MSAU401中文资料

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EasyPactMVS

MasterPact MTE
分断能力 Icu(kA)
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MTE_ 分类
MTEN04 MTEN06 MTEN08 MTEN10 MTEN12 MTEN16 MTEN20 MTEN25 MTEN32 MTEN40 MTEH06 MTEH08 MTEH10 MTEH12 MTEH16 MTEH20 MTEH25 MTEH32 MTEH40 MTEN04 MTEN06 MTEN08 MTEN10 MTEN12 MTEN16 MTEN20 MTEN25 MTEN32 MTEN40 MTEH06 MTEH08 MTEH10 MTEH12 MTEH16 MTEH20 MTEH25 MTEH32 MTEH40 MTEN04 MTEN06 MTEN08 MTEN10 MTEN12 MTEN16 MTEN20 MTEN25 MTEN32 MTEN40 MTEH06 MTEH08 MTEH10 MTEH12 MTEH16 MTEH20

陶瓷基复合材料超高温冷热冲击试验

陶瓷基复合材料超高温冷热冲击试验刘宁夫; 蒋军亮; 丛琳华; 田敏【期刊名称】《《科学技术与工程》》【年(卷),期】2019(019)028【总页数】5页(P401-405)【关键词】冷热冲击试验; 辐射加热; 对流冷却; 有限元法【作者】刘宁夫; 蒋军亮; 丛琳华; 田敏【作者单位】中国飞机强度研究所西安710065【正文语种】中文【中图分类】V416.4陶瓷基复合材料以其优异的耐高温、抗氧化和抗腐蚀等性能在航空航天和其他工业领域得到广泛的应用和关注,然而由于陶瓷材料的脆性本征,严重制约了其优异的高温性能的发挥。

研究表明[1],陶瓷构件和结构失效的原因主要包括两类:热冲击和接触损伤,其中由热冲击导致的陶瓷构件失效占到约1/3,如美国哥伦比亚航天飞机失事的主要原因就是表面陶瓷隔热瓦受热冲击剥落导致。

在陶瓷材料抗冷热冲击性能研究方面,武小峰等以裂纹间距和深度作为变量,利用最小能量原理,发展了热冲击裂纹间距预测的有限元方法,并通过水淬法研究了裂纹间距与热冲击温差之间的关系[2]；陶永强等[3]利用燃气急热试验研究了材料热冲击开裂机理和裂纹间距、深度预报。

目前评价材料抗热冲击性能最常见的试验方法是水淬法和两厢法。

水淬法通过将材料淬火/淬水后的剩余强度和临界淬火/淬水温差评价材料的抗热冲击性能,但水淬法试验过程中表面热交换速率明显高于材料真实使用状态。

两厢法通过将材料在高低温环境箱内循环移动达到对高温低温环境的模拟[4],但环境箱无法模拟陶瓷材料在瞬态气动加热状态下的热环境。

由于陶瓷基复合材料在航空航天结构应用时,受气动加热影响,其始终处于一种单面受热的状态[5—7],因此热冲击试验常用的水淬法和两厢法对于陶瓷基复合材料的热冲击试验模拟并不适用,本文采用的石英灯红外辐射的加热方式模拟陶瓷基复合材料的热冲击试验,可以精确、快速地控制材料表面的瞬时温度和热流密度[8，9],在单面热冲击试验具有广泛的应用价值。

优美斯（Optimax Systems）的相位平移干扰光学测量方法白皮书说明书

The Effect Of Phase Distortion On InterferometricMeasurements Of Thin Film Coated Optical SurfacesJon Watson, Daniel SavageOptimax Systems, 6367 Dean Parkway, Ontario, NY USA*********************©Copyright Optimax Systems, Inc. 2010This paper discusses difficulty in accurately interpreting surface form data from a phase shifting interferometer measurement of a thin film interference coated surfaces.PHASE-SHIFTING INTERFEROMETRYPhase-shifting interferometry is a metrology tool widely used in optical manufacturing to determine form errors of an optical surface. The surface under test generates a reflected wavefront that interferes with the reference wavefront produced by the interferometer 1. A phase-shifting interferometer modulates phase by slightly moving the reference wavefront with respect to the reflected test wavefront 2 . The phase information collected is converted into the height data which comprises the surface under test3.Visibility of fringes in an interferometer is a function of intensity mismatch between the test and reference beams. Most commercially available interferometers are designed to optimize fringe contrast based on a 4% reflected beam intensity. If the surface under test is coated for minimum reflection near or at the test wavelength of the interferometer, the visibility of the fringe pattern can be too low to accurately measure.OPTICAL THIN-FILM INTERFERENCE COATINGSOptical thin-film interference coatings are structures composed of one or more thin layers (typically multiples of a quarter-wave optical thickness) of materials deposited on the surface of an optical substrate.The goal of interference coatings is to create a multilayer film structure where interference effects within the structure achieve a desired percent intensity transmission or reflection over a given wavelength range.The purpose of the coating defines the design of the multilayer structure. Basic design variables include:• Number of layers• Thickness of each layer• Material of each layerThe most common types of multilayer films are high reflector (HR) and anti-reflection (AR) coatings. HR coatings function by constructively interfering reflected light, while AR coatings function by destructively interfering reflected light. These coatings are designed to operate over a specific wavelength range distributed around a particular design wavelength.To produce the desired interference effects, thin-film structures are designed to modulate the phase of the reflected or transmitted wavefront. The nature of the interference effect depends precisely on the thickness of each layer in the coating as well as the refractive index of each layer. If the thickness and index of each layer is uniform across the coated surface, the reflected wavefront will have a constant phase offset across the surface. However, if layer thicknesses or index vary across the coated surface, then the phase of thereflected wavefront will also vary. Depending on the design of the coating and the severity of the thickness or index non-uniformity, the distortion of the phase of the reflected wavefront can be severe. 4Layer thickness non-uniformity is inherent in the coating process and is exaggerated by increasing radius of curvature of the coated surface.5 All industry-standard directed source deposition processes (thermal evaporation, sputtering, etc) result in some degree of layer thickness non-uniformity.5 Even processes developed to minimize layer non-uniformity, such as those used at Optimax, will still result in slight layer non-uniformity (within design tolerance).TESTING COATED OPTICS INTERFEROMETRICALLYPhase-shifting interferometers use phase information to determine the height map of the surface under test. However, surfaces coated with a thin-film interference coating can have severe phase distortion in the reflected wavefront due to slight layer thickness non-uniformities and refractive index inhomogeneity. Therefore, the measured irregularity of a coated surface measured on a phase shifting interferometer at a wavelength other than the design wavelength, may not represent the actual irregularity of the surface. Even using a phase shifting interferometer at the coating design wavelength does not guarantee accurate surface irregularity measurements. If a coating has very low reflectance over any given wavelength range (such as in the case of an AR coating), the phase shift on reflection with wavelength will vary significantly in that range.7 Figure 1 shows an example of how the phase can vary with coating thickness variations.Figure 1In this particular case, if a point at the lens edge has the nominal coating thickness and the coating at lens center is 2% thicker, expect ~38° phase difference in the measurement (~0.1 waves). This will erroneous be seen as height by the interferometer, despite the actual height change in this case being less than 7nm (~0.01 waves). Also, depending on coating design, low fringe visibility may inhibit measurements.There is an extreme method to determine the irregularity of a thin-film interference coated surface by flash coating it with a bare metal mirror coating. A metal mirror coating is not a thin-film interference coating, and the surface of the mirror represents the true surface, This relatively expensive process requires extra time, handling, and potential damage during the metal coating chemical strip process.CONCLUSIONS•There can be practical limitations to getting accurate surface form data on coated optical surfaces due to issues with phase distortion and fringe visibility.•The issues are a function of thin film coating design particulars and the actual deposition processes.1 R.E. Fischer, B. Tadic-Galeb, P. Yoder, Optical System Design, Pg 340, McGraw Hill, New York City, 20082 H.H. Karow, Fabrication Methods For Precision Optics, Pg 656, John Wiley & Sons, New York City, 19933 MetroPro Reference Guide OMP-0347J, Page 7-1, Zygo Corporation, Middlefield, Connecticut, 20044 H.A. Macleod, Thin Film Optical Filters, Chapter 11: Layer uniformity and thickness monitoring, The Institute of Physics Publishing, 2001.5 R.E. Fischer, B. Tadic-Galeb, P. Yoder, Optical System Design, Pg 581, McGraw Hill, New York City, 2008。

AD4001 AD4005 数据手册说明书

16位、2 MSPS/1 MSPS 、精密差分SAR ADC数据手册AD4001/AD4005Rev. ADocument FeedbackInformation furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks andregistered trademarks are the property of their respective owners.One Technology Way, P .O. Box 9106, Norwood, MA 02062-9106, U.S.A.Tel: 781.329.4700 ©2017 Analog Devices, Inc. All rights reserved. Technical Support /cnADI 中文版数据手册是英文版数据手册的译文，敬请谅解翻译中可能存在的语言组织或翻译错误，ADI 不对翻译中存在的差异或由此产生的错误负责。

如需确认任何词语的准确性，请参考ADI 提供的最产品特性吞吐速率：2 MSPS/1 MSPS 可选INL ：±0.4 LSB （最大值）保证16位无失码低功耗9.5 mW (2 MSPS)，4.9 mW (1 MSPS)（仅VDD ） 80 μW (10 kSPS)，16 mW (2 MSPS)（总计）SNR ：典型值96.2 dB (1 kHz, V REF = 5 V)；典型值95.5 dB (100 kHz) THD ：典型值−123 dB (1 kHz, V REF = 5 V)；典型值−99 dB (100 kHz) 易用特性可降低系统功耗和复杂性输入过压箝位电路减少了非线性输入电荷反冲高阻态模式长采集阶段输入范围压缩快速转换时间支持很低的SPI 时钟速率 SPI 可编程模式、读/写能力、状态字差分模拟输入范围：±V REF0 V 至V REF （V REF 在2.4 V 至5.1 V 之间）单电源工作：1.8 V ，逻辑接口电压：1.71 V 至5.5 V SAR 架构：无延迟/流水线延迟，首次转换有效精确的首次转换保证工作：−40°C 至+125°CSPI/QSPI/MICROWIRE/DSP 兼容串行接口以菊花链形式连接多个ADC ，并能提供繁忙指示10引脚封装：3 mm × 3 mm LFCSP 、3 mm × 4.90 mm MSOP 封装应用自动测试设备机器自动化医疗设备电池供电设备精密数据采集系统概述AD4001/AD4005是低噪声、低功耗、高速、16位精密逐次逼近型寄存器(SAR)模数转换器(ADC)。

Schneider SW 2524-4024-4048 集成指南说明书

Schneider SW 2524-4024-4048, KiloVault Integration GuideIntroduction3 Notes on the SW31800 & 3600 HLX/CHLX4 Basic Settings4 Advanced Settings4HAB 7.5kWh6 Basic Settings6 Advanced Settings6 2100 PLC7 Basic Settings7 Advanced Settings7Resources8 SCP SW Menu Map8 InsightCloud SW Menus9 Links11IntroductionThis guide covers the recommended set-up and configuration of the Schneider Electric Conext SW Solar Hybrid Inverter System (120/240V) using the Conext System Control Panel and InsightCloud. We’ll only be covering battery related settings. In case you are using the Schneider Conext Gateway or InsightHome/Facility, these same settings are available there as well.You can download the SW Owners’ guide here:https:///SwUsersGuideIn that guide, document number 975-0638-01-01 Rev H, you can find an SCP menu map for both Basic and Advanced Settings. A menu map is also reproduced in the Resources section of this document.CAUTION:If you update the firmware on your Schneider Electric equipment, ALL the settings must be reverified. The programmed settings shown in the following tables must be applied based on desired Warranty/Cycle life. We recommend an 80% depth of discharge for our Lithium Iron Phosphate (LiFePO4 or LFP) batteries and a 50% depth of discharge for our PLC battery.Notes on the SW●As of this writing the SW 4048’s minimum high battery voltage disconnect (Hi Batt Cut Out) is 58V,slightly higher than the high voltage disconnect we recommend for 48V systems.●As of this writing, the Schneider Conext Gateway,InsightHome/Facility and InsightCloudapplication provide easier and greater control over the SW than is available through the ConextSystem Control Panel (SCP) or the Conext Combox. The Combox is being discontinued and there are no firmware updates planned for it and the SCP.The SCP provides minimal control over your system.●The maximum battery capacity for the SW is 1000Ah.●When using the SCP, the SW Advanced Settings are accessed by…○Selecting the SW on the Select Device menu○Press and release the Enter and Up Arrow and Down Arrow simultaneously. It may takea few tries to do this.○After performing this keypress,Advanced Settings appears at the top of the XW Pro Setup menu.○If you press and release Enter & Up Arrow & Down Arrow simultaneously again then Basic Settings will appear at the bottom of the Setup Menu●Put the SW into Standby Mode before changing any basic or advanced settings.○Critical loads will lose power and disconnect from the grid or generator when the SW is put into standby mode. To avoid this, place your system into Bypass before putting the SW intoStandby mode.●Put the SW into Operating Mode after changing the settings to save the changes.○If you put your system into Bypass, please remember to take it out of Bypass.1800 & 3600 HLX/CHLX Basic SettingsSetting Name1800 Setting3600 Setting24V48V24V48VBattery Type This will be overridden in Advanced SettingsBattery Capacity150Ah per Parallel String300Ah per Parallel StringMax Charge Rate Set to a percentageof 90A (the 4024max) so that whenadded to the solarcharge controlleramps, the sum is100A (per HLX inparallel)Set to a percentageof 45A (the 4048max) so that whenadded to the solarcharge controlleramps, the sum is100A (per HLX inparallel)Set to a percentageof 90A (the 4024max) so that whenadded to the solarcharge controlleramps, the sum is100A (per HLX inparallel)Set to a percentageof 45A (the 4048max) so that whenadded to the solarcharge controlleramps, the sum is100A (per HLX inparallel)Charge Cycle 2 Stage No FloatRecharge Volts (80% DoD)25.5V51V25.5V51V Low Battery Cutout24V48V24V48VAdvanced SettingsSetting Name1800 Setting3600 Setting24V48V24V48VInverter/Low Batt Cut Out24V48.0V24V48V Inverter/LBCO Delay 5 secondsInverter/LBCO Hysteresis0.5VInverter/High Batt Cut Out28.8V57.6V28.8V57.6V Charger/Batt Capacity150Ah per battery in parallel300Ah per battery in parallelCharger/Max Chg Rate Set to a percentageof 90A (the 4024max) so that whenadded to the solarcharge controlleramps, the sum is100A (per parallelstring)Set to a percentageof 45A (the 4048max) so that whenadded to the solarcharge controlleramps, the sum is100A (per parallelstring)Set to a percentageof 90A (the 4024max) so that whenadded to the solarcharge controlleramps, the sum is100A (per parallelstring)Set to a percentageof 45A (the 4048max) so that whenadded to the solarcharge controlleramps, the sum is100A(per parallelstring)Charger/Charge Cycle2-StageCharger/Default Batt Temp Warm (the default)Charger/Recharge Volts (80%DoD)25.5V51.0V25.5V51.0V Charger/Absorb Time 2 minutes or lessCharger/Batt Type CustomCharger/Custom/Eqlz Support DisabledCharger/Custom/Eqlz Voltage N/ACharger/Custom/Bulk Voltage28.2V56.4V28.2V56.4V Charger/Custom/Bulk Termination27.8V (.4V below Bulk)55.6V (.8V below Bulk)27.8V55.6V Charger/Custom/Absorb Voltage28.2V56.4V28.2V56.4V Charger/Custom/Float Voltage N/ACharger/Custom/Batt Temp Comp0 mV/°CHAB 7.5kWhPlease note: the KiloVault HAB 7.5kWh battery can only be used in 48V systems, so all settings are for the Conext 4048.Basic SettingsSetting Name Setting ValueBattery Type AGM (This will be overridden in Advanced Settings)Battery Capacity150Ah per HAB in parallelMaximum Charge Rate Set to a percentage of 45A (the 4048 max) so that when added to the solar charge controller amperage, the sum is 120A (per HAB in parallel)Charge Cycle2-StageRecharge Volts51.4VLow Battery Cut Out48.2VAdvanced SettingsSetting Name Setting Value Inverter/Low Batt Cut Out48VInverter/LBCO Delay 3 secondsInverter/LBCO Hysteresis2VInverter/High Batt Cut Out57VCharger/Battery Type CustomCharger/Batt Capacity150Ah per HAB in parallelCharger/Max Charge Rate Set to a percentage of 45A (the 4048 max) so that when added to the solar charge controller amperage, the sum is120A (per HAB in parallel)Charger/Charge Cycle 2 Stage No FloatCharger/Default Batt Temp WarmCharger/Recharge Volts for 80% DoD51.4VCharger/Absorb Time 2 minutes or lessCharger/Custom/Eqlz Support DisabledCharger/Custom/Eqlz Voltage N/ACharger/Custom/Bulk Voltage56.2VCharger/Custom/Bulk Termination Voltage55.4V (required to be at least 0.8V below Bulk) Charger/Custom/Absorb Voltage56.2VCharger/Custom/Float Voltage N/ACharger/Custom/Batt Temp Comp0 mV / °C2100 PLCBasic SettingsSetting Name24V48V Battery Type AGM (will be overridden in Advanced Settings) Battery Capacity180Ah per 2100 PLC in ParallelMax Charge Rate Set to a percentage of 90A (the 4024max) so that when added to the solarcharge controller amperage, the sum is100A (per PLC in parallel)Set to a percentage of 45A (the 4048 max) so that when added to the solar charge controller amperage, the sum is 100A (per PLC in parallel)Charge Cycle 3 Stage without a solar charge controller2 stage with a solar charge controllerRecharge Volts for 50% DoD24.6V49.2V Low Battery Cutout24V48VAdvanced SettingsSetting Name24V48V Inverter/Low Batt Cut Out24V48.0VInverter/LBCO Delay10 secondsInverter/LBCO Hysteresis2VInverter/High Batt Cut Out30V60VCharger/Batt Type CustomCharger/Batt Capacity180Ah per 2100 PLC in ParallelCharger/Max Chg Rate Set to a percentage of 90A (the 4024max) so that when added to the solarcharge controller amperage, the sum is100A (per PLC in parallel)Set to a percentage of 45A (the 4048max) so that when added to the solarcharge controller amperage, the sum is100A (per PLC in parallel)Charger/Charge Cycle 3 Stage without a solar charge controller 2 stage with a solar charge controllerCharger/Default Batt Temp Warm (the default)Charger/Recharge Volts (for 50% DoD)24.6V49.2VCharger/Absorb Time8 HoursCharger/Custom/Eqlz Support EnabledCharger/Custom/Eqlz Voltage28.4V (14.2V * 2)56.4V (14.1V * 4)Charger/Custom/Bulk Voltage28.4V (14.2V * 2)56.4V (14.1V * 4)Charger/Custom/Bulk Termination Voltage28V (required to be at least .4V below Bulk)55.6V (required to be at least .8V below Bulk) Charger/Custom/Absorb Voltage28.4V (14.2V * 2)56.4V (14.1V * 4)Charger/Custom/Float Voltage27.2V (13.6V*2)54.4V (13.6V * 4)Charger/Custom/Batt Temp Comp-3mV /°CResourcesSCP SW Menu MapInsightCloud SW MenusThese screenshots are from demonstration sites using random data on InsightCloud -https://To see this data for yourself and to practice using InsightCloud, point your web browser tohttps://, create an account,and create a new site using;●URN: urn:dev:opm:000054-Combox-587AC6N1CSWCL1●SERIAL NUMBER: SESA405035This Schneider demo site simulates a SW installation with a Schneider Conext MPPT 60 charge controller, a Conext battery monitor and a Conext Automatic Generator Start.Input any site name you wish, any date you want for the commissioning date and estimate the site, battery bank and inverter sizes using your preferred method. For this example, it was named Schneider Insight 2 Demo Site 1.From the InsightCloud home page click the demo site you set up above.On the Site Overview page, click “Configuration” to select the demo site you set up earlier.In the Device List, Click “Inverter Charger” to reveal the SW inverter. Click on one of them to load the settings control panel. To see all of the settings categories, click the “Collapse all” button. The settings mentioned above are all available here.LinksSW Installation Guide:●https:///SwInstallationGuideSW Owner’s Guide:●https:///SwOwnersGuideKiloVault HLX/CHLX Manual:●https:///static/datafiles/Others/KiloVault_HLX_Series_Manual_V2.1.2_April022021.pdf KiloVault HAB Manual:●https:///static/datafiles/Others/KLV%20HAB%20Installation%20and%20User%20Manual%20Rev%202.06.pdfKiloVault PLC Manual:●https:///static/datafiles/Others/KiloVault%202100%20PLC%20Installation%20and%20User%20Manual%20Rev%201.04.pdfRevised: 2021-05。

DNV-OS-C401(2010) 中文版(DNT部分)

2013年4月SECTION 3 NON-DESTRUCTIVE TESTING第三章无损检测1．General 通则1.1 Scope 范围1.1.1 This section gives requirements for non-destructive testing.本章节给出了无损探伤的要求。

2. Non-Destructive Testing (NDT) 无损探伤测试（NDT）2.1General 通则2.1.1Prior to commencement of fabrication the contractor shall submit a plan for NDT, NDT proce dures and documents for NDT inspectors’ certification for acceptance by the purchaser. The progr amme shall contain information and documents for planning, controlling and reporting在装配前，卖方必须向买方递交NDT 图，NDT 工艺文件以及NDT人员资格证，并经卖方接受。

这个程序必须包括计划、控制和报告DNT 的信息和文件。

2.1.2 The inspection categories shall be defined in accordance with DNV-OS-C101 Sec.4 or DNV-O S-C201 Sec.4 and shall be specified in relevant design drawings.检测类别应根据DNV-OS-C101第四节或DNV-OS-C201第四节来划分，并指定相关图纸。

2.1.3Welds shall be subject to NDT in progress with fabrication. The results of these activities shal l be consecutively reported to the purchaser.在制造过程中，焊缝质量主要依据无损探伤试验，试验结果应不断报告给买方。

Schneider Electric XUSL4E14F031N 产品数据手册说明书

T h e i n f o r m a t i o n p r o v i d e d i n t h i s d o c u m e n t a t i o n c o n t a i n s g e n e r a l d e s c r i p t i o n s a n d /o r t e c h n i c a l c h a r a c t e r i s t i c s o f t h e p e r f o r m a n c e o f t h e p r o d u c t s c o n t a i n e d h e r e i n .T h i s d o c u m e n t a t i o n i s n o t i n t e n d e d a s a s u b s t i t u t e f o r a n d i s n o t t o b e u s e d f o r d e t e r m i n i n g s u i t a b i l i t y o r r e l i a b i l i t y o f t h e s e p r o d u c t s f o r s p e c i f i c u s e r a p p l i c a t i o n s .I t i s t h e d u t y o f a n y s u c h u s e r o r i n t e g r a t o r t o p e r f o r m t h e a p p r o p r i a t e a n d c o m p l e t e r i s k a n a l y s i s , e v a l u a t i o n a n d t e s t i n g o f t h e p r o d u c t s w i t h r e s p e c t t o t h e r e l e v a n t s p e c i f i c a p p l i c a t i o n o r u s e t h e r e o f .N e i t h e r S c h n e i d e r E l e c t r i c I n d u s t r i e s S A S n o r a n y o f i t s a f f i l i a t e s o r s u b s i d i a r i e s s h a l l b e r e s p o n s i b l e o r l i a b l e f o r m i s u s e o f t h e i n f o r m a t i o n c o n t a i n e d h e r e i n .Product data sheetCharacteristicsXUSL4E14F031NXUSL type 4 - Finger protection - Std sensingrange - Hp = 310 mm, R=14mmProduct availability: Non-Stock - Not normally stocked in distribution facilityMainRange of product Preventa Safety detection Product or component typeSafety light curtain type 4Device short name XUSL4EOutput type2 safety outputs OSSD solid-state PNP arc suppres-sion)Product specific applica-tionFor finger protection [R] Resolution 0.55 in (14 mm)[Sn] nominal sensing distance3.28…19.69 Ft (1…6 m) by cabling 0.00…9.84 ft (0…3 m) by cabling [Hp] Height protected 12.20 in (310 mm)Number of beams 30Type of start / restart Manual Automatic External Device Moni-toring (EDM)Selected by wiringComplementaryDetection system Transmitter-receiver system Response time 5.5 msKit compositionAdjustable mounting bracket(s)1 receiver(s)1 transmitter(s)1 user guide with certificate of conformity on CD-ROM [EAA] effective aperture angle 2.5 ° at 3 mEmissionIR LED 0.000037402 in (950 nm)[Us] rated supply voltage 24 V DC +/- 20 %SupplyPower supply IEC 61496-1Power supply IEC 60204-1[Ie] rated operational current 2 ACurrent consumption42 mA no-load transmitter 83 mA no-load receiver 42 mA transmitter900 mA with maximum load receiver Output current limits 0.4 A safety outputs OSSD Output voltage 24 V Output circuit type DC Maximum voltage drop <0.5 VLocal signalling 1 multi-colour LED transmitter 2 dual colour LEDs receiverElectrical connection 1 male connector M12 5 pins transmitter 1 male connector M12 8 pins receiverFunction availableTestMuting through external safety module XPSLCMUT1160LED display of operating modes and faults Marking CEMaterialAluminium casingPolycarbonate front panel Polypropylene end caps Housing colourRed RAL 3000Fixing mode By fixing bracketsNet weight 1.54 lb(US) (0.7 kg)Offer type Standard distanceEnvironmentDirectives89/336/EEC - electromagnetic compatibility2002/95/EC - RoHS directive98/37/EEC - machinery89/655/EEC - work equipment2002/96/EC - WEEE directiveProduct certifications CULusCETÜVSafety level (correctly wired)Type 4 IEC 61496-1SIL 3 IEC 61508SILCL 3 IEC 62061Category 4 EN/ISO 13849-1PL = e EN/ISO 13849-1Optical characteristic Resistance to light disturbance EN/IEC 61496-2Mission time20 year(s)Safety reliability data PFHd = 1.27E-8 1/h IEC 61508Ambient air temperature for operation-10…55 °C (14…131 °F)-4…131 °F (-20…55 °C)Ambient air temperature for storage-31…158 °F (-35…70 °C)-25…70 °C (-13…158 °F)Relative humidity0…95 % without condensationIP degree of protection IP65IP67Shock resistance10 gn 16 ms IEC 61496-1Vibration resistance0.35 +/- 0.05 mm 10…55 Hz)IEC 61496-1Ordering and shipping detailsCategory22455 - LIGHT CURTAINS - XUSLDiscount Schedule DS2GTIN00785901735632Package weight(Lbs) 1.58 kg (3.49 lb(US))Returnability YesCountry of origin ITOffer SustainabilitySustainable offer status Green Premium productREACh Regulation REACh DeclarationEU RoHS Directive Pro-active compliance (Product out of EU RoHS legal scope)EU RoHS Decla-rationToxic heavy metal free YesMercury free YesRoHS exemption information YesEnvironmental Disclosure Product Environmental ProfileCircularity Profile End Of Life InformationContractual warrantyWarranty18 monthsDimensions Drawings DimensionsBrackets DimensionsMounting and Clearance Mounting and Clearance(1)Insert(2)Bracket(3)Washer(4)Spring washer(5)NutConnections and SchemaWiring DiagramsTransmitter Connections(1)+24 Vdc(2)Configuration_0(3)0 Vdc(4)Configuration_1(5)FEReceiver Connections(1)OSSD1(2)+ 24 V(3)OSSD2(4)Configuration_A(5)K1_K2 Feeback/Restart(6)Configuration_B(7)0 Vdc(8)FEReceiver Configurations and Operating ModesAutomatic Start/RestartWithout External Device Monitoring (EDM) feedback loopWith External Device Monitoring (EDM) feedback loopManual Start/RestartWithout External Device Monitoring (EDM) feedback loop(1)RestartWith External Device Monitoring (EDM) feedback loop(1)RestartConnecting to a Safety Interface1 :Click on Download & Documents2 :Click on Application solutionsTo have all connection schematics concerning our safety module, select "download and document" and download the file "Safety lightcurtains association with safety interfaces"。

RJMU401国密安全芯片数据手册说明书

⏹封装功能大容量增强型，基于ARM 安全智能卡内核的国密安全芯片内嵌SM1、SM2、SM3、SM4国密加密算法RJMU401数据手册⏹内核：高性能32位ARM SC100 CPU — 双总线架构，DMA 加速，快速中断响应— 支持ARM 和Thumb 指令集— 三级流水线— 采用软内核技术，防止外部对其进行扫描 — 采用小端存储格式— 主频为32MHz ，可进行3、4分频，系统默认工作频率8M ⏹存储器— 8KB ROM— 18K RAM— 128～550KB 的FLASH 存储器⏹时钟、复位和电源管理— 1.6V~5.5V 供电— CPU 时钟可由软件配置为内部时钟— 内置32 MHz 高速RC 振荡器，支持3/4分频 — 内置多功能时钟发生电路— 内置32 KHz 低功耗RC 振荡器 ⏹多达6个定时器— 3个16位通用定时器、— 1个ETU 定时器— 1个Wake-up 定时器— 1个32位看门狗定时器⏹多种密码算法— 对称算法：DES 、T-DES 、AES 、SM1、SM4— 非对称算法：RSA 、SM2— 摘要算法：SM3、SHA-256⏹安全特性— 存储保护单元（MPU ）— 频率检测功能— 存储总线检测功能，防FIA 攻击 — 抗EMA/DEMA 攻击 — 硬件CRC16/32电路校验 — 硬件真随机发生器 — 防篡改检测电路 ⏹外围接口— 1路智能卡接口，符合ISO7816标准，支持T=0/T=1协议— 1路SWP 接口，速率高达1.2Mbps — 1路SPI 主从接口— 1路UART 接口— 高达15路GPIO ，支持多种中断方式，多达12路GPIO 可复用 ⏹应用市场— 城市一卡通PBOC 终端、一卡通、银行POS 机、移动无线支付等金融支付— SIM 卡、JA VA 卡、ESIM 卡等领域 — 嵌入式软件安全保护— 手机、通信模块、路由器、对讲机等数据加密 — 监控设备、自动化控制 VSOP8LSSOP20L1.1概述 (3)1.2系统架构 (4)2、性能参数 (6)2.1处理器系统 (6)2.2存储单元 (6)2.3中断控制器 (7)2.4时钟与定时器 (7)2.5安全性及物理防护 (8)2.6对外接口 (10)2.7算法性能 (11)2.8模块功耗性能 (12)2.9其他模块 (14)2.10模拟模块 (14)3、引脚定义 (15)3.1引脚定义图：SSOP_20L (15)3.2引脚定义图：VSOP_8L (16)4、接口电气特性 (17)4.1测试条件 (17)4.1.1 最小和最大数值 (17)4.1.2 典型数值 (17)4.27816接口电气特性 (17)4.2.1绝对最大额定值 (18)4.3SPI接口电气参数 (18)4.3.1绝对最大额定值 (19)5、电源模块设计及工作条件 (21)5.1电源电路模块设计 (21)5.2推荐工作参数 (22)6 、SPI功能描述 (23)6.1概述 (23)6.2时钟信号的相位和极性 (23)7、应用电路图 (25)7.1RJMU401FHO与STM32F103的7816参考电路 (25)7.2RJMU401FHO的SPI参考电路 (25)7.3RJMU401EHV与STM32F103的7816参考电路 (26)8、电气特性 (27)9、芯片封装信息 (28)10、订货信息 (30)附录一：简称及缩略语 (32)1、简介1.1 概述RJMU401安全芯片是一个基于32位RISC处理器的SOC芯片，具备高处理能力、高安全性、低功耗、低成本等特点。

掩蔽与解蔽法螯合滴定测定钙镁

3 实验结果与讨论
3. 1 HAA 的用量与反应用 HAA 掩蔽 Mg2 + 、螯合滴定 Ca2 + ,而 Mg2 + 与
HAA 生成 Mg (AA) 2 螯合物 : Mg2 + + 2 HAA →Mg (AA) 2 + 2 H +
在加热条件下 ,乙酰丙酮的羰基与铵氨发生加成、脱水反应〔5〕:
2 实验方法
2. 1 主要试剂与仪器钙、镁标准溶液均为 2. 00 mg/ ml 。掩蔽剂 :50 ml 三乙醇胺 ( TEA) 溶液 (1 + 2) 中 ,
加入 2 g 酒石酸钾钠 ( Tart rate) 、1 g KF 、2 ml 乙二胺和 20 ml MPA (巯基丙酸或巯基丁二酸 MSA) ,摇匀 , 用 NaOH 溶液 (10 %) 调整 p H 9. 5 左右。
10 ml 掩蔽剂 ,效果最佳。本实验选用 5 ml 掩蔽剂 , 4 实际应用
极为适宜。
3. 4 指示剂的选择与用量文献提出“三色激励彩色对螯合滴定钙常用五种
指示剂”〔10〕和“螯合滴定 Mg2 + 指示剂颜色变化与筛选〔11〕的启发下 ,进行了实验研究。实验结果表明 ,选用铬黑 T 、甲基红、百里酚酞 ,其配比为 7∶1∶1 的乙醇溶液 ,作混合指示剂 ,比文献〔10～11〕三色激励彩色作指示剂更加优越。实验也表明 ,在 50 ml 乙醇中加入 0. 35 g 铬黑 T 、0. 05 g 甲基红和 0. 05 g 百里酚酞为混合指示剂 ,加入 2～5 滴混合指示剂 ,终点颜色变化更加敏锐、清晰。本实验选用 4 滴混合指示剂 ,非常适宜。 3. 5 Ca2 + 、Mg2 + 的量与 ED TA 标准溶液消耗量的线性关系

中文Socomec Resys M40

否否否是否否
• •
预报警功能当故障电流超过动作值的 50％，预报警输出触点动作（若选）。当故障电流下降至预设值的 30％，该触点将自动复位。使用 DIP 开关 A 与 B 来选择继电器的动作方式。当选择正向安全，继电器通常处于励磁（闭合）状态，当发生故障时处于失磁（打开）状态。当选择负向安全，继电器通常处于失磁（打开）状态，当发生故障时处于励磁（闭合）状态。
The information provided in this literature is believed to be accurate (subject to change without prior notice); however, use of such information shall be 50m* m ax. entirely at the user’s own risk.
PDF 文件使用 "pdfFactory Pro" 试用版本创建
L1 L2 L3 N E
• 安装详图
30mm 44mm 49.5mm 63.5mm
1
2
3
4
5
6
7
*Dual voltage only available 只在 115V/230V AC 是作为 as 115V/230V AC. For 115V, connect across 双电源。 terminals 6 and 7 使用 115V 时连接端子 6 和 7。 For all other voltages, 使用其他电压等级电源时连接 connect across terminals 5 and 端子 5 和 7。 7.
标准:
A B C D
•

施耐德宝光微机保护产品选型手册说明书

Schneider Baoguang关于施耐德宝光施耐德（陕西）宝光电器有限公司（简称SSBEA或施耐德宝光）是施耐德电气有限公司与陕西宝光集团有限公司共同组建的一家专业从事中、系统及相关产品研发、生产和销售的中外合资企业。

高新科技园区。

在世界五百强企业与中国中压电器龙头企业的通力合作下，作为国内中压行业著名的“宝光”品牌真空断路器的唯一合法生产商，施耐德宝光秉承精益生产科学理念，凭借品质过硬、安全可靠的全系列高品质产品和覆盖用户全生命周期的完善服务，帮助用户实现卓越的生产运营绩效和市场竞争力，用品质的“不妥协”实现可持续发展之道。

我们致力于将施耐德宝光打造成为中国卓越和高效的中压断路器和系统的制造平台，依托自身的专业优势，为广大用户和合作伙伴提供领先的总成本和长期全面的安心保障。

目录V5系列新一代微机保护测控装置 (1)产品概述 (1)产品特点 (2)型号及功能说明 (3)保护功能 (4)测控功能 (6)技术参数 (7)典型接线图 (8)外形尺寸及面板开孔尺寸 (11)V5订货选型表 (12)V3系列微机保护测控装置 (13)产品概述 (13)产品特点 (14)型号及功能说明 (15)保护功能 (16)测控功能 (17)技术参数 (18)典型接线图 (19)外形尺寸及面板开孔尺寸 (21)V3订货选型表 (22)V3U微机综合保护装置 (23)产品概述 (23)型号及功能说明 (24)保护功能 (25)测控功能 (26)技术参数 (27)外形尺寸图/典型接线图 (28)后台系统 (29)系统总体结构 (30)V5系列新一代微机保护测控装置是一种用于测量、控制、保护、通讯一体化的智能设备，产品主要用于工业及能源领域对线路、变压器、电动机及电容器的保护测控。

此产品外观时尚、结构精巧、大屏幕液晶显示，图形化中文菜单，四位方向导航盘，操作快捷方便。

内部基于SOC芯片软件方案，32位处理器，并根据硬件进行深度改良优化的嵌入式操作系统，使CPU运行效率更高。

DL401中文资料

Manual D L401DL401100 MHz FADC1. Funktion (2)1.1. Übersicht (2)1.1.1. Anwendung (2)1.1.2. Daten (2)1.1.3. Besonderheiten (2)1.1.4. Aufbau (2)1.1.5. Stromversorgung (2)1.2. Blockdiagramm (3)1.3. Funktionsbeschreibung (3)1.4. Steckerbelegungen (4)1.4.1. P1-VME (4)1.4.2. P2-VME32/VXI (4)1.4.3. DL400C (5)2. Betrieb (6)2.1. Konfigurierung (6)2.1.1. Jumper (6)2.1.2. SHORT-Adresse (6)2.1.3. Interne/Externe Clock (6)2.1.4. Lineare/Nichtlineare Kennlinie (6)2.2. Bedienung (7)2.2.1. Eingangssignale (7)2.2.2. Steuerung (7)2.3. Programmierung (8)2.3.1. Reset (8)2.3.2. Initialisierung (8)2.3.3. Speicheraufteilung (9)2.3.4. Speicheraufteilung DL401Z (9)2.3.5. Serial DAC Programmierung (9)1. F UNKTION1.1. Übersicht1.1.1. AnwendungDriftkammern, Transient Recording1.1.2. DatenParameter WertKanalzahl4Abtastrate / Kanal≤ 100 MHz Speichertiefe1024 Samples Amplitudenauflösung linear8 BitAmplitudenauflösung nichtlinear10 BitEingangsempfindlichkeit (im unteren Bereich)195 µV/LSB Verstärkung (Anpaßverstärker)10Pedestal Korrektur 6 Bit1.1.3. Besonderheiten-COMMONSTART-COMMONSTOP, Addresscounter lesbar-AUTOSTOP bei Memory Overflow-START und STOP per Software-RUN und EOC (EndOfConversion) per Software lesbar-Multiple Event Speicherung-Auslese wahlfrei-100 MHz Quartzclock wahlweise1.1.4. AufbauDL400 Application-Module, VME-Doppeleuropa, Breite 3TE, Höhe 6HE1.1.5. StromversorgungSpannung Strom Leistung+5V.45 A 2.15 W-5.2V 4.6 A24 W+12V0.125 A 1.5 W-12V25 mA.3 WGesamt28.05 W1.2. Blockdiagramm1.3. FunktionsbeschreibungVon einem Frontstecker werden die differentiellen Analogsignale von 4 Kanälen über Anpaßverstärker um den Faktor 10 verstärkt und können für eine optimale Ausnutzung desdynamischen Bereichs im Pedestal verschoben werden. Die Pedestalwerte werden für alle Kanäle unabhängig in einem 4 Kanal DAC mit 6 Bit Auflösung erzeugt.Die Amplitudenauflösung der nachfolgenden FADCs beträgt 8 Bits. Durch ein vorgeschaltetes Netzwerk (NL) kann der dynamische Bereich um den Faktor 4 erweitert werden, so daß eine nichtlineare Übertragungsfunktion mit einer effektiven Amplitudenauflösung von 10 Bits (im unteren Bereich) erreicht wird.Das GATE-Signal über einen Frontstecker, bzw. über Software gesetzt, bestimmt Beginn und Ende der Aufzeichnung. Auf jeden CONVERT-Impuls werden die momentanen Analogwerte an allen 4 Kanälen gleichzeitig digitalisiert und anschließend in die Speicher eingeschrieben. Der Impuls kann wiederum von der Frontplatte oder per Software generiert werden. Als Quelle kann auch ein 100 MHz Quartzoszillator auf dem Board verwendet werden.Nach dem Einschreiben wird der Adresszähler um 1 erhöht. In der Betriebsart 'AutoStop' wird bei einem Überlauf des Zählers (>1023) die Aufzeichnung gestoppt, im anderen Modus(CommonStop) beginnt die Aufzeichnung immer wieder bei 0!Die Digitalisierung wird normalerweise durch Wegnahme des GATE-Signals beendet. Zu diesem Zeitpunkt wird ein Bit gesetzt und das Modul generiert (falls ermöglicht) einen Interrupt.Der Addresscounter wird dann gegebenenfalls ausgelesen und das wahlfreie Auslesen der Daten kann erfolgen.Falls die Tiefe der Memories dies erlaubt kann nach einem Stop auch die Wiederaufnahme der Aufzeichnung ohne Zwischenauslese erfolgen (Multi event storage). Bei einem RESET wird der Addresscounter auf 0 gesetzt.1.4. Steckerbelegungen1.4.1. P1-VME1.4.2. P2-VME32/VXI1.4.3. DL400C2. B ETRIEB2.1. Konfigurierung2.1.1. JumperBetriebsart Jumper BemerkungInternal Clock J3,/J4Quartz ClockExternal Clock J4,/J3NIM-InputDelay Delay do not changeDebug J1, J2do not change2.1.2. SHORT-AdresseUm das Modul im SHORT-Adressraum von VME ansprechen zu können, muß die gewünschte Adresse des Moduls mit den Rotary-HEX-Schaltern auf der DL400 Basisplatine eingestellt werden (siehe weiter unter 2.3. Programmierung).2.1.3. Interne/Externe ClockFalls die interne Clock mit 100 MHz benutzt werden soll, muß Internal Clock gesetzt werden.2.1.4. Nichtlineare/Lineare KennlinieBei nichtlinearer Eingangsbeschaltung der FADCs ist der Zusammenhang zwischen dem FADC-Code (C) und der Eingangsspannung (U i) am Modul nach folgender Formel gegeben:U i =C256 - a * C * U o / K;K (=10) kennzeichnet die Verstärkung des Anpaßverstärkers.a (=0.75) ist der Expansionsfaktor.U o (=0.5V) ist die Referenzspannung bei U i =0;ACHTUNG: Bei linearer Eingangsbeschaltung des FADC müssen die Widerstände R79…R82 (=15.4 Ω) unter den FADC chips entfernt werden (a=0, U o = 2V).2.2. Bedienung2.2.1. EingangssignaleDie analogen Signale für 4 Kanäle werden als differentielle Signale von der Frontseite zugeführt. Die Eingangsimpedanz zwischen den Eingangspins ±Cn beträgt 100Ω. Die Spannung für Vollaussteuerung beträgt 160mV.2.2.2. SteuerungZur externen Steuerung dienen im wesentlichen die 2 NIM-Signale GATE und CONVERT:•CONVERT: Dieses Signal stellt die Clock für die Konvertierung dar.•GATE: Dieses Signal bestimmt die Dauer der Konvertierung.2.3. Programmierung über DL400Das Modul ist ohne Programmierung zunächst nur im Short-Addressbereich (AM=$2D oder $29) ansprechbar. Die Bezeichnung "ss" in den folgenden Adressangaben steht für dieEinstellung der HEX-Schalter!2.3.1. ResetWRITE:SHORT.$ss20RESETD31D15D0HighWord LowWordLongWord2.3.2. InitialisierungFür die Festlegung der Standard-Basisadresse des Moduls, der Modulgröße, der gewünschten Addressmodifier und der Parameter für einen Interrupt müssen verschiedene Register (im Short-bereich) auf der DL400 Basisplatine geladen werden!WRITE:SHORT.$ss50D0…D15: Address Std-BaseaddressSHORT.$ss60D0…D3: MaskD8…D13: AMD15: Enable Mask for Submodule Size Address Modifierenable STD-accessSHORT.$ss70 (auch READ)D0…D7: IntVectorD8…D10: IntPrioD11: IntModeInterrupt VectorInterrupt Priority (0=Disable)0=RORA, 1=ROACD31D15D0HighWord LowWordLongWordFestlegung der Modulgröße:ModuleSize Mask64KB$0128KB$1256KB$3512KB$71MB$FACHTUNG:•D0…D3 in Address muß genauso wie D0…D3 in Mask gesetzt werden!•D8…D15 in Address bei Standard-Zugriff auf HIGH setzen!2.3.3. SpeicheraufteilungREAD:SHORT.$ss00Convert Convert do Internal ConvertSHORT.$ss70D12: RunD13: InterruptD14: DACRead test RUNtest INTERRUPT FLAG read Serial DACSHORT.$ss90D16…D25: Counter Read Address CounterSTD.$rAddr Ch3Ch2Ch1Ch0Sample 0 ……Ch3Ch2Ch1Ch0Sample 1023WRITE:SHORT.$ss00ClearInterrupt ClearInterrupt Clear Interrupt FlagSHORT.$ss10D0: DACWrite Shift DAC and Serial Write SHORT.$ss20RESET RESET Module RESETSHORT.$ss70D12: InternalD13: Gate/D14: DACEnableD15: AutoStop set internal Mode set internal Gate enable Serial DAC enable AutoStopD31D15D0HighWord LowWordLongWord2.3.4. Speicheraufteilung DL401ZREAD:SHORT.$ss90D0…D15: Counter Read Address CounterSTD.$rAddr Ch1Ch0Digital Sample 0 ……Ch1Ch0Digital Sample 32KD31D15D0HighWord LowWordLongWord2.3.5. Serial DAC ProgrammierungFür die volle Ausnutzung der Dynamik kann von jedem Kanal die Schwelle unabhängig calibriert werden. Zu diesem Zweck wird ein 4 Kanal DAC mit 6 bit Amplitudenauflösung programmiert. Bei einer Eingangsspannung von 0V am FADC ergeben sich etwa folgende Werte: DAC=0:FADC pedestal < 0DAC≈25:FADC pedestal ≈ 0DAC=63:FADC pedestal ≈ 50Die DACs müssen seriell gelesen bzw. beschrieben werden. Die Reihenfolge für die Datenbits ist von D5 nach D0 über Kanal 3 nach Kanal 0!SCHEMA für Lesen (und Setzen) der DACs:1)Enable DAC2)for ChannelNr:=3 downto 0 dofor DataBit:=5 downto 0 doRead Bit at D14 of DACReadWRITE Bit at D0 to DACWrite3)Disable DAC。

MSA-3111中文资料

6-482FeaturesMSA-3111• Surface Mount SOT-143Package• 3 dB Bandwidth: DC to 0.5GHz• 18.4 dB Gain at 1GHz • 3.5 dB NF at 1GHz MSA-3135• Hermetic Ceramic Package • 3 dB Bandwidth: DC to 0.6GHz• 19.6 dB Gain at 1GHz • 3.2 dB NF at 1GHz MSA-3185• Plastic Microstrip Package • 3 dB Bandwidth: DC to 0.5GHz• 18.7 dB Gain at 1GHz • 3.5 dB NF at 1GHz MSA-3186• Surface Mount Plastic Microstrip Package • 3 dB Bandwidth: DC to 0.5GHz• 18.7 dB Gain at 1GHz • 3.5 dB NF at 1GHzSilicon Bipolar RFIC Amplifiers Technical DataMSA-31XX SeriesDescriptionThe MSA-31XX series are high performance silicon bipolar RFIC amplifiers designed to becascadable in 50 Ω systems. The stability factor of K > 1 contrib-utes to easy cascading innumerous narrow and broadband IF and RF commercial and industrial applications.The MODAMP MSA series is fabricated using a 10GHz f T ,25GHz F MAX , silicon bipolar RFIC process which utilizes nitride self-alignment, ion implantation, and gold metallization to achieve excellent uniformity,performance, and reliability. The use of an external bias resistor for temperature and current stability also allows bias flexibility.Package options include, the industry standard plastic surface mount SOT-143 package, the 100␣mil surface mountablehermetic ceramic package, the 85␣mil plastic microstripline package, and the 85 mil surface mountable plastic microstripline package.MSA-3111MSA-3186MSA-3185MSA-31355965-9664E6-483Absolute Maximum Ratings [1]MSA-MSA-MSA-Parameter 311131353185, -3186Device Current 50 mA 60 mA 60 mAPower Dissipation [2,3]250 mW [3a]325 mW [3b]325 mW [3c]RF Input Power +13 dBm +13 dBm +13 dBm Junction Temperature 150°C 200°C 150°C Storage Temperature -65 to 150°C-65 to 200°C-65 to 150°CThermalResistance: θjc500°C/W 155°C/W 115°C/WNotes:1. Permanent damage may occur if any of these limits are exceeded.2. T CASE = 25°C.3a. Derate at 2.0 mW/°C for T C > 25°C.b. Derate at 6.5 mW/°C for T C > 149°C.c. Derate at 8.7 mW/°C for T C > 112°C.Typical Biasing ConfigurationElectrical Specifications, T A = 25°CI D = 29 mA, Z o = 50 ΩNote: 1. Refer to “Tape and Reel Packaging for Surface Mount Devices.”V 7 VCC INPUT6-484Typical Performance for MSA-3111Figure 1. Power Gain vs. Frequency atFour Temperatures, I D = 29 mA.Figure 2. Power Gain vs. Current at 25°C.Figure 3. Typical P 1dB vs. Frequency at 25°C.G p (d B )FREQUENCY (GHz)0.11.04.030255101520I (mA)DG p (d B )40253016122420302614182228203510P (d B m )1d B FREQUENCY (GHz)0.101.04.01428106412Figure 6. I D vs. V D at Four Temperatures.Figure 5. Power Gain, Noise Figure,and P 1dB vs. Temperature at 1GHz and I D = 29 mA.Figure 4. Noise Figure vs. Frequencyat I D = 29 mA.N O I S E F I G U R E (d B)FREQUENCY (GHz)0.13 1.04.045P (d B m )1d B AMBIENT TEMPERATURE (°C)G A I N (d B )85259191881017-256453N O I S E F I G U R E (d B )1600301020V (VOLTS)D40165432I m AD Typical Scattering Parameters at T A = 25°C, for MSA-3111I D = 29 mA, Z o = 50 ΩS 11S 21S 12S 22(GHz)Mag.Ang.(dB)Mag.Ang.(dB)Mag.Ang.Mag.Ang.0.10.05324.416.53167-27.00.04590.10-230.20.06424.015.83156-26.50.047160.10-410.30.07-423.414.78146-26.00.050230.10-590.40.07-822.713.59136-25.30.054280.11-720.50.07-1222.012.53128-24.60.059330.11-840.60.07-1821.111.41121-23.90.064360.11-940.70.07-2220.410.47114-23.10.070390.11-1000.80.08-2619.79.63109-22.40.076410.11-1060.90.08-3219.08.89104-21.70.082420.11-1111.00.08-3518.48.2799-21.10.088430.11-1141.50.08-5915.6 5.9980-18.50.118440.11-1232.00.10-7913.4 4.6965-16.60.148420.10-1222.50.10-10411.8 3.8852-15.20.175380.11-1183.00.10-12910.4 3.3139-14.10.198330.12-1143.50.12-1639.3 2.9127-13.20.219280.12-1174.00.151648.2 2.5816-12.60.236230.13-1254.50.211407.4 2.344-12.10.250180.13-1365.00.29121 6.5 2.10-7-11.70.260140.14-1485.50.36109 5.6 1.90-18-11.30.271100.17-1586.00.42984.61.70-28-11.00.28270.21-165Frequency6-485Typical Performance for MSA-3135Figure 1. Power Gain vs. Frequency atFour Temperatures, I D = 29 mA.Figure 2. Power Gain vs. Current at 25°C.Figure 3. Typical P 1dB vs. Frequency at 25°C.G p (d B )FREQUENCY (GHz)0.10 1.04.030255101520I (mA)DG p (d B )4025302035P (d B m )1d B FREQUENCY (GHz)0.1 1.04.0Figure 4. Noise Figure vs. Frequencyat I D = 29 mA.Figure 5. Power Gain, Noise Figure,and P 1dB vs. Temperature at 1GHz and I D = 29 mA.Figure 6. I D vs. V D at Four Temperatures.NO I S E F I G U R E (d B )FREQUENCY (GHz)0.11.04.02453P (d B m )1d B AMBIENT TEMPERATURE (°C)G A I N (d B )8525-256453N O I S E F I G U R E (d B )00301020V (VOLTS)D40165432I m AD 50Typical Scattering Parameters at T A = 25°C, for MSA-3135I D = 29 mA, Z o = 50 ΩS 11S 21S 12S 22(GHz)Mag.Ang.(dB)Mag.Ang.(dB)Mag.Ang.Mag.Ang.0.10.05124.717.11169-27.30.04370.09-190.20.06224.416.52158-27.00.045140.09-370.30.07-223.915.72149-26.50.047200.09-520.40.07-723.414.77139-26.00.050240.09-670.50.07-1222.813.77131-25.40.054290.09-800.60.07-2122.112.79124-24.70.058320.09-920.70.07-2721.511.86117-24.10.063340.09-1020.80.07-3320.911.03111-23.40.037360.09-1110.90.08-3920.210.25106-22.80.072380.09-1191.00.08-4419.69.55101-22.20.078390.09-1271.50.08-7916.97.0380-19.70.104390.10-1552.00.09-11614.8 5.5263-17.70.130360.10-1712.50.11-14513.2 4.5549-16.30.153310.091763.00.15-17211.7 3.8635-15.20.175250.101623.50.1916610.5 3.3422-14.30.192190.111544.00.241499.4 2.949-13.70.207130.121524.50.291348.3 2.61-3-13.20.21970.131485.00.351207.4 2.34-16-12.80.22810.151415.50.41107 6.4 2.08-27-12.50.236-50.191386.00.46955.41.87-39-12.30.243-100.24137Frequency6-486Typical Performance for MSA-3185, MSA-3186Figure 2. Power Gain vs. Current at 25°C.Figure 3. Typical P 1dB vs. Frequency at 25°C.Figure 1. Power Gain vs. Frequency atFour Temperatures, I D = 29 mA.G p (d B )FREQUENCY (GHz)0.10 1.04.030255101520I (mA)DG p (d B )4025302035P (d B m )1dB FREQUENCY (GHz)0.101.04.01428106412Figure 4. Noise Figure vs. Frequencyat I D = 29 mA.Figure 5. Power Gain, Noise Figure,and P 1dB vs. Temperature at 1 GHz and I D = 29 mA.Figure 6. I D vs. V D at Four Temperatures.N O I S E F I G U RE (d B )FREQUENCY (GHz)0.11.04.0345P (d B m )1d B AMBIENT TEMPERATURE (°C)G A I N (d B )85259191881017-256453N O I S EF IG U R E (d B )1600301020V (VOLTS)D40165432I m AD 5076-487Frequency Typical Scattering Parameters at T A = 25°C, for MSA-3186I D = 29 mA, Z o = 50 ΩS 11S 21S 12S 22(GHz)Mag.Ang.(dB)Mag.Ang.(dB)Mag.Ang.Mag.Ang.0.10.05124.717.11169-27.30.04370.09-190.20.06224.416.52158-27.00.045140.09-370.30.07-223.915.72149-26.50.047200.09-520.40.07-723.414.77139-26.00.050240.09-670.50.07-1222.813.77131-25.40.054290.09-800.60.07-2122.112.79124-24.70.058320.09-920.70.07-2721.511.86117-24.10.063340.09-1020.80.07-3320.911.03111-23.40.037360.09-1110.90.08-3920.210.25106-22.80.072380.09-1191.00.08-4419.69.55101-22.20.078390.09-1271.50.08-7916.97.0380-19.70.104390.10-1552.00.09-11614.8 5.5263-17.70.130360.10-1712.50.11-14513.2 4.5549-16.30.153310.091763.00.15-17111.7 3.8635-15.20.175250.101623.50.1916610.5 3.3422-14.30.192190.111544.00.241499.4 2.949-13.70.207130.121524.50.291348.3 2.61-3-13.20.21970.131485.00.351207.4 2.34-16-12.80.22810.151415.50.41107 6.4 2.08-27-12.50.236-50.191386.00.46955.41.87-39-12.30.243-100.24137Typical Scattering Parameters at T A = 25°C, for MSA-3185I D = 29 mA, Z o = 50 ΩS 11S 21S 12S 22(GHz)Mag.Ang.(dB)Mag.Ang.(dB)Mag.Ang.Mag.Ang.0.10.05-324.617.04167-27.20.04480.09-320.20.04-1324.216.22156-26.80.046160.09-570.30.04-2223.615.18145-26.20.049220.10-760.40.06-2523.014.07135-25.50.053270.11-840.50.07-2722.212.95127-24.70.058310.12-910.60.07-3121.511.85119-24.00.063340.12-1020.70.07-3320.710.85112-23.30.068360.12-1100.80.06-4120.010.01106-22.60.074380.13-1200.90.06-4519.39.27101-21.90.080390.13-1261.00.06-5718.78.5996-21.30.086400.13-1341.50.05-8915.9 6.2374-18.60.118380.13-1572.00.05-12213.9 4.9357-16.60.147330.12-1732.50.0816712.20.0741-15.10.175260.16-1633.00.1614310.7 3.4425-14.10.197170.18-1543.50.211209.4 2.9511-13.50.21290.24-1384.00.301028.2 2.56-3-13.00.22320.28-1244.50.40937.1 2.26-16-12.70.231-50.31-1145.00.5187 6.1 2.03-28-12.40.240-110.34-1095.50.6180 5.2 1.82-40-12.20.247-170.36-1056.00.67724.31.64-53-12.00.251-230.40-101FrequencySOT-143Outline Drawings 8535 86Tape and Reel Part Number Ordering InformationPart Number Devices per Reel Reel SizeMSA-3111-TR130007"MSA-3186-TR110007"DIA..006 ± .002.15 ± .051. Dimensions are inmm0.51 ±(0.020 ±DIMENSIONS ARE IN MILLIMETERS (INCHES)DIMENSIONS ARE IN MILLIMETERS (INCHES)6-488。

MSAU301中文资料

Dual OutputSingle OutputBlock DiagramMinmax's MSAU300 1W DC/DC's are in "gull-wing" SMT package,weigh a mere 2.2 grams and meet 245]/10sec in solder-reflow for lead free process.The series is designed to provide high levels of isolation 3000VDC. It consists of 18 models with input voltages of 5V,12V and 24VDC which offers standard output voltages of 5V, 12V, 15V, {5V, {12V and {15VDC for the choice. Their impressive guaranteed efficiencies enable all models to deliver their fully rated output power from -40] to +85]without heat sinking or forced-air cooling.The MSAU300 series is an excellent selection for a variety of applications including data communication equipments, distributed power systems, telecommunication equipments and industrial robot systems.The MSAU300 units are available in tape and reel package.y Internal SMD Constructiony UL 94V-0 Package Material y Lead Frame Technology y Temperature Performance -40] to +85]y Output 5, 12, 15, {5, {12 and {15VDC y Input 5, 12 and 24VDCy Low Costy MTBF > 2,000,000 Hours y 3000VDC Isolationy Efficiency up to 81%Key Features1W, High Isolation SMD, Single & Dual Output DC/DC ConvertersREV:0 2005/04MINMAX180553{0.7{34{15MSAU32979553{0.8{42{12MSAU32872857{2{100{5MSAU3267955316715MSAU324785531.58412MSAU3237187584200524(21.6 ~ 26.4)MSAU321815104{0.7{34{15MSAU319805105{0.8{42{12MSAU318748112{2{100{5MSAU31680510416715MSAU3147951061.58412MSAU313718121174200512(10.8 ~ 13.2)MSAU311797258{0.7{34{15MSAU309787255{0.8{42{12MSAU3087210277{2{100{5MSAU30678725816715MSAU3047872581.58412MSAU303711030281420055(4.5 ~ 5.5)MSAU301% (Typ.)% (Max.)mA (Typ.)mA (Typ.)mA mA VDC VDC@Max. Load @No Load @Max. Load Min.Max.EfficiencyLoad RegulationInput CurrentOutput CurrentOutput VoltageInput VoltageModel NumberModel Selection GuideFree-Air ConvectionCooling%95---Humidity ]+125-40Storage Temperature ]+90-40CaseOperating Temperature ]+85-40Ambient Operating Temperature Unit Max.Min.Conditions ParameterEnvironmental SpecificationsExceeding the absolute maximum ratings of the unit could cause damage.These are not continuous operating ratings.mW550---Internal Power Dissipation]300---Lead Temperature (1.5mm from case for 10 Sec.)VDC 30-0.724VDC Input ModelsVDC 18-0.712VDC Input ModelsVDC 9-0.75VDC Input ModelsInput Surge Voltage( 1000 mS )Unit Max.Min.ParameterNotes :1. Specifications typical at Ta=+25], resistive load,nominal input voltage, rated output current unless otherwise noted.2. Ripple & Noise measurement bandwidth is 0-20MHz.3. These power converters require a minimum output loading to maintain specified regulation.4. Operation under no-load conditions will not damage these modules; however, they may not meet all specifications listed.5. All DC/DC converters should be externally fused on the front end for protection.6. Other input and output voltage may be available,please contact factory.7. Specifications subject to change without notice.Absolute Maximum RatingsInternal CapacitorInput FilterA 0.3------All ModelsReverse Polarity Input Current 26.42421.624V Input Models13.21210.812V Input Models VDC 5.554.55V Input Models Input Voltage RangeUnitMax.Typ.Min.Model ParameterInput Specifications2MINMAX REV:0 2005/04K Hours------2000MIL-HDBK-217F @ 25], Ground BenignMTBFKHz 12010070Switching Frequency pF 10060---100KHz,1VIsolation Capacitance G[------10500VDC Isolation Resistance VDC ------3300Flash Tested for 1 SecondIsolation Voltage Test VDC ------300060 SecondsIsolation Voltage Rated Unit Max.Typ.Min.Conditions ParameterGeneral Specifications0.5 Second Max.Output Short Circuit%/]{0.02{0.01---Temperature Coefficient %------120Over LoadmV rms 5------Ripple & Noise (20MHz)mV P-P 150------Over Line, Load & Temp.Ripple & Noise (20MHz)mV P-P 7550---Ripple & Noise (20MHz)%See Model Selection GuideIo=20% to 100%Load Regulation %{1.5{1.2---For Vin Change of 1%Line Regulation %{1.0{0.1---Dual Output, Balanced LoadsOutput Voltage Balance %{4.0{1.5---Output Voltage Accuracy Unit Max.Typ.Min.ConditionsParameterOutput Specifications# For each outputuF2.22.2104.74.733Maximum Capacitive Load Unit {15V #{12V #{5V #15V 12V 5V Models by Vout Capacitive Load100mA Slow - Blow Type200mA Slow - Blow Type500mA Slow - Blow Type24V Input Models 12V Input Models 5V Input Models Input Fuse Selection GuideDerating CurveREV:0 2005/04MINMAX3Test ConfigurationsInput Reflected-Ripple Current Test SetupInput reflected-ripple current is measured with a inductor Lin (4.7uH) and Cin (220uF, ESR < 1.0[ at 100 KHz) to simulate source impedance.Capacitor Cin, offsets possible battery impedance.Current ripple is measured at the input terminals of the module, measurement bandwidth is 0-500 KHz.Peak-to-Peak Output Noise Measurement TestUse a Cout 0.33uF ceramic capacitor.Scope measurement should be made by using a BNC socket, measurement bandwidth is 0-20 MHz. Position the load between 50 mm and 75 mm from the DC/DC Converter.Maximum Capacitive LoadThe MSAU300 series has limitation of maximum connected capacitance at the output.The power module may be operated in current limiting mode during start-up, affecting the ramp-up and the startup time.The maximum capacitance can be found in the data sheet.In applications where power is supplied over long lines and output loading is high, it may be necessary to use a capacitor at the input to ensure startup.Capacitor mounted close to the power module helps ensure stability of the unit, it is recommended to use a good quality low Equivalent Series Resistance (ESR < 1.0[ at 100KHz) capacitor of a 2.2uF for the 5V input devices, a 1.0uF for the 12V input devices and a 0.47uF for the 24V devices.Output Ripple ReductionA good quality low ESR capacitor placed as close as practicable across the load will give the best ripple and noise performance.To reduce output ripple, it is recommended to use 1.0uF capacitors at the output.Thermal ConsiderationsMany conditions affect the thermal performance of the power module, such as orientation, airflow over the module and board spacing. To avoid exceeding the maximum temperature rating of the components inside the power module, the case temperature must be kept below 90°C.The derating curves are determined from measurements obtained in an experimental apparatus.4MINMAX REV:0 2005/04The MSAU300 converter is encapsulated in a low thermal resistance molding compound that has excellent resistance/electrical characteristics over a wide temperature range or in high humidity environments.The encapsulant and unit case are both rated to UL 94V-0 flammability specifications.Leads are tin plated for improved solderability.NA: Not Available for Electrical ConnectionNANA 12NANA11NA NA 10+Vout +Vout 8UL94V-0:FlammabilityNA NA 7-Vout NA 6 2.2g :Weight Common -Vout 5NA NA 3Molding :Case Material +Vin +Vin 2-Vin -Vin 115.3*8.0*7.0 mm0.60*0.31*0.27 inches:Case Size Dual OutputSingle OutputPin Physical CharacteristicsPin Connections{0.002{0.05PinX.XXX{0.005X.XX{0.13X.XX{0.01X.X{0.25Inches Millimeters ToleranceConnecting Pin PatternsTop View (2.54 mm / 0.1 inch grids)Mechanical DimensionsREV:0 2005/04MINMAX5。

Microsemi USB50403C - USB50424C Transient Voltage

USB50403C – USB50424C
Available
Bidirectional TVS Array
DESCRIPTION
This USB50403C – USB50424C Transient Voltage Suppressor (TVS) family is packaged in a SOT-143 configuration giving protection to 1 bidirectional data or interface line. It is designed for use in applications where protection is required at the board level from voltage transients caused by electrostatic discharge (ESD) as defined in IEC 61000–4-2, electrical fast transients (EFT) per IEC 61000-4-4 and secondary effects of lightning. It is also available in RoHS compliant versions. These TVS arrays have a peak power rating of 500 watts for an 8/20 sec pulse. This array is suitable for protection of sensitive circuitry consisting of TTL, CMOS, DRAM’s, SRAM’s, HCMOS, HSIC microprocessors, and Universal Serial Bus (USB) and I/O transceivers.

DAP401中文资料

1)Valid, if leads are kept at ambient temperature at a distance of 3 mm from caseGültig, wenn die Anschlußdrähte in 3 mm Abstand von Gehäuse auf Umgebungstemperatur gehalten werden 35828.02.2002Small Signal Diode ArraysDioden Sätze mit AllzweckdiodenNominal power dissipation 200 mW Nenn-VerlustleistungRepetitive peak reverse voltage 80 VPeriodische Spitzensperrspannung 5 Pin-Plastic case13 x 3.5 x 6.6 [mm]5 Pin-Kunststoffgehäuse Weight approx. – Gewicht ca.0.6 g Dimensions / Maße in mmStandard packaging: bulksee page 22Standard Lieferform: lose im Kartons. Seite 22"DAP": common anodes / gemeinsame Anoden "DAN": common cathodes / gemeinsame KathodenMaximum ratings GrenzwerteType Typ Repetitive peak reverse voltage Periodische SpitzensperrspannungV RRM [V]Surge peak reverse voltage StoßspitzensperrspannungV RSM [V]DAN 4018080DAP 4018080Max. average forward rectified current, R-load,T A = 25/Cfor one diode operation onlyI FAV 100 mA 1)per diode for simultaneous operation I FAV 50 mA 1)Dauergrenzstrom in Einwegschaltung mit R-Last,T U = 25/Cfür eine einzelne DiodeI FAV 100 mA 1)pro Diode bei gleichzeitigem Betrieb I FAV 50 mA 1)Peak forward surge current, 50 Hz half sine-wave T A = 25/CI FSM500 mAStoßstrom für eine 50 Hz Sinus-Halbwelle1)Valid, if leads are kept at ambient temperature at a distance of 3 mm from caseGültig, wenn die Anschlußdrähte in 3 mm Abstand von Gehäuse auf Umgebungstemperatur gehalten werden 35928.02.2002Operating junction temperature – Sperrschichttemperatur T j – 50…+150/C Storage temperature – LagerungstemperaturT S– 50…+150/CCharacteristics KennwerteForward voltage T j = 25/C I F = 10 mA V F < 1.0 V Durchlaßspannung Leakage current T j = 25/CV R = 20 VI R < 25 nA SperrstromReverse recovery time I F = 10 mA through/über t rr < 4 ns SperrverzugI R = 10 mA to/auf I R = 1 mAThermal resistance junction to ambient airR thA< 85 K/W 1)Wärmewiderstand Sperrschicht – umgebende Luft。

基于多尺度自注意力增强的多方对话角色识别方法

第35卷第5期2021年5月中文信息学报JO U R N A L OF CHINESE INFORM ATION PROCESSINGVol. 35, No. 5M a y，2021文章编号：1003-0077(2021)05-0101-09基于多尺度自注意力增强的多方对话角色识别方法张禹尧，蒋玉茹，张仰森(北京信息科技大学智能信息处理研究所，北京100101)摘要：角色识别任务是近年来提出的一项自然语言处理任务，面向多方参与的对话场景，目标是将对话中的人物提及映射到具体的人物实体。

目前在该任务的最优系统中，只使用了较为简单的编码器，并未针对对话文本特点进行改造创新。

该文在最优系统的基础上，提出了一种基于多尺度自注意力增强的方法，借助不同尺度的自注意力，来获得更好的信息表示。

首先，通过尺度较大的全局注意力，对场景内的全部对话信息进行处理.保留了全局的对话信息；然后.通过尺度较小的局部注意力.对局部范围内的对话进行计算，捕获近距离的信息之间的关联关系；最后，将不同尺度得到的信息进行融合，达到对编码信息增强的效果。

在SemEval2018 T a s k4任务上的实验结果表明了该方法的有效性，相较于目前最优系统，在全部实体的F,值上提高了18.94%。

关键词：角色识别；多尺度自注意力；全局注意力；局部注意力中图分类号：TP391 文献标识码：AMulti-party Dialogue Character Identification Method Basedon Multi-scale Self-attention EnhancementZ H A N G Y uyao, J I A N G Y u r u, Z H A N G Y an g sen(Institute of Intelligent Information Processing, Beijing Information Science andTechnology University，Beijing 100101，China)Abstract：The character identification task aims at mapping the person mentions in the dialogue to specific person entities in the dialogue scenarios involving multiple parties. This paper proposes a method based on multi-scale selfattention enhancement* which uses self-attention at different scales to obtain better information representation.F irst»the global dialog information in the scene is captured through global attention with a large scope. Then,through the small-scale local attention»the dialog in the local area is calculated to capture the association relationship between the information at close range. Finally»the information obtained at different scales is fused to enhance the encoded information. The experimental results on SemEval2018 Task4 show the effectiveness of the method by18.94%in F i compared with the current optimal system.Keywords：character identification；multi-scale self-attention；global attention；local attention〇引言角色识别（character identification)任务的目标是在多人参与的对话中，将每个人物提及（mention)映射到具体的人物实体，这里的人物提及可以是任何表示人物的名词，如“他”“阿姨”等。

美控U-S1-MKCN4信号发生器使用说明书

信号发生器使用说明书杭州美控自动化技术有限公司U-S1-MKCN 4第4版杭州美控自动化技术有限公司前言感谢您购买我公司产品。

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序号物品名称数量备注1信号发生器12测试引线3一红一黑一黄3使用说明书14合格证15USB线16便携包1目录第一章概括 (1)1.1简介 (1)1.2主要功能 (1)1.3技术指标 (2)1.4规格 (3)第二章各部分名称及功能 (4)2.1接线端子 (5)2.2按键 (6)2.3液晶屏显示 (7)第三章信号输出 (8)3.1电压、有源电流输出 (8)3.24-20mA输出 (8)3.3热电偶输出 (9)3.4无源电流输出 (9)3.5电压、电流信号按显示量程输出或测量(免去量程换算) (10)第四章信号测量 (12)4.1电压、有源电流测量 (12)4.2无源电流测量 (13)4.3热电偶测量 (14)4.4调节阀门 (15)第五章可编程输出 (16)5.1分割输出功能(n/m) (16)5.2线性输出功能 (16)5.3自动步进功能 (18)第六章故障排除及仪表维护 (19)6.1故障排除 (19)6.2仪表维护 (20)第一章概括第一章概括1.1简介本信号发生器具有多种信号的测量和输出功能，包括电压、电流、热电偶信号，采用高清LCD液晶屏和功能分明的硅胶按键，显示清晰，操作简单，且具有待机时间长，精度高和可编程输出功能。

广泛应用于实验室、工业现场PLC与过程仪表、电动阀门等的调试。