HDSP-5703-HG000中文资料

XXHDS产品优势介绍yx

HPQ XP256 XP48 XP512 XP128 XP1024 XP10000 XP12000 XP 24000
SUN N/A SE9910 SE9960 SE9970 SE9980 SE9985 SE9990 SE9990V
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XXHDS产品优势介绍yx
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• HDS独有虚拟端口模式
– 每一个物理端口支持128个异构主机平台连接
• 各主机拥有自己的存储空间，没有数据覆盖危险
• 多个LUN 0 支持
– 更好的利用FC端口200MB/s的带宽
• 很多应用仅需要5－10MB/s的带宽
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•存储系统
•POR T
•AMS •Virtual Port
SE9985
SE9990
SE9990 V
• HP：高端存储全球OEM战略合作 • SUN：高端存储全球联合品牌合作 • 联想、Gateway、Acer：中、低端模
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XXHDS产品优势介绍yx
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•OE M
HDS中国区业务
• 4 iSCSI ports—2 per controller (Fibre Channel models available 2008)
• Supports SATA II (500GB or 750GB) or SAS (147GB or 300GB) HDDs
• 6, 8, or 12 HDDs per model, up to 9TB of capacity
• • • •

HDSP-G10X资料

Features• Low Power Consumption • Industry Standard Size• Industry Standard Pinout • Choice of Character Size 7.6 mm (0.30 in), 10 mm (0.40 in), 10.9 mm (0.43 in), 14.2 mm (0.56 in), 20 mm (0.80 in)• Choice of ColorsAlGaAs Red, High Efficiency Red (HER), Yellow, Green• Excellent Appearance Evenly Lighted Segments±50° Viewing Angle• Design FlexibilityCommon Anode or Common CathodeSingle and Dual DigitLeft and Right Hand Decimal Points±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display• Excellent for Long Digit String Multiplexing DescriptionThese low current seven segment displays are designed for applica-tions requiring low power consumption. They are tested and selected for their excellent low current characteristics to ensure that the segments are matched at low currents. Drive currents as low as 1 mA per segment are available.Pin for pin equivalent displays are also available in a standard current or high light ambient design. The standard current displays are available in all colors and are ideal for most applica-tions. The high light ambient displays are ideal for sunlight ambients or long string lengths. For additional information see the 7.6 mm Micro Bright Seven Segment Displays, 10 mm Seven Segment Displays, 7.6 mm/10.9 mm Seven Segment Displays, 14.2 mm Seven Segment Displays, 20 mm Seven Segment Displays, or High Light Ambient Seven Segment Displays data sheets.Low Current Seven SegmentDisplays Technical Data HDSP-335x Series HDSP-555x Series HDSP-751x Series HDSP-A10x Series HDSP-A80x Series HDSP-A90x Series HDSP-E10x Series HDSP-F10x Series HDSP-G10x Series HDSP-H10x Series HDSP-K12x, K70x SeriesHDSP-N10x SeriesDevicesAlGaAs HER Yellow Green Package HDSP-HDSP-HDSP-HDSP-Description Drawing A1017511A801A9017.6 mm Common Anode Right Hand Decimal AA1037513A803A9037.6 mm Common Cathode Right Hand Decimal BA1077517A807A9077.6 mm Common Anode ±1. Overflow CA1087518A808A9087.6 mm Common Cathode ±1. Overflow DF10110 mm Common Anode Right Hand Decimal EF10310 mm Common Cathode Right Hand Decimal FF10710 mm Common Anode ±1. Overflow GF10810 mm Common Cathode ±1. Overflow HG10110 mm Two Digit Common Anode Right Hand Decimal XG10310 mm Two Digit Common Cathode Right Hand Decimal YE100335010.9 mm Common Anode Left Hand Decimal IE101335110.9 mm Common Anode Right Hand Decimal JE103335310.9 mm Common Cathode Right Hand Decimal KE106335610.9 mm Universal ±1. Overflow[1]LH101555114.2 mm Common Anode Right Hand Decimal MH103555314.2 mm Common Cathode Right Hand Decimal NH107555714.2 mm Common Anode ±1. Overflow OH108555814.2 mm Common Cathode ±1. Overflow PK121K70114.2 mm Two Digit Common Anode Right Hand Decimal RK123K70314.2 mm Two Digit Common Cathode Right Hand Decimal SN10020 mm Common Anode Left Hand Decimal QN10120 mm Common Anode Right Hand Decimal TN10320 mm Common Cathode Right Hand Decimal UN10520 mm Common Cathode Left Hand Decimal VN10620 mm Universal ±1. Overflow[1]W Note:1. Universal pinout brings the anode and cathode of each segment’s LED out to separate pins. See internal diagrams L or W.Part Numbering System5082-x xx x-x x x xxHDSP-x xx x-x x x xxMechanical Options[1]00: No mechanical optionColor Bin Options[1,2]0: No color bin limitationMaximum Intensity Bin[1,2]0: No maximum intensity bin limitationMinimum Intensity Bin[1,2]0: No minimum intensity bin limitationDevice Configuration/Color[1]G: GreenDevice Specific Configuration[1]Refer to respective datasheetPackage[1]Refer to Respective datasheetNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative fordetails.2. Bin options refer to shippable bins for a part-number. Color and Intensity Bins are typically restricted to 1 bin per tube (excep-tions may apply). Please refer to respective datasheet for specific bin limit information.Package DimensionsPackage Dimensions (cont.)Package Dimensions (cont.)*The Side View of package indicates Country of Origin.Package Dimensions (cont.)Package Dimensions (cont.)元器件交易网9 Package Dimensions (cont.)10 Internal Circuit DiagramInternal Circuit Diagram (cont.)Absolute Maximum RatingsAlGaAs Red HERHDSP-A10X/E10X/HDSP-751X/Yellow GreenH10X/K12X/N10X/335X/555X/HDSP-A80X HDSP-A90X Description F10X, G10X Series K70X Series Series Series Units Average Power per Segment or DP375264mW Peak Forward Current per 45mA Segment or DPDC Forward Current per15[1]15[2]mA Segment or DPOperating Temperature Range-20 to +100-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment 3.0V or DPLead Solder Temperature for 3Seconds (1.60 mm [0.063 in.] below 260°C seating plane)Notes:1. Derate above 91°C at 0.53 mA/°C.2. Derate HER/Yellow above 80°C at 0.38 mA/°C and Green above 71°C at 0.31 mA/°C.Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions315600I F = 1 mA A10x3600I F = 5 mA330650I F = 1 mAF10x, G10x3900I F = 5 mA390650I F = 1 mA E10x Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)3900I F = 5 mA400700I F = 1 mAH10x, K12x4200I F = 5 mA270590I F = 1 mA N10x3500I F = 5 mA1.6I F = 1 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA1.82.2I F = 20 mA Pk All Devices Peak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2 mV mV/°CV F/Segment or DPA10x255F10x, G10x320E10x340Thermal Resistance LED RθJ-PIN°C/W/SegH10x, K12x Junction-to-Pin400N10x430High Efficiency RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions160270I F = 2 mA 751x1050I F = 5 mA200300I F = 2 mA Luminous Intensity/Segment[1,2]I V mcd(Digit Average)1200I F = 5 mA335x, 555x,K70x270370I F = 2 mA1480I F = 5 mA1.6I F = 2 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA2.1 2.5I F = 20 mA Pk All Devices Peak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DP751x200335x Thermal Resistance LED RθJ-PIN280°C/WJunction-to-Pin555x, K70x345YellowDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250420I F = 4 mA(Digit Average)I V mcd1300I F = 10 mA1.7I F = 4 mAForward Voltage/Segment or DP V F 1.8V I F = 5 mA A80x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK583nmDominant Wavelength[3,5]λd581.5585592.5nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinGreenDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250475I F = 4 mA(Digit Average)I V mcd1500I F = 10 mA1.9I F = 4 mAForward Voltage/Segment or DP V F 2.0V I F = 10 mA A90x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK566nmDominant Wavelength[3,5]λd571577nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is the single wavelength which defines the color of thedevice.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. The yellow (HDSP-A800) and Green (HDSP-A900) displays are categorized for dominant wavelength. The category is designated by anumber adjacent to the luminous intensity category letter.Intensity Bin Limits (mcd)AlGaAs RedHDSP-A10xIV Bin Category Min.Max.E0.3150.520F0.4280.759G0.621 1.16H0.945 1.71I 1.40 2.56J 2.10 3.84K 3.14 5.75L 4.708.55HDSP-E10x/F10x/G10xIV Bin Category Min.Max.D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-H10x/K12xIV Bin Category Min.Max.C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50HDSP-N10xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued HERHDSP-751xIV Bin Category Min.Max.B0.1600.240C0.2000.300D0.2500.385E0.3150.520F0.4280.759G0.621 1.16HDSP-751xIV Bin Category Min.Max.B0.2400.366C0.3000.477D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-555x/K70xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued YellowHDSP-A80xIV Bin Category Min.Max.D0.2500.385E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60GreenHDSP-A90xIV Bin Category Min.Max.E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60Electrical/OpticalFor more information on electrical/optical characteristics, please see Application Note 1005.Contrast Enhancement For information on contrast enhancement, please see Application Note 1015.Soldering/Cleaning Cleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from the chorinated hydrocarbon family (methylene chloride, trichloro-ethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs, please refer to Application Note 1027.Note:All categories are established for classification of products. Productsmay not be available in all categories. Please contact your localAgilent representatives for further clarification/information.Color Categories/semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788 6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6271 2451India, Australia, New Zealand: (+65) 6271 2394Japan: (+81 3) 3335-8152(Domestic/International), or0120-61-1280(Domestic Only)Korea: (+65) 6271 2194Malaysia, Singapore: (+65) 6271 2054Taiwan: (+65) 6271 2654Data subject to change.Copyright © 2003 Agilent Technologies, Inc.Obsoletes 5988-8412ENSeptember 24, 20035989-0080EN。

HDSP-0883-00300中文资料

DevicesPart Number HDSP-ColorDescriptionFront View0781High-Efficiency Red Numeric, Right Hand DP A 0782Low Power Numeric, Left Hand DP B 0783Over Range ±1C 0784HexadecimalD 0791High-Efficiency Red Numeric, Right Hand DP A 0792High Brightness Numeric, Left Hand DP B 0793Over Range ±1C 0794HexadecimalD 0881YellowNumeric, Right Hand DP A 0882Numeric, Left Hand DP B 0883Over Range ±1C 0884HexadecimalD 0981High-Performance GreenNumeric, Right Hand DP A 0982Numeric, Left Hand DP B 0983Over Range ±1C 0984HexadecimalDHDSP-078x HDSP-079x HDSP-088x HDSP-098xFeatures• Three Character Options Numeric, Hexadecimal, Over Range• Three ColorsHigh Efficiency Red, Yellow,High Performance Green• 4x 7 Dot Matrix Character • High Efficiency Red, Yellow and High Performance Green • Two High Efficiency Red OptionsLow Power, High Brightness • Performance Guaranteed Over Temperature• High Temperature Stabilized • Memory Latch/Decoder/DriverTTL Compatible• Categorized for Luminous IntensityDescriptionThese standard solid state displays have a 7.4 mm (0.29 inch) dot matrix character and an on-board IC with data memory latch/decoder and LED drivers in a glass/ceramic package.The hermetic HDSP-078x,-079x/-088x displays utilize a solder glass frit seal. The HDSP-098X displays utilize an epoxy glass-to-ceramic seal.The numeric devices decode posi-tive BCD logic into characters “0-9,” a “–” sign, decimal point,and a test pattern. Thehexadecimal devices decodeGlass/Ceramic Numeric and Hexadecimal Displays for Industrial Applications Technical Datapositive BCD logic into 16characters, “0-9, A-F.” An input is provided on the hexadecimal devices to blank the display (all LEDS off) without losing the contents of the memory.The over range device displays “±1” and right hand decimal point and is typically driven via external switching transistors.COUNTRY CODEPackage DimensionsAbsolute Maximum RatingsNotes:1. The nominal thermal resistance of a display mounted in a socket that is soldered onto a printed circuit board isRθJA=50°C/W/device. The device package thermal resistance is RθJ-PIN = 15°C/W/device. The thermal resistance device pin-to-ambient through the PC board should not exceed 35°C/W/device for operation up to T A = +100°C.2. Voltage values are with respect to device ground, pin 6.3. These displays are categorized for luminous intensity with the intensity category designated by a letter code located on the back ofthe display package. Case temperature of the device immediately prior to the light measurement is equal to 25°C.Electrical/Optical Characteristics T A = –55°C to +100°CNotes:4. The luminous intensity at a specific operating ambienttemperature, I v(T A), may be approximated from the following exponential equation: I v(T A)=I v(25°C) e[k(T-25°C)].Device KHDSP-078 Series–0.0131/°CHDSP-079x SeriesHDSP-088x Series–0.0112/°CHDSP-098x Series–0.0104/°C 5. The dominant wavelength, λd, is derived from the CIE chroma-ticity diagram and represents the single wavelength whichdefines the color of the device.6. The HDSP-088X and HDSP-098X series devices are categor-ized as to dominant wavelength with the category designated by a number on the back of the display package.7. All typical values at V CC = 5.0 V and T A = 25°C.Operational ConsiderationsElectricalThese devices use a modified4x7 dot matrix of light emitting diodes to display decimal/ hexadecimal numeric informa-tion. The high efficiency red and yellow displays use GaAsP/GaP LEDs and the high performance green displays use GaP/GaP LEDs. The LEDs are driven by constant current drivers, BCD information is accepted by the display memory when the enable line is at logic low and the data islatched when the enable is atlogic high. Using the enable pulsewidth and data setup and holdtimes listed in the RecommendedOperating Conditions allows datato be clocked into an array ofdisplays at a 6.7MHz rate.The decimal point input is activelow true and this data is latchedinto the display memory in thesame fashion as the BCD data.The decimal point LED is drivenby the on-board IC.The blanking control input on thehexadecimal displays blanks(turns off) the displayedinformation without disturbingthe contents of display memory.The display is blanked at aminimum threshold level of 2.0volts. When blanked, the displaystandby power is nominally 250mW at T A = 25°C.The ESD susceptibility of the ICdevices is Class A of MIL-STD-883 or Class 2 of DOD-STD-1686and DOD-HDBK-263.AMechanicalThese displays are hermetically sealed for use in environments that require a high reliability device. These displays are designed and tested to meet a helium leak rate of5x10-8cc/sec.These displays may be mounted by soldering directly to a printed circuit board or insertion into a socket. The lead-to-lead pin spacing is 2.54 mm (0.100 inch) and the lead row spacing is 15.24 mm (0.600 inch). These displays may be end stacked with 2.54 mm (0.100 inch) spacing between outside pins of adjacent displays. Sockets such as Augat 324-AG2D (3 digits) or Augat 508-AG8D (one digit, right anglemounting) may be used.The primary thermal path forpower dissipation is through thedevice leads. Therefore, to insurereliable operation up to anambient temperature of +100°C,it is important to maintain abase-to-ambient thermalresistance of less than35°C watt/device as measured ontop of display pin 3.For further information onsoldering and post soldercleaning, see Application Note1027, Soldering LEDComponents.PreconditioningThese displays are 100% pre-conditioned by 24 hour storage at125°C, at 100°C for the HDSP-098x Series.Contrast EnhancementThese display devices aredesigned to provide an optimumON/OFF contrast when placedbehind an appropriate contrastenhancement filter. For furtherinformation on contrastenhancement, see ApplicationNote 1015, ContrastEnhancement for LEDDisplays.Over Range DisplayThe over range devices display“±1” and decimal point. Thecharacter height and packageconfiguration are the same as thenumeric and hexadecimaldevices. Character selection isobtained via external switchingtransistors and current limitingresistors.Absolute Maximum RatingsDescription Symbol Min Max Unit Storage Temperature, Ambient T S–65+125°C Operating Temperature, Ambient T A–55+100°C Forward Current, Each LED I F10mA Reverse Voltage, Each LED V R5VPackage DimensionsLuminous Intensity per LED(Digit Average) at T= 25°C Figure 3. Typical Driving Circuit.Notes:0: Line switching transistor in Figure 7 cutoff.1: Line switching transistor in Figure 7 saturated.X: ‘don’t care.’Electrical Characteristics T A = –55°C to +100°CColor Bin Limits (Dominant Wavelength)Note:Bin categories are established for classification of products. Productsmay not be available in all bin categories. Please consult your localAgilent Technologies representative./semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939Japan: (+81 3) 3335-8152 (Domestic/Interna-tional), or 0120-61-1280 (Domestic Only)Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand,Philippines, Indonesia: (+65) 6755 2044Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc.Obsoletes 5964-6390EJuly 14, 20045988-2261EN。

HDSP-5707-HD000中文资料

14.2 mm (0.56 inch)Seven Segment Displays Technical DataFeatures• Industry Standard Size • Industry Standard Pinout 15.24 mm (0.6 in.) DIP Leads on 2.54 mm (0.1 in.) Centers • Choice of ColorsAlGaAs Red, High Efficiency Red, Yellow, Green, Orange • Excellent Appearance Evenly Lighted Segments Mitered Corners on Segments Gray Package Gives Optimum Contrast±50° Viewing Angle • Design FlexibilityCommon Anode or Common CathodeSingle and Dual Digits Right Hand Decimal Point ±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display • High Light Output • High Peak Current• Excellent for Long Digit String Multiplexing • Intensity and Color Selection OptionSee Intensity and ColorSelected Displays Data Sheet • Sunlight Viewable AlGaAsDescriptionThe 14.2 mm (0.56 inch) LED seven segment displays aredesigned for viewing distances upto 7 metres (23 feet). Thesedevices use an industry standard size package and pinout. Both the numeric and ±1 overflow devices feature a right hand decimalpoint. All devices are available as either common anode or common cathode.Orange AlGaAs Red HERYellowGreen Package HDSP-HDSP-[1]HDSP-[1]HDSP-HDSP- DescriptionDrawingH401H151550157015601Common Anode Right Hand Decimal A H403H153550357035603Common Cathode Right Hand Decimal B H157550757075607Common Anode ±1. Overflow C H158550857085608Common Cathode ±1. OverflowD K401552157215621Two Digit Common Anode Right Hand DecimalE K403552357235623Two Digit Common Cathode Right Hand DecimalFDevicesNote:1. These displays are recommended for high ambient light operation. Please refer to the HDSP-H10X/K12X AlGaAs and HDSP-555X HER data sheet for low current operation.HDSP-K40x Series HDSP-550x Series HDSP-552x Series HDSP-560x Series HDSP-562x Series HDSP-570x Series HDSP-572x Series HDSP-H15x Series HDSP-H40x SeriesThese displays are ideal for most applications. Pin for pin equivalent displays are alsoavailable in a low current design.The low current displays are idealfor portable applications. For additional information see the Low Current Seven Segment Displays data sheet.Part Numbering SystemNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative for details.2. Bin options refer to shippable bins for a part number. Color and Intensity Bins are typically restricted to 1bin per tube (exceptions may apply). Please refer to respective datasheet for specific bin limit information.5082 -X X X X-X X X X X HDSP-X X X X-X X X X XMechanical Options [1]00: No Mechanical Option Color Bin Options [1,2]0: No Color Bin LimitationMaximum Intensity Bin [1,2]0: No Maximum Intensity Bin Limitation Minimum Intensity Bin [1,2]0: No Minimum Intensity Bin Limitation Device Configuration/Color [1]1: Common Anode 3: Common CathodeDevice Specific Configuration [1]Refer to Respective DatasheetPackage [1]H: 14.2 mm (0.56 inch) Single Digit Seven Segment DisplayFUNCTIONPIN AB CDEF1CATHODE e ANODE e CATHODE c ANODE cE CATHODE NO. 1 E ANODE NO. 12CATHODE d ANODE d ANODE c, d CATHODE c, d D CATHODE NO. 1 D ANODE NO. 13ANODE [3]CATHODE [4]CATHODE b ANODE bC CATHODE NO. 1 C ANODE NO. 14CATHODE c ANODE c ANODE a, b, DP CATHODE a, b, DP DP CATHODE NO. 1DP ANODE NO. 15CATHODE DP ANODE DP CATHOPDE DP ANODE DE E CATHODE NO. 1 E ANODE NO. 26CATHODE b ANODE b CATHODE a ANODE aD CATHODE NO. 2 D ANODE NO. 27CATHODE a ANODE a ANODE a, b, DP CATHODE a, b, DP G CATHODE NO. 2G ANODE NO. 28ANODE [3]CATHODE [4]ANODE c, d CATHODE c, d C CATHODE NO. 2 C ANODE NO. 29CATHODE f ANODE f CATHODE d ANODE d DP CATHODE NO. 2DP ANODE NO. 210CATHODE g ANODE g NO PINNO PINB CATHODE NO. 2 B ANODE NO. 211 A CATHODE NO. 2 A ANODE NO. 212 F CATHODE NO. 2 F ANODE NO. 213DIGIT NO. 2 ANODE DIGIT NO. 2 CATHODE 14DIGIT NO. 1 ANODE DIGIT NO. 1 CATHODE 15 B CATHODE NO. 1 B ANODE NO. 116 A CATHODE NO. 1 A ANODE NO. 117G CATHODE NO. 1G ANODE NO. 118F CATHODE NO. 1 F ANODE NO. 1NOTES:1. ALL DIMENSIONS IN MILLIMETRES (INCHES).2. ALL UNTOLERANCED DIMENSIONS ARE FOR REFERENCE ONLY.3. REDUNDANT ANODES.4. REDUNDANT CATHODES.5. FOR HDSP-5600/-5700 SERIES PRODUCT ONLY.Package DimensionsInternal Circuit DiagramNotes:1. See Figure 2 to establish pulsed conditions.2. Derate above 46°C at 0.54 mA/°C.3. See Figure 7 to establish pulsed conditions.4. Derate above 53°C at 0.45 mA/°C.5. See Figure 8 to establish pulsed conditions.HER/Orange HDSP-5500AlGaAs Red HDSP-H40x Yellow Green HDSP-H150HDSP-K40x HDSP-5700HDSP-5600 Description SeriesSeriesSeriesSeriesUnits Average Power per Segment or DP 9610580105mW Peak Forward Current per 160[1]90[3]60[5]90[7]mA Segment or DPDC Forward Current per Segment or DP 40[2]30[4]20[6]3018]mA Operating Temperature Range -20 to +100[9]-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment or DP 3.0V Lead Solder Temperature for 3 Seconds 260°C(1.60 mm [0.063 in.] below seating plane)Absolute Maximum Ratings6. Derate above 81°C at 0.52 mA/°C.7. See Figure 9 to establish pulsed conditions.8. Derate above 39°C at 0.37 mA/°C.9. For operation below -20°C, contact your local Agilent components sales office or an authorized distributor.Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2,5]I V9.116.0mcd I F = 20 mA(Digit Average)1.8I F = 20 mAForward Voltage/Segment or DP V F V2.03.0I F = 100 mAH15XPeak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin400°C/W/to-Pin SegHigh Efficiency RedDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions9002800I F = 10 mA Luminous Intensity/Segment[1,2,6]I Vµcd(Digit Average)3700I F = 60 mA Peak:1 of 6 dfForward Voltage/Segment or DP V F 2.1 2.5V I F = 20 mA 55XXPeak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin345°C/W/to-Pin SegYellowDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions6001800I F = 10 mA Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)2750I F = 60 mA Peak:1 of 6 dfForward Voltage/Segment or DP V F 2.1 2.5V I F = 20 mA 57XXPeak WavelengthλPEAK583nmDominant Wavelength[3,7]λd581.5586592.5nmReverse Voltage/Segment or DP[4]V R 3.040V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin345°C/W/to-Pin SegOrangeDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment I V 2.37mcd I F = 10 mA(Segment Average)[1,2]Forward Voltage/Segment or DP V F 2.1 2.5V I F = 20 mAPeak WavelengthλPEAK600nm H40x Dominant Wavelength[3]λd603nm I F = 10 mA K40x Reverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µA Temperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin345°C/W/to-Pin SegDeviceSeriesHDSP-ParameterSymbol Min.Typ.Max.UnitsTest Conditions 9002500I F = 10 mALuminous Intensity/Segment [1,2]I Vµcd(Digit Average)`3100I F = 60 mA Peak:1 of 6 df Forward Voltage/Segment or DPV F 2.1 2.5V I F = 10 mA56XXPeak Wavelength λPEAK 566nm Dominant Wavelength [3,7]λd 571577nm Reverse Voltage/Segment or DP [4]V R 3.050V I R = 100 µATemperature Coefficient of ∆V F /°C -2mV/°C V F /Segment or DPThermal Resistance LED Junction-R θJ-Pin345°C/W/to-PinSegHigh Performance GreenNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd , is derived from the CIE chromaticity diagram and is that single wavelength which defines the color of the device.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. For low current operation, the AlGaAs HDSP-H10X series displays are recommended. They are tested at 1 mA dc/segment and are pin for pin compatible with the HDSP-H15X series.6. For low current operation, the HER HDSP-555X series displays are recommended. They are tested at 2 mA dc/segment and are pin for pin compatible with the HDSP-550X series.7. The Yellow (HDSP-5700) and Green (HDSP-5600) displays are categorized for dominant wavelength. The category is designated by a number adjacent to the luminous intensity category letter.AlGaAs RedFigure 3. Maximum Allowable DC Current vs.Ambient Temperature.Figure 4. Forward Current vs.Forward Voltage.HER, Yellow, Green, OrangeFigure 7. Maximum Tolerable Peak Currentvs. Pulse Duration – HER, Orange.I D C M A X . – M A X I M U M D C C U R R E N T P E R S E G M E N T – m AT A – AMBIENT TEMPERATURE – °C 5030102051525354045I F – F O R W A R D C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 20 m A)I F – FORWARD CURRENT PER SEGMENT – mA204010305152535ηP E A K – N O R M A L IZ E D R E L A T I V E E F F I C I E N C YI PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA4550110120Figure 11. Forward Current vs.Forward Voltage.Figure 9. Maximum Tolerable PeakCurrent vs. Pulse Duration – Green.Figure 10. Maximum Allowable DC Current vs.Ambient Temperature.Figure 12. Relative LuminousIntensity vs. DC Forward Current.Figure 13. Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Current.Electrical/OpticalFor more information onelectrical/optical characteristics,please see Application Note 1005.Contrast EnhancementFor information on contrastenhancement please see Application Note 1015.Soldering/CleaningCleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from thechlorinated hydrocarbon family(methylene chloride, trichloro–ethylene, carbon tetrachloride,etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs please refer to Application Note 1027.I F – F O R W A R D C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 10 m A )I F – DC FORWARD CURRENT – mAηV – R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D T O 1 A T 10 m A P E R S E G ME N T )0.6I PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA902070801001.61.41.31.10.90.860504030100.71.01.21.5HDSP-H15x IV Bin Category Min.Max.K 9.2016.90L 13.8025.30M 20.7038.00N 31.1056.90O 46.6085.40Intensity Bin Limits (mcd)AlGaAs RedHDSP-550x/552x IV Bin Category Min.Max.E 0.91 1.67F 1.37 2.51G 2.05 3.76H 3.08 5.64I 4.628.64J 6.9312.70K 10.3919.04HERHDSP-570x/572xIV Bin Category Min.Max.D 0.61 1.11E 0.91 1.67F 1.37 2.51G 2.05 3.76H 3.08 5.64I 4.628.64J 6.9312.70K 10.3919.04YellowHDSP-560x/562x IV Bin Category Min.Max.E 0.91 1.67F 1.37 2.51G 2.05 3.76H 3.08 5.64I 4.618.46GreenColor CategoriesNote:All categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representatives for further clarification/information.10HDSP-H40x/K40x IV Bin Category Min.Max.B 0.77 1.17C 0.95 1.45D 1.19 1.82E 1.49 2.27F 1.85 2.89G 2.32 3.54H 2.904.43Orange元器件交易网元器件交易网/semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(408) 654-8675Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 271 2451India, Australia, New Zealand: (+65) 271 2394Japan: (+81 3) 3335-8152(Domestic/Interna-tional), or 0120-61-1280(Domestic Only)Korea: (+65) 271 2194Malaysia, Singapore: (+65) 271 2054Taiwan: (+65) 271 2654Data subject to change.Copyright © 2002 Agilent Technologies, Inc.Obsoletes 5988-0383ENJanuary 17, 20025988-4273EN。

HDS NAS介绍

高性能NAS平台
价格
Essential NAS
2000 2000近线性
用于文件服务器、整合、文件共享和备份的标准解决方案
3100
1100c
1300c
1500c
性能
5
3200
价格
Essential NAS Platform 设备型号
• 现场升级能力 • 可从以前的产品升级
所有的指标基于双节点集群:
Accounts
IP Network LAN
Exchange Server
DB Server
NAS
SAN
FC Backup
IP FC
3
减少或消除部门内部的服务器和存储设备
SW Development
减少或消除部门内部的服务器和存储设备
Engineering
减少或消除部门内部的服务器和存储设备
Sales
25
ProtecTIER 设备架构概述
“它是一个磁带库，同时也是一个磁带驱动器”
Virtual Tape Library Appliance
集成的服务器和磁盘存储系统
光纤通道
备份服务器
ProtecTIER 应用程序
• 模拟磁带库单元，包括驱动器、磁带盒和机械臂 • 使用光纤通道 ( FC) 连接的磁盘存储系统作为备份介质
• 中等级别业务, 远程办公室，大型企业
• 为文件共享，备份和整合提供方案
• 适用于对性能和扩展能力 NAS Platform • 企业及产品，具有高级功能
• 企业级大型环境, 对性能要求高的场合
• 为整合, 高性能的企业应用提供解决方案
• 适用于对性能和扩展能力要求非常高的场合

HDSP-076X资料

Package DimensionsZAbsolute Maximum RatingsDescription Symbol Min.Max.Unit Storage Temperature, Ambient T S-65+100°C Operating Temperature, Ambient[1]T A-55+85°C Supply Voltage[2]V CC-0.5+7.0V Voltage Applied to Input Logic, dp and Enable Pins V I, V DP, V E-0.5V CC V Voltage Applied to Blanking Input[2]V B-0.5V CC V Maximum Solder Temperature at 1.59 mm (0.062 inch)260°C Below Seating Plane, t ≤ 5 secondsRecommended Operating ConditionsDescription Symbol Min.Nom.Max.Unit Supply Voltage[2]V CC 4.5 5.0 5.5V Operating Temperature, Ambient[1]T A-55+85°C Enable Pulse Width t W100nsec Time Data Must Be Held Before Positive t SETUP50nsec Transition of Enable LineTime Data Must Be Held After Positive t HOLD50nsec Transition of Enable LineEnable Pulse Rise Time t TLH 1.0msec Optical Characteristics at T A = 25°C, V CC = 5.0 VNotes:1. The nominal thermal resistance of a display mounted in a socket that is soldered onto a printed circuit board is RθJA = 50°C/W/device. The device package thermal resistance is RθJ-PIN = 15°C/W/device. The thermal resistance device pin-to-ambient through the PC board should not exceed 35°C/W/device for operation at T A = +85°C.2. Voltage values are with respect to device ground, pin 6.3. These displays are categorized for luminous intensity with the intensity category designated by a letter code located on the back ofthe display package. Case temperature of the device immediately prior to the light measurement is equal to 25°C.Electrical Characteristics; T A = -55°C to +85°CNotes:4. The luminous intensity at a specific operating ambient temperature, I V (T A ) may be approximated from the following exponential equation: I (T = I (25°C) e [k (T - 25°C)].d device.6. The HDSP-0860 and HDSP-0960 series devices are categorized as to dominant wavelength with the category designated by a number on the back of the display package.7. All typical values at V CC = 5.0 V and T A = 25°C.AOperational ConsiderationsElectricalThese devices use a modified4x7 dot matrix light emitting diode to display decimal/hexa-decimal numeric information. The high efficiency red and yellow LEDs are GaAsP epitaxial layer on a GaP transparent substrate. The green LEDs are GaP epitaxial layer on a GaP transparent substrate. The LEDs are driven by constant current drivers, BCD information is accepted by the display memory when the enable line is at logic low and the data is latched when the enable is at logic high. Using the enable pulse width and data setup and hold times listed in the Recommended Operating Conditions allows data to be clocked into an array of displays at a 6.7 MHz rate.The decimal point input is activelow true and this data is latchedinto the display memory in thesame fashion as the BCD data.The decimal point LED is drivenby the on-board IC.The blanking control input on thehexadecimal displays blanks (turnsoff) the displayed informationwithout disturbing the contents ofdisplay memory. The display isblanked at a minimum thresholdlevel of 2.0 volts. When blanked,the display standby power isnominally 250 mW at T A = 25°C.MechanicalThe primary thermal path forpower dissipation is through thedevice leads. Therefore, to insurereliable operation up to anambient temperature of +85°C, itis important to maintain a case-to-ambient thermal resistance ofless than 35°C watt/device asmeasured on top of display pin 3.For information on soldering andpost solder cleaning see Applica-tion Note 1027, Soldering LEDComponents.Contrast EnhancementThese display devices aredesigned to provide an optimumON/OFF contrast when placedbehind an appropriate contrastenhancement filter. For furtherinformation, please refer toApplication Note 1015, ContrastEnhancement Techniques forLED Displays.Over Range DisplayThe over range devices display“±1” and decimal point. Thecharacter height and packageconfiguration are the same as thenumeric and hexadecimaldevices. Character selection isobtained via external switchingtransistors and current limitingresistors.Package DimensionsNotes:0: Line switching transistor in Figure 7 cutoff.1: Line switching transistor in Figure 7 saturated.X: 'don't care'Absolute Maximum RatingsDescriptionSymbol Min.Max.Unit Storage Temperature, Ambient T S-65+100°C Operating Temperature, Ambient T A -55+85°C Forward Current, Each LED I F 10mA Reverse Voltage, Each LEDV R5VLuminous Intensity per LED[3,4]Figure 3. Typical Driving Circuit.Electrical Characteristics: T= -55°C to +85°CNote:Test conditions as specified in Optical Characteristic table.Intensity Bin Limits for HDSP-0760Note:Test conditions as specified in Optical Characteristic table.Intensity Bin Limits for HDSP-0770Intensity Bin Limits for HDSP-0860Note:Test conditions as specified in Optical Characteristic table.Intensity Bin Limits for HDSP-0960Note:Test conditions as specified in Optical Characteristic table.Color Bin LimitsNote:Test conditions as specified in Optical Characteristic table.Data subject to change.Copyright © 2001 Agilent Technologies, Inc.June 15, 2001Obsoletes 5963-7395E (11/99)5988-2260EN。

HQxxxx-xxx-3AA中文资料

HQ SeriesSPECIFICATIONS STANDARD*SPECIAL ELECTRICALCenter Frequency (Fc)100 to 1000 Mhz80 to 1400 MHz 3dB Relative Bandwidth (% of FC) 4 to 40 4 to 50 Number of Sections Available 3 to 8 2 to 10 Nominal Impedance50 Ohms50 to 75 Ohms Maximum Insertion Loss See Curve See Curve Maximum VSWR 1.5/1 1.3/1 Attenuation in the Stopband See Graph See GraphMaximum Input Power (Average)(Watts to10,000 ft.)500 x 3dB BW (MHz)(Loss Factor)(Fc MHz)See StandardMaximum Input Power (Peak)(Watts to10,000 ft.)300 x 3dB BW (MHz)Fc (MHz)2,000ENVIRONMENTALShock15 G's25 G's Vibration 5 G's10 G's Humidity90% relative100% relativeINSERTION LOSS:The Maximum Insertion Loss at center frequency is equal to :LF x (N + 0.5) / % 3 dB BW + 0.2 Where:LF= Loss Factor, N= Number of Sections% 3dB BW:3dB BW (MHz) x 100divided byCenter Frequency (MHz) Example:A 3 section HQ with a center frequency of 400 MHz and a 3dB BW of 40 MHz would have,1.5 x 3.5 / 10 = 5.25 / 10 = 0.525 0.525 + 0.2 = 0.8 dBConnectors Available on HQ Series:Lark Code Type C DIM.Inches & MMLarkCodeType C DIM.Inches & MMA SMA JACK.800 & 20.3G N JACK 1.625 & 41.3B SMA PLUG.855 & 22.5H N PLUG 1.585 & 40.3C TNC JACK 1.350 & 34.3L SOLDER MPINAXIAL.625 & 15.9D TNC PLUG 1.280 & 32.5*M SOLDER PINRADIAL.625 & 15.9E BNC JACK 1.350 & 34.3S SPECIALF BNC PLUG 1.280 & 32.5*Not recommended for use with this series.LENGTH:The approximate length of a Lark HQ series filter can be determined by the formula:( 0.5 N + 2 / %BW ) x LC = LWhere N is the number of sections used, % BW is:3dB BW (MHz) x 100divided byCENTER FREQUENCY (MHz)LC is the length constant at the specified center frequency, L is the dimension between theconnectors; C1 and C2 are the connector lengths as shown above. All of the length information given here is approximate. Exact length specifications must be quoted by the factory. If a special length is needed,please submit all of your requirements - both electrical and mechanical. This will enable Lark Engineering to quote the optimum design for your application.Example:A 3 section HQ with a center frequency of 400 MHz a 3dB BW of 40 MHz and SMA jack input and output connectors would be:(1.5 + 0.2) x 1.38 = 2.35 + C1 + C2In most cases, the L dimension is rounded to the nearest 1/4 inch which in this instance would be 2.25inches and the O.A.L. is:2.25 + .800 + .800 =3.85 inches.To convert inches to millimeters multiply x 25.40.Lark Engineering HQ SERIES元器件交易网STOPBAND ATTENUATIONThe graph on the following pages defines the normal specification limits on attenuation Lark bandpass filter series HP, HQ, SF, and SM. The minimum level of attenuation in dB is shown as a "number of 3dB bandwidths from center frequency".Since the frequency characteristics vary for differing bandwidths, it is necessary to establishspecifications for each bandwidth of filter. The different graphs represent various 3dB percentage bandwidths. Intermediate values should be interpolated. The 3dB percentage bandwidth is defined asfollows:STOPATT5.HTM元器件交易网As the 3dB bandwidth is exactly 10% of the center frequency, the answer can be read directly from the 10% graph. Using the 5 section curve at the point -1.5 (255 MHz) we find the minimum level of attenuation is 36dB. At +1.6 (348 MHz) the minimum level of attenuation is 48dB.For special requirements, please contact our Application Engineering Department.STOPBAND ATTENUATIONSTOPBAND ATTENUATIONSTOPATT5.HTM元器件交易网STOPBAND ATTENUATIONSTOPBAND ATTENUATIONSTOPBAND ATTENUATION。

HDSP-207资料

10 mm (0.40 inch) Seven Segment DisplaysTechnical DataFeatures• Industry Standard Size• Industry Standard Pinout 7.6 mm (0.3 inch) DIP Single 15.24 mm (0.6 inch) DIP Dual Leads on 2.54 mm(0.1 inch) Centers• Choice of ColorsRed, AlGaAs Red, High Efficiency Red, Orange, Yellow, Green• Excellent Appearance Evenly Lighted Segments Mitered Corners on Segments Gray Package Gives Optimum Contrast±50° Viewing Angle • Design FlexibilityCommon Anode orCommon CathodeSingle and Dual DigitsRight Hand Decimal Point±1. Overflow Character• Categorized for LuminousIntensityYellow and Green Categorizedfor ColorUse of Like Categories Yields aUniform Display• High Light Output• High Peak Current• Excellent for Long DigitString MultiplexingHDSP-F00x SeriesHDSP-F15x SeriesHDSP-F20x SeriesHDSP-F30x SeriesHDSP-F40x SeriesHDSP-F50x SeriesHDSP-G00x SeriesHDSP-G15x SeriesHDSP-G20x SeriesHDSP-G30x SeriesHDSP-G40x SeriesHDSP-G50x Series• Intensity and ColorSelection Option• Sunlight Viewable AlGaAsAlGaAs Red Red[1]HER Orange Yellow Green PackageHDSP-HDSP-HDSP-HDSP-HDSP-HDSP-Description DrawingF001F151F201F401F301F501Common Anode Right Hand Decimal AF003F153F203F403F303F503Common Cathode Right Hand Decimal BF007F157F207F407F307F507Common Anode ±1. Overflow CF008F158F208F408F308F508Common Cathode ±1. Overflow DG001G151G201G401G301G501Two Digit Common AnodeRight Hand Decimal E G003G153G203G403G303G503Two Digit Common CathodeRight Hand Decimal F DevicesNote:1. These displays are recommended for high ambient light operation. Please refer to the HDSP-F10X data sheet for low currentoperation.元器件交易网DescriptionThe 10 mm (0.40 inch) LED seven segment displays are Agilent’s most space-efficient character size. They are designed for viewing distances up to 4.5metres (15 feet). These devicesuse an industry standard sizepackage and pinout. The dualnumeric, single numeric, and ±1.overflow devices feature a righthand decimal point. All devicesare available as either commonanode or common cathode.Typical applications includeinstruments, point of saleterminals, and appliances.Package DimensionsInternal Circuit DiagramHOLE PATTERN FOR PCB LAYOUT TO ACHIEVE UNIFORM 0.450 IN. DIGIT TO DIGIT PITCH. FOR HDSP-FXXX TO HDSP-GXXX.Electrical/Optical Characteristics at T A = 25°C Absolute Maximum RatingsRed AlGaAs Red HER/Orange Yellow Green HDSP-HDSP-HDSP-HDSP-HDSP-F00X/G00X F15X/G15X F20X/G20X/F30X/G30X F50X/G50X DescriptionSeriesSeriesG40X SeriesSeriesSeriesUnits Average Power per Segment or DP 829610580105mW Peak Forward Current per 150[1]160[3]90[7]60[7]90[9]mA Segment or DPDC Forward Current per 25[2]40[4]30[6]20[8]30[10]mA Segment or DPOperating Temperature Range -40 to +100-20 to +100[11]-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per 3.0VSegment or DPLead Solder Temperature for 3Seconds (1.59 mm [0.63 in.]260°Cbelow seating plane)Notes:1. See Figure 1 to establish pulsed conditions.2. Derate above 80°C at 0.63 mA/°C.3. See Figure 2 to establish pulsed conditions.4. Derate above 46°C at 0.54 mA/°C.5. See Figure 7 to establish pulsed conditions.6. Derate above 53°C at 0.45 mA/°C.7. See Figure 8 to establish pulsed conditions.8. Derate above 81°C at 0.52 mA/°C.9. See Figure 9 to establish pulsed conditions.10. Derate above 39°C at 0.37 mA/°C.11. For operation below -20°C, contact your local Agilentcomponents sales office or an authorized distributor.Device SeriesParameterSymbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment [1,2]I V 6501200µcdI F = 20 mA (Digit Average)Forward Voltage/Segment or DPV F 1.6 2.0V I F = 20 mAHDSP-Peak Wavelength λPEAK 655nm F00X/G00XDominant Wavelength [3]λd 640nm Reverse Voltage/Segment or DP [4]V R 3.012V I F = 100 µATemperature Coefficient of ∆V F /°C -2mV/°CV F /Segment or DP Thermal Resistance LED R θJ-PIN320°C/W/SegJunction-to-PinRedAlGaAs RedDeviceSeries Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2,5]I V7.515.0mcd I F = 20 mA(Digit Average)Forward Voltage/Segment or DP V F 1.8 2.2V I F = 20 mA HDSP-Peak WavelengthλPEAK645nmF15X/G15X Dominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN320°C/W/SegJunction-to-PinHigh Efficiency RedDeviceSeries Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]I V4201200µcd I F = 5 mA(Digit Average)Forward Voltage/Segment or DP V F 2.0 2.5V I F = 20 mA HDSP-Peak WavelengthλPEAK635nmF20X/G20X Dominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN320°C/W/SegJunction-to-PinOrangeYellowDevice SeriesParameterSymbolMin.Typ.Max.Units Test Conditions Luminous Intensity/Segment [1,2]290800µcdI F = 5 mA(Digit Average)I V Forward Voltage/Segment or DPV F 2.2 2.5V I F = 20 mAHDSP-Peak Wavelength λPEAK 583nm F30X /G30XDominant Wavelength [3,6]λd 581.5586592.5nm Reverse Voltage/Segment or DP [4]V R 3.040V I R = 100 µA Temperature Coefficient of ∆V F /°C -2mV/°CV F /Segment or DP Thermal Resistance LED R θJ-PIN320°C/W/SegJunction-to-PinDevice SeriesParameterSymbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment [1,2]I V 4201200µcdI F = 5 mA(Digit Average)Forward Voltage/Segment or DPV F 2.0 2.5V I F = 20 mAPeak Wavelength l PEAK 600nm Dominant Wavelength [3]l d 603nm Reverse Voltage/Segment or DP [4]V R 3.030V I R = 100 µATemperature Coefficient of ∆V F /°C -2mV/°CV F /Segment or DP Thermal Resistance LED Rl\q J-PIN320°C/W/SegJunction-to-PinHDSP-F40X/G40XHigh Performance GreenDevice Test Series Parameter Symbol Min.Typ.Max.Units Conditions Luminous Intensity/Segment[1,2]I V10303500µcd I F = 10 mA(Digit Average)Forward Voltage/Segment or DP V F 2.1 2.5V I F = 10 mA HDSP-Peak WavelengthλPEAK566nmF50X/G50X Dominant Wavelength[3,6]λd571577nmReverse Voltage/Segment or DP[4]V R 3.050V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN320°C/W/SegJunction-to-PinNotes:1. Case temperature of device immediately prior to the intensity measurement is 25°C.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is that single wavelength which defines the color ofthe device.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. For low current operation, the AlGaAs HDSP-F10X, G10X series displays are recommended. They are tested at 1 mAdc/segment and are pin for pin compatible with the HDSP-F15X/G15X series.6. The Yellow (HDSP-F30X/G30X) series and Green (HDSP-F50X/G50X) series displays are categorized for dominant wavelength. Thecategory is designated by a number adjacent to the luminous intensity category letter.Figure 1. Maximum Tolerable Peak Current vs. Pulse Duration – Red.Figure 5. Relative Luminous Intensity vs. DC Forward Current.Figure 6. Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Current.RED, AlGaAs RedHER, Orange, Yellow, GreenFigure 7. Maximum Tolerable Peak Current vs.Pulse Duration – HER, Orange.Figure 8. Maximum Tolerable Peak Current vs. Pulse Duration – Yellow.元器件交易网元器件交易网Data subject to change.Copyright © 1999 Agilent Technologies, Inc.Obsoletes 5952-3428 (11/90)5963-7393E (11/99)。

HDSP-2133资料

DevicesHigh HighEfficiency Performance Yellow RedGreen Orange HDSP-2131HDSP-2132HDSP-2133HDSP-2179DescriptionThe HDSP-2131 (yellow), HDSP-2179 (orange),HDSP-2132 (high efficiency red) and the HDSP-2133(green) are eight-digit, 5 x 7 dot matrix, alphanu-meric displays. The 5.0 mm (0.2 inch) high characters are packaged in a standard 7.64 mm (0.30 inch) 32pin DIP. The on-board CMOS IC has the ability to decode 128 ASCII characters, which are permanently stored in ROM. In addition, 16 programmable symbols may be stored in an on-board RAM. Seven brightness levels provide versatility in adjusting the display intensity and power consumption. The HDSP-213x and HDSP-2179 are designed for stan-dard microprocessor interface techniques. The display and special features are accessed through a bidirectional eight-bit data bus. These features make the HDSP-213x and HDSP-2179 ideally suited for applications where a hermetic, low power alpha-numeric display is required.Features•Wide operating temperature range -55°C to +85°C •Smart alphanumeric display – On-board CMOS IC – Built-in RAM – ASCII decoder – LED drive circuitry •128 ASCII character set •16 user definable characters •Programmable features– Individual character flashing – Full display blinking– Multi-level dimming and blanking – Self test– Clear function•Read/write capability •Full TTL compatibility•HDSP-2131/-2133/-2179 useable in night vision lighting applications•Categorized for luminous intensity •HDSP-2131/2133 categorized for color •Excellent ESD protection •Wave solderable •X-Y stackable •RoHS compliantHDSP-2131, HDSP-2132, HDSP-2133, HDSP-2179Eight Character 5.0 mm (0.2 inch) Glass/Ceramic Intelligent 5x7 Alphanumeric Displays for Military ApplicationsData SheetPackage Dimensions1. ALL DIMENSIONS ARE IN mm (INCHES).2. UNLESS OTHERWISE SPECIFIED, TOLERANCE IS ± 0.30 mm (0.015 INCH).3. FOR GREEN AND YELLOW DEVICES ONLY.4. LEADS ARE COPPER ALLOY, SOLDER DIPPED.Absolute Maximum RatingsSupply Voltage, V DD to Ground[1]-0.3 to 7.0 VOperating Voltage, V DD to Ground 5.5 VInput Voltage, Any Pin to Ground-0.3 to V DD +0.3 VFree Air Operating Temperature Range, T A-55°C to +85°CStorage Temperature, T S-55°C to +100°CCMOS IC Junction Temperature, T J (IC)+150°CSoldering Temperature [1.59 mm (0.063 in.) Below Body]Solder Dipping260°C for 5 secsWave Soldering250°C for 3 secsESD Protection @ 1.5 kΩ, 100 pF V Z = 4 kV (each pin)Notes:1. Maximum voltage is with no LEDs illuminated.2. 20 dots ON in all locations at full brightness.ESD WARNING: STANDARD CMOS HANDLING PRECAUTIONS SHOULD BE OBSERVED WITH THE HDSP-2131, HDSP-2132, HDSP-2133, AND HDSP-2179.Character SetRecommended Operating ConditionsParameter Symbol Minimum Nominal Maximum UnitsSupply Voltage V DD 4.5 5.0 5.5VElectrical Characteristics over Operating Temperature Range4.5 < V DD <5.5 V (unless otherwise specified)25°C25°CParameter Symbol Min.Typ.[1]Max.[1]Max.[2]Units Test Conditions Input Leakage I I-10.0+10.0µA V IN = 0 to V DD, (Input without Pullup)pins CLK, D0-D7,A0-A4Input Current I IP-30.0111830µA V IN = 0 to V DD, (Input with Pullup)pins RST, CLS, WR,RD, CE, FLI DD Blank I DD (BLK)0.5 1.5 2.0mA V IN = V DDI DD 8 digits I DD(V)200255330mA"V" on in all 812 Dots/Character[3]locationsI DD 8 digits I DD(#)300370430mA"#" on in all 820 Dots/Character[3]locationsInput Voltage High V IH 2.0V DD V V DD = 5.5 V+0.3Input Voltage Low V IL GND0.8V V DD = 4.5 V-0.3 VOutput Voltage High V OH 2.4V V DD = 4.5 V,I OH = -40 µA Output Voltage Low V OL0.4V V DD = 4.5 V,D0-D7I OL = 1.6 mA Output Voltage Low0.4V V DD = 4.5 V,CLK I OL = 40 µA Thermal Resistance R q J-PIN11°C/WIC Junction-to-PINNotes:1.V DD = 5.0 V.2.Maximum I DD occurs at -55°C.3.Average I DD measured at full brightness. See Table 2 in Control Word Section for I DD at lower brightness levels. Peak I DD = 28/15 x Average I DD (#).Optical Characteristics at 25°C[4]V DD = 5.0 V at Full BrightnessHigh Efficiency Red HDSP-2132Description Symbol Minimum Typical Units Luminous Intensity Character Average (#)I V 2.57.5mcd Peak Wavelength l PEAK635nm Dominant Wavelength l d626nmOrange HDSP-2179Description Symbol Minimum Typical Units Luminous Intensity Character Average (#)I V 2.57.5mcd Peak Wavelength l PEAK600nm Dominant Wavelength l d602nmYellow HDSP-2131Description Symbol Minimum Typical Units Luminous Intensity Character Average (#)I V 2.57.5mcd Peak Wavelength l PEAK583nm Dominant Wavelength l d585nmHigh Performance Green HDSP-2133Description Symbol Minimum Typical Units Luminous Intensity Character Average (#)I V 2.57.5mcd Peak Wavelength l PEAK568nm Dominant Wavelength l d574nmNote:4.Refers to the initial case temperature of the device immediately prior to the light measurement.DDReferenceNumber Symbol Description Min.[1]Units1t ACC Display Access TimeWrite210Read230ns2t ACS Address Setup Time to Chip Enable10ns3t CE Chip Enable Active Time[2,3]Write140Read160ns4t ACH Address Hold Time to Chip Enable20ns5t CER Chip Enable Recovery Time60ns6t CES Chip Enable Active Prior to Rising Edge of[1,2]Write140Read160ns7t CEH Chip Enable Hold Time to Rising Edge ofRead/Write Signal[2,3]0ns8t W Write Active Time100ns9t WD Data Valid Prior to Rising Edge of Write Signal50ns10t DH Data Write Hold Time20ns11t R Chip Enable Active Prior to Valid Data160ns12t RD Read Active Prior to Valid Data75ns13t DF Read Data Float Delay10ns–t RC Reset Active Time300nsNotes:1.Worst case values occur at an IC junction temperature of 150°C.2.For designers who do not need to read from the display, the Read line can be tied to V DD and the Write and Chip Enable lines can be tied together.3.Changing the logic levels of the Address lines when CE = “0” may cause erroneous data to be entered into the Character RAM, regardless of the4.The display must not be accessed until after 3 clock pulses (110 µs min. using the internal refresh clock) after the rising edge of the reset line.DDSymbol Description25°C Typical Minimum[1]Units F OSC Oscillator Frequency5728kHz F RF Display Refresh Rate256128HzF FL Character Flash Rate21Hzt ST[7]Self Test Cycle Time 4.69.2Sec Notes:5.F RF = F OSC/224.6.F FL = F OSC/28,672.7.t ST = 262,144/F OSC.Write Cycle Timing DiagramINPUT PULSE LEVELS: 0.6 V to 2.4 VRead Cycle Timing DiagramCharacter FontRelative Luminous Intensity vs. TemperatureINPUT PULSE LEVELS: 0.6 V to 2.4 VOUTPUT REFERENCE LEVELS: 0.6 V to 2.2 V OUTPUT LOADING = 1 TTL LOAD AND 100 pFNOTE: NOT TO SCALETYP.R E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 25°C )-550T A – AMBIENT TEMPERATURE – °C85-15651054.03.53.02.01.51.00.5254552.5-35Electrical DescriptionPin Function DescriptionRESET (RST, Pin 5)Reset initializes the display.FLASH (FL, Pin 27)FL low indicates an access to the Flash RAM and is unaffected by thestate of address lines A3-A4.ADDRESS INPUTS Each location in memory has a distinct address. Address inputs (A0-A2)(A0-A4, Pins 28-32)select a specific location in the Character RAM, the Flash RAM or aparticular row in the UDC (User-Defined Character) RAM. A3-A4 are used toselect which section of memory is accessed. Table 1 shows the logic levelsneeded to access each section of memory.Table 1. Logic Levels to Access MemoryFL A4A3Section of Memory A2A1A00X X Flash RAM Character Address100UDC Address Register Don't Care101UDC RAM Row Address110Control Word Register Don't Care111Character RAM Character AddressCLOCK SELECT This input is used to select either an internal (CLS = 1) or external (CLS, Pin 1)(CLS = 0) clock source.CLOCK INPUT/OUTPUT Outputs the master clock (CLS = 1) or inputs a clock (CLS = 0) for slave (CLK, Pin 2)displays.WRITE (WR, Pin 3)Data is written into the display when the WR input is low and the CE inputis low.CHIP ENABLE (CE, Pin 4)This input must be at a logic low to read or write data to the display andmust go high between each read and write cycle.input is low.DATA Bus (D0-D7,The Data bus is used to read from or write to the display.Pins 11-14, 19-22)GND(SUPPLY) (Pin 17)This is the analog ground for the LED drivers.GND(LOGIC) (Pin 18)This is the digital ground for internal logic.V DD(POWER) (Pin 16)This is the positive power supply input.F i g u r e 1. H D S P -213x /-2179 i n t e r n a l b l o c k d i a g r a m .11eight 5 x 7 dot matrixcharacters. The major user accessible portions of the dis-play are listed below:ASCII decoder, a 16 character UDC RAM, a UDC Address Register, a Control Word Register, and the refreshcircuitry necessary to synchron-ize the decoding and driving ofCharacter RamFigure 2 shows the logic levels needed to access the HDSP-213x/-2179 Character RAM. During a normal access the CE = “0” and either RD = “0” or WR = “0”.However, erroneous data may be written into the Character RAM if the Address lines are unstable when CE = “0” regardless of the logic levels of the RD or WR lines.Address lines A 0-A 2 are used to select the location in the Charac-ter RAM. Two types of data can be stored in each Character RAM location: an ASCII code or a UDC RAM address. Data bit D 7 is used to differentiate between an ASCII character and a UDC RAMaddress. D 7 = 0 enables the ASCII decoder and D 7 = 1 enables the UDC RAM. D 0-D 6 are used to input ASCII data and D 0-D 3 are used to input a UDC address.Figure 2. Logic levels to access the character RAM.Display Internal Block DiagramFigure 1 shows the internal block diagram of the HDSP-213x/-2179display. The CMOS IC consists of an 8 byte Character RAM, an 8bit Flash RAM, a 128 characterCharacter RAM This RAM stores either ASCII character data or a UDC RAM address.Flash RAMThis is a 1 x 8 RAM which stores Flash data.User-Defined Character RAM This RAM stores the dot pattern for custom characters.(UDC RAM)User-Defined Character This register is used to provide the address to the UDC RAM when the user is writing or Address Registerreading a custom character.(UDC Address Register)Control Word RegisterThis register allows the user to adjust the display brightness, flash individual characters, blink, self test, or clear the display.CE FL A 4A 3A 2A 1A 0RST WR RD CHARACTER ADDRESSSYMBOL IS ACCESSED IN LOCATIONSPECIFIED BY THE CHARACTER ADDRESS ABOVE 0100011111011UNDEFINEDCONTROL SIGNALSCHARACTER RAM ADDRESSCHARACTER RAM DATA FORMATWRITE TO DISPLAY READ FROM DISPLAY UNDEFINED000 = LEFT MOST 111 = RIGHT MOSTD 7D 6D 5D 4D 3D 2D 1D 00128 ASCII CODEXXXUDC CODE1DISPLAY0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CAREDIG 0DIG 1DIG 2DIG 3DIG 4DIG 5DIG 6DIG 7001010011100101110111000UDC RAM and UDC Address Register Figure 3 shows the logic levels needed to access the UDC RAM and the UDC Address Register. The UDC Address Register is eight bits wide. The lower four bits (D0-D3) are used to select one of the 16 UDC locations. The upper four bits (D4-D7) are not used. Once the UDC address has been stored in the UDC Address Register, the UDC RAM can be accessed.To completely specify a 5 x 7 character requires eight write cycles. One cycle is used to store the UDC RAM address in the UDC Address Register. Seven cycles are used to store dot data in the UDC RAM. Data is entered by rows. One cycle is needed to access each row. Figure 4 shows the organization of a UDC character assuming the symbol to be stored is an “F.” A0-A2 are used to select the row to be accessed and D0-D4 are used to transmit the row dot data. The upper three bits (D5-D7) are ignored. D0 (least significant bit) corresponds to the right most column of the 5 x 7 matrix and D4 (most significant bit) corresponds to the left most column of the 5 x 7 matrix.Flash RAMFigure 5 shows the logic levels needed to access the Flash RAM. The Flash RAM has one bit associated with each location of the Character RAM. The Flash input is used to select the Flash RAM. Address lines A3-A4 are ignored. Address lines A0-A2 are used to select the location in the Flash RAM to store the attribute. D0 is used to store or remove the flash attribute. D0 = “1” stores the attribute and D0 = “0” removes the attribute.When the attribute is enabledthrough bit 3 of the Control Word and a "1" is stored in the Flash RAM, the corresponding character will flash at approximately 2 Hz.The actual rate is dependent onthe clock frequency. For anexternal clock the flash rate canbe calculated by dividing the clockfrequency by 28,672.Figure 4. Data to load “F” into the UDC RAM.Figure 3. Logic levels to access a UDC character.CEFL A4A3A2A1A0RST WR RD100011001X X X11UNDEFINEDCONTROL SIGNALSUDC ADDRESS REGISTER ADDRESSUDC ADDRESS REGISTER DATA FORMATWRITE TO DISPLAYREAD FROM DISPLAYUNDEFINED000 = ROW 1110 = ROW 7D7D6D5D4D3D2D1D0X UDC CODEX X XFL A4A3A2A1A0011ROW SELECTUDC RAM ADDRESSUDC RAM C CDATA FORMAT O OL L1 50 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CARED7D6D5D4D3D2D1D0X DOT DATAX XCERST WR RD100011011UNDEFINEDCONTROL SIGNALSWRITE TO DISPLAYREAD FROM DISPLAYUNDEFINEDC C C C CO O O O OL L L L L1 2 3 4 5D4D3D2D1D0UDC CHARACTER HEX CODE1 1 1 1 1 ROW 1 •••••1F1 0 0 0 0 ROW2 •101 0 0 0 0 ROW 3 •101 1 1 1 0 ROW 4 ••••1D1 0 0 0 0 ROW 5 •101 0 0 0 0 ROW 6 •101 0 0 0 0 ROW 7 •10IGNORED0 = LOGIC 0; 1 = LOGIC 1; * = ILLUMINATED LED1213Control Word RegisterFigure 6 shows how to access the Control Word Register. This is an eight bit register which performs five functions. They are Bright-ness control, Flash RAM control,Blinking, Self Test and Clear.Each function is independent of the others. However, all bits are updated during each Control Word write cycle.Brightness (Bits 0-2)Bits 0-2 of the Control Word adjust the brightness of the display. Bits 0-2 are interpreted as a three bit binary code with code (000) corresponding to maximum brightness and code (111) corresponding to a blanked display. In addition to varying the display brightness, bits 0-2 also vary the average value of I DD . I DD can be calculated at any bright-ness level by multiplying the percent bright-ness level by the value of I DD at the 100%brightness level. These values of I DD are shown in Table 2.Flash Function (Bit 3)Bit 3 determines whether the flashing character attribute is on or off. When bit 3 is a “1,” the output of the Flash RAM ischecked. If the content of a loca-tion in the Flash RAM is a “1,” the associated digit will flash at approximately 2 Hz. For anexternal clock, the blink rate can be calculated by driving the clock frequency by 28,672. If the flash enable bit of the Control Word is a “0,” the content of the Flash RAM is ignored. To use this function with multiple display systems see the Reset section.Blink Function (Bit 4)Bit 4 of the Control Word is used to synchronize blinking of all eight digits of the display. When this bit is a “1” all eight digits of the display will blink at approxi-mately 2 Hz. The actual rate is dependent on the clock frequency.For an external clock, the blink rate can be calculated by dividing the clock frequency by 28,672.This function will override the Flash function when it is active.To use this function with multiple display systems see the Reset section.Figure 5. Logic levels to access the flash RAM.Figure 6. Logic levels to access the control word register.Table 2. Current Requirements at Different Brightness Levels Symbol D 2D 1D 0% Brightness 25°C Typ.Units I DD (V)000100200mA 00180160mA 01053106mA 0114080mA 1002754mA 1012040mA 111326mACE FL A 4A 3A 2A 1A 0RST WR RD 0100011XX011UNDEFINEDREMOVE FLASH ATSPECIFIED DIGIT LOCATION STORE FLASH ATSPECIFIED DIGIT LOCATIONCONTROL SIGNALS FLASH RAM ADDRESS FLASH RAM DATA FORMAT0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CAREWRITE TO DISPLAY READ FROM DISPLAY UNDEFINEDD 7D 6D 5D 4D 3D 2D 1D 0XXXXXXX01CHARACTER ADDRESS000 = LEFT MOST 111 = RIGHT MOSTFL A 4A 3A 2A 1A 001000111XXX1011UNDEFINEDCONTROL SIGNALSCONTROL WORD ADDRESSCONTROL WORD DATA FORMAT0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CARE0 DISABLE FLASH 1 ENABLE FLASH BRIGHTNESS CONTROL LEVELS 0 DISABLE BLINKING 1 ENABLE BLINKING0 NORMAL OPERATION1 CLEAR FLASH AND CHARACTER RAMS 0 X NORMAL OPERATION; X IS IGNORED 1 X START SELF TEST; RESULT GIVEN IN X X = 0 FAILED X = 1 PASSED WRITE TO DISPLAY READ FROM DISPLAY UNDEFINEDD 7D 6D 5D 4D 3D 2D 1D 0CSSBLFB000100%00180%01053%01110010120%11013%1110%BBSelf Test Function (Bits 5, 6)Bit 6 of the Control Word Register is used to initiate the self test function. Results of the internal self test are stored in bit 5 of the Control Word. Bit 5 is a read only bit where bit 5 = “1” indicates a passed self test and bit 5 = “0”indicates a failed self test.Setting bit 6 to a logic 1 will start the self test function. The built-in self test function of the IC consists of two internal routines which exercises major portions of the IC and illuminates all of the LEDs. The first routine cycles the ASCII decoder ROM through all states and performs a checksum on the output. If the checksum agrees with the correct value, bit 5 is set to “1.” The second routine provides a visual test of the LEDs using the drive circuitry. This is accomplished by writing checkered and inverse checkered patterns to the display. Each pattern is displayed for approxi-mately 2 seconds.During the self test function the display must not be accessed. The time needed to execute the self test function is calculated by multiplying the clock period by 262,144. For example, assume a clock frequency of 58 KHz, then the time to execute the self test function frequency is equal to (262,144/58,000) = 4.5 second duration.At the end of the self test function, the Character RAM is loaded with blanks, the Control Word Register is set to zeros except for bit 5, and the Flash RAM is cleared and the UDC Address Register is set to all ones.Clear Function (Bit 7)Bit 7 of the Control Word will clear the Character RAM and the Flash RAM. Setting bit 7 to a "1" will start the clear function. Three clock cycles (110 µs min. using theinternal refresh clock) arerequired to complete the clearfunction. The display must not beaccessed while the display is beingcleared. When the clear functionhas been completed, bit 7 will bereset to a “0.” The ASCII charactercode for a space (20H) will beloaded into the Character RAM toblank the display and the FlashRAM will be loaded with “0”s. TheUDC RAM, UDC Address Register,and the remainder of the ControlWord are unaffected.Display ResetFigure 7 shows the logic levelsneeded to Reset the display. Thedisplay should be Reset on Power-up. The external Reset clears theCharacter RAM, Flash RAM,Control Word and resets theinternal counters. After the risingedge of the Reset signal, threeclock cycles (110 µs min. using theinternal refresh clock) arerequired to complete the resetsequence. The display must not beaccessed while the display is beingreset. The ASCII Character codefor a space (20H) will be loadedinto the Character RAM to blankthe display. The Flash RAM andControl Word Register are loadedwith all "0"s. The UDC RAM andUDC Address Register are un-affected. All displays whichoperate with the same clocksource must be simultaneouslyreset to synchronize the Flashingand Blinking functions.Mechanical and ElectricalConsiderationsThe HDSP-213x/-2179 is a 32 pindual-in-line package with 24external pins, which can bestacked horizontally and verti-cally to create arrays of any size.The HDSP-213x/-2179 is designedto operate continuously from-55°C to +85°C with a maximumof 20 dots ON per character.Illuminating all thirty-five dots atfull brightness is notrecommended.The HDSP-213x/-2179 isassembled by die attaching andwire bonding 280 LED chips and aCMOS IC to a ceramic sub-strate.A glass window is placed over theceramic substrate creating an airgap over the LED wire bonds. Asecond glass window creates anair gap over the CMOS IC. Thispackage construction makes thedisplay highly tolerant to temper-ature cycling and allows wavesoldering and visual inspection ofthe IC.The inputs to the CMOS IC areprotected against static dischargeand input current latchup. How-ever, for best results standardCMOS handling precautionsshould be used. Prior to use, theHDSP-213X should be stored inFigure 7. Logic levels to reset the display.Figure 8. Maximum power dissipation vs.ambient temperature derating based onT J MAX = 125°C.CERST WR RD0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CARENOTE:IF RST, CE, AND WR ARE LOW, UNKNOWNDATA MAY BE WRITTEN INTO THE DISPLAY.FL01X X X X XA4 -A0D7 -D0PD–POWERDISSIPATION–WT A– AMBIENT TEMPERATURE –°C4.03.01.02.01415Soldering and Post Solder Cleaning Instructions for the HDSP-213x/-2179The HDSP-213x/-2179 may be hand soldered or wave soldered with lead-free solder. When hand soldering it is recommended that an electronically temperature con-trolled and securely grounded soldering iron be used. For best results, the iron tip temperature should be set at 315°C (600°F).For wave soldering, a rosin-based RMA flux can be used. The solder wave temperature should be set at 245°C ± 5°C (473°F ± 9°F), and dwell in the wave should be set between 11/2 to 3 seconds for optimum soldering. The preheat temperature should not exceed 105°C (221°F) as measured on the solder side of the PC board.Proper handling is imperative to avoid excessive thermal stresses to component when heated.Therefore, the solder PCB must be allowed to cool to room temperature, 25°C, before handling.For further information on soldering and post soldercleaning, see Application Note 1027, Soldering LED Components.antistatic packages or conductive material. During assembly, a grounded conductive work area should be used, and assemblypersonnel should wear conductive wrist straps. Lab coats made of synthetic material should be avoided since they are prone to static charge buildup. Input current latchup is caused when the CMOS inputs are subjected to either a voltage below ground (V IN < ground) or to a voltage higher than V DD (V IN > V DD ) and when a high current is forced into the input. To prevent input cur-rent latchup and ESD damage,unused inputs should be con-nected either to ground or to V DD .Voltages should not be applied to the inputs until V DD has been applied to the display. Transient input voltages should be eliminated.Thermal ConsiderationsThe HDSP-213x/-2179 has been designed to provide a low thermal resistance path from the CMOS IC to the 24 package pins. This heat is then typically conducted through the traces of the user’s printed circuit board to free air. For most applications no additional heatsinking is required.The maximum operating IC junction temperature is 150°C.The maximum IC junction tem-perature can be calculated using the following equation:T J (IC) MAX = T A+ (P D MAX) (R q J-PIN + R q PIN-A )WhereP D MAX = (V DD MAX) (I DD MAX)I DD MAX = 370 mA with 20 dots ON in eight character locations at 25°C ambient. This value is from the Electrical Characteristics table.P D MAX = (5.5 V) (0.370 A)= 2.04 W Ground ConnectionsTwo ground pins are provided to keep the internal IC logic ground clean. The designer can, when necessary, route the analog ground for the LED drivers sep-arately from the logic ground until an appropriate ground plane is available. On long interconnects between the display and the host system, the designer can keep voltage drops on the analogground from affecting the display logic levels by isolating the two grounds.The logic ground should be con-nected to the same ground poten-tial as the logic interface circuitry.The analog ground and the logic ground should be connected at a common ground which canwithstand the current introduced by the switching LED drivers.When separate ground connec-tions are used, the analog ground can vary from -0.3 V to +0.3 V with respect to the logic ground.Voltage below -0.3 V can cause all dots to be on. Voltage above +0.3V can cause dimming and dot mismatch.ESD SusceptibilityThese displays have ESD sus-ceptibility ratings of CLASS 3 per DOD-STD-1686 and CLASS B per MIL-STD-883C.BOTTOM SIDE OF PC BOARD TIME – SECONDST E M P E R A T U R E – °CTOP SIDE OF PC BOARDCONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)PREHEAT SETTING = 150°C (100°C PCB)SOLDER WAVE TEMPERATURE = 245°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)AIR KNIFE ANGLE = 40°NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTL Y COOLED BEFORE EXERTING MECHANICAL FORCE.Figure 9. Recommended wave soldering profile for lead-free Smart Display.Intensity Bin LimitsIntensity Range (mcd)Bin Min.Max.G 2.50 4.00H 3.41 6.01I 5.129.01J 7.6813.52K 11.5220.28Note: Test conditions as specified in Optical Characteristic table.Color Bin Limits Color Range (nm)Color Bin Min.Max.Green1576.0580.02573.0577.03570.0574.04567.0571.5Yellow3581.5585.04584.0587.55586.5590.06589.0592.5Note: Test conditions as specified in OpticalCharacteristic table.For product information and a complete list of distributors, please go to our website: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes 5989-3182EN AV02-0190EN March 6, 2007Contrast EnhancementWhen used with the proper con-trast enhancement filters, the HCMS-213x/-2179 series displays are readable daylight ambients.Refer to Application Note 1029Luminous Contrast and Sunlight Readability of the HDSP-235x Series Alphanumeric Displays for Military Applications for information on contrast en-hancement for daylight ambients.Refer to Application Note 1015Contrast Enhancement Techniques for LED Displays for information on contrast enhancement in moderate ambients.Night Vision LightingWhen used with the proper NVG/DV filters, the HDSP-2131, HDSP-2179 and HDSP-2133 may be used in night vision lighting applica-tions. The HDSP-2131 (yellow),HDSP-2179 (orange) displays are used as master caution and warning indicators. The HDSP-2133 (high per-formance green)displays are used for general instrumenta-tion. For a list of NVG/DV filters and a discussion on night vision lighting technol-ogy, refer to Application Note 1030 LED Displays and Indicators and Night Vision Imaging System Lighting. An external dimming circuit must be used to dim these displays to night vision lighting levels to meet NVIS radiance requirements. Refer to AN 1039Dimming HDSP-213x Displays to Meet Night Vision Lighting Levels.。

HDS VSP G1000系列产品介绍

HDS VSP G1000系列产品介绍目录第1章HDS VSP G1000产品介绍 (4)1.1概述 (4)1.2VSP G1000技术的技术优势 (6)1.2.1永续运行 (6)1.2.2高度灵活的基础架构 (6)1.2.3自动、智能的架构 (11)1.2.4统一存储 (11)1.2.5无中断数据迁移 (13)1.2.6VSP G1000水平扩展的基础架构 (16)1.3VSP G1000软件包 (17)1.3.1SVOS（存储虚拟化操作系统） (17)1.3.2HITACHI COMMAND SUITE DATA MOBILITY（数据移动和灵活性） (21)1.3.3Hitachi Command Suite Analytics(高级分析和监控软件包) (22)1.3.4Hitachi Local Replication（本地数据保护） (24)1.3.5Hitachi Remote Replication（远程数据保护） (26)1.3.6File Base（统一存储） (29)1.4VSP G1000产品技术指标 (32)1.4.1VSP G1000 规格: 主机端口 (32)1.4.2VSP G1000 规格: 可用性 (32)1.4.3VSP G1000 规格: 支持的操作系统 (33)1.4.4Hitachi Virtual Storage Platform G1000 规格: 物理特性 (34)1.4.5Hitachi Virtual Storage Platform G1000 规格: 软件 (35)1.5外接存储系统兼容列表（存储虚拟化） (38)1.5.1HDS (38)1.5.2ATDX (39)1.5.3Data Direct Networks (39)1.5.4Dell (39)1.5.5EMC (39)1.5.6Fujitsu (40)1.5.7Gateway (40)1.5.8HP (41)1.5.9IBM (41)1.5.10NetApp (42)1.5.11Nexsan Technologies (42)1.5.12Pillar Data Systems (42)1.5.13SGI (43)1.5.14Sun Microsystems (43)1.5.15Xiotech (43)1.5.16X-IO (44)1.6VSP G1000 场地准备要求 (44)1.6.1VSP G1000环境要求 (44)1.6.2VSP G1000 电源要求 (45)1.6.3VSP G1000 模块装配图示 (47)1.6.4VSP G1000 控制器图示 (49)1.6.5VSP G1000 设备尺寸 (50)1.6.6机柜及服务空间 (50)第1章HDS VSP G1000产品介绍1.1概述如今，数据中心的运营耗费了大量的人力，这通常会阻碍IT团队与不断变化的业务需求保持同步发展。

5082-E107-EG000中文资料

Features• Low Power Consumption • Industry Standard Size• Industry Standard Pinout • Choice of Character Size7.6 mm (0.30 in), 10 mm (0.40 in), 10.9 mm (0.43 in), 14.2 mm (0.56 in), 20 mm (0.80 in)• Choice of ColorsAlGaAs Red, High Efficiency Red (HER), Yellow, Green• Excellent Appearance Evenly Lighted Segments±50° Viewing Angle• Design FlexibilityCommon Anode or Common CathodeSingle and Dual DigitLeft and Right Hand Decimal Points±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display• Excellent for Long Digit String Multiplexing DescriptionThese low current seven segment displays are designed for applica-tions requiring low power consumption. They are tested and selected for their excellent low current characteristics to ensure that the segments are matched at low currents. Drive currents as low as 1 mA per segment are available.Pin for pin equivalent displays are also available in a standard current or high light ambient design. The standard current displays are available in all colors and are ideal for most applica-tions. The high light ambient displays are ideal for sunlight ambients or long string lengths. For additional information see the 7.6 mm Micro Bright Seven Segment Displays, 10 mm Seven Segment Displays, 7.6 mm/10.9 mm Seven Segment Displays, 14.2 mm Seven Segment Displays, 20 mm Seven Segment Displays, or High Light Ambient Seven Segment Displays data sheets.Low Current Seven SegmentDisplays Technical Data HDSP-335x SeriesHDSP-555x SeriesHDSP-751x SeriesHDSP-A10x Series HDSP-A80x Series HDSP-A90x Series HDSP-E10x Series HDSP-F10x Series HDSP-G10x Series HDSP-H10x Series HDSP-K12x, K70x Series HDSP-N10x SeriesHDSP-N40x SeriesDevicesAlGaAs HER Yellow Green Package HDSP-HDSP-HDSP-HDSP-Description Drawing A1017511A801A9017.6 mm Common Anode Right Hand Decimal A A1037513A803A9037.6 mm Common Cathode Right Hand Decimal B A1077517A807A9077.6 mm Common Anode ±1. Overflow C A1087518A808A9087.6 mm Common Cathode ±1. Overflow D F10110 mm Common Anode Right Hand Decimal E F10310 mm Common Cathode Right Hand Decimal F F10710 mm Common Anode ±1. Overflow G F10810 mm Common Cathode ±1. Overflow H G10110 mm Two Digit Common Anode Right Hand Decimal X G10310 mm Two Digit Common Cathode Right Hand Decimal Y E100335010.9 mm Common Anode Left Hand Decimal I E101335110.9 mm Common Anode Right Hand Decimal J E103335310.9 mm Common Cathode Right Hand Decimal K E106335610.9 mm Universal ±1. Overflow[1]L H101555114.2 mm Common Anode Right Hand Decimal M H103555314.2 mm Common Cathode Right Hand Decimal N H107555714.2 mm Common Anode ±1. Overflow O H108555814.2 mm Common Cathode ±1. Overflow P K121K70114.2 mm Two Digit Common Anode Right Hand Decimal R K123K70314.2 mm Two Digit Common Cathode Right Hand Decimal S N10020 mm Common Anode Left Hand Decimal Q N101N40120 mm Common Anode Right Hand Decimal T N103N40320 mm Common Cathode Right Hand Decimal U N10520 mm Common Cathode Left Hand Decimal V N106N40620 mm Universal ±1. Overflow[1]W Note:1. Universal pinout brings the anode and cathode of each segment’s LED out to separate pins. See internal diagrams L or W.Part Numbering System5082-x xx x-x x x xxHDSP-x xx x-x x x xxMechanical Options[1]00: No mechanical optionColor Bin Options[1,2]0: No color bin limitationMaximum Intensity Bin[1,2]0: No maximum intensity bin limitationMinimum Intensity Bin[1,2]0: No minimum intensity bin limitationDevice Configuration/Color[1]G: GreenDevice Specific Configuration[1]Refer to respective datasheetPackage[1]Refer to Respective datasheetNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative fordetails.2. Bin options refer to shippable bins for a part-number. Color and Intensity Bins are typically restricted to 1 bin per tube (excep-tions may apply). Please refer to respective datasheet for specific bin limit information.Package DimensionsPackage Dimensions (cont.)Package Dimensions (cont.)*The Side View of package indicates Country of Origin.Package Dimensions (cont.)Package Dimensions (cont.)Package Dimensions (cont.)Internal Circuit DiagramInternal Circuit Diagram (cont.)Absolute Maximum RatingsAlGaAs Red - HDSP-HERA10X/E10X/H10X HDSP-751X/Yellow GreenK12X/N10X/N40X335X/555X/HDSP-A80X HDSP-A90X Description F10X, G10X Series K70X Series Series Series Units Average Power per Segment or DP375264mW Peak Forward Current per 45mA Segment or DPDC Forward Current per15[1]15[2]mA Segment or DPOperating Temperature Range-20 to +100-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment 3.0V or DPWave Soldering Temperature for 3Seconds (1.60 mm [0.063 in.] below 250°C seating body)Notes:1. Derate above 91°C at 0.53 mA/°C.2. Derate HER/Yellow above 80°C at 0.38 mA/°C and Green above 71°C at 0.31 mA/°C.Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions315600I F = 1 mA A10x3600I F = 5 mA330650I F = 1 mAF10x, G10x3900I F = 5 mA390650I F = 1 mA E10x Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)3900I F = 5 mA400700I F = 1 mAH10x, K12x4200I F = 5 mA270590I F = 1 mAN10x, N40x3500I F = 5 mA1.6I F = 1 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA1.82.2I F = 20 mA PkAll Devices Peak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2 mV mV/°CV F/Segment or DPA10x255F10x, G10x320E10x340Thermal Resistance LED RθJ-PIN°C/W/SegH10x, K12x Junction-to-Pin400N10x, N40x430High Efficiency RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions160270I F = 2 mA 751x1050I F = 5 mA200300I F = 2 mA Luminous Intensity/Segment[1,2]I V mcd(Digit Average)1200I F = 5 mA335x, 555x,K70x270370I F = 2 mA1480I F = 5 mA1.6I F = 2 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA2.1 2.5I F = 20 mA Pk All Devices Peak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DP751x200335x Thermal Resistance LED RθJ-PIN280°C/WJunction-to-Pin555x, K70x345YellowDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250420I F = 4 mA(Digit Average)I V mcd1300I F = 10 mA1.7I F = 4 mAForward Voltage/Segment or DP V F 1.8V I F = 5 mA A80x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK583nmDominant Wavelength[3,5]λd581.5585592.5nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinGreenDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250475I F = 4 mA(Digit Average)I V mcd1500I F = 10 mA1.9I F = 4 mAForward Voltage/Segment or DP V F 2.0V I F = 10 mA A90x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK566nmDominant Wavelength[3,5]λd571577nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is the single wavelength which defines the color of thedevice.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. The yellow (HDSP-A800) and Green (HDSP-A900) displays are categorized for dominant wavelength. The category is designated by anumber adjacent to the luminous intensity category letter.AlGaAs RedIntensity Bin Limits (mcd)AlGaAs RedHDSP-A10xIV Bin Category Min.Max.E0.3150.520F0.4280.759G0.621 1.16H0.945 1.71I 1.40 2.56J 2.10 3.84K 3.14 5.75L 4.708.55HDSP-E10x/F10x/G10xIV Bin Category Min.Max.D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-H10x/K12xIV Bin Category Min.Max.C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50HDSP-N10xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued HERHDSP-751xIV Bin Category Min.Max.B0.1600.240C0.2000.300D0.2500.385E0.3150.520F0.4280.759G0.621 1.16HDSP-751xIV Bin Category Min.Max.B0.2400.366C0.3000.477D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-555x/K70xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued YellowHDSP-A80xIV Bin Category Min.Max.D0.2500.385E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60GreenHDSP-A90xIV Bin Category Min.Max.E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60Electrical/OpticalFor more information on electrical/optical characteristics, please see Application Note 1005.Contrast Enhancement For information on contrast enhancement, please see Application Note 1015.Soldering/Cleaning Cleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from the chorinated hydrocarbon family (methylene chloride, trichloro-ethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs, please refer to Application Note 1027.Note:All categories are established for classification of products. Productsmay not be available in all categories. Please contact your localAgilent representatives for further clarification/information.Color Categories/semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788 6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6271 2451India, Australia, New Zealand: (+65) 6271 2394Japan: (+81 3) 3335-8152(Domestic/International), or0120-61-1280(Domestic Only)Korea: (+65) 6271 2194Malaysia, Singapore: (+65) 6271 2054Taiwan: (+65) 6271 2654Data subject to change.Copyright © 2005 Agilent Technologies, Inc.Obsoletes 5988-8412ENJanuary 19, 20055989-0080EN。

HDSP-2503资料

Eight Character 5 mm and 7 mm Smart Alphanumeric Displays Technical DataFeatures• X Stackable (HDSP-21XX)• XY Stackable (HDSP-250X)• 128 Character ASCII Decoder• Programmable Functions • 16 User Definable Characters• Multi-Level Dimming and Blanking• TTL Compatible CMOS IC • Wave SolderableApplications• Computer Peripherals• Industrial Instrumentation • Medical Equipment• Portable Data Entry Devices • Cellular Phones • TelecommunicationsEquipment• Test EquipmentDescriptionThe HDSP-210X/-211X/-250Xseries of products is ideal forapplications where displayingeight or more characters of dotmatrix information in anaesthetically pleasing manner isrequired. These devices are8-digit, 5 x 7 dot matrix, alpha-numeric displays and are allpackaged in a standard 15.24 mm(0.6 inch) 28 pin DIP. The on-board CMOS IC has the ability todecode 128 ASCII characterswhich are permanently stored inROM. In addition, 16 program-mable symbols may be stored inon-board ROM, allowing consider-HDSP-210X SeriesHDSP-211X SeriesHDSP-250X Seriesable flexibility for displayingadditional symbols and icons.Seven brightness levels provideversatility in adjusting the displayintensity and power consumption.The HDSP-210X/-211X/-250Xproducts are designed forstandard microprocessor interfacetechniques. The display andspecial features are accessedthrough a bidirectional 8-bit databus.Device Selection GuideAlGaAs High EfficiencyFont Height Red Red Orange Yellow Green0.2 inches HDSP-2107HDSP-2112HDSP-2110HDSP-2111HDSP-21130.27 inches HDSP-2504HDSP-2502HDSP-2500HDSP-2501HDSP-2503Package DimensionsESD WARNING: STANDARD CMOS HANDLING PRECAUTIONS SHOULD BE OBSERVED TO AVOID STATIC DISCHARGE.Absolute Maximum RatingsSupply Voltage, V DD to Ground [1]........................................-0.3 to 7.0 V Operating Voltage, V DD to Ground [2]..............................................5.5 V Input Voltage, Any Pin to Ground..............................-0.3 to V DD +0.3 V Free Air Operating Temperature Range, T A [3]................-45°C to +85°C Storage Temperature Range, T S ..................................-55°C to +100°C Relative Humidity (non-condensing)...............................................85%Maximum Solder Temperature(Below Seating Plane), t < 5 sec..............................................260°C ESD Protection @ 1.5 k Ω, 100 pF ........................V Z = 4 kV (each pin)Notes:1. Maximum Voltage is with no LEDs illuminated.2. 20 dots ON in all locations at full brightness.3. Maximum supply voltage is 5.25 V for operation above 70°C.Package DimensionsASCII Character Set HDSP-210X, HDSP-211X, HDSP-250X SeriesElectrical Characteristics Over Operating Temperature Range (-45°C to +85°C)4.5 V < V DD <5.5 V , unless otherwise specifiedT A = 25°C -45°C < T A < + 85°CV DD = 5.0 V 4.5 V < V DD < 5.5 V Parameter Symbol Typ.Max.Min.Max.Units Test Conditions Input LeakageI IH 1.0µAV IN = 0 to V DD ,(Input without pullup)I IL -1.0pins CLK, D 0-D 7,A 0-A 4Input CurrentI IPL-11-18-30µAV IN = 0 to V DD ,(Input with pullup)pins CLS, RST,WR, RD, CE, FL I DD BlankI DD (BLK)0.5 3.0 4.0mA V IN = V DD I DD 8 digitsI DD (V)200255330mA “V” on in all 812 dots/character [1,2]locations I DD 8 digitsI DD (#)300370430mA “#” on in all 20 dots/character [1,2,3,4]locationsInput Voltage High V IH 2.0V DD V +0.3Input Voltage Low V IL GND 0.8V -0.3 V Output Voltage High V OH 2.4VV DD = 4.5 V ,I OH = -40 µA Output Voltage Low V OL 0.4V V DD = 4.5 V ,D 0-D 7I OL = 1.6 mA Output Voltage Low V OL 0.4V V DD = 4.5 V ,CLKI OL = 40 µA High Level Output I OH -60mA V DD = 5.0 V CurrentLow Level Output I OL 50mA V DD = 5.0 VCurrentThermal Resistance R θJ-C15°C/WIC Junction-to-CaseNotes:1.Average I DD measured at full brightness. See Table 2 in Control Word Section for I DD at lower brightness levels. Peak I DD = 28/15 x I DD (#).2.Maximum I DD occurs at -55°C.3.Maximum I DD (#) = 355 mA at V DD = 5.25 V and IC T J = 150°C.4.Maximum I DD (#) = 375 mA at V DD =5.5 V and IC T J = 150°C.Optical Characteristics at 25°CV DD = 5.0 V at Full BrightnessLuminous Intensity Peak DominantCharacter Average (#)Wavelength Wavelength Part Iv (mcd)λPeakλd Description Number Min.Typ.(nm)(nm) AlGaAs HDSP-2107 5.015.0645637-2504HER HDSP-2112 2.57.5635626-2502Orange HDSP-2110 2.57.5600602-2500Yellow HDSP-2111 2.57.5583585-2501High HDSP-2113 2.57.5568574 Performance -2503GreenNote: 1. Refers to the initial case temperature of the device immediately prior to measurement.[1]AC Timing Characteristics Over Temperature Range (-45°C to +85°C)4.5 V < V DD <5.5 V, unless otherwise specifiedReferenceNumber Symbol Description Min.[1]Units 1t ACC Display Access TimeWrite210Read230ns 2t ACS Address Setup Time to Chip Enable10ns 3t CE Chip Enable Active Time[2,3]Write140Read160ns 4t ACH Address Hold Time to Chip Enable20ns 5t CER Chip Enable Recovery Time60ns 6t CES Chip Enable Active Prior to Rising Edge of[2,3]Write140Read160ns 7t CEH Chip Enable Hold Time to Rising Edge ofRead/Write Signal[2,3]0ns 8t W Write Active Time100ns 9t WSU Data Write Setup Time50ns 10t WH Data Write Hold Time20ns 11t R Chip Enable Active Prior to Valid Data160ns 12t RD Read Active Prior to Valid Data75ns 13t DF Read Data Float Delay10ns t RC Reset Active Time[4]300ns Notes:1. Worst case values occur at an IC junction temperature of 150° C.2. For designers who do not need to read from the display, the Read line can be tied to VDD and the Write and Chip Enable lines can betied together.3. Changing the logic levels of the Address lines when CE = “0” may cause erroneous data to be entered into the Character RAM,regardless of the logic levels of the WR and RD lines.4. The display must not be accessed until after 3 clock pulses (110 µs min. using the internal refresh clock) after the rising edge of thereset line.AC Timing Characteristics Over Temperature Range (-45°C to +85°C)4.5 V < V DD <5.5 V , unless otherwise specifiedWrite Cycle Timing DiagramSymbol Description 25°C Typ.Min.[1]Units F OSC Oscillator Frequency 5728kHz F RF [2]Display Refresh Rate 256128Hz F FL [3]Character Flash Rate 21Hz t ST [4]Self Test Cycle Time4.69.2secNotes:1. Worst case values occur at an IC junction temperature of 150°C.2. F RF = F OSC/2243. F FL = F OSC /28,6724. t ST = 262,144/F OSCRead Cycle Timing DiagramRelative Luminous Intensity vs. TemperatureYELLOW HDSP-2111/2501Electrical DescriptionPin Function DescriptionRESET (RST, pin 1)Initializes the display.FLASH (FL, pin 2)FL low indicates an access to the Flash RAM and is unaffected by thestate of address lines A3-A4.ADDRESS INPUTS Each location in memory has a distinct address. Address inputs (A0-A2)(A0-A4, pins 3-6, 10)select a specific location in the Character RAM, the Flash RAM or aparticular row in the UDC (User-Defined Character) RAM. A3-A4 areused to select which section of memory is accessed. Table 1 shows thelogic levels needed to access each section of memory.Table 1. Logic Levels to Access MemorySection of Memory FL A4 A3A2 A1 A0Flash RAM 0X X Char. AddressUDC Address Register 10 0Don't CareUDC RAM 10 1Row AddressControl Word Register 11 0Don’t CareCharacter RAM 11 1Character Address CLOCK SELECT Used to select either an internal (CLS = 1) or external (CLS = 0) clock source. (CLS, pin 11)CLOCK INPUT/OUTPUT Outputs the master clock (CLS = 1) or inputs a clock (CLS = 0) for slave (CLK, pin 12)displays.WRITE (WR, pin 13)Data is written into the display when the WR input is low and theCE input is low.CHIP ENABLE (CE, pin 17)Must be at a logic low to read or write data to the display and must gohigh between each read and write cycle.READ (RD, pin 18)Data is read from the display when the RD input is low and the CEinput is low.DATA Bus (D0-D7,Used to read from or write to the display.pins 19, 20, 23-28)GND (SUPPLY) (pin 15)Analog ground for the LED drivers.GND (LOGIC) (pin 16)Digital ground for internal logic.V DD (POWER) (pin 14)Positive power supply input.F i g u r e 1. H D S P -210X /-211X /-212X /-250X I n t e r n a l B l o c k D i a g r a m .11Character RAM This RAM stores either ASCII character data or a UDC RAM address.Flash RAMThis is a 1 x 8 RAM which stores Flash data.User-Defined Character RAM This RAM stores the dot pattern for custom characters.(UDC RAM)User-Defined Character This register is used to provide the address to the UDC RAM when Address Registerthe user is writing or reading a custom character.(UDC Address Register)Control Word RegisterThis register allows the user to adjust the display brightness, flash individual characters, blink, self test, or clear the display.Display Internal Block DiagramFigure 1 shows the internal block diagram of the HDSP-210X/-211X/-250X displays. The CMOS IC consists of an 8 byte CharacterRAM, an 8 bit Flash RAM, a 128character ASCII decoder, a 16character UDC RAM, a UDCAddress Register, a Control Word Register, and refresh circuitry necessary to synchronize thedecoding and driving of eight 5 x 7 dot matrix characters. Themajor user-accessible portions of the display are listed below:Character RamFigure 2 shows the logic levels needed to access theHDSP-210X/-211X/-250XCharacter RAM. During a normal access, the CE = “0” and either RD = “0” or WR = “0.” However,erroneous data may be written into the Character RAM if the address lines are unstable when CE = “0” regardless of the logic levels of the RD or WR lines.Address lines A 0-A 2 are used to select the location in the Charac-ter RAM. Two types of data can be stored in each Character RAM location: an ASCII code or a UDC RAM address. Data bit D 7 is used to differentiate between the ASCII character and a UDC RAMaddress. D 7 = 0 enables the ASCII decoder and D 7 = 1 enables the UDC RAM. D 0-D 6 are used to input ASCII data and D 0-D 3 are used to input a UDC address.Figure 2. Logic Levels to Access the Character RAM.12 UDC RAM and UDC AddressRegisterFigure 3 shows the logic levelsneeded to access the UDC RAMand the UDC Address Register.The UDC Address Register iseight bits wide. The lower fourbits (D0-D3) are used to select oneof the 16 UDC locations. Theupper four bits (D4-D7) are notused. Once the UDC address hasbeen stored in the UDC AddressRegister, the UDC RAM can beaccessed.To completely specify a 5 x 7character, eight write cycles arerequired. One cycle is used tostore the UDC RAM address in theUDC Address Register and sevencycles are used to store dot datain the UDC RAM. Data is enteredby rows and one cycle is neededto access each row. Figure 4shows the organization of a UDCcharacter assuming the symbol tobe stored is an “F.” A0-A2 are usedto select the row to be accessedand D0-D4 are used to transmitthe row dot data. The upper threebits (D5-D7) are ignored. D0 (leastsignificant bit) corresponds to theright most column of the 5 x 7matrix and D4 (most significantbit) corresponds to the left mostcolumn of the 5 x 7 matrix.Flash RAMFigure 5 shows the logic levelsneeded to access the Flash RAM.The Flash RAM has one bitassociated with each location ofthe Character RAM. The Flashinput is used to select the FlashRAM while address lines A3-A4 areignored. Address lines A0-A2 areused to select the location in theFlash RAM to store the attribute. D0 is used to store or remove the flash attribute. D0 = “1” stores the attribute and D0 = “0”removes the attribute.When the attribute is enabledthrough bit 3 of the Control Wordand a “1” is stored in the FlashRAM, the correspondingcharacter will flash at approxi-mately 2 Hz. The actual rate isdependent on the clock frequency.For an external clock the flashrate can be calculated by dividingthe clock frequency by 28,672.C C C C CO O O O OL L L L L12345UDC HEXD4D3D2D1D0CHARACTER CODE11111ROW 1*****1F10000ROW 2*1010000ROW 3*1011110ROW 4****1D10000ROW 5*1010000ROW 6*1010000ROW 7*10IGNORED0 = LOGIC 0; 1 = LOGIC 1; * = ILLUMINATED LED.Figure 4. Data to Load ""F'' into the UDC RAM.元器件交易网Figure 5. Logic Levels to Access the Flash RAM.Table 2. Current Requirements atDifferent Brightness Levels V DD = 5.0 V %Current at 25°CSymbol D 2D 1D 0BrightnessTyp.Units I DD (V)000100200mA 00180160mA 01053106mA 0114080mA 1002754mA 1012040mA 111326mAFigure 6. Logic Levels to Access the Control Word RegisterControl Word RegisterFigure 6 shows how to access the Control Word Register. This 8-bit register performs five functions:Brightness control, Flash RAM control, Blinking, Self Test, and Clear. Each function isindependent of the others; how-ever, all bits are updated during each Control Word write cycle.Brightness (Bits 0-2)Bits 0-2 of the Control Word adjust the brightness of the display. Bits 0-2 are interpreted as a three bit binary code with code (000) corresponding to maximum brightness and code (111) corresponding to a blanked display. In addition to varying the display brightness, bits 0-2 also vary the average value of I DD . I DD can be calculated at any bright-ness level by multiplying the percent brightness level by the value of I DD at the 100% bright-ness level. These values of I DD are shown in Table 2.Flash Function (Bit 3)Bit 3 determines whether the flashing character attribute is on or off. When bit 3 is a“1,” the output of the Flash RAM ischecked. If the content of a loca-tion in the Flash RAM is a “1,” the associated digit will flash atapproximately 2 Hz. For anexternal clock, the blink rate can be calculated by driving the clock frequency by 28,672. If the flash enable bit of the Control Word is a “0,” the content of the Flash RAM is ignored. To use this function with multiple display systems, see the Display Reset section.Blink Function (Bit 4)Bit 4 of the Control Word is used to synchronize blinking of alleight digits of the display. When this bit is a “1” all eight digits of the display will blink at approxi-mately 2 Hz. The actual rate is dependent on the clock frequency .For an external clock, the blink rate can be calculated by dividing the clock frequency by 28,672.This function will override the Flash function when it is active.To use this function with multiple display systems, see the Display Reset section.Self Test Function (Bits 5, 6) Bit 6 of the Control Word Register is used to initiate the self test function. Results of the internal self test are stored in bit 5 of the Control Word. Bit 5 is a read only bit where bit 5 = “1” indicates a passed self test and bit 5 = “0”indicates a failed self test.Setting bit 6 to a logic 1 will start the self test function. The built-in self test function of the IC consists of two internal routines which exercise major portions of the IC and illuminate all of the LEDs. The first routine cycles the ASCII decoder ROM through all states and performs a checksum on the output. If the checksum agrees with the correct value, bit 5 is set to “1.” The second routine provides a visual test of the LEDs using the drive circuitry. This is accomplished by writing checkered and inverse checkered patterns to the display. Each pattern is displayed for approxi-mately 2 seconds.During the self test function the display must not be accessed. The time needed to execute the self test function is calculated by multiplying the clock period by 262,144. For example, assume a clock frequency of 58 KHz, then the time to execute the self test function frequency is equal to (262,144/58,000) = 4.5 second duration.At the end of the self test func-tion, the Character RAM is loaded with blanks, the Control Word Register is set to zeros except for bit 5, the Flash RAM is cleared, and the UDC Address Register is set to all ones.Clear Function (Bit 7)Bit 7 of the Control Word willclear the Character RAM and theFlash RAM. Setting bit 7 to a “1”will start the clear function. Threeclock cycles (110 ms minimumusing the internal refresh clock)are required to complete the clearfunction. The display must not beaccessed while the display isbeing cleared. When the clearfunction has been completed, bit7 will be reset to a “0.” The ASCIIcharacter code for a space (20H)will be loaded into the CharacterRAM to blank the display and theFlash RAM will be loaded with“0”s. The UDC RAM, UDCAddress Register, and the re-mainder of the Control Word areunaffected.Display ResetFigure 7 shows the logic levelsneeded to Reset the display. Thedisplay should be Reset onPower-up. The external Resetclears the Character RAM, FlashRAM, Control Word and resetsthe internal counters. After therising edge of the Reset signal,three clock cycles (110 µsminimum using the internalrefresh clock) are required tocomplete the reset sequence. Thedisplay must not be accessedwhile the display is being reset.The ASCII Character code for aspace (20H) will be loaded intothe Character RAM to blank thedisplay. The Flash RAM andControl Word Register are loadedwith all “0”s. The UDC RAM andUDC Address Register areunaffected. All displays whichoperate with the same clocksource must be simultaneouslyreset to synchronize the Flashingand Blinking functions.Mechanical and ElectricalConsiderationsThe HDSP-210X/-211X/-250X are28 pin dual-in-line packages with26 external pins. The devices canbe stacked horizontally and verti-cally to create arrays of any size.The HDSP-210X/-211X/-250X aredesigned to operate continuouslyfrom -45°C to +85°C with amaximum of 20 dots on percharacter at 5.25 V. Illuminatingall thirty-five dots at full bright-ness is not recommended.The HDSP-210X/-211X/-250X areassembled by die attaching andwire bonding 280 LED chips anda CMOS IC to a thermallyconductive printed circuit board.A polycarbonate lens is placedover the PC board creating an airgap over the LED wire bonds. Aprotective cap creates an air gapover the CMOS IC. Backfill epoxyenvironmentally seals the displaypackage. This packageconstruction makes the displayhighly tolerant to temperaturecycling and allows wavesoldering.The inputs to the IC are protectedagainst static discharge and inputcurrent latchup. However, forbest results standard CMOShandling precautions should be Figure 7. Logic Levels to Reset theDisplay.15used. Prior to use, the HDSP-210X/-211X/-250X should be stored in antistatic tubes or in conductive material. During assembly, a grounded conductive work area should be used, and assembly personnel should wear conductive wrist straps. Lab coats made of synthetic material should be avoided since they are prone to static buildup. Input current latchup is caused when the CMOS inputs are subjected to either a voltage below ground (V IN < ground) or to a voltage higher than V DD (V IN > V DD) and when a high current is forced into the input. To prevent input current latchup and ESD damage, unused inputs should be con-nected either to ground or to V DD. Voltages should not be applied to the inputs until V DD has been applied to the display.Thermal Considerations The HDSP-210X/-211X/-212X/ 250X have been designed to provide a low thermal resistance path for the CMOS IC to the 26 package pins. Heat is typically conducted through the traces of the printed circuit board to free air. For most applications no additional heatsinking is required.Measurements were made on a 32 character display string to determine the thermal resistance of the display assembly. Several display boards were constructed using 0.062 in. thick printed circuit material, and one ounce copper 0.020 in. traces. Some of the device pins were connected to a heatsink formed by etching a copper area on the printed circuit board surrounding the display. A maximally metallized printed circuit board was also evaluated.The junction temperature wasmeasured for displays soldereddirectly to these PC boards,displays installed in sockets, andfinally displays installed insockets with a filter over thedisplay to restrict airflow. Theresults of these thermalresistance measurements, RθJ-Aare shown in Table 3 and includethe effects of RθJ-C.Ground ConnectionsTwo ground pins are provided tokeep the internal IC logic groundclean. The designer can, whennecessary, route the analogground for the LED driversseparately from the logic grounduntil an appropriate ground planeis available. On long interconnec-tions between the display and thehost system, the designer cankeep voltage drops on the analogground from affecting the displaylogic levels by isolating the twogrounds.The logic ground should beconnected to the same groundpotential as the logic interfacecircuitry. The analog ground andthe logic ground should beconnected at a common groundwhich can withstand the currentintroduced by the switching LEDdrivers. When separate groundconnections are used, the analogground can vary from -0.3 V to+0.3 V with respect to the logicground. Voltage below -0.3 V cancause all dots to be on. Voltageabove +0.3 V can cause dimmingand dot mismatch.Soldering and Post SolderCleaning Instructions forthe HDSP-210X/-211X/-250XThe HDSP-210X/-211X/-250Xmay be hand soldered or wavesoldered with SN63 solder. Whenhand soldering, it is recom-mended that an electronicallytemperature controlled andsecurely grounded soldering ironbe used. For best results, the irontip temperature should be set at315°C (600°F). For wave solder-ing, a rosin-based RMA flux canbe used. The solder wave temper-ature should be set at 245°C ±5°C (473°F ± 9°F), and the dwellin the wave should be setbetween 11 /2 to 3 seconds foroptimum soldering. The preheattemperature should not exceed105°C (221°F) as measured onthe solder side of the PC board. Table 3. Thermal Resistance, θJA, Using Various Amounts of Heatsinking MaterialHeatsinkingMetal W/Sockets W/O Sockets W/Sockets per Device W/O Filter W/O Filter W/Filter sq. in.(Avg.)(Avg.)(Avg.)Units 0313035°C/W1312833°C/W3302633°C/W Max. Metal292532°C/W 4 Board Avg302733°C/WFor additional information onsoldering and post solder clean-ing, see Application Note 1027,Soldering LED Components.Contrast EnhancementThe objective of contrastenhancement is to provide goodreadability in a variety of ambientlighting conditions. For informa-tion on contrast enhancement seeApplication Note 1015, ContrastEnhancement Techniques forLED Displays.Data subject to change.Copyright © 1999 Agilent Technologies, Inc.Obsoletes 5964-6378E5968-7907E (11/99)。

5082-H403-HH000中文资料

14.2 mm (0.56 inch)Seven Segment Displays Technical DataFeatures• Industry Standard Size • Industry Standard Pinout 15.24 mm (0.6 in.) DIP Leads on 2.54 mm (0.1 in.) Centers • Choice of ColorsAlGaAs Red, High Efficiency Red, Yellow, Green, Orange • Excellent Appearance Evenly Lighted Segments Mitered Corners on Segments Gray Package Gives Optimum Contrast±50° Viewing Angle • Design FlexibilityCommon Anode or Common CathodeSingle and Dual Digits Right Hand Decimal Point ±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display • High Light Output • High Peak Current• Excellent for Long Digit String Multiplexing • Intensity and Color Selection OptionSee Intensity and ColorSelected Displays Data Sheet • Sunlight Viewable AlGaAsDescriptionThe 14.2 mm (0.56 inch) LED seven segment displays aredesigned for viewing distances upto 7 metres (23 feet). Thesedevices use an industry standard size package and pinout. Both the numeric and ±1 overflow devices feature a right hand decimalpoint. All devices are available as either common anode or common cathode.Orange AlGaAs Red HERYellowGreen Package HDSP-HDSP-[1]HDSP-[1]HDSP-HDSP- DescriptionDrawingH401H151550157015601Common Anode Right Hand Decimal A H403H153550357035603Common Cathode Right Hand Decimal B H157550757075607Common Anode ±1. Overflow C H158550857085608Common Cathode ±1. OverflowD K401552157215621Two Digit Common Anode Right Hand DecimalE K403552357235623Two Digit Common Cathode Right Hand DecimalFDevicesNote:1. These displays are recommended for high ambient light operation. Please refer to the HDSP-H10X/K12X AlGaAs and HDSP-555X HER data sheet for low current operation.HDSP-K40x Series HDSP-550x Series HDSP-552x Series HDSP-560x Series HDSP-562x Series HDSP-570x Series HDSP-572x Series HDSP-H15x Series HDSP-H40x SeriesThese displays are ideal for most applications. Pin for pin equivalent displays are alsoavailable in a low current design.The low current displays are idealfor portable applications. For additional information see the Low Current Seven Segment Displays data sheet.Part Numbering SystemNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative for details.2. Bin options refer to shippable bins for a part number. Color and Intensity Bins are typically restricted to 1bin per tube (exceptions may apply). Please refer to respective datasheet for specific bin limit information.5082 -X X X X-X X X X X HDSP-X X X X-X X X X XMechanical Options [1]00: No Mechanical Option Color Bin Options [1,2]0: No Color Bin LimitationMaximum Intensity Bin [1,2]0: No Maximum Intensity Bin Limitation Minimum Intensity Bin [1,2]0: No Minimum Intensity Bin Limitation Device Configuration/Color [1]1: Common Anode 3: Common CathodeDevice Specific Configuration [1]Refer to Respective DatasheetPackage [1]H: 14.2 mm (0.56 inch) Single Digit Seven Segment DisplayFUNCTIONPIN AB CDEF1CATHODE e ANODE e CATHODE c ANODE cE CATHODE NO. 1 E ANODE NO. 12CATHODE d ANODE d ANODE c, d CATHODE c, d D CATHODE NO. 1 D ANODE NO. 13ANODE [3]CATHODE [4]CATHODE b ANODE bC CATHODE NO. 1 C ANODE NO. 14CATHODE c ANODE c ANODE a, b, DP CATHODE a, b, DP DP CATHODE NO. 1DP ANODE NO. 15CATHODE DP ANODE DP CATHOPDE DP ANODE DE E CATHODE NO. 1 E ANODE NO. 26CATHODE b ANODE b CATHODE a ANODE aD CATHODE NO. 2 D ANODE NO. 27CATHODE a ANODE a ANODE a, b, DP CATHODE a, b, DP G CATHODE NO. 2G ANODE NO. 28ANODE [3]CATHODE [4]ANODE c, d CATHODE c, d C CATHODE NO. 2 C ANODE NO. 29CATHODE f ANODE f CATHODE d ANODE d DP CATHODE NO. 2DP ANODE NO. 210CATHODE g ANODE g NO PINNO PINB CATHODE NO. 2 B ANODE NO. 211 A CATHODE NO. 2 A ANODE NO. 212 F CATHODE NO. 2 F ANODE NO. 213DIGIT NO. 2 ANODE DIGIT NO. 2 CATHODE 14DIGIT NO. 1 ANODE DIGIT NO. 1 CATHODE 15 B CATHODE NO. 1 B ANODE NO. 116 A CATHODE NO. 1 A ANODE NO. 117G CATHODE NO. 1G ANODE NO. 118F CATHODE NO. 1 F ANODE NO. 1NOTES:1. ALL DIMENSIONS IN MILLIMETRES (INCHES).2. ALL UNTOLERANCED DIMENSIONS ARE FOR REFERENCE ONLY.3. REDUNDANT ANODES.4. REDUNDANT CATHODES.5. FOR HDSP-5600/-5700 SERIES PRODUCT ONLY.Package DimensionsInternal Circuit DiagramNotes:1. See Figure 2 to establish pulsed conditions.2. Derate above 46°C at 0.54 mA/°C.3. See Figure 7 to establish pulsed conditions.4. Derate above 53°C at 0.45 mA/°C.5. See Figure 8 to establish pulsed conditions.HER/Orange HDSP-5500AlGaAs Red HDSP-H40x Yellow Green HDSP-H150HDSP-K40x HDSP-5700HDSP-5600 Description SeriesSeriesSeriesSeriesUnits Average Power per Segment or DP 9610580105mW Peak Forward Current per 160[1]90[3]60[5]90[7]mA Segment or DPDC Forward Current per Segment or DP 40[2]30[4]20[6]3018]mA Operating Temperature Range -20 to +100[9]-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment or DP 3.0V Lead Solder Temperature for 3 Seconds 260°C(1.60 mm [0.063 in.] below seating plane)Absolute Maximum Ratings6. Derate above 81°C at 0.52 mA/°C.7. See Figure 9 to establish pulsed conditions.8. Derate above 39°C at 0.37 mA/°C.9. For operation below -20°C, contact your local Agilent components sales office or an authorized distributor.Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2,5]I V9.116.0mcd I F = 20 mA(Digit Average)1.8I F = 20 mAForward Voltage/Segment or DP V F V2.03.0I F = 100 mAH15XPeak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin400°C/W/to-Pin SegHigh Efficiency RedDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions9002800I F = 10 mA Luminous Intensity/Segment[1,2,6]I Vµcd(Digit Average)3700I F = 60 mA Peak:1 of 6 dfForward Voltage/Segment or DP V F 2.1 2.5V I F = 20 mA 55XXPeak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin345°C/W/to-Pin SegYellowDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions6001800I F = 10 mA Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)2750I F = 60 mA Peak:1 of 6 dfForward Voltage/Segment or DP V F 2.1 2.5V I F = 20 mA 57XXPeak WavelengthλPEAK583nmDominant Wavelength[3,7]λd581.5586592.5nmReverse Voltage/Segment or DP[4]V R 3.040V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin345°C/W/to-Pin SegOrangeDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment I V 2.37mcd I F = 10 mA(Segment Average)[1,2]Forward Voltage/Segment or DP V F 2.1 2.5V I F = 20 mAPeak WavelengthλPEAK600nm H40x Dominant Wavelength[3]λd603nm I F = 10 mA K40x Reverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µA Temperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin345°C/W/to-Pin SegDeviceSeriesHDSP-ParameterSymbol Min.Typ.Max.UnitsTest Conditions 9002500I F = 10 mALuminous Intensity/Segment [1,2]I Vµcd(Digit Average)`3100I F = 60 mA Peak:1 of 6 df Forward Voltage/Segment or DPV F 2.1 2.5V I F = 10 mA56XXPeak Wavelength λPEAK 566nm Dominant Wavelength [3,7]λd 571577nm Reverse Voltage/Segment or DP [4]V R 3.050V I R = 100 µATemperature Coefficient of ∆V F /°C -2mV/°C V F /Segment or DPThermal Resistance LED Junction-R θJ-Pin345°C/W/to-PinSegHigh Performance GreenNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd , is derived from the CIE chromaticity diagram and is that single wavelength which defines the color of the device.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. For low current operation, the AlGaAs HDSP-H10X series displays are recommended. They are tested at 1 mA dc/segment and are pin for pin compatible with the HDSP-H15X series.6. For low current operation, the HER HDSP-555X series displays are recommended. They are tested at 2 mA dc/segment and are pin for pin compatible with the HDSP-550X series.7. The Yellow (HDSP-5700) and Green (HDSP-5600) displays are categorized for dominant wavelength. The category is designated by a number adjacent to the luminous intensity category letter.AlGaAs RedFigure 3. Maximum Allowable DC Current vs.Ambient Temperature.Figure 4. Forward Current vs.Forward Voltage.HER, Yellow, Green, OrangeFigure 7. Maximum Tolerable Peak Currentvs. Pulse Duration – HER, Orange.I D C M A X . – M A X I M U M D C C U R R E N T P E R S E G M E N T – m AT A – AMBIENT TEMPERATURE – °C 5030102051525354045I F – F O R W A R D C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 20 m A)I F – FORWARD CURRENT PER SEGMENT – mA204010305152535ηP E A K – N O R M A L IZ E D R E L A T I V E E F F I C I E N C YI PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA4550110120Figure 11. Forward Current vs.Forward Voltage.Figure 9. Maximum Tolerable PeakCurrent vs. Pulse Duration – Green.Figure 10. Maximum Allowable DC Current vs.Ambient Temperature.Figure 12. Relative LuminousIntensity vs. DC Forward Current.Figure 13. Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Current.Electrical/OpticalFor more information onelectrical/optical characteristics,please see Application Note 1005.Contrast EnhancementFor information on contrastenhancement please see Application Note 1015.Soldering/CleaningCleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from thechlorinated hydrocarbon family(methylene chloride, trichloro–ethylene, carbon tetrachloride,etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs please refer to Application Note 1027.I F – F O R W A R D C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 10 m A )I F – DC FORWARD CURRENT – mAηV – R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D T O 1 A T 10 m A P E R S E G ME N T )0.6I PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA902070801001.61.41.31.10.90.860504030100.71.01.21.5HDSP-H15x IV Bin Category Min.Max.K 9.2016.90L 13.8025.30M 20.7038.00N 31.1056.90O 46.6085.40Intensity Bin Limits (mcd)AlGaAs RedHDSP-550x/552x IV Bin Category Min.Max.E 0.91 1.67F 1.37 2.51G 2.05 3.76H 3.08 5.64I 4.628.64J 6.9312.70K 10.3919.04HERHDSP-570x/572xIV Bin Category Min.Max.D 0.61 1.11E 0.91 1.67F 1.37 2.51G 2.05 3.76H 3.08 5.64I 4.628.64J 6.9312.70K 10.3919.04YellowHDSP-560x/562x IV Bin Category Min.Max.E 0.91 1.67F 1.37 2.51G 2.05 3.76H 3.08 5.64I 4.618.46GreenColor CategoriesNote:All categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representatives for further clarification/information.10HDSP-H40x/K40x IV Bin Category Min.Max.B 0.77 1.17C 0.95 1.45D 1.19 1.82E 1.49 2.27F 1.85 2.89G 2.32 3.54H 2.904.43Orange元器件交易网元器件交易网/semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(408) 654-8675Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 271 2451India, Australia, New Zealand: (+65) 271 2394Japan: (+81 3) 3335-8152(Domestic/Interna-tional), or 0120-61-1280(Domestic Only)Korea: (+65) 271 2194Malaysia, Singapore: (+65) 271 2054Taiwan: (+65) 271 2654Data subject to change.Copyright © 2002 Agilent Technologies, Inc.Obsoletes 5988-0383ENJanuary 17, 20025988-4273EN。

HDSP-Exxx中文资料

Seven Segment Displays—10mm (0.40 inch), 10mm Slim Font,10.9mm (0.43 inch), 14.2mm (0.56inch),13mm Slim FontReliability DataDescriptionThe following cumulative test results have been obtained from testing performed at HP Optoelec-tronics Division in accordance with the latest revision of MIL- STD-883.Hewlett-Packard tests parts at the absolute maximum rated condi-tions recommended for the device. The actual performance you obtain from HP parts depends on the electrical and environmen-tal characteristics of your applica-Point Typical PerformanceStress Test Total DeviceUnits Total Failure Rate ColorsConditionsHoursTestedFailedMTBF(% /1 K Hours)HER T A = 55°C, I F = 30 mA 420,000630420,000≤0.23 %AlGaAs T A = 55°C, I F = 30 mA 378,000630378,000≤0.26 %Green T A = 55°C, I F = 30 mA 252,000840252,000≤0.40 %Orange T A = 55°C, I F = 30 mA 147,000210147,000≤0.26 %YellowT A = 55°C, I F = 20 mA147,00021147,000≤0.26 %Table 1. Life TestsDemonstrated PerformanceFailure Rate PredictionThe failure rate of semiconductor devices is determined by the junction temperature of thedevice. The relationship between ambient temperature and actual junction temperature is given by the following:T J (°C) = T A (°C) + θJA P AVG where T A = ambient temperature in °CθJA = thermal resistance of junction-to-ambient in °C/wattHDSP-Exxx, HDSP-Fxxx,HDSP-Gxxx, HDSP- Hxxx,HDSP-Kxxx, HDSP-3xxx,HDSP-4xxx, HDSP-5xxx,HDSP-6xxx, HDSP-7xxxtion but will probably be better than the performance outlined in Table 1.P AVG = average power dissipated in wattsThe estimated MTBF and failure rate at temperatures lower than the actual stress temperature can be determined by using anArrhenius model for temperature acceleration. Results of such calculations are shown in the table below using an activation energy of 0.43 eV (reference MIL-HDBK-217).Table 2.Point Typical Performance in Time[2]Performance[1] in Time(90%Confidence) Ambient Temp.Junction Temp.Failure Rate Failure Rate I F(°C)(°C)MTBF[1](%/1K Hours)MTBF[2](%/1K Hours) 3085115457,0000.219%118,0000.850% 751056430000.156%165,0000.605%6595920,0000.109%237,0000.423%55851,344,0000.074%346,0000.289%45752,006,0000.050%516,0000.194%35653,066,0000.033%788,0000.127%25554,809,0000.021%1,236,0000.081% Notes:1.The point typical MTBF (which represents 60% confidence level) is the total device hours divided by the number offailures. In the case of zero failures, one failure is assumed for this calculation.2.The 90% confidence MTBF represents the minimum level of reliability performance which is expected from 90% of allsamples. This confidence interval is based on the statistics of the distribution of failures. The assumed distribution of failures is exponential. This particular distribution is commonly used in describing useful life failures. Refer toMIL-STD-690B for details on this methodology.3. A failure is any LED which does not emit light.Example of Failure Rate Calculation:Assume a device operating 8 hours/day, 5 days a week. The utilization factor, given 168 hours/week is:(8 hours/day) x (5 days/week) ÷ (168 hours/week) = 0.25The point failure rate per year (8760 hours) at 25°C ambient temperature is:(0.021%/1K hours) x 0.25 x (8760 hours/year) = 0.045% per yearSimilarly, 90% confidence level failure rate per year at 25°C:(0.081%/1K hours) x 0.25 x (8760 hours/year) = 0.177% per yearTable 3. Environmental TestsUnits Units Test Name Reference Test Conditions Tested Failed Solder Heat Resistance MIL-STD-883 Method 2003260°C, 3 seconds100 Temperature Cycle MIL-STD-883 Method 1010-55°C to 100°C, 15 min. dwell,260015 min. transfer, 20 cyclesHumidity Storage JIS C 7021 Method B-1185°C, 85% RH, 168 Hours2520Solderability MIL-STD-883 Method 200316 Hours steam aging followed by100solder dip at 260°C for 5 secondsSalt Atmosphere MIL-STD-883 Method 100935°C, 24 Hours100Table 4. Mechanical TestsUnits Units Test Name Reference Test Conditions Tested Failed Terminal Strength MIL-STD-883 Method 2004 Cond. A 1 lb. for 30 sec.110 Lead Strength MIL-STD-883 Method 2004 Cond. B 3 X 90 degree bend, 8 oz.110 Vibration Variable MIL-STD-883 Method 2007 2 Hours for each X, Y, Z axis at220 Frequency20 Gs, 10 to 2k Hz; 20 min. sweep/go/ledFor technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-800-235-0312 or 408-654-8675 • Far East/Australasia: Call your local HP sales office. Japan: (81 3) 3335-8152 • Europe: Call your local HP sales office. • Data subject to change. • Copyright © 1999 Hewlett-Packard Co.5968-7071E (8/99)。

5082-333Y-GK000中文资料

DescriptionThis 7.62 mm (0.3 inch) LED seven-segment display uses industry standard size package and pinout. The device isavailable in either common anodeAgilent HDSP-331x/332E/333x/334x Series 7.62 mm (0.3 inch) General Purpose Seven-Segment DisplayData SheetFeatures•Industry standard size•Industry standard pinout7.62 mm (0.4 inch) character height DIP lead on 2.54 mm •Choice of colorsHigh Efficiency Red (HER), Green,AlGaAs Red, and Yellow •Excellent appearanceEvenly lighted segments gray pack-age gives optimum contrast ± 50° viewing angle •Design flexibilityCommon anode or common cathode Single digitLeft and right hand decimal point•Categorized for luminous intensityGreen and yellow categorized for color Applications•Suitable for indoor use•Not recommended for industrial application, i.e., operating temperature requirementsexceeding +85˚C or below –25˚C [1]•Extreme temperature cycling not recommendedNote:1.For additional details, please contact your local Agilent sales office or an authorized distributor.Devices HERGreenAlGaAs Red Yellow DescriptionPackage Drawing HDSP-331E HDSP-331GHDSP-331AHDSP-331YCommon Anode, Right Hand and A Left Hand DecimalHDSP-332E Common Anode, Right Hand and Left A Hand Decimal without Pin 4, 5 and 12HDSP-333E HDSP-333G HDSP-333A HDSP-333Y Common Cathode, Right Hand B DecimalHDSP-334EHDSP-334GHDSP-334AHDSP-334YCommon Cathode, Right Hand DecimalCor common cathode. The choice of colors includes High Efficiency Red (HER), Green, AlGaAs Red,and Yellow. The gray facedisplays are suitable for indoor use.Part Numbering SystemNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative for details.2. Bin options refer to shippable bins for a part number. Color and Intensity Bins are typically restricted to 1bin per tube (exceptions may apply). Please refer to respective datasheet for specific bin limit information.5082 -X X X X-X X X X X HDSP-X X X X-X X X X XMechanical Options [1]00: No Mechanical Option Color Bin Options [1,2]0: No Color Bin LimitationMaximum Intensity Bin [1,2]0: No Maximum Intensity Bin Limitation Minimum Intensity Bin [1,2]0: No Minimum Intensity Bin Limitation Device Configuration/Color [1]A: AlGaAs RedE: High Efficiency Red G: Green Y: YellowDevice Specific Configuration [1]Refer to Respective Datasheet Package [1]Refer to Respective Datasheet∅1.1FRONT VIEWTOP END VIEWA F GB C L.DPD E DIMENSIONS IN MILLIMETERS (INCHES)R.DPNOTE: HDSP-332E DOES NOT HAVE PIN 4, 5 AND 12.Package Drawing APackage Drawing B∅1.1FRONT VIEW TOP END VIEWAF G BCDEDIMENSIONS IN MILLIMETERS (INCHES)R.DPPackage Drawing C∅1.1FRONT VIEW TOP END VIEWAF G BCDEDIMENSIONS IN MILLIMETERS (INCHES)R.DP611310872113.14 COMPIN N0.123678910111314CONNECTION CATHODE A CATHODE F COMMON ANODE CATHODE L.DP CATHODE E CATHODE D CATHODE R.DP CATHODE C CATHODE G CATHODE B COMMON ANODEPINS 4, 5, 12: NO CONNECTION FORHDSP-331E/331G/331Y/331A AND NO PIN FOR HDSP-332EHDSP-331E/331G/331Y/331A/332E9Common AnodeCommon Cathode14138761294.12 COMPIN NO.1246789121314CONNECTION ANODE F ANODE G COMMON CATHODEANODE E ANODE D ANODE C ANODE DP COMMON CATHODEANODE B ANODE AHDSP-333E/333G/333Y/333APINS 3, 5, 10, 11: NCCommon Cathode1098524371.6 COMPIN NO.12345678910CONNECTION COMMON CATHODEANODE E ANODE G ANODE F ANODE D COMMON CATHODEANODE DP ANODE C ANODE B ANODE AHDSP-334E/334G/334Y/334APINS 11, 12, 13, 14: NCElectrical/Optical Characteristics at T A = 25˚C High Efficiency Red (HER)Devices HDSP-ParameterSymbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment I V 1.15mcd I F = 5 mA 0.81.80mcd I F = 10 mA Forward Voltage V F2.05 2.40V I F = 20 mAPeak Wavelength λPEAK 635nm Dominant Wavelength λd 620nm Reverse VoltageVR5VI R = 100 µAGreen Devices HDSP-ParameterSymbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment I V 0.8 2.00mcd I F = 10 mA Forward Voltage V F 2.07V I F = 10 mA 1.802.25 2.60V I F = 20 mAPeak Wavelength λPEAK 568nm Dominant Wavelength λd 573nm Reverse VoltageVR5VI R = 100 µAAbsolute Maximum Ratings at T A = 25˚C DescriptionHERGreenAlGaAs Red Yellow HDSP-33xE HDSP-33xG HDSP-33xA HDSP-33xY Units Power Dissipation Segment 65653052mW Forward Current Segment25[1]25[2]15[3]20[4]mA Peak Forward Current per Segment 1001008080mA (1/10 Duty Factor at 10 kHz)Operating Temperature Range –35 to +85–35 to +85–35 to +85–35 to +85˚C Storage Temperature Range–35 to +85–35 to +85–35 to +85–35 to +85˚C Reverse Voltage per Segment or DP5555V Wave Soldering Temperature for 3 Seconds 250250250250˚C(at 2 mm Distance from the Body)Notes:1.Derate above 25˚C at 0.33 mA/˚C.2.Derate above 25˚C at 0.33 mA/˚C.3.Derate above 25˚C at 0.2 mA/˚C.4.Derate above 25˚C at 0.27 mA/˚C.331G 333G 334G331E 332E 333E 334EYellow Devices HDSP-ParameterSymbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment I V 0.71mcd I F = 5 mA 0.801.50mcd I F = 10 mA Forward Voltage V F2.15 2.60V I F = 20 mAPeak Wavelength λPEAK 595nm Dominant Wavelength λd 590nm Reverse VoltageVR5VI R = 100 µAAlGaAs Red Devices HDSP-ParameterSymbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment I V 3.93mcd I F = 5 mA 2.0014.20mcd I F = 10 mA Forward Voltage V F 1.85 2.00V I F = 20 mAPeak Wavelength λPEAK 660nm Dominant Wavelength λd 643nm Reverse VoltageVR5VI R= 100 µA331Y 333Y 334Y331A 333A 334AIntensity Bin Limits (mcd at 10 mA)HER/Green/Yellow AlGaAs RedBin Name Min.[1]Max.[1]Min.[1]Max.[1]G 0.801 1.250NA NA H 1.251 2.000NA NA I 2.001 3.200 2.001 3.200J NA NA 3.201 5.050KNA NA5.0518.000Note:1.Tolerance for each bin limit is ± 10%.Color Bin Limits (nm at 10 mA)Dominant Wavelength (nm)Color Bin Min.Max.Note:1.Tolerance for each bin limit is 1 nm.Figure 1. Maximum allowable average or DC current vs. ambient temperature.Figure 2. Forward current vs. forward voltage.Figure 3. Relative luminous intensity vs. DC forward current.High Efficiency Red (HER)Figure 4. Relative efficiency (luminousintensity per unit current) vs. peak current.020*********T A – AMBIENT TEMPERATURE – °C M A X I M U M D C C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VI F – F O R W A R D C U R R E N T P E R S E G M E N T – m A2.52.01.51.00.50510********IF – FORWARD CURRENT FOR SEGMENT – mAR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 10 m A )35R E L A T I V E EF F I C I E N C Y (N O R M A L I Z E D T O 1 A T 10 m A )1.4005101520253035404550I PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA0.20.40.60.81.01.2Figure 7. Relative luminous intensity vs. DC forward current.Figure 8. Relative efficiency (luminous intensity per unit current) vs. peak current.Figure 5. Maximum allowable average or DC current vs. ambient temperature.Figure 6. Forward current vs. forward voltage.Green30T A – AMBIENT TEMPERATURE – °CM A X I M U M D C C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VI F – F O R W A R D C U R R E N T P E R S E G M E N T – m A3.02.52.01.51.00.500510********I F – FORWARD CURRENT FOR SEGMENT – mAR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 10 m A )35R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D T O 1 A T 10 m A )05101520253035404550I PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA0.20.40.60.81.01.2Figure 9. Maximum allowable average or DC current vs. ambient temperature.Figure 10. Forward current vs. forward voltage.Figure 11. Relative luminous intensity vs. DC forward current.Figure 12. Relative efficiency (luminous intensity per unit current) vs. peak current.AlGaAs RedT A – AMBIENT TEMPERATURE – °C M A X I M U M D C C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VI F – F O R W A R D C U R R E N T P E R S E G M E N T – m A3.02.52.01.51.00.500510********I F – FORWARD CURRENT FOR SEGMENT – mAR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 10 m A )35R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D T O 1 A T 10 m A )05101520253035404550I PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA0.20.40.60.81.01.2Figure 13. Maximum allowable average or DC current vs. ambient temperature.Figure 14. Forward current vs. forward voltage.Figure 15. Relative luminous intensity vs. DC forward current.Figure 16. Relative efficiency (luminous intensity per unit current) vs. peak current.YellowT A – AMBIENT TEMPERATURE – °C M A X I M U M D C C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VI F – F O R W A R D C U R R E N T P E R S E G M E N T – m A3.52.52.01.51.00.50051015202530I F – FORWARD CURRENT FOR SEGMENT – mAR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 10 m A )353.0R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D T O 1 A T 10 m A )1.4005101520253035404550I PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA0.20.40.60.81.01.2/semicon-ductorsFor product information and a complete list of distributors, please go to our web site. For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939Japan: (+81 3) 3335-8152(Domestic/ International), or 0120-61-1280(Domestic Only)Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843Data subject to change.Obsoletes 5988-2971ENJuly 17, 20045988-9421EN。

5082-K111-HG000中文资料

DevicesAlGaAs Orange Red HER Green Package HDSP-HDSP-HDSP-HDSP- DescriptionDrawingA411A111A211A5117.6 mm Common Anode Right Hand Decimal A A413A113A213A5137.6 mm Common Cathode Right Hand Decimal B F411F111F211F51110 mm Common Anode Right Hand Decimal C F413F113F213F51310 mm Common Cathode Right Hand Decimal D G411G111G211G51110 mm Two Digit Common Anode Right Hand Decimal E G413G113G213G51310 mm Two Digit Common Cathode Right Hand Decimal F H411H111H211H51114.2 mm Common Anode Right Hand Decimal G H413H113H213H51314.2 mm Common Cathode Right Hand Decimal H K411K111K211K51114.2 mm Two Digit Common Anode Right Hand Decimal I K413K113K213K51314.2 mm Two Digit Common Cathode Right Hand DecimalJBlack Surface Seven Segment Displays Technical DataFeatures• Black Surface and Color Tinted Epoxy• Industry Standard Size • Industry Standard Pinout • Choice of Character Size 7.6 mm (0.30 in.), 10 mm (0.40in.), 14.2 mm (0.56 in.)• Choice of ColorsAlGaAs Red, High Efficiency Red (HER), Green, Orange • Excellent Appearance Evenly Lighted Segments ±50° Viewing Angle• Design FlexibilityCommon Anode or Common CathodeSingle and Two Digit• Categorized for Luminous IntensityCategorized for Color: Green Use of Like Categories Yields a Uniform Display• Excellent for Long Digit String MultiplexingDescriptionThese devices use industrystandard size package and pinout.Available with black surfaceHDSP-AX11/-AX13 Series HDSP-FX11/-FX13 Series HDSP-GX11/-GX13 Series HDSP-HX11/-HX13 Series HDSP-KX11/-KX13 Seriesfinish. All devices are available as either common anode or common cathode.Typical applications includeappliances, channel indicators of TV, CATV converters, game machines, and point of sale terminals.Part Numbering System5082 -X X X X-X X X X XHDSP-X X X X-X X X X XMechanical Options[1]00: No Mechanical OptionColor Bin Options[1,2]0: No Color Bin LimitationMaximum Intensity Bin[1,2]0: No Maximum Intensity Bin LimitationMinimum Intensity Bin[1,2]0: No Minimum Intensity Bin LimitationDevice Configuration/Color[1]1: Common Anode3: Common CathodeDevice Specific Configuration[1]Refer to Respective DatasheetPackage[1]A: 7.6 mm (0.3 inch) Single Digit Seven Segment DisplayF: 10 mm (0.4 inch) Single Digit Seven Segment DisplayG: 10 mm (0.4 inch) Dual Digit Seven Segment DisplayH: 14.2 mm (0.56 inch) Single Digit Seven Segment DisplayK: 14.2 mm (0.56 inch) Dual Digit Seven Segment Display Notes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearestAgilent representative for details.2. Bin options refer to shippable bins for a part number. Color and Intensity Bins are typically restricted to 1bin per tube (exceptions may apply). Please refer to respective datasheet for specific bin limit information.Package Dimensions (7.6 mm Series)Internal Circuit DiagramPackage Dimensions (10 mm Series: Single)Internal Circuit DiagramPackage Dimensions (10 mm Series: Two Digit)Internal Circuit DiagramPackage Dimensions (14.2 mm Series: Single)Internal Circuit DiagramPackage Dimensions (14.2 mm Series: Two Digit)Internal Circuit Diagram2DIGIT NO. 1 CATHODE1Absolute Maximum RatingsAlGaAs Red HER/Orange GreenHDSP-X11X HDSP-X21X/X41X HDSP-X51X Description Series Series Series Units Average Power per Segment37105105mW or DPPeak Forward Current per4590[1]90[3]mA Segment or DPDC Forward Current per15[5]30[2]30[4]mA Segment or DPOperating Temperature Range–20 to +100 –40 to +100°C Storage Temperature Range–55 to +100°C Reverse Voltage per 3.0V Segment or DPWave Soldering Temperature for250°C 3 Seconds (1.60 mm [0.063 in.]below Body)Notes:1. See Figure 5 to establish pulsed conditions.2. Derate above 53°C at 0.45 mA/°C (see Figure 7).3. See Figure 6 to establish pulsed conditions.4. Derate above 39°C at 0.37 mA/°C (see Figure 7).5. Derate above 91°C at 0.53 mA/°C (see Figure 1).Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDevice SeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions A11X Luminous Intensity/Segment[1,2]I V315600µcd I F = 1 mA (Digit Average)3600I F = 5 mAF11X, G11X330650I F = 1 mA3900I F = 5 mAH11X, K11X400700I F = 1 mA4200I F = 5 mAAll Devices Forward Voltage/Segment or DP V F 1.6 2.0V I F = 1 mA1.7I F = 5 mA1.822I F = 20 mA PeakPeak WavelengthλP EAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPA11X Thermal Resistance LED RθJ-PIN255°C/W/Junction-to-Pin Seg.F11X, G11X320H11X, K12X400OrangeDevice SeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions A41X Luminous Intensity/Segment I V0.70mcd I F = 5 mA (Segment Average)[1,2]F41X, G41X 1.0I F = 5 mAH41X, K41X 2.37I F = 10 mAAll Forward Voltage/Segment or DP V F 2.0 2.5V I F = 20 mA DevicesPeak WavelengthλPEAK600nmDominant Wavelength[3]λd603nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C–2mV/°CV F/Segment or DPA41X Thermal Resistance LED RθJ-PIN200°C/W/Junction-to-Pin Seg.F41X, G41X320H41X, K41X345High Efficiency RedDevice SeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions A21X Luminous Intensity/Segment[1,2]I V360980µcd I F = 5 mA (Digit Average)5390I F = 20 mAF21X, G21X4201200I F = 5 mAH21X, K21X9002800I F = 10 mA3700I F = 60 mA Peak:1/6 Duty Factor All Forward Voltage/Segment or DP V F 2.0 2.5V I F = 20 mA DevicesPeak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPA21X Thermal Resistance LED RθJ-PIN200°C/W/Junction-to-Pin Seg.F21X, G21X320H21X, K21X345High Performance GreenDevice SeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test ConditionsA51X Luminous Intensity/Segment[1,2]I V8603000µcd I F = 10 mA (Digit Average)6800I F = 20 mAF51X, G51X10303500I F = 10 mAH51X, K51X9002500I F = 10 mA3100I F = 60 mA Peak:1/6 Duty FactorAll Forward Voltage/Segment or DP V F 2.1 2.5V I F = 10 mADevicesPeak WavelengthλPEAK566nmDominant Wavelength[3,5]λd571577nmReverse Voltage/Segment or DP[4]V R 3.050V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPA51X Thermal Resistance LED RθJ-PIN200°C/W/Junction-to-Pin Seg.F51X, G51X320H51X, G51X345Notes:1. Case temperature of device immediately prior to the intensity measurement is 25°C.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is that single wavelength which defines the color ofthe device.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. Green (HDSP-A51X/F51X/G51X/H512X/K51X) series displays are categorized for dominant wavelength. The category is designated bya number adjacent to the luminous intensity category letter.Figure 3. Relative Luminous Intensity vs. DC Forward Current.Figure 4. Relative Efficiency (LuminousIntensity per Unit Current) vs. Peak Current.Figure 1. Maximum Allowable Average orDC Current vs. Ambient Temperature.Figure 2. Forward Current vs. Forward Voltage.16024681012142010090807060504030T – AMBIENT TEMPERATURE – °C AI A V E . M A X – M A X I M U M A V E R A G E F O R W A R D C U R R E N T P E R S E G M E N T – m AF 1201102018F 50.020.010.05.02.01.00.50.10.51.01.52.02.5V – FORWARD VOLTAGE – VF I – F O R W A R D C U R R E N TP E R S E G M E N T – m A20105210.50.20.10.10.20.51251020R E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 1 m A )I – FORWARD CURRENT PER SEGMENT – mAF I – PEAK FORWARD CURRENTPER SEGMENT – mAPEAK η –R E L A T I V E E F F I C I E N C Y – N O R M A L I Z E D T O 1 A T 1 m AP E A K 1.31.21.11.00.90.80.7AlGaAs RedHER, Green, OrangeFigure 7. Maximum Allowable DCCurrent vs. Ambient Temperature.Figure 8. Forward Current vs.Forward Voltage Characteristics.Figure 9. Relative Luminous Intensity vs. DC Forward Current.Figure 10. Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Current.40051015202530352010090807060504030T – AMBIENT TEMPERATURE – °CA I M A X – M A X I M U M D C C U R R E N T P E R S E G M E N T – m AD C 1201105045010080604020I – F O R W A R D C U R R E N T P E R S E G M E N T – m AF 2.04.03.01.0V –FORWARD VOLTAGE – VF 05.0ηP E A K – R E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 5 m A F O R H E R ,A N D T O 1 A T 10 m A F O R G R E E N )150108642205301025I – FORWARD CURRENT PER SEGMENT – mAF 0I – PEAK FORWARD CURRENTPER SEGMENT – mAPEAK ηP E A K – R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D T O 1 A T 5 m A F O R H E R ,A N D 10 m A F O R G R E E N )Figure 5. Maximum Tolerable Peak Currentvs. Pulse Duration – HER, Orange.Figure 6. Maximum Tolerable Peak Current vs. Pulse Duration – Green.R A T I O O F M A X I M U M O P E R A T I N G P E A K C U R R E N T T O T E M P E R A T U R E D E R A T E D D C C U R R E N TI P E A K F I M A X D C t – PULSE DURATION – µsP 101100DC R A T I O O F M A X I M U M O P E R A T I N G P E A K C U R R E N T T O T E M P E R A T U R E D E R A T E D D C C U R R E N TI P E A K FI M A X D C t – PULSE DURATION – µs P 101100DCHDSP-A1xx IV Bin Category Min.Max.E 0.3150.520F 0.4280.759G 0.621 1.16H 0.945 1.71I 1.40 2.56J 2.10 3.84K 3.14 5.75L 4.708.55Intensity Bin Limits (mcd)AlGaAs RedHDSP-F1xx/G1xx IV Bin Category Min.Max.D 0.3910.650E 0.5320.923F 0.755 1.39G 1.13 2.08H 1.703.14HDSP-H1xx/K1xx IV Bin Category Min.Max.C 0.4150.690D 0.5650.990E 0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50OrangeHDSP-A41XIV Bin Category MinMaxA 0.2840.433B 0.3540.541C 0.4430.677D 0.5540.846E 0.692 1.057F 0.856 1.322G 1.082 1.652H 1.352 2.066I 1.692 2.581J 2.114 3.227K 2.641 4.034L 3.300 5.042M 4.127 6.303N 5.1577.878HDSP-F41X/G41XIV Bin Category MinMaxC 0.4850.890D 0.728 1.333E 1.091 2.000F 1.636 3.000G 2.454 4.500H 3.6826.751HDSP-H41X/K41XIV Bin Category MinMaxB 0.77 1.17C 0.95 1.45D 1.19 1.82E 1.49 2.27F 1.85 2.89G 2.32 3.54H 2.904.43Intensity Bin Limits (mcd), continued HERMin.Max.B0.3420.630C0.5160.946D0.774 1.418E 1.160 2.127F 1.740 3.190G 2.610 4.785H 3.9157.177Min.Max.C0.4850.890D0.728 1.333E 1.091 2.000F 1.636 3.000G 2.454 4.500H 3.682 6.751Min.Max.E0.91 1.67F 1.37 2.51G 2.05 3.76H 3.08 5.64I 4.628.64J 6.9312.70K10.3919.04Contrast EnhancementFor information on contrast enhancement, please see Application Note 1015.Soldering/CleaningFor information on soldering LEDs, please refer to Application Note 1029.Electrical/OpticalFor more information onelectrical/optical characteristics,please see Application Note 1005.Color CategoriesNote:All categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representatives for further clarification/information.HDSP-A5xx IV Bin Category Min.Max.H 0.86 1.58I 1.29 2.37J 1.94 3.55K 2.90 5.33L 4.378.01Intensity Bin Limits (mcd), continued GreenHDSP-F5xx/G5xx IV Bin Category Min.Max.H 1.54 2.82I 2.31 4.23J 3.46 6.34K 5.189.50L 7.7814.26HDSP-H5xx/K5xx IV Bin Category Min.Max.E 0.91 1.67F 1.37 2.51G 2.05 3.76H 3.08 5.64I 4.618.46/semiconductors For product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/Interna-tional), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc. Obsoletes 5988-1742ENJuly 17, 20045988-4433EN。

HDSPE103资料

Features• Low Power Consumption • Industry Standard Size• Industry Standard Pinout • Choice of Character Size7.6 mm (0.30 in), 10 mm (0.40 in), 10.9 mm (0.43 in), 14.2 mm (0.56 in), 20 mm (0.80 in)• Choice of ColorsAlGaAs Red, High Efficiency Red (HER), Yellow, Green• Excellent Appearance Evenly Lighted Segments±50° Viewing Angle• Design FlexibilityCommon Anode or Common CathodeSingle and Dual DigitLeft and Right Hand Decimal Points±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display• Excellent for Long Digit String Multiplexing DescriptionThese low current seven segment displays are designed for applica-tions requiring low power consumption. They are tested and selected for their excellent low current characteristics to ensure that the segments are matched at low currents. Drive currents as low as 1 mA per segment are available.Pin for pin equivalent displays are also available in a standard current or high light ambient design. The standard current displays are available in all colors and are ideal for most applica-tions. The high light ambient displays are ideal for sunlight ambients or long string lengths. For additional information see the 7.6 mm Micro Bright Seven Segment Displays, 10 mm Seven Segment Displays, 7.6 mm/10.9 mm Seven Segment Displays, 14.2 mm Seven Segment Displays, 20 mm Seven Segment Displays, or High Light Ambient Seven Segment Displays data sheets.Low Current Seven Segment DisplaysTechnical Data HDSP-335X SeriesHDSP-555X SeriesHDSP-751X SeriesHDSP-A10X Series HDSP-A80X Series HDSP-A90X Series HDSP-E10X Series HDSP-F10X Series HDSP-G10X Series HDSP-H10X Series HDSP-K12X, K70X SeriesHDSP-N10X SeriesPackage DimensionsDevicesAlGaAs HERYellow Green Package HDSP-HDSP-HDSP-HDSP-DescriptionDrawingA1017511A801A9017.6 mm Common Anode Right Hand Decimal A A1037513A803A9037.6 mm Common Cathode Right Hand Decimal B A1077517A807A9077.6 mm Common Anode ±1. Overflow C A1087518A808A9087.6 mm Common Cathode ±1. Overflow D F10110 mm Common Anode Right Hand Decimal E F10310 mm Common Cathode Right Hand Decimal F F10710 mm Common Anode ±1. Overflow G F10810 mm Common Cathode ±1. OverflowH G10110 mm Two Digit Common Anode Right Hand Decimal X G10310 mm Two Digit Common Cathode Right Hand Decimal Y E100335010.9 mm Common Anode Left Hand Decimal I E101335110.9 mm Common Anode Right Hand Decimal J E103335310.9 mm Common Cathode Right Hand Decimal K E106335610.9 mm Universal ±1. Overflow [1]L H101555114.2 mm Common Anode Right Hand Decimal M H103555314.2 mm Common Cathode Right Hand Decimal N H107555714.2 mm Common Anode ±1. Overflow O H108555814.2 mm Common Cathode ±1. OverflowP K121K70114.2 mm Two Digit Common Anode Right Hand Decimal R K123K70314.2 mm Two Digit Common Cathode Right Hand Decimal S N10020 mm Common Anode Left Hand Decimal Q N10120 mm Common Anode Right Hand Decimal T N10320 mm Common Cathode Right Hand Decimal U N10520 mm Common Cathode Left Hand Decimal V N10620 mm Universal ±1. Overflow [1]WNote:1. Universal pinout brings the anode and cathode of each segment’s LED out to separate pins. See internal diagrams L or W.Package Dimensions (cont.)Package Dimensions (cont.)*The Side View of package indicates Country of Origin.Package Dimensions (cont.)Package Dimensions (cont.)元器件交易网7 Package Dimensions (cont.)Internal Circuit DiagramInternal Circuit Diagram (cont.)Absolute Maximum RatingsAlGaAs Red HERHDSP-A10X/E10X/HDSP-751X/Yellow GreenH10X/K12X/N10X/335X/555X/HDSP-A80X HDSP-A90X Description F10X, G10X Series K70X Series Series Series Units Average Power per Segment or DP375264mW Peak Forward Current per 45mA Segment or DPDC Forward Current per15[1]15[2]mA Segment or DPOperating Temperature Range-20 to +100-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment 3.0V or DPLead Solder Temperature for 3Seconds (1.60 mm [0.063 in.] below 260°C seating plane)Notes:1. Derate above 91°C at 0.53 mA/°C.2. Derate HER/Yellow above 80°C at 0.38 mA/°C and Green above 71°C at 0.31 mA/°C.元器件交易网10Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions315600I F = 1 mA A10X3600I F = 5 mA330650I F = 1 mA F10X, G10X3900I F = 5 mA390650I F = 1 mA E10X Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)3900I F = 5 mA400700I F = 1 mA H10X, K12X4200I F = 5 mA270590I F = 1 mA N10X3500I F = 5 mA1.6I F = 1 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA1.82.2I F = 20 mA PkAll Devices Peak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 mATemperature Coefficient of∆V F/°C-2 mV mV/°CV F/Segment or DPA10X255F10X, G10X320E10X340Thermal Resistance LED RθJ-PIN°C/W/SegH10X, K12X Junction-to-Pin400N10X430High Efficiency RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions160270I F = 2 mA 751X1050I F = 5 mA200300I F = 2 mA Luminous Intensity/Segment[1,2]I V mcd(Digit Average)1200I F = 5 mA335X, 555X,K70X270370I F = 2 mA1480I F = 5 mA1.6I F = 2 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA2.1 2.5I F = 20 mA Pk All Devices Peak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 mATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DP751X200335X Thermal Resistance LED RθJ-PIN280°C/WJunction-to-Pin555X, K70X345YellowDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250420I F = 4 mA(Digit Average)I V mcd1300I F = 10 mA1.7I F = 4 mAForward Voltage/Segment or DP V F 1.8V I F = 5 mA A80X2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK583nmDominant Wavelength[3,5]λd581.5585592.5nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 mATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinGreenDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250475I F = 4 mA(Digit Average)I V mcd1500I F = 10 mA1.9I F = 4 mAForward Voltage/Segment or DP V F 2.0V I F = 10 mA A90X2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK566nmDominant Wavelength[3,5]λd571577nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 mATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is the single wavelength which defines the color of thedevice.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. The yellow (HDSP-A800) and Green (HDSP-A900) displays are categorized for dominant wavelength. The category is designated by anumber adjacent to the luminous intensity category letter.Data subject to change.Copyright © 1999 Agilent Technologies, Inc.5091-8365E (11/99)。

HDS系列存储产品技术资料

HDS系列存储产品技术资料HDS存储目录第1章 HDS系列产品手册资料 (4)1.1 HDS VSP G1000（高端存储－1及高端存储扩容－1/2）产品介绍 (4)14.1.1概述 (4)14.1.2 VSP G1000产品亮点 (4)14.1.3 VSP G1000产品技术优势 (5)14.1.4 VSP G1000软件包 (14)14.1.5 VSP G1000产品技术指标 (25)1.2 HDS HUS-VM（高端存储－2/3及高端存储扩容－3/4）产品介绍 (30)14.2.1概述 (30)14.2.2 HUS VM技术的技术优势 (33)14.2.3HUS VM软件包 (40)14.2.4 HUS VM产品技术指标 (43)1.3 HDS VSP G200（中端存储1/2/3）产品介绍 (46)14.3.1概述 (46)14.3.2VSP Gx00系列产品亮点 (47)14.3.3 VSP Gx00技术优势 (48)14.3.4 VSP Gx00软件包 (49)14.3.5 VSP Gx00产品技术指标 (49)1.4 存储虚拟化兼容列表（VSP G1000/G200/HUS-VM通用） (54)1.5 HDS HCP（归档存储网关）产品介绍 (58)14.5.1什么是归档及其影响 (58)14.5.2归档平台与SAN和NAS的区别 (60)14.5.3HCP 概述 (61)14.5.4HCP优势 (62)14.5.5HCP功能介绍 (63)1.6 HDS Brocade 6510（光纤交换机－1/2及光纤交换机扩容）产品介绍 (69)14.6.1 亮点 (69)14.6.2 概述 (70)14.6.3 超高的性价比，支持不断增长的 SAN 工作负载 (70)14.6.4行业领先的技术，灵活、简单而且简便易用 (71)14.6.5拟化私有云存储的有机组成部分 (71)14.6.6 Brocade Access Gateway（接入网关）模式错误！未定义书签。

HDS存储系统简介及日常维护介绍 VSP-PPT学习课件

2020年2月24日星期一
9
VSP产品的技术指标
VSP 最小配置 VSP 最大配置
硬盘数量
虚拟化容量
前端端口 (8G) FC, FICON, FCoE(1)
0 16 (FC)
后端链路(6G)
0
缓存大小
32 GB
缓存保护
Flash (+ battery)
Virtual Storage Director(3)
©
2 27
查看SIM日志
©
2 28
©
2 29
©
2 30
©
2 31
SD2487741
truenorth
https://
©
2 32
https://
©
2 33
Storage Navigator介绍 - 1
用户登录 – 使用浏览器打开地址： http://xxx.xxx.xxx.xxx/cgi-bin/utility/sjcmain.cgi
Username/Password:root/root
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SAN
Fibre Channel
ESCON / FICON
Mainframe Host
IBM® z/OS®
Host View Devices
Internal Devices
Target Port Target Port
ELUN
LUN LUN LUN LUN LUN LUN LUN
VDEV
LDEV LDEV LDEV LDEV
- Dispatch to Site
2 24
USPV指示灯介绍
USP 的指示灯 – 1 READY 在运行状态下常亮 – 2 ALARM 通常不亮，在有部件损坏的情况下会亮红灯 – 3 MESSAGE 通常不亮，在系统有新的SIM产生的情况下会亮黄灯，但并不一定是有部件损坏 – 7 BS-ON 黄灯常亮 – 8 PS-ON 在设备开机的状态下，此灯常亮。

HDSP-5557-ID000资料

Features• Low Power Consumption • Industry Standard Size• Industry Standard Pinout • Choice of Character Size7.6 mm (0.30 in), 10 mm (0.40 in), 10.9 mm (0.43 in), 14.2 mm (0.56 in), 20 mm (0.80 in)• Choice of ColorsAlGaAs Red, High Efficiency Red (HER), Yellow, Green• Excellent Appearance Evenly Lighted Segments±50° Viewing Angle• Design FlexibilityCommon Anode or Common CathodeSingle and Dual DigitLeft and Right Hand Decimal Points±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display• Excellent for Long Digit String Multiplexing DescriptionThese low current seven segment displays are designed for applica-tions requiring low power consumption. They are tested and selected for their excellent low current characteristics to ensure that the segments are matched at low currents. Drive currents as low as 1 mA per segment are available.Pin for pin equivalent displays are also available in a standard current or high light ambient design. The standard current displays are available in all colors and are ideal for most applica-tions. The high light ambient displays are ideal for sunlight ambients or long string lengths. For additional information see the 7.6 mm Micro Bright Seven Segment Displays, 10 mm Seven Segment Displays, 7.6 mm/10.9 mm Seven Segment Displays, 14.2 mm Seven Segment Displays, 20 mm Seven Segment Displays, or High Light Ambient Seven Segment Displays data sheets.Low Current Seven SegmentDisplays Technical Data HDSP-335x SeriesHDSP-555x SeriesHDSP-751x SeriesHDSP-A10x Series HDSP-A80x Series HDSP-A90x Series HDSP-E10x Series HDSP-F10x Series HDSP-G10x Series HDSP-H10x Series HDSP-K12x, K70x Series HDSP-N10x SeriesHDSP-N40x SeriesDevicesAlGaAs HER Yellow Green Package HDSP-HDSP-HDSP-HDSP-Description Drawing A1017511A801A9017.6 mm Common Anode Right Hand Decimal A A1037513A803A9037.6 mm Common Cathode Right Hand Decimal B A1077517A807A9077.6 mm Common Anode ±1. Overflow C A1087518A808A9087.6 mm Common Cathode ±1. Overflow D F10110 mm Common Anode Right Hand Decimal E F10310 mm Common Cathode Right Hand Decimal F F10710 mm Common Anode ±1. Overflow G F10810 mm Common Cathode ±1. Overflow H G10110 mm Two Digit Common Anode Right Hand Decimal X G10310 mm Two Digit Common Cathode Right Hand Decimal Y E100335010.9 mm Common Anode Left Hand Decimal I E101335110.9 mm Common Anode Right Hand Decimal J E103335310.9 mm Common Cathode Right Hand Decimal K E106335610.9 mm Universal ±1. Overflow[1]L H101555114.2 mm Common Anode Right Hand Decimal M H103555314.2 mm Common Cathode Right Hand Decimal N H107555714.2 mm Common Anode ±1. Overflow O H108555814.2 mm Common Cathode ±1. Overflow P K121K70114.2 mm Two Digit Common Anode Right Hand Decimal R K123K70314.2 mm Two Digit Common Cathode Right Hand Decimal S N10020 mm Common Anode Left Hand Decimal Q N101N40120 mm Common Anode Right Hand Decimal T N103N40320 mm Common Cathode Right Hand Decimal U N10520 mm Common Cathode Left Hand Decimal V N106N40620 mm Universal ±1. Overflow[1]W Note:1. Universal pinout brings the anode and cathode of each segment’s LED out to separate pins. See internal diagrams L or W.Part Numbering System5082-x xx x-x x x xxHDSP-x xx x-x x x xxMechanical Options[1]00: No mechanical optionColor Bin Options[1,2]0: No color bin limitationMaximum Intensity Bin[1,2]0: No maximum intensity bin limitationMinimum Intensity Bin[1,2]0: No minimum intensity bin limitationDevice Configuration/Color[1]G: GreenDevice Specific Configuration[1]Refer to respective datasheetPackage[1]Refer to Respective datasheetNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative fordetails.2. Bin options refer to shippable bins for a part-number. Color and Intensity Bins are typically restricted to 1 bin per tube (excep-tions may apply). Please refer to respective datasheet for specific bin limit information.Package DimensionsPackage Dimensions (cont.)Package Dimensions (cont.)*The Side View of package indicates Country of Origin.Package Dimensions (cont.)Package Dimensions (cont.)Package Dimensions (cont.)Internal Circuit DiagramInternal Circuit Diagram (cont.)Absolute Maximum RatingsAlGaAs Red - HDSP-HERA10X/E10X/H10X HDSP-751X/Yellow GreenK12X/N10X/N40X335X/555X/HDSP-A80X HDSP-A90X Description F10X, G10X Series K70X Series Series Series Units Average Power per Segment or DP375264mW Peak Forward Current per 45mA Segment or DPDC Forward Current per15[1]15[2]mA Segment or DPOperating Temperature Range-20 to +100-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment 3.0V or DPWave Soldering Temperature for 3Seconds (1.60 mm [0.063 in.] below 250°C seating body)Notes:1. Derate above 91°C at 0.53 mA/°C.2. Derate HER/Yellow above 80°C at 0.38 mA/°C and Green above 71°C at 0.31 mA/°C.Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions315600I F = 1 mA A10x3600I F = 5 mA330650I F = 1 mAF10x, G10x3900I F = 5 mA390650I F = 1 mA E10x Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)3900I F = 5 mA400700I F = 1 mAH10x, K12x4200I F = 5 mA270590I F = 1 mAN10x, N40x3500I F = 5 mA1.6I F = 1 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA1.82.2I F = 20 mA PkAll Devices Peak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2 mV mV/°CV F/Segment or DPA10x255F10x, G10x320E10x340Thermal Resistance LED RθJ-PIN°C/W/SegH10x, K12x Junction-to-Pin400N10x, N40x430High Efficiency RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions160270I F = 2 mA 751x1050I F = 5 mA200300I F = 2 mA Luminous Intensity/Segment[1,2]I V mcd(Digit Average)1200I F = 5 mA335x, 555x,K70x270370I F = 2 mA1480I F = 5 mA1.6I F = 2 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA2.1 2.5I F = 20 mA Pk All Devices Peak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DP751x200335x Thermal Resistance LED RθJ-PIN280°C/WJunction-to-Pin555x, K70x345YellowDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250420I F = 4 mA(Digit Average)I V mcd1300I F = 10 mA1.7I F = 4 mAForward Voltage/Segment or DP V F 1.8V I F = 5 mA A80x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK583nmDominant Wavelength[3,5]λd581.5585592.5nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinGreenDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250475I F = 4 mA(Digit Average)I V mcd1500I F = 10 mA1.9I F = 4 mAForward Voltage/Segment or DP V F 2.0V I F = 10 mA A90x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK566nmDominant Wavelength[3,5]λd571577nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is the single wavelength which defines the color of thedevice.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. The yellow (HDSP-A800) and Green (HDSP-A900) displays are categorized for dominant wavelength. The category is designated by anumber adjacent to the luminous intensity category letter.Figure 1. Maximum AllowableAverage or DC Current vs. Ambient Temperature.Figure 2. Forward Current vs.Forward Voltage.AlGaAs RedFigure 4. Relative Efficiency (Luminous Intensity per UnitCurrent) vs. Peak Current.Figure 3. Relative Luminous Intensity vs. DC Forward Current.Figure 5. Maximum Allowable Average or DC Current vs. Ambient Temperature.Figure 6. Forward Current vs. Forward Voltage.HER, Yellow, GreenFigure 7. Relative Luminous Intensityvs. DC Forward Current.Figure 8. Relative Efficiency(Luminous Intensity per UnitCurrent) vs. Peak Current.Intensity Bin Limits (mcd)AlGaAs RedHDSP-A10xIV Bin Category Min.Max.E0.3150.520F0.4280.759G0.621 1.16H0.945 1.71I 1.40 2.56J 2.10 3.84K 3.14 5.75L 4.708.55HDSP-E10x/F10x/G10xIV Bin Category Min.Max.D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-H10x/K12xIV Bin Category Min.Max.C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50HDSP-N10xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued HERHDSP-751xIV Bin Category Min.Max.B0.1600.240C0.2000.300D0.2500.385E0.3150.520F0.4280.759G0.621 1.16HDSP-751xIV Bin Category Min.Max.B0.2400.366C0.3000.477D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-555x/K70xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued YellowHDSP-A80xIV Bin Category Min.Max.D0.2500.385E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60GreenHDSP-A90xIV Bin Category Min.Max.E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60Electrical/OpticalFor more information on electrical/optical characteristics, please see Application Note 1005.Contrast Enhancement For information on contrast enhancement, please see Application Note 1015.Soldering/Cleaning Cleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from the chorinated hydrocarbon family (methylene chloride, trichloro-ethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs, please refer to Application Note 1027.Note:All categories are established for classification of products. Productsmay not be available in all categories. Please contact your localAgilent representatives for further clarification/information.Color Categories/semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788 6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6271 2451India, Australia, New Zealand: (+65) 6271 2394Japan: (+81 3) 3335-8152(Domestic/International), or0120-61-1280(Domestic Only)Korea: (+65) 6271 2194Malaysia, Singapore: (+65) 6271 2054Taiwan: (+65) 6271 2654Data subject to change.Copyright © 2005 Agilent Technologies, Inc.Obsoletes 5988-8412ENJanuary 19, 20055989-0080EN。