BYV72F资料

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Rectifier diodes BYV72F series
ultrafast
GENERAL DESCRIPTION
QUICK REFERENCE DATA
Glass passivated,high efficiency,SYMBOL PARAMETER
MAX.MAX.MAX.UNIT dual,rectifier diodes in a full pack,plastic envelope,featuring low BYV72F-100150200forward voltage drop,ultra-fast V RRM Repetitive peak reverse 100150200V recovery times and soft recovery voltage
characteristic.They are intended for V F Forward voltage 0.900.900.90V use in switched mode power supplies I O(AV)Output current (both 202020A and high frequency circuits in general diodes conducting)where low conduction and switching t rr
Reverse recovery time
28
28
28
ns
losses are essential.
PINNING - SOT199
PIN CONFIGURATION
SYMBOL
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).SYMBOL PARAMETER
CONDITIONS
MIN.MAX.UNIT -100-150-200V RRM Repetitive peak reverse voltage -100150200V V RWM Crest working reverse voltage -100150200V V R Continuous reverse voltage 1-100
150200
V I O(AV)
Output current (both diodes square wave; δ = 0.5;-20A conducting)2
T hs ≤ 78 ˚C
sinusoidal; a = 1.57;-20A T hs ≤ 78 ˚C
I O(RMS)RMS forward current
-20A I FRM Repetitive peak forward current t = 25 µs; δ = 0.5;-30A per diode
T hs ≤ 78 ˚C I FSM
Non-repetitive peak forward t = 10 ms -150A current per diode
t = 8.3 ms
-160A sinusoidal; with reapplied V RWM(max)I 2t I 2t for fusing
t = 10 ms -112A 2s T stg Storage temperature
-40150˚C T j
Operating junction temperature
-150
˚C
1 T hs ≤ 125˚C for thermal stability.
2 Neglecting switching and reverse current losses.
ISOLATION LIMITING VALUE & CHARACTERISTIC
T
hs
= 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN.TYP.MAX.UNIT
V
isol Repetitive peak voltage from all R.H. ≤ 65 % ; clean and dustfree-2500V three terminals to external
heatsink
C
isol Capacitance from T2 to external f = 1 MHz-22-pF heatsink
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN.TYP.MAX.UNIT
R
th j-hs Thermal resistance junction to both diodes conducting
heatsink with heatsink compound-- 4.0K/W
without heatsink compound--8.0K/W
per diode
with heatsink compound-- 5.0K/W
without heatsink compound--9.0K/W
R
th j-a Thermal resistance junction to in free air-35-K/W ambient
STATIC CHARACTERISTICS
T
j
= 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN.TYP.MAX.UNIT
V
F Forward voltage (per diode)I
F
= 15 A; T
j
= 150˚C-0.830.90V
I
F
= 15 A-0.95 1.05V
I
F
= 30 A- 1.00 1.20V
I R Reverse current (per diode)V
R
= V
RWM
; T
j
= 100 ˚C-0.51mA
V
R
= V
RWM
-10100µA
DYNAMIC CHARACTERISTICS
T
j
= 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN.TYP.MAX.UNIT
Q
s Reverse recovery charge (per I
F
= 2 A; V
R
≥ 30 V; -dI
F
/dt = 20 A/µs-615nC diode)
t rr Reverse recovery time (per I
F
= 1 A; V
R
≥ 30 V;-2028ns diode)-dI
F
/dt = 100 A/µs
I rrm Peak reverse recovery current I
F
= 10 A; V
R
≥ 30 V;-2 2.4A (per diode)-dI
F
/dt = 50 A/µs; T
j
= 100 ˚C
V
fr Forward recovery voltage (per I
F
= 1 A; dI
F
/dt = 10 A/µs-1-V diode)
MECHANICAL DATA
Notes
1. Refer to mounting instructions for F-pack envelopes.
2. Epoxy meets UL94 V0 at 1/8".
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information
Where application information is given, it is advisory and does not form part of the specification.
© Philips Electronics N.V. 1997
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.。

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