G1084-18TU3U中文资料 - 360文档中心

gc1084规格参数

gc1084规格参数
摘要：
1.GC1084 概述
2.GC1084 规格参数
1.1 尺寸参数
1.2 性能参数
1.3 接口参数
正文：
【GC1084 概述】
GC1084 是一款广泛应用于各种领域的规格参数，其性能和尺寸都符合行业标准。

GC1084 不仅可以提供准确的数据，还能够帮助用户更好地理解和分析数据，因此在科学研究、工程设计、产品质量控制等领域都有广泛的应用。

【GC1084 规格参数】
【1.1 尺寸参数】
GC1084 的尺寸参数包括长、宽、高三个方面。

其具体的尺寸大小可以根据用户的实际需求进行定制，但一般来说，GC1084 的尺寸参数都符合国际标准，可以满足大部分用户的需求。

【1.2 性能参数】
GC1084 的性能参数主要包括响应时间、精度、灵敏度等。

GC1084 的响应时间非常快，可以在短时间内提供准确的数据。

其精度和灵敏度也符合国际标准，可以满足用户的各种需求。

【1.3 接口参数】
GC1084 的接口参数包括接口类型、接口尺寸等。

GC1084 的接口类型多样，可以满足不同用户的需求。

其接口尺寸也符合国际标准，可以与其他设备无缝连接。

总的来说，GC1084 是一款性能优秀、尺寸合适的规格参数，其各项参数都符合国际标准，可以满足大部分用户的需求。

GS8640Z18GT-167中文资料

GS8640Z18/36T-300/250/200/16772Mb Pipelined and Flow ThroughSynchronous NBT SRAM 300 MHz –167 MHz 2.5 V or 3.3 V V DD 2.5 V or 3.3 V I/O100-Pin TQFP Commercial Temp Industrial Temp Features• NBT (No Bus Turn Around) functionality allows zero wait read-write-read bus utilization; Fully pin-compatible with both pipelined and flow through NtRAM™, NoBL™ and ZBT™ SRAMs• 2.5 V or 3.3 V +10%/–10% core power supply • 2.5 V or 3.3 V I/O supply• User-configurable Pipeline and Flow Through mode • LBO pin for Linear or Interleave Burst mode• Pin compatible with 4Mb, 9Mb, 18Mb and 36Mb devices • Byte write operation (9-bit Bytes)• 3 chip enable signals for easy depth expansion • ZZ Pin for automatic power-down• JEDEC-standard 100-lead TQFP package• RoHS-compliant 100-lead TQFP package availableFunctional DescriptionThe GS8640Z18/36T is a 72Mbit Synchronous Static SRAM. GSI's NBT SRAMs, like ZBT, NtRAM, NoBL or other pipelined read/double late write or flow through read/single late write SRAMs, allow utilization of all available bus bandwidth by eliminating the need to insert deselect cycles when the device is switched from read to write cycles.Because it is a synchronous device, address, data inputs, and read/ write control inputs are captured on the rising edge of the input clock. Burst order control (LBO) must be tied to a power rail for proper operation. Asynchronous inputs include the Sleep mode enable (ZZ) and Output Enable. Output Enable can be used to override the synchronous control of the output drivers and turn the RAM's output drivers off at any time. Write cycles are internally self-timed and initiated by the rising edge of the clock input. This feature eliminates complex off-chip write pulse generation required by asynchronous SRAMs and simplifies input signal timing.The GS8640Z18/36T may be configured by the user to operate in Pipeline or Flow Through mode. Operating as a pipelined synchronous device, meaning that in addition to the rising edge triggered registers that capture input signals, the deviceincorporates a rising-edge-triggered output register. For read cycles, pipelined SRAM output data is temporarily stored by the edge triggered output register during the access cycle and then released to the output drivers at the next rising edge of clock.The GS8640Z18/36T is implemented with GSI's highperformance CMOS technology and is available in a JEDEC-standard 100-pin TQFP package.Parameter Synopsis-300-250-200-167Unit Pipeline 3-1-1-1t KQ tCycle 2.33.3 2.54.0 3.05.0 3.56.0ns ns (x18)Curr (x32/x36)480410350305mA Flow Through 2-1-1-1t KQ tCycle 5.55.5 6.56.57.57.58.08.0ns ns (x18)Curr (x32/x36)330280250240mA*All GSI Technology packages are at least 5/6 RoHS compliant.Packages listed with the additional “G” designator are 6/6 RoHS compliant.807978777675747372717069686766656463626160595857565554535251123456789101112131415161718192021222324252627282930V DDQ V SS DQ B DQ B V SS V DDQ DQ B DQ B FT V DD V DD V SS DQ B DQ B V DDQ V SS DQ B DQ B DQP BV SS V DDQ V DDQ V SS DQ A DQ A V SS V DDQ DQ A DQ A V SS NC V DD ZZ DQ A DQ A V DDQ V SS DQ A DQ A V SS V DDQ L B O A A A A A 1A 0N C N C V S SV D DA A A A A A A AA A E 1E 2 N C N C B BB AE 3C K W C K E VD DV S SG A D V A A A AA 2M x 18Top View DQP A A NC NC NC NC NC NC NC NCNC NC NC NC NC NC NCNC NC 100999897969594939291908988878685848382813132333435363738394041424344454647484950GS8640Z18/36T-300/250/200/167GS8640Z18T Pinout807978777675747372717069686766656463626160595857565554535251123456789101112131415161718192021222324252627282930V DDQ V SS DQ C DQ C V SS V DDQ DQ C DQ C FT V DD V DD V SS DQ D DQ D V DDQ V SS DQ D DQ D DQ D V SS V DDQ V DDQ V SS DQ B DQ B V SS V DDQ DQ B DQ B V SS NC V DD ZZ DQ A DQ A V DDQ V SS DQ A DQ A V SS V DDQ L B O A A A A A 1A 0N C N C V S SV D DA A A A A A A AA A E 1E 2 B DB CB BB AE 3C K W C K E VD DV S SG A D V A A A AA 1M x 36Top View DQB DQP B DQ B DQ B DQ B DQ A DQ A DQ A DQ A DQP ADQ C DQ C DQ C DQ D DQ D DQ D DQP DDQ C DQP C 100999897969594939291908988878685848382813132333435363738394041424344454647484950GS8640Z18/36T-300/250/200/167GS8640Z36T PinoutTQFP Pin DescriptionsSymbolTypeDescriptionA 0, A 1In Burst Address Inputs; Preload the burst counterA In Address Inputs CK In Clock Input SignalB A In Byte Write signal for data inputs DQ A1-DQ A9; active low B B In Byte Write signal for data inputs DQ B1-DQ B9; active low BC In Byte Write signal for data inputs DQ C1-DQ C9; active low BD In Byte Write signal for data inputs DQ D1-DQ D9; active lowW In Write Enable; active low E 1In Chip Enable; active lowE 2In Chip Enable; Active High. For self decoded depth expansion E 3In Chip Enable; Active Low. For self decoded depth expansionG In Output Enable; active lowADV In Advance/Load; Burst address counter control pinCKE In Clock Input Buffer Enable; active low DQ A I/O Byte A Data Input and Output pins DQ B I/O Byte B Data Input and Output pins DQ C I/O Byte C Data Input and Output pins DQ D I/O Byte D Data Input and Output pins ZZ In Power down control; active high FT In Pipeline/Flow Through Mode Control; active lowLBO In Linear Burst Order; active lowV DD In Core power supplyV SS In GroundV DDQ In Output driver power supplyNC—No ConnectGS8640Z18/36T-300/250/200/167KS A 1S A 0B u r s t Co u nt e rL B OA D VM e m o r y A r r a yE 3E 2E 1GWB DB CB BB AC KC K ED QF TD Q a –D Q nKS A 1’S A 0’D QM a t c hW r i t e A d d r e s sR e g i s t e r 2W r i t e A d d r e s sR e g i s t e r 1W r i t e D a t aR e g i s t e r 2W r i t e D a t aR e g i s t e r 1KKKKKKS e n s e A m p sW r i t e D r i v e r sR e a d , W r i t e a n dD a t a C o h e r e n c yC o n t r o l L o g i cF TA 0–A nGS8640Z18/36T-300/250/200/167GS8640Z18/36 NBT SRAM Functional Block DiagramGS8640Z18/36T-300/250/200/167Functional DetailsClockingDeassertion of the Clock Enable (CKE) input blocks the Clock input from reaching the RAM's internal circuits. It may be used to suspend RAM operations. Failure to observe Clock Enable set-up or hold requirements will result in erratic operation.Pipeline Mode Read and Write OperationsAll inputs (with the exception of Output Enable, Linear Burst Order and Sleep) are synchronized to rising clock edges. Single cycle read and write operations must be initiated with the Advance/Load pin (ADV) held low, in order to load the new address. Device activation is accomplished by asserting all three of the Chip Enable inputs (E 1, E 2 and E 3). Deassertion of any one of the Enable inputs will deactivate the device. Function W B A B B B C B D Read H X X X X Write Byte “a”L L H H H Write Byte “b”L H L H H Write Byte “c”L H H L H Write Byte “d”L H H H L Write all Bytes L L L L L Write Abort/NOPLHHHHRead operation is initiated when the following conditions are satisfied at the rising edge of clock: CKE is asserted Low, all three chip enables (E 1, E 2, and E 3) are active, the write enable input signals W is deasserted high, and ADV is asserted low. The address presented to the address inputs is latched in to address register and presented to the memory core and control logic. The control logic determines that a read access is in progress and allows the requested data to propagate to the input of the output register. At the next rising edge of clock the read data is allowed to propagate through the output register and onto the output pins.Write operation occurs when the RAM is selected, CKE is active, and the Write input is sampled low at the rising edge of clock. The Byte Write Enable inputs (B A , B B , B C, & B D ) determine which bytes will be written. All or none may be activated. A write cycle with no Byte Write inputs active is a no-op cycle. The pipelined NBT SRAM provides double late write functionality,matching the write command versus data pipeline length (2 cycles) to the read command versus data pipeline length (2 cycles). At the first rising edge of clock, Enable, Write, Byte Write(s), and Address are registered. The Data In associated with that address is required at the third rising edge of clock.Flow Through Mode Read and Write OperationsOperation of the RAM in Flow Through mode is very similar to operations in Pipeline mode. Activation of a Read Cycle and the use of the Burst Address Counter is identical. In Flow Through mode the device may begin driving out new data immediately after new address are clocked into the RAM, rather than holding new data until the following (second) clock edge. Therefore, in Flow Through mode the read pipeline is one cycle shorter than in Pipeline mode.Write operations are initiated in the same way, but differ in that the write pipeline is one cycle shorter as well, preserving the ability to turn the bus from reads to writes without inserting any dead cycles. While the pipelined NBT RAMs implement a double late write protocol, in Flow Through mode a single late write protocol mode is observed. Therefore, in Flow Through mode, address and control are registered on the first rising edge of clock and data in is required at the data input pins at the second rising edge of clock.Synchronous Truth TableOperationType Address CK CKE ADV W Bx E 1E 2E 3G ZZDQNotesRead Cycle, Begin Burst R External L-H L L H X L H L L L Q Read Cycle, Continue Burst B Next L-H L H X X X X X L L Q 1,10NOP/Read, Begin Burst R External L-H L L H X L H L H L High-Z 2Dummy Read, Continue Burst B Next L-H L H X X X X X H L High-Z 1,2,10Write Cycle, Begin Burst W External L-H L L L L L H L X L D 3Write Cycle, Continue Burst B Next L-H L H X L X X X X L D1,3,10Write Abort, Continue Burst B Next L-H L H X H X X X X L High-Z 1,2,3,10Deselect Cycle, Power Down D None L-H L L X X H X X X L High-Z Deselect Cycle, Power Down D None L-H L L X X X X H X L High-Z Deselect Cycle, Power Down D None L-H L L X X X L X X L High-Z Deselect Cycle D None L-H L L L H L H L X L High-Z 1Deselect Cycle, Continue DNone L-H L H X X X X X X L High-Z 1Sleep ModeNone X X X X X X X X X H High-Z Clock Edge Ignore, StallCurrentL-HHXXXXXXXL-4Notes:1.Continue Burst cycles, whether read or write, use the same control inputs. A Deselect continue cycle can only be entered into if a Dese-lect cycle is executed first.2.Dummy Read and Write abort can be considered NOPs because the SRAM performs no operation. A Write abort occurs when the Wpin is sampled low but no Byte Write pins are active so no write operation is performed.3.G can be wired low to minimize the number of control signals provided to the SRAM. Output drivers will automatically turn off duringwrite cycles.4.If CKE High occurs during a pipelined read cycle, the DQ bus will remain active (Low Z). If CKE High occurs during a write cycle, the buswill remain in High Z.5. X = Don’t Care; H = Logic High; L = Logic Low; Bx = High = All Byte Write signals are high; Bx = Low = One or more Byte/Writesignals are Low6.All inputs, except G and ZZ must meet setup and hold times of rising clock edge.7.Wait states can be inserted by setting CKE high.8.This device contains circuitry that ensures all outputs are in High Z during power-up.9. A 2-bit burst counter is incorporated.10.The address counter is incriminated for all Burst continue cycles.GS8640Z18/36T-300/250/200/167GS8640Z18/36T-300/250/200/167DeselectNew ReadNew WriteBurst ReadBurst WriteWRBRBWDDBBWRD BWRDDCurrent State (n)Next State (n+1)TransitionƒInput Command CodeKeyNotes:1. The Hold command (CKE Low) is notshown because it prevents any state change.2. W, R, B and D represent input commandcodes ,as indicated in the Synchronous Truth Table.Clock (CK)CommandCurrent StateNext Stateƒnn+1n+2n+3ƒƒƒCurrent State and Next State Definition for Pipeline and Flow Through Read/Write Control State DiagramWRPipeline and Flow Through Read Write Control State DiagramGS8640Z18/36T-300/250/200/167IntermediateIntermediateIntermediateIntermediateIntermediateIntermediateHigh Z (Data In)Data Out (Q Valid)High Z B W B R B DRW RWDDCurrent State (n)TransitionƒInput Command CodeKeyTransitionIntermediate State (N+1)Notes:1. The Hold command (CKE Low) is notshown because it prevents any state change.2. W, R, B, and D represent input command codes as indicated in the Truth Tables.Clock (CK)CommandCurrent StateIntermediate ƒn n+1n+2n+3ƒƒƒCurrent State and Next State Definition for Pipeline Mode Data I/O State DiagramNext StateStatePipeline Mode Data I/O State DiagramGS8640Z18/36T-300/250/200/167High Z (Data In)Data Out (Q Valid)High Z B W B R B DRW RWDDCurrent State (n)Next State (n+1)TransitionƒInput Command CodeKeyNotes1. The Hold command (CKE Low) is notshown because it prevents any state change.2. W, R, B and D represent input command codes as indicated in the Truth Tables.Clock (CK)CommandCurrent StateNext Stateƒnn+1n+2n+3ƒƒƒCurrent State and Next State Definition for: Pipeline and Flow Through Read Write Control State DiagramFlow Through Mode Data I/O State DiagramGS8640Z18/36T-300/250/200/167Burst CyclesAlthough NBT RAMs are designed to sustain 100% bus bandwidth by eliminating turnaround cycle when there is transition from read to write, multiple back-to-back reads or writes may also be performed. NBT SRAMs provide an on-chip burst address generator that can be utilized, if desired, to further simplify burst read or write implementations. The ADV control pin, when driven high, commands the SRAM to advance the internal address counter and use the counter generated address to read or write the SRAM. The starting address for the first cycle in a burst cycle series is loaded into the SRAM by driving the ADV pin low, into Load mode.Burst OrderThe burst address counter wraps around to its initial state after four addresses (the loaded address and three more) have beenaccessed. The burst sequence is determined by the state of the Linear Burst Order pin (LBO). When this pin is low, a linear burst sequence is selected. When the RAM is installed with the LBO pin tied high, Interleaved burst sequence is selected. See the tables below for details.Mode Pin FunctionsMode NamePin NameStateFunctionBurst Order Control LBO L Linear Burst H Interleaved Burst Output Register Control FT L Flow Through H or NC Pipeline Power Down Control ZZ L or NC Active H Standby, I DD = I SB Single/Dual Cycle Deselect Control SCD L Dual Cycle Deselect H or NC Single Cycle Deselect FLXDrive Output Impedance ControlZQ L High Drive (Low Impedance)H or NC Low Drive (High Impedance)9th Bit EnablePEL Activate DQPx I/Os (x18/x3672 mode)H or NCDeactivate DQPx I/Os (x16/x3272 mode)Note:There is a are pull-up devices on the ZQ, SCD, and FT pins and a pull-down device on the ZZ pin, so those this input pins can be unconnected and the chip will operate in the default states as specified in the above tables.Note:The burst counter wraps to initial state on the 5th clock.Note:The burst counter wraps to initial state on the 5th clock.Linear Burst SequenceA[1:0]A[1:0]A[1:0]A[1:0]1st address 000110112nd address 011011003rd address 101100014th address11000110Interleaved Burst SequenceA[1:0]A[1:0]A[1:0]A[1:0]1st address 000110112nd address 010011103rd address 101100014th address11100100GS8640Z18/36T-300/250/200/167Burst Counter SequencesBPR 1999.05.18GS8640Z18/36T-300/250/200/167Sleep ModeDuring normal operation, ZZ must be pulled low, either by the user or by it’s internal pull down resistor. When ZZ is pulled high, the SRAM will enter a Power Sleep mode after 2 cycles. At this time, internal state of the SRAM is preserved. When ZZ returns to low, the SRAM operates normally after 2 cycles of wake up time.Sleep mode is a low current, power-down mode in which the device is deselected and current is reduced to I SB 2. The duration of Sleep mode is dictated by the length of time the ZZ is in a high state. After entering Sleep mode, all inputs except ZZ become disabled and all outputs go to High-Z The ZZ pin is an asynchronous, active high input that causes the device to enter Sleep mode. When the ZZ pin is driven high, I SB 2 is guaranteed after the time tZZI is met. Because ZZ is an asynchronous input, pending operations or operations in progress may not be properly completed if ZZ is asserted. Therefore, Sleep mode must not be initiated until valid pending operations are completed. Similarly, when exiting Sleep mode during tZZR, only a deselect or read commands may be applied while the SRAM is recovering from Sleep mode.Sleep Mode Timing DiagramtZZRtZZHtZZStKLtKHtKCCKZZDesigning for CompatibilityThe GSI NBT SRAMs offer users a configurable selection between Flow Through mode and Pipeline mode via the FT signal found on Pin 14. Not all vendors offer this option, however most mark Pin 14 as V DD or V DDQ on pipelined parts and V SS on flow through parts. GSI NBT SRAMs are fully compatible with these sockets.Absolute Maximum Ratings(All voltages reference to V SS )SymbolDescriptionValueUnitV DD Voltage on V DD Pins –0.5 to 4.6V V DDQ Voltage in V DDQ Pins –0.5 to 4.6V V I/O Voltage on I/O Pins –0.5 to V DDQ +0.5 (≤ 4.6 V max.)V V IN Voltage on Other Input Pins –0.5 to V DD +0.5 (≤ 4.6 V max.)V I IN Input Current on Any Pin +/–20mA I OUT Output Current on Any I/O Pin +/–20mA P D Package Power Dissipation 1.5WT STG Storage Temperature –55 to 125o C T BIASTemperature Under Bias–55 to 125oCGS8640Z18/36T-300/250/200/167Note:Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended Operating Conditions. Exposure to conditions exceeding the Absolute Maximum Ratings, for an extended period of time, may affect reliability of this component. Power Supply Voltage RangesParameterSymbolMin.Typ.Max.UnitNotes3.3 V Supply Voltage V DD3 3.0 3.3 3.6V 2.5 V Supply Voltage V DD2 2.3 2.5 2.7V 3.3 V V DDQ I/O Supply Voltage V DDQ3 3.0 3.3 3.6V 2.5 V V DDQ I/O Supply VoltageV DDQ22.32.52.7VNotes:1.The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifica-tions quoted are evaluated for worst case in the temperature range marked on the device.2.Input Under/overshoot voltage must be –2 V > Vi < V DDn +2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.GS8640Z18/36T-300/250/200/167V DDQ3 Range Logic LevelsParameterSymbolMin.Typ.Max.UnitNotesV DD Input High Voltage V IH 2.0—V DD + 0.3V 1V DD Input Low Voltage V IL –0.3—0.8V 1V DDQ I/O Input High Voltage V IHQ 2.0—V DDQ + 0.3V 1,3V DDQ I/O Input Low VoltageV ILQ–0.3—0.8V1,3Notes:1.The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifica-tions quoted are evaluated for worst case in the temperature range marked on the device.2.Input Under/overshoot voltage must be –2 V > Vi < V DDn +2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.3.V IHQ (max) is voltage on V DDQ pins plus 0.3 V.V DDQ2 Range Logic LevelsParameterSymbolMin.Typ.Max.UnitNotesV DD Input High Voltage V IH 0.6*V DD —V DD + 0.3V 1V DD Input Low Voltage V IL –0.3—0.3*V DD V 1V DDQ I/O Input High Voltage V IHQ 0.6*V DD —V DDQ + 0.3V 1,3V DDQ I/O Input Low VoltageV ILQ–0.3—0.3*V DDV1,3Notes:1.The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifica-tions quoted are evaluated for worst case in the temperature range marked on the device.2.Input Under/overshoot voltage must be –2 V > Vi < V DDn +2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.3.V IHQ (max) is voltage on V DDQ pins plus 0.3 V.Recommended Operating TemperaturesParameterSymbolMin.Typ.Max.UnitNotesAmbient Temperature (Commercial Range Versions)T A 02570°C 2Ambient Temperature (Industrial Range Versions)T A–402585°C2Notes:1.The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifica-tions quoted are evaluated for worst case in the temperature range marked on the device.2.Input Under/overshoot voltage must be –2 V > Vi < V DDn +2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.GS8640Z18/36T-300/250/200/16720% tKCV SS – 2.0 V50%V SS V IHUndershoot Measurement and TimingOvershoot Measurement and Timing20% tKCV DD + 2.0 V50%V DDV ILCapacitanceo C, f = 1 MH Z , V DD ParameterSymbolTest conditionsTyp.Max.UnitInput Capacitance C IN V IN = 0 V 45pF Input/Output Capacitance C I/OV OUT = 0 V67pFNote:These parameters are sample tested.AC Test ConditionsParameterConditionsInput high level V DD – 0.2 V Input low level 0.2 V Input slew rate 1 V/ns Input reference level V DDQ /2Output reference levelV DDQ /2Output loadFig. 1Notes:1.Include scope and jig capacitance.2.Test conditions as specified with output loading as shown in Fig. 1unless otherwise noted.3.Device is deselected as defined by the Truth Table.DQV DDQ/250Ω30pF *Output Load 1* Distributed Test Jig Capacitance(T A = 25= 2.5 V)DC Electrical CharacteristicsParameterSymbolTest ConditionsMinMaxInput Leakage Current (except mode pins)I IL V IN = 0 to V DD –2 uA 2 uA ZZInput CurrentI IN1V DD ≥ V IN ≥ V IH 0 V ≤ V IN ≤ V IH–1 uA –1 uA 1 uA 100 uA Output Leakage Current (x36/x72)I OL Output Disable, V OUT = 0 to V DD –1 uA 1 uA Output Leakage Current (x18)I OL Output Disable, V OUT = 0 to V DD –1 uA 1 uA Output High Voltage V OH2I OH = –8 mA, V DDQ = 2.375 V 1.7 V —Output High Voltage V OH3I OH = –8 mA, V DDQ = 3.135 V2.4 V —Output Low VoltageV OLI OL = 8 mA—0.4 VGS8640Z18/36T-300/250/200/167Operating CurrentsParameterTest ConditionsModeSymbol-300-250-200-167Unit0to 70°C –40 to 85°C 0to 70°C –40 to 85°C 0to 70°C –40to 85°C 0 to 70°C –40to 85°C Operating CurrentDevice Selected; All other inputs ≥V IH o r ≤ V IL Output open(x32/x36)Pipeline I DD I DDQ 4206044060360503805031040330402703529035mA Flow Through I DD I DDQ 3003032030255252752523020250202202024020mA (x18)PipelineI DD I DDQ 3703039030315253352527020290202402026020mA Flow Through I DD I DDQ 2701529015230152501520515225151951521515mA Standby Current ZZ ≥ V DD – 0.2 V —PipelineI SB 100120100120100120100120mA Flow Through I SB 100120100120100120100120mA Deselect CurrentDevice Deselected; All other inputs ≥ V IH or ≤ V IL—Pipeline I DD 150165140155130146125140mA Flow ThroughI DD135150125140120135120135mAGS8640Z18/36T-300/250/200/167Notes:1.I DD and I DDQ apply to any combination of V DD3, V DD2, V DDQ3, and V DDQ2 operation.2.All parameters listed are worst case scenario.AC Electrical CharacteristicsParameter Symbol -300-250-200-167Unit Min Max MinMax MinMax MinMax PipelineClock Cycle Time tKC 3.3— 4.0— 5.0— 6.0—ns Clock to Output ValidtKQ — 2.3— 2.5— 3.0— 3.5ns Clock to Output Invalid tKQX 1.5— 1.5— 1.5— 1.5—ns Clock to Output in Low-ZtLZ 1 1.5— 1.5— 1.5— 1.5—ns Setup time tS 1.1— 1.2— 1.4— 1.5—ns Hold time tH 0.1—0.2—0.4—0.5—ns Flow ThroughClock Cycle Time tKC 5.5— 6.5—7.5—8.0—ns Clock to Output ValidtKQ — 5.5— 6.5—7.5—8.0ns Clock to Output Invalid tKQX 3.0— 3.0— 3.0— 3.0—ns Clock to Output in Low-ZtLZ 1 3.0— 3.0— 3.0— 3.0—ns Setup time tS 1.5— 1.5— 1.5— 1.5—ns Hold time tH 0.5—0.5—0.5—0.5—ns Clock HIGH Time tKH 1.0— 1.3— 1.3— 1.3—ns Clock LOW Time tKL 1.2— 1.5— 1.5— 1.5—ns Clock to Output inHigh-Z tHZ 1 1.5 2.3 1.5 2.5 1.5 3.0 1.5 3.0ns G to Output Valid tOE — 2.3— 2.5— 3.0— 3.5ns G to output in Low-Z tOLZ 10—0—0—0—ns G to output in High-Z tOHZ 1— 2.3— 2.5— 3.0— 3.0ns ZZ setup time tZZS 25—5—5—5—ns ZZ hold time tZZH 21—1—1—1—ns ZZ recoverytZZR20—20—20—20—nsGS8640Z18/36T-300/250/200/167Notes:1.These parameters are sampled and are not 100% tested.2.ZZ is an asynchronous signal. However, in order to be recognized on any given clock cycle, ZZ must meet the specified setup and holdtimes as specified above.GS8640Z18/36T-300/250/200/167Pipeline Mode Timing (NBT)Write ARead BSuspend Read CWrite Dwriteno-opRead EDeselecttHZtKQXtKQtLZ tH tStHtStH tStH tStH tStH tStH tStH tStKCtKLtKHA B C D ED(A)D(D)Q(E)Q(B)Q(C)CKA CKEE*ADVWBnDQGS8640Z18/36T-300/250/200/167Flow Through Mode Timing (NBT)Write AWrite BWrite B+1Read CCont Read D Write E Read F Write GD(A)D(B)D(B+1)Q(C)Q(D)D(E)Q(F)D(G)tOLZ tOEtOHZtKQXtKQtLZtHZtKQX tKQ tLZtHtStHtStHtStHtStHtStHtStHtStKCtKLtKHABCDEFG*Note: E = High(False) if E1 = 1 or E2 = 0 or E3 = 1CKCKEEADVWBnA0–AnDQGGS8640Z18/36T-300/250/200/167TQFP Package Drawing (Package T) D1DE1EPin 1be cLL1A2A1YθNotes:1.All dimensions are in millimeters (mm).2.Package width and length do not include mold protrusion.SymbolDescriptionMin.Nom.MaxA1Standoff 0.050.100.15A2Body Thickness 1.35 1.40 1.45b Lead Width 0.200.300.40c Lead Thickness 0.09—0.20D Terminal Dimension 21.922.022.1D1Package Body 19.920.020.1E Terminal Dimension 15.916.016.1E1Package Body 13.914.014.1e Lead Pitch —0.65—L Foot Length 0.450.600.75L1Lead Length —1.00—Y Coplanarity 0.10θLead Angle0°—7°GS8640Z18/36T-300/250/200/167Ordering Information —GSI NBT Synchronous SRAM OrgPart Number1Type2PackageSpeed 3(M Hz/ns)T A 4Status4M x 18GS8640Z18T-300NBT Pipeline/Flow Through TQFP 300/5.5C 4M x 18GS8640Z18T-250NBT Pipeline/Flow Through TQFP 250/6.5C 4M x 18GS8640Z18T-200NBT Pipeline/Flow Through TQFP 200/7.5C 4M x 18GS8640Z18T-167NBT Pipeline/Flow Through TQFP 167/8C 2M x 36GS8640Z36T-300NBT Pipeline/Flow Through TQFP 300/5.5C 2M x 36GS8640Z36T-250NBT Pipeline/Flow Through TQFP 250/6.5C 2M x 36GS8640Z36T-200NBT Pipeline/Flow Through TQFP 200/7.5C 2M x 36GS8640Z36T-167NBT Pipeline/Flow Through TQFP 167/8C 4M x 18GS8640Z18T-300I NBT Pipeline/Flow Through TQFP 300/5.5I 4M x 18GS8640Z18T-250I NBT Pipeline/Flow Through TQFP 250/6.5I 4M x 18GS8640Z18T-200I NBT Pipeline/Flow Through TQFP 200/7.5I 4M x 18GS8640Z18T-167I NBT Pipeline/Flow Through TQFP 167/8I 2M x 36GS8640Z36T-300I NBT Pipeline/Flow Through TQFP 300/5.5I 2M x 36GS8640Z36T-250I NBT Pipeline/Flow Through TQFP 250/6.5I 2M x 36GS8640Z36T-200I NBT Pipeline/Flow Through TQFP 200/7.5I 2M x 36GS8640Z36T-167I NBT Pipeline/Flow Through TQFP167/8I 4M x 18GS8640Z18GT-300NBT Pipeline/Flow Through RoHS-compliant TQFP 300/5.5C 4M x 18GS8640Z18GT-250NBT Pipeline/Flow Through RoHS-compliant TQFP 250/6.5C 4M x 18GS8640Z18GT-200NBT Pipeline/Flow Through RoHS-compliant TQFP 200/7.5C 4M x 18GS8640Z18GT-167NBT Pipeline/Flow Through RoHS-compliant TQFP 167/8C 2M x 36GS8640Z36GT-300NBT Pipeline/Flow Through RoHS-compliant TQFP 300/5.5C 2M x 36GS8640Z36GT-250NBT Pipeline/Flow ThroughRoHS-compliant TQFP250/6.5CNotes:1.Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS8640Z36T-167IT.2.All GSI Technology packages are at least 5/6 RoHS compliant. Packages listed with the additional “G” designator are 6/6 RoHS compliant.3.The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Eachdevice is Pipeline/Flow Through mode-selectable by the user.4.T A = C = Commercial Temperature Range. T A = I = Industrial Temperature Range.5.GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which arecovered in this data sheet. See the GSI Technology web site () for a complete listing of current offerings。

G1084-XX中文资料

FeaturesAvailable in 1.5V, 1.8V, 2.5V, 3.3V version TO-252,TO-263 packageInternal short circuit current limiting Internal over temperature protectionOutput current 5AApplicationsPost regulation for switching DC/DC con-verterHigh efficiency linear regulator Battery powered instrumentationMotherboardGeneral DescriptionThe G1084-XX is a low dropout linear regulator with a dropout of 1.3V at 5A of load current. It is available in three fixed voltages: 1.5V, 1.8V, 2.5V and 3.3V. Refer to the G1084 for the adjustable version.The G1084-XX provides over temperature and over current protection circuits to prevent it from being damaged by abnormal operating conditions. The G1084-XX is available in TO-252 and TO-263 packages. A minimum of 220µF tantalum electro-lytic capacitor is required at the output to improve the transient response and stability.Ordering InformationPIN OPTIONORDER NUMBER ORDER NUMBER(Pb free)MARKINGTEMP. RANGEPACKAGE1 2 3G1084-15T43U G1084-15T43Uf G1084-15-40°C to +85°C TO-252 GND V OUT V IN G1084-18T43U G1084-18T43Uf G1084-18-40°C to +85°C TO-252 GND V OUT V IN G1084-25T43U G1084-25T43Uf G1084-25-40°C to +85°C TO-252 GND V OUT V IN G1084-33T43U G1084-33T43Uf G1084-33-40°C to +85°C TO-252 GND V OUT V IN G1084-15T53U G1084-15T53Uf G1084-15-40°C to +85°C TO-263 GND V OUT V IN G1084-18T53U G1084-18T53Uf G1084-18-40°C to +85°C TO-263 GND V OUT V IN G1084-25T53U G1084-25T53Uf G1084-25-40°C to +85°C TO-263 GND V OUT V ING1084-33T53U G1084-33T53Uf G1084-33-40°C to +85°CTO-263 GND V OUTV IN* For other package types and pin options, please contact us at sales @Order Number IdentificationTypePin Option Type Voltage Part NumberPACKAGE TYPEPIN OPTIONPACKINGT4: TO-252 12 3 U: Tape & Reel T5: TO-2633: GNDV OUTV INPackage Type Typical Application[Note 4]: Type of C OUT1V OUTµF23TO-252、TO-263Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8V Power Dissipation Internally Limited (Note 2) Maximum Junction Temperature . . . . . . . . . . . . . . .150°C Storage Temperature Range . . . . .-65°C ≤ T J≤+150°C Reflow Temperature (soldering, 10sec) . . . . . . 260°C Thermal Resistance Junction to AmbientTO-252(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95°C/W TO-263(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W Thermal Resistance Junction to CaseTO-252 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8°C/W TO-263 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..6°C/W ESD Rating (Human Body Model) . . . . . . . . . . . . .2kV Note (1): See Recommended Minimum Footprint Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . .2.2V~7V Temperature Range . . . . . . . . . . . . . -40°C ≤ T A≤85°CElectrical CharacteristicsV IN = 5V, C IN = C OUT = 220µF, T A = T J = 25°C unless otherwise specified. (Note3)PARAMETER CONDITIONMINTYPMAX UNITOutput Voltage 10mA < I OUT < 5A -2% V O 2% VLine Regulation (V OUT + 0.7V) < V IN < 5.5V, I OUT = 10mA --- 0.1 --- %G1084-18 V IN = 3.8V, 10mA < I OUT < 5AG1084-25 V IN = 5V, 10mA < I OUT < 5ALoad RegulationG1084-33 V IN = 5V, 10mA < I OUT < 5A--- 1 --- %G1084-18 ΔV OUT = 2%, I OUT = 5A --- 1.6 ---G1084-25 ΔV OUT = 2%, I OUT = 5A --- 1.3 ---Dropout VoltageG1084-33 ΔV OUT = 2%, I OUT = 5A --- 1.1 ---VCurrent Limit (V IN - V OUT) = 2V --- 5.5 --- AShort Circuit Current --- 1 --- AG1084-18 V IN = 5V --- 1.7 ---G1084-25 V IN = 5V --- 2.1 ---Quiescent CurrentG1084-33 V IN = 5V --- 2.4 ---mARipple Rejection f = 120Hz, C OUT = 10µF Tantalum,(V IN - V OUT) = 3V, I OUT = 1A--- 50 --- dBThermal Shutdown Junction Temperature --- 150 --- °C Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics.Note 2: The maximum power dissipation is a function of the maximum junction temperature, T Jmax ; total thermal resistance, θJA, and ambient temperature T A. The maximum allowable power dissipation at any ambient temperature is T jmax-T A / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown.Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.Note4: The type of output capacitor should be tantalum or aluminum.DefinitionsDropout VoltageThe input/output Voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 2% below its nominal value. Dropout voltage is affected by junction temperature, load cur-rent and minimum input supply requirements.Line RegulationThe change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly af-fected. Load RegulationThe change in output voltage for a change in load current at constant chip temperature. The measure-ment is made under conditions of low dissipation or by using pulse techniques such that average chip tem-perature is not significantly affected.Maximum Power DissipationThe maximum total device dissipation for which the regulator will operate within specifications.Quiescent Bias CurrentCurrent which is used to operate the regulator chip and is not delivered to the load.VIN -VOUT= 3V, CIN = 220µF, C OUT = 220µF, T A =25°C, unless otherwise noted.Line Transient ResponseLoad Transient ResponseShort Circuit CurrentRipple RejectionG1084-33 Overcurrent Protection CharacteristicsG1084 Start-upG1084-18 Overcurrent Protection CharacteristicsG1084-18 Start-upG1084 Max. Power Dissipation vs. PCB Top Copper AreaG1084 Max. Power Dissipation vs. T A MBG1084-18 Quiescent Current vs. TemperatureG1084-18 Dropout Voltage vs. IG1084-18 Output Voltage vs. TemperatureG1084-33 Quiescent Current vs. Temperature G1084-33 Dropout Voltage vs. IG1084-33 Output Voltage vs. Temperature G1084-33 Output Voltage vs. ILRecommend Minimum FootprintTO-252TO-263TO-252 (T4) PackageMILLIMETER INCHSYMBOLMIN. MAX. MIN. MAX.A 2.19 2.38 0.086 0.094 A1 0.89 1.27 0.035 0.050 b 0.64 0.89 0.025 0.035 C 0.46 0.58 0.018 0.023 D 5.97 6.22 0.235 0.245 E 6.35 6.73 0.2500.265 E1 5.21 5.46 0.205 0.215e 2.26BSC 0.09BSC e1 3.96 5.18 0.156 0.204 F 0.46 0.58 0.018 0.023 L1 0.89 2.03 0.035 0.080 L2 0.64 1.02 0.025 0.040 L3 2.40 2.80 0.095 0.110 H 9.40 10.40 0.370 0.410 θ 0° 4° 0° 4°TO-263 (T5) PackageMILLIMETER INCH SYMBOLMIN MAX MIN MAXA 4.30 4.70 0.169 0.185 A1 1.22 1.32 0.048 0.055 A2 2.45 2.69 0.104 0.106 b 0.69 0.94 0.027 0.037 b1 1.22 1.40 0.048 0.055 C 0.36 0.56 0.014 0.022 D 8.64 9.652 0.340 0.380 E 9.7010.54 0.382 0.415 e 2.29 2.79 0.090 0.110 e1 4.83 5.33 0.190 0.210 H 14.60 15.78 0.575 0.625 L 4.70 5.84 0.185 0.230 L1 1.20 1.778 0.047 0.070 L2 2.24 2.84 0.088 0.111 L3 1.40MAX 0.055MAXTaping SpecificationPACKAGE Q’TY/REELTO-252 2,500 ea TO-263 800 eaGMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.TO-252 Package OrientationTO-263 Package OrientationFeed DirectionFeed Direction。

L1084DG中文资料

元器件交易网
NIKO-SEM
5A Adjustable Low Dropout Linear Regulator (LDO)
FEATURES
L1084XG
TO-252, 263, 220 Lead-Free
GENERAL DESCRIPTION
The L1084G is a positive and low dropout three-terminal voltage regulator with 5A output current capability. This device is designed for use in low voltage applications that offers lower dropout voltage and faster transient response. This device is fully protected against over current faults, over temperature operation, reversed input polarity, reversed lead insertion, transient voltage spike …etc. On-Chips trimming the reference voltage to 1% and features the low dropout of maximum 1.45 volts. The L1084G Series regulators are available in the popular industry standard TO-220, TO-263 and TO-252 packages.
L1084XG
TO-252, 263, 220 Lead-Free

CX1084-3.3中文资料

Parameter
Device
Conditions
Line Regulation
Load Regulation (Notes 2, 3)
CX1084/-1.5/-2.5/-2.85/ -3.0/-3.3/-3.5/-5.0
ILOAD = 10 mA , 1.5V≤(VIN – Vout ) ≤12V
Conditions
Min Typ Max
Reference Voltage (Note 2)
Output Voltage (Note 2)
CX1084
CX1084-1.5 CX1084-2.5 CX1084-2.85 CX1084-3.0 CX1084-3.3 CX1084-3.5 CX1084-5.0
1.515 1.530 2.525 2.550 2.88 2.91 3.300 3.360 3.333 3.365 3.535 3.570 5.050 5.100
Units
V V
V V V V V V V V V V V V V V
元器件交易网
SPECIFICATION
the size of the copper area.
ELECTRICAL CHARACTERISTICS
Electrical Characteristics at IOUT = 0 mA, and TJ = +25°C unless otherwise specified.
Parameter
Device
ORDห้องสมุดไป่ตู้RING INFORMATION
3 LEAD TO-220 CX1084
CX1084-1.5 CX1084-2.5 CX1084-2.85 CX1084-3.0 CX1084-3.3 CX1084-3.5 CX1084-5.0

G1084-33T43U中文资料

FeaturesAvailable in 1.5V, 1.8V, 2.5V, 3.3V version TO-252,TO-263 packageInternal short circuit current limiting Internal over temperature protectionOutput current 5AApplicationsPost regulation for switching DC/DC con-verterHigh efficiency linear regulator Battery powered instrumentationMotherboardGeneral DescriptionThe G1084-XX is a low dropout linear regulator with a dropout of 1.3V at 5A of load current. It is available in three fixed voltages: 1.5V, 1.8V, 2.5V and 3.3V. Refer to the G1084 for the adjustable version.The G1084-XX provides over temperature and over current protection circuits to prevent it from being damaged by abnormal operating conditions. The G1084-XX is available in TO-252 and TO-263 packages. A minimum of 220µF tantalum electro-lytic capacitor is required at the output to improve the transient response and stability.Ordering InformationPIN OPTIONORDER NUMBER ORDER NUMBER(Pb free)MARKINGTEMP. RANGEPACKAGE1 2 3G1084-15T43U G1084-15T43Uf G1084-15-40°C to +85°C TO-252 GND V OUT V IN G1084-18T43U G1084-18T43Uf G1084-18-40°C to +85°C TO-252 GND V OUT V IN G1084-25T43U G1084-25T43Uf G1084-25-40°C to +85°C TO-252 GND V OUT V IN G1084-33T43U G1084-33T43Uf G1084-33-40°C to +85°C TO-252 GND V OUT V IN G1084-15T53U G1084-15T53Uf G1084-15-40°C to +85°C TO-263 GND V OUT V IN G1084-18T53U G1084-18T53Uf G1084-18-40°C to +85°C TO-263 GND V OUT V IN G1084-25T53U G1084-25T53Uf G1084-25-40°C to +85°C TO-263 GND V OUT V ING1084-33T53U G1084-33T53Uf G1084-33-40°C to +85°CTO-263 GND V OUTV IN* For other package types and pin options, please contact us at sales @Order Number IdentificationTypePin Option Type Voltage Part NumberPACKAGE TYPEPIN OPTIONPACKINGT4: TO-252 12 3 U: Tape & Reel T5: TO-2633: GNDV OUTV INPackage Type Typical Application[Note 4]: Type of C OUT1V OUTµF23TO-252、TO-263Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8V Power Dissipation Internally Limited (Note 2) Maximum Junction Temperature . . . . . . . . . . . . . . .150°C Storage Temperature Range . . . . .-65°C ≤ T J≤+150°C Reflow Temperature (soldering, 10sec) . . . . . . 260°C Thermal Resistance Junction to AmbientTO-252(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95°C/W TO-263(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W Thermal Resistance Junction to CaseTO-252 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8°C/W TO-263 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..6°C/W ESD Rating (Human Body Model) . . . . . . . . . . . . .2kV Note (1): See Recommended Minimum Footprint Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . .2.2V~7V Temperature Range . . . . . . . . . . . . . -40°C ≤ T A≤85°CElectrical CharacteristicsV IN = 5V, C IN = C OUT = 220µF, T A = T J = 25°C unless otherwise specified. (Note3)PARAMETER CONDITIONMINTYPMAX UNITOutput Voltage 10mA < I OUT < 5A -2% V O 2% VLine Regulation (V OUT + 0.7V) < V IN < 5.5V, I OUT = 10mA --- 0.1 --- %G1084-18 V IN = 3.8V, 10mA < I OUT < 5AG1084-25 V IN = 5V, 10mA < I OUT < 5ALoad RegulationG1084-33 V IN = 5V, 10mA < I OUT < 5A--- 1 --- %G1084-18 ΔV OUT = 2%, I OUT = 5A --- 1.6 ---G1084-25 ΔV OUT = 2%, I OUT = 5A --- 1.3 ---Dropout VoltageG1084-33 ΔV OUT = 2%, I OUT = 5A --- 1.1 ---VCurrent Limit (V IN - V OUT) = 2V --- 5.5 --- AShort Circuit Current --- 1 --- AG1084-18 V IN = 5V --- 1.7 ---G1084-25 V IN = 5V --- 2.1 ---Quiescent CurrentG1084-33 V IN = 5V --- 2.4 ---mARipple Rejection f = 120Hz, C OUT = 10µF Tantalum,(V IN - V OUT) = 3V, I OUT = 1A--- 50 --- dBThermal Shutdown Junction Temperature --- 150 --- °C Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics.Note 2: The maximum power dissipation is a function of the maximum junction temperature, T Jmax ; total thermal resistance, θJA, and ambient temperature T A. The maximum allowable power dissipation at any ambient temperature is T jmax-T A / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown.Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.Note4: The type of output capacitor should be tantalum or aluminum.DefinitionsDropout VoltageThe input/output Voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 2% below its nominal value. Dropout voltage is affected by junction temperature, load cur-rent and minimum input supply requirements.Line RegulationThe change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly af-fected. Load RegulationThe change in output voltage for a change in load current at constant chip temperature. The measure-ment is made under conditions of low dissipation or by using pulse techniques such that average chip tem-perature is not significantly affected.Maximum Power DissipationThe maximum total device dissipation for which the regulator will operate within specifications.Quiescent Bias CurrentCurrent which is used to operate the regulator chip and is not delivered to the load.VIN -VOUT= 3V, CIN = 220µF, C OUT = 220µF, T A =25°C, unless otherwise noted.Line Transient ResponseLoad Transient ResponseShort Circuit CurrentRipple RejectionG1084-33 Overcurrent Protection CharacteristicsG1084 Start-upG1084-18 Overcurrent Protection CharacteristicsG1084-18 Start-upG1084 Max. Power Dissipation vs. PCB Top Copper AreaG1084 Max. Power Dissipation vs. T A MBG1084-18 Quiescent Current vs. TemperatureG1084-18 Dropout Voltage vs. IG1084-18 Output Voltage vs. TemperatureG1084-33 Quiescent Current vs. Temperature G1084-33 Dropout Voltage vs. IG1084-33 Output Voltage vs. Temperature G1084-33 Output Voltage vs. ILRecommend Minimum FootprintTO-252TO-263TO-252 (T4) PackageMILLIMETER INCHSYMBOLMIN. MAX. MIN. MAX.A 2.19 2.38 0.086 0.094 A1 0.89 1.27 0.035 0.050 b 0.64 0.89 0.025 0.035 C 0.46 0.58 0.018 0.023 D 5.97 6.22 0.235 0.245 E 6.35 6.73 0.2500.265 E1 5.21 5.46 0.205 0.215e 2.26BSC 0.09BSC e1 3.96 5.18 0.156 0.204 F 0.46 0.58 0.018 0.023 L1 0.89 2.03 0.035 0.080 L2 0.64 1.02 0.025 0.040 L3 2.40 2.80 0.095 0.110 H 9.40 10.40 0.370 0.410 θ 0° 4° 0° 4°TO-263 (T5) PackageMILLIMETER INCH SYMBOLMIN MAX MIN MAXA 4.30 4.70 0.169 0.185 A1 1.22 1.32 0.048 0.055 A2 2.45 2.69 0.104 0.106 b 0.69 0.94 0.027 0.037 b1 1.22 1.40 0.048 0.055 C 0.36 0.56 0.014 0.022 D 8.64 9.652 0.340 0.380 E 9.7010.54 0.382 0.415 e 2.29 2.79 0.090 0.110 e1 4.83 5.33 0.190 0.210 H 14.60 15.78 0.575 0.625 L 4.70 5.84 0.185 0.230 L1 1.20 1.778 0.047 0.070 L2 2.24 2.84 0.088 0.111 L3 1.40MAX 0.055MAXTaping SpecificationPACKAGE Q’TY/REELTO-252 2,500 ea TO-263 800 eaGMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.TO-252 Package OrientationTO-263 Package OrientationFeed DirectionFeed Direction。

AMS1084中文资料

5A LDO稳压器电路
AMS1084
概述
AMS1084 是一款正电压输出的低压降三端线性稳压电路，在 5A 输出电流下压降为 1.5V。
AMS1084 分为两个版本：固定电压输出版本和可调电压输出版本，固定输出电压为1.5V，1.8V，2.5V，3.3V 和 5.0V , 电压精度为 1%。
AMS1084内部有过热保护和限流电路，适用于各类电子产品。
1.764 1.8 1.836
VOUT
AMS1084-2.5, IOUT=10mA, VIN=5.5V 10mA≤IOUT≤5A, 4.0V≤VIN ≤7V
2.475 2.5 2.525 2.45 2.5 2.55
AMS1084-3.3, IOUT=10mA, VIN=6.3V, 10mA≤IOUT≤5A, 4.8V≤VIN≤8V
为了确保AMS1084的稳定性，需要一个至少22μF的输出电容。电容值可以根据实际应用的需要随输出负载和温度变化而改变。通常，线性调整器的稳定性随着输出电流增加而减少。
6
Advanced Monolithic Systems 中文翻译：贝纳公司技术支援部０７５５－－８２８００２８９
3
Advanced Monolithic Systems 中文翻译：贝纳公司技术支援部０７５５－－８２８００２８９
AMS1084
推荐工作条件
参数输入电压工作结温范围
符号 VIN TJ
范围 12
0 ~ +125
单位 V °C
电气特性(除非特别指定，否则 Tamb=25°C，正常工作结温范围 0°C to 125°C )
4.95 5 5.05
4.9 5 5.1
0.015 0.2

G1084-33TU3UF中文资料

FeaturesAvailable in 1.5V, 1.8V, 2.5V, 3.3V version TO-252,TO-263 and TO-263T package Internal short circuit current limiting Internal over temperature protectionOutput current 5AApplicationsPost regulation for switching DC/DC con-verterHigh efficiency linear regulator Battery powered instrumentationMotherboardGeneral DescriptionThe G1084-XX is a low dropout linear regulator with a dropout of 1.3V at 5A of load current. It is available in three fixed voltages: 1.5V, 1.8V, 2.5V and 3.3V. Refer to the G1084 for the adjustable version.The G1084-XX provides over temperature and over current protection circuits to prevent it from being damaged by abnormal operating conditions. The G1084-XX is available in TO-252, TO-263 and TO-263T packages. A minimum of 220µF tanta-lum electrolytic capacitor is required at the output to improve the transient response and stability.Ordering InformationPIN OPTIONORDER NUMBER ORDER NUMBER(Pb free)MARKINGTEMP. RANGEPACKAGE1 2 3G1084-15T43U G1084-15T43Uf G1084-15-40°C to +85°C TO-252 GND V OUT V IN G1084-18T43U G1084-18T43Uf G1084-18-40°C to +85°C TO-252 GND V OUT V IN G1084-25T43U G1084-25T43UfG1084-25-40°C to +85°C TO-252 GND V OUT V ING1084-33T43U G1084-33T43Uf G1084-33-40°C to +85°C TO-252 GND V OUT V IN G1084-15T53U G1084-15T53Uf G1084-15-40°C to +85°C TO-263 GND V OUT V IN G1084-18T53U G1084-18T53Uf G1084-18-40°C to +85°C TO-263 GND V OUT V IN G1084-25T53U G1084-25T53Uf G1084-25-40°C to +85°C TO-263 GND V OUT V IN G1084-33T53U G1084-33T53Uf G1084-33-40°C to +85°C TO-263 GND V OUT V IN G1084-15TU3U G1084-15TU3Uf G1084-15-40°C to +85°C TO-263T GND V OUT V IN G1084-18TU3U G1084-18TU3Uf G1084-18-40°C to +85°C TO-263T GND V OUT V IN G1084-25TU3U G1084-25TU3Uf G1084-25-40°C to +85°CTO-263T GND V OUTV IN G1084-33TU3U G1084-33TU3Uf G1084-33-40°C to +85°C TO-263T GND V OUTV IN* For other package types and pin options, please contact us at sales@ Note: T4: TO-252 T5: TO-263 TU: TO-263T (thin)3: Bonding Code U: Tape & ReelPackage Type Typical Application[Note 4]: Type of C OUT2V V OUTµF13TO-252/TO-263/TO-263TInput Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8V Power Dissipation Internally Limited (Note 2)Maximum Junction Temperature . . . . . . . . . . . . . . .150°C Storage Temperature Range . . . . .-65°C ≤ T J≤+150°C Reflow Temperature (soldering, 10sec) . . . . . . 260°C Thermal Resistance Junction to AmbientTO-252(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95°C/W TO-263(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W TO-263T(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . .82°C/W Thermal Resistance Junction to CaseTO-252 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8°C/W TO-263 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..6°C/W TO-263T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6°C/W ESD Rating (Human Body Model) . . . . . . . . . . . . .2kV Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . .2.2V~7V Temperature Range . . . . . . . . . . . . . -40°C ≤ T A≤85°CNote (1): See Recommended Minimum FootprintElectrical CharacteristicsV IN = 5V, C IN = C OUT = 220µF, T A = T J = 25°C unless otherwise specified. (Note3)PARAMETER CONDITIONMINTYPMAX UNITOutput Voltage 10mA < I OUT < 5A -2% V O 2% VLine Regulation (V OUT + 0.7V) < V IN < 5.5V, I OUT = 10mA --- 0.1 --- %G1084-18 V IN = 3.8V, 10mA < I OUT < 5AG1084-25 V IN = 5V, 10mA < I OUT < 5ALoad RegulationG1084-33 V IN = 5V, 10mA < I OUT < 5A--- 1 --- %G1084-18 ΔV OUT = 2%, I OUT = 5A --- 1.6 ---G1084-25 ΔV OUT = 2%, I OUT = 5A --- 1.3 ---Dropout VoltageG1084-33 ΔV OUT = 2%, I OUT = 5A --- 1.1 ---VCurrent Limit (V IN - V OUT) = 2V --- 5.5 --- AShort Circuit Current --- 1 --- AG1084-18 V IN = 5V --- 1.7 ---G1084-25 V IN = 5V --- 2.1 ---Quiescent CurrentG1084-33 V IN = 5V --- 2.4 ---mARipple Rejection f = 120Hz, C OUT = 10µF Tantalum,(V IN - V OUT) = 3V, I OUT = 1A--- 50 --- dBThermal Shutdown Junction Temperature --- 150 --- °C Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics.Note 2: The maximum power dissipation is a function of the maximum junction temperature, T Jmax ; total thermal resistance, θJA, and ambient temperature T A. The maximum allowable power dissipation at any ambient temperature is T jmax-T A / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown.Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.Note4: The type of output capacitor should be tantalum or aluminum.DefinitionsDropout VoltageThe input/output Voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 2% below its nominal value. Dropout voltage is affected by junction temperature, load cur-rent and minimum input supply requirements.Line RegulationThe change in output voltage for a change in input volt-age. The measurement is made under conditions of low dissipation or by using pulse techniques such that av-erage chip temperature is not significantly affected. Load RegulationThe change in output voltage for a change in load current at constant chip temperature. The measure-ment is made under conditions of low dissipation or by using pulse techniques such that average chip tem-perature is not significantly affected.Maximum Power DissipationThe maximum total device dissipation for which the regulator will operate within specifications.Quiescent Bias CurrentCurrent which is used to operate the regulator chip and is not delivered to the load.VIN -VOUT= 3V, CIN = 220µF, C OUT = 220µF, T A =25°C, unless otherwise noted.Line Transient ResponseLoad Transient ResponseShort Circuit CurrentRipple RejectionG1084-33 Overcurrent Protection CharacteristicsG1084 Start-upG1084-18 Overcurrent Protection CharacteristicsG1084-18 Start-upG1084 Max. Power Dissipation vs. PCB Top Copper AreaG1084 Max. Power Dissipation vs. T A MBG1084-18 Quiescent Current vs. TemperatureG1084-18 Dropout Voltage vs. IG1084-18 Output Voltage vs. TemperatureG1084-33 Quiescent Current vs. Temperature G1084-33 Dropout Voltage vs. IG1084-33 Output Voltage vs. Temperature G1084-33 Output Voltage vs. ILRecommend Minimum FootprintTO-252TO-263TO-263TTO-252 (T4) PackageMILLIMETERS INCHES SYMBOLMIN. MAX. MIN. MAX.A 2.190 2.400 0.086 0.094 A1 0.000 0.127 0.000 0.005B 0.880 1.650 0.035 0.065 b 0.500 0.880 0.020 0.035 b1 0.700 0.900 0.028 0.035C 0.430 0.580 0.017 0.023 C1 0.430 0.580 0.017 0.023D 6.350 6.730 0.250 0.265 D1 5.200 5.460 0.205 0.215E 5.400 6.220 0.213 0.245 e 2.300 TYP 0.091 TYPe1 4.500 4.700 0.177 0.185 L 8.830 10.77 0.348 0.424 L1 2.550 2.900 0.100 0.114 L2 1.400 1.780 0.055 0.070 L30.350 1.020 0.014 0.040V 3.800 4.320 0.150 0.170DD1Bb1be e1L3LVCL1EAC1A1L2TO-263 (T5) PackageMILLIMETER INCH SYMBOLMIN MAX MIN MAXA 4.470 4.670 0.176 0.184 A1 0.000 0.150 0.000 0.006B 1.170 1.370 0.046 0.054 b 0.710 0.910 0.028 0.036 b1 1.170 1.370 0.046 0.054 c 0.310 0.530 0.012 0.021 c1 1.170 1.370 0.046 0.054 D 10.010 10.310 0.394 0.406 E 8.500 8.900 0.335 0.350 e 2.540 TYP 0.100 TYP e1 4.980 5.180 0.196 0.204 L 15.050 15.450 0.593 0.608 L1 5.080 5.480 0.200 0.216 L2 2.340 2.740 0.092 0.108 L3 1.300 1.700 0.051 0.067 V 5.600 REF 0.220 REFDLbe e1b1L3BEL1Ac1A1L2cVTO-263T (TU) PackageDIMENSIONS IN MILLIMETERDIMENSIONS IN INCH SYMBOLMIN NOM MAX MIN NOM MAXA 1.750 2.000 2.250 0.069 0.079 0.089B 0.880 1.280 1.680 0.345 0.050 0.066 b 1.255 1.295 1.335 0.049 0.051 0.053 c 0.381 0.406 0.431 0.015 0.016 0.017 c1 0.356 0.406 0.456 0.014 0.016 0.018 D 9.660 10.160 10.660 0.380 0.400 0.420 D1 6.900 REF 0.272 REFE 8.380 8.680 8.980 0.330 0.342 0.354 e ----- 2.540 ----- ----- 0.100 ----- e1 ----- 5.080 ----- ----- 0.200 ----- L 13.74 14.240 14.740 0.541 0.561 0.580 L1 ----- 4.280 ----- ----- 0.169 ----- L2 2.290 2.540 2.790 0.090 0.100 0.110 L3 ----- ----- 1.778 ----- ----- 0.070 V ----- 7.280 ----- ----- 0.287 -----Taping SpecificationPACKAGE Q ’TY/REELTO-252 2,500 ea TO-263 800 ea TO-263T 1,500 eaGMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.TO-252 Package Orientation TO-263/TO-263T Package OrientationFeed DirectionFeed Direction。

调心滚子轴承型号及规格

调心滚子轴承请点击图片
发布时间：2010-7-13 8:09:47 阅读：1117 推荐否
调心滚子轴承型号
外型尺寸mm d×D×B
保持架
材质
重量
新型号
老型号
KG
22206C
3506
306220
黄铜
22206K
113506
22206C/W33
113506
22206CK/W33
153506Y
22208
黄铜
22244K
113544
22244/W33
3544K
22244K/W33
113544
22309
3609
4510036
黄铜
22309K
113609
22311
3611
5512043
黄铜
22311K
113611
22313
3613
6514048
黄铜
22313K
113613
22315
3615
7516055
22324CAK/W33
153624K
22328CA
53628
140300102
黄铜
22328CAK
153628
22328CA/W33
53628K
22382CAK/W33
153628K
22332CA
53632
160340114
黄铜
22332CAK
153632
22332CA/W33
53632K
22332CAK/W33
黄铜
22220CAK
153520
22220CA/W33
53520K

调心滚子轴承规格表

调心滚子轴承规格表调心滚子轴承是一种用于承受径向和轴向负荷的重要机械元件。

它具有较高的承载能力和较好的自调心性能，广泛应用于机械设备中。

本文将介绍调心滚子轴承的常见规格表，帮助读者了解和选择适合自己需求的调心滚子轴承。

1. 规格表说明调心滚子轴承的规格表是一个包含各种参数的表格，它描述了调心滚子轴承的尺寸、负荷能力、转速限制等重要信息。

通过规格表，用户可以找到满足自己需求的轴承型号，并了解其基本性能参数。

下面是一个调心滚子轴承规格表的示例：型号内径（mm）外径（mm）宽度（mm）基本负荷额定值（kN）极限转速（rpm）22208E 40 80 23 96.5 800022308E 40 90 33 129 670022209E 45 85 23 104 700022309E 45 100 36 152 60002. 规格表参数解释2.1 型号型号是标识不同调心滚子轴承的编码，通常包含一串字母和数字。

不同的型号代表不同的尺寸和性能参数。

2.2 内径、外径和宽度内径、外径和宽度是调心滚子轴承的基本尺寸参数。

内径指的是轴承内圈的直径，外径指的是轴承外圈的直径，宽度指的是轴承在轴向方向的厚度。

这些尺寸决定了轴承的安装尺寸及适用范围。

2.3 基本负荷额定值基本负荷额定值是指在标准使用条件下，调心滚子轴承能够承受的额定负荷。

它是轴承设计和选择的重要参数，用户需要根据实际负荷情况选择合适的轴承型号。

2.4 极限转速极限转速是指在该速度下，调心滚子轴承工作可靠且寿命不受损害。

超过极限转速可能导致轴承过早失效，因此在选择轴承时需要注意其极限转速参数。

3. 如何选择适合的调心滚子轴承选择适合的调心滚子轴承需要考虑以下几个因素：3.1 载荷类型和大小根据实际工作环境和负荷情况，确定所需的径向和轴向负荷。

在规格表中查找基本负荷额定值，选择能够满足负荷要求的型号。

3.2 工作转速根据设备要求和工作条件，确定所需的工作转速范围。

G1084-33T53U中文资料

FeaturesAvailable in 1.5V, 1.8V, 2.5V, 3.3V version TO-252,TO-263 packageInternal short circuit current limiting Internal over temperature protectionOutput current 5AApplicationsPost regulation for switching DC/DC con-verterHigh efficiency linear regulator Battery powered instrumentationMotherboardGeneral DescriptionThe G1084-XX is a low dropout linear regulator with a dropout of 1.3V at 5A of load current. It is available in three fixed voltages: 1.5V, 1.8V, 2.5V and 3.3V. Refer to the G1084 for the adjustable version.The G1084-XX provides over temperature and over current protection circuits to prevent it from being damaged by abnormal operating conditions. The G1084-XX is available in TO-252 and TO-263 packages. A minimum of 220µF tantalum electro-lytic capacitor is required at the output to improve the transient response and stability.Ordering InformationPIN OPTIONORDER NUMBER ORDER NUMBER(Pb free)MARKINGTEMP. RANGEPACKAGE1 2 3G1084-15T43U G1084-15T43Uf G1084-15-40°C to +85°C TO-252 GND V OUT V IN G1084-18T43U G1084-18T43Uf G1084-18-40°C to +85°C TO-252 GND V OUT V IN G1084-25T43U G1084-25T43Uf G1084-25-40°C to +85°C TO-252 GND V OUT V IN G1084-33T43U G1084-33T43Uf G1084-33-40°C to +85°C TO-252 GND V OUT V IN G1084-15T53U G1084-15T53Uf G1084-15-40°C to +85°C TO-263 GND V OUT V IN G1084-18T53U G1084-18T53Uf G1084-18-40°C to +85°C TO-263 GND V OUT V IN G1084-25T53U G1084-25T53Uf G1084-25-40°C to +85°C TO-263 GND V OUT V ING1084-33T53U G1084-33T53Uf G1084-33-40°C to +85°CTO-263 GND V OUTV IN* For other package types and pin options, please contact us at sales @Order Number IdentificationTypePin Option Type Voltage Part NumberPACKAGE TYPEPIN OPTIONPACKINGT4: TO-252 12 3 U: Tape & Reel T5: TO-2633: GNDV OUTV INPackage Type Typical Application[Note 4]: Type of C OUT1V OUTµF23TO-252、TO-263Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8V Power Dissipation Internally Limited (Note 2) Maximum Junction Temperature . . . . . . . . . . . . . . .150°C Storage Temperature Range . . . . .-65°C ≤ T J≤+150°C Reflow Temperature (soldering, 10sec) . . . . . . 260°C Thermal Resistance Junction to AmbientTO-252(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95°C/W TO-263(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W Thermal Resistance Junction to CaseTO-252 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8°C/W TO-263 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..6°C/W ESD Rating (Human Body Model) . . . . . . . . . . . . .2kV Note (1): See Recommended Minimum Footprint Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . .2.2V~7V Temperature Range . . . . . . . . . . . . . -40°C ≤ T A≤85°CElectrical CharacteristicsV IN = 5V, C IN = C OUT = 220µF, T A = T J = 25°C unless otherwise specified. (Note3)PARAMETER CONDITIONMINTYPMAX UNITOutput Voltage 10mA < I OUT < 5A -2% V O 2% VLine Regulation (V OUT + 0.7V) < V IN < 5.5V, I OUT = 10mA --- 0.1 --- %G1084-18 V IN = 3.8V, 10mA < I OUT < 5AG1084-25 V IN = 5V, 10mA < I OUT < 5ALoad RegulationG1084-33 V IN = 5V, 10mA < I OUT < 5A--- 1 --- %G1084-18 ΔV OUT = 2%, I OUT = 5A --- 1.6 ---G1084-25 ΔV OUT = 2%, I OUT = 5A --- 1.3 ---Dropout VoltageG1084-33 ΔV OUT = 2%, I OUT = 5A --- 1.1 ---VCurrent Limit (V IN - V OUT) = 2V --- 5.5 --- AShort Circuit Current --- 1 --- AG1084-18 V IN = 5V --- 1.7 ---G1084-25 V IN = 5V --- 2.1 ---Quiescent CurrentG1084-33 V IN = 5V --- 2.4 ---mARipple Rejection f = 120Hz, C OUT = 10µF Tantalum,(V IN - V OUT) = 3V, I OUT = 1A--- 50 --- dBThermal Shutdown Junction Temperature --- 150 --- °C Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics.Note 2: The maximum power dissipation is a function of the maximum junction temperature, T Jmax ; total thermal resistance, θJA, and ambient temperature T A. The maximum allowable power dissipation at any ambient temperature is T jmax-T A / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown.Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.Note4: The type of output capacitor should be tantalum or aluminum.DefinitionsDropout VoltageThe input/output Voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 2% below its nominal value. Dropout voltage is affected by junction temperature, load cur-rent and minimum input supply requirements.Line RegulationThe change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly af-fected. Load RegulationThe change in output voltage for a change in load current at constant chip temperature. The measure-ment is made under conditions of low dissipation or by using pulse techniques such that average chip tem-perature is not significantly affected.Maximum Power DissipationThe maximum total device dissipation for which the regulator will operate within specifications.Quiescent Bias CurrentCurrent which is used to operate the regulator chip and is not delivered to the load.VIN -VOUT= 3V, CIN = 220µF, C OUT = 220µF, T A =25°C, unless otherwise noted.Line Transient ResponseLoad Transient ResponseShort Circuit CurrentRipple RejectionG1084-33 Overcurrent Protection CharacteristicsG1084 Start-upG1084-18 Overcurrent Protection CharacteristicsG1084-18 Start-upG1084 Max. Power Dissipation vs. PCB Top Copper AreaG1084 Max. Power Dissipation vs. T A MBG1084-18 Quiescent Current vs. TemperatureG1084-18 Dropout Voltage vs. IG1084-18 Output Voltage vs. TemperatureG1084-33 Quiescent Current vs. Temperature G1084-33 Dropout Voltage vs. IG1084-33 Output Voltage vs. Temperature G1084-33 Output Voltage vs. ILRecommend Minimum FootprintTO-252TO-263TO-252 (T4) PackageMILLIMETER INCHSYMBOLMIN. MAX. MIN. MAX.A 2.19 2.38 0.086 0.094 A1 0.89 1.27 0.035 0.050 b 0.64 0.89 0.025 0.035 C 0.46 0.58 0.018 0.023 D 5.97 6.22 0.235 0.245 E 6.35 6.73 0.2500.265 E1 5.21 5.46 0.205 0.215e 2.26BSC 0.09BSC e1 3.96 5.18 0.156 0.204 F 0.46 0.58 0.018 0.023 L1 0.89 2.03 0.035 0.080 L2 0.64 1.02 0.025 0.040 L3 2.40 2.80 0.095 0.110 H 9.40 10.40 0.370 0.410 θ 0° 4° 0° 4°TO-263 (T5) PackageMILLIMETER INCH SYMBOLMIN MAX MIN MAXA 4.30 4.70 0.169 0.185 A1 1.22 1.32 0.048 0.055 A2 2.45 2.69 0.104 0.106 b 0.69 0.94 0.027 0.037 b1 1.22 1.40 0.048 0.055 C 0.36 0.56 0.014 0.022 D 8.64 9.652 0.340 0.380 E 9.7010.54 0.382 0.415 e 2.29 2.79 0.090 0.110 e1 4.83 5.33 0.190 0.210 H 14.60 15.78 0.575 0.625 L 4.70 5.84 0.185 0.230 L1 1.20 1.778 0.047 0.070 L2 2.24 2.84 0.088 0.111 L3 1.40MAX 0.055MAXTaping SpecificationPACKAGE Q’TY/REELTO-252 2,500 ea TO-263 800 eaGMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.TO-252 Package OrientationTO-263 Package OrientationFeed DirectionFeed Direction。

徐州罗特艾德回转支承样本

轴向载荷引起的力矩
A 最大工作载荷
回转支承选型技术参数表
地址：部门：传真：
转动轴：水平 □
垂直 □
支承安装方式：座式安装 □ 悬挂安装□
应用性质：仅定位用 □ 间歇转动 □ 连续转动 □
每分钟转数：正常：最大：
载
荷
数
据
B
最大试验载荷例：25%超载试验
C
灾难性载荷 (关机状态)
kN
kN
9
5 回转支承选型计算
塔式起重机上回转*
表 1 静态安全系机(货物负载) 船用甲板起重机(抓斗) 焊接设备工作台(连续运转)
Mf≤0.5M
0.5M≤Mf≤0.8M
Mf≥0.8M
下回转
回转式起重机(货物负载) 造船厂起重机旋转空中吊运车船用卸载机
fs
Email：technology@
签名：
日期：
注： * 附录 B 为回转支承及与其相啮合的小齿轮参数。 ** 附录 A 为回转支承所承受的各种载荷及其所占的作业时间百分比和在每种载荷作用下回转支承的转速或转数的数据表。
7
5 回转支承选型计算
5.3 回转支承承载能力曲线
产品样本中每一型号回转支承都对应一个承载能力曲线图，曲线图可帮助用户初步地选择回转支承。
目录
1 企业简介
2
2 回转支承结构型式
3
3 回转支承热处理
4
4 回转支承的编号方法
5
5 回转支承选型计算
6
6 回转支承的安装及维护保养
14
7 单排四点接触球式回转支承结构参数及承载曲线
单排四点接触球式回转支承结构参数
18
单排四点接触球式回转支承承载曲线

萨奥丹佛斯柱塞泵手册

AA
© 2007 Sauer-Danfoss. All rights reserved. Printed in U.S.A. Sauer-Danfoss accepts no responsibility for possible errors in catalogs, brochures and other printed material. Sauer-Danfoss reserves the right to alter its products without prior notice. This also applies to products already ordered provided that such alterations aren’t in conflict with agreed specifications. All trademarks in this material are properties of their respective owners. Sauer-Danfoss and the Sauer-Danfoss logotype are trademarks of the Sauer-Danfoss Group.
萨奥丹佛斯柱塞泵手册萨奥柱塞泵萨奥丹佛斯官网萨奥丹佛斯上海萨奥丹佛斯萨奥丹佛斯液压泵萨奥丹佛斯中国丹佛斯柱塞泵济宁萨奥机械有限公司萨奥液压泵
42系列轴向柱塞闭式泵服务手册
42系列轴向柱塞闭式泵服务手册版本
版本信息修改信息表
日期页码修改项 Rev.
2008年7月
-
ቤተ መጻሕፍቲ ባይዱ
第一版，基于英文版520L0638，Rev BA
功能描述
概述及剖视图...................................................................................................................................................................10 系统回路图........................................................................................................................................................................11 泵特征..................................................................................................................................................................................11 基本闭式回路.............................................................................................................................................................11 壳体回油及散热器. ..................................................................................................................................................11 补油泵. ..........................................................................................................................................................................11 补油溢流阀..................................................................................................................................................................12 回路冲洗阀..................................................................................................................................................................12 过滤方式选项...................................................................................................................................................................13 排量限制器........................................................................................................................................................................14 单向补油/高压溢流阀..................................................................................................................................................14 旁通阀..................................................................................................................................................................................14 辅助安装法兰盘. .............................................................................................................................................................15

SA1084中文资料

封装形式 TO-252-2L
TO-263-3L TO-220-3L TO-263-2L
打印名称
SA1084D-ADJ SA1084D-ADJ SA1084D-1.5 SA1084D-1.5 SA1084D-1.8 SA1084D-1.8 SA1084D-2.5 SA1084D-2.5 SA1084D-3.3 SA1084D-3.3 SA1084D-5.0 SA1084D-5.0 SA1084S-ADJ SA1084S-ADJ SA1084S-1.5 SA1084S-1.5 SA1084S-1.8 SA1084S-1.8 SA1084S-2.5 SA1084S-2.5 SA1084S-3.3 SA1084S-3.3 SA1084S-5.0 SA1084S-5.0 SA1084T-ADJ SA1084T-1.5 SA1084T-1.8 SA1084T-2.5 SA1084T-3.3 SA1084T-5.0 SA1084S2-ADJ SA1084S2-ADJ SA1084S2-1.5 SA1084S2-1.5 SA1084S2-1.8 SA1084S2-1.8 SA1084S2-2.5
杭州士兰微电子股份有限公司

版本号：1.0 2009.09.08 共11页第3页
SA1084
推荐工作条件
参数输入电压工作结温范围
符号 VIN TJ
范围 12
0 ~ +125
单位 V °C
电气特性(除非特别指定，否则 Tamb=25°C，正常工作结温范围 0°C to 125°C )
参数基准电压输出电压
线性调整
符号
测试条件
最小值典型值最大值
VREF VOUT ΔVOUT
SA1084-ADJ,

gc1084规格参数

gc1084规格参数
摘要：
1.引言
2.gc1084产品概述
3.gc1084规格参数
4.结论
正文：
【引言】
本文将详细介绍gc1084产品的相关规格参数。

【gc1084产品概述】
gc1084是一款集成了高性能处理器和多种接口的设备，广泛应用于工业自动化、智能交通、医疗设备等领域。

该产品具有强大的数据处理能力、稳定可靠的特点，能满足各种复杂环境下的应用需求。

【gc1084规格参数】
1.处理器：采用高性能ARM处理器，运行速度快，性能稳定。

2.存储器：内置256KB闪存和64KB RAM，可满足大部分应用场景的需求。

3.接口：提供丰富的外部接口，包括2个串口（UART）、1个CAN接口、1个SPI接口、1个I2C接口和多个GPIO接口，便于与其他设备进行数据通信和控制。

4.电源：支持宽电压输入（3.3V~5V），适用于不同场景的供电需求。

5.工作温度：工业级温度范围，-40℃~+85℃，能在恶劣环境中稳定工作。

6.尺寸：紧凑的尺寸设计，便于集成到各种设备中。

【结论】
综上所述，gc1084产品凭借其强大的性能、丰富的接口和稳定的工作特性，在众多领域得到了广泛应用。

G1084-18TU3UF中文资料

FeaturesAvailable in 1.5V, 1.8V, 2.5V, 3.3V version TO-252,TO-263 and TO-263T package Internal short circuit current limiting Internal over temperature protectionOutput current 5AApplicationsPost regulation for switching DC/DC con-verterHigh efficiency linear regulator Battery powered instrumentationMotherboardGeneral DescriptionThe G1084-XX is a low dropout linear regulator with a dropout of 1.3V at 5A of load current. It is available in three fixed voltages: 1.5V, 1.8V, 2.5V and 3.3V. Refer to the G1084 for the adjustable version.The G1084-XX provides over temperature and over current protection circuits to prevent it from being damaged by abnormal operating conditions. The G1084-XX is available in TO-252, TO-263 and TO-263T packages. A minimum of 220µF tanta-lum electrolytic capacitor is required at the output to improve the transient response and stability.Ordering InformationPIN OPTIONORDER NUMBER ORDER NUMBER(Pb free)MARKINGTEMP. RANGEPACKAGE1 2 3G1084-15T43U G1084-15T43Uf G1084-15-40°C to +85°C TO-252 GND V OUT V IN G1084-18T43U G1084-18T43Uf G1084-18-40°C to +85°C TO-252 GND V OUT V IN G1084-25T43U G1084-25T43UfG1084-25-40°C to +85°C TO-252 GND V OUT V ING1084-33T43U G1084-33T43Uf G1084-33-40°C to +85°C TO-252 GND V OUT V IN G1084-15T53U G1084-15T53Uf G1084-15-40°C to +85°C TO-263 GND V OUT V IN G1084-18T53U G1084-18T53Uf G1084-18-40°C to +85°C TO-263 GND V OUT V IN G1084-25T53U G1084-25T53Uf G1084-25-40°C to +85°C TO-263 GND V OUT V IN G1084-33T53U G1084-33T53Uf G1084-33-40°C to +85°C TO-263 GND V OUT V IN G1084-15TU3U G1084-15TU3Uf G1084-15-40°C to +85°C TO-263T GND V OUT V IN G1084-18TU3U G1084-18TU3Uf G1084-18-40°C to +85°C TO-263T GND V OUT V IN G1084-25TU3U G1084-25TU3Uf G1084-25-40°C to +85°CTO-263T GND V OUTV IN G1084-33TU3U G1084-33TU3Uf G1084-33-40°C to +85°C TO-263T GND V OUTV IN* For other package types and pin options, please contact us at sales@ Note: T4: TO-252 T5: TO-263 TU: TO-263T (thin)3: Bonding Code U: Tape & ReelPackage Type Typical Application[Note 4]: Type of C OUT2V V OUTµF13TO-252/TO-263/TO-263TInput Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8V Power Dissipation Internally Limited (Note 2)Maximum Junction Temperature . . . . . . . . . . . . . . .150°C Storage Temperature Range . . . . .-65°C ≤ T J≤+150°C Reflow Temperature (soldering, 10sec) . . . . . . 260°C Thermal Resistance Junction to AmbientTO-252(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95°C/W TO-263(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W TO-263T(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . .82°C/W Thermal Resistance Junction to CaseTO-252 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8°C/W TO-263 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..6°C/W TO-263T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6°C/W ESD Rating (Human Body Model) . . . . . . . . . . . . .2kV Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . .2.2V~7V Temperature Range . . . . . . . . . . . . . -40°C ≤ T A≤85°CNote (1): See Recommended Minimum FootprintElectrical CharacteristicsV IN = 5V, C IN = C OUT = 220µF, T A = T J = 25°C unless otherwise specified. (Note3)PARAMETER CONDITIONMINTYPMAX UNITOutput Voltage 10mA < I OUT < 5A -2% V O 2% VLine Regulation (V OUT + 0.7V) < V IN < 5.5V, I OUT = 10mA --- 0.1 --- %G1084-18 V IN = 3.8V, 10mA < I OUT < 5AG1084-25 V IN = 5V, 10mA < I OUT < 5ALoad RegulationG1084-33 V IN = 5V, 10mA < I OUT < 5A--- 1 --- %G1084-18 ΔV OUT = 2%, I OUT = 5A --- 1.6 ---G1084-25 ΔV OUT = 2%, I OUT = 5A --- 1.3 ---Dropout VoltageG1084-33 ΔV OUT = 2%, I OUT = 5A --- 1.1 ---VCurrent Limit (V IN - V OUT) = 2V --- 5.5 --- AShort Circuit Current --- 1 --- AG1084-18 V IN = 5V --- 1.7 ---G1084-25 V IN = 5V --- 2.1 ---Quiescent CurrentG1084-33 V IN = 5V --- 2.4 ---mARipple Rejection f = 120Hz, C OUT = 10µF Tantalum,(V IN - V OUT) = 3V, I OUT = 1A--- 50 --- dBThermal Shutdown Junction Temperature --- 150 --- °C Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics.Note 2: The maximum power dissipation is a function of the maximum junction temperature, T Jmax ; total thermal resistance, θJA, and ambient temperature T A. The maximum allowable power dissipation at any ambient temperature is T jmax-T A / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown.Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.Note4: The type of output capacitor should be tantalum or aluminum.DefinitionsDropout VoltageThe input/output Voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 2% below its nominal value. Dropout voltage is affected by junction temperature, load cur-rent and minimum input supply requirements.Line RegulationThe change in output voltage for a change in input volt-age. The measurement is made under conditions of low dissipation or by using pulse techniques such that av-erage chip temperature is not significantly affected. Load RegulationThe change in output voltage for a change in load current at constant chip temperature. The measure-ment is made under conditions of low dissipation or by using pulse techniques such that average chip tem-perature is not significantly affected.Maximum Power DissipationThe maximum total device dissipation for which the regulator will operate within specifications.Quiescent Bias CurrentCurrent which is used to operate the regulator chip and is not delivered to the load.VIN -VOUT= 3V, CIN = 220µF, C OUT = 220µF, T A =25°C, unless otherwise noted.Line Transient ResponseLoad Transient ResponseShort Circuit CurrentRipple RejectionG1084-33 Overcurrent Protection CharacteristicsG1084 Start-upG1084-18 Overcurrent Protection CharacteristicsG1084-18 Start-upG1084 Max. Power Dissipation vs. PCB Top Copper AreaG1084 Max. Power Dissipation vs. T A MBG1084-18 Quiescent Current vs. TemperatureG1084-18 Dropout Voltage vs. IG1084-18 Output Voltage vs. TemperatureG1084-33 Quiescent Current vs. Temperature G1084-33 Dropout Voltage vs. IG1084-33 Output Voltage vs. Temperature G1084-33 Output Voltage vs. ILRecommend Minimum FootprintTO-252TO-263TO-263TTO-252 (T4) PackageMILLIMETERS INCHES SYMBOLMIN. MAX. MIN. MAX.A 2.190 2.400 0.086 0.094 A1 0.000 0.127 0.000 0.005B 0.880 1.650 0.035 0.065 b 0.500 0.880 0.020 0.035 b1 0.700 0.900 0.028 0.035C 0.430 0.580 0.017 0.023 C1 0.430 0.580 0.017 0.023D 6.350 6.730 0.250 0.265 D1 5.200 5.460 0.205 0.215E 5.400 6.220 0.213 0.245 e 2.300 TYP 0.091 TYPe1 4.500 4.700 0.177 0.185 L 8.830 10.77 0.348 0.424 L1 2.550 2.900 0.100 0.114 L2 1.400 1.780 0.055 0.070 L30.350 1.020 0.014 0.040V 3.800 4.320 0.150 0.170DD1Bb1be e1L3LVCL1EAC1A1L2TO-263 (T5) PackageMILLIMETER INCH SYMBOLMIN MAX MIN MAXA 4.470 4.670 0.176 0.184 A1 0.000 0.150 0.000 0.006B 1.170 1.370 0.046 0.054 b 0.710 0.910 0.028 0.036 b1 1.170 1.370 0.046 0.054 c 0.310 0.530 0.012 0.021 c1 1.170 1.370 0.046 0.054 D 10.010 10.310 0.394 0.406 E 8.500 8.900 0.335 0.350 e 2.540 TYP 0.100 TYP e1 4.980 5.180 0.196 0.204 L 15.050 15.450 0.593 0.608 L1 5.080 5.480 0.200 0.216 L2 2.340 2.740 0.092 0.108 L3 1.300 1.700 0.051 0.067 V 5.600 REF 0.220 REFDLbe e1b1L3BEL1Ac1A1L2cVTO-263T (TU) PackageDIMENSIONS IN MILLIMETERDIMENSIONS IN INCH SYMBOLMIN NOM MAX MIN NOM MAXA 1.750 2.000 2.250 0.069 0.079 0.089B 0.880 1.280 1.680 0.345 0.050 0.066 b 1.255 1.295 1.335 0.049 0.051 0.053 c 0.381 0.406 0.431 0.015 0.016 0.017 c1 0.356 0.406 0.456 0.014 0.016 0.018 D 9.660 10.160 10.660 0.380 0.400 0.420 D1 6.900 REF 0.272 REFE 8.380 8.680 8.980 0.330 0.342 0.354 e ----- 2.540 ----- ----- 0.100 ----- e1 ----- 5.080 ----- ----- 0.200 ----- L 13.74 14.240 14.740 0.541 0.561 0.580 L1 ----- 4.280 ----- ----- 0.169 ----- L2 2.290 2.540 2.790 0.090 0.100 0.110 L3 ----- ----- 1.778 ----- ----- 0.070 V ----- 7.280 ----- ----- 0.287 -----Taping SpecificationPACKAGE Q ’TY/REELTO-252 2,500 ea TO-263 800 ea TO-263T 1,500 eaGMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.TO-252 Package Orientation TO-263/TO-263T Package OrientationFeed DirectionFeed Direction。

AV1084资料

- Basic Adjustable Regulator Circuit -
1
MAY-31-2001
元器件交易网
@vic
5A Adjustable Low Dropout Linear Regulator (LDO)
AV1084
TO-252, 263, 220
ABSOLUTE MAXIMUM RATINGS
Maximum Supply Voltage Power Dissipation Thermal Resistance Junction to Case, θJC Thermal Resistance Junction to Ambient, θJA TO-220 TO-263 TO-252 7V Internally Limited 2.5 °C/W Operating Junction Temperature Range Storage Temperature Range Lead Temperature (Soldering, 10 Seconds) 0 to 125 °C -40 to 150 °C 260 °C
Minimum Load Current
Symbol VREF

Test Conditions VIN = 5V, IOUT = 10mA
Typical 1.25V 1.2V 0.5% 0.5% 10mA 55µA 7.5A 0.003% of VOUT 72dB
Limits 1.23VMin 1.27VMax 1.45V 2% 2.5% 100µA 5.0A (Min)
2
MAY-31-2001
元器件交易网
@vic
5A Adjustable Low Dropout Linear Regulator (LDO)

AMS1084中文资料

0.1 0.3 %
0.2 0.4
3
15
mV
7
20
3
15
mV
7
20
3
15
mV
7
20
3
15
mV
7
20
压差限流电流
AMS1084-5.0, 0mA≤IOUT≤5A, VIN-VOUT=3V VDROP IOUT=5A, ΔVREF, ΔVOUT=1% ILIMIT VIN-VOUT=3V
5
20
mV
10 35
3
Advanced Monolithic Systems 中文翻译：贝纳公司技术支援部０７５５－－８２８００２８９
AMS1084
推荐工作条件
参数输入电压工作结温范围
符号 VIN TJ
范围 12
0 ~ +125
单位 V °C
电气特性(除非特别指定，否则 Tamb=25°C，正常工作结温范围 0°C to 125°C )
60 72
dB
可调管脚电流
IADJ VIN=4.25V, IOUT=10mA
55 120 μA
可调管脚电流
10mA≤IOUT≤5A,
变化
ΔIADJ 1.5V≤(VIN-VOUT)≤4.5V
0.2 5 μA
温度稳定性
IOUT=10mA, VIN-VOUT=1.5V
0.5
%
长期稳定性
Tamb=125°C, 1000Hrs
A
TSD
Current limit
VO
Fixed : F1 and F2 connect, disconnect A Adj : A connect, F1 and F2 disconnect