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Arduino Nano ESP32 产品参考手册说明书

Arduino Nano ESP32 产品参考手册说明书

Product Reference ManualSKU: ABX00083DescriptionThe Arduino Nano ESP32 (with and without headers) is a Nano form factor board based on the ESP32-S3 (embedded in the NORA-W106-10B from u-blox®). This is the first Arduino board to be based fully on an ESP32, and features Wi-Fi®, Bluetooth® LE, debugging via native USB in the Arduino IDE as well as low power.The Nano ESP32 is compatible with the Arduino IoT Cloud, and has support for MicroPython. It is an ideal board for getting started with IoT development.Target areas:Maker, Debugging, IoT, MicroPythonFeaturesXtensa® Dual-core 32-bit LX7 Microprocessor Up to 240 MHz384 kB ROM512 kB SRAM16 kB SRAM in RTC (low power mode)DMA ControllerPowerOperating voltage 3.3 VVUSB supplies 5 V via USB-C® connectorVIN range is 6-21 VConnectivityWi-Fi®Bluetooth® LEBuilt-in antenna2.4 GHz transmitter/receiverUp to 150 MbpsPins14x digital (21x including analog)8x analog (available in RTC mode)SPI(D11,D12,D13), I2C (A4/A5), UART(D0/D1) Communication PortsSPII2CI2SUARTCAN (TWAI®)Low Power7 μA consumption in deep sleep mode240 μA consumption in light sleep modeRTC MemoryUltra Low Power (ULP) CoprocessorPower Management Unit (PMU)ADC in RTC mode55556778888999910101011111111121212131313131314151516Contents1 The Board1.1 Application Examples 2 ESP32 Core3 Recommended Operating Conditions4 Block Diagram5 Board Topology5.1 Front View6 NORA-W106-10B (Radio Module / MCU)6.1 Xtensa® Dual-Core 32bit LX7 Microprocessor 6.2 Wi-Fi®6.3 Bluetooth®7 System7.1 Resets 7.2 Timers 7.3 Interrupts8 Serial Communication Protocols8.1 Inter-Integrated Circuit (I2C)8.2 Inter-IC Sound (I2S)8.3 Serial Peripheral Interface (SPI)8.4 Universal Asynchronous Receiver/Transmitter (UART)8.5 Two Wire Automotive Interface (TWAI®)9 External Flash Memory 10 USB Connector 11 Power Options11.1 Power Tree 11.2 Pin Voltage 11.3 VIN Rating 11.4 VUSB11.5 Using the 3.3 V Pin 11.6 Pin Current 12 Pinout12.1 Analog (JP1)12.2 Digital (JP2)13 Mounting Holes And Board Outline161617171717174191920202014 Board Operation14.1 Getting Started - IDE14.2 Getting Started - Arduino Web Editor 14.3 Getting Started - Arduino IoT Cloud 14.4 Online Resources 14.5 Board Recovery15 Declaration of Conformity CE DoC (EU)16 Declaration of Conformity to EU RoHS & REACH 211 01/19/202117 Conflict Minerals Declaration 18 FCC Caution19 Company Information 20 Reference Documentation 21 Change Log1 The BoardNano ESP32 is a 3.3 V development board based on the NORA-W106-10B from u-blox®, a module that includes a ESP32-S3 system on a chip (SoC). This module has support for Wi-Fi® and Bluetooth® Low Energy (LE), with amplified communication through a built-in antenna. The CPU (32-bit Xtensa® LX7) support clock frequencies at up to 240 MHz and has native support for debugging via the USB-C® connector.1.1 Application ExamplesHome automation: an ideal board for automating your home, and can be used for smart switches, automatic lighting and motor control for e.g. motor controlled blinds.IoT sensors: with several dedicated ADC channels, accessible I2C/SPI buses and a robust ESP32-S3 based radio module, this board can easily be deployed to monitor sensor values.Low power designs: create battery powered applications with low power consumption, utilising the built in low power modes of the ESP32-S3 SoC.2 ESP32 CoreThe Nano ESP32 uses the Arduino Core for ESP32 boards, a derivation of Espressif's arduino-esp32 core. Rating3 Recommended Operating ConditionsSymbol Description Min Typ Max UnitV IN Input voltage from VIN pad67.021VV USB Input voltage from USB connector 4.8 5.0 5.5VT OP Operating Temperature-402585°CFunctional Overview4 Block DiagramArduino Nano ESP32 Block Diagram5 Board Topology5.1 Front ViewTop View of Arduino Nano ESP32 Ref.DescriptionM1NORA-W106-10B (ESP32-S3 SoC)J1CX90B-16P USB-C® connectorJP11x15 analog headerJP21x15 digital headerU2MP2322GQH step down converterU3GD25B128EWIGR 128 Mbit (16 MB) ext. flash memory DL1RGB LEDDL2LED SCK (serial clock)DL3LED Power (green)D2PMEG6020AELRX Schottky DiodeD3PRTR5V0U2X,215 ESD Protection6 NORA-W106-10B (Radio Module / MCU)The Nano ESP32 features the NORA-W106-10B stand alone radio module, embedding an ESP32-S3 series SoC as well as an embedded antenna. The ESP32-S3 is based on an Xtensa® LX7 series microprocessor.6.1 Xtensa® Dual-Core 32bit LX7 MicroprocessorThe microprocessor for the ESP32-S3 SoC inside the NORA-W106 module is a dual-core 32-bit Xtensa® LX7. Each core can run at up to 240 MHz and has 512 kB SRAM memory. The LX7 features:32-bit customized instruction set128-bit data bus32-bit multiplier / dividerSupport for JTAG debuggingThe LX7 has a 384 kB ROM (Read Only Memory), and 512 kB of SRAM (Static Random Access Memory). It also features an 8 kB RTC FAST and RTC SLOW memory. These memories are designed for low-power operations, where the SLOW memory can be accessed by the ULP (Ulta Low Power) coprocessor, retaining the data in deep sleep mode.6.2 Wi-Fi®The NORA-W106-10B module supports the Wi-Fi® 4 IEEE 802.11 standards b/g/n, with an output power EIRP at up to 10 dBm. The max range for this module is 500 meters.802.11b: 11 Mbit/s802.11g: 54 Mbit/s802.11n: 72 Mbit/s max at HT-20 (20 MHz), 150 Mbit/s max at HT-40 (40 MHz)6.3 Bluetooth®The NORA-W106-10B module supports Bluetooth® LE v5.0 with an output power EIRP at up to 10 dBm and data rates up to 2 Mbps. It has the option to scan and advertise simultaneously, as well as supporting multiple connections in peripheral/central mode.7 System7.1 ResetsThe ESP32-S3 has support for four levels of reset:CPU: resets CPU0/CPU1 coreCore: resets the digital system, except for the RTC peripherals (ULP coprocessor, RTC memory).System: resets the entire digital system, including the RTC peripherals.Chip: resets the entire chip.It is possible to conduct a software reset of this board, as well as obtaining the reset reason.To do a hardware reset of the board, use the onboard reset button (PB1).7.2 TimersThe Nano ESP32 has the following timers:52-bit system timer with 2x 52-bit counters (16 MHz) and 3x comparators.4x general-purpose 54-bit timers3x watchdog timers, two in main system (MWDT0/1), one in the RTC module (RWDT).7.3 InterruptsAll GPIOs on the Nano ESP32 can be configured to be used as interrupts, and is provided by an interrupt matrix. Interrupt pins are configured on an application level, using the following configurations:LOWHIGHCHANGEFALLINGRISING8 Serial Communication ProtocolsThe ESP32-S3 chip provides flexibility for the various serial protocols it supports. For example, the I2C bus can be assigned to almost any available GPIO.8.1 Inter-Integrated Circuit (I2C)Default pins:A4 - SDAA5 - SCLThe I2C bus is by default assigned to the A4/A5 (SDA/SCL) pins for retro compatibility. This pin assignment can however be changed, due to the flexibility of the ESP32-S3 chip.The SDA and SCL pins can be assigned to most GPIOs, however some of these pins may have other essential functions that prevents I2C operations to run successfully.Please note: many software libraries uses the standard pin assignment (A4/A5).8.2 Inter-IC Sound (I2S)There two I2S controllers that are typically used for communication with audio devices. There are no specific pins assigned for I2S, this can be used by any free GPIO.Using standard or TDM mode, the following lines are used:MCLK - master clockBCLK - bit clockWS - word selectDIN/DOUT - serial dataUsing PDM mode:CLK - PDM clockDIN/DOUT serial dataRead more about the I2S protocol in Espressif's Peripheral API - InterIC Sounds (I2S)8.3 Serial Peripheral Interface (SPI)SCK - D13COPI - D12CIPO - D11CS - D10The SPI controller is by default assigned to the pins above.8.4 Universal Asynchronous Receiver/Transmitter (UART)D0 / TXD1 / RXThe UART controller is by default assigned to the the pins above.8.5 Two Wire Automotive Interface (TWAI®)The CAN/TWAI® controller is used to communicate with systems using the CAN/TWAI® protocol, particularly common in the automotive industry. There are no specific pins assigned for the CAN/TWAI® controller, any free GPIO can be used.Please note: TWAI® is also known as the CAN2.0B, or "CAN classic". The CAN controller is NOT compatible with CAN FD frames.9 External Flash MemoryNano ESP32 features a 128 Mbit (16 MB) external flash, the GD25B128EWIGR (U3). This memory is connected to the ESP32 via Quad Serial Peripheral Interface (QSPI).The operating frequency for this IC is 133 MHz, and has a data transfer rate at up to 664 Mbit/s.10 USB ConnectorThe Nano ESP32 has one USB-C® port, used to power and program your board as well as sending & receiving serial communication.Note that you should not power the board with more than 5 V via the USB-C® port.11 Power OptionsPower can either be supplied via the VIN pin, or via USB-C® connector. Any voltage input either via USB or VIN is stepped down to 3.3 V using the MP2322GQH (U2) converter.The operating voltage for this board is 3.3 V. Please note that there's no 5V pin available on this board, only the VBUS can provide 5 V when the board is powered via USB.11.1 Power TreeArduino Nano ESP32 power tree.11.2 Pin VoltageAll digital & analog pins on the Nano ESP32 are 3.3 V. Do not connect any higher voltage devices to any of the pins as it will risk damaging the board.11.3 VIN RatingThe recommended input voltage range is 6-21 V.You should not attempt to power the board with a voltage outside the recommended range, particularly not higher than 21 V.The efficiency of the converter depends on the input voltage via the VIN pin. See the average below for a board operation with normal current consumption:4.5 V - >90%.12 V - 85-90%18 V - <85%This information is extracted from the MP2322GQH's datasheet.11.4 VUSBThere is no 5V pin available on the Nano ESP32. 5 V can only be provided via the VUSB, which is supplied directly from the USB-C® power source.While powering the board via the VIN pin, the VUSB pin is not activated. This means you have no option of providing 5 V from the board unless powered via USB or externally.11.5 Using the 3.3 V PinThe 3.3 V pin is connected to the 3.3 V rail which is connected to the output of the MP2322GQH step down converter. This pin is primarily used to power external components.11.6 Pin CurrentThe GPIOs on the Nano ESP32 can handle source currents up to 40 mA, and sink currents up to 28 mA. Never connect devices that draw higher current directly to a GPIO.Mechanical Information12 PinoutPinout for Nano ESP32.12.1 Analog (JP1)Pin Function Type Description1SCK NC Serial Clock2+3V3Power+3V3 Power Rail3BOOT0Mode Board Reset 04A0Analog Analog input 05A1Analog Analog input 16A2Analog Analog input 27A3Analog Analog input 38A4Analog Analog input 4 / I²C Serial Datal (SDA) 9A5Analog Analog input 5 / I²C Serial Clock (SCL) 10A6Analog Analog input 611A7Analog Analog input 712VUSB Power USB power (5V)13BOOT1Mode Board Reset 114GND Power Ground15VIN Power Voltage Input12.2 Digital (JP2)Pin Function Type Description1D12 / CIPO*Digital Controller In Peripheral Out2D11 / COPI*Digital Controller Out Peripheral In3D10Digital Chip Select4D9Digital GPIO 95D8Digital GPIO 86D7Digital GPIO 77D6Digital GPIO 68D5Digital GPIO 59D4Digital GPIO 410D3Digital GPIO 311D2Digital GPIO 212GND Power Ground13RST Internal Reset14D1/RX Digital GPIO 4 / Serial 0 Receiver (RX) 15D0/TX Digital GPIO 3 / Serial 0 Transmitter (TX) *CIPO/COPI replaces the MISO/MOSI terminology.13 Mounting Holes And Board OutlineMechanical View of Nano ESP3214 Board Operation14.1 Getting Started - IDEIf you want to program your Nano ESP32 while offline you need to install the Arduino IDE [1]. To connect the Nano ESP32 to your computer, you will need a Type-C® USB cable, which can also provide power to the board, as indicated by the LED (DL1).14.2 Getting Started - Arduino Web EditorAll Arduino boards, including this one, work out-of-the-box on the Arduino Web Editor [2], by just installing a simple plugin.The Arduino Web Editor is hosted online, therefore it will always be up-to-date with the latest features and support for all boards. Follow [3] to start coding on the browser and upload your sketches onto your board.14.3 Getting Started - Arduino IoT CloudAll Arduino IoT enabled products are supported on Arduino IoT Cloud which allows you to log, graph and analyze sensor data, trigger events, and automate your home or business.14.4 Online ResourcesNow that you have gone through the basics of what you can do with the board you can explore the endless possibilities it provides by checking exciting projects on Arduino Project Hub [4], the Arduino Library Reference [5], and the online store [6]; where you will be able to complement your board with sensors, actuators and more. 14.5 Board RecoveryAll Arduino boards have a built-in bootloader which allows flashing the board via USB. In case a sketch locks up the processor and the board is not reachable anymore via USB, it is possible to enter bootloader mode by double-tapping the reset button right after the power-up.Certifications15 Declaration of Conformity CE DoC (EU)We declare under our sole responsibility that the products above are in conformity with the essential requirements of the following EU Directives and therefore qualify for free movement within markets comprising the European Union (EU) and European Economic Area (EEA).16 Declaration of Conformity to EU RoHS & REACH 21101/19/2021Arduino boards are in compliance with RoHS 2 Directive 2011/65/EU of the European Parliament and RoHS 3 Directive 2015/863/EU of the Council of 4 June 2015 on the restriction of the use of certain hazardous substances in electrical and electronic equipment.Substance Maximum Limit (ppm)Lead (Pb)1000Cadmium (Cd)100Mercury (Hg)1000Hexavalent Chromium (Cr6+)1000Poly Brominated Biphenyls (PBB)1000Poly Brominated Diphenyl ethers (PBDE)1000Bis(2-Ethylhexyl} phthalate (DEHP)1000Benzyl butyl phthalate (BBP)1000Dibutyl phthalate (DBP)1000Diisobutyl phthalate (DIBP)1000Exemptions : No exemptions are claimed.Arduino Boards are fully compliant with the related requirements of European Union Regulation (EC) 1907 /2006 concerning the Registration, Evaluation, Authorization and Restriction of Chemicals (REACH). We declare none of the SVHCs (https://echa.europa.eu/web/guest/candidate-list-table), the Candidate List of Substances of Very High Concern for authorization currently released by ECHA, is present in all products (and also package) in quantities totaling in a concentration equal or above 0.1%. To the best of our knowledge, we also declare that our products do not contain any of the substances listed on the "Authorization List" (Annex XIV of the REACH regulations) and Substances of Very High Concern (SVHC) in any significant amounts as specified by the Annex XVII of Candidate list published by ECHA (European Chemical Agency) 1907 /2006/EC.17 Conflict Minerals DeclarationAs a global supplier of electronic and electrical components, Arduino is aware of our obligations with regards to laws and regulations regarding Conflict Minerals, specifically the Dodd-Frank Wall Street Reform and Consumer Protection Act, Section 1502. Arduino does not directly source or process conflict minerals such as Tin, Tantalum, Tungsten, or Gold. Conflict minerals are contained in our products in the form of solder, or as a component in metal alloys. As part of our reasonable due diligence Arduino has contacted component suppliers within our supply chain to verify their continued compliance with the regulations. Based on the information received thus far we declare that our products contain Conflict Minerals sourced from conflict-free areas.18 FCC CautionAny Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:(1) This device may not cause harmful interference(2) this device must accept any interference received, including interference that may cause undesired operation. FCC RF Radiation Exposure Statement:1. This Transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.2. This equipment complies with RF radiation exposure limits set forth for an uncontrolled environment.3. This equipment should be installed and operated with a minimum distance of 20 cm between the radiator &your body.English: User manuals for licence-exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the device or both. This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions:(1) this device may not cause interference(2) this device must accept any interference, including interference that may cause undesired operation of the device.French: Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes :(1) l’ appareil nedoit pas produire de brouillage(2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.IC SAR Warning:English This equipment should be installed and operated with a minimum distance of 20 cm between the radiator and your body.French: Lors de l’ installation et de l’ exploitation de ce dispositif, la distance entre le radiateur et le corps est d ’au moins 20 cm.Important: The operating temperature of the EUT can’t exceed 85℃ and shouldn’t be lower than -40 ℃. Hereby, Arduino S.r.l. declares that this product is in compliance with essential requirements and other relevant provisions of Directive 201453/EU. This product is allowed to be used in all EU member states.19 Company InformationCompany name Arduino SRLCompany Address Via Andrea Appiani, 25 - 20900 MONZA Italy)20 Reference DocumentationRef LinkArduino IDE (Desktop)https:///en/Main/SoftwareArduino Web Editor(Cloud)https:///editorWeb Editor - Getting Started https:///cloud/web-editor/tutorials/getting-started/getting-started-web-editorProject Hub https:///projecthub?by=part&part_id=11332&sort=trending Library Reference https:///arduino-libraries/Online Store https:///21 Change LogDate Changes08/06/2023Release。

AEM 数字微欧姆仪说明书

AEM 数字微欧姆仪说明书

Technical Hotline: (800) 343-1391DigitalMicro-OhmmetersOur products are backed by over 100 years of experience in test and measurement equipment, and encompass the latest international standards for quality and safety.FEATURES►Selectable test currents from 10mA to 200A (model dependent) ►Resolutions to 0.1 micro-ohm ►Accuracies to 0.05%►Large easy to read backlit display ►Automatic and softwaretemperature compensation (model dependent)►Automatic multipoint measurements►Internal data storage of test results ►Analysis and report generation software (DataView ®) included ►Built into a rugged field proven case►Kelvin test cables includedIP 53cover open2• 2 Kelvin clips, 10ft (10A - Hippo)• 2 Kelvin Probes 10ft (1A, spring loaded)• NiMH rechargeable battery pack • Optical USB cable • US 115V power cord • DataView ® software • Extra large tool bag • 2 spare fuses (12.5A)• User manual• 1017.84Kelvin Clips 10ft (10A - Hippo)• 2118.70 Kelvin Clips 20ft (10A - Hippo)• 2118.73 Kelvin Probes 10ft (1A, spring loaded)• 2118.74 Kelvin Probes 20ft (1A, spring loaded)• 2118.75 2 Kelvin Probes Pistol Grip 10ft (10A - spring loaded)• 2118.76 2 Kelvin Probes Pistol Grip 20ft (10A - spring loaded)• 2118.77 2 Kelvin Probes 10ft (10A - spring loaded)• 2118.78 2 Kelvin Probes 20ft (10A - spring loaded)• 2118.79 Kelvin Clips 10ft (1-10A)• 2118.80Kelvin Clips 20ft (1-10A)FEATURES►Reliable low resistance measurements ► F our-terminal Kelvin resistance measurement eliminates test lead resistance►Measures up to 4000μΩ with 10A of test current ►0.25% basic accuracy ►1μΩ resolution ► D irect reading, easy to operate►Test current selection of 1mA, 10mA, 100mA, 1A and 10A ► P olarity reversal button ► O verload and input fuse protection ► M anufactured to international safety and environmental standards ► A utomatic scaling and zeroing ► L arge terminals accept banana plugs and spade lugs ► R echargeable NiMH battery with internal charger (110/230V) ► R ugged, double insulated watertight case►I ncludes DataView ® software for instrument configuration, data storage, analysis and report generationAPPLICATIONS► A erospace metallic coating resistance measurement ► B onding verification on earth/ground systems ► W eld joint integrity verification ► C ontact resistance measurement of breakers and switchgear ► A ircraft and rail bonding checks ► W ire to terminal connections and resistance checks ► B attery strap resistance checks ► C able joint and bus bar connection checks ► M echanical bond tests1017.84 (10ft) 2118.70 (20ft)2118.73 (10ft)2118.74 (20ft)2118.752118.762118.772118.782118.79 (10ft)2118.80 (20ft)3IP53cover open4• 2 Kelvin clips 10ft (10A - Hippo)• 2 Kelvin Probes 10ft (1A, spring loaded)• NiMH rechargeable 6V battery pack • Optical USB cable • US 115V power cord • DataView ® software • Extra large tool bag • User manual• 1017.84Kelvin Clips 10ft (10A - Hippo)• 2118.70 Kelvin Clips 20ft (10A - Hippo)• 2118.73 Kelvin Probes 10ft (1A, spring loaded)• 2118.74 Kelvin Probes 20ft (1A, spring loaded)• 2118.75 2 Kelvin Probes Pistol Grip 10ft (10A - spring loaded)• 2118.76 2 Kelvin Probes Pistol Grip 20ft (10A - spring loaded)• 2118.77 2 Kelvin Probes 10ft (10A - spring loaded)• 2118.78 2 Kelvin Probes 20ft (10A - spring loaded)• 2118.79 Kelvin Clips 10ft (1-10A)• 2118.80 Kelvin Clips 20ft (1-10A)• 2129.95 RTD Temperature Probe• 2129.96RTD Temperature Probe w/ 7ft extension cableFEATURES►Test up to 60 minutes continuously at 10A ►Measure from 1μΩ to 2500Ω ► T est current selection of 1mA, 10mA, 100mA, 1A and 10A ► R TD temperature probe to check tested sample (optional) ► S electable metal types ► A utomatic and manual temperature correction ► E MF levels measured and eliminated in measurement ► T wo programmable alarm set points ► S tores up to 1500 test results ► S electable Inductive or Resistive test modes ► A utomatic multiple test mode (multiple tests without pressing the test button) ► L arge multi-line electroluminescent display ► L ocal or remote test setup and control ► I nternal rechargeable batteries – conduct up to 5000 10A tests ► R ugged, double insulated watertight caseAPPLICATIONS►Aerospace metallic coating resistance measurement►Bonding resistance measurement of motors and transformers ► B onding verification on earth/ground systems ► W eld joint integrity verification ► C ontact resistance measurement of breakers and switchgear ► A ircraft and rail bonding checks ► W ire to terminal connections and resistance checks ► B attery strap resistance checks ► C able joint and bus bar connection checks ► M echanical bond tests1017.84 (10ft) 2118.70 (20ft)2118.73 (10ft)2118.74 (20ft)2118.752118.762118.772118.782118.79 (10ft)2118.80 (20ft)2129.952129.96 (w/ cable)56ConstructionRotary selectionswitch Large multi-line backlit liquid crystal display Communication/buttonsAC line receptacle * Function buttons allow direct access to data storage and retrieval, polarity reversal, auto/manual measurement and displayed values.Secondary indicator - test current, voltage,Caution indicatorPolarity indicator Overheating Functional DisplayCurrent output Current output terminal (C-)Potential terminal (P+)Potential7Rotary selectionswitchbacklit liquid crystal displayport RTD temperatureprobe inputbuttonsAC line recharging * Function buttons allow direct access to data storage and retrieval, polarity reversal, auto/manual measurement and displayed values.Temperature correction active indicationConstructionFunctional DisplayCurrent output terminal (C+)Current output terminal (C-)Potential Potential terminal (P-)548• Accessory Bag• 2 25ft Kelvin Test Leads w/ Hippo Clamp (200A)• 1 Green Ground Lead w/ Clamp • USB Cable • Power Cord • User manual• DataView ® software• 2129.72 Lead - Set of 2 25ft Kelvin Leads withHippo Clamp (200A)• 2129.73 Lead - Set of 2 50ft Kelvin Leads withHippo Clamp (200A)• 2129.86 Current Probe Model MR6292• 2129.88 Lead - 10ft Eartth/Ground w/ attachedClamp• 5000.40 110V US Power CordFEATURES► A dvanced cooling system allows continuous testing at 100A or below and up to 120 seconds at 200A ►Allows multiple sequential tests►Programmable test currents from 5 to 200A ► M easures single or both sides grounded systems ► D irect viewing of stored tests on the display ► A ccurately measures low contact resistances from 0.1μΩ to 1Ω ► R esolution of 0.1μΩ ► L arge LCD digital display, available in four languages ► S tores up to 8000 test results ► U SB communication interface ► D irect printout using DataView ® software and a PC ► R ugged, light-weight and water-resistant caseAPPLICATIONS► T est switchgear contact resistance ►Test circuit breaker contact resistance ►Test air frame bonding ► T est rail bonding ►Test pipeline bonding ►Test large transformers2129.862129.72 (25ft)2129.885000.402129.73 (50ft)910ConstructionFunctional DisplayExhaust vents Fuse Alphanumeric keypad and function buttons USBport terminal (C+)Current output terminal (C-)Current probe connectorPotential terminal (P+)Potential terminal (P-)11FEATURES►Configure instrument from your PC►Customize views and templates to your exact needs►Create and store a library of configurations that can be used with the Models 6240, 6255, and 6292 as needed ►Display test results►Print reports using standard included templates or custom templates you design►Upload stored test results to your PCStatistical presentation of measurements All set up functions available from one screenClean, easy-to-read report of test resultsEasily documents statistics about user and test site to be storedwith the dataUnited States & CanadaChauvin Arnoux®, Inc.d.b.a. AEMC® Instruments200 Foxborough Blvd.Foxborough, MA 02035 USA(508) 698-2115 • Fax (508) 698-2118Customer Supportfor placing an order,obtaining price & delivery(800) 343-1391************************Sales & Marketing Departmentfor general sales and marketinginformation********************************Repair & Calibration Servicefor information on repair & calibration***************United States & Canada (continued)Technical & ProductApplication Supportfor technical and application support(800) 343-1391*****************Webmasterfor information regarding our website******************South America, Central America,Mexico & the CaribbeanChauvin Arnoux®, Inc.d.b.a. AEMC® Instruments15 Faraday DriveDover, NH 03820 USA***************Australia & New ZealandChauvin Arnoux®, Inc.d.b.a. AEMC® Instruments15 Faraday DriveDover, NH 03820 USA***************All other countriesChauvin Arnoux® SCA190, rue Championnet75876 Paris Cedex 18, FranceTel 33 1 44 85 45 28Fax 33 1 46 27 73 89***********************Call the AEMC® Instruments Technical Assistance Hotline for immediate consultation with an applications engineer: (800) 343-1391Chauvin Arnoux®, Inc. d.b.a AEMC® Instruments • 200 Foxborough Blvd. • Foxborough, MA 02035 USA • (800) 343-1391 • (508) 698-2115 • Fax (508) 698-2118ExportDepartment:(603)749-6434(x520)•Fax(603)742-2346•E-mail:***************© 2019 Chauvin Arnoux, Inc. d.b.a. AEMC Instruments 950.BR_6240_6255_6292_0319 Printed in the USAVisit our website at 。

tms320vc5416数据手册

tms320vc5416数据手册

TMS320VC5416Fixed-Point Digital Signal Processor Data ManualPRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of the TexasInstruments standard warranty.Production processing does notnecessarily include testing of all parameters.Literature Number:SPRS095PMarch1999–Revised October2008Revision HistoryTMS320VC5416Fixed-Point Digital Signal ProcessorSPRS095P–MARCH 1999–REVISED OCTOBER 2008NOTE:Page numbers for previous revisions may differ from page numbers in the current version.This data sheet revision history highlights the technical changes made to the SPRS095O device-specific data sheet to make it an SPRS095P revision.Scope:This document has been reviewed for technical accuracy;the technical content is up-to-date as of the specified release date with the following corrections.2Revision History Submit Documentation FeedbackContentsTMS320VC5416Fixed-Point Digital Signal ProcessorSPRS095P–MARCH 1999–REVISED OCTOBER 2008Revision History ...........................................................................................................................1TMS320VC5416Features.......................................................................................................2Introduction.......................................................................................................................2.1Description ..................................................................................................................2.2PinAssignments............................................................................................................2.2.1TerminalAssignments forthe GGUPackage...............................................................2.2.2Pin AssignmentsforthePGEPackage......................................................................2.2.3Signal Descriptions ..............................................................................................3Functional Overview ...........................................................................................................3.1Memory ......................................................................................................................3.1.1Data Memory .....................................................................................................3.1.2Program Memory ................................................................................................3.1.3Extended Program Memory ...................................................................................3.2On-Chip ROM With Bootloader ...........................................................................................3.3On-Chip RAM ...............................................................................................................3.4On-Chip Memory Security .................................................................................................3.5Memory Map ................................................................................................................3.5.1Relocatable Interrupt Vector Table ............................................................................3.6On-Chip Peripherals .......................................................................................................3.6.1Software-Programmable Wait-State Generator .............................................................3.6.2Programmable Bank-Switching ................................................................................3.6.3Bus Holders ......................................................................................................3.7Parallel I/O Ports ...........................................................................................................3.7.1Enhanced 8-/16-Bit Host-Port Interface (HPI8/16)..........................................................3.7.2HPI Nonmultiplexed Mode ......................................................................................3.8Multichannel Buffered Serial Ports (McBSPs)..........................................................................3.9Hardware Timer ............................................................................................................3.10Clock Generator ............................................................................................................3.11Enhanced External Parallel Interface (XIO2)...........................................................................3.12DMA Controller .............................................................................................................3.12.1Features ..........................................................................................................3.12.2DMA External Access ...........................................................................................3.12.3DMA Memory Maps .............................................................................................3.12.4DMA Priority Level ...............................................................................................3.12.5DMA Source/Destination Address Modification .............................................................3.12.6DMA in Autoinitialization Mode ................................................................................3.12.7DMA Transfer Counting .........................................................................................3.12.8DMA Transfer in Doubleword Mode ..........................................................................3.12.9DMA Channel Index Registers .................................................................................3.12.10DMA Interrupts ..................................................................................................3.12.11DMA Controller Synchronization Events .....................................................................3.13General-Purpose I/O Pins .................................................................................................3.13.1McBSP Pins as General-Purpose I/O .........................................................................3.13.2HPI Data Pins as General-Purpose I/O ......................................................................3.14Device ID Register .........................................................................................................3.15Memory-Mapped Registers ...............................................................................................3.16McBSP Control Registers and Subaddresses ..........................................................................3.17DMA Subbank Addressed Registers ....................................................................................3.18Interrupts ....................................................................................................................4Support .............................................................................................................................Contents3TMS320VC5416Fixed-Point Digital Signal ProcessorSPRS095P–MARCH1999–REVISED 4.1Documentation Support...................................................................................................4.2Device and Development-Support Tool Nomenclature................................................................5Electrical Specifications......................................................................................................5.1Absolute Maximum Ratings...............................................................................................5.2Recommended Operating Conditions...................................................................................5.3Electrical Characteristics.................................................................................................5.3.1Test Loading.....................................................................................................5.3.2Timing Parameter Symbology............................................................................................5.3.3Internal Oscillator With External Crystal.................................................................................5.4Clock Options...............................................................................................................5.4.1Divide-By-Two and Divide-By-Four Clock Options..........................................................5.4.2Multiply-By-N Clock Option(PLL Enabled)...................................................................5.5Memory and Parallel I/O Interface Timing..............................................................................5.5.1Memory Read....................................................................................................5.5.2Memory Write....................................................................................................5.5.3I/O Read..........................................................................................................5.5.4I/O Write..........................................................................................................5.5.5Ready Timing for Externally Generated Wait States..................................................................5.5.6and Timings...............................................................................................5.5.7Reset,BIO,Interrupt,and MP/MC Timings.............................................................................5.5.8Instruction Acquisition and Interrupt Acknowledge Timings..........................................5.5.9External Flag(XF)and TOUT Timings..................................................................................5.5.10Multichannel Buffered Serial Port(McBSP)Timing...................................................................5.5.10.1McBSP Transmit and Receive Timings....................................................................5.5.10.2McBSP General-Purpose I/O Timing.......................................................................5.5.10.3McBSP as SPI Master or Slave Timing....................................................................5.5.11Host-Port Interface Timing...............................................................................................5.5.11.1HPI8Mode.....................................................................................................5.5.11.2HPI16Mode....................................................................................................6Mechanical Data.................................................................................................................6.1Package Thermal Resistance Characteristics..........................................................................4Contents Submit Documentation FeedbackTMS320VC5416Fixed-Point Digital Signal Processor SPRS095P–MARCH1999–REVISED OCTOBER2008List of Figures2-1144-Ball GGU MicroStar BGA™(Bottom View).............................................................................2-2144-Pin PGE Low-Profile Quad Flatpack(Top View).......................................................................3-1TMS320VC5416Functional Block Diagram..................................................................................3-2Program and Data Memory Map................................................................................................3-3Extended Program Memory Map...............................................................................................3-4Process Mode Status Register..................................................................................................3-5Software Wait-State Register(SWWSR)[Memory-Mapped Register(MMR)Address0028h].........................3-6Software Wait-State Register(SWWSR)[Memory-Mapped Register(MMR)Address0028h].........................3-7Bank-Switching Control Register BSCR)[MMR Address0029h]...........................................................3-8Host-Port Interface—Nonmulltiplexed Mode.................................................................................3-9HPI Memory Map.................................................................................................................3-10Multichannel Control Register(MCR1).........................................................................................3-11Multichannel Control Register(MCR2).........................................................................................3-12Pin Control Register(PCR)......................................................................................................3-13Nonconsecutive Memory Read and I/O Read Bus Sequence.............................................................3-14Consecutive Memory Read Bus Sequence(n=3reads)..................................................................3-15Memory Write and I/O Write Bus Sequence.................................................................................3-16DMA Transfer Mode Control Register(DMMCRn)...........................................................................3-17On-Chip DMA Memory Map for Program Space(DLAXS=0and SLAXS=0).........................................3-18On-Chip DMA Memory Map for Data and IO Space(DLAXS=0and SLAXS=0)....................................3-19DMPREC Register................................................................................................................3-20General-Purpose I/O Control Register(GPIOCR)[MMR Address003Ch]................................................3-21General-Purpose I/O Status Register(GPIOSR)[MMR Address003Dh].................................................3-22Device ID Register(CSIDR)[MMR Address003Eh].........................................................................3-23IFR and IMR Registers...........................................................................................................5-1Tester Pin Electronics............................................................................................................5-2Internal Divide-By-Two Clock Option With External Crystal...............................................................5-3External Divide-By-Two Clock Timing.........................................................................................5-4Multiply-By-One Clock Timing..................................................................................................5-5Nonconsecutive Mode Memory Reads.......................................................................................5-6Consecutive Mode Memory Reads............................................................................................5-7Memory Write(MSTRB=0)....................................................................................................5-8Parallel I/O Port Read(IOSTRB=0).........................................................................................5-9Parallel I/O Port Write(IOSTRB=0)..........................................................................................5-10Memory Read With Externally Generated Wait States.....................................................................5-11Memory Write With Externally Generated Wait States.....................................................................5-12I/O Read With Externally Generated Wait States...........................................................................5-13I/O Write With Externally Generated Wait States...........................................................................5-14HOLD and HOLDA Timings(HM=1).........................................................................................List of Figures5TMS320VC5416Fixed-Point Digital Signal ProcessorSPRS095P–MARCH1999–REVISED 5-15Reset and BIO Timings.........................................................................................................5-16Interrupt Timing..................................................................................................................5-17MP/MC Timing...................................................................................................................5-18Instruction Acquisition(IAQ)and Interrupt Acknowledge(IACK)Timings................................................5-19External Flag(XF)Timing......................................................................................................5-20TOUT Timing.....................................................................................................................5-21McBSP Receive Timings.......................................................................................................5-22McBSP Transmit Timings.......................................................................................................5-23McBSP General-Purpose I/O Timings........................................................................................5-24McBSP Timing as SPI Master or Slave:CLKSTP=10b,CLKXP=0....................................................5-25McBSP Timing as SPI Master or Slave:CLKSTP=11b,CLKXP=0....................................................5-26McBSP Timing as SPI Master or Slave:CLKSTP=10b,CLKXP=1....................................................5-27McBSP Timing as SPI Master or Slave:CLKSTP=11b,CLKXP=1....................................................5-28Using HDS to Control Accesses(HCS Always Low)........................................................................5-29Using HCS to Control Accesses...............................................................................................5-30HINT Timing......................................................................................................................5-31GPIOx Timings...................................................................................................................5-32Nonmultiplexed Read Timings.................................................................................................5-33Nonmultiplexed Write Timings.................................................................................................5-34HRDY Relative to CLKOUT....................................................................................................6List of Figures Submit Documentation FeedbackTMS320VC5416Fixed-Point Digital Signal Processor SPRS095P–MARCH1999–REVISED OCTOBER2008List of Tables2-1Terminal Assignments for the TMS320VC5416GGU(144-Pin BGA Package).........................................2-2Signal Descriptions...............................................................................................................3-1Standard On-Chip ROM Layout...............................................................................................3-2Processor Mode Status(PMST)Register Bit Fields........................................................................3-3Software Wait-State Register(SWWSR)Bit Fields.........................................................................3-4Software Wait-State Control Register(SWCR)Bit Fields..................................................................3-5Bank-Switching Control Register(BSCR)Fields..............................................................................3-6Bus Holder Control Bits..........................................................................................................3-7Sample Rate Input Clock Selection...........................................................................................3-8Clock Mode Settings at Reset.................................................................................................3-9DMD Section of the DMMCRn Register......................................................................................3-10DMA Reload Register Selection...............................................................................................3-11DMA Interrupts...................................................................................................................3-12DMA Synchronization Events..................................................................................................3-13DMA Channel Interrupt Selection..............................................................................................3-14Device ID Register(CSIDR)Bits................................................................................................3-15CPU Memory-Mapped Registers................................................................................................3-16Peripheral Memory-Mapped Registers for Each DSP Subsystem........................................................3-17McBSP Control Registers and Subaddresses.................................................................................3-18DMA Subbank Addressed Registers...........................................................................................3-19Interrupt Locations and Priorities................................................................................................5-1Input Clock Frequency Characteristics.........................................................................................5-2Clock Mode Pin Settings for the Divide-By-2and By Divide-By-4Clock Options.......................................5-3Divide-By-2and Divide-By-4Clock Options Timing Requirements.......................................................5-4Divide-By-2and Divide-By-4Clock Options Switching Characteristics...................................................5-5Multiply-By-N Clock Option Timing Requirements..........................................................................5-6Multiply-By-N Clock Option Switching Characteristics......................................................................5-7Memory Read Timing Requirements..........................................................................................5-8Memory Read Switching Characteristics.....................................................................................5-9Memory Write Switching Characteristics.....................................................................................5-10I/O Read Timing Requirements................................................................................................5-11I/O Read Switching Characteristics...........................................................................................5-12I/O Write Switching Characteristics............................................................................................5-13Ready Timing Requirements for Externally Generated Wait States......................................................5-14Ready Switching Characteristics for Externally Generated Wait States..................................................5-15HOLD and HOLDA Timing Requirements....................................................................................5-16HOLD and HOLDA Switching Characteristics...............................................................................5-17Reset,BIO,Interrupt,and MP/MC Timing Requirements..................................................................5-18Instruction Acquisition(IAQ)and Interrupt Acknowledge(IACK)Switching Characteristics...........................List of Tables7TMS320VC5416Fixed-Point Digital Signal ProcessorSPRS095P–MARCH1999–REVISED 5-19External Flag(XF)and TOUT Switching Characteristics...................................................................5-20McBSP Transmit and Receive Timing Requirements.......................................................................5-21McBSP Transmit and Receive Switching Characteristics..................................................................5-22McBSP General-Purpose I/O Timing Requirements........................................................................5-23McBSP General-Purpose I/O Switching Characteristics...................................................................5-24McBSP as SPI Master or Slave Timing Requirements(CLKSTP=10b,CLKXP=0).................................5-25McBSP as SPI Master or Slave Switching Characteristics(CLKSTP=10b,CLKXP=0).............................5-26McBSP as SPI Master or Slave Timing Requirements(CLKSTP=11b,CLKXP=0).................................5-27McBSP as SPI Master or Slave Switching Characteristics(CLKSTP=11b,CLKXP=0).............................5-28McBSP as SPI Master or Slave Timing Requirements(CLKSTP=10b,CLKXP=1).................................5-29McBSP as SPI Master or Slave Switching Characteristics(CLKSTP=10b,CLKXP=1).............................5-30McBSP as SPI Master or Slave Timing Requirements(CLKSTP=11b,CLKXP=1).................................5-31McBSP as SPI Master or Slave Switching Characteristics(CLKSTP=11b,CLKXP=1).............................5-32HPI8Mode Timing Requirements.............................................................................................5-33HPI8Mode Switching Characteristics..........................................................................................5-34HPI16Mode Timing Requirements............................................................................................5-35HPI16Mode Switching Characteristics.......................................................................................6-1Thermal Resistance Characteristics............................................................................................8Submit Documentation Feedback List of Tables1TMS320VC5416FeaturesTMS320VC5416 Fixed-Point Digital Signal Processor SPRS095P–MARCH1999–REVISED OCTOBER2008Reads•Advanced Multibus Architecture With ThreeSeparate16-Bit Data Memory Buses and One•Arithmetic Instructions With Parallel Store and Program Memory Bus Parallel Load•40-Bit Arithmetic Logic Unit(ALU)Including a•Conditional Store Instructions40-Bit Barrel Shifter and Two Independent•Fast Return From Interrupt 40-Bit Accumulators•On-Chip Peripherals•17-×17-Bit Parallel Multiplier Coupled to a–Software-Programmable Wait-State 40-Bit Dedicated Adder for Non-Pipelined Generator and ProgrammableSingle-Cycle Multiply/Accumulate(MAC)Bank-SwitchingOperation–On-Chip Programmable Phase-Locked •Compare,Select,and Store Unit(CSSU)for the Loop(PLL)Clock Generator With External Add/Compare Selection of the Viterbi Operator Clock Source–One16-Bit Timer•Exponent Encoder to Compute an Exponent–Six-Channel Direct Memory Access(DMA) Value of a40-Bit Accumulator Value in aControllerSingle Cycle–Three Multichannel Buffered Serial Ports •Two Address Generators With Eight Auxiliary(McBSPs)Registers and Two Auxiliary Register–8/16-Bit Enhanced Parallel Host-Port Arithmetic Units(ARAUs)Interface(HPI8/16)•Data Bus With a Bus Holder Feature•Power Consumption Control With IDLE1,•Extended Addressing Mode for8M×16-Bit IDLE2,and IDLE3Instructions With Maximum Addressable External ProgramPower-Down ModesSpace•CLKOUT Off Control to Disable CLKOUT •128K×16-Bit On-Chip RAM Composed of:•On-Chip Scan-Based Emulation Logic,IEEE –Eight Blocks of8K×16-Bit On-ChipStd1149.1(JTAG)Boundary Scan Logic(1) Dual-Access Program/Data RAM•144-Pin Ball Grid Array(BGA)(GGU Suffix)–Eight Blocks of8K×16-Bit On-ChipSingle-Access Program RAM•144-Pin Low-Profile Quad Flatpack(LQFP)(PGE Suffix)•16K×16-Bit On-Chip ROM Configured forProgram Memory• 6.25-ns Single-Cycle Fixed-Point InstructionExecution Time(160MIPS)•Enhanced External Parallel Interface(XIO2)•8.33-ns Single-Cycle Fixed-Point Instruction •Single-Instruction-Repeat and Block-RepeatExecution Time(120MIPS) Operations for Program Code• 3.3-V I/O Supply Voltage(160and120MIPS)•Block-Memory-Move Instructions for BetterProgram and Data Management• 1.6-V Core Supply Voltage(160MIPS)•Instructions With a32-Bit Long Word Operand• 1.5-V Core Supply Voltage(120MIPS)(1)IEEE Standard1149.1-1990Standard-Test-Access Port and •Instructions With Two-or Three-OperandBoundary Scan ArchitectureTMS320C54x,TMS320are trademarks of Texas Instruments.All other trademarks are the property of their respective owners.PRODUCTION DATA information is current as of publication date.Copyright©1999–2008,Texas Instruments Incorporated Products conform to specifications per the terms of the TexasInstruments standard warranty.Production processing does notnecessarily include testing of all parameters.。

Autodesk Nastran 2023 参考手册说明书

Autodesk Nastran 2023 参考手册说明书
DATINFILE1 ........................................................................................................................................................... 9
FILESPEC ............................................................................................................................................................ 13
DISPFILE ............................................................................................................................................................. 11
File Management Directives – Output File Specifications: .............................................................................. 5
BULKDATAFILE .................................................................................................................................................... 7

opennsfw2 用法 -回复

opennsfw2 用法 -回复

opennsfw2 用法-回复OpenNSFW2 是一个用于图像分类任务的深度学习模型,其用途是在应用程序中进行图像内容的自动分析和过滤。

OpenNSFW2 旨在识别图像中的不雅内容,以帮助保护用户免受色情或暴力图像的侵害。

本文将一步一步回答关于OpenNSFW2 的用法以及如何集成到应用程序中的问题。

第一步:理解OpenNSFW2 原理和背景OpenNSFW2 是一个基于TensorFlow 的深度学习模型,它是根据现有的色情图像数据集进行训练而来。

该模型使用卷积神经网络(CNN)架构,通过对输入图像进行特征提取和分类,来预测图像的不雅程度。

OpenNSFW2 可以根据图像中的一系列特征,如色调、纹理和形状等,对图像进行分类,并给出一个置信度分数。

第二步:安装和配置OpenNSFW2要使用OpenNSFW2,首先需要在计算机上安装TensorFlow。

可以通过TensorFlow 的官方网站或使用包管理器(如pip)来进行安装。

安装过程可能会因操作系统和计算机配置而有所不同,建议按照TensorFlow 官方文档提供的步骤进行安装。

安装TensorFlow 后,可以从GitHub 上的OpenNSFW2 托管库中下载模型文件。

这些模型文件包含了预先训练好的权重和参数,可供直接使用。

将下载的模型文件放置在项目的合适位置,并将其配置为OpenNSFW2 的默认模型。

第三步:编写代码集成OpenNSFW2现在可以在应用程序中集成OpenNSFW2。

下面以Python 为例,演示如何使用OpenNSFW2 进行图像分类。

1. 导入所需的库和模块:import tensorflow as tfimport numpy as npimport cv22. 加载并配置OpenNSFW2 模型:model_path = 'path/to/open_nsfw-2.0.pb' # 指定下载的模型文件路径graph = tf.Graph()sess = tf.Session(graph=graph)with tf.gfile.GFile(model_path, "rb") as f:graph_def = tf.GraphDef()graph_def.ParseFromString(f.read())with graph.as_default():tf.import_graph_def(graph_def, name='')3. 定义函数以预处理图像:def preprocess_image(image_path):image = cv2.imread(image_path)image = (image - [123.68, 116.779, 103.939]) * 0.017image = cv2.resize(image, (224, 224))image = image.reshape((1, 224, 224, 3))return image4. 定义函数以分类图像:def classify_image(image_path):image = preprocess_image(image_path)input_tensor = graph.get_tensor_by_name('input:0')output_tensor = graph.get_tensor_by_name('predictions:0')predictions = sess.run(output_tensor, {input_tensor: image})nsfw_score = predictions[0][1]return nsfw_score5. 调用分类函数并输出结果:image_path = 'path/to/image.jpg' # 指定待分类的图像路径score = classify_image(image_path)print("NSFW Score:", score)通过以上步骤,就可以在应用程序中使用OpenNSFW2 模型进行图像分类,并获取图像的不雅程度分数。

得捷电子 Intellidox端口重组模块及可启用包说明书

得捷电子 Intellidox端口重组模块及可启用包说明书

What’s in the BoxIntellidox Docking ModuleEach Intellidox Docking Module package contains one Intellidox module with a factory-installed nest for the ConneX1 portable gas detector. The power adapter, power cord, calibration gas tubing, exhaust tubing, and user manual are packaged sepa-rately as the Intellidox Enabler Kit. One Enabler Kit is required for each stand-alone Intellidox module.If the Intellidox module is damaged or if parts are missing, con-tact BW T echnologies or an authorized distributor immediately.Intellidox Enabler KitOne Intellidox Enabler Kit is required for each stand-alone Intel-lidox module. Each Enabler Kit contains:1. Power supply and AC power cord appropriate to shippingdestination;2. Ethernet cable;3. Calibration gas and purge gas tubing, cut to 1 meter(3.3 feet);4. Quick connect fittings;5. Exhaust tubing, cut to 4.57 meters (15 feet);6. Inlet (purge) filter assembly;7. Intellidox end plate;8. CD containing the Intellidox Operator’s Manual in PDFformat; and9. CD containing FleetManager II version 3.0.0 software orhigher.If Enabler Kit parts are damaged or missing, or if additionalEnabler Kits are required, contact BW T echnologies or an autho-rized distributor immediately.A b o u t t h i s P u b l i c a t i o nT h i s p u b l i c a t i o n i s a q u i c k -s t a r t r e f e r e n c e g u i d e t o a s s e m b l i n g t h e I n t e l l i d o x D o c k i n g M o d u l e , a n d p r e p a r i n g i t f o r fi r s t u s e . E n s u r e t h a t y o u a r e f a m i l i a r w i t h t h e u s e o f p e r s o n a l g a s d e t e c -t i o n d e v i c e s a n d a c c e s s o r i e s , a n d t a k e a p p r o p r i a t e a c t i o n i n t h ee v e n t of a n a l a r m c o n d i t i o n .F o r a d d i t i o n a l i n f o r m a t i o n r e g a r d i n g I n t e l l i d o x i n s t a l l a t i o n , c o n fi g u r a t i o n , o p e r a t i o n a n d m a i n t e n a n c e , r e f e r t o t h e I n t e l l i d o xO p e r a t o r M a n u a l o r v i s i t w w w .g a s m o n i t o r s .c o m .A b o u t t h e I n t e l l i d o x D o c k i n g M o d u l eT h e I n t e l l i d o x D o c k i n g M o d u l e (‘I n t e l l i d o x ’ o r ‘I n t e l l i d o x m o d u l e ’) i s a n a u t o m a t i c b u m p t e s t a n d c a l i b r a t i o n d o c k i n g s t a t i o n f o r u s e w i t h C o n n e X 1 p o r t a b l e g a s d e t e c t o r s m a n u f a c t u r e d b y B W T e c h n o l o g i e s . T h e I n t e l l i d o x a u t o m a t i c a l l y p e r f o r m s e s s e n t i a l p r o c e d u r e s i n c l u d i n g s e n s o r i d e n t i fi c a t i o n , b u m p t e s t s , c a l i b r a -t i o n s , a l a r m t e s t s a n d d a t a t r a n s f e r s . I t a l s o r e t a i n s a c u m u l a t i v e r e c o r d o f d e t e c t o r d a t a l o g s t h a t a r e t r a n s f e r r e d t o i t s o n b o a r dm e m o r y .T h e I n t e l l i d o x c a n b e u s e d o n a t a b l e t o p o r o t h e r fl a t s u r f a c e . A b u i l t -i n r e t r a c t a b l e s t a n d c a n b e d e p l o y e d t o h o l d t h e I n t e l l i d o x u p r i g h t a t a n a n g l e t h a t i s s u i t a b l e f o r r o u t i n e u s e . I n t e l l i d o x m o d u l e s c a n a l s o b e m o u n t e d o n a w a l l o r o t h e r fl a t s u r f a c e . F o ra d d i t i o n a l i n f o r m a t i o n , r e f e r t o t h e O p e r a t o r M a n u a l.T h i s I n t e l l i d o x m o d e l i s i n t e n d e d f o r u s e a s a s t a n d -a l o n e d o c k -i n g m o d u l e o n l y . D o n o t c o n n e c t t w o o r m o r e I n t e l l i d o x m o d u l e st o g e t h e r .I n t e n d e d U s eU n l e s s o t h e r w i s e s p e c i fi e d a t t i m e o f p u r c h a s e , I n t e l l i d o x m o d -u l e s s h i p p e d f r o m B W T e c h n o l o g i e s :• A r e f a c t o r y c o n fi g u r e d f o r u s e w i t h C o n n e X 1 p o r t a b l e g a s d e t e c t o r s c o n t a i n i n g H 2S s e n s o r s w i t h s t a n d a r d c a l i b r a t i o ng a s s e t t i n g s .• C o n t a i n a m u l t i -g a s e x p a n s i o n m o d u l e .• O p e r a t e a s s t a n d -a l o n e b u m p t e s t a n d c a l i b r a t i o n s t a t i o n s .• M a y b e c o n n e c t e d t o a n e t w o r k v i a E t h e r n e t c a b l e f o r e n h a n c e d a c c e s s t o a n d c o n t r o l o f a d m i n i s t r a t i v e a n dm a i n t e n a n c e t a s k s .• A r e c o m p a t i b l e w i t h F l e e t M a n a g e r I I v e r s i o n 3.0.0 s o f t w a r eo r h i g h e r .I f t h e I n t e l l i d o x m o d u l e o r a n y o f i t s p a r t s a r e d a m a g e d o r m i s s i n g , c o n t a c t B W T e c h n o l o g i e s o r a n a u t h o r i z e d d i s t r i b u t o ri m m e d i a t e l y .N o r m a l O p e r a t i n g C o n d i t i o n sT h e I n t e l l i d o x i s d e s i g n e d t o b e s a f e u n d e r t h e f o l l o w i n g c o n d i -t i o n s :• I n d o o r u s e o n l y• N o r m a l a t m o s p h e r e (20.9% O 2) t h a t i s f r e e o f h a z a r d o u sg a s• T e m p e r a t u r e r a n g e o f +10°C t o +35°C• R e l a t i v e h u m i d i t y o f 0% t o 50%I f t h e i n t e n d e d o p e r a t i n g e n v i r o n m e n t d o e s n o t m a t c h t h e s e c r i -t e r i a , B W T e c h n o l o g i e s r e c o m m e n d s t h a t y o u c o n s u l t a q u a l i fi e d p r o f e s s i o n a l s p e c i a l i s t p r i o r t o i n s t a l l i n g a n d u s i n g a n y I n t e l l i d o xm o d u l e s .T h i s e q u i p m e n t u s e s p o t e n t i a l l y h a r m f u l g a s f o r c a l i b r a t i o n s . T h e I n t e l l i d o x m u s t b e a t t a c h e d t o a v e n t i n g s y s t e m o r b e u s e d i n aw e l l -v e n t i l a t e d a r e a .Copyright, Notices, TrademarksWhile this information is presented in good faith and believed to be accurate, BW Technologies disclaims the implied warranties of merchantability and fitness for a particular purpose and makes no express warranties except as may be stated in its written agree-ment with and for its customers.In no event is BW T echnologies liable to anyone for any indirect, special or consequential damages. The information and specifica-tions in this document are subject to change without notice.Intellidox, ConneX1, and FleetManager II are trademarks of BW Technologies. Other brand or product names are trademarks of their respective owners.Symbol DefinitionsThis manual uses the following signal words, as defined by ANSI Z535.4-1998:Important Safety Information: Read First1. To ensure personal safety, read Safety Information andWarnings before using the Intellidox.2. Use the Intellidox only as specified by the manufacturer.Failure to do so may impair protection provided by the Intellidox.3. The safety and security of any system or networkincorporating the Intellidox and its accessory components is the responsibility of the assembler of the system.4. Follow all required National Electric Codes (NEC) and safetystandards.Prepare for First UseT o ensure that the Intellidox module is ready for safe opera-tion, you must attach the endplate, attach the purge inlet filter assembly, and connect the exhaust tubing before you connect power or attach a gas cylinder.Attach the EndplateEach Intellidox Enabler Kit contains one endplate. T o prevent gas leaks, the end plate must be attached and locked with the lock latch arm before connecting power supply or connecting gas cylinders. The end plate must remain securely latched at all times during operation. If the end plate is detached during operation, disconnect power and replace the end plate immedi-ately.1. Unhook and lift latch arm.2. Attach end plate.3. Lower and lock latch arm.Connect the Purge Inlet Filter AssemblyEach Intellidox Enabler Kit contains one purge inlet filter as-sembly. Unless otherwise specified, the purge inlet is configured to use ambient air in a fresh air environment with a normal atmosphere of 20.9% O 2 that is free of hazardous gas . Ensure that the purge inlet filter assembly is attached before using the Intellidox module. Y ou may attach an extension tubing to the filter assembly to draw ambient air from an adjacent fresh air environment.D o c k i n g M o d u l e50104991-166 || Q R G -E N -F M S U _B 2 E n g l i s h ©2016 B W T e c h n o l o g i e s . Al l r i g h t s r e s e r v e d .2840 2 A v e . S E C a l g a r y , A l b e r t a C a n a d a T 2A 7X 9C a n a d a : 1-800-663-4164U S A : 1-888-749-8878E u r o p e : +44 (0) 1295 700300O t h e r r e g i o n s : 1-403-248-9226F a x : 1-403-273-3708W e b : w w w .h o n e y w e l l a n a l y t i c s .c o mQ u i c k R e f e r e n c eG u i d eBW TECHNOLOGIES BY HONEYWELL 50104991-166 || QRG-EN-FMSU_B2 INTELLIDOX DOCKING MODULE QUICK REFERENCE GUIDEB W T EC H N O L O G I E S B Y H O N E Y W E L L W W W .H O N E Y W E L L A N A L Y T I C S .C O M I N T E L L I D O X D O C K I N G M O D U L E Q U I C K R E F E R E N C E G U I D EI n t e l l i d o x2. If AutoDownload Datalog is set usingFleetManager II software, detector datalogs are automatically transferred to Intellidox.Bump Test PassWhen the bump test is successful, LCD screen background changes to green and Bump test passed message is displayed. Alarm responseand sensor response test items are checked.Press to return to Intellidox user menu.Bump Test FailWhen the bump test fails, LCD screen back-ground changes to red and Bump test failed message is displayed. Failed alarm response and/or sensor response test items are markedwith .If the AutoCal on Failed Bump is set using Fleet-Manager II software, calibration automatically begins.CalibrationCalibration is a two-step procedure that deter-mines the measurement scale for the detector’s response to gas. In the first step, a baseline reading is taken in a clean, uncontaminated environment. In the second step, the sensors are exposed to known concentrations of gas. The detector uses the baseline and known gas concentrations to determine the measurement scale.Calibration Guidelines1. Calibrate only in a normal environment thatis 20.9% O 2 and free of hazardous gas. Do not operate the docking module in a hazardous area. Failure to adhere to this guideline can result in possible personal injury and/or property damage.2. Use only premium grade calibrationgases and cylinders that are approved by BW Technologies, and supplied by BW Technologies or an authorized distributor. The calibration gases mustmeet the accuracy of the detector. For more information, refer to the Operator Manual.3. Do not use a gas cylinder beyond itsexpiration date.4. All calibration cylinders must be usedwith a demand flow regulator and must meet these maximum inlet pressurespecifications: disposable cylinders: 000 psig/70 bar, refillable cylinders: 03000 psig/207 bar5. Do not calibrate the detector duringcharging or immediately after charging is complete.6. Calibrate the sensor if ambient gasreadings vary during startup.7. Calibrate a new sensor before use. Allowthe sensor to stabilize before starting calibration.8. Used sensor: wait 60 seconds 9. New sensor: wait 5 minutes10. When calibrating the same gas detectormultiple times, wait 10 minutes between calibrations to allow the sensor to stabilize.11. If a certified calibration is required,contact BW Technologies or an authorized distributor.Calibrate a DetectorIf AutoCal on Overdue Sensors is set using FleetManager II software and sensors are over-due, then calibration starts automatically once Intellidox recognizes the detector.1. Insert a detector.2. Use and to move to Calibrate mydetector on the Intellidox user menu.3. Press to select Calibrate my detector.The LCD screen background changes to yellow and the calibration progress screen is displayed.4. Calibration begins. Progress screens aredisplayed while the tests are performed.5. If AutoDownload Datalog is set usingFleetManager II software, detector datalogs are automatically transferred to Intellidox.Calibration PassWhen the calibration is successful, LCD screen background changes to green and Calibration passed is displayed. Alarm response and sensor response test items are checked. Press to return to Intellidox user menu.Calibration FailWhen the calibration fails, LCD screen back-ground changes to red and Calibration failed is displayed. Failed alarm response and/or sensor response test items are marked with .1. Ensure that the filter assembly is freeof obstructions and defects.2. Connect the filter assembly to thepurge inlet.3. If necessary, attach an extensiontubing to the filter assembly to draw ambient air from an adjacent fresh air environment.Connect the Exhaust TubingEach Intellidox Enabler Kit includes one exhaust tubing that is 4.57 meters (15 feet) long.1. Inspect the exhaust tubing to ensurethat it is free of obstructions and defects.2. Connect the exhaust tubing to theexhaust outlet.3. Ensure that the exhaust tubing is notconnected to a negative pressure system, or obstructed in any way.Connect the PowerEach Intellidox Enabler Kit contains one power supply and AC power cord. Use only the power supply provided in the Enabler Kit to connect the Intellidox Docking Module to an appropriate electrical power outlet. When the power is connected, the Intellidoxactivates and a self-test is performed.1. Connect the AC power cord to thepower supply2. Connect the power supply to theIntellidox power port.3. Plug the AC power cord into a suitable wall outlet.4. When the power is connected, theIntellidox LCD activates and a self-testis performed.To prevent the corruption or loss of data and/or software and/or firmware, do not deactivate the equipment while performing datalog transfers, bump tests, calibrations or other operations.Charge a DetectorUse the Intellidox to charge detectors fitted with rechargeable batteries. For more infor-mation on battery maintenance, refer to the detector manual.1. Charge only in a normal environmentthat is 20.9% O 2 and free of hazardous gas. Do not operate the docking module in a hazardous area. Failure to adhere to this guideline can result in possible personal injury and/or property damage.2. Deactivate the detector.3. Insert the detector into the Intellidoxmodule.4. Battery charging begins immediately.Battery charging is disabled during bump test and calibration procedures.Once tests and other routines are com-pleted, you may leave the detector in the module for charging. If the detector isactivated, the module will deactivate it after 10 minutes of inactivity. When charging is complete, remove the detector. Do not store the detector in the module.Prepare for Bump Tests and CalibrationsThe Intellidox module is factory-configured for use with ConneX1 portable gas detec-tors containing H 2S sensors. Gas inlets are configured at the factory. Inlet con-figurations cannot be altered. The Intel-lidox Enabler Kit includes quick connect fittings and calibration tubing cut to the minimum recommended length of 1 meter (39 inches). Use only tubing that is between 1 meter (39 inches) and 10 meters (33 feet) in length when you connect gas cylinders to an Intellidox module.Connect Calibration Gas1. Connect a demand flow regulator to the calibration gas cylinder.2. Use the quick connect fittings and calibration gas tubing to connect the calibration gas cylinder to the gas.Bump Test Bump test is a procedure that confirms a detector’s ability to respond to target gasesby exposing the detector to gas concentra-tions that exceed its alarm setpoints.If AutoBump on Insertion is set using FleetManager II software, then bump test starts automatically when Intellidox recog-nizes the detector. If AutoCal on OverdueSensors is enabled and if a calibration is also due, then no bump test is performed. Instead, calibration starts automatically when the detector is recognized.1. Insert a detector.2. Press and on the keypad tomove to Bump test my detector on theIntellidox user menu.3. Press to select Bump Test. TheLCD screen background changes to yellow and the bump test progress screen is displayed.1. The bump test begins. T estsequence progress screens are displayed while the tests are per-formed.Touchpad and buttonsActionMove right Move left Move up Move down Select menu item Save changesClose menu itemReturn to previous screen Cancel changesLCD BacklightBacklight StatusIdlePrompt for user action Activity in progress Activity successful WarningActivity Failed50104991-166 || QRG-EN-FMSU_B2 INTELLIDOX DOCKING MODULE QUICK REFERENCE GUIDE。

索尼HDR-CX900 1英寸 CMOS 传感器摄像头说明书

索尼HDR-CX900 1英寸 CMOS 传感器摄像头说明书

Key Features1” Exmor R ® CMOS sensor w/ Direct Pixel Read OutThe world’s first 1.0” CMOS sensor featuring an Exmor R ® CMOS image sensor technology. With this back-illuminated technology, the sensor doubles light sensitivity and combines with Sony’s Column A/D Conversion to reduce noise by half — a great help when photographing in dimly lit environments. Markedly reduced noise is evident even when high-sensitivity settings are used for capturing night landscapes or indoor scenes.14MP resolution video and 20MP still image captureCreate cinematic video with 14MP resolution sensor (for video) and high quality 20MP still images.Versatile shooting w/ XA VC-S, A VCHD and MP4 codecsThe HDR-CX900 records HD movies in the XA VC-S format, which uses MPEG-4 A VC/H.264 for video compression and linear PCM for audio compression, while saving files in a MP42 wrapper. The highly compressed files allow extensive record times. The camcorder also records in A VCHD, ideal for quality video for HDTV and Blu-ray disc burning. Additionally, the camcorder can shoot MP4 HD video, which is ideal for sharing over the internet at up to 28Mbps. Having the ability to switch between all three of three formats makes this camcorder an ideal tool that is versatile for creating content to live in a number of different environments.Carl Zeiss ® Vario Sonnar T* lens w/ 12x optical zoomThe HDR-CX900 comes equipped with a newly developed Carl Zeiss ® Vario-Sonnar T* lens that has cleared a series of tough performance tests. Not only is this 29mm wide-angle lens ideal for capturing grand landscapes, but it covers wide-ranging image expression thanks to maximum 12x optical zoom and 24x Clear Image zoomMulti-interface Accessory Shoe for system accessoriesUsers can expand photographic and movie shooting possibilities by attaching optional accessories via the Multi Interface Shoe, including an electronic viewfinder, powerful external flash and stereo microphone. You can also connect with a compatible remote control via Multi Terminal.BIONZ ® X Processor enables high Speed rec 120fpsThe new BIONZ ® X image processor enables the camcorder to create more naturally vivid and lifelike image quality, and higher resolution imagery.Notable features of BIONZ X technology include:1. Detail reproduction technology optimally filters edges and textures differently depending on the scene.2. Area specific noise reduction swiftly and efficiently analyzes the subject and reduces noise.This new image processing technology achieves an even better balance of exceptional detail and advanced noise control.Its ability to record at 120p enables slow-motion playback at one-fifth the speed in a 24p environment in post-processing.Optical SteadyShot™ Image Stabilization w/ Active ModeHDR-CX900/BHD Camcorder with 1" sensorWelcome to broadcast-quality HD video from the palm of your hand. The 1” image sensor is approximately 8x larger than that of typical camcorders for capturing defocused backgrounds and true cinematic depth. It’s flexible, too. Record your vision in XA VCS (up to 50mpbs), A VCHD or MP4 codecs with impressive clarity and color accuracy. There’s nothing else like it in the industry.Optical SteadyShot™ Image Stabilization with Intelligent Active Mode is an advanced optical image stabilization technology that corrects camera shake to capture scenes with phenomenal smoothness and stability. Intelligent Active Mode analyzes video frames and provides compensation with assistance from the new BIONZ® X image processing engine. Whether recording movies while strolling on vacation, shooting while chasing a child, or zooming in to capture faraway subjects, Handycam’s simple solution smoothly reproduces the scene with a higher level of stability.High contrast 0.39" OLED EVF for eye-level framingThe HDR-CX900 employs high contrast a 0.39” OLED Tru-Finder EVF which reproduces rich color and deep black. A new optical design of the EVF, using four dual-surface aspherical lenses, allows for a 33-degree wide angle view that is amazing clear through the edge of the view finder. Large 3.5" Xtra Fine LCD™ (921K)The 3.5” (16:9) Xtra Fine LCD™ screen (921K) displays sharp, bright, vivid images, letting you compose a shot more easily -- even outdoors, while enabling you to change settings to best represent the scene.Simple connectivity to smartphones via Wi-Fi®/NFCConnectivity with smartphones for One-touch sharing/One-touch remote has been simplified with Wi-Fi®/NFC control. In addition to Wi-Fi® support for connecting to smartphones, the HDR-CX900 also supports NFC (near field communication) providing “touch connection” convenience when transferring images to Android™ smartphones and tablets. Users need only touch devices to connect; no complex set-up is required. Moreover, when using Smart Remote Control — a feature that allows shutter release to be controlled by a smartphone — connection between HDR-CX900 and the smartphone can be established by simply touching devices.Specifications1. Requires NFC-compatible mobile device. Check device’s user manual for compatibility.© 2014 Sony Electronics Inc. All rights reserved. Reproduction in whole or in part without written permission is prohibited. Sony, Exmor R, BIONZ and the Sony logo are trademarks of Sony Corporation. All other trademarks are trademarks of their respective owners. Features and specifications subject to change without notice. / UPC:027********* / Updated: January 3, 2014。

Active Silicon Snapper SDK 软件开发者工具包说明书

Active Silicon Snapper SDK 软件开发者工具包说明书

SNAPPER SOFTWARE DEVELOPER’S KIT (SDK)•Allows rapid system development and integration usingSnapper hardware.•Comprehensive library functions and documentation for allSnappers and Bus Interface Boards.•Comprehensive application examples with full sourcecode.•Libraries supplied as dynamic link libraries (DLLs/.so) for alloperating systems apart from static libraries for MS-DOS.•Royalty free (provided it is used in conjunction withSnapper hardware).•SDKs are available for the following operating systems:Windows NT, Windows 95, Windows 98, Windows 3.1x,MS-DOS (protected mode), MacOS, Solaris 2, LynxOS andSnapper SDKVxWorks.OVERVIEWThe Snapper SDK is designed for OEMs and integrators using Snapper hardware. It contains comprehensive example applications and optimised libraries for a variety of operating systems (listed above). The API (application programming interface) is consistent across operating systems and hardware platforms allowing easy migration between for example, Windows 3.1x to Windows 95/98/NT, or perhaps from the ISA Bus Interface Board to the PCI Bus Interface Board.The Snapper SDK (pictured above) contains detailed manual pages on all the Snapper functions as well as sections on installation, a developer’s guide, error handling, JPEG (“Crunch”) compression, a glossary and technical notes. Also included is a general purpose imaging library - the “TMG” library, which again runs on all of the above operating systems. This imaging library contains many general purpose imaging functions for the loading, saving, displaying and pixel format conversion of images. A key feature of the display functionality is that the API is virtually independent of the programming environment (e.g. Windows NT, X Windows etc).The libraries for the 32 bit operating systems (i.e. all except Windows 3.1x) are written in native 32 bit code optimised to the environment in which they will be used. MS-DOS static libraries are provided for 32 bit protected mode DOS (using Watcom’s 32 bit compiler).The price of the SDK includes 90 days hotline support. Further maintenance and support is available at a nominal yearly charge, which includes software upgrades and updated manual information.Snapper Software StructureSNAPPER SDK INFORMATIONSupported Operating Systems and Platforms:OS OS Level Platform CompilerWindows NT: v4.0 or above x86 Microsoft Visual C++ (v4.0 or above). Windows 95: - x86 Microsoft Visual C++ (v4.0 or above). Windows 98: - x86 Microsoft Visual C++ (v4.0 or above). Windows 3.1x: - x86 Microsoft Visual C++ (v1.0 , 1.5, 1.51),Microsoft Visual Basic (v3.0 or above). MS-DOS: - x86 Watcom C++ (v10.5 or above) usingWatcom’s 32 bit flat model and Flashtek’sX-32VM DOS extender.MacOS System 7.5 and above, orSystem 8 and aboveAny PCI Mac Metrowerks CodeWarrior Professional 3.Solaris 2: Solaris 2.6 or above. Sparc(SBus & PCI) SunSoft’s SPARCompiler C (v2.0 or above) and GNU C (v2.5 or above).LynxOS: LynxOS 2.5LynxOS Cetia Uni/RT 2.4 X86,PowerPC 603and aboveGCC v2VxWorks: Tornado 1.0.1 PowerPC 603and above.Tornado 1.0.1NOTE:1.The above compilers are fully supported and the example applications are all written with these compilers. Codegenerated on alternative compilers for the above operating systems will also work with the supplied libraries for that operating system.2.Solaris 2.3 is also available but does not include the latest library features and should NOT be used for new projects.SDK Contents:•Comprehensive application examples with full source code: Windows NT/95/98/3.1x are all written using the Microsoft MFC application framework.•Libraries for Windows NT/95/98/3.1x are provided as DLLs (dynamic link libraries). The libraries for Solaris 2 are provided as “.so” (shared object) libraries. Device drivers are provided for each operating system (capable of full DMA as appropriate) which provide the interface between the libraries and the hardware. All Snapper libraries are optimised for the operating system. In other words native 32 bit code is used for 32 bit operating systems.•TMG imaging library - A general purpose imaging library, which includes software JPEG compression and decompression - again optimised to the operating system. Example source code for custom TMG functions is also included.•ActiveX SDK for Windows NT/95/98 developers. The SnapperTool application is provided, not only as an example of an ActiveX program, but also as a simple image acquisition tool.•Comprehensive Developer’s Manual.•90 days telephone support and software upgrades.Support:Support is provided by telephone, fax, e-mail and web site. Yearly support contracts may be purchased which provide telephone support, access to the web-site/FTP site and typically several upgrades per year.TMG Imaging Library:The Snapper SDK is supplied with a general purpose image library referred to as the TMG library. This library provides general purpose imaging functions such as file loading, saving, pixel format conversion etc, as well as JPEG software compression and decompression and display functions. The display API is simple to use and virtually identical across alloperating systems. (Under MS-DOS, the Flash Graphics library from Flashtek is also required - Snapper part numberDOS-FG-LIB.) Other functions include chroma keying, colourmap/palette generation and LUT operations.32 Bit DOS Extenders:The X-32VM DOS extender is a pre-requisite when using the Watcom compiler (Snapper part number DOS-X32-LIB). This allows Flash Graphics compatibility and PCI DMA support.EXAMPLE APPLICATIONSThis example is a complete program that shows how an image is acquired from a Snapper module (Snapper-24 in this example), displayed, then saved as a TIFF file. (This code is written for MS-DOS, but it is identical for all other operating systems, apart from some additional TMG_display calls that may be required).#include <asl_inc.h>int main(ui16 argc, char** argv){Thandle hBase, hSnapper; /* handle to baseboard and Snapper */Thandle hSrcImage, hRGB24Image; /* handle to images */Thandle hDisplay; /* handle to display *//* Initialize the Bus Interface Board, Snapper and Display */hBase = ASL_get_ret(BASE_create(BASE_AUTO));hSnapper = BASE_get_parameter(hBase, BASE_MODULE_HANDLE);hSrcImage = TMG_image_create();hRGB24Image = TMG_image_create();hDisplay = TMG_display_init(hDisplay, TMG_800x600x24); /* 800 by 600, 24 bit *//* Initialize the Snapper in its default RGBX32 bit acquisition mode */SNP24_initialize(hSnapper, SNP24_CCIR_DEFAULT);SNP24_set_image(hSnapper, hSrcImage); /* set image parameters *//* Capture an image, display it and write it to a TIFF file */SNP24_capture(hSnapper, SNP24_START_AND_WAIT);SNP24_read_video_data(hSnapper, hSrcImage, TMG_RUN);TMG_display_image(hDisplay, hSrcImage, TMG_RUN);/* Convert from pixel format RGBX32 to RGB24 */TMG_image_convert(hSrcImage, hRGB24Image, TMG_RGB24, 0, TMG_RUN);TMG_image_set_outfilename(hRGB24Image, "rgb24.tif");TMG_image_write(hRGB24Image, TMG_NULL, TMG_TIFF, TMG_RUN);/* Free memory and exit */BASE_destroy(BASE_ALL_HANDLES);TMG_image_destroy(TMG_ALL_HANDLES);}ORDERING INFORMATIONPART NUMBER DESCRIPTIONSNP-SDK Snapper Software Development Kit.This includes a printed copy of the manual and a CD containing support forWindows 95/98/NT, ActiveX, MS-Dos, MacOS and Solaris 2.The CD contains on-line documentation, driver files, library executables (DLLs or SOs),all header files, as well as all the source code for the examples from the SNP-APPS-CDdetailed below.SNP-SDK-RT Snapper Software Development Kit for Real Time Operating Systems.This includes a printed copy of the manual and a CD containing support for LynxOSand VxWorks as well as Windows 95/98/NT, ActiveX, MS-Dos, MacOS and Solaris 2.The CD contains on-line documentation, driver files, library executables (DLLs or SOs),all header files, as well as all the source code for the examples from the SNP-APPS-CDdetailed below.SNP-SDK-MAN Snapper Software Development Kit printed manual only, as detailed above.SNP-SDK(-RT)-CD Snapper Software Development Kit CD only, as detailed above.SNP-SDK(-RT)-SUP 12 month support and upgrade contract for SDK.SNP-APPS-CD Snapper Application Examples. This consists of pre-compiled examples on a CD. DOS-FG-LIB Flashtek’s “Flash Graphics” library is required in addition to the SNP-SDK for imagingapplications under MS-DOS. This library is royalty free and works with the Watcomcompiler and the X-32VM DOS extender.DOS-X32-LIB Flashtek’s X-32VM 32 bit DOS extender. This is pre-requisite for use with the Watcomcompiler (it allows Flash Graphics and PCI DMA support).SNP-IG Snapper Installation Guide. This is included in the SDK manual, but is available as aseparate item free of charge.TMG-LIB-SW-LIC Software licence to use the TMG library (including its JPEG compression /decompression software and display software) without Snapper hardware. The use ofthe TMG library is free of charge as long as it is used in conjunction with Snapperhardware. If it is used independently (for example - software only JPEG decompressionand display) then a licence must be purchased.ORDERING NOTES•Further operating systems will be supported as PCI becomes available on other platforms - for example DEC Alpha workstations and PowerPC based systems.•Please contact Active Silicon for latest information on other Snappers, Bus Interface Boards, and supported operating systems.USAActive Silicon, Inc479 Jumpers Hole Road, Suite 301, Severna Park, MD 21146, USATel +1 410 696 7642Fax +1 410 696 7643**********************EuropeActive Silicon Limited Pinewood Mews, Bond Close, Iver Bucks, SL0 0NA, UKTel +44 (0) 1753 650600 Fax +44 (0) 1753 651661**********************All trademarks referred to in this datasheet are the property of their respective owners。

IQS7222AEV01 User Guide

IQS7222AEV01 User Guide

IQS7222AEV01 USER GUIDE IQ Switch® - ProxFusion® SeriesTable of ContentsIQS7222AEV01 USER GUIDE (1)1INTRODUCTION (3)2SETTING UP FOR THE IQS7222A STAMP (4)3REFERENCE DESIGNS (6)1 IntroductionThis user guide describes the operation of the IQS7222AEV01 Evaluation Kit. The EV-Kit consists of one part:➢IQS7222A Stamp x 1Please note CT210A is not included in this EV-Kit.To visualise raw data from the EV-Kit, the stamp board can be interfaced to any personal computer with USB support, along with the CT210A and the relevant IQS7222A software Graphical User Interface (GUI) available to download from the Azoteq website. The purpose of the IQS7222AEV01 EV-Kit is to help application and development engineers in evaluating these IC’s capabilities. A picture of the evaluation kit is shown below.2 Setting up for the IQS7222A StampTo interface the IQS7222A Stamp to a PC we advise using the CT210A. This EV Kit can be setup with the following steps:➢Download & Install GUI from Azoteq website➢Plug the stamp board into the CT210A as shown below➢Connect the CT210A to the PC with a USB cable (use USB data cable only)➢Run the IQS7222A GUI (latest version available from the website) ➢Click “Start Streaming” button➢GUI should look as follow.3 Reference DesignsFigure 3-1 IQS7222A QFN20 Stamp LayoutVisit for a list of distributors and worldwide representation., LightSense™, SwipeSwitch™, and the。

苯加氢合成环己烷过程设计课程设计

苯加氢合成环己烷过程设计课程设计

****** 华南理工大学2000级博士研究生学位课程 ******《化工过程模拟和优化》课程设计项目名称:苯加氢合成环己烷过程设计专业:化学工程指导教授:学生:目录1 概述 (3)1.1 设计任务 (3)1.2 生产方式的选择 (3)1.3 工艺流程方块图 (3)1.4 原料质量要求与产品规格 (4)2 工艺流程 (4)2.1工艺流程图 (4)2.2 流程叙述 (4)2.3 流程特点 (5)3 反应系统 (5)3.1 反应方程式 (5)3.2 反应器型式 (5)3.3 反应条件 (5)3.4 产量与进料 (6)3.5催化剂 (6)3.6 反应系统物料衡算 (6)4 分离系统 (7)4.1 分离次序原则 (7)4.2 分离方案 (8)4.3 分离条件的确定 (8)4.4 分离系统的物料衡算 (8)5 能量衡算 (9)5.1 能量衡算结果 (9)5.2 能量衡算分析与讨论 (9)6 参考文献 (10)7 附录 (10)7.1 Aspen 计算流程图 (10)7.2 Aspen 输入输出文件 (10)年产47700吨环己烷过程设计1 概述1.1设计任务项目名称:环己烷生产过程设计 产品名称:环己烷 产品规格:纯度99.9%生产能力:47700吨/年(与50000吨/年己内酰胺厂配套)产品用途:环己烷是用于生产环己醇、环己酮和己二酸的原料,也可用作有机溶剂等。

环己酮进一步生产己内酰胺、聚酰胺6纤维(尼龙6)。

尼龙6具有广泛用途,民用:可纯纺和混纺作衣料、针织品、地毯等;工业:作轮胎的帘子线、帐篷、绳索、降落伞等。

1.2 生产方式的选择工业上生产环己烷有石油馏分分离法和苯加氢法两种。

1.2.1 石油馏分分离法原油中一般含有0.5~1%的环己烷,而粗汽油中约含有5~15%。

将以环己烷为基本组分的汽油进行分离,分出65.6~85.3℃馏分,其中主要含环己烷及甲基环戊烷,然后在80℃,用三氯化铝作催化剂进行处理,此时甲基环戊烷异构化为环己烷. 异构化后的产物,再经过蒸馏、高温裂解(除去烷烃)、溶剂处理(除去芳烃和烯烃)等一系列操作,最后可得到纯度为95%以上的环己烷。

OB2203_Demo Board Manual_(120W)

OB2203_Demo Board Manual_(120W)

120W AdaptorDemo Board Manual(OB2203 + OB6563)Key FeaturesPFC is shut down when system goes to standbyStandby power less than 0.29W under 240V AC no loadHigh efficiency more than 87.7% under normal line with full loadOCP with line compensationProgrammable soft start Precise OVP Low components count Meet EN55022 EMI Pass 4kV surge test Pass 15kV/8kV ESD testOn -B ri g ht co n f i de nt i a l toCh a r mr i chIndex1Adaptor Module Specification................................................................................................................................4 1.1 Input Characteristics...................................................................................................................................4 1.2 Output Characteristics................................................................................................................................4 1.3 Performance Specifications........................................................................................................................4 1.4 Soft Start.....................................................................................................................................................4 1.5 Protection Features.....................................................................................................................................5 1.6 Environments..............................................................................................................................................5 1.7 Dielectric withstand....................................................................................................................................5 1.8 Insulation....................................................................................................................................................5 1.9 Leakage current..........................................................................................................................................5 1.10 Printed circuit board...................................................................................................................................5 1.11 EMI.............................................................................................................................................................5 2 Adaptor Module Information. (6)2.1 Schematic...................................................................................................................................................6 2.2 PCB Gerber File.........................................................................................................................................8 2.3 Bill of material............................................................................................................................................9 2.4 Transformer Design..................................................................................................................................11 2.4.1 Transformer Specification.......................................................................................................................11 2.4.2 Transformer Winding data......................................................................................................................11 2.4.3 Boost Inductor Specicfication.................................................................................................................12 2.4.4 Boost Inductor Winding data..................................................................................................................12 2.5 Adaptor Module Snapshot........................................................................................................................12 3 Performance Evaluation. (14)3.1 Input Characteristics.................................................................................................................................15 3.1.1 Input Normal Characteristics....................................................................................................................15 3.1.2 Input current and Standby power..............................................................................................................16 3.1.3 Efficiency..................................................................................................................................................16 3.2 Output Characteristics..............................................................................................................................17 3.2.1 Line Regulation & Load Regulation.........................................................................................................17 3.2.2 Ripple & Noise..........................................................................................................................................17 3.2.3 Overshoot & Undershoot..........................................................................................................................18 3.2.4 Dynamic Test............................................................................................................................................19 3.2.5 Time Sequence..........................................................................................................................................20 3.3 Protections................................................................................................................................................22 3.3.1 Over Current Protection (OCP).................................................................................................................22 3.3.2 Over V oltage Protection (OVP).................................................................................................................22 3.3.3 Short Circuit Protection.............................................................................................................................22 3.4 EMI Test...................................................................................................................................................23 3.4.1 Conducted EMI Test ...............................................................................................................................23 3.4.2 Radiation EMI Test.................................................................................................................................23 3.5 ESD Test...................................................................................................................................................25 3.6 Lighting Test.............................................................................................................................................26 4 Other important waveform (27)On -B ri g ht co n f i de nt i a l toCh a r mr i ch4.1 Vdd, FB, Sense& Gate wave form at no load/25% load/50% load/full load............................................27 4.2MOSFET VDS wave,Output diode V AK waveform at full load,start/normal/output short (28)FiguresRipple & Noise waveform....................................................................................................................................18 Overshoot and Undershoot waveform..................................................................................................................19 Dynamic waveform...............................................................................................................................................20 Time Sequence waveform.....................................................................................................................................21 Vdd,FB,Sense&Gate waveform............................................................................................................................27 MOSFET VDS,CS&V AK start waveform............................................................................................................28 MOSFET VDS,CS&V AK normal operation waveform.......................................................................................28 MOSFET VDS,CS&V AK output short waveform (30)TablesTable 1 Input current at full load...........................................................................................................................16 Table 2 Standby power at no load with LED (with PFC)......................................................................................16 Table 3 Efficiency with PFC part..........................................................................................................................16 Table 4 Line Regulation & Load Regulation........................................................................................................17 Table 5 Ripple & Noise measure results...............................................................................................................17 Table 6 Overshoot/undershoot measurement results.............................................................................................18 Table 7 Output voltage under dynamic test...........................................................................................................20 Table 8 Turn-on delay /hold-up/Rise time/Fall time measurement results............................................................20 Table 9 OCP value vs. input voltage.....................................................................................................................22 Table 10 OVP test result........................................................................................................................................22 Table 11 SCP test result.. (23)On -B ri g ht co n f i de nt i a l toCh a r mr i ch1 Adaptor Module SpecificationModel number:OBPD120W-H240ARev.:011.1 Input CharacteristicsAC input voltage rating 100Vac ~ 240Vac AC input voltage range 90Vac ~ 264Vac AC input frequency range 47Hz ~ 63Hz25A maximum at 115V AC Inrush current at 25°C50A maximum at 230V ACInput current1.56 A rms max.1.2 Output CharacteristicsOutput V oltage 19.0V Output Tolerance ±5% Min. load current 0AMax. load current6.3A1.3 Performance SpecificationsMax. Output Power 120WStandby Power <0.5W @ 240V/50Hz, no loadEfficiency>85% @ normal line, full load , including power loss in input filters Line Regulation<1% Load Regulation<5% Ripple (Po: 10 to 90%) <350 mVpp Noise (F<640KHz) <200mVppHold up Time 16.7m Sec. Min. @100Vac with full loadTurn on Delay Time2 Sec. Max. @100Vac with full load1.4 Soft StartSettling time <15ms to within 1% at nominal loadOvershoot<3%On -B ri g ht co n f i de nt i a l toCh a r mr i ch1.5 Protection FeaturesShort circuit Protection Output shut down with automatic recovery Over V oltage Protection <25VOver Current ProtectionOutput shut down with automatic recovery. The protection functionwill be enabled if output current exceeds 110%~140% of rated outputcurrent.1.6 EnvironmentsOperating Temperature 0 to+40℃℃ Operating Humidity 20% to 90% R.H. Storage Temperature -40 to +60℃℃Storage Humidity0% to 95% R.H.1.7 Dielectric withstandThe power supply shall withstand for 1 minute without breakdown by the application of a 60Hz 1500V AC voltageapplied between both input line and ground (10mA DC cut-off current). Main transformer shall similarly withstand3000Vac applied between both primary and secondary windings for a minimum of one minute.1.8 InsulationThe insulation resistance should be not less than 30 MOHM after applying of 500VDC for 1 minute1.9 Leakage currentThe AC leakage current is less than 3.5mA when the power supply connects to 264V/50Hz AC input voltage.1.10 Printed circuit boardTechnology Single sided FR2Dimensions134mm(L), 88mm(W) and 40mm(H)1.11 EMIMeet international standardsOn -B ri g ht co n f i de nt i a l toCh a r mr i chOri g ht co n f i de nt i a l toCh a r mr i cPWM Part:On -B ri g ht co n f i de nt i a l toCh a r mr i ch2.2 PCB Gerber FileOn -B ri g ht co n f i de nt i a l toCh a r mr i chOOOB2203 Demo Board Manual (OBPD120W_Adapter)Transformer Winding dataWinging Material Start Finish N1 Φ0.45*2 2UEW 不断线 TAPE TAPE W=10mm (Y) 3 Copper Copper W =9mm P =0.02mm 5 4 TAPE TAPE W=10mm (Y) N2 Φ0.60*2 三层绝缘线 TAPE TAPE W=10mm (Y) 7 Copper Copper W 9mm P 0.02mm 5 8 TAPE TAPE W=10mm (Y) N3 Φ0.12*3 2UEW 间绕 TAPE TAPE W=10mm (Y) N1’ 0.45*2 2UEW TAPE TAPE W=10mm (Y) 13 Copper Copper 9mm P 0.02mm 5 14 TAPE TAPE W=10mm (Y) 三层绝缘线16 N40.20*1 三层绝缘线17 TAPE TAPE W=10mm (Y) 18 Copper Copper W 9mm P 0.02mmOri g ht co nf i de t i ChBoost inductor Winding dataWinging Material Start N1Φ0.20*10 利兹线TAPE TAPE W=10mm (Y)N2Φ0.20*1 2UEWTAPE TAPE W=10mm (Y)Adaptor Module SnapshotO rightconfidentohOn -B ri g ht co n f i de nt i a l toCh a r m r i chOOOmraOR&N waveform@90Vac input with no load R&N waveform@90Vac input with full loadR&N waveform@264Vac input with no load R&N waveform@264Vac input with full load3.2.3 Overshoot & UndershootOf i de nt i al toCh a r mr i chOvershoot waveform@90Vac input with full load Overshoot waveform @90Vac input with no loadOvershoot waveform @264Vac input with full load Overshoot waveform @264Vac input with no loadUndershoot waveform @264V ac input with full load3.2.4 Dynamic TestA dynamic loading with low set at 1.26 A lasting for 10mS and high set at 5.0A lasting for 50mS is added tooutput. The ramp is set at 0.125A/uS at transient. All data was measurement at PCB end.On -B ri g ht co n f i de nt i al toCh a r mr i chDynamic waveform @90Vac input Dynamic waveform @132Vac inputDynamic waveform @180Vac input Dynamic waveform @264Vac input3.2.5 Time SequenceOg ht co n f i de nt i a l toCh a r mrTurn on waveform @90Vac input with full load Turn on waveform @264Vac input with full loadHold up waveform @90Vac input with full load Hold up waveform @264Vac input with full loadRise waveform @90Vac input with full load Rise waveform @264Vac input with full loadO-B ri g ht co n f i de nt i a l toCh a r mr i chFall waveform @90Vac with full load Fall waveform @264Vac with full loadProtections O CharmrichOht co n f i de nt i a l toChOn -B ri g ht co n f i de nt i a l toCh a r mr i ch3.5 ESD TestOn -B ri g ht co n f i de nt i a l toCh a r mr i ch3.6 Lighting TestOn -B ri g ht co n f i de nt i a l toCh a r mr i ch4 Other important waveform4.1 Vdd, FB, Sense& Gate wave form at no load/25% load/50% load/fullload.Vdd,FB,Sense&Gate wave form@90Vac; no load Vdd,FB,Sense&Gate wave form@90Vac; 25% loadVdd,FB,Sense&Gate wave form@90Vac; 50% load Vdd,FB,Sense&Gate wave form@90Vac; full loadVdd,FB,Sense&Gate wave form@264Vac; no load Vdd,FB,Sense&Gate wave form@264Vac; 25% loadOn -B ri g ht co nf i de nt i a l toCh ar mr i chVdd,FB,Sense&Gate wave form@264Vac; 50% load Vdd,FB,Sense&Gate wave form@264Vac; full load4.2 MOSFET VDS wave, CS wave and Output diode V AK waveform at fullload, start/normal/output short4.2.1 VDS ,CS & V AK start waveformVDS ,CS & V AK start waveform@90Vac; full load VDS ,CS & V AK start waveform@264Vac; full load4.2.2 VDS ,CS & V AK normal waveformVDS ,CS & V AK normal waveform@90Vac; full load VDS ,CS & V AK normal waveform@90Vac; 2.4A loadOn -B ri g ht co nf i de nt i a l toCh a r mr i chVDS ,CS & V AK normal waveform@90Vac; 1.65A load VDS ,CS & V AK normal waveform@90Vac; 1.45A loadVDS ,CS & V AK normal waveform@90Vac; 1.2A load VDS ,CS & V AK normal waveform@264Vac; full loadVDS ,CS & V AK normal waveform@264Vac; 3.0A load VDS ,CS & V AK normal waveform@264Vac; 2.0A loadOn -B ri g ht co n f i de nt i a l toCh a r mr i chVDS ,CS & V AK normal waveform@264Vac; 1.6A load VDS ,CS & V AK normal waveform@264Vac; 1.4A load4.2.3 VDS ,CS & V AK output short waveformVDS ,CS & V AK output short waveform@90Vac; full load VDS ,CS & V AK output short waveform@264Vac; full loadDisclaimerOn-Bright Electronics reserves the right to make corrections, modifications, enhancements, improvements, and other changes to its documents, products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.This document is under copy right protection. Non of any part of document could be reproduced, modified without prior written approval from On-Bright Electronics.On -B ri g ht co n f i de nt i a l toCh a r mr i ch。

【计算机工程与设计】_数据验证_期刊发文热词逐年推荐_20140726

【计算机工程与设计】_数据验证_期刊发文热词逐年推荐_20140726

移动agent 离子膜法烧碱 短波跳频调制解调器 知识产权核 目标区域检测 用户验证 生存期 状态图 片上外设总线 激光陀螺 混合编程 混合的树增广朴素贝叶斯分类 消息中间件 测试覆盖 测试用例 测试数据 模糊层次分析法(fahp) 模型验证 模型 树增广朴素贝叶斯分类 栈 查询 权重 机器学习 有向无环图 最小二乘法 最大后验估计器 最佳逼近 数据验证 数据矩阵码 数据标准化 数据拟合技术 数据库安全 数据库 数字签名 数字旅游工程 故障恢复 支持向量机 支持向量回归机 控制反转 控制分组数 探测算法 指标值 恢复机制 忙状态 异步传输模式 异常模式 异常因子 并行分布式 嵌入式软件 嵌入式系统 层模式 小波神经网络 小波
异步交互 异构数据 应用模型 序列最小优化 布尔过程论 小波变换 对比检验 密钥 密码学 客户机 实时性 安全组件 因子 商业智能 可重构 单阶段 医学图像 动态网页 切换 内存管理 内存机制数据库 典型相关分析 兴趣关联规则 关键词 关节点匹配 关系数据库 共享系统 元组树 元数据 信息隐藏 信息模型 信息检索 信息安全 信息共享 体绘制 体系仿真 优先级 仿真试验 仿真数据管理 仿真 人脸识别 人因工程 产品数据管理系统 中介者 个体 业务质量 不完全数据 三维姿态重建 一致性测试 xml web访问信息挖掘 tesla变压器 shear-warp算1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106

Mellanox Technologies和DataON合作建立微软认证的超融合集群应用程序说明书

Mellanox Technologies和DataON合作建立微软认证的超融合集群应用程序说明书

SOLUTION BRIEF©2016 Mellanox Technologies. All rights reserved.verged infrastructure with these promises:• Consolidating existing data center silos to streamline operations• Simplifying the IT infrastructure for quick de-ployment and scale-out• Improving agility to accommodate constantly changing business needsDataON™ and Mellanox Empower Next-Gen Hyper-Converged Infrastructurepage 2SOLUTION BRIEF: DataON™ and Mellanox Empower Next-Gen Hyper-Converged Infrastructure 350 Oakmead Parkway, Suite 100, Sunnyvale, CA 94085Tel: 408-970-3400 • Fax: © Copyright 2016. Mellanox Technologies. All rights reserved.Mellanox, Mellanox logo, and ConnectX are registered trademarks of Mellanox Technologies, Ltd. Mellanox NEO, Mellanox Spectrum, and LinkX are trademarks of Mellanox Technologies, Ltd. All other trademarks are property of their respective owners.15-51693SBRev1.0• Industry Leading Application Performance – The S2D-3110 HCCA with four (4x) cluster nodes is capable of providing over 2.4 million IOPS (running VMFleet) using the latest all flash NVMe™ based SSD technology to scale I/O intensive workloads.• Storage and Network with SMB 3.0 over RDMA – Deliv-ers highest throughput, lowest latency and increased CPU efficiency • Hyper-Converged Scalability – Incremental compute, net-working, and storage resources provide near-linear scalabil-ity. Each HCCA can also be expanded in capacity via 12G SAS JBODs for further storage expansion.。

CS4397-KS中文资料

CS4397-KS中文资料
3.1 Differential DC offset calibration ........................................................................ 16 3.2 Soft Mute ........................................................................................................... 16 3.3 Mode Select ....................................................................................................... 17 3.4 Power DowN ...................................................................................................... 17 4.0 PIN DESCRIPTION - PCM MODE .............................................................................. 18 5.0 PIN DESCRIPTION - DSD MODE .............................................................................. 23 6.0 PIN DESCRIPTION - 8X INTERPOLATOR MODE .................................................... 24 7.0 APPLICATIONS .......................................................................................................... 25 7.1 Recommended Power-up Sequence ................................................................. 25 8.0 CONTROL PORT INTERFACE .................................................................................. 26 8.1 SPI Mode ........................................................................................................... 26 8.2 I2C Mode ........................................................................................................... 26 8.2 Memory Address Pointer (MAP) ....................................................................... 26 9.0 PARAMETER DEFINITIONS ...................................................................................... 33 10.0 REFERENCES .......................................................................................................... 33 11.0 PACKAGE DIMENSIONS ......................................................................................... 34

PCV-2V压力释放阀,直接操作手动可调说明书

PCV-2V压力释放阀,直接操作手动可调说明书

w e e n g i n e e r y o u r p r o g r e s sTable of Contents1 Product Details .....................................................................................................................................................................................2 1.1 Application ............................................................................................................................................................................................. 2 1.2 Recommended Installation .................................................................................................................................................................... 2 2 Function ................................................................................................................................................................................................ 2 2.1 Features ................................................................................................................................................................................................. 23 Technical Data ...................................................................................................................................................................................... 34 Ordering Information ........................................................................................................................................................................... 3 4.1 Type Code ............................................................................................................................................................................................. 3 4.2Versions currently available (3)5 Description of Characterisics in Accordance with Type Code ........................................................................................................ 4 5.1 Characteristic 1: Variant DSU ................................................................................................................................................................ 4 5.2 Characteristic 2: Port / Case: Variant CA - Cartridge ............................................................................................................................. 4 5.3 Characteristic 3: input flow rate .............................................................................................................................................................. 4 5.4 Characteristic 4: Max.permissible pressure ........................................................................................................................................... 4 5.5 Characteristic 5: Activation / Setting ...................................................................................................................................................... 4 5.6 Characteristic 6: Stepped cavity 8.00239 (corresponds to Bucher UVP- 4) ......................................................................................... 4 Das vorgesteuerte Druckbegrenzungsventil ist ein Cartridgebauteil und wird in eine Stufenbohrung entsprechend nebenstehender Zeichnung eingeschraubt. ..................................................................................................................................................................................................... 4 5.7 Characteristic 7: Seal ............................................................................................................................................................................. 4 6 Installation ............................................................................................................................................................................................ 5 6.1 General information ............................................................................................................................................................................... 5 6.2 Connection Recommendations .............................................................................................................................................................. 5 6.3 Installation - installation space ............................................................................................................................................................... 5 7 Notes, Standards and Safety Instructions ......................................................................................................................................... 5 7.1 General Instructions ............................................................................................................................................................................... 5 7.2 Standards ............................................................................................................................................................................................... 58 Zubehör .................................................................................................................................................................................................5w e e n g i n e e r y o u r p r o g r e s s1The pressure valve is designed as cartridge valve. It is a direct operated valve for flow rates up to 10 l / min, which can be adjusted manually. The adjustment can be protected by a cap. The components are designed robust. The valve can be charged up to 500 bar and is delivered at a certain pressure.1.1 ApplicationThe pressure valve is used to protect high volume lift cylinders in truck cranes. It should avoid excessive pressure increase in unmoving cylin-ders due to warming (“sushine valve”).1.2 Recommended Installation2 FunctionThe pressure valve operates as a direct acting seat valve. The pressure can be set using an adjusting screw. The screw is locked after adjustment with a backup sealing nut and can be protected by a cap.2.1 Features▪ Cartridge type▪ Small installation space ▪ Robust construction▪Stepped cavity (corresponds to Bucher UVP-4) ▪Seat valve, leakage freeP – protected port T - tankw e e n g i n e e r y o u r p r o g r e s s3 Technical Data4 4.1 Type CodeXXX – fest vorgegebene Merkmale XXX – vom Kunden wählbare Merkmale4.2 Versions currently availableThe versions listed below are available as standard. Further versions as part of the options given on the type code can be configured upon request.designationtype codepart nr.PRV –DSU –CA -10LPM -500BAR –MAN230BAR –239 -NBR PRV –DSU –CA -10 -500 –MAN230 –239 -N 412.072.451.9 PRV –DSU –CA -10LPM -500BAR –MAN235BAR –239 -NBR PRV –DSU –CA -10 -500 –MAN235 –239 -N 412.072.430.9 PRV –DSU –CA -10LPM -500BAR –MAN290BAR –239 -NBR PRV –DSU –CA -10 -500 –MAN290 –239 -N 412.072.433.9 PRV –DSU –CA -10LPM -500BAR –MAN340BAR –239 -NBR PRV –DSU –CA -10 -500 –MAN340 –239 -N 412.072.431.9 PRV –DSU –CA -10LPM -500BAR –MAN420BAR –239 -NBR PRV –DSU –CA -10 -500 –MAN420 –239 -N 412.072.432.9CriteriaUnit Value Installation position any Weightkg 0,1Surface protectiveZinc coated Maximum input pressure (P) bar 550Adjustable pressurebar 100 - 500 Maximum Tankpressure (T) bar 8 Maximum input flow rate (P) l/min 10Hydraulic fluidMineral oil (HL, HLP) conforming with DIN 51524, other fluids upon re-Hydraulic fluid pressure range °C -25 bis +80 Ambient temperature °C < +50 Viscosity rangemm2/s 2,8 - 500Contamination gradeFiltering conforming with NAS 1638, class 9, with minimum retentionPRVDSUCA10500239N000102030405060700 Product group Pressure relief valves PRV 01 Variant manual adjustable DSU 02 Port / Case Cartridgeventil CA 03 Input flow rate Qmax.10 l/min 1004 Max.permissible pressure Pmax.. 500bar50005 Activation Man ually adjustable 100-500barMAN100 06 Stepped cavity WESSEL-Patrone 8.00239 (stepped cavity) 239 07 Seal NBR, temperatur range -25°C bis +80°CNw e e n g i n e e r y o u r p r o g r e s s5 5.1 Characteristic 1: Variant DSUAdjustable pressure relief valve5.2 Characteristic 2: Port / Case: Variant CA - CartridgeAs variant CA, the valve is delivered as a cartridge valve. The Cavity has to be designed according to characteristic 6 (stepped cavity)5.3 Characteristic 3: input flow rateRecommended maximum flow rate of 10 l/min.5.4 Characteristic 4: Max.permissible pressureMaximum permissible pressure is 500bar (adjustable range100 - 500bar)5.5 Characteristic 5: Activation / SettingThe valve can be adjusted with a set screw. For this purpose, the protective cap must be removed and the counter nut undone.5.6 Characteristic 6: Stepped cavity 8.00239 (corresponds to Bucher UVP- 4)Das vorgesteuerte Druckbegrenzungsventil ist ein Cartridgebauteilund wird in eine Stufenbohrung entsprechend nebenstehender Zeichnung eingeschraubt.5.7 Characteristic 7: SealNBR, temperature range -25°C bis +80°Cw e e n g i n e e r y o u r p r o g r e s s6 Installation6.1 General information▪ Observe all installation and safety information of the construction machine / attachment tools manufacturer. ▪ Only technically permitted changes are to be made on the construction machine. ▪ The user has to ensure that the device is suitable for the respective application. ▪ Application exclusively for the range of application specified by the manufacturer. ▪ Before installation or de-installation, the hydraulic system is to be depressurized. ▪ Settings are to be made by qualified personnel only.▪ Opening is only to be performed with the approval of the manufacturer, otherwise the warranty is invalidated.6.2 Connection RecommendationsNOTE : Enclosed proposed resolution is not always guaranteed. The functionality and the technical details of the construction ma-chine must be checked.5.3 Montage – BauraumObserve connection names.Do not damage seals and flange surface. Its hydraulic system must be ventedEnsure sufficient free space for setting and installation work6.3 Installation - installation space▪ Observe connection names.▪ Do not damage seals and flange surface. ▪ Its hydraulic system must be vented▪ Ensure sufficient free space for setting and installation workCAUTION: Hydraulic hoses must not touch the pressure relief valve, otherwise they are subject to thermal damaging. Tightening torques must be observed. Torque wrench needed.77.1 General Instructions▪The views in drawings are shown in accordance with the European normal projection variant▪ A comma ( , ) is used as a decimal point in drawings ▪All dimensions are given in mm7.2 StandardsThe following standards must be observed when installing and operating the valve:▪ DIN EN ISO 13732-1:2008-12, Temperatures on accessible surfaces8 ZubehörSafety cap: 275.066.000.6。

TL46对比光敏传感器产品说明书

TL46对比光敏传感器产品说明书

148CATALOG | Photoelectric Sensors(**)TLCATALOG S E C T I O NTL46Contrast sensor9 ±3 mm18 mm (Lens No.18 glass)22 mm (Lens No.22 glass)28 mm (Lens No.28 glass)40 mm (Lens No.40 glass)Switching frequency10 kHz (mod. TL46-WE color mode)15 kHz (mod. TL46-W)20 kHz (mod. TL46-A/WL)25 kHz (mod. TL46-W...PZ)30 kHZ (mod. TL46-WLF/WE contrast mode)50 kHZ (mod. TL46-WJ)70 kHz (mod. TL46-WH...PZ)Jitter50 μs (mod. TL46-WE color mode)33 μs (mod. TL46-W)25 μs (mod. TL46-A/WL)<20 μs (mod. TL46-W...PZ)16 μs (mod. TL46-WLF/WE contrast mode)<7 μs (mod. TL46-WJ <3 μs (mod. TL46-WH...PZ)Light emission RGB LED white LED Red LED Setting push buttonsTrimmer (precise incremental encoder) mod. TL46-APower supplyVDC 10…30 VVAC VAC/DC OutputPNP •NPN•NPN/PNP •relayAnalogue out 0…5 V Analogue Output (TL46-A/W/WL only)IO-Link V1.1.2 Smart sensor profile double channel I/O(mod. TL46-WH...PZ, TL46-W...PZ)Connectioncable connector •pig-tailApproximate dimensions (mm)31 x 81 x 58Housing material Aluminium Mechanical protectionIP67(**) ATEX II 3DGAPPLICATIONS• Packaging and labeling machinery• Beverage/Food/Cosmetic/Pharmaceutical industries • Printing machinery• Flexographic printing machinery• Very high precision for cutting and sealing applicationsULTRA HIGH SPEED HIGH PERFORMING CONTRAST SENSOR FOR COLOREDREGISTRATION MARK DETECTIONTL46• Ultra Fast model up to 70 kHz and very low 3us jitter (TL46-WH...OZ)• Color mode enhanced model (TL46-WE)• Position mouniting monitoring through IO-Link communication • Mechanical vibration monitoring through IO-Link communication • Wide-spectrum RGB or white LED emission• 7 different models: basic, standard, enhanced, low jitter, color mode, basic IO-Link, ultra fast with IO-Link • Automatic, manual and dynamic settings• 10, 15, 20, 30, 50, 70 kHz switching frequencies• Very low 3us jitter for fast and very precise detection (TL46-WH...OZ)• NPN/PNP/PP and analog outputs• IO-Link connectivity V1.1.2 with smart functions•Standard mounting, M12 connector rotatable to 5 positionsCONTRAST SENSORSPower supply 10 … 30 VDC (limit values) Ripple 2 VPP max.Consumption (output current excluded)40 mA max. at 24 VDC (mod. TL46-A)50 mA max. at 24 VDC (mod. TL46-W/WJ)85 mA max. at 24 VDC 24 VDC with bargraph ON in threshold adjustment mode, 55 mA max at 24 VDC with bargraph OFF in normal functioning mode (mod. TL46-WL)35 mA max. at 24 VDC (mod. TL46-WLF/WE)30mA (mod. TL46-WH...PZ, TL46-W...PZ)Light emission white LED 400-700 nm (mod. TL46-A-4xx); red LED 630 nm (mod. TL46-A-6xx)blue LED 465nm/green LED 520 nm/red LED 630 nm (mod. TL46-W/WL/WLF/WE/WJ/WH...PZ/W...PZ)Detection Distance9 ±3 mm18 mm (Lens No.18 glass) 22 mm (Lens No.22 glass) 28 mm (Lens No.28 glass) 40 mm (Lens No.40 glass)Minimum spot dimension 1.5 x 5 mm; 0.8 x 4 mm (TL46-WJ, TL46-WH...PZ, TL46-W...PZ) Depth of field± 3 mmResponse time 100 μs (mod. TL46-WE, TL46-WH...PZ color mode33 μs (mod. TL46-W)25 μs (mod. TL46-A/WL)20 μs (mod. TL46-W...PZ)16 μs (mod. TL46-WLF/WE contrast mode)10 μs (mod. TL46-WJ)6 μs (mod. TL46-WH...PZ)Switching frequency 10 kHz (mod. TL46-WE, TL46WH...PZ color mode)15 kHz (mod. TL46-W)20 kHz (mod. TL46-A/WL)30 kHz (mod. TL46-WLF/WE contrast mode)50 kHz (mod. TL46-WJ)70 kHz (mod. TL46-WH...PZ)Jitter 50 μs (mod. TL46-WE, TL46-WH...OZ color mode)33 μs (mod. TL46-W)25 μs (mod. TL46-A/WL)20 μs (mod. TL46-W...PZ)16 μs (mod. TL46-WLF/WE contrast mode)<7 μs (mod. TL46-WJ)3 μs (mod. TL46-WH...PZ)Setting SET push-buttons (mod. TL46-W/WL/WLF/WH...PZ/W...PZ)sensivity trimmer (mod. TL46-A)Operating mode DARK/LIGHT selection by switch (mod. TL46-A); automatic DARK/LIGHT selection (mod. TL46-W/WL/WJ) automatic DARK/LIGHT selection in the target/background detection, selectable via wire in the dynamic detection(mod. TL46-WLF/WE/WH)Indicatorsyellow OUTPUT LEDgreen READY LED, orange DELAY LED and KEYLOCK (mod TL46-W/WJ/W...PZ) green READY LED, 4-digit display/DELAY LED/KEYLOCK LED mod. TL46-WLF/WE/WH...PZ orange ARROWS (mod. TL46-A), DELAY LED and KEYLOCK LED 5-segment bargraph (mod. TL46-WL)Dark/light selection Switch; Automatic;Automatic/manual; remote/dynamicDelay0…20ms selectable via delay input0…100ms programmedAuxiliary function Keylock (not available on TL46-WE)Fine Hysteresis regulation (TL46-WL/WLF/WE)Output PNP (mod. TL46-WJ); PNP or NPN; PNP/NPN (mod. TL46-W/WL/WLF/WE by part number);PP/PNP/NPN (TL46-W/WH...PZ); analog output (mod. TL46-A/W/WL)Output current100mASaturaton Voltage= <2VAnalogue Out0,5…5,5V ±10%; 2V on white target 90%; 1…3V ±10%(white 90%) ; 5,5V max Analogue out impedance 2,2 kΩ (short circuit protection)Connection M12 5-pole connectorDielectric strength500 Vac, 1 min between electronics and housingInsulating resistance>20 MΩ, 500 Vdc between electronics and housingElectrical protection class 2, double insulationProtection device Reverse polarity protection, overload and short circuit protection Mechanical protection IP67Ambient light rejection according to EN 60947-5-2Vibrations0,5 mm amplitude, 10 … 55 Hz frequency, for every axis (EN60068-2-6)Shock resistance11 ms (30 G) 6 shock for every axis (EN60068-2-27)Housing material aluminiumLens material PMMA (mod. TL46-A, TL46-W), glass (mod. TL46-W-815G/WL/WLF/WJ/WE) Operating temperature-10 … 55 °CStorage temperature-20 … 70 °CWeight170 g max. TECHNICAL DATA149CATALOG | Photoelectric Sensors150CATALOG | Photoelectric Sensors15,614,41811,530,614,8TL46-A TL46-WL TL46-WLF/WE/WH...PZTL46-W/WJ/W...PZ DIMENSIONS151CATALOG | Photoelectric SensorsAIBLAC DEF G F BABC DHF G FAN B MOyellow OUTPUT LED green READY LED orange DELAY LED orange KEYLOCK LED Bargraph+/- push-buttonsSET push-button Display MARK push-buttonBKGD push-button Light/Dark Switch Orange Indicators Arrows Sensitivity Adjustment KnobTL46-ATL46-WLF/WE/WJTL46-W...PZ/WH...PZTL46-W/WLINDICATORS AND SETTINGSCONNECTIONSStandard 9 mm lensmmAccessory 18 mm lens mmAccessory 28 mm lensmmAccessory 40 mm lensmmHORIZONTAL SPOTVERTICAL SPOTHorizontal spot ispresent in the TL46models with final ‘-L’suffixACCESSORIESDATALOGIC PRODUCT OFFERINGMobile Computers VisionSensors Hand HeldSafety LaserSafety LightLaser Marking。

iosurface ios用法

iosurface ios用法

iosurface ios用法iOSurface是苹果操作系统iOS中的一个图形服务接口,用于在应用程序中进行图形渲染和处理。

它是基于Core Animation和Metal框架构建的,提供了一种高效的方式来处理三维图形和图像。

iOSurface可以用于以下几种情况:1.图像处理:iOSurface可以作为图像数据的容器,可以快速地进行像素级别的处理,如图像滤镜、颜色调整和图像合成等。

同时,iOSurface还支持不同格式的图像数据,包括RGBA和YUV等。

2.视频处理:iOSurface可以在应用程序中进行视频渲染和处理。

它可以作为视频帧的容器,方便地进行视频帧的采集、解码、编码和展示。

3.绘制图形和动画:iOSurface可以作为绘制图形和动画的目标。

通过使用Core Animation和Metal框架,可以在iOSurface上进行高性能的绘制,从而实现各种复杂的图形和动画效果。

4.多线程图形处理:iOSurface可以在多个线程之间共享图形数据,方便地进行多线程图形处理。

这对于一些需要实时反馈的图形应用非常有用,如实时视频游戏和图像处理应用等。

拓展:除了在iOS应用程序中使用iOSurface进行图形渲染和处理之外,iOSurface还可以与其他图形库和框架进行集成,以实现更复杂的图形应用。

例如,可以将iOSurface与Metal Performance Shaders结合使用,以实现高性能的图像处理和机器学习任务。

此外,iOSurface还可以与ARKit等增强现实框架结合使用,以实现更丰富的增强现实应用程序。

总的来说,iOSurface为开发者提供了一个强大的工具,用于在iOS设备上进行图形处理和渲染。

Unitronics V700-T20BJ 可编程逻辑控制器+HMI安装指南说明书

Unitronics V700-T20BJ 可编程逻辑控制器+HMI安装指南说明书

1Vision™PLC+HMI Installation Guide V700-T20BJGeneral DescriptionV700 PLC+HMI is programmable logic controller that comprise a built-in operating panel containing a 7” Color Touchscreen I/O Options Snap-in I/O Modules / I/O Expansion Modules Screen 7" Color Touch Keypad or Function KeysNoneProgramming Com Port, Built-inRS232/485 Yes Ethernet YesUSB device,mini-BYesCom Ports, separate order, installed by userThe user may install one or both of the following ports: • CANbus port (V100-17-CAN) • RS232/RS485 port (V100-17-RS4/V100-17-RS4X)* V700 comprises both RS232/485 and USB ports; note that only one channel may be used at a time.Standard Kit ContentsControllerYesTerminal Block Yes (3 pin) BatteryYesMounting Brackets Yes (4 parts) Rubber SealYesAlert Symbols and General RestrictionsWhen any of the following symbols appear, read the associated information carefully. SymbolMeaning DescriptionDanger The identified danger causes physical and property damage. Warning The identified danger could cause physical and property damage. Caution CautionUse caution.Before using this product, the user must read and understand this document.All examples and diagrams are intended to aid understanding, and do not guarantee operation. Unitronics accepts no responsibility for actual use of this product based on these examples. Please dispose of this product according to local and national standards and regulations.Only qualified service personnel should open this device or carry out repairs.Failure to comply with appropriate safety guidelines can cause severe injury or property damage. Do not attempt to use this device with parameters that exceed permissible levels.To avoid damaging the system, do not connect/disconnect the device when power is on.Vision™ Installation Guide2Environmental ConsiderationsDo not install in areas with: excessive or conductive dust, corrosive or flammable gas, moisture or rain, excessive heat, regular impact shocks or excessive vibration, in accordance with the standards given in the product’s technical specification sheet. Do not place in water or let water leak onto the unit.Do not allow debris to fall inside the unit during installation.Ventilation: 10mm space required between controller’s top/bottom edges & enclosure walls.Install at maximum distance from high-voltage cables and power equipment.MountingDimensionsNote that the Snap-in I/O module thickness is 23 mm (0.9”).Vision™3Panel MountingBefore you begin, note that the mounting panel cannot be more than 5 mm thick. 1. Make a panel cut-out of the appropriate size: 193x125mm (7.59”x4.92”).2. Slide the controller into the cut-out, ensuring that the rubber seal is in place.3. Push the mounting brackets into their slots on the sides of the panel as shown in the figure below.4. Tighten the bracket’s screws against the panel. Hold the bracket securely against the unit while tightening the screw.5. When properly mounted, the controller is squarely situated in the panel cut-out as shown in the accompanying figures.Vision™ Installation Guide4Inserting the BatteryIn order to preserve data in case of power-off, you must insert the battery. The battery is supplied taped to the battery cover on the rear of the controller. 1. R emove the battery cover shown on page 3.The polarity (+) is marked on the battery holder and on the battery. 2. I nsert the battery, ensuring that the polarity symbol on the battery is: - facing up- aligned with the symbol on the holder 3. Replace the battery cover.Use proper precautions to prevent Electro-Static Discharge (ESD) while servicing thebattery.Caution To preserve back-up values for RTC and system data during battery replacement, thecontroller must be powered.WiringDo not touch live wires.Install an external circuit breaker. Guard against short-circuiting in external wiring. Use appropriate circuit protection devices.Unused pins should not be connected. Ignoring this directive may damage the device.Double-check all wiring before turning on the power supply.CautionTo avoid damaging the wire, do not exceed a maximum torque of 0.5 N·m (5 kgf·cm). Do not use tin, solder, or any substance on stripped wire that might cause the wire strand to break.Install at maximum distance from high-voltage cables and power equipment.Wiring ProcedureUse crimp terminals for wiring; use 3.31 mm² –0.13 mm² wire (12-16 AWG): 1. S trip the wire to a length of 7±0.5mm (0.270–0.300“). 2. U nscrew the terminal to its widest position before inserting a wire. 3. I nsert the wire completely into the terminal to ensure a proper connection. 4. T ighten enough to keep the wire from pulling free.Input or output cables should not be run through the same multi-core cable or share the same wire. Allow for voltage drop and noise interference with I/O lines used over an extended distance. Use wire that is properly sized for the load.The controller and I/O signals must be connected to the same 0V signal.Vision™5Power SupplyThe controller requires either an external 12 or 24VDC power supply. Note: Photo is for illustration purposes only.1.The power supply must include double insulation. Outputs must be rated asSELV/PELV/Class 2/Limited Power.2. Use separate wires to connect the functional earth terminal and the 0V terminal to the system earth ground.3. Install an external circuit breaker. Guard against short-circuiting in external wiring.4. Double-check all wiring before turning on the power supply.5. Do not connect either the ‘Neutral’ or ‘Line’ signal of the 110/220VAC to device’s 0V pin.6. In the event of voltage fluctuations or non-conformity to voltage power supply specifications, connect the device to a regulated power supply.Earthing the OPLCTo maximize system performance, avoid electromagnetic interference by: Mounting the controller on a metal panel.Connect each common and ground connection directly to the earth ground of your system.For ground wiring use the shortest and thickest possible wire.Communication PortsThe controller comprises a USB port, 1 RS232/RS485 serial port and an Ethernet port.The user may order and install one or both of the following modules:• An additional port (Port 2).Available types: RS232/RS485 isolated/non-isolated• A CANbus portFor the most updated information regarding ports and their installation, please refer to the Technical Library at . Turn off power before making communications connections. CautionAlways use the appropriate port adapters.The USB port may be used for programming, OS download, and PC access.Note that COM port 1 function is suspended when this port is physically connected to a PC . The serial port type is RJ-11 and may be set to either RS232 or RS485 via DIP switch, in accordancewith the table shown below.Use RS232 to download programs from a PC, and to communicate with serial devices and applications, such as SCADA.Use RS485 to create a multi-drop network containing up to 32 devices.Vision™ Installation Guide6PinoutsThe pinouts below show PLC port signals.To connect a PC to a port that is set to RS485, remove the RS485 connector, and connect the PC to the PLC via the programming cable. Note that this is possible only if flow control signals are not used (which is the standard case). RS232Pin # Description1* DTR signal 2 0V reference 3 TXD signal4 RXD signal5 0V reference 6*DSR signal*Standard programming cables do not provide connection points for pins 1 and 6. **When a port is adapted to RS485, Pin 1 (DTR) is used for signal A, and Pin 6 (DSR) signal is used for signal B.RS232 to RS485: Changing DIP Switch SettingsThe port set to RS232 by factory default.To change the settings, first remove the Snap-in I/O Module, if one is installed, and then set the switches according to the following table.RS232/RS485: DIP Switch SettingsSwitch Settings123456RS232* ON ON ON OFF ON OFF RS485 OFF OFF OFF ON OFF ON RS485 with termination**ONONOFFONOFFON*Default factory setting**Causes the unit to function as an end unit in an RS485 networkEthernetImplement communications via TCP/IP, such as MODBUS over TCP. RJ45 Connector Pinout Ethernet LEDS Pin # DescriptionLED Function 1 T+ = Positive transmit signal Green (LNK) ON when link exists 2 T- = Negative transmit signal 3 R+ = Positive receive signal Yellow (ACT)Blinks during RX/TX6R- = Negative receive signalVision™7Installing a Snap-in I/O Module1. R emove the I/O connector cap shown on Page 3.2. L ine the circular guidelines on the Snap-in I/O Module with the slots on the controller as shown below.3 Apply even pressure on all4 corners until you hear a distinct ‘click’. The module is now installed. Check that all sides and corners are correctly aligned.Removing a Snap-in I/O Module 1. L ocate the four buttons on the sides of the controller, two on either side. 2. P ress the buttons and hold them down to open the locking mechanism. 3. G ently rock the module from side to side, easing the module from the controller.Vision™ Installation Guide The information in this document reflects products at the date of printing. Unitronics reserves the right, subject to all applicable laws, at any time, at its sole discretion, and without notice, to discontinue or change the features, designs, materials and other specifications of its products, and to either permanently ortemporarily withdraw any of the forgoing from the market.All information in this document is provided "as is" without warranty of any kind, either expressed or implied, including but not limited to any implied warranties of merchantability, fitness for a particular purpose, or non-infringement. Unitronics assumes no responsibility for errors or omissions in the information presented inthis document. In no event shall Unitronics be liable for any special, incidental, indirect or consequential damages of any kind, or any damages whatsoeverarising out of or in connection with the use or performance of this information.The tradenames, trademarks, logos and service marks presented in this document, including their design, are the property of Unitronics (1989) (R"G) Ltd. orother third parties and you are not permitted to use them without the prior written consent of Unitronics or such third party as may own themDOC18001-A008/158。

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ORIGINAL ARTICLESmart surfaces with switchable superoleophilicity and superoleophobicity in aqueous media:toward controllable oil/water separationLianbin Zhang,Zhonghai Zhang and Peng WangAdvanced materials with surfaces that have controllable oil wettability when submerged in aqueous media have great potential for various underwater applications.Here we have developed smart surfaces on commonly used materials,including non-woven textiles and polyurethane sponges,which are able to switch between superoleophilicity and superoleophobicity in aqueousmedia.The smart surfaces are obtained by grafting a block copolymer,comprising blocks of pH-responsive poly(2-vinylpyridine)and oleophilic/hydrophobic polydimethylsiloxane (i.e.,P2VP -b-PDMS)on these materials.The P2VP block can alter itswettability and its conformation via protonation and deprotonation in response to the pH of the aqueous media,which provides controllable and switchable access of oil by the PDMS block,resulting in the switchable surface oil wettability in the aqueous media.On the other hand,the high flexibility of the PDMS block facilitates the reversible switching of the surface oil wettability.As a proof of concept,we also demonstrate that materials functionalized with our smart surfaces can be used for highly controllable oil/water separation processes.NPG Asia Materials (2012)4,e8;doi:10.1038/am.2012.14;published online 17February 2012Keywords:block copolymer;oil/water separation;smart surfaces;wettabilityINTRODUCTIONRecently,the remarkable oil-repellent ability of fish scales,which allows fish to survive in oil-polluted water,has drawn considerable research attention.1Studies reveal that this fascinating ability,which is recognized as underwater superoleophobicity (oil contact angle larger than 1501),arises from the combination of hierarchical micro-nanos-tructures and the hydrophilic chemistry on the surface of the scales.1–3Inspired by fish scales,artificial superoleophobic surfaces in aqueous media have been realized in recent years,and the study of surface oil wettability in aqueous media is emerging as a new research focus.4–7The wettability of oil on a material surface,when submerged in an aqueous environment,has a critical role in many practical applica-tions,such as droplet manipulation in microfluidics,8–10cell and protein adhesion control on surfaces,11–14preparation of electrowet-ting-based displays 15and oil/water separation.16,17It is anticipated that a surface with controlled oil wettability,or more desirably a smart surface that switches its oil wettability in response to external stimuli in aqueous media,would offer great promise in the design and fabrication of intelligent materials for advanced applications.Although considerable efforts have been devoted to controlling oil wettability as well as oil-adhesion properties on material surfaces in aqueous media,5–7smart surfaces with switchable superoleophobicity and superoleophilicity (oil contact angle lower than 101)in aqueous media have not been reported.Generally,existing methods to prepare superoleophobic surfaces in aqueous media emphasize the use of hydrophilic chemistry in combi-nation with hierarchical surface structures.1,4–6Although the hydro-philic surface chemistry works well for obtaining underwater oleophobicity,it by itself is not possible to switch to oleophilic when immersed in aqueous media,as the hydrophilic surface traps water,and the water-trapped surface repels oil due to the repellency between polar (trapped water in the surface)and non-polar (oil)molecules.T o realize oleophilicity in aqueous media,a surface chemistry that is both oleophilic and hydrophobic is generally required.2,18–20For instance,the superhydrophobic (water contact angle larger than 1501)and superoleophilic nanowire membrane constructed by Stellacci and co-workers,18exhibited oleophilic property in aqueous media,and can be used for the separation of oil from water.Therefore,to obtain a smart surface with switchable oil wettability in aqueous media,especially between superoleophobicity and superoleo-philicity,the chemistry on the surface should be delicately designed such that it comprises both hydrophilic and oleophilic/hydrophobic characteristics,with either characteristic becoming dominantly exposed over the other in response to environmental conditions.Received 14November 2011;revised 3January 2012;accepted 16January 2012Water Desalination and Reuse Center,Chemical and Life Sciences and Engineering Division,King Abdullah University of Science and Technology,Thuwal,Saudi ArabiaCorrespondence:Professor P Wang,Water Desalination and Reuse Center,Chemical and Life Sciences and Engineering Division,King Abdullah University of Science and Technology,Thuwal 23955-6900,Saudi Arabia.E-mail:peng.wang@.saNPG Asia Materials (2012)4,e8;doi:10.1038/am.2012.14&Nature Japan K.K.All rights reserved 1884-4057//amBlock copolymers,consisting of two or more covalently bonded blocks with different physical and chemical properties,represent a promising class of materials suitable for the preparation of smart surfaces.21–25Here we describe a block copolymer-grafting strategy that uses a block copolymer comprising pH-responsive poly(2-vinyl-pyridine)and oleophilic/hydrophobic polydimethylsiloxane blocks (i.e.,P2VP-b-PDMS),to functionalize inexpensive and easily available materials,including non-woven textiles and polyurethane sponges, to prepare surfaces with switchable superoleophilicity and super-oleophobicity in aqueous media.The P2VP block on the grafted block copolymer can alter its wettability and its conformation via protonation and deprotonation in response to the pH of the aqueous media,which in turn provides controllable and switchable access of oil by the oleophilic PDMS block on the surface,thus realizing a smart surface with switchable oil wettability in aqueous media.As a proof of concept,we demonstrate the effectiveness and sustainability of our functionalized materials in highly controllable oil/ water separation.MATERIALS AND METHODSMaterialsPoly(2-vinylpyridine-b-dimethylsiloxane)block copolymer P5321(P2VP-b-PDMS16000-b-10000g molÀ1)and carboxy-terminated P2VP P7546 (P2VP-COOH,10000g molÀ1)were purchased from Polymer Source,Inc., (Montreal,Quebec,Canada).Sylgard184silicone elastomer base and curing agent were purchased from Dow Corning(Midland,MI,USA).Silica nanoparticles(with an average size of7.0nm),1,2-bis(triethoxysilyl)ethane, (3-bromopropyl)trimethoxysilane(BPS),3-glycidoxypropyl trimethoxysilane, tetrahydrofuran(THF),1,2-dichloroethane(DCE),oil red O and anhydrous toluene were all purchased from Sigma-Aldrich(St Louis,MO,USA)and used as received.Non-woven textiles(cloth-like wipes made from cellulose and polypropylene blends)were purchased from Workwipes(New Pig Co.,Tipton, PA,USA).Water purified in a Milli-Q(Millipore,Billerica,MA,USA)system was used in all experiments.Experimental proceduresPreparation of functionalized textile and sponge by the block copolymer grafting.A silica nanoparticle suspension containing20ml of2%silica nanoparticles (7.0nm),0.5ml concentrated HCl and0.5ml1,2-bis(triethoxysilyl)ethane wasfirst prepared by mixing under stirring.The non-woven textile wasfirst cleaned by ethanol and water to remove surface impurities and then treated by air plasma for1min.Subsequently,the silica nanoparticles were deposited on the textile by a dip-coating process.After drying of the silica-nanoparticle-deposited textile in an oven at601C for3h,the textile was washed thoroughly by copious amounts of water and then dried.The silica-nanoparticle-deposited textiles were then immersed in a1%anhydrous toluene solution of BPS for12h at room temperature to functionalize the textile surface with bromoalkyl groups via silanization.The silanized textile was then rinsed with toluene and ethanol to remove the unreacted silanes,followed by drying with a flow of nitrogen.Finally,the P2VP-b-PDMS block copolymers were coated on the silanized textile from a2mg mlÀ1THF solution by a dip-coating process,and then the textile was put in a vacuum oven at1501C for12h to enable quaternization between the bromoalkyl groups and the pyridine groups of the block copolymers.The ungrafted polymers were removed by washing with copious amounts of THF.Functionalized sponges were prepared using the same procedures.Preparation offlat surfaces of P2VP-b-PDMS,P2VP and PDMS.P2VP-b-PDMS-grafted smooth silicon wafer:A cleaned,smooth silicon wafer wasfirst immersed in a1%anhydrous toluene solution of BPS for12h at room temperature to functionalize the silicon surface with bromoalkyl groups via silanization.The silanized silicon was then rinsed with toluene and ethanol to remove the unreacted silanes,followed by drying with aflow of nitrogen.The P2VP-b-PDMS block copolymer was spin-coated on the silanized silicon surface from a2mg mlÀ1THF solution,and then the silicon wafer was put in a vacuum oven at1501C for12h to enable quaternization between the bromoalkyl groups and the pyridine groups of the block copolymers.The ungrafted polymers were removed by washing with copious amounts of THF.P2VP-grafted smooth silicon wafer:26A cleaned,smooth silicon wafer was first immersed in a1%anhydrous toluene solution of3-glycidoxypropyl trimethoxysilane for12h at room temperature to functionalize the silicon surface with glycidyl groups.The glycidyl group-grafted silicon wafer was then rinsed with toluene and ethanol to remove the unreacted silanes,followed by drying with aflow of nitrogen.The P2VP-COOH was spin-coated on the silanized silicon surface from a2mg mlÀ1THF solution,and then the silicon wafer was put in a vacuum oven at1501C for12h to enable a reaction between the glycidyl groups and the end-carboxyl groups of P2VP-COOH. The ungrafted polymers were removed by washing with copious amounts of THF.Flat PDMS surface:Theflat PDMS surface was prepared by mixing the Sylgard184silicone elastomer base and curing agent in a10:1ratio,degassing and spin-coating this mixture on a silicon wafer,and curing for12h at601C. Characterization.Air plasma treatment was carried out using a PDC-002 plasma cleaner(Harrick Plasma Company,Ithaca,NY,USA).Scanning electron microscopy images were obtained on an FEI Magellan scanning electron microscope(FEI Company,Hillsboro,OR,USA).Contact angle(CA)mea-surements were performed with an Attension Theta system(KSV Instruments Ltd,Espoo,Finland)at ambient temperature.Water droplets of2.0m l were used for the water CA measurements in air.For the underwater oil CA measurements,oil droplets(DCE,ca.2m l)were dropped carefully onto the surface of the samples,which werefixed on the bottom of a glass container filled with water of different pH.An average CA value was obtained by measuring the same sample at three different positions.Controllable separation of gasoline and water mixtures.A piece of the block copolymer-grafted textile(B2Â2cm2)wasfixed between two glass tubes (diameter B1.5cm),serving as a separation membrane.With the non-acid-pretreated textile in place,a mixture of commercial gasoline and pH6.5water (30ml gasoline,10ml water)was poured into the upper glass tube.The gasoline selectively passed through the textile,whereas the water remained in the upper glass tube.For the acidic water-treated textile,the functionalized textile wasfirst wetted with acidic water with a pH of2.0before the oil/water separation process.Then a mixture of commercial gasoline and pH6.5water (10ml gasoline,30ml water)was poured into the upper glass tube.Water selectively passed through the textile,whereas gasoline remained in the upper glass tube.Underwater oil capture and release by the functionalized sponge.DCE of2ml stained with oil red O dye was dropped into a beaker containing water with a pH of6.5,and a functionalized sponge was moved to touch the DCE in water. The release of the DCE from the sponge was carried out by putting the oil-loaded sponge into acidic water with a pH of2.0,followed by gentle compression.RESULTS AND DISCUSSIONPreparation of block copolymer-grafted non-woven textiles Generally,to achieve extreme wettability,a rough surface,especially a hierarchically micro-nanostructured surface,is a prerequisite,which amplifies the surface’s intrinsic wetting behavior.27–32Here wefirst chose a non-woven textile as our substrate,because of its low cost, wide availability,chemical and mechanical robustness,and more importantly,its inherentfiber structure,which provides micro-scale structure.Figure1a schematically illustrates the block copolymer grafting strategy for preparation of a surface with switchable super-oleophilicity and superoleophobicity in aqueous media on a textile substrate.T o introduce nanostructures on the textile surface and further increase the surface roughness,silica nanoparticles werefirst deposited on the textile from a silica suspension,containing silica nanoparticles(diameter B7.0nm),HCl and1,2-bis(triethoxysilyl) ethane.The1,2-bis(triethoxysilyl)ethane was used as a couplingSuperoleophilicity and superoleophobicityL Zhang et al 2NPG Asia Materialsagent,which can react with the hydroxyl groups on the surfaces of silica nanoparticles and the textile to cross-link the silica nanoparticles and improve the adhesion between the silica nanoparticles and the underlying textile fibers.The textile with the deposited silica nano-particles was then immersed in an anhydrous toluene solution of BPS to functionalize the surface with bromoalkyl groups via silanization,which served as an intermediate anchoring layer for the block copolymer grafting.Finally,the P2VP -b-PDMS block copolymer was dip-coated on the silanized textile from a tetrahydrofuran solution,and the textile was then placed in a vacuum oven at 1501C to enable quaternization between the bromoalkyl groups of BPS and the pyridyl groups on the block copolymers,yielding a layer of the grafted block copolymer.Because of the nature of the grafting of the block copolymers via the pyridyl groups in the P2VP blocks,the grafted block copolymer layer can be considered as a mixed polymer brush of P2VP and PDMS chains with broad distribution.33Scanning electron microscopy measurements were carried out to characterize the surface morphologies of the textile before and after these treatments.The raw textile typically had ribbon-like fibers of about 40m m in width and 5m m in thickness with relatively smooth surfaces (Figure 1b).After the deposition of the silica nanoparticles and the grafting of the block copolymer,the basic structure of the textile remained unchanged (Figure 1c).An enlarged view of a textile fiber (Figure 1c,inset)reveals that there were discretely distributed aggregates of the nanoparticles ranging in size from tens of nan-ometers to several micrometers on the fiber surfaces.These nanopar-ticle aggregates,along with the inherent micro-sized fibers of the textile,constituted a hierarchically micro-nanostructured positional analysis of the textile surface before and after these treatments,which was carried out by X-ray photoelectron spectro-scopy measurements,confirmed the successful grafting of the P2VP -b-PDMS block copolymer on the surface of the textile by the appearance of a nitrogen signal associated with P2VP (Supplementary Figure S1).pH-responsive property and switchable oil wettability of the functionalized textileAs has been reported,P2VP has a pH-responsive property and it can alter its wettability as well as its conformation via protonation and deprotonation of its pyridyl groups if the pH changes.34–36The X-ray photoelectron spectroscopy measurement of the functionalized textile indicated that the grafting of the block copolymer on the surface of the textile was achieved via a very small number of2-vinylpyridineFigure 1Preparation and characterization of a surface with switchable superoleophilicity and superoleophobicity on a non-woven textile substrate.(a )Schematic showing the preparation strategy for a surface with switchable superoleophilicity and superoleophobicity on a non-woven textile.(b )Scanning electron microscope (SEM)image of the raw textile.Inset:enlarged view of the surface of a single fiber.(c )SEM image of the textile after deposition of silica nanoparticles and block copolymer grafting.Inset:enlarged view of the surface of a singlefiber.Figure 2Wettability of the functionalized textile in air.(a )Still images from video CA measurements for a water droplet (pH ¼6.5)applied on the functionalized textile (left)and after 900s of exposure (right)in air.(b )Still images from video CA measurements for a water droplet (pH ¼2.0)applied on the functionalized textile;the acidic droplet spread over the surface gradually within 160s,indicating the transition of wettability of the surface from superhydrophobicity to superhydrophilicity.(c )Reversible wettability of the functionalized textile for water droplets with a pH of 6.5(even cycles)and 2.0(odd cycles)in air.(d )Still images from video CA measurements of a DCE droplet applied on the functionalized textile surface in air.Superoleophilicity and superoleophobicity L Zhang et al3NPG Asia Materialsmonomer units,and most of the pyridyl groups on P2VP-b -PDMS copolymer remained unchanged during the grafting process,which preserved the pH-responsive property of P2VP (Supplementary Figure S1).CA measurements were first conducted in air to probe the responsive wettability of the functionalized textile surface by using water droplets with different pH (Supplementary Figure S2).Figure 2a shows that a water droplet with a pH of 6.5formed a sphere with a CA of 157.21on the textile surface in air.After sitting in ambient air for 15min,the same water droplet maintained its spherical shape despite its size shrinkage due to evaporation,indicating its stable super-hydrophobicity to water with a pH of 6.5.As a weak polybase,P2VP has a p K a of about 3.6.34When in contact with a water droplet with a pH of 6.5,P2VP is therefore in the deprotonated state and exhibits a collapsed conformation due to the hydrophobic interaction between the deprotonated P2VP chains.On the other hand,the PDMS block has a desirably low glass transition temperature (Tg)of about À621C (according to the supplier),and it can be considered as a liquid-like polymer with high flexibility at ambient temperature.26In air,the liquid-like PDMS,which is more hydrophobic than the P2VP ,can spontaneously move to the exterior of the grafted copoly-mer layer and dominantly expose itself to air.37As a consequence,hydrophobic PDMS on the exterior of the grafted block copolymer layer makes the surface hydrophobic,which is further amplified by the hierarchical micro-nanostructures on the surface,resulting in the superhydrophobicity.However,when a water droplet with a pH of 2.0was applied to the same textile in air,it gradually wetted the textile and spread over the surface completely within about 160s,indicating the superhydrophilic property (water contact angle lower than 101)of the surface to acidicwater with a pH of 2.0(Figure 2b).When contacting the acidic water,the P2VP chains on the surface become protonated and exhibit an extended conformation because of the electrostatic repulsion among the like charges.They then stretch to the exterior of the grafted block copolymer layer.With the protonated P2VP exposed on the surface,the textile surface acquires hydrophilic property,leading to the wetting with the acidic water.After wetting with the acidic water (pH ¼2.0),most of the pyridyl groups on the functionalized textile can be protonated considering the p K a (3.6)of P2VP .Remarkably,the acidic-water wetted textile easily recovered its superhydrophobicity when we rinsed it with water (pH 6.5)and dried it with nitrogen flow.This treatment can be conducted at room temperature and does not involve the use of extreme heating or organic solvent washing processes.33The reversible cycles can be repeated many times without any change in the responsive property (Figure 2c).The easy reversal of the wetting characteristics of the functionalized textile can be attributed to the highly flexible PDMS of the grafted copolymers.Upon drying,the PDMS,being more hydro-phobic than P2VP ,can spontaneously move and expose itself on the exterior of the grafted block copolymers again,thereby recovering the superhydrophobicity of the functionalized textile.In addition to hydrophobicity,the dominance of the oleophilic PDMS on the exterior surface endows the functionalized textile with a high affinity to oil.CA measurements using DCE (density,1.253g cm À3)droplets show that,as soon as an oil droplet contacted the functionalized textile surface,it immediately spread out and wetted the textile within 0.05s,indicating the superoleophilicity of the material in air (Figure 2d).Having demonstrated the superoleophilicity of the P2VP -b-PDMS-grafted textile as well as its switchable wettability to waterwithFigure 3Oil wettability of the functionalized textile in aqueous media.(a )Still images from video CA measurements of a DCE droplet on the functionalized textile surface in water with a pH of 6.5.(b )Snapshots showing the ability of the functionalized textile for the capture of an oil droplet in aqueous media with a pH of 6.5.In greater detail,an oil droplet stained with oil red O was first dropped to the bottom of a beaker containing water with a pH of 6.5.Then,a piece of the functionalized textile was lowered into the water to approach the oil droplet.On contact,the textile immediately sucked up the oil droplet,leaving behind no oil residue.(c )Image of a DCE droplet applied on the surface of the textile in water with a pH of 2.0.(d )Photograph of DCE droplets sitting on the functionalized textile in acidic water with a pH of 2.0.The DEC droplets were stained with oil red O for clear observation.(e )Reversible oil wettability of the functionalized textile in aqueous media with a pH of 6.5(even cycles)and 2.0(odd cycles).Superoleophilicity and superoleophobicityL Zhang et al4NPG Asia Materialsdifferent pH in air,we then evaluated the oil wettability of the functionalized textile in aqueous media with different pH.Figure 3a shows the oil-wetting behavior of the functionalized textile immersed in water with a pH of 6.5.It can be observed that as soon as an oil (DCE)droplet touched the surface,it was immediately sucked into the textile within 0.12s,indicating its superoleophilicity.Because of this superoleophilicity,the block copolymer-grafted textile could be used in underwater oil capture as demonstrated in Figure 3b.As has been discussed,in water with a pH of 6.5,the P2VP is not protonated and maintains its collapsed conformation,which main-tains the dominant exposure of the PDMS.The dominantly exposed PDMS prevents the textile from being wetted by water and retains its high affinity to oil,which,assisted by the hierarchical surface struc-tures,leads to superoleophilicity.Upon contact with oil,the PDMS chains preferentially stretch out into the oil because of their oleophilic nature (Figure 4,left panel).Moreover,air could be trapped inside the porous structures of the textile when the superhydrophobic textile is moved from air to water,17,38,39which may also contribute to the superoleophilicity of the functionalized textile in water with a pH of 6.5.Additionally,it was found that the functionalized textile main-tained its superoleophilicity even after 24h of immersion in water with a pH of 6.5,demonstrating its stable superoleophilicity in such aqueous media.In contrast,when the functionalized textile was immersed in water with a pH of 2.0,the oil wettability of the textile was completely reversed.As shown in Figure 3c,the oil droplet formed a sphere with a CA of 165.31on the textile surface in the acidic water,indicating that the textile was superoleophobic.Figure 3d is a photograph of oil droplets sitting on the surface of the textile in the acidic water (pH 2.0).Clearly,the oil did not wet the material.Furthermore,in the acidic water,the oil droplet on such a surface showed a sliding angle less than 51,which means the oil droplets on the surface could roll off easily,indicating the low oil adhesion of the surface in the acidic water.As discussed previously,when in contact with water with a pH of 2.0,the textile becomes hydrophilic and wets with the acidic water because of the protonated P2VP chains,which exhibit an extended conformation and are dominantly exposed.The protonated P2VP on the exterior of the grafted block copolymer layer is hydrophilic and traps water,and thus,a water-trapped surface could be formed on top of the oleophilic PDMS,which effectively blocks the access of the oil by the PDMS (Figure 4,right panel).Because of the high repellency between polar (water and protonated P2VP)and non-polar (oil)molecules,the surface exhibits oleophobicity,which is further ampli-fied by the hierarchical structures of the textile,resulting in a super-oleophobic surface.After being rinsed with water (pH 6.5)and dried with nitrogen flow,the superoleophobic textile could easily recover its superoleophilicity in aqueous media with a pH of 6.5,and this reversible cycle could be repeated many times without any change in the pH-responsive property of the surface (Figure 3e).The reversible cycles of the surface wettability both in air and aqueous media imply that the chemical characteristics of the surface,especially the pH-responsive property of the functionalized textile,are stable during treatment.As is well known,the wettability of a solid surface is governed by both the chemical composition and the roughness of the surface.27–32T o further verify the effect of the pH-responsive surface chemistry on the oil wettability of the functionalized textile,a smooth silicon wafer was used as the substrate onto which the P2VP -b-PDMS block copolymer was grafted.This set-up eliminated the influence of surface roughness.Meanwhile,a flat and pure PDMS film and a pure P2VP-grafted smooth silicon wafer were also prepared for comparisons (see Methods).The wettability of these flat surfaces under different conditions was investigated and the results are summarized in Table 1.In air,the P2VP-b -PDMS-grafted silicon surface was oleophilic and exhibited pH-responsive wettbility to water with different pH,indicating that the surface chemistry changed as a result of deprotonation and protonation of the P2VP .Compared with that of the pure P2VP-grafted flat silicon surface,in air,the much increased CA of the P2VP -b-PDMS-grafted surface to water with a pH of 6.5indicates the presence of PDMS on the exterior of the grafted block copolymer layer.Although immersed in water with a pH of 6.5,the P2VP-b -PDMS-grafted surface also exhibited oleophilic properties with the CA for DCE,similar to that of the flat pure PDMS film in the same water,indicating that the PDMS maintains its dominance on the exterior of the grafted block copolymer layer.However,when immersed in water with a pH of 2.0,the P2VP-b -PDMS-grafted surface became oleophobic with the CA for DCE,similar to that of the pure P2VP-grafted surface in acidic water (pH ¼2.0).Given that the flat pure PDMS film had a constant CA for DCE in water with different pH,the distinct change of the oil wettability on the P2VP-b -PDMS-grafted surface implies the domi-nant exposure of the protonated P2VP on the exterior of block copolymer layer in the acidic water,which blocks the access of oil by the oleophilic PDMS.The oil droplet actually sits on a water-trapped surface formed by extended and hydrophilic P2VP in the protonated state in the acidic water.Therefore,our results demon-strated that the grafting of P2VP-b -PDMS endowed the surfaces with a unique pH-responsive chemistry,which induced switchable oil wett-ability in aqueous media with different pH.Considering that the surface chemical composition of the P2VP-b -PDMS-graftedsmoothFigure 4Schematic diagrams for the switchable oil wettability of the P2VP-b -PDMS-grafted textile.Left,schematic diagram of the oil wettability of the functionalized textile in water with a pH of 6.5.Right,schematic diagram of the oil wettability of the functionalized textile in water with a pH of 2.0.Table 1CA of water and DCE droplets on the different surfaces in air and in waterCA,±31Wetting systems Flat silicon withP2VP-b -PDMSFlat PDMS Flat silicon with P2VP Textile with P2VP-b -PDMSWater of pH 6.5in air 91.2109.355.0157.2Water of pH 2.0in air 52.1107.524.70DCE in air13.523.021.00DCE in water of pH 6.536.527.475.50DCE in water of pH 2.0137.625.8132.3165.3Abbreviations:CA,contact angle;DCE,1,2-dichloroethane;PDMS,polydimethylsiloxane;P2VP ,poly(2-vinylpyridine);P2VP -b-PDMS,P2VP -b-dimethylsiloxane).Superoleophilicity and superoleophobicity L Zhang et al5NPG Asia Materials。

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