LEAD-FREE SEMICONDUCTOR PACKAGE
- 1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。
专利名称：LEAD-FREE SEMICONDUCTOR PACKAGE 发明人：MASTER, Raj, N.,ANNAD, Srinivasan,
Ashok,PARTHASARATHY, Srinivasan,MUI,
Yew, Cheong
申请号：US2006014625
申请日：20060419
公开号：WO07/001598P1
公开日：
20070104
专利内容由知识产权出版社提供
摘要：A package substrate (4) includes die solder pads (3) and pin solder fillets (5). The pin solder fillets (5) might comprise between approximately 90 wt % to approximately 99 wt % tin and approximately 10 wt % to 1 wt % antimony. The die solder pads (3) might comprise between approximately 4 wt % to approximately 8 wt % bismuth, approximately 2 wt % to approximately 4 wt % silver, approximately 0 wt % to approximately 0.7 wt % copper, and approximately 87 wt % to approximately 92 wt % tin. The die solder pads (3) might comprise between approximately 7 wt % to approximately 20 wt % indium, between approximately 2 wt % to approximately 4.5 wt % silver, between approximately 0 wt % to approximately 0.7 wt % copper, between approximately 0 wt % to approximately 0.5 wt % antimony, and between approximately 74.3 wt % to approximately 90 wt % tin.
申请人：MASTER, Raj, N.,ANNAD, Srinivasan, Ashok,PARTHASARATHY, Srinivasan,MUI, Yew, Cheong
地址：One AMD Place Mail Stop 68 P.O. Box 3453 Sunnyvale, CA 94088-3453 US,5772 Trowbridge Way San Jose, CA 95138 US,Block 45, #11-34 Marine Crescent 440045
SG,1534 Belleville Way Sunnyvale, CA 94087 US,Block 30, #06-384 Jalan Bahagia 320030 SG
国籍：US,US,SG,US,SG
代理机构：DRAKE, Paul, S.,BROOKES BATCHELLOR LLP
更多信息请下载全文后查看。