SIHLZ14中文资料

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ED15M44SLEZ中文资料(Positronic)中文数据手册「EasyDatasheet - 矽搜」

ED15M44SLEZ中文资料(Positronic)中文数据手册「EasyDatasheet - 矽搜」

MD / ED系列
0.135 [3.43] 0.352 [8.94]
对于焊杯触点 ,指定 在步骤 4代码 2
订购信息.
典型型号: ED15M200T2Z
修正公头性和母头性提供偏光螺旋千斤顶. 指定订购信息步骤 7码 T6.
典型型号: MD15M200T6Z
直印刷电路板安装连接器
CODE NUMBER
HDC
6 0.375 [9.53] 0.360 [9.14]
指定订购信息步骤 6代码 F或 Q. F代表铁 素体电感和 Q为铁素体电感与推入式紧固件 .
L 90°印 刷 电 路 板 安 装 连 接 器
铁素体电感酒吧
A
0.135±0.005 [3.43±0.13]
Fixed female jackscrews
六标准连接器变体安排,9,15个提供, 25,29,37和50 触点.每个梅洛-D连接器变种可用 接触终端进行焊杯,包装后,直和90°
印刷电路板安装端子具有三个印刷电路板一个选择
脚印.每欧元-D接口变体可与端子接触 印刷电路板国家为焊杯,包装后直和90°安装 按欧洲标准公制脚印终端.梅洛-D和欧洲-D
钢与锡板;锌板用重铬酸盐密封.其他材料和 可根据要求完成.
尼龙塑料,铜或锡板;锌板用重铬酸盐密封 . 磷青铜或铍铜与锡板.
钢锌板和重铬酸盐密封,或清除锌板.
滑动锁,锁片,钢,镍板.
热塑性UL 94V-0.复合材料,铜或 钢锌板和重铬酸盐密封.
机械特性:
固定触点:
在绝缘体: 耐焊 铁热:
梅洛 -D
欧元 -D
可选壳件
与环球 FLOAT支架 [F]
0.120±0.010 [3.05±0.25]

ANSI ASQZ1.4抽样检验技术

ANSI ASQZ1.4抽样检验技术







7.2檢查水平等級 7.2.1一般檢查水平 一般檢查水平分為三級:一般檢查水平I;一般檢 查水平II;一般檢查水平III。 判斷能力:III>II>I。 7.2.2 特殊檢查水平 特殊檢查水平分為四級:特殊檢查水平S-1;特殊 檢查水平S-2;特殊檢查水平S-3;特殊檢查水平 S-4。 判斷能力:S-4>S-3>S-2>S-1。一般檢查水平的 判斷能力大於特殊檢查水平的判斷能力。即: III>II>I >S-4>S-3>S-2>S-1 7.3檢查水平的選擇原則 沒有特別規定時,首先採用一般檢查水平II;

繼續抽樣的結論。若結論為繼續抽檢,按規定 樣本大小作第二次抽樣檢查,據累計抽樣檢查 結果判定批合格或批不合格。 5.2.3 多次抽樣。多次抽樣檢驗是二次抽樣 檢驗的擴展。每次均按規定的樣本大小抽樣並 作檢查,將各次抽檢結果累計與判定數組比較, 作出合格、不

合格或繼續抽檢的結論,直至抽檢次數可 作出合格或不合格判定為止。中國規定有 五次抽樣檢查,美國規定有七次抽樣。 5.2.4 序貫抽樣。序貫抽樣檢查每次隻抽 取一個樣品檢查,一個或若幹個樣品檢查 後,將累計檢查結果與相應的判斷標准作 比較﹐作出合格﹑不合格或繼續抽驗的結 論。

6.合格質量水平 AQL
6.1.AQL 的概念與意義 合格質量水平AQL(Acceptable Quality Level),也稱品質允收水準。它表征連續提 交批平均不合格率的上限值,它是計數調整型 抽樣檢查對交驗批的質量標準。AQL 以每百 單位產品的不合格數或不合格數表示。在數值 上它等於過程平均不合格品率上限值p max , 它是允許的不良再壞的批質量平均值。

瑞典模具钢

瑞典模具钢

X13T6W(236)电渣重溶模具材料详细介绍:X13T6W(236H)电渣重溶模具钢材详细介绍:MEK4/DIN1.8523高耐磨塑胶模具钢详细介绍:高温热作模具用合金BC-3详细介绍:高温热作模具用合金BC-3材料介绍热挤压材料BC-3是一种新型特种合金材料,适应于800℃以上应用的热加工领域。

具有良好的稳定性和耐磨性及红硬性,同时具有优良的抗急冷急热和抗高温氧化性能,在温度650℃时具有良好的综合性能,是一种理想的热挤压材料。

现用于制作有色金属铜及铜金合金的挤压。

其使用寿命比一般热作模具钢可提高五到十倍,并且挤制的产品表面质量好,尺寸精确度高,而且使用寿命长,应用到铜加工行业已有多年的历史。

一、新型特种钢BC-3热挤压材料的主要性能1、机械性能2、持久性能3、蠕变和疲劳性能4抗氧化数据5、长期时效性能热挤压模具是有色金属挤压生产中使用的关键工具,热挤压模具的使用寿命和质量,极大影响着挤压制品的质量、挤压制品表面质量不好,尺寸精度差,因而需要频繁更换模具,生产效率太低,产品成品率低,磨具消耗量大。

我们开发研制的BC-3合金材料已经解决了铜及压的多种难题。

几年来,已经在全国铜挤压领域肿,去得了显著的经济效益和社会效益并充分显示了这种新型材料的显著优越性。

1、提高生产效率BC-3材料使用寿命长。

使用寿命是H13钢的5-10倍,可以为企业减少大量热停修模的时间。

2、提高产品质量BC-3的红硬性高,耐磨性好。

使用中不变形,不氧化,表面光滑不沾铜。

所挤制的产品表面质量好,尺寸精确度高,为拉伸工序和定尺控制提供了良好条件。

消除了使用热作钢模具时的粘铜、划伤等现象。

3、提高产品成品率使用BC-3材料挤压出的铜材表面光洁,成品率高。

4、减低模具费用热挤压生产中,挤压模消耗量大,占生产的比重也高,使用BC-3材料是热作钢模具使用寿命的5-10倍,并且减少大量的模具机加工费用。

其经济效益和社会效益显著。

为实现热挤压产品高产、优质、低耗提供了保证,为有色金属加工业的可持续发展创造了良好的条件。

欧洲品牌电磁器件型号123456产品说明书

欧洲品牌电磁器件型号123456产品说明书

Dimensions: [mm]Scale - 5:174404054047BC74404054047T e m p e r a t u r eT pT L74404054047Cautions and Warnings:The following conditions apply to all goods within the product series of WE-LQS of Würth Elektronik eiSos GmbH & Co. KG:General:•This electronic component is designed and manufactured for use in general electronic equipment.•Würth Elektronik must be asked for written approval (following the PPAP procedure) before incorporating the components into any equipment in fields such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc. where higher safety and reliability are especially required and/or if there is the possibility of direct damage or human injury.•Electronic components that will be used in safety-critical or high-reliability applications, should be pre-evaluated by the customer. •The component is designed and manufactured to be used within the datasheet specified values. If the usage and operation conditions specified in the datasheet are not met, the wire insulation may be damaged or dissolved.•Do not drop or impact the components, the component may be damaged.•Würth Elektronik products are qualified according to international standards, which are listed in each product reliability report. Würth Elektronik does not warrant any customer qualified product characteristics beyond Würth Elektroniks’ specifications, for its validity and sustainability over time.•The responsibility for the applicability of the customer specific products and use in a particular customer design is always within the authority of the customer. All technical specifications for standard products also apply to customer specific products.Product specific:Soldering:•The solder profile must comply with the technical product specifications. All other profiles will void the warranty.•All other soldering methods are at the customers’ own risk.•Strong forces which may affect the coplanarity of the components’ electrical connection with the PCB (i.e. pins), can damage the part, resulting in avoid of the warranty.Cleaning and Washing:•Washing agents used during the production to clean the customer application might damage or change the characteristics of the wire insulation, marking or plating. Washing agents may have a negative effect on the long-term functionality of the product.•Using a brush during the cleaning process may break the wire due to its small diameter. Therefore, we do not recommend using a brush during the PCB cleaning process.Potting:•If the product is potted in the customer application, the potting material may shrink or expand during and after hardening. Shrinking could lead to an incomplete seal, allowing contaminants into the core. Expansion could damage the components. We recommend a manual inspection after potting to avoid these effects.Storage Conditions:• A storage of Würth Elektronik products for longer than 12 months is not recommended. Within other effects, the terminals may suffer degradation, resulting in bad solderability. Therefore, all products shall be used within the period of 12 months based on the day of shipment.•Do not expose the components to direct sunlight.•The storage conditions in the original packaging are defined according to DIN EN 61760-2.•The storage conditions stated in the original packaging apply to the storage time and not to the transportation time of the components. Packaging:•The packaging specifications apply only to purchase orders comprising whole packaging units. If the ordered quantity exceeds or is lower than the specified packaging unit, packaging in accordance with the packaging specifications cannot be ensured. Handling:•Violation of the technical product specifications such as exceeding the nominal rated current will void the warranty.•Applying currents with audio-frequency signals may result in audible noise due to the magnetostrictive material properties.•The temperature rise of the component must be taken into consideration. The operating temperature is comprised of ambient temperature and temperature rise of the component.The operating temperature of the component shall not exceed the maximum temperature specified.These cautions and warnings comply with the state of the scientific and technical knowledge and are believed to be accurate and reliable.However, no responsibility is assumed for inaccuracies or incompleteness.Würth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCE PROJECTIONMETHODChrB.001.0062022-10-01DIN ISO 2768-1mDESCRIPTIONWE-LQS SMT Semi-ShieldedPower Inductor ORDER CODE74404054047SIZE/TYPE BUSINESS UNIT STATUS PAGEImportant NotesThe following conditions apply to all goods within the product range of Würth Elektronik eiSos GmbH & Co. KG:1. General Customer ResponsibilitySome goods within the product range of Würth Elektronik eiSos GmbH & Co. KG contain statements regarding general suitability for certain application areas. These statements about suitability are based on our knowledge and experience of typical requirements concerning the areas, serve as general guidance and cannot be estimated as binding statements about the suitability for a customer application. The responsibility for the applicability and use in a particular customer design is always solely within the authority of the customer. Due to this fact it is up to the customer to evaluate, where appropriate to investigate and decide whether the device with the specific product characteristics described in the product specification is valid and suitable for the respective customer application or not.2. Customer Responsibility related to Specific, in particular Safety-Relevant ApplicationsIt has to be clearly pointed out that the possibility of a malfunction of electronic components or failure before the end of the usual lifetime cannot be completely eliminated in the current state of the art, even if the products are operated within the range of the specifications.In certain customer applications requiring a very high level of safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health it must be ensured by most advanced technological aid of suitable design of the customer application that no injury or damage is caused to third parties in the event of malfunction or failure of an electronic component. Therefore, customer is cautioned to verify that data sheets are current before placing orders. The current data sheets can be downloaded at .3. Best Care and AttentionAny product-specific notes, cautions and warnings must be strictly observed. Any disregard will result in the loss of warranty.4. Customer Support for Product SpecificationsSome products within the product range may contain substances which are subject to restrictions in certain jurisdictions in order to serve specific technical requirements. Necessary information is available on request. In this case the field sales engineer or the internal sales person in charge should be contacted who will be happy to support in this matter.5. Product R&DDue to constant product improvement product specifications may change from time to time. As a standard reporting procedure of the Product Change Notification (PCN) according to the JEDEC-Standard inform about minor and major changes. In case of further queries regarding the PCN, the field sales engineer or the internal sales person in charge should be contacted. The basic responsibility of the customer as per Section 1 and 2 remains unaffected.6. Product Life CycleDue to technical progress and economical evaluation we also reserve the right to discontinue production and delivery of products. As a standard reporting procedure of the Product Termination Notification (PTN) according to the JEDEC-Standard we will inform at an early stage about inevitable product discontinuance. According to this we cannot guarantee that all products within our product range will always be available. Therefore it needs to be verified with the field sales engineer or the internal sales person in charge about the current product availability expectancy before or when the product for application design-in disposal is considered. The approach named above does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.7. Property RightsAll the rights for contractual products produced by Würth Elektronik eiSos GmbH & Co. KG on the basis of ideas, development contracts as well as models or templates that are subject to copyright, patent or commercial protection supplied to the customer will remain with Würth Elektronik eiSos GmbH & Co. KG. Würth Elektronik eiSos GmbH & Co. KG does not warrant or represent that any license, either expressed or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, application, or process in which Würth Elektronik eiSos GmbH & Co. KG components or services are used.8. General Terms and ConditionsUnless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms and Conditions of Würth Elektronik eiSos Group”, last version available at .Würth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCE PROJECTIONMETHODChrB.001.0062022-10-01DIN ISO 2768-1mDESCRIPTIONWE-LQS SMT Semi-ShieldedPower Inductor ORDER CODE74404054047SIZE/TYPE BUSINESS UNIT STATUS PAGE。

Shimadzu GC-2014C184-E014F 产品说明书.pdf_1718759513.25

Shimadzu GC-2014C184-E014F 产品说明书.pdf_1718759513.25

GC-2014Big Performance & Small Space GC-2014Improved design and innovative technology for all of our injectors, detectors and fl ow controllers equal or surpass our GC-2010 the high-end technology leader.High PerformanceSuperior PerformanceLarge LCD, all digital gases control and auto-diagnostics inherited from the GC-2010 – “The Most advanced, easy-to-use interface”Easy OperationExcellent User InterfaceUse any column types for any analysis. Packed or capillary columns give you the freedom to choose the best technique for your measurement. Fully integrated multiple valve systems are made simple for optimum performance for SystemGC custom GC products.FlexibilityExpandability for Every SituationSimple nozzle replacement supports both capillary and packed columns.Our New FPD is used for all columnsDetectorsHolophotal Flame Photometric DetectorPhotomultiplierFilter Lens Nozzle The detectors have been completely redesigned, incorporating the GC-2010 detector designs for capillary analyses and the GC-14 detector designs for packed columns. This TCD-2014 unit is ideal for packed column measurements employing the semi-diffusion cell designInjection unitswith unsurpassed accuracyThe design of the SPL-2014 capillary column sample injection unit is based on the GC-2010 technology.This accuracy was unattainable with previous models.The packed column sample injection unit employs the proven design of the GC-14 injection unit.Easier to understand, simpler operationLarge display, help functions and pop-up screens Loaded with productivity-enhancing functionsEasy OperationA large LCD displays chromatograms and method parameters.This is a great improvement for Chromatopacs systems that do not have these real time displays.Graphical user interface enables quick setting of all analytical conditions.The built-in Help function almost eliminates need for familiarization training.Large displayshows most analysis details at a glance,ideal for Chromatopac users.Graphical popup screen that clearly indicates thepolarity so manual injection errors are prevented when using the dual packed column system.Polarity display prevents injection errorsEasy-to-understand Pop-up ScreensChromatogram display Graphical U/IBuilt-in Help FunctionLarge Display6Self-diagnosticsUnit control check Hardware diagnosis Save and check diagnosis logGC-2014250mmGC-14230mmSolenoid valve unitManual fl ow controllersAFCSpeci fi cationsDetectorsTemperature range Temperature settingNo. of units installed simultaneously Detector type 400°C max. (FID, TCD, FTD) 350°C max. (ECD, FPD) 1°C stepsUp to 4 units (restricted depending on detector type) FID, TCD, ECD, FPD, FTD for capillary/packedDual fl ow rate differential system400°C max.3pgC/s (dodecane)107Quartz glass Standard: for packed, Option: for capillaryFlame Ionization Detector (FID) SystemTemperature rangeMinimum detected quantityDynamic rangeNozzleThermal Conductivity Detector (TCD)System Temperature range Dynamic range Sensitivity Dual fl ow rate differential system400°C max.10540,000mV · mL/mg (built-in pre-ampli fi er, with 10 × ampli fi cation)Electron Capture Detector (ECD)SystemTemperature range Minimum detected quantity Dynamic range Fixed current system using 63Ni370MBq radiation source 400°C max.0.1pg/s (γ-BHC)104Flame Photometric Detector (FPD)Temperature range Dynamic rangeMinimum detected quantity 350°C max.P: 104S: 103P: 0.5pgP/s (tributyl phosphate) S: 8pgS/s (dodecane thiol)Flame Thermionic Detector (FTD)Temperature range Dynamic rangeMinimum detected quantity (Two types, one for capillary and one for packed. The speci fi cation are the same.) 400°C max.N: 103P: 103N: 0.4pgN/s (azobenzene)P: 0.05pgP/s (malathion)Display240 × 320 dot graphics display (30 characters × 16 lines)Dimensions, Weight, Power Requirements (GC main unit)Dimensions WeightPower Requirements 400 (W) × 690 (H) × 607 (D) mm48kg (GC-2014AF model)AC100V/120V 230V1800VA (GC-2014AF model) or2600VA (GC-2014AF model), 50/60HzColumn OvenTemperature range DimensionsOven capacity Temperature accuracy Temperature deviation Temperature variation coef fi cient Temperature program steps Programmed rate setting range Total time for all steps Linear heating rangeCooling rateColumns accepted (Ambient + 10°C) ~ 400°C (using liquid CO2 gas*: -50°C ~400°C)250 (W) × 360 (H) × 175 (D) mm15.8LSet value (K) ± 1% (calibration at 0.01°C increments)2°C max. (on 200mm dia. circumference 30mm from rear)0.01°C/°CUp to 20 (cooling program possible)-250°C ~ 250°C/min9999.99 minutes max.30°C/min up to 150°C20°C/min up to 250°C10°C/min up to 380°C7°C/min up to 400°C (at 25°C ambient temperature)300°C ~ 50°C in 6 min max. (at 25°C ambient temperature)Capillary columns: 2Packed columns for GC14B: 4 (Glass columns: 2)Sample Injection UnitTemperature rangeHeating settingsNo. of units installed simultaneously Sample injection unit types Up to 400°C1°C stepsUp to 3 unitsDual packed, single packed, split/splitless, direct, direct (AMC)Carrier Gas Flow Controller For Packed / DualFlow rate setting range Programmable steps Programmed rate setting range Correction function 0 ~ 100mL/min7-400 ~ 400mL/minMaintains column fl ow rate during column oven heatingFor Capillary Split/Splitless, Direct (Split/splitless injection mode)Pressure setting range Programmable steps Programmed rate setting range Split ratio setting rangeTotal fl ow rate setting range Correction function 0 ~ 970kPa7 (pressure-decreasing program possible)-400 ~ 400kPa/min0 ~ 9999.90 ~ 1200mL/minMaintains column average linear velocity during column oven heating (for capillary only)(Pressure mode direct injection)Pressure setting range Programmable steps Programmed rate setting range Correction function 0 ~ 970kPa/min7-400 ~ 400kPa/minMaintains column average linear velocity during column oven heating (for capillary only)(Flow-rate mode direct injection)Flow rate setting range Programmable steps Programmed rate setting range 0 ~ 1200mL/min 7-400 ~ 400mL/minFor Single Packed, Direct (AMC)Flow rate setting range Correction function 0~100mL/minMaintenance column fl ow rate during column oven heating*Optional parts are required to use liquid CO2 gas.。

NSF14中文

NSF14中文

元件認證指南目錄飲用水處理系統和元件認證指南章節-----------------------------------------------------------------------------------頁碼序--------------------------------------------------------------------------------------1-4 概況-----------------------------------------------------------------------------------5常見問題-----------------------------------------------------------------------------6-8 NSF標準規定-----------------------------------------------------------------------9-15 認證-----------------------------------------------------------------------------------15-18 與供應商合作-----------------------------------------------------------------------19詞彙表--------------------------------------------------------------------------------20-24 附錄A--------------------------------------------------------------------------------25附錄B--------------------------------------------------------------------------------26附錄C--------------------------------------------------------------------------------27-28 聯絡資訊-----------------------------------------------------------------------------29序NSF International(簡稱NSF)成立於1944年,為一個致力於公共衛生安全以及環境保護的機構。

LCX14中文资料

LCX14中文资料

© 2005 Fairchild Semiconductor Corporation DS012412March 1995Revised February 200574LCX14 Low Voltage Hex Inverter with 5V Tolerant Schmitt Trigger Inputs74LCX14Low Voltage Hex Inverterwith 5V Tolerant Schmitt Trigger InputsGeneral DescriptionThe LCX14 contains six inverter gates each with a Schmitt trigger input. They are capable of transforming slowly changing input signals into sharply defined, jitter-free out-put signals. In addition, they have a greater noise margin than conventional inverters.The LCX14 has hysteresis between the positive-going and negative-going input thresholds (typically 1.0V) which is determined internally by transistor ratios and is essentially insensitive to temperature and supply voltage variations.The inputs tolerate voltages up to 7V allowing the interface of 5V, 3V and 2.5V systems.The 74LCX14 is fabricated with advanced CMOS technol-ogy to achieve high speed operation while maintaining CMOS low power dissipation.Featuress 5V tolerant inputss 2.3V–3.6V V CC specifications provided s 6.5 ns t PD max (V CC 3.3V), 10 P A I CC max s Power down high impedance inputs and outputs s r 24 mA output drive (V CC 3.0V)s Implements patented noise/EMI reduction circuitry s Latch-up performance exceeds JEDEC 78 conditions s ESD performance:Machine model ! 200VHuman model ! 2000Vs Leadless Pb-Free DQFN packageOrdering Code:Devices also available in T ape and Reel. Specify by appending the suffix letter “X ” to the ordering code.Pb-Free package per JEDEC J-STD-020B.Note 1: DQFN package available in Tape and Reel only.Note 2: “_NL ” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.Order Number Package Package DescriptionNumber 74LCX14M M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow 74LCX14MX_NL(Note 2)M14A Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow 74LCX14SJ M14D Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide74LCX14BQX (Note 1)MLP014A Pb-Free 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm74LCX14MTC MTC1414-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 74LCX14MTCX_NL (Note 2)MTC14Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 274L C X 14Logic SymbolIEEE/IECPin DescriptionsTruth TableConnection DiagramsPin Assignments for SOIC, SOP , and TSSOPPad Assignments for DQFN(Top View)Pin NamesDescription I n Inputs O nOutputsInput OutputA O LH HL74LCX14Absolute Maximum Ratings (Note 3)Recommended Operating Conditions (Note 5)Note 3: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The “Recom-mended Operating Conditions ” table will define the conditions for actual device operation.Note 4: I O Absolute Maximum Rating must be observed.Note 5: Unused inputs must be held HIGH or LOW. They may not float.DC Electrical CharacteristicsSymbol ParameterValueConditionsUnits V CC Supply Voltage 0.5 to 7.0V V I DC Input Voltage 0.5 to 7.0VV O DC Output Voltage 0.5 to V CC 0.5Output in HIGH or LOW State (Note 4)V I IK DC Input Diode Current 50V I GND mA I OK DC Output Diode Current 50V O GND mA 50V O ! V CCI O DC Output Source/Sink Current r 50mA I CC DC Supply Current per Supply Pin r 100mA I GND DC Ground Current per Ground Pin r 100mAT STGStorage Temperature65 to 150q CSymbol ParameterMin Max Units V CC Supply Voltage Operating 2.0 3.6V Data Retention1.5 3.6V I Input Voltage 0 5.5V V O Output Voltage HIGH or LOW State 0V CCV I OH /I OLOutput CurrentV CC 3.0V 3.6V r 24mAV CC 2.7V 3.0V r 12V CC 2.3V 2.7Vr 8Symbol ParameterConditionsV CC T A 40q C to 85q C Units (V)Min Max V t Positive Input Threshold 2.50.9 1.7V 3.0 1.2 2.2V t Negative Input Threshold 2.50.4 1.1V 3.00.6 1.5V H Hysteresis2.50.3 1.0V3.00.4 1.2V OHHIGH Level Output VoltageI OH 100P A 2.3 3.6V CC - 0.2VI OH = -8 mA 2.3 1.8I OH 12 mA 2.7 2.2I OH 18 mA 3.0 2.4I OH 24 mA3.0 2.2V OLLOW Level Output VoltageI OL 100P A 2.3 3.60.2V I OL = 8mA 2.30.6I OL 12 mA 2.70.4I OL 16 mA 3.00.4I OL 24 mA3.00.55I I Input Leakage Current 0 d V I d 5.5V 2.3 3.6r 5.0P A I OFF Power-Off Leakage Current V I or V O 5.5V 010P A I CC Quiescent Supply Current V I V CC or GND 2.3 3.610P A 3.6V d V I d 5.5V 2.3 3.6r 10'I CCIncrease in I CC per InputV IH V CC 0.6V2.33.6500P A 474L C X 14AC Electrical CharacteristicsNote 6: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (t OSHL ) or LOW-to-HIGH (t OSLH ).Dynamic Switching CharacteristicsCapacitanceSymbolParameterT A 40q C to 85q C, R L 500 :UnitsV CC 3.3V r 0.3VV CC 2.7V V CC 2.5V r 0.2VC L 50 pF C L 50 pF C L 30 pF MinMax Min Max Min Max t PHL Propagation Delay Time1.5 6.5 1.57.5 1.57.8ns t PLH 1.56.5 1.57.51.57.8t OSHL Output to Output Skew 1.0ns t OSLH(Note 6)1.0Symbol ParameterConditionsV CC T A 25q C Units (V)Typical V OLP Quiet Output Dynamic Peak V OL C L 50 pF, V IH 3.3V, V IL 0V 3.30.8V C L 30 pF, V IH 2.5V, V IL 0V 2.50.6V OLVQuiet Output Dynamic Valley V OLC L 50 pF, V IH 3.3V, V IL 0V 3.3 0.8VC L 30 pF, V IH 2.5V, V IL 0V2.50.6Symbol ParameterConditionsTypical Units C IN Input Capacitance V CC Open, V I 0V or V CC 7pF C OUT Output CapacitanceV CC 3.3V, V I 0V or V CC8pF C PDPower Dissipation CapacitanceV CC 3.3V, V I 0V or V CC , f 10 MHz25pF74LCX14AC Loading and Waveforms Generic for LCX FamilyFIGURE 1. AC Test Circuit(C L includes probe and jig capacitance)Waveform for Inverting and Non-Inverting FunctionsPropagation Delay, Pulse Width and t rec Waveforms3-STATE Output High Enable andDisable TImes for Logic3-STATE Output Low Enable andDisable Times for LogicSetup Time, Hold TIme and Recovery TIme for Logict rise and t fallFIGURE 2. Waveforms(Input Pulse Characteristics; f = 1MHz, t r = t f = 3ns)Test Switcht PLH, t PHL Opent PZL, t PLZ6V at V CC 3.3 r 0.3VV CC x 2 at V CC 2.5 r 0.2Vt PZH,t PHZ GNDSymbolV CC3.3V r 0.3V 2.7V 2.5V r 0.2VV mi 1.5V 1.5V V CC/2V mo 1.5V 1.5V V CC/2V x V OL 0.3V V OL 0.3V V OL 0.15VV y V OH 0.3V V OH 0.3V V OH 0.15V 674L C X 14Schematic DiagramGeneric for LCX Family74LCX14Tape and Reel SpecificationTape Format for DQFNTAPE DIMENSIONS inches (millimeters)REEL DIMENSIONS inches (millimeters)PackageTape Number Cavity Cover Tape DesignatorSection Cavities Status Status Leader (Start End)125 (typ)Empty Sealed BQXCarrier 2500/3000Filled Sealed Trailer (Hub End)75 (typ)EmptySealedTapeSize A B C D N W1W212 mm13.00.0590.5120.7957.0080.4880.724(330)(1.50)(13.00)(20.20)(178)(12.4)(18.4) 874L C X 14Physical Dimensionsinches (millimeters) unless otherwise noted14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" NarrowPackage Number M14A 74LCX14Physical Dimensions inches (millimeters) unless otherwise noted (Continued)Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm WidePackage Number M14D 1074L C X 14Physical Dimensionsinches (millimeters) unless otherwise noted (Continued)Pb-Free 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mmPackage Number MLP014APhysical Dimensions inches (millimeters) unless otherwise noted (Continued)14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm WidePackage Number MTC14Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:1.Life support devices or systems are devices or systemswhich, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea-sonably expected to result in a significant injury to the user.2. A critical component in any component of a life supportdevice or system whose failure to perform can be rea-sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.元器件交易网 74LCX14 Low Voltage Hex Inverter with 5V Tolerant Schmitt Trigger Inputs。

IBM Z14 ZR1 和 LinuxONE Rockhopper II 电缆出口选项说明书

IBM Z14 ZR1 和 LinuxONE Rockhopper II 电缆出口选项说明书

IBM Z14ZR1 AND L INUX ONE R OCKHOPPER IIC ABLE E XIT C HOICESEdited by Aleis Murphy, Greg HutchisonIBM Z Hardware Sales SpecialistsWashington Systems CenterHerndon, VA This document is designed to address potential confusion regarding the ordering of Top and/orBottom Exit Cabling on the IBM z14 ZR1 and LinuxONE Rockhopper II.For additional information, please refer to the 3907 Installation Manual for Physical Planning (IMPP).Here are summary points to the details that follow.1.I/O and power cabling can be routed through the top of the rack, even when bottomexit cabling is ordered. The Top Exit Cabling feature provides a top hat. Top hat details to follow in this document.2.Top and Bottom Exit Cabling can both be ordered simultaneously.3.There is no non-raised floor feature although this system can be installed on a non-raised floor. With bottom exit cabling on a non-raised floor, all cables must egress out of the top of the machine – and an exit path out of the top of the machine is provided for the cables.4.Fiber Quick Connect - FQC (FC7934) can be ordered with either Top Exit or Bottom ExitCabling. FQC is applicable to FICON Express16S+, FICON Express16S and FICONExpress8S – Long Wave only.5.When FQC is desired, Fiber Transport Services must also be ordered.Figure 1: This is the Cables tab in eConfig for the z14 ZR1 and LinuxONE Rockhopper II. This screenshot should be familiar to IBMers and Business Partners only.Note that in the cabling tab of the IBM configurator, there are three choices.Fiber Transport Services (FTS)This provides installation planning assistance, fiber trunking cable, connectors, distribution enclosures, cable support routing hardware, and installation by IBM personnel.With the use of fiber trunking and distribution enclosures, all system reconfigurations may be performed at a patch panel, planned to eliminate extensive down time and enhancing your availability.Reconfiguration is as simple as unplugging and re-plugging a connector. The Enterprise Fiber Cabling Services use a proven modular cabling system, the fiber transport system (FTS), which includes trunk cables, zone cabinets, and panels for servers, directors, and storage devices. FTS supports Fiber Quick Connect (FQC), a fiber harness that is integrated in the frame of a z14server for quick connection. In the IBM z14 FQC supports FICON LX features types. Fiber Quick Connect can be implemented out of the top or the bottom in the z14 ZR1.Top Exit Cabling FC7917When installed on a non-raised floor, all cables shall be egressed out of the top of the rack, even if only Bottom Exit Cabling is ordered.When Top Exit Cabling is ordered, there are no side chimneys as with other IBM Z systems. In the case of the z14 Model ZR1 and LinuxOne Rockhopper II a new “top hat” is provided with Top Exit Cabling.The top hat can be configured to exit cables either from the top-front or the top-rear of the rack. This same feature can be used for overhead power cabling or for overhead I/O cabling. The feature is required for scenarios in which top exit is desired with Fiber Quick Connect (FC7934) brackets at the top. The top hat provides cable strain relief and cable management. Strain relief is also available out of the top when Top Exit Cabling is not ordered. Minimum: 0Maximum: 1Pre-requisites: NoneCo-requisites: NoneCompatibility Conflicts: NoneField Installable: YesFigure 2: IBM z14 Model ZR1 Top Hat for Top Exit Cabling – cables exiting from the front ofthe top exit cabling enclosureIf FCQ is also ordered, appropriate harness brackets are included.Figure 3: The Fiber Quick Connect feature enables trunk cables to connect to FICON channels using under-the-cover attachment harnesses. These harnesses are installed when your system is built, and your 3907 arrives ready to connect the trunk cables at your site. The harness brackets use an MTP connector, and the FICON connects are routed to the FICONfeature cards in the rack.Figure 4: When routing cables directly through the top of the frame, there are two sliding plates on the top of the frame (one on each side of the rear of the frame) that can be opened and any gaps can be eliminated with self-sticking foam. The foam assists with airflow containment. The sliding plates can be used for top exit cabling, even if the Top Exit Cabling feature code is not ordered.Bottom Exit Cabling FC7919When bottom exit cabling is selected, the required infrastructure is provided. This feature includes cabling egress for both Input/Output (I/O) cables and power cables.When installation is on a raised floor and when cables are planned to be egressed out the bottom of the rack, FC7919 should be ordered.When installed on a non-raised floor, all cables shall be egressed out of the top of the rack. Minimum: 0Maximum: 1Pre-requisites: NoneCo-requisites: NoneCompatibility Conflicts: NoneField Installable: YesFigure 5: Bottom Exit Cabling TailgateIBM has offered tailgates for a variety of generations of IBM Z systems. Tailgates in the past have offered the ability to support and protect the cables that are exiting the system.The tailgates offered today are specifically designed for cushioning the exiting cables as well as preventing or minimizing airflow recirculation within the system.These bracket assemblies are only available and installed on the rear of the system. With Bottom Exit Cabling there can be no cable egress in the front of the z14 ZR1 or LinuxONE Rockhopper II system.I/O feature cables and connectorsThe IBM Facilities Cabling Services fiber transport system offers a total cable solution service to help with cable ordering requirements. These services can include the requirements for all of the protocols and media types that are supported (for example, FICON, Coupling Links, and OSA). The services can help whether the focus is the data center, SAN, LAN, or the end-to-end enterprise.You can route I/O cables:- Through the top of the frame using the top exit cabling (FC 7917) with FQC (Fiber Quick Connect)- Through the top of the frame using the top exit cabling (FC 7917) without FQC- Directly through the top of the frame, even without Top Exit Cabling- Through the bottom of the frame using the bottom exit cabling feature (FC 7919) with FQC - Through the bottom of the frame using the bottom exit cabling feature (FC 7919) without FQC- Through the bottom of the frame or to the top of the frame using the spine cable management hardware (see the next page) if the 3907 contains more than one PCIe+ I/O drawers or if you are installing the 16U Reserved feature (FC 0617).The Fiber Quick Connect (FQC) feature for FICON LX cabling and trunking (only) can be used on a 3907 that is installed on a raised floor or a non-raised floor. This is an optional feature. The FQC components can be on the top or the bottom of the machine, depending on whether you’ve order Bottom Exit Cabl ing or Top Exit Cabling or both.Figure 6: Rack Enclosure Cable Management SystemA newly designed vertical cable management guide (“spine”) can assist with proper cable management for fiber, copper, and coupling cables. The spine is shipped with configurations that contain two to four PCIe+ I/O drawers or with the 16U Reserved feature (FC 0617). All external cabling to the system (from top or bottom) can use the spine to minimize interference with the PDUs mounted on the sides of the rack. The spine includes removable hooks that can be placed in appropriate slots throughout the length of the spine.IBM Site and Facilities has a comprehensive set of scalable solutions to address cabling requirements, from product-level to enterprise-level for small, medium, and large enterprises. These services fall into two major categories:- IBM Facilities Cabling Services - fiber transport system- IBM IT Facilities Assessment, Design, and Construction Services - optimized airflow assessment for cabling.Planning and installation services for individual fiber optic cable connections are available. An assessment and planning for IBM Fiber Transport System (FTS) trunking components can also be performed. These services are designed to be right-sized for your products or the end-to-end enterprise, and to take into consideration the requirements for all of the protocols and media types supported on z14, LinuxONE and older IBM Z servers (for example, FICON, Coupling Links, OSA-Express) whether the focus is the data center, the Storage Area Network (SAN), the Local Area Network (LAN), or the end-to-end enterprise.IBM Site and Facilities are designed to deliver convenient, packaged services to help reduce the complexity of planning, ordering, and installing fiber optic cables. The appropriate fiber cabling is selected based upon the product requirements and the installed fiber plant.z14 ZR1 and LinuxONE Rockhopper II Height ConsiderationsAlways consult the Installation Manual for Physical Planning publication.Height Reduction:If you have doorways that will not fit the 3907, you should order FC9975. This reduces the frame height to 1900 mm (74.8 in). With FC9975, the 2U top hat, the primary Support Element, and the alternate Support Element are shipped in separate boxes.Height Reduction adds time to the installation process and should be selected only when absolutely necessary for delivery clearance purposes. FC9975 should be ordered for openings less than 2032 mm (80.0 in) high.The top exit cabling enclosure is installed on the top of the machine in the rear. The following table provides the dimensions and weight for the top exit cabling enclosure (FC7917):Note: Ensure that there is enough headroom for cabling to exit the top of the z14 and easily be routed into overhead trays.。

Z64S4440M中文资料(Aerovox)中文数据手册「EasyDatasheet - 矽搜」

Z64S4440M中文资料(Aerovox)中文数据手册「EasyDatasheet - 矽搜」
芯片中文手册,看全文,戳
交流电动机运行电容器
ZeMax TM - 铝合金外壳
AEROMET II - 塑料盒
SuperMet - 金属外壳
芯片中文手册,看全文,戳
目录
AEROMET II规格(系列M型).......................................... .................................... 3 SuperMet & ZeMax TM 规格(系列Z型)............................................ .................. 4 部分编号系统.............................................................................................................五 AEROMET II评分表(单台容量)系列M型....................................... ........... 6 AEROMET II评分表(双功能)系列型号M ....................................... ............. 8 SuperMet评分表(单台容量)系列Z型........................................ ............... 9 SuperMet评分表(双容量)系列Z型........................................ .............. 11 ZeMax TM 评分表(单台容量)系列Z型......................................... ........... 13 AEROMET II机械尺寸.............................................. .......................................... 15 SuperMet机械尺寸............................................... ........................................... 16 ZeMax TM 机械Dimensions............................................................................................17 附件 - 安装硬件.............................................. ............................................ 18

定型wbh-814技术说明书v1.50

定型wbh-814技术说明书v1.50

目录1概述 (3)1.1功能简介 (3)1.2功能配置 (3)1.2.1WBH-814非电量保护装置的配置 (3)1.3功能特点 (3)2基本技术参数 (4)2.1基本数据 (4)2.1.1额定直流数据 (4)2.1.2打印机辅助交流电源 (4)2.1.3机箱结构 (4)2.2功率消耗 (4)2.3输出触点 (5)2.3.1信号触点容量 (5)2.3.2跳闸出口触点容量 (5)2.3.3辅助继电器触点容量 (5)2.4绝缘性能 (5)2.5冲击电压 (5)2.6寿命 (5)2.7机械性能 (5)2.8环境条件 (5)2.9抗干扰能力 (5)3主要技术指标 (6)3.1保护定值整定范围和定值误差 (6)3.2记录容量 (6)3.2.1故障事件报告容量 (6)3.2.2异常记录容量 (6)3.3对时方式 (6)4装置背视图和端子图 (6)4.1WBH-814保护装置背视图和端子图 (6)4.1.1WBH-814保护装置背视图 (6)4.1.2WBH-814保护装置端子图 (6)4.1.3WBH-814保护装置就地信号触点图 (9)4.1.4WBH-814保护装置跳闸触点图 (10)5保护原理说明 (10)5.1非电量保护原理 (10)6整定内容及整定说明 (11)6.1通讯参数设置 (11)6.2WBH-814的保护整定清单 (12)6.2.1WBH-814 的保护软压板清单 (12)6.2.2WBH-814 的保护定值清单 (12)6.2.3WBH-814 的保护出口清单 (13)7保护装置保护性能测试 (14)7.1非电量保护性能测试 (14)7.1.1经CPU开出的开入插件测试 (14)7.1.2不经CPU开出的开入插件测试 (14)7.1.3非电量保护测试举例说明 (14)8订货须知 (15)9附录一:保护性能测试准备工作 (15)10附录二:装置使用说明 (15)10.1键盘 (15)11附录三:装置运行说明 (16)11.1面板指示灯说明 (16)11.2运行工况及说明 (16)11.3故障报文和处理措施 (16)12附录四:装置通讯说明(IEC 60870-5-103规约) (17)12.1告警信息 (17)12.2自检信息 (17)1概述1.1功能简介WBH-814装置完成变压器非电量保护,需要延时的非电量不需要外加延时继电器,由CPU延时。

维佳银星中文手册

维佳银星中文手册

视频会议终端VegaStarSilver用户手册意大利爱斯乐电讯概述该手册描述了视频会议终端VegaStarSilver、VegaStarGold和AVC8400的功能和技术特征,以及正确的使用信息。

需要说明的是,VegaStarSilver、VegaStarGold和AVC8400三种产品仅仅在个别技术指标上有差异,本手册主要描述产品的操作使用,对上述三种产品是通用的。

使用的符号和语法在这本手册中,下面的一些符号用于红外控制按钮:功能按钮字母-数字键盘按钮通过会议终端的自带键盘或红外控制器的字母-数字键盘按钮即可:例如:◇按一次=1◇按两次=A◇按三次=B◇按一次=*◇按两次=.◇按三次=@◇按四次=space◇按一次=#◇两次=&◇按三次=\◇按四次=/按钮或一组按钮的功能紧跟在每个符号之后给出。

许多功能要求使用界面图标或直接使用红外控制器按钮。

当对各个单元进行操作的时候,对各种功能的描述包含了一些显示的窗口的示例。

硬件连接设备的具体操作这一章描述了会议终端设备一般的操作步骤,比如说,怎样产生一个连接(可以是呼叫,也可以是应答)。

在这之前,我们假定系统已经正确安装,还假定视频窗口显示出主菜单。

发起一个呼叫在系统启动后出现的主界面如:包含三种不同的呼叫方式:●从电话号码簿呼叫●视频和音频呼叫音频呼叫从电话号码簿呼叫该设备利用终端频繁的连接数据,提供了一种直接的选择方式,你只须从列表中选出呼叫号码,系统将直接将呼叫发送出去。

使用红外控制器箭头按钮选择电话号码簿,按OK键:1.直接翻动索引查找所要的第一个字母。

2.使用红外控制器箭头按钮选择出你想要的名字,并按OK键。

3.按“呼叫”键发出呼叫。

4.按“断开”键断开连接。

发起视频/音频呼叫1.使用红外控制器箭头按钮选择主界面中的“视频呼叫”键,并按OK键。

2.选择呼叫类型(LAN/ISDN)。

3.按数字键盘输入呼叫号码。

4.用键盘输入呼叫的人名(对IP有效)-用箭头按钮选择需输入的字母,并按OK键。

SIH产品知识080914

SIH产品知识080914

SIH汽车产品知识依维柯红岩SIH系列车型编号规则续表2: 驾驶室代号表厚德载物自强不息表6:代号驱动型式代号驱动型式代号驱动型式156×6910×4268×4012×4378×8488×213SIH系列车型编号规则续•内部管理车型CQ3254XW29G294GKL表示为总质量为25t的自卸汽车上装有斯太尔霸王驾驶室、潍柴W P10.290(213k W);一、二轴轴距为29dm,驱动型式为6×4,装有高腹面的宽车架、同型号功率较大的发动机(此车型型号中,CQ为企业名称代号,3表示自卸汽车,25表示车辆的总质量为25t,4表示产品序号(在此特指国Ⅲ),X表示装斯太尔霸王驾驶室,W29表示装潍柴W P10.290(213k W);G表示高腹面车架,K表示宽车架,L表示同型号功率较大的发动机)。

•注意事项:•在已定型的基本型车上进行的局部改进或选装总成,且变化较少,为便于管理,该车型可用内部管理车型型号进行区分,但产品合格证、产品标牌打印的车型型号及对外联系反映的车型型号应为该车型的产品公告车型型号。

查公告实例说明15厚德载物自强不息车辆识别代码(VIN)•为了识别某一辆车,有车辆制造厂为该辆车指定的一组字码;•保证30年内在世界范围内制造的所有车辆的VIN代号具有唯一性;•提供车辆的一般特性资料。

•基本内容分为三部分(共17位):•WMI 世界制造厂识别代号•VDS 车辆说明部分(车辆特征代码)•VIS 车辆指示部分16厚德载物自强不息车辆识别代码(VIN)•我公司产品:•红岩车L Z F H31M6×××××××××(整车)L Z F F26M8×××××××××(底盘)•斯太尔车L Z F E24M4×××××××××(整车)L Z F C30M6×××××××××(底盘)20厚德载物自强不息主要参数名词解释1、尺寸参数轴距:指车轴之间的距离。

2014 Honda Odyssey LX技术参考指南说明书

2014 Honda Odyssey LX技术参考指南说明书

T E C H N O L O G YR E F E R E N C EG U I D Eo w n e r s.h o n d a.c o m2014SMS T ext Messaging................................................................................................14Basic Audio Operation..........................................................................................15Bluetooth ®Audio......................................................................................................16Pandora ®. (17)iPod ®or USB Flash Drive (18)BLUETOOTH ®HANDSFREELINK ®p.10INSTRUMENT PANEL p.2i-MID p.5p.Malfunction IndicatorsIf an indicator remains on, there may be a problem; see your dealerCharging system Low tire pressure:Add air Immobilizer (blinks): Use other vehicle key and see your dealerDaytime running lights (DRL)Maintenance Minder TM: Make dealer appointmentINFORMATION DISPLAYWhen you start the engine, the rip meter A/B,T o toggle between the different displays, press and release the select/reset knob repeatedly.AUTO DOOR LOCKSSETTINGS FOR YOUR VEHICLEPress SETTINGS to enter the Settings Menu. Use the selector Choose from the available options:Adjust bass, treble, and more.Clock Adjustment Adjust the system clock.Camera SettingsWhat to DoUse these buttons to navigate through the HFL menus. Selector knob:Go directly to the phone Rotate to scroll PHONE button:*This feature is inoperable when the vehicle is moving.you can make a call using voice commands.See your Owner’s Manual for instructions onSelect various controls depending on the audio source being played.Connect an iPhone or iPod dockMake sure your phone is on and paired topage 11) and the screen is on and unlocked.Press AUX until Bluetooth Audio appears on the display.From your phone, open the desired audio player or app and begin playing. Sound is redirected to the audio system. Make sure the volume on your phone is properly adjusted.iPod OR USB FLASH DRIVEConnect the iPod dock connector or USB flash drive to the USB port(see page 15).Press AUX until iPod or USB appears on the display.Use the steering wheel or audio system controls to change tracks.Note:Connect your device only when your vehicle is stopped.HONDA OWNERS。

英特尔核处理器(14代)销售指南说明书

英特尔核处理器(14代)销售指南说明书

On the following slides we’ll show you how to sell to the following customers:Intel ® Core ™Processors (14th gen) deliver the ultimate immersiveexperience for everything from intense gaming and creating to highly focused and intentional work sessions.Gamers CreatorsHow to Sell GuideIntel ® Core ™ Desktop Processors (14th gen)GamersWhat DoGamers Dowith Their PC?AAA GamingOnline GamingStreamingEnthusiast Tuning &Overclocking6For gamers, the experience is what matters. Their PCmust give them the performance they need to playspecific titles or fire up the latest, most demandingsoftware on the highest settings.Gamer-Focused Conversation Starters:▪IMPROVED P-core and E-core frequency2 and INCREASED L2 & L3 cache3 for tacklingmore complex gameplay processes▪NEW Discrete Wi-Fi 7 support for supercharged wireless connectivity and immersiveonline gameplay8▪Performance hybrid architecture with up to 24 (8P+16E) cores and up to 32 threads forthe needs of the most demanding games1▪Intel® Dynamic Tuning Technology for streamlined gaming performance▪DDR5 support (up to 5600 MT/s) for high refresh rates and smooth gameplay5,7▪Discrete Thunderbolt™ 4 technology support (USB4 compliant) to connect gamingaccessories, peripherals, and move game files to an external drive with up to 40 GbpsbandwidthLook for the K and KF SKUs for GamersWhat DoGamers ValueMost?Price-PerformanceBalanceEase of UseConnectivityMultitaskingHow to Sell to:GameWithoutCompromiseCreatorsWhat Do Creators Do with Their PC?Digital Arts & Editing Animation 3D Modeling Music ProductionWhether livestreaming or crafting digital art, creators rely on their PC as an extension of their creativity. Their PC is a tool that enables expression, and its value always comes back to how it helps or hinders a creator’s ability to realize their vision.Creator-Focused Conversation Starters:▪IMPROVED Intel ® Smart Cache Technology 3to optimize the system memory required tocreate and edit large files▪MORE E-cores and greater L3 cache with Intel ® Core ™ i7 processors (14th gen) for more multitasking power ▪NEW Discrete Wi-Fi 7 support for downloading, uploading, and streaming their latest creations 8▪Features a larger max memory capacity of up to 192GB for more application data▪Intel ® Thread Director 4 prioritizes workloads for optimized multitasking between multiple creative applications ▪Discrete Thunderbolt ™ 4 technology support (USB4 compliant) to connect creativeaccessories and peripherals and move project files to an external drive with up to 40 Gbps bandwidthWhat DoCreators Value Most?PerformanceReliability Connectivity MultitaskingLook for the K and KF SKUs for CreatorsHow to Sell to:C r e a t e W i t h o u t C o m p r o m i s eNotices & DisclaimersPerformance varies by use, configuration and other factors. Learn more on the Performance Index site.Performance results are based on testing as of dates shown in configurations and may not reflect all publicly available updates. See backup for configuration details. No product or component can be absolutely secure.Your costs and results may vary.Intel technologies may require enabled hardware, software or service activation.© Intel Corporation. Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and brands may be claimed as the property of others.1.Performance hybrid architecture combines two core microarchitectures, Performance-cores (P-cores) and Efficient-cores (E-cores), on a single processor die first introducedon 12th Gen Intel® Core™ processors. Select 12th Gen and newer Intel® Core™ processors do not have performance hybrid architecture, only P-cores or E-cores, and may have the same cache size. See for SKU details, including cache size and core frequency.2.Select SKUs E-cores frequency improved. See for SKU details.3.Intel® Core™ i5 desktop processors (14th gen), Intel® Core™ i7 desktop processors (14th gen), and Intel® Core™ i9 desktop processors (14th gen) only.4.Built into the hardware, Intel® Thread Director is provided only in performance hybrid architecture configurations of 12th Gen or newer Intel® Core™ processors; OS enablementis required. Available features and functionality vary by OS.5.On select processor SKUs. DDR5-5600 MT/s 1DPC UDIMM 1Rx8, 1Rx16 (lead supplier) and DDR5-5200 1Rx8, 1Rx16, 2Rx8 are POR on all Intel® Core™ i9 desktop processorSKUs, all Intel® Core™ i7 desktop processor SKUs, and select Intel® Core™ i5 desktop processor SKUs (14th gen).6.Unlocked features are present with select chipsets and processor combinations. Altering clock frequency or voltage may void any product warranties and reduce stability,security, performance, and life of the processor and other components. Check with system and component manufacturers for details.7.Maximum memory speeds are associated with 1 DIMM per Channel (1DPC) configurations. Additional DIMM loading on any channel may impact maximum memory speed. Upto DDR5-5600 MT/s 1DPC UDIMM 1Rx8, 1Rx16 and DDR5-5200 1Rx8, 1Rx16, 2Rx8 on select SKUs. Maximum memory capacity is achievable with 2DPC configurations. For additional 2DPC configuration details, refer to the Raptor Lake Processor External Design Specification (EDS), Doc ID 640555.8.Subject to regional availability, operating system support and router compatibility. Learn more at https:///content/www/us/en/products/docs/wireless/wi-fi-7.html。

ir2014芯片手册

ir2014芯片手册

ir2014芯片手册摘要:1.ir2014 芯片概述2.ir2014 芯片的主要特性3.ir2014 芯片的引脚功能4.ir2014 芯片的内部结构5.ir2014 芯片的应用领域正文:ir2014 是一款四路光耦隔离器,具有高速、高电压隔离能力和卓越的电磁兼容性。

这款芯片主要应用于计算机、通信设备、家用电器以及工业自动化领域,提供了可靠的输入输出隔离。

首先,让我们来看一下ir2014 芯片的主要特性。

ir2014 具有高速传输能力,能够满足各种高速信号传输的需求。

同时,它还具有高电压隔离能力,可以有效地保护电路不受高压干扰。

此外,ir2014 还具有良好的电磁兼容性,能够在各种复杂的电磁环境下正常工作。

接下来,我们来看一下ir2014 芯片的引脚功能。

ir2014 芯片共有四个引脚,分别是输入端IN1、IN2、输出端OUT1、OUT2。

其中,输入端用于接收输入信号,输出端用于输出隔离后的信号。

在使用时,需要将输入端的信号接入到芯片的输入引脚,然后将输出端的信号接入到芯片的输出引脚,以实现信号的隔离传输。

再来看一下ir2014 芯片的内部结构。

ir2014 芯片内部采用了光电耦合器结构,通过光电转换实现输入输出信号的隔离。

这种结构既保证了信号的传输速度,又保证了信号的隔离性能。

最后,我们来看一下ir2014 芯片的应用领域。

由于ir2014 具有高速、高电压隔离能力和良好的电磁兼容性,因此,它广泛应用于计算机、通信设备、家用电器以及工业自动化领域。

在这些领域中,ir2014 提供了可靠的输入输出隔离,保障了设备的正常运行。

SIHF9Z14L资料

SIHF9Z14L资料

Power MOSFETIRF9Z14S, SiHF9Z14S, IRF9Z14L, SiHF9Z14LVishay SiliconixFEATURES •Advanced Process Technology•Surface Mount (IRF9Z14S/SiHF9Z14S)•Low-ProfileThrough-Hole (IRF9Z14L/SiHF9Z14L)•175 °C Operating Temperature •Fast Switching •P-Channel•Fully Avalanche Rated •Lead (Pb)-free AvailableDESCRIPTIONThird generation Power MOSFETs from Vishay utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.The D 2PAK is a surface mount power package capable of accommodating die size up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D 2PAK is suitable for high current applications because of is low internal connection resistance and can dissipate up to 2.0 W in a typical surface mount application.The through-hole version (IRF9Z14L/Si HF9Z14L) is available for low-profile applications.Notea.See device orientation.PRODUCT SUMMARYV DS (V)- 60R DS(on) (Ω)V GS = - 10 V0.50Q g (Max.) (nC)12Q gs (nC) 3.8Q gd (nC) 5.1ConfigurationSingleG D SORDERING INFORMATIONPackage D 2PAK (TO-263)D 2PAK (TO-263)I 2PAK (TO-262)Lead (Pb)-free IRF9Z14SPbF IRF9Z14STRLPbF a IRF9Z14LPbFSiHF9Z14S-E3SiHF9Z14STL-E3a SiHF9Z14L-E3SnPbIRF9Z14S IRF9Z14STRL a -SiHF9Z14SSiHF9Z14STL a-ABSOLUTE MAXIMUM RATINGS T C = 25 °C, unless otherwise notedPARAMETER SYMBOL LIMITU NITDrain-Source Voltage V DS- 60VGate-Source Voltage V GS ± 20Continuous Drain Current eV GS at - 10 VT C = 25 °C I D- 6.7A T C = 100 °C- 4.7Pulsed Drain Current a, e I DM - 27Linear Derating Factor0.29W/°CSingle Pulse Avalanche Energy b, e E AS 140mJ Avalanche Current aI AR - 6.7A Repetiitive Avalanche Energy a E AR 4.3mJMaximum Power DissipationT C = 25 °C P D 3.7WT A = 25 °C43IRF9Z14S, SiHF9Z14S, IRF9Z14L, SiHF9Z14LVishay SiliconixNotesa.Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).b.V DD = - 25 V, starting T J = 25 °C, L = 3.6 mH, R G = 25 Ω, I AS = - 6.7 A (see fig. 12).c.I SD ≤ - 6.7 A, dI/dt ≤ 90 A/µs, V DD ≤ V DS , T J ≤ 175 °C.d. 1.6 mm from case.es IRF9Z14/SiHF9Z14 data and test conditions.Notea.When mounted on 1" square PCB (FR-4 or G-10 material).Peak Diode Recovery dV/dt c, edV/dt - 4.5V/ns Operating Junction and Storage Temperature RangeT J , T stg- 55 to + 175°CSoldering Recommendations (Peak Temperature)for 10 s 300dTHERMAL RESISTANCE RATINGSPARAMETER SYMBOL TYP.MAX.U ITMaximum Junction-to-Ambient (PCBMounted, steady-state)aR thJA-40°C/WMaximum Junction-to-Case (Drain)R thJC - 3.5ABSOLUTE MAXIMUM RATINGS T C = 25 °C, unless otherwise notedPARAMETER SYMBOL LIMITU ITN N N NIRF9Z14S, SiHF9Z14S, IRF9Z14L, SiHF9Z14LVishay SiliconixNotesa.Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).b.Pulse width ≤ 300 µs; duty cycle ≤ 2 %.es IRF9Z14/SiHF9Z14 data and test conditions.TYPICAL CHARACTERISTICS 25 °C, unless otherwise notedFig. 1 - Typical Output CharacteristicsFig. 2 - Typical Output Characteristics Fig. 3 - Typical Transfer CharacteristicsFig. 4 - Normalized On-Resistance vs. TemperatureDrain-Source Body Diode Characteristics Body Diode Reverse Recovery Time t rr T J = 25 °C, I F = - 6.7 A, dI/dt = 100 A/µsb, c-80160ns Body Diode Reverse Recovery Charge Q rr -96190nCForward Turn-On Timet onIntrinsic turn-on time is negligible (turn-on is dominated by L S and L D )SPECIFICATIONS T J = 25 °C, unless otherwise notedPARAMETER SYMBOL TEST CO N DITIO N S MI N .TYP.MAX.U NITIRF9Z14S, SiHF9Z14S, IRF9Z14L, SiHF9Z14L Vishay SiliconixFig. 5 - Typical Capacitance vs. Drain-to-Source Voltage Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage Fig. 7 - Typical Source-Drain Diode Forward VoltageIRF9Z14S, SiHF9Z14S, IRF9Z14L, SiHF9Z14LVishay SiliconixFig. 9 - Maximum Drain Current vs. Case TemperatureFig. 10a - Switching Time Test CircuitFig. 10b - Switching Time WaveformsFig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-CaseFig. 12a - Unclamped Inductive Test CircuitFig. 12b - Unclamped Inductive WaveformsIRF9Z14S, SiHF9Z14S, IRF9Z14L, SiHF9Z14LVishay SiliconixFig. 12c - Maximum Avalanche Energy vs. Drain CurrentFig. 13a - Basic Gate Charge WaveformFig. 13b - Gate Charge Test CircuitIRF9Z14S, SiHF9Z14S, IRF9Z14L, SiHF9Z14LVishay SiliconixVishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see /ppg?91089.Disclaimer Legal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网。

以色列球阀标准SI1144

以色列球阀标准SI1144

以色列球阀标准SI1144(1998年3月修订版)目录表A部分概要101 范围102 参考103 定义104 分类105 标识106 使用说明书106 标准的符合性B部分材料和结构201 结构202 材料203 质量和表面处理204 阀体205 球和阀杆206 手柄207 启闭装置208 密封件209 连接形式C部分测试和附加要求301 概要302 主要损失303 密封性304 抗静压性305 调节时的稳定性306 增压时密封的稳定性307 耐久性A 部分-----概要101 范围这标准适用于公称直径从1/2 "-2"的螺纹连接的球阀(以下简称阀门)。

适用于金属制作和一般用途流体输送系统中的阀门,包括饮用水、农业用水和工业用水的阀门。

102引用标准下列标准和文献资料被引用:以色列标准SI50.3---密封性管螺纹SI137----铜合金锭SI258----镍镀铬和铜镀镍铬SI67----灰铸铁SI103----英制螺纹钢管SI982----黑心可锻铸铁、珠光体可锻铸铁和白口可锻铸铁国外标准DIN2999-1983-----惠氏管螺纹103定义在本标准中,下列定义是适应的:球阀阀门的密封元件是一个带有通孔的球。

阀门的关闭是通过球绕一个轴线旋转来实现的,这轴线与水道中心线和球孔中心线相垂直。

公称直径名义值,常用作阀门的分类,等同于管子的公称直径.操作装置一个组件,能传递力,通过球的旋转来完成打开、关闭流体通道和调节流体的流量。

公称压力名义值,常用作阀门的等级;它近似表示阀门在连续使用过程中能承受最大的静压,单位用巴。

104产品分类按公称压力,阀门分类如下:4巴阀6巴阀10巴阀16巴阀大于16巴阀(按制造者的声明)105标识每一个阀门都要有明显的、清晰的、耐用的、凸出的或盖印的标识,包括以下内容:生产商名称或注册商标公称直径公称压力(按104条款)生产商产品目录上的模型图案,如果生产商产品超过一个款式时。

SI-EH

SI-EH

压力(%)
100 90 90 80 80 70 70 60 60 50 50 40 40 30 30 20 20 10 10 00 0 0.5 1.5 1 2 2.5 3.5 3 4
位置 压力
100 90 90 80 80 70 70 60 60 50 50 40 40 30 30 20 20 10 10 0 0 0.5 1.5 1 2 2.5
SI/EH PRO-改进的监测和控制:
• 数据记录仪-记录事件、分析和报警信息。
• Rotork 蓝牙设定器 PRO-在 SI/EH 执行机构和 Insight2 软件 之间进行数据下载和上传。
• 半自动极限位置校准。
• 部分行程—可远程或使用 Rotork 蓝牙®设置器 Pro 就地激 活。
• 可选 ESD 手动复位—限制执行器的操作,直到当过程控制 安全时在本地手动复位。
SI-EH 直行程性能数据
EH-L 执行器可灵活用于各种特殊作业,且设计可用于双位置或 紧急关闭。执行器在慢速模式选项下也可设置用于精度<0.5%的 模拟控制。当电源断开或收到控制信号时可令弹簧伸缩或双动以 进行故障保护或末位锁定。可选蓄能器和各种液压泵的尺寸均能 满足所需的操作速度和故障安全操作。
• 兼容 Rotork Insight2 软件。

兼容各种
Rotork





-Pakscan

®
Profibus

Foundation Fieldbus®、Devicenet® 和 Modbus。
Insight2
重新定义流体控制
3
SI-EH 角行程执行器
Skilmatic SI/EH-Q 系列产品为角行程阀门和调节 器提供了独一无二且安全可靠的电动故障安全型 和调节控制的解决方案。
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Power MOSFETIRLZ14, SiHLZ14Vishay SiliconixFEATURES•Dynamic dV/dt Rating •Logic-Level Gate Drive•R DS(on) Specified at V GS = 4 V and 5 V •175 °C Operating Temperature •Fast Switching •Ease of Paralleling •Simple Drive Requirements •Lead (Pb)-free AvailableDESCRIPTIONThird generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching,ruggedized device design, low on-resistance and cost-effectiveness.The TO-220 package is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 W. The low thermal resistance and low package cost of the TO-220 contribute to its wide acceptance throughout the industry.Notesa.Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).b.V DD = 25 V, starting T J = 25 °C, L = 793 µH, R G = 25 Ω, I AS = 10 A (see fig. 12).c.I SD ≤ 10 A, dI/dt ≤ 90 A/µs, V DD ≤ V DS , T J ≤ 175 °C.d. 1.6 mm from case.PRODUCT SUMMARYV DS (V)60R DS(on) (Ω)V GS = 5.0 V0.20Q g (Max.) (nC)8.4Q gs (nC) 3.5Q gd (nC) 6.0ConfigurationSingleTO-220GDSORDERING INFORMATIONPackage TO-220Lead (Pb)-free IRLZ14PbF SiHLZ14-E3SnPbIRLZ14SiHLZ14ABSOLUTE MAXIMUM RATINGS T C = 25 °C, unless otherwise notedPA AMETE SYMBOL LIMIT UNIT Drain-Source Voltage V DS60VGate-Source Voltage V GS ± 10 Continuous Drain Current V GS at 5.0 VT C = 25 °C I D10A T C = 100 °C7.2Pulsed Drain Current a I DM 40Linear Derating Factor0.29W/°C Single Pulse Avalanche Energy b E AS 68mJ Maximum Power Dissipation T C = 25 °CP D 43WPeak Diode Recovery dV/dt cdV/dt 4.5V/ns Operating Junction and Storage Temperature Range T J , T stg- 55 to + 175°C Soldering Recommendations (Peak Temperature)for 10 s 300d Mounting Torque6-32 or M3 screw10lbf · in 1.1N · m * Pb containing terminations are not RoHS compliant, exemptions may apply元器件交易网IRLZ14, SiHLZ14Vishay SiliconixNotesa.Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).b.Pulse width ≤ 300 µs; duty cycle ≤ 2 %.THERMAL RESISTANCEPA AMETE SYMBOL MIN.TYP.MAX.UNIT Maximum Junction-to-Ambient R thJA --62°C/WCase-to-Sink, Flat, Greased Surface R thCS -0.50-Maximum Junction-to-Case (Drain)R thJC--3.5元器件交易网IRLZ14, SiHLZ14Vishay SiliconixTYPICAL CHARACTERISTICS 25 °C, unless otherwise notedC Fig. 2 - Typical Output Characteristics, T C= 175 °CFig. 3 - Typical Transfer CharacteristicsFig. 4 - Normalized On-Resistance vs. Temperature元器件交易网IRLZ14, SiHLZ14Vishay SiliconixFig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage元器件交易网IRLZ14, SiHLZ14 Vishay SiliconixFig. 9 - Maximum Drain Current vs. Case Temperature Fig. 10a - Switching Time Test Circuit Fig. 10b - Switching Time Waveforms元器件交易网IRLZ14, SiHLZ14Vishay SiliconixFig. 12a - Unclamped Inductive Test CircuitFig. 12b - Unclamped Inductive WaveformsFig. 13a - Basic Gate Charge WaveformFig. 13b - Gate Charge Test Circuit元器件交易网IRLZ14, SiHLZ14Vishay SiliconixFig. 14 - For N-ChannelVishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see /ppg?91325.元器件交易网Disclaimer Legal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网。

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