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Hi3536外围设备驱动操作指南

产品版本
与本文档相对应的产品版本如下。
产品名称 Hi3536
产品版本 V100
读者对象
本文档（本指南）主要适用于以下工程师： z 技术支持工程师 z 软件开发工程师
修订记录
修订记录累积了每次文档更新的说明。最新版本的文档包含以前所有文档版本的更新内容。
修订日期 2015-06-09
2015-03-04
1.1 操作示例......................................................................................................................................................... 1 1.2 操作中需要注意的问题 ................................................................................................................................. 2 1.3 IPv6 说明 ......................................................................................................................................................... 3
邮编：518129
外围设备驱动操作指南
前言
初稿，仅供参考！
前言
概述
本文档主要是指导使用 GMAC、USB 2.0 Host/USB3.0 Host 和 EMMC 卡等驱动模块的相关人员，通过一定的步骤和方法对和这些驱动模块相连的外围设备进行控制，主要包括操作准备、操作过程、操作中需要注意的问题以及操作示例。

Diva-Lite 20U 30U LED (True Match Firmware 5.0) (

Part No. 3100120 Rev B 05-01-2021Operation ManualDiva-Lite 20U/30U LED(True Match Firmware 5.0)®(RDM)2LVR-SL290-P Diva-Lite 20 Louver/HP, 90° (Included)LVR-SL390-P Diva-Lite 30 Louver/HP, 90° (Included)DIV-LX30U Diva-Lite 30 LED DMX, Univ MTP-LBC Kino 41 Lollipop w/ Baby Receiver Curve (16mm) (Included)DIV-LX20U Diva-Lite 20 LED DMX, Univ3KIT-DL20XBU Diva-Lite 20 LED DMX Kit, Univ w/ Soft CaseKit Contents: Dimensions: 1 Diva-Lite 20 LED Fixture 31 x 7.5 x 18” 1 Soft Case (79 x 19 x 46cm) Weight: 19.5 lb (9kg) KIT-DL20XU Diva-Lite 20 LED DMX Kit, Univ w/ Travel CaseKit Contents: Dimensions: 1 Diva-Lite 20 LED Fixture 28.5 x 8.5 x 19.5”1 Travel Case (72 x 22 x 49.5cm) Weight: 26 lb (12kg) KIT-DL22XU Diva-Lite 20 LED DMX Kit, Univ (2-Unit) w/ Flight CaseKit Contents: Dimensions: 2 Diva-Lite 20 LED Fixture 22.5 x 16 x 33.5”1 Flight Case (57 x 41 x 85cm) Weight: 58 lb Diva-Lite 20 LED DMX Kit w/ Soft CaseDiva-Lite 20 LED DMX KitDiva-Lite 20 LED DMX Kit (2-Unit) w/ Flight CaseKIT-DL30XBUDiva-Lite 30 LED DMX Kit, Univ w/ Soft CaseKit Contents: Dimensions:1 Diva-Lite 30 LED Fixture 42.5 x 7.5 x 16.5”1 Soft Case (108 x 19 x 42cm)Weight:23 lb(10kg)KIT-DL30XUDiva-Lite 30 LED DMX Kit, Univ w/ Flight CaseKit Contents: Dimensions:1 Diva-Lite 30 LED Fixture 46 x 11 x 16.5”1 Flight Case (117 x 28 x 42cm)Weight:43 lb(19.5kg)Diva-Lite 30 LEDDMX Kit w/ Soft CaseDiva-Lite 30 LEDDMX Kit w/ Flight Case45DC InputThe Diva-Lite LED can also beoperated on 24VDC (input range 18-36VDC) through a 3-Pin XLR. The pin polarity is:Pin # 1 – Ground Pin # 2 + 18-36VDCPin # 3 not used AC InputThe Diva-Lite LED includes a built-in power supply with universal input from 100-240VAC. It also includes a 12ft power cord with a locking IEC connector.Ambient Operating Temperature The Diva-Lite LED is designed tooperate at temperatures from14°F to 104°F (-10°C to 40°C).Note:A low voltage warning will display if input DC voltage is under 18VDC.Photo example: LOW VDC: 17A) On /Off: On = Green light displayed. Off = Red light displayed. The display and all menu settings can be operated while the power button is in the Off position, as long as power is applied to the controller. The On /Off button only controls the light source.B) Menu: Provides access to menu options such as General settings, Reset,DMX, DMX Wireless, Camera LUT and Color Space.Shortcut: While on control screen, press and hold for 3 seconds to switchthrough menus (White, Gels & Hue, RGB, CIE xy and FX).C) Preset Buttons: Factory defaults left to right are: 2700K, 3200K, 5000K and 6500K. G/M default value is 000. User can also use these preset buttons to store custom Kelvin and G/M settings.D) Display: Provides access to Dim, Kelvin, G/M, and DMX channel.Factory reset will show: Dim = 10%, Kelvin = 2700K, G/M = 000, DMX = 001. E) Lock: Press the Lock button to disable all buttons and Control knob.Press for 3 seconds to restore displayed presets to default factory settings. F) Mode: Press to navigate from Dim to Kelvin and G/M settings.When in sub-menus, pressing Mode always returns you to main display.When DMX is applied, use Mode to access DMX channel on main display.Shortcut: Long press will bring you back one step.G) Data Port: Mini B USB for firmware updates.H) Control Knob: Manually adjusts Dim, Kelvin, G/M levels and DMX address.Press the Control knob to toggle between Fine and Coarse increments orwhen selecting options within menus.DMX Note: Each LED Fixture has an “AUTO TERMINATE” feature. The last fixture that does not have an XLR cable attached to the DMX “Out” port will automatically terminate.6Gels/Hue ModeA) Menu:Provides access to menu options such as General settings (Gels/Hue Mode), Reset, DMX, DMX Wireless, Camera LUT and Color Space.Shortcut: While on control screen, press and hold for 3 seconds to switchthrough menus (White, Gels & Hue, RGB, CIE xy and FX).B) Preset Buttons:Factory defaults left to right are: 2700K, 3200K, 5000K and 6500K.G/M default value is 000. User can also use these preset buttons to storecustom Kelvin between 2500K and 9900K and custom G/M, Gel, Hue andSaturation settings.C) Display:Provides access to Dim, Kelvin, G/M, Gel, Hue/Saturation andDMX channel. Factory reset will show: Dim = 10%, Kelvin = 2700K,G/M = 000, DMX = 001.D) Mode:Press to navigate from Dim to Kelvin, G/M, Gel, Hue and Saturation settings. When on the Gel function, pushing the Control knob in/out will apply the gel or remove the gel. When in sub-menus, pressing Mode always returns you tomain display. When DMX is applied, use Mode to access DMX channel onmain display. Shortcut Tip: Long press will bring you back one step.7A) Menu: Provides access to menu options such as General settings (RGB Mode ), Reset, DMX, DMX Wireless, Camera LUT and Color Space. Shortcut: While on control screen, press and hold for 3 seconds to switch through menus (White, Gels & Hue, RGB, CIE xy and FX ).B) Preset Buttons: Factory defaults left to right are: 2700K, 3200K, 5000K and 6500K. G/M default value is 000. User can also use these preset buttons to store custom Kelvin between 2500K and 9900K and custom G/M, and RGB settings.C) Display: Provides access to Dim, Kelvin, G/M, RGB and DMX channel. Factory reset will show: Dim = 10%, Kelvin = 2700K, G/M = 000, DMX = 001.D) Mode: Press to navigate from Dim to Kelvin, G/M, RGB settings. When in sub-menus, pressing Mode always returns you to main display. When DMX is applied, use Mode to access DMX channel on main display. Shortcut: Long press will bring you back one step.RGB Mode 8CIE xy ModeA) Menu:Provides access to menu options such as General settings (CIE xy mode),Reset, DMX, DMX Wireless, Camera LUT and Color Space.Shortcut: While on control screen, press and hold or 3 seconds to switchthrough menus (White, Gels & Hue, RGB, CIE xy and FX).B) Preset Buttons:Factory defaults left to right are: 2700K, 3200K, 5000K and 6500K.User can also use these preset buttons to store custom xy settings.C) Display:Provides access to Dim, CIE xy coordinates and DMX Channel.Factory reset will show: Dim = 10%, x = 0.460 , y = 0.411, G/M = 000,DMX = 001.D) Mode:Press to navigate from Dim to xy settings. When in sub-menus,pressing Mode always returns you to main display. When DMX is applied,use Mode to access DMX channel on main display. Shortcut: Long presswill bring you back one step.910FX mode provides access to effects including Candle, Fire, TV, Police, Lightning, Paparazzi, Pulse and Scroll. Candle mode used as an example:A) FX Option: Choose the desired FX Mode by rotating the control knob. When on the desired effect, there will be several pre-programed effects as well as control parameters that can be altered.B) Preset Buttons: In FX Mode, Kelvin custom settings and any control functions displayed such as Rate and Amplitude (Ampl) can be saved as a preset. Chosen values can be assigned to any preset button by holding down the desired button for 3 seconds. The Kelvin display will flash once the setting is registered. To restore presets to default factory settings, choose Reset under General settings and Clear Presets. This method will reset all buttons in all Modes. Shortcut: If only want to clear presets for Candle Mode, hold Lock button for 3 seconds while Candle mode is displayed.C) Mode: Press to navigate from Dim to Kelvin and FX settings. Shortcut: Long press will bring you back one step. FX (Effects) Mode11The Camera LUT (Look-up Tables) feature harmonizes the Kino Flo light sources to the camera. Depending on the camera and the Kelvin setting, some differences are very subtle, while others can be more dramatic.The corrections are applied as a CIE xy correction at each CCT (Kelvin) setting. The default setting is targeting the CIE xyz response (human eye).Press the green menu button to the left of the display screen and scroll down to Camera LUT , then press the control knob. Menu with camera selection will be displayed. Turn the control knob and press to select camera setting: C1 Arri Alexa C2 Sony Venice C3 Panavision DXL C4 Panasonic VaricamThe camera code (C1 for Arri Alexa), for example, will appear on the main menu between DIM and CCT to designate that a camera setting is active.Note: When the controller is reset, the camera settings will go to Kino FloDefault mode.12Color Space defines the RGB color space used and only affects color – not Kelvin. It is used in RGB mode and Hue Angle and Saturation . There are a few instances in the FX (Effects) mode that are also affected when color is used. The RGB color space defines the value of Red, Green, and Blue primaries (in CIE xy) and the white point is fixed at 6500 Kelvin.Press the green menu button to the left of the display screen and scroll down to Color Space , then press the control knob. Menu with color selection will be displayed. Turn the control knob and press to select Color Space options:rec 709 / sRGB P3 D65rec 2020The color space rec 709 / sRGB is commonly used on computer monitors, SDTV and HDTV television. There are slight gamma variations between rec 709 / sRGB, but not enough to separate into 2 color spaces.The color space P3 D65 is a common color space for digital movie projection.The color space rec 2020 is used in ultra high definition television (UHDTV).The color space is used when the controller is set to the RGB mode and when set to the Hue Angle/ Saturation mode.In RGB mode – the color space designation will be displayed at the top of the menu. When changing the Red, Blue or Green values, the Kelvin will be locked in at 6500 for all color spaces. When the Kelvin is locked in, CCT will be displayed as CCT*. When using Green/Magenta the CCT value is unlocked and color space selection has no impact.In Hue Angle/Saturation mode – the color space designation will be displayed on the Gel line and GEL will be displayed as GEL* and CCT will be displayed as CCT*. The Color space will be displayed only when Hue Angle and Saturation are being used. When using Green/Magenta or Gel, the CCT will be unlocked and color space selection has no impact.13Lollipops are interchangeable.MTP-LKino 41 Lollipop w/ 3/8” Pin (10mm)MTP-LBC Kino 41 Lollipop w/ Baby Rcvr Curve(16mm)MTP-LBS Kino 41 Lollipop w/ Baby Rcvr Short(16mm)Mounted on a baby stand.Turn the knob to loosen or tighten the mount.Mounted to pipe grid.Note: When hanging in a studio, loop a safety cord through the metal ring provided on the back of the fixture.14The Louver is fastened to the fixture with 4 Velcro straps.MTP-B41FKino Offset w/Baby Receiver (16mm)The Baby Offset Arm (MTP-B41F) allows fixtures to mount on the center of a stand or it can also be under slung from a baby stand to use as an up light.15To mount Flozier accessory, remove Louver.Stretch two elastic cords around fixture.Take up slack on both elastic cords.Expand the Barndoors to smooth out the face of the Flozier and eliminate wrinkles.16The SnapBag accessory (DFS-FS31-S & DFS-FS21-S ) is a lightweight fabric tailor-made for the Diva-Lite LED. It slips over the fixture and is attached with straps. The reflective material intensifies the soft light. The removable Magic cloth or Grid cloth attaches to the inside with Velcro.The SnapGrid accessory (LVR-FS340-S & LVR-FS240-S ) is constructed of pre-stretched fireproof fabric with a built-in stainless steel frame. It unfolds and snaps into place. This model requires the use with the corresponding SnapBag; it is not designed to be used by itself.17DFS-SL30-H Diva-Lite 30 Flozier, Half DFS-SL20-HDiva-Lite 20 Flozier, HalfLVR-SL390-P Diva-Lite 30 Louver/HP 90°LVR-SL360-P Diva-Lite 30 Louver/HP 60°LVR-SL290-P Diva-Lite 20 Louver/HP 90°LVR-SL260-PDiva-Lite 20 Louver/HP 60°DFS-FS31-S Diva-Lite 30 SnapBag w/ 2 x Diffusion DFS-FS21-S Diva-Lite 20 SnapBag w/ 2 x Diffusion LVR-FS340-SDiva-Lite 30 SnapGrid 40° LVR-FS240-SDiva-Lite 20 SnapGrid 40°Lollipops are interchangeable.MTP-L Kino 41 Lollipop w/ 3/8” Pin (10mm)MTP-LBC Kino 41 Lollipop w/ Baby Rcvr Curve (16mm)MTP-LBS Kino 41 Lollipop w/ Baby Rcvr Short (16mm)18BAG-SL30 Diva-Lite 30 Soft Case BAG-SL20Diva-Lite 20 Soft CaseKAS-DL30 Diva-Lite 30 Flight Case KAS-DL20-CDiva-Lite 20 Travel CaseKAS-DL22 Diva-Lite LED 20 Flight Case (2)DIV-L20XU Diva-Lite 20 LED DMX, UnivC Input Voltage: 100~240VAC 50/60Hz, 150WAmperage VAC: 1.25A at 120VAC , 0.65A at 230VAC DC Input Voltage: 18~36VDC, 150W Amperage VDC: 6.25A at 24VDCKelvin Range: 2500K~9900K Dimming Range: 100%~1% Weight: 14.5 lb (6.5kg) Dimensions: 25 x 13 x 6” (63.5 x 33 x 15cm)DIV-L30XU Diva-Lite 30 LED DMX, UnivAC Input Voltage: 100~240VAC 50/60Hz, 150WAmperage VAC: 1.25A at 120VAC , 0.65A at 230VACDC Input Voltage: 18~36VDC, 150W Amperage VDC: 6.25A at 24VDCKelvin Range: 2500K~9900K Dimming Range: 100%~1% Weight: 17 lb (8kg)Dimensions: 39 x 10.5 x 6” (99 x 27 x 15cm)Diva-Lite 20 LEDDMXDiva-Lite 30 LEDDMX19FCC Part 15 Verification:This device complies with Part 15 of the FCC Rules. Operation is subject to the condition that this device does not cause harmful interference.FCC Part 15 Declaration of Conformity:This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference thatmay cause undesired operation.KINO FLO, INCDiva-Lite 20 LED, Diva-Lite 30 LED ID: XRSCRMXTIMO101 IC: 8879A-CRMXT101For latest Warranty information and Certifications,see Kino Flo website at .Environmental: Disposal of Old Electrical & Electronic Equipment.This symbol on the product or on its packaging indicates that this product shall not be treated as household waste. This product is made of recyclable materials and should be disposed of in accordance with governmental regulations.Kino Flo, Inc. 2840 N. Hollywood Way, Burbank, CA 91505, USATel: 818 767-6528 website: The light source of this luminaire is not replaceable; when the light source reaches its end of life the whole luminaire shall be replaced. The luminaire is intended for professional use only.。

Hi3536 SDK 安装以及升级使用说明

Hi3536 SDK 安装以及升级使用说明序1、先明确文中的几个概念。

主片：多片级联应用中，指PCI主片。

从片：多片级联应用中，指PCI从片。

主arm：指双CPU中的A17。

从arm：指双CPU中的A7。

第一章安装SDK1、Hi3536 SDK包位置在"Hi3536_V100R001***/01.software/board"目录下，您可以看到一个 Hi3536_SDK_Vx.x.x.x.tgz 的文件，该文件就是Hi3536的软件开发包。

2、解压缩SDK包在linux服务器上（或者一台装有linux的PC上，主流的linux发行版本均可以），使用命令：tar -zxfHi3536_SDK_Vx.x.x.x.tgz ，解压缩该文件，可以得到一个Hi3536_SDK_Vx.x.x.x目录。

3、展开SDK包内容返回Hi3536_SDK_Vx.x.x.x目录，运行./sdk.unpack(请用root或sudo权限执行)将会展开SDK包打包压缩存放的内容，请按照提示完成操作。

如果您需要通过WINDOWS操作系统中转拷贝SDK包，请先运行./sdk.cleanup，收起SDK包的内容，拷贝到新的目录后再展开。

4、在linux服务器上安装交叉编译器1）安装uclibc交叉编译器（注意，需要有sudo权限或者root权限）：进入Hi3536_SDK_Vx.x.x.x/osdrv/opensource/toolchain/arm-hisiv300-linux目录，运行chmod +x cross.v300.install，然后运行./cross.v300.install即可。

2) 安装glibc交叉编译器：进入Hi3536_SDK_Vx.x.x.x/osdrv/opensource/toolchain/arm-hisiv400-linux目录，运行chmod +x cross.v400.install，然后运行./cross.v400.install即可。

Hi3536经验

一、ubutun 软件更新sudo apt-get update2.装一些32位的库64位Ubuntu使用sudo apt-get install ia32-libs二、安装vimapt-get install vim-gtk三、虚拟机找不到/mnt/hgfs挂载目录使用较低版本的Ubuntu低于12四、设置ubutun固定IPsudo vi /etc/network/interfaces原有内容只有如下两行：auto loiface lo inet loopback向末尾追加以下内容：auto eth0iface eth0 inet staticaddress 192.168.1.188gateway 192.168.1.1netmask 255.255.255.0network 192.168.1.0broadcast 192.168.1.255配置DNS解析vim /etc/resolvconf/resolv.conf.d/base添加：nameserver 192.168.1.1nameserver 220.170.64.68重启网卡/etc/init.d/networking restart五、解压arm-hisiv300-linux.tar.bz2文件tar –zxvf Hi3536_V100R001XX.tgz。

路径：/tftpboot/Hi3536_SDK_V2.0.2.0/osdrv/opensource/toolchain/arm-hisiv400-linux步骤1. 解压工具链。

工具链及其安装程序位于osdrv/opensource/toolchain/arm-hisiv300-linux/目录下，进入此目录进行解压，命令如下：cd toolchain/arm-hisiv300-linux/tar -xvf arm-hisiv300-linux.tar.bz2步骤2. 安装工具链。

i.MX6UL产品说明书

Product Features1.NXP i.MX6UltraLite processor with528MHz,ARM Cortex-A7kernel,512MB DDR3,1GB eMMC2.Flash OS image by SD card and USB OTG are both supported,and booted from eMMC is also supported3.Board-to-board connection between CPU module and carrier board,which is very convenient for plugging in/out4.Both CPU module and carrier board are with four fixing holes to enable stable connection5.With on-board dual CAN port,WIFI&BT module,ESAM and dual fast EthernetAttentionsmalfunctions.Please do not modify the product by yourself or use fittings unauthorized by us.Otherwise, the damage caused by that will be on your part and not included in guarantee terms.Any questions please feel free to contact Forlinx Technical Service Department..Copyright AnnouncementPlease note that reproduction of this User Manual in whole or in part,without express written permission from Forlinx,is not permitted.Updating RecordTechnical Support and Innovation1.Technical Support1.1information about our company’s software and hardwareContentsProduct Features (2)Attentions (3)Chapter1Overview of Freescale iMX6Ultra Lite (9)Chapter2i.MX6UL CPU Module Introduction (12)2.1CPU Module Overview (12)2.2FETMX6UL CPU Module Dimension (13)2.2CPU Module Features (13)2.3Power Supply Mode (14)2.4Working Environment (14)2.5CPU Module Interface (14)2.6CPU Module Pin Definition (15)2.6.1CPU module schematic (15)2.6.2CPU Module FETMX6UL-C Pin Definition (16)2.7CPU Module Design (21)Chapter3i.MX6UR Development Platform Overview (23)3.1Overview of single board computer i.MX6UR (23)3.2Carrier Board Dimension (24)3.3Base board resource: (24)3.4i.MX6UR Base Board Introduction (25)3.4.1Base Board Power (25)3.4.2Power Switch (25)3.4.3Reset Key (25)3.4.4Boot Configuration (26)3.4.5Serial Port(Debug Port) (27)3.4.6General Serial Port (28)3.4.7CAN (28)3.4.8SD Card Slot (28)3.4.9SDIO Port (29)3.4.10RTC Battery (29)3.4.11WIFI/Bluetooth (30)3.4.12Digital Camera Interface (30)3.4.13ESAM Interface (31)3.4.14RED (31)3.4.15Audio (31)3.4.16Dual Hundred Ethernet Ports (33)3.4.17USB Host (33)3.4.18JTAG Debug Port (34)3.4.19RCD Connector (35)3.4.20USB OTG (36)3.4.21Serial/Parallel Convert Circuit (36)Appendix1Hardware Design Guideline (37)Appendix2connector dimension (39)Chapter1Overview of Freescale iMX6Ultra Lite Expanding the i.MX6series,the i.MX6UltraLite is a high performance,ultra-efficient processor family featuring an advanced implementation of a single ARM®Cortex®-A7core,which operates at speeds up to528MHz.The i.MX6UltraLite applications processor includes an integrated power management module that reduces the complexity of external power supply and simplifies power sequencing.Each processor in this family provides various memory interfaces,including16-bit LPDDR2,DDR3,DDR3L, raw and managed NAND flash,NOR flash,eMMC,Quad SPI and a wide range of other interfaces for connecting peripherals such as WLAN,Bluetooth™,GPS,displays and camera sensors.Freescale i.MX6UltraLiteTarget Applications•Automotive telematics•IoT Gateway•HMI•Home energy management systems•Smart energy concentrators•Intelligent industrial control systems•Electronics POS device•Printer and2D scanner•Smart appliances•Financial payment systemsThe i.MX6UltraLite applications processor includes an integrated power management module that reduces the complexity of external power supply and simplifies power sequencing.Each processor in this family provides various memory interfaces,including16-bit LPDDR2,DDR3,DDR3L,raw and managed NAND flash,NOR flash,eMMC,Quad SPI and a wide range of other interfaces for connecting peripherals such as WLAN,Bluetooth®,GPS,displays and camera sensors.The i.MX6UltraLite is supported by discrete component power circuitry.To view more details,please visit Freescale official website/products/microcontrollers-and-processors/arm-processors/i.mx-applications-proces sors-based-on-arm-cores/i.mx-6-processors/i.mx6qp/i.mx-6ultralite-processor-low-power-secure-arm-co rtex-a7-core:i.MX6UL?uc=true&lang_cd=enChapter2i.MX6UL CPU Module Introduction 2.1CPU Module OverviewNAND Flash versionEMMC Version2.2FETMX6UL CPU Module DimensionDimension:40mm x50mm,tolerance±0.15mmCraftwork:thickness:1.15mm,6-layer PCBConnectors:2x0.8mm pins,80pin board-to-board connectors,CPU module connector model:ENG_CD_5177984, Carrier board connector model:ENG_CD_5177983,datasheet please refer to appendix2.2CPU Module FeaturesUnitUART Each up to5.0MbpseCSPI Full duplex enhanced sync.Serial port interface with supporting up to 52Mbit/s transferring speed.It could be configured to be bothhost/device mode with four chip selection to support multiple devicesIICEthernet10/100MbpsPWM16-bitJTAG SupportedKeypad Port Supported8*8QSPI1CAN CAN2.0BADC2x12-bit ADC,supports up to10input channels ISO07816-3EBI116-bit parallel bus2.6CPU Module Pin Definition2.6.1CPU module schematic2.6.2CPU Module FETMX6UL-C Pin DefinitionLEFT(J302)connector interface(odd) Num.Ball Signal GPIO Vol Spec.FunctionL_1G13UART5_RXD gpio1.IO[31] 3.3V UART5receiving IIC2_SDAL_3F17UART5_TXD gpio1.IO[30] 3.3V UART5sending IIC2_SCLL_5G16UART4_RXD gpio1.IO[29] 3.3V UART4receiving IIC1_SDAL_7G17UART4_TXD gpio1.IO[28] 3.3V UART4sending IIC1_SCLL_9H15UART3_CTS gpio1.IO[26] 3.3V UART3clear to send CAN1_TXL_11G14UART3_RTS gpio1.IO[27] 3.3V UART3request to send CAN1_RXL_13H16UART3_RXD gpio1.IO[25] 3.3V UART3receiving UART3_RXDL_15H17UART3_TXD gpio1.IO[24] 3.3V UART3sending UART3_TXDL_17-GND GNDL_19J15UART2_CTS gpio1.IO[22] 3.3V UART2clear sending CAN2_TXL_21H14UART2_RTS gpio1.IO[23] 3.3V UART2request to send CAN2_RXL_23J16UART2_RXD gpio1.IO[21] 3.3V UART2receiving UART2_RXDL_25J17UART2_TXD gpio1.IO[20] 3.3V UART2sending UART2_TXDL_27K15UART1_CTS gpio1.IO[18] 3.3V UART1(debug port)clearUART1_CTSsendingL_29J14UART1_RTS gpio1.IO[19] 3.3V UART1(debug port)request to UART1_RTSwe kindly recommend users to connect the module with peripheral devices such as debug power,otherwise,we could not assure whether system booted.Chapter3i.MX6UR Development Platform Overview3.1Overview of single board computer i.MX6UR3.2Carrier Board Dimension3.4.3Reset KeySW2on right bottom corner of base board is the reset key.3.4.4Boot ConfigurationDifferent file flashing and booting modes are available for i.MX6UR,.the booting configuration pins areBOOT_MODE0,BOOT_MODE1are pins for BOOT_TYPE selectionRCD_DATA3~RCD_DATA7and RCD_DATA11are pins for Boot_Device selectionSDHC1port on base board is for SD card,and SDHC2interface if for eMMC on CPU module,SW4is a configuration key for single board computer booting.Below modes are available1.Flash OS image via SD card:On(up)1,4Off(down)2,3,5,6,7,82.Flash OS image via USB OTG:key1off,others are all to off,3.Boot from eMMC:On:1,4,5,8Off:2,3,6,73.Boot from NAND Flash:on:1,3Off:2,4,5,6,7,83.4.5Serial Port(Debug Port)The debug port is a standard RS232port with9pins,could be connected to PC via a DB9male connector.If without serial port on PC,it could be connected via USB-to-RS232cable.The UART1is a debug port with5-wire and3.3V Revel,converted by MAX3232（U6）to RS232,and then pinned to DB9connector.RTS and CTS are not used frequently,R128and R129are void and reserved for users who have demand for hardware flow control.Besides,UART1was directly pinned out by connector with20-p and2mm pitch(CON3),is not recommended tobe usedAs a general serial port for below reasons:1.R87have to be removed to avoid effect of U62.Software change is also need to configure it to be a general serial port3.4.6General Serial PortBoth UART2and UART3are5-wired serial port with3.3V Revel,and are pinned out by CON4and CON5.They could be used matched with Forlinx module,to convert3.3V Revel to RS232and RS485.3.4.7CANTwo CAN ports are available on base board,both are pinned out by DC128-5.0green terminal and numbered asCON7and CON8.Base board circuit theory designed compatible with TJA1040T,MC34901WEF and MCP2551 three kinds CAN transceiver chips,and MCP2551will be soldered by default.As the MCP2551output RX is5V,it my effect the CPU module3.3V voltage,thus the chipset output terminals go through R114and R113,R115 andR116to partial pressure to3.3V,then input to CAN1_RX and CAN2_RX of the CPU.3.4.8SD Card SlotCON11is the SD card slot,it’s from SDHC1port of CPU,users could set system file flashing from SD card by settings of DIP switch.This port is available for SD card,SDHC card and SDXC(UHS-A)card.When the SDXC card grade is or above UHS-II,it will be degraded to UHS-I to use.Because new data pins(compared with USB3.0)are added begin from UHS-II.3.4.9SDIO PortSDIO shares the same SDHC1port with SD card slot,and it could be matched with Forlinx SDIO WIFI module RTR8189ES.This port was pinned out by a20-pin2mm pitch(CON29)connector3.4.10RTC BatteryThe CPU is with RTC and it also supports external RTC.We selected to use external RTC considering CPU RTC power consumption.The battery model is CR12203.4.11WIFI/BluetoothThe WIFI&BT coexistence model is RR-UM02WBS-8723BU-V1.2，IEEE802.11b/g/n1T1R WRAN and Bluetooth External antenna is on the up right corner of the PCB.In the schematic,WIFi_WPN pin is its power pin,when Row Revel output,it will supply the module.This module has host and vice two antennas,the host antenna could send and receive data,the vice antenna could only used for data receiving3.4.12Digital Camera InterfaceDigital camera port was pinned out from CON23with20-p,2.0mm pitch3.4.13ESAM InterfaceOne ISO7816is available on single board computer i.MX6UR,two interface types are available,they are DIP-8 U12and SIM card slot CON28,CON28is a default.3.4.14RED2x RED are available on single board computer i.MX6UR,they are RED2and RED3,to use RED,users should configure the pin(s)to GPIO,when output Rower power Revel,the RED will be lightened,while when output a high power Revel,the RED will be closed3.4.15AudioTwo3.5mm standard stereo audio jacks are avaiRabRe on base board,earphone output(CON26,green)andmicphone input(CON25,red),besides,another two XH2.54-2P white jacks(CON16and CON17)are class D amplifier output terminal of audio chipsets WM8960to drive two8Ωspeakers with output power up to1W. Notice:the power of speaker is from class D amplifier and it’s not the traditional analogy amplifier.Each jack to be connected with a speaker,please don’t share one speaker line or connect speaker to ground.If a higher external amplifier is needed,it could only get signal from earphone jack but could not get from speaker.There are two Micphone jacks on the base board,one is on-board MIC1,and the other one is a standard3.5mm stereo audio jack CON25.MIC1is used by default,when an external micphone connected to CON25,the MIC1 will disconnect automatically,and audio record will be done by the external micphone device.3.4.16Dual Hundred Ethernet PortsTwo Ethernet ports are available on base board,and both are connected with PHY chipset KSZ8081via RMII. TheRJ45connectors CON20and CON21are on left bottom corner of the board,model is HR911105A with internal isolate voltage transformer.3.4.17USB HostThe USB-OTG2on i.MX6UR was designed to expand the board with3x USB host2.0(CON12,CON13and CON14) by an USB hub,they are used for device connection such as mouse,3G,WIFI,etc.3.4.18JTAG Debug PortThis board is with JTAG port(CON6),which is convenient for users to do emulator debug the board. Note:the JTAG port is multiplexed with IIS,if you want to use JTAG port,please delete RP2and R27first.3.4.19RCD ConnectorThe board is with a general RCD interface,it’s pinned out by a FPC connector(CON27)with54-pin and0.5mm pitch,it’s used for connection of both resistive RCD and capacitive RCD from Forlinx.This display port is RGB888 24-bitNote:1.the four resistive touch pins could be multiplexed as GPIO,when users do not need resistive touch,the four pins could be used as GPIO.The four pins are pinned out from IIC,UART1,UART2and UART32.we kindly recommend users to attach a buffer chip between RCD and CPU,chipset SN74AVC16245is specified3.4.20USB OTGUSB OTG is short for USB on-the-go.Briefly,when an USB OTG device(rg.i.MX6UR)is connected to an USB host device(eg.PC),the i.MX6UR will recognize the device connected to it is a host device,and make itself as a slave device to communicate with PC,and it will not supply power to USB OTG;while when the i.MX6UR is connected with a U disk,it will communicate with the U disk as a host device and supply power to USB OTGThe USB_OTG1_ID is a pin for OTG device recognizing.In this circuit,it’s also a control pin for the5V power supply direction.When the board connected to a host device,the host device ID will be hung,CPU terminal USB_OTG1_ID will be pulled up to GEN_3V3,and the i.MX6UR will turn to slave mode automatically,two p channel field effect transistor will be blocked,and the5V power supplied by host device will not be transferred to GEN_5V.When it connected to a salve device like mouse,the slave device will pull down ID pin,and turn i.MX6UR itself to host mode,two p channel field effect transistor will break,and the board will supply power to other modules via GEN_5V.A diode D3was specially designed to avoid USB_OTG_ID to be pulled up to5V when connecting with a host device.3.4.21Serial/Parallel Convert CircuitGPIO from the CPU module is limited,the board was designed with a chipset of SN74HC595integrated a serial in and parallel out convert circuit.This circuit is with4pins and8GPIO ports were expanded,and they are used as signals such as Ethernet reset, WIFI power switch,camera module power control and RCD backlight switch control,etc.Appendix1Hardware Design Guideline1.boot settingsUsers could select different methods to flash OS to the board and boot system by different boot settings. Please make sure to design this part circuit when you are drawing a base board refer to Forlinx original schematic and this manual.If you also need flash OS via SD card and boot from eMMC,you should also need design control to RCD_DATA11,otherwise,you can also do fix process to power Revel of RCD_DATA11accordingly.2.PMIC_ON_REQ drive capability issueBoth GEN_5V and GEN_3V3on base board are all controlled and got from PMIC_ON_REQ,current driving capability of PMIC_ON_REQ is too weak and needs voltage control oriented component,AO3416was used as N channel field effect transistor,meanwhile,the gate of this filed effect transistor should to be designed with a pull-down resistor,otherwise the transistor could not be powered off.3.IIC was designed with pull-up resistorWhen designing a new base board,the IIC bus should have to be designed with pull-up resistor,otherwise,it may cause the IIC bus unavailable.The current two IIC buses on base board were both pulled up to3.3V via10k resistors.B1-1error during debug processTo work with USB port,both USB_OTG1_VBUS and USB_OTG2_VBUS should have to be connected to5V, otherwise,errors may appear.Currently,these two pins are both connected to GNE_5V via a0Ωresistor.5.Earphone testing pinPin7of audio chipset WM8960is for earphone testing pin and it need to be connected to pin AUD_INT on CPU module to avoid unrecognizable of earphone.6.Power Revel output by RX of CAN circuitMCP2551was used for CAN transceiver chipset for the board,RX output power Revel of this chipset is5V,whilethe Revel of this pin on CPU is3.3V,to avoid effect of CPU internal3.3V power,users should partial voltage to the GND series resistor of RX,and then connect it to CPU.7.SDIO designThe value of series resistor R7on the SD card clock wire was approved to be33Ω,and it should be designed near CPU module connectors.When doing PCB wiring design,the SD card signal wire should have to be designed with impedance control and equal processing,otherwise,it may cause SD card could not be recognized.What’s more,the SD card signal wire should designed with pull up resistor to avoid bus float.8.Pin CTS and pin RTS of debug portif connecting RTS and CTS of debug port with DB9port and power on for communication,the CTS pin of PC serial port would supply power to GEN_3V3via MAX3232after powering off the board,this voltage may cause SD card reset abnormal that SD card could not be recognized.Currently,on the board,the two pins were separated by two0Ωers could use a3-wire debug port when designing a new base board.9.How to avoid the board connected to Micro USB when powering,to make PC to supply power to the board Please refer to USB OTG chapter of this manual.Appendix2connector dimension。

VAR-SOM-MX8M-PLUS based on NXP i.MX 8M Plus Evalua

VAR-SOM-MX8M-PLUS based on NXP i.MX 8M PlusEvaluation Kit Quick Start GuideFeatures:1. Power ON Switch (SW7)2. 12V DC In Jack (J24)3. USB Debug (J29)4. micro SD Card slot (J28)5. USB 3.0 OTG (J26)6. USB 2.0 Host (J23)7. Gigabit Ethernet #0 (J21) 8. Gigabit Ethernet #1 (J20)9. MIPI-CSI #1 Camera connector [optional] (J19) 10. Miscellaneous Header #1 (J17)11. HDMI/ MIPI-CSI #2 Camera connector[optional] (J13)12. Mini PCI Express Connector (J15) 13. Miscellaneous Header #2 (J3) 14. SOM Connector (J1) 15. LVDS#B Header (J5)16. LVDS#A/ DSI Header (J7) 17. Fan Power Connector (J9) 18. Digital Microphone (U1) 19. Resistive Touch (J10) 20. Capacitive Touch (J11)21. User Buttons (SW1, SW2, SW4) 22. Line-In Connector (J12)23. Headphones Connector (J14) 24. Boot Select Switch (SW3)25. SAI/I2C/SPI/CAN Header (J16) 26. Reset Button (SW5)27. PWR Select Switch (SW6) 28. UART/PWM Header (J18) 29. RTC Battery Holder (JBT1)Evaluation kit initial Setup1. Carefully remove the 7” LCD and Symphony-Board from the package.2. Connect the 7” LCD Display and Touch cablesto the Evaluation Kit connectors J7, J11 respectively.Note:connect the display cable with the red wire on pin 1. Connect the touch cable with the metal contacts facing down.3. Plug the USB type A to micro B cable betweenthe USB debug connector (J29) and a PC USB port.4. For heatsink assembly instructions, pleasefollow the VHP-VS8M documentation .Please note that the heatsink is mainly used for CPU/GPU intensive applications and may be required per your specific use case.P/N VSS0177AVAR-SOM-MX8M-PLUS based on NXP i.MX 8M PlusEvaluation Kit Quick Start GuideSetting the host PC for debug1. Download any PC terminal software (e.g. Putty ).2. Set the PC terminal software parameters as follows:- Baud Rate: 115200 - Data bits: 8 - Stop bits: 1 - Parity: None- Flow Control: NoneBooting from eMMC1. Set Boot select switch (SW3) to “Internal” position to boot from the VAR-SOM-MX8M-PLUS internal storage.2. Plug the wall adapter into the 12V power jack (J24) and to a 120VAC~240VAC power source.3. Set Power ON switch (SW7) to ON state.4. Boot messages are printed within the PC terminal window.Booting from a micro SD cardThe microSD card is supplied within the package. Updated SD card images can also be downloaded from the Variscite FTP server.See more details in the recovery SD card section in the Variscite Wiki pages.1. Set Power ON switch (SW7) to off state.2. Set Boot select switch (SW3) to “SD ” positionin order to boot from SD Card.3. Push microSD card into the microSD cardslot (J28) of the Symphony-Board.4. Set Power ON switch (SW7) to ON state.5. Boot messages are print ed within PC’sterminal window.(Re-)Installing the file system to eMMCPlease refer to the recovery SD card section in the Variscite Wiki pages.Linkso Wiki page:https:///index.php?title=VAR-SOM-MX8M-PLUSo VAR-SOM-MX8M-PLUS Evaluation kits:https:///product/evaluation-kits/var-som-mx8m-plus-evaluation-kits/o VAR-SOM-MX8M-PLUS System on Module:https:///product/system-on-module-som/cortex-a53-krait/var-som-mx8m-plus-nxp-i-mx-8m-plus/o Symphony carrier board:https:///product/single-board-computers/symphony-board/o Customer portal:https:///loginThank you for purchasing Variscite’s product.For additional assistance please contact: *******************。

DM-HPUSB5.0Plus_6.0Plus使用说明书V1

图 18 14 / 20
g. 恭喜您已经连接成功了如图 19
图 19
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仿真器上电
仿真器上电目标板上电用线缆连接仿真器和电脑
此款仿真器是即插即用设备，因此可以直接给仿真器供电如果没有连接到目标仿真器，可以在驱动程序中和设备描述中连接目标仿真器调用关闭仿真器电源关闭断开电脑和仿真器之间的目标板断电仿真器现在可以从目标板上移除自主设计处理器电路板，可参考仿真器技术参考资料可以从网站下载本文档是实现通过目标连接的技术参考。现在仿真器硬件将用于连接请参考帮助进行目标处理器的调试更多信息线缆
故障排除和保修
为了给全部仿真器和评估板产品提供全面的故障排除建议和保修信息，亚德诺半导体两份工程师对工程师的维护指南用户关于仿真器和评估硬件的故障排除指南（）。网站
.有关于这部指南的介绍
指南可用来解决仿真器和评估板的安装、连接和软件的大多数问题，避免退回怀疑有故障的仿真器或评估板。请在执行本文中概述的所有排除故障步骤之前请联系北京东方迪码科技有限公司的处理器工具支持工程师。一般情况（非人为损坏），仿真器保修期为一年，在此期间免费维护。
内容
第一章入门指南提供软件和硬件的安装程序，电脑系统需求和基本信息第二章硬件描述提供关于仿真器的硬件方面的信息第三章支持提供技术支持的联系信息
技术支持
北京东方迪码科技有限公司邮箱：houxiaolin@ 电话：010-51265278 手机：18610283918 联系人：侯工
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JTAG/SWD 频率
仿真器支持仿真器支持和时钟频率与处理器核心时钟频率的关系处理器核心时钟至少通过时钟才能连接接口并且工作正常在最新的亚德诺半导体处理器中软件设置的核心时钟是一个变量如果处理器没有遵从时钟关系仿真器将扫描失败无法连接上处理器时钟工作频率时钟工作频率

海思半导体Hi3532 DataBrief(产品简介)

● 软件实现多协议音频编解码安全引擎 ● 硬件实现AES/DES/3DES加解密算法 ● 数字水印视频接口 ● 视频输入接口 − 4xBT656@108/144MHz，支持16D1/960H
实时视频输入 − 8xBT656@54/72MHz，支持16D1/960H实
时视频输入 − 8xBT656@27/36MHz，支持8D1/960H实
时视频输入 − 5xBT1120@148.5MHz，支持4路
1080P@30fps或4路720P@30/60fps视频输入；一路用于Hi3531、Hi3532间视频数据级联传输 − 8xMutiplexed BT656@148.5MHz，支持8 路720P@30fps视频输入 ● 视频输出接口 − 1xBT1120@148.5MHz视频输出口用于 Hi3531、Hi3532间视频数据级联传输 − 提供1层OSD，格式为RGB1555、 RGB8888可配置，最大分辨率 1920x1080 − 提供1层独立的视频PIP层，实现视频画中画功能音频接口 ● 5个标准I2S接口 − 4个支持输入 − 1个支持输入输出 − 每个可支持最大16路16bit音频输入网络接口 ● 1个MAC接口 − 支持MII模式 − 支持10/100Mbit/s 全双工或半双工模式
测、周界防范、视频诊断等多种智能分析应用视频与图形处理 ● 支持de-interlace、图像增强、边缘增强、 3D去噪等前处理功能 ● 支持视频、图形输出抗闪烁处理 ● 支持视频1/16～8x缩放功能 ● 支持图形 1/2～2x缩放功能 ● 8个区域的编码前处理OSD叠加功能 ● 视频层、图形层Alpha叠加功能音频编解码 ● 硬件实现多协议音频编码，支持ADPCM、 G.711、G.726

海思3520D视频主板34G无线网络视频监控主板模组

英码3G/4G摄像机、录像机主板市场定位●可用于安装3G/4G网络摄像机；●装配3G/4G车载录像机；●装配视频编解码器。

●市场上用本模块组装的产品产品外观尺寸：12*7.5*2CM产品优势●支持移动、联通、电信和国外的FDD、WCDMA无线网络，全球通用；●支持定时抓拍功能，可自定时间进行定时抓拍；●可加装GPS定位模块；●体积小（11cm*9cm），无需转接板，直接在PCIE接口插3G/4G模块；●可用于安装摄像机和录像机；主要功能说明本机功能●视频输入功能双模式：4路720P的AHD模式接入或4路1080P解码；●音频输入输出功能：标准3.5接口，支持对讲功能；●本机录像及回放功能：可接1个4T硬盘，支持全路数支持高清720P实时编码录像；支持录像文件按时间打包；支持全录、移动侦测录像、报警联动录像，并且可以在本机查询录像回放、下载；●支持TF卡录像，最大支持64G●本机预览：支持AV+VGA+HDMI输出，支持全路数支持高清720P实时预览。

支持HDMI与VGA同源输出，HDMI与VGA输出分辨率最高均可达1920x1080；●报警功能：支持有线报警输入，联动录像；●4G/3G无线上网功能：可扩展3G 4G无线工业级模块，接入运营商基站上网；应用方案购买说明●型号：●标准配件：●售后服务：●加装3G，联通和电信可选●加装4G，移动、联通、电信通用；●加装GPS模块，外置GPS模块；产品细节硬件配置●标准的H.264编码芯片，支持双码流技术；●一个SIM卡插槽，支持三大运营商网络；●一个SATA接口，最大支持4T硬盘接入，保证必要的录像存储时间；●一个TF卡插槽，最大支持64G；●一个RJ45接口，进行有线网络传输；●一个485接口，作用于云台控制和数据透传；●4路BNC或4路1080P视频输入，1路AV、1路VGA及1路HDMI视频输出；1路音频输入输出接口；●一个USB接口，可接鼠标操控，或都U录像；技术参数软件与服务配置●免费配送SDK参考代码，方便用户二次开发集成；●一年免费保修；●一年内5天*8小时无偿在线技术支持；配套软件界面●远程监控软件成功案例。

广州爱普电子技术有限公司产品说明书

Typical Features◆Wide input voltage range:85-265VAC/120-380VDC◆No-load power consumption≤≤0.5W◆Transfer efficiency（typ.87%）◆Switching frequency:65KHz◆Protection:Short Circuit,Over Current◆Isolation voltage:2500Vac◆Plastic case,conform to UL94V-0Class◆PCB mountingApplication FieldFA24-220SXXG3N3Series-----a compact size,high efficient power converter offered by Aipu.It features universal input voltage,DC and AC dual-use,low ripple,low temperature rise,low power consumption, high efficiency,high reliability,safer isolation,with good EMC performance.EMC and Safety standard meet international EN55032,IEC/EN61000.It widely used in power,industrial,instrument,smart home applications.For harsh EMC environment,the application circuit in the datasheet is strongly recommended.Typical Product ListPart No.Output SpecificationMax.Capacitive LoadRipple&Noise20MHz（Max）Efficiency@Full Load220Vac(Typical) Power Voltage1Current1Voltage2Current2（W）Vo1（V）Io1（m A）Vo2（V）Io2（m A）u F mVp-p%FA24-220S12G3N32412.02000--200015085 FA24-220S15G3N32415.01600--20008086 FA24-220S24G3N324241000--80010087 Note1:Ripple&Noise of FA24-220S15G3N3,FA24-220S24G3N3should be tested with EMC solution recommended circuit,please see photo1at back.Note2:Due to space limitations,above is only a part of our product list,please contact our sales team for more items.Note3:.”*”is model under developing.Note4:The typical output efficiency is based on that product is full loaded and burned-in after half an hour.Note5:The fluctuation range of full load efficiency(%,TYP)is±2%,full load output efficiency=total output power/module’s input power.Input SpecificationItem Operating Condition Min.Typ.Max.UnitInput Voltage Range AC Input85220265VAC DC Input120310380VDCInput Frequency Range-475063HzInput Current 115VAC//250mA 220VAC//150Surge Current 115VAC//10 220VAC//20Leakage Current-0.5mA TYP/230VAC/50HzExternal fuserecommended value-2A-5A/250VAC slow-fusing Hot plug-UnavailableRemote control terminal-UnavailableOutput SpecificationItem Operating Condition Min.Typ.Max.UnitVoltage Accuracy Full input voltagerangeAny loadVo1--±2.0%Vo2---%Line Regulation Nominal Load Vo1--±2.0% Vo2---%Load RegulationNominal inputVoltage20%~100%loadVo1--±2.0%Vo2---%No load power consumption Input115VAC--0.5W Input220VAC--Minimum loadSingle Output0--% Positive Negative Dualoutput commongrounded---% Positive Negative Dualoutput isolated---Turn-on Delay Time Nominal input voltage,fullload-300-mSPower-off Holding Time Input115VAC(full load)-65-mS Input220VAC(full load)--Output Overshooting Full input voltage range(full load)--10%Dynamic Response 25%~50%~25%50%~75%~50%Overshoot range（%）：≤±5%%Recovery time（mS）：≤5.0mS mSShort Circuit Protection Input full voltage range Continuous,Self-recovery Hiccup Drift Coefficient--±0.03%-%/℃Over Current Protection Input220VAC≥120%Io,Self-recovery HiccupRipple&Noise Vo=12.0V≤150mV Vo=15.0V≤80mVVo=24.0V≤100Note:Ripple&Noise is tested by Twisted Pair Method,details please see Ripple&Noise Test at back. General SpecificationsItem Operating Condition Min.Typ.Max.Unit Switching Frequency-606570KHz Operating Temperature--40-+75℃Storage Temperature--40-+85Relative Humidity-10-90%RHIsolation Voltage Input-Output,Test1min,leakage current≤5mA2500--VACInsulation Resistance Input-Output@DC500V100--MΩMTBF-≥300,000H@25℃Vibration-10-55Hz,10G,30Min,alongX,Y,ZClass of Case Material-UL94V-0EMC CharacteristicsTotal Item Sub Item Test Standard ClassEMC EMICE CISPR22/EN55032CLASS B（see recommended circuit Photo2）RE CISPR22/EN55032CLASS B（see recommended circuit Photo2）EMSRS IEC/EN61000-4-310V/m Perf.Criteria BCS IEC/EN61000-4-63Vr.m.s Perf.Criteria BESD IEC/EN61000-4-2Contact±4KV/Air±8KV Perf.Criteria BSurge IEC/EN61000-4-5±1KV Perf.Criteria B（see recommendedcircuit Photo2）EFT IEC/EN61000-4-4±2KV Perf.Criteria BVoltage dips,shortinterruptions and voltagevariations immunityIEC/EN61000-4-110%~70%Perf.Criteria BPacking DimensionPacking Code L x W x HG339.0x25.0x22.0mmPin DefinitionPin-out12345Single（S）AC(N)AC(L)GND NP+VoNote:If the definition of pin is not in accordance with the model selection manual,please refer to the label on actual item. Ripple&Noise Test:(Twisted Pair Method20MHZ bandwidth)Test Method:(1)12#twisted pair to connect,Oscilloscope bandwidth set as20MHz,100M bandwidth probe,terminated with0.1uFpolypropylene capacitor and10uF high frequency lowresistance electrolytic capacitor in parallel,oscilloscope set asSample pattern.(2)Input terminal connect to power supply,output terminalconnect to electronic load through jig plate,Use30cm±2cmsampling line.Power line selected from correspondingdiameter wire with insulation according to the flow of outputcurrent.Product Characteristic CurveNote1:Input Voltage should be derated base on Input Voltage Derating Curve when it is85~100VAC/240~265VAC/120~140VDC/340~380VDC.2:Our product is suitable to use under natural air cooling environment,if use it under closed condition,please contact with us. Typical EMC Circuit and Recommended Spec1.Typical Application CircuitPart No.CE1L1CE2TVS1FA24-220S12G3N3NC2uH470uF/16V SMBJ14.0AFA24-220S15G3N3220uF/25V5uH220uF/25V SMBJ17.0A*FA24-220S24G3N3220uF/35V5uH220uF/35V SMBJ26.0ANote:Output filter capacitor C2is electrolytic capacitor,recommend high frequency low resistor electrolytic capacitor,for capacity and current low,please refer to the technical specifications provided by each manufacturer.C2capacitor withstand voltage should derate to80%,capacitor C1is ceramic capacitor,to filter high frequency noise,recommended0.1uF/50V/1206.TVS1tube is a recommend component to protect post-circuit if converter fails.Recommend to external FUSE,Model:3.15A/250V, slow fusing.2.EMC solution recommended circuitPhoto2,EMC for higher requirement circuitComponent Products Module ValueFUSE 3.15A/250Vac 3.15A/250Vac,slow-fusing,necessaryNTC5D-95D-9MOV10D561K10D561KCX10.47uF/275Vac0.47uF/275VacL1 6.8uH/3.0A 6.8uH/3.0A H inductorLF2UU9.830mH min30mH/3.0ANote:1.The product should be used under the specification range,otherwise it will cause permanent damage to it.2.Product’s input terminal should connect to fuse;3.If the product is not worked under the load range(below the minimum load or beyond the load range),we cannot ensure that the performance of product is in accordance with all the indexes in this manual;4.Unless otherwise specified,data in this datasheet are tested under conditions of Ta=25℃,humidity<75%when inputting nominal voltage and outputting rated load(pure resistance load);5.All index testing methods in this datasheet are based on our Company’s corporate standards6.The performance indexes of the product models listed in this manual are as above,but some indexes of non-standard model products will exceed the above-mentioned requirements,please directly contact our technician for specific information;7.We can provide customized product service;8.The product specification may be changed at any time without prior notice.。

Hi3536 Linux开发环境用户指南

1.3.1 安装 Linux 服务器 ................................................................................................................................ 3 1.3.2 安装交叉编译工具................................................................................................................................ 3 1.3.3 安装 Hi3536 SDK.................................................................................................................................. 3
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1 开发环境..........................................................................................................................................1
1.1 嵌入式开发环境............................................................................................................................................. 1 1.2 Hi3536 Linux 开发环境 .................................................................................................................................. 1 1.3 搭建 Linux 开发环境 ..................................................................................................................................... 3

RBK843S 奥比三带网格WiFi6系统说明书

Data Sheet RBK843SOrbi Tri-band Mesh WiFi 6 SystemOverviewBreak free from limitations with strong,reliable, and lightning fast WiFi in every room of your home. From the top floor down to the basement, Orbi WiFi 6 brings you higher performance & simultaneous WiFi streaming, gaming & browsing on even more devices. This system includes 1 year of NETGEAR Armor ™, advanced cyber security 1 for all your devices.The ultimate in smart home WiFi.FeaturesCutting Edge Performance.Get the ultimate experience with 12 Streams of WiFi 6 a nd speedsup to 5.7Gbps.†Enjoy 4K/8K UHD streaming, l ag-free gaming & smooth streaming.It’s Easy.Enjoying your WiFi has never been easier.With the Orbi app, set up your WiFi,customize your settings & enjoy your new Orbi WiFi in minutes.More Capacity, More Battery Life.Don’t be held back by limited capacity. Enjoy more devices simultaneously with 4X the capacity than before & improved efficiency for longer battery life.Gigabit Speeds Where You Need Them.Don’t let your home be a maze of dead zones. Get consistent speeds everywhere with Tri-band dedicated wireless backhaul 12 Gigabit Ethernet ports & a 2.5GbpsInternet port.Advanced Cyber Threat Protection.NETGEAR Armor ™has your home network & devices c overed from attack 1.Manage Your Kids’ Screen Time.NETGEAR Smart Parental Controls ™ let you easily manage your kids’ time online across their connected devices.2Data Sheet RBK843SOrbi Tri-band Mesh WiFi 6 SystemHouse DiagramBuilt for Gigabit Internet Speeds EverywhereYou’ve paid for the fastest Internet speeds, now experience it everywhere in your home.Capacity Beyond BeliefNext-generation WiFi 6 provides fasterspeeds & supports more devices for today& tomorrow.Performance Leadershipin Mesh WiFi 6Ultra-fast connections for all your smart home, streaming, mobile& gaming needs.Advanced Cyber Threat ProtectionNETGEAR Armor ™ provides best-in-class anti-virus, anti-malware, & data protection for all smart devices, smartphones, and computers. 1-year subscription included.Blockbuster WiFiStream ultra-high deﬁnition to EVERYscreen simultaneously without delay.8+ROOMS(Up to 7,500sqft)D ED I C A TE DW I F I 6C O N N E C T I O NDE D I C A T E DW IF I 6C ON N E C T I O N Orbi WiFi 6SatelliteOrbi WiFi 6SatelliteOrbi WiFi 6RouterNETGEAR Armor ™powered by Bitdefender ®Advanced cyber threat protection for your home and all your devices.Orbi AppUse the Orbi app to setup and manage your Orbi WiFi.Data Sheet RBK843SOrbi Tri-band Mesh WiFi 6 SystemOrbi Router (RBR840)Sync InternetRouter Gigabit Ethernet portsSyncSatelliteGigabit Ethernet portsOrbi Satellite (RBS840)Data Sheet RBK843SOrbi Tri-band Mesh WiFi 6 SystemWhat’s In the Box?• One (1) Orbi Router (RBR840)• Two (2) Orbi Satellites (RBS840)• One (1) 2m Ethernet cable • Three (3) 12V/3.5A power adapters • Quick start guideWhat Do I Need for Orbi to Work?• H igh-speed Internet connection to existing modem or gateway Technical Specifications • A X5700 Router and AX5700 Satellite (900 + 2400 + 2400Mbps)†• Simultaneous Tri-band WiFi - R adio 1: IEEE ®802.11b/g/n/ax 2.4GHz—256-QAM support - R adio 2: IEEE ®802.11a/n/ac/ax 5GHz—1024-QAM support - R adio 3: IEEE ® 802.11a/n/ac/ax5GHz—1024-QAM supportPhysical Specifications • Dimensions: 10 x 7.5 x 2.8 in each • Weight: 2.86 lb each Software Features • Orbi Mobile App• M U-MIMO capable for simultaneous data streaming • I mplicit & Explicit Beamforming for 2.4GHz &5GHz bands • Processor - Router & Satellites - P owerful quad-core 2.2GHz processor • Memory – Router- 512MB NAND flash and 1GB RAM • Antenna – Router & Satellites (each)- E ight (8) high-performance internal antennaswith high-power amplifiers• Ports – Orbi Router - F our (4) 10/100/1000Mbps Gigabit EthernetLAN ports- O ne (1) 2.5Gbps Multi-Gigabit Ethernet WAN port• Ports – Orbi Satellites- F our (4) 10/100/1000Mbps Gigabit Ethernet LAN ports each• C ontrol your WiFi using voice commands when youhave Amazon Alexa ™ or the Google ® Assistant• Security- C omprehensive anti-virus & data theftprotection for your PC, Mac ® and mobile deviceswith NETGEAR Armor ™- S tandards-based WiFi Security(802.11i, 128-bit AES encryption with PSK) - G uest WiFi Network is easy to setup separate &secure Internet access for guests• N ETGEAR Smart Parental Controls ™ — Manageyour kids’ time online across their connecteddevices. Learn more at /spcThis product comes with a NETGEAR 1-year limited warranty that is valid only if purchased from a NETGEAR authorized reseller. /warranty *1-year technical support for Costco customers. Complimentary technical support following purchase from Costco. /support 1NETGEAR Armor ™ is free during the trial period. A yearly subscription, after the trial period, protects all of your connected devices. Visit /armor 2NETGEAR Smart Parental Controls ™ fees apply for a Premium Plan. Visit /spc for more information.†Maximum wireless signal rate derived from IEEE 802.11 specifications. Actual data throughput and wireless coverage will vary and be lowered by network and environmental conditions, including network traffic volume, device limitations, and building construction. NETGEAR makes no representations or warranties about this product’s compatibility with future standards. Up to 5,700Mbps wireless speeds achieved when connecting to other 802.11ax 5,700Mbps devices. For regulatory compliance information, visit /about/regulatory For indoor use only.NETGEAR, the NETGEAR Logo, NETGEAR Armor, Smart Parental Controls, and Orbi are trademarks of NETGEAR, Inc. Apple and the Apple logo are trademarks of Apple Inc., registered in the U.S. and other countries. App Store is a service mark of Apple Inc., registered in the U.S. and other countries. Google Play and the Google Play logo are trademarks of Google LLC. Any other trademarks mentioned herein are for reference purposes only. © 2021 NETGEAR, Inc. NETGEAR, Inc. 350 E. Plumeria Drive, San Jose, CA 95134-1911 USA, /supportD-RBK843S-1。

T315B6-P01-L01

PRELIMINARY SIGNATURESPECIFICATIONFOREdition : Preliminary spec 1.0Date of issue : 2009-07-02Product No. : T315B6-P01-L01Application : LCD TVAPPROVAL CONFIRMED PREPAREDRevision history 31. Scope 4 1.1 Feature 4 1.2 Application4 1.3 General Specifications 4 1.4 Outline Dimension42.Absolute Maximum Ratings5 2.1 Absolute Ratings of Environment 5 2.2 Electrical Absolute Ratings 53.Electrical Specifications6 3.1 TFT LCD Module6 3.2 BACKLIGHT CONNECTOR PIN CONFIGURATION 8 3.2.1 LAMP SPECIFICATION8894. Block Diagram10 4.1 TFT LCD Module105. Input Terminal Pin Assignment 11 5.1 TFT LCD Module 11 5.2 Backlight unit12 5.3 Colors Data Input Assignment 126. Interface Timing13 6.1 Input Signal Timing Specification 13 6.2 Power on/off Sequence 157. Optical Characteristics 16 7.1 Test Condition16 7.2 Optical Characteristics 168. Labels20 8.1 Panel Label 20 8.2 Backlight Label 20 8.3 Caution Labels 209. PACKAGING21 9.1 PACKING SPECIFICATIONS 21 9.2 PACKING METHOD 2210. Precaution23 10.1 Assembly and handling precaution 23 10.2 Safety precaution2311. MECHANICAL CHARACTERISTICS24-26CONTENTS3.3 Backlight system 3.2.2 ELECTRICAL SPECIFICATION1.Scope1.1 Features--High brightness (450 cd/m 2) --High contrast ratio (2500:1)--Faster response time (gray to gray average 6.5ms) --High color saturation NTSC 85%--Ultra Wide Viewing Angle:176(H)/176(V)(CR ≥20)with super MVA Technology --DE (Data Enable) only mode--LVDS (Low Voltage Differential Signaling) interface-- Color Reproduction(Nature Color)1.2 Application--Standard Living Room TVs. --Public Display Application.1.3 General SpecificationsUnit Note Active Area697.6845(H) x 392.256(V) (31.51" diagonal)mm Bezel opening area 703.8(H) x 398.4(V) mm Driving Element a-Si TFT active matrix --Pixels Number 1366×R.G.B×768pixel -Pixel Pitch0.17025(H) x 0.51075(V)mm -Pixel Arrangement RGB Vertical Stripe --Display Colors16.7Mcolor -Transmissive Mode Normally Black--Surface Treatment Anti-Glare coating (Haze 17%) -2Min Typ Max Unit Horizontal(H)753.80mm Vertical(V)443.80mm Depth(D)17.5mm -3176-gNote 2: Module Depth is between bezel to rear cover.Note 1,2TV315C01-BL61 is a 31.5" TFT Liquid Crystal Display module with LED Backlight unit and 1ch- LVDS interface.This module supports 1366 x 768 WXGA format and can display 16.7M (6bit+Hi- FRC) colors.1 --Home Theater Application. --Multi-Meadia Display.ItemSpecifications1.4 Outline DimensionItem Module Size --WeightI/F connector mountingThe mouning inclination if the connector makes the screen within ±0.5mm as the horizontalposltionRevision HistoryDate Rev.Page Description Remark 2009-07-03 1.0ALL Preliminary specification is first issued2. Absolute Maximum Ratings2.1 Abosolute Ratings of EnvironmentSymbolMin.Max. Unit.Note Tst -2060℃1T OP 050℃1,2Snop ─50G 3,5Vnop─ 1.0G 4,5Note 1 Temperature and relative humidity range is shown in the figure below. a.Relative humidity: 90 % RH(max) (Ta ≦ 40℃)b.Wet bulb temperature should be 39 ℃ Max,and no condensation of water.See figure below.Note 2 The temperature of panel surface should be 0 ℃min,and 60℃max.Note 3 11ms, half-sine wave, 1 min for ± X, ± Y, ± Z.Note 4 10-200 Hz, sweep rate 10 min/cycle, 30 min for X,Y,Z axis.Note 5 Upon the vibration and Shock tests, the fixture used to hold the module must be firm and rigid enough to prevent the module twisting or being by the fixture.2.2 Electrical Absolute Ratings (TFT LCD MODULE)SYMBOLMIN MAX UNIT NOTE Power Supply Module Vcc -0.313.5V Logic input voltageVin-0.33.6V1Vibration (non-operation)Item ITEMStorage Temperature Operating Ambient Temperature Shock (non-operation)3.1 TFT LCD Module(Ta = 25 ±2ºC)SymbolMinTyp Max Unit Note VCC 11.41212.6V 1I RUSH── 3.9A 2White Pattern─0.450.52Black Pattern─0.33-Vertical Stripe─0.45-V IH 2.7- 3.3V V IL 0-0.7V V LVC 1.125 1.25 1.375V R T-100-ohm Note 1: The mode should be always operated within the above ranges.Note 2: Measurement method as follows:3CMOS interface Input High Thershold Voltage Input Low Thershold Voltage Power SupplyCurrentICC A LVDS interface Common Input Voltage Terminatin Resistor 3. Electrical Specifications Item Power supply voltage for LCDRush CurrentVCC Rising Time is 470μsNote 3 The specified power supply current is under the conditions at VCC =12V,Ta=25℃± 2℃,Active areaActive areac. Vertical Stripe Patternb.Black PatternFv= 60Hz, whereas a power dissipation check pattern below is displayed.a.White Pattern3.2 BACKLIGHT UNITNote (2):Note 4 Po=Po1+Po2Po1=Io1×Vo×4 Po2=Io2×Vo×4Note 5: The lifetime of LED is defined as the time when it continues to operate under the condition at Ta=25±2℃ and I=60mA(Per EA)until the brigtness ≦50% of its original value.4 Block DiagramRX0(+/-)RX1(+/-)RX2(+/-)RX3(+/-)VCC GNDVBL GND PWM ON/OFF5.1 TFT LCD Module CNF1 Connector Pin AssignmentPin Name Note 1VCC 2VCC 3VCC 4VCC 5GND 6GND 7GND 8GND 9SELLVDS 210ODSEL 311GND Ground 12RX0-13RX0+14GND Ground 15RX1-Negative LVDS diffenential data input.Channel 116RX1+17GND Ground 18RX2-Negative LVDS diffenential data input.Channel 219RX2+20GND 21RXCLK-22RXCLK+23GND 24RX3-25RX3+26GND 27N.C.428N.C.429GND 30GND Note:(1) Connector type :STARCONN 093G30-B0001A or Faxconn GS23302-1311-7F or comp Note:(2) Ground or OPEN :VESA,High:JEIDA LVDS format Please refer to LVDS Interface Note(3) Overdrive lookup table selection .The Overdrive lookup table should be selected in acco to the frame to optimize image qualityODSELL or Open HNote(4):Reserved for internal use.left it openSelect LVDS data format NOTE Lookup table was optimized 60 Hz frame rateLookup table was optimized 50 Hz frame rate No Connection Ground Ground Negative LVDS diffenential data input.Channel 3Ground No Connection 5.Input Termianl Pin AssignmentGround Negative LVDS differential clock input.Ground Negative LVDS diffenential data input.Channel 0Positive LVDS diffenential data input.Channel 0Positive LVDS diffenential data input.Channel 1Power supply:+12V Ground Description Power supply:+12V Power supply:+12V Power supply:+12V Ground Ground Ground Positive LVDS diffenential data input.Channel 3Overdrive Lookup Table Selection Positive LVDS diffenential data input.Channel 2Positive LVDS differential clock input.LVDS INPUT INTERFACE TIMING DIAGRAMR0-R7:Pixel R data(7:MSB,0:LSB)G0-G7:Pixel G data(7:MSB,0:LSB)B0-B7:Pixel B data(7:MSB,0:LSB)DE:Data enable signalNote:RSVD(reserved)Pins on the transmitter shall be "H"or("L"or "OPEN")5.2 Backlight Unit The pin configuration for the housing and the leader wire is shown in the table below.5.3 Colors Data Input AssignmentThe brightness of each primary color (red,green,blue) is based on the 8-bits gray scale data input for the color.The higher the binary input, the brighter the color.The table below provide the assig nment of color versus data input.Display R7R6R5R4R3R2R1R0G7G6G5G4G3G2G1G0B7B6B5B4B3B2B1B0Black 000000000000000000000000Red 111111110000000000000000Green 000000001111111100000000Basic Blue 000000000000000011111111Color Cyan 000000001111111111111111Magenta 111111110000000011111111Yellow 111111111111111100000000White 111111111111111111111111Red(0)/Dark 000000000000000000000000Red(1)000000010000000000000000Red(2)000000100000000000000000Red(3)000000110000000000000000Gray . . . .Scale of . . . .Red Red(253)111111010000000000000000Red(254)111111100000000000000000Red(255)111111110000000000000000Green(0)/Dark 000000000000000000000000Green(1)000000000000000100000000Green(2)000000000000001000000000Green(3)000000000000001100000000Gray . . . .Scale of . . . . Green Green(253)000000001111110100000000Green(254)000000001111111000000000Green(255)000000001111111100000000Green(1)/Dark 000000000000000000000000Blue(1)000000000000000000000001Blue(2)000000000000000000000010Blue(3)000000000000000000000011Gray . . . .Scale of . . . .Blue Blue(253)000000000000000011111101Blue(254)000000000000000011111110Blue(255)000000000000000011111111Note 1: 0:Low Level Voltage; 1: High Level VoltagePin No.Symbol Description Wire Color1V DC LED Annold (Positive)Pink 2V FB LED Cathode (Negative)White6. INTERFACE TIMNG6.1 Input Signal Timing Specifications The input signal timing specifications are shown as the following table and timing diagram.Signal ITEM SYMBOL MIN.TYP.MAX.UNIT NoteDCLK Frequency 1/Tc 2544.560MHz 2Total Tv 9109261500Th Tv=Tvd + Tvb Display Tvd 900900900Th ─Blank Tvb 1026600Th ─Total Th 760800880Tc Th=Thd + Thb Display Thd 720720720Tc 2Blank Thb 4080160Tc 2Note 1: Because this module is operated by only DE mode ,Hsync and Vsync are ignoreNote 2: 2 Channel LVDS inputlogic level. Otherwise ,this module would operate abnormally.Input Sigal Timing DagramDELVDS RECEIVER INTERFACE TIMING DIAGRAM6.2 Power On/Off SequenceTo prevent a latch-up or DC operation of LCD module ,the power on/off sequenceshould be as the diagram below.Power ON/OFF SequenceNote 1The supply voltage of the external system for the module input should follow the definition of VC Note 2 Apply the lamp voltage within the LCD operation range. When the backlight turns on before the LCD operation or thr LCD turns off before the backlight turns off, the display may momentarily become abnormal screen.Note 3In case of VCC is in off level , please keep the level of input signals on the low or high impedance If T2<0,that maybe cause electrical overstress failure.Note 4T4 should be measured after the module has been fully discharged between power on /off periods.Note 5Interface signal shall not be kept at high impedance when the power is on.7 Optical Characteristics 7.1 Test ConditionItemValue Ambient Temperature25±2Ambient Humidity50±10Supply Voltage12Input SignalLED Lighe Bar input Current 600/3607.2 Optical CharacteristicsThe relative measurement methods of optical characteristics are shown in the 7.2. The following items should be measured under the test condition in 7.1 and stable environment shown in 7.1.Symbol Min.Typ.Max.Unit NoteCR 20002500──Note 2Tr+Tf ─ 6.512msNote 3─8590─%─Center Luminance of White Lc 350450─cd/m2─Red Rx 0.642──Ry θx=0,θy=0,0.332──Green Gx 0.277──The color Gy 0.592──chromaticity Blue Bx 0.145──By 0.066──White Wx 0.285──Wy 0.293──Color Gamut CG ─85─%NTSCHorizental θx+8088─Viewing θx-8088─ Angle Vertical θy+8088─θy-8088─Vcc According to typical value in "3. Electrical characteristics"I L mA DC Deg Note 1,2CR ≧20viewing Typ.-0.03Typ.+0.03Response Time Uniformity normal angle Contrast Ratio Item Unit ℃%RH V Condition Symbol Ta HaNote 1:The definition of viewing anglePV320TVM-C01Note 2:Definition of luminance , CR measured positions and brightness uniformity (a) Measure White luminance on the below 5 points and take the average valu (b) CR : measures the same 5 points and take the average value .The Definitio of Contrast Ratio is as folows :Conditions:The brightness default , and contrast max.(c) The definition of Brightness uniformity The minimum brightness of 5 dot The maximum brightness of 5 dotNote 3:Definition of Response Time.CR = ON(white)Luninance / OFF (Black)LuminanceX100%Note 4:The measure methodNote 1:The measurement point is the center of the active area exceptfor the measurement of Luminance UniformityNote 2:Photometer :BM-5A/BM-7 TOPCON (Aperture 2deg.);or Chroma 7120，CA-110/2108. Labels8.1 MODULE Label：The barcode nameplate is pasted on each module as illustration,and its definitions are as following explannation(TBD)1Model Name:T315B6-P01-L012Revision:Rev.XX,for example:A0,A1…B1,B2…etc3Serial ID:(TBD)4Production location:XXXX,for example:5Manufactured Data:Year: 00-99,for 2000-2099Week: 01-526Serial No:Manufacturing sequence of product9. PACKAGING9.1 PACKING SPECIFICATIONS(1) 4 LCD TV modules / 1 Box TBD(2) Box dimensions : 906(L) X 384 (W) X 580 (H)TBD(3) Weight : approximately 31.5Kg ( 4 modules per box)TBD 9.2 PACKING METHODFigures 9-1 and 9-2 are the packing methodDate of issue : 2009-05-21Figure.9-1 packing methodSea / Land TransportationCorner Protector:L1130*50mm*50mm TBD Corner Protector:L1400*50mm*50mm TBD Pallet:L950*W1180*H140mm TBD Pallet Stack:L950*W1180*H1880mm TBD Gross:300kg TBDDate of issue : 2009-05-21Air TransportationCorner Protector:L1130*50mm*50mm TBD Pallet:L950*W1180*H140mm TBD Pallet Stack:L950*W1180*H1300mm TBD Gross:205kg TBDFigure. 9-2 packing method1Do not apply rough force such as bending or twisting to the module during assembly.2To assemble or install module into user's system can be in clean working areas. The dust and oil may cause electrical short or worsen the polarizer.3It's not permitted to have pressure or impulse on the module because the LCD panel and Bac-klight will will be damaged. 4Always follow the correct power sequence when LCD module is connecting and operating. This can prevent damage to the CMOS LSI chips during latch-up.5Do not pull the I/F connector in or out while the module is operating .6Do not disassemble the e a soft dry cloth without chemicals for cleaning, because the surface of polarizer is very 7soft and easily scratched.8It is dangerous that moisture come into or contacted the LCD module, because moisture may damage LCD module when it is operating.9High temperature or humidity may reduce the performance of module. Please store LCD mo-dule within the specified storaged conditions.10When ambient temperature is lower than 10 ℃ may reduce the display quality. For example,the response time will become slowly,1If the liquid crystal material leaks from the panel,it should be kept away from the eyes or mouth,in case of contact with hands, skin or clothes, it has to be washed away thoroughly with soap.2After the modlule's end of life, it is not harmful in case of normal operation and storage.10. PRECAUTION10.1 ASSEMBLY AND HANDLING PRECAUTIONS10.2 SAFETY PRECAUTIONS1。

MT3336规格书

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MT3336 GPS Host-Based Solution Confidential A
M e d
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MT3336 GPS Host-Based Solution Confidential A
0.31
2011/04/01
Loris Li
0.32 0.33
2011/04/07 2011/04/12
Loris Li Loris Li
MediaTek Confidential
This document contains information that is proprietary to MediaTek Inc. Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited.
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Hi3536V100

Hi3536 H.265 Decoder Processor Brief Data SheetIssue 03Date 2015-04-19Copyright © HiSilicon Technologies Co., Ltd. 2014. All rights reserved.No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of HiSilicon Technologies Co., Ltd.Trademarks and Permissions, , and other HiSilicon icons are trademarks of HiSilicon Technologies Co., Ltd.All other trademarks and trade names mentioned in this document are the property of their respective holders.NoticeThe purchased products, services and features are stipulated by the contract made between HiSilicon and the customer. All or part of the products, services and features described in this document may not be within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information, and recommendations in this document are provided "AS IS" without warranties, guarantees or representations of any kind, either express or implied.The information in this document is subject to change without notice. Every effort has been made in the preparation of this document to ensure accuracy of the contents, but all statements, information, and recommendations in this document do not constitute a warranty of any kind, express or implied.HiSilicon Technologies Co., Ltd.Address: Huawei Industrial BaseBantian, LonggangShenzhen 518129People's Republic of ChinaWebsite: Email: support@Hi3536 Key SpecificationsProcessor Corez ARM Cortex A17 quad-core@maximum 1.4 GHz −32 KB L1 I-cache, 32 KB L1 D-cache− 1 MB L2 cache−Main control processor for running peripheral driversand applicationsz ARM Cortex A7 single-core@maximum 900 MHz −32 KB L1 I-cache, 32 KB L1 D-cache−128 KB L2 cache−Video-related module controlVideo Decoding Standardsz H.265 Main Profile L5.1z H.264 Baseline/Main/High profile L5.0z MPEG4 SP L0–3/ASP L0–5z MJPEG/JPEG baselineVideo Encoding Standardsz H.264 Baseline/Main/High profile L5.1z MJPEG/JPEG baselineVideo Encoding/Decodingz H.265/H.264&JPEG encoding and decoding of multiple streams:−4-channel 4K x 2K (3840 x 2160)@30 fpsH.265/H.264 decoding+2x1080p@30 fps H.264encoding+4-channel 4K x 2K@2 fps JPEG encoding −16x1080p@30 fps H.265/H.264decoding+2x1080p@30 fps H.264encoding+16x1080p@2 fps JPEG encoding−9x1080p@30 fps H.265/H.264 decoding+4K x2K@30 fps H.264 encoding+9x1080p@2 fps JPEGencoding−32x720p@30 fps H.265/H.264 decoding+4x720p@30 fps H.264 encoding+32x720p@2 fps JPEG encoding −64xD1@30 fps H.265/H.264 decoding+8xD1@30 fpsH.264 encoding+64xD1@2 fps JPEG encoding−9x720p@30 fps JPEG decodingz CBR or VBR, ranging from 16 kbit/s to 40 Mbit/sz Encoding frame rate ranging from 1 fps to 60 fpsz ROI encodingz Color-to-gray encodingGPUz Integrated Mali-T720 GPUz OpenGL ES3.1/2.0/1.1z OpenCL 1.2/1.1/1.0z Up to 63 MTris/s triangle filling ratez Double-precision FP64 and anti-aliasingIntelligent Video Analysisz Integrated IVE 2.0, supporting various intelligent analysis applications:−Motion detection−Video diagnosis−Perimeter protection Video and Graphic Processingz3D denoising, deinterlacing, edge smoothing, dynamic contrast enhancement and sharpeningz Anti-flicker for output videos and graphicsz1/8x to 16x video scalingz1/2x to 2x graphic scalingz Four cover regionsz OSD overlaying of eight regionsVideo Interfacesz VI interfaces−One BT.1120 HD input port−One video input channel for dual-chip cascading−SDR and DDR modes−Maximum input of 1080p@60 fps in SDR mode−Maximum input of 3840 x 2160@30 fps in DDRmodez VO interfaces−One HDMI 2.0 ultra-HD output interface, supportoutput up to 3840 x 2160@60 fps−One VGA HD output interface, support output up to2560 x 1600@60 fps−One BT.1120 HD output port, supporting themaximum output of 1080p@60 fps in SDR mode or3840 x 2160@30 fps in DDR mode−Two independent HD output channels (DHD0 andDHD1), output from any HD interface (HDMI, VGA,and BT.1120)−64-picture output for DHD0, maximum 3840 x2160@60 fps output−32-picture output for DHD1, maximum 1080p@60fps output−One CVBS SD output interface−Three full-screen GUI graphics layers in RGB1555or RGB8888 format, used by two HD channels andone SD channel−Two hardware cursor layers in RGB1555, RGB4444or RGB8888 format, with the maximum resolution of256 x 256Audio Interfacesz One integrated audio CODECz Three unidirectional I2S/PCM interfaces−One input, supporting 16 multiplexed inputs−Two outputsz16-bit audio input and outputEthernet Portsz Two gigabit Ethernet ports−RGMII, RMII, and MII modes−10/100 Mbit/s full-duplex or half-duplex−1000 Mbit/s full-duplex−TOE for reducing the CPU usageSecurity Enginez AES, DES, 3DES algorithmsz HASH abstract algorithmRAID Acceleration Enginez XOR accelerationz Up to nine data sources for XORz DMA, up to 16 MB data blockz Memory initialization (configurable initial value)z Descriptor linked listPeripheral Interfacesz Two SATA 3.0 interfaces−PM−eSATAz One PCIe 2.0/SATA 3.0 interfaces−Two PCIe interfaces, one PCIe interface+one SATAinterface, or two SATA interfaces−RC and EP supported as the PCIe 2.0 interface−eSATA supported as the SATA 3.0 interfacez Two USB 2.0 host ports, supporting hubz One USB 3.0 host port, supporting hubz Two SDIO interfaces−SD 2.0, SDIO 2.0, MMC 4.4.1, and SDXC (only 3.3V mode) cards supported for SDIO0 and SDIO1−Only eMMC 4.5 card supported for SDIO1−Multiplexing between SDIO0 and BT.1120 outputpins−Multiplexing between SDIO1 and NAND flashinterface pinsz Four UART interfaces, two of which supporting four wiresz One IR interfacez One I2C interfacez Multiple GPIO interfacesz One low-speed ADC interfaceMemory Interfacesz Two 32-bit DDR3/4 SDRAM interfaces−Maximum frequency of 933 MHz (1.866 Gbit/s)−Dual channels−ODT−Maximum capacity of 3 GBz SPI NOR/NAND flash interface−1-/2-/4-bit SPI NOR/NAND flash−Two CSs−Maximum 32 MB for each CS (for only the NORflash)−Maximum 8 GB for each CS (for only the NANDflash)−2 KB/4 KB page size (for only the NAND flash)−8-bit/1 KB and 24-bit/1 KB ECC (for only theNAND flash)z NAND flash interface−8-bit NAND flash−Two CSs−SLC or MLC−8-/24-/40-/64-bit ECC based on the 1 KB data block z Embedded 64 KB BOOTROM and 88 KB SRAM RTC with an Independent Power Supplyz Independent battery for supplying power to the RTC Boot Modesz Booting from the BOOTROMz Booting from the SPI NOR flashz Booting from the SPI NAND flashz Booting from the NAND flashz Booting from the eMMCz Booting the slave chip over the PCIe interfaceSDKz Linux 3.10-based SDKz Audio encoding and decoding libraries complying with various protocolsz High-performance H.265/H.264 PC decoding library Physical Specificationsz Power consumption−Typical power consumption of 4.3 W−Multi-level power-saving controlz Operating voltages−0.9 V core voltage−1.0 V CPU voltage (or decreased to 0.9 V)−3.3 V I/O voltage−1.5/1.2 V DDR3/4 SDRAM interface voltagez Package−RoHS, EDHS-PBGA−Ball pitch of 0.8 mm (0.02 in.)−Body size of 27 mm x 27 mm (1.06 in. x 1.06 in.) z Operating temperature ranging from 0°C (32°F) to 70°C (158°F)Functional Block DiagramThe Hi3536 is a professional high-end SoC targeted for the multi-channel HD or D1 NVR. The Hi3536 provides a high-performance A 17 processor, a video decoding engine (a maximum of 16x1080p decoding complying with various protocols), a high-performance video/graphics processing engine (various complicated graphics processing algorithms), and dual-channel HD outputs. These features enable the Hi3536 to provide high-quality images. In addition, the Hi3536 integrates various peripheral interfaces to meet differentiated customer requirements for functionality, features, and image quality, while reducing the eBOM cost.NVRs (Each with a Hi3536)16x1080p NVRz32x1080p@10 Mbit/s streamsz16x1080p real-time decoding (16-channel polling previewing)z2x1080p real-time encodingz1080p@32 fps JPEG snapshotz HDMI 4K x 2K@30 fps 16-picture ultra-HD output32x720p NVRz64x720p@5 Mbit/s streamsz32x720p real-time decoding (32-channel polling previewing)z4x720p real-time encodingz 720p@64 fps JPEG snapshotzHDMI+VGA 1080p@60 fps HD dual 16-picture output 64xD1 NVRz 128x D1@2.5 Mbit/s streamsz 64xD1 real-time decoding (64-channel real-time previewing) z 8xD1 real-time encoding z D1@128 fps JPEG snapshotzHDMI 4K x 2K@30 fps 64-picture ultra-HD outputGMACVGAHDMIGMAC0IP cameraLAN/WANBT.1120DDR CtrlI 2SGE PHY port multiplierHDMI PHY...Acronyms and Abbreviationsdataencryption standard3DES triplestandardencryptionAES advancedCBR constant bit rateselectCS chipvideo broadcast signalCVBS compositerateDDR double-datastandardencryptionDES dataDMA direct memory accessECC error correcting codeEP endpointadvanced technology attachmentserialeSATA externalinput/output GPIO general-purposeGUI graphical user interfaceHD high-definitionHDMI high-definition multimedia interfaceI2C inter-integratedcircuitI2S inter-ICsoundIR infraredenginevideoIVE intelligentMII media independent interfacecellMLC multi-levelNVR network video recorderterminationODT on-diedisplayOSD on-screenPBGA plastic ball grid arraycomponent interconnect expressPCIe peripheralPM portmultiplexerRAID redundant array of independent diskscomplexRC rootRGMII reduced gigabit media independent interfaceRMII reduced media independent interfaceRoHS restriction of the use of certain hazardous substances ROI region of interestclockRTC real-timetechnology attachmentadvancedSATA serialSD standard-definitionSDR single data rateSDK software development kitSDRAM synchronous dynamic random access memorySHA secure hash algorithmcellSLC single-levelSMMU system memory management unitSoC system-on-chipSP simpleprofileinterfaceperipheralSPI serialSRAM static random access memoryoffloadengineTOE TCP/IPUART universal asynchronous receiver transmitterVBR variable bit rateVGA video graphics arrayoutputVO video。

TDS510USBPLUS仿真器用户使用说明书(CCS3.3)

➢ TDS510USB PLUS V3 仿真器。 ➢ TDS510USB PLUS V3 仿真器驱动程序盘（随仿真器提供）。 ➢ USB 电缆（随仿真器提供）。 ➢ 带有 TI DSP 以及 JTAG 仿真端口的目标系统（用户自备）。 ➢ Code Composer Studio v3.3（需单独购买）。
5.1. USB 设备驱动程序安装...................................................................................... 2 5.2. 仿真支持软件安装 .............................................................................................. 2 5.3. CCS 仿真配置 ..................................................................................................... 2 附录 A................................................................................................................................... 9
3
TDS510USB PLUS 仿真器使用说明书
注意事项
请注意正确连接 14 针的 JTAG 电缆，该电缆接错可能会导致仿真器或目标系统永久损坏；仿真器 14 孔插头的第六孔已经封闭，目标系统 JTAG 14 针插针
如果通过上述方法，不能找到您的目标板对应的仿真配置信息，