SN74CB3Q3244中文资料

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关于74HC244芯片的中文资料

最小额定最大
电源电压Vcc 54 4.5 5 5.5 V
74 4.75 5 5.25
输入高电平电ViH 2 V
输入低电平电ViL 54 0.7 V
74 0.8
输出高电平电流IOH 54 -12 mA
74 -15
输出低电平电流IOL 54 12 mA
74 24
求关于74HC244线接收器(3S,两组控制)
简要说明:
244为三态输出的八组缓冲器和总线驱动器,其主要电器特性的典型值如下(不同厂家具体值有差别):
型号 tPLH tphl PD
54LS241/74LS241 12ns 12ns 110mW
引出端符号:
1A1~1A4,2A1~2A4 输入端
/1G, /2G 三态允许端(低电平有效)
1Y1~1Y4,2Y1~2Y4 输出端
逻辑图:
双列直插封装
极限值:
电源电压 …………………………………………. 7V
输入电压 …………………………………………. 5.5V
tPHZ输出由高到高阻态禁止时间 Vcc=5V CL=5pF
RL=90 Ω 18 ns
tPLZ输出由低到高阻态禁止时间 25 ns
静态特性（TA为工作环境温度范围）
参数测试条件【1】 LS244 单位
最小最大
VIK输入嵌位电压 Vcc=最小，Iik=-18mA -1.5 V
输出高阻态时高电平电压 …………………………. 5.5V
工作环境温度
54XXX …………………………………. -55~125℃
74XXX …………………………………. 0~70℃

SN74CB3T3306中文资料

PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)SN74CB3T3306DCTR ACTIVE SM8DCT 83000TBD CU SNPB Level-1-235C-UNLIM SN74CB3T3306DCURACTIVEUS8DCU83000Pb-Free (RoHS)CU NIPDAULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS)or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing orchemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM30-Mar-2005Addendum-Page 1元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SN74CB3Q16244中文资料

FEATURES1234567891011121314151617181920212223244847464544434241403938373635343332313029282726251OE1B11B2GND1B31B4V CC2B12B2GND2B32B43B13B2GND3B33B4V CC4B14B2GND4B34B44OE2OE1A11A2GND1A31A4V CC2A12A2GND2A32A43A13A2GND3A33A4V CC4A14A2GND4A34A43OEDGG, DGV, OR DL PACKAGE(TOP VIEW)SN74CB3Q1624416-BIT FET BUS SWITCH2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCHSCDS168–MAY2004–REVISED MARCH2005•High-Bandwidth Data Path(up to500MHz(1))•5-V Tolerant I/Os With Device Powered Up orPowered Down•Low and Flat ON-State Resistance(r on)Characteristics Over Operating Range(ron=5ΩTyp)•Rail-to-Rail Switching on Data I/O Ports–0-to5-V Switching With3.3-V VCC–0-to3.3-V Switching With2.5-V VCC•Bidirectional Data Flow With Near-ZeroPropagation Delay•Low Input/Output Capacitance MinimizesLoading and Signal Distortion(Cio(OFF)=4pF Typ)•Fast Switching Frequency(f OE=20MHz Max)•Data and Control Inputs Provide UndershootClamp Diodes•Low Power Consumption(I CC=1mA Typ)•V CC Operating Range From2.3V to3.6V•Data I/Os Support0-to5-V Signaling Levels(0.8V,1.2V,1.5V,1.8V,2.5V,3.3V,5V)•Control Inputs Can Be Driven by TTL or5-V/3.3-V CMOS Outputs•I off Supports Partial-Power-Down ModeOperation•Latch-Up Performance Exceeds100mA PerJESD78,Class II•ESD Performance Tested Per JESD22–2000-V Human-Body Model(A114-B,Class II)–1000-V Charged-Device Model(C101)•Supports Both Digital and AnalogApplications:PCI Interface,Differential SignalInterface,Memory Interleaving,Bus Isolation,Low-Distortion Signal Gating(1)For additional information regarding the performance charac-teristics of the CB3Q family,refer to the TI application report,CBT-C,CB3T,and CB3Q Signal-Switch Families,literaturenumber SCDA008.Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.PRODUCTION DATA information is current as of publication date.Copyright©2004–2005,Texas Instruments Incorporated Products conform to specifications per the terms of the TexasInstruments standard warranty.Production processing does not元器件交易网DESCRIPTION/ORDERING INFORMATIONSN74CB3Q1624416-BIT FET BUS SWITCH2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCHSCDS168–MAY 2004–REVISED MARCH 2005The SN74CB3Q16244is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of the pass transistor,providing a low and flat ON-state resistance (r on ).The low and flat ON-state resistance allows for minimal propagation delay and supports rail-to-rail switching on the data input/output (I/O)ports.The device also features low data I/O capacitance to minimize capacitive loading and signal distortion on the data bus.Specifically designed to support high-bandwidth applications,the SN74CB3Q16244provides an optimized interface solution ideally suited for broadband communications,networking,and data-intensive computing systems.The SN74CB3Q16244is organized as four 4-bit bus switches with separate output-enable (1OE,2OE,3OE,4OE)inputs.It can be used as four 4-bit bus switches,two 8-bit bus switches,or one 16-bit bus switch.When OE is low,the associated 4-bit bus switch is ON,and the A port is connected to the B port,allowing bidirectional data flow between ports.When OE is high,the associated 4-bit bus switch is OFF,and a high-impedance state exists between the A and B ports.This device is fully specified for partial-power-down applications using I off .The I off circuitry prevents damaging current backflow through the device when it is powered down.The device has isolation during power off.To ensure the high-impedance state during power up or power down,OE should be tied to V CC through a pullup resistor;the minimum value of the resistor is determined by the current-sinking capability of the driver.ORDERING INFORMATIONT APACKAGE (1)ORDERABLE PART NUMBER TOP-SIDE MARKING Tube SN74CB3Q16244DL SSOP –DLCB3Q16244Tape and reel SN74CB3Q16244DLR –40°C to 85°CTube SN74CB3Q16244DGG TSSOP –DGG CB3Q16244Tape and reel SN74CB3Q16244DGGR TVSOP –DGVTape and reelSN74CB3Q16244DGVRBW244(1)Package drawings,standard packing quantities,thermal data,symbolization,and PCB design guidelines are available at /sc/package.FUNCTION TABLE(EACH 4-BIT BUS SWITCH)INPUT INPUT/OUTPUTFUNCTION OE AL B A port =B port HZDisconnect2元器件交易网LOGIC DIAGRAM (POSITIVE LOGIC)1A11B11A41OE1B43B13OE3B42A12B12A42OE2B44A14B14A44OE4B4SIMPLIFIED SCHEMATIC,EACH FET SWITCH (SW)AEN (1)B(1)EN is the internal enable signal applied to the switch.SN74CB3Q1624416-BIT FET BUS SWITCH2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCHSCDS168–MAY 2004–REVISED MARCH 20053元器件交易网Absolute Maximum Ratings (1)Recommended Operating Conditions (1)SN74CB3Q1624416-BIT FET BUS SWITCH2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCHSCDS168–MAY 2004–REVISED MARCH 2005over operating free-air temperature range (unless otherwise noted)MINMAX UNIT V CC Supply voltage range (2)–0.5 4.6V V IN Control input voltage range (2)(3)–0.57V V I/O Switch I/O voltage range (2)(3)(4)–0.57V I IK Control input clamp current V IN <0–50mA I I/OK I/O port clamp current V I/O <0–50mA I I/OON-state switch current (5)±64mA Continuous current through V CC or GND±100mADGG package70θJA Package thermal impedance (6)DGV package 58°C/W DL package63T stg Storage temperature range–65150°C (1)Stresses beyond those listed under "absolute maximum ratings"may cause permanent damage to the device.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)All voltages are with respect to ground,unless otherwise specified.(3)The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.(4)V I and V O are used to denote specific conditions for V I/O .(5)I I and I O are used to denote specific conditions for I I/O .(6)The package thermal impedance is calculated in accordance with JESD 51-7.MINMAX UNIT V CC Supply voltage2.33.6V V CC =2.3V to 2.7V 1.7 5.5V IH High-level control input voltage V V CC =2.7V to 3.6V 2 5.5V CC =2.3V to 2.7V 00.7V IL Low-level control input voltage V V CC =2.7V to 3.6V00.8V I/O Data input/output voltage 0 5.5V T A Operating free-air temperature–4085°C(1)All unused control inputs of the device must be held at V CC or GND to ensure proper device operation.Refer to the TI application report,Implications of Slow or Floating CMOS Inputs ,literature number SCBA004.4元器件交易网Electrical Characteristics(1) Switching CharacteristicsSN74CB3Q1624416-BIT FET BUS SWITCH 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCHSCDS168–MAY2004–REVISED MARCH2005over recommended operating free-air temperature range(unless otherwise noted)PARAMETER TEST CONDITIONS MIN TYP(2)MAX UNIT V IK V CC=3.6V,I I=–18mA–1.8V I IN Control inputs V CC=3.6V,V IN=0to5.5V±1µAV O=0to5.5V,Switch OFF,I OZ(3)V CC=3.6V,±1µAV I=0,V IN=V CC or GNDI off V CC=0,V O=0to5.5V,V I=01µAI I/O=0,I CC V CC=3.6V,V IN=V CC or GND12mASwitch ON or OFF,∆I CC(4)Control inputs V CC=3.6V,One input at3V,Other inputs at V CC or GND30µAPer control A and B ports open,mA/ I CCD(5)V CC=3.6V,0.150.25input Control input switching at50%duty cycle MHz C in Control inputs V CC=3.3V,V IN=5.5V,3.3V,or0 3.55pFSwitch OFF,C io(OFF)V CC=3.3V,V I/O=5.5V,3.3V,or046pFV IN=V CC or GND,Switch ON,C io(ON)V CC=3.3V,V I/O=5.5V,3.3V,or01013pFV IN=V CC or GND,V I=0,I O=30mA68V CC=2.3V,TYP at V CC=2.5V VI =1.7V,I O=–15mA510r on(6)ΩV I=0,I O=30mA68V CC=3VV I=2.4V,I O=–15mA59(1)V IN and I IN refer to control inputs.V I,V O,I I,and I O refer to data pins.(2)All typical values are at V CC=3.3V(unless otherwise noted),T A=25°C.(3)For I/O ports,the parameter I OZ includes the input leakage current.(4)This is the increase in supply current for each input that is at the specified TTL voltage level,rather than V CC or GND.(5)This parameter specifies the dynamic power-supply current associated with the operating frequency of a single control input(see Figure2).(6)Measured by the voltage drop between the A and B terminals at the indicated current through the switch.ON-state resistance isdetermined by the lower of the voltages of the two(A or B)terminals.over recommended operating free-air temperature range(unless otherwise noted)(see Figure3)V CC=2.5V V CC=3.3VFROM TO±0.2V±0.3V PARAMETER UNIT(INPUT)(OUTPUT)MIN MAX MIN MAXf OE(1)OE A or B1020MHzt pd(2)A or B B or A0.180.3nst en OE A or B 1.58 1.57nst dis OE A or B1817ns(1)Maximum switching frequency for control input(V O>V CC,V I=5V,R L≥1MΩ,C L=0)(2)The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified loadcapacitance,when driven by an ideal voltage source(zero output impedance).5元器件交易网02468101214160.00.51.01.52.02.53.03.54.04.55.0V I − Vr o n – O N -S t a t e R e s i s t a n c e – W024*******2468101214161820OE Switching Frequency − MHzC C I − m ASN74CB3Q1624416-BIT FET BUS SWITCH2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCHSCDS168–MAY 2004–REVISED MARCH 2005Figure 1.Typical r on vs V IFigure 2.Typical I CC vs OE Switching Frequency6元器件交易网PARAMETER MEASUREMENT INFORMATIONV OH V OLV CC Open Output Waveform 1S1 at 2 × V CC (see Note B)Output Waveform 2S1 at GND (see Note B)0 V0 VV CCV CCVOLTAGE WAVEFORMSPROPAGATION DELAY TIMES (t pd(s))VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMESNOTES: A.C L includes probe and jig capacitance.B.Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z O = 50 Ω, t r ≤ 2.5 ns, t f ≤ 2.5 ns.D.The outputs are measured one at a time, with one transition per measurement.E.t PLZ and t PHZ are the same as t dis .F.t PZL and t PZH are the same as t en .G.t PLH and t PHL are the same as t pd(s). The t pd propagation delay is the calculated RC time constant of the typical ON-state resistanceof the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).H.All parameters and waveforms are not applicable to all devices.TEST R L S1V ∆C L 2.5 V ± 0.2 V 3.3 V ± 0.3 V V CC V It PHZ /t PZHt PLZ /t PZL t pd(s) 2.5 V ± 0.2 V 3.3 V ± 0.3 V 2.5 V ± 0.2 V 3.3 V ± 0.3 VOpen Open 2 × V CC 2 × V CC GND GND500 Ω500 Ω500 Ω500 Ω500 Ω500 ΩV CC or GND V CC or GNDGND GND V CC V CC 30 pF 50 pF 30 pF 50 pF 30 pF 50 pF0.15 V 0.3 V 0.15 V 0.3 V(V IN SN74CB3Q1624416-BIT FET BUS SWITCH2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCHSCDS168–MAY 2004–REVISED MARCH 2005Figure 3.Test Circuit and Voltage Waveforms7元器件交易网PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74CB3Q16244DGG PREVIEW TSSOP DGG 4840Pb-Free (RoHS)CU NIPDAU Level-1-250C-UNLIM SN74CB3Q16244DGGR ACTIVE TSSOP DGG 482000Pb-Free (RoHS)CU NIPDAU Level-1-250C-UNLIM SN74CB3Q16244DGVR ACTIVE TVSOP DGV 482000Pb-Free (RoHS)CU NIPDAU Level-1-250C-UNLIM SN74CB3Q16244DL ACTIVE SSOP DL 4825TBD CU NIPDAU Level-1-235C-UNLIM SN74CB3Q16244DLRACTIVESSOPDL481000TBDCU NIPDAULevel-1-235C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS)or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it isprovided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM30-Mar-2005Addendum-Page 1元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SN74LVC32A中文资料

1 1B 2 1Y 3 2A 4 2B 5 2Y 6
7
14 13 4B 12 4A 11 4Y 10 3B 9 3A
8
3 2 1 20 19
1Y 4
18 4A
NC 5
17 NC
2A 6
16 4Y
NC 7
15 NC
2B 8
14 3B
9 10 11 12 13
3A
3Y
NC
GND
2Y
3Y
GND
NC - No internal connection
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCC is provided in the recommended operating conditions table. (4) The package thermal impedance is calculated in accordance with JESD 51-7.
Copyright © 1993–2005, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.

常见数字逻辑器件中文注解.pdf

常见数字逻辑器件中文注解型号器件名称厂牌SN7400四2输入端与非门SN7401四2输入端与非门(OC)SN7402四2输入端或非门TISN7403四2输入端与非门(OC)TISN7404六反相器TISN7405六反相器(OC)TISN7406六高压输出反相器(OC,30V)TISN7407六高压输出缓冲,驱动器(OC,30V)TISN7408四2输入端与门TISN7409四2输入端与门(OC)TISN7410三3输入端与非门TISN7412三3输入端与非门(OC)TISN7413双4输入端与非门TISN7414六反相器TISN7416六高压输出反相缓冲/驱动器TISN7417六高压输出缓冲/驱动器(OC,15V)TISN7420双4输入端与非门TISN7422双4输入端与非门(OC)TISN7423可扩展双4输入端或非门TISN7425双4输入端或非门TISN7426四2输入端高压输出与非缓冲器TISN7427三3输入端或非门TISN7428四2输入端或非缓冲器TISN74308输入端与非门TISN7432四2输入端或门74系列：：74LS00TTL2输入端四与非门74LS01TTL集电极开路2输入端四与非门74LS02TTL2输入端四或非门74LS03TTL集电极开路2输入端四与非门74LS04TTL六反相器74LS05TTL集电极开路六反相器74LS06TTL集电极开路六反相高压驱动器74LS07TTL集电极开路六正相高压驱动器74LS08TTL2输入端四与门74LS09TTL集电极开路2输入端四与门74LS10TTL3输入端3与非门74LS107TTL带清除主从双J-K触发器74LS109TTL带预置清除正触发双J-K触发器74LS11TTL3输入端3与门74LS112TTL带预置清除负触发双J-K触发器74LS12TTL开路输出3输入端三与非门74LS121TTL单稳态多谐振荡器74LS122TTL可再触发单稳态多谐振荡器74LS123TTL双可再触发单稳态多谐振荡器74LS125TTL三态输出高有效四总线缓冲门74LS126TTL三态输出低有效四总线缓冲门74LS13TTL4输入端双与非施密特触发器74LS132TTL2输入端四与非施密特触发器74LS133TTL13输入端与非门74LS136TTL四异或门74LS138TTL3-8线译码器/复工器74LS139TTL双2-4线译码器/复工器74LS14TTL六反相施密特触发器74LS145TTL BCD—十进制译码/驱动器74LS15TTL开路输出3输入端三与门74LS150TTL16选1数据选择/多路开关74LS151TTL8选1数据选择器74LS153TTL双4选1数据选择器74LS154TTL4线—16线译码器74LS155TTL图腾柱输出译码器/分配器74LS156TTL开路输出译码器/分配器74LS157TTL同相输出四2选1数据选择器74LS158TTL反相输出四2选1数据选择器74LS16TTL开路输出六反相缓冲/驱动器74LS160TTL可预置BCD异步清除计数器74LS161TTL可予制四位二进制异步清除计数器74LS162TTL可预置BCD同步清除计数器74LS163TTL可予制四位二进制同步清除计数器74LS164TTL八位串行入/并行输出移位寄存器74LS165TTL八位并行入/串行输出移位寄存器74LS166TTL八位并入/串出移位寄存器74LS169TTL二进制四位加/减同步计数器74LS17TTL开路输出六同相缓冲/驱动器74LS170TTL开路输出4×4寄存器堆74LS173TTL三态输出四位D型寄存器74LS174TTL带公共时钟和复位六D触发器74LS175TTL带公共时钟和复位四D触发器74LS180TTL9位奇数/偶数发生器/校验器74LS181TTL算术逻辑单元/函数发生器74LS185TTL二进制—BCD代码转换器74LS190TTL BCD同步加/减计数器74LS191TTL二进制同步可逆计数器74LS192TTL可预置BCD双时钟可逆计数器74LS193TTL可预置四位二进制双时钟可逆计数器74LS194TTL四位双向通用移位寄存器74LS195TTL四位并行通道移位寄存器74LS196TTL十进制/二-十进制可预置计数锁存器74LS197TTL二进制可预置锁存器/计数器74LS20TTL4输入端双与非门74LS21TTL4输入端双与门74LS22TTL开路输出4输入端双与非门74LS221TTL双/单稳态多谐振荡器74LS240TTL八反相三态缓冲器/线驱动器74LS241TTL八同相三态缓冲器/线驱动器74LS243TTL四同相三态总线收发器74LS244TTL八同相三态缓冲器/线驱动器74LS245TTL八同相三态总线收发器74LS247TTL BCD—7段15V输出译码/驱动器74LS248TTL BCD—7段译码/升压输出驱动器74LS249TTL BCD—7段译码/开路输出驱动器74LS251TTL三态输出8选1数据选择器/复工器74LS253TTL三态输出双4选1数据选择器/复工器74LS256TTL双四位可寻址锁存器74LS257TTL三态原码四2选1数据选择器/复工器74LS258TTL三态反码四2选1数据选择器/复工器74LS259TTL八位可寻址锁存器/3-8线译码器74LS26TTL2输入端高压接口四与非门74LS260TTL5输入端双或非门74LS266TTL2输入端四异或非门74LS27TTL3输入端三或非门74LS273TTL带公共时钟复位八D触发器74LS279TTL四图腾柱输出S-R锁存器74LS28TTL2输入端四或非门缓冲器74LS283TTL4位二进制全加器74LS290TTL二/五分频十进制计数器74LS293TTL二/八分频四位二进制计数器74LS295TTL四位双向通用移位寄存器74LS298TTL四2输入多路带存贮开关74LS299TTL三态输出八位通用移位寄存器74LS30TTL8输入端与非门74LS32TTL2输入端四或门74LS322TTL带符号扩展端八位移位寄存器74LS323TTL三态输出八位双向移位/存贮寄存器74LS33TTL开路输出2输入端四或非缓冲器74LS347TTL BCD—7段译码器/驱动器74LS352TTL双4选1数据选择器/复工器74LS353TTL三态输出双4选1数据选择器/复工器74LS365TTL门使能输入三态输出六同相线驱动器74LS365TTL门使能输入三态输出六同相线驱动器74LS366TTL门使能输入三态输出六反相线驱动器74LS367TTL4/2线使能输入三态六同相线驱动器74LS368TTL4/2线使能输入三态六反相线驱动器74LS37TTL开路输出2输入端四与非缓冲器74LS373TTL三态同相八D锁存器74LS374TTL三态反相八D锁存器74LS375TTL4位双稳态锁存器74LS377TTL单边输出公共使能八D锁存器74LS378TTL单边输出公共使能六D锁存器74LS379TTL双边输出公共使能四D锁存器74LS38TTL开路输出2输入端四与非缓冲器74LS380TTL多功能八进制寄存器74LS39TTL开路输出2输入端四与非缓冲器74LS390TTL双十进制计数器74LS393TTL双四位二进制计数器74LS40TTL4输入端双与非缓冲器74LS42TTL BCD—十进制代码转换器74LS352TTL双4选1数据选择器/复工器74LS353TTL三态输出双4选1数据选择器/复工器74LS365TTL门使能输入三态输出六同相线驱动器74LS366TTL门使能输入三态输出六反相线驱动器74LS367TTL4/2线使能输入三态六同相线驱动器74LS368TTL4/2线使能输入三态六反相线驱动器74LS37TTL开路输出2输入端四与非缓冲器74LS373TTL三态同相八D锁存器74LS374TTL三态反相八D锁存器74LS375TTL4位双稳态锁存器74LS377TTL单边输出公共使能八D锁存器74LS378TTL单边输出公共使能六D锁存器74LS379TTL双边输出公共使能四D锁存器74LS38TTL开路输出2输入端四与非缓冲器74LS380TTL多功能八进制寄存器74LS39TTL开路输出2输入端四与非缓冲器74LS390TTL双十进制计数器74LS393TTL双四位二进制计数器74LS40TTL4输入端双与非缓冲器74LS42TTL BCD—十进制代码转换器74LS447TTL BCD—7段译码器/驱动器74LS45TTL BCD—十进制代码转换/驱动器74LS450TTL16:1多路转接复用器多工器74LS451TTL双8:1多路转接复用器多工器74LS453TTL四4:1多路转接复用器多工器74LS46TTL BCD—7段低有效译码/驱动器74LS460TTL十位比较器74LS461TTL八进制计数器74LS465TTL三态同相2与使能端八总线缓冲器74LS466TTL三态反相2与使能八总线缓冲器74LS467TTL三态同相2使能端八总线缓冲器74LS468TTL三态反相2使能端八总线缓冲器74LS469TTL八位双向计数器74LS47TTL BCD—7段高有效译码/驱动器74LS48TTL BCD—7段译码器/内部上拉输出驱动74LS490TTL双十进制计数器74LS491TTL十位计数器74LS498TTL八进制移位寄存器74LS50TTL2-3/2-2输入端双与或非门74LS502TTL八位逐次逼近寄存器74LS503TTL八位逐次逼近寄存器74LS51TTL2-3/2-2输入端双与或非门74LS533TTL三态反相八D锁存器74LS534TTL三态反相八D锁存器74LS54TTL四路输入与或非门74LS540TTL八位三态反相输出总线缓冲器74LS55TTL4输入端二路输入与或非门74LS563TTL八位三态反相输出触发器74LS564TTL八位三态反相输出D触发器74LS573TTL八位三态输出触发器74LS574TTL八位三态输出D触发器74LS645TTL三态输出八同相总线传送接收器74LS670TTL三态输出4×4寄存器堆74LS73TTL带清除负触发双J-K触发器74LS74TTL带置位复位正触发双D触发器74LS76TTL带预置清除双J-K触发器74LS83TTL四位二进制快速进位全加器74LS85TTL四位数字比较器74LS86TTL2输入端四异或门74LS90TTL可二/五分频十进制计数器74LS93TTL可二/八分频二进制计数器74LS95TTL四位并行输入\\输出移位寄存器74LS97TTL6位同步二进制乘法器CD系列：：CD4000双3输入端或非门+单非门TICD4001四2输入端或非门HIT/NSC/TI/GOLCD4002双4输入端或非门NSCCD400618位串入/串出移位寄存器NSCCD4007双互补对加反相器NSCCD40084位超前进位全加器NSCCD4009六反相缓冲/变换器NSCCD4010六同相缓冲/变换器NSCCD4011四2输入端与非门HIT/TICD4012双4输入端与非门NSCCD4013双主-从D型触发器FSC/NSC/TOSCD40148位串入/并入-串出移位寄存器NSCCD4015双4位串入/并出移位寄存器TICD4016四传输门FSC/TICD4017十进制计数/分配器FSC/TI/MOTCD4018可预制1/N计数器NSC/MOTCD4019四与或选择器PHICD402014级串行二进制计数/分频器FSCCD402108位串入/并入-串出移位寄存器PHI/NSCCD4022八进制计数/分配器NSC/MOTCD4023三3输入端与非门NSC/MOT/TICD40247级二进制串行计数/分频器NSC/MOT/TICD4025三3输入端或非门NSC/MOT/TICD4026十进制计数/7段译码器NSC/MOT/TICD4027双J-K触发器NSC/MOT/TICD4028BCD码十进制译码器NSC/MOT/TICD4029可预置可逆计数器NSC/MOT/TICD4030四异或门NSC/MOT/TI/GOLCD403164位串入/串出移位存储器NSC/MOT/TICD4032三串行加法器NSC/TICD4033十进制计数/7段译码器NSC/TICD40348位通用总线寄存器NSC/MOT/TICD40354位并入/串入-并出/串出移位寄存NSC/MOT/TI CD4038三串行加法器NSC/TICD404012级二进制串行计数/分频器NSC/MOT/TICD4041四同相/反相缓冲器NSC/MOT/TICD4042四锁存D型触发器NSC/MOT/TICD40434三态R-S锁存触发器("1"触发)NSC/MOT/TI CD4044四三态R-S锁存触发器("0"触发)NSC/MOT/TI CD4046锁相环NSC/MOT/TI/PHICD4047无稳态/单稳态多谐振荡器NSC/MOT/TICD40484输入端可扩展多功能门NSC/HIT/TICD4049六反相缓冲/变换器NSC/HIT/TICD4050六同相缓冲/变换器NSC/MOT/TICD4051八选一模拟开关NSC/MOT/TICD4052双4选1模拟开关NSC/MOT/TICD4053三组二路模拟开关NSC/MOT/TICD4054液晶显示驱动器NSC/HIT/TICD4055BCD-7段译码/液晶驱动器NSC/HIT/TI CD4056液晶显示驱动器NSC/HIT/TICD4059“N”分频计数器NSC/TICD406014级二进制串行计数/分频器NSC/TI/MOT CD4063四位数字比较器NSC/HIT/TICD4066四传输门NSC/TI/MOTCD406716选1模拟开关NSC/TICD4068八输入端与非门/与门NSC/HIT/TICD4069六反相器NSC/HIT/TICD4070四异或门NSC/HIT/TICD4071四2输入端或门NSC/TICD4072双4输入端或门NSC/TICD4073三3输入端与门NSC/TICD4075三3输入端或门NSC/TICD4076四D寄存器CD4077四2输入端异或非门HITCD40788输入端或非门/或门CD4081四2输入端与门NSC/HIT/TICD4082双4输入端与门NSC/HIT/TICD4085双2路2输入端与或非门CD4086四2输入端可扩展与或非门CD4089二进制比例乘法器CD4093四2输入端施密特触发器NSC/MOT/ST CD40948位移位存储总线寄存器NSC/TI/PHICD40953输入端J-K触发器CD40963输入端J-K触发器CD4097双路八选一模拟开关CD4098双单稳态触发器NSC/MOT/TICD40998位可寻址锁存器NSC/MOT/STCD4010032位左/右移位寄存器CD401019位奇偶较验器CD401028位可预置同步BCD减法计数器CD401038位可预置同步二进制减法计数器CD401044位双向移位寄存器CD40105先入先出FI-FD寄存器CD40106六施密特触发器NSC\\TICD40107双2输入端与非缓冲/驱动器HAR\\TICD401084字×4位多通道寄存器CD40109四低-高电平位移器CD40110十进制加/减,计数,锁存,译码驱动STCD4014710-4线编码器NSC\\MOTCD40160可预置BCD加计数器NSC\\MOTCD40161可预置4位二进制加计数器NSC\\MOTCD40162BCD加法计数器NSC\\MOTCD401634位二进制同步计数器NSC\\MOTCD40174六锁存D型触发器NSC\\TI\\MOTCD40175四D型触发器NSC\\TI\\MOTCD401814位算术逻辑单元/函数发生器CD40182超前位发生器CD40192可预置BCD加/减计数器(双时钟)NSC\\TI CD40193可预置4位二进制加/减计数器NSC\\TICD401944位并入/串入-并出/串出移位寄存NSC\\MOT CD401954位并入/串入-并出/串出移位寄存NSC\\MOT CD402084×4多端口寄存器CD45014输入端双与门及2输入端或非门CD4502可选通三态输出六反相/缓冲器CD4503六同相三态缓冲器CD4504六电压转换器CD4506双二组2输入可扩展或非门CD4508双4位锁存D型触发器CD4510可预置BCD码加/减计数器CD4511BCD锁存,7段译码,驱动器CD4512八路数据选择器CD4513BCD锁存,7段译码,驱动器(消隐)CD45144位锁存,4线-16线译码器CD45154位锁存,4线-16线译码器CD4516可预置4位二进制加/减计数器CD4517双64位静态移位寄存器CD4518双BCD同步加计数器CD4519四位与或选择器CD4520双4位二进制同步加计数器CD452124级分频器CD4522可预置BCD同步1/N计数器CD4526可预置4位二进制同步1/N计数器CD4527BCD比例乘法器CD4528双单稳态触发器CD4529双四路/单八路模拟开关CD4530双5输入端优势逻辑门CD453112位奇偶校验器CD45328位优先编码器CD4536可编程定时器CD4538精密双单稳CD4539双四路数据选择器CD4541可编程序振荡/计时器CD4543BCD七段锁存译码,驱动器CD4544BCD七段锁存译码,驱动器CD4547BCD七段译码/大电流驱动器CD4549函数近似寄存器CD4551四2通道模拟开关CD4553三位BCD计数器CD4555双二进制四选一译码器/分离器CD4556双二进制四选一译码器/分离器CD4558BCD八段译码器CD4560"N"BCD加法器CD4561"9"求补器CD4573四可编程运算放大器CD4574四可编程电压比较器CD4575双可编程运放/比较器CD4583双施密特触发器CD4584六施密特触发器CD45854位数值比较器CD45998位可寻址锁存器74系列芯片功能大全7400TTL2输入端四与非门7401TTL集电极开路2输入端四与非门7402TTL2输入端四或非门7403TTL集电极开路2输入端四与非门7404TTL六反相器7405TTL集电极开路六反相器7406TTL集电极开路六反相高压驱动器7407TTL集电极开路六正相高压驱动器7408TTL2输入端四与门7409TTL集电极开路2输入端四与门7410TTL3输入端3与非门74107TTL带清除主从双J-K触发器74109TTL带预置清除正触发双J-K触发器7411TTL3输入端3与门74112TTL带预置清除负触发双J-K触发器7412TTL开路输出3输入端三与非门74121TTL单稳态多谐振荡器74122TTL可再触发单稳态多谐振荡器74123TTL双可再触发单稳态多谐振荡器74125TTL三态输出高有效四总线缓冲门74126TTL三态输出低有效四总线缓冲门7413TTL4输入端双与非施密特触发器74132TTL2输入端四与非施密特触发器74133TTL13输入端与非门74136TTL四异或门74138TTL3-8线译码器/复工器74139TTL双2-4线译码器/复工器7414TTL六反相施密特触发器74145TTL BCD—十进制译码/驱动器7415TTL开路输出3输入端三与门74150TTL16选1数据选择/多路开关74151TTL8选1数据选择器74153TTL双4选1数据选择器74154TTL4线—16线译码器74155TTL图腾柱输出译码器/分配器74156TTL开路输出译码器/分配器74157TTL同相输出四2选1数据选择器74158TTL反相输出四2选1数据选择器7416TTL开路输出六反相缓冲/驱动器74160TTL可预置BCD异步清除计数器74161TTL可予制四位二进制异步清除计数器74162TTL可预置BCD同步清除计数器74163TTL可予制四位二进制同步清除计数器74164TTL八位串行入/并行输出移位寄存器74165TTL八位并行入/串行输出移位寄存器74166TTL八位并入/串出移位寄存器74169TTL二进制四位加/减同步计数器7417TTL开路输出六同相缓冲/驱动器74170TTL开路输出4×4寄存器堆74173TTL三态输出四位D型寄存器74174TTL带公共时钟和复位六D触发器74175TTL带公共时钟和复位四D触发器74180TTL9位奇数/偶数发生器/校验器74181TTL算术逻辑单元/函数发生器74185TTL二进制—BCD代码转换器74190TTL BCD同步加/减计数器74191TTL二进制同步可逆计数器74192TTL可预置BCD双时钟可逆计数器74193TTL可预置四位二进制双时钟可逆计数器74194TTL四位双向通用移位寄存器74195TTL四位并行通道移位寄存器74196TTL十进制/二-十进制可预置计数锁存器74197TTL二进制可预置锁存器/计数器7420TTL4输入端双与非门7421TTL4输入端双与门7422TTL开路输出4输入端双与非门74221TTL双/单稳态多谐振荡器74240TTL八反相三态缓冲器/线驱动器74241TTL八同相三态缓冲器/线驱动器74243TTL四同相三态总线收发器74244TTL八同相三态缓冲器/线驱动器74245TTL八同相三态总线收发器74247TTL BCD—7段15V输出译码/驱动器74248TTL BCD—7段译码/升压输出驱动器74249TTL BCD—7段译码/开路输出驱动器74251TTL三态输出8选1数据选择器/复工器74253TTL三态输出双4选1数据选择器/复工器74256TTL双四位可寻址锁存器74257TTL三态原码四2选1数据选择器/复工器74258TTL三态反码四2选1数据选择器/复工器74259TTL八位可寻址锁存器/3-8线译码器7426TTL2输入端高压接口四与非门74260TTL5输入端双或非门74266TTL2输入端四异或非门7427TTL3输入端三或非门74273TTL带公共时钟复位八D触发器74279TTL四图腾柱输出S-R锁存器7428TTL2输入端四或非门缓冲器74283TTL4位二进制全加器74290TTL二/五分频十进制计数器74293TTL二/八分频四位二进制计数器74295TTL四位双向通用移位寄存器74298TTL四2输入多路带存贮开关74299TTL三态输出八位通用移位寄存器7430TTL8输入端与非门7432TTL2输入端四或门74322TTL带符号扩展端八位移位寄存器74323TTL三态输出八位双向移位/存贮寄存器7433TTL开路输出2输入端四或非缓冲器74347TTL BCD—7段译码器/驱动器74352TTL双4选1数据选择器/复工器74353TTL三态输出双4选1数据选择器/复工器74365TTL门使能输入三态输出六同相线驱动器74365TTL门使能输入三态输出六同相线驱动器74366TTL门使能输入三态输出六反相线驱动器74367TTL4/2线使能输入三态六同相线驱动器74368TTL4/2线使能输入三态六反相线驱动器7437TTL开路输出2输入端四与非缓冲器74373TTL三态同相八D锁存器74374TTL三态反相八D锁存器74375TTL4位双稳态锁存器74377TTL单边输出公共使能八D锁存器74378TTL单边输出公共使能六D锁存器74379TTL双边输出公共使能四D锁存器7438TTL开路输出2输入端四与非缓冲器74380TTL多功能八进制寄存器7439TTL开路输出2输入端四与非缓冲器74390TTL双十进制计数器74393TTL双四位二进制计数器7440TTL4输入端双与非缓冲器7442TTL BCD—十进制代码转换器74352TTL双4选1数据选择器/复工器74353TTL三态输出双4选1数据选择器/复工器74365TTL门使能输入三态输出六同相线驱动器74366TTL门使能输入三态输出六反相线驱动器74367TTL4/2线使能输入三态六同相线驱动器74368TTL4/2线使能输入三态六反相线驱动器7437TTL开路输出2输入端四与非缓冲器74373TTL三态同相八D锁存器74374TTL三态反相八D锁存器74375TTL4位双稳态锁存器74377TTL单边输出公共使能八D锁存器74378TTL单边输出公共使能六D锁存器74379TTL双边输出公共使能四D锁存器7438TTL开路输出2输入端四与非缓冲器74380TTL多功能八进制寄存器7439TTL开路输出2输入端四与非缓冲器74390TTL双十进制计数器74393TTL双四位二进制计数器7440TTL4输入端双与非缓冲器7442TTL BCD—十进制代码转换器74447TTL BCD—7段译码器/驱动器7445TTL BCD—十进制代码转换/驱动器74450TTL16:1多路转接复用器多工器74451TTL双8:1多路转接复用器多工器74453TTL四4:1多路转接复用器多工器7446TTL BCD—7段低有效译码/驱动器74460TTL十位比较器74461TTL八进制计数器74465TTL三态同相2与使能端八总线缓冲器74466TTL三态反相2与使能八总线缓冲器74467TTL三态同相2使能端八总线缓冲器74468TTL三态反相2使能端八总线缓冲器74469TTL八位双向计数器7447TTL BCD—7段高有效译码/驱动器7448TTL BCD—7段译码器/内部上拉输出驱动74490TTL双十进制计数器74491TTL十位计数器74498TTL八进制移位寄存器7450TTL2-3/2-2输入端双与或非门74502TTL八位逐次逼近寄存器74503TTL八位逐次逼近寄存器7451TTL2-3/2-2输入端双与或非门74533TTL三态反相八D锁存器74534TTL三态反相八D锁存器7454TTL四路输入与或非门74540TTL八位三态反相输出总线缓冲器7455TTL4输入端二路输入与或非门74563TTL八位三态反相输出触发器74564TTL八位三态反相输出D触发器74573TTL八位三态输出触发器74574TTL八位三态输出D触发器74645TTL三态输出八同相总线传送接收器74670TTL三态输出4×4寄存器堆7473TTL带清除负触发双J-K触发器7474TTL带置位复位正触发双D触发器7476TTL带预置清除双J-K触发器7483TTL四位二进制快速进位全加器7485TTL四位数字比较器7486TTL2输入端四异或门7490TTL可二/五分频十进制计数器7493TTL可二/八分频二进制计数器7495TTL四位并行输入\\输出移位寄存器7497TTL6位同步二进制乘法器CD系列门电路CD4000双3输入端或非门CD4001四2输入端或非门CD4002双4输入端或非门CD4007双互补对加反向器CD4009六反向缓冲／变换器CD4011四2输入端与非门CD4012双4输入端与非门CD4023三2输入端与非门CD4025三2输入端与非门CD4030四2输入端异或门CD4041四同相／反向缓冲器CD40488输入端可扩展多功能门CD4049六反相缓冲/变换器CD4050六同相缓冲／变换器CD40688输入端与门／与非门CD4069六反相器CD4070四2输入异或门CD4071四2输入端或门CD4072双4输入端或门CD4073三3输入端与门CD4075三3输入端或门CD4077四异或非门CD40788输入端与非门／或门CD4081四2输入端与门CD4082双4输入端与非门CD4085双2路2输入端与或非门CD4086四2输入端可扩展与或非门CD40104TTL至高电平CMOS转换器CD40106六施密特触发器CD40107双2输入端与非缓冲／驱动器CD40109四低-高电平位移器CD4501三多输入门CD4052六反向缓冲器（三态输出）CD4503六同相缓冲器（三态输出）CD45046TTL或CMOS同级移相器CD4506双可扩展AIO门CD4507四异或门CD45194位与／或选择器CD4530双5输入多数逻辑门CD4572四反向器加二输入或非门加二输入与非门CD45998位可寻址锁存器触发器CD4013双D触发器CD4027双JK触发器CD4042四锁存D型触发器CD4043四三态R-S锁存触发器（“1”触发）CD4044四三态R-S锁存触发器（“0”触发）CD4047单稳态触发／无稳多谐振荡器CD4093四2输入端施密特触发器CD4098双单稳态触发器CD40998位可寻址锁存器CD4508双4位锁存触发器CD4528双单稳态触发器(与CD4098管脚相同，只是3、13脚复位开关为高电平有效）CD4538精密单稳多谐振荡器CD4583双施密特触发器CD4584六施密特触发器CD45998位可寻址锁存器计数器CD4017十进制计数/分配器CD402014位二进制串行计数器/分频器CD4022八进制计数/分配器CD40247位二进制串行计数器/分频器CD4029可预置数可逆计数器（4位二进制或BCD码）CD404012二进制串行计数器/分频器CD404512位计数／缓冲器CD4059四十进制N分频器CD406014二进制串行计数器/分频器和振荡器CD40953输入端J-K触发器（相同J-K输入端）CD40963输入端J-K触发器（相反和相同J-K输入端）CD40110十进制加／减计数／锁存／7端译码／驱动器CD40160可预置数BCD加计数器（异步复位）CD40161可预置数4位二进制加计数器(R非＝0时，CP上脉冲复位）（异步复位）CD40162可预置数BCD加计数器（同步复位）CD40163可预置数4位二进制加计数器(R非＝0时，CP上脉冲复位）（同步复位）CD40192可预置数BCD加/减计数器CD40193可预置数4位二进制加/减计数器CD4510可预置BCD加/减计数器CD4516可预置4位二进制加/减计数器CD4518双BCD同步加计数器CD4520双同步4位二进制加计数器CD452124级频率分频器CD4522可预置数BCD同步1/N加计数器CD4526可预置数4位二进制同步1/N加计数器CD4534实时与译码计数器CD4536可编程定时器CD4541可编程定时器CD45533数字BCD计数器CD4568相位比较器／可编程计数器CD4569双可预置BCD／二进制计数器CD45978位总线相容计数／锁存器CD45988位总线相容可建地址锁存器译码器CD4511BCD锁存/7段译码器/驱动器CD45144位锁存/4-16线译码器CD45154位锁存/4-16线译码器（负逻辑输出）CD4026十进制计数/7段译码器（适用于时钟计时电路，利用C端的功能可方便的实现60或12分CD4028BCD-十进制译码器CD4033十进制计数/7段译码器CD40544位液晶显示驱动CD4055BCD-7段码／液晶驱动CD4056BCD-7段码／驱动CD401028位可预置同步减法计时器（BCD）CD401038位可预置同步减法计时器（二进制）CD4513BCD-锁存／7端译码／驱动器（无效“0”不显）CD45144位锁存／4线—16线译码器（输出“1”）CD45154位锁存／4线—16线译码器（输出“0”）CD4543BCD-锁存／7段译码／驱动器CD4544BCD-锁存／7段译码／驱动器——波动闭锁CD4547BCD-锁存／7段译码／大电流驱动器CD4555双二进制4选1译码器／分离器（输出“1”）CD4556双二进制4选1译码器／分离器（输出“0”）CD4558BCD-7段译码CD4555双二进制4选1译码器/分离器CD4556双二进制4选1译码器/分离器（负逻辑输出）移位寄存器CD400618位串入—串出移位寄存器CD40148位串入/并入—串出移位寄存器CD4015双4位串入—并出移位寄存器CD40218位串入/并入—串出移位寄存器CD403164位移位寄存器CD40348位通用总线寄存器CD40354位串入/并入—串出/并出移位寄存器CD40764线D型寄存器CD40948位移位／存储总线寄存器CD4010032位左移／右移CD40105先进先出寄存器CD401084×4多端口寄存器阵列CD401944位并入／串入—并出／串出移位寄存器（左移／右移）CD401954位并入／串入—并出／串出移位寄存器CD451764位移位寄存器CD45490连续的近似值寄存器CD4562128位静态移位寄存器CD45804×4多端寄存器模拟开关和数据选择器CD4016四联双向开关CD4019四与或选择器【Qn=(An*Ka)+(Bn*Kb)】CD4051单八路模拟开关CD4052双4路模拟开关CD4053三2路模拟开关CD4066四双向模拟开关CD4067单十六路模拟开关CD4097双八路模拟开关CD40257四2选1数据选择器CD4512八路数据选择器CD4529双四路／单八路模拟开关CD4539双四路数据选择器CD4551四2通道模拟多路传输运算电路CD40084位超前进位全加器CD4019四与或选择器【Qn=(An*Ka)+(Bn*Kb)】CD4527BCD比例乘法器CD4032三路串联加法器CD4038三路串联加法器（负逻辑）CD4063四位量级比较器CD4070四2输入异或门CD45854位数值比较器CD40894位二进制比例乘法器CD401019位奇偶发生器／校验器CD4527BCD比例乘法器CD453112位奇偶数CD4559逐次近似值码器CD4560“N”BCD加法器CD4561“9”求补器CD45814位算术逻辑单元CD4582超前进位发生器CD45854位数值比较器存储器CD40494字×8位随机存取存储器CD450564×1位RAMCD4537256×1静态随机存取存储器CD4552256位RAM特殊电路CD4046锁相环集成电路CD45328位优先编码器CD4500工业控制单元CD4566工业时基发生器CD4573可预置运算放大器CD4574比较器、线性、双对双运放CD4575双／双预置运放／比较器CD45978位总线相容计数／锁存器CD45988位总线相容可建地址锁存器。

SN74LVC32244ZKER中文资料

PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)SN74LVC32244GKER ACTIVE LFBGA GKE 961000NoneSNPB Level-3-220C-168HR SN74LVC32244ZKERACTIVELFBGAZKE961000Green (RoHS &no Sb/Br)SNAGCULevel-3-250C-168HR(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -May not be currently available -please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead (Pb-Free).Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean "Pb-Free"and in addition,uses package materials that do not contain halogens,including bromine (Br)or antimony (Sb)above 0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducteddestructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM25-Feb-2005IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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SN74CB3T3257中文资料

FUNCTION TABLE (EACH MULTIPLEXER/DEMULTIPLEXER)
INPUTS
OE
S
L
L
L
H
H
X
INPUT/OUTPUT A
B1 B2 Z
FUNCTION
A port = B1 port A port = B2 port
Disconnect
VCC
5.5 V VCC ≈VCC – 1 V
3
元器件交SN易74网 4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE BUS SWITCH WITH 5-V-TOLERANT LEVEL SHIFTER
• Bidirectional Data Flow With Near-Zero Propagation Delay
• Low ON-State Resistance (ron) Characteristics (ron = 5 Ω Typ)
• Low Input/Output Capacitance Minimizes Loading (Cio(OFF) = 5 pF Typ)
SCDS149 – OCTOBER 2003 – REVISED MARCH 2005
FEATURES
• Output Voltage Translation Tracks VCC • Supports Mixed-Mode Signal Operation on All
Data I/O Ports
15 OE
SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW)
A

SN74CB3T3257PWR,SN74CB3T3257DGVR,SN74CB3T3257PW,SN74CB3T3257PWRE4,规格书,Datasheet 资料

• Control Inputs Can Be Driven by TTL or 5-V/3.3-V CMOS Outputs
• Ioff Supports Partial-Power-Down Mode Operation
• Latch-Up Performance Exceeds 250 mA Per JESD 17
TA –40°C to 85°C
TSSOP – PW TVSOP – DGV
ORDERING INFORMATION
PACKAGE (1)
ORDERABLE PART NUMBER
Tube
SN74CB3T3257PW
Tape and reel
SN74CB3T3257PWR
Tape and reel
SN74CB3T3257DGVR
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
– 5-V/3.3-V Input Down to 2.5-V Output Level Shift With 2.5-V VCC
• 5-V-Tolerant I/Os With Device Powered Up or Powered Down
• Bidirectional Data Flow With Near-Zero Propagation Delay

HD74BC244A中文资料

HD74BC244AOctal Buffers/Line Drivers With 3 State OutputsADE-205-007A (Z)2nd. EditionMarch 1993 DescriptionThe HD74BC244A provides high drivability and operation equal to or better than high speed bipolar standard logic IC by using Bi-CMOS process. The device features low power dissipation that is about 1/5 of high speed bipolar logic IC, when the frequency is 10 MHz. The device has eight inverter drivers with three state outputs in a 20 pin package. This device is a non inverting buffer and has two active low enables (1G and 2G). Each enable independently controls 4 buffers.Features• Input/Output are at high impedance state when power supply is off.• Built in input pull up circuit can make input pins be open, when not used.• TTL level input• Wide operating temperature rangeTa = –40 to + 85°CFunction TableInputsG A Output YH X ZL H HL L LH:High levelL:Low levelX:ImmaterialZ:High impedanceHD74BC244A2Pin ArrangementAbsolute Maximum RatingsItemSymbol Rating Unit Supply voltage V CC –0.5 to +7.0V Input diode current I IK ±30mA Input voltage V IN –0.5 to +7.5V Output voltage V OUT –0.5 to +7.5V Off state output voltage V OUT(off)–0.5 to +5.5V Storage temperature Tstg–65 to +150°CNote:1.The absolute maximum ratings are values which must not individually be exceeded, andfurthermore, no two of which may be realized at the same time.HD74BC244A3Recommended Operating ConditionsItemSymbol Min Typ Max Unit Supply voltage V CC 4.5 5.0 5.5V Input voltage V IN 0—V CC V Output voltage V OUT 0—V CC V Operating temperature Topr –40—85°C Input rise/fall time*1t r , t f—8ns/VNote:1.This item guarantees maximum limit when one input switches.Waveform: Refer to test circuit of switching characteristics.Logic DiagramHD74BC244A4Electrical Characteristics (Ta = –40°C to +85°C)Item Symbol V CC (V)Min Max Unit Test ConditionsInput voltage V IH 2.0—V V IL —0.8V Output voltageV OH 4.5 2.4—V I OH = –3 mA 4.5 2.0—V I OH = –15 mA V OL4.5—0.5V I OL = 48 mA 4.5—0.55V I OL = 64 mA Input diode voltage V IK 4.5—–1.2V I IN = –18 mA Input currentI I5.5—–250µA V IN = 0 V 5.5— 1.0µA V IN = 5.5 V 5.5—100µA V IN = 7.0 V Short circuit output current*1I OS 5.5–100–225mA V IN = 0 or 5.5 V Off state output current I OZH 5.5—50µA V O = 2.7 V I OZL 5.5—–50µA V O = 0.5 V Supply currentI CCL 5.5—29.5mA V IN = 0 or 5.5 V All outputs is “L”I CCH 5.5—0.5mA V IN = 0 or 5.5 V All outputs is “H”I CCZ 5.5— 2.5mA V IN = 0 or 5.5 V All outputs is “Z”I CCT *25.5—1.5mAV IN = 3.4 or 0.5 V Notes :1.Not more than one output should be shorted at a time and duration of the short circuit should notexceed one second.2.When input by the TTL level, it shows I CC increase at per one input pin.HD74BC244A5Switching Test Method (C L = 50 pF)Ta = 25°C V CC = 5.0 VTa = –40 to 85°C V CC = 5.0 V ±10%ItemSymbol Min Max Min Max Unit Test Conditions Propagation delay time t PLH 3.0 6.0 3.07.0nsSee under figuret PHL 3.0 6.0 3.07.0Output enable time t ZH 3.08.0 3.010.0ns t ZL 3.08.0 3.010.0Output disable time t HZ 3.07.0 3.09.0ns t LZ 3.07.03.09.0Input capacitanse C IN 3.0(Typ)—pF V IN = V CC or GND Output capacitanceC O15.0(Typ)—pFV O = V CC or GNDTest CircuitHD74BC244A Waveforms-1Waveforms-26HD74BC244A Package DimensionsUnit: mm7Cautions1.Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,copyright, trademark, or other intellectual property rights for information contained in this document.Hitachi bears no responsibility for problems that may arise with third party’s rights, includingintellectual property rights, in connection with use of the information contained in this document.2.Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.3.Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,traffic, safety equipment or medical equipment for life support.4.Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installationconditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.5.This product is not designed to be radiation resistant.6.No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.7.Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.Hitachi, Ltd.Semiconductor & Integrated Circuits.Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.Hitachi Asia Pte. Ltd.16 Collyer Quay #20-00Hitachi TowerSingapore 049318Tel: 535-2100Fax: 535-1533URLNorthAmerica : http:/Europe : /hel/ecg Asia (Singapore): .sg/grp3/sicd/index.htm Asia (Taiwan): /E/Product/SICD_Frame.htm Asia (HongKong): /eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htmHitachi Asia Ltd.Taipei Branch Office3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105)Tel: <886> (2) 2718-3666Fax: <886> (2) 2718-8180Hitachi Asia (Hong Kong) Ltd.Group III (Electronic Components)7/F., North Tower, World Finance Centre,Harbour City, Canton Road, Tsim Sha Tsui,Kowloon, Hong Kong Tel: <852> (2) 735 9218Fax: <852> (2) 730 0281 Telex: 40815 HITEC HXHitachi Europe Ltd.Electronic Components Group.Whitebrook ParkLower Cookham Road MaidenheadBerkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000Fax: <44> (1628) 778322Hitachi Europe GmbHElectronic components Group Dornacher Stra§e 3D-85622 Feldkirchen, Munich GermanyTel: <49> (89) 9 9180-0Fax: <49> (89) 9 29 30 00Hitachi Semiconductor (America) Inc.179 East Tasman Drive,San Jose,CA 95134 Tel: <1> (408) 433-1990Fax: <1>(408) 433-0223For further information write to:。

SN74CBT3253中文资料

元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。

SN74AHC244PWG4中文资料

PACKAGING INFORMATIONOrderable DeviceStatus (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9678201Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 5962-9678201QRA ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type 5962-9678201QSA ACTIVE CFP W 201TBD A42N /A for Pkg Type 5962-9678201SA ACTIVE CFP W 20TBD Call TI Call TI5962-9678201VRA ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type 5962-9678201VSA ACTIVE CFP W 201TBD A42N /A for Pkg Type SN74AHC244DBLE OBSOLETE SSOP DB 20TBDCall TI Call TISN74AHC244DBR ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DBRE4ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DBRG4ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DGVR ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DGVRE4ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DGVRG4ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DW ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWE4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWG4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWR ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWRE4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWRG4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244N ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74AHC244NE4ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74AHC244NSR ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244NSRE4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244NSRG4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PW ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWE4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWG4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWLEOBSOLETETSSOPPW20TBDCall TICall TI24-Sep-2007Orderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74AHC244PWR ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWRE4ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWRG4ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIMSNJ54AHC244FK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type SNJ54AHC244J ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type SNJ54AHC244WACTIVECFPW201TBDA42N /A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--TheMoisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.24-Sep-2007TAPE AND REEL BOXINFORMATIONDevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74AHC244DBR DB 20SITE 41330168.27.5 2.51216Q1SN74AHC244DGVR DGV 20SITE 41330127.0 5.6 1.6812Q1SN74AHC244DWR DW 20SITE 413302410.813.0 2.71224Q1SN74AHC244NSR NS 20SITE 41330248.213.0 2.51224Q1SN74AHC244PWRPW20SITE 41330166.957.11.6816Q122-Sep-2007DevicePackage Pins Site Length (mm)Width (mm)Height (mm)SN74AHC244DBR DB 20SITE 41346.0346.00.0SN74AHC244DGVR DGV 20SITE 41346.0346.00.0SN74AHC244DWR DW 20SITE 41346.0346.00.0SN74AHC244NSR NS 20SITE 41346.0346.00.0SN74AHC244PWRPW20SITE 41346.0346.00.022-Sep-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityRFID Telephony /telephonyLow Power /lpw Video&Imaging /videoWirelessWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments Incorporated。

SN74CBT3244中文资料

TI SN74AHC244Q 数据手册说明书

SN74AHC244Q Octal Buffer/driver with 3-State Outputs1 Features•Q devices meet automotive performance requirements•Customer-specific configuration control can be supported along with major-change approval •EPIC™ (Enhanced-Performance Implanted CMOS) process•Operating range of 2 V to 5.5 V V CC•Latch-Up performance exceeds 250 mA per JESD 172 Applications•Enable or disable a digital signal•Eliminate slow or noisy input signals•Hold a signal during controller reset•Debounce a switch 3 DescriptionThis octal buffer/driver is designed specifically to improve the performance and density of 3-state memory-address drivers, clock drivers, and bus-oriented receivers and transmitters.(1)Package drawings, standard packing quantities, thermal data,symbolization, and PCB design guidelines are available at/sc/package.Table of Contents1 Features ............................................................................12 Applications .....................................................................13 Description .......................................................................14 Revision History ..............................................................25 Function Table .................................................................36 Specifications ..................................................................46.1 Absolute Maximum Ratings........................................46.2 ESD Ratings...............................................................46.3 Recommended Operating Conditions.........................46.4 Thermal Information....................................................56.5 Electrical Characteristics.............................................56.6 Switching Characteristics, V CC = 3.3 V ± 0.3 V ..........56.7 Switching Characteristics, V CC = 5 V ± 0.5 V .............66.8 Noise Characteristics..................................................66.9 Operating Characteristics...........................................67 Parameter Measurement Information . (7)8 Detailed Description ........................................................88.1 Overview.....................................................................88.2 Functional Block Diagram...........................................88.3 Device Functional Modes............................................89 Application and Implementation ....................................99.1 Power Supply Recommendations...............................99.2 Layout.........................................................................910 Device and Documentation Support ..........................1110.1 Documentation Support..........................................1110.2 Receiving Notification of Documentation Updates..1110.3 Support Resources.................................................1110.4 Trademarks.............................................................1110.5 Electrostatic Discharge Caution..............................1110.6 Glossary..................................................................1111 Mechanical, Packaging, and OrderableInformation (12)4 Revision HistoryNOTE: Page numbers for previous revisions may differ from page numbers in the current version.Changes from Revision * (February 2002) to Revision A (April 2023)Page •Added Applications , Package Information table, Pin Functions table, ESD Ratings table, Thermal Information table, Device Functional Modes , Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, andOrderable Information section (1)SN74AHC244QSGDS017A – FEBRUARY 2002 – REVISED APRIL 20235 Function TableFigure 5-1. DW or PW Package (Top View)SN74AHC244QSGDS017A – FEBRUARY 2002 – REVISED APRIL 2023SN74AHC244QSGDS017A – FEBRUARY 2002 – REVISED APRIL 6 Specifications6.1 Absolute Maximum Ratings1.Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to thedevice. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.2.The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 6.2 ESD Ratings(1)JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.(2)JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.6.3 Recommended Operating Conditions(1)(1)(1)All unused inputs of the device must be held at V CC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs , literature number SCBA004.6.4 Thermal Information(1)For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.6.5 Electrical Characteristics6.6 Switching Characteristics, V CC = 3.3 V ± 0.3 VSN74AHC244QSGDS017A – FEBRUARY 2002 – REVISED APRIL 2023SN74AHC244QSGDS017A – FEBRUARY 2002 – REVISED APRIL 6.7 Switching Characteristics, V CC = 5 V ± 0.5 V6.8 Noise Characteristics(1)(1)Characteristics are for surface-mount packages only.6.9 Operating Characteristics7 Parameter Measurement InformationA.C L includes probe and jig capacitance.B.Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z O = 50 Ω, t r ≤ 3 ns, t f ≤ 3 ns.D.The outputs are measured one at a time with one input transition per measurement.Figure 7-1. Load Circuit and Voltage WaveformsSN74AHC244QSGDS017A – FEBRUARY 2002 – REVISED APRIL 20238 Detailed Description8.1 OverviewThe SN74AHC244Q is organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state.To ensure the high-impedance state during power up or power down, OE should be tied to V CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.8.2 Functional Block DiagramFigure 8-1. Logic Diagram (Positive Logic)†Figure 8-2. Logic Symbol8.3 Device Functional Modes†This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.SN74AHC244QSGDS017A – FEBRUARY 2002 – REVISED APRIL 20239 Application and ImplementationNoteInformation in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.9.1 Power Supply RecommendationsThe power supply can be any voltage between the MIN and MAX supply voltage rating located in the Section 6.3 table.Each VCC pin should have a good bypass capacitor to prevent power disturbance. For devices with a single supply, 0.1 μf is recommended; if there are multiple VCC pins, then 0.01 μf or 0.022 μf is recommended for each power pin. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. A 0.1 μf and a 1 μf are commonly used in parallel. The bypass capacitor should be installed as close to the power pin as possible for best results.9.2 Layout9.2.1 Layout GuidelinesWhen using multiple-bit logic devices, inputs should never float.In many cases, functions or parts of functions of digital logic devices are unused, for example, when only two inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such input pins should not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. Layout Diagram specifies the rules that must be observed under all circumstances. All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. The logic level that should be applied to any particular unused input depends on the function of the device. Generally they will be tied to GND or V CC , whichever makes more sense or is more convenient. It is generally acceptable to float outputs, unless the part is a transceiver. If the transceiver has an output enable pin, it will disable the output section of the part when asserted. This will not disable the input section of the I/Os, so they cannot float when disabled.SN74AHC244QSGDS017A – FEBRUARY 2002 – REVISED APRIL 2023SN74AHC244QSGDS017A – FEBRUARY 2002 – REVISED APRIL 9.2.1.1 Layout ExampleFigure 9-1. Layout Diagram10 Device and Documentation Support10.1 Documentation Support10.1.1 Related DocumentationThe table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.10.2 Receiving Notification of Documentation UpdatesTo receive notification of documentation updates, navigate to the device product folder on . Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.10.3 Support ResourcesTI E2E ™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need.Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use .10.4 TrademarksTI E2E ™ is a trademark of Texas Instruments.All trademarks are the property of their respective owners.10.5 Electrostatic Discharge CautionThis integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.10.6 GlossaryTI GlossaryThis glossary lists and explains terms, acronyms, and definitions.SN74AHC244QSGDS017A – FEBRUARY 2002 – REVISED APRIL 2023SN74AHC244QSGDS017A – FEBRUARY 2002 – REVISED APRIL 11 Mechanical, Packaging, and Orderable InformationThe following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.PACKAGING INFORMATION(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free".RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement.(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andAddendum-Page 1continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.Addendum-Page 2TAPE AND REEL INFORMATIONA0B0K0W Dimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSSprocket HolesP1*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1 (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74AHC244QDWRG4SOIC DW 202000330.024.410.813.3 2.712.024.0Q1SN74AHC244QDWRG4Q1SOIC DW 202000330.024.410.813.3 2.712.024.0Q1SN74AHC244QPWR TSSOP PW 202000330.016.4 6.957.0 1.48.016.0Q1SN74AHC244QPWRG4TSSOPPW202000330.016.46.957.01.48.016.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length (mm)Width (mm)Height (mm) SN74AHC244QDWRG4SOIC DW202000367.0367.045.0SN74AHC244QDWRG4Q1SOIC DW202000367.0367.045.0 SN74AHC244QPWR TSSOP PW202000356.0356.035.0SN74AHC244QPWRG4TSSOP PW202000356.0356.035.0PACKAGE OUTLINESOIC - 2.65 mm max heightDW0020ASOICNOTES:1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.2. This drawing is subject to change without notice.3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side.4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side.5. Reference JEDEC registration MS-013.EXAMPLE BOARD LAYOUT DW0020ASOIC - 2.65 mm max heightSOIC ArrayNOTES: (continued)6. Publication IPC-7351 may have alternate designs.7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.EXAMPLE STENCIL DESIGN DW0020ASOIC - 2.65 mm max heightSOIC ArrayNOTES: (continued)8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternatedesign recommendations.9. Board assembly site may have different recommendations for stencil design.PACKAGE OUTLINETSSOP - 1.2 mm max heightPW0020ASMALL OUTLINE PACKAGENOTES:1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.2. This drawing is subject to change without notice.3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side.4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.5. Reference JEDEC registration MO-153.EXAMPLE BOARD LAYOUTTSSOP - 1.2 mm max heightPW0020A SMALL OUTLINE PACKAGENOTES: (continued)6. Publication IPC-7351 may have alternate designs.7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.EXAMPLE STENCIL DESIGNTSSOP - 1.2 mm max heightPW0020A SMALL OUTLINE PACKAGENOTES: (continued)8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.9. Board assembly site may have different recommendations for stencil design.IMPORTANT NOTICE AND DISCLAIMERTI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, regulatory or other requirements.These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.TI objects to and rejects any additional or different terms you may have proposed.Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2023, Texas Instruments Incorporated。

SN74LS03NSR,SN74LS03N,规格书,Datasheet 资料

TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74LS03DR SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1SN74LS03NSRSONS142000330.016.48.210.52.512.016.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74LS03DR SOIC D142500367.0367.038.0SN74LS03NSR SO NS142000367.0367.038.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components which meet ISO/TS16949requirements,mainly for automotive ponents which have not been so designated are neither designed nor intended for automotive use;and TI will not be responsible for any failure of such components to meet such requirements.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Mobile Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2012,Texas Instruments Incorporated。

SN74ACT244PW中文资料

SN74ACT244PWR

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-8776001M2A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-8776001MRA ACTIVE CDIP J201TBD A42N/A for Pkg Type 5962-8776001MSA ACTIVE CFP W201TBD Call TI N/A for Pkg Type 5962-8776001SRA ACTIVE CDIP J201TBD A42N/A for Pkg Type 5962-8776001SSA ACTIVE CFP W201TBD Call TI N/A for Pkg Type SN74ACT244DBLE OBSOLETE SSOP DB20TBD Call TI Call TISN74ACT244DBR ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244DBRE4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244DBRG4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244DWG4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244DWRG4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN74ACT244NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN74ACT244NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244NSRG4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244PW ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244PWE4ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244PWG4ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ACT244PWLE OBSOLETE TSSOP PW20TBD Call TI Call TISN74ACT244PWR ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244PWRE4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244PWRG4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54ACT244FK ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type SNJ54ACT244J ACTIVE CDIP J201TBD A42N/A for Pkg Type SNJ54ACT244W ACTIVE CFP W201TBD Call TI N/A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF SN54ACT244,SN54ACT244-SP,SN74ACT244:•Automotive:SN74ACT244-Q1•Enhanced Product:SN74ACT244-EPNOTE:Qualified Version Definitions:•Automotive-Q100devices qualified for high-reliability automotive applications targeting zero defects•Enhanced Product-Supports Defense,Aerospace and Medical ApplicationsTAPE AND REEL INFORMATION*All dimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74ACT244DBR SSOPDB 202000330.016.48.27.5 2.512.016.0Q1SN74ACT244DWR SOICDW 202000330.024.410.813.0 2.712.024.0Q1SN74ACT244NSR SONS 202000330.024.48.213.0 2.512.024.0Q1SN74ACT244PWR TSSOP PW 202000330.016.4 6.957.1 1.68.016.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74ACT244DBR SSOP DB202000346.0346.033.0 SN74ACT244DWR SOIC DW202000346.0346.041.0 SN74ACT244NSR SO NS202000346.0346.041.0 SN74ACT244PWR TSSOP PW202000346.0346.033.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDLP®Products BroadbandDSP Digital ControlClocks and Timers MedicalInterface MilitaryLogic Optical NetworkingPower Mgmt SecurityMicrocontrollers TelephonyRFID Video&ImagingRF/IF and ZigBee®Solutions WirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2009,Texas Instruments Incorporated。

74ACQ244资料

Note 1: Absolute maximum ratings are those values beyond which damage to the device may occur. The databook specifications should be met, without exception, to ensure that the system design is reliable over its power supply, temperature, and output/input loading variables. Fairchild does not recommend operation of FACT circuits outside databook specifications.
Outputs In L H X (Pins 12, 14, 16, 18) L H Z Outputs In L H X (Pins 3, 5, 7, 9) L H Z

2
元器件交易网
74ACQ244 • 74ACTQ244
Absolute Maximum Ratings(Note 1)
Features
s ICC and IOZ reduced by 50% s Guaranteed simultaneous switching noise level and dynamic threshold performance s Guaranteed pin-to-pin skew AC performance s Improved latch-up immunity s 3-STATE outputs drive bus lines or buffer memory address registers s Outputs source/sink 24 mA s Faster prop delays than the standard AC/ACT244

SN74LVTZ244PWRG4,SN74LVTZ244DBRE4,SN74LVTZ244DBRG4,SN74LVTZ244DWE4, 规格书,Datasheet 资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74LVTZ244DBLE OBSOLETE SSOP DB20TBD Call TI Call TISN74LVTZ244DBR ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DBRE4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DBRG4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DWG4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DWRG4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVTZ244PWLE OBSOLETE TSSOP PW20TBD Call TI Call TISN74LVTZ244PWR ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244PWRE4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244PWRG4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to takereasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TIto Customer on an annual basis.TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74LVTZ244DBR SSOP DB 202000330.016.48.27.5 2.512.016.0Q1SN74LVTZ244DWR SOIC DW 202000330.024.410.813.0 2.712.024.0Q1SN74LVTZ244PWRTSSOPPW202000330.016.46.957.11.68.016.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74LVTZ244DBR SSOP DB202000367.0367.038.0 SN74LVTZ244DWR SOIC DW202000367.0367.045.0SN74LVTZ244PWR TSSOP PW202000367.0367.038.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s 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常用4000系列标准数字电路的中文名称资料

常用4000系列标准数字电路的中文名称资料74系列芯片功能大全（点击型号查货）常用74系列标准数字电路的中文名称资料器件代号器件名称74 74LS 74HCCD4000 双3输入端或非门+单非门TI 7400 TTL 2输入端四与非门00 四2输入端与非门√√√CD4001 四2输入端或非门HIT/NSC/TI/GOL 7401 TTL 集电极开路2输入端四与非门01 四2输入端与非门(OC) √√CD4002 双4输入端或非门NSC7402 TTL 2输入端四或非门02 四2输入端或非门√√√CD4006 18位串入/串出移位寄存器NSC 7403 TTL 集电极开路2输入端四与非门03 四2输入端与非门(OC) √√CD4007 双互补对加反相器NSC 7404 TTL 六反相器04 六反相器√√√CD4008 4位超前进位全加器NSC 7405 TTL 集电极开路六反相器05 六反相器(OC) √√CD4009 六反相缓冲/变换器NSC 7406 TTL 集电极开路六反相高压驱动器06 六高压输出反相器(OC,30V) √√CD4010 六同相缓冲/变换器NSC 7407 TTL 集电极开路六正相高压驱动器07 六高压输出缓冲,驱动器(OC,30V)√√√CD4011 四2输入端与非门HIT/TI7408 TTL 2输入端四与门08 四2输入端与门√√√CD4012 双4输入端与非门NSC7409 TTL 集电极开路2输入端四与门09 四2输入端与门(OC) √√√CD4013 双主-从D型触发器FSC/NSC/TOS 7410 TTL 3输入端3与非门10 三3输入端与非门√√√CD4014 8位串入/并入-串出移位寄存器NSC7411 TTL 3输入端3与门11 三3输入端与门√√CD4015 双4位串入/并出移位寄存器TI 7412 TTL 开路输出3输入端三与非门12 三3输入端与非门(OC) √√√CD4016 四传输门FSC/TI7413 TTL 4输入端双与非施密特触发器13 双4输入端与非门√√√CD4017 十进制计数/分配器FSC/TI/MOT 7414 TTL 六反相施密特触发器14 六反相器√√√CD4018 可预制1/N计数器NSC/MOT 7415 TTL 开路输出3输入端三与门15 三3输入端与门(OC) √√CD4019 四与或选择器PHI 7416 TTL 开路输出六反相缓冲/驱动器16 六高压输出反相器(OC,15V) √CD4020 14级串行二进制计数/分频器FSC 7417 TTL 开路输出六同相缓冲/驱动器17 六高压输出缓冲,驱动器(OC,15V)√CD4021 08位串入/并入-串出移位寄存器PHI/NSC 7420 TTL 4输入端双与非门20 双4输入端与非门√√√CD4022 八进制计数/分配器NSC/MOT7421 TTL 4输入端双与门21 双4输入端与门√√√CD4023 三3输入端与非门NSC/MOT/TI 7422 TTL 开路输出4输入端双与非门22 双4输入端与非门(OC) √√CD4024 7级二进制串行计数/分频器NSC/MOT/TI 7427 TTL 3输入端三或非门25 双4输入端或非门(有选通端) √√√CD4025 三3输入端或非门NSC/MOT/TI 7428 TTL 2输入端四或非门缓冲器26 四2输入端高压输出与非缓冲器√√√CD4026 十进制计数/7段译码器NSC/MOT/TI7430 TTL 8输入端与非门27 三3输入端或非门√√√CD4027 双J-K触发器NSC/MOT/TI7432 TTL 2输入端四或门28 四2输入端或非缓冲器√√√CD4028 BCD码十进制译码器NSC/MOT/TI 7433 TTL 开路输出2输入端四或非缓冲器30 8输入端与非门√√√CD4029 可预置可逆计数器NSC/MOT/TI 7437 TTL 开路输出2输入端四与非缓冲器32 四2输入端或门√√√CD4030 四异或门NSC/MOT/TI/GOL 7438 TTL 开路输出2输入端四与非缓冲器33 四2输入端或非缓冲器(OC) √√CD4031 64位串入/串出移位存储器NSC/MOT/TI 7439 TTL 开路输出2输入端四与非缓冲器37 四2输入端与非缓冲器√√CD4032 三串行加法器NSC/TI7440 TTL 4输入端双与非缓冲器38 四2输入端与非缓冲器(OC) √√CD4033 十进制计数/7段译码器NSC/TI 7442 TTL BCD—十进制代码转换器40 双4输入端与非缓冲器√√√CD4034 8位通用总线寄存器NSC/MOT/TI 7445 TTL BCD—十进制代码转换/驱动器42 4线-10线译码器(BCD输入) √√CD4035 4位并入/串入-并出/串出移位寄存NSC/MOT/TI 7446 TTL BCD—7段低有效译码/驱动器43 4线-10线译码器(余3码输入) √CD4038 三串行加法器NSC/TI 7447 TTL BCD—7段高有效译码/驱动器44 4线-10线译码器(余3葛莱码输入) √CD4040 12级二进制串行计数/分频器NSC/MOT/TI 7448 TTL BCD—7段译码器/内部上拉输出驱动48 4线-7段译码器√CD4041 四同相/反相缓冲器NSC/MOT/TI 7450 TTL 2-3/2-2输入端双与或非门49 4线-7段译码器√CD4042 四锁存D型触发器NSC/MOT/TI 7451 TTL 2-3/2-2输入端双与或非门50 双2路2-2输入与或非门√√√CD4043 4三态R-S锁存触发器("1"触发) NSC/MOT/TI 7454 TTL 四路输入与或非门51 2路3-3输入,2路2-2输入与或非门√√√CD4044 四三态R-S锁存触发器("0"触发) NSC/MOT/TI 7455 TTL 4输入端二路输入与或非门52 4路2-3-2-2输入与或门√CD4046 锁相环NSC/MOT/TI/PHI 7473 TTL 带清除负触发双J-K触发器53 4路2-2-2-2输入与或非门√CD4047 无稳态/单稳态多谐振荡器NSC/MOT/TI 7474 TTL 带置位复位正触发双D触发器54 4路2-3-3-2输入与或非门√√CD4048 4输入端可扩展多功能门NSC/HIT/TI 7476 TTL 带预置清除双J-K触发器55 2路4-4输入与或非门√CD4049 六反相缓冲/变换器NSC/HIT/TI 7483 TTL 四位二进制快速进位全加器60 双4输入与扩展器√√CD4050 六同相缓冲/变换器NSC/MOT/TI 7485 TTL 四位数字比较器61 三3输入与扩展器√CD4051 八选一模拟开关NSC/MOT/TI 7486 TTL 2输入端四异或门62 4路2-3-3-2输入与或扩展器√CD4052 双4选1模拟开关NSC/MOT/TI 7490 TTL 可二/五分频十进制计数器64 4路4-2-3-2输入与或非门√CD4053 三组二路模拟开关NSC/MOT/TI 7493 TTL 可二/八分频二进制计数器65 4路4-2-3-2输入与或非门(OC) √CD4054 液晶显示驱动器NSC/HIT/TI 7495 TTL 四位并行输入\输出移位寄存器70 与门输入J-K触发器√CD4055 BCD-7段译码/液晶驱动器NSC/HIT/TI 7497 TTL 6位同步二进制乘法器71 与或门输入J-K触发器√CD4056 液晶显示驱动器NSC/HIT/TI 74107 TTL 带清除主从双J-K触发器72 与门输入J-K触发器√CD4059 “N”分频计数器NSC/TI 74109 TTL 带预置清除正触发双J-K触发器74 双上升沿D型触发器√√CD4060 14级二进制串行计数/分频器NSC/TI/MOT 74112 TTL 带预置清除负触发双J-K触发器78 双D型触发器√√CD4063 四位数字比较器NSC/HIT/TI 74121 TTL 单稳态多谐振荡器85 四位数值比较器√CD4066 四传输门NSC/TI/MOT74122 TTL 可再触发单稳态多谐振荡器86 四2输入端异或门√√√CD4067 16选1模拟开关NSC/TI74123 TTL 双可再触发单稳态多谐振荡器87 4位二进制原码/反码√CD4068 八输入端与非门/与门NSC/HIT/TI 74125 TTL 三态输出高有效四总线缓冲门95 4位移位寄存器√CD4069 六反相器NSC/HIT/TI74126 TTL 三态输出低有效四总线缓冲门101 与或门输入J-K触发器√CD4070 四异或门NSC/HIT/TI74132 TTL 2输入端四与非施密特触发器102 与门输入J-K触发器√CD4071 四2输入端或门NSC/TI74133 TTL 13输入端与非门107 双主-从J-K触发器√CD4072 双4输入端或门NSC/TI 74136 TTL 四异或门108 双主-从J-K触发器√CD4073 三3输入端与门NSC/TI74138 TTL 3-8线译码器/复工器109 双主-从J-K触发器√CD4075 三3输入端或门NSC/TI 74139 TTL 双2-4线译码器/复工器110 与门输入J-K触发器√CD4076 四D寄存器74145 TTL BCD—十进制译码/驱动器111 双主-从J-K触发器√√CD4077 四2输入端异或非门HIT 74150 TTL 16选1数据选择/多路开关112 双下降沿J-K触发器√CD4078 8输入端或非门/或门74151 TTL 8选1数据选择器113 双下降沿J-K触发器√CD4081 四2输入端与门NSC/HIT/TI 74153 TTL 双4选1数据选择器114 双下降沿J-K触发器√CD4082 双4输入端与门NSC/HIT/TI 74154 TTL 4线—16线译码器116 双4位锁存器√CD4085 双2路2输入端与或非门74155 TTL 图腾柱输出译码器/分配器120 双脉冲同步驱动器√CD4086 四2输入端可扩展与或非门74156 TTL 开路输出译码器/分配器121 单稳态触发器√√√CD4089 二进制比例乘法器74157 TTL 同相输出四2选1数据选择器122 可重触发单稳态触发器√√√CD4093 四2输入端施密特触发器NSC/MOT/ST 74158 TTL 反相输出四2选1数据选择器123 可重触发双稳态触发器√√√CD4094 8位移位存储总线寄存器NSC/TI/PHI 74160 TTL 可预置BCD异步清除计数器125 四总线缓冲器√√√CD4095 3输入端J-K触发器74161 TTL 可予制四位二进制异步清除计数器126 四总线缓冲器√√√CD4096 3输入端J-K触发器74162 TTL 可预置BCD同步清除计数器128 四2输入端或非线驱动器√√√CD4097 双路八选一模拟开关74163 TTL 可予制四位二进制同步清除计数器132 四2输入端与非门√√√CD4098 双单稳态触发器74164 TTL 八位串行入/NSC/MOT/TI 并行输出移位寄存器CD4099 8位可寻址锁存器NSC/MOT/ST 74165 TTL 八位并行入/串行输出移位寄存器CD40100 32位左/右移位寄存器74166 TTL 八位并入/串出移位寄存器74169 TTL 二进制四位加/减同步计数器CD40101 9位奇偶较验器74170 TTL 开路输出4×4寄存器堆CD40102 8位可预置同步BCD减法计数器74173 TTL 三态输出四位D型寄存器CD40103 8位可预置同步二进制减法计数器74174 TTL 带公共时钟和复位六D触发器CD40104 4位双向移位寄存器74175 TTL 带公共时钟和复位四D触发器CD40105 先入先出FI-FD寄存器74180 TTL 9位奇数/偶数发生器/校验器CD40106 六施密特触发器NSC\TI 74181 TTL 算术逻辑单元/函数发生器CD40107 双2输入端与非缓冲/驱动器HAR\TI 74185 TTL 二进制—BCD代码转换器CD40108 4字×4位多通道寄存器74190 TTL BCD同步加/减计数器CD40109 四低-高电平位移器74191 TTL 二进制同步可逆计数器CD40110 十进制加/减,计数,锁存,译码驱动ST 74192 TTL 可预置BCD 双时钟可逆计数器CD40147 10-4线编码器NSC\MOT 74193 TTL 可预置四位二进制双时钟可逆计数器CD40160 可预置BCD加计数器NSC\MOT 74194 TTL 四位双向通用移位寄存器CD40161 可预置4位二进制加计数器NSC\MOT 74195 TTL 四位并行通道移位寄存器CD40162 BCD加法计数器NSC\MOT 74196 TTL 十进制/二-十进制可预置计数锁存器CD40163 4位二进制同步计数器NSC\MOT 74197 TTL 二进制可预置锁存器/计数器CD40174 六锁存D型触发器74221 TTL 双/单稳态多NSC\TI\MOT 谐振荡器CD40175 四D型触发器NSC\TI\MOT 74240 TTL 八反相三态缓冲器/线驱动器CD40181 4位算术逻辑单元/函数发生器74241 TTL 八同相三态缓冲器/线驱动器CD40182 超前位发生器74243 TTL 四同相三态总线收发器CD40192 可预置BCD加/减计数器(双时钟) NSC\TI 74244 TTL 八同相三态缓冲器/线驱动器CD40193 可预置4位二进制加/减计数器NSC\TI 74245 TTL 八同相三态总线收发器CD40194 4位并入/串入-并出/串出移位寄存NSC\MOT 74247 TTL BCD—7段15V输出译码/驱动器CD40195 4位并入/串入-并出/串出移位寄存NSC\MOT 74248 TTL BCD—7段译码/升压输出驱动器CD40208 4×4多端口寄存器74249 TTL BCD—7段译码/开路输出驱动器74251 TTL 三态输出8选1数据选择器/复工器CD4501 4输入端双与门及2输入端或非门74253 TTL 三态输出双4选1数据选择器/复工器CD4502 可选通三态输出六反相/缓冲器74256 TTL 双四位可寻址锁存器CD4503 六同相三态缓冲器74257 TTL 三态原码四2选1数据选择器/复工器CD4504 六电压转换器74258 TTL 三态反码四2选1数据选择器/复工器CD4506 双二组2输入可扩展或非门74259 TTL 八位可寻址锁存器/3-8线译码器CD4508 双4位锁存D型触发器74260 TTL 5输入端双或非门CD4510 可预置BCD码加/减计数器74266 TTL 2输入端四异或非门CD4511 BCD锁存,7段译码,驱动器74273 TTL 带公共时钟复位八D触发器CD4512 八路数据选择器74279 TTL 四图腾柱输出S-R锁存器CD4513 BCD锁存,7段译码,驱动74283 TTL 4位二进制全器(消隐) 加器CD4514 4位锁存,4线-16线译码器74290 TTL 二/五分频十进制计数器CD4515 4位锁存,4线-16线译码器74293 TTL 二/八分频四位二进制计数器CD4516 可预置4位二进制加/减计数器74295 TTL 四位双向通用移位寄存器CD4517 双64位静态移位寄存器74298 TTL 四2输入多路带存贮开关CD4518 双BCD同步加计数器74299 TTL 三态输出八位通用移位寄存器CD4519 四位与或选择器74322 TTL 带符号扩展端八位移位寄存器CD4520 双4位二进制同步加计数器74323 TTL 三态输出八位双向移位/存贮寄存器CD4521 24级分频器74347 TTL BCD—7段译码器/驱动器CD4522 可预置BCD同步1/N计数器74352 TTL 双4选1数据选择器/复工器CD4526 可预置4位二进制同步1/N计数器74353 TTL 三态输出双4选1数据选择器/复工器CD4527 BCD比例乘法器74365 TTL 门使能输入三态输出六同相线驱动器CD4528 双单稳态触发器74366 TTL 门使能输入三态输出六反相线驱动器CD4529 双四路/单八路模拟开关74367 TTL 4/2线使能输入三态六同相线驱动器CD4530 双5输入端优势逻辑门74368 TTL 4/2线使能输入三态六反相线驱动器CD4531 12位奇偶校验器74373 TTL 三态同相八D锁存器CD4532 8位优先编码器74374 TTL 三态反相八D锁存器CD4536 可编程定时器74375 TTL 4位双稳态锁存器CD4538 精密双单稳74377 TTL 单边输出公共使能八D锁存器CD4539 双四路数据选择器74378 TTL 单边输出公共使能六D锁存器CD4541 可编程序振荡/计时器74379 TTL 双边输出公共使能四D锁存器CD4543 BCD七段锁存译码,驱动器74380 TTL 多功能八进制寄存器CD4544 BCD七段锁存译码,驱动器74390 TTL 双十进制计数器CD4547 BCD七段译码/大电流驱动器74393 TTL 双四位二进制计数器CD4549 函数近似寄存器74447 TTL BCD—7段译码器/驱动器CD4551 四2通道模拟开关74450 TTL 16:1多路转接复用器多工器CD4553 三位BCD计数器74451 TTL 双8:1多路转接复用器多工器CD4555 双二进制四选一译码器/分离器74453 TTL 四4:1多路转接复用器多工器CD4556 双二进制四选一译码器/分离器74460 TTL 十位比较器CD4558 BCD八段译码器74461 TTL 八进制计数器CD4560 "N"BCD加法器74465 TTL 三态同相2与使能端八总线缓冲器CD4561 "9"求补器74466 TTL 三态反相2与使能八总线缓冲器CD4573 四可编程运算放大器74467 TTL 三态同相2使能端八总线缓冲器CD4574 四可编程电压比较器74468 TTL 三态反相2使能端八总线缓冲器CD4575 双可编程运放/比较器74469 TTL 八位双向计数器CD4583 双施密特触发器74490 TTL 双十进制计数器74491CD4584 六施密特触发器74498 TTL 八进制移位寄存器CD4585 4位数值比较器74502 TTL 八位逐次逼近寄存器CD4599 8位可寻址锁存器74503 TTL 八位逐次逼近寄存器74533 TTL 三态反相八D锁存器74534 TTL 三态反相八D锁存器74540 TTL 八位三态反相输出总线缓冲器74563 TTL 八位三态反相输出触发器74564 TTL 八位三态反相输出D触发器74573 TTL 八位三态输出触发器74574 TTL 八位三态输出D触发器74645 TTL 三态输出八同相总线传送接收器74670 TTL 三态输出4×4寄存器堆。

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PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74CB3Q3244DBQR ACTIVE SSOP/QSOP DBQ 202500Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74CB3Q3244DBR PREVIEW SSOP DB 162000None Call TI Call TISN74CB3Q3244DGVR ACTIVE TVSOP DGV 202000Pb-Free (RoHS)CU NIPDAU Level-1-250C-UNLIM SN74CB3Q3244DW PREVIEW SOIC DW 1640None Call TI Call TI SN74CB3Q3244DWR PREVIEW SOIC DW 162000None Call TI Call TISN74CB3Q3244GQNR ACTIVE VFBGA GQN 201000None SNPB Level-1-240C-UNLIM SN74CB3Q3244PW ACTIVE TSSOP PW 2070Pb-Free (RoHS)CU NIPDAU Level-1-250C-UNLIM SN74CB3Q3244PWR ACTIVE TSSOP PW 202000Pb-Free (RoHS)CU NIPDAU Level-1-250C-UNLIM SN74CB3Q3244RGYR ACTIVE QFN RGY 201000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR SN74CB3Q3244ZQNRACTIVEVFBGAZQN201000Pb-Free (RoHS)SNAGCULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -May not be currently available -please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead (Pb-Free).Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including therequirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean "Pb-Free"and in addition,uses package materials that do not contain halogens,including bromine (Br)or antimony (Sb)above 0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM25-Feb-2005元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. 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