三井 Bump wafer TAPE Datasheet
BM20系列电子连接器说明书
●Receptacle/Header
BM 20 # (**) − * DS − 0.4 V (51)
⁞
⁞ Series Name: BM Series No.: 20
Shape Symbols B: With reinforcing metal fitting JC: Connector for conductivity testing
Contact resistance Maximum of 100 mø Insulation resistance Minimum of 25 mø
Left at temperature 40±2ç, humidity 90 to 95%, 96 hours
6. Temperature Cycles 7. Durability
■Product Number Structure
Refer to this page when determining product specifications by model types. Please place orders with part numbers listed in this catalog. The characteristics and specifications of the product described in this catalog are reference values. Please make sure to check the latest delivery specifications at the time of product use.
A space saving design that keeps the connector compact, but still maintains an adequate vacuum area (no less than 0.7mm wide). Depth DS: 2.3 mm DP: 1.78 mm
AZ P4000系列正相光刻胶技术数据表说明书
Technical datasheetAPPLICATIONGeneral purpose positive tone photoresists featuring a special PAC (Photo Active Compound) engineered to prevent poisoning of plating solutions and extend plating bath life. Excellent substrate adhesion for wet etch applications.•Wide compatibility with electro -plating solu-tions•Safe solvent•Single coat thicknesses from 1.0 to >20µm •May be cured as a permanent dielectric in-* Contact your AZ product representative for more in-formation and special spin programs for ultra thick films.COMPANION PRODUCTSThinning/Edge Bead RemovalAZ ®EBR Solvent or AZ® EBR 70/30 DevelopersAZ ® 400K 1:3 or 1:4, AZ ® 421K, AZ Developer 1:1, AZ 340 RemoversAZ ® 300T, AZ ® 400T, AZ Kwik StripAZ® P4000 SeriesPositive Tone PhotoresistsTYPICAL PROCESSSoft Bake: 90-115C*Rehydrate: for films > 4.0µm thick Expose: 350-450nm sensitive Develop: Spray or immersionDeveloper type: Inorganic (IN) * Use higher soft bake temp. for best adhesion to metals. Ramped temperature may be required for thicker films.OPTICAL CONSTANTS*96µm gold bump plated in AZ P4620 Cyanide electro -plating solutionTYPICAL SPIN CURVES (150MM SUBSTRATE)Note: Thicker films will be coated by varying spin times and other dispense parameters (or via multiple coats). Single films above 7.0µm are not spun to equilibrium.TYPICAL AU PLATING RESULTS (CYANIDE PLATING SOLUTION; PH = 5.5)Resist: AZ P4620Thickness: 24µmDevelop: AZ 400K 1:3Plating Temp: 45CPlating Time: 50 min.Metal Thickness: 20µmStrip: AZ 400TREFERENCE PROCESS (12µM THICK AZ P4620 FILM)* Thicker films may require a ramped soft bake process to avoid bubble formation due to rapid outgassing ofsolvents. Contact your AZ product representative for ultra-thick coat and bake processing guidelines.EXPOSURE LATITUDE FOR 20µM LINES AZ P4620 AT FT = 12µM EXPOSURE LATITUDE FOR 40µM LINES AZ P4620 AT FT = 24µMABSORBANCE SPECTRA OF P4000 SERIES PHOTORESISTS (UNBLEACHED, NORMAL-IZED TO 1µM)PROCESSING P4000 AS A DIELECTRIC INSULATORAZ P4000 Series photoresists may be thermally cured after develop to form stable dielectric isolators. The die-lectric properties are cure temperature dependent as shown in the table below.EXAMPLE COATING SEQUENCE FOR 20+ µM THICK FILMSAZ P4000 SERIES FLUID VISCOSITIESDILL MODELLING PARAMETERSAPPROXIMATE EXPOSURE DOSE REQUIRE-MENT VS. FILM THICKNESS (SUSS MA -200)PROCESS CONSIDERATIONSSUBSTRATE PREPARATIONSubstrates must be clean, dry, and free of organic residues. Oxide forming substrates (Si, etc.) should be HMDS primed prior to coating AZ P4000. Contact your AZ product representative for detailed information on pre-treating with HMDS.COATINGFilms up to 8.0µm thick (depending upon wafer size) may be set and spun to equilibrium using the spin curve graphs as a reference. Thicker films require special coat programs using carefully timed spread and spin cycles. Contact your AZ products representative for additional information.SOFT BAKESoft bake times and temperatures may be application specific. Process optimization is recommended to ensure stable lithographic and adhesion performance. Soft bake temperatures for AZ P4000 should be in the 95-115C range. Temperatures towards the high end of this range will improve adhesion to most metals. Thick films may require gradual ramping of the soft bake temperature to prevent bubbling.FILM REHYDRATIONP4000 photoresist films thicker than 4.0µm require a rehydration hold between soft bake and exposure. Hold times are typically 30-60 minutes (depending upon film thickness) @ relative humidity 40 - 45%.EXPOSUREAZ P4000 is sensitive to exposure wavelengths between 310 and 450nm. 365-436nm is recommended.POST EXPOSE BAKEA PEB is not generally required for P4000 but may be employed to maximize process latitudes and to mitigate standing wave effects caused by monochromatic exposure. PEB temperatures and times may be application specific. As a general rule, PEB temperatures should be in the 100 to 115C range.DEVELOPINGSpray or immersion developing in AZ 400K series developers is recommended. AZ 400K 1:3 or AZ 421K (unbuffered) are recommended for resist film thicknesses above 12µm. AZ 400K 1:4 provides improved devel-oper selectivity for thinner films. AZ Developer 1:1 may be used in applications requiring zero etch rate on Alu-minum substrates.HARD BAKEHard baking (post develop bake) improves adhesion in wet etch or plating applications and improves pattern stability in dry etch processes. Hard bake temperatures should be in the 100 to 110C range to ensure minimal thermal distortion of the pattern. Higher temperatures may be used to cure the pattern (cross link the resin) for use as a permanent insulator.COMPATIBLE MATERIALSAZ P4000 Series materials are compatible with all commercially available lithography processing equipment. Compatible materials of construction include glass, quartz, PTFE, PFA, stainless steel, HDPE, polypropylene, and ceramic.Rev. (08/21)Products are warranted to meet the specifications set forth on their label/packaging and/or certificate of analysis at the time of shipment or for the expressly stated duration. MERCK MAKES NO REPRESENTATION OR WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY OR FITNESS FOR A PARTICULAR USE REGARDING OUR PRODUCTS OR ANY INFORMATION PROVIDED IN CONNECTION THEREWITH. Customer is responsible for and must independently determine suitability of Merck´s products for customer ’s products, intended use and processes, including the non -infringement of any third parties´ intellectual property rights. Merck shall not in any event be liable for incidental, consequential, indirect, exemplary or special damages of any kind resulting from any use or failure of the products: All sales are subject to Merck ’s complete Terms and Conditions of Sale. Prices are subject to change without notice. Merck reserves the right to discontinue products without prior notice.The information on our trademarks is available in the Trademarks section on . Detailed information on our trademarks is also available via publicly accessible resources. All other trademarks are the property of their respective owners. © 2021 Merck KGaA, Darmstadt, Germany and/or its affiliates.DisclaimerHANDLING/DISPOSALAZ P4000 Series materials are flammable liquids containing PGMEA (1-Methoxy -2-propanol acetate). Refer to the current version of the MSDS and to local regulations for up to date information on safe handling and proper disposal. AZ P4000 is compatible with drain lines handling similar organic solvent based materials.。
半导体用语
Siliconingot 硅锭Wafer晶片Mirror wafer 镜面晶圆Patter 晶圆片FAB：fabrication 制造Fabrication Facility 制造wafer生产工厂Probe test 探针测试Probe card 探针板Contact 连接Probe Tip 探头端部ChipFunction 功能EPM：Electrical Parameter MonitoringSummary 总结R&D：Research and Development 研究和开发MCP：Multi Chip Package 多芯片封装POP：Package on Packagee-MMC：embedded Multi Media card 嵌入式多媒体卡WLP：Wafer Level Package 晶圆级封装SDP 一层DDP 两层QDP 四层ODP 八层Pad outBack Grind 背研磨Wafer Grind Back Grind 磨片Overview 概述TPM：Total Profit Management SKTPM Operation 操作Erase 消除Key Para. ：Key parameter 关键参数Cycling 写入次数、循环次数Retention 保留时间Non-Volatile memoryVolatile memoryRead 读Write 写Refresh 更新Speed 速度、速率、转速Restore 修复、恢复Electrical Signal 电信号WFBI：Wafer Burn-InPT1H：Probe Test 1 Hot TestPT1C：Probe Test 1 Cold TestL/Rep：Laser RepairPurpose 目的Substrate 基片Trend 趋势Small Size 小体积High Density 高集成High Speed 高速度Roadmap 路标TSOP：Thin small outline package 薄型小尺寸封装FBGA：（Fine Ball Grid Array）package 细间距球栅阵列（一种封装模式）Flip Chip Package：在wafer的chip上形成bump直接在substrate或PCB基板上填充形态，使I/O最高密度化的填充方式。
110815_JCET_LCtape_evaluation
Press Roller Laminating speed ：50mm/s
yyyy/mm/dd
Confidential
Result (Pattern wafer)
Thickness Wafer with pattern Mirror wafer
90um Done with no issue Break (Auto-run)
Robot Arm
Wafer(Wapage)
Wafer Cassette
yyyy/mm/dd
yyyy/mm/dd
Confidential
Result (mirror wafer) ・Mirror wafer lamination 90um wafer was run by automatic task. (Unloading -> Aligning -> Laminating -> Separate PET film-> Loading) As a result, unloading, laminating, Separating were done with no issue, however, wafer brake during cassette loading due to wafer warp. 150um wafer has less warpage, therefore we took video on this wafer. 120um wafer are able to laminate by auto-running, however we tested by pattern wafer. (warpage level was same as 150um sample)
120um Done with no issue Done with no issue
M133131 MF0 IC U10 01 Bumped unsawn wafer on UV-tape
3.1
• The format of this data sheet has been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
MF0 IC U10 01
Bumped unsawn wafer on UV-tape
Rev. 3.1 — 20 February 2007
133131
Product data sheet
PUBLIC
1. General description
1.1 Scope
The MF0 IC U10 01 is contactless Smart Card IC designed for card IC coils following the mifare Card IC Coil Design Guide and is qualified to work properly in NXP´ reader environment, which is built according to NXP´ specification.
NXP Semiconductors
MF0 IC U10 01
Bumped unsawn wafer on UV-tape
5.3 Chip dimensions
• Chip size: • Scribe line:
0.69 x 0.69 mm 66.4 / 86.4 μm
5.4 Passivation
封装测试行业专业英语翻译
焊接压区(鋁墊/壓區) 键合区温度 劈刀 压板 铜丝 弹坑 腐球檢查 腐球試驗 鱼尾形焊接 雙叠金球 重丝 打火棒 第一焊点
flat ball
扁球
free air size(FAB)
金球大小
ball shear tool
推球刀
Golf ball
高尔夫球形
Heat block
加热块
Heat clamper
周期(生產日期)
deionized water (DI 纯水
Defect
次品/不良品
Defect Rate
次品率/不良品率
Die Bond (DB)
裝片
Die or chip dispatch sheet
芯片 派工单
dust-free paper
无尘纸
ESD (ElectroStatic 靜電放電
ESD label
托板
loading capacity of oven 烘箱容量
location pin hole
定位孔
Machine (M/C)
機器/機台
magazine
料盒
mask No. of wafer
芯片版号（光罩号）
microscope
显微镜
mixed device
混管、混料
N2 cabinet visual inspection
Epoxy bridge
黏胶桥接
Epoxy Curing
黏膠烘烤
Epoxy Curing Oven 装片胶烘烤烘箱
epoxy inspection
粘胶检查
Epoxy oscillator
黏胶搅拌器
Epoxy void
EEJA电镀金Bump制程(中国语)
精细对应 中硬度对应 形状(无外倾) 半光泽外观
MICROFAB Au1101
高速系
MICROFAB Au1151
有机添加剂
MICROFAB Au140
高速系
MICROFAB Au620
无机添加剂
MICROFAB Au640
高速系
MICROFAB Au660
Technical Div./S.Kawahara/MF-Au Process/2007.09.26
4
COG (Chip On Glass)
COG (Chip On Glass)是Flip Chip实装方法的其中之一，在玻璃 基板上进行半导体芯片实装的方法，主要使用在手机等液晶显示控 制器LSI 等方面。
Driver LSI Chip
Bump
Bump
Glass Substrate (LCD Panel)
Technical Div./S.Kawahara/MF-Au Process/2007.09.26
EEJA CONFIDENTIAL/Do not duplicate 16
最新Bump形状发展趋势
MF-Au100 第一代(’90～)
MF-Au660 第二代(‘01～)
MF-Au1101 第三代(‘07～)
EEJA CONFIDENTIAL/Do not duplicate 11
MICROFAB Au系列
Au100
Au140
Au310
Au660
Au1101
Technical Div./S.Kawahara/MF-Au Process/2007.09.26
EEJA CONFIDENTIAL/Do not duplicate 12
赛米控丹佛斯 配置IGBT M7芯片SEMITRANS 3 SKM150GB12M7G 数据表
Rev. 0.4–12.10.20201SEMITRANS ®3GBIGBT M7 ModulesSKM150GB12M7G Target Data Features*•V CE(sat) with positive temperature coefficient•High overload capability•Low loss high density IGBT´s•Fast & soft switching inverse CAL diodes•Large clearance (10 mm) and creepage distances (20 mm)•Insulated copper baseplate using DBC Technology (Direct Bonded Copper) •UL recognized, file no. E63532Typical Applications•AC inverter drives •UPS•Electronic weldersAbsolute Maximum Ratings SymbolConditions Values UnitIGBT V CES T j =25°C 1200V I C T j =175°CT c =25°C 215A T c =80°C164A I Cnom 150A I CRM300A V GES -20 (20)V t psc V CC =800V V GE ≤ 15V V CES ≤ 1200 VT j =150°C8µs T j -40 (175)°C Inverse diodeI F T j =175°CT c =25°C 179A T c =80°C134A I FRM 300A I FSM t p =10ms, sin 180°, T j =25°C774A T j -40...175°C Module I t(RMS)500A T stg -40 (125)°C V isolAC sinus 50 Hz, t =1min4000VCharacteristics SymbolConditionsmin.typ.max.UnitIGBT V CE(sat)I C =150A V GE =15V chiplevel T j =25°C 1.56 1.88V T j =150°C 1.80 2.30V V CE0chiplevel T j =25°C 0.840.91V T j =150°C 0.720.83V r CE V GE =15V chiplevel T j =25°C 4.8 6.5m ΩT j =150°C7.29.8m ΩV GE(th)V CE = 10 V, I C =15mA5.466.6V I CES V GE =0V V CE =1200V T j =25°C 1.5mA T j =150°C -mA C ies V CE =10V V GE =0Vf =1MHz 32.0nF C oes f =1MHz t.b.d.nF C res f =1MHz0.38nF Q G V GE =-8V ... + 15V 1500nC R Gint T j =25°C 2.5Ωt d(on)V CC =600V I C =150AV GE =+15/-15VT j =150°C t.b.d.ns t r T j =150°C t.b.d.ns E on T j =150°C 33mJ t d(off)T j =150°C t.b.d.ns t f T j =150°C t.b.d.ns E off T j =150°C 45mJR th(j-c)per IGBT0.228K/W2Rev. 0.4–12.10.2020© by SEMIKRONSEMITRANS ®3GBIGBT M7 ModulesSKM150GB12M7G Target Data Features*•V CE(sat) with positive temperature coefficient•High overload capability•Low loss high density IGBT´s•Fast & soft switching inverse CAL diodes•Large clearance (10 mm) and creepage distances (20 mm)•Insulated copper baseplate using DBC Technology (Direct Bonded Copper) •UL recognized, file no. E63532Typical Applications•AC inverter drives •UPS•Electronic weldersCharacteristics SymbolConditionsmin.typ.max.UnitInverse diodeV F = V EC I F =150AV GE =0V chiplevelT j =25°C 2.17 2.49V T j =150°C 2.12 2.42V V F0chiplevel T j =25°C 1.30 1.50V T j =150°C 0.90 1.10V r Fchiplevel T j =25°C 5.8 6.6m ΩT j =150°C 8.18.8m ΩI RRM I F =150A V GE =-15V V CC =600V T j =150°C t.b.d.A Q rr T j =150°C t.b.d.µC E rr T j =150°C30mJR th(j-c)per diode0.332K/W Module L CE 15nH R CC'+EE'measured per switchT C =25°C 0.55m ΩT C =125°C0.85m ΩR th(c-s)calculated without thermal coupling (λgrease =0.81 W/(m*K))0.020.038K/W M s to heat sink M635Nm M t to terminals M62.55Nm -Nm w325g© by SEMIKRON Rev. 0.4–12.10.20203GBThis is an electrostatic discharge sensitive device (ESDS) due to international standard IEC 61340.*IMPORTANT INFORMATION AND WARNINGSThe specifications of SEMIKRON products may not be considered as guarantee or assurance of product characteristics ("Beschaffenheitsgarantie"). The specifications of SEMIKRON products describe only the usual characteristics of products to be expected in typical applications, which may still vary depending on the specific application. Therefore, products must be tested for the respective application in advance. Application adjustments may be necessary. The user of SEMIKRON products is responsible for the safety of their applications embedding SEMIKRON products and must take adequate safety measures to prevent the applications from causing a physical injury, fire or other problem if any of SEMIKRON products become faulty. The user is responsible to make sure that the application design is compliant with all applicable laws, regulations, norms and standards. Except as otherwise explicitly approved by SEMIKRON in a written document signed by authorized representatives of SEMIKRON, SEMIKRON products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. No representation or warranty is given and no liability is assumed with respect to the accuracy, completeness and/or use of any information herein, including without limitation, warranties of non-infringement of intellectual property rights of any third party. SEMIKRON does not assume any liability arising out of the applications or use of any product; neither does it convey any license under its patent rights, copyrights, trade secrets or other intellectual property rights, nor the rights of others. SEMIKRON makes no representation or warranty of non-infringement or alleged non-infringement of intellectual property rights of any third party which may arise from applications. Due to technical requirements our products may contain dangerous substances. For information on the types in question please contact the nearest SEMIKRON sales office. This document supersedes and replaces all information previously supplied and may be superseded by updates. SEMIKRON reserves the right to make changes.4。
Flipchip制造流程
Press and cure equipment
1.Heating 2.Press
Flip chip bonder
1. Mounting 2.Heating 3.Press
Kingbond Training Course
Tack,Flux & Reflow
Conventional chip with aluminum I/O pads around the perimeter
Thermosetting
Underfill dispenser
Heating
Dispensing
Kingbond Training Course
ACF: Anisotropic Conductive Film Process
Wafer bump
Bump by Au
ACF Pre-setter
ACF Pre-setting
Kingbond Training Course
Flip Chip conductive method - connect to Substrate/PCB 1.Metal bump 金屬凸塊-C4 process(IBM) 2. Tape-Automated bonding 捲帶接合-ACF process 3. Anisotropic conductive adhesives
製程圖例:
Bump
檢驗重點項目:
1. Bump定位與焊接情形 2. 晶片崩裂 Crack,有無短路,斷路
Chip
Substrate/ Module
Kingbond Training Course
上晶片流程 Flip Chip flow
Pick up
SMT物料培训教材
1608 (1.6mmX0.8mm)
0805 (80milX50mil)
2012 (2.0mmX1.2mm)
1206 (120milX60mil)
3216 (3.2mmX1.6mm)
1210 (120milX100mil) 3225 (3.2mmX2.5mm)
1812 (180milX120mil) 4532 (4.5mmX3.2mm)
电阻在电路中用“R”加数字表示，如：R1表示编号为1的电阻。电阻在电 路中的主要作用为：分流、限流、分压、偏置等。
一、参数识别：电阻的单位为欧姆（Ω），倍率单位有：千欧（KΩ），兆 欧（MΩ）等。换算方法是：
1兆欧=1000千欧=1000000欧
1M=1000K=1000000
1、电阻器：导体对电流的阻碍作用称为电阻，用字母“R”表示，电阻基 本单位为 “欧姆”。
倍利得電子科技（深圳）有限公司
R
练习读料盘（1）
厂商 尺寸 精度 阻值 料号
倍利得電子科技（深圳）有限公司
R
练习读料盘（2）
厂商 尺寸 精度 阻值 料号
倍利得電子科技（深圳）有限公司
R
练习读料盘（3）
厂商 尺寸 精度 阻值 料号
倍利得電子科技（深圳）有限公司
R
六、排阻
排阻是由若干个电阻组合，它有多个脚，有A型(RN)和B型(RP)两种：A 有一个公共端，其他各引脚与公共脚之间的电阻为R：B型(RP)是相邻两脚的 电阻为R。
由若干个电阻组合，它有多个脚，有A型（RN）和B型（RP）两种；A型 有一个公共脚，其他各引脚之间的电阻为R；B型（RP）是相邻两脚的电 阻为R。
(RN）
（RP）
识别方法与电阻相同，如“330”为33Ω排阻，RN型是有方向的，有圆点
FPC基材物料中英文对照
FPC基材物料中英文对照1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (CCL)5、单面覆铜箔层压板:single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料:prepreg14、粘结片：bonding sheet15、预浸粘结片:preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板:laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板:core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板:adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜:adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层:cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive face34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates 基材材料1、A阶树脂：A-stage resin2、B阶树脂：B-stage resin3、C阶树脂：C-stage resin4、环氧树脂：epoxy resin5、酚醛树脂:phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin 8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin 10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin 12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac 14、氟树脂：fluroresin15、硅树脂：silicone resin 16、硅烷：silane17、聚合物：polymer 18、无定形聚合物：amorphous polymer 19、结晶现象：crystalline polamer 20、双晶现象：dimorphism 21、共聚物：copolymer 22、合成树脂：synthetic23、热固性树脂：thermosetting resin 24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin 26、环氧当量：weight per epoxy equivalent (WPE)27、环氧值：epoxy value 28、双氰胺：dicyandiamide29、粘结剂：binder 30、胶粘剂：adesive31、固化剂：curing agent 32、阻燃剂：flame retardant33、遮光剂：opaquer 34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester 36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (PI) 38、聚四氟乙烯：polytetrafluoetylene (PTFE)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP)40、增强材料：reinforcing material 41、玻璃纤维：glass fiber42、E玻璃纤维:E-glass fibre 43、D玻璃纤维：D-glass fibre 44、S玻璃纤维：S-glass fibre 45、玻璃布：glass fabric46、非织布:non-woven fabric 47、玻璃纤维垫：glass mats 48、纱线：yarn 49、单丝：filament50、绞股：strand 51、纬纱：weft yarn52、经纱：warp yarn 53、但尼尔：denier54、经向：warp-wise 55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count 57、织物组织：weave structure58、平纹组织：plain structure 59、坏布：grey fabric60、稀松织物：woven scrim 61、弓纬：bow of weave62、断经：end missing 63、缺纬：mis-picks64、纬斜：bias 65、折痕：crease66、云织：waviness 67、鱼眼：fish eye68、毛圈长：feather length 69、厚薄段：mark70、裂缝：split 71、捻度：twist of yarn72、浸润剂含量：size content 73、浸润剂残留量：size residue 74、处理剂含量：finish level 75、浸润剂：size76、偶联剂：couplint agent 77、处理织物：finished fabric 78、聚酰胺纤维：polyarmide fiber 79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper 81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length 83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention 85、白度：whitenness86、陶瓷：ceramics 87、导电箔：conductive foil88、铜箔：copper foil 89、电解铜箔：electrodeposited copper foil (ED copper foil)90、压延铜箔：rolled copper foil 91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (RA copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil 95、涂胶脂铜箔：resin coated copper foil (RCC)96、复合金属箔：composite metallic material 97、载体箔：carrier foil98、殷瓦：invar 99、箔（剖面）轮廓：foil profile100、光面：shiny side 101、粗糙面：matte side102、处理面：treated side 103、防锈处理：stain proofing 104、双面处理铜箔：double treated foil。
模具零配件中英文对照解读
常用模具零件中英文对照表2005-12-19 14:51:17 中国注塑网入水：gate进入位：gate location水口形式：gate type大水口：edge gate细水口：pin-point gate水口大小：gate size转水口：switching runner/gate唧嘴口径：sprue diameter流道: runner热流道：hot runner,hot manifold热嘴冷流道: hot sprue/cold runner唧嘴直流: direct sprue gate圆形流道：round(full/half runner流道电脑分析：mold flow analysis流道平衡:runner balance热嘴：hot sprue热流道板：hot manifold发热管：cartridge heater探针: thermocouples插头：connector plug插座：connector socket密封/封料：seal运水：water line喉塞：line lpug喉管：tube塑胶管：plastic tube快速接头：jiffy quick connector plug/socker 模具零件：mold components三板模：3-plate mold二板模：2-plate mold边钉/导边：leader pin/guide pin边司/导套：bushing/guide bushing中托司：shoulder guide bushing中托边：guide pin顶针板：ejector retainner plate托板：support plate螺丝：screw管钉：dowel pin开模槽：ply bar scot内模管位：core/cavity inter-lock顶针：ejector pin司筒：ejector sleeve司筒针：ejector pin推板：stripper plate缩呵：movable core,return core core puller 扣机（尼龙拉勾）：nylon latch lock斜顶：lifter模胚（架）：mold base上内模：cavity insert下内模：core insert行位（滑块）：slide镶件：insert压座/斜鸡：wedge耐磨板/油板：wedge wear plate压条：plate撑头: support pillar唧嘴：sprue bushing挡板：stop plate定位圈：locating ring锁扣：latch扣鸡：parting lock set推杆：push bar栓打螺丝：S.H.S.B顶板：eracuretun活动臂：lever arm分流锥：spure sperader水口司:bush垃圾钉：stop pin隔片：buffle弹弓柱：spring rod弹弓:die spring中托司：ejector guide bush中托边：ejector guide pin镶针：pin销子：dowel pin波子弹弓：ball catch喉塞:pipeplug锁模块：lockplate斜顶：anglefrompin斜顶杆：angleejectorrod尼龙拉勾：partinglocks活动臂：leverarm复位键、提前回杆：earlyreturnbar气阀：valves斜导边：anglepin术语：terms承压平面平衡：partingsurfacesupportbalance模排气：partinglineventing回针碰料位：returnpinandcavityinterference模总高超出啤机规格：moldbaseshuthight顶针碰运水：waterlineinterfereswithejectorpin料位出上/下模：partfromcavith(core)side模胚原身出料位：cavitydirectcutonA-plate,coredirectcutonB-plate. 不准用镶件：Donotuse(core/cavity)insert用铍铜做镶件：useberylliumcopperinsert初步（正式）模图设计：preliinary(final)molddesign反呵：reversecore弹弓压缩量：springcompressedlength稳定性好：goodstability,stable强度不够：insufficientrigidity均匀冷却：evencooling扣模：sticking热膨胀：theroexpansion公差：tolorance铜公(电极）：copperelectrodecompre sion molding 压缩成型flash mold 溢流式模具plsitive mold 挤压式模具split mold 分割式模具cavity 型控母模core 模心公模taper 锥拔leather cloak 仿皮革shiver 饰纹flow mark 流痕welding mark 溶合痕post screw insert 螺纹套筒埋值self tapping screw 自攻螺丝striper plate 脱料板piston 活塞cylinder 汽缸套chip 细碎物handle mold 手持式模具encapsulation molding 低压封装成型、射出成型用模具two plate 两极式（模具）well type 蓄料井insulated runner 绝缘浇道方式hot runner 热浇道runner plat 浇道模块valve gate 阀门浇口band heater 环带状的电热器spindle 阀针spear head 刨尖头slag well 冷料井cold slag 冷料渣air vent 排气道welding line 熔合痕eject pin 顶出针punch 冲头insert 入块(嵌入件)deburring punch 压毛边冲子groove punch 压线冲子stamped punch 字模冲子round punch 圆冲子special shape punch 异形冲子bending block 折刀roller 滚轴baffle plate 挡块located block 定位块supporting block for location 定位支承块air cushion plate 气垫板air-cushion eject-rod 气垫顶杆trimming punch 切边冲子stiffening rib punch = stinger 加强筋冲子ribbon punch 压筋冲子reel-stretch punch 卷圆压平冲子guide plate 定位板sliding block 滑块sliding dowel block 滑块固定块active plate 活动板lower sliding plate 下滑块板upper holder block 上压块upper mid plate 上中间板spring box 弹簧箱spring-box eject-rod 弹簧箱顶杆spring-box eject-plate 弹簧箱顶板bushing bolck 衬套cover plate 盖板guide pad 导料块electrical discharge machining (EDM) 电火花加工electrical insulating property 电绝缘性能electrochemical die-sinking machine 电解型腔加工机，电解型腔加工机床electrochemical machine (ECM) 电解加工机床，电化学加工机床electrochemical machining (ECM) 电解加工，电化学加工electro-discharge cutting 电火花加工，电火花切割electro-discharge cutting machine 电火花切割机electro-discharge machine tool 电火花加工机床Electro-discharge Machine 电火花加工机床electro-discharge machining 电火花加工electro-discharge machining process 电火花加工工艺，电火花加工工序epoxy resin 环氧树脂guide bushing 导套guide pillar 导柱，导杆，导柱guide pin 导向销，导杆guide pin cover 导柱盖guide plate 导料板，导板guide plate blanking die 导板式冲裁模，导板式落料模guide post 导柱，导柱guide stock plate 挡料板injection mold 注射模，注塑模injection molding 注射成型，注塑成型injection-molding machine 注塑机，注射机，注塑成形机injection plunger 注射柱塞in-line reciprocating screw 联机往复螺杆，串联往复螺杆，直线排列往复螺杆inner ram 内滑块inserting molding 嵌件成形integrated manufacturing 集成制造internal stress 内应力13.intermediate platen 中间板，隔板塑料成型模具的主要设计要素脱模距stripper distance脱模斜度draft投影面积projected area最大开距maximum daylight;open daylight闭合高度mould-shut height抽芯距core-pulling distance抽芯力core-pulling force脱模力ejector force开模力mould opening force模内压力internal mould pressure;cavity pressure成型压力moulding pressure背压环back-up ring 1 bar = 14.5psi高压接头bite type fitting液压马达hydraulic motor冷却水流量计waterflow regulator打磨器材abrasive material打磨砂轮grinding wheels切割砂轮cutting wheels码模夹(注塑机使用) mould clamps; lifting clamps 小五金工具piping tools高压力软管high pressure hose风管,水软管air .water hose高压油表pressure gauge压力油喉hydraulic hoses光塑检测photoelastic testing吹塑模plastic blow mould注塑模plastic injection mould冲扎复合模blank & form compound die精密冲模precision blanking die熔料流动率MFR=melt flow rate熔料流动指数MET=melt flow index推板导柱guide pin for ejector plater座板clamping plate垫块space block(plate)推板ejector block(plate)afdek plate 档尘板guide stripe 行位后板cavity sub-insert 前模镶件core sub-insert 后模镶件sprue puller insert 扣针镶件stage ejector 顶棍spacer rock(risers) 间隔板变形distortion弯曲warp拖花drag marks火花纹EDM marks困气venting烧黑burns表面缩水shrinkage料位过薄/砸穿thin wall stock走水不平行uneven fill pattern夹水纹/流纹witness line;mismatch;stress marks 走水纹knit lines走水不齐short shotsorifice 料口nozzle seat 热嘴垫圈nozzle plate 射嘴板cross pin 十字头销sled 射台seal ring 封密圈spacer rail 介子座heater groove 发热管槽heater cement 发热管的结合剂soak 浸泡seat 垫圈ream 铰大圆孔直径grind 磨床drill 钻床mill 铣床caliper 卡尺G-caliper 分厘卡Depth Gauge 深厚计hardness tester 硬度计angle gauge 角规marble table 云台石projector 投影仪height gauge 高度仪microscope 显微镜plug gauge 塞规leveller 水平器R gauge R 规Inter caliper 内分厘卡surface 平面仪item number 细目编码catalog number 材料分类编码undercut lip 倒扣口hot tip = hot drop = nozzle 热嘴blow-off strip 放气板blow-off nozzle 吹风口spiral hose 螺旋式的连接喉rust solvent 除锈剂shaft 曲轴ensile strength 拉伸力yield strength 屈服力spark erosion 电火花蚀刻etch(photo-etch) 电蚀harden 淬硬copper electrode 铜公corrosion resistance 耐腐蚀anneal 退火heat treatment 淬火FEM(finite elemnet method) 有限元法preliminary tool design 初期模具设计图zone 热流道区域reverse taper 倒啤把clamp plate 码板toggle clamp 快速夹vacuum furnace 真空炉cavity insert rounds 圆柱镶件cavity insert b0locks 方柱镶件tensile strength 抗张强度,抗拉强度Concept drawing 概念图Assembly drawing 装配图mismatch;witness line 夹纹shut-off(n.) 枕位venting valves 疏气阀venting plug 疏气塞valve casing 阀门罩twist drill 旋钻harden/nitride 碎硬anneal 退火temper 回火stess crack 应力断裂corrosion resistance 防腐,防锈tensile strength 物】抗张强度,抗拉强度split mould (分离)组合式的模具inclined plate 斜面inclined bolt 斜栓jaw (工具,机械等)夹住东西的部分,钳口step change of the P/L 分形面枕位的改变thin steel section 较薄的料位clean-up 清理,清除,清扫Mold Dating Insert 模具日志镶件Hot Sprue Bushing 热浇口套semi-automatic 半自动quick disconnector 快速断开接头full shot 足量注射mismatch 夹痕;夹水纹ejector mark 顶痕screw boss 螺丝孔,螺丝基座sink mark 缩坑15% glass filled ABS 掺有15%玻璃的ABS spraying mold release 脱模剂drag mark 拖痕stress mark 应力痕reinforcement rib 加强筋slght stoning 轻度磨砂soliid line 实线dotted line 虚线internal diameter 内径external diameter 外径nickel-plated 电镀的handling hole;lifting hole 吊装孔parallel 平行块piston 活塞plunger 柱塞carrier 导轨rest 支架item number 项目编号catalog item 商品目录编码dimensional datum 尺寸基准heat treatment certification 淬硬证明文件back-up bushing 支撑导套jacking screw 起重螺丝,千斤顶tapped hole (带有螺旋角度的)螺丝孔diagonal corner 成对角的角落burn mark 烧痕hot runner mainfold (热流道板)分流板texuring 蚀纹clamping screw (注塑机)码模螺丝imperial 英制的metric 公制的puller bushing 水口套puller bar 水口铁drool bushing 防漏胶套筒safety switch 限位制water line connected internally or hard tubing 不可用胶喉连接运水lifter on square rod or locked from rotation 用方形柱或用管钉止转gate insert 入水镶件gate shut-offs 流道开关配件guided ejection 中托司parting line shutoff 前后模接触面waterlines clear tie bars. 运水喉咀接驳位要避开啤机呵林柱. BGV=Balanced Gate Value 平衡入水值spacer 垫块pocket 挖槽rough 粗加工finish 精加工plunge rate 进刀率retract rate 提刀速率splindle rate 主轴转速coolant 冷却液SPLIT RING 开口环(钥匙圈)侧向抽芯力side pulling-core forceconvert.transfer 转图guide pin 边针Tee slot cutter T 形SLOT CUTTER zigzag 双向切削constant overlap spiral 等距环切parallel spiral 环绕切削parallel spiral clean corners 环切并清角morph spiral 依外形环绕true spiral 螺旋切削one way 单向end mill 平铣刀spher mill 球刀bull mill 圆鼻刀face mill 面铣刀rad mill 圆角成型刀chamfer mill 倒角刀slot mill 槽刀taper mill 推拔铣刀dove mill 鸠尾铣刀lot mill 棒状drill 钻孔reamer 纹刀bore bar 搪刀tap RH 右牙刀Tap LH 左牙刀ctr Drill 中心钻spot drill 点钻cntr bore 沉头孔刀c. sink 鱼眼孔钻loft surface 举升曲面coons surface 昆氏曲面ruled surface 直纹曲面revolved surface 旋转曲面swept surface 扫描曲面draft surface 牵引曲面grinding wheel 磨砂使用的轮子quench steel 将...淬火,使冷却stress relieving 应力消除molten 熔热的oxide film 氧化层guide pin and sleeve, locating ring ,导边,司筒,定位圈ejector ,ejector balde, ejector sleeve,顶针,扁顶针,顶针司筒, lifters, wear plate,horn pin,斜坊,磨损板,气顶针,O ring, water baffle, water pipe plug,O 形圈,隔片,运水管道塞, water line connector,wear plate ,运水管道转接头,耐磨板air cylinder,hydraulic cylinder,氯压缸,液压缸micro switch,oil nipple, spring,开关装置,油枪接头,弹弓sprue bushing,early return system,浇口套,早期回撞装置, accelerated ejectors, slied holder,加速顶针,注塑周期计数器, cycle counter,date stamper，滑块固定板,生产日期铭牌,hot runner system ，热流道系统chemical composition 化学成份thermal conductiivity 导热性能thermal diffusivity 热扩散性能dimensonal stablity 尺寸稳定性能cooling effiency 冷却效率easiler ejection 易于脱模alloy insert 合金镶件(cooling) duct 输送管;导管maintenance cost 维护费用ultrasonic testing 超声波检测crack 断裂direct gate 直接浇口ring gate 环形浇口disk gate;disphragm gate 盘形浇口spoke gate;spider gate 轮辐浇口pin-point gate 点浇口edge gate 侧浇口submarine gate;tunnel gate 潜伏浇口fan gate 扇形浇口tab gate 护耳浇口runner plate 流道板(或冷或热)secondary nozzle 二级喷嘴torpedo;torpedo body assembly 鱼雷形组合体catridge heater 管式加热器heat pipe 热管valve gate 阀式浇口force plunger;pot plunger 柱塞flash groove;spew groove 溢料槽impression;cavity block;cavity plate 凹模punch;force 凸模movable insert;loose detail 活动镶件cavity splits;core splits(凹模拼块) (型芯拼块) 拼块side core 侧型芯thread plug;threaded core 螺纹型芯thread ring;threaded cavity 螺纹型环cutting wheel 切割砂轮grinding wheel 打磨砂轮abrasive material 打磨器材mould clamps;lifting clamp 砂模夹(注塑机使用)air (water) hose 风管,水轮管pressure gauge 高压油表hydraulic hose 压力油喉plastic blow mould 吹塑模plastic injection mould 注塑模blandk&form compound die 冲扎复合模precisiion blanking die 精密冲模MFR=melt flow rate 熔料流动率MFT=melt flow index 熔料流动指数handling hole 拉铃孔stop plate 限位块linder bush 衬套spacer block(plate) 垫块,方铁back-up ring 背位环standoff 限位块American Safety Hoist Rings. 英制安全吊装环Mechanical Properties 机械性能Tensile Strength(MPa) 抗拉强度elongation 延伸率hardness(Brinell) 硬度shear stength(MPa) 剪切力impact strength 冲韧性Physical Properties 物理性能solidification shrinkage 凝固收缩率freezing range 凝固与熔范围thermal expansion 热膨胀系数specific heat 比热thermal conductivity 热导率electrical conductivity 电导率micro-structure 金相分析hot work tool steel 热作钢circular motion 环形运动variable 变数,参数graphics window 图形窗口45 degree entry and a zero degree exit. 进刀口45 度,退刀口0 度runner stripper plate 脱料板stripper plate 活动板spacer rock(risers) 间隔板stage ejector 顶棍sprue puller insert 扣针导套guide strip 行位后板afdek plate 挡尘板side gate 大水口pinpoint gate 细水口SHCS 杯头螺丝FHCS 平头螺丝set screw 无头螺丝ball catch 波子螺丝wedge 行位较杯gib 线条,(撑鸡的导轨)latch 拉杆clamp 码仔spring guide pin 弹弓导柱steel pad disc 橙仔方ejector cam insert 斜顶块(screw) nut 螺母taper 嗲把/ 斜度taper interlock 嗲把锁texture 花纹toggle-lok 回撞装置top clamping plate 顶码板unified national coarse (UNC) 美制螺丝(粗牙) unified national fine (UNF) 美制螺丝(幼牙) set screw 喷头螺丝side gate 大水口slide retainer 行位管位water junction 喉咀spacer block 登仔jiffy-matic socket 喉咀套jiffy-tite plug 喉咀公spring plunger 弹弓座sprue puller 勾针/勾粒spring washer 弹簧塑圈stepped ejector pin 有托顶针strippers plate 推板/细水口板submarine gate 潜水口support pin 拉杆support plate 暗板surface finish 光洁度alignment strip 斜锁angle pin 斜针fan gate 扇形入水fillet 圆口ball catch 弹弓波子blade ejector 扁顶bottom clamping plate 底码板free length 自然长度bridge piece 水口铁helix spindle 锅杆hose clip 水喉箍bubbler 隔气运水jiggle 斜顶jiggle witness line 斜顶片位置center distance (CRS) 山打距离(中心线距离)clamp 码仔contour 外形leader pin 导针location ring(flange) 法兰counterbore 拔头,介子托mock-up;prototype 手办die cast 合金压铸national pipe thread(NPT) 美制喉牙overflow 垃圾位ejection sleeve 司筒,顶套epoxy 胶样pin point gate 细水口pressure plug 喉塞pressure spring 压力弹簧parting line flash 披锋burned 烧黑underfilled 缺料insert mismatch 镶件夹口ejector pins not flush 顶针有高低ejector pins skid 顶针滑动insert flash 镶件披锋pressure transducer 压力探测头hydraulic schematic 油积筒油路接驳图jiffy connector recessed 安装喉嘴后不可突出模胚knock out pullback stud -flush with clamp plate 顶棍镶件与底板有否空间safety switches 限位开关stop block 限位块safety strap 安全带drool bushing 防漏胶套筒insert mismatch 镶件夹口EDM visible 明显火花纹lifter scrapes 斜顶拖花short shots 走水不齐wall stock 料位厚薄knit lines 走水纹stress marks 夹水纹uneven fill pattern 走水不平行drag marks 拖花sprue pretrusion 唧嘴突出高度sprue orifice and radil size 唧嘴R 尺寸sprue bushing-keyed 唧嘴有管钉English Chinese program name 产口名称part name 零件名称tool name 模具名称tool source 模具来源tool steel 模具钢材resin 塑料program number 产品编号part number 零件编号tool number 模具编号customer 客户名称No of cavities 内模编号machine size 啤机吨数drum miller 鼓形铣床duplex horizontal miller 复式卧铣床face miller 端面铣床grinding miller 研磨机plain miller 平面铣床planer-type miller 刨式铣床rack miller 齿条铣床slab miller 大型平面铣床slot miller 键槽铣刀spline miller 花键铣刀thread miller 螺纹铣刀vertical miller 立式铣刀,立辊,立辊轧机endmill 立铣刀plastic mould steel 塑料模钢cold work steel 冷作钢hot work steel 热作钢high speed steel 高速钢electric magnetic clutch 电磁离合器pad printer 移印机screen printer 丝印机hot stamper 烫印机solid carbide slitting saw 钻石钢锯片convex cutter 凸锣刀片concave cutter 凹锣刀片side&face cutters,staggered teeth end-mill 锣刀semi-rod 半圆刀split double end 双头刀single end 单头刀2-flute 两辨3-flute 三辨4-flute 四辨reamer 直拈centre drill 中心钻solid carbide drill 钻咀zinc ingot 锌锭aluminium ignot 铝锭tin ignot 锡锭heater cement 发热管的结合剂heater groove 发热管槽spacer rail 介子座cross pin 十字头销nozzle plate 射嘴板nozzle seat 热嘴addendum 齿冠dedendum 齿根air compressor 空气压缩机air exhauster 抽气机air intake 进气口air seal 空气隔离层Mold changing systems 换模系统Mold core 模芯Mold heaters/chillers 模具加热器/冷却器Mold polishing/texturing 模具打磨/磨纹Mold repair 模具维修Molds 模具Pressing dies 压模Quick die change systems 速换模系统Quick mold change systems 快速换模系统三、模具塑料模具mould of plastics注塑模具injection mould冲压模具die模架mould base定模座板Top clamping plate Top plateFixed clamp plate水口推板stripper plateA板A plateB板B plate支承板support plate方铁spacer plate底针板ejector plate面针板ejector retainer plate回针Return pin导柱Guide pin有托导套Shoulder Guide bush 直导套Straight Guide bush动模座板Bottom clamp plate Moving clamp plate基准线datum line基准面datum plan型芯固定板core-retainer plate 凸模固定板punch-retainer plate 顶针ejector pin单腔模具single cavity mould多腔模具multi-cavity mould多浇口multi-gating浇口gate缺料starving排气breathing光泽gloss合模力mould clamping force锁模力mould locking force挤出extrusion开裂crack循环时间cycle time老化aging螺杆screw麻点pit嵌件insert活动镶件movable insert起垩chalking浇注系统feed system主流道sprue分流道runner浇口gate直浇口direct gate , sprue gate轮辐浇口spoke gate , spider gate点浇口pin-point gate测浇口edge gate潜伏浇口submarine gate , tunnel gate料穴cold-slug well浇口套sprue bush流道板runner plate排飞槽vent分型线（面）parting line定模stationary mould，Fixed mould动模movable mould, movable half上模upper mould，upper half下模lower mould，lower half型腔cavity凹模cavity plate，cavity block拼块split定位销dowel定位销孔dowel hole型芯core斜销angle pin, finger cam滑块slide滑块导板slide guide strip楔紧块heel block, wedge lock拉料杆sprue puller定位环locating ring冷却通cooling channel脱模斜度draft滑动型芯slide core螺纹型芯threaded core热流道模具hot-runner mould绝热流道模insulated runner mould熔合纹weld line （flow line）三板式模具three plate mould脱模ejection换模腔模具interchangeable cavity mould 脱模剂release agent注射能力shot capacity注射速率injection rate注射压力injection pressure差色剂colorant保压时间holdup time闭模时间closing time定型装置sizing system阴模female mould，cavity block阳模male mould电加工设备Electron Discharge Machining数控加工中心CNC machine center万能铁床Universal milling machine卧式刨床Horizontal planer车床Engine lathe平面磨床Surface grinding machine去磁机Demagnetization machine万能摇臂钻床Universal radial movable driller 立式钻床Vertical driller超声波清洗机Ultrasonic clearing machine compre sion molding压缩成型flash mold溢流式模具plsitive mold挤压式模具split mold分割式模具cavity型控母模core模心公模taper锥拔leather cloak仿皮革shiver饰纹flow mark流痕welding mark溶合痕post screw insert螺纹套筒埋值self tapping screw自攻螺丝striper plate脱料板piston活塞cylinder汽缸套chip细碎物handle mold手持式模具（移转成型用模具）encapsulation molding低压封装成型（射出成型用模具）two plate两极式（模具）well type蓄料井insulated runner绝缘浇道方式hot runner热浇道runner plat浇道模块valve gate阀门浇口band heater环带状的电热器spindle阀针spear head刨尖头slag well冷料井cold slag冷料渣air vent排气道welding line熔合痕eject pin顶出针knock pin顶出销return pin回位销反顶针sleave套筒stripper plate脱料板insert core放置入子runner stripper plate浇道脱料板guide pin导销eject rod (bar)（成型机）顶业捧subzero深冷处理three plate三极式模具runner system浇道系统stress crack应力电裂orientation定向sprue gate射料浇口，直浇口nozzle射嘴sprue lock pin料头钩销(拉料杆)slag well冷料井side gate侧浇口edge gate侧缘浇口tab gate搭接浇口film gate薄膜浇口flash gate闸门浇口slit gate缝隙浇口fan gate扇形浇口dish gate因盘形浇口diaphragm gate隔膜浇口ring gate环形浇口subarine gate潜入式浇口tunnel gate隧道式浇口pin gate针点浇口Runner less无浇道(sprue less)无射料管方式long nozzle延长喷嘴方式sprue浇口;溶渣根据中文词汇查所关心的技术问题，解决实际工作中的难题例如，在汉语词汇中看到——高速冲孔废料上跳（かす上り、scrap jump ）词汇，到网上一搜，中图分类号TG382.6，文章编码：1671-3508-2008-10-07-517，“高速冲压中防止冲孔废料上跳的方法”一文会告诉你引起高速冲孔废料上跳的原因，不外乎有油膜粘连、真空吸附、刃口磨损、磁性未退四个主要方面，解决这些问题有三个方向的思路可以考虑，具体手段有“毛糙面”法、“斜刀口”法、“硅胶顶出”法、“凹模刃口倒退拔”法，等等。
3M 7240
Scotch-Weld™Epoxy Adhesive 7240 FR B/AProduct Data SheetUpdated : December 2001Supersedes : November 2000Product Description3M Scotch-Weld TM 7240 FRB/A epoxy adhesive is ahigh performance, two-parttoughened adhesive. Offers high shear and peeladhesion and outstandinglevels of durability. Contains300 µm glass beads foraccurate glue line control.Tested to FAR25 (verticalburn) and meets the 15second self extinguishingrequirement.Physical Properties BASE ACCELERATOR Not for Specification Purposes Base Toughened Epoxy Modified AmineColour Black Off-whiteSpecific Gravity (approx.) 1.05-1.10 1.12-1.18Mix RatioBy VolumeBy Weight 1001005052Viscosity (Pa.s at 23o C) 100-200 100-200Worklife at 23o C (min)20 g45Time to Handling Strengthat 23o C (Hours) 6Shelf Life 12 months from date of dispatch by 3M when stored inthe original carton at 21 o C and 50% relative humidity. Typical Performance Overlap Shear Strength Test method EN 2243-1Characteristics (MPa)Not for specification purposesTest conditions Cure cycle 1 Cure cycle 2 Cure cycle 3- 55 ± 3°C 17.9 (C) 18.2 ( C ) 19.4 ( C )-40 ± 2°C 20.4 ( C ) 21.9 ( C ) 22.4 ( C )23 ± 2°C 26.9 ( C ) 27.4 ( C ) 26.6 ( C )70 ± 2°C 16.2 ( C ) 16.4 ( C ) 14.3 ( C )100 ± 2°C 5.7 ( C ) 6.2 ( C ) 4.8 ( C )150 ± 3°C 1.9 ( C ) 1.9 ( C ) 2.0 ( C ) Overlap shear specimens were constructed using 1.6 mm thick 2024 T3 clad aluminium with the surface prepared using the optimised FPL etch.Date : December 2001Scotch-Weld Epoxy Adhesive7240 FR B/A Typical Performance Roller (Bell) Peel Strength Test method EN 2243-2Characteristics(Cont’d) (N/25mm)Not for specification purposesCure cycle 1 Cure cycle 2 Cure cycle 3120 105 90 Roller (Bell) peel specimens were constructed using 1.6 and 0.5 mm thick 2024 T3 clad aluminium with the surface prepared using the optimised FPL etchCure cycles :1. 7 days at 23 ± 2°C under a pressure of 100 kPa the first 24 hours2. 24 hours at 35 ± 2°C under a pressure of 100 kPa followed by a 60 minute post-cure at 80 o C3. 60 min at 60-65 °C under a pressure of 100 kPa.~300 µm diameter glass beads were used to control glue line thickness___________________________________________________________________________________________________________________ Adhesion Properties Overlap Shear Strength Test method EN 2243-1Not for specification purposes (MPa)Typical results obtained using overlap shear specimens prepared according to EN 2243-1. All specimens were cured for 24 hours at 35 o C under a pressure of 100 kPa.Substrate Overlap shear strength / MPa Failure Mode 2024 T3 clad aluminium 22.4 Cohesive5754 H111 aluminium alloy 12.5 Substrate failure (stretching) Cold rolled steel 17.1 Substrate failure (stretching)Stainless steel 23.7 Cohesive Hot dip galvanised steel 15.9 Substrate failure (stretching) Carbon fibre reinforced epoxy 24.3 CohesiveGlass fibre reinforced phenolic 17.2 Substrate failure (delamination)Glass fibre reinforced polyester 6.2 Substrate failure_____________________________________________________________________Environmental Resistance Overlap shear strength Test method EN 2243-1Not for specification purposes (MPa)Table denotes typical results obtained on 1.6 mm thick optimised FPL etched 2024 T3 bare aluminium after curing for 60 minutes at 60-65 o C. Testing was conducted at 23 ± 2°C after aging for 750 hours.Conditions Test resultsControl (23 o C / 50% RH) 19.7 (Cohesive – no degradation)20 mins dry heat (200o C) 32.8 (Cohesive)D.I. water at 23°C 19.9 (Cohesive)Jet fuel at 23°C 22.3 (Cohesive)Lead free fuel at 23o C 23.2 (Cohesive)Hydraulic oil at 23°C 24.8 (Cohesive)19.4 (Cohesive)*Hot –wet exposure (70°C ; ≥ 95 %relative humidity)5 % salt spray at 35 o C 18.2 (Cohesive)** Denotes no corrosion under the glue line7240 FR B/AFlammability (FAR25)(25 x 12.5 x 12.5) mm sample blocks of adhesive were mounted vertically, and exposed to a flame for 30 seconds. On removal of the flame, the adhesive ‘self extinguished’ in less that 15 secondsCompression strength and Young’s modulusData generated from a cast block of material (25 x 12.5 x 12.5 mm), cured for 24 hours at 23+/-3°C followed by a 60 minutes post-cure at 80+/-3°C. Specific gravity of the cured material was measured as 1.03-1.06 at 23 o CCompression strength (MPa)Young’s modulus (MPa)23 +/- 2°C : 45-50 23 +/- 2°C : 3500-4000Additional Product Information Work Life:After mixing, the mixtureremains workable for a timebefore it becomes tooviscous to properly wet thesurface to which it isapplied.The work life and rate ofcure are both greatlyaffected by temperature andto some extent humidity,curing faster astemperature and humidityare raised.Once mixed, the adhesiveshould be used within 45minutes.Equipment :3M Scotch-Weld TM 7240 FRB/A is supplied either in adual syringe plasticcartridge designed to fit theEPX TM applicator system orvia bulk packaging formats.Contact your 3Mrepresentative forassistance in selectingapplication equipment tosuit your specific needs.Clean Up:Excess adhesive can becleaned up prior to curingwith 3M Solvent No.2.Note: 3M Solvent No.2 isflammable. When usingsolvents for clean up it isessential that the correctsafety precautions areobserved.Surface Preparation For high strength structuralbonds, paint, oxide films,oils, dust and all othersurface contaminants Must be completelyremoved. The level ofsurface preparation willdepend on the requiredbond strength andenvironmental resistancerequired.Storage Conditions Rotate stock on a “first in -first out” basis. When storedat room temperature in theoriginal packaging, shelf lifeis 12 months.7240 FR B/A AdditionalInformationFor any additional information please contact your local 3M representativeHealth & Safety Information For Health & Safety information, please contact the Product Responsibility Department Tel: 01344 8606783M and Scotch-Weld are trademarks of the 3M CompanyValues presented have been determined by standard test methods and are average values not to be used for specification purposes. Our recommendations on the use of our products are based on tests believed to be reliable but we would ask that you conduct your own tests to determine their suitability for your applications.This is because 3M cannot accept any responsibility or liability direct or consequential for loss or damage caused as a result of our recommendations.Tapes & Adhesives © 3M United Kingdom PLC 19963M United Kingdom PLC 3M House,28 Great Jackson Street, Manchester,M15 4PA Product Information :Tel 0870 60 800 50Fax 0870 60 700 993M Ireland3M House, Adelphi Centre,Upper Georges Street,Dun Laoghaire,Co. Dublin,IrelandCustomer Service :Tel (01) 280 3555Fax (01) 280 3509。
FCCSP介绍
ATC FCCSP Introduction Amkor Technology China | Sep. 2017WHAT IS FCCSP?FCCSP : F lip C hip C hip S cale P ackage–FCCSP is an Interconnect TechnologyF lip C hip C hip S cale P ackageSmaller and thinnerApplication(s)–High Speed Memory–Power Regulator –Analog Device (RF)–Graphic –Chipset –Microprocessor–Communication –Consumer products –Making The FutureWHAT CAN WE DO ?Making The Future20012003200520072009201120132015CABGA (2003)SCSP 16+0(2014 )SCSP 3+1(2006)SCSP 2+0 (2005)SCSP 2+1 (2006)SCSP 8+0 (2012 )SCSP 4+1(2011)PoP Top (2013 )PoP btm (2007)Phased out on 2008Thinner PKG HeightHigher StackPBGA(2005)Phase out on Y2013W B L A M I N A T E P K GMicroSD (2006)WLCSP & DPS -8’(2011)Wafer bumping –8”(2007)O t h e r sPunch-QFN (2006)SD-QFN 2+1 (2010)SD TSOP 2+1 (2006)SD-TSOP 4+0 (2009)LQFP(2001)Phased out on Y2005More I/OL E A D F R A M E P K GsQFN (2004) Phased out onY2005DR PQFN (2014)fcPBA(2005)Phase out on Y2008fcSCSP (2012)fcCSP CUF (2008)fcBGA (2008)Phased out on 2009Higher StackF L I P C H I P P K GBare die POP (2013)CuP fcCSP (2013)WLCSP Interposer (2014)SOIC (2002)Phased out on Y2005TSOP (2004)Finger print sensor(2015)TMV (2015)TCNCP (2014)EMI shield (2015 )2017SCSP MEMS(2016)Exposed Die fcCSP(2016)SCSP SIP (2016)LSC fcCSP (2016)fcCSP MUF (2011)Saw QFN (2016)Wafer bumping –12” (2016)TSV FPS (2017)SCSP 24+0(2017 )DPS –12” (2017)Glass wafer(2017)fcMSP (2017)DR sQFN (2017)ATC PACKAGE PORTFOLIOHVM Available2017201820192020Die size (mm)91.8151.5151.5Bump pitch (µm)▪Pb free solder▪Fine Pitch Cu Pillar -with TCNCP-with MR14040/8045/9014040/8045/9013030/6030/60Body size/Ball count▪0.8 mm pitch ▪0.65 mm pitch ▪0.5 mm pitch ▪0.4 mm pitch ▪0.3 mm pitch 15 mm/32915 mm/49515 mm/84915 mm/992–21 mm/64521 mm/98421 mm/169321 mm/263221 mm/468021 mm/64521 mm/98421 mm/169321 mm/263221 mm/4680Substrate Standard coreLow CTE coreCorelessMSPStandard coreLow CTE coreCorelessMSPStandard coreLow CTE coreCorelessMSPFCCSP TECHNOLOGYHVM Available2017201820192020L&S(µm) pitch▪Tenting(+)▪MSAP(+)▪SAP▪Embedded trace (L1)≥40/40≥15/25≥16/16≥10/10←←12/12←20/2515/20, 14/1810/10,8/107/7,5/515/2512/188/85/5←12/16←←Laser via pad/via (µm)▪Blind via (prepreg) ▪Core layer via≥90/60≥150/75←←85/60125/75,115/75←105/7580/60←F/C pitch (µm)▪CuP+ SOP ▪CuP+ BOL≥130≥40/8011030/60100←←25/50←←SR Ink▪SRR≥12.5←←10←Core material▪CTE (ppm)15 ~ 2.5 ← 1.5 ~ 1.000, -2Solder mask ▪Tg(°C)▪CTE (ppm)≤135≥40←←15520~17.51709←←Surface finish OSP+(SOP)+(Ni/Au)ENEPIG[ Module ](Thin Ni) ENEPIG+ OSP [ Module ]←←FCCSP SUBSTRATE TECHNOLOGYWafer IncomingPre bake**Note Plasma clean **Note Underfill **Note UF Cure **Note Flip Chip Attach / Reflow Flux clean Pre-cleanBall Inspection System MoldPost Mold CurePlasma Clean Final Visual InspectionLaser Marking Solder Ball Attach / Reflow / CleaningPackage SawIVI inspectionWafer SawingLaser Grooving Back Grinding 1Back Grinding2Wafer Sawing3Flip Chip AttachUnder Fill45Mold6Laser Marking7Solder Ball Attach8Package Sawing**Note) Yellow mark are option for CUFFCCSP PROCESS FLOWWAFER BACK GRINDWafer TapeFlipWafer Back GrindingFinished WBG ( Reduce Thickness )LASER GROOVINGFinished Laser Grooving ( Pre-Saw )WAFER SAWBladeFinished Wafer Saw ( Die Saw )Pickup Die From FlipperFlipperPickup Die From waferFlipper DieF lip C hipFlipperDieBonderBonder BonderDieDieAttach DieDipping FluxREFLOWDieGo through Reflow Solder MeltingFinished Chip Attach ( Attach Die )PRESSURIZEDWATER PRESSURIZEDWATER PRESSURIZEDWATERPRESSURIZEDWATERHOT AIRHOT AIRHOT PLATEHOT PLATEFLUX CLEANDieFinished Flux clean ( Clean flux residue )UNDER FILLUnder FillFinished Under Fill ( Protect bumps )MOLDINGMolding CompoundFinished Molding ( Protect Die )LASER MARKINGFinished Laser marking ( Unit Information )Molding CompoundSPRD SPRD SPRDSPRDSOLDER BALL ATTACHFinished Solder Ball AttachPACKAGE SAWFinished Package Saw ( unit base )AmkorSPRDSPRDSPRD SPRDBALL INSPECTION SYSTEMSPRDSPRDSPRDCameraCameraFinished Ball Scan ( check quality )FINAL VISION INSPECTIONSPRDSPRDThank YouAmkor is making the future with you。
FC简介
-Stencil printing bump
-Solder ball attach
Gold bump
Wafer Bumping (晶元表面凸点)
3. Bumping 工艺流程: (Solder bump & Copper pillar bump)
CSP: Solder bump
Copper pillar bump
倒装芯片封测流程
Underfill (底部填充)：
在芯片侧边点胶，通过毛细作用使UF胶填满芯片底部，固化烘烤后对芯片形成包封保护. 固化烘烤辅以Pressure oven (压力烘箱)，能有效解决UF Void问题； Underfill Process简称CUF (Capillarity Underfill)，属可选Process；
B. 压力烘箱原理视图：
C. Underfill 点胶模拟(Glass die)：
Underfill 点胶视图
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Thanks！
点胶机：Protec
Normal & Pressure烘箱
Nozzle Epoxy PCB
点胶前
Underfill
点胶后
SAT扫描
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倒装芯片封测流程
Underfill (底部填充-CUF)：
A. 毛细作用及原理视图：指液体在细管状 物体内侧，由于内聚力与附着力的差异、 克服地心引力而上升的现象；
FC简介
What is Flipchip?
What is ‘Flipchip’ ? Flipchip起源于60年代，由IBM率先研发。倒装芯片之所以被称为‘倒装’，是相对于 传统的金属线键合连接方式(Wire Bonding)而言的。 传统WB工艺，通过金属线键合与基板连接的芯片，电气面朝上(图1)，而倒装芯片的 电气面朝下(图2)，芯片送入贴片时，先将芯片翻转以进行贴装，也由于这一翻转过程， 而被称为 “倒装芯片”。
芯片测试的几个术语及解释CPFTWAT
CP是把坏的Die挑出来，可以减少封装与测试的成本。
可以更直接的知道Wafer的良率。
FT是把坏的chip挑出来；检验封装的良率。
现在对于一般的wafer工艺，很多公司多吧CP给省了；减少成本。
ＣＰ对整片Ｗａｆｅｒ的每个Ｄｉｅ来测试而ＦＴ则对封装好的Ｃｈｉｐ来测试。
ＣＰＰａｓｓ才会去封装。
然后ＦＴ，确保封装后也Ｐａｓｓ。
WAT是Wafer Acceptance Test，对专门的测试图形（test key）的测试，通过电参数来监控各步工艺是否正常与稳定；CP是wafer level的chip probing，是整个wafer工艺，包括backgrinding与backmetal（if needed），对一些基本器件参数的测试，如vt,Rdson,BVdss,Igss,Idss等，一般测试机台的电压与功率不会很高；FT是packaged chip level的Final Test，主要是对于这个（CP passed）IC或Device芯片应用方面的测试，有些甚至是待机测试；Pass FT还不够，还需要作process qual与product qualCP测试对Memory来说还有一个非常重要的作用，那就是通过MRA计算出chip level的Repair address，通过Laser Repair 将CP测试中的Repairable die修补回来，这样保证了yield与reliability两方面的提升。
CP是对wafer进行测试,检查fab厂制造的工艺水平FT是对package进行测试,检查封装厂制造的工艺水平对于测试项来说,有些测试项在CP时会进行测试,在FT时就不用再次进行测试了,节省了FT测试时间;但是有些测试项必须在FT时才进行测试(不同的设计公司会有不同的要求)一般来说，CP测试的项目比较多，比较全；FT测的项目比较少，但都是关键项目，条件严格。
但也有很多公司只做FT不做CP(如果FT与封装yield高的话，CP就失去意义了)。