MAX3397EEVKIT+中文资料
MAX3237EEAI+T中文资料
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,or visit Maxim's website at .General DescriptionThe MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E +3.0V-powered EIA/TIA-232 and V.28/V.24communications interface devices feature low power con-sumption, high data-rate capabilities, and enhanced electrostatic-discharge (ESD) protection. The enhanced ESD structure protects all transmitter outputs and receiver inputs to ±15kV using IEC 1000-4-2 Air-G ap Discharge, ±8kV using IEC 1000-4-2 Contact Discharge (±9kV for MAX3246E), and ±15kV using the Human Body Model. The logic and receiver I/O pins of the MAX3237E are protected to the above standards, while the transmit-ter output pins are protected to ±15kV using the Human Body Model.A proprietary low-dropout transmitter output stage delivers true RS-232 performance from a +3.0V to +5.5V power supply, using an internal dual charge pump. The charge pump requires only four small 0.1µF capacitors for opera-tion from a +3.3V supply. Each device guarantees opera-tion at data rates of 250kbps while maintaining RS-232output levels. The MAX3237E guarantees operation at 250kbps in the normal operating mode and 1Mbps in the MegaBaud™ operating mode, while maintaining RS-232-compliant output levels.The MAX3222E/MAX3232E have two receivers and two transmitters. The MAX3222E features a 1µA shutdown mode that reduces power consumption in battery-pow-ered portable systems. The MAX3222E receivers remain active in shutdown mode, allowing monitoring of external devices while consuming only 1µA of supply current. The MAX3222E and MAX3232E are pin, package, and func-tionally compatible with the industry-standard MAX242and MAX232, respectively.The MAX3241E/MAX3246E are complete serial ports (three drivers/five receivers) designed for notebook and subnotebook computers. The MAX3237E (five drivers/three receivers) is ideal for peripheral applications that require fast data transfer. These devices feature a shut-down mode in which all receivers remain active, while consuming only 1µA (MAX3241E/MAX3246E) or 10nA (MAX3237E).The MAX3222E, MAX3232E, and MAX3241E are avail-able in space-saving SO, SSOP, TQFN and TSSOP pack-ages. The MAX3237E is offered in an SSOP package.The MAX3246E is offered in the ultra-small 6 x 6 UCSP™package.ApplicationsBattery-Powered Equipment PrintersCell PhonesSmart Phones Cell-Phone Data Cables xDSL ModemsNotebook, Subnotebook,and Palmtop ComputersNext-Generation Device Features♦For Space-Constrained ApplicationsMAX3228E/MAX3229E: ±15kV ESD-Protected, +2.5V to +5.5V, RS-232 Transceivers in UCSP ♦For Low-Voltage or Data Cable ApplicationsMAX3380E/MAX3381E: +2.35V to +5.5V, 1µA, 2Tx/2Rx, RS-232 Transceivers with ±15kV ESD-Protected I/O and Logic PinsMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246E±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V ,Up to 1Mbps, True RS-232 Transceivers________________________________________________________________Maxim Integrated Products 119-1298; Rev 11; 10/07Ordering Information continued at end of data sheet.*Dice are tested at T A = +25°C, DC parameters only.**EP = Exposed paddle.Pin Configurations, Selector Guide, and Typical Operating Circuits appear at end of data sheet.MegaBaud and UCSP are trademarks of Maxim Integrated Products, Inc.†Covered by U.S. Patent numbers 4,636,930; 4,679,134;4,777,577; 4,797,899; 4,809,152; 4,897,774; 4,999,761; and other patents pending.M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 TransceiversABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICS(V CC = +3V to +5.5V, C1–C4 = 0.1µF, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.) (Notes 3, 4)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.V CC to GND..............................................................-0.3V to +6V V+ to GND (Note 1)..................................................-0.3V to +7V V- to GND (Note 1)...................................................+0.3V to -7V V+ + |V-| (Note 1).................................................................+13V Input Voltages T_IN, EN , SHDN , MBAUD to GND ........................-0.3V to +6V R_IN to GND.....................................................................±25V Output Voltages T_OUT to GND...............................................................±13.2V R_OUT, R_OUTB (MAX3241E)................-0.3V to (V CC + 0.3V)Short-Circuit Duration, T_OUT to GND.......................Continuous Continuous Power Dissipation (T A = +70°C)16-Pin SSOP (derate 7.14mW/°C above +70°C)..........571mW 16-Pin TSSOP (derate 9.4mW/°C above +70°C).......754.7mW 16-Pin TQFN (derate 20.8mW/°C above +70°C).....1666.7mW 16-Pin Wide SO (derate 9.52mW/°C above +70°C).....762mW 18-Pin Wide SO (derate 9.52mW/°C above +70°C).....762mW 18-Pin PDIP (derate 11.11mW/°C above +70°C)..........889mW 20-Pin TQFN (derate 21.3mW/°C above +70°C)........1702mW 20-Pin TSSOP (derate 10.9mW/°C above +70°C)........879mW 20-Pin SSOP (derate 8.00mW/°C above +70°C)..........640mW 28-Pin SSOP (derate 9.52mW/°C above +70°C)..........762mW 28-Pin Wide SO (derate 12.50mW/°C above +70°C).............1W 28-Pin TSSOP (derate 12.8mW/°C above +70°C)......1026mW 32-Lead Thin QFN (derate 33.3mW/°C above +70°C)..2666mW 6 x 6 UCSP (derate 12.6mW/°C above +70°C).............1010mW Operating Temperature Ranges MAX32_ _EC_ _...................................................0°C to +70°C MAX32_ _EE_ _.................................................-40°C to +85°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°C Bump Reflow Temperature (Note 2)Infrared, 15s..................................................................+200°C Vapor Phase, 20s..........................................................+215°C Note 1:V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.Note 2:This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the devicecan be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.Preheating is required. Hand or wave soldering is not allowed.MAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 Transceivers_______________________________________________________________________________________3M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers4_______________________________________________________________________________________TIMING CHARACTERISTICS—MAX3237E(V CC = +3V to +5.5V, C1–C4 = 0.1µF, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.) (Note 3)±10%. MAX3237E: C1–C4 = 0.1µF tested at +3.3V ±5%, C1–C4 = 0.22µF tested at +3.3V ±10%; C1 = 0.047µF, C2, C3, C4 =0.33µF tested at +5.0V ±10%. MAX3246E; C1-C4 = 0.22µF tested at +3.3V ±10%; C1 = 0.22µF, C2, C3, C4 = 0.54µF tested at 5.0V ±10%.Note 4:MAX3246E devices are production tested at +25°C. All limits are guaranteed by design over the operating temperature range.Note 5:The MAX3237E logic inputs have an active positive feedback resistor. The input current goes to zero when the inputs are atthe supply rails.Note 6:MAX3241EEUI is specified at T A = +25°C.Note 7:Transmitter skew is measured at the transmitter zero crosspoints.TIMING CHARACTERISTICS—MAX3222E/MAX3232E/MAX3241E/MAX3246EMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 Transceivers_______________________________________________________________________________________5-6-4-202460MAX3237ETRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE (MBAUD = GND)LOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )10001500500200025003000531-1-3-5-6-2-42046-5-31-135010001500500200025003000LOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )MAX3237ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCE-7.5-5.0-2.502.55.07.5MAX3237ETRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE (MBAUD = V CC )LOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )500100015002000__________________________________________Typical Operating Characteristics(V CC = +3.3V, 250kbps data rate, 0.1µF capacitors, all transmitters loaded with 3k Ωand C L , T A = +25°C, unless otherwise noted.)-6-5-4-3-2-10123456010002000300040005000MAX3241ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V)302010405060020001000300040005000MAX3241EOPERATING SUPPLY CURRENT vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )04286121014010002000300040005000MAX3241ESLEW RATE vs. LOAD CAPACITANCEM A X 3237E t o c 05LOAD CAPACITANCE (pF)S L E W R A T E (V /μs )-6-5-4-3-2-10123456010002000300040005000MAX3222E/MAX3232ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P UT V O L T A G E (V )624108141216010002000300040005000MAX3222E/MAX3232ESLEW RATE vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S L E W R A T E (V /μs)2520155103530404520001000300040005000MAX3222E/MAX3232E OPERATING SUPPLY CURRENT vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers6_______________________________________________________________________________________Typical Operating Characteristics (continued)(V CC = +3.3V, 250kbps data rate, 0.1µF capacitors, all transmitters loaded with 3k Ωand C L , T A = +25°C, unless otherwise noted.)20604080100MAX3237ETRANSMITTER SKEW vs. LOAD CAPACITANCE(MBAUD = V CC )LOAD CAPACITANCE (pF)100015005002000T R A N S M I T T E R S K E W (n s )-6-2-42046-3-51-1352.03.03.52.54.04.55.0SUPPLY VOLTAGE (V)T R A N S M I T T E R O U T P U T V O L T A G E (V )MAX3237ETRANSMITTER OUTPUT VOLTAGE vs. SUPPLY VOLTAGE (MBAUD = GND)10203040502.0MAX3237E SUPPLY CURRENT vs. SUPPLY VOLTAGE (MBAUD = GND)SUPPLY VOLTAGE (V)S U P P L Y C U R R E N T (m A )3.03.52.54.04.55.0MAX3246ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )4000300010002000-5-4-3-2-101234567-65000468101214160MAX3246ESLEW RATE vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S L EW R A T E (V /μs )200030001000400050001020304050600MAX3246EOPERATING SUPPLY CURRENT vs. LOAD CAPACITANCEM A X 3237E t o c 17LOAD CAPACITANCE (pF)S U P P L Y C U R R EN T (m A )1000200030004000500055453525155024681012MAX3237ESLEW RATE vs. LOAD CAPACITANCE(MBAUD = GND)LOAD CAPACITANCE (pF)S L E W R A T E (V /μs )10001500500200025003000010203050406070MAX3237ESLEW RATE vs. LOAD CAPACITANCE(MBAUD = V CC )LOAD CAPACITANCE (pF)S L E W R A T E (V /μs )5001000150020001020304050MAX3237ESUPPLY CURRENT vs. LOAD CAPACITANCE WHEN TRANSMITTING DATA (MBAUD = GND)LOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )10001500500200025003000MAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 Transceivers_______________________________________________________________________________________7Pin DescriptionM A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers8_______________________________________________________________________________________MAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 Transceivers_______________________________________________________________________________________9Detailed DescriptionDual Charge-Pump Voltage ConverterThe MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246Es’ internal power supply consists of a regu-lated dual charge pump that provides output voltages of +5.5V (doubling charge pump) and -5.5V (inverting charge pump) over the +3.0V to +5.5V V CC range. The charge pump operates in discontinuous mode; if the output voltages are less than 5.5V, the charge pump is enabled, and if the output voltages exceed 5.5V, the charge pump is disabled. Each charge pump requires a flying capacitor (C1, C2) and a reservoir capacitor (C3, C4) to generate the V+ and V- supplies (Figure 1).RS-232 TransmittersThe transmitters are inverting level translators that con-vert TTL/CMOS-logic levels to ±5V EIA/TIA-232-compli-ant levels.The MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E transmitters guarantee a 250kbps data rate with worst-case loads of 3k Ωin parallel with 1000pF,providing compatibility with PC-to-PC communication software (such as LapLink™). Transmitters can be par-alleled to drive multiple receivers or mice.The MAX3222E/MAX3237E/MAX3241E/MAX3246E transmitters are disabled and the outputs are forcedinto a high-impedance state when the device is in shut-down mode (SHDN = G ND). The MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E permit the outputs to be driven up to ±12V in shutdown.The MAX3222E/MAX3232E/MAX3241E/MAX3246E transmitter inputs do not have pullup resistors. Connect unused inputs to GND or V CC . The MAX3237E’s trans-mitter inputs have a 400k Ωactive positive-feedback resistor, allowing unused inputs to be left unconnected.MAX3237E MegaBaud OperationFor higher-speed serial communications, the MAX3237E features MegaBaud operation. In MegaBaud operating mode (MBAUD = V CC ), the MAX3237E transmitters guarantee a 1Mbps data rate with worst-case loads of 3k Ωin parallel with 250pF for +3.0V < V CC < +4.5V. For +5V ±10% operation, the MAX3237E transmitters guarantee a 1Mbps data rate into worst-case loads of 3k Ωin parallel with 1000pF.RS-232 ReceiversThe receivers convert RS-232 signals to CMOS-logic output levels. The MAX3222E/MAX3237E/MAX3241E/MAX3246E receivers have inverting three-state outputs.Drive EN high to place the receiver(s) into a high-impedance state. Receivers can be either active or inactive in shutdown (Table 1).Figure 1. Slew-Rate Test CircuitsLapLink is a trademark of Traveling Software.M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers10______________________________________________________________________________________The complementary outputs on the MAX3237E/MAX3241E (R_OUTB) are always active, regardless of the state of EN or SHDN . This allows the device to be used for ring indicator applications without forward biasing other devices connected to the receiver outputs. This is ideal for systems where V CC drops to zero in shutdown to accommodate peripherals such as UARTs (Figure 2).MAX3222E/MAX3237E/MAX3241E/MAX3246E Shutdown ModeSupply current falls to less than 1µA in shutdown mode (SHDN = low). The MAX3237E’s supply current falls to10nA (typ) when all receiver inputs are in the invalid range (-0.3V < R_IN < +0.3). When shut down, the device’s charge pumps are shut off, V+ is pulled down to V CC , V- is pulled to ground, and the transmitter out-puts are disabled (high impedance). The time required to recover from shutdown is typically 100µs, as shown in Figure 3. Connect SHDN to V CC if shutdown mode is not used. SHDN has no effect on R_OUT or R_OUTB (MAX3237E/MAX3241E).±15kV ESD ProtectionAs with all Maxim devices, ESD-protection structures are incorporated to protect against electrostatic dis-charges encountered during handling and assembly.The driver outputs and receiver inputs of the MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E have extra protection against static electricity. Maxim’s engineers have developed state-of-the-art structures to protect these pins against ESD of ±15kV without damage.The ESD structures withstand high ESD in all states:normal operation, shutdown, and powered down. After an ESD event, Maxim’s E versions keep working without latchup, whereas competing RS-232 products can latch and must be powered down to remove latchup.Furthermore, the MAX3237E logic I/O pins also have ±15kV ESD protection. Protecting the logic I/O pins to ±15kV makes the MAX3237E ideal for data cable applications.SHDN T2OUTT1OUT5V/div2V/divV CC = 3.3V C1–C4 = 0.1μFFigure 3. Transmitter Outputs Recovering from Shutdown or Powering UpMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 TransceiversESD protection can be tested in various ways; the transmitter outputs and receiver inputs for the MAX3222E/MAX3232E/MAX3241E/MAX3246E are characterized for protection to the following limits:•±15kV using the Human Body Model•±8kV using the Contact Discharge method specified in IEC 1000-4-2•±9kV (MAX3246E only) using the Contact Discharge method specified in IEC 1000-4-2•±15kV using the Air-G ap Discharge method speci-fied in IEC 1000-4-2Figure 4a. Human Body ESD Test ModelFigure 4b. Human Body Model Current WaveformFigure 5a. IEC 1000-4-2 ESD Test Model Figure 5b. IEC 1000-4-2 ESD Generator Current WaveformM A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceiverscharacterized for protection to ±15kV per the Human Body Model.ESD Test ConditionsESD performance depends on a variety of conditions.Contact Maxim for a reliability report that documents test setup, test methodology, and test results.Human Body ModelFigure 4a shows the Human Body Model, and Figure 4b shows the current waveform it generates when dis-charged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest,which is then discharged into the test device through a 1.5k Ωresistor.IEC 1000-4-2The IEC 1000-4-2 standard covers ESD testing and performance of finished equipment; it does not specifi-cally refer to integrated circuits. The MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E help you design equipment that meets level 4 (the highest level)of IEC 1000-4-2, without the need for additional ESD-protection components.The major difference between tests done using the Human Body Model and IEC 1000-4-2 is higher peak current in IEC 1000-4-2, because series resistance is lower in the IEC 1000-4-2 model. Hence, the ESD with-stand voltage measured to IEC 1000-4-2 is generally lower than that measured using the Human Body Model. Figure 5a shows the IEC 1000-4-2 model, and Figure 5b shows the current waveform for the ±8kV IEC 1000-4-2 level 4 ESD Contact Discharge test. The Air-G ap Discharge test involves approaching the device with a charged probe. The Contact Discharge method connects the probe to the device before the probe is energized.Machine ModelThe Machine Model for ESD tests all pins using a 200pF storage capacitor and zero discharge resis-tance. Its objective is to emulate the stress caused by contact that occurs with handling and assembly during manufacturing. All pins require this protection during manufacturing, not just RS-232 inputs and outputs.Therefore, after PC board assembly, the Machine Model is less relevant to I/O ports.Table 2. Required Minimum Capacitor ValuesFigure 6a. MAX3241E Transmitter Output Voltage vs. Load Current Per TransmitterTable 3. Logic-Family Compatibility with Various Supply VoltagesMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 TransceiversApplications InformationCapacitor SelectionThe capacitor type used for C1–C4 is not critical for proper operation; polarized or nonpolarized capacitors can be used. The charge pump requires 0.1µF capaci-tors for 3.3V operation. For other supply voltages, see Table 2 for required capacitor values. Do not use val-ues smaller than those listed in Table 2. Increasing the capacitor values (e.g., by a factor of 2) reduces ripple on the transmitter outputs and slightly reduces power consumption. C2, C3, and C4 can be increased without changing C1’s value. However, do not increase C1without also increasing the values of C2, C3, C4,and C BYPASS to maintain the proper ratios (C1 to the other capacitors).When using the minimum required capacitor values,make sure the capacitor value does not degradeexcessively with temperature. If in doubt, use capaci-tors with a larger nominal value. The capacitor’s equiv-alent series resistance (ESR), which usually rises at low temperatures, influences the amount of ripple on V+and V-.Power-Supply DecouplingIn most circumstances, a 0.1µF V CC bypass capacitor is adequate. In applications sensitive to power-supply noise, use a capacitor of the same value as charge-pump capacitor C1. Connect bypass capacitors as close to the IC as possible.Operation Down to 2.7VTransmitter outputs meet EIA/TIA-562 levels of ±3.7V with supply voltages as low as 2.7V.Figure 6b. Mouse Driver Test CircuitM A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 TransceiversFigure 7. Loopback Test CircuitT1IN T1OUTR1OUT5V/div5V/div5V/divV CC = 3.3V C1–C4 = 0.1μFFigure 8. MAX3241E Loopback Test Result at 120kbps T1INT1OUTR1OUT5V/div5V/div5V/divV CC = 3.3V, C1–C4 = 0.1μFFigure 9. MAX3241E Loopback Test Result at 250kbps+5V 0+5V 0-5V +5VT_INT_OUT5k Ω + 250pFR_OUTV CC = 3.3V C1–C4 = 0.1μFFigure 10. MAX3237E Loopback Test Result at 1000kbps (MBAUD = V CC )Transmitter Outputs Recoveringfrom ShutdownFigure 3 shows two transmitter outputs recovering from shutdown mode. As they become active, the two trans-mitter outputs are shown going to opposite RS-232 levels (one transmitter input is high; the other is low). Each transmitter is loaded with 3k Ωin parallel with 2500pF.The transmitter outputs display no ringing or undesir-able transients as they come out of shutdown. Note thatthe transmitters are enabled only when the magnitude of V- exceeds approximately -3.0V.Mouse DrivabilityThe MAX3241E is designed to power serial mice while operating from low-voltage power supplies. It has been tested with leading mouse brands from manu-facturers such as Microsoft and Logitech. The MAX3241E successfully drove all serial mice tested and met their current and voltage requirements.MAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 TransceiversFigure 6a shows the transmitter output voltages under increasing load current at +3.0V. Figure 6b shows a typical mouse connection using the MAX3241E.High Data RatesThe MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E maintain the RS-232 ±5V minimum transmit-ter output voltage even at high data rates. Figure 7shows a transmitter loopback test circuit. Figure 8shows a loopback test result at 120kbps, and Figure 9shows the same test at 250kbps. For Figure 8, all trans-mitters were driven simultaneously at 120kbps into RS-232 loads in parallel with 1000pF. For Figure 9, a single transmitter was driven at 250kbps, and all transmitters were loaded with an RS-232 receiver in parallel with 1000pF.The MAX3237E maintains the RS-232 ±5.0V minimum transmitter output voltage at data rates up to 1Mbps.Figure 10 shows a loopback test result at 1Mbps with MBAUD = V CC . For Figure 10, all transmitters were loaded with an RS-232 receiver in parallel with 250pF.Interconnection with 3V and 5V LogicThe MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E can directly interface with various 5V logic families, including ACT and HCT CMOS. See Table 3for more information on possible combinations of inter-connections.UCSP ReliabilityThe UCSP represents a unique packaging form factor that may not perform equally to a packaged product through traditional mechanical reliability tests. UCSP reliability is integrally linked to the user’s assembly methods, circuit board material, and usage environ-ment. The user should closely review these areas when considering use of a UCSP package. Performance through Operating Life Test and Moisture Resistance remains uncompromised as the wafer-fabrication process primarily determines it.Mechanical stress performance is a greater considera-tion for a UCSP package. UCSPs are attached through direct solder contact to the user’s PC board, foregoing the inherent stress relief of a packaged product lead frame. Solder joint contact integrity must be consid-ered. Table 4 shows the testing done to characterize the UCSP reliability performance. In conclusion, the UCSP is capable of performing reliably through envi-ronmental stresses as indicated by the results in the table. Additional usage data and recommendations are detailed in the UCSP application note, which can be found on Maxim’s website at .Table 4. Reliability Test DataM A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers__________________________________________________________Pin ConfigurationsMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 TransceiversPin Configurations (continued)M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers__________________________________________________Typical Operating CircuitsMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 Transceivers_____________________________________Typical Operating Circuits (continued)M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers_____________________________________Typical Operating Circuits (continued)MAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 Transceivers______________________________________________________________________________________21Selector Guide___________________Chip InformationTRANSISTOR COUNT:MAX3222E/MAX3232E: 1129MAX3237E: 2110MAX3241E: 1335MAX3246E: 842PROCESS: BICMOSOrdering Information (continued)†Requires solder temperature profile described in the AbsoluteMaximum Ratings section. UCSP Reliability is integrally linked to the user’s assembly methods, circuit board material, and environment. Refer to the UCSP Reliability Notice in the UCSP Reliability section of this datasheet for more information.**EP = Exposed paddle.。
MAX1239MEEE中文资料
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
MAX1236–MAX1239
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Applications
Hand-Held Portable Applications Medical Instruments Battery-Powered Test Equipment Solar-Powered Remote Systems Received-Signal-Strength Indicators System Supervision
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For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at .
MAX1879EVKIT中文资料
General DescriptionThe MAX1879, in conjunction with a P-channel MOSFET and a current-limited wall-mount adapter with an output voltage between +4.7V to +20V, allows safe and quick charging of a single lithium-ion (Li+) cell.The MAX1879 evaluation kit (EV kit) is a complete, fully assembled and tested Li+ battery charger. Jumpers on the EV kit allow easy adjustment to a +4.1V or +4.2V battery regulation voltage. A light-emitting diode (LED)indicates the cell’s charging status.Featureso Simple Stand-Alone Li+ Charger o Low Power Dissipationo Safely Precharges Over-Discharged Cellso Top-Off Charging to Achieve Full Battery Capacity o 8-Pin µMAX ®Package o Surface-Mount Construction o Fully Assembled and TestedEvaluates: MAX1879MAX1879 Evaluation Kit________________________________________________________________Maxim Integrated Products 119-2177; Rev 1; 9/05Component ListOrdering InformationFor pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .µMAX is a registered trademark of Maxim Integrated Products, Inc.E v a l u a t e s : M A X 1879MAX1879 Evaluation Kit 2_______________________________________________________________________________________Quick StartThe MAX1879 EV kit is a fully assembled and tested sur-face-mount board. Follow the steps below to verify board operation. Do not plug the WALL CUBE in until indicated.1)Install a shunt across pins 1 and 2 of jumper JU1 (TSEL)for a minimum 34ms on-time top-off pulse width.2)Install a shunt across jumper J U2 (THERM) to dis-able the temperature-monitoring function.3)Verify that a shunt is not across jumper JU3 (ADJ) ifcharging a +4.2V Li+ battery. Install a shunt across jumper JU3 if charging a +4.1V Li+ battery. 4)Connect a 6V current-limiting (≤1A) power supplyacross the EV kit ’s WALL CUBE and GND terminals.5)Place a voltmeter across the EV kit ’s BATT+ andBATT- terminals.6)Observe correct Li+ cell polarity.Connect a sin-gle-cell Li+ battery across the EV kit ’s BATT+ and BATT- terminals. The LED turns on if the battery voltage is below the predetermined voltage (4.1V or 4.2V) and greater than +2.5V. See Table 4 for addi-tional LED status descriptions.7)The LED turns off once the Li+ cell has beencharged to the predetermined voltage.Detailed DescriptionThe MAX1879 EV kit is a fully assembled and tested single Li+ battery charger. The EV kit contains an exter-nal p-channel MOSFET for current switching and can deliver up to 1A of current to an Li+ battery.The EV kit contains a jumper that sets the battery (BATT)regulation voltage to +4.1V or +4.2V. An external resis-tor can also adjust the regulation voltage from +4.0V to +4.2V. An LED indicates the charging status of the bat-tery. The maximum charging time is 6.25 hours.The MAX1879 employs thermistor feedback to prequalify the Li+ cell ’s temperature for fast charging. The EV kit con-tains a jumper that allows the user to bypass this feature or to connect an external thermistor to the EV kit board.Input SourceThe input source for the MAX1879 EV kit must be a current-limited supply capable of continuous short-circuit operation. The supply should have a current limit of ≤1A and an output voltage between +4.7V and +20V.Connect a current-limited wall cube to power jack J 1(center pin is the positive terminal); otherwise, connect a current-limited power-supply across the WALL CUBE and GND PC pads. Current-limited power sources with higher charge currents can be used, but diode D1 and MOSFET P1 must be rated accordingly.Jumper SelectionThe MAX1879 EV kit features jumpers (J U1, J U2, and JU3) to configure the circuit for optimal charging perfor-mance and evaluation.Jumper JU1 sets the minimum on-time pulse width. See Table 1 for the J U1 shunt configuration to select the appropriate top-off pulse width. Refer to the Selecting Minimum On-Time section in the MAX1879 data sheet for information on selecting the minimum on-time pulse width in top-off mode.(THERM) to a 10k Ωresistor, thus disabling temperature qualification. To enable temperature qualification,remove the shunt from J U2 and connect a thermistor between the THERM and GND pads. The thermistor should be 10k Ωat +25°C and have a negative temper-ature coefficient. See Table 2 for the JU2 configuration.Refer to the Thermistor section in the MAX1879 data sheet for other thermistor details.Jumper JU3 sets the battery regulation voltage. The EV kit comes with two voltage options, 4.2V (J U3 open)and 4.1V (J U3 closed). For other voltages (+4.0V to +4.2V), replace resistor R1. Refer to the Adjusting the Battery Regulation Voltage section in the MAX1879data sheet to select resistor R1. See Table 3 for the JU3configuration.The LED on the EV kit is driven by the CHG pin.Depending on the Li+ cell ’s charging status, the pin is low or high impedance, thus turning the LED on or off. If a thermistor is installed, and the cell temperature is unacceptable for fast charging, or the charger is in the precharging state, the LED blinks at 2Hz. The EV kit stops charging the cell during a temperature fault. See Table 4 for LED and CHG states.For driving logic circuits, remove the LED and install a 100k Ωpullup resistor from CHG to the logic supply of the CHG monitoring circuit. A logic-low signal appears at CHG when the charger is in fast-charge; otherwise, a logic high signal is detected. During the precharging or temperature fault state, the output logic signal alter-nates between low and high at a fixed frequency of 2Hz. See Table 4.Evaluates: MAX1879MAX1879 Evaluation Kit_______________________________________________________________________________________3E v a l u a t e s : M A X 1879MAX1879 Evaluation Kit 4_______________________________________________________________________________________Figure 1. MAX1879 EV Kit SchematicEvaluates: MAX1879MAX1879 Evaluation KitMaxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 _____________________5©2005 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products, Inc.Figure 2. MAX1879 EV Kit Component Placement Guide—Component SideFigure 3. MAX1879 EV Kit PC Board Layout—Component SideFigure 4. MAX1879 EV Kit PC Board Layout—Solder Side。
MAX16809EVKIT+中文资料
General DescriptionThe MAX16809 evaluation kit (EV kit) is a 16-channel,constant-current LED driver, capable of driving 40mA each to 16 LED strings with a total forward voltage of up to 32V. The MAX16809 EV kit is based on the MAX16809 device, which has 16 constant-current-sink-ing outputs with sink current settable using a single resistor and a high-performance, current-mode pulse-width-modulator (PWM) controller, for implementing a DC-DC converter that generates the supply voltage to drive the LED strings.The MAX16809 EV kit operates at supply voltages between 9V to 16V and temperatures ranging from 0°C to +70°C. I t features a PWM dimming control,adaptive control of the LED supply voltage, which depends upon the operating voltage of the LED strings,a built-in clock generator, and a low-current shutdown.The MAX16809 EV kit is a fully assembled and tested board.Features♦9V to 16V Supply Voltage Range♦40mA LED Current (Per Each LED String)♦Single-Resistor Current Adjust for 16 Channels ♦Up to 32V LED String Voltage♦Boost Converter to Generate LED Supply Voltage ♦Adaptive LED Supply Voltage Control Increases Efficiency ♦PWM Dimming Control♦Output-Voltage-Spike Protection for Inductive-Output Lines ♦Proven PCB LayoutEvaluates: MAX16809MAX16809 Evaluation Kit________________________________________________________________Maxim Integrated Products 119-0821; Rev 0; 5/07For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .Ordering Information*This limited temperature range applies to the EV kit PCB only.The MAX16809 IC temperature range is -40°C to +125°C.†EP = Exposed paddle.E v a l u a t e s : M A X 16809MAX16809 Evaluation Kit 2_______________________________________________________________________________________Evaluates: MAX16809MAX16809 Evaluation Kit_______________________________________________________________________________________3Quick StartRecommended Equipment•One 16V, 5A adjustable power supply •One 5V power supply•16 LED strings with a total forward voltage ≤32V •One multimeter•One PWM signal generator (optional)ProcedureThe MAX16809 EV kit is fully assembled and tested.Follow the steps below to verify operation. Caution: Do not turn on the power supply until all connections are completed.1)Connect LED strings with operating voltage ofapproximately 32V between VLED (pins 1-4 of J1)and OUT0–OUT15 (pins 5-20 of J1). All 16 channels should have an LED string load connected of the same type.2)Connect the DC power supply (16V, 5A) to VIN andGND.3)Connect a DC power supply (0 to 5V) to VBIAS andGND.4)Turn on the power supplies and apply 10V to VI Nand 3V to 5V to VBIAS. Connect SHDN and PWM to 3V to 5V. All of the LEDs should turn on. Measure the current through any LED string, which should be 40mA ±7%.5)I ncrease the supply voltage to 16V and the LEDcurrents will be stable. Measure the current through any LED string, which should be 40mA ±7%.6)Apply a PWM signal with amplitude of 3V to 5V anda frequency between 100Hz and 2kHz to the PWM input. The LED brightness should increase as the PWM duty cycle increases and viceversa.7)Connect SHDN to GND and all LEDs should turn off.Detailed DescriptionThe MAX16809 EV kit is a 16-channel, constant-current LED driver capable of driving 40mA each to 16 LED strings, with a total forward voltage of up to 32V. The MAX16809 EV kit can drive a total of 160 white LEDs in 16 strings, with operating current up to 40mA. The MAX16809 EV kit can operate at input supply voltages between 9V and 16V.The MAX16809 EV kit evaluates the MAX16809 IC, which has two major sections. The first section consists of 16constant-current LED drivers capable of sinking up to 55mA when on and blocking up to 36V when off. The sec-ond section is a high-performance current-mode PWMcontroller that can control a DC-DC converter to generate the supply voltage for driving the LED strings. The MAX16809 EV kit uses the PWM controller to drive a boost converter, which takes a 9V to 16V input and gen-erates a 33V LED supply voltage. To drive a constant cur-rent into an LED string, connect the LED string between the 33V output and any of the 16 constant-current-sink outputs. The resistor (R1) from the SET pin to ground pro-grams the sink current of each output. The sink current of any output can be up to 55mA and the amplitude is the same value for all the outputs. The difference between the total forward voltage and the LED supply voltage drops between the constant-current-sink output and ground,and is dissipated as power in the device.The LED supply voltage generated by the boost con-verter in the MAX16809 EV kit is adaptive. The LED string with the highest total forward voltage dominates the control loop, and the boost-converter voltage is adjusted so that the driver associated with that string receives just enough voltage required for current drive.All the other strings, with lower total forward voltages,will have excess supply voltage, which is then dropped in the associated driver. This feedback mechanism ensures that the linear-current-control circuit dissipates the minimum possible power. An on-board inverter (U4A) is configured to generate the clock input for the MAX16809. The constant-current output-driver circuits and U4 need a 3.3V to 5V input, which should be sup-plied externally. If 5V is not available, it can be generat-ed using an emitter-follower buffer from the REF output of MAX16809.Boost ConverterThe boost converter that generates the 33V LED supply voltage operates at a switching frequency of 350kHz in continuous-conduction mode (CCM). The current-mode PWM controller in the MAX16809 drives the external MOSFET (Q2) to control the boost converter. The MOSFET is turned on at the beginning of every switching cycle and turned off when the current through the induc-tor (L1) reaches the peak value set by the error-amplifier-output voltage. Inductor current is sensed from the volt-age across the ground-referenced current-sense resis-tor (parallel combination of R12 and R13). This current-sense information is passed on to the current-sense comparators in the MAX16809 through the CS pin.During the on period of the MOSFET, the inductor stores energy from the input supply. When the switch is turned off, the inductor generates sufficient voltage in reverse direction to discharge the stored energy to VLED. This generated voltage forms a source, in series with the input supply voltage, and drives VLED through the rectifier diode (D2).E v a l u a t e s : M A X 16809MAX16809 Evaluation Kit4_______________________________________________________________________________________As the boost converter is operated in CCM, only part of the stored energy in the inductor is discharged to VLED.The advantages of CCM include reduced input and out-put filtering, reduced EMI due to lower peak currents,and higher converter efficiency. However, these advan-tages come at the cost of a right-half-plane zero in the converter-transfer function. Compensating this zero requires reducing the system bandwidth, which affects the converter-dynamic response. As the 16-channel,constant-current-sink outputs control the current through the LEDs, slower control of VLED does not affect the LED operation. Compensation of the feedback circuit is explained in the Feedback Compensation section.An internal comparator turns off the gate pulse to the external MOSFET if the voltage at the CS pin exceeds 0.3V. The current through the inductor that produces 0.3V at the CS pin is the maximum inductor current possible (the actual current can be a little higher than this limit due to the 60ns propagation delay from the CS pin to the MOSFET drive output). This condition can happen when the feedback loop is broken, when the output capacitor charges during power-up, or when there is an overload at the output. This feature protects the MOSFET by limiting the maximum current passing through it during such conditions.The RC filter, consisting of R9 and C10, removes the voltage spike across the current-sense resistors pro-duced by the turn-on gate current of the MOSFET and the reverse-recovery current of D2. Without filtering,these current spikes can cause sense comparators to falsely trigger and turn off the gate pulse prematurely.The filter time constant should not be higher than required (the MAX16809 EV kit uses a 120ns time con-stant), as a higher time constant adds additional delay to the current-sense voltage, effectively increasing the current limit.During normal operating conditions, the feedback loop controls the peak current. The error amplifier compares a scaled-down version of the LED supply voltage (VLED) with a highly accurate 2.5V reference. The error amplifier and compensation network then amplify the error signal, and the current comparator compares this signal to the sensed-current voltage to create a PWM drive output.Power-Circuit DesignI nitially, decide the input supply voltage range, output voltage VLED (the sum of the maximum LED total for-ward voltage and 1V bias voltage for the constant-cur-rent-sink output), and the output current I OUT (the sum of all the LED string currents).Calculate maximum duty cycle D MAX using the following equation:where V D is the forward drop of the rectifier diode D2(~0.6V), VIN MIN is the minimum input supply voltage (in this case, 9V), and V FET is the average drain-to-source voltage of the MOSFET Q2 when it is on.Select the switching frequency F SW based on the space, noise, dynamic response, and efficiency con-straints. Select the maximum peak-to-peak ripple on the inductor current I L PP . For the MAX16809 EV kit,F SW is 350kHz and IL PP is ±30% of the average induc-tor current. Use the following equations to calculate the maximum average-inductor current I L AVG and peak inductor current IL PEAK :Since I L PP is ±30% of the average-inductor current ILAVG :Calculate the minimum inductance value L MIN with the inductor current ripple set to the maximum value:Choose an inductor that has a minimum inductance greater than this calculated value.Calculate the current-sense resistor (R12 in parallel with R13) using the equation below:where 0.3V is the maximum current-sense signal volt-age. The factor 0.75 is for compensating the reduction of maximum current-sense voltage due to the additionof slope compensation. Check this factor and adjust after the slope compensation is calculated. See the Slope Compensation section for more information.IL IL PP AVG =××032.Evaluates: MAX16809MAX16809 Evaluation Kit_______________________________________________________________________________________5The saturation current limit of the selected inductor (IL SAT ) should be greater than the value given by the equation below. Selecting an inductor with 10% higher IL SAT rating is a good choice:Calculate the output capacitor C OUT (parallel combina-tion of C16, C17, C18, and C24) using the followingequation:where VLED PP is the peak-to-peak ripple in the LED supply voltage. The value of the calculated output capacitance will be much lower than what is actually necessary for feedback loop compensation. See the Feedback Compensation section to calculate the out-put capacitance based on the compensation require-ments.Calculate the input capacitor C IN (parallel combination of C12, C13, C14, and C5) using the following equation:where VI N PP is the peak-to-peak input ripple voltage.This equation assumes that input capacitors supply most of the input ripple current.Selection of Power SemiconductorsThe switching MOSFET (Q2) should have a voltage rat-ing sufficient to withstand the maximum output voltage,together with the diode drop of D2, and any possible overshoot due to ringing caused by parasitic induc-tances and capacitances. Use a MOSFET with voltage rating higher than that calculated by the following equation:The factor of 1.3 provides a 30% safety margin.The continuous drain-current rating of the selected MOSFET when the case temperature is at +70°C should be greater than that calculated by the following equation.The MOSFET must be mounted on a board, as per manufacturer specifications, to dissipate the heat:The MOSFET dissipates power due to both switchinglosses, as well as conduction losses. Use the following equation to calculate the conduction losses in the MOSFET:where RDS ON is the on-state drain-source resistance of the MOSFET with an assumed junction temperature of 100°C.Use the following equation to calculate the switching losses in the MOSFET:where I GON and I GOFF are the gate currents of the MOSFET (with V GS equal to the threshold voltage)when it is turned on and turned off, respectively, and C GD is the gate-to-drain MOSFET capacitance. Choose a MOSFET that has a higher power rating than that cal-culated by the following equation when the MOSFET case temperature is at +70°C:The MAX16809 EV kit uses a Schottky diode as the boost-converter rectifier (D2). A Schottky rectifier diode produces less forward drop and puts the least burden on the MOSFET during reverse recovery. If a diode with considerable reverse-recovery time is used, it should be considered in the MOSFET switching-loss calculation.The Schottky diode selected should have a voltage rat-ing 20% above the maximum boost-converter output voltage. The current rating of the diode should be greater than I Din the following equation:P P P TOT COND SW=+V VLED V DS D =+()×13.IL IL SAT PEAK=×11.E v a l u a t e s : M A X 16809MAX16809 Evaluation Kit 6_______________________________________________________________________________________Slope CompensationWhen the boost converter operates in CCM with more than 50% duty cycle, subharmonic oscillations occur if slope compensation is not implemented. Subharmonic oscillations do not allow the PWM duty cycle to settle to a peak current value set by the voltage-feedback loop.The duty cycle oscillates back and forth about the required value, usually at half the switching frequency.Subharmonic oscillations die out if a sufficient negative slope is added to the inductor peak current. This means that for any peak current set by the feedback loop, the output pulse terminates sooner than normally expected. The minimum slope compensation that should be added to stabilize the current loop is half of the worst-case (max) falling slope of inductor current.Adding a ramp to the current-sense signal, with posi-tive slope in sync with the switching frequency, can produce the desired function. The greater the duty cycle, the greater the added voltage, and the greater the difference between the set current and the actual inductor current. In the MAX16809 EV kit, the oscillator ramp signal is buffered using Q1 and added to the cur-rent-sense signal with proper scaling to implement the slope compensation. Follow the steps below to calcu-late the component values for slope compensation.Calculate the worst-case falling slope of the inductor current using the following equation:From the inductor current falling slope, find its equiva-lent voltage slope across the current-sense resistor R CS (R12 parallel with R13) using the following equation:The minimum voltage slope that should be added to the current-sense waveform is half of V SLOPE for ensur-ing stability up to 100% duty cycle. As the maximum continuous duty cycle used is less than 100%, the mini-mum required compensation slope becomes:The factor 1.1 provides a 10% margin. Resistors R9and R10 determine the attenuation of the buffered volt-age slope from the emitter of Q1. The forward drop ofsignal diode D11, together with the V BE of Q1, almost cancel the 1.1V offset of the ramp waveform. Calculate the approximate slope of the oscillator ramp using the following equation:where 1.7V is the ramp amplitude and F SW is the switching frequency.Select the value of R9 such that the input bias current of the current-sense comparators does not add consider-able error to the current-sense signal. The value of R10for the slope compensation is given by the equation:LED DriverThe MAX16809 features a 16-channel, constant-current LED driver, with each channel capable of sinking up to 55mA of LED current. The LED strings are connected between VLED and the constant-current-sink outputs to drive regulated current through LED strings. The cur-rent through all 16 channels is controlled through resis-tor (R1) from the SET pin to ground. The MAX16809 EV kit sets the current through each string at 40mA and the maximum LED supply voltage to 33V. The MAX16809EV kit drives LED strings with a total forward voltage of up to 32V.A 4-wire serial interface with four inputs (DIN, CLK, LE,and OE ) individually control the constant-current out-puts. I n the MAX16809 EV kit, a 50kHz clock signal,generated by U4A, clocks 16 1s into the internal shift register by tying DIN and LE to 5V. The clock-generation circuit can be avoided if a microcontroller provides the function.The output enable (OE ) can provide PWM dimming. An inverted PWM signal, generated by the inverter U4B, is necessary to drive the OE pin. When the PWM signal is low (LED drivers off), it also influences the feedback with the network formed by R6 and D12. See the Adaptive LED Supply Voltage Control section for more details.I f an inverted PWM signal is available, use the circuit shown in Figure1 to drive the OE input and feedbacknetwork.VR F SLOPE SW=×17.V IL R SLOPE SLOPE CS=×Evaluates: MAX16809MAX16809 Evaluation Kit_______________________________________________________________________________________7Output Current SettingThe amplitude of the output sink currents for all 16channels is set to the same value by the resistor (R1)from the SET pin to ground. The minimum allowed value of R SET is 311Ω, which sets the output currents to 55mA. The maximum allowed value of R SET is 5k Ω. The MAX16809 EV kit uses 430Ωfor R SET , which sets the output current to 40mA. To set a different output cur-rent, use the following equation:where R SET is the current-setting resistor (R1) value in ohms and I OUT is the desired output current in milliamps.Adaptive LED Supply Voltage ControlTo reduce power dissipation in the I C, the MAX16809EV kit features adaptive control of VLED based on the operating voltage of the LED strings. The constant-cur-rent-sink outputs can sink stable currents with output voltages as low as 0.8V. The voltage at each of the 16outputs will be the difference between VLED and the total forward voltage of the LED string connected to that output. The MAX16809 EV kit implements a feed-back mechanism to sense the voltage at each of the 16constant-current-sink outputs. Using dual zener diodes (D3–D10), the MAX16809 EV kit selects the lowest dri-ver voltage (with the greatest LED string voltage) to regulate. The boost-converter PWM then adjusts so that VLED is high enough for this sink output to settle toapproximately 0.8V. All the other strings have sufficient voltage, as their total forward voltages are lower. The feedback mechanism ensures that the IC dissipates the minimum possible power. For adaptive control to func-tion efficiently connect LED strings to all 16 channels and use an equal number of LEDs from the same bin in each string. I f some of the 16 channels are not used,then the zener diodes (D3–D10) should be removed from the unused channels.Use the equation below to calculate the value of R2 to get the required minimum voltage at the sink outputs:where 2.5V is the feedback reference, V DZ is the for-ward drop of the ORing diode (D3–D10), V S = 0.5V is the required sink-output voltage, and V FLED is the nom-inal total forward voltage of the LED strings. Select the value of R2 such that R7 is approximately 10k Ω.The zener diodes (D3–D10) also provide output over-voltage protection. If an LED string gets partially or fully shorted, making the sink-output voltage go high, the 15V zener diode connected to that output conducts in reverse direction, and limits the VLED voltage. Under this condition, the other LED strings might not turn on.When the outputs are off, the LED drivers are at high impedance and the feedback network now combines R6 and D12 to provide a path for the feedback currentand to control VLED. Use the following equation toE v a l u a t e s : M A X 16809MAX16809 Evaluation Kit 8_______________________________________________________________________________________calculate the value of R6 to get the required LED sup-ply voltage during PWM off time:where 2.5V is the feedback-reference voltage, 0.4V is the total voltage dropped by D4 and PWM input, and VLED OFF is the desired LED supply voltage during PWM off time. VLED OFF should be set to the worst-case LED string voltage plus some additional headroom for the LED drivers (0.8V), as well as a reserve voltage (approximately 1V). The reserve voltage allows the MAX16809 to provide current for very short PWM dim-ming on-pulses. With pulses as low as 2µs, the VLED control loop is not able to react, and the output capaci-tors provide all the current. For longer PWM dimming pulses, the control loop reacts and the supply operates at the adaptive voltage level.During an open LED condition, the 33V zener diode (D1) limits the maximum LED supply voltage to 35.5V. If VLED attempts to increase beyond this level, D1 con-ducts in reverse direction and pulls the FB pin high,which causes the boost regulator to cut back on the PWM signal and reduce the output voltage.PWM DimmingThe PWM dimming controls the LED brightness by adjusting the duty cycle of the PWM input signal. A high voltage at the PWM input enables the output cur-rent; a low voltage turns off the output current. Connect a signal with peak amplitude of 3V to 5V and with fre-quency from 100Hz to 2kHz to the PWM input and vary the duty cycle to adjust the LED brightness. The LED brightness increases when the duty cycle increases and vice versa. If an inverted PWM signal is available,use that signal to implement PWM dimming, as shown in Figure 1.Feedback CompensationLike any other circuit with feedback, the boost convert-er that generates the supply voltage for the LED strings needs to be compensated for stable control of its out-put voltage. As the boost converter is operated in con-tinuous-conduction mode, there exists a right-half-plane (RHP) zero in the power-circuit transfer function.This zero adds a 20dB/decade gain together with a 90-degree phase lag, which is difficult to compensate. The easiest way to avoid this zero is to roll off the loop gainto 0dB at a frequency less than half of the RHP zero fre-quency with a -20dB/decade slope. For a boost con-verter, the worst-case RHP zero frequency (F ZRHP ) is given by the following equation:where D MAX is the maximum duty cycle, L is the induc-tance of the inductor, and I O is the output current,which is the sum of all the LED string currents.The boost converter used in the MAX16809 EV kit is operated with current-mode control. There are two feedback loops within a current-mode-controlled con-verter: an inner loop that controls the inductor current and an outer loop that controls the output voltage. The amplified voltage error produced by the outer voltage loop is the input to the inner current loop that controls the peak inductor current.The internal current loop converts the double-pole 2nd-order system, formed by the inductor and the output capacitor C OUT , to a 1st-order system having a single pole consisting of the output filter capacitor and the out-put load. As the output load is a constant current (i.e.,very high Thevenin impedance), this pole is located near the origin (0Hz). The phase lag created by the output pole for any frequency will be 90 degrees. Since the power-circuit DC gain is limited by other factors, the gain starts falling at -20dB/decade from a non-zero frequency before which the power-circuit gain stabilizes.Total gain of the feedback loop at DC is given by the following equation:where G P is the power-circuit DC gain, and G EA is the error-amplifier open-loop DC gain, typically 100dB. G FB is the gain of the feedback network for adaptive control of the VLED, which is seen from VLED to the error-amplifier input (FB pin). The adaptive control senses the voltages at the 16 constant-current-sink outputs and adjusts the feedback to control these voltages to a minimum value (Figure 2). As the LEDs carry constant current, the voltage across the LEDs does not change with variations in VLED. Any change in VLED directly reflects to the constant-current-sink outputs and to the error-amplifier input, making G FB equal to unity.G G G G TOT P EA FB=××Evaluates: MAX16809MAX16809 Evaluation Kit_______________________________________________________________________________________9The DC gain of the power circuit is expressed as the change in the output voltage, with respect to the change in error-amplifier output voltage. As the boost converter in the MAX16809 EV kit drives a constant-current load, the power-circuit DC gain is calculatedCalculate the power-circuit DC gain using the following where R CS is the current-sense resistor, F SW is theswitching frequency, and the factor 3 is to account for the attenuation of error-amp output before it is fed to the current-sense comparator.The power-circuit gain is lowest at the minimum input supply voltage and highest at the maximum input sup-ply voltage. Any input supply voltage between 9V and 16V can be used for power-circuit gain calculation, as the final compensation values obtained are the same.Calculate the frequency F P2,at which the power-circuit gain starts falling,at -20dB/decade using the following equation:where C OUT is the output filter capacitor, which is the parallel combination of C16, C17, C18, and C24. Adjust the output capacitance so that the product of F P2and G P is below F ZRHP / 6. The value of output capacitance obtained this way will be much greater than the value obtained using the maximum output voltage ripple specification.The compensation strategy is as follows. The gain-fre-quency response of the feedback loop should cross 0dB at or below half of the RHP zero frequency, with a slope of -20dB/decade for the feedback to be stable and have sufficient phase margin. The compensation network from COMP pin to FB pin of the MAX16809 (formed by R5,C28, C29, and R11) offers one dominant pole (P1), a zero (Z1), and a high-frequency pole (P3). There are two very low frequency poles and a zero in the loop before the crossover frequency. The function of the zero (Z1) is to compensate for the output pole and to reduce the slope of the loop gain from -40dB/decade to -20dB/decade,and also to reduce the phase lag by 90 degrees.Choose the crossover frequency to be half of the worst-case RHP zero frequency:Place the zero (Z1) at one-third of the crossover fre-quency, so that the phase margin starts improving from a sufficiently lower frequency:Use the following equation to calculate the dominant pole location, so that the loop gain crosses 0dB at F C :Since the open-loop gain of the error amplifier can have variations, the dominant pole location can also vary from device to device. I n the MAX16809 EV kit, the dominant pole location is decided by the error-amplifier gain, so the combined effect is a constant-gain-band-width product.Select the value of R11 such that the input bias current of the error amplifier does not cause considerable drop across it. The effective AC impedance seen from the FB pin is the sum of R11 and R7. I t is preferable to keep R7 much lower, compared to R11, to have better control on the AC impedance. Find C29 using the fol-lowing equation:The location of the zero (Z1) decided by R5 and C29 is given by the following equation:Place the high-frequency pole (P 3), formed by C28,C29, and R5, at half the switching frequency to provide further attenuation to any high-frequency signal propa-gating through the system. The location of the high-fre-quency pole (F P3) is given by the following equation,and should be used to calculate the value of C28:。
MAX3094EESE中文资料
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at .
元器件交易网
MAX3093E/MAX3094E
_______________Ordering Information
PART MAX3093ECUE MAX3093ECSE MAX3093ECPE MAX3093EEUE MAX3093EESE MAX3093EEPE MAX3094ECUE MAX3094ECSE MAX3094ECPE MAX3094EEUE MAX3094EESE MAX3094EEPE TEMP RANGE 0°C to +70°C 0°C to +70°C 0°C to +70°C -40°C to +85°C -40°C to +85°C -40°C to +85°C 0°C to +70°C 0°C to +70°C 0°C to +70°C -40°C to +85°C -40°C to +85°C -40°C to +85°C PIN-PACKAGE 16 TSSOP 16 Narrow SO 16 Plastic DIP 16 TSSOP 16 Narrow SO 16 Plastic DIP 16 TSSOP 16 Narrow SO 16 Plastic DIP 16 TSSOP 16 Narrow SO 16 Plastic DIP
________________________Applications
MAX999EUK-T中文资料
TOP VIEW
Q1 GND 2
MAX999
5 VCC
IN+ 3
4 IN-
SOT23-5 Pin Configurations continued at end of data sheet.
________________________________________________________________ Maxim Integrated Products 1
— — — — — — — — ACAB
PART NO. OF COMPARATORS COMPLEMENTARY OUTPUT SHUTDOWN LATCH ENABLE PACKAGE
__________________Pin Configurations
MAX961
1
MAX962
2
MAX963
PART
TEMP RANGE
PINPACKAGE
SOT TOP MARK
MAX961ESA -40°C to +85°C 8 SO
—
MAX961EUA MAX962ESA MAX962EUA MAX963ESD MAX964ESE MAX964EEE MAX997ESA MAX997EUA MAX999EUK-T
2
MAX964
4
MAX997
1
MAX999
1
Yes Yes Yes 8 SO/µMAX
No
No
No 8 SO/µMAX
Yes Yes Yes 14 SO
No
Yes
No 16 SO/QSOP
No
Yes
No 8 SO/µMAX
No
MA3X717E资料
Schottky Barrier Diodes (SBD)
MA3X717D, MA3X717E
Silicon epitaxial planar type
For switching circuits I Features
• Two MA3X717s are contained in one package • Optimum for low-voltage rectification because of its low forward rise voltage (VF) (Low VF type of MA3X704D/E) • Optimum for high-frequency rectification because of its short reverse recovery time (trr)
2.8 − 0.3 0.65 ± 0.15 1.5
+ 0.25 − 0.05 + 0.2
Unit : mm
0.65 ± 0.15
0.95
1.9 ± 0.2
2.9 − 0.05
1 3 2
+ 0.2
0.95
1.45
1.1 − 0.1
I Absolute Maximum Ratings Ta = 25°C
0
5
10
15
20
25
30
Forward voltage VF (V)
Ambient temperature Ta (°C)
Reverse voltage VR (V)
Ct VR
3.2 2.8 f = 1 MHz Ta = 25°C
IR T a
104
Terminal capacitance Ct (pF)
MAX3313EEUB-T中文资料
General DescriptionThe MAX3311E/MAX3313E are low-power, 5V EIA/TIA-232-compatible transceivers. All transmitter outputs and receiver inputs are protected to ±15kV using the Human Body Model, making these devices ideal for applications where more robust transceivers are required.Both devices have one transmitter and one receiver.The transmitters have a proprietary low-dropout trans-mitter output stage enabling RS-232-compatible opera-tion from a +5V supply with a single inverting charge pump. These transceivers require only three 0.1µF capacitors and will run at data rates up to 460kbps while maintaining RS-232-compatible output levels.The MAX3311E features a 1µA shutdown mode. In shutdown the device turns off the charge pump, pulls V- to ground, and the transmitter output is disabled.The MAX3313E features an INVALID output that asserts high when an active RS-232 cable signal is connected,signaling to the host that a peripheral is connected to the communication port.________________________ApplicationsDigital Cameras PDAs GPS POSTelecommunications Handy Terminals Set-Top BoxesFeatureso ESD Protection for RS-232-Compatible I/O Pins±15kV—Human Body Modelo 1µA Low-Power Shutdown (MAX3311E)o INVALID Output (MAX3313E)o Receiver Active in Shutdown (MAX3311E)o Single Transceiver (1Tx/1Rx) in 10-Pin µMAX PackageMAX3311E/MAX3313E±15kV ESD-Protected, 460kbps, 1µA,RS-232-Compatible Transceivers in µMAX________________________________________________________________Maxim Integrated Products1Pin Configurations19-1910; Rev 0; 1/01Ordering InformationFor price, delivery, and to place orders,please contact Maxim Distribution at 1-888-629-4642,or visit Maxim’s website at .Typical Operating CircuitM A X 3311E /M A X 3313E±15kV ESD-Protected, 460kbps, 1µA,RS-232-Compatible Transceivers in µMAX 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICSStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.V CC to GND.............................................................-0.3V to +6V V- to GND................................................................+0.3V to -7V V CC + |V-|............................................................................+13V Input VoltagesTIN, SHDN to GND...............................................-0.3V to +6V RIN to GND......................................................................±25V Output VoltagesTOUT to GND................................................................±13.2V ROUT, INVALID to GND.....................…-0.3V to (V CC + 0.3V)Short-Circuit DurationTOUT to GND.........................................................ContinuousContinuous Power Dissipation10-Pin µMAX (derate 5.6mW/°C above +70°C)..........444mW Operating Temperature RangesMAX331_ECUB.................................................0°C to +70°C MAX331_EEUB..............................................-40°C to +85°C Junction Temperature.....................................................+150°C Storage Temperature Range............................-65°C to +150°C Lead Temperature (soldering, 10s)................................+300°CMAX3311E/MAX3313E±15kV ESD-Protected, 460kbps, 1µA,RS-232-Compatible Transceivers in µMAX_______________________________________________________________________________________3ELECTRICAL CHARACTERISTICS (continued)TIMING CHARACTERISTICSM A X 3311E /M A X 3313E±15kV ESD-Protected, 460kbps, 1µA,RS-232-Compatible Transceivers in µMAX 4_______________________________________________________________________________________Typical Operating Characteristics(V CC = +5V, 0.1µF capacitors, transmitter loaded with 3k Ωand C L , T A = +25°C, unless otherwise noted.)0428612101410001500500200025003000SLEW RATEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S L E W R A T E (V /µs )-5-4-3-2-10123456050010001500200025003000TRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )010001500500200025003000SUPPLY CURRENT vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)Detailed DescriptionSingle Charge-Pump Voltage ConverterThe MAX3311E/MAX3313E internal power supply has a single inverting charge pump that provides a negative voltage from a single +5V supply. The charge pump operates in a discontinuous mode and requires a flying capacitor (C1) and a reservoir capacitor (C2) to gener-ate the V- supply.RS-232-Compatible DriverThe transmitter is an inverting level translator that con-verts CMOS-logic levels to EIA/TIA-232 compatible lev-els. It guarantees data rates up to 460kbps with worst-case loads of 3k Ωin parallel with 1000pF. When SHDN is driven low, the transmitter is disabled and put into tri-state. The transmitter input does not have an internal pullup resistor.RS-232 ReceiverThe MAX3311E/MAX3313E receiver converts RS-232signals to CMOS-logic output levels. The MAX3311E receiver will remain active during shutdown mode. The MAX3313E INVALID indicates when an RS-232 signal is present at the receiver input, and therefore when the port is in use.The MAX3313E INVALID output is pulled low when no valid RS-232 signal level is detected on the receiver input.MAX3311E Shutdown ModeIn shutdown mode, the charge pump is turned off, V- is pulled to ground, and the transmitter output is disabled (Table 1). This reduces supply current typically to 1µA.The time required to exit shutdown is less than 25ms.Applications InformationCapacitor SelectionThe capacitor type used for C1 and C2 is not critical for proper operation; either polarized or nonpolarized capacitors are acceptable. If polarized capacitors are used, connect polarity as shown in the Typical Operating Circuit . The charge pump requires 0.1µF capacitors. Increasing the capacitor values (e.g., by a factor of 2) reduces power consumption. C2 can beincreased without changing C1’s value. However, do not increase C1’s value without also increasing the value of C2 and C BYPASS to maintain the proper ratios (C1 to the other capacitors).When using the minimum 0.1µF capacitors, make sure the capacitance does not degrade excessively with temperature. If in doubt, use capacitors with a larger nominal value. The capacitor ’s equivalent series resis-tance (ESR) usually rises at low temperatures and influ-ences the amount of ripple on V-.To reduce the output impedance at V-, use larger capacitors (up to 10µF).Bypass V CC to ground with at least 0.1µF. In applica-tions sensitive to power-supply noise generated by the charge pump, decouple V CC to ground with a capaci-tor the same size as (or larger than) charge-pump capacitors C1 and C2.Transmitter Output when ExitingShutdownFigure 1 shows the transmitter output when exiting shutdown mode. The transmitter is loaded with 3k Ωin parallel with 1000pF. The transmitter output displays no ringing or undesirable transients as the MAX3311E comes out of shutdown. Note that the transmitter is enabled only when the magnitude of V- exceeds approximately -3V.High Data RatesThe MAX3311E/MAX3313E maintain RS-232-compati-ble ±3.7V minimum transmitter output voltage even atMAX3311E/MAX3313E±15kV ESD-Protected, 460kbps, 1µA,RS-232-Compatible Transceivers in µMAX5Figure 1. Transmitter Output when Exiting Shutdown or Powering Up10µs/divSHDNTOUT5V/div1.5V/divTIN = GNDTIN = V CCM A X 3311E /M A X 3313E±15kV ESD-Protected, 460kbps, 1µA,RS-232-Compatible Transceivers in µMAX 6_______________________________________________________________________________________high data rates. Figure 2 shows a transmitter loopback test circuit. Figure 3 shows the loopback test result at 120kbps, and Figure 4 shows the same test at 250kbps.±15kV ESD ProtectionAs with all Maxim devices, ESD-protection structures are incorporated on all pins to protect against electro-static discharges encountered during handling and assembly. The MAX3311E/MAX3313E driver outputsand receiver inputs have extra protection against static discharge. Maxim ’s engineers have developed state-of-the-art structures to protect these pins against ESD of ±15kV without damage. The ESD structures withstand high ESD in all states: normal operation, shutdown, and powered down. After an ESD event, Maxim ’s E versions keep working without latchup; whereas, competing products can latch and must be powered down to remove latchup.ESD protection can be tested in various ways. The transmitter outputs and receiver inputs of the product family are characterized for protection to ±15kV using the Human Body Model.ESD Test ConditionsESD performance depends on a variety of conditions.Contact Maxim for a reliability report that documents test setup, test methodology, and test results.Human Body ModelFigure 5 shows the Human Body Model, and Figure 6shows the current waveform it generates when dis-charged into low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest,which is then discharged into the test device through a 1.5k Ωresistor.Machine ModelThe Machine Model for ESD tests all pins using a 200pF storage capacitor and zero discharge resis-tance. Its objective is to emulate the stress caused by contact that occurs with handling and assembly during manufacturing. Of course, all pins require this protec-tion during manufacturing, not just RS-232 inputs and outputs. Therefore, after PC board assembly, the Machine Model is less relevant to I/O ports.Figure 4. Loopback Test Results at 250kbps2µs/divTOUTTINROUTFigure 3. Loopback Test Results at 120kbps 5µs/divTOUTTINROUTMAX3311E/MAX3313E±15kV ESD-Protected, 460kbps, 1µA,RS-232-Compatible Transceivers in µMAX_______________________________________________________________________________________7Figure 5. Human Body ESD Test ModelFigure 6. Human Body Current WaveformPin Configurations (continued)Chip InformationTRANSISTOR COUNT: 278M A X 3311E /M A X 3313E±15kV ESD-Protected, 460kbps, 1µA,RS-232-Compatible Transceivers in µMAX Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.8_____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©2001 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.______________________________________________________________Pin Description。
MAXIM MAX038 Evaluation Kit 数据手册
Evaluates: MAX038MAX038 Evaluation Kit________________________________________________________________Maxim Integrated Products 1_______________General DescriptionThe MAX038 evaluation kit (EV kit) is a high-frequency function generator capable of producing accurate tri-angle/sawtooth, sine, and square/pulse waveforms up to 10MHz, using the supplied components. Output fre-quency and duty cycle are easily adjusted with on-board potentiometers. Removable jumpers select sine,square, or triangle waveforms, or fix the duty cycle at 50%. The output is buffered with a MAX442 amplifier capable of driving a 50Ωcoaxial cable. The MAX038EV kit is fully assembled and tested.___________________________Featureso 325kHz to 10MHz Operation o Adjustable Duty Cycle o 2.5V Reference Output o TTL-Compatible SYNC Output o Fully Assembled and Tested____________________Component List_________________________Quick StartThe MAX038 EV kit is a fully assembled and tested board. Follow these steps to verify board operation. Do not turn on the power supply until all connections are completed.1)Connect a +5V supply to the pad marked +5V.Connect a -5V supply to the pad marked -5V.Connect ground(s) to the GND pad.2)Connect an oscilloscope to the BNC jack markedOUTPUT through a terminated 50Ωcable. The MAX038 output prior to the amplifier stage may also be monitored using an oscilloscope probe at the OUT pad. 3)Place the shunt across pins 2 and 3 of JU4 for 50%duty cycle. Place the shunt across pins 1 and 2 of______________Ordering Information______________________________EV KitFor free samples & the latest literature: , or phone 1-800-998-8800.For small orders, phone 408-737-7600 ext. 3468.查询MAX038EVKIT供应商JU3 to allow the frequency to be adjusted. Verify that there is a shunt on JU5.4)Verify the shunts on JU1 and JU2 for a square-waveoutput. Refer to Table 1 for alternate waveform selections.5)Apply power and verify the output waveform._______________Detailed DescriptionWaveform SelectionTo select the desired output waveform, place shunts across JU1 and JU2 in the combinations shown in Table 1. These jumpers set address pins A0 and A1 to TTL/CMOS-logic levels. External control may be initiat-ed by connecting an external source to the A0 and A1 pads and removing the shunts on JU1 and JU2.Note that there are 10k Ωpull-up resistors to +5V on the A0 and A1 address lines.* Note: Frequency pre-set by oscillator capacitor (C1) and inputcurrent (position of R3) as specified by formula [1].Output FrequencyThe output frequency is controlled by the oscillator capacitor (C1), the current injected into the IIN pin, and the voltage on the FADJ pin. The EV kit allows indepen-dent adjustment of both input current (R3) and FADJ voltage (R2). Refer to the Detailed Description section of the MAX038 data sheet for additional theory of oper-ation.Input Current ControlThe current injected into the IIN pin acts as the primary frequency-adjustment control. The R3 potentiometer varies the current to the MAX038’s IIN pin. The input current can be easily monitored by removing the JU5shunt and placing a current meter across the JU5 pins.The components supplied on the EV kit will allow an input current range of 50µA to 725µA. With the VADJ pin grounded, the fundamental output frequency (F o ) is as follows:F o (MHz) = I IN (µA) ÷C OSC (pF) [1]where: I IN = current injected into IIN= V REF ÷(R3 + R12)= 2.5V ÷(0k Ωto 50k Ω+ 3.3k Ω)C OSC = external oscillator capacitor (C1)To use an external input current, connect the external current source to the IIN pad and remove the JU5 shunt completely. Note that there is a 3.3k Ωresistor in series with the device IIN pin.FADJ ControlVarying the FADJ voltage will also vary the output fre-quency. With a shunt across pins 1 and 2 of JU3, the R2 potentiometer will vary the voltage applied to the FADJ pin. With the JU3 shunt on pins 2 and 3, the FADJ pin is grounded. Grounding the FADJ pin sets the out-put to the fundamental output frequency (F o ), as given by equation [1].To use an external FADJ voltage, connect the external source to the FADJ pad and remove the JU3 shunt completely. Limit the external FADJ voltage to ±2.4V.Duty-Cycle ControlThe voltage on the DADJ pin controls the duty cycle of the output waveform. With the JU4 shunt on pins 1 and 2,the R1 potentiometer will vary the voltage applied to the DADJ pin, thus varying the duty cycle 15% to 85%. With the JU4 shunt on pins 2 and 3, the DADJ pin is grounded.Grounding the DADJ pin fixes the duty cycle at 50%.To use an external DADJ voltage, connect the external voltage source to the DADJ pad and remove the JU4shunt completely. Limit the external DADJ voltage to ±2.3V.E v a l u a t e s : M A X 038MAX038 Evaluation Kit 2_______________________________________________________________________________________Output Buffer The MAX038 output amplitude is fixed at 2V p-p. The MAX038 output is capable of driving a capacitive load up to 90pF. The MAX442 amplifier buffers the MAX038 output to a 50Ωcoaxial cable. The MAX442 is set at a gain of 2V/V, so that the output amplitude remains 1V/V after the 50Ωback termination. The EV kit’s OUT pad provides access to the output of the MAX038 prior to the MAX442 buffer stage. The MAX442 output connects to the BNC connector through a 50Ωresistor to back terminate a 50Ωcoaxial cable. When a terminated 50Ωcable is connected, this resistor forms a voltage divider with the load impedance, which attenuates the signal by one-half. The MAX442 is operated with a 2V/V closed-loop gain to provide unity gain at the 50Ωcable’s output.The MAX442 is actually a 2-channel amplifier. A built-in multiplexer allows either of two input signals to be selected. TTL-level address pin A0 selects either IN0 or IN1. The MAX038 output is connected to MAX442 input IN0. IN1 is unused and connected to ground; it may be used by cutting the JU7 trace, thus discon-necting IN1 from ground. Likewise, the MAX442 address pin A0 can be disconnected from ground by cutting the JU8 trace. Pull up A0 to +5V to select IN1. See the MAX442 data sheet for additional operation details.Reference Voltage The MAX038 includes a 2.5V bandgap reference capa-ble of sourcing 4mA and sinking 100µA. Access to the reference voltage is provided at the REF pad. The ref-erence voltage is primarily used to provide stable cur-rent to IIN and to bias DADJ and FADJ.Extending the OutputFrequency RangeThe components supplied with the EV kit allow an out-put frequency range of 325kHz to 10MHz. The frequen-cy range is controlled primarily by the oscillator capaci-tor (C1) and the input current, which is a function of the reference voltage and potentiometer R3. The resulting frequency range can be shifted up or down dependingon the value of C1. Refer to the Output Frequency vs.Input Current graph which appears in the Typical Operating Characteristics of the MAX038 data sheet.The upper end of the range can be extended by reduc-ing C1. The lower end of the range can be reduced by increasing the value of C1. Take care when selecting alternate capacitors if stable operation over tempera-ture is desired. Ceramic capacitors with low tempera-ture coefficients give the best results. Refer to the Selecting Resistors and Capacitors section of theMAX038 data sheet for further details.Sync Outputand Phase-Detector InputRefer to the SYNC Output and Phase Detector sectionsof the MAX038 data sheet for details of circuit synchro-nization. Access to the Phase Detector Input (PDI) and SYNC is provided at pads PDI and SYNC.High-speed transient currents in DGND and DV+ cancause a switching spike in the output waveform at thezero-crossing point. A lowpass output filter, as shown in Figure 3 of the MAX038 data sheet, may be used to greatly reduce the spike. Complete LC filter assemblies(S3LP series) are available from Coilcraft (phone:708-639-6400). If the SYNC output is not required, dis-abling the SYNC circuit will eliminate the switching spike. Cut the trace between the DV+ and +5V pads to disable the SYNC output.Evaluates: MAX038 MAX038 Evaluation Kit_______________________________________________________________________________________3E v a l u a t e s : M A X 038MAX038 Evaluation Kit 4_______________________________________________________________________________________Figure 1. MAX038 EV Kit SchematicEvaluates: MAX038MAX038 Evaluation Kit_______________________________________________________________________________________5Figure 2. MAX038 EV Kit Component Placement Guide—Component SideE v a l u a t e s : M A X 038MAX038 Evaluation Kit 6_______________________________________________________________________________________Figure 3. MAX038 EV Kit PC Board Layout—Component SideEvaluates: MAX038MAX038 Evaluation Kit_______________________________________________________________________________________7Figure 4. MAX038 EV Kit PC Board Layout—Solder SideE v a l u a t e s : M A X 038MAX038 Evaluation Kit NOTESMaxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.8_____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©1996 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.。
MC3317中文资料
Industrial Temperature Range (– 25°C to +85°C) LM201A 0.075 2.0 10 10 50 1.0 0.5 General Purpose N/626, D/751
Internally Compensated
Commercial Temperature Range (0°C to +70°C) LF351 LF411C MC1436, C MC1741C MC1776C MC3476 MC34001 MC34001B MC34071 MC34071A MC34080B MC34081B MC34181 TL071AC TL071C TL081AC TL081C 200 pA 200 pA 0.04 0.5 0.003 0.05 200 pA 200 pA 0.5 500 nA 200 pA 200 pA 0.1 nA 200 pA 200 pA 200 pA 400 pA 10 2.0 10 6.0 6.0 6.0 10 5.0 5.0 3.0 1.0 1.0 2.0 6.0 10 6.0 15 10 10 12 15 15 15 10 10 10 10 10 10 10 10 10 10 10 100 pA 100 pA 10 200 3.0 25 100 pA 100 pA 75 50 100 pA 100 pA 0.05 50 pA 50 pA 100 pA 200 pA 25 25 70 20 100 50 25 50 25 50 25 25 25 50 25 50 25 4.0 8.0 1.0 1.0 1.0 1.0 4.0 4.0 4.5 4.5 16 8.0 4.0 4.0 4.0 4.0 4.0 13 25 2.0 0.5 0.2 0.2 13 13 10 10 55 30 10 13 13 13 13 ±5.0 +5.0 ±15 ±3.0 ±1.2 ±1.5 ±5.0 ±5.0 +3.0 +3.0 ±5.0 ±5.0 ±2.5 ±5.0 ±5.0 ±5.0 ±5.0 ±18 ±22 ±34 ±18 ±18 ±18 ±18 ±18 +44 +44 ±22 ±22 ±18 ±18 ±18 ±18 ±18 JFET Input JFET Input, Low Offset, Low Drift High Voltage General Purpose µPower, Programmable Low Cost, µPower, Programmable JFET Input JFET Input High Performance Single Supply Decompensated High Speed, JFET Input Low Power, JFET Input Low Noise, JFET Input Low Noise, JFET Input JFET Input JFET Input N/626, D/751 N/626, D/751 P1/626, D/751 P1/626, D/751 P1/626, D/751 P1/626 P/626, D/751 P/626, D/751 P/626, D/751 P/626, D/751 P/626, D/751 P/626, D/751 P/626 P/626 D/751 P/626 D/751
MAX3097EEEE中文资料
General DescriptionThe MAX3097E/MAX3098E feature three high-speed RS-485/RS-422 receivers with fault-detection circuitry and fault-status outputs. The receivers’ inputs have fault thresholds that detect when the part is not in a valid state.The MAX3097E/MAX3098E indicate when a receiver input is in an open-circuit condition, short-circuit condi-tion, or outside the common-mode range. They also generate a fault indication when the differential input voltage goes below a preset threshold. See Ordering Information or the Electrical Characteristics for thresh-old values.The fault circuitry includes a capacitor-programmable delay to ensure that there are no erroneous fault condi-tions even at slow edge rates. Each receiver is capable of accepting data at rates up to 32Mbps.________________________ApplicationsRS-485/RS-422 Receivers for Motor-Shaft EncodersHigh-Speed, Triple RS-485/RS-422 Receiver with Extended Electrostatic Discharge (ESD)Triple RS-485/RS-422 Receiver with Input Fault IndicationTelecommunications Embedded SystemsFeatureso Detects the Following RS-485 Faults:Open-Circuit Condition Short-Circuit ConditionLow Differential Voltage Signal Common-Mode Range Violationo ESD Protection±15kV—Human Body Model±15kV—IEC 1000-4-2, Air-Gap Discharge Method±8kV—IEC 1000-4-2, Contact Discharge Method o Single +3V to +5.5V Operationo -10V to +13.2V Extended Common-Mode Range o Capacitor-Programmable Delay of Fault Indication Allows Error-Free Operation at Slow Data Rates o Independent and Universal Fault Outputs o 32Mbps Data Rateo 16-Pin QSOP is 40% Smaller than Industry-Standard 26LS31/32 SolutionsMAX3097E/MAX3098E±15kV ESD-Protected, 32Mbps, 3V/5V ,T riple RS-422/RS-485Receivers with Fault Detection________________________________________________________________Maxim Integrated Products1Pin ConfigurationTypical Application Circuit19-1727; Rev 0; 7/00For free samples and the latest literature, visit or phone 1-800-998-8800.For small orders, phone 1-800-835-8769.Ordering InformationOrdering Information continued at end of data sheet.M A X 3097E /M A X 3098E±15kV ESD-Protected, 32Mbps, 3V/5V ,T riple RS-422/RS-485Receivers with Fault Detection 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICSStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Supply Voltage (V CC ).............................................................+7V Receiver Input Voltage (A, A , B, B , Z, Z ).............................±25V Output Voltage (OUT_, ALARM_)...............-0.3V to (V CC + 0.3V)DELAY........................................................-0.3V to (V CC + 0.3V)Continuous Power Dissipation (T A = +70°C)16-Pin QSOP (derate 8.3mW/°C above +70°C)............667mW 16-Pin SO (derate 8.7mW/°C above +70°C).................696mW 16-Pin Plastic DIP (derate 10.53mW/°Cabove +70°C).............................................................762mWOperating Temperature RangesMAX3097EC_E...................................................0°C to +70°C MAX3098E_C_E.................................................0°C to +70°C MAX3097E_E_E..............................................-40°C to +85°C MAX3098E_E_E..............................................-40°C to +85°C Storage Temperature Range.............................-65°C to +150°C Junction Temperature......................................................+150°C Lead Temperature (soldering, 10s).................................+300°CMAX3097E/MAX3098E±15kV ESD-Protected, 32Mbps, 3V/5V ,T riple RS-422/RS-485Receivers with Fault Detection_______________________________________________________________________________________3SWITCHING CHARACTERISTICSIN Note 3:A differential terminating resistor is required for proper function of open-circuit fault detection (see Applications Information ).Note 4:See Applications Information for a discussion of the receiver common-mode voltage range and the operating conditions for fault indication.Note 5:Applies to the individual channel immediate-fault outputs (ALARM_) and the general delayed-fault output (ALARMD) whenthere is no external capacitor at DELAY.Note 6:Equivalent pulse test: 1.3V / (t DFLH - t DFHL ) ≥SR D .Note 7:Equivalent pulse test: 0.62V / (t DFLH - t DFHL ) ≥SR D .DELAYED ALARM OUTPUTM A X 3097E /8E t o c 0620µs/divCH 1CH 2CH 3GNDGNDGNDCH1: V A , 5V/divCH2: V ALARMA , 5V/div CH3: V ALARMD , 5V/div V = GND, C DELAY = 270pFM A X 3097E /M A X 3098E±15kV ESD-Protected, 32Mbps, 3V/5V ,T riple RS-422/RS-485Receivers with Fault Detection 4_______________________________________________________________________________________Typical Operating Characteristics(Typical values are at V CC = +5V and T A = +25°C.)110010100010,000110010100010,000ALARMD OUTPUT DELAY vs. CAPACITANCECAPACITANCE (pF)A L A R M D O U T P U T D E L A Y (µs )3040506070-40-20204060RECEIVER PROPAGATION DELAYvs. TEMPERATURETEMPERATURE (°C)R E C E I V E R P R O P A G A T I O N D E L A Y (n s )8013245SUPPLY CURRENT vs. TEMPERATURES U P P L Y C U R R E N T (m A )-40-20204060TEMPERATURE (°C)800.51.01.52.02.53.53.04.54.05.0-45-35-40-30-25-20-15-10-5RECEIVER OUTPUT LOW VOLTAGEvs. OUTPUT CURRENTOUTPUT CURRENT (mA)O U T P U T L O W V O L T A G E (V )0124356010515203025RECEIVER OUTPUT HIGH VOLTAGEvs. OUTPUT CURRENTOUTPUT CURRENT (mA)O U T P U T H I G H V O L T A G E (V )MAX3097E/MAX3098E±15kV ESD-Protected, 32Mbps, 3V/5V ,T riple RS-422/RS-485Receivers with Fault Detection_______________________________________________________________________________________5CH 3CH 2GND CH 1COMMON-MODE VOLTAGE FAULT(HIGH SIDE)M A X 3097E /8E t o c 07a2ms/divCH1: V A + AC(60Hz), 10V/div CH2: V OUTA , 5V/div CH3: V ALARMA , 5V/div V CC = 3VGND GNDCOMMON-MODE VOLTAGE FAULT(LOW SIDE)M A X 3097E /8E t o c 07bCH 3CH 2GND CH 12ms/divCH1: V A + AC(60Hz), 10V/div CH2: V OUTA , 5V/div CH3: V ALARMA , 5V/div V CC = 3VGND GNDTypical Operating Characteristics (continued)(Typical values are at V CC = +5V and T A = +25°C.)MAX3097ELOW DIFFERENTIAL INPUT FAULTM A X 3097E /8E t o c 08CH 2GNDGNDCH 1100µs/divCH1: V A , 200mV/div CH2: V ALARMA , 5V/div V = GNDSLEW-RATE FAULTM A X 3097E /8E t o c 09CH 2GNDGNDCH 1CH1: V A , 5V/divCH2: V ALARMA , 5V/div SLEW RATE = 0.05V/µs V A = GND-8-440812-100-5510FAULT-DETECTION RECEIVER DIFFERENTIALTHRESHOLD VOLTAGE SHIFT vs.COMMON-MODE VOLTAGE (V)T H R E S H O L D S H I F T (m V )M A X 3097E /M A X 3098E±15kV ESD-Protected, 32Mbps, 3V/5V ,T riple RS-422/RS-485Receivers with Fault Detection 6_______________________________________________________________________________________MAX3097E/MAX3098E±15kV ESD-Protected, 32Mbps, 3V/5V ,T riple RS-422/RS-485Receivers with Fault Detection_______________________________________________________________________________________7Figure 1. Typical Receiver Test CircuitFigure 2. Propagation DelayFigure 3. Fault-Detection TimingFigure 4. Common-Mode Fault Propagation DelayTest Circuits and WaveformsDetailed DescriptionThe MAX3097E/MAX3098E feature high-speed, triple RS-485/RS-422 receivers with fault-detection circuitry and fault-status outputs. The fault outputs are active push-pull, requiring no pull-up resistors. The fault cir-cuitry includes a capacitor-programmable delayed FAULT_ output to ensure that there are no erroneous fault conditions even at slow edge rates (see Delayed Fault Output ). The receivers operate at data rates up to 32Mbps.The MAX3097E/MAX3098E are designed for motor-shaft encoders with standard A, B, and Z outputs (see Using the M AX3097E/M AX3098E as Shaft Encoder Receivers ). The devices provide an alarm for open-cir-cuit conditions, short-circuit conditions, data nearing the minimum differential threshold conditions, data below the minimum threshold conditions, and receiver inputs outside the input common-mode range. Tables 1and 2 are functional tables for each receiver.M A X 3097E /M A X 3098E±15kV ESD-Protected, 32Mbps, 3V/5V ,T riple RS-422/RS-485Receivers with Fault Detection 8_______________________________________________________________________________________Note 1:ALARMD indicates fault for any receiver.Note 2:Receiver output may oscillate with this differential input condition.Note 3:See Applications Information for conditions leading to input range fault condition.X = Don ’t careNote 1:ALARMD indicates fault for any receiver.Note 2:Receiver output may oscillate with this differential input condition.Note 3:See Applications Information for conditions leading to input range fault condition.X = Don ’t care; for B-grade functionality, replace V ID input values in Table 2 with B-grade parameters from Electrical Characteristics.MAX3097E/MAX3098E±15kV ESD-Protected, 32Mbps, 3V/5V ,T riple RS-422/RS-485Receivers with Fault Detection_______________________________________________________________________________________9±15kV ESD ProtectionAs with all Maxim devices, ESD-protection structures are incorporated on all pins to protect against ESD encountered during handling and assembly. The MAX3097E/MAX3098E receiver inputs have extra pro-tection against static electricity found in normal opera-tion. Maxim ’s engineers developed state-of-the-art structures to protect these pins against ±15kV ESD without damage. After an ESD event, the MAX3097E/MAX3098E continue working without latchup.ESD protection can be tested in several ways. The receiver inputs are characterized for protection to the following:•±15kV using the Human Body Model•±8kV using the Contact Discharge method specified in IEC 1000-4-2 (formerly IEC 801-2)•15kV using the Air-Gap Discharge method specified in IEC 1000-4-2 (formerly IEC 801-2)ESD Test ConditionsESD performance depends on a number of conditions.Contact Maxim for a reliability report that documents test setup, methodology, and results.Human Body ModelFigure 5a shows the H uman Body Model, and Figure 5b shows the current waveform it generates when dis-charged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of inter-est, which is then discharged into the device through a 1.5k Ωresistor.IEC 1000-4-2Since January 1996, all equipment manufactured and/or sold in the European community has been required to meet the stringent IEC 1000-4-2 specification. The IEC 1000-4-2 standard covers ESD testing and performance of finished equipment; it does not specifically refer to inte-grated circuits. The MAX3097E/MAX3098E help you design equipment that meets Level 4 (the highest level)of IEC 1000-4-2, without additional ESD-protection com-ponents.The main difference between tests done using the H uman Body Model and IEC 1000-4-2 is higher peak current in IEC 1000-4-2. Because series resistance is lower in the IEC 1000-4-2 ESD test model (Figure 6a), the ESD-withstand voltage measured to this standard is gen-erally lower than that measured using the Human Body Model. Figure 6b shows the current waveform for the ±8kV IEC 1000-4-2 Level 4 ESD Contact Discharge test.The Air-Gap test involves approaching the device with a charge probe. The Contact Discharge method connects the probe to the device before the probe is energized.Machine ModelThe Machine Model for ESD testing uses a 200pF stor-age capacitor and zero-discharge resistance. It mimics the stress caused by handling during manufacturing and assembly. All pins (not just RS-485 inputs) require this protection during manufacturing. Therefore, the Machine Model is less relevant to the I/O ports than are the Human Body Model and IEC 1000-4-2.Figure 5a. Human Body ESD Test ModelFigure 5b. Human Body Model Current Waveform___________Applications InformationUsing the MAX3097E/MAX3098E as ShaftEncoder ReceiversThe MAX3097E/MAX3098E are triple RS-485 receivers designed for shaft encoder receiver applications. A shaft encoder is an electromechanical transducer that converts mechanical rotary motion into three RS-485differential signals. Two signals, A (A and A) and B (B and B) provide incremental pulses as the shaft turns,while the index signal, Z (Z and Z) occurs only once per revolution to allow synchronization of the shaft to a known position. Digital signal processing (DSP) tech-niques are used to count the pulses and provide feed-back of both shaft position and shaft velocity for a stable positioning system.Shaft encoders typically transmit RS-485 signals over twisted-pair cables since the signal often has to travel across a noisy electrical environment (Figure 7).Detecting FaultsSignal integrity from the shaft encoder to the DSP is essential for reliable system operation. Degraded sig-nals could cause problems ranging from simple mis-counts to loss of position. In an industrial environment,many problems can occur within the three twisted pairs. The MAX3097E/MAX3098E can detect various types of common faults, including a low-input-level sig-nal, open-circuit wires, short-circuit wires, and an input signal outside the common-mode input voltage range of the receiver.Detecting Short CircuitsIn Figure 8, if wires A and A are shorted together, then A and A will be at the same potential, so the difference in the voltage between the two will be approximately 0. This causes fault A to trigger since the difference between A -A is less than the differential fault threshold.Detecting Open-Circuit ConditionsDetecting an open-circuit condition is similar to detect-ing a short-circuit condition and relies on the terminat-ing resistor being across A and A . For example, if the wire drops out of the A terminal, A pulls A through the terminating resistor to look like the same signal. In this condition, V ID is approximately 0 and a fault occurs.M A X 3097E /M A X 3098E±15kV ESD-Protected, 32Mbps, 3V/5V ,T riple RS-422/RS-485Receivers with Fault Detection 10______________________________________________________________________________________Figure 7. Typical Shaft Encoder OutputFigure 6a. IEC 1000-4-2 ESD Test ModelFigure 6b. IEC 1000-4-2 ESD Generator Current WaveformMAX3097E/MAX3098E±15kV ESD-Protected, 32Mbps, 3V/5V ,T riple RS-422/RS-485Receivers with Fault Detection______________________________________________________________________________________11Common-Mode RangeThe MAX3097E/MAX3098E contain circuitry that de-tects if the input stage is going outside its useful com-mon-mode range. If the received data could be unreliable, a fault signal is triggered.Detecting Low Input DifferentialDue to cable attenuation on long wire runs, it is possi-ble that V ID < 200mV, and incorrect data will be received. In this condition, a fault will be indicated.Delayed Fault OutputThe delayed fault output provides a programmable blanking delay to allow transient faults to occur without triggering an alarm. Such faults may occur with slow signals triggering the receiver alarm through the zero crossover region.Figure 9 shows the delayed alarm output.ALARMD performs a logic OR of ALARMA, ALARMB,and ALARMZ (Figure 10). A NOR gate drives an N-channel MOSFET so that in normal operation with no faults, the current source (10µA typ) is shunted toground. Upon activation of any alarm from receiver A,B, or Z, the MOSFET is turned off, allowing the current source to charge C DELAY . When V DELAY exceeds the DELAY threshold, the comparator output, ALARMD,goes high. ALARMD is reset when all receiver alarms go low, quickly discharging C DELAY to ground.Setting Delay TimeALARMD ’s delay time is set with a single capacitor connected from DELAY to GND. The delay comparator threshold varies with supply voltage, and the C DELAY value can be determined for a given time delay period from the Capacitance vs. ALARMD Output Delay graph in the Typical Operating Characteristics or using the following equations:t D = 15 + 0.33 x C DELAY (for V CC = 5V)andt D = 10 + 0.187 x C DELAY (for V CC = 3V)where t D is in µs and C DELAY is in pF.M A X 3097E /M A X 3098E±15kV ESD-Protected, 32Mbps, 3V/5V ,T riple RS-422/RS-485Receivers with Fault Detection 12______________________________________________________________________________________Chip InformationTRANSISTOR COUNT: 675PROCESS: CMOSMAX3097E/MAX3098E±15kV ESD-Protected, 32Mbps, 3V/5V ,T riple RS-422/RS-485Receivers with Fault Detection______________________________________________________________________________________13Package InformationM A X 3097E /M A X 3098E±15kV ESD-Protected, 32Mbps, 3V/5V ,T riple RS-422/RS-485Receivers with Fault Detection 14______________________________________________________________________________________Package Information (continued)MAX3097E/MAX3098E±15kV ESD-Protected, 32Mbps, 3V/5V ,T riple RS-422/RS-485Receivers with Fault Detection______________________________________________________________________________________15Package Information (continued)M A X 3097E /M A X 3098E±15kV ESD-Protected, 32Mbps, 3V/5V ,T riple RS-422/RS-485Receivers with Fault Detection M axim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a M axim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.16____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©2000 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.NOTES。
33977资料
Freescale Semiconductor, Inc. reserves the right to change the detail specifications, as may be required, to permit improvements in the design of its products.Document Number: MC33977Rev. 2.0, 1/2007Freescale Semiconductor Technical Data© Freescale Semiconductor, Inc., 2007. All rights reserved.Single Gauge DriverThe 33977 is a Serial Peripheral Interface (SPI) Controlled, stepper motor gauge driver Integrated Circuit (IC). This monolithic IC consists of a dual H-Bridge coil driver and its associated control logic. The H-Bridge drivers are used to automatically control the speed, direction, and magnitude of current through the coils of a two-phaseinstrumentation stepper motor, similar to an MMT-licensed AFIC 6405 of Switec MS-X156.xxx motor.The 33977 is ideal for use in instrumentation systems requiring distributed and flexible stepper motor gauge driving. The device also eases the transition to stepper motors from air core motors by emulating the damped air core pointer movement. Features •MMT-Licensed Two-Phase Stepper Motor Compatible •Switec MS-X15.xxx Stepper Motor Compatible •Minimal Processor Overhead Required•Fully Integrated Pointer Movement and Position State Machine with Air Core Movement Emulation•4096 Possible Steady State Pointer Positions •340° Maximum Pointer Sweep •Maximum Acceleration of 4500°/s 2•Maximum Pointer Velocity of 400°/s•Analog Microstepping (12 Steps/Degrees of Pointer Movement)•Pointer Calibration and Return to Zero (RTZ)•Controlled via 16-Bit SPI Messages •Internal Clock Capable of Calibration •Low Sleep Mode Current•Pb-Free Packaging Designated by suffix code EGFigure 1. 33977 Simplified Application DiagramORDERING INFORMATIONDevice Temperature Range (T A )PackageMC33977DW/R2- 40°C to 125°C24 SOICWMCZ33977EG/R233977SINGLE GAUGE DRIVERAnalog Integrated Circuit Device Data33977INTERNAL BLOCK DIAGRAMINTERNAL BLOCK DIAGRAMFigure 2. 33977 Simplified Internal Block DiagramH-BRIDGE COS+INTERNAL VPWRVDDCOSCOS-REGULATORLOGICSPIILIMOVERTEMPERATUREAND CONTROLSINOSCILLATORDETECTUNDER -ANDOVERVOLTAGE DETECTCS SCLK SO SIRSTRTZSIN+SIN-GND (8)MULTIPLEXERSIGMA-DELTAADCAGNDSTATE MACHINEVDDAnalog Integrated Circuit Device Data 33977PIN CONNECTIONSPIN CONNECTIONSFigure 3. 33977 Pin ConnectionsTable 1. 33977 Pin DefinitionsA functional description of each pin can be found in the Functional Pin Description section beginning onpage 10.PinPin Name Pin Function Formal Name Definition1234(MS Motor Pin #)COS+ (MS #4)COS- (MS #3)SIN+ (MS #1)SIN- (MS #2)OutputH-Bridge Outputs 0Each pin is the output of a half-bridge, designed to source or sink current.5 to 8, 17 to 20GND N/A Ground Ground pins9CS Input Chip Select This pin is connected to a chip select output of a Large Scale Integration (LSI) Master IC and controls which device is addressed.10SCLK Input Serial Clock This pin is connected to the SCLK pin of the master device and acts as a bit clock for the SPI port.11SOOutput Serial Output This pin is connected to the SPI Serial Data Input pin of the Master device or to the SI pin of the next device in a daisy chain.12SIInput Serial Input This pin is connected to the SPI Serial Data Output pin of the Master device from which it receives output command data.13RTZ Multiplexed Output Return to ZeroThis is a multiplexed output pin for the non-driven coil, during a Return to Zero (RTZ) event.14VDD Input Voltage This SPI and logic power supply input will work with 5.0 V supplies. 15RSTInputResetThis pin is connected to the Master and is used to reset the device, or place it into a sleep state by driving it to Logic [1]. When this pin is driven to Logic [0], all internal logic is forced to the default state. This input has an internal active pull-up. 16VPWRInput Battery Voltage Power supply21, 22, 23, 24NC–No ConnectThese pins are not connected to any internal circuitry, or any other pin, and may be connected to the board where convenient.NC NC NC NC GND GND GND GND VPWR RST VDD RTZCOS +COS -SIN+SIN-GND GND GND GND CS SCLK SO SIAnalog Integrated Circuit Device Data33977ELECTRICAL CHARACTERISTICS MAXIMUM RATINGSELECTRICAL CHARACTERISTICSMAXIMUM RATINGSTable 2. Maximum RatingsAll voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device.RatingsSymbolValueUnitELECTRICAL RATINGS Power Supply Voltage Steady-State V PWRSS-0.3 to 41VInput Pin Voltage (1)V IN -0.3 to 7.0V SIN± COSI± Continuous Current Per Output (2)I OUTMAX 40mA ESD Voltage (3)Human Body Model (HBM) Machine Model (MM)Charge Device Model (CDM)V ESD±2000 ±2000±200V THERMAL RATINGS Operating Temperature Ambient JunctionT A T J -40 to 125-40 to 150°CStorage Temperature T STG-55 to 150°C Thermal Resistance Junction-to-Ambient Junction-to-LeadR ΘJA R ΘJL 6020°C/W Peak Package Reflow Temperature During Reflow (4), (5)T PPRTNote 5°CNotes1.Exceeding voltage limits on Input pins may cause permanent damage to the device.2.Output continuous output rating so long as maximum junction temperature is not exceeded. Operation at 125°C ambient temperaturewill require maximum output current computation using package thermal resistances.3.ESD testing is performed in accordance with the Human Body Model (HBM) (C ZAP = 100 pF, R ZAP = 1500 Ω), the Machine Model (MM)(C ZAP = 200 pF, R ZAP = 0 Ω), and the Charge Device Model (CDM).4.Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device.5.Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL),Go to , search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.Analog Integrated Circuit Device Data 33977ELECTRICAL CHARACTERISTICSSTATIC ELECTRICAL CHARACTERISTICSSTATIC ELECTRICAL CHARACTERISTICSTable 3. Static Electrical CharacteristicsCharacteristics noted under conditions 4.75 V < VDD < 5.25 V, and - 40°C < TA < 125°C, unless otherwise noted. Typical values noted reflect the approximate parameter means at T A = 25°C under nominal conditions unless otherwise noted.CharacteristicSymbol Min Typ Max UnitPOWER INPUT (VDD)Battery Supply Voltage Range Fully Operational Limited Operation (6),(7)V PWR6.54.0–2626VV PWR Supply CurrentGauge Outputs ON, No Output Loads I PWR–4.06.0mAVPWR Supply Current (All Outputs Disabled)Reset = Logic [0], V DD = 5.0 V Reset = Logic [0], V DD = 0 V I PWRSLP1I PWRSLP2––42156025µAOvervoltage Detection Level (8)V PWROV 263238V Undervoltage Detection Level (9)V PWRUV 5.0 5.6 6.2V Logic Supply Voltage Range (5.0 V Nominal Supply)V DD 4.5 5.0 5.5V Under V DD Logic Reset V DDUV––4.5VVDD Supply Current Sleep: Reset Logic [0]Outputs EnabledI DDOFF I DDON––401.0651.8µV mAPOWER OUTPUT (SIN-, SIN+, COS-, COS+)Microstep Output (Measured Across Coil Outputs)SIN± (COS±) (Refer to Pin Definitions onpage 3)R OUT = 200 Ω, PE6 = 0VSteps Pin Definitions 6, 18, 0, 125, 7, 17, 19 1, 11, 13, 234, 8, 16, 20 2, 10, 14, 223, 9, 15, 21 3, 9, 15, 212, 10, 14, 22 5, 7, 17, 191, 11, 13, 23 5, 7, 17, 190, 126, 18V ST6V ST5V ST4V ST3V ST2V ST1V ST0 4.820.94 V ST60.84 V ST60.68 V ST60.47 V ST60.23 V ST60.15.30.97 V ST60.87 V ST60.71 V ST60.50 V ST60.26 V ST60.06.01.0 V ST60.96 V ST60.8 V ST60.57 V ST60.31 V ST60.1Full Step Active Output (Measured Across Coil Outputs) (10)SIN± (COS±), Steps 1,3 (Pin Definitions 0 and 2)V FS4.95.36.0V Notes6.Outputs and logic remain active; however, the larger coil voltage levels may be clipped. The reduction in drive voltage may result in aloss of position control.7.The logic will reset at some level below the specified Limited Operational minimum.8.Outputs will disable and must be re-enabled via the PECCR command.9.Outputs remain active; however, the reduction in drive voltage may result in a loss of position control.10.See Figure 7.Analog Integrated Circuit Device Data33977ELECTRICAL CHARACTERISTICSSTATIC ELECTRICAL CHARACTERISTICSPOWER OUTPUT (SIN-, SIN+, COS-, COS+) (Continued)Microstep Full Step Output (Measured from Coil Low Side to Ground)SIN± (COS±) I OUT = 30 mA V LS0.00.10.3VOutput Flyback Clamp (11)V FB –V ST6 + 0.5V ST6 + 1.0V Output Current Limit (Output - V ST6)I LIM 40100170mA Overtemperature Shutdown (12) T SD 155–180°C Overtemperature Hysteresis (12)T HYST 8.0–16°C CONTROL I/O (SI, SCLK, CS, RST, SO)Input Logic High Voltage (12)V IH 2.0––V Input Logic Low Voltage (12)V IL ––0.8V Input Logic Voltage Hysteresis (12)V INHYST –100–mV Input Logic Pull-Down Current (SI, SCLK)I DWN 3.0–20µA Input Logic Pull-Up Current (CS, RST)I UP 5.0–20µA SO High State Output Voltage (I OH = 1.0 mA)V SOH 0.8 V DD––V SO Low State Output Voltage (I OL = 1.6 mA)V SOL –0.20.4V SO Tri-State Leakage Current (CS = 3.5 V)I SOLK -5.00.0 5.0µA Input Capacitance (13)C IN – 4.012pF SO Tri-State Capacitance (13)C SO––20pFANALOG TO DIGITAL CONVERTER (RTZ ACCUMULATOR COUNT)ADC Gain (12), (14)G ADC100188270Counts/V/msNotes 11.Outputs remain active; however, the reduction in drive voltage may result in a loss of position control.12.This parameter is guaranteed by design; however, it is not production tested.13.Capacitance not measured. This parameter is guaranteed by design; however, it is not production tested. 14.Reference RTZ Accumulator (Typical) on page 30Table 3. Static Electrical Characteristics (continued)Characteristics noted under conditions 4.75 V < VDD < 5.25 V, and - 40°C < TA < 125°C, unless otherwise noted. Typical values noted reflect the approximate parameter means at T A = 25°C under nominal conditions unless otherwise noted.CharacteristicSymbolMinTypMaxUnitAnalog Integrated Circuit Device Data 33977ELECTRICAL CHARACTERISTICSDYNAMIC ELECTRICAL CHARACTERISTICSDYNAMIC ELECTRICAL CHARACTERISTICSTable 4. Dynamic Electrical CharacteristicsCharacteristics noted under conditions 4.75 V < VDD < 5.25 V, and - 40°C < TA < 125°C, unless otherwise noted. Typical values noted reflect the approximate parameter means at T A = 25°C under nominal conditions unless otherwise noted.CharacteristicSymbol Min Typ Max UnitPOWER OUTPUT AND CLOCK TIMINGS (SIN+, SIN-, COS+, COS-) CS SIN± (COS±) Output Turn ON Delay Time (Time from Rising CS Enabling Outputs to Steady State Coil Voltages and Currents)(15)t DLYON––1.0msSIN± (COS±) Output Turn OFF Delay Time (Time from Rising CS Disables Outputs to Steady State Coil Voltages and Currents) (15)t DLYOFF–– 1.0msUncalibrated Oscillator Cycle Time t CLU 0.651.01.7µs Calibrated Oscillator Cycle TimeCalibration Pulse = 8.0 µs, PECCR D4 = Logic [0]Calibration Pulse = 8.0 µs, PECCR D4 = Logic [1]t CLC1.00.91.11.0 1.21.1µsMaximum Pointer Speed (16) V MAX ––400°/s Maximum Pointer Acceleration (16)A MAX––4500°/s 2SPI INTERFACE TIMING (CS, SCLK, SO, SI, RST) (17)Recommended Frequency of SPI Operationf SPI – 1.0 2.0MHz Falling Edge of CS to Rising Edge of SCLK (Required Setup Time) (18)t LEAD 167––ns Falling Edge of SCLK to Rising Edge of CS (Required Setup Time) (18)t LAG 167––ns SI to Falling Edge of SCLK (Required Setup Time) (18)t SISU –2583ns Falling Edge of SCLK to SI (Required Hold Time) (18)t SIHOLD –2583ns SO Rise Time C L = 200 pF t RSO–2550nsSO Fall Time C L = 200 pFt FSO–2550nsSI, CS, SCLK, Incoming Signal Rise Time (19)t RSI ––50ns SI, CS, SCLK, Incoming Signal Fall Time (19)t FIS ––50ns Falling Edge of RST to Rising Edge of RST (Required Setup Time) (18)t W RST –– 3.0µs Rising Edge of CS to Falling Edge of CS (Required Setup Time) (18), (20)t CS –– 5.0µs Falling Edge of RST to Rising Edge of CS (Required Setup Time) (18)t EN––5.0µsNotes15.Maximum specified time for the 33977 is the minimum guaranteed time needed from the microcontroller.16.The minimum and maximum value will vary proportionally to the internal clock tolerance. These numbers are based on an ideallycalibrated clock frequency of 1.0 MHz. These are not 100 percent tested.17.The 33977 shall meet all SPI interface timing requirements specified in the SPI Interface Timing section of this table, over the specifiedtemperature range. Digital interface timing is based on a symmetrical 50 percent duty cycle SCLK Clock Period of 33 ns. The device shall be fully functional for slower clock speeds. Reference Figure 4 and 5.18.The required setup times specified for the 33977 are the minimum time needed from the microcontroller to guarantee correct operation. 19.Rise and Fall time of incoming SI, CS, and SCLK signals suggested for design consideration to prevent the occurrence of double pulsing. 20.The value is for a 1.0 MHz calibrated internal clock. The value will change proportionally as the internal clock frequency changes.Analog Integrated Circuit Device Data33977ELECTRICAL CHARACTERISTICSDYNAMIC ELECTRICAL CHARACTERISTICSSPI INTERFACE TIMING (CS, SCLK, SO, SI, RST) ‘ (CONTINUED)Time from Falling Edge of CS to SO Low Impedance (22)t SOEN ––145ns Time from Falling Edge of CS to SO High Impedance (23)t SODIS –1.34.0µs Time from Rising Edge of SCLK to SO Data Valid (24)0.2 V DD = SO = 0.8 V DD , C L = 200 pFt VALID–90150nsNotes21.The 33977 shall meet all SPI interface timing requirements specified in the SPI Interface Timing section of this table, over the specifiedtemperature range. Digital interface timing is based on a symmetrical 50 percent duty cycle SCLK Clock Period of 33 ns. The device shall be fully functional for slower clock speeds.22.Time required for output status data to be terminated at SO 1.0 k Ω load on SO.23.Time required for output status data to be available for use at SO 1.0 k Ω load on SO.24.Time required to obtain valid data out from SO following the rise of SCLK.Table 4. Dynamic Electrical Characteristics (continued)Characteristics noted under conditions 4.75 V < VDD < 5.25 V, and - 40°C < TA < 125°C, unless otherwise noted. Typical values noted reflect the approximate parameter means at T A = 25°C under nominal conditions unless otherwise noted.CharacteristicSymbolMinTypMaxUnitAnalog Integrated Circuit Device Data 33977ELECTRICAL CHARACTERISTICSTIMING DIAGRAMSTIMING DIAGRAMSFigure 4. Input Timing Switching CharacteristicsFigure 5. Valid Data Delay Time and Valid Time WaveformstWRSTRST0.2 V DDV INCSSCLKSI0.7 V DD0.7 V DDt LEAD t CSt LAG0.7 V DD 0.2 V DDt RSIV ILV IH V ILV IH t FISt SISUt SI(HOLD)0.7 V DD 0.2 V DDValidDon’t CareValidDon’t CareDon’t Caret RSIt FISSCLK50%1.0VV OLV OH3.5VV OLV OHV OLV OHt SO(DIS)0.2 V DDt RSOt RSO t VALIDt SO(EN)0.7 V DD0.2 V DD0.7 V DDLow-to-HighHigh-to-LowSOSOAnalog Integrated Circuit Device Data33977FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTIONFUNCTIONAL DESCRIPTIONINTRODUCTIONThis 33977 is a single-packaged, Serial PeripheralINterface (SPI) controlled, single stepper motor gauge driver integrated circuit (IC). This monolithic stepper IC consists of [deleted two per D. Mortensen] a dual output H-Bridge coil driver [deleted plural s for accurate tense] and theassociated control logic. The dual H-Bridge driver is used to automatically control the speed, direction, and magnitude of current through the coils of a two-phase instrumentation stepper motor, similar to an MMT-licensed AFIC 6405 of Switec MS-X 156.xxx motor.FUNCTIONAL PIN DESCRIPTIONCOSINE POSITIVE (COS0+)The H-Bridge pins linearly drive the sine and cosine coils of a stepper motor, providing four-quadrant operation.COSINE NEGATIVE (COS0-)The H-Bridge pins linearly drive the sine and cosine coils of a stepper motor, providing four-quadrant operation.SINE POSITIVE (SIN+)The H-Bridge pins linearly drive the sine and cosine coils of a stepper motor, providing four-quadrant operation.SINE NEGATIVE (SIN-)The H-Bridge pins linearly drive the sine and cosine coils of a stepper motor, providing four-quadrant operation.GROUND (GND)Ground pins.CHIP SELECT (CS)The pin enables communication with the master device. When this pin is in a logic [0] state, the 33977 is capable of transferring information to, and receiving information from, the master. The 33977 latches data in from the Input Shift registers to the addressed registers on the rising edge of CS.The output driver on the SO pin is enabled when CS is logic [0]. When CS is logic high, signals at the SCLK and SI pins are ignored and the SO pin is tri-stated (highimpedance). CS will only be transitioned from a logic [1] state to a logic [0] state when SCLK is logic [0]. CS has an internal pull-up (I UP ) connected to the pin, as specified in the section of the Static Electrical Characteristics Table.SERIAL CLOCK (SCLK)SCLK clocks the Internal Shift registers of the 33977device. The SI pin accepts data into the Input Shift register on the falling edge of the SCLK signal, while the Serial Output pin (SO) shifts data information out of the SO Line Driver on the rising edge of the SCLK signal. It is important that the SCLK pin be in a logic [0] state whenever the CS makes any transition.SCLK has an internal pull down (l DWN ), as specified in the section of the Static Electrical Characteristics Table. When CS is logic [1], signals at the SCLK and SI pins are ignored and SO is tri-stated (high impedance). Refer to the data transfer Timing Diagrams on page 9.SERIAL OUTPUT (SO)The SO data pin is a tri-stateable output from the Shift register. The Status register bits are the first 16 bits shifted out. Those bits are followed by the message bits clocked in FIFO, when the device is in a daisy chain connection or being sent words that are multiples of 16 bits. Data is shifted on the rising edge of the SCLK signal. The SO pin will remain in a high impedance state until the CS pin is put into a logic low state.SERIAL INPUT (SI)The SI pin is the input of the SPI. Serial input information is read on the falling edge of SCLK. A 16-bit stream of serial data is required on the SI pin, beginning with the mostsignificant bit (MSB). Messages that are not multiples of 16 bits (e.g., daisy chained device messages) are ignored. After transmitting a 16-bit word, the CS pin must be de-asserted (logic [1]) before transmitting a new word. SI information is ignored when CS is in a logic high state.RETURN TO ZERO (RTZ)This is a multiplexed output pin for the non-driven coil, during a Return to Zero (RTZ) event.VOLTAGE (VDD)The SPI and logic power supply input will work with 5.0 V supplies.RESET (RST)If the master decides to reset the device, or place it into a sleep state, the RST pin is driven to a Logic [0]. A Logic [0] on the RST pin forces all internal logic to the known default state. This input has an internal active pull-up.VOLTAGE POWER (VPWR)This is the power supply pin.FUNCTIONAL DESCRIPTIONFUNCTIONAL INTERNAL BLOCK DESCRIPTION (OPTIONAL) FUNCTIONAL INTERNAL BLOCK DESCRIPTION (OPTIONAL)Figure 6. Functional Internal 33977 Block IllustrationSERIAL PERIPHERAL INTERFACE (SPI) This circuitry manages incoming messages and outgoing status data.LOGICThis design element includes internal logic including state machines and message decoding.INTERNAL REFERENCEThis design element is used for step value levels.UNDER AND OVERVOLTAGE DETECTION This design element detects when V PWR is out of the normal operating range.OSCILLATORThe internal oscillator generates the internal clock for all timing critical features.H-BRIDGE AND CONTROLThis circuitry contains the output coil drivers and the multiplexers necessary for four quadrant operation and RTZ sequencing. This circuitry is repeated for the Sine and Cosine coils.•Overtemperature — Each output includes an overtemperature sensing circuit•ILIM — Each output is current limitedRETURN TO ZERO (RTZ)This circuitry outputs the voltage present on the non-driven coil during RTZ operation.SPI LogicUnder andOscillator OvervoltageDetectH-Bridge and Control Internal ReferenceRTZFUNCTIONAL DEVICE OPERATIONOPERATIONAL MODESFUNCTIONAL DEVICE OPERATIONOPERATIONAL MODESSTATE MACHINE OPERATIONThe 33977 is ideal for use in instrumentation systemsrequiring distributed and flexible stepper motor gauge driving.The device also eases the transition to stepper motors fromair core motors by emulating the air core pointer movementwith little additional processor bandwidth utilization. The two-phase stepper motor has maximum allowable velocities andacceleration and deceleration. The purpose of the steppermotor state machine is to drive the motor with the maximumperformance while remaining within the motor’s voltage,velocity, and acceleration constraints.A requirement of the state machine is to ensure thedeceleration phase begins at the correct time and pointerposition. When commanded, the motor [will deleted PV]accelerates constantly to the maximum velocity, and then itmoves toward the commanded position at the maximumvelocity. Eventually, the pointer reaches the calculatedlocation where the movement has to decelerate, safelyslowing to a stop at the desired position. During thedeceleration phase, the motor does [will deleted PV] notexceed the maximum deceleration.During normal operation, both stepper motor rotors aremicrostepped at 24 steps per electrical revolution, illustratedin Figure 7. A complete electrical revolution results in twodegrees of pointer movement. There is a second smaller[parentheses removed-unnecessary] state machine in the ICcontrolling these microsteps. The smaller state machinereceives clockwise or counter-clockwise index commands attimed intervals, thereby stepping the motor in the appropriatedirection by adjusting the current in each coil. Normalizedvalues are provided in Table 5.Figure 7. Clockwise MicrostepsTable 5. Coil Step ValueStep Angle SINE(Angle)*COS (Angle -30)*PE6=0COS (Angle -30)*PE6=100.00.0 1.00.866 1150.2590.9650.966 2300.50.866 1.0 3450.7070.7070.966 4600.8660.50.866 5750.9660.2590.707 690 1.00.00.500 71050.966-0.2590.259 81200.866-0.50.0 91350.707-0.707-0.259 101500.5-0.866-0.500FUNCTIONAL DEVICE OPERATIONOPERATIONAL MODESThe motor is stepped by providing index commands at intervals. The time between steps defines the motor velocity and the changing time defines the motor acceleration.The state machine uses a table to define the allowed time and the maximum velocity. A useful side effect of the table is that it also allows the direct determination of the position at which the velocity should reduce to stop the motor at the desired position.Motor motion equations follow: [reworded for efficient use of space](The units of position are steps and velocity and acceleration are in steps/second and steps/second2.) From an initial position of 0 with an initial velocity (u), the motor position (s) at a time (t) is:For unit steps, the time between steps is:This defines the time increment between steps when the motor is initially traveling at a velocity u. In the ROM, this time is quantized to multiples of the system clock by rounding upwards, ensuring acceleration never exceeds the allowed value. The actual velocity and acceleration is calculated from the time step actually used. Using:andand solving for v in terms of u, s, and t gives:The correct value of t to use in the equation is thequantized value obtained above.From these equations, a set of recursive equations can be generated to give the allowed time step between motor indexes when the motor is accelerating from a stop to its maximum velocity.Starting from a position p of 0 and a velocity v of 0, these equations define the time interval between steps at each position. To drive the motor at maximum performance, index commands are given to the motor at these intervals. A table is generated giving the time step *t at an index position n. Note: [chgd for format consistency AND deleted that as PV] For p n = n, on the nth step, the motor [has deleted as PV] indexed by n positions and has been accelerating steadily at the maximum allowed rate. This is critical because it also indicates the minimum distance the motor must travel while decelerating to a stop. For example, the stopping distance isalso equal to the current value of n.The algorithm of pointer movement can be summarized in two steps:1.The pointer is at the previously commanded positionand is not moving.2. A command to move to a pointer position (other thanthe current position) has been received. Timed indexpulses are sent to the motor driver at an ever-increasing rate, according to the time steps in Table 6, until:aThe maximum velocity (default or selected) isreached after which the step time intervals will nolonger decrease.bThe distance in steps that remain to travel are less than the current step time index value. The motorthen decelerates by increasing the step timesaccording to Table 6 until the commandedposition is reached. The state machine controlsthe deceleration so that the pointer reaches thecommanded position efficiently.An example of the velocity table for a particular motor is provided in Table 6. This motor’s maximum speed is 4800111650.259-0.966-0.707 121800.0-1.0-0.866 13195-0.259-0.966-0.966 14210-0.5-0.867-1.0 15225-0.707-0.707-0.966 16240-0.866-0.5-0.866 17255-0.966-0.259-0.707 18270-1.00.0-0.500 19285-0.9660.259-0.259 20300-0.8660.50.0 21315-0.7070.7070.259 22330-0.50.8660.500 23345-0.2590.9660.707 * Denotes normalized valuesTable 5. Coil Step Values = ut + 1/2 at 2⇒t =- u + √u2 + 2aav2 = u2 + 2asv = u + atv = 2/t - up0 = 0v0 = 0∆t n =⎡-vn -1 + √v2n -1 + 2aa⎤where ⎡ ⎤ indicates rounding upv n = 2/∆tn - V n -1p n = nFUNCTIONAL DEVICE OPERATIONOPERATIONAL MODESmicrosteps/s (at 12 microsteps/degrees), and its maximum acceleration is 54000 microsteps/s2. The table is quantized to a 1.0 MHz clock.Table 6. Velocity TableVelocity Position Time BetweenSteps (µs)Velocity(µSteps/s)VelocityPositionTime BetweenSteps (µs)Velocity(µSteps/s)VelocityPositionTime BetweenSteps (µs)Velocity(µSteps/s)00.00.00763802631.61522573891.1 12721736.7773772652.51532563906.3 21360773.5783742673.81542553921.6 31127188.7793722688.21552543937.0 47970125.5803692710.01562543937.0 55858170.7813662732.21572533952.6 64564219.1823642747.31582523968.3 73720268.8833612770.11592513984.1 83132319.3843582793.31602504000.0 92701370.2853562809.01612494016.1 102373421.4863542824.91622484032.3 112115472.8873512849.01632484032.3 121908524.1883492865.31642474048.6 131737575.7893472881.81652464065.0 141594627.4903442907.01662454081.6 151473678.9913422924.01672444098.4 161369730.5923402941.21682444098.4 171278782.5933382958.61692434115.2 181199834.0943362976.21702424132.2 191129885.7953342994.01712414149.4 201066938.1963323012.01722414149.4 211010990.1973303030.31732404166.7 229601041.7983283048.81742394184.1 239161091.7993263067.51752384201.7 248771140.31003243086.41762384201.7 258421187.61013223105.61772374219.4 268121231.51023213115.31782364237.3 277841275.51033193134.81792654255.3 287601315.81043173154.61802354255.3 297371356.91053153174.61812344273.5 307161396.61063143184.71822334291.8 316971434.71073123205.11832334291.8 326801470.61083103225.81842324310.3 336631508.31093093236.21852314329.0 346481543.21103073257.31862314329.0 356341577.31113063268.01872304347.8。
MAX1737EEI中文资料
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Ordering Information
PART MAX1737EEI TEMP. RANGE -40°C to +85°C PIN-PACKAGE 28 QSOP
Applications
Notebook Computers Hand-Held Instruments Li+ Battery Packs Desktop Cradle Chargers
INPUT SUPPLY
Typical Operating Circuit
DCIN VL
CSSP CSSN DHI
Pin Configuration
TOP VIEW
VL 1 ISETIN 2 ISETOUT 3 THM 4 REF 5 GND 6 BATT 7 VADJ 8 CCV 9 CCS 10 CCI 11 CELL 12 TIMER1 13 TIMER2 14 28 DCIN 27 CSSP 26 CSSN 25 DHI 24 LX
MAX3373EEKA+中文资料
General DescriptionThe MAX3372E–MAX3379E and MAX3390E–MAX3393E ±15kV ESD-protected level translators provide the level shifting necessary to allow data transfer in a multivoltage system. Externally applied voltages, V CC and V L , set the logic levels on either side of the device. A low-voltage logic signal present on the V L side of the device appears as a high-voltage logic signal on the V CC side of the device, and vice-versa. The MAX3374E/MAX3375E/MAX3376E/MAX3379E and MAX3390E–MAX3393E unidi-rectional level translators level shift data in one direction (V L →V CC or V CC →V L ) on any single data line. The MAX3372E/MAX3373E and MAX3377E/MAX3378E bidi-rectional level translators utilize a transmission-gate-based design (Figure 2) to allow data translation in either direction (V L ↔V CC ) on any single data line. The MAX3372E–MAX3379E and MAX3390E–MAX3393E accept V L from +1.2V to +5.5V and V CC from +1.65V to +5.5V, making them ideal for data transfer between low-voltage ASICs/PLDs and higher voltage systems.All devices in the MAX3372E –MAX3379E , MAX3390E –MAX3393E family feature a three-state output mode that reduces supply current to less than 1µA, thermal short-circuit protection, and ±15kV ESD protection on the V CC side for greater protection in applications that route sig-nals externally. The MAX3372E /MAX3377E operate at a guaranteed data rate of 230kbps. Slew-rate limiting reduces E MI emissions in all 230kbps devices. The MAX3373E –MAX3376E /MAX3378E /MAX3379E and MAX3390E–MAX3393E operate at a guaranteed data rate of 8Mbps over the entire specified operating voltage range. Within specific voltage domains, higher data rates are possible. (See the Timing Characteristics table.)The MAX3372E –MAX3376E are dual level shifters available in 3 x 3 UCSP™, 8-pin TDFN, and 8-pin SOT23-8 packages. The MAX3377E /MAX3378E /MAX3379E and MAX3390E–MAX3393E are quad level shifters available in 3 x 4 UCSP, 14-pin TDFN, and 14-pin TSSOP packages.________________________ApplicationsSPI™, MICROWIRE™, and I 2C Level TranslationLow-Voltage ASIC Level Translation Smart Card Readers Cell-Phone Cradles Portable POS SystemsPortable Communication Devices Low-Cost Serial Interfaces Cell Phones GPSTelecommunications EquipmentFeatures♦Guaranteed Data Rate Options230kbps8Mbps (+1.2V ≤V L ≤V CC ≤+5.5V)10Mbps (+1.2V ≤V L ≤V CC ≤+3.3V)16Mbps (+1.8V ≤V L ≤V CC ≤+2.5V and +2.5V ≤V L ≤V CC ≤+3.3V)♦Bidirectional Level Translation (MAX3372E/MAX3373E and MAX3377E/MAX3378E)♦Operation Down to +1.2V on V L♦±15kV ESD Protection on I/O V CC Lines ♦Ultra-Low 1µA Supply Current in Three-State Output Mode♦Low-Quiescent Current (130µA typ)♦UCSP, TDFN, SOT23, and TSSOP Packages ♦Thermal Short-Circuit ProtectionMAX3372E–MAX3379E/MAX3390E–MAX3393E±15kV ESD-Protected, 1µA, 16Mbps, Dual/QuadLow-Voltage Level Translators in UCSP________________________________________________________________Maxim Integrated Products119-2328; Rev 2; 11/07For pricing, delivery, and ordering information,please contact Maxim Direct at 1-888-629-4642,or visit Maxim’s website at .Ordering InformationUCSP is a trademark of Maxim Integrated Products, Inc.SPI is a trademark of Motorola, Inc.MICROWIRE is a trademark of National Semiconductor Corp.Ordering Information continued at end of data sheet.Selector Guide appears at end of data sheet.+Denotes a lead-free package.T = Tape and reel.M A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSP 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICSStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.(All voltages referenced to GND.)V CC ...........................................................................-0.3V to +6V I/O V CC_......................................................-0.3V to (V CC + 0.3V)I/O V L_...........................................................-0.3V to (V L + 0.3V)THREE-STATE ...............................................-0.3V to (V L + 0.3V)Short-Circuit Duration I/O V L , I/O V CC to GND...........Continuous Short-Circuit Duration I/O V L or I/O V CC to GND Driven from 40mA Source(except MAX3372E and MAX3377E).....................ContinuousContinuous Power Dissipation (T A = +70°C)8-Pin SOT23 (derate 8.9mW/°C above +70°C)...........714mW 8-Pin TDFN (derate 18.2mW/°C above +70°C)........1455mW 3 x 3 UCSP (derate 4.7mW/°C above +70°C)............379mW 3 x 4 UCSP (derate 6.5mW/°C above +70°C)............579mW 14-Pin TSSOP (derate 9.1mW/°C above +70°C)........727mW 14-Pin TDFN (derate 18.2mW/°C above +70°C)......1454mW Operating Temperature Range ...........................-40°C to +85°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°CELECTRICAL CHARACTERISTICS (continued)MAX3372E–MAX3379E/MAX3390E–MAX3393E Low-Voltage Level Translators in UCSP(V CC= +1.65V to +5.5V, V L= +1.2V to (V CC+ 0.3V), GND = 0, I/O V L_and I/O V CC_unconnected, T A= T MIN to T MAX, unless other-M A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSP 4_______________________________________________________________________________________TIMING CHARACTERISTICS(V CC = +1.65V to +5.5V, V L = +1.2V to (V CC + 0.3V), GND = 0, R LOAD = 1M Ω, I/O test signal of Figure 1, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +3.3V, V L = +1.8V, T A = +25°C, unless otherwise noted.) (Notes 1, 2)MAX3372E–MAX3379E/MAX3390E–MAX3393ELow-Voltage Level Translators in UCSP_______________________________________________________________________________________5and not production tested.Note 2:For normal operation, ensure V L < (V CC + 0.3V). During power-up, V L > (V CC + 0.3V) will not damage the device. Note 3:To ensure maximum ESD protection, place a 1µF capacitor between V CC and GND. See Applications Circuits .Note 4:10% to 90% Note 5:90% to 10%TIMING CHARACTERISTICS (continued)(V = +1.65V to +5.5V, V = +1.2V to (V + 0.3V), GND = 0, R = 1M Ω, I/O test signal of Figure 1, T = T to T , unlessM A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSP 6_______________________________________________________________________________________Typical Operating Characteristics(R LOAD = 1M Ω, T A = +25°C, unless otherwise noted. All 230kbps TOCs apply to MAX3372E/MAX3377E only. All 8Mbps and 500kbps TOCs apply to MAX3373E–MAX3376E/MAX3378E/MAX3379E and MAX3390E–MAX3393E only.)V L SUPPLY CURRENT vs. SUPPLY VOLTAGE (DRIVING I/O V L , V CC = +3.3V, V L = +1.8V)V CC (V)S U P P L Y C U R R E N T (μA )4.954.403.853.302.752.2010020030040050060001.655.50V CC SUPPLY CURRENT vs. SUPPLY VOLTAGE (DRIVING I/O V L , V CC = +3.3V, V L = +1.8V)V CC (V)S U P P L Y C U R R E N T (m A )4.954.403.853.302.752.200.51.01.52.02.53.03.501.65 5.50V L SUPPLY CURRENT vs. TEMPERATURE (DRIVING I/O V CC , V CC = +3.3V, V L = +1.8V)TEMPERATURE (°C)S U P P L Y C U R R E N T (μA )6035-151050100150200250300350400-4085V CC SUPPLY CURRENT vs. TEMPERATURE(DRIVING I/O V CC , V CC = +3.3V, V L = +1.8V)TEMPERATURE (°C)S U P P L Y C U R R E N T (μA )6035-151020040060080010001200140016000-4085V L SUPPLY CURRENT vs. CAPACITIVE LOAD (DRIVING I/O V L , V CC = +3.3V, V L= +1.8V)CAPACITIVE LOAD (pF)S U P P L Y C U R R E N T (μA )857055402550100150200250300350010100V CC SUPPLY CURRENT vs. CAPACITIVE LOAD (DRIVING I/O V L , V CC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)S U P P L Y C U R R E N T (μA )8570554025500100015002000250010100RISE/FALL TIME vs. CAPACITIVE LOAD (DRIVING I/O V L , V CC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )908070605040305001000150020002500020100RISE/FALL TIME vs. CAPACITIVE LOAD (DRIVING I/O V L , V CC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )454030352025152468101214161801050RISE/FALL TIME vs. CAPACITIVE LOAD (DRIVING I/O V L , V CC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )454035302520155010015020025001050MAX3372E–MAX3379E/MAX3390E–MAX3393ELow-Voltage Level Translators in UCSP_______________________________________________________________________________________7PROPAGATION DELAY vs. CAPACITIVE LOAD (DRIVING I/O V L , V CC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )90807060504030100200300400500600700020100PROPAGATION DELAY vs. CAPACITIVE LOAD (DRIVING I/O V L , V CC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )4540353025201536912151050PROPAGATION DELAY vs. CAPACITIVE LOAD (DRIVING I/O V L , V CC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )454035302520155010015020025030001050RISE/FALL TIME vs. CAPACITIVE LOAD(DRIVING I/O V L , V CC = +2.5V, V L = +1.8V)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )908070605040305001000150020002500020100RISE/FALL TIME vs. CAPACITIVE LOAD (DRIVING I/O VL , V CC = +2.5V, V L = +1.8V)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )4540353025201524681012141050RISE/FALL TIME vs. CAPACITIVE LOAD (DRIVING I/O V CC , V CC = +2.5V, V L = +1.8V)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )45403530252015501001502002503001050RISE/FALL TIME vs. CAPACITIVE LOAD (DRIVING I/O V CC , VCC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )908070605040305001000150020002500020100RISE/FALL TIME vs. CAPACITIVE LOAD (DRIVING I/O V CC, V CC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )454035302520152468101201050RISE/FALL TIME vs. CAPACITIVE LOAD (DRIVING I/O V CC , V CC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )454035302520155010015020025030001050Typical Operating Characteristics (continued)(R LOAD = 1M Ω, T A = +25°C, unless otherwise noted. All 230kbps TOCs apply to MAX3372E/MAX3377E only. All 8Mbps and 500kbps TOCs apply to MAX3373E–MAX3376E/MAX3378E/MAX3379E and MAX3390E–MAX3393E only.)M A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSP 8_______________________________________________________________________________________Typical Operating Characteristics (continued)(R LOAD = 1M Ω, T A = +25°C, unless otherwise noted. All 230kbps TOCs apply to MAX3372E/MAX3377E only. All 8Mbps and 500kbps TOCs apply to MAX3373E–MAX3376E/MAX3378E/MAX3379E and MAX3390E–MAX3393E only.)PROPAGATION DELAY vs. CAPACITIVE LOAD (DRIVING I/O V CC , V CC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )90807060504030100200300400500600700020100PROPAGATION DELAY vs. CAPACITIVE LOAD (DRIVING I/O V CC , V CC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )4540353025201512345601050PROPAGATION DELAY vs. CAPACITIVE LOAD (DRIVING I/O V CC , V CC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )454035302520155010015020025030001050RISE/FALL TIME vs. CAPACITIVE LOAD (DRIVING I/O V CC , V CC = +2.5V, V L = +1.8V)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )908070605040305001000150020002500020100RISE/FALL TIME vs. CAPACITIVE LOAD (DRIVING I/O V CC , V CC = +2.5V, V L = +1.8V)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )403020246810121050RISE/FALL TIME vs. CAPACITIVE LOAD (DRIVING I/O V CC , V CC = +2.5V, V L = +1.8V)CAPACITIVE LOAD (pF)RI S E /F A L l T I M E (n s )403020501001502002503003501050RAIL-TO-RAIL DRIVING(DRIVING I/O V L , V CC = +3.3V, V L = +1.8V,C LOAD = 50pF, DATA RATE = 230kbps)M A X 3372E t o c 25I/O V L_I/O V CC_1V/div 2V/div 1μs/div RAIL-TO-RAIL DRIVING(DRIVING I/O V L , V CC = +3.3V, V L = +1.8V,C LOAD = 15pF, DATA RATE = 8Mbps)M A X 3372E t o c 26I/O V L_I/O V CC_1V/div2V/div200ns/divMAX3372E–MAX3379E/MAX3390E–MAX3393ELow-Voltage Level Translators in UCSP_______________________________________________________________________________________9Typical Operating Characteristics (continued)(R LOAD = 1M Ω, T A = +25°C, unless otherwise noted. All 230kbps TOCs apply to MAX3372E/MAX3377E only. All 8Mbps and 500kbps TOCs apply to MAX3373E–MAX3376E/MAX3378E/MAX3379E and MAX3390E–MAX3393E only.)EXITING THREE-STATE OUTPUT MODE (V CC = +3.3V, V L = +1.8V, C LOAD = 50pF)MAX3372E toc28I/O V L_I/O V CC_2μs/divTHREE-STATE2V/div1V/div1V/divPin DescriptionOPEN-DRAIN DRIVING(DRIVING I/O V L , V CC = +3.3V, V L = +1.8V,C LOAD = 15pF, DATA RATE = 500kbps)M A X 3372E t o c 27I/O V L_I/O V CC_1V/div2V/div200ns/divM A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSP 10______________________________________________________________________________________Detailed DescriptionThe MAX3372E –MAX3379E and MAX3390E –MAX3393E E SD-protected level translators provide the level shifting necessary to allow data transfer in a multivoltage system.Externally applied voltages, V CC and V L , set the logic lev-els on either side of the device. A low-voltage logic signal present on the V L side of the device appears as a high-voltage logic signal on the V CC side of the device, and vice-versa. The MAX3374E /MAX3375E /MAX3376E /MAX3379E and MAX3390E –MAX3393E unidirectional level translators level shift data in one direction (V L →V CC or V CC →V L ) on any single data line. The MAX3372E /MAX3373E and MAX3377E /MAX3378E bidi-rectional level translators utilize a transmission-gate-based design (see Figure 2) to allow data translation in either direction (V L ↔V CC ) on any single data line. The MAX3372E –MAX3379E and MAX3390E –MAX3393Eaccept V L from +1.2V to +5.5V and V CC from +1.65V to +5.5V, making them ideal for data transfer between low-voltage ASICs/PLDs and higher voltage systems.All devices in the MAX3372E –MAX3379E , MAX3390E –MAX3393E family feature a three-state output mode that reduces supply current to less than 1µA, thermal short-circuit protection, and ±15kV ESD protection on the V CC side for greater protection in applications that route sig-nals externally. The MAX3372E /MAX3377E operate at a guaranteed data rate of 230kbps. Slew-rate limiting reduces E MI emissions in all 230kbps devices. The MAX3373E –MAX3376E /MAX3378E /MAX3379E and MAX3390E–MAX3393E operate at a guaranteed data rate of 8Mbps over the entire specified operating voltage range. Within specific voltage domains, higher data rates are possible. (See the Timing Characteristics table.)Figure 1a. Rail-to-Rail Driving I/O V LFigure 1b. Rail-to-Rail Driving I/O V CCMAX3372E–MAX3379E/MAX3390E–MAX3393ELow-Voltage Level Translators in UCSPLevel TranslationFor proper operation ensure that +1.65V ≤V CC ≤+5.5V, +1.2V ≤V L ≤+5.5V, and V L ≤(V CC + 0.3V).During power-up sequencing, V L ≥(V CC + 0.3V) will not damage the device. During power-supply sequenc-ing, when V CC is floating and V L is powering up, a cur-rent may be sourced, yet the device will not latch up.The speed-up circuitry limits the maximum data rate for devices in the MAX3372E –MAX3379E , MAX3390E –MAX3393E family to 16Mbps. The maximum data rate also depends heavily on the load capacitance (see the Typical Operating Characteristics ), output impedance of the driver, and the operational voltage range (see the Timing Characteristics table).Speed-Up CircuitryThe MAX3373E –MAX3376E /MAX3378E /MAX3379E and MAX3390E–MAX3393E feature a one-shot generator that decreases the rise time of the output. When triggered,MOSFETs PU1 and PU2 turn on for a short time to pull upI/O V L_and I/O V CC_to their respective supplies (see Figure 2b). This greatly reduces the rise time and propa-gation delay for the low-to-high transition. The scope photo of Rail-to-Rail Driving for 8Mbps Operation in the Typical Operating Characteristics shows the speed-up circuitry in operation.Rise-Time AcceleratorsThe MAX3373E–MAX3376E/MAX3378E/MAX3379E and the MAX3390E –MAX3393E have internal rise-time accelerators allowing operation up to 16Mbps. The rise-time accelerators are present on both sides of the device and act to speed up the rise time of the input and output of the device, regardless of the direction of the data. The triggering mechanism for these accelera-tors is both level and edge sensitive. To prevent false triggering of the rise-time accelerators, signal fall times of less than 20ns/V are recommended for both the inputs and outputs of the device. Under less noisy con-ditions, longer signal fall times may be acceptable.Figure 1c. Open-Drain Driving I/O V CCFigure 1d. Open-Drain Driving I/O V LM A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSP Three-State Output ModePull THREE-STATE low to place the MAX3372E –MAX3379E and MAX3390E–MAX3393E in three-state out-put mode. Connect THREE-STATE to V L (logic-high) for normal operation. Activating the three-state output mode disconnects the internal 10k Ωpullup resistors on the I/O V CC and I/O V L lines. This forces the I/O lines to a high-impedance state, and decreases the supply current to less than 1µA. The high-impedance I/O lines in three-state output mode allow for use in a multidrop network.When in three-state output mode, do not allow the voltageat I/O V L_to exceed (V L + 0.3V), or the voltage at I/O V CC_to exceed (V CC + 0.3V).Thermal Short-Circuit ProtectionThermal overload detection protects the MAX3372E –MAX3379E and MAX3390E–MAX3393E from short-circuit fault conditions. In the event of a short-circuit fault, when the junction temperature (T J ) reaches +152°C, a thermal sensor signals the three-state output mode logic to force the device into three-state output mode. When T J has cooled to +142°C, normal operation resumes.Figure 2a. Functional Diagram, MAX3372E/MAX3377E (1 I/O line)Figure 2b. Functional Diagram, MAX3373E/MAX3378E (1 I/O line)±15kV ESD Protection As with all Maxim devices, ESD-protection structures are incorporated on all pins to protect against electrostatic discharges encountered during handling and assembly. The I/O V CC lines have extra protection against static electricity. Maxim’s engineers have developed state-of-the-art structures to protect these pins against E SD of ±15kV without damage. The E SD structures withstand high E SD in all states: normal operation, three-state output mode, and powered down. After an ESD event, Maxim’s E versions keep working without latchup, whereas competing products can latch and must be powered down to remove latchup.ESD protection can be tested in various ways. The I/O V CC lines of this product family are characterized for protection to the following limits:1)±15kV using the Human Body Model2)±8kV using the Contact Discharge method specifiedin IEC 1000-4-23)±10kV using IE C 1000-4-2’s Air-Gap DischargemethodESD Test Conditions E SD performance depends on a variety of conditions. Contact Maxim for a reliability report that documents test setup, test methodology, and test results.Human Body Model Figure 3a shows the Human Body Model and Figure 3b shows the current waveform it generates when dis-charged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of inter-est, which is then discharged into the test device through a 1.5kΩresistor.IEC 1000-4-2 The IE C 1000-4-2 standard covers E SD testing and performance of finished equipment; it does not specifi-cally refer to integrated circuits. The MAX3372E–MAX3379E and MAX3390E–MAX3393E help to design equipment that meets Level 3 of IEC 1000-4-2, without the need for additional ESD-protection components. The major difference between tests done using the Human Body Model and IE C 1000-4-2 is higher peak current in IE C 1000-4-2, because series resistance is lower in the IE C 1000-4-2 model. Hence, the E SD with-stand voltage measured to IE C 1000-4-2 is generally lower than that measured using the Human Body Model. Figure 4a shows the IEC 1000-4-2 model, and Figure 4b shows the current waveform for the ±8kV, IEC 1000-4-2, Level 4, ESD contact-discharge test.The air-gap test involves approaching the device with a charged probe. The contact-discharge method con-nects the probe to the device before the probe is energized.Machine Model The Machine Model for E SD tests all pins using a 200pF storage capacitor and zero discharge resis-tance. Its objective is to emulate the stress caused by contact that occurs with handling and assembly during manufacturing. Of course, all pins require this protec-tion during manufacturing, not just inputs and outputs. Therefore, after PCB assembly, the Machine Model is less relevant to I/O ports.MAX3372E–MAX3379E/MAX3390E–MAX3393E Low-Voltage Level Translators in UCSPFigure 3a. Human Body ESD Test ModelFigure 3b. Human Body Current WaveformM A X 3372E –M A X 3379E /M A X 3390E –M A X 3393EApplications InformationPower-Supply DecouplingTo reduce ripple and the chance of transmitting incor-rect data, bypass V L and V CC to ground with a 0.1µF capacitor. See the Typical Operating Circuit. To ensure full ±15kV ESD protection, bypass V CC to ground with a 1µF capacitor. Place all capacitors as close to the power-supply inputs as possible.I 2C Level TranslationThe MAX3373E –MAX3376E , MAX3378E /MAX3379E and MAX3390E–MAX3393E level-shift the data present on the I/O lines between +1.2V and +5.5V, making them ideal for level translation between a low-voltageASIC and an I 2C device. A typical application involves interfacing a low-voltage microprocessor to a 3V or 5V D/A converter, such as the MAX517.Push-Pull vs. Open-Drain DrivingAll devices in the MAX3372E –MAX3379E and MAX3390E–MAX3393E family may be driven in a push-pull configuration. The MAX3373E –MAX3376E /MAX3378E /MAX3379E and MAX3390E –MAX3393E include internal 10k Ωresistors that pull up I/O V L_and I/O V CC_to their respective power supplies, allowing operation of the I/O lines with open-drain devices. See the Timing Characteristics table for maximum data rates when using open-drain drivers.Low-Voltage Level Translators in UCSPFigure 4b. IEC 1000-4-2 ESD Generator Current WaveformFigure 4a. IEC 1000-4-2 ESD Test Model Typical Operating CircuitMAX3372E–MAX3379E/MAX3390E–MAX3393ELow-Voltage Level Translators in UCSPApplications CircuitsM A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSP Applications Circuits (continued)MAX3372E–MAX3379E/MAX3390E–MAX3393E Low-Voltage Level Translators in UCSP Applications Circuits (continued)M A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSPApplications Circuits (continued)MAX3372E–MAX3379E/MAX3390E–MAX3393ELow-Voltage Level Translators in UCSPApplications Circuits (continued)M A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSP Selector Guide*Higher data rates are possible (see the Timing Characteristics table).Ordering Information (continued)+Denotes a lead-free package.**EP = Exposed pad.T = Tape and reel.Ordering Information (continued)MAX3372E–MAX3379E/MAX3390E–MAX3393E Low-Voltage Level Translators in UCSP**EP = Exposed pad.T = Tape and reel.†Future product—contact factory for availability.M A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSPPin Configurations (continued)Pin Configurations (continued)MAX3372E–MAX3379E/MAX3390E–MAX3393E Low-Voltage Level Translators in UCSPM A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSPPin Configurations (continued)MAX3372E–MAX3379E/MAX3390E–MAX3393ELow-Voltage Level Translators in UCSPChip InformationTRANSISTOR COUNT:MAX3372E–MAX3376E: 189MAX3377E–MAX3379E, MAX3390E–MAX3393E:295PROCESS: BiCMOSPackage Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)M A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSPPackage Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)Package Information (continued)MAX3372E–MAX3379E/MAX3390E–MAX3393E Low-Voltage Level Translators in UCSP (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline informationgo to /packages.)M A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSPPackage Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)Package Information (continued)MAX3372E–MAX3379E/MAX3390E–MAX3393E Low-Voltage Level Translators in UCSP (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline informationgo to /packages.)Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)M A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSPMAX3372E–MAX3379E/MAX3390E–MAX3393E ±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad Low-Voltage Level Translators in UCSPMaxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________31©2007 Maxim Integrated Productsis a registered trademark of Maxim Integrated Products, Inc.Revision History元器件交易网。
MAX3077EESA中文资料
The MAX3072E/MAX3075E/MAX3078E are intended for half-duplex communications, and the MAX3070E/ MAX3071E/MAX3073E/MAX3074E/MAX3076E/MAX307 7E are intended for full-duplex communications. The MAX3079E is selectable for half-duplex or full-duplex operation. It also features independently programmable receiver and transmitter output phase through separate pins.
LMV339M资料
LMV331Single /LMV393Dual /LMV339QuadGeneral Purpose,Low Voltage,TinyPack ComparatorsGeneral DescriptionThe LMV393and LMV339are low voltage (2.7-5V)versions of the dual and quad comparators,LM393/339,which are specified at 5-30V.The LMV331is the single version,which is available in space saving SC70-5and SOT23-5packages.SC70-5is approximately half the size of SOT23-5.The LMV393is available in 8-pin SOIC and 8-pin MSOP .The LMV339is available in 14-pin SOIC and 14-pin TSSOP .The LMV331/393/339is the most cost-effective solution where space,low voltage,low power and price are the pri-mary specification in circuit design for portable consumer products.They offer specifications that meet or exceed the familiar LM393/339at a fraction of the supply current.The chips are built with National’s advanced Submicron Silicon-Gate BiCMOS process.The LMV331/393/339have bipolar input and output stages for improved noise perfor-mance.Features(For 5V Supply,Typical Unless Otherwise Noted)n Space Saving SC70-5Package (2.0x 2.1x 1.0mm)n Space Saving SOT23-5Package (3.00x 3.01x1.43mm)n Guaranteed2.7V and 5V Performance n Industrial Temperature Range −40˚C to +85˚C n Low Supply Current60µA/Channeln Input Common Mode Voltage Range Includes Groundn Low Output Saturation Voltage200mVApplicationsn Mobile Communications n Notebooks and PDA’sn Battery Powered Electronicsn General Purpose Portable DevicenGeneral Purpose Low Voltage ApplicationsConnection Diagrams5-Pin SC70-5/SOT23-5DS100080-1Top View 8-Pin SO/MSOPDS100080-2Top View14-Pin SO/TSSOPDS100080-3Top ViewAugust 1999LMV331Single /LMV393Dual /LMV339Quad General Purpose,Low Voltage,TinyPack Comparators©1999National Semiconductor Corporation Ordering InformationPackage Temperature Range PackagingMarkingTransportMediaNSCDrawing Industrial−40˚C to+85˚C5-pin SC70-5LMV331M7C131k Units Tape and Reel MAA05LMV331M7X C133k Units Tape and Reel 5-pin SOT23-5LMV331M5C121k Units Tape and Reel MA05BLMV331M5X C123k Units Tape and Reel 8-pin Small Outline LMV393M LMV393M RailsM08ALMV393MX LMV393M 2.5k Units Tape and Reel 8-pin MSOP LMV393MM LMV3931k UnitsTape and ReelMUA08ALMV393MMX LMV393 3.5k Units Tape and Reel 14-pin Small Outline LMV339M LMV339M RailsM14ALMV339MX LMV339M 2.5k Units Tape and Reel 14-pin TSSOP LMV339MT LMV339MT RailsMTC14LMV339MTX LMV339MT 2.5k Units Tape and Reel2Absolute Maximum Ratings(Note1)If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.ESD Tolerance(Note2)Human Body ModelLMV331/393/339800VMachine Model LMV331/339/393120V Differential Input Voltage±Supply Voltage Voltage on any pin(referred to V−pin)5.5V Soldering InformationInfrared or Convection(20sec)235˚C Storage Temp.Range−65˚C to+150˚C Junction Temperature(Note3)150˚C Operating Ratings(Note1)Supply Voltage 2.7V to5.0V Temperature RangeLMV393,LMV339,LMV331−40˚C≤T J≤+85˚CThermal Resistance(θJA)M Package,8-pin SurfaceMount190˚C/WM Package,14-pin SurfaceMount145˚C/WMTC Package,14-pinTSSOP155˚C/WMAA05Package,5-pinSC70-5478˚C/WM05A Package5-pinSOT23-5265˚C/WMM Package,8-pin MiniSurface Mount235˚C/W2.7V DC Electrical CharacteristicsUnless otherwise specified,all limits guaranteed for T J=25˚C,V+=2.7V,V−=0V.Boldface limits apply at the temperature extremes.Symbol Parameter Conditions Typ(Note4)LMV331/393/339Limit(Note5)UnitsV OS Input Offset Voltage1.77mV maxTCV OS Input Offset VoltageAverage Drift5µV/˚CI B Input Bias Current10250400nA maxI OS Input Offset Current550150nA maxV CM Input Voltage Range−0.1V2.0VV SAT Saturation Voltage I sink≤1mA200mVI O Output Sink Current V O≤1.5V235mA minI S Supply Current LMV33140100µA maxLMV393Both Comparators70140µA maxLMV339All four Comparators140200µA max Output Leakage Current.0031µA max 2.7V AC Electrical CharacteristicsT J=25˚C,V+=2.7V,R L=5.1kΩ,V−=0V.Symbol Parameter Conditions Typ(Note4)Unitst PHL Propagation Delay(High to Low)Input Overdrive=10mV1000nsInput Overdrive=100mV350nst PLH Propagation Delay(Low to High)Input Overdrive=10mV500nsInput Overdrive=100mV400ns35V DC Electrical CharacteristicsUnless otherwise specified,all limits guaranteed for T J=25˚C,V+=5V,V−=0V.Boldface limits apply at the temperature extremes.Symbol Parameter Conditions Typ(Note4)LMV331/393/339Limit(Note5)UnitsV OS Input Offset Voltage 1.779mV maxTCV OS Input Offset VoltageAverage Drift5µV/˚CI B Input Bias Current25250400nA maxI OS Input Offset Current250150nA maxV CM Input Voltage Range−0.1V4.2VA V Voltage Gain5020V/mV minV sat Saturation Voltage I sink≤4mA200400700mV maxI O Output Sink Current V O≤1.5V8410mA I S Supply Current LMV33160120150µA maxLMV393Both Comparators 100200250µA maxLMV339All four Comparators 170300350µA maxOutput Leakage Current.0031µA max 5V AC Electrical CharacteristicsT J=25˚C,V+=5V,R L=5.1kΩ,V−=0V.Symbol Parameter Conditions Typ(Note4)Units t PHL Propagation Delay(High to Low)Input Overdrive=10mV600nsInput Overdrive=100mV200nst PLH Propagation Delay(Low to High)Input Overdrive=10mV450nsInput Overdrive=100mV300ns Note1:Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.Operating Ratings indicate conditions for which the device is in-tended to be functional,but specific performance is not guaranteed.For guaranteed specifications and the test conditions,see the Electrical characteristics.Note2::Human body model,1.5kΩin series with100pF.Machine model,200Ωin series with100pF.Note3:The maximum power dissipation is a function of T J(max),θJA,and T A.The maximum allowable power dissipation at any ambient temperature is P D=(T J(max) -T A)/θJA.All numbers apply for packages soldered directly into a PC board.Note4:Typical Values represent the most likely parametric norm.Note5:All limits are guaranteed by testing or statistical analysis.4Typical Performance CharacteristicsUnless otherwise specified,V S =+5V,single supply,T A =25˚CSupply Current vsSupply Voltage Output High (LMV331)DS100080-34Supply Current vsSupply Voltage Output Low (LMV331)DS100080-33Output Voltage vsOutput Current at 5V SupplyDS100080-37Output Voltage vs Output Current at 2.7SupplyDS100080-38Input Bias Current vs Supply VoltageDS100080-36Response Time vs Input Overdrives Negative TransitionDS100080-42Response Time for Input Overdrive Positive TransitionDS100080-43Response Time vs Input Overdrives Negative TransitionDS100080-41Response Time for Input Overdrive Positive TransitionDS100080-405Simplified SchematicDS100080-47 6Application CircuitsBasic ComparatorA basic comparator circuit is used for converting analog sig-nals to a digital output.The LMV331/393/339have an open-collector output stage,which requires a pull-up resistor to a positive supply voltage for the output to switch properly.When the internal output transistor is off,the output voltage will be pulled up to the external positive voltage.The output pull-up resistor should be chosen high enough so as to avoid excessive power dissipation yet low enough to supply enough drive to switch whatever load circuitry is used on the comparator output.On the LMV331/393/339the pull-up resistor should range between 1k to 10k Ω.The comparator compares the input voltage (V in )at the non-inverting pin to the reference voltage (V ref )at the invert-ing pin.If V in is less than V ref ,the output voltage (V o )is at the saturation voltage.On the other hand,if V in is greater than V ref ,the output voltage (V o )is at V cc..Comparator with HysteresisThe basic comparator configuration may oscillate or produce a noisy output if the applied differential input voltage is near the comparator’s offset voltage.This usually happens when the input signal is moving very slowly across the compara-tor’s switching threshold.This problem can be prevented by the addition of hysteresis or positive feedback.Inverting Comparator with HysteresisThe inverting comparator with hysteresis requires a three re-sistor network that are referenced to the supply voltage V cc of the comparator.When Vin at the inverting input is less than V a ,the voltage at the non-inverting node of the com-parator (V in <V a ),the output voltage is high (for simplicity assume V o switches as high as V cc ).The three network re-sistors can be represented as R 1//R 3in series with R 2.The lower input trip voltage V a1is defined asWhen V in is greater than Va (V in V a ),the output voltage is low very close to ground.In this case the three network re-sistors can be presented as R 2//R 3in series with R 1.The up-per trip voltage V a2is defined asThe total hysteresis provided by the network is defined as∆V a =V a1-V a2To assure that the comparator will always switch fully to V cc and not be pulled down by the load the resistors values should be chosen as follow:R pull-up <<R loadand R 1>R pull-up .DS100080-26DS100080-4FIGURE 1.Basic Comparator7Application Circuits(Continued)Non-Inverting Comparator with HysteresisNon inverting comparator with hysteresis requires a two re-sistor network,and a voltage reference (V ref )at the inverting input.When V in is low,the output is also low.For the output to switch from low to high,V in must rise up to V in1where V in1is calculated byWhen V in is high,the output is also high,to make the com-parator switch back to it’s low state,V in must equal V ref be-fore V a will again equal V ref .V in can be calculated by:The hysteresis of this circuit is the difference between V in1and V in2.∆V in =V cc R 1/R 2DS100080-25FIGURE 2.Inverting Comparator with HysteresisDS100080-22DS100080-23 8Application Circuits(Continued)Square Wave OscillatorComparators are ideal for oscillator applications.This squarewave generator uses the minimum number of components.The output frequency is set by the RC time constant of thecapacitor C1and the resistor in the negative feedback R4.The maximum frequency is limited only by the large signalpropagation delay of the comparator in addition to any ca-pacitive loading at the output,which would degrade the out-put slew rate.To analyze the circuit,assume that the output is initially high.For this to be true,the voltage at the inverting input V c has tobe less than the voltage at the non-inverting input V a.For V cto be low,the capacitor C1has to be discharged and willcharge up through the negative feedback resistor R4.Whenit has charged up to value equal to the voltage at the positiveinput V a1,the comparator output will switch.V a1will be given by:If:R1=R2=R3Then:V a1=2V cc/3When the output switches to ground,the value of V a is re-duced by the hysteresis network to a value given by:V a2=V cc/3Capacitor C1must now discharge through R4towardsground.The output will return to its high state when the volt-age across the capacitor has discharged to a value equal toV a2.For the circuit shown,the period for one cycle of oscillationwill be twice the time it takes for a single RC circuit to chargeup to one half of its final value.The time to charge the ca-pacitor can be calculated fromWhere V max is the max applied potential across the capaci-tor=(2V cc/3)and V C=Vmax/2=V CC/3One period will be given by:1/freq=2tor calculating the exponential gives:1/freq=2(0.694)R4C1Resistors R3and R4must be at least two times larger thanR5to insure that V o will go all the way up to V cc in the highstate.The frequency stability of this circuit should strictly bea function of the external components.Free Running MultivibratorA simple yet very stable oscillator that generates a clock forslower digital systems can be obtained by using a resonatoras the feedback element.It is similar to the free running mul-tivibrator,except that the positive feedback is obtainedthrough a quartz crystal.The circuit oscillates when thetransmission through the crystal is at a maximum,so thecrystal in its series-resonant mode.The value of R1and R2are equal so that the comparator willswitch symmetrically about+V cc/2.The RC constant of R3and C1is set to be several times greater than the period ofthe oscillating frequency,insuring a50%duty cycle by main-taining a DC voltage at the inverting input equal to the abso-lute average of the output waveform.When specifying the crystal,be sure to order series resonantwith the desired temperature coefficientDS100080-8DS100080-24FIGURE5.Squarewave OscillatorDS100080-7FIGURE6.Crystal controlled Oscillator9Application Circuits(Continued)Pulse generator with variable duty cycle:The pulse generator with variable duty cycle is just a minor modification of the basic square wave generator.Providing a separate charge and discharge path for capacitor C 1gener-ates a variable duty cycle.One path,through R 2and D 2will charge the capacitor and set the pulse width (t 1).The other path,R 1and D 1will discharge the capacitor and set the time between pulses (t 2).By varying resistor R 1,the time between pulses of the gen-erator can be changed without changing the pulse width.Similarly,by varying R 2,the pulse width will be altered with-out affecting the time between pulses.Both controls will change the frequency of the generator.The pulse width and time between pulses can be found from:Solving these equations for t 1and t 2t 1=R 4C 1ln2t 2=R 5C 1ln2These terms will have a slight error due to the fact that V max is not exactly equal to 2/3V CC but is actually reduced by the diode drop to:Positive Peak Detector:Positive peak detector is basically the comparator operated as a unit gain follower with a large holding capacitor from the output to ground.Additional transistor is added to the output to provide a low impedance current source.When the output of the comparator goes high,current is passed through the transistor to charge up the capacitor.The only discharge path will be the 1M ohm resistor shunting C1and any load that is connected to the output.The decay time can be al-tered simply by changing the 1M ohm resistor.The output should be used through a high impedance follower to a avoid loading the output of the peak detector.Negative Peak Detector:For the negative detector,the output transistor of the com-parator acts as a low impedance current sink.The only dis-charge path will be the 1M Ωresistor and any load imped-ance used.Decay time is changed by varying the 1M ΩresistorDS100080-9FIGURE 7.Pulse GeneratorDS100080-17FIGURE 8.Positive Peak DetectorDS100080-18FIGURE 9.Negative Peak Detector10Application Circuits(Continued)Driving CMOS and TTLThe comparator’s output is capable of driving CMOS andTTL Logic circuits.AND GatesThe comparator can be used as three input AND gate.Theoperation of the gate is as follow:The resistor divider at the inverting input establishes a refer-ence voltage at that node.The non-inverting input is the sumof the voltages at the inputs divided by the voltage dividers.The output will go high only when all three inputs are high,casing the voltage at the non-inverting input to go above thatat inverting input.The circuit values shown work for a″0″equal to ground and a″1″equal to5V.The resistor values can be altered if different logic levels aredesired.If more inputs are required,diodes are recom-mended to improve the voltage margin when all but one ofthe inputs are high.OR GatesA three input OR gate is achieved from the basic AND gatesimply by increasing the resistor value connected from theinverting input to V cc,thereby reducing the reference volt-age.A logic″1″at any of the inputs will produce a logic″1″at theoutput.ORing the OutputBy the inherit nature of an open collector comparator,theoutputs of several comparators can be tied together with apull up resistor to V cc.If one or more of the comparators out-puts goes low,the output V o will go low.DS100080-5FIGURE10.Driving CMOSDS100080-6FIGURE11.Driving TTLDS100080-11FIGURE12.AND GateDS100080-10FIGURE13.OR Gate11Application Circuits(Continued)DS100080-12FIGURE14.ORing the OutputsDS100080-13rge Fan-In AND Gate12SC70-5Tape and Reel SpecificationDS100080-44 SOT-23-5Tape and Reel SpecificationTAPE FORMATTape Section#Cavities Cavity Status Cover Tape StatusLeader0(min)Empty Sealed(Start End)75(min)Empty SealedCarrier3000Filled Sealed250Filled SealedTrailer125(min)Empty Sealed(Hub End)0(min)Empty Sealed13SOT-23-5Tape and Reel Specification(Continued)TAPE DIMENSIONSDS100080-45 8mm0.1300.1240.1300.1260.138±0.0020.055±0.0040.1570.315±0.012(3.3)(3.15)(3.3)(3.2)(3.5±0.05)(1.4±0.11)(4)(8±0.3)Tape Size DIM A DIM Ao DIM B DIM Bo DIM F DIM Ko DIM P1DIM W14SOT-23-5Tape and Reel Specification(Continued)REEL DIMENSIONSDS100080-46 8mm7.000.0590.5120.795 2.1650.331+0.059/−0.0000.567W1+0.078/−0.039330.00 1.5013.0020.2055.008.40+1.50/−0.0014.40W1+2.00/−1.00 Tape Size A B C D N W1W2W315Physical Dimensions inches(millimeters)unless otherwise noted5-Pin SC70-5Tape and ReelOrder Number LMV331M7and LMV331M7XNS Package Number MAA05A 16Physical Dimensions inches(millimeters)unless otherwise noted(Continued)5-Pin SOT23-5Tape and ReelOrder Number LMV331M5and LMV331M5XNS Package Number MA05B17Physical Dimensions inches(millimeters)unless otherwise noted(Continued)8-Pin Small OutlineOrder Number LMV393M and LMV393MXNS Package Number M08A18Physical Dimensions inches(millimeters)unless otherwise noted(Continued)8-Pin MSOPOrder Number LMV393MM and LMV393MMXNS Package Number MUA08A19Physical Dimensions inches(millimeters)unless otherwise noted(Continued)14-Pin Small OutlineOrder Number LMV339M and LMV339MXNS Package Number M14A20Physical Dimensions inches (millimeters)unless otherwise noted (Continued)LIFE SUPPORT POLICYNATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION.As used herein:1.Life support devices or systems are devices or systems which,(a)are intended for surgical implant into the body,or (b)support or sustain life,and whose failure to perform when properly used in accordance with instructions for use provided in the labeling,can be reasonably expected to result in asignificant injury to the user.2.A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system,or to affect its safety or effectiveness.National Semiconductor Corporation Americas Tel:1-800-272-9959Fax:1-800-737-7018Email:support@ National Semiconductor Europe Fax:+49(0)180-5308586Email:europe.support@ Deutsch Tel:+49(0)180-5308585English Tel:+49(0)180-5327832Français Tel:+49(0)180-5329358Italiano Tel:+49(0)180-5341680National Semiconductor Asia Pacific Customer Response Group Tel:65-2544466Fax:65-2504466Email:sea.support@National Semiconductor Japan Ltd.Tel:81-3-5639-7560Fax: 14-Pin TSSOPOrder Number LMV339MT and LMV339MTXNS Package Number MTC14LMV331Single /LMV393Dual /LMV339Quad General Purpose,Low Voltage,TinyPack Comparators National does not assume any responsibility for use of any circuitry described,no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.元器件交易网。
关于MAX7321EVKIT的说明书
General DescriptionThe MAX7321 evaluation kit (EV kit) provides a proven design to evaluate the MAX7321 I 2C port expander with eight open-drain I/Os. The EV kit also includes Windows ®2000/XP- and Windows Vista ®-compatible software that provides a simple graphical user interface (GUI) for exer-cising the features of the MAX7321. The MAX7321 EV kit PCB comes with a MAX7321ATE+ installed.Features♦Wide 1.71V to 5.5V Supply Range ♦Windows 2000/XP- and Windows Vista (32-Bit)-Compatible Software ♦USB-PC Connection (Cable Included)♦USB Powered♦Lead(Pb)-Free and RoHS Compliant ♦Proven PCB Layout♦Fully Assembled and TestedEvaluates: MAX7321MAX7321 Evaluation Kit________________________________________________________________Maxim Integrated Products119-4414; Rev 0; 1/09For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,or visit Maxim’s website at .Ordering Information+Denotes lead(Pb)-free and RoHS compliant.Microsoft Corp.E v a l u a t e s : M A X 7321Quick StartRequired Equipment•MAX7321 EV kit (USB cable included)•A user-supplied Windows 2000/XP- or WindowsVista-compatible PC with a spare USB portNote:In the following sections, software-related items are identified by bolding. Text in bold refers to items directly from the EV kit software. Text in bold and under-lined refers to items from the Windows operating system.ProcedureThe MAX7321 EV kit is fully assembled and tested.Follow the steps below to verify board operation:1)Visit /evkitsoftware to down-load the latest version of the EV kit software,7321Rxx.ZIP. Save the EV kit software to a tempo-rary folder and uncompress the ZIP file.2)Install the EV kit software on your computer by run-ning the INSTALL.EXE program inside the temporary folder. The program files are copied and icons are created in the Windows Start | Programs menu.3)Verify that all jumpers (JU1–JU8) are in their defaultpositions, as shown in Table 1.MAX7321 Evaluation Kit 2_______________________________________________________________________________________Component List (continued)MAX7321 EV Kit FilesµMAX is a registered trademark of Maxim Integrated Products, Inc.4)Connect the USB cable from the PC to the EV kitboard. A New Hardware Found window pops up when installing the USB driver for the first time. If you do not see a window that is similar to the one described above after 30 seconds, remove the USB cable from the board and reconnect it.Administrator privileges are required to install the USB device driver on Windows.5)Follow the directions of the Add New HardwareWizard to install the USB device driver. Choose the Search for the best driver for your device option.Specify the location of the device driver to be C:\Program Files\M AX7321(default installation directory) using the Browse button. During device driver installation, Windows may show a warning message indicating that the device driver Maxim uses does not contain a digital signature. This is not an error condition and it is safe to proceed with installation. Refer to the USB_Driver_Help.PDF doc-ument included with the software for additional information.6)Start the MAX7321 EV kit software by opening itsicon in the Start | Programs menu. The EV kit soft-ware main window appears, as shown in Figure 1.7)Verify that the P0–P7 port states are set to 1 (set asinputs). Write 0 to P0–P7 to drive low by checkingthe corresponding checkboxes on the GUI interface.P0–P3 have LEDs that light up when the port statesare set to 0.Detailed Description of Software The main window of the MAX7321 EV kit is shown inFigure 1.To write to P0–P7, check the corresponding checkboxand press the Write button. The port state appears nextto the port checkbox. The port state can only be 0or 1.To read from P0–P7, press the Read Byte button. Toread P0–P7 and their respective transition flags, pressthe Read 2 Bytes button. Reading 2 bytes alwaysreturns 0when the port state is set to 0. When P0–P7port states are set to 1, P0–P7 are configured as inputsand pressing the Read 2 Bytes button returns both thecurrent state and the transition flag.Evaluates: MAX7321 MAX7321 Evaluation KitTable 1. MAX7321 EV Kit Jumper Descriptions (JU1–JU8)E v a l u a t e s : M A X 7321MAX7321 Evaluation Kit 4_______________________________________________________________________________________Figure 1. MAX7321 EV Kit Software Main WindowThe AutoWrite and AutoRead checkboxes can be checked to have the software automatically perform write and read operations. AutoWrite allows the user to change port states without pressing the Write button.AutoRead allows pushbutton inputs to be read without pressing the Read buttons. There are two AutoRead checkboxes, but only one can be pressed at a time.The I2C Address drop-down list has a feature to AutoDetect . Users have the option to choose their own I 2C address from the list, even if that address is not detected. When an address is selected that is not detected, the software GUI displays MAX7321EVKit not connected in the status bar.Advanced User InterfaceA serial interface can be used by advanced users by selecting Options | Interface (Advanced Users)from the menu bar.For I 2C, select the 2-wire interface tab, as shown in Figure 2. Press the Hunt for active listeners button to obtain the current MAX7321 slave address in the Target Device Address combo box. In the General commands tab, select 1 – SM BusSend-Byte(addr,cmd)in the Command drop-down list. Enter the desired values into the Command byte combo box and press the Execute button.Detailed Description of HardwareThe MAX7321 EV kit provides a proven layout for the MAX7321. Jumper blocks JU1 and JU3 select the I 2C device address (refer to the MAX7321 IC data sheet for detailed information). H eaders H 2 and H 3 provide labeled test points for all of the MAX7321 pins. Ports P0–P3 have LEDs. Ports P2 and P3 can be tied together to double the LED current on D7 by changing the shunt position on JU7 and JU8. Ports P4–P7 do not include LEDs for customized port testing. All ports have momen-tary pushbutton switches.Evaluates: MAX7321MAX7321 Evaluation Kit_______________________________________________________________________________________5Figure 2. Advanced User Interface WindowE v a l u a t e s : M A X 7321User-Supplied Power SupplyThe MAX7321 EV kit is powered completely from the USB port by default. By default, V+ is 3.3V and the port voltage is 3.3V. To set the port (LED) voltage indepen-dent of V+, move the shunt on JU4 to the 1-2 position and provide a positive voltage on the VPEXT pad. To set a different voltage on V+, move the shunt on JU2 to the 2-3 position and provide a positive voltage on the EXT_V+ pad.User-Supplied I 2C InterfaceThe MAX7321 EV kit uses the on-board SDA and SCL by default. For user-supplied I 2C, change the shunt position on JU5 and JU6 to the 2-3 position. JU5 con-nects to the EXT_SCL pad and JU6 connects to the EXT_SDA pad. If supplying I 2C, make sure to pull up the SDA and SCL lines to V+ or to an external voltage.MAX7321 Evaluation Kit 6_______________________________________________________________________________________Evaluates: MAX7321MAX7321 Evaluation Kit_______________________________________________________________________________________7Figure 3a. MAX7321 EV Kit Schematic (1 of 3)E v a l u a t e s : M A X 7321MAX7321 Evaluation Kit 8_______________________________________________________________________________________Figure 3b. MAX7321 EV Kit Schematic (2 of 3)Evaluates: MAX7321MAX7321 Evaluation Kit_______________________________________________________________________________________9Figure 3c. MAX7321 EV Kit Schematic (3 of 3)E v a l u a t e s : M A X 7321MAX7321 Evaluation Kit 10______________________________________________________________________________________Figure 4. MAX7321 EV Kit Component Placement Guide—Component SideEvaluates: MAX7321MAX7321 Evaluation Kit______________________________________________________________________________________11Figure 5. MAX7321 EV Kit PCB Layout—Component SideMaxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.12__________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©2009 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.E v a l u a t e s : M A X 7321MAX7321 Evaluation KitFigure 6. MAX7321 EV Kit PCB Layout—Solder Side。
MAXIM MAX3397E 数据手册
General DescriptionThe MAX3397E ±15kV ESD-protected bidirectional level translator provides level shifting for data transfer in a multivoltage system. Externally applied voltages, V CC and V L , set the logic levels on either side of the device.A logic-low signal present on the V L side of the device appears as a logic-low signal on the V CC side of the device, and vice versa. The MAX3397E utilizes a trans-mission-gate-based design to allow data translation in either direction (V L ↔V CC ) on any single data line. The MAX3397E accepts V L from +1.2V to +5.5V and V CC from +1.65V to +5.5V, making the device ideal for data transfer between low-voltage ASI Cs/PLDs and higher voltage systems.The MAX3397E features a shutdown mode that reduces supply current to less than 1µA, thermal short-circuit pro-tection, and ±15kV ESD protection on the V CC side for greater protection in applications that route signals exter-nally. The MAX3397E operates at a guaranteed data rate of 8Mbps over the entire specified operating voltage range. Within specific voltage domains, higher data rates are possible. See the Timing Characteristics table.The MAX3397E is available in an 8-pin µDFN package and specified over the extended -40°C to +85°C oper-ating temperature range.ApplicationsCell Phones, MP3 Players Telecommunications EquipmentSPI™, MICROWIRE™, and I 2C Level Translation Portable POS Systems, Smart Card Readers Low-Cost Serial Interfaces, GPSFeatures♦Bidirectional Level Translation ♦Guaranteed Data Rate8Mbps (+1.2V ≤V L ≤V CC ≤+5.5V)16Mbps (+1.8V ≤V L ≤V CC ≤+3.3V)♦Extended ESD Protection on the I/O V CC Lines±15kV Human Body Model±15kV Air-Gap Discharge per IEC 61000-4-2±8kV Contact Discharge per IEC 61000-4-2♦Enable/Shutdown♦Ultra-Low 1µA Supply Current in Shutdown Mode ♦8-Pin µDFN PackageMAX3397EDual Bidirectional Low-LevelTranslator in µDFN________________________________________________________________Maxim Integrated Products1For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .Typical Application Circuit appears at end of data sheet.SPI is a trademark of Motorola, Inc.MICROWIRE is a trademark of National Semiconductor Corp.+Denotes a lead-free package.Pin ConfigurationM A X 3397EDual Bidirectional Low-Level Translator in µDFN 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.(All voltages referenced to GND.)V CC , V L .....................................................................-0.3V to +6V I/O V CC_......................................................-0.3V to (V CC + 0.3V)I/O V L_..........................................................-0.3V to (V L + 0.3V)EN.............................................................................-0.3V to +6V Short-Circuit Duration I/O V L_, I/O V CC_to GND .......ContinuousContinuous Power Dissipation (T A = +70°C)8-Pin µDFN (derate 4.8mW/°C above +70°C)............381mW Operating Temperature Range ...........................-40°C to +85°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°CELECTRICAL CHARACTERISTICSMAX3397EDual Bidirectional Low-LevelTranslator in µDFNELECTRICAL CHARACTERISTICS (continued)(V CC = +1.65V to +5.5V, V L = +1.2V to 5.5V, I/O V L_, and I/O V CC_are unconnected, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V = +3.3V, V = +1.8V, T = +25°C.) (Notes 1, 2)TIMING CHARACTERISTICSM A X 3397EDual Bidirectional Low-Level Translator in µDFN 4_______________________________________________________________________________________Note 1:All units are 100% production tested at T A = +25°C. Limits over the operating temperature range are guaranteed by designand not production tested.Note 2:For normal operation, ensure V L <(V CC + 0.3V).Note 3:When V CC is below V L by more than the tri-state threshold, the device turns off its pullup resistors and I/O_ enters tri-state.The device is not in shutdown.Note 4:To ensure maximum ESD protection, place a 1µF capacitor between V CC and GND. See the Typical Application Circuit .Note 5:10% of input to 90% of output.Note 6:90% of input to 10% of output.TIMING CHARACTERISTICS (continued)(V = +1.65V to +5.5V, V = +1.2V to +5.5V, R = 1M Ω, C = 15pF, driver output impedance ≤50Ω, I /O test signal of Typical Operating Characteristics(V CC = +3.3V, V L = +1.8V, R LOAD = 1M Ω, C LOAD = 15pF, T A = +25°C, data rate = 8Mbps, unless otherwise noted.)0100502001502503001.653.303.852.202.754.404.955.50V L SUPPLY CURRENT vs. V CC SUPPLY VOLTAGE(DRIVING ONE I/O V L_)M A X 3397E t o c 01V CC SUPPLY VOLTAGE (V)V L S U P P L Y C U R R E N T (μA )501501002002501.652.752.203.303.854.404.955.50V L SUPPLY CURRENT vs. V CC SUPPLY VOLTAGE(DRIVING ONE I/O V CC_)M A X 3397E t o c 02V CC SUPPLY VOLTAGE (V)V L S U P P L Y C U R R E N T (μA )03001002005004007006008001.21.92.63.3V CC SUPPLY CURRENT vs. V L SUPPLY VOLTAGE(DRIVING ONE I/O V L_)M A X 3397E t o c 03V L SUPPLY VOLTAGE (V)V C C S U P P L Y C U R R E N T (μA )MAX3397EDual Bidirectional Low-LevelTranslator in µDFN_______________________________________________________________________________________50100502001503002503501.21.92.63.3V CC SUPPLY CURRENT vs. V L SUPPLY VOLTAGE(DRIVING ONE I/O V CC_)M A X 3397E t o c 04V L SUPPLY VOLTAGE (V)V C C S U P P L Y C U R R E N T (μA )60402080100120140160180200-4010-15356085V L SUPPLY CURRENT vs. TEMPERATURE(DRIVING ONE I/O V L_)M A X 3397E t o c 05TEMPERATURE (°C)V L S U P P L Y C U R R E N T (μA )10050200150300250350-4010-15356085V L SUPPLY CURRENT vs. TEMPERATURE(DRIVING ONE I/O V CC_)M A X 3397E t o c 06TEMPERATURE (°C)V L S U P P L Y C U R R E N T (μA )04020806012010014002010304052515354550V L SUPPLY CURRENT vs. CAPACITIVE LOAD(DRIVING ONE I/O V L_)M A X 3397E t o c 07CAPACITIVE LOAD (pF)V L S U P P L Y C U R R E N T (μA )6004002008001000120002015510253035404550V CC SUPPLY CURRENT vs. CAPACITIVE LOAD(DRIVING ONE I/O V L_)M A X 3397E t o c 08CAPACITIVE LOAD (pF)V C C S U P P L Y C U R R E N T (μA )5101520252025101553035404550RISE/FALL TIME vs. CAPACITIVE LOAD(DRIVING ONE I/O V L_)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )06428101202015510253035404550PROPAGATION DELAY vs. CAPACITIVE LOAD(DRIVING ONE I/O V L_)M A X 3397E t o c 10CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )642810122015510253035404550RISE/FALL TIME vs. CAPACITIVE LOAD(DRIVING ONE I/O V CC_)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )214365798101015205253035454050PROPAGATION DELAY vs. CAPACITIVE LOAD(DRIVING ONE I/O V CC_)CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )M A X 3397E t o c 12M A X 3397EDual Bidirectional Low-Level Translator in µDFN 6_______________________________________________________________________________________Detailed DescriptionThe MAX3397E bidirectional, ESD-protected level translator provides the level shifting necessary to allow data transfer in a multivoltage system. Externally applied voltages, V CC and V L , set the logic levels on either side of the device. A logic-low signal present on the V L side of the device appears as a logic-low signal on the V CC side of the device, and vice versa. The device uses a transmission-gate-based design (see the Functional Diagram ) to allow data translation in either direction (V L ↔V CC ) on any single data line. The MAX3397E accepts V L from +1.2V to +5.5V and V CCfrom +1.65V to +5.5V, making the device ideal for data transfer between low-voltage ASI Cs/PLDs and higher voltage systems.The MAX3397E features a shutdown mode that reduces the supply current to less than 1µA, thermal short-circuit protection, and ±15kV ESD protection on the V CC side for greater protection in applications that route signals externally. The device operates at a guar-anteed data rate of 8Mbps over the entire specified operating voltage range. Within specific voltage domains, higher data rates are possible. See the Timing Characteristics table.Typical Operating Characteristics (continued)(V CC = +3.3V, V L = +1.8V, R LOAD = 1M Ω, C LOAD = 15pF, T A = +25°C, data rate = 8Mbps, unless otherwise noted.)RAIL-TO-RAIL DRIVING (DRIVING ONE I/O V L_)MAX3397E toc1320ns/divI/O V L_I/O V CC_1V/div1V/divEXITING SHUTDOWN MODEMAX3397E toc142μs/divI/O V CC_EN2V/divI/O V L_1V/div1V/divMAX3397EDual Bidirectional Low-LevelTranslator in µDFN_______________________________________________________________________________________7Level TranslationFor proper operation, ensure that +1.65V ≤V CC ≤+5.5V and +1.2V ≤V L ≤+5.5V. During power-up sequencing,V L ≥(V CC + 0.3V) does not damage the device. The speed-up circuitry limits the maximum data rate for the MAX3397E to 16Mbps. The maximum data rate also depends heavily on the load capacitance (see the Typical Operating Characteristics ), output impedance of the driver, and the operational voltage range (see the Timing Characteristics table).Rise-Time AcceleratorsThe MAX3397E has an internal rise-time accelerator,allowing operation up to 16Mbps. The rise-time accelera-tors are present on both sides of the device and act to speed up the rise time of the input and output of the device, regardless of the direction of the data. The trig-gering mechanism for these accelerators is both level and edge sensitive. To prevent false triggering of the rise-time accelerators, signal fall times of less than20ns/V are recommended for both the inputs and outputs of the device. Under less noisy conditions, longer signal fall times are acceptable. Note:To guarantee operation of the rise time, accelerators the maximum parasitic capacitance should be less than 200pF on the I/O lines.Shutdown ModeDrive EN low to place the MAX3397E in shutdown mode. Connect EN to V L or V CC (logic-high) for normal operation. Activating the shutdown mode disconnects the internal 10k Ωpullup resistors on the I /O V CC and I/O V L lines. This forces the I/O lines to a high-imped-ance state, and decreases the supply current to less than 1µA. The high-impedance I /O lines in shutdown mode allow for use in a multidrop network. The MAX3397E effectively has a diode from each I/O to the corresponding supply rail and GND. Therefore, when in shutdown mode, do not allow the voltage at I/O V L_to exceed (V L + 0.3V), or the voltage at I /O V CC_ to exceed (V CC + 0.3V).Figure 1a. Rail-to-Rail Driving I/O V L Figure 1b. Rail-to-Rail Driving I/O V CCM A X 3397EDual Bidirectional Low-Level Translator in µDFN 8_______________________________________________________________________________________Operation with One Supply DisconnectedCertain applications require sections of circuitry to be disconnected to save power. When V L is connected and V CC is disconnected or connected to ground, the device enters shutdown mode. In this mode, I/O V L can still be driven without damage to the device; however, data does not translate from I /O V L to I /O V CC . I f V CC falls more than 0.8V (typ) below V L , the device disconnects the pullup resistors at I /O V L and I /O V CC . To achieve the lowest possible supply current from V L when V CC is disconnected, it is recommended that the voltage at the V CC supply input be approximately equal to GND. Note:When V CC is disconnected or connected to ground, I/O V CC must not be driven more than V CC + 0.3V.When V CC is connected and V L is less than 0.7V (typ),the device enters shutdown mode. I n this mode, I /O V CC can still be driven without damage to the device;however, data does not translate from I/O V CC to I/O V L .Note: When V L is disconnected or connected to ground, I/O V L must not be driven more than V L + 0.3V.Thermal Short-Circuit ProtectionThermal-overload detection protects the MAX3397E from short-circuit fault conditions. I n the event of a short-circuit fault, when the junction temperature (T J )reaches +150°C, a thermal sensor signals the shut-down mode logic to force the device into shutdown mode. When the T J has cooled to +140°C, normal operation resumes.±15kV ESD ProtectionAs with all Maxim devices, ESD-protection structures are incorporated on all pins to protect against electro-static discharges encountered during handling and assembly. The I /O V CC lines have extra protection against static electricity. Maxim’s engineers have developed state-of-the-art structures to protect these pins against ESD of ±15kV without damage. The ESD structures withstand high ESD in all states: normal operation, shutdown mode, and powered down. After an ESD event, Maxim’s E versions keep working withoutFigure 1c. Open-Drain Driving I/O V L Figure 1d. Open-Drain Driving I/O V CCMAX3397EDual Bidirectional Low-LevelTranslator in µDFN_______________________________________________________________________________________9latchup, whereas competing products can latch and must be powered down to remove latchup. ESD protec-tion can be tested in various ways. The I/O V CC lines of the MAX3397E are characterized for protection to the following limits:1)±15kV using the Human Body Model2)±8kV using the Contact Discharge method specifiedby IEC 61000-4-23)±15kV using the Air-Gap Discharge method specifiedby IEC 61000-4-2ESD Test ConditionsESD performance depends on a variety of conditions.Contact Maxim for a reliability report that documents test setup, test methodology, and test results.Human Body ModelFigure 2a shows the Human Body Model, and Figure 2b shows the current waveform it generates when dis-charged into a low-impedance state. This model con-sists of a 100pF capacitor charged to the ESD voltage of interest that is then discharged into the test device through a 1.5k Ωresistor.IEC 61000-4-2The I EC 61000-4-2 standard covers ESD testing and performance of finished equipment; it does not specifi-cally refer to integrated circuits. The MAX3397E helpsFigure 2b. Human Body Current WaveformFigure 2a. Human Body ESD Test ModelM A X 3397EDual Bidirectional Low-Level Translator in µDFN10______________________________________________________________________________________to design equipment that meets Level 4 of IEC 61000-4-2 without the need for additional ESD-protection com-ponents.The major difference between tests done using the Human Body Model and IEC 61000-4-2 is higher peak current in I EC 61000-4-2 because series resistance is lower in the I EC 61000-4-2 model. Hence, the ESD withstand voltage measured to IEC 61000-4-2 is gener-ally lower than that measured using the Human Body Model. Figure 3a shows the IEC 61000-4-2 model, and Figure 3b shows the current waveform for the ±8kV,IEC 61000-4-2, Level 4, ESD contact-discharge test.The Air-Gap test involves approaching the device with a charged probe. The contact-discharge method connects the probe to the device before the probe is energized.Machine ModelThe Machine Model for ESD tests all pins using a 200pF storage capacitor and zero discharge resis-tance. Its objective is to emulate the stress caused by contact that occurs with handling and assembly during manufacturing. Of course, all pins require this protec-tion during manufacturing, not just inputs and outputs.Therefore, after PCB assembly, the Machine Model is less relevant to I/O ports.Applications InformationPower-Supply DecouplingTo reduce ripple and the chance of transmitting incorrect data, bypass V L and V CC to ground with a 0.1µF capaci-tor (see the Typical Application Circuit ). To ensure full ±15kV ESD protection, bypass V CC to ground with a 1µF capacitor. Place all capacitors as close as possible to the power-supply inputs.I 2C Level TranslationThe MAX3397E level-shifts the data present on the I/O lines between +1.2V and +5.5V, making them ideal for level translation between a low-voltage ASI C and an I 2C device. A typical application involves interfacing a low-voltage microprocessor to a 3V or 5V D/A convert-er, such as the MAX517.Push-Pull vs. Open-Drain DrivingThe MAX3397E can be driven in a push-pull configura-tion and include internal 10k Ωresistors that pull up I/O V L_and I /O V CC_to their respective power supplies,allowing operation of the I /O lines with open-drain devices. See the Timing Characteristics table for maxi-mum data rates when using open-drain drivers.Chip InformationPROCESS: BiCMOSFigure 3b. IEC 61000-4-2 ESD Generator Current Waveform Figure 3a. IEC 61000-4-2 ESD Test ModelMAX3397EDual Bidirectional Low-LevelTranslator in µDFN______________________________________________________________________________________11Typical Application CircuitM A X 3397EDual Bidirectional Low-Level Translator in µDFN 12______________________________________________________________________________________Package Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)MAX3397EDual Bidirectional Low-LevelTranslator in µDFNMaxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________13©2007 Maxim Integrated Productsis a registered trademark of Maxim Integrated Products, Inc.Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)。
MCZ33976EG;MCZ33976EGR2;中文规格书,Datasheet资料
H-Bridge Outputs 1 Each of these pins is the output pin of a half bridge, designed to source or sink current.
Analog Integrated Circuit Device Data Freescale Semiconductor /
33976
2 /
Analog Integrated Circuit Device Data Freescale Semiconductor
PIN CONNECTIONS
PIN CONNECTIONS
COS0+
1
COS0-
2
SIN0+
3
SIN0-
4
GND
5
GND
6
GND
Chip Select
This pin is connected to a chip select output of a LSI IC.
Serial Clock
This pin is connected to the SCLK pin of the master device and acts as a bit clock for the SPI port.
This pin is connected to the SPI Serial Data Output pin of the master device from which it receives output command data.
Multiplexed Output This is a multiplexed output pin for the non-driven coil, during a Return to Zero (RTZ) event.
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General DescriptionThe MAX3397E evaluation kit (EV kit) is a fully assem-bled and tested printed-circuit board (PCB) that demonstrates the capabilities of the MAX3397E ESD-protected, dual bidirectional low-level translator. The MAX3397E allows data translation in either direction (V L ↔V CC ) on any single data line. The MAX3397E EV kit accepts V L from +1.2V to +5.5V and V CC from +1.65V to +5.5V. The EV kit comes with the MAX3397EELA+installed.Features♦Jumper-Selectable Enable/Shutdown Configuration ♦+1.2V to +5.5V Supply Range for V L ♦+1.65V to +5.5V Supply Range for V CC ♦Proven PCB Layout♦Fully Assembled and TestedEvaluates: MAX3397EMAX3397E Evaluation Kit________________________________________________________________Maxim Integrated Products 119-0972; Rev 0; 8/07For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,or visit Maxim’s website at .Ordering InformationComponent Supplier+E v a l u a t e s : M A X 3397EMAX3397E Evaluation Kit 2_______________________________________________________________________________________Quick StartRecommended EquipmentBefore beginning, the following equipment is needed: •One +5V DC power supply •One +3.3V DC power supply •One function generator •One oscilloscopeProcedureThe MAX3397E EV kit is fully assembled and tested.Follow the steps below to verify board operation.Caution: Do not turn on power supplies until all con-nections are completed.1)Turn off the +5V DC and +3.3V DC power supplies.2)Turn off the function generator.3)Make sure the shunt is on pin 1-2 of JU1.4)Connect the positive (+) terminal of the +5V DCpower supply to the VCC pad and connect the neg-ative (-) terminal to the adjacent GND pad.5)Connect the positive (+) terminal of the +3.3V DCpower supply to the VL pad and connect the nega-tive (-) terminal to the adjacent GND pad.6)Connect the positive (+) terminal of the functiongenerator to I/OVCC1 pad of the MAX3397E EV kit.Connect the negative (-) terminal of the DC signal source to the GND pad.7)Turn on the +5V DC and +3.3V DC power supplies.8)Turn on the function generator.9)Set the function generator to a 5V P-P , 1MHz, 2.5VDC offset square wave.10)Use the oscilloscope to measure the I/O V L1output atpin 5. Verify that the waveform is a 1MHz square wave and is approximately 3.3 V P-P with 1.625V DC offset.Detailed Description of HardwareThe MAX3397E is an ESD-protected, dual bidirectional low-level translator. The MAX3397E EV kit board pro-vides a proven layout for evaluating the MAX3397E.The EV kit comes with a MAX3397EELA+ installed.Enable/Shutdown ControlPlace the shunt on pin 1-2 of JU1 (as shown in Table 1)to drive the EN pin of the MAX3397E high and to enable the device. Place the shunt on pin 2-3 of JU1 to drive the EN pin of the MAX3397E low and to put the device in shutdown state.Power SupplyThe MAX3397E accepts V L from +1.2V to +5.5V and V CC from +1.65V to +5.5V. The voltage on V L must be less than or equal to the voltage on V CC .When V L is connected and V CC is disconnected or connected to ground, the device enters shutdown mode. In this mode, I/O V L can still be driven without damage to the device; however, data does not translate from I/O V L to I/O V CC . If V CC falls more than +0.8V (typ) below V L , the device disconnects the pullup resis-tors at I/O V L and I/O V CC . To achieve the lowest possi-ble supply current from V L when V CC is disconnected,it is recommended that the voltage at the V CC supply input be approximately equal to GND.Evaluates: MAX3397EMAX3397E Evaluation Kit3Figure 1. MAX3397E EV Kit SchematicFigure 3. MAX3397E EV Kit PCB Layout—Component SideMaxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.4_____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©2007 Maxim Integrated Productsis a registered trademark of Maxim Integrated Products, Inc.E v a l u a t e s : M A X 3397EMAX3397E Evaluation Kit Figure 4. MAX3397E EV Kit PCB Layout—Solder Side。