CD4042BNSR中文资料

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CD4045BEE4中文资料

The CD4045B types are supplied in 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline package (NSR suffix), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)CD4045BE ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4045BEE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4045BNSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4045BNSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4045BNSRG4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4045BPW ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4045BPWE4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4045BPWG4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4045BPWR ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4045BPWRE4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4045BPWRG4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TIto Customer on an annual basis.TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant CD4045BNSR SO NS 162000330.016.48.210.5 2.512.016.0Q1CD4045BPWRTSSOPPW162000330.012.47.05.61.68.012.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) CD4045BNSR SO NS162000346.0346.033.0 CD4045BPWR TSSOP PW162000346.0346.029.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDSP BroadbandClocks and Timers Digital ControlInterface MedicalLogic MilitaryPower Mgmt Optical NetworkingMicrocontrollers SecurityRFID TelephonyRF/IF and ZigBee®Solutions Video&ImagingWirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2008,Texas Instruments Incorporated。

CD4042B

Data sheet acquired from Harris Semiconductor SCHS040IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。

CD4522BNSR中文资料

Data sheet acquired from Harris SemiconductorSCHS079C − Revised October 2003The CD4522B-series types are supplied in 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)CD4522BE ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4522BEE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4522BM ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4522BM96ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4522BM96E4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4522BM96G4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4522BME4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4522BMG4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4522BMT ACTIVE SOIC D16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4522BMTE4ACTIVE SOIC D16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4522BMTG4ACTIVE SOIC D16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4522BNSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4522BNSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4522BNSRG4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4522BPW ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4522BPWE4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4522BPWG4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4522BPWR ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4522BPWRE4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4522BPWRG4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.TAPE AND REELINFORMATION*All dimensionsare nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant CD4522BM96SOIC D 162500330.016.4 6.510.3 2.18.016.0Q1CD4522BNSR SO NS 162000330.016.48.210.5 2.512.016.0Q1CD4522BPWRTSSOPPW162000330.012.47.05.61.68.012.0Q1PACKAGE MATERIALS INFORMATION19-Mar-2008*All dimensionsare nominalDevice Package TypePackage DrawingPins SPQ Length (mm)Width (mm)Height (mm)CD4522BM96SOIC D 162500333.2345.928.6CD4522BNSR SO NS 162000346.0346.033.0CD4522BPWRTSSOPPW162000346.0346.029.0PACKAGE MATERIALS INFORMATION19-Mar-2008Pack Materials-Page 2IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDSP BroadbandClocks and Timers Digital ControlInterface MedicalLogic MilitaryPower Mgmt Optical NetworkingMicrocontrollers SecurityRFID TelephonyRF/IF and ZigBee®Solutions Video&ImagingWirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2008,Texas Instruments Incorporated。

IC集成电路型号大全及40系列芯片功能大全

IC集成电路型号大全及40系列芯片功能大全CD4001 四2输入端或者非门CD4002 双4输入端或者非门CD4006 18位串入/串出移位寄存器CD4007 双互补对加反相器CD4008 4位超前进位全加器CD4009 六反相缓冲/变换器CD4010 六同相缓冲/变换器CD4011 四2输入端与非门CD4012 双4输入端与非门CD4013 双主-从D型触发器CD4014 8位串入/并入-串出移位寄存器CD4015 双4位串入/并出移位寄存器CD4016 四传输门CD4017 十进制计数/分配器CD4018 可预制1/N计数器CD4019 四与或者选择器CD4020 14级串行二进制计数/分频器CD4021 08位串入/并入-串出移位寄存器CD4022 八进制计数/分配器CD4023 三3输入端与非门CD4024 7级二进制串行计数/分频器CD4025 三3输入端或者非门CD4026 十进制计数/7段译码器CD4027 双J-K触发器CD4028 BCD码十进制译码器CD4029 可预置可逆计数器CD4030 四异或者门CD4031 64位串入/串出移位存储器CD4032 三串行加法器CD4033 十进制计数/7段译码器CD4034 8位通用总线寄存器CD4035 4位并入/串入-并出/串出移位寄存CD4038 三串行加法器CD4040 12级二进制串行计数/分频器CD4041 四同相/反相缓冲器CD4042 四锁存D型触发器CD4043 三态R-S锁存触发器("1"触发)CD4044 四三态R-S锁存触发器("0"触发)CD4046 锁相环CD4047 无稳态/单稳态多谐振荡器CD4048 四输入端可扩展多功能门CD4049 六反相缓冲/变换器CD4050 六同相缓冲/变换器CD4051 八选一模拟开关CD4052 双4选1模拟开关CD4053 三组二路模拟开关CD4054 液晶显示驱动器CD4055 BCD-7段译码/液晶驱动器CD4056 液晶显示驱动器CD4059 “N”分频计数器 NSC/TICD4060 14级二进制串行计数/分频器CD4063 四位数字比较器CD4066 四传输门CD4067 16选1模拟开关CD4068 八输入端与非门/与门CD4069 六反相器CD4070 四异或者门CD4071 四2输入端或者门CD4072 双4输入端或者门CD4073 三3输入端与门CD4075 三3输入端或者门CD4076 四D寄存器CD4077 四2输入端异或者非门CD4078 8输入端或者非门/或者门CD4081 四2输入端与门CD4082 双4输入端与门CD4085 双2路2输入端与或者非门CD4086 四2输入端可扩展与或者非门CD4089 二进制比例乘法器CD4093 四2输入端施密特触发器CD4095 三输入端J-K触发器CD4096 三输入端J-K触发器CD4097 双路八选一模拟开关CD4098 双单稳态触发器CD4099 8位可寻址锁存器CD40100 32位左/右移位寄存器CD40101 9位奇偶较验器CD40102 8位可预置同步BCD减法计数器CD40103 8位可预置同步二进制减法计数器CD40104 4位双向移位寄存器CD40105 先入先出FI-FD寄存器CD40106 六施密特触发器CD40107 双2输入端与非缓冲/驱动器CD40108 4字×4位多通道寄存器CD40109 四低-高电平位移器CD40110 十进制加/减,计数,锁存,译码驱动CD40147 10-4线编码器CD40160 可预置BCD加计数器CD40161 可预置4位二进制加计数器CD40162 BCD加法计数器CD40163 4位二进制同步计数器CD40174 六锁存D型触发器CD40175 四D型触发器CD40181 4位算术逻辑单元/函数发生器CD40182 超前位发生器CD40192 可预置BCD加/减计数器(双时钟) CD40193 可预置4位二进制加/减计数器CD40194 4位并入/串入-并出/串出移位寄存CD40195 4位并入/串入-并出/串出移位寄存CD40208 4×4多端口寄存器CD4501 4输入端双与门及2输入端或者非门CD4502 可选通三态输出六反相/缓冲器CD4503 六同相三态缓冲器CD4504 六电压转换器CD4506 双二组2输入可扩展或者非门CD4508 双4位锁存D型触发器CD4510 可预置BCD码加/减计数器CD4511 BCD锁存,7段译码,驱动器CD4512 八路数据选择器CD4513 BCD锁存,7段译码,驱动器(消隐) CD4514 4位锁存,4线-16线译码器CD4515 4位锁存,4线-16线译码器CD4516 可预置4位二进制加/减计数器CD4517 双64位静态移位寄存器CD4518 双BCD同步加计数器CD4519 四位与或者选择器CD4520 双4位二进制同步加计数器CD4521 24级分频器CD4522 可预置BCD同步1/N计数器CD4526 可预置4位二进制同步1/N计数器CD4527 BCD比例乘法器CD4528 双单稳态触发器CD4529 双四路/单八路模拟开关CD4530 双5输入端优势逻辑门CD4531 12位奇偶校验器CD4532 8位优先编码器CD4536 可编程定时器CD4538 精密双单稳CD4539 双四路数据选择器CD4541 可编程序振荡/计时器CD4543 BCD七段锁存译码,驱动器CD4544 BCD七段锁存译码,驱动器CD4547 BCD七段译码/大电流驱动器CD4549 函数近似寄存器CD4551 四2通道模拟开关CD4553 三位BCD计数器CD4555 双二进制四选一译码器/分离器CD4556 双二进制四选一译码器/分离器CD4558 BCD八段译码器CD4560 "N"BCD加法器CD4561 "9"求补器CD4573 四可编程运算放大器CD4574 四可编程电压比较器CD4575 双可编程运放/比较器CD4583 双施密特触发器CD4584 六施密特触发器CD4585 4位数值比较器CD4599 8位可寻址锁存器CD22100 4×4×1交叉点开关0206A 天线开关集成电路03VFG9 发射压控振荡集成电路1021AC 发射压控振荡集成电路1097C 升压集成电路140N 电源取样比较放大集成电路14DN363 伺服操纵集成电路15105 充电操纵集成电路15551 管理卡升压集成电路1710 视频信号处理集成电路1N706 混响延时集成电路20810－F6096 存储集成电路2252B 微处理集成电路2274 延迟集成电路24C01ACEA 存储集成电路24C026 存储集成电路24C04 存储集成电路24C64 码片集成电路24LC16B 存储集成电路24LC65 电可改写编程只读存储集成电路27C1000PC－12 存储集成电路27C2000QC－90 存储集成电路27C20T 存储集成电路27C512 电可改写编程只读存储集成电路2800 红外遥控信号接收集成电路28BV64 码片集成电路28F004 版本集成电路31085 射频电源集成电路32D54 电源、音频信号处理集成电路1732D75 电源、音频信号处理集成电路32D92 电源中频放大集成电路4066B 电子开关切换集成电路4094 移位寄存串入、并出集成电路424260SDJ 存储集成电路4260 动态随机存储集成电路4270351/91B9905 中频放大集成电路4370341/90M9919 中频处理集成电路4464 存储集成电路4558 双运算放大集成电路4580D 双运算放大集成电路47C1638AN－U337 微处理集成电路47C1638AU－353 微处理集成电路47C432GP 微处理集成电路47C433AN－3888 微处理集成电路49/4CR1A 中频放大集成电路5101 天线开关集成电路5G052 发光二极管四位显示驱动集成电路5G24 运算放大集成电路5W01 双运算放大集成电路649/CRIA70612 中频放大集成电路673/3CR2A 多模转换集成电路74122 可重触发单稳态集成电路74HC04 逻辑与非门集成电路74HC04D 六反相集成电路74HC123 单稳态集成电路74HC125 端口功能扩展集成电路74HC14N 六反相集成电路74HC157A 多路转换集成电路74HC165 移相寄存集成电路1874HC245 总线收发集成电路74HC32 或者门四2输入集成电路74HC374八D 触发集成电路74HC573D 存储集成电路74HCT157 多路转换双输入集成电路74HCT4046A 压控振荡集成电路74HCT4538D 单稳态集成电路74HCT4538N 触发脉冲集成电路74HCT86D 异或者门四2输入集成电路74HCU04 与非门集成电路74LS125 端口功能扩展集成电路74LS373 锁存集成电路74LS393 计数双四位二进制集成电路74LS74双D 触发集成电路78014DFP 系统操纵处理集成电路811N 伴音阻容偏置集成电路83D33 压控振荡集成电路85712 场扫描信号校正处理集成电路85713 行扫描信号校正集成电路87C52 微处理集成电路87CK38N－3584 微处理集成电路87CK38N－3627 微处理集成电路89C52 系统操纵处理集成电路89C55 系统操纵处理集成电路93C66 电可改写编程只读存储集成电路93LC56 电可改写编程存储集成电路9821K03 系统操纵集成电路A1642P 背景歌声消除集成电路A701 红外遥控信号接收集成电路A7950 场频识别集成电路19A8772AN 色差信号延迟处理集成电路A9109 功率放大集成电路AAB 电源集成电路ACA650 色度信号解调集成电路ACFP2 色度、亮度信号分离集成电路ACP2371 多伴音、多语言改善集成电路ACVP2205 色度、亮度信号分离集成电路AD1853 立体声数/模转换集成电路AD1858 音频解调集成电路AD722 视频编码集成电路ADC2300E 音频数/模转换集成电路ADC2300J 音频数/模转换集成电路ADC2310E 音频数/模转换集成电路ADV7172 视频编码集成电路ADV7175A 视频编码集成电路AE31201 频率显示集成电路AJ7080 射频调制集成电路AK4321－VF－E1 音频数/模转换集成电路AN1319 双高速电压比较集成电路AN1358S 双运算放大集成电路AN1393 双运算放大集成电路AN1431T 稳压电源集成电路AN1452 音频前置放大集成电路AN1458S 双运算放大集成电路AN206 伴音中频及前置放大集成电路AN222 自动频率操纵集成电路AN236 副载波信号处理集成电路AN239Q 图像、伴音中频放大集成电路AN247P 图像中频放大、AGC操纵集成电路AN253P 调频/调幅中频放大集成电路20AN262 音频前置放大集成电路AN2661NK 视频信号处理集成电路AN2663K 视频信号处理集成电路AN272 音频功率放大集成电路AN2751FAP 视频信号处理集成电路AN281 色度解码集成电路AN2870FC 多功能操纵集成电路AN295 行、场扫描信号处理集成电路AN301 伺服操纵集成电路AN305 视频自动增益操纵集成电路AN306 色度自动相位操纵集成电路AN318 直流伺服操纵集成电路AN320 频率操纵、调谐显示驱动集成电路AN3215K 视频信号处理集成电路AN3215S 视频信号处理集成电路AN3224K 磁头信号记录放大集成电路AN3248NK 亮度信号记录、重放处理集成电路AN331 视频信号处理集成电路AN3311K 磁头信号放大集成电路AN3313 磁头信号放大集成电路AN3321S 录像重放信号处理集成电路AN3331K 磁头信号处理集成电路AN3337NSB 磁头信号放大集成电路AN3380K 磁头信号处理集成电路AN3386NK 磁头信号处理集成电路AN3495K 色度、亮度信号降噪集成电路AN355 伴音中频放大、检波集成电路AN3581S 视频驱动集成电路AN366 调频/调幅中频放大集成电路AN3791 移位操纵集成电路21AN3792 磁鼓伺服操纵接口集成电路AN3795 主轴伺服操纵接口集成电路AN3814K 电机驱动集成电路AN4265 音频功率放大集成电路AN4558 运算放大集成电路AN5010 电子选台集成电路AN5011 电子选台集成电路AN5015K 电子选台集成电路AN5020 红外遥控信号接收集成电路AN5025S 红外遥控信号接收集成电路AN5026K 红外遥控信号接收集成电路AN5031 电调谐操纵集成电路AN5034 调谐操纵集成电路AN5036 调谐操纵集成电路AN5043 调谐操纵集成电路AN5071 频段转换集成电路AN5095K 电视信号处理集成电路AN5110 图像中频放大集成电路AN5130 图像中频、视频检波放大集成电路AN5138NK 图像、伴音中频放大集成电路AN5156K 电视信号处理集成电路AN5177NK 图像、伴音中频放大集成电路AN5179K 图像、伴音中频放大集成电路AN5183K 中频信号处理集成电路AN5195K 中频、色度、扫描信号处理集成电路AN5215 伴音信号处理集成电路AN5520 伴音中频放大及鉴频集成电路AN5222 伴音中频放大集成电路AN5250 伴音中频放大、鉴频及功率放大集成电路AN5262 音频前置放大集成电路22AN5265 音频功率放大集成电路AN5270 音频功率放大集成电路AN5273 双声道音频功率放大集成电路AN5274 双声道音频功率放大集成电路AN5275 中置、3D放大集成电路AN5285K 双声道前置放大集成电路AN5295NK 音频信号切换集成电路AN5312 视频、色度信号处理集成电路AN5313NK 视频、色度信号处理集成电路AN5342 图像水平轮廓校正集成电路AN5342FB 水平清晰度操纵集成电路AN5344FBP 色度信号处理集成电路AN5348K 人工智能信号处理集成电路AN5385K 色差信号放大集成电路AN5410 行、场扫描信号处理集成电路AN5421 同步检测集成电路AN5422 行、场扫描信号处理集成电路AN5512 场扫描输出集成电路AN5515 场扫描输出集成电路AN5521 场扫描输出集成电路AN5532 场扫描输出集成电路AN5534 场扫描输出集成电路AN5551 枕形校正集成电路AN5560 场频识别集成电路AN5600K 中频、亮度、色度及扫描信号处理集成电路AN5601K 视频、色度、同步信号处理集成电路AN5607K 视频、色度、行场扫描信号处理集成电路AN5615 视频信号处理集成电路AN5620X 色度信号处理集成电路AN5621 场扫描输出集成电路23AN5625 色度信号处理集成电路AN5633K 色度信号处理集成电路AN5635 色度解码集成电路AN5635NS 色度解码集成电路AN5637 色度解码、亮度延迟集成电路AN5650 同步信号分离集成电路AN5682K 基色电子开关切换集成电路AN5693K 视频、色度、行场扫描信号处理集成电路AN5712 图像中频放大、AGC操纵集成电路AN5722 图像中频放大、检波集成电路AN5732 伴音中频放大、鉴频集成电路AN5743 音频功率放大集成电路AN5750 行自动频率操纵及振荡集成电路AN5757S 行扫描电源电压操纵集成电路AN5762 场扫描振荡、输出集成电路AN5764 光栅水平位置操纵集成电路AN5765 电源稳压操纵集成电路AN5767 同步信号处理集成电路AN5768 光栅倾斜校正操纵集成电路AN5769 行、场会聚操纵集成电路AN5790N 行扫描信号处理集成电路AN5791 同步脉冲相位与脉宽调整集成电路AN5803 双声道立体声解调集成电路AN5836 双声道前置放大集成电路AN5858K 视频信号操纵集成电路AN5862 视频信号操纵集成电路AN5862S－E1 视频信号开关操纵集成电路AN5870K 模拟信号切换集成电路AN5891K 音频信号处理集成电路AN614 行枕形校正集成电路24AN6210 双声道前置放大集成电路AN6306S 亮度信号处理集成电路AN6308 模拟电子开关集成电路AN6327 视频重放信号处理集成电路AN6341N 伺服操纵集成电路AN6342N 基准分频集成电路AN6344 伺服操纵集成电路AN6345 分频集成电路AN6346N 磁鼓伺服操纵集成电路AN6350 磁鼓伺服操纵集成电路AN6357N 主轴接口集成电路AN6361N 色度信号处理集成电路AN6367NK 色度信号处理集成电路AN6371S 自动相位操纵集成电路AN6387 电机伺服操纵集成电路AN6550 卡拉OK音频放大集成电路AN6554 四运算放大集成电路AN6561 双运算放大集成电路AN6562SG 双运算放大集成电路AN6609N 电机驱动集成电路AN6612 电机稳速操纵集成电路AN6650 电机速度操纵集成电路AN6651 电机速度操纵集成电路AN6652 电机稳速操纵集成电路AN6875 发光二极管五位显示驱动集成电路AN6877 发光二极管七位显示驱动集成电路AN6884 发光二极管五位显示驱动集成电路AN6886 发光二极管五位显示驱动集成电路AN6888 发光二极管显示驱动集成电路AN6914 双电压比较集成电路25AN7085N5 单片录、放音集成电路AN7105 双声道音频功率放大集成电路AN7106K 双声道音频功率放大集成电路AN7108 单片立体声放音集成电路AN710S 单片放音集成电路AN7110E 音频功率放大集成电路AN7114 音频功率放大集成电路AN7116 音频功率放大集成电路AN7118 双声道音频功率放大集成电路AN7118S 双声道音频功率放大集成电路AN7120 音频功率放大集成电路AN7124 双声道音频功率放大集成电路AN7145 双声道音频功率放大集成电路AN7148 双声道音频功率放大集成电路AN7158N 音频功率放大7.5W×2集成电路AN7161N 音频功率放大集成电路AN7164 双声道音频功率放大集成电路AN7171NK 音频功率放大集成电路AN7205 调频/调谐及高频放大集成电路AN7220 调频/调幅中频放大集成电路AN7222 调频/调幅中频放大集成电路AN7223 调频/调幅中频放大集成电路AN7226 调频/调幅中频放大集成电路AN7256 调频/调谐及中频放大集成电路AN7311 双声道前置放大集成电路AN7312 双声道前置放大集成电路AN7315 双声道前置放大集成电路AN7315S 双声道前置放大集成电路AN7320 音频前置放大集成电路AN7396K 双声道前置放大集成电路26AN7397K 双声道前置放大集成电路AN7410 调频立体声多路解码集成电路AN7414 调频立体声解码集成电路AN7420N 调频立体声解码集成电路AN7470 调频立体声解码集成电路AN7805 三端电源稳压＋5V/1A集成电路AN7806 三端电源稳压＋6V/1A集成电路AN7807 三端电源稳压＋7V/1A集成电路AN7808 三端电源稳压＋8V/1A集成电路AN7809 电源稳压＋9V/1A集成电路AN7810 三端电源稳压＋10V/1A集成电路AN7812 三端电源稳压＋12V/1A集成电路AN7815 三端电源稳压＋15V/1A集成电路AN7818 三端电源稳压＋18V/1A集成电路AN7820 三端电源稳压＋20V/1A集成电路AN7824 三端电源稳压＋24V/1A集成电路AN78L05 三端电源稳压＋5V/0.1A集成电路AN78L06 三端电源稳压＋6V/0.1A集成电路AN78L08 三端电源稳压＋8V/0.1A集成电路AN78L09 三端电源稳压＋9V/0.1A集成电路AN78L10 三端电源稳压＋10V/0.1A集成电路AN78L12 三端电源稳压＋12V/0.1A集成电路AN78L15 三端电源稳压＋15V/0.1A集成电路AN78L18 三端电源稳压＋18V/0.1A集成电路AN78L20 三端电源稳压＋20V/0.1A集成电路AN78L24 三端电源稳压＋24V/0.1A集成电路AN78M05 三端电源稳压＋5V/0.5A集成电路AN78M06 三端电源稳压＋6V/0.5A集成电路AN78M08 三端电源稳压＋8V/0.5A集成电路AN78M09 三端电源稳压＋9V/0.5A集成电路27AN78M10 三端电源稳压＋10V/0.5A集成电路AN78M12 三端电源稳压＋12V/0.5A集成电路AN78M15 三端固定式稳压＋15V/0.5A集成电路AN78M18 三端电源稳压＋18V/0.5A集成电路AN78M20 三端电源稳压＋20V/0.5A集成电路AN78M24 三端电源稳压＋24V/0.5A集成电路AN7905 三端电源稳压－5V/1A集成电路AN7906 三端电源稳压－6V/1A集成电路AN7908T 三端电源稳压－8V/1A集成电路AN7909T 三端电源稳压－9V/1A集成电路AN7910T 三端电源稳压－10V/1A集成电路AN7912 三端电源稳压－12V/1A集成电路AN7915 三端电源稳压－15V/1A集成电路AN7918 三端电源稳压－18V/1A集成电路AN7920 三端电源稳压－20V/1A集成电路AN7924 三端电源稳压－24V/1A集成电路AN79L05 三端电源稳压－5V/0.1A集成电路AN79L06 三端电源稳压－6V/0.1A集成电路AN79L08 三端电源稳压－8V/0.1A集成电路AN79L09 三端电源稳压－9V/0.1A集成电路AN79L10 三端电源稳压－10V/0.1A集成电路AN79L12 三端电源稳压－12V/0.1A集成电路AN79L15 三端电源稳压－15V/0.1A集成电路AN79L18 三端电源稳压－18V/0.1A集成电路AN79L20 三端电源稳压－20V/0.1A集成电路AN79L24 三端电源稳压－24V/0.1A集成电路AN79M05 三端电源稳压－5V/0.5A集成电路AN79M06 三端电源稳压－6V/0.5A集成电路AN79M08 三端电源稳压－8V/0.5A集成电路AN79M09 三端电源稳压－9V/0.5A集成电路28AN79M10 三端电源稳压－10V/0.5A集成电路AN79M12 三端电源稳压－12V/0.5A集成电路AN79M15 三端电源稳压－15V/0.5A集成电路AN79M18 三端电源稳压－18V/0.5A集成电路AN79M20 三端电源稳压－20V/0.5A集成电路AN79M24 三端电源稳压－24V/0.5A集成电路AN8028 自激式开关电源操纵集成电路AN8270K 主轴电机操纵集成电路AN8280 电机驱动集成电路AN8281S 电机驱动集成电路AN8290S 主轴电机驱动集成电路AN8355S 条形码扫描接收集成电路AN8370S 光电伺服操纵集成电路AN8373S 射频伺服处理集成电路AN8375S 伺服处理集成电路AN8389S－E1 电机驱动集成电路AN8480NSB 主轴电机驱动集成电路AN8481SB－E1 主轴电机驱动集成电路AN8482SB 主轴电机驱动集成电路AN8623FBQ 主轴伺服处理集成电路AN8788FB 电机驱动集成电路AN8802CE1V 伺服处理集成电路AN8813NSBS 主轴电机驱动集成电路AN8819NFB 伺服驱动、直流交换集成电路AN8824FBQ 前置放大集成电路AN8825NFHQ－V 聚焦、循迹误差处理集成电路AN8831SC 视频预视放集成电路AN8832SB－E1 射频放大、伺服处理集成电路AN8837SB－E1 伺服处理集成电路AN89C2051－24PC 微处理集成电路29APU2400U 音频信号处理集成电路APU2470 音频信号处理集成电路AS4C14405－60JC 动态随机存储1M×4集成电路AS4C256K16ED－60JC 存储集成电路ASD0204－015 图文操纵集成电路ASD0204GF－022－3BA显示操纵集成电路AT24C08 存储集成电路AT24C08A 存储集成电路AT24C256－10CI 码片集成电路AT27C010 电可改写编程只读存储集成电路AT27C020 存储集成电路ATMEL834 存储集成电路AVM－1 视频信号处理厚膜集成电路AVM－2 音频信号处理厚膜集成电路AVSIBCP08 倍压整流切换集成电路B0011A 存储集成电路B1218 电子快门操纵集成电路BA033T 三端电源稳压＋3.3V集成电路BA10324 四运算放大集成电路BA10393N 双运算放大集成电路BA1102F 杜比降噪处理集成电路BA1106F 杜比降噪处理集成电路BA12ST 电源稳压集成电路BA1310 调频立体声解码集成电路BA1332L 调频立体声解码集成电路BA1350 调频立体声解码集成电路BA1351 调频立体声解码集成电路BA1356 调频立体声解码集成电路BA1360 调频立体声解码集成电路BA15218N 双运算放大集成电路30BA225 可触发双单稳态振荡集成电路BA302 音频前置放大集成电路BA311 音频前置放大集成电路BA313 音频前置放大集成电路BA3283 单片放音集成电路BA328F 双声道前置放大集成电路BA329 双声道前置放大集成电路BA3304F 录放音前置均衡放大集成电路BA3306 音频、前置放大集成电路BA3312N 话筒信号前置放大集成电路BA3313L 自动音量操纵集成电路BA3314 话筒信号前置放大集成电路BA335 自动选曲集成电路BA336 自动选曲集成电路BA340 音频前置放大集成电路BA3402F 双声道前置放大集成电路BA3404F 自返转放音集成电路BA343 双声道前置放大集成电路BA3503F 双声道前置放大集成电路BA3506 单片放音集成电路BA3513FS 单片放音集成电路BA3516 单片放音集成电路BA3706 自动选曲集成电路BA3707 录音带曲间检测集成电路BA3812L 五频段音调补偿集成电路BA3818F 电压比较运放集成电路BA3822LS 双声道五频段显示均衡集成电路BA3828 电子选台预置集成电路BA3880 音频处理集成电路31BA401 调频中频放大集成电路BA402 调频中频放大集成电路BA4110 调频中频放大集成电路BA4234L 调频中频放大集成电路BA4402 调频调谐收音集成电路BA4403 调频高频放大、混频、本振集成电路BA4560 双运算放大集成电路BA5096 数字混响集成电路BA5102A 音频功率放大集成电路BA514 音频功率放大集成电路BA516 音频功率放大集成电路BA5208AF 音频功率放大集成电路BA532 音频功率放大集成电路BA534 音频功率放大集成电路BA5406 双声道音频功率放大集成电路BA5412 音频功率放大集成电路BA547 音频功率放大1.5W集成电路BA5912AFP－YE2 电机驱动、倾斜、加载集成电路BA5981FP－E2 聚焦、循迹驱动集成电路BA5983FB 四通道伺服驱动集成电路BA5983FM－E2 电机驱动集成电路BA6104 发光二极管五位显示驱动集成电路BA6107A 电机伺服操纵集成电路BA6109 加载电机驱动集成电路BA6125 发光二极管五位显示驱动集成电路BA6137 发光二极管五位显示驱动集成电路BA6191 音频操纵集成电路BA6196FP 伺服驱动集成电路BA6208 电机驱动集成电路BA6208D 电机驱动集成电路32BA6209 电机驱动集成电路BA6209N 双向驱动电机集成电路BA6218 加载电机驱动集成电路BA6219 电机驱动集成电路BA6219B 电机驱动集成电路BA6227 电机稳速操纵集成电路BA6238 电机驱动集成电路BA6239 电机双向驱动集成电路BA6239A 电机双向驱动集成电路BA6246M 加载、转盘电机驱动集成电路BA6248 电机驱动集成电路BA6286 电机驱动集成电路BA6287 电机驱动集成电路BA6290 电机驱动集成电路BA6295AFP－E2 加载、倾斜驱动集成电路BA6296FP 电机速度操纵集成电路BA6297AFP 伺服驱动集成电路BA6302A 电机伺服操纵集成电路BA6305 操纵放大集成电路BA6305F 操纵放大集成电路BA6308 电子开关切换集成电路BA6321 电机伺服操纵集成电路BA6392 伺服驱动集成电路BA6395 主轴电机驱动集成电路BA6396FP 伺服驱动集成电路BA6411 电机驱动集成电路BA6435S 主轴电机驱动集成电路BA6459P1 电机驱动集成电路BA6570FP－E2 聚焦、循迹驱动集成电路33BA6664FM 三相主电机驱动集成电路BA6791FP 四通道伺服驱动集成电路BA6796FP 电机驱动集成电路BA6810S 音频显示驱动集成电路BA6844AFP－E2 三相主电机驱动集成电路BA6849FP 主轴电机驱动集成电路BA689 发光二极管十二位显示驱动集成电路BA6893KE2 直流变换驱动集成电路BA6956AN 加载电机驱动集成电路BA6993 双运算放大集成电路BA7001 音频切换集成电路BA7004 测试信号发生集成电路BA7005AL 射频调制集成电路BA7007 信号检测集成电路BA7021 视频信号选择集成电路BA7024 视频信号测试集成电路BA7025L 信号检测集成电路BA7042 振荡集成电路BA7047 调频检波集成电路BA7048N 包络信号检测集成电路BA7106LS 检测信号操纵集成电路BA7180FS 磁头信号放大集成电路BA7212S 磁头信号放大集成电路BA7253S 磁头信号放大集成电路BA7254S 四磁头信号放大集成电路BA7258AS 亮度信号处理集成电路BA7264S 视频信号处理集成电路BA7274S 磁头信号放大集成电路BA7357S 中频放大集成电路BA7604N 电子开关切换集成电路34BA7606F 色差信号切换集成电路BA7655 色度信号处理集成电路BA7665FS－E2 视频输出放大集成电路BA7725FS 混响立体声放大集成电路BA7725S 信号压缩及扩展处理集成电路BA7743FS 磁头信号放大集成电路BA7751ALS 音频信号录放处理集成电路BA7752LS 音频信号处理集成电路BA7755 磁头开关集成电路BA7755AF－E2 磁头开关集成电路BA7765AS 音频信号处理集成电路BA7766SA 音频信号处理集成电路BA7767AS 音频信号处理集成电路BA7797F 音频信号处理集成电路BA8420 特技操纵处理集成电路BAL6309 场同步信号发生集成电路BH3866AS 音频、色度信号前置放大集成电路BH4001 微处理集成电路BH7331P 音频功率放大集成电路BH7770KS 音频信号处理集成电路BL3207 亮度延时集成电路BL3208B 音频延迟混响集成电路BL5132 中频放大集成电路BL54573 电子调频波段转换集成电路BL5612 视频放大、色差矩阵集成电路BM5060 微处理集成电路BM5061 字符发生集成电路BM5069 微处理集成电路BN5115 图像中频放大集成电路BOC31F 单片微处理集成电路35BP5020 视频电源转换集成电路BT852 视频编码集成电路BT864 视频编码集成电路BT866PQFP 微处理集成电路BU12102 时序信号发生解码集成电路BU2092F 扩展集成电路BU2185F 同步信号处理集成电路BU2285FV 时钟信号发生集成电路BU2820 伺服操纵集成电路BU2841FS 视频、蓝背景信号发生集成电路BU2872AK 操作系统操纵、屏显驱动集成电路BU3762AF 红外遥控信号发射集成电路BU4053B 电子开关切换集成电路BU5814F 红外遥控信号发射集成电路BU5994F 红外遥控信号发射集成电路BU6198F 屏幕显示集成电路BU9252F 音频延时集成电路BU9252S 数/模转换集成电路BU9253FS 话筒音频混响集成电路BX1303 音频功率放大集成电路BX1409 红外遥控信号接收集成电路BX7506 主轴电机电源操纵集成电路C1363CA 红外遥控电子选台集成电路C1490HA 红外遥控信号接收集成电路C187 分配、十进制计数集成电路C301 译码BCD－10段集成电路C68639Y 微处理集成电路C75P036 微处理集成电路CA0002 调幅模拟声解调集成电路CA2004 音频功率放大集成电路36CA2006 音频功率放大集成电路CA270AW 视频检波放大集成电路CA3075 调频中频放大集成电路CA3089 调频中频放大集成电路CA3120E 视频信号处理集成电路CA3140 运算放大集成电路CA810 音频功率放大集成电路CA920 行扫描信号处理集成电路CAS126 天线开关集成电路CAT24C16 电可改写编程只读存储集成电路CAT35C104HP 存储集成电路CC4000 或者非门双3输入集成电路CC4008 计数4位二进制集成电路CC40107 与非双2输入缓冲、驱动集成电路CC40174 六D触发集成电路CC40194 移位寄存集成电路CC4025 或者非门3输入集成电路CC4026 译码、驱动、十进制计数集成电路CC4027 上升沿J－K触发集成电路。

CD4044中文资料

October 1987Revised January 1999CD4043BC • CD4044BC Quad 3-STATE NOR R/S Latches • Quad 3-STATE NAND R/S Latches © 1999 Fairchild Semiconductor Corporation DS005967.prf CD4043BC • CD4044BCQuad 3-STATE NOR R/S Latches •Quad 3-STATE NAND R/S LatchesGeneral DescriptionThe CD4043BC are quad cross-couple 3-STATE CMOSNOR latches, and the CD4044BC are quad cross-couple 3-STATE CMOS NAND latches. Each latch has a separate Qoutput and individual SET and RESET inputs. There is acommon 3-ST ATE ENABLE input for all four latches. Alogic “1” on the ENABLE input connects the latch states tothe Q outputs. A logic “0” on the ENABLE input discon-nects the latch states from the Q outputs resulting in anopen circuit condition on the Q output. The 3-ST ATE fea-ture allows common bussing of the outputs.Featuress Wide supply voltage range: 3V to 15Vs Low power:100 nW (typ.)s High noise immunity:0.45 V DD (typ.)s Separate SET and RESET inputs for each latchs NOR and NAND configurations3-STATE output with common output enableApplications•Multiple bus storage•Strobed register•Four bits of independent storage with output enable•General digital logicOrdering Code:Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.Connection DiagramsPin Assignments for DIP, SOIC and SOPCD4043BCTop ViewPin Assignments for DIP and SOICCD4044BCTop ViewOrder Number Package Number Package DescriptionCD4043BCM M16A16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow BodyCD4043BCN N16E16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” WideCD4044BCM M16A16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow BodyCD4044BCSJ M16D16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm WideCD4044BCN N16E16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide 2C D 4043B C • C D 4044B CBlock DiagramsCD4043BCCD4044BCTruth TablesCD4043BCCD4044BC OC = 3-ST ATE NC = No change X = Don’t care∆ = Dominated by S = 1 input ∆∆ = Dominated by R = 0 inputS R E Q X X 0OC 001NC 10110110111∆S R E Q X X 0OC 111NC 0111101001∆∆CD4043BC • CD4044BCAbsolute Maximum Ratings (Note 1)(Note 2)Recommended Operating Conditions (Note 2)Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed; they are not meant to imply that the devices should be operated at these limits. The tables of “Recom-mended Operating Conditions” and “Electrical Characteristics” provide con-ditions for actual device operation.Note 2: V SS = 0V unless otherwise specified.DC Electrical Characteristics (Note 2)Note 3: I OH and I OL are tested one output at a time.Supply Voltage (V DD )−0.5V to +18V Input Voltage (V IN )−0.5V to V DD +0.5V Storage Temperature Range (T S )−65°C to +150°CPower Dissipation (P D )Dual-In-Line 700 mW Small Outline 500 mW Lead Temperature (T L )(Soldering, 10 seconds)260°C Supply Voltage (V DD ) 3.0V to 15V Input Voltage (V IN )0 to V DD VOperating T emperature Range (T A )CD4043BC, CD4044BC−40°C to +85°CSymbol ParameterConditions−40°C +25°C +85°C Units MinMax MinTyp Max MinMax I DDQuiescent V DD = 5V , V IN = V DD or V SS 200.0120150µA Device CurrentV DD = 10V , V IN = V DD or V SS 400.0140300µA V DD = 15V , V IN = V DD or V SS 800.0280600µA V OLLOW Level |I O | ≤ 1 µA, V IL = 0V , V IH = V DD Output VoltageV DD = 5.0V 0.0500.050.05V V DD = 10V 0.0500.050.05V V DD = 15V0.0500.050.05V V OHHIGH Level |I O | ≤ 1 µA, V IL = 0V , V IH = V DD Output VoltageV DD = 5.0V 4.95 4.95 5.0 4.95V V DD = 10V 9.959.95109.95V V DD = 15V14.9514.951514.95V V ILLOW Level |I O | ≤ 1 µAInput VoltageV DD = 5.0V , V O = 0.5V or 4.5V 1.5 2.25 1.5 1.5V V DD = 10V , V O = 1.0V or 9.0V 3.0 4.5 3.0 3.0V V DD = 15V , V O = 1.5V or 13.5V4.06.754.0 4.0V V IHHIGH Level |I O | ≤ 1 µAInput VoltageV DD = 5.0V , V O = 0.5V or 4.5V 3.5 3.5 3.5V V DD = 5.0V , V O = 1.0V or 9.0V 7.07.07.0V V DD = 15V , V O = 1.5V or 13.5V111111V I OLLOW Level V IL = 0V , V IH = V DD Output Current V DD = 5.0V , V O = 0.4V 0.520.440.880.36mA (Note 3)V DD = 10V , V O = 0.5V 1.3 1.1 2.20.9mA V DD = 15V , V O = 1.5V 3.6 3.0 6.0 2.4mA I OHHIGH Level V IL = 0V , V IH = V DD Output Current V DD = 5.0V , V O = 4.6V −0.52−0.44−0.32−0.36mA (Note 3)V DD = 10V , V O = 9.5V −1.3−1.1−0.8−0.9mA V DD = 15V , V O = 13.5V −3.6−3.0−2.4−2.4mAI INInput CurrentV DD = 15V , V IN = 0V −0.3−0.3−1.0µA V DD = 15V , V IN = 15V0.30.31.0µA 4C D 4043B C • C D 4044B CAC Electrical Characteristics (Note 4)T A = 25°C, C L = 50 pF , R L = 200k, input t r = t f = 20 ns, unless otherwise notedNote 4: AC Parameters are guaranteed by DC correlated testing.Timing WaveformsCD4043BCD4044BEnable TimingSymbol ParameterConditions Min Typ Max Units t PLH , t PHLPropagation Delay S or R to QV DD = 5.0V 175350ns V DD = 10V 75175ns V DD = 15V60120ns t PZH , t PHZPropagation Delay Enable to Q (HIGH)V DD = 5.0V 115230ns V DD = 10V 55110ns V DD = 15V4080ns t PZL , t PLZPropagation Delay Enable to Q (LOW)V DD = 5.0V 100200ns V DD = 10V 50100ns V DD = 15V4080ns t THL , t TLHTransition TimeV DD = 5.0V 100200ns V DD = 10V 50100ns V DD = 15V4080ns t WOMinimum SET or RESET Pulse WidthV DD = 5.0V 80160ns V DD = 10V 4080ns V DD = 15V2040ns C INInput Capacitance5.07.5pFCD4043BC • CD4044BCPhysical Dimensions inches (millimeters) unless otherwise noted16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow BodyPackage Number M16A16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm WidePackage Number M16DF a irch ild d o e s n o t a ssu m e a n y re spo n sib ility fo r u se o f a n y circu itry de scrib e d , n o circu it pa ten t lice nse s a re im p lie d a nd F a irch ild re se rv e s the rig h t a t a n y tim e w ith ou t n o tice to cha n g e sa id circu itry an d sp e cifica tio n s.C D 4043B C • C D 4044B C Q u a d 3-S T A T E N O R R /S L a t c h e s • Q u a d 3-S T A T E N A N D R /S L a t c h e sLIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORTDEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:1.Life support devices or systems are devices or systemswhich, (a) are intended for surgical implant into thebody, or (b) support or sustain life, and (c) whose failureto perform when properly used in accordance withinstructions for use provided in the labeling, can be rea-sonably expected to result in a significant injury to the user.2. A critical component in any component of a life support device or system whose failure to perform can be rea-sonably expected to cause the failure of the life support device or system, or to affect its safety or Physical Dimensions inches (millimeters) unless otherwise noted (Continued)16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” WidePackage Number N16E。

CD4502BMS中文资料

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.CD4502BMSCMOS Strobed Hex Inverter/BufferFeatures•High Voltage Type (20V Rating)• 2 TTL Load Output Drive Capability • 3 State Outputs•Common Output Disable Control •Inhibit Control•100% Tested for Quiescent Current at 20V •5V, 10V and 15V Parametric Ratings•Maximum Input Current of 1µA at 18V Over Full Pack-age Temperature Range; 100nA at 18V and +25o C •Noise Margin (Over Full Package/Temperature Range)-1V at VDD = 5V -2V at VDD = 10V - 2.5V at VDD = 15V •Meets All Requirements of JEDEC Tentative Standard No. 13B, “Standard Speciﬁcations for Description of ‘B’ Series CMOS Devices”Applications• 3 State Hex Inverter for Interfacing ICs with Data Buses •COS/MOS to TTL Hex BufferDescriptionCD4502BMS consists of six inverter/buffers with 3 state outputs. A logic “1” on the OUTPUT DISABLE input produces a high impedance state in all six outputs. This feature permits common busing of the outputs, thus simplifying system design. A Logic “1” on the INHIBIT input switches all six outputs to logic “0” if the OUTPUT DISABLE input is a logic “0”. This device is capable of driving two standard TTL loads, which is equivalent to six times the JEDEC “B” series IOL standard.The CD4502BMS is supplied in these 16-lead outline packages:Braze Seal DIP H4T Frit Seal DIPH1F Ceramic FlatpackH6WDecember 1992File Number3334PinoutCD4502BMS TOP VIEWFunctional Diagram14151691312111012345768D3Q3D13 STATEQ1D2VSSQ2VDD Q6D5INHIBIT Q5D4Q4D6OUTPUT DISABLEQ2Q17543 STATE VDD = 16VSS = 8OUTPUT DISABLED2D163INHIBIT12Q32D31Q49D410Q511D513Q614D615Absolute Maximum Ratings Reliability InformationDC Supply Voltage Range, (VDD) . . . . . . . . . . . . . . .-0.5V to +20V (Voltage Referenced to VSS Terminals)Input Voltage Range, All Inputs . . . . . . . . . . . . .-0.5V to VDD +0.5V DC Input Current, Any One Input . . . . . . . . . . . . . . . . . . . . . . . .±10mA Operating Temperature Range. . . . . . . . . . . . . . . .-55o C to +125o C Package Types D, F, K, HStorage Temperature Range (TSTG). . . . . . . . . . .-65o C to +150o C Lead Temperature (During Soldering) . . . . . . . . . . . . . . . . .+265o C At Distance 1/16 ± 1/32 Inch (1.59mm± 0.79mm) from case for 10s Maximum Thermal Resistance . . . . . . . . . . . . . . . .θjaθjc Ceramic DIP and FRIT Package. . . . .80o C/W20o C/W Flatpack Package . . . . . . . . . . . . . . . .70o C/W20o C/W Maximum Package Power Dissipation (PD) at +125o CFor TA = -55o C to +100o C (Package Type D, F, K). . . . . .500mW For TA = +100o C to +125o C (Package Type D, F, K) . . . . .DerateLinearity at 12mW/o C to 200mW Device Dissipation per Output Transistor . . . . . . . . . . . . . . .100mW For TA = Full Package Temperature Range (All Package Types) Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+175o CTABLE1.DC ELECTRICAL PERFORMANCE CHARACTERISTICSPARAMETER SYMBOL CONDITIONS(NOTE 1)GROUP ASUBGROUPS TEMPERATURELIMITSUNITSMIN MAXSupply Current IDD VDD = 20V, VIN = VDD or GND1+25o C-2µA2+125o C-200µAVDD = 18V, VIN = VDD or GND3-55o C-2µA Input Leakage Current IIL VIN = VDD or GND VDD = 201+25o C-100-nA2+125o C-1000-nAVDD = 18V3-55o C-100-nA Input Leakage Current IIH VIN = VDD or GND VDD = 201+25o C-100nA2+125o C-1000nAVDD = 18V3-55o C-100nA Output Voltage VOL15VDD = 15V, No Load1, 2, 3+25o C, +125o C, -55o C-50mV Output Voltage VOH15VDD = 15V, No Load (Note 3)1, 2, 3+25o C, +125o C, -55o C14.95-V Output Current (Sink)IOL5VDD = 5V, VOUT = 0.4V1+25o C 3.06-mA Output Current (Sink)IOL10VDD = 10V, VOUT = 0.5V1+25o C7.8-mA Output Current (Sink)IOL15VDD = 15V, VOUT = 1.5V1+25o C20.4-mA Output Current (Source)IOH5A VDD = 5V, VOUT = 4.6V1+25o C--0.53mA Output Current (Source)IOH5B VDD = 5V, VOUT = 2.5V1+25o C--1.8mA Output Current (Source)IOH10VDD = 10V, VOUT = 9.5V1+25o C--1.4mA Output Current (Source)IOH15VDD = 15V, VOUT = 13.5V1+25o C--3.5mA N Threshold Voltage VNTH VDD = 10V, ISS = -10µA1+25o C-2.8-0.7V P Threshold Voltage VPTH VSS = 0V, IDD = 10µA1+25o C0.7 2.8VFunctional F VDD = 2.8V, VIN = VDD or GND7+25o C VOH >VDD/2VOL <VDD/2VVDD = 20V, VIN = VDD or GND7+25o CVDD = 18V, VIN = VDD or GND8A+125o CVDD = 3V, VIN = VDD or GND8B-55o CInput Voltage Low(Note 2)VIL5VDD = 5V, VOH > 4.5V, VOL < 0.5V1, 2, 3+25o C, +125o C, -55o C- 1.5VInput Voltage High(Note 2)VIH5VDD = 5V, VOH > 4.5V, VOL < 0.5V1, 2, 3+25o C, +125o C, -55o C 3.5-VInput Voltage Low (Note 2)VIL15VDD = 15V, VOH > 13.5V,VOL < 1.5V1, 2, 3+25o C, +125o C, -55o C-4VInput Voltage High (Note 2)VIH15VDD = 15V, VOH > 13.5V,VOL < 1.5V1, 2, 3+25o C, +125o C, -55o C11-VTri-State Output Leakage IOZL VIN = VDD or GNDVOUT = 0VVDD = 20V1+25o C-0.4-µA2+125o C-12-µAVDD = 18V3 -55o C-0.4-µATri-State Output Leakage IOZH VIN = VDD or GNDVOUT = VDDVDD = 20V1+25o C-0.4µA2+125o C-12µAVDD = 18V3 -55o C-0.4µANOTES: 1.All voltages referenced to device GND, 100% testing being implemented.2.Go/No Go test with limits applied to inputs.3.For accuracy, voltage is measured differentially to VDD. Limitis 0.050V max.TABLE2.AC ELECTRICAL PERFORMANCE CHARACTERISTICSPARAMETER SYMBOL CONDITIONSGROUP ASUBGROUPS TEMPERATURELIMITSUNITSMIN MAXPropagation Delay Data or Inhibit to Output TPHL1VDD = 5V, VIN = VDD or GND(Note 1, 2)9+25o C-270ns10, 11+125o C, -55o C-365nsPropagation Delay Data or Inhibit to Output TPLH1VDD = 5V, VIN = VDD or GND(Note 1, 2)9+25o C-380ns10, 11+125o C, -55o C-513nsPropagation Delay Inhibit to Output TPHL2VDD = 5V, VIN = VDD or GND(Note 1, 2)9+25o C-270ns10, 11+125o C, -55o C-365nsPropagation Delay Inhibit to Output TPLH2VDD = 5V, VIN = VDD or GND(Note 1, 2)9+25o C-380ns10, 11+125o C, -55o C-513nsPropagation Delay Disable to Output TPHZ VDD = 5V, VIN = VDD or GND(Note 2, 3)9+25o C-120ns10, 11+125o C, -55o C-162nsPropagation Delay Disable to Output TPZH VDD = 5V, VIN = VDD or GND(Note 2, 3)9+25o C-220ns10, 11+125o C, -55o C-297nsPropagation Delay Disable to Output TPLZ VDD = 5V, VIN = VDD or GND(Note 2, 3)9+25o C-250ns10, 11+125o C, -55o C-338nsPropagation Delay Disable to Output TPZL VDD = 5V, VIN = VDD or GND(Note 2, 3)9+25o C-250ns10, 11+125o C, -55o C-338nsTransition Time TTHL VDD = 5V, VIN = VDD or GND(Note 1, 2)9+25o C-120ns 10, 11+125o C, -55o C-162nsTransition Time TTLH VDD = 5V, VIN = VDD or GND(Note 1, 2)9+25o C-200ns 10, 11+125o C, -55o C-270nsNOTES:1.CL = 50pF, RL = 200K, Input TR, TF < 20ns.2.-55o C and +125o C limits guaranteed, 100% testing being implemented.3.VDD = 5V,CL = 50pF, RL = 1K, Input TR, TF < 20ns.TABLE3.ELECTRICAL PERFORMANCE CHARACTERISTICSPARAMETER SYMBOL CONDITIONS NOTES TEMPERATURELIMITSUNITS MIN MAXSupply Current IDD VDD = 5V, VIN = VDD or GND1, 2-55o C, +25o C-1µA+125o C-30µAVDD = 10V, VIN = VDD or GND1, 2-55o C, +25o C-2µA+125o C-60µAVDD = 15V, VIN = VDD or GND1, 2-55o C, +25o C-2µA+125o C-120µA Output Voltage VOL VDD = 5V, No Load1, 2+25o C, +125o C,-55o C-50mVOutput Voltage VOL VDD = 10V, No Load1, 2+25o C, +125o C,-55o C-50mVOutput Voltage VOH VDD = 5V, No Load1, 2+25o C, +125o C,-55o C4.95-VOutput Voltage VOH VDD = 10V, No Load1, 2+25o C, +125o C,-55o C9.95-V Output Current (Sink)IOL5VDD = 5V, VOUT = 0.4V1, 2+125o C 2.16-mA-55o C 3.84-mAOutput Current (Sink)IOL10VDD = 10V, VOUT = 0.5V 1, 2, 4+125o C 5.4-mA -55o C 9.6-mA Output Current (Sink)IOL15VDD = 15V, VOUT = 1.5V 1, 2, 4+125o C 14.4-mA -55o C 25.2-mA Output Current (Source)IOH5A VDD = 5V, VOUT = 4.6V 1, 2+125o C --0.36mA -55o C --0.64mA Output Current (Source)IOH5B VDD = 5V, VOUT = 2.5V 1, 2+125o C --1.15mA -55o C --2.0mA Output Current (Source)IOH10VDD = 10V, VOUT = 9.5V 1, 2+125o C --0.9mA -55o C --1.6mA Output Current (Source)IOH15VDD =15V, VOUT = 13.5V 1, 2+125o C --2.4mA -55o C --4.2mA Input Voltage Low VIL VDD = 10V, VOH > 9V,VOL < 1V1, 2+25o C, +125o C,-55o C -3V Input Voltage High VIH VDD = 10V, VOH > 9V,VOL < 1V 1, 2+25o C, +125o C,-55o C+7-V Propagation Delay Data to Output TPHL1VDD = 10V 1, 2, 3+25o C -120ns VDD = 15V 1, 2, 3+25o C -80ns Propagation Delay Data to Output TPLH1VDD = 10V 1, 2, 3+25o C -180ns VDD = 15V 1, 2, 3+25o C -130ns Propagation Delay Inhibit to Output TPHL2VDD = 10V 1, 2, 3+25o C -120ns VDD = 15V 1, 2, 3+25o C -80ns Propagation Delay Inhibit to Output TPLH2VDD = 10V 1, 2, 3+25o C -180ns VDD = 15V 1, 2, 3+25o C -130ns Propagation Delay Disable to Output TPHZ VDD = 10V 1, 2, 4+25o C -80ns VDD = 15V 1, 2, 4+25o C -60ns Propagation Delay Disable to Output TPZH VDD = 10V 1, 2, 4+25o C -100ns VDD = 15V 1, 2, 4+25o C -80ns Propagation Delay Disable to Output TPLZ VDD = 10V 1, 2, 4+25o C -130ns VDD = 15V 1, 2, 4+25o C -110ns Propagation Delay Disable to Output TPZL VDD = 10V 1, 2, 4+25o C -110ns VDD = 15V 1, 2, 4+25o C -80ns Transition Time TTHL VDD = 10V 1, 2, 3+25o C -60ns VDD = 15V 1, 2, 3+25o C -40ns Transition Time TTLH VDD = 10V 1, 2, 3+25o C -100ns VDD = 15V 1, 2, 3+25o C -80ns Input Capacitance CINAny Inputs1, 2+25o C-7.5pFNOTES:1.All voltages referenced to device GND.2.The parameters listed on Table 3 are controlled via design or process and are not directly tested. These parameters are characterized on initial design release and upon design changes which would affect these characteristics.3.CL = 50pF, RL = 200K, Input TR, TF < 20ns.4.CL = 50pF, RL = 1K, Input TR, TF < 20ns.TABLE 3.ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued)PARAMETER SYMBOL CONDITIONSNOTES TEMPERATURELIMITSUNITS MIN MAXTABLE4.POST IRRADIATION ELECTRICAL PERFORMANCE CHARACTERISTICSPARAMETER SYMBOL CONDITIONS NOTES TEMPERATURELIMITSUNITS MIN MAXSupply Current IDD VDD = 20V, VIN = VDD or GND1, 4+25o C-7.5µA N Threshold Voltage VNTH VDD = 10V, ISS = -10µA1, 4+25o C-2.8-0.2V N Threshold VoltageDelta∆VTN VDD = 10V, ISS = -10µA1, 4+25o C-±1V P Threshold Voltage VTP VSS = 0V, IDD = 10µA1, 4+25o C0.2 2.8V P Threshold VoltageDelta∆VTP VSS = 0V, IDD = 10µA1, 4+25o C-±1VFunctional F VDD = 18V, VIN = VDD or GND1+25o C VOH >VDD/2VOL <VDD/2VVDD = 3V, VIN = VDD or GNDPropagation Delay Time TPHLTPLH VDD = 5V1, 2, 3, 4+25o C- 1.35 x+25o CLimitnsNOTES: 1.All voltages referenced to device GND.2.CL = 50pF, RL = 200K, Input TR, TF < 20ns.3.See Table 2 for +25o C limit.4.Read and RecordTABLE5.BURN-IN AND LIFE TEST DELTA PARAMETERS +25o C PARAMETER SYMBOL DELTA LIMIT Supply Current - MSI-1IDD± 0.2µAOutput Current (Sink)IOL5± 20% x Pre-Test Reading Output Current (Source)IOH5A± 20% x Pre-Test ReadingTABLE6.APPLICABLE SUBGROUPSCONFORMANCE GROUP MIL-STD-883METHOD GROUP A SUBGROUPS READ AND RECORDInitial Test (Pre Burn-In)100% 50041, 7, 9IDD, IOL5, IOH5AInterim Test 1 (Post Burn-In)100% 50041, 7, 9IDD, IOL5, IOH5AInterim Test 2 (Post Burn-In)100% 50041, 7, 9IDD, IOL5, IOH5A PDA (Note 1)100% 50041, 7, 9, DeltasInterim Test 3 (Post Burn-In)100% 50041, 7, 9IDD, IOL5, IOH5A PDA (Note 1)100% 50041, 7, 9, DeltasFinal Test100% 50042, 3, 8A, 8B, 10, 11Group A Sample 50051, 2, 3, 7, 8A, 8B, 9, 10, 11Group B Subgroup B-5Sample 50051, 2, 3, 7, 8A, 8B, 9, 10, 11, Deltas Subgroups 1, 2, 3, 9, 10, 11 Subgroup B-6Sample 50051, 7, 9Group D Sample 50051, 2, 3, 8A, 8B, 9Subgroups 1, 2 3NOTE:1. 5% Parameteric, 3% Functional; Cumulative for Static 1 and 2.TABLE7.TOTAL DOSE IRRADIATIONCONFORMANCE GROUPS MIL-STD-883METHODTEST READ AND RECORDPRE-IRRAD POST-IRRAD PRE-IRRAD POST-IRRADGroup E Subgroup 250051, 7, 9Table 41, 9Table 4Test Circuit and WaveformFIGURE 2.DISABLE DELAY TIMES TEST CIRCUIT AND WAVEFORMSTABLE 8.BURN-IN AND IRRADIATION TEST CONNECTIONSFUNCTION OPEN GROUND VDD 9V ± -0.5VOSCILLATOR50kHz25kHzStatic Burn-In 1Note 12, 5, 7, 9, 11, 141, 3, 4, 6, 8, 10, 12,13, 1516Static Burn-In 2Note 12, 5, 7, 9, 11, 1481, 3, 4, 6, 10, 12,13, 15, 16Dynamic Burn-In Note 1-8162, 5, 7, 9, 11, 1441, 3, 6, 10, 12, 13,15Irradiation Note 22, 5, 7, 9, 11, 1481, 3, 4, 6, 10, 12,13, 15, 16NOTES:1.Each pin except VDD and GND will have a series resistor of 10K ± 5%, VDD = 18V ± 0.5V2.Each pin except VDD and GND will have a series resistor of 47K ±5%; Group E, Subgroup 2, sample size is 4 dice/wafer, 0 failures,VDD = 10V ± 0.5VLogic DiagramFIGURE 1.LOGIC DIAGRAM OF 1 OF 6 IDENTICAL INVERTER/BUFFERSVDDVSSQ1DI ***3-STATE OUTPUT DISABLE INHIBIT INVERTER/BUFFER NO. 1VDD VSSTO 5 OTHERINVERTER/BUFFERS*ALL INPUTS ARE PROTECTED BY CMOS PROTECTION NETWORKTRUTH TABLEDISABLEINHIBITDn Qn 0001001001X 01XXZLogic 0 = Low Logic 1 = HighZ = High Impedance X = Don’t Care1415169131211101235768D3Q3D1Q1D2VSSQ2VDD Q6D5INHIBIT Q5D4Q4D6DISABLE4PULSE GENERATORACL 1k Ω0.01k µFVDDTEST CONDITIONS TEST PIN 15POINT A tPHZ VSS VSS tPLZ VDD VDD tPZL VDD VDD tPZHVSSVSS50%tPLZtPHZ10%90%tPZL tPZH VDD VOL VOH VSS50%10%90%Typical Performance CharacteristicsFIGURE 3.TYPICAL OUTPUT LOW (SINK) CURRENTCHARACTERISTICSFIGURE 4.MINIMUM OUTPUT LOW (SINK) CURRENTCHARACTERISTICSFIGURE 5.TYPICAL OUTPUT HIGH (SOURCE) CURRENTCHARACTERISTICSFIGURE 6.MINIMUM OUTPUT HIGH (SOURCE) CURRENTCHARACTERISTICSFIGURE 7.TYPICAL VOLTAGE TRANSFER CHARACTERISTICSFIGURE 8.TYPICAL POWER DISSIPATION AS A FUNCTIONOF INPUT FREQUENCY10V5VAMBIENT TEMPERATURE (T A ) = +25o CGATE-TO-SOURCE VOLTAGE (VGS) = 15V51015151********DRAIN-TO-SOURCE VOLTAGE (VDS) (V)1/6 O U T P U T L O W (S I N K ) C U R R E N T (I O L ) (m A )10V5VAMBIENT TEMPERATURE (T A ) = +25o CGATE-TO-SOURCE VOLTAGE (VGS) = 15V510157.55.02.510.012.515.0DRAIN-TO-SOURCE VOLTAGE (VDS) (V)1/6 O U T P U T L O W (S I N K ) C U R R E N T (I O L ) (m A )-10V-15VAMBIENT TEMPERATURE (T A) = +25o CGATE-TO-SOURCE VOLTAGE (VGS) = -5V0-5-10-15DRAIN-TO-SOURCE VOLTAGE (VDS) (V)-20-25-30-5-10-15O U T P U T H I G H (S O U R C E ) C U R R E N T (I O H ) (m A )-10V-15VAMBIENT TEMPERATURE (T A ) = +25o C-5-10-15DRAIN-TO-SOURCE VOLTAGE (VDS) (V)-5-10-15O U T P U T H I G H (S O U R C E ) C U R R E N T (I O H ) (m A )GATE-TO-SOURCE VOLTAGE (VGS) = -5VAMBIENT TEMPERATURE (T A ) = +25o CSUPPLY VOLTAGE (VDD) = 15V 10V5V 151050510152025INPUT VOLTAGE (VI) (V)O U T P U T V O L T A G E (V O ) (V )CL = 15pFCL = 50pF AMBIENT TEMPERATURE (T A ) = +25o CSUPPLY VOLTAGE (VDD) = 15V10V5V10V 864286422INPUT FREQUENCY (fI) (kHz)1001011021031048642864864286428642864210410310210105D I S S I P A T I O N PE R I N V E R T E R /B UF F E R (P D ) (µW )All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certiﬁcation.Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or speciﬁcations at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.For information regarding Intersil Corporation and its products, see web site CD4502BMSFIGURE 9.TYPICAL TRANSITION TIME AS A FUNCTION OFLOAD CAPACITANCE FIGURE 10.TYPICAL PROPAGATION DELAY TIME AS AFUNCTION OF LOAD CAPACITANCEChip Dimensions and Pad LayoutDimensions in parenthesis are in millimeters and are derived from the basic inch dimensions as indicated.Grid graduations are in mils (10-3 inch).METALLIZATION:Thickness: 11k Å−14k Å, AL.PASSIVATION:10.4kÅ - 15.6k Å, SilaneBOND PADS:0.004 inches X 0.004 inches MIN DIE THICKNESS:0.0198 inches - 0.0218 inchesTypical Performance Characteristics (Continued)AMBIENT TEMPERATURE (T A ) = +25o CLOAD CAPACITANCE (CL) (pF)02050T R A N S I T I O N T I M E (t T H L , t T L H ) (n s )SUPPL Y VOLTAGE (VDD) = 5V (tTLH)4060801001001505V (tTLH)10V (tTLH)10V (tTHL)15V (tTLH)15V (tTLH)AMBIENT TEMPERATURE (T A ) = +25o CLOAD CAPACITANCE (CL) (pF)2050P R O P A G A T I O N D E L A Y T I M E (t P L H , t P H L ) (n s )SUPPL Y VOLTAGE (VDD) = 5V (tPLH)4060801001001505V (tPHL)10V (tPLH)10V (tPHL)15V (tPLH)15V (tPHL)200250。

CD4044BDTE4资料

Data sheet acquired from Harris Semiconductor SCHS041D − Revised October 2003The CD4043B and CD4044B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (D, DR, DT, DW, DWR, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. 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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDSP BroadbandInterface Digital ControlLogic MilitaryPower Mgmt Optical NetworkingMicrocontrollers SecurityLow Power TelephonyWirelessVideo&ImagingWirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedPACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)CD4043BD ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4043BDE4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4043BDG4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4043BDR ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4043BDRE4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4043BDRG4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4043BDT ACTIVE SOIC D16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4043BDTE4ACTIVE SOIC D16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4043BDTG4ACTIVE SOIC D16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4043BDW ACTIVE SOIC DW1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4043BDWE4ACTIVE SOIC DW1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4043BDWG4ACTIVE SOIC DW1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4043BDWR ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4043BDWRE4ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4043BDWRG4ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4043BE ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4043BEE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type CD4043BF3A ACTIVE CDIP J161TBD A42SNPB N/A for Pkg Type CD4043BF3AS2534OBSOLETE CDIP J16TBD Call TI Call TI CD4043BM OBSOLETE SOIC D16TBD Call TI Call TICD4043BNSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4043BNSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4043BNSRG4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4043BPW ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4043BPWE4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4043BPWG4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)CD4043BPWR ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4043BPWRE4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4043BPWRG4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4044BD ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4044BDE4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4044BDG4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4044BDR ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4044BDRE4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4044BDRG4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4044BDT ACTIVE SOIC D16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4044BDTE4ACTIVE SOIC D16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4044BDTG4ACTIVE SOIC D16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4044BDW ACTIVE SOIC DW1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4044BDWE4ACTIVE SOIC DW1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4044BDWG4ACTIVE SOIC DW1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4044BDWR ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4044BDWRE4ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4044BDWRG4ACTIVE SOIC DW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4044BE ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4044BEE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4044BF ACTIVE CDIP J161TBD A42SNPB N/A for Pkg Type CD4044BF3A ACTIVE CDIP J161TBD A42SNPB N/A for Pkg Type CD4044BF3AS2534OBSOLETE CDIP J16TBD Call TI Call TI CD4044BM OBSOLETE SOIC D16TBD Call TI Call TICD4044BNSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4044BNSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4044BNSRG4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4044BPW ACTIVE TSSOP PW1690Green(RoHS&CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)CD4044BPWE4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4044BPWG4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4044BPWR ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4044BPWRE4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4044BPWRG4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant CD4043BDR SOIC D 162500330.016.4 6.510.3 2.18.016.0Q1CD4043BDWR SOIC DW 162000330.016.410.7510.7 2.712.016.0Q1CD4043BNSR SO NS 162000330.016.48.210.5 2.512.016.0Q1CD4043BPWR TSSOP PW 162000330.012.47.0 5.6 1.68.012.0Q1CD4044BDR SOIC D 162500330.016.4 6.510.3 2.18.016.0Q1CD4044BDWR SOIC DW 162000330.016.410.7510.7 2.712.016.0Q1CD4044BNSR SO NS 162000330.016.48.210.5 2.512.016.0Q1CD4044BPWRTSSOPPW162000330.012.47.05.61.68.012.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) CD4043BDR SOIC D162500333.2345.928.6 CD4043BDWR SOIC DW162000346.0346.033.0 CD4043BNSR SO NS162000346.0346.033.0 CD4043BPWR TSSOP PW162000346.0346.029.0 CD4044BDR SOIC D162500333.2345.928.6 CD4044BDWR SOIC DW162000346.0346.033.0 CD4044BNSR SO NS162000346.0346.033.0 CD4044BPWR TSSOP PW162000346.0346.029.0。

4050B中文资料

October 1987Revised January 1999CD4049UBC• CD4050BC Hex Inverting Buffer • Hex Non-Inverting Buffer © 1999 Fairchild Semiconductor Corporation DS005971.prf CD4049UBC • CD4050BCHex Inverting Buffer •Hex Non-Inverting BufferGeneral DescriptionThe CD4049UBC and CD4050BC hex buffers are mono-lithic complementary MOS (CMOS) integrated circuits con-structed with N- and P-channel enhancement modetransistors. These devices feature logic level conversionusing only one supply voltage (V DD). The input signal highlevel (V IH) can exceed the V DD supply voltage when thesedevices are used for logic level conversions. Thesedevices are intended for use as hex buffers, CMOS to DTL/TTL converters, or as CMOS current drivers, and at V DD=5.0V, they can drive directly two DTL/TTL loads over thefull operating temperature range.Featuress Wide supply voltage range: 3.0V to 15Vs Direct drive to 2 TTL loads at 5.0V over full temperatureranges High source and sink current capabilitys Special input protection permits input voltages greaterthan V DDApplications•CMOS hex inverter/buffer•CMOS to DTL/TTL hex converter•CMOS current “sink” or “source” driver•CMOS HIGH-to-LOW logic level converterOrdering Code:Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.Connection DiagramsPin Assignments for DIPCD4049UBCTop ViewCD4050BCTop ViewOrder Number Package Number Package DescriptionCD4049UBCM M16A16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” NarrowCD4049UBCN N16E16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” WideCD4050BCM M16A16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” NarrowCD4050BCN N16E16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide 2C D 4049U B C • C D 4050B CSchematic DiagramsCD4049UBC 1 of 6 Identical UnitsCD4050BC1 of 6 Identical UnitsCD4049UBC • CD4050BCAbsolute Maximum Ratings (Note 1)(Note 2)Recommended Operating Conditions (Note 2)Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed; they are not meant to imply that the devices should be operated at these limits. The table of “Recom-mended Operating Conditions” and “Electrical Characteristics” provides conditions for actual device operation.Note 2: V SS = 0V unless otherwise specified.DC Electrical Characteristics (Note 3)Note 3: V SS = 0V unless otherwise specified.Supply Voltage (V DD )−0.5V to +18V Input Voltage (V IN )−0.5V to +18V Voltage at Any Output Pin (V OUT )−0.5V to V DD + 0.5V Storage Temperature Range (T S )−65°C to +150°CPower Dissipation (P D )Dual-In-Line 700 mW Small Outline 500 mW Lead Temperature (T L )(Soldering, 10 seconds)260°C Supply Voltage (V DD )3V to 15V Input Voltage (V IN )0V to 15V Voltage at Any Output Pin (V OUT )0 to V DDOperating T emperature Range (T A )CD4049UBC, CD4050BC−40°C to +85°CSymbol ParameterConditions−40°C +25°C +85°C Units MinMax MinTyp Max MinMax I DDQuiescent Device CurrentV DD = 5V 40.03 4.030µA V DD = 10V 80.058.060µA V DD = 15V160.0716.0120µAV OLLOW Level Output VoltageV IH = V DD , V IL = 0V ,|I O | < 1 µA V DD = 5V 0.0500.050.05V V DD = 10V 0.0500.050.05V V DD = 15V0.050.050.05VV OHHIGH Level Output VoltageV IH = V DD , V IL = 0V ,|I O | < 1 µA V DD = 5V 4.95 4.955 4.95V V DD = 10V 9.959.95109.95V V DD = 15V14.9514.951514.95V V ILLOW Level Input Voltage |I O | < 1 µA(CD4050BC Only)V DD = 5V, V O = 0.5V 1.5 2.25 1.5 1.5V V DD = 10V , V O = 1V 3.0 4.5 3.0 3.0V V DD = 15V , V O = 1.5V4.0 6.75 4.0 4.0V V ILLOW Level Input Voltage |I O | < 1 µA(CD4049UBC Only)V DD = 5V, V O = 4.5V 1.0 1.5 1.0 1.0V V DD = 10V , V O = 9V 2.0 2.5 2.0 2.0V V DD = 15V , V O = 13.5V3.03.53.03.0V V IHHIGH Level Input Voltage |I O | < 1 µA(CD4050BC Only)V DD = 5V, V O = 4.5V 3.5 3.5 2.75 3.5V V DD = 10V , V O = 9V 7.07.0 5.57.0V V DD = 15V , V O = 13.5V11.011.08.2511.0V V IHHIGH Level Input Voltage |I O | < 1 µA(CD4049UBC Only)V DD = 5V, V O = 0.5V 4.0 4.0 3.5 4.0V V DD = 10V , V O = 1V 8.08.07.58.0V V DD = 15V , V O = 1.5V12.012.011.512.0V I OLLOW Level Output Current V IH = V DD , V IL = 0V (Note 4)V DD = 5V, V O = 0.4V 4.6 4.05 3.2mA V DD = 10V , V O = 0.5V 9.88.512 6.8mA V DD = 15V , V O = 1.5V29254020mA I OHHIGH Level Output Current V IH = V DD , V IL = 0V (Note 4)V DD = 5V, V O = 4.6V −1.0−0.9−1.6−0.72mA V DD = 10V , V O = 9.5V −2.1−1.9−3.6−1.5mA V DD = 15V , V O = 13.5V−7.1−6.2−12−5mA I INInput CurrentV DD = 15V , V IN = 0V −0.3−0.3−10−5−1.0µA V DD = 15V , V IN = 15V0.30.310−51.0µA 4C D 4049U B C • C D 4050B CDC Electrical Characteristics (Continued)Note 4: These are peak output current capabilities. Continuous output current is rated at 12 mA maximum. The output current should not be allowed to exceed this value for extended periods of time. I OL and I OH are tested one output at a time.AC Electrical Characteristics (Note 5)CD4049UBCT A = 25°C, C L = 50 pF , R L = 200k, t r = t f = 20 ns, unless otherwise specifiedNote 5: AC Parameters are guaranteed by DC correlated testing.AC Electrical Characteristics (Note 6)CD4050BCT A = 25°C, C L = 50 pF , R L = 200k, t r = t f = 20 ns, unless otherwise specifiedNote 6: AC Parameters are guaranteed by DC correlated testing.Symbol ParameterConditions Min Typ Max Units t PHLPropagation Delay Time V DD = 5V 3065ns HIGH-to-LOW LevelV DD = 10V 2040ns V DD = 15V 1530ns t PLHPropagation Delay Time V DD = 5V 4585ns LOW-to-HIGH LevelV DD = 10V 2545ns V DD = 15V 2035ns t THLT ransition Time V DD = 5V 3060ns HIGH-to-LOW LevelV DD = 10V 2040ns V DD = 15V 1530ns t TLHT ransition Time V DD = 5V 60120ns LOW-to-HIGH LevelV DD = 10V 3055ns V DD = 15V 2545ns C INInput CapacitanceAny Input1522.5pFSymbol ParameterConditions Min Typ Max Units t PHLPropagation Delay Time V DD = 5V 60110ns HIGH-to-LOW LevelV DD = 10V 2555ns V DD = 15V 2030ns t PLHPropagation Delay Time V DD = 5V 60120ns LOW-to-HIGH LevelV DD = 10V 3055ns V DD = 15V 2545ns t THLT ransition Time V DD = 5V 3060ns HIGH-to-LOW LevelV DD = 10V 2040ns V DD = 15V 1530ns t TLHT ransition Time V DD = 5V 60120ns LOW-to-HIGH LevelV DD = 10V 3055ns V DD = 15V 2545ns C INInput CapacitanceAny Input57.5pFCD4049UBC • CD4050BCSwitching Time WaveformsTypical ApplicationsCMOS to TLL or CMOS at a Lower V DDV DD1 ≥ V DD2In the case of the CD4049UBC the output drive capability increases with increasing input voltage. E.g., If V DD1 = 10V the CD4049UBC could drive 4 TTL loads. 6C D 4049U B C • C D 4050B CPhysical Dimensionsinches (millimeters) unless otherwise noted16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” NarrowPackage Number M16ACD4049UBC• CD4050BC Hex Inverting Buffer • Hex Non-Inverting Buffer LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:1.Life support devices or systems are devices or systemswhich, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea-sonably expected to result in a significant injury to the user.2. A critical component in any component of a life supportdevice or system whose failure to perform can be rea-sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.Physical Dimensions inches (millimeters) unless otherwise noted (Continued)16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” WidePackage Number N16EF a irch ild d o e s n o t a ssu m e a n y re sp o n sib ility fo r u se o f a n y circu itry d e scrib e d, no circu it p a te n t licen se s a re im p lie d an d F a irch ild re se rv e s th e rig h t a t an y tim e w itho u t n o tice to ch a n g e sa id circu itry a n d sp e cificatio n s.。

CD4046中文资料_数据手册_参数

CD4046B型号采用16铅密封双线陶瓷封装(F3Asuffix)、16铅双线塑料封装(Esuffix)、16铅小外径封装(nsr后缀)和16铅薄收缩小外径封装 (PW和PWR后缀)(1)营销状态值定义如下:ACTIVE:推荐用于新设计的产品设备。LIFEBUY:德州仪器公司宣布该设备将停产，终身购买期已经生效。NRND:不推荐用于新设计。该设备正在生产中，以支持现有客户，但TI不建议在新设计中使用该部件。预览:设备已宣布，但尚未投产。样品可能有也可能没有。过时的:TI已经停止生产该设备。(2)Eco Plan—可能目前不可用—请查看以获得最新的可用信息和额外的产品内容详细信息。没有:还没有可用的铅(Pb-Free)。无铅(RoHS): TI的术语“无铅”或“无铅”是指与所有6种物质的现行RoHS要求兼容的半导体产品，包括在均质材料中铅的重量不超过0.1%的要求。CD4046设计用于高温焊接的无钛pb产品适用于特定的无铅工艺。环保(RoHS &没有某人/ Br): TI定义“绿色”意味着“Pb-Free”,此外,使用包装材料,不含卤素,包括溴(Br)或锑(某人)总数的 0.1%以上产品的重量。(3)实验室,峰值温度。湿度敏感性级别评级根据JEDECindustry标准分类和soldertemperature峰值。重要信息和免责声明:本页所提供的信息代表德州仪器自提供之日起的知识和信念。TI的知识和信念基于第三方提供的信息，对于这些信息的准确性不作任何陈述或保证。目前正在努力更好地整合来自第三方的信息。TI已采取并将继续采取合理措施，提供具有代表性和准确的信息，但可能未对来料和化学品进行破坏性测试或化学分析。TI和TI供应商认为某些信息是专有的，因此CAS号码和其他有限的信息可能无法发布。在任何情况下，TI因该等信息而产生的责任都不应超过.CD4046客户在本文件中每年销售的TI部件的采购总价无铅 (RoHS): TI的术语“无铅”或“无铅”是指与当前所有6种物质的RoHS要求兼容的半导体产品，包括在均质材料中铅的重量不超过0.1% 的要求。设计用于高温焊接的无钛pb产品适用于特定的无铅工艺。无铅(免RoHS):该组件具有免RoHS的任何1)基于铅的倒装芯片焊料凸点之间使用的模具和封装，或2)基于铅的模具胶粘剂之间使用的模具和铅框架。否则，该CD4046组件被认为是如上定义的无pb (RoHS兼容)的。绿色(RoHS & no Sb/Br):TI定义“绿色”意味着Pb-Free (RoHS兼容),和自由的溴(Br)和(某人)锑阻燃剂(Br或某人不超过 0.1% weightin均质材料)(3)实验室,峰值温度。湿度敏感性级别评级根据电平行业标准分类,和峰值焊接温度。(4)CD4046可能有额外的标记,与标志,许多跟踪代码的信息,(5)多个设备标记将在括号内。只有一个设备标记包含在括号中，并以“~”分隔，将出现在一个设备上。如果一条线是缩进的，那么它是前一条线的延续，这两条线代表了该设备的整个设备标记。Finish选项由一条垂直的直线分隔。如果结束值超过最大列宽，则铅/球结束值可以绕成两行。重要信息和免责声明:本页所提供的信息代表德州仪器自提供之日起的知识和信念。TI的知识和信念基于第三方提供的信息，对于这些信息的准确性不作任何陈述或保证。目前正在努力更好地整合来自第三方的信息。TI已经并将继续采取合理措施，提供具有代表性和准确的信息，但可能没有对来料和化学品进行破坏性测试或化学分析。TI和 TI供应商认为某些信息是专有的，因此CAS编号和其他有限的信息可能无法发布。在任何情况下，TI因该等信息而产生的责任，都不应超过TI在本文件中每年向客户出售的TI务，只售原装现货库存，万联芯城电子元器件全国供应，专为终端生产，研发企业提供现货物料，价格优势明显，BOM配单采购可节省逐个搜索购买环节，只需提交BOM物料清单，商城即可为您报价，万联芯城完善的供应链体系能够满足多种报价需求，为客户节省成本，点击进入万联芯城。

cd4052中文资料_数据手册_参数

NOTE: When ordering, use the entire part number. The sufﬁxes 96 and R denote tape and reel. The sufﬁx T denotes a small-quantity reel of 250.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
-55 to 125 16 Ld SOIC
CD4051BNSR, CD4052BNSR, CD4053BNSR
-55 to 125 16 Ld SOP
CD4051BPW, CD4051BPWR, CD4052BPW, CD4052BPWR CD4053BPW, CD4053BPWR
-55 to 125 16 Ld TSSOP
- Digital . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3V to 20V
- Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≤20VP-P
[ /Title • Low ON Resistance, 125Ω (Typ) Over 15VP-P Signal Input (CD405 Range for VDD-VEE = 18V
1B,
• High OFF Resistance, Channel Leakage of ±100pA (Typ)
LOGIC LEVEL CONVERSION

CD4052,CD4053中文资料

+5 VDC to +15 VDC 0V to VDD VDC
−55℃ to +125℃
DC Electrical Characteristics 直流电气特性：
Symbol 符号
Parameter 数
参
Conditions
条件
−55℃ +25°
最小
最大
最小
典型
125℃
最大
最小
最大
Units 单位
−0.5 VDC to +18 VDC −0.5 VDC to VDD +0.5 VDC −65℃ to +150℃
700 mW 500 mW
Lead Temperature 焊接温度(TL) Soldering, 10 seconds)（焊接 10 秒）
260℃
Recommended Operating Conditions 建议操作条件： DC Supply Voltage 直流供电电压 (VDD) Input Voltage 输入电压 (VIN) Operating Temperature Range 工作温度范围 (TA) CD4051BC/CD4052BC/CD4053BC
CD4051,CD4052,CD4053 中文资料
模拟开关 CD4051,CD4052,CD4053 中文资料 CD4051/CC4051 是单 8 通道数字控制模拟电子开关，有三个二进控制输入端 A、B、C
和 INH 输入，具有低导通阻抗和很低的截止漏电流。幅值为 4.5～20V 的数字信号可控制峰值至 20V 的模拟信号。例如，若 VDD＝+5V，VSS＝0，VEE＝-13.5V，则 0～5V 的数字信号可控制-13.5～ 4.5V 的模拟信号。这些开关电路在整个 VDD-VSS 和 VDD-VEE 电源范围内具有极低的静态功耗，与控制信号的逻辑状态无关。当 INH 输入端＝“1”时，所有的通道截止。三位二进制信号选通 8 通道中的一通道，可连接该输入端至输出。

CD4522BE中文资料

cd4048中文资料

测试条件规范值参数55402585125单位ol输出低电平电压最大5010015050100150005oh输出高电平电压最小50100150501001504959951495il输入低电平电压最大054510901513550100150102025ih输入高电平电压最小4505901013515501001504080125oh输出高电平电流最小254695135505010015050501001502006416421806115401605113341304211281150360924maol输出低电平电流最小040515501001505010015006416420611540051133404211280360924ma1501500110dd电源电50100150501001500250510025051075150300oz15015015004120动态特性ta25
海纳电子资讯网ｗｗｗ．ｆｐｇａ－ａｒｍ．ｃｏｍ为您提供各种ＩＣ的应用资料

参数
tPLH tPHL
传输延迟时间
tPLH tPHL
输出转换时间
CI 输入电容（任一输入端）
逻辑图：
测试条件
VDD（V）
规范值
最小
最大
单位
CL＝50pF
5.0
－
300
ns
RL＝200k
10.0
130
tr＝20ns
15.0
tf＝20ns
海纳电子资讯网ｗｗｗ．ｆｐｇａ－ａｒｍ．ｃｏｍ为您提供各种ＩＣ的应用资料
CC4048------8 输入多功能门（3S，可扩展）
简要说明：
CC4048 是具有四个控制信号输入端的 8 输入门。三个二进制控制输入端 M0、

CD4041UBF中文资料

Data sheet acquired from Harris Semiconductor SCHS039C – Revised September 2003The CD4041UB types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes).IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDSP BroadbandInterface Digital ControlLogic MilitaryPower Mgmt Optical NetworkingMicrocontrollers SecurityLow Power TelephonyWirelessVideo&ImagingWirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedPACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)CD4041UBE ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4041UBEE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type CD4041UBF ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4041UBF3A ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4041UBM ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4041UBM96ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4041UBM96E4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4041UBM96G4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4041UBME4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4041UBMG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4041UBMT ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4041UBMTE4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4041UBMTG4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4041UBNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4041UBNSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4041UBNSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4041UBPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4041UBPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4041UBPWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4041UBPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4041UBPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4041UBPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant CD4041UBM96SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1CD4041UBNSR SO NS 142000330.016.48.210.5 2.512.016.0Q1CD4041UBPWRTSSOPPW142000330.012.47.05.61.68.012.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) CD4041UBM96SOIC D142500346.0346.033.0 CD4041UBNSR SO NS142000346.0346.033.0 CD4041UBPWR TSSOP PW142000346.0346.029.0。

4042 CMOS 四时钟控制 D 锁存器

40
6 75 4 0
40 V
VIH
l l High Level Input Voltage IO k 1 mA
VDD e 5V VO e 0 5V or 4 5V
35
3 5 2 75
35
V
VDD e 10V VO e 1V or 9V
70
70 55
70
V
VDD e 15V VO e 1 5V or 13 5V 11 0
Note 2 VSS e 0V unless otherwise specified Note 3 Being a latch the CD4042BM CD4042BC is not clock rise and fall time sensitive
Note 4 IOH and IOL are tested one output at a time
VDD e 10V VO e 0 5V
VDD e 15V VO e 1 5V
0 64
0 51 0 88
16
1 3 2 25
42
34 88
0 36
mA
09
mA
24
mA
IOH
High Level Output Current VIH e VDD VIL e 0V
(Note 4)
VDD e5V VO e 4 6V
0 0 05 0 0 05 0 0 05
0 05 V 0 05 V 0 05 V
VOH
l l High Level Output Voltage IO k 1 mA VIH e VDD VIL e 0V
VDD e 5V
4 95
VDD e 10V

CD4052BM中文资料

Recommended Operating Conditions
DC Supply Voltage (VDD) Input Voltage (VIN) Operating Temperature Range (TA) 4051BM 4052BM 4053BM 4051BC 4052BC 4053BC
Features
range of digital and analog signal levels digital 3 – 15V analog to 15Vp-p Low ‘‘ON’’ resistance 80X (typ ) over entire 15Vp-p signal-input range for VDDbVEE e 15V High ‘‘OFF’’ resistance channel leakage of g 10 pA (typ ) at VDDbVEE e 10V Logic level conversion for digital addressing signals of 3 – 15V (VDDbVSS e 3 – 15V) to switch analog signals to 15 Vp-p (VDDbVEE e 15V) Matched switch characteristics DRON e 5X (typ ) for VDDbVEE e 15V Very low quiescent power dissipation under all digitalcontrol input and supply conditions 1 mW (typ ) at VDDbVSS e VDDbVEE e 10V Binary address decoding on chip
2

CD系列芯片名称及解释

CD系列芯片名称及解释CD系列芯片资料CD4000 双3输入端或非门+单非门 TICD4001 四2输入端或非门 HIT/NSC/TI/GOLCD4002 双4输入端或非门 NSCCD4006 18位串入/串出移位寄存器 NSCCD4007 双互补对加反相器 NSCCD4008 4位超前进位全加器 NSCCD4009 六反相缓冲/变换器 NSCCD4010 六同相缓冲/变换器 NSCCD4011 四2输入端与非门 HIT/TICD4012 双4输入端与非门 NSCCD4013 双主-从D型触发器 FSC/NSC/TOSCD4014 8位串入/并入-串出移位寄存器 NSCCD4015 双4位串入/并出移位寄存器 TICD4016 四传输门 FSC/TICD4017 十进制计数/分配器 FSC/TI/MOTCD4018 可预制1/N计数器 NSC/MOTCD4019 四与或选择器 PHICD4020 14级串行二进制计数/分频器 FSCCD4021 08位串入/并入-串出移位寄存器 PHI/NSC CD4022 八进制计数/分配器 NSC/MOTCD4023 三3输入端与非门 NSC/MOT/TICD4024 7级二进制串行计数/分频器 NSC/MOT/TI CD4025 三3输入端或非门 NSC/MOT/TICD4026 十进制计数/7段译码器 NSC/MOT/TI CD4027 双J-K触发器 NSC/MOT/TICD4028 BCD码十进制译码器 NSC/MOT/TICD4029 可预置可逆计数器 NSC/MOT/TICD4030 四异或门 NSC/MOT/TI/GOLCD4031 64位串入/串出移位存储器 NSC/MOT/TICD4032 三串行加法器 NSC/TICD4033 十进制计数/7段译码器 NSC/TICD4034 8位通用总线寄存器 NSC/MOT/TICD4035 4位并入/串入-并出/串出移位寄存NSC/MOT/TI CD4038 三串行加法器 NSC/TICD4040 12级二进制串行计数/分频器 NSC/MOT/TICD4041 四同相/反相缓冲器 NSC/MOT/TICD4042 四锁存D型触发器 NSC/MOT/TICD4043 4三态R-S锁存触发器("1"触发) NSC/MOT/TI CD4044 四三态R-S锁存触发器("0"触发) NSC/MOT/TI CD4046 锁相环NSC/MOT/TI/PHICD4047 无稳态/单稳态多谐振荡器 NSC/MOT/TICD4048 4输入端可扩展多功能门 NSC/HIT/TICD4049 六反相缓冲/变换器 NSC/HIT/TICD4050 六同相缓冲/变换器 NSC/MOT/TICD4051 八选一模拟开关 NSC/MOT/TICD4052 双4选1模拟开关 NSC/MOT/TICD4053 三组二路模拟开关 NSC/MOT/TICD4054 液晶显示驱动器 NSC/HIT/TICD4055 BCD-7段译码/液晶驱动器 NSC/HIT/TI CD4056 液晶显示驱动器 NSC/HIT/TICD4059 “N”分频计数器 NSC/TICD4060 14级二进制串行计数/分频器 NSC/TI/MOT CD4063 四位数字比较器 NSC/HIT/TICD4066 四传输门 NSC/TI/MOTCD4067 16选1模拟开关 NSC/TICD4068 八输入端与非门/与门 NSC/HIT/TICD4069 六反相器 NSC/HIT/TICD4070 四异或门 NSC/HIT/TICD4071 四2输入端或门 NSC/TICD4072 双4输入端或门 NSC/TICD4073 三3输入端与门 NSC/TICD4075 三3输入端或门 NSC/TICD4076 四D寄存器CD4077 四2输入端异或非门 HITCD4078 8输入端或非门/或门CD4081 四2输入端与门 NSC/HIT/TICD4082 双4输入端与门 NSC/HIT/TICD4085 双2路2输入端与或非门CD4086 四2输入端可扩展与或非门CD4089 二进制比例乘法器CD4093 四2输入端施密特触发器 NSC/MOT/ST CD4094 8位移位存储总线寄存器 NSC/TI/PHICD4095 3输入端J-K触发器CD4096 3输入端J-K触发器CD4097 双路八选一模拟开关CD4098 双单稳态触发器 NSC/MOT/TICD4099 8位可寻址锁存器 NSC/MOT/STCD40100 32位左/右移位寄存器CD40101 9位奇偶较验器CD40102 8位可预置同步BCD减法计数器CD40103 8位可预置同步二进制减法计数器CD40104 4位双向移位寄存器CD40105 先入先出FI-FD寄存器CD40106 六施密特触发器 NSC\\TICD40107 双2输入端与非缓冲/驱动器HAR\\TI CD40108 4字×4位多通道寄存器CD40109 四低-高电平位移器CD40110 十进制加/减,计数,锁存,译码驱动 STCD40147 10-4线编码器 NSC\\MOTCD40160 可预置BCD加计数器 NSC\\MOTCD40161 可预置4位二进制加计数器 NSC\\MOTCD40162 BCD加法计数器 NSC\\MOTCD40163 4位二进制同步计数器 NSC\\MOTCD40174 六锁存D型触发器 NSC\\TI\\MOTCD40175 四D型触发器 NSC\\TI\\MOTCD40181 4位算术逻辑单元/函数发生器CD40182 超前位发生器CD40192 可预置BCD加/减计数器(双时钟) NSC\\TI CD40193 可预置4位二进制加/减计数器 NSC\\TICD40194 4位并入/串入-并出/串出移位寄存NSC\\MOT CD40195 4位并入/串入-并出/串出移位寄存NSC\\MOT CD40208 4×4多端口寄存器CD4501 4输入端双与门及2输入端或非门CD4502 可选通三态输出六反相/缓冲器CD4503 六同相三态缓冲器CD4504 六电压转换器CD4506 双二组2输入可扩展或非门CD4508 双4位锁存D型触发器CD4510 可预置BCD码加/减计数器CD4511 BCD锁存,7段译码,驱动器CD4512 八路数据选择器CD4513 BCD锁存,7段译码,驱动器(消隐)CD4514 4位锁存,4线-16线译码器CD4515 4位锁存,4线-16线译码器CD4516 可预置4位二进制加/减计数器CD4517 双64位静态移位寄存器CD4518 双BCD同步加计数器CD4519 四位与或选择器CD4520 双4位二进制同步加计数器CD4521 24级分频器CD4522 可预置BCD同步1/N计数器CD4526 可预置4位二进制同步1/N计数器CD4527 BCD比例乘法器CD4528 双单稳态触发器CD4529 双四路/单八路模拟开关CD4530 双5输入端优势逻辑门CD4531 12位奇偶校验器CD4532 8位优先编码器CD4536 可编程定时器CD4538 精密双单稳CD4539 双四路数据选择器CD4541 可编程序振荡/计时器CD4543 BCD七段锁存译码,驱动器CD4544 BCD七段锁存译码,驱动器CD4547 BCD七段译码/大电流驱动器CD4549 函数近似寄存器CD4551 四2通道模拟开关CD4553 三位BCD计数器CD4555 双二进制四选一译码器/分离器CD4556 双二进制四选一译码器/分离器CD4558 BCD八段译码器CD4560 "N"BCD加法器CD4561 "9"求补器CD4573 四可编程运算放大器CD4574 四可编程电压比较器CD4575 双可编程运放/比较器CD4583 双施密特触发器CD4584 六施密特触发器CD4585 4位数值比较器CD4599 8位可寻址锁存器。

C2404资料

Product Construction:Conductor:• Fully annealed tinned copper perASTM B-33• Fully annealed solid bare copper perASTM B-3, (C2754, C2755)Insulation:• Premium-grade, coIor-coded S-R PVCper UL 1061Jacket:• PVC, gray• Temperature Range: –20°C to +80°CApplications:• Public address systems• Intercoms• Remote control circuits• Suggested voltage rating: 300 voltsCompliances:• NEC Article 800 Type CM (UL: 75°C)• UL Style 2464 (UL: 80°C 300V)• CSA CMG (CSA: 60°C)• Designed to meet UL 70,000 BTU VerticalTray Flame Test• Passes CSA CMG Flame TestPackaging:• Please contact Customer Service forpackaging and color options*Capacitance between conductorsProduct Construction: Conductor:• 24 AWG fully annealed stranded tinnedcopper per ASTM B-33 Insulation:• Premium-grade, coIor-coded S-R PVCper UL 1061• Color Code: See charts below Jacket:• PVC, gray• Temperature Range: –20°C to +80°C Applications:• Public address systems• Intercoms• Internal telephones• Remote control circuits• Suitable for EIA RS-232 applications • Suggested voltage rating: 300 volts Features:• Easy to terminate• Excellent electrical properties• Tinned conductors provide excellentcorrosion resistance• Assists soldering applications Compliances:• NEC Article 800 Type CM (UL: 75°C)• UL Style 2464 (UL: 80°C, 300V)• UL Style 2576 (UL: 80˚C, 150V)• CSA CMG (CSA: 60°C)• Designed to meet UL 70,000 BTU Vertical Tray Flame Test• Passes CSA CMG Flame Test Packaging:• Please contact Customer Service forpackaging and color optionsProduct Construction:Conductor:• 22 AWG fully annealed, stranded tinnedcopper per ASTM B-33Insulation:• Premium-grade, coIor-coded S-R PVCper UL 1061• Color Code: See charts belowJacket:• PVC, gray• Temperature Range: –20°C to +80˚CApplications:• Public address systems• Intercoms• Internal telephones• Remote control circuits• Suitable for EIA RS-232 applications• Suggested voltage rating: 300 voltsFeatures:• Easy to terminate• Excellent electrical properties• Tinned conductors provide excellentcorrosion resistance• Assists soldering applicationsCompliances:• NEC Article 800 Type CM (UL: 75°C)• UL Style 2464 (UL: 80°C, 300V)• UL Style 2576 (UL: 80˚C, 150V)• CSA CMG (CSA 80°C)• Designed to meet UL 70,000 BTU VerticalTray Flame Test• Passes CSA CMG Flame TestPackaging:• Please contact Customer Service forpackaging and color options†CM-CSA CMG OnlyProduct Construction:Conductor:• 20 or 18 AWG fully annealed stranded,tinned copper per ASTM B-33Insulation:• Premium-grade, coIor-coded PVC perUL 1007• Color Code: See charts belowJacket:• PVC, gray• Temperature Range: –20˚C to +80°CApplications:• Public address systems• Intercoms• Internal telephones• Remote control circuits• Suitable for EIA RS-232 applications• Suggested voltage rating: 300 voltsCompliances:• NEC Article 800 Type CM (UL: 75°C)• UL Style 2464 (UL: 80°C, 300V)• UL Style 2576 (UL: 80˚C, 150V)• CSA CMG (CSA: 60°C)• Designed to meet UL 70,000 BTU VerticalTray Flame Test• Passes CSA CMG Flame TestPackaging:• Please contact Customer Service forpackaging and color options†CM (UL) c(UL), CSA CMG OnlyProduct Construction:Conductor:• 16 thru 12 AWG fully annealed strandedtinned copper per ASTM B-33Insulation:• Premium-grade, coIor-coded PVC• Color Code: See chart belowJacket:• PVC, gray• Temperature Range: –20°C to +80°CApplications:• Public address systems• Intercoms• Internal telephones• Remote control circuits• Suitable for EIA RS-232 applications• Suggested voltage rating: 300 voltsCompliances:• NEC Article 725 Type CL3 (UL: 75°C)• NEC Article 800 Type CM (UL: 75°C)• UL Style 2464 (UL: 80°C, 300V)• UL Style 2587 (UL: 90°C, 600V)• CSA CMG (CSA: 60°C)• Designed to meet UL 70,000 BTU VerticalTray Flame Test• Passes CSA CMG Flame TestPackaging:• Please contact Customer Service forpackaging and color options†CL3, UL2587, CSA CMH OnlyProduct Construction: Conductor:• 22 thru 18 fully annealed stranded tinnedcopper per ASTM B-33Insulation:• Premium-grade, coIor-coded PVC (18 AWG), S-R PVC (22 AWG)• Color Code: See chart belowJacket:• PVC, gray• Temperature Range: –20°C to +80°C Applications:• TV antenna rotor control• Satellite actuator control• Public address systems• Suggested voltage rating: 300 volts Features:• Tinned copper conductors provide excellent corrosion resistance• Assists with soldering applications Compliances:• NEC Article 800 Type CM (UL: 75°C)• UL Style 2464 (UL: 80°C, 300V)• CSA CMG (CSA: 60°C)• Designed to meet UL 70,000 BTU VerticalTray Flame Test• Passes CSA CMG Flame Test Packaging:• Please contact Customer Service forpackaging and color options。

CD4049UBNSR中文资料

NOTE: When ordering, use the entire part number. The sufﬁx R denotes tape and reel. The sufﬁx T denotes a small-quantity reel of 250.
Pinouts
CD4049UB (PDIP, CERDIP, SOIC, SOP, TSSOP) TOP VIEW
VCC 1 G=A 2
A3 H=B 4
B5 I=C 6
C7 VSS 8
16 NC 15 L = F 14 F 13 NC 12 K = E 11 E 10 J = D 9D
CD4050B (PDIP, CERDIP, SOIC, SOP) TOP VIEW
VCC 1 G=A 2
A3 H=B 4
B5 I=C 6
SOIC - Lead Tips Only
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speciﬁcation is not implied.
2
元器件交易网
CD4049UB, CD4050B
Absolute Maximum Ratings
Thermal Information

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The CD4042B types are supplied in 16-leadhermetic dual-in-line ceramic packages(F3A suffixes), 16-lead dual-in-line plasticpackage (E suffix), 16-lead small-outlinepackage s (D, DR, DT, DW, DWR, and NSRsuffixes), and 16-lead thin shrink small-outlinepackages (PW and PWR suffixes).Copyright 2003, Texas Instruments IncorporatedPACKAGING INFORMATIONOrderable DeviceStatus (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)CD4042BD ACTIVE SOIC D 1640Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM CD4042BDR ACTIVE SOIC D 162500Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM CD4042BDT ACTIVE SOIC D 16250Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM CD4042BDW ACTIVE SOIC DW 1640Pb-Free (RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIM CD4042BDWR ACTIVE SOIC DW 162000Pb-Free (RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIM CD4042BE ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC CD4042BF ACTIVE CDIP J 161None Call TI Level-NC-NC-NC CD4042BF3A ACTIVE CDIP J 161None Call TI Level-NC-NC-NC CD4042BM OBSOLETE SOIC D 16None Call TI Call TICD4042BNSR ACTIVE SO NS 162000Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM CD4042BPW ACTIVE TSSOP PW 1690Pb-Free (RoHS)CU NIPDAU Level-1-250C-UNLIM CD4042BPWRACTIVETSSOPPW162000Pb-Free (RoHS)CU NIPDAULevel-1-250C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -May not be currentlyavailable -please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead (Pb-Free).Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean "Pb-Free"and in addition,uses package materials that do not contain halogens,including bromine (Br)or antimony (Sb)above 0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM28-Feb-2005Addendum-Page 1元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。