calibrator1.Shaker;2.Rubber covers;3.Keyboard;4.Aluminum casing;5.Display;B port;7.External vibration diodes.12345617SV110 user's manualFollowing the requirements of ISO 8041, the calibrator’s built-in reference accelerometer measures the cross-axis (transverse) vibrations to detect any interference to the calibration signal. Faults caused by transverse vibrations are indicated by two LEDS on the calibrator’s housing. This unique solution ensures stability of both the calibration level & frequency, independent from the mass of the test object.7. Manual control of the calibratorThe Instrument’s keypad is designed to be minimal, but still highly ergonomic and easy to use providing effective operational capabilities. Thanks to that, the number of the control push-buttons of the instrument is reduced to only three.SV110 keyboard1.Vibrations level button;2.Start/Stop button;3. Charge diode;4.Display box;5.Vibration frequency button;6. Battery diode;7. USB port.General keys functions:Start/stop the calibrator and the shaker with the <Start/Stop> keyEnter/escape the Menu mode with simultaneously pressing <Level> and <Freq.> keys Scroll the Menu lists with the <Level> and <Freq.>Open the sub-menu with the <Start/Stop> key pressed at the selected position Increase/decrease the value of signal level, frequency and the calibration factor.7.1. Turning on/offTURNING ON: To switch the power on the operator should hold the <Start/Stop> key for a couple of seconds. The instrument switches on and goes the self-test routine12 45 6 37SV110 user's manual(during this time the manufacturer's logo, the name of the instrument and firmware version is displayed).In the ready to operate mode the SV 110 displays theamplitude and frequency of the shaker:TURNING OFF: To shut down the unit the operator should hold the <Start/Stop> key for a couple of seconds during which a countdown (“Shutting down” 3… 2… 1… ) is displayed. Thus, the SV 110 gives you time to decide if you really want to turn off the instrument. If you release the key too early, the SV 110 returns to the last presented VIEW mode.If the battery capacity is low SV 110 will show a “Low Battery!” or “Warning! Low Battery!” messages appear when the shaker is stopped or is working accordingly.7.2. Menu contentThe menu is simply operated by three push-buttons and small OLED display. The Menu list consists of six positions: Sensor Type, Units, Frequency Units, Calibration, Battery, USB charging and Unit Label.To enter the Menu mode the user should press <Level> and <Freq.> keys simultaneously. The <Level> and <Freq.> keys enable the user To scroll the Menu list down and up. To open the sub-menu the user should press <Start/Stop>key at the selected position. Sensor type selectionThe Sensor Type position enables the user to select the type of used sensor: Accelerometer or Velocity and Displacement transducer.For each sensor type and frequency there is dedicated set of charger amplitudes (see chapter “Technical data”): <Start/Stop> <Level>For 79.58Hz:-1; 2; 3; 4; 5; 6; 7; 8; 9; 10 m/s2; -2, 4, 6, 8 10, 12, 14, 16, 18 20 mm/s; -4, 8, 12, 16, 20, 24, 28, 32, 36, 40 µm.SV110 user's manualFor 159.2Hz:-1; 2; 3; 4; 5; 6; 7; 8; 9; 10 m/s2; -1; 2; 3; 4; 5; 6; 7; 8; 9; 10 mm/s; -1; 2; 3; 4; 5; 6; 7; 8; 9; 10 µm.Measurement units selectionThe Units position enables the user to select the measurement unit: Linear Metric or Not Metric . <Start/Stop>Frequency units selectionThe Frequency Units position enables the user to selectthe frequency units: Hz or CPM (Cycles per minute). <Start/Stop><Freq.>The screen on the right presents the ready to operate mode with Non Metric units and CPMfrequency. Calibration factor settingThe Calibration position enables the user to set the calibration factor for different calibration frequencies:79.58Hz and 159.2Hz.<Start/Stop>If the user decided to change the calibration factor hemust press the <Freq.>key. After this to set the calibration Factor with the <Level>(“-“) or <Freq.> (“+”) keys. <Freq.><Freq.>Battery controlThe Battery position enables the user to check the battery condition. <Start/Stop>USB chargingThe USB charging position enables the user to switch on <Start/Stop>SV110 user's manualor off the charging via USB port. If USB charging is switched off the unit will not charge the internal batteries via USB also when connected to USB source.Unit specific informationThe Unit Label position enables the user to read the unit specific information:Copyrighted manufacturer name: SVANTEK (C)Instrument name: SV 110Unit serial number: SN 3500Firmware version: 1.02.1CRC(OK): 8BD4Standards that instrument conforms: ISO 8041:2005 <Start/Stop> <Level> <Level> <Level>8. CalibrationInstall the calibrated sensor on the shaker. The SV 105 Hand-Arm sensor is calibrated with the use of dedicatedadapter.The Adapter should be installed on the shakerwith the special stud.SV110 user's manualNotice: The SV 105 Hand-Arm sensor should be calibrated at 79,58 Hz only!purpose accelerometer is connected to theshaker with the use of magnet adapter or with the specialstud.Switch on calibrator by pressing <Start/Stop>key for awhile. In ready to operate mode the SV 110 displays theamplitude and frequency of the shakerBy pressing the <Freq.> key select the shaker frequency: 79.58Hz or 159.2Hz.By pressing the <Level>key select the shaker amplitude, as example for an acceleration sensor: 1m/s2, 2m/s2, 3m/s2, 4m/s2, 5m/s2, 6m/s2, 7m/s2, 8m/s2, 9 m/s2 or 10m/s2.When the frequency and amplitude are set, run the shakerby pressing<Start/Stop> key.Hold the calibrator in a hand. Wait until bothdiodes emit a green light. This means that thecalibration process is not disturbed by an externalvibration.Placing calibrator on a surface may cause appearance of transverse vibrations which issignalized by the right-hand side LED diodeemitting a red light.X and Y LEDs flashing yellow when the device is stabilisingin Z axis direction. When the required level is achieved theLEDs stop flashing.If X and Y LEDs light red steadily it means that external vibrations’ level in X or Y directions are higher than 10% (-20dB) of vibration level generated by shaker in Z direction.After external vibration is stabilized the LEDs are changedto green. Stable condition is indicated also by message“Level OK”.SV110 user's manualIf the calibration level is achieved by the unit, the X, Y vibration level is indicated as a % of vibration level generated by shaker in Z direction, but only if this levelexceeds 10% value.THD compensationTHD (Total harmonic distortion) – means that the harmonics on Z axis exceed threshold 3% (-30,5 dB) of reference vibration level. In this case Z-diode stats to flash with red light.For example: When the vibrations are set with ≈80 Hz, 1 m/s2(120 dB), then the total vibrations amount with frequencies n*16 HZ (160, 240, 320, 400,...) cannot be higher than 0,03 m/s2 (89,5 dB).If the unit detects the high THD level at 79.58Hz it will try to compensate it. If compensation is possible the“THD Compensation” message appears.If compensation fails or in case the high THD level is detected at 159.2Hz, but the unit can achieve the calibration level, the “Level OK, High THD!” messageappears.If the unit cannot achieve the calibration level at the required frequency, the “Level unreachable” message appears and calibration is stopped. The user will beproposed to exit this screen.The inner temperature of the calibrator is constantly controlled and if it is exceeds the certain dangerous level, the device is automatically stopped the shaker. Such situation may be caused by too heavy accelerometer. If this happened the “High temperature” message appears and the user should wait until the device temperature isnormalised and continue the calibration.To stop the shaker press<Start/Stop> key.Switch of the calibrator by pressing <Start/Stop> key for a couple of seconds during which a countdown (“Shutting down” 3… 2… 1… ) is displayed.9. General Care and CleaningRemove the sensor and switch the device off.Disconnect the device from the power supply.Wipe the device’s surface with the cloth damped with the mixture of warmwater and detergent.SV110 user's manualAfter cleaning, wipe the device with dry cloth and wait until the surface iscompletely dry.Do not immerse the device in any fluids as this may damage the device andcause electrical shock. Only the external parts of the device should be cleaned 10. ChargingSV 110 instrument is equipped with an internal charger, so that the fixed internal batteries can be charged directly from USB port or charger (SA 54).Notice: It is recommended to charge the unit with charger SA 54! Charging viaUSB port is optional and by default is switched off. To charge via USB it isnecessary to have USB port with 500mA.Ensure the SV 110 is fully charged prior to use by connecting it to a USB port or to USB charger. The SV 110will automatically switch on during charging and display how much the internal instrument battery is loaded. The SV 110will display ‘Fully charged’ once charging is complete. Full charging from SA 54should take approximately 5 hours from a fully discharged state. Charging from PC via USB port is much slower and takes approximately 10 hours for fully discharged battery. A fully charged instrument holds enough charge to run maximum 12 hours of work with attached accelerometer.Notice: Use only high quality USB cables. Many poor quality cables do not ensurelow resistance of the cable, thus disabling proper charging of the internal cells.11. Recalibration of SV110Recalibrations have to be done for all frequencies with vibrations’ level set as shown in the table below:Recalibration for frequency 159.2Hz:SV110 user's manualInstall the reference sensor and start the shaker with 159.2Hz and 10m/s 2vibrations parameters.Wait until the vibrations are steady (diodes are lighting with green continuous light and information “Level OK ”is displayed).Read the vibrations level value from the reference sensor. When it is the same as the set one skip to the next frequency. When it differs it is necessary to enter/modify the calibration coefficient. Stop the shaker by pressing <Start/Stop> button When the device is idle press buttons <Level> and <Freq.>at the same time to enter the menu.Select the sensor type in the Sensor Type position: Accelerometer , Velocity or Displacement.With the <Level> button select the Calibrationposition. With the <Level> button select the required frequencyof the shaker.With the <Start/Stop> button enter the Calibrationmenu.Press the <Freq.> button (“Change ”) and select the new calibration Factor with the <Level> (“-“) or <Freq.> (“+”)buttons.Press the <Start/Stop> button to confirm new calibration Factor and exit the Calibration menu.Notice: As the calibration coefficient is set, it is recommended to repeat the measurement with reference sensor.Use one of formulas bellow:[dB]C = Ar – AcSV110 user's manualWhere:A – standard sensor vibration level–set vibration level of calibrated deviceWhere:Ac- set vibrations level of calibrated device [dB]Ar – standard sensor vibration level [dB].12. Technical dataµmSV110 user's manual。
SY88923AV资料
s 3.3V and 5V power supply options s Up to 3.2Gbps operation s Low noises Chatter-Free LOS Generation s Open Collector TTL LOS Output s TTL /EN Inputs Differential PECL inputs for data s Single power supplysDesigned for use with (Micrel-Synergy laser diode driver and controller)s Available in a tiny 10-pin (3mm) MSOPThe SY88923AV limiting post amplifier with its high gain and wide bandwidth is ideal for use as a post amplifier in fiber-optic receivers with data rates up to 3.2Gbps. Signals as small as 5mVp-p can be amplified to drive devices with PECL inputs. The SY88923AV generates a chatter-free Loss of Signal (LOS) open collector TTL output.The SY88923AV incorporates a programmable level detect function to identify when the input signal has been lost. The LOS output will change from logic “LOW” to logic “HIGH” when input signal is smaller than the swing set by LOS LVL . This information can be fed back to the EN input of the device to maintain stability under loss of signal condition. Using LOS LVL pin, the sensitivity of the level detection can be adjusted. The LOS LVL voltage can be set by connecting a resistor divider between V CC and V REF show in Figure 3. Figure 4, 5, 6, and 7 show the relationship between input level sensitivity and the voltage set on LOS LVL.The LOS output is a TTL open collector output that requires a pull-up resistor for proper operation, Figure 1.s 1.25Gbps and 2.5Gbps Gigabit Ethernets 531Mbps, 1062Mbps and 2.12Gbps Fibre Channel s 622Mbps SONETs Gigabit Interface Converter s 2.5Gbps SDH/SONETs 2.5Gbps Proprietary Links sParallel 10G EthernetFigure 1. LOS Output with Desired Rise TimeΩV /EN DIN /DIN VREF LOSLVL VCC DOUT /DOUT LOS GNDGND/ENLOSD IN /D IN V REF V CC LOS LVLD OUT /D OUTMICREL-SYNERGY3250 SCOTT BOULEVARD SANTA CLARA CA 95054USA TEL + 1 (408) 980-9191 FAX + 1 (408) 914-7878 WEB This information is believed to be accurate and reliable, however no responsibility is assumed by Micrel for its use nor for any infringement of patents or other rights of third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent right of Micrel Inc.© 2000 Micrel Incorporated。
第四部分CQI-17 教材-ESD
更多地阐明可参考标准ANSI/ESD S541。
序言
物体的任何相对移动和本体分离，或固体，液体及含有微粒的气体的流 动，都能产生静电荷。通常的静电放电源包括人员，常用的聚合物制成 的物体，和制程设备。在下列情况下，静电放电就会发生： i. 一个带电物体接近并接触静电放电敏感器件，或 ii. 当一个静电放电敏感器件暴露在一个静电场中的时候，将它接地。
静电的危害 实例:
1. 手机出现的经常死机、自动关机、话音质量差、杂音大、信号 时好时差、按键出错等问题有绝大多数与静电损伤相关。也因 为这一点，静电放电被认为是电子产品质量最大的潜在杀手， 静电防护也成为电子产品质量控制的一项重要内容。而国内外 品牌手机使用时稳定性的差异也基本上反映了他们在静电防护 及产品的防静电设计上的差异。 集成电路的最小线宽已经降到了45nm这意味着按照10MV/CM计算 的理论耐击穿能力只有45V，可能只是我们弯腰捡起一片纸张时 产生的静电压的 1/20，而另一些领域，如硬盘行业中的生产对 静电控制的要求已经降到5V以下。
定义和工作人员安全
4.0 定义 本文件中所使用的用语与EOS/ESD协会的词汇表，EOS/ESD ADV 1.0，中 的词汇，是相符合的。 5.0 工作人员安全 文件中描述的工作流程和设备，或许会导致操作人员暴露于有害的电气 环境。本文件的使用者应自己负责选择符合相关法律，管理条例和内外 部政策的设备。用户要慎重地注意到，本标准不能替换或代替任何其它 关于操作人员安全的要求。 无论在哪里，只要操作人员会与电源相接触的地方，接地断路器(GFCI) 和其它安全保护措施应被采用。
术语和定义
3. 带电器件模型敏感度（CDM）
带电器件模型的损害主要来源，是能量从一个带电器件迅速地释放。 静 电放电完全与器件相关，但器件与地电位面的相对距离，却能影响实际 的失效水平。该模型假定，当带电器件的导电管脚与具有较低的电位的 导体表面接触时，会发生迅速放电。 带电器件模型测试标准的准备过程中的一个主要问题，是如何找到适当 仪器测量放电过程。信号波形的上升时间经常是少于200微微秒。整个过 程可能发生在少于2.0纳秒的时间里。虽然时间非常短, 放电时电流却能 达到几十安培的水平。
S5688B中文资料
TOSHIBA Rectifier Silicon Diffused TypeS5688B, S5688G, S5688J, S5688NGeneral Purpose Rectifier Application· Average forward current: I F (AV) = 1.0 A· Repetitive peak reverse voltage: V RRM = 100~1000 VMaximum Ratings (Ta = 25°C)Characteristic Symbol RatingsUnitS5688B 100S5688G 400S5688J 600 Repetitive peak reversevoltageS5688NV RRM1000V Average forward currentI F (AV) 1.0 A45 (50 Hz) S5688B S5688G49 (60 Hz) 30 (50 Hz) Peak one cycle surge forward current (non repetitive)S5688J S5688NI FSM33 (60 Hz)AJunction temperature T j -40~150 °C Storage temperature rangeT stg-40~150 °CElectrical Characteristics (Ta = 25°C)Characteristic Symbol Test condition Min Typ. Max UnitPeak forward voltageV FM I FM = 1.0 A ¾ ¾ 1.2 V Repetitive peak reverse currentI RRMV RRM = rated¾¾ 10 m AMarkingCode Type B S5688B G S5688GJ S5688J N S5688NUnit: mmJEDEC ― JEITA―TOSHIBA 3-3F2A Weight: 0.18 g (typ.)i F - v FTa (max) - I F (AV)Surge forward current (non-repetitive)Instantaneous forward voltage v F(V)Number of cycles at 50 Hz and 60 HzTime t (s)M a x i m u m a l l o w a b l e a m b i e n t t e m p e r a t u r e T a (m a x ) (°C )I n s t a n t a n e o u s o n -s t a t e c u r r e n t i F (A )T r a n s i e n t t h e r m a l i m p e d a n c e r t h (j -a ) (°C /W )S u r g e f o r w a r d c u r r e n t I F S M (A )0.0010.010.1110 100010013 5 1010030 50 0.40.8 1.2 1.6 2.0 2.4 3.22.8· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property.In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. · The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice.000707EAARESTRICTIONS ON PRODUCT USE。
AV设备名称中英文对照表
AV设备名称中英文对照表1、音响设备（Audio Equipment）设备名称Equipment全频主扩音箱Speaker-Full Range低音主扩音箱Speaker-Subwoofer线阵列演出音箱Speaker-Line array返送\监听音箱Speaker-Monitor功率放大器Power Amplifier调音台（8路）Audio Mixer-8 way调音台（12路）Audio Mixer-12 way调音台（16路）Audio Mixer-16 way调音台（24路）Audio Mixer-24 way调音台（32路）Audio Mixer-32 way无线麦克风Wireless Mic.领夹麦克风lapel Mic.有线麦克风Cabel Mic.定向电容麦克风Capacitance Mic(讲台麦克风)Podium Mic数字录音机Date recorder均衡器EQ效果器Effect压限器Gabbed Compress反馈抑制器Feedback control卡座录音机CrossoverCD机CD PlayerMD机MD Player信号缆Signal Cable2、视频设备（Viedo Equipment）：设备名称Equipment投影机（液晶）LCD Projector幻灯机Slide Projectors投影仪(16mm) Filmstrip Projectors实物投影仪Visualizer正投幕Front Screen背投幕Rear Screen电动投影幕Electromotion ScreenRGB-视频转换器SONY1024视频特技台Video Mixer视频选择器Video Switcher视频分配器Video Distribute视频分配器VGA DistributeRGB选择器VGA SwitcherRGB 矩阵VGA Matrix Switcher连屏信号分配器ANALOG WAY等离子显示器Plasma监视器MonitorLED电视墙LED Video Wall-16Lattice摄像机Camera录像机VCRBETA录像机BETA Video tape recorderDVD机DVD Player液晶显示器LCD Display电视机（21寸-34寸）TV Set触摸屏Touch Display3，灯光系统（Light Systems）：设备名称EquipmentPAR灯Parcan换色器color scroller扫描电脑灯Scan Moving Light摇头电脑灯Moving Light 1200W染光电脑灯Coloration Moving LightLogo片（玻璃）Logo Parcel-GlassLogo片（金属）Logo Parcel- Sheet copper频闪灯Flashing Light成像灯ETC追光灯Follow Spot星空玫瑰Sky Rose城市之光City ColorAC灯AC Light观众灯Spectator Light三基色Tricolor Light天（地）排灯Velarium Light回光灯Return Light激光灯Laser lightTRUSS架Truss电葫芦Truss MotorT型架Light TreeH架H Shelf灯控台Light Console电脑灯控制台Moving Light Console珍珠2000调光台Pearl 2000可控硅Dimmer Pack4，办公设备（Office Automation）设备名称EquipmentPC机Computer, PC笔记本本电脑Laptop黑白激光打印机LaserJat Printer, B&W彩色激光打印机LaserJat Printer, Color复印机Photocopier激光普通纸传真机Laser Fax碎纸机（A级保密）Paper Cut5，同传设备（SI Systems）：设备名称Equipment中央控制器Mains voltage on delivery译员机Interpreter’s Set辐射板High output power翻译房Interpreter booth接收机（耳机）Infra-red receivers即席发言代表机Delegate Extempore Machine 6，其它设备（Others）：设备名称Equipment无线表决器Wireless Vote表决器主机系统Vote Systems电视电话会议系统Conference Call Sytems发电车Cynamo Camin对讲机Walking Talking有线对讲Intercom。
Private全系列名目
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AV16823DL资料
74ALVT1682318-bit bus-interface D-type flip-flop with reset and enable;3-stateRev. 04 — 2 August 2005Product data sheet1.General descriptionThe 74ALVT16823 18-bit bus interface register is designed to eliminate the extrapackages required to buffer existing registers and provide extra data width for widerdata/address paths of buses carrying parity.The 74ALVT16823 has two 9-bit wide buffered registers with clock enable (pin nCE) andmaster reset(pin nMR)which are ideal for parity bus interfacing in high microprogrammedsystems.The registers are fully edge-triggered. The state of each D input, one set-up time beforethe LOW-to-HIGH clock transition is transferred to the corresponding Q output of theflip-flop.It is designed for V CC operation from 2.5 V to 3.0 V with I/O compatibility to 5 V.2.Featuress Two sets of high speed parallel registers with positive edge-triggered D-type flip-flopss 5 V I/O compatibles Ideal where high speed, light loading, or increased fan-in are required with MOSmicroprocessorss Bus hold data inputs eliminate the need for external pull-up resistors to hold unusedinputss Live insertion and extraction permitteds Power-up 3-states Power-up resets No bus current loading when output is tied to 5 V buss Output capability: +64 mA to−32 mAs Latch-up protection:x JESD78: exceeds 500 mAs ESD protection:x MIL STD 883, method 3015: exceeds 2000 Vx Machine Model: exceeds 200 V3.Quick reference data4.Ordering informationTable 1:Quick reference data T amb = 25°C.Symbol Parameter ConditionsMin Typ Max Unit t PLH propagation delay nCP to nQx C L = 50 pF; V CC =2.5V 1.5 2.9 4.5ns C L = 50 pF; V CC =3.3V 1.0 2.3 3.1ns t PHL propagation delay nCP to nQx C L = 50 pF; V CC =2.5V 1.4 2.7 4.2ns C L = 50 pF; V CC =3.3V 1.0 2.1 2.9ns C i input capacitance V I = 0 V or V CC -3-pF C o output capacitance V I/O = 0 V or V CC -9-pF I CCquiescent supply currentoutputs disabled;V CC =2.5V -40-µA outputs disabled;V CC =3.3V-70-µATable 2:Ordering informationType numberPackagetemperature range NameDescriptionVersion 74ALVT16823DL −40°C to +85°C SSOP56plastic shrink small outline package; 56leads;body width 7.5mmSOT371-174ALVT16823DGG−40°C to +85°CTSSOP56plastic thin shrink small outline package;56leads;body width 6.1mmSOT364-15.Functional diagramFig 1.IEC logic symbolFig 2.Bushold circuit (one data input)4D1,2543525516498489471045128D5,644134314421541164017381937203621342333243126001aad24255G328R65627EN530G72EN1R23C41291D01D11D21D31D41D51D61D71D82D02D12D22D32D42D52D62D72D81Q01Q11Q21Q31Q41Q51Q61Q71Q82Q02Q12Q22Q32Q42Q52Q62Q72Q81CE 2MR 1CP 2OE 2CE 1OE 1MR 2CP 7C8001aad245data input to internal circuitV CCxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx74ALVT16823_4© Koninklijke Philips Electronics N.V . 2005. All rights reserved.Product data sheet Rev. 04 — 2 August 20054 of 20Philips Semiconductors74ALVT1682318-bit bus-interface D-type flip-flop with reset and enable; 3-stateFig 3.Logic diagram001aad243nQ8nD8nQ3nD3nQ2nD2nQ1nD1nQ0nD0nD QnCPRnD QRnD QRnD QRnD QRnOEnMR CP CP CP CP CP nCEnQ4nD4nD QRCP nQ5nD5nD QRCP nQ6nD6nD QRCP nQ7nD7nD QRCP6.Pinning information6.1Pinning6.2Pin descriptionFig 4.Pin configuration74ALVT168231MR 1CP 1OE 1CE 1Q01D0GND GND 1Q11D11Q21D2V CC V CC 1Q31D31Q41D41Q51D5GND GND 1Q61D61Q71D71Q81D82Q02D02Q12D12Q22D2GND GND 2Q32D32Q42D42Q52D5V CC V CC 2Q62D62Q72D7GND GND 2Q82D82OE 2CE 2MR 2CP001aad4031234567891011121314151617181920212223242526272856555453525150494847464544434241403938373635343332313029Table 3:Pin descriptionSymbol Pin Description1MR 1 1 master reset input (active-LOW)1OE 2 1 output enable input (active-LOW)1Q03 1 data output 0GND 4ground (0 V)1Q15 1 data output 11Q26 1 data output 2V CC 7supply voltage 1Q381 data output 3Table 3:Pin description …continuedSymbol Pin Description1Q49 1 data output 41Q510 1 data output 5GND11ground (0 V)1Q612 1 data output 61Q713 1 data output 71Q814 1 data output 82Q015 2 data output 02Q116 2 data output 12Q217 2 data output 2GND18ground (0 V)2Q319 2 data output 32Q420 2 data output 42Q521 2 data output 5V CC22supply voltage2Q623 2 data output 62Q724 2 data output 7GND25ground (0 V)2Q826 2 data output 82OE27 2 output enable input (active-LOW)2MR28 2 master reset input (active-LOW)2CP29 2 clock pulse input (active rising edge) 2CE30 2 clock enable input (active-LOW)2D831 2 data input 8GND32ground (0 V)2D733 2 data input 72D634 2 data input 6V CC35supply voltage2D536 2 data input 52D437 2 data input 42D338 2 data input 3GND39ground (0 V)2D240 2 data input 22D141 2 data input 12D042 2 data input 01D843 1 data input 81D744 1 data input 71D645 1 data input 6GND46ground (0 V)1D547 1 data input 51D448 1 data input 41D349 1 data input 37.Functional description7.1Function table[1]H = HIGH voltage level;h = HIGH voltage level one set-up time prior to the LOW-to-HIGH clock transition;L = LOW voltage level;l = LOW voltage level one set-up time prior to the LOW-to-HIGH clock transition;NC = no change;X = don’t care;Z = high-impedance OFF-state;↑ = LOW-to-HIGH clock transition;↑ = not a LOW-to-HIGH clock transition.8.Limiting valuesV CC 50supply voltage 1D251 1 data input 21D152 1 data input 1GND 53ground (0 V)1D054 1 data input 01CE 55 1 clock enable input (active-LOW)1CP561 clock pulse input (active rising edge)Table 3:Pin description …continuedSymbol Pin Description Table 4:Function tableOperating mode Input OutputnOEnMR nCE nCP nDx nQx clearL L X X X L load and read data L H L ↑h H l L holdL H H ↑X NC high-impedanceHXXXXZTable 5:Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit V CC supply voltage −0.5+4.6V V I input voltage [1]−0.5+7.0V V O output voltage output in OFF-state or HIGH-state [1]−0.5+7.0V I IK input diode current V I < 0 V −50-mA I OKoutput diode currentV O < 0 V−50-mA[1]The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.[2]The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability.9.Recommended operating conditionsI O output current output in LOW-state -128mA output in HIGH-state−64-mA T stg storage temperature −65+150°C T jjunction temperature[2]-150°CTable 5:Limiting values …continuedIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit Table 6:Recommended operating conditionsSymbol Parameter ConditionsMin Typ Max Unit V CC =2.5 V V CC supply voltage 2.3- 2.7V V I input voltage0- 5.5V V IH HIGH-level input voltage 1.7--V V IL LOW-level input voltage --0.7V I OH HIGH-level output current --−8mA I OLLOW-level output currentnone--8mA current duty cycle ≤50%;f ≥ 1 kHz--24mA ∆t/∆v input transition rise or fall rateoutputs enabled --10ns/V T amb ambient temperature in free air−40-+85°C V CC =3.3 VV CC supply voltage 3.0- 3.6V V I input voltage0- 5.5V V IH HIGH-level input voltage 2.0--V V IL LOW-level input voltage --0.8V I OH HIGH-level output current --−32mA I OLLOW-level output currentnone--32mA current duty cycle ≤50%;f ≥ 1 kHz--64mA ∆t/∆v input transition rise or fall rateoutputs enabled --10ns/V T ambambient temperaturein free air −40-+85°C10.Static characteristicsTable 7:Static characteristicsAt recommended operating conditions; voltages are referenced to GND (ground=0V); T amb =−40°C to +85°C. Symbol Parameter Conditions Min Typ Max Unit V CC = 2.5 V± 0.2 V[1]V IK input clamping voltage V CC = 2.3V; I IK=−18mA-−0.85−1.2VV OH HIGH-level output voltage V CC = 2.3 V to 2.7 V; I OH=−100µA V CC− 0.2V CC-VV CC = 2.3 V; I OH=−8mA 1.8 2.5-VV OL LOW-level output voltage V CC = 2.3V; I OL=100µA-0.070.2VV CC = 2.3V; I OL=24 mA-0.30.5VV CC = 2.3V; I OL=8 mA--0.4VV OL(pu)power-up LOW-level outputvoltage V CC = 2.7 V; I O = 1 mA;V I=V CC or GND[2]--0.55VI LI input leakage currentcontrol pins V CC=2.7V; V I = V CC or GND-0.1±1µAV CC = 0 V to 2.7 V; V I=5.5V-0.110µA I/O data pins V CC =2.7V; V I= V CC[3]-0.11µAV CC =2.7V; V I= 0V[3]-+0.1−5µA I OFF off current V CC = 0V; V I or V O=0V to 4.5V-+0.1±100µA I HOLD bus hold current data inputs V CC = 2.3V; V I = 0.7V[4]-100-µAV CC = 2.3V; V I = 1.7V[4]-−70-µA I EX external current into output output HIGH-state when V O>V CC;V O=5.5V; V CC=2.3 V-10125µAI PU power-up 3-state outputcurrent V CC≤ 1.2V; V O=0.5V to V CC;V I=GND or V CC[5]-1±100µAI PD power-down 3-state outputcurrent V CC≤ 1.2V; V O=0.5V to V CC;V I=GND or V CC[5]-1±100µAI OZ3-state output current V CC = 2.7 V; V I = V IL or V IHoutput HIGH state; V O = 2.3 V-0.55µAoutput LOW-state; V O = 0.5 V-+0.5−5µA I CC quiescent supply current V CC = 2.7 V; V I = GND or V CC; I O = 0Aoutputs HIGH-state-0.040.1mAoutputs LOW-state- 2.7 4.5mAoutputs disabled[6]-0.040.1mA∆I CC additional quiescent supplycurrent per input pin V CC = 2.3 V to 2.7 V; one input atV CC−0.6V, other inputs at V CC or GND[7]-0.040.4mAC I input capacitance V I = 0 V or V CC-3-pF C O output capacitance V I/O = 0 V or 3.0V-9-pF V CC = 3.3 V± 0.3 V[8]V IK input clamping voltage V CC = 3.0V; I IK=−18mA-−0.85−1.2V V OH HIGH-level output voltage V CC = 3.0 V to 3.6 V; I OH=−100µA V CC− 0.2V CC-VV CC = 3.0 V; I OH=−32mA 2.0 2.3-V[1]All typical values are at V CC = 2.5V and T amb = 25°C.[2]For valid test results, data must not be loaded into the flip-flops (or latches) after applying power.[3]Unused pins at V CC or GND.[4]Not guaranteed.[5]This parameter is valid for any V CC between 0V and 1.2V with a transition time of up to 10ms.From V CC =1.2V to V CC =2.5V ±0.2V a transition time of 100µs is permitted. This parameter is valid for T amb =25°C only.[6]I CC is measured with outputs pulled up to V CC or pulled down to ground.[7]This is the increase in supply current for each input at the specified voltage level other than V CC or GND.[8]All typical values are at V CC = 3.3V and T amb = 25°C.[9]This is the bus hold overdrive current required to force the input to the opposite logic state.V OLLOW-level output voltageV CC = 3.0V; I OL =100µA -0.070.2V V CC = 3.0V; I OL =16 mA -0.250.4V V CC = 3.0V; I OL =32 mA -0.30.5V V CC = 3.0V; I OL =64 mA-0.40.55V V OL(pu)power-up LOW-level output voltageV CC = 3.6 V; I O = 1 mA;V I =V CC or GND[2]--0.55VI LIinput leakage current control pins V CC =3.6V; V I = V CC or GND -0.1±1µA V CC = 0 V or 3.6 V; V I =5.5V -0.110µA I/O data pinsV CC = 3.6 V; V I =V CC [3]-0.51µA V CC =3.6V; V I = 0 V[3]-+0.1−5µA I OFF off currentV CC = 0V; V I or V O =0V to 4.5V -0.1±100µA I HOLDbus hold current data inputsV CC = 3V; V I = 0.8V 75130-µA V CC = 3V; V I = 2.0V −75−140-µA V CC = 3.6 V; V I = 0V to 3.6 V[9]±500--µA I EX external current into output output HIGH-state when V O >V CC ;V O =5.5V; V CC =3.0 V -10125µA I PU power-up 3-state output currentV CC ≤ 1.2V; V O =0.5V to V CC ;V I =GND or V CC[10]-1±100µA I PD power-down 3-state output currentV CC ≤ 1.2V; V O =0.5V to V CC ;V I =GND or V CC[10]-1±100µAI OZ3-state output currentV CC = 3.6 V; V I = V IL or V IH output HIGH state; V O = 3.0 V -0.55µA output LOW-state; V O = 0.5 V-+0.5−5µA I CCquiescent supply currentV CC = 3.6 V; V I = GND or V CC ; I O = 0A outputs HIGH-state -0.060.1mA outputs LOW-state - 3.9 5.5mA outputs disabled[6]-0.060.1mA ∆I CC additional quiescent supply current per input pin V CC = 3 V to 3.6 V; one input atV CC −0.6V , other inputs at V CC or GND [7]-0.040.4mA C I input capacitance V I = 0 V or V CC -3-pF C Ooutput capacitanceV I/O = 0 V or 3.0V-9-pFTable 7:Static characteristics …continuedAt recommended operating conditions; voltages are referenced to GND (ground =0V); T amb =−40°C to +85°C.Symbol Parameter ConditionsMin Typ Max Unit[10]This parameter is valid for any V CC between0V and1.2V with a transition time of up to10ms.From V CC=1.2V to V CC=3.3V±0.3Va transition time of 100µs is permitted. This parameter is valid for T amb=25°C only.11.Dynamic characteristicsTable 8:Dynamic characteristicsVoltages are referenced to GND (ground=0V); for test circuit see Figure10;T amb=−40°C to+85°C.Symbol Parameter Conditions Min Typ Max UnitV CC = 2.5 V± 0.2 V[1]f max maximum clock frequency see Figure5150--MHzt PLH propagation delay nCP to nQx see Figure5 1.5 2.9 4.5nst PHL HIGH-to-LOW propagation delaynCP to nQx see Figure5 1.4 2.7 4.2nsnMR to nQx see Figure7 1.5 2.7 4.2ns t PZH output enable time to HIGH-level see Figure8 2.1 3.4 5.0nst PZL output enable time to LOW-level see Figure9 1.8 3.0 4.7nst PHZ output disable time from HIGH-level see Figure8 1.7 3.0 4.3nst PLZ output disable time from LOW-level see Figure9 1.4 2.3 3.3nst su(H)set-up time HIGHnDx to nCP see Figure6 1.00.5-nsnCE to nCP see Figure6 1.00.2-ns t su(L)set-up time LOWnDx to nCP see Figure6 1.8 1.3-nsnCE to nCP see Figure6+0.5−0.1-ns t h(H)hold time HIGHnDx to nCP see Figure6+0.1−1.4-nsnCE to nCP see Figure6 1.00.2-ns t h(L)hold time LOWnDx to nCP see Figure6+0.1−0.5-nsnCE to nCP see Figure6+1.0−0.1-ns t WH pulse width HIGH nCP see Figure5 2.00.8-nst WL pulse width LOWnCP see Figure5 3.0 2.1-nsnMR see Figure7 2.00.8-ns t rec recovery time nMR to nCP see Figure7 2.0 1.3-nsV CC = 3.3 V± 0.3 V[2]f max maximum clock frequency see Figure5250--MHzt PLH propagation delay nCP to nQx see Figure5 1.0 2.3 3.1nst PHL HIGH-to-LOW propagation delaynCP to nQx see Figure5 1.0 2.1 2.9nsnMR to nQx see Figure7 1.0 2.3 2.9ns t PZH output enable time to HIGH-level see Figure8 1.7 2.7 4.0nst PZL output enable time to LOW-level see Figure9 1.4 2.3 3.5ns[1]All typical values are measured at V CC = 2.5V and T amb = 25°C.[2]All typical values are measured at V CC = 3.3V and T amb = 25°C.12.Waveformst PHZ output disable time from HIGH-level see Figure 8 2.2 3.1 4.0ns t PLZ output disable time from LOW-level see Figure 9 1.8 2.6 3.5ns t su(H)set-up time HIGH nDx to nCP see Figure 6 1.00.5-ns nCE to nCPsee Figure 6 1.00.1-ns t su(L)set-up time LOW nDx to nCP see Figure 6 1.6 1.1-ns nCE to nCPsee Figure 6+0.5−0.5-ns t h(H)hold time HIGH nDx to nCP see Figure 6+0.1−0.7-ns nCE to nCPsee Figure 6 1.00.5-ns t h(L)hold time LOW nDx to nCP see Figure 6+0.1−0.5-ns nCE to nCPsee Figure 6+1.0−0.1-ns t WH pulse width HIGH nCP see Figure 5 1.50.7-ns t WLpulse width LOW nCP see Figure 5 2.5 1.4-ns nMRsee Figure 7 2.0 1.5-ns t recrecovery time nMR to nCPsee Figure 72.01.1-nsTable 8:Dynamic characteristics …continuedVoltages are referenced to GND (ground =0V); for test circuit see Figure 10;T amb =−40°C to +85°C.Symbol Parameter ConditionsMin Typ Max Unit Measurement points are given in Table 9.V OH is a typical voltage output drop that occur with the output load.Fig 5.Propagation delay, clock input to output, clock pulse width and maximum clockfrequencyV M V MV Mt PLHt PHLt WH t WL1/f maxV Minput nCPoutput nQx0 VV I0 VV OH001aad399Measurement points are given in Table 9.The shaded areas indicate when the input is permitted to change for predictable output performance.Fig 6.Data set-up and hold timesMeasurement points are given in Table 9.V OH is a typical voltage output drop that occur with the output load.Fig 7.Master reset pulse width, master reset to output delay and master reset to clockrecovery timeMeasurement points are given in Table 9.V OH is a typical voltage output drop that occur with the output load.Fig 8.3-state output enable time to HIGH-level and output disable time from HIGH-level001aad401V M input nDx,nCEinput nCPV M V M V MV MV M t su(H)t h(H)t su(L)t h(L)0 V0 VV IV Iinput nMRinput nCPoutput nQxt PHLt WLt RECV M0 VV OH0 V0 VV M V MV M001aad400V IV I001aad402V M V YV Mt PHZt PZHV MV OH0 V0 Vinput nOEoutput nQxV IMeasurement points are given in Table 9.V OL is a typical voltage output drop that occur with the output load.Fig 9.3-state output enable time to LOW-level and output disable time from LOW-level Table 9:Measurement pointsSupply voltageInput Output V MV M V XV Y≥3 V 1.5 V 1.5 V V OL + 0.3V V OH − 0.3 V ≤2.7 V0.5× V CC0.5×V CCV OL + 0.3VV OH − 0.3 V001aad404input nOEV M V MV Xt PLZt PZLoutput nQxV M0 VV OLV IV IMeasurement points are given in Table9.a.Input pulse definitionTest data is given in T able10.Definitions test circuit:R L = Load resistor.C L = Load capacitance including jig and probe capacitance.R T = Termination resistance should be equal to output impedance Z o of the pulse generator.V EXT = Test voltage for switching times.b.T est circuitFig 10.Load circuitry for switching timesTable 10:Test dataInput Load V EXTV I f i t W t r, t f C L R L t PLZ, t PZL t PLH, t PHL t PHZ,t PZH3.0 V or V CC whichever is less ≤ 10 MHz500 ns≤ 2.5 ns50 pF500Ω 6 V or2× V CCopen GND001aac221V M V Mt Wt W10 %90 %90 %0 VV IV Inegativepulsepositivepulse0 VV M V M90 %10 %10 %t THL(t f)t TLH(t r)t TLH(t r)t THL(t f)V EXTV CCV I V Omna616DUTC LR TR LR LPULSEGENERATOR13.Package outlineFig 11.Package outline SOT371-1 (SSOP56)UNIT A 1A 2A 3b p c D (1)E (1)e H E L L p Q Z y w v θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTIONISSUE DATE IECJEDEC JEITAmm0.40.22.352.200.250.30.20.220.1318.5518.307.67.40.63510.410.11.00.61.21.00.850.4080oo 0.180.251.40.1DIMENSIONS (mm are the original dimensions)Note1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.SOT371-199-12-2703-02-18(1)w Mb pD H EE Z ecv M AXAy5629MO-118281θAA 1A 2L pQdetail XL(A )3pin 1 index0510 mmscaleSSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mmSOT371-1Amax.2.8Fig 12.Package outline SOT364-1 (TSSOP56)UNIT A 1A 2A 3b p c D (1)E (2)e H E L L p Q Z y w v θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTIONISSUE DATE IECJEDEC JEITAmm0.150.0580oo 0.1DIMENSIONS (mm are the original dimensions).Notes1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.SOT364-199-12-2703-02-19w MθAA 1A 2D L p Qdetail XE ZecLX(A )30.251285629ypin 1 indexb H 1.050.850.280.170.20.114.113.96.26.00.518.37.90.500.350.50.10.080.250.80.4pEv M AATSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1Amax.1.20 2.5 5 mmscaleMO-15314.Revision historyTable 11:Revision historyDocument ID Release date Data sheet status Change notice Doc. number Supersedes74ALVT16823_420050802Product data sheet--74ALVT16823_3 Modifications:•The format of this data sheet has been redesigned to comply with the new presentation andinformation standard of Philips Semiconductors.•Section2: modified ‘Jedec Std 17’ into ‘JESD78’•Table8: changed propagation delays.74ALVT16823_319980612Product specification-9397 750 0401674ALVT16823_2 74ALVT16823_219980612Product specification-9397 750 0401674ALVT16823 74ALVT1682319980303----15.Data sheet status[1]Please consult the most recently issued data sheet before initiating or completing a design.[2]The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL .[3]For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.16.DefinitionsShort-form specification —The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device.These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.17.DisclaimersLife support —These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductorscustomers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.Right to make changes —Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’),relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes noresponsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to theseproducts,and makes no representations or warranties that these products are free from patent,copyright,or mask work right infringement,unless otherwise specified.18.TrademarksNotice —All referenced brands, product names, service names and trademarks are the property of their respective owners.19.Contact informationFor additional information, please visit: For sales office addresses, send an email to: sales.addresses@Level Data sheet status [1]Product status [2][3]DefinitionI Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice.IIPreliminary dataQualificationThis data sheet contains data from the preliminary specification.Supplementary data will be published at a later date.Philips Semiconductors reserves the right to change the specification without notice,in order to improve the design and supply the best possible product.III Product data ProductionThis data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design,manufacturing and supply.Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).20.Contents1General description. . . . . . . . . . . . . . . . . . . . . . 12Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Quick reference data. . . . . . . . . . . . . . . . . . . . . 24Ordering information. . . . . . . . . . . . . . . . . . . . . 25Functional diagram . . . . . . . . . . . . . . . . . . . . . . 36Pinning information. . . . . . . . . . . . . . . . . . . . . . 56.1Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56.2Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 57Functional description . . . . . . . . . . . . . . . . . . . 77.1Function table. . . . . . . . . . . . . . . . . . . . . . . . . . 78Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 79Recommended operating conditions. . . . . . . . 810Static characteristics. . . . . . . . . . . . . . . . . . . . . 911Dynamic characteristics . . . . . . . . . . . . . . . . . 1112Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1213Package outline . . . . . . . . . . . . . . . . . . . . . . . . 1614Revision history. . . . . . . . . . . . . . . . . . . . . . . . 1815Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 1916Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1917Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1918Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1919Contact information . . . . . . . . . . . . . . . . . . . . 19© Koninklijke Philips Electronics N.V.2005All rights are reserved.Reproduction in whole or in part is prohibited without the priorwritten consent of the copyright owner.The information presented in this document doesnot form part of any quotation or contract,is believed to be accurate and reliable and maybe changed without notice.No liability will be accepted by the publisher for anyconsequence of its use.Publication thereof does not convey nor imply any license underpatent- or other industrial or intellectual property rights.Date of release: 2 August 2005Document number: 74ALVT16823_4。
多摩川产品资料说明
陀螺仪：可应用于航空、航天、航海、兵器、汽车、生物医学、环境监控等领域。
1、体积小、重量轻。
适合于对安装空间和重量要求苛刻的场合，例如弹载测量等。
2、低成本。
3、高可靠性。
内部无转动部件，全固态装置，抗大过载冲击，工作寿命长。
4、低功耗。
5、大量程。
适于高转速大g值的场合。
6、易于数字化、智能化。
可数字输出，温度补偿，零位校正等。
测速发电机：输出电动势与转速成比例的微特电机。
测速发电机的绕组和磁路经精确设计，其输出电动势E和转速n成线性关系，即E=Kn,K是常数。
改变旋转方向时输出电动势的极性即相应改变。
在被测机构与测速发电机同轴联接时，只要检测出输出电动势，就能获得被测机构的转速，故又称速度传感器。
测速发电机广泛用于各种速度或位置控制系统。
在自动控制系统中作为检测速度的元件，以调节电动机转速或通过反馈来提高系统稳定性和精度；在解算装置中可作为微分、积分元件，也可作为加速或延迟信号用或用来测量各种运动机械在摆动或转动以及直线运动时的速度。
电子凸轮：利用角度位置传感器来模拟机械凸轮各控制点的角度范围，并能独立输出各自的控制信号，此种设备称为电子凸轮，包含“机械凸轮＋微动开关”的基本功能。
•可以输出多路控制开关量（ON/OFF)，且每路都可以独立预设起始、终止角度。
•可以动态检测和显示实际运行角度，对设备运行和再调整实时检测。
•可以随时修改预设角度，且每一路均有LED状态指示，“开态”点亮，“关态”熄灭。
•各路输出信号在电气上相互隔离，抗干扰能力强，可靠性高。
•动作精度可达到1°typical轨迹球：外型尺寸：1、1.4、2、3英寸输出方式：PS2、USB、方波、脉冲输出轨迹球外观：透明（七色光可选）、白色、黑色本产品有发光技术及三轴两项技术专利，产品精度高，寿命长，主要运用于医学行业中的B超、SMP、雷达、舰船等行业，国内市场占有率超过70%。
同步器：同步器有常压式和惯性式。
目前全部同步式变速器上采用的是惯性同步器，它主要由接合套、同步锁环等组成，它的特点是依靠摩擦作用实现同步。
诺基亚 IPSO-VN 命令行参考手册说明书
Nokia IPSO-VN 命令行参考手册版本4.1部件编号：N450000640 Rev 001*N450000640 Rev 001*出版日期： 2008年2 月版权所有©2008 Nokia。
保留一切权利。
保留根据美国著作权法规定的各项权利。
有限权利说明美国政府在使用、复制或披露方面，受 DFARS 252.227 7013“技术数据和电脑软件使用权利”（Rights in Technical Data and ComputerSoftware）条款中的第 (c)(1)(ii) 分节规定的限制条件的约束。
不论在提供本软件时是否附有任何其他属于本电脑软件的许可协议，美国政府在使用、复制或披露方面的权利，都受限于 FAR52.227-19“商业电脑软件-有限权利”（Commercial Computer Software-Restricted Rights）条款中的有关规定。
重要须知本软件和硬件由 Nokia Inc. 以“现有状态”提供，没有任何暗示或明示担保，其中包括（但不限于）对销路和某特定目的之适用性的担保。
对于任何因使用本软件而造成的任何直接损失、间接损失、附带损失、特别损失、惩罚性的损失赔偿、或后果性损失（其中包括但不限于购买替代货物或服务；使用上的损失、数据损失或利润损失；或业务中断），不论原因如何以及基于何种责任理论，亦不论是否有合同、为严格责任或侵权行为（其中包括疏忽行为或另外其它行为），Nokia 或其附属公司、子公司或供应商将不承担任何赔偿责任。
即使对方已事先告戒有出现上述损失的可能性，亦不承担任何赔偿责任。
Nokia 保留对此处所及任何产品的更改权利，恕不另行通知。
商标Nokia 是 Nokia Corporation 的注册商标。
本文提及的其他产品是其各自所有公司的商标或注册商标。
0801012Nokia IPSO-VN 命令行参考手册Nokia IPSO-VN 命令行参考手册3Nokia 联络信息公司总部地区联络信息Nokia 客户支援中心网站 电话1-888-477-4566 或1-650-625-2000传真1-650-691-2170邮政地址Nokia Inc.313 Fairchild DriveMountain View, CA 94043-2215美国美洲Nokia Inc.313 Fairchild DriveMountain View, CA 94043-2215美国电话： 1-877-997-9199美国和加拿大境外： +1 512-437-7089电子信箱： ************************************欧洲、中东地区、非洲Nokia House, Summit AvenueSouthwood, FarnboroughHampshire GU14 ONG英国电话：英国： +44 161 601 8908电话：法国： +33 170 708 166电子信箱： ********************************亚太地区438B Alexandra Road#07-00 Alexandra TechnoparkSingapore 119968电话： +65 6588 3364电子信箱： ********************************网站：https:///电子信箱：*********************美洲欧洲电话：1-888-361-5030 或1-613-271-6721电话：+44 (0) 125-286-8900传真：1-613-271-8782传真：+44 (0) 125-286-5666亚太地区电话：+65-67232999传真：+65-672328970506024Nokia IPSO-VN 命令行参考手册目录前言 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19手册结构. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19手册约定. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19相关文档. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 241报警命令. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 alert-config local-syslog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25alert-config mail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27alert-config snmp-trap. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29alert-config syslog. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31show alert-config . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33show alert-config local-syslog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35show alert-config mail. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36show alert-config snmp-trap. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37show alert-config syslog. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38unset alert-config. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39unset alert-config mail. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40unset alert-config snmp-trap. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41unset alert-config syslog. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 422ARP 命令. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 arp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43arp timeout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45show arp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46show arp dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48show arp proxy. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49show arp static. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50show arp timeout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51unset arp dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52unset arp dynamic vlan,ethernet,channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53unset arp proxy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54unset arp proxy vlan,ethernet,channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55unset arp static. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56unset arp static vlan,ethernet,channel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 3攻击防御命令. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59Nokia IPSO-VN 命令行参考手册5attack-defense. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59attack-defense tcp-syn-cookie. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61attack-defense threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62policy session-flood. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63policy session-flood enable,disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65policy session-flood protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66show attack-defense. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68show policy session-flood. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71unset policy session-flood. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72unset policy session-flood protocol. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 734AUX 接口命令. . . . . . . . . . . . . . . . . . . . . . . . . . . . .75 aux com2 enable,disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75aux com2 poll-interval . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77service root-net-login enable,disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78service telnet,ssh,web port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79show aux . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80show root-net-login. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81show service port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 825备份恢复命令 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .83 backup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83copy backup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85copy backup internal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86delete backup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87restore from. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88restore from internal. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89show backup. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 906CAM 命令. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .91 cam-table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91cam-table timeout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93show cam-table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94show cam-table timeout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96unset cam-table dynamic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97unset cam-table static . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 987配置文件命令 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .99 copy config internal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99copy config internal to active . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101copy config to . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102delete config . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103import config from tftp. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 6Nokia IPSO-VN 命令行参考手册import config from x/zmodem. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105load config . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106save config . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107show config . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108show config default . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109show current-config. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1118调试命令. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113 debug clear. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113debug dump byte. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114debug dump complex . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115debug dump hook . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116debug dump session. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117debug file . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118debug match. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119debug show . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121debug start . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123debug stop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1249默认策略命令. . . . . . . . . . . . . . . . . . . . . . . . . . . . .125 policy default inter-zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125policy default intra-zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127show policy default . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12810DST 命令. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .129 show current timezone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129show timezone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130timezone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132timezone dst off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133timezone dst on default. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134timezone dst on manual day-day . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135timezone dst on manual day-week. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136timezone dst on manual week-day. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137timezone dst on manual week-week. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13811高可用性命令. . . . . . . . . . . . . . . . . . . . . . . . . . . . .141 auth . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141auth password . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142config check. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143config sync. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144config sync auto. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145election . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146encrypt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147 Nokia IPSO-VN 命令行参考手册7event-track. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148event-track ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149ha . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150hotstandby switch. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152ip address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153ip-track. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154peer ip address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156rti session . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157rti session default. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158rti sync. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159show ha . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160time. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162time benchmark. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163time daily . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164time sync . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165unset ip-track. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166unset rti session . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167vfid . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16812接口命令 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169 auto advertise on,off. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169bind gateway tunnel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170channel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172floating ip address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173flow control on,off. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175hold ethernet. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176hold ethernet,channel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177interface ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178ip address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179mac address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180mtu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181port mode access,trunk . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182port trunk native vlan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183port vlan. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184show GTB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185show interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186show interface channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188show interface ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190show interface tunnel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192show interface vlan. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194shutdown. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196 8Nokia IPSO-VN 命令行参考手册speed duplex . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197tunnel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198unset bind gateway . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199unset channel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200unset floating ip address. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201unset GTB. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202unset hold ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203unset hold ethernet,channel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204unset ip address. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205unset port trunk native . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206unset port vlan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207unset shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208unset tunnel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209unset vlan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210vlan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211working-type. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21213IP包过滤命令. . . . . . . . . . . . . . . . . . . . . . . . . . . . .213 policy ip-filter enable,disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213policy ip-filter global . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215policy ip-filter inter-zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218policy ip-filter intra-zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221policy ip-filter log. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224policy ip-filter number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225policy ip-filter permit,deny . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226policy ip-filter protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227policy ip-filter schedule. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229policy ip-filter timeout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231show policy ip-filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232show policy ip-filter intra-zone. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233unset policy ip-filter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 234unset policy ip-filter timeout,schedule. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23614IP-MAC 绑定命令 . . . . . . . . . . . . . . . . . . . . . . . . . . .237 policy ip-mac . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237policy ip-mac enable,disable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239show policy ip-mac . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240unset policy ip-mac . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24215语言设置命令. . . . . . . . . . . . . . . . . . . . . . . . . . . . .243 language . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243show language. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244 Nokia IPSO-VN 命令行参考手册916多播命令 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245 dvmrp cache-lifetime . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245dvmrp metric. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 246dvmrp on,off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 247dvmrp pim . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248dvmrp prune-lifetime . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 249dvmrp route. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250dvmrp ttl. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252igmp-snooping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253igmp-snooping interface-flags. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 254igmp-snooping version . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 255multicast cam-table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 256policy multicast. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 257policy multicast allowed-zone. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 259policy multicast enable,disable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260policy multicast number. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 261show dvmrp interface,neighbor,timer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 262show dvmrp route,state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 263show igmp-snooping state. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 265show policy multicast. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 266unset dvmrp route. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 268unset multicast cam-table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 269unset policy multicast . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 270unset policy multicast allowed-zone. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27117地址转换命令 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 273 policy dnat. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 273policy dnat enable,disable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275policy dnat load-balancing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 276policy dnat matching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 278policy dnat number. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 280policy mip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 281policy mip enable,disable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 283policy mip matching. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 284policy mip number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 287policy snat. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 288policy snat enable,disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 290policy snat matching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 291policy snat number. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 293show policy dnat. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 294show policy mip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 296show policy snat. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 298unset policy dnat. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300 10Nokia IPSO-VN 命令行参考手册。
CY7C1515AV18资料
Page 2 of 31 [+] Feedback
元器件交易网
Logic Block Diagram (CY7C1513AV18)
CY7C1511AV18, CY7C1526AV18 CY7C1513AV18, CY7C1515AV18
18 D[17:0]
A(19:0) 20
■ Variable drive HSTL output buffers
■ JTAG 1149.1 compatible test access port
■ Delay Lock Loop (DLL) for accurate data placement
Configurations
CY7C1511AV18 – 8M x 8 CY7C1526AV18 – 8M x 9 CY7C1513AV18 – 4M x 18 CY7C1515AV18 – 2M x 36
Address Register
21
A(20:0)
2M x 8 Array 2M x 8 Array 2M x 8 Array 2M x 8 Array
Read Data Reg. 32 16
16
Control Logic
RPS
C C
Reg.
Reg. 8 8
Reg.
8
8
8
CQ CQ Q[7:0]
Logic Block Diagram (CY7C1526AV18)
Address Register
21
A(20:0)
2M x 9 Array 2M x 9 Array 2M x 9 Array 2M x 9 Array
Read Data Reg. 36 18
CY7C024AV-20AC中文资料
3.3V 4K/8K/16K x 16/18 Dual-Port Static RAMCY7C024AV/025AV/026AV CY7C0241AV/0251AV/036AVFeatures•True dual-ported memory cells which allowsimultaneous access of the same memory location •4/8/16K × 16 organization (CY7C024AV/025AV/026AV)•4/8K × 18 organization (CY7C0241AV/0251AV)•16K × 18 organization (CY7C036AV)•0.35-micron CMOS for optimum speed/power •High-speed access: 20 and 25 ns •Low operating power—Active: I CC = 115 mA (typical)—Standby: I SB3 = 10 µA (typical)•Fully asynchronous operation •Automatic power-down•Expandable data bus to 32/36 bits or more using Master/Slave chip select when using more than one device•On-chip arbitration logic•Semaphores included to permit software handshaking between ports•INT flag for port-to-port communication •Separate upper-byte and lower-byte control •Pin select for Master or Slave•Commercial and industrial temperature ranges •Available in 100-pin TQFPNotes:1.I/O 8–I/O 15 for x16 devices; I/O 9–I/O 17 for x18 devices.2.I/O 0–I/O 7 for x16 devices; I/O 0–I/O 8 for x18 devices.3.A 0–A 11 for 4K devices; A 0–A 12 for 8K devices; A 0–A 13 for 16K devices.4.BUSY is an output in master mode and an input in slave mode.R/W L OE LI/O 8/9L –I/O 15/17LI/O Control Address DecodeA 0L –A 11/12/13L CE L OE L R/W LBUSY L I/O ControlCE L Interrupt Semaphore ArbitrationSEM L INT L M/SUB LLB L I/O 0L –I/O 7/8LR/W R OE RI/O 8/9L –I/O 15/17RCE R UB RLB R I/O 0L –I/O 7/8RUB L LB LLogic Block DiagramA 0L –A 11/1213LTrue Dual-Ported RAM Array A 0R –A 11/12/13RCE R OE R R/W R BUSY R SEM RINT R UB R LB RAddress DecodeA 0R –A 11/12/13R[1][1][2][2][4][4]12/13/148/98/912/13/148/98/912/13/1412/13/14[3][3][3][3]Pin ConfigurationsNotes:5.A12L on the CY7C025AV.6.A12R on the CY7C025AV.Top View100-Pin TQFP100 9997989623142415960611213151416454039959417269108761127283029313235343637383367666465636268697075737472718988868785939284NCNCNCNCA5LA4LINT LA2LA0LLGNDINT RA0RA1L NCNCNCNCI/O10LI/O11LI/O15LV CCGNDI/O1RI/O2RV CC9091A3LM/SR I/O14LGNDI/O12LI/O13LA1RA2RA3RA4RNCNCNCNCI/O3RI/O4RI/O5RI/O6RNCNCNCNC18192021222324258382818079787776585756555453525143444546 47484950I/O9LI/O8LI/O7LI/O6LI/O5LI/O4LI/O3LI/O2LGNDI/O1LI/OLOELSEM LVCCCELUBLLBLNCA11LA1LA9LA8LA7LA6LI/O0RI/O7RI/O8RI/O9RI/O1RI/O11RI/O12RI/O13RI/O14RGNDI/O15RŒRRWRGNDSEMRCERUBRLBRNCA11RA1RA9RA8RA7RA6RA5RCY7C024AV (4K × 16)R/W L[5][6CY7C025AV (8K × 16)Notes:7.A 12L on the CY7C0251AV.8.A 12R on the CY7C0251AVC.Pin Configurations (continued)Top View100-Pin TQFP100 9997989623142415960611213151416454039959417269108761127283029313235343637383367666465636268697075737472718988868785939284NC NC NC NC A 5L A 4L INT L A 2L A 0L BUSY L GND INT R A 0R A 1L NC NC I/O 11L I/O 12L I/O 16L V CC GND I/O 1R I/O 2R V CC 9091A 3L M/S BUSY R I/O 15L GND I/O 13L I/O 14L A 1R A 2R A 3R A 4R NC NC NC NCI/O 3R I/O 4R I/O 5R I/O 6R NC NC18192021222324258382818079787776585756555453525143444546 47484950I /O 9LI /O 7LI /O 6LI /O 5LI /O 4LI /O 3LI /O 2LI /O 10LG N DI /O 1LI /O 0LO E LS E M LV C CC E LU B LL B LN C A 11LA 10LA 9LA 8LA 7LA 6LI/O 0R I /O 7RI /O 16RI /O 9RI /O 10RI /O 11RI /O 12RI /O 13RI /O 14RG N D I /O 15RO E RR W R G N D S E M R C E R U B R L B R N C A 11R A 10R A 9R A 8RA 7R A 6RA 5RCY7C0241AV (4K × 18)I/O 8L I/O 17L I/O 8R I/O 17RR /W L[8][7]1329291908485878688898382817678777980939495969798991005960616766646563626869707573747271NC NC NC A6L A5L A4L INTL A2L A0L GND M/S A0R A1R A1L A3L BUSYR INTR A2R A3R A4R A5R NC NC NCBUSYL 5857565554535251CY7C026AV (16K × 16)NC NC NC NC I/O10L I/O11L I/O15L I/O13L I/O14L GND I/O0R VCC I/O3R GND I/O12L I/O1R I/O2R I/O4R I/O5R I/O6R NC NC NC NCVCC 17161591012111314876451819202122232425I /O 9L I /O 8L I /O 7L I /O 6L I /O 5L I /O 4L I /O 0L I /O 2L I /O 1L V C C R W L U B L L B L G N D I /O 3L S E M L C E L A 113L A 12L A 11L A 10L A 9L A 8L A 7LO E L 3435364241394038374344455048494746A 6R A 7R A 8R A 9R A 10R A 11R C E R A 13R U B R G N D R W R G N D I /O 14R L B R A 12R O E R I /O 15R I /O 13R I /O 12R I /O 11R I /O 10R I /O 9R I /O 8R I /O 7R S E M R 3332313029282726CY7C0251AV (8K × 18)Pin Configurations (continued)Top View100-Pin TQFP 100 9997989623142415960611213151416454039959417269108761127283029313235343637383367666465636268697075737472718988868785939284NC NC NC A 5L A 4L INT L A 2L A 0L BUSY L GND INT R A 0R A 1L NC NC I/O 11L I/O 12L I/O 16L V CC GND I/O 1R I/O 2R V CC 9091A 3L R I/O 15L GND I/O 13L I/O 14L A 1R A 2R A 3R A 4R NC NC NCI/O 3R I/O 4R I/O 5R I/O 6R NC NC18192021222324258382818079787776585756555453525143444546 47484950I /O 9LI /O 7LI /O 6LI /O 5LI /O 4LI /O 3LI /O 2LI /O 10LG N DI /O 1LI /O 0LO E LS E M LV C CC E LU B LL B L A 11LA 10LA 9LA 8LA 7L A 6LI/O 0R I /O 7RI /O 16RI /O 9RI /O 10RI /O 11RI /O 12RI /O 13RI /O 14RG N D I /O 15RO E R R W R G N D S E M RC E RU B RL B RA 11RA 10RA 9R A 8RA 7RA 6RA 5RI/O 8L I/O 17L I/O 8R I/O 17RR /W LCY7C036AV (16K × 18)A 13L A 13R A 12LA 12RSelection GuideCY7C024AV/025AV/026AV CY7C0241AV/0251AV/036AV-20CY7C024AV/025AV/026AV CY7C0241AV/0251AV/036AV-25Unit Maximum Access Time 2025ns Typical Operating Current 120115mA Typical Standby Current for I SB1(Both ports TTL Level)3530mA Typical Standby Current for I SB3(Both ports CMOS Level)1010µAArchitectureThe CY7C024AV/025AV/026AV and CY7C0241AV/0251AV/ 036AV consist of an array of 4K, 8K, and 16K words of 16 and 18 bits each of dual-port RAM cells, I/O and address lines, and control signals (CE, OE, R/W). These control pins permit independent access for reads or writes to any location in memory. To handle simultaneous writes/reads to the same location, a BUSY pin is provided on each port. Two Interrupt (INT) pins can be utilized for port-to-port communication. Two Semaphore (SEM) control pins are used for allocating shared resources. With the M/S pin, the devices can function as a master (BUSY pins are outputs) or as a slave (BUSY pins are inputs). The devices also have an automatic power-down feature controlled by CE. Each port is provided with its own output enable control (OE), which allows data to be read from the device.Functional DescriptionThe CY7C024AV/025AV/026AV and CY7C0241AV/0251AV /036AV are low-power CMOS 4K, 8K, and 16K ×16/18 dual-port static RAMs. Various arbitration schemes are included on the devices to handle situations when multiple processors access the same piece of data. Two ports are provided, permitting independent, asynchronous access for reads and writes to any location in memory. The devices can be utilized as standalone 16/18-bit dual-port static RAMs or multiple devices can be combined in order to function as a 32/36-bit or wider master/slave dual-port static RAM. An M/S pin is provided for implementing 32/36-bit or wider memory applications without the need for separate master and slave devices or additional discrete logic. Application areas include interprocessor/multiprocessor designs, communications status buffering, and dual-port video/graphics memory. Each port has independent control pins: Chip Enable (CE), Read or Write Enable (R/W), and Output Enable (OE). Two flags are provided on each port (BUSY and INT). BUSY signals that the port is trying to access the same location currently being accessed by the other port. The Interrupt flag (INT) permits communication between ports or systems by means of a mail box. The semaphores are used to pass a flag, or token, from one port to the other to indicate that a shared resource is in use. The semaphore logic is comprised of eight shared latches. Only one side can control the latch (semaphore) at any time. Control of a semaphore indicates that a shared resource is in use. An automatic power-down feature is controlled independently on each port by a Chip Select (CE) pin.The CY7C024AV/025AV/026AV and CY7C0241AV/0251AV/ 036AV are available in 100-pin Thin Quad Plastic Flatpacks (TQFP).Write OperationData must be set up for a duration of t SD before the rising edge of R/W in order to guarantee a valid write. A write operation is controlled by either the R/W pin (see Write Cycle No. 1 waveform) or the CE pin (see Write Cycle No. 2 waveform). Required inputs for non-contention operations are summarized in Table1.If a location is being written to by one port and the opposite port attempts to read that location, a port-to-port flowthrough delay must occur before the data is read on the output; otherwise the data read is not deterministic. Data will be valid on the port t DDD after the data is presented on the other port. Read OperationWhen reading the device, the user must assert both the OE and CE pins. Data will be available t ACE after CE or t DOE after OE is asserted. If the user wishes to access a semaphore flag, then the SEM pin must be asserted instead of the CE pin, and OE must also be asserted.Pin DefinitionsLeft Port Right Port DescriptionCE L CE R Chip Enable.R/W L R/W R Read/Write Enable.OE L OE R Output Enable.A0L–A13L A0R–A13R Address (A0–A11 for 4K devices; A0–A12 for 8K devices; A0–A13 for16K).I/O0L–I/O17L I/O0R–I/O17R Data Bus Input/Output.SEM L SEM R Semaphore Enable.UB L UB R Upper Byte Select (I/O8–I/O15 for x16 devices; I/O9–I/O17 for x18devices).LB L LB R Lower Byte Select (I/O0–I/O7 for x16 devices; I/O0–I/O8 for x18devices).INT L INT R Interrupt Flag.BUSY L BUSY R Busy Flag.M/S Master or Slave Select.V CC Power.GND Ground.NC No Connect.InterruptsThe upper two memory locations may be used for message passing. The highest memory location (FFF for the CY7C024AV/41AV, 1FFF for the CY7C025AV/51AV, 3FFF for the CY7C026AV/36AV) is the mailbox for the right port and the second-highest memory location (FFE for the CY7C024AV/ 41AV, 1FFE for the CY7C025AV/51AV, 3FFE for the CY7C026AV/36AV) is the mailbox for the left port. When one port writes to the other port’s mailbox, an interrupt is generated to the owner. The interrupt is reset when the owner reads the contents of the mailbox. The message is user defined.Each port can read the other port’s mailbox without resetting the interrupt. The active state of the busy signal (to a port) prevents the port from setting the interrupt to the winning port. Also, an active busy to a port prevents that port from reading its own mailbox and, thus, resetting the interrupt to it.If an application does not require message passing, do not connect the interrupt pin to the processor’s interrupt request input pin.The operation of the interrupts and their interaction with Busy are summarized in Table2.BusyThe CY7C024AV/025AV/026AV and CY7C0241AV/0251AV/ 036AV provide on-chip arbitration to resolve simultaneous memory location access (contention). If both ports’ CEs are asserted and an address match occurs within t PS of each other, the busy logic will determine which port has access. If t PS is violated, one port will definitely gain permission to the location, but it is not predictable which port will get that permission. BUSY will be asserted t BLA after an address match or t BLC after CE is taken LOW.Master/SlaveA M/S pin is provided in order to expand the word width by configuring the device as either a master or a slave. The BUSY output of the master is connected to the BUSY input of the slave. This will allow the device to interface to a master device with no external components. Writing to slave devices must be delayed until after the BUSY input has settled (t BLC or t BLA), otherwise, the slave chip may begin a write cycle during a contention situation. When tied HIGH, the M/S pin allows the device to be used as a master and, therefore, the BUSY line is an output. BUSY can then be used to send the arbitration outcome to a slave.Semaphore OperationThe CY7C024AV/025AV/026AV and CY7C0241AV/0251AV/ 036AV provide eight semaphore latches, which are separate from the dual-port memory locations. Semaphores are used to reserve resources that are shared between the two ports. The state of the semaphore indicates that a resource is in use. For example, if the left port wants to request a given resource, it sets a latch by writing a zero to a semaphore location. The left port then verifies its success in setting the latch by reading it. After writing to the semaphore, SEM or OE must be deasserted for t SOP before attempting to read the semaphore. The semaphore value will be available t SWRD + t DOE after the rising edge of the semaphore write. If the left port was successful (reads a zero), it assumes control of the shared resource, otherwise (reads a one) it assumes the right port has control and continues to poll the semaphore. When the right side has relinquished control of the semaphore (by writing a one), the left side will succeed in gaining control of the semaphore. If the left side no longer requires the semaphore, a one is written to cancel its request.Semaphores are accessed by asserting SEM LOW. The SEM pin functions as a chip select for the semaphore latches (CE must remain HIGH during SEM LOW). A0–2 represents the semaphore address. OE and R/W are used in the same manner as a normal memory access. When writing or reading a semaphore, the other address pins have no effect.When writing to the semaphore, only I/O0 is used. If a zero is written to the left port of an available semaphore, a one will appear at the same semaphore address on the right port. That semaphore can now only be modified by the side showing zero (the left port in this case). If the left port now relinquishes control by writing a one to the semaphore, the semaphore will be set to one for both sides. However, if the right port had requested the semaphore (written a zero) while the left port had control, the right port would immediately own the semaphore as soon as the left port released it. Table 3 shows sample semaphore operations.When reading a semaphore, all sixteen/eighteen data lines output the semaphore value. The read value is latched in an output register to prevent the semaphore from changing state during a write from the other port. If both ports attempt to access the semaphore within t SPS of each other, the semaphore will definitely be obtained by one side or the other, but there is no guarantee which side will control the semaphore.Table 1.Non-Contending Read/WriteInputs OutputsCE R/W OE UB LB SEM I/O9–I/O17I/O0–I/O8OperationH X X X X H High Z High Z Deselected: Power-DownX X X H H H High Z High Z Deselected: Power-Down L L X L H H Data In High Z Write to Upper Byte Only L L X H L H High Z Data In Write to Lower Byte Only L L X L L H Data In Data In Write to Both BytesL H L L H H Data Out High Z Read Upper Byte OnlyL H L H L H High Z Data Out Read Lower Byte OnlyL H L L L H Data Out Data Out Read Both BytesX X H X X X High Z High Z Outputs DisabledH H L X X L Data Out Data Out Read Data in Semaphore FlagX H L H H L Data Out Data Out Read Data in Semaphore FlagH X X X L Data In Data In Write D IN0 into Semaphore FlagX X H H L Data In Data In Write D IN0 into Semaphore Flag L X X L X L Not AllowedL X X X L L Not AllowedTable 2.Interrupt Operation Example (assumes BUSY L = BUSY R = HIGH)[9]Left Port Right Port Function R/W L CE L OE L A0L–13L INT L R/W R CE R OE R A0R–13R INT R Set Right INT R Flag L L X FFF[12]X X X X X L[11] Reset Right INT R Flag X X X X X X L L FFF (or 1/3FFF)H[10] Set Left INT L Flag X X X X L[10]L L X1FFE (or 1/3FFE)X Reset Left INT L Flag X L L1FFE[12]H[11]X X X X X Table 3.Semaphore Operation ExampleFunction I/O0–I/O17 Left I/O0–I/O17 Right StatusNo action11Semaphore-freeLeft port writes 0 to semaphore01Left Port has semaphore tokenRight port writes 0 to semaphore01No change. Right side has no write access to semaphore Left port writes 1 to semaphore10Right port obtains semaphore tokenLeft port writes 0 to semaphore10No change. Left port has no write access to semaphore Right port writes 1 to semaphore01Left port obtains semaphore tokenLeft port writes 1 to semaphore11Semaphore-freeRight port writes 0 to semaphore10Right port has semaphore tokenRight port writes 1 to semaphore11Semaphore freeLeft port writes 0 to semaphore01Left port has semaphore tokenLeft port writes 1 to semaphore11Semaphore-freeNotes:9.See Functional Description for specific highest memory locations by device.10.If BUSY R=L, then no change.11.If BUSY L=L, then no change.12.See Functional Description for specific addresses by device.Maximum Ratings [13](Above which the useful life may be impaired. For user guide-lines, not tested.)Storage Temperature .................................–65°C to +150°C Ambient Temperature withPower Applied.............................................–55°C to +125°C Supply Voltage to Ground Potential...............–0.5V to +4.6V DC Voltage Applied toOutputs in High-Z State..........................–0.5V to V CC + 0.5V DC Input Voltage[14]...............................–0.5V to V CC + 0.5V Output Current into Outputs (LOW).............................20 mA Static Discharge Voltage.......................................... > 2001V Latch-up Current.................................................... > 200 mA Operating RangeRange Ambient Temperature V CC Commercial0°C to +70°C 3.3V ± 300 mV Industrial[15]–40°C to +85°C 3.3V ± 300 mVElectrical Characteristics Over the Operating RangeParameter DescriptionCY7C024AV/025AV/026AVCY7C0241AV/0251AV/036AVUnit -20-25Min.Typ.Max.Min.Typ.Max.V OH Output HIGH Voltage (V CC=3.3V) 2.4 2.4V V OL Output LOW Voltage0.40.4V V IH Input HIGH Voltage 2.0 2.0V V IL Input LOW Voltage0.80.8V I OZ Output Leakage Current–1010–1010µA I IX Input Leakage Current–1010–1010µAI CC Operating Current (V CC = Max., I OUT=0mA) Outputs Disabled Com’l.120175115165mA Ind.[15]135185mAI SB1Standby Current (Both Ports TTL Level)CE L & CE R≥ V IH, f = f MAX Com’l.35453040mA Ind.[15]4050mAI SB2Standby Current (One Port TTL Level) CE L| CE R≥ V IH, f = f MAX Com’l.751106595mA Ind.[15]75105mAI SB3Standby Current (Both Ports CMOS Level)CE L & CE R≥ V CC−0.2V, f = 0Com’l.1050010500µA Ind.[15]10500µAI SB4Standby Current (One Port CMOS Level)CE L | CE R≥ V IH, f = f MAX[16]Com’l.70956080mA Ind.[15]7090mACapacitance[17]Parameter Description Test Conditions Max.UnitC IN Input Capacitance T A = 25°C, f = 1 MHz,V CC = 3.3V 10pFC OUT Output Capacitance10pF Notes:13.The Voltage on any input or I/O pin can not exceed the power pin during power-up.14.Pulse width < 20 ns.15.Industrial parts are available in CY7C026AV and CY7C036AV only.16.f MAX = 1/t RC = All inputs cycling at f = 1/t RC (except output enable). f = 0 means no address or control lines change. This applies only to inputs at CMOS level standby I SB3.17.Tested initially and after any design or process changes that may affect these parameters.AC Test Loads and Waveforms3.0V GND90%90%10%3ns3ns10%ALL INPUT PULSES(a)Normal Load (Load 1)R1=590Ω3.3VOUTPUT R2=435ΩC =30pFV TH =1.4VOUTPUTC =30pF(b)Thévenin Equivalent (Load 1)(c)Three-State Delay (Load 2)R1=590ΩR2=435Ω3.3VOUTPUTC =5pFR TH =250Ω≤≤including scope and jig)(Used for t LZ , t HZ , t HZWE , and t LZWE Switching Characteristics Over the Operating Range [18]Parameter DescriptionCY7C024AV/025AV/026AV CY7C0241AV/0251AV/036AV Unit-20-25Min.Max.Min.Max.Read Cycle t RC Read Cycle Time 2025ns t AA Address to Data Valid2025ns t OHA Output Hold From Address Change 33ns t ACE [19]CE LOW to Data Valid 2025ns t DOEOE LOW to Data Valid 1213ns t LZOE [20, 21, 22]OE Low to Low Z 33ns t HZOE [20, 21, 22]OE HIGH to High Z 1215ns t LZCE [20, 21, 22]CE LOW to Low Z 33ns t HZCE [20, 21, 22]CE HIGH to High Z 1215ns t PU [22]CE LOW to Power-Up 0ns t PD [22]CE HIGH to Power-Down 2025ns t ABE [19]Byte Enable Access Time2025nsWrite Cycle t WC Write Cycle Time 2025ns t SCE [19]CE LOW to Write End 1520ns t AW Address Valid to Write End 1520ns t HA Address Hold From Write End 00ns t SA [19]Address Set-up to Write Start 00ns t PWE Write Pulse Width 1520ns t SDData Set-up to Write End1515nsNotes:18.Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specifiedI OI /I OH and 30-pF load capacitance.19.SCE time.20.At any given temperature and voltage condition for any given device, t HZCE is less than t LZCE and t HZOE is less than t LZOE .21.Test conditions used are Load 3.22.This parameter is guaranteed but not tested. For information on port-to-port delay through RAM cells from writing port to reading port, refer to Read Timingwith Busy waveform.Data Retention ModeThe CY7C024AV/025AV/ 026AV and CY7C0241AV/ 0251AV/036AV are designed with battery backup in mind. Data retention voltage and supply current are guaranteed over temperature. The following rules ensure data retention:1.Chip Enable (CE) must be held HIGH during data retention, within V CC to V CC – 0.2V.2.CE must be kept between V CC – 0.2V and 70% of V CC during the power-up and power-down transitions.3.The RAM can begin operation >t RC after V CC reaches the minimum operating voltage (3.0V).Notes:23.For information on port-to-port delay through RAM cells from writing port to reading port, refer to Read Timing with Busy waveform.24.Test conditions used are Load 2.25.t BDD is a calculated parameter and is the greater of t WDD –t PWE (actual) or t DDD –t SD (actual).26.CE = V CC , V in = GND to V CC , T A = 25°C. This parameter is guaranteed but not tested.t HDData Hold From Write Endns t HZWE [21, 22]R/W LOW to High Z 1215ns t LZWE [21, 22]R/W HIGH to Low Z3ns t WDD [23]Write Pulse to Data Delay4550ns t DDD [23]Write Data Valid to Read Data Valid 3035ns Busy Timing [24]t BLA BUSY LOW from Address Match 2020ns t BHA BUSY HIGH from Address Mismatch 2020ns t BLC BUSY LOW from CE LOW 2020ns t BHC BUSY HIGH from CE HIGH 1717ns t PS Port Set-up for Priority 55ns t WB R/W HIGH after BUSY (Slave)00ns t WH R/W HIGH after BUSY HIGH (Slave)1517ns t BDD [25]BUSY HIGH to Data Valid 2025ns Interrupt Timing [24]t INS INT Set Time 2020ns t INR INT Reset Time2020ns Semaphore Timingt SOP SEM Flag Update Pulse (OE or SEM)1012ns t SWRD SEM Flag Write to Read Time 55ns t SPS SEM Flag Contention Window 55ns t SAASEM Address Access Time2025nsSwitching Characteristics Over the Operating Range (continued)[18]Parameter DescriptionCY7C024AV/025AV/026AV CY7C0241AV/0251AV/036AV Unit -20-25Min.Max.Min.Max.TimingParameter Test Conditions [26]Max.Unit ICC DR1@ VCC DR = 2V50µAData Retention Mode3.0V3.0VV CC > 2.0VV CC to V CC –0.2VV CCCEt RCV IHSwitching WaveformsNotes:27.R/W is HIGH for read cycles.28.Device is continuously selected CE = V IL and UB or LB = V IL . This waveform cannot be used for semaphore reads.29.OE = V IL .30.Address valid prior to or coincident with CE transition LOW.31.To access RAM, CE = V IL , UB or LB = V IL , SEM = V IH . T o access semaphore, CE = V IH , SEM = V IL .t RCt AAt OHADATA VALIDPREVIOUS DATA VALIDDATA OUTADDRESSt OHARead Cycle No.1 (Either Port Address Access)[27, 28, 29]t ACEt LZOEt DOEt HZOEt HZCEDATA VALIDt LZCEt PUt PDI SBI CCDATA OUTOECE and LB or UBCURRENTRead Cycle No.2 (Either Port CE/OE Access)[27, 30, 31]UB or LBDATA OUTt RCADDRESSt AAt OHACEt LZCEt ABEt HZCEt HZCEt ACE t LZCERead Cycle No. 3 (Either Port)[27, 29, 30, 31]Notes:32.R/W must be HIGH during all address transitions.33. A write occurs during the overlap (t SCE or t PWE ) of a LOW CE or SEM and a LOW UB or LB.34.t HA is measured from the earlier of CE or R/W or (SEM or R/W) going HIGH at the end of write cycle.35.If OE is LOW during a R/W controlled write cycle, the write pulse width must be the larger of t PWE or (t HZWE + t SD ) to allow the I/O drivers to turn off and data to be placed onthe bus for the required t SD . If OE is HIGH during an R/W controlled write cycle, this requirement does not apply and the write pulse can be as short as the specified t PWE .36.To access RAM, CE = V IL , SEM = V IH .37.To access upper byte, CE = V IL , UB = V IL , SEM = V IH .T o access lower byte, CE = V IL , LB = V IL , SEM = V IH .38.Transition is measured ±500 mV from steady state with a 5-pF load (including scope and jig). This parameter is sampled and not 100% tested.39.During this period, the I/O pins are in the output state, and input signals must not be applied.40.If the CE or SEM LOW transition occurs simultaneously with or after the R/W LOW transition, the outputs remain in the high-impedance state.Switching Waveforms (continued)t AWt WCt PWE t HDt SDt HACER/WOEDATAOUTDATA INADDRESSt HZOE t SAt HZWE t LZWEWrite Cycle No.1: R/W Controlled Timing [32, 33, 34, 35][38][38][35][36, 37]NOTE 39NOTE 39t AWt WCt SCE t HDt SDt HACER/WDATA INADDRESSt SAWrite Cycle No. 2: CE Controlled Timing [32, 33, 34, 40][36, 37]Notes:41.CE = HIGH for the duration of the above timing (both write and read cycle).42.I/O 0R = I/O 0L = LOW (request semaphore); CE R = CE L = HIGH.43.Semaphores are reset (available to both ports) at cycle start.44.If t SPS is violated, the semaphore will definitely be obtained by one side or the other, but which side will get the semaphore is unpredictable.Switching Waveforms (continued)t SOPt SAAVALID ADRESS VALID ADRESSt HD DATA IN VALID DATA OUT VALIDt OHAt AWt HAt ACEt SOPt SCEt SDt SAt PWEt SWRDt DOEWRITE CYCLEREAD CYCLEOER/WI/O 0SEMA 0–A 2Semaphore Read After Write Timing, Either Side [41]MATCHt SPSA 0L –A 2LMATCHR/W L SEM LA 0R –A 2RR/W R SEM RTiming Diagram of Semaphore Contention [42, 43, 44]。
AVS12中文资料
Repetitive peak off-state voltage (2)
RMS on-state current (360° conduction angle)
Non repetitive surge peak on-state current ( Tj initial = 25°C )
TC = 70°C
tion and high security triggering of the triac. When connected to VSS, the mode input activates an additional option. If the main power drops from 220V to 110V, the triac control remains locked to the 220V mode and avoids any high voltage spike when the voltage comes back to 220V. When connected to VDD, the mode input desactivates this option. • The TRIAC is specially designed for this application. An optimization between sensitivity and dynamic parameters of the triac gate highly reduces the losses of supply resistor and allows excellent immunity against disturbances.
TRIAC
s HIGH EFFICIENCY AND SAFETY SWITCHING s UNINSULATED PACKAGE : AVS12CB s VDRM = ± 600V s IT(RMS): 12A
Milestone AV Technologies 产品说明书
Milestone AV Technologies6436 City West ParkwayEden Prairie, MN 55344 USACustomer ServiceAmericas:800-359-5520•651-484-7988•**************Europe,MiddleEast,andAfrica:+31(0)495580852•************************** Asia Pacific:8675589969226•**********************©2012 Milestone AV Technologies, a Duchossois Group Company.IMPORTANT SAFETY INSTRUCTIONS – SAVE THESE INSTRUCTIONS – PLEASE READ ENTIRE MANUAL PRIOR TO USESpecifi cationsÙW e ight ca p acity-DO NOT EXCEED : 22.6 kg (50 lb) includ es TV and any acc ess ori es ÙTilt: ±12°CAUTION: Avoid p ot e ntial pe r s onal injuri es and p ro pe rty damag e !ÙDo not u se thi s p roduct for any p ur p o se not e x p licitly spe cifi e d by manufactur e r . ÙTh e wall mu s t b e ca p abl e of s u pp orting fi v e tim es th e w e ight of th e monitor and mount combin e d . ÙThi s p roduct i s d es ign e d for u se in wood fram e wall s only!ÙIf you do not und e r s tand th ese in s truction s , or hav e doubt s about th e s af e ty of th e in s tallation, a sse mbly or u se of thi s p roduct, contact Cu s tom e r S e rvic e or call a qualifi e d contractor .ÙManufactur e r i s not r esp on s ibl e for damag e or injury cau se d by incorr e ct a sse mbly or u se.3mmWARNING: This productcontains small items that could be a choking hazard if swallowed. B e for e s tarting a sse mbly, v e rify all p art s ar e includ e d and undamag e d . If any p art s ar e mi ss ing or damag e d, do not r e turn th e damag e d it e m to your d e al e r; contact Cu s tom e r S e rvic e. N e v e r u se damag e d p art s !NOTE: M4, M6, or M8 d es crib es th e diam e t e r, mm d es crib es th e l e ngth of s cr e w s that ar e lab e l e d M# X ##mm . Not all hardwar e includ e d will b e u se d .[01] x 1[02] x 1[03] x 2[05] x 4[06] x 4[07] x 4[08] x 4[09] x 4[10] x 4[11] x 4[12] x 4[13] x 4[14] x 4[15] x 4[17] x 4[16] x 8M4M6/M8M4M6/M8M8 x 16mm M8 x 35mmM6 x 12mm M6 x 20mm M6 x 35mmM4 x 12mm M4 x 30mmSupplied Parts and HardwareIn s tall brack e t e xt e n s ion s[03] ONLY if your TV ha s a 200 x 200 mm (79⁄10 x 79⁄10 in.) hol e p att e rn.M4/M6/M8En s ur e th e brack e t i s l e v e l on th e back of th e TV .NOTE: If th e hol e p att e rn on your TV i s 75mm x 75mm th e wa s h e r s [16, 17] will not b e u se d .If you r e quir e additional sp ac e for cabl es , r e c esses , or p rotru s ion s , choo se confi guration B .[01]Your TV ty pe will h e l p you d e t e rmin e which hardwar e confi guration to u se.A. In s tallation o p tion without sp ac e r s (TV s with fl at back s )B. In s tallation o p tion u s ing sp ac e r s (TV s with irr e gularback s )Hand thr e ad s cr e w s into th e thr e ad e d in se rt s on th e back of your TV to d e t e rmin e th e corr e ct s cr e w diam e t e r (M4, M6, or M8).CAUTION: Avoid p ot e ntial pe r s onal injuri es and p ro pe rty damag e ! V e rify that th e r e ar e ad e quat e thr e ad s to se cur e th e brack e t s to th e monitor . If you e ncount e r r es i s tanc e , s to p imm e diat e ly and contact cu s tom e r se rvic e. U se th e s hort es t s cr e w and sp ac e r combination to accommodat e your n ee d s. U s ing hardwar e that i s too long may damag e your TV .B1-1 Select the hardware diameter and length1 Select TV Hardware and Mount TV BracketEn s ur e th e brack e t i s l e v e l on th e back of th e TV. Standard confi guration s ar e s hown.NOTE: If th e hol e p att e rn on your TV i s75mm x 75mm th e wa s h e r s[16,17] will not b e u se d.For spe cial a pp lication s, or if you ar e unc e rtain about your hardwar e se l e ction, contact Cu s tom e r S e rvic e.L e v e l th e wall p lat e [02] and mark th e hol e location s.CAUTION: Avoid p ot e ntial injuri es or p ro pe rty damag e !Im p ro pe r u se could r e duc e th e holding p ow e r of th e lag bolt . To avoidp ot e ntial injuri es or p ro pe rty damag eÙDO NOT ov e r-tight e n th e lag bolt s [04].ÙTight e n th e lag bolt s [04] only until th e y ar e p ull e d firmly again s t th e wall p lat e [02].V e rify th e c e nt e r of th e s tud u s ing an awl, a thin nail, or an e dg e to e dg e s tud fi nd e r . CAUTION: Avoid p ot e ntial pe r s onal injuri es and p ro pe rtydamag e !ÙAny mat e rial cov e ring th e wall mu s t not e xc ee d 16 mm (5/8 in .). ÙMinimum wood s tud s iz e : common 51 x 102 mm (2 x 4 in .)(nominal 38 x 89 mm (1½ x 3½ in .)).CAUTION: Avoid p ot e ntial injuri es or p ro pe rty damag e ! Pilothol es MUST b e drill e d to a d ep th of 63½ mm (2½ in .), u s ing a 3 mm (1⁄8 in .) diam e t e r drill bit .[02][01]A34.92 mm(13⁄8 in.)[01][02]BS e cur e th e TV to th e wall p lat e u s ing th e locking tab (T). NOTE: If you n ee d to r e mov e th e TV from th e wall p lat e, un se cur e th e locking tab (T).5 Adjust Up / Down Tilt TensionLoo se n th e tilt t e n s ion nut to adju s t th e tilt of your TV. Tight e nth e tilt t e n s ion nut wh e n your TV i s se t to th e d es ir e d tilt.Mil es ton e AV T e chnologi es and it s affi liat e d cor p oration s and s ub s idiari es (coll e ctiv e ly, “Mil es ton e”), int e nd to mak e thi s manual accurat e and com p l e t e. How e v e r, Mil es ton e mak es no claim that th e information contain e d h e r e in cov e r s all d e tail s, condition s, or variation s. Nor do es it p rovid e for e v e ry p o ss ibl e conting e ncy in conn e ction with th e in s tallation or u se of thi s p roduct. Th e information contain e d in thi s docum e nt i s s ubj e ct to chang e without notic e or obligation of any kind. Mil es ton e mak es no r ep r ese ntation of warranty, e x p r esse d or im p li e d, r e garding th e information contain e d h e r e in. Mil es ton e a ss um es no r esp on s ibility for accuracy, com p l e t e n ess or s uffi ci e ncy of th e information contain e d in thi s docum e nt.。
ANALOG DEVICES SSM2017 数据手册
aSelf-Contained Audio PreamplifierSSM2017One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.Tel: 617/329-4700World Wide Web Site: Fax: 617/326-8703© Analog Devices, Inc., 1997FUNCTIONAL BLOCK DIAGRAMPIN CONNECTIONS Epoxy Mini-DIP (P Suffix)REFERENCE+IN V–V+OUTRG 2RG 16-Pin Wide Body SOL (S Suffix)NC NC –IN +IN V–V+OUTREFERENCE NC NC NCNC RG 1RG 2NC NCNC = NO CONNECTFEATURESExcellent Noise Performance: 950 pV/√Hz or 1.5 dB Noise FigureUltralow THD: < 0.01% @ G = 100 Over the Full Audio BandWide Bandwidth: 1 MHz @ G = 100High Slew Rate: 17 V/s typ Unity Gain StableTrue Differential Inputs Subaudio 1/f Noise Corner8-Pin Mini-DIP with Only One External Component Required Very Low CostExtended Temperature Range: –40؇C to +85؇C APPLICATIONSAudio Mix ConsolesIntercom/Paging Systems Two-Way Radio SonarDigital Audio SystemsREV.CInformation furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.GENERAL DESCRIPTIONThe SSM2017 is a latest generation audio preamplifier, combin-ing SSM preamplifier design expertise with advanced process-ing. The result is excellent audio performance from a self-contained 8-pin mini-DIP device, requiring only one external gain set resistor or potentiometer. The SSM2017 is further en-hanced by its unity gain stability.Key specifications include ultralow noise (1.5 dB noise figure)and THD (<0.01% at G = 100), complemented by wide band-width and high slew rate.Applications for this low cost device include microphone pream-plifiers and bus summing amplifiers in professional and con-sumer audio equipment, sonar, and other applications requiring a low noise instrumentation amplifier with high gain capability.查询SSM2017供应商SSM2017–SPECIFICATIONS(V S = ؎15 V and –40؇C ≤ T A≤ +85؇C, unless otherwise noted. Typical speci-fications apply at T A = +25؇C.)Parameter Symbol Conditions Min Typ Max Units DISTORTION PERFORMANCE T A = +25°CV O = 7 V rmsR L = 5 kΩTotal Harmonic Distortion Plus Noise THD+N G = 1000, f = 1 kHz0.012%G = 100, f = 1 kHz0.005%G = 10, f = 1 kHz0.004%G = 1, f = 1 kHz0.008% NOISE PERFORMANCEInput Referred Voltage Noise Density e n f = 1 kHz, G = 10000.95nV/√Hzf = 1 kHz; G = 100 1.95nV/√Hzf = 1 kHz; G = 1011.83nV/√Hzf = 1 kHz; G = 1107.14nV/√HzInput Current Noise Density i n f = 1 kHz, G = 10002pA/√Hz DYNAMIC RESPONSESlew Rate SR G = 101017V/µsR L = 4.7 kΩC L = 50 pFT A = +25°CSmall Signal Bandwidth BW–3 dB G = 1000200kHzG = 1001000kHzG = 102000kHzG = 14000kHz INPUTInput Offset Voltage V IOS0.1 1.2mV Input Bias Current I B V CM = 0 V625µA Input Offset Current Ios V CM = 0 V±0.002±2.5µA Common-Mode Rejection CMR V CM = ±8 VG = 100080112dBG = 1006092dBG = 104074dBG = 1, T A = +25°C2654dBG = 1, T A = – 40°C to +85°C2054dBPower Supply Rejection PSR V S = ±6 V to ±18 VG = 100080124dBG = 10060118dBG = 1040101dBG = 12682dBInput Voltage Range IVR±8V Input Resistance R IN Differential, G = 10001MΩG = 130MΩCommon Mode, G = 1000 5.3MΩG = 17.1MΩOUTPUTOutput Voltage Swing V O R L = 2 kΩ; T A = +25°C±11.0±12.3V Output Offset Voltage V OOS–40500mV Minimum Resistive Load Drive T A = +25°C2kΩT A = –40°C to +85°C 4.7kΩMaximum Capacitive Load Drive50pF Short Circuit Current Limit I SC Output-to-Ground Short±50mA Output Short Circuit Duration10sec GAINGain AccuracyR G =10 kΩT A = +25°CG – 1R G = 10 Ω, G = 10000.251dBR G = 101 Ω, G = 1000.201dBR G = 1.1 kΩ, G = 100.201dBR G = ؕ, G = 10.050.5dB Maximum Gain G70dB REFERENCE INPUTInput Resistance10kΩVoltage Range±8V Gain to Output1V/V POWER SUPPLYSupply Voltage Range V S±6±22V Supply Current I SY V CM = 0 V, R L = ؕ±10.6±14.0mA Specifications subject to change without notice.REV. C–2–SSM2017–3–REV. CCAUTIONESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily accumulate on the human body and test equipment and can discharge without detection.Although the SSM2017 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.Typical Performance CharacteristicsFigure 1. Typical THD+Noise* at G = 1, 10, 100, 1000;V O = 7 V rms, V S = ±15 V, R L = 5 k Ω; T A = +25°C*80 kHz low-pass filter used for Figures 1-2.ABSOLUTE MAXIMUM RATINGS Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±22 V Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . Supply Voltage Output Short Circuit Duration . . . . . . . . . . . . . . . . . . . 10 sec Storage Temperature Range (P, Z Packages) –65°C to +150°C Junction Temperature (T J ) . . . . . . . . . . . . . –65°C to +150°C Lead Temperature Range (Soldering, 60 sec) . . . . . . . . 300°C Operating Temperature Range . . . . . . . . . . . . –40°C to +85°C Thermal Resistance*8-Pin Hermetic DIP (Z):θJA = 134; θJC = 12 . . . . . . °C/W 8-Pin Plastic DIP (P):θJA = 96; θJC = 37 . . . . . . . . . . °C/W 16-Pin SOIC (S):θJA = 92; θJC= 27 . . . . . . . . . . . . . °C/W*θJA is specified for worst case mounting conditions, i.e., θJA is specified for device in socket for cerdip and plastic DIP; θJA is specified for device soldered to printed circuit board for SOL package.ORDERING GUIDETemperature Package Package ModelRange*Description Option SSM2017P –40°C to +85°C 8-Pin Plastic DIP N-8SSM2017S–40°C to +85°C 16-Lead SOL R-16SSM2017S-REEL–40°C to +85°C16-Lead SOLR-16*XIND = –40°C to +85°C.Figure 2. Typical THD+ Noise * at G = 2, 10, 100, 1000;V O = 10 V rms, V S = ±18 V, R L = 5 k Ω; T A = +25°CSSM2017–4–REV. CFigure 3.Voltage Noise Density vs.Frequency Figure 6. Maximum Output Swingvs. FrequencyFigure 9. Output Voltage Range vs.Supply VoltageFigure 4.RTI Voltage Noise Densityvs. GainFigure 7. Maximum Output Voltagevs. Load ResistanceFigure 10. CMRR vs. FrequencyFigure 5. Output Impedance vs.FrequencyFigure 8. Input Voltage Range vs.Supply VoltageFigure 11. +PSRR vs. FrequencySSM2017–5–REV. CFigure 12. –PSRR vs. FrequencyFigure 15. V OOSvs. Temperature Figure 18. I Bvs. Supply Voltage Figure 13. V IOSvs. Temperature Figure 16. V OOSvs. Supply Voltage Figure 19. I SYvs. Temperature Figure 14. V IOSvs. Supply VoltageFigure 17. I Bvs. TemperatureFigure 20. I SY vs. Supply VoltageSSM2017–6–REV. CFigure 21. Bandwidth of the SSM2017 for Various Valuesof GainNOISE PERFORMANCEThe SSM2017 is a very low noise audio preamplifier exhibiting a typical voltage noise density of only 1 nV/√Hz at 1 kHz. The exceptionally low noise characteristics of the SSM2017 are in part achieved by operating the input transistors at high collector currents since the voltage noise is inversely proportional to the square root of the collector current. Current noise, however, is directly proportional to the square root of the collector current.As a result, the outstanding voltage noise performance of the SSM2017 is obtained at the expense of current noise perfor-mance. At low preamplifier gains, the effect of the SSM2017’s voltage and current noise is insignificant.The total noise of an audio preamplifier channel can be calcu-late by:E n =e n 2+(i n R S )2+e t 2where:E n = total input referred noise e n = amplifier voltage noise i n = amplifier current noise R S = source resistancee t = source resistance thermal noise.For a microphone preamplifier, using a typical microphone im-pedance of 150 Ω the total input referred noise is:e n = 1 nV/√Hz @ 1 kHz, SSM2017 e n i n = 2 pA/√Hz @ 1 kHz, SSM2017 i nR S = 150 Ω, microphone source impedance e t = 1.6 nV /√Hz @ 1 kHz, microphone thermal noise E n =√(1 nV √Hz )2 + 2 (pA /√Hz × 150 Ω)2 + (1.6 nV /√Hz )2= 1.93 nV /√Hz @ 1 kHz.This total noise is extremely low and makes the SSM2017virtually transparent to the user.A V dB R G 10NC 3.210 4.7k 1020 1.1k 31.33033010040100314503210006010G =V OUT (+In) – (In) =10k ⍀R G+1Basic Circuit ConnectionsGAINThe SSM2017 only requires a single external resistor to set the voltage gain. The voltage gain, G , is:G =10k ΩR G+1andR G =10k ΩG –1For convenience, Table I lists various values of R G for common gain levels.Table I. Values of R G for Various Gain LevelsThe voltage gain can range from 1 to 3500. A gain set resistor is not required for unity gain applications. Metal-film or wire-wound resistors are recommended for best results.The total gain accuracy of the SSM2017 is determined by the tolerance of the external gain set resistor, R G , combined with the gain equation accuracy of the SSM2017. Total gain drift com-bines the mismatch of the external gain set resistor drift with that of the internal resistors (20 ppm/°C typ).Bandwidth of the SSM2017 is relatively independent of gain as shown in Figure 21. For a voltage gain of 1000, the SSM2017has a small-signal bandwidth of 200 kHz. At unity gain, the bandwidth of the SSM2017 exceeds 4 MHz.SSM2017–7–REV. CFigure 23.SSM2017 in Phantom Powered Microphone CircuitINPUTSThe SSM2017 has protection diodes across the base emitter junctions of the input transistors. These prevent accidental ava-lanche breakdown, which could seriously degrade noise perfor-mance. Additional clamp diodes are also provided to prevent theinputs from being forced too far beyond the supplies.a.Single Endedb.Pseudo Differentialc.True DifferentialFigure 22.Three Ways of Interfacing Transducers for High Noise ImmunityAlthough the SSM2017’s inputs are fully floating, care must be exercised to ensure that both inputs have a dc bias connection capable of maintaining them within the input common-mode range. The usual method of achieving this is to ground one side of the transducer as in Figure 22a, but an alternative way is to float the transducer and use two resistors to set the bias point as in Figure 22b. The value of these resistors can be up to 10 k Ω,but they should be kept as small as possible to limit common-mode pickup. Noise contribution by resistors themselves is neg-ligible since it is attenuated by the transducer’s impedance. Bal-anced transducers give the best noise immunity and interface directly as in Figure 22c.REFERENCE TERMINALThe output signal is specified with respect to the reference ter-minal, which is normally connected to analog ground. The ref-erence may also be used for offset correction or level shifting. A reference source resistance will reduce the common-mode rejec-tion by the ratio of 5 k Ω/R REF . If the reference source resis-tance is 1 Ω, then the CMR will be reduced to 74 dB (5 k Ω/1 Ω= 74 dB).COMMON-MODE REJECTIONIdeally, a microphone preamplifier responds only to the differ-ence between the two input signals and rejects common-mode voltages and noise. In practice, there is a small change in output voltage when both inputs experience the same common-mode voltage change; the ratio of these voltages is called the common-mode gain. Common-mode rejection (CMR) is the logarithm of the ratio of differential-mode gain to common-mode gain,expressed in dB.PHANTOM POWERINGA typical phantom microphone powering circuit is shown in Figure 23. Z 1 through Z 4 provide transient overvoltage protec-tion for the SSM2017 whenever microphones are plugged in or unplugged.SSM2017–8–REV. CC 1534–24–4/91P R I N T E D I N U .S .A .BUS SUMMING AMPLIFIERIn addition to is use as a microphone preamplifier, the SSM2017can be used as a very low noise summing amplifier. Such a cir-cuit is particularly useful when many medium impedance out-puts are summed together to produce a high effective noise gain.The principle of the summing amplifier is to ground the SSM2017inputs. Under these conditions, Pins 1 and 8 are ac virtual grounds sitting about 0.55 V below ground.To remove the 0.55 V offset, the circuit of Figure 24 is recommended.A 2 forms a “servo” amplifier feeding the SSM2017’s inputs.This places Pins l and 8 at a true dc virtual ground. R4 in con-junction with C2 remove the voltage noise of A 2, and in fact just about any operational amplifier will work well here since it is re-moved from the signal path. If the dc offset at Pins l and 8 is not too critical, then the servo loop can be replaced by the diode bi-asing scheme of Figure 24. If ac coupling is used throughout,then Pins 2 and 3 may be directly grounded.Figure 24. Bus Summing AmplifierOUTLINE DIMENSIONSDimensions shown in inches and (mm).8-Pin Plastic DIP (P) Package8-Pin Hermetic DIP (Z) Package16-Pin SOIC (S) Package。