PCB英语培训资料

PCB英语培训资料
一. 流程英语及相关词汇
❖PCB(Printed Circuit Board) 印制线路板
❖Marketing Department市场部
❖PE – Product Engineering Department 产品工程部
❖MI - Manufacturing Instruction生产制作指示/生产流程单❖CAD/CAM - Computer Aided Design计算机辅助设计/制造❖TQ—Engineering Technical Query 工程问题
1. Inner board cutting: 内层开料-1
❖Sheet Size大料尺寸
❖Panel Size拼板尺寸
❖Material Type材料类型
❖Supplier供应商
❖Base material基材
❖Thickness厚度
❖Board Thickness板厚
❖Laminate Thickness材料厚度
❖inner core 芯板/内层板料
❖Comparative Tracking Index 比较漏电痕迹指数CTI
❖Glass Transition Temperature玻璃态转化温度Tg
1. Inner board cutting: 内层开料-2
❖Dielectric Thickness介电层厚度
❖Dielectric constant介电常数Er
❖Base Copper底铜/基铜
❖Delamination分层
❖Flammability可燃性
❖Baking烘板
❖Single/double单层/双面
❖Double sided board双面板
❖Multilayer board 多层板
❖Bare board裸板(board without copper)
2. Inner Image Transfer:内层图像转移/内光成像
3. Inner Etching 内层蚀板
4. Inner AOI—Automatic Optical Inspection自动光学检查
5. Pressing 层压
❖Lamination 压板
❖Lay-up structure压板结构
❖PP - Prepreg半固化片
❖Copper clad/ Copper foil铜箔Cu foil
❖Resin树脂
❖After Pressed Thickness压板后之厚度
6. Drilling 钻孔-1
❖Hole孔
❖Hole Type孔类型
❖Hole Tolerance 孔径公差
❖Hole chart 孔表/分孔图
❖Plated Though Hole 金属化孔PTH
❖Non-Plated Though Hole 非金属化孔NPTH
❖Drill tape钻带
❖Blind via hole盲孔
❖Buried hole埋孔
❖Hole Diameter孔径
6. Drilling 钻孔-2
❖Hole location孔位
❖Hole Position Tolerance孔位误差
❖Hole Position Deviation孔位置偏差
❖2nd Drilling 重钻
❖Mounting hole安装孔
❖Pin hole销定孔
❖Target Hole目标孔
❖Slot 槽,坑
❖No. of holes孔数
❖Laser via hole激光穿孔
❖Roughness粗糙度
7. Plate Through Hole (PTH)沉铜/孔化
❖Hole wall copper thick 孔壁铜厚
❖Defect缺陷
❖Cracking裂缝
8. Outer Dry Film 外层干菲林/外光成像-1
❖Dry Film干菲林/干膜D/F
❖External layer外层
❖Internal layer内层
❖Component Side 零件面C/S
❖Solder Side焊接面S/S
❖Top side/ layer 顶层
❖Bottom side/layer底层
❖Primary side首面
❖Secondary side第二面
❖(提示: 层的写法尽量按客户的习惯书写)
8. Outer Dry Film 外光成像-2
❖Power plane电源层
❖Ground 接地层
❖Layer层
❖Dry-film tenting D/F封孔
❖Surface mounting Device表面粘贴装置SMD
❖Line Width线宽—LW
❖Line Space线隙—LS: Line-Line/Line-Pad/Pad-Pad
❖Conductor导体
❖Circuit线路
❖Pattern线路
❖Artwork菲林
❖Master drawing菲林图形
❖Artwork Modification菲林修改
❖Outer Dry Film外光成像-3
❖Annular ring锡圈
❖Min.Annular Ring最小环宽/焊盘宽
❖Hole breakout 破环/崩孔
❖Pad焊盘
❖Round pad圆盘
❖Teardrop泪珠
❖Clearance/space间距/间隙
❖Minimum 最小---Min.
❖Maximum 最大---Max.
❖Min.Spacing between Line to Line线与线间的最小距离
❖Test coupon图样
❖Registration Deviation 对位偏差
9. Pattern Plating 线路电镀/图形电镀
❖Plating电镀
❖Chemical corrosion化学腐蚀
❖Copper plating电镀铜
❖Copper thickness on hole wall 孔内铜厚
❖Max.Board Thickness After Plating电镀后总板厚度之上限10. Outer Etching 外蚀板
❖Undercut侧蚀
11. Solder Resist 湿绿油/阻焊-1
❖S/M(Solder Mask) 阻焊
❖Solder resist film阻焊菲林
❖SM print SM印油菲林
❖SM imaging SM曝光菲林
❖Solder Mask opening 阻焊开窗/曝光窗
❖Solder Mask material/Type 绿油材料/类型
❖Color颜色
❖Shiny有光泽的,发光的(光亮油,)
❖Matte哑光油的
❖Matte Green 哑光绿油
❖Liquid Photo-Imaginable (LPI)液态光固化剂
11. Solder Mask 湿绿油/阻焊-2
❖W/F(Wet Film) 湿膜/湿绿油
❖Ball Grid Array (BGA) 球栅阵列
❖S/M Bridge 绿油桥
❖Cover 盖(油入孔)
❖Tenting封孔/盖油
❖Via Plugging 封孔
❖Plug Hole塞孔
❖Filled with solder resist 塞孔
❖Solder mask on bare copper (SMOBC) 裸铜覆盖阻焊膜
❖Encroach 侵占, 蚕食
❖Encroach into holes 入孔
12. Carbon Ink 印碳油
❖Carbon ink碳油
❖Carbon Resistance 碳油电阻
13. Component Mark 印字符
❖Silk Screen丝印
❖Component Marking 元件字符C/M
❖Legend字符
❖Corner mark板角记号
❖Logo标记
❖Date Code周期代号
❖Cust. P/N: customer part number客户型号
❖Revision/Version:版本号
14. Gold Finger Plating 金手指
❖Bevelling斜边
❖Gold Finger(G/F) 金手指
❖Chamfer倒角
❖Key slot槽孔
❖Au/Ni 金/镍
15. Hot Air Leveling 喷锡
❖HAL(Hot Air Leveling) 热风整平
❖HASL Hot Air Solder Leveling
❖Impedance阻抗IMP
❖Surface Treatment表面处理
16. Immersion Silver 沉银
17. OSP抗氧化处理
18. Immersion Tin 沉锡
19. Immersion Gold/Imm Au 沉金
20. Solder/Tin/Lead Stripping 退锡
❖ENIG----Electroless Nickel/Immersion Gold 沉金(工艺) ❖Ag银
21. V-Cutting V-坑
❖V-Cut V - 坑
❖Remain Thickness 保留厚度
❖Scoring==V-CUT刻槽
❖Scratch划痕
❖V-groove V- 坑
22. Routing (铣/锣板)/ Punching 啤板
❖Profiling外围成型
❖Engineering drawing工程图纸
❖Fiducial mark基准点
❖Dimension尺寸
❖Length 长度
❖Width 宽度
❖Breakaway tab/area板边位
❖Datum hole基准参考孔
❖Punching die /Punch 啤模
❖Offset偏移量
❖Outline外形
❖Shape 外形
23. Electrical Testing 电测试
❖E-test fixture E-T 夹具
❖Electrical Test Fixture电测试夹具
❖V oltage电压
❖Open/short开路/短路
❖Probe point测试点
24. Outer Final QC 最后检查
❖Warpage翘曲度
❖Bow and twist 板弯曲
25. Peelable Mask 印蓝胶
❖Peelable Mask/Blue Mask蓝胶
❖Peelable可剥性
26. Packing&Shipment 包装出货
❖Vacunm Pack真空包装
❖No.of Pcs Per Bag每包数量
❖Packing包装
27. Other其它相关-1
❖Gerber Data 客户资料打包文件
❖Checklist检查表
❖production film 生产菲林
❖Paste film粘贴/贴键菲林/钢网
❖Solder coating上锡
❖Reliability可靠性
❖Assembly安装性
❖Correspondance符合性
❖Pin gauge 针规
❖Backplane背板
❖Customer客户
27. Other其它相关-2
❖Customer P/N客户产品编号
❖Delivery交货
❖Description说明
❖Golden board金板
❖Missing 缺少
❖Mother board 主机板
❖Ionic cleanliness离子清洁度/离子污染度
❖Location位置
❖Max. X-out坏板上限/最大允许报废板数
❖No.of Array/Panel每个拼板套板数
❖Negative反面的
❖Positive正的
27. Other其它相关-3
❖Production生产板
❖Sample样板
❖Remark备注
❖Special requirement特殊要求
❖Specification详细说明，制作规范
❖Wiring线路
❖Square方形的
❖View From…观察方向由…
❖Lead free process 无铅处理
❖Dummy Pad 为圆形或方形的PAD(加在板边位/标位或空白处起平衡电镀作用)
❖Dummy copper实心的铜皮
❖Thermal Pad 散热盘
❖Fibre纤维面
二. 问题之基本模式
❖Title: Engineering technical question of 021D2002R2 (JOVE P/N: 20LN21119)==On Hold/Go on with suggestion
❖Hello Ye jian,
❖Nice to contact with you! I'm Jack, an Engineer from Engineering department in Jove.
❖For the captioned project, we found some questions need you to confirm with customer.
❖Question 1: As there are PTH (plated-hole) between the edge of unit, after doing V-cut, the holes will be scratched, and after customer divide them into two parts along the v-cut line, the copper showing in A part on the hole wall and that on the board may be picked off, which will lead to solder failure. Please refer to fig01
❖Suggestion: a)To avoid this potential fault, we will modify the cad data: to add two PTH holes as position B to insure the connection between top and bottom sides. And to add two NPTH holes as position C (use 2nd drill) at the end-point of V-cut line which closed to that big PTH hole to cut the copper off so as to avoid copper being picked off. Please kindly confirm this modification can be acceptable.
❖b) Or we will do sample board to let our customer to approve. Please have one, a) or b)? ❖Question 2: Same case as question 1 except that the PTH holes is only on one edge of unit. Please refer to fig02
❖Suggestion: a) We will do them NPTH holes and will shave the copper around holes to get about 8 mil clearance.
❖ b) We only add two NPTH holes (use 2nd drill) at the end-point of V-cut line which
closed to that big PTH hole to avoid that potential fault. Please kindly confirm these modification can be acceptable.
❖
❖Have a nice day!
❖B.Regards
❖Ding, you de
**********************
❖Engineering technical question of 021D2002R2 (JOVE P/N: 20LN21119)==On Hold/Go on with suggestion
❖Dear John(名字)
❖Hello Mr Smith(姓)
❖Hi Miss Green
❖Nice day John
❖Good Morning Jack
❖Nice to contact with you! / I’m glad to cooperate with you!
❖I'm Jack, an Engineer from Engineering department in Jove.
❖1) After checking the captioned new project/updated gerber data, we have some questions as below. Would you please help to settle them. 在检查完此新板后，我们有如下问题。

请帮忙(尽快)解决。

❖2) For the captioned project, we found some questions need you to confirm with customer.
❖对标题中的新板, 我们发现如下问题, 需要同客户确认.
❖3) After checking the new project, we found some questions as below. Please kindly help to settle them.
❖查完此新板后, 我们发现如下问题, 请帮忙解决.
❖As this order is urgent, would you please settle below questions a.s.a.p.
❖由于订单紧, 请尽快解决下面的工程问题.
❖Have a nice day!
❖Have a nice weekend!
❖Nice Weekend!
Best Regards!
B.regards!
❖制作人名字:
❖Ding, you de
**********************。