Side_By_Side2_lesson03
整理版Lesson3(冀教版八年级英语上册)ppt课件
02
题目示例
Read the following passage and fill in the blanks with the correct
words.
03
题目解析
这种题型有助于提高学生的词汇量和语法水平，同时也能培养他们的阅
读理解和组织语言的能力。通过填写空白，学生可以更好地掌握词汇的
拼写和用法。
Course content
Lesson 4
This lesson is designed to develop critical thinking skills. It includes analytical exercises, debates, and other activities that encourage students to think critically about different topics.
02 Vocabulary learning
New vocabulary
Word list
Synonyms and antonyms
Compile a list of new vocabulary words for the lesson, including definitions and examples.
To introduce students to different cultures and help them understand global perspectives.
Critical Thinking
To develop students' analytical and critical thinking skills in English.
Side by side 3 Chapter 3
什么？ B. 我打算送我女儿去幼儿园。 A. 你女儿真可爱! B. 谢谢！地球人都知道！ A. 哦，得了吧！顺便问一下， 明年你打算做什么？ B. 我打算在家照顾我的女儿和 三个儿子。 A. 哦！太棒了！你真是个好丈 夫，好父亲！ B. 谢谢！我知道！
A. 告诉我, Obama总统, 明天你
打算做什么？ B. 我打算去超市。 A.你打算买什么？ B. 我打算买一条面包。 A. 哦，得了吧！顺便问一下， 今天下午你打算做什么？ B. 我打算和我妻子去划水。 A. 不幸的是，现在太晚了！ B. 好吧，我不得不回家做晚饭 了。
Yes, it will. It’ll begin at 7:30. Rule: Will does not contract with subject pronouns in short answers.
Examples: Will Ms. Martinez return soon?
Yes, she will. (She’ll return in a little while.)
banjo班卓琴
Broadway show tunes are songs from musical productions that have been performed in theaters in the Broadway area of New York City.
European adj.
Yes,________ will.
No, ________ won’t.(____’ll______.) Will we finish our class at 12 o’clock? Will class start at 9 o’clock tomorrow? Will you come to school next Sunday?
_Lesson_03_Social_Responsibility_and_Management_Ethics
Values-Based Management
Values-Based Management 价值观管理
An approach to managing in which managers establish and uphold an organization’s shared values.
Organization’s values
企业道德就是用规则与原理来判断行为 是否合乎道德的
14
Managerial Ethics… (cont’d)
The utilitarian view 道德的功利观 The rights view 道德的权利观 The theory of justice view 道德公正理论观
15
Managerial Ethics… (cont’d)
9
How Organizations Go Green
Legal (of Light Green) Approach Market Approach 市场方法 利益相关者方法 法律方法
Do what is legally required by obeying laws, rules, and regulations willingly and without legal challenge Respond to the preferences of their customers for environmentally friendly products
Guide managers’ decisions and actions 指导管理者的决策和行动 Shape employee behavior 塑造雇工行为 Influence marketing efforts 影响营销效果 Build team spirits 建立团队精神
side by side第二册 unit10课件
目录
• 单元介绍 • 词汇学习 • 语法讲解 • 听力训练 • 阅读理解 • 口语训练 • 写作训练
01 单元介绍
单元目标
01
掌握与职业相关的词汇 和表达。
02
了解不同职业的特点和 要求。
03
提高对职业规划和就业 市场的认识。
04
培养跨文化交际能力， 了解不同国家的职业文 化。
学习如何运用生动的语言描述季节特点 学习如何描绘动物习性和特点
写作练习
根据所给的主题，选择一个你熟悉的 人，写一篇描述他的短文，注意运用 细节描写来刻画人物形象。
想象你有一个动物朋友，写一篇关于 它的短文，描绘它的习性和特点。
选择一个你喜欢的季节，写一篇关于 它的短文，尽量运用生动的语言来描 述季节的特点。
02 词汇学习
新词汇
单词
apple, banana, orange, peach, pear, watermelon
短语
a piece of cake, a walk in the park
词汇练习
填空
将所学的单词或短语填入句子中 。
选择
从所给的选项中选择正确的单词或 短语。
匹配
将单词与正确的图片或定义匹配。
情态动词
介绍can、may、must等 情态动词的用法和意义， 以及它们在句子中的位置 。
语法练习
选择题
改错题
提供多个选择题，让学生选择正确的 语法形式或表达方式。
给出包含语法错误的句子，要求学生 找出错误并改正。
填空题
给出不完整的句子，要求学生填写正 确的语法形式或单词。
语法应用
造句
新概念英语第二册第3课课文详解
新概念英语第二册第3课课文详解In Lesson 3 of New Concept English Book Two, the main focus is on introducing the past continuous tense. The text describes a scene where Mr. Brown -- who is a teacher -- is talking about his student, Bob. We see that Bob is a young student who is not very focused on his studies, as he is often found staring out of the window during class. Mr. Brown is concerned about Bob's lack of focus and decides to have a talk with him.在新概念英语第二册第3课中，主要介绍了过去进行时态。
课文描述了一个场景，布朗老师谈到了他的学生鲍勃。
我们可以看到，鲍勃是一个年轻的学生，对学习不够专注，经常在课堂上盯着窗外发呆。
布朗老师对鲍勃缺乏注意力表示担忧，并决定和他谈谈。
The past continuous tense is a verb form that indicates an ongoing action in the past. In this lesson, the sentences are constructed in a way that helps learners understand how to form and use the past continuous tense correctly. By providing examples of sentences like "I was walking to the bus stop when it starting raining," the texthelps students see the difference between simple past and past continuous tenses.过去进行时是一个动词形式，表示过去正在发生的动作。
学术英语Unit 6 课后练习答案 ppt课件
2. … this family was in the know and could afford expensive Western brands. (Line 3, Para.10)
This family is familiar with the high-grade and expensive Western brands and could pay for it.
Unit 6 Consumer Behavior
Text A
Language building-up
Collocations
3. in the know 知内情的
I have got to find someone in the know, so I can get my business off the ground (=to succeed initially).
学术英语Unit 6 课后练习答案
Unit 6 Consumer Behavior
Text A
Critical reading and thinking
Language Support
1. Others are focused on… prepare for the week. (Line 4, Para.3)
line4para18含有大量漂白剂的洗衣粉可以为一味追求洁净的市场提供超白的衣物但是对于一个有环保意识或者饮用水匮乏的市场来说这恐怕是一场大灾难
学术英语 管理
Consumer Behavior
学术英语Unit 6 课后练习答案
Unit 6 Consumer Behavior
• Text A
Consumer Behavior Influencers
朗文国际英语教程2(side by side2)Gazette3 SBS2 Gazette3
The Spring Festival
People in northern China will eat jiaozi, or dumplings, for breakfast, as they think "jiaozi" in sound means ―saying goodbye to the old and welcoming the new".
Review
•Special adj./adv.
adj./adv. Comparative Superlative
good/well bad/ill many/much little old
better worse more less older elder
best worst most least oldest eldest
Review
Error correction
1. Lesson 9 is more easier than Lesson 10. 2. My mother is younger than your. 3. He is one of longest boys in his class. 4. The boy doesn’t draw much well.
Review
1.—Which is____ season in Beijing?
—I think it's autumn.
A. good B. better C. the best 2. Tian’anmen Square is one of ___squares in the world. rge rger C.the largest
The Spring Festival
新概念英语第二册第三课(包含课文及完整课后练习)
Lesson 3 Please send me a card 请给我寄一张明信片First listen and then answer the question.听录音，然后回答以下问题。
How many cards did the writer send?Postcards always spoil my holidays. Last summer, I went to Italy. I visited museums and sat in public gardens. A friendly waiter taught me a few words of Italian. Then he lent me a book. I read a few lines, but I did not understand a word. Everyday I thought about postcards. My holidays passed quickly, but I did not send cards to my friends. On the last day I made a big decision. I got up early and bought thirty-seven cards.I spent the whole day in my room, but I did not write a single card!New words and expressions 生词和短语send v. 寄，送friendly adj. 友好的postcard n. 明信片waiter n. 服务员，招待员spoil v. 使索然无味，损坏lend v. 借给museum n. 博物馆decision n. 决定public adj. 公共的single adj. 唯一的，单一的whole adj. 整个的Note on the text 课文注释1 a few words,几句话。
side by side 3 (Mingwei Li)
… in wonderland Spring break, fall break, Thanks Giving day what to do in the foreign airport? Check in luggage Waiting for boarding
Fasten the seat belt
+
GRAMMAR
3. be + -ing (现在进行体） 这一结构的主要意义是表示按计划，安排即将发生的动作，常用 于表示位置转移的动词，如come，leave，start，arrive等，也 可用于其他动态动词。 We’re leaving on Friday. The president is coming to the UN this week.
+
Side by side chapter 3
Main talker: Annabelle Lee Date: 07/16/2014
+
Warm up
Check
your homework (new words and recitations)
Writing
assignment ( what’s your attitude towards western culture? 200 words)
To a sleep without dreams
Were it not for your songs. by Langston Hughes
+
Close reading 2
Equality
and Greatness
Key words Distinction 区别，差别 Merit 功绩，荣誉，价值 Eminence 卓越
朗文国际英语教程2(side by side2)Gazette2 SBS2 Gazette2
Burj Dubai....900 meters high
To be finally completed 2008
The world's tallest building.
The biggest mickey collection. America's Janet has 2,760 mickey toys.
The world's largest coffee the world's largest coffee's capacity is 9,130 litres, can fill 32,160 small cups.
The world's biggest excavator（挖掘机） It is built by KRUPP of Germany. ( It's 45,500 tons,95 meters high and 215 meters long.)
The world's largest flag
Israel's teddy stadium exhibited a national flag and its area reaches 44,404 square meters.
The world's highest statue Christ the redeemer statue in Brazil
The world's widest mouth. Francisco . The mouth with 17 cm wide, almost the length of a person's hand.
The world's largest shoes ( for 5.5 meters long , 2.1 meters wide and 2.9 meters high.) On November 17, 2010 in Amsterdam this shoe first met us.
Side-By-Side朗文国际英语教程练习册2
Side By Side朗文国际英语教程练习册2Listen and Choose the Correct Response:1. What do your friends like to do on the weekend?2. What does your sister like to do on the weekend?3. What does your brother like to do on the weekend?4. What do you and your friends like to do on the weekend?5. What does your son like to do on the weekend?6. What do you like to do on the weekend?7. What does your next door neighbor like to do on the weekend?8. What does your cousin Zoom like to do on the weekend?Grammar Ra p: I don’t like to rushI don’t like to rush, do you? I don’t like to hurry. I don’t like to get up sad.I don’t like to worry.I am not going to rush, are you? I am not going to hurry. I am not going to get up sad. I am not going to worry.Grammar Ra p: He doesn’t like to watch TVHe doesn’t like to watch TV. He doesn’t like to dance. He doesn’t like to cook or sow or wash or ironing his pants. She doesn’t like to go to the beach. She doesn’t like to shop.C. Listen and choose the correct response1.Where's the tea?2.Where are the oranges?3.Where's the fish?4.Where are the cookies?5.Where's the cake?6.Where's the rice?7.Where are the pears?8.Where's the cheese?F. Listen and put a check under the correct picture.1.Let's have some pizza!2.Where are the eggs?3.Let's make some fresh orange juice!4.Let's bake a pie!5.Where are the potatoes?6.Let's have asandwich for lunch!I Listen. Then clap and practice.A. How much salt should I put in the soup?B. Just a little, not too much.A. How many onions should I put in the salad?B. Just a few, not too many.A. How nuch pepper should I put in the stew?B. Just a little, not too much.A. How many eggs should I put in the omelet?B. Just a few, not too many.A. How nuch sugar should I put in the tea?B. Just a little, not too much.ALL. Salt in the soup,Pepper in the stew,Eggs in the omelet,Just a few.Just a little, not too much.Not too many, just a few.Just a few, not too many.Not too many, just one or two.P19.LListen and put a check under the correct picture.1.A. Would you care for some more?B. Yes, please. But not too much.2. A. Do you like them?B. Yes,but my doctor says that too many are bad for my health.3. A. These are wonderful !B. I'm glad you like them. I bought them this morning.4. A. How much did you eat ?B. I ate too much!5. A. I bought it this morning, and it's very good.Would you like a little?B. Yes, please.6. A. I really don't like them.B. But they're good for you!7. A. How do you like them?B. They're wonderful.8. A. Would you care for some more?B. Yes, please. But not too much.9. A. Hmm. This is delicious. Would you care for some more?B. Yes, please. But just a little.10. A. This is delicious!B. I'm glad you like it . I made it this morning.M. Listen. Then clap and practice.All. Not too much, just a littleNot too many, just a fewNot too much, just a littleNot too many, just a fewA. Would you like more chicken?B. Just a littleA. Would you like more carrots?B. Just a fewA. Would you like more gravy?B. Just a littleA. Would you like more salad?B. Just a littleA. Would you like more tomatoes?B. Just a fewA. Would you like more coffee?B. Just a littleA. Would you like more cookies?B. Just a fewAll. Not too much, just a littleNot too many, just a fewNot too much, just a littleNot too many, just a few（注：可编辑下载，若有不当之处，请指正，谢谢!）。
基坑规范英文版
基坑规范英文版篇一：行业标准中英对照44项工程建设标准（英文版）目录123篇二：地下室设计深基坑中英文对照外文翻译文献中英文对照外文翻译(文档含英文原文和中文翻译)Deep ExcavationsABSTRACT ：All major topics in the design of in-situ retaining systems for deep excavations in urban areas are outlined. Type of wall, water related problems and water pressures, lateral earth pressures, type of support, solution to earth retaining walls, types of failure, internal and external stability problems.KEYWORDS: deep excavation; retaining wall; earth pressure;INTRODUCTIONNumbers of deep excavation pits in city centers are increasing every year. Buildings, streets surroundingexcavation locations and design of very deep basements make excavations formidable projects. This chapter has been organized in such a way that subjects related to deep excavation projects are summarized in several sections in the order of design routine. These are types of in-situ walls, water pressures and water related problems. Earth pressures in cohesionless and cohesive soils are presented in two different categories. Ground anchors, struts and nails as supporting elements are explained. Anchors are given more emphasis pared to others due to widespread use observed in the recent years. Stability of retaining systems are discussed as internal and external stability. Solution of walls for shears, moments, displacements and support reactions under earth and water pressures are obtained making use of different methods of analysis. A pile wall supported by anchors is solved by three methods and the results are pared. Type of wall failures, observed wall movements and instrumentation of deep excavation projects are summarized.1. TYPES OF EARTH RETAINING WALLS1.1 IntroductionMore than several types of in-situ walls are used to support excavations. The criteria for the selection of type of wall are size of excavation, ground conditions, groundwater level, vertical and horizontal displacements of adjacent ground and limitations of various structures, availability of construction, cost,speed of work and others. One of the main decisions is the water-tightness of wall. The following types ofin-situ walls will be summarized below;1. Braced walls, soldier pile and lagging walls2. Sheet-piling or sheet pile walls3. Pile walls (contiguous, secant)4. Diaphragm walls or slurry trench walls5. Reinforced concrete (cast-in-situ or prefabricated) retaining walls6. Soil nail walls7. Cofferdams8. Jet-grout and deep mixed walls9. Top-down construction10. Partial excavation or island method1.1.1 Braced WallsExcavation proceeds step by step after placement of soldier piles or so called king posts around the excavation at about 2 to 3 m intervals. These may be steel H, I or WF sections. Rail sections and timber are also used. At each level horizontal waling beams and supporting elements (struts, anchors,nails) are constructed. Soldier piles are driven or monly placed in bored holes in urban areas, and timberlagging is placed between soldier piles during the excavation. Various details of placement of lagging are available, however(来自: 小龙文档网:基坑规范英文版), precast units, in-situ concrete or shotcrete may also be used as alternative to timber. Depending on ground conditions no lagging may be provided in relatively shallow pits.Historically braced walls are strut supported. They had been used extensively before the ground anchor technology was developed in 1970?s. Soils with some cohesion and without water table are usually suitable for this type of construction or dewatering is acpanied if required and allowed. Strut support is monly preferred in narrow excavations for pipe laying or similar works but also used in deep and large excavations (See Fig 1.1). Ground anchor support is increasingly used and preferred due to access for construction works and machinery. Waling beams may be used or anchors may be placed directly on soldierpiles without any beams.1.1.2 Sheet-piling or Sheet Pile WallsSheet pile is a thin steel section (7-30 mm thick)400-500 mm wide. It is manufactured in different lengths and shapes like U, Z and straight line sections (Fig. 1.2). There are interlocking watertight grooves at the sides, and they are driven into soil by hammering or vibrating. Their use is often restricted in urbanized areas due to environmental problems likenoise and vibrations. New generation hammers generate minimum vibration anddisturbance, and static pushing of sections have been recently possible. In soft ground several sections may be driven using a template. The end product is a watertight steel wall in soil. One side (inner) of wall is excavated step by step and support is given by struts or anchor. Waling beams (walers) are frequently used. They are usually constructed in water bearing soils.Steel sheet piles are the most mon but sometimes reinforced concrete precast sheet pile sections are preferred in soft soils if driving difficulties are not expected. Steel piles may also encounter driving difficulties in very dense, stiff soils or in soils with boulders. Jetting may be acpanied during the process to ease penetration. Steel sheet pile sections used in such difficult driving conditions are selected according to the driving resistance rather than the design moments in the project. Another frequently faced problem is the flaws in interlocking during driving which result in leakages under water table. Sheet pile walls are monly used for temporary purposes but permanent cases are also abundant. In temporary works sections are extracted after their service is over, and they are reused after maintenance. This process may not be suitable in dense urban environment.1.1.3 Pile WallsIn-situ pile retaining walls are very popular due to their availability and practicability. There are different types of pile walls (Fig. 1.3). In contiguous (intermittent) bored pile construction, spacing between the piles is greater篇三：基坑开挖换填施工方案英文版Sokoto Cement Factory Project of the 17 Bureau, Chinese Railway ConstructionCompanythConstruction Schemes for Foundation pit ExcavationAnd ReplacementComposed by：Editor：Chief editor：Fifth division of 17th Bureau of CRCC, manager department of theSokoto Cement Factory Project, Nigeria23th November 2104Contents1Introduction ......................................... ...................................................... ............................. １1.1 Basis for theposition ............................................. ............................................... １1.2 Principles for theposition ............................................. ........................................ １2.1Location ............................................. ...................................................... .................... １2.2 Geographicreport ............................................... ...................................................... ... ２2.3 Ground water and undergroundwater. ............................................... ......................... ２ Construction techniques andmethods .............................................. ...................................... ２3.1 Excavation of the foundationpit .................................................. ................................ ２3.1.13.1.23.1.33.1.43.1.53.1.63.23.2.13.2.23.2.33.2.44 Gradient of the foundationpit .................................................. ......................... ３ The stability of the side slope ................................................ ............................ ３ The form ofexcavation ........................................... .......................................... ４Preparation for theexcavation ........................................... ................................ ５ Construction procedures ........................................... ......................................... ６Methods .............................................. ...................................................... ......... ６ Constructionmaterial ............................................. ........................................... ７Constructionpreparation .......................................... ......................................... ８Techniques and constructionalprocedure. ........................................... ............. ８Methods .............................................. ...................................................... ......... ９ 3 Gravelreplacement .......................................... ...................................................... ...... ７ Organization of construction and logistic work ................................................. ................ １１4.1 The managing system for construction organization. ........................................ ...... １１4.2 Human resources for theconstruction ......................................... ............................ １１4.3 Logisticwork ................................................. ...................................................... .... １２4.4 Technicalguarantee ............................................ ..................................................... １２4.5 Quality and techniques standard andregulation ........................................... ........... １２4.5.14.5.24.5.34.5.44.64.6.14.6.24.6.34.74.8 Qualitystandard ............................................. ............................................... １２Quality monitoringorganization ......................................... .......................... １３ Raising awareness for the importance of quality and professional skills. .... １３ Establishing quality managementcode. ................................................ ........ １３ Safety regulations for mechanical construction ......................................... ... １４ Trafficregulations ......................................................................................... １５Safety regulations for fillingconstruction. ........................................ ............ １５ Safety techniquesmeasures ............................................. ........................................ １４Environment protectionmeasures ............................................. .............................. １６ Construction during the rainseason ............................................... ......................... １６4.8.14.8.2 Collecting weatherdata ................................................. ................................ １６ Technical measures fordrainage ............................................. ...................... １６4.9 Technical measures for sandstorm ................................................ .......................... １７4.10 Contingencyplan ................................................. .................................................... １７Construction Schemes for Foundation pitExcavation And Replacement1 Introduction1.1 Basis for the position1.1.1 1.1.21.1.3 Drawings submitted by the Owner (GB50300-2001）。
教材side by side朗文国际英语教程
教材side by side朗文国际英
语教程
1. 图文并茂，有助于进行图文联想
学生用书整本都是彩页，图片繁多而清晰，图片与单词，句子，甚至段落之间对应关系强，非常适合盖上文字，看图做口语练习。
整本书就好像一本易于理解的绘本，有利于产生图文联想。
2. 语法与口语相结合，实用价值高
交际是学习语言的根本目的，语法包括时态语态词性、词汇发音等是语言的根本，此套教材用词地道简洁，朗朗上口，将两者有机结合，既能让学生自如表达，又能满足应试中中高考的语法、词汇量、阅读能力、听力能力的要求，也同时要求授课老师备课时做好听说读写的全面训练准备。
3. 课程设计由易到难，每个单元的内容都很丰富，提高学习积极性
以第一册的第一单元为例
•首先有单词的预习环节
•其次设计了小组问答环节
•然后是角色扮演环节
•接下来是阅读、听力和练习环节
•最后是发音和章节总结环节
短短一个单元有这么多环节，丰富有趣的活动提高孩子学习积极性，帮助孩子记忆语法点。
4. 配套资源齐全，适合练习
教材配有练习册和音频，地道的美音清晰易模仿，每课结尾处的PRONUNCIATION，涵盖了升降调，重度，连读，弱读等发音基础知识。
而练习册中的grammarRAP，则把重点语法串起来，编成RAP跟读，体会语言的节奏感，这些是学校课本没有涉及的，对中级以后提高口语速度及自然度，甚至听力，都是至关重要的。
美国一位语言教授，曾编写过Jazz Chants系列口语书，也是以此方法帮助非母语类英语学习。
5. 利用阅读材料提高阅读能力的同时巩固语法。
PCI_Express_Mini_CEM_12_26Oct07_cb
PCI Express®Mini Card ElectromechanicalSpecificationRevision 1.21March 28October 26, 20075Revision RevisionHistory Daterelease. 6/02/031.0 Initial1.1 Incorporated approved Errata and ECNs. 3/28/051.2 Incorporated approved ECNs. 10/26/2007PCI-SIG disclaims all warranties and liability for the use of this document and the information contained herein and assumes no responsibility for any errors that may appear in this document, nor does the PCI-SIG make a commitment to update the information contained herein.Contact the PCI-SIG office to obtain the latest revision of the specification.Membership ServicesE-mail: administration@Phone: 503-619-0569Fax: 503-644-6708Technical Supporttechsupp@DISCLAIMERThis PCI Express Mini Card Electromechanical Specification is provided "as is" with nowarranties whatsoever, including any warranty of merchantability, noninfringement, fitnessfor any particular purpose, or any warranty otherwise arising out of any proposal,specification, or sample. PCI-SIG disclaims all liability for infringement of proprietaryrights, relating to use of information in this specification. No license, express or implied, byestoppel or otherwise, to any intellectual property rights is granted herein.PCI, PCI Express, PCIe, and PCI-SIG are trademarks or registered trademarks of PCI-SIG.All other product names are trademarks, registered trademarks, or service marks of their respective owners.Copyright © 2003, 2005,-05 2007 PCI-SIG2Contents1. INTRODUCTION (7)1.1. O VERVIEW (7)1.2. S PECIFICATION R EFERENCES (9)1.3. T ARGETED A PPLICATIONS (9)1.4. F EATURES AND B ENEFITS (10)2. MECHANICAL SPECIFICATION (11)2.1. O VERVIEW (11)2.2. C ARD S PECIFICATIONS (11)2.2.1.Card Form Factor (12)2.2.2.Card and Socket Types (13)2.2.3.Card PCB Details (14)2.3. S YSTEM C ONNECTOR S PECIFICATIONS (23)2.3.1.System Connector (23)2.3.2.System Connector Parametric Specifications (27)C ONNECTOR A REA (28)2.4. I/O2.5. R ECOMMENDED S OCKET C ONFIGURATIONS (29)2.5.1.Single Use Full-Mini and Half-Mini Sockets (29)2.5.2.Dual-Use Sockets (32)2.5.3.Dual Head-to-Head Sockets (35)2.5.4.Side-by-Side Socket Spacing (37)2.6. T HERMAL G UIDELINES (38)2.6.1.Thermal Design Definitions (38)2.6.2.Thermal Guidelines for PCI Express Mini Card Add-in Card Designers (39)2.6.2.1. Implementation Considerations (40)2.6.3.Thermal Guidelines for Integrating Wireless Wide Area Network Mini Card Add-inCards (41)3. ELECTRICAL SPECIFICATIONS (45)3.1. O VERVIEW (45)3.2. S YSTEM I NTERFACE S IGNALS (45)3.2.1.Power Sources and Grounds (47)3.2.2.PCI Express Interface (47)B Interface (48)3.2.4.Auxiliary Signals (48)3.2.4.1. Reference Clock (48)3.2.4.2. CLKREQ# Signal (48)3.2.4.3. PERST# Signal (52)3.2.4.4. WAKE# Signal (52)3.2.4.5. SMBus (52)munications Specific Signals (53)3.2.5.1. Status Indicators (53)3.2.5.2. W_DISABLE# Signal (54)3er Identity Module (UIM) Interface (55)3.2.6.1. UIM_PWR (55)3.2.6.2. UIM_RESET (56)3.2.6.3. UIM_CLK (56)3.2.6.4. UIM_VPP (56)3.2.6.5. UIM_DATA (56)3.3. C ONNECTOR P IN-OUT D EFINITIONS (57)3.3.1.Grounds (58)3.3.2.Coexistence Pins (58)3.3.3.Reserved Pins (58)3.4. E LECTRICAL R EQUIREMENTS (58)3.4.1.Logic Signal Requirements (58)3.4.2.Digital Interfaces (59)3.4.3.Power (62)3.5. C ARD E NUMERATION (62)A. SUPPLEMENTAL GUIDELINES FOR PCI EXPRESS MINI CARD CONNECTORTESTING (63)A.1. T EST B OARDS A SSEMBLY (63)A.1.1.Base Board Assembly (64)A.1.2.Plug-in Cards Assembly (65)A.2. I NSERTION L OSS M EASUREMENT (66)A.3. R ETURN L OSS M EASUREMENT (66)A.4. N EAR E ND C ROSSTALK M EASUREMENT (66)B. I/O CONNECTOR GUIDELINES (69)B.1. W IRE-LINE M ODEMS (69)B.2. IEEE 802.3 W IRED E THERNET (69)W IRELESS E THERNET (69)B.3. IEEE802.114FiguresF IGURE 1-1: PCI E XPRESS M INI C ARD A DD-IN C ARD I NSTALLED IN A M OBILE P LATFORM (8)F IGURE 1-2: L OGICAL R EPRESENTATION OF THE PCI E XPRESS M INI C ARD S PECIFICATION (8)F IGURE 2-1: F ULL-M INI C ARD F ORM F ACTOR (M ODEM E XAMPLE A PPLICATION S HOWN) (12)F IGURE 2-2: H ALF-M INI C ARD F ORM F ACTOR (W IRELESS E XAMPLE A PPLICATION S HOWN) (13)F IGURE 2-3: F ULL-M INI C ARD T OP AND B OTTOM (15)F IGURE 2-4: H ALF-M INI C ARD T OP AND B OTTOM (16)F IGURE 2-5: C ARD T OP AND B OTTOM D ETAILS A AND B (17)F IGURE 2-6: C ARD E DGE (19)F IGURE 2-7: C ARD C OMPONENT K EEP O UT A REAS FOR F ULL-M INI C ARDS (21)F IGURE 2-8: C ARD C OMPONENT K EEP O UT A REAS FOR H ALF-M INI C ARDS (22)F IGURE 2-9: PCI E XPRESS M INI C ARD S YSTEM C ONNECTOR (23)F IGURE 2-13: I/O C ONNECTOR L OCATION A REAS (29)F IGURE 2-14: R ECOMMENDED S YSTEM B OARD L AYOUT FOR F ULL-M INI-O NLY S OCKET (30)F IGURE 2-15: R ECOMMENDED S YSTEM B OARD L AYOUT FOR H ALF-M INI-O NLY S OCKET (31)F IGURE 2-16: R ECOMMENDED S YSTEM B OARD L AYOUT (D ETAIL D) (32)F IGURE 2-17: D UAL-U SE S OCKET (33)F IGURE 2-18: R ECOMMENDED S YSTEM B OARD L AYOUT FOR D UAL-U SE S OCKET (34)F IGURE 2-19: D UAL H EAD-TO-H EAD S OCKET (36)F IGURE 2-20: R ECOMMENDED S YSTEM B OARD L AYOUT FOR D UAL H EAD-TO-H EAD S OCKETS (37)F IGURE 2-21: R ECOMMENDED S YSTEM B OARD L AYOUT (S IDE-BY-S IDE S PACING) (38)F IGURE 2-22: P OWER D ENSITY U NIFORM L OADING AT 80 P ERCENT C OVERAGE (40)F IGURE 3-1: P OWER-U P CLKREQ# T IMING (50)F IGURE 3-2: CLKREQ# C LOCK C ONTROL T IMINGS (51)TablesT ABLE 2-1: C ARD AND S OCKET T YPES C ROSS-C OMPATIBILITY (14)T ABLE 2-2: S YSTEM C ONNECTOR P HYSICAL R EQUIREMENTS (27)T ABLE 2-4: S YSTEM C ONNECTOR M ECHANICAL P ERFORMANCE R EQUIREMENTS (27)T ABLE 2-6: S YSTEM C ONNECTOR E LECTRICAL P ERFORMANCE R EQUIREMENTS (28)T ABLE 2-8: S YSTEM C ONNECTOR E NVIRONMENTAL P ERFORMANCE R EQUIREMENTS (28)T ABLE 2-10: M AXIMUM TDP (41)T ABLE 3-1: PCI E XPRESS M INI C ARD S YSTEM I NTERFACE S IGNALS (45)T ABLE 3-3: P OWER-U P CLKREQ# T IMINGS (50)T ABLE 3-5: CLKREQ# C LOCK C ONTROL T IMINGS (51)T ABLE 3-7: S IMPLE I NDICATOR P ROTOCOL FOR LED S TATES (53)T ABLE 3-10: R ADIO O PERATIONAL S TATES (55)T ABLE 3-11: S YSTEM C ONNECTOR P IN-OUT (57)T ABLE 3-13: DC S PECIFICATION FOR 3.3V L OGIC S IGNALING (59)T ABLE 3-14: S IGNAL I NTEGRITY R EQUIREMENTS AND T EST P ROCEDURES (60)T ABLE 3-16: P OWER R ATINGS (62)5611. Introduction1.1. OverviewThis specification defines an implementation for small form factor PCI Express cards. Thespecification uses a qualified sub-set of the same signal protocol, electrical definitions, andconfiguration definitions as the PCI Express Base Specification, Revision 1.0a1.1. Where this5specification does not explicitly define PCI Express characteristics, the PCI Express Base Specification governs.The primary differences between a PCI Express add-in card (as defined by the PCI Express Card Electromechanical Specification) and a PCI Express Mini Card add-in card is a unique card form factoroptimized for mobile computing platforms and a card-system interconnection optimized for10communication applications. Specifically, PCI Express Mini Card add-in cards are smaller and have smaller connectors than standard PCI Express add-in cards.Figure 1-1 shows a conceptual drawing of this form factor as it may be installed in a mobileplatform. Figure 1-1 does not reflect the actual dimensions and physical characteristics as thosedetails are specified elsewhere in this specification. However, it is representative of the general15concept of this specification to use a single system connector to support all necessary systeminterfaces by means of a common edge connector. Communications media interfaces may beprovided via separate I/O connectors and RF connectors each with independent cables as illustrated in Figure 1-1.78A-0381Figure 1-1: PCI Express Mini Card Add-in Card Installed in a Mobile Platform PCI Express Mini Card supports two primary system bus interfaces: PCI Express and USB as shown in Figure 1-2.S y s t e m B u s e s A-0339A PCI Express Mini CardModemEthernet WirelessSystem Interface Function I/O InterfaceFigure 1-2: Logical Representation of the PCI Express Mini Card Specification1.2. SpecificationReferencesThis specification requires references to other specifications or documents that will form the basis for some of the requirements stated herein.PCI Express Base Specification, Revision 1.0a1.1PCI Express Card Electromechanical Specification, Revision 1.0a1.15PCI Local Bus Specification, Revision 2.3Mini PCI Specification, Revision 1.0PCI Bus Power Management Interface Specification, Revision 1.11.2Advanced Configuration and Power Interface Specification, Revision 2.0bUniversal Serial Bus Specification, Revision 2.010SMBus Specification, Revision 2.0EIA-364-1000.01: Environmental Test Methodology for Assessing the Performance of Electrical Connectors and Sockets Used in Business Office ApplicationsEIA-364: Electrical Connector/Socket Test Procedures Including Environmental ClassificationsIS0/IEC 7816-2, 19992007-3-1, Information Technology - I I dentification Cards – -Integrated Circuit(s)15Cards – Part 2: Cards with Contacts – - Part 2: Dimensions and Location of the ContactsISO/IEC 7816-3, 1997-12-15, Second Addition, Information Technology - Identification Cards - IntegratedCircuit(s) Cards With Contacts - Part 3: Electronic Signals and Transmission Protocols IS0/IEC 7816-3, 2006, Identification Cards – Integrated Circuit Cards – Part 3: Cards with Contacts –Electrical Interface and Transmission Protocols ISO/IEC 7816-3, Amendment 1 2002-06-01, Amendment 1: 20Electrical Characteristics and Class Indication for Integrated Circuit(s) Cards Operating at 5 V, 3 V and 1,8VApplications1.3. TargetedAlthough the PCI Express Mini Card is originally intended for both wired and wirelesscommunication applications, it is not limited to such applications. Communications-specific25applications may include:Wired data communication:Local Area Network (LAN): 10/100/1000 Mbps EthernetWide Area Network (WAN): V.90/V.92 modemWireless data communication:30Wireless-LAN (W-LAN): 802.11b/g/a (2.4 GHz and 5.2 GHz bands)Wireless-WAN (W-WAN): Cellular data (e.g., GSM/GPRS, UMTS, and CDMA-2000)Wireless-Personal Area Network (W-PAN): Bluetooth9PCI Express Mini Card is targeted toward addressing system manufacturers’ needs for build-to-order and configure-to-order rather than providing a general end-user-replaceable module. Inspecific applications such as wireless, there are worldwide regulatory implications in providing end-user access to items such as antenna connections and frequency-determining components. It is up to the system manufacturer to limit access to appropriate trained service personnel and provide such 5notification to the user.Although not specifically considered, other applications that may also find their way to this form factor include advanced wired WAN technologies (xDSL and cable modem), location services using GPS, and audio functions.1.4. Features and Benefits10The performance characteristics of PCI Express make PCI Express Mini Card add-in cards desirable in a wide range of mobile systems. This mobile computer optimized form factor provides a number of benefits, including:Upgradeability – PCI Express Mini Card add-in cards are removable and upgradeable withavailable “new technology” cards. This allows upgrades to the newest technologies. System15manufacturers are responsible for providing sufficient notification in the accompanying manualwhen a qualified technician should perform the upgrade service.Flexibility – A single PCI Express Mini Card interface can accommodate various types of communications devices. Therefore, the OEM manufacturer can supply build-to-order systems(for example, a network interface card instead of a modem or Token Ring instead of Ethernet).20Reduced Cost – A standard form factor for small form factor add-in cards makes them more manufacturable, which may lead to reduced costs and provide an economy-of-scale advantageover custom manufactured form factors.Serviceability – PCI Express Mini Card add-in cards can be removed and easily serviced if theyfail.25Reliability – PCI Express Mini Card add-in cards will be mass-produced cards with higher quality than low-volume custom boards.Software Compatibility – PCI Express Mini Card add-in cards are intended to be fully compatible with software drivers and applications that will be developed for standard PCIExpress add-in cards.30Reduced Size – PCI Express Mini Card add-in cards are smaller than PC Cards, PCI Express add-in cards, Mini PCI add-in cards, and other add-in card form factors. This reduced sizepermits a higher level of integration of data communications devices into notebook PCs.Regulatory Agency Accepted Form Factor – Standardization of the PCI Express Mini Cardform factor will permit world wide regulatory agencies to approve PCI Express Mini Card35communications devices independent of the system. This significantly reduces cost and risk onthe part of systems manufacturers.Power Management – PCI Express Mini Card is designed to be truly mobile friendly for current and future mobile specific power management features.1022. MechanicalSpecification2.1. OverviewThis specification defines a two small form factor card s for systems in which a PCI Express add-in card cannot be used due to mechanical system design constraints. The specification defines asmaller card s based on a single 52-pin card-edge type connector for system interfaces. The5specification also defines the PCI Express Mini Card system board connector. In this document Mini Card refers to either form-factor. As the two form-factors primarily differ in length, they will be individually identified as the Full-Mini Card and the Half-Mini Card for the full length and half-length versions of the cards, respectively.2.2. CardSpecifications10There is one are two PCI Express Mini Card add-in card size s: Full-Mini Card and Half-Mini Card.For purposes of the drawings in this specification, the following notes apply:All dimensions are in millimeters, unless otherwise specified.All dimension tolerances are ± 0.15 mm, unless otherwise specified.Dimensions marked with an asterisk (*) are overall envelope dimensions and include space15allowances for insulation to comply with regulatory and safety requirements.Insulating material shall not interfere with or obstruct mounting holes or grounding pads.2.2.1. Card Form FactorThe card form factor s is are specified by Figure 2-1 and Figure 2-2. The se figure s illustrate s amodem example application s . The hatched area s shown in this these figure s represent s the available component volume for the card’s circuitry.A-03405.00 REFPIN 1Figure 2-1: Full-Mini Card Form Factor (Modem Example Application Shown)A-07295.00 REFFigure 2-2: Half-Mini Card Form Factor (Wireless Example Application Shown)2.2.2. Card and Socket TypesGiven the multiple card sizes defined for Mini Card, host platforms have options with regard to socket configurations implemented to support each of the card sizes and potentially the mixing of the two card sizes within a common socket arrangement.Single socket arrangements include those specific to Full-Mini Card (F1) and Half-Mini Card (H1) 5only usages. These sockets specifically have the card retention features for only one size card and are further defined in Section 2.5.1.Additionally, a single socket that optionally supports either a Full-Mini Card (F2) or a Half-Mini Card (H1 or H2) is possible to implement, this type being referred to as a dual-use socket and supports card retention for both size cards. See Section 2.5.2 for more details on this socket 10definition.A dual head-to-head socket is defined as an optional way to incorporate two socket connectors (identified as A and B) into a space that most closely replaces a single Full-Mini socket. Thisarrangement offers the choice of installing two Half-Mini Cards (one of which has to be a H2 type) or one Full-Mini Card (F2) enabling some additional flexibility for a selection of BTO options. See 15Section 2.5.3for more details on this socket definition.Table 2-1 defines cross-compatibility for a series of defined card and socket types. It is important to notice that the dual head-to-head socket arrangement has special limitations with regard to card compatibility.Table 2-1: Card and Socket Types Cross-CompatibilityFull-Mini-Only Socket* Half-Mini-OnlySocketDual-UseSocketDual Head-to-Head SocketCard TypesConnectorA ConnectorAConnectorAConnectorAConnectorBF1 Full-Mini1Yes No No No NoF2 Full-Mini withbottom-sidekeep outsYes No Yes Yes NoH1 Half-Mini No Yes Yes Yes NoH2 Half-Mini withbottom-sidekeep outsNo Yes Yes Yes Yes* Equivalent to the original Mini Card defined card and socket in Revision 1.1 of this specification.Mini Cards that were developed prior to this type definition are by default identified as Type F1.Given that the existing design meets the bottom-side keep out definition for Type F2, thensubsequently identifying the product as Type F2 is acceptable.2.2.2.2.2.3. Card PCB Details5Figure 2-3, Figure 2-4Figure 2-3, Figure 2-5Figure 2-4, and Figure 2-6Figure 2-5 provide the printed circuit board (PCB) details required to fabricate the card. The PCB for this application is expected to be 1.0 mm thick.A-0341A+0.2x R 0.80 M A XP i n n u m b e r i n g r e f e r e n c e :O d d p i n s – T o p S i d e E v e n p i n s – B o t t o m S i d eM A B C0.10x 2.15 R E F I NFigure 2-3: Full-Mini Card Top and BottomA-0728+0.2x R 0.80 M A XP i n n u m b e r i n g r e f e r e n c e :O d d p i n s – T o p S i d e E v e n p i n s – B o t t o m S i d eM A B C0.10x 2.15 R E F I NFigure 2-4: Half-Mini Card Top and BottomA-0342AD e t a i l B (B o t t o m S i d e )(T o p S i d e ).054.0Figure 2-5: Card Top and Bottom Details A and B1.35 MAXA-0343AA-0343BFigure 2-6: Card EdgeFigure 2-7and Figure 2-8 provide details regarding the component keep out areas on Full-Mini (Types F1 and F2) and Half-Mini Cards (Types H1 and H2), respectively.Component and routing (all layers)keep out area for hold down solutionsA-0344AA-0727B o t t o m S i d e (T y p e F 1)B o t t o m S i d e (T y p e F 2)2x 5.80C o m p o n e n t a n d r o u t i n g (a l l l a y e r s )k e e p o u t a r e a f o r h o l d d ow n s o l u t i o n s5T o p S i d e (T y p e s F 1 a n d F 2)4x 5.80Figure 2-7: Card Component Keep Out Areas for Full-Mini CardsA-0730B o t t o m S i d e (T y p e H 1)B o t t o m S i d e (T y p e H 2)2x 5.80C o m p o n e n t a n d r o u t i n g (a l l l a y e r s )T o p S i d e (T y p e s H 1 a n d H 2)Figure 2-8: Card Component Keep Out Areas for Half-Mini Cards2.3. System Connector SpecificationsThe PCI Express Mini Card system connector is similar to the SO-DIMM connector and is modeledafter the Mini PCI Type III connector without side retaining clips.Note: All dimensions are in millimeters, unless otherwise specified. All dimension tolerances are ± 0.15 mm, unless otherwise specified.5Connector2.3.1. SystemThe system connector is 52-pin card edge type connector. Detailed dimensions should be obtained from the connector manufacturer. Figure 2-9 shows the system connector. Figure 2-7, Figure 2-8, and Figure 2-9 show the recommended locations of the PCI Express Mini Card system connectoron the system board.10A-0345AFigure 2-9: PCI Express Mini Card System ConnectorA-0346AThe horizontal axis for the pattern is established by a line through the center of the Ø 1.60 and Ø 1.10holes. The vertical axis is 90˚ to the horizontal axis, through the center of datum E.Location of inserted card edge is aligned with of holes.Figure 2-7: Recommended System Board Layout (Single Socket)7 spacesA-0347 Figure 2-8: Recommended System Board Layout (Detail D)A-0348 Figure 2-9: Recommended System Board Layout (Dual Socket)2.3.2. SystemConnectorParametric SpecificationsTable 2-2, Table 2-4, Table 2-6, and Table 2-8 specify the requirements for physical, mechanical, electrical, and environmental performance for the system connector.Table 2-22-1: System Connector Physical RequirementsParameter SpecificationConnector Housing U.L. rated 94-V-1 (minimum) Must be compatible with lead-free soldering processContacts: Receptacle Copper alloyContact Finish: Receptacle Must be compatible with lead-free soldering processTable 2-42-2: System Connector Mechanical Performance RequirementsParameter SpecificationDurability EIA-364-9 50 cyclesTotal mating/unmating force* EIA-364-132.3 kgf maximumShock EIA-364-27, Test condition AAdd to EIA-364-1000 test group 3 with LLCR before vibration sequence.Note: Shock specifications assume that an effective card retention feature is used.* Card mating/unmating sequence:1. Insert the card at the angle specified by the manufacturer.2. Rotate the card into position.3. Reverse the installation sequence to unmate.Table 2-62-3: System Connector Electrical Performance RequirementsParameter SpecificationLow Level Contact Resistance EIA-364-2355 milliohms mΩmaximum (initial) per contact;20 mΩmilliohms maximum change allowedInsulation Resistance EIA-364-21> 5 x 108 @ 500 V DCDielectric Withstanding Voltage EIA-364-20> 300 V AC (RMS) @ sea levelCurrent Rating 0.50 amp A/power contact (continuous) The temperature rise above ambient shall not exceed 30 °C. The ambient condition is still air at 25 °C.EIA-364-70 method 2Voltage Rating 50 V AC per contactTable 2-82-4: System Connector Environmental Performance RequirementsParameter Specification Operating Temperature -40 °C to +80 °CEnvironmental Test Methodology EIA-364-1000.01Test Group, 1, 2, 3, and 4Useful Field Life 5 yearsTo ensure that the environmental tests measure the stability of the connector, the add-in cards used shall have edge finger tabs with a minimum plating thickness of 30 micro-inches of gold over50 micro-inches of nickel (for environmental test purposes only). Furthermore, it is highly desirablethat testing gives an indication of the stability of the connector when add-in cards at the lower and 5upper limit of the card thickness requirement are used. In any case, both the edge tab platingthickness and the card thickness shall be recorded in the environmental test report.2.3.3.2.4. I/O Connector AreaThe placement of I/O connectors on a PCI Express Mini Card add-in card is recommended to be atthe end opposite of the system connector as shown in Figure 2-13. The recommended area applies 10to both sides of the card, though typical placement will be on the top of the card due to theadditional height available. Depending on the application, one or more connectors may be required to provide for cabled access between the card and media interfaces such as LAN and modem line interfaces and/or RF antennas. This area is not restricted to I/O connectors only and can be usedfor circuitry if not needed for connectors.15A-0349A-0349AFigure 2-13: I/O Connector Location Areas2.5. Recommended Socket ConfigurationsThe following subsections address various recommended footprints for the system connector covering single-use sockets, dual-use sockets and multi-socket configurations.2.5.1. Single Use Full-Mini and Half-Mini SocketsFigure 2-14, Figure 2-15, and Figure 2-16 show the recommended system board layouts for single-5use sockets.A-0346AThe horizontal axis for the pattern is established by a line through the center of the Ø 1.60 and Ø 1.10holes. The vertical axis is 90˚ to the horizontal axis, through the center of datum E.Location of inserted card edge is aligned with of holes.Figure 2-14: Recommended System Board Layout for Full-Mini-Only SocketA-0731The horizontal axis for the pattern is established by a line through the center of the Ø 1.60 and Ø 1.10holes. The vertical axis is 90˚ to the horizontal axis, through the center of datum E.Location of inserted card edge is aligned with of holes.Figure 2-15: Recommended System Board Layout for Half-Mini-Only SocketA-03477 spacesFigure 2-16: Recommended System Board Layout (Detail D)2.5.2. Dual-Use SocketsFigure 2-17 illustrates the concept of a dual-use socket that can accept either a Full-Mini Card or a Half-Mini Card. This socket differs from the Full-Mini-only socket in that consideration is given to support hold down support for the installation of a Half-Mini Card into the same socket. All Mini Cards with the exception of the Type F1 Full-Mini Card are compatible with this socket. 5Figure 2-18 shows the recommended system board layout for the dual-use socket.A-0725H a l f -M i n i C a r d i n s t a l l e dD u a l -U s e S o c k e t w i t h n o M i n i C a r d s i n s t a l l e dF u l l -M i n i C a r d i n s t a l l e dC o n n e c t o r AC o n n e c t o r AFigure 2-17: Dual-Use SocketA-0726The horizontal axis for the pattern is established by a line through the center of the Ø 1.60 and Ø 1.10holes. The vertical axis is 90˚ to the horizontal axis, through the center of datum E.Location of inserted card edge is aligned with of holes.Figure 2-18: Recommended System Board Layout for Dual-Use Socket2.5.3. Dual Head-to-Head SocketsFigure 2-19 illustrates the concept of a dual head-to-head socket configuration. This optionalconfiguration defines a two connector (A and B) solution that is intended to allow installation foreither one Full-Mini Card or two Half-Mini Cards. Figure 2-20shows the recommended system board layout for this configuration based on overlaying the defined dual-use and Half-Mini-only5sockets (see Figure 2-15 and Figure 2-18 for additional dimensional details).It is important to note the limitations regarding card compatibility with this socket configuration.Connector A can accept all but the Type F1 Full-Mini Card. Connector B can only accept Type H2 Half-Mini Cards. When using two Half-Mini Cards in this configuration, care must be taken that atleast one of those cards be Type H2.10A-0724T w o H a l f -M i n i C a r d s i n s t a l l e dD u a l H e a d -t o -H e a d S o c k e t w i t h n o M i n i C a r d s i n s t a l l e dO n e F u l l -M i n i C a r d i n s t a l l e dC o n n e c t o r B (o n l y c o m p a t i b l e w i t h H 2 c a r d s )C o n n e c t o r AC o n n e c t o r AC o n n e c t o r B (o n l y c o m p a t i b l e w i t h H 2 c a r d s )C o n n e c t o r B (u n u s e d )Figure 2-19: Dual Head-to-Head Socket。
朗文国际英语教程2(side-by-side2)unit6-SBS2-Unit-6
无论如何还是谢谢你
1. 固执的 2. 有耐性的 3. 懒的 4. 粗鲁的 5. 吵的 6. 大方的 7. 流行的，受欢迎的 8. 有耐心的 9. 精力充沛的 10.讨人厌的 11.脏乱的 12.乐于助人的 13.诚实的
1. 乐于助人的 2. 诚实的 3. 有耐性的 4. 懒的 5. 粗鲁的 6. 流行的， 7. 精力充沛的 8. 讨人厌的 9. 脏乱的 10.固执的 11.受欢迎的 12.有耐心的 13.大方的
1. big _b_i_g_g_e__r__ _t_h_e__b_i_g_g_est
2. funny _f_u_n__n_i_e_r_ _th__e_f_u_n__n_iest 3. close _c__lo_s__e_r__ _th__e_c__lo_s__est 4. friendly _f_ri_e_n_d__li_e_r th__e_f_r_ie__n_d_liest 5. comfortable _m_o__r_e_c_o__m__fo__rt_a_ble
1. even though = even if 即使 2. product 产品 3. furniture 家具 4. appliance 器具、器械、装置 5. dependable 可靠的 6. entertainment 娱乐 7. besides 除了…之外 beside在…旁边 8. location 位置、场所 9. convenient 方便的 10. salesperson 销售员 11. In addition, … 另外…
This cow is the shortest in the world.
世界最高男子土耳其 人苏丹·考森 （SultanKosen），2009年 2月11日测量时身高为2.46 米，他的生日是1982年12 月10日。
DevexpressChartControl柱状图简单例子
DevexpressChartControl柱状图简单例⼦ //using DevExpress.XtraEditors;//using DevExpress.XtraCharts;// Create an empty chart.ChartControl sideBySideBarChart = new ChartControl();// Create the first side-by-side bar series and add points to it.Series series1 = new Series("Side-by-Side Bar Series 1", ViewType.Bar);series1.Points.Add(new SeriesPoint("A", 10));series1.Points.Add(new SeriesPoint("B", 12));series1.Points.Add(new SeriesPoint("C", 14));series1.Points.Add(new SeriesPoint("D", 17));// Create the second side-by-side bar series and add points to it.Series series2 = new Series("Side-by-Side Bar Series 2", ViewType.Bar);series2.Points.Add(new SeriesPoint("A", 15));series2.Points.Add(new SeriesPoint("B", 18));series2.Points.Add(new SeriesPoint("C", 25));series2.Points.Add(new SeriesPoint("D", 33));// Add the series to the chart.sideBySideBarChart.Series.Add(series1);sideBySideBarChart.Series.Add(series2);// Hide the legend (if necessary).sideBySideBarChart.Legend.Visibility = DevExpress.Utils.DefaultBoolean.False;// Rotate the diagram (if necessary).//((XYDiagram)sideBySideBarChart.Diagram).Rotated = true;// Add a title to the chart (if necessary).ChartTitle chartTitle1 = new ChartTitle();chartTitle1.Text = "Side-by-Side Bar Chart";sideBySideBarChart.Titles.Add(chartTitle1);// Add the chart to the form.sideBySideBarChart.Dock = DockStyle.Fill; this.Controls.Add(sideBySideBarChart);。
lesson 3 The Sun is Rising
Spring Dawn Sleeping lazily at dawn in spring, Sound of birdsong all around. Last night’s wind and rain still ring, How many blossoms blown to the ground?
The s_e_a_s_o_n_’_s change. n. 改变
“年Th度e工Su作主n概I题s述Rising” is a song about spring. Spring is a
ADD RELATED TITLE WORDS
favourite theme for songs and poems in all languages. Look at
Climb the hillside, The weather is warming, The wind blows gently, Through the trees.
The sun is rising, Spring is coming, See it bring, The season’s change.
标题文本预设
此部分内容作为文字排版占位显示 （建议使用主题字体）
标题文本预设
此部分内容作为文字排版占位显示 （建议使用主题字体）
标题文本预设
此部分内容作为文字排版占位显示 （建议使用主题字体）
年度工作概述
ADD RELATED TITLE WORDS
1 此处添加详细文本描述，建议与标 题相关并符合整体语言风格，语言 描述
The sun is rising,
Spring is coming,
The snow is _m__el_t_in_g_owThoeutweather is warm.
2024年03版小学三年级上册第6次英语第二单元真题试卷
2024年03版小学三年级上册英语第二单元真题试卷考试时间：100分钟（总分:110）A卷考试人：_________题号一二三总分得分一、选择题(共计20题，共40分)1、What is the opposite of "fast"?A, QuickB, SlowC, SpeedyD, Rapid2、Which plant is often used for decoration in homes?哪种植物常用于家庭装饰？A. Houseplant (室内植物)B. Oak (橡树)C. Pine (松树)D. Fern (蕨类植物)3、What do we call the green pigment in plants?中文解释：我们称植物中的绿色色素为？A, ChlorophyllB, CaroteneC, Melanin4、What do we call the first meal of the day?我们称一天中的第一餐为？A) LunchB. DinnerC. BreakfastD. Snack5、What is the opposite of "dark"?A, LightB, BrightC, DullD, Faint6、What is the currency used in the United States?美国使用的货币是什么？A. Euro 欧元B. Dollar 美元C. Pound 英镑D. Yen 日元7、What do we call a plant that grows in the Arctic?中文解释：我们称生长在北极的植物为？A, Arctic plantB, Tropical plantC, Desert plant8、我会选。
(选出与句子相符的图片，把字母标号填在题前括号里)。
9、What do we call plants that grow in tropical regions?中文解释：我们称生长在热带地区的植物为？A, Tropical plantsB, Arctic plantsC, Desert plants10、What does "植物生理学" mean in English?A, Plant physiologyB, Plant geneticsC, Plant ecologyD, Plant anatomy11、What do you call the time when you play games?你玩游戏的时间称为何？A. Playtime 玩耍时间B. Free time 空闲时间C. Leisure time 休闲时间D. Break 时间12、Where do you go to see stars?你去哪里看星星？A. SchoolB. GardenC. OutsideD. Playground13、What is the capital of France?A, RomeB, MadridC, BerlinD, Paris14、What is the opposite of "happy"?“快乐”的反义词是什么？A. SadB. DepressedC. UnhappyD. All of the above15、【二会词汇】给英文单词或短语选出正确的汉语意思。