SN74AS244C中文资料 - 360文档中心

SN74LVC244APWR中文资料

11G NhomakorabeaD 2A1
TA –40°C to 85°C
–40°C to 125°C
ORDERING INFORMATION
PACKAGE (1)
ORDERABLE PART NUMBER
QFN – RGY
Reel of 1000
SN74LVC244ARGYR
VFBGA – GQN Reel of 1000
Copyright © 1992–2005, Texas Instruments Incorporated
元器件交易网
SN74LVC244A OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS
SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005
at VCC = 3.3 V, TA = 25°C • Typical VOHV (Output VOH Undershoot) > 2 V
at VCC = 3.3 V, TA = 25°C • Supports Mixed-Mode Signal Operation on All
Ports (5-V Input/Output Voltage With 3.3-V VCC) • Ioff Supports Partial-Power-Down Mode Operation • Latch-Up Performance Exceeds 250 mA Per JESD 17 • ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A)
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

IN74ACT244中文资料

O CTAL 3-S TATE N ONINVERTINGB UFFER/L INE D RIVER/L INE R ECEIVERHigh-Speed Silicon-Gate CMOS The IN74ACT244 is identical in pinout to the LS/ALS244, HC/HCT244. The IN74ACT244 may be used as a level converterfor interfacing TTL or NMOS outputs to High Speed CMOSinputs.designed to be used with 3-state memory address drivers, clocknoninverting outputs and two active-low output enables.•TTL/NMOS Compatible Input Levels•Outputs Directly Interface to CMOS, NMOS, and TTL•Operating Voltage Range: 4.5 to 5.5 V •Low Input Current: 1.0 µA; 0.1 µA @ 25°C •Outputs Source/Sink 24 mAORDERING INFORMATIONIN74ACT244N PlasticIN74ACT244DW SOICT A = -40° to 85° C for allpackagesFUNCTION TABLEInputs Outputs Enable A,Enable BA,B YA,YBL L LL H HH X ZX=don’t careZ = high impedanceLOGIC DIAGRAMPIN 20=V CCPIN 10 = GNDPIN ASSIGNMENTMAXIMUM RATINGS*Symbol Parameter ValueUnit V CC DC Supply Voltage (Referenced to GND) -0.5 to +7.0 VV IN DC Input Voltage (Referenced to GND) -0.5 to V CC +0.5 VV OUT DC Output Voltage (Referenced to GND) -0.5 to V CC +0.5 VI IN DC Input Current, per Pin ±20 mAI OUT DC Output Sink/Source Current, per Pin ±50 mAI CC DC Supply Current, V CC and GND Pins ±50 mAP D Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ 750500mWTstg Storage Temperature -65 to +150 °CT L Lead Temperature, 1 mm from Case for 10Seconds(Plastic DIP or SOIC Package)260 °C*Maximum Ratings are those values beyond which damage to the device may occur.Functional operation should be restricted to the Recommended Operating Conditions.+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°CSOIC Package: - 7 mW/°C from 65° to 125°CRECOMMENDED OPERATING CONDITIONSSymbol Parameter MinMaxUnit V CC DC Supply Voltage (Referenced to GND) 4.5 5.5 VV IN, V OUT DC Input Voltage, Output Voltage (Referenced toGND)0 V CC VT J Junction Temperature (PDIP) 140 °CT A Operating Temperature, All Package Types -40 +85 °CI OH Output Current - High -24 mAI OL Output Current - Low 24 mAt r, t f Input Rise and Fall Time * (except Schmitt Inputs) V CC=4.5 VV CC =5.5 V108.0ns/V* VINfrom 0.8 V to 2.0 VThis device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, V IN and V OUT should be constrained to the range GND≤(V IN or V OUT)≤V CC.Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or V CC). Unused outputs must be left open.DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)V CC Guaranteed LimitsSymbol Parameter Test Conditions V 25 °C -40°C to85°CUnit V IH Minimum High-Level Input VoltageV OUT = V CC -0.1 V 4.5 5.5 2.0 2.0 2.0 2.0 VV IL Maximum Low -Level Input VoltageV OUT =0.1 V 4.5 5.5 0.8 0.8 0.8 0.8 VV OH Minimum High-Level Output VoltageI OUT ≤ -50 µA 4.5 5.5 4.4 5.4 4.4 5.4 V*V IN =V IHI OH =-24 mAI OH =-24 mA4.55.5 3.86 4.86 3.76 4.76 V OL Maximum Low-Level Output VoltageI OUT ≤ 50 µA 4.5 5.5 0.1 0.1 0.1 0.1 V*V IN =V ILI OL =24 mAI OL =24 mA4.55.5 0.36 0.36 0.44 0.44 I IN Maximum Input Leakage CurrentV IN =V CC or GND 5.5 ±0.1 ±1.0 µAI OZ Maximum Three-State Leakage Current V IN (OE)=V IL or V IH V IN =V CC or GND V OUT =V CC or GND5.5 ±0.5 ±5.0 µA∆I CCT Additional MaxI CC /InputV IN =V CC - 2.1 V 5.5 1.5 mA I OLD +Minimum Dynamic Output CurrentV OLD =1.65 V Max 5.5 75 mAI OHD +Minimum Dynamic Output CurrentV OHD =3.85 V Min 5.5 -75 mAI CC Maximum Quiescent Supply Current(per Package)V IN =V CC or GND 5.5 8.0 80 µAAll outputs loaded; thresholds on input associated with output under test. +Maximum test duration 2.0 ms, one output loaded at a time.AC ELECTRICAL CHARACTERISTICS(V CC=5.0 V ± 10%, C L=50pF,Input t r=t f=3.0 ns)LimitsGuaranteedUnitSymbol Parameter 25 °C -40°C to85°CMax MinMaxMin t PLH Propagation Delay, A to YA or B to YB2.0 9.0 1.5 10.0 ns(Figure 1)2.0 9.0 1.5 10.0 nst PHL Propagation Delay, A to YA or B to YB(Figure 1)1.5 8.5 1.0 9.5 nst PZH Propagation Delay, Output Enable to YAor YB (Figure 2)t PZL Propagation Delay, Output Enable to YA2.0 9.5 1.5 10.5 nsor YB (Figure 2)2.0 9.5 1.5 10.5 nst PHZ Propagation Delay, Output Enable to YAor YB (Figure 2)2.5 10.0 2.0 10.5 nst PLZ Propagation Delay, Output Enable to YAor YB (Figure 2)C IN Maximum Input Capacitance 4.5 4.5 pFTypical @25°C,V CC=5.0VC PD Power Dissipation Capacitance 45 pFFigure 1. Switching Waveforms Figure 2. Switching Waveforms。

74act244t工作原理

74ACT244T工作原理1.简介本文将介绍74A CT244T芯片的工作原理。

74A CT244T是一种高速C M OS（互补金属氧化物半导体）非反相缓冲器/放大器，具有广泛的应用领域。

我们将深入探讨其内部构造和工作原理，以帮助读者更好地了解该芯片的功能和性能。

2.构造和功能74AC T244T芯片由多个逻辑门组成，包括六个非反相缓冲器。

每个缓冲器都能够接受输入信号并输出被放大的信号。

该芯片还具有使输入信号反相的功能。

通过连接适当的引脚，可以实现不同的逻辑功能，如缓冲、放大、反相等。

3.工作原理3.1输入与输出74AC T244T芯片有多个引脚，其中包括输入引脚（A1-A6）和输出引脚（Y1-Y6）。

输入引脚接受外部信号作为输入，输出引脚将放大后的信号输出到外部电路中。

3.2内部结构该芯片内部包含多个晶体管以及其他电子元件。

这些元件按照特定的布局和连接方式组成非反相缓冲器电路。

布线和电子元件的优化设计使得芯片在高速工作时具有出色的性能。

3.3工作过程当输入信号在某个引脚上发生变化时，该信号将进入对应的非反相缓冲器。

缓冲器通过晶体管的导通和截止来控制信号的放大和传递。

当输入信号为高电平时，输出信号也为高电平；当输入信号为低电平时，输出信号也为低电平。

3.4异常处理在使用74A CT244T芯片时，需要注意输入信号的幅值和频率范围，以确保芯片正常工作。

当输入信号超出芯片的额定范围时，可能会导致输出信号不准确或不稳定。

此外，芯片的供电电压也应符合规定，以确保其正常运行。

4.应用领域74AC T244T芯片广泛应用于数字电路设计和通信系统中。

它可用于信号放大、缓冲、逻辑电平转换等功能。

其高速工作和稳定性使其成为许多电子设备中不可或缺的部分，如计算机、通信设备、显示器等。

5.总结通过本文的介绍，我们了解了74AC T244T芯片的构造和工作原理。

该芯片通过非反相缓冲器实现信号的放大和传递，并具有反相功能。

SN74AHC244DWE4中文资料

PACKAGING INFORMATIONOrderable DeviceStatus (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9678201Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 5962-9678201QRA ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type 5962-9678201QSA ACTIVE CFP W 201TBD A42N /A for Pkg Type 5962-9678201SA ACTIVE CFP W 20TBD Call TI Call TI5962-9678201VRA ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type 5962-9678201VSA ACTIVE CFP W 201TBD A42N /A for Pkg Type SN74AHC244DBLE OBSOLETE SSOP DB 20TBDCall TI Call TISN74AHC244DBR ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DBRE4ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DBRG4ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DGVR ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DGVRE4ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DGVRG4ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DW ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWE4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWG4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWR ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWRE4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWRG4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244N ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74AHC244NE4ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74AHC244NSR ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244NSRE4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244NSRG4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PW ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWE4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWG4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWLEOBSOLETETSSOPPW20TBDCall TICall TI24-Sep-2007Orderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74AHC244PWR ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWRE4ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWRG4ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIMSNJ54AHC244FK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type SNJ54AHC244J ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type SNJ54AHC244WACTIVECFPW201TBDA42N /A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--TheMoisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.24-Sep-2007TAPE AND REEL BOXINFORMATIONDevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74AHC244DBR DB 20SITE 41330168.27.5 2.51216Q1SN74AHC244DGVR DGV 20SITE 41330127.0 5.6 1.6812Q1SN74AHC244DWR DW 20SITE 413302410.813.0 2.71224Q1SN74AHC244NSR NS 20SITE 41330248.213.0 2.51224Q1SN74AHC244PWRPW20SITE 41330166.957.11.6816Q122-Sep-2007DevicePackage Pins Site Length (mm)Width (mm)Height (mm)SN74AHC244DBR DB 20SITE 41346.0346.00.0SN74AHC244DGVR DGV 20SITE 41346.0346.00.0SN74AHC244DWR DW 20SITE 41346.0346.00.0SN74AHC244NSR NS 20SITE 41346.0346.00.0SN74AHC244PWRPW20SITE 41346.0346.00.022-Sep-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. 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Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityRFID Telephony /telephonyLow Power /lpw Video&Imaging /videoWirelessWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments Incorporated。

ACS244MS中文资料

1CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.1-888-INTERSIL or 321-724-7143|Copyright © Intersil Corporation 1999March 1998ACS244MSRadiation Hardened Non-Inverting,Octal, Three-State Buffer/Line DriverFeatures•QML Qualiﬁed Per MIL-PRF-38535 Requirements • 1.25Micron Radiation Hardened SOS CMOS•Radiation Environment-Latch-up Free Under any Conditions-Total Dose. . . . . . . . . . . . . . . . . . . . . .3 x 105RAD(Si)-SEU Immunity. . . . . . . . . . .<1 x 10-10 Errors/Bit/Day -SEU LET Threshold . . . . . . . . . . .>100MeV/(mg/cm 2)•Input Logic Levels .V IL = (0.3V)(V CC ), V IH = (0.7V)(V CC )•Output Current. . . . . . . . . . . . . . . . . . . . . . . . . . .±16mA •Quiescent Supply Current. . . . . . . . . . . . . . . . . . . .20µA •Propagation Delay . . . . . . . . . . . . . . . . . . . . . . . . .9.0nsApplications•Databus Driving •Data Routing•Redundant Data Control CircuitryDescriptionThe Radiation Hardened ACS244MS is a Non-Inverting,Octal, Three-State Buffer/Line Driver with two active-LOW Enable inputs (AE and BE). Each Enable input controls four outputs. When an Enable input is LOW, the corresponding outputs are active. A HIGH on an Enable input causes the corresponding outputs to be high impedance, regardless of the input levels.The ACS244MS is fabricated on a CMOS Silicon on Sap-phire (SOS) process, which provides an immunity to Single Event Latch-up and the capability of highly reliable perfor-mance in any radiation environment. These devices offer signiﬁcant power reduction and faster performance when compared to ALSTTL types.Speciﬁcations for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed below must be used when ordering.Detailed Electrical Speciﬁcations for the ACS244 are contained in SMD 5962-98541. A “hot-link” is provided on our homepage with instructions for downloading./data/sm/index.htmOrdering InformationPinoutsACS244 (SBDIP)TOP VIEWACS244 (FLATPACK)TOP VIEWSMD PART NUMBER INTERSIL PART NUMBER TEMP. RANGE (o C)PACKAGE CASE OUTLINE 5962F9854101VRC ACS244DMSR-02-55 to 12520 Ld SBDIP CDIP2-T20N/AACS244D/Sample-022520 Ld SBDIP CDIP2-T205962F9854101VXC ACS244KMSR-02-55 to 12520 Ld Flatpack CDFP4-F20N/A ACS244K/Sample-022520 Ld Flatpack CDFP4-F20N/AACS244HMSR-0225DieN/A1112131415161718201910987654321AE AI1BO4AI2BO3AI3AI4BO2BO1GND V CC AO1BI4AO2BE BI3AO3BI2AO4BI12345678120191817161514139101211AE AI1BO4AI2BO3AI3AI4BO2BO1GNDV CC AO1BI4AO2BE BI3AO3BI2AO4BI1File Number44792All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certiﬁcation.Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or speciﬁcations at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.For information regarding Intersil Corporation and its products, see web site Sales Ofﬁce HeadquartersNORTH AMERICA Intersil CorporationP. O. Box 883, Mail Stop 53-204Melbourne, FL 32902TEL:(321) 724-7000FAX: (321) 724-7240EUROPE Intersil SAMercure Center100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111FAX: (32) 2.724.22.05ASIAIntersil (Taiwan) Ltd.Taiwan Limited7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of ChinaTEL: (886) 2 2716 9310FAX: (886) 2 2715 3029Die CharacteristicsDIE DIMENSIONS:Size:2540µm x 2540µm (100 mils x 100mils)Thickness:525µm ±25µm (20.6 mils ±1 mil)Bond Pad: 110µm x 110µm (4.3 x 4.3 mils)METALLIZATION:AlMetal 1 Thickness: 0.7µm ±0.1µm Metal 2 Thickness: 1.0µm ±0.1µm SUBSTRATE POTENTIAL:Unbiased InsulatorPASSIVATIONType: Phosphorous Silicon Glass (PSG)Thickness: 1.30µm ±0.15µm SPECIAL INSTRUCTIONS:Bond V CC FirstADDITIONAL INFORMATION:Worst Case Density:<2.0 x 105 A/cm 2Transistor Count:214Metallization Mask LayoutACS244MSBO4 (3)AI2 (4)BO3 (5)AI3 (6)BO2 (7)AI4 (8)V CC BO1 (9)AO4 (12)(13)BI2(14)AO3(15)BI3(16)AO2(17)BI4(18)AO1(20)V CC (20)AE (1)AI1(2)BE (19)(11)BI1(10)GND (10)GND ACS244MS。

HD74BC244A中文资料

HD74BC244AOctal Buffers/Line Drivers With 3 State OutputsADE-205-007A (Z)2nd. EditionMarch 1993 DescriptionThe HD74BC244A provides high drivability and operation equal to or better than high speed bipolar standard logic IC by using Bi-CMOS process. The device features low power dissipation that is about 1/5 of high speed bipolar logic IC, when the frequency is 10 MHz. The device has eight inverter drivers with three state outputs in a 20 pin package. This device is a non inverting buffer and has two active low enables (1G and 2G). Each enable independently controls 4 buffers.Features• Input/Output are at high impedance state when power supply is off.• Built in input pull up circuit can make input pins be open, when not used.• TTL level input• Wide operating temperature rangeTa = –40 to + 85°CFunction TableInputsG A Output YH X ZL H HL L LH:High levelL:Low levelX:ImmaterialZ:High impedanceHD74BC244A2Pin ArrangementAbsolute Maximum RatingsItemSymbol Rating Unit Supply voltage V CC –0.5 to +7.0V Input diode current I IK ±30mA Input voltage V IN –0.5 to +7.5V Output voltage V OUT –0.5 to +7.5V Off state output voltage V OUT(off)–0.5 to +5.5V Storage temperature Tstg–65 to +150°CNote:1.The absolute maximum ratings are values which must not individually be exceeded, andfurthermore, no two of which may be realized at the same time.HD74BC244A3Recommended Operating ConditionsItemSymbol Min Typ Max Unit Supply voltage V CC 4.5 5.0 5.5V Input voltage V IN 0—V CC V Output voltage V OUT 0—V CC V Operating temperature Topr –40—85°C Input rise/fall time*1t r , t f—8ns/VNote:1.This item guarantees maximum limit when one input switches.Waveform: Refer to test circuit of switching characteristics.Logic DiagramHD74BC244A4Electrical Characteristics (Ta = –40°C to +85°C)Item Symbol V CC (V)Min Max Unit Test ConditionsInput voltage V IH 2.0—V V IL —0.8V Output voltageV OH 4.5 2.4—V I OH = –3 mA 4.5 2.0—V I OH = –15 mA V OL4.5—0.5V I OL = 48 mA 4.5—0.55V I OL = 64 mA Input diode voltage V IK 4.5—–1.2V I IN = –18 mA Input currentI I5.5—–250µA V IN = 0 V 5.5— 1.0µA V IN = 5.5 V 5.5—100µA V IN = 7.0 V Short circuit output current*1I OS 5.5–100–225mA V IN = 0 or 5.5 V Off state output current I OZH 5.5—50µA V O = 2.7 V I OZL 5.5—–50µA V O = 0.5 V Supply currentI CCL 5.5—29.5mA V IN = 0 or 5.5 V All outputs is “L”I CCH 5.5—0.5mA V IN = 0 or 5.5 V All outputs is “H”I CCZ 5.5— 2.5mA V IN = 0 or 5.5 V All outputs is “Z”I CCT *25.5—1.5mAV IN = 3.4 or 0.5 V Notes :1.Not more than one output should be shorted at a time and duration of the short circuit should notexceed one second.2.When input by the TTL level, it shows I CC increase at per one input pin.HD74BC244A5Switching Test Method (C L = 50 pF)Ta = 25°C V CC = 5.0 VTa = –40 to 85°C V CC = 5.0 V ±10%ItemSymbol Min Max Min Max Unit Test Conditions Propagation delay time t PLH 3.0 6.0 3.07.0nsSee under figuret PHL 3.0 6.0 3.07.0Output enable time t ZH 3.08.0 3.010.0ns t ZL 3.08.0 3.010.0Output disable time t HZ 3.07.0 3.09.0ns t LZ 3.07.03.09.0Input capacitanse C IN 3.0(Typ)—pF V IN = V CC or GND Output capacitanceC O15.0(Typ)—pFV O = V CC or GNDTest CircuitHD74BC244A Waveforms-1Waveforms-26HD74BC244A Package DimensionsUnit: mm7Cautions1.Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,copyright, trademark, or other intellectual property rights for information contained in this document.Hitachi bears no responsibility for problems that may arise with third party’s rights, includingintellectual property rights, in connection with use of the information contained in this document.2.Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.3.Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,traffic, safety equipment or medical equipment for life support.4.Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installationconditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.5.This product is not designed to be radiation resistant.6.No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.7.Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.Hitachi, Ltd.Semiconductor & Integrated Circuits.Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.Hitachi Asia Pte. Ltd.16 Collyer Quay #20-00Hitachi TowerSingapore 049318Tel: 535-2100Fax: 535-1533URLNorthAmerica : http:/Europe : /hel/ecg Asia (Singapore): .sg/grp3/sicd/index.htm Asia (Taiwan): /E/Product/SICD_Frame.htm Asia (HongKong): /eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htmHitachi Asia Ltd.Taipei Branch Office3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105)Tel: <886> (2) 2718-3666Fax: <886> (2) 2718-8180Hitachi Asia (Hong Kong) Ltd.Group III (Electronic Components)7/F., North Tower, World Finance Centre,Harbour City, Canton Road, Tsim Sha Tsui,Kowloon, Hong Kong Tel: <852> (2) 735 9218Fax: <852> (2) 730 0281 Telex: 40815 HITEC HXHitachi Europe Ltd.Electronic Components Group.Whitebrook ParkLower Cookham Road MaidenheadBerkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000Fax: <44> (1628) 778322Hitachi Europe GmbHElectronic components Group Dornacher Stra§e 3D-85622 Feldkirchen, Munich GermanyTel: <49> (89) 9 9180-0Fax: <49> (89) 9 29 30 00Hitachi Semiconductor (America) Inc.179 East Tasman Drive,San Jose,CA 95134 Tel: <1> (408) 433-1990Fax: <1>(408) 433-0223For further information write to:。

74HC244中文资料

54/74LS244三态八缓冲器/线驱动器/线接收器(3S,两组控制)简要说明:244为三态输出的八组缓冲器和总线驱动器,其主要电器特性的典型值如下(不同厂家具体值有差别):型号t PLH t phl P D54LS241/74LS241 12ns 12ns 110mW引出端符号:1A1~1A4,2A1~2A4 输入端/1G, /2G 三态允许端(低电平有效)1Y1~1Y4,2Y1~2Y4 输出端逻辑图:双列直插封装极限值:电源电压 (7V)输入电压…………………………………………. 5.5V输出高阻态时高电平电压…………………………. 5.5V工作环境温度54XXX …………………………………. -55~125℃74XXX …………………………………. 0~70℃存储温度…………………………………………. -65~150℃功能表:推荐工作条件:54LS244/74LS244单位最小额定最大电源电压Vcc 54 4.5 5 5.5V 74 4.75 5 5.25输入高电平电V iH 2 V输入低电平电V iL 54 0.7V 74 0.8输出高电平电流I OH 54 -12mA 74 -15输出低电平电流I OL 54 12mA 74 24动态特性(T A=25℃)参数测试条件LS244单位最大t PLH输出由低到高传输延迟时间Vcc =5VC L=45pFR L=667 Ω18 nst PHL输出由高到低传输延迟时间18 ns t PZH输出由高阻态到高允许时间23 ns t PZL输出由高阻态到低允许时间30 nst PHZ输出由高到高阻态禁止时间Vcc=5V C L=5pFR L=90 Ω18 nst PLZ输出由低到高阻态禁止时间25 ns 静态特性（TA为工作环境温度范围）参数测试条件【1】LS244单位最小最大V IK输入嵌位电压Vcc=最小，I ik=-18mA -1.5 V △V T滞后电压Vcc＝最小0.2 VV OH输出高电平电压Vcc＝最小，V IL＝最大，V IH=2V,I OH＝－3mA2.4 VV OL输出低电平电压Vcc=最小，V IL＝最大， I OL=最大54 0.4V74 0.5I I最大输入电压时输出电流Vcc＝最大，V I=7V 0.1 mA I IH输入高电平电流Vcc＝最大，VIH=2.7V 20 uA I IL输入低电平电流1A,2A Vcc＝最大，V IL=0.4V -0.2 mA I OS输出短路电流Vcc＝最大-40 -225 mAI OZH输出高阻态时高电平电流Vcc＝最大，V IH=2VV IL=最大，V O=2.7V20 uAI OZL输出高阻态时低电平电流Vcc＝最大，V IH=2V,V IL＝最大，V O=0.4V-20 uAIcc电源电流Vcc＝最大1Y,2Y均为高电平27mA 1Y,2Y均为低电平461Y,2Y均为高阻态54[1]: 测试条件中的“最小”和“最大”用推荐工作条件中的相应值。

74AC244_01中文资料

1/9April 2001s HIGH SPEED: t PD = 3.8ns (TYP.) at V CC = 5V sLOW POWER DISSIPATION:I CC = 4µA(MAX.) at T A =25°C sHIGH NOISE IMMUNITY:V NIH = V NIL = 28 % V CC (MIN.)s50Ω TRANSMISSION LINE DRIVING CAPABILITYsSYMMETRICAL OUTPUT IMPEDANCE:|I OH | = I OL = 24mA (MIN)sBALANCED PROPAGATION DELAYS:t PLH ≅ t PHLsOPERATING VOLTAGE RANGE:V CC (OPR) = 2V to 6VsPIN AND FUNCTION COMPATIBLE WITH 74 SERIES 244sIMPROVED LATCH-UP IMMUNITYDESCRIPTIONThe 74AC244 is an advanced high-speed CMOS OCTAL BUS BUFFER (3-STATE) fabricated with sub-micron silicon gate and double-layer metal wiring C 2MOS tecnology.The G input controls four BUS BUFFERs.This device is designed to be used with 3 state memory address drivers, etc.All inputs and outputs are equipped with protection circuits against static discharge, giving them 2KV ESD immunity and transient excess voltage.74AC244OCTAL BUS BUFFERWITH 3 STATE OUTPUTS (NON INVERTED)PIN CONNECTION AND IEC LOGIC SYMBOLSORDER CODESPACKAGE TUBE T & R DIP 74AC244B SOP 74AC244M74AC244MTR TSSOP74AC244TTR74AC2442/9INPUT AND OUTPUT EQUIVALENT CIRCUITPIN DESCRIPTIONTRUTH TABLEX : Don’t CareZ : High ImpedanceABSOLUTE MAXIMUM RATINGSAbsolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is not implied.RECOMMENDED OPERATING CONDITIONS1) V IN from 30% to 70% of V CCPIN No SYMBOL NAME AND FUNCTION 11G Output Enable Input 2, 4, 6, 81A1 to 1A4Data Inputs 9, 7, 5, 32Y1 to 2Y4Data Outputs 11, 13, 15,172A1 to 2A4Data Inputs 18, 16, 14,121Y1 to 1Y4Data Outputs192G Output Enable Input 10GND Ground (0V)20V CCPositive Supply VoltageINPUTSOUTPUTG An Yn L L L L H H HXZSymbol ParameterValue Unit V CC Supply Voltage -0.5 to +7V V I DC Input Voltage -0.5 to V CC + 0.5V V O DC Output Voltage -0.5 to V CC + 0.5V I IK DC Input Diode Current ± 20mA I OK DC Output Diode Current ± 20mA I ODC Output Current± 50mA I CC or I GND DC V CC or Ground Current± 400mA T stg Storage Temperature-65 to +150°C T LLead Temperature (10 sec)300°CSymbol ParameterValue Unit V CC Supply Voltage 2 to 6V V I Input Voltage 0 to V CC V V O Output Voltage 0 to V CC V T op Operating Temperqture-55 to 125°C dt/dvInput Rise and Fall Time V CC = 3.0, 4.5 or 5.5V (note 1)8ns/V74AC2443/9DC SPECIFICATIONS1) Maximum test duration 2ms, one output loaded at time2) Incident wave switching is guaranteed on transmission lines with impedances as low as 50ΩSymbolParameterTest ConditionValue UnitV CC (V)T A = 25°C -40 to 85°C -55 to 125°C Min.Typ.Max.Min.Max.Min.Max.V IHHigh Level Input Voltage3.0V O = 0.1 V or V CC -0.1V 2.1 1.5 2.1 2.1V4.5 3.15 2.25 3.15 3.155.5 3.852.753.853.85V ILLow Level Input Voltage3.0V O = 0.1 V or V CC -0.1V 1.50.90.90.9V4.5 2.25 1.35 1.35 1.355.5 2.75 1.651.651.65V OHHigh Level Output Voltage3.0I O =-50 µA 2.9 2.99 2.9 2.9V4.5I O =-50 µA 4.4 4.49 4.4 4.45.5I O =-50 µA 5.4 5.495.4 5.43.0I O =-12 mA 2.56 2.46 2.44.5I O =-24 mA 3.86 3.76 3.75.5I O =-24 mA 4.864.764.7V OLLow Level Output Voltage3.0I O =50 µA 0.0020.10.10.1V4.5I O =50 µA 0.0010.10.10.15.5I O =50 µA 0.0010.10.10.13.0I O =12 mA 0.360.440.54.5I O =24 mA 0.360.440.55.5I O =24 mA 0.360.440.5I I Input Leakage Current5.5V I = V CC or GND ± 0.1± 1± 1µA IozHigh Impedance Output Leakage Current5.5V I = V IH or V IL V O = V CC or GND ± 0.5± 2.5± 5µA I CC Quiescent Supply Current5.5V I = V CC or GND 44080µA I OLD Dynamic Output Current (note 1, 2)5.5V OLD = 1.65 V max 7550mA I OHDV OHD = 3.85 V min-75-50mA74AC2444/9AC ELECTRICAL CHARACTERISTICS (C L = 50 pF, R L = 500 Ω, Input t r = t f = 3ns)(*) Voltage range is 3.3V ± 0.3V (**) Voltage range is 5.0V ± 0.5VCAPACITIVE CHARACTERISTICSPD load. (Refer to Test Circuit). Average operating current can be obtained by the following equation. I CC(opr) = C PD x V CC x f IN + I CC /8 (per circuit)TEST CIRCUITC L = 50pF or equivalent (includes jig and probe capacitance)R L = R 1 = 500Ω or equivalentR T = Z OUT of pulse generator (typically 50Ω)SymbolParameterTest ConditionValueUnitV CC (V)T A = 25°C -40 to 85°C -55 to 125°C Min.Typ.Max.Min.Max.Min.Max.t PLH t PHL Propagation DelayTime 3.3(*) 1.5 5.29.0 1.510.0 1.512.5ns 5.0(**)1.5 3.87.0 1.57.5 1.59.5t PZL t PZH Output EnableTime 3.3(*) 1.5 6.110.5 1.511.0 1.513.0ns 5.0(**) 1.5 4.28.0 1.58.5 1.510.5t PLZ t PHZ Output DisableTime3.3(*) 1.5 6.810.5 1.511.5 1.513.0ns 5.0(**)1.55.49.01.59.51.511.0SymbolParameterTest ConditionValue UnitV CC (V)T A = 25°C -40 to 85°C -55 to 125°C Min.Typ.Max.Min.Max.Min.Max.C IN Input Capacitance 5.04pF C OUT OutputCapacitance5.08pF C PDPower Dissipation Capacitance (note 1)5.0f IN = 10MHz21pFTESTSWITCH t PLH , t PHL Open t PZL , t PLZ 2V CC t PZH , t PHZOpen74AC2445/9WAVEFORM 1: PROPAGATION DELAYS (f=1MHz; 50% duty cycle)WAVEFORM 2: OUTPUT ENABLE AND DISABLE TIME(f=1MHz; 50% duty cycle)74AC244 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.© The ST logo is a registered trademark of STMicroelectronics© 2001 STMicroelectronics - Printed in Italy - All Rights ReservedSTMicroelectronics GROUP OF COMPANIESAustralia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - MoroccoSingapore - Spain - Sweden - Switzerland - United Kingdom© 9/9。

74ALS244AN中文资料

元器件交易网DIP20:plastic dual in-line package; 20 leads (300 mil)SOT146-1SO20:plastic small outline package; 20 leads; body width 7.5 mm SOT163-1SSOP20:plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.This data sheet contains preliminary data, and supplementary data will be published at a later date. PhilipsSemiconductors reserves the right to make changes at any time without notice in order to improve designand supply the best possible product.Philips Semiconductors811 East Arques AvenueP .O. Box 3409Sunnyvale, California 94088–3409Telephone 800-234-7381DEFINITIONSData Sheet IdentificationProduct Status Definition Objective Specification Preliminary Specification Product Specification Formative or in Design Preproduction Product Full ProductionThis data sheet contains the design target or goal specifications for product development. Specificationsmay change in any manner without notice.This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changesat any time without notice, in order to improve design and supply the best possible product.© Copyright Philips Electronics North America Corporation 1997All rights reserved. Printed in U.S.A.。

SN74AHC244PWG4中文资料

PACKAGING INFORMATIONOrderable DeviceStatus (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9678201Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 5962-9678201QRA ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type 5962-9678201QSA ACTIVE CFP W 201TBD A42N /A for Pkg Type 5962-9678201SA ACTIVE CFP W 20TBD Call TI Call TI5962-9678201VRA ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type 5962-9678201VSA ACTIVE CFP W 201TBD A42N /A for Pkg Type SN74AHC244DBLE OBSOLETE SSOP DB 20TBDCall TI Call TISN74AHC244DBR ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DBRE4ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DBRG4ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DGVR ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DGVRE4ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DGVRG4ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DW ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWE4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWG4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWR ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWRE4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWRG4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244N ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74AHC244NE4ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74AHC244NSR ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244NSRE4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244NSRG4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PW ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWE4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWG4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWLEOBSOLETETSSOPPW20TBDCall TICall TI24-Sep-2007Orderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74AHC244PWR ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWRE4ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWRG4ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIMSNJ54AHC244FK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type SNJ54AHC244J ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type SNJ54AHC244WACTIVECFPW201TBDA42N /A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--TheMoisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.24-Sep-2007TAPE AND REEL BOXINFORMATIONDevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74AHC244DBR DB 20SITE 41330168.27.5 2.51216Q1SN74AHC244DGVR DGV 20SITE 41330127.0 5.6 1.6812Q1SN74AHC244DWR DW 20SITE 413302410.813.0 2.71224Q1SN74AHC244NSR NS 20SITE 41330248.213.0 2.51224Q1SN74AHC244PWRPW20SITE 41330166.957.11.6816Q122-Sep-2007DevicePackage Pins Site Length (mm)Width (mm)Height (mm)SN74AHC244DBR DB 20SITE 41346.0346.00.0SN74AHC244DGVR DGV 20SITE 41346.0346.00.0SN74AHC244DWR DW 20SITE 41346.0346.00.0SN74AHC244NSR NS 20SITE 41346.0346.00.0SN74AHC244PWRPW20SITE 41346.0346.00.022-Sep-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityRFID Telephony /telephonyLow Power /lpw Video&Imaging /videoWirelessWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments Incorporated。

SN74LVC244A资料

FEATURES
• Operates From 1.65 V to 3.6 V • Inputs Accept Voltages to 5.5 V • Specified From –40°C to 85°C and –40°C to
125°C • Max tpd of 5.9 ns at 3.3 V • Typical VOLP (Output Ground Bounce) < 0.8 V
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data s applied to any output in the high or low state(2)(3)
IIK Input clamp current
VI < 0
IOK Output clamp current
VO < 0
IO Continuous output current
19 2OE
18 1Y1
2A1 11
9 2Y1
1A2 4
16 1Y2
2A2 13
7 2Y2
1A3 6
14 1Y3
2A3 15
5 2Y3
1A4 8
12 1Y4
2A4 17
Pin numbers shown are for the DB, DGV, DW, N, NS, PW, and RGY packages.

74als244

74ls244百科名片74LS244为3态8位缓冲器，一般用作总线驱动器。

74LS244没有锁存的功能。

地址锁存器就是一个暂存器，它根据控制信号的状态，将总线上地址代码暂存起来。

8086/8088数据和地址总线采用分时复用操作方法，即用同一总线既传输数据又传输地址。

当微处理器与存储器交换信号时，首先由CPU发出存储器地址，同时发出允许锁存信号ALE给锁存器，当锁存器接到该信号后将地址/数据总线上的地址锁存在总线上，随后才能传输数据。

74ls244图例锁存器是一个很普通的时序电路。

一般的，它在时钟上升沿或者下降沿来的时候锁存输入，然后产生输出，在其他的时候输出都不跟随输入变化，这就是所谓边缘触发的D触发器。

当然也有电平触发的D触发器，具体使用哪种，得看你使用得总线配置。

通常用作单片机的地址锁存器的芯片有74LS373、8282、74LS273、74HC373等。

74ls24474LS373和8282是带三态输出的8位锁存器，它们的结构和用法类似。

以74LS373为例，共有8个输入端D1—D8及8个输出端Q1—Q8。

当三态端OE为有效低电平，74LS373的G端为输人选通端，使能端G为有效高电平时，输出跟随输入变化；当G＝1时，锁存器处于透明工作状态，即锁存器的输出状态随数据端的变化而变化，即脚1=Di(I=1，2，…，8)。

当G端由1变0时，数据被锁存起来，此时输出端Qi不再随输入端的变化而变化，而一直保持锁存前的值不变。

G端(或STB端)可直接与单片机的锁存控制信号端ALE相连，在ALE的下降沿进行地址锁存。

74ls244引角布局只要根据“输入三态，输出锁存”的原则，选择74系列的TTL电路或MOS电路就能组成简单的扩展电路，如74LS244、74LS273、74LS373、74LS377等芯片都能组成输入、输出接口。

它主要用于三态输出，作为地址驱动器，时钟驱动器和总线驱动器，定向发送器等。

其真值表如下：74Ls244真值表输入输出！G A TL H HL L LH X Z74Ls244技术参数最小典型最大VCC 4.25V 5V 5.25V高电平输出电流-15m A低电平输出电流24m A工作温度0 70。

SN74ACT244PW中文资料

元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。

SN74ACT244PWR

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-8776001M2A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-8776001MRA ACTIVE CDIP J201TBD A42N/A for Pkg Type 5962-8776001MSA ACTIVE CFP W201TBD Call TI N/A for Pkg Type 5962-8776001SRA ACTIVE CDIP J201TBD A42N/A for Pkg Type 5962-8776001SSA ACTIVE CFP W201TBD Call TI N/A for Pkg Type SN74ACT244DBLE OBSOLETE SSOP DB20TBD Call TI Call TISN74ACT244DBR ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244DBRE4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244DBRG4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244DWG4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244DWRG4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN74ACT244NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN74ACT244NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244NSRG4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244PW ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244PWE4ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244PWG4ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ACT244PWLE OBSOLETE TSSOP PW20TBD Call TI Call TISN74ACT244PWR ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244PWRE4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244PWRG4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54ACT244FK ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type SNJ54ACT244J ACTIVE CDIP J201TBD A42N/A for Pkg Type SNJ54ACT244W ACTIVE CFP W201TBD Call TI N/A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF SN54ACT244,SN54ACT244-SP,SN74ACT244:•Automotive:SN74ACT244-Q1•Enhanced Product:SN74ACT244-EPNOTE:Qualified Version Definitions:•Automotive-Q100devices qualified for high-reliability automotive applications targeting zero defects•Enhanced Product-Supports Defense,Aerospace and Medical ApplicationsTAPE AND REEL INFORMATION*All dimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74ACT244DBR SSOPDB 202000330.016.48.27.5 2.512.016.0Q1SN74ACT244DWR SOICDW 202000330.024.410.813.0 2.712.024.0Q1SN74ACT244NSR SONS 202000330.024.48.213.0 2.512.024.0Q1SN74ACT244PWR TSSOP PW 202000330.016.4 6.957.1 1.68.016.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74ACT244DBR SSOP DB202000346.0346.033.0 SN74ACT244DWR SOIC DW202000346.0346.041.0 SN74ACT244NSR SO NS202000346.0346.041.0 SN74ACT244PWR TSSOP PW202000346.0346.033.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDLP®Products BroadbandDSP Digital ControlClocks and Timers MedicalInterface MilitaryLogic Optical NetworkingPower Mgmt SecurityMicrocontrollers TelephonyRFID Video&ImagingRF/IF and ZigBee®Solutions WirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2009,Texas Instruments Incorporated。

SN74LVC244资料

元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1999, Texas Instruments Incorporated。

74act244scx手册解读

74act244scx手册解读74ACT244SCX是一款集成逻辑芯片，属于TTL（晶体管-晶体管逻辑）系列。

本手册将对其进行详细解读，包括芯片的功能特性、引脚功能、电气特性及应用示例等方面。

首先，让我们来了解一下74ACT244SCX芯片的功能特性。

该芯片是一个具有8个双向缓冲器的三态缓冲器，用于将一个8位数据线的逻辑电平转换为另一个8位数据线的逻辑电平。

这意味着它可以完成数据信号的转发，适用于数码信号的放大、隔离和解耦等应用。

此外，芯片还具有高噪声抵抗能力和可逆的数据传输功能。

接下来，我们来了解一下74ACT244SCX芯片的引脚功能。

该芯片共有20个引脚，包括8个输出端口（Y1-Y8）、8个输入端口（A1-A8）和一个使能端口（G）。

输入端口用于接收输入信号，输出端口用于输出经过处理后的信号，而使能端口用于控制芯片的工作状态。

在三态缓冲器（Tri-State Buffer）的应用中，使能端口（G）非常重要，它可以使输出端口（Y1-Y8）高阻抗（高阻抗状态）。

我们再来了解一下74ACT244SCX芯片的电气特性。

该芯片具有广泛的工作电压范围，可以在2V至6V的电压下正常工作。

其输入电压范围为0V至Vcc，输出电压范围为0V至Vcc，高电平输入电压范围为0.7Vcc至Vcc，低电平输入电压范围为0V至0.3Vcc。

另外，该芯片具有高速操作能力，最大时钟频率可达100MHz，非常适合高速数据传输的应用。

最后，我们来看一些74ACT244SCX芯片的应用示例。

这款芯片广泛应用于各种数据信号传输和处理电路中。

常见的应用场景包括数据总线驱动、数据信号放大、数据隔离、数据解耦等。

此外，由于其高速操作能力和可靠性，还可应用于工业领域的自动化控制系统和通信设备等。

综上所述，74ACT244SCX是一款集成逻辑芯片，具有8个双向缓冲器的三态缓冲器功能。

其引脚功能包括8个输入端口、8个输出端口和1个使能端口。

该芯片具有高噪声抵抗能力、可逆的数据传输功能和广泛的工作电压范围。

74ALVC244中文资料

元器件交易网
INTEGRATED CIRCUITS
DATA SHEET
74ALVC244 Octal buffer/line driver; 3-state
Product speciﬁcation Supersedes data of 2003 Aug 11 2003 Sep 08
元器件交易网
Philips Semiconductors
Product speciﬁcation
Octal buffer/line driver; 3-state
74ALVC244
FEATURES • Wide supply voltage range from 1.65 to 3.6 V • 3.6 V tolerant inputs/outputs • CMOS low power consumption • Direct interface with TTL levels (2.7 to 3.6 V) • Power-down mode • Latch-up performance exceeds 250 mA • Complies with JEDEC standard: JESD8-7 (1.65 to 1.95 V) JESD8-5 (2.3 to 2.7 V) JESD8B/JESD36 (2.7 to 3.6 V) • ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V. QUICK REFERENCE DATA GND = 0 V; Tamb = 25 °C. SYMBOL tPHL/tPLH PARAMETER propagation delay nAn to nYn

74ACT244MTC中文资料

© 2005 Fairchild Semiconductor Corporation DS009943November 1988Revised March 200574AC244 • 74ACT244 Octal Buffer/Line Driver with 3-STATE Outputs74AC244 • 74ACT244Octal Buffer/Line Driver with 3-STATE OutputsGeneral DescriptionThe AC/ACT244 is an octal buffer and line driver designed to be employed as a memory address driver, clock driver and bus-oriented transmitter/receiver which provides improved PC board density.Featuress I CC and I OZ reduced by 50%s 3-STATE outputs drive bus lines or buffer memory address registers s Outputs source/sink 24 mA s ACT244 has TTL-compatible inputsOrdering Code:Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.Pb-Free package per JEDEC J-STD-020B.Note 1: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Please use order number as indicated.FACT ¥ is a trademark of Fairchild Semiconductor Corporation.Order Number Package Package DescriptionNumber 74AC244SC M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 74AC244SCX_NL (Note 1)M20B Pb-Free 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 74AC244SJ M20D Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide74AC244MTC MTC2020-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 74AC244MTCX_NL (Note 1)MTC20Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide74AC244PC N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide 74ACT244SC M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 74ACT244SCX_NL (Note 1)M20B Pb-Free 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 74ACT244SJ M20D Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74ACT244MSA MSA2020-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide 74ACT244MTC MTC2020-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 74ACT244MTCX_NL (Note 1)MTC20Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide74ACT244PCN20A20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide 274A C 244 • 74A C T 244Logic SymbolIEEE/IECConnection DiagramPin DescriptionsTruth TablesX ImmaterialZ High ImpedancePin Names DescriptionOE 1, OE 23-STATE Output Enable InputsI 0–I 7Inputs O 0–O 7OutputsInputs OutputsOE 1I n (Pins 12, 14, 16, 18)L L L L H H HXZ Inputs OutputsOE 2I n (Pins 3, 5, 7, 9)L L L L H H HXZ74AC244 • 74ACT244Absolute Maximum Ratings (Note 2)Recommended Operating ConditionsNote 2: Absolute maximum ratings are those values beyond which damage to the device may occur. The databook specifications should be met, with-out exception, to ensure that the system design is reliable over its power supply, temperature, and output/input loading variables. Fairchild does not recommend operation of FACT ¥ circuits outside databook specifications.DC Electrical Characteristics for ACNote 3: All outputs loaded; thresholds on input associated with output under test.Note 4: Maximum test duration 2.0 ms, one output loaded at a time.Note 5: I IN and I CC @ 3.0V are guaranteed to be less than or equal to the respective limit @ 5.5V V CC .Supply Voltage (V CC ) 0.5V to 7.0VDC Input Diode Current (I IK )V I 0.5V 20 mA V I V CC 0.5V 20 mADC Input Voltage (V I )0.5V to V CC 0.5VDC Output Diode Current (I OK )V O 0.5V 20 mA V O V CC 0.5V 20 mADC Output Voltage (V O ) 0.5V to V CC 0.5VDC Output Source or Sink Current (I O )r 50 mA DC V CC or Ground Current per Output Pin (I CC or I GND )r 50 mAStorage Temperature (T STG ) 65q C to 150q CJunction Temperature (T J )PDIP140q CSupply Voltage (V CC )AC 2.0V to 6.0V ACT4.5V to5.5V Input Voltage (V I )0V toV CC Output Voltage (V O )0V to V CCOperating Temperature (T A ) 40q C to 85q CMinimum Input Edge Rate ('V/'t)AC DevicesV IN from 30% to 70% of V CC V CC @ 3.3V, 4.5V, 5.5V 125 mV/nsMinimum Input Edge Rate ('V/'t)ACT Devices V IN from 0.8V to 2.0V V CC @ 4.5V, 5.5V125 mV/nsSymbol Parameter V CC T A 25q C T A 55q C to 125q C T A 40q C to 85q CUnitsConditions (V)Typ Guaranteed Limits V IHMinimum HIGH Level 3.0 1.5 2.1 2.1 2.1V OUT 0.1V Input Voltage4.5 2.25 3.15 3.15 3.15V or V CC 0.1V5.5 2.75 3.85 3.85 3.85V ILMaximum LOW Level 3.0 1.50.90.90.9V OUT 0.1VInput Voltage4.5 2.25 1.35 1.35 1.35Vor V CC 0.1V5.5 2.75 1.65 1.65 1.65V OHMinimum HIGH Level 3.0 2.99 2.9 2.9 2.9Output Voltage4.5 4.49 4.4 4.4 4.4V I OUT 50 P A5.5 5.495.4 5.4 5.43.0 2.56 2.4 2.46I OH 12 mA 4.5 3.86 3.7 3.76VI OH 24 mA 5.54.86 4.7 4.76I OH 24 mA (Note 3)V OLMaximum LOW Level 3.00.0020.10.10.1Output Voltage4.50.0010.10.10.1VI OUT 50 P A 5.50.0010.10.10.13.00.360.500.44I OL 12 mA 4.50.360.500.44VI OL 24 mA 5.50.360.500.44I OL 24 mA (Note 3)I IN Maximum Input 5.5r 0.1r 1.0r 1.0P A V I V CC , GND(Note 5)Leakage Current I OZMaximum V I (OE) V IL , V IH 3-STATE 5.5r 0.25r 5.0r 2.5P AV I V CC , V GND CurrentV O V CC , GND I OLD Minimum Dynamic 5.55075mA V OLD 1.65V Max I OHD Output Current (Note 4) 5.5 50 75mA V OHD 3.85V Min I CC Maximum Quiescent 5.54.080.040.0P AV IN V CC (Note 5)Supply Currentor GND 474A C 244 • 74A C T 244DC Electrical Characteristics for ACTNote 6: All outputs loaded; thresholds on input associated with output under test.Note 7: Maximum test duration 2.0 ms, one output loaded at a time.Symbol ParameterV CC T A 25q C T A 55q C to 125q C T A 40q C to 85q CUnits Conditions (V)Typ Guaranteed Limits V IH Minimum HIGH Level 4.5 1.5 2.0 2.0 2.0V V OUT 0.1V Input Voltage 5.5 1.5 2.0 2.0 2.0or V CC 0.1V V IL Maximum LOW Level 4.5 1.50.80.80.8V V OUT 0.1V Input Voltage 5.5 1.50.80.80.8or V CC 0.1V V OHMinimum HIGH Level 4.5 4.49 4.4 4.4 4.4VI OUT 50 P A Output Voltage5.5 5.495.4 5.4 5.4I OH 124.5 3.86 3.70 3.76VI OH 24 mA 5.54.864.70 4.76I OH 24 mA (Note 6)V OLMaximum LOW Level 4.50.0010.10.10.1VI OUT 50 P A Output Voltage5.50.0010.10.10.1I OL 12 mA4.50.360.500.44V I OL 24 mA5.50.360.500.44I OL 24 mA (Note 6)I IN Maximum Input 5.5r 0.1r 1.0r 1.0P A V I V CC , GND Leakage Current I OZ Maximum 3-STATE 5.5r 0.25r 5.0r 2.5P A V I V IL , V IH Current V O V CC , GND I CCT Maximum 5.50.61.6 1.5mA V I V CC2.1V I CC /InputI OLD Minimum Dynamic 5.55075mA V OLD 1.65V Max I OHD Output Current (Note 7) 5.5 5075mA V OHD 3.85V Min I CCMaximum Quiescent 5.54.080.040.0P AV IN V CC Supply Currentor GND74AC244 • 74ACT244AC Electrical Characteristics for ACNote 8: Voltage Range 3.3 is 3.3V r 0.3VVoltage Range 5.0 is 5.0V r 0.5VAC Electrical Characteristics for ACTNote 9: Voltage Range 5.0 is 5.0V r 0.5VCapacitanceSymbol ParameterV CCT A 25q C T A 55q C to 125q C T A 40q C to 85q CUnits(V)C L 50 pFC L 50 pF C L 50 pF (Note 8)Min Typ Max Min Max Min Max t PLH Propagation Delay 3.3 2.0 6.59.0 1.012.5 1.510.0ns Data to Output 5.0 1.5 5.07.0 1.09.5 1.07.5t PHL Propagation Delay 3.3 2.0 6.59.0 1.012.0 2.010.0ns Data to Output 5.0 1.5 5.07.0 1.09.0 1.07.5t PZH Output Enable Time 3.3 2.0 6.010.5 1.011.5 1.511.0ns 5.0 1.5 5.07.0 1.09.0 1.58.0t PZL Output Enable Time 3.3 2.57.510.0 1.013.0 2.011.0ns 5.0 1.5 5.58.0 1.010.5 1.58.5t PHZ Output Disable Time 3.3 3.07.010.0 1.012.5 1.510.5ns 5.0 2.5 6.59.0 1.010.5 1.09.5t PLZOutput Disable Time3.3 2.57.510.5 1.013.0 2.511.5ns 5.02.06.59.01.011.02.09.5Symbol ParameterV CCT A 25q C T A 55q C to 125q C T A 40q C to 85q CUnits(V)C L 50 pFC L 50 pF C L 50 pF (Note 9)Min Typ Max Min Max Min Max t PLH Propagation Delay 5.02.06.59.01.010.01.510.0ns Data to Output t PHL Propagation Delay 5.02.07.09.01.010.01.510.0nsData to Output t PZH Output Enable Time 5.0 1.5 6.08.5 1.09.5 1.09.5ns t PZL Output Enable Time 5.0 2.07.09.5 1.011.0 1.510.5ns t PHZ Output Disable Time 5.0 2.07.09.5 1.011.0 1.510.5ns t PLZOutput Disable Time5.02.57.510.01.011.52.010.5nsSymbol ParameterTyp Units ConditionsC IN Input Capacitance4.5pF V CC OPEN C PDPower Dissipation Capacitance45.0pFV CC 5.0V 674A C 244 • 74A C T 244Physical Dimensions inches (millimeters) unless otherwise noted20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" WidePackage Number M20B74AC244 • 74ACT244Physical Dimensionsinches (millimeters) unless otherwise noted (Continued)Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm WidePackage Number M20D 874A C 244 • 74A C T 244Physical Dimensions inches (millimeters) unless otherwise noted (Continued)20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm WidePackage Number MSA2074AC244 • 74ACT244Physical Dimensionsinches (millimeters) unless otherwise noted (Continued)20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm WidePackage Number MTC201074A C 244 • 74A C T 244 O c t a l B u f f e r /L i n e D r i v e r w i t h 3-S T A T E O u t p u t sPhysical Dimensions inches (millimeters) unless otherwise noted (Continued)20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" WidePackage Number N20AFairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.LIFE SUPPORT POLICYFAIRCHILD ’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:1.Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea-sonably expected to result in a significant injury to the user. 2. A critical component in any component of a life support device or system whose failure to perform can be rea-sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.。

DM74AS244资料

© 2000 Fairchild Semiconductor Corporation DS006298October 1986Revised March 2000DM74AS240 • DM74AS244 3-STATE Bus Driver/ReceiverDM74AS240 • DM74AS2443-STATE Bus Driver/ReceiverGeneral DescriptionThis family of Advance Schottky 3-STATE Bus circuits are designed to provide either bidirectional or unidirectional buffer interface in Memory, Microprocessor, and Communi-cation Systems. The output characteristics of the circuits have low impedance sufficient to drive terminated trans-mission lines down to 133Ω. The input characteristics of the circuits likewise have a high impedance so it will not significantly load the transmission line. The package con-tains eight 3-STATE buffers organized with four buffers having a common 3-STATE enable gate. The DM74AS240and DM74AS244 are eight wide in a 20 pin package, and may be used as a 4 wide bidirectional or eight wide unidi-rectional. The buffer selection includes inverting and non-inverting, with enable or disable 3-STATE control.Featuress Advanced oxide-isolated, ion-implanted Schottky TTL process s Improved switching performance with less power dissi-pation compared with Schottky counterpart s Functional and pin compatible with 74LS and Schottky counterpart s Switching response specified into 500Ω and 50 pF s Specified to interface with CMOS at V OH = V CC − 2VOrdering Code:Devices also available in T ape and Reel. Specify by appending the suffix letter “X” to the ordering code.Connection DiagramsDM74AS240DM74AS244Function TablesDM74AS240DM74AS244L = LOW Logic Level H = HIGH Logic LevelX = Either LOW or HIGH Logic LevelZ = High ImpedanceOrder Number Package NumberPackage DescriptionDM74AS240WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide DM74AS240N N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide DM74AS244WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide DM74AS244NN20A20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 WideInputs Output G A Y L L H L H L HXZInputs OutputG A Y L L L L H H HXZ 2D M 74A S 240 • D M 74A S 244Absolute Maximum Ratings (Note 1)Note 1: The “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the absolute maximum ratings.The “Recommended Operating Conditions” table will define the conditions for actual device operation.Recommended Operating ConditionsElectrical Characteristicsover recommended operating free air temperature range. All typical values are measured at V CC = 5V, T A = 25°C.Note 2: The output conditions have been chosen to produce a current that closely approximates one half the true short-circuit output current, I OS .Supply Voltage, V CC 7V Input Voltage7V Voltage Applied to Disabled Output 5.5VOperating Free Air Temperature Range 0°C to +70°C Storage Temperature Range −65°C to +150°CTypical θJA N Package 57.0°C/W M Package76.0°C/WSymbol ParameterMin Nom Max Units V CC Supply Voltage4.555.5V V IH HIGH Level Input Voltage 2V V IL LOW Level Input Voltage 0.8V I OH HIGH Level Output Current −15mA I OL LOW Level Output Current 64mA T AFree Air Operating Temperature70°CSymbol ParameterConditionsMinTypMax Units V IK Input Clamp Voltage V CC = 4.5V, I IN = −18 mA −1.2VV OHHIGH Level V CC = 4.5V, I OH = −3 mA 2.4 3.2VOutput VoltageV CC = 4.5V, I OH = Max2.4I OH = −2 mA, V CC = 4.5V to 5.5V V CC −2V OL LOW Level Output Voltage V CC = 4.5V, I OL = Max 0.350.55V I I Input Current at Max Input Voltage V CC = 5.5VV IN = 7VOthers 100µA I IH HIGH Level Input Current V CC = 5.5V, V IN = 2.7V Others 20µAI ILLOW Level Input CurrentV CC = 5.5V, V IN = 0.4VAS240, (G, G),µA(Control Inputs),−500DM74AS244 (G)DM74AS244 (A)−1000I OZH HIGH Level 3-STATE Output Current V CC = 5.5V, V = 2.7V 50µA I OZL LOW Level 3-STATE V CC = 5.5V, V = 0.4V DM74AS240, −50µA Output Current DM74AS244I O (Note 2)Output Drive Current V CC = 5.5V, V OUT = 2.25V −50−115−150mAI CCDM74AS240V CC = 5.5VOutputs HIGH 1117Supply CurrentOutputs LOW 5175mA 3-STATE 2438I CCDM74AS244V CC = 5.5VOutputs HIGH 2234Supply CurrentOutputs LOW 6090mA 3-STATE3454DM74AS240 • DM74AS244DM74AS240 Switching Characteristicsover recommended operating free air temperature range DM74AS244 Switching Characteristicsover recommended operating free air temperature range Symbol ParameterConditionsFrom To Min Max Units (Input)(Output)t PLH Propagation Delay Time V CC = 4.5V to 5.5V A Y 2 6.5ns LOW-to-HIGH Level Output R 1 = R 2 = 500Ωt PHL Propagation Delay Time C L = 50 pFA Y 2 5.7ns HIGH-to-LOW Level Output t PZL Output Enable to LOW Level G Y 29ns t PZH Output Enable to HIGH Level G Y 2 6.4ns t PLZ Output Disable from LOW Level G Y 29.5ns t PHZOutput Disable from HIGH LevelGY25nsSymbol ParameterConditionsFrom To Min Max Units (Input)(Output)t PLH Propagation Delay Time V CC = 4.5V to 5.5V A Y 2 6.2ns LOW-to-HIGH Level Output R 1 = R 2 = 500Ωt PHL Propagation Delay Time C L = 50 pFA Y 2 6.2ns HIGH-to-LOW Level Output t PZL Output Enable to LOW Level G Y 27.5ns t PZH Output Enable to HIGH Level G Y 29ns t PLZ Output Disable from LOW Level G Y 29ns t PHZOutput Disable from HIGH LevelGY26ns 4D M 74A S 240 • D M 74A S 244Physical Dimensionsinches (millimeters) unless otherwise noted20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 WidePackage Number M20B5DM74AS240 • DM74AS244 3-STATE Bus Driver/ReceiverPhysical Dimensions inches (millimeters) unless otherwise noted (Continued)20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 WidePackage Number N20AFairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:1.Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea-sonably expected to result in a significant injury to the user.2. A critical component in any component of a life support device or system whose failure to perform can be rea-sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.。