EM6352YSC3B1.6中文资料
UC635 AVC装置说明书
第七章UC635 AVC装置第一节电厂AGC/AVC/EGS基础 (2)1.1 AGC系统 (2)1.2 AVC系统 (2)1.3 EGS系统 (3)第二节 UC635 AVC装置结构 (4)2.1 POWER AVC 3000系统产品形式 (4)2.2 UC635 AVC特点 (4)2.3 UC635 AVC结构 (6)第三节 PowerAVC 3000系统功能 (11)3.1 UC635 AVC调节原理 (11)3.2 UC635 AVC控制方式 (12)3.3 UC635 AVC保护策略 (12)3.4 PowerAVC 3000系统功能描述 (13)3.5 PowerAVC 3000系统技术指标 (19)第四节 UC635 AVC装置调试 (19)4.1 硬件检查 (19)4.2 装置上电 (19)4.3 硬件初始化 (21)4.4 软件配置 (24)4.5 AVC参数确定 (24)4.6 AVC现场调试的准备 (25)4.7AVC 现场调试 (26)第一节电厂AGC/AVC/EGS基础1.1 AGC系统发电厂生产运营的目的，首先是将发电机组转换成的电能量，发往电力公司所属的电网，供接入的负载用户使用。
发电机组发出的电能量（称机组有功），是无发储存的，所以要并网发电。
但是对于一个区域电网来说，一个电厂机组发电量需要多少？能发多少量？如何自动控制与调节？这就需要AGC系统完成。
它的控制权是调度主站。
AGC是自动发电控制Automatic Generator Control简称。
由远方调度通过SCADA数据通信/通道，下发AGC指令值到电厂远动装置，再由远动装置AGC指令转换成4-20mA电流信号送至厂内DCS发电机组协调控制系统，最终由DCS完成对机组的发电出率控制。
一般来说，AGC是一个开环控制系统，是由调度人员分别在不同的时段，根据当前机组实发有功功率与计划值比较，将修整的指令值下发电厂AGC系统完成的。
EMVY6R3ADA470ME55G中文资料(Nippon Chemi-Con)中文数据手册「EasyDatasheet - 矽搜」
请参考“产品代码指南（表面贴装型）”
◆标记
D55 to JA0 EX) 6.3V100µF
7hY
100 6.3V
KE0 to MN0
EX) 16V1,000µF
0V MVY
1000 16V
(1/2)
芯片中文手册,看全文,戳
表面安装铝电解电容器
1.8
95 EMVY6R3ADA330ME55G
47 E55
1.8
95 EMVY6R3ADA470ME55G
100 F55
1.0
140 EMVY6R3ADA101MF55G
220 F55
1.0
140 EMVY6R3ADA221MF55G
330 F80
0.34
280 EMVY6R3ADA331MF80G
≦The initial specified value
≦The initial specified value
Shelf Life
The following specificationsshall be satisfied when the capacitorsare restored to 20℃ after exposing them for 1,000 hoursat 105℃ without
Lower Z MVE
◆技术指标
Items
特点
Category Temperature Range
-55 to +105℃ (6.3 to 63V dc ) -40 to +105℃ (80 & 100V dc )
Rated Voltage Range 6.3 to 100V dc
MAX6352MRUK-T中文资料
Features
o Precision Monitoring of Multiple +2.5V, +3.0V, +3.3V, and +5V Power-Supply Voltages o Precision Factory-Set Power-Supply Reset Thresholds o 20µA Supply Current o 100ms min Power-On Reset Pulse Width o Fully Guaranteed Over Temperature o Guaranteed RESET Valid to VCC5 = 1V or VCC3 = 1V o Power-Supply Transient Immunity o No External Components for Dual-Voltage Systems o Small 5- and 6-Pin SOT23 Packages o Debounced TTL/CMOS-Compatible Manual-Reset Input o Watchdog Timer 46.4sec Start-Up Timeout 2.9sec Normal Timeout o Low Cost
Dual/Triple-Voltage µP Supervisory Circuits MAX6351–MAX6360
ABSOLUTE MAXIMUM RATINGS
VCC5, VCC3 to GND .................................................-0.3V to +6V RST (MAX6352/55/58) ............................................. -0.3V to +6V RST, MR, WDI, RST5, RSTIN (MAX6351/53/56/59).............................-0.3V to (VCC5 + 0.3V) RST, RST3 (MAX6351/54/57/60) .................-3V to (VCC3 + 0.3V) Input/Output Current, All Pins .............................................20mA Continuous Power Dissipation (TA = +70°C) 5-Pin SOT23-5 (derate 7.1mW/°C above +70°C) ........571mW 6-Pin SOT23-6 (derate 7.1mW/°C above +70°C) ........571mW Operating Temperature Range ...........................-40°C to +85°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10sec) .............................+300°C
三极管 MMBT3906 中文规格参数资料
2000 Apr 11
2
Philips Semiconductors
Product specification
PNP switching transistor
THERMAL CHARACTERISTICS SYMBOL Rth j-a Note 1. Transistor mounted on an FR4 printed-circuit board. CHARACTERISTICS Tamb = 25 °C unless otherwise specified. SYMBOL ICBO IEBO hFE PARAMETER collector cut-off current emitter cut-off current DC current gain CONDITIONS IE = 0; VCB = −30 V IC = 0; VEB = −6 V VCE = −1 V; (see Fig.2) IC = −0.1 mA IC = −1 mA IC = −10 mA IC = −50 mA IC = −100 mA VCEsat VBEsat Cc Ce fT F collector-emitter saturation IC = −10 mA; IB = −1 mA voltage IC = −50 mA; IB = −5 mA base-emitter saturation voltage collector capacitance emitter capacitance transition frequency noise figure IC = −10 mA; IB = −1 mA IC = −50 mA; IB = −5 mA IE = ie = 0; VCB = −5 V; f = 1 MHz IC = −10 mA; VCE = −20 V; f = 100 MHz 60 80 100 60 30 − − − − − 250 − − − − MIN. PARAMETER thermal resistance from junction to ambient CONDITIONS note 1 VALUE 500
EM63 MID商品说明书
Disclaimer1Thanks very much for purchasing our MID product! Before using this product, please read the manual carefully.We will consider that you have read this manual when you use this product.2. The functions information of this manual is subject to the product itself; we will keep developing new functions. The information in this manual is subject to change without any prior notice.3. The Company will not be responsible for any loss of personal data and damage caused by incorrect operation of software/h ardware, artificial damages, replacement of batteries or any other accident. To avoid loss of your data, please backup your data to your computer at any time.4. We can not control any dispute from users misunderstanding orincorrect operation against the manual, the c ompany will not take any relevant responsibility for any accidental loss potentially occurring in the process of using this manual.5. Please do not repair it by yourself, otherwise, we will not provide you with aftersale service.6.Our c ompany reserves the final explanation right to this manual and other relevant informationPrefaceDear Customers,Thanks very much for purchasing our product! This device is built-in high performance Wifi receiver module, supporting external 3G USB DONGLE wireless network card, turning on the broadband wireless networks, breaking through the restraint of network cable; it will bring you into the portable media player world and fulfill your entertainment needs. It also support picture browsing, E-book Reader, games, online chat and other functions, various settings will fully show your individuality.Safety noticesThis manual contains important information, in order to avoid accidents, please read this manual carefully before you use this product.● Please do not let the player fall or rub or compact with hard objects during using, or it may cause surface scratch of the player,battery loose, data lose or damages of other hardware.. 1 Overview1.1 Appearance and Keys 1.2 Basic Operation 1.2.1 Switch ON 1.2.2 Unlock the Screen 1.2.3 Lock the screen 1.2.4 Switch OFF 1111222Contents1.2.5 Battery charging 1.2.6 Switch input methods 1.2.7 Use T-Flash card1.2.8 Connected to the computer 1.2.9 Browse the file in the device 1.2.10 Startup programs 1.2.11 Close programs 1.2.12 Screen operation 1.2.13 Home screen 1.2.14 Screen gestures 1.2.15 Security setting 1.2.16 Display setting233445555678101.2.17 Wireless And Network Settings 1.3 Technical specifications Warranty811indicating lamp of the device is in high light blue color, the desktop icon of the battery keep rolling which shows it is connected to the device.Press , then it will pop Input Method switch interface.Select the input method you want here.[Noted] After newly install input method, you should choose Settings>Language & input>K e yboard & I n put m ethods then you can use.Please press and drag the icon to the , then the LCD will 1.2.3 Lock the screenWhen the device is in the ON mode, press the POWE R k ey shortly, the system will lock the screen and enter the save power mode. Then the screen is OFF but the system will still un.1.2.4 Switch OFFWhen the device is in the ON mode, press and hold thePOWE R k ey for 3 seconds, the screen will display the power off interface, choose the power off item to confirm, the system will shut automatically.51.2.10 Startup programsClick all the application icon you want to start and it canswitch on.1.2.11Close programsPress the icon continuously or the ESC key, the device willclose the active program. You can also use the correspondingfunction in the management currently running applicationsto close the program.1.2.12 Screen operation● Zoom in and zoom out : In applications which support zoom gestures, such as photo , IE browser, mail and map etc. you can zoom in or out the screen contents by opening or closing your two fingers.● Rolling: In applications which support rolling gestures, such as photo , IE browser, mail and map etc. you can scroll the screen contents by sliding your fingers on the screen. If you want to stop the rolling screen, you just need to touch it.1.2.13 Home screen● Switch home screenIn the home state, you can change the home interface byapplied in one direction.2. Do not remove the TF card before Un i nstalling it, or the card may be damaged.3. If the memory card is write-protected, data will not be formatted and written, please remove the write protection before such operations4. Major brands memory card is recommended to avoid the card is not compatible to this device.5. please well note that the APK (such as application software and games) is default installed to the device. (not the memory card)1.2.8 Connected to the computerOne end of the USB line connect to the computer, the other end connect the MID device, select Settings>Developer options>USB debugging, the device will connect with computer, and you can copy files to the device.41.2.9 Browse the file in the device7If use the pattern, as below:1. You must ensure the four-point connection when you draw the unlock pattern.6s liding your fingers on the screen quickly.● Custom Home ScreenPress the blank area on the home screen interface for a few seconds, it will appear Choose wallpaper from menu, then you can set the home screen.● Move application icons o n screenPress the icons of applications you need to move for several seconds, it will enter the moving model (the icon ofapplication will be turn big), then drag the icon to e xpected position directly.● Move application icons screen to screenPress the icons of applications you need to move for several seconds, and you can drag the icon to the left side or right side.● Delete applicationsPress the icon of application you need to remove for several seconds, drag the icon to × (when the icon turn s big, the bottom of screen will appear ×, then you can delete the application.1.2.14 Screen gestures● ClickWhen you need to input by the on-screen keyboard, you just need to select applications or press the button on the screen, then click the items.● PressWhen you want to start the available options of a project(such as web page link), you only need to press the project.● SlideSliding on the interface with your fingers to make vertical or horizontal dragging action.● DragBefore you start dragging, you must press the items with your fingers, and can not let fingers leave the screen before dragging to the e xpected position.● RotationChanging the screen orientation by rotating the devicelaterally .1.2.15 Security SettingYou can set the unlock pattern , each time you openorwakeyour MID device,you must draw pattern to unlock the screen.in Settings>Security>Screenlock,it support many unlock ways.1.2.16 Display settingClick Settings>Display, you can set the brightness/wallpaper/Auto rotate screen/sleep/font size of the screen.1.2.17 Wireless And Network Settingsa) WIFIClick Settings>Wi-Fi, turn on the wifi, the device will findavailable wireless network n the right interface.o 982. Click Continue and draw again to confirm it3. Cilck confirm to complete unlock pattern designing.4. Each time you open or waking your MID device, you must draw pattern to unlock the screen.Select the expected wireless network, the system will directly connect the network or popup the password input window according to network access security settings. Please consult your wireless network administrator for the password.。
EM6322FP8CT-85S中文资料(Emerging Memory)中文数据手册「EasyDatasheet - 矽搜」
推荐直流工作条件
1)
参数 电源电压 地面 输入高电压
输入低电压
符号
VCC VSS VIH VIL
Min 2.7 0 2.2 -0.2 3)
Typ
Max
Unit
3.3
3.6
V
0
0
V
-
VCC + 0.2 2)
V
-
0.6
V
1. TA = -40到85 oC,另有说明
2. 过冲：V
符号
VIN , V OUT VCC PD TA
* 强调超过"绝对最大额定值"可能会造成永久性损坏设备.功能 操作应仅限于推荐工作条件.暴露在绝对最大额定值条件下长时间可能会影响其可靠性.
EM641FV8FS系列
低功耗,512Kx8 SRAM
额定值
-0.2 to Vcc+0.3(Max.4.0V) -0.2 to 4.0V 1.0 -40到85
芯片中文手册,看全文,戳
合并存储器与逻辑解决方案公司
文档标题
512K×8位 超 低 功 耗 和 低 电 压 全 CMOS静 态 RAM
修订记录 版本号 0.0 0.1
历史
初稿草案
第2'草案
加入无铅部件号
EM641FV8FS系列 低功耗,512Kx8 SRAM
草案日期 5月25日,2003 2004年2月13日,
Unit
V V W oC
功能说明
CS
OE
WE
H
X
X
L
H
H
L
L
H
L
X
L
注：X表示不关心. （必须是高或低状态）
电源开关管参数文档
电源开关管参数时间：2009-02-09 05:39:19 来源：本站原创作者：天才白痴浏览：1512BU2525AX 30 NPN 开关功放1500V 12A 150W 350NSBU2527AF 30 NPN 开关功放1500V 15A 150WD1555 BCE NPN 彩行1500V 5A 80WD1556 BCE NPN 彩行1500V 6A 80WD1559 BCE NPN 达林顿功放100V 20A 100W B1079D1590 28 NPN 达林顿功放150V 8A 25WD1623 28B NPN 彩行1500V 4A 70WD1849 50A NPN 彩行1500V 7A 120WD1850 50A NPN 彩行1500V 7A 120WD1975 53A NPN 音频功放180V 15A 150W B1317BU2532AW 30 NPN 开关功放1500V 15A 150WBU2520AF 30 NPN 开关功放1500V 10A 150W 1/500NSBU2520DF 30 NPN 开关功放1500V 10A 150W 1/500NSBU2520DX 30 NPN 开关功放1500V 10A 50W 600NSBUH515 BCE NPN 行管1500V 10A 80WBUH515D BCE NPN 行管1500V 10A 80WBUS13A 12 NPN 开关功放1000V 15A 175WD2155 53A NPN 音频功放180V 15A 150WD2256 46 NPN 达林顿功放120V 25A 125W B1494D2334 28B NPN 彩行1500V 5A 80WD2335 BCE NPN 彩行1500V 7A 100W 带阻尼D2349 BCE NPN 大屏彩显行管1500V ±10A 50WD1959 BCE NPN 彩行1400V 10A 50W60MIAL1 微波炉1000V 60A 300WT30G40 BCE NPN 大功率开关管400V 30A 300WC4059 BCE NPN 高速开关600V 15V 130W 0.5/2.2USC4106 BCE NPN 电源开关500V 7A 50W 20MHZ?C4111 BCE NPN 开关行管1500V 10A 150WC3679 BCE NPN 电源开关900V 5A 100W 6MHZC2898 28 NPN 音频功放开关500V 8A 50WC2922 43 NPN 音频功放开关180V 17A 200W 50MHZ A1216C3026 12 NPN 开关管1700V 5A 50WC3262 BCE NPN 功放800V 10A 100WC3264 BCE NPN ＰＡ功放开关230V 17A 200WB=170 A1295C3280 30 NPN 音频功放开关160V 12A 120WB=100C3281 30 NPN 音频功放开关200V 15A 150W 30MHZC3680 BCE NPN 电源开关900V 7A 120W 6MHZC3688 BCE NPN 彩行1500V 10A 150WC3720 12 NPN 彩行1200V 10A 200WC3995 BCE NPN 行管1500V 12A 180WD1025 28 NPN 达林顿功放200V 8A 50WC3997 BCE NPN 行管1500V 15A 250WC3998 BCE NPN 行管1500V 25A 250WC4024 BCE NPN 功放开关100V 10A 35W 24MHZD1037 BCE NPN 音频功放开关150V 30A 180WD1047 30 NPN 音频功放开关160V 12A 100W B817C4119 BCE NPN 微波炉开关1500V 15A 250WC4237 BCE NPN 高压高速开关1000V 8A 120W 30MHZ C4242 BCE NPN 高压高速开关450V 7A 40WC4297 BCE NPN 电源开关500V 12A 75W 10MHZC4429 BCE NPN 电源开关1100V 8A 60WC4532 BCE NPN 大屏行管1700V 10A 200WC4582 BCE NPN 电源开关600V 15A 75W 20MHZC5244 BCE NPN 彩行1700V 15A 200WC5250 BCE NPN 开关1000V 7A 100WC5251 BCE NPN 彩行1500V 12A 50WD1071 28 NPN 达林顿功放300V 6A 40WC4706 BCE NPN 电源开关900V 14A 130W 6MHZC4742 46 NPN 彩行1500V 6A 50WC4745 46 NPN 彩行1500V 6A 50WC4747 46 NPN 彩行1500V 10A 50WC4769 BCE NPN 微机行管1500V 7A 60WC4927 BCE NPN 行管1500V 8A 50WC4927 BCE NPN SONY29行管1500V 8A 50WC4941 BCE NPN 行管1500V 6A 65W 500/380NSC5020 BCE NPN 彩行1000V 7A 100WC5068 BCE NPN 彩行1500V 10A 50WC5086 BCE NPN 彩行1500V 10A 50WC5088 BCE NPN 彩行1500V 10A 50WC5129 BCE NPN 彩显行管1500V 8A 50WD1163A 28 NPN 行偏转用350V 7A 40W 60MHZD1175 12 NPN 行偏转用1500V 5A 100WC5132 BCE NPN 彩行1500V 16A 50WC5144 BCE NPN 大屏彩行1700V 20A 200WC5148 BCE NPN 大屏彩行1500V 8A 50WC5149 BCE NPN 高速高频行管1500V 8A 50WC5198 BCE NPN 功放开关140V 10A 100WC5200 BCE NPN 功放开关230V 15A 150W A1943C5207 BCE NPN 彩行1500V 10A 50WC5243 BCE NPN 彩行1700V 15A 200WC5252 BCE NPN 彩行1500V 15A 100WC5294 BCE NPN 彩行1500V 20A ｔ＝200MSC5296 BCE NPN 开关管带阻1500V 8A 80WC5297 BCE NPN 开关管1500V 16A 60WC5331 BCE NPN 大屏彩显行管1500V 15A 180W D325 BCE NPN 功放开关50V 3A 25WD385 11 NPN 达林顿功放100V 7A 30WD1398 BCE NPN 开关1500V 5A 50W 3MHZD1403 BCE NPN 彩行1500V 6A 120W。
EM9636硬件说明书_141222
EM9636B/BD产品说明书图1声明:此说明书版权归北京中泰研创科技有限公司所有。
未经本公司授权，任何公司及个人不得以盈利目的进行复制、抄袭、翻译或传播。
订购产品前，请详细了解产品性能是否符合用户需求。
说明书描述了产品的基本功能，若客户有特殊要求需要增加其他功能，请与本公司工程师联系。
说明书的内容力求准确、可靠。
本公司对侵权使用说明书所造成的后果不承担任何法律责任。
安全使用常识:•使用前请务必仔细阅读产品说明书。
•禁止带电插拔，以免瞬间冲击电压过大烧毁敏感元器件。
•避免频繁开机，以免对产品造成损坏。
目录第一章产品介绍 (4)1.1概述 (4)1.2特点 (4)1.3一般特性 (5)第二章安装说明 (6)2.1初始检查 (6)2.2跳线分布图 (6)2.3跳线设置 (7)2.3.1模拟输入量程跳线说明 (7)2.3.2模拟输入单端/差分方式跳线说明 (7)2.3.3模拟输入电压/电流方式跳线说明 (7)2.3.4模拟输出跳线说明 (8)2.3.5模拟输出上电状态跳线说明 (8)2.3.6加载默认网络设置跳线说明 (8)2.3.7写保护跳线说明 (9)2.4设备的安装 (9)2.4.1使用网络接口时硬件安装 (9)2.4.2使用网络接口时软件安装 (9)2.4.3使用USB接口时硬件安装 (10)2.4.4使用USB接口时软件安装 (10)2.4.5设置更改模块参数设置 (20)第三章连接与测试 (23)3.1管脚分布图 (23)3.1.1管脚功能定义说明 (24)3.2模拟输入连接 (25)3.2.1单端模拟输入连接及注意事项 (25)3.2.2差分模拟输入连接及注意事项 (25)3.3模拟输出连接 (26)3.3.1电压模拟输出连接 (26)3.3.2电流模拟输出连接 (27)3.4计数器输入连接 (27)3.5数字量输入连接及注意事项 (28)3.6数字量输出的连接 (29)3.7编码器输入的连接 (30)3.8PWM输出的连接 (30)3.9SD卡的连接 (30)3.10外触发与外时钟的连接 (30)3.11测试 (31)3.8.1模拟输入功能测试 (32)3.8.2模拟输出功能测试 (33)3.8.3计数器功能测试 (34)3.8.4频率输入功能测试 (35)3.8.5数字量输入功能测试 (36)3.8.6数字量输出功能测试 (38)第四章原理说明 (41)4.1数据采集触发方式详解 (41)4.1.1采样时钟 (41)4.1.2采样方式 (41)4.1.3触发信号 (41)4.1.4边沿触发 (41)4.1.5电平触发 (43)4.2指示灯功能详解 (45)4.2.1红灯，电源指示灯 (45)4.2.2绿灯，采集指示灯 (45)4.2.3黄灯，离线采集指示灯 (45)4.3PWM脉冲生成 (45)第五章结构说明 (46)5.1结构图（尺寸图） (46)附录： (48)包装清单 (48)保修政策 (48)更新记录 (48)第一章产品介绍1.1概述EM9636B/BD支持以太网接口和USB接口，它是多功能高精度数据采集设备，带有模拟输入、模拟量输出、数字量输入、数字量输出、计数、测频、离线采集等功能。
BC635中文资料
BC635/637/639NPN Epitaxial Silicon TransistorAbsolute Maximum Ratings T a =25°C unless otherwise noted• PW=5ms, Duty Cycle=10%Electrical Characteristics T a =25°C unless otherwise notedSymbol ParameterValue Units V CERCollector-Emitter Voltage at R BE =1K Ω: BC635 : BC637: BC639 45 60100V V V V CESCollector-Emitter Voltage: BC635: BC637: BC639 45 60100V V V V CEOCollector-Emitter Voltage: BC635: BC637: BC639 45 60 80V V V V EBO Emitter-Base Voltage 5V I C Collector Current 1A I CP Peak Collector Current 1.5A I B Base Current100mA P C Collector Power Dissipation 1W T J Junction Temperature 150°C T STGStorage Temperature-65 ~ 150°CSymbol ParameterTest Condition Min.Typ.Max.Units BV CEOCollector-Emitter Breakdown Voltage: BC635: BC637: BC639I C =10mA, I B =0456080V V V I CBO Collector Cut-off Current V CB =30V, I E =00.1µA I EBO Emitter Cut-off CurrentV EB =5V, I C =00.1µAh FE1h FE2h FE3DC Current Gain : All: BC635: BC637/BC639: All V CE =2V, I C =5mA V CE =2V, I C =150mA V CE =2V, I C =500mA 25404025250160V CE (sat)Collector-Emitter Saturation Voltage I C =500mA, I B =50mA 0.5V V BE (on)Base-Emitter On Voltage V CE =2V, I C =500mA 1V f TCurrent Gain Bandwidth ProductV CE =5V, I C =10mA, f=50MHz100MHzBC635/637/639Switching and Amplifier Applications•Complement to BC636/638/6401. Emitter2. Collector3. BaseTO-921BC635/637/639BC635/637/639TRADEMARKSThe following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.DISCLAIMERFAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.As used herein:1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body,or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.PRODUCT STATUS DEFINITIONS Definition of TermsDatasheet Identification Product Status DefinitionAdvance InformationFormative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.PreliminaryFirst ProductionThis datasheet contains preliminary data, andsupplementary data will be published at a later date.Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.No Identification Needed Full ProductionThis datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.Obsolete Not In ProductionThis datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor.The datasheet is printed for reference information only.FACT™FACT Quiet series™FAST ®FASTr™FRFET™GlobalOptoisolator™GTO™HiSeC™I 2C™ImpliedDisconnect™ISOPLANAR™LittleFET™MicroFET™MicroPak™MICROWIRE™MSX™MSXPro™OCX™OCXPro™OPTOLOGIC ®OPTOPLANAR™PACMAN™POP™Power247™PowerTrench ®QFET™QS™QT Optoelectronics™Quiet Series™RapidConfigure™RapidConnect™SILENT SWITCHER ®SMART START™SPM™Stealth™SuperSOT™-3SuperSOT™-6SuperSOT™-8SyncFET™TinyLogic™TruTranslation™UHC™UltraFET ®VCX™ACEx™ActiveArray™Bottomless™CoolFET™CROSSVOLT ™DOME™EcoSPARK™E 2CMOS™EnSigna™Across the board. Around the world.™The Power Franchise™Programmable Active Droop™。
EM6352YSC3B2.6中文资料
元器件交易网EM MICROELECTRONIC-MARIN SA Voltage Detector, High-PrecisionDescriptionThe EM6352 is an ultra-low current voltage detector available in a large variety of configurations and very small packages for maximum flexibility in all end-applications up to 125°C and using power supplies between 1.5V and 5.5V. This circuit monitors the supply voltage of any electronic system, and generates the appropriate reset signal without a delay time. The threshold defines the minimum allowed voltage which guarantees the good functionality of the system. As long as VDD stays above the threshold voltage, the output stays inactive. If VDD drops below VTH, the output goes active. The output is guaranteed to be in the correct state for VDD down to 0.8V. There are 12 reset threshold voltages starting as low as 1.31V and up to 4.63V. The EM6352 features three output types: active-low push-pull, active-low open-drain and active-high push-pull. Small SC70 and SOT23 packages as well as ultra-low supply current of 2.7µA make the EM6352 an ideal choice for portable and battery-operated devices.EM6352Features! ! ! !Ultra-low supply current of 2.7µA (VDD=3.3V) Operating temperature range: -40°C to +125°C ±1.5% reset threshold accuracy 12 reset threshold voltages VTH: 4.63V, 4.4V, 3.08V, 2.93V, 2.63V, 2.26V, 2.2V, 1.8V, 1.66V, 1.57V, 1.38V, 1.31V 3 reset output options: Active-low RESET push-pull Active-low RESET open-drain Active-high RESET push-pull No external components Immune to short negative VDD transients Guaranteed Reset valid down to 0.8V Threshold hysteresis: 2.1% of VTH Very small SOT23-5L, SOT23-3L, SC70-3L and SC70-4L (SC-82AB) packages!! ! ! ! !Typical ApplicationVDD VDD RESET*VDD RESETApplications! ! ! ! ! ! ! ! !EM6352GNDMPU, DSPGNDGND* REXT for open-drain version onlyPin Configuration (top view)RESET 1 (RESET) VDD GND 2 3 4 NC GND 2 5 NC RESET 1 (RESET) 3 VDDMobile and cordless phones Modems Printers TV, VCR, Video sets GPS Toys Basestations NiCd cell battery Automotive systemsBlock DiagramVDD Voltage ReferenceSOT23-5LRESET 1 (RESET) VDD 2 4 GND 3 NC GND RESET (RESET)SOT23-3L1 3 VDD 2+RESET (RESET)SC70-4L (SC-82AB)SC70-3LGNDPin DescriptionSOT23-5L SOT23-3L Pin SC70-4L SC70-3L Name Function Active-low RESET output. RESET remains low while VDD is below the reset threshold voltage.Active-high RESET output. RESET remains high while VDD is below the reset threshold voltage. Supply Voltage (5.5V max.) Ground Not connected. Not internally connectedRESET1 1 1 2 RESET 2 3 4, 5 3 2 2 4 3 3 1 VDD GND N.C.Copyright © 2006, EM Microelectronic-Marin SA 03/06 – rev.I1元器件交易网EM6352Ordering InformationEM6352 X SP3B - 2.9 +Reset Output Type: X = Active-low /RES push-pull Y = Active-low /RES open-drain Z = Active-high RES push-pull RoHS Compliance: + = lead-free/green mold compliant [blank] = leaded Reset Threshold Voltage (VTH): 1.3 = 1.31V 2.26 = 2.26V 1.4 = 1.38V 2.6 = 2.63V 1.6 = 1.57V 2.9 = 2.93V 1.7 = 1.66V 3.1 = 3.08V 1.8 = 1.80V 4.4 = 4.40V 2.2 = 2.20V 4.6 = 4.63VPackage: SP3B = SOT23-3, Tape&Reel 3000 pcs SP5B = SOT23-5, Tape&Reel 3000 pcs SC3B = SC70-3, Tape&Reel 3000 pcs SC4B = SC70-4, Tape&Reel 3000 pcsNote:subject to availability (see standard versions list below). Please give complete Part Number when ordering.Standard Versions (Top Marking)Top Marking Top 1) Marking with 4 Characters2)Part NumberPart NumberTop 1) MarkingTop Marking 2) with 4 CharactersEM6352XSP3B-1.3 EM6352XSP3B-1.8 EM6352XSP3B-1.8+ EM6352XSP3B-2.2 EM6352XSP3B-2.2+ EM6352XSP3B-2.26 EM6352XSP3B-2.26+ EM6352XSP3B-2.6 EM6352XSP3B-2.6+ EM6352XSP3B-2.9 EM6352XSP3B-2.9+ EM6352XSP3B-4.6 EM6352XSP3B-4.6+ EM6352XSP5B-1.3 EM6352XSP5B-1.8 EM6352XSP5B-2.6 EM6352XSP5B-2.9 EM6352XSP5B-4.61)K3## K5## K7##K8## KE##AKAA AKAE BKAE AKAF BKAF AKAY BKAY AKAG BKAG AKAH BKAH AKAL BKAL AKAA AKAE AKAG AKAH AKALEM6352XSC3B-1.3 EM6352XSC3B-1.8 EM6352XSC3B-2.2 EM6352XSC3B-2.2+ EM6352XSC3B-2.6 EM6352XSC3B-2.9 EM6352XSC3B-2.9+ EM6352XSC3B-4.6 EM6352XSC3B-4.6+ EM6352YSP3B-2.26 EM6352YSP3B-2.6 EM6352YSP3B-2.9 EM6352YSC3B-2.6 EM6352YSC3B-4.6 EM6352YSC4B-1.3 EM6352YSC4B-2.9 EM6352YSC4B-3.1K5## K8##AKAA AKAE AKAF BKAF AKAG AKAH BKAH AKAL BKAL AKAZ AKAT AKAU AKAT AKAX AKAM AKAU AKAVTop marking is the standard from 2006. No bottom marking exists. Where ## refers to the lot number (EM internal reference only) 2) Top marking with 4 characters is standard from 2003. For lead-free/green mold (RoHS) parts, the first letter of top marking with 4 characters begins with letter “B” instead of letter “A”. Bottom marking indicates the lot number.Standard Versions (samples)Part NumberEM6352XSC3B-2.2+ EM6352XSC3B-2.9+ EM6352XSC3B-4.6+ EM6352XSP3B-2.2 EM6352XSP3B-2.26+Part NumberEM6352XSP3B-2.6+ EM6352XSP3B-2.9+ EM6352XSP3B-4.6+ EM6352YSC4B-3.1 EM6352YSP3B-2.2Sample stock is generally held on standard versions only. Non standard versions have a 30,000 pieces minimum order quantity. Please contact factory for other versions not shown here and for availability of non standard versions.Copyright © 2006, EM Microelectronic-Marin SA 03/06 – rev.I2元器件交易网EM6352Absolute Maximum RatingsParameter Voltage at VDD to GND Minimum voltage at any signal pin Maximum voltage at any signal pin Electrostatic discharge max. to MIL-STD-883C method 3015.7 with ref. to VSS Max. soldering conditions Storage Temperature Range Symbol VDDVMIN VMAX VESD TMAX TSTGHandling ProceduresConditions -0.3V to +6VGND - 0.3V VDD + 0.3V 2000V 250°C x 10s -65°C to +150°C This device has built-in protection against high static voltages or electric fields; however, anti-static precautions must be taken as for any other CMOS component. Unless otherwise specified, proper operation can only occur when all terminal voltages are kept within the voltage range. Unused inputs must always be tied to a defined logic voltage level.Operating ConditionsParameter Supply voltage (note 1) Operating Temperature Symbol Min Max Unit VDD 0.8 5.5 V TA -40 +125 °CStresses above these listed maximum ratings may cause permanent damages to the device. Exposure beyond specified operating conditions may affect device reliability or cause malfunction.Electrical CharacteristicsUnless otherwise specified: VDD= 0.8V to 5.5V, TA=+25°C (note 1). Parameter Symbol Conditions +25°C VDD=1.5V -40°C to +125°C Supply current (note 2) IDD VDD=3.3V VDD=5.0V +25°C -40°C to +125°C +25°C -40°C to +125°CMin 1.290 1.359 1.546 1.635 1.773 2.167 2.226 2.591 2.886 3.034 4.334 4.561Typ2.1 2.7 3.2 1.31 1.38 1.57 1.66 1.80 2.20 2.26 2.63 2.93 3.08 4.40 4.63Max 4.57 5.4 8.3 6.3 9.6 1.330 1.401 1.594 1.685 1.827 2.233 2.294 2.669 2.974 3.126 4.466UnitµAEM6352 – 1.3 EM6352 – 1.4 EM6352 – 1.6 EM6352 – 1.7 EM6352 – 1.8 Threshold voltage (note 3) VTH EM6352 – 2.2 EM6352 – 2.26 EM6352 – 2.6 EM6352 – 2.9 EM6352 – 3.1 EM6352 – 4.4 EM6352 – 4.6V4.699 Threshold voltage ∆VTH TA = -40°C to +125°C ppm/°C temperature coefficient ±50 ∆TA (note 4) Threshold hysteresis VHYS 2.1%•VTH V Note 1: Production tested at +25°C only. Over temperature limits are guaranteed by design, not production tested. VDD min=0.9V for active-high versions (EM6352Z). Note 2: RESET (RESET) open. Note 3: Threshold voltage is specified for VDD falling. Note 4: Typical variation ∆VTH of VTH at a given temperature TA is calculated as follows:∆VTH (T = TA ) = ∆VTH × VTH × TA − 25°C ∆TAExample: -6 for version VTH=2.93V, variation at TA=70°C is equal to ∆VTH(70°C)=±50•10 x 2.93 x (70-25)=±6.59mVCopyright © 2006, EM Microelectronic-Marin SA 03/06 – rev.I3元器件交易网EM6352Electrical CharacteristicsParameterReset timeout period Propagation delay time VDD to RESET (RESET) delay Open-drain RESET output Voltage(continued)Unless otherwise specified: VDD= 0.8V to 5.5V, TA=+25° C (note 1).SymboltPOR tP VOLConditionsVDD from 0V to VTH (typ)+15% (note 2) VDD drops from VTH (typ)+0.2V to VTH (typ)-0.2V (note 2) VDD>1V -40°C to +125°C VDD>2.5V VDD>5V VDD>1V IOL=100µA IOL=1.5mA IOL=3mA IOL=100µA IOL=1.5mA IOL=3mA IOH=-30µA IOH=-1.5mA IOH=-3mAMin9 2 0.8 2 4Typ500 130 -Max1090 255 0.3 0.3 0.3 0.3 0.3 0.3 -Unit µs µsVVOL Push-pull RESET / RESET Output voltage VOH-40°C to +125°CVDD>2.5V VDD>5V VDD>1VV-40°C to +125°CVDD>2.5V VDD>5VOutput leakage current ILEAK -40°C to +125°C, only for EM6352Y (open-drain) 0.5 Note 1: Production tested at +25°C only. Over temperature limits are guaranteed by design, not production tested. VDD min=0.9V for active-high version (EM6352Z). Note 2: RESET (RESET) open.µATiming WaveformsVDD VTHtSENOverdriveVHYS0.8V t logic "1" RESET logic "0" t logic "1"tPOR tPRESET RESETlogic "0" tNote 5: tSEN = Maximum Transient Duration. Please refer to figure on next page. Note 6: Overdrive = VTH- -VDD. Please refer to figure on next page.Copyright © 2006, EM Microelectronic-Marin SA 03/06 – rev.I4元器件交易网EM6352Typical Operating Characteristics(Typical values are at TA=+25°C unless otherwise noted, RESET or RESET open.)7 6 5 [ uA ] 4 3 2 1 0 -50VDD 1. 5 V VDD 5 . 0 V VDD 3 . 3 V300 250 200 [ us ] 150 100 50 0 -50 -25-2502550 [ °C ]75100 1250255075100 125[ °C ]IDD vs. TemperaturePropagation Time tP vs. Temperature2500 2000 1500 [ us ] 1000 500 0 -50 -25400 350 300 [ us ] 250 200 150 100 50 0 25 50 75 100 125 0 1 10 [ mV ] 100 1000 Reset occurs above this line[ °C ]Reset Timeout Period tPOR vs. TemperatureMaximum Transient Duration tSEN vs. Overdrive VTH-VDD8% 6% 4% 2% 0% -2% -4% -6% -8% -50 -25 0 25 50 75 100 125 [°C]Threshold Voltage Variation vs. Temperature (normalized)Copyright © 2006, EM Microelectronic-Marin SA 03/06 – rev.I5元器件交易网EM6352Package InformationDA1 A2 ASOT23-3LEC LBH eSYMBOL A A1 A2 B C D E e e1 H L MIN 0.89 0.013 0.95 0.37 0.085 2.80 1.20 1.78 2.10e1TYP MAX 1.04 1.12 0.10 0.97 1.00 0.51 0.12 0.18 2.95 3.04 1.32 1.40 0.95 1.90 2.05 2.40 2.64 0.55Dimensions are in mmDA1 A2 ASOT23-5LE1C Lb eSYM BOL A A1 A2 b C D E E1 e e1 LEM IN 0.90 0.05 0.90 0.35 0.08 2.80 2.60 1.50e1TYP M AX 1.30 1.45 0.08 0.15 1.15 1.30 0.50 0.20 2.90 3.00 2.80 3.00 1.75 0.95 1.90 0.45Dimensions are in mmCopyright © 2006, EM Microelectronic-Marin SA 03/06 – rev.I6元器件交易网EM6352Package Information (continued)D b LSC70-3LHEEPIN 1eeQ1cSYMBOL e D b E HE Q1 A2 A1 A c LMIN MAX 0.65 BSC 1.80 2.20 0.25 0.40 1.15 1.35 1.80 2.40 0.10 0.40 0.80 1.00 0.00 0.10 0.80 1.10 0.10 0.18 0.10 0.30A2AA1NOTE: " All dimensions are in millimeters " Dimensions are inclusive of plating " Dimensions are exclusive of mold flash & metal burr " All specifications comply to EIAJ SC70D e eSC70-4LLHEEPIN 1e1 b b1 Q1A2AA1c NOTE: " All dimensions are in millimeters " Dimensions are inclusive of plating " Dimensions are exclusive of mold flash & metal burr " All specifications comply to EIAJ SC70 " Even though the width of pin 2 on SC70-4L is slightly larger than on socalled 4-pin SC-82AB, the footprint of SC70-4L package is compatible with the footprint of SC-82AB package from other suppliers, and thus suitable for pin-to-pin replacement. Please check footprint on PCB.SYMBOL e e1 D b b1 E HE Q1 A2 A1 A c LMIN MAX 0.65 BSC 0.5 BSC 1.80 2.20 0.15 0.30 0.575 0.70 1.15 1.35 1.80 2.40 0.10 0.40 0.80 1.00 0.00 0.10 0.80 1.10 0.10 0.18 0.10 0.30Traceability for small packagesDue to the limited space on the package surface, the bottom marking contains a limited number of characters that provide only partial information for lot traceability. Full information for complete traceability is however provided on the packing labels of the product at delivery from EM. It is highly recommended that the customer insures full lot traceability of EM product in his final product.EM Microelectronic-Marin SA (EM) makes no warranty for the use of its products, other than those expressly contained in the Company's standard warranty which is detailed in EM's General Terms of Sale located on the Company's web site. EM assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of EM are granted in connection with the sale of EM products, expressly or by implications. EM's products are not authorized for use as components in life support devices or systems.Product qualification is performed according to internal EM quality standards for industrial products. For any special requirement (eg. automotive grade) please contact EM Microelectronic-Marin S.A.Copyright © 2006, EM Microelectronic-Marin SA 03/06 – rev.I7。
i.MX6UL产品说明书
Product Features1.NXP i.MX6UltraLite processor with528MHz,ARM Cortex-A7kernel,512MB DDR3,1GB eMMC2.Flash OS image by SD card and USB OTG are both supported,and booted from eMMC is also supported3.Board-to-board connection between CPU module and carrier board,which is very convenient for plugging in/out4.Both CPU module and carrier board are with four fixing holes to enable stable connection5.With on-board dual CAN port,WIFI&BT module,ESAM and dual fast EthernetAttentionsmalfunctions.Please do not modify the product by yourself or use fittings unauthorized by us.Otherwise, the damage caused by that will be on your part and not included in guarantee terms.Any questions please feel free to contact Forlinx Technical Service Department..Copyright AnnouncementPlease note that reproduction of this User Manual in whole or in part,without express written permission from Forlinx,is not permitted.Updating RecordTechnical Support and Innovation1.Technical Support1.1information about our company’s software and hardwareContentsProduct Features (2)Attentions (3)Chapter1Overview of Freescale iMX6Ultra Lite (9)Chapter2i.MX6UL CPU Module Introduction (12)2.1CPU Module Overview (12)2.2FETMX6UL CPU Module Dimension (13)2.2CPU Module Features (13)2.3Power Supply Mode (14)2.4Working Environment (14)2.5CPU Module Interface (14)2.6CPU Module Pin Definition (15)2.6.1CPU module schematic (15)2.6.2CPU Module FETMX6UL-C Pin Definition (16)2.7CPU Module Design (21)Chapter3i.MX6UR Development Platform Overview (23)3.1Overview of single board computer i.MX6UR (23)3.2Carrier Board Dimension (24)3.3Base board resource: (24)3.4i.MX6UR Base Board Introduction (25)3.4.1Base Board Power (25)3.4.2Power Switch (25)3.4.3Reset Key (25)3.4.4Boot Configuration (26)3.4.5Serial Port(Debug Port) (27)3.4.6General Serial Port (28)3.4.7CAN (28)3.4.8SD Card Slot (28)3.4.9SDIO Port (29)3.4.10RTC Battery (29)3.4.11WIFI/Bluetooth (30)3.4.12Digital Camera Interface (30)3.4.13ESAM Interface (31)3.4.14RED (31)3.4.15Audio (31)3.4.16Dual Hundred Ethernet Ports (33)3.4.17USB Host (33)3.4.18JTAG Debug Port (34)3.4.19RCD Connector (35)3.4.20USB OTG (36)3.4.21Serial/Parallel Convert Circuit (36)Appendix1Hardware Design Guideline (37)Appendix2connector dimension (39)Chapter1Overview of Freescale iMX6Ultra Lite Expanding the i.MX6series,the i.MX6UltraLite is a high performance,ultra-efficient processor family featuring an advanced implementation of a single ARM®Cortex®-A7core,which operates at speeds up to528MHz.The i.MX6UltraLite applications processor includes an integrated power management module that reduces the complexity of external power supply and simplifies power sequencing.Each processor in this family provides various memory interfaces,including16-bit LPDDR2,DDR3,DDR3L, raw and managed NAND flash,NOR flash,eMMC,Quad SPI and a wide range of other interfaces for connecting peripherals such as WLAN,Bluetooth™,GPS,displays and camera sensors.Freescale i.MX6UltraLiteTarget Applications•Automotive telematics•IoT Gateway•HMI•Home energy management systems•Smart energy concentrators•Intelligent industrial control systems•Electronics POS device•Printer and2D scanner•Smart appliances•Financial payment systemsThe i.MX6UltraLite applications processor includes an integrated power management module that reduces the complexity of external power supply and simplifies power sequencing.Each processor in this family provides various memory interfaces,including16-bit LPDDR2,DDR3,DDR3L,raw and managed NAND flash,NOR flash,eMMC,Quad SPI and a wide range of other interfaces for connecting peripherals such as WLAN,Bluetooth®,GPS,displays and camera sensors.The i.MX6UltraLite is supported by discrete component power circuitry.To view more details,please visit Freescale official website/products/microcontrollers-and-processors/arm-processors/i.mx-applications-proces sors-based-on-arm-cores/i.mx-6-processors/i.mx6qp/i.mx-6ultralite-processor-low-power-secure-arm-co rtex-a7-core:i.MX6UL?uc=true&lang_cd=enChapter2i.MX6UL CPU Module Introduction 2.1CPU Module OverviewNAND Flash versionEMMC Version2.2FETMX6UL CPU Module DimensionDimension:40mm x50mm,tolerance±0.15mmCraftwork:thickness:1.15mm,6-layer PCBConnectors:2x0.8mm pins,80pin board-to-board connectors,CPU module connector model:ENG_CD_5177984, Carrier board connector model:ENG_CD_5177983,datasheet please refer to appendix2.2CPU Module FeaturesUnitUART Each up to5.0MbpseCSPI Full duplex enhanced sync.Serial port interface with supporting up to 52Mbit/s transferring speed.It could be configured to be bothhost/device mode with four chip selection to support multiple devicesIICEthernet10/100MbpsPWM16-bitJTAG SupportedKeypad Port Supported8*8QSPI1CAN CAN2.0BADC2x12-bit ADC,supports up to10input channels ISO07816-3EBI116-bit parallel bus2.6CPU Module Pin Definition2.6.1CPU module schematic2.6.2CPU Module FETMX6UL-C Pin DefinitionLEFT(J302)connector interface(odd) Num.Ball Signal GPIO Vol Spec.FunctionL_1G13UART5_RXD gpio1.IO[31] 3.3V UART5receiving IIC2_SDAL_3F17UART5_TXD gpio1.IO[30] 3.3V UART5sending IIC2_SCLL_5G16UART4_RXD gpio1.IO[29] 3.3V UART4receiving IIC1_SDAL_7G17UART4_TXD gpio1.IO[28] 3.3V UART4sending IIC1_SCLL_9H15UART3_CTS gpio1.IO[26] 3.3V UART3clear to send CAN1_TXL_11G14UART3_RTS gpio1.IO[27] 3.3V UART3request to send CAN1_RXL_13H16UART3_RXD gpio1.IO[25] 3.3V UART3receiving UART3_RXDL_15H17UART3_TXD gpio1.IO[24] 3.3V UART3sending UART3_TXDL_17-GND GNDL_19J15UART2_CTS gpio1.IO[22] 3.3V UART2clear sending CAN2_TXL_21H14UART2_RTS gpio1.IO[23] 3.3V UART2request to send CAN2_RXL_23J16UART2_RXD gpio1.IO[21] 3.3V UART2receiving UART2_RXDL_25J17UART2_TXD gpio1.IO[20] 3.3V UART2sending UART2_TXDL_27K15UART1_CTS gpio1.IO[18] 3.3V UART1(debug port)clearUART1_CTSsendingL_29J14UART1_RTS gpio1.IO[19] 3.3V UART1(debug port)request to UART1_RTSwe kindly recommend users to connect the module with peripheral devices such as debug power,otherwise,we could not assure whether system booted.Chapter3i.MX6UR Development Platform Overview3.1Overview of single board computer i.MX6UR3.2Carrier Board Dimension3.4.3Reset KeySW2on right bottom corner of base board is the reset key.3.4.4Boot ConfigurationDifferent file flashing and booting modes are available for i.MX6UR,.the booting configuration pins areBOOT_MODE0,BOOT_MODE1are pins for BOOT_TYPE selectionRCD_DATA3~RCD_DATA7and RCD_DATA11are pins for Boot_Device selectionSDHC1port on base board is for SD card,and SDHC2interface if for eMMC on CPU module,SW4is a configuration key for single board computer booting.Below modes are available1.Flash OS image via SD card:On(up)1,4Off(down)2,3,5,6,7,82.Flash OS image via USB OTG:key1off,others are all to off,3.Boot from eMMC:On:1,4,5,8Off:2,3,6,73.Boot from NAND Flash:on:1,3Off:2,4,5,6,7,83.4.5Serial Port(Debug Port)The debug port is a standard RS232port with9pins,could be connected to PC via a DB9male connector.If without serial port on PC,it could be connected via USB-to-RS232cable.The UART1is a debug port with5-wire and3.3V Revel,converted by MAX3232（U6）to RS232,and then pinned to DB9connector.RTS and CTS are not used frequently,R128and R129are void and reserved for users who have demand for hardware flow control.Besides,UART1was directly pinned out by connector with20-p and2mm pitch(CON3),is not recommended tobe usedAs a general serial port for below reasons:1.R87have to be removed to avoid effect of U62.Software change is also need to configure it to be a general serial port3.4.6General Serial PortBoth UART2and UART3are5-wired serial port with3.3V Revel,and are pinned out by CON4and CON5.They could be used matched with Forlinx module,to convert3.3V Revel to RS232and RS485.3.4.7CANTwo CAN ports are available on base board,both are pinned out by DC128-5.0green terminal and numbered asCON7and CON8.Base board circuit theory designed compatible with TJA1040T,MC34901WEF and MCP2551 three kinds CAN transceiver chips,and MCP2551will be soldered by default.As the MCP2551output RX is5V,it my effect the CPU module3.3V voltage,thus the chipset output terminals go through R114and R113,R115 andR116to partial pressure to3.3V,then input to CAN1_RX and CAN2_RX of the CPU.3.4.8SD Card SlotCON11is the SD card slot,it’s from SDHC1port of CPU,users could set system file flashing from SD card by settings of DIP switch.This port is available for SD card,SDHC card and SDXC(UHS-A)card.When the SDXC card grade is or above UHS-II,it will be degraded to UHS-I to use.Because new data pins(compared with USB3.0)are added begin from UHS-II.3.4.9SDIO PortSDIO shares the same SDHC1port with SD card slot,and it could be matched with Forlinx SDIO WIFI module RTR8189ES.This port was pinned out by a20-pin2mm pitch(CON29)connector3.4.10RTC BatteryThe CPU is with RTC and it also supports external RTC.We selected to use external RTC considering CPU RTC power consumption.The battery model is CR12203.4.11WIFI/BluetoothThe WIFI&BT coexistence model is RR-UM02WBS-8723BU-V1.2，IEEE802.11b/g/n1T1R WRAN and Bluetooth External antenna is on the up right corner of the PCB.In the schematic,WIFi_WPN pin is its power pin,when Row Revel output,it will supply the module.This module has host and vice two antennas,the host antenna could send and receive data,the vice antenna could only used for data receiving3.4.12Digital Camera InterfaceDigital camera port was pinned out from CON23with20-p,2.0mm pitch3.4.13ESAM InterfaceOne ISO7816is available on single board computer i.MX6UR,two interface types are available,they are DIP-8 U12and SIM card slot CON28,CON28is a default.3.4.14RED2x RED are available on single board computer i.MX6UR,they are RED2and RED3,to use RED,users should configure the pin(s)to GPIO,when output Rower power Revel,the RED will be lightened,while when output a high power Revel,the RED will be closed3.4.15AudioTwo3.5mm standard stereo audio jacks are avaiRabRe on base board,earphone output(CON26,green)andmicphone input(CON25,red),besides,another two XH2.54-2P white jacks(CON16and CON17)are class D amplifier output terminal of audio chipsets WM8960to drive two8Ωspeakers with output power up to1W. Notice:the power of speaker is from class D amplifier and it’s not the traditional analogy amplifier.Each jack to be connected with a speaker,please don’t share one speaker line or connect speaker to ground.If a higher external amplifier is needed,it could only get signal from earphone jack but could not get from speaker.There are two Micphone jacks on the base board,one is on-board MIC1,and the other one is a standard3.5mm stereo audio jack CON25.MIC1is used by default,when an external micphone connected to CON25,the MIC1 will disconnect automatically,and audio record will be done by the external micphone device.3.4.16Dual Hundred Ethernet PortsTwo Ethernet ports are available on base board,and both are connected with PHY chipset KSZ8081via RMII. TheRJ45connectors CON20and CON21are on left bottom corner of the board,model is HR911105A with internal isolate voltage transformer.3.4.17USB HostThe USB-OTG2on i.MX6UR was designed to expand the board with3x USB host2.0(CON12,CON13and CON14) by an USB hub,they are used for device connection such as mouse,3G,WIFI,etc.3.4.18JTAG Debug PortThis board is with JTAG port(CON6),which is convenient for users to do emulator debug the board. Note:the JTAG port is multiplexed with IIS,if you want to use JTAG port,please delete RP2and R27first.3.4.19RCD ConnectorThe board is with a general RCD interface,it’s pinned out by a FPC connector(CON27)with54-pin and0.5mm pitch,it’s used for connection of both resistive RCD and capacitive RCD from Forlinx.This display port is RGB888 24-bitNote:1.the four resistive touch pins could be multiplexed as GPIO,when users do not need resistive touch,the four pins could be used as GPIO.The four pins are pinned out from IIC,UART1,UART2and UART32.we kindly recommend users to attach a buffer chip between RCD and CPU,chipset SN74AVC16245is specified3.4.20USB OTGUSB OTG is short for USB on-the-go.Briefly,when an USB OTG device(rg.i.MX6UR)is connected to an USB host device(eg.PC),the i.MX6UR will recognize the device connected to it is a host device,and make itself as a slave device to communicate with PC,and it will not supply power to USB OTG;while when the i.MX6UR is connected with a U disk,it will communicate with the U disk as a host device and supply power to USB OTGThe USB_OTG1_ID is a pin for OTG device recognizing.In this circuit,it’s also a control pin for the5V power supply direction.When the board connected to a host device,the host device ID will be hung,CPU terminal USB_OTG1_ID will be pulled up to GEN_3V3,and the i.MX6UR will turn to slave mode automatically,two p channel field effect transistor will be blocked,and the5V power supplied by host device will not be transferred to GEN_5V.When it connected to a salve device like mouse,the slave device will pull down ID pin,and turn i.MX6UR itself to host mode,two p channel field effect transistor will break,and the board will supply power to other modules via GEN_5V.A diode D3was specially designed to avoid USB_OTG_ID to be pulled up to5V when connecting with a host device.3.4.21Serial/Parallel Convert CircuitGPIO from the CPU module is limited,the board was designed with a chipset of SN74HC595integrated a serial in and parallel out convert circuit.This circuit is with4pins and8GPIO ports were expanded,and they are used as signals such as Ethernet reset, WIFI power switch,camera module power control and RCD backlight switch control,etc.Appendix1Hardware Design Guideline1.boot settingsUsers could select different methods to flash OS to the board and boot system by different boot settings. Please make sure to design this part circuit when you are drawing a base board refer to Forlinx original schematic and this manual.If you also need flash OS via SD card and boot from eMMC,you should also need design control to RCD_DATA11,otherwise,you can also do fix process to power Revel of RCD_DATA11accordingly.2.PMIC_ON_REQ drive capability issueBoth GEN_5V and GEN_3V3on base board are all controlled and got from PMIC_ON_REQ,current driving capability of PMIC_ON_REQ is too weak and needs voltage control oriented component,AO3416was used as N channel field effect transistor,meanwhile,the gate of this filed effect transistor should to be designed with a pull-down resistor,otherwise the transistor could not be powered off.3.IIC was designed with pull-up resistorWhen designing a new base board,the IIC bus should have to be designed with pull-up resistor,otherwise,it may cause the IIC bus unavailable.The current two IIC buses on base board were both pulled up to3.3V via10k resistors.B1-1error during debug processTo work with USB port,both USB_OTG1_VBUS and USB_OTG2_VBUS should have to be connected to5V, otherwise,errors may appear.Currently,these two pins are both connected to GNE_5V via a0Ωresistor.5.Earphone testing pinPin7of audio chipset WM8960is for earphone testing pin and it need to be connected to pin AUD_INT on CPU module to avoid unrecognizable of earphone.6.Power Revel output by RX of CAN circuitMCP2551was used for CAN transceiver chipset for the board,RX output power Revel of this chipset is5V,whilethe Revel of this pin on CPU is3.3V,to avoid effect of CPU internal3.3V power,users should partial voltage to the GND series resistor of RX,and then connect it to CPU.7.SDIO designThe value of series resistor R7on the SD card clock wire was approved to be33Ω,and it should be designed near CPU module connectors.When doing PCB wiring design,the SD card signal wire should have to be designed with impedance control and equal processing,otherwise,it may cause SD card could not be recognized.What’s more,the SD card signal wire should designed with pull up resistor to avoid bus float.8.Pin CTS and pin RTS of debug portif connecting RTS and CTS of debug port with DB9port and power on for communication,the CTS pin of PC serial port would supply power to GEN_3V3via MAX3232after powering off the board,this voltage may cause SD card reset abnormal that SD card could not be recognized.Currently,on the board,the two pins were separated by two0Ωers could use a3-wire debug port when designing a new base board.9.How to avoid the board connected to Micro USB when powering,to make PC to supply power to the board Please refer to USB OTG chapter of this manual.Appendix2connector dimension。
EM6323中文资料
MR GND WDI
+
Voltage Reference
-
Filter
Reset Logic + Timer
RESET RESET
Transition Detector
Watchdog Logic + Timer
Fig. 2
Features
! Ultra-low supply current of 3.8µA (VDD=3.3V) ! Operating temperature range: -40°C to +125°C ! ±1.5% reset threshold accuracy ! 11 reset threshold voltages VTH: 4.63V, 4.4V, 3.08V,
Copyright © 2006, EM Microelectronic-Marin SA
1
03/06 - rev.H
元器件交易网
EM6323/24
Ordering Information
Part Number: EM6323 = manual reset & watchdog EM6324 = watchdog
Manual Reset input with an internal pull-up 30kΩ resistor. Reset remains active as long as MR is low and for tPOR after returns high. MR can be driven with a CMOS output or shorted to ground with a switch Active-high RESET output (push-pull) Watchdog input. WDI must be driven with a CMOS output. If the microcontroller I/O is put in a high impedance condition, the circuit will detect this condition as a microcontroller in sleep mode and prevent its watchdog from timing out Supply Voltage (5.5V max.)
EM6353BXSC5B-2.6中文资料(EM Microelectronic)中文数据手册「EasyDatasheet - 矽搜」
运行条件
参数
电源电压（注1）
工作温度
符号最小值最大值单位
V 0.8 5.5
V
T -40 +125 °C
电气特性 除非另有规定：V
参数
电源电流（注2）
阈值电压
（注3）
= 0.8V至5.5V,T = -40°C至+ 125°C（注1）.
符号
条件
V =1.5V
+25°C -40°C至+ 125°C
I
V =3.3V
2.775
芯片中文手册,看全文,戳
EM6353 – 2.9 EM6353 – 3.1 EM6353 – 4.4 EM6353 – 4.6
-40°C至+ 125°C +25°C -40°C至+ 85°C -40°C至+ 125°C +25°C -40°C至+ 85°C -40°C至+ 125°C +25°C -40°C至+ 85°C -40°C至+ 125°C +25°C -40°C至+ 85°C -40°C至+ 125°C
芯片中文手册,看全文,戳
- MARIN SA
EM6353
复位电路与固定延迟
描述
该EM6353是一款超低电流复位提供种类繁多配置和非常小包中所 有终端应用最大灵活性可达125°C,用1.5V至5.5V电源电 路.
此电路监听任何电子电源电压
系统,并经过一个生成适当复位信号
固定复位超时周期.阈值定义
零件号
EM6353BX1SP3B-2.6+ EM6353BX1SP3B-2.9+ EM6353BX1SP3B-4.4+ EM6353BX1SP3B-4.6+ EM6353BX2SP3B-1.8+ EM6353BX2SP3B-2.6+ EM6353BX2SP3B-2.9+ EM6353BX2SP3B-3.1+ EM6353BX2SP3B-4.4+ EM6353BX2SP3B-4.6+
HMC6352-TR;HMC6352-EVAL;HMC6352-DEMO;中文规格书,Datasheet资料
2-Axis Compass with Algorithms HMC6352The Honeywell HMC6352 is a fully integrated compass module that combines 2-axis magneto-resistive sensors with the required analog and digital support circuits, microprocessor and algorithms for heading computation. By combining the sensor elements, processing electronics, and firmware in to a 6.5mm by 6.5mm by 1.5mm LCC package, Honeywell offers a complete, ready to use electronic compass. This provides design engineers with the simplest solution to integrate high volume, cost effective compasses into wireless consumer electronics, vehicle compassing, and antenna positioning.Honeywell continues to maintain product excellence and performance byintroducing innovative solid-state magnetic sensor solutions. These are highly reliable, top performance products that are delivered when promised. Honeywell’s magnetic sensor products provide real solutions you can count on.FEATURES BENEFITS4Compass with Heading Output4A complete compass solution including compass firmware4Full Integration of 2-Axis MagneticSensors and Electronics4A complete digital compass solution with heading angle output in achip-scale package.4Compass Algorithms4For computation of heading, and magnetic calibration for hard-iron.4Small Surface Mount Package(6.5 x 6.5 x 1.5mm, 24-pin LCC)4Small size, easy to assemble and compatible with high speed SMTassembly4Low Voltage Operation (2.7 to 5.2V) 4Compatible with battery powered applications4I 2C 2-Wire Serial Interface 4Works as a Slave to Customer’s Master Processor (100kHz).4Lead Free Package Construction4Complies with Current Environmental Standards (RoHS)4Wide Magnetic Field Range (± 2 Oe)4Sensor Can Be Used in Strong Magnetic Field Environments4Set/Reset Strap Drive4Stray Magnetic Field Protection and Temperature CompensationSPECIFICATIONSCharacteristics Conditions (1)MinTyp Max UnitsSupply Voltage Vsupply to GND 2.7 3.0 5.2 VoltsSupply Current Vsupply to GNDSleep Mode (Vsupply = 3.0V)Steady State (Vsupply = 3.0V)Steady State (Vsupply = 5.0V)Dynamic Peaks112 10µAmAmAmAField Range (2)Total applied field 0.10 - 0.75 gaussHeading Accuracy HMC6352 2.5 degRMSHeading Resolution 0.5 degHeading Repeatability 1.0 degDisturbing Field Sensitivity starts to degrade. Enableset/reset function to restore sensitivity.20 gaussMax. ExposedFieldNo permanent damage and set/resetfunction restores performance.10000 gaussOperating Temperature Ambient-20 70 °CStorage Temperature Ambient-55 125 °CPeak Reflow Temperature For Lead-Free SMT Reflow 230 - 240 °CMoisture Sensivity Max 240°C MSL3 -Output Heading, Mag X, Mag YSize 6.5 x 6.5 x 1.5 mmWeight 0.14 grams(1) Tested at 25°C except stated otherwise.(2) Field upper limit can be extended by using external resistors across CA1/CA2 and CB1/CB2.PIN CONFIGURATION/PACKAGE DIMENSIONS2 PIN DESCRIPTIONSPin Name Description1 OF- No User Connection (Offset Strap Negative)2 SR+ No User Connection (Set/Reset Strap Positive)3 NC No User Connection4 _MCLR Master Clear Input5 GND Supply/System Ground6 NC No User Connection7 SDI I2C Data Output (SPI Data In)8 SDO No User Connection (SPI Data Out)9 PGM No User Connection (Program Enable)10 SCL I2C Clock (SPI Clock)11 SS No User Connection (Slave Select)12 NC No User Connection13 NC No User Connection14 VDD Supply Voltage Positive Input (+2.7VDC to +5.0VDC)15 NC No User Connection16 NC No User Connection17 NC No User Connection18 NC No User Connection19 CB2 Amplifier B Filter Capacitor Connection20 CB1 Amplifier B Filter Capacitor Connection21 NC No User Connection22 CA2 Amplifier A Filter Capacitor Connection23 CA1 Amplifier A Filter Capacitor Connection24 OF+ No User Connection (Offset Strap Positive)I2C COMMUNICATION PROTOCOLThe HMC6352 communicates via a two-wire I2C bus system as a slave device. The HMC6352 uses a layered protocolwith the interface protocol defined by the I2C bus specification, and the lower command protocol defined by Honeywell.The data rate is the standard-mode 100kbps rate as defined in the I2C Bus Specification 2.1. The bus bit format is an 8-bitData/Address send and a 1-bit acknowledge bit. The format of the data bytes (payload) shall be case sensitive ASCII characters or binary data to the HMC6352 slave, and binary data returned. Negative binary values will be in two’s complement form. The default (factory) HMC6352 7-bit slave address is 42(hex) for write operations, or 43(hex) for read operations.The HMC6352 Serial Clock (SCL) and Serial Data (SDA) lines do not have internal pull-up resistors, and require resistivepull-ups (Rp) between the master device (usually a host microprocessor) and the HMC6352. Pull-up resistance values of about 10k ohms are recommended with a nominal 3.0-volt supply voltage. Other values may be used as defined in the I2CBus Specification 2.1.The SCL and SDA lines in this bus specification can be connected to a host of devices. The bus can be a single master to multiple slaves, or it can be a multiple master configuration. All data transfers are initiated by the master device which is responsible for generating the clock signal, and the data transfers are 8 bit long. All devices are addressed by I2C’s unique 7 bit address. After each 8-bit transfer, the master device generates a 9 th clock pulse, and releases the SDA line.The receiving device (addressed slave) will pull the SDA line low to acknowledge (ACK) the successful transfer or leavethe SDA high to negative acknowledge (NACK).Per the I2C spec, all transitions in the SDA line must occur when SCL is low. This requirement leads to two unique conditions on the bus associated with the SDA transitions when SCL is high. Master device pulling the SDA line low whilethe SCL line is high indicates the Start (S) condition, and the Stop (P) condition is when the SDA line is pulled high whilethe SCL line is high. The I2C protocol also allows for the Restart condition in which the master device issues a secondstart condition without issuing a stop. 34 All bus transactions begin with the master device issuing the start sequence followed by the slave address byte. The address byte contains the slave address; the upper 7 bits (bits7-1), and the Least Significant bit (LSb). The LSb of theaddress byte designates if the operation is a read (LSb=1) or a write (LSb=0). At the 9 thclock pulse, the recieving slave device will issue the ACK (or NACK). Following these bus events, the master will send data bytes for a write operation, or the slave will transmit back data for a read operation. All bus transactions are terminated with the master issuing a stop sequence.The following timing diagram shows an example of a master commanding a HMC6352 (slave) into sleep mode by sending the “S” command. The bottom two traces show which device is pulling the SDA line low.I 2C bus control can be implemented with either hardware logic or in software. Typical hardware designs will release the SDA and SCL lines as appropriate to allow the slave device to manipulate these lines. In a software implementation, care must be taken to perform these tasks in code.Command ProtocolThe command protocol defines the content of the data (payload) bytes of I 2C protocol sent by the master, and the slave device (HMC6352).After the master device sends the 7-bit slave address, the 1-bit Read/Write, and gets the 1-bit slave device acknowledge bit returned; the next one to three sent data bytes are defined as the input command and argument bytes. To conserve data traffic, all response data (Reads) will be context sensitive to the last command (Write) sent. All write commands shall have the address byte least significant bit cleared (factory default 42(hex)). These commands then follow with the ASCII command byte and command specific binary formatted argument bytes in the general form of:(Command ASCII Byte) (Argument Binary MS Byte) (Argument Binary LS Byte)The slave (HMC6352) shall provide the acknowledge bits between each data byte per the I 2C protocol. Response byte reads are done by sending the address byte (factory default 43(hex)) with the least significant bit set, and then clocking back one or two response bytes, last command dependant. For example, an “A” command prompts the HMC6352 to make a sensor measurement and to route all reads for a two byte compass heading or magnetometer data response. Then all successive reads shall clock out two response bytes after sending the slave address byte. Table 1 shows the HMC6352 command and response data flow.42(hex)Write to This I 2C Address “S” CommandTable 1 – HMC6352 Interface Commands/ResponsesCommandByte ASCII (hex) Argument 1 Byte(Binary)Argument 2Byte(Binary)Response 1Byte(Binary)Response 2Byte(Binary) Descriptionw (77) EEPROM Address Data Write to EEPROMr (72) EEPROM Address Data Read from EEPROMG (47) RAM Address Data Write to RAM Registerg (67) RAM Address Data Read from RAM RegisterS (53) Enter Sleep Mode (Sleep)W (57) Exit Sleep Mode (Wakeup)O (4F) Update Bridge Offsets (S/R Now) C (43) Enter User Calibration ModeE (45) Exit User Calibration ModeL (4C) Save Op Mode to EEPROMA (41) MSB Data LSB Data Get Data. Compensate and Calculate New HeadingOperational ControlsHMC6352 has two parameters; Operational Mode and Output Mode, which control its operation. The Operational Mode control byte is located at RAM register byte 74(hex) and is shadowed in EEPROM location 08(hex). This byte can be usedto control the continuous measurement rate, set/reset function, and to command the HMC6352 into the three allowed operating modes; Standby, Query, and Continuous.The Output Mode control byte is located at RAM register byte 4E(hex) and is not shadowed in the EEPROM, and upon power up the device is in the Heading output mode. This byte can be changed to get magnetometer data if necessary butis typically left in a default heading data mode.Non-Volatile MemoryThe HMC6352 contains non-volatile memory capability in the form of EEPROM that retains key operational parametersand settings for electronic compassing. Table 2 shows the balance of the EEPROM locations that the user can read andwrite to. Details on the features of these location bytes will be discussed in the following paragraphs.Table 2 – HMC6352 EEPROM ContentsEE Address (hex) Byte Description Factory Default00 I2C Slave Address 42(hex)01 Magnetometer X Offset MSB factory test value02 Magnetometer X Offset LSB factory test value03 Magnetometer Y Offset MSB factory test value04 Magnetometer Y Offset LSB factory test value05 Time Delay (0 – 255 ms) 01(hex)06 Number of Summed measurements(1-16) 04(hex)07 Software Version Number > 01(hex)08 Operation Mode Byte 50(hex)Operational ModesThe HMC6352 has three operational modes plus the ability to enter/exit the non-operational (sleep) mode by command. Sleep mode sends the internal microprocessor into clock shutdown to save power, and can be brought back by the “W” command (wake). The “S” command returns the processor to sleep mode. The three operational modes are defined bytwo bits in the internal HMC6352 Operation Mode register. If the master device sends the “L” command, the current operational mode control byte in the RAM register is loaded into the internal EEPROM register and becomes the default operational mode on the next power-up. The application environment of the HMC6352 will dictate the most suitable operational mode. 5Standby Mode:(Operational Mode=0) This is the factory default mode. The HMC6352 waits for master device commands or change in operational mode. Receiving an “A” command (get data) will make the HMC6352 perform a measurement of sensors (magnetometers), compute the compensated magnetometer and heading data, and wait for thenext read or command. No new measurements are done until another “A” command is sent. This mode is useful to getdata on demand or at random intervals as long as the application can withstand the time delay in getting the data.Query Mode: (Operational Mode=1) In this mode the internal processor waits for “A” commands (get data), makes the measurements and computations, and waits for the next read command to output the data. After each read command, the HMC6352 automatically performs another get data routine and updates the data registers. This mode is designed to getdata on demand without repeating “A” commands, and with the master device controlling the timing and data throughput.The tradeoff in this mode is the previous query latency for the advantage of an immediate read of data.The above two modes are the most power conserving readout modes.Continuous Mode: (Operational Mode=2) The HMC6352 performs continuous sensor measurements and data computations at selectable rates of 1Hz, 5Hz, 10Hz, or 20Hz, and updates the output data bytes. Subsequent “A” commands are un-necessary unless re-synchronization to the command is desired. Data reads automatically get the most recent updates. This mode is useful for data demanding applications.The continuous mode measurement rate is selected by two bits in the operational mode selection byte, along with the mode selection and the periodic Set/Reset bit. The periodic Set/Reset function performs a re-alignment of the sensors magnetic domains in case of sensor perming (magnetic upset event), operating temperature shifts, and normal thermal agitation of the domains. Exposure of the HMC6352 to magnetic fields above 20 gauss (disturbing field threshold) leads to possible measurement inaccuracy or “stuck” sensor readings until the set/reset function is performed. With the periodicSet/Reset bit set, the set/reset function occurs every few minutes.Operational Mode Control Byte SyntaxAs described above, the HMC6352 operation mode, measurement rate, and periodic set/reset are selected and storedboth in a processor RAM register and in EEPROM. Upon power-up the EEPROM will transfer the saved operational mode control byte into register address 74(hex). The following is the byte format:Bit 7 =0Bits 6 and 5 (Continuous Mode Measurement Rate)Bit 6 Bit 5 Description0 0 1 Hz Measurement Rate0 1 5 Hz Measurement Rate1 0 10 Hz Measurement Rate1 1 20 Hz Measurement RateBit 4 (Periodic Set/Reset), 0 = Off, 1 = OnBit 3 = 0Bit 2 = 0Bits 1 and 0 (Operational Mode Value)Bit 1 Bit 0 Description0 0 Standby Mode0 1 Query Mode1 0 Continuous Mode1 1 Not AllowedThe total bit format for the Operational Mode Byte is shown below:Bit 7 (MSB) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 (LSB)0 M. Rate_H M. Rate_L Per. S/R 0 0 Op Mode_H Op Mode_L6 Output Data ModesThe read response bytes after an “A” command, will cause the HMC6352 will return two bytes with binary formatted data. Either heading or magnetometer data can be retrieved depending on the output data selection byte value. Negative signed magnetometer data will be returned in two’s complement form. This output data control byte is located in RAM register location 4E(hex) and defaults to value zero (heading) at power up.The following is the byte format:Bits 7 through 3 = 0Bits 0, 1, 2 (Output Mode Value)Bit 2 Bit 1 Bit 0 Description0 0 0 Heading Mode0 0 1 Raw Magnetometer X Mode0 1 0 Raw Magnetometer Y Mode0 1 1 Magnetometer X Mode1 0 0 Magnetometer Y ModeThe total bit format for the Output Mode Byte is shown below:Bit 7 (MSB) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 (LSB)0 0 0 0 0 Mode Mode ModeHeading Mode: The heading output data will be the value in tenths of degrees from zero to 3599 and provided in binary format over the two bytes.Raw Magnetometer Modes: These X and Y raw magnetometer data readings are the internal sensor values measuredat the output of amplifiers A and B respectively and are 10-bit 2’s complement binary ADC counts of the analog voltagesat pins CA1 and CB1. The leading 6-bits on the MSB are zero filled or complemented for negative values. The zero count value will be about half of the supply voltage. If measurement averaging is implemented, the most significant bits may contain values of the summed readings.Magnetometer Modes: These X and Y magnetometer data readings are the raw magnetometer r eadings plus offset and scaling factors applied. The data format is the same as the raw magnetometer data. These compensated data values come from the calibration routine factors plus additional offset factors provided by the set/reset routine.User CalibrationThe HMC6352 provides a user calibration routine with the “C” command permitting entry into the calibration mode and the “E” command to exit the calibration mode. Once in calibration mode, the user is requested to rotate the compass on a flat surface at least one full circular rotation while the HMC6352 collects several readings per second at various headings withthe emphasis on rotation smoothness to gather uniformly spaced readings. Optimally two rotations over 20 seconds duration would provide an accurate calibration. The calibration time window is recommended to be from 6 seconds up to3 minutes depending on the end user’s platform.The calibration routine collects these readings to correct for hard-iron distortions of the earth’s magnetic field. These hard-iron effects are due to magnetized materials nearby the HMC6352 part that in a fixed position with respect to the end user platform. An example would be the magnetized chassis or engine block of a vehicle in which the compass is mounted onto. Upon exiting the calibration mode, the resulting magnetometer offsets and scaling factors are updatedI2C Slave AddressThe I2C slave address byte consists of the 7 most significant bits with the least siginificant bit zero filled. A described earlier, the default (factory) value is 42(hex) and the legal I2C bounded values are between 10(hex) and F6(hex). This slave address is written into EEPROM address 00(hex) and changed on the power up.Magnetometer OffsetsThe Magnetometer Offset bytes are the values stored after the completion of the last factory or user calibration routine. Additional value changes are possible, but will be overwritten when the next calibration routine is completed. Note that 7these offset values are added to the sensor offset values computed by the set/reset routine to convert the raw magnetometer data to the compensated magnetometer data. These values are written into EEPROM addresses 01(hex)to 04 (hex) and loaded to RAM on the power up. These offsets are in ADC counts applied to the 10-bit ADC raw magnetometer data. Most offset MSB values will likely be zero filled or complemented.Time DelayThe EEPROM time delay byte is the binary value of the number of milliseconds from the time a measurement request was commanded and the time the actual measurements are made. The default value is 01(hex) for no delay. Extra measurement delays maybe desired to allow for amplifier stabilization from immediate HMC6352 power-up or for externalfilter capacitor selection that limits the bandwidth and time response of the amplifier stages. This value is written into EEPROM address 05(hex) and loaded to RAM on the power up.Measurement SummingThis EEPROM summed measurement byte permits designers/users to back average or data smooth the output data (heading, magnetometer values) to reduce the amount of jitter in the data presentation. The default value is 04(hex) whichis four measurements summed. A value of 00(hex) would be no summing. Up to 16 sets of magnetometer data may be selected for averaging. This slave address is written into EEPROM address 06(hex) and loaded to RAM on the power up. Software VersionThis EEPROM software version number byte contains the binary value of the programmed software. Values of 01(hex)and beyond are considered production software.Timing RequirementsTable 3 contains the time delays required by HMC6352 upon receipt of the command to either perform the commandedtask or to have the response available on the I2C bus.Table 3 – Interface Command DelaysCommand ByteDescription Time Delay (µsec)ASCII (hex)w (77) Write to EEPROM 70r (72) Read from EEPROM 70G (47) Write to RAM Register 70g (67) Read from RAM Register 70S (53) Enter Sleep Mode (Sleep) 10W (57) Exit Sleep Mode (Wakeup) 100O (4F) Update Bridge Offsets (S/R Now) 6000C (43) Enter User Calibration Mode 10E (45) Exit User Calibration Mode 14000L (4C) Save Op Mode to EEPROM 125A (41) Get Data. Compensate and Calculate New Heading 6000Command and Operation Mode InteractionsAll commands are accepted in the standby mode. Honeywell strongly recommends using this mode during the initial setup stage. Setting up of the HMC6352 operation mode and its slave address are typical set up examples. Although executionof all commands in the Query and Continuous Modes is acceptable, the completion outcome is not guaranteed.Q: How to Read Data from HMC6352?A: In Standby Mode - Use “A” command.In Query Mode - Send 43(hex) slave address to read data and clock out the two register data bytes for heading.An initial “A” command is needed to update the heading after each read.8 9In Continuous Mode - Send 43(hex) slave address to read data and clock out the register data bytes for heading. The “A” command is not allowed or required.Waveform ExamplesExample 1: This example shows how to read a single byte from the HMC6352. The Slave (HMC6352) continues to hold the SDA line low after the acknowledge (ACK) bit because the first bit of the data byte is a zero. Remember that the data read is last command sensitive.Example 2: This example shows how to read two bytes from the HMC6352 (slave). The slave continues to hold the SDA line low after the acknowledge bit because the first bit of the data bytes is zero.Example 3: This example shows how to command HMC6352 to read a RAM register by sending the “g” command and the register address 7F(hex). Note that this example does not show the process of reading the answer. See example 1 for reading a byte.Example 4: This example shows how to write to a RAM register in the H MC6352 by sending the “G” command, the register address 7F(hex), and the data byte 55(hex) to the HMC6352 slave.SDA SCL M_SDA S_SDA43(hex)Read From This I2C Address55(hex) DataSDA SCL M_SDA S_SDA43(hex)Read From This I2C Address55(hex) Data00(hex) DataSDA SCL M_SDA S_SDA42(hex)Write to This I2C Address“g” Command7F(hex) Register 7FSDA SCL M_SDA S_SDA42(hex)Write to This I2C Address“G” Command7F(hex) Register 7F55(hex) Data10 Example 5: The final example shows how to read RAM register 7F(hex). First perform a write operation to command the HMC6352 to read a RAM register and define which register to read (Example 3). The sensor puts the answer in the data buffer. Then perform a read operation to clock out the answer (Example 1). There is a Stop/Start event in between the write operation and the read operation. This example is just a combination of Examples 3 and 1, but it is provided to show that reading a register involves both a write and a read operation.APPLICATION NOTESThe HMC6352 Integrated Compass Sensor circuit is composed of two magneto-resistive (MR) sensors with orthogonal orientation for sensing the horizontal components of the earth’s magnetic field (0 to 630 milli-gauss), plus two amplifiers, a set/reset drive circuit, and a microprocessor (µP). Best accuracy is obtained in clean magnetic environments (free air) and held level, or perpendicular to the gravitational direction. At worst case, each degree of tilt from a level orientation could add two degrees of compass heading error. Magnetic errors can be introduced if operated near strong magnetic sources such as microphone or speaker magnets, transformers in test equipment, and CRT deflection yokes in video displays/monitors. These magnetic errors can typically be reduced or eliminated by performing the calibration routine.When locating the HMC6352 in dense printed circuit board designs, take precautions in location of this magnetic field sensing device for soft-iron effects that bend the earth’s magnetic field. These soft -iron effects are from ferrous materials without residual magnetization and tend to be items like nickel-plating on SMT component contacts and RFI/EMI shielding materials. The amount of stand-off of the HMC6352 from these soft-irons is heuristic and dependant on the amount of material, material shape, and proximity.A user calibration mode is available in the HMC6352 to diminish hard-iron effects of the end-user’s (customer’s) location of the product. Hard-iron effects come from nearby ferrous materials with residual magnetism that buck or boost the intensity of the earth’s magnetic field, leading to heading errors. Such hard-iron effects come from vehicle chassis, speaker magnets, and high current conductors or circuit traces.PCB PAD DEFINITION(Dimensions in Millimeters)The HMC6352 is a fine pitch LCC package with a 0.80mm pin pitch (spacing), with the pin pads defined as 0.70mm by 0.33mm in size. PCB pads are recommended to be oversized by 0.025mm from each pad for a short dimension oversize of 0.05mm. The interior PCB pad is recommended to be 0.05mm oversized per pin with an exterior oversize of 0.20mm for proper package centering and to permit test probing. Lead finish is SnAgCu.Soldering attachment shall be done by SMT lead-free reflow methods with standard preheating, soaking, reflow, and cooling profiles for large body parts. Caution, excessive temperature exposure beyond the profiles may result in internal damage to the HMC6352 circuits.SDA SCL S_SDA42(hex) Write to This I2C Address “g”Command7F(hex) Register 7F43(hex) Read From This I2C Address55(hex) Data分销商库存信息:HONEYWELLHMC6352-TR HMC6352-EVAL HMC6352-DEMO。
常用开关电源芯片大全之欧阳育创编
常用开关电源芯片大全第1章DC-DC电源转换器/基准电压源1.1 DC-DC电源转换器1.低噪声电荷泵DC-DC电源转换器AAT3113/AAT31142.低功耗开关型DC-DC电源转换器ADP30003.高效3A开关稳压器AP15014.高效率无电感DC-DC电源转换器FAN56605.小功率极性反转电源转换器ICL76606.高效率DC-DC电源转换控制器IRU30377.高性能降压式DC-DC电源转换器ISL64208.单片降压式开关稳压器L49609.大功率开关稳压器L4970A10.1.5A降压式开关稳压器L497111.2A高效率单片开关稳压器L497812.1A高效率升压/降压式DC-DC电源转换器L597013.1.5A降压式DC-DC电源转换器LM157214.高效率1A降压单片开关稳压器LM1575/LM2575/LM2575HV15.3A降压单片开关稳压器LM2576/LM2576HV16.可调升压开关稳压器LM257717.3A降压开关稳压器LM259618.高效率5A开关稳压器LM267819.升压式DC-DC电源转换器LM2703/LM270420.电流模式升压式电源转换器LM273321.低噪声升压式电源转换器LM275022.小型75V降压式稳压器LM500723.低功耗升/降压式DC-DC电源转换器LT107324.升压式DC-DC电源转换器LT161525.隔离式开关稳压器LT172526.低功耗升压电荷泵LT175127.大电流高频降压式DC-DC电源转换器LT176528.大电流升压转换器LT193529.高效升压式电荷泵LT193730.高压输入降压式电源转换器LT195631.1.5A升压式电源转换器LT196132.高压升/降压式电源转换器LT343333.单片3A升压式DC-DC电源转换器LT343634.通用升压式DC-DC电源转换器LT346035.高效率低功耗升压式电源转换器LT346436.1.1A升压式DC-DC电源转换器LT346737.大电流高效率升压式DC-DC电源转换器LT378238.微型低功耗电源转换器LTC175439.1.5A单片同步降压式稳压器LTC187540.低噪声高效率降压式电荷泵LTC191141.低噪声电荷泵LTC3200/LTC3200-542.无电感的降压式DC-DC电源转换器LTC325143.双输出/低噪声/降压式电荷泵LTC325244.同步整流/升压式DC-DC电源转换器LTC340145.低功耗同步整流升压式DC-DC电源转换器LTC340246.同步整流降压式DC-DC电源转换器LTC340547.双路同步降压式DC-DC电源转换器LTC340748.高效率同步降压式DC-DC电源转换器LTC341649.微型2A升压式DC-DC电源转换器LTC342650.2A两相电流升压式DC-DC电源转换器LTC342851.单电感升/降压式DC-DC电源转换器LTC344052.大电流升/降压式DC-DC电源转换器LTC344253.1.4A同步升压式DC-DC电源转换器LTC345854.直流同步降压式DC-DC电源转换器LTC370355.双输出降压式同步DC-DC电源转换控制器LTC373656.降压式同步DC-DC电源转换控制器LTC377057.双2相DC-DC电源同步控制器LTC380258.高性能升压式DC-DC电源转换器MAX1513/MAX151459.精简型升压式DC-DC电源转换器MAX1522/MAX1523/MAX152460.高效率40V升压式DC-DC电源转换器MAX1553/MAX155461.高效率升压式LED电压调节器MAX1561/MAX159962.高效率5路输出DC-DC电源转换器MAX156563.双输出升压式DC-DC电源转换器MAX1582/MAX1582Y64.驱动白光LED的升压式DC-DC电源转换器MAX158365.高效率升压式DC-DC电源转换器MAX1642/MAX164366.2A降压式开关稳压器MAX164467.高效率升压式DC-DC电源转换器MAX1674/MAX1675/MAX167668.高效率双输出DC-DC电源转换器MAX167769.低噪声1A降压式DC-DC电源转换器MAX1684/MAX168570.高效率升压式DC-DC电源转换器MAX169871.高效率双输出降压式DC-DC电源转换器MAX171572.小体积升压式DC-DC电源转换器MAX1722/MAX1723/MAX172473.输出电流为50mA的降压式电荷泵MAX173074.升/降压式电荷泵MAX175975.高效率多路输出DC-DC电源转换器MAX180076.3A同步整流降压式稳压型MAX1830/MAX183177.双输出开关式LCD电源控制器MAX187878.电流模式升压式DC-DC电源转换器MAX189679.具有复位功能的升压式DC-DC电源转换器MAX194780.高效率PWM降压式稳压器MAX1992/MAX199381.大电流输出升压式DC-DC电源转换器MAX61882.低功耗升压或降压式DC-DC电源转换器MAX62983.PWM升压式DC-DC电源转换器MAX668/MAX66984.大电流PWM降压式开关稳压器MAX724/MAX72685.高效率升压式DC-DC电源转换器MAX756/MAX75786.高效率大电流DC-DC电源转换器MAX761/MAX76287.隔离式DC-DC电源转换器MAX8515/MAX8515A88.高性能24V升压式DC-DC电源转换器MAX872789.升/降压式DC-DC电源转换器MC33063A/MC34063A90.5A升压/降压/反向DC-DC电源转换器MC33167/MC3416791.低噪声无电感电荷泵MCP1252/MCP125392.高频脉宽调制降压稳压器MIC220393.大功率DC-DC升压电源转换器MIC229594.单片微型高压开关稳压器NCP1030/NCP103195.低功耗升压式DC-DC电源转换器NCP1400A96.高压DC-DC电源转换器NCP140397.单片微功率高频升压式DC-DC电源转换器NCP141098.同步整流PFM步进式DC-DC电源转换器NCP142199.高效率大电流开关电压调整器NCP1442/NCP1443/NCP1444/NCP1445100.新型双模式开关稳压器NCP1501101.高效率大电流输出DC-DC电源转换器NCP1550102.同步降压式DC-DC电源转换器NCP1570103.高效率升压式DC-DC电源转换器NCP5008/NCP5009 104.大电流高速稳压器RT9173/RT9173A105.高效率升压式DC-DC电源转换器RT9262/RT9262A106.升压式DC-DC电源转换器SP6644/SP6645107.低功耗升压式DC-DC电源转换器SP6691108.新型高效率DC-DC电源转换器TPS54350109.无电感降压式电荷泵TPS6050x110.高效率升压式电源转换器TPS6101x111.28V恒流白色LED驱动器TPS61042112.具有LDO输出的升压式DC-DC电源转换器TPS6112x 113.低噪声同步降压式DC-DC电源转换器TPS6200x114.三路高效率大功率DC-DC电源转换器TPS75003115.高效率DC-DC电源转换器UCC39421/UCC39422116.PWM控制升压式DC-DC电源转换器XC6371117.白光LED驱动专用DC-DC电源转换器XC9116118.500mA同步整流降压式DC-DC电源转换器XC9215/XC9216/XC9217119.稳压输出电荷泵XC9801/XC9802120.高效率升压式电源转换器ZXLB16001.2 线性/低压差稳压器121.具有可关断功能的多端稳压器BAXXX122.高压线性稳压器HIP5600123.多路输出稳压器KA7630/KA7631124.三端低压差稳压器LM2937125.可调输出低压差稳压器LM2991126.三端可调稳压器LM117/LM317127.低压降CMOS500mA线性稳压器LP38691/LP38693128.输入电压从12V到450V的可调线性稳压器LR8129.300mA非常低压降稳压器（VLDO）LTC3025130.大电流低压差线性稳压器LX8610131.200mA负输出低压差线性稳压器MAX1735132.150mA低压差线性稳压器MAX8875133.带开关控制的低压差稳压器MC33375134.带有线性调节器的稳压器MC33998135.1.0A低压差固定及可调正稳压器NCP1117136.低静态电流低压差稳压器NCP562/NCP563137.具有使能控制功能的多端稳压器PQxx138.五端可调稳压器SI-3025B/SI-3157B139.400mA低压差线性稳压器SPX2975140.五端线性稳压器STR20xx141.五端线性稳压器STR90xx142.具有复位信号输出的双路输出稳压器TDA8133143.具有复位信号输出的双路输出稳压器TDA8138/TDA8138A144.带线性稳压器的升压式电源转换器TPS6110x145.低功耗50mA低压降线性稳压器TPS760xx146.高输入电压低压差线性稳压器XC6202147.高速低压差线性稳压器XC6204148.高速低压差线性稳压器XC6209F149.双路高速低压差线性稳压器XC64011.3 基准电压源150.新型XFET基准电压源ADR290/ADR291/ADR292/ADR293151.低功耗低压差大输出电流基准电压源MAX610x152.低功耗1.2V基准电压源MAX6120153.2.5V精密基准电压源MC1403154.2.5V/4.096V基准电压源MCP1525/MCP1541155.低功耗精密低压降基准电压源REF30xx/REF31xx156.精密基准电压源TL431/KA431/TLV431A第2章AC-DC转换器及控制器1.厚膜开关电源控制器DP104C2.厚膜开关电源控制器DP308P3.DPA-Switch系列高电压功率转换控制器DPA423/DPA424/DPA425/DPA4264.电流型开关电源控制器FA13842/FA13843/FA13844/FA138455.开关电源控制器FA5310/FA53116.PWM开关电源控制器FAN75567.绿色环保的PWM开关电源控制器FAN76018.FPS型开关电源控制器FS6M07652R9.开关电源功率转换器FS6Sxx10.降压型单片AC-DC转换器HV-2405E11.新型反激准谐振变换控制器ICE1QS0112.PWM电源功率转换器KA1M088013.开关电源功率转换器KA2S0680/KA2S088014.电流型开关电源控制器KA38xx15.FPS型开关电源功率转换器KA5H0165R16.FPS型开关电源功率转换器KA5Qxx17.FPS型开关电源功率转换器KA5Sxx18.电流型高速PWM控制器L499019.具有待机功能的PWM初级控制器L599120.低功耗离线式开关电源控制器L659021.LINK SWITCH TN系列电源功率转换器LNK304/LNK305/LNK30622.LINK SWITCH系列电源功率转换器LNK500/LNK501/LNK52023.离线式开关电源控制器M51995A24.PWM电源控制器M62281P/M62281FP25.高频率电流模式PWM控制器MAX5021/MAX502226.新型PWM开关电源控制器MC4460427.电流模式开关电源控制器MC4460528.低功耗开关电源控制器MC4460829.具有PFC功能的PWM电源控制器ML482430.液晶显示器背光灯电源控制器ML487631.离线式电流模式控制器NCP120032.电流模式脉宽调制控制器NCP120533.准谐振式PWM控制器NCP120734.低成本离线式开关电源控制电路NCP121535.低待机能耗开关电源PWM控制器NCP123036.STR系列自动电压切换控制开关STR8xxxx37.大功率厚膜开关电源功率转换器STR-F665438.大功率厚膜开关电源功率转换器STR-G865639.开关电源功率转换器STR-M6511/STR-M652940.离线式开关电源功率转换器STR-S5703/STR-S5707/STR-S570841.离线式开关电源功率转换器STR-S6401/STR-S6401F/STR-S6411/STR-S6411F 442.开关电源功率转换器STR-S651343.离线式开关电源功率转换器TC33369～TC3337444.高性能PFC与PWM组合控制集成电路TDA16846/TDA1684745.新型开关电源控制器TDA1685046.“绿色”电源控制器TEA150447.第二代“绿色”电源控制器TEA150748.新型低功耗“绿色”电源控制器TEA153349.开关电源控制器TL494/KA7500/MB375950.Tiny SwitchⅠ系列功率转换器TNY253、TNY254、TNY25551.Tiny SwitchⅡ系列功率转换器TNY264P～TNY268G52.TOP Switch（Ⅱ）系列离线式功率转换器TOP209～TOP22753.TOP Switch-FX系列功率转换器TOP232/TOP233/TOP23454.TOP Switch-GX系列功率转换器TOP242～TOP25055.开关电源控制器UCX84X56.离线式开关电源功率转换器VIPer12AS/VIPer12ADIP57.新一代高度集成离线式开关电源功率转换器VIPer53第3章功率因数校正控制/节能灯电源控制器1.电子镇流器专用驱动电路BL83012.零电压开关功率因数控制器FAN48223.功率因数校正控制器FAN75274.高电压型EL背光驱动器HV8265.EL场致发光背光驱动器IMP525/IMP5606.高电压型EL背光驱动器/反相器IMP8037.电子镇流器自振荡半桥驱动器IR21568.单片荧光灯镇流器IR21579.调光电子镇流器自振荡半桥驱动器IR215910.卤素灯电子变压器智能控制电路IR216111.具有功率因数校正电路的镇流器电路IR216612.单片荧光灯镇流器IR216713.自适应电子镇流器控制器IR252014.电子镇流器专用控制器KA754115.功率因数校正控制器L656116.过渡模式功率因数校正控制器L656217.集成背景光控制器MAX8709/MAX8709A18.功率因数校正控制器MC33262/MC3426219.固定频率电流模式功率因数校正控制器NCP165320.EL场致发光灯高压驱动器SP440321.功率因数校正控制器TDA4862/TDA486322.有源功率因数校正控制器UC385423.高频自振荡节能灯驱动器电路VK05CFL24.大功率高频自振荡节能灯驱动器电路VK06TL第4章充电控制器1.多功能锂电池线性充电控制器AAT36802.可编程快速电池充电控制器BQ20003.可进行充电速率补偿的锂电池充电管理器BQ20574.锂电池充电管理电路BQ2400x5.单片锂电池线性充电控制器BQ2401xB接口单节锂电池充电控制器BQ2402x7.2A同步开关模式锂电池充电控制器BQ241008.集成PWM开关控制器的快速充电管理器BQ29549.具有电池电量计量功能的充电控制器DS277010.锂电池充电控制器FAN7563/FAN756411.2A线性锂/锂聚合物电池充电控制器ISL629212.锂电池充电控制器LA5621M/LA5621V13.1.5A通用充电控制器LT157114.2A恒流/恒压电池充电控制器LT176915.线性锂电池充电控制器LTC173216.带热调节功能的1A线性锂电池充电控制器LTC173317.线性锂电池充电控制器LTC173418.新型开关电源充电控制器LTC198019.开关模式锂电池充电控制器LTC400220.4A锂电池充电器LTC400621.多用途恒压/恒流充电控制器LTC400822.4.2V锂离子/锂聚合物电池充电控制器LTC405223.可由USB端口供电的锂电池充电控制器LTC405324.小型150mA锂电池充电控制器LTC405425.线性锂电池充电控制器LTC405826.单节锂电池线性充电控制器LTC405927.独立线性锂电池充电控制器LTC406128.镍镉/镍氢电池充电控制器M62256FP29.大电流锂/镍镉/镍氢电池充电控制器MAX150130.锂电池线性充电控制器MAX150731.双输入单节锂电池充电控制器MAX1551/MAX155532.单节锂电池充电控制器MAX167933.小体积锂电池充电控制器MAX1736B接口单节锂电池充电控制器MAX181135.多节锂电池充电控制器MAX187336.双路输入锂电池充电控制器MAX187437.单节锂电池线性充电控制器MAX189838.低成本/多种电池充电控制器MAX190839.开关模式单节锂电池充电控制器MAX1925/MAX192640.快速镍镉/镍氢充电控制器MAX2003A/MAX200341.可编程快速充电控制器MAX712/MAX71342.开关式锂电池充电控制器MAX74543.多功能低成本充电控制器MAX846A44.具有温度调节功能的单节锂电池充电控制器MAX8600/MAX860145.锂电池充电控制器MCP73826/MCP73827/MCP7382846.高精度恒压/恒流充电器控制器MCP73841/MCP73842/MCP73843/MCP73844 647.锂电池充电控制器MCP73861/MCP7386248.单节锂电池充电控制器MIC7905049.单节锂电池充电控制器NCP180050.高精度线性锂电池充电控制器VM7205。
BXC6332_Datasheet-规格书-离线语音蓝牙芯片
离线语音识别芯片最小系统平台BXC6332芯片规格书版本: 1.0日期: 2020年12月备注：1．以下信息如有更新,将不做通知,请用户在使用前先确定手中资料是否为最新版本。
2．对于错误或不恰当操作所导致的后果,我们将不承担责任。
目录1．芯片特征 (4)2．芯片引脚 (6)3．芯片电气特性 (9)4．芯片封装尺寸 (11)版本记录一、芯片特征内核和存储⏹高性能ARM®Cortex™-M032 位RISC 内核，主频200MHz，支持硬件浮点运算⏹内置2MB SPI FLASHAI算法⏹离线语音识别，采用最新的神经网络（TDNN）算法，具有识别精准，误判率低等优势，5米远场可靠识别⏹语音降噪算法：过滤掉稳态噪声、对动态噪声也有很好的抑制作用，噪音下也可准确识别⏹音频解码：◆支持 MP3，WAV，WMA，APE，FLAC, AAC，MP4，M4A，AIF，AIFC 音频解码◆BT 支持 SBC，AAC 音频解码音频◆BT 电话支持 mSBC 语音编解码器音频⏹两通道 16 位 DAC，SNR> = 95dB⏹单通道 16 位 ADC，SNR> = 90dB⏹采样率支持 8KHz / 11.025KHz / 16KHz / 22.05KHz / 24KHz /32KHz / 44.1KHz / 48KHz⏹三通道立体声模拟 MUX⏹DAC 支持直推式, 单端或者差分输出电源⏹VBAT 为 2.2V 至 5.5V⏹VDDIO 为 2.2V 至 3.6V⏹RTCVDD 为 2.2V 至 3.6V蓝牙⏹符合蓝牙 V5.1 + BR + EDR + BLE 规范⏹满足 Class1 class2 和 class3 传输功耗需求⏹支持 GFSK 和π/ 4 DQPSK 所有包装类型⏹提供+ 6dbm 发射功率⏹具有-90dBm 灵敏度的接收器⏹快速 AGC 可增强动态范围⏹支持 a2dp \ avctp \ avdtp \ avrcp \ hfp \ spp \ smp \ att \ gap \ gatt \ rfcomm \ sdp \ l2ca 配置文件外设⏹一个全速 USB 2.0 OTG 控制器⏹四个多功能 16 位定时器，支持捕获和 PWM 模式⏹三个用于电机的 16 位 PWM 驱动发生器⏹三个全双工基本 UART，UART0 和 UART1 支持 DMA 模式⏹两个 SPI 接口支持主机和设备模式⏹一个硬件 IIC 接口支持主机和从机模式⏹内置 Cap Sense Key 控制器⏹13 通道 10 位 ADC 用于模拟采样⏹所有 GPIO 上的外部唤醒/中断封装和工作温度⏹QFN32 （4mm*4mm）⏹工作温度：-20℃至+ 70℃⏹储存温度：-65℃至+ 150℃应用领域⏹智能家电（生活电器、健康家电、厨房家电等）⏹智能卫浴、智能照明、智能机电、智能家居。
UL635H256s2C35G1中文资料
UL635H256Obsolete - Not Recommended for New DesignsPin ConfigurationPin DescriptionSignal Name Signal Description A0 - A14Address Inputs DQ0 - DQ7Data In/Out E Chip Enable G Output Enable W Write EnableVCC Power Supply Voltage VSSGroundG A11A9A8A13W n. c.VCC n. c.A14A12A7A6A5A4A3n.c.A10E DQ7DQ6DQ5DQ4DQ3VSS DQ2DQ1DQ0A0A1A2n.c.12345678910111213141516TSOPTop View32313029282726252423222120191817A14A12A7A6A5A4A3A2A1A0DQ0DQ1DQ2VSS VCC W A13A8A9A11G A10E DQ7DQ6DQ5DQ4DQ31234567891011121314SOPTop View 2827262524232221201918171615Low Voltage PowerStore 32K x 8 nvSRAM•High-performance CMOS non- volatile static RAM 32768 x 8 bits •35 and 45 ns Access Times •15 and 20 ns Output Enable Access Times•I CC = 8 mA typ. at 200 ns Cycle Time•Automatic STORE to EEPROM on Power Down using system capacitance•Software initiated STORE •Automatic STORE Timing•106 STORE cycles to EEPROM •100 years data retention in EEPROM•Automatic RECALL on Power Up •Software RECALL Initiation •Unlimited RECALL cycles from EEPROM•Wide voltage range: 2.7 ... 3.6 V (3.0 ... 3.6 V for 35 ns type)•Operating temperature range:0 to 70 °C -40 to 85 °C•QS 9000 Quality Standard •ESD protection > 2000 V(MIL STD 883C M3015.7-HBM)•RoHS compliance and Pb- free •Package:SOP28 (330 mil)The UL635H256 has two separate modes of operation: SRAM mode and nonvolatile mode. In SRAM mode, the memory operates as an ordinary static RAM. In nonvolatile operation, data is transferred in parallel from SRAM to EEPROM or from EEPROM to SRAM. In this mode SRAM functions are disab-led.The UL635H256 is a fast static RAM (35 and 45 ns), with a nonvo-latile electrically erasable PROM (EEPROM) element incorporated in each static memory cell. The SRAM can be read and written an unlimited number of times, while independent nonvolatile data resi-des in EEPROM. Data transfers from the SRAM to the EEPROM (the STORE operation) take place automatically upon power down using charge stored in system capacitance. Transfers from the EEPROM to the SRAM (the RECALL operation) take place automatically on powerup.The UL635H256 combines the high performance and ease of use of a fast SRAM with nonvolatile data integrity.STORE cycles also may be initia-ted under user control via a soft-ware sequence.Once a STORE cycle is initiated,further input or output are disabled until the cycle is completed.Because a sequence of addresses is used for STORE initiation, it is important that no other read or write accesses intervene in the sequence or the sequence will be aborted.RECALL cycles may also be initia-ted by a software sequence.Internally, RECALL is a two step procedure. First, the SRAM data is cleared and second, the nonvola-tile information is transferred into the SRAM cells.The RECALL operation in no way alters the data in the EEPROM cells. The nonvolatile data can be recalled an unlimited number of times.FeaturesDescriptionUL635H256EEPROM Array 512 x (64 x 8)RECALLDQ0DQ1DQ2DQ3DQ4DQ5DQ6DQ7Column I/O Column DecoderA0 - A13Store/Recall ControlR o w D e c o d e rV CC V SSGE WA0 A 1 A2 A3 A4A10Software DetectPower ControlV CCA5A6A7A8A9A11A12A13A14I n p u t B u f f e r sSTORESRAM Array 512 Rows x 64 x 8 ColumnsBlock DiagramTruth Table for SRAM OperationsOperating Mode E WGDQ0 - DQ7Standby/not selectedH **High-Z Internal ReadL H H High-Z Read L H LData Outputs Low-Z WriteLL*Data Inputs High-Z*H or LCharacteristicsAll voltages are referenced to V SS = 0 V (ground).All characteristics are valid in the power supply voltage range and in the operating temperature range specified.Dynamic measurements are based on a rise and fall time of ≤ 5 ns, measured between 10 % and 90 % of V I , as well as input levels of V IL = 0 V and V IH = 3 V. The timing reference level of all input and output signals is 1.5 V,with the exception of the t dis -times and t en -times, in which cases transition is measured ± 200 mV from steady-state voltage.a: Stresses greater than those listed under …Absolute Maximum Ratings“ may cause permanent damage to the device. This is a stressrating only, and functional operation of the device at condition above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.Absolute Maximum Ratings a Symbol Min.Max.Unit Power Supply Voltage V CC -0.5 4.6V Input Voltage V I -0.3V CC +0.5V Output Voltage V O -0.3V CC +0.5V Power Dissipation P D 1W Operating Temperature C-Type K-TypeT a 0-407085°C °C Storage TemperatureT stg-65150°CUL635H256b:I CC1 and I CC3 are depedent on output loading and cycle rate. The specified values are obtained with outputs unloaded.The current I CC1 is measured for WRITE/READ - ratio of 1/2.c:I CC2 and I CC4 are the average currents required for the duration of the respective STORE cycles.d:Bringing E ≥ V IH will not produce standby current levels until any nonvolatile cycle in progress has timed out. See MODE SELECTIONtable. The current I CC(SB)1 is measured for WRITE/READ - ratio of 1/2.DC Characteristics Symbol ConditionsC-TypeK-TypeUnitMin.Max.Min.Max.Operating Supply Current bI CC1V CC V IL V IH t c t c= 3.6 V = 0.8 V = 2.2 V = 35 ns = 45 ns 45354737mA mA Average Supply Current during c STOREI CC2V CC E W V IL V IH = 3.6 V ≤ 0.2 V≥ V CC -0.2 V ≤ 0.2 V≥ V CC -0.2 V 34mAOperating Supply Current b at t cR = 200 ns(Cycling CMOS Input Levels)I CC3V CC W V IL V IH = 3.6 V≥ V CC -0.2 V ≤ 0.2 V≥ V CC -0.2 V 1011mAAverage Supply Current during c PowerStore Cycle I CC4V CC V IL V IH = V CCmin = 0.2 V≥ V CC -0.2 V 22mAStandby Supply Current d (Cycling TTL Input Levels)I CC(SB)1V CC E t c t c= 3.6 V = V IH = 35 ns = 45 ns 1191210mA mA Standby Supply Curent d(Stable CMOS Input Levels)I CC(SB)V CC E V IL V IH= 3.6 V≥ V CC -0.2 V ≤ 0.2 V≥ V CC -0.2 V11mARecommendedOperating Conditions Symbol Conditions Min.Max.Unit Power Supply VoltageV CCt c = 35 ns t c = 45 ns3.02.7 3.63.6V V Input Low Voltage V IL -2 V at Pulse Width 10 ns permitted-0.30.8V Input High VoltageV IH2.2V CC +0.3VUL635H256DC Characteristics Symbol ConditionsC-Type K-TypeUnit Min.Max.Min.Max.Output High Voltage Output Low Voltage V OHV OLV CCI OHI OL= V CC min=-2 mA= 2 mA2.40.42.40.4VVOutput High Current Output Low Current I OHI OLV CCV OHV OL= V CC min= 2.4 V= 0.4 V2-22-2mAmAInput Leakage CurrentHigh Low I IHI ILV CCV IHV IL= 3.6 V= 3.6 V=0V-11-11μAμAOutput Leakage CurrentHigh at Three-State- Output Low at Three-State- Output I OHZI OLZV CCV OHV OL= 3.6 V= 3.6 V=0V-11-11μAμASRAM Memory OperationsNo.Switching CharacteristicsRead CycleSymbol3545UnitAlt.IEC Min.Max.Min.Max.1Read Cycle Time f t AVAV t cR3545ns 2Address Access Time to Data Valid g t AVQV t a(A)3545ns 3Chip Enable Access Time to Data Valid t ELQV t a(E)3545ns4Output Enable Access Time to Data Valid t GLQVt a(G)1520ns5 E HIGH to Output in High-Z h t EHQZ t dis(E)1315ns 6G HIGH to Output in High-Z h t GHQZ t dis(G)1315ns 7 E LOW to Output in Low-Z t ELQX t en(E)55ns 8G LOW to Output in Low-Z t GLQX t en(G)00ns 9Output Hold Time after Address Change t AXQX t v(A)33ns 10Chip Enable to Power Active e t ELICCH t PU00ns 11Chip Disable to Power Standby d, e t EHICCL t PD3545ns e:Parameter guaranteed but not tested.f:Device is continuously selected with E and G both Low.g:Address valid prior to or coincident with E transition LOW.h:Measured ± 200 mV from steady state output voltage.UL635H256Read Cycle 1: Ai-controlled (during Read cycle: E = G = V IL , W = V IH )fNo.Switching Characteristics Write Cycle Symbol3545UnitAlt. #1Alt. #2IEC Min.Max.Min.Max.12Write Cycle Time t AVAV t AVAVt cW 3545ns 13Write Pulse Widtht WLWHt w(W)2530ns 14Write Pulse Width Setup Time t WLEHt su(W)2530ns 15Address Setup Time t AVWL t AVEL t su(A)00ns 16Address Valid to End of Write t AVWH t AVEH t su(A-WH)2530ns 17Chip Enable Setup Time t ELWHt su(E)2530ns 18Chip Enable to End of Write t ELEHt w(E)2530ns 19Data Setup Time to End of Write t DVWH t DVEH t su(D)1215ns 20Data Hold Time after End of Write t WHDX t EHDX t h(D)00ns 21Address Hold after End of Write t WHAX t EHAX t h(A)0ns 22W LOW to Output in High-Z h, i t WLQZ t dis(W)1315ns 23W HIGH to Output in Low-Zt WHQXt en(W)55nsRead Cycle 2: G-, E-controlled (during Read cycle: W = V IH )gAi DQiOutputAi E GI CCDQiOutputUL635H256L- to H-level undefined H- to L-leveli:If W is low and when E goes low, the outputs remain in the high impedance state.j:E or W must be V IH during address transition.Write Cycle #1: W-controlled jWrite Cycle #2: E-controlled jAi E W DQiInputDQiOutputHigh ImpedanceAi E W DQiInputDQiOutputUL635H256 Nonvolatile Memory OperationsMode SelectionE W A13 - A0(hex)Mode I/O Power NotesH X X Not Selected Output High Z StandbyL H X Read SRAM Output Data Active m L L X Write SRAM Input Data ActiveL H0E3831C703E03C1F303F0FC0Read SRAMRead SRAMRead SRAMRead SRAMRead SRAMNonvolatile STOREOutput DataOutput DataOutput DataOutput DataOutput DataOutput High ZActive k, lk, lk, lk, lk, lk, lL H0E3831C703E03C1F303F0C63Read SRAMRead SRAMRead SRAMRead SRAMRead SRAMNonvolatile RECALLOutput DataOutput DataOutput DataOutput DataOutput DataOutput High ZActive k, lk, lk, lk, lk, lk, lk:The six consecutive addresses must be in order listed. W must be high during all six consecutive cycles. See STORE cycle and RECALL cycle tables and diagrams for further details.The following six-address sequence is used for testing purposes and should not be used: 0E38, 31C7, 03E0, 3C1F, 303F, 339C.l:While there are 15 addresses on the UL635H256, only the lower 14 are used to control software modes.Activation of nonvolatile cycles does not depend on the state of G.m:I/O state assumes that G ≤ V IL.No.PowerStorePower Up RECALLSymbolConditions Min.Max.UnitAlt.IEC24Power Up RECALL Duration n t RESTORE650μs25STORE Cycle Duration f, e t PDSTORE the power supply decayrate has to be smallerthan 10 Vs-1 after thestart of the STOREoperation10ms26Time allowed to Complete SRAMCycle ft DELAY500ns Low Voltage Trigger Level V SWITCH 2.4 2.7Vn: t RESTORE starts from the time V CC rises above V SWITCH.UL635H256o:The software sequence is clocked with E controlled READs.p:Once the software controlled STORE or RECALL cycle is initiated, it completes automatically, ignoring all inputs.q:Note that STORE cycles (but not RECALL) are aborted by V CC < V SWITCH (STORE inhibit).r: An automatic RECALL also takes place at power up, starting when V CC exceeds V SWITCH and takes t RESTORE . V CC must not drop below V SWITCH once it has been exceeded for the RECALL to function properly.s:Noise on the E pin may trigger multiple READ cycles from the same address and abort the address sequence.t:If the Chip Enable Pulse Width is less than t a(E) (see Read Cycle) but greater than or equal t w(E)SR , than the data may not be valid at the end of the low pulse, however the STORE or RECALL will still be initiated.No.Software Controlled STORE/RECALL Cycle k, o Symbol 3545UnitAlt.IEC Min.Max.Min.Max.27STORE/RECALL Initiation Time t AVAV t cR 3545ns 28Chip Enable to Output Inactive p t ELQZ t dis(E)SR 600600ns 29STORE Cycle Time q t ELQXS t d(E)S 1010ms 30RECALL Cycle Time rt ELQXR t d(E)R 2020μs 31Address Setup to Chip Enable s t AVELN t su(A)SR 00ns 32Chip Enable Pulse Width s, t t ELEHN t w(E)SR 2530ns 33Chip Disable to Address Change st EHAXNt h(A)SRnsPowerStore and automatic Power Up RECALLV CC3.0 VPowerStorePower Up V SWITCH W DQiPOWER UP RECALL BROWN OUT BROWN OUT PowerStore(NO SRAM WRITES)RECALL NO STOREUL635H256Software Controlled STORE/RECALL Cycle t, u, v (E = HIGH after STORE initiation)u:W must be HIGH when E is LOW during the address sequence in order to initiate a nonvolatile cycle. G may be either HIGH or LOWthroughout. Addresses 1 through 6 are found in the mode selection table. Address 6 determines wheter the UL635H256 performs a STORE or RECALL.v: E must be used to clock in the address sequence for the Software controlled STORE and RECALL cycles.Ai EDQiOutputSoftware Controlled STORE/RECALL Cycle t, u, v, w (E = LOW after STORE initiation)Ai EDQiOutputUL635H256Test Configuration for Functional CheckV IHV ILV SS1.1 k95030 pF wV O S i m u l t a n e o u s m e a s u r e -m e n t o f a l l 8 o u t p u t p i n sI n p u t l e v e l a c c o r d i n g t o t h er e l e v a n t t e s t m e a s u r e m e n tDQ0DQ1DQ2DQ3DQ4DQ5DQ6DQ7A0A1A2A3A4A5A6A7A8A9A10A11A12E W G3 VA13A14V CCXw:In measurement of t dis -times and t en -times the capacitance is 5 pF.x:Between V CC and V SS must be connected a high frequency bypass capacitor 0.1 μF to avoid disturbances.Capacitance e Conditions Symbol Min.Max.Unit Input Capacitance V CC V I f T a= 3.0 V = V SS = 1MHz = 25 °CC I 8pF Output CapacitanceC O7pFAll Pins not under test must be connected with ground by capacitors.Operating Temperature Range C =0to 70 °C K =-40to 85 °CG1S245C UL635H256TypePackageS =SOP28 (330mil) Type 1 S2 = SOP28 (330mil) Type 2Ordering Code Leadfree Optionblank =Standard PackageG1=Leadfree Green Package Access Time35=35 ns (V CC = 3.0 ... 3.6 V)45=45 ns (V CC = 2.7 ... 3.6 V)y: on special requestExample Date of manufacture(The first 2 digits indicating the year, and the last 2 digits the calendar week.)Leadfree Green PackageProduct specificationInternal CodeDevice Marking (example)ZMDUL635H256S2C 45Z 0425G1UL635H25611March 31, 2006STK Control #ML0059Rev 1.0Device OperationThe UL635H256 has two separate modes of operation:SRAM mode and nonvolatile mode. The memory ope-rates in SRAM mode as a standard fast static RAM.Data is transferred in nonvolatile mode from SRAM to EEPROM (the STORE operation) or from EEPROM to SRAM (the RECALL operation). In this mode SRAM functions are disabled.STORE cycles may be initiated under user control via a software sequence and are also automatically initiated when the power supply voltage level of the chip falls below V SWITCH . RECALL operations are automatically initiated upon power up and may also occur when the V CC rises above V SWITCH , after a low power condition.RECALL cycles may also be initiated by a software sequence.SRAM READThe UL635H256 performs a READ cycle whenever E and G are LOW and W is HIGH. The address specified on pins A0 - A14 determines which of the 32768 data bytes will be accessed. When the READ is initiated by an address transition, the outputs will be valid after a delay of t cR . If the READ is initiated by E or G, the out-puts will be valid at t a(E) or at t a(G), whichever is later.The data outputs will repeatedly respond to address changes within the t cR access time without the need for transition on any control input pins, and will remain valid until another address change or until E or G is brought HIGH or W is brought LOW.SRAM WRITEA WRITE cycle is performed whenever E and W are LOW. The address inputs must be stable prior to entering the WRITE cycle and must remain stable until either E or W goes HIGH at the end of the cycle. The data on pins DQ0 - 7 will be written into the memory if it is valid t su(D) before the end of a W controlled WRITE or t su(D) before the end of an E controlled WRITE.It is recommended that G is kept HIGH during the entire WRITE cycle to avoid data bus contention on the common I/O lines. If G is left LOW, internal circuitry will turn off the output buffers t dis (W) after W goes LOW.Automatic STOREThe UL635H256 uses the intrinsic system capacitance to perform an automatic STORE on power down. As long as the decay rate from the system power supply is smaller than 15 Vs -1 the UL635H256 will safely and automatically STORE the SRAM data in EEPROM on power down.In order to prevent unneeded STORE operations, auto-matic STORE will be ignored unless at least one WRITE operation has taken place since the most recent STORE or RECALL cycle. Software initiated STORE cycles are performed regardless of whether or not a WRITE operation has taken place.Automatic RECALLDuring power up, an automatic RECALL takes place. At a low power condition (power supply voltage < V SWITCH )an internal RECALL request may be latched. As soon as power supply voltage exceeds the sense voltage of V SWITCH , a requested RECALL cycle will automatically be initiated and will take t RESTORE to complete.If the UL635H256 is in a WRITE state at the end of power up RECALL, the SRAM data will be corrupted. To help avoid this situation, a 10 k Ω resistor should be connected between W and power supply voltage.Software Nonvolatile STOREThe UL635H256 software controlled STORE cycle is initiated by executing sequential READ cycles from six specific address locations. By relying on READ cycles only, the UL635H256 implements nonvolatile operation while remaining compatible with standard 32K x 8SRAMs. During the STORE cycle, an erase of the pre-vious nonvolatile data is performed first, followed by a parallel programming of all the nonvolatile elements.Once a STORE cycle is initiated, further inputs and out-puts are disabled until the cycle is completed.Because a sequence of addresses is used for STORE initiation, it is important that no other READ or WRITE accesses intervene in the sequence or the sequence will be aborted.To initiate the STORE cycle the following READ sequence must be performed:1. Read addresses 0E38(hex)Valid READ 2. Read addresses 31C7(hex)Valid READ 3. Read addresses 03E0(hex)Valid READ 4. Read addresses 3C1F (hex)Valid READ 5. Read addresses 303F (hex)Valid READ 6.Read addresses0FC0(hex)Initiate STORE CycleOnce the sixth address in the sequence has been entered, the STORE cycle will commence and the chip will be disabled. It is important that READ cycles and not WRITE cycles be used in the sequence, although it is not necessary that G be LOW for the sequence to be valid. After the t STORE cycle time has been fulfilled, the SRAM will again be activated for READ and WRITE operation.UL635H25612 March 31, 2006STK Control #ML0059Rev 1.0Software Nonvolatile RECALLA RECALL cycle of the EEPROM data into the SRAMis initiated with a sequence of READ operations in amanner similar to the STORE initiation. To initiate theRECALL cycle the following sequence of READ opera-tions must be performed:1. Read addresses0E38(hex)Valid READ2. Read addresses31C7(hex)Valid READ3. Read addresses03E0(hex)Valid READ4. Read addresses3C1F(hex)Valid READ5. Read addresses303F(hex)Valid READ6. Read addresses0C63(hex)Initiate RECALLCycleInternally, RECALL is a two step procedure. First, theSRAM data is cleared and second, the nonvolatileinformation is transferred into the SRAM cells. Aftert d(E)R cycle time the SRAM will once again be ready forREAD and WRITE operations.The RECALL operationin no way alters the data in the EEPROM cells. Thenonvolatile data can be recalled an unlimited number oftimes.Hardware ProtectionThe UL635H256 offers hardware protection againstinadvertent STORE operation through V CC Sense.When V CC < V SWITCH all software STORE operationswill be inhibited.Low Average Active PowerThe UL635H256 has been designed to draw signifi-cantly less power when E is LOW (chip enabled) butthe cycle time is longer than 45 ns.When E is HIGH the chip consumes only standby cur-rent.The overall average current drawn by the part dependson the following items:1. CMOS or TTL input levels2. the time during which the chip is disabled (E HIGH)3. the cycle time for accesses (E LOW)4. the ratio of READs to WRITEs5. the operating temperature6. the V CC levelThe information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved.UL635H256LIFE SUPPORT POLICYSimtek products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Simtek product could create a situation where personal injury or death may occur.Components used in life-support devices or systems must be expressly authorized by Simtek for such purpose. LIMITED WARRANTYThe information in this document has been carefully checked and is believed to be reliable. However, Simtek makes no guarantee or warranty concerning the accuracy of said information and shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it. The information in this document describes the type of component and shall not be considered as assured characteristics.Simtek does not guarantee that the use of any information contained herein will not infringe upon the patent, trademark, copyright, mask work right or other rights of third parties, and no patent or licence is implied hereby. This document does not in any way extent Simtek’s warranty on any product beyond that set forth in its standard terms and conditions of sale.Simtek reserves terms of delivery and reserves the right to make changes in the products or specifications, or both, presented in this publication at any time and without notice.March 31, 2006Change recordDate/Rev Name Change01.11.2001Ivonne Steffens format revision and release for …Memory CD 2002“03.07.2002Matthias Schniebel adding 35 ns type with V CC = 3.0 ... 3.6 V25.09.2002Matthias Schniebel Adding …Type 1“ to SOP28 (330mil)09.01.2003Matthias Schniebel Removing 55 ns type20.10.2003Matthias Schniebel Low Voltage Trigger Level V SWITCH = 2.4 ... 2.7 V (old: 2.5 ... 2.7 V)changing max. decay rate from the system power supply to 15 Vs-1(old: 10 Vs-1)05.12.2003Matthias Schniebel I CC = 8 mA typ. at 200 ns Cycle Timeadding K-Type with 35 ns: I CC1 = 47 mA, I CC(SB)1 = 12mA21.04.2004Matthias Schniebel adding …Leadfree Green Package“ to ordering informationadding …Device Marking“7.4.2005Stefan Günther Page1: adding RoHS compliance and Pb- free, 106 endurance cyclesand 100a data retention,add also S2 package (chip pack) and ordering code31.3.2006Troy Meester changed to obsolete status1.0Simtek Assigned Simtek Document Control Number。
EM351中文资料(List Unclassifed)中文数据手册「EasyDatasheet - 矽搜」
收发器使用高效架构,超过由所施加动态范围要求 IEEE 802.15.4-2003标准由超过15分贝.集成接收通道滤波允许强大合作 存在与在2.4GHz频谱其他通信标准,如IEEE 802.11-2007和 蓝牙.集成稳压器,VCO,环路滤波器和功率放大器防护持外部元件数量 低.可选高性能无线模式（升压模式）,可通过软件选择,以提高动态范围.
4-2
7.2配置
7-2
4.4集成MAC模块
4-2
7.3强制功能
7-3
4.5数据包跟踪接口（PTI）
4-2
7.4复位
7-4
4.6随机数发生器
4-2
7.5启动配置
7-4
5 ARM ® 皮质 TM-M3和内存
7.6 GPIO模式
7-5
模块
5-1
7.6.1模拟模式
7-5
7.6.2输入模式
7-6
5.1 ARM ® 皮质 TM-M3微处理器
AES128加密加速器
灵活ADC,UART / SPI / TWI串行
通信和通用定时器
24高度可配置GPIO与施密特
触发器输入
业界领先ARM
® 皮质 M3处理器
领先32位处理性能
高效Thumb-2指令集
运行在6,12,或24兆赫
灵活嵌套向量中断控制器
低功耗,先进管理
接收电流（W / CPU）：26毫安
该EM35x提供许多先进电源管理功能,使电池寿命长.一个高频内部RC振荡器允许处理器核心醒来时 迅速开始执行代码. 各种深睡眠模式可低于1μA功耗,同时防护持RAM内容. 为支持用户自定义应用程序,片上外设包括UART,SPI,TWI,ADC,以及通用定时器,以及多达24个GPIO. 此外,集成电压调节器,电源接通复位电路,和睡眠定时器可用.
EMC6W201-AEZG中文资料(SMSC)中文数据手册「EasyDatasheet - 矽搜」
芯片中文手册,看全文,戳
Auto Fan Device with Piecewise Linear Control, Temperature Monitoring & Voltage Monitoring for MultiProcessor Systems
概述
该EMC6W201是环境监测设备,自动风扇控制能力, 增强系统声学噪声抑制.这符合ACPI设备提供硬件 监视多达六个电压（包括其自己VCC）和五个外部热传感器,测量 多达五个风扇速度,并控制多个直流风扇使用三个脉冲宽度速度 调制器（PWM）输出.需要注意是,可以通过连接两个风扇到一个PWM输出控制多于三个风扇.该 EMC6W201将在36引脚QFN封装,无铅RoHS标准封装.
通道.
EMC6W201
汽车风扇装置与
分段线性控制,
温度监控和 电压监测 多处理器系统
数据摘要
电压监控器
- 显示器电源（+ 1.5V,+ 2.5V,+ 5V,VCC和 两节1.5V VCCP）
- 所有监测值限制比较 - 中断引脚对于超出极限电压指示 PROCHOT输入/双向引脚（2） - 可选引脚专用输入或输入/输出 - 独立PROCHOT输出引脚（FORCED_PR＃）
80 ARKAY DRIVE, HAUPPAUGE, NY 11788 (631) 435-6000, FAX (631) 273-3123
Copyright © 2007 SMSC or its subsidiaries. All rights reserved.
Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently, complete information sufficient for construction purposes is not necessarily given. Although the information has been checked and is believed to be accurate, no responsibility is assumed for inaccuracies. SMSC reserves the right to make changes to specifications and product descriptions at any time without notice. Contact your local SMSC sales office to obtain the latest specifications before placing your product order. The provision of this information does not convey to the purchaser of the described semiconductor devices any licenses under any patent rights or other intellectual property rights of SMSC or others. All sales are expressly conditional on your agreement to the terms and conditions of the most recently dated version of SMSC's standard Terms of Sale Agreement dated before the date of your order (the "Terms of Sale Agreement"). The product may contain design defects or errors known as anomalies which may cause the product's functions to deviate from published specifications. Anomaly sheets are available upon request. SMSC products are not designed, intended, authorized or warranted for use in any life support or other application where product failure could cause or contribute to personal injury or severe property damage. Any and all such uses without prior written approval of an Officer of SMSC and further testing and/or modification will be fully at the risk of the customer. Copies of
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元器件交易网EM MICROELECTRONIC-MARIN SA Voltage Detector, High-PrecisionDescriptionThe EM6352 is an ultra-low current voltage detector available in a large variety of configurations and very small packages for maximum flexibility in all end-applications up to 125°C and using power supplies between 1.5V and 5.5V. This circuit monitors the supply voltage of any electronic system, and generates the appropriate reset signal without a delay time. The threshold defines the minimum allowed voltage which guarantees the good functionality of the system. As long as VDD stays above the threshold voltage, the output stays inactive. If VDD drops below VTH, the output goes active. The output is guaranteed to be in the correct state for VDD down to 0.8V. There are 12 reset threshold voltages starting as low as 1.31V and up to 4.63V. The EM6352 features three output types: active-low push-pull, active-low open-drain and active-high push-pull. Small SC70 and SOT23 packages as well as ultra-low supply current of 2.7µA make the EM6352 an ideal choice for portable and battery-operated devices.EM6352Features! ! ! !Ultra-low supply current of 2.7µA (VDD=3.3V) Operating temperature range: -40°C to +125°C ±1.5% reset threshold accuracy 12 reset threshold voltages VTH: 4.63V, 4.4V, 3.08V, 2.93V, 2.63V, 2.26V, 2.2V, 1.8V, 1.66V, 1.57V, 1.38V, 1.31V 3 reset output options: Active-low RESET push-pull Active-low RESET open-drain Active-high RESET push-pull No external components Immune to short negative VDD transients Guaranteed Reset valid down to 0.8V Threshold hysteresis: 2.1% of VTH Very small SOT23-5L, SOT23-3L, SC70-3L and SC70-4L (SC-82AB) packages!! ! ! ! !Typical ApplicationVDD VDD RESET*VDD RESETApplications! ! ! ! ! ! ! ! !EM6352GNDMPU, DSPGNDGND* REXT for open-drain version onlyPin Configuration (top view)RESET 1 (RESET) VDD GND 2 3 4 NC GND 2 5 NC RESET 1 (RESET) 3 VDDMobile and cordless phones Modems Printers TV, VCR, Video sets GPS Toys Basestations NiCd cell battery Automotive systemsBlock DiagramVDD Voltage ReferenceSOT23-5LRESET 1 (RESET) VDD 2 4 GND 3 NC GND RESET (RESET)SOT23-3L1 3 VDD 2+RESET (RESET)SC70-4L (SC-82AB)SC70-3LGNDPin DescriptionSOT23-5L SOT23-3L Pin SC70-4L SC70-3L Name Function Active-low RESET output. RESET remains low while VDD is below the reset threshold voltage.Active-high RESET output. RESET remains high while VDD is below the reset threshold voltage. Supply Voltage (5.5V max.) Ground Not connected. Not internally connectedRESET1 1 1 2 RESET 2 3 4, 5 3 2 2 4 3 3 1 VDD GND N.C.Copyright © 2006, EM Microelectronic-Marin SA 03/06 – rev.I1元器件交易网EM6352Ordering InformationEM6352 X SP3B - 2.9 +Reset Output Type: X = Active-low /RES push-pull Y = Active-low /RES open-drain Z = Active-high RES push-pull RoHS Compliance: + = lead-free/green mold compliant [blank] = leaded Reset Threshold Voltage (VTH): 1.3 = 1.31V 2.26 = 2.26V 1.4 = 1.38V 2.6 = 2.63V 1.6 = 1.57V 2.9 = 2.93V 1.7 = 1.66V 3.1 = 3.08V 1.8 = 1.80V 4.4 = 4.40V 2.2 = 2.20V 4.6 = 4.63VPackage: SP3B = SOT23-3, Tape&Reel 3000 pcs SP5B = SOT23-5, Tape&Reel 3000 pcs SC3B = SC70-3, Tape&Reel 3000 pcs SC4B = SC70-4, Tape&Reel 3000 pcsNote:subject to availability (see standard versions list below). Please give complete Part Number when ordering.Standard Versions (Top Marking)Top Marking Top 1) Marking with 4 Characters2)Part NumberPart NumberTop 1) MarkingTop Marking 2) with 4 CharactersEM6352XSP3B-1.3 EM6352XSP3B-1.8 EM6352XSP3B-1.8+ EM6352XSP3B-2.2 EM6352XSP3B-2.2+ EM6352XSP3B-2.26 EM6352XSP3B-2.26+ EM6352XSP3B-2.6 EM6352XSP3B-2.6+ EM6352XSP3B-2.9 EM6352XSP3B-2.9+ EM6352XSP3B-4.6 EM6352XSP3B-4.6+ EM6352XSP5B-1.3 EM6352XSP5B-1.8 EM6352XSP5B-2.6 EM6352XSP5B-2.9 EM6352XSP5B-4.61)K3## K5## K7##K8## KE##AKAA AKAE BKAE AKAF BKAF AKAY BKAY AKAG BKAG AKAH BKAH AKAL BKAL AKAA AKAE AKAG AKAH AKALEM6352XSC3B-1.3 EM6352XSC3B-1.8 EM6352XSC3B-2.2 EM6352XSC3B-2.2+ EM6352XSC3B-2.6 EM6352XSC3B-2.9 EM6352XSC3B-2.9+ EM6352XSC3B-4.6 EM6352XSC3B-4.6+ EM6352YSP3B-2.26 EM6352YSP3B-2.6 EM6352YSP3B-2.9 EM6352YSC3B-2.6 EM6352YSC3B-4.6 EM6352YSC4B-1.3 EM6352YSC4B-2.9 EM6352YSC4B-3.1K5## K8##AKAA AKAE AKAF BKAF AKAG AKAH BKAH AKAL BKAL AKAZ AKAT AKAU AKAT AKAX AKAM AKAU AKAVTop marking is the standard from 2006. No bottom marking exists. Where ## refers to the lot number (EM internal reference only) 2) Top marking with 4 characters is standard from 2003. For lead-free/green mold (RoHS) parts, the first letter of top marking with 4 characters begins with letter “B” instead of letter “A”. Bottom marking indicates the lot number.Standard Versions (samples)Part NumberEM6352XSC3B-2.2+ EM6352XSC3B-2.9+ EM6352XSC3B-4.6+ EM6352XSP3B-2.2 EM6352XSP3B-2.26+Part NumberEM6352XSP3B-2.6+ EM6352XSP3B-2.9+ EM6352XSP3B-4.6+ EM6352YSC4B-3.1 EM6352YSP3B-2.2Sample stock is generally held on standard versions only. Non standard versions have a 30,000 pieces minimum order quantity. Please contact factory for other versions not shown here and for availability of non standard versions.Copyright © 2006, EM Microelectronic-Marin SA 03/06 – rev.I2元器件交易网EM6352Absolute Maximum RatingsParameter Voltage at VDD to GND Minimum voltage at any signal pin Maximum voltage at any signal pin Electrostatic discharge max. to MIL-STD-883C method 3015.7 with ref. to VSS Max. soldering conditions Storage Temperature Range Symbol VDDVMIN VMAX VESD TMAX TSTGHandling ProceduresConditions -0.3V to +6VGND - 0.3V VDD + 0.3V 2000V 250°C x 10s -65°C to +150°C This device has built-in protection against high static voltages or electric fields; however, anti-static precautions must be taken as for any other CMOS component. Unless otherwise specified, proper operation can only occur when all terminal voltages are kept within the voltage range. Unused inputs must always be tied to a defined logic voltage level.Operating ConditionsParameter Supply voltage (note 1) Operating Temperature Symbol Min Max Unit VDD 0.8 5.5 V TA -40 +125 °CStresses above these listed maximum ratings may cause permanent damages to the device. Exposure beyond specified operating conditions may affect device reliability or cause malfunction.Electrical CharacteristicsUnless otherwise specified: VDD= 0.8V to 5.5V, TA=+25°C (note 1). Parameter Symbol Conditions +25°C VDD=1.5V -40°C to +125°C Supply current (note 2) IDD VDD=3.3V VDD=5.0V +25°C -40°C to +125°C +25°C -40°C to +125°CMin 1.290 1.359 1.546 1.635 1.773 2.167 2.226 2.591 2.886 3.034 4.334 4.561Typ2.1 2.7 3.2 1.31 1.38 1.57 1.66 1.80 2.20 2.26 2.63 2.93 3.08 4.40 4.63Max 4.57 5.4 8.3 6.3 9.6 1.330 1.401 1.594 1.685 1.827 2.233 2.294 2.669 2.974 3.126 4.466UnitµAEM6352 – 1.3 EM6352 – 1.4 EM6352 – 1.6 EM6352 – 1.7 EM6352 – 1.8 Threshold voltage (note 3) VTH EM6352 – 2.2 EM6352 – 2.26 EM6352 – 2.6 EM6352 – 2.9 EM6352 – 3.1 EM6352 – 4.4 EM6352 – 4.6V4.699 Threshold voltage ∆VTH TA = -40°C to +125°C ppm/°C temperature coefficient ±50 ∆TA (note 4) Threshold hysteresis VHYS 2.1%•VTH V Note 1: Production tested at +25°C only. Over temperature limits are guaranteed by design, not production tested. VDD min=0.9V for active-high versions (EM6352Z). Note 2: RESET (RESET) open. Note 3: Threshold voltage is specified for VDD falling. Note 4: Typical variation ∆VTH of VTH at a given temperature TA is calculated as follows:∆VTH (T = TA ) = ∆VTH × VTH × TA − 25°C ∆TAExample: -6 for version VTH=2.93V, variation at TA=70°C is equal to ∆VTH(70°C)=±50•10 x 2.93 x (70-25)=±6.59mVCopyright © 2006, EM Microelectronic-Marin SA 03/06 – rev.I3元器件交易网EM6352Electrical CharacteristicsParameterReset timeout period Propagation delay time VDD to RESET (RESET) delay Open-drain RESET output Voltage(continued)Unless otherwise specified: VDD= 0.8V to 5.5V, TA=+25° C (note 1).SymboltPOR tP VOLConditionsVDD from 0V to VTH (typ)+15% (note 2) VDD drops from VTH (typ)+0.2V to VTH (typ)-0.2V (note 2) VDD>1V -40°C to +125°C VDD>2.5V VDD>5V VDD>1V IOL=100µA IOL=1.5mA IOL=3mA IOL=100µA IOL=1.5mA IOL=3mA IOH=-30µA IOH=-1.5mA IOH=-3mAMin9 2 0.8 2 4Typ500 130 -Max1090 255 0.3 0.3 0.3 0.3 0.3 0.3 -Unit µs µsVVOL Push-pull RESET / RESET Output voltage VOH-40°C to +125°CVDD>2.5V VDD>5V VDD>1VV-40°C to +125°CVDD>2.5V VDD>5VOutput leakage current ILEAK -40°C to +125°C, only for EM6352Y (open-drain) 0.5 Note 1: Production tested at +25°C only. Over temperature limits are guaranteed by design, not production tested. VDD min=0.9V for active-high version (EM6352Z). Note 2: RESET (RESET) open.µATiming WaveformsVDD VTHtSENOverdriveVHYS0.8V t logic "1" RESET logic "0" t logic "1"tPOR tPRESET RESETlogic "0" tNote 5: tSEN = Maximum Transient Duration. Please refer to figure on next page. Note 6: Overdrive = VTH- -VDD. Please refer to figure on next page.Copyright © 2006, EM Microelectronic-Marin SA 03/06 – rev.I4元器件交易网EM6352Typical Operating Characteristics(Typical values are at TA=+25°C unless otherwise noted, RESET or RESET open.)7 6 5 [ uA ] 4 3 2 1 0 -50VDD 1. 5 V VDD 5 . 0 V VDD 3 . 3 V300 250 200 [ us ] 150 100 50 0 -50 -25-2502550 [ °C ]75100 1250255075100 125[ °C ]IDD vs. TemperaturePropagation Time tP vs. Temperature2500 2000 1500 [ us ] 1000 500 0 -50 -25400 350 300 [ us ] 250 200 150 100 50 0 25 50 75 100 125 0 1 10 [ mV ] 100 1000 Reset occurs above this line[ °C ]Reset Timeout Period tPOR vs. TemperatureMaximum Transient Duration tSEN vs. Overdrive VTH-VDD8% 6% 4% 2% 0% -2% -4% -6% -8% -50 -25 0 25 50 75 100 125 [°C]Threshold Voltage Variation vs. Temperature (normalized)Copyright © 2006, EM Microelectronic-Marin SA 03/06 – rev.I5元器件交易网EM6352Package InformationDA1 A2 ASOT23-3LEC LBH eSYMBOL A A1 A2 B C D E e e1 H L MIN 0.89 0.013 0.95 0.37 0.085 2.80 1.20 1.78 2.10e1TYP MAX 1.04 1.12 0.10 0.97 1.00 0.51 0.12 0.18 2.95 3.04 1.32 1.40 0.95 1.90 2.05 2.40 2.64 0.55Dimensions are in mmDA1 A2 ASOT23-5LE1C Lb eSYM BOL A A1 A2 b C D E E1 e e1 LEM IN 0.90 0.05 0.90 0.35 0.08 2.80 2.60 1.50e1TYP M AX 1.30 1.45 0.08 0.15 1.15 1.30 0.50 0.20 2.90 3.00 2.80 3.00 1.75 0.95 1.90 0.45Dimensions are in mmCopyright © 2006, EM Microelectronic-Marin SA 03/06 – rev.I6元器件交易网EM6352Package Information (continued)D b LSC70-3LHEEPIN 1eeQ1cSYMBOL e D b E HE Q1 A2 A1 A c LMIN MAX 0.65 BSC 1.80 2.20 0.25 0.40 1.15 1.35 1.80 2.40 0.10 0.40 0.80 1.00 0.00 0.10 0.80 1.10 0.10 0.18 0.10 0.30A2AA1NOTE: " All dimensions are in millimeters " Dimensions are inclusive of plating " Dimensions are exclusive of mold flash & metal burr " All specifications comply to EIAJ SC70D e eSC70-4LLHEEPIN 1e1 b b1 Q1A2AA1c NOTE: " All dimensions are in millimeters " Dimensions are inclusive of plating " Dimensions are exclusive of mold flash & metal burr " All specifications comply to EIAJ SC70 " Even though the width of pin 2 on SC70-4L is slightly larger than on socalled 4-pin SC-82AB, the footprint of SC70-4L package is compatible with the footprint of SC-82AB package from other suppliers, and thus suitable for pin-to-pin replacement. Please check footprint on PCB.SYMBOL e e1 D b b1 E HE Q1 A2 A1 A c LMIN MAX 0.65 BSC 0.5 BSC 1.80 2.20 0.15 0.30 0.575 0.70 1.15 1.35 1.80 2.40 0.10 0.40 0.80 1.00 0.00 0.10 0.80 1.10 0.10 0.18 0.10 0.30Traceability for small packagesDue to the limited space on the package surface, the bottom marking contains a limited number of characters that provide only partial information for lot traceability. Full information for complete traceability is however provided on the packing labels of the product at delivery from EM. It is highly recommended that the customer insures full lot traceability of EM product in his final product.EM Microelectronic-Marin SA (EM) makes no warranty for the use of its products, other than those expressly contained in the Company's standard warranty which is detailed in EM's General Terms of Sale located on the Company's web site. EM assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of EM are granted in connection with the sale of EM products, expressly or by implications. EM's products are not authorized for use as components in life support devices or systems.Product qualification is performed according to internal EM quality standards for industrial products. For any special requirement (eg. automotive grade) please contact EM Microelectronic-Marin S.A.Copyright © 2006, EM Microelectronic-Marin SA 03/06 – rev.I7。