10测试准入与准出准则

词汇表Glossary
系统验证测试System Verification Test
SVT
系统集成测试System Integration Test SIT 系统设计验证System Design Verification SDV 产品环境概况 product environment profile PEP 产品开发团队Offering Development Team PDT 主验证计划Master Validation Plan
MVP 渐增集成测试（流程）Incremental Integration Test (process)IIT 批量供货General Availability
GA 电磁兼容性Electromagnetic Compatibility EMC 工程更改Engineering Change
EC 设计更改请求Design Change Request DCR 决策评审点Decision Checkpoint
DCP 构建模块用户评估 Building Block User Evaluation BBUE 构建模块功能验证Building Block Functional Validation BBFV R&D-Template-Incremental Build and Test 开发阶段渐增Build 和测试模板-02.00.00 Page 1
测试阶段图
Test Phase Chart
渐增集成及测试
Incremental Integration and Testing
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进入标准
Entry Criteria
是否可以获取构建模块的初始功能规格？Building block initial functional specification available?
3构建模块的概要和详细设计是否完成？Building block high and low level design complete?
2对于新开发单板，SI 分析是否已完成？Building block simulation complete?
1日期Date
否No*是Yes
进入需求Entry Requirements
序号Number
构建模块Building Block ________________ 日期Date _______________完成人Completed by ____________________
构建模块功能验证进入标准
Building Block Functional Validation Entry Criteria
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正式的缺陷跟踪系统是否建立起来并且能够正常运转？
Official defect tracking system established and working?
8BBFV 的测试环境是否已准备好？BBFV hardware available?
7BBFV 要使用的验证工具是否准备好？Verification tools available?
6构建模块使用评估是否完成？（评估构建模块是否可用，是否已准备好）
Building Block Usage Evaluation (BBUE)complete?
5是否已经制定出测试进度安排，所有测试都标有起始日期？Has the test schedule been developed indicating all appropriate tests with start and end dates?
4* 标有“否”的项目应当提交IPMT 或其授权部门评审。

对照检查表Checklist
单板软件测试设计Embeded software test design
1.4
单板硬件测试设计Board hardware test design
1.3渐增BUILD 测试设计Incremental BUILD test design
1.2更新测试与验证计划Update Certification and Test Plan
1.1测试设计和计划更新Update test design and plan
1
备注Comment(s) *
否No
是Yes 测试活动Test Activity
序号Number 构建模块名称Building Block Name ________________ 日期Date _______________
完成人Completed by ____________________
构建模块功能验证测试活动对照检查表
Building Block Functional Validation Test Activities Checklist
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大规模逻辑测试Logic test
4.3
单板软件测试
Embeded software test 4.2单板硬件测试
Board hardware test 4.1单板测试Board test 4软件单元测试Software unit test 3软件代码审查
source code inspection 2.4大规模逻辑审查Logic review 2.3单板软件设计审查
Embeded software design review
2.2单板硬件设计审查Board hardware design review
2.1设计审查/检视
Design review/inspection 2软件单元测试设计Software unit test design 1.6逻辑测试设计Logic test design 1.5测试活动描述
Descriptions of Test Activities
进行渐增BUILD 测试的分析，渐增BUILD 测试所涉及的测试方案、测试用例的设计，以及进行评审等。

The incremental BUILD test analysis, accomplish the test design and test case,and review them.
渐增BUILD 测试设计Incremental BUILD test design
1.2
进行测试与验证计划的更新和补充。

Update the Certification & Test Plan.
更新测试与验证计划Update Certification and Test Plan
1.1更新测试与验证计划、进行渐增BUILD 测试设计、单板硬件测试设计、单板软件测试设计、逻辑测试设计、软件单元测试设计。

Update Certification and Test Plan,design the incremental BUILD test,Board hardware test design,Embeded
software test design,logical test design and software unit test.
测试设计和计划更新Update test design and plan
1
定义
要素
序号
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对软件进行单元测试。

Test the software unit.
软件单元测试Software unit test
3
针对软件代码进行审查。

Inspect the Source code.软件代码审查
source code inspection 2.4包括代码审查、单元测试结果审查和逻辑实现后结果、应用的审查。

Include code review,units test result review,result and application inspection after logic implemented.大规模逻辑审查Logic review
2.3
是为了早期发现、改正单板软件配套文档、程序代码中存在的错误、不足，优化、改进程序代码和完善配套文档。

包括模块级和整体代码审查，是检视活动的补充和延伸。

Inspect the code and related documents to find fault and defect 。

It is the supplement to formatl inspection.
单板软件设计审查
Embeded software design review
2.2
测试人员对单板硬件原理图、PCB 等设计文件作设计审查，在底层设计上保证测试对象功能实现上的可靠性与正确性。

包括EMC 、环境、安规、防护等工程特性的审查和器件降额使用、FMEA 分析等可靠性审查。

Testing member review design files of Board hardware
schematies and PCB.Essure the reliability and correctness of test objects function realization in low layer design.Include reviews and FMEA anlysis of engineer character such as EMC, environment,safety,etc.
单板硬件设计审查Board hardware design review
2.1
包括单板硬件设计审查、单板软件设计审查、逻辑设计审查、软件代码走读、系统设计审查等。

Includ Board hardware design inspection,embeded sofrware design inspection,logic design inspection,source code review,system design inspection
设计审查/检视
Design review/inspection
2
针对软件方面的单元测试的设计。

Design the software unit test.
软件单元测试设计Software unit test design 1.6包括逻辑集成仿真设计(含方案和用例设计、
TESTBENCH 开发调试)，逻辑在板的集成测试设计(含方案和用例设计)，进行测试设计的评审。

Including logic integrated simulation design( containing scheme and testcase design ,the development and
debugging of testbench),logic integrated test design on board (containing scheme and testcase) and review test design.逻辑测试设计Logic test design
1.5
包括进行单板软件测试方案、测试用例的设计，为单板软件测试开发测试代码，以及对测试设计进行评审。

Include Embeded software test scheme design and test case design. Develop test code for the test of Embeded software ,and review the test design .
单板软件测试设计Embeded software test design
1.4
包括进行单板硬件测试方案、测试用例的设计，为单板硬件测试开发测试代码，以及对测试设计进行评审。

Include Board hardware test scheme
Design and test case design,develop test code for the test of board hardware,and review test design.
单板硬件测试设计Board hardware test design
1.3
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包括对整个逻辑设计的集成仿真和上板的集成测试。

Including the integrated simulation of the whole logic and integration test on board .
大规模逻辑测试Logic test
4.3
是单板软件形成版本后的测试，包括底层硬件初始化及操作、代码级测试、系统资源测试、协议测试、性能测试、软件保护机制、极限条件测试、板间配合测试、单板软件功能验证等。

Include the code test and integrated test . Consisted of
firmware function test , performance test , protocol test , limited condition test , fault tolerance test , etc.
单板软件测试
Embeded software test
4.2
包括单板功能/性能、容错、容限、EMC 、环境、兼容性、板间配合等方面的测试。

Include board function,capability,tolerance,error
tolerance,EMC,environment,compatibility,match between boards test.
单板硬件测试
Board hardware test
4.1
测试人员依据测试方案和用例对设计对象做覆盖性的测试，检查单板设计的规范性，保证单板设计实现上的可靠性与正确性。

单板测试的活动包括单板硬件测试、单板软件测试、逻辑测试等。

Test members make general test for test objects according to test scheme and test case.Check the regulation of board
design,enssure the reliability and correctness of realization for board design.board test activities include Board hardware test,Embeded software test,logical test,etc.
单板测试Board test
4
退出标准Exit Criteria
是否所有发现的构建模块问题都被记录在正式的缺陷跟踪系统里了？
Have all known problems for the building blocks and system been reported in the official defect tracking system?
3BBFV 测试计划和活动是否成功地执行？BBFV test plans and procedures successfully executed?
2BBFV 发现问题需进行的设计更改（包括需求、规格、配置、缺陷等方面的更改）是否已执行？
Agreed to list of Design Change Requests implemented?
1日期Date
否No *
是Yes
退出要求
Exit Requirements
序号Number 系统名称System Name ____________________ 日期Date _____________完成人Completed by __________________________________构建模块功能验证退出标准
Building Block Functional Validation Exit Criteria
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SI 仿真中发现的问题是否在硬件测试中进一步得到确认？
If a card, has the electrical test been correlated with signal integrity simulation?
6BBFV 测试结果是否经过PDT 内部评审？Have the results of BBFV testing been communicated to the PDT?
5所有严重度为1的问题都得到了解决，遗留问题的加权密度Di 小于30，并且所有遗留的问题已经找到解决方案？（注：Di 的算法同TR4A 规格部分查检表的算法）
All severity 1,2,&3 problems closed and plans for severity 4 problems in-place?
4*注：标有“否”的项目需经由IPMT 或其授权部门或者其授权部门评审。

* Note: Items marked with a "no" are subject to review with the IPMT.
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系统设计验证
System Design Verification 进入标准
Entry Criteria
正式的缺陷跟踪系统是否建立起来并且能够正常运转？
Official defect tracking system established and working?
10
SDV 硬件（测试人员可以得到足够量的所有部件，或者如果没有的话，所有系统均有承诺的交付期，以符合SDV 时间表）以及SDV 非预装软件是否完成？
SDV hardware available (all parts available to testers in their required volumes for test or if not available, all systems with commIITed delivery dates in time to meet SDV schedule) and SDV non-preload software available that supports all system functions as stated in the System Functional Specifications and tested on SDV or functionally equivalent hardware?
9
SDV 所用的验证和测试工具是否已准备好？Verification and test tools available?
8是否建立了硬件和软件的级别控制？（即确认计划阶段的 测试与验证计划中的BUILD 划分是否准备好）
Level control for hardware and software established?7
具备基本功能的样机是否已完成？Functionally workable prototypes available?
6是否已制定关键活动的时间安排？
Schedule of key events available? (includes SDV
Testing Completion date which is the conclusion of 1st pass test cases with no blocks early enough to allow time for defect disposition and regression prior to SDV Exit.)5
是否已明确SDV 要求和测试计划？
SDV requirements and test plans distinctly identified?4SDV 系统中的所有构建模块是否都有构建模块功能规格是否都已实现？
Building block functional specifications available for all building blocks in SDVsystems?3
构建模块的概要和详细设计是否完成？
Building block high and low level design complete?2构建模块的仿真是否完成？
Building block simulation complete?
1日期Date
否No*是Yes 进入要求
Entry Requirements
序号Number
系统名称System Name ________________ 日期Date _______________完成人Completed by ____________________系统设计验证进入标准
System Design Verification Entry Criteria
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*注：标有“否”的项目需经由IPMT或其授权部门或者其授权部门评审。

* Items marked with a “no” are subject to review with the IPMT
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对照检查表Checklist
需要的特别测试Required special test
16
回归测试
Regression test 15可靠性强化测试
Reliability Enhance Test 14环境测试
Environment test 13热测试
Thermal test 12噪声测试Noise test 11安全测试Safety test 10电磁兼容性(EMC)测试EMC test 9容限/容错测试Tolerance test
8软件协议一致性测试Software protocol consistency test 7性能/指标测试
Performance/index test 6功能测试Function test 5模块/子系统软件测试Module/subsystem software test 4模块/子系统硬件测试Module/subsystem hardware test
3软件集成测试
Software integration test 2测试设计更新Update test design 1
备注
Comment(s) *
否No 是Yes 测试活动Test Activity
序号Number 构建模块名称Building Block Name ________________ 日期Date _______________
完成人Completed by ____________________
系统设计验证测试活动对照检查表
System Design Verification Test Activities Checklist
*注：标有“否”的项目要求在备注栏内说明情况
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* Note: Items marked with a "no" requires a reference entry in the Comment(s) field 测试活动描述
Description of Test Activities
分析子系统内部、外部接口，针对性地设计各种性能、指标等容限/容错测试用例，测试子系统的各种容限是否合理，冗余措施是否合适、全面，对异常操作是否具有保护、告警、恢复能力等。

analysis of the interface inside and outside,design some test case for the tolerance or edge of performance and characteristic ，to ensure the system ‘s tolerance is
reaonable,the redundance is suitable,the protect 、alarm or resume is consided
容限/容错测试Tolerance test
8
从软件方面测试产品对标准、协议的顺从性。

Certificate wheather the software of the system conform to the standard and the protocol.
软件协议一致性测试Software protocol consistency test 7验证子系统/系统对外的各项指标是否满足相关国标、规范要求；同时验证子系统/系统是否能够满足设计规格中对性能的要求。

Certificate wheather the subsystem/system indicators content with the internal/international standard; Verificate if the performance of the system conform to the design specification.
性能/指标测试
Performance/index test
6
本项测试 验证子系统功能是否符合设计规格要求并且可靠地实现。

Certificate wheather the subsystem functions is right and conform to the design specification.
功能测试Function test
5
包括模块/子系统软件功能验证、性能/指标测试、容错容限测试等等。

Include Software module/subsystem function test,Performance/Indicator test, tolerance test,etc.
模块/子系统软件测试Module/subsystem software test 4
包括模块/子系统硬件内部接口信号质量和时序的分析测试、板间配合测试、框间配合测试、硬件总线测试、电源测试、模块功能验证、模块及子系统内外接口指标测试等等。

Include the analysis and test of interface signal quality and time sequence 、test of cooperatability between board and module 、test of bus 、test of power 、test of module function 、interface test of module or subsystem .
模块/子系统硬件测试Module/subsystem hardware test
3
对软件模块及模块间接口进行集成测试。

Test the software module and the interface between them.软件集成测试
Software integration test 2对渐增BUILD 测试的计划、方案和用例进行更新完善。

Update test plan, test scheme and test case of the incremental BUILD test.
测试设计更新Update test design 1定义
要素
序号
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包括对版本修改部分及关联部分的审查和回归测试验证。

根据需要对回归修改部分的设计代码或文档进行检视、评审，确保更改的正确性；同时根据改动情况与可能影响范围，确定需要回归测试策略与范畴。

此项活动开展根据预算和时间安排以及风险因素等进行综合考虑与评估。

Include the inspection and test to ensure the function of module modified and related,.it’s include the design
inspection 、code peer review and the scope or strategy for regress test.the test to do should be taken in conside of the budget 、plan and the risk.
回归测试
Regression test
15
通过施加高强度的应力来加速暴露产品的问题，通过对问题的定位分析，及早采取纠正措施，从而使产品的可靠性得到增长。

包括高加速寿命试验HALT 、高加速应力试验HAST 等.
Apply high stress to the product to speed up the failure to expose and by locating and analysing the problem, we adopt corrective action and improve the reliability of product. The accelerated reliability test include High Accelerated Life Test and High Accelerated Stress Test.
可靠性强化测试
Reliability Enhance Test
14
对产品进行环境摸底测试，验证或改进产品的环境适应能力，使其达到设计要求。

包括低温、高温、温度变化、湿热、水、太阳辐射、大气腐蚀、砂尘、长霉、振动、冲击、碰撞、地震试验等。

Perform a thermal test to know the real situation of product,validate and improve the product thermal performance to meet the design requirements, including low temperature test,high temperature test, temperature cycling test, damp heat test, rain test, solar radiation test, fungus test, sand&dust test,salt fog test, vibration test, shock test, bump test and earthquake test.
环境测试
Environment test
13
对产品进行热摸底测试，作为验证并改进产品热性能的依据，使其达到设计要求
Perform a thermal test to know the real situation of product,validate and improve the product thermal performance to meet the design requirements
热测试
Thermal test
12
对产品的噪声进行摸底测试，验证或改进设计，使噪声限制在设计要求之内
Perform a noise test to know the real situation of product,validate and ruduce the product noise to meet the design requirements.
噪声测试Noise test
11
对产品进行安全摸底测试，验证或改进产品的安全性，使其达到设计要求
Perform a safety test to know the real situation of product,validate and improve the product safety to meet the design requirements.
安全测试Safety test
10
为保证系统满足相关的产品EMC 要求及法令法规要求，在整机EMC 测试前进行各种模块级和（或）单板级的EMC 预测试，用以验证系统设计的正确性。

To assure the system meet the related product EMC
requirements and statute/ regulation requierments, perform pre-EMC test in all of the module and board level before applying to the whole system to validate the system design.电磁兼容性(EMC)测试EMC test
9
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由PDT 来决定为了支持该产品，是否可能需要进行其他的测试。

some other needed test decided by product team .
需要的特别测试Required special test
16
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退出标准Exit Criteria
SDV 测试中缺少的硬件、软件的清单及其可获得日期是否已归档（区分哪些在GA 之前要求完成，哪些可以在其后完成）？
List of hardware, software, device drivers, and BIOS components unavailable for SDV testing and
availability documented (distinguish which ones are required for G.A. or the G.A. date will slip)?
7
所有严重度为1的问题都得到了解决，遗留问题的加权密度Di 小于20，并且所有遗留的问题已经找到解决方案？（注：Di 的算法同TR4A 规格部分查检表的算法）
For problems relating to the base system
configuration, all severity 1,2,&3 problems are closed and plans for severity 4 problems in place (all
remaining non-base system building blocks must be closed or cancelled by end of BBFV. Severity 1,2, &3 problems may be dispositoned as “accepted” if waiting for SIT hardware/software to verify the fix)?6
是否所有发现的构建模块问题都被记录在正式的缺陷跟踪系统里了？
Have all known problems for the building blocks and system been reported in the official defect tracking system?
5
所有SDV 测试计划和活动是否都已成功执行?All SDV test plans and procedures successfully executed (with no blocked test cases per the Master Validation Plan version 2.0 or higher)?
4
所有的系统软件（如业务处理器，等）都已开发完毕，功能都已实现？
All system software (e.g. Service Processor, etc.) have been fully developed with no missing functional support?
3
系统级的信号质量仿真与测试是否完成？
Signal Quality Simulation correlation to engineering model completed?
2
SDV 发现问题需进行的设计更改（包括需求、规格、配置、缺陷等方面的更改）是否已执行？Agreed to list of Design Change Requests implemented?
1
日期Date
否No*是Yes 退出要求
Exit Requirements
序号Number
系统名称System Name ________________ 日期Date ______________完成人Completed by ____________________________
系统设计验证退出标准
System Design Verification Exit Criteria
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PDT 宣布所有退出标准都已满足，如未满足，SDV 退出书中是否列出了获得批准的计划偏差？Declaration by the PDT that all exit criteria has been satisfied, and if not satisfied, approved plan deviations listed in the SDV Exit letter?
9
需要BBFV 的器件的BBFV 测试是否完成？如果没有，需要完成BBFV 的构建模块清单是否已归档，其中包括安排好的、SIT 回归开始之前的退出日期？
Is BBFV testing completed for components requiring BBFV? If not, has a list of building blocks still to complete BBFV been documented, with scheduled exit dates, prior to the start of SIT regression?8
*注：标有“否”的项目需经由IPMT 或其授权部门评审。

* Note: Items marked with a "no" are subject to review with the IPMT.
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系统集成测试
System Integration Test
进入标准
Entry Criteria
SDV 硬件（测试人员可以得到足够量的所有部件，或者如果没有的话，所有系统均有承诺的交付期，以符合SDV 时间表）以及SDV 非预装软件是否完成？
Manufacturing built hardware and software available (hardware, engineering code, and preload - all parts available to testers in their required volumes for test or if not available, all systems with commIITed delivery dates in time to meet SIT Schedule)?
7
机器类型和构建模块（即基线版本）是否已发布？Machine type model and building blocks released?6工具及测试方案是否已按要求进行更新并且可以获得？
Tools and test plans updated as required and available?
5
是否有支持退出SVT 或发货支持 的审批和PEP 方案？（即确认是否已完成的产品规格中是否包括了产品的实行运行条件，以便SIT 测试）
Plans in place for agency approvals and PEP that support SVT Exit or Ship Support?
4
是否已制定了关键活动的时间进度安排？
Schedule of key events available (includes SIT Testing Completion date which is the conclusion of test cases with no blocks early enough to allow time for defect disposition & regression prior to SIT Exit)?
3
所有严重度为1的问题都得到了解决，遗留问题的加权密度Di 小于20，并且所有遗留的问题已经找到解决方案？（注：Di 的算法同TR4A 规格部分查检表的算法）
Previously identified severity 1,2,&3 problems are closed and plans for severity 4 problems in place?2
是否可以得到已批准的出版物（即信息产品）草稿？
Approval draft level publications available?
1日期Date
否No*是Yes 进入要求
Entry Requirements
序号Number
系统名称System Name ________________ 日期Date _______________完成人Completed by ____________________
系统集成测试进入标准
System Integration Test Entry Criteria
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*注：标有“否”的项目需经由IPMT或其授权部门评审。

* Items marked with a “no” are subject to review with the IPMT.
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对照检查表Checklist
需要的特别测试Required special test
16
包装测试Packing test
15安全测试Safety test 14可靠性鉴定测试
Reliability certification test
13热测试
Thermal test 12噪声测试Noise test 11环境测试
Enviroment test 10电磁兼容性(EMC)测试EMC test 9回归测试
Regression test
8组网测试（含内部与外部设备组网测试）
Networking test(including interal and external equipment networking test)
7
可用性测试Usability test
6容限、容错测试Tolerance test 5软件协议一致性测试Software protocol consistency test 4系统性能/指标测试System performance /index test
3系统功能测试
System function test 2测试设计更新Update test design 1
备注
Comment(s) *
否No
是Yes
测试活动Test Activity 序号Number 系统名称System Name ________________ 日期Date _______________完成人Completed by ____________________系统集成测试测试活动对照检查表
System Integration Test Test Activity Checklist
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*注：标有“否”的项目要求在备注栏内说明情况
Note: Items marked with a "no" requires a reference entry in the Comment(s) field.测试活动描述
Description of Test Activities
该测试是面向产品使用者的测试，考察产品和用户的交互方式是否符合用户的使用习惯、产品是否具备可维护性、安全性、用户资料是否正确和完整，从用户实际使用的角度对产品的可用性进行评价。

The test is face to product user,review whether the product meet with the user’s custom,whether the product have maintainability,safety. Whether custom information
Is correct and integrity, assessment the product’s usability base on user’s application.
可用性测试Usability test
6
分析系统内部、外部接口，针对性地设计各种性能、指标等容限/容错测试用例，测试系统的各种容限是否合理，冗余措施是否合适、全面，对异常操作是否具有保护、告警、恢复能力等。

analysis of the interface inside and outside,design some test case for the tolerance or edge of performance and characteristic ，to ensure the system ‘s tolerance is
reaonable,the redundance is suitable,the protect 、alarm or resume is consided .
容限、容错测试Tolerance test
5
从软件方面测试产品对标准、协议的顺从性。

Certificate if the software of the system conform to the standard and the protocol.
软件协议一致性测试Software protocol consistency test 4验证系统对外的各项指标是否满足相关国标、规范要求。

同时对系统级性能进行测试，确认产品能够满足设计规格中对性能的要求。

Certificate if the system indicators content with the
internal/international standard; Verificate if the performance of the system conform to the design specification.系统性能/指标测试System performance /index test
3
对系统级功能进行全面验证，严格按照系统规格说明书，验证系统是否符合规格设计需求，功能是否可靠实现。

Certificate if the system functions is right and conform to the design specification.
系统功能测试
System function test
2
对渐增BUILD 测试的计划、方案和用例进行更新完善。

Update the test plan, test design and test case of the incremental BUILD test.
测试设计更新Update test design 1定义
要素
序号
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验证产品的设计是否达到了规定的可靠性要求。

仅在需要或用户的要求下进行，不作为转产鉴定的依据。

Validate the design satisfy the prescribed reliability
ruquirements. Performed only under the users’ demand or
necessary condition and is not the criterion for production.
可靠性鉴定测试
Reliability certification
test 13验证产品的热性能是否达到规定要求，并作为转产鉴定的依据，与摸底测试的要求不同。

相关的国际准入认证在此阶段进行。

Validate the products’ thermal performance and judge whether to prudoction, the items are the same as above, but condition and methods are different. Related international admittance authentication is on-going in this phase.热测试
Thermal test
12验证产品的噪声是否达到规定要求，并作为转产鉴定的依据，与摸底测试的要求不同。

相关的国际准入认证在此阶段进行。

Validate the products’ noise and judge whether to prudoction, the items are the same as above, but condition and methods are different. Related international admittance authentication is on-going in this phase.噪声测试
Noise test
11验证产品的环境适应性是否达到规定要求，并作为转产鉴定的依据，项目同摸底测试，但试验条件与方法不同。

相关的国际准入认证在此阶段进行。

Validate the products’ environmental adaptibility and judge whether to production, the items are the same as above, but condition and methods are different. Related international admittance authentication is on-going in this phase.环境测试
Enviroment test
10为保证系统满足相关的产品EMC 要求及法令法规要求，而进行的系统EMC 测试，确认与设计规格、认证要求、国际国内以及行业标准的符合性。

To assure the system meet the related product EMC requirements and statute/ regulation, perform system’s EMC test to accord with the design specifications, authentication ruquirements, domestic and international industry standard.电磁兼容性(EMC)测试
EMC test
9同6.15Same as 6.15回归测试Regression test 8
内部组网测试：验证本系统与公司相关产品选件、系统能否正常配合工作。

如与交换机、传输、时钟等设备的配合应用。

此项测试应考虑实际网上应用需求，选择相关产品典型版本进行兼容性测试。

外部组网测试：验证本系统与不同厂家设备选件、系统能否正常配合工作。

Internal networking test:Verificate whether the system work with other products’options and system,e.g.Transmission,switching,clock,etc.The test should take the actual requirement into account,make compatability test based on related products’ typical version. External networking test:Verificate whether the system is compatable with the system or options of different companies.组网测试（含内部与外
部设备组网测试）
Networking test(including
interal and external
equipment networking
test)
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同6.16Same as 6.16
需要的特别测试
Required special test 16验证产品包装是否达到了包装设计要求，并作为转产的依据。

Validate the products’ packing performance and judge whether to prudoction.包装测试
Packing test
15验证产品的安全性能是否达到规定要求，并作为转产鉴定的依据，与摸底测试的要求不同。

相关的国际准入认证在此阶段进行。

Validate the products’ safety performance and judge whether to prudoction, the items are the same as above, but condition and methods are different. Related international admittance authentication is on-going in this phase.安全测试
Safety test
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退出标准
Exit Criteria 是否重新确认用新的或者返工软件和硬件工具所做
成的硬件器件能很好地用在产品上并且符合规格？
（即回归测试是否通过）
Reverification that hardware components built with
new or reworked soft and hard tools fit in the Offering
as planned and conform to specifications?
8SIT 发现问题需进行的设计更改（包括需求、规格、配置、缺陷等方面的更改）是否都已实现？All Engineering Changes implemented?7
退出SIT 后的版本更新计划是否发布？Plan for updates received after SIT exit to be included on bulletin board system (BBS) and/or in preload?6
华为制造部门为预装每个操作系统，是否可以获取第一语言用户发货级软件预装器件来建造成制造像？（即开发的软件和预装操作系统配合测试是否已通过？）First language customer ship level software preload components available to be built into a manufacturing image for each operating system to be preloaded by Huawei manufacturing? 5
所有严重度为1的问题都得到了解决，遗留问题的加权密度Di 小于12，并且所有遗留的问题已经找到解决方案？（注：Di 的算法同TR6规格部分查检表的算法）All severity 1,2,&3 problems closed and plans for severity 4 problems in place?4
所有发现的构建模块和系统问题都记录在正式的缺陷跟踪系统？All known problems for building blocks and system reported in the official defect tracking system?3
所有BBFV 、SDV 和SIT 测试计划（包括回归测试）和程序是否都已成功实施，测试用例都已被执行？All BBFV, SDV, & SIT test plans, including regression testing, and procedures successfully executed with no blocked test cases?2
是否承诺在承诺的发货期之前完成认证审批计划?Agency approval plans commIITed to support completion before commIITed ship date?1
日期Date
否No*是Yes 退出要求Exit Requirements 序号
Number 系统名System Name __________________________ 日期Date ____________完成人Completed by ______________________
系统集成测试退出标准
System Integration Test Exit Criteria
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