HDSP-F508-00000中文资料

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HDSP-0984-00100中文资料

DevicesPart Number HDSP-ColorDescriptionFront View0781High-Efficiency Red Numeric, Right Hand DP A 0782Low Power Numeric, Left Hand DP B 0783Over Range ±1C 0784HexadecimalD 0791High-Efficiency Red Numeric, Right Hand DP A 0792High Brightness Numeric, Left Hand DP B 0793Over Range ±1C 0794HexadecimalD 0881YellowNumeric, Right Hand DP A 0882Numeric, Left Hand DP B 0883Over Range ±1C 0884HexadecimalD 0981High-Performance GreenNumeric, Right Hand DP A 0982Numeric, Left Hand DP B 0983Over Range ±1C 0984HexadecimalDHDSP-078x HDSP-079x HDSP-088x HDSP-098xFeatures• Three Character Options Numeric, Hexadecimal, Over Range• Three ColorsHigh Efficiency Red, Yellow,High Performance Green• 4x 7 Dot Matrix Character • High Efficiency Red, Yellow and High Performance Green • Two High Efficiency Red OptionsLow Power, High Brightness • Performance Guaranteed Over Temperature• High Temperature Stabilized • Memory Latch/Decoder/DriverTTL Compatible• Categorized for Luminous IntensityDescriptionThese standard solid state displays have a 7.4 mm (0.29 inch) dot matrix character and an on-board IC with data memory latch/decoder and LED drivers in a glass/ceramic package.The hermetic HDSP-078x,-079x/-088x displays utilize a solder glass frit seal. The HDSP-098X displays utilize an epoxy glass-to-ceramic seal.The numeric devices decode posi-tive BCD logic into characters “0-9,” a “–” sign, decimal point,and a test pattern. Thehexadecimal devices decodeGlass/Ceramic Numeric and Hexadecimal Displays for Industrial Applications Technical Datapositive BCD logic into 16characters, “0-9, A-F.” An input is provided on the hexadecimal devices to blank the display (all LEDS off) without losing the contents of the memory.The over range device displays “±1” and right hand decimal point and is typically driven via external switching transistors.Figure 1. Timing Diagram.Figure 2. Block Diagram.COUNTRY CODEPackage DimensionsAbsolute Maximum RatingsNotes:1. The nominal thermal resistance of a display mounted in a socket that is soldered onto a printed circuit board isRθJA=50°C/W/device. The device package thermal resistance is RθJ-PIN = 15°C/W/device. The thermal resistance device pin-to-ambient through the PC board should not exceed 35°C/W/device for operation up to T A = +100°C.2. Voltage values are with respect to device ground, pin 6.3. These displays are categorized for luminous intensity with the intensity category designated by a letter code located on the back ofthe display package. Case temperature of the device immediately prior to the light measurement is equal to 25°C.Electrical/Optical Characteristics T A = –55°C to +100°CNotes:4. The luminous intensity at a specific operating ambienttemperature, I v(T A), may be approximated from the following exponential equation: I v(T A)=I v(25°C) e[k(T-25°C)].Device KHDSP-078 Series–0.0131/°CHDSP-079x SeriesHDSP-088x Series–0.0112/°CHDSP-098x Series–0.0104/°C 5. The dominant wavelength, λd, is derived from the CIE chroma-ticity diagram and represents the single wavelength whichdefines the color of the device.6. The HDSP-088X and HDSP-098X series devices are categor-ized as to dominant wavelength with the category designated by a number on the back of the display package.7. All typical values at V CC = 5.0 V and T A = 25°C.Operational ConsiderationsElectricalThese devices use a modified4x7 dot matrix of light emitting diodes to display decimal/ hexadecimal numeric informa-tion. The high efficiency red and yellow displays use GaAsP/GaP LEDs and the high performance green displays use GaP/GaP LEDs. The LEDs are driven by constant current drivers, BCD information is accepted by the display memory when the enable line is at logic low and the data islatched when the enable is atlogic high. Using the enable pulsewidth and data setup and holdtimes listed in the RecommendedOperating Conditions allows datato be clocked into an array ofdisplays at a 6.7MHz rate.The decimal point input is activelow true and this data is latchedinto the display memory in thesame fashion as the BCD data.The decimal point LED is drivenby the on-board IC.The blanking control input on thehexadecimal displays blanks(turns off) the displayedinformation without disturbingthe contents of display memory.The display is blanked at aminimum threshold level of 2.0volts. When blanked, the displaystandby power is nominally 250mW at T A = 25°C.The ESD susceptibility of the ICdevices is Class A of MIL-STD-883 or Class 2 of DOD-STD-1686and DOD-HDBK-263.AMechanicalThese displays are hermetically sealed for use in environments that require a high reliability device. These displays are designed and tested to meet a helium leak rate of5x10-8cc/sec.These displays may be mounted by soldering directly to a printed circuit board or insertion into a socket. The lead-to-lead pin spacing is 2.54 mm (0.100 inch) and the lead row spacing is 15.24 mm (0.600 inch). These displays may be end stacked with 2.54 mm (0.100 inch) spacing between outside pins of adjacent displays. Sockets such as Augat 324-AG2D (3 digits) or Augat 508-AG8D (one digit, right anglemounting) may be used.The primary thermal path forpower dissipation is through thedevice leads. Therefore, to insurereliable operation up to anambient temperature of +100°C,it is important to maintain abase-to-ambient thermalresistance of less than35°C watt/device as measured ontop of display pin 3.For further information onsoldering and post soldercleaning, see Application Note1027, Soldering LEDComponents.PreconditioningThese displays are 100% pre-conditioned by 24 hour storage at125°C, at 100°C for the HDSP-098x Series.Contrast EnhancementThese display devices aredesigned to provide an optimumON/OFF contrast when placedbehind an appropriate contrastenhancement filter. For furtherinformation on contrastenhancement, see ApplicationNote 1015, ContrastEnhancement for LEDDisplays.Over Range DisplayThe over range devices display“±1” and decimal point. Thecharacter height and packageconfiguration are the same as thenumeric and hexadecimaldevices. Character selection isobtained via external switchingtransistors and current limitingresistors.Absolute Maximum RatingsDescription Symbol Min Max Unit Storage Temperature, Ambient T S–65+125°C Operating Temperature, Ambient T A–55+100°C Forward Current, Each LED I F10mA Reverse Voltage, Each LED V R5VPackage DimensionsLuminous Intensity per LED(Digit Average) at T= 25°C Figure 3. Typical Driving Circuit.Notes:0: Line switching transistor in Figure 7 cutoff.1: Line switching transistor in Figure 7 saturated.X: ‘don’t care.’Electrical Characteristics T A = –55°C to +100°CColor Bin Limits (Dominant Wavelength)Note:Bin categories are established for classification of products. Productsmay not be available in all bin categories. Please consult your localAgilent Technologies representative./semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939Japan: (+81 3) 3335-8152 (Domestic/Interna-tional), or 0120-61-1280 (Domestic Only)Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand,Philippines, Indonesia: (+65) 6755 2044Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc.Obsoletes 5964-6390EJuly 14, 20045988-2261EN。

HDSP-50XB中文资料

14.2 mm (0.56 inch) General PurposeBlue Seven Segment DisplaysTechnical DataHDSP-50xB SeriesFeatures•Industry Standard Size •Industry Standard Pin-Out 15.24 mm (0.6 in.) DIP Leads on 2.54 mm (0.1 in.) Centers •Blue Color•Mitered FontMitered Corners on Segments •Gray Face PaintGray Package Gives Optimum Contrast•±50° Viewing Angle •Design Flexibility Common Anode or Common Cathode•Categorized for Luminous IntensityApplications•Suitable for Indoor Use •Not Recommended for Industrial Applications, i.e. Operating TemperaturesRequirements Exceeding 80°C or Below –20°C[1]•Extreme Temperature Cycling Not Recommended[1] DescriptionThese 14.2 mm (0.56 inch) blue displays use industry standard size and pin-out. The devices are available as either common anode or common cathode. TheHDSP-50xB series are suitable forindoor use.DevicesBlueHDSP-Description501B Common Anode RightHand Decimal503B Common CathodeRight Hand Decimal Note:1. For details, please contact your localAgilent components sales office or an authorized distributor.Part Numbering System5082 - X XX X - X X X XXHDSP- X XX X - X X X XXMechanical Options[1]00: No Mechanical OptionColor Bin Options[1,2]0: No Color Bin LimitationMinimum Intensity Bin[1,2]0: No Maximum Intensity Bin LimitationMinimum Intensity Bin[1,2]0: No Minimum Intensity Bin LimitationDevice Configuration/Color[1]B: BlueDevice Specification Configuration[1]Refer to Respective DatasheetPackage[1]Refer to Respective DatasheetNotes:1. For codes not listed in the figure above, please refer to the respective datasheet orcontact your nearest Agilent representative for details.2. Bin options refer to shippable bins for a part-number. Color and Intensity Bins aretypically restricted to 1 bin per tube (exceptions may apply). Please refer torespective datasheet for specific bin limit information.Package DimensionsInternal Circuit DiagramCOMMON CATHODECOMMON ANODE COMMON ANODECOMMON CATHODEPINFUNCTION PIN 1CATHODE e 2CATHODE d3COMMON ANODE 4CATHODE c 5CATHODE DP 6CATHODE b 7CATHODE a8COMMON ANODE 9CATHODE f 10CATHODE g12345678910FUNCTION ANODE e ANODE dCOMMON CATHODE ANODE c ANODE DPANODE b ANODE aCOMMON CATHODE ANODE f ANODE gHDSP-501B HDSP-503B∅ 0.51TOP END VIEWFRONT VIEWSIDE VIEWTYP. 10 PLCSNOTES:1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).2. UNLESS OTHERWISE STATED, TOLERANCES ARE ± 0.25 mm.Absolute Maximum Ratings at T A=25°CHDSP-501BParameter Symbol HDSP-503B Units Power Dissipated per Segment or DP P D135mW Peak Forward Current per Segment or DP I PEAK70mA(1/10 Duty Cycle, 0.1 ms Pulse Width)DC Forward Current per Segment or DP[1]I F30[1]mA Reverse Voltage per Segment or DP V R5V Operating Temperature T O–20 to +80°C Storage Temperature T S–30 to +85°C Wave Soldering Conditions Temperature250°C(1.6 mm [0.063 in.] below Body)Time3sNote:1.Derate above 25°C at 0.33 mA/°C.Optical/Electrical Characteristics at T A=25°CDevices Test HDSP-Parameter Symbol Min.Typ.Max.Units Conditions Luminous Intensity/Segment I v 2.02 3.40mcd I F = 10 mA(Segment Average)[1,2]501B Forward Voltage/Segment or DP V F 3.80 4.50V I F = 20 mA 503B Peak WavelengthλPEAK428nmDominant Wavelength[3]λd466nmReverse Current/Segment or DP[4]I R100µA V R = 5 V Notes:1.Case temperature of the device immediately prior to the intensity measurement is 25°C.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and represents the single wavelength which definesthe color of the device.4. Typical specification for reference only. Do not exceed absolute maximum ratings.Intensity Bin Limits[1] (µcd at 10 mA)Bin Name Min.[2]Max.[2]H20202630I26303420J34204200K42005040Notes:1.Bin categories are established for classification of products. Products may not beavailable in all bin categories.2. Tolerance for each bin limit is ±10%.Contrast EnhancementFor information on contrast enhancement, please see Application Note 1015.Soldering/CleaningCleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from thechlorinated hydrocarbon family (methylene chloride, trichloro-ethylene, carbon tetrachloride,etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs please refer to Application Note 1027.Device ReliabilityFor reliability information, please see the reliability data sheet 14.2 mm (0.56 inch) General Purpose Blue Seven Segment Display.Figure 2. Relative Luminous Intensity vs. DC Forward Current.Figure 3. Maximum Allowable Average Current per Dot vs. Ambient Temperature.Figure 1. Forward Current vs.Forward Voltage.I F – M A X I M U M A V E R A G E C U R R E N T – m A100T A – AMBIENT TEMPERATURE – °C208010030604010205152535R E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 20 m A )00I F – FORWARD CURRENT PER SEGMENT – mA1.200.800.400.2015301.000.601025520I F – F O R W A R D C U R R E N T P E R S E G M E N T – m A0V F – FORWARD VOLTAGE – V35153530514102/semiconductorsFor product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939Japan: (+81 3) 3335-8152 (Domestic/Interna-tional), or 0120-61-1280 (Domestic Only)Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand,Philippines, Indonesia: (+65) 6755 2044Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc.Obsoletes 5988-0378EN July 17, 20045988-8000EN。

HQxxxx-xxx-3AA中文资料

HQ SeriesSPECIFICATIONS STANDARD*SPECIAL ELECTRICALCenter Frequency (Fc)100 to 1000 Mhz80 to 1400 MHz 3dB Relative Bandwidth (% of FC) 4 to 40 4 to 50 Number of Sections Available 3 to 8 2 to 10 Nominal Impedance50 Ohms50 to 75 Ohms Maximum Insertion Loss See Curve See Curve Maximum VSWR 1.5/1 1.3/1 Attenuation in the Stopband See Graph See GraphMaximum Input Power (Average)(Watts to10,000 ft.)500 x 3dB BW (MHz)(Loss Factor)(Fc MHz)See StandardMaximum Input Power (Peak)(Watts to10,000 ft.)300 x 3dB BW (MHz)Fc (MHz)2,000ENVIRONMENTALShock15 G's25 G's Vibration 5 G's10 G's Humidity90% relative100% relativeINSERTION LOSS:The Maximum Insertion Loss at center frequency is equal to :LF x (N + 0.5) / % 3 dB BW + 0.2 Where:LF= Loss Factor, N= Number of Sections% 3dB BW:3dB BW (MHz) x 100divided byCenter Frequency (MHz) Example:A 3 section HQ with a center frequency of 400 MHz and a 3dB BW of 40 MHz would have,1.5 x 3.5 / 10 = 5.25 / 10 = 0.525 0.525 + 0.2 = 0.8 dBConnectors Available on HQ Series:Lark Code Type C DIM.Inches & MMLarkCodeType C DIM.Inches & MMA SMA JACK.800 & 20.3G N JACK 1.625 & 41.3B SMA PLUG.855 & 22.5H N PLUG 1.585 & 40.3C TNC JACK 1.350 & 34.3L SOLDER MPINAXIAL.625 & 15.9D TNC PLUG 1.280 & 32.5*M SOLDER PINRADIAL.625 & 15.9E BNC JACK 1.350 & 34.3S SPECIALF BNC PLUG 1.280 & 32.5*Not recommended for use with this series.LENGTH:The approximate length of a Lark HQ series filter can be determined by the formula:( 0.5 N + 2 / %BW ) x LC = LWhere N is the number of sections used, % BW is:3dB BW (MHz) x 100divided byCENTER FREQUENCY (MHz)LC is the length constant at the specified center frequency, L is the dimension between theconnectors; C1 and C2 are the connector lengths as shown above. All of the length information given here is approximate. Exact length specifications must be quoted by the factory. If a special length is needed,please submit all of your requirements - both electrical and mechanical. This will enable Lark Engineering to quote the optimum design for your application.Example:A 3 section HQ with a center frequency of 400 MHz a 3dB BW of 40 MHz and SMA jack input and output connectors would be:(1.5 + 0.2) x 1.38 = 2.35 + C1 + C2In most cases, the L dimension is rounded to the nearest 1/4 inch which in this instance would be 2.25inches and the O.A.L. is:2.25 + .800 + .800 =3.85 inches.To convert inches to millimeters multiply x 25.40.Lark Engineering HQ SERIES元器件交易网STOPBAND ATTENUATIONThe graph on the following pages defines the normal specification limits on attenuation Lark bandpass filter series HP, HQ, SF, and SM. The minimum level of attenuation in dB is shown as a "number of 3dB bandwidths from center frequency".Since the frequency characteristics vary for differing bandwidths, it is necessary to establishspecifications for each bandwidth of filter. The different graphs represent various 3dB percentage bandwidths. Intermediate values should be interpolated. The 3dB percentage bandwidth is defined asfollows:STOPATT5.HTM元器件交易网As the 3dB bandwidth is exactly 10% of the center frequency, the answer can be read directly from the 10% graph. Using the 5 section curve at the point -1.5 (255 MHz) we find the minimum level of attenuation is 36dB. At +1.6 (348 MHz) the minimum level of attenuation is 48dB.For special requirements, please contact our Application Engineering Department.STOPBAND ATTENUATIONSTOPBAND ATTENUATIONSTOPATT5.HTM元器件交易网STOPBAND ATTENUATIONSTOPBAND ATTENUATIONSTOPBAND ATTENUATION。

HDS AMS2000安装服务手册

HDS 中端设备安装服务手册文档编号：文档编号：HDSHDS-DF800 DF800800-I001HDS AMS2000 安装服务手册文档版本文档用途文档撰写日立数据系统有限公司声明文档审核文档批准V1.0 杨海林 2009 年 09 月 03 日 2008 年__月___日 2008 年__月___日本文档仅限于 HDS 工程师以及授权服务工程师使用。

日立数据系统（中国）有限公司技术热线：4006786783第1页共9页HDS 中端设备安装服务手册文档控制修改记录日期2009.09.03作者杨海林版本1.0修改记录创建审阅姓名职位分发拷贝No.1 2 3 4姓名单位日立数据系统（中国）有限公司技术热线：4006786783第2页共9页HDS 中端设备安装服务手册目1. 2. 3. 4. 5. 6. 7.录概述.................................................................................................4 安装前准备 ....................................................................................4 需要准备的工具 ............................................................................4 到货及清点 ....................................................................................5 设备安装 ........................................................................................5 现场安装服务注意事项 ................................................................5 ISP 安装流程要求 .........................................................................6附件一：安装检查列表 ............................................................................8 附件二：需要收集的配置信息 ................................................................9日立数据系统（中国）有限公司技术热线：4006786783第3页共9页HDS 中端设备安装服务手册HDS AMS2000 安装服务手册1. 概述为了保障服务质量，避免设计规划不合理、以及安装不规范等带来的潜在风险，因此需要对安装服务进行规范。

EHP-AX08LS-UB01-P01中文资料

EVERLIGHT ELECTRONICS CO.,LTD. Technical Data SheetHigh Power LED – 1WEverlight Electronics Co., Ltd. Rev. 1.0 Page: 1 of 9EHP-AX08LS/UB01-P01 DimensionsNotes: 1. Dimensions are in millimeters.2. Tolerances unless dimensions ±0.25mm.EHP-AX08LS/UB01-P01Relative Spectral Distribution, I F =350mA, T Ambient =25ºCForward Voltage vs Forward Current, T Ambient =25ºCRelative Luminous Intensity vs Forward Current, T Ambient =25ºCForward Current Derating Curve, Derating based on T j MAX =125°CTypical Electro-Optical Characteristics Curves4005006007008000.00.20.40.60.81.0R e l a t i v e L u m i n o u s I n t e n s t i yWavelength(nm)01002003004005002.62.83.03.23.43.63.8F o r w a r d V o l t a g e (V )Forward Current (mA)01002003004005000.00.20.40.60.81.01.21.4R e l a t i v e L u m i n o u s I n t e n s i t yForward Current (mA)020*********100150200250300350400F o r w a r d C u r r e n t (m A )Ambient Temperature (oC )Typical Representative Spatial Radiation PatternEHP-AX08LS/UB01-P01-80-60-40-200204060800.00.10.20.30.40.50.60.70.80.91.0R e l a t i v e L u m i n o u s I n t e n s i t yDegree (2θ)EHP-AX08LS/UB01-P01 Label explanationCPN: Customer’s Production NumberP/N : Production NumberQTY: Packing QuantityCAT: RanksHUE: Dominant WavelengthREF: ReferenceLOT No: Lot NumberMADE IN TAIWAN: Production PlaceTube Packing Specifications1. Tube2. Inner Carton3. Outside Cartonz Packing Quantity1. 60 Pcs / Per Tube2. 20 Tubes / Inner Carton3. 12 Inner Cartons / Outside CartonEHP-AX08LS/UB01-P011. Over-current-proofThough EHP-A08 has conducted ESD protection mechanism, customer must not use the device in reverse and should apply resistors for extra protection. Otherwise slight voltage shift may causeenormous current change and burn out failure would happen.2. Storagei. Do not open moisture proof bag before the products are ready to use.ii. Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less.iii. The LEDs should be used within a year.iv. After opening the package, the LEDs should be kept at 30℃ or less and 70%RH or less.v. The LEDs should be used within 168 hours (7 days) after opening the package.vi. If the moisture absorbent material (silicone gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions.vii. Pre-curing treatment : 60±5℃ for 24 hours.3. Thermal Managementi. For maintaining the high flux output and achieving reliability, EHP-A08 series LED package shouldbe mounted on a metal core printed circuit board (MCPCB) with proper thermal connection todissipate approximately 1W of thermal energy under 350mA operation.ii. Special thermal designs are also recommended to take in outer heat sink design, such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc.iii. Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and LED lifetime will decrease critically.4. Soldering Conditioni. Lead reflow soldering temperature profileEHP-AX08LS/UB01-P01ii. Reflow soldering should not be done more than two times.iii. While soldering, do not put stress on the LEDs during heating.iv. After soldering, do not warp the circuit board5. Soldering Ironi. For prototype builds or small series production runs it is possible to place and solder the LED byhand.ii. Dispensing thermal conductive glue or grease on the substrates and follow its curing spec. Press LED housing to closely connect LED and substrate.iii. It is recommended to hand solder the leads with a solder tip temperature of 280°C for less than 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and moreintervals, and do soldering of each terminal.iv. Be careful because the damage of the product is often started at the time of the hand solder.。

爱普生PDG53P0800P5DN电流保护模具说明书

Eaton PDG53P0800P5DNEaton Power Defense molded case circuit breaker, Globally Rated, Frame 5, Three Pole, 800A, 100kA/480V, PXR25 ARMS LSIG w/ Modbus RTU, CAM Link and Relays, No TerminalsEaton Power Defense molded case circuit breakerPDG53P0800P5DN 786679291481139.7 mm 406.4 mm 209.5 mm 21.32 kg Eaton Selling Policy 25-000, one (1) year from the date of installation of theProduct or eighteen (18) months from thedate of shipment of the Product,whichever occurs first.RoHS Compliant IEC 60947-2CCC MarkedUL 489CSAProduct NameCatalog Number UPCProduct Length/Depth Product Height Product Width Product Weight WarrantyCompliancesCertificationsModbus / Relays / CAM100 kAIC at 480 Vac5600800 AThree-pole600 VPD5 Global100 kAIC Icu/ 50 kAIC Ics/ 220 kAIC Icm @380-415V (IEC)85 kAIC Icu/ 40 kAIC Ics/ 187 kAIC Icm @480V Brazil (IEC)200 kAIC @240V (UL)100 kAIC Icu/ 50 kAIC Ics/ 220 kAIC Icm @440V (IEC)100 kAIC @480/277V (UL)35 kAIC Icu/ 18 kAIC Ics/ 73.5 kAIC Icm @690V (IEC)200 kAIC Icu/ 150 kAIC Ics/ 440 kAIC Icm @240V (IEC)40 kAIC Icu/ 25 kAIC Ics/ 84 kAIC Icm @525V South Africa (IEC) 65 kAIC @600/347V (UL)ElectronicClass AComplete breakerNo Terminals600 Vac Eaton Power Defense MCCB PDG53P0800P5DN 3D drawingConsulting application guide - molded case circuit breakersPower Xpert Protection Manager x64Power Xpert Protection Manager x32StrandAble terminals product aidPower Defense brochurePower Defense molded case circuit breaker selection posterPower Defense technical selling bookletPower Defense molded case circuit breakers - Frame 5 product aid Power Xpert Release trip units for Power Defense molded case circuit breakersMolded case circuit breakers catalogPDG5 CSA CertificationPDG5 CB reportEU Declaration of Conformity - Power Defense molded case circuit breakersPDG5 UL authorizationPower Defense Declaration concerning California’s Proposition 65PDG6 CCC certificatePDG6 CSA certificationPDG5 CCC certificationPower Defense Frame 5 walking beam installation instructions -IL012290ENPower Defense Frame 5 key interlock installation instructions -IL012294ENPower Defense Frame 5 breaker status module installation instructions – IL012307ENPower Defense Frame 4_5 flex shaft handle mech assembly instructions - IL012284ENPower Defense Frame 5 interphase barrier kit 3 pole installation instructions - IL012293ENPower Defense Frame 4_5_6 high performance flex shaft handle mechSpecial featuresInterrupt ratingFrameRated operation voltage (Ue) at AC - max Amperage RatingNumber of polesVoltage rating - maxCircuit breaker typeInterrupt rating rangeSwitch off techniqueClassCircuit breaker frame typeTerminalsVoltage rating 3D CAD drawing package Application notesBrochuresCatalogsCertification reports Installation instructionsPXR 25 LSIG w/ARMS Modbus RTU and CAM Link assembly instructions - IL012296ENPower Defense Frame 5 vertical padlockable handle lock hasp installation instructions - IL012283ENPower Defense Frame 2/3/4/5/6 voltage neutral sensor module wiring instructions – IL012316ENPower Defense Frame 5 aux, alarm, shunt trip and uvr instructions(IL012201EN).pdfPower Defense Frame 5 Trip Unit Upgrade Relays Board, Animated Instructions.rhPower Defense Frame 5 Trip Unit Replacement Animated Instructions Power Defense Frame 5 Shunt Trip, Aux and Alarm Trip How-To Video Power Defense Frame 5 Aux, Alarm, ST and UVR Animated Instructions.rh1Power Defense Frame 5 UVR Trip How-To VideoPower Defense Frame 5 Trip Unit Upgrade Wire Harnesses, Animated Instructions.rhPower Defense Frame 6 Trip Unit How-To VideoPower Defense BreakersPower Defense Frame 2 Variable Depth Rotary Handle Mechanism Installation How-To VideoPower Defense molded case circuit breakersPower Defense Frame 5 Trip Unit How-To VideoPower Defense Frame 3 Variable Depth Rotary Handle Mechanism Installation How-To VideoEaton Power Defense for superior arc flash safetyEaton Specification Sheet - PDG53P0800P5DNPower Defense time current curve Frame 5 - PD5Selling Policy 25-000 - Distribution and Control Products and ServicesImplementation of arc flash mitigating solutions at industrial manufacturing facilitiesSingle and double break MCCB performance revisitedMolded case and low-voltage power circuit breaker healthMaking a better machineIntelligent circuit protection yields space savingsTrip TypeCommunicationInstallation videosMultimediaSpecifications and datasheetsTime/current curvesWarranty guidesWhite papersEaton Corporation plc Eaton House30 Pembroke Road Dublin 4, Ireland © 2023 Eaton. All Rights Reserved. Eaton is a registered trademark.All other trademarks areproperty of their respectiveowners./socialmediaIntelligent power starts with accurate, actionable data Safer by design: arc energy reduction techniques Molded case and low-voltage breaker health。

HDS存储VSP用户维护手册_v11

HDS 存储VSP 用户维护手册(2013年5月)目录一、设备维护 (3)1.1VSP配置信息 (3)1.2VSP系统架构 (3)1.3维护常用命令 (8)1.4VSP应急方案-上下电操作 (36)1.5设备巡检 (39)二、微码升级 (46)2.1微码升级的意义 (46)2.2微码升级的策略 (47)2.3微码升级的步骤 (48)三、故障处理 (53)3.1故障处理预案 (54)四、案例 (56)4.1硬盘更换步骤 (56)4.2CHA更换步骤 (60)4.3DKA更换步骤 (67)4.4CM更换步骤 (71)一、设备维护1.1 VSP配置信息1.2 VSP系统架构1.2.1 VSP系统架构图其系统架构采用了交换式架构，如下所示。

图2-1：VSP硬件技术架构1.2.2 VSP主要部件图2-2 VSP硬件主要部件图VSP的主要部件包括：✓前端卡(CHA)：负责连接外部主机或存储交换设备，如小型机；✓后端卡(DKA)：负责连接内部磁盘存储设备，如硬盘；✓数据缓存卡（CPC)：CHA访问后端磁盘时的数据缓存区域；✓内存条（CM)：CM的内存条；✓PCI-Express交换卡（ESW）： DKC数据交换控制卡；✓处理器板卡（MPB）：负责前端及后端数据的处理；✓磁盘（HDD)：存储设备的磁盘；✓备份盘（Spare Disk）：用作备份盘的磁盘；✓电池（Battery)：系统掉电时保存数据的电池；✓电源（PS)：系统供电及交换用的电源；✓风扇（FAN)：系统冷却用的风扇；✓控制台（SVP)：系统配置和管理监控的控制台（一台笔记本电脑）；✓线缆（Cable）：连接存储内部和外部各部件间的电缆；✓光纤接头（SFP)：光纤转换接头；1.2.3 VSP存储的磁盘分布图VSP的磁盘分布按照如下进行标识：HDDxyz_dd其中：xy=Cabinet（盘柜）；z=HDU number（磁盘笼编号）dd=HDD number（磁盘编号）图2-3：VSP磁盘位置图1.3维护常用命令当盘机出现故障，如磁盘、控制卡、电源、内存、电池到出现异常时，会产生SIM信息，同时盘机会根据故障的严重程度，将Message或Alarm灯亮起。

HDSP-5507-IJ000中文资料

14.2 mm (0.56 inch)Seven Segment Displays Technical DataFeatures• Industry Standard Size • Industry Standard Pinout 15.24 mm (0.6 in.) DIP Leads on 2.54 mm (0.1 in.) Centers • Choice of ColorsAlGaAs Red, High Efficiency Red, Yellow, Green, Orange • Excellent Appearance Evenly Lighted Segments Mitered Corners on Segments Gray Package Gives Optimum Contrast±50° Viewing Angle • Design FlexibilityCommon Anode or Common CathodeSingle and Dual Digits Right Hand Decimal Point ±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display • High Light Output • High Peak Current• Excellent for Long Digit String Multiplexing • Intensity and Color Selection OptionSee Intensity and ColorSelected Displays Data Sheet • Sunlight Viewable AlGaAsDescriptionThe 14.2 mm (0.56 inch) LED seven segment displays aredesigned for viewing distances upto 7 metres (23 feet). Thesedevices use an industry standard size package and pinout. Both the numeric and ±1 overflow devices feature a right hand decimalpoint. All devices are available as either common anode or common cathode.Orange AlGaAs Red HERYellowGreen Package HDSP-HDSP-[1]HDSP-[1]HDSP-HDSP- DescriptionDrawingH401H151550157015601Common Anode Right Hand Decimal A H403H153550357035603Common Cathode Right Hand Decimal B H157550757075607Common Anode ±1. Overflow C H158550857085608Common Cathode ±1. OverflowD K401552157215621Two Digit Common Anode Right Hand DecimalE K403552357235623Two Digit Common Cathode Right Hand DecimalFDevicesNote:1. These displays are recommended for high ambient light operation. Please refer to the HDSP-H10X/K12X AlGaAs and HDSP-555X HER data sheet for low current operation.HDSP-K40x Series HDSP-550x Series HDSP-552x Series HDSP-560x Series HDSP-562x Series HDSP-570x Series HDSP-572x Series HDSP-H15x Series HDSP-H40x SeriesThese displays are ideal for most applications. Pin for pin equivalent displays are alsoavailable in a low current design.The low current displays are idealfor portable applications. For additional information see the Low Current Seven Segment Displays data sheet.Part Numbering SystemNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative for details.2. Bin options refer to shippable bins for a part number. Color and Intensity Bins are typically restricted to 1bin per tube (exceptions may apply). Please refer to respective datasheet for specific bin limit information.5082 -X X X X-X X X X X HDSP-X X X X-X X X X XMechanical Options [1]00: No Mechanical Option Color Bin Options [1,2]0: No Color Bin LimitationMaximum Intensity Bin [1,2]0: No Maximum Intensity Bin Limitation Minimum Intensity Bin [1,2]0: No Minimum Intensity Bin Limitation Device Configuration/Color [1]1: Common Anode 3: Common CathodeDevice Specific Configuration [1]Refer to Respective DatasheetPackage [1]H: 14.2 mm (0.56 inch) Single Digit Seven Segment DisplayFUNCTIONPIN AB CDEF1CATHODE e ANODE e CATHODE c ANODE cE CATHODE NO. 1 E ANODE NO. 12CATHODE d ANODE d ANODE c, d CATHODE c, d D CATHODE NO. 1 D ANODE NO. 13ANODE [3]CATHODE [4]CATHODE b ANODE bC CATHODE NO. 1 C ANODE NO. 14CATHODE c ANODE c ANODE a, b, DP CATHODE a, b, DP DP CATHODE NO. 1DP ANODE NO. 15CATHODE DP ANODE DP CATHOPDE DP ANODE DE E CATHODE NO. 1 E ANODE NO. 26CATHODE b ANODE b CATHODE a ANODE aD CATHODE NO. 2 D ANODE NO. 27CATHODE a ANODE a ANODE a, b, DP CATHODE a, b, DP G CATHODE NO. 2G ANODE NO. 28ANODE [3]CATHODE [4]ANODE c, d CATHODE c, d C CATHODE NO. 2 C ANODE NO. 29CATHODE f ANODE f CATHODE d ANODE d DP CATHODE NO. 2DP ANODE NO. 210CATHODE g ANODE g NO PINNO PINB CATHODE NO. 2 B ANODE NO. 211 A CATHODE NO. 2 A ANODE NO. 212 F CATHODE NO. 2 F ANODE NO. 213DIGIT NO. 2 ANODE DIGIT NO. 2 CATHODE 14DIGIT NO. 1 ANODE DIGIT NO. 1 CATHODE 15 B CATHODE NO. 1 B ANODE NO. 116 A CATHODE NO. 1 A ANODE NO. 117G CATHODE NO. 1G ANODE NO. 118F CATHODE NO. 1 F ANODE NO. 1NOTES:1. ALL DIMENSIONS IN MILLIMETRES (INCHES).2. ALL UNTOLERANCED DIMENSIONS ARE FOR REFERENCE ONLY.3. REDUNDANT ANODES.4. REDUNDANT CATHODES.5. FOR HDSP-5600/-5700 SERIES PRODUCT ONLY.Package DimensionsInternal Circuit DiagramNotes:1. See Figure 2 to establish pulsed conditions.2. Derate above 46°C at 0.54 mA/°C.3. See Figure 7 to establish pulsed conditions.4. Derate above 53°C at 0.45 mA/°C.5. See Figure 8 to establish pulsed conditions.HER/Orange HDSP-5500AlGaAs Red HDSP-H40x Yellow Green HDSP-H150HDSP-K40x HDSP-5700HDSP-5600 Description SeriesSeriesSeriesSeriesUnits Average Power per Segment or DP 9610580105mW Peak Forward Current per 160[1]90[3]60[5]90[7]mA Segment or DPDC Forward Current per Segment or DP 40[2]30[4]20[6]3018]mA Operating Temperature Range -20 to +100[9]-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment or DP 3.0V Lead Solder Temperature for 3 Seconds 260°C(1.60 mm [0.063 in.] below seating plane)Absolute Maximum Ratings6. Derate above 81°C at 0.52 mA/°C.7. See Figure 9 to establish pulsed conditions.8. Derate above 39°C at 0.37 mA/°C.9. For operation below -20°C, contact your local Agilent components sales office or an authorized distributor.Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2,5]I V9.116.0mcd I F = 20 mA(Digit Average)1.8I F = 20 mAForward Voltage/Segment or DP V F V2.03.0I F = 100 mAH15XPeak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin400°C/W/to-Pin SegHigh Efficiency RedDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions9002800I F = 10 mA Luminous Intensity/Segment[1,2,6]I Vµcd(Digit Average)3700I F = 60 mA Peak:1 of 6 dfForward Voltage/Segment or DP V F 2.1 2.5V I F = 20 mA 55XXPeak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin345°C/W/to-Pin SegYellowDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions6001800I F = 10 mA Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)2750I F = 60 mA Peak:1 of 6 dfForward Voltage/Segment or DP V F 2.1 2.5V I F = 20 mA 57XXPeak WavelengthλPEAK583nmDominant Wavelength[3,7]λd581.5586592.5nmReverse Voltage/Segment or DP[4]V R 3.040V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin345°C/W/to-Pin SegOrangeDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment I V 2.37mcd I F = 10 mA(Segment Average)[1,2]Forward Voltage/Segment or DP V F 2.1 2.5V I F = 20 mAPeak WavelengthλPEAK600nm H40x Dominant Wavelength[3]λd603nm I F = 10 mA K40x Reverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µA Temperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin345°C/W/to-Pin SegDeviceSeries HDSP-ParameterSymbol Min.Typ.Max.UnitsTest Conditions 9002500I F = 10 mALuminous Intensity/Segment [1,2]I Vµcd(Digit Average)`3100I F = 60 mA Peak:1 of 6 df Forward Voltage/Segment or DPV F 2.1 2.5V I F = 10 mA56XXPeak Wavelength λPEAK 566nm Dominant Wavelength [3,7]λd 571577nm Reverse Voltage/Segment or DP [4]V R 3.050V I R = 100 µATemperature Coefficient of ∆V F /°C -2mV/°C V F /Segment or DPThermal Resistance LED Junction-R θJ-Pin345°C/W/to-PinSegHigh Performance GreenNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd , is derived from the CIE chromaticity diagram and is that single wavelength which defines the color of the device.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. For low current operation, the AlGaAs HDSP-H10X series displays are recommended. They are tested at 1 mA dc/segment and are pin for pin compatible with the HDSP-H15X series.6. For low current operation, the HER HDSP-555X series displays are recommended. They are tested at 2 mA dc/segment and are pin for pin compatible with the HDSP-550X series.7. The Yellow (HDSP-5700) and Green (HDSP-5600) displays are categorized for dominant wavelength. The category is designated by a number adjacent to the luminous intensity category letter.AlGaAs RedFigure 2. Maximum Tolerable Peak Current vs. Pulse Duration – AlGaAs Red.Figure 1. Maximum Tolerable Peak Current vs.Pulse Duration – Red.Figure 3. Maximum Allowable DC Current vs.Ambient Temperature.Figure 4. Forward Current vs.Forward Voltage.HER, Yellow, Green, OrangeFigure 7. Maximum Tolerable Peak Currentvs. Pulse Duration – HER, Orange.Figure 8. Maximum Tolerable Peak Current vs. Pulse Duration – Yellow.Figure 5. Relative Luminous Intensity vs. DC Forward Current.Figure 6. Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Current.I D C M A X . – M A X I M U M D C C U R R E N T P E R S E G M E N T – m AT A – AMBIENT TEMPERATURE – °C 5030102051525354045I F – F O R W A R D C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 20 m A )I F – FORWARD CURRENT PER SEGMENT – mA204010305152535ηP E A K – N O R M A L IZ E D R E L A T I V E E F F I C I E N C YI PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA40051015202530352010090807060504030T – AMBIENT TEMPERATURE – °C AI M A X – M A X I M U M D C C U R R E N T P E R S E G M E N T – m AD C 4550110120Figure 11. Forward Current vs.Forward Voltage.Figure 9. Maximum Tolerable PeakCurrent vs. Pulse Duration – Green.Figure 10. Maximum Allowable DC Current vs.Ambient Temperature.Figure 12. Relative LuminousIntensity vs. DC Forward Current.Figure 13. Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Current.Electrical/OpticalFor more information onelectrical/optical characteristics,please see Application Note 1005.Contrast EnhancementFor information on contrastenhancement please see Application Note 1015.Soldering/CleaningCleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from thechlorinated hydrocarbon family(methylene chloride, trichloro–ethylene, carbon tetrachloride,etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs please refer to Application Note 1027.I F – F O R W A R D C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 10 m A )I F – DC FORWARD CURRENT – mAηV – R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D T O 1 A T 10 m A P E R S E G M EN T )0.6I PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA902070801001.61.41.31.10.90.860504030100.71.01.21.5HDSP-H15x IV Bin Category Min.Max.K 9.2016.90L 13.8025.30M 20.7038.00N 31.1056.90O 46.6085.40Intensity Bin Limits (mcd)AlGaAs RedHDSP-550x/552x IV Bin Category Min.Max.E 0.91 1.67F 1.37 2.51G 2.05 3.76H 3.08 5.64I 4.628.64J 6.9312.70K 10.3919.04HERHDSP-570x/572xIV Bin Category Min.Max.D 0.61 1.11E 0.91 1.67F 1.37 2.51G 2.05 3.76H 3.08 5.64I 4.628.64J 6.9312.70K 10.3919.04YellowHDSP-560x/562x IV Bin Category Min.Max.E 0.91 1.67F 1.37 2.51G 2.05 3.76H 3.08 5.64I 4.618.46GreenColor CategoriesNote:All categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representatives for further clarification/information.10HDSP-H40x/K40x IV Bin Category Min.Max.B 0.77 1.17C 0.95 1.45D 1.19 1.82E 1.49 2.27F 1.85 2.89G 2.32 3.54H 2.904.43Orange元器件交易网元器件交易网/semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(408) 654-8675Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 271 2451India, Australia, New Zealand: (+65) 271 2394Japan: (+81 3) 3335-8152(Domestic/Interna-tional), or 0120-61-1280(Domestic Only)Korea: (+65) 271 2194Malaysia, Singapore: (+65) 271 2054Taiwan: (+65) 271 2654Data subject to change.Copyright © 2002 Agilent Technologies, Inc.Obsoletes 5988-0383ENJanuary 17, 20025988-4273EN。

F880-PC中文资料

F880SPECIFICATIONLocation of equipmentSee ApprovalsOUTPUTNumber of channelsEightVoltage21.5V DC minimum24.0V DC maximumDesign current0 to 350mA per segmentCurrent limit> 370mAMinimum loadNo loadIsolationFieldbus to power supply: 250V AC rms withstandFieldbus to fieldbus: 250V AC rms withstandINPUTInput voltage19.2 - 30.0V DC, reverse polarity protectedCurrent consumption(8 segments each with 350mA output load, redundant operation)3.5A @ 24V DC input, max.Power dissipation(8 segments each with 350mA output load, redundant operation)2.75W / segment, typ.ALARMSAlarm contact rating1 A max. @ 30V DC max.Alarm contact statusNormally closedAlarm thresholdSegment output: 19V DCMECHANICALMounting methodIntegrated fixings for 'Top hat' DIN rail, 35mm x 7.5mm or 35mm x 15mm to EN50022ELECTRICAL CONNECTIONSHost connectorsHost 1A, Host 1B, Host 2A, Host 2B via AKB336 cables to ALF111 modulesField, Power & Alarm terminalsPluggable rising cage-clamp screw terminals (- PS)Conductor size: 0.14 to 2.5 mm2Pluggable spring-clamp screw terminals (- PC)Conductor size: 0.2 to 2.5 mm2- flexible or rigidChassis groundFixed rising cage-clamp screw terminalsConductor size: 0.14 to 2.5 mm2TerminatorsA single termination is provided automatically by using either 1or 2 power modules ENVIRONMENTALAmbient temperatureOperating —40°C to +65°C (See note)Storage—40°C to +85°CNote: This temperature range applies only when the carrier DIN rail is mounted vertically on a vertical surface.Ingress protectionIP20 to BS EN60529 (Additional protection by means of enclosure)ELECTRICALEMC ComplianceTo EN61326:1998 Electrical equiment for measurement, control and laboratory use - EMC requirementsPHYSICAL NETWORKSIEC61158-2ISA-S50.02 Part 2-1992F OUNDATION fieldbus TM H1Profibus PAORDERING INFORMATIONCOMPONENTS AND ACCESSORIESPart No DescriptionF880-CA F880 module carrier, unpopulatedF8018-segment power moduleF880-PS F880 system, pluggable screw terminalconnectors, comprising F880 carrier and twoF801 modulesF880-PC F880 system, pluggable spring clampconnectors, comprising F880 carrier and twoF801 modulesLinking alarm circuitsF801 module top panel showing indicatorsAPPROVALS - for the latest certification information visit /certs_1.nsf。

D2008F(A、P、P1)使用说明书(中性)

D2008F（A/P/P1）数字式电子称重仪表使用说明书2010年03月版●使用前请仔细阅读本产品说明书●请妥善保管本产品说明书，以备查阅目录第一章技术参数 (1)第二章安装联接 (2)一、仪表与数字传感器的连接 (2)三、仪表与大屏幕的连接使用 (2)四、仪表与电脑的连接使用 (2)五、仪表与蓄电池的连接使用 (2)第三章称重记录的贮存与打印 (2)一．称重记录的贮存 (2)二. 皮重存储的输入方法： (3)三. 称重记录的打印 (3)四. 统计报表的打印 (4)五．称重记录的查询 (6)六．称重记录的删除 (7)七．查询打印 (8)附录A：打印操作举例： (8)附录B：明细表及统计报表示例 (10)第一章技术参数1、型号：D2008F （A/P/P1）2、数字传感器接口：通信方式RS485信号传输距离最长1000米传输波特率9600、19200 bps激励电源DC12V数字接口能力最多16个数字传感器或数字模块3、显示：7位白光LED数码管，7个状态指示符。

4、键盘数字键0 ~ 9功能键30个（10个与数字键复合）5、时钟：可显示年、月、日、时、分、秒，自动闰年、闰月；6、大屏幕显示接口传输方式串行输出方式，电流环和RS232传输波特率600bps7、串行通讯接口传输方式RS232/RS485波特率600/1200/2400/4800/9600/19200可选8、打印接口配置标准并行打印接口，可配接ESPON LQ-300K＋Ⅱ、ESPON LQ-300K、ESPONLQ-680K 、ESPON LQ-730K 、ESPON LQ-1600K（＋）、KX-P1131、KX-P1121、DS-300等宽行打印机，D2008FP带热敏微打，D2008FP1带针式微打。

9、数据贮存可贮存1500组车号皮重，201组货号和中英文货物名，100组客户号及中英文客户名，100组数字或中英文备注信息，可贮存2400组称重记录，20组过载记录。

大彩串口屏F系列8寸DC80600F080_1000_0T产品手册

产品手册DC80600F080_1000_0T 数据手册V1.0V1.0V10.V1.0广州大彩光电科技有限公司版权所有版本记录版本日期修改原因页面撰写人审核人V1.02018/6/29创建文档all林绍佳目录1.硬件介绍 (1)1.1硬件配置 (1)1.2调试工具 (1)2.产品规格 (2)3.可靠性测试 (4)4.产品尺寸 (5)5.产品定义 (6)6.产品架构 (7)7.开发软件 (8)7.1什么是虚拟串口屏 (8)7.2Keil与虚拟串口屏绑定调试 (9)8.开发文档 (10)1.硬件介绍以下主要介绍产品的一些硬件配置信息和调试所需工具。

1.1硬件配置以下为该产品硬件配置图，如图1-1所示。

图1-1硬件配置图1.2调试工具以下为该产品调试工具参考图，如图1-2所示。

图1-2调试工具图2.产品规格◆产品参数产品型号DC80600F080_1000_0T(电阻触摸)产品系列F系列核心处理器*32位大彩深度定制专用处理器操作系统嵌入式实时操作系统，上电即可运行协议类型大彩组态指令集尺寸8.0寸分辨率800*600存储空间64Mbit字库内置矢量字体，边缘抗锯齿处理，包含任何大小点阵ASCII、GBK、GB2312、UNICODE 字库，可自定义任意电脑字体显示图片存储支持JPEG、PNG（半透/全透）压缩，支持任意大小图片存储。

累加可存储约48张全屏图片(按大小150KB/张计算，不建议BMP格式)。

图片压缩比不同，此值会上下浮动颜色65K色，16位RGB电压5-15V(误差±0.2V)功耗最暗无喇叭:1.1W；最亮无喇叭:3.5W；最亮有喇叭:4.5W 通讯接口RS232/TTL(出厂默认232电平)接口规格默认PH2.0-8P，可选配FPC1.0-10P图片下载UART/SD卡（U盘预留）外部键盘不支持实时时钟(RTC)选配（支持倒计时、定时器、年月日等时间显示）屏有效显示区（AA）长×宽=163.5mm×123.0mm产品尺寸长×宽×高=199.5mm×148.8mm×16.3mm配套上位机软件VisualTFT®AV输入不支持声音播放WAV、MP3音频格式(喇叭4Ω2W，单声道)，与图片共用存储空间。

HDSP-F208-00000中文资料

Features• Industry Standard Size • Industry Standard Pinout 7.6 mm (0.3 inch) DIP Single 15.24 mm (0.6 inch) DIP Dual Leads on 2.54 mm (0.1 inch) Centers • Choice of ColorsAlGaAs Red, High Efficiency Red, Orange, Yellow, Green • Excellent Appearance Evenly Lighted Segments Mitered Corners on Segments Gray Package Gives Optimum ContrastBlack Surface and Color Tinted Epoxy (HDSP-F161 only)±50° Viewing Angle• Design Flexibility Common Anode or Common Cathode Single and Dual Digits Right Hand Decimal Point ±1. Overflow Character • Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display • High Light Output • High Peak Current• Excellent for Long Digit String Multiplexing• Intensity and Color Selection Option• Sunlight Viewable AlGaAsAlGaAs Red [1]HER Orange Yellow Green Package HDSP-HDSP-HDSP-HDSP-HDSP- DescriptionDrawingF151F201F401F301F501Common Anode Right Hand Decimal A F161Common Anode Right Hand Decimal A F153F203F403F303F503Common Cathode Right Hand Decimal B F157F207F407F307F507Common Anode ±1. Overflow C F158F208F408F308F508Common Cathode ±1. Overflow D G151G201G401G301G501Two Digit Common Anode Right Hand Decimal E G153G203G403G303G503Two Digit Common Cathode Right Hand DecimalFDevicesNote:1. These displays are recommended for high ambient light operation. Please refer to the HDSP-F10X data sheet for low current operation.DescriptionThe 10 mm (0.40 inch) LED seven segment displays are Agilent’s most space-efficient character size. They are designed for viewing distances up to 4.5metres (15 feet). These devicesuse an industry standard sizepackage and pinout. The dualnumeric, single numeric, and ±1.overflow devices feature a righthand decimal point. All devicesare available as either commonanode or common cathode.Typical applications includeinstruments, point of saleterminals, and appliances.Part Numbering System5082-x xx x-x x x xxHDSP-x xx x-x x x xxMechanical Options[1]00: No mechanical option16: Special dimensional tolerancesColor Bin Options[1,2]0: No color bin limitationMaximum Intensity Bin[1,2]0: No maximum intensity bin limitationMinimum Intensity Bin[1,2]0: No minimum intensity bin limitationDevice Configuration/Color[1]1: Common Anode3: Common CathodeDevice Specific Configuration[1]Refer to respective data sheetPackage[1]F: 10 mm (0.4 inch) Single Digit Seven Segment DisplayG: 10 mm (0.4 inch) Dual Digit Seven Segment DisplayNotes:1. For codes not listed in the figure above, please refer to the respective data sheet or contact your nearest Agilent representativefor details.2. Bin options refer to shippable bins for a part-number. Color and Intensity Bins are typically restricted to 1 bin per tube(exceptions may apply). Please refer to respective data sheet for specific bin limit information.Package DimensionsInternal Circuit DiagramHOLE PATTERN FOR PCB LAYOUT TO ACHIEVE UNIFORM 0.450 IN. DIGIT TO DIGIT PITCH. FOR HDSP-FXXX TO HDSP-GXXX.Electrical/Optical Characteristics at T A = 25°C Notes:1.See Figure 1 to establish pulsed conditions.2.Derate above 46°C at 0.54 mA/°C.3.See Figure 6 to establish pulsed conditions.4.Derate above 53°C at 0.45 mA/°C.5.See Figure 7 to establish pulsed conditions.6.Derate above 81°C at 0.52 mA/°C.7.See Figure 8 to establish pulsed conditions.8.Derate above 39°C at 0.37 mA/°C.9.For operation below -20°C, contact your local Agilent components sales office or an authorized distributor.Device SeriesParameterSymbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment [1,2,5]I V 7.515.0mcdI F = 20 mA (Digit Average)Forward Voltage/Segment or DPV F 1.8 2.2V I F = 20 mAHDSP-Peak Wavelength λPEAK 645nm F15x/F16x/Dominant Wavelength [3]λd 637nm G15xReverse Voltage/Segment or DP [4]V R 3.015V I R = 100 µATemperature Coefficient of ∆V F /°C -2mV/°CV F /Segment or DP Thermal Resistance LED R θJ-PIN320°C/W/SegJunction-to-PinAlGaAs RedAbsolute Maximum RatingsAlGaAs Red HER/Orange Yellow Green HDSP-HDSP-HDSP-HDSP-F15x/F16x F20x/G20x/F30x/G30x F50x/G50x DescriptionG15x SeriesG40x SeriesSeriesSeriesUnits Average Power per Segment or DP 9610580105mW Peak Forward Current per 160[1]90[3]60[5]90[7]mA Segment or DPDC Forward Current per Segment 40[2]30[4]20[6]30[8]mA or DPOperating Temperature Range –20 to +100[9]–40 to +100°C Storage Temperature Range –55 to +100°C Reverse Voltage per Segment or DP 3.0V Wavesoldering Temperature for 250°C3 Seconds (1.59 mm [0.063 in.]below body)Device SeriesParameterSymbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment [1,2]I V 4201200µcdI F = 5 mA (Digit Average)Forward Voltage/Segment or DPV F 2.0 2.5V I F = 20 mAHDSP-Peak Wavelength λPEAK 635nm F20x/G20xDominant Wavelength [3]λd 626nm Reverse Voltage/Segment or DP [4]V R 3.030V I R = 100 µATemperature Coefficient of ∆V F /°C -2mV/°CV F /Segment or DP Thermal Resistance LED R θJ-PIN320°C/W/SegJunction-to-PinHigh Efficiency RedElectrical/Optical Characteristics at T A = 25°C, continued OrangeDevice SeriesParameterSymbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment [1,2]I V 4201200µcdI F = 5 mA(Digit Average)Forward Voltage/Segment or DPV F 2.0 2.5V I F = 20 mAPeak Wavelength l PEAK 600nm Dominant Wavelength [3]l d 603nm Reverse Voltage/Segment or DP [4]V R 3.030V I R = 100 µATemperature Coefficient of ∆V F /°C -2mV/°CV F /Segment or DP Thermal Resistance LED Rl\q J-PIN320°C/W/SegJunction-to-PinHDSP-F40x/G40xElectrical/Optical Characteristics at T A = 25°C, continuedYellowDeviceSeries Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]290800µcd I F = 5 mA(Digit Average)I VForward Voltage/Segment or DP V F 2.2 2.5V I F = 20 mA HDSP-Peak WavelengthλPEAK583nmF30x/G30x Dominant Wavelength[3,6]λd581.5586592.5nmReverse Voltage/Segment or DP[4]V R 3.040V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN320°C/W/SegJunction-to-PinHigh Performance GreenDevice Test Series Parameter Symbol Min.Typ.Max.Units Conditions Luminous Intensity/Segment[1,2]I V10303500µcd I F = 10 mA(Digit Average)Forward Voltage/Segment or DP V F 2.1 2.5V I F = 10 mA HDSP-Peak WavelengthλPEAK566nmF50x/G50x Dominant Wavelength[3,6]λd571577nmReverse Voltage/Segment or DP[4]V R 3.050V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN320°C/W/SegJunction-to-PinNotes:1. Case temperature of device immediately prior to the intensity measurement is 25°C.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is that single wavelength which defines the color ofthe device.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. For low current operation, the AlGaAs HDSP-F10X, G10X series displays are recommended. They are tested at 1 mAdc/segment and are pin for pin compatible with the HDSP-F15X/F16x/G15X series.6. The Yellow (HDSP-F30X/G30X) series and Green (HDSP-F50X/G50X) series displays are categorized for dominant wavelength. Thecategory is designated by a number adjacent to the luminous intensity category letter.Figure 4. Relative Luminous Intensity vs. DC Forward Current.Figure 5. Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Current.AlGaAs RedFigure 1. Maximum Tolerable Peak Current vs. PulseDuration – AlGaAs Red.I D C M A X . – M A X I M U M D C C U R R E N T P E R S E G M E N T – m A20T A – AMBIENT TEMPERATURE – °C 30901207050406080100110I F – F O R W A R D C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 20 m A)I F – FORWARD CURRENT PER SEGMENT – mA204010305152535I PEAK – PEAK FORWARD CURRENTPER SEGMENT – mAηP E A K – N O R M A L I Z E D R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D T O 1 A T 20 m A )HER, Orange, Yellow, GreenFigure 6. Maximum Tolerable Peak Current vs.Pulse Duration – HER, Orange.Figure 7. Maximum Tolerable Peak Current vs.Pulse Duration – Yellow.Intensity Bin Limits (mcd)AlGaAs RedHDSP-F15x/F16x/G15x IV Bin Category Min.Max.L 8.6715.90M 13.0023.80N 19.5035.80O 29.3053.60P 43.9080.50HDSP-F20x/G20x/F40x/G40xIV Bin Category Min.Max.C 0.4850.890D 0.728 1.333E 1.091 2.000F 1.636 3.000G 2.454 4.500H 3.682 6.751HER/OrangeHDSP-F30x/G30x IV Bin Category Min.Max.C 0.2970.543D 0.4450.817E 0.669 1.225F 1.003 1.838G 1.504 2.758H 2.2564.137YellowHDSP-F50x/G50x IV Bin Category Min.Max.H 1.54 2.82I 2.31 4.23J 3.46 6.34K 5.189.50L 7.7814.26GreenColor CategoriesNote:All categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representatives for further clarification/information.Contrast EnhancementFor information on contrast enhancement, please see Application Note 1015.Soldering/CleaningCleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from thechlorinated hydrocarbon family (methylene chloride, trichloro-ethylene, carbon tetrachloride,etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For further information on soldering LEDs, please refer to Application Note 1027.元器件交易网For product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939Japan: (+81 3) 3335-8152 (Domestic/Interna-tional), or 0120-61-1280 (Domestic Only)Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand,Philippines, Indonesia: (+65) 6755 2044Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2005 Agilent Technologies, Inc.Obsoletes 5988-2222ENFebruary 2, 20055989-2346EN。

FI-6800产品说明书

Appendixfi-6800 Technical SpecificationsProduct nameFI-6800 Supported operating systems Microsoft ® Windows ® 2000 Professional / Microsoft ® Windows ® XP(32 bit/64 bit) /Microsoft ® Windows Server ™ 2003 / 2008 (32 bit/64 bit) / Microsoft ® Windows Vista ™ (32 bit/64 bit)[VRS]Microsoft ® Windows ® 2000 Professional / Microsoft ® Windows ® XPProfessional (32 bit) / Microsoft ® Windows Vista™ Enterprise/Business (32bit/64bit)Scanner typeADF (Automatic Document Feeder)+Manual Feed Scanning modesSimplex / Duplex, Color / Grayscale / Monochrome Image sensor typeColor CCD (Charge-coupled device) x 2 (front x 1, back x 1) Light sourceWhite LED array Document sizeMaximum: A3 (297 x 420mm or 12 x 17in.) (long document scanning: 3048mm (120in.)) Minimum: A8 Portrait (52 x 74mm or 2 x 3in.) Paper weight (Thickness)Less than A5 size : 0.050 to 0.25mm (41 to 209 g/m 2, or 11 to 56 lb) A4 to A5 size : 0.025 to 0.25mm (20 to 209 g/m 2, or 5.4 to 56 lb) Over A4 : 0.050 to 0.25mm (41 to 209 g/m 2, or 11 to 56 lb) Color *2Grayscale *2Scanning speed (A4 Landscape) *1Monochrome Simplex : 130ppm (200, 300dpi), Duplex: 260ipm (200, 300dpi) (Duplex: 260ipm (200dpi), 250ipm (300dpi) *With CGA board) Color *2 Grayscale *2Scanningspeed (A4 Portrait) *1 MonochromeSimplex : 100ppm (200, 300dpi), Duplex: 200ipm (200, 300dpi) (Duplex: 200ipm (200,300dpi) *With CGA board) Paper chute capacity (A4 Landscape) *3500 sheets (A4: 80 g/m 2 or 21 lb) Expected daily volume60,000 sheets/day Background colorsWhite / Black (Selectable) Optical resolution600dpi Color (24 bit) Grayscale (8 bit) Outputresolution *4Monochrome (1 bit) 50 to 600dpi (adjustable by 1 dpi increments) (100 / 150 / 200 / 240 / 300 / 400dpi) *With CGA board Output format Color:24bit,8bit(8bit and 4bit with driver)Grayscale:8bit(4bit with driver) Monochrome:1bitAD converter 1024 levels (10 bit)Interface *5 *6 Ultra SCSI, USB2.0, With CGA board : Ultra Wide SCSI, USB2.0Connector shape Ultra SCSI : Shield type 50 pin (pin type) , USB: B typeWith CGA board : Ultra Wide SCSI : Shield type 68 pin(pin type),USB: B typeSCSI Terminator Built-inImage processing (half-tone) Dither / Error diffusionVoltage or voltage range AC 100 to 240V ±10%Power consumption Operating: 200W or less (Sleep mode: less than 4W *10)Operating environment Temperature: 15 to 35°C (59 to 95°F )Relative humidity: 20 to 80% (Non-condensing)Dimensions: Width x Depth x Height *7460 x 430 x 310mm (18.1 x 16.9 x 12.2in.)Installation space: 860 x 1630 x 350mm (33.8 x 64.1 x 13.7in.)Weight 32kgIncluded software / drivers TWAIN, ISIS™, ScandAll PRO, Adobe® Acrobat®, QuickScan™ ProDemo,Image processing software (Trial), Kofax® VRS Professional, Scan toMicrosoft SharePointEnvironmental compatibility *8 ENERGY STAR®, and RoHSMulti-feed detection Yes (Standard) ultrasonic multi-feed defection sensorOthersLong paperscanning *93048 mm (120in.)Included items AC cable, USB cable, Setup DVD-ROM, Adobe® Acrobat®DVD-ROM,QuickScan™ Pro brochure*1 Actual scanning speeds are affected by data transmission and software processing times.*2 JPEG compressed figures.*3 Maximum capacity varies, depending upon paper weight.*4 Maximum output resolutions may vary, depending upon the size of the area being scanned andwhether the scanner is scanning in simplex or duplex.*5 You cannot use both SCSI and USB 2.0 interfaces at the same time.*6 You cannot connect multiple computers to the scanner using each type of interface cables at the sametime.*7 Excluding the ADF hopper.*8 PFU Limited, a Fujitsu company, has determined that this product meets RoHS requirements(2005/95/EC).*9 Capable of scanning documents that exceed A3 size in length. For long page scanning with standardI/F: Documents that exceed 432mm (17in.) are limited to 400dpi for lengths up to 863mm (34in.). Documents between 863mm and 3,048mm (120in.) in length are limited to 300dpi. Multi-image documents up 432mm in length are limited to 400dpi. For long page scanning with VRS: Documentsthat exceed 432mm (17in.) are limited to 300dpi for lengths up to 1,778mm (70in.). Documentsbetween 1,778mm and 3,048mm (120in.) in length are limited to 200dpi. Documents that exceed432mm can be scanned under any resolution for lengths up to 1,016mm (70in.) when used with ISIS.*10 Without CGA board interface.■OptionsPost Imprinter(Front side)(FI-680PRF)PA03575-D201Post Imprinter(Back side) (FI-680PRB) PA03575-D203The imprinter option enables users to print information on original documentsfor document management purposes. While the FI-680PRF (post imprinter)prints information on the front of documents, the FI-680PRB (post imprinter)prints information on the reverse-side of documents after they have beenscanned. Although both the FI-680PRF and the FI-680PRB may be attachedto the same scanner unit, both imprinters cannot be used simultaneously.■ConsumablesPick Roller PA03575-K011Lifetime: Every 600,000 sheets or one year. These rollers feed documents into the scanner.Separator Roller PA03575-K012Lifetime: Every 600,000 sheets or one year.These rollers feed documents through the scanner.Brake Roller PA03575-K013Lifetime: Every 600,000 sheets or one year.These rollers separate documents as they are being fed into the scanner.Print Cartridge CA00050-0262 Lifetime: 4,000,000 charactersFI-680PRF and FI-680PRB print head。

HDEXT50M 用户手册说明书

HDEXT50MUSER MANUALExtend HD Signals over CAT 5/5e/6 up to 164ft.(50m)All Rights ReservedVersion: HDEXT50M_2017V1.2PrefaceRead this user manual carefully before using this product. Pictures displayed in this manual are for reference only. Different models and specifications are subject to the actual product.This manual is only for operational instruction, not for any maintenance usage. The functions described in this version are updated till June 2016. Any changes of functions and parameters since then will be informed separately. Please refer to the dealers for the latest details.All product function is valid till 2017-6-19.TrademarksProduct model and logo are trademarks. Any other trademarks mentioned in this manual are acknowledged as the properties of the trademark owner. No part of this publication may be copied or reproduced without the prior written consent.FCC StatementThis equipment can generate, use, and radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. It has been tested and found to comply with the limits of a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a commercial installation.Operation of this equipment in a residential area is likely to cause interference, in which case the user at their own expense will be required to take whatever measures may be necessary to correct the interferenceAny changes or modifications not expressly approved by the manufacture would void the user’s authority to operate the equipment.SAFETY PRECAUTIONST o ensure the best from the product, please read all instructions carefully before using the device. Save this manual for further reference.●Unpack the equipment carefully and save the original box and packing material forprobable future shipment.●Follow basic safety precautions to reduce the risk of fire, electrical shock and injuryto persons.●Do not dismantle the housing or modify the module. It may result in electrical shockor burn.●Using supplies or parts not meeting the products’ specifications may causedamage, deterioration or malfunction.●Refer all servicing to qualified service personnel.●T o prevent fire or shock hazard, do not expose the unit to rain or moisture. Do notinstall this product near water.●Do not place any heavy items on the extension cable in case of extrusion.●Do not remove the housing of the device as opening or removing housing mayexpose you to dangerous voltage or other hazards.●Install the device in a place with fine ventilation to avoid damage caused byoverheating.●Keep the module away from liquids.●Spillage into the housing may result in fire, electrical shock, or equipment damage.If an object or liquid falls or spills on to the housing, unplug the module immediately.●Do not twist/pull by force the ends of the optical cable. It can cause malfunction.●Do not use liquid or aerosol cleaners to clean this unit. Always unplug the powercord to the device before cleaning.●Unplug the power cord when left unused for an extended period.●Information on disposal for scrapped devices: Do not burn or mix with generalhousehold waste; please treat the devices as normal electrical waste.Table of Contents1. Introduction (5)1.1 Introduction to HDEXT50M (5)1.2 Features (5)1.3 Package List (6)2. Panel Description (6)3. System Connection (7)3.1 Usage Precautions (7)3.2 System Diagram (7)3.3 Connection Procedure (8)4. Specification (8)5. Troubleshooting & Maintenance (9)6. After-sales Service (10)7. Warranty (11)1. Introduction1.1 Introduction to HDEXT50M1.2 Features▪Extend DVI/HDMI over cost-effective Cat5 cable up to 164 ft. (50m) ▪Supports full HD 1080p (1920x1080@60Hz)▪Local HDMI output (loop out)▪Supports PoC – receiver can we powered via the transmitter▪Built-in EDID to ensure proper HDMI transmission▪Built in EQ button on the side to compensate for signal equalization ▪Digital audio support through HDMI▪HDCP 1.4 compliant▪Bi-directional wideband IR control▪Plug & Play - no set-up required▪Includes IR kits & one Micro USB power supply1.3 Package List• 1 x Transmitter• 1 x Receiver• 1 x Wideband IR TX cable • 1 x Wideband IR RX cable • 1 x Power adapter (DC 5V 1A)• 1 x User ManualNote : If there are defective parts or parts are missing, please contact your local dealer(s).2. Panel DescriptionTransmitter (TX)① CAT OUT : RJ45 connector withGreen (when powered on) & Yellow (when linked successfully between transmitter and receiver) indicators. Connect to Receiver over CATx cable. ② IR IN: Connect with IR Receiver.③ IR OUT : Connect with IR Emitter. ④ DC 5V: Micro USB, connect to thepower adaptor. ⑤ HDMI IN: Connect to HDMI source. ⑥ HDMI OUT : HDMI loop output,connect to display. ⑦ RESET : Reboot.Receiver (RX)①CAT IN: RJ45 connector with Green& Yellow indicators. Connect to Transmitterover CATx cable.②IR IN: Connect with IR Receiver.③IR OUT: Connect with IR Emitter.④HDMI OUT: Connect to display.⑤EQ SETTING: After the system is connected, press this button three to six timesrepeatedly until the best image output. When the cable, source, or display ischanged, or reset the output resolution, it is need to press this button repeatedly to ensure the best image.Pictures shown in this manual are only for reference.3. System Connection3.1 Usage Precautions▪System should be installed in a clean environment, which should have a proper temperature and humidity.▪All the power switches, plugs, sockets and power cords should be insulated and safe.▪All devices should be connected before powered on.▪System Diagram shown in this manual is for reference only; more specific schemes depend on real-time applications.3.2 System Diagram3.3 Connection ProcedureStep1. Connect HDMI source devices (Gaming consoles, DVD players, etc.) to the HDMI input ports on the Transmitter.Step2. Connect a CAT5e/6 cable to the CAT5e/6 port on both the Transmitter and the Receiver.Step3. Connect HDMI display (HDTV, projector, monitor, etc.) to the HDMI output on the Receiver unit.Step4. Connect the 5V power supply LAST to both units and power on the devices. 4. Specification5. Troubleshooting & MaintenanceIf your problem persists after following the above troubleshooting steps, seek further help from authorized dealer or our technical support.6. After-sales ServiceIf problems arise when operating the device, please refer to this user manual. Any transport costs are borne by the users during the warranty.①Product Limited Warranty: We warrant that products will be free from defects inmaterials and workmanship for three years, which starts from the first day the product exits warehouse. (Make note of the serial number on the product)Proof of purchase in the form of a bill of sale or receipted invoice MUST bepresented to obtain warranty service.②What the warranty does not cover:●Warranty expiration.●Factory applied serial number has been altered or removed from the product.●Damage, deterioration or malfunction caused by:●Normal wear and tear●Use of supplies or parts not meeting our specifications●No certificate or invoice as the proof of warranty.●The product model showed on the warranty card does not match with themodel of the product for repairing or had been altered.●Damage caused by force majeure.●Servicing not authorized●Any other causes which does not relate to a product defect●Delivery, installation or labor charges for installation or setup of the product.③Technical Support: Email or call our after-sales department if there are anyproblems or any unanswered questions. Please inform us the following information about your cases:●Product version and name.●Detailed failure situations.●The formation of the cases.Remarks: For any questions or problems, please try to get help from your local distributor or contact or call us at 888-975-1368 for further support.HDEXT50M7. WarrantyA. LIMITED WARRANTYKanexPro ™ warrants that (a) its products (the “Product”) will perform greatly in agreement with the accompanying written materials for a period of 36 months (3 full years) from the date of receipt and (b) that the product will be free from defects in materials and workmanship under normal use and service for a period of 3 years.B. CUSTOMER REMEDIESKanexPro’s entire liability and Customer’s exclusive remedy shall be, at KanexPro option, either return of the price paid for the product, or repair or replacement of the Product that does not meet this Limited Warranty and which is returned to KanexPro with a copy of customers’ receipt. This Limited Warranty is void if failure of the Product has resulted from accident, abuse, or misapplication. Any replacement Product will be warranted for the remainder of the original warranty period of 3 years, whichever is longer.C. NO OTHER WARRANTIEST o the maximum extent permitted by applicable law, KanexPro disclaims all other warranties, either express or implied, including, but not limited to implied warranties of merchantability and fitness for a purpose, regarding the product and any related written materials. This limited warranty gives customers specific legal rights. Customers may have other rights depending on the jurisdiction. D. NO LIABILITY FOR DAMAGES T o the maximum extent permitted by applicable law, in no event shall KanexPro be liable for any damages whatsoever (including without limitation, special, incidental, consequential, or indirect damages for personal injury, loss of business profits, business interruption, loss of business information, or any other pecuniary loss) arising out of the use of or inability to use this product, even if KanexPro has been advised of the possibility of such damages.11 | P a g e1405 pioneer street Brea, CA 92821。

HDS系列存储产品技术资料

HDS系列存储产品技术资料HDS存储目录第1章 HDS系列产品手册资料 (4)1.1 HDS VSP G1000（高端存储－1及高端存储扩容－1/2）产品介绍 (4)14.1.1概述 (4)14.1.2 VSP G1000产品亮点 (4)14.1.3 VSP G1000产品技术优势 (5)14.1.4 VSP G1000软件包 (14)14.1.5 VSP G1000产品技术指标 (25)1.2 HDS HUS-VM（高端存储－2/3及高端存储扩容－3/4）产品介绍 (30)14.2.1概述 (30)14.2.2 HUS VM技术的技术优势 (33)14.2.3HUS VM软件包 (40)14.2.4 HUS VM产品技术指标 (43)1.3 HDS VSP G200（中端存储1/2/3）产品介绍 (46)14.3.1概述 (46)14.3.2VSP Gx00系列产品亮点 (47)14.3.3 VSP Gx00技术优势 (48)14.3.4 VSP Gx00软件包 (49)14.3.5 VSP Gx00产品技术指标 (49)1.4 存储虚拟化兼容列表（VSP G1000/G200/HUS-VM通用） (54)1.5 HDS HCP（归档存储网关）产品介绍 (58)14.5.1什么是归档及其影响 (58)14.5.2归档平台与SAN和NAS的区别 (60)14.5.3HCP 概述 (61)14.5.4HCP优势 (62)14.5.5HCP功能介绍 (63)1.6 HDS Brocade 6510（光纤交换机－1/2及光纤交换机扩容）产品介绍 (69)14.6.1 亮点 (69)14.6.2 概述 (70)14.6.3 超高的性价比，支持不断增长的 SAN 工作负载 (70)14.6.4行业领先的技术，灵活、简单而且简便易用 (71)14.6.5拟化私有云存储的有机组成部分 (71)14.6.6 Brocade Access Gateway（接入网关）模式错误！未定义书签。

HDSP-0984-F0200资料

DevicesPart Number HDSP-ColorDescriptionFront View0781High-Efficiency Red Numeric, Right Hand DP A 0782Low Power Numeric, Left Hand DP B 0783Over Range ±1C 0784HexadecimalD 0791High-Efficiency Red Numeric, Right Hand DP A 0792High Brightness Numeric, Left Hand DP B 0793Over Range ±1C 0794HexadecimalD 0881YellowNumeric, Right Hand DP A 0882Numeric, Left Hand DP B 0883Over Range ±1C 0884HexadecimalD 0981High-Performance GreenNumeric, Right Hand DP A 0982Numeric, Left Hand DP B 0983Over Range ±1C 0984HexadecimalDHDSP-078x HDSP-079x HDSP-088x HDSP-098xFeatures• Three Character Options Numeric, Hexadecimal, Over Range• Three ColorsHigh Efficiency Red, Yellow,High Performance Green• 4x 7 Dot Matrix Character • High Efficiency Red, Yellow and High Performance Green • Two High Efficiency Red OptionsLow Power, High Brightness • Performance Guaranteed Over Temperature• High Temperature Stabilized • Memory Latch/Decoder/DriverTTL Compatible• Categorized for Luminous IntensityDescriptionThese standard solid state displays have a 7.4 mm (0.29 inch) dot matrix character and an on-board IC with data memory latch/decoder and LED drivers in a glass/ceramic package.The hermetic HDSP-078x,-079x/-088x displays utilize a solder glass frit seal. The HDSP-098X displays utilize an epoxy glass-to-ceramic seal.The numeric devices decode posi-tive BCD logic into characters “0-9,” a “–” sign, decimal point,and a test pattern. Thehexadecimal devices decodeGlass/Ceramic Numeric and Hexadecimal Displays for Industrial Applications Technical Datapositive BCD logic into 16characters, “0-9, A-F.” An input is provided on the hexadecimal devices to blank the display (all LEDS off) without losing the contents of the memory.The over range device displays “±1” and right hand decimal point and is typically driven via external switching transistors.COUNTRY CODEPackage DimensionsAbsolute Maximum RatingsNotes:1. The nominal thermal resistance of a display mounted in a socket that is soldered onto a printed circuit board isRθJA=50°C/W/device. The device package thermal resistance is RθJ-PIN = 15°C/W/device. The thermal resistance device pin-to-ambient through the PC board should not exceed 35°C/W/device for operation up to T A = +100°C.2. Voltage values are with respect to device ground, pin 6.3. These displays are categorized for luminous intensity with the intensity category designated by a letter code located on the back ofthe display package. Case temperature of the device immediately prior to the light measurement is equal to 25°C.Electrical/Optical Characteristics T A = –55°C to +100°CNotes:4. The luminous intensity at a specific operating ambienttemperature, I v(T A), may be approximated from the following exponential equation: I v(T A)=I v(25°C) e[k(T-25°C)].Device KHDSP-078 Series–0.0131/°CHDSP-079x SeriesHDSP-088x Series–0.0112/°CHDSP-098x Series–0.0104/°C 5. The dominant wavelength, λd, is derived from the CIE chroma-ticity diagram and represents the single wavelength whichdefines the color of the device.6. The HDSP-088X and HDSP-098X series devices are categor-ized as to dominant wavelength with the category designated by a number on the back of the display package.7. All typical values at V CC = 5.0 V and T A = 25°C.Operational ConsiderationsElectricalThese devices use a modified4x7 dot matrix of light emitting diodes to display decimal/ hexadecimal numeric informa-tion. The high efficiency red and yellow displays use GaAsP/GaP LEDs and the high performance green displays use GaP/GaP LEDs. The LEDs are driven by constant current drivers, BCD information is accepted by the display memory when the enable line is at logic low and the data islatched when the enable is atlogic high. Using the enable pulsewidth and data setup and holdtimes listed in the RecommendedOperating Conditions allows datato be clocked into an array ofdisplays at a 6.7MHz rate.The decimal point input is activelow true and this data is latchedinto the display memory in thesame fashion as the BCD data.The decimal point LED is drivenby the on-board IC.The blanking control input on thehexadecimal displays blanks(turns off) the displayedinformation without disturbingthe contents of display memory.The display is blanked at aminimum threshold level of 2.0volts. When blanked, the displaystandby power is nominally 250mW at T A = 25°C.The ESD susceptibility of the ICdevices is Class A of MIL-STD-883 or Class 2 of DOD-STD-1686and DOD-HDBK-263.AMechanicalThese displays are hermetically sealed for use in environments that require a high reliability device. These displays are designed and tested to meet a helium leak rate of5x10-8cc/sec.These displays may be mounted by soldering directly to a printed circuit board or insertion into a socket. The lead-to-lead pin spacing is 2.54 mm (0.100 inch) and the lead row spacing is 15.24 mm (0.600 inch). These displays may be end stacked with 2.54 mm (0.100 inch) spacing between outside pins of adjacent displays. Sockets such as Augat 324-AG2D (3 digits) or Augat 508-AG8D (one digit, right anglemounting) may be used.The primary thermal path forpower dissipation is through thedevice leads. Therefore, to insurereliable operation up to anambient temperature of +100°C,it is important to maintain abase-to-ambient thermalresistance of less than35°C watt/device as measured ontop of display pin 3.For further information onsoldering and post soldercleaning, see Application Note1027, Soldering LEDComponents.PreconditioningThese displays are 100% pre-conditioned by 24 hour storage at125°C, at 100°C for the HDSP-098x Series.Contrast EnhancementThese display devices aredesigned to provide an optimumON/OFF contrast when placedbehind an appropriate contrastenhancement filter. For furtherinformation on contrastenhancement, see ApplicationNote 1015, ContrastEnhancement for LEDDisplays.Over Range DisplayThe over range devices display“±1” and decimal point. Thecharacter height and packageconfiguration are the same as thenumeric and hexadecimaldevices. Character selection isobtained via external switchingtransistors and current limitingresistors.Absolute Maximum RatingsDescription Symbol Min Max Unit Storage Temperature, Ambient T S–65+125°C Operating Temperature, Ambient T A–55+100°C Forward Current, Each LED I F10mA Reverse Voltage, Each LED V R5VPackage DimensionsLuminous Intensity per LED(Digit Average) at T= 25°C Figure 3. Typical Driving Circuit.Notes:0: Line switching transistor in Figure 7 cutoff.1: Line switching transistor in Figure 7 saturated.X: ‘don’t care.’Electrical Characteristics T A = –55°C to +100°CColor Bin Limits (Dominant Wavelength)Note:Bin categories are established for classification of products. Productsmay not be available in all bin categories. Please consult your localAgilent Technologies representative./semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939Japan: (+81 3) 3335-8152 (Domestic/Interna-tional), or 0120-61-1280 (Domestic Only)Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand,Philippines, Indonesia: (+65) 6755 2044Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc.Obsoletes 5964-6390EJuly 14, 20045988-2261EN。

HDSP0984资料

3-256DevicesPart Number HDSP-ColorDescriptionFront View0781High-Efficiency Red Numeric, Right Hand DP A 0782Low Power Numeric, Left Hand DP B 0783Over Range ±1C 0784HexadecimalD 0791High-Efficiency Red Numeric, Right Hand DP A 0792High Brightness Numeric, Left Hand DP B 0793Over Range ±1C 0794HexadecimalD 0881YellowNumeric, Right Hand DP A 0882Numeric, Left Hand DP B 0883Over Range ±1C 0884HexadecimalD 0981High-Performance GreenNumeric, Right Hand DP A 0982Numeric, Left Hand DP B 0983Over Range ±1C 0984Hexadecimal DHDSP-078X HDSP-079X HDSP-088X HDSP-098XFeatures• Three Character Options Numeric, Hexadecimal, Over Range• Three ColorsHigh Efficiency Red, Yellow,High Performance Green• 4x 7 Dot Matrix Character • High Efficiency Red, Yellow and High Performance Green • Two High Efficiency Red OptionsLow Power, High Brightness • Performance Guaranteed Over Temperature• High Temperature Stabilized • Memory Latch/Decoder/DriverTTL Compatible• Categorized for Luminous IntensityDescriptionThese standard solid state displays have a 7.4 mm (0.29 inch) dot matrix character and an on-board IC with data memory latch/decoder and LED drivers in a glass/ceramic package.The hermetic HDSP-078X,-079X/-088X displays utilize a solder glass frit seal. The HDSP-098X displays utilize an epoxy glass-to-ceramic seal.The numeric devices decode posi-tive BCD logic into characters “0-9,” a “–” sign, decimal point,and a test pattern. Thehexadecimal devices decodeGlass/Ceramic Numeric and Hexadecimal Displays for Industrial Applications Technical DataH5964-6390Epositive BCD logic into 16characters, “0-9, A-F.” An input is provided on the hexadecimal devices to blank the display (all LEDS off) without losing the contents of the memory.The over range device displays “±1” and right hand decimal point and is typically driven via external switching transistors.3-257Figure 1. Timing Diagram.Figure 2. Block Diagram.COUNTRY CODEPackage DimensionsAbsolute Maximum RatingsRecommended Operating ConditionsDescription Symbol Min.Nom.Max.Unit Supply Voltage[2]V CC 4.5 5.0 5.5V Operating Temperature, Ambient[1]T A–55+100°C Enable Pulse Width t W100nsec Time Data Must Be Held Before Positive t SETUP50nsec Transition of Enable LineTime Data Must Be Held After Positive t HOLD50nsec Transition of Enable LineEnable Pulse Rise Time t TLH 1.0msec Optical Characterstics at T = 25°C, V = 5.0 VNotes:1. The nominal thermal resistance of a display mounted in a socket that is soldered onto a printed circuit board isRθJA=50°C/W/device. The device package thermal resistance is RθJ-PIN = 15°C/W/device. The thermal resistance device pin-to-ambient through the PC board should not exceed 35°C/W/device for operation up to T A = +100°C.2. Voltage values are with respect to device ground, pin 6.3. These displays are categorized for luminous intensity with the intensity category designated by a letter code located on the back ofthe display package. Case temperature of the device immediately prior to the light measurement is equal to 25°C.3-258Electrical/Optical Characteristics T A = –55°C to +100°CNotes:4. The luminous intensity at a specific operating ambienttemperature, I v(T A), may be approximated from the following exponential equation: I v(T A)=I v(25°C) e[k(T-25°C)].Device KHDSP-078X Series–0.0131/°CHDSP-079X SeriesHDSP-088X Series–0.0112/°CHDSP-098X Series–0.0104/°C 5. The dominant wavelength, λd, is derived from the CIE chroma-ticity diagram and represents the single wavelength whichdefines the color of the device.6. The HDSP-088X and HDSP-098X series devices are categor-ized as to dominant wavelength with the category designated by a number on the back of the display package.7. All typical values at V CC = 5.0 V and T A = 25°C.Operational ConsiderationsElectricalThese devices use a modified4x7 dot matrix of light emitting diodes to display decimal/ hexadecimal numeric informa-tion. The high efficiency red and yellow displays use GaAsP/GaP LEDs and the high performance green displays use GaP/GaP LEDs. The LEDs are driven by constant current drivers, BCD information is accepted by the display memory when the enable line is at logic low and the data islatched when the enable is atlogic high. Using the enable pulsewidth and data setup and holdtimes listed in the RecommendedOperating Conditions allows datato be clocked into an array ofdisplays at a 6.7MHz rate.The decimal point input is activelow true and this data is latchedinto the display memory in thesame fashion as the BCD data.The decimal point LED is drivenby the on-board IC.The blanking control input on thehexadecimal displays blanks(turns off) the displayedinformation without disturbingthe contents of display memory.The display is blanked at aminimum threshold level of 2.0volts. When blanked, the displaystandby power is nominally 250mW at T A = 25°C.The ESD susceptibility of the ICdevices is Class A of MIL-STD-883 or Class 2 of DOD-STD-1686and DOD-HDBK-263.A3-259MechanicalThese displays are hermetically sealed for use in environments that require a high reliability device. These displays are designed and tested to meet a helium leak rate of5x10-8cc/sec.These displays may be mounted by soldering directly to a printed circuit board or insertion into a socket. The lead-to-lead pin spacing is 2.54 mm (0.100 inch) and the lead row spacing is 15.24 mm (0.600 inch). These displays may be end stacked with 2.54 mm (0.100 inch) spacing between outside pins of adjacent displays. Sockets such as Augat 324-AG2D (3 digits) or Augat 508-AG8D (one digit, right anglemounting) may be used.The primary thermal path forpower dissipation is through thedevice leads. Therefore, to insurereliable operation up to anambient temperature of +100°C,it is important to maintain abase-to-ambient thermalresistance of less than35°C watt/device as measured ontop of display pin 3.For further information onsoldering and post soldercleaning, see Application Note1027, Soldering LEDComponents.PreconditioningThese displays are 100% pre-conditioned by 24 hour storage at125°C, at 100°C for the HDSP-098X Series.Contrast EnhancementThese display devices aredesigned to provide an optimumON/OFF contrast when placedbehind an appropriate contrastenhancement filter. For furtherinformation on contrastenhancement, see ApplicationNote 1015, ContrastEnhancement for LEDDisplays.Over Range DisplayThe over range devices display“±1” and decimal point. Thecharacter height and packageconfiguration are the same as thenumeric and hexadecimaldevices. Character selection isobtained via external switchingtransistors and current limitingresistors.Absolute Maximum RatingsDescription Symbol Min Max Unit Storage Temperature, Ambient T S–65+125°C Operating Temperature, Ambient T A–55+100°C Forward Current, Each LED I F10mA Reverse Voltage, Each LED V R5V3-2603-261Package DimensionsLuminous Intensity per LED(Digit Average) at T= 25°C Recommended Operating ConditionsV = 5.0 VFigure 3. Typical Driving Circuit.Notes:0: Line switching transistor in Figure 7 cutoff.1: Line switching transistor in Figure 7 saturated.X: ‘don’t care.’Electrical Characteristics T A = –55°C to +100°C3-262。

HDSP-5557-AB000资料

Features• Low Power Consumption • Industry Standard Size• Industry Standard Pinout • Choice of Character Size7.6 mm (0.30 in), 10 mm (0.40 in), 10.9 mm (0.43 in), 14.2 mm (0.56 in), 20 mm (0.80 in)• Choice of ColorsAlGaAs Red, High Efficiency Red (HER), Yellow, Green• Excellent Appearance Evenly Lighted Segments±50° Viewing Angle• Design FlexibilityCommon Anode or Common CathodeSingle and Dual DigitLeft and Right Hand Decimal Points±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display• Excellent for Long Digit String Multiplexing DescriptionThese low current seven segment displays are designed for applica-tions requiring low power consumption. They are tested and selected for their excellent low current characteristics to ensure that the segments are matched at low currents. Drive currents as low as 1 mA per segment are available.Pin for pin equivalent displays are also available in a standard current or high light ambient design. The standard current displays are available in all colors and are ideal for most applica-tions. The high light ambient displays are ideal for sunlight ambients or long string lengths. For additional information see the 7.6 mm Micro Bright Seven Segment Displays, 10 mm Seven Segment Displays, 7.6 mm/10.9 mm Seven Segment Displays, 14.2 mm Seven Segment Displays, 20 mm Seven Segment Displays, or High Light Ambient Seven Segment Displays data sheets.Low Current Seven SegmentDisplays Technical Data HDSP-335x SeriesHDSP-555x SeriesHDSP-751x SeriesHDSP-A10x Series HDSP-A80x Series HDSP-A90x Series HDSP-E10x Series HDSP-F10x Series HDSP-G10x Series HDSP-H10x Series HDSP-K12x, K70x Series HDSP-N10x SeriesHDSP-N40x SeriesDevicesAlGaAs HER Yellow Green Package HDSP-HDSP-HDSP-HDSP-Description Drawing A1017511A801A9017.6 mm Common Anode Right Hand Decimal A A1037513A803A9037.6 mm Common Cathode Right Hand Decimal B A1077517A807A9077.6 mm Common Anode ±1. Overflow C A1087518A808A9087.6 mm Common Cathode ±1. Overflow D F10110 mm Common Anode Right Hand Decimal E F10310 mm Common Cathode Right Hand Decimal F F10710 mm Common Anode ±1. Overflow G F10810 mm Common Cathode ±1. Overflow H G10110 mm Two Digit Common Anode Right Hand Decimal X G10310 mm Two Digit Common Cathode Right Hand Decimal Y E100335010.9 mm Common Anode Left Hand Decimal I E101335110.9 mm Common Anode Right Hand Decimal J E103335310.9 mm Common Cathode Right Hand Decimal K E106335610.9 mm Universal ±1. Overflow[1]L H101555114.2 mm Common Anode Right Hand Decimal M H103555314.2 mm Common Cathode Right Hand Decimal N H107555714.2 mm Common Anode ±1. Overflow O H108555814.2 mm Common Cathode ±1. Overflow P K121K70114.2 mm Two Digit Common Anode Right Hand Decimal R K123K70314.2 mm Two Digit Common Cathode Right Hand Decimal S N10020 mm Common Anode Left Hand Decimal Q N101N40120 mm Common Anode Right Hand Decimal T N103N40320 mm Common Cathode Right Hand Decimal U N10520 mm Common Cathode Left Hand Decimal V N106N40620 mm Universal ±1. Overflow[1]W Note:1. Universal pinout brings the anode and cathode of each segment’s LED out to separate pins. See internal diagrams L or W.Part Numbering System5082-x xx x-x x x xxHDSP-x xx x-x x x xxMechanical Options[1]00: No mechanical optionColor Bin Options[1,2]0: No color bin limitationMaximum Intensity Bin[1,2]0: No maximum intensity bin limitationMinimum Intensity Bin[1,2]0: No minimum intensity bin limitationDevice Configuration/Color[1]G: GreenDevice Specific Configuration[1]Refer to respective datasheetPackage[1]Refer to Respective datasheetNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative fordetails.2. Bin options refer to shippable bins for a part-number. Color and Intensity Bins are typically restricted to 1 bin per tube (excep-tions may apply). Please refer to respective datasheet for specific bin limit information.Package DimensionsPackage Dimensions (cont.)Package Dimensions (cont.)*The Side View of package indicates Country of Origin.Package Dimensions (cont.)Package Dimensions (cont.)Package Dimensions (cont.)Internal Circuit DiagramInternal Circuit Diagram (cont.)Absolute Maximum RatingsAlGaAs Red - HDSP-HERA10X/E10X/H10X HDSP-751X/Yellow GreenK12X/N10X/N40X335X/555X/HDSP-A80X HDSP-A90X Description F10X, G10X Series K70X Series Series Series Units Average Power per Segment or DP375264mW Peak Forward Current per 45mA Segment or DPDC Forward Current per15[1]15[2]mA Segment or DPOperating Temperature Range-20 to +100-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment 3.0V or DPWave Soldering Temperature for 3Seconds (1.60 mm [0.063 in.] below 250°C seating body)Notes:1. Derate above 91°C at 0.53 mA/°C.2. Derate HER/Yellow above 80°C at 0.38 mA/°C and Green above 71°C at 0.31 mA/°C.Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions315600I F = 1 mA A10x3600I F = 5 mA330650I F = 1 mAF10x, G10x3900I F = 5 mA390650I F = 1 mA E10x Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)3900I F = 5 mA400700I F = 1 mAH10x, K12x4200I F = 5 mA270590I F = 1 mAN10x, N40x3500I F = 5 mA1.6I F = 1 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA1.82.2I F = 20 mA PkAll Devices Peak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2 mV mV/°CV F/Segment or DPA10x255F10x, G10x320E10x340Thermal Resistance LED RθJ-PIN°C/W/SegH10x, K12x Junction-to-Pin400N10x, N40x430High Efficiency RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions160270I F = 2 mA 751x1050I F = 5 mA200300I F = 2 mA Luminous Intensity/Segment[1,2]I V mcd(Digit Average)1200I F = 5 mA335x, 555x,K70x270370I F = 2 mA1480I F = 5 mA1.6I F = 2 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA2.1 2.5I F = 20 mA Pk All Devices Peak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DP751x200335x Thermal Resistance LED RθJ-PIN280°C/WJunction-to-Pin555x, K70x345YellowDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250420I F = 4 mA(Digit Average)I V mcd1300I F = 10 mA1.7I F = 4 mAForward Voltage/Segment or DP V F 1.8V I F = 5 mA A80x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK583nmDominant Wavelength[3,5]λd581.5585592.5nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinGreenDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250475I F = 4 mA(Digit Average)I V mcd1500I F = 10 mA1.9I F = 4 mAForward Voltage/Segment or DP V F 2.0V I F = 10 mA A90x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK566nmDominant Wavelength[3,5]λd571577nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is the single wavelength which defines the color of thedevice.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. The yellow (HDSP-A800) and Green (HDSP-A900) displays are categorized for dominant wavelength. The category is designated by anumber adjacent to the luminous intensity category letter.AlGaAs RedIntensity Bin Limits (mcd)AlGaAs RedHDSP-A10xIV Bin Category Min.Max.E0.3150.520F0.4280.759G0.621 1.16H0.945 1.71I 1.40 2.56J 2.10 3.84K 3.14 5.75L 4.708.55HDSP-E10x/F10x/G10xIV Bin Category Min.Max.D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-H10x/K12xIV Bin Category Min.Max.C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50HDSP-N10xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued HERHDSP-751xIV Bin Category Min.Max.B0.1600.240C0.2000.300D0.2500.385E0.3150.520F0.4280.759G0.621 1.16HDSP-751xIV Bin Category Min.Max.B0.2400.366C0.3000.477D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-555x/K70xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued YellowHDSP-A80xIV Bin Category Min.Max.D0.2500.385E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60GreenHDSP-A90xIV Bin Category Min.Max.E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60Electrical/OpticalFor more information on electrical/optical characteristics, please see Application Note 1005.Contrast Enhancement For information on contrast enhancement, please see Application Note 1015.Soldering/Cleaning Cleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from the chorinated hydrocarbon family (methylene chloride, trichloro-ethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs, please refer to Application Note 1027.Note:All categories are established for classification of products. Productsmay not be available in all categories. Please contact your localAgilent representatives for further clarification/information.Color Categories/semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788 6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6271 2451India, Australia, New Zealand: (+65) 6271 2394Japan: (+81 3) 3335-8152(Domestic/International), or0120-61-1280(Domestic Only)Korea: (+65) 6271 2194Malaysia, Singapore: (+65) 6271 2054Taiwan: (+65) 6271 2654Data subject to change.Copyright © 2005 Agilent Technologies, Inc.Obsoletes 5988-8412ENJanuary 19, 20055989-0080EN。

德飞Delphi产品手册.pdf_1693960108.2492783说明书

产品手册 | 德飞Delphi德飞整合光电关联显微镜全球首创整合的台式荧光扫描电镜一体机由于电镜无法感知荧光信号，在电镜里找到荧光所确定的感兴趣区域，是光电关联显微的一个难题。

传统的分布式光电关联显微技术，荧光和电镜是两台独立的机器，二者共用一个样品载具，通过对载具的机械校准来实现对同一位置点的观察，受限于机械移动的精度，当样品尺寸较大或荧光信号较少时，传统的光电关联技术无法满足生物样品在纳米尺度关联的要求。

如右图，德飞采用对射的光路结构，荧光显微镜找到感兴趣区域后，无需任何的移动样品，电镜直接对同一位置高分辨观察，整合的光路设计提高了位置关联的精度。

德飞整合/对射光路结构原理图(iCLEM)传统的光电关联显微技术，荧光和电镜图像是分别观察和获取的，两种图像需要人工后期匹配，会引入人为误差。

阴极荧光是德飞图像自动关联的关键，当电镜的电子束击打在载玻片上时，会产生阴极荧光，而它能被荧光显微镜的相机接受到，阴极荧光斑点被用来作为临时的图像匹配基准，进而实现高精度和自动的荧光和电镜图像叠加。

使用德飞，用户不需要在校准和叠加图像上花费时间，德飞采用了高精度的机械设计和专利的自动图像叠加技术，无需人工干预，就能得到精度高达50纳米的荧光和电镜叠加图像。

临时的图像匹配基准阴极荧光sCMOS 相机固态LED 光源电镜镜筒真空室荧光物镜德飞提供了快速和方便的生物图像解决方案，用户能在一台整合的显微镜里同时获得荧光和电镜图像专利的图像自动叠加技术小鼠胰腺组织超薄切片光电关联图像，100nm厚，锇酸电镜染色，Hoechst(蓝)，胰岛素-Aleaxa594（桔）荧光染色德飞的应用：德飞整合光电关联显微镜（iCLEM），荧光定位样品中感兴趣区域，电镜接力高倍观察，通过在荧光图像中叠加电镜图像，实现在一张图像里同时获得功能物质分布和高分辨结构信息。

典型的德飞光电关联应用包括：组织，细胞或是其它生物材料的切片样品；在载物片上培植的细胞。