30W_EFD25_sample
磁芯EFD30
3C90 3C94 3C95 3C96 3F35 3F3 3F4
Properties of core sets under power conditions (continued) B (mT) at GRADE H = 250 A/m; f = 25 kHz; T = 100 °C ≥330 ≥330 ≥330 ≥340 ≥300 ≥315 ≥300 ≥300 f = 500 kHz; ˆ = 50 mT; B T = 100 °C − − − ≤ 1.7 ≤ 0.6 − − − f = 500 kHz; ˆ = 100 mT; B T = 100 °C − − − − ≤ 4.5 − − − 3 CORE LOSS (W) at f = 1 MHz; ˆ = 30 mT; B T = 100 °C − − − − − − ≤ 1.4 ≤ 1.1 f = 1 MHz; ˆ = 50 mT; B T = 100 °C − − − − − − − ≤ 4.0 f = 3 MHz; ˆ = 10 mT; B T = 100 °C − − − − − − ≤ 2.2 ≤ 1.8
TYPE NUMBER
CSH-EFD30-1S-12P(1)
2008 Sep 01
4
Ferroxcube
EFD cores and accessories
MOUNTING PARTS General data ITEM Clip REMARKS stainless steel (CrNi); clamping force ≈35 N FIGURE 3
FERROXCUBE
DATA SHEET
EFD30/15/9 EFD cores and accessories
Supersedes Байду номын сангаасata of September 2004 2008 Sep 01
Leshan Radio Company 有限公司，高功率透电器件 MAXIMUM RATINGS
Symbol PD
T j , TS t g
Max 225
-55 to +150
Unit mW °C
LH8550PLT1G Series
S-LH8550PLT1G Series
3
1 2
SOT–23
COLLECTOR 3
1 BASE
2 EMITTER
Rev.C 1/4
LESHAN RADIO COMPANY, LTD. LH8550PLTIG Series,S-LH8550PLTIG Series
Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable
DEVICE MARKING AND ORDERING INFORMATION
Device
Marking
Shipping
(S-)LH8550PLT1G
KIO
0.60
PIN 1. BASE 2. EMITTER 3. COLLECTOR
0.035 0.9
0.079 2.0
0.031 0.8
inches mm
Rev.C 4/4
3000/Tape&Reel
(S-)LH8550PLT3G
KIO
10000/Tape&Reel
(S-)LH8550QLT1G
KIY
3000/Tape&Reel
(S-)LH8550QLT3G
KIY
10000/Tape&Reel
MAXIMUM RATINGS Rating
Collector-Emitter Voltage Collector-Base Voltage Emitter-Base Voltage Collector Current-continuoun
IR公司_大功率MOS管选型
I DContinuous Drain Current(A)70°Micro3Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPartNumberPD Max.PowerDissipation (W)N-ChannelLogic LevelIRLML2402*912570.54200.25 1.20.95230H1IRLML2803912580.54300.251.20.93230P-ChannelLogic LevelIRLML6302*912590.54-200.6-0.62-4.8230H1IRLML5103912600.54-300.6-0.61-4.8230* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)70°Micro6Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPartNumberPD Max.PowerDissipation (W)N-ChannelLogic LevelIRLMS1902915401.7200.10 3.2 2.675H2IRLMS1503915081.7300.103.22.675P-ChannelLogic LevelIRLMS6702*914141.7-200.20-2.3-1.975H2IRLMS5703914131.7-300.20-2.3-1.975* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)70°Micro8Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart NumberP D Max.PowerDissipation (W)N-Channel Logic LevelIRF7601* 912611.820 0.035 5.7 4.6 70 H3IRF7603 912621.830 0.035 5.6 4.5 70Dual N-Channel Logic LevelIRF7501* 912651.220 0.135 2.4 1.9 100 H3IRF7503 912661.2530 0.135 2.4 1.9 100P-Channel Logic LevelIRF7604* 912631.8-20 0.09 -3.6 -2.9 70 H3IRF7606 912641.8-30 0.09 -3.6 -2.9 70Dual P-Channel Logic LevelIRF7504* 912671.25-20 0.27 -1.7 -1.4 100 H3IRF7506 912681.25-30 0.27 -1.7 -1.4 100Dual N- and P-Channel Logic LevelIRF7507* 912691.2520 0.1352.4 1.9 100 H3-20 0.27 -1.7 -1.4IRF7509 912701.2530 0.135 2.4 1.9 100-30 0.27 -1.7 -1.4* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-Pak D -PakSOT-227Micro6SOT-223Micro8 2 Illustrations not to scaleI DContinuous Drain Current(A)70°SO-8Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRF7413913302.5300.011139.250H4IRF7413A 916132.5300.0135128.450IRF9410915622.5300.0375.850Dual N-ChannelIRF7311914352.0200.029 6.6 5.362.5H4IRF7313914802.0300.029 6.5 5.262.5IRF7333917002.0300.10 3.5 2.862.5917002.0300.050 4.9 3.962.5IRF9956915592.0300.103.52.862.5Dual P-ChannelIRF7314914352.0-200.058-5.3-4.362.5H4IRF7316915052.0-300.058-4.9-3.962.5IRF9953915602.0-300.25-2.3-1.862.5* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)70°SO-8Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)RΘMax.ThermalResistance(°C/W)1FaxonDemand Number Case Outline KeyPart NumberP D Max.PowerDissipation (W)Dual N- and P-ChannelIRF7317 915682.020 0.029 6.6 5.3 62.5 H42.0-20 0.058 -5.3 -4.3 62.5IRF9952 915622.030 0.103.5 2.8 62.5915622.0-30 0.25 -2.3 -1.8 62.5IRF7319 916062.030 0.029 6.5 5.2 62.52.0-30 0.058 -4.9 -3.9 62.5* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-Pak D -PakSOT-227Micro6SOT-223Micro8 2 Illustrations not to scaleI DContinuous Drain Current(A)70°SO-8Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelLogic LevelIRF7401912442.5200.0228.77.050H4IRF7201911002.5300.0307.0 5.650IRF7403912452.5300.0228.55.450Dual N-ChannelLogic LevelIRF7101908712.0200.10 3.5 2.362.5H4IRF7301912382.0200.050 5.2 4.162.5IRF7303912392.0300.050 4.9 3.962.5IRF7103910952.0500.1303.02.362.5P-ChannelLogic LevelIRF7204911032.5-200.060-5.3-4.250H4IRF7404912462.5-200.040-6.7-5.450IRF7205911042.5-300.070-4.6-3.750IRF7406912472.5-300.045-5.8-3.750IRF7416913562.5-300.02-10-7.150* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)70°SO-8Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)Dual P-ChannelLogic LevelIRF7104910962.0-200.250-2.3-1.862.5H4IRF7304912402.0-200.090-4.3-3.462.5IRF7306912412.0-300.10-3.6-2.962.5Dual N- and P-Channe Logic LevelIRF7307912421.4200.050 4.3 3.490H4-200.090-3.6-2.9IRF7105910972.0250.1093.5 2.862.52-250.25-2.3-1.862IRF7309912432.0300.050 4.9 3.962.5-300.10-3.6-2.9* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)70°SOT-223Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRFL4105913812.1550.045 3.7 3.060H6IRFL110908612.01000.54 1.50.9660IRFL4310913682.11000.20 1.6 1.360IRFL21090868 2.02001.50.960.660IRFL214908622.02502.00.790.560P-ChannelIRFL9110908642.0-1001.2-1.1-0.6960H6N-ChannelLogic LevelIRLL3303913792.1300.031 4.6 3.760H6IRLL014N 914992.1550.14 2.0 1.660IRLL2705913802.1550.043.83.060* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)100°D-PakSurface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRFR33039164257300.0313321 2.2H7IRFR024N9133638550.0751610 3.3IRFR41059130248550.0452516 2.7IRFR12059131869550.0273723 1.8IRFR11090524251000.54 4.3 2.75IRFR120N 91365391000.219.1 5.8 3.2IRFR391091364521000.11159.5 2.4IRFR2109052625200 1.5 2.6 1.75IRFR22090525422000.8 4.833IRFR21490703252502 2.2 1.45IRFR2249060042250 1.1 3.8 2.43IRFR3109059725400 3.6 1.7 1.15IRFR3209059842400 1.8 3.123IRFR42090599425003 2.4 1.53IRFRC2090637426004.421.33* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)100°D-PakSurface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)P-ChannelIRFR55059161057-550.11-18-11 2.2H7IRFR53059140289-550.065-28-18 1.4IRFR90149065425-600.5-5.1-3.25IRFR90249065542-600.28-8.8-5.63IRFR91109051925-100 1.2-3.1-25IRFR91209052042-1000.6-5.6-3.63IRFR9120N 9150739-1000.48-6.5-4.1 3.2IRFR92109052125-2003-1.9-1.25IRFR92209052242-200 1.5-3.6-2.33IRFR92149165850-250 3.0-2.7-1.7 2.5IRFR93109166350-4007.0-1.8-1.12.5* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)100°D-PakSurface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelLogic LevelIRLR27039133538300.0452214 3.3H7IRLR33039131657300.0313321 2.2IRLR31039133369300.0194629 1.8IRLR024N 9136338550.0651711 3.3IRLR27059131746550.042415 2.7IRLR29059133469550.0273623 1.8IRLR120N 91541391000.18511 6.9 3.2IRLR341091607521000.10159.52.4* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)100°D 2PakSurface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart NumberP D Max.PowerDissipation (W)N-ChannelIRFZ24NS 913554555 0.07 17 12 3.3 H10IRFZ34NS 913116855 0.04 29 20 2.2IRFZ44NS 9131511055 0.022 49 35 1.4IRFZ46NS 9130512055 0.020 53 37 1.3IRFZ48NS 9140814055 0.016 64 45 1.1IRF1010NS 913723.855 0.011 84 60 40IRF3205S 9130420055 0.008 110 80 0.75IRFZ44ES 9171411060 0.023 48 34 1.4IRF1010ES 9172017060 0.012 83 59 0.90IRF2807S 9151815075 0.013 71 50 1.0IRF520NS 9134047100 0.2 9.5 6.7 3.2IRF530NS 9135263100 0.11 15 11 2.4IRF540NS 91342110100 0.052 27 19 1.6IRF1310NS 91514120100 0.036 36 25 1.3IRF3710S 91310150100 0.028 46 33 1.0IRF3315S 9161794150 0.082 21 15 1.6IRF3415S 91509150150 0.042 37 26 1.0IRFBC20S 9.101450600 4.4 2.2 1.4 2.5IRFBC30S 9101574600 2.2 3.6 2.3 1.7IRFBC40S 91016130600 1.2 6.2 3.9 1.0* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-Pak D -PakSOT-227Micro6SOT-223Micro8 2 Illustrations not to scaleI DContinuous Drain Current(A)100°D 2PakSurface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemandNumberCase Outline KeyPart NumberP D Max.PowerDissipation (W)IRFBF20S 9166554900 8.0 1.7 1.1 2.3 H10P-ChannelIRF5305S 91386110-55 0.06 -31 -22 1.4 H10IRF4905S 914783.8-55 0.02 -74 -52 40IRF9520NS 9152247-100 0.48 -6.7 -4.8 3.2IRF9530NS 9152375-100 0.20 -14 -9.9 2.0IRF9540NS 9148394-100 0.117 -19 -13 1.6IRF5210S 91405150-100 0.06 -35 -25 1.0* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-Pak D -PakSOT-227Micro6SOT-223Micro8 2 Illustrations not to scaleI DContinuous Drain Current(A)100°D 2PakSurface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart NumberP D Max.PowerDissipation (W)N-Channel Logic LevelIRL3302S 916925720 0.020 39 25 2.2 H10IRL3202S916756920 0.016 48 30 1.8IRL3102S 916918920 0.013 61 39 1.4IRL3402S 9169311020 0.01 85 54 1.1IRL3502S 9167614020 0.007 110 67 0.89IRL2703S 913604530 0.04 24 17 3.3IRL3303S 913236830 0.026 38 27 2.2IRL3103S 9133811030 0.014 64 45 1.4IRL2203NS 9136717030 0.007 116 82 0.90IRL3803S 9131920030 0.006 140 98 0.75IRLZ24NS 913584555 0.06 18 13 3.3IRLZ34NS 913086855 0.035 30 21 2.2IRLZ44NS 9134711055 0.022 47 33 1.4IRL3705NS 9150217055 0.01 89 63 0.90IRL2505S 9132620055 0.008 104 74 0.75IRLZ44S 9090615060 0.028 50 36 1.0IRL530NS 9134963100 0.1 15 11 2.4IRL2910S 91376150100 0.026 48 34 1.0* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-Pak D -PakSOT-227Micro6SOT-223Micro8 2 Illustrations not to scaleI DContinuous Drain Current(A)100°SOT-227Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous DrainCurrent 25°C(A)RΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelFully Isolated Low ChargeFA38SA50LC 916155005000.1338240.25H21FA57SA50LC916506255000.0857360.20* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)100°I-PakThrough-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRFU33039164257300.0313321 2.2H8IRFU024N 9133638550.0751610 3.3IRFU41059130248550.0452519 2.7IRFU12059131869550.0273723 1.8IRFU11090524251000.54 4.3 2.7 5.0IRFU120N 91365391000.219.1 5.8 3.2IRFU391091364521000.11159.5 2.4IRFU2109052625200 1.5 2.6 1.7 5.0IRFU22090525422000.80 4.8 3.0 3.0IRFU2149070325250 2.0 2.2 1.4 5.0IRFU2249060042250 1.1 3.8 2.4 3.0IRFU3109059725400 3.6 1.7 1.1 5.0IRFU3209059842400 1.8 3.1 2.0 3.0IRFU4209059942500 3.0 2.4 1.5 3.0IRFUC2090637426004.42.01.33.0I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°I-PakThrough-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)P-ChannelIRFU55059161057-550.11-18-11 2.2H8IRFU53059140289-550.065-28-18 1.4IRFU90149065425-600.50-5.1-3.2 5.0IRFU90249065542-600.28-8.8-5.6 3.0IRFU91109051925-100 1.2-3.1-2.0 5.0IRFU91209052042-1000.60-5.6-3.6 3.0IRFU9120N 9150739-1000.48-6.5-4.1 3.2IRFU92109052125-200 3.0-1.9-1.2 5.0IRFU92209052242-200 1.5-3.6-2.3 3.0IRFU92149165850-2503.0-2.7-1.7 2.5IRFU93109166350-4007.0-1.8-1.12.5N-ChannelLogic LevelIRLU27039133538300.0452214 3.3H8IRLU33039131657300.0313321 2.2IRLU31039133369300.0194629 1.8IRLU024N 9136338550.0651711 3.3IRLU27059131746550.04241715IRLU29059133469550.0273623 1.8IRLU120N 91541391000.18511 6.9 3.2IRLU341091607521000.10159.52.4I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°HEXDIPThrough-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRFD014907001.3600.2 1.7 1.2120H9IRFD024906991.3600.1 2.5 1.8120IRFD110903281.31000.54 1.00.71120IRFD120903851.31000.27 1.30.94120IRFD210903861.3200 1.50.60.38120IRFD220904171.32000.80.80.50120IRFD214912711.3250 2.00.570.32120IRFD224912721.3250 1.10.760.43120IRFD310912251.3400 3.60.420.23120IRFD320912261.3400 1.80.600.33120IRFD420912271.3500 3.00.460.26120IRFDC20912281.36004.40.320.21120I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI D Continuous Drain Current (A)100°TO-220Qg TotalGate Charge(nC)Through-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C (A)R ΘMax.Thermal Resistance(°C/W)1Faxon Demand Number Case OutlineKeyPart Number P D Max.Power Dissipation (W)N-ChannelLow ChargeIRF737LC91314743000.75 6.1** 1.7 3.9H11IRF740LC 910681254000.5510** 1.039IRF840LC 910691255000.858.0** 1.039IRFBC40LC910701256001.26.2**1.039I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°TO-220ABThrough-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRFZ24N 9135445550.071712 3.3H12IRFZ34N9127656550.042618 2.7IRFZ44N 9130383550.0244129 1.8IRFZ46N 9127788550.024633 1.7IRFZ48N 9140694550.0165337 1.6IRF1010N 91278130550.0127251 1.2IRF320591279150550.0089869 1.0IRFZ34E 9167268600.0422820 2.2IRFZ44E 91671110600.0234834 1.4IRF1010E 91670170600.01281570.90IRF280791517150750.0137150 1.0IRF520N 91339471000.209.5 6.79.5IRF530N 91351601000.111511 2.4IRF540N 91341941000.0522719 1.6IRF1310N 916111201000.0363625 1.3IRF3710913091501000.0284633 1.0IRF331591623941500.0822115 1.6IRF3415914771501500.0423726 1.0IRFBC209062350600 4.4 2.2 1.4 2.5IRFBC309048274600 2.2 3.6 2.3 1.7IRFBC4090506125600 1.2 6.2 3.9 1.0IRFBE2090610548006.51.81.22.3I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°TO-220ABThrough-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)IRFBE3090613125800 3.0 4.1 2.6 2.0H12IRFBF3090616125900 3.7 3.6 2.3 1.0IRFBG209060454100011 1.40.86 2.3IRFBG309062012510005.03.12.01.0P-ChannelIRF9Z24N 9148445-550.175-12-8.53.3H12IRF9Z34N 9148556-550.10-17-12 2.7IRF530591385110-550.06-31-22 1.4IRF490591280150-550.02-64-45 1.0IRF9530N 9148275-1000.20-13-9.2 2.0IRF9540N 9143794-1000.117-19-13 1.6IRF521091434150-1000.06-35-25 1.0IRF62159147983-1500.29-11-7.81.8I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°TO-220ABThrough-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart NumberP D Max.PowerDissipation (W)N-Channel Logic LevelIRL3302 916965720 0.020 39 25 2.2 H12IRL3202 916956920 0.016 48 30 1.8IRL3102 916948920 0.013 61 39 1.4IRL3402 9169711020 0.01 85 54 1.1IRL3502 9169814020 0.007 110 67 0.89IRL2703 913594530 0.04 24 17 3.3IRL3303 913225630 0.026 34 24 2.7IRL3103 913378330 0.014 56 40 1.8IRL2203N 9136613030 0.007 100 71 1.230 0.007 61 43 3.2IRL3803 9130115030 0.006 120 83 1.0IRLZ24N 913574555 0.06 18 13 3.3IRLZ34N 913075655 0.035 27 19 2.7IRLZ44N 913468355 0.022 41 29 1.8IRL3705N 9137013055 0.01 77 54 1.2IRL2505 9132520055 0.008 104 74 0.75IRL520N 9149447100 0.18 10 7.1 3.2IRL530N 9134863100 0.10 15 11 2.4IRL540N 9149594100 0.044 30 21 1.6IRL2910 91375150100 0.026 48 34 1.0I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI D Continuous Drain Current (A)100°TO-220 FullPak (Fully Isolated)Qg TotalGate Charge(nC)Through-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous DrainCurrent 25°C(A)R ΘMax.Thermal Resistance (°C/W)1Fax on Demand Number Case OutlineKeyPart Number P D Max.Power Dissipation (W)N-ChannelLow ChargeIRFI740GLC91209404000.55 6.0** 3.139H13IRFI840GLC 91208405000.85 4.8** 3.139IRFIBC40GLC91211406001.24.0**3.139I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°TO-220 FullPak (Fully Isolated)Through-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRFIZ24N 9150126550.07139.2 5.8H14IRFIZ34N9148931550.041913 4.8IRFIZ44N 9140338550.02428200.024IRFIZ46N 9130640550.023122 3.8IRFIZ48N 9140742550.0163625 3.6IRFI1010N 9137347550.0124431 3.2IRFI32059137448550.0085640 3.1IRFIZ24E 9167329600.071149.6 5.2IRFIZ34E 9167437600.0422115 4.1IRFI510G 90829271000.54 4.5 3.2 5.5IRFI520N 91362271000.207.2 5.1 5.5IRFI530N 91353331000.11117.8 4.5IRFI540N 91361421000.0521813 3.6IRFI1310N 91611451000.0362216 3.3IRFI371091387481000.0252820 3.1IRFI620G 90832302000.8 4.1 2.6 4.1IRFI630G 90652322000.4 5.9 3.7 3.6IRFI640G 90649402000.189.8 6.2 3.1IRFI614G 9083123250 2.0 2.1 1.3 5.5IRFI624G 9083330250 1.1 3.4 2.2 4.1IRFI634G 90738322500.45 5.6 3.5 3.6IRFI644G 90739402500.287.953.1I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°TO-220 FullPak (Fully Isolated)Through-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)IRFI720G 9083430400 1.8 2.6 1.7 4.1H14IRFI730G 9065032400 1.0 3.7 2.3 3.6IRFI740G 90651404000.55 5.4 3.4 3.1IRFI734G 9100135450 1.2 3.4 2.1 3.6IRFI744G 91002404500.63 4.9 3.1 3.1IRFI820G 9064130500 3.0 2.1 1.3 4.1IRFI830G 9064632500 1.5 3.12 3.6IRFI840G 90642405000.85 4.6 2.9 3.1IRFIBC20G 90850306004.41.71.1 4.1IRFIBC30G 90851356002.2 2.5 1.63.6IRFIBC40G 9085240600 1.2 3.5 2.2 3.1IRFIBE20G 9085330800 6.5 1.4.86 4.1IRFIBE30G 9085435800 3.0 2.1 1.4 3.6IRFIBF20G 90855309008.0 1.2.79 4.1IRFIBF30G90856359003.71.91.23.6P-ChannelIRFI9Z24N 9152929-550.175-9.5-6.7 5.2H14IRFI9Z34N 9153037-550.10-14-10 4.1IRFI49059152663-550.02-41-29 2.4IRFI9540G 9083742-1000.117-13-9.2 3.6IRFI9540N 9148742-1000.117-13-9.2 3.6IRFI52109140448-1000.06-20-14 3.1IRFI9634G 9148835-2501.0-4.1-2.63.6I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°TO-220 FullPak (Fully Isolated)Through-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelLogic LevelIRLI2203N 9137847300.0076143 3.2H14IRLI38039132048300.0066747 3.1IRLIZ24N 9134426550.06149.9 5.8IRLIZ34N 9132931550.0352014 4.8IRLIZ44N 9149838550.0222820 4.0IRLI3705N 9136947550.014733 3.2IRLI25059132763550.00858412.4IRLI520N 91496271000.187.7 5.4 5.5IRLI530N 91350331000.10117.8 4.5IRLI540N 91497421000.04420143.6IRLI291091384481000.02627193.1P-ChannelLogic LevelIRFI9520G 9083537-1000.6-5.2-3.6 4.1H14IRFI9530G 9083638-1000.03-7.7-5.4 3.6IRFI9620G 9087430-200 1.5-3.0-1.9 4.1IRFI9630G 9083840-2000.8-4.3-2.7 3.6IRFI9640G9083940-2000.5-6.1-3.93.1I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI D Continuous Drain Current (A)100°TO-247Qg TotalGate Charge(nC)Through-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C (A)R ΘMax.Thermal Resistance (°C/W)1Fax on Demand Number Case OutlineKeyPart Number P D Max.Power Dissipation (W)1N-ChannelLow ChargeIRFP350LC912291904000.3018**0.6570H16IRFP360LC 912302804000.2023**0.4598IRFP450LC 912311905000.4016**0.6570IRFP460LC 912322805000.2720**0.4598IRFPC50LC 912331906000.6013**0.6570IRFPC60LC912342806000.4016**0.4598I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not rated。
AVID FOD Receiver User's Guide
FOD Receiver User’s Guide Rev 3, 07/18/2013General DescriptionThe AVID FOD (Foreign Object Detection) Receiver is a standard WPC V1.1 wireless power receiver (5.0W) that has been calibrated and characterized to accurately measure and report received power information. This RX device is useful for testing transmitter devices, for characterizing and optimizingV1.1 (and newer) transmitter’s FOD functionality, and for doing Qi pre-compliance testing.Here are the main features of the AVID FOD Receiver:- Fully functional V1.1 Qi Receiver- Uses “naked” RX coil as specified for TPR#5 in the WPC Part 3 spec. Coil is isolated from the electronics and mounted in plastic frame that mates with the foreign object holders for good alignment - Factory calibrated and characterized using calibrated AVID FOD Transmitter- Accurately measures and reports PPR (received power) values per WPC V1.1 spec- Calculates and sends additional 16-bit PPR values (proprietary packet 0x28) that can be decoded and reported using the AVID FOD Transmitter and AVID V1.1 Sniffer- Programmable PPR offset and internal loads (DIP switch settings)- External load board (included) has minimum, maximum and in-between loads for testing and characterizing transmitters and for running Qi pre-compliance tests- Supports internal loads up to 2.0 Watts in 0.25 Watt increments (DIP switch settings) and external loads up to 5.0 Watts maximum.AVID FOD Receiver, Top ViewAVID FOD Receiver, Side and Bottom ViewsAVID Receiver Load BoardBasic Setup and OperationTo operate the FOD Receiver, first set the DIP switches on top of the unit to program the internal loadand the PPR offset values (see below) as desired. The FOD receiver can be operated using internalloads up to 2.0 Watts, but AVID recommends leaving the Load DIP switches all off and connecting the external load board to the output screw terminals for testing because this will isolate the load from the receiver and keep the electronics at a more even temperature. Next, place the FOD Receiver on any Qi transmitter for characterization and testing.The “Power” and “Status” LEDs on top of the FOD Receiver indicate the operational state of the receiver. The Power LED will light solid blue as long as the receiver is receiving enough power from the transmitterto power up its internal electronics. The Status LED will light solid green when the receiver is receiving enough power to supply the internal or external load and to regulate its output voltage to +5.0V. Whenthe FOD Receiver is first placed on a transmitter, it connects a minimum internal load of 100 ohms (to ensure robust communications). Next the receiver adjusts its bridge voltage to about 5.8V and then connects the internal or external load and disconnects the minimum 100 ohm load. If an external load is connected to the terminal block on the receiver and current flow is detected through the output, all internal loads are disconnected otherwise the internal load programmed on the DIP switches is left connected.Once the load is connected, the receiver will send error messages to regulate the output to +5.0V +/- 5%. The FOD Receiver should operate normally on any Qi transmitter (base station). If the FOD Receiver is powered up and regulating its output voltage, the status LED will remain green or amber. If the FOD Receiver cannot regulate its output voltage the status LED will turn off. If an error occurs (see below) the status LED will blink red. To maintain good power measurement accuracy, always make sure theFOD Receiver is not operated on or near metal desks or other large metal objects during testing.Below are brief descriptions of the functionality supported by the FOD Receiver: Function DescriptionPower LED Solid blue when FOD Receiver receives sufficient power from the transmitter to power its internal circuitryStatus LED Solid green when FOD Receiver receives sufficient power from the transmitter to power its internal load and regulate to +5.0V +/-5% Solid amber when FOD Receiver receives sufficient power from the transmitter to power an external load and regulate to +5.0V +/-5% Blinking red indicates various error codes (see quick start guide below)VBRIDGE Pin Rectified bridge voltage measurement test point COMM Pin Communication modulator digital signal test point GND Pins Internal circuitry ground referenceTEST DIP Switches PPR offset multiplier (6 bits) 0 to 63. This value is multiplied by the PPR offset step size to get the resulting PPR offset value in mWCOMM DIP Switches PPR step size (2 bits). This value is multiplied by the PPR offset multiplier to get the resulting PPR offset value in mW00 = -5 mW, 01 = -10 mW, 10 = +5 mW, 11 = +10 mWLOAD DIP Switches Internal load (4 bits) 0 to 8 (positions 9-15 reserved)This value is multiplied by 0.25 to get the resulting internal load in Watts If external load >= 0.25W is sensed, all internal loads are switched offTerminal Block For connecting external loads. When operating properly the FOD Receiver will provide +5.0V +/- 5% at this outputExternal Load Board Can be used to connect and switch on/off various external loads for characterizing V1.1 transmitters and running FOD pre-compliance testsV1.1 Transmitter (Base Station) FOD CharacterizationV1.1 QI compliant transmitter (base station) product developers can use the AVID FOD Receiver tool and the AVID external load board (or user supplied load) to characterize and adjust the transmitter power measurements. The FOD Receiver has been characterized using the AudioDev WPC approved V1.1 Test Transmitter and the results show good correlation between transmitted power and received power to within about 50 mW accuracy over a 0.25 W to 6.0 W load range.If the transmitter under test has a means of providing an indication of its transmitted power values during power transfer, then it is possible to use the AVID FOD Receiver to characterize the transmitter’s power loss measurements and FOD thresholds.To use the AVID FOD Receiver to characterize a transmitter, use the following procedure:1) Connect the external load board to the FOD Receiver terminal block and switch on the 0.25 Wload only. The on position for the switches is toward the edge of the load board.2) Place the FOD Receiver on the transmitter, center aligned, and record the transmitted power andreceived power values. If the transmitter does not already provide the received power values to the user, the AVID Qi Sniffer V1.1 can be used to capture the received power values including16-bit high resolution values reported by the AVID FOD Receiver.3) Repeat step 2 at several external load points such as at 1.0 W increments up to 5.0 W.4) Plot the received power vs. transmitted power values for each load point. The data should showgood correlation. If the difference is greater than 100 mW at any of the load points, makeadjustments to the transmitter to improve the power measurements.Base Station Qi Pre-Compliance TestingV1.1 QI compliant transmitter (base station) product developers can use the AVID FOD Receiver tool, the AVID external load board (or electronic load), and a set of WPC defined Foreign Objects to run Qi FOD Part 3 pre-compliance tests. AVID Technologies supplies (separately) the WPC defined foreign objects with an alignment frame and spacers that can be used for this testing.The Part 3 Base Station FOD compliance tests use two test receivers: TPR#5 and TPR#6. These receivers use a low-loss coil with no shield to minimize parasitic losses.TPR#5 is configured to output 5.0V +/-20% and to use a received power window size of 64 ms and a window offset size of 16 ms. TPR#5 is also configured to over report its received power values by 235 mW. During the WPC interim extension period in effect until May 2014, TPR#5 shall instead over report its received power values by 35 mW:TPR#5 PPR = (PPM+235)TPR#5 (INT) PPR = (PPM+35) ** Use this equation during the WPC interim periodPPM is the actual received power determined by the test receiver by measuring its load power and adding estimated parasitic power losses.TPR#6 is identical to TPR#5 except TPR#6 is configured to under report its received power values by 15 mW. During the WPC interim extension period in effect until May 2014, TPR#6 shall instead under report its received power values by 115 mW.TPR#6 PPR = (PPM-15)TPR#6 (INT) PPR = (PPM-115) ** Use this equation during the WPC interim periodBase Station Thermal Compliance TestingThe Part 3 Base Station FOD thermal compliance tests consist of measurements that check the temperature rise (at +25 deg C ambient) of four different WPC defined foreign objects while they are placed between the test receiver (TPR#5) and the base station during power transfer. Each object has an allowed temperature limit as defined in the table below.WPC Defined Foreign Objects:LimitObject Configuration Temperature#1 Steel disc centered 60 deg C#2 Aluminum ring centered 60 deg C#3 Aluminum foil centered 80 deg C#4 Steel disc offset 15.5 mm 60 deg CIf any of the foreign objects reaches or exceeds the temperature limits above during testing, the transmitter’s FOD measurements, thresholds, or reaction time may need to be adjusted to meet compliance.To use the AVID FOD Receiver to emulate TPR#5 and run the foreign object thermal pre-compliance tests on a base station, use the following procedure:1) Set the DIP switches on the AVID FOD Receiver to emulate TPR#5 as follows:TEST = 000111 (PPR offset multiplier = 7)COMM = 10 (PPR offset step = +5 mW)LOAD = 0000 (no internal load)2) Connect the external load board to the FOD Receiver and switch on the 0.25W (100 ohm) loadonly on the far left of the load board near the terminal block connector.3) Connect foreign object #1 (steel disc) K-type thermocouple connector to a suitable thermometeror DMM that can measure temperature of a K-type thermocouple.4) Fit the clear plastic alignment frame on top of the foreign object holder.5) Place the foreign object and alignment frame on the base station under test and align the centerof the foreign object holder with the center of the base station transmitter coil. The AVID foreign object holders have score marks that indicate the center lines.6) Place the AVID FOD Receiver in the alignment frame on top of the foreign object and make surethe receiver and foreign object are still center aligned with the transmitter coil.7) Increase the load on the external load until the transmitter hits its power loss (FOD) threshold andterminates (or lowers) its transmitted power. If you are using the AVID supplied external loadboard, leave the 0.25W load switched on, switch on the variable (0.24 W to 1.38 W) load, andslowly adjust the potentiometer until right at the point the power loss threshold is hit.8) Reduce the external load by 50 mA. If you are using the AVID supplied external load board thiscan be accomplished by switching off the 0.25W (100 ohm) load.9) Run the transmitter for 10 minutes (or until the transmitter terminates power transfer) and recordthe temperature of the foreign object.If the transmitter terminates power transfer before 10 minutes during any of these tests, repeat steps 6 and 7 above and reduce the load slightly until the transmitter runs for 10 minutes OR until the minimum load of 0.25 W (50.0 mA) is reached. At the minimum load, if the transmitter still terminates power before 10 minutes, the temperature of the object is recorded at the point where power transfer was terminated. The steps above are repeated as follows:- Using object #1 with 2.0 mm spacer placed between the foreign object and the AVID FOD receiver- Using object #1 with 5.0 mm spacer placed between the foreign object and the AVID FOD receiver- Using foreign object #2- Using foreign object #3- Using foreign object #4The steel disc objects present lower power losses and temperature rises than the other objects. For the steel objects, the thermal test may run for the full 10 minutes. The transmitter FOD power loss threshold should be set to keep the temperature of the objects below the limit at the end of the 10 minute test.The aluminum foil and ring objects present higher power losses and temperature rises than the steel discs. For these objects, even at the minimum 50 mA load the thermal test may not run the full 10 minutes before the transmitter reaches its FOD power loss threshold. In this case the transmitter FOD threshold and reaction time should be adjusted to keep the foreign object temperature below the limit when the threshold is reached and the transmitter either terminates or reduces power.If the transmitter can be adjusted to keep the foreign objects below the temperature limits for all of the above tests, then the product will likely pass the FOD thermal compliance tests at an approved Qi compliance lab. If not, adjust the transmitter FOD power loss thresholds and reaction time accordingly.Base Station Guaranteed Power Compliance TestingThe Part 3 Base Station FOD guaranteed power compliance test consists of a measurement that checks to make sure the base station under test can deliver 5.0 Watts to a test receiver (TPR#6) that has no foreign object present, but is simulating power loss into a foreign object by under reporting its received power.To use the AVID FOD Receiver to emulate TPR#6 and run the guaranteed power pre-compliance tests on a base station, use the following procedure:1) Set the DIP switches on the AVID FOD Receiver to emulate TPR#6 as follows:TEST = 010111 (PPR offset multiplier = 23)COMM = 00 (PPR offset step = -5 mW)LOAD = 0000 (no internal load)2) Connect the external load board to the FOD Receiver and switch on the 0.25W load only.3) Place the FOD Receiver on the base station and make sure it is center aligned with thetransmitter coil. Wait until the base station begins power transfer.4) Switch on the 1W load on the external load board. Allow the base station to continue powertransfer for 10 seconds.5) Switch on the 2W load on the external load board. Allow the base station to continue powertransfer for 10 seconds.6) Switch on the 3W load and switch off the 0.25W and 1W loads on the external load board (total =5W load). Allow the base station to continue power transfer for 5 minutes.7) Measure the voltage at the terminal block output on the FOD Receiver and make sure it isbetween 4.75V and 5.25V (regulation tolerance of the FOD Receiver).If the voltage measured in step 7 is between 4.75V and 5.25V, then the product will likely pass the FOD guaranteed power compliance tests at an approved Qi compliance lab. If the voltage is not between4.75V to5.25V, make adjustments to the base station device to improve the power transfer performance and repeat the tests above.NOTE: AVID FOD TOOLS ARE NOT APPROVED FOR FINAL QI COMPLIANCE TESTING. THEY ARE DESIGNED TO BE USED FOR DEVELOPMENT AND PRE-COMPLIANCE TESTING BY CUSTOMERS DESIGNING and PROTOTYPING WPC V1.1 WIRELESS POWER PRODUCTS.AVID FOD Receiver Quick Start Guide:Quick Start Guide ***************************SYSTEM MONITORING:VBRIDGE: (5.0V +/-0.5V)Receiver DC Bridge VoltageCOMM. (0 -3.3V Logic)Modulation Signal5V, 0-1A OUTPUT:Internal load is disabledwhen external load (>0.25W)is connected.CONFIGURATION SWITCHES:TEST Position 1-6PPR offset multiplierLOAD Position 1-4Selects internal load0-2W, in 0.25W StepsCOMM Position 5PPR offset polarityPosition 6PPR offset step sizeAll switches can be changedduring run time.STATUS LED:©2013 AVID Technologies, Inc. All rights reserved.FOD Receiver。
ProductTypeList-optiMOS(20-250V)
N-Channel MOSFETs: OptiMOS™ (20V…250V) Product TypeProduct TypeBSN045NE2LSBSN011NE2LSBSN011NE2LSIBSN012N03LSBSN012N03LSIBSN048N03LSBSB012NE2LXBSB014N04LX3 GBSB015N04NX3 GBSB017N03LX3 GBSB012N03LX3 GBSB028N06NN3 GBSB044N08NN3 GBSB056N10NN3 GBSB013NE2LXIBSB008NE2LXBSB280N15NZ3 G BSB165N15NZ3 G BSB012NE2LXI BSF024N03LT3 G BSF050N03LQ3 G BSF030NE2LQ BSF134N10NJ3 G BSF110N06NT3 G BSF450NE7NH3 G BSF035NE2LQ IPB015N04L G IPB027N10N3 G IPB035N08N3 G IPB015N04N G IPB019N06L3 G IPB083N10N3 G IPB042N10N3 G IPB054N06N3 GIPB037N06N3 G IPB097N08N3 G IPB055N03L G IPB054N08N3 G IPB042N03L G IPB022N04L G IPB065N03L G IPB072N15N3 G IPB025N08N3 G IPB080N03L G IPB081N06L3 G IPB147N03L G IPB096N03L G IPB136N08N3 GIPB090N06N3 G IPB029N06N3 G IPB049NE7N3 G IPB031NE7N3 G IPB020NE7N3 G IPB123N10N3 G IPB038N12N3 G IPB144N12N3 G IPB320N20N3 G IPB107N20N3 G IPB200N25N3 G IPB600N25N3 G BUZ32 H3045A BUZ31 H3045A IPB108N15N3 G BUZ30A H3045AIPB107N20NA IPB057N06N IPB026N06N IPB230N06L3 G IPB067N08N3 G IPB034N03L G IPB009N03L G IPB011N04L G IPB011N04N G IPB016N06L3 G IPB017N06N3 G IPB019N08N3 G IPB020N04N G IPB025N10N3 G IPB030N08N3 GIPB036N12N3 G IPB065N15N3 G IPB010N06NIPB014N06NSPD07N20 GIPD031N06L3 G IPD034N06N3 G IPD035N06L3 G IPD036N04L GIPD038N06N3 G IPD048N06L3 G IPD053N08N3 G SPD50N03S2L-06 G SPD30N03S2L-07 G IPD068N10N3 G SPD50N03S2-07 GIPD082N10N3 G IPD088N06N3 G IPD096N08N3 G SPD30N03S2L-10 G IPD127N06L GIPD135N08N3 G IPD160N04L GIPD170N04N GIPD200N15N3 G SPD30N03S2L-20 G IPD220N06L3 G IPD25CN10N GIPD250N06N3 G IPD33CN10N GIPD350N06L GIPD640N06L G IPD78CN10N G IPD800N06N G IPD122N10N3 G IPD180N10N3 G IPD110N12N3 G IPD031N03L G IPD040N03L G IPD050N03L G IPD060N03L G IPD075N03L G IPD090N03L G IPD320N20N3 G IPD600N25N3 G IPD530N15N3 G IPD105N03L G IPD135N03L GIPD025N06N IPD053N06N IPI023NE7N3 G IPI034NE7N3 G IPI052NE7N3 G IPI126N10N3 G IPI180N10N3 G IPI041N12N3 G IPI076N12N3 G IPI147N12N3 G IPI045N10N3 G IPI086N10N3 G IPI030N10N3 G IPI04CN10N G IPI072N10N3 G IPI26CN10N G IPI35CN10N GIPI075N15N3 G IPI200N15N3 G IPI024N06N3 G IPI032N06N3 G IPI040N06N3 G IPI037N08N3 G IPI320N20N3 G IPI110N20N3 G IPI200N25N3 G IPI600N25N3 G IPI111N15N3 G IPI530N15N3 G IPI020N06NIPI029N06N BUZ31 H3046 IPI084N06L3 GIPU135N08N3 G IPS110N12N3 G IPS060N03L G IPS075N03L G IPS031N03L G IPS040N03L G IPS090N03L G IPS105N03L G IPS135N03L G IPS050N03L G BSZ0908ND BSZ0907ND BSC0921NDI BSC0923NDI BSC0924NDI BSC0925ND BSC0910NDI BSC0911NDBSZ035N03LS G BSZ035N03MS G BSZ040N04LS G BSZ042N04NS G BSZ050N03LS G BSZ050N03MS G BSZ058N03LS G BSZ058N03MS G BSZ067N06LS3 G BSZ076N06NS3 G BSZ088N03MS G BSZ088N03LS G BSZ097N04LS G BSZ100N06LS3 G BSZ100N03MS GBSZ105N04NS G BSZ110N06NS3 G BSZ123N08NS3 G BSZ130N03MS G BSZ130N03LS G BSZ165N04NS G BSZ340N08NS3 G BSZ440N10NS3 G BSZ160N10NS3 G BSZ900N15NS3 G BSZ520N15NS3 G BSZ0909NSBSZ240N12NS3 G BSZ12DN20NS3 G BSZ16DN25NS3 GBSZ42DN25NS3 G BSZ900N20NS3 G BSZ060NE2LS BSZ065N03LS BSZ036NE2LS BSZ018NE2LS BSZ0901NSBSZ0901NSIBSZ0902NSBSZ0904NSIBSZ0902NSIBSZ018NE2LSI BSZ042N06NS BSZ023N04LS BSZ150N10LS3 G BSO615N GBSO033N03MS GBSO083N03MS G BSO110N03MS G BSO330N02K G BSO150N03MD G BSO220N03MD G BSC010NE2LS BSC050NE2LS BSC046N02KS G BSC019N02KS G BSC014N03LS G BSC016N03LS G BSC014N03MS G BSC016N04LS G BSC016N03MS G BSC017N04NS G BSC018N04LS GBSC020N03MS G BSC020N03LS G BSC025N03MS G BSC027N04LS G BSC025N03LS G BSC028N06LS3 G BSC030N03MS G BSC030N04NS G BSC030N03LS G BSC031N06NS3 G BSC034N03LS G BSC035N04LS G BSC042N03MS G BSC042N03LS GBSC050N03MS G BSC050N04LS G BSC050N03LS G BSC054N04NS G BSC057N03MS G BSC057N03LS G BSC057N08NS3 G BSC059N04LS G BSC060N10NS3 G BSC067N06LS3 G BSC076N06NS3 G BSC079N10NS GBSC080N03LS G BSC082N10LS G BSC090N03MS G BSC090N03LS G BSC093N04LS G BSC100N03MS G BSC100N10NSF G BSC100N06LS3 G BSC105N10LSF G BSC110N06NS3 G BSC118N10NS G BSC120N03MS G BSC120N03LS GBSC123N10LS G BSC152N10NSF G BSC190N15NS3 G BSC159N10LSF G BSC196N10NS G BSC205N10LS G BSC252N10NSF G BSC265N10LSF G BSC340N08NS3 G BSC042NE7NS3 G BSC160N10NS3 G BSC440N10NS3 G BSC077N12NS3 G BSC190N12NS3 G BSC520N15NS3 GBSC600N25NS3 G BSC026N02KS G BSC070N10NS3 G BSC109N10NS3 G BSC0909NSBSC360N15NS3 G BSC0908NSBSC240N12NS3 G BSC900N20NS3 G BSC12DN20NS3 G BSC16DN25NS3 G BSC22DN20NS3 G BSC018NE2LS BSC024NE2LS BSC011N03LS BSC052N03LSBSC0902NSBSC032NE2LS BSC0901NSIBSC0904NSIBSC010NE2LSI BSC0902NSIBSC014NE2LSI BSC018NE2LSI BSC011N03LSI BSC0906NSBSC009NE2LS BSC036NE7NS3 G BSC046N10NS3 G BSC028N06NS BSC010N04LSI BSC014N04LS BSC014N04LSIBSC039N06NS BSC014N06NS BSC010N04LS BSC500N20NS3 G BSC022N04LS BSC072N03LD G BSC150N03LD G BSC750N10ND G IPP023NE7N3 G IPP034NE7N3 G IPP052NE7N3 G BUZ31L HBUZ73 HBUZ73A HBUZ73AL HBUZ73L HIPP180N10N3 G IPP041N12N3 G IPP048N12N3 G IPP076N12N3 G IPP114N12N3 G IPP147N12N3 G IPP030N10N3 G IPP045N10N3 G IPP04CN10N G IPP05CN10N G IPP072N10N3 G IPP086N10N3 G IPP12CN10L G IPP16CN10N G IPP075N15N3 G IPP200N15N3 G IPP034N03L GIPP055N03L G IPP065N03L G IPP080N03L G IPP096N03L G IPP114N03L G IPP015N04N G IPP023N04N G IPP039N04L G 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EFD25磁芯
f = 3 MHz; Bˆ = 10 mT; T = 100 °C
− − − − ≤1.10
1997 Nov 21
2
Philips Components
EFD cores and accessories
Product specification
EFD25
COIL FORMERS
General data
Finland: Philips Components, ESPOO, Tel. (0) 9 615 800, Fax. (0) 9 615 80510.
France: Philips Composants, SURESNES, Tel. (01) 4099 6161, Fax. (01) 4099 6493.
Germany: Philips Components GmbH, HAMBURG, Tel. (040) 2489-0, Fax. (040) 2489 1400.
Greece: Philips Hellas S.A., TAVROS, Tel. (01) 4894 339/(01) 4894 239, Fax. (01) 4814 240.
µe
≈1 450 ≈1 780 ≈1 780 ≈1 600
≈800
AIR GAP (µm)
≈0 ≈0 ≈0 ≈0 ≈0
TYPE NUMBER
EFD25-3C30 EFD25-3C85 EFD25-3C90 EFD25-3F3 EFD25-3F4
Properties of core sets under power conditions
− −
f = 100 kHz; Bˆ = 100 mT; T = 100 °C
大功率器件的设计测试方案
700MHz-14GHz宽带10ohm 测试夹具和部分TRL校准件
TRL校准件的大致布局
需要从时域和频域来分析TRL校准件的设计好坏 TRL校准件质量的高低决定了测试的不确定度
参考文献：安捷伦刘迪 怎样设计和验证TRL 校准件以及TRL 校准的具体过程 Page 11
大功率器件的设计测试方案
关键问题3：
输出功率, 电压/电流, 功率效率，三阶互调失真，谐波失真，输入输出驻波比，
增益，增益平坦度…
以上所有参数都跟输入输出匹配、直流偏置、频率及功率有关
大功率器件的设计测试方案
内容
• 功率器件及功放概述
• 功率器件设计测试的关键问题及解决方案
• 大功率器件的完整测试方案
• 基于X参数的L波段45W GaN功率放大器设计实例 • 基于ADS的X参数仿真实例
测试夹具的关键指标：频率范围、驻波比、连接器的一致性、左右对称性(S11=S22)
Page 10
参考文献：安捷伦刘迪 怎样设计和验证TRL 校准件 以及TRL 校准的具体过程
大功率器件的设计测试方案
关键问题2：
如何消除测试夹具的影响？
10MHz-20GHz宽带50ohm 测试夹具和部分TRL校准件
感性振荡的解决方案：栅极(基极)和漏极(集电极)的隔离要好，通常是2个电源通过DUT共地
Page 9
大功率器件的设计测试方案
关键问题2：
如何评估功率器件所需的测试夹具？
Launch Launch
DUT
测试夹具分为：50ohm和非50ohm
黄色即构成夹具的金属散热块， 绿色线即PCB传输线 测试夹具的典型构造
(F ) bij X ij ( a11 ) P j
OEP30W音频放大芯片的输出特性和温度特性测试方案
OEP30W音频放大芯片的输出特性和温度特性测试方案在博文"OEP30WD类音频功率放大器简单测试”中给出了OPE30W的基本连接方式和功能应用。
对于该音频放大芯片的输出特性和温度特性是什么？本文给出了测试方案。
在测试芯片的频率相应的时候，需要使用到正弦波产生芯片模块AD9833。
所使用到的COM2串口命令如下所示：fromtsmodule.tshardwareimport*ccloadSerial.write(b’ad9833setfrequency250 ’)详细的参考资料为：AD9833数字信号发生器模块[1]频率特性测试由于OEP30W的输出为D类功放输出，需要对输出信号进行低通滤波之后，才能够获得其中的音频信号。
下面采用两种低通滤波的方式：LC低通滤波；RC低通滤波1.LC低通滤波对OEP30W输出SP+,SP-都使用LC低通滤波。
如下所示。
滤波后的信号在使用DM3068数字万用表交流信号挡进行测量。
下图中电感的容量为：，电容的容量为：。
那么该低通滤波器的谐振频率为：OEP30W音频放大芯片的输出特性和温度特性测试方案测量电路方案如下是绘制的输出信号的幅度。
由于输入信号的幅值是固定的，所以这个曲线就代表了整个系统的幅频特性。
从其中可以看到在5kHz的地方有一个明显的谐振峰值，这是由LC低通滤波器所带来的。
测试电路的幅频响应为了减少该谐振峰对于OEP30W模块的频率特性的影响，将上面LC中的C的容值改成0.01uF。
此时，谐振频率变成了15.9kHz。
绘制输出信号的幅值随着频率的变化，代表了上述测量系统的幅频特性。
其中在4kHz以下，系统的幅频特性非常平坦。
2.RC低通滤波使用RC滤波来对OEP30W模块中的音频信号进行提取。
如下图所示，其中的电感的改成4.7kΩ的电阻。
该低通滤波器的滤波常数所对应的截止频率等于：使用RC滤波的电路绘制出输出信号的幅值随着频率的变化，代表着上述测量系统的频率特性。
D25NF10L
1/9February 2003STD25NF10LN-CHANNEL 100V - 0.030 Ω - 25A DPAKLOW GATE CHARGE STripFET™ II POWER MOSFETs TYPICAL R DS (on) = 0.030 Ωs EXCEPTIONAL dv/dt CAPABILITY s 100% AVALANCHE TESTED s LOW THRESHOLD DEVICE s LOGIC LEVEL DEVICEsSURFACE-MOUNTING DPAK (TO-252) POWER PACKAGE IN TAPE & REEL (SUFFIX “T4")DESCRIPTIONThis MOSFET series realized with STMicroelectronics unique STripFET process has specifically been designed to minimize input capacitance and gate charge. It is therefore suitable as primary switch in advanced high-efficiency, high-frequency isolated DC-DC converters for Telecom and Computer applications. It is also intended for any applications with low gate drive requirementsAPPLICATIONSs HIGH-EFFICIENCY DC-DC CONVERTERS s UPS AND MOTOR CONTROLTYPE V DSS R DS(on)ID STD25NF10L100 V< 0.035 Ω25 AABSOLUTE MAXIMUM RATINGS(•) Pulse width limited by safe operating area.(*) Current Limited by Package(1) I SD ≤25A, di/dt ≤300A/µs, V DD ≤ V (BR)DSS , Tj ≤ T JMAX (2) Starting T j = 25 o C, I D = 12.5A, V DD = 50VSymbol ParameterValue Unit V DS Drain-source Voltage (V GS = 0)100V V DGR Drain-gate Voltage (R GS = 20 k Ω)100V V GS Gate- source Voltage± 16V I D (*)Drain Current (continuous) at T C = 25°C 25A I D Drain Current (continuous) at T C = 100°C 25A I DM (•)Drain Current (pulsed)100A P tot Total Dissipation at T C = 25°C 100W Derating Factor0.67W/°C dv/dt (1)Peak Diode Recovery voltage slope 20V/ns E AS (2)Single Pulse Avalanche Energy 450mJ T stg Storage Temperature-55 to 175°CT jMax. Operating Junction Temperature2/9THERMAL DATA(#) When Mounted on 1 inch 2 FR-4 board, 2 oz of Cu.ELECTRICAL CHARACTERISTICS (T CASE = 25 °C UNLESS OTHERWISE SPECIFIED)OFFON (*)DYNAMICRthj-case Rthj-pcb T lThermal Resistance Junction-case Thermal Resistance Junction-pcb (#)Maximum Lead Temperature For Soldering PurposeMax Max1.550275°C/W °C/W °CSymbol ParameterTest ConditionsMin.Typ.Max.Unit V (BR)DSS Drain-sourceBreakdown Voltage I D = 250 µA, V GS = 0100V I DSS Zero Gate VoltageDrain Current (V GS = 0)V DS = Max RatingV DS = Max Rating T C = 125°C 110µA µA I GSSGate-body Leakage Current (V DS = 0)V GS = ± 16 V±100nASymbol ParameterTest ConditionsMin.Typ.Max.Unit V GS(th)Gate Threshold Voltage V DS = V GS I D = 250 µA 12.5V R DS(on)Static Drain-source On ResistanceV GS = 10 V I D = 12.5 A V GS = 4.5 VI D = 12.5 A0.0300.0350.0350.040ΩΩSymbol ParameterTest ConditionsMin.Typ.Max.Unit g fs (*)Forward Transconductance V DS = 15 VI D =12.5 A24S C iss C oss C rssInput Capacitance Output Capacitance Reverse Transfer CapacitanceV DS = 25V f = 1 MHz V GS = 01710250110pF pF pF3/9SWITCHING ONSWITCHING OFFSOURCE DRAIN DIODE(*)Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.(•)Pulse width limited by safe operating area.Symbol ParameterTest ConditionsMin.Typ.Max.Unit t d(on)t r Turn-on Delay Time Rise TimeV DD = 50 VI D = 12.5 A R G = 4.7 Ω V GS = 5 V (Resistive Load, Figure 3)2040ns ns Q g Q gs Q gdTotal Gate Charge Gate-Source Charge Gate-Drain ChargeV DD = 80 V I D = 25 A V GS = 5 V388.52152nC nC nCSymbol ParameterTest ConditionsMin.Typ.Max.Unit t d(off)t fTurn-off Delay Time Fall TimeV DD = 50 VI D = 12.5 A R G =4.7Ω, V GS = 5 V (Resistive Load, Figure 3)5820ns nsSymbol ParameterTest ConditionsMin.Typ.Max.Unit I SD I SDM (•)Source-drain CurrentSource-drain Current (pulsed)25100A A V SD (*)Forward On Voltage I SD = 25 A V GS = 0 1.5V t rr Q rr I RRMReverse Recovery Time Reverse Recovery Charge Reverse Recovery CurrentI SD = 25 Adi/dt = 100A/µs V DD = 50 V T j = 150°C (see test circuit, Figure 5)883177.2ns nC AELECTRICAL CHARACTERISTICS (continued)5/96/9Fig. 3: Switching Times Test Circuits For ResistiveFig. 5: Test Circuit For Inductive Load Switching8/9Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.The ST logo is registered trademark of STMicroelectronics® 2002 STMicroelectronics - All Rights ReservedAll other names are the property of their respective owners.STMicroelectronics GROUP OF COMPANIESAustralia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States.9/9。
HT-69020NP-0, HT-69030NP-0 Duct Probe RH Transmitt
HT-69020NP-0, HT-69030NP-0 Duct Probe RHTransmitter Installation GuideIntroductionThe HT-69 Series Duct Probe Relative Humidity (RH)Transmitters use a highly accurate and reliable thermosetpolymer-based capacitance humidity sensor and state-of-the-art digital linearization and temperature-compensated circuitry to monitor humidity levels in a duct. The humidity sensor is encapsulated in a 60 micron HDPE filter at the end of a 9 in. (230 mm) stainless steel (S/S) probe and a compact enclosure.Figure 1: HT-69 Duct Probe RH Transmitter DimensionsFigure 2: Dimensions of the HT-69 Duct Probe RH Transmitter*241102556A*Part No. 24-11025-56 Rev. A2022-11-11MountingThe transmitter installs directly into any air duct with a minimum width or diameter of 10 in. (25.5 cm).-Select a suitable installation area in the middle of the duct wall.-To achieve the best reading, do not place in an area where air stratification may be present.-Mount the sensor at least 5 ft. (1.5 m) in either direction from elbows, dampers, filters, or other duct restrictions.-Avoid areas that expose the transmitter to vibrations or rapid temperature changes.To install the transmitter, complete the following steps:1.When you select a suitable spot, drill a 0.6 in. (15mm) to 0.75 in. (20 mm) hole for the probe.2.Slide the probe into the drilled hole until the enclosure is flush against the duct. The airflow direction is not important.3.Secure the enclosure to the duct with two No. 10 x 1 in. (25 mm) self-tapping screws (not provided).4.Tighten the screws until the enclosure is tight against the duct so that there is no movement of the enclosure. A foam gasket on the back of the enclosure provides a tight seal against any air leaks. See Step 1 in Figure 3.5.The enclosure includes a hinged cover with a latch.To open the cover, pull slightly on the latch on the right side of the enclosure. At the same time, pull on the cover as shown in Step 2 of Figure 3.6.A 0.5 in. NPT threaded connection hole is in the bottom of the enclosure. Screw the EMT or cable gland connector into the threaded connection holeuntil tight. See Step 3 in Figure 3.Note: Preferably use weatherproof EMT or cable gland fittings. The E-style enclosure includes 0.5 in. NPT to M16 thread adaptor and cable gland fitting.7.Make wire connections as shown in the wire diagram in Wiring .8.Swing the door closed until it securely latches. For added security, install the two provided screws in the integrated screw tabs. See Step 4 of Figure 3.Wiring•Deactivate the 24 VAC/DC power supply before you make all connections to the device to prevent electrical shock or equipment damage.•Use 14 AWG to 22 AWG shielded wiring for allconnections and do not locate the device wires in the same conduit with wiring that supplies inductive loads such as motors. Make all connections in accordance with national and local codes.•Pull at least 6 in. (15 cm) of wire into the enclosure,then complete the wiring connection according to the wire diagram for the applicable power supply and output signal type. See Figure 4.•Place the output switch in the required position to select the required signal output type (mA or VDC), as shown in Step 2 of Figure 4. The factory default setting is 4 mA to 20 mA.•If you select mA, no further output set up is required.If you select VOLT output as shown in Figure 5, place the voltage output switch to the required span position,that is 10 VDC = 0 VDC to 10 VDC. The factory default setting is 0 VDC to 10 VDC. See Step 1 of Figure 4.•Connect the DC positive or the AC voltage hot side to the PWR terminal. For voltage output or AC power,connect the supply common to the COM terminal.The device is reverse voltage-protected and does not operate if you connect it backwards. The device contains a half-wave power supply so the supplycommon is the same as the signal common. See Step 3of Figure 4.•The analog output is available on the OUT terminal.Check the controller Analog Input to determine the correct connection before you apply power as shown in Step 3 of Figure 4.Figure 3: Mounting the HT-69 Duct Probe RH TransmitterFigure 4: Wiring of the HT-60 Duct Probe TransmitterTechnical specificationsTable 1: HT-69020NP-0, HT-69030NP-0 Duct Probe RH Transmitter technical specificationsThe performance specifications are nominal and conform to acceptable industry standards. For application at conditions beyond these specifications, consult the local Johnson Controls office. Johnson Controls shall not be liable for damages resulting from misapplication or misuse of its products.Product warrantyThis product is covered by a limited warranty, details of which can be found at / buildingswarranty.Software termsUse of the software that is in (or constitutes) this product, or access to the cloud, or hosted services applicable to this product, if any, is subject to applicable end-user license, open-source software information, and other terms set forth at /techterms. Your use of this product constitutes an agreement to such terms. PatentsPatents: https://Single point of contactContact informationContact your local branch office: /locationsContact Johnson Controls: /contact-us© 2022 Johnson Controls. All rights reserved. All specifications and other information shown were current as of document revision and。
WTW最新产品资料
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实验室测量
数字化
inoLab Multi 9310
®
inoLab® Multi 9420
inoLab® Multi 9430
pH/ORP
所有的 SenTix ® 和通过ＡＤＡ Ｓ７／ＩＤＳ转换器的带Ｓ７插头的传统电极，另外９４２０／９４３０可以通过伸缩自如的ＤＩＮ／ＢＮＣ 适配器连接传统电极
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FDO® 925 TetraCon® 925, LR 925/01
溶解氧 电导率 常规测量 带文件的常规测量
AQS/GLP
m ● ● ● ● ● ● m
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高精度 控制测量 ＬＩＭＳ连接 质量担保 培训 服务 实验室测量 现场测量 深度测量 药品测量（电导率／溶解氧） ＰＣ接口 外部控制
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6100 VIS 6600 UV-VIS
550/550IR
比色皿尺寸
(mm)
16
16, 10, 20, 50 ● ● LCD
ISL6558EVAL2;中文规格书,Datasheet资料
Sefram DAS 30 DAS 50 说明书
SEFRAM DAS 30 / DAS 50Sefram• 2 to 4 analogue channels • Universal input• DC, AC+DC RMS voltage measurement • Frequency, counter• Temperature: thermocouple, Pt100/Pt1000*• Power analysis function • 16 logical channels • 14-bit resolution• 10" TFT panoramic LCD touch screen • 1 Ms/s sampling rate • 100 kHz bandwidth• 32 Gb internal hard disk • 32 Mword memory• Interfaces : 2 x USB, Ethernet,• Lithium-ion battery• Autonomy: up to 9,5 hours.• 110mm Thermal printer module*• IEC 1010 CAT III 600V * factory optionSelection guideThe new DAS 30-50 DAS 30 & DAS 50 recorders offer universal input, which are convenient for all types of signals : - voltage from 1mV to 1000V DC or 425Vrms- temperature (thermocouples) and Pt100/Pt1000*- counter, frequency- current (with optional shunt)Universal inputThe new DAS 30 & DAS50 recorders are general purpose and multifunction recorders and are suitable for many applications:- maintenance/failure diagnostic on electrical systems - voltage, current, temperature recording and monitoring - power analysis for single phase, dual phase and three phase systems Typical applicationsThanks to the new user interface combined with its large touch screen LCD, the portable DAS recorders are design for ease of use for a wide range of data recording applications and easy transfer of your records.The new DAS 30-50 series recorders have been designed to meet the requirements of all applications in industry (IEC 61010, CAT. III 600V). You can view your measurements (traces,digital values) and record directly in the internal memory or into a USB memory stick. Using Sefram software, you can transfer easily your records on a computer.Multifunction handheld recordersDAS 30/50DAS 30DAS 502 isolated universal channels •4 isolated universal channels •2 Pt100/Pt1000 input factory option factory option 110mm thermal printerfactory optionfactory optionFactory options110mm thermal printer modulePt100/Pt1000 boardIt’s possible to install on Sefram DAS 30 & 50 recorders a thermal printer module (110 mm width, 10 meters thermal paper roll).This factory option adds 2 channels dedicated to Pt100/Pt1000 platinium resistance measurements, with 2 wires or 3 wires or 4 wires setup.Using a 20 bit analog to digital converter, this card will provide an excellent accuracy and resolution for temperature measurement.Channels setup: one screen with colors to differentiate channels Oscilloscope modeDigital display of measurements XY modeTrigger: several type of trigger, one channel, on a level, slope,several channels or combined conditions.With the thermal printer module, you can setup your printSEFRAM VIEWERThis licence free software is supplied with each recorder. It allows the visualization of the recordings and the data trans-fer to other applications. SEFRAM Viewer makes the acquired signal analysis easier.•Curve printing•Display of values (text)•Cursors and zoom •File concatenation •8 math calculations•Up to 120 characters text notes •Bitmap, Excel®, txt, csv export •Easy setup of curves displayWith Flexpro® :• More than 100 functionsof statistical and math analysis • Powerful graphical display • Measurement report editingFLEXPRO™: a powerful software for your data analysis.ENERGY / POWER ANALYSISA very powerful analysis for single phase, dual phases or three phases networks. Analysis is provided with Fresnel diagramor oscilloscope mode.Your instrument shows how to connect the inputs with a sche-matic and you can setup parameters and measurements on the same screen.Example of a single phase network.Real time display of signals and harmoics (up to rank 50)Setup of parameters to measure or calculate.FT SEFRAM DAS 30/50 A 01 - Specifications can be updated without notice32, rue Edouard Martel • B.P. 55 • 42009 - St Etienne cedex 2Tel.+33 (0).4.77.59 36 81P APER PLOT CARACTERISTICS*Paper width :110 mmPaper speed :from 1 mm/min to 25mm/sPaper speed in memory mode :10 mm/s max.Resolution & accuracy : Y axis :8 dots per mmX axis :16 dots per mmXY mode :8 dots per mm (both axis)StorageSetup backup :unlimited on the hard diskInternal hard disk :32 Gb (solid state)GENERAL SPECIFICATIONSDisplay :10 inches TFT LCD coloured touch screenF(t)and XY functions.Zoom, cursors, dV, dT and zoom betweencursors.Calculation functionsy=ax+b , y=/x/+b, y=a√x+b+c,y=ax2+b, y=(log x)+b, yae(x+b)+c Automatic measurements :20 automatic measurements ( F, T, Vpp, Tm…) Interfaces : 2 x USB port, EthernetPower supply :100 to 240 VAC, ouput 15 V 5A max. Battery (factory installed) :Lithium ion 10,8 V, 6,5 Ah.Autonomy :Typically 9h30mn after a complete charge4 hours without screen saverCharging time: 1 hour (recorder off)Complete charge in 4 hours.Dimensions & weight :295 x 210 x 105, 2.5 KgOperating temperature range :0°C to 40°CMax. RH. :80% without condensation.Storage temperature range :-20°C to 60°CWarranty : 2 yearsSafety :IEC 61010 - CAT III 600VO PTIONNAL ACCESSORIESAccessory clampsSP 201 - 200 AAC, 10mV/1A, ø 15 mm.SP 221- 100 AAC, 100mV/1A, ø 15 mm.SP 230 - 1200 AAC, 10mV/1A, ø 50 mm.SP 261- 1200 AAC+DC, 1mV/1A, ø 50 mm.SP 270 - 2000 AAC, 1 mV/1A, ø 70 mm.A 1287- 3000 AAC, 0.333 mV/A, ø 150 mm / FlexShuntsShunts (with banana plugs)910007100Shunt CA 0.01 ohm : 3 A910007200Shunt CA 0.1 ohm : 1 A989007000Shunt CA 50 ohm : 0.05 A989006000Shunt CC 1 ohm : 0.5 A912008000Shunt CA 10 ohm : 0.15 AShunts (with wires)207030301 Shunt 0.01 ohm : 30 A max207030500Shunt 0.001 ohm : 50 A maxLogical channels.98440550016 isolated logical channels interface98440500016 channels logic probe.Rugged carrying case903001000Rugged carrying caseFLEXPRO software910008100FLEXPRO - VIEW910008200FLEXPRO - FULLPrinter module (factory option)903002000Thermal printer moduleConsumables837500526Thermal paper roll (10m)Pt100/Pt1000 (factory option)903003000 2 channels Pt100/Pt100019" rackmount kit903004000Rackmount kitSupplied with : a carrying case, a set of red and black cable + alligator clip+quick banana plug, main adaptor, manual (CD-ROM).SPECIFICATIONS – UNIVERSAL INPUTNumber of channels : 2 (DAS30) or 4 (DAS50)V OLTAGEBandwidth :100 kHzDC voltage ranges : 1 mV à 1000 VMaximum input voltage :± 500 VDC or 500 VACMax offset :± 5 ranges (up to ± 500 V)Accuracy :± 0,1% of range ; ± 10_V / ± 0,1% offset TRMS AC+DC ranges :from 200 mV to 424 VBandwidth (- 3 dB) :5Hz - 100kHzResponse time :100 ms typical (40 ms to 50 Hz)Crest factor :2,2 and 600 V peak voltageF REQUENCYSensitivity :100 mV rms min.Duty cycle :10% min.Frequency range :0.1 Hz to 100 kHzBasic accuracy 0,02% of full scaleT EMPERATURESensor RangesCouple J-210°C to 1200°CCouple K-250°C to 1370°CCouple T-200°C to 400°CCouple S-50°C to 1760°CCouple B200°C to 1820°CCouple E-250°C to 1000°CCouple N-250°C to 1300°CCouple C0°C to 2320°CCouple L-200°C to 900°CAccuracy Cold junction compensation ±1,25°CP OWER ANAL YSIS FUNCTIONNetworks :Single phase, 2 phases, 3 phasesDisplay :Fresnel diagram, oscilloscope, data Measurements :Mean value, RMS value, peak value,crest factor, THD and DF for voltagesand currents, active, reactive and apparentpower, power factor (cos ϕ)Harmonics :calculated up to rank 50,with display and record.S AMPLINGResolution :14 bitSampling rate :1M sample/sec per channel max.Memory length :32Mword in segments of up to 128 Blocks Triggering :Positive edge, negative edge, on logical input,delay, Go No GoPre trigger :-100% to +100%.B ANDWIDTHBandwidth ( -3dB)Range :Range :Range :Internal analogue filters :Slope :Programmable digital filters :Slope :Input impedance (DC) :Maximum input voltage :Between 2 terminals of one channel Isolation between frame ground and channel :>1 V : 100k Hz>50mV : 50kHz5 mV : 20kHz10 kHz, 1 kHz, 100 Hz, 10 Hz.20 dB/decade10 Hz, 1 Hz, 0,1 Hz, 0,01 Hz, 0,001 Hz 40 dB/decade>25MΩ for range <1V1 MΩ for upper ranges // 150pF typical± 500VAC between one channeland the frame ground± 500VAC>100 MΩ at 500 VDC.L OGIC INPUTChannels :16TTL – Max voltage :24VSampling rate :The same sampling rate as analogue inputs. Sensor supply :9 to 15 VAlarms 2 : A & B 0-5 V output.PT100 / PT1000* INPUTNumber of channels : 2Current : 1mA for Pt100 and 100µA for Pt1000 Resolution :20 bitsTemperature range:-200°C to +850°C Measurements :2, 3, 4 wires Accuracy at 20°C :±0,2°C *factory option。
SF-2410FP-T系列快速响应精确SMD保护朗道说明书
*R o H SC O MP LI A N T*Ro H SC O M P L I A N T &**HA LO G E N F RE EF 3A Clearing Time Characteristics for Series% of Current Rating100 %200 %Electrical CharacteristicsModel Rated Current(A)SF-2410FP0062T-20.062SF-2410FP008T-20.080SF-2410FP010T-20.100**** Melting I 2t calculated at 10 times rated current.*RoHS Directive 2015/863, Mar 31, 2015 and Annex.** B ourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less.SinglFuse ™ SF-2410FP-T Series Applicationsn N otebooks n LCD Monitors n LCD Backlight Inverters n POE, POE+n PC Servers n Power Supplies n Game Consoles n White GoodsEnvironmental CharacteristicsOperating Temperature .................................................................................................................................................................-55 °C to +125 °C Storage ConditionsTemperature .............................................................................................................................................................................+15 °C to +30 °C Humidity..........................................................................................................................................................................................20 % to 70 % Shelf Life..........................................................................................................................................................2 years from manufacturing date Moisture Sensitivity Level .......................................................................................................................................................................................1ESD Classification (HBM).............................................................................................................................................................................Class 6Average Pre-Arcing Time vs. Current Curves62 mA750 mA500 mA 400 mA 375 mA 315 mA 250 mA 80 mA 100 mA 125 mA 160 mA 200 mA 1000001000010001001010.10.010.001P R E -A R C I N G T I M E (S E C O N D S )0.011010.1CURRENT (A) 1 A10 A8 A 7 A 5 A 4 A 3.5 A 1.5 A 2 A 2.5 A 3 A 3.15 A 1000001000010001001010.10.010.001P R E -A R C I N G T I M E (S E C O N D S )0.1100101CURRENT (A)Average I 2t vs. t Curves1000010001001010.10.010.0010.0001I 2t (A 2s )0.010.1110100100010000010000TIME (SECONDS)62 mA80 mA 100 mA 125 mA 160 mA 200 mA 250 mA 315 mA 375 mA 400 mA 500 mA 750 mA 1000000010000001000001000010001001010.1I 2t (A 2s )0.010.1110100100010000010000TIME (SECONDS)1 A1.5 A 2 A2.5 A 3 A3.15 A 3.5 A 4 A 5 A 7 A 8 A 10 APackagingHow to OrderSF - 2410 FP 0062 T - 2SinglFuse™Product DesignatorSMD Footprint2410 = EIA 2410 (6125 metric)Fuse Blow TypeFP = Fast Acting PrecisionRated Current0062 ~ 1000 (62 mA ~ 10 A)Structure TypeT = Ceramic Tube Packaging Type- 2 = Tape & ReelTypical Part MarkingRepresents total content. Layout may vary.Product DimensionsRecommended Pad Layout(.102 ± .004)2.95(.116)3.15(.124)DIMENSIONS:MM (INCHES)DIMENSIONS:MM (INCHES)Solder Reflow RecommendationsT e m pe r a t u r eTimet 25 °C TO PEAKT PT LTS T 25 °CS* Tolerance for peak profile temperature (Tp ) is defined as a supplier minimum and a user maximum.Solder Wave RecommendationsT em pe r at u r e (°C )Peak Temperature (Dwell Time)Time (Sec.)10030028026024022020018016014012010080604020Current Rating Thermal Derating Curve120100806040200-60-40-20020406080100120140AMBIENT TEMPERATURE (°C)R A T E D C U R R E N T P E R C E N T A G E (%)Reliability TestingREV. 11/23Asia-Pacific: Tel: +886-2 2562-4117 • Email: ******************EMEA: Tel: +36 88 885 877 • Email: ******************The Americas: Tel: +1-951 781-5500 • Email: *******************This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and its affiliates (collectively, “Bourns”).Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change without notice. 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USB转串口 RD232R datasheet
Document No.: RD_000062RD232R USB UART IC Datasheet Version 2.311.3 USB CompliantThe RD232R is fully compliant with the USB 2.0 specification and has been given the USB-IF Test-ID (TID).Table of Contents1 Typical Applications (2)1.1 Driver Support (2)1.2 Part Numbers (2)Note: Packing codes for xxxx is: (2)1.3 USB Compliant (3)2 RD232R Block Dia gram (4)3 Device Pin Out and Signal Description (7)3.1 28-LD SSOP Package (7)3.2 SSOP Package Pin Out Description (7)3.3 QFN-32 Package (10)3.4 QFN-32 Package Signal Description (10)3.5 CBUS Signal Options (13)4 Function Description (14)4.1 Key Features (14)4.2 Functional Block Descriptions (15)5 Devices Characteristics and Ratings (17)5.1 Absolute Maximum Ratings (17)5.2 DC Characteristics (18)5.3 EEPROM Reliability Characteristics (21)5.4 Internal Clock Characteristics (21)6 USB Power Configurations (23)6.1 USB Bus Powered Configuration (23)6.2 Self Powered Configuration (24)6.3 USB Bus Powered with Power Switching Configuration (25)6.4 USB Bus Powered with Selectable External Logic Supply (26)7 Application E xa mples (27)7.1 USB to RS232 Converter (27)7.2 USB to RS485 Coverter (28)7.3 USB to RS422 Converter (29)7.4 USB to MCU UART Interface (30)7.5 LED Interface (31)7.6 Using the External Oscillator (32)8 Internal EEPROM Configuration (33)9 Package Parameters (35)9.1 SSOP-28 Package Dimensions (35)Document No.: RD_000062RD232R USB UART IC Datasheet Version 2.31Clearance No.: CORECHIPS# 51 9.2 QFN-32 Package Dimensions (36)9.3 QFN-32 Package Typical Pad Layout (37)9.4 QFN-32 Package Typical Solder Paste Diagram (37)9.5 Solder Reflow Profile (38)Appendix A - List of Figures and Tables (39)Figure 3.1 SSOP Package Pin Out and Schematic SymbolNote: The convention used throughout this document for active low signals is the signal name followed by aDescr i p tio nUSB Data Signal Plus, incorporating internal series resistor and 1.5k pull u pUSB Data Signal Minus, incorporating internal series resistor.Descr i p tio n+1.8V to +5.5V supply to the UART Interface and CBUS group pins (1...3, 5, 6,9...14, 22, 23). In USB bus powered designs connect this pin to 3V3OUT pin to driveout at +3.3V levels, or connect to VCC to drive out at 5V CMOS level. This pin canalso be supplied with an external +1.8V to +2.8V supply in order to drive outputs atlower levels. It should be noted that in this case this supply should originate fromthe same source as the supply to VCC. This means that in bus powered designs aregulator which is supplied by the +5V on the USB bus should be used.Figure 3.2 QFN-32 Package Pin Out and schematic symbol3.4 QFN-32 SignalPin No.DescriptionUSBDP I/O USB Data Signal Plus, incorporating internal series resistor and 1.5k pull up r esist oto +3.3V.USBDM I/O USB Data Signal Minus, incorporating internal series resistor.Table 3.5 USB Interface GroupPin DescriptionVCCIO PWR +1.8V to +5.5V supply for the UART Interface and CBUS group pins (2, 3,6,7,8,9,10 11, 21, 22, 30,31,32). In USB bus powered designs connect this pin to3V3OUTto drive out at +3.3V levels, or connect to VCC to drive out at +5V CMOS level. This pin can also be supplied with an external +1.8V to +2.8V supply in order to drive out at lower levels. It should be noted that in this case this supply should originate from the same source as the supply to VCC. This means that in bus powered designs a regulator which is supplied by the +5V on the USB bus should be used.4 Function DescriptionThe RD232R is a USB to serial UART interface device which simplifies USB to serial designs and reduces external component count by fully integrating an external EEPROM, USB termination resistors and an integrated clock circuit which requires no external crystal, into the device. It has been designed to operate efficiently with a USB host controller by using as little as possible of the total USB bandwidth available.4.1 Key FeaturesFunctional Integration. Fully integrated EEPROM, USB termination resistors, clock generation, AVCC filtering, POR and LDO regulator.Configurable CBUS I/O Pin Options. The fully integrated EEPROM allows configuration of the Control Bus (CBUS) functionality, signal inversion and drive strength selection. There are 5 configurable CBUS I/O pins. These configurable options are1. TXDEN - transmit enable for RS485 designs.2. PWREN# - Power control for high power, bus powered designs.3. TXLED# - for pulsing an LED upon transmission of data.4. RXLED# - for pulsing an LED upon receiving data.5. TX&RXLED# - which will pulse an LED upon transmission OR reception of data.6. SLEEP# - indicates that the device going into USB suspend mode.7. CLK48 / CLK24 / CLK12 / CLK6 - 48MHz, 24MHz, 12MHz, and 6MHz clock output signaloptions.The CBUS pins can also be individually configured as GPIO pins, similar to asynchronous bit bang mode. It is possible to use this mode while the UART interface is being used, thus providing up to 4 general purpose I/O pins which are available during normal operation. An application note, available from CORECHIPS website () describes this feature.The CBUS lines can be configured with any one of these output options by setting bits in the internal EEPROM. The device is supplied with the most commonly used pin definitions pre-programmed - see Section 8 for details.Asynchronous Bit Bang Mode with RD# and WR# Strobes. The RD232R supports CORECHIPS`s previous chip generation bit-bang mode. In bit-bang mode, the eight UART lines can be switched from the regular interface mode to an 8-bit general purpose I/O port. Data packets can be sent to the device and they will be sequentially sent to the interface at a rate controlled by an internal timer (equivalent to the baud rate pre-scaler). With the RD232R device this mode has been enhanced by outputting the internal RD# and WR# strobes signals which can be used to allow external logic to be clocked by accesses to the bit-bang I/O bus. This option will be described more fully in a separate application note available from CORECHIPS website ().Synchronous Bit Bang Mode. The RD232R supports synchronous bit bang mode. This mode differs from asynchronous bit bang mode in that the interface pins are only read when the device is written to. This makes it easier for the controlling program to measure the response to an output stimulus as the data returned is synchronous to the output data. An application note, available from CORECHIPS website() describes this feature.CoreChips-ID™. The RD232R also includes the new CoreChips-ID™security dongle feature. This CoreChips-ID™ feature allows a unique number to be burnt into each device during manufacture. This number cannot be reprogrammed. This number is only readable over USB and forms a basis of a security dongle which can be used to protect any customer application software being copied. This allows the possibility of using the RD232R in a dongle for software licensing. Further to this, a renewable license scheme can be implemented based on the CoreChips-ID™ number when encrypted with other information. This encrypted number can be stored in the user area of the RD232R internal EEPROM, and can be decrypted, then compared with the protected CoreChips-ID™ to verify that a license is valid. Web based applications can be used to maintain product licensing this way. An application note, available from CORECHIPS website () describes this feature.The RD232R is capable of operating at a voltage supply between +3.3V and +5V with a nominal operational mode current of 15mA and a nominal USB suspend mode current of 70µA. This allows greater margin for peripheral designs to meet the USB suspend mode current limit of 2.5mA. An integrated level converter within the UART interface allows the RD232R to interface to UART logic running at +1.8V, 2.5V,+3.3V or +5V.Document No.: RD_000062RD232R USB UART IC Datasheet Version 2.31Clearance No.: CORECHIPS# 51 4.2 Functional Block DescriptionsThe following paragraphs detail each function within the RD232R. Please refer to the block diagram shown in Figure 2.1Internal EEPROM. The internal EEPROM in the RD232R is used to store USB Vendor ID (VID), Product ID (PID), device serial number, product description string and various other USB configuration descriptors. The internal EEPROM is also used to configure the CBUS pin functions. The RD232R is supplied with the internal EEPROM pre-programmed as described in Section 8. A user area of the internal EEPROM is available to system designers to allow storing additional data. The internal EEPROM descriptors can be programmed in circuit, over USB without any additional voltage requirement. It can be programmed using the CORECHIPS utility software called MPROG, which can be downloaded from CORECHIPS Utilities on the CORECHIPS website ().+3.3V LDO Regulator. The +3.3V LDO regulator generates the +3.3V reference voltage for driving the USB transceiver cell output buffers. It requires an external decoupling capacitor to be attached to the3V3OUT regulator output pin. It also provides +3.3V power to the 1.5kΩ internal pull up resistor on USBDP. The main function of the LDO is to power the USB Transceiver and the Reset Generator Cells rather than to power external logic. However, it can be used to supply external circuitry requiring a+3.3V nominal supply with a maximum current of 50mA.USB Transceiver. The USB Transceiver Cell provides the USB 1.1 / USB 2.0 full-speed physical interface to the USB cable. The output drivers provide +3.3V level slew rate control signalling, whilst a differential input receiver and two single ended input receivers provide USB data in, Single-Ended-0 (SE0) and USB reset detection conditions respectfully. This function also incorporates the internal USB series termination resistors on the USB data lines and a 1.5kΩ pull up resistor on USBDP.USB DPLL. The USB DPLL cell locks on to the incoming NRZI USB data and generates recovered clockand data signals for the Serial Interface Engine (SIE) block.Internal 12MHz Oscillator - The Internal 12MHz Oscillator cell generates a 12MHz reference clock. This provides an input to the x4 Clock Multiplier function. The 12MHz Oscillator is also used as the reference clock for the SIE, USB Protocol Engine and UART FIFO controller blocks.Clock Multiplier / Divider. The Clock Multiplier / Divider takes the 12MHz input from the Internal Oscillator function and generates the 48MHz, 24MHz, 12MHz and 6MHz reference clock signals. The 48Mz clock reference is used by the USB DPLL and the Baud Rate Generator blocks.Serial Interface Engine (SIE). The Serial Interface Engine (SIE) block performs the parallel to serial and serial to parallel conversion of the USB data. In accordance with the USB 2.0 specification, it performsbit stuffing/un-stuffing and CRC5/CRC16 generation. It also checks the CRC on the USB data stream.USB Protocol Engine. The USB Protocol Engine manages the data stream from the device USB control endpoint. It handles the low level USB protocol requests generated by the USB host controller and the commands for controlling the functional parameters of the UART in accordance with the USB 2.0 specification chapter 9.FIFO RX Buffer (128 bytes). Data sent from the USB host controller to the UART via the USB data OUT endpoint is stored in the FIFO RX (receive) buffer. Data is removed from the buffer to the UART transmit register under control of the UART FIFO controller. (Rx relative to the USB interface).FIFO TX Buffer (256 bytes). Data from the UART receive register is stored in the TX buffer. The USB host controller removes data from the FIFO TX Buffer by sending a USB request for data from the device data IN endpoint. (Tx relative to the USB interface).UART FIFO Controller. The UART FIFO controller handles the transfer of data between the FIFO RX and TX buffers and the UART transmit and receive registers.UART Controller with Programmable Signal Inversion and High Drive. Together with the UART FIFO Controller the UART Controller handles the transfer of data between the FIFO RX and FIFO TXbuffers and the UART transmit and receive registers. It performs asynchronous 7 or 8 bit parallel to serialand serial to parallel conversion of the data on the RS232 (or RS422 or RS485) interface.Control signals supported by UART mode include RTS, CTS, DSR, DTR, DCD and RI. The UART Controller also provides a transmitter enable control signal pin option (TXDEN) to assist with interfacing to RS485 transceivers. RTS/CTS, DSR/DTR and X ON / X OFF handshaking options are also supported. Handshaking is handled in hardware to ensure fast response times. The UART interface also supports the RS232 BREAK setting and detection conditions.Figure 6.1 Bus Powered ConfigurationFigure 6.1 Illustrates the RD232R in a typical USB bus powered design configuration. A USB bus powered device gets its power from the USB bus. Basic rules for USB bus power devices are as follows : On plug-in to USB, the device should draw no more current than 100mA.In USB Suspend mode the device should draw no more than 2.5mA.A bus powered high power USB device (one that draws more than 100mA) should use one of theCBUS pins configured as PWREN# and use it to keep the current below 100mA on plug-in and2.5mA on USB suspend.A device that consumes more than 100mA cannot be plugged into a USB bus powered hub.No device can draw more than 500mA from the USB bus.The power descriptors in the internal EEPROM of the RD232R should be programmed to match the current drawn by the device.A ferrite bead is connected in series with the USB power supply to reduce EMI noise from the RD232R and associated circuitry being radiated down the USB cable to the USB host. The value of the Ferrite Bead depends on the total current drawn by the application. A suitable range of Ferrite Beads is available from Steward (), for example Steward Part # MI0805K400R-10.Note: If using PWREN# (available using the CBUS) the pin should be pulled to VCCIO using a 10kFigure 6.2 Self Powered ConfigurationFigure 6.2 illustrates the RD232R in a typical USB self powered configuration. A USB self powered device gets its power from its own power supply, VCC, and does not draw current from the USB bus. The basic rules for USB self powered devices are as follows :A self powered device should not force current down the USB bus when the USB host or hubcontroller is powered down.A self powered device can use as much current as it needs during normal operation and USBsuspend as it has its own power supply.A self powered device can be used with any USB host, a bus powered USB hub or a self powered USBhub.The power descriptor in the internal EEPROM of the RD232R should be programmed to a value of zero (self powered).In order to comply with the first requirement above, the USB bus power (pin 1) is used to control the RESET# pin of the RD232R device. When the USB host or hub is powered up an internal 1.5kΩ resistor on USBDP is pulled up to +3.3V (generated using the 4K7 and 10k resistor network), thus identifying the device as a full speed device to the USB host or hub. When the USB host or hub is powered off, RESET# will be low and the RD232R is held in reset. Since RESET# is low, the internal 1.5kΩ resistor is not pulledup to any power supply (hub or host is powered down), so no current flows down USBDP via the 1.5k pull-up resistor. Failure to do this may cause some USB host or hub controllers to power up erratically. Figure 6.2 illustrates a self powered design which has a +4V to +5.5V supply.When the RD232R is in reset, the UART interface I/O pins are tri-stated. Input pins have internal pull-up resistors to VCCIO, so they will gently pull high unless driven by some external logic.When using internal RD232R oscillator the VCC supply voltage range must be +4.0V to 5.5V.3. When using external oscillator the VCC supply voltage range must be +3.3V to 5.5V Any designwhich interfaces to +3.3 V or +1.8V would be having a +3.3V or +1.8V supply to VCCIO.Figure 6.3 Bus Powered with Power Switching ConfigurationA requirement of USB bus powered applications, is when in USB suspend mode, the application draws a total current of less than 2.5mA. This requirement includes external logic. Some external logic has the ability to power itself down into a low current state by monitoring the PWREN# signal. For external logic that cannot power itself down in this way, the RD232R provides a simple but effective method of turning off power during the USB suspend mode.Figure 6.3 shows an example of using a discrete P-Channel MOSFET to control the power to external logic. A suitable device to do this is an International Rectifier () IRLML6402, or equivalent. It recommended that a “soft start circuit consisting of a 1kΩ series resistor and a 0.1limit the current surge when the MOSFET turns on. Without the soft start circuit it is possible that the transient power surge, caused when the MOSFET switches on, will reset the RD232R or the USB host/hub controller. The soft start circuit example shown in Figure 6.3 powers up with a slew rate of approximaely12.5V/ms. Thus supply voltage to external logic transitions from GND to +5V in approximately 400 microseconds.As an alternative to the MOSFET, a dedicated power switch IC with inbuilt “soft-start” can be used. A suitable power switch IC for such an application is the Micrel () MIC2025-2BM orWith power switching controlled designs the following should be noted:The external logic to which the power is being switched should have its own reset circuitry to automatically reset the logic when power is re-applied when moving out of suspend mode.Set the Pull-down on Suspend option in the internal RD232R EEPROM.iii) One of the CBUS Pins should be configured as PWREN# in the internal RD232R EEPROM, and used to switch the power supply to the external circuitry. This should be pulled high through a 10 kFigure 6.4 USB Bus Powered with +3.3V or +5V External Logic Power SupplyFigure 6.4 illustrates a USB bus power application with selectable external logic supply. The external logic can be selected between +3.3V and +5V using the jumper switch. This jumper is used to allow tto be interfaced with a +3.3V or +5V logic devices. The VCCIO pin is either supplied with +5V from the USB bus (jumper pins1 and 2 connected), or from the +3.3V output from the RD232R 3V3OUT pin (jumper pins 2 and 3 connected). The supply to VCCIO is also used to supply external logic.With bus powered applications, the following should be noted:To comply with the 2.5mA current supply limit during USB suspend mode, PWREN# or SLEEP# signals should be used to power down external logic in this mode. If this is not possible, use the configuration shown in Section 6.3.The maximum current sourced from the USB bus during normal operation should not exceed 100mA, otherwise a bus powered design with power switching (Section 6.3) should be used.Another possible configuration could use a discrete low dropout (LDO) regulator which is supplied by the 5V on the USB bus to supply between +1.8V and +2.8V to the VCCIO pin and to the external logic. In this case VCC would be supplied with the +5V from the USB bus and the VCCIO would be supplied fromthe output of the LDO regulator. This results in the RD232R I/O pins driving out at between +1.8V andFor a USB bus powered application, it is important to consider the following when selecting the regulator: The regulator must be capable of sustaining its output voltage with an input voltage of +4.35V. An Low Drop Out (LDO) regulator should be selected.The quiescent current of the regulator must be low enough to meet the total current requirement ofFigure 7.1 Application Example showing USB to RS232 ConverterAn example of using the RD232R as a USB to RS232 converter is illustrated in Figure 7.1. In this application, a TTL to RS232 Level Converter IC is used on the serial UART interface of the RD232R to convert the TTL levels of the RD232R to RS232 levels. This level shift can be done using the popular “213” series of TTL to RS232 level converters. These “213” devices typically have 4 transmitters and 5 receivers in a 28-LD SSOP package and feature an in-built voltage converter to convert the +5V (nominal) VCC to the +/- 9 volts required by RS232. A useful feature of these devices is the SHDN# pin which can be used to power down the device to a low quiescent current during USB suspend mode.A suitable level shifting device is the Sipex SP213EHCA which is capable of RS232 communication at up to 500k baud. If a lower baud rate is acceptable, then several pin compatible alternatives are available such as the Sipex SP213ECA, the Maxim MAX213CAI and the Analogue Devices ADM213E, which are all suitable for communication at up to 115.2k baud. If a higher baud rate is required, the Maxim MAX3245CAI device is capable of RS232 communication rates up to 1Mbaud. Note that the MAX3245 is not pin compatible with the 213 series devices and that the SHDN pin on the MAX device is active high and should be connect toFigure 7.2 Application Example Showing USB to RS485 ConverterAn example of using the RD232R as a USB to RS485 converter is shown in Figure 7.2. In this application, a TTL to RS485 level converter IC is used on the serial UART interface of the RD232R to convert the TTL levels of the RD232R to RS485 levels.This example uses the Sipex SP481 device. Equivalent devices are available from Maxim and Analogue Devices. The SP481 is a RS485 device in a compact 8 pin SOP package. It has separate enables on both the transmitter and receiver. With RS485, the transmitter is only enabled when a character is being transmitted from the UART. The TXDEN signal CBUS pin option on the RD232R is provided for exactly this purpose and so the transmitter enable is wired to CBUS2 which has been configured as TXDEN. Similarly, CBUS3been configured as PWREN#. This signal is used to control the SP481`s receiver enable. The receiver enable is active low, so it is wired to the PWREN# pin to disable the receiver when in USB suspend mode. CBUS2 = TXDEN and CBUS3 = PWREN# are the default device configurations of the RD232R pins.RS485 is a multi-drop network; so many devices can communicate with each other over a two wire cable interface. The RS485 cable requires to be terminated at each end of the cable. A link (which provides the termination) allows the cable to be terminated if the SP481 is physically positioned at either end of In this example the data transmitted by the RD232R is also present on the receive path of the SP481.This is a common feature of RS485 and requires the application software to remove the transmitted data from the received data stream. With the RD232R it is possible to do this entirely in hardware by modifying theFigure 7.3 USB to RS422 Converter ConfigurationAn example of using the RD232R as a USB to RS422 converter is shown in Figure 7.3. In this application, two TTL to RS422 Level Converter ICs are used on the serial UART interface of the RD232R to convert the TTL levels of the RD232R to RS422 levels. There are many suitable level converter devices available. This example uses Sipex SP491 devices which have enables on both the transmitter and receiver. Since the SP491 transmitter enable is active high, it is connected to a CBUS pin in SLEEP# configuration. The SP491 receiver enable is active low and is therefore connected to a CBUS pin PWREN# configuration. This ensures that when both the SP491 transmitters and receivers are enabled then the device is active, and when the device is in USB suspend mode, the SP491 transmitters and receivers are disabled. If a similar application is used, but the design is USB BUS powered, it may be necessary to use a P-Channel logic level MOSFET (controlled by PWREN#) in the VCC line of the SP491 devices to ensure that the USB standby current of 2.5mA is met. The SP491 is specified to transmit and receive data at a rate of up to 5 Mbaud. In this example the maximum data rate is limited to 3 Mbaud by the RD232R.Figure 7.4 USB to MCU UART InterfaceAn example of using the RD232R as a USB to Microcontroller (MCU) UART interface is shown in Figure7.4. In this application the RD232R uses TXD and RXD for transmission and reception of data, and RTS# / CTS# signals for hardware handshaking. Also in this example CBUS0 has been configured as a 12MHz output Optionally, RI# could be connected to another I/O pin on the MCU and used to wake up the USB host controller from suspend mode. If the MCU is handling power management functions, then a CBUS pin can be configured as PWREN# and would also be connected to an I/O pin of the MCU.Figure 7.5 Dual LED ConfigurationAn example of using the RD232R to drive LEDs is shown in Figure 7.5. In this application one of the CBUS pins is used to indicate transmission of data (TXLED#) and another is used to indicate receiving data (RXLED#). When data is being transmitted or received the respective pins will drive from tri-state to low in order to provide indication on the LEDs of data transfer. A digital one-shot is used so that even a small percentage of data transfer is visible to the end user.Figure 7.6 Single LED ConfigurationAnother example of using the RD232R to drive LEDs is shown in Figure 7.6. In this example one of the CBUS pins is used to indicate when data is being transmitted or received by the device (TX&RXLED). In this configuration the RD232R will drive only a single LED.7.6 Using the External OscillatorThe RD232R defaults to operating using its own internal oscillator. This requires that the device is powered with VCC(min)=+4.0V. This supply voltage can be taken from the USB VBUS. Applications which require using an external oscillator, VCC= +3.3V, must do so in the following order:1. When device powered for the very first time, it must have VCC > +4.0V. This supply is availablefrom the USB VBUS supply = +5.0V.2. The EEPROM must then be programmed to enable external oscillator. This EEPROM modificationcannot be done using the CORECHIPS programming utility, MPROG. The EEPROM can only be re- configured from a custom application. Please refer to the applications note on the CORECHIPSwebsite () on how to do this.3. The RD232R can then be powered from VCC=+3.3V and an external oscillator. This can be doneusing a link to switch the VCC supply.The RD232R will fail to operate when the internal oscillator has been disabled, but no external oscillator has been connected.Figure 9.1 SSOP-28 Package DimensionsThe RD232RL is supplied in a RoHS compliant 28 pin SSOP package. The package is lead (Pb) free and uses a “green” compound. The package is fully compliant with European Union directive 2002/95/EC. This package is nominally 5.30mm x 10.20mm body (7.80mm x 10.20mm including pins). The pins are on a 0.65 mm pitch. The above mechanical drawing shows the SSOP-28 package.All dimensions are in millimetres.The date code format is YYXX where XX = 2 digit week number, YY = 2 digit year number. This is followed by the revision number.Figure 9.2 QFN-32 Package DimensionsThe RD232RQ is supplied in a RoHS compliant leadless QFN-32 package. The package is lead ( Pb ) free, and uses a “green” compound. The package is fully compliant with European Union directive 2002/95/EC. This package is nominally 5.00mm x 5.00mm. The solder pads are on a 0.50mm pitch. The above mechanical drawing shows the QFN-32 package. All dimensions are in millimetres.The centre pad on the base of the RD232RQ is not internally connected, and can be left unconnected, or connected to ground (recommended).The date code format is YYXX where XX = 2 digit week number, YY = 2 digit year number.The code XXXXXXX is the manufacturing LOT code.。
光敏传感器 EE-SX1023-W1 产品说明书
Slot-type pre-wired model•General-purpose model with a 2.1-mm-wide slot.Model Number StructureOrdering InformationPhotomicrosensorRatings, Characteristics and Exterior SpecificationsAbsolute Maximum Ratings (Ta = 25°C )*1.Refer to the temperature rating chart if the ambient temperatureexceeds 25°C.*2.The pulse width is 10 μs maximum with a frequency of 100 Hz.*plete soldering within 10 seconds.Exterior SpecificationsElectrical and Optical Characteristics (Ta = 25°C)RoHS CompliantBe sure to read Safety Precautions on page 3.(2)(1)EE-S X 1 023 - W 1(3)(4)(5)(6)(2)Transmissive(5)Coad(4)Serial number(6)Serial number(3)Phototransistor output(1)PhotomicrosensorItemSymbol Rated valueUnit EmitterForward current I F 50 *1mA Pulse forward current I FP 1 *2A Reverse voltage V R 4V DetectorCollector-Emitter voltage V CEO 30V Emitter-Collector voltage V ECO ---V Collector current I C 20mA Collector dissipation P C100 *1mWAmbient temperatureOperating T opr -25 to 85°C StorageT stg -30 to 100°C Soldering temperatureT sol260 *3°CConnecting methodWeight (g)Material Case Pre-wired3.4PolycarbonateItemSymb olValue UnitConditionMIN.TYP.MAX.EmitterForward voltage V F --- 1.2 1.5V I F = 30 mA Reverse current I R ---0.0110μA V R = 4 V Peak emission wavelength λP---940---nmI F = 20 mADetectorLight currentI L0.5------mAI F = 20 mA,V CE = 5 V Dark currentI D ---2200nA V CE = 10 V,0 l x Leakage current I LEAK ---------------Collector-Emitter saturated voltage V CE (sat)---0.10.4V I F = 20 mA,I L = 0.1 mA Peak spectral sensitivity wavelength λP---850---nmV CE = 10 V Rising timetr ---4---μsV CC = 5 V,R L = 100 ΩI L = 5 mA Falling time tf ---4---μsV CC = 5 V,R L = 100 ΩI L = 5 mAEngineering Data (Reference value)Fig 1. Forward Current vs. Collector Dissipation Temperature RatingFig 2. Forward Current vs. Forward Voltage Characteristics (Typical)Fig 3. Light Current vs. Forward Current Characteristics (Typical)Fig 4. Light Current vs. Collector-Emitter Voltage Characteristics (Typical)Fig 5. Relative Light Current vs. Ambient Temperature Characteristics (Typical)Fig 6. Dark Current vs. Ambient Temperature Characteristics (Typical)Fig 7. Response Time vs. LoadResistance Characteristics (Typical)Fig 8. Sensing Position Characteristics (Typical)Fig 9. Response Time Measurement CircuitF o r w a r d c u r r e n t I F (m A )C o l l e c t o r d i s s i p a t i o n P c (m W )Ambient temperature T a (°C)10080604020-200-400102030405060I FP C501001500.20.40.60.811.2 1.4 1.6 1.8F o r w a r d c u r r e n t I F (m A )Forward voltage V F(V)108642L i g h t c u r r e n t I L (m A )Forward current I F (mA)L i g h t c u r r e n t I L (m A )Collector–Emitter voltage V CE (V)R e l a t i v e l i g h t c u r r e n t I (%)Ambient temperature Ta (°C)D a r k c u r r e n t I D (n A )Ambient temperature Ta (°C)R e s p o n s e t i m e t r , t f (µs )Load resistance R L (k )-0.5-0.2500.250.50.75 1.0Distance d (mm)R e l a t i v e l i g h t c u r r e n t I L (%)Input 0Output OutputSafety PrecautionsTo ensure safe operation, be sure to read and follow the Instruction Manual provided with the Sensor.This product is not designed or rated for ensuring safety of persons either directly or indirectly. Do not use it for such purposes.Do not use the product with a voltage or current that exceeds the rated range.Applying a voltage or current that is higher than the rated range may result in explosion or fire.Do not miswire such as the polarity of the power supply voltage.Otherwise the product may be damaged or it may burn.This product does not resist water. Do not use the product in places where water or oil may be sprayed onto the product.Do not use the product in atmospheres or environments that exceed product ratings.Dispose of this product as industrial waste.Dimensions and Internal Circuit(Unit: mm)PhotomicrosensorCAUTIONPrecautions for Safe UsePrecautions for Correct UseCross section A-AKA CEEE-SX1023-W1Internal circuitTerminal No.Color Name A Orange Anode K Green Cathode C White Collector EBlueEmitterUnless otherwise specified, the tolerances are as shown below.DimensionsTolerance 3 mm max.±0.2003 < mm ≤ 6±0.2406 < mm ≤ 10±0.29010 < mm ≤ 18±0.35018 < mm ≤ 30±0.42030 < mm ≤ 50±0.50050 < mm ≤ 80±0.600EmitterDetector1.3 × 0.51.3 × 0.5Aperture size (H×W)Please check each region's Terms & Conditions by region website.OMRON CorporationElectronic and Mechanical Components CompanyRegional Contactr opeAme icas Euhttps:/// http://components.omron.eu/ Asia-Pacific China https://.sg/ https:///Ko ea Japanhttps://www.omron-ecb.co.kr/ https://www.omron.co.jp/ecb/。
赛米控丹佛斯电子 Board_1_SKYPER_32PRO_R 数据表
Board 1 SKYPER 32PRO RSKYPER ®Adaptor boardAdaptor boardBoard 1 SKYPER 32PRO R Preliminary Data Features•Two output channels •Failure managementTypical Applications*•Adaptor board for SKYPER 32 IGBT drivers in bridge circuits for industrial applications•DC bus up to 1200VFootnotesAll characteristics listed in the data sheet are guilty for the use with SKYPER 32Please consider the derating of the ambient temperaturePlease refer to the datasheet of SKYPER 32 for further informationThis is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal.Absolute Maximum Ratings SymbolConditionsValuesUnitVs Supply voltage primary 16V Iout PEAK Output peak current 15A Iout AVmax Output average current 50mA f max max. switching frequency50kHz V CECollector emitter voltage sense across the IGBT1700V V isol IO Isolation test voltage input - output (AC, rms, 2s)4000V V isolPD Partial discharge extinction voltage, rms, Q PD d 10pC1500V V isol12Isolation test voltage output 1 - output 2 (AC, rms, 2s)1500V R Gon min 1.5:R Goff min Minimum rating for external R Goff 1.5:T op Operating temperature -25...85°C T stgStorage temperature-25 (85)°CCharacteristics SymbolConditionsmin.typ.max.UnitVs Supply voltage primary side 14.41515.6V V j input signal voltage on / off 15 / 0V V IT+Input treshold voltage HIGH 12.3V V IT-Input threshold voltage (LOW) 4.6V V G(on)Turn on gate voltage output 15V V G(off)Turn off gate voltage output-7V t d(on)IO Input-output turn-on propagation time 1.2µs t d(off)IOInput-output turn-off propagation time1.2µsDeratingAdaptor Board 1 SKYPER® 32PRO RTechnical ExplanationsRevision 02------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------This Technical Explanation is valid for the following parts:part number type date code (YYWW)L6100231 Board 1 SKYPER® 32PRO R ≥ 1004Related documents:titleTechnical Explanations SKYPER® 32PRO RPrepared by: Johannes Krapp------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------ ContentApplication and Handling Instructions (3)Further application support (3)General Description (3)Dimensions (4)Component Placement Layout (4)PIN Array (not SKiiP® compatible) (5)PIN Array – Secondary Side (6)Signal IF_CMN_nHALT (7)Setting Dead Time (7)Setting Dynamic Short Circuit Protection (7)Collector Series Resistance (8)Adaptation Gate Resistors (8)Setting Soft Turn-Off (8)Over Temperature Protection Circuit (OTP) (9)Mounting Notes (9)Schematics (10)Parts List (12)Application and Handling InstructionsPlease provide for static discharge protection during handling. As long as the hybrid driver is not completely assembled,the input terminals have to be short-circuited. Persons working with devices have to wear a grounded bracelet. Any synthetic floor coverings must not be statically chargeable. Even during transportation the input terminals have to be short-circuited using, for example, conductive rubber. Worktables have to be grounded. The same safety requirements apply to MOSFET- and IGBT-modules.Any parasitic inductances within the DC-link have to be minimised. Over-voltages may be absorbed by C- or RCD-snubber networks between main terminals for PLUS and MINUS of the power module.When first operating a newly developed circuit, SEMIKRON recommends to apply low collector voltage and load currentin the beginning and to increase these values gradually, observing the turn-off behaviour of the free-wheeling diode and the turn-off voltage spikes generated across the IGBT. An oscillographic control will be necessary. Additionally, the case temperature of the module has to be monitored. When the circuit works correctly under rated operation conditions, short-circuit testing may be done, starting again with low collector voltage.It is important to feed any errors back to the control circuit and to switch off the device immediately in failure events.Repeated turn-on of the IGBT into a short circuit with a high frequency may destroy the device.The inputs of the hybrid driver are sensitive to over-voltage. Voltages higher than V S +0,3V or below -0,3V may destroythese inputs. Therefore, control signal over-voltages exceeding the above values have to be avoided.The connecting leads between hybrid driver and the power module should be as short as possible (max. 20cm), thedriver leads should be twisted.Further application supportLatest information is available at . For design support please read the SEMIKRON Application Manual Power Modules available at .General DescriptionThe Board 1 SKYPER ® 32PRO is an adaptor board for the IGBT module e.g. SEMITRANS™, SEMiX ®(solder pin version). The board can be customized allowing adaptation and optimization to the used IGBT module.The switching characteristic of the IGBT can be influenced through user settings, e.g. changing turn-on and turn-off speed by variation of R Gon and R Goff . Furthermore, it is possible to adjust the monitoring level and blanking time for the DSCP, softturn-off behaviour as well as an over temperature trip level by using the temperature sensor integrated in SEMiX ®modules(see Technical Explanations SKYPER ®32PRO).Board 1 SKYPER ® 32PROPlease note:This technical explanation is based on the Technical Explanations for SKYPER ® 32PRO. Please read the Technical Explanations SKYPER ® 32PRO before using the Adaptor Board.Please note:All values in this technical explanation are typical values. Typical values are the average values expected in large quantities and are provided for information purposes only. These values can and do vary in different applications. All operating parameters should be validated by user’s technical experts for each application.DimensionsPIN Array (not SKiiP ® compatible)Connector X20 (ODU FLAKAFIX 511.068.803.020)Product information of suitable female connectors and distributor contact information is available at e.g. (part number 09 18 520 6 813).PIN Signal FunctionSpecification X20:01 IF_PWR_15P Drive power supply Stabilised +15V ±4% X20:02 IF_PWR_GND GND for power supplyX20:03 IF_PWR_15P Drive power supply Stabilised +15V ±4% X20:04 IF_PWR_GND GND for power supplyX20:05 IF_PWR_15P Drive power supply Stabilised +15V ±4% X20:06 IF_PWR_GND GND for power supply X20:07 reservedX20:08 IF_PWR_GND GND for power supplyX20:09 IF_CMN_nHALT Driver core status signal (bidirectional signal with dominant recessive behaviour) Digital 15V logic; LOW (dominant) = driver disabled; HIGH (recessive) = ready to operate X20:10 reserved X20:11 reservedX20:12 IF_CMN_GND GND for signal IF_CMN_nHALT X20:13 reserved X20:14 reservedX20:15IF_HB_TOPSwitching signal input (TOP switch)Digital 15 V logic; 10 kOhm impedance; LOW = TOP switch off; HIGH = TOP switch onX20:16 IF_HB_BOT Switching signal input (BOTTOM switch) Digital 15 V logic; 10 kOhm impedance; LOW = BOT switch off; HIGH = BOT switch on X20:17 reservedX20:18 IF_HB_GND GND for signals IF_HB_TOP & IF_HB_BOT X20:19 reserved X20:20reservedPIN Array – Secondary SideConnector X100, X200 (MOLEX Series 41791, Part Number 26-60-4050)Product information of suitable female connectors and distributor contact information is available at e.g. (e.g. series 41695).PIN Signal FunctionSpecification X100:01 EMITTER_TOP Emitter output TOP IGBT X100:02 reservedX100:03 GATE_TOP Gate output TOP IGBT X100:05 VCE_TOP Collector output TOP IGBT X200:01 EMITTER_BOT Emitter output BOT IGBT X200:02 reservedX200:03 GATE_BOT Gate output BOT IGBT X200:05 VCE_BOTCollector output BOT IGBTConnector X12 (MOLEX Series 41791, Part Number 26-60-4020)Product information of suitable female connectors and distributor contact information is available at e.g. (e.g. series 41695).PIN SignalFunctionSpecification X12:01 SENSE_TEMP_T1 Input temperature signal NTC + / PTC + X12:02 SENSE_TEMP_T2Input temperature signalNTC - / PTC -Signal IF_CMN_nHALTThe Halt Logic Signals PRIM_HALT_IN and PRIM_HALT_OUT of the driver core are coupled to one bidirectional signal (IF_CMN_nHALT) with dominant recessive behaviour. IF_CMN_nHALT shows the driver core status. When IF_CMN_nHALT is HIGH (recessive), the driver core is ready to operate. When IF_CMN_nHALT is LOW (dominant), the driver core is disabled / not ready to operate because of e. g. detected failure or driver core system start.A controller can hold with the IF_CMN_nHALT signal the driver core in a safe state (e.g. during a start up of a system or gathered failure signal of other hardware) or generate a coeval release of paralleled driver. Furthermore, paralleled drivers can send and receive IF_CMN_nHALT signals among each other by using a single-wire bus.Connection IF_CMN_nHALTSetting Dead TimeDT adjustmentDesignation Shape SettingR43(connected toGND) 0603 (SMD)PRIM_CFG_TDT2_INFactory setting: 0R44(connected toGND) 0603 (SMD)PRIM_CFG_SELECT_INFactory setting: not equippedR45(connected toGND) 0603 (SMD)PRIM_CFG_TDT3_INFactory setting: 0R46(connected toGND)0603 (SMD)PRIM_CFG_TDT1_INFactory setting: not equipped Factory setting: 3,3µsSetting Dynamic Short Circuit ProtectionR CE & C CEDesignation Shape SettingR162 1206 (SMD)R CEFactory setting: not equippedTOPC150 1206 (SMD)C CEFactory setting: not equippedTOPR262 1206 (SMD)R CEFactory setting: not equippedBOTC260 1206 (SMD)C CEFactory setting: not equippedBOTCollector Series ResistanceR VCEDesignation SettingR150 MiniMELF (SMD)R VCE*Factory setting: not equippedTOPR250 MiniMELF (SMD)R VCE *Factory setting: not equippedBOT* 1200V IGBT operation: 0** 1700V IGBT operation: 1k / 0,4WAdaptation Gate ResistorsR Gon & R GoffDesignation Shape SettingR151, R152, R153 (parallel connected) MiniMELF (SMD)R GonFactory setting: not equippedTOPR154, R155, R156 (parallel connected) MiniMELF (SMD)R GoffFactory setting: not equippedTOPR251, R252, R253 (parallel connected) MiniMELF (SMD)R GonFactory setting: not equippedBOTR254, R255, R256 (parallel connected) MiniMELF (SMD)R GoffFactory setting: not equippedBOTSetting Soft Turn-OffR Goff_SCDesignation Shape SettingR160, R161 (parallel connected) MiniMELF (SMD)R Goff_SCFactory setting: not equippedTOPR260, R261 (parallel connected) MiniMELF (SMD)R Goff_SCFactory setting: not equippedBOTOver Temperature Protection Circuit (OTP)The external error input SEC_TOP_ERR_IN on the secondary side (high potential) of the driver core is used for an over temperature protection circuit to place the gate driver into halt mode.Dimensioning OTPIf no temperature sensor is connected:- R172: 0 (factory setting: not equipped)- R175: not equip (factory setting: equipped)- R177: not equip (factory setting: not equipped)If a NTC temperature sensor is connected:1. Define an over temperature trip level according to the application.2. Calculate the nominal ohmic resistance value of the temperature sensor at the defined trip level according to the IGBT Moduleexplanation.3. The trip level on the adapter board is set withR172 (factory setting: not equipped)by using the calculated resistance value.4. R177 = 450kΩ2 / R NTC(@ -40°C)[kΩ] (factory setting: not equipped)5. R175: equip (factory setting: equipped)If a PTC temperature sensor is connected:1. Define an over temperature trip level according to the application.2. Calculate the nominal ohmic resistance value of the temperature sensor at the defined trip level according to the IGBT Moduleexplanation.3. The trip level on the adapter board is set withR177 = 450kΩ2 / R calculated_resistance[kΩ] (factory setting: not equipped)4. R172 = 0 (factory setting: not equipped)5. R175: equip (factory setting: equipped)Mounting NotesDriver Core Mounting1. Soldering of components (e.g. R Gon, R Goff, etc.) on adaptor board.2. Insert driver core into the box connector on adaptor board.3. The connecting leads between board and power module should be as short as possible (max. 20cm), the leads should be twisted.SchematicsSchematic I Adaptor BoardSchematic II AdaptorboardParts ListDISCLAIMERSEMIKRON reserves the right to make changes without further notice herein to improve reliability, function or design. Information furnished in this document is believed to be accurate and reliable. However, no representation or warranty is given and no liability is assumed with respect to the accuracy or use of such information. SEMIKRON does not assume any liability arising out of the application or use of any product or circuit described herein. Furthermore, this technical information may not be considered as an assurance of component characteristics. No warranty or guarantee expressed or implied is made regarding delivery, performance or suitability. This document supersedes and replaces all information previously supplied and may be superseded by updates without further notice.SEMIKRON products are not authorized for use in life support appliances and systems without the express written approval by SEMIKRON.。
30W功率放大器的制作
R14=330RC10-11=220uF 63V所有电阻为1/4W1%除非注明。
元件装配图（30K）：
印刷电路板图（22K）：
R7=10RC1=470nF 100V MKT Q5=BC212
R8=47KC2=1nF 100V MKTQ6=BC183
R9=560RC3=68pF ceramicQ7-8=MPSAO6
R10-11=8K2 C4-8=22nF 100V MKT Q9=TIP141
R12-15=120R C5-6-7=100nF 100V MKT Q10=TIP146
电路原理图（15K）：
元件列表：
R1=1KR16-17=270RD1=9.1V 0.4W zener
R2=47KR18=22R 1WD2-3=1N4148
R3=1K5R19=NCQ1-2=BC550C
R4-5=10KR20-21=0.39R 4WQ3=MPSA56
R6=5K6TR1=250R trimm网|100 | 2008-1-3 10:56:14 |双击自动滚屏|
很多时候我们需要一个功率不大但音质很好的功放且她必需由一些常用的元件组成，线路也不是很复杂。她的后级电路采用达林顿（复合晶体管），使用时必需加散热器，并要采用云母绝缘和导热硅脂。其基极电流由TR1调节，慢慢调节使R20、R21上的压降为12mV。最开始可能会有200mV电压，这是我们可以等一会而在仔细调节TR1直到其为12mV。然后等待15分钟，再次检查这点的电压是否稳定（在没有输入信号的情况下）。正常时（无信号输入）此级正确的电流为30mA。
Agilent HLD MD30 Helium Leak Detector说明书
Preciso, potente e facile da usareIl rilevatore mobile di perdite a elio con pompa a secco Agilent HLD MD30 è uno strumento preciso e allo stesso tempo robusto; vanta inoltre un'intuitiva interfaccia a schermo tattile e una struttura del menu che permette agli utilizzatori di accedere immediatamente a sofisticate capacità di rilevazione delle perdite. Le configurazioni applicative integrate riducono la durata dei cicli di test e possono essere memorizzate a garanzia della ripetibilità. Le quattro ruote permettono di spostarlo agevolmente nei punti desiderati. La pompa per vuoto primaria inclusa è la pompa scroll a secco TriScroll 620 Agilent, caratterizzata da una velocità di pompaggio di 30 m 3/ora.Il rilevatore HLD MD30 è stato progettato per facilitare al massimo l'ottimizzazione delle prestazioni di rilevazione delle perdite in qualsiasi applicazione, eliminando del tutto perdite di tempo o costosi errori.Caratteristiche –Sei diverse guide alla configurazione delle applicazioni aiutano a configurare correttamente lo strumento per ottenere le migliori prestazioni, garantendo l'impostazione di parametri adeguati per condurre test efficienti ed esaustivi.–L 'interfaccia a schermo tattile più ampia, più resistente e più reattiva ruota di 180° per offrire una visualizzazione perfetta.–Interfaccia utente più snella e intuitiva. L 'accesso immediato alle funzioni utilizzate con maggior frequenza e il menu a struttura piatta permettono di individuare rapidamente l'impostazione desiderata.–La procedura guidata di avvio aiuta l'utilizzatore a configurare lo strumento sin dalla prima accensione.–Funzionalità grafiche migliorate: zoom per l'ispezione ravvicinata dei dati, impostazioni con codice colore e registrazione dei grafici in base al tempo per pressione e tasso di perdita.–L 'ampia superficie di lavoro offre uno spazio più che sufficiente per appoggiare le parti da sottoporre a test, gli attrezzi e così via.–La procedura di spegnimento migliorata mantiene sotto vuoto lo spettrometro e protegge la pompa turbomolecolare.–Migliore manovrabilità per un più facile accesso a condotte e aree di servizio anguste in impianti per la fabbricazione di semiconduttori o altri ambienti di produzione. –La pompa per vuoto a secco elimina il rischio di contaminazione da olio dei sistemi e delle parti oggetto dei test.Rilevatore mobile di perdite a elio con pompa a secco Agilent HLD MD30Scheda datiLe informazioni fornite possono variare senza preavviso.© Agilent Technologies, Inc. 2018Stampato negli Stati Uniti, 27 febbraio 20185991-9060ITEo reimpostazione del tracciato sulla scala del tasso di perdita Le due schermate della pagina principale permettono di visualizzare lo stato del test o l'interpretazione dei dati a seconda delle specifiche esigenze.Facile navigazione tramite l'ampia interfaccia a schermo tattileVista dello stato del testVista graficaSpecifiche Informazioni per gli ordini Agilent dispone di una rete globale di personale tecnico e offre un'ampia scelta di opzioni di assistenza che: –proteggono l'investimento –incrementano al massimo la produttività –garantiscono la completa conformità degli strumenti alle normative di settore Per ulteriori informazioni, contatta il rappresentante Agilent o visita il sito /chem/HLD-leak-detection。
Fluke Ti30 Thermal Imager 产品说明书
To understand your full investment in a thermography program, here are some questions to consider:
.Product and performance Is the camera you are purchasing fully radiometric {i.e.measures temperature on every one of the available pixelsl? - The ability to measure absolute temperature is critically important to establishing an effective predictive maintenance program for electrical and mechanical equipment.
focusable, 61em (24 in) to infinity 'c or or selectable Gray, Ironbow or Rainbow Automatic,Semi-Automatic or Manual
LCD Backlight:
Bright, Dim.Off-Selectable
Detector
Detector Type: NETDlThermai Sensitivitvl: TIIenul
120 x 160 uncoaled local plane arrav 200 mK
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Temperature Range:
-10 to 250°C (14 to 482 "F)
Accuracy:
.Software Is there an additional cost for