TLE2024CNE4中文资料
TLE6244中文资料
VS
IN1 IN2
IN15 IN16 SCLK SI
as Ch. 1 as Ch. 1 as Ch. 1 as Ch. 1 as Ch. 1 as Ch. 1 as Ch. 1
LOGIC
16
1
16
Serial Interface SPI
Output Control Buffer
SO
Final Data Sheet
OUT2 OUT3 OUT4 OUT5 OUT6 OUT7 OUT8 OUT9 OUT10 OUT11 OUT12 OUT13 OUT14 OUT15 OUT16 OUT17 OUT18
VDD VDD-Moni-
toring
GND_ABE
VDD ABE
Final Data Sheet
3
V4.2, 2003-08-29
元器件交易网
TLE 6244X
1.3 Description of the Power Stages
OUT1... OUT6
6 non-inverting low side power switches for nominal currents up to 2.2A. Control is possible by input pins, by the µsec-bus or via SPI. For TJ = 25°C the on-resistance of the power switches is below 400mΩ. An integrated zener diode limits the output voltage to 70V typically.
A protection for inverse current is implemented for OUT1... OUT4 for use as stepper-motor control.
TL084ACNE4中文资料
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedPACKAGING INFORMATIONOrderableDevice Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9851501Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 5962-9851501QPA ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type 5962-9851503Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type5962-9851503QCAACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL081ACD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACJG OBSOLETE CDIP JG 8TBD Call TI Call TITL081ACP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081ACPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081BCD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081BCPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDRG4ACTIVESOICD82500Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)TL081CP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CPSRE4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CPWLE OBSOLETE TSSOP PW 8TBD Call TI Call TITL081ID ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081IPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081MFKB OBSOLETE LCCC FK 20TBD Call TI Call TI TL081MJG OBSOLETE CDIP JG 8TBD Call TI Call TI TL081MJGB OBSOLETE CDIP JG 8TBD Call TI Call TITL082ACD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082ACPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082ACPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACPSRE4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDE4ACTIVESOICD875Green (RoHS &CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package QtyEco Plan (2)Lead/Ball FinishMSL Peak Temp (3)no Sb/Br)TL082BCDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082BCPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CJG OBSOLETE CDIP JG 8TBD Call TI Call TITL082CP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPSRG4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPW ACTIVE TSSOP PW 8150Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWE4ACTIVE TSSOP PW 8150Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWLE OBSOLETE TSSOP PW 8TBDCall TI Call TITL082CPWR ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWRE4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWRG4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ID ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDG4ACTIVESOICD875Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)TL082IDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IJG OBSOLETE CDIP JG 8TBD Call TI Call TITL082IP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082IPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082IPWR ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IPWRE4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082MFK OBSOLETE LCCC FK 20TBD Call TI Call TITL082MFKB ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg TypeTL082MJG ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type TL082MJGB ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type TL084ACD ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDG4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDRG4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACN ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL084ACNE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL084ACNSR ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACNSRE4ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCD ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDG4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDRG4ACTIVESOICD142500Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007Orderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TL084BCN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084BCNE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084CJ OBSOLETE CDIP J14TBD Call TI Call TITL084CN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CNE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CNSLE OBSOLETE SO NS14TBD Call TI Call TITL084CNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CNSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084CPWLE OBSOLETE TSSOP PW14TBD Call TI Call TITL084CPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ID ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084IJ OBSOLETE CDIP J14TBD Call TI Call TITL084IN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084INE4ACTIVE PDIP N1425Pb-Free CU NIPDAU N/A for Pkg Type 23-Apr-2007Orderable DeviceStatus (1)Package Type Package Drawing Pins Package QtyEco Plan (2)Lead/Ball FinishMSL Peak Temp (3)(RoHS)TL084MFK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type TL084MFKB ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type TL084MJ ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL084MJB ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL084QD ACTIVE SOIC D 1450TBD CU NIPDAU Level-1-220C-UNLIM TL084QDRACTIVESOICD142500TBDCU NIPDAULevel-1-220C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight inhomogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.23-Apr-2007TAPE AND REELINFORMATION3-May-2007DevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TL081ACDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081BCDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081CDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081CPSR PS 8MLA 330168.2 6.6 2.51216Q1TL081IDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082ACDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082ACDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082ACPSR PS 8MLA 330168.2 6.6 2.51216Q1TL082BCDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082CDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082CDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082CPSR PS 8MLA 330168.2 6.6 2.51216Q1TL082CPWR PW 8MLA 330127.0 3.6 1.6812Q1TL082IDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082IDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082IPWR PW 8MLA 330127.0 3.6 1.6812Q1TL084ACDR D 14MLA 33016 6.59.0 2.1816Q1TL084ACDR D 14FMX 3300 6.59.0 2.1816Q1TL084ACNSR NS 14MLA 330168.210.5 2.51216Q1TL084BCDR D 14FMX 3300 6.59.0 2.1816Q1TL084CDR D 14FMX 3300 6.59.0 2.1816Q1TL084CNSR NS 14MLA 330168.210.5 2.51216Q1TL084CPWR PW 14MLA 330127.0 5.6 1.6812Q1TL084IDRD14FMX3306.59.02.1816Q13-May-2007TAPE AND REEL BOX INFORMATIONDevicePackagePins Site Length (mm)Width (mm)Height (mm)TL081ACDR D 8FMX 338.1340.520.64TL081BCDR D 8FMX 338.1340.520.64TL081CDR D 8FMX 338.1340.520.64TL081CPSR PS 8MLA 333.2333.228.58TL081IDR D 8FMX 338.1340.520.64TL082ACDR D 8FMX 338.1340.520.64TL082ACDR D 8MLA 338.1340.520.64TL082ACPSR PS 8MLA 333.2333.228.58TL082BCDR D 8FMX 338.1340.520.64TL082CDR D 8FMX 338.1340.520.64TL082CDR D 8MLA 338.1340.520.64TL082CPSR PS 8MLA 333.2333.228.58TL082CPWR PW 8MLA 338.1340.520.64TL082IDR D 8FMX 338.1340.520.64TL082IDR D 8MLA 338.1340.520.64TL082IPWR PW 8MLA 338.1340.520.64TL084ACDR D 14MLA 333.2333.228.58TL084ACDR D 14FMX 333.2333.228.58TL084ACNSR NS 14MLA 333.2333.228.58TL084BCDR D 14FMX 333.2333.228.58TL084CDR D 14FMX 333.2333.228.58TL084CNSR NS 14MLA 333.2333.228.58TL084CPWR PW 14MLA 338.1340.520.64TL084IDRD14FMX333.2333.228.583-May-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. 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2024年中鸣机器人编程软件
人工智能算法在机器人中的实践
1
深度学习算法
通过深度学习算法，机器人可以学习和掌握复杂 的任务和技能，提高自主性和适应性。
2
强化学习算法
强化学习算法可以让机器人在与环境的交互中学 习和优化行为策略，实现更加智能的决策和行动 。
群体智能算法
3
群体智能算法可以模拟生物群体的行为特征，让 多个机器人协同完成任务，提高整体效率和性能 。
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远程遥控功能实现
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遥控信号接收与处理
通过编程实现机器人对远程遥控信号的接收和处理，确保信号的 准确性和稳定性。
遥控指令执行
根据接收到的遥控指令，控制机器人的运动和操作，实现远程操 控。
遥控界面设计
提供友好的遥控界面设计，方便用户进行远程操控和监视。
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04
高级功能应用与拓展
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如果在安装过程中遇到任何问题，可以参考软件提供的帮助文档或者 联系中鸣机器人技术支持团队寻求帮助。
7
界面功能介绍
主界面
显示当前打开的机器人项目和相关资 源文件，提供菜单栏、工具栏等快捷 操作方式。
编程界面
提供图形化编程和Python编程两种 编程方式，支持拖拽式编程和代码编 辑功能。
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案例二：避障机器人编程设计
避障原理介绍
利用超声波或红外测距传感器检测前方障碍物，实现机器人自动 避障。
编程步骤详解
初始化测距传感器、设置安全距离阈值、编写避障控制逻辑。
调试与优化技巧
调整测距传感器精度、优化避障算法以减少误判和提高响应速度。
2024/2/29
BQ2024资料
mm x 3,00 mm)SizeFEATURESDESCRIPTIONAPPLICATIONS1DBZ PACKAGE (TOP VIEW)SDQVSSVSS23SDQ VSS VSSNCSDQ VSS 123LP PACKAGE (BOTTOM VIEW)bq2024SLUS770–MAY 20071.5K-BIT SERIAL EPROM WITH SDQ INTERFACE•1536Bits of One-Time Programmable (OTP)The bq2024is a 1.5K-bit serial EPROM containing a EPROM For Storage Of User-Programmable factory-programmed,unique 48-bit identification Configuration Datanumber,8-bit CRC generation,and the 8-bit family code (09h).A 64-bit status register controls write •Factory-Programmed Unique 64-Bit protection and page redirection.Identification NumberThe bq2024SDQ™interface requires only a single •Bus-Interface Architecture Allowing Multiple connection and a ground return.The DATA pin is bq2024's Attached to a Single Hostalso the sole power source for the bq2024.The bus •Single-Wire Interface to Reduce Circuit Board architecture allows multiple SDQ devices to be Routingconnected to a single host.•Synchronous Communication Reduces Host The small surface-mount package options saves Interrupt Overheadprinted-circuit-board space,while the low cost makes •No Standby Power Requiredit ideal for applications such as battery pack configuration parameters,record maintenance,asset •Address Space Backward Compatible With tracking,product-revision status,and access-code bq2022Asecurity.•8-byte RAM Buffer for Faster Write •Page Address RedirectionORDERING INFORMATION (1)•15KV IEC 61000-4-2Air Charge on SDQPACKAGED DEVICES (3)T A(2)•Available in a 3-Pin SOT23Package and TO-92PART NUMBER PACKAGE STATUS Package–20°C to bq2024DBZR SOT23-3Production 70°C bq2024LPRTO-92Preview(1)For the most current package and ordering information,see •Security Encoding the Package Option Addendum at the end of this document,•Inventory Trackingor see the TI Web site at .(2)Device specified to °C to 85°C.•Product-Revision Maintenance (3)The device is available only in tape and reel with a base•Battery-Pack Identificationquantity of 3000units for the bq2024DBZR and 2000units for the bq2024LPR.BLOCK DIAGRAMPlease be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.SDQ is a trademark of Texas Instruments.UNLESS OTHERWISE NOTED this document contains Copyright ©2007,Texas Instruments IncorporatedPRODUCTION DATA information current as of publication date.Products conform to specifications per the terms of Texas Instruments standard warranty.Production processing does not necessarily include testing of all parameters.DC ELECTRICAL CHARACTERISTICSAC SWITCHING CHARACTERISTCSbq2024SLUS770–MAY 2007These devices have limited built-in ESD protection.The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.over operating free-air temperature range unless otherwise noted (1)UNITV PU DC voltage applied to data –0.3V to 7V I OL Low-level output current40mA ESD IEC 61000-4-2Air discharge Data to V SS,V SS to data15kV T A Operating free-air temperature range –20°C to 70°C T A(Comm)Communication free-air temperature range Communication is specified by design –40°C to 85°C T stg Storage temperature range –55°C to 125°CLead temperature (soldering,10s)260°C(1)Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.T A =–20°C to 70°C;V PU(min)=2.65V DC to 5.5V DC ,all voltages relative to VSSPARAMETERTEST CONDITIONMINTYPMAX UNIT I DATA Supply currentV PU =5.5V20µA Logic 0,V PU =5.5V,I OL =4mA,SDQ pin 0.4V OL Low-level output voltage VLogic 0,V PU =2.65V,I OL =2mA 0.4V OH High-level output voltage Logic 1V PU5.5I OL Low-level output current (sink)V OL =0.4V,SDQ pin 4mA V IL Low-level input voltage Logic 00.8V V IH High-level input voltage Logic 12.2V V PPProgramming voltage11.512V T A =–20°C to 70°C;V PU(min)=2.65V DC to 5.5V DC ,all voltages relative to VSSPARAMETERTEST CONDITIONMIN TYPMAX UNIT t c Bit cycle time (1)60120µs t WSTRB Write start cycle (1)115µs t WDSU Write data setup (1)t WSTRB15µs t WDH Write data hold (1)(2)60t cµs 1t rec Recovery time (1)µs For memory command only5t RSTRB Read start cycle (1)113µs t ODD Output data delay (1)t RSTRB13µs t ODHO Output data hold (1)1760µs t RST Reset time (1)480µs t PPD Presence pulse delay (1)1560µs t PP Presence pulse (1)60240µs t EPROG EPROM programming time 2500µs t PSU Program setup time 5µs t PREC Program recovery time5µs(1)5-k Ωseries resistor between SDQ pin and V PU .(See Figure 1)(2)t WDH must be less than t c to account for recovery.2Submit Documentation FeedbackFUNCTIONAL DESCRIPTION GENERAL OPERATION1536-BIT EPROMbq2024 SLUS770–MAY2007AC SWITCHING CHARACTERISTCS(continued)T A=–20°C to70°C;V PU(min)=2.65V DC to5.5V DC,all voltages relative to VSSPARAMETER TEST CONDITION MIN TYP MAX UNIT t PRE Program rising-edge time5µst PFE Program falling-edge time5µst RSTREC480µsTerminal FunctionsTERMINALI/O DESCRIPTIONNAME NO.bq2024DBZRSDQ1I DataVSS2,3-Groundbq2024LPR,bq2024LPFRVSS1-GNDSDQ2I DataNC3-No connectionThe block diagram on page1shows the relationships among the major control and memory sections of the bq2024.The bq2024has three main data components:a1536-bit factory-programmed ROM,including8-bit family code,48-bit identification number and8-bit CRC value,EPROM,and EPROM STATUS bytes.Power for read and write operations is derived from the DATA pin.An internal capacitor stores energy while the signal line is high and releases energy during the low times of the DATA pin,until the pin returns high to replenish the charge on the capacitor.A special manufacturer's PROGRAM PROFILE BYTE can be read to determine the programming profile required to program the part.Table1is a memory map of the1536-bit EPROM section of the bq2024,configured as six pages of32bytes 8-byte RAM buffers are additional registers used when programming the memory.Data are first written to the RAM buffer and then verified by reading an8-bit CRC from the bq2024that confirms proper receipt of the data.If the buffer contents are correct,a programming command is issued and an8-byte segment of data is written into the selected address in memory.This process ensures data integrity when programming the memory.The details for reading and programming the1536-bit EPROM portion of the bq2024are in the Memory Function Commands section of this data sheet.Table1.1536-BIT EPROM Data Memory MapADDRESS(HEX)PAGE00A0-00BF Page50080-009F Page40060-007F Page30040-005F Page20020-003F Page10000-001F Page03Submit Documentation FeedbackEPROM STATUS MEMORYError CheckingCustomizing the bq2024Bus Terminationbq2024SLUS770–MAY 2007In addition to the programmable 1536bits of memory,there are 64bits of status information contained in the EPROM STATUS memory.The STATUS memory is accessible with separate commands.The STATUS bits are EPROM and are read or programmed to indicate various conditions to the software interrogating the bq2024.The first byte of the STATUS memory contains the write protect page bits,that inhibit programming of the corresponding page in the 1536-bit main memory area if the appropriate write-protection bit is programmed.Once a bit has been programmed in the write protect page byte,the entire 32-byte page that corresponds to that bit can no longer be altered but may still be read.The write protect bits may be cleared by using the WRITE STATUS command.The next six bytes of the EPROM STATUS memory contain the page address redirection bytes.Bits in the EPROM status bytes can indicate to the host what page is substituted for the page by the appropriate redirection byte.The hardware of the bq2024makes no decisions based on the contents of the page address redirection bytes.This feature allows the user's software to make a data patch to the EPROM by indicating that a particular page or pages should be replaced with those indicated in the page address redirection bytes.The ones complement of the new page address is written into the page address redirection byte that corresponds to the original (replaced)page.If a page address redirection byte has an FFh value,the data in the main memory that corresponds to that page are valid.If a page address redirection byte has some other hex value,the data in the page corresponding to that redirection byte are invalid,and the valid data can now be found at the ones complement of the page address indicated by the hexadecimal value stored in the associated page address redirection byte.A value of FDh in the redirection byte for page 1,for example,indicates that the updated data are now in page 2.The details for reading and programming the EPROM status memory portion of the bq2024are given in the Memory Function Commands section.Table 2.EPROM Status BytesADDRESS (HEX)PAGEWrite protection bitsBIT0-write protect page 0BIT1-write protect page 1BIT2-write protect page 200hBIT3-write protect page 3BIT4-write protect page 4BIT5-write protect page 5BIT6to 7-bitmap of used pages 01h Redirection byte for page 002h Redirection byte for page 103h Redirection byte for page 204h Redirection byte for page 305h Redirection byte for page 406h Redirection byte for page 507hFactory programmed 00hTo validate the data transmitted from the bq2024,the host generates a CRC value from the data as they are received.This generated value is compared to the CRC value transmitted by the bq2024.If the two CRC values match,the transmission is error-free.The equivalent polynomial function of this CRC is X 8+X 5+X 4+1.Details are found in the CRC Generation Section of this data sheet.The 64-bit ID identifies each bq2024.The 48-bit serial number is unique and programmed by Texas Instruments.The default 8-bit family code is 09h;however,a different value can be reserved on an individual customer basis.Contact your Texas Instruments sales representative for more information.Because the drive output of the bq2024is an open-drain,N-channel MOSFET,the host must provide a source current or a 5-k Ωexternal pullup,as shown in the typical application circuit in Figure 1.4Submit Documentation FeedbackSerial CommunicationInitializationROM COMMANDSREAD ROMReset bq2024SLUS770–MAY 2007Figure 1.Typical Applications CircuitA host reads,programs,or checks the status of the bq2024through the hierarchical command structure of the SDQ interface.Figure 2shows that the host must first issue a ROM command before the EPROM memory or status can be The ROM command either selects a specific device when multiple devices are on the SDQ bus,or skips the selection process in single SDQ device applications.InitializationROM Command SequenceMemory/Status Command SequenceFigure 2.General Command SequenceInitialization consists of two pulses,the RESET and the PRESENCE pulses.The host generates the RESET pulse,while the bq2024responds with the PRESENCE pulse.The host resets the bq2024by driving the DATA bus low for at least 480µs.For more details,see the RESET section under SDQ Signaling .The READ ROM command sequence is the fastest sequence that allows the host to read the 8-bit family code and 48-bit identification number.It is used if only one SDQ slave device is attached to the bus.The READ ROM sequence starts with the host generating the RESET pulse of at least 480µs.The bq2024responds with a PRESENCE pulse.Next,the host continues by issuing the READ ROM command,33h,and then reads the ROM and CRC byte using the READ signaling (see the READ and WRITE signals section)during the data frame.Figure 3.READ ROM Sequence5Submit Documentation FeedbackMATCH ROMResetSEARCH ROMReset bq2024SLUS770–MAY 2007The MATCH ROM command,55h,is used by the host to select a specific SDQ device when the family code and identification number is known.The host issues the MATCH ROM command followed by the family code,ROM number,and the CRC byte.Only the device that matches the 64-bit ROM sequence is selected and available to perform subsequent Memory/Status Function commands.Figure 4.MATCH ROM SequenceThe SEARCH ROM command,F0h,is used to obtain the 8-bit family code and the 48-bit identification number and 8-bit CRC of any SDQ device when it is unknown.All devices on the bus are read under the SEARCH ROM command with the use of a collision-detect and device-decode method.Figure 5shows the SEARCH ROM sequence started by the host,generating the RESET pulse of at least bq2024responds with a PRESENCE pulse.The host then issues the command in the command frame by writing an F0h.During the DATA READ of the SEARCH ROM sequence,each bit is transmitted three times.The bq2024transmits the bit followed by the complement of the bit.The host in turn retransmits the bit just read.Collision detection is performed by comparing the bit and bit complement time-slots.If they are both zero,this indicates that a collision has occurred,indicating multiple devices on the bus.The device decode is achieved in the third transmission of the bit from the host back to the bq2024.If the bit transmitted by the host does not match the bit transmitted by the bq2024,then the device with mismatch stops transmitting.Devices that did match,continue transmitting.This process is continued until all bits of a single device are read.The SEARCH ROM command is reissued and the process is repeated to read additional devices.NOTE:If the number of devices on the bus is unknown,the SEARCH ROM command should be used.A.B =bit(n):n th bit transmitted by bq2024B.C =bit(n):complement of n th bit transmitted by bq2024C.H =bit(n):n th bit transmitted by hostFigure 5.SEARCH ROM Sequence6Submit Documentation FeedbackSKIP ROMResetMEMORY/STATUS FUNCTION COMMANDS READ DATA MEMORY COMMANDSREAD MEMORY/Page CRCbq2024 SLUS770–MAY2007This SKIP ROM command,CCh,allows the host to access the memory/status functions without issuing the 64-bit ROM code sequence.The SKIP ROM command is directly followed by a memory/status functions command.Because this command can cause bus collisions when multiple SDQ devices are on the same bus, this command should be issued in single device applications.Figure6.SKIP ROM SequenceSix memory/status function commands allow read and modification of the1536-bit EPROM data memory or the 64-bit EPROM status memory.There are two types of READ MEMORY command,plus the WRITE MEMORY, READ STATUS,and WRITE STATUS commands.Additionally,the part responds to a PROGRAM PROFILE byte command.The bq2024responds to memory/status function commands only after a part is selected by a ROM command.Two READ MEMORY commands are available on the bq2024.Both commands are used to read data from the 1536-bit EPROM data field.They are the READ MEMORY/Page CRC and the READ MEMORY/Field CRC commands.The READ MEMORY/Page CRC generates CRC at the end any32-byte page boundary whereas the READ MEMORY/Field CRC generates CRC when the end of the1536-bit data memory is reached.To read memory and generate the CRC at the32-byte page boundaries of the bq2024,the ROM command is followed by the READ MEMORY/Generate CRC command,C3h,followed by the address low byte and then the address high byte.An8-bit CRC of the command byte and address bytes is computed by the bq2024and read back by the host to confirm that the correct command word and starting address were received.If the CRC read by the host is incorrect,a reset pulse must be issued and the entire sequence must be repeated.If the CRC received by the host is correct,the host issues read time slots and receives data from the bq2024starting at the initial address and continuing until the end of a32-byte page is reached.At that point,the host sends eight additional read time slots and receive an8-bit CRC that is the result of shifting into the CRC generator all of the data bytes from the initial starting byte to the last byte of the current page.Once the8-bit CRC has been received,data is again read from the1536-bit EPROM data field starting at the next page.This sequence continues until the final page and its accompanying CRC are read by the host.Thus each page of data can be considered to be33bytes long,the32bytes of user-programmed EPROM data and an8-bit CRC that gets generated automatically at the end of each page.READ EPROM Memory and CRC Initialization and ROM Read andMEMORY/Generate Address Low Byte Address High Byte Byte Command Sequence Verify CRCCRC Command Generated at32-BytePageC3h A0A7A8A15Boundaries NOTE:Individual bytes of address and data are transmitted LSB first.Figure7.READ MEMORY/Page CRC7Submit Documentation FeedbackREAD MEMORY/Field CRCWRITE MEMORYbq2024SLUS770–MAY 2007To read memory without CRC generation on 32-byte page boundaries,the ROM command is followed by the READ MEMORY command,F0h,followed by the address low byte and then the address high byte.NOTE:As shown in Figure 8,individual bytes of address and data are transmitted LSB first.An 8-bit CRC of the command byte and address bytes is computed by the bq2024and read back by the host to confirm that the correct command word and starting address were received.If the CRC read by the host is incorrect,a reset pulse must be issued and the entire sequence must be repeated.If the CRC received by the host is correct,the host issues read time slots and receives data from the bq2024starting at the initial address and continuing until the end of the 1536-bit data field is reached or until a reset pulse is issued.If reading occurs through the end of memory space,the host may issue eight additional read time slots and the bq2024responds with an 8-bit CRC of all data bytes read from the initial starting byte through the last byte of memory.After the CRC is received by the host,any subsequent read time slots appear as logical 1s until a reset pulse is issued.Any reads ended by a reset pulse prior to reaching the end of memory does not have the 8-bit CRC available.Read EPROMInitialization and ROMREAD MEMORY Command Address Low Address High Read and Memory Until EndRead andCommand F0h Byte Byte Verify CRC of EPROMVerify CRCSequenceMemoryA0A7A8A15Figure 8.READ MEMORY/Field CRCThe WRITE MEMORY command is used to program the 1536-bit EPROM memory field.The 1536-bit memory field is programmed in 8-byte segments.Data is first written into an 8-byte RAM buffer one byte at a time.The contents of the RAM buffer is then ANDed with the contents of the EPROM memory field when the programming command is issued.Figure 9illustrates the sequence of events for programming the EPROM memory field.After issuing a ROM the host issues the WRITE MEMORY command,0Fh,followed by the low byte and then the high byte of the starting address.The bq2024calculates and transmits an 8-bit CRC based on the WRITE command and address.If at any time during the WRITE MEMORY process,the CRC read by the host is incorrect,a reset pulse must be issued,and the entire sequence must be repeated.After the bq2024transmits the CRC,the host then transmits 8bytes of data to the bq2024.Another 8-bit CRC is calculated and transmitted based on the 8bytes of data.If this CRC agrees with the CRC calculated by the host,the host transmits the program command 5Ah and then applies the programming voltage for at least 2500µs or t EPROG .The contents of the RAM buffer is then logically ANDed with the contents of the 8-byte EPROM offset by the starting address.The starting address can be any integer multiple of eight between 0000and 00BF (hex)such as 0000,0008,and 0010(hex).The WRITE DATA MEMORY command sequence can be terminated at any point by issuing a reset pulse except during the program pulse period t PROG .NOTE:The bq2024responds with the data from the selected EPROM address sent least significant-bit first.This response should be checked to verify the programmed byte.If the programmed byte is incorrect,then the host must reset the part and begin the write sequence again.8Submit Documentation Feedbackbq2024 SLUS770–MAY2007For both of these cases,the decision to continue programming is made entirely by the host,because the bq2024is not able to determine if the8-bit CRC calculated by the host agrees with the8-bit CRC calculated by the bq2024.Prior to programming,bits in the1536-bit EPROM data field appear as logical1s.Figure9.WRITE MEMORY Command Flow9Submit Documentation FeedbackREAD STATUSWRITE STATUSbq2024SLUS770–MAY 2007The READ STATUS command is used to read data from the EPROM status data field.After issuing a ROM command,the host issues the READ STATUS command,AAh,followed by the address low byte and then the address high byte.NOTE:An 8-bit CRC of the command byte and address bytes is computed by the bq2024and read back by the host to confirm that the correct command word and starting address were received.If the CRC read by the host is incorrect,a reset pulse must be issued and the entire sequence must be repeated.If the CRC received by the host is correct,the host issues read time slots and receives data from the bq2024starting at the supplied address and continuing until the end of the EPROM Status data field is reached.At that point,the host receives an 8-bit CRC that is the result of shifting into the CRC generator all of the data bytes from the initial starting byte through the final factory-programmed byte that contains the 00h value.This feature is provided because the EPROM status information may change over time making it impossible to program the data once and include an accompanying CRC that is always valid.Therefore,the READ status command supplies an 8-bit CRC that is based on (and always is consistent with)the current data stored in the EPROM status data field.After the 8-bit CRC is read,the host receives logical 1s from the bq2024until a reset pulse is issued.The READ STATUS command sequence can be ended at any point by issuing a reset pulse.Read STATUSInitialization and ROMREAD MEMORY CommandAddress Low Address High Read and Memory Until EndRead and Command AAh Byte Byte Verify CRC of STATUSVerify CRCSequenceMemoryA0A7A8A15Figure 10.READ STATUS CommandThe Write Status command is used to program the EPROM Status data field after the bq2024has been selected by a ROM commandThe flow chart in Figure 11illustrates that the host issues the Write Status command,55h,followed by the address low byte address high byte the followed by the byte of data to be programmed.NOTE:Individual bytes of address and data are transmitted LSB first.An 8-bit CRC of the command byte,address bytes,and data byte is computed by the bq2024and read back by the host to confirm that the correct command word,starting address,and data byte were received.If the CRC read by the host is incorrect,a reset pulse must be issued and the entire sequence must be repeated.If the CRC received by the host is correct,the program command (5Ah)is issued.After the program command is issued,then the programming voltage,V PP is applied to the DATA pin for period t PROG .Prior to programming,the first seven bytes of the EPROM STATUS data field appear as logical 1s.For each bit in the data byte provided by the host that is set to a logical 0,the corresponding bit in the selected byte of the EPROM STATUS data field is programmed to a logical 0after the programming pulse has been applied at the byte location.The eighth byte of the EPROM STATUS byte data field is factory-programmed to contain 00h.10Submit Documentation Feedbackbq2024SLUS770–MAY2007 Figure11.WRITE STATUS Command Flowbq2024SLUS770–MAY 2007After the programming pulse is applied and the data line returns to V PU ,the host issues eight read time slots to verify that the appropriate bits have been programmed.The bq2024responds with the data from the selected EPROM STATUS address sent least significant bit first.This response should be checked to verify the programmed byte.If the programmed byte is incorrect,then the host must reset the device and begin the write sequence again.If the bq2024EPROM data byte programming was successful,the bq2024automatically increments its address counter to select the next byte in the STATUS MEMORY data field.The least significant byte of the new two-byte address is also loaded into the 8-bit CRC generator as a starting value.The host issues the next byte of data using eight write time slots.As the bq2024receives this byte of data into the RAM buffer,it also shifts the data into the CRC generator that has been preloaded with the LSB of the current address and the result is an 8-bit CRC of the new data byte and the LSB of the new address.After supplying the data byte,the host reads this 8-bit CRC from the bq2024with eight read time slots to confirm that the address incremented properly and the data byte was received correctly.If the CRC is incorrect,a Reset Pulse must be issued and the Write Status command sequence must be restarted.If the CRC is correct,the host issues a programming pulse and the selected byte in memory is programmed.NOTE:The initial write of the WRITE STATUS command,generates an 8-bit CRC value that is the result of shifting the command byte into the CRC generator,followed by the two-address bytes,and finally the data byte.Subsequent writes within this WRITE STATUS command due to the bq2024automatically incrementing its address counter generates an 8-bit CRC that is the result of loading (not shifting)the LSB of the new (incremented)address into the CRC generator and then shifting in the new data byte.For both of these cases,the decision to continue programming the EPROM Status registers is made entirely by the host,because the bq2024is not able to determine if the 8-bit CRC calculated by the host agrees with the 8-bit CRC calculated by the bq2024.If an incorrect CRC is ignored and a program pulse is applied by the host,incorrect programming could occur within the bq2024.Also note that the bq2024always increments its internal address counter after the receipt of the eight read time slots used to confirm the programming of the selected EPROM byte.The decision to continue is again made entirely by the host,therefore if the EPROM data byte does not match the supplied data byte but the master continues with the WRITE STATUS command,incorrect programming could occur within the bq2024.The WRITE STATUS command sequence can be ended at any point by issuing a reset pulse.Table mand Code SummaryCOMMAND DESCRIPTIONCATEGORY(HEX)Read Serialization ROM and 33h CRC55h Match Serialization ROM ROM Commands Available in Command Level IF0h Search Serialization ROM CCh Skip Serialization ROM F0h Read Memory/Field CRC AAh Read EPROM Status C3h Read Memory/Page CRC Memory Function Commands Available in Command Level II0Fh Write Memory 99h Programming Profile 55h Write EPROM Status Program Command Available Only in WRITE 5AhProgram ControlMEMORY and WRITE STATUS Modes。
SII2024中文资料
On a per-channel basis, the SiI 2024 supports selectable transmit and receive data rates for automatic speed negotiation. It also utilizes 10-bit SSTL_2-compatible interfaces for each channel’s parallel data input/output. For added flexibility in some system applications, the SiI 2024 offers pre-emphasis and voltage swing control on the serial transmit ports. The SiI 2024 is available in a 324-pin, 23x23mm PBGA package and supports JTAG for improved testability.
CTRL
JTAG CTRL
Low Power
• Single 1.8V supply for core circuits and 2.5V supply for parallel I/O
• Power dissipation: 250 mW per channel
Cost Effective
• Standard CMOS technology • Plastic 324-pin PBGA
元器件交易网
SiI 2024 Fibre Channel Quad SerDes
Silicon Image's SiI 2024 Quad serializer/deserializer (SerDes) is capable of transmitting and receiving four independent channels of data at 1.0625 and 2.125 gigabits-per-second (Gbps). Targeted at Fibre Channel applications, the SiI 2024 Quad SerDes is designed for power, performance and price. Making use of a robust CMOS design that significantly reduces power dissipation and jitter, the SiI 2024 provides a low-cost solution for applications that require multiple-channel, high-performance Fibre Channel SerDes. By offering four integrated, low-power SerDes in one package, the SiI 2024 reduces board space and power requirements traditionally needed for Fibre Channel SerDes.
E2CA-AN4E资料
Inductive Proximity SensorE2CALinear Output Proximity Sensor withHigh-accuracy ResolutionResolution is 0.05%of the maximum sensingdistance.The model with a sensing distance of 1.2mm ensures a resolution of 0.6 m.Models with response frequencies ranging from 10to 3kHz are available.The M30-size model ensures a sensing distance of10mm.Satisfies IEC IP67requirements,thus detecting the displacement of metal objects without beinginfluenced by water and oil spray.The E2CA has a standard linear output of 4to 20mA and connects to the Linear Discrimination Unit,Digital Panel Meter,and I/O Unit of the Programmable Controller.The E2CA’s compact amplifier can be plugged into surface mounting sockets thus greatly reducing wiring effort and ensuring easy mounting.Ordering InformationShieldSizeSensing di t (S )Response frequency Sensor UnitAmplifier Unit g distance (Sn)Linear output Switchingoutput DC AC ShieldedM80.3to 1.5mm 10kHz 1kHz E2CA-XIR5A E2CA-AL4C E2CA-AN4C M120.4to 2mm 10kHz 800Hz E2CA-X2A E2CA-AL4D E2CA-AN4D M181to 5mm 5kHz 350Hz E2CA-X5A E2CA-AL4E E2CA-AN4E M302to 10mm3kHz100HzE2CA-X10A E2CA-AL4FE2CA-AN4FApplication ExamplesDetection of Metals on Other MetalsCounts the number of gear teeth.Detects mounting screws,riv-ets,and soldering conditionDetection of Loosened ScrewsImproper screwingLoosenedDiscrimination of MaterialsBrassIronCopperMeasurement of Sheet AnglesMeasures leaned press molds and elevated boardsMetal plateMeasurement of External DimensionsMetal objectAlarm outputDiscrimination of ShapesDetects top and bottom sides of metal caps and surface and back sides of nutsMeasurement of Object DeformationsE2CA Amplifier UnitE2CA Amplifier UnitE2CA Amplifier UnitE2CA Amplifier UnitE2CA Ampli-fier UnitE2CA Ampli-fier UnitE2CA Amplifier UnitE2CA Amplifier UnitE2CA Amplifier Unit OutputOutputOutputOutputOutputOutputOutputE2CAE2CA E2CA E2CA E2CAE2CAE2CA E2CAK3TS K3TSK3TSK3TS K3TS K3TSK3TS K3TSSensing Head Measurement of Sheet ThicknessSpecificationsSensor model E2CA-X1R5A E2CA-X2AItem Amplifier model E2CA-AN4C E2CA-AL4C E2CA-AN4D E2CA-AL4DSupply voltage(operating voltage range)100to240VAC50/60Hz(90to264VAC)12to24VDC(10to30VDC),ripple(p-p):10%max.100to240VAC50/60Hz(90to264VAC)12to24VDC(10to30VDC),ripple(p-p):10%max.Current consumption60mA max.70mA max.60mA max.70mA max. Sensing object Ferrous metalSensing range(with standard sensing object)0.3to1.5mm(8x8x1mm iron)0.4to2mm(12x12x1mm iron)Linear output h t i ti Resolution0.05%FSpcharacteristics Linearity 2%FS 1.5%FSResponse frequency(see note1)10kHz(--1dB)10kHz(--1dB)Switching output h t i ti Differential travel2%to5%of rated sensing distanceg pcharacteristics Response frequency(see note2)1kHz800HzSensitivity adjustment f i Sensitivity adjustment(switching output)Adjustments of switching output within sensing rangeadjust e tfunction Linear output4mA4-mA adjustment at20%of rated sensing distancecurrentadjustment20mA20-mA adjustment at rated sensing distanceOutput Linear output(see note3)4to20mA(with permissible load resistance of0to300 )Switching output100mA max.transistor photocoupler output at40VDC with max.residual voltage of2V Switching output mode Normally open or normally closed(selectable with selector on front panel)Cord length compensation3or5m(selectable with selector on front panel)Indicators POWER,SPAN(linear range),and OPER(switching output)indicatorsAmbient temperature Operating:--25 C to70 C(Sensor)and--10 C to55 C(Amplifier)with no icing Ambient humidity Operating:35%to95%(Sensor)and35%to85%(Amplifier)Temperature influence 10%FS max.of linear output current at23 C in the rated ambient operatingtemperature range of the Sensor and Amplifier UnitsVoltage influence DC power supply model: 0.5%FS max.of linear output current at a voltage between80%and120%of the rated power supply voltageAC power supply model: 0.5%FS max.of linear output current at a voltage between90%and110%of the rated power supply voltageInsulation resistance50M min.(at500VDC)between the case and current carry partsDielectric strength DC power supply model:1,000VAC(50/60Hz)for1min between current carry partsand caseAC power supply model:1,500VAC(50/60Hz)for1min between current carry partsand caseVibration resistance Sensor(destruction):10to55Hz,1.5-mm double amplitude for2hours each in X,Y,andZ directionsAmplifier(destruction):10to25Hz,2-mm double amplitude for2hours each in X,Y,andZ directionsShock resistance Sensor(destruction):500m/s2(approx.50G)3times each in X,Y,and Z directionsAmplifier(destruction):100m/s2(approx.10G)3times each in X,Y,and Z directions Degree of protection Sensor:IEC60529IP67(JEM IP67g waterproof and oil-proof)Cord length Sensor:2-conductor,3-m-long(standard length)or5-m-long shielded cordWeight (t Sensor Approx.40gg(see note4)Amplifier Approx.250g Approx.140g Approx.250g Approx.140g Material Case BrassSensing surface ABS resinCord PolyethyleneSensor model E2CA-X5A E2CA-X10AItem Amplifier model E2CA-AN4E E2CA-AL4E E2CA-AN4F E2CA-AL4FSupply voltage(operating voltage range)100to240VAC50/60Hz(90to264VAC)12to24VDC(10to30VDC),ripple(p-p):10%max.100to240VAC50/60Hz(90to264VAC)12to24VDC(10to30VDC),ripple(p-p):10%max.Current consumption60mA max.70mA max.60mA max.70mA max. Sensing object Ferrous metalSensing range(with standard sensingobject)1to5mm(18x18x1mm iron)2to10mm(30x30x1mm iron)Linear output h t i ti Resolution0.05%FSpcharacteristics Linearity 1.5%FS 2%FSResponse frequency(see note1)5kHz(--1dB)3kHz(--1dB)Switching output h t i ti Differential travel2%to5%of rated sensing distanceg pcharacteristics Response frequency(see note2)350Hz100HzSensitivity adjustment f i Sensitivity adjustment(switching output)Adjustments of switching output within sensing rangeadjust e tfunction Linear output4mA4-mA adjustment at20%of rated sensing distancecurrentadjustment20mA20-mA adjustment at rated sensing distanceOutput Linear output(see note3)4to20mA(with permissible load resistance of0to300 )Switching output100mA max.transistor photocoupler output at40VDC with max.residual voltage of2V Switching output mode Normally open or normally closed(selectable with selector on front panel)Cord length compensation3or5m(selectable with selector on front panel)Indicators POWER,SPAN(linear range),and OPER(switching output)indicatorsAmbient temperature Operating:--25 C to70 C(Sensor)and--10 C to55 C(Amplifier)with no icing Ambient humidity Operating:35%to95%(Sensor)and35%to85%(Amplifier)Temperature influence 10%FS max.of sensing distance at23 C in the rated ambient operating temperaturerange of--10 C and40 CVoltage influence DC power supply model: 0.5%FS max.of linear output current at a voltage between80%and120%of the rated power supply voltageAC power supply model: 0.5%FS max.of linear output current at a voltage between90%and110%of the rated power supply voltageInsulation resistance50M min.(at500VDC)between the case and current carry partsDielectric strength DC power supply model:1,000VAC(50/60Hz)for1min between current carry partsand caseAC power supply model:1,500VAC(50/60Hz)for1min between current carry partsand caseVibration resistance Sensor(destruction):10to55Hz,1.5-mm double amplitude for2hours each in X,Y,andZ directionsAmplifier(destruction):10to25Hz,2-mm double amplitude for2hours each in X,Y,andZ directionsShock resistance Sensor(destruction):500m/s2(approx.50G)3times each in X,Y,and Z directionsAmplifier(destruction):100m/s2(approx.10G)3times each in X,Y,and Z directions Degree of Protection Sensor:IEC60529IP67(JEM IP67g waterproof and oil-proof)Cord length Sensor:2-conductor,3-m-long(standard length)or5-m-long shielded cordWeight (t Sensor Approx.60g Approx.160gg(see note4)Amplifier Approx.250g Approx.140g Approx.250g Approx.140g Material Case BrassSensing surface ABS resinCord PolyethyleneNote: 1.This is a frequency decreasing the level of linear output current by1dB.2.This is a response frequency measured in accordance with CENELEC standards.3.The maximum load impedance of the E2CA-AL4is150 at a supply voltage of12V.4.The weight includes the3-m-long cord.The weights of the Amplifiers do not include connecting sockets.Engineering DataSensing Distance vs.Output Current (Typical)E2CA-X1R5A E2CA-X2A E2CA-X5A E2CA-X10A Sensing Object Size vs.Linearity (Typical)E2CA-X1R5A E2CA-X2A E2CA-X5A E2CA-X10A Column Diameter vs.Linearity (Typical)E2CA-X1R5A E2CA-X2A E2CA-X5A E2CA-X10A O u t p u t c u r r e n t (m A )Sensing distance (mm)O u t p u t c u r r e n t (m A )Sensing distance (mm)O u t p u t c u r r e n t (m A )Sensing distance (mm)O u t p u t c u r r e n t (m A )Sensing distance (mm)L i n e a r i t y (%o f f u l l s c a l e )Sensing distance X (mm)L i n e a r i t y (%o f f u l l s c a l e )Sensing distance X (mm)L i n e a r i t y (%o f f u l l s c a l e )Sensing distance X (mm)L i n e a r i t y (%o f f u l l s c a l e )Sensing distance X (mm)L i n e a r i t y (%o f f u l l s c a l e )Sensing distance X (mm)L i n e a r i t y (%o f f u l l s c a l e )Sensing distance X (mm)L i n e a r i t y (%o f f u l l s c a l e )Sensing distance X (mm)L i n e a r i t y (%o f f u l l s c a l e )Sensing distance X (mm)8dia.10dia.6dia.10dia.20dia.30dia.40dia.Flat plateFlat plateFlat plateFlat plateMaterial:Iron t=1140dia.220dia.Sensing object material:Iron t=1Material:Iron t=1Sensing object material:Iron t=1Sensing object material:IronSensing object material:IronMaterial:IronMaterial:Ironfff20dia.10dia.30dia.40dia.60dia.100dia.NomenclatureSelector and Adjuster Settings(1)Operation Mode SelectorThe switching output transistor turns ON when there is sensing object detection.The switching output transistor turns ON when there is no sensing object detection.POWER indicator (red LED)ON when power is supplied to the E2CA.OPER indicatorON when the switching output of the POWER indicator is detected.(ON when detected,OFF when not detected)(1)Operation mode selector(2)Cord length compensation selectorSENSITIVITY adjusterUsed to adjust the sensing distance of switching output.SPAN indicatorIndicates the linear range of green LED output current.Linear output current adjuster (20mA)Linear output current adjuster (4mA)(2)Cord Length Compensation Selector Set the selector to 3m or 5m according to the length of the Sensor cord in use.A cord length of 3m is selected.A cord length of 5m isselected.OUTPUT OUTPUT NONONCNC CABLECABLE 3m3m5m5mLinear Output Adjustment (LINEARITY Adjuster)Step 123RemarksPositioning---20%of rated sensing distanceStandard objectStandard objectRated sensing distance---LINEARITY adjuster---4mA20mA---Adjustment procedureConnect an ammeter across terminals 1and 2.Shielded cordNote:This illustration shows the Sensor Unit connected to the Amplifier Unit with the P2CF-11Front-connecting Socket mounted.P2CF-11Switching output(photocoupler output)E2CA-A j 4j Amplifier Unit P2CF-11Front-connecting SocketPlace the standard object at 20%of the rated sensing distance away from the Sensor Unit.Turn the 4mA LINEARITY adjuster slowly clockwise (the output current is increased)orcounterclockwise (the output current isdecreased)to set the output current to 4mA.(SPAN indicator is ON.)Fasten the standard object at the ratedsensing distance.Turn the 20-mA LINEARITY adjuster slowlyclockwise (the output current is increased)or counterclockwise (the output current isdecreased)to set the output current to 20mA.(SPAN indicator is ON.)To further improve the adjustment accuracy,set again theposition of the standard object in the order of steps 2and 3.Perform minute adjustment of the output current.Sensitivity (Distance)AdjustmentDetecting conditionStandard objectStandard target (See Note at below right.)SENSITIVITY adjusterSENSITIVITYLowHighAdjustment procedurePlace the standard object at the specified position.Slowly turn the SENSITIVITYadjuster clockwise (toward “High”)and stop it when the OPER.indicator illuminates.Move the object to confirm that the OPER.indicator is ON when the object is at the specified position and that it is OFF when the object is moved away from that position.Compensation of Cord Length DifferenceSet the CABLE selector to the required position according to the length of the cord being used (3m or 5m).CABLE 3m5m3-mcord CABLE 3m5m 5-m cordOperationOutput CircuitTiming ChartMain circuitCompa-rator100mA max.47VLinear output:4to 20mASwitching output (+)Switching output (--)0VDistance of objectSPAN indicatorLinear outputMode selectorTransistor output (switching output)OPER.indicator2.2100%(Rated distance)20%(Set distance)ON OFF20mA 4mAON OFFON OFF NO NC*SENSITIVITY adjusterConnectionsConnections between Sensor Units and Amplifier UnitsE2CA-AL4j +Sensor UnitSensor UnitShielded cordWhite BlueSwitching output (Transistorizedphotocoupler output)0V 12to 24VDC 0V (+)Linear outputSensor UnitShielded cordWhite BlueSwitching output (Transistorized photocoupler output)0V (+)Linear output100to 240VACE2CA-AN4j +Sensor UnitE2CA-AL4j Amplifier unitP2CF-11Front-connecting SocketE2CA/AN4j Amplifier unitP2CF-11Front-connecting SocketNote:The above illustrations show the terminal arrangement viewed from the rear of the socket,which is coupled to the Amplifier Unit.Shielded cordWhiteBlueComparator,microproces-sor,etc.Connection of Resistive Load:E2CA-AN4j +Sensor UnitConnection to Z4W-DD1CE2CA-AN4j AmplifierSynchronous sensorShielded cord4to 20mA0V+12V Blue Output Black BrownLinear output(+)100to 200VACR(see note)E2CA-AN4j Amplifier P2CF-11Front-connecting SocketWhiteBlue100mA,30VDC max.100to 240VAc,50/60HzSensor Unit (E2CA)Z4W-DD1CNote:Resistance R when E2CA-AL4is used:300 max.at 24V/150 max.at 12V Resistance R when E2CA-AN4is used:300 max.+12V0V4to 20mA 0V0VE2CA-AL4j AmplifierP2CF-11Front-connecting SocketConnection to K3TS-SD12Connection to K3TX-AD22Shielded cord Shielded cordSensor UnitSensor UnitWhiteBlue12to 24VDCK3TS WhiteBlue12to 24VDCE2CA-AL4j AmplifierP2CF-11Front-connecting SocketK3TXCQM1Linear Sensor Interface UnitConnection to CQM1-LSEShielded cord SensorE2CA-AL4j AmplifierP2CF-11Front-connecting SocketWhiteBlue4to 20mACQM1-LSE01DimensionsNote:All units are in millimeters unless otherwise indicated.Sensor UnitsE2CA-X1R5AE2CA-X2AShielded cordStandard length:3mShielded cordStandard length:3m2.8dia.2.8dia.E2CA-X5A E2CA-X10AShielded cordStandard length:3m ShieldedcordStandard length:3m5.5dia.4.1dia.Amplifier UnitsE2CA-A j C/F E2CA-Aj D/E48x 4844.8x44.8Mounting Hole DimensionsModelF (mm)E2CA-X1R5A 8.5dia.+0.50E2CA-X2A 12.5dia.+0.50E2CA-X5A 18.5dia.+0.50E2CA-X10A30.5dia.+0.50Accessories (Order Separately)Mounting Fixture (Y92E-B Series)Four types of exclusive resin mounting fixtures are optionally available.Select the type suited to the dimensions of the Sensor.Y92F-30Adapter for Flush MountingY92A-48B Protective CoverThe protective hard plastic cover shields the front panel,particularly the setting section,from dust,dirt,and water drip.Mounting panelY92F-30Adapter for flush mountingP3GA-11Back-con-necting SocketY92A-48BConnecting Sockets for E2CA-A j 4jP2CF-11Front-connecting Socket (Track Mounted)Eleven,M3.5 7.5sems screwsTwo,4.5-dia.hole70max.31.2max.Terminal Arrangement (Top View)Mounting HolesTwo,4.5-dia.holesNote:The Socket can be mounted to a track.50max.P3GA-11Back-connecting SocketTerminal Arrangement (Bottom View)27dia.454525.64.516.36.211PL11Back-connecting Socket (Solder Terminal)Terminal Arrangement (Bottom View)Mounting HolesTwo,3.5dia.or M3socket mounting holes31-dia.hole51max.35max.30dia.Approx.20.5Two,2dia.Two,3.5dia.or M3socket mounting holesPrecautionsCorrect UseMountingDo not tighten the nut of the Sensor with excessive force.Be sureto use the washer with the nut when tightening.Model Tightening torqueE2CA-X1R5A 1.96N S m (20kgf S cm)E2CA-X2A 5.9N S m (60kgf S cm)E2CA-X5A 14.7N S m (150kgf S cm)E2CA-X10A 39.2N S m (400kgf S cm)Note:The above tightening torque applies when a toothed wash-er is used.Effects of Surrounding MetalBe sure to separate the Sensor from surrounding metal objects as shown in the following illustration if the Sensor is embedded.d dia.Model/DistancedDmE2CA-X1R5A 0(8)0 4.5E2CA-X2A 0(12)06E2CA-X5A 0(18)015E2CA-X10A 0(30)30Note:The values for “d”indicate distances for the outer diameter of the shielded models.Mutual InterferenceIf the Sensors are mounted in parallel or face-to-face,be sure to keep the clearance between the Sensors as specified in the table.Model/DistanceABE2CA-X1R5A 3020E2CA-X2A3020E2CA-X5A 5035E2CA-X10A10075Sensor CordThe Sensor cord must be either 3or 5m.Do not cut or extend the Sensor cord,otherwise the E2CA may not provide the specified out-put.Mounting the Amplifier UnitWhen mounting more than one amplifier vertically,it is recom-mended that a margin of approximately 20mm above and below the Socket be provided in consideration of the space required by the hook of the Socket.HookDuctPanelP2CF-1112Enclosed MountingIf the Y92F-30Adapter is used,insert the E2CA into the square hole from the front side of the panel and slide the Y92F-30onto the E2CA from the rear side of the E2CA.Then press the Y92F-30so that the space between the Y92F-30and the panel is reduced as much as possible.Finally,secure the Y92F-30with screws.Panel Y92F-30Adapter P3G-11Back-mounting SocketRemoving the Amplifier UnitIf the Y92F-30is used,loosen the screws of theY92F-30,spread out the hooks,and remove the Y92F-30.OthersThe accuracy of the E2CA will vary with the on-site environment.The resolution,temperature characteristics,and voltage character-istic linearity are especially affected.Therefore,keep the on-site en-vironment as suitable for the E2CA as possible.OMRON CorporationIndustrial Sensors DivisionSensing Devices and Components Division H.Q.28th Fl.,Crystal Tower Bldg.1-2-27,Shiromi,Chuo-ku,Osaka 540-6028JapanPhone:(81)6-949-6012Fax:(81)6-949-6021ALL DIMENSIONS SHOWN ARE IN MILLIMETERS.To convert millimeters into inches,multiply by 0.03937.To convert grams into ounces,multiply by 0.03527.Cat.No.D77-E1-1In the interest of product improvement,specifications are subject to change without notice.Printed in Japan 0398-0.5M (0398)a。
EPEC2024用户手册
特性 ·ISO 高速 CAN1 接口（CANopen） ·ISO 高/低速 CAN2 接口（CAN2.0B） ·供电 10—30VDC，编程时要求大于 11.5V ·建议 24VDC 供电 ·程序时钟周期默认 10ms（可改） ·248 个 16bit 参数 ·高压和过载保护 ·过热保护 ·输出短路保护 ·镀金接触、自锁、密封良好的连接器
上海派芬自动控制技术有限公司 地址：上海·浦东·金桥浙桥路 289 号建银大厦 A 座 605~608 邮编：201206
电话：+86-(21)-51303669/70
传真：+86-(21)-51303671 tech@
PLC SET 2 (2024) 硬件手册
电源电压过低 <9.5VDC
功耗 大约 1.8 瓦（24 伏供电和空载时）
监视功能 电压过低 过热
CAN 接口 物理界面标准 ISO11898 协议 CAN 2.0B 更高物理层协议 CANopen（CAN1） 物理层协议，用户自编程用（CAN2）可用于 J1939，CANkindom，FullCAN，ISObus，HilonA/B，CAN2.0A
DI：正向开关量信号输入（PNP）（悬空为 FALSE）
输入针号
电路图
最大输入 最小逻辑 最大逻辑
电压
高电平 低电平
XM1.19,
XM1.20,
XM2.19, XM2.20,
30 VDC >4.8 V
<4.2 V
XM3.16…
XM3.23
2006-01-16 输入阻抗
TLE2021CPE4中文资料
description
The TLE202x, TLE202xA, and TLE202xB devices are precision, high-speed, low-power operational amplifiers using a new Texas Instruments Excalibur process. These devices combine the best features of the OP21 with highly improved slew rate and unity-gain bandwidth. The complementary bipolar Excalibur process utilizes isolated vertical pnp transistors that yield dramatic improvement in unity-gain bandwidth and slew rate over similar devices. The addition of a bias circuit in conjunction with this process results in extremely stable parameters with both time and temperature. This means that a precision device remains a precision device even with changes in temperature and over years of use. This combination of excellent dc performance with a common-mode input voltage range that includes the negative rail makes these devices the ideal choice for low-level signal conditioning applications in either single-supply or split-supply configurations. In addition, these devices offer phase-reversal protection circuitry that eliminates an unexpected change in output states when one of the inputs goes below the negative supply rail. A variety of available options includes small-outline and chip-carrier versions for high-density systems applications. The C-suffix devices are characterized for operation from 0°C to 70°C. The I-suffix devices are characterized for operation from – 40°C to 85°C. The M-suffix devices are characterized for operation over the full military temperature range of – 55°C to 125°C.
ADS807E;ADS807E1K;ADS807E1KG4;ADS807EG4;DEM-ADS807E;中文规格书,Datasheet资料
12-Bit, 53MHz SamplingANALOG-TO-DIGITAL CONVERTERFEATURESq SPURIOUS-FREE DYNAMIC RANGE:82dB at 10MHz f INq HIGH SNR: 67.5dB (2Vp-p), 69dB (3Vp-p)q LOW POWER: 335mWq INTERNAL OR EXTERNAL REFERENCE q LOW DNL: 0.5LSBq FLEXIBLE INPUT RANGE: 2Vp-p to 3Vp-p q SSOP-28 PACKAGEDESCRIPTIONThe ADS807 is a high-speed, high dynamic range,12-bit pipelined Analog-to-Digital (A/D) converter. This con-verter includes a high-bandwidth track-and-hold that gives excellent spurious performance up to and beyond the Nyquist rate. The differential nature of this track-and-hold and A/D converter circuitry minimizes even-order harmonics and gives excellent common-mode noise immunity. The track-and-hold can also be operated single-ended.The ADS807 provides for setting the full-scale range of the converter without any external reference circuitry. The inter-nal reference can be disabled allowing low drive, internal references to be used for improved tracking in multichannel systems.The ADS807 provides an over-range indicator flag to indicate an input signal that exceeds the full-scale input range of the converter. This flag can be used to reduce the gain of front end gain control circuitry. There is also an output enable pin to allow for multiplexing and testability on a PC board.The ADS807 employs digital error correction techniques to provide excellent differential linearity for demanding imaging applications.APPLICATIONSq COMMUNICATIONS IF PROCESSING q COMMUNICATIONS BASESTATIONS q TEST EQUIPMENT q MEDICAL IMAGING q VIDEO DIGITIZING q CCD DIGITIZINGA D S807E+2.5V +2.5V +3V +2V+2V +3VADS807SBAS072A – JANUARY 1999 – REVISED JULY 2002PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.Copyright © 1999, Texas Instruments IncorporatedPlease be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.PIN DESIGNATOR DESCRIPTION1GND Ground2Bit 1Data Bit 1 (MSB)3Bit 2Data Bit 24Bit 3Data Bit 35Bit 4Data Bit 46Bit 5Data Bit 57Bit 6Data Bit 68Bit 7Data Bit 79Bit 8Data Bit 810Bit 9Data Bit 911Bit 10Data Bit 1012Bit 11Data Bit 1113Bit 12Data Bit 12 (LSB)14CLK Convert Clock 15+V S +5V Supply16FS SEL HI = 3V, LO = 2V17OTR Out-of-Range Indicator18INT/EXT Reference Select: HIGH or Floating = Exter-nal LOW = Internal 50k Ω pull-up.19OE Output Enable 20GND Ground21REFB Bottom Reference/Bypass 22REFT Top Reference/Bypass23CM Common-Mode Voltage Output 24IN Complementary Analog Input 25IN Analog Input 26GND Ground 27+V S +5V Supply28VDRVLogic Driver Supply VoltagePIN DESCRIPTIONS+V S .......................................................................................................+6V Analog Input...........................................................(–0.3V) to (+V S + 0.3V)Logic Input .............................................................(–0.3V) to (+V S + 0.3V)Case Temperature .........................................................................+100°C Junction Temperature ....................................................................+150°C Storage Temperature.....................................................................+150°C NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability.ABSOLUTE MAXIMUM RATINGS (1)Top ViewSSOPPIN CONFIGURATIONThis integrated circuit can be damaged by ESD. Texas Instru-ments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.GND Bit 1 (MSB)Bit 2Bit 3Bit 4Bit 5Bit 6Bit 7Bit 8Bit 9Bit 10Bit 11Bit 12 (LSB)CLK VDRV +V S GND IN IN CM REFT REFB GND OE INT/EXT OTR FS SEL +V S12345678910111213142827262524232221201918171615ADS807ESPECIFIED PACKAGE TEMPERATUREPACKAGE ORDERING TRANSPORT PRODUCT PACKAGE-LEADDESIGNATOR (1)RANGE MARKING NUMBER MEDIA, QUANTITY ADS807ESSOP-28DB–40°C to +85°CADS807EADS807E Tube, 50"""""ADS807E/1KTape and Reel, 1000NOTE: (1) For the most current specifications and package information refer to our web site at .PACKAGE/ORDERING INFORMATIONELECTRICAL CHARACTERISTICSAt T A = full specified temperature range, V S = +5V, differential input range = 2V to 3V for each input, sampling rate = 50MHz, unless otherwise noted.ADS8073SBAS072A ELECTRICAL CHARACTERISTICS (Cont.)At T A = full specified temperature range, V S = +5V, differential input range = 2V to 3V for each input, sampling rate = 50MHz, unless otherwise noted.(7) Excludes internal reference.TIMING DIAGRAMADS8075 SBAS072A SPECTRAL PERFORMANCEFrequency (MHz)510152025M a g n i t u d e (d B F S )–20–40–60–80–100f IN= 21MHz SNR = 68dBFS SFDR = 77dBFSSPECTRAL PERFORMANCEFrequency (MHz)510152025M a g n i t u d e (d B F S )0–10–20–30–40–50–60–70–80–90–100f IN = 10MHz SNR = 68dBFS SFDR = 82dBFSSPECTRAL PERFORMANCEFrequency (MHz)510152025M a g n i t u d e (d B F S )0–10–20–30–40–50–60–70–80–90–100f IN = 1MHz SNR = 68dBFS SFDR = 83dBFS SPECTRAL PERFORMANCE(Single-Ended, 2Vp-p)Frequency (MHz)4.59.013.5M a g n i t u d e (d B F S )–20–40–60–80–100f IN = 10MHz SNR = 68dBFS SFDR = 62dBFSSPECTRAL PERFORMANCE (Sampling Frequency = 27MHz)Frequency (MHz)4.59.013.5M a g n i t u d e (d B F S )–20–40–60–80–100f IN = 10MHz SNR = 68dBFS SFDR = 81dBFSTYPICAL CHARACTERISTICSAt T A = full specified temperature range, differential input range = 2V to 3V, sampling rate = 50MHz, and internal reference, unless otherwise noted.2-TONE INTERMODULATION DISTORTIONFrequency (MHz)510152025M a g n i t u d e (d B c )–20–40–60–80–100ADS8077SBAS072ASPECTRAL PERFORMANCE (Sampling Frequency = 53MHz)Frequency (MHz)5.310.615.921.226.5M a g n i t u d e (d B F S )–20–40–60–80–100f IN = 21MHz SNR = 68dBFS SFDR = 72dBFSSWEPT POWER SFDRInput Amplitude (dBFS)0–10–20–30–40–50–60S F D R (d B F S , d B c )10080604020f IN = 10MHzdBcdBFSUNDERSAMPLING(Sampling Frequency = 27MHz)Frequency (MHz)4.59.013.5M a g n i t u d e (d B F S )–20–40–60–80–100f IN = 50MHz SNR = 65dBFS SFDR = 73dBFSTYPICAL CHARACTERISTICS(Cont.)At T A = full specified temperature range, differential input range = 2V to 3V, sampling rate = 50MHz, and internal reference, unless otherwise noted.DYNAMIC PERFORMANCEvs SAMPLING FREQUENCY(Differential Input)Sampling Frequency (MHz)S F D R , S N R (d B )90858075706560354045505560SINAD vs SAMPLING FREQUENCY(Differential Input)Sampling Frequency (MHz)S I N A D (d B )7570656055354045505560800k600k 400k200k0OUTPUT NOISE HISTOGRAM (DC INPUT)C o u n t sN – 2N – 1N N + 1N + 2Code3V Full-ScaleDIFFERENTIAL LINEARITY ERROR(Single-Ended, Input Sampling Frequency = 40MHz)Output CodesD LE (L S B )1.0000.5000–0.500–1.0001024204830724096INTEGRAL LINEARITY ERROR (Sampling Frequency = 40MHz)Output CodesI L E (L S B )2.01.51.00.50–0.5–1.0–1.5–2.01024204830724096f IN = 10MHzINTEGRAL LINEARITY ERROROutput CodesI L E (L S B )2.01.51.00.50–0.5–1.0–1.5–2.01024204830724096f IN = 10MHzDIFFERENTIAL LINEARITY ERROR Output CodesD LE (L S B )2.01.51.00.50–0.5–1.0–1.5–2.01024204830724096INTEGRAL LINEARITY ERROROutput CodesI L E (L S B )2.01.51.00.50–0.5–1.0–1.5–2.001024204830724096DIFFERENTIAL LINEARITY ERROROutput CodesD LE (L S B )2.01.51.00.50–0.5–1.0–1.5–2.01024204830724096TYPICAL CHARACTERISTICS (Cont.)At T A = full specified temperature range, differential input range = 2V to 3V, sampling rate = 50MHz, and internal reference, unless otherwise noted.ADS8079SBAS072A•improves the noise immunity based on the converter ’s common-mode input rejection Using the single-ended mode, the signal is applied to one of the inputs, while the other input is biased with a DC voltage to the required common-mode level. Both inputs are equal in terms of their impedance and performance, except that applying the signal to the complementary input (IN) instead of the IN input will invert the input signal relative to the output code. For example, in case the input driver operates in inverting mode, using IN as the signal input will restore the phase of the signal to its original orientation. Time-domain applications may benefit from a single-ended interface con-figuration and its reduced circuit complexity. While maintain-ing good SNR, driving the ADS807 with a single-ended signal will result in a reduction of the distortion performance.Employing dual-supply amplifiers and AC-coupling will usu-ally yield the best results, while DC-coupling and/or single-supply amplifiers impose additional design constraints due to their headroom requirements, especially when selecting the 3Vp-p input range. However, single-supply amplifiers have the advantage of inherently limiting their output swing to within the supply rails. Alternatively, a voltage-limiting ampli-fier, like the OPA688, may be considered to set fixed-signal limits and avoid any severe over-range condition for the A/D converter.The full-scale input range of the ADS807 is defined by the reference voltages. For example, setting the range select pin to FS SEL = LOW, and using the internal references (REFT = +3.0V and REFTB = +2.0V), the full-scale range is defined to: FSR = 2 • (REFT – REFB) = 2Vp-p.The trade-off of the differential input configuration versus the single-ended is its higher complexity. In either case, the selection of the driver amplifier should be such that the amplifier ’s performance will not degrade the A/D converter ’s performance. The ADS807 operates on a single power supply, which requires a level shift to a ground-based bipolar input signals to comply with its input voltage range require-ments.T he input of the ADS807 is of a capacitive nature and thedriving source needs to provide the current to charge or discharge the input sampling capacitor while the track-and-hold is in track mode. This effectively results in a dynamic input impedance which depends on the sampling frequency.It most applications, it is recommended to add a series resistor, typically 20Ω to 50Ω, between the drive source and the converter inputs. This will isolate the capacitive input from the source, which can be crucial to avoid gain peaking when using wideband operational amplifiers. Secondly, it will create a 1st-order, low-pass filter in conjunction with the specified input capacitance of the ADS807. Its cutoff fre-quency can be adjusted even further by adding an external shunt capacitor from each signal input to ground. The opti-mum values of this R-C network depend on a variety of factors which include the ADS807 sampling rate, the se-lected op amp, the interface configuration, and the particular application (time domain versus frequency domain). Gener-ally, increasing the size of the series resistor and/or capacitorAPPLICATION INFORMATIONTHEORY OF OPERATIONThe ADS807 is a high-speed, CMOS A/D converter which employs a pipelined converter architecture consisting of 12internal stages. Each stage feeds its data into the digital error correction logic ensuring excellent differential linearity and no missing codes at the 12-bit level. The output data becomes valid after the rising clock edge (see Timing Dia-gram). The pipeline architecture results in a data latency of 6 clock cycles.The analog input of the ADS807 consists of a differential track-and-hold circuit. The differential topology along with tightly matched poly-poly capacitors produce a high level of AC performance at high sampling rates and in undersampling applications.Both inputs (IN, IN) require external biasing using a com-mon-mode voltage that is typically at the mid-supply level (+V S /2).DRIVING THE ANALOG INPUTSThe analog inputs of the ADS807 are a very high impedance.They should be driven through an R-C network designed to pass the highest frequency of interest. This prevents high-frequency noise in the input from affecting SFDR and SNR.The ADS807 can be used in a wide variety of applications and deciding on the best performing analog interface circuit depends on the type of application. The circuit definition should include considerations of input frequency spectrum and amplitude, single-ended or differential drive, and avail-able power supplies. For example, communication (frequency domain) applications process frequency bands not including DC. In imaging (time domain) applications, the input DC component must be maintained into the A/D converter.Features of the ADS807, including full-scale select (FS SEL ),external reference, and CM output provide flexibility to ac-commodate a wide range of applications. The ADS807should be configured to meet application objectives while observing the headroom requirements of the driving amplifi-ers to yield the best overall performance.The ADS807 input structure allows it to be driven either single-ended or differentially. Differential operation of the ADS807 requires an in-phase input signal and a 180° out-of-phase part simultaneously applied to the inputs (IN, IN). The differential operation offers a number of advantages which,in most applications, will be instrumental in achieving the best dynamic performance of the ADS807:•the signal swing is half of that required for the single-ended operation and therefore, is less demanding to achieve while maintaining good linearity performance from the signal source •the reduced signal swing allows for more headroom in the interface circuitry and therefore, a wider selection of the best suitable driver op amp •even-order harmonics are minimizedwill improve the SNR performance, but depending on the signal source, large resistor values may be detrimental to achieving good harmonic distortion. In any case, optimizing the R-C values for the specific application is encouraged.Transformer Coupled, Single-Ended to Differential ConfigurationIf the application requires a signal conversion from a single-ended source to drive the ADS807 differentially, an RF transformer might be a good solution. The selected trans-former must have a center tap in order to apply the common-mode DC voltage necessary to bias the converter inputs. AC-grounding the center tap will generate the differential signal swing across the secondary winding. Consider a step-up transformer to take advantage of a signal amplification with-out the introduction of another noise source. Furthermore, the reduced signal swing from the source may lead to improved distortion performance.The differential input configuration provides a noticeable advantage of achieving good SFDR over a wide range of input frequencies. In this mode, both inputs of the ADS807 see matched impedances. Figure 1 shows the schematic for the suggested transformer coupled interface circuit. The component values of the R-C low-pass may be optimized depending on the desired roll-off frequency. The resistor across the secondary side (R T) should be calculated using the equation R T = n2•R G to match the source impedance (R G) for good power transfer and VSWR.The circuit example of Figure 1 shows the voltage-feedback amplifier OPA680 driving the RF transformer, which converts the single-ended signal into a differential one. The OPA680 can be employed for either single- or dual-supply operation. For details on how to optimize its frequency response, refer to the OPA680 data sheet (SBOS083), available at . With the 49.9Ω series output resistor, the ampli-fier emulates a 50Ω source (R G). Any DC content of the signal can be easily blocked by a capacitor (0.1µF) and to also to avoid DC loading of the op amp’s output stage.AC-Coupled, Single-Ended-to-Differential Interface with Dual-Supply Op AmpsCommunications applications, in particular, demand a very high dynamic range and low levels of intermodulation distor-tion, but usually allow the input signal to be AC-coupled into the A/D converter. Appropriate driver amplifiers need to be selected to maintain the excellent distortion performance of the ADS807. Often, these op amps deliver the lowest distor-tion with a small, ground-centered signal swing that requires dual power supplies. Because of the AC-coupling, this re-quirement can be easily accomplished and the needed level shifting of the input signal can be implemented without affecting the driver circuit.See Figure 2 for an example of such an interface circuit specifically designed to maximize the dynamic performance. The voltage feedback amplifier, OPA642, maintains an ex-cellent distortion performance for input frequencies of up to 15MHz. The two amplifiers (A1, A2) are configured as an inverting and noninverting gain stage to convert the input signal from single-ended to differential. The nominal gain for this stage is set to +2V/V. The outputs of the OPA642s are AC-coupled to the converter’s differential inputs. This will keep the distortion performance at its best since the signal range stays within the linear region of the op amp and sufficient headroom to the supply rails can be maintained. Four resistors located between the top (REFT) and bottom (REFB) reference shift the input signal to a common-mode voltage of approximately +2.5V.The interface circuit of Figure 2 can be modified to extend the bandwidth to approximately 25MHz by replacing the OPA642 with its decompensated version, the OPA643. The OPA643 provides the necessary slew rate for a low distortion front end to the ADS807. With a minimum gain stability of +3, the gain resistors have to be modified, as well as optimizing the series resistor and shunt capacitance at each of the converter inputs.FIGURE 1. Converting a Single-Ended Input Signal into a Differential Signal Using a RF-Transformer.分销商库存信息:TIADS807E ADS807E/1K ADS807E/1KG4 ADS807EG4DEM-ADS807E。
2024版年度Hyperlynx教程中文版精讲
电源地平面处理
合理设计电源地和信号地平面，降低地线阻抗和 噪声。
ABCD
2024/2/2
去耦电容配置
在关键元器件附近配置去耦电容，减少电源噪声 和干扰。
电源完整性仿真
采用仿真软件对电源完整性进行分析和评估，提 前发现并解决潜在问题。
17
04 高速数字电路设 计专题研讨
2024/2/2
18
高速数字信号传输理论基础
布线设计
根据布局进行布线设计，遵循一定的布线规则和技巧， 确保信号传输的完整性和稳定性。
审核与优化
对设计进行审核，检查是否存在错误或不合理之处， 并进行优化改进。
输出与制造
将设计输出为制造文件，进行PCB板的制造和组装。
14
布局布线策略优化探讨
布局策略
布线技巧
采用分区布局、模块化布局等策略，提高布 局的合理性和可维护性。
工具栏功能
工具栏提供了常用的操作按钮，如画图工具、选择工具、缩放工具等，方便用 户进行各种操作。
2024/2/2
6
初学者常见问题解答
如何导入和导出数 据？
如何查看和分析仿 真结果？
如何创建新的工程？ 2024/2/2
如何设置仿真参数？
遇到软件崩溃或无 法启动等问题怎么 办？
7
02 原理图设计与仿 真基础
30
频率响应和噪声性能评估指标
2024/2/2
频率响应指标
包括增益、相位裕度、带宽等，用于评估电路在不同频率下的性能表 现。
噪声性能指标
包括信噪比、噪声系数、噪声密度等，用于评估电路在噪声环境下的 性能表现。
稳定性分析
通过仿真分析电路的稳定性，如相位裕度、增益裕度等，避免电路出 现自激振荡等不稳定现象。
E24
*/
#include <intrins.h>
void PrintByte(unsigned char byte_data)
{
while( BUSY == 1 ){
}
PRINTER_DATA = byte_data;
nSTB = 0;
_nop_();
// 调整 nSTB 信号脉宽
nSTB = 1;
}
/*
SETB TR1
; 启动定时器 T1
14
炜煌针式打印机说明书
MOV SCON, #50H
; 设置串行口工作方式为异步串行口，模式 1
SETB TI
; 设置标志位，为发送数据作准备
RET
; 定义待打印数据内容
; 保存在程序段
print_content:
DB '北京炜煌科技微型打印机', 0DH, 'MicroPrinter demo', 0DH
该信号高电平时，表示打印机正“忙”不能接受数据，而当该信号
2
BUSY 出
低电平时，表示打印机“准备好”，可以接收数据）
6
BUSY 出 同 BUSY（TTL 电平时，此引脚为空引脚）
9
GND — 信号地
注: 1.“入”表示输入到打印机； 2.“出”表示从打印机输出 3.信号的逻辑电平为 TTL 电平。
2.1.3 并口例程
单片机控制打印机时汇编例程
BUSY
EQU P3.2
; 定义 BUSY 信号引脚
nSTB
EQU P3.7
; 定义 nSTB 信号引脚
ORG 0000H
6
0 . 5μS 0 . 5μS
start: main:
TLE2144CN资料
TLE214x, TLE214xA EXCALIBUR LOW NOISE HIGH SPEED PRECISION OPERATIONAL AMPLIFIERS
SLOS183C − FEBRUARY 1997 − REVISED JUNE 2006
D Low Noise D D D D D
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
0°C to 70°C −40°C to 105°C −55°C to 125°C
1200 µV TLE2142MD TLE2142MFK TLE2142MJG — — † The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2142ACDR). ‡ The PW packages are available left-ended taped and reeled. Add LE the suffix to device type (e.g., TLC2142CPWLE). TLE2144 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25°C 1.5 mV 2.4 mV 1.5 mV 2.4 mV 1.5 mV 2.5 mV SMALL OUTLINE† (DW) — TLE2144CDW — TLE2144IDW — TLE2144MDW CHIP CARRIER (FK) — — — — TLE2144AMFK TLE2144MFK CERAMIC DIP (J) — — — — TLE2144AMJ TLE2144MJ
巨鹰Giant204 四通道称重模块 用户手册说明书
Giant204四通道称重模块用户手册 V1.0目录1 技术支持 (3)2 产品介绍 (4)3 技术参数 (5)4 外形尺寸,电气连接以及选型 (6)4.1 外形尺寸 (6)4.2 电气连接与说明 (6)4.2.1 称重传感器连接 (7)4.2.2 指示灯 (8)4.2.3 通信接口RS232/RS485 (8)4.3 选型 (8)5 显示与按键 (9)6 功能与设置 (10)6.1 主界面显示与功能 (11)6.1.1 相关指令 (12)6.2功能菜单 (15)6.2.1 相关指令 (16)6.3校准菜单 (21)6.3.1 校准方式选择菜单 (21)6.3.2 实物校准菜单 (22)6.3.3 数字校准菜单 (24)6.3.4 相关指令 (25)6.4 参数保存菜单 (27)6.4.1相关指令 (27)6.5 显示设置菜单 (28)6.5.1相关指令 (28)6.6 通信设置菜单 (29)6.6.1 相关指令 (30)7 MODBUS通讯协议 (33)8用户设置软件 (40)8.1 软件安装与启动 (40)9 附件 (41)9.1 仪表显示的错误代码 (41)9.2 基本术语 (41)9.3 标准ASCII码 (42)1 技术支持感谢您选择并使用大连哲勤科技有限公司产品，此用户手册协助您了解并正确使用设备。
如需订购产品、技术支持、以及产品信息反馈，请通过以下方式联系我们。
请在联系时附注设备的购买时间，购买方式，联系人信息，地址以及电话等相关信息，便于我们为您服务。
网址E-Mail**************电话+86-411-66831953， 4000-511-521传真+86-411-82388125版本控制2 产品介绍Giant204四通道称重变送器是面向工业控制领域的重量变送器，集四个高速称重通道，RS485和RS232通信接口于一体（Modbus-RTU通信协议），同时进行四个重量的独立并行高速检测。
2024E说明书
有功电度、无功电度在显示的时候分别占用 LEDB、LEDC，其中低位数据显示在 LEDC 上， 电度显示的单位本装置为固定 KWH/KVARH。 显示精度为 0.1 KWH/KVARH。最大显示量为 9999999.9。
如果设置为自动循环显示方式时，当按键在连续 20 秒（此时间可手工设置）无任何触发， 显示将自动进入循环显示，显示相电压 VLN，线电压 VLL，电流 I，P，Q，功率因数，有功 电度 EP，无功电度 EQ。
➢ 总述
1、 功能简述
特点：
DOE2024E 综合电量测控仪表是林洋电气科技有限公司产品的重要组成。该设计充分考
虑性价比、易用性、可靠性和配套性。
◇ 采用交流直接离散采样技术，对电压、电流进行谐波分析和测量
◇ 可任意设定 PT/CT 变比
◇ 高亮度 LED 显示，寿命长，可视度高
◇ 显示可滚动设置
◇ 安装方便，插件结构，接线美观
电压显示的数值单位，通常为 V。 当 PT 变比很大，导致显示的数值超过 1000V 时，显示的电位转换为 KV，K 灯会点亮；当 一次侧电压超过 1000 000V 时，M 灯会点亮。
电流显示的数值单位，通常为 A。 当 CT 变比很大，导致显示的数值超过 1000A 时，显示的电位转换为 KA，K 灯会点亮。 P/Q/COS 分别在 LEDA，LEDB，LEDC 三行显示，单位：P 为 W，Q 为 VAR，COS 为 0.000； P/Q 其中任一数据超过 1000 时，则显示 KW/KVAR，K 灯会点亮； P/Q 其中任一数据超过 1000 000 时，则显示 MW/MVAR，M 灯会点亮；
BAUD
标识符
LEDB
0000
波特率高位
LEDC
2024 Lexus IS线上书说明书
To deliver pure exhilaration, there are no shortcuts. Pushed to the limitat every turn, the 2024 IS line offers daring style, uncompromisingengineering and a 472-horsepower 1 IS 500.IS 300 / 350 F SPORT DESIGN IS 300I S S T Y L E S 241-horsepower 1 in-line 4 turbo (RWD )or 260-horsepower 1 3.5-liter V6 (AWD )All IS models include Lexus Safety311-horsepower 1 3.5-liter V6 (IS 350 RWD/AWD ) F SPORT exterior styling and F SPORT–tuned suspension IS 300 / 350 F SPORT F SPORT seats with enhanced bolsters Aluminum pedalsThe IS 500 is the most powerful IS,with a 472-horsepower 1 5.0-liter V8Triple-Beam LED headlamps Navigation System 5 and Mark Levinson ®6 IS 500 F SPORT PERFORMANCE IS 500 F SPORT PERFORMANCE PREMIUM 500 S T Y L E SLearn more at/ISPerformance Visual effects shown. Do not attempt.E RF O R M A N C E F E A T U R E S I S I S F S P O R T s h o w n i n I r i d i u m 3IS 300 / 350 F SPORT DESIGN IS 300 / 350 F SPORT IS 300 Available all-wheel driveEight-speed Sport Direct-Shift0–60 in 5.6 seconds 7 (IS 350 RWD ) 0–60 in 6.1 seconds 7 (IS 300 AWD ) Performance-inspired instrumentation 19-inch staggered-width alloy wheelsYamaha ® rear performance dampers F SPORT–tuned AdaptiveTorsen ®8 limited-slip rear differential Two-piece aluminum 14.0-in Exclusive stacked quad exhaust tips Naturally aspirated V8 with472 horsepower 1 at 7,100 rpm E R F O R M A N C E F E A T U R E S I S 500Learn more at /ISPerformanceWith dramatic character lines on the outside, bold details inside and expressions of F SPORT styling, the 2024 IS line looks as aggressive as it feels.D E S I G N F E A T U R E S I S Learn more at /ISDesign IS 300 Low, imposing stanceAerodynamic, coupe-like silhouette Slim LED headlamps with integrated daytime running lightsAvailable 19-inch split-10-spoke alloy wheels Available heated and ventilated front seatsLearn more at /ISDesign D E S I G N F E A T U R E S O R T M O D E L S I S F S P O R T s h o w n i n U l t r a W h i t e 3IS 300 / 350 F SPORT IS 300 / 350 F SPORT DESIGN F SPORT exterior styling, including grille surround and rear spoilerF SPORT seats with enhanced bolsters Silver and white F SPORT badging F SPORT Black Geometric interior trim Available 19-inch Matte BlackD E S I G N F E A T U R E S I S 500Learn more at/ISDesignIS 500Raised front hoodBlack F SPORT Performance19-inch split-10-spoke Enkei alloy wheelswith Dark Metallic finish F SPORT Performance front door-sill scuff plates Satin interior trimOffering a 10.3-inch pinch-and-zoom touchscreen multimedia display, this is more than technology that connects you—it’s an extension of you.Lexus app (engine start with active Enform Remote 12 trial or subscription, service scheduling and more)Apple CarPlay ®10 integrationAndroid Auto TM11 compatibilityPerformance-inspiredinstrumentation. The IS 500 takes the F SPORT digital gauges further with an Learn more at/ISTechnologyE C H N O L O G YF E A T U R E S17 speakers 1,800 watts7.1-channel architectureQuantumLogic ®6 SurroundH N O L O G Y F E A T U R E SAVAILABLEMARK LEVINSON ® PREMIUM SURROUND SOUNDOur integrated suite of standard active safety equipment and convenience features, Lexus Safety System+ 2.52 adds peace of Learn more at/ISSafetyHNOLOGYFEATURESUp to 10-year trial of Service Connect 23 Complimentary loaner vehicles 24Complimentary vehicle wash 25OWNERSHIP SERVICESTwo complimentary maintenance services 21 4-year/50,000-mile Basic Warranty 22X U S C A R ESAFETYIn addition to standard Lexus Safety System+ 2.5,2 every IS also includes up to a 3-year trial ofSafety Connect.26CONNECTIVITYW ith LexusCare, every new IS comes standard withconnectivity services, including a 3-year trial ofEnform Remote12 and a SiriusXM®27 3-month X U SCAREX U S C A R EEXCLUSIVE EXPERIENCESLearn more at/LexusCareEntertainment exclusives Elite culinary experiencesExclusive retailer offers VIP sporting event accessResort credits and moreIS 350IS 300IS 500IS 300 AWD HORSEP OWER 1HORSEP OWER 1311241HORSEP OWER 1HORSEP OWER 14722603.5-LITER ENGINETURBOCHARGED 2.0-LITER ENGINE5.0-LITER ENGINELB-FT OF TORQUE 1LB-FT OF TORQUE 1LB-FT OF TORQUE 1LB-FT OF TORQUE 13.5-LITER ENGINESPEED SP ORTDIRECT-SHIFT AUTOMATIC TR ANSMISSION SPEEDAUTOMATIC TR ANSMISSIONSPEED SP ORTDIRECT-SHIFT AUTOMATIC TR ANSMISSIONCTY / HWY / CMBMANUFACTURER-ESTIMATED MPG 28CTY / HWY / CMBMANUFACTURER-ESTIMATED MPG 28CTY / HWY / CMBMANUFACTURER-ESTIMATED MPG 28CTY / HWY / CMBMANUFACTURER-ESTIMATED MPG 28CTY / HWY / CMBMANUFACTURER-ESTIMATED MPG 28SPEED SP ORTDIRECT-SHIFT AUTOMATIC TR ANSMISSIONSPEEDAUTOMATIC TR ANSMISSIONRWDAWD RWDRWDAWDSTANDARDAVAIL ABLESTANDARDSTANDARDSTANDARD86820/28/2319/26/2221/31/2517/25/2019/26/2286 5.65.76.94.46.1IN-LINE4V8395280236258V6V60–60 MPH (SEC)40–60 MPH (SEC)70–60 MPH (SEC)70–60 MPH (SEC)70–60 MPH (SEC)7IS STYLESStandard features:- LED headlamps, taillamps and daytime running lights - NuLuxe ® interior trim- Eight-way power front seats - Dual-zone climate control - Heated outside mirrors- Apple CarPlay ®10 integration - Android Auto™11 compatibility- L exus Multimedia System with 8.0-inch touchscreen display- L exus Enform Safety Connect,26 Service Connect,23 Remote,12 and Wi-Fi 29 trials. Paid subscription required after trial. 4G network dependent. See for details.- Blind Spot Monitor 30 with Rear Cross-T raffic Alert 31- Backup camera with dynamic gridlines 32- 10 standard airbags 33IS 300Includes IS 300 features, and adds or replaces:- Heated front seats- F SPORT–tuned suspension- F SPORT exterior styling, including unique front and rear bumpers, grille surround, rear spoiler and exhaust tips- F SPORT 19-in split-five-spoke alloy wheels with Dark Metallic finish and summer (RWD ) or all-season (AWD ) tires - F SPORT Design exterior badgingIS 300/350 F SPORT DESIGNIS 300/350 F SPORTIncludes IS 350 F SPORT Design features, and adds or replaces:- P erformance-inspired instrumentation with sliding bezel- F SPORT heated leather-trimmed steering wheel - F SPORT bolstered, heated and ventilated front seats - 10-way power-adjustable driver’s seat including lumbar support - Four-way adjustable headrests - Embossed interior door trim - Black Geometric interior trim - Aluminum pedals- F SPORT 19-in split-five-spoke staggered-width alloy wheels with Dark Metallic finish and summer (RWD ) or all-season (AWD ) tiresView all standard features and configure yours at /ISBuildIS 500 STYLESIS 500 F SPORTPERFORMANCEIS 500 F SPORTPERFORMANCE PREMIUMIncludes IS 350 F SPORT features,and adds or replaces:- Drive Mode Select with Sport S/S+ and Custom modes- Power tilt-and-slide moonroof- Intuitive Parking Assist with Auto Braking34 andRear Cross-T raffic Braking35- Power tilt-and-telescopic steering wheel- Outside mirrors with Dark Chrome trim and auto tilt-downin reverse- Lexus Memory System for driver’s seat, outside mirrorsand steering wheel- Y amaha® rear performance dampers- F SPORT–tuned Adaptive Variable Suspension- T wo-piece aluminum 14.0-in front and 12.7-inrear brake rotors- Quad exhaust tips- Raised front hood- Satin interior trim- F SPORT Performance front door-sill scuff plates- IS 500 startup animation in multi-information display- F SPORT Performance 19-in split-10-spoke staggered-width Enkei alloy wheels with Dark Metallic finishIncludes IS 500 F SPORT Performance features,and adds or replaces:- Panoramic View Monitor13- Power rear sunshade- Triple-Beam LED headlamps- Navigation System5- 10.3-in high-resolution touchscreen multimedia display-L exus Enform Dynamic Navigation,36 Dynamic VoiceCommand,and Destination Assist37 trials. Paid subscriptionrequired after trial. 4G network dependent. See for details.- Mark Levinson®6 17-speaker, 1,800-wattPremium Surround Sound- Machined aluminum control knobsPACKAGESCOMFORT PACKAGE (IS 300)M EM ORY PACKAGE(IS 300 F SPORT, IS 350 F SPORT)- Heated and ventilated front seats- Heated leather-trimmed steering wheel - Power tilt-and-slide moonroof- Rain-sensing windshield wipers- Auto-dimming rearview mirror with HomeLink®38 system PREMIUM PACKAGE(IS 300)Includes Comfort Package features,and adds or replaces:- Open-Pore Black interior trim- Power tilt-and-telescopic steering column- Outside mirrors withauto tilt-down in reverse- Lexus Memory System for driver’s seat,outside mirrors and steering wheel- 19-in split-10-spoke alloy wheelswith summer (RWD) orall-season (AWD) tires- Front door-sill scuff plates- Rear armrest with cupholders- Power rear sunshade- Power tilt-and-telescopic steering wheel- Outside mirrors with auto tilt-down in reverse- Lexus Memory System for driver’s seat,outside mirrors and steering wheelNAVIGATION PACKAGEPACKAGES (CONT.)Includes Navigation Package, plus:- M ark Levinson ® 17-speaker, 1,800-watt Premium Surround Sound- Machined aluminum control knobsHANDLING PACKAGE (IS 350 F SPORT )I S F S P O R T s h o w n i n C l o u d b u r s t G r a y 3- Navigation System 5- 10.3-in high-resolution touchscreen multimedia display- L exus Enform Dynamic Navigation,36Dynamic Voice Command, and Destination Assist 37 trials. Paid subscription required after trial. 4G network dependent. See for details.- Drive Mode Select with Sport S/S+ and Custom modes- F SPORT–tuned Adaptive Variable Suspension- Torsen ®8 limited-slip rear differential (RWD )NAVIGATION /MARK LEVINSON PACKAGEBLACKOUT PACKAGE (IS 350 F SPORT )Includes Memory Package and Handling Package features, and adds or replaces:- 19-in Matte Black BBS ®9 wheels - Dark Chrome window trim- Dark Chrome outside mirror trim- Triple-Beam LED headlamps - Power tilt-and-slide moonroof - Power rear sunshade - Panoramic View Monitor13- Intuitive Parking Assist with Auto Braking34 andRear Cross-Traffic Braking35- Mark Levinson® 17-speaker, 1,800-wattPremium Surround Sound18-inSplit-five-spoke alloy wheels STANDARD IS 30019-inSplit-seven-spoke forged alloy Matte Black BBS ®9 wheels AVAILABLE IS 350 F SPORT,IS 500 F SPORT Performance,IS 500 F SPORT Performance Premium19-inSplit-10-spoke alloy wheels AVAILABLE IS 30019-inSplit-five-spoke alloy wheels with Dark Metallic finish STANDARDIS 300/350 F SPORT Design,IS 300/350 F SPORT19-inSplit-10-spokeEnkei alloy wheels with Dark Metallic finish STANDARD IS 500 F SPORT Performance,IS 500 F SPORTPerformance PremiumBLACK NULUXE INTERIORBLACK METALLIC INTERIOR TRIMIS 300IS 300IS 300IS 300FPOWHITENULUXEINTERIORIS 300/350 F SPORT DESIGN IS 300/350 F SPORTIS 500 F SPORTPERFORMANCEIS 500 F SPORTPERFORMANCE PREMIUM IS 300/350 F SPORT DESIGNIS 300/350 F SPORTIS 500 F SPORTPERFORMANCEIS 500 F SPORTPERFORMANCE PREMIUMIS 300/350 F SPORTIS 500 F SPORTPERFORMANCEIS 500 F SPORTPERFORMANCE PREMIUMIS 300/350 F SPORTDESIGNSATININTERIOR TRIMWHITE NULUXE INTERIORIS 300/350 F SPORT DESIGNIS 500 F SPORTPERFORMANCEIS 500 F SPORTPERFORMANCEPREMIUMIS 300/350 F SPORTDESIGNIS 300/350 F SPORTDESIGNIS 300/350 F SPORTIS 500 F SPORTPERFORMANCEIS 500 F SPORTPERFORMANCEPREMIUMIS 300/350 F SPORTIS 500 F SPORTPERFORMANCEIS 500 F SPORTPERFORMANCEPREMIUMIS 300/350 F SPORTDESIGNIS 300/350 F SPORTIS 500 F SPORTPERFORMANCEIS 500 F SPORTPERFORMANCEPREMIUMIS 300/350 F SPORTIS 300IS 300IS 300IS 300IS 300WHITE NULUXE INTERIORIS 300IS 300/350 F SPORT DESIGN IS 300IS 300/350 F SPORTDESIGNIS 300IS 300/350 F SPORTDESIGNIS 300 IS 300/350 F SPORTIS 500 F SPORTPERFORMANCEIS 500 F SPORTPERFORMANCEPREMIUMIS300/350F SPORTIS 500 F SPORTPERFORMANCEIS 500 F SPORTPERFORMANCEPREMIUMIS 500 F SPORTPERFORMANCEIS 500 F SPORTPERFORMANCEPREMIUMIS 300IS 300/350 F SPORTDESIGNIS 300/350 F SPORTIS 500 F SPORTPERFORMANCEIS 500 F SPORTIS300/350F SPORTWHITE NULUXE INTERIORIS 300IS 300/350 F SPORT DESIGN IS 300IS 300/350 F SPORTDESIGNIS 300IS 300/350 F SPORTDESIGNIS 300 IS 300/350 F SPORTIS 500 F SPORTPERFORMANCEIS 500 F SPORTPERFORMANCEPREMIUMIS 300/350 F SPORTIS 500 F SPORTPERFORMANCEIS 500 F SPORTPERFORMANCEPREMIUMIS 500 F SPORTPERFORMANCEIS 500 F SPORTPERFORMANCEPREMIUMIS 300/350 F SPORTIS 300IS 300/350 F SPORTDESIGNIS 300/350 F SPORTIS 500 F SPORTPERFORMANCEIS 500 F SPORTWHITE NULUXE INTERIORIS 500 F SPORT PERFORMANCE IS 500 F SPORT PERFORMANCE PREMIUM IS 350 F SPORT DESIGNIS 350 F SPORT DESIGN IS 350 F SPORTIS 500 F SPORTPERFORMANCEIS 500 F SPORTPERFORMANCEPREMIUMIS 350 F SPORTIS 500 F SPORTPERFORMANCEIS 500 F SPORTPERFORMANCEPREMIUMIS 350 F SPORTDESIGNIS 350 F SPORTIS 500 F SPORTPERFORMANCEIS 500 F SPORTPERFORMANCEPREMIUMIS 350 F SPORTIS 500 F SPORTPERFORMANCEIS 500 F SPORTPERFORMANCEPREMIUMWHITE NULUXE INTERIORIS 300IS 300/350 F SPORT DESIGN IS 300IS 300/350 F SPORTDESIGNIS 300IS 300/350 F SPORTDESIGNIS 300 IS 300/350 F SPORTIS 500 F SPORTPERFORMANCEIS 500 F SPORTPERFORMANCEPREMIUMIS 300/350 F SPORTIS 500 F SPORTPERFORMANCEIS 500 F SPORTPERFORMANCEPREMIUMIS 500 F SPORTPERFORMANCEIS 500 F SPORTPERFORMANCEPREMIUMIS 300/350 F SPORTIS 300IS 300/350 F SPORTDESIGNIS 300/350 F SPORTIS 500 F SPORTPERFORMANCEIS 500 F SPORTEMINENT WHITE PEARL*EXTERIORIS 300IS 300IS 300IS 300IS 300ULTRA WHITE*EXTERIORWHITENULUXEINTERIORIS 500 F SPORT PERFORMANCE IS 500 F SPORT PERFORMANCE PREMIUM IS 300/350 F SPORT DESIGNIS 300/350 F SPORT IS 500 F SPORT PERFORMANCEIS 500 F SPORT PERFORMANCE PREMIUM IS 300/350 F SPORTIS 500 F SPORTPERFORMANCEIS 500 F SPORTPERFORMANCEPREMIUMIS 300/350 F SPORTDESIGNIS 300/350 F SPORTIS 500 F SPORTPERFORMANCEIS 500 F SPORTPERFORMANCEIS 300/350 F SPORTIS 300/350 F SPORT DESIGN IS 300/350 F SPORT DESIGNACCESSORIES- All-weather floor liners 39- All-weather floor mats 39- All-weather trunk tray - Alloy wheel locks - Body side moldings - Cargo net 40- Carpet floor mats 39- Carpet trunk mat - Coin holder / ashtray cup - Door edge film by 3M™- Door edge guards - Emergency assistance kit - First aid kit- Glass breakage sensor- Illuminated door sills - Illuminated trunk sill - Key gloves with Lexus logo - Lexus Universal Tablet Holder - Paint protection film by 3M™41- Rear bumper appliqué- Rear spoilerF SPORT ACCESSORIES- Key gloves with F logo - Lowering springsLearn more at /accessoriesThe Lexus Performance Driving School is a full-day program where you’ll get to experience vehicles infused with the DNA of the RC F GT3 racecar firsthand. Designed to build driving skills and confidence—on and off the track—it’s nothing short of pure exhilaration.Lexus PerformanceR F O R M A N C E D R I V I N G S C H O O LLearn more atRestrictions for participation apply, including but notIconic CircuitsTake the driver’s seat and unleash your driving prowess at some of the most iconic motorsports venues in Learn how Lexus performance design, features and technologies deliver a feeling of extreme driver engagement Driver DevelopmentElevate your driving skills with personalized coaching across a variety of driving activities, from1. 2. 3.4. 5.6.7.8.9.10.11.12.13.14.15.16.17.18.19.20.21.22.23.24.25.26.27.28.29.30.31.32.33.34.35.36.37.38.39.40.41.。
EH4说明书
一、EH4是全新概念的电导率张量测量仪通常意义下的电探仪，指的是交、直流电阻率剖面仪。
这两种方法都是有源测量方法，需要向地下直接供电，并且随着测量深度加大，电极布线和供电量都不断增加，野外劳动强度大，效率低。
另一方面，尽管这两种方法都属于有源电探，但采集到的视电阻率值都属于标量范畴，对辨别地下二度体异常的走向无能为力。
大地电磁同属于电探，但它是无源测量。
利用天然电磁场，虽然避免了大电流供电，但天然电磁场不稳定，而且某些频段先天不足，干扰强，讯号弱。
参看（图1）大地电磁场水平分量频谱展示图。
它反映了天然电磁场与人文电磁场的分布情况。
在1Hz左右，无论电场和磁场都是低谷；在1000Hz处磁场几近寂静，电场有一低谷。
在几十赫兹到104Hz范围内，人文活动的电磁场干扰特别严重。
这些特点决定了大地电磁法只适合于采集较低频率。
通常观测时间长，分辨率较低，适合解决深层宏观问题。
所以尽管电探方法起源最早，几十年来，由于以上的局限性，一直阻碍它的发展。
几十年来，1000米以内，几百米上下，正是人类经济、文明活动在地壳上层最活跃的深度。
其它物探方法，如地震勘探法，自40~50年代之后都开始大展身手，而浅、中深度范围的电探则相对寂寞冷落，处于陪衬地位。
也正是这种现状激发了国内外众多的科学家和仪器制造商不断研制开发新的电探仪器，寻找新的电探方法。
96年中下旬，由美国以研制大地电磁仪器而闻名的EMI公司和以制造高分辨率地震仪著名的Geometrics公司联合研制出EH4。
这是全新概念的电导率张量测量仪。
它利用大地电磁的测量原理，但配置了特殊的人工电磁波发射源。
这种发射源的天线是一对十字交叉的天线，组成X、Y两个方向的磁偶极子，轻便而且只用于普通汽车电瓶供电，发射率从500Hz到100KHz，专门用来弥补大地电磁场的寂静区和几百赫兹附近的人文电磁干扰谐波（见图1）。
仪器用反馈式高灵敏度低噪音磁棒和特制的电极，分别接收X、Y两个方向的磁场和电场。
UL 486E-2000 中文版 用于连接铝和或铜导体的设备接线端子
UL 486E用于连接铝和/或铜导体的设备接线端子目次前言引言1 范围2 测量单位3 参考结构4 总则5 材料性能6 总则7 样品的选择7．1 总则7．2 热循环7．3 静态加热程序7．4 机械程序8 样品的准备8．1 总则8．2 试验和控制导线8．3 导线剥皮8．4 拧紧扭矩8．5 均衡器9 温度测量10热循环试验10．1 总则10．2 样品试验装配装置10．3 紧固部件11 静态加热试验12 牢固性试验13 重复静态加热试验14 拔出试验14A 10天潮湿氨-空气应力断裂试验标志15 详细内容引言1 范围1．1 这些要求适用于预期与（带有符合“国家电气法规NFPA 70”的铜、铝或覆铜铝线的）器具或设备一起使用的压力型设备接线端子。
端子的结构要保证它们与任何导线一起使用都是可接受的。
1．2 这些要求适用于现场连接的设备接线端子，它们是设备整体的一部分，或预期用在某一特定设备中。
1．3 这些要求覆盖了标定电流的设备接线端子、标定功率的端子和标定导线范围的端子，这些端子预期用在器具和设备中并符合这些器具和设备的要求。
1．4 这些要求覆盖了预期与AWG 12（3.3）或以上的铝或覆铜铝导线以及AWG 30（0.05 mm2）或以上的铜导线一起使用的端子型导线连接器。
电流额定值基于按照连接器的额定值标定为75︒C或90︒C的绝缘导体的载流量，且不超过接线端子的最大电流额定值（如果提供的话）。
对于预期与标准导线一起使用的设备接线端子，则预期采用下述导线股结构：铝线——B类同心、压缩、及单向捻实的铜线——B类同心和压缩，C类同心覆铜铝线——B类同心也可以按标识所示包括其它类别及绞股结构。
（1995年8月29日对1.4进行了修订）1．4A 这些要求还覆盖了为AWG 2（33.6 mm2）及以上的压实绞股铜导线附加标定的连接器。
这些连接器是按照15.9A标记的。
参见4.1及8.2.6(b)(3)例外。
（2000年5月23日对1.4A进行了修订）1．4B这些要求还覆盖了1.3规定的预期与米制导线一起使用的其横截面积在标定的AWG/kcmil导线范围内的所有类型的连接器。
servo伺服电机(2024)
驱动器参数配置
根据电机参数和应用需求进行驱动器 参数配置，如电流环、速度环、位置 环等参数调整。
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调试技巧与注意事项
初始化设置
正确设置电机和驱动器的初始参 数，如电机类型、编码器类型、
通讯协议等。
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调试步骤
按照先开环后闭环、先低速后高速 的原则进行调试，逐步调整控制器 参数以达到最佳性能。
行业竞争日益激烈，国内外企业 纷纷加大研发投入，推出高性能
、高可靠性的伺服电机产品。
随着技术的不断进步和应用领域 的拓展，伺服电机企业需要不断 创新，提高产品附加值和竞争力
。
面对国际贸易摩擦和疫情等不确 定性因素，企业需要加强风险管 理，提高供应链稳定性和市场应
变能力。
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THANKS
市场需求
随着工业自动化程度的不断提高和智能制造的快速发展，伺服电机的市场需求不断增长 。同时，对伺服电机的性能、精度和可靠性等方面的要求也越来越高。未来，伺服电机
市场将继续保持快速增长态势，并向更高性能、更高精度和更智能化的方向发展。
6
02
伺服电机结构与组成
Chapter
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主要部件及功能
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能够实现高精度的位置 、速度和扭矩控制。
具有快速动态响应特性 ，适用于高速、高精度 运动控制场合。
能够实现宽范围的调速 ，满足不同应用需求。
5
采用高品质材料和先进 制造工艺，具有较高的 可靠性和稳定性。
应用领域及市场需求
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应用领域
伺服电机广泛应用于自动化设备、机器人、数控机床、印刷机械、包装机械、纺织机械 等领域。
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0°C to 70°C – 40°C to 85°C – 55°C to 125°C
— — TLE2022AMFK TLE2022MFK
— TLE2022BMJG TLE2022AMJG TLE2022MJG
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—
—
† The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2022CDR). ‡ The DB and PW packages are only available left-end taped and reeled. § Chip forms are tested at 25°C only. TLE2024 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25°C 500 µV 750 µV 1000 µV 500 µV 750 µV 1000 µV 500 µV 750 µV 1000 µV SMALL OUTLINE (DW) TLE2024BCDW TLE2024ACDW TLE2024CDW TLE2024BIDW TLE2024AIDW TLE2024IDW TLE2024BMDW TLE2024AMDW TLE2024MDW CHIP CARRIER (FK) — CERAMIC DIP (J) — PLASTIC DIP (N) TLE2024BCN TLE2024ACN TLE2024CN TLE2024BIN TLE2024AIN TLE2024IN TLE2024BMN TLE2024AMN TLE2024MN CHIP FORM§ (Y) — — TLE2024Y —
Copyright 2002, Texas Instruments Incorporated
POST OFFICE BO75265
1
元器件交易网
TLE202x, TLE202xA, TLE202xB, TLE202xY EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS
D D D D D D
Supply Current . . . 300 µA Max High Unity-Gain Bandwidth . . . 2 MHz Typ High Slew Rate . . . 0.45 V/µs Min Supply-Current Change Over Military Temp Range . . . 10 µA Typ at VCC ± = ± 15 V Specified for Both 5-V Single-Supply and ±15-V Operation Phase-Reversal Protection
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
0°C to 70°C
– 40°C to 85°C
— TLE2024BMFK TLE2024AMFK TLE2024MFK
— TLE2024BMJ TLE2024AMJ TLE2024MJ
– 55°C to 125°C
—
§ Chip forms are tested at 25°C only.
2
description
The TLE202x, TLE202xA, and TLE202xB devices are precision, high-speed, low-power operational amplifiers using a new Texas Instruments Excalibur process. These devices combine the best features of the OP21 with highly improved slew rate and unity-gain bandwidth. The complementary bipolar Excalibur process utilizes isolated vertical pnp transistors that yield dramatic improvement in unity-gain bandwidth and slew rate over similar devices. The addition of a bias circuit in conjunction with this process results in extremely stable parameters with both time and temperature. This means that a precision device remains a precision device even with changes in temperature and over years of use. This combination of excellent dc performance with a common-mode input voltage range that includes the negative rail makes these devices the ideal choice for low-level signal conditioning applications in either single-supply or split-supply configurations. In addition, these devices offer phase-reversal protection circuitry that eliminates an unexpected change in output states when one of the inputs goes below the negative supply rail. A variety of available options includes small-outline and chip-carrier versions for high-density systems applications. The C-suffix devices are characterized for operation from 0°C to 70°C. The I-suffix devices are characterized for operation from – 40°C to 85°C. The M-suffix devices are characterized for operation over the full military temperature range of – 55°C to 125°C.
D D D D D
High Open-Loop Gain . . . 6.5 V/µV (136 dB) Typ Low Offset Voltage . . . 100 µV Max Offset Voltage Drift With Time 0.005 µV/mo Typ Low Input Bias Current . . . 50 nA Max Low Noise Voltage . . . 19 nV/√Hz Typ
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† The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR). ‡ The DB and PW packages are only available left-end taped and reeled. § Chip forms are tested at 25°C only. TLE2022 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25°C 150 µV 300 µV 500 µV 150 µV 300 µV 500 µV 150 µV 300 µV 500 µV SMALL OUTLINE† (D) TLE2022BCD TLE2022ACD TLE2022CD TLE2022BID TLE2022AID TLE2022ID — TLE2022AMD TLE2022MD SSOP‡ (DB) — — TLE2022CDBLE — — — CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) — TLE2022ACP TLE2022CP — TLE2022AIP TLE2022IP — TLE2022AMP TLE2022MP TSSOP‡ (PW) — — TLE2022CPWLE — CHIP FORM§ (Y) — — TLE2022Y —
TLE2021 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25°C 200 µV 500 µV 200 µV 500 µV 100 µV 200 µV 500 µV SMALL OUTLINE† (D) TLE2021ACD TLE2021CD TLE2021AID TLE2021ID — TLE2021AMD TLE2021MD SSOP‡ (DB) TLE2021CDBLE CHIP CARRIER (FK) — CERAMIC DIP (JG) — PLASTIC DIP (P) TLE2021ACP TLE2021CP TLE2021AIP TLE2021IP — TLE2021AMP TLE2021MP TSSOP‡ (PW) — TLE2021CPWLE — CHIP FORM§ (Y) — TLE2021Y —