CXA7002R中文资料
Omega FP7002 FP7002A流动性和温度传感器指南说明书
FP7002/FP7002A Flow/Temperature Transmitter e-mail:**************For latest product manuals: Shop online at User’s Guide***********************The information contained in this document is believed to be correct, but OMEGA accepts no liability for any errors it contains, and reserves the right to alter specifications without notice.Servicing North America:U.S.A. Omega Engineering, Inc. Headquarters: Toll-Free: 1-800-826-6342 (USA & Canada only) Customer Service: 1-800-622-2378 (USA & Canada only) Engineering Service: 1-800-872-9436 (USA & Canada only) Tel: (203) 359-1660 Fax: (203) 359-7700 e-mail:************** For Other Locations Visit /worldwideFP7002/FP7002A FLOW/TEMPERATURE TRANSMITTERSECTION PAGESection 1 - General Description ......................... 1Section 2 - Installation ................................. 12.1 Unpacking ..................................... (1)2.2 Important Considerations Before Installation (1)2.3 Flowmeter Installation .................................... 22.4 Electrical Connections (4)Section 3 - Maintenance ................................ 5Section 4 - Calibration ................................. 54.1 Flow Calibration .. (5)4.2 Temperature Calibration .................................. 64.3 Calibration Setup . (7)Section 5 - Specifications ............................... 9iYour FP7002/FP7002A has been designed for ease of use and flexibility. It is important that you read this user’s manual completely and follow all safety precautions before operating your unit.Precautions 1. F OLLOW ALL SAFETY PRECAUTIONS AND OPERATING INSTRUCTIONS OUTLINED IN THIS MANUAL.3. A DD ADDITIONAL SAFEGUARDS TO YOUR SYSTEM IN CRITICAL APPLICATIONS WHERE DAMAGE OR INJURY MAY RESULT FROM SENSOR FAILURE.5. D O NOT OPERATE IN FLAMMABLE OR EXPLOSIVE ENVIRONMENTS.6. D O NOT USE IN HUMAN MEDICAL OR NUCLEAR APPLICATIONS.7. N EVER OPERATE WITH A POWER SOURCE OTHER THAN WHAT IS SPECIFIED IN THIS MANUAL.8. R EMOVE AND/OR DISCONNECT POWER SOURCE BEFORE ATTEMPTING INSTALLATION OR MAINTENANCE.9. A LWAYS OPERATE YOUR UNIT WITH THE SHIELD WIRE CONNECTED TO EARTH GROUND.10. I NSTALLATION AND WIRING SHOULD BE DONE BY There are no user serviceable parts inside your unit. Attempting to open, repair or service your unit may void your warranty.iiThe FP7002 flow/temperature transmitter is ideal for monitoring of typical industrial water flows and temperature, from hard-to-handle corrosive aqueous solutions to high purity fluids. The FP7002 uses a paddlewheel-like rotor whose motion is converted into a pulse output. This pulse output is converted to a 4 - 20 mA (or 1 - 5 Vdc) analog output by the built-in signal conditioner. A solid state temperature sensor built into the sensor body provides a separate 4 - 20 mA (or 1 - 5 Vdc) analog output directly proportional to changes in fluid temperature. These independent analog outputs can be run long distances to a panel meter, controller or computer.A complete flow measurement system consists of the flow sensor/transmitter, the installation fitting and a readout device. The FP7002 has polypropylene, 316SS, and FKM wetted parts. The schedule 40 PVC tee fittings are supplied with a PVC locking nut, and the galvanized iron tee fittings are supplied with a brass locking nut to provide a secure metal to-metal mounting to the threaded brass insert.Section 2 - Installation2.1 UnpackingRemove the Packing List and verify that you have received all equipment. If you have any questions about the shipment, please call the OMEGA Customer Service Department.When you receive the shipment, inspect the container and equipment for any signs of damage. Note any evidence of rough handling in The carrier will not honor any claims unless all shipping material is saved for their examination. After examining and removing contents, save packing material and carton in the event that reshipment is necessary.THE FP7002 PADDLEWHEEL FLOW TRANSMITTER IS NOT EXPLOSION-PROOF, NOR IS IT INTRINSICALLY SAFE. IT IS NOT TO BE USED FOR FLAMMABLE OR HAZARDOUS LIQUIDS, NOR CAN IT BE USED IN HAZARDOUS AREAS.The FP7002 is intended for use with water and other low viscosity liquids ONLY; it can NOT be used with oils and other viscous 1up to 5 centipoise viscosity, but field calibration is recommended for accurate measurements.It is important to note that most process water contains dissolved minerals. If the flowsensor is repeatedly exposed to process water and then the line is allowed to dry, these dissolved minerals will deposit onto the FP7002 and will inhibit the low flowrate operation of the sensor. If this occurs, cleaning of the sensor is recommended.WATER HAMMER AND SURGES CAN BE DAMAGING TO ANY FLOWMETER AND MUST ALWAYS BE AVOIDED.WATER HAMMER OCCURS WHEN A LIQUID FLOW IS SUDDENLY STOPPED AS WITH QUICK CLOSING AND SOLENOID OPERATED VALVES. SURGES OCCUR WHEN FLOW IS SUDDENLY BEGUN, AS WHEN A PUMP IS TURNED ON AT FULL POWER OR A VALVE IS QUICKLY OPENED.LIQUID SURGES ARE PARTICULARLY DAMAGING TO FLOWMETERS IF THE PIPE IS ORIGINALLY EMPTY. TO AVOID DAMAGING SURGES, FLUID LINES SHOULD REMAIN FULL (IF POSSIBLE) AND PUMPS SHOULD BE BROUGHT UP TO POWER AND VALVES OPENED SLOWLY. IN ADDITION, TO AVOID BOTH WATER HAMMER AND SURGES, A SURGE CHAMBER SHOULD BE INSTALLED.2.3 Flowmeter InstallationThe FP7002 can be mounted in vertical or horizontal pipe runs; however, the pipe must be full of liquid for proper readings. Thus, the sensor should not be mounted in vertical pipe where the liquid flows down, since the pipe may not always be full in this situation. Refer to Figures 2-1 and 2-2.23FLOW Figure 2-1. Horizontal Mounting Position FLOWFigure 2-2. Vertical Mounting Position4o’clock position) because this is where sediment in the liquid will tend to accumulate. The best mounting location is at or near the 12 o’clock position, so long as bubbles are not present in the liquid. The 3 o’clock and 9 o’clock positions are also acceptable. In an upward flowing vertical pipe, the flowsensor can be mounted anywhere around the pipe.As with many flowmeters, the FP7002 requires a fully developed flow profile in order to provide accurate readings. To insure this, a length of straight pipe run before and after the flowmeter is required. The amount of upstream straight pipe run that is required depends upon the type of obstruction which is immediately upstream of the flowsensor. See Table 2-1 for specific requirements. Downstream of the flowsensor, in all situations, only 5 diameters of straight pipe run is required, regardless of the downstream obstruction.*Oscillating or reciprocating pumps, which produce flow and pressure pulses in the flowstream, are not recommended for use with the FP7002If you do not have the proper amount of straight piperun available at your desired installation location, it isrecommended to use flow straighteners to decrease therequired straight run.The paddlewheel must be aligned with the fluid flow; the installation fitting is supplied with an alignment tab which mates with a flat on the base of the paddlewheel sensor to insure proper sensor alignment. When using the PVC installation fitting, it is critical that the cap of the sensor is threaded onto the mating fitting HAND TIGHT ONLY; use of pipe wrenches, etc. on the plastic cap can lead to damage to the cap and/or the installation fitting.magnets will tend to attract rust from the flowing fluid. Thus, it is NOT recommended to install the FP7002 in pipes which under typical conditions contain rust, such as in cast iron, black iron, carbon steel and other iron pipes (galvanized pipe has been treated to resist rust). In situations where rust can not be avoided, it is recommended to install a fine magnetic filter at least 50 pipe diameters upstream from the FP7002 and to periodically shut down the line and remove the sensor from theinstallation fitting for cleaning.All electrical connections and wiring should be performed by suitably trained personnel only.To insure proper hook-up to your indicating device, the paddles of the FP7002 can be spun in the open air by blowing onto them before the sensor is installed into the installation fitting.This is particularly important where the pipeline can not be conveniently shut down and the sensor removed after installation.Figure 2-3. Basic Wiring Diagram6Except for intermittent removal of the sensor from the flow line for cleaning, there is no routine maintenance for the FP7002.Section 4 - Calibration4.1 Flow CalibrationEquipment Required:12-18 Vdc Regulated Power SupplyFrequency Generator/Calibrator (such as OMEGA Model: CL123)Multimeter (such as OMEGA Model: HHM290)Small jeweler’s type common blade screwdriverCalibration Procedure:1. Unscrew and remove the protection head cover.2. Make wiring connections to the transmitter as shown on page 7.3. Apply power and allow the unit to warm up for 10 minutes.4. D etermine the maximum volumetric flow rate expected by theapplication.For our example we will use “GPM”. This will be “GPM Max”5. F rom the table on page 8, determine the proper “K-Factor” for themodel fitting you will be using.6. D etermine your full scale calibration frequency using this formula.This will be “F Max”.F Max = K-Factor x GPM Max60Example:U sing a Model FP7015 Tee Fitting with a K-Factor of 29.46and a GPM Max of 125.29.46 x 125 GPM = 61.38 for your F Max607. S et your frequency generator for an output of 0 Hz. Adjust the zeropotentiometer (P1) for a 4.00 mA output.8. S et your frequency generator for the “F Max” you calculated above.Adjust the span potentiometer (P2) for a 20.00 mA output.9. S et your frequency generator for one half the “F Max” you calculatedabove. You should have an output reading of 12.00 mA +/- 0.16 mA.If not, repeat steps 7 & 8.10. R e-install 10 k resistor across terminals 5 and 6 and re-install whitewire to terminal 5.11. Calibration complete.74.2 Temperature CalibrationEquipment Required:12-18 Vdc Regulated Power SupplyType-K Thermocouple Probe (such as OMEGA Model: KTSS-HH) Multimeter (such as OMEGA Model: HHM290) Small potentiometer adjustment tool Calibration Procedure:1. Unscrew and remove the protection head cover.2. Make wiring connections to the transmitter as shown on page 7.3. Apply power and allow the unit to warm up for 10 minutes.4. P lace a reference temperature probe next to the body of thepaddlewheel flow sensor with the unit removed from the flow line and lying on a work bench. 5. C onnect the reference probe to a thermometer and allow the reading to stabilize for a few minutes. Record the reference probe reading as “Rtemp”6. C alculate the correct current output that the transmitter should have for the ambient temperature your flow sensor and reference probe are exposed to using this formula.0.16 x Rtemp + 4 = output settingExample: If your reference probe is reading 23.4°C0.16 x 23.4 + 4 = 7.74 mA7. A djust potentiometer P3 for the correct current output you calculated above.8. Calibration complete.84.3 Calibration Setup4.3.1 Flow Calibration Setup4.3.2 Temperature Calibration SetupFigure 4-2. Temperature Calibration SetupP3THERMOMETERSensor/TransmitterFP7002 Polypropylene body/316SS shaftFlow TransmitterAccuracy:± 2% of full scaleRepeatability:± 1% of full scalePower:Regulated 9 to 18 Vdc @ 50 mA maxInput:DC Pulse from PaddlewheelOutput:3-Wire 4 to 20 mA or 1 to 5 VdcMax Loop Resistance:Ohms = (V supply - 9 V)/0.02 A Temperature TransmitterAccuracy:± 1.7°C (3°F)Repeatability:± 0.2°C (0.4°F)Range:0 to 100°C (32 to 212°F)Power:Regulated 9 to 18 Vdc @ 30 mA maxOutput:2-Wire 4 to 20 mA or 1 to 5 VdcMax Loop Resistance:Ohms = (V supply - 9 V)/0.02 A GeneralNON-WETTED MATERIALSTransmitter Housing:NEMA Rated - P ainted Cast AluminumWETTED MATERIALSSensor Body:P olypropylene body (PVDF optional),PVDF paddle, Viton O-ring, 316SS shaft.Model FP7002A includes brass lockingnut. Model FP7002 includes PVC lockingnut.MAX, RECOMMENDEDFLUID VISCOSITY: 5 centipoiseFLUID TEMPERATURE/Do not exceed the maximum ratings ofPRESSURE RANGE:y our piping. Depending on the materialof the fitting, the operating temperature/pressure may be limited by your piping,and not by the sensor. For all PVC teefittings, do not exceed 150 psig @ 27°C(80°F), 100 psig @ 38°C (100°F), 60 psig @49°C (120°F), 30 psig @ 60°C (140°F), dueto the insert in the tee. FP7000 sensor: 0°to 26°C (32° to 80°F) up to 150 psig; maxpressure decreases 1.1 psig per each 1°Fabout 80°F for a max. temperature of200°F at 18 psig max.10WARRANTY/DISCLAIMEROMEGA ENGINEERING, INC. warrants this unit to be free of defects in materials and workmanship for a period of 13 months from date of purchase. OMEGA’s WARRANTY adds an additional one (1) month grace period to the normal one (1) year product warranty to cover handling and shipping time. T his ensures that OMEGA’s customers receive maximum coverage on each product.If the unit malfunctions, it must be returned to the factory for evaluation. OMEGA’s Customer Service Department will issue an Authorized Return (AR) number immediately upon phone or written request. Upon examination by OMEGA, if the unit is found to be defective, it will be repaired or replaced at no charge. OMEGA’s WARRANT Y does not apply to defects resulting from any action of the purchaser, including but not limited to mishandling, improper interfacing, operation outside of design limits, improper repair, or unauthorized modification. This WARRANTY is VOID if the unit shows evidence of having been tampered with or shows evidence of having been damaged as a result of excessive corrosion; or current, heat, moisture or vibration; improper specification; misapplication; misuse or other operating conditions outside of OMEGA’s control. Components in which wear is not warranted, include but are not limited to contact points, fuses, and triacs.OMEGA is pleased to offer suggestions on the use of its various products. However, OMEGA neither assumes responsibility for any omissions or errors nor assumes liability for any damages that result from the use of its products in accordance with information provided by OMEGA, either verbal or written. OMEGA warrants only that the parts manufactured by the company will be as specified and free of defects. OMEGA MAKES NO OTHER WARRANTIES OR REPRESENTATIONS OF ANY KIND W HATSOEVER, EXPRESSED OR IMPLIED, EXCEPT THAT OF TITLE, AND ALL IMPLIED W ARRANTIES INCLUDING ANY W ARRANTY OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE ARE HEREBY DISCLAIMED. LIMITATION OF LIABILITY: The remedies of purchaser set forth herein are exclusive, and the total liability of OMEGA with respect to this order, whether based on contract, warranty, negligence, indemnification, strict liability or otherwise, shall not exceed the purchase price of the component upon which liability is based. In no event shall OMEGA be liable for consequential, incidental or special damages.CONDITIONS: Equipment sold by OMEGA is not intended to be used, nor shall it be used: (1) as a “Basic Component” under 10 CFR 21 (NRC), used in or with any nuclear installation or activity; or (2) in medical applications or used on humans. Should any Product(s) be used in or with any nuclear installation or activity, medical application, used on humans, or misused in any way, OMEGA assumes no responsibility as set forth in our basic WARRANTY / DISCLAIMER language, and, additionally, purchaser will indemnify OMEGA and hold OMEGA harmless from any liability or damage whatsoever arising out of the use of the Product(s) in such a manner.RETURN REQUESTS/INQUIRIESDirect all warranty and repair requests/inquiries to the OMEGA Customer Service Department. BEFORE RET URNING ANY PRODUCT (S) T O OMEGA, PURCHASER MUST OBT AIN AN AUT HORIZED RET URN (AR) NUMBER FROM OMEGA’S CUST OMER SERVICE DEPART MENT (IN ORDER T O AVOID PROCESSING DELAYS). T he assigned AR number should then be marked on the outside of the return package and on any correspondence.The purchaser is responsible for shipping charges, freight, insurance and proper packaging to prevent breakage in transit.OMEGA’s policy is to make running changes, not model changes, whenever an improvement is possible. This affords our customers the latest in technology and engineering.OMEGA is a trademark of OMEGA ENGINEERING, INC.© Copyright 2018 OMEGA ENGINEERING, INC. All rights reserved. This document may not be copied, photocopied, reproduced, translated, or reduced to any electronic medium or machine-readable form, in whole or in part, without the prior written consent of OMEGA ENGINEERING, INC.FOR WARRANTY RETURNS, please have the following information available BEFORE contacting OMEGA:1. Purchase Order number under which the product was PURCHASED,2. M odel and serial number of the product under warranty, and3. R epair instructions and/or specific problems relative to the product.FOR NON-WARRANTY REPAIRS, consult OMEGA for current repair charges. Have the following information available BEFORE contacting OMEGA:1. P urchase Order number to cover the COST of the repair,2. Model and serial number of the product, and3. Repair instructions and/or specific problemsrelative to the product.Where Do I Find Everything I Need for Process Measurement and Control?OMEGA…Of Course!Shop online at TEMPERATUREM U Thermocouple, RTD & Thermistor Probes, Connectors, Panels & AssembliesM U Wire: Thermocouple, RTD & ThermistorM U Calibrators & Ice Point ReferencesM U Recorders, Controllers & Process MonitorsM U Infrared PyrometersPRESSURE, STRAIN AND FORCEM U Transducers & Strain GagesM U Load Cells & Pressure GagesM U Displacement TransducersM U Instrumentation & AccessoriesFLOW/LEVELM U Rotameters, Gas Mass Flowmeters & Flow ComputersM U Air Velocity IndicatorsM U Turbine/Paddlewheel SystemsM U Totalizers & Batch ControllerspH/CONDUCTIVITYM U pH Electrodes, Testers & AccessoriesM U Benchtop/Laboratory MetersM U Controllers, Calibrators, Simulators & PumpsM U Industrial pH & Conductivity EquipmentDATA ACQUISITIONM U Communications-Based Acquisition SystemsM U Data Logging SystemsM U Wireless Sensors, Transmitters, & ReceiversM U Signal ConditionersM U Data Acquisition SoftwareHEATERSM U Heating CableM U Cartridge & Strip HeatersM U Immersion & Band HeatersM U Flexible HeatersM U Laboratory HeatersENVIRONMENTALMONITORING AND CONTROLM U Metering & Control InstrumentationM U RefractometersM U Pumps & TubingM U Air, Soil & Water MonitorsM U Industrial Water & Wastewater TreatmentM U pH, Conductivity & Dissolved Oxygen InstrumentsM4054/0118。
2N7002中文资料大全
2N7002中文资料大全
描述：
晶体管极性:N沟道
漏极电流, Id 最大值:280mA
电压, Vds 最大:60V
开态电阻, Rds(on):5ohm
电压 @ Rds测量:10V
电压, Vgs 最高:2.1V
功耗:0.2W
工作温度范围:-55to 150
封装类型:SOT-23
针脚数:3
SVHC(温度关注物质):Cobalt dichloride (18-Jun-2010) SMD标号:702
功率, Pd:0.2W
外宽:3.05mm
外部深度:2.5mm
外部长度/高度:1.12mm
封装类型:SOT-23
带子宽度:8mm
晶体管数:1
晶体管类型:MOSFET
温度 @ 电流测量:25°C
满功率温度:25°C
电压 Vgs @ Rds on 测量:10V
电压, Vds 典型值:60V
电流, Id 连续:0.115A
电流, Idm 脉冲:0.8A
表面安装器件:表面安装
通态电阻, Rds on @ Vgs = 10V:5ohm
通态电阻, Rds on @ Vgs = 4.5V:5.3ohm
阈值电压, Vgs th 典型值:2.1V
阈值电压, Vgs th 最高:2.5V
SVHC(高度关注物质)(附加):Bis (2-ethyl(hexyl)phthalate) (DEHP) (18-Jun-2010)。
克伊利·7002开关系统数据手册说明书
1.888.KEITHLEY (U.S. only) SideTextSWITCHINGANDCONTROLA G R E A T E R M E A S U R E O F C O N F I D E N C ETen-slothighdensityswitchmainframe The Model 7002 Switch System is a 10-slot mainf rame that supports up to400 2-pole mul t i p lex e r channels or 400 matrix crosspoints. The front panelincludes a unique in t er a c t ive display of chan n el status for quick pro g ram-ming. Scanning speeds of up to 300 channels per second are possible withthe high density switch cards. The wide selection of more than 30 d ifferentswitch cards makes the 7002 one of the most flexible switch i ng main-frames avail a ble.Reduce the Size and Costof Your Switching Application.up to 400 channels of 2-pole switching. A single Model 7002 mainframecan accommodate up to ten 40-channel cards. That’s 400 channels in asingle full-rack package that is only 178mm high (7 in). This level of density provides some impor-tant advantages. First, it reduces the amount of switching hardware required for a given ap p li c a t ion. Second, it provides high flexibility. The high density cards can be used with the special signal cardsto cover all your signal needs for a large application with one m ainframe.The 7002 is fully compatible with all 7001 switch cards. From thisf ig u r a t ion flex i b il-a m p le, the outputs of a mul t ip lex e r card can be connectedt i p lex e r cards can be con n ect e d to formlex e r. Intercard wiring is eliminated by using the an a l og backplane to formThe interactive front panel display helps shorten the time requiredAn optional light pen provides point and click pro g ram m ing from thep lete switch patterns.Automatic card configuration. When the high density cards are installed,the 7002 au t o m at i c al l y configures each slot independently for the propercard. The channel status display on the front panel adjusts to show eachcard’s capacity and con f ig u r a t ion.Front panel info key. At the touch of a button, the operator receives con-text-sensitive, on-line information to help configure the system. This infor-mation is displayed on a 52-character alphanumeric display for clear andreadable messages. There is no need to refer constantly to the operator’smanual. All information messages, operating instructions, and prompts areavailable in English, German, and French. Just select the desired languagein the con f ig u r a t ion menu.Programmable channel closure restrictions. The 7002 allows specificchannels to be locked out from closure. This restriction can be conditionalbased on the open/close state of other channels or crosspoints. This capa-bility is useful to prevent certain signals from being accidentally connectedto high power circuits, for example.DC, RF, and optical switchcapabilityInteractive channel statusdisplaySERVICES AVAILABLE7002-3Y-EW 1-year factory warranty extended to 3 years from date of shipment19811.888.KEITHLEY (U.S. only)A G R E A T E R M E A S U R E O F C O N F I D EN CE7002 7002Switch/Control Mainframe400-channelSystem Throughput300 channel per second scanning. The 7002 can scan through up to 300 chan-nels per second. This scan process can be controlled by the internal time base of the 7002 or through external triggers. The scan sequence is con t rolled by what appears in the scan list. The scan list can include channels, ranges of channels, and memory locations. This ap p roach gives max i m um flexibility while obtaining maximum through p ut.Built-in Scan Control and trigger Link. The built-in scan control eliminates the need for the computer to control every step of the test pro-cedure. Simply program the 7002 to control the channel spacing, scan spacing, and number of scans. Trigger Link gives you access to six inde-pen d ent hardware trigger lines on a single cable.SYSTEMCAPACitY: 10 plug-in cards per mainframe.MeMoRY: Battery backed-up storage for 500 switch pat t erns. SWitCh SettLiNg tiMe: Automatically selected by the main-frame. For different switchcards, 7002 will be set to the slow-est relay settling time. Additional time from 0 to 99999.999s econds can be added in 1ms increments.tRiggeR SouRCeS:External Trigger (TTL-compatible, programmable edge, 600ns min i m um pulse, rear panel BNC).IEEE-488 bus (GET, *TRG)Trigger LinkTHROUGHPUTeXeCutioN SPeeD oF SCAN LiSt (channels or memory l ocationsper s econd):ChannelsMemoriesBreak-Before-MakeOFF 300243ON 270189tRiggeR eXeCutioN tiMe (maximum time from ac t i v a t ion of trig g er Source to start of switch open or close 2):Source Latency Jitter GET1 200 µs <15 µs *TRG2, 3 3.0 ms Trigger Link 200 µs <10 µs External200 µs<10 µs Timer <25 µsNOTES1. Excluding switch settling time.2. Assuming no IEEE-488 commands are pending execution.3. Display off.IEEE-488 COMMAND EXECUTION TIMECommand Execution Time 1CLOS (@1!1)<8 ms + Relay Settle Time NOTES1. Measured from the time at which the command terminator is taken from the bus to relay energize. With display OFF.IEEE-488 BUS IMPLEMENTATIONStANDARDS CoNFoRMANCe: Conforms to SCPI-1990, IEEE-488.2, and IEEE-488.1.MuLtiLiNe CoMMANDS: DCL, LLO, SDC, GET, GTL, UNT, UNL, SPE, SPD.uNiLiNe CoMMANDS: IFC, REN, EOI, SRQ, ATN.iNteRFACe FuNCtioNS: SH1, AH1, T5, TE0, L4, LE0, SR1, RL1, PP0, DC1, DT1, C0, E1.All aspects of 7002 op e r a t ion are available from the front panel or over the IEEE-bus interface. The 7002 conforms to IEEE-488.2 and the SCPI (Standard Com m ands for Programmable Instru m ents) command language protocol.• Scan List • Scan Spacing • Channel Spacing • Number of Scans • Number of Channels • Trigger Source• Single Channel Mode • Channel Restrictions • Save Mainframe Con f ig u r a t ion Setups • Digital I/O • Card Pair • Channel Delay • Number of Poles• Channel Pattern MemoryGENERALDiSPLAY: Dual-line vacuum fluorescent. 1st line: 20-char-ac t er alphanumeric. 2nd line: 32-character alphanu-meric. Chan n el status LED grid.Light PeN oPtioN: Provides interactive programming of channels, cross points, scan lists, and memory.ReAR PANeL CoNNeCtoRS: IEEE-488; 9-pin DB9 Female; 8-pin micro DIN for Trigger Link; 8-pin micro DIN for Trigger Link expansion; BNC for External Trigger; BNC for Channel ReadyPoWeR: 100V to 240Vrms, 50/60Hz, 110VA max i m um.eMC: Complies with European Union Directive 89/336/ EEC, EN61326-1.SAFetY: Conforms to European Union Directive 73/23/EEC, EN61010-1).eMi/RFi: Meets VDE 0871B and FCC Class B.eNViRoNMeNt: operating: 0°C to 50°C, <80% RH (0°C to 35°C). Storage: –25°C to +65°C.DiMeNSioNS, Weight: 178mm high × 438mm wide × 448mm deep (7 in × 171⁄4 in × 175⁄8 in). Net weight 9.1kg (20 lb).。
7002说明书
‡ SIGNET 7002 Vortex Flow SensorENGLISH3-7002.090DescriptionThe 3-7002 Vortex Flow Sensor uses vortex shedding technology as the primary method of determining the flow rate, and uses ultrasonic sensors to detect the vortices.The only material in contact with the fluid is PVDF plastic.It is available in 3 in. (DN80) and 4 in. (DN100) sizes, and in Wafer and Flanged versions. Both ANSI and ISO bolt patterns are offered.Location •Six common piping systems are shown as guidelines to help you select the best location for the vortex flow sensor. Always maximize distance between sensors and pump sources.Installation •All mounting angles are acceptable in either horizontal or vertical pipe runs, with upward flow preferred in the case of vertical runs. Install the sensor with the arrow pointing in the direction of the flow.•Pipe supports are recommended before and after the sensor to support the weight.*Install a "drip loop" or slope the conduit downward from the terminal block. Seal conduit entries with electrician's putty.•Reynold’s Number •value of 20000 is required in a 4 in. (DN 100) system.on flow sensor performance. As the viscosity of a fluid increases, the velocity (or flow rate) required to achieve accurate flow measurement also increases.application.Reynold’s Number:R e = 3162.76 x Q x Sg/(µ x ID)where:Q = Flow rate in GPMSg = Specific Gravityµ = Dynamic Viscosity in Centipoise (cP)ID = pipe inside diameter in inchesBackpressure Calculation •Minimum downstream pipe backpressure levels are required to prevent cavitation within the sensor. The minimum back pressure is calculated by the following formula: 2.7 x ∆P + 1.3x Po (∆P = Pressure drop across sensor. Po = Water saturation vapor pressure at operating temperature.)ing Pressure Drop Graph, find ∆P by locating yourmaximum flow rate on specific sensor size ing the Water Saturation Vapor Pressures Chart, find Po atoperating temperature.3.Calculate minimum back pressure needed using formula.Pressure Drop GraphC-7/02 EnglishInstallation•Proper alignment of the sensor with gaskets and flanges is necessary to assure a uniform flow profile through the sensor.•Space flanges in the piping system according to the length of the vortex flow sensor body.•Observe torque recommendations.•Mounting hardware, gaskets and piping system components (shown with broken lines in the diagrams below) are not furnished with the vortex flow sensors.•For flange versions: Bolt length approximations shown in the table above include two flange adapters, two flange rings and a gasket, all typical of +GF+ SYGEF-PVDF piping systemcomponents, plus nuts and washers.•For wafer versions: If the application requires operationoutside the range 15 to 35° C (59 to 95° F), then the accessory Spring Kit (3-7002.391) is necessary to relieve the forces due to thermal expansion of PVDF material and/or to prevent leakage during cooling. Bolt length approximations shown in the table above include sensor length, width dimensions for two each flange adapters, flange rings and gaskets, all typical of +GF+ SYGEF-PVDF piping system components, plus nuts and washers. If the accessory Spring Kit will be used, bolt length requirements increase by 60.0 mm (2.5 inches.)•Do not exceed 70 ºC media temperature •Do not exceed torque specifications.Sensor Config.# of Bolts Bolt Diameter Approximate Bolt Length Required Torque 3" Flange ISO 16M16 (5/8" - 11)70 mm (2.75")40 ± 5 N•m ( 30 ± 4 lbf•ft)3" Flange ANSI 8M16 (5/8" - 11)70 mm (2.75")40 ± 5 N•m ( 30 ± 4 lbf•ft)4" Flange ISO 16M16 (5/8" - 11)80 mm (3.00")45 ± 5 N•m (33 ± 4 lbf•ft)4" Flange ANSI 16M16 (5/8" - 11)80 mm (3.00")45 ± 5 N•m (33 ± 4 lbf•ft)3" Wafer ISO 8M16 (5/8" - 11)180 mm (7.50")25 N•m (18.5 lbf•ft)3" Wafer ANSI 4M16 (5/8" - 11)180 mm (7.50")25 N•m (18.5 lbf•ft)4" Wafer ISO 8M16 (5/8" - 11)220 mm (8.50")30 N•m (22 lbf•ft)4" WaferANSI8M16 (5/8" - 11)220 mm (8.50")30 N•m (22 lbf•ft)Tighten the flange bolts in the appropriate sequence.Tighted each bolt to 50% of the specification, repeat the pattern to 80%, then repeat again to the specified torque.Wiring for Frequency OutputThe open-collector frequency output requires a three-wire connection between the sensor and the monitoring device.To wire the vortex sensor frequency output to remote equipment:•Cable with single twisted-pair plus shield recommended.•Maximum cable length 200 ft.•Install cable through a conduit port andconnect as shown to the terminal block inside the vortex sensor cap.•Open collector voltage is supplied by +GF+ SIGNET instruments.•Use the 2535/2536 input card setting when wiring to the +GF+ SIGNET 9010Intelek-Pro Flow ControllerTo wire the vortex sensor frequency output to a Signet 8550Integral transmitter:cap. The cap will not be used.• Connect the Vortex sensor to the 8550 as shown.Out toremote equipmentCalibration Data: Frequency OutputUse the following K-factor data to program a flow meter which accepts the open collector frequency signal from the vortex flow sensor.The K-factor is the number of pulses generated byeach gallon (or liter) of fluid that passes through the sensor.Calibration - Current OutputThe current output from the 3-7002 is factory-calibrated for full scale operation ( 4-20 mA = 0-4 m/s).Since the sensor is limited to a minimum of 0.2 m/s, the current output is held at 4 mA when flow is less than 0.2 m/s, (or 0.66 ft/s), and increases to 20 mA at the maximum flow velocity (4.0 m/s, or 13.12 ft/s).The charts on page 5 show the relationship between the fluid velocity, the actual flow rate (in GPM and LPM) and the current output. You can also use the following formula to calculate the current output at any specific flow velocity.Example 1: In a pipe with a flow velocity of 2 m/s, what is the correct current output?:+4=12.0mAMax sensor velocityFluid velocity in pipe X 16+4=current output (mA)4 mA20 mAWiring for Current OutputThe 4-20 mA current output selection requires a two-wire loop connection between the sensor and monitoring device.+ 4 = 10.97 mAExample 2: In a 4 in.pipe what should the current output be when the flow rate is 200 gpm?:Velocity-Flow Rate-Current output ChartTechnical DataWetted materials•Sensor body:PVDFPipe size•d90/DN80 (3 in.) and d110/DN100 (4 in.) Linear Flow rangeTurn-down ratio:20:1•d90/DN80 (3 in.):Reynolds ≥ 16000: 0.2 to 4 m/s (0.66 to 13 ft/s)•d110/DN100 (4 in.):Reynolds ≥ 20000: 0.2 to 4 m/s (0.66 to 13 ft/s)NOTE: Below these velocity ranges, Vortex output is non-linear.Electronics module enclosure•Rating:NEMA 4X/IP65•Material:Valox®[Polybutylene TerephThalate (PBT) resin]Weight:Wafer 3 in./DN80: 4.5 lb/2.0 kg4 in./DN 100:7.0 lb./3.2 kgFlange: 3 in./DN80:11.0 lb./5.0 kg4 in./DN100:16.0 lb./7.3 kgElectrical•Accuracy:±1% of reading•Repeatability:±0.25% of reading•Response time: 1 s., first order5 s. settled to 1% of rate •Reverse polarity protection•Open Collector output:•NPN transistor, 10 mA max sink, 30 VDC max pull-up voltage, 0 to 100 Hz, 50% duty cycle, non-isolated.< 100 hz at maximum range.•Power requirement:4.5 to 7 VDC, regulated, 10 mA maximum•Current output:•factory-set; 4 to 20 mA = 0 to 4 m/s (0 to 13 ft/s) (Custom ranges available from factory)•Loop impedance:1Ω maximum at 12 VDC600Ω maximum at 24 VDC •Resolution:≈2.5 µA•Power requirement:12 to 24 VDC, regulated, 20 mA maximum268111417psibar32¡FWafer Vortex Sensor:10bar@30¼C,6.5bar@70¼C(145psi@86¼F,94psi@158¼F) Flange Vortex Sensor:10bar@30¼C,2bar@120¼C(145psi@86¼F,30psi@248¼F) EnvironmentalRating:NEMA 4X/IP65Maximum Media Pressure/Temperature•Ambient temp.:0 to 70 °C (32 to 158 °F)•Storage temp.:-15 to 80 °C (5 to 176 °F)•Relative humidity:0 to 95%, non-condensing •Vibration resistance:At least 1g in every axis up to 500 Hz.(The ultrasonic pickup is unaffected by normal piping system vibrations.)Standards and Approvals•Manufactured under ISO 9001 and ISO 14001•CE3-7000-5x3-7001-5xFlange Vortex Sensor dimensionsSize m m inch m m inch m m inch m m inch DN80133.1 5.2478.0 3.07108.0 4.25251.79.91DN100158.06.2296.03.78127.05.00277.110.91ABC DWafer Vortex Sensor dimensionsSizem m inch m m inch m m inch m m inch DN80196.97.7578.0 3.07199.97.87287.011.3DN100228.69.0096.03.78249.99.84322.612.7A BC D+GF+ SIGNET 7002 Vortex Flow SensorsPart NumberCodeDescription3-7002-2AF 159 000 6573-7002-2AFI 159 000 6583-7002-2AW159 000 6613-7002-2BF 159 000 662High-Purity 4” (d110/DN100) Flange, ANSI 3-7002-2BFI 159 000 663High-Purity 4” (d110/DN100) Flange, ISO 3-7002-2BW159 000 666High-Purity 4” (d110/DN100) Wafer3-7002-3AF 159 000 667PVDF 3” (d90/DN80) Flange, ANSI3-7002-3AFI 159 000 668PVDF 3” (d90/DN80) Flange, ISO 3-7002-3AW159 000 671PVDF 3” (d90/DN80) Wafer3-7002-3BF 159 000 672PVDF 4” (d110/DN100) Flange, ANSI 3-7002-3BFI 159 000 673PVDF 4” (d110/DN100) Flange, ISO 3-7002-3BW159 000 676PVDF 4” (d110/DN100) WaferAccessoriesPart NumberCodeDescription3-8550-1159 000 210Flow Transmitter for Field Mount3-8550-2159 000 212Flow Transmitter with 2 Relays for Field Mount 3-8550-3159 000 2142-Channel Flow Transmitter for Field Mount 3-8050159 000 184Universal Adapter Kit3-0000.393159 000 618Liquid Tight Connector Kit with PG 13.5 to NPT Adapter 3-7002.391159 000 692Spring Kit (includes four (4) springs)Ordering Information‡ SIGNETSignet Scientific Company, 3401 Aerojet Avenue, El Monte, CA 91731-2882 U.S.A. • Tel. (626) 571-2770 • Fax (626) 573-2057For Worldwide Sales and Service, visit our website: • Or call (in the U.S.): (800) 854-4090GEORGE FISCHER ‡ Piping Systems3-7002.090/(C-7/02) English© Signet Scientific Company 2002Printed in U.S.A. on recycled paper。
ATT7022中文资料
2、引脚描述 引脚 标识 1 RESET 2 SIG
3,4 6,7 9,10 5 11 13,14 16,17 19,20 24 26 27
V1P/V1N V3P/V3N V5P/V5N REFCAP REFOUT V2P/V2N V4P/V4N V6P/V6N TEST SEL CF1
28
CF2
35 36 37 38 40
RESET 1 SIG V1P V1N
2 3 4
33 VDD 32 NC 31 NC 30 NC
REFCAP 5 V3P 6 V3N AGND V5P
7 8 9
ATT7022
29 NC 28 CF2 27 CF1 26 SEL 25
NC
V5N 10 REFOUT 11
12 13 14 15 16 17 18 19 20 21 22
24 TEST 23 GND
A V C C
V V 2 2 P N
A V V G 4 4 N P N D
A V C C
V 6 P
V 6 N
N C
N C
第 5 页 共 32 页
珠海炬力集成电路设计有限公司
Actions Semiconductor Co., Ltd.
时间
复位
运行
复位
片内电源监控特性 §2.2 模数转换 ATT7022 片内集成了 6 路 16 位的 ADC，采用双端差分信号输入。最大输入电 压是 1.5v，即可以输入最大的正弦信号有效值是 1v。建议将电压通道 Un 对应到 ADC 的输入选在 0.5v 左右，而电流通道 Ib 时的 ADC 输入选在 0.1v 左右。 ADC 内部结构图：
第 3 页 共 32 页
RK7002AT116中文资料
Transistors Rev.A 1/44V Drive Nch MOS FETRK7002Az StructureSilicon N-channel MOS FET transistorz Features1) Low on-resistance. 2) High ESD3) High-speed switching. 4) Low-voltage drive (4V).5) Drive circuits can be simple.6) Parallel use is easy .z ApplicationsSwitching z External dimensions (Unit : mm)z Packaging specifications z Equivalent circuitRK7002AType T1163000Package CodeBasic ordering unit (pieces)TapingA protection diode has been built in between thegate and the source to protect against static electricity when the product is in use.Use the protection circuit when fixed voltages are exceeded.z Absolute maximum ratings (T a=25°C)Drain-source voltage Gate-source voltage Drain current Source current (Body diode)Total power dissipation Channel temperature Storage temperatureContinuous Pulsed Continuous PulsedV DSS V GSS I S P D ∗2Tch 60V V mA mA mW °C ±20 ±300I D I SP ∗1A I DP ∗1A ±1.22000.8200150Tstg°C−55 to +150Symbol Limits Unit Parameter∗1 Pw ≤10µs, Duty cycle ≤1%∗2 With each pin mounted on the recommended land.z Thermal resistance°C / WRth (ch-a)625ParameterSymbol Limits Unit Channel to ambientWith each pin mounted on the recommended land.∗Transistors Rev.A 2/4z Electrical characteristics (T a=25°C)z Body diode characteristics (Source-Drain) (T a=25°C)Forward voltageV SD −− 1.2V I S =300mA, V GS =0VParameterSymbol Min.Typ.Max.Unit Conditions∗Pulsed∗Transistors Rev.A 3/4z Electrical characteristic curvesFig.1 Typical output characteristics D R A I N C U R R E N T : I D (A )DRAIN-SOURCE VOLTAGE : V DS (V)GATE-SOURCE VOLTAGE : V GS (V)Fig.2 Typical transfer characteristicsD R A I N C U R RE N T : I D (A )CHANNEL TEMPERATURE : Tch (°C)G A T E T H R E S HO L D V O L T A G E : V G S (t h ) (V )Fig.3 Gate threshold voltagevs. channel temperatureDRAIN CURRENT : I D (A)Fig.4 Static drain-source on-stateresistance vs. drain current ( Ι )S T A T I C D R A I N -S O U R C E O N -S T A T E R E S I S T A N C E : R D S (o n ) (Ω)DRAIN CURRENT : I D (A)Fig.5 Static drain-source on-stateresistance vs. drain current ( ΙΙ )S T A T I C D R A I N -S O U R C E O N -S T A T E R E S I S T A N C E : R D S (o n ) (Ω)Fig.6 Static drain-source on-stateresistance vs. gate-source voltage7563214GATE-SOURCE VOLTAGE : V GS (V)O N -S T A T E R E S I S T A N C E : R D S (o n ) (Ω)S T A T I C D R A I N -S O U R C ES T A T I C D R A I N -S O U R C E O N -S T A T ER E S I S T A N C E : R D S (o n ) (Ω)CHANNEL TEMPERATURE : Tch (°C)Fig.7 Static drain-source on-stateresistance vs. channel temperatureSOURCE-DRAIN VOLTAGE : V SD (V)Fig.8 Reverse drain current vs.source-drain voltage ( Ι )R E V E R S E D R A I N C U R R E N T : I D R (A )SOURCE-DRAIN VOLTAGE : V SD (V)Fig.9 Reverse drain current vs.source-drain voltage ( ΙΙ )R E V E R S E D R A I N C U R R E N T : I D R (A )Transistors Rev.A 4/4Fig.10 Forward transfer admittancevs. drain currentF O R W A R D T R A N S F E R A D M I T T A N C E : |Y f s | (S )DRAIN CURRENT : I D (A)Fig.11 Typical capacitancevs. drain-source voltageC A P A C I T A N C E : C (p F )DRAIN-SOURCE VOLTAGE : V DS (V)S W I T C H I N G T I M E : t (n s )DRAIN CURRENT : I D (A)Fig.12 Switching characteristics(See Figures 13 and 14 for the measurement circuit and resultant waveforms)z Switching characteristics measurement circuitFig.13 Switching time measurement circuit DSFig.14 Switching time waveformsAppendixAbout Export Control Order in JapanProducts described herein are the objects of controlled goods in Annex 1 (Item 16) of Export T rade ControlOrder in Japan.In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause)on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.Appendix1-Rev1.1。
2N7002中文资料(fairchild)中文数据手册「EasyDatasheet - 矽搜」
V 1 µA 1 mA 1 µA 0.5 mA 10 nA 100 nA
-10 nA -100 nA
V = V , I =1毫安
2N7000 0.8 2.1 3
V
V = V , I = 250 µA
2N7002 1 2.1 2.5 NDS7002A
= 10 V, I =500毫安
2N7000
1.2 5
图 3.导通电阻变化
随着温度
图 4.导通电阻变化有排水
电流和温度
图 5.传输特性
图 6.门阈值变化与
温度
芯片中文手册,看全文,戳
电气特性
（持续）
2N7000 / 2N7002 /NDS7002A
图 7.击穿电压变化
随着温度
图 8.体二极管正向电压变化与
图 9.电容特性
图 10.栅极电荷特性
2N7002
60 60
±20
±40
200
115
500
800
400
200
3.2
1.6
-55至150
300
312.5
625
S
NDS7002A
Units V V V
280 1500 300 2.4 -65至150
mA
mW mW/°C
°C °C
417
°C/W
芯片中文手册,看全文,戳
电气特性
芯片中文手册,看全文,戳
1995年11月
2N7000 / 2N7002 / NDS7002A N沟道增强型场效应晶体管
概述
这些N沟道增强型场效应晶体管 采用飞兆半导体专有,高密度生产, DMOS技术.这些产品目是为最大限度地减少通态电阻 ,同时提供坚固,可靠和快速开关性能.他们可以在需要高 达400mA DC大多数应用中使用,并且可以提供脉冲电流 高达2A.这些产品特别适用于低电压,低电流应用, 如小伺服电机控制,功率MOSFET栅极驱动器,和其他开关 应用.
2N7002中文资料(Diodes)中文数据手册「EasyDatasheet - 矽搜」
反向传输电容
(2)
C
5
pF
导通时间（2）（3）
t
关闭时间（2）（3）
t
20 ns V 30V, I =200mA 20 ns R =25Ω, R =150Ω
（1）脉冲条件下进行测定.宽度=300μS.占空比 （3）开关时间测量50Ω源阻抗和5ns上升时间脉冲发生器
辣妹参数数据可应要求提供该设备
2% （2）抽样检测.
门 - 体泄漏
零栅压漏 当前
I
10 nA V =± 20V, V =0V
I
1
µA V =48V, V =0V
500 µA V =48V, V =0V, T=125°C (2)
通态漏电流（1）
I
500
mA V =25V, V =10V
静态漏源通态
电压（1）
V
3.75 V V =10V, I =500mA
芯片中文手册,看全文,戳
SOT23 N沟道增强 模式垂直DMOS FET
ISSUE 4 – 2006年 4月
特征
* 60电压V CEO
PARTMARKING详细信息 - 702
2N7002
S D
G
绝对最大额定值.
SOT23
参数
符号
VALUE
UNIT
漏源电压
V
60
V
连续漏极电流在T
=25°C
I
115
mA
漏电流脉冲
I
800
mA
门源电压
V
± 40
V
在T功率耗散
=25°C
P
330
mW
工作和存储温度范围
T :T
2N7002-AE3-R资料
UNISONIC TECHNOLOGIES CO.,2N7002MOSFETN-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTORDESCRIPTIONThe UTC 2N7002 has been designed to minimize on-state resistance while provide rugged, reliable, and fast switching performance. It can be used in most applications requiring up to 400mA DC and can deliver pulsed currents up to 2A. The product is particularly suited for low voltage, low current applications such as small servo motor control, power MOSFET gate drivers, and other switching applicationsFEATURES* High density cell design for low R DS(ON). * Voltage controlled small signal switch * Rugged and reliable * High saturation current capabilityMARKING*Pb-free plating product number: 2N7002LPIN CONFIGURATIONPIN NO.PIN NAME1 SOURCE2 GATE3 DRAINORDERING INFORMATIONOrder NumberNormal Lead free Package Packing2N7002-AE3-R 2N7002L-AE3-R SOT-23 Tape ReelABSOLUTE MAXIMUM RATINGS (Ta=25°C unless otherwise noted.)PARAMETER SYMBOL RATINGS UNITDrain-Source Voltage V DSS 60 V Drain-Gate Voltage (R GS ≤1M Ω) V DGR 60 V Continuous ±20Gate Source Voltage Non Repetitive(tp<50µs)V GSS±40 V Continuous 115Maximum Drain Current Pulsed I D 800mA Maximum Power DissipationDerated above 25°CP D200 1.6 mW mW/°C Operating Temperature T OPR 0 ~ +70 °CStorage Temperature T STG -40 ~ +150THERMAL CHARACTERISTICSPARAMETER SYMBOL RATINGS UNITThermal Resistance, Junction to Ambient θJA 625 °C/WELECTRICAL CHARACTERISTICS (T A =25°C, unless otherwise specified.)PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT OFF CHARACTERISTICSDrain-Source Breakdown Voltage BV DSS V GS =0V, I D =10µA 60 V0.5 mAZero Gate Voltage Drain Current I DSSV DS =60V, V GS =0V T J =125°C 1 µAGate-Body leakage, Forward I GSSF V GS =20V, V DS =0V 100 nA Gate-Body leakage Reverse I GSSR V GS =-20V, V DS =0V -100nA ON CHARACTERISTICS (Note) Gate Threshold Voltage V GS (th) V GS = V DS , I D =250µA 1 2.1 2.5 VV GS = 10V, I D =500mA 0.6 3.75Drain-Source On-Voltage V DS (ON) V GS = 5.0V, I D =50mA 0.09 1.5VOn-State Drain Current I D(ON) V GS =10V,V DS ≥2V DS(ON) 500 2700 mAV GS =10V, I D =500mAT J =100°C1.2 1.7 7.5 13.5Ω Static Drain-Source On-Resistance R DS (ON)V GS =5.0V, I D =50mAT J =100°C1.72.4 7.5 13.5 Forward Transconductance g FS V DS ≥2V DS(ON), I D =200mA 80 320 mS DYNAMIC CHARACTERISTICS Input Capacitance C iss V DS =25V,V GS =0V,f =1.0MHz 20 50 pF Output Capacitance C oss 11 25 pF Reverse Transfer Capacitance C rss 4 5 pFTurn-On Time t ONV DD =30V, R L =150ΩI D =200mA, V GS =10V R GEN =25Ω20 nS Turn-Off Time t OFFV DD =30V, R L =25ΩI D =200mA, V GS =10V R GEN =25Ω20 nS DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS Drain-Source Diode Forward Voltage V SD V GS =0V, Is=115mA (Note ) 0.88 1.5 VMaximum Pulsed Drain-Source DiodeForward CurrentI SM 0.8 AMaximum Continuous Drain-SourceDiode Forward CurrentIs 115 mANote: Pulse Test: Pulse Width ≤300µs, Duty Cycle ≤2.0%TEST CIRCUIT AND WAVEFORMFigure 1V DDV OUTFigure 2. Switching WaveformsTYPICAL CHARACTERICS543211.510.50221.61.20.80.432.521.5100.5D R A I N -S O U R CE C U R R E N T , I D (A )DRAIN -SOURCE VOLTAGE, V DS (V)Figure 3. On-Region CharacteristicsN O R M A L I Z E D D R A I N –S O U R C E O N –R E S I S T A N C E , R D S (O N )DRAIN CURRENT , I D (A)Figure 4. On-Resistance Varisation with GateVoltage and Drain Current100750-2521.51-500.51.61.20.80.432.521.5100.525501501250.751.251.7520N O R M A L I Z E D D R A I N -S O U R C E O N -R E S I S T A N C E , R D S (O N )JUCTION TEMPERATURE, T J (°C)Figure 5. On-Resistance Varisationwith TemperatureN O R M A L I Z E D D R A I N -S O U R C E O N -R E S I S T A N C E , R DS (O N )DRAIN CURRENT ,I D (A)Figure 6. On-Resistance Varisation with DrainCurrent and Temperature10864210075-25-5025501251.61.21.80.4201501.11.0510.950.90.850.8D R A I N C U R R E N T , I D (A )GATE TO SOURCE VOLTAGE , V GS (V)Figure 7. Transfer CharacteristicsN O R M A L I Z E D G A T E -S O U R C E T H R E S H O L D V O L T A G E , V t hJUCTION TEMPERATURE, T J (°C)Figure 8. Gate Threshold Varisationwith TemperatureTYPICAL CHARACTERICS (cont.)10075-251.11.051-500.9251 1.20.80.410.50.10.050.010.20.00525501501250.951.0251.0751.40.0010.9750.62N O R M A L I Z E D D R A I N -S O U R C E V R E A K D O W N V O L T A G E , B V D S SJUCTION TEMPERATURE, T J (°C)Figure 9. Breakdown Voltage Varisationwith TemperatureBODY DIODE FORWARD VOLTAGE , V SD (V)Figure 10. Body Diode Forward Voltage Varisationwith TemperatureR E V E R S E D R A I N C U R R E N T , I S (A )1102053220.80.41.21.6205102401503060C A P A C I T A N C E (p F )DRAIN TO SOURCE VOLTAGE, V DS (V)Figure 11. Capacitance CharacteristicsGATE CHARGE, Qg (nC)Figure 12. Gate Charge Characteristics60801020520.50.050.10.0110.00530231D R A I N C U R RE N T , I D (A )DRAIN TO SOURCE VOLTAGE, V DS (V)Figure 13. Maximum Safe Operating Area3000.001101t1, TIME (sec)10010.10.010.0010.00010.0020.010.050.10.20.5Figure 14. Transient Thermal Response CurveN O R M A L I Z E D E F F E C T I V E T R A N S I E N T T H E R M A L R E S I S T A N C E , r (t )。
2N7002资料
1.Product profile1.1General descriptionN-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using Trench MOSFET technology.1.2Features and benefits⏹Suitable for logic level gate drive sources ⏹Very fast switching⏹Surface-mounted package ⏹Trench MOSFET technology1.3Applications⏹Logic level translators⏹High-speed line drivers1.4Quick reference data2.Pinning information2N700260 V, 300 mA N-channel Trench MOSFETRev. 7 — 8 September 2011Product data sheetTable 1.Quick reference dataSymbol ParameterConditions Min Typ Max Unit V DS drain-source voltage 25°C ≤T j ≤150°C--60V I D drain currentV GS =10V; T sp =25°C;see Figure 1; see Figure 3--300mA P tot total power dissipation T sp =25°C;see Figure 2--0.83W Static characteristicsR DSondrain-source on-state resistanceV GS =10V; I D =500mA; T j =25°C; see Figure 6; see Figure 8- 2.85ΩTable 2.Pinning information Pin Symbol Description Simplified outlineGraphic symbol1G gate SOT23 (TO-236AB)2S source 3Ddrain1233.Ordering information4.Marking[1]% = placeholder for manufacturing site code5.Limiting valuesTable 3.Ordering informationType numberPackage NameDescriptionVersion 2N7002TO-236ABplastic surface-mounted package; 3 leadsSOT23Table 4.Marking codesType numberMarking code [1]2N700212%Table 5.Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol ParameterConditions Min Max Unit V DS drain-source voltage 25°C ≤T j ≤150°C-60V V DGR drain-gate voltage 25°C ≤T j ≤150°C; R GS =20k Ω-60V V GS gate-source voltage -3030V V GSM peak gate-source voltage pulsed; t p ≤50µs; δ=0.25-4040V I Ddrain currentV GS =10V; T sp =25°C;see Figure 1; see Figure 3-300mA V GS =10V; T sp =100°C; see Figure 1-190mA I DM peak drain current pulsed; t p ≤10µs; T sp =25°C;see Figure 3- 1.2A P tot total power dissipation T sp =25°C;see Figure 2-0.83W T j junction temperature -65150°C T stg storage temperature -65150°C Source-drain diodeI S source current T sp =25°C-300mA I SMpeak source currentpulsed; t p ≤10µs; T sp =25°C - 1.2A6.Thermal characteristicsTable 6.Thermal characteristicsSymbol Parameter ConditionsMin Typ Max Unit R th(j-a)thermal resistance from junction to ambientMounted on a printed-circuit board; minimum footprint ; vertical in still air--350K/WR th(j-sp)thermal resistance from junction to solder pointsee Figure 4--150K/W7.CharacteristicsTable 7.CharacteristicsSymbol Parameter Conditions Min Typ Max Unit Static characteristicsV(BR)DSS drain-sourcebreakdown voltage I D=10µA; V GS=0V; T j=25°C60--V I D=10µA; V GS=0V; T j=-55°C55--VV GSth gate-source thresholdvoltage I D=0.25mA;V DS=V GS; T j=25°C;see Figure 9; see Figure 1012 2.5VI D=0.25mA;V DS=V GS; T j=150°C;see Figure 9; see Figure 100.6--VI D=0.25mA;V DS=V GS; T j=-55°C;see Figure 9; see Figure 10-- 2.75VI DSS drain leakage current V DS=48V;V GS=0V; T j=25°C-0.011µAV DS=48V;V GS=0V; T j=150°C--10µA I GSS gate leakage current V GS=15V; V DS=0V; T j=25°C-10100nAV GS=-15V;V DS=0V; T j=25°C-10100nAR DSon drain-source on-stateresistance V GS=10V; I D=500mA; T j=25°C;see Figure 6; see Figure 8- 2.85ΩV GS=10V; I D=500mA; T j=150°C;see Figure 6; see Figure 8--9.25ΩV GS=4.5V;I D=75mA;T j=25°C;seeFigure 6; see Figure 8- 3.8 5.3ΩDynamic characteristicsC iss input capacitance V DS=10V;f=1MHz;V GS=0V;T j=25°C -3150pFC oss output capacitance- 6.830pF C rss reverse transfercapacitance- 3.510pFt on turn-on time V GS=10V; V DS=50V;R L=250Ω;R G(ext)=50Ω; R GS=50Ω- 2.510nst off turn-off time-1115ns Source-drain diodeV SD source-drain voltage I S=300mA;V GS=0V;T j=25°C;seeFigure 11-0.85 1.5VQ r recovered charge V GS=0V;I S=300mA;dI S/dt=-100A/µs -30-nCt rr reverse recovery time-30-ns8.Package outlinePlastic surface-mounted package; 3 leads SOT23Fig 13.Package outline SOT23 (TO-236AB)9.Soldering10.Revision historyTable 8.Revision historyDocument ID Release date Data sheet status Change notice Supersedes2N7002 v.720110908Product data sheet-2N7002 v.6 Modifications:•The format of this data sheet has been redesigned to comply with the new identity guidelinesof NXP Semiconductors.•Legal texts have been adapted to the new company name where appropriate.2N7002 v.620060428Product data sheet2N7002 v.52N7002 v.520051115Product data sheet2N7002 v.42N7002 v.420050426Product data sheet2N7002 v.32N7002 v.320000727Product specification HZG3362N7002 v.22N7002 v.219970617Product specification2N7002 v.12N7002 v.119901031Product specification--11.Legal information11.1Data sheet status[1]Please consult the most recently issued document before initiating or completing a design.[2]The term 'short data sheet' is explained in section "Definitions".[3]The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest productstatus information is available on the Internet at URL .11.2DefinitionsPreview — The document is a preview version only. The document is still subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.11.3DisclaimersLimited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third partycustomer(s). NXP does not accept any liability in this respect.Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.Document status [1][2] Product status [3] DefinitionObjective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.Product [short] data sheet Production This document contains the product specification.Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at /profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use ofnon-automotive qualified products in automotive equipment or applications.In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 11.4TrademarksNotice: All referenced brands, product names, service names and trademarks are the property of their respective owners.Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation.12.Contact informationFor more information, please visit: For sales office addresses, please send an email to: salesaddresses@13.Contents1Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . .11.1General description . . . . . . . . . . . . . . . . . . . . . .11.2Features and benefits. . . . . . . . . . . . . . . . . . . . .11.3Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .11.4Quick reference data . . . . . . . . . . . . . . . . . . . . .12Pinning information. . . . . . . . . . . . . . . . . . . . . . .13Ordering information. . . . . . . . . . . . . . . . . . . . . .24Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .26Thermal characteristics . . . . . . . . . . . . . . . . . . .47Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .58Package outline. . . . . . . . . . . . . . . . . . . . . . . . . .89Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .910Revision history. . . . . . . . . . . . . . . . . . . . . . . . .1011Legal information. . . . . . . . . . . . . . . . . . . . . . . .1111.1Data sheet status . . . . . . . . . . . . . . . . . . . . . . .1111.2Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .1111.3Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .1111.4Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .1212Contact information. . . . . . . . . . . . . . . . . . . . . .12Please be aware that important notices concerning this document and the product(s)described herein, have been included in section ‘Legal information’.© NXP B.V.2011.All rights reserved.For more information, please visit: For sales office addresses, please send an email to: salesaddresses@。
2N7002A中文资料
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SYMBOL VDSS VDGR VGSS RATING 60 60 20 115 mA 800 200 150 -55 150 mW UNIT V V V
Continuous Drain Current Pulsed Drain Power Dissipation Junction Temperature Storage Temperature Range
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TEST CONDITION VGS=0V, ID=10 A VDS=60V, VGS=0V VGS=20V, VDS=0V VGS=-20V, VDS=0V MIN. 60 TYP. MAX. 1 1 -1 UNIT V A A A
SYMBOL BVDSS IDSS IGSSF IGSSR
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元器件交易网
2N7002A
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ID IDP PD Tj Tstg
EQUIVALENT CIRCUIT
ELECTRICAL CHARACTERISTICS (Ta=25
CHARACTERISTIC Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Body Leakage, Forward Gate-Body Leakage, Reverse
元器件交易网
SEMICONDUCTOR
MPXV7002中文资料
Document Number: MPXV7002Rev 0, 09/2005Freescale Semiconductor Technical Data© Freescale Semiconductor, Inc., 2005. All rights reserved.Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and CalibratedThe MPXV7002 series piezoresistive transducers are state-of-the-artmonolithic silicon pressure sensors designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.Features • 2.5% Typical Error over +10°C to +60°C with Auto Zero• 6.25% Maximum Error over +10°C to +60°C without Auto Zero•Ideally Suited for Microprocessor or Microcontroller-Based Systems •Thermoplastic (PPS) Surface Mount Package •Temperature Compensated over +10° to +60°C •Patented Silicon Shear Stress Strain Gauge•Available in Differential and Gauge Configurations Typical Applications•Hospital Beds •HVAC•Respiratory Systems •Process ControlORDERING INFORMATIONDevice TypeOptionsCase No.MPX Series Order No.Packing Options Device Marking SMALL OUTLINE PACKAGE (MPXV7002 SERIES)Ported ElementsGauge, Axial Port, SMT 482A MPXV7002GC6URailsMPXV 7002GGauge, Axial Port, SMT482A MPXV 7002G C6T1Tape & Reel MPXV 7002GGauge, Side Port, SMT 1369MPXV 7002G P Trays MPXV 7002G Differential, Dual Port, SMT1351MPXV 7002DP Trays MPXV 7002G Differential, Dual Port, SMT1351MPXV7002DPT1Tape & Reel MPXV7002G MPXV7002 SERIESINTEGRATED PRESSURE SENSOR -2 to 2 kPa (-0.3 to 0.3 psi)0.5 to 4.5 V OUTPUT SMALL OUTLINE PACKAGEPIN NUMBERS(1)1.Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.1N/C 5N/C 2V S 6N/C 3Gnd 7N/C 4V out8N/CSensing ElementThin Film Temperature Compensationand Gain Stage #1Gain Stage #2and Ground Reference Shift CircuitryV SV outGNDPins 1 and 5 through 8 are NO CONNECTS for surface mount packageMPXV7002SensorsFigure 1. Fully Integrated Pressure Sensor SchematicTable 1. Maximum Ratings (1)1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.RatingSymbol Value Unit Maximum Pressure (P1 > P2)P max 8.0kPa Storage Temperature T stg –30 to +100°C Operating TemperatureT A10 to +60°CTable 2. Operating Characteristics (V S = 5.0 Vdc, T A = 25°C unless otherwise noted. Decoupling circuit shown in Figure 3 required to meet specification.)CharacteristicSymbol Min Typ Max Unit Pressure Range (1)1. 1.0 kPa (kiloPascal) equals 0.145 psi.P OP –2.0— 2.0kPa Supply Voltage (2)2.Device is ratiometric within this specified excitation range.V S 4.75 5.0 5.25Vdc Supply Current I o ——10mAdc Pressure Offset (3)(10 to 60°C)@ V S = 5.0 Volts 3.Offset (V off ) is defined as the output voltage at the minimum rated pressure.V off 2.25 2.5 2.75Vdc Full Scale Output (4)(10 to 60°C)@ V S = 5.0 Volts 4.Full Scale Output (V FSO ) is defined as the output voltage at the maximum or full rated pressure.V FSO 4.25 4.5 4.75Vdc Full Scale Span (5)(10 to 60°C)@ V S = 5.0 Volts 5.Full Scale Span (V FSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure.V FSS 3.5 4.0 4.5 V Vdc Accuracy (6)(10 to 60°C)6.Accuracy (error budget) consists of the following:•Linearity:Output deviation from a straight line relationship with pressure over the specified pressure range.•Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled toand from the minimum or maximum operating temperature points, with zero differential pressure applied.•Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from theminimum or maximum rated pressure, at 25°C.•TcSpan:Output deviation over the temperature range of 10° to 60°C, relative to 25°C.•TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 10° to 60°C, relative to25°C.•Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of V FSS , at 25°C.——±2.5(7)7.Auto Zero at Factory Installation: Due to the sensitivity of the MPXV7002 Series, external mechanical stresses and mounting position can affect the zero pressure output reading. Autozero is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of ± 5°C between autozero and measurement.±6.25%V FSS Sensitivity V/P — 1.0—-V/kPa Response Time (8)8.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure.t R — 1.0—-ms Output Source Current at Full Scale Output I O+—0.1—-mAdc Warm-Up Time (9)9.Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.——20—-msMPXV7002SensorsON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONINGThe performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip.Figure 2 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482). A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm.The MPXV7002 series pressure sensor operatingcharacteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensorperformance and long-term reliability. Contact the factory for information regarding media compatibility in your application.Figure 3 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of amicroprocessor or microcontroller. Proper decoupling of the power supply is recommended.Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 10° to 60°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range.Figure 2. Cross-Sectional Diagram SOP(not to scale)Figure 3. Recommended Power Supply Decouplingand Output Filtering(For additional output filtering, please refer toApplication Note AN1646.)Figure 4. Output versus Pressure DifferentialFluoro Silicone Gel Die CoatWire Bond DieP1Stainless Steel CapThermoplasticCaseDie BondDifferential SensingElementP2+5 V1.0 µF0.01 µF470 pFGNDV sV outIPSOUTPUTLead FrameDifferential Pressure (kPa)O u t p u t V o l t a g e (V )5.04.03.02.01.002TYPICALMIN-2-11Transfer Function:V out = V S × (0.2 × P(kPa)+0.5) ± 6.25% V FSS V S = 5.0 Vdc T A = 10 to 60°CMAXMPXV7002SensorsPRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLEFreescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing a gel die coat which protects the die from harsh media.The Pressure (P1) side may be identified by using the table below:MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONSSurface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correctfootprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads.Figure 5. Small Outline Package FootprintPart NumberCase Type Pressure (P1)Side IdentifierMPXV7002GC6U/GC6T1482A-01Vertical Port Attached MPXV7002GP 1369-01Side with Port Attached MPXV7002DP1351-01Side with Dual Port Attached0.66016.760.060 TYP 8X 1.520.100 TYP 8X 2.540.100 TYP 8X 2.540.3007.62inch mmSCALE 2:1PACKAGE DIMENSIONSISSUE ASMALL OUTLINE PACKAGEMPXV7002 SensorsCASE 1351-01ISSUE ASMALL OUTLINE PACKAGEMPXV7002SensorsCASE 1351-01ISSUE ASMALL OUTLINE PACKAGEMPXV7002 SensorsCASE 1369-01ISSUE BSMALL OUTLINE PACKAGEMPXV7002SensorsCASE 1369-01ISSUE BSMALL OUTLINE PACKAGEMPXV7002 SensorsMPXV7002Rev. 0How to Reach Us:Home Page: E-mail:support@USA/Europe or Locations Not Listed:Freescale SemiconductorTechnical Information Center, CH3701300 N. Alma School Road Chandler, Arizona 85224+1-800-521-6274 or +1-480-768-2130support@Europe, Middle East, and Africa:Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 781829 Muenchen, Germany +44 1296 380 456 (English)+46 8 52200080 (English)+49 89 92103 559 (German)+33 1 69 35 48 48 (French)support@Japan:Freescale Semiconductor Japan Ltd.Headquarters ARCO Tower 15F1-8-1, Shimo-Meguro, Meguro-ku,Tokyo 153-0064Japan0120 191014 or +81 3 5437 9125support.japan@Asia/Pacific:Freescale Semiconductor Hong Kong Ltd.Technical Information Center 2 Dai King StreetTai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080@For Literature Requests Only:Freescale Semiconductor Literature Distribution Center P .O. Box 5405Denver, Colorado 802171-800-441-2447 or 303-675-2140Fax: 303-675-2150LDCForFreescaleSemiconductor@Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document.Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may beprovided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended orunauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.All other product or service names are the property of their respective owners.© Freescale Semiconductor, Inc. 2005. All rights reserved.。
2N7002 数据表 .pdf.pdf说明书
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
OFF CHARACTERISTICS
Drain–Source Breakdown Voltage (VGS = 0, ID = 10 µAdc)
VDSS
VDGR
ID ID IDM
60
60
±ā115 ±ā75 ±ā800
Vdc Vdc mAdc
Gate–Source Voltage – Continuous – Non–repetitive (tp ≤ 50 µs)
THERMAL CHARACTERISTICS
VGS
±ā20
Vdc
VGSM
±ā40
Figure 2. Transfer Characteristics
VGS(th), THRESHOLD VOLTAGE (NORMALIZED)
2.4
2.2 2.0 VGS = 10 V
ID = 200 mA 1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4 -ā60
-ā20
+ā20
+ā60
+ā100
Turn–On Delay Time Turn–Off Delay Time
(VDD = 25 Vdc, ID ^ 500 mAdc, RG = 25 Ω, RL = 50 Ω, Vgen = 10 V)
BODY–DRAIN DIODE RATINGS
td(on)
–
td(off)
MPXV7002DP中文资料
Document Number: MPXV7002Rev 0, 09/2005Freescale Semiconductor Technical Data© Freescale Semiconductor, Inc., 2005. All rights reserved.Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and CalibratedThe MPXV7002 series piezoresistive transducers are state-of-the-artmonolithic silicon pressure sensors designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.Features • 2.5% Typical Error over +10°C to +60°C with Auto Zero• 6.25% Maximum Error over +10°C to +60°C without Auto Zero•Ideally Suited for Microprocessor or Microcontroller-Based Systems •Thermoplastic (PPS) Surface Mount Package •Temperature Compensated over +10° to +60°C •Patented Silicon Shear Stress Strain Gauge•Available in Differential and Gauge Configurations Typical Applications•Hospital Beds •HVAC•Respiratory Systems •Process ControlORDERING INFORMATIONDevice TypeOptionsCase No.MPX Series Order No.Packing Options Device Marking SMALL OUTLINE PACKAGE (MPXV7002 SERIES)Ported ElementsGauge, Axial Port, SMT 482A MPXV7002GC6URailsMPXV 7002GGauge, Axial Port, SMT482A MPXV 7002G C6T1Tape & Reel MPXV 7002GGauge, Side Port, SMT 1369MPXV 7002G P Trays MPXV 7002G Differential, Dual Port, SMT1351MPXV 7002DP Trays MPXV 7002G Differential, Dual Port, SMT1351MPXV7002DPT1Tape & Reel MPXV7002G MPXV7002 SERIESINTEGRATED PRESSURE SENSOR -2 to 2 kPa (-0.3 to 0.3 psi)0.5 to 4.5 V OUTPUT SMALL OUTLINE PACKAGEPIN NUMBERS(1)1.Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.1N/C 5N/C 2V S 6N/C 3Gnd 7N/C 4V out8N/CSensing ElementThin Film Temperature Compensationand Gain Stage #1Gain Stage #2and Ground Reference Shift CircuitryV SV outGNDPins 1 and 5 through 8 are NO CONNECTS for surface mount packageMPXV7002SensorsFigure 1. Fully Integrated Pressure Sensor SchematicTable 1. Maximum Ratings (1)1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.RatingSymbol Value Unit Maximum Pressure (P1 > P2)P max 8.0kPa Storage Temperature T stg –30 to +100°C Operating TemperatureT A10 to +60°CTable 2. Operating Characteristics (V S = 5.0 Vdc, T A = 25°C unless otherwise noted. Decoupling circuit shown in Figure 3 required to meet specification.)CharacteristicSymbol Min Typ Max Unit Pressure Range (1)1. 1.0 kPa (kiloPascal) equals 0.145 psi.P OP –2.0— 2.0kPa Supply Voltage (2)2.Device is ratiometric within this specified excitation range.V S 4.75 5.0 5.25Vdc Supply Current I o ——10mAdc Pressure Offset (3)(10 to 60°C)@ V S = 5.0 Volts 3.Offset (V off ) is defined as the output voltage at the minimum rated pressure.V off 2.25 2.5 2.75Vdc Full Scale Output (4)(10 to 60°C)@ V S = 5.0 Volts 4.Full Scale Output (V FSO ) is defined as the output voltage at the maximum or full rated pressure.V FSO 4.25 4.5 4.75Vdc Full Scale Span (5)(10 to 60°C)@ V S = 5.0 Volts 5.Full Scale Span (V FSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure.V FSS 3.5 4.0 4.5 V Vdc Accuracy (6)(10 to 60°C)6.Accuracy (error budget) consists of the following:•Linearity:Output deviation from a straight line relationship with pressure over the specified pressure range.•Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled toand from the minimum or maximum operating temperature points, with zero differential pressure applied.•Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from theminimum or maximum rated pressure, at 25°C.•TcSpan:Output deviation over the temperature range of 10° to 60°C, relative to 25°C.•TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 10° to 60°C, relative to25°C.•Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of V FSS , at 25°C.——±2.5(7)7.Auto Zero at Factory Installation: Due to the sensitivity of the MPXV7002 Series, external mechanical stresses and mounting position can affect the zero pressure output reading. Autozero is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of ± 5°C between autozero and measurement.±6.25%V FSS Sensitivity V/P — 1.0—-V/kPa Response Time (8)8.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure.t R — 1.0—-ms Output Source Current at Full Scale Output I O+—0.1—-mAdc Warm-Up Time (9)9.Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.——20—-msMPXV7002SensorsON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONINGThe performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip.Figure 2 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482). A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm.The MPXV7002 series pressure sensor operatingcharacteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensorperformance and long-term reliability. Contact the factory for information regarding media compatibility in your application.Figure 3 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of amicroprocessor or microcontroller. Proper decoupling of the power supply is recommended.Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 10° to 60°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range.Figure 2. Cross-Sectional Diagram SOP(not to scale)Figure 3. Recommended Power Supply Decouplingand Output Filtering(For additional output filtering, please refer toApplication Note AN1646.)Figure 4. Output versus Pressure DifferentialFluoro Silicone Gel Die CoatWire Bond DieP1Stainless Steel CapThermoplasticCaseDie BondDifferential SensingElementP2+5 V1.0 µF0.01 µF470 pFGNDV sV outIPSOUTPUTLead FrameDifferential Pressure (kPa)O u t p u t V o l t a g e (V )5.04.03.02.01.002TYPICALMIN-2-11Transfer Function:V out = V S × (0.2 × P(kPa)+0.5) ± 6.25% V FSS V S = 5.0 Vdc T A = 10 to 60°CMAXMPXV7002SensorsPRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLEFreescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing a gel die coat which protects the die from harsh media.The Pressure (P1) side may be identified by using the table below:MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONSSurface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correctfootprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads.Figure 5. Small Outline Package FootprintPart NumberCase Type Pressure (P1)Side IdentifierMPXV7002GC6U/GC6T1482A-01Vertical Port Attached MPXV7002GP 1369-01Side with Port Attached MPXV7002DP1351-01Side with Dual Port Attached0.66016.760.060 TYP 8X 1.520.100 TYP 8X 2.540.100 TYP 8X 2.540.3007.62inch mmSCALE 2:1PACKAGE DIMENSIONSISSUE ASMALL OUTLINE PACKAGEMPXV7002 SensorsCASE 1351-01ISSUE ASMALL OUTLINE PACKAGEMPXV7002SensorsCASE 1351-01ISSUE ASMALL OUTLINE PACKAGEMPXV7002 SensorsCASE 1369-01ISSUE BSMALL OUTLINE PACKAGEMPXV7002SensorsCASE 1369-01ISSUE BSMALL OUTLINE PACKAGEMPXV7002 SensorsMPXV7002Rev. 0How to Reach Us:Home Page: E-mail:support@USA/Europe or Locations Not Listed:Freescale SemiconductorTechnical Information Center, CH3701300 N. Alma School Road Chandler, Arizona 85224+1-800-521-6274 or +1-480-768-2130support@Europe, Middle East, and Africa:Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 781829 Muenchen, Germany +44 1296 380 456 (English)+46 8 52200080 (English)+49 89 92103 559 (German)+33 1 69 35 48 48 (French)support@Japan:Freescale Semiconductor Japan Ltd.Headquarters ARCO Tower 15F1-8-1, Shimo-Meguro, Meguro-ku,Tokyo 153-0064Japan0120 191014 or +81 3 5437 9125support.japan@Asia/Pacific:Freescale Semiconductor Hong Kong Ltd.Technical Information Center 2 Dai King StreetTai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080@For Literature Requests Only:Freescale Semiconductor Literature Distribution Center P .O. Box 5405Denver, Colorado 802171-800-441-2447 or 303-675-2140Fax: 303-675-2150LDCForFreescaleSemiconductor@Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document.Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may beprovided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended orunauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.All other product or service names are the property of their respective owners.© Freescale Semiconductor, Inc. 2005. All rights reserved.。
RCLAMP7002M.TBT中文资料
RailClamp Low Capacitance TVS Diode Array
Features
1000 Watts peak pulse power (8/20µs) Protection for high-speed data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 1kV, 24A (1.2/50µs) Low clamping voltage: 10V at Ipp = 40A (8/20µs) Array of surge rated suppression diodes Protects two high speed lines Low capacitance: 10pF (I/O to Ground) Operating voltage range: 3.3 - 70V Small package saves board space Solid-state silicon-avalanche technology JEDEC MSOP-10L package Molding compound flammability rating: UL 94V-0 Marking: Marking code and date code Packaging: Tape and Reel per EIA 481 Lead Finish: Matte tin RoHS/WEEE Compliant ADSL Lines Central Office Equipment T1/E1 secondary IC Side Protection Small Office Home Office (SOHO) Applications WAN/LAN Equipment ISDN S/T Interface ATM Interfaces
2N7002中文资料_数据手册_参数
件编号：71333 S09-0857-REV. E，2009年5月18日 VISHAY SILICONIX 2N7002K典型征 25°C，除非另有说明源极 - 漏极二极管正向电压温度阈值电 压方差 1.2 1.5 1 100 1000 0.0 0.3 0.6 0.9 T J = 125℃ V SD - 源极至漏极电压（V） 10 T J = - 55℃ V GS = 0V T J = 25℃ - 0.8 - 0.6 - 0.4 - 0.2 0.0 0.2 0.4 - 50 - 25 0 25 50 75 100 125 150 I D = 250μA T J - 结温（°C）导通电阻与栅源电压的关系单脉冲功率，结到环境 0 1 2 3 4五 02468 10 V GS - 栅极 - 源极电压（V） 我 D = 500毫安 我 D = 200毫安 0.01 0 1 2.5 3 100 600 0.1时间（S） 1.5 2 0.5 1 10 T A = 25℃归一化热暂态阻抗，结到环境 10 10 -3 10 -2 1 10 600 10 -1 -4 100 2 1 0.1 0.01 0.2 0.1 0.05 0.02单脉冲占空比= 0.5方波脉冲持续时间（S） 1.工作周期D = 2.每单位基数= R THJA = 350℃/ W 3. T JM - T A = P DM Z THJA（T） T 1 T 2 T 1 T 2笔记： 4.表面安装 P D
万联芯城
万联芯城-电子元器件采购网，专 为终端工厂客户提供一站式电子元器件配套服务，万 联芯城所售电子元器件均为原装现货库存，提交 BOM 表立即报价。万联芯城代理长电，顺络，先科 ST 等知名电子元器件品牌，价格有明显的优势，欢 迎广大客户咨询相关采购业务。点击进入万联芯城。
FAIRCHILD 2N7000 2N7002 NDS7002A 数据手册
2N7000 / 2N7002 / NDS7002AN-Channel Enhancement Mode Field Effect TransistorGeneral Description___________________________________________________________________________________________These N-Channel enhancement mode field effect transistors are produced using Fairchild's proprietary, high cell density,DMOS technology. These products have been designed to minimize on-state resistance while provide rugged, reliable,and fast switching performance. They can be used in most applications requiring up to 400mA DC and can deliver pulsed currents up to 2A. These products are particularly suited for low voltage, low current applications such as small servo motor control, power MOSFET gate drivers, and other switching applications.SG D TO-92 2N7000(TO-236AB)TRADEMARKSThe following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORTDEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.As used herein:1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant intothe body, or (b) support or sustain life, or (c) whosefailure to perform when properly used in accordancewith instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.2. A critical component is any component of a lifesupport device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status DefinitionAdvance InformationPreliminary No Identification Needed Obsolete This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.This datasheet contains preliminary data, andsupplementary data will be published at a later date.Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor.The datasheet is printed for reference information only.Formative or In DesignFirst ProductionFull ProductionNot In ProductionDISCLAIMERFAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY , FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.PowerTrench QFET™QS™QT Optoelectronics™Quiet Series™SILENT SWITCHER SMART START™SuperSOT™-3SuperSOT™-6SuperSOT™-8FASTr™GlobalOptoisolator™GTO™HiSeC™ISOPLANAR™MICROWIRE™OPTOLOGIC™OPTOPLANAR™PACMAN™POP™Rev. GACEx™Bottomless™CoolFET™CROSSVOLT ™DOME™E 2CMOS TM EnSigna TM FACT™FACT Quiet Series™FAST SyncFET™TinyLogic™UHC™VCX™。
tc7002参数
tc7002参数
TC7002的参数包括：
1. 设备型号：TC700-2
2. 机型简称：700
3. 发动机型号：东康ISLe 375 30（国Ⅲ）
4. 额定功率（kW）：276/2200
5. 额定扭矩（N·m/r/min）：1550/1400\~1600
6. 整车整备质量（kg）：45000
7. 行驶状态自重（总质量）（kg）：45000
8. 前桥轴荷（kg）：9500/9500
9. 中后桥轴荷（kg）：26000
10. 额定总起重量（kg）：70000
11. 支腿跨距（纵向×横向）（m）：基本臂最大起重力矩（kN·m）：2303
12. 基本臂最大起升高度（m）：最长主臂最大起重力矩（kN·m）：1221
13. 主臂最大起升高度（m）：
14. 副臂最大起升高度（m）
15. 转台尾部回转半径（mm）
16. 最大工作幅度（mm）
17. 额定工作压力（Mpa）
18. 额定系统流量（L/min）
19. 变幅角度（°）
20. 回转角度（°）
21. 作业速度：单绳最大速度（主卷扬）（m/min）：130；单绳最大速度（副卷扬）（m/min）；起重臂起幅/落幅时间（s）：50；起重臂全伸/全缩时间（s）：110；水平支腿伸/缩时间（s）；垂直支腿伸/缩时间（s）；回转速度（r/min）：0-2。
22. 行驶参数：最高行驶速度（km/h）：80；最大爬坡度（%）：40；接近角（°）：19；离去角（°）：12；最小转弯直径（m）：24。
CXA2112资料
LCD DriverDescriptionThe CXA2112R is a driver IC developed for use in the 6-input/12-input Sony polysilicon TFT LCD panel (LCX016/017). It has a line invert amplifier and analog de-multiplexers, timing generator and output buffers required for these. CXA2112R can directly drive analog inputs of LCX016/017. It is used one IC with the LCX016, and two ICs with the LCX017. The VCOM setting circuit and pre-charge pulse waveform generator are also on-chip.Features•High-speed signal processing supports XGA high refresh signal (dot clock to 100MHz)•Overall wide band response•Low output deviation by on-chip output offset cancel circuit•Small phase delay difference between inverted signal and non-inverted signal •On-chip timing generator with ECL •Dot clock phase adjustment function •VCOM voltage generation circuit•Pre-charge pulse waveform generation circuit Absolute Maximum Ratings •Supply voltage V CC 16V •Supply voltageV DD5.5V •Operating temperature –20 to +70°C •Storage temperature–65 to +150°C•Allowable power dissipation P D2300mW (single layered board mounted)Operating Conditions •Supply voltage V CC 15 to 15.5V •Supply voltageV DD 4.75 to 5.25V– 1–E97801A81-PSSony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.CXA2112RFor the availability of this product, please contact the sales office.– 2–Block DiagramP O S _C N T 1P O S _C N T 2N E X T _O U TN E X T _I NF /R _C N TG N DN CD .PD .PS /12_C N TN CE N BD I R _C N TN CN CN CO F F S E TV I D E O _I NI N V _O U TS H _I NF R PV C CS I D _O F S TD .PD .PS I D _I NS I D _O U TI S E TN CS I G C E NV C O M O F S T V C O M O U TGND2SH_OUT1NC SH_OUT2NCSH_OUT3PV CCD.P D.PPGND NCSH_OUT4NCSH_OUT5NC SH_OUT6INV_CNT DLY_CNT MCLK MCLK/V DD CLK_OUT CLK_OUT/D.P D.P DGND CLK_IN NC CLK_IN/PRG NC NCPin Description– 3–– 4–– 5–– 6–– 7–53V DD5V5V power supply.588, 9, 24, 25, 40, 41, 56, 577, 11, 14, 15, 16, 18, 20, 22, 28, 30, 36, 60, 63, 64DGNDD.P GNDDigital GND.Die pad.Used as thermal radiator onboard.Connect to GND.NCNo connection.Not connected to anything.Pin No.Symbol I/OStandardvoltage levelEquivalent circuit Description– 8–– 9–Electrical Characteristics (See Electrical Characteristics Measurement Circuit.)V DD = 5V, V CC = 15.5V, V SIGCEN = 7V, Ta = 25°C V DD current consumption Vcc current consumption Invert amplifier gainInvert amplifier slew rateInvert amplifier output band widthOutput delay deviationfor inverse/non-inverse SID gainSID output slew rate VCOM adjustable rangeFarst stage S/H slew rateSH_OUT slew rate Output deviation between channels ∗Dot clock input highestfrequencyDot clock input lowest frequency Maximum output voltageMinimum output voltageI DD I CC A INVSR INV BW INV T DIFFA SIDSR SID V COM SR SH1SR OUTD OUTf CLKHf CLKLV MAX V MINI VDD I VCC1I VCC2V INV V INV INV V INV V INV V SID V SID_INV SID V COM—V OUT 1 to V OUT 6V OUT 1 to V OUT 6f CLK f CLK V OUT 1 to V OUT 6V OUT 1 to V OUT 6I DD = I VDDI CC = I VCC1+ I VCC2A INV = V INV (AC)/V INInput a square wave from V IN so that V INV output amplitude is3.5Vp-p. Measure slew rate at 10 to 90% of output waveform rise or fall. (for inverse or non-inverse)Input 2.5V DC, 100mVp-p AC from Pin 47 (VIDEO_IN) andmeasure V INV . The frequency that is –3dB to 100kHz. (for inverse/non-inverse)Invert amplifier delay time difference for inverse and non-inverse.A SID = V SID (AC)/V SID_INInput invert pulse to Pin 44(FRP), load capacity C7 = 47pF, and apply DC input voltage to V SID_IN so that V SID is 2.5V/11.5V. Measure slew rate at 10 to 90% of output waveform rise or fall.VCOM output voltage when Pin 34 (VCOMOFST) is changed from 0 to 10V.First stage S/H slew rate on Block Diagram.Input a square wave from V IN so that VOUT1 to VOUT6 output amplitude is 3.5Vp-p. Measure slew rate at 10 to 90% of output waveform rise or fall. (load 270pF, for inverse or non-inverse)Apply DC voltage to V IN so that V INV (SH_IN) is 6V.Highest frequency for f CLK output at correct timing.Lowest frequency for f CLK output at correct timing.Maximum voltage at which sample-and-hold output(SH_OUT1 to SH_OUT6) can be output.Minimum voltage at which sample-and-hold output(SH_OUT1 to SH_OUT6) can be output.2230——————Vsig – 2or less ———1001332412.7700902430—70015031151213.524252———4——Vsig ——10202.5mA mA timesV/µsMHzns timesV/µsV V/µsV/µsmVp-p MHzMHzVV12345678910111213141516No.ItemSymbolMeasurement pointsMeasurement contentsMin.Typ.Max.Unit∗Minimum VOUT1 to VOUT6 value subtracted from maximum VOUT1 to VOUT6 value.Unless otherwise specified, pin setting conditions are as follows.(48) OFFSET = 3.3V, (47) VIDEO_IN = 2.0V, (42) SID_OFST = 3.3V, (39) SID_IN = 2.3V, (35) SIGCEN = 7.0V, (34) VCOMOFST = 0.0V, (1) POS_CNT1 = 0.0V, (2) POS_CNT2 = 0.0V, (5) F/R_CNT = 5.0V, (10) S/12_CNT = 5.0V, (13) DIR_CNT = 5.0V, (49) DLY_CNT = 4.0V, (52) INV_CNT = 5.0V, (44) FRP = 0.0V, f CLK= 65MHz– 10–– 11–Electrical Characteristics Measurement CircuitOUT 6OUT 5OUT 4OUT 1OUT 2OUT 3Frequency f CLK– 12–Description of Operation1. INVERT_AMPThe VIDEO signal from VIDEO_IN (Pin 47) is amplified about 2.7 times at INVERT_AMP. Its output is INV_OUT (Pin 46). Status of INVERT_AMP is determined by FRP (Pin 44) input (high: inverse, low: non-inverse). Invert operation is carried out with SIGCEN (Pin 35) potential as center voltage of signal inversion.OFFSET (Pin 48) input voltage corresponds to 100% white level of the signal input to VIDEO_IN.When used in combination with the CXA2111R, connect the CXA2111R V33 (Pin 8) output to the CXA2112R OFFSET. When use DA converter output as the VIDEO signal, connect DA converter maximum output voltage (normally, DA converter's supply voltage).VIDEO INFRPINV_OUTOutput level when input is up to OFFSET levelSIGCEN potentialOFFSET level2. SIDThe signal input to SID_IN (Pin 39) is folded by SIGCEN potential, the same as for INVERT_AMP operation,and outputs to SID_OUT (Pin 38).Gain is about 4 times. SID_OFST (Pin 42) operates in the same way as OFFSET input for INVERT_AMP. In combination with the CXA2111R, connect the CXA2111R SID_OUT (Pin 6) to the CXA2112R SID_IN, and CXA2111R V33 (Pin 8) to the CXA2112R SID_OFST.– 13–Output level when input isSID INFRPSIGCEN potentialSID_OFST levelThe SID output is prepared for the Sony LCD panel's (LCX017 and LCX016) uniformity improvement signal input (Psig input). SID_OUT does not have the capability to drive those pins directly. Connect via a buffer.3. VCOMVCOM generates the DC voltage applied to the Sony LCD panel COM electrode. VCOMOUT (Pin 33) voltage is set as the deviation relative to SIGCEN voltage.When VCOMOFST (Pin 34) is changed from 0 to 10V, VCOMOUT changes from (SIGCEN potential) to (SIGCEN potential) – 2V.– 14–4. De-MultiplexerSH_IN (Pin 45) input is de-multiplexed in order from SH_OUT1 (Pin 31) to SH_OUT6 (Pin 17) according to internal timing generator setting, and then is output.Output phase is made simultaneous by the 3-stage sample-and-hold circuit.The waveform example below shows this operation for forward scan, 6-output de-multiplexing.ADGKCF HJBEILSH_INCLK_IN0VSH_OUT10V0V0V0V0VSH_OUT2SH_OUT3SH_OUT4SH_OUT5SH_OUT6Depending on the operation mode setting, scan direction (SH_OUT1 →SH_OUT6 and SH_OUT6 →SH_OUT1), number of outputs (6-output/12-output) and sample-and-hold position (output phase) can be changed.2)Scan direction switchingDIR_CNT (Pin 13) high gives forward scan, and low gives reverse scan. For forward scan, the input signal level time series is output in descending order from SH_OUT1, and for reverse scan, in descending order from SH_OUT6.For 12-output, SH_OUT6 and SH_OUT1 operated as if connected in order.3)Sample-and-hold position settingOutput's phase can be changed by the voltage applied to POS_CNT1 (Pin 1) and POS_CNT2 (Pin 2). This setting is done for adjustment of the LCD panel input signal timing.Each input pin has 4 setting values, for a total of 16settings.POS_CNT1 is lower, POS_CNT2 is upper, and each setting values are as shown in Table A-1.– 15–5. Operation Mode Setting1)For each RGB channel, LCX016 requires demultiplexed 6 analog outputs (one CXA2112R), and LCX017needs 12 (two CXA2112R). In either case, scan direction switching, sample-and-hold position and phase can be controlled. The mode input pin settings for each case are shown below.Fixed Mode SettingS/12_CNT (Pin 10)F/R_CNT (Pin 5)NEXT_IN (Pin 4)NEXT_OUT (Pin 3)6-outputsLCX016LCX017High X ∗1Short"FRONT" half of 12 outputs ∗2Low HighConnect to the other NEXT_OUT Connect to the other NEXT_IN"REAR" half of 12 outputs ∗2Low LowTable B∗1X: Don't Care∗2"FRONT": input data sampling begins from "FRONT" chip for forward scan direction (DIR_CNT high).Setting value0123Threshold GND 1.151.702.950.75V 1.50V 2.55V V DDto to to to Table A-1Setting Voltage Range for Sample-and-Hold Position– 16–There are two ways to use these pins.A.Connect directly to the CXA2111R.Connect to the corresponding CXA2111R pins POS_CNT1 and POS_CNT2. This allows bit setting via the CXA2111R register controlled by I 2C bus.B.Connect to CMOS logic.Connect CMOS logic as shown in the diagram. See Table A-2.R1 sets the level for setting values 1 and 2. The appropriate resistance value changes depending on numbers of CXA2112R are driven by one CMOS logic (1-channel or RGB 3-channel drive, or one CXA2112R (6-outputs/ch) or two CXA2112R (12-outputs/ch)).Recommended resistance values are given in Table A-3.CMOS Logic ConnectionUsage of CXA2112R and Threshold Setting Resistor R1Setting value0123a L Hi-Z Hi-Z Hb L L H HTable A-2CMOS Logic ConnectionSetting Value and CMOS Output PinsPOS_CNT1(POS_CNT2)CM O SSupply voltage V MOSR1 value6-outputs 270k Ω12-outputs 150k Ω6-outputs 100k Ω12-outputs47k ΩTable A-3V MOS = 3.3 to 5VRGB 1-channel driveRGB 3-channel drive6. Dot Clock Phase AdjustmentThe CXA2112R has phase adjustment function for input dot clock to achieve high precision and stable operation.High definition images with no jitter and flicker can be reproduced by this adjustment.De-multiplexer operation timing is generated from the clock input to CLK_IN (Pin 59) and CLK_IN/ (Pin 61) (ECL differential). By connecting CLK_OUT (Pin 54) and CLK_OUT/ (Pin 55) to CLK IN/, phase adjusted clock can be used for its timing generation.The CLOCK DELAY block is a PLL clock generator that uses MCLK (Pin 50) and MCLK/ (Pin 51) ECL differential input clock as reference. The CLK_OUT polarity, inverted/non-inverted can be switched by high/low of INV_CNT (Pin 52) input.Also, in the DLY_CNT (Pin 49) input voltage range of 3 to 5V, CLK_OUT phase relative to MCLK can be changed continuously 180deg. (PH DLY in the diagram below.)It also has the advantage that an MCLK with noise can be shaped and used on the board.MCLKCLK_OUTSH_IN7. Usage of CXA2112R in 12-outputsTwo CXA2112Rs are required for 12-outputs, as shown in Application Circuit 2.Please note that the following precautions.•Input the same clock to both ICs' timing generator clock input pins CLK_IN and CLK_IN/. To be concrete, connect one CLK_OUT and CLK_OUT/ to both ICs' CLK_IN and CLK_IN/. At this time, the other CLK_OUT and CLK_OUT/ are not used, but be sure to input the same clock to MCLK and MCLK/ inputs.•Connect both ICs' SH_INs to only one ICs' INV_OUT. At that time, connect the other ICs' VIDEO_IN and OFFSET to 5V. In the same way, connect the other ICs' SID_IN and SID_OFST to 5V.•When only one IC is used for all of INVET_AMP, SID and VCOM, the FRP input on the other IC does not have to be at the timing in the above paragraph, but can be connected to GND.•Short ENB, PRG, POS_CNT1, POS_CNT2, DIR_CNT, INV_CNT and DLY_CNT at both ICs, and apply the same signals.– 17–– 18–Notes on Operation1. Signal input timings to the timing generatorInput Signal Timing ChartENBPRGFRPMaintain the relationship in the timing chart. While PRG is high, video input signal must not be changed.The same name output from Sony's LCD timing generators CXD2442Q and CXD2453Q satisfy the above conditions.If the above timing does not be satisfied, timing violation may cause decay of characteristics or IC damage in some case. Especially do not input FRP pulse without ENB and PRG input.We strongly recommend to verify the design on this timings and presence of ENB and PRG.2. Notes on Mounting•Please be sure that the wiring for internal timing generator link pins NEXT_IN (Pin 4) and NEXT_OUT (Pin 3)is as short as possible, in especially 12-outputs. Also, do not locate a large amplitude high-speed signal path (such as CMOS logic) near the wiring.•The eight pins 8, 9, 24, 25, 40, 41, 56 and 57 are connected to the "die pad" inside the package. A good thermal radiation effect can be achieved by a thick connection to GND plane.•Be sure to short PVcc (Pin 26) and Vcc (Pin 43) so that they go on and off simultaneously.3. Input Video Signal•Please be sure that the video signal amplitude (0% black level to 100% white level) which inputs to sample and hold (SH_IN (Pin 45)) does not exceed 3.5V PP.Also, as for inputting to sample and hold, do not apply DC level of 2V or lower during operation.Application Circuit 1Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.– 19–Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.– 20–– 21–Example of Representative Characteristics (V CC = 15.5V, V DD = 5.0V, SIGCEN = 7.0V, Ta = 25°C)180120600–60–120–1802.53 3.54 4.55CLK_OUT phase to MCLK vs. DLY_CNT voltage (1)DLY_CNT (Pin 49) voltage [V]P h a s e [d e g ]180120600–60–120–1802.53 3.54 4.55CLK_OUT phase to MCLK vs. DLY_CNT voltage (2)DLY_CNT (Pin 49) voltage [V]P h a s e [d e g ]1614121020012345SID_OUT voltage vs. SID_OFST voltage (1)SID_OFST (Pin 42) voltage [V]S I D _O U T (P i n 38) v o l t a g e [V ]86412102012345SID_OUT voltage vs. SID_OFST voltage (2)SID_OFST (Pin 42) voltage [V]S I D _O U T (P i n 38) v o l t a g e [V ]8641614121020012345SID_OUT voltage vs. SID_IN voltage (1)SID_IN (Pin 39) voltage [V]S I D _O U T (P i n 38) v o l t a g e [V ]8641614121020012345SID_OUT voltage vs. SID_IN voltage (2)SID_IN (Pin 39) voltage [V]S I D _O U T (P i n 38) v o l t a g e [V ]864– 22–141020012345INV_OUT voltage vs. OFFSET voltage (1)OFFSET (Pin48) voltage [V]I N V _O U T (P i n 46) v o l t a g e [V ]86412141020012345INV_OUT voltage vs. OFFSET voltage (2)OFFSET (Pin48) voltage [V]I N V _O U T (P i n 46) v o l t a g e [V ]86412141020012345INV_OUT voltage vs. VIDEO_IN voltage (1)VIDEO_IN (Pin 47) voltage [V]I N V _O U T (P i n 46) v o l t a g e [V ]86412141020012345INV_OUT voltage vs. VIDEO_IN voltage (2)VIDEO_IN (Pin 47) voltage [V]I N V _O U T (P i n 46) v o l t a g e [V ]8641286100108VCOMOUT voltage vs. VCOMOFST voltageVCOMOFST (Pin 34) voltage [V]V C O M O U T (P i n 33) v o l t a g e [V ]432572461412Package Outline Unit: mmSONY CODE EIAJ CODE JEDEC CODEPACKAGE MATERIALLEAD TREATMENTLEAD MATERIALPACKAGE MASSEPOXY RESINPALLADIUM PLATINGCOPPER ALLOYPACKAGE STRUCTURELQFP-64P-L02LQFP064-P-14140.7g0.37 – 0.07+ 0.08(0.35)(.125).145±.464PIN LQFP (PLASTIC)DETAIL ADETAIL BNOTE: Dimension “∗” does not include mold protrusion.NOTE : PALLADIUM PLATINGThis product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).– 23–。
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Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.CXA7002R64 pin LQFP (Plastic)I 2C Bus Compatible Audio Video (AV) Switch & Electronic Volume ControlDescriptionThe Sony CXA7002R is an Audio/Video switch designed primarily for application in Digital Set Top Boxes. It provides video and audio routing from the digital encoder source to the TV and VCR scart (peri-television) connectors. In addition, the TV audio output has a programmable volume control. The chip is programmed by means of an I 2C interface and can operate from a single or dual power supply.Target specifications:Canal+, BSkyB, TPS, NorDig,and ECCA Euro-Box FeaturesSupply•Single:0V, +5V , +12V•Dual:0V, –5V, +5V and +12V(Low number of external parts required)Video•2 scart switching (VCR, TV)•VCR input supports RGB mode•Integrated 75Ω drivers for direct video connection •Y/C mixer with trap for RF modulators •Switchable clamps on inputs •Low pass filters on six inputs•Controllable gain on encoder inputs •Adjustable gain on RGB outputs•Video output shutdown for low power modes •Fast blanking switch•Slow blanking switch for TV and VCR output •SVHS switch on VCR output •Y/C auxiliary inputAudio•Four stereo audio inputs•Volume control (–56dB to +6dB in 2dB steps)•Additional +6dB gain on audio DAC inputs •Audio overlay facility•Volume bypass for TV and Phono outputs •Mono switching on TV , VCR outputs •Switchable audio limiter function•Switchable Mono output for RF modulators •Audio output disable for standby modeI 2C and Logic•Fast mode compatible I 2C bus•Function monitor with loop through•Interrupt output for function monitor and sync detect•Logic output pin•Sync detector for Y/CVBS inputs Applications•Digital Set Top Box•Integrated digital television StructureBipolar silicon monolithic ICAbsolute Maximum Ratings (Ta = 25°C)unless stated•Supply voltage V CC14V •Storage temperature Tstg –65 to +150°C •Allowable power dissipationP D 1.1W (when mounted on the board)Operating Conditions •Single supply12 ± 0.6V 5 ± 0.25V•Dual supply –5 ± 0.25V5 ± 0.25V 12 ± 0.6V•Operating temperature Topr –20 to +75°C •Maximum ESD voltage ±2kV(Human Body Model)– 2 –CXA7002RBlock Diagram (1) Video SectionNote) All video outputs contain 75Ω drivers.VOUT_1BLUEVIN_1DIG BLUE VIN_2VCR BLUEVIN_4VCR GREEN VIN_7VCR RED/CHROMATVVOUT_2GREENVIN_3DIG GREEN/CVBSVOUT_3VOUT_4LUMA/CVBS VOUT_7RF MODVOUT_5CHROMAVOUT_6GND_VID V CC _AUDAUD_BIAS +5V_VID +5V_VOUT LUMA/CVBSTRAPVIN_5DIG RED/CHROMA VIN_6DIG CHROMAVIN_13AUX CHROMA VIN_8DIG CVBS/LUMA VIN_9DIG CVBS/LUMA VIN_10VCR CVBS/LUMA VIN_11TV CVBS VIN_12VID_BIASGND GND –5V_GNDA –5V_GNDA –5V_GNDA +12V +5V_DIG GND_DIG AUD_BIAS +5/12V_V CC A AUX Y/CVBS– 3 –CXA7002R(2) Audio SectionRIN_1 (DIG)MONOPHONO_RRTVLTVPHONO_LROUT1LOUT1VCRRIN_2 (VCR)RIN_3 (TV/OVERLAY)RIN_4 (AUX)LIN_1 (DIG)LIN_2 (VCR)LIN_3 (TV/OVERLAY)LIN_4 (AUX)TVH/W MUTE– 4 –(3) Digital SectionTV_FBLKLOGICFNC_TVFBLK_IN1FBLK_IN2INTERUPTSDA SCL FNC_VCR– 5 –RIN_4LIN_4VIN_7VIN_10VIN_4VIN_2VIN_13VIN_12VIN_11+5V_VID GND_VID VOUT_5VOUT_6VOUT_4VOUT_3+5V_VOUT V O U T _2V O U T _1V O U T _7T R A PV I D _B I A SV I N _1V I N _3V I N _5V I N _6V I N _8V I N _9G N D–5V _G N D AL O G I CL T VR T VL I N _3R I N _3A U D _B I A SL I N _2R I N _2S Y N C _I DL I N _1R I N _1I N T E R U P TS C LS D AG N D–5V _G N D AV c c _A U DG N D _A U DR O U T 1LOUT1MONO PHONO_R PHONO_L +5/+12V_VccA –5V_GNDA AUD_BIAS GND_DIG +5V_DIG FBLK_IN2FNC_VCR TV_FBLK FBLK_IN1HW_MUTE FNC_TV +12V– 6 –– 7 –– 8 –– 9 –Electrical CharacteristicsNominal conditions (Ta = 25°C)Item Current consumption (Single ended supply)Current consumption (Dual supply)SymbolIcc1Icc2Icc3Icc4Icc5Conditions+12 supply, no signal, no load+5 supply, no signal, no load+12 supply, no signal, no load+5 supply, no signal, no load–5 supply, no signal, no loadMin.————–50Typ.30601080–20Max.558530110—UnitmAmAmAmAmA(1) Video SystemNominal conditions single supply (Ta = 25°C, +5V/12V_VccA = +12V, –5V_GNDA = 0V, +5V_VID = +5V, +5V_VOUT = +5V, +5V_DIG = +5V)ItemSync tip clamp voltage at input Chroma bias input voltageRGB dc restore input voltageSync tip clamp voltage at output Chroma bias output voltage RGB dc restore output voltageGain (Vout1 to 7)Gain (Vout1, 2, 3)Video input gainVin 1, 3, 5, 6, 8, 9SymbolVclmp1Cbias1Cbias2RGB1Vclmp2Cbias3RGB2GVvGV RGB1GV RGB2GV RGB3G i/p1G i/p1G i/p1ConditionsVin3, Vin8, Vin9, Vin10, Vin11,Vin12 inputs. (Vin3 set to CVBSmode) (Fig. 1)Vin5, Vin7 inputs. Clamps set toChroma bias mode. (Fig. 1)Vin6, Vin13 inputs. (Fig. 1)Vin1, Vin2, Vin3, Vin4, Vin5, Vin7inputs. (Vin3 & Vin5 set to RGBmode) (Fig. 1)Vout4, Vout6 outputs (Fig. 1)Vout3, Vout5 outputs (Fig. 1)Vout1, Vout2, Vout3 outputs(Fig. 1)f = 200kHz, 0.3Vp-p input,RGB Gain = 0dB,Input Gain = 0dB (Fig. 2)f = 200kHz, 0.3Vp-p input,RGB Gain = +1dB,Input Gain = 0dB (Fig. 2)f = 200kHz, 0.3Vp-p input,RGB Gain = +2dB,Input Gain = 0dB (Fig. 2)f = 200kHz, 0.3Vp-p input,RGB Gain = +3dB,Input Gain = 0dB (Fig. 2)f = 200kHz, 0.3Vp-p input,Video gain = +1dB (Fig. 2)f = 200kHz, 0.3Vp-p input,Video gain = +3dB (Fig. 2)f = 200kHz, 0.3Vp-p input,Video gain = +6dB (Fig. 2)Min.———————5.56.57.58.56.58.511.5Typ.2.43.12.452.50.31.80.66.07.08.09.07.09.012.0Max.———————6.57.58.59.57.59.512.5UnitVVVVVVVdBdBdBdBdBdBdB– 10 –– 11 –Audio SystemUnless otherwise stated: input coupling capacitor 1µF; output coupling capacitor of 10µF; load of 10kΩ.Nominal conditions single supply(Ta = 25°C, +5V/12V_V CC A = +12V, –5V_GNDA = 0V, +5V_VID = +5V,+5V_VOUT = +5V, +5V_DIG = +5V, GND_VID = 0V) Nominal conditions dual supply(Ta = 25°C, +5V/12V_V CC A = +5V, –5V_GNDA = –5V, +5V_VID = +5V,+5V_VOUT = +5V, +5V_DIG = +5V, GND_VID = 0V)ItemInput pin voltage(Single/Dual supply)Output pin voltage(Single supply)Output pin voltage(Dual supply)Output pin voltage when disabled (Single/Dual supply)GainInputRin1 or Lin1Rin1 or Lin1Rin1 + Lin1Rin1 + Lin1Rin2, 3, 4 orLin2, 3, 4Rin1 + Lin1Rin2 + Lin2Rin3 + Lin3Rin4 + Lin4Rin2 + Lin2Rin3 + Lin3Rin4 + Lin4Rin3Lin3SymbolV APIN1V APIN2V APIN2V APIN3GV A1GV A2GV A3GV A4GV A5GV A6GV A7GV A9GV A10GV A11ConditionsNo signal, no load (Fig. 3)No signal, no load (Fig. 3)No signal, no load (Fig. 3)No signal, no load (Fig. 3)f = 10kHz, 0.3Vp-p input(Fig. 4)f = 10kHz, 0.3Vp-p input(Fig. 4)f = 10kHz, 0.3Vp-p stereo input,TV volume set to 0dB, TV monoswitch on (Fig. 4)f = 10kHz, 0.3Vp-p stereo input,TV volume set to 0dB (Note 1)(Fig. 4)f = 10kHz, 0.3Vp-p input,TV volume set to 0dB (Fig. 4)f = 10kHz, 0.3Vp-p stereo input,VCR mono switch on (Fig. 4)f = 10kHz, 0.3Vp-p stereo input,TV volume set to 0dB (Note 1)(Fig. 4)f = 10kHz, 0.3Vp-p input,VCR mono switch on (Fig. 4)f = 10kHz, 0.3Vp-p, Lin3 hasno signal Audio overlay enabled.(Fig. 4)f = 10kHz, 0.3Vp-p input Audiooverlay enabled. (Fig. 4)Min.2.255.75–0.25–0.255.75.75.75.7–0.35.7–0.3–0.3–12.5–12.5Typ.2.566.26.26.26.20.26.20.20.2–11.75–11.75Max.2.756.250.250.256.76.76.76.70.76.70.70.7–11.25–11.25UnitVVVVdBdBdBdBdBdBdBdBdBdBOutputTV or PhonoVCRTV (mono mix)MONOTV, VCR,PhonoVCR(mono mix)MONOVCR(mono mix)RTV, ROUT1,Phono_RLTV, LOUT1,Phono_LNote 1) Mono switch set to mix RTV & LTV after volume control.– 12 –ItemAudio frequency response DistortionInput dynamic rangeRin2, 3, 4/Lin2, 3, 4Input dynamic rangeRin1/Lin1Cross talk(Channel separation)Input impedanceRin1, 2, 3, 4/Lin1, 2, 3, 4S/N ratioElectronic Volume Control Volume attenuation step Audio limiter levelMuteTV I/P Mute orVCR I/P MUTE SymbolF AFTHDVd A1Vd A1Vct AZin1S/N AA EVCAlimitAmuteCondition0.3Vp-p input. Output/Input gainat 30kHz with 10kHz serving as0dB (Fig. 4)f = 1kHz, 0.5Vrms, unweightedresponse; LPF @400Hz, HPF@80kHz (Fig. 4)f = 1kHz, RIN1/LIN1 inputamplifier set to –6dB. Dualsupply mode used. (Fig. 4)f = 1kHz (Fig. 4)f = 10kHz, 1Vrms input on oneinput, measure on any audiooutput (Fig. 4)(Excluding any external seriesresistor) (Fig. 4)f = 1kHz, 1Vrms input (0dBvolume). (20Hz to 20kHz) BPF +A weighting filter (Fig. 4)f = 10Hz, 0.5Vp-p. Set by I2C(Fig. 4)f = 1kHz, 2.5Vrms input.Measure TV pk-pk output withlimiter switched on. (Fig. 4)f = 1kHz, 1Vrms input(Fig. 4)Min.–0.3—2.51.25——801.6——Typ.0.0052.91.45–90100—22.2–85Max.0.30.1—————2.4——UnitdB%VrmsVrmsdBdBdBdBVrmsdB– 13 –– 14 –Digital Characteristics (1) I 2C InterfaceThe I 2C interface is compliant with Philips I 2C Fast Mode specification (data April 1995). The interface is also capable of interfacing to +3.3V or +5V logic levels.ItemHigh level input voltage Low level input voltage Low level output voltage Hysteresis of schmitt trigger input Spike suppression Fall time for SDA line SCL clock frequency Bus free time between a stop and startHold time (repeated start condition)Low period of SCL clock High period of SCL clock Setup time for a repeated start condition Data hold time Data setup timeSetup time for stop conditionSymbol V IH V IL V OL V HYSTt SP t F t SCL t BUF t HD;STA t LOW t HIGH t SU;SDA t HD;DA T t SU;DAT t SU;STOConditionWith SDA, 3mA current supplied With SDA, 6mA current supplied V IH – V IL400pF bus load I 2C bus line requirement I 2C bus line requirement I 2C bus line requirement I 2C bus line requirement I 2C bus line requirement I 2C bus line requirement I 2C bus line requirement I 2C bus line requirement I 2C bus line requirementMin.2.3000———01.30.61.30.60.601000.6Typ.————0.5———————————Max.5.51.50.40.6—50300400—————0.9——Unit V V V V ns ns kHz µs µs µs µs µs µs µs µs(2) Slow BlankingLoad = 10kΩ, supply +12V = +12VItemInput threshold low levelInput threshold high level Output low level (Int TV mode) Output level (Ext 16:9 mode) Output level (Ext 4:3 mode)SymbolV TH1V TH2V OUT1V OUT2V OUT3ConditionLoad = 10kΩLoad = 10kΩLoad = 10kΩMin.———4.810Typ.38.10.35.511Max.——0.86.5—UnitVVVVV(3) Fast BlankingOutput load = 150Ω, supply +5V_VOUT = +5VItem Input threshold Input current Output low level Output high level SymbolV TH3I IN1V OUT4V OUT5ConditionMeasured on fast blanking input1, 2+2V applied to inputLoad = 150ΩLoad = 150ΩMin.——3Typ.0.72—Max.——0.2—UnitVµAVV(4) logic and interrupt outputThese outputs are open collector type and normally connected to +5V through a 10kΩ resistor.Item Output low voltage SymbolDIG VOUTLConditionI OL = 1mAMin.—Typ.—Max.0.4UnitV– 15 –Fig. 1. Video System (DC Tests)DC measured from Pins 1, 2, 3, 4, 6, 7, 8, 9, 10, 11, 51, 52, 53, 54, 55, 56, 57, 60, 61, 62, 63Notes)1. All supplies de-coupled close to the supply pins, 17, 24, 28, 58, 64 with 10nF and 10µF capacitors.2. All video outputs are unloaded during tests.– 16 –Fig. 2. Video System(Gain, Dynamic Range, Bandwidth, Differential Gain, Differential Phase, Crosstalk, Linearity)Signal applied to Pins 51, 52, 53, 54, 55, 56, 57, 6, 7, 8, 9, 10, 11Output signal measured from Pins 60, 61, 62, 63, 64, 1, 2, 3Notes)1. All supplies de-coupled close to the supply pins, 17, 24, 28, 58, 64 with 10nF and 10µF capacitors.2. For video crosstalk tests all video inputs are terminated with 37.5Ω.– 17 –Fig. 3. Audio System (DC Tests)DC measured from Pins 29, 30, 31, 32, 41, 42, 44, 45, 47, 48, 49, 50Notes)1. Single audio supply configuration shown. Operate switches for dual supply configuration.2. All supplies de-coupled close to the supply pins, 17, 24, 28, 58, 64 with 10nF and 10µF capacitors.– 18 –Fig. 4. Audio System(Gain, Bandwidth, Signal to Noise, Electronic Volume, Zero Cross Detection, Dynamic Range, Crosstalk)Signal applied to Pins 41, 42, 44, 45, 47, 48, 49, 50Output signal measured from Pins 29, 30, 31, 32, 33Notes)1. Single audio supply configuration shown. Operate switches for dual supply configuration.2. All supplies de-coupled close to the supply pins, 17, 24, 58, 64 with 10nF and 10µF capacitors.– 19 –I2C Control Data FormatS Slave address A DA T A1A DA T A2A DA T A3A DA T A4A DA T An A P S: Start condition A: Acknowledge P: Stop conditionAddress = 90HI2C Data Structure (write mode)AddressData1 Data2 Data3Data4 Data5 Data6 Data7b71AUDIOLIMITERMONOSWITCHTV AUDMUTEFILTERCONTROLVOUT5_0Vb6VCR MONOSWITCHTV MONOSWITCHTV INPUTMUTEENABLEVOUT7b5TV VOLBYP ASSZCDENABLEVOUT6b41AUDIODISABLEVIN5CLAMPENABLEVOUT5b3LOGICLEVELVIN7CLAMPENABLEVOUT4b2VIN3CLAMPENABLEVOUT3b1VCR INPUTMUTEENABLEVOUT2b00 = WriteTV AUDMUTEPHONOBYPASSOVERLAYENABLEENABLEVOUT1VOLUME CONTROLVCR AUDIO SELECT TV AUDIO SELECTVIDEO INPUT GAIN FNC VCR FNC TV FAST BLANK VCR VIDEO SWITCH RGB GAIN TV VIDEO SWITCHSYNC SEL MIXER CONTROLAddress Datab71NOTUSEDb6NOTUSEDb5ZEROCROSSST A TUSb41P.O.D.b3NOTUSEDb2SYNCDETECTb1b01 = ReadI2C Data Structure (read mode)FNC_VCRNote)ZCD= Zero Cross DetectP.O.D.= Power on Detect– 20 –I2C Video ControlTV Video Control [Data 5 Bits 0, 1, 2]Switch setting0 xxxxx0001 xxxxx0012 xxxxx0103 xxxxx0114 xxxxx1005 xxxxx1016 xxxxx1107 xxxxx111Vout1BlueEncoderBlueVIN1BiasVCR BlueVIN2BiasBiasEncoderblueVIN1BiasBiasVout2GreenEncoderGreenVIN3BiasVCR GreenVIN4BiasBiasEncoderGreenVIN3BiasBiasVout3Red/ChromaEncoderRedVIN5EncoderChromaVIN6VCRChroma/RedVIN7BiasEncoderChromaVIN5EncoderRedVIN5Aux ChromaVIN13BiasVout4CVBS/YEncoderCVBSVIN8EncoderLumaVIN9VCR CVBS/YVIN10TV CVBSVIN11EncoderLumaVIN3AuxCVBSVIN12AuxCVBS/YVIN12BiasCommentDigital encoder RGB orCVBSDigital encoder Y/CVCR Y/C or RGBTVDigital encoder Y/CEncoder RGB and AUX CVBSAux Y/C or CVBSVideo MuteAfter power on all TV outputs are off (high impedance) and muted. TV RGB Gain Control [Data 5 Bits 3, 4]I2C setting "RGB GAIN"0 xxx00xxx1 xxx01xxx2 xxx10xxx3 xxx11xxx Extra gain/dB+1+2+3The power on default is 0dB.– 21 –VCR Video Control [Data 5 Bits 5, 6, 7]Switch setting0 000xxxxx1 001xxxxx2 010xxxxx3 011xxxxx4 100xxxxx5 101xxxxx6 110xxxxx7 111xxxxxVout5ChromaEncoder ChromaVIN5Encoder ChromaVIN6VCR ChromaVIN7BiasEncoder ChromaVIN5BiasAux ChromaVIN13BiasVout6CVBS/YEncoder CVBS/YVIN8Encoder LumaVIN9VCR CVBS/YVIN10TV CVBSVIN11Encoder LumaVIN3Aux CVBSVIN12Aux CVBSVIN12BiasCommentDigital encoder Y/CDigital encoder Y/CVCR Y/CTV CVBSEncoder Y/CAUX CVBSAUX Y/CVideo muteAfter power on VCR outputs are off (high impedance) and muted. "Y/C MIXER CONTROL" [Data 6 Bits 0, 1]I2C setting0 xxxxxx001 xxxxxx012 xxxxxx103 xxxxxx11Vout7 Mixer outputNo mix, Vout7 = Vout4 (CVBS) Mix Vout4 (Y) + Vout3 (C) No mix, Vout7 = Vin8 (CVBS) No mix Vout7 = Vout4 (CVBS)The power on default is no mix.Input Clamp Control "VIN3 Clamp" [Data 6 Bit 2]xxxxx0xx = GREEN input on VIN3. DC restore clamp active. (Power on default) xxxxx1xx = CVBS input on VIN3. Sync tip clamp active.Input Clamp Control "VIN7 Clamp" [Data 6 Bit 3]xxxx0xxx = CHROMA input on VIN7. Chroma bias applied. (Power on default) xxxx1xxx = RED input on VIN7. DC restore clamp applied.Input Clamp Control "VIN5 Clamp" [Data 6 Bit 4]xxx0xxxx = RED input on VIN5. DC restore clamp applied. (Power on default) xxx1xxxx = CHROMA input on VIN5. Chroma bias applied.– 22 –Sync Select Control for RGB DC Restore Circuits "SYNC_SEL" [Data 6 Bits 5, 6]When the TV output is set to RGB + Y/CVBS mode. Then it is necessary to select the input that contains the sync information for the RGB signal. This will normally be the digital encoder CVBS or VCR CVBS input.I2C setting "SYNC_SEL"0 x00xxxxx1 x01xxxxx2 x10xxxxx3 x11xxxxx Input with syncVIN8VIN9VIN10VIN12The power on default is Vin8 ie. Digital encoder input. Video Input Gain [Data 4 Bits 6, 7]Extra gain applied to Vin1, 3, 5, 6, 8, 9I2C setting "VIDEO INPUT GAIN"0 00xxxxxx1 01xxxxxx2 10xxxxxx3 11xxxxxx Extra gain/dB 0 (Bypass)+1+3+6The power on default is bypass.Filter Control [Data 6 Bit 7]The filters on the six digital encoder inputs Vin1, 3, 5, 6, 8, 9 are switched on with this control bit.0xxxxxxx = Filter bypass. Power on default.1xxxxxxx = Filter on.Standby Mode Control [Data 7 Bits 0, 1, 2, 3, 4, 5, 6]The video outputs VOUT1, 2, 3, 4, 5, 6, 7 can be individually turned off using data byte 7.0 = Video output off. (Power on default)1 = Video output on.Note)When switched off, the video outputs are in a high impedance state. With a normal 150Ω load, the outputs will be pulled to 0V.– 23 –– 24 –Bi-directional Line Control on VCR Scart "Vout5_0V" [Data 7 Bit 7]0xxxxxxx = Vout5 active. Connected to input specified in VCR switch table.1xxxxxxx = Vout5 set to 0V .Fig 5. Bi-directional Line to VCRAs Pin 15 on the VCR scart can be bi-directional, either chroma output or red/chroma input, it is necessary for output Vout5 to be individually controlled. When the red or chroma signal comes from the VCR, then output Vout5 is set to 0V giving the required line termination impedance of 75Ω.Pin 15Red in Chroma in Chroma out– 25 –I 2C Audio Signal ControlTV and Phono Audio Control [Data 2 Bits 1, 2]After power on Rin1/Lin1 are selected.VCR Audio Control [Data 2 Bits 3, 4]Switch setting 0xxxxx00x 1xxxxx01x 2xxxxx10x 3xxxxx11xRTV, Phono_RRin1Rin2Rin3Rin4LTV, Phono_LLin1Lin2Lin3Lin4After power on Rin1/Lin1 are Mono Switch [Data 2 Bit 6]Switch setting 0xxx00xxx 1xxx01xxx 2xxx10xxx 3xxx11xxxRout1Rin1RTV signal Rin3Rin4Lout1Lin1LTV signal Lin3Lin4Switch setting 0x0xxxxxx 1x1xxxxxxConnection to R channel outputR (R + L mix)Connection to L channel outputL (R + L mix)CommentNormal Mono mixVCR Mono Switch [Data 1 Bit 6]Switch setting 0x0xxxxxx 1x1xxxxxxConnection to R channel outputR (R + L mix)Connection to L channel outputL (R + L mix)CommentNormal Mono mix"AUDIO DISABLE" [Data 3 Bit 4]xxx0xxxx =Normal outputsxxx1xxxx =All outputs disabled. When the outputs are disabled, they are in a high impedance state.For a single supply configuration, the output voltage will drop to 0V."PHONO BYPASS" [Data 2 Bit 0]xxxxxxx0 = Phono outputs connected after volume control block. (Default)xxxxxxx1 = Phono outputs connected before volume control block."TV VOL BYPASS" [Data 2 Bit 5]xx0xxxxx = TV outputs connected after volume control block. (Default)xx1xxxxx = TV outputs connected before volume control block."MONO SWITCH" [Data 2 Bit 7]0xxxxxxx = Mono output connected to mix of TV R + L channels. (Default) 1xxxxxxx = Mono output connected to mix of RIN1 + LIN1 inputs."VOLUME CONTROL" [Data 1 Bits 1, 2, 3, 4, 5]Setting 0xx00000x 1xx00001x 2xx00010x 3xx00011x 4xx00100x 5xx00101x 6xx00110x 7xx00111x 8xx01000x 9xx01001x 10xx01010x 11xx01011x :31xx11111xVolume gain+6dB+4dB+2dB0dB (power on default)–2dB–4dB–6dB–8dB–10dB–12dB–14dB–16dB:–56dB"OVERLAY ENABLE" [Data 3 Bit 0]xxxxxxx0 =Overlay off (Power on default)xxxxxxx1 =Overlay on: Rin3 and Lin3 are mixed and added to Rin1, Lin1 channels.TV Mute and Zero Cross OperationWhen the zero cross is switched on (ZCD = 1), volume control changes are only implemented when the audio signal passes though the zero cross point. Similarly, when a mute instruction is sent, the TV outputs are only muted when the signal passes the zero cross point. This eliminates any click noise.There are two TV audio mute control bits in the bus map. By having two bits it allows the TV outputs to be muted, the TV channel changed and then un-muted all in one I2C write operation. The normal structure for a click free audio channel change is as follows:Data 1:Mute the TV audio output with the ZCD switched on.Data 2:Change the TV audio source.Data 3:Un-mute the TV audio output again with the ZCD switched on.– 26 –Operation of the Mute circuitTV Audio Mute [Data 1 Bit 0], [Data 3 Bit 7]11ZCD[Data 3 Bit 5]11OperationTV, Phono, Mono outputUn-mute immediatelyUn-mute on next zero crossMute immediatelyMute on next zero crossAfter power on TV Audio Mute = 1 and ZCD are set to 1."TV INPUT MUTE" [Data 3 Bit 6]x0xxxxxx = The input to the TV switch is not muted.x1xxxxxx = The input to the TV switch is muted. (Power on default)"VCR INPUT MUTE" [Data 3 Bit 1]xxxxxx0x = The input to the VCR switch is not muted.xxxxxx1x = The input to the VCR switch is muted. (Power on default)"AUDIO LIMITER" [Data 1 Bit 7]When active, the output of the volume control block is limited to 2.2Vrms maximum. 0xxxxxxx = The volume control outputs are not limited. (Power on default)1xxxxxxx = The volume control outputs are limited to 2.2Vrms.– 27 –Fast Blanking Operation (Pin 16 on SCART), FBLKThe fast blanking signal instructs the TV to select either the external CVBS information or the external RGB information. This is used to superimpose an on screen display (OSD) presentation (normally RGB) upon a CVBS background. Fast blanking information has the same nominal phase as the RGB and CVBS signal, and is defined as follows,Fast blanking output at scart,1. CVBS mode:Scart pin voltage = 0 to 0.4V2. RGB mode:Scart pin voltage = 1 to3.0VThe threshold voltage is approximately 0.75V at the scart input.Fast Blanking I2C ControlIn the CXA7002R has two fast blanking inputs, one associated with the digital encoder input (FBLK_IN1) and another associated with the VCR RGB/CVBS input (FBLK_IN2). These can be selected and switched to the output using an I2C instruction. In addition, the fast blank output pin can be set to a constant 0V or +3.5V by means of the I2C control. Hence there are four possible states. These are set according to the following table."FAST_BLANK" [Data 4 Bits 0, 1]I2C setting "BLANK_LEVEL" 0xxxxxx001xxxxxx012xxxxxx103xxxxxx11Fast blank output pin voltage0V (Power on default)Same status as Fast Blank in 1 (0/+3.5V) Same status as Fast Blank in 2 (0/+3.5V) +3.5VFast Blank Output InterfaceThe Fast Blanking output pin is connected to the scart via a 75Ω resistor. Optional ESD protection circuitry can be added.Fig. 6. Fast Blanking Output Interface– 28 –– 29 –Function Switching Operation (Pin 8 on scart)Both, VCR and TV function lines can be set to outputs and controlled independently. The TV function line has two modes, the first being control via I 2C and secondly the follow mode where the output will follow the same state as the VCR input.When the VCR function lines is set as input, the level can be read back from the status resistor. An interrupt is generated when the level changes."FNC TV_LEVEL" [Data 4 Bits 2, 3]These bits set the voltage at the output TV_FNC function line (Pin 8).Note) After power on the output is internal TV mode ie. 0V at the pin."FNC VCR_LEVEL" [Data 4 Bits 4, 5]These bits set the voltage at the output VCR_FNC function line (Pin 8).I 2C control "FNC_TV"0xxxx00xx 1xxxx01xx 2xxxx10xx 3xxxx11xxVoltage at outputFollows VCR input< 1V > 4.5V , < 7V > 9.5VModeFollows VCR inputInternal TVExternal scart input 16:9 mode External scart input 4:3 modeI 2C control FNC_VCR 0xx00xxxx 1xx01xxxx 2xx10xxxx 3xx11xxxxVoltage at outputNA < 1V > 4.5V, < 7V > 9.5VModeInput InternalExternal scart input 16:9 mode External scart input 4:3 modeNote) The power on default is "Input" mode.Fig. 7. TV Function Switch Output+12V_DIGLogic and Interrupt Output PinsThese two pins are open collector type and require an external pull-up resistor.Interrupt OutputThe interrupt pin will become a current sink for approximately 1µs when the VCR input function line changes from:a) 0 to 6V, 6 to 0V b) 0 to 12V, 12 to 0V c) 6 to 12V, 12 to 6VORWhen the sync detector detects that a valid video signal has been added or removed.This pin will normally be connected to +5V through a 10kΩ resistor.Multiple interrupt signal may be generated for signals on the threshold of having a valid sync.Logic OutputThe logic output level can be changed using the logic output bit in the I2C register, "LOGIC_LEVEL"."LOGIC LEVEL" [Data 3 Bit 3]xxxxx0xx = Current sink mode resulting in < 0.4V saturation voltage on logic pin. (default)xxxxx1xx = Open collector/high output impedance on logic pin.Imax during current sink = 1mAFig. 8. INT and Logic Line Interface– 30 –。