Mechanical_Intro_14.5_L10_Thermal

合集下载

Mini PC PN63-S1 自清洗风扇模块说明书

Mini PC PN63-S1 自清洗风扇模块说明书

Self-cleaning fan module bring stronger performanceand even keeps the heatsinks cleanEasy modification, maximum possibilities• Powered by 11th Generation Intel ® Core TM processors combined Intel ® Iris ® Xe • The latest memory DDR5 support• An optional multi-storage design that accommodates up to two M.2 SSD and a 2.5-inch solid-state drives(SSD) or hard disk drives (HDD) for added storage flexibility• Support up to 3 x 4K displays simultaneously, or 1*5K@60Hz (through Mini DP or DP port)Improved Cooling• Anti-Dust Self-Cleaning System keeps the CPU operating at optimum temperatures and enables stronger performance that lasts• The System even can effectively remove dust to maintain a cleaner heatsink and prolong the lifecycle of the productConvenient connectivity• Including a front-mounted USB 3.1 Gen2 Type-C port and a configurable port to support legacy devices, additional displays or multiple network connections• Onboard 2.5GbE LAN delivering faster Ethernet connectivityEasily upgradeable design• A convenient sliding chassis design lets you add or upgrade a M.2 SSD, 2.5-inch HDD or SSD, or memoryin two easy steps using just a screwdriver3DDR4MemorySelf-CleaningTriple StorageDDR5MemoryPCIe 4.0x4M.2 SSD2.5” HDD or 2.5” SSD3 DisplaysPad lock Support2.5G LANWi-Fi 6802.11ax6Kensington LockU11th Gen Intel ProcessorsCPU1 x Audio Jack (Line out/ Mic in/ Headphone out)HDMI 1.4 portUSB 3.2 Gen21 x 3-in-1 Card Reader(Micro SD/ Micro SDHC/ Micro SDXC)(option: Display Port 1.4/ COM/ VGA)1 x Intel ™ (RJ45) 2.5G LAN1 x Mini Display1.2 Port1 x Kensington Lock2 x USB 3.2 Gen2Over view:Accessories list:Feature table:• Power Cord • AC Adapter (80cm)• Quick Start Guide & Warranty Card • VESA Mount Kit (Optional)• Keyboard & Mouse (Optional) Wired / WirelessPowerBIOSPD input N NExtended PowerButtonUSB Single Port ControlAC Power loss HDMI-CEC CrashFree EZ FlashBIOS CustomizationPXE/WOL Y N Y Y Y Y YSecurityReliabilityfTPM 2.0dTPM 2.0Kensington lockPad-lock Chassis IntrusionY optional Y N NY N Y NAnti-Surge FanlessMilitary-grade Durability 24/7 DurabilityTest RemoteMyASUS / CSMASUS ControlCenter AI Noise Cancelation ASUS Cooperate Stable ModelWatchdog timer MyLogooptional optional optional Y N N NSmart Fan Control Wi-Fi Smart ConnectModel OS CPU Memory Storage Chipset Graphics Wireless NetworkLANTPM BIOS FunctionSoftware Power SupplyHumidityCertificatesInterfacePhysicalMax ResolutionTemperatureAcousticFront I/OSide I/ORear I/ODimension Weight HDMI DP VGA Operating StorageIdle mode Full loadingPN63-S1IntegratedIntel ® Wi-Fi 6 and Bluetooth 5Intel ® Wi-Fi 5 and Bluetooth 52 x DDR4 SO-DIMM slots for DDR4 3200 MHz, 1 x 8GB - 2 x 32GB (total)Intel ® Core ™ i7-11370H/ i5-11300H (cTDP:35W)Intel ® Core ™ i7-1165G7/ i5-1135G7/ i3-1115G4 (cTDP:28W)Windows ®11 64bit, Windows ®11 Pro 64bit, Linux, or W/O OS (Please check with local rep on validated Linux version)1 x 6Gb/s SATA connector for 2.5” 1TB HDD/SSD*1 x M.2 2280 PCIe Gen4 slot for 256GB - 2TB SSD* (NVMe only)1 x M.2 2280 PCIe Gen3 slot for 256GB - 1TB SSD* (NVMe only)*For higher capacity please refer to QVL (location: official website Support CPU / Memory Support)Intel ® LAN, 10/100/1000/2500 MbpsSupports Wake on LAN / PXE / Auto Power on / RTC WakeThe following software are included in OS:ASUS Business manager, ASUS Product registration program, Asus Control Center test,Watchdog timer1 x USB 3.2 Gen2 Type-C (10 Gbps)1 x USB 3.2 Gen2 (10 Gbps)1 x Audio Jack(Line out/ Mic in/ Headphone out)*All data transfer speed is according to ASUS testing result, actual performance may vary depending on objectiveenvironmental changes.2 x USB 3.2 Gen2 (10 Gbps)1 x Mini Display 1.2 Port 1 x HDMI 1.4 Port1 x Configurable Port (options: Display Port 1.4/ COM/ VGA)1 x Intel LAN (RJ45)1 x Padlock ring1 x DC-in*Supports up to 3 display simultaneously.Integrated - Intel ® UHD Graphics (i3) or Intel ® Iris ® Xe Graphics (i5/i7)*Intel ® Iris ® Xe Graphics requires 128-bit dual channel memory for optimal performance1 x Kensington Lock1 x 3-in-1 carder (Micro SD/Micro SDHC/Micro SDXC)19.5Vdc, 4.62A, 90W 120 x 130 x58 mm (0.9L)0.75 kg (barebone)4096 x 2160 @ 60 Hz 5120 x 2160 @ 60 Hz 1920 x 1200 @ 60 Hz0℃~50℃0%~95% Relative Humidity<38 dBA* Test results will vary slightly depending on the HDD/SSD SKU selected by customer-40℃~85℃<29 dBABSMI / CB / CE / FCC / UL / CCC / Energy Star / C-Tick / WiFi / RF / VCCIfTPM 2.0 or TPM 2.0 chip (Optional)64 Mb Flash ROM, UEFI AMI BIOS, PnP, DMI2.0, WfM2.0, SM BIOS 2.8, ACPI 5.0,Multi-language BIOS, ASUS EZ Flash 3, ASUS CrashFree BIOS 3, My Favorites, Quick Note andASUS DRAM SPD (Serial Presence Detect) memory information。

微星笔记本电脑

微星笔记本电脑

微星笔记本电脑
佚名
【期刊名称】《互联网周刊》
【年(卷),期】2004(000)041
【摘要】微星笔记本电恼新品510A和S250都采用了白色珠光漆表面。

【总页数】1页(P70)
【正文语种】中文
【中图分类】TP303
【相关文献】
1.新都市流行风——微星X-Slim X400笔记本电脑 [J],
2.来,战个痛快!微星GT60游戏笔记本电脑 [J], 张臻
3.微星可定制化游戏笔记本电脑-GX640 [J],
4.劲"风",为生活注入新能量MSi微星Wind系列百万纪念款超便携笔记本电脑
U135 [J],
5.劲“风”,为生活注入新能量——msi微星Wind系列百万纪念款超便携笔记本电脑U135 [J],
因版权原因,仅展示原文概要,查看原文内容请购买。

NVIDIA Maximus Technology for ANSYS Mechanical 详解说

NVIDIA Maximus Technology for ANSYS Mechanical 详解说

DU-06Use6467-001_v01 |er GuideSeptember 20112DOCUMENT CHANGE HISTORYDU-06467-001_v01Version Date Authors Description of Change01 August 3, 2012 Initial release02 September 10, 2012 EK, SP Minor edits, clarity regarding solver optimizationsTABLE OF CONTENTS Maximus Technology for ANSYS Mechanical (4)Prerequisite Skills (4)What This Document Contains (5)Benefits of Maximus Technology (5)OEMs for Maximus Technology (5)NVIDIA Maximus Technology (6)Maximus Computing Advantage (6)Elements of Maximus Technology (6)Basic Maximus Configuration (8)Maximus for ANSYS Mechanical (9)Enabling ANSYS Mechanical for Maximus (9)Monitoring GPU Activity with Maximus Configuration Utility (11)Supported Solver Types (12)Model Considerations (12)Troubleshooting (13)References (13)This document describes the basic settings, configuration, and monitoring of an NVIDIA® Maximus‐enabled workstation for ANSYS Mechanical solvers.This document does not replace any documentation provided by ANSYS for softwareofferings specific to CAE software. Refer to the documentation provided by ANSYS forANSYS software configurations.This document does not explain the fundamentals of ANSYS usage or the discipline ofCAE.PREREQUISITE SKILLSThis document is intended for persons responsible for optimizing a Maximus‐enabled workstation for ANSYS Mechanical. It is assumed the audience is familiar with, or has skilled experience with the following:④ANSYS Mechanical CAE Software④Computer Aided Engineering (CAE)④Graphics Processing Unit (GPU) functionality④Modern workstation terminology④Hardware connectivity④Physical system building skills④Thermal and electrical workstation system internals④Microsoft Windows configurationMaximus Technology for ANSYS MechanicalWHAT THIS DOCUMENT CONTAINSThis document provides an introduction to NVIDIA Maximus technology and how to enable your workstation and ANSYS Mechanical to use Maximus.④NVIDIA Maximus Technology starting on page 6 describes the benefits of NVIDIAMaximus technology, its key elements, and the basic system requirements forenabling Maximus on your workstation.④Maximus for ANSYS Mechanical starting on page 9 focuses on using Maximus withANSYS Mechanical. It explains how to enable Maximus for ANSYS Mechanical and monitor GPU activity. It identifies the solvers that are enabled for Maximus, describes model considerations, and troubleshooting tips when a solver workload does not perform to your expectations.④References on page 13 provides useful references to related documentation.BENEFITS OF MAXIMUS TECHNOLOGYFor a comprehensive overview of Maximus technology, its benefits, and how it is being used, go to /maximus.OEMS FOR MAXIMUS TECHNOLOGYA list of OEMs that carry Maximus platforms are listed at/maximus.This section describes the benefits of Maximus‐enabled workstations and applications, the key elements of Maximus technology, and the basic configuration for a Maximus‐enabled workstation.MAXIMUS COMPUTING ADVANTAGEIn the past, workstation architectures forced professionals to do graphics‐intensive and compute‐intensive work serially; often offline. NVIDIA Maximus technology represents a revolution for these professionals by enabling both tasks to be performed concurrently without experiencing any drop in performance.For example; a designer can work on design iteration B while running a simulation on design iteration A. Because these tasks are performed concurrently, it is possible to explore ideas faster and converge more quickly on the best possible answers. ELEMENTS OF MAXIMUS TECHNOLOGYMaximus is an enabling technology that brings together the professional 3D graphics capability of NVIDIA Quadro® GPUs with the massive parallel computing capabilities of the NVIDIA Tesla™ C2075 companion processors. Figure 1 illustrates the advantages of the Tesla processor.F F M QFFigure 1. igure 2 show Maximus ‐ena Quadro cardsFigure 2. Tesla Pe ws the perfor abled works s in the perfoSolidWor rformance rmance imp tation. The M ormance sca rks Scalingeprovements p Maximus co aling chart pg Chart possible with nfiguration lus oneTesl h ANSYS M can consist la card.Mechanical on of any ofthe n a eBASIC MAXIMUS CONFIGURATIONThis section describes hardware and software requirements for a Maximus‐enabled workstation running ANSYS Mechanical. Only the basic requirements are covered in this document. For further details about upgrading an eligible workstation to a Maximus configuration, refer to the NVI DIA Maximus System Builders’ Guide for Microsoft Windows 7‐64 document.Check that your system satisfies the following software and hardware requirements:④Microsoft Windows 7 – 64 bit operating system.④ANSYS Mechanical 14 with HPC License Pack. At the release date of this document,one HPC pack enables eight CPU cores and one entire GPU.④One NVIDIA Quadro card installed in the first x16 (x16 electrical) PCIe slot of thehost computer.④One NVIDIA Tesla card installed in the second x16 (x16 electrical) PCIe slot of thehost computerAfter ANSYS Mechanical becomes multi-GPU aware and if it is physically possible, youcan have more than one Tesla processor in your system. At the release date of thisdocument, ANSYS Mechanical is still single-GPU aware. Follow future announcementsfrom ANSYS and NVIDIA regarding multi-GPU awareness.At the release date of this document, Tesla C2075 is the only supported compute cardfor ANSYS Mechanical.NVIDIA recommends that no display device be connected to the Tesla C2075 DVI displayoutput.④NVIDIA Quadro/Tesla Driver 275.89, or newer ANSYS‐certified driver, correctlyinstalled. Refer to for a list of drivers for download④Correct installation and cabling with power connectors (as needed) of all NVIDIAgraphics cards. If you purchased your system from an OEM with the NVIDIA cards pre‐installed, no action is needed.No NVIDIA SLI (Scalable Link Interface) ribbon cable is necessary or required for aMaximus configuration.T ac n so E U 1.2.This section e ctivity. The s eed to be co olver worklo ENABLIN Use the follow . Select Tool . Select Solve explains how solvers that nsidered are oad that doe NG ANS wing proced s from the m e Process Set w to enable M can use Max e identified. es not perfor SYS MEC dure to enabl main menuttings… to dis Maximus for ximus are lis The section rm to your ex CHANIC le Maximus splay the Solv r ANSYS Me sted and cha also contain xpectations.AL FOR for ANSYS ve Process Se echanical an aracteristics ns trouble ‐shR MAXIM Mechanical ettings menund monitor G of models th hooting tips MUS :u .GPU hat for a3.4.5.6.7.. Check that . Click Adva . Select NVID . Click OK .. Open the A Search for displayed,* softwar * licens* ********BATCH M INPUT F 6 PA START-U STOP FI GPU ACC00000000 CURRENT Working to automatica provides th t My Compute nced… to dis DIA from the ANSYS Mec the text GPU , Maximus is re license ses). ********** ***** A MODE REQUE FILE COPY ARALLEL CP UP FILE MO ILE MODE CELERATOR 0 JOBNAME=f ogether with ally ensures he best perfo er is selected splay the Adv drop ‐down hanical solv U ACCELERA s not enabled agreement **********ANSYS COMMA STED (-b) MODE (-c) PUS REQUEST DE OPTION ENA VERSION=W file 14:22h ANSYS Me that ANSYS ormance.d on the Solv vanced Prope list of the Us ve.out file ATOR OPTIO d.t and FAR **********AND LINE A = NOLI = COPY TED= NORE = NORE ABLEDWINDOWS x62:46 OCT echanical so S Mechanica ve Process Set erties dialog se GPU accel to check tha ON ENABLED 12.212 (fo **********ARGUMENTS STYADAD4 RELE 24, 2011 C oftware, the M al runs on th Maximus fo ttings menu.menu.eration (if po at Maximus D . If this text or non-DOD ***************EASE= 13.0CP= 0Maximus dr he Tesla GPU or ANSYS Mech ossible) field.is enabled. string is not D ** * ******** UP201.811riverU. This settin hanical.t 101012 ngM UTumTcoFInerreMonitoriUtilityNVIDIA Mworkstatis accessQuadro dThe NVIDIAtility that prmemory andTypically, MCorrectly. FigFigure 3.n typical ANrror correctieduced by 13ng GPUMaximus Configtions only. Dowsible from in tdrivers.Maximus Crovides convutilization mCU is used ture 3 showsNVIDIA MNSYS Mechanon) off. Note3 percent.Activityguration Utilitwnload the MChe NVIDIA ConConfigurationvenient GPUmonitors foro ensure thas the MCU mMaximus Conical workfle that wheny with Mty (MCU) is suCU from http:ntrol Panel stan Utility (MCU processingr all supporteat ANSYS Mmenu page.onfiguratiolows, you haECC is on, aMaximuspported for M//www.nvidiaarting with thCU) is a sepcontrols. Thed GPUs inMechanical ison Utilityave the optioavailable meConfiguMaximus-enabl/maxime 304 releasearate graphihe MCU proa Maximus‐s using the syon to turn ECemory on thurationledmus. The MCUof theical softwareovides GPUenabled sysystem GPUsCC (memorye Tesla boarestem.syrd isThe MCU provides simple controls to enable or disable computational processing on an installed Quadro GPU. Use this feature to better tune the system for a particular workflow need.Supported Solver TypesANSYS Mechanical uses a companion Tesla GPU with a single job per GPU. The following ANSYS Mechanical solvers are Maximus‐enabled:④Direct sparse solver for SMP and distributed ANSYS④PCG and JCG iterative solvers for SMP and distributed ANSYSModel ConsiderationsSimulation models exist in a wide variety of sizes normally measured in degrees of freedom (DOF). Though all models may exhibit some level of GPU acceleration benefit, consideration should be given to the following factors to achieve maximum acceleration in ANSYS Mechanical:④Models that deploy the direct sparse solver:●Models with approximately 500 thousand to 8 million DOF typically yield the mostaccelerated performance.●All model sizes are supported, but for very large models beyond 8 million DOF,some work might exceed the 6GB GPU memory and therefore stay on the CPU.●Models should always run in‐core (system memory) to eliminate I/O.④Models that deploy the iterative PCG or JCG solver:●Models with approximately 500 thousand to 5 million DOF typically yield the mostaccelerated performance.●Model size must not exceed the 6GB memory or they will not run, and will need tobe restarted on CPUs‐only (ANSYS Mechanical will provide a message in this case).●The is no out‐of‐core option (models always runs in‐core for iterative solvers)●The MSAV option should be turned off, otherwise the GPU is deactivated. ANSYSWorkbench will automatically set MSAVE for models over 100,000 nodes.Solid structures always provide better performance than shell structures.TROUBLESHOOTINGThere may be times when a solver workload does not perform to your expectations. Following is a list of common items that typically hinder optimal performance of asolver on a Maximus‐enabled workstation:④The Tesla C2075 is not set to handle compute tasks.④ECC is turned ON for the Tesla C2075, or the Quadro 6000, or both. While enablingECC improves accuracy, it slows down performance.④The disk subsystem I/O rate is too slow or bandwidth is constrained.④There is not enough scratch disk space in the system.④The job unexpectedly runs out of core memory.④There is not enough memory in the system.④The ANSYS license does not provide support for Maximus.④The simulation job is too small. See “Model Considerations” on page 10.④MSAV option is set to ON.④Shell structure models are being used.④More CPUs are being used than necessary for the simulation job. More CPUs do notnecessarily add linearly to overall wall clock time performance.REFERENCES④ANSYS Support Documentation: Refer to /Support/Documentation ④NVIDIA Maximus Configuration Guide: Refer to NVIDIA Maximus System Builders’Guide for Microsoft Windows 7‐64NALDOWEXAInreriganwCoexHHDHDRNVcainThandeonprOOpTNVCoreC©oticeLL NVIDIA DESIGNOCUMENTS (TOGWARRANTIES, EXPXPRESSLY DISCLAPARTICULAR PUformation furnisesponsibility forghts of third parny patent rightsithout notice. Torporation produxpress written apDMIDMI, the HDMI lDMI Licensing LLOVI ComplianVIDIA Products tan only be sold ocorporate the dehis device is prond other intelleevice must be aunly, unless otherohibited.OpenCLpenCL is a traderademarksVIDIA, the NVIDorporation in theespective compaopyright2012 NVIDIA CorN SPECIFICATIONGETHER AND SEPPRESSED, IMPLIEAIMS ALL IMPLIEDRPOSE.shed is believedthe consequencrties that may rof NVIDIA CorpoThis publicationucts are not autpproval of NVIDIAogo, and High-DLC.nce Statemehat support Rovior distributed toevice into buyerotected by U.S. pctual propertyuthorized by ROVrwise authorizemark of Apple InDIA logo, Teslae U.S. and othenies with whichrporation. All rigNS, REFERENCE BPARATELY, “MATED, STATUTORY,D WARRANTIES Od to be accuratces of use of sucresult from its uoration. Specificsupersedes andthorized as critiA Corporation.Definition Multimnti Corporation’s Ro buyers with a’s products.patent numbersrights. The useVI Corporation and in writing bync. used under li, and Quadroer countries. Oththey are associaghts reserved.BOARDS, FILES, DTERIALS”) ARE B, OR OTHERWISOF NONINFRINGEte and reliable.ch information ose. No license iscations mentionereplaces all otical componentsmedia InterfaceRevision 7.1.L1 Avalid and existin6,516,132; 5,58e of ROVI Corpond is intended foROVI Corporatiicense to the Khare trademarksher company andated.DRAWINGS, DIAGBEING PROVIDEDE WITH RESPECEMENT, MERCHAN. However, NVIDor for any infrins granted by imed in this publicher informations in life supportare trademarksAnti-Copy Procesng authorization83,936; 6,836,54oration's copy por home and othion. Reverse enronos Group Inc.s and/or registd product nameGNOSTICS, LISTSD “AS IS.” NVIDICT TO THE MATNTABILITY, ANDDIA Corporationngement of pateplication of othcation are subjepreviously suppt devices or systor registered trss (ACP) encodinn from ROVI to p49; 7,050,698; aprotection technher limited pay-pngineering or di.ered trademarkes may be trade, AND OTHERIA MAKES NOTERIALS, ANDFITNESS FORassumes noents or othererwise underect to changeplied. NVIDIAtems withoutrademarks ofng technologypurchase andnd 7,492,896nology in theper-view usesisassembly isks of NVIDIAmarks of the。

MTEX_Intro_EBSD_2014_Pittsburgh

MTEX_Intro_EBSD_2014_Pittsburgh

Overview of the MATLAB® Environment or Matrix Laboratory : Strong choice
• Functions for integrating MATLAB based algorithms with external applications and languages, such as C, C++, FORTRAN, Java™ etc • Advantage – some speed critical functions are coded in C and compiled for MTEX)
and Tensors r = ix + jy +kz
Conversions in MTEX
%% Define hkl or uvw % pole to plane hkl h = h.a* + k.b* + l.c* h = Miller(1,1,1,CS,'Forsterite','hkl') % direction u = u.a + v.b + w.c u = Miller(1,1,1,CS,'Forsterite','uvw') % angles between h and v angle_between_h_and_u = angle(h,u)/degree %% conversion between hkl and uvw % N.B. converted uvw and hkl not always integer values % change hkl (h) to uvw uvw = uvw(h) % change uvw (u) to hkl hkl = hkl(u) %% conversion of hkl and uvw to specimen coordinates % N.B. converted uvw and hkl not always integer values % change hkl (h) to vector3d r1 % Miller indices h parallel to specimen direction r1 r1 = vector3d(h) % change uvw (u) to vector3d r2 % Miller indices u parallel to specimen direction r2 r2 = vector3d(u) %% conversion of specimen coordinates to hkl and uvw % N.B. converted uvw and hkl not always integer values % change vector3d(1,1,1) to hkl hkl_111 = Miller(vector3d(1,1,1),CS,'Forsterite','hkl') % change vector3d(1,1,1) to uvw uvw_111 = Miller(vector3d(1,1,1),CS,'Forsterite','uvw')

阿尔法冷 Eisbaer Pro Aurora 280 CPU 说明书

阿尔法冷 Eisbaer Pro Aurora 280 CPU 说明书

Alphacool Eisbaer Pro Aurora 280 CPUAlphacool article number: 11773The Alphacool Eisbaer Pro Aurora offers a much higher cooling surface than the normal Eisbaer Aurora. It was developed spe-cifically for extremely large CPU DIEs and covers processors such as the AMD Threadripper but also the AMD Ryzen CPUs com-pletely. The Eisbaer Pro is also designed for the Intel Sockets 3647 and 4189 to ensure the best possible cooling performance of the entire CPU.• Full copper radiator, Nickel-plated copper cooler• Virtually silent DC-LT2 pump• Hose length 40 cm• Digital RGB illuminated cooler and 140 mm fanCompatibility list1 x Mounting set for AMD TR4 / sTRX4 / SP31 x Mounting set for AMD AM41 x Mounting set for Intel 2011 / 2011-3 / 20661 x Mounting set for Intel 3647 Narrow & Square1 x Mounting set for Intel LGA 41891 x Mounting set for Intel LGA 17008 x M3x5 case mounting screws8 x M3x30 fan screws2 x 140 mm Aurora Rise fans 1 x Y -Adaptor 4-Pin PWM 1 x Digital RGB Controller 1 x 3-Pin JST to 3-Pin 5V adaptor 1 x Thermal compound 1 x Screw plug Tool 1 x Allen keyData Quick fastenersThe Alphacool Eisbaer Pro Aurora CPU AIO water cooler is a special development for processors with particularly large CPU dies. These include the AMD Threadripper and Epyc processors and the Intel CPUs for the LGA 3647 and LGA 4189 socket. With the optional XPX Pro AM4 mounting bracket, the Alphacool Eisbaer Pro CPU cooler can also be used on AMD Ryzen processors. Large cooling surfaceThe cold plate bottom covers the entire surface of the respective processors. The area of the cooling fins exceeds all known processor cores with an area of around 55 x 42 mm. This ensures that all hotspots of a CPU are directly covered and thus opti-mally cooled. With the additionally available AM4 bracket, cooling an AMD Ryzen processor is also child's play. The cooling fins are 0.4 mm thick and also have an optimal distance of 0.4 mm between them. In total there are 58 cooling fins on the bottom of the cooler. The bottom of the cooler is only 3 mm thick, which allows the heat to reach the water and be dissipated as quick-ly as possible.Copper radiatorAs per usual with Alphacool, the radiators are made of copper. Alphacool is the first manufacturer worldwide to use copper for all water bearing components such as the antechambers, the cooling fins and the cooling channels to which the fins are sol-dered. The connection threads are made of brass for strength reasons. In addition, the cooling fins are only lightly painted. On closer inspection the copper shimmers through a little. A thick lacquer coating would result in a reduction of the cooling capaci-ty. The fin density is at optimal 15FPI. Therefore the radiator works perfectly even at low airflow. A too high fin density would require fans with higher speed to achieve the same cooling capacity. A lower fin density would no longer benefit from fast ro-tating fans. So the golden mean was chosen.Real water coolingThe Eisbaer Pro Aurora consists almost entirely of actual water cooling components. The extremely robust and durable TPV hoses are used in the enterprise products for servers and workstations. The hose connections also come from the Enterprise series from Alphacool and use the standard G1/4". This makes the Eisbaer Pro Aurora fully compatible with all common water cooling products. The quick-release fastener allows easy expansion of the AIO with additional components. The most im-portant of these are the prefilled radiators and the Eiswolf GPU AIO water cooling system.Fan and lightingThe entire Eisbaer Aurora Pro cooler is equipped with addressable digital RGB LEDs. This gives a real eye-catcher in the Case. The fan used is the Aurora Rise with 140mm. Due to the special blade design, the fan is extremely quiet and the addressable RGB LEDs provide brilliant illumination. The Alphacool Aurora Rise fan convinces with a max. statistical pressure of 2.20 mm/ H2O and offers a max. air flow of 154.1 m3/h. The PWM control allows the fan to be controlled over a wide speed range. In ad-dition, it offers a zero control. It can therefore be regulated down to 0 rpm and then starts with approx. 350 rpm. Of course all Digital RGB LEDs can be controlled at will. Depending on the controller almost all effects are possible.How to connect everythingThe fans are normally controlled via a 4-pin PWM connector. An included Y-adapter for the fans makes it easy to connect them to the mainboard. This allows all fans to be controlled and regulated via one connector. Each fan has a 3-pin JST connector in-cluding Y-adapter for the LED illumination. This allows the fans to be connected directly together and can also be controlled simultaneously via a controller. For the connection to a typical 3-pin 5V connector a corresponding adapter is included. Alter-natively, the included Digital RGB controller can be used. The pump of the Eisbaer Aurora uses a 3-pin Molex connector. This can also be connected to the mainboard.The Eisbaer Pro Aurora is a true multi-talent. Expandable, fully compatible with DIY water cooling components and it is the optimal solution for the most powerful processors on the market.。

AMD FirePro W7100 8GB 高端工作站图形卡说明书

AMD FirePro W7100 8GB 高端工作站图形卡说明书

AMD FirePro W7100 8GB GraphicsAMD FirePro W7100 8GB Graphics J3G93AA INTRODUCTIONThe AMD FirePro™ W7100 workstation graphics delivers great performance, superb visual quality, and outstandingmulti-display capabilities. It is an excellent high-end solution for professionals who work with advanced visualization,complex models, large data sets, video editing and production.The AMD FirePro W7100 features AMD Eyefinity technology support for up to 4 directly attached independent monitors from a single graphics card. Also, the AMD FirePro W7100 is backed by 8GB of ultra-fast GDDR5 memory. PERFORMANCE AND FEATURES∙AMD Graphics Core Next (GCN) architecture designed to effortlessly balance GPU compute and 3D workloads efficiently∙Blazing compute performance powered by latest AMD GCN architecture yielding up to 3.0 TFLOPS of peak single precision and up to 200 GFLOPS peak double precision∙Optimized and certified for leading workstation ISV applications. The AMD FirePro™ professional graphic s family is certified on more than 100 different applications for reliable performance.∙GeometryBoost technology with dual primitive engines∙Four (4) native display DisplayPort 1.2a (with Adaptive-Sync) outputs with 4K resolution support∙AMD Eyefinity technology (see Note 1) support managing up to 6 displays seamlessly as though they were one display∙New Ultra HD Media Engine with more than 8x decode and 3x encode performance than the prior generation anddedicated Audio DSP’s enabling low power decode of t wo streams H.264 4K resolution at 60Hz content and 4Kencoding∙AMD PowerTune and AMD ZeroCore Power technologies that allow for state of the art dynamic power management of the GPU∙8GB of high speed GDDR5 memory∙PCI Express® 3.0 compliantCOMPATIBILITYThe AMD FirePro W7100 is supported on the following HP Z Workstations:- Z230 CMT, Z440, Z640, Z840SERVICE AQND SUPPORTThe AMD FirePro W7100 has a one-year limited warranty or the remainder of the warranty of the HP product in which it is installed. Technical support is available seven days a week, 24 hours a day by phone, as well as online support forums.Parts and labor are available on-site within the next business day. Telephone support is available for parts diagnosis and installation. Certain restrictions and exclusions apply.TECHNICAL SPECIFICATIONSForm Factor Full height, single slot (9.5” X 4.376”)Graphics Controller AMD FirePro W7100 graphicsGPU: 1792 Stream Processors organized into 28 Compute UnitsPower: <75 WattsCooling: ActiveBus Type PCI Express® x16, Generation 3.0Memory 8GB GDDR5 memoryMemory Bandwidth: up to 176 GB/sMemory Width: 256 bitConnectors 4x Display Port 1.2a connectors with HBR2 and MST support.Factory Configured: No video cable adapter includedAfter market option kit: No video cable adapter includedAdditional DisplayPort-to-VGA or DisplayPort-to-DVI adapters are available as FactoryConfiguration or Option Kit accessories.Maximum Resolution DisplayPort:- 4096x2160 @24bpp 60HzDual Link DVI:- 2560x1600 (requires DP to DL-DVI adapter)Single Link DVI:- 1920x1200 (requires DP to DVI adapter)VGA:- 1920x1200 (requires DP to VGA adapter)Image Quality Features Advanced support for 8-bit, 10-bit, and 16-bit per RGB color component.High bandwidth scaler for high quality up and downscalingDisplay Output Max number of monitors supported using DisplayPort 1.2a:- 4 direct attached monitors- 6 using DP 1.2a with MST and HBR2 enabled monitorsMonitor chaining from a single DisplayPort (subject to a max of 6 total monitors across alloutputs, requires use of DisplayPort enabled monitors supporting MST and HBR2):- one 4096x2160 display- two 2560x1600 displays- four 1920x1200 displaysShading Architecture Shader Model 5.0Supported Graphics APIs OpenGL 4.4OpenCL 1.2 and 2.0DirectX 11.2 / 12AMD MantleAvailable Graphics Drivers Windows 8.1 / 8 (64-bit and 32-bit)Windows® 7 (64-bit and 32-bit)LinuxHP qualified drivers may be preloaded or available from the HP support Web site:/country/us/en/support.htmlNotes 1. AMD Eyefinity technology supports up to six DisplayPort™ monitors on an enabled graphicscard. Supported display quantity, type and resolution vary by model and board design; confirmspecifications with manufacturer before purchase. To enable more than two displays, or multipledisplays from a single output, additional hardware such as DisplayPort-ready monitors orDisplayPort 1.2 MST-enabled hubs may be required. See /eyefinityfaq for fulldetails.2. OpenGL 4.4 support available with driver 14.301.xxx or later.3. OpenCL 2.0 support planned in driver updates for early 2015.4. For HP Z440 Workstation configurations, the HP Z4 Fan and Front Card Guide Kit, which isavailable both CTO (G8T99AV) and AMO (J9P80AA), is required.Summary of ChangesDescription of change: Date of change: VersionHistory:© Copyright 2014 Hewlett-Packard Development Company, L.P.The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. The information contained herein is subject to change without notice.。

Agilent I O Hardware 数据手册说明书

Agilent I O Hardware 数据手册说明书

82357A technical specificationsGeneral requirementsMinimum system requirements Windows 98(SE)/Me 2•PCI IEEE-488 interface for PCs•Transfer rates up to 900 KB/s•Dual processor support onWindows 2000/XPBest for•Maximum GPIB throughput forall configurationsHigh performance for manufacturingtest applicationsThe 82350B is Agilent’s highest-performance GPIB interface. Witha direct PCI computer connection,transaction overhead is minimizedfor the best overall performance.The 82350B card de-couples GPIBtransfers from PCI bus transfers.Buffering provides I/O and systemperformance that is superior to directmemory access (DMA). The hardwareis software configurable and compati-ble with the Plug-and-Play standardfor easy hardware installation. TheGPIB interface card plugs into a 5 voltPCI slot in the backplane of your PC.For programming capability youhave access with the latest versionof IO Libraries suite, version 14.1, toprogram in all standard developmentenvironments. Agilent’s IO LibrariesSuite 14.1 is easy to use and workswith virtually any vendor’s instrumentor T&M programming softwareapplication and includes automaticconfiguration for Agilent or NI VISA,NI-488.2, VISA COM or T&M ToolkitDirect IO. Even if you use NI IO soft-ware Agilent will configure automati-cally so as a user you do not have tobe concerned with the behind-the-scenes details.382350B technical specifications General requirements Minimum system requirements Windows 98(SE)/Me (note 98 supported with version 14.0 only)/2000/XP Software required Agilent IO Libraries Suite (included); see requirements on page 1PCI bus slot 5-V PCI slot, 32 bits Supported standards PCI rev 2.2IEEE 488.1 and IEEE 488.2 compatible General characteristics Power Backplane +5 V PCI Connectors Standard 24-pin GPIB (IEEE-488)+5V PCI Maximum data rate More than 900 KB/s Maximum instrument connection 14 instruments—daisy chain via GPIB Buffering Built-in Configuration Plug-and-Play EMC and safety *IEC 61326-1Group 1, Class A IEC 61010-1Warranty 1 year Dimensions Length, width, and height 122 mm (L) x 122 mm (W) x 22 mm (H) (a full-height PCI card)Weight 0.091 kg Environmental specifications Operating environment 0°C to 55°C Operating humidity Up to 90% at 40°C non-condensing Storage environment -40°C to +70°C Storage humidity Up to 90% at 65°C non-condensing * Additional detail and information in the Declaration of ConformityThis traditional GPIB connection still offers the highest throughputE5810A technical specifications 45USB port on your PC to up to fourRS-232 instruments or devices•Fully compatible with WindowsCOM driver and industry-standardVISA I/O software.Best for•Easy connection to RS-232 devices•Notebook computer RS-232connectionsAdd four serial ports in minutesThe Agilent E5805A USB/4-portRS232 interface provides a directconnection from the USB port onyour notebook or desktop PC to up tofour RS-232 instruments or devices.There are no switches to set, no PCcards to install, and no external powersupplies are required. Simply installthe driver and plug in the E5805AUSB 4-port RS232 interface to addfour RS-232 ports to your computer.Since the E5805A is a standardPlug-and-Play device, your computerautomatically detects and configuresit when it is connected to your com-puter USB port. You can interface upto four devices, with baud rates up to230 Kb/s per serial port. The E5805Aprovides four DB9 serial connectorsand ships with a 1.8-meter USB cable.E5813A technical specificationsGeneral requirements67Agilent Technologies’ Test and Measurement Support, Services, and Assistance Agilent Technologies aims to maximize the value you receive, while minimizing your risk and problems. We strive to ensure that you get the test and measurement capabilities you paid for and obtain the support you need. Our extensive support resources and services can help you choose the right Agilent products for your applications and apply them successfully. Every instru-ment and system we sell has a global warranty. Support is available for at least five years beyond the production life of the product. Two concepts underlie Agilent’s overall support policy: “Our Promise” and “Your Advantage.”Our Promise Our Promise means your Agilent test and measurement equipment will meet its advertised performance and functionality. When you are choosing new equipment,we will help you with product information, including realistic performance specifications and practical recom-mendations from experienced test engineers. When you receive your new Agilent equipment, we can help verify that it works properly, and help with initial product operation.Your AdvantageYour Advantage means that Agilent offers a wide range of additional expert test and measurement services, which you can purchase according to your unique technical and business needs. Solve problems efficiently and gain a competitive edge by contracting with us for calibration, extra-cost upgrades, out-of-warranty repairs, and onsite education and training, as well as design, system integration, project management, and other professional engineering services. Experienced Agilent engineers and techni-cians worldwide can help you maximize your productivity,optimize the return on investment of your Agilent instruments and systems, and obtain dependable measurement accuracy for the life of those products./find/emailupdates Get the latest information on the products and applications you /find/openAgilent Open simplifies the process of connecting and programming test systems to help engineers design,validate and manufacture electronic products. Agilentoffers open connectivity for a broad range of system-ready instruments, open industry software, PC-stan-dard I/O and global support, which are combined to more easily integrate test system development. For more assistance with your test & measurement needs or to find your local Agilent office go to /find/contactus Microsoft, Windows and Visual Studio are U.S. registered trademarks of Microsoft Corporation.Pentium is a U.S. registered trademark of Intel Corporation.Product specifications and descriptions in this document subject to change without notice.© Agilent Technologies, Inc. 2005Printed in USA, August 5, 20055989-1889EN Agilent Open Agilent Email Updates •Agilent E2094N IO Libraries Suite, Data sheet pub no. 5989-1439EN •Modern Connectivity–Using USB and LAN I/O Converters, Application note 1475-1pub no. 5989-0123EN •Simplified PC Connections for GPIB Instruments,Application note 1409-1, pub no. 5988-5897EN •Using LAN in Test Systems: The Basics,Application note 1465-9, pub no. 5989-1412ENpub no. 5989-1417EN •Computer I/O Considerations, Application note 1465-2, pub no. 5988-9818EN Learn more at /find/io-ds Join the Agilent Developer Network to get updated I/O software, instrument drivers, code examples,white papers, and more! Registration is easy and free at /find/adn.。

爱克斯板开发者套件数据手册说明书

爱克斯板开发者套件数据手册说明书

规格书
概述 CPU GPU 内存 存储 存储扩展 BIOS 系统支持 推理单元 CPU iGPU GNA I/O 接口 以太网 USB 无线模组 电源输入
其他
显示
显示接口
英特尔赛扬 N5105 2.0-2.9GHz (formerly Jasper Lake) 英特尔 UHD 集成显卡 24 个执行单元 450MHz-800MHz 板载 LPDDR4x 2933MHz, 4GB/6GB/8GB 板载 64GB eMMC 存储 1 * M.2 Key-M 2242, Support SATA&NVME AMI UEFI BIOS Ubuntu Windows 10/11
85x85mm Operation: 0℃ - 45℃ Storage: -10℃ - 75℃ 5%~95% RH (non-condensing)
DC 12V Lower than 18W
1
Power
2
Headset & mic 2-in-1 3.5mm jack
3
Type-C PD Power Input
3
Type-C PD 电源输入
4
40-Pin GPIO 排针
5
RJ45 千兆以太网
6
USB3.0 Type-A x 2
7
USB3.0 Type-A x 2
8
DP x 1 , HDMI x1
9
DC 12V 输入板载 1.25mm 接口
10
M.2 2242 存储扩展
关键组件
尺寸
AIxBoard Edge Developer Kit Datasheet
Key Components
Dimensions

NVIDIA RTX 5000 Ada 代辊GPU数据手册说明书

NVIDIA RTX 5000 Ada 代辊GPU数据手册说明书

NVIDIA RTX 5000 Ada Generation Performance for endless possibilities. DatasheetPowering the Next Era of InnovationIndustries are embracing accelerated computing and AI to tackle powerful dynamics and unlock transformative possibilities. Generative AI is reshapingthe way professionals create and innovate across various domains, from design and engineering to entertainment and healthcare. The NVIDIA RTX™ 5000 Ada Generation GPU, with third-generation RTX technology, unlocks breakthroughsin generative AI, revolutionizing productivity and offering unprecedented creative possibilities.The NVIDIA RTX 5000 Ada Generation GPU is purpose-built for today’s professional workflows. Built on the NVIDIA Ada Lovelace architecture, it combines 100 third-generation RT Cores, 400 fourth-generation Tensor Cores, and 12,800 CUDA® cores with 32 gigabytes (GB) of graphics memory to deliver the next generation of AI graphics and petaFLOPS inferencing performance, accelerating rendering, AI, graphics, and compute workloads. RTX 5000-powered workstations equip you for success in today’s demanding business landscape.NVIDIA RTX professional graphics cards are certified for a broad range of professional applications, tested by leading independent software vendors (ISVs) and workstation manufacturers, and backed by a global team of support specialists. Get the peace of mind to focus on what matters with the premier visual computing solution for mission-critical business.Key Features>PCIe Gen4>Four DisplayPort 1.4a connectors >AV1 encode and decode support >DisplayPort with audio>3D stereo support with stereo connector>NVIDIA® GPUDirect® for Video support>NVIDIA GPUDirect remote direct memory access (RDMA) support >NVIDIA Quadro® Sync II¹ compatibility>NVIDIA RTX Experience>NVIDIA RTX Desktop Manager software>NVIDIA RTX IO support>HDCP 2.2 support>NVIDIA Mosaic² technologyRendering**********************************************(5.2GHzTurbo), 64GB RAM, Windows 11 Enterprise x64, Chaos V-Ray v5.0,NVIDIA Driver 536.15. Relative speedup for 1920x1080 resolution,scene 12 pipeline subtest render time (seconds). Performance basedon pre-released build, subject to change.Omniverse**********************************************(5.2GHzTurbo), 64GB RAM, Windows 11 Enterprise x64, NVIDIA Driver528.49. CAD application performance based on internal testing ofNVIDIA Omniverse Create with several models of varying size andrender complexity. Performance is measured as frames renderedper second. NVIDIA DLSS 3 is enabled for NVIDIA RTX 5000 AdaGeneration GPUs, DLSS 2 enabled for non-Ada generation GPUs.Performance based on pre-released build, subject to change. Training**********************************************(5.2GHzTurbo), 64GB RAM, Windows 11 Enterprise x64, PyTorch v2.1.0,NVIDIA Driver 528.86. Relative speedup for JASPER TrainingPhase, precision = Mixed, batch size = 64. Performance based onpre-released build, subject to change.NVIDIA RTX 5000 Ada Generation | Datasheet | 1Ready to Get Started?To learn more about NVIDIA RTX 5000, visit:/rtx-50001 Quadro Sync II card sold separately. I2 Windows 10 and Linux. I3 Peak rates based on GPU boost clock. I4 Effective FP8teraFLOPS (TFLOPS) using sparsity. I 5 Display ports are on by default for RTX 5000. Display ports aren’t active when usingvGPU software. | 6 Virtualization support for the RTX 5000 Ada Generation GPU will be available in an upcoming NVIDIA vGPUrelease, anticipated in Q3, 2023. | 7 Product is based on a published Khronos specification and is expected to pass the Khronosconformance testing process when available. Current conformance status can be found at /conformance© 2023 NVIDIA Corporation. All rights reserved. NVIDIA, the NVIDIA logo, CUDA, GPUDirect, NVLink, Quadro, and RTX aretrademarks and/or registered trademarks of NVIDIA Corporation in the U.S. and other countries. Other company and productnames may be trademarks of the respective companies with which they are associated. All other trademarks are the propertyof their respective owners. 2788511. JUL23PNY Part Numbers VCNRTX5000ADA-PBYVCNRTX5000ADA-PBVCNRTX5000ADA-EDUVCNRTX5000ADA-BLKVCNRTX5000ADASYNC-PBGPU Memory32GB GDDR6Memory Interface256 bitMemory Bandwidth576GB/sError Correcting Code (ECC)YesNVIDIA Ada LovelaceArchitecture-Based CUDA Cores12,800NVIDIA Fourth-GenerationTensor Cores400NVIDIA Third-Generation RT Cores100Single-Precision Performance65.3 TFLOPS³RT Core Performance151.0 TFLOPS³Tensor Performance1044.4 TFLOPS4System Interface PCIe 4.0 x16Power Consumption Total board power: 250WThermal Solution ActiveForm Factor 4.4” H x 10.5” L, single slotDisplay Connectors4x DisplayPort 1.4a5Max Simultaneous Displays4x 4096 x 2160 @ 120Hz4x 5120 x 2880 @ 60Hz2x 7680 x 4320 @ 60HzEncode/Decode Engines2x encode, 2x decode (+AV1 encodeand decode)VR Ready YesvGPU Software Support6>NVIDIA vPC/vApps>NVIDIA RTX Virtual WorkstationvGPU Profiles Supported See the Virtual GPU licensing guide.Graphics APIs DirectX 12, Shader Model 6.7,OpenGL 4.67, Vulkan 1.37Compute APIs CUDA 12.2, OpenCL 3.0,DirectComputeNVIDIA NVLink ®NoGraphics**********************************************(5.2GHzTurbo), 64GB RAM, Windows 11 Enterprise x64, SPECviewperf2020, NVIDIA Driver 528.49. Relative speedup for 4K SiemensNX composite score. Performance based on pre-released build,subject to change.HPC**********************************************(5.2GHzTurbo), 64GB RAM, Windows 11 Enterprise x64, CUDA 11.8(cuBLAS performance), NVIDIA Driver 525.85. Relative speedupfor GFLOPS, precision = INT8, input = zero. Performance based onpre-released build, subject to change.Generative AI**********************************************(5.2GHzTurbo), 64GB RAM, Windows 11 Enterprise x64, Stable DiffusionWebUI v1.3.1, NVIDIA Driver 536.15. Relative speedup for512x512 image generation. Performance based on pre-releasedbuild, subject to change.。

MSI MEG Aegis Ti5 商品说明书

MSI MEG Aegis Ti5 商品说明书

PATH TO THE FUTUREThe Best desktop for gaming, MSI MEG Aegis Ti5, leads the trend ofthe future by bringing out the most powerful and interactivedesktop in the gaming industry. Equipped with the latest 10th GenIntel Core i9 K series, Nvidia Ampere, MSI GeForce RTX 30 seriesPicture and logosSELLING POINTSWindows 11 ProUp to 12th Generation Intel® Core™ i9 12900K gaming processor with DDR5 memoryUp to MSI GeForce RTX™ 3090 Graphics cardPCIe Gen 5 bandwidth support, improved workloads and render capabilities for enhanced gaming experience.Gaming Dial- Quickly and intuitively harness this gaming beastSilent Storm Cooling 4 - Excellent heat dissipation design to ensure smooth operation of the game visuals2.5G + 1G Dual LAN - None delaying gaming experienceWiFi 6E Technology wireless gaming with wired qualityMSI Mystic Light, customize your gaming colorAmbient Link support, immersive gaming experience1.1 x USB 3.2 Gen 1 Type A1 x Mic-in / 1x Headphone-out2.1 x USB 3.2 Gen 2 Type C1 x USB 3.2 Gen 1 Type A3.5x Audio jacks / 1 x Optical S/PDIF out. 1x RJ45 (2.5G LAN) /1x USB 3.1 Gen 1 Type A / 1x USB 3.1 Gen 2x2 Type C. 1xRJ45 (Gigabit LAN) / 2x USB 3.1 Gen 1 Type A. 1xThunderbolt 4 (optional)*. 1x HDMI™ out (2.0a). 1x PS/2Combo Port / 2x USB 2.0SPECIFICATIONOperating Systems Operating Systems Windows 11 Pro Barcode Info EAN4719072938499Model Part No9S6-B93911-073MKT Name MEG Aegis Ti5 12VTFMKT Spec MEG Aegis Ti5 12VTF-073IT Color ID1/Black-Black-BlackProcessor CPU Number Intel Core i9-12900KF CPU Clock 3.2GHzCPU Cores16,6TDP125WCache30 MB Intel® Smart Cache Threads24CPU Cooler Liquid coolingChipset Chipsets Z690Discrete Graphics VGA I/O Port HDMIx1, Display Portx3VGA MKT Name GeForce RTX 3080 Ti VENTUS 3X 12G OC GPU1 VRAM Size12GMemory Memory Size32GB(16GB*2) Memory Type DDR5 SDRAM Memory Speed2400(4800)MHz Module Type U-DIMM Memory Slot (Total/Free)4/2Max Capacity Max 128GBStorage SSD Size2TBHDD1 Size2TB*1SSD Config2TB*1SSD Interface PCIe GEN4x4 NVMe SSD Form Factor M.2-2280 M-KEY M.2 slots (Total/Free)3/2HDD1 RPM7200RPMHDD1 Form Factor 3.5 inchHDD1 Interface SATA GEN33.5" Drive Bays (Total/Free)1/02.5" Drive Bays (Total/Free)2/2ODD(Type)N/AODD Height N/AODD Type N/ACommunications LAN1x Intel I225-V+1x Intel I219-V WLAN INTEL/AX211.NGWG.NV WLAN Version Wi-Fi 6E+BTBT Version 5.2Audio Audio Chipset Realtek ALC1220P Audio Type7.1 Channel HD AudioI/O Ports (Front)Thunderbolt N/A USB 3.2 Gen 1 Type A2 USB 3.2 Gen 2 Type C1 Audio Mic-in1 Audio Headphone-out1I/O Ports (Rear)USB 3.2 Gen 2x2 Type C (R)1USB 3.2 Gen 2 Type A (R)3USB 2.0 Type A (R)2RJ452HDMI™ out1x (v2.0b) PS/21Audio jack5S/PDIF1Power Power850WPower Certification80PLUS Gold Formfactor SFXType POWER SUPPLYIn The Box Keyboard Interface N/A Mouse Interface N/A Power Cord1 AC Adaptor N/A Warranty Card1 Quick Guide2 User Manual N/A VESA Mount kit N/A Keyboard N/A Mouse N/ARegulatory Compliance Operating, Storage Temperature0° C ~ 35° C ; -20° C ~ 60° C Operating, Storage Humidity0% ~ 85%;0% ~ 90% Regulatory ComplianceFCC(Class B)CB/CEUL(CUL)BSMIVCCIDimension & Weight Product Dimension (WxDxH) (mm)551.3 x 239.9 x 511.6 Product Dimension (WxDxH) (inch)21.7 x 9.44 x 20.14 Inside Carton Dimension (WxDxH) (mm)686 x 357 x 673 Inside Carton Dimension (WxDxH) (inch)27.01 x 14.06 x 26.5 Outer Carton Dimension Standard (WxDxH) (mm)N/AOuter Carton Dimension Standard (WxDxH) (inch)N/AWeight (Net kg)15.15Weight (Gross kg)21.3Liter67Warranty Warranty N/A。

Digital+thermal+sensor

Digital+thermal+sensor

Temperature measurement in the Intel® Core TM DuoProcessorEfraim Rotem – Mobile Platform Group, Intel corporationJim Hermerding – Mobile platform Group, Intel corporationCohen Aviad - Microprocessor Technology Lab, Intel corporationCain Harel - Microprocessor Technology Lab, Intel corporationAbstractModern CPUs with increasing core frequency and power are rapidly reaching a point where the CPU frequency and performance are limited by the amount of heat that can be extracted by the cooling technology. In mobile environment, this issue is becoming more apparent, as form factors become thinner and lighter. Often, mobile platforms trade CPU performance in order to reduce power and manage thermals. This enables the delivery of high performance computing together with improved ergonomics by lowering skin temperature and reducing fan acoustic noise.Most of available high performance CPUs provide thermal sensor on the die to allow thermal management, typically in the form of analog thermal diode. Operating system algorithms and platform embedded controllers read the temperature and control the processor power. Improved thermal sensors directly translate into better system performance, reliability and ergonomics.In this paper we will introduce the new Intel® Core TM Duo processor temperature sensing capability and present performance benefits measurements and results.IntroductionToday’s high performance processors contain over a hundred million transistors, running in a frequency of several gigahertz. The power and thermal characteristics of these processors are becoming more challenging than ever before, and are likely to continue to grow with Moor’s low. Improvements in the cooling technology however, are relatively slow and do not follow Moor’s low. All computing segments face power and thermal challenges. In the server domain, the cost of electricity and air conditioning is one of the biggest expense items of a data center, and drives the need for low power high efficiency systems. In the mobile computing market, power and thermal management are the key limiter for delivering higher computational performance. Thin and light industrial designs are limited by the heat that can be extracted from the box. Ergonomic characteristics are also highly impacted by thermal considerations. The cooling fan is the major source of acoustic noise in the mobile system and external skin hot spots should be avoided for ergonomic reasons as well.The increasing demand for compute density brings the need for efficient thermal management schemes. Several such schemes have been proposed, for example DVS (dynamic frequency voltage scaling [1]). These mechanisms were implemented in CPUs such as the Intel® Centrino® Processor [2]. Most operating systems on the market support ACPI [3]. This is an industry standard infrastructure that enables thermal management of computer platforms. Thermal management is done by the use of active cooling devices, such as fans, or passive cooling actions such as DVS. Thermal management schemes accept user preferences for setting management policy. A computer user can select between high performance, energy conservation and improved ergonomics parameters.The basic feedback for most of the power and thermal management schemes is temperature measurement. Both Intel® processors [4] and others [5], incorporate temperature sensor on the die to allow thermal measurement, typically in the form of analog thermal diode. The voltage on a diode junction is a function of the junction temperature. The diode is routed to external pins and an A/D chip on the platform converts the voltage into temperature reading. The Intel® Centrino processor [2] introduced a fixed thermal sensor, tuned to the max specified junction temperature. In case of abnormal conditions, such as cooling system malfunction, the circuitasserts a signal that activates a programmable self management power saving action that protects the CPU from operating out of its specified thermal range. It is apparent that the accuracy of the thermal measurements directly impacts the performance of the thermal management system and the performance of the CPU. In mobile computers, 1.5o C accuracy in temperature measurement is equivalent to 1 Watt of CPU power. In desk-top computers the impact is even higher due to the lower thermal resistance and 1o C accuracy translates into 2 Watt of CPU power.There are several causes for temperature measurement inaccuracy:1.Parameter variance: The thermal diode is not idealand during the manufacturing process, there are variations in the diode parameters that translate into reading variations. An offset value is programmed into the Intel® Core™ Duo, to be used by the A/D to generate accurate readings.2.A/D accuracy: Some errors are associated with theanalog to digital conversion due to design and technology limitations as well as quantization errors.The best temperature A/Ds available on the market today provide +/- ½o C accuracy.3.Proximity to the hot spot: CPU performance andreliability is limited by the temperature of the hottest location on the die. Thermal diode placement is limited by routing and I/O considerations and usually cannot be placed at the hottest spot on the die. Furthermore, the hot spot tends to shift around as a function of the workload of the CPU. It is not rare to find temperature difference as high as 10o C between a diode and the hot spot.4.Manufacturing temperature control: Parts are testedfor functionality and reliability at the max temperature specifications. Variations in test temperature drive a need for additional guard-band in the temperature control set points.The speed of response to temperature changes also impacts thermal management performance. The Intel®Core TM Duo processor has implemented a new digital temperature reading capability to address the accuracy and response time limitations of existing solutions. The rest of the paper will describe the implementation of the digital sensor and the measured results of it’s performance. The Intel® Core ™ Duo digital sensor (DTS) The general structure of the digital thermometer of the Intel® Core™ Duo [7] is described in Figure 1. In addition to the analog thermal diode, multiple sensing devices are distributed on the die in all the hot spots. An internal A/D circuit converts each sensor into a 7 bit digital reading. The temperature reading is calculated as an offset from the maximum specified Tj, e.g. 0 indicated that the CPU is at it’s maximum allowable Tj, 1 indicated 1o C below etc. All temperature readings are combined together into a single value, indicating the temperature of the hottest spot on die. The Intel®Core TM Duo is a dual core CPU. The DTS offers the ability to read temperature for each core independently and to read the maximum temperature for the entire package. To achieve measurement accuracy, each sensor is calibrated at test time. Calibration is done for the Maximum Tj and the linearity of the readout slope. The temperature reading is post processed for filtering out random noise and generating the H/W activated thermal protection functions. The DTS implementation on the Intel® Core TM Duo processor supports the legacy Intel Centrino® thermal sensor and fixed function thresholds PROCHOT and THERMTRIP [2].Figure 1: Digital Thermometer Block Diagram PROCHOT is a fixed temperature threshold calibrated to trip at the max specified junction temperature. Upon crossing this threshold, a H/W power reduction action is initiated, reducing the frequency and voltage, keeping the CPU within functionality and reliability limits. A properly designed cooling system with thermal management shouldnot activate the H/W protection mechanisms. Some aggressive platform designs however, may need occasional H/W initiated action due to long response time. On most operating systems, interrupt latency is not guaranteed and therefore, S/W based control may respond too slow. Other actions have inherent long delays. The time extending from activation of a fan and until its maximum speed is reached may be too long. Aggressive thermal design, together with a slow cooling response may cause thermal excursions that may compromise reliability and functionality. It is possible to design a system with enough margins to avoid such cases, but this comes at a cost of performance or compromised ergonomic characteristics. H/W based protection enables better user experience without compromising the device reliability and performance.THERMTRIP is a catastrophic shut down event, both on the CPU and for the platform. It identifies thermal runaway in case of cooling system malfunction and turns off the CPU and platform voltages, preventing meltdown and permanent damage.A new functionality of the DTS on the Intel® Core TM Duo is out of spec indication. It is possible for the CPU to operate within specifications while at maximum Tj. Out of spec indication is a notification to the operating system that a malfunction occurred, junction temperature is rising and a graceful shut down is required while functionality is still guaranteed and user data can be saved.In order to perform S/W and ACPI thermal control functions, the DTS offers interrupt generation capability, in addition to the temperature reading. Two S/W programmable thresholds are loaded by S/W and a thermal interrupt is generated upon threshold crossing. This thermal event generates an interrupt to single or both cores simultaneously according to the APIC settings.The digital thermometer is the basis for software thermal control such as the ACPI. In the ACPI infrastructure, thermal management is done by assigning a set of policies or actions to temperature thresholds. A policy can be active, such as activating fan in various speeds (_ACx), or passive (_PSV), by reducing the CPU frequency. Interrupt thresholds are defined to indicate upper and lower temperatures thresholds. An example of digital thermometer usage is given in Figure 2._TMP=60Figure 2: Digital thermometer and ACPIIn the above example the current die temperature is at 60o C. The thresholds set to 5o C above and below the current temperature. If the temperature rises above 65o C, an interrupt is generated, notifying the S/W of a significant change in temperature. The control software reads the temperature and identifies the new temperature and initiates action if needed. In the above example, 65o C requires activating a fan at a low speed. The activation thresholds and policies are defined at system configuration and communicated to the ACPI. Upon interrupt servicing, new thresholds are written around the new temperature to further track temperature changes. Small hysteresis values are applied to prevent frequent interrupts around a threshold point.Measurements and resultsIn previous Pentium™ - M systems, a single analog thermal diode was used to measure die temperature. Thermal diode cannot be located at the hottest spot of the die due to design limitations. To perform thermal management activities, some fixed offset was applied to the measured temperature, to keep the CPU within specifications. With the increasing performance and power density of the Intel® Core TM Duo, the performance implications of guard bands increase. Figure 3 shown measured die temperature of different workloads. It can be seen that the hot spot of the die moves to different locations depending on the nature of the workload.Die Hot-SpotCore #2Core #1CacheFigure 3: Die hot spots at different workloadsFigure 3 demonstrates a shift of the hot spot in a dual core workload. A workload that stresses the floating point unit which is a high power operation, will generate hot spot near the floating point while other workloads will stress different locations on the die. Figure 4 shows the thermal impact of single core applications.Figure 4: Thermal behavior of a single core applicationIt can be noted that a single diode cannot capture themaximal die temperature. Placing a diode between the cores, results in non optimal location as this is a relatively cold area of the die in single thread workloads. Workloads can be migrated by the operating system scheduler from one core to the another on the same die and therefore a symmetrical sensor placement is required.In order to evaluate the DTS temperature reading, we performed a study to identify the impact of different workloads on the difference between diode and the hot spot, as measured by the DTS. A set of workloads including all SPEC-2K components and other popular benchmarks and applications, at single thread and multi-thread were executed on the CPU. Several iterations were done to reach a thermal steady state and then the diode and DTS temperatures were measured. Before taking the measurement, a calibration process has been performed, leaving only the temperature offset. As described earlier, both external A/D and internal DTS have some inaccuracies. Calibration procedure is needed to equalize DTS and diode temperature readings and measure temperature offsets only. Figure 5 shows the offset between the analog diode and the hot spot, as measured by the DTS. The horizontal axis represents the hot spot temperature as a percentage of the max temperature. The vertical axis shows the temperature offset between the diode and the hot spot. Each point on the chart represents a single application.It can be seen that large temperature gradients exist on the die. It also can be noted that some workloads display high temperature gradients while other have no offset. Thermal control algorithms need to prevent the hot spot from exceeding the max temperature specification. It is possible to mitigate the temperature difference by applying a fixed offset to the diode reading. This obviously is a non optimal solution as the workloads with low offset will be panelized by the unnecessary temperature offset. The use of digital thermometer provides improved temperature reading, enables higher CPU performance within thermal limitations and improves reliability.Figure 5: Diode to DTS Temp. differencePrevious studies [6] have shown that temperature reduction directly translates into performance degradation. The above chart represents 3%-7% reduction in performance due to temperature measurement offset. Building a thermal management system around a thermal diode, with the characteristics shown in Figure 5 requires temperature guard-band. This guard band can be applied to the control set point, and as a result, the workloads that generate high offset temperatures result in lost performance. A different approach can set the Tj threshold assuming that the diode represents the correct die temperature. Some of the workloads will run at high max Tj and therefore risk functional issues or reliability degradation.The DTS also reduces the other temperature readings errors, which are not shown in this paper. The DTS is calibrated at manufacturing conditions and the reference point is set to this test temperature. Functionality, electrical specifications and reliability commitments are guaranteed at maximum Tj as measured by the DTS. Any test inaccuracy or parameters variance are already accounted for in the DTS set point.Summary and conclusionsWith the increasing demand for computational density and the increase in CPU transistors and frequency, power and thermal are the key limiters for providing computing performance. In recent years, thermal management has become a fundamental function of computer platform. The input to every thermal management scheme is a thermal sensor. We have shown that thermal sensor accuracy translates into power, which in turn translates into better CPU performance. Legacy analog thermal sensors incur inaccuracies due to parameter distribution and temperature offset from the hot spot. In this paper we introduced the new digital thermal sensor (DTS) of the Intel® Core® Duo processor. We showed that multiple sense point on various hot spots of the die, together with on die A/D converter provide improved temperature reading. The better accuracy translates either into 3%-7% higher performance or into improved ergonomics. The introduction of dual core References[1] D. Brooks, M. Martonosi, ”Dynamic Thermal Management for High-Performance Microprocessors” Proceedings of the HPCA-07, January 2001[2] Intel® Pentium® M processor product specifications /design/mobile/datashts/302189 08.pdf[3] Advanced Configuration and Power Interface./ acpi/.[4] Intel SpeedStep Technology,/support/processors/mobile/pentiu miii/ss.htm[5] D. Pham1, S. Asano, et. al., “The design and implementation of a first-generation CELL processor”, Proceedings of ISSCC 2005.[6] E. Rotem, A. Naveh, et al., “Analysis of Thermal Monitor features of the Intel Pentium M Processor”, Proceedings of TACS-01, ISCA-31, 2004.[7]A. Naveh, E. Rotem, et al.,”Power and Thermal Management in the Intel® Core™ Duo” , Intel Technology Journal Vol. 10 #2, 2006. ITJ MY。

MPI TITAN RF Probe Selection Guide

MPI TITAN RF Probe Selection Guide

MPI Probe Selection GuideWith a critical understanding of the numerous measurement challenges associated with today’s RF ap-plications, MPI Corporation has developed TITAN™ RF Probes, a product series specifically optimized for these complex applications centered upon the requirements of advanced RF customers.TITAN™ Probes provide the latest in technology and manufacturing advancements within the field of RF testing. They are derived from the technology transfer that accompanied the acquisition of Allstron, then significantly enhanced by MPI’s highly experienced RF testing team and subsequently produced utilizing MPI’s world class MEMS technology. Precisely manufactured, the TITAN™ Probes include matched 50 Ohm MEMS contact tips with improved probe electrical characteristics which allow the realization of unmat -ched calibration results over a wide frequency range. The patented protrusion tip design enables small passivation window bond pad probing, while significantly reducing probe skate thus providing the out -standing contact repeatability required in today’s extreme measurement environments. TITAN TM Probes with all their features are accompanied by a truly affordable price.The TITAN™ Probe series are available in single-ended and dual tip configurations, with pitch range from 50 micron to 1250 micron and frequencies from 26 GHz to 110 GHz. TITAN™ RF Probes are the ideal choice for on-wafer S-parameter measurements of RF, mm-wave devices and circuits up to 110 GHz as well as for the characterization of RF power devices requiring up to 10 Watts of continuous power. Finally, customers can benefit from both long product life and unbeatable cost of ownership which they have desired foryears.Unique design of the MEMS coplanar contacttip of the TITAN™ probe series.DC-needle-alike visibility of the contact point and the minimal paddamage due to the unique design of the tipAC2-2 Thru S11 Repeatability. Semi-Automated System.-100-80-60-40-200 S 11 E r r o r M a g n i t u d e (d B )Frequency (GHz)Another advantage of the TITAN™ probe is its superior contact repeatability, which is comparable with the entire system trace noise when measured on the semi-automated system and on gold contact pads.CROSSTALKCrosstalk of TITAN™ probes on the short and the bare ceramic open standard of 150 micron spacing compared to conventional 110 GHz probe technologies. Results are corrected by the multiline TRL calibration. All probes are of GSG configuration and 100 micron pitch.-80-60-40-200Crosstalk on Open. Multiline TRL Calibration.M a g (S21) (d B )Frequency (GHz)-80-60-40-200Crosstalk on Short. Multiline TRL Calibration.M a g (S21) (d B )Frequency (GHz)The maximal probe c ontac t repeatability error of the c alibrate S11-parameter of the AC2-2 thru standard by T110 probes. Semi-automated system. Ten contact circles.Cantilever needle material Ni alloy Body materialAl alloy Contact pressure @2 mils overtravel 20 g Lifetime, touchdowns> 1,000,000Ground and signal alignment error [1]± 3 µm [1]Planarity error [1] ± 3 µm [1]Contact footprint width < 30 µm Contact resistance on Au < 3 mΩThermal range-60 to 175 °CMechanical CharacteristicsAC2-2 Thru S21 Repeatability. Manual TS50 System.-100-80-60-40-200S 21 E r r o r M a g n i t u d e (d B )Frequency (GHz)MECHANICAL CHARACTERISTICSThe maximal probe c ontac t repeatability error of the c alibrate S21-parameter of the AC2-2 thru standard by T50 probes. Manual probe system TS50.26 GHZ PROBES FOR WIRELESS APPLICATIONSUnderstanding customer needs to reduce the cost of development and product testing for the high competitive wireless application market, MPI offers low-cost yet high-performance RF probes. The specifically developed SMA connector and its outstanding transmission of electro-magnetic waves through the probe design make these probes suitable for applications frequencies up to 26 GHz. The available pitch range is from 50 micron to 1250 micron with GS/SG and GSG probe tip configurations. TITAN™ 26 GHz probes are the ideal choice for measurement needs when developing components for WiFi, Bluetooth, and 3G/4G commercial wireless applications as well as for student education.Characteristic Impedance 50 ΩFrequency rangeDC to 26 GHz Insertion loss (GSG configuration)1< 0.4 dB Return loss (GSG configuration)1> 16 dB DC current ≤ 1 A DC voltage ≤ 100 V RF power, @10 GHz≤ 5 WTypical Electrical Characteristics26 GHz Probe Model: T26Connector SMAPitch range50 µm to 1250 µm Standard pitch step from 50 µm to 450 µm from 500 µm to 1250 µm25 µm step 50 µm stepAvailable for 90 µm pitch Tip configurations GSG, GS, SG Connector angleV-Style: 90-degree A-Style: 45-degreeMechanical CharacteristicsT26 probe, A-Style of the connectorTypical Electrical Characteristics: 26 GHz GSG probe, 250 micron pitchPROBES FOR DEVICE AND IC CHARACTERIZATION UP TO 110 GHZTITAN™ probes realize a unique combination of the micro-coaxial cable based probe technology and MEMS fabricated probe tip. A perfectly matched characteristic impedance of the coplanar probe tips and optimized signal transmission across the entire probe down to the pads of the device under test (DUT) result in excellent probe electrical characteristics. At the same time, the unique design of the probe tip provides minimal probe forward skate on any type of pad metallization material, therefo -re achieving accurate and repeatable measurement up to 110 GHz. TITAN™ probes are suitable for probing on small pads with long probe lifetime and low cost of ownership.The TITAN™ probe family contains dual probes for engineering and design debug of RF and mm-wave IC’s as well as high-end mm-wave range probes for S-parameter characterization up to 110 GHz for modeling of high-performance microwave devices.Characteristic Impedance 50 ΩFrequency rangeDC to 40 GHz Insertion loss (GSG configuration)1< 0.6 dB Return loss (GSG configuration)1> 18 dB DC current ≤ 1 A DC voltage ≤ 100 V RF power, @10 GHz≤ 5 WTypical Electrical Characteristics40 GHz Probe Model: T40Connector K (2.92 mm)Pitch range50 µm to 500 µmStandard pitch step For GSG configuration:from 50 µm to 450 µm from 500 µm to 800 µmFor GS/SG configuration:from 50 µm to 450 µm 25 µm step 50 µm stepAvailable for 90 µm pitch25 µm stepAvailable for 90/500 µm pitch Tip configurations GSG, GS, SG Connector angleV-Style: 90-degree A-Style: 45-degreeMechanical CharacteristicsTypical Electrical Characteristics: 40 GHz GSG probe, 150 micron pitchT40 probe, A-Style of the connectorCharacteristic Impedance50 ΩFrequency range DC to 50 GHz Insertion loss (GSG configuration)1< 0.6 dB Return loss (GSG configuration)1> 17 dBDC current≤ 1 ADC voltage≤ 100 VRF power, @10 GHz≤ 5 W Typical Electrical Characteristics Connector Q (2.4 mm)Pitch range50 µm to 250 µm Standard pitch stepFor GSG configuration: from 50 µm to 450 µm For GS/SG configuration: from 50 µm to 450 µm 25 µm stepAvailable for 90/500/550 µm pitch 25 µm stepAvailable for 90/500 µm pitchTip configurations GSG, GS, SG Connector angle V-Style: 90-degreeA-Style: 45-degreeMechanical CharacteristicsT50 probe, A-Style of the connectorTypical Electrical Characteristics: 50 GHz GSG probe, 150 micron pitchCharacteristic Impedance50 ΩFrequency range DC to 67 GHz Insertion loss (GSG configuration)1< 0.8 dB Return loss (GSG configuration)1> 16 dBDC current≤ 1 ADC voltage≤ 100 VRF power, @10 GHz≤ 5 W Typical Electrical Characteristics Connector V (1.85 mm)Pitch range50 µm to 250 µm Standard pitch stepFor GSG configuration: from 50 µm to 400 µm For GS/SG configuration: from 50 µm to 250 µm 25 µm step Available for 90 µm pitch25 µm step Available for 90 µm pitchTip configurations GSG Connector angle V-Style: 90-degreeA-Style: 45-degreeMechanical CharacteristicsT67 probe, A-Style of the connectorTypical Electrical Characteristics: 67 GHz GSG probe, 100 micron pitchCharacteristic Impedance 50 ΩFrequency rangeDC to 110 GHz Insertion loss (GSG configuration)1< 1.2 dB Return loss (GSG configuration)1> 14 dB DC current ≤ 1 A DC voltage ≤ 100 V RF power, @10 GHz≤ 5 WTypical Electrical CharacteristicsMechanical CharacteristicsTypical Electrical Characteristics: 110 GHz GSG probe, 100 micron pitchT110 probe, A-Style of the connectorCharacteristic impedance50 ΩFrequency range DC to 220 GHz Insertion loss (GSG configuration)1< 5 dB Connector end return loss(GSG configuration)1> 9 dBTip end return loss(GSG configuration)1> 13 dBDC current≤ 1.5 ADC voltage≤ 50 V Typical Electrical CharacteristicsConnector Broadband interface Pitch range50/75/90/100/125 µm Temperature range -40 ~ 150 ºC Contact width15 µmquadrant compatible(allowing corner pads)Yes recommended pad size20 µm x 20 µm recommended OT (overtravel)15 µmcontact resistance(on Al at 20 ºC using 15 µm OT)< 45 mΩlifetime touchdowns(on Al at 20 ºC using 15 µm OT)> 200,000Mechanical CharacteristicsT220 probe, broadband interface Typical Performance (at 20 ºC for 100 µm pitch)BODY DIMENSIONS PROBES Single-Ended V-StyleT220 GHz Probe1.161.1628.328437.455.6512.5527.73Single-Ended A-StyleCALIBRATION SUBSTRATESAC-series of calibration standard substrates offers up to 26 standard sets for wafer-level SOL T, LRM probe-tip cali -bration for GS/SG and GSG probes. Five coplanar lines provide the broadband reference multiline TRL calibration as well as accurate verification of conventional methods. Right-angled reciprocal elements are added to support the SOLR calibration of the system with the right-angled configuration of RF probes. A calibration substrate for wide-pitch probes is also available.Material Alumina Elements designCoplanarSupported calibration methods SOLT, LRM, SOLR, TRL and multiline TRL Thickness 635 µmSizeAC2-2 : 16.5 x 12.5 mm AC3 : 16.5 x 12.5 mm AC5 : 22.5 x 15 mm Effective velocity factor @20 GHz0.45Nominal line characteristic impedance @20 GHz 50 ΩNominal resistance of the load 50 ΩTypical load trimming accuracy error ± 0.3 %Open standardAu pads on substrate Calibration verification elements Yes Ruler scale 0 to 3 mm Ruler step size100 µmCalibration substrate AC2-2Probe Configuration GSGSupported probe pitch100 to 250 µm Number of SOL T standard groups 26Number of verification and calibration lines5Calibration substrate AC-3Probe Configuration GS/SG Supported probe pitch50 to 250 µm Number of SOL T standard groups 26Number of verification and calibration lines5Calibration substrate AC-5Probe Configuration GSG, GS/SG Supported probe pitch250 to 1250 µm Number of SOL T standard groups GSG : 7GS : 7SG : 7Open standardOn bare ceramic Number of verification and calibration linesGSG : 2GS : 1Typical characteristics of the coplanar line standard of AC2-2 calibration substrate measured using T110-GSG100 probes, and methods recommended by the National Institute of Standard and Technologies [2, 3].2468(d B /c m )F requency (G Hz)α-6-4-202I m a g (Z 0) ()F requency (G Hz)AC2-2 W#006 and T110A-GSG100Ω2.202.222.242.262.282.30 (u n i t l e s s )F requency (G Hz)β/βо4045505560R e a l (Z 0) ()F requency (G Hz)ΩTypical Electrical CharacteristicsMPI QAlibria® RF CALIBRATION SOFTWAREMPI QAlibria® RF calibration software has been designed to simplify complex and tedious RF system calibration tasks. By implementing a progressive disclosure methodology and realizing intuitive touch operation, QAlibria® provides crisp and clear guidance to the RF calibration process, minimizing con-figuration mistakes and helping to obtain accurate calibration results in fastest time. In addition, its concept of multiple GUI’s offers full access to all configuration settings and tweaks for advanced users. QAlibria® offers industry standard and advanced calibration methods. Furthermore, QAlibria® is integrated with the NIST StatistiCal™ calibration packages, ensuring easy access to the NIST mul-tiline TRL metrology-level calibration and uncertainty analysis.MPI Qalibria® supports a multi-language GUI, eliminating any evitable operation risks and inconvenience.SpecificationsRF AND MICROWAVE CABLESMPI offers an excellent selection of flexible cables and acces-sories for RF and mm-wave measurement applications forcomplete RF probe system integration.CablesHigh-quality cable assemblies with SMA and 3.5 mm connectorsprovide the best value for money, completing the entry-level RFsystems for measurement applications up to 26 GHz. Phase stab-le high-end flexible cable assemblies with high-precision 2.92, 2.4, 1.85 and 1 mm connectors guarantee high stability, accuracy and repeatability of the calibration and measurement for DC applications up to 110 GHz.MPI offers these cable assemblies in two standard lengths of 120 and 80 cm, matching the probe system’s footprint and the location of the VNA.Cables Ordering InformationMRC-18SMA-MF-80018 GHz SMA flex cable SMA (male) - SMA (female), 80 cmMRC-18SMA-MF-120018 GHz SMA flex cable SMA (male) - SMA (female), 120 cmMRC-26SMA-MF-80026 GHz SMA flex cable SMA (male) - SMA (female), 80 cmMRC-26SMA-MF-120026 GHz SMA flex cable SMA (male) - SMA (female), 120 cmMRC-40K-MF-80040 GHz flex cable 2.92 mm (K) connector, male-female, 80 cm longMRC-40K-MF-120040 GHz flex cable 2.92 mm (K) connector, male-female, 120 cm longMRC-50Q-MF-80050 GHz flex cable 2.4 mm (Q) connector, male-female , 80 cm longMRC-50Q-MF-120050 GHz flex cable 2.4 mm (Q) connector, male-female , 120 cm longMRC-67V-MF-80067 GHz flex cable 1.85 mm (V) connector, male-female, 80 cm longMRC-67V-MF-120067 GHz flex cable 1.85 mm (V) connector, male-female, 120 cm longMMC-40K-MF-80040 GHz precision flex cable 2.92 mm (K) connector, male-female, 80 cm long MMC-40K-MF-120040 GHz precision flex cable 2.92 mm (K) connector, male-female, 120 cm long MMC-50Q-MF-80050 GHz precision flex cable 2.4 mm (Q) connector, male-female , 80 cm long MMC-50Q-MF-120050 GHz precision flex cable 2.4 mm (Q) connector, male-female , 120 cm long MMC-67V-MF-80067 GHz precision flex cable 1.85 mm (V) connector, male-female, 80 cm long MMC-67V-MF-120067 GHz precision flex cable 1.85 mm (V) connector, male-female, 120 cm long MMC-110A-MF-250110 GHz precision flex cable 1 mm (A) connector, male-female, 25 cm longMPI Global PresenceDirect contact:Asia region: ****************************EMEA region: ******************************America region: ********************************MPI global presence: for your local support, please find the right contact here:/ast/support/local-support-worldwide© 2023 Copyright MPI Corporation. All rights reserved.[1] [2][3] REFERENCESParameter may vary depending upon tip configuration and pitch.R. B. Marks and D. F. Williams, "Characteristic impedance determination using propagation constant measu -rement," IEEE Microwave and Guided Wave Letters, vol. 1, pp. 141-143, June 1991.D. F. Williams and R. B. Marks, "Transmission line capacitance measurement," Microwave and Guided WaveLetters, IEEE, vol. 1, pp. 243-245, 1991.AdaptersHigh-In addition, high-quality RF and high-end mm-wave range adapters are offered to address challenges ofregular system reconfiguration and integration with different type of test instrumentation. MRA-NM-350F RF 11 GHz adapter N(male) - 3.5 (male), straight MRA-NM-350M RF 11 GHz adapter N(male) - 3.5 (female), straightMPA-350M-350F Precision 26 GHz adapter 3.5 mm (male) - 3.5 mm (female), straight MPA-350F-350F Precision 26 GHz adapter 3.5 mm (female) - 3.5 mm (female), straight MPA-350M-350M Precision 26 GHz adapter 3.5 mm (male) - 3.5 mm (male), straight MPA-292M-240F Precision 40 GHz adapter 2.92 mm (male) - 2.4 mm (female), straight MPA-292F-240M Precision 40 GHz adapter 2.92 mm (female) - 2.4 mm (male), straight MPA-292M-292F Precision 40 GHz adapter 2.92 mm (male) - 2.92 mm (female), straight MPA-292F-292F Precision 40 GHz adapter 2.92 mm (female) - 2.92 mm (female), straight MPA-292M-292M Precision 40 GHz adapter 2.92 mm (male) - 2.92 mm (male), straight MPA-240M-240F Precision 50 GHz adapter 2.4 mm (male) - 2.4 mm (female), straight MPA-240F-240F Precision 50 GHz adapter 2.4 mm (female) - 2.4 mm (female), straight MPA-240M-240M Precision 50 GHz adapter 2.4 mm (male) - 2.4 mm (male), straight MPA-185M-185F Precision 67 GHz adapter 1.85 mm (male) -1.85 mm (female), straight MPA-185F-185F Precision 67 GHz adapter 1.85 mm (female) -1.85 mm (female), straight MPA-185M-185M Precision 67 GHz adapter 1.85 mm (male) -1.85 mm (male), straight MPA-185M-100FPrecision 67 GHz adapter 1.85 mm (male) -1.00 mm (female), straightDisclaimer: TITAN Probe, QAlibria are trademarks of MPI Corporation, Taiwan. StatistiCal is a trademark of National Institute of Standards and Technology (NIST), USA. All other trademarks are the property of their respective owners. Data subject to change without notice.。

PROFINET V2.2 用户手册说明书

PROFINET V2.2 用户手册说明书
DANGER indicates that death or severe personal injury will result if proper precautions are not taken.
WARNING indicates that death or severe personal injury may result if proper precautions are not taken.
PROFINET Standard V2.2 for SIMOTION V4.1 SP 2
Product Information, 08/2008
3
Introduction
1
The standardization of PROFINET for IEC61158 requires a transition from Version V2.1 to V2.2. The contents related to PROFINET with IRT have changed. When using the RT class 'IRT' in the PROFINET network, versions V2.1 and V2.2 are not compatible. This means that when using PROFINET with IRT in both SIMOTION and SINAMICS, it is important to ensure that all devices that participate in IRT communication support the standard according to either V2.1 or V2.2.

SPIE-法国

SPIE-法国

Media PartnerPhotonics Europe 2008 · /pe · info@ · TEL: +44 29 2089 4747 12 Photonics Europe 2008 · /pe · info@ · TEL: +44 29 2089 4747SPIE Europe thanks the following sponsorsfor their generous supportAttendee Pens Stand #511www.micos.wsCoffee Breaks Stand #420www.klastech.deConference Bags Stand #Exhibitor Lounge Stand #Lanyards Stand #Pastries Stand #511www.micos.wsVertical Banner Stand #231www.hamamatsu.frExhibitor list as of 3 March 2008.AMA Association for Sensor Technology. . . . #209A.T. Wall Company. . . . . . . . . . . . . . . . . . . . . #224AFOP - French Optics and PhotonicsManufacturers Association . . . . . . . . . . . . #124AHF analysentechnik AG . . . . . . . . . . . . . . . . #316Alcatel Thales III V Lab. . . . . . . . . . . . . . . . . . #329AT -Fachverlag GmbH. . . . . . . . . . . . . . . . . . . #534Avantes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #232Becker & Hickl GmbH . . . . . . . . . . . . . . . . . . #405Bookham . . . . . . . . . . . . . . . . . . . . . . . . . . . . #317Breault Research Organization. . . . . . . . . . . . #117Brush Ceramic Products . . . . . . . . . . . . . . . . #104Carl Hanser Verlag . . . . . . . . . . . . . . . . . . . . . #530Cedrat Technologies. . . . . . . . . . . . . . . . . . . . #118CEIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #323CILAS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #416Conerefringent Optics SL. . . . . . . . . . . . . . . . #508Crystal Fibre. . . . . . . . . . . . . . . . . . . . . . . . . . #306CST - Computer Simulation Technology . . . . #226CVI Melles Griot Ltd. . . . . . . . . . . . . . . . . . . . #507Draka . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #230EDP Sciences. . . . . . . . . . . . . . . . . . . . . . . . . #532EKSPLA Co.. . . . . . . . . . . . . . . . . . . . . . . . . . #330Electro Optics Magazine . . . . . . . . . . . . . . . . #430Consortium. . . . . . . . . . . . . . . . . . . . . . . . . . . #331ePIXnet. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #431Epner Technology, Inc.. . . . . . . . . . . . . . . . . . #423EQ Photonics GmbH . . . . . . . . . . . . . . . . . . . #223ET Enterprises Ltd . . . . . . . . . . . . . . . . . . . . . #328European Optical Society. . . . . . . . . . . . . . . . #536EuroPhotonics . . . . . . . . . . . . . . . . . . . . . . . . #100Fibercore Ltd.. . . . . . . . . . . . . . . . . . . . . . . . . #515Fibercryst . . . . . . . . . . . . . . . . . . . . . . . . . . . . #426FiberTech Optica Inc.. . . . . . . . . . . . . . . . . . . #415Fischer Connectors . . . . . . . . . . . . . . . . . . . . #122Flexible Optical BV. . . . . . . . . . . . . . . . . . . . . #514FRAMOS GmbH. . . . . . . . . . . . . . . . . . . . . . . #106Frank Optic Products GmbH . . . . . . . . . . . . . #105Fraunhofer Heinrich Hertz Institut . . . . . . . . . #321Fujian CASTECH Crystals, Inc. . . . . . . . . . . . #501Gorman-Rupp Industries . . . . . . . . . . . . . . . . #413GWU-Lasertechnik GmbH . . . . . . . . . . . . . . . #501Hamamatsu . . . . . . . . . . . . . . . . . . . . . . . . . . #231HC Photonics Corp . . . . . . . . . . . . . . . . . . . . #501Heptagon . . . . . . . . . . . . . . . . . . . . . . . . . . . . #521HOLOEYE Photonics AG . . . . . . . . . . . . . . . . #309HORIBA Jobin Yvon SAS. . . . . . . . . . . . . . . . #327id Quantique SA. . . . . . . . . . . . . . . . . . . . . . . #405Impex HighTech GmbH . . . . . . . . . . . . . . . . . #411Innolume GmbH. . . . . . . . . . . . . . . . . . . . . . . #115Institut d’Optique Graduate School . . . . . . . . #437International Society for Stereology. . . . . . . . #529iXFiber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #126KERDRY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . #120Kimoga Material Technology Co., Ltd.. . . . . . #520KLASTECH. . . . . . . . . . . . . . . . . . . . . . . . . . . #420Laser Components GmbH. . . . . . . . . . . . . . . #220Laser Focus World . . . . . . . . . . . . . . . . . . . . . #414Laser Zentrum Hannover e.V . (LZH). . . . . . . . #505LEONI Fiber Optics GmbH. . . . . . . . . . . . . . . #406Leukos . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #123LINOS Photonics France . . . . . . . . . . . . . . . . #307Lovalite. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #121Lumera Laser GmbH . . . . . . . . . . . . . . . . . . . #310Lumerical Solutions, Inc. . . . . . . . . . . . . . . . . #121M.C.S.E.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . #128Mad City Labs, Inc. . . . . . . . . . . . . . . . . . . . . #214Materials Today . . . . . . . . . . . . . . . . . . . . . . . #435Menlo Systems GmbH. . . . . . . . . . . . . . . . . . #517Exhibitor ListPhotonics Europe 2008 · /pe · info@ · TEL: +44 29 2089 47473T Advertiser Index Alcatel Thales III-V Lab. . . . . . . . . . . . . . . . . . . . . . . . . . . p. 11CVI Melles Griot Ltd. . . . . . . . . . . . . . . . . . . . . . . . . . . Cover 4ET Enterprises Ltd.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . p. 23EPIC—European Photonics Industry Consortium . . . . . . p. 13KLASTECH—Karpushko Laser Technologies . . . . . . . . . p. 19LINOS Photonics France . . . . . . . . . . . . . . . . . . . . . . . . . p. 17Photoniques. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . p. 5RSoft Design Group. . . . . . . . . . . . . . . . . . . . . . . . . . . Cover 2Space Light srl . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . p. 21Exhibition Floor PlanMesse Stuttgart . . . . . . . . . . . . . . . . . . . . . . . #524MICOS GmbH . . . . . . . . . . . . . . . . . . . . . . . . #511Nature Publishing Group . . . . . . . . . . . . . . . . #208NEMO (Network of Excellence onMicro-Optics). . . . . . . . . . . . . . . . . . . . . . . #217New Focus, Inc. . . . . . . . . . . . . . . . . . . . . . . . #317Newport Spectra-Physics . . . . . . . . . . . . . . . #205NEYCO. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #212NIL Technology. . . . . . . . . . . . . . . . . . . . . . . . #125NP Photonics . . . . . . . . . . . . . . . . . . . . . . . . . #501Nufern. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #428NuSil Technology . . . . . . . . . . . . . . . . . . . . . . #525Ocean Optics . . . . . . . . . . . . . . . . . . . . . . . . #110OLLA Project . . . . . . . . . . . . . . . . . . . . . . . . . #429Omega Optical, Inc.. . . . . . . . . . . . . . . . . . . . #107OpTIC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #333Optics & Laser Europe . . . . . . . . . . . . . . . . . . #312Optics Pages . . . . . . . . . . . . . . . . . . . . . . . . . #527OptiGrate . . . . . . . . . . . . . . . . . . . . . . . . . . . . #510Optima Research . . . . . . . . . . . . . . . . . . . . . . #131OptoIndex. . . . . . . . . . . . . . . . . . . . . . . . . . . . #531Opton Laser International. . . . . . . . . . . . . . . . #130Optronis GmbH . . . . . . . . . . . . . . . . . . . . . . . #216OXXIUS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #304Phoenix BV. . . . . . . . . . . . . . . . . . . . . . . . . . . #315Photon Design . . . . . . . . . . . . . . . . . . . . . . . . #204Photonex 2008. . . . . . . . . . . . . . . . . . . . . . . . #527Photonic Cleaning Technologies . . . . . . . . . . #421Photonics 4 Life - Network of Excellence . . . #427Photonics Spectra - Laurin Publishing. . . . . . #100Photonik Zentrum Hessen in Wetzlar AG. . . . #222Physik Instrumente (PI) GmbH & Co.. . . . . . . #308Point Source. . . . . . . . . . . . . . . . . . . . . . . . . . #113Quantel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #305Raicol Crystals Ltd. . . . . . . . . . . . . . . . . . . . . #206Rhenaphotonics Alsace . . . . . #533, 535, 537, 539Royal Society of Chemistry . . . . . . . . . . . . . . #541RSoft Design Group. . . . . . . . . . . . . . . . . . . . #320RSP Technology BV . . . . . . . . . . . . . . . . . . . . #424Santec Europe Ltd.. . . . . . . . . . . . . . . . . . . . . #409Scientec . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #412SEDI Fibres Optiques. . . . . . . . . . . . . . . . . . . #313SEMELAB PLC. . . . . . . . . . . . . . . . . . . . . . . . #109Sill Optics GmbH & Co., KG. . . . . . . . . . . . . . #221SIOF-Italian Society of Optics and Photonics #516Space Light srl . . . . . . . . . . . . . . . . . . . . . . . . #518Spectroscopy Magazine. . . . . . . . . . . . . . . . . #433SphereOptics GmbH . . . . . . . . . . . . . . . . . . . #504Spiricon GmbH. . . . . . . . . . . . . . . . . . . . . . . . #419Springer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #211Stanford Computer Optics GmbH . . . . . . . . #114bTaylor & Francis - Contemporary Physics . . . #528Taylor & Francis - Fiber and Integrated Optics #528Taylor & Francis - Informa UK Ltd.. . . . . . . . . #528Taylor & Francis - International Journal ofOptomechatronics. . . . . . . . . . . . . . . . . . . #528Taylor & Francis - Journal of Modern Optics . #528THALES Laser . . . . . . . . . . . . . . . . . . . . . . . . #506The Institution of Engineering andTechnology (IET) . . . . . . . . . . . . . . . . . . . . #425Thorlabs GmbH . . . . . . . . . . . . . . . . . . . . . . . #517TSP Diffusion . . . . . . . . . . . . . . . . . . . . . . . . . #417UCM AG. . . . . . . . . . . . . . . . . . . . . . . . . . . . . #116Unice E-O Services Inc.. . . . . . . . . . . . . . . . . #422Universal Photonics, Inc. . . . . . . . . . . . . . . . . #207VTT Technical Research Centre of Finland. . . #129Wiley-VCH GmbH & Co. KGaA . . . . . . . . . . . #523Xiton Photonics GmbH. . . . . . . . . . . . . . . . . . #501XLITH GmbH . . . . . . . . . . . . . . . . . . . . . . . . . #432Yole Développement . . . . . . . . . . . . . . . . . . . #225ZODIAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #322Photonics Europe 2008 · /pe · info@ · TEL: +44 29 2089 4747 5The French magazine specializing in Optics-Photonics Photoniques :the magazine of theFrench Optical CommunityPhotoniques,magazine of the French OpticalSociety,establishes links and partnerships betweenall the entities working in Optics-Photonics :at national level with AFOP (French ManufacturersAssociation in Optics and Photonics)and in eachregion of France.Photoniques :The source of information for all the professionals in thefield of Optics-Photonics in France.In each issue :industry news,technical articles written by specialists,new products…A useful and efficient circulation :7500copiesAfter 7years of existence,cooperation and networking withthe specialists of the optic world in France,Photoniques hasbuilt a large qualified database of potential users :researchers,technicians,engineers and managers,fromindustry such as communications,industrial vision,lasers,test and measurements,imaging/displays…Are you interested in the French optics and photonics markets?Photoniques is your partner!How to keep you informed about Optics-Photonics in France?Become a Photoniques reader!123For additionnal information,contact:Olga Sortais :+33134042144o.sortais@ to request an issue of Photoniques and a media kit6 Photonics Europe 2008 · /pe · info@ · TEL: +44 29 2089 4747As a new addition to Photonics Europe, the Industry PerspectivesProgramme will provide a series of executive briefi ngs coveringkey technologies and sectors.Come hear key members of Europe’s photonics industrydiscuss their successes, future plans and the way in which theyintend to maximize their market penetration and growth. Hearreviews of the European Innovation landscape highlightinggeographical areas of strengths in areas such as business R&D,knowledge transfer and demonstrate the outcomes from recentsuccessful European-funded industry programmes.Industry Perspectives Programme Included with Conference registration.Individual Sessions can be purchased at the Cashier. Individual sessions, €100. The sessions will deliver a strategic perspective into each application area, allowing you to uncover and confirm the future prospects for your business. Benchmark your aspirations for your business and technology against some of Europe’s leading companies and engage with them as a potential supplier or partner. You will hear presentations from Philips, Audi, PCO, Coherent Scotland, GlaxoSmithKline, Carl Zeiss, Yole Development, Koheras and Fraunhofer on their successes and strategic priorities. Tuesday 8 April Morning SessionPhotovoltaics10.15 to 10.45 hrs.Photovoltaics - Market and Technology TrendsGaëtan Rull, Market Analyst for New Energy Technologies,Yole Développement 10.45 to 11.15 hrs.High Throughput Manufacturing for BulkHeterojunction PVsMarkus Scharber, Head of Materials Group, Konarka 11.15 to 11.45 hrs.Managing JGrowth in the Production of Thin Films(To be confi rmed.)Dr. Immo Kotschau, Director of Research and Development,Centrotherm GmbH 11.45 to 12.30 hrs.End to End Mass Production of Silicon Thin FilmModulesDetlev Koch, Head of BU Solar Thin Films & Senior Vice President,O C Oerlikon Balzers AG Break – 12.30 to 14.00 hrs.Afternoon SessionMEMS/MOEMS14.00 to 14.30 hrs.Market Trends and Technical Advances in M(O)EMSDr. Eric Mounier, Manager for MEMS & Optoelectronics andMicronews Chief Editor, Yole Développement14.30 to 15.00 hrs.Inorganic/Organic Hybrid Polymers (ORMOCER) forOptical InterconnectsDr. Michael Popall, Head of Microsystems and Portable PowerSupply, Fraunhofer ISC15.00 to 15.30 hrs.Future MOEMS and Photonic MicrosystemsDr. Thomas Hessler, Director Axetris, Leister Process Technologies15.30 to 16.15 hrs.Innovations in MOEMS product developmentProf. Hubert Karl, Director, Fraunhofer IPMSWednesday 9 AprilMorning Session Multimedia, Displays and Lighting 10.15 to 10.45 hrs.Plasmonics for Photonics: Challenges and Opportunities Ross Stanley, Section Head: MOEMS & Nanophotonics, CSEM 10.45 to 11.15 hrs.Photonic Microsystems for Displays Edward Buckley, VP Business Development, Light Blue Optics Ltd.11.15 to 11.45 hrs.Matrix-Beam – the antiglaring LED-high beam Benjamin Hummel, Research for Concept Lighting T echnologies, Audi 11.45 to 12.30 hrs.High Brightness OLEDs for Next Generation LightingPeter Visser, Project Manager, OLLA Project, The Netherlands Break –12.30 to 14.00 hrs.Photonics Europe 2008 · /pe · info@ · TEL: +44 29 2089 4747 7Thursday 10 AprilMorning SessionImaging10.15 to 10.45 hrs.High Resolution Imaging detectors for invisiblelight –Development and IndustrialisationHans Hentzell, CEO, Acreo10.45 to 11.15 hrs.(Presentation to be confi rmed.)11.15 to 11.45 hrs.Raman Spectroscopy, Raman Imaging and FutureTrendsSopie Morel, Sales Manager, Molecular & Microanalysis Division,HORIBA Jobin Yvon 11.45 to 12.30 hrs.World Markets for Lasers and Their Application Steve Anderson, Associate Publisher/Editor-in-Chief,Laser Focus World Break – 12.30 to 14.00 hrs. Afternoon SessionBiomedical and Healthcare Photonics 14.00 to 14.30 hrs.Photonic Systems for Biotechnology Research Karin Schuetze, Director of R&D, Carl Zeiss Microimaging 14.30 to 15.00 hrs.Photonics 4 Life Prof. Jeürgen Popp, Director, IPHT Germany 15.00 to 15.30 ser System Development for Biophotonics Chris Dorman, Managing Director, Coherent Scotland15.30 to 16.15 hrs.Supercontinuum Light - a paradigm shift in lasersources for biophotonicsJakob Dahlgren Skov, CEO, Koheras Husain Imam, Business Development Manager, Koheras Industrial Perspectives ProgrammeWednesday 9 April Afternoon Session OPERA 2015: European Photonics - Corporate and Research Landscape 13.30 to 13.45 hrs.Optics and Photonics in the 7th Framework ProgrammeGustav Kalbe, Head of Sector - Photonics, Information Society andMedia, Directorate General, European Commission 13.45 to 14.00 hrs.OPERA 2015: Aims, Results and link to Photonics 21Markus Wilkens, VDI 14.00 to 14.20 hrs.European Photonics Industry Landscape Bart Snijders, TNO 14.20 to 14.40 hrs.European Photonics Research Landscape Marie-Joëlle Antoine, Optics Valley 14.40 to 15.00 hrs.Resources for Photonics Development Peter Van Daele, IMEC Break – 15.00 to 15.15 hrs. 15.15 to 15.35 hrs.Towards the Future on Optics and Photonics ResearchDr. Eugene Arthurs, SPIE Europe (UK)15.35 to 16.15 hrs.Strategic Opportunities for R&D in EuropeMike Wale, Bookham, UK16.15 to 16.45 hrs.A Sustainable Business Model for Optics andPhotonicsDavid Pointer, Managing Director, Point Source (Pending)16.45 to 17.15 hrs.Final Open DiscussionChaired by: Gustav Kalbe, Head of Sector - Photonics, InformationSociety and Media, Directorate General, European Commission8Photonics Europe 2008 · /pe · info@ · TEL: +44 29 2089 4747Photonics Innovation Village Tuesday to Thursday during Exhibition HoursThe Photonics Innovation Village will showcase the latest projects and breakthroughs from optics-photonics researchers at universities, research centres and start-up companies. This is a great opportunity to see how EU R&D and project funds are being used by some of the great young innovators in Europe.A window on creative products developed by universities and research centres. Under the patronage of the European Commission, fi fteen entrants from across Europe complete to win categories ranging from Best Marketability to Best Design, Best Technology, and Best Overall Product.Low power remote sensing system Y. A. Polkanov, Russia (Individual work)New approach is based on use of a low-power radiation source with specifi ed gating, when time of source radiation interruption is equal to a pulse duration of ordinary lidar. We propose to reconstruct the average values of these characteristics over the parts commensurable with the sounding path length. As scanning systems is offered with speed of circular scanning is determined by time of small linear moving of a laser beam. It allows to predict a reduction of the meteorological situation stability from an anticipatory change of the revealed structure character of optical heterogeneities of a atmosphere ground layer atmosphere.Point of care sensor for non-invasive multi-parameter diagnostics of blood biochemistry Belarusian State University, Belarus; Ruhr-Universität-Bochum, Germany; Second Clinical Hospital, Belarus Compact fi bre optical and thermal sensor for noninvasive measurement of blood biochemistry including glucose, hemoglobin and its derivatives concentrations is developed as a prototype of the point-of-care diagnosticdevices for cardiologic, tumour and diabetic patients. Integrated platform for data acquisition, data processing and communication to remote networks has been developed on the pocket PC.Polarization-holographic gratings and devices on their basisLaboratory of Holographic Recording & Processing of Information, Institute of Cybernetics, GeorgiaWe have developed the technology of obtaining of polarization-holographic gratings that have anisotropic profi le continuously changing within each spatial period and also the technology of obtaining of polarization-holographic elements on the basis of such gratings. Special highly effective polarization-sensitive materials developed by us are used for obtaining such gratings and elements. We can present samples of gratings and elements and give a demonstration of their work.Ultra-miniature omni-view camera moduleImage Sensing group of the Photonics Division of CSEM (Centre Suisse d’Electronique et de Microtechnique), SwitzerlandA live demonstration with a working prototype of a highly integrated ultra-miniature camera module with omni-directional view dedicated to autonomous micro fl ying devices is presented.Femtosecond-pulse fi bre laser for microsurgery and marking applicationsMultitel, BelgiumMultitel presents a new prototype of an all-fi bred femtosecond amplifi ed laser. The device has been specifi cally developed for micromachining and microsurgery applications and operates at 1.55µm, which corresponds to a high absorption peak of water (molecule contained in large quantity in living tissue and cells). Since no free-space optics is used for pulse compression or amplifi cation the prototype is compact and very stable. Moreover, the seed laser source has a high repetition rate therefore enabling multiphoton absorption applications and use in multi-pulse and burst modes.Flexible artifi cial optical robotic skinsDepartment of Applied Physics and Photonics (VUB-TONA) and Robotics & Multibody Mechanics Research Group (VUB-R&MM) of the Vrije Universiteit Brussel, Belgium; Thin Film Components Group (UG-TFCG) and Polymer Chemistry & Biomaterials Research Group (UG-PBM) of the Universiteit Gent, BelgiumWe will present a paradigm shifting application for optical fi bre sensors in the domain of robotics. We propose fi bre B ragg gratings (FB Gs) written in highly-birefringent microstructured optical fi bres integrated in a fl exible skin-like foil to provide a touch capability to a social pet-type robot for hospitalized children named “Probo”. The touch information is complementary to vision analysis and audio analysis and will be used to detect where Probo is being touched and to differentiate between different types of affective touches such as tickling, poking, slapping, petting, etc.Co-Sponsored by: Location: Galleri de Marbre Under the patronage of the European Commission, Photonics Unit Join us for the Photonics Innovation Village Awards 2008 which will take place on Wednesday, 9th April 2008, from 17.00 hrs. in the Galerie de Marbre.3D tomographic microscopeLauer Technologies, FranceThe 3D tomographic microscope generates 3D high-resolution images of non-marked samples. The demonstration will show 3D manipulation of images obtained with this microscope.Polar nephelometerInstitute of Atmospheric Optics of Tomsk, RussiaMaterial comprising a matrix, apatite and at least one europium composite compound with particle medium sizes more 4-5 micron. The composition for the production of the material comprises (wt. %) apatite 0.01-10.0; composite compound. 0.01-10.0, and the balance is a matrix-forming agent, such as a polymer, a fibre, a glass-forming composition, or lacquer/adhesive-forming substance.High speed Stokes portable polarimeterMIPS Laboratory of the Haute Alsace University, FranceThe implementation of an imaging polarimeter able to capture dynamic scenes is presented. Our prototype is designed to work at visible wavelengths and to operate at high-speed (a 360 Hz framerate was obtained), contrary to commercial or laboratory liquid crystal polarimeters previously reported. It has been used in the laboratory as well as in a natural environment with natural light. The device consists of commercial components whose cost is moderate. The polarizing element is based on a ferroelectric liquid crystal modulator which acts as a half-wave plate at its design wavelength.Diffractive/refractive endoscopic UV-imaging system Institut für Technische Optik (ITO) of the University of Stuttgart, GermanyWe present a new optical system with an outstanding high performance despite of demanding boundary conditions of endoscopic imaging to enable minimal invasive laser-based measurement techniques. For this purpose the system provides a high lens speed of about 10 times the value of a conventional UV-endoscope, a multiple broad band chromatic correction and small-diameter but wide-angle access optics. This was realized with a new design concept including unconventional, i.e. diffractive components. An application are UV-LIF-measurements on close-to-production engines to speed up the optimization of the combustion and produce aggregates with less fuel consumption and exhaust gases like CO2.Light-converting materials and composition: polyethylene fi lm for greenhouses, masterbatch, textile, sunscreen and aerosolUsefulsun Oy, Finland; Institute Theoretical and Experimental Biophysics Russian Academy of Sciences, RussiaThe composition for the production of the material comprises (wt. % ) composite compound (inorganic photoluminophore particles with sizes 10-800nm) -0.01-10.0; coordination compound of metal E (the product of transformation of europium, samarium, terbium or gadolinium ) - 0,0-10,0 and the balance is a matrix-forming agent, such as, a polymer, a fi ber, a glass-forming composition or gel, aerosol, lacquer/adhesive-forming substance. The present invention relates to composite materials, in particular to light-converting materials used in agriculture, medicine, biotechnology and light industry.HIPOLAS - a compact and robust laser sourceCTR AG (Carinthian Tech Research AG), AustriaThe prototype covers a robust, compact and powerful laser ignition source for reciprocating gas and petrol engines that could be mounted directly on the cylinder.We have developed a diode pumped solid-state laser with a monolithic Neodymium YAG resonator core. A ring of 12 high power laser diodes pumps the resonator. Due to the adjustment-free design, the laser is intrinsically robust to environmental vibrations and temperature conditions. With overall dimensions of Æ 50 x 70 mm the laser head is small enough to be fi tted at the standard spark plug location on the cylinder head. The dimensions can be reduced for future prototypes. OLLA OLED lighting tile demonstratorOLLA project-consortiumOLED technology is not only a display technology but also suited for lighting purposes. The OLLA project has the goal to demonstrate viability of OLED technology for general lighting applications. The demonstrator tile shown here combines the current results of the project : a large sized (15x15cm2) white OLED stack with high effi cacy (up to 50 lm/W), combined with long lifetime (>10.000 hours).During Photonics Europe, we will show several OLEDs tiles in different colors. The demonstrators are made by the OLLA project-consortium members. The large OLED demonstrator tile was fabricated on the inline tool at Fraunhofer IPMS in Dresden.Analyze-IQNanoscale Biophotonics Laboratory, School of Chemistry,and Machine Learning / Data Mining Group, Department ofInformation Technology, National University of Ireland, Galway, IrelandAnalyze-IQ is the next generation spectral analysis software tool for optical and molecular spectroscopies such as Raman, Mid-IR, NIR, and Fluorescence. The Analyze-IQ software is based on patented machine-learning algorithms and a model based approach in which the software learns to recognise the relevant information in complex mixtures from sample spectra. It then uses these models to rapidly and accurately identify or quantify unknown materials such as narcotics and explosives, in complex mixtures commonly found in law-enforcement and industrial applications.Micro-optical detection unit for lab-on-a-chipDepartment of Applied Physics and Photonics (VUB-TONA) of the Vrije Universiteit Brussel, BelgiumWe present a detection unit for fl uorescence and UV-VIS absorbance analysis in capillaries, which can be used for chromatography. By usinga micro-fabrication technology (Deep Proton Writing) the optics aredirectly aligned onto the micro-fl uidic channel. This integration enables the development of portable and ultimately disposable lab-on-a-chip systems for point-of-care diagnosis. We will explain the working principle of our detection system in a proof-of-concept demonstration set-up while focusing on some specifi c applications of micro-fl uidics in low-cost lab-on-a-chip systems.Photonics Innovation Village。

KSZ9021RN to KSZ9031RNX Migration Guide

KSZ9021RN to KSZ9031RNX Migration Guide

KSZ9021RN to KSZ9031RNXMigration GuideRev. 1.1IntroductionThis document summarizes the hardware pin and software register differences for migrating from an existing board design using the KSZ9021RN PHY to a new board design using the KSZ9031RNX PHY. For hardware and software details, consult reference schematic and data sheet of each respective device.Data sheets and support documentations can be found on Micrel’s web site at: .Differences SummaryTable 1 summarizes the supported device attribute differences between KSZ9021RN and KSZ9031RNX PHY devices.Device Attribute KSZ9021RN KSZ9031RNXReduced Gigabit Media Independent Interface (RGMII) RGMII Version 1.3 (power-up default) using off-chip data-to-clock delays with register options to:•Set on-chip (RGMII Version 2.0) delays•Make adjustments and corrections to TXand RX timing pathsRGMII Version 2.0 (power-up default) using on-chip data-to-clock delays with register options to:•Set off-chip (RGMII Version 1.3) delays•Make adjustments and corrections to TXand RX timing pathsTransceiver (AVDDH)Voltage3.3V only 3.3V or 2.5V (commercial temperature only)Digital I/O (DVDDH)Voltage3.3V or 2.5V 3.3V, 2.5V or 1.8VIndirect Register Access Proprietary (Micrel defined) –Extended Registers IEEE defined –MDIO Manageable Device (MMD) RegistersEnergy-Detect Power-Down (EDPD) Mode Not Supported Supported for further power consumptionreduction when cable is disconnected; Disabledas the power-up default and enable using MMDregisterIEEE 802.3azEnergy Efficient Ethernet (EEE) Mode Not Supported Supported with:•Low Power Idle (LPI) mode for1000Base-T and 100Base-TX•Transmit Amplitude reduction for10Base-T (10Base-Te)•Associated MMD registers for EEEWake-on-LAN (WOL) Not Supported Supported with:•Wake-up using detection of Link Status,Magic Packet, or Custom-Packet•PME_N interrupt output signal•Associated MMD registers for WOL Table 1. Summary of Device Attribute Differences between KSZ9021RN and KSZ9031RNXPin DifferencesTable 2 summarizes the pin differences between KSZ9021RN and KSZ9031RNX PHY devices. Pin #KSZ9021RNKSZ9031RNXPin NameType Pin FunctionPin NameTypePin Function1 AVDDH P 3.3V analog V DD AVDDH P 3.3V/2.5V (commercial temp only) analog V DD 12 AVDDH P 3.3V analog V DD AVDDH P 3.3V/2.5V (commercial temp only) analog V DD 13VSS_PSGndDigital groundNC–No connectThis pin is not bonded and can be connected to digital ground for footprint compatibility with the Micrel KSZ9021RN Gigabit PHY.16 DVDDH P3.3V / 2.5V digital V DD DVDDH P 3.3V, 2.5V, or 1.8V digital V DD_I/O 17 LED1 /PHYAD0I/OLED Output:Programmable LED1 OutputConfig Mode:The pull-up/pull-down value is latched as PHYAD[0] during power-up / reset.LED1 /PHYAD0 /PME_N1I/O LED1 output:Programmable LED1 outputConfig mode:The voltage on this pin issampled and latched during the power-up/reset process to determine the value of PHYAD[0].PME_N output:Programmable PME_N output (pin option 1). This pin function requires an external pull-up resistor to DVDDH (digital V DD_I/O ) in a range from 1.0k Ω to 4.7k Ω. When asserted low, this pin signals that a WOL event has occurred.When WOL is not enabled, this pin function behaves as per the KSZ9021RN pin definition.This pin is not an open-drain for all operating modes.34 DVDDH P3.3V / 2.5V digital V DD DVDDH P 3.3V, 2.5V, or 1.8V digital V DD_I/O38 INT_N O Interrupt OutputThis pin provides aprogrammable interrupt output and requires an external pull-up resistor to DVDDH in the range of 1K to 4.7K ohms for active low assertion.INT_N/O Interrupt OutputThis pin provides aprogrammable interrupt output and requires an external pull-up resistor to DVDDH in the range of 1K to 4.7K ohms for active low assertion.This pin is an open-drain.PME_N2 PME_N output: Programmable PME_N output (pin option 2). When asserted low, this pin signals that a WOL event has occurred.When WOL is not enabled, this pin function behaves as per the KSZ9021RN pin definition. This pin is not an open-drain for all operating modes.40 DVDDH P 3.3V / 2.5V digital V DD DVDDHP3.3V, 2.5V, or 1.8V digitalV DD_I/O47 AVDDH P 3.3V analog V DD NC–NoconnectThis pin is not bonded and canbe connected to AVDDH powerfor footprint compatibility withthe Micrel KSZ9021RN GigabitPHY.48 ISET I/O Set transmit output levelConnect a 4.99KΩ 1%resistor to ground on thispin. ISET I/O Set the transmit output levelConnect a 12.1kΩ 1% resistorto ground on this pin.Table 2. Pin Differences between KSZ9021RN and KSZ9031RNXStrapping Option DifferencesThere is no strapping pin difference between KSZ9021RN and KSZ9031RNX.Register Map DifferencesThe register space within the KSZ9021RN and KSZ9031RNX consists of direct-access registers and indirect-access registers.Direct-access RegistersThe direct-access registers comprise of IEEE-Defined Registers (0h – Fh) and Vendor-Specific Registers (10h – 1Fh). Between the KSZ9021RN and KSZ9031RNX, the direct-access registers and their bits have the same definitions, except for the following registers in Table 3.Direct-access RegisterKSZ9021RN KSZ9031RNXName Description Name Description3h PHYIdentifier2 Bits [15:10] (part of OUI) – same asKSZ9031RNXBits [9:4] (model number) – unique forKSZ9021RNBits [3:0] (revision number) – uniquedepending on chip revision PHY Identifier 2 Bits [15:10] (part of OUI) – same asKSZ9021RNBits [9:4] (model number) – unique forKSZ9031RNXBits [3:0] (revision number) – uniquedepending on chip revisionBh ExtendedRegister –Control Indirect Register AccessSelect read/write control andpage/address of Extended RegisterReserved ReservedDo not change the default value ofthis registerCh ExtendedRegister –Data Write Indirect Register AccessValue to write to Extended RegisterAddressReserved ReservedDo not change the default value ofthis registerDh ExtendedRegister –Data Read Indirect Register AccessValue read from Extended RegisterAddressMMD Access –ControlIndirect Register AccessSelect read/write control and MMDdevice addressEh Reserved ReservedDo not change the default value ofthis register MMD Access –Register/DataIndirect Register AccessValue of register address/data for theselected MMD device address1Fh, bit [1] Software Reset 1 = Reset chip, except all registers0 = Disable resetReserved ReservedTable 3. Direct-access Register Differences between KSZ9021RN and KSZ9031RNXIndirect-access RegistersThe indirect register mapping and read/write access are completely different for the KSZ9021RN (uses Extended Registers) and KSZ9031RNX (uses MMD Registers). Refer to respective devices’ data sheets for details.Indirect registers provide access to the following commonly used functions:•1000Base-T link-up time control (KSZ9031RNX only)• Pin strapping status• Pin strapping override•Skew adjustments for RGMII clocks, control signals, and datao Resolution of skew steps are different between KSZ9021RN and KSZ9031RNX•Energy-Detect Power-Down Mode enable/disable (KSZ9031RNX only)•Energy Efficient Ethernet function (KSZ9031RNX only)•Wake-on-LAN function (KSZ9031RNX only)Revision HistoryRevision Date Summary of ChangesMigration Guide created1.0 12/7/121.1 6/7/13 Indicate PME_N1 (pin 17) for KSZ9031RNX is not an open-drain.Indicate INT_N (pin 38) is an open-drain for KSZ9021RN, but is not an open-drain for KSZ9031RNX.Indicate direct-access register 1Fh, bit [1] difference.。

RA参数表

RA参数表
10) 参数在第 8 章指定的功能图加以表示(此处为图 G153)。
11-4
Siemens Electrical Drives Ltd. 6RX1700-0AD50 SIMOREG DC Master 使用说明书
05.2007
参数号 说 明
值范围 [单位] 步长
11.1
r000
运行状态显示
运行状态显示 状态显示,故障和报警信息
(控制字 2,位 31,见 P691)
[自版本 1.8 起]
o4 等待电压(电枢)
o4.0 等待在电源端子 1U1,1V1,1W1 的电压。电压和频率必须在参数
P351,P352,P353,P363 和 P364 规定的范围内。也见 P078.001。
o4.1 等待熔断器监控器 OK 信号
[自版本 1.7 起]
o7 等待合闸指令( = READY TO SWITCH ON) o7.0 等待通过端子 37 的合闸指令。 o7.1 等待由开关量连接器(根据在参数 P654 中的选择)或控制字,0 位
(根据在参数 P648 中的选择)的合闸指令。 o7.2 等待通过一个外部分闸指令输入的内部分闸取消或等待“用励磁
功能 模拟量输出 开关量输出 基本整流器上串行接口的配置 监控功能的解除 补偿值 晶闸管诊断 关于 DriveMonitor 和 OP1S 的参数 程序文件参数 故障存贮器 只读参数: 报警 装置标志 只读参数: 控制字和状态字 复位和存储参数,现有的和更改的 P 和 r 参数 密码保护,钥匙/锁的作用原理 处理器利用率 其他 串行接口的开关量连接器/连接器的转换 换向监控 设定值的减小 输入和输出功能定义 继电器输出端子 109/110 功能意义 启动脉冲速度调节器 用于起重机 4 级主开关的计算 带有 SCI1 的 SCB1 的配置 在板安装位置 2 和 3 的附加板的配置 SIMOLINK 板的配置 EB1 扩展板的配置 EB2 扩展板的配置 SBP 脉冲编码器板的配置 并行接口的配置 用于 SIMOREG CM (控制模块)的参数 外部励磁单元额定直流电流 模拟工作模式 DriveMonitor 的参数 槽禁止激活 DriveMonitor 的参数 DriveMonitor 的参数 专家的参数存取 现存的和更改的 U 和 n 参数

BladeModeler-Intro_14.0_L01_Introduction

BladeModeler-Intro_14.0_L01_Introduction

Vista CCD
Enter geometry constraints
10
© 2011 ANSYS, Inc.
April 11, 2012
Release 14.0
Vista CCD
Analyze Results
11
© 2011 ANSYS, Inc.
April 11, 2012
Release 14.0
April 11, 2012
Release 14.0
April 11, 2012
Release 14.0
BladeModeler
• DesignModeler • Additional modifications to turbomachinery components
Revolved trim
Blade fillets
Shroud cover
17
• ANSYS tools have been widely used by leading turbomachinery manufacturers for many years
2
© 2011 ANSYS, Inc.
April 11, 2012
Release 14.0
ANSYS Turbo System Workflow
Meanline sizing tools BladeGen DesignModeler BladeEditor
6
© 2011 ANSYS, Inc.
April 11, 2012
Release 14.0
BladeModeler
Meanline Sizing Tools
• • • •
Vista AFD (Axial Fan Design) Vista CCD (Centrifugal Compressor Design) Vista CPD (Centrifugal Pump Design) Vista RTD (Radial Turbine Design)

NPI工程师培训资料_2022年学习资料

NPI工程师培训资料_2022年学习资料

新產品導入流程-DRI-Item-Action item-unit-Remark-Check points 3-工程可行性評估-NPI-密切聯系制造和制工-1.特别是新技求,新制程的可行性-評估,研究和准備工作-K ep the contact-1.The evaluation and-Engineering feasi ility-close with manufa--preparation of new technolog -cture and manufac--and process-ture engineer-工程資料獲得与 轉相關部門-工程資料括:BOM,Overlay,Board-file,Schematic,MPS,Cosm tic-l.所有资料可以由Compass或MCMs網-站下载或由客户的Email得到-4-Inspecti n Criterion,Stencil-量試說明會發布-Job Number,Fixture shippi g-2.确認所有资料是否到位或有更新-tracking Number,Test Program-3.若有更 告知相关部门-release date.-Engineering documents acquire,-i cluding BOM,Overlay,Board-1.Download all files from-C mpass/MCMS or by email-Build preparation-2.To verify f all files are-meeting-completed or updated-tracking Number,Test Program,-3.Forward to all department if-a d forward to related-any update

MSI Optix G系列产品说明说明书

MSI Optix G系列产品说明说明书

PATH TO THE FUTUREInspired by the rigorous quality testing in the production ofMSI Optix G series, MSI Optix G series’ design is full ofsymbols of sturdiness and durability. Additionally, to providequality user experience, Optix G series has really simpleinstallation process and a friendly user interface, and will bethe best choice for entry level gamers to step into the gameworld.Selling PointsPannello IPS - Colori e luminosità ottimizzati per lamigliore esperienza visivaRisoluzione FHDRefresh rate 144Hz - Gaming incredibilmente fluidoTempo di risposta 1ms - Elimina gli eventuali problemidi screen tearingAmpia gamma colore - Dettagli realistici come non maiAMD FreeSync - Previeni problemi di tearing estuttering e ottieni un gameplay incredibilmente fluidoNight Vision - Esclusiva tecnologia MSIDesign senza bordi - Esperienza di gioco definitivaAnti-sfarfallio e Riduzione Luce Blu - Previeni i problemidi affaticamento degli occhiAmpio angolo di visione di 178°Picture and logos1.5-way joystick navigator2.1x DC jack3.2x HDMI (1.4b)4.1x Display Port (1.2a)5.1x Earphone out6.1x Kensington lockSpecificationScreen Size23.8” (60cm)Active Display Area (mm)527.04(H) x 296.46(V) Curvature FlatPanel Type IPSResolution1920x1080 (FHD)Pixel pitch0.2745(H)X0.2745(V)Aspect Ratio16:9Dynamic Refresh Rate technology FreeSyncHDR (High dynamic range)NASDR Brightness (nits)250Contrast Ratio1000:1DCR (Dynamic Contrast Ratio)100000000:1Signal Frequency30~180 KHz(H) / 47~145 Hz(V) Activated Range48Hz-144HzRefresh Rate144HZResponse Time (MPRT)1ms(MPRT)Response Time (GTG)4msResponse Time (Tr + Tf)7.5msView Angles178°(H)/178°(V)Surface Treatment Anti-glareNTSC (CIE1976 area percentageoverlap)111.3%/85.7%NTSC (CIE1931 area percentageoverlap)91.4%/81.5%sRGB (CIE1976 area percentageoverlap)127.7%/99.4%sRGB (CIE1931 area percentageoverlap)129%/99.9%Adobe RGB (CIE1976 area percentageoverlap)109.4%/90.3%Adobe RGB (CIE1931 area percentageoverlap)95.6%/84.8%DCI-P3 (CIE1976 area percentageoverlap)101.7%/94.6%DCI-P3 (CIE1931 area percentageoverlap)95.1%/92.7%Rec.709 (CIE1976 area percentageoverlap)127.7%/99.4%Rec.709 (CIE1931 area percentageoverlap)129%/99.9%Display Colors16.7MColor bit8 bits (6 bits + FRC)Note_DP1920 x 1080 (up to 144Hz)Note_HDMI1920 x 1080 (up to 144Hz)Note_DVI N/AHDMI2HDMI version 1.4bHDMI HDCP version NADisplayPort1DisplayPort version 1.2aDisplayPort HDCP version NAThunderbolt version NAThunderbolt HDCP version NAUSB Type C (DisplayPort Alternate)NADVI NAD-Sub NAMic-in NAHeadphone-out1Audio Combo NALock type Kensington LockUSB 2.0 Type B NAUSB 3.2 Gen 1 Type B NAThunderbolt NAUSB 2.0 Type A NAUSB 2.0 Type C NAUSB 3.2 Gen 1 Type A NAUSB 3.2 Gen 1 Type C NAUSB 3.2 Gen 2x2 Type C NAUSB 3.2 Gen 2x2 Type A NACard Reader NAFeature Gaming ModeAdaptive Sync (Freesync)5 Ways Joystick Navigator ControlFrameless designMSI Gaming OSDNight VisionPower Type External Adaptor 20V 2.25A Power Input100~240V, 50/60Hz Adapter's KC safety Number N/APower Cord Type C5QC Output NAQC Output Power NAPD Output NAPD Output Power NAAdjustment (Tilt)-5° ~ 20°Adjustment (Swivel)NAAdjustment (Height)NAAdjustment (Pivot)NAVESA Mounting100x100mmFrameless Design YesOuter Carton Dimension (WxDxH) (mm)621 x 187 x 434Outer Carton Dimension (WxDxH) (inch)24.45 x 7.36 x 17.09 Product Dimension with Stand (WxDxH) (mm)540.3 x 219.6 x 422.6 Product Dimension with Stand (WxDxH) (inch)21.27 x 8.65 x 16.64 Product Dimension without Stand (WxDxH)540.3 x 65.5 x 328.2 (mm)21.27 x 2.58 x 12.92 Product Dimension without Stand (WxDxH)(inch)Stand Dimension (WxDxH) (mm)461.1 x 219.6 x 267.5 Stand Dimension (WxDxH) (inch)18.15 x 8.65 x 10.53 Inside Carton Dimension (WxDxH) (mm)606 x 172 x 409Inside Carton Dimension (WxDxH) (inch)23.86 x 6.77 x 16.1 Weight (Net kg) 3.3Weight (Gross kg)5DisplayPort Cable0HDMI Cable1DVI Cable0USB Type A to Type B Cable0USB Type C to Type A Cable0USB Type C to Type C Cable0Thunderbolt Cable0VGA Cable03.5mm audio Cable03.5mm combo audio Cable0Power Cord1AC Adaptor1Warranty Card1Quick Guide1Warranty36MSKU Number0Color ID1/Black-BlackEAN4719072688318。

  1. 1、下载文档前请自行甄别文档内容的完整性,平台不提供额外的编辑、内容补充、找答案等附加服务。
  2. 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
  3. 3、如文档侵犯您的权益,请联系客服反馈,我们会尽快为您处理(人工客服工作时间:9:00-18:30)。

• Tcontact is the temperature of the contact surface and
• Ttarget is the temperature of the target surface.
q TCC Ttarget TconC (Thermal Contact Conductivity) is set
© 2012 ANSYS, Inc.
December 19, 2012
Release 14.5
… Thermal Contact
The amount of heat flow across a contact interface is defined by the contact heat flux expression “q” shown here:
5
© 2012 ANSYS, Inc.
December 19, 2012
Release 14.5
C. Material Properties
• The only required material property for steady state is thermal conductivity.
• • • • • • • •
Surface roughness surface finish Oxides trapped fluids contact pressure surface temperature lubricants Etc . . . .
DT
T x
Continued . . .
10
A positive value for heat load will add energy to the system.
Release 14.5
A. Basics of Steady-State Heat Transfer
The schematic setup for a steady-state (static) thermal analysis is shown here. Later in this chapter we will shown the procedure for setting up a coupled thermal structural analysis.
In thermal analyses all body types are supported: • Solid, surface, and line bodies. – Line bodies cross-section and orientation is defined within DesignModeler. – A “Thermal Mass” feature is available for use in transient analysis (not covered in this course). Shell and line body assumptions: • Shells: temperatures may vary over the surface (no through-thickness temperature variation). • Line bodies: temperature may vary along the length of the beam (no variation across the cross section).
7
© 2012 ANSYS, Inc.
December 19, 2012
Release 14.5
… Thermal Contact
• When can heat flow across a contact region?
Contact Type Bonded No Separation Rough Frictionless Frictional Heat Transfer Between Parts in Contact Region? Initially Touching Inside Pinball Region Outside Pinball Region Yes Yes No z Yes Yes No Yes No No Yes No No Yes No No
T1
12
© 2012 ANSYS, Inc.
December 19, 2012
Release 14.5
E. Thermal Boundary Conditions
Heat Flow:
• A heat flow rate can be applied to a vertex, edge, or surface. • Heat flow has units of energy/time.
3
© 2012 ANSYS, Inc.
December 19, 2012
Release 14.5
. . . Basics of Steady-State Heat Transfer
For a steady-state (static) thermal analysis in Mechanical, the temperatures {T} are solved for in the matrix below:
K T T QT
Assumptions:
• • • •
No transient effects are considered in a steady-state analysis [K] can be constant or a function of temperature {Q} can be constant or a function of temperature Fixed temperatures represent constraints {T} on the system (like fixed displacements on structures).
It is important to remember these assumptions related to performing thermal analyses in Mechanical.
© 2012 ANSYS, Inc. December 19, 2012
4
Release 14.5
B. Geometry
Release 14.5
… Thermal Contact
By default, perfect thermal contact is assumed, meaning no temperature drop occurs at the interface. Numerous “real world” conditions can contribute to less than perfect contact conductance:
• Thermal Conductivity is input in the Engineering Data application
• Temperature-dependent thermal conductivity is input as a table
6
© 2012 ANSYS, Inc.
Heat Flux:
• Heat flux can be applied to surfaces only (edges in 2D). • Heat flux has units of energy/time/area.
Internal Heat Generation:
• An internal heat generation rate can be applied to bodies only. • Heat generation has units of energy/time/volume.
8
© 2012 ANSYS, Inc.
December 19, 2012
Release 14.5
… Thermal Contact
If the contact is bonded or no separation, then heat transfer will occur when the surfaces are within the pinball radius.
December 19, 2012
Release 14.5
D. Thermal Contact
As with structural analyses, contact regions are automatically created to enable heat transfer between parts in assemblies.
Note: advanced topics including thermal transient analyses are covered in the ANSYS Mechanical Heat Transfer training course.
2 © 2012 ANSYS, Inc. December 19, 2012
11
© 2012 ANSYS, Inc.
December 19, 2012
Release 14.5
… Thermal Contact
Spot welds provide discreet contact locations where heat transfer can take place.
T2
Lecture 10 Thermal Analysis
14.5 Release
Introduction to ANSYS Mechanical
1 © 2012 ANSYS, Inc. December 19, 2012
相关文档
最新文档