Overview Tech OBIEE
博视
博视博视：用科技尽览天地博视，英文名为Lecture, 是一个全球领先的科技公司，致力于为人们带来视听的乐趣和新的启发。
自成立以来，博视一直坚持技术创新和产品品质的追求，为用户提供了丰富多样的产品和服务。
本文将从公司背景、产品特色和市场影响等多个方面对博视进行详细介绍。
一、公司背景博视成立于2000年，创始人是一群热爱科技的年轻人。
他们深信科技的力量可以改变人们的生活，并为此毅然决然地投身于科技领域。
经过多年的努力和发展，博视已经成为全球最大的视听技术公司之一。
公司总部位于美国硅谷，拥有数百名顶级科学家和工程师，致力于开发最前沿的技术和产品。
二、产品特色1. 科技先锋：作为一家科技公司，博视始终将技术创新放在首位。
公司拥有深厚的研发实力和雄厚的资金支持，不断推出颠覆性的技术和产品。
例如，最新发布的博视HoloLens，便是一款将增强现实技术与头戴显示器相结合的产品，让用户可以在现实世界中获得虚拟的视觉体验。
这不仅为用户带来了无限的乐趣，还在医疗、教育等领域发挥了重要作用。
2. 产品多样化：博视不仅在视听技术领域有着卓越的表现，还涉足了消费电子、通信设备、智能家居等多个领域。
公司旗下的产品线十分丰富，涵盖了电视、音响、手机、电脑等多个终端设备。
而这些产品不仅在功能上满足了用户的需求，同时也注重用户体验，致力于为用户带来更加便捷、智能的生活体验。
3. 环保节能：博视一直致力于研发更加环保、节能的产品。
公司在产品设计中采用了许多节能技术，例如智能节能模式、低功耗处理器等。
同时，博视还推行了回收计划，鼓励用户对旧设备进行回收和再利用，减少电子垃圾的产生。
这一系列环保措施不仅为用户节约了能源和费用，也对环境保护做出了积极的贡献。
三、市场影响博视作为全球最大的视听技术公司之一，其产品在市场上具有很高的知名度和竞争力。
博视的产品远销全球，成千上万的用户通过博视的产品享受到了高品质的视听体验。
同时，博视在各个领域也取得了重要的成果，其技术在医疗、娱乐、教育等行业得到了广泛应用。
外企急聘：Siebel Tech,Function,EAI,Testing,Consultant,Analytice,PM
★★外企急聘：Siebel Tech, Function, Siebel EAI, Siebel testing★沪/京/杭全球化项目机会：“Siebel ” 上海、杭州、北京、、大连、海外急聘！！！职位需求：testing、technical、ProjectManager、Consultant 、Analytics、EAI项目情况：全球化项目，来自美国、英国、澳大利亚等。
Siebel ConsultantKey Responsibilities1. Strong Sales or Marketing experience2. Strong CRM/ERP related knowledge and experience, consulting across a wide range of Siebelmodules and Products in different industry3. Strong design capabilityKey Requirements1. 3-7 years of Siebel implementation or rollout experiences2. At least 5-7 years successful consultant experience3. Senior consulting role, responsible for implementing Siebel product based project4. Strong understanding of business process5. Ability to design & optimize business process for client6. Ability to present and demonstrate business solutions at the executive level7. Understanding the principles of the software development lifecycle8. Ability to do requirements gathering, gap analysis, functional or technical design9. Excellent communication, presentation and negotiation skills10. Ability to product training to key user group11. Familiar with Siebel application configuration, Business Services12. Familiar with data migration Integration, EIM, EAI, ADM13. Siebel certified BA consultant is preferred14. Bachelor Degree in Computer Science or Engineering related and above; MBA preferable15. Good English proficiency (written and spoken)16. Fast learning capability17. Positive attitude; good team player; able to work under pressure; and willing to travelSiebel TechnicalKey Responsibilities1. Individual will be responsible for assigned projects development in Siebel application configuration, testing and documentation2. Able to possess development experience in object orientedKey Requirements1. At least >3 years Siebel experience2. Ability to work independently on programming/developing projects as well as work in a team environment3. Good experience on Siebel Tools, Siebel eScript or Siebel VB, Business Services4. Good knowledge on Siebel software development life cycle.5. Participate in requirements gathering, gap analysis, functional design6. Ability to do technical design7. Strong object oriented programming knowledge, Java, J2EE, Java script preferred8. Familiar with Siebel application automation, Workflow, Assignment Manager9. Familiar with Siebel EIM, data mapping design, data manipulation10. Familiar with RDBMS SQL, Stored Procedure, Triggers, Views in Oracle or MS SQL server11. Siebel Certified consultant is preferred or finish Siebel Core consultant course12. Bachelor’s degree in Computer Science or Engineering related13. Good English proficiency (written and spoken)14. Fast learning capability15. Positive attitude; good team player; able to work under pressure; and willing to travelSiebel AnalyticsKey Responsibilities1. Strong knowledge and experience on Siebel Analytics based BI system implementation2. Ability to design and developing Siebel Analytics3. Good concepts and experience on Data Warehousing, RDBMS, OLAP, OLTPKey Requirements1. At least >3 years Siebel analytics experience2. Good knowledge of Siebel Analytics, Business Model, Repository, ETL process3. Good experience of ETL tools, Informatica or MS DTS/SSIS4. Good knowledge SQL and Object Oriented programming5. Familiar with reports design and developing6. Familiar with Informatica architecture, transformations7. Familiar with design and developing Informatica workflow8. Siebel certified analytics consultant is preferred or finish the course9. Bachelor’s degree in Computer Science or Engineering related10. Good English proficiency (written and spoken)11. Fast learning capability12. Positive attitude; good team player; able to work under pressure; and willing to travelSiebel EAIKey Responsibilities1. Good knowledge and experience on Siebel EAI2. be familiar with third-party solutionsKey Requirements1. At least 3-5 years Siebel EAI experience2. Senior Siebel EAI Lead or developer, responsible for Siebel System based integration implementation3. Good experience on Siebel enterprise application integration implementation4. Understanding of integration, designing, usage models, exchanging data5. Good knowledge of third party solutions such IBM, TIBCO, WebMethods6. Good experience on EAI Siebel Adapter, UI Data Adapter, Siebel VBC7. Familiar with EAI MQSeries Transport, Java BS, HTTP Transport8. Familiar with Data Mapping9. Familiar with XML integration10. Siebel certified integration champion is preferred or finish related course11. Bachelor’s degree in Computer Science or Engineering related12. Good English proficiency (written and spoken)13. Fast learning capability14. Positive attitude; good team player; able to work under pressure; and willing to travelTest Lead-SiebelOver 6 years work experience1. Strong Communication Skills – Reading / Writing / Listening2. Overall execution responsibility3. Manage offshore team4. Manage communication with onsite team5. Provide functional guidance for “Test Planning” and “Test Execution”6. Test execution7. Issue Resolution8. Act as dedicated (virtual) support for different functional areas9. Strong Siebel KnowledgeTest Analysts-Siebel3 to 5 years1. Strong English Communication Skills – Reading / Writing / Listening2. Analysis of business requirements3. Review of Test Plan & preparation of Test Cases4. Test script execution5. Report test results and defects detected6. Participate in reviews and status meetings7. Strong Siebel KnowledgeTest Engineers-Siebel1 to 3 years1. Strong English Communication Skills – Reading / Writing / Listening2. Test scripts preparation3. Test script execution4. Report test results and defects detected5. Participate in reviews and status meetings6. Strong Siebel Knowledge。
Hexagon Technology Solutions Provider Overview说明书
ASSOCIA TION of MINE SURVEYORSof ZIMBABWEPhumudzo Netshapapame BEng(Mining),ADBPM (UCT)T echnical Sales Specialist CROWN PLAZA MONOMOTAPA HOTEL15, August, 2019Agenda Agenda Itema)Company Overviewb)Life-Of-Mine Survey StrategyCompany OverviewTechnology Solutions Provider•Established leader in information technologies •Solutions drive productivity and quality improvementsGlobal Reach•Broad range of vital industries served•More than 18,000 employees in 50 countries R&D Focused•10-12% of net sales invested in R&D •3,400+ employees in R&D•3,200+ active patentsStrong Financials• 3.3 bn US in sales•23.4% operatingmargin Hexagon at a glanceHexagon businessesGEOSYSTEMSReality-capture solutions used to record distance, monitor movement, guide machines, capture Earth images and create 3D models of landscapes, infrastructure or entire citiesPOSITIONING INTELLIGENCESatellite positioning and correction solutions for land, sea and airAGRICULTURESmart agriculture solutions for automating and improving crop planning and resource utilization for optimum yieldGEOSPATIALGeospatial data management solutions that leverage the power of mapping to enable a holistic understanding of changeMININGIntegrated, digital mine solutions for smarter, safer, more productive minesSAFETY & INFRASTRUCTUREGeospatial-based solutions that streamline operations, accelerate information flows, and optimize resourcesGEOSPATIAL LANDSCAPE Geospatial Enterprise Solutions Industrial Enterprise SolutionsManufacturing solutions that integrate sensing, thinking and acting capabilities – from people to machines – where quality drives productivity Enterprise engineering software solutions that enable smarter design, build and operation of large-scale constructionMANUFACTURING INTELLIGENCE PROCESS, POWER, MARINE MANUFACTURING LANDSCAPE ENGINEERINGLANDSCAPE201519701997200320082010Key CustomersProven and trusted by industry leadersLife-of-Mine Survey StrategyHexagon Mining T echnology SuiteKnowledge ManagementAnalyticsCollaborationIntegrationLife-of-Mine (LOM): Survey IntegrationExploration Modeling Design SchedulingOperationalFleet Management – OP& UGMachine GuidanceHealth & MaintenanceCommunicationsCollision Avoidance Fatigue Monitoring Vehicle InterventionShovel AssistTracking RadarSemi-Autonomous Autonomous Reverse GuidanceAuto-SpotAuto-SteerTotal Stations & LaserScannersAirborne UAV SystemsLong Range RadarScanningPlanningOperations Safety Automation SurveySoftware, HardwareSoftwarePoint-to-Point Integration (API)Enterprise Platform Integration (API)Hexagon Mining Open Pit Survey SolutionProcess and Display Point Cloud DataSENSORSTransformativeTechnology forData Capture,Analysis andDisplaySOFTWARESet flight plan, camera position and dwell timeGenerate data for ortho-photos, 3D models, and point clouds in high density with great accuracySpaced control points increase geo reference accuracy FW-7Process and Display Point Cloud DataCaptured points can be imported into MinePlan 3DData can be transformed for multiple purposes in MP3DProcess and Display Point Cloud DataPoint Cloud Solution: workflow thru MinePlan 3DInstrument(s)•P50•MS60•BLK•Aibot UAVScanRegistration•Cyclone / InfinityPoint CloudAnalysis•“MinePlanReshaper”Mine Planning•MinePlan 3D +Stockpile AnalysisHighwallMonitoring Grade Control Leach PadTailings DamMonitoring RockCharacteristics / Features Tunneling Over/UnderBreakMonitoring andMovementUse Cases ~ TotalMonitoringUAV WorkflowFlightExecutionDataProcessingDataAnalysingActionFlightPlanningDataintegrationHexagonMiningUAVSolutionPoint Cloud Solution: workflow through MinePlan 3DReconciliation: workflow in MinePlan 3D & MinePlan Production InputsEOP Solids Designed Digblock/Cuts planned vs. actual reconciliation ProcessBuild designed solids Clip by EOP solidsReservesExploration Model Grade Control ModelOutputreports and charts Areas of differenceReconciliation: workflow in MinePlan 3D & MinePlan Production▪simple configuration▪modification of inputs▪powerful analysis of variations ▪standardized report formats ▪full integrationLocation ManagementA manageable spatial database thatstores and validates all of anoperations Location position and metadataInventory ManagementGain insights into point in time stocks balances in a number of areas of anoperationReconcile the entire material movement value chain from survey BCM to contained metal recoveryvalues.TargetsCompare multiple schedules against what has actually occurredin the field, from material movement to Availability etc.Activity CostingsGain near real time revenue, cost or profit information within an operation, building costs from the ground upEnterprise ReportingHolistic cross departmental reporting is essential to the understanding the how an organization is performing and enablingpeople to analyze the gapsMANAGEReconciliationHaulage AnalysisAnalyze and turn raw GPS information into meaningful packets of data, TKMPH, compare base haul profiles to what isactually happening in the field•Survey perform pit survey at the bench level •Survey only captures volume of the ore stockpile •The weightometer on crusher is certifiedReconciliation: workflow in HxGN MineEnterprisePlanningProductionMaintenanceHuman ResourcesFinanceSafety Siloed DataBreak down the individual silos in an operation sharing data and information across the business providing greater insights into an operations performanceHolistic ReportsSingle tool for operations to utilise across the organisation. Providing a platform for enterprise toleverage.Blended MetricsUnderstand how different departments affect each other. HR affects Production or Maintenance. Identifytrends across the businessMineEnterprise – A connected systemReconciliation: workflow in HxGN MineEnterpriseHexagon Mining UG Survey Solution•An average of 30% overbreak in UG mining •Delays in mining cycles•Inability to react and reconcileAreas of Opportunity•Automated survey and markups•Overbreak/underbreak profileMOSS: Standardized Blasting Workflow•Automated survey and markups•Overbreak/underbreak profile•Pattern auto generationMOSS: Standardized Blasting Workflow•Automated survey and markups•Overbreak/underbreak profile•Pattern auto generation•Center line, grade and collars in each shot•The Result•Topo survey•Collar markup•Real time updateMOSS: Standardized Blasting Workflow•Integrates with any planning package •Better volume calculations•CMD lidar scansAdditional BenefitsTHANKY UO。
PORTFREEPRODUCTIONPROGRAM
PORTFREEPRODUCTIONPROGRAMIntroductionThe PORTFREEPRODUCTIONPROGRAM is a comprehensive software system designed to streamline and automate the production process for port-free products. This program aims to eliminate the need for ports, such as USB or HDMI ports, in electronic devices by providing alternative methods of data transfer and connectivity. In this document, we will provide a detailed overview of the PORTFREEPRODUCTIONPROGRAM, its features, and the benefits it offers to manufacturers of electronic devices.FeaturesThe PORTFREEPRODUCTIONPROGRAM offers a wide range of features that simplify the production process for port-free products. Some of the key features include:Alternative connectivity methodsThe program provides alternative methods of connectivity, such as wireless connectivity and cloud-based data transfer. This allows electronic devices to communicate and exchange information without the need for physical ports.Streamlined manufacturing processThe PORTFREEPRODUCTIONPROGRAM includes several modules that automate various stages of the manufacturing process. These modules include:•Design module: This module allows manufacturers to design port-free electronic devices using an intuitive and user-friendly interface. Manufacturers can specify thedesired functionality of the device and the program willgenerate the necessary code and configurations.•Testing module: This module automatically tests the performance and functionality of the port-free devices toensure that they meet the required standards. It includes comprehensive testing procedures and generates detailed test reports.•Production module: This module handles the production of the port-free devices, including the assembly of components, quality control, and packaging. It ensures that the devices are manufactured in a timely and efficient manner.Integration with existing systemsThe PORTFREEPRODUCTIONPROGRAM can be seamlessly integrated with existing manufacturing systems, such as enterprise resource planning (ERP) and supply chain management (SCM) systems. This allows manufacturers to leverage their existing infrastructure and processes while benefiting from the additional capabilities offered by the program.Real-time analyticsThe program includes a real-time analytics module that provides manufacturers with valuable insights into the production process. It collects and analyzes data from various stages of the manufacturing process, allowing manufacturers to identify bottlenecks, optimize workflows, and improve overall efficiency and productivity.BenefitsBy implementing the PORTFREEPRODUCTIONPROGRAM, manufacturers can enjoy a wide range of benefits, including: Cost savingsEliminating the need for physical ports in electronic devices can significantly reduce the manufacturing costs. This is because ports can be expensive to produce, assemble, and maintain. By utilizing alternative connectivity methods, manufacturers can save on the costs associated with ports, such as connectors, cables, and related components.Enhanced flexibility and design optionsRemoving ports from electronic devices opens up new possibilities in terms of design and form factor. Manufacturers can create more compact and sleek devices without compromising on functionality. This allows for greater flexibility in product design and differentiation, ultimately resulting in a competitive advantage in the market.Improved user experienceBy providing alternative methods of connectivity, the PORTFREEPRODUCTIONPROGRAM enhances the user experience of electronic devices. Users can enjoy seamless wireless connectivity and transfer data effortlessly. This improves convenience and usability, leading to higher customer satisfaction and loyalty.Future-proofingAs technology continues to evolve, the PORTFREEPRODUCTIONPROGRAM ensures that manufacturers are well-prepared for future advancements. By eliminating reliance on physical ports, manufacturers can adapt to emerging technologies and trends without the need for costly hardware upgrades or modifications.ConclusionThe PORTFREEPRODUCTIONPROGRAM is a powerful software system that revolutionizes the production process for port-free electronic devices. With its range of features and benefits, this program offers manufacturers an efficient and cost-effective solution to produce cutting-edge devices without the need for physical ports. By embracing this program, manufacturers can stay ahead of the competition and meet the ever-increasing demands of the market.。
mechatronics
mechatronicsMechatronics: Bridging the Gap between Mechanical Engineering and ElectronicsIntroductionMechatronics is an interdisciplinary field that combines mechanical engineering, electronics, computer science, and control systems to design and create smart devices. These devices, often found in industrial automation, robotics, and automotive applications, have revolutionized various sectors by enhancing efficiency, precision, and safety. This document provides an overview of mechatronics, its key components, applications, and future prospects.1. Definition and ComponentsMechatronics is a well-balanced integration of mechanical engineering, electronic engineering, computer science, and control engineering. The goal is to design and develop intelligent systems that can both receive and process information, as well as perform physical actions based on thatinformation. Mechatronic systems typically consist of four core components:1.1 Mechanical Components: These include various physical parts such as actuators, sensors, motors, gears, and linkages. Mechanical engineering principles are used to design and optimize these components for specific tasks and environmental conditions.1.2 Electronic Components: Mechatronics heavily relies on electronic components like microcontrollers, sensors, and transducers. These components enable the system to sense, measure, and process data, making informed decisions based on that data.1.3 Computer Science and Software: Mechatronic systems utilize software programs to analyze data, control actuators, and communicate with other devices. Programming languages like C, C++, and PLC ladder logic are commonly used for development.1.4 Control Systems: Control theory plays a crucial role in mechatronics. It involves designing and implementing algorithms and control systems to regulate the behavior andperformance of the mechatronic system. It ensures stability, accuracy, and safety in various applications.2. Applications of Mechatronics2.1 Industrial Automation: Mechatronic systems have transformed industrial processes by increasing efficiency, improving product quality, and reducing human involvement. Industrial robots, assembly lines, and automated guided vehicles are just a few examples of how mechatronics is applied in manufacturing industries.2.2 Robotics: Mechatronics is the backbone of modern robotics. Robots used in healthcare, exploration, home assistance, and even disaster management heavily rely on mechatronic principles. These robots can perform complex tasks with accuracy and precision, enhancing productivity and safety.2.3 Automotive Systems: The automotive industry heavily relies on mechatronics for safety systems, engine control units, and navigation systems. Mechatronic systems enable advanced driver assistance systems (ADAS) like lane-keeping assist, adaptive cruise control, and collision avoidance, improving vehicle safety.2.4 Biomedical Engineering: Mechatronics plays a key role in the design and development of medical devices such as prosthetics, assistive devices, surgical robots, and monitoring systems. These devices enhance patients' quality of life and provide improved medical care.3. Future ProspectsMechatronics is a rapidly growing field with immense potential. The advancements in artificial intelligence, machine learning, and internet of things (IoT) are expected to further revolutionize mechatronic systems. Some potential future prospects include:3.1 Smart Cities: Mechatronics can contribute to the development of smart cities by integrating intelligent systems into urban infrastructure, transportation, and energy management. This can lead to enhanced efficiency, reduced energy consumption, and improved quality of life for residents.3.2 Human-Robot Interaction: As robots become more advanced, mechatronics will play a crucial role in developingintuitive human-robot interaction mechanisms. This includes designing robots that can recognize emotions, understand natural language, and respond accordingly.3.3 Autonomous Systems: Mechatronic systems are the foundation of autonomous vehicles and drones. The future prospects include developing fully autonomous transportation systems that can navigate, interact, and make decisions without human intervention.ConclusionMechatronics brings together mechanical engineering, electronics, computer science, and control systems to create intelligent and efficient systems. Its widespread applications in industrial automation, robotics, automotive systems, and biomedical engineering have had a significant impact on different sectors. The future prospects of mechatronics are promising, with the potential to revolutionize various industries and contribute to the development of smart cities and advanced human-robot interaction mechanisms.。
欧博特纽维尔 IP7000系列产品数据手册说明书
From Product Management Telephone NurembergST-VS ST-VS/MKP1 +49 911 93456 0 12-Jan-2015 Release LetterProduct: DIVAR IP 7000 FamilyVersion: Maintenance Release DOM image v1.0.5This letter contains latest information about the above mentioned Bosch DIVAR IP 7000 Family.1. GeneralDIVAR IP 7000 is an affordable, simple and reliable all-in-one recording, viewing and management solution for network surveillance systems of up to 128 channels (with 32 channels pre-licensed).Running the full Bosch VMS (Video Management System) solution and powered by Bosch Video Recording Manager software, DIVAR IP 7000 is an intelligent IP storage device that eliminates the need for separate NVR (Network Video Recorder) server and storage hardware.It combines advanced recording management and state-of-the-art iSCSI storage into a single cost-effective, plug and play IP recording appliance for IT-minded customers which are seeking for a state-of-the-art “second generation” NVR recording solution.2. Restrictions; Known Issues•Graphics Port: The DVI port must be used for configuration. Do not use the VGA port for configuration.•Initial installation: During initial boot and installation the system must be connected to the network.Please note: All systems come with the same default IP address.•Transcoder: Maximum transcoder source stream resolution is 1920x1080p30•Mobile Video Service: the local MVS needs to be added to the system with the private IP address (not 127.0.0.1), if it shall serve as a fall-back transcoder for Operator Client access.•BVC needs to be upgraded to version 1.6.2 or higher, if it shall serve as replay client for DIVAR IP 7000 appliances with BVMS 5.0.5•VideoSDK needs to be upgraded to 5.81 MR1 or higher, if it shall serve as integration tool for DIVAR IP 3000 appliances with BVMS 5.0.5•3rd party device support restrictions are listed in the Bosch VMS release notes:o /documents/Release_Notes_5.0.5__Release_Note_enUS _16781064459.pdf3. New subcomponent software versions•Bosch VMS 5.0.5.1010 (alternative installation option: BVMS 4.5.9.359)From Product Management Telephone NurembergST-VS ST-VS/MKP1 +49 911 93456 0 12-Jan-2015•Video Recording Manager 3.00.0074•Video Streaming Gateway 5.91.0020•USB-Transcoder Service 5.60.00784. New FeaturesSystem Setup•Initial Setup procedure prompts a selection of two software installation options:o BVMS 5.0.5: recommended for most userso BVMS 4.5.9: recommended if system shall be integrated into existing BVMS 4.5.9 based infrastructureConfiguration Wizard (BVMS 5.0.5)•Remote access: DNS information can be entered in the Basic step. The port rules for router configuration can be retrieved from the detailed report in the last wizard step.•Network address of video devices to be added can be changed, if they are located in a different IP range.•Recording profiles and retention time settings can be changed individually per device or for a selection of devices.Management Server (BVMS 5.0.5)•Additional data: option to record text data together with video streamVideo Streaming Gateway (BVMS 5.0.5)•VSG supports alarm recording triggered by BVMS events5. Applied Changes / Bug FixesBVMS 5.0.5•Tested software/firmware versions, supported devices, bug fixes and change are listed in the Bosch VMS release notes:/documents/Release_Notes_5.0.5__Release_Note_enUS_16781 064459.pdfVideo Recording Manager•Bug fixes and change are listed in the VRM release notes:/downloads/nue-mkp/VRM/3_00/Bosch_Releaseletter_VRM3_00_0073.pdfMobile Video Service•Fixed: correct MVS entry shown in port mapping table for remote access•Fixed: local MVS priority settings prevent system overload•Changed: MVS web page can now be used: https://<system-IP>/mvsFrom Product Management Telephone NurembergST-VS ST-VS/MKP1 +49 911 93456 0 12-Jan-20156. Installation Notes•An upgrade from DOM Image v1.0.1 cannot be performed manually. DOM image v1.0.2 and later require a newer version of the system BIOS•All models are based on Windows Server 2008 R2, 64-bit, Standard Edition7. History7.1 DIVAR IP 7000 DOM image version 1.0.4Restrictions; Known Issues•Graphics Port: The DVI port must be used for configuration. Do not use the VGA port for configuration.•Initial installation: During initial boot and installation the system must be connected to the network.Please note: All systems come with the same default IP address.•Transcoder: Maximum transcoder source stream resolution is 1920x1080p30•ONVIF Support Restrictionso no support for event-based recordingo Audio on some 3rd Party cameras not fully supported which may result in non-availability of audio streamso TCP not supported for ONVIF cameras but with UDP protocol onlyo Motion JPEG is not supportedo VCA is always recorded for Bosch deviceso VCA is not available for ONVIF camerasFrom Product Management Telephone NurembergST-VS ST-VS/MKP1 +49 911 93456 0 12-Jan-2015New subcomponent software versions•BVMS 4.5.9.359•VRM 3.00.0057New FeaturesImage•Added support for 3TB hard drives (DIVAR IP 7000 2U)•Added support for party populated hard drive layouts; 3 to 8 hard drives as part of a RAID 5 configuration (DIVAR IP 7000 2U)Configuration Client and Configuration Wizard•To avoid security issues, a global default password must be set for all devices and all authorization levels (service, live, user) that are not password protected. You can disable this enforced password protection for BVIP devices.•VIP X16 XF E has been moved to Device Family 2 for support of 2nd stream for recording.Deviating from the behaviour of the other devices belonging to Device Family 2, VIP X16 XF Emust use the same stream for all recordings. Although the user can configure stream 1 forcontinuous recording and stream 2 for alarm recording, the second setting will not take effect. After an Bosch VMS upgrade, perform the update of the device family manually.To update the device family:Right-click the device and click Edit Encoder.Click OK.Applied Changes / Bug FixesImage•Fixed: DVD burner permission problem•Fixed: 30days password expiration problem (last fix didn’t apply in every case)•Changed: Client software and documentation updated on the local network share Operator Client•Fixed: Click on find video by event results jumped to wrong playback time.•Fixed: Live video images from NTSC cameras on DVR 670 were squeezed.•Fixed: Sometimes OpClient could crash on loading favorites.•Fixed: ONVIF domes could not be controlled.•Fixed: Under rare circumstances OpClient could crash on logon of dual authorization group.•Fixed: Video viewing via NAT/port mapping routes did not work on Windows XP.•Fixed: Manual focus/iris in automatic mode.•Tested software/firmware versions and supported devices (see BVMS 4.5.9 release notes for details http://144.76.6.227/downloads/support-cctv/DIVAR_IP_3000/BVMS_VERSION_4_5_9_ReleaseNotes.pdf)From Product Management Telephone NurembergST-VS ST-VS/MKP1 +49 911 93456 0 12-Jan-2015 Configuration Client•Fixed: OPC Server Connection for BIS license option was not available.Configuration Collector•Fixed: Config Collector freezed while zipping collected files.VRM•Fixed: Discovery is more stable•Fixed: Reliability of disconnecting transcoders improved•Fixed: Exporting Log-Files large than 100MB•Changed: iSCSI-password is also set on USB-Transcoder7.1 DIVAR IP 7000 DOM image version 1.0.2Restrictions; Known Issues•Graphics Port: The DVI port must be used for configuration. Do not use the VGA port for configuration.•Initial installation: During initial boot and installation the system must be connected to the network.Please note: All systems come with the same default IP address.•ONVIF Support Restrictionso no support for event-based recordingo Audio on some 3rd Party cameras not fully supported which may result in non-availability of audio streamso TCP not supported for ONVIF cameras but with UDP protocol onlyo Motion JPEG is not supportedo VCA is always recorded for Bosch deviceso VCA is not available for ONVIF camerasNew subcomponent software versions•BVMS 4.5.8.151•VSG 5.60.0073• Transcoder 5.60.0073•.NET Framework 4.5New Features•Unlisted Bosch BVIP video devices can be added as generic devices (see BVMS 4.5.5 release notes for details).•Server Lookup improvements (see BVMS 4.5.8 release notes for details).From Product Management Telephone NurembergST-VS ST-VS/MKP1 +49 911 93456 0 12-Jan-2015 •Minor changes in the user and workstation settings (see BVMS 4.5.8 release notes for details).•Client software and documentation can be downloaded from local network share.Applied Changes / Bug Fixes•Fixed: 30days password expiration problem•Fixed: Windows activation problem•Fixed: iSCSI LUN preparation problem•Fixed: firewall rule exceptions•Wizard prompts system reboot option when Network settings are changed•Minor fixes in new subcomponent software versions (BVMS, VRM, VSG, Transcoder)•Minor improvements in the initial installation procedure•Tested software/firmware versions and supported devices (see BVMS 4.5.8 release notes for details → http://144.76.6.227/downloads/support-cctv/DIVAR_IP_3000/BVMS_VERSION_4_5_8_ReleaseNotes_v1.pdf).•Bosch VMS default screen now shows text labels below the icons.•The default network settings now match the default network settings of other Bosch video devices o IP Address: 192.168.0.200o Subnet mask: 255.255.255.0Installation Notes•An upgrade from DOM Image v1.0.1 cannot be performed manually. DOM image v1.0.2 requires a newer version of the system BIOS•All models are based on Windows Server 2008 R2, 64-bit, Standard Edition7.2 DIVAR IP 7000 DOM image version 1.0.1Restrictions; Known Issues•Graphics Port: The DVI port must be used for configuration. Do not use the VGA port for configuration.•Password of limited operational Windows user expires after 30 days:o The password of limited user must be set manually to “never expires” on DIVAR IP 7000 by logging on to the DIVAR IP via remote desktop with user administrator user “BVRAdmin”.In the “Server Manager” the password can be changed to “Password never expires”(Configuration → Local Users and Groups → User (→ user limited)).o For details s. Bosch Security Knowledge Basehttps:///al/12/2/article.aspx?aid=7400&tab=search&bt=4&r= •Default IP Address: The system comes with the following network settingso IP Address: 192.168.178.200o Subnet mask: 255.255.0.0From Product Management Telephone NurembergST-VS ST-VS/MKP1 +49 911 93456 0 12-Jan-2015 •Initial installation: During initial boot and installation the system must be connected to the network.Please note: All systems come with the same default IP address.•Network Settings Change: The DIVAR IP needs to be restarted, if network settings are changed in the Wizard. This applies for the initial setup as well as for changes during standard operation.•Adding Storage: If the wizard stops at Step 8 “Add storage”, because the LUNs aren’t formatted, the LUNs have to be formatted using the Bosch VMS Config Client.•ONVIF Support Restrictionso no support for event-based recordingo Audio on some 3rd Party cameras not fully supported which may result in non-availability of audio streamso TCP not supported for ONVIF cameras but with UDP protocol onlyo Motion JPEG is not supportedo VCA is always recorded for Bosch deviceso VCA is not available for ONVIF camerasNew FeaturesThe DIVAR IP 7000 Family is an all-in-one management solution that comes with BVMS/VRM including Video Streaming Gateway pre-installed and with 32 channels pre-licensed. The system will come with one built-in Transcoder channel.Applied Changes / Bug Fixesn/a。
知名电子公司及其官网
A INTECH(美国英特奇公司)A- INTECH(美国英特奇公司AC TEXAS INSTRUMENTS [T1](美国德克萨斯仪器公司) .ti./AD ANALOG DEVICES(美国模拟器件公司) .analog./AM ADV ANCED MICRO DEVICES（美国先进微电子器件公司）.advantagememory./ AM DA TA-INTERSIL(美国戴特-英特锡尔公司) .datapoint./AN PANASONIC(日本松下电器公司) .panasonic./AY GENERAL INSTRUMENTS[G1](美国通用仪器公司)BA ROHM(日本东洋电具制作所)(日本罗姆公司) .rohmelectronics./BX SONY(日本索尼公司) .sony./CA RCA(美国无线电公司)CA PHILIPS(荷兰菲利浦公司) .semiconductors.philips./CA SIGNETICS(美国西格尼蒂克公司) .spt./CAW RCA(美国无线电公司)CD FAIRCHILD(美国仙童公司) .fairchildsemi./CD RCA(美国无线电公司)CIC SOLITRON(美国索利特罗器件公司)CM CHERRY SEMICONDUCTOR(美国切瑞半导体器件公司) .cherry-semi./CS PLESSEY(英国普利西半导体公司)CT SONY(日本索尼公司) .sony./CX SONY(日本索尼公司) .sony./CXA SONY(日本索尼公司) .sony./CXD SONY(日本索尼公司) .sony./CXK DAEWOO(韩国大宇电子公司)DBL PANASONIC(日本松下电器公司) .panasonic./DN AECO(日本阿伊阔公司)D...C GTE(美国通用电子公司微电路部)EA SIGNETICS(美国西格尼蒂克公司) .spt./EEA THOMSON-CSF(法国汤姆逊半导体公司) .thomson./EF THOMSON-CSF(法国汤姆逊半导体公司) .thomson./EFB PHILIPS(荷兰菲利浦公司) .semiconductors.philips./EGC THOMSON-SGF(法国汤姆逊半导体公司)ESM PHILIPS(荷兰菲利浦公司) .semiconductors.philips./F FAIRCHILD(美国仙童公司) .fairchildsemi./FCM FAIRCHILD(美国仙童公司) .fairchildsemi.G GTE(美国微电路公司)GD GOLD STAR[韩国金星(高尔达)电子公司]GL GOLD STAR[韩国金星(高尔达)电子公司]GM GOLD STAR[韩国金星(高尔达)电子公司]HA HITACHI(日本日立公司) semiconductor.hitachi./HD HITACHI(日本日立公司) semiconductor.hitachi./HEF PHILIPS(荷兰菲利浦公司) .semiconductors.philips./HM,HZ HITACHI(日本日立公司) semiconductor.hitachi./ICL,IG INTERSIL(美国英特锡尔公司)IR,IX SHARP[日本夏普(声宝)公司] .sharp./ITT,JU ITT(德国ITT半导体公司) .ittcannon./KA,KB SAMSUNG(韩国三星电子公司) .sec.samsung./KC SONY(日本索尼公司) .sony./KDA SAMSUNG(韩国三星电子公司) .sec.samsung./KIA,KID KEC(韩国电子公司)KM KS SAMSUNG(韩国三星电子公司) .sec.samsung./L SGS-ATES SEMICONDUCTOR(意大利SGS-亚特斯半导体公司) .st./ L SANYO(日本三洋电气公司) .sanyo./LA SANYO(日本三洋电气公司) .sanyo./LB SANYO(日本三洋电气公司) .sanyo./LC SANYO(日本三洋电气公司) .sanyo./LC GENERAL INSTRUMENTS(GI)(美国通用仪器公司)LF PHILIPS(荷兰菲利浦公司) .semiconductors.philips./LF NATIONAL SEMICONDUCTOR(美国国家半导体公司) .national./LH NATIONAL SEMICONDUCTOR(美国国家半导体公司) .national./ LH LK SHARP[日本夏普(声宝)公司] .sharp./LM SANYO(日本三洋电气公司) .sanyo./LM NATIONAL SEMICONDUCTOR(美国国家半导体公司) .national./ LM SIGNETICS(美国西格尼蒂公司) .spt./LM FAIRCILD(美国仙童公司) .fairchildsemi./LM SGS-ATES SEMICONDUCTOR(意大利SGS-亚特斯半导体公司) .st./ LM PHILIPS(荷兰菲利浦公司) .semiconductors.philips./LM MOTOROLA(美国莫托罗拉半导体产品公司) .motorola./LM SAMSUNG(韩国三星电子公司) .sec.samsung./LP NATIONAL SEMICONDUCTOR(美国国家半导体公司) .national./LR LSC SHARP[日本夏普(声宝)公司] .sharp./M SGS-ATES SEMICONDUCTOR(意大利SGS-亚特斯半导体公司) .st./ M MITSUBISHI(日本三菱电机公司) .mitsubishi./MA ANALOG SYSTEMS(美国模拟系统公司) .analog./MAX （美国）美信集成产品公司.maxim-ic./MB FUJITSU(日本富士通公司) .fujitsu./MBM FUJITSU(日本富士通公司) .fujitsu./MC MOTOROLA(美国莫托罗拉半导体产品公司) .motorola./MC PHILIPS(荷兰菲利浦公司) .semiconductors.philips./MC ANALOG SYSTEMS(美国模拟系统公司) .analog./MF MITSUBISHI(日本三菱电机公司) .mitsubishi./MK MOSTEK(美国莫斯特卡公司)ML PLESSEY(美国普利西半导体公司)ML MITEL SEMICONDUCTOR(加拿大米特尔半导体公司) .mitelsemi./ MLM MOTOROAL(美国莫托罗拉半导体产品公司) .motorola./MM NATIONAL SEMICONDUCTOR(美国国家半导体公司) .national./ MN PANASONIC(日本松下电器公司) .panasonic./MN MICRO NETWORK(美国微网路公司)MP MICRO POWER SYSTEMS(美国微功耗系统公司)MPS MICRO POWER SYSTEMS(美国微功耗系统公司)MSM OKI(美国OKI半导体公司) .oki./MSM OKI(日本冲电气XX) .oki./N NA SIGNETICS(美国西格尼蒂克公司) .spt./NC NITRON(美国NITROR公司)NE SIGNETICS(美国西格尼蒂克公司) .spt./NE PHILIPS(荷兰菲利浦公司) .semiconductors.philips./NE MULLARD(英国麦拉迪公司)NE SGS-ATES SEMICONDUCTOR(意大利SGS-亚特斯半导体公司) .st./NJM NEW JAPAN RADIO(JRC)(新日本无线电公司)OM PANASONIC(日本松下电器公司) .panasonic./OM SIGNETICS(美国西格尼蒂克公司) .spt./RC RAYTHEON(美国雷声公司)RM RAYTHEON(美国雷声公司)RH-IX SHARP[日本夏普(声宝)公司] .sharp./S SIEMENS(德国西门子公司) .siemens./S AMERICAN MICRO SYSTEMS(美国微系统公司)SA PHILIPS(荷兰菲利浦公司) .semiconductors.philips./SAA PHILIPS(荷兰菲利浦公司) .semiconductors.philips./SAA SIGNETICS(美国西格尼蒂克公司) .spt./SAA GENERAL INSTRUMENTS(GI)(美国通用仪器公司)SAA ITT(德国ITT-半导体公司) .ittcannon./SAB SIGNETICS(美国西格尼蒂克公司) .spt./SAB AEG-TELEFUNKEN(德国德律风根公司) .telefunken.de/engl/index_e.aspl SAF SIGNETICS(美国西格尼蒂克公司) .spt./SAK PHILIPS(荷兰菲利浦公司) .semiconductors.philips./SAS HITACHI(日本日立公司) semiconductor.hitachi./SAS AEG-TELEFUNKEN(德国德律风根公司) .telefunken.de/engl/index_e.aspl SAS SIEMENS(德国西门子公司) .siemens./SDA (德国西门子公司) .siemens./SC SIGNETICS(美国西格尼蒂克公司) .spt./SE SIGNETICS(美国西格尼蒂克公司) .spt./SE PHILIPS(荷兰菲利浦公司) .semiconductors.philips./SG SILICON GENERAL(美国通用硅片公司) .ssil./SG MOTOROAL(美国莫托罗拉半导体产品公司) .motorola./SG PHILIPS(荷兰菲利浦公司) .semiconductors.philips./SH FAIRCHILD(美国仙童公司) .fairchildsemi./SI SANKEN(日本三肯电子公司) .sanken-elec.co.jp/SK RCA(美国无线电公司)SL PLESSEY(英国普利西半导体公司)SN MOTOROAL(美国莫托罗拉半导体产品公司) .motorola./SN TEXAS INSTRUMENTS(TI)(德国德克萨斯仪器公司) .ti./SND SSS(美国固体科学公司) .s3./SO SIEMENS(德国西门子公司) .siemens./SP PLESSEY(英国普利西半导体公司)STK SANYO(日本三洋电气公司) .sanyo./STR SANKEN(日本三肯电子公司) .sanken-elec.co.jp/SW PLESSEY(英国普利西半导体公司)T TOSHIBA(日本东芝公司) .toshiba./T GENERAL INSTRUMENTS(GI)(美国通用仪器公司)TA TOSHIBA(日本东芝公司) .toshiba./TAA SIGNETICS(美国西格尼蒂克公司) .spt./TAA SIEMENS(德国西门子公司) .siemens./TAA SGS-ATES SEMICONDUCTOR(意大利SGS-亚特斯半导体公司) .st./TAA PRO ELECTRON(欧洲电子联盟)TAA PHILIPS(荷兰菲利浦公司) .semiconductors.philips./TAA PLESSEY(英国普利西半导体公司)TAA MULLARD(英国麦拉迪公司)TBA FAIRCHILD(美国仙童公司) .fairchildsemi./TBA SIGNETICS(美国西格尼蒂克公司) .spt./TBA SGS-ATES SEMICONDUCTOR(意大利SGS-亚特斯半导体公司) .st./ TBA HITACHI(日本日立公司) semiconductor.hitachi./TBA NEC EIECTRON(日本电气公司) .nec-global./TBA ITT(德国ITT半导体公司) .ittcannon./TBA AEG-TELEFUNKEN(德国德律风根公司) .telefunken.de/engl/index_e.asplTBA PRO ELECTRON(欧洲电子联盟)TBA SIEMENS(德国西门子公司) .siemens./TBA PLESSEY(英国普利西半导体公司)TBA NATIONAL SEMICONDUCTOR(美国国家半导体公司) .national./TBA THOMSON-CSF(法国汤姆逊半导体公司) .thomson./TBA PHILIPS(荷兰菲利浦公司) .semiconductors.philips./TBA MULLARD(英国麦拉迪公司)TC TOSHIBA(日本东芝公司) .toshiba./TCA ITT(德国ITT半导体公司) .ittcannon./TCA SIGNETICS(美国西格尼蒂克公司) .spt./TCA SPRAGUE ELECTRIC(美国史普拉格电子公司)TCA MOTOROAL(美国莫托罗拉半导体公司) .motorola./TCA PRO ELECTRON(欧洲电子联盟)TCA PLESSEY(英国普利西半导体公司)TCA SGS-ATES SEMICONDUCTOR(意大利SGS-亚特斯半导体公司) .st./TCA MULLARD(英国麦拉迪公司)TCA PHILIPS(荷兰菲利浦公司) .semiconductors.philips./TCA AEG-TELEFUNKEN(德国德律风根公司) .telefunken.de/engl/index_e.aspl TCA SIEMENS(德国西门子公司) .siemens./TCM TEXAS INSTRUMENTS[TI](美国德克萨斯仪器公司) .it./TDA SIGNETICS(美国西格尼蒂克公司) .spt./TDA SPRAGUE ELECTRIC(美国史普拉格电子公司)TDA MOTOROLA(美国莫托罗拉半导体公司) .motorola./TDA PRO ELECTRON(欧洲电子联盟)TDA NATIONAL SEMICONDUCTOR(美国国家半导体公司) .national./TDA PLESSEY(英国普利西半导体公司)TDA SIEMENS(德国西门子公司) .siemens./TDA NEC ELECTRON(日本电气公司) .nec-global./TDA AEG-TELEFUNKEN(德国德律风根公司) .telefunken.de/engl/index_e.aspl TDA ITT(德国ITT半导体公司) .ittcannon./TDA HITACHI(日本日立公司) semiconductor.hitachi./TDA SGS-ATES SEMICONDUCTOR(意大利-SGS亚特斯半导体公司) .st./TDA PRO ELECTRON(欧洲电子联盟)TDA PHILIPS(荷兰菲利浦公司) .semiconductors.philips./TDA RCA(美国无线电公司)TDA MULLARD(英国麦拉迪公司)TDA THOMSON-CSF(法国汤姆逊半导体公司) .thomson./TDB THOMSON-CSF(法国汤姆逊半导体公司) .thomson./TDC TRW LSI PRODUCTS(美国TRW大规模集成电路公司)TEA THOMSON-CSF(法国汤姆逊半导体公司) .thomson./TEA PHILIPS(荷兰菲利浦公司) .semiconductors.philips./TL TEXAS INSTRUMENTS(TI)(美国德克萨斯仪器公司) .toshiba./TL MOTOROLA(美国莫托罗拉半导体产品公司) .motorola./TM TOSHIBA(日本东芝公司) .toshiba./TMM TOSHIBA(日本东芝公司) .toshiba./TMS TEXAS INSTRUMENTS(TI)(美国德克萨斯仪器公司) .ti./TP TEXAS INSTRUMENTS(TI)(美国德克萨斯仪器公司) .ti./TP NATIONAL SEMICONDUCTOR(美国国家半导体公司) .national./TPA SIEMENS(德国西门子公司) .siemens./TUA SIEMENS(德国西门子公司) .siemens./U AEG-TELEFUNKEN(德国德律风根公司) .telefunken.de/engl/index_e.aspl UAA SIEMENS(德国西门子公司) .siemens./UC SOLITRON(美国索利特罗器件公司) .solitron./ULN SPRAGUE EIECTRIC(美国史普拉格电子公司) .sharp./ULN SIGNETICS(美国西格尼蒂克公司) .spt./ULN MOTOROLA(美国莫托罗拉半导体产品公司) .motorola./ULS SPRAGUE ELECTRIC(美国史普拉格电子公司) .sharp./ULX SPRAGUE ELECTRIC(美国史普拉格电子公司) .sharp./XR TEXAR INTEGRA TED SYSTEMS(美国埃克萨集成系统公司) .ti./YM Y AMAHA(日本雅马哈公司) .yamaha.co.jp/UA MOTOROLA(美国莫托罗拉半导体产品公司) .motorola./UA SIGNETICS(美国西格尼蒂克公司) .spt./UA PHILIPS(荷兰菲利浦公司) .semiconductors.philips./UA FAIRCHILD(美国仙童公司) .fairchildsemi./UAA THOMSON-CSF(法国汤姆逊半导体公司) .thomson./UPA NEC ELECTRON(日本电气公司) .nec-global./UPB NEC ELECTRON(日本电气公司) .nec-global./UPC NEC ELECTRON(日本电气公司) .nec-global./UPD NEC ELECTRON(日本电气公司) .nec-global./UPD NEC-MIRO(美国NEC电子公司微电脑分部).nec-global./。
集成电路封装技术专家：比尔·摩尔(Bill Moor)人物简介
• 促使封装技术不断创新和突破
推动插件式封装、表面贴装封装等技术的发展
• 提高了集成电路的性能和可靠性
• 为封装技术的发展奠定了基础
提出封装集成、系统级封装等技术概念
• 为集成电路封装技术的发展指明了方向
• 促使封装技术向更高层次发展
比尔·摩尔对集成电路封装技术产业发展的影响
比尔·摩尔对科技产业的影响与启示
对科技产业产生了深远影响
启示我们要关注科技产业的发展趋势
• 他的创新精神和领导力为科技产业的发展提供了榜样
• 及时调整发展战略，抓住市场机遇
• 他的成就为科技产业的发展提供了动力
• 注重技术创新和人才培养，提高产业竞争力
比尔·摩尔的个人品质与领导风格
具有创新精神
具有卓越的领导力
• 加入了学校的无线电俱乐部，开始接触电子技术
大学时期，比尔·摩尔进入加州理工学院学习
• 主修电子工程专业，辅修化学和物理
• 1965年获得电子工程学士学位
比尔·摩尔在英特尔公司的职业生涯
1965年，比尔·摩尔加入英特尔公司，担任工程师
• 参与半导体存储器产品的研发
• 对集成电路封装技术产生浓厚兴趣
集成电路封装技术的起源与发展
20世纪60年代，集成电路封装技术诞生
• 集成电路技术的发展，对封装技术提出了更高要求
• 封装技术为保护集成电路芯片，提高可靠性而诞生
20世纪70年代，集成电路封装技术得到进一步发展
• 出现了插件式封装、表面贴装封装等技术
• 提高了集成电路的性能和可靠性
20世纪80年代至今，集成电路封装技术不断发展
集成电路封装技术专家：比尔·摩尔人物简介
如何用英语介绍华为芯片的作文
文章标题Introducing Huawei's Chipset InnovationsHuawei, a global technology leader, has madesignificant strides in the realm of chipset development, revolutionizing the telecommunications and computing landscapes. At the heart of Huawei's technological prowess lies its cutting-edge chipsets, which power a range of devices from smartphones to networking equipment. Thisessay aims to delve into the remarkable advancements and features of Huawei's chipsets, highlighting their significance in the global technology ecosystem.Firstly, it's imperative to understand the fundamental role chipsets play in modern technology. A chipset is a set of integrated circuits designed to perform specific functions, often serving as the brain of electronic devices. Huawei's chipsets are renowned for their superior performance, efficiency, and innovation. The company's research and development teams have invested heavily in chipset technology, resulting in groundbreaking advancements.One of the most notable achievements is Huawei's HiSilicon chipset family. These chipsets are designed and manufactured in-house, allowing Huawei to have greater control over their devices' hardware and software integration. The HiSilicon chipsets are known for their high processing speeds, low power consumption, and advanced features like AI capabilities.Furthermore, Huawei's chipsets are not just limited to smartphones. The company has also made significant contributions to the networking industry with its chipset innovations. Huawei's networking chipsets are designed to provide robust and scalable solutions for data centers, enterprise networks, and telecommunications systems. These chipsets enable high-speed data transmission, improved security, and efficient resource utilization.Another noteworthy aspect of Huawei's chipsets is their adaptability and scalability. The company's chipset designs are flexible enough to be tailored to meet the specific needs of different devices and applications. Whether it's a high-end smartphone or a large-scale networking system,Huawei's chipsets can be optimized to deliver optimal performance.Moreover, Huawei's commitment to sustainability is reflected in its chipset designs. The company strives to use energy-efficient technologies and materials in its chipsets, reducing the overall carbon footprint of its devices. This commitment to environmental responsibility aligns with Huawei's broader vision of building a sustainable digital future.In conclusion, Huawei's chipsets are a testament to the company's technological prowess and innovation. They are not just powerful components that drive Huawei's devices; they are also key enablers of the global technology ecosystem. From smartphones to networking equipment, Huawei's chipsets are shaping the future of telecommunications and computing. As the company continues to invest in research and development, we can expect to see even more remarkable advancements in chipset technology from Huawei in the future.**介绍华为芯片创新**华为作为全球技术领导者，在芯片开发领域取得了重大进展，推动了电信和计算领域的革命性变革。
常见英文缩写
常用英文缩写VIP = very improtant person重要人物IMP (import)进口EXP (export)出口MAX (maximum)最大的、的最大限度的MIN (minimum)最小的，最低限度DOC (document)文件、的单据INT (international)国际的EMS (express mail special)特快传递IRC（International Red Cross）国际红十字会UNESCO（the United Nations Educational,Scientific and Cultural Organization）联合国教科文组织W.C（water closet）CIA(central intelligence agence)美国中情局FBI(feberal bureau of investigation)美国联邦调查局FA(football association)足协WTO 世界贸易组织WHO世界卫生组织UN 联合国UNICEF 联合国教科文组织建筑1.CBD：中央商务区(Central Business District) CBD应具备以下特征：现代城市商务中心，汇聚世界众多知名企业，经济、金融、商业高度集中，众多最好的写字楼、商务酒店和娱乐中心，最完善便利的交通，最快捷的通讯与昂贵的地价。
2.CLD：中央居住区，指由若干个居住区组成的可以满足城市居民居住、教育、购物、娱乐、休闲的大型集中型居住区，国际上普遍称为Central Living District（简称CLD）。
CLD 最重要的两个因素是空间和环境。
3.COD：中央行政区，全称是CentraL OffiCiaL DistriCt ，其名称源于该区内汇集了多家国家部委、机关、办事机构4.MORE：互动商务居住区，英文Mobile Office Residential Edifice的缩写，其文意为移动、办公、居住等意。
微型计算机英语
Microcomputers, as the cornerstone of modern technology, embody the epitome of advanced computing capabilities packed into compact devices. They have revolutionized various sectors by virtue of their high-quality standards and robust performance. This essay aims to delve deeply into the multi-faceted aspects that contribute to defining a microcomputer as 'high-quality' and 'high-standard', encompassing hardware specifications, software compatibility, user experience, reliability, and innovation.**Hardware Specifications:**The quality and standard of a microcomputer significantly hinge on its hardware components. A high-quality microcomputer typically boasts cutting-edge central processing units (CPUs) capable of executing multiple instructions concurrently at high speeds. It also features a substantial amount of Random Access Memory (RAM) which enables seamless multitasking and efficient data processing. Additionally, it has a high-capacity solid-state drive (SSD), providing lightning-fast read/write speeds compared to traditional hard disk drives (HDDs). The inclusion of high-performance graphics processing units (GPUs) is another hallmark of a top-tier microcomputer, ensuring smooth rendering for graphic-intensive applications or gaming.Moreover, connectivity options such as Wi-Fi 6, Bluetooth 5.0, USB-C ports, Thunderbolt 3, and Ethernet ports with high bandwidth denote high standards in terms of interfacing with peripherals and networking. These features allow for faster data transfer rates and broader compatibility with contemporary devices.**Software Compatibility and Optimization:**A high-quality microcomputer transcends just powerful hardware; it also necessitates a harmonious integration with sophisticated software. Operating systems should be optimized to leverage the full potential of the hardware resources. Compatibility with a wide array of software applications, including specialized professional tools and latest gaming titles, is critical. Regular software updates ensure security patches and improved functionality, thereby maintaining the high standard of the device's performance over time.**User Experience:**The user experience is a paramount aspect of any high-quality microcomputer. This includes an intuitive and responsive interface, ergonomic design, and a suite of built-in utilities that simplify tasks. A high-quality microcomputer should also offer extended battery life, quick boot-up times, and quiet operation, contributing to a seamless user experience. Furthermore, features like biometric login, voice recognition, and touch screen capabilities can enhance usability and convenience.**Reliability and Durability:**A microcomputer with high standards must be reliable and durable. This encompasses factors like robust build quality, ability to withstand normal wear and tear, and resistance to environmental hazards. Longevity is guaranteed through rigorous testing, use of high-quality materials, and heat dissipation mechanisms that prevent overheating. Warranty coverage and after-sales support services also reflect the manufacturer's commitment to upholding high standards.**Innovation and Future-proofing:**Lastly, a forward-thinking approach to technology ensures that a microcomputer remains high-quality and high-standard over time. This could mean embracing emerging technologies such as artificial intelligence, augmented reality, or quantum computing. Compatibility with next-generation interfaces like virtual reality headsets or compatibility with new protocols and standards will future-proof the device.In conclusion, a high-quality, high-standard microcomputer is a product of meticulous engineering across all dimensions – from the power of its hardware and sophistication of its software, to the ease of its use, durability, and foresight into technological advancements. In today’s competitive landscape, these attributes define not only the value but also the longevity and adaptability of a microcomputer, setting the benchmark for excellence in the digital era.This detailed analysis underscores the multifarious nature of whatconstitutes a 'high-quality' and 'high-standard' microcomputer. As technology continues to evolve, so too will our understanding and expectations of these standards, making continuous improvement and innovation essential for manufacturers striving to meet and exceed them.。
微微创新AG-加利欧功能概述 M000204-08说明书
Description M000204-08 Galileo Function OverviewMicro Innovation AGSpinnereistrasse 8-14CH-9008 St.GallenTel. +41 71 243 24 24Fax +41 71 243 24 90Table of contents1General (5)1.1System Requirements (5)1.2MICRO PANEL GF-x / XV (5)2Possibilities and Limits (6)2.1Project (6)2.2Mask (7)2.3Printing Functions (7)2.4Windows CE (7)3Project Handling (8)3.1Project Handling (8)3.2Project Documentation (8)3.3Project Settings (8)3.4Project Conversion (8)4Mask Handling (9)4.1Mask Handling (9)4.2Sub Mask (9)4.3Mask Documentation (9)4.4Mask Settings (9)4.5Object Handling (10)5Static Objects (11)5.1Drawing Objects (11)5.2Background and Images (11)5.3Dynamic Properties (11)5.4General Functions of Static Objects (11)6Dynamic Objects (12)6.1Basic Objects (12)6.2Graphical Presentation of Objects (12)6.3Keyboards (13)6.4Function Objects (13)6.5Special Function Objects (13)6.6Dynamic Properties (14)6.7General Functions of Dynamic Objects (14)7Script (15)7.1Loop-Script (15)7.2Event-Script (15)8PLC, panel type selection and data definition (16)8.1PLC Selection (16)8.2Definition of Tags (16)8.3Assign Tags (16)8.4Handling (16)8.5MICRO Panel Configuration (17)8.6Text Editing (17)8.7Further Settings and Handling (17)9Testing and Operating (18)9.1Simulation of Objects (18)9.2Optimizing (18)9.3Compiling (18)9.4Download and Upload (18)9.5Online Testing and Operating from PC (18)10PLC Protocols (19)10.1M PB-TP (19)10.2M PB1-TP / MPB2-TP (20)10.3P DP-TP (20)10.4E IB-TP (20)10.5I BS-TP (20)10.6B CB-TP (21)10.7P anel System Port (without a communication card) (21)10.8E thernet (depending on the panel type) (21)Proper useHardware, software, operating systems and drivers must only be used for the applica-tions specified in this description and only in conjunction with the components recom-mended by Micro Innovation AG.Warning!No warranty claims will be recognized for faults arising from the improper handling of any device.Devices and communication should not be used for the implementation of any safety functions relating to the protection of personnel and machinery.No liability is accepted for claims for damages arising from a failure or functional defect. All data specified in this document do not represent guaranteed specifications in the legal sense.Legend* The file size of recipe management depends on the number of data records, the number of variables and used variable types. Within Galileo the exact file size is displayed.Note: The specification of the 'Maximum Data' relate to the limiting values which are managed by the software. The number of available amounts used in the different panels depends on the free memory (depending upon type of device of the internal flash memory or of the PCMCIA card).M000204-08.doc / PD 21 / 21 19.04.2010。
华为数据中心3.0架构白皮书
Technical White PaperHigh Throughput Computing Data Center ArchitectureThinking of Data Center 3.0 AbstractIn the last few decades, data center (DC) technologies have kept evolving fromDC 1.0 (tightly-coupled silos) to DC 2.0 (computer virtualization) to enhance dataprocessing capability. Emerging big data analysis based business raiseshighly-diversified and time-varied demand for DCs. Due to the limitations onthroughput, resource utilization, manageability and energy efficiency, current DC2.0 shows its incompetence to provide higher throughput and seamlessintegration of heterogeneous resources for different big data applications. Byrethinking the demand for big data applications, Huawei proposes a highthroughput computing data center architecture (HTC-DC). Based on resourcedisaggregation and interface-unified interconnects, HTC-DC is enabled withPB-level data processing capability, intelligent manageability, high scalability andhigh energy efficiency. With competitive features, HTC-DC can be a promisingcandidate for DC3.0.ContentsEra of Big Data: New Data Center Architecture in Need 1⏹Needs on Big Data Processing 1⏹DC Evolution: Limitations and Strategies 1⏹Huawei’s Vision on Future DC 2DC3.0: Huawei HTC-DC 3⏹HTC-DC Overview 3⏹Key Features 4Summary 6June 2014ERA OF BIG DATA: NEW DATA CENTER ARCHITECTURE IN NEED⏹Needs on Big Data Processing During the past few years, applications which arebased on big data analysis have emerged, enrichinghuman life with more real-time and intelligentinteractions. Such applications have proven themselvesto become the next wave of mainstream of onlineservices. As the era of big data approaches, higher andhigher demand on data processing capability has beenraised. Being the major facilities to support highlyvaried big data processing tasks, future data centers(DCs) are expected to meet the following big datarequirements (Figure 1):▪PB/s-level data processing capability ensuring aggregated high-throughput computing, storage and networking; ▪Adaptability to highly-varied run-time resource demands; ▪Continuous availability providing 24x7 large-scaled service coverage, and supporting high-concurrency access; ▪ Rapid deployment allowing quick deployment and resource configuration for emerging applications.⏹ DC Evolution: Limitations and StrategiesDC technologies in the last decade have been evolved (Figure 2) from DC 1.0 (with tightly-coupled silos) to current DC 2.0 (with computer virtualization). Although data processing capability of DCs have been significantly enhanced, due to the limitations on throughput, resource utilization, manageability and energy efficiency, current DC 2.0 shows its incompetence to meet the demands of the future:Figure 2. DC Evolution- Throughput: Compared with technological improvement in computational capability of processors, improvement in I/O access performance has long been lagged behind. With the fact that computing within conventional DC architecture largely involves data movement between storage and CPU/memory via I/O ports, it is challenging for current DC architecture to provide PB-level high throughput for big data applications. The problem of I/O gap is resulted from low-speed characteristics of conventional transmission and storage mediums, and also from inefficient architecture design and data access mechanisms.To meet the requirement of future high throughput data processing capability, adopting new transmission technology (e.g. optical interconnects) and new storage medium can be feasible solutions. But a more fundamental approach is to re-design DC architecture as well as data access mechanisms for computing. If data access in computing process can avoid using conventional I/O mechanism, but use ultra-high-bandwidth network to serve as the new I/O functionality, DC throughput can be significantly improved.Figure 1. Needs Brought by Big DataJune 2014- Resource Utilization:Conventional DCs typically consist of individual servers which are specifically designed for individual applications with various pre-determined combinations of processors, memories and peripherals. Such design makes DC infrastructure very hard to adapt to emergence of various new applications, so computer virtualization technologies are introduced accordingly. Although virtualization in current DCs help improve hardware utilization, it cannot make use of the over-fractionalized resource, and thus making the improvement limited and typically under 30%1,2. As a cost, high overhead exists with hypervisor which is used as an essential element when implementing computer virtualization. In addition, in current DC architecture, logical pooling of resources is still restricted by the physical coupling of in-rack hardware devices. Thus, current DC with limited resource utilization cannot support big data applications in an effective and economical manner.One of the keystones to cope with such low utilization problem is to introduce resource disaggregation, i.e., decoupling processor, memory, and I/O from its original arrangements and organizing resources into shared pools. Based on disaggregation, on-demand resource allocation and flexible run-time application deployment can be realized with optimized resource utilization, reducing Total Cost of Operation (TCO) of infrastructure.- Manageability: Conventional DCs only provide limited dynamic management for application deployment, configuration and run-time resource allocation. When scaling is needed in large-scaled DCs, lots of complex operations still need to be completed manually.To avoid complex manual re-structuring and re-configuration, intelligent self-management with higher level of automation is needed in future DC. Furthermore, to speed up the application deployment, software defined approaches to monitor and allocate resources with higher flexibility and adaptability is needed.- Energy Efficiency: Nowadays DCs collectively consume about 1.3% of all Array global power supply3. As workload of big data drastically grows, future DCswill become extremely power-hungry. Energy has become a top-lineoperational expense, making energy efficiency become a critical issue in greenDC design. However, the current DC architecture fails to achieve high energyefficiency, with the fact that a large portion of energy is consumed for coolingother than for IT devices.With deep insight into the composition of DC power consumption (Figure3), design of each part in a DC can be more energy-efficient. To identify andeliminate inefficiencies and then radically cut energy costs, energy-savingdesign of DC should be top-to-bottom, not only at the system level but also atFigure 3. DC Power Consumption the level of individual components, servers and applications.Huawei’s Vision on Future DCIn Huawei’s vision, to support future big data applications, future DCs should be enabled with the following features:- Big-Data-Oriented: Different from conventional computing-centric DCs, data-centric should be the key design concept of DC3.0. Big data analysis based applications have highly varied characteristics, based on which DC 3.0 should provide optimizedmechanisms for rapid transmission, highly concurrent processing of massive data, and also for application-diversified acceleration.- Adaptation for Task Variation: Big data analysis brings a booming of new applications, raising different resource demands that vary with time. In addition, applications have different need for resource usage priority. To meet such demand variation with highadaptability and efficiency, disaggregation of hardware devices to eliminate the in-rack coupling can be a key stone. Such a methodenables flexible run-time configuration on resource allocation, ensuring the satisfactory of varied resource demand of different applications.- Intelligent Management: DC 3.0 involves massive hardware resource and high density run-time computation, requiring higher intelligent management with less need for manual operations. Application deployment and resource partitioning/allocation, even system diagnosis need to be conducted in automated approaches based on run-time monitoring and self-learning. Further, Service Level Agreement (SLA) guaranteeing in complex DC computing also requires a low-overhead run-time self-manageable solution.1./index.cfm?c=power_mgt.datacenter_efficiency_consolidation2./system-optimization/a-data-center-conundrum/3./green/bigpicture/#/datacenters/infographicsJune 2014- High Scalability: Big data applications require high throughput low-latency data access within DCs. At the same time, extremely high concentration of data will be brought into DC facilities, driving DCs to grow into super-large-scaled with sufficient processing capability. It is essential to enable DCs to maintain acceptable performance level when ultra-large-scaling is conducted.Therefore, high scalability should be a critical feature that makes a DC design competitive for the big data era.- Open, Standard based and Flexible Service Layer: With the fact that there exists no unified enterprise design for dynamical resource management at different architecture or protocol layers, from IO, storage to UI. Resources cannot be dynamically allocated based on the time and location sensitive characteristics of the application or tenant workloads. Based on the common principles of abstraction and layering, open and standard based service-oriented architecture (SOA) has been proven effective and efficient and has enabled enterprises of all sizes to design and develop enterprise applications that can be easily integrated and orchestrated to match their ever-growing business and continuous process improvement needs, while software defined networking (SDN) has also been proven in helping industry giants such as Google to improve its DC network resource utilization with decoupling of control and data forwarding, and centralized resource optimization and scheduling. To provide competitive big data related service, an open, standard based service layer should be enabled in future DC to perform application driven optimization and dynamic scheduling of the pooled resources across various platforms.- Green: For future large-scale DC application in a green and environment friendly approach, energy efficient components, architectures and intelligent power management should be included in DC 3.0. The use of new mediums for computing, memory, storage and interconnects with intelligent on-demand power supply based on resource disaggregation help achieving fine-grained energy saving. In addition, essential intelligent energy management strategies should be included: 1) Tracking the operational energy costs associated with individual application-related transactions; 2) Figuring out key factors leading to energy costs and conduct energy-saving scheduling; 3) Tuning energy allocation according to actual demands; 4) Allowing DCs to dynamically adjust the power state of servers, and etc.DC3.0: HUAWEI HTC-DCHTC-DC OverviewTo meet the demands of high throughput in the big data era, current DC architecture suffers from critical bottlenecks, one of which is the difficulty to bridge the I/O performance gap between processor and memory/peripherals. To overcome such problem and enable DCs with full big-data processing capability, Huawei proposes a new high throughput computing DC architecture (HTC-DC), which avoids using conventional I/O mechanism, but uses ultra-high-bandwidth network to serve as the new I/O functionality. HTC-DC integrates newly-designed infrastructures based on resource disaggregation, interface-unified interconnects and a top-to-bottom optimized software stack. Big data oriented computing is supported by series of top-to-bottom accelerated data operations, light weighted management actions and the separation of data and management.Figure 4. Huawei HTC-DC ArchitectureFigure 4 shows the architecture overview of HTC-DC. Hardware resources are organized into different pools, which are links up together via interconnects. Management plane provides DC-level monitoring and coordination via DC Operating System (OS), while business-related data access operations are mainly conducted in data plane. In the management plane, a centralized ResourceJune 2014Figure 5. Hardware Architecture of Huawei HTC-DC Management Center (RMC) conducts global resource partitioning/allocation and coordination/scheduling of the related tasks, with intelligent management functionalities such as load balancing, SLA guaranteeing, etc. Light-hypervisor provides abstract of pooled resources, and performs lightweight management that focuses on execution of hardware partitioning and resource allocation but not get involved in data access. Different from conventional hypervisor which includes data access functions in virtualization, light-hypervisor focuses on resource management, reducing complexity and overhead significantly. As a systematical DC3.0 design, HTC-DC also provides a complete software stack to support various DC applications. A programming framework with abundant APIs is designed to enable intelligent run-time self-management.Key FeaturesResource Disaggregated Hardware SystemFigure 5 illustrates the hardwarearchitecture of HTC-DC, which isbased on completely-disaggregatedresource pooling. The computing poolis designed with heterogeneity. Eachcomputing node (i.e. a board) carriesmultiple processors (e.g., x86, Atom,Power and ARM, etc.) for application-diversified data processing. Nodes inmemory pool adopt hybrid memorysuch as DRAM and non-volatilememory (NVM) for optimized high-throughput access. In I/O pool,general-purposed extension (GPU,massive storage, external networking,etc.) can be supported via differenttypes of ports on each I/O node. Eachnode in the three pools is equippedwith a cloud controller which canconduct diversified on-board manage-ment for different types of nodes. Pooled Resource Access Protocol (PRAP)To form a complete DC, all nodes in the three pools are interconnected via a network based on a new designed Pooled Resource Access Protocol (PRAP). To reduce the complexity of DC computing, HTC-DC introduces PRAP which has low-overhead packet format, RDMA-enabled simplified protocol stack, unifying the different interfaces among processor, memory and I/O. PRAP is implemented in the cloud controller of each node to provide interface-unified interconnects. PRAP supports hybrid flow/packet switching for inter-pool transmission acceleration, with near-to-ns latency. QoS can be guaranteed via run-time bandwidth allocation and priority-based scheduling. With simplified sequencing and data restoring mechanisms, light-weight lossless node-to-node transmission can be achieved.With resource disaggregation and unified interconnects, on-demand resource allocation can be supported by hardware with fine-granularity, and intelligent management can be conducted to achieve high resource utilization (Figure 6). RMC in the management plane provides per-minute based monitoring, on-demand coordination and allocation over hardware resources. Required resources from the pools can be appropriately allocated according to the characteristics of applications (e.g. Hadoop). Optimized algorithm assigns and schedules tasks on specific resource partitions where customized OSs are hosted. Thus, accessibility and bandwidth of remote memory and peripherals can be ensured within the partition, and hence end-to-end SLA can be guaranteed. Enabled with self-learning mechanisms, resource allocation and management in HTC-DC requires minimal manual operation, bringing intelligence and efficiency.June 2014Figure 6. On-demand Resource Allocation Based on DisaggregationHuawei Many-Core Data Processing UnitTo increase computing density, uplift data throughput and reduce communication latency, Huawei initializes Data Processing Unit (DPU, Figure 7) which adopts lightweight-core based many-core architecture, heterogeneous 3D stacking and Through-Silicon Vias (TSV) technologies. In HTC-DC, DPU can be used as the main computing component. The basic element of DPU is Processor-On-Die (POD), which consists of NoC, embedded NVM, clusters with heavy/light cores, and computing accelerators. With software-defined technologies, DPU supports resource partitioning and QoS-guaranteed local/remote resource sharing that allow application to directly access resources within its assigned partition. With decoupled multi-threading support, DPU executes speculative tasks off the critical path, resulting in enhanced overall performance. Therefore static power consumptions can be significantly reduced. Especially, some of the silicon chip area can be saved by using the optimal combinations of the number of synchronization and execution pipelines, while maintaining the same performance.Figure 7. Many-Core ProcessorNVM Based StorageEmerging NVM (including MRAM or STT-RAM, RRAM and PCM, etc.) has been demonstrated with superior performance over flash memories. Compared to conventional storage mediums (hard-disk, SSD, etc.), NVM provides more flattened data hierarchy with simplified layers, being essential to provide sufficient I/O bandwidth. In HTC-DC, NVMs are employed both as memory and storage. NVM is a promising candidate for DRAM replacement with competitive performance but lower power consumption. When used as storage, NVM provides 10 times higher IOPS than SSD4, bringing higher data processing capability with enhanced I/O performance.Being less hindered by leakage problems with technology scaling and meanwhile having a lower cost of area, NVM is being explored extensively to be the complementary medium for the conventional SDRAM memory, even in L1 caches. Appropriately tuning of selective architecture parameters can reduce the performance penalty introduced by the NVM to extremely tolerable levels while obtaining over 30% of energy gains.54./global/business/semiconductor/news-events/press-releases/detail?newsId=129615.M. Komalan et.al., “Feasibility exploration of NVM based I-cache through MSHR enhancements”, Proceeding in DATE’14June 2014Optical InterconnectsTo meet the demand brought by big data applications, DCs are driven to increase the data rate on links (>10Gbps) while enlarging the scale of interconnects (>1m) to host high-density components with low latency. However due to non-linear power consumption and signal attenuation, conventional copper based DC interconnects cannot have competitive performance with optical interconnects on signal integrity, power consumption, form factor and cost6. In particular, optical interconnect has the advantage of offering large bandwidth density with low attenuation and crosstalk. Therefore a re-design of DC architecture is needed to fully utilize advantages of optical interconnects. HTC-DC enables high-throughput low-latency transmission with the support of interface-unified optical interconnects. The interconnection network of HTC-DC employs low-cost Tb/s-level throughput optical transceiver and co-packaged ASIC module, with tens of pJ/bit energy consumption and low bit error rate for hundred-meter transmission. In addition, with using intra/inter-chip optical interconnects and balanced space-time-wavelength design, physical layer scalability and the overall power consumption can be enhanced. Using optical transmission that needs no signal synchronization, PRAP-based interconnects provide higher degree of freedom on topology choosing, and is enabled to host ultra-large-scale nodes.DC-Level Efficient Programming FrameworkTo fully exploit the architectural advantages and provide flexible interface for service layer to facilitate better utilization of underlying hardware resource, HTC-DC provides a new programming framework at DC-level. Such a framework includes abundant APIs, bringing new programming methodologies. Via these APIs, applications can issue requests for hardware resource based on their demands. Through this, optimized OS interactions and self-learning-based run-time resource allocation/scheduling are enabled.In addition, the framework supports automatically moving computing operations to near-data nodes while keeping data transmission locality. DC overhead is minimized by introducing topology-aware resource scheduler and limiting massive data movement within the memory pool.In addition, Huawei has developed the Domain Specific Language (HDSL) as part of the framework to reduce the complexity of programming in HTC-DC for parallelism. HDSL includes a set of optimized data structures with operations (such as Parray, parallel processing the data in array) and a parallel processing library. One of the typical applications of HDSL is for graph computing. HDSL can enable efficient programming with competitive performance. Automated generation of distributed codes is also supported.SUMMARYWith the increasing growth of data consumption, the age of big data brings new opportunities as well as great challenges for future DCs. DC technologies have been evolved from DC 1.0 (tightly-coupled server) to DC 2.0 (software virtualization) with the data processing capability being largely enhanced. However, the limited I/O throughput, energy inefficiency, low resource utilization and limited scalability of DC 2.0 become the bottlenecks to fulfill big data application demand. Therefore, a new, green and intelligent DC 3.0 architecture fitting different resource demands of various big-data applications is in need.With the design avoiding data access via conventional I/O but using ultra-high-bandwidth network to serve as the new I/O functionality, Huawei proposes HTC-DC as a new generation of DC design for future big data applications. HTC-DC architecture enables a DC to compute as a high throughput computer. Based on the resource disaggregated architecture and interface-unified PRAP network, HTC-DC integrates many-core processor, NVM, optical interconnects and DC-level efficient programming framework.Such a DC ensures PB-level data processing capability, supporting intelligent management, being easy and efficient to scale, and significantly saves energy.HTC-DC architecture is still being developed. Using Huawei’s cutting-edge technologies, HTC-DC can be a promising candidate design for the future, ensuring a firm step for DCs to head for the big data era.■6.“Silicon Photonics Market & Technologies 2011-2017: Big Investments, Small Business”, Yole Development, 2012Copyright © Huawei Technologies Co., Ltd. 2014. All rights reserved.No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd.and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.All other trademarks and trade names mentioned in this document are the property of their respective holders.NoticeThe information in this document may contain predictive statements including, without limitation, statements regarding the future financial and operating results, future product portfolio, new technology, etc. There are a number of factors that could cause actual results and developments to differ materially from those expressed or implied in the predictive statements. Therefore, such information is provided for reference purpose only and constitutes neither an offer nor an acceptance. Huawei may change the information at any time without notice.Huawei Technologies Co., Ltd.Address: Huawei Industrial BaseBantian, LonggangShenzhen 518129People's Republic of ChinaWebsite: Tel: 0086-755-28780808。
sandybridge
sandybridgeSandy Bridge: A Breakthrough in Processor TechnologyIntroductionSandy Bridge is a significant milestone in the evolution of processor technology, developed by Intel Corporation. Launched in 2011, this microarchitecture design revolutionized the market by introducing several groundbreaking features and advancements. This document aims to explore the Sandy Bridge architecture, outline its key components, discuss its advantages, and analyze its impact on the computing industry.Overview of Sandy Bridge ArchitectureThe Sandy Bridge architecture represents the second generation of Intel's Core processors. It succeeded the Nehalem microarchitecture and offered several improvements, including increased performance, enhanced power management, and improved graphics capabilities.Key Components of Sandy Bridge1. CPU Cores: Sandy Bridge processors featured up to four CPU cores, each capable of processing multiple threads simultaneously with Intel's Hyper-Threading technology. This allowed for greater efficiency in multitasking and improved overall performance.2. Integrated GPU: Sandy Bridge marked the first time that Intel integrated a graphics processing unit (GPU) directly onto the CPU die. The GPU provided a significant boost in graphics performance, enabling smooth playback of high-definition videos, improved gaming capabilities, and better visual effects.3. Ring Bus: Sandy Bridge introduced a new communication architecture called the Ring Bus. It replaced the traditional Front Side Bus (FSB) used in previous processor generations. The Ring Bus improved data transfer speeds between the cores, cache, GPU, and other components, resulting in faster and more efficient data processing.4. Smart Cache: Sandy Bridge processors featured an upgraded Smart Cache system that improved memory access and reduced latency. The Smart Cache dynamically allocatedresources to the CPU cores as needed, resulting in improved performance and efficiency.Advantages of Sandy Bridge1. Increased Performance: Sandy Bridge offered significant performance improvements over its predecessor, Nehalem. The combination of more CPU cores, Hyper-Threading technology, and a higher clock speed resulted in faster and more responsive computing experiences.2. Enhanced Graphics: The integrated GPU in Sandy Bridge processors delivered superior graphics performance, reducing the need for a separate graphics card in most everyday computing tasks. This resulted in cost savings for consumers and improved energy efficiency.3. Power Efficiency: Sandy Bridge processors introduced several power management features, including the ability to dynamically adjust clock speeds and voltages based on workload demands. This feature, known as Intel Turbo Boost, helped optimize performance while conserving power, making Sandy Bridge processors more energy-efficient.4. Greater Overclocking Potential: Sandy Bridge processors were well-regarded by PC enthusiasts and overclockers due to their high overclocking potential. The architecture's improved power management and thermal design enabled users to push their CPUs to higher clock speeds without compromising stability.Impact on the Computing IndustryThe launch of Sandy Bridge had a profound impact on the computing industry. Its improved performance, energy efficiency, and integrated graphics capabilities made it an attractive option for both mainstream users and professionals alike. Sandy Bridge CPUs powered a wide range of devices, from desktop computers and laptops to servers and workstations.Additionally, the integrated GPU capabilities of Sandy Bridge processors played a crucial role in improving the overall visual experience for users. Graphics-intensive tasks such as gaming and video editing became more accessible to a broader audience, as dedicated graphics cards were no longer a necessity for many applications.Sandy Bridge's success also prompted competing companies to invest in their own integrated graphics solutions, leading to significant advancements in GPU technology across the industry.ConclusionSandy Bridge represents a major breakthrough in processor technology, introducing several key advancements that revolutionized the computing industry. Its improved performance, energy efficiency, and integrated graphics capabilities set a new standard for processors, making it a popular choice for consumers and professionals alike. As Intel continues to innovate, Sandy Bridge remains a significant milestone in the evolution of CPU design and a testament to the ongoing quest for faster and more efficient computing.。
贝尔金Beovision Eclipse 2代的产品手册
State-of-the-art sound paired with exceptional OLED picture.Integrated 3 channel speaker system with powerful 450 watts.Personalise with selection of covers, aluminium finishes and placement options.Much more than a TV, it is also a complete music system.Beoremote One– providing one-touch access.I M P O R T A N T F E A T U R E SRedefining the TV experience.BeoVision Eclipse combines the beauty of OLED 4K images with the world’s best TV sound system. It represents sound and picture in perfect alignment. Add to this the stunning looks – every little detail is carefully attended to.High-quality materials provide the aesthetic freedom to place the TV anywhere you want, even freestanding in a room.P R O D U C T O V E R V I E WS P E C I F I C A T I O N S B A S I CT E C H N I C A L Speaker ConfigurationIntegrated fully activethree channel stereo(centre and stereo)· 1 x 1” tweeter· 2 x 2.5” fullrange drivers· 3 x 4” midrange/wooferAmplifiers· 1 x 50 watts for centre tweeter· 2 x 50 watts for fullrange driver· 3 x 100 watts for midrange/wooferAdvanced sound features·Integrated 7.1 surroundsound module·Adaptive Bass Linearisation·Sound modes and Speaker groups·TrueImage up and downmixing·Immaculate Wireless Soundintegrated for a full wireless surroundsolution with connection of up to8 speakers·Multiroom technology is integrated Integrated music servicesTuneIn Internet RadioQplay 2.0 (China Specific)Deezer (incl. Deezer HiFi)Display·LG 55” / 65” OLED 4K·Cinema HDR (Dolby Vision®,HDR10, HLG), Dolby Vision IQ.·ą9 Gen 3 AI Processor with AI Picture Pro: artificial intelligence deep learning algorithms to improve picture quality·webOS & ThinQ AI·Absolute black, wide viewing angle, wide colour gamutRemote Control2way Bluetooth control via Beoremote One BTPlacement·Manual wall bracket moving up to60° from wall.·Motorised wall bracket with remote operation moving up to 60° from wall ·Motorised floor stand with remote operation moving up to 90° to either side ·Floor standC O N N E C T I V I T YY O U M I G H T W A N N A K N O W MultiroomAirplay 2Chromecast built-inBeolink MultiroomOutputs8x WISA8x Powerlink6x PUC control via IRInputsSoundcenter:·Bluetooth 4.2· 4 x HDMI (2.0)· 1 x Ethernet 10/100Mb· 1 x Analogue line in(3,5 mm mini jack)· 1 x Optical inTV screen:· 4 x HDMI (2.1)· 3 x USB· 1 x Ethernet 10/100MbDesigner:T orsten Valeur, David Lewis DesignersMotorised floor stand:designduo | smedegaard weisWeight55”: 33.1 kg65”: 41.8 kgFloor stand: 25.2 kgWall bracket: 8.0 kgS P E C I F I C A T I O N S F O R55”111.8B E O V I S I O N EC L I P S E 2n d G E N .S P E C I F I C A T I O N S F O R 65”D I M E N S I O N S A N D P L A C E M E N T S :Floor standWall bracket99.5124.965"144.112.211.1111.851.8123.5Wall bracket139.010.612.299.5Motorised wall bracket3.6124.960°51.8136.012.211.1111.837.2121.354.4123.5Motorised wall bracket60° 3.6124.9 3.660°133.649.951.854.4136.098.437.252.0121.3Motorised floorstand 98.437.2133.698.437.252.0121.3Motorised floorstand98.4252.0H I G H L I G H T E D V A R I A N T SS I L V E RSoundcenter speaker coverLight OakSoundcenter rear sideSilver aluminiummotorised floor standSilver aluminiumB R A S ST O N ESoundcenter speaker coverOak woodSoundcenter rear sideBrass tone aluminiummotorised floor standBrass tone aluminiumB R O N Z ET O N ESoundcenter speaker coverSmoked OakSoundcenter rear sideBronze tone aluminiummotorised floor standBronze aluminiumC O S T U M I S A B I L I T YS O U N D C E N T E R S P E A K E R C O V E R :SilverForged Iron Grey SilveraluminiumSilveraluminiumOak Black InfantryGreen Brass tone alumunium Brass tonealumuniumBlackBronze tone alumunium Smoked oak WalnutBrass T one Parisian Night Blue Purple HeartPiano Black aluminiumBronze T oneAluminiumFabricWoodLight Oak M O T O R I S E D F L O O R S T A N DF L O O R S T A N DS O U N D C E N T E R R E A R S I D E·Silver aluminium·Brass tone alumunium ·Bronze tone alumunium ·Piano Black aluminium。
博时特 EC01 边缘计算盒说明书
边缘计算盒子EC01说明书深圳博时特科技有限公司Bozztek Technology（Shenzhen）Co.,Ltd.发布版本:V1.0日期:2020.11.10边缘计算盒子说明书一.应用场景本产品基于瑞芯微RK3399+RK1808架构的AI边缘计算解决方案，RK3399为双Cortex-A72+四Cortex-A53大小核CPU，主频1.8GHz的高性能处理器，可支持4K60fps VP9and4K10bits，H265/H264视频解码，外围接口丰富，拥有丰富的扩展性。
RK1808是一款嵌入式神经网络处理器（NPU），双核A35，1.6GHz主频CPU，NPU算力可达3.0TOPs，支持PCI-e/USB3.0/RGMIIMP。
可通过集联多片RK1808核心板，扩展出强劲12T甚至更高的算力，可对多路摄像头及网络摄像头进行视频结构化分析。
Rockchip RK3399+RK1808芯片的边缘计算主板算力超强，输入输出接口丰富且扩展性强。
PCB有极佳的电气特性和抗干扰特性，工作稳定可靠，达到工业级标准。
可广泛应用于智慧城市、安防、医疗以及工业互联网等人工智能终端领域。
二.产品特性●RK3399*1+RK1808*4,12.0T算力（还可扩展多个计算棒，最大可达24T算力）●支持INT8/INT16/FP16混合运算，完美兼顾性能、功耗及运算精度●支持8路1080P视频流接入,每路视频流最大可独享4GDDR缓存，最大可有3T算力支持●支持TensorFlow、Caffe、ONNX、DaRKnet等框架的网络模型转换核心板预留接口丰富，支持多种外设扩展三.产品规格表四.F501终端类型图示外形图五．EC01边缘计算盒子外形尺寸六．外观接口指示说明七.安装EC01边缘盒子的安装产品4角有开安装孔，可以根据使用场景需要，通过螺丝固定到墙壁或设备上。
3、设备自带电源适配器总长1.8米。
电源线延长不可超过3米，否则会导致设备主机端电压供电不足，出现反复重启、死机等异常现象。
维克ト恩能源生产力系统配置助手说明书
Overview of available AssistantsClick on the thumbnails to see the full screenshot.1. Assistants related to SolarMake sure to read Configuring solar systems with Quattros and Multis when configuring a solar system.ESS AssistantFor Energy Storage Systems (ESS). The Assistant manages the prioritising of Solar Power. Documentation.PV Inverter supportUse this Assistant in Off-grid systems that have AC-Coupled solar power: a grid-tie PV inverter connected to the AC out of a Multi or Quattro inverter/charger.Documentation.DEPRECATED Self-consumption Hub-1 - for dc-coupled systems2022-06-01assistants:overview_of_available_assistants https:///live/assistants:overview_of_available_assistants 13:41Note that Hub-1 is deprecated in favor of ESS.Hub-1 Assistant documentation.Hub-1 is only for hardware with new microprocessor (26 or 27).Hub-1 and Hub-2 Assistant notesDEPRECATED Self-consumption Hub-2 v3 - for ac-coupled systemsTake note of the factor 1.0 rule.Deprecated in favor of ESS.Only for hardware with new microprocessor (26 or 27).Hub-1 and Hub-2 Assistant notesDEPRECATED Self-consumption Hub-2 v2 - for ac-coupled systemsUse only on hardware with old microprocessor (19 or 20). On newer systems, use the version 3 instead, see above.Take note of the factor 1.0 rule.Note that all Hub-2 Assistant versions have been deprecated in favor of ESS.Hub-1 and Hub-2 Assistant notesDEPRECATED Self-consumption Hub-4Do not use Hub-4 for new installs. It is deprecated in favor of ESS.Hub-4 manual.Only for hardware with new microprocessor (26 or 27).2. Functional AssistantsGenerator start and stopAutomatically start and stop a generator based on battery state of charge andactual load of a system. Note that automatic genset start/stop functionality isalso available on the Virtual switch tab in VEConfigure, which is easier to workwith.This is one of the available options to automatically start and stop a generator using Victron equipment. See the auto-generator-start-stop document for an overview of all options. More general information about using a generator in combination with Victron is available here.This Generator start and stop Assistant is also the one to use to configure Ignore AC Input using Assistants.AC Current sensor2022-06-01assistants:overview_of_available_assistants https:///live/assistants:overview_of_available_assistants 13:41Reads PV Inverter current, using an AC Current sensor (CSE000100000),connected to a VE.Bus product. More information available in the AC Currentsensor manual.Silence fanDisable the fans at night with a simple external switch, to ensure a quiet night.Very useful for boats and motorhomes.Input current limit controlAutomatically set the input current limit to a predefined value based on thestate of an aux input or rpm measured with the 1140 interface. Used in thefollowing systems:1.A variable speed generator, flywheel generator or waterturbine, where the available AC powerdepends on the rpm. See the Interface 1140 (ASS030510000) manual for more information.Vehicles or boats that have two different types of shore plugs. One high power plug and one low 2.power plug. Use the assistant to automatically set the input current limiter based on the used plug.And there are more situations that can come to mind, for example a Multi connected behind a 3.transfer switch.Charge current controlSets the charge current to a predefined setpoint, based on the active AC Input(for Quattros) or the state of an aux input.Safety switchUsed to wire an emergency stop button to a VE.Bus system. DEPRECATED VE.Bus BMS supportDeprecated: per VE.Bus firmware version 489, this Assistant is no longer required. When installing a system with VE.Bus BMS, our advice is to first update the firmware of the inverter, using VictronConnect, and thereafter do the configuration. No Assistant needed.Required in combination with a VE.Bus BMS, used with our 12.8 V Lithium batteries. This Assistant communicates with the BMS and controls the Multi based on the BMS measurements.Two-Signal BMS support (previously called Lynx Ion BMS support)Required in combination with a Lynx Ion BMS, used with our 24 V 180 AhLithium system. This Assistant can also be used to control the Multi with a thirdparty Lithium system including BMS. See our PDF Connecting other lithiumbattery systems to Multis and Quattros for more information.3. Advanced AssistantsProgrammable relay2022-06-01assistants:overview_of_available_assistants https:///live/assistants:overview_of_available_assistants 13:41Relay lockerGeneral flag userDISQUSView the discussion thread.。
英语北京硅谷时代技术开发中心其他产品介绍
一、滚瓜烂熟系列《英语发音滚瓜烂熟》发音是任何一种语言的基础，英语学习要从英语发音开始。
只有掌握了标准英语发音，才能说出纯正的英语，才能听懂正常语速的对话，也才能自如地用英语交流。
硅谷时代互动英语实验室经过长期素材准备、技术开发，推出了《英语发音“滚瓜烂熟”》学习软件。
1、素材权威丰富素材由人教社选定的专家及外籍学者编写、朗读。
素材包含数千个发音盲点（近似音）的辩识练习和分门别类的10000多单词。
发音盲点包含音标盲点、音节盲点、单词盲点等，并且用户在学习过程中还会智能地产生用户自己的盲点。
2、目标彻底《英语发音“滚瓜烂熟”》的目的是使您对英语发音的敏感度就象母语一样，任何英语发音都能在您大脑里产生直接反射，英语的听和说再也不需要经过反复思考。
3、功能强大音标学习：通过音标发音技巧、音标发音校正、音标听写、常见音标盲点辩识、用户音标盲点辩识等功能使您对每一个音标都能正确发音和辨别。
音节学习：通过音节拼读、音节听写、常见音节盲点辩识、用户音节盲点辩识等功能进一步提高您对音语发音的敏感度，并且使您以后看到任何单词都会发音。
常见单词盲点辩识：本产品从国家教委指定教材中精心挑选了数千个单词盲点，如“thin”和“thing”，“sin”和“thin”，“wheat”和“wait”，“ship”和“sheep”等，让您反复辩识。
学完这些盲点后，您再也不会在听英语时因某个单词而打顿。
用户单词盲点辩识：用户单词盲点是您在学习过程中产生的盲点。
该功能是为您自己量身定制的一套单词发音盲点解决方案。
捋单词：让您一遍一遍地将所有常用单词的发音和词义捋得滚瓜烂熟。
捋单词与一般的单词记忆法完全不同，它总是让您优先记忆您最不熟悉的单词，使您在短时间内对10000余个常用单词的熟悉程度都同“Sorry”一样，脱口而出。
我们的单词库按难易程度分为8个等级，用户可以根据自己的英语水平选择任一个等级。
4、适用面广本产品适合每一个英语学习者，如果您是初学者，您可以用来学好发音，并快速高效地提高听力水平；如果您已具备一定英语水平，本产品将会使您的听说能力产生突破性提高；如果您的英语水平非常高，本产品仍然对提高英语敏感度大有裨益。
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