ELECTROSTATIC CHUCK DEVICE AND METHOD FOR DETERMIN
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专利名称：ELECTROSTATIC CHUCK DEVICE AND
METHOD FOR DETERMINING ATTRACTED
STATE OF WAFER
发明人：Hiroshi Fujisawa
申请号：US13060237
申请日：20090826
公开号：US20110141650A1
公开日：
20110616
专利内容由知识产权出版社提供
专利附图：
摘要：Provided is an electrostatic chuck device including attraction determining means, which enables a quick and accurate recognition of an attracted state of a
substrate, and also provided is a method of determining an attracted state of a substrate, which enables a quick and accurate recognition of the attracted state of the substrate in the electrostatic chuck device. The electrostatic chuck device includes: an electrostatic chuck for attracting the substrate, the electrostatic chuck being provided on an upper surface side of a metal base; and attraction determining means for determining the attracted state of the substrate. Further, the method of determining an attracted state of a substrate is used for the electrostatic chuck device including the electrostatic chuck for attracting the substrate, the electrostatic chuck being provided on the upper surface side of the metal base, the method including obtaining, by a heat flux sensor, a flow of heat transferred from the substrate via the electrostatic chuck, to thereby determine the attracted state of the substrate.
申请人：Hiroshi Fujisawa
地址：Nara JP
国籍：JP
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