FSMD2920Series
富士通固态电容系列介绍
富士通固态电容1. NS系列:主要特点:低阻抗/高纹波电流/长寿命/非套管/插件适应产品:开关电源与DC-DC交换器,CPU电源,微型大功率电源等(主要为需要长寿命的打印机,电脑主机板与部分显卡).温度: 105度标准寿命:2000HRS具体电压/容值/体积/内阻:4V-25V 10UF-1200UF 6.3*7-10*12.5 10-63毫欧(具体可根据客户需要参考目录书)此款与三和的FB系列类似,三和容值可达到3300UF,高度可到6MM,但三和的内阻比富士通的大.2. LS系列:主要特点:低阻抗/高稳定性/长寿命/非套管/插件适应产品:开关电源与DC-DC交换器,CPU电源,微型大功率电源等(主要为需要长寿命的打印机,电脑主机板与部分显卡).温度: 105度标准寿命:2000HRS具体电压/容值/体积/内阻:4V-25V 22UF-820UF 体积均为10*10.5 内阻12-35毫欧(具体可根据客户需要参考目录书)此款与NS不同点:高度都为10.5MM,直径为10MM,容值稍低,可作为NS的补充.3. R7系列:主要特点:超低阻抗/高纹波电流/长寿命/非套管/插件适应产品:开关电源与DC-DC交换器,CPU电源,微型大功率电源等(主要为需要长寿命的打印机,电脑主机板与部分显卡).温度: 105度标准寿命:2000HRS具体电压/容值/体积/内阻:2.5V-16V 68UF-1500UF 8*11.5-10*12.5 内阻都为7毫欧(具体可根据客户需要参考目录书)此款的主要特点就是内阻超低,使用寿命可以会更长.4.R5系列:主要特点:特超低阻抗/高纹波电流/长寿命/非套管/插件适应产品:开关电源与DC-DC交换器,CPU电源,微型大功率电源等(主要为需要长寿命的打印机,电脑主机板与部分显卡).温度: 105度标准寿命:2000HRS具体电压/容值/体积/内阻:2.5V-6.3V 390UF-1500UF 8*11.5-10*12.5 内阻都为5毫欧(具体可根据客户需要参考目录书)此款的主要特点就是内阻超低,使用寿命可以会更长.适合需要高容值,小电压的产品.5.NU系列:主要特点:超低阻抗/高纹波电流/长寿命/大容值/非套管/插件适应产品:开关电源与DC-DC交换器,CPU电源,微型大功率电源等(主要为需要长寿命的打印机,电脑主机板与部分显卡).温度: 105度标准寿命:2000HRS具体电压/容值/体积/内阻:2.5V-16V 100UF-2700UF 8*11.5-10*12.5 内阻都为7-25毫欧(具体可根据客户需要参考目录书)此款的容值增加到2700UF6. L8系列:主要特点:低阻抗/高纹波电流/长寿命/非套管/插件适应产品:开关电源与DC-DC交换器,CPU电源,微型大功率电源等(主要为需要长寿命的打印机,电脑主机板与部分显卡).温度: 105度标准寿命:2000HRS具体电压/容值/体积/内阻:2.5V-6.3V 470UF-1000UF 8*8 内阻都为6-8毫欧(具体可根据客户需要参考目录书)此款可做R5的补充.7. PS系列:主要特点:低阻抗/高纹波电流/长寿命/非套管/贴片(加底座)适应产品:开关电源与DC-DC交换器,CPU电源,微型大功率电源等(主要为需要长寿命的打印机,电脑主机板与部分显卡).温度: 105度标准寿命:2000HRS具体电压/容值/体积/内阻:2.5V-16V 39UF-1500UF 6.3*5.7-10*12.4 内阻都为12-40毫欧(具体可根据客户需要参考目录书)此款比插件的固态电容成本要高8. FS系列:主要特点:低阻抗/高纹波电流/长寿命/非套管/贴片(加底座)适应产品:开关电源与DC-DC交换器,CPU电源,微型大功率电源等(主要为需要长寿命的打印机,电脑主机板与部分显卡).温度: 105度标准寿命:2000HRS具体电压/容值/体积/内阻:2.5V-10V 10UF-180UF 5*5.7 内阻都为21-220毫欧(具体可根据客户需要参考目录书)此款适合电压低,体积小,容值不大的需求9. SS/SA/SB系列:主要特点:低阻抗/高纹波电流/长寿命/非套管/贴片(加底座)适应产品:开关电源与DC-DC交换器,CPU电源,微型大功率电源等(主要为需要长寿命的打印机,电脑主机板与部分显卡).温度: 105度标准寿命:2000HRS具体电压/容值/体积/内阻:2.5V-6.3V 220UF-560UF 6.3*5.7 内阻为14-25毫欧(具体可根据客户需要参考目录书)此款适合电压低,体积小,容值不大的需求(一般体积越小,内阻不容易控制小)10. HS/HA系列:主要特点:低阻抗/高纹波电流/长寿命/非套管/贴片(加底座)适应产品:开关电源与DC-DC交换器,CPU电源,微型大功率电源等(主要为需要长寿命的打印机,电脑主机板与部分显卡).温度: 105度标准寿命:2000HRS具体电压/容值/体积/内阻:2.5V-6.3V 330UF-1500UF 8*6.7-8*11.7 内阻为8-18毫欧(具体可根据客户需要参考目录书)此款适合要求直径是8MM大的杰特兴主要代理经营国产固态电容,质优价廉,欢迎咨询询价送样,电话135****9681,罗海波,QQ381545145.。
ICMEF212P900MFR 2012 90Ω 2lines Common Mode ESD Filter
Max 4.0 Max 1.0
Max 1.7
MΩ
Volt
mA
10V
25℃±2℃ 25℃±2℃
Min 10
5
Max100
■ TERMINOLOGY
· Vt: Per IEC 61000-4-2, 30A@8kV, level 4, trigger voltage measured initiation of pulse, all test in contact discharge mode.
Capacitance
Current
Insulation Resistance
(Max)
Rated Voltage
Rated Current
symbol
ZCM
RDC
ILCຫໍສະໝຸດ IRCRVRIR
Units
Test Condition
Value
Ω @100MHz 90(±25%)
Ω
㎂
pF
25℃±2℃
5V
0.5Vrms @1MHz
icmef212p900mfr 2012 90Ω 2lines common mode esd filter pagecommon mode esd filter icmef212p900mfr specificationcovers engineeringrequirements icmef212p900m(common mode esd filter) suppressingcommon mode noise highspeed differential data line onecommon mode filters twoesd suppression devices integrated ultralow profile ultralow profile (2.01.20.8mm) ceramicmultilayer type smd component non-polarizedproduct productconforming rohsdirective. lvdslines notebookcomputers usb2.0,ieee1394, dvi, lines pdp,lcd tv, dvd player, pc, audio player, dsc partnumber code mddi,mipi mobilephone productspecifications partnumber code icmef 21 2p 900 seriesname ict'scommon mode esd filter dimensions, 2.0mm lines2p= linesnumber lines,2p= linescommon mode impedance 100mhz),900= 90? tolerance commonmode impedance, 25%type electrodeplating: leadfree packing type, reelitem pagecommon mode esd filter icmef212p900mfr electricalcharacteristics characteristicscommon mode impedance resistance leakage current capacitance insulation resistance
传真机耗材型号对照
国 三星 SF-5800 SF-5800P
佳能 L770
SF-5805P
SF-5905P
硒鼓
5000 页
硒鼓
硒鼓
硒鼓
2500 页
硒鼓
2500 页
硒鼓
中 佳能 FX-2 佳能 L500
佳能 FX-3 佳能 L250
L600 L380
L350
L200
L240
L280
硒鼓 硒鼓
佳能 FX-4 佳能 L900 L880
硒鼓
理光 1465 理光 FAX SL310
硒鼓
理光 EM-1 理光 FAX EL800
硒鼓
中国 OA 技术论坛 树叶收集整理发布
中国 OA 技术论坛 树叶收集整理发布
UG-3221 松下 UG-3220 松下 UG-3313 松下 KX-PEP5 三星 SF5100D3 三星 SF5800D5 佳能 FX-1
松下 UF490 590
术
松下 UF-A8710 8880 8770 1100
技 松下 KX-6500 6100 6300 A 三星 SF5100、SF5100P、Msys-5100P、SF-530 SF535e SF-531P、SF-515 O SF550 SF808
兄弟 1270T 1970T 1270 1970 770 870
技 兄弟 FAX-1010 1020 1030 FAX-1170 1270 1570MC MFC-1770
1870MC 1970MC
A 兄弟 1150 1150P 1200P 1250 1700P 1350 1550MC 1650 1750 O 1850MC 1500M 1950
国
MR2920中文资料
Input voltage autosensingProvision for Standby mode operation Partial Resonance Power Supply IC Module MR29001. The circuit diagrams and parts tables provided for reference purposes in this document are for the use of persons with basic circuit design knowledge to aid in understanding the product.As such they do not constitute a guarantee of output, temperature, or other characteristics, or characteristics or safety as determined by the relevant authorities.2. The products noted in this document are semiconductor components for use in general electronic equipment and for general industrial use. Consideration has been given to ensure safety and reliability as appropriate for the importance of the systems used by the customer. Please contact Shindengen's sales section if any points are unclear.3. Fail-safe design and safety requirements must be considered in applications in which particularly high levels of reliability and safety are required (eg nuclear power control, aerospace, traffic equipment, medical equipment used in life-support, combustion control equipment, various types of safety equipment).Please contact our sales department if anything is unclear.4. Shindengen takes no responsibility for losses or damage incurred, or infringements of patents or other rights, as a result of the use of the circuit diagrams and parts tables provided for reference purposes in this document.5. The circuit diagrams and parts tables provided for reference purposes in this document do not guarantee or authorize execution of intellectual property rights, or any other rights, of Shindengen or third parties.6. Systems using Shindengen products noted in this document and which are strategic materials as defined in the Foreign Exchange and Foreign Trade Control Law or the Export and Trade Control Law require export permission under the relevant legislation prior to export.Inquiries: Functional Devices Division, Device Sales Department, Device Sales SectionPh 03-5951-8131Fax 03-5951-8089Thank you July 1st, 19951. Outline1.1 Introduction (4)Characteristics (4)1.2Applications (4)1.31.4 Absolute Maximum Ratings (4)and Reference Output Capacities1.5 Equivalent Circuit and Dimensions (4)2. Block Diagram2.1 Block Diagram (5)2.2 Pin Function Description (5)3. Operation Description3.1 Start-up Circuit (6)3.2 On-trigger Circuit (7)3.3 Partial Resonance (7)3.4 Standby Mode Control (8)3.5 Output Voltage Control (9)3.6 Soft Drive Circuit (9)3.7 Circuit for Load Shorts (10)3.8 Collector Pin (pin 7) (10)3.9 Thermal Shut-down Circuit (TSD) (10)3.10 Over-voltage Protection Circuit (OVP) (10)3.11 Malfunction Prevention Circuit (11)(patent applied for)3.12 Over-current Protection Circuit (11)4. Standard Circuit (12)5. Design Procedures5.1 Design Flow Chart (13)5.2 Main Transformer Design Procedure (13)5.3 Main Transformer Design Examples (15)5.4 Selection of Constants for (18)Peripheral Components6. Cooling Design6.1 Junction Temperature and Power Losses (19)6.2 Junction Temperature (19)and Thermal Resistance6.3 Cautions for Cooling Design (19)The values presented in this document are based on tentative specifications as of June 29th, 2001, and may change in futureThe MR2900 Series IC modules are designed for both 200V and autosensing input with a burst-mode switching function at micro-loads. These modules are of the partial resonance type, and are comprised of a switching device optimized for both 200V and autosensing power supply input, and a control IC. They are designed to provide the following power supply characteristics.1.2 Characteristics1. An ultra high-speed IGBT with 900V resistance ensures high efficiency and low noise at partial resonance.2. An ultra high-speed IGBT with 900V resistance simplifies design for autosensing power supply input.3. Very low power consumption at micro-loads (in burst mode).4. Onboard start-up circuit eliminates the need for start-up resistors.5. Soft drive circuit achieves low noise levels.6. Excess current protection function (ton limit, primary current limit).7. Excess voltage protection and thermal shut-down function.8. Power supply circuits may be constructed with a minimum of external components. 9. The use of a full mold package provides benefits in insulation design.1.3 ApplicationsTVs, displays, printers, VTR, DVD, STB, air-conditioners, refrigerators, and other electrical appliances, and office equipment.1.4 Absolute Maximum Ratings and Reference Output CapacitiesAbsolute maximum ratingsMaximum output capacity P o [W ]Peak input voltagePeak input currentInput voltage rangeModelV in [V ]I in [A ]90V to 276VAC180V to 276VACMR2920 7 100 150MR2940 90010 150 225Maximum output capacity and input voltage range differ with design conditions.1.5 Equivalent Circuit and DimensionsCollector GNDV ccEmitter/OCL F/BZ/C V in 4.5±0.54.2±0.5 4.25.0±0.2+0.27.6±0.52.7±0.20.7±0.22.2 Pin Function DescriptionPin numberAbbreviationDescription1Z/CTrigger input pinZero detection voltage: 0.35VStandby: Up to 4.5V in standby mode.2 F/B Feedback signal input pint on(min) to t on(max): 1.5V to 4.5V/0μs to 25μs Standby: Oscillation stopped at up to 0.8V. Standby: Oscillation started at 1.8V or higher.3 GND GND pin4 V cc IC power supply pinOscillation start voltage: V cc ≧14V Oscillation stop voltage: V cc ≦8.5V Excess voltage latching voltage:V cc =20V 5 V in Start pinCurrent supplied V in →V cc at start-up Start-up circuit OFF:V cc ≧14V Start-up circuit ON: V cc ≦7.6V6Emitter /OCL Main switching device emitter and current detection pin Excess current detection threshold:0.6VExcess current detection threshold at standby: 50mV7 Collecter Main switching device collector pinCollector Emitter/OCLV cc Z/C F/B V in GNDshort, oscillation is stopped when the voltage at the V cc pin reaches 8.5V, and when this voltage drops to 7.6V the start-up circuit operates again and the voltage at the V cc pin then begins rising. See Fig.3.2.Incorporation of the functions described above improve efficiency, particularly during standby, and reduces the number of start-up resistors required, thus reducing the overall number of components.The MR2000 Series employs current-critical operation to detect energy bursts at the secondary side of the main transformer and switch on the main switching device.Energy discharge timing is detected at the negative edge of the control coil voltage waveform (0.2V in the diagram at right), and the main switching device switched on for current-critical operation.The on-trigger detection voltage (0.2V) incorporates a 50mV hystersis to increase noise resistance.3.3 Partial ResonanceIn current-critical switching power supplies (RCC), damping begins at the resonance frequency (determined by the primary inductance L P of the main transformer and the resonating condenser C) when the secondary current in the circuit formed by connecting the resonating condenser between the collector and GND of the main switching device reaches 0A.The discharge current of the resonating condenser flows through the primary coil and returns energy to the input. Adjustment of the CR time constant applied to the Z/C pin (see diagram at right) allows the main switching device to be turned on at the trough of the damping voltage waveform, thus permitting a reduction in turn-on losses.In a circuit using partial resonance, the energy stored in the resonating condenser during the OFF period of the main switching device is returned to the input, thus permitting a reduction in turn-on losses. This allows the connection of a large-capacity condenser between the collector and GND of the main switching device, and thus permits a reduction in noise.The use of partial resonance is effective in permitting a simple circuit configuration with improved efficiency andnoise reduction.3.4 Standby Mode Control (patent applied for)The MR2000 Series is able to switch between two methodsof output voltage control - normal operation and the standbymode, in a single power supply.The standby mode supported by this IC employs the burst method for intermittent operation under light loads to reduce oscillation frequency and switching losses, and is effective in reducing the standby input voltage undermicro-loads.A unique characteristic of this IC is the use of the burstmode for intermittent operation without stopping IC control, and thus minimizing output ripple. The Z/C pin is clamped to a voltage of 4.5V (typical) or less by an external signal to allow selection of standby modecontrol. The standby mode is cleared (ie restored to thenormal mode) by clearing the clamp voltage on the Z/C pin, and applying a voltage of 4.5V (typical) or higher.In normal operation the ON range of the main switching device is controlled in a linear manner in relation to voltage variation at the F/B pin, while in standby mode operation the Emitter/OCL pin current detection threshold value isswitched from 0.6V for the normal mode to 0.05V for thestandby mode.The collector current is fixed at a peak value by the currentdetection threshold value, and the burst mode is selected.Burst mode control is such that oscillation occurs when the voltage at the F/B pin is 1.8V (typical) or higher, and isstopped when this voltage is 0.8V (typical) or lower.As output voltage control in the standby mode fixes thedrain current peak value for each oscillation cycle, the dutyratio of the oscillating and non-oscillating intervals is varied to ensure a constant voltage.3.5 Output Voltage Control (normal operation)The MR2000 Series controls output voltage with the ON range proportional to the voltage at the F/B pin.When the voltage at the F/B pin is 1.5V the ON range is 0µs, and is controlled in a linear manner so that when the voltage is 4.5V the ON range is 25µs. A current of 200µA=IF/B (typical) flows at the F/B pin, and the impedance of the photocoupler transistor connected externally between the F/B pin and GND is varied with the control signal from the secondary output detection circuit, thus controlling the ON range of the main switching device to produce a constant voltage.The maximum ON range is adjusted by setting the maximum value for the voltage at the F/B pin using a resistor connected externally between the F/B pin and GND.3.6 Soft Drive Circuit (patent applied for)The MR2000 Series supplies the main switching device gate drive voltage from two separate drive circuits.A voltage exceeding the threshold value for the main switching device is supplied from the first drive circuit at the leading edge of the drive voltage waveform to switch on the main switching device with the optimum timing.The drive voltage is then supplied gradually by the second drive circuit (see Fig.3.9).Supply of drive voltage in this manner reduces drive losses, as well as reducing noise due to gate charge current and discharge current when the resonating condenser is switched on.3.7 Circuit for Load ShortsThe MR2000 Series is designed so that when droop occurs under excessive load, output voltage drops, and control coil voltage drops in proportion.When the control coil voltage falls below 4.5V (typical) the standby mode is selected and the Emitter/OCL pin threshold voltage changes from 0.6V to 0.05V, thus limiting the collector current to approximately 1/10th of its previous value.This design permits a reduction in the stress on the MR2000 Series IC in the case of a load short, and control of the short-circuit current in the secondary diode and load circuit.3.8 Collector Pin (pin 7)The collector pin on the main switching device.The transformer is designed, and the resonating condenser adjusted, to ensure that V CE(max) is less than 900V.Depending upon input conditions, the collector pin may be subjected to reverse bias for a period during partial resonance.This IC employs an ultra high-speed IGBT in the main switching device. This device differs from MOSFET devices in that it has no body diode structure, thus requiring connection of an external high-speed diode between the Collector and Emitter/OCL pins.3.9 Thermal Shut-down Circuit (TSD)The MR2000 Series incorporates a thermal shut-down circuit.The onboard IC is latched at 150°C (typical) and oscillation is then stopped.Unlatch is achieved by momentarily dropping the voltage at the V cc pin to V UL (unlatch voltage) or lower.3.10 Over-voltage Protection Circuit (OVP)The MR2000 Series incorporates an over-voltage protection circuit (OVP).Latching occurs when the control coil voltage exceeds 20V (typical), and secondary output over-voltage protection then operates indirectly.Unlatch is achieved in the same manner as for the overheat protection circuit.3.11 Malfunction Prevention Circuit (patent applied for)The use of current-critical operation in the MR2000 Series ensures that the main transformer does not become saturated provided the droop setting is optimized.On the other hand, at start-up, and in the case of a load short, the output voltage is very much less than the set voltage.As the control coil voltage is proportional to the output voltage it also reaches an extremely small value, and the on-trigger timing may be incorrectly detected due to the ringing voltage while the device is OFF and switched on before the current-critical point.To counter this problem, the MR2000 Seriesincorporates a circuit to prevent on-trigger malfunction at start-up, and in the case of a load short. This function disables the on-trigger for a period of 2.7μs (typical) after the main switching device in the IC is switched OFF (on-dead time). This prevents incorrect detection due to the ringing voltage while the device is OFF.This design permits detection of the point at which the transformer secondary current is 0A at start-up, and in the case of a load short. The main switching device is then switched on at this point, allowing abnormal oscillation to be controlled.3.12 Over-current Protection CircuitA current detection resistor is connected between theEmitter/OCL pin and GND to detect current betweenthe emitter of the main switching device and the emitter current detection pin.During stable operation the main switching devicecurrent is limited by pulse-by-pulse operation with the0.6V threshold value.The leading edge clamp function preventsmalfunctioning and thus prevents incorrect detection atturn-on.During standby, the 50mV threshold value is selected and the oscillation noise from the transformer due to burst oscillation is reduced.V O NGND5.2 Main Transformer Design ProcedureThis design procedure provides an example of an electrical design procedure.Ensure that design of insulation materials, insulation configuration, and structure are in accordance with the necessary safety standards as determined by the relevant authorities.5.2.1 Standard Design ConditionsAbbreviation Unit ReferencevalueMinimum input voltage V AC(min) V ― Rated output voltage V o V ― Rated output current I o A ― Maximum output current I o(max) A ― Efficiencyη0.80~0.85Minimum oscillation frequency f (min) kHz 25k ~50kHz Duty ratio D 0.50~0.70 Control coil voltageV NC V 15~17V Effective cross-sectional area of transformer core A e mm 2― Magnetic flux density variation ΔB mT 250~320mTCoil current densityα A/mm 24~6A/mm 2Note that the above values are for reference only, and should be adjusted to suit load conditions.ReexaminationgReview transformer core size and oscillation frequency and redesign if I g is 1mm or greater.V FNC is the control coil voltage rectification diode forward voltage.The reference value for determining the control coil voltage V NC(min) is 15V to 17V.If the V NC(min) value is too small, start-up characteristics may deteriorate and start-up may become difficult. If the V NC(min) value is too large, the over-voltage latch stop voltage V OP is able to be reached easily. Check the V NC(min) voltage in an actual circuit during the design process to determine its optimum value.A NC C5.3 Main Transformer Design Examples5.3.1 Initial SetupInput voltage AC90~276V V O1:DC135V, 0.45A Efficiency 85% V O2:DC35V,0.40ARated output V O3:DC16V,0.40ATotal output 81.2W Oscillationfrequency at droop 29.6kHzDroop output110.36W (rated output x 1.36) Duty ratioT ON /T=0.655P on(max) is s or less. L °C isq μs.q andS1S2S35.4 Selection of Constants for Peripheral ComponentsT j(max) for the MR Series is 150°C.As operation of the MR Series is accompanied by an increase in temperature associated with power losses, it is necessary to consider the type of heat sink to be used. While a design which ensures that T j(max) is not exceeded is of absolute importance, the overheat protection function (T SD =150°C (typical)) must be also considered in any design. The extent to which T j is derated in a design is therefore extremely important in improving reliability.The majority of power losses during operation of the MR Series are associated with the internal MOSFET.If the majority of power losses are considered as ON losses, they may be expressed by the following equation.P D =V DS ×I DThe temperature increase (ΔT j ) due to power losses (P D ) is expressed as,ΔT j +T a ≦T j(max)and if T SD =150°C (typical) and T SD(min)=120°C are assumed, P D is limited so that the following equation is satisfied.ΔT j +T a ≦T SD(min)T j may be calculated as follows using the thermal resistance θja .T j =( P D ×θja ) +T aθja is the thermal resistance in the vicinity of the junction, and is expressed as follows.θja =θjc +θcf +θfaThermal shutdown (TSD) is a protective function which stops and latches operation at 150°C in the event of abnormal heating of the MR1520. Circuit design therefore requires a cooling design in which temperature has been sufficiently derated. Shindengen recommends that cooling design be such that case temperature does not exceed 100°C.6.1 Junction Temperature and Power Losses 6.2 Junction Temperature and Thermal Resistance Abbreviation UnitThermal resistance between junction and vicinity. θja ℃/WThermal resistance between junction and case. θjc ℃/WThermal resistance between case and fins(contact thermal resistance).θcf ℃/W Thermal resistance between case and fins(contact thermal resistance).θfa ℃/W 6.3 Cautions for Cooling Design。
Vigor2920 系
Vigor2920 系列雙WAN安全防護路由器快速安裝手冊版本: 1.0韌體版本: V3.3.3.1日期: 19/07/2010因手冊更新無法及時通知用戶,請隨時連上居易網站,取得最新的手冊內容。
版權資訊版權聲明© 2010版權所有,翻印必究。
此出版物所包含資訊受版權保護。
未經版權所有人書面許可,不得對其進行拷貝、傳播、轉錄、摘錄、儲存到檢索系統或轉譯成其他語言。
交貨以及其他詳細資料的範圍若有變化,恕不預先通知。
商標本手冊內容使用以下商標:z Microsoft為微軟公司註冊商標z Windows視窗系列,包括Windows 95, 98, Me, NT, 2000, XP 以及其Explorer均屬微軟公司商標z Apple以及Mac OS均屬蘋果電腦公司的註冊商標z其他產品則為各自生產廠商之註冊商標安全說明和保障安全說明z在設置前請先閱讀安裝說明。
z由於路由器是複雜的電子產品,請勿自行拆除或是維修本產品。
z請勿自行打開或修復路由器。
z請勿把路由器置於潮濕的環境中,例如浴室。
z請將本產品放置在足以遮風避雨之處,適合溫度在攝氏5度到40度之間。
z請勿將本產品暴露在陽光或是其他熱源下,否則外殼以及零件可能遭到破壞。
z請勿將LAN網線置於戶外,以防電擊危險。
z請將本產品放置在小孩無法觸及之處。
z若您想棄置本產品時,請遵守當地的保護環境的法律法規。
保固自使用者購買日起二年內為保固期限,請將您的購買收據保存二年,因為它可以證明您的購買日期。
當本產品發生故障乃導因於製作及(或)零件上的錯誤,只要使用者在保固期間內出示購買證明,居易科技將採取可使產品恢復正常之修理或更換有瑕疵的產品(或零件),且不收取任何費用。
居易科技可自行決定使用全新的或是同等價值且功能相當的再製產品。
下列狀況不在本產品的保固範圍內:(1)若產品遭修改、錯誤(不當)使用、不可抗力之外力損害,或不正常的使用,而發生的故障;(2) 隨附軟體或是其他供應商提供的授權軟體;(3) 未嚴重影響產品堪用性的瑕疵。
大连捷成
FL-1204A-P12×42800FL-1208A-P12×82880FL-1212A-P12×123240FL-1604A-P16×42880FL-1608A-P16×83240FL-1612A-P16×123420FL-1616A-P16×163600FL-0404S-P4×41580FL-0804S-P 8×42770单声道模拟音频、3Pin平衡接口单声道模拟音频、3Pin平衡接口立体声模拟音频、3Pin非平衡立体声立体声模拟音频、3Pin非平衡立体声单声道模拟音频、3Pin平衡接口AUDIO矩阵单声道模拟音频、3Pin平衡接口单声道模拟音频、3Pin平衡接口单声道模拟音频、3Pin平衡接口单声道模拟音频、3Pin平衡接口FL-0808S-P8×83070FL-1204S-P 12×4立体声模拟音频、3Pin非平衡立体声128014983080FL-1208S-P12×83170FL-1212S-P12×123560FL-1604S-P16×43160FL-1608S-P16×83400FL-1612S-P16×123760FL-1616S-P 16×163960立体声模拟音频、3Pin非平衡立体声立体声模拟音频、3Pin非平衡立体声立体声模拟音频、3Pin非平衡立体声立体声模拟音频、3Pin非平衡立体声立体声模拟音频、3Pin非平衡立体声立体声模拟音频、3Pin非平衡立体声立体声模拟音频、3Pin非平衡立体声STEREO矩阵FL-0404VA-BP4×42250FL-0804VA-BP8×42800FL-0808VA-BP8×83200FL-0404VS-BP4×41980FL-0804VS-BP8×43000FL-0808VS-BP8×83200FL-0404HDMI 4×42200 CVBS信号BNC接口、模拟单音频信号3Pin接口CVBS信号BNC接口、模拟单音频信号3Pin接口CVBS信号BNC接口、模拟单音频信号3Pin接口CVBS信号BNC接口、立体声音频3Pin接口CVBS信号BNC接口、立体声音频3Pin接口CVBS信号BNC接口、立体声音频3Pin接口HDMI接口,兼容DVI信号,支持EDID管理CVBS+AUDI OCVBS+STER EOFL-0404HDMI4×42600FL-0804HDMI8×44500FL-0808HDMI8×85600FL-0404HD4×42400FL-0808HD8×83800FL-1608HD16×84500FL-1616HD 16×165800 HD/SD-SDI信号,支持电缆均衡功能HD/SD-SDI信号,支持电缆均衡功能HDMI接口,兼容DVI信号,支持EDID管理(可扩展至8x8)HDMI接口,兼容DVI信号,支持EDID管理HDMI接口,兼容DVI信号,支持EDID管理HD/SD-SDI信号,支持电缆均衡功能HD/SD-SDI信号,支持电缆均衡功能DVI/HDMI HD/SD-SDIFL-0404G 4×42900FL-0808G 8×84900FL-1608G 16×85900FL-1616G 16×167900延保1年延保2年延保3年3G/HD/SD-SDI信号,支持电缆均衡/时钟恢复功能3G/HD/SD-SDI信号,支持电缆均衡/时钟恢复功能3G/HD/SD-SDI信号,支持电缆均衡/时钟恢复功能3G/HD/SD-SDI信号,支持电缆均衡/时钟恢复功能成交价格×15%3G/HD/SD-SDI成交价格×5%成交价格×10%。
SJ-A292A-FREQ中文资料
Drawing Specifications
Electrical Connection
Pin 1
For the most up to date specifications on each NEL product, log on to our website—
Dimensions shown in inches and millimeters.
Conditions
Min
Typical
— — — — — — — —
200.0 MHz 55/45% 1.70 V 2.56 V 600 psec +200 psec 3 psec +100 ppm
Max
Supply Voltage Supply Current Output Current Operating Temperature Storage Temperature Power Dissipation Lead Temperature Load StaA2920 Series
Differential Positive ECL (DPECL) Fast Edge SJ-A2920 Series Rev K
Frequency Range: 50.0 MHz to 200.0 MHz
Description
The SJ-A2920 Series of quartz crystal oscillators provide DPECL Fast Edge compatible signals. Systems designers may now specify space-saving, cost-effective packaged PECL oscillators to meet their timing requirements.
SMD2920中文资料
107SMD2920 Surface Mount PTC Devices R.O.C. Patent#415624ELECTRICAL CHARACTERISTICSMaximum Time To TripResistancePart NumberI hold (A)I trip (A) V max (Vdc) I max (A) P d max. (W) Current (A) Time (Sec.) R min (£[) R 1max (£[) Agency ApprovalSMD2920P030TS SMD2920P050TS SMD2920P075TS SMD2920P100TS SMD2920P125TS SMD2920P150TS SMD2920P185TS SMD2920P200TS SMD2920P200TS/24 SMD2920P250TS SMD2920P260TS SMD2920P300TS SMD2920P300TS/15 0.30 0.50 0.75 1.10 1.25 1.50 1.85 2.00 2.00 2.50 2.60 3.00 3.000.60 1.00 1.50 2.20 2.50 3.00 3.70 4.00 4.00 5.00 5.20 6.00 6.00 60 60 30 33 15 33 33 15 24 15 6 6 15 10 10 40 40 40 40 40 40 40 40 40 40 40 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.50 2.50 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 3.00 4.00 0.30 0.50 2.00 2.00 2.50 5.00 5.00 10.00 10.00 20.00 20.00 1.200 0.350 0.350 0.120 0.070 0.080 0.065 0.050 0.050 0.035 0.025 0.015 0.0154.800 1.400 1.000 0.410 0.250 0.230 0.150 0.125 0.125 0.085 0.075 0.048 0.048UL CSA TÜV UL CSA TÜV UL CSA TÜV UL CSA TÜV UL CSA TÜV UL CSA TÜV UL CSA TÜV UL CSA TÜV UL CSA TÜV UL CSA TÜV UL CSA TÜV UL CSA TÜV UL CSA TÜVNote: I hold = Hold current: maximum current device will pass without tripping in 20¢J still air.I trip = Trip current: minimum current at which the device will trip in 20¢J still air. V max = Maximum voltage device can withstand without damage at rated current (I max ) I max = Maximum fault current device can withstand without damage at rated voltage (V max ) P d = Power dissipated from device when in the tripped state at 20¢J still air. R min = Minimum resistance of device in initial (un-soldered) state.R 1max = Maximum resistance of device at 20¢J measured one hour after tripping or reflow soldering of 260¢J for 20 sec.Caution: Operation beyond the specified rating may result in damage and possible arcing and flame. ¡·Specifications are subject to change without notice.l The SMD2920 Series, a polymer-based Positive Temperature Coefficient (PTC) device to protect electrical circuits against overcurrent conditions with resettable feature, is fully compatible with current industrial standards. l The new designed SMD2920 Series provides surface mount overcurrent protection with superior performance.l Application: The SMD2920 Series is ideal for computers and peripherals and can be applied to almost anywhere there is a low voltage power supply and a load to be protected.lThe solder plated termination is designed to meet or exceed solderability specifications and provide excellent solder joint inspectability.l Agency Approval: UL File # E201431.CSA File # CA115375-1SMD2920 Surface Mount PTC Devices R.O.C. Patent#415624How to Select a Polymer PTC fuse:(1) Determine the following operating parameters for the circuits:(A) Normal Operating Current (I hold)(B) Maximum Circuit Voltage (V max)(C) Maximum Interrupt Current (I max)(D) Normal Operating Temperature (min¢J/max¢J)(2) Select the device form factor and dimension suitable for the application:Surface Mount Device (SMD Series)Radial Leaded Device (RLD Series)Axial Leaded Strap Device (STD Series)Other Custom-designed Device (Disc/Chip)(3) Compare the maximum ratings for V max and I max of the PTC device withthe circuit in application and make sure that the circuit’s requirement doesnot exceed the device ratings.(4) Check that the PTC device’s trip time (time-to-trip) will protect the circuit.(5) Verify that the circuit operating temperatures are within the PTC device’snormal operating temperature range.(6) Verify the performance and suitability of the chosen PTC device in theapplication.108109SMD2920 Surface Mount PTC Devices R.O.C. Patent#415624THERMAL DERATING CURVE FOR SMD2920 SERIESTHERMAL DERATING CHART FOR SMD2920 SERIES – Ihold (Amps)Ambient Operation TemperatureModel-40¢J -20¢J 0¢J 23¢J 40¢J 50¢J 60¢J 70¢J85¢J SMD2920P030TS 0.45 0.40 0.35 0.30 0.25 0.23 0.20 0.17 0.14 SMD2920P050TS 0.76 0.67 0.59 0.50 0.42 0.38 0.33 0.29 0.23 SMD2920P075TS 1.13 1.01 0.88 0.75 0.62 0.56 0.50 0.44 0.34 SMD2920P100TS 1.66 1.47 1.29 1.10 0.91 0.83 0.73 0.64 0.50 SMD2920P125TS 1.89 1.68 1.46 1.25 1.04 0.94 0.83 0.73 0.56 SMD2920P150TS 2.27 2.01 1.76 1.50 1.25 1.13 1.00 0.87 0.74 SMD2920P185TS 2.80 2.47 2.17 1.85 1.54 1.39 1.22 1.07 0.85 SMD2920P200TS 3.02 2.68 2.34 2.00 1.66 1.50 1.32 1.16 0.90 SMD2920P200TS/24 3.02 2.68 2.34 2.00 1.66 1.50 1.32 1.16 0.90 SMD2920P250TS 3.78 3.35 2.93 2.50 2.08 1.88 1.65 1.45 1.13 SMD2920P260TS 3.64 3.25 2.91 2.60 2.26 2.08 1.95 1.74 1.48 SMD2920P300TS 4.53 4.02 3.51 3.00 2.52 2.26 1.99 1.75 1.34 SMD2920P300TS/15 4.53 4.023.51 3.00 2.52 2.26 1.991.751.34-40.000.0040.0080.00120.00Device Ambient Temperature (¢J )0.0050.00100.00150.00200.00P e r c e n t a g e o f R a t e d C u r r e n t110SMD2920 Surface Mount PTC Devices R.O.C. Patent#415624AVERAGE TIME-CURRENT CURVE FOR SMD2920 SERIESSOLDER REFLOW0.10 1.0010.00100.00Fault Current (Amp.)0.010.101.0010.00100.00A BC D FG H J K E IT i m e t o T r i p (S e c .)A :SMD2920P030TSB :SMD2920P050TSC :SMD2920P075TSD :SMD2920P100TSE :SMD2920P150TSF :SMD2920P200TSG :SMD2920P125TSH :SMD2920P185TS I :SMD2920P250TSJ :SMD2920P260TSK :SMD2920P300TS111SMD2920 Surface Mount PTC Devices R.O.C. Patent#415624PHYSICAL DIMENSIONS (mm)A B C D E Part Number Min. Max. Min. Max. Min. Max. Min. Min. Max. SMD2920P030TS 6.73 7.98 4.80 5.44 0.75 1.25 0.30 0.25 2.00 SMD2920P050TS 6.73 7.98 4.80 5.44 0.75 1.25 0.30 0.25 2.00 SMD2920P075TS 6.73 7.98 4.80 5.44 0.75 1.25 0.30 0.25 2.00 SMD2920P100TS 6.73 7.98 4.80 5.44 0.55 1.00 0.30 0.25 2.00 SMD2920P125TS 6.73 7.98 4.80 5.44 0.55 1.00 0.30 0.25 2.00 SMD2920P150TS 6.73 7.98 4.80 5.44 0.75 1.25 0.30 0.25 2.00 SMD2920P185TS 6.73 7.98 4.80 5.44 0.75 1.25 0.30 0.25 2.00 SMD2920P200TS 6.73 7.98 4.80 5.44 0.75 1.25 0.30 0.25 2.00 SMD2920P250TS 6.73 7.98 4.80 5.44 0.75 1.25 0.30 0.25 2.00 SMD2920P260TS 6.73 7.98 4.80 5.44 0.55 1.00 0.30 0.25 2.00 SMD2920P300TS 6.73 7.98 4.80 5.44 0.75 1.25 0.30 0.25 2.00 SMD2920P300TS/156.737.984.805.440.751.250.300.252.00ENVIRONMENTAL SPECIFICATIONSOperating/Storage Temperature-40¢J to +85¢J Maximum Device Surface Temperature in Tripped State 125¢JPassive Aging +85¢J, 1000 hours ±5% typical resistance change Humidity Aging +85¢J, 85%R.H. 1000 hours ±5% typical resistance change Thermal Shock MIL-STD-202 Method 107G+85¢J/-40¢J 20 times -30% typical resistance change Solvent Resistance MIL-STD-202, Method 215 No changeVibrationMIL-STD-883C, Method 2007.1, Condition A No changePHYSICAL SPECIFICATIONSTerminal Material Solder-Plated Copper (Solder Material: 63/37 SnPb)Lead Solderability Meets EIA Specification RS186-9E, ANSI/J-STD-002 Category 3. Packaging16 mm tape on 7 inch reel per EIA-481-1 (equivalent to IEC286, part 3) 2000 devices per reel for P100TS, P125TS &P260 others : 1500 devices per reel¡· Specifications are subject to change without notice.FIGURESOLDER PAD LAYOUTSSMD2920 Surface Mount PTC Devices R.O.C. Patent#415624TAPE SPECIFICATIONS: EIA-481-1P030TS-P075TS P100TS P150TS–P185TSP050TS P125TS P200TS–P250TSP260TS P300TSW 16.0+/-0.30 16.0+/-0.30 16.0+/-0.307.5+/-0.05 7.5+/-0.05 7.5+/-0.051 1.75+/-0.10 1.75+/-0.10 1.75+/-0.100 1.55+/-0.05 1.55+/-0.05 1.55+/-0.051 1.5+/-0.10 1.5+/-0.10 1.5+/-0.10P0 4.0+/-0.10 4.0+/-0.10 4.0+/-0.101 8.0+/-0.10 8.0+/-0.10 8.0+/-0.10P2 2.0+/-0.05 2.0+/-0.05 2.0+/-0.050 5.45+/-0.10 5.45+/-0.10 5.45+/-0.1007.65+/-0.10 7.65+/-0.10 7.65+/-0.10T 0.25+/-0.10 0.25+/-0.10 0.25+/-0.100 1.25+/-0.10 1.00+/-0.10 1.45+/-0.10Leader min. 390 390 390160 160 160(mm)H 12.0+/-0.15W 9.0+/-0.5D 60+/−0.5F 13.0+/-0.2C 178+/-1.0H111+/-0.5W1 2.5+/-0.5W2 3.0+/-0.5W3 4.0+/-0.5W4 5.0+/-0.5(mm)112SMD2920 Surface Mount PTC Devices R.O.C. Patent#415624 PART NUMBERING SYSTEMSMD2920 P ¡¼¡¼¡¼TSSolder Plated TerminationMultilayer Thickness VersionCurrent RatingPolytronics SymbolDevice Dimensions: Length/Width(Unit: 1/100 inch)Surface Mount DeviceCROSS REFERENCECross ReferencePolytronics/ EVERFUSE TMRaychem/ PolySwitch® Bourns/ Multifuse®SMD2920P030TS SMD2920P050TS SMD2920P075TS SMD2920P100TS SMD2920P125TSSMD2920P150TS SMD2920P185TS SMD2920P200TSSMD2920P200TS/24 SMD2920P250TS SMD2920P260TS SMD2920P300TSSMD2920P300TS/15 SMD030SMD050SMD075SMD100/33SMD125SMD150/33 (3425)SMD185 (3425)SMD200 (3425)N/ASMD250 (3425)SMD260SMD300N/AMF-SM030MF-SM050(30Vdc)MF-SM075MF-SM100(30Vdc)MF-SM125MF-SM150(15Vdc)N/AMF-SM200 (3425)N/AMF-SM250 (3425)MF-SM260N/AN/A“Multifuse” is a registered trademark of Bourns , Inc.“PolySwitch” is a registered trademark of Raychem Corporation.¡· S pecifications are subject to change without notice.113SMD2920 Surface Mount PTC Devices R.O.C. Patent#415624 114。
2920封装系列贴片保险丝
I trip = Trip Current. Minimum current at which the device will always trip in 25°C still air.
Pd
= Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
Thermal Derating Curve
Derating Curves for JSMD2920 Series
160 140 120 100
80 60 40 20
0
-40
-20
0
20
40
Temperature (°C)
Average Time-Current Curve
100
Average Time Current Curves
Curren t
(A)
Time (Sec)
Resistance
R i min ()
R1ma
x
()
JSMD2920-030 JS/030 60.0 100 0.30
0.60
1.5
1.5
3.0
0.600
4.800
JSMD2920-050 JS/050 60.0 100 0.50
1.00
1.5
2.5
4.0
0.88
0.75
0.62
0.56
JSMD2920-100
1.66
1.47
1.29
1.10
0.91
0.83
JSMD2920-125
1.89
德清华英电子SAW带通滤波器说明书
DEQING HUAYING ELECTRONICS CO.,LTD.APPROVAL SHEETSAW BANDPASS FILTERPART NO.: NDFG010-1580SAProduct Type:Customer:SAW FilterPart NO.:Customer Part NO.:NDFG010-1580SAVer. Ctrl.:Issued Date:SFG010-1580SA -160315-v1.0PREPARED BY CHECKED BY APPROVED BY Part No. : NDFG010-1580SAPages : 10Data : 2016-3-15Revision : SFG010-1580SA -160315-v1.0Add (Deqing): 188 Zhiyuan North Rd.Wukang Town Deqing County Zhejiang Province 313200,P.R.ChinaPhone : +86-572-8281127Fax : +86-572-8281298E-mail : *******************Website : Revision Date Description Remark SFG010-1580SA -160315-v1.0 2016-3-15 First draftMarkingTop View, Laser MarkingStability CharacteristicsItem No. Test Item STD Reference Test Conditions per lotPreconditioning JESD22-A113 1) Temperature Cycling, 5 cycles -40℃to85℃2) Bake, 24 hrs @125±5℃;3) Reflow, 3 reflow cycles using profiles perIPC/JEDEC J-STD-020, SnPb or Pb-freeprofile based on device end use process4) Drying, Room ambient temperature2111 TemperatureCycling JESD22-A104 -40℃/ +85℃,40min dwell,<1 min transfertime,500cycles232 High TemperatureStorage JESD22-A103 85℃,240hr233 Low TemperatureStorage JESD22-A119 -40℃, 240hr234 High Temp. HighHumidity Storage JESD22-A106B 85°C , 85%RH, 240hr235 High TemperatureOperating JESD22-A102C +121℃100%RH 96hr236 Human Body ModeESD JESD22-A114 Measure to get the ESD limits level or marginbeyond specification57 Drop Test IEC 68-2-32 100㎝3times Steel floor JIG(110g~150g) 68 Solder ability JESD22-B102 Characterization per JESD22-B102 59 Vibration, VariableFrequency JESD22-B103 20 Hz to 2 kHz (log variation) in > 4 minutes,4X in each orientation, 50g peak acceleration2310 Mechanical Shock JESD22-B104 Y1 plane only, 5 pulses, 0.5 ms duration, 1500g peak acceleration2311 Solder HeatResistance IEC 68-2-21 Ue3 ±250V,C=100pF,R=1.5kΩ,1times1112 Static marginal test JESD22-A114F C=100pF,R=1.5kΩ,1times ( demand ofcustomer )1113 Power capacityMargin Limits / Power margin tests beyond input powerspecification:CW signal,85℃,highest in-band frequency,2hours dwell time for each step, repeat the testsuntil DUT abnormal12Requirements: The SAW filer shall remain within the electrical specifications after tests.。
联想凌拓DM系列存储平台简介
DM240ION MAPPING
DM7000F* DM7000H DM5000F* DM5000H DM3000H
DM240S (2U24) ▪ 24 x 2.5" drives
DM600S (4U60) ▪ 60 x 3.5" or 2.5" drives ▪ High Density Offering
480 HDDs/SSDs
DM120s, DM240s, DM600s
275K IOPs
DM7000F SPECIFICATION OVERVIEW
▪ Active-Active Controllers ▪ Unified Storage
Form Factor Cache Array Base host ports per system
Maximum host connectivity ports
Drive expansion ports Maximum drives Expansion support System performance (100% 8KB random read @ 1ms)
Lenovo DM7000F
3U
256GB
联想凌拓DM 系列存储平台简介
LENOVO OFFERING OVERVIEW
All Flash
UNIFIED
➢ Maximum performance
➢ Latency sensitive apps
➢ Mission critical workload Hybrid ➢ Cost effective
A700s
All-Flash
A700
Apollo (NVMe)
2N2920中文资料
TO–77 PACKAGE
PIN 1 – Collector 1 PIN 2 – Base 1 PIN 3 – Emitter 1 PIN 4 – Emitter 2 PIN 5 – Base 2 PIN 6 – Collector 2
ABSOLUTE MAXIMUM RATINGS
(Tamb = 25°C unless otherwise stated)
mV
1
1) Terminals not under test are open circuited under all test conditions. 2) The lower of the two readings is taken as hFE1.
Semelab plc.
Telephone +44(0)1455 556565. Fax +44(0)1455 552612. E-mail: sales@ Website:
mA
nA
W mmho
— pF
TRANSISTOR MATCHING CHARACTERISTICS Static Forward Current Gain VCE = 5V
Balance Ratio See Note 2. VCE = 5V VCE = 5V VCE = 5V TA1 = 25°C VCE = 5V TA1 = 25°C
Prelim. 9/95
INDIVIDUAL TRANSISTOR CHARACTERISTICS IC = 10mA Collector – Base Breakdown Voltage
V(BR)CEO* Collector – Emitter Breakdown Voltage IC = 10mA Emitter – Base Breakdown Voltage Collector Cut-off Current Collector Cut-off Current Emitter Cut-off Current IE = 10mA VCB = 45V
15 Watt单输出开框SMD选择指南说明书
RP15-4805SOFW RP15-483.3SOFW15 Watt Single OutputOpen Frame SMDSelection Guide 24V and 48V Input TypesPart NumberInput Output Output Input (1)Efficiency (2)Capacitive (3)Range Voltage Current Current Load max.VDC VDC mA mA %RP15-243.3SOFW**9-36 3.3400060/680851000µF RP15-2405SOFW**9-365300070/754871000µF RP15-2412SOFW**9-3612130010/79386330µF RP15-2415SOFW**9-3615100010/76386220µF RP15-483.3SOFW**18-75 3.3400040/340851000µF RP15-4805SOFW**18-755300040/377871000µF RP15-4812SOFW**18-7512130010/39786330µF RP15-4815SOFW**18-7515100010/38286220µF** Standard part is without suffix and has no Trim or CTRL connections* add suffix /P for CTRL function with positive logic (1=ON, 0=OFF) including trim pin * add suffix /N for CTRL function with negative logic (0=ON, 1=OFF) including trim pin . * add suffix -R for Tape and Reel Packaging Ordering ExamplesRP15-4805SOFW = 48V 4:1 Input, 5V Output, No CTRL pin, No Trim PinRP15-4805SOFW/P = 48V 4:1 Input, 5V Output, Positive Logic CTRL pin and Trim pin fitted.RP15-243.3SOFW/N = 24V 4:1 Input, 3.3V Output, Negative Logic CTRL pin and Trim pin fittedDescription●Ultraminiature Open Frame SMD ●15 Watts Output Power ●4:1 Input Voltage Range ●Single Output●2.25kVDC Isolation●Fixed Operating Frequency●Optional Remote On/Off and Trim pins ●Efficiency to 87%FeaturesThe RP15-SOFW series are SMD open frame ultraminiature power DC/DC converters in a case half the size of industry standard 15W converters. The converters use solder ball pins to enable SMD mounting and can be reflow soldered. Despite their small size,the RP15-SOFW converters are fully specified devices with output currents up to 4 Amps, no minimum load, 2250VDC isolation and low ripple/noise figures.The outputs are also fully protected against short circuits, overcurrent and overvoltage. The RP15-S0FW series will find many uses in telecommunications and otherdemanding applications where price, board space or board height is at a premium.Please Read Application NotesREV:0/2014P-37RP15-SOFWPOWERLINEDC/DC-Converterwith 3 year WarrantyDerating graphs are valid only for the shownpart numbers. If you need detailed derating-information about a part-number not shown here please contact our technical support **********************************125755025100Ambient Temperature Range (°C)-40-10050608090100O u t p u t P o w e r (%)76Natural Convection-2570RP15-4805SOFWUL-60950-1 Certified E196683RoHS2011/65/EU6/6Derating Graph(Ambient T emperature)Input Voltage Range 24V nominal input 9-36VDC 48V nominal input18-75VDC Input FilterPi Type Input Surge Voltage (100 ms max.)24V Input 50VDC 48V Input100VDC Input Reflected Ripple (nominal Vin and full load) (4)30mAp-p Start Up Time (nominal Vin and constant resistor load)30ms max.Optional Remote ON/OFF (5)DC-DC ON Short or 0V < Vr < 1.2V Negative logic (/N)DC-DC OFF Open or 3.0V < Vr < 15V DC-DC ON Open or 3.0V < Vr < 15V Positive logic (/P)DC-DC OFF Short or 0V < Vr < 1.2VRemote Pin drive current Nominal Vin -0.5mA~1.0mARemote OFF input currentNominal Vin 2.5mAOutput Voltage Accuracy (full Load and nominal Vin)±1%Optional Output Trim (5)±10%Minimum Load0%Line Regulation (low line, high line at full load)All Output voltages ±0.2%Load Regulation (0% to full load)All Output voltages ±0.2%Ripple and Noise (20MHz bandwith, with 1µF MLCC on output)All Output voltages 100mVp-p Temperature Coefficient±0.02%/°C max.Transient Response (25% load step change)250µs Over Voltage Protection3.3V 3.7-5.4V Zener diode clamp (only single)5V 5.4-7.0V 12V 13.5-19.6V 15V16.8-20.5V Over Load Protection (% of full load at nominal Vin)150% typUndervoltage Lockout See Application Notes Short Circuit Protection Hiccup, automatic recovery Efficiencysee …Selection Guide“ tableIsolation Voltage (rated for one minute)Basic Isolation2250VDC Isolation Resistance 1 G Ωmin.Isolation Capacitance 1500pF max.Operating Frequency 3.3V, 5V 350kHz typ All others400kHz typOperating Temperature Range -40°C to +85°C (with derating)Storage Temperature Range -55°C to +125°CThermal Impedance Natural convection18.2°C/Watt Thermal Shock MIL-STD-810FVibration 10-55Hz, 2G, 30 Min. along X, Y and ZRelative Humidity 5% to 95% RHBase Material FR4 PCB Weight 10.5gPacking QuantityRefer to App Notes for tube dimensions20 pcs per Tube 120 pcs per ReelDimensions 27.9 x 23.9 x 8.5mm continued on next pageSpecifications (typical at nominal input and 25°C unless otherwise noted)POWERLINEDC/DC-ConverterRP15-SOFW SeriesR P 15-S O F WREV: 0/P-38Specifications (typical at nominal input and 25°C unless otherwise noted)POWERLINEDC/DC-ConverterRP15-SOFW SeriesConducted Emissions (6)EN55022Class A/B Radiated Emissions EN55022ClassB Radiated Immunity EN61000-4-3Perf. Criteria A Fast Transient (7)EN61000-4-4Perf. Criteria A Surge (7)EN61000-4-5Perf. Criteria A Conducted Immunity EN61000-4-6Perf. Criteria A MTBF (8)Bellcore TR-NWT-0003321322 x 103hours MIL-HDBK 217F515 x 103hours1. Values at nominal input voltage and no load/full load.2. Typical Value at nominal input voltage and full load.3.Test by minimum Vin and constant resistor load.4.Simulated source impedance of 12µH. 12µH inductor in series with +Vin.5.If no suffix is specified, the control and trim pins will be omitted. If fitted, the ON/OFF control function can be positive or negative logic. The pin voltage is referenced to negative input.Positive logic ON/OFF is marked with suffix-P (eg. RP15-2405SOFW/P)Negative logic ON/OFF is marked with suffix-N (eg. RP15-2405SOFW/N).6. Meets Class A with external components shown above. Will meet Class B with external common mode filter (see Application Notes)7.Requires external capacitor to meet EN61000-4-4_5: 220µF/100V, low ESR (48mOhm)8.BELLCORE TR-NWT-000332. Case l: 50% Stress, Temperature at 40°C.MIL-HDBK 217F Notice 2. Ta = 25°C, full load, (Ground Benign, controlled environment).Notes :REV:0/2014P-39RP15-S0FWEMC Filtering - For Class B filter suggestion, see Application NotesClass A Filter470pF/ 3kVVin=24V: C1=6.8µF/50V 1812 MLCC, L1 = 10µH, 2.6A, 40mOhm, 0705 SMD Vin=48V: C1= 2.2µF/100V 1812 MLCC, L1 = 18µH, 1.6A, 1Ohm, 0705 SMDPOWERLINEDC/DC-ConverterRP15-SOFWSeriesPackage Style and Pinning (mm)Pin ConnectionsPin #Standard /P or /N 1+Vin +Vin 2-Vin -Vin 3no pin CTRL 4+Vout +Vout 5no pin Trim 6-Vout-VoutPCB Tolerance ±0.5 mmSMD Pin Pitch Tolerance ±0.25mmR P 15-S O F WREV: 0/P-40Trim UpR UTrim DownR D5654External Output Trimming (optional)With /P or /N suffix, output can be externally trimmed by using the method shown here. See Application Notes for details.Typical Characteristics301848Efficiency VS Input Voltage3642245460667072747678808284868890E f f i c i e n c y (%)Input Voltage (V)7225075Efficiency VS Output load501004045505560657075808590Output Load (%)E f f ic ie n c y (%)RP15-4805SOFWRP15-4805SOFW27.923.91.81.8Recommended Pads =2.8mm dia.The product information and specifications are subject to change without prior notice. All products are designed for non-safety critical commercial and industrial applications.The Buyer agrees to implement safeguards that anticipate the consequences of any failures that might cause harm, loss of life and/or damage property.RP15-4805SOFW RP15-483.3SOFW。
SF-2410FP-T系列快速响应精确SMD保护朗道说明书
*R o H SC O MP LI A N T*Ro H SC O M P L I A N T &**HA LO G E N F RE EF 3A Clearing Time Characteristics for Series% of Current Rating100 %200 %Electrical CharacteristicsModel Rated Current(A)SF-2410FP0062T-20.062SF-2410FP008T-20.080SF-2410FP010T-20.100**** Melting I 2t calculated at 10 times rated current.*RoHS Directive 2015/863, Mar 31, 2015 and Annex.** B ourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less.SinglFuse ™ SF-2410FP-T Series Applicationsn N otebooks n LCD Monitors n LCD Backlight Inverters n POE, POE+n PC Servers n Power Supplies n Game Consoles n White GoodsEnvironmental CharacteristicsOperating Temperature .................................................................................................................................................................-55 °C to +125 °C Storage ConditionsTemperature .............................................................................................................................................................................+15 °C to +30 °C Humidity..........................................................................................................................................................................................20 % to 70 % Shelf Life..........................................................................................................................................................2 years from manufacturing date Moisture Sensitivity Level .......................................................................................................................................................................................1ESD Classification (HBM).............................................................................................................................................................................Class 6Average Pre-Arcing Time vs. Current Curves62 mA750 mA500 mA 400 mA 375 mA 315 mA 250 mA 80 mA 100 mA 125 mA 160 mA 200 mA 1000001000010001001010.10.010.001P R E -A R C I N G T I M E (S E C O N D S )0.011010.1CURRENT (A) 1 A10 A8 A 7 A 5 A 4 A 3.5 A 1.5 A 2 A 2.5 A 3 A 3.15 A 1000001000010001001010.10.010.001P R E -A R C I N G T I M E (S E C O N D S )0.1100101CURRENT (A)Average I 2t vs. t Curves1000010001001010.10.010.0010.0001I 2t (A 2s )0.010.1110100100010000010000TIME (SECONDS)62 mA80 mA 100 mA 125 mA 160 mA 200 mA 250 mA 315 mA 375 mA 400 mA 500 mA 750 mA 1000000010000001000001000010001001010.1I 2t (A 2s )0.010.1110100100010000010000TIME (SECONDS)1 A1.5 A 2 A2.5 A 3 A3.15 A 3.5 A 4 A 5 A 7 A 8 A 10 APackagingHow to OrderSF - 2410 FP 0062 T - 2SinglFuse™Product DesignatorSMD Footprint2410 = EIA 2410 (6125 metric)Fuse Blow TypeFP = Fast Acting PrecisionRated Current0062 ~ 1000 (62 mA ~ 10 A)Structure TypeT = Ceramic Tube Packaging Type- 2 = Tape & ReelTypical Part MarkingRepresents total content. Layout may vary.Product DimensionsRecommended Pad Layout(.102 ± .004)2.95(.116)3.15(.124)DIMENSIONS:MM (INCHES)DIMENSIONS:MM (INCHES)Solder Reflow RecommendationsT e m pe r a t u r eTimet 25 °C TO PEAKT PT LTS T 25 °CS* Tolerance for peak profile temperature (Tp ) is defined as a supplier minimum and a user maximum.Solder Wave RecommendationsT em pe r at u r e (°C )Peak Temperature (Dwell Time)Time (Sec.)10030028026024022020018016014012010080604020Current Rating Thermal Derating Curve120100806040200-60-40-20020406080100120140AMBIENT TEMPERATURE (°C)R A T E D C U R R E N T P E R C E N T A G E (%)Reliability TestingREV. 11/23Asia-Pacific: Tel: +886-2 2562-4117 • Email: ******************EMEA: Tel: +36 88 885 877 • Email: ******************The Americas: Tel: +1-951 781-5500 • Email: *******************This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and its affiliates (collectively, “Bourns”).Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change without notice. Users should check for and obtain the latest relevant information and verify that such information is current and complete before placing orders for Bourns® products.The characteristics and parameters of a Bourns® product set forth in its data sheet are based on laboratory conditions, and statements regarding the suitability of products for certain types of applications are based on Bourns’ knowledge of typical requirements in generic applications. The characteristics and parameters of a Bourns® product in a user application may vary from the data sheet characteristics and parameters due to (i) the combination of the Bourns® product with other components in the user’s application, or (ii) the environment of the user application itself. The characteristics and parameters of a Bourns®product also can and do vary in different applications and actual performance may vary over time. Users should always verify the actual performance of the Bourns® product in their specific devices and applications, and make their own independent judgments regarding the amount of additional test margin to design into their device or application to compensate for differences between laboratory and real world conditions.Unless Bourns has explicitly designated an individual Bourns® product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949) or a particular qualification (e.g., UL listed or recognized), Bourns is not responsible for any failure of an individual Bourns® product to meet the requirements of such industry standard or particular qualification. Users of Bourns® products are responsible for ensuring compliance with safety-related requirements and standards applicable to their devices or applications.Bourns® products are not recommended, authorized or intended for use in nuclear, lifesaving, life-critical or life-sustaining ap-plications, nor in any other applications where failure or malfunction may result in personal injury, death, or severe property or environmental damage. Unless expressly and specifically approved in writing by two authorized Bourns representatives on a case-by-case basis, use of any Bourns® products in such unauthorized applications might not be safe and thus is at the user’s sole risk. Life-critical applications include devices identified by the U.S. Food and Drug Administration as Class III devices and generally equivalent classifications outside of the United States.Bourns expressly identifies those Bourns® standard products that are suitable for use in automotive applications on such products’ data sheets in the section entitled “Applications.” Unless expressly and specifically approved in writing by two authorized Bourns representatives on a case-by-case basis, use of any other Bourns® standard products in an automotive application might not be safe and thus is not recommended, authorized or intended and is at the user’s sole risk. If Bourns expressly identifies a sub-category of automotive application in the data sheet for its standard products (such as infotainment or lighting), such identification means that Bourns has reviewed its standard product and has determined that if such Bourns®standard product is considered for potential use in automotive applications, it should only be used in such sub-category of automotive applications. Any reference to Bourns® standard product in the data sheet as compliant with the AEC-Q standard or “automotive grade” does not by itself mean that Bourns has approved such product for use in an automotive application.Bourns® standard products are not tested to comply with United States Federal Aviation Administration standards generallyor any other generally equivalent governmental organization standard applicable to products designed or manufactured for use in aircraft or space applications. Bourns expressly identifies Bourns® standard products that are suitable for use in aircraft or space applications on such products’ data sheets in the section entitled “Applications.” Unless expressly and specifically approved in writing by two authorized Bourns representatives on a case-by-case basis, use of any other Bourns® standard product in an aircraft or space application might not be safe and thus is not recommended, authorized or intended and is at the user’s sole risk.The use and level of testing applicable to Bourns® custom products shall be negotiated on a case-by-case basis by Bourns and the user for which such Bourns® custom products are specially designed. Absent a written agreement between Bourns and the user regarding the use and level of such testing, the above provisions applicable to Bourns® standard products shall also apply to such Bourns® custom products.Users shall not sell, transfer, export or re-export any Bourns® products or technology for use in activities which involve the design, development, production, use or stockpiling of nuclear, chemical or biological weapons or missiles, nor shall they use Bourns® products or technology in any facility which engages in activities relating to such devices. The foregoing restrictions apply to all uses and applications that violate national or international prohibitions, including embargos or international regulations. Further, Bourns® products and Bourns technology and technical data may not under any circumstance be exported or re-exported to countries subject to international sanctions or embargoes. Bourns® products may not, without prior authorization from Bourns and/or the U.S. Government, be resold, transferred, or re-exported to any party not eligibleto receive U.S. commodities, software, and technical data.To the maximum extent permitted by applicable law, Bourns disclaims (i) any and all liability for special, punitive, consequential, incidental or indirect damages or lost revenues or lost profits, and (ii) any and all implied warranties, including implied warranties of fitness for particular purpose, non-infringement and merchantability.For your convenience, copies of this Legal Disclaimer Notice with German, Spanish, Japanese, Traditional Chinese and Simplified Chinese bilingual versions are available at:/legal/disclaimers-terms-and-policiesPage:Web。
产品规格书
控制方式
同步控制伎持双备份
10
控制距离
超五类双绞网线,超过100米使用光纤传输
11
软件接口
Windows
12
信号输入
RJ45
(7)屏体运行参数
1
工作电压
AC:n0V~240V∖50~60Hz伎持双备份
2
峰值功率
≤400W∕m2
3
平均功率
100W∕m2〜180W∕m2
4
连续工作时间
≥7×24hrs,支持连续不间断显示
1
LED种类
SMD1515
2
像素点间距
1.875mm
3
像素点组成
IRlGlB
(3)模组技术参数
1
模组分辨率(宽*高)
160像素*90像素
2
模组尺寸(宽X高)
(宽)30Ommχ(高)168.75mm
3
模组信号输入
支持精密镀金接插件直连
4
模组电源输入
支持精密镀金接插件直连
5
模组数据存储
支持数据存储
6
电磁兼容
5
平均无故障工作时间
>1000H
6
LED寿命
10万小时
7
离散失控点
<0.001,出厂时为0
8
连续失Hale Waihona Puke 点09盲点率
≤0.001,出厂时为0
10
屏幕温升(使用运行状态)
M5度
11
运彳再境温度
-10℃-60℃
12
运行环境湿度
10%~90%RH,猿结
注:参数指标根据项目的具体情况会有变化(产品按照提交合同规格书为准)
自恢复保险丝SMD2920封装参数型号规格书大全
24 The SMD2920 Series PTC provides surface mount over-current protection for applications where space is at a premium and resettable protection is desired.u RoHS compliant, Lead-Free and Halogen-Free u Fast time-to-tripu Compact design saves board space u Low resistance uLow-profileu Mobile phones - battery and port protection u Game console port protection u USB peripherals u Disk driveu PDAS / digital cameras u Power portsuGeneral electronicsHold Current TripCurrent RatedVoltage MaxCurrent TypicalPower Maximum TimeTo Trip Resistance Part NumberI hold (A)I trip (A) V max (Vdc) I max (A) P dtyp. (W) Current (A) Time(Sec.) R min(Ω) R 1max(Ω) SMD2920-030 0.300.60 60 100 1.5 1.5 3.0 0.600 4.800 SMD2920-050 0.50 1.00 60 100 1.5 2.5 4.0 0.180 1.400 SMD2920-075 0.75 1.50 33 100 1.5 8.0 0.3 0.100 1.000 SMD2920-100 1.10 2.20 33 100 1.5 8.0 0.5 0.065 0.410 SMD2920-125 1.25 2.50 33 100 1.5 8.0 2.0 0.050 0.250 SMD2920-150 1.50 3.00 33 100 1.5 8.0 2.0 0.035 0.230 SMD2920-185 1.85 3.70 33 100 1.5 8.0 2.5 0.030 0.150 SMD2920-200 2.00 4.00 16 100 1.5 8.0 4.5 0.020 0.120 SMD2920-250 2.50 5.00 16 100 1.5 8.0 16.0 0.020 0.085 SMD2920-260 2.60 5.20 6 100 1.5 8.0 10.0 0.014 0.075 SMD2920-3003.00 6.00 6 40 1.5 8.0 20.0 0.012 0.048 SMD2920-300/16V 3.00 6.00 16 100 1.5 8.0 20.0 0.012 0.048I hold = Hold current: maximum current device will pass without tripping in 23°C still air. I trip = Trip current: minimum current at which the device will trip in 23°C still air. V max = Maximum voltage device can withstand without damage at rated current (I max ) I max = Maximum fault current device can withstand without damage at rated voltage (V max ) P dtyp.= Power dissipated from device when in the tripped state at 23°C still air. R min = Minimum resistance of device in initial (un-soldered) state.R 1max = Maximum resistance of device at 23°C measured one hour after tripping.Caution: Operation beyond the speci fied rating may result in damage and possible arcing and flame.SMD2920-300/V 3.00 6.00 100 1.5 8.0 20.0 0.012 0.048 24.......SM 2.50 5.00 100 1.5 8.0 16.0 0.020 0.085 D2920-250/24V 24Profile FeaturePb-Free Assembly Average Ramp-Up Rate (T S max to T P ) 3°C/second max. Preheat :Temperature Min (T S min) Temperature Max (T S max) Time (T S min to T S max) 150°C 200°C60-180 seconds Time maintained above: Temperature(TL) Time (tL)217°C60-150 seconds Peak/Classification Temperature(T P ): 260°C Time within 5°C of actual peak: Temperature20-40 seconds Ramp-down Rate:6°C/ second max. Time 25°C to Peak Temperature8 minutes max.Note: All temperatures refer to of the package, measured on the package body surface.Solder reflowDue to “Lead Free ” nature, Temperature and Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components.1.Recommended max past thickness > 0.25mm.2.Devices can be cleaned using standard methods and aqueous solvent.3.Rework use standard industry practices.4.Storage Environment : < 30/ 60%RH℃Caution:1.If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.2.Devices are not designed to be wave soldered to the bottom side of the board.5Terminal pad material Pure TinSoldering CharacteristicsMeets EIA specification RS 186-9E, ANSI/J-std-002 Category 3holdA B C DeviceNominalNominal Nominal 2920 Series5.102.305.60050L SMDProduct name size 2920 mils SMD :surface mount deviceHold Current 0.50ATape & Reel Quantity2,000 pcs/reelModel-40℃ -20℃ 0℃25℃40℃50℃60℃70℃85℃SMD2920-030 0.45 0.40 0.35 0.30 0.25 0.23 0.20 0.17 0.14 SMD2920-050 0.76 0.67 0.59 0.50 0.42 0.38 0.33 0.29 0.23 SMD2920-075 1.13 1.01 0.88 0.75 0.62 0.56 0.50 0.44 0.34 SMD2920-100 1.66 1.47 1.29 1.10 0.91 0.83 0.73 0.64 0.50 SMD2920-125 1.89 1.68 1.46 1.25 1.04 0.94 0.83 0.73 0.56 SMD2920-150 2.27 2.01 1.76 1.50 1.25 1.13 1.00 0.87 0.74 SMD2920-185 2.80 2.47 2.17 1.85 1.54 1.39 1.22 1.07 0.85 SMD2920-200 3.02 2.68 2.34 2.00 1.66 1.50 1.32 1.16 0.90 SMD2920-250 3.78 3.35 2.93 2.50 2.08 1.88 1.65 1.45 1.13 SMD2920-260 3.64 3.25 2.91 2.60 2.26 2.08 1.95 1.74 1.13 SMD2920-300 4.53 4.02 3.51 3.00 2.52 2.26 1.99 1.75 1.34 SMD2920-300/16V4.534.023.513.002.522.261.991.751.34Maxmum ambient operating temperature (Tmao) vs. hold current ( I hold )u Operation beyond the specified maximum ratings or improper use may result in damage and possible electrical arcing and/or flame.u PPTC device are intended for occasional over-current protection. Application for repeated over-current condition and/or prolonged trip are not anticipated.uAvoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device performance.0.646 (16.4)0.512(13.0)Arbor Hole DiameterDimensions are in inches (and millimeters)0.157 (4.0) 0.059 (1.5)Diameter Cover tape(8.0)(13.3)。
KYOCERA FS-1920 说明书
i安装注意事项对于因安装不当所引起的损坏我公司概不负责软件声明本机所用软件必须支持打印机仿真模式打印机出厂时设定为 PCL仿真仿真模式可以按照第 1 章中所述的操作步骤进行修改本手册声明本手册内容若有变更恕不另行通知在以后版本中可能会插入增补内容对于本版中可能出现的任何技术错误或排版错误敬请用户见谅用户在遵照本手册指示操作时如发生意外我公司概不负责对于打印机固件只读存储器中的内容的故障我公司概不负责本手册页式打印机附带或相关的所有具版权的材料均受到版权保护版权所有未经京瓷公司事先书面许可禁止复印或以其它方式复制本手册及所有具版权的材料全部或部分内容本手册及所有具版权的材料全部或部分内容的复印件必须包含与其原件相同的版权声明关于商标PRESCRIBE是京瓷公司的注册商标KPDL 及KIR 京瓷图像精细技术是京瓷公司的商标Diablo 630 是 Xerox Corporation 的产品IBM Proprinter X24E 是 IBM 公司的产品Epson LQ-850 是 Seiko Epson Corporation 的产品Hewlett-Packard PCL 及 PJL 是惠普公司的注册商标Centronics 是 Centronics Data Computer Inc.的商标PostScript 是 Adobe Systems Incorporated 的注册商标Macintosh 是苹果电脑公司的注册商标Microsoft Windows 及 Windows NT是微软公司的注册商标PowerPC 和Microdrive 是 IBM 公司的商标CompactFlash 是 SanDisk Corporation 的商标E NERGY S TAR 是在美国注册的标记所有其它品名及产品名称是其相关公司的注册商标或商标京瓷公司的此款页式打印机采用 PeerlessPrintXL 提供 HP LaserJet 兼容 PCL6 语言仿真PeerlessPrintXL 是 The Peerless Group 的商标公司地址Redondo Beach CA 90278U.S.A.本机使用 Wind River Systems 公司的 Tornado实时操作系统及工具开发而成Agfa Monotype Corporation 的 UFST及 MicroType2004 京瓷美达株式会社版权所有2004 年 4 月 1.0 修正版iiIBM 程序授权协议您所购买的产品中包含一个或多个属于国际商用机器公司以下称作IBM的软件程序以下称作程序本协议阐明了 IBM 将软件授权于您的条款和条件若不接受本授权协议中的条款和条件可在购买本机后 14 天之内将其退回货款将全额返还若未能在 14 天之内退回产品则将认定您已接受协议的条款和条件程序为授权使用并非出售IBM 或适用国家的 IBM 机构仅授权您在获得该程序的国家内使用您获得的授权只限于本协议下准予的范围程序一词系指正版程序及其全部或部分复制内容包括修改后的复制内容或并入其它程序的部分IBM 保留对程序的所有权程序涉及的版权为 IBM 所拥有或已得到其所有者的授权1. 授权根据此授权协议您仅可在安装此程序的产品上使用程序或将此程序及产品的所有权同时转让另一方若要转让程序则必须将本授权协议的副本及所有其它相关文件同时转让对方对您的授权随即终止另一方在初次使用此程序前应接受本协议的条款和条件您不得1使用复制修改合并或转让程序的复件除非本授权协议载明2对程序进行反安装或反编译或3转授出租租赁或转让程序2. 有限的保证程序依现状提供有关程序再无其它明示或默示的保证条件包括但不限于关于适销性或适用于特定用途的默示保证有些管辖范围不允许排除默示保证因此上述排除规定可能对您并不适用3. 赔偿限制根据本授权协议IBM 的全部责任如下1对于在任何方面与本授权协议相关的任何形式的任何索赔包括根本性违约所致IBM 将只负责实际损失并以以下较高者为限a 与 25000美元等值的当地货币金额或b IBM 当时通用的程序授权使用费此限制条款不适用 IBM 负有法律责任的人身伤害或对个人不动产或有形资产的破坏IBM 将不对任何利润损失储蓄损失或任何偶然损坏或其它间接经济损失承担责任即使 IBM 或其授权供应商已经知悉此种损失的可能性IBM 将不会受理您根据任何第三方索赔所提出的任何赔偿要求此限制条款同样适用 IBM 的所有程序开发商IBM 与开发商的赔偿限额不累计因此开发商是本章节的指定受益人有些管辖范围不允许此类限制或排除规定因此这些条款可能对您并不适用4. 综合您可随时终止授权协议若您未能遵守本授权协议的条款和条件IBM 可以终止对您的授权在任何一种情况下您均必须销毁所有程序的复件您应负责支付由此授权协议而发生的任何税费包括个人财产税任何一方均不得在诉讼原因出现两年以上后提出任何诉讼若您是在美国获得此程序则本授权协议将受纽约州法律的管辖若您是在加拿大获得此程序则本授权协议将受安大略省法律的管辖否则本授权协议将受您获得此程序所在国家法律的管辖iii字体商标声明本机的所有常驻字体均由 Agfa Corporation授权Helvetica Palatino 及 Times 是 Linotype-Hell AG的注册商标ITC Avant Garde Gothic ITC Bookman ITC ZapfChancery 及 ITC Zapf Dingbats 是 International Typeface Corporation的注册商标Agfa Japan 授权协议1.软件系指用专门的格式编码的数字式机器可读可升级数据以及 UFST软件2.您同意接受非独占性授权以在您返回 Agfa Japan 的注册卡上所载明的地址,专门为您自己的常规业务或个人目的使用此软件复制和显示字母数字代码及符号Typefaces 的粗细风格及样式根据本授权协议的条款您有权在最多三台打印机上使用字体若您需要在三台以上打印机上存取字体您应申请多用户授权协议这可从 Agfa Japan获得Agfa Japan 保留对软件及字体的所有权利所有权及权益您的权利范围只限于授权按本协议明确载明的条款使用软件3.为保护 Agfa Japan 的专利权您同意对软件及有关字体的其它专利信息严格保密并制定合理的措施管理软件及字体的存取和使用4.您同意不复制或复印软件或字体但您可进行备份您同意在任何此类备份上应保留原件中的专利声明5.本授权协议应一直延续到软件及字体的使用结束除非协议提前终止若您未能遵守本授权协议的条款而且在 Agfa Japan通知后三十30天内未能予以改正Afga Japan可终止协议当本授权协议期满或终止时您应按要求退还 Agfa Japan 或销毁所有软件字体及文件6.您同意不对软件进行修改变更分解解密反工程或反编译7.Agfa Japan保证在交货后九十90天内软件运行符合 Agfa Japan 发布的标准且软盘在材质及工艺上无缺陷Agfa Japan 不保证软件无缺陷错误和疏忽双方同意所有其它明示或默示保证包括关于适用于特定用途及适销性的保证排除在外8.有关软件及字体对您的专门赔偿亦即 Agfa Japan 的唯一责任为在其退回 Agfa Japan时修理或更换故障部分在任何情况下 Afga Japan 均不会对利润损失数据丢失或任何其它偶然或间接损失或由于滥用软件及字体或对其使用不当所造成的任何损失承担责任9.本协议受美国纽约州法律的管辖10.未经 Agfa Japan 的事先书面许可您不应转授出售租赁或其它方式转让软件和或字体11.政府使用复制或泄漏应视情况受到FAR 252-227-7013b3ii或c1ii 中技术数据与计算机软件权利条款的限制条件制约其它使用复制或泄漏应受到适用FAR 52.227-19c2中所阐明有限权利软件的限制条件制约12.您声明已阅读本协议了解其内容并同意受到其中条款和条件的约束任何一方不应受到未在本协议中所载明的任何声明或陈述约束对本协议的修改除非得到各方授权代表的书面签署否则一概无效打开软盘包装即表示您同意接受本协议的条款和条件墨粉使用注意事项•请勿焚烧墨粉及墨粉盒否则会有火星灼伤的危险•切勿打开墨粉盒或废粉盒•务必防止吸入墨粉或用沾上墨粉的双手擦拭眼睛或碰到嘴唇而且务必要防止其沾在皮肤上•有关用过的墨粉盒与废粉盒的处理请向经销商垂询或遵照国家与地方法规及法令处理墨粉或墨粉盒•墨粉盒与废粉盒应远离儿童目录iv目录简介......................................................................................................................................................x 特点. (xi)欲知详情...................................................................................................................................................................xiv 操作手册指南....................................................................................................................................................................xv 第 1 章使用操作面板...........................................................................................................1-1了解操作面板...................................................................................................................................................................1-2信息显示屏...............................................................................................................................................................1-2接口指示灯...............................................................................................................................................................1-3纸张尺寸指示灯.......................................................................................................................................................1-3纸张类型指示灯.......................................................................................................................................................1-4就绪数据以及注意指示灯...................................................................................................................................1-4按键...........................................................................................................................................................................1-5菜单系统路径图.......................................................................................................................................................1-6打印测试页.....................................................................................................................................................................1-12菜单图.....................................................................................................................................................................1-12状态页.....................................................................................................................................................................1-14维修状态页.............................................................................................................................................................1-18网络卡接口状态页.................................................................................................................................................1-19字体列表.................................................................................................................................................................1-21转储接收的数据.....................................................................................................................................................1-23纸张使用.........................................................................................................................................................................1-24设定纸张尺寸.........................................................................................................................................................1-24设定纸盒中的纸张尺寸 .........................................................................................................................1-24设定 MP 托盘中的纸张尺寸 .................................................................................................................1-28设定纸张类型.........................................................................................................................................................1-30设定纸盒中的纸张类型 .........................................................................................................................1-30设定 MP 托盘中的纸张类型 .................................................................................................................1-31创建自定义纸张类型 .............................................................................................................................1-32重新设定自定义纸张类型 .....................................................................................................................1-36MP 托盘模式...........................................................................................................................................................1-37选择供纸源.............................................................................................................................................................1-38选择接纸盘.............................................................................................................................................................1-39忽略 A4 与 Letter 尺寸的差别...............................................................................................................................1-40目录v页码标记.........................................................................................................................................................................1-41仿真.........................................................................................................................................................................1-41改变仿真 .................................................................................................................................................1-41用于 KPDL 仿真的可选仿真 .................................................................................................................1-42打印 KPDL 故障 .....................................................................................................................................1-43字体.........................................................................................................................................................................1-44默认字体 .................................................................................................................................................1-44默认字号 .................................................................................................................................................1-46改变 Courier/Letter Gothic 的字形 ........................................................................................................1-47设定 Courier/Letter Gothic 的字符间距 ................................................................................................1-48代码集.....................................................................................................................................................................1-49打印份数.................................................................................................................................................................1-50打印方向.................................................................................................................................................................1-51KIR 京瓷图像精细技术...................................................................................................................................1-52省粉打印.................................................................................................................................................................1-54分辨率.....................................................................................................................................................................1-55e-MPS..............................................................................................................................................................................1-56快速打印.................................................................................................................................................................1-57校验保留.................................................................................................................................................................1-59打印个人作业.........................................................................................................................................................1-61打印存储的作业.....................................................................................................................................................1-63打印编码作业.........................................................................................................................................................1-65打印编码作业列表.................................................................................................................................................1-67检索虚拟信箱VMB 中的作业.......................................................................................................................1-68打印 VMB 列表......................................................................................................................................................1-69e-MPS 配置.............................................................................................................................................................1-70接口.................................................................................................................................................................................1-74并行接口模式.........................................................................................................................................................1-74USB 接口模式.........................................................................................................................................................1-75串行接口参数.........................................................................................................................................................1-76网络接口参数.........................................................................................................................................................1-78使用存储装置.................................................................................................................................................................1-81启用 RAM 磁盘......................................................................................................................................................1-81读取数据.................................................................................................................................................................1-83写入数据.................................................................................................................................................................1-84删除数据.................................................................................................................................................................1-86从 CompactFlash 卡读取字体................................................................................................................................1-87格式化存储装置.....................................................................................................................................................1-88打印数据名称列表.................................................................................................................................................1-89目录vi配置.................................................................................................................................................................................1-91页面保护模式.........................................................................................................................................................1-91换行LF 操作....................................................................................................................................................1-92回车CR 操作...................................................................................................................................................1-93宽幅 A4 间距...........................................................................................................................................................1-94打印浓度.................................................................................................................................................................1-95总打印页数.............................................................................................................................................................1-96墨粉计数器复位.....................................................................................................................................................1-96信息语言.................................................................................................................................................................1-97自动换页超时.........................................................................................................................................................1-99睡眠定时器设定...................................................................................................................................................1-100打印机复位...........................................................................................................................................................1-102资源保护...............................................................................................................................................................1-103警告蜂鸣器设定..........................................................................................................................................1-104自动继续设定.......................................................................................................................................................1-105双面打印错误检测设定.......................................................................................................................................1-107第 2 章纸张选择...................................................................................................................2-1一般指示...........................................................................................................................................................................2-2纸张可用性...............................................................................................................................................................2-2纸张规格...................................................................................................................................................................2-2选择适合的纸张.......................................................................................................................................................2-3专用纸...............................................................................................................................................................................2-7投影胶片投影用胶片.......................................................................................................................................2-7不干胶标签...............................................................................................................................................................2-8纸张类型.........................................................................................................................................................................2-12第 3 章保养...........................................................................................................................3-1更换墨粉盒.......................................................................................................................................................................3-2墨粉盒更换周期.......................................................................................................................................................3-2填充墨粉...................................................................................................................................................................3-3更换废粉盒.......................................................................................................................................................................3-6更换废粉盒...............................................................................................................................................................3-6清洁...................................................................................................................................................................................3-9清洁充电器电极丝...................................................................................................................................................3-9清洁充电器栅极.....................................................................................................................................................3-10纸张传送装置.........................................................................................................................................................3-13目录vii第 4 章故障排除...................................................................................................................4-1一般性指导.......................................................................................................................................................................4-2打印质量问题...................................................................................................................................................................4-3指示灯和信息...................................................................................................................................................................4-6指示灯.......................................................................................................................................................................4-6保养信息...................................................................................................................................................................4-7错误信息.................................................................................................................................................................4-10排除卡纸故障.................................................................................................................................................................4-12纸盒或打印机内卡纸.............................................................................................................................................4-14在选购双面器处卡纸.............................................................................................................................................4-16在选购分页器处卡纸.............................................................................................................................................4-18在 MP 托盘处卡纸..................................................................................................................................................4-20第 5 章字体...........................................................................................................................5-1字体列表...........................................................................................................................................................................5-2PCL可升级和位图字体...................................................................................................................................5-2KPDL字体1......................................................................................................................................................5-5KPDL字体2......................................................................................................................................................5-6附录 A 选购件......................................................................................................................A-1可用选购件......................................................................................................................................................................A-2扩展打印机内存..............................................................................................................................................................A-3安装选购件......................................................................................................................................................................A-9PF-60 供纸盒............................................................................................................................................................A-9DU-61 双面器........................................................................................................................................................A-12SO-60 分页器.........................................................................................................................................................A-15EF-60 信封送纸器.................................................................................................................................................A-21PT-4/PT-60 背部托盘 ............................................................................................................................................A-25网络接口卡............................................................................................................................................................A-26Microdrive 硬盘..............................................................................................................................................A-28CompactFlash存储卡....................................................................................................................................A-30附录 B 主机接口..................................................................................................................B-1并行接口..........................................................................................................................................................................B-2并行接口通信模式..................................................................................................................................................B-2接口信号..................................................................................................................................................................B-2USB 接口.........................................................................................................................................................................B-5规格..........................................................................................................................................................................B-5接口信号..................................................................................................................................................................B-5目录viii串行接口选购..........................................................................................................................................................B-6RS-232C 接口...........................................................................................................................................................B-6RS-232C 协议..................................................................................................................................................................B-7PRESCRIBE FRPO D0 命令...................................................................................................................................B-9RS-232C 电缆连接........................................................................................................................................................B-10采用适合的 RS-232C 电缆....................................................................................................................................B-10将打印机连接至计算机........................................................................................................................................B-10附录 C 规格..........................................................................................................................C-1术语表................................................................................................................................... 术语表-1索引........................................................................................................................................... 索引-1。
- 1、下载文档前请自行甄别文档内容的完整性,平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益,请联系客服反馈,我们会尽快为您处理(人工客服工作时间:9:00-18:30)。
Surface Mountable PTC Resettable Fuse : FSMD2920 Series
1. Summary
(a) RoHS Compliant (Lead Free) Product
(b) Applications : All high-density boards
(c) Product Features : 2920 Dimension, Surface mountable, Solid state, Faster time to
trip than standard SMD devices.
(d) Operation Current : 300mA~3.0A
(e) Maximum Voltage : 6V~60V
(f) Temperature Range : -40℃ to 85℃
2. Agency Recognition
UL : File No. E211981
C-UL: File No. E211981
TUV: File No. R50090556
Note: FSMD300-2920 TUV Pending
3. Electrical Characteristics (23℃)
I H=Hold current-maximum current at which the device will not trip at 23℃still air.
I T=Trip current-minimum current at which the device will always trip at 23℃ still air.
V MAX=Maximum voltage device can withstand without damage at it rated current.(I MAX)
I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23℃ still air environment. R MIN=Minimum device resistance at 23℃prior to tripping.
R1MAX=Maximum device resistance at 23℃measured 1 hour post trip.
Termination pad characteristics
Termination pad materials : Pure Tin
4. FSMD Product Dimensions (Millimeters)
A B C D
Part Number Min Max Min Max Min Max Min FSMD030-2920 6.73 7.98 4.80 5.44 0.60 1.15 0.35 FSMD050-2920 6.73 7.98 4.80 5.44 0.60 1.15 0.35 FSMD075-2920 6.73 7.98 4.80 5.44 0.35 1.15 0.35 FSMD100-2920 6.73 7.98 4.80 5.44 0.40 1.00 0.35 FSMD125-2920 6.73 7.98 4.80 5.44 0.40 0.90 0.35 FSMD150-2920 6.73 7.98 4.80 5.44 0.40 0.90 0.35 FSMD185-2920 6.73 7.98 4.80 5.44 0.30 0.90 0.35 FSMD200-2920 6.73 7.98 4.80 5.44 0.30 0.90 0.35 FSMD250-2920 6.73 7.98 4.80 5.44 0.30 0.90 0.35 FSMD260-2920 6.73 7.98 4.80 5.44 0.30 0.90 0.35 FSMD300-2920
6.73
7.98 4.80 5.44 0.40 0.90 0.35
5. Thermal Derating Curve
6. Typical Time-To-Trip at 23℃
7. Material Specification
Terminal pad material : Pure Tin
Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3
8. Part Numbering and Marking System
Part Numbering System Part Marking System
F S M D □ □ □ - 2920 Current rating
Example
Warning: -Operation beyond the specified maximum ratings or improper use may result in damage and possible
electrical arcing and/or flame.
-PPTC device are intended for occasional overcurrent protection. Application for repeated overcurrent condition and/or prolonged trip are not anticipated. 甲、 -Avoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device
performance.
9. Pad Layouts 、Solder Reflow and Rework Recommendations
The dimension in the table below provide the recommended pad layout for each FSMD2920 device
Profile Feature
Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3 ℃/second max.
Preheat :
Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) 150 ℃ 200 ℃ 60-180 seconds
Time maintained above:
Temperature(T L ) Time (t L ) 217 ℃
60-150 seconds Peak/Classification Temperature(Tp) : 260 ℃
Time within 5℃ of actual Peak :
Temperature (tp)
20-40 seconds Ramp-Down Rate : 6 ℃/second max.
Time 25 ℃ to Peak Temperature :
8 minutes max. Note 1: All temperatures refer to of the package,
measured on the package body surface.。