HA9P5147-9中文资料

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1-J27系列印制电路连接器(1-13)

J27系列产品具有9、17、29、41、53、65、72、84、96、110线共10种规格。

根据环境等级，该系列产品可分为普通级、I级、Ⅱ级、GJB级、KJ级和宇航级。

其中普通级产品执行Q/450300RYL2301-90标准；I级产品执行Q/RY.J0102-91标准；Ⅱ级产品执行RY3.646.002-1JT标准；GJB级产品执行ZZR-Q/RY20024A-2011标准，KJ级产品执行Q/RY.J01101-2006标准；宇航级产品执行CASTPS05/003-2006标准。

用途：J27系列产品广泛适用于航天、航空等军用电子设备、计算机内印制电路板之间、印制电路板与电缆之间以及电缆与电缆之间的电连接。

特点：●体积小、重量轻、接触件密集度高，连接可靠性高。

●双曲形双片簧结构插孔保证接触可靠，接触电阻稳定，插拔寿命高，适应恶劣环境。

●定位导向装置具有36种方位组合，防同规格品种的误插合。

●本系列产品安装锁紧方式灵活，有垂直安装、水平安装、浮动安装以及螺纹锁紧等。

●插针、插孔为可拆卸式安装。

●插针、插孔基座材料耐高温（260℃），抗辐射（107Gy），符合航天真空使用要求，可与法国军标、美军标、IE C标准对应产品互换替代使用。

●GJB级产品符合GJB1438A-2006。

产品型谱：J27系列产品接触件数目具有9、17、29、41、53、65、72、84、96、110线共10种规格；连接器尾端端接形式分为直插印制板式、弯插印制板式、焊线式。

主要环境条件及技术指标J27系列产品类型环境等级 J27系列规格 Ⅱ类 I 类普通级名称TKXⅡBC TKXIBC TKXBC 直插头TKXⅡH TKXIH TKXH 焊线直插头TKLⅡH TKLIH TKLH 锁紧插头ZKXⅡBC ZKXIBC ZKXBC 直插座ZKXⅡH ZKXIH ZKXH 焊线直插座 ZKLⅡBC ZKLIBC ZKLBC 锁紧直插座 ZKLⅡH ZKLIH ZKLH 锁紧插座 ZKFⅡH ZKFIH ZKFH 浮动插座 TJXⅡBC TJXIBC TJXBC 直插头 TJXⅡH TJXIH TJXH 焊线直插头 TJLⅡH TJLIH TJLH 锁紧插头 TJⅡBW TJIBW TJBW 弯插头 TJⅡBW 1 TJIBW 1 TJBW 1 长弯插头 ZJXⅡBC ZJXIBC ZJXBC 直插座 ZJXⅡH ZJXIH ZJXH 焊线直插座 ZJLⅡBC ZJLIBC ZJLBC 锁紧直插座ZJLⅡBW ZJLIBW ZJLBW 锁紧弯插座 ZJLⅡBW 1 ZJLIBW 1 ZJLBW 1 锁紧长弯插座 ZJLⅡH ZJLIH ZJLH 锁紧插座J27-9 J27-17 J27-29 J27-41J27-53 J27-65 J27-72 J27-84J27-96 J27-110 ZJFⅡH ZJFIH ZJFH 浮动插座插头、插座相配直接形式及适用范围J27系列产品各型号规格的外形结构及安装开孔尺寸垂直安装（直脚插针）J27系列产品各型号规格的外形结构及安装开孔尺寸垂直安装（直脚插孔）J27系列产品各型号规格的外形结构及安装开孔尺寸水平安装（弯脚插针）J27系列产品各型号规格的外形结构及安装开孔尺寸垂直安装（焊线针、孔）J27系列产品各型号规格的外形结构及安装开孔尺寸垂直安装（焊线针、孔）J27系列产品各型号规格的外形结构及安装开孔尺寸垂直安装（焊线针、孔）J27系列产品各型号规格的外形结构及安装开孔尺寸浮动安装J27系列产品各型号规格的外形结构及安装开孔尺寸螺纹锁紧。

HM61104R7LFTR7中文资料

Outline Dimensions (mm)
Figure 1 Recommended Solder Pad Layout
Refer to Specifications table for ‘Ht’ dimension of each model.
Figure 2
Recommended Solder Pad Layout
Notes:
Inductance, Lo @1kHz, 0.1V µH ±10%
10 22 47 100 220 470 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1000 1200 1500 1800 2200 2700
Marking Code Std LF
05 06 07 08 09 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84
DCR Ω Typ.
0.12 0.26 0.50 1.0 2.2 5.0 0.065 0.07 0.09 0.1 0.11 0.13 0.15 0.18 0.2 0.25 0.28 0.35 0.45 0.5 0.65 0.75 0.95 1.1 1.35 1.6 2 2.4 2.7 3.6 4.3 5.6 6.5 7 9.2 10.5

HA9P2557-9资料

25
Differential Input Range
25
CMRR
Note 3
Full
Voltage Noise (Pin 10 = GND f = 1kHz
25
VX = VY = GND)
f = 100kHz
25
OUTPUT CHARACTERISTICS
Output Offset Current
25
25
Linearity Error
VX, VY = ±4V, Full Scale = 4V
25
VX, VY = ±3V, Full Scale = 3V
25
AC CHARACTERISTICS
Small Signal Bandwidth (-3dB) VY = 200mVP-P, VX = 4V
25
(RL = 50Ω)
VX = 200mVP-P, VY = 4V
25
Rise Time
VOUT = -80mV to +80mV, RL = 50Ω 25
Propagation Delay
RL = 50Ω
25
Feedthrough (Note 4)
f = 5MHz
25
THD+N
f = 10kHz, VY = 1VRMS, VX = 4V
Full
Full Scale Output Compliance
Full
Voltage
Full Scale Output Current
25
HA-2557-9
MIN
TYP
MAX
IOUT = (---V----X----+----–-----V----X-1----0--)--k-×---V--(--ΩV-----Y---+-----–----V----Y-------)

HMUB-DJ-1中文资料

3. Backplane
MU Backplane connector has a self-holding mechanism which does not transfer any force on the back panel when both side of connector assemblies are fully connected. Back panel side connectors can be removed or inserted even both sides are mated.
Part Simplex plug housing Spring Ferrule Simplex adapter housing Adapter metal fittings Simplified receptacle housing Simplified plug Backplane connector housing Split sleeve Dust cap
Please contact us if you have any requests. Hirose will offer excellent solutions to meet your requirements.
5
Terminators
元器件交易网
sProduct Specifications
K K
16 way
--K
5. Simplified plugs and Receptacles
Extremely small size (only 13.75mm Plug length). MU simplified plug is designed for equipments inside connection.

L6599_中文资料

L6599高压谐振控制器特征50%占空比，谐振半桥变频控制高精度振荡器高至500kHz 的工作频率序号编码器件编码封装包装L6599D SO-16N 管装 L6599DTR SO-16N 卷带 L6599NDIP16管装两级过流保护：变频和停机闭锁与PFC 控制器的接口自锁禁止输入轻载脉冲工作模式上电/断电顺序或欠压保护输入单调输出电压上升为非线性软启动整合了一个能够承受600V 以上电压的高压浮动结构和一个同步驱动式高压横向双扩散金属氧化物半导体(LDMOS)器件，节省了一个外部快速恢复自举二极管用低电压下拉方式为两个栅驱动器提供一个输出电流0.3A 和灌入电流0.8A的典型峰值电流处理能力。

DIP-16，SO-16N 两种封装特征液晶电视和等离子电视的电源台式电脑和初级服务器电信设备开关电源交直流适配器的开关电源框图目录1 驱动描述 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42 引脚设置 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52.1 引脚排列 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52.2 引脚功能说明 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 典型系统框图 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 电气数据 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74.1 极限参数. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74.2 热相关数据. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .85 电气参数. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 典型的电气性能. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .127 应用资料. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157.1 振荡器. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .167.2 工作在空载或非常轻的负载状态. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .187.3 软启动. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .217.4 电流检测，过流保护和过载保护 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237.5 闭锁关机. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .267.6 LINE检测功能. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .277.7 自举部分 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .287.8 应用实例. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .298 封装外形尺寸 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 修订记录 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 驱动描述L6599是一个用于谐振半桥拓扑电路的精确的双端控制器。

MT9P017 MI5140

MT9P017: 1/4-Inch 5Mp CMOS Digital Image Sensor FeaturesAptina Confidential and Proprietary Preliminary ‡PDF: 7874015293/Source: 8150004667Aptina reserves the right to change products or specifications without notice.MT9P017_DS -Rev.B Pub. 6/10 EN ©2009 Aptina Imaging Corporation All rights reserved.1/4-Inch 5Mp CMOS Digital Image SensorMT9P017 Data Sheet For the latest data sheet, refer to Aptina’s Web site: Features •DigitalClarity ® CMOS imaging technology •Low dark current •Simple two-wire serial interface •Auto black level calibration •Support for external LED or xenon flash •High frame rate preview mode with arbitrary down-size scaling from maximum resolution •Programmable controls: gain, horizontal and vertical blanking, auto black level offset correction, frame size/rate, exposure, left–right and top–bottom image reversal, window size, and panning •Data interfaces: parallel or CCP2-compliant sub-low-voltage differential signaling (sub-LVDS) or single/dual lanes serial mobile industry processor interface (MIPI)•On-die phase-locked loop (PLL) oscillator •Bayer pattern down-size scaler •Superior low-light performance •Integrated position and color-based shading correction •6.4Kb one-time programmable (OTP) memory for storing shading correction coefficients of three light sources and module information •Extended Flash duration that is up to start of frame readout •On-chip VCM driver Applications•Cellular phones •Digital still cameras •PC cameras •PDAs General Description The Aptina MT9P017 is a 1/4-inch CMOS active-pixeldigital image sensor with a pixel array of2592H x 1944V (2608H x 1960V including border pix-els). It incorporates sophisticated on-chip camerafunctions such as windowing, mirroring, column androw skip modes, and snapshot mode. It is programma-ble through a simple two-wire serial interface and hasvery low power consumption.Ordering Information Table 2: Available Part Numbers Table 1: Key Performance Parameters Parameter Value Optical format 1/4-inch (4:3)Active imager size 3.63mm(H)x2.72(V):4.54mm diagonal Active pixels 2592H x 1944V Pixel size 1.4μm x 1.4μm Chief ray angle 25.0°Color filter array RGB Bayer pattern Shutter type Electronic rolling shutter (ERS)Input clock frequency 6–27MHz Maximum data rate Parallel 84 Mpps at 84MHz PIXCLK CCP2650Mbps MIPI 840 Mbps per lane Frame rate Full resolution (2592 x1944)15fps 1080P 15fps(100% FOV)30fps(68% FOV, windowing)720P 30fps(90% FOV, skip2)45fps(90% FOV, bin2)60fps(45% FOV, windowing)VGA (640x480) 60 fps(100% FOV, skip2, bin2)115 fps(100% FOV, skip4)ADC resolution 10-bit, on-die Responsivity TBDV/lux-sec (550nm)Dynamic range TBDdB SNR MAX TBDdB Supply voltage Digital I/O 1.7–1.9V (1.8V nominal) or 2.4–3.1V (2.8V nominal)Digital Core 1.15-1.25(1.2V nominal)Analog 2.6–3.1V (2.8V nominal)Digital 1.8V 1.7–1.9V (1.8V nominal)Power Consump-tion Full resolution Parallel: TBDmW at TBD°C (TYP)CCP2: TBDmW at TBD°C (TYP)MIPI: TBDmW at TBD°C (TYP)Standby TBD μW at TBD°C (TYP) Package Bare die Operating temperature –30°C to +70°C (at junction)Part Number Description MT9P017D00STCC48AC1Bare dieTable of ContentsFeatures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Functional Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Pixel Array . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Operating Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Signal Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Output Data Format. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Serial Pixel Data Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Parallel Pixel Data Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Output Data Timing (Parallel Pixel Data Interface) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Two-Wire Serial Register Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Start Condition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Stop Condition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Data Transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Slave Address/Data Direction Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Message Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Acknowledge Bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 No-Acknowledge Bit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Typical Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Single READ from Random Location. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Single READ from Current Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Sequential READ, Start from Random Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Sequential READ, Start from Current Location. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Single WRITE to Random Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Sequential WRITE, Start at Random Location. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Programming Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 Output Size Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 Effect of Scaler on Legal Range of Output Sizes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 Output Data Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 Changing Registers while Streaming. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 Programming Restrictions when Using Global Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 Control of the Signal Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 Serial Register Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 Default Power-Up State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 CCP2 Serial Pixel Data Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 MIPI Serial Pixel Data Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 Parallel Pixel Data Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 Output Enable Control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 Configuration of the Pixel Data Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 System States. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 Power-On Reset Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 Soft Reset Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 Signal State During Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 General Purpose Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Streaming/Standby Control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Clocking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35PLL Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 Influence of ccp_data_format. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 Influence of ccp2_signalling_mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 Clock Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 Shading Correction (SC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 The Correction Function. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 One-Time Programmable Memory (OTPM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 Programming the OTPM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 Reading the OTPM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 Image Acquisition Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 Window Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 Pixel Border . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 Readout Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 Horizontal Mirror . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 Vertical Flip. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42 Subsampling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42 Programming Restrictions when Subsampling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44 Binning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46 Programming Restrictions when Binning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49 Scaler. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50 Frame Rate Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 Minimum Row Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52 Minimum Frame Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52 Integration Time. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52 Fine Integration Time Limits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53 fine_correction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53 Flash Timing Control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54 Analog Gain. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55 Using Per-color or Global Gain Control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55 SMIA Gain Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55 Aptina Gain Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56 Gain Code Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56 Sensor Core Digital Data Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57 Test Patterns . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57 Effect of Data Path Processing on Test Patterns. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58 Solid Color Test Pattern. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58 100% Color Bars Test Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58 Fade-to-gray Color Bars Test Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 PN9 Link Integrity Pattern. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60 Walking 1s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61 Test Cursors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61 Digital Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63 Pedestal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63 Digital Data Path. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64 Embedded Data Format and Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64 Timing Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65 Power-Up Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65 Power-Down Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66 Hard Standby . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67 Soft Standby and Soft Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68 Soft Standby . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68 Soft Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68Internal VCM Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68 Spectral Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70 Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .72 Two-Wire Serial Register Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .72 EXTCLK. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74 Parallel Pixel Data Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75 Serial Pixel Data Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76 Control Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77 Power-On Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78 Operating Voltages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .79 Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .81 SMIA and MIPI Specification Reference. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .81 Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .82List of FiguresFigure 1:Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Figure 2:Pixel Color Pattern Detail (Top Right Corner) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Figure 3:Typical Configuration: Parallel Pixel Data Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Figure 4:Typical Configuration: Serial CCP2 Pixel Data Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Figure 5:Typical Configuration: Serial Dual-Lane MIPI Pixel Data Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Figure 6:Spatial Illustration of Image Readout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Figure 7:Pixel Data Timing Example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Figure 8:Row Timing and FV/LV Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Figure 9:Single READ from Random Location. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Figure 10:Single READ from Current Location. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Figure 11:Sequential READ, Start from Random Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Figure 12:Sequential READ, Start from Current Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Figure 13:Single WRITE to Random Location. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Figure 14:Sequential WRITE, Start at Random Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Figure 15:Effect of Limiter on the Data Path. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 Figure 16:Timing of Data Path. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 Figure 17:MT9P017 System States. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 Figure 18:MT9P017 Profile 1/2 Clocking Structure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 Figure 19:Effect of horizontal_mirror on Readout Order. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 Figure 20:Effect of vertical_flip on Readout Order. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42 Figure 21:Effect of x_odd_inc = 3 on Readout Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42 Figure 22:Effect of x_odd_inc = 7 on Readout Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43 Figure 23:Pixel Readout (No Subsampling). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43 Figure 24:Pixel Readout (x_odd_inc = 3, y_odd_inc = 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43 Figure 25:Pixel Readout (x_odd_inc = 7, y_odd_inc = 7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44 Figure 26:Pixel Readout (x_odd_inc = 3, y_odd_inc = 1, x_bin = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47 Figure 27:Pixel Readout (x_odd_inc = 3, y_odd_inc = 3, xy_bin = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47 Figure 28:Pixel Readout (x_odd_inc = 7, y_odd_inc = 7, xy_bin = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48 Figure 29:Xenon Flash Enabled. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54 Figure 30:LED Flash Enabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54 Figure 31:100 Percent Color Bars Test Pattern. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 Figure 32:Fade-to-Gray Color Bars Test Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60 Figure 33:Walking 1s 10-bit Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61 Figure 34:Walking 1s 8-bit Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61 Figure 35:Test Cursor Behavior with image_orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62 Figure 36:Data Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64 Figure 37:Power-Up Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65 Figure 38:Power-Down Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66 Figure 39:Hard Standby. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67 Figure 40:Soft Standby and Soft Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68 Figure 41:VCM Driver Typical Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69 Figure 42:Quantum Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70 Figure 43:Chief Ray Angle (CRA) vs. Image Height . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71 Figure 44:Two-Wire Serial Bus Timing Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .72 Figure 45:Parallel Data Output Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73 Figure 46:Internal Power-On Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78。

连新检针机九点测试套件说明书

附：日本国PL 检针法对部分产品的检针要求标准产品名称检测标准文胸、衬衫、袜子、童装、小玩具等小件车缝制品ØFe0.8-1.2mm(Fe 为铁球)羊毛衫、西服、茄克、羽绒服、牛仔服等中型制品ØFe1.0-1.2mm(Fe 为铁球)床单、毛巾被、床罩、窗帘等宽幅车缝制品ØFe1.2-2.0mm(Fe 为铁球)较大玩具、塑胶制品、鞋类、手袋ØFe1.2-2.0mm(Fe 为铁球)以上未列产品项目标准请查询日本检针法列表检针机灵敏度标准表示方法是以一定直径Ø的铁球为标准参照物，而非几级来说明。

标准检测卡及标准检测卡架图片:本检针机测试卡套件说明书由东莞市连之新金属检测设备有限公司制作及提供，版权所有，未经许可禁止复制或拷贝转发！公司信息：东莞市连之新金属检测设备有限公司电话：*************传真：*************地址：东莞市寮步镇横坑工业区金湖S001-003号网址：邮箱：***************连新®检针机九点测试套件说明书连新®标准检针机测试卡套件系严格按照国际环保组织制订的标准而制作，用来确定隧道式（又名：输送式、龙门式）检针机的可用灵敏度。

这个校准套件包含4个标准测试卡（分别为含有Fe0.8mm、Fe1.0mm、Fe1.2mm、Fe1.5mm 直径铁球的测试卡）。

这些检针机测试卡，适合最常见的检针标准要求，适用于美国、欧洲、日本等主流检针要求标准。

此外检针测试卡标准套件还包括一个校准卡架(可自行根据检针机通道高度尺寸制作，原则上只要该校准卡架能通过检针机灵敏度和高度限制即可)，该校准卡架设计高度有两种：9cm（适用10cm~15cm）、12cm（适用15cm~20cm），有若干缺口(槽位)放置和固定标准测试卡，用来进行检针机灵敏度九点测试校准。

(例如有效探测通道高度120mm 的连新®牌输送带式检针机JZQ-630K 型可选用测试卡架高度为9mm。

HA17393中文资料

Output Sink Current Iosink (mA)
HA17903, HA17393 Series
Output Sink Current vs. Ambient Temperature 20
15
VCC = 36 V
15 V
5V 10
2V
5
0
–20
0
25
50
75
Ambient Temperature Ta (°C)
Ratings
Item
HA17903 HA17903 HA17903 HA17903 HA17903 HA17393 HA17393
Symbol PS
PSJ
FP
FPJ
FPK
F
Unit
Supply
VCC
36
36
36
36
36
36
36
V
voltage
Dfferential
VIN(diff)
VCC
VCC
VCC
Input offset current
Common mode input voltage*3
VIO I IB I IO VCM+
—
2.0 5.0 mV
—
25
—
3
3.5 —
250 nA
50
nA
—
V
IIN (+) or IIN (–) | IIN (+) – IIN (–) |
Supply current
board. Derate by 7.14mW/°C above that temperature.
3. Short circuit between the output and VCC will be a cause to destory the circuit. The maximum output current is about 20mA for any supply voltage.

17HA产品规格书-中文

20
100 10
50
0
0
0
1000
2000
3000
4000
Pulse rate [pps]
0 100 200 300 400 500 600
Speed [r/min]
• 单极性
17HA7602
฽ណ్͇ḬӬ౜ব়ึ᯵Ү٧ ᯵Ү٧‫ۋ‬ՁḬ AMA MSU3040M ᯵ҮഴयḬஞ൥
0.65A(ࢎϘ) 12V 50
40
0.65A(ࢎϘ) 24V 6
30
4
20
2 10
0
0
0
2000
4000
6000
8000
Pulse rate [pps]
0 200 400 600 800 1000 1200
Speed [r/min]
17HA0601N
฽ណ్͇ḬӬ౜ব়ึ᯵Ү٧ ᯵Ү٧‫ۋ‬ՁḬ AMA MSU3040M ᯵ҮഴयḬஞ൥
静力矩 mNm oz-in
35 4.96
额定电流 A
0.65
60 8.50
0.43
170 24.09
0.87
220 31.18
0.5
每相电阻 ohm 6.6
8 3.1 20
每相电感 mH 2.9
定位力矩
转子惯量
mNm oz-in g.cm2 oz-in2
5
0.71 20 0.08
4
Байду номын сангаас
8
1.13 20 0.11
0.87A(ࢎϘ) 12V 300 250 200
0.87A(ࢎϘ) 24V 40 30
150
20
100 10

K-9可选配件，微维克斯硬度试验机剪子订单号型号及描述说明书

G
steel ball 1471N(150kgf) beryllium copper, phosphor bronze
H
1/8”
588.4N(60kgf) Bearing metal
E
diameter 980.7N(100kgf)
K
steel ball 1471N(150kgf)
L
1/4”
588.4N(60kgf) Plastics, lead
50x50mm travel stage
Dimensions: 4.92x4.92”(125x125mm) Minimum reading: 0.01mm 810-012
Clamping devices (Vises)
Vise Max. opening: 1.77”(45mm) Standard for the MH series. 810-016
Indenters
Order No. 19BAA061 19BAA058 19BAA062 19BAA059 19BAA060
Type Knoop Indenter Vickers Indenter Knoop Indenter Vickers Indenter Vickers Indenter
Model H, HM Standard Series H, HM Standard Series MVK-H2, H3, HM114 MVK-H2, H3, HM114 HV, AVK-C Series
Micro-Vickers/Vickers Hardness Testing Machine
Test Blocks
Order No. 64BAA173 64BAA174 64BAA175 64BAA176 64BAA177 64BAA178 64BAA179 64BAA180 64BAA181 64BAA182 64BAA183 64BAA184 64BAA185 64BAA186 64BAA187 64BAA188 64BAA189 64BAA190 64BAA191 64BAA192 64BAA193 64BAA194 64BAA195 64BAA196 64BAA197 64BAA198 64BAA199 64BAA200 64BAA201 64BAA202 64BAA203 64BAA204 64BAA205 64BAA206 64BAA207 64BAA208 64BAA209 64BAA210 64BAA211 64BAA212 64BAA213 64BAA214 64BAA215 64BAA216 64BAA217 64BAA218 64BAA219 64BAA220

HA-5147中文资料

Operating Conditions
Temperature Range HA-5147-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC HA-5147-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 75oC HA-5147-9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
Electrical Speciﬁcations VSUPPLY = ±15V, CL ≤ 50pF, RS ≤ 100Ω
PARAMETER
TEST CONDITIONS
TEMP. (oC)
MIN
TYP
MAX
UNITS
INPUT CHARACTERISTICS
Offset Voltage
25
-
30
100
Thermal Information
Thermal Resistance (Typical, Note 2)
θJA (oC/W) θJC (oC/W)
CERDIP Package. . . . . . . . . . . . . . . . . 135
50
SOIC Package . . . . . . . . . . . . . . . . . . . 158
Using the HA-5147 allows designers to minimize errors while maximizing speed and bandwidth in applications requiring gains greater than ten.

常用功率管参数

有刷/无刷电调常用功率管参数大全(若以上无你所需型号请留言)08年8月21日更新A2700 N型管(贴片)耐压：30V电流：9A导通电阻：7.3mΩSI4336 N型管(贴片)耐压：30V电流：22A导通电阻：4.2mΩSI4404 N型管(贴片)耐压：30V电流：17A导通电阻：8mΩSI4410 N型管(贴片)耐压：30V电流：10A导通电阻：14mΩSI4420 N型管(贴片)耐压：30V电流：10A导通电阻：10mΩSI4812 N型管(贴片)耐压：30V电流：7.3A导通电阻：28mΩSI9410 N型管(贴片)耐压：30V电流：6.9A导通电阻：50mΩIRF7313 N型管(贴片)耐压：30V电流：6A导通电阻：29mΩIRF7413 N型管(贴片) 耐压：30V电流：12A导通电阻：18mΩIRF7477 N型管(贴片) 耐压：30V电流：11A导通电阻：20mΩIRF7805Z N型管(贴片) 耐压：30V电流：16A导通电阻：6.8mΩIRF7811 N型管(贴片) 耐压：30V电流：11A导通电阻：12mΩIRF7831 N型管(贴片) 耐压：30V电流：16A导通电阻：0.004ΩIRF7832 N型管(贴片) 耐压：30V电流：20A导通电阻：4mΩIRF8113 N型管(贴片)耐压：30V电流：17A导通电阻：5.6mΩTPC8003 N型管(贴片) 耐压：30V电流：12A导通电阻：6mΩFDS6688 N型管(贴片) 耐压：30V电流：16A导通电阻：0.006ΩFDD6688 TO-252贴片耐压：30V电流：84A导通电阻：5mΩA2716 P型管(贴片)耐压：30V电流：7A导通电阻：11.3mΩSI4405 P型管(贴片) 耐压：30V电流：17A导通电阻：7.5mΩSI4425 P型管(贴片)耐压：30V电流：9A导通电阻：19mΩSI4435 P型管(贴片) 耐压：30V电流：8A导通电阻：20mΩSI4463 P型管(贴片)耐压：20V电流：12.3A导通电阻：16mΩSI9435 P型管(贴片) 耐压：30V电流：5.3A导通电阻：50mΩIRF7424 P型管(贴片)电流：8.8A导通电阻：22mΩSTM4439A P型管(贴片) 耐压：30V电流：14A导通电阻：18mΩFDS6679 P型管(贴片) 耐压：30V电流：13A导通电阻：9mΩBUZ111S N型管(直插) 耐压：55V电流：80A导通电阻：8mΩ5N05 N型管(直插)耐压：50V电流：75A导通电阻：0.0095Ω6N60 N型管(直插)耐压：600V电流：5.5A导通电阻：0.75Ω50N03L N型管(直插)耐压：25V电流：28A导通电阻：21mΩ60N06 N型管(直插)耐压：60V电流：60A导通电阻：14mΩBTS110 N型管(直插) 耐压：100V导通电阻：200mΩBTS120 N型管(直插)耐压：100V电流：19A导通电阻：100mΩIRF15 0 N型管(铁壳非直插) 耐压：100V电流：40A导通电阻：55mΩIRF1405 N型管(直插)耐压：55V电流：131A导通电阻：5.3mΩIRF2804 N型管(直插)耐压：40V电流：75A导通电阻：2mΩIRF3205 N型管(直插)耐压：55V电流：110A导通电阻：8mΩIRF3703 N型管(直插)耐压：30V电流：210A导通电阻：2.3mΩIRL3803 N型管(直插)耐压：30V电流：140A导通电阻：6mΩ。

SNJ5407FK中文资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)JM38510/00803BCA ACTIVE CDIP J141None Call TI Level-NC-NC-NC JM38510/00803BDA ACTIVE CFP W141None Call TI Level-NC-NC-NC SN5407J ACTIVE CDIP J141None Call TI Level-NC-NC-NC SN5417J ACTIVE CDIP J141None Call TI Level-NC-NC-NCSN7407D ACTIVE SOIC D1450Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7407DR ACTIVE SOIC D142500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7407J OBSOLETE CDIP J14None Call TI Call TISN7407N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN7407N3OBSOLETE PDIP N14None Call TI Call TISN7407NSR ACTIVE SO NS142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7417D ACTIVE SOIC D1450Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7417DR ACTIVE SOIC D142500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7417N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN7417N3OBSOLETE PDIP N14None Call TI Call TISN7417NSR ACTIVE SO NS142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSNJ5407FK ACTIVE LCCC FK201None Call TI Level-NC-NC-NCSNJ5407J ACTIVE CDIP J141None Call TI Level-NC-NC-NCSNJ5407W ACTIVE CFP W141None Call TI Level-NC-NC-NCSNJ5417J ACTIVE CDIP J141None Call TI Level-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-May not be currently available-please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead(Pb-Free).Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean"Pb-Free"and in addition,uses package materials that do not contain halogens, including bromine(Br)or antimony(Sb)above0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to takereasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TIto Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

ELM9927HA资料

■GENERAL DESCRIPTIONELM99xxxA series is CMOS voltage regulator providing large current. It consists of devices including reference voltage source, error amplifier, low resistance output transistor, short-circuit protection circuit,output voltage setting resistor, chip-enable circuit. Output voltage is fixed internally with high accuracy.ELM99xxxA provides excellent characteristics, such as small input-output voltage difference due to low resistance output transistor, high load stability due to high gain error amplifier.The chip-enable function is available in three selections, no-chip enable function, active-low (“L” active)and active-high (“H” active).The package is SOT-89-3 or SOT-89-5. SOT-89-5 is used for chip enable version.■FEATURES・Maximum output current: 300mA (Intenal current limiter operates in case load current exceeds 300mA.)・High accuracy of output voltage: ±2.0%・Small input-output voltage differential : TYP . 140mV (ELM9930xA IOUT=40mA)・Low stand-by current consumption : TYP . 0.1μA (ELM99xx3A)・High load stability : TYP . 5mV (1mA ≦Iout ≦100mA)・High input stability : TYP . 0.15%/V (ELM9930xA IOUT=40mA)・Output voltage range: 2.0V ～6.0V ( 0.1V steps )・Short-circuit current limiter : TYP . 70mA (VOUT=0V)・Chip-enable pin available: “L”active ELM99xx2A, “H”active ELM99xx3A ■APPLICATION・Cellular telephones・Palmtops・Laptop and notebook computers ・cameras and video recorders ・Reference voltage sources ・Battery-operated devices・PCMCIA cards1.ELM99xx 1ASOT-89Pin No.Pin Name 1VSS 2VIN 3VOUT2.ELM99xx2A3.ELM99xx3ASOT-89-5Pin No.Pin Name 1VSS 2VIN 3VOUT 4NC 5CE 123( TOP VIEW )SOT-89123( TOP VIEW )54SOT-89-5ELM99xxxA LOW SATURATION VOLTAGE REGULATORSOT-89-5Pin No.Pin Name 1VSS 2VIN 3VOUT 4NC 5CE■PIN CONFIGURATION123( TOP VIEW )54SOT-89-5■SELECTION GUIDEELM99 x x x A↑↑↑↑a b c d ■MARKINGSOT-89①②③④ELM99xx1A①: Represents the integer digit of the Output Voltage ②③ : Represents the assembly lot numberA～Z repeated (I,O,X excepted)④ : Represents the assembly lot number0～9 repeated①②③④SOT-89-5ELM99xx2A①: Represents the integer digit of the Output Voltage②③ : Represents the assembly lot numberA ～Z repeated (I,O,X excepted)④ : Represents the assembly lot number0～9 repeatedELM99xx3A①: Represents the integer digit of the Output Voltage②: Represents the decimal digit of the Output Voltage③ : Represents the assembly lot number A ～Z repeated (I,O,X excepted)④ : Represents the assembly lot number0～9 repeated■BLOCK DIAGRAM■STANDARD CIRCUITELM99xx1A ELM99xx2A, ELM99xx3A ELM99xx1A* Output current must not exceed power dissipation specified in Maximum Absolute Ratings.■ELECTRICAL CHARACTERISTICS■TYPICAL PERFORMANCE CHARACTERISTICSVin(V)V C E H (V )ELM99XX2A VCEH - VinVin(V)V C E L (V )ELM99XX2A VCEL - VinVin(V)V C E H (V )ELM99XX3A VCEH - VinVin(V)V C E L (V )ELM99XX3A VCEL - Vin●　ELM9927xATop(℃)V o u t (V )Vout - TopVin(V)Vo u t (V )Vout - VinVin(V)V o u t (V )Vout - VinIout(mA)V o u t (V )Vout - IoutIout(mA)V d i f (V )Vdif - Iout1011021031041050102030405060Frequency(Hz)R i p p l e R e j e c t i o n (d B )Ripple RejectionCo=1.0μF3456781020304050Vin(V)I S S (μA )Iss - VinTop=25℃-200204060801020304050Top(℃)I s s (μA )Iss - TopVin=3.7VTime (μs)I n p u t ,O u t p u t V o l t a g e (V )Input Transient ResponseTime (μs)O u t p u t V o l t a g e (V )Load Transient ResponseTime (μs)O u t p u t V o l t a g e (V )Load Transient ResponseTime (μs)I n p u t ,O u t p u t V o l t a g e (V )Input Transient Response●　ELM9930xAVin(V)V o u t (V )Vout - VinVin(V)V o u t (V )Vout - VinIout(mA)V o u t (V )Vout - IoutIout(mA)V d i f (V )Vdif - IoutTop(℃)V o u t (V )Vout - Top1011021031041050102030405060Frequency(Hz)R i p p l e R e j e c t i o n (d B )Ripple RejectionCo=1.0μF345678010********Vin(V)I S S (μA )Iss - VinTop=25℃-200204060801020304050Top(℃)I s s (μA )Iss - TopVin=4.0VTime(μs)I n p u t ,O u t p u t V o l t a g e (V )Input Transient ResponseTime(μs)I n p u t ,O u t p u t V o l t a g e (V )Input Transient ResponseTime(μs)O u t p u t V o l t a g e (V )Load Transient ResponseTime(μs)O u t p u t V o l t a g e (V )Load Transient Response●　ELM9933xATop(℃)V o u t (V )Vout - Top1011021031041050102030405060Frequency(Hz)R i p p l e R e j e c t i o n (d B )Ripple RejectionCo=1.0μFIout(mA)V d i f (V )Vdif - IoutVin(V)V o u t (V )Vout - VinIout(mA)V o u t (V)Vout - IoutVin(V)V o u t (V )Vout - Vin-200204060801020304050Top(℃)I s s (μA )Iss - TopVin=4.3V456781020304050Vin(V)I S S (μA )Iss - VinTop=25℃Time(μs)I n p u t ,O u t p u t V o l t a g e (V )Input Transient ResponseTime(μs)I n p u t ,O u t p u t V o l t a g e (V )Input Transient ResponseTime(μs)O u t p u t V o l t a g e (V )Load Transient ResponseTime(μs)O u t p u t V o l t a g e (V )Load Transient Response●　ELM9950xAVin(V)V o u t (V )Vout - VinVin(V)V o u t (V )Vout - VinTop(℃)V o u t (V )Vout - TopIout(mA)V o u t (V )Vout - IoutIout(mA)V d i f (V )Vdif - Iout1011021031041050102030405060Frequency(Hz)R i p p l e R e j e c t i o n (d B )Ripple RejectionCo=1.0μF5678010********Vin(V)I S S (μA )Iss - VinTop=25℃-200204060801020304050Top(℃)I s s (μA )Iss - TopVin=6.0VTime (μs)I n p u t ,O u t p u t V o l t a g e (V )Input Transient ResponseTime (μs)I n p u t ,O u t p u t V o l t a g e (V )Input Transient ResponseTime (μs)O u t p u t V o l t a g e (V )Load Transient ResponseTime (μs)O u t p u t V o l t a g e (V )Load Transient Response。

爱同9PX UPS 9PX8KIPM31 产品说明书

Eaton 9PX8KIPM31Eaton 9PX 3:1 Power Module, 8 kVA, 7.2 kW, Input: Hardwired,Outputs: Hardwired, Rack/tower, 3UEaton 9PX UPS9PX8KIPM3174317204012170 cm44 cm13 cm23 kg 2 yearCE Marked TUV IEC/EN 62040-2 IEC/EN 62040-1 CEEACProduct Name Catalog Number UPC Product Length/Depth Product Height Product Width Product Weight Warranty Compliances CertificationsView runtime graph No battery 0YesHardwired Online/Double-conversion 7.2 kW 8 kVASine wave 400V0.9230V default (200/208/220/230/240/250V)200/208/220/230/240/250 V +/- 1%250/60 Hz 2Hardwired/fixed connection 400V default (380/400/415V)305-480 V 50/60 HzRuntime graph Battery management Battery replacement Battery quantity Extended battery capability Receptacle TopologyWattage VA rating Output waveform Voltage Output power factor Output nominal voltageOutput voltage rangeVoltage distortion output (linear load) - max Output frequency Feed type Input connectionInput nominal voltage Input voltage range Nominal frequency CommunicationABM & Temperature compensated charging method (user selectable)Automatic battery test Deep discharge protection Automatic recognition of external battery units USB port (HID compliant)Serial port (RS232)Mini terminal block for remote On/Off Mini-terminal block for remote power off Dry contacts (4 outputs, relay, DB9)40-70 Hz >.99One slot for optional communication card NoNoEaton Intelligent Power Manager, Eaton Intelligent Power Protector Multilingual graphical LCD display OtherYes3000 m Online: 1472<48 dB at 1 meter 0-95% non-condensing 0° to 40°C (32° to 104°F)Rack/tower 3UInput frequency range Input power factor Expansion slotsEthernet interface Includes network card Software compatibilityUser interfaceType of interface Potential free switch contact Altitude BTU Rating Noise level Relative humidity Temperature range Special featuresForm factor Rack size Construction typeDouble conversion topology Constantly monitors power conditions and regulates voltage and frequency Provides more real power (watts) to protect more equipment with a 0.9 power factorEnergy efficient, reduce energy and cooling costs Internal bypass allows service continuity in case of UPS faultNext-generation graphical LCD displayMeter energy consumption (at the UPS level)Eaton Corporation plc Eaton House30 Pembroke Road Dublin 4, Ireland © 2023 Eaton. All Rights Reserved. Eaton is a registered trademark.All other trademarks areproperty of their respective owners./socialmediaFree standing modelNo 9531YesNoYesRack mounting kit Efficiency Package contents Phase (input)Phase (output)Internal bypass Hot swap power Auto shutdown function Power Module USB cable Serial cable(2) Supports for tower mountingSafety instructions Quickstart guide。

FPGA可编程逻辑器件芯片XCVU9P-2FLGA2577I中文规格书

On power-up, or on reset, the PHY is configured to operate in SGMII mode with PHY address 0b00111 using the settings shown in Table 1-44. These settings can be over written using software commands passed over the MDIO interface.Table 1-45 details the FPGA U1 to U58 M88E111 Ethernet PHY connections.Ethernet PHY Status LEDs[Figure 1-2, callout 19]The Ethernet PHY status LEDs are integrated into the metal frame of the P3 RJ-45connector. These LEDs are visible on the left edge of the VCU110 board when it is installedTable 1-44:Board Connections for PHY Configuration Pins PinBit[2]Bit[1]Bit[0]DescriptionPin to Constant MappingPinBit[2:0]CFG0PHYADR[2]PHYADR[1]PHYADR[0]111PHYAddr 00111. Do not advertise the PAUSE bit.VCC2V5111CFG1ENA_PAUSE PHYADR[4]PHYADR[3]000LED_LINK10110CFG2ANEG[3]ANEG[2]ANEG[1]111Auto-Neg en, advertise all caps; prefer slave. Auto crossover enabled. 125 CLK option disabled.LED_LINK100101CFG3ANEG[0]ENA_XC DIS_125111LED_LINK1000100CFG4HWCFG_MD[2]HWCFG_MD[1]HWCFG_MD[0]100SGMII to Cu mode. Fiber/copper auto-detect disabled. Sleep move disabled.LED_DUPLEX 011CFG5DIS_FCDIS_SLEEPHWCFG_MD[3]110LED_RX 010CFG6SEL_BDT INT_POL 75/50 OHM 010MDC/MDIO selected. Active-Low interrupt. 50Ω SerDes option.LED_TX 001GND000Table 1-45:FPGA U1 to Ethernet PHY U58 ConnectionsFPGA (U1) PinNet NameI/O StandardM88E111 PHY U58PinNameBB21PHY_MDIO LVCMOS18M1MDIO_SDA BC18PHY_MDC LVCMOS18L3MDC_SCL BC21PHY_INT LVCMOS18L1INT_B BB18PHY_RESETLVCMOS18K3RESET_BNotes:1.Ethernet PHY U58 signals are level-shifted (U45) to 1.8V for interface to FPGA U1 bank 84.Table 1-46:FPGA U1 to CP2105GM U34 ConnectionsFPGA U1 Pin Function Direction I/O Standard Schematic Net Name CP2105GM Device (U34) Pin Function DirectionAR20Receive Input LVCMOS18USB_UART_TX21Transmitdata OutputAT20Transmit Output LVCMOS18USB_UART_RX20Receivedata InputAR19Clear tosend Output LVCMOS18USB_UART_CTS18Clear tosend InputAU19Requestto send Input LVCMOS18USB_UART_RTS19Requestto send OutputA15 FMC_HPC0_DP4_M2C_N (1)BC1 B16FMC_HPC0_DP6_M2C_P (1)BA2A18 FMC_HPC0_DP5_M2C_P (1)BB4 B17FMC_HPC0_DP6_M2C_N (1)BA1A19 FMC_HPC0_DP5_M2C_N (1)BB3 B20FMC_HPC0_GBTCLK1_M2C_P (2)(1)AK13A22 FMC_HPC0_DP1_C2M_P (1)BE11B21FMC_HPC0_GBTCLK1_M2C_N (2)(1)AK12A23 FMC_HPC0_DP1_C2M_N (1)BE10B24NA A26 FMC_HPC0_DP2_C2M_P (1)BE7 B25NA A27 FMC_HPC0_DP2_C2M_N (1)BE6 B28NA A30 FMC_HPC0_DP3_C2M_P (1)BD9 B29NAA31 FMC_HPC0_DP3_C2M_N (1)BD8 B32FMC_HPC0_DP7_C2M_P (1)AY9A34 FMC_HPC0_DP4_C2M_P (1)BC7 B33FMC_HPC0_DP7_C2M_N (1)AY8A35 FMC_HPC0_DP4_C2M_N (1)BC6 B36FMC_HPC0_DP6_C2M_P (1)BA7A38 FMC_HPC0_DP5_C2M_P (1)BB9 B37FMC_HPC0_DP6_C2M_N(1)BA6A39 FMC_HPC0_DP5_C2M_N(1)BB8B40NANANotes:1.No I/O standards are associated with MGT connections.2.Series capacitor coupled.J22 FMC HPC0 PinSchematic Net Name I/O Standard U1FPGA PinJ22 FMCHPC0 PinSchematic Net NameI/OStandard U1FPGAPinTable 1-57:J22 VITA 57.1 FMC HPC0 Sections C and D to FPGA U1 Connections J22 FMC HPC0 PinSchematic Net NameI/O Standard U1FPGA PinJ22 FMCHPC 0 PinSchematic Net NameI/O StandardU1 FPGA PinC2 FMC_HPC0_DP0_C2M_P (1)BF9 D1 VADJ_1V8_PGOOD (3)LVCMOS18AP18C3 FMC_HPC0_DP0_C2M_N (1)BF8D4 FMC_HPC0_GBTCLK0_M2C_P (2)(1)AL11C6 FMC_HPC0_DP0_M2C_P (1)BF14D5 FMC_HPC0_GBTCLK0_M2C_N (2)(1)AL10C7 FMC_HPC0_DP0_M2C_N (1)BF13D8 FMC_HPC0_LA01_CC_P LVDS AY32C10FMC_HPC0_LA06_P LVDS BD30D9 FMC_HPC0_LA01_CC_N LVDS BA32C11FMC_HPC0_LA06_N LVDS BE30D11 FMC_HPC0_LA05_P LVDS BC29C14FMC_HPC0_LA10_P LVDS AR32D12 FMC_HPC0_LA05_N LVDS BC30C15FMC_HPC0_LA10_NLVDS AT32D14 FMC_HPC0_LA09_P LVDS BC31C18NA NA D15 FMC_HPC0_LA09_NLVDS BD31C19NA NA D17NA NA C22NA NA D18NA NA C23NA NA D20NA NA C26NANAD21NANAC27NANA D23NA NA C30FMC_HPC0_IIC_SCL U80.9D24NA NA C31FMC_HPC0_IIC_SDA U80.8D26NA NA C34GA0 = 0 = GND D27NANAC35VCC12_SW D29 FMC_HPC0_TCK_BUF U19.17C37VCC12_SW D30FPGA_TDO_FMC_TDI_BUF U19.21C39UTIL_3V3D31FMC_HPC0_TDO_HPC1_TDIU132.1D32 VCC3V3D33 FMC_HPC0_TMS_BUFU19.20D34NAD35 GA1 = 0 = GNDD36UTIL_3V3 D38UTIL_3V3 D40UTIL_3V3Notes:1.No I/O standards are associated with MGT connections.2.Series capacitor coupled.3.VADJ_1V8_PGOOD level-shifted from 3.3V to 1.8V at TXS0108E U44.J22 FMC HPC0 PinSchematic Net NameI/O Standard U1FPGA PinJ22 FMCHPC 0 PinSchematicNet NameI/OStandardU1 FPGA Pin。

FPGA可编程逻辑器件芯片XCVU9P-FLGA2577中文规格书

Chapter 2: Overview•MSI•MSI-X•PM•AER (only PCIe 3.x core)Others•Only supports the INCR burst type. Other types result in a Slave Illegal Burst (SIB) interrupt.•No memory type support (AxCACHE)•No protection type support (AxPROT)•No lock type support (AxLOCK)•No non-contiguous byte enable support (WSTRB)•For 7 series Gen2 IP, PCIe access from the Host system must be limited to 1DW (4 Bytes) transaction only.Note: Both AXI Bypass and Register access are limited by this restriction.PCIe to DMA Bypass Master•Only issues the INCR burst type•Only issues the data, non-secure, and unprivileged protection type•For 7 series Gen2 IP, limited to 1DW (4 Bytes) transaction onlyUser Interrupt in MSI-X ModeUsers need to program a different vector number for each user interrupts in the IRQ Block User Vector Number register to generate acks for all user interrupts. This generates acks for all user interrupts when there are simultaneous interrupts. When all vector numbers are pointing to the same MSI-X entry, there is only one ack.Licensing and OrderingThis Xilinx® IP module is provided at no additional cost with the Xilinx Vivado® Design Suiteunder the terms of the Xilinx End User License. Information about this and other Xilinx IPmodules is available at the Xilinx Intellectual Property page. For information about pricing andavailability of other Xilinx IP modules and tools, contact your local Xilinx sales representative.For more information, visit the DMA Subsystem for PCI Express product page.PG195 (v4.1) April 29, 2021DMA/Bridge Subsystem for PCIe v4.1Chapter 3: Product SpecificationTable 4: 64-Bit BARsPCIe BARs SelectionBAR0 (64-bit)BAR2 (64-bit)BAR4 (64-bit) During IPCustomizationDefault DMAPCIe to AXI Lite MasterPCIe to AXI4-Lite Master DMAenabledPCIe to AXI4-Lite Master DMA PCIe to DMA Bypass PCIe to AXI Lite Master andPCIe to DMA BypassenabledPCIe to DMA BypassDMA PCIe to DMA BypassenabledDifferent combinations of BARs can be selected. The tables above list only 32-bit selections and 64-bit selections for all BARs as an example. You can select different combinations of BARsbased on your requirements.Related InformationPCIe BARs TabH2C ChannelThe previous tables represents PCIe to AXI4-Lite Master, DMA, and PCIe to DMA Bypass for 32-bit and 64-bit BAR selections. Each space can be individually selected for 32-bits or 64-bits BAR.The number of H2C channels is configured in the Vivado® Integrated Design Environment (IDE).The H2C channel handles DMA transfers from the host to the card. It is responsible for splitting read requests based on maximum read request size, and available internal resources. The DMA channel maintains a maximum number of outstanding requests based on the RNUM_RIDS, which is the number of outstanding H2C channel request ID parameter. Each split, if any, of a readrequest consumes an additional read request entry. A request is outstanding after the DMAchannel has issued the read to the PCIe RQ block to when it receives confirmation that the write has completed on the user interface in-order. After a transfer is complete, the DMA channelissues a writeback or interrupt to inform the host.The H2C channel also splits transaction on both its read and write interfaces. On the readinterface to the host, transactions are split to meet the maximum read request size configured,and based on available Data FIFO space. Data FIFO space is allocated at the time of the readrequest to ensure space for the read completion. The PCIe RC block returns completion data to the allocated Data Buffer locations. T o minimize latency, upon receipt of any completion data, the H2C channel begins issuing write requests to the user interface. It also breaks the write requests into maximum payload size. On an AXI4-Stream user interface, this splitting is transparent.PG195 (v4.1) April 29, 2021DMA/Bridge Subsystem for PCIe v4.1。

哈飞赛马全车维修手册第7章发动机冷却系

第七章发动机冷却系第一节概述维护标准值见表7-1。

冷却液容量见表7-2。

密封剂见表7-3。

专用工具见表7-4。

表7-1表7-2第二节故障检查1.故障现象分类见表7-5。

2.故障现象分类检查步骤检查步骤1见表7-6。

表7-6检查步骤2见表7-7。

第三节车上维护1.散热器盖开阀压力的检查标准值：74~103kPa 极限值：64 kPa2.冷却液的检查（1）检查冷却液壶内的冷却液量是否在“F”和“L”之间；（2）检查冷却液中是否混有机油。

3.冷却液的更换（1）按顺序拆下散热器放水螺塞、散热器盖。

放出散热器、暖风机及发动机内的冷却液；（2）拆下气缸体的放水阀，排出水套中的冷却液（见图7-1）；图7-1（3）拆下冷却壶，排出冷却液；（4）冷却液排出后，从散热器盖注水，清洗冷却液的管路；（5）在气缸体放水阀的螺纹上涂上规定的密封剂，按规定力矩拧紧（见图7-2）；密封剂：LT5699在涂用新胶之前，必须将旧胶清除干净。

拧紧力矩：40±5N·m图7-2（6）确认散热器的放水螺塞已拧紧；（7）安装冷却液壶；（8）冷却液加注到散热器口的位置，向冷却液壶中加注冷却液到“F”线；冷却液：Shell Freeze Guard 冷却液总容量：7.0L（9）装好散热器盖；（10）起动发动机暖机至节温器打开。

（11）发动机高速空转几次后停机；（12）在发动机冷态时，拆下散热器，再加冷却液至散热器加水口，冷却液壶内也要加至“F”线。

图7-3第四节节温器1.节温器的拆卸与安装节温器拆卸前、安装后的工作冷却液的排出与注入（参照本章有关章节）。

拆卸、安装发动机罩（参照本手册有关章节）。

拆卸、安装空气滤清器（参照本手册有关章节）。

蓄电池及蓄电池托架的拆卸、安装。

拆卸步骤见图7-4。

图7-41-散热器出水管的连接2-进水管的接头3-节温器拆卸操作要领：散热器出水管的拆卸。

散热器出水管的管夹上画上对准标记之后拆下。

安装操作要领：1）节温器的安装密封圈装在节温器上，注意不要扭曲和损伤，节温器的放气阀要处于上面时进行安装（见图7-5）。

9009P技术要求规格书

API 5UE
根据美国石油协会API的推荐性实践RP 5UE计算缺陷深度的定量方法
修正斜探头圆管检测时的深度和水平距离
曲面修正
修正模式：内弧/外弧
裂纹测高功能
根据斜探头端点反射法计算焊接裂纹高度
闸门扩展功能
将闸门内回波放大到整个回波区域
DAC功能
用于制作、设置和应用DAC曲线
AVG功能
用于制作、设置和应用AVG曲线
序号
名称
技术要求
1
数字式超声波探伤仪
性能特点：
性能强劲：高压方波发射、穿透力强，满足大型铸、锻件探伤的需求
小巧轻便：整机（含电池）重量不大于1.3Kg，高空、野外作业轻松自如
操作简易：按键少，定义明确，实现单手握持操作
防尘防水：按IP65防护标准设计，适应复杂的工业探伤环境
超低功耗：标配锂聚合物电池，连续工作时间不小于7小时
截图功能
将仪器屏幕存为图片并输出到U盘中
动态回放
内部/U盘，内部约3分钟的回波记录功能，U盘可无限记录
转存功能
通过USB接口把仪器内部数据集转存到U盘中
闸门
闸门方式：off/进波/失波/测量
500组数据集，包括仪器设置、探伤状态和回波图形等
存储
支持从U盘导入探伤数据
使闸门内回波幅度自动调节到指定幅度
8、专用测厚功能模块，具有多种测厚模式
9、RF（射频）回波功能，对于薄壁材料测量或学术研究和定性分析有很大帮助
10、端点反射法测量焊缝裂纹高度
11、内置AWS D1.1/D1.5、API 5UE评价标准
12、通过回波扩展功能可将闸门内回波区域放大到整个屏幕显示
13、自动增益控制AGC，配合峰值回波、图像冻结功能，快速确定缺陷最高波，探伤更高效