东京精密 圆度仪 轮廓仪资料
圆度仪说明书
1.参数和定义参考参考圆是用某种规则匹配测量数据得到的相关圆，据此参考圆计算得到圆度的有关参数。
最小二乘参考圆(LSCI)计算得到的最小二乘参考圆与其内外数据差值的平方和最小。
该圆普遍被用作参考圆。
P=最高峰值 V=最低谷值最小区域参考圆(MZCI)计算得到的最小区域参考圆是两个完全包容测量数据的同心圆，这两圆之间的径向间距最小。
P=最高峰值 V=最低谷值最小外接参考圆(MCCI)计算得到的最小外接参考圆是完全将测量数据包容在内的最小圆。
V=圆度最大内切参考圆(MICI)计算得到的最大内切参考圆是完全被测量数据包容在内的最大圆。
P=圆度倾斜纠正当测量的圆柱轴线建立后，当它与主轴轴线不平行时，它与主轴轴线在空间某个方向的倾斜将使测量数据发生椭圆畸变。
本选项允许在相对于圆柱轴线进行进一步计算之前，从单个圆度测量数据中去除该椭圆度。
偏心度E偏心值是所选基准轴(点)到所分析参考圆中心的距离。
偏心角为主轴零度位置与参考圆中心和基准轴连线之间的夹角。
A=基准点 B=数据中心 E=偏心值θ=偏心角(上图为315˚)角度偏心角为主轴零度位置与参考圆中心和基准轴连线之间的夹角。
A=最小二乘中心 B=最小二乘参考圆 C=角度θE=偏心 D=回转中心跳动两个同心圆的径向间隔，这两个圆与基准轴(或点)同心，并完全包容测量数据，即指示器读数的总变动量。
(ISO 1101; DIN 7184; 第三部分)。
A=跳动 B=距基准点最近的数据点 C=基准点D=距基准点最远的数据点半径R此值取决于径向横臂的标定(为标尺的目视读数)，仅供参考。
谐波分析数据用傅立叶级数表示。
删除点为从任何间断数据的两边删除的点的个数。
它们是从所选数据总数中删除的。
平面度平面度可用最小二乘或最小区域方法来定义。
最小二乘基准拟合一平面，测量数据至该平面差值的平方和最小。
最小区域基准拟合两个平行平面，使其完全包容测量数据，且间隔最小。
A=轴线 F=平面度 LS=最小二乘基准垂直度“参考平面垂直度”值是两个平行平面最小轴向间隔，这两个平面垂直于参考轴线，并且完全包容由被测数据拟合的最小二乘平面。
轮廓仪作业指导书
轮廓仪作业指导书引言概述：轮廓仪是一种用于测量物体外形尺寸和形状的仪器，广泛应用于工业生产和质量控制领域。
正确使用轮廓仪可以提高工作效率和产品质量，本文将详细介绍轮廓仪的操作指导。
一、准备工作1.1 确保轮廓仪处于稳定平整的工作台上，避免仪器晃动影响测量准确性。
1.2 检查轮廓仪的电源线是否连接稳固，确保电源供应正常。
1.3 清洁轮廓仪的测量平台和传感器头，避免灰尘或杂物影响测量结果。
二、测量操作2.1 将待测物体放置在轮廓仪的测量平台上，确保物体与平台接触紧密。
2.2 启动轮廓仪，根据仪器操作界面指引选择测量模式和参数。
2.3 使用轮廓仪的探测器头沿着物体轮廓移动，确保探测器头与物体表面接触良好，保持稳定速度进行测量。
三、数据处理3.1 测量完成后，将测量数据导出到计算机或打印机进行保存或输出。
3.2 对测量数据进行分析和处理，比对标准尺寸，判断物体尺寸和形状是否符合要求。
3.3 如有异常数据或不符合要求的情况，及时调整测量参数或重新测量，确保数据准确性。
四、维护保养4.1 定期清洁轮廓仪的传感器头和测量平台，避免灰尘或杂物影响测量精度。
4.2 检查轮廓仪的电源线和连接线是否有损坏，及时更换或修复。
4.3 定期校准轮廓仪，确保测量精度和稳定性。
五、安全注意事项5.1 使用轮廓仪时，避免将手指或其他物体伸入测量范围，以免造成伤害。
5.2 在清洁和维护轮廓仪时，务必先断开电源并等待仪器完全停止工作。
5.3 如发现轮廓仪有异常情况或故障，应及时停止使用并联系专业维修人员进行处理。
结语：通过正确的操作和维护保养，轮廓仪可以更好地发挥作用，提高测量精度和效率。
遵循本文所述的操作指导和注意事项，将能够更好地使用轮廓仪进行测量工作。
光学轮廓仪的性能特点介绍
光学轮廓仪的性能特点介绍首先，光学轮廓仪具有较高的测量精度。
光学轮廓仪采用激光光源和精密光学元件，能够提供高分辨率的图像，使得测量结果更加准确。
通过将测量对象与光学系统成像，可以实现亚微米级别的测量精度，满足大多数工业领域对于尺寸测量的高要求。
其次，光学轮廓仪具有快速的测量速度。
相比传统的机械测量方法，光学轮廓仪可以快速地完成一次测量。
其快速测量的优势源于光学系统的高速成像和数据采集系统的高效处理能力。
对于大批量生产的工业产品，光学轮廓仪的高速测量特性能够大幅度提高生产效率。
光学轮廓仪还具有广泛的适用范围。
不同于接触传感器只能测量直线形状的尺寸，光学轮廓仪能够测量曲线、曲面以及复杂形状的物体。
轮廓测量的对象可以包括各种类型的零件、工件和产品，如塑料件、金属件、模具等。
同时，光学轮廓仪也适用于不同行业的测量需求，如机械制造、汽车制造、航空航天、电子等。
光学轮廓仪的操作相对简单。
用户只需根据仪器的操作说明将待测物体放置在测量台上，点击相应的测量按钮即可完成一次测量。
仪器还可以实现自动对焦、自动测量和自动数据处理等功能，减少人工操作的复杂性，提高测量的准确性和稳定性。
此外，光学轮廓仪还提供了友好的用户界面和菜单，使得操作人员可以快速掌握仪器的使用方法。
最后，光学轮廓仪具有良好的数据处理能力。
测量结果可以以图像、轮廓和三维点云等形式呈现，并且可以进行数据分析和比对。
仪器可以对测量数据进行统计分析，生成测量报告和数据图表，帮助用户更好地评估产品质量和生产过程的稳定性。
此外，光学轮廓仪还支持与其他软件系统的数据接口，以满足更复杂的测量和数据处理需求。
综上所述，光学轮廓仪具有高精度、快速、适用广泛、易于操作和数据处理能力强等性能特点。
其在各个领域的应用前景广阔，为工业制造和质量控制领域带来了革命性的测量手段和技术。
圆度仪的主要技术规格与精度
圆度仪的主要技术规格与精度圆度仪是一种用于测量物体圆度的精密仪器，它可以帮助人们准确地评估物体的圆度，并提供精确的测量结果。
圆度仪的主要技术规格和精度对于保证测量结果的准确性和可靠性至关重要。
圆度仪的主要技术规格包括测量范围、分辨率、测量方式等。
测量范围是指圆度仪能够测量的物体直径范围，一般来说，圆度仪的测量范围较大，可以适应不同尺寸的物体测量需求。
分辨率是指圆度仪能够显示的最小刻度，它决定了测量结果的精确程度。
测量方式有多种，常见的有光学测量和机械测量两种，光学测量通常具有更高的精度和稳定性。
圆度仪的精度是评估其性能和可靠性的重要指标。
精度是指测量结果与真实值之间的偏差，通常以百分比或微米为单位表示。
圆度仪的精度受到多个因素的影响，包括仪器本身的稳定性、测量环境的稳定性、操作人员的技术水平等。
一般来说，圆度仪的精度应达到或接近被测物体要求的精度，以确保测量结果的准确性。
在实际应用中，圆度仪常常被用于制造业领域，特别是对于需要高精度加工的零部件和产品。
通过圆度仪的精确测量，可以及时发现和纠正加工过程中的偏差，提高产品的质量和可靠性。
此外，圆度仪还常用于科研实验室和检测机构，用于对物体的圆度进行科学研究和精密检测。
在使用圆度仪进行测量时，需要注意以下几点以提高测量精度。
首先，保持测量环境的稳定性，避免温度、湿度等因素对测量结果的影响。
其次，正确选择和安装被测物体，确保其与圆度仪的接触良好。
同时，操作人员应具备一定的技术水平，熟悉仪器的操作方法和注意事项，以确保测量过程的准确性和可靠性。
圆度仪的主要技术规格和精度是保证测量结果准确性和可靠性的重要因素。
正确选择和使用圆度仪，可以提高产品的质量和可靠性，满足制造业和科研领域对于高精度测量的需求。
在今后的发展中，圆度仪将继续不断提高其技术规格和精度，以满足人们对于更高精度测量的需求。
东京精密
设备采购指南·系列
目 录
Contents
01
表面粗糙度测量仪
HANDYSURF E-35B, E-40A, E-45A便携式表面粗糙度测量机 SURFCOM 480A/130A 表面粗糙度测量机 SURFCOM 1400D 表面粗糙度测量机 SURFCOM 1400-3DF 精密表面粗糙度测量机 SURFCOM 1400D-LCD 玻璃波纹度测量机 SURFCOM 1400-PDP 形状测量机
上海热线：021-54248686
表面粗糙度测量仪
表面粗糙度测量机 SURFCOM 480A/130A
可操作性强：
·TFT大屏幕液晶触摸屏，简单实用 ·AI功能，操作简单，减少操作失误 ·世界各国通用 ·满足各种需求的分析功能 ·自动停止功能(针对SURFCOM 480A) ·测量向导功能 ·个性化图标设计，方便操作 ·再计算功能降低了测针磨损，
传真:021-64418200
传真:00852-81673379
地址:上海市徐汇区宛平南路521号 地址:香港上环文咸东街65-67号
恒昌花园B座903室
喜利商业大厦15楼
上海热线：021-54248686
设备采购指南·系列
TAYA S A F
高斯、2RC λс:0.08、0.25、0.8、2.5mm、λs:2.5、8μm
评价 固定模式 长度 任意模式
截止波长值×5
0.4～12.5mm(0.1mm单位)
0.4～4.0mm (0.1mm单位)
测量速度
0.6mm/s(返回1mm/s)
0.3mm/s (返回0.5mm/s)
轮廓仪使用教程PPT课件
2.1 校 验 步 骤-------校准力
点击
1.点击确认
2.目视确认并点击 “√”， 测头进入空摆校验步骤
3.点击OK
4.将砝码放置在测臂上并点击OK
5.将砝码拿离测臂并点击OK
校准力完 毕
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二、轮廓仪的校验
2. 2校 验 步 骤-------校准测头弯曲
1.点击OK
校准弯曲 完成
大落以免损伤测头； 6.测量完成后调整HZ使测头处在安全位置。
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以上！谢谢！
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放映结束 感谢各位的批评指导！
谢 谢！
让我们共同进步
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（1）自动接触
（2）Y向调节
3. 退出测量站，点击测量按钮进入测量。
4. 测量完成后进入元素构建、评价界面。
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（3）找最高点
13
三、轮廓仪的测量使用
2. 自动测量（测量助手）
2. 1进入测量助手并设置相关参数 2. 2点击启动进入自动测量步骤
设置测头每次测量后移动的坐标（安 全轮位廓20置最21/）高3/，点9 测基头础每上次抬测升量并完回成撤后会在
175-M8mm
350X33mm
（2）扫描起始点在测针测量范围内； （3）测针约在Y向最高点上； （4）测针Z向位置合适，保证轮廓最高/最低点在Z向量程内。
Z向量程：175-M8mm：±13.02mm 350X33mm：±25.84mm
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三、轮廓仪的测量使用
1. 手动测量
2. 进入测量站，点击自动接触使测头接触零件表面后， 调节夹具上Y向调节旋钮找到工件Y向最高点
轮廓仪操作指导书
文件名称：表面粗糙度轮廓形状复合测量机操作指导书 版次 A 总页数 2 文件编号：MX/J7601-08-30 第 1次修订 页次 1一、操作说明：1、闭合控制柜开关，同时启动电脑，检测轮廓形状时，将驱动器的电源打开。
2、根据检测要求，选择安装对应的检测器，并将检测器存放台的切换开关（SW ）切换到相应的位置。
3、摘下测针保护套，测量机自检完毕后，打开ACCT 测量软件，使测量机进行检测准备阶段。
4、将显示画面切换到测量界面。
5、清洁工件，然后选择对应的工装装夹工件。
6、测量完成，进入分析界面分析检测结果并填写检测报告单，手动返回测针，从工装上取下工件。
二、标准块校正： 1、粗糙度检测校正1.1在粗糙度测量画面中，单击菜单的“校正”并选择其中的“校正”，按校正步骤进行校正。
1.2选择探针为“通常使用的探针”→ 选择校正方法为“利用标准片校正”→ 校正条件的标准值设定为标准片上的值3.21um ，校正倍率选±128um → 将标准片放置在水平调整台上 → 执行校正测量条件的设定：单击“编辑”，选择“基本条件”，测量速度选0.300mm/s ，移动返回速度6.000mm/s ，测量长度5λ，单击滤波器，勾选“使λs 有效”，“比”设300，波长设0.8mm ，单击去除形状，选择最小二乘直线，确定并执行测量。
1.3移动测针至图2位置，点击测量，将测量值与标准块标识的值进行对比，差值在±5%之内即为测针可用。
如果大于±5%，需分析测量出的曲线图（纵横放大倍率分别为2万和2千倍），观察波峰波、谷是否清楚，波峰是否尖锐，否则表示测针磨损或损坏。
图1 校正驱动器标准块的摆放及与测针位置 图2 校正测针标准块的摆放及与测针的位置2、轮廓形状检测校正2.1在轮廓形状测量画面中，单击菜单的“校正”并选择其中的“校正”，按校正步骤进行校正。
2.2选择探针中单击变更，探针设定为“通常使用的探针” 单击属性对校正参数进行设置：LH=348.5，LV=0,K=1,R1=0.025，单击“R1对应值”→ 选择校正方法为“球段差成批校正” 标准球校正装置为“E-MC-S34A/65A ”→ 设定校正条件为“标准球半径为6.35mm ”段差量=16mm,退避量=20mm → 设置校正装置：将16mm 的块规与标准球校正装置组合连接，并水平放置（如图3所示），将探针停在标准球的顶点上方（如图4所示），单击“工具”菜单中的“峰＆谷检测”，选择X 轴，轨迹范围=4mm,测量速度=0.3,检测方法= 圆计算移动速度=3,执行检测，系统自动找准X 方向最高点。
日本东京精密
东京精密株式会社公司简介东京精密株式会社是日本著名半导体制造设备之一,公司总部设在日本东京都三鹰市, 在美国,欧洲,新加坡,中国等地设有分公司,研发基地或生产厂等.We develop our businesses in two key areas: semiconductor manufacturing equipment and precision measuring systems. Our philosophy is to generate long-term growth through the creation of "WIN-WIN," or mutually beneficial, relationships, with all our stakeholders - customers, business partners, shareholders and employees.（公司网站原文）东京精密主要从事半导体加工设备及精密测量仪器制造及开发. 半导体加工设备有硅片加工用地倒角机、内圆切片机, 半导体加工前道工序用的光刻机（LEEPL）、CMP、晶片表面综合检查设备及测试封装用的探针台、划片机、硅片背面抛光机等.过去，东京精密简称“TSK”，在国内半导体行业享有盛誉。
现在东京精密采用了新的商标“ACCRETECH”，她是由英文成长ACCRETE和技术TECHNOLOGY的合成词，是融合公司”以WIN-WIN精神工作，创世界一流产品“经营理念的新标志。
参展产品：硅片材料的内圆切片机、硅片倒角机，光刻机，CMP，硅片表面检查系统，探针台背面减薄抛光机，划片机。
网址：http://www.accretech.jp/Semiconductor Manufacturing Equipment:Product listWafer Manufacturing SystemVariety of products line for wafer manufacturers including Wafer Slicing Machine and Wafer Edge Grinding Machine.Sliced Wafer Carbon Demounting and Cleaning Machine : C-RW-200/300Feature 1Automatic demounting of wafers from the slicing base, cleaning and storing into the cassette.Wafer Edge Grinding: W-GM-5200•Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness.•The non-contact measuring method achieves the stable alignment.•Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of thepost-processed wafer.•The modular concept to make the optimum process line possible.•Low damage grinding method is available.Feature 1Machine specification ready for 300 mm and 200 mm wafer.Feature 2Visual system (optional) for measuring the chamfer width of periphery and notch.Wafer Edge Grinding: W-GM-4200•Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness.•The non-contact measuring method achieves the stable alignment.•Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of thepost-processed wafer.•The modular concept to make the optimum process line possible.•Low damage grinding method is available.Feature 1Machine specification ready for 75 - 150 mm wafer or for 150 - 200 mm wafer. Feature 2Capable of various material processes, such as chemical compound semiconductor.Wafer Slicing Machine: S-LM-116GPrecise slicing machine for fragile materials such as glass, ceramics, ferrite. Feature 116"-size blade for easy handling, lifting and adjustment.Feature 2Open-structure loading unit for easy mounting of the workpiece.Feature 3Easy setting of slicing speed and wafer thickness with digital switch.Feature 4Strong frame, highly rigid table provides long-term stability in performance. Feature 5Easy coolant adjustment and dressing operation.Wafer Slicing Machine: A-WS-100SScribes wafer substrate with high precisionFeature 1Easy alignmentWith fine adjustment in horizontal and rotative directionsFeature 2Easy scribe settingWith the touch panel to set the index amount, number of times of scribing, etc. CMPCMPs remove unevenness on wafer surfaces that occur during the production process. Applications are growing due to the increase of layers in semiconductor devices and the growing variety of wiring materials. ChaMP: For 300mm WafersCombining the technological expertise built up by Accretech in precision measuring equipment and semiconductor manufacturing equipment, we now offer "the ChaMP Series", the CMP systems compatible with 300 mm wafers, with process performance required by design rules for 90 nm and 32 nm devices, and able to keep up with the most advanced volume-production fabs.Feature 1Air-float Head "Sylphide"•Reference polishing is made possible via an air cushion that provides uniform pressure distribution.•Wafer pressure is applied by an airbag independent of ring pressure, providing excellent low-pressure controllability and stability.•Zone control is available.Feature 2Edge Exclusion of 1 mm!Feature 3Wafer Pressure Controllability & RepeatabilityFeature 4Simple Maintenance for Polishing Heads - Ring Change Demounting (approximately 5 seconds)Slide the snap ring cover up with both handsSpread the snap ring with your thumb (the retaining ring drops off)Completely remove the retaining ringMounting (approximately 10 seconds)1. Grip the snap ring with both hands and push the retainer into thecarrier. Rotate it slightly to align the faces where the positioningframe slips into place.2. Attach the snap ring round the whole circumference and slide thecover down.ChaMP: For 150 or 200mm WafersFor 150 or 200mm WafersChaMP: Compact CMP SystemSmall footprintWafer Probing MachinesWafer probing machines perform electrical tests of each chip on a wafer, ensuring the quality of semiconductor devices.Wafer Probing Machines: UF3000EXNext-generation high-spec probing machine the world No.1 supplier presents Phenomenal levels of throughput have been made possible with the synergistic effects of high-speed wafer handling enabled by a new algorithm, and the high-speed and low-noise XY Stage enabled by a newly developed purpose-built drive unit for probes. The Z axis ensures world-class load capacity and high precision, and offers excellent contact via an optimal structural design that employs topology which reliably eliminates changes in flatness due to positioning.With advanced OTS latest positioning system technology and by colorizing wafer alignment imaging and equipping a light super magnification function, the UF3000EX has improved dramatically in terms of precision and operability. Wafer Probing Machines: UF3000EX-eAssimilating the up-to-date technologies such as originative OTS, QPU and TTG, this super high-spec system provides the testing system which meets your needs for the miniaturization of the next-generation devices and various testing environment.Feature 1OTS - the newest positioning technology (Optical Target Scope)OTS enables to measure the relative position of the cameras with absolute accuracy, which improved dramatically.Based on the ACCRETECH metrology technology, OTS enables theself-correlation of the alignment optical system.Feature 2QPU - super high-rigid chucking (Quad-Pod Unit)To effectively attain the accuracy in positioning, the high rigidity of every part is greatly important.The UF3000 uses the new technology of 4 axes driving mechanism (QPU) for Z-axis, enabling the high-rigid, stable probe contact.Feature 3Load-portTesting environment satisfying the users' needs is available by the common platform of 8-inch and 12-inch cassettes and the front allocation of the inspection tray. The machine is also ready for AMHS (Automated Material Handling System).Feature 4TTG (Touch To Go)Pursuing the easy operation, the UF3000 adopts the function to move to the position you touch on the map or image shown on the touch panel. Setting up is easy, and screen configuration is possible by the user definition.Wafer Probing Machine: UF2000Tokyo Seimitsu, now known as Accretech, has continued to lead the semiconductor industry as the world's number one manufacturer of wafer probing machines. The newly developed UF2000 high-precision 200mm wafer prober is designed for devices with decreasing pad pitches typified by LCD drivers and other such devices, and features enhanced functionality in all areas, while offering the same functions and operating ease as the previous model.Feature 1Achieves overall precision of ±1.5µm.Feature 2Adopts new processor, newly designed loader and image processing system with enhanced performance, dramatically boosting throughput.Wafer Probing Machine: UF200REvolving and Proliferating Wafer Probing Machine, UF SeriesBased on a flexible platform, the high accuracy and high rigidity, UF series is further evolved. Wafers are varying with the progress of line width shrinkage and assembly technology. This machine can be used for processing very thin wafers and can be used as a handler for the wafer level burn-in system.Feature 18-inch multipurpose machine.Wafer Probing Machine: UF190REvolving and Proliferating Wafer Probing Machine, UF SeriesBased on a flexible platform, the high accuracy and high rigidity, UF series is further evolved. Wafers are varying with the progress of line width shrinkage and assembly technology. This machine can be used for processing very thin wafers and can be used as a handler for the wafer level burn-in system.Feature 1High-performance, high-throughput, and excellent cost performance machine.Feature 2The UF190A features the same high-performance and excellent operability as the UF200 earned a reputation including the automatic needle alignment function and the color LCD touch panel.Wafer Probing Machine: FP200AEvolving and Proliferating Wafer Probing Machine, UF Series Based on a flexible platform, the high accuracy and high rigidity, UF series is further evolved. Wafers are varying with the progress of line width shrinkage and assembly technology. This machine can be used for processing very thin wafers and can be used as a handler for the wafer level burn-in system. Feature 1Frame transfer ready for the thinner wafer.Wafer Probing Machines Network: VEGANETThe operation status of the wafer probing machines can be centralizedly monitored to further improve the operation rateSystem monitorOperation rate controlProber status monitorData analysisWafer Probing Machines Network: LIGHTVEGAThe resource control will be centralized on the user hostWafer Probing Machines Network: GEM Network SystemWafer Probing Machines Network: VEGA PLANETDedicated terminals contributing to the efficiency enhancement of test areas Feature 1Device data compile terminalFeature 2Remote operation terminalFeature 3Logging data analysis terminalFeature 4Map viewerPolish GrindersPolish grinders simultaneously thin wafers while performing damage removal caused by the grinding process, and offer various applications for peripheral processes in the one system.Polish Grinder: PG3000/PG200PG3000PG200The product of a unique ACCRETECH innovation, this Polish Grinder combines the wafer thinness required for IC cards and three-dimensional mounting technology with damage removal functions in a single device.Feature 1Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine.Feature 2All the processes are completed without moving the wafer on the same chuck table.Feature 3The smallest footprint in the worldFeature 4Environmental - friendly - subsurface damage reduction without chemicals. Feature 5System configurationPolish Grinder: PG3000RM/PG200RMPG3000 RM : For 300mm WafersPG200 RM : For 200mm WafersACCRETECH also offers the "RM option", having the additional process of the tape removing for thinner wafer after the tape mounting, in addition to the standard process of PG300/200.Feature 1Optional RM moduleThe RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames.Feature 2Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine.Feature 3All the processes are completed without moving the wafer on the same chuck table.Feature 4The smallest footprint in the world.Feature 5Environmental - friendly - subsurface damage reduction without chemicals. Feature 6System configurationWafer Dicing MachinesWafer dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.Wafer Dicing Machines：AD3000T/STokyo Seimitsu Wafer Dicing Machine realizes the remarkable “CoO (Cost of Owne rship)” by the world smallest footprint, high throughput, and high processing quality reinforced by the collaboration of theup-to-date technology.Wafer Dicing Machines:A-WD-200THigh throughput achieved by a new conceptThe A-WD-200T uses an opposing, twin spindle arrangement. Thisunique concept minimizes motion and delivers a massive boost inthroughput.Wafer Dicing Machines:A-WD-250SFully automated dicing machine for 8 inch wafer and large-sizedsubstratesWafer Dicing Machines: AD20TRevolutionary axis design orientation creates the smallest twin spindleDicing SawWafer Dicing Machines:A-WD-10BThis multipurpose dicing machine realizes ease of use with theadaptation of the much sought-after space saving factor, slide coversystem and functionmanagement system.Wafer Dicing Machines:PS280Now, with two independent stages, cutting and positioning canproceed in parallel. The result - a maximum dicing speed up to twicethat previously possible!New connected handlers, shorten coordination time - bringingincreased operation efficiency and substantial savings in processingtime.Automatic Cleaning System:A-CS-100AStand-alone wafer cleaning unit, A-CS-100A will provide best solution for cleaning and drying the wafer such as sawn with semi-automaticdicing saws.High-pressure water spray up to 10 MPa driven by horizontal swinging arm will achieve excellent cleaning quality.Wafer Dicing Machines:ML300High performance laser dicing machine for 300 mm wafers with SDE.Wafer Dicing Machines:ML200We have developed a dicing machine equipped with stealth dicingtechnology (developed by Hamamatsu Photonics) as a stealth dicingengine, exhibiting excellent performance.Precision ACCRETECH BladeWith the diamond, the world-hardest substance, super-abrasive grit,we offer the cutting blade and solution that are high quality and costcutting.•Precision ACCRETECH BladeProduct listMeasuring Systems:Product list"No measurement,no manufacturing" - ACCRETECH supplys the best from Multi-perpose measuring to In-line measuring.Automatic Measuring SystemsMachine control gauges control processing machines based on data taken before, during and after operation. This indispensable system is used to prevent defects and boost accuracy in manufacture, thereby raising productivity. We also produce air micrometers, electric micrometers and high-precision sensors.•Machine Control Gauges•Various Sensors and Electric / Air Micrometers•High Precisions Digital Measurement Instrument•Laser Interferometer / Built-in Measuring Instruments•Automatic Measuring SystemsIndustrial Measuring SystemsWe manufacture a variety of high-precision industrial measuring systems, including: 3D Coordinate Measuring Machines, Surface Texture and Contour Measuring Instruments and Cylindrical Form Measuring Instruments.•3D Coordinate Measuring Machines•Surface Texture and Contour Measuring Instruments•Roundness and Cylindrical Profile Measuring Instruments。