IC datasheet pdf-TLV2556,pdf (Low Power, Serial ADC with Internal Reference)(1)

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TLV2556IPW;TLV2556IDWR;TLV2556IPWR;TLV2556IPWRG4;TLV2556IDWRG4;中文规格书,Datasheet资料

Copyright 2002, Texas Instruments Incorporated

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TLV2556
SLAS355A – DECEMBER 2001 – REVISED SEPTEMBER 2002
AVAILABLE OPTIONS PACKAGE TA – 40°C to 85°C SMALL OUTLINE 20-TSSOP (PW) TLV2556IPW 20-SOWB (DW) TLV2556IDW
AIN0 AIN1 AIN2 AIN3 AIN4 AIN5 AIN6 AIN7 AIN8 GND
1 2 3 4 5 6 7 8 9 10
20 19 18 17 16 15 14 13 12 11
VCC INT/EOC I/O CLOCK DATA IN DATA OUT CS REF + REF – AIN10 AIN9
Input Address Register
16
DATA OUT
DATA IN CS I/O CLOCK
17 15 18 Control Logic and I/O Counters 10 GND
4 Internal OSC
2

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TLV2556
SLAS355A – DECEMBER 2001 – REVISED SEPTEMBER 2002
TLV2556
SLAS355A – DECEMBER 2001 – REVISED SEPTEMBER 2002
12-BIT, 200-KSPS, 11 CHANNEL, LOW POWER, SERIAL ADC WITH INTERNAL REFERENCE
FEATURES D 12-Bit-Resolution A/D Converter D Up to 200-KSPS (150-KSPS for 3 V) D D D D D D D D D D D D

vp16256中文资料_数据手册_IC数据表

C15:0
16-bit coefficient input bus. In the Byte mode of operation, C15:8 have alternative uses as explained in the text.
pass filter, with a 10MHz input rate and 5MHz output rate. Coefficients are stored internally and can be down loaded from
GH208
a host system or an EPROM. The latter requires no additional
EPROM
I 208-Pin Plastic PowerQuad PQ2 Package
ANALOG INPUT
EPROM ADDR DATA
CHANGE COEFF POWER-ON RESET
ADC
RES COEFFICIENTS
VP 16256
EPROM
OUTPUT DATA
CLKOP
SCLK GND
by-two mode. The output rate is then half the input rate, but twice the
number of stages are possible at a given sample rate. A single device
with a 40MHz clock would then, for example, provide a 128-stage low
Fig. 2 Typical system application

IC datasheet pdf-LT3652HV PDF DATASHEET

13652hvfT YPICAL APPLICATIOND ESCRIPTION ChargerThe LT ®3652HV is a complete monolithic step-down bat-tery charger that operates over a 4.95V to 34V input range. The LT3652HV provides a constant-current/constant-voltage charge characteristic, with maximum charge current externally programmable up to 2A. The charger employs a 3.3V ﬂ oat voltage feedback reference, so any desired battery ﬂ oat voltage up to 18V can be programmed with a resistor divider.The LT3652HV employs an input voltage regulation loop, which reduces charge current if the input voltage falls below a programmed level, set with a resistor divider. When the LT3652HV is powered by a solar panel, the input regulation loop is used to maintain the panel at peak output power.The L T3652HV c an b e c onﬁ gured t o t erminate c harging w hen charge c urrent f alls b elow 1/10 o f t he p rogrammed m aximum (C/10). Once charging is terminated, the LT3652HV enters a low-current (85μA) standby mode. An auto-recharge feature starts a new charging cycle if the battery voltage falls 2.5% below the programmed ﬂ oat voltage. The LT3652HV also contains a programmable safety timer, used to terminate charging after a desired time is reached. This allows top-off charging at currents less than C/10.F EATURESA PPLICATIONS nInput Supply Voltage Regulation Loop for Peak Power T racking in (MPPT) Solar Applicationsn Wide Input Voltage Range: 4.95V to 34V (40V Abs Max)n Programmable Charge Rate Up to 2An User Selectable Termination: C/10 or On-Board Termination Timern Resistor Programmable Float Voltage Up to 18V Accommodates 4-Cell Li-Ion/Polymer , 5-Cell LiFePO 4, Lead-Acid Chemistriesn Parallelable for Higher Output Current n 1MHz Fixed Frequencyn 0.5% Float Voltage Reference Accuracy n 5% Charge Current Accuracy n 2.5% C/10 Detection Accuracyn Binary-Coded Open-Collector Status PinsnSolar Powered Applications n Remote Monitoring Stations n Portable Handheld Instruments n 12V to 24V Automotive SystemsnBattery Charging from Current Limited AdapterL , L T , L TC, L TM, Linear Technology and the Linear logo are registered trademarks and PowerPath is a trademark of Linear Technology Corporation. All other trademarks are the property of their respective owners.V IN_REG Loop Servos Maximum Charge Current to Prevent AC Adapter Output from Drooping Lower Than 24V 5-Cell LiFePO 4 Charger (18V at 1.5A) with C/10 TerminationPowered by Inexpensive 24VDC/1A Unregulated Wall Adapter.SYSTEM LOADD3ADAPTER OUTPUT CURRENT (A)00.2A D A P T E R O U T P U T V O L T A G E (V )12151833302724210.61 1.23652 TA01b360.40.8 1.61.421.81A/24VDC Unregulated AdapterI vs V CharacteristicLT3652HV23652hvfP IN CONFIGURATIONA BSOLUTE MAXIMUM RATINGS Voltages:V IN ........................................................................40V V IN_REG , SHDN , CHRG , FAUL T ............V IN + 0.5V , 40V SW ........................................................................40V SW-V IN .................................................................4.5V BOOST ...................................................SW+10V , 50V BAT , SENSE .. (20V)(Note 1)ORDER INFORMATIONLEAD FREE FINISH TAPE AND REEL PART MARKING*PACKAGE DESCRIPTION TEMPERATURE RANGE LT3652HVEDD#PBF LT3652HVEDD#TRPBF LFRG 12-Lead Plastic DFN 3mm × 3mm –40°C to 125°C LT3652HVIDD#PBF LT3652HVIDD#TRPBF LFRG 12-Lead Plastic DFN 3mm × 3mm –40°C to 125°C LT3652HVEMSE#PBF LT3652HVEMSE#TRPBF 3652HV 12-Lead Plastic MSOP –40°C to 125°C LT3652HVIMSE#PBFLT3652HVIMSE#TRPBF3652HV12-Lead Plastic MSOP–40°C to 125°CConsult LTC Marketing for parts speciﬁ ed with wider operating temperature ranges. *The temperature grade is identiﬁ ed by a label on the shipping container.Consult LTC Marketing for information on non-standard lead based ﬁ nish parts.For more information on lead free part marking, go to: /leadfree/ For more information on tape and reel speciﬁ cations, go to: /tapeandreel/TOP VIEWDD PACKAGE12-LEAD (3mm × 3mm) PLASTIC DFN1211891045321SW BOOST SENSE BAT NTCV FBV IN V IN_REG SHDN CHRG FAUL T TIMER6713123456V IN V IN_REG SHDN CHRG FAUL T TIMER 121110987SW BOOST SENSE BAT NTC V FBTOP VIEW13MSE PACKAGE12-LEAD PLASTIC MSOPT JMAX = 125°C, θJA = 43°C/W , θJC = 3°C/WEXPOSED PAD (PIN 13) IS GND, MUST BE SOLDERED TO PCBT JMAX = 125°C, θJA = 43°C/W , θJC = 3°C/WEXPOSED PAD (PIN 13) IS GND, MUST BE SOLDERED TO PCBBAT-SENSE .........................................–0.5V to +0.5VNTC, TIMER, ........................................................2.5V V FB ..........................................................................5V Operating Junction Temperature Range(Note 2) .............................................–40°C to 125°C Storage Temperature Range ...................–65°C to 150°CLT3652HV33652hvfE LECTRICAL CHARACTERISTICSSYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITSV IN V IN Operating RangeV IN Start Voltage V BAT = 4.2 (Notes 3, 4)V BAT = 4.2 (Note 4)l l 4.957.534V V V IN(OVLO)OVLO Threshold OVLO Hysteresis V IN Rising l3435140V V V IN(UVLO)UVLO Threshold UVLO Hysteresis V IN Rising 4.60.24.95V V V FB(FL T)Float Voltage Reference (Note 6)l 3.2823.263.3 3.3183.34V V ΔV RECHARGE Recharge Reference Threshold Voltage Relative to V FB(FL T) (Note 6)82.5mV V FB(PRE)Reference Precondition Threshold V FB Rising (Note 6)2.3V V FB(PREHYST)Reference Precondition Threshold HysteresisVoltage Relative to V FB(PRE) (Note 6)70mVV IN_REG(TH)Input Regulation Reference V FB = 3V; V SENSE – V BAT = 50mV l 2.65 2.7 2.75V I IN_REG Input Regulation Reference Bias Current V IN_REG = V IN_REG(TH)l 35100nA I VINOperating Input Supply CurrentCC/CV Mode, I SW = 0Standby ModeShutdown (SHDN = 0)l 2.58515 3.5mA μA μA I BOOST BOOST Supply Current Switch On, I SW = 0,2.5 < V (BOOST – SW) < 8.520mA I BOOST/I SW BOOST Switch Drive I SW = 2A30mA/A V SW(ON)Switch-On Voltage Drop V IN – V SW , I SW = 2A350mV I SW(MAX)Switch Current Limit l 2.53A V SENSE(PRE)Precondition Sense Voltage V SENSE – V BAT ; V FB = 2V 15mVV SENSE(DC)Maximum Sense Voltage V SENSE – V BAT ; V FB = 3V (Note 7)l 95100105mV V SENSE(C/10)C/10 T rigger Sense Voltage V SENSE – V BAT , Falling l7.51012.5mV I BAT BAT Input Bias Current Charging Terminated 0.11μA I SENSE SENSE Input Bias Current Charging Terminated 0.11μA I VFB V FB Input Bias Current Charging Terminated 65nA I VFB V FB Input Bias Current CV Operation (Note 5)110nAV NTC(H)NTC Range Limit (High)V NTC Rising l 1.25 1.36 1.45V V NTC(L)NTC Range Limit (Low)V NTC Falling l 0.270.290.315V V NTC(HYST)NTC Threshold Hysteresis % of threshold 20%R NTC(DIS)NTC Disable Impedance Impedance to ground l 250500kΩI NTC NTC Bias Current V NTC = 0.8V l 47.55052.5μA V SHDN Shutdown Threshold Risingl 1.151.2 1.25V V SHDN (HYST)Shutdown Hysteresis 120mV I SHDN SHDN Input Bias Current –10nAV CHRG , V FAUL T Status Low Voltage 10mA Load l 0.4V I TIMER Charge/Discharge Current 25μA V TIMER(DIS)Timer Disable Thresholdl0.10.25VThe l denotes the speciﬁ cations which apply over the full operating junction temperature range, otherwise speciﬁ cations are at T A = 25°C. V IN = 20V, Boost – SW = 4V, SHDN = 2V, V FB = 3.3V, C TIMER= 0.68μF.LT3652HV43652hvfSYMBOL PARAMETERCONDITIONS MIN TYP MAX UNITSt TIMERFull Charge Cycle Timeout 3hr Precondition Timeout 22.5minTimer Accuracyl–1010%f O Operating Frequency 1MHz DCDuty Cycle RangeContinuous Operationl 1590%E LECTRICAL CHARACTERISTICS The l denotes the speciﬁ cations which apply over the full operating junction temperature range, otherwise speciﬁ cations are at T A = 25°C. V IN = 20V, Boost – SW = 4V, SHDN = 2V, V FB = 3.3V, C TIMER = 0.68μF.Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime.Note 2: The L T3652HV is tested under pulsed load conditions such that T J ≅ T A . The L T3652HVE is guaranteed to meet performance speciﬁ cations from 0°C to 85°C junction temperature. Speciﬁ cations over the –40°C to 125°C operating junction temperature range are assured by design, characterization, and correlation with statistical process controls. The L T3652HVI speciﬁ cations are guaranteed over the full –40°C to 125°C operating junction temperature range. High junction temperatures degrade operating lifetimes; operating lifetime is derated for junction temperatures greater than 125°C.Note 3: V IN minimum voltages below the start threshold are only supported if (V BOOST -V SW ) > 2V .Note 4: This parameter is valid for programmed output battery ﬂ oat voltages ≤ 4.2V . V IN operating range minimum is 0.75V above the programmed output battery ﬂ oat voltage (V BAT(FL T) + 0.75V). V IN Start Voltage is 3.3V above the programmed output battery ﬂ oat voltage (V BAT(FL T) + 3.3V).Note 5: Output battery ﬂ oat voltage (V BAT(FL T)) programming resistor divider equivalent resistance = 250k compensates for input bias current. Note 6: All V FB voltages measured through 250k series resistance.Note 7: V SENSE(DC) is reduced by thermal foldback as junction temperature approaches 125°C.LT3652HV53652hvfT YPICAL PERFORMANCE CHARACTERISTICS Switch Forward Drop (V IN – V SW ) vs TemperatureCC/CV Charging; SENSE Pin Bias Current vs V SENSEC/10 Threshold (V SENSE –V BAT ) vs TemperatureV FB Reference Voltage vs TemperatureV IN Standby Mode Current vs TemperatureSwitch Drive (I SW /I BOOST ) vs Switch CurrentT J = 25°C, unless otherwise noted.TEMPERATURE (°C)–50V F B (F L T )3.2963.2983.3003.302050753652 G01a3.304–2525100125TEMPERATURE (°C)–5065I V I N C U R R E N T (μA )70758010090050753652 G029585–2525100SWITCH CURRENT (A)I S W /I B O O S T18243036 1.6126021273315930.40.8 1.20.2 1.80.6 1.0 1.4 2.03652 G03TEMPERATURE (°C)–50320V S W (O N ) (m V )340360380480420050753652 G04440460400–2525100125V SENSE (V)–350I S E N S E (μA )–250–150–5010050–300–200–10003652 G05TEMPERATURE (°C)–508V S E N S E (C /10) (m V )9101112050753652 G06–2525100125TEMPERATURE (°C)–50V I N _R E G (T H ) (V )2.6802.6852.6902.7152.7102.7052.7002.695050753652 G012.720–2525100125V IN_REG Thresholdvs Temperature: I CHG at 50%LT3652HV63652hvfTYPICAL PERFORMANCE CHARACTERISTICSMaximum Charge Current (V SENSE –V BAT ) vs TemperatureThermal Foldback – Maximum Charge Current (V SENSE –V BAT ) vs TemperatureCC/CV Charging; BAT Pin Bias Current vs V BATT A = 25°C, unless otherwise noted.TEMPERATURE (°C)–5099.0V S E N S E (D C ) (m V )99.299.699.8100.0101.0100.4050753652 G0799.4100.6100.8100.2–2525100125TEMPERATURE (°C)V S E N S E (D C )(m V )4080206010012045658510512535135255575951153652 G08V BAT (V)–0.4I B A T (m A )0.00.40.82.21.62.01.2–0.20.20.61.01.81.43652 G09V IN_REG (V)2.65V S E N S E (D C ) (m V )208060402.67 2.692.73652 G101002.66 2.682.722.71 2.732.742.75V BAT(FL T) (V)020I R F B (μA )861012183652 G114264810121614TIME (MINUTES)EFFICIENCY (%)C H A R G E C U R R E N T (A ); P OW E R L O S S (W )0.52.02.51.51.040801003652 G123.0354575655595852060140120160180200Maximum Charge Current(V SENSE –V BAT ) vs V IN_REG VoltageV FLOAT Programming Resistor Current vs V FLOAT for 2-Resistor NetworkCharge Current, Efﬁ ciency, and Power Loss vs Time(I CHG(MAX) = 2A; V FLOAT = 8.2V)Charger Efﬁ ciency vs Battery Voltage (I CHG= 2A)V BAT (V)70E F F I C I E N C Y (%)7680828486887472789057911134141536810123652 G13LT3652HV73652hvfP IN FUNCTIONS V IN (Pin 1): Charger Input Supply. V IN operating range is 4.95V to 34V. V IN must be 3.3V greater than the pro-grammed output battery ﬂ oat voltage (V BAT(FLT)) for reli-able start-up. (V IN – V BAT(FLT)) ≥ 0.75V is the minimum operating voltage, provided (V BOOST – V SW ) ≥ 2V. I VIN ~ 85μA after charge termination. This pin is typically con-nected to the cathode of a blocking diode.V IN_REG (Pin 2): Input Voltage Regulation Reference. Maxi-mum charge current is reduced when this pin is below 2.7V. Connecting a resistor divider from V IN to this pin enables programming of minimum operational V IN voltage. This is typically used to program the peak power voltage for a solar panel. The LT3652HV servos the maximum charge current required to maintain the programmed operational V IN voltage, through maintaining the voltage on V IN_REG at or above 2.7V. If the voltage regulation feature is not used, connect the pin to V IN .SHDN (Pin 3): Precision Threshold Shutdown Pin. The enable threshold is 1.2V (rising), with 120mV of input hysteresis. When in shutdown mode, all charging functions are disabled. The precision threshold allows use of the SHDN pin to incorporate UVLO functions. If the SHDN pin is pulled below 0.4V, the IC enters a low current shutdown mode where V IN current is reduced to 15μA. Typical SHDN pin input bias current is 10nA. If the shutdown function is not desired, connect the pin to V IN .CHRG (Pin 4): Open-Collector Charger Status Output; typically pulled up through a resistor to a reference volt-age. This status pin can be pulled up to voltages as high as V IN when disabled, and can sink currents up to 10mA when enabled. During a battery charging cycle, if required charge current is greater than 1/10 of the programmed maximum current (C/10), CHRG is pulled low. A tem-perature fault also causes this pin to be pulled low. After C/10 charge termination or, if the internal timer is used for termination and charge current is less than C/10, the CHRG pin remains high-impedance.FAULT (Pin 5): Open-Collector Charger Status Output; typically pulled up through a resistor to a reference volt-age. This status pin can be pulled up to voltages as high as V IN when disabled, and can sink currents up to 10mA when enabled. This pin indicates fault conditions during abattery charging cycle. A temperature fault causes this pin to be pulled low. If the internal timer is used for termina-tion, a bad battery fault also causes this pin to be pulled low. If no fault conditions exist, the FAULT pin remains high-impedance.TIMER (Pin 6): End-Of-Cycle Timer Programming Pin. If a timer-based charge termination is desired, connect a capacitor from this pin to ground. Full charge end-of-cycle time (in hours) is programmed with this capacitor following the equation: t EOC = C TIMER • 4.4 • 106A bad battery fault is generated if the battery does not achieve the precondition threshold voltage within one-eighth of t EOC , or: t PRE = C TIMER • 5.5 • 105A 0.68μF capacitor is typically used, which generates a timer EOC at three hours, and a precondition limit time of 22.5 minutes. If a timer-based termination is not desired, the timer function is disabled by connecting the TIMER pin to ground. With the timer function disabled, charging terminates when the charge current drops below a C/10 threshold, or I CHG(MAX)/10V FB (Pin 7): Battery Float Voltage Feedback Reference. The charge function operates to achieve a ﬁ nal ﬂ oat voltage of 3.3V on this pin. Output battery ﬂ oat voltage (V BAT(FLT)) is programmed using a resistor divider. V BAT(FLT) can be programmed up to 18V.The auto-restart feature initiates a new charging cyclewhen the voltage at the V FB pin falls 2.5% below the ﬂoat voltage reference.The V FB pin input bias current is 110nA. Using a resistor divider with an equivalent input resistance at the V FB pin of 250k compensates for input bias current error.Required resistor values to program desired V BAT(FLT) follow the equations:R1 = (V BAT(FLT) • 2.5 • 105)/3.3 (Ω) R2 = (R1 • 2.5 • 105)/(R1 - (2.5 • 105))(Ω)R1 is connected from BAT to V FB , and R2 is connected from V FBto ground.LT3652HV 83652hvfNTC (Pin 8): Battery Temperature Monitor Pin. This pin is the input to the NTC (Negative Temperature Coefﬁ cient) thermistor temperature monitoring circuit. This function is enabled by connecting a 10kΩ, B = 3380 NTC thermistor from the NTC pin to ground. The pin sources 50μA, and monitors the voltage across the 10kΩ thermistor. When the voltage on this pin is above 1.36 (T < 0°C) or below 0.29V (T > 40°C), charging is disabled and the CHRG and FAULT pins are both pulled low. If internal timer termina-tion is being used, the timer is paused, suspending the charging cycle. Charging resumes when the voltage on NTC returns to within the 0.29V to 1.36V active region. There is approximately 5°C of temperature hysteresis associated with each of the temperature thresholds. The temperature monitoring function remains enabled while the thermistor resistance to ground is less than 250k, so if this function is not desired, leave the NTC pin unconnected.BAT (Pin 9): Charger Output Monitor Pin. Connect a 10μF decoupling capacitance (C BAT ) to ground. Depend-ing on application requirements, larger value decoupling capacitors may be required. The charge function operates to achieve the programmed output battery ﬂ oat voltage (V BAT(FLT)) at this pin. This pin is also the reference for the current sense voltage. Once a charge cycle is termi-nated, the input bias current of the BAT pin is reduced to < 0.1μA, to minimize battery discharge while the charger remains connected.SENSE (Pin 10): Charge Current Sense Pin. Connect the inductor sense resistor (R SENSE ) from the SENSE pin to the BAT pin. The voltage across this resistor sets the averagecharge current. The maximum charge current (I CHG(MAX)) corresponds to 100mV across the sense resistor. This resistor can be set to program maximum charge cur-rent as high as 2A. The sense resistor value follows the relation:R SENSE = 0.1/I CHG(MAX) (Ω)Once a charge cycle is terminated, the input bias current of the SENSE pin is reduced to < 0.1μA, to minimize battery discharge while the charger remains connected.BOOST (Pin 11): Bootstrapped Supply Rail for Switch D rive. This pin facilitates saturation of the switch transistor. Connect a 1μF or greater capacitor from the BOOST pin to the SW pin. Operating range of this pin is 0V to 8.5V, referenced to the SW pin. The voltage on the decoupling capacitor is refreshed through a rectifying diode, with the anode connected to either the battery output voltage or an external source, and the cathode connected to the BOOST pin.SW (Pin 12): Switch Output Pin. This pin is the output of the charger switch, and corresponds to the emitter of the switch transistor. When enabled, the switch shorts the SW pin to the V IN supply. The drive circuitry for this switch is bootstrapped above the V IN supply using the BOOST supply pin, allowing saturation of the switch for maximum efﬁ ciency. The effective on-resistance of the boosted switch is 0.175Ω.SGND (Pin 13): Ground Reference and Backside Exposed Lead Frame Thermal Connection. Solder the exposed lead frame to the PCB ground plane.P IN FUNCTIONSLT3652HV93652hvfB LOCK DIAGRAM+–LT3652HV103652hvfA PPLICATIONS INFORMATION OverviewL T3652HV is a complete monolithic, mid-power , multi-chemistry buck battery charger , addressing high input voltage applications with solutions that require a minimum of external components. The IC uses a 1MHz constant fre-quency, average-current mode step-down architecture.The L T3652HV incorporates a 2A switch that is driven by a bootstrapped supply to maximize efficiency during charging cycles. Wide input range allows operation to full charge from voltages as high as 34V . A precision threshold shutdown pin allows incorporation of UVLO functionality using a simple resistor divider . The IC can also be put into a low-current shutdown mode, in which the input supply bias is reduced to only 15μA.The L T3652HV employs an input voltage regulation loop, which reduces charge current if a monitored input voltage falls below a programmed level. When the L T3652HV is powered by a solar panel, the input regulation loop is used to maintain the panel at peak output power .The L T3652HV automatically enters a battery precondition mode if the sensed battery voltage is very low. In this mode, the charge current is reduced to 15% of the programmed maximum, as set by the inductor sense resistor , R SENSE . Once the battery voltage reaches 70% of the fully charged float voltage, the IC automatically increases maximum charge current to the full programmed value.The L T3652HV can use a charge-current based C/10 termination scheme, which ends a charge cycle when the battery charge current falls to one tenth of the pro-grammed maximum charge current. The L T3652HV also contains an internal charge cycle control timer , for timer-based termination. When using the internal timer , the IC combines C/10 detection with a programmable time constraint, during which the charging cycle can continue beyond the C/10 level to top-off a battery. The charge cycle terminates when a specific time elapses, typically 3 hours. When the timer-based scheme is used, the IC also supports bad battery detection, which triggers a system fault if a battery stays in precondition mode for more than one eighth of the total charge cycle time.Once charging is terminated, the L T3652HV automati-cally enters a low-current standby mode where supply bias currents are reduced to 85μA. The IC continues tomonitor the battery voltage while in standby, and if that voltage falls 2.5% from the full-charge float voltage, the L T3652HV engages an automatic charge cycle restart. The IC also automatically restarts a new charge cycle after a bad battery fault once the failed battery is removed and replaced with another battery.The L T3652HV contains provisions for a battery tem-perature monitoring circuit. This feature monitors battery temperature using a thermistor during the charging cycle. If the battery temperature moves outside a safe charg-ing range of 0°C to 40°C, the IC suspends charging and signals a fault condition until the temperature returns to the safe charging range.The L T3652HV contains two digital open-collector outputs, which provide charger status and signal fault conditions. These binary-coded pins signal battery charging, standby or shutdown modes, battery temperature faults, and bad battery faults.General Operation (See Block Diagram)The L T3652HV uses average current mode control loop architecture, such that the IC servos directly to average charge current. The L T3652HV senses charger output voltage through a resistor divider via the V FB pin. The difference between the voltage on this pin and an internal 3.3V voltage reference is integrated by the voltage error amplifier (V-EA). This amplifier generates an error volt-age on its output (I TH ), which corresponds to the average current sensed across the inductor current sense resistor , R SENSE , which is connected between the SENSE and BAT pins. The I TH voltage is then divided down by a factor of 10, and imposed on the input of the current error amplifier (C-EA). The difference between this imposed voltage and the current sense resistor voltage is integrated, with the resulting voltage (V C ) used as a threshold that is compared against an internally generated ramp. The output of this comparison controls the charger’s switch.The I TH error voltage corresponds linearly to average current sensed across the inductor current sense resistor , allowing maximum charge current control by limiting the effective voltage range of I TH . A clamp limits this voltage to 1V which, in turn, limits the current sense voltage to 100mV . This sets the maximum charge current, or the current delivered while the charger is operating in con-A PPLICATIONS INFORMATIONstant-current (CC) mode, which corresponds to 100mV across R SENSE. The I TH voltage is pulled down to reduce this maximum charge current should the voltage on the V IN_REG pin falls below 2.7V (V IN_REG(TH)) or the die tem-perature approaches 125°C.If the voltage on the V FB pin is below 2.3V (V FB(PRE)), the L T3652HV engages precondition mode. D uring the precondition interval, the charger continues to operate in constant-current mode, but the maximum charge current is reduced to 15% of the maximum programmed value as set by R SENSE.When the charger output voltage approaches the float volt-age, or the voltage on the V FB pin approaches 3.3V (V FB(FL T)), the charger transitions into constant-voltage (CV) mode and charge current is reduced from the maximum value. As this occurs, the I TH voltage falls from the limit clamp and servos to lower voltages. The IC monitors the I TH volt-age as it is reduced, and detection of C/10 charge current is achieved when I TH = 0.1V. If the charger is configured for C/10 termination, this threshold is used to terminate the charge cycle. Once the charge cycle is terminated, the CHRG status pin becomes high-impedance and the charger enters low-current standby mode.The L T3652HV contains an internal charge cycle timer that terminates a successful charge cycle after a programmed amount of time. This timer is typically programmed to achieve end-of-cycle (EOC) in 3 hours, but can be con-figured for any amount of time by setting an appropriate timing capacitor value (C TIMER). When timer termination is used, the charge cycle does not terminate when C/10 is achieved. Because the CHRG status pin responds to the C/10 current level, the IC will indicate a fully-charged battery status, but the charger continues to source low currents into the battery until the programmed EOC time has elapsed, at which time the charge cycle will terminate. At EOC when the charging cycle terminates, if the battery did not achieve at least 97.5% of the full float voltage, charging is deemed unsuccessful, the L T3652HV re-initiates, and charging continues for another full timer cycle.Use of the timer function also enables bad-battery detec-tion. This fault condition is achieved if the battery does not respond to preconditioning, such that the charger remains in (or enters) precondition mode after 1/8th of the programmed charge cycle time. A bad battery fault halts the charging cycle, the CHRG status pin goes high-impedance, and the FAUL T pin is pulled low.When the L T3652HV terminates a charging cycle, whether through C/10 detection or by reaching timer EOC, the average current mode analog loop remains active, but the internal float voltage reference is reduced by 2.5%. Because the voltage on a successfully charged battery is at the full float voltage, the voltage error amp detects an over-voltage condition and I TH is pulled low. When the voltage error amp output drops below 0.3V, the IC enters standby mode, where most of the internal circuitry is dis-abled, and the V IN bias current is reduced to 85μA. When the voltage on the V FB pin drops below the reduced float reference level, the output of the voltage error amp will climb, at which point the IC comes out of standby mode and a new charging cycle is initiated.V IN Input SupplyThe L T3652HV is biased through a reverse-current block-ing element from the charger input supply to the V IN pin. This supply provides large switched currents, so a high-quality, low ESR decoupling capacitor is recommended to minimize voltage glitches on V IN. The V IN decoupling capacitor (C VIN) absorbs all input switching ripple current in the charger, so it must have an adequate ripple current rating. RMS ripple current (I CVIN(RMS)) is:I CVIN(RMS)≅ I CHG(MAX) • (V BAT / V IN)•([V IN / V BAT] – 1)1/2,where I CHG(MAX) is the maximum average charge current (100mV/R SENSE). The above relation has a maximum at V IN = 2 • V BAT, where:I CVIN(RMS) = I CHG(MAX)/2.The simple worst-case of ½ • I CHG(MAX) is commonly used for design.。

IC datasheet pdf-TLV2254-Q1,pdf(Advanced LinCMOS Rail-to-Rail Very Low Power Operational Amplifier)

TLV225xĆQ1,Advanced LinCMOS VERY LOWĆPOWER OPERATIONALTLV225xĆQ1, TLV225xAĆQ1Advanced LinCMOSVERY LOWĆPOWER OPERATIONAL AMPLIFIERSTLV225xĆQ1,Advanced LinCMOS VERY LOWĆPOWER OPERATIONALTLV225xĆQ1,Advanced LinCMOS VERY LOWĆPOWER OPERATIONALTLV225xĆQ1,Advanced LinCMOS VERY LOWĆPOWER OPERATIONALPACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TLV2252AQDRG4Q1ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2252AQDRQ1ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2252QDRG4Q1ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2252QDRQ1ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2254AQDRG4Q1ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2254AQDRQ1ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2254QDRG4Q1ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2254QDRQ1ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF TLV2252-Q1,TLV2252A-Q1,TLV2254-Q1,TLV2254A-Q1:•Catalog:TLV2252,TLV2252A,TLV2254,TLV2254A•Enhanced Product:TLV2252-EP,TLV2252A-EP,TLV2254-EP,TLV2254A-EP•Military:TLV2252M,TLV2252AM,TLV2254M,TLV2254AMNOTE:Qualified Version Definitions:•Catalog-TI's standard catalog product•Enhanced Product-Supports Defense,Aerospace and Medical Applications •Military-QML certified for Military and Defense ApplicationsIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDLP®Products Communications and /communicationsTelecomDSP Computers and /computersPeripheralsClocks and Timers /clocks Consumer Electronics /consumer-appsInterface Energy /energyLogic Industrial /industrialPower Mgmt Medical /medicalMicrocontrollers Security /securityRFID Space,Avionics&/space-avionics-defenseDefenseRF/IF and ZigBee®Solutions /lprf Video and Imaging /videoWireless /wireless-appsMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2010,Texas Instruments Incorporated。

IC datasheet pdf-AM26LV31C,AM26LV31I,pdf(LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERS)

FEATURESD OR NS PACKAGE(TOP VIEW)DESCRIPTION/ORDERING INFORMATIONAM26LV31C,AM26LV31ILOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERSSLLS201G–MAY 1995–REVISED MAY 2005•Switching Rates up to 32MHz•Operate From a Single 3.3-V Supply •Propagation Delay Time ...8ns Typ •Pulse Skew Time ...500ps Typ•High Output-Drive Current ...±30mA•Controlled Rise and Fall Times ...3ns Typ •Differential Output Voltage With 100-ΩLoad ...1.5V Typ•Ultra-Low Power Dissipation –dc,0.3mW Max–32MHz All Channels (No Load),385mW Typ •Accept 5-V Logic Inputs With 3.3-V Supply •Low-Voltage Pin-to-Pin CompatibleReplacement for AM26C31,AM26LS31,MB571•High Output Impedance in Power-Off Condition•Driver Output Short-Protection Circuit •Package Options Include Plastic Small-Outline (D,NS)PackagesThe AM26LV31C and AM26LV31I are BiCMOS quadruple differential line drivers with 3-state outputs.They are designed to be similar to TIA/EIA-422-B and ITU Recommendation V.11drivers with reduced supply-voltage range.The devices are optimized for balanced-bus transmission at switching rates up to 32MHz.The outputs have very high current capability for driving balanced lines such as twisted-pair transmission lines and provide a high impedance in the power-off condition.The enable function is common to all four drivers and offers the choice of active-high or active-low enable inputs.The AM26LV31C and AM26LV31I are designed using Texas Instruments proprietary LinIMPACT-C60™technology,facilitating ultra-low power consumption without sacrificing speed.These devices offer optimum performance when used with the AM26LV32quadruple line receivers.The AM26LV31C is characterized for operation from 0°C to 70°C.The AM26LV31I is characterized for operation from –45°C to 85°CORDERING INFORMATIONT APACKAGE (1)ORDERABLE PART NUMBER TOP-SIDE MARKING AM26LV31CD SOIC –DTape and reelAM26LV31C AM26LV31CDR 0°C to 70°CAM26LV31CNS SOIC –NS Tape and reel 26LV31AM26LV31CNSR AM26LV31ID SOIC –DTape and reelAM26LV31I AM26LV31IDR –45°C to 85°CAM26LV31INS SOIC –NSTape and reel 26LV31IAM26LV31INSR(1)Package drawings,standard packing quantities,thermal data,symbolization,and PCB design guidelines are available at /sc/package.Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.4Z4Y 3Z 3Y 2Z 2Y 1Z 1Y4A3A2A1AG GAll resistor values are nominal.AM26LV31C,AM26LV31ILOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERSSLLS201G–MAY 1995–REVISED MAY 2005FUNCTION TABLE (1)ENABLES OUTPUTSINPUT A G G Y Z H H X H L L H X L H H X L H L L X L L H X LHZZ(1)H =high level,L =low level,X =irrelevant,Z =high impedance (off)LOGIC DIAGRAM (POSITIVE LOGIC)SCHEMATIC (EACH DRIVER)Absolute Maximum Ratings(1) Recommended Operating Conditions Electrical Characteristics AM26LV31C,AM26LV31ILOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERSSLLS201G–MAY1995–REVISED MAY2005over operating free-air temperature range(unless otherwise noted)MIN MAX UNITV CC Supply voltage range(2)–0.36VV I Input voltage range–0.36VV O Output voltage range–0.36VD package73θJA Package thermal impedance(3)°C/WNS package64 Lead temperature1,6mm(1/16in)from case for10s260°CT stg Storage temperature range–65150°C (1)Stresses beyond those listed under"absolute maximum ratings"may cause permanent damage to the device.These are stress ratingsonly,and functional operation of the device at these or any other conditions beyond those indicated under"recommended operating conditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)All voltage values are with respect to GND.(3)The package thermal impedance is calculated in accordance with JESD51-7.MIN NOM MAX UNIT V CC Supply voltage3 3.3 3.6VV IH High-level input voltage2VV IL Low-level input voltage0.8VI OH High-level output current–30mAI OL Low-level output current30mAAM26LV31C070T A Operating free-air temperature°CAM26LV31I–4585over recommended operating supply-voltage and free-air temperature ranges(unless otherwise noted)PARAMETER TEST CONDITIONS MIN TYP(1)MAX UNITV IK Input clamp voltage I I=18mA–1.5VV OH High-level output voltage V IH=2V,I OH=–12mA 1.85 2.3VV OL Low-level output voltage V IL=0.8V,I OH=12mA0.8 1.05V|V OD|Differential output voltage(2)0.95 1.5VV OC Common-mode output voltage 1.3 1.55 1.8VR L=100ΩChange in magnitude of∆|V OC|±0.2V common-mode output voltage(2)I O Output current with power off V O=–0.25V or6V,V CC=0±100µAOff-state(high-impedance state)I OZ V O=–0.25V or6V,G=0.8V or G=2V±100µAoutput currentI H High-level input current V CC=0or3V,V I=5.5V 10µAI L Low-level input current V CC=3.6V,V I=0–10µAI OS Short-circuit output current V CC=3.6V,V O=0–200mAI CC Supply current(all drivers)V I=V CC or GND,No load100µAPower-dissipation capacitanceC pd No load160pF(all drivers)(3)(1)All typical values are at V CC=3.3V,T A=25°C.(2)∆|V OD|and∆|V OC|are the changes in magnitude of V OD and V OC,respectively,that occur when the input is changed from a high level toa low level.(3)C pd determines the no-load dynamic current consumption.I S=C pd×V CC×f+I CCSR +90%ǒV OH *V OL Ǔ*10%ǒV OH *V OL Ǔt r,the differential slew rate of V OD is 2 SR.Switching CharacteristicsAM26LV31C,AM26LV31ILOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERSSLLS201G–MAY 1995–REVISED MAY 2005V CC =3.3V,T A =25°CPARAMETERTEST CONDITIONS MIN TYP (1)MAX UNIT t PLH Propagation delay time,low-to high-level output See Figure 24812ns t PHL Propagation delay time,high-to low-level output 4812ns t t Transition time (t r or t f )3ns SR Slew rate,single-ended output voltage See Note(2)and Figure 20.31V/ns t PZH Output-enable time to high level See Figure 31020ns t PZL Output-enable time to low level See Figure 41020ns t PHZ Output-disable time from high level See Figure 31020ns t PLZ Output-disable time from low level See Figure 41020ns t sk(p)Pulse skew f =32MHz,See Note(3)0.51.5ns t sk(o)Skew limitf =32MHz 1.5ns t sk(lim)Skew limit (device to device)f =32MHz,See Note(4)3ns(1)All typical values are at V CC =3.3V,T A =25°C.(2)Slew rate is defined by:(3)Pulse skew is defined as the |t PLH -t PHL |of each channel of the same device.(4)Skew limit (device to device)is the maximum difference in propagation delay times between any two channels of any two devices.PARAMETER MEASUREMENT INFORMATIONG GZOutput, V OInputt PLH t PHLV CC0 V50%50%PROPAGATION DELAY TIMESYAOutput, V Ot rt f V OH90%90%RISE AND FALL TIMES10%10%V OLNOTES: A.C L includes probe and jig capacitance.B.The input pulse is supplied by a generator having the following characteristics: PRR = 32 MHz, Z O ≈ 50 Ω, 50% duty cycle,t r and t f ≤ 2 ns.10%10%90%90%YZt ft rV OL V OH AM26LV31C,AM26LV31ILOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERSSLLS201G–MAY 1995–REVISED MAY 2005Figure 1.Differential and Common-Mode Output VoltagesFigure 2.Test Circuit and Voltage Waveforms,t PHL and t PLHPARAMETER MEASUREMENT INFORMATIONInput t PZHt PHZ V CC 50%50%0 VOutput V OH50%VOLTAGE WAVEFORMSV off ≈00.3 VNOTES: A.C L includes probe and jig capacitance.B.The input pulse is supplied by a generator having the following characteristics: PRR = 1 MHz, Z O = 50 Ω, 50% duty cycle,t r and t f (10% to 90%) ≤ 2 ns.C.T o test the active-low enable G, ground G and apply an inverted waveform to G.S1= 110 ΩOutput TEST CIRCUITAM26LV31C,AM26LV31ILOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERSSLLS201G–MAY 1995–REVISED MAY 2005Figure 3.Test Circuit and Voltage Waveforms,t PZH and t PHZPARAMETER MEASUREMENT INFORMATIONInputtPZLt PLZV CC50%50%0 VOutputV OL50%VOLTAGE WAVEFORMSV off ≈V CC0.3 VNOTES: A.C L includes probe and jig capacitance.B.The input pulse is supplied by a generator having the following characteristics: PRR = 1 MHz, Z O = 50 Ω, 50% duty cycle,t r and t f (10% to 90%) ≤ 2 ns.C.T o test the active-low enable G, ground G and apply an inverted waveform to G.ΩOutputTEST CIRCUITV AM26LV31C,AM26LV31ILOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERSSLLS201G–MAY 1995–REVISED MAY 2005Figure 4.Test Circuit and Voltage Waveforms,t PZL and t PLZPACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)AM26LV31CD ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMAM26LV31CDE4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMAM26LV31CDG4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMAM26LV31CDR ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMAM26LV31CDRE4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMAM26LV31CDRG4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM AM26LV31CNSLE OBSOLETE SO NS16TBD Call TI Call TIAM26LV31CNSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMAM26LV31CNSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMAM26LV31CNSRG4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMAM26LV31ID ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMAM26LV31IDE4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMAM26LV31IDG4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMAM26LV31IDR ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMAM26LV31IDRE4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMAM26LV31IDRG4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMAM26LV31INSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMAM26LV31INSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMAM26LV31INSRG4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.TAPE AND REELINFORMATION*All dimensionsare nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant AM26LV31CDR SOIC D 162500330.016.4 6.510.3 2.18.016.0Q1AM26LV31CNSR SO NS 162000330.016.48.210.5 2.512.016.0Q1AM26LV31IDR SOIC D 162500330.016.4 6.510.3 2.18.016.0Q1AM26LV31INSRSONS162000330.016.48.210.52.512.016.0Q1PACKAGE MATERIALS INFORMATION19-Mar-2008*Alldimensions are nominal DevicePackage Type Package Drawing Pins SPQ Length (mm)Width (mm)Height (mm)AM26LV31CDRSOIC D 162500333.2345.928.6AM26LV31CNSRSO NS 162000346.0346.033.0AM26LV31IDRSOIC D 162500333.2345.928.6AM26LV31INSR SO NS 162000346.0346.033.0PACKAGE MATERIALS INFORMATION 19-Mar-2008Pack Materials-Page 2IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDLP®Products Communications and /communicationsTelecomDSP Computers and /computersPeripheralsClocks and Timers /clocks Consumer Electronics /consumer-appsInterface Energy /energyLogic Industrial /industrialPower Mgmt Medical /medicalMicrocontrollers Security /securityRFID Space,Avionics&/space-avionics-defenseDefenseRF/IF and ZigBee®Solutions /lprf Video and Imaging /videoWireless /wireless-appsMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2010,Texas Instruments Incorporated。

TPS2554 and TPS2555 Evaluation Module User's Guide

User's GuideSLVU462–June2011TPS2554and TPS2555Evaluation Module This user’s guide describes the evaluation module(EVM)for the TPS2554and TPS2555.TPS2554and TPS2555are precision-adjustable,current-limited,power-distribution switches.The document contains an operational description of the EVM,schematic,board layout,and bill of materials.Contents1Description (2)1.1Features (2)1.2Applications (2)2Schematic (3)3General Configuration and Description (4)3.1Physical Access (4)3.2Current-Limit Setpoint (4)3.3Test Setup (4)4EVM Assembly Drawings and Layout Guidelines (5)4.1Layout Guidelines (5)4.2PCB Drawings (5)5Bill of Materials (8)List of Figures1TPS2554/5EVM Schematic (3)2Typical TPS2554/5EVM Test Setup (5)3Top-Side Placement and Routing (6)4Layer-Two Routing (6)5Layer-Three Routing (7)6Bottom-Side Placement and Routing (7)List of Tables1User Interface (4)2Test Points (4)3EVM Bill of Materials (8)1 SLVU462–June2011TPS2554and TPS2555Evaluation Module Submit Documentation FeedbackCopyright©2011,Texas Instruments IncorporatedDescription 1DescriptionThe TPS2554EVM-010evaluation module allows reference circuit evaluation of the Texas Instruments TPS2554and TPS2555power-distribution switches.1.1Features•Precision adjustable,current-limited,power-distribution switch•Fast overcurrent response–1µs typical•80-mΩ,high-side MOSFET•Operating range:4.5V to5.5V1.2Applications•USB ports/hubs•Notebook personal computers(PC)2TPS2554and TPS2555Evaluation Module SLVU462–June2011Submit Documentation FeedbackCopyright©2011,Texas Instruments IncorporatedGeneral Configuration and Description 3General Configuration and Description3.1Physical AccessTable1lists the TPS2554/5EVM connector functionality,and Table2describes the test point availability.er InterfaceConnector Label DescriptionJ1VIN Input connectorJ2VOUT Output connectorJ3J3Input voltage jumper.Shunt can be removed to measure input current.J4J4Output voltage jumper.Shunt can be removed to measure output current.J5EN Enable jumper.Leave open to enable TPS2554and install shunt to enable TPS2555.J6ILIM_SEL Current limit select.Install shunt to select ILIM0(2.4A nominal),and remove shunt toselect ILIM1(1.2A nominal).D1(RED)FLT Fault LEDTable2.Test PointsTest Point Color Label DescriptionTP3RED IN Power switch input(IC side of J3shunt)TP4BLK GND Power switch input groundTP1WHT FLT Fault pin outputTP2RED VOUT Power switch outputTP5BLK GND Power switch output groundTP6WHT EN Enable pin input3.2Current-Limit SetpointR4and R5configure the current-limit setpoint for ILIM0and ILIM1,respectively(see J6in Table1).ILIM0or ILIM1setpoint can be adjusted using the following example by substituting R4or R5for RILIMx .In thisexample IOS=2A.The following example is an approximation only and does not take into account the resistor tolerance or the variation of ILIM.For exact variation of ILIM,see the TPS2554/TPS2555data sheet,SLVSAM0.IOS=48000/RILIMx=2ARILIMx=48000/IOS=48000/2=24000ΩChoose RILIMx=23.7kΩIOS=48000/23700=2.03A3.3Test SetupFigure2shows a typical test setup for TPS2554/5EVM.4TPS2554and TPS2555Evaluation Module SLVU462–June2011Submit Documentation FeedbackCopyright©2011,Texas Instruments IncorporatedV INOscilloscope EVM Assembly Drawings and Layout GuidelinesFigure2.Typical TPS2554/5EVM Test Setup4EVM Assembly Drawings and Layout Guidelines4.1Layout Guidelines•TPS2554/55placement:Place the TPS2554/55near the USB output connector and the150-µF OUT pin filter capacitor.Connect the exposed pad to the GND pin and the system ground plane using a viaarray.•IN pin bypass capacitance:Place the100-nF bypass capacitor near the IN and GND pins,and make the connection using a low-inductance trace.•ILIM0and ILIM1pin connections:Current-limit accuracy can be compromised by stray current leakage from a higher voltage source to the ILIM0or ILIM1pins.Ensure that adequate spacing existsbetween IN pin copper/trace and ILIM0pin trace to prevent contaminate buildup during the PCBassembly process.If a low-current-limit setpoint is required(RILIMx >200kΩ),use ILIM1for this case,as it is further away from the IN pin.4.2PCB DrawingsThe Figure3through Figure6show component placement and layout of the EVM.5 SLVU462–June2011TPS2554and TPS2555Evaluation Module Submit Documentation FeedbackCopyright©2011,Texas Instruments IncorporatedEVM Assembly Drawings and Layout Guidelines Figure 3.Top-Side Placement and RoutingFigure yer-Two Routing6TPS2554and TPS2555Evaluation ModuleSLVU462–June 2011Submit Documentation FeedbackCopyright ©2011,Texas Instruments Incorporated EVM Assembly Drawings and Layout Guidelinesyer-Three RoutingFigure6.Bottom-Side Placement and Routing7 SLVU462–June2011TPS2554and TPS2555Evaluation Module Submit Documentation FeedbackCopyright©2011,Texas Instruments IncorporatedEvaluation Board/Kit Important NoticeTexas Instruments(TI)provides the enclosed product(s)under the following conditions:This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT,DEMONSTRATION,OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use.Persons handling the product(s)must have electronics training and observe good engineering practice standards.As such,the goods being provided are not intended to be complete in terms of required design-,marketing-,and/or manufacturing-related protective considerations, including product safety and environmental measures typically found in end products that incorporate such semiconductor components or circuit boards.This evaluation board/kit does not fall within the scope of the European Union directives regarding electromagnetic compatibility,restricted substances(RoHS),recycling(WEEE),FCC,CE or UL,and therefore may not meet the technical requirements of these directives or other related directives.Should this evaluation board/kit not meet the specifications indicated in the User’s Guide,the board/kit may be returned within30 days from the date of delivery for a full refund.THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES,EXPRESSED,IMPLIED,OR STATUTORY,INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.The user assumes all responsibility and liability for proper and safe handling of the goods.Further,the user indemnifies TI from all claims arising from the handling or use of the goods.Due to the open construction of the product,it is the user’s responsibility to take any and all appropriate precautions with regard to electrostatic discharge.EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE,NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT,SPECIAL,INCIDENTAL,OR CONSEQUENTIAL DAMAGES.TI currently deals with a variety of customers for products,and therefore our arrangement with the user is not exclusive.TI assumes no liability for applications assistance,customer product design,software performance,or infringement of patents or services described herein.Please read the User’s Guide and,specifically,the Warnings and Restrictions notice in the User’s Guide prior to handling the product.This notice contains important safety information about temperatures and voltages.For additional information on TI’s environmental and/or safety programs,please contact the TI application engineer or visit /esh.No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine,process,or combination in which such TI products or services might be or are used.FCC WarningThis evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT,DEMONSTRATION,OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use.It generates,uses,and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part15 of FCC rules,which are designed to provide reasonable protection against radio frequency interference.Operation of this equipment in other environments may cause interference with radio communications,in which case the user at his own expense will be required to take whatever measures may be required to correct this interference.EVM Warnings and RestrictionsIt is important to operate this EVM within the input voltage range of0V to5.5V and the output voltage range of0V to5.5V. Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM.If there are questions concerning the input range,please contact a TI field representative prior to connecting the input power.Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM.Please consult the EVM User's Guide prior to connecting any load to the EVM output.If there is uncertainty as to the load specification,please contact a TI field representative.During normal operation,some circuit components may have case temperatures greater than85°C.The EVM is designed to operate properly with certain components above85°C as long as the input and output ranges are maintained.These components include but are not limited to linear regulators,switching transistors,pass transistors,and current sense resistors.These types of devices can be identified using the EVM schematic located in the EVM User's Guide.When placing measurement probes near these devices during operation,please be aware that these devices may be very warm to the touch.Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2011,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAudio /audio Communications and Telecom /communicationsAmplifiers Computers and Peripherals /computersData Converters Consumer Electronics /consumer-appsDLP®Products Energy and Lighting /energyDSP Industrial /industrialClocks and Timers /clocks Medical /medicalInterface Security /securityLogic Space,Avionics and Defense /space-avionics-defense Power Mgmt Transportation and /automotiveAutomotiveMicrocontrollers Video and Imaging /videoRFID Wireless /wireless-appsRF/IF and ZigBee®Solutions /lprfTI E2E Community Home Page Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2011,Texas Instruments Incorporated。

IC datasheet pdf-TPIC6A259,pdf (Power Logic 8-Bit Addressable Latch)

POWER LOGIC 8ĆBIT ADDRESSABLE LATCHPOWER LOGIC 8ĆBIT ADDRESSABLE LATCHPOWER LOGIC 8ĆBIT ADDRESSABLE LATCHPOWER LOGIC 8ĆBIT ADDRESSABLE LATCHPOWER LOGIC 8ĆBIT ADDRESSABLE LATCHPACKAGING INFORMATION Orderable DeviceStatus (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)TPIC6A259DWACTIVE SOIC DW 2425TBD CU NIPDAU Level-1-220C-UNLIM TPIC6A259DWG4ACTIVE SOIC DW 2425Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TPIC6A259DWRG4ACTIVE SOIC DW 242000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TPIC6A259NEACTIVE PDIP NE 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by thirdparties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM 28-May-2009Addendum-Page 1IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDLP®Products BroadbandDSP Digital ControlClocks and Timers MedicalInterface MilitaryLogic Optical NetworkingPower Mgmt SecurityMicrocontrollers TelephonyRFID Video&ImagingRF/IF and ZigBee®Solutions WirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2009,Texas Instruments Incorporated。

IC datasheet pdf-CAT3606 pdf,datasheet

CAT36066-Channel Low Noise Charge Pump White LED DriverDescriptionThe CAT3606 controls up to four LEDs for the main display and two LEDs for the sub-display in cellular phones. The device is capable of operating in either 1x (LDO) mode or 1.5x charge pump mode. All LED pin currents are regulated and tightly matched to achieve uniformity of brightness across the LCD backlight. An external resistor (R SET) sets the nominal output current.The device can deliver as much as 20 mA per channel during low voltage operation (3 V), and 30 mA per channel during nominal operation (3.3 V). A constant high-frequency switching scheme (1MHz) provides low noise and allows the use of very small value ceramic capacitors.A “zero” quiescent current mode can be achieved via the chip enable pin EN. The Main and Sub LEDs each have their own dedicated ON/OFF control pins ENM, ENS. Dimming can be achieved using either a DC voltage to control the R SET pin current, or by applying a PWM signal on the ENM and ENS pins.The device is available in a 16−pad TQFN package with a max height of 0.8 mm.Features•Drives up to 4 Main LEDs and 2 Sub LEDs•Separate Control for Main and Sub LEDs •Compatible with Supply V oltage of 3 V to 5.5 V•Power Efficiency up to 90%•Output Current up to 30 mA per LED•High−frequency Operation at 1 MHz•2 Modes of Operation 1x and 1.5x•White LED Detect Circuitry on All Channels •Shutdown Current less than 1 m A•Small Ceramic Capacitors•Soft Start and Current Limiting•Short Circuit Protection•16−pad TQFN Package, 0.8 mm Max Height•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS CompliantApplications•Cell Phone Main and Sub−display Backlight•Navigation •PDAs •Digital CamerasTQFN−16HV4 SUFFIXCASE 510AEPIN CONNECTIONS (Note 1)G366MARKING DIAGRAMSDevice Package ShippingORDERING INFORMATIONCAT3606HV4−T2TQFN−16(Note 2)2,000/Tape & ReelG366 = CAT3606HV4−T2CDBB = CAT3606HV4−GT21.The “exposed pad” under the package must beconnected to the ground plane on the PCB.2.Matte−Tin Plated Finish (RoHS−compliant).3.NiPdAu Plated Finish (RoHS−compliant).LED5LED4LED3LED2LED1C2+C2−C1−LED6ENENMENSRSETVOUTVINC1+1(4 x 4 mm) (Top View)CDBBCAT3606HV4−GT2TQFN−16(Note 3)GNDFigure 1. Typical Application Circuitm FLi −OUT Table 1. PIN DESCRIPTIONPin #Name Function1LED6LED6 cathode terminal2EN Enable/shutdown input, active high3ENM Enable “main” input for LED1 to LED4, active low 4ENS Enable “sub” input for LED5 and LED6, active low5RSET The LED output current is set by the current sourced out of the RSET pin 6VOUT Charge pump output connected to the LED anodes 7VIN Supply voltage8C1+Bucket capacitor 1 terminal 9C1Bucket capacitor 1 terminal 10C2Bucket capacitor 2 terminal 11C2+Bucket capacitor 2 terminal 12LED1LED 1 cathode terminal 13LED2LED 2 cathode terminal 14LED3LED 3 cathode terminal 15LED4LED 4 cathode terminal 16LED5LED 5 cathode terminal PADGNDGround referenceTable 2. ABSOLUTE MAXIMUM RATINGSParameter Rating Unit VIN, VOUT, LEDx voltage−0.3 to 7.0V EN, ENM, ENS voltage−0.3 to VIN V RSET voltage−0.3 to VIN V RSET current±1mA Ambient Temperature Range−40 to +85_C Storage Temperature Range−65 to +160_C Lead Temperature300_C ESD Rating HBM (Human Body Model)2,000V ESD Rating MM (Machine Model) (Note 4)200V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.4.Machine model is with 200 pF capacitor discharged directly into each pin.Table 3. RECOMMENDED OPERATING CONDITIONSParameter Range Unit VIN 3.0 to 5.5V Ambient Temperature Range−40 to +85_C Input/Output/Bucket Capacitors 1 ±20% Typical m FI LED per LED pin0 to 30mAI OUT Total Output Current0 to 150mA Table 4. ELECTRICAL OPERATING CHARACTERISTICS(Limits over recommended operating conditions unless specified otherwise. Typical values at T A = 25°C, V IN = 3.5 V, I RSET = 5 m A.) Symbol Parameter Conditions Min Typ Max UnitI Q Quiescent Current V EN= 0 V1x Mode, No Load1.5x Mode, No Load 0.10.32.6115m AmAmAV RSET RSET Regulated Voltage 1.17 1.2 1.23VI LED Programmed LED Current I RSET = 5 m AI RSET = 37 m AI RSET = 78 m A 2.415.030.0mAI LED LED Current Range with 6 LEDs 3.3 ≤ VIN ≤ 4.5 V3.0 ≤ VIN ≤4.5 V 3020mAI LED LED Current Range with 4 LEDs 3.3 ≤ VIN ≤ 4.5 V30mAI LED−ACC LED Current Accuracy0.5 mA ≤ I LED≤ 3 mA3 mA ≤ I LED≤ 30 mA ±15±5%I LED−DEV LED Channel Matching(I LED – I LEDAVG) / I LEDAVG±3%R OUT Output Resistance(Open Loop)1x Mode,1.5x Mode, I OUT = 100 mA1.46.52.510Wf OSC Charge Pump Frequency0.8 1.0 1.3MHz T DROPOUT1x to 1.5x Mode Transition Dropout Delay0.40.60.9ms I EN−CTR Input Leakage Current On Inputs EN, ENM, ENS1m AV EN−CTR High Detect ThresholdLow Detect Threshold On Inputs EN, ENM, ENS0.40.80.71.3VI SC Input Current Limit VOUT = GND304560mA I LIM Maximum Input Current VOUT > 1 V200400600mABlock DiagramFigure 2. CAT3606 Functional Block Diagramm FVBasic OperationAt power-up, the CA T3606 starts operation in 1x mode. If it is able to drive the programmed LED current, it continues in 1x mode. If the battery voltage drops to a level where the LED current cannot be met, the driver automatically switches into 1.5x mode, to boost the output voltage high enough to achieve the nominal LED current.The above sequence is reinitialized each and every time the chip is powered up or is taken out of shutdown mode (via EN pin). The use of the Main and Sub display enable pins (ENM or ENS) does not affect the mode of operation. LED Current SettingThe LED current is set by the external resistor R SET connected between the RSET pin and ground. Table 5 lists various LED currents and the associated R SET resistor value for standard 1% precision surface mount resistors.Table 5. RSET Resistor SelectionLED Current (mA)R SET (k W)1649228751021049.91532.42023.73015.4The enable lines ENM and ENS allow to turn On or Off a group of LEDs as shown in Table 6.Table 6. LED SelectionControl Lines LED Outputs EN ENM ENSMainLED1 − LED4SubLED5 −LED6 0X X––111––101ON−110−ON100ON ON NOTES:1 = logic high (or VIN)0 = logic low (or GND)– = LED output OFFX = don’t careThe unused LED channels can also be turned off by connecting the respective LED pins to VOUT. In which case, the corresponding LED driver is disabled and the typical LED sink current is only about 0.2 mA. When the following equation is true on any channel, the driver turns off the LED channel:VOUT*V LED v1V(LED channel OFF) Note: The CA T3606 is designed to drive LEDs with forward voltage greater than 1 V and is not compatible with resistive loads.Figure 3. Efficiency vs. Input Voltage(6 LEDs)Figure 4. Efficiency vs. Total LED Current(6 LEDs)INPUT VOLTAGE (V)TOTAL LED CURRENT (mA)405060708090100405060708090100Figure 5. LED Current vs. Input VoltageFigure 6. LED Current Change vs.TemperatureINPUT VOLTAGE (V)TEMPERATURE (°C)−−−0.51.5−−Figure 7. Ground Current vs. Input Voltage(1x Mode)Figure 8. Ground Current vs. Temperature(1x Mode)INPUT VOLTAGE (V)TEMPERATURE (°C)0.10.20.30.40.500.10.20.30.40.5E F F I C I E N C Y (%)E F F I C I E N C Y (%)L E D C U R R E N T C H A N G E (%)L E D C U R R E N T C H A N G E (%)G R O U N D C U R R E N T (m A )G R O U N D C U R R E N T (m A )01.0−−Figure 9. Ground Current vs. Input Voltage(1.5x Mode)Figure 10. Supply Current vs. Input VoltageINPUT VOLTAGE (V)INPUT VOLTAGE (V)134580120140Figure 11. Oscillator Frequency vs. InputVoltageFigure 12. Oscillator Frequency vs.TemperatureINPUT VOLTAGE (V)TEMPERATURE (°C)0.900.951.001.051.100.900.951.001.051.10Figure 13. Output Resistance vs. Input Voltage(1x Mode)Figure 14. Output Resistance vs. Input Voltage(1.5x Mode)INPUT VOLTAGE (V)INPUT VOLTAGE (V)1234246810G R O U N D C U R R E N T (m A )G R O U N D C U R R E N T (m A )C L O C K F R E Q U E N C Y (M H z )C L O C K F R E Q U E N C Y (M H z )O U T P U T R E S I S T A N C E (W )O U T P U T R E S I S T A N C E (W )2100Figure 15. Switching Waveforms in 1.5x Mode Figure 16. Operating Waveforms in 1x Mode400 nsec/div400 nsec/divCurrent Input 50mV/VIN 50mV/divVOUT Input 50mV/div VIN Figure 17. Power Up 6 LEDs at 15 mA,VIN = 3 V (1.5x Mode)Figure 18. Power Up 6 LEDs at 15 mA,VIN = 3.6 V (1x Mode)400 m sec/div400 m sec/div2V/divVOUT 2V/div EN 2V/divVOUT 100mA/divInput 2V/divEN Figure 19. LED Current vs. R SETFigure 20. Line Transient Responsein 1x ModeRSET (k W )200 m sec/div10,000100100.1101002V/div VOUT 5mA/div Input 1V/div3.6V to4.9VVinL E D C U R R E N T (m A )10mA/Input Current 100mA/divAC coupledCurrent 10mA/div AC coupledAC coupledVOUT 50mV/divdiv divCurrent Current 10001(V IN = 3.6 V, EN = V IN , ENM = ENS = GND, C IN = C OUT = 1 m F, T AMB = 25°C, unless otherwise specified.)Figure 21. Foldback Current Limiting OUTPUT CURRENT (mA)5004003002001000012345O U TP U T V O L T A G E (V )1x ModeFigure 22. RSET Pin Voltage vs. Temperature−50−2502550751001251.161.181.201.221.24R S E T P I N V O L T A G E (V )Figure 23. PWM Dimming at 1 kHz on ENM and ENS50mA/divCurrent Tot. LED 1V/divVOUT ENM & ENS5V/div200 m sec/divTEMPERATURE (°C)Recommended LayoutWhen the driver is in the 1.5x charge pump mode, the 1MHz switching frequency operation requires to minimize trace length and impedance to ground on all 4 capacitors. A ground plane should cover the area on the bottom side of the PCB opposite to the IC and the bypass capacitors.Capacitors Cin and Cout require short connection to ground which can be done with multiple vias as shown on Figure 24.A square copper area matches the QFN16 exposed pad (GND) and must be connected to the ground plane underneath. The use of multiple via will improve the heat dissipation.Figure 24. PCB LayoutPACKAGE DIMENSIONSTQFN16, 4x4CASE 510AE−01ISSUE AA3A1SIDE VIEWTOP VIEW BOTTOM VIEWDETAIL AFRONT VIEWNotes:(1) All dimensions are in millimeters.(2) Complies with JEDEC MO-220.SYMBOL MIN NOM MAXA0.700.750.80A10.000.020.05A30.20 REFb0.250.300.35D 3.90 4.00 4.10D2 2.00−−− 2.25E 4.00E2 2.00−−− 2.25e3.900.65 BSC4.10L0.45−−−0.65CAT3606Example of Ordering Information (Note 7)PrefixDevice #Suffix 5.All packages are RoHS −compliant (Lead −free, Halogen −free).6.The standard lead finish is NiPdAu.7.The device used in the above example is a CAT3606HV4−GT2 (TQFN, NiPdAu Plated Finish, Tape & Reel, 2,000/Reel).8.For Matte −Tin package option, please contact your nearest ON Semiconductor Sales office.9.For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION。

255N;中文规格书,Datasheet资料

Nominal data
Type 255 N VDC VDC min-1 W °C °C m3/h B dB(A) 5 4.5 .. 5.5 9600 0.4 -10 70 3.2 <3 16
Nominal voltage Nominal voltage range Speed Power input Min. ambient temperature Max. ambient temperature Air flow Sound power level Sound pressure level
Mass Dimensions Material of impeller Housing material Direction of air flow Direction of rotation Bearing Lifetime L10 at 20 °C Lifetime L10 at 60 °C Connection line Motor protection Approval
/
255 N
DC axial compact fan
Product drawing
Web data sheet XI · Page 3 of 4 ebm-papst St. Georgen GmbH & Co. KG · Hermann-Papst-Straße 1 · D-78112 St. Georgen · Phone +49 7724 81-0 · Fax +49 7724 81-1309 · info2@ ·
255 N
DC axial compact fan
ebm-papst St. Georgen GmbH & Co. KG Hermann-Papst-Straße 1 D-78112 St. Georgen Phone +49 7724 81-0 Fax +49 7724 81-1309 info2@ wቤተ መጻሕፍቲ ባይዱ

低成本锂电池充电芯片,付电路图介绍

特点
·高达 1000mA 的可编程充电电流 ·无需 MOSFET、检测电阻器或隔离二极管 ·用于单节锂离子电池、采用 SOP 封装的完整
线性充电器 ·恒定电流/恒定电压操作，并具有可在无过热
危险的情况下实现充电速率最大化的热调节功能 ·精度达到±1.5%的 4.2V 预设充电电压 ·用于电池电量检测的充电电流监控器输出 ·自动再充电 ·充电状态双输出、无电池和故障状态显示 ·C/10 充电终止 ·待机模式下的供电电流为 55uA ·2.9V涓流充电器件版本
VFLOAT-VRECHRG
IBAT=0 至 IBAT=1200V/RPROG VBAT 高至低
IBAT 降至 ICHG/10 以下
42
45
%Vcc
100 150
mΩ
20
μs
0.8
1.8
4
ms
0.8
1.8
4
ms
2.0
μA
4
南京拓微集成电路有限公司
典型性能特征
恒定电流模式下 PROG 引脚电压与电源电压的关系曲线
500
●
55
100
●
55
100
55
100
4．137 ● 450 ● 950 ●0
● 120
4．2 500 1000 －2.5 ±1 －1 130
4．263 550 1050 －6 ±2 －2 140
2.8
2.9
3.0
60
80
100
● 3.5
3.7
3.9
● 150 200
300
60
100
140
5
30
50
● 60
70

IC datasheet pdf-CD54AC245,CD74AC245,CD54ACT245,CD74ACT245,pdf(Octal-Bus Transceiver,Three-State, No

CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
FAST™ is a Trademark of Fairchild Semiconductor.
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA DC Output Source or Sink Current per Output Pin, IO
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC (Note 4)
AC Types. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5V to 5.5V ACT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Slew Rate, dt/dv AC Types, 1.5V to 3V . . . . . . . . . . . . . . . . . . . . . . . . . 50ns (Max) AC Types, 3.6V to 5.5V . . . . . . . . . . . . . . . . . . . . . . . . 20ns (Max) ACT Types, 4.5V to 5.5V. . . . . . . . . . . . . . . . . . . . . . . 10ns (Max)

IC datasheet pdf-MAXQ2010评估套件

BIT 3 COM3 1A 1H 2A 2H 3A 3H 4A 4H 5A 5H 6A 6H 7A 7H 8A 8H
BIT 2 COM2 1B 1G 2B 2G 3B 3G 4B 4G 5B 5G 6B 6G 7B 7G 8B 8G
BIT 1 COM1 1C 1N 2C 2N 3C 3N 4C 4N 5C 5N 6C 6N 7C 7N 8C 8N
QTY
DESCRIPTION 100nF ±10%, 10V ceramic capacitors (0805) Murata GRM219R71C104KA01D 10nF ±5%, 10V ceramic capacitors (0805) Murata GRM21BR72A103KA01L 22pF ±5%, 10V ceramic capacitors (0805) Murata GRM2195C2A220JZ01D 4.7μF ±10%, 10V ceramic capacitors (0805) Murata GRM219R61A475KE19D 10μF ±10%, 10V capacitors (0805) Murata GRM21BR61A106KE19L Empty capacitor footprint (0805) 1μF ±10%, 10V ceramic capacitors (0805) Murata GRM21BR71C105KA01L Green surface-mount LEDs Lumex SML-LX0805SUGC-TR Red surface-mount LED Lumex SML-LX0805SIC-TR
BIT 6 COM2 1F 1J 2F 2J 3F 3J 4F 4J 5F 5J 6F 6J 7F 7J 8F 8J

255H;中文规格书,Datasheet资料

NoH VDC VDC min-1 W °C °C m3/h B dB(A) 5 4.5 .. 5.5 12000 0.6 -10 55 4.5 4.4 23
Nominal voltage Nominal voltage range Speed Power input Min. ambient temperature Max. ambient temperature Air flow Sound power level Sound pressure level
255 H
DC axial compact fan
ebm-papst St. Georgen GmbH & Co. KG Hermann-Papst-Straße 1 D-78112 St. Georgen Phone +49 7724 81-0 Fax +49 7724 81-1309 info2@
Web data sheet XI · Page 2 of 4 ebm-papst St. Georgen GmbH & Co. KG · Hermann-Papst-Straße 1 · D-78112 St. Georgen · Phone +49 7724 81-0 · Fax +49 7724 81-1309 · info2@ ·
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分销商库存信息:
EBM-PAPST 255H
/
255 H
DC axial compact fan
Charts: Air flow
(in H ² O) 0,05 0,10 0,15
Dpf S
Pa
40
30
20
10
0
0,4
0,8

National LP265 LP365 数据手册

C1995 National Semiconductor Corporation TL H 5023
RRD-B30M115 Printed in U S A
Absolute Maximum Ratings
If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications
LP265 LP365 Micropower Programmable Quad Comparator
查询LP265供应商
December 1994
LP265 LP365 Micropower Programmable Quad Comparator
General Description
The LP365 consists of four independent voltage comparators The comparators can be programmed four at the same time for various supply currents input currents response times and output current drives This is accomplished by connecting a single resistor between the VCC and ISET pins
VDC to 36 VDC or g2 0 VDC to g18 VDC)
Y Low supply current drain (10 mA) and low power

LM2576-ADJ

5. ON/OFF
TV SUFFIX
1
PLASTIC PACKAGE
CASE 314B
5
Heatsink surface connected to Pin 3.
D2T SUFFIX PLASTIC PACKAGE
CASE 936A (D2PAK)
1 5
Heatsink surface (shown as terminal 6 in case outline drawing) is connected to Pin 3.
The LM2576 features include a guaranteed ±4% tolerance on output voltage within specified input voltages and output load conditions, and ±10% on the oscillator frequency (±2% over 0°C to 125°C). External shutdown is included, featuring 80 µA (typical) standby current. The output switch includes cycle–by–cycle current limiting, as well as thermal shutdown for full protection under fault conditions.
+Vin 1
4 Feedback
3.1 V Internal Regulator
ON/OFF
R2 Fixed Gain Error Amplifier Comparator
R1 1.0 k Freq

M25P16

Micron M25P16 Serial Flash Embedded Memory16 Mb, 3VFeatures•SPI bus compatible serial interface•16Mb Flash memory•75 MHz clock frequency (maximum)•2.7V to 3.6V single supply voltage•Page program (up to 256 bytes) in 0.64ms (TYP)•Erase capability–Sector erase: 512Kb in 0.6 s (TYP)–Bulk erase: 16Mb in 13 s (TYP)•Write protection–Hardware write protection: protected area size defined by non-volatile bits BP0, BP1, BP2•Deep power down: 1µA (TYP)•Electronic signature–JEDEC standard 2-byte signature (2015h)–Unique ID code (UID) and 16 bytes of read-only data, available upon customer request–RES command, one-byte signature (14h) for backward compatibility•More than 100,000 write cycles per sector•More than 20 years data retention•Automotive grade parts available•Packages (RoHS compliant)–SO8N (MN) 150 mils–SO8W (MW) 208 mils–SO16 (MF) 300 mils–VFDFPN8 (MP) MLP8 6mm x 5mm–VFDFPN8 (ME) MLP8 8mm x 6mm–UFDFPN8 (MC) MLP8 4mm x 3mmContentsFunctional Description (6)Signal Descriptions (8)SPI Modes (9)Operating Features (11)Page Programming (11)Sector Erase, Bulk Erase (11)Polling during a Write, Program, or Erase Cycle (11)Active Power, Standby Power, and Deep Power-Down (11)Status Register (12)Data Protection by Protocol (12)Software Data Protection (12)Hardware Data Protection (12)Hold Condition (13)Configuration and Memory Map (14)Memory Configuration and Block Diagram (14)Memory Map – 16Mb Density (15)Command Set Overview (16)WRITE ENABLE (18)WRITE DISABLE (19)READ IDENTIFICATION (20)READ STATUS REGISTER (21)WIP Bit (22)WEL Bit (22)Block Protect Bits (22)SRWD Bit (22)SRWD Bit (22)WRITE STATUS REGISTER (23)READ DATA BYTES (25)READ DATA BYTES at HIGHER SPEED (26)PAGE PROGRAM (27)SECTOR ERASE (28)BULK ERASE (29)DEEP POWER-DOWN (30)RELEASE from DEEP POWER-DOWN (31)READ ELECTRONIC SIGNATURE (32)Power-Up/Down and Supply Line Decoupling (33)Power-Up Timing and Write Inhibit Voltage Threshold Specifications (35)Maximum Ratings and Operating Conditions (36)Electrical Characteristics (37)AC Characteristics (38)Package Information (44)Device Ordering Information (50)Standard Parts (50)Automotive Parts (51)Revision History (53)Rev. H – 1/14 (53)Rev. G – 1/13 (53)Rev. F – 10/12 (53)Rev. E – 8/12 (53)Rev. D – 05/12 (53)Rev. C – 3/12 (53)Rev. B – 3/12 (53)Rev. A – 09/2011 (53)List of FiguresFigure 1: Logic Diagram (6)Figure 2: Pin Connections: SO8, VFQFPN , VDFPN (7)Figure 3: Pin Connections: SO16 (7)Figure 4: SPI Modes Supported (9)Figure 5: Bus Master and Memory Devices on the SPI Bus (10)Figure 6: Hold Condition Activation (13)Figure 7: Block Diagram (14)Figure 8: WRITE ENABLE Command Sequence (18)Figure 9: WRITE DISABLE Command Sequence (19)Figure 10: READ IDENTIFICATION Command Sequence (20)Figure 11: READ STATUS REGISTER Command Sequence (21)Figure 12: Status Register Format (21)Figure 13: WRITE STATUS REGISTER Command Sequence (23)Figure 14: READ DATA BYTES Command Sequence (25)Figure 15: READ DATA BYTES at HIGHER SPEED Command Sequence (26)Figure 16: PAGE PROGRAM Command Sequence (27)Figure 17: SECTOR ERASE Command Sequence (28)Figure 18: BULK ERASE Command Sequence (29)Figure 19: DEEP POWER-DOWN Command Sequence (30)Figure 20: RELEASE from DEEP POWER-DOWN Command Sequence (31)Figure 21: READ ELECTRONIC SIGNATURE Command Sequence (32)Figure 22: Power-Up Timing (34)Figure 23: AC Measurement I/O Waveform (38)Figure 24: Serial Input Timing (42)Figure 25: Write Protect Setup and Hold during WRSR when SRWD=1 Timing (42)Figure 26: Hold Timing (43)Figure 27: Output Timing (43)Figure 28: SO8N 150 mils Body Width (44)Figure 29: SO8W 208 mils Body Width (45)Figure 30: SO16W 300 mils Body Width (46)Figure 31: VFDFPN8 (MLP8) 6mm x 5mm (47)Figure 32: VFDFPN8 (MLP8) 8mm x 6mm (48)Figure 33: UFDFPN8 (MLP8) 4mm x 3mm (49)List of TablesTable 1: Signal Names (6)Table 2: Signal Descriptions (8)Table 3: Protected Area Sizes (12)Table 4: Sectors 31:0 (15)Table 5: Command Set Codes (17)Table 6: READ IDENTIFICATION Data Out Sequence (20)Table 7: Status Register Protection Modes (24)Table 8: Power-Up Timing and V WI Threshold (35)Table 9: Absolute Maximum Ratings (36)Table 10: Operating Conditions (36)Table 11: Data Retention and Endurance (36)Table 12: DC Current Specifications (37)Table 13: DC Voltage Specifications (37)Table 14: AC Measurement Conditions (38)Table 15: Capacitance (38)Table 16: AC Specifications (25 MHz, Device Grade 3, V CC[min]=2.7V) (38)Table 17: Instruction Times (25 MHz, Device Grade 3, V CC[min]=2.7V) (39)Table 18: AC Specifications (75 MHz, Device Grade 3 and 6, V CC[min]=2.7V) (40)Table 19: Instruction Times (75 MHz, Device Grade 3 and 6, V CC[min]=2.7V) (41)Table 20: Part Number Example (50)Table 21: Part Number Information Scheme (50)Table 22: Part Number Example (51)Table 23: Part Number Information Scheme (51)Functional DescriptionThe M25P16 is an 16Mb (2Mb x 8) serial Flash memory device with advanced write pro-tection mechanisms accessed by a high speed SPI-compatible bus. The device supports high-performance commands for clock frequency up to 75MHz.The memory can be programmed 1 to 256 bytes at a time using the PAGE PROGRAM command. It is organized as 32 sectors, each containing 256 pages. Each page is 256bytes wide. Memory can be viewed either as 8,192 pages or as 2,097,152 bytes. The en-tire memory can be erased using the BULK ERASE command, or it can be erased one sector at a time using the SECTOR ERASE command.This datasheet details the functionality of the M25P16 device based on 110nm process.Figure 1: Logic DiagramS#V CCHOLD#V SSDQ1C DQ0W#Table 1: Signal NamesFigure 2: Pin Connections: SO8, VFQFPN , VDFPN1234V CC HOLD#5678DQ1V SSS#DQ0C W#Note:1.There is an exposed central pad on the underside of the MLP8 package that is pulled in-ternally to V SS , and must not be connected to any other voltage or signal line on the PCB. The Package Mechanical section provides information on package dimensions and how to identify pin 1.Figure 3: Pin Connections: SO16123416151413V CC HOLD#DNU DNU DNU DNU DNU DNU DNU DNU 56781211109DQ1V SS S#DQ0C W#/V PPNotes:1.DU = Don't Use2.The Package Mechanical section provides information on package dimensions and howto identify pin 1.Signal Descriptions Table 2: Signal DescriptionsSPI ModesThese devices can be driven by a microcontroller with its serial peripheral interface (SPI) running in either of the following two SPI modes:•CPOL=0, CPHA=0•CPOL=1, CPHA=1For these two modes, input data is latched in on the rising edge of serial clock (C), and output data is available from the falling edge of C.The difference between the two modes is the clock polarity when the bus master is in STANDBY mode and not transferring data:•C remains at 0 for (CPOL=0, CPHA=0)•C remains at 1 for (CPOL=1, CPHA=1)Figure 4: SPI Modes SupportedCMSBCPHADQ001CPOL01DQ1CMSBBecause only one device is selected at a time, only one device drives the serial data out-put (DQ1) line at a time, while the other devices are HIGH-Z. An example of three devi-ces connected to an MCU on an SPI bus is shown here.Figure 5: Bus Master and Memory Devices on the SPI BusSSNotes: 1.WRITE PROTECT (W#) and HOLD# should be driven HIGH or LOW as appropriate.2.Resistors (R) ensure that the memory device is not selected if the bus master leaves theS# line HIGH-Z.3.The bus master may enter a state where all I/O are HIGH-Z at the same time; for exam-ple, when the bus master is reset. Therefore, C must be connected to an external pull-down resistor so that when all I/O are HIGH-Z, S# is pulled HIGH while C is pulled LOW.This ensures that S# and C do not go HIGH at the same time and that the t SHCH require-ment is met.4.The typical value of R is 100 kΩ, assuming that the time constant R × C p (C p = parasiticcapacitance of the bus line) is shorter than the time during which the bus master leavesthe SPI bus HIGH-Z.5.Example: Given that C p = 50 pF (R × C p= 5μs), the application must ensure that the busmaster never leaves the SPI bus HIGH-Z for a time period shorter than 5μs.Operating FeaturesPage ProgrammingTo program one data byte, two commands are required: WRITE ENABLE, which is onebyte, and a PAGE PROGRAM sequence, which is four bytes plus data. This is followed bythe internal PROGRAM cycle of duration t PP. To spread this overhead, the PAGE PRO-GRAM command allows up to 256 bytes to be programmed at a time (changing bitsfrom 1 to 0), provided they lie in consecutive addresses on the same page of memory. Tooptimize timings, it is recommended to use the PAGE PROGRAM command to programall consecutive targeted bytes in a single sequence than to use several PAGE PROGRAMsequences with each containing only a few bytes.Sector Erase, Bulk EraseThe PAGE PROGRAM command allows bits to be reset from 1 to 0. Before this can beapplied, the bytes of memory need to have been erased to all 1s (FFh). This can be ach-ieved a sector at a time using the SECTOR ERASE command, or throughout the entirememory using the BULK ERASE command. This starts an internal ERASE cycle of dura-tion t SE or t BE. The ERASE command must be preceded by a WRITE ENABLE command. Polling during a Write, Program, or Erase CycleAn improvement in the time to complete the following commands can be achieved bynot waiting for the worst case delay (t W, t PP, t SE, or t BE).•WRITE STATUS REGISTER•PROGRAM•ERASE (SECTOR ERASE, BULK ERASE)The write in progress (WIP) bit is provided in the status register so that the applicationprogram can monitor this bit in the status register, polling it to establish when the pre-vious WRITE cycle, PROGRAM cycle, or ERASE cycle is complete.Active Power, Standby Power, and Deep Power-DownWhen chip select (S#) is LOW, the device is selected, and in the ACTIVE POWER mode.When S# is HIGH, the device is deselected, but could remain in the ACTIVE POWERmode until all internal cycles have completed (PROGRAM, ERASE, WRITE STATUSREGISTER). The device then goes in to the STANDBY POWER mode. The device con-sumption drops to I CC1.The DEEP POWER-DOWN mode is entered when the DEEP POWER-DOWN commandis executed. The device consumption drops further to I CC2. The device remains in thismode until the RELEASE FROM DEEP POWER-DOWN command is executed. While inthe DEEP POWER-DOWN mode, the device ignores all WRITE, PROGRAM, and ERASEcommands. This provides an extra software protection mechanism when the device isnot in active use, by protecting the device from inadvertent WRITE, PROGRAM, orERASE operations. For further information, see the DEEP POWER DOWN command.Status RegisterThe status register contains a number of status and control bits that can be read or set(as appropriate) by specific commands. For a detailed description of the status registerbits, see READ STATUS REGISTER (page 21).Data Protection by ProtocolNon-volatile memory is used in environments that can include excessive noise. The fol-lowing capabilities help protect data in these noisy environments.Power on reset and an internal timer (t PUW) can provide protection against inadvertentchanges while the power supply is outside the operating specification.PROGRAM, ERASE, and WRITE STATUS REGISTER commands are checked before theyare accepted for execution to ensure they consist of a number of clock pulses that is amultiple of eight.All commands that modify data must be preceded by a WRITE ENABLE command to setthe write enable latch (WEL) bit.In addition to the low power consumption feature, the DEEP POWER-DOWN mode of-fers extra software protection since all PROGRAM, and ERASE commands are ignoredwhen the device is in this mode.Software Data ProtectionMemory can be configured as read-only using the block protect bits (BP2, BP1, BP0) asshown in the Protected Area Sizes table.Hardware Data ProtectionHardware data protection is implemented using the write protect signal applied on theW# pin. This freezes the status register in a read-only mode. In this mode, the block pro-tect (BP) bits and the status register write disable bit (SRWD) are protected.Table 3: Protected Area SizesNote: 1.0 0 0 = unprotected area (sectors): The device is ready to accept a BULK ERASE commandonly if all block protect bits (BP2, BP1, BP0) are 0.Hold ConditionThe HOLD# signal is used to pause any serial communications with the device withoutresetting the clocking sequence. However, taking this signal LOW does not terminateany WRITE STATUS REGISTER, PROGRAM, or ERASE cycle that is currently in progress.To enter the hold condition, the device must be selected, with S# LOW. The hold condi-tion starts on the falling edge of the HOLD# signal, if this coincides with serial clock (C)being LOW. The hold condition ends on the rising edge of the HOLD# signal, if this co-incides with C being LOW. If the falling edge does not coincide with C being LOW, thehold condition starts after C next goes LOW. Similarly, if the rising edge does not coin-cide with C being LOW, the hold condition ends after C next goes LOW.During the hold condition, DQ1 is HIGH impedance while DQ0 and C are Don’t Care.Typically, the device remains selected with S# driven LOW for the duration of the holdcondition. This ensures that the state of the internal logic remains unchanged from themoment of entering the hold condition. If S# goes HIGH while the device is in the holdcondition, the internal logic of the device is reset. To restart communication with thedevice, it is necessary to drive HOLD# HIGH, and then to drive S# LOW. This preventsthe device from going back to the hold condition.Figure 6: Hold Condition ActivationHOLD#CHOLD condition (standard use)HOLD condition (nonstandard use)Configuration and Memory MapMemory Configuration and Block DiagramEach page of memory can be individually programmed; bits are programmed from 1 to 0. The device is sector or bulk-erasable, but not page-erasable; bits are erased from 0 to 1. The memory is configured as follows:•2, 097,152 bytes (8 bits each)•32 sectors (512Kb, 65KB each)•8,192 pages (256 bytes each)Figure 7: Block DiagramHOLD#S#W#CDQ0DQ1Micron M25P16 Serial Flash Embedded MemoryConfiguration and Memory MapMemory Map – 16Mb DensityTable 4: Sectors 31:0Micron M25P16 Serial Flash Embedded MemoryMemory Map – 16Mb DensityCommand Set OverviewAll commands, addresses, and data are shifted in and out of the device, most significantbit first.Serial data inputs DQ0 and DQ1 are sampled on the first rising edge of serial clock (C)after chip select (S#) is driven LOW. Then, the one-byte command code must be shiftedin to the device, most significant bit first, on DQ0 and DQ1, each bit being latched onthe rising edges of C.Every command sequence starts with a one-byte command code. Depending on thecommand, this command code might be followed by address or data bytes, by addressand data bytes, or by neither address or data bytes. For the following commands, theshifted-in command sequence is followed by a data-out sequence. S# can be drivenHIGH after any bit of the data-out sequence is being shifted out.•READ DATA BYTES (READ)•READ DATA BYTES at HIGHER SPEED•READ STATUS REGISTER•READ IDENTIFICATION•RELEASE from DEEP POWER-DOWNFor the following commands, S# must be driven HIGH exactly at a byte boundary. Thatis, after an exact multiple of eight clock pulses following S# being driven LOW, S# mustbe driven HIGH. Otherwise, the command is rejected and not executed.•PAGE PROGRAM•SECTOR ERASE•BULK ERASE•WRITE STATUS REGISTER•WRITE ENABLE•WRITE DISABLEAll attempts to access the memory array are ignored during a WRITE STATUS REGISTERcommand cycle, a PROGRAM command cycle, or an ERASE command cycle. In addi-tion, the internal cycle for each of these commands continues unaffected.Table 5: Command Set CodesWRITE ENABLEThe WRITE ENABLE command sets the write enable latch (WEL) bit.The WEL bit must be set before execution of every PROGRAM, ERASE, and WRITE com-mand.The WRITE ENABLE command is entered by driving chip select (S#) LOW, sending the command code, and then driving S# HIGH.Figure 8: WRITE ENABLE Command SequenceDon’t CareDQ[0]C DQ1S#WRITE DISABLEThe WRITE DISABLE command resets the write enable latch (WEL) bit.The WRITE DISABLE command is entered by driving chip select (S#) LOW, sending the command code, and then driving S# HIGH.The WEL bit is reset under the following conditions:•Power-up•Completion of any ERASE operation •Completion of any PROGRAM operation•Completion of any WRITE REGISTER operation •Completion of WRITE DISABLE operationFigure 9: WRITE DISABLE Command SequenceDon’t CareDQ[0]C DQ1S#READ IDENTIFICATIONThe READ IDENTIFICATION command reads the following device identification data:•Manufacturer identification (1 byte): This is assigned by JEDEC.•Device identification (2 bytes): This is assigned by device manufacturer; the first byte indicates memory type and the second byte indicates device memory capacity.•A Unique ID code (UID) (17 bytes,16 available upon customer request): The first byte contains length of data to follow; the remaining 16 bytes contain optional Customized Factory Data (CFD) content.Table 6: READ IDENTIFICATION Data Out SequenceNote:1.The CFD bytes are read-only and can be programmed with customer data upon demand.If customers do not make requests, the devices are shipped with all the CFD bytes pro-grammed to zero.A READ IDENTIFICATION command is not decoded while an ERASE or PROGRAM cy-cle is in progress and has no effect on a cycle in progress. The READ IDENTIFICATION command must not be issued while the device is in DEEP POWER-DOWN mode.The device is first selected by driving S# LOW. Then the 8-bit command code is shifted in and content is shifted out on DQ1 as follows: the 24-bit device identification that is stored in the memory, the 8-bit CFD length, followed by 16 bytes of CFD content. Each bit is shifted out during the falling edge of serial clock (C).The READ IDENTIFICATION command is terminated by driving S# HIGH at any time during data output. When S# is driven HIGH, the device is put in the STANDBY POWER mode and waits to be selected so that it can receive, decode, and execute commands.Figure 10: READ IDENTIFICATION Command SequenceidentificationidentificationDQ1MSBMSBCDQ0MSBDon’t CareREAD STATUS REGISTERThe READ STATUS REGISTER command allows the status register to be read. The status register may be read at any time, even while a PROGRAM, ERASE, or WRITE STATUS REGISTER cycle is in progress. When one of these cycles is in progress, it is recommen-ded to check the write in progress (WIP) bit before sending a new command to the de-vice. It is also possible to read the status register continuously.Figure 11: READ STATUS REGISTER Command SequenceDQ1CDQ0Don’t Care Figure 12: Status Register Formatb7SRWD 00BP2BP1BP0WEL WIP b0status register write protectblock protect bitswrite enable latch bitwrite in progress bitWIP BitThe write in progress (WIP) bit indicates whether the memory is busy with a WRITESTATUS REGISTER cycle, a PROGRAM cycle, or an ERASE cycle. When the WIP bit is setto 1, a cycle is in progress; when the WIP bit is set to 0, a cycle is not in progress.WEL BitThe write enable latch (WEL) bit indicates the status of the internal write enable latch.When the WEL bit is set to 1, the internal write enable latch is set; when the WEL bit isset to 0, the internal write enable latch is reset and no WRITE STATUS REGISTER, PRO-GRAM, or ERASE command is accepted.Block Protect BitsThe block protect bits are non-volatile. They define the size of the area to be softwareprotected against PROGRAM and ERASE commands. The block protect bits are writtenwith the WRITE STATUS REGISTER command.When one or more of the block protect bits is set to 1, the relevant memory area, as de-fined in the Protected Area Sizes table, becomes protected against PAGE PROGRAM andSECTOR ERASE commands. The block protect bits can be written provided that theHARDWARE PROTECTED mode has not been set. The BULK ERASE command is execu-ted only if all block protect bits are 0.SRWD BitThe status register write disable (SRWD) bit is operated in conjunction with the writeprotect (W#) signal. When the SRWD bit is set to 1 and W# is driven LOW, the device isput in the hardware protected mode. In the hardware protected mode, the non-volatilebits of the status register (SRWD, and the block protect bits) become read-only bits andthe WRITE STATUS REGISTER command is no longer accepted for execution. SRWD BitThe status register write disable (SRWD) bit is operated in conjunction with the writeprotect (W#/V PP) signal. When the SRWD bit is set to 1 and W#/V PP is driven LOW, thedevice is put in the hardware protected mode. In the hardware protected mode, thenon-volatile bits of the status register (SRWD, and the block protect bits) become read-only bits and the WRITE STATUS REGISTER command is no longer accepted for execu-tion.WRITE STATUS REGISTERThe WRITE STATUS REGISTER command allows new values to be written to the statusregister. Before the WRITE STATUS REGISTER command can be accepted, a WRITE EN-ABLE command must have been executed previously. After the WRITE ENABLE com-mand has been decoded and executed, the device sets the write enable latch (WEL) bit.The WRITE STATUS REGISTER command is entered by driving chip select (S#) LOW,followed by the command code and the data byte on serial data input (DQ0). TheWRITE STATUS REGISTER command has no effect on b6, b5, b4, b1, and b0 of the sta-tus register. The status register b6 b5, and b4 are always read as ‘0’. S# must be drivenHIGH after the eighth bit of the data byte has been latched in. If not, the WRITE STATUSREGISTER command is not executed.Figure 13: WRITE STATUS REGISTER Command SequenceCDQ0As soon as S# is driven HIGH, the self-timed WRITE STATUS REGISTER cycle is initi-ated; its duration is t W. While the WRITE STATUS REGISTER cycle is in progress, the sta-tus register may still be read to check the value of the write in progress (WIP) bit. TheWIP bit is 1 during the self-timed WRITE STATUS REGISTER cycle, and is 0 when thecycle is completed. Also, when the cycle is completed, the WEL bit is reset.The WRITE STATUS REGISTER command allows the user to change the values of theblock protect bits (BP2, BP1, BP0). Setting these bit values defines the size of the areathat is to be treated as read-only, as defined in the Protected Area Sizes table.The WRITE STATUS REGISTER command also allows the user to set and reset the statusregister write disable (SRWD) bit in accordance with the write protect (W#/V PP) signal.The SRWD bit and the W#/V PP signal allow the device to be put in the HARDWARE PRO-TECED (HPM) mode. The WRITE STATUS REGISTER command is not executed oncethe HPM is entered. The options for enabling the status register protection modes aresummarized here.Table 7: Status Register Protection ModesNotes: 1.Software protection: status register is writable (SRWD, BP2, BP1, and BP0 bit values canbe changed) if the WRITE ENABLE command has set the WEL bit.2.PAGE PROGRAM, SECTOR ERASE, AND BULK ERASE commands are not accepted.3.PAGE PROGRAM and SECTOR ERASE commands can be accepted.4.Hardware protection: status register is not writable (SRWD, BP2, BP1, and BP0 bit valuescannot be changed).5.PAGE PROGRAM, SECTOR ERASE, AND BULK ERASE commands are not accepted.When the SRWD bit of the status register is 0 (its initial delivery state), it is possible towrite to the status register provided that the WEL bit has been set previously by a WRITEENABLE command, regardless of whether the W#/V PP signal is driven HIGH or LOW.When the status register SRWD bit is set to 1, two cases need to be considered depend-ing on the state of the W#/V PP signal:•If the W#/V PP signal is driven HIGH, it is possible to write to the status register provi-ded that the WEL bit has been set previously by a WRITE ENABLE command.•If the W#/V PP signal is driven LOW, it is not possible to write to the status register evenif the WEL bit has been set previously by a WRITE ENABLE command. Therefore, at-tempts to write to the status register are rejected, and are not accepted for execution.The result is that all the data bytes in the memory area that have been put in SPM bythe status register block protect bits (BP2, BP1, BP0) are also hardware protectedagainst data modification.Regardless of the order of the two events, the HPM can be entered in either of the fol-lowing ways:•Setting the status register SRWD bit after driving the W#/V PP signal LOW•Driving the W#/V PP signal LOW after setting the status register SRWD bit.The only way to exit the HPM is to pull the W#/V PP signal HIGH. If the W#/V PP signal ispermanently tied HIGH, the HPM can never be activated. In this case, only the SPM isavailable, using the status register block protect bits (BP2, BP1, BP0).READ DATA BYTESThe device is first selected by driving chip select (S#) LOW. The command code for READ DATA BYTES is followed by a 3-byte address (A23-A0), each bit being latched-in during the rising edge of serial clock (C). Then the memory contents at that address is shifted out on serial data output (DQ1), each bit being shifted out at a maximum fre-quency f R during the falling edge of C.The first byte addressed can be at any location. The address is automatically incremen-ted to the next higher address after each byte of data is shifted out. Therefore, the entire memory can be read with a single READ DATA BYTES command. When the highest ad-dress is reached, the address counter rolls over to 000000h, allowing the read sequence to be continued indefinitely.The READ DATA BYTES command is terminated by driving S# HIGH. S# can be driven HIGH at any time during data output. Any READ DATA BYTES command issued while an ERASE, PROGRAM, or WRITE cycle is in progress is rejected without any effect on the cycle that is in progress.Figure 14: READ DATA BYTES Command SequenceDon’t CareDQ[0]CDQ1Note: 1.Cx = 7 + (A[MAX] + 1).READ DATA BYTES at HIGHER SPEEDThe device is first selected by driving chip select (S#) LOW. The command code for the READ DATA BYTES at HIGHER SPEED command is followed by a 3-byte address (A23-A0) and a dummy byte, each bit being latched-in during the rising edge of serial clock(C). Then the memory contents at that address are shifted out on serial data output (DQ1) at a maximum frequency f C , during the falling edge of C.The first byte addressed can be at any location. The address is automatically incremen-ted to the next higher address after each byte of data is shifted out. Therefore, the entire memory can be read with a single READ DATA BYTES at HIGHER SPEED command.When the highest address is reached, the address counter rolls over to 000000h, allow-ing the read sequence to be continued indefinitely.The READ DATA BYTES at HIGHER SPEED command is terminated by driving S# HIGH.S# can be driven HIGH at any time during data output. Any READ DATA BYTES at HIGHER SPEED command issued while an ERASE, PROGRAM, or WRITE cycle is in progress is rejected without any effect on the cycle that is in progress.Figure 15: READ DATA BYTES at HIGHER SPEED Command SequenceCDQ0DQ1Don’t Care Note: 1.Cx = 7 + (A[MAX] + 1).。

HA9P2556-9_datasheet

Functional Block Diagram
VX+ + VXHA-2556 VOUT A X
-Leabharlann PinoutHA-2556 (PDIP, CERDIP, SOIC) TOP VIEW
GND 1 REF VREF 2 VYIOB 3 VYIOA 4 VY+ 5 VY - 6 V- 7 VOUT 8
Σ Y X
Features
• High Speed Voltage Output . . . . . . . . . . . . . . . . . 450V/µs • Low Multiplication Error . . . . . . . . . . . . . . . . . . . . . . .1.5% • Input Bias Currents. . . . . . . . . . . . . . . . . . . . . . . . . . . 8µA • 5MHz Feedthrough. . . . . . . . . . . . . . . . . . . . . . . . . . -50dB • Wide Y Channel Bandwidth . . . . . . . . . . . . . . . . . . 57MHz • Wide X Channel Bandwidth . . . . . . . . . . . . . . . . . . 52MHz • VY 0.1dB Gain Flatness . . . . . . . . . . . . . . . . . . . . 5.0MHz
Ordering Information
PART NUMBER HA3-2556-9 HA9P2556-9 HA1-2556-9 TEMP. RANGE (oC) -40 to 85 -40 to 85 -40 to 85 PACKAGE 16 Ld PDIP 16 Ld SOIC 16 Ld CERDIP PKG. NO. E16.3 M16.3 F16.3

LV5256GP资料

Functions
• Built-in Pch gate drive power supply • Output short-circuit detection by monitoring the input side of the error amplifier • OCP timer function • Software start function • Support for tracking function • Built-in thermal protection circuit • Built-in UVLO • ON/OFF function: Off-time input current smaller than 1µA • Oscillation frequency : 300kHz to 1.5MHz Oscillation frequency can be set by an external resistor
Specifications
Parameter Maximum input voltage
Maximum Ratings at Ta = 25°C
Symbol VIN max VDD max Maximum output voltage Maximum output current Allowable input pin voltage Allowable power dissipation Operating temperature Storage temperature VO max IO max VCONT max Pd max Topr Tstg Between OUT and SW RT, FB, IN, OCP, SS, ONOFF, TRAC_IN, DU_SEL, OPC_SEL pins Mounted on a specified board * 0.8 -20 to +85 -40 to +125 W °C °C Conditions Ratings 12 3.6 16 650 VDD Unit V V V mA V

TPS2556EVM-423 and TPS2557EVM-423 User's Guide

Using the TPS2556EVM-423and TPS2557EVM-423User's GuideLiterature Number:SLUU393November2009User's GuideSLUU393–November2009 Using the TPS2556EVM-423and TPS2557EVM-423 This user’s guide describes the TPS2556EVM-423and TPS2557EVM-423evaluation modules(EVM).This guide contains the EVM schematic,list of materials,assembly drawing,and top and bottom board layouts.1IntroductionThe TPS2556EVM-423and TPS2557EVM-423are evaluation modules(EVM)for Texas Instruments’power-distribution switches with adjustable current-limit.These EVMs operate over a2.5-V to6.5-V range.An on-board jumper sets the output current-limit to either0.5A or1A.The board is designed for the5-A capability of the TPS2556or TPS2557.Test points provide convenient access to all critical node voltages. 2DescriptionThe PCB top-side accepts a power-distribution switch in a SON-8(DRB)package with a thermal pad.These switches have an enable input,an over-current status output,and over-temperature shutdown.The switches operate in current limit mode only.TPS2556EVM-423is enabled active lo.TPS2557is enabled active hi.2.1SwitchesTable1.SwitchesENABLE SWITCH POSITIONTPS2556LOTPS2557HI2Using the TPS2556EVM-423and TPS2557EVM-423SLUU393–November2009Submit Documentation FeedbackCopyright©2009,Texas Instruments Incorporated Description 2.2JumpersTable2.JumpersCURRENT J20.1A ON1.0A OFF2.3Test PointsTable3.Test PointsTEST POINT PINTP1VINTP1ENTP3FLTTP4ILIMTP5VOUTTP6GNDTP7GNDTP8GNDTP9GND3 SLUU393–November2009Using the TPS2556EVM-423and TPS2557EVM-423 Submit Documentation FeedbackCopyright©2009,Texas Instruments IncorporatedSchematic 3SchematicFigure1.Schematic4Using the TPS2556EVM-423and TPS2557EVM-423SLUU393–November2009Submit Documentation FeedbackCopyright©2009,Texas Instruments Incorporated Getting Started 4Getting StartedPreset the power supply to5V and turn off.Connect the power supply output to the input terminals of the HPA423.Slide S1to disable the TPS2556or TPS2557.Turn on the power supply to apply5.0V to the EVMinput-power terminals.VOUT should be0V.Slide S1to enable the device.For TPS2556,set S1to LO;for TPS2557,set S1to HI.VOUT should be VIN+/-0.3V.Set the oscilloscope to auto trigger mode and the horizontal-sweep to4ms/div.Set all vertical channels for2V/div except the current probe set for200mA/div4.1Monitor1.Input voltage at TP12.Output voltage at TP53.EVM input current4.FAULT#status voltage at test point TP34.2Verify EVM Output1.Set the scope for normal trigger,single sweep.Trigger on VOUT,negative slope at about a3.5-V level.2.Momentarily short the output connector.A sample scope trace is shown in.Observe VOUT drops to0V3.Input current rises to an amplitude of400mA+/-50mA,within0to4ms after VOUT low.4.FAULT signal is low2ms to20ms after VOUT low.5Performace Data and Characteristics CurvesFigure2.100-kΩREnabled Into a Short CircuitILIM5 SLUU393–November2009Using the TPS2556EVM-423and TPS2557EVM-423 Submit Documentation FeedbackCopyright©2009,Texas Instruments IncorporatedEVM Assembly Drawing and PCB Layout 6EVM Assembly Drawing and PCB LayoutFigure3.Top Layer Assembly(top view)Figure4.Top Copper(top view)6Using the TPS2556EVM-423and TPS2557EVM-423SLUU393–November2009Submit Documentation FeedbackCopyright©2009,Texas Instruments Incorporated EVM Assembly Drawing and PCB LayoutFigure5.Bottom Copper(top view)7 SLUU393–November2009Using the TPS2556EVM-423and TPS2557EVM-423 Submit Documentation FeedbackCopyright©2009,Texas Instruments IncorporatedList of Materials 7List of MaterialsTable4.List of Materials-002-001REF DES DESCRIPTION PART NUMBER MFR11C1Capacitor,ceramic,X7R,10V,10%,10µF,1206STD STD22C2,C3Capacitor,ceramic,16V,X7R,10%,0.1µF,0805STD STDC4Capacitor,tantalum,10V,100mΩ,10%,150µF,B45197A2157K409KEMET 117343(D)C5Capacitor,tantalum,10V,100mΩ,10%,150µF,B45197A2157K409KEMET 007343(D)J1,J3Terminal block,2pin,6A,3.5mm,0.27inch x ED555/2DS OST 220.25inchJ2Header,male2pin,100-mil spacing,0.100inch x PEC02SAAN Sullins 112inch22R1,R2Resistor,chip,1/10W,1%,10kΩ,0805STD STD22R3Resistor,chip,1/10W,1%,24.9kΩ,0805STD STD11R4Resistor,chip,1/10W,1%,75kΩ,0805STD STDS1Switch,SPDT,slide,PC-mount,500mA,0.457EG1218E-SWITCH 11inch x0.157inchTP1,TP2,Test point,white,thru hole color keyed,0.100x5002Keystone 55TP3,TP4,0.100inchTP5TP6,TP7,Test point,SM,0.150x0.090,0.185inch x0.1355016Keystone 44TP8,TP9inch01U1Current-Limited,Power-Distribution Switches,DRB TPS2556DRB TI10U1Current-Limited,Power-Distribution Switches,DRB TPS2557DRB TI11PCB,2.25inch x2.22inch x0.062inch HPA423Any11Shunt,100mil,black,0.100929950-003M8Using the TPS2556EVM-423and TPS2557EVM-423SLUU393–November2009Submit Documentation FeedbackCopyright©2009,Texas Instruments Incorporated List of MaterialsEVALUATION BOARD/KIT IMPORTANT NOTICETexas Instruments(TI)provides the enclosed product(s)under the following conditions:This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT,DEMONSTRATION,OR EVALUATIONPURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use.Persons handling theproduct(s)must have electronics training and observe good engineering practice standards.As such,the goods being provided are not intended to be complete in terms of required design-,marketing-,and/or manufacturing-related protective considerations,including product safety and environmental measures typically found in end products that incorporate such semiconductorcomponents or circuit boards.This evaluation board/kit does not fall within the scope of the European Union directives regarding electromagnetic compatibility,restricted substances(RoHS),recycling(WEEE),FCC,CE or UL,and therefore may not meet the technical requirements of these directives or other related directives.Should this evaluation board/kit not meet the specifications indicated in the User’s Guide,the board/kit may be returned within30 days from the date of delivery for a full refund.THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BYSELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES,EXPRESSED,IMPLIED,OR STATUTORY,INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.The user assumes all responsibility and liability for proper and safe handling of the goods.Further,the user indemnifies TI from all claims arising from the handling or use of the goods.Due to the open construction of the product,it is the user’s responsibility to take any and all appropriate precautions with regard to electrostatic discharge.EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE,NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT,SPECIAL,INCIDENTAL,OR CONSEQUENTIAL DAMAGES.TI currently deals with a variety of customers for products,and therefore our arrangement with the user is not exclusive.TI assumes no liability for applications assistance,customer product design,software performance,or infringement ofpatents or services described herein.Please read the User’s Guide and,specifically,the Warnings and Restrictions notice in the User’s Guide prior to handling theproduct.This notice contains important safety information about temperatures and voltages.For additional information on TI’senvironmental and/or safety programs,please contact the TI application engineer or visit /esh.No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine,process,or combination in which such TI products or services might be or are used.FCC WarningThis evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT,DEMONSTRATION,OR EVALUATIONPURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use.It generates,uses,and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part15 of FCC rules,which are designed to provide reasonable protection against radio frequency interference.Operation of thisequipment in other environments may cause interference with radio communications,in which case the user at his own expense will be required to take whatever measures may be required to correct this interference.EVM WARNINGS AND RESTRICTIONSIt is important to operate this EVM within the input voltage range of2.5V DC to6.23V DC and the output current of5A.Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM.If there arequestions concerning the input range,please contact a TI field representative prior to connecting the input power.Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM.Please consult the EVM User's Guide prior to connecting any load to the EVM output.If there is uncertainty as to the load specification,please contact a TI field representative.During normal operation,some circuit components may have case temperatures greater than100°C.The EVM is designed tooperate properly with certain components above as long as the input and output ranges are maintained.These components include but are not limited to linear regulators,switching transistors,pass transistors,and current sense resistors.These types of devices can be identified using the EVM schematic located in the EVM User's Guide.When placing measurement probes near thesedevices during operation,please be aware that these devices may be very warm to the touch.Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2009,Texas Instruments Incorporated9 SLUU393–November2009Using the TPS2556EVM-423and TPS2557EVM-423 Submit Documentation FeedbackCopyright©2009,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDLP®Products BroadbandDSP Digital ControlClocks and Timers MedicalInterface MilitaryLogic Optical NetworkingPower Mgmt SecurityMicrocontrollers TelephonyRFID Video&ImagingRF/IF and ZigBee®Solutions WirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2009,Texas Instruments Incorporated。

XL2596降压型直流电源变换器芯片(常规型)

3A 150KHz 40V Buck DC to DC Converter XL2596Featuresn Wide 4.5V to 40V Input Voltage Range n 3.3V,5V,12V, and adjustable versions n Output Adjustable from 1.23V to 37V n Maximum Duty Cycle 100% n Minimum Drop Out 1.5Vn Fixed 150KHz Switching Frequency n 3A Constant Output Current Capability n Internal Optimize Power Transistor n High efficiencynExcellent line and load regulation n TTL shutdown capabilityn ON/OFF pin with hysteresis function n Built in thermal shutdown function n Built in current limit functionn Built in second current limit function n Available in TO-220,TO-263 packagesApplicationsn LCD Monitor and LCD TV n Digital Photo Frame n Set-up Box n ADSL ModemnTelecom / Networking EquipmentGeneral DescriptionThe XL2596 is a 150 KHz fixed frequency PWM buck (step-down) DC/DC converter, capable of driving a 3A load with high efficiency, low ripple and excellent line and load regulation. Requiring a minimum number of external components, the regulator is simple to use and include internal frequency compensation and a fixed-frequency oscillator.The PWM control circuit is able to adjust the duty ratio linearly from 0 to 100%. An enable function, an over current protection function is built inside. When second current limit function happens, the operation frequency will be reduced from 150KHz to 50KHz. An internal compensation block is built in to minimize external component count.Figure1. Package Type of XL25963A 150KHz 40V Buck DC to DC ConverterXL2596Pin ConfigurationsFigure2. Pin Configuration of XL2596 (Top View)Table 1 Pin DescriptionPin NumberPin NameDescription1 VINSupply V oltage Input Pin. XL2596 operates from a 4.5V to 40V DC voltage. Bypass Vin to GND with a suitably large capacitor to eliminate noise on the input.2 OUTPUTPower Switch Output Pin (SW). Output is the switch node thatsupplies power to the output.3GNDGround Pin. Care must be taken in layout. This pin should be placed outside of the Schottky Diode to output capacitorground path to prevent switching current spikes from inducing voltage noise into XL2596.4 FEEDBACK Feedback Pin (FB). Through an external resistor dividernetwork, Feedback senses the output voltage and regulates it.The feedback threshold voltage is 1.23V .5 ON/OFFEnable Pin. Drive ON/OFF pin low to turn on the device, driveit high to turn it off. Floating is default low.3A 150KHz 40V Buck DC to DC Converter XL2596 Function BlockFigure3. Function Block Diagram of XL2596Typical Application CircuitFigure4. XL2596 Typical Application Circuit 12V-5V/3A3A 150KHz 40V Buck DC to DC Converter XL2596Ordering InformationMarking ID PackageTemperature Range Lead Free Packing Type Supplied As XL2596T-ADJE1 Tube XL2596T-3.3E1 Tube XL2596T-5.0E1 Tube TO220-5L-40o C ~ 85o CXL2596T-12E1 TubeXL2596S-ADJE1 800 Units on Tape & Reel XL2596S-3.3E1 800 Units on Tape & Reel XL2596S-5.0E1 800 Units on Tape & Reel TO263-5L-40o C ~ 85o CXL2596S-12E1800 Units on Tape & ReelXLSEMI Pb-free products, as designated with “E1” suffix in the par number, are RoHS compliant.3A 150KHz 40V Buck DC to DC Converter XL2596Absolute Maximum Ratings（Note1）Parameter Symbol Value Unit Input Voltage Vin -0.3 to 45 V Feedback Pin Voltage V FB-0.3 to Vin VON/OFF Pin Voltage V ON/OFF-0.3 to Vin V Output Switch Pin Voltage V Output-0.3 to Vin V Power Dissipation P D Internally limited mW Thermal Resistance (TO220 & TO263)R JA30 ºC/W (Junction to Ambient, No Heatsink, Free Air)Operating Junction Temperature T J-40 to 125 ºC Storage Temperature T STG-65 to 150 ºC Lead Temperature (Soldering, 10 sec) T LEAD260 ºC ESD (HBM) 2000 V Note1: Stresses greater than those listed under Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.3A 150KHz 40V Buck DC to DC Converter XL2596 XL2596-3.3 Electrical CharacteristicsT a = 25℃;unless otherwise specified.Symbol Parameter Test Condition Min. Typ. Max. Unit System parameters test circuit figure6VOUT OutputV oltageVin = 4.75V to 40VIload=0.2A to 3A3.168 3.3 3.432 VEfficiency ŋVin=12V ,V out=3.3VIout=3A- 73 - %XL2596-5.0 Electrical CharacteristicsT a = 25℃;unless otherwise specified.Symbol Parameter Test Condition Min. Typ. Max. Unit System parameters test circuit figure7VOUT OutputV oltageVin = 7V to 40VIload=0.2A to 3A4.8 55.2 VEfficiency ŋVin=12V ,V out=5VIout=3A- 80 - %XL2596-12 Electrical CharacteristicsT a = 25℃;unless otherwise specified.Symbol Parameter Test Condition Min. Typ. Max. Unit System parameters test circuit figure8VOUT OutputV oltageVin = 15V to 40VIload=0.2A to 3A11.52 12 12.48 VEfficiency ŋVin=25V ,V out=12VIout=3A- 90 - %XL2596-ADJ Electrical CharacteristicsT a = 25℃;unless otherwise specified.Symbol Parameter Test Condition Min. Typ. Max. Unit System parameters test circuit figure9VOUT OutputV oltageVin = 4.5V to 40VIload=0.2A to 3A1.193 1.23 1.267 VEfficiency ŋVin=12V ,V out=3VIout=3A- 73 - %3A 150KHz 40V Buck DC to DC Converter XL2596 Electrical Characteristics (DC Parameters)Vin = 12V for the 3.3V,5V,and Adjustable versions and Vin=24V for the 12V version, GND=0V, Vin & GND parallel connect a 220uf/50V capacitor; Iout=500mA, T a = 25℃; the others floating unless otherwise specified.Parameters Symbol Test Condition Min. Typ. Max. Unit Input operation voltage Vin 4.5 40 V Shutdown Supply Current I STBY V ON/OFF=5V 80 200 uAQuiescent Supply Current I q V ON/OFF =0V,V FB =Vin2 10 mAOscillator Frequency Fosc 127 150 173 Khz Switch Current Limit I L V FB =0 3.6 4.8 6.9 AON/OFF Pin Threshold V ON/OFF High (Regulator OFF)Low (Regulator ON)1.40.8VI H V ON/OFF =2.5V (OFF) 5 15 uA ON/OFF Pin InputLeakage Current ILV ON/OFF =0.5V (ON) 0.2 5 uAOutput Saturation V oltage V CE V FB=0VI out=3A1.3 1.5 VMax. Duty Cycle D MAX V FB=0V 100 %3A 150KHz 40V Buck DC to DC Converter XL2596 Test Circuit and Layout guidelinesFigure5. Standard Test Circuits and Layout GuidesSelect R1 to be approximately 1K, use a 1% resistor for best stability.C1 and CFF are optional; in order to increase stability and reduce the input power line noise, CIN and C1 must be placed near to PIN1 and PIN3;For output voltages greater than approximately 10V, an additional capacitor CFF is required. The compensation capacitor is typically between 100 pf and 33 nf, and is wired in parallel with the output voltage setting resistor, R2. It provides additional stability for high output voltage, low input-output voltages, and/or very low ESR output capacitors, such as solid tantalum capacitors. CFF=1/(31*1000*R2); This capacitor type can be ceramic, plastic, silver mica, etc. (Because of the unstable characteristics of ceramic capacitors made with Z5U material, they are not recommended.)3A 150KHz 40V Buck DC to DC Converter XL2596XL2596 Series Buck Regulator Design Procedure (Fixed Output)Output Capacitor (COUT)ConditionsInductor (L1)Through Hole Electrolytic Surface Mount TantalumOutput V oltage (V) Load Current (A) Max Input V oltage (V) Inductance (uh) Panasonic HFQ Series (uf/V) Nichicon PL Series (uf/V) A VX TPS Series (uf/V) Sprague 595D Series (uf/V) 5 22470/25 560/16 330/6.3 390/6.3 7 22 560/35 560/35 330/6.3 390/6.3 10 22 680/35 680/35 330/6.3 390/6.3 3 40 33560/35 470/35 330/6.3 390/6.3 6 22470/25 470/35 330/6.3 390/6.3 10 33 330/35 330/35 330/6.3 390/6.3 3.3 2 40 47330/35 270/50 220/10 330/10 8 22470/25 560/16 220/10 330/10 10 22 560/25 560/25 220/10 330/10 15 33 330/35 330/35 220/10 330/10 3 40 47330/35 270/35 220/10 330/10 9 22470/25 560/16 220/10 330/10 20 68 180/35 180/35 100/10 270/10 5 2 40 68180/35 180/35 100/10 270/10 15 22470/25 470/25 100/16 180/16 18 33 330/25 330/25 100/16 180/16 30 68 180/25 180/25 100/16 120/20 3 40 68180/35 180/25 100/16 120/20 15 33330/25 330/25 100/16 180/16 20 68 180/25 180/25 100/16 120/20 12 2 40 15082/25 82/2568/20 68/253A 150KHz 40V Buck DC to DC Converter XL2596 XL2596 Series Buck Regulator Design Procedure (Adjustable Output) Through Hole Output Electrolytic Surface Mount Output CapacitorOutputV oltage (V) PanasonicHFQ Series(uf/V)NichiconPL Series(uf/V)FeedforwardCapacitorA VX TPSSeries(uf/V)Sprague595D Series(uf/V)FeedforwardCapacitor2 820/35 820/35 33nf 330/6.3 470/4 33nf 4 560/35 470/35 10nf 330/6.3 390/6.3 10nf6 470/25 470/35 3.3nf 220/10 330/10 3.3nf 9 330/25 330/25 1.5nf 100/16 180/16 1.5nf 12 330/25 330/25 1nf 100/16 180/16 1nf 15 220/25 220/35 680pf 68/20 120/20 680pf 24 220/35 150/35 560pf 33/25 33/25 220pf 28 100/50 100/50 390pf 10/35 15/50 220pfSchottky Diode Selection TableCurrent SurfaceMount ThroughHoleVR (The same as system maximum input voltage)20V 30V 40V 50V 60V1A √1N5817 1N5818 1N5819√1N5820 1N5821 1N5822√MBR320 MBR330 MBR340 MBR350 MBR360 √SK32 SK33 SK34 SK35 SK36√30WQ03 30WQ04 30WQ05√31DQ03 31DQ04 31DQ053A√SR302 SR303 SR304 SR305 SR306√1N5823 1N5824 1N5825√SR502 SR503 SR504 SR505 SR506√SB520 SB530 SB540 SB550 SB560 5A√50WQ03 50WQ04 50WQ053A 150KHz 40V Buck DC to DC Converter XL2596 Typical System Application for 3.3V VersionFigure6. XL2596-3.3 System Parameters Test CircuitTypical System Application for 5V VersionFigure7. XL2596-5.0 System Parameters Test Circuit3A 150KHz 40V Buck DC to DC Converter XL2596 Typical System Application for 12V Version3A 150KHz 40V Buck DC to DC Converter XL2596Package Information(1) TO220-5L3A 150KHz 40V Buck DC to DC Converter XL2596Package Information(2) TO263-5L。

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1.1PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TLV2556IDW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2556IDWG4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2556IDWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2556IDWRG4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2556IPW ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2556IPWG4ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2556IPWR ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2556IPWRG4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF TLV2556:•Enhanced Product:TLV2556-EPNOTE:Qualified Version Definitions:•Enhanced Product-Supports Defense,Aerospace and Medical ApplicationsTAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TLV2556IPWR TSSOPPW202000330.016.46.957.1 1.68.016.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm)TLV2556IPWR TSSOP PW202000346.0346.033.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDLP®Products BroadbandDSP Digital ControlClocks and Timers MedicalInterface MilitaryLogic Optical NetworkingPower Mgmt SecurityMicrocontrollers TelephonyRFID Video&ImagingRF/IF and ZigBee®Solutions WirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2009,Texas Instruments Incorporated。