BL-S56C-11S2中文资料
飞毛腿普及版型号表
NO.品牌型号原装代码容量1诺基亚诺基亚6111BL-4B 5002诺基亚诺基亚6100BL-4C 6003诺基亚诺基亚5310BL-4CT 6004诺基亚诺基亚N97mini BL-4D 8005诺基亚诺基亚C6BL-4J 7006诺基亚诺基亚2680S BL-4S 5507诺基亚诺基亚8900BL-4U 6008诺基亚诺基亚3220BL-5B 6009
诺基亚
诺基亚2600C
BL-5BT
600
10诺基亚诺基亚3100BL-5BT 750
11诺基亚诺基亚5220BL-5CT 65012诺基亚诺基亚N95BL-5F 70013诺基亚诺基亚5800
BL-5J
75014诺基亚诺基亚N85
BL-5K 55015诺基亚诺基亚
8800A BL-5X/BP-6X
50016诺基亚诺基亚N95-8G
BL-6F
75017诺基亚诺基亚7900BL-6P 50018诺基亚诺基亚
6700C BL-6Q
75019诺基亚诺基亚8820BL-6U 65020诺基亚诺基亚8210BLB-275021
诺基亚
诺基亚3310
BLC-2
750
最新飞毛腿
飞毛
最新飞毛腿
飞毛腿电池通用型号表查询请登录： 飞毛腿电子（深圳）有限公司
普及版型号表
飞毛腿电池通用型号表查询请登录：。
CL1011说明书
CL1011 使用说明书
6.5.2.3
按格测试：先设定被检表量程（电压或电流值） ，按确认后，自动弹出满格设置， 确认后，显示 00.0000 格。 方法 1：利用数字键键入输出格数，按“确认”键直接输出，设定值视为示值。 使用左移、右移、上升、下降四个键，对位光标所指的数字进行升降调节，以调 节输出大小，获取实际值，误差跟随变化。 方法 2：使用 10%、50%，100%确定输出格数（视为示值） ，再使用左移、右移、 上升、下降四个键，对位光标所指的数字进行升降调节，以调节输出大小（获取 实际值） ，误差跟随变化。
6.5.2.2
量程测试：先设定被检表量程（电压值或电流值） ，使用 10%、50%，100%确定输 出值，再使用左移、右移、上升、下降四个键，对位光标所指的数字进行升降调 节，以调节输出大小。 方法 1：利用数字键键入测试点，按“确认”键直接输出，设定值视为示值。使 用左移、右移、上升、下降四个键，对位光标所指的数字进行升降调节，以调节 输出大小，获取实际值，误差跟随变化。电流项目设定测试点时，默认单位 mA。 方法 2：使用 10%、50%，100%确定输出值（视为示值） ，再使用左移、右移、上 升、下降四个键，对位光标所指的数字进行升降调节，以调节输出大小（获取实 际值） ，误差跟随变化。
实际值 100% 量程
γA-- 示值误差
示值 实际值 100% 示值 示值 实际值 100% 量程
γm-- 引用误差
提示 – 超载、高压、钳表 6.4 按键 项目键：DCV、ACV、Ω、DCI、ACI 设置键：0、1、2、3、4、5、6、7、8、9、小数点、A 移动键：左移、右移 升降键：上升、下降 量程键：量程、10%、50%、100%
常用纽扣电池型号对照表
常用纽扣电池型号对照表CR2032是指一种20mm直径，3.2mm高。
IEC标准中，R代表圆柱形，L代表碱性，数字代表电池的大小，数字后面的P代表高功率，这里有一个特殊规定，在表示五号普通锌锰电池时，要标识为R6P，而不是R06或者R6。
CR系列也是一种典型的干电池型号，常见的有CR2025、CR2032等。
其中C是以锂金属为负极，以二氧化锰为正极的化学电池体系，R表示电池的形状为圆柱形，如果是方形则F替代；20表示电池的直径是20mm，32代表电池的高度为3.2mm。
除了单支干电池型号命名外，还有一些组合干电池型号的标识表示如下：1、9V电池：6F22是由6个扁平形电池叠层的碳性电池；6LR61则是由6个扁平形电池叠层的碱性电池；2、AG系列：是直径很小的CR电池，分为AG1到AG13计13种，属于碱性电池；3、23A和27A：是由八个同一规格的AG电池叠层的，也称12V扣式电池，27A大于23A。
这些组合的干电池型号往往是基于特殊电压或者容量的考虑，也只适用于一些特定领域。
由于这些干电池型号有一定的市场容量，知道它们属于干电池序列这一点，就便于把握其价格与特性。
另外还有非锌锰和锂锰系的干电池，如镁锰电池等，因为比较少见，所以对这种干电池及干电池型号介绍不多。
普通充电电池充电时间计算一、充电常识在这里，首先要说明的是，充电是使用充电电池的重要步骤。
适当合理的充电对延长电池寿命很有好处，而野蛮胡乱充电将会对电池寿命有很大影响。
上一篇曾说过，目前的锂电池基本都是根据各个产品单独封装，互不通用的，因此各个产品也提供各自的充电设备，互不通用，在使用时只要遵循各自的说明书使用即可。
所以本篇对电池充电的介绍主要是指镍镉电池和镍氢电池。
对镍隔电池和镍氢电池充电有两种方式，就是我们大家所熟知的“快充”和“慢充”。
快充和慢充是充电的一个重要概念，只有了解了快充和慢充才能正确掌握充电。
首先，快充和慢充是个相对的概念。
Mini-Circuits PWR-6LRMS-RC 50Ω 输出功率分配器说明书
PWR-6LRMS-RC50Ω-45 dBm to +10 dBm, 50 to 6000 MHzSm art Po wer SensorUSB / Ethernet true RMSThe Big Deal• USB and Ethernet control • True RMS power sensor(Measure CW and modulated signals)• Measure power levels as low as -45 dBm • Fast Measurement rate: 30 msProduct OverviewMini-Circuits’ PWR-6LRMS-RC is a low cost, compact sensor-head that turns any PC with a USB port into a true RMS power meter for CW (continuous waveform), modulated and multi-tone signals. The sensor has a 55 dB input dynamic range allowing measurement of RF powers down to -45 dBm, over 50 to 6000 MHz.The USB HID interface is “plug & play” compatible, meaning no driver installation is required. Full software support is provided, including our user-friendly GUI application for Windows and a full API with programming instructions for Windows and Linux environments (both 32-bit and 64-bit systems).Download from /softwaredownload/pm.htmlModel No.DescriptionPWR-6LRMS-RC USB/Ethernet smartTrue RMS Power SensorIncluded Accessories PWRSN-6LRMS-RC Power Sensor HeadUSB-RJ45-CBL-7+6.6 ft “Y” data cable (USB & RJ45)Typical Applications• Turn any Windows or Linux PC into a Power Meter • Lab & benchtop testing• Signal level calibration in production test systems• Power monitoring in remote installations / base-stations • Bluetooth / Wi-Fi / 2G /3G / 4G testingKey FeaturesCASE STYLE: JL1941Rev. D M177005Generic photo used for illustration purposes onlyTorvalds. Pentium is a registered trademark of Intel Corporation. Neither Mini-Circuits nor the Mini-Circuits PWR-series power sensors are affiliated with orendorsed by the owners of the above referenced trademarksSoftware PackageElectrical Specifications, -45 dBm to +10 dBm, 50 to 6000 MHz1 Maximum continuous safe operational power limit: +13 dBm. Performance is guaranteed up to +10 dBm.2Tested with CW signal3 When using Faster mode at high frequencies below -30dBm, use of averaging is recommended to prevent noise errors.4 When using Faster mode below -30dBm, uncertainty value may increase by up to 0.2 dB relative to Low noise modeElectrical Specifications (Continued), -45 dBm to +10 dBm, 50 to 6000 MHz5Digital modulation transmission rates are measured in ‘symbols per second’ (sps) and use a bandpass filter on the output to limit spectral spreading.6 Relative to an equivalent CW signal @+25°C7 Tested at -40 to 0 dBm @+25°C average modulated power. Be careful that peak power does not exceed specified Maximum power.Absolute Maximum RatingsOutline Drawing (JL1941)inch8 Power sensor to be used with the supplied control cable only.9 Maximum torque 8 in-lb (90 N-cm).Power IndicatorLAN Status indicatorsTypical Performance Curves1.001.051.101.151.201.25100020003000400050006000V S W R (:1)VSWRFREQUENCY (MHz)V S W R (:1)-4%-2%0%2%4%6%8%0200040006000L i n e a r i t y (%)LINEARITY @ 25O C FREQUENCY (MHz)L I N E A R I T Y (%)LINEARITY @ 25°C -0.100.000.100.200.300.400100020003000400050006000FREQUENCY (MHz)UNCERTAINTY OF POWER MEASUREMENT @ 25O C FREQUENCY (MHz)U N C E R T A I N T Y (d B )0.30 0.15 0.00-0.15-0.30UNCERTAINTY OF POWER MEASUREMENT CW SIGNAL@ 25°CTypical Performance Curves (Continued)-0.50-0.30-0.100.100.300.500100020003000400050006000U N C E R T A I N T Y (d B )FREQUENCY (MHz)UNCERTAINTY OF POWER MEASUREMENT MODULATED SIGNALS @ 25°C, -40 dBm-0.50-0.30-0.100.100.300.500100020003000400050006000U N C E R T A I N T Y (d B )FREQUENCY (MHz)UNCERTAINTY OF POWER MEASUREMENT MODULATED SIGNALS @ 25°C, -30 dBm-0.50-0.30-0.100.100.300.500100020003000400050006000U N C E R T A I N T Y (d B )FREQUENCY (MHz)UNCERTAINTY OF POWER MEASUREMENT MODULATED SIGNALS @ 25°C, -15 dBm-0.50-0.30-0.100.100.300.500100020003000400050006000U N C E R T A I N T Y (d B )FREQUENCY (MHz)UNCERTAINTY OF POWER MEASUREMENT MODULATED SIGNALS @ 25°C, 0 dBmUSB Type A plug -power adaptorRJ45 connector - Connected to LANUSB-AC/DC-5Connect USB-AC/DC-5to mains powerConnection diagramsConnection diagram for USB controlConnection diagram for Ethernet control, using power adapterConnection diagram for Ethernet control, using PoE systemUSB Type A plug -Note: Commercially available PoE splitter not supplied by Mini-CircuitsSoftware & Documentation Download:• Mini-Circuits’ full software and support package including user guide, Windows GUI, DLL files, programming manual and examples can be downloaded free of charge from/softwaredownload/pm.html .• Please contact ****************************** for supportGraphical User Interface (GUI) for Windows Key Features:• Set compensation frequency and monitor power measurement • Configure measurement offsets and relative power readings • Set measurement mode (speed and averaging)• Control multiple power sensors at once • Schedule data recording• Guided measurements for a variety of applications (characterizing a two port device, power monitoring, etc.)Application Programming Interface (API)Windows Support:• API DLL files exposing the full power sensor functionality. See programming manual at https:///softwaredownload/Prog_Manual-4-Power_Meter.pdf for details. • ActiveX COM DLL file for creation of 32-bit programs • .Net library DLL file for creation of 32 / 64-bit programs• Supported by most common programming environments (refer to application note AN-49-001 for summary of tested environments)Linux Support:• Full power sensor control in a Linux environment is achieved by way of USB interrupt commands. See programming manualOrdering Information Additional NotesA. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies CalibrationDescriptionCALSN-6LRMS-RCCalibration ServiceClick HereIncluded AccessoriesPart No.DescriptionPWRSN-6LRMS-RC Power Sensor HeadUSB-RJ45-CBL-7+6.6 ft (2 m) “Y” data cable with USB Type-A and RJ45 plug connectors 10ModelDescriptionPWR-6LRMS-RCUSB/Ethernet Smart True RMS Power SensorOptional AccessoriesDescriptionUSB-AC/DC-5+AC/DC 5V DC Power Adapter with US, EU, IL, UK, AUS, and China power plugs 11USB-RJ45-CBL-7+ (spare) 6.6 ft (2 m) “Y” data cable with USB Type-A and RJ45 plug connectors NF-SM50+N-Type Female to SMA Male Adapter.NF-SF50+N-Type Female to SMA Female Adapter NF-BM50+N-Type Female to BNC Male Adapter.11 Power plugs for other countries are also available, Plugs for other countries are also available, if you need a power plug for a country not listedplease contact ******************************.10 Power sensor to be used with the supplied control cable only.。
BSS64;中文规格书,Datasheet资料
50
100
1
10 100 I C - COLLECTOR CURRE NT (mA)
200
/
BSS64
NPN General Purpose Amplifier
(continued)
Typical Characteristics
1 0.8
β = 10
V BEON - BASE EMITTER ON VOLTAGE (V)
SMALL SIGNAL CHARACTERISTICS
fT Cob Current Gain - Bandwidth Product Output Capacitance IC = 4.0 mA, VCE = 10, f = 35 MHz VCB = 10 V, f = 1.0 MHz 60 5.0 MHz pF
Absolute Maximum Ratings*
Symbol
VCEO VCBO VEBO IC TJ, Tstg Collector-Emitter Voltage Collector-Base Voltage Emitter-Base Voltage Collector Current - Continuous
TA = 25°C unless otherwise noted
Parameter
Value
80 120 5.0 200 -55 to +150
Units
V V V mA °C
Operating and Storage Junction Temperature Range
*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
BCX51 52 53 PNP中间功率导电器SOT89数据手册说明书
Features• BV CEO > -45V, -60V & -80V• I C = -1A Continuous Collector Current • I CM = -2A Peak Pulse Current• Low Saturation Voltage V CE(sat) <************• Gain Groups 10 and 16• Complementary NPN Types: BCX54, 55, and 56• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen- and Antimony-Free. "Green" Device (Note 3)•For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/200, PPAPcapable, and manufactured in IATF 16949 certified facilities),please contact us or your local Diodes representative.https:///quality/product-definitions/Mechanical Data• Case: SOT89• Case Material: Molded Plastic, “Green” Molding Compound; UL Flammability Rating 94V-0• Moisture Sensitivity: Level 1 per J-STD-020•Terminals: Matte Tin Finish Leads; Solderable per MIL-STD-202 Method 208•Weight: 0.052 grams (Approximate)Applications • Medium Power Switching or Amplification Applications • AF Driver and Output StagesOrdering Information (Note 4)Product Compliance Marking Reel Size (inches)Tape Width (mm)Quantity per ReelBCX51TA Standard AA 7 12 1,000 BCX51-13R Standard AA 13 12 4,000 BCX5110TA Standard AC 7 12 1,000 BCX5116TA Standard AD 7 12 1,000 BCX5116TC Standard AD 13 12 4,000 BCX52TA Standard AE 7 12 1,000 BCX5210TA Standard AG 7 12 1,000 BCX5216TA Standard AM 7 12 1,000 BCX53TA Standard AH 7 12 1,000 BCX5310TA Standard AK 7 12 1,000 BCX5316TA Standard AL 7 12 1,000 BCX5316TC Standard AL 13 12 4,000 BCX5316-13R Standard AL 13 12 4,000 BCX5110TC Standard AC 13 12 4,000 BCX51TC Standard AA 13 12 4,000 BCX5210TC Standard AG 13 12 4,000 BCX5216TC Standard AM 13 12 4,000 BCX52TC Standard AE 13 12 4,000 BCX5310TC Standard AK 13 12 4,000 BCX53TCStandardAH13124,000Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.2. See https:///quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.4. For packaging details, go to our website at https:///design/support/packaging/diodes-packaging/.Top View Device SymbolTop View Pin-Out SOT89E C BMarking InformationAbsolute Maximum Ratings (@ T A = +25°C, unless otherwise specified.)CharacteristicSymbol BCX51 BCX52 BCX53 Unit Collector-Base Voltage V CBO -45 -60 -100 V Collector-Emitter Voltage V CEO -45-60 -80V Emitter-Base Voltage V EBO -5 V Continuous Collector CurrentI C -1 A Peak Pulse Collector Current (Single pulse) I CM -2 Continuous Base CurrentI B -100 mAPeak Pulse Base Current (Single pulse) I BM-200Thermal Characteristics (@ T A = +25°C, unless otherwise specified.)CharacteristicSymbol Value Unit Power Dissipation(Note 5) P D1 W(Note 6) 1.5 (Note 7) 2.0 Thermal Resistance, Junction to Ambient Air (Note 5) R θJA 125 °C/W (Note 6) 83 (Note 7)60 Thermal Resistance, Junction to Lead (Note 8) R θJL 13 °C/W Thermal Resistance, Junction to Case (Note 9)R θJC 27 °C/W Operating and Storage Temperature Range T J, T STG-55 to +150°CESD Ratings (Note 10)CharacteristicSymbol Value Unit JEDEC ClassElectrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine ModelESD MM400VCNotes: 5. For a device mounted with the exposed collector pad on 15mm x 15mm 1oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured under still air conditions whilst operating in a steady-state.6. Same as Note 5, except the device is mounted on 25mm x 25mm 1oz copper.7. Same as Note 5, except the device is mounted on 50mm x 50mm 1oz copper.8. Thermal resistance from junction to solder-point (on the exposed collector pad).9. Thermal resistance from junction to the top of the case.10. Refer to JEDEC specification JESD22-A114 and JESD22-A115.xx = Product Type Marking Code, as follows:BCX51 = AA BCX52 = AEBCX53 = AH BCX5110 = AC BCX5210 = AG BCX5310 = AK BCX5116 = AD BCX5216 = AMBCX5316 = ALThermal Characteristics and Derating Information2550751001251500.00.20.40.60.81.0Derating CurveTemperature (°C) M a x P o w e r D i s s i p a t i o n (W )Transient Therm al Im pedanceT h e r m a l R e s i s t a n c e (°C /W )Pulse Width (s)Pulse Power DissipationPulse Width (s)M a x P o w e r D i s s i p a t i o n (W )Copper Area (sqmm)M a x i m u m P o w e r (W )Copper Area (sqmm)T h e r m a l R e s i s t a n c e (°C /W )Note:11. Measured under pulsed conditions. Pulse width ≤ 300µs. Duty cycle ≤ 2%.Typical Electrical Characteristics (@ T A = +25°C, unless otherwise specified.)-I , COLLECTOR CURRENT (A)C h ,D C C U R RE N T G A I NF E Fig. 2 Typical DC Current Gain vs. Collector CurrentDC Current Gain vs. Collector Current -V , COLLECTOR-EMITTER VOLTAGE (V)CE I , C O L L E C T O R C U R R E N T (A )CFig. 1 Typical Collector Current vs. Collector-Emitter VoltageCollector Current vs. Collector-Emitter Voltage -h FE V I CI C V V CETypical Electrical Characteristics (continued.)0.20.40.60.81.0-V , B A S E -E M I T T E R T U R N -O N V O L T A G E (V )B E (O N)-I , COLLECTOR CURRENT (A)C -V , C O L L E C T O R -E M I T T E R S A T U R A T I O N V O L T A G E (V )C E (S A T )Fig. 4 Typical Collector-Emitter Saturation Voltagevs. Collector Current 0.20.40.60.81.01.2-V , B A S E -E M I T T E R S A T U R A T I O N V O L T A G E (V B E (S AT )-I , COLLECTOR CURRENT (mA)C f , G A I N -B A ND W I D T H P R O D U C T (M H z )T Fig. 6 Typical Gain-Bandwidth Product vs. Collector Current V , REVERSE VOLTAGE (V)R C A P A C I T A N C E (p F )Fig. 7 Typical Capacitance Characteristics -V B E (s a t ), B A S E -E M I T T E R S A T U R A T I O N V O L T A G E )-V B E (o n ), B A S E -E M I T T E R T U R N -O N V O L T A G E (V )-V C E (s a t ) , C O L L E C T O R -E M I T T E RC v V RVCE(sat) V I Cf T V I CPackage Outline DimensionsPlease see /package-outlines.html for the latest version.SOT89SOT89Dim Min Max TypA 1.40 1.60 1.50B 0.50 0.62 0.56B1 0.42 0.540.48c 0.35 0.43 0.38D 4.40 4.60 4.50D1 1.62 1.83 1.733D2 1.61 1.81 1.71E 2.40 2.60 2.50E2 2.05 2.35 2.20e - - 1.50H 3.95 4.25 4.10H1 2.63 2.93 2.78L 0.90 1.20 1.05L1 0.327 0.527 0.427z 0.20 0.40 0.30All Dimensions in mmSuggested Pad LayoutPlease see /package-outlines.html for the latest version.SOT89Dimensions Value(in mm)C 1.500G 0.244X 0.580X1 0.760X2 1.933Y 1.730Y1 3.030Y2 1.500Y3 0.770Y4 4.530TOP VIEW。
RG-S1926S+产品说明书
目第一章录产品概述 ...................................................................................................................................................................51.1 产品简介 ........................................................................................................................................................................5 1.2 RG-S1926S+交换机特性和规格说明............................................................................................................................5 1.3 手册说明 ........................................................................................................................................................................6 第二章 硬件安装指南 .............................................................................................................................................................8 2.1 交换机部件 ....................................................................................................................................................................8 前面板端口说明 .......................................................................................................................................................8 LED 指示灯 ...............................................................................................................................................................9 2.2 安装 ..............................................................................................................................................................................10 2.3 交换机的链接 ..............................................................................................................................................................12 与服务器及工作站相连 ..........................................................................................................................................12 与 HUB 或其它交换机相连....................................................................................................................................12 2.4 注意事项 ......................................................................................................................................................................13 第三章 交换机的配置与使用 ...............................................................................................................................................15 3.1 工作模式 .......................................................................................................................................................................15 3.2 端口配置 ......................................................................................................................................................................15 端口的四种工作模式 ..............................................................................................................................................15 端口的自动学习地址功能及自动协商的能力 ......................................................................................................15 流量控制..................................................................................................................................................................15 广播风暴控制 .........................................................................................................................................................16 端口安全..................................................................................................................................................................16 端口镜像（Port Mirror） ....................................................................................................................................16 端口带宽控制 ..........................................................................................................................................................17 3.3 VLAN ............................................................................................................................................................................17 Port VLAN................................................................................................................................................................17 802.1Q Tag VLAN ...................................................................................................................................................17 3.4 TRUNK............................................................................................................................................................................19 3.5 优先级 ...........................................................................................................................................................................21 3.6 IGMP SNOOPING ............................................................................................................................................................21 3.7 DHCP 功能....................................................................................................................................................................23 3.8 交换机文件更新 ..........................................................................................................................................................24 3.9 IEEE802.1X 认证 ..........................................................................................................................................................24 第四章 TELNET/带外管理使用说明..................................................................................................................................29 4.1 概述 ..............................................................................................................................................................................29 4.2 TELNET/带外连接方法和登录过程..............................................................................................................................29 4.3 TELNET/带外的管理界面及操作方法..........................................................................................................................30 顶层菜单..................................................................................................................................................................30 系统菜单..................................................................................................................................................................31网络菜单..................................................................................................................................................................34 端口菜单..................................................................................................................................................................40 Port VLAN 菜单 .......................................................................................................................................................43 Trunk 菜单 ...............................................................................................................................................................46 AAA 服务.................................................................................................................................................................47 安全管理菜单 ..........................................................................................................................................................51 优先级菜单 ..............................................................................................................................................................53 选择语言菜单 ..........................................................................................................................................................54 Tag VLAN 工作模式下的菜单设置 .......................................................................................................................54 Tag VLAN 模式下网络菜单 ....................................................................................................................................54 Tag VLAN 模式下端口菜单 ....................................................................................................................................55 Tag VLAN 菜单 ........................................................................................................................................................564.4 TELNET/带外管理的其它注意事项..............................................................................................................................61 第五章 基于 WEB 的管理—WBM ...................................................................................................................................625.1 RG-S1926S+ WEB SERVER 概述 ...................................................................................................................................62 5.2 RG-S1926S+ WEB SERVER 连接 ...................................................................................................................................62 5.3 RG-S1926S+ WEB SERVER 的管理界面及操作方法 ...................................................................................................63 管理界面..................................................................................................................................................................63 系统..........................................................................................................................................................................65 网络..........................................................................................................................................................................68 端口..........................................................................................................................................................................74 Port VLAN................................................................................................................................................................75 Trunk ........................................................................................................................................................................77 Tag VLAN .................................................................................................................................................................78 安全设置....................................................................................................................................................................79 5.4 WEB 管理的其它注意事项...........................................................................................................................................80 第六章 RG-S1926S+应用设置策略示例 .............................................................................................................................81第一章产品概述1.1 产品简介感谢您购买了锐捷 RG-S1926S+网管交换机。
BS62LV1600FI55中文资料
BS62LV1600FI55中⽂资料Very Low Power CMOS SRAM 2M X 8 bitBS62LV1600Pb-Free and Green package materials are compliant to RoHSn FEATURESWide V CC operation voltage : 2.4V ~ 5.5V Very low power consumption : V CC = 3.0V Operation current : 46mA (Max.) a t 55ns 2mA (Max.) at 1MHz Standby current : 1.5uA (Typ.) at 25 O C V CC = 5.0V Operation current : 115mA (Max.) a t 55ns 10mA (Max.) a t 1MHz Standby current : 6.0uA (Typ.) at 25O C ? High speed access time : -55 55ns (Max.) at V CC :3.0~5.5V -70 70ns (Max.) at V CC : 2.7~5.5V ? Automatic power down when chip is deselected ? Easy expansion with CE1, CE2 and OE options ? Three state outputs and TTL compatible ? Fully static operation ? Data retention supply voltage as low as 1.5V n DESCRIPTIONThe BS62LV1600 is a high performance, very low power CMOS Static Random Access Memory organized as 2048K by 8 bits and operates form a wide range of 2.4V to 5.5V supply voltage.Advanced CMOS technology and circuit techniques provide both high speed and low power features with typical CMOS standby current of 1.5uA at 3.0V/25O C and maximum access time of 55ns at 3.0V/85O C.Easy memory expansion is provided by an active LOW chip enable (CE1), an active HIGH chip enable (CE2), and active LOW output enable (OE) and three-state output drivers.The BS62LV1600 has an automatic power down feature, reducing the power consumption significantly when chip is deselected. The BS62LV1600 is available in JEDEC standard 44-pin TSOP II and 48-ball BGA package.n POWER CONSUMPTIONPOWER DISSIPATIONSTANDBY(I CCSB1, Max)Operating(I CC , Max)V CC =5.0V V CC =3.0V PRODUCT FAMILYOPERATING TEMPERATUREV CC =5.0V V CC =3.0V1MHz10MHzf Max. 1MHz10MHzf Max.PKG TYPEBS62LV1600EC TSOP II-44 BS62LV1600FC Commercial +0O C to +70O C 50uA 8.0uA 9mA 48mA 113mA 1.5mA 19mA 45mABGA-48-0912 BS62LV1600EITSOP II-44 BS62LV1600FIIndustrial -40O C to +85O C100uA 16uA 10mA 50mA 115mA 2mA 20mA 46mABGA-48-0912n PIN CONFIGURATIONSn BLOCK DIAGRAMBrilliance Semiconductor, Inc. reserves the right to change products and specifications without notice.G H F E D C B A 1 2 3 4 5 6 A9 A11 A10 A19A12 A14 A13 A15 WE NC NC NC DQ7 A17 A16 A7 VSS VCC DQ2 DQ1 DQ6 DQ5 NC A5 OE A3 A0 A6 A4 A1A2CE2 NC NC NCCE1 DQ4 NC 48-ball BGA top view NC NC DQ0 VSS VCC DQ3 NC A18 A20 A8n TRUTH TABLEn ABSOLUTE MAXIMUM RATINGS (1)SYMBOL PARAMETER RATING UNITSV TERM Terminal Voltage withRespect to GND-0.5(2) to 7.0 VT BIAS Temperature UnderBias-40 to +125 O CT STG Storage Temperature -60 to +150 O CP T Power Dissipation 1.0 WI OUT DC Output Current 20 mA1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.2. –2.0V in case of AC pulse width less than 30 ns. n OPERATING RANGERANGAMBIENTTEMPERATUREV CC Commercial 0O C to + 70O C 2.4V ~ 5.5VIndustrial -40O C to + 85O C 2.4V ~ 5.5Vn CAPACITANCE (1) (T A = 25O C, f = 1.0MHz) SYMBOL PAMAMETER CONDITIONS MAX. UNITS C INInputCapacitanceV IN = 0V 10 pFC IOInput/OutputCapacitanceV I/O = 0V 12 pF1. This parameter is guaranteed and not 100% tested.n DC ELECTRICAL CHARACTERISTICS (T A =-40O C to +85OC)1. Typical characteristics are at T A =25O C and not 100% tested.2. Undershoot: -1.0V in case of pulse width less than 20 ns.3. Overshoot: V CC +1.0V in case of pulse width less than 20 ns.4. F MAX =1/t RC.5. I CC(MAX.) is 45mA/113mA at V CC =3.0V/5.0V and T A =70O C.6. I CCSB1(MAX.) is 8.0uA/50uA at V CC =3.0V/5.0V and T A =70O C.n DATA RETENTION CHARACTERISTICS (T A = -40O C to +85OC)1. V CC =1.5V, T A =25O C and not 100% tested.2. t RC = Read Cycle Time.3. I CCRD(Max.) is4.0uA at T A =70O C.n LOW V CC DATA RETENTION WAVEFORM (1) (CE1 Controlled)Data Retention Mode V CCt CDRV CC t RV IHV IHCE1≧V CC - 0.2V V DR ≧1.5V CE1V CCn LOW V CC DATA RETENTION WAVEFORM (2) (CE2 Controlled)n AC TEST CONDITIONS (Test Load and Input/Output Reference)Input Pulse Levels Vcc / 0V Input Rise and Fall Times 1V/ns Input and Output Timing Reference Level 0.5Vcc t CLZ , t OLZ , t CHZ , t OHZ , t WHZ C L = 5pF+1TTL Output LoadOthersC L = 30pF+1TTL1. Including jig and scope capacitance.n KEY TO SWITCHING WAVEFORMSn AC ELECTRICAL CHARACTERISTICS (T A = -40O C to +85OC)READ CYCLECE2 Data Retention Mode V CC t CDR V CC t R V ILV IL V CCV DR ≧1.5V CE2≦0.2V 1 TTL ALL INPUT PULSES→← 90%V CC GND Rise Time : 1V/ns Fall Time : 1V/ns90%→← 10%10%n SWITCHING WAVEFORMS (READ CYCLE)READ CYCLE 1 (1,2,4)READ CYCLE 2 (1,3,4)READ CYCLE 3 (1, 4)NOTES:1. WE is high in read Cycle.2. Device is continuously selected when CE1 = V IL and CE2= V IH .3. Address valid prior to or coincident with CE1 transition low and/or CE2 transition high.4. OE = V IL .5. Transition is measured ± 500mV from steady state with C L = 5pF. The parameter is guaranteed but not 100% tested. t RC t OHt AA D OUT ADDRESS t OHD OUTCE2 CE1D OUTCE2 CE1 OE ADDRESSn AC ELECTRICAL CHARACTERISTICS (T A = -40OC to +85OC)WRITE CYCLEn SWITCHING WAVEFORMS (WRITE CYCLE)WRITE CYCLE 1 (1)t WCt WR1(3)t CW(11)t CW(11)t WP(2)t AWt OHZ(4,10)t AS t WR2(3)t DHt DWD IND OUTWECE2CE1OEADDRESS(5)(5)WRITE CYCLE 2 (1,6)NOTES:1. WE must be high during address transitions.2. The internal write time of the memory is defined by the overlap of CE1 and CE2 active and WE low. All signals must be active to initiate a write and any one signal can terminate a write by going inactive. The data input setup and hold timing should be referenced to the second transition edge of the signal that terminates the write.3. t WR is measured from the earlier of CE1 or WE going high or CE2 going low at the end of write cycle.4. During this period, DQ pins are in the output state so that the input signals of opposite phase to the outputs must not be applied.5. If the CE1 low transition or the CE2 high transition occurs simultaneously with the WE low transitions or after the WE transition, output remain in a high impedance state.6. OE is continuously low (OE = V IL ).7. D OUT is the same phase of write data of this write cycle. 8. D OUT is the read data of next address.9. If CE1 is low and CE2 is high during this period, DQ pins are in the output state. Then the data input signals of opposite phase to the outputs must not be applied to them. 10. T ransition is measured ± 500mV from steady state with C L = 5pF. The parameter is guaranteed but not 100% tested. 11. t CW is measured from the later of CE1 going low or CE2 going high to the end of write.D IND OUTWE CE2 CE1ADDRESSn ORDERING INFORMATIONBSI (Brilliance Semiconductor Inc.) assumes no responsibility for the application or use of any product or circuit described herein. BSI does not authorize its products for use as critical components in any application in which the failure of the BSI product may be expected to result in significant injury or death, including life-support systems and critical medical instruments.n PACKAGE DIMENSIONSTSOP II-44n PACKAGE DIMENSIONS (continued)3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS.1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS. 2: PIN#1 DOT MARKING BY LASER OR PAD PRINT.N EDNOTES:4812.09.0E1D1e3.755.250.75 48 mini-BGA (9mm x 12mm)n Revision HistoryRevision No. History Draft Date Remark2.2 Add Icc1 characteristic parameter Jan. 13, 2006Improve Iccsb1 spec.I-grade from 220uA to 100uA at 5.0V20uA to 16uA at 3.0VC-grade from 110uA to 50uA at 5.0V10uA to 8.0uA at 3.0V2.3 Change I-grade operation temperature range May. 25, 2006 - from –25O C to –40O C。
Watts Classic Series ES-ACV-SB-LFF115_LFF1115 型号产品
Watts product specifications in U.S. customary units and metric are approximate and are provided for reference only. For precise measurements, please contact Watts Technical Service. Watts reserves the right to change or modify product design, construction, specifications, or materials with-out prior notice and without incurring any obligation to make such changes and modifications on Watts products previously or subsequently sold.ES-ACV-SB-LFF115_LFF1115LFF115 (Globe) LFF1115 (Angle)Pressure Reducing Control Valve*The wetted surface of this product contacted by consumable water contains less than 0.25% of lead by weight.Standard Components(3)(3)(3)(2)(2)(1)(1)Standard 3" & Smaller Standard 4" & Larger Optional All Sizes(3)(2)(1)Schematics• Throttles to reduce high upstream pressure to constant lower downstream pressure1 – Main Valve (Single Chamber)2 – Pressure Reducing Control3 – Fixed Orifice• Reducing setpoint is adjustableOperationsThe Watts ACV Pressure Reducing Control Valve is designed to automatically reduce a fl uctuating higher upstream pressure to a constant lower downstream pressure regardless of varying fl ow rates. It is con-trolled by a normally open, pressure reducing pilot designed to: 1) Open (allowing fl uid out of the main valve cover chamber) when downstream pressure is below the adjustable setpoint, and 2) Close (allowing fl uid to fi ll the main valve cover chamber) when downstream pressure is above the adjustable setpoint. A decrease in downstream pressure causes the valve to modulate toward an open position, raising downstream pres-sure. An increase in downstream pressure causes the valve to modulate toward a closed position, lowering downstream pressure.○X – Isolation Cocks ○FC – Flo-Clean Strainer ○Y – Y-Strainer (Replaces Flo-Clean) ○ACS – Adjustable Closing Speed(Replaces Fixed Orifi ce) ○AOS – Adjustable Opening Speed ○P – Position Indicator ○L – Limit Switch Options & Accessories2C lassiC s eriesLFF115 (Globe)LFF1115 (Angle)Body & Cover: Ductile Iron ASTM A536Coating:NSF Listed Fusion Bonded Epoxy Lined and Coated Trim:316 Stainless SteelElastomers: Buna-N (standard) EPDM (optional)Viton (optional)Stem, Nut & Stainless SteelSpring:MaterialsGlobeAngleOperating PressureOperating TemperaturePilot SystemTubing & FittingsThreaded = 400 psi Buna-N: 160°F Maximum Reducing Control Copper / Brass (Standard)150 Flanged = 250 psi EPDM: 300°F Maximum 20-175 psi (Standard)Stainless Steel (Optional)300 Flanged = 400 psiViton: 250°F Maximum0-30 psi (Optional)100-300 psi (Optional)Valve Cover Chamber CapacityValve TravelDimensionsABCDEFGHIJKLMVALVE SIZE GLOBE THRD.GLOBE 150#GLOBE 300#COVER TO CENTER ANGLE THRD.ANGLE 150#ANGLE 300#ANGLE THRD.ANGLE 150#ANGLE 300#PORT SIZE PORT SIZE PORT SIZE SHIPPING WEIGHTS*1-1/47-1/43-1/23-1/41-7/81/41/21/8151-1/27-1/48-1/293-1/23-1/441-7/841/41/21/81529-3/89-3/8104-15/16444-1/4444-1/41/21/21/4352-1/2111111-5/875-1/25-1/25-13/16444-5/161/21/23/865310-1/21213-1/475-1/45-3/46-1/85-1/45-3/46-1/81/21/23/89541515-5/88-5/86-3/47-1/86-3/47-1/81/21/23/81906202111-3/48-1/28-7/88-1/28-7/81/21/21/2320825-3/826-3/815-3/41111-1/21111-1/21/211/26501029-3/431-1/818-3/414-7/815-5/814-7/815-5/81119401234 35-1/220-5/81717-3/41717-3/411115001439 40-1/222-1/411116751641-3/843-1/226-1/41113100*Estimated in lbs.Valve Size (in)1-1/41-1/222-1/2346810121416fl.oz. 44410102270U.S. Gal1-1/42-1/246-1/29-1/2Valve Size (in)1-1/41-1/222-1/2346810121416Travel (in)3/83/81/25/83/411-1/222-1/233-1/243C lassiC s eriesSizingCAVITATION ZONEINLET PRESSURE - PSI OUTLET PRESSURE - PSI30028026024022020018016014012010080604020102040506070809013014012011010030After selecting the valve size, locate inlet and outlet pressures on this chart. If the intersection point falls in the shaded area, cavitation can occur. Operation of valves continually in the cavitation zone should be avoided. Consult Watts ACV for alternatives.Cavitation ChartSize (in)1-1/41-1/222-1/2346810Maximum Continuous (GPM)95130210300485800185031005000Maximum Intermittent (GPM)1191612653905901000230040006250Minimum Continuous (GPM)111203050115200300Maximum continuous fl ow based on velocity of 20 ft. per second. Maximum intermittent fl ow based on velocity of 25 ft. per second. Minimum continuous fl ow based on velocity of 1 ft. per second.NOTE: The above chart is a suggested guide. Inlet pressure, outlet pressure, minumum, normal and maximum fl ow rates shouldbe considered for specifi c valve sizing. Contact Watts ACV for details.LFF115 (Globe)LFF1115 (Angle)4C lassiC s eriesITEM DESCRIPTION MATERIAL1Cover ASTM A536 65-45-12 Epoxy Coated Ductile Iron 2Cover Bearing SAE 841 Bronze3Shaft / Stem ASTM A276 304 Stainless Steel 4Stud ASTM A570 Gr.33 Zinc Plated Steel 5Cover Nut ASTM A570 Gr.33 Zinc Plated Steel 6Diaphragm*Buna-N (Nitrile)7Body ASTM A536 65-45-12 Epoxy Coated Ductile Iron 8Quad Seal*Buna-N (Nitrile)9Seat Ring ASTM A743 CF8M (316) Stainless Steel 10Spring ASTM A276 302 Stainless Steel 11Stem NutASTM A276 304 Stainless Steel12Diaphragm Washer ASTM A536 65-45-12 Epoxy Coated Ductile Iron 13SpacerASTM A276 304 Stainless Steel14Quad Seal Retainer ASTM A536 65-45-12 Epoxy Coated Ductile Iron 15O-Ring*Buna-N (Nitrile)16Quad Seal Plate ASTM A743 CF8M (316) Stainless Steel 17Seat Gasket*Buna-N (Nitrile)* Contained in Main Valve Repair KitLFF115 (Globe)LFF1115 (Angle)C lassiC s eries Cross Sectional DetailITEM NUMBER DESCRIPTION1Adjusting Screw DESCRIPTIONLFF115 (Globe)LFF1115 (Angle)Outlet Inlet GaugePressure Reducing PilotModel LF263AP56C lassiC s eriesLFF115 (Globe)LFF1115 (Angle)InstallationsStart-UpProper Automatic Control Valve startup requires bringing the valve into service in a controlled manner. All adjustments to control pilots and speed controls should be made slowly, allowing the valve to respond and the system to stabilize.Control Valves should be set-up in a dynamic (flowing) condition for proper start-up. Provisions for flow must be made to insure proper settings.1. Close upstream and downstream valves to isolate the valve from line pressure. Release spring ten-sion on Pressure Reducing Control by turning adjustment screw out (counterclockwise), decreas-ing setpoint. Open all Isolation Ball Valves, if so equipped. If valve is fitted with adjustable speed controls, turn needle(s) in (clockwise) until seated, and return out (counterclockwise) 11/2 to 21/2 turns. These are approximate settings, and should be fine tuned to suit system requirements after pressure adjustments have been made.2. Slowly open upstream isolation valve to allow controlled filling of the valve. Vent entrapped air bycarefully loosening control tubing or pipe plug at the highest point possible. If valve is equipped with a Position Indicator, open Air Bleed Petcock to vent air. Water will be milky in appearance and will begin to clear as air is vented. Carefully loosen enough cover screws on control pilot(s) to vent entrapped air. Retighten when water vents clearly.3. Setting Reducing Control: Slowly open downstream isolation valve. Gradually turn adjustmentscrew on the Pressure Reducing Control in (clockwise) to raise downstream pressure. Allow valve and system to stabilize. Observe inlet and outlet pressure gauges. Continue to adjust as needed, pausing approximately every 11/2 turns, allowing valve and system to stabilize. Turning adjustment screw clockwise raises outlet pressure. Turning adjustment screw counterclockwise lowers outlet pressure. When desired downstream pressure is reached, tighten locknut on adjustment screw.4. Fine tune Speed Controls to suit system requirements. Adjust Closing Speed Control (if equipped)clockwise for slower closure, and counterclockwise for faster closure. Adjust Opening Speed Control (if equipped) clockwise for slower opening, and counterclockwise for faster opening.• Prior to installation, flush line to remove debris.• Install valve horizontally “in line” (cover facing up), so flow arrow matches flow through the line. Avoid installing valves 6" and larger vertically. Consult factory prior to ordering if installation is other than described.• Install inlet and outlet isolation valves.When using butterfly valves, insure disc does not contact control valve. Damage or improper valve seating may occur.• Provide adequate clearance for valve servicing and maintenance.• Install pressure gauges to monitor valve inlet and outlet pressure.• If installation is subjected to very low flow or potentially static conditions, it is recommended a pressure relief valve (1/2" minimum) be installed downstream of the Pressure Reducing Valve for additional system protection.C lassiC s eries SpecificationsLFF115 (Globe) LFF1115 (Angle)The Lead Free* Pressure Reducing Control Valve shall be a pilot operated diaphragm valve designed to automatically reduce a fluctuating higher upstream pressure to a constant lower downstream pressure re-gardless of varying flow rates.The main valve shall be a hydraulically operated, single diaphragm actuated, globe or angle pattern valve. Y-pattern valves shall not be permitted. The valve shall contain a disc and diaphragm assembly that forms a sealed chamber below the valve cover, separating operating pressure from line pressure. The diaphragm shall be constructed of nylon reinforced Buna-N, and shall not seal directly against the valve seat and shall be fully supported by the valve body and cover. Rolling diaphragm construction will not be allowed and there shall be no pistons operating the main valve or any pilot controls.The main valve body and cover shall be Ductile Iron ASTM A536, and all internal cast components shall be Ductile Iron or CF8M (316) Stainless Steel. All Ductile Iron components, including the body and cover, shall be lined and coated with an NSF 61 Certified Epoxy Coating applied by the electrostatic heat fusion process. All main valve throttling components (valve seat and disc guide) shall be Stainless Steel. The valve body and cover must be machined with a 360-degree locating lip to assure proper alignment.The disc and diaphragm assembly shall contain a Buna-N synthetic rubber “Quad Seal” that is securely re-tained on 3-1/2 sides by a disc retainer and disc guide. Diaphragm assemblies utilizing bolts or cap screws for component retention will not be permitted.The exposed portion of the Quad Seal shall contact the valve seat and seal drip-tight. The disc and dia-phragm assembly must be guided by two separate bearings, one installed in the valve cover and one con-centrically located within the valve seat, to avoid deflection and assure positive disc-to-seat contact. Center guided valves will not be permitted. All necessary repairs shall be made from the top of the valve while the body remains in line.Pilot control systems for valves 3" and smaller shall contain a Flow Clean Strainer, Fixed Orifice Closing Speed, Adjustable Opening Speed Control and Pressure Reducing Pilot. Pilot control systems for valves 4" and larger shall contain an external Y-Strainer, Fixed Orifice Closing Speed, Pressure Reducing Pilot and Isolation Ball Valves on all body connections. All pilot control systems shall utilize copper tubing and brass fittings regardless of valve size. The adjustment range of the pressure reducing pilot shall be 30-300 psi. The valve shall be Watts ACV Model LFF115 or (Globe) or LFF1115 (Angle) pattern Pressure Reducing Control Valve.Other Watts ACV Pressure Reducing Control ValvesLFF115-3 / LFF1115-3 Pressure Reducing Valve with Hydraulic Check FeatureLFF115-7 / LFF1115-7 Pressure Reducing Valve with Downstream Surge Control FeatureLFF115-74 / LFF1115-74 Pressure Reducing Valve with Low Flow By-Pass*The wetted surface of this product contacted by consumablewater contains less than 0.25% of lead by weight.7ES-ACV-SB-LFF115_LFF1115 1410 © 2014 WattsUSA: Tel: (713) 943-0688 • Fax: (713) 944-9445 •。
7106芯片资料
第三章 万用表的电路原理及装配
3.1万用表的基本结构：
3.1.4 液晶显示概述 数字万用表的液晶显示器是采用段电极显
示的方式来实现的，也就是液晶显示器的前部 电极被分割成a,b,c,d,e,f,g七段，各段电极 a,b,c,d,e,f,g与“7106”集成电路芯片中的 “BP”引脚，也叫背电极。背电极也是前部电 极的共用电极。若是各段前部电极与背电极之 间电位相等时，则液晶不显示。若某一段或几 段前部电极与背电极存在电位差时，则液晶显 示。这样就可以根据被测参数的实际情况分别 显示十进制中的1，2，3，4，5，6，7，8， 9，0这十个数。
14 G1
一般规定为7～15V，常选用9V叠层电
E1 15
池，消耗电流仅为1.8mA，功耗仅为
16 D2
16mW。
C2 17
+
OSC2
OSC3 INTEN
00
7106
型值为1010Ω，对输入信号无衰减作用。 A2 19
并且，外围电路简单，可直接驱动 LCD
T
2
=
T
1
⋅
Vin V REF
−−−−−−
T 2 = N ⋅ T CP − − − − − −
N
=
T1 T CP ⋅V REF
⋅ Vin
−−−−−−
第三章 万用表的电路原理及装配
结论：等式左端的脉冲计数值N 与被测电压Vin成正比，并且通过正反 两次积分后实现了模拟量转换成数字 量。
然后通过液晶显示器读出被测参 数值。
第三章 万用表的电路原理及装配
积分器输入
当反向积分一结束，A/D转换器又
BL-S36A-11S-01中文资料
Iv TYP.(mcd
)
17
13
13
13
BL-S36A-11UG-XX BL-S36B-11UG-XX Ultra Green
AlGaInP
574 2.20 2.50
15
BL-S36A-11PG-XX
BL-S36B-11PG-XX
Ultra Pure Green InGaN
525 3.80 4.50
元器件交易网
LED NUMERIC DISPLAY, 1 DIGIT BL-S36X-11
Package configuration & Internal circuit diagram
Notes: 1. All dimensions are in millimeters (inches)
BL-S36B-11Y-XX
Yellow
GaAsP/GaP
585 2.10 2.50
10
BL-S36A-11G-XX
BL-S36B-11G-XX
Green
GaP/GaP
570 2.20 2.50
10
Ultra Bright
Electrical-optical characteristics: (Ta=25 ) (Test Condition: IF=20mA)
Ref Surface Color White
Epoxy Color
Water
clear
1
2
3
4
5
Black White diffused
Gray Red Diffused
Red Green Diffused
Green Yellow Diffused
bosch ISC
ISC-PPR1-W16 Professional 系列被动红外探测器非常适合室内商业环境。
传感器数据融合技术可以确保探测器能够依据准确的信息发送报警状态。
三焦距光学技术消除了探测盲区，并能高效地对入侵者做出响应。
Professional 系列集各种独特、强大的功能于一身，提供卓越的捕获性能，并从根本上消除了误报。
自锁双体式外壳、内置水平仪、灵活调整的安装高度以及三种可选的安装支架，帮助简化安装和缩短维护时间。
基本功能传感器数据融合技术传感器数据融合技术是一项非常独特的功能，它使用强大的软件算法收集来自多个传感器的数据：两个热电传感器、一个室温传感器和一个白光强度传感器。
微控制器能够分析和比较传感器数据，从而为保安领域提供最精确的报警决策。
三焦距光学技术三焦距光学技术采用具有三种特定焦距的光学元件：长焦范围、中焦范围和短焦范围。
探测器可将这三种焦距应用于 86 个探测防区，从而组合成 11 个严密的探测网。
此外，三焦距光学技术还包括两个热释电传感器，拥有双倍的标准光学增益。
传感器可以处理多个数据信号，性能精确，真正消除了误报。
主动白光抑制内部光传感器可以测量照射在探测器表面的光照强度。
传感器数据融合技术利用此信息来消除强光源导致的误报。
可选探测范围（16 米 x 21 米或 8 米 x 10 米）安装人员可以使用拨码开关选择 16 米 x 21 米或 8 米 x 10 米（50英尺 x 70 英尺或 25 英尺 x 33 英尺）探测范围。
动态温度补偿探测器能够自动调整被动红外线的灵敏度，即使在临界温度下也可以探测入侵者。
动态温度补偿技术准确探测人体热量，避免误报，并能在各种操作温度下提供一致的捕捉性能。
外壳/墙壁防拆开关当入侵者卸下外壳或尝试从墙壁卸下探测器时，常闭触点将会打开，向控制主机发出报警。
自调 LED 指示灯LED 指示灯能够自动调整亮度，从而与周围的光照强度和谐一致。
在步测期间，蓝色发光二极管 (LED) 将会指示报警条件并进入活动状态。
ISC技术规格参数
ISC技术参数55寸智能平板规格参数显示屏参数屏类型TFT LCD屏标准A规显示区域1209.6(H) x 680.4 (V)分辨率1209.6(H) x 680.4 (V)亮度500 cd/㎡对比度5000：1响应时间< 5.5ms色彩总数1073.7M（10-bit 4通道低压差分信号）刷新频率100Hz/120Hz(FRC技术)可视角度> 178°寿命> 50000小时触摸书写系统识别原理红外光学识别响应时间< 8ms触摸有效时间> 5 mm扫描频率100Hz扫描精度4096×4096通信方式全速USB书写方式任意不透明直径大于5mm的物体书写屏表面物理钢化莫氏7级防爆，防反光、防眩、防散射（可选）触摸框前维护触摸框模块化前置，方便维护电视系统彩色制式PAL/SECAM频道数199输入阻抗75 Ohm射频连接类型IEC模拟SCALER MTK8222高频头TDQ-6F6梳状滤波器3D COMB filter高频接口 1AV输入（黄、白、 1红）AV输出（黄、白、1红）1色差 (4pinDIN)YPBPR（绿蓝红） 21VGA输入(15针D-Sub)PC-AUDIO输入 1高清多媒体接2口（HDMI）同轴输出（橙） 1耳机输出 1声音输出功率2*10W扬声器数 4体感游戏（特定内置家庭、办公娱乐体感游戏型号）不需要打开电脑，即可播放音频、视频和图片USB多媒体播放功能PC系统主芯片AMD Athlon II X2 240 双核心处理器，主频2.8G 主板YESTON A785显卡ATI HD4200声卡集成声卡网卡集成10/100/1000M自适应网卡内存2G DDRIII硬盘320G SATA操作系统Windows XP/Windows 7USB（A口） 4USB（B口） 1网际接口RJ45 1VGA输出 1耳机 1电源参数输入电源220V AC 50/60Hz整机功耗﹤300W待机功耗﹤3W工作环境工作温度0℃-40℃工作湿度10% - 95%贮存温度-10℃-60℃贮存湿度10% - 95%外观尺寸底架（选配）壁挂架、移动支架屏幕钢化NG玻璃整机尺寸1350x820x135mm整机包装尺寸1600x990x320mm重量59kg±3kg外观无锐角安全设计，边角部位采用平滑圆弧过渡，细缝接合均匀65寸智能平板规格参数显示屏参数屏类型TFT LCD屏标准A规显示区域1428.48 (H) x 803.52 (V)分辨率1920 x1080亮度500 cd/㎡对比度5000：1响应时间< 5.5ms色彩总数1073.7M（10-bit 4通道低压差分信号）刷新频率100Hz/120Hz(FRC技术)可视角度> 178°寿命> 50000小时触摸书写系统识别原理红外光学识别响应时间< 8ms触摸有效时间> 5 mm扫描频率100Hz扫描精度4096×4096通信方式全速USB书写方式任意不透明直径大于5mm的物体书写屏表面物理钢化莫氏7级防爆，防反光、防眩、防散射（可选）触摸框前维护触摸框模块化前置，方便维护电视系统彩色制式PAL/SECAM频道数199输入阻抗75 Ohm射频连接类型IEC模拟SCALER MTK8222高频头TDQ-6F6梳状滤波器3D COMB filter高频接口 1AV输入（黄、白、1红）1AV输出（黄、白、红）1色差 (4pinDIN)YPBPR（绿蓝红） 2VGA输入(15针1D-Sub)PC-AUDIO输入 12高清多媒体接口（HDMI）同轴输出（橙） 1耳机输出 1声音输出功率2*10W扬声器数 4体感游戏（特定内置家庭、办公娱乐体感游戏型号）不需要打开电脑，即可播放音频、视频和图片USB多媒体播放功能PC系统主芯片AMD Athlon II X2 240 双核心处理器，主频2.8G 主板YESTON A785显卡ATI HD4200声卡集成声卡网卡集成10/100/1000M自适应网卡内存2G DDRIII硬盘320G SATA操作系统Windows XP/Windows 7USB（A口） 4USB（B口） 1网际接口RJ45 1VGA输出 1耳机 1电源参数输入电源220V AC 50/60Hz整机功耗﹤400W待机功耗﹤3W工作环境工作温度0℃-40℃工作湿度10% - 95%贮存温度-10℃-60℃贮存湿度10% - 95%外观尺寸底架（选配）壁挂架、移动支架屏幕钢化NG玻璃整机尺寸1600×960×150mm整机包装尺寸1820×1120×320mm重量74kg±3kg外观无锐角安全设计，边角部位采用平滑圆弧过渡，细缝接合均匀VGA矩阵VGA特性增益0dB带宽350MHz（-3dB）满载微分相位0.05º@4.43 MHz微分增益0.05% @4.43 MHz最大传播延时5nS(±1nS)切换速度≤150nSVGA输入信号类型VGA信号接口VGA D型15针最小电平0.5Vp-p最大电平 1.0Vp-p阻抗75Ω回波损耗-30dB@5MHzVGA输出信号类型VGA信号接口VGA D型15针输出电平0.75Vp-p阻抗75Ω回波损耗-30dB@5MHz直流补偿最大5mV同步信号特性输入/输出信号TTL类型输入电平0V-5Vp-p输出电平TTL: 5Vp-p输出阻抗75Ω极性正或负（与输入一致）音频特性增率0dB频率响应20 Hz ~ 20 kHz0.05% @ 1 kHz （额定电压下）总谐波失真+噪声（CMRR） >75dB @: 20 Hz ~ 20 kHz共态抑制比（CMRR）音频输入信号类型立体声，平衡接口5PIN接口阻抗>10KΩ最大电平+21dBu音频输出信号类型立体声，平衡接口5PIN接口阻抗>470Ω最大电平+21dBu控制类型串行控制接口RS-232，9-针母D型接口波特率9600数据位8位停止位无奇偶校验位2=TX，3=RX，5=GND串行控制口结构规格电源100VAC ~ 240VAC, 50/60 Hz, 国际自适应电源功率≤30W存储环境温度-20°C ~ +150°C工作环境温度-10°C ~ +55°C相对湿度20% ~ 95%50，000小时平均无故障时间会议专用音箱灵敏度87dB（1W/1M）频率响应50Hz-17KHz单元构成Low 5.5”*1 ,Hi 1”*1同轴输入功率50W-100W储存温度-20℃-60℃阻抗8Ω尺寸（H×W×D）220×155×133mm重量 2.5Kg双通道无线麦克风频率响应50-22,000 Hz，可选择成50-12,000 Hz 模式通道双通道/系统无线频率 1.92 to 1.93 GHz (UPCS 北美) ，1.88 to 1.90 GHz (DECT 欧洲)覆盖范围100’ (30米) 大约值. (无遮挡)Executive HD 基100-240V AC, 50-60 Hz, 15W (通用输入)站电源需求HD 充电基座电20W源需求电池锂电池，8小时连续发言时间充电时间2小时加密128-bit 专利技术(每一个麦克风通道)环境需求工作温度40° to 100° F (5° to 40° C)，湿度20% to 85%RAV600和900尺寸RAV43.2厘米 X 19.1厘米 X 5.1厘米RF控制器10.5”X 4.5”X 2.75”麦克半径17.8厘米，高度3.8厘米重量RAV 2.04公斤RF控制器0.91公斤麦克0.5公斤运行环境温度华氏32º to 122º湿度15% to 80%电源电压100 — 240VAC 50–60 Hz 自适应麦克范围360º链接5类线RJ-45，Link In/Out端口最大距离15米（RAV 900），23米（RAV 600）频响范围60Hz — 14 KHz (+/-1dB)总谐波失真>0.08% （-45dBu 输入@ 1 KHz）灵敏度-45dBu输入电平-6dBu（1 KHz 94dBSPL）动态范围65dB线路输入链接非平衡式RCA插头增益-10dBu(正常)，调节范围：-14dBu to +18dBu 正常电平-10 dBu最大电平+9 dBu阻抗>10Kohm线路输出链接非平衡式RCA插头正常电平-10dBu，调节范围：-14dBu to +18dBu最大电平+9 dBu频响范围40Hz — 15 KHz(+/-1dB)动态范围80dB总谐波失真<0.02% （+6dBu 输入@ 1 KHz）阻抗>10Kohm重放/录音输入链接非平衡式RCA插头增益-10dBu，调节范围：-14dBu to +18dBu正常电平-10 dBu最大电平+9 dBu阻抗>10Kohm重放/录音输出链接非平衡式RCA插头正常电平-10dBu，调节范围：-14dBu to +18dBu 最大电平+9 dBu频响范围40Hz — 15 KHz(+/-1dB)动态范围>80dB总谐波失真<0.02% （+6dBu 输入@ 1 KHz）阻抗>10Kohm音箱链接左、右按压式端子功率8Ohm负载10W阻抗8 Ohm频响范围60 Hz — 15 kHz(+/-1dB)动态范围>80dB总谐波失真<0.5% （+5dBu 线路输入@ 1 KHz）输出电平90dBSPL 输出 @ 1米混音器回声消除尾音时间128 ms自适应噪音消除6—18dB门控自适应环境电平、第一麦克优先、NOM衰减电话接口条件所有测量都是在ALC禁止的情况下完成的连接RJ-11接口尾音时间30 ms频响范围 250 Hz — 3.3 kHz(+/-1dB) 总谐波失真<0.2%（+7dBu 线路输入@ 1 KHz）动态范围>60dB通讯输入/输出端口10/100M以太网控制端口带LED指示器的RJ-45接口RS-232控制接口DB9，波特率57600（缺省），8位数据位，1位停止位，无奇偶校验，硬件流控on（缺省）/offVISCA摄像头端口DIN，波特率9600，无流控USB 1.1配置端口附加端口AMX NXD-700ViNXD-700Vi 特性显示类型7" 彩色有源液晶显示分辨率16 x 9 (800 x 480 )亮度350 +cd/m对比度200 :1可视范围 6.00" x 3.60"可视角100° (任意角度)显示颜色256K (18 位色深)内存模块扩展内存模块64MB闪存128MB 闪存，已预载演示页面 (可升级至 1GB) 电源电源类型1.4 A @ 12.0 伏直流电压（有线连接）2.8 A @ 12.0 伏直流电压（带电池底座及充电时）机械特性尺寸15.04 cm x 20.21 cm x 8.45 cm重量0.839 公斤IPAD屏基本参数操作系统IOS处理器A4，1GHz存贮容量16GB显示屏屏幕尺寸9.7英寸屏幕分辨率1024×768屏幕描述多点触摸IPS屏，防指纹涂层，LED指取设备触摸屏网络连接WiFi功能支持802.11a/b/g/n无线协议蓝牙功能支持音频视频声音系统内置音效芯片外置接口音频接口 3.5mm耳机接口，3.5mm麦克风接口其他接口苹果Dock接口电源参数电池类型锂电池续航类型使用时间：10小时左右待机时间：超过1个月外观参数产品尺寸242.8×189.7×13.4mm产品重量692g机壳材质镁合金材质机壳颜色银色平板电脑附件包装清单平板电脑主机x1 连接线x1说明书x1 充电器x1可选配件iPad Keyboard Dock（键盘底座）iPad Case（原装皮套）iPad Camera Connection Kit（相机连接套件）iPad Dock（充电底座）iPad 10W USB Power Adapter（充电器）iPad Dock Connector to VGA Adapter（转换线）Apple Wireless Keyboard（蓝牙键盘）Apple In-Ear Headphones with Remote and Mic（耳机）Apple Earphones with Remote and Mic（线控耳机）Apple Composite A V Cable（视频连接线）双飞燕无线键鼠套装键盘参数键盘类型无线键盘性能净重:650g（加电池后672g）标准104键盘按键寿命:2000万次鼠标参数鼠标类型无线光电鼠标性能分辨率为3200dpi，五档切换精确自定义48K记忆体，存储绝招编程30G加速度单重:83g（加电池后130g）7个功能快捷键。
tmIoT模组 Transmitter 系列 S2C_4111 硬件使用手册说明书
tmIoT®模组Transmitter系列S2C_4111 硬件使用手册4通道0~10V模拟电压采集& 4通道0~10V模拟电压输出修订版本：免责声明本文档中的信息如有更改，恕不另行通知，并且不代表宁波弘讯软件开发有限公司的承诺。
宁波弘讯软件开发有限公司按原样提供此文档，不作任何形式的保证或暗示，包括但不限于其特定目的。
宁波弘讯软件开发有限公司保留对本手册或产品进行改进和/或更改的权利和/或本手册中描述的程序。
本手册中提供的信息旨在准确可靠。
但是宁波弘讯软件开发有限公司不对其使用或任何侵权承担任何责任。
本手册可能包含意外的印刷错误。
我们会定期对此处的信息进行更改，以纠正此类错误，并将这些更改合并到新版本手册中。
目录1.tmIoT®模组 (5)1.1 tmIoT®平台简介 (5)1.2 tmIoT®模组分类 (5)1.3 tmIoT® Transmitter 系列选型 (6)2.S2C_4111 (7)2.1产品简介及功能说明 (7)2.2产品基本参数 (7)2.3产品硬件配置 (8)2.3.1产品外形尺寸 (8)2.3.2接线端口定义 (9)2.4产品接线方式 (10)2.4.1模拟电压采集接线方式 (10)2.4.2模拟电压输出接线方式 (10)2.4.3 CAN通讯接线说明 (10)2.4.4 USB通讯接线说明 (11)2.5产品指示灯说明 (12)2.6安装方式 (13)附录A：联系方式 (15)1.tmIoT®模组1.1 tmIoT®平台简介tmIoT®模组应弘讯在物联网产业中的角色定位，在现有技术平台框架内，参考SIEMENS、Pilz 等欧洲先进工控厂商的技术经验,汇整出的具有弘讯特色的IoT 模组。
模组以工业通讯协议转换仪（Gateway）、IO 模块（IO Module）、传感变送器（Transmitter）、微型智能控制器（Smart Controller）为主要支干，搭载弘讯可视化云端逻辑组态工具（tmIoT Studio），能够快速把工业设备连接起来，进行信息交换和通讯，以实现智能化识别、定位、跟踪、监控和管理，从而大幅度提高制造效率，改善产品质量，降低产品成本和资源消耗。
bbc bircher ag xl-cp42ax xl-cp49ax xl-cp56ax xl-cp
1XL-CP42Ax / XL-CP49Ax / XL-CP56Ax / XL-CP56Bx / XL-CP74Ax / XL-CP80Ax / XL-CP80Bx / XL-CP99Ax原版安装说明书应用1安全说明2部件概览中文390273E 02/22• 在将设备投入运行之前，应先彻底阅读本操作说明，并保留本操作说明以便将来参考。
• 除了规定的应用，不得将本产品用于其他用途。
• 安全触边的组装和安装以及更改或加装安全触边的调试只能由经过相关专业培训和授权的人员进行。
• 请注意遵守当地所有相关的电气安全规定！• 不遵守这些安全预防措施可能会导致传感器或者物体损坏、人员重伤或者死亡。
• 设备制造商有责任实施风险评估，并安装符合适用的本地、国家及国际规章和安全标准、法律和法规以及机械指令 2006/42/EC（如适用）的系统。
• 对于您的应用，始终将安全功能视作一个整体，切勿认为仅关系到系统的某一部分。
• 安装人员应负责测试系统，以确保系统满足所有适用的安全标准。
开始安装或组装之前，必须采取以下安全措施：• 确保不会接通设备/装置的电源！• 确定电源已断开！• 遮挡或拧下带电的相邻零件！• 接通电源之前，作为预防措施，请检查接线以防止任何会影响与本产品相连之设备的损坏或故障。
• 如果您要离开安装现场，请确保产品工作正常且安装正确。
请向建筑所有者/操作员说明操作工业门和本产品的正确方式。
安全触边安全监控器安全触边系统是按照标准 EN ISO 13856-2设计并满足其要求的压敏保护装置，安全触边系统由安全触边和安全监控器组成。
本说明书介绍了 XL 系列信号发生器的组装和安装。
本信号发生器是装在金属支撑型材上由柔性橡胶制成的主动感应型材。
按照 EN ISO 13856-2 标准使用本安全触条的信号发生器，需要使用由 BBC Bircher AG 指定的并经过规定的合格评估程序的安全监控器（信号处理器和输出监控装置）。
BLF6G22S-45,112;中文规格书,Datasheet资料
(RoHS)
/
NXP Semiconductors
BLF6G22S-45
Power LDMOS transistor
1.3 Applications
I RF power amplifiers for W-CDMA base stations and multicarrier applications in the 2000 MHz to 2200 MHz frequency range
Min 65
1.4 1.65 -
-
Typ -
1.9 2.15 12.5
5 0.2
Max -
2.4 2.65 1.5 -
150 -
Unit V
V V µA A
nA S Ω
7. Application information
Table 7. Application information
Mode of operation: 2-carrier W-CDMA; PAR 7.5 dB at 0.01 % probability on CCDF; 3GPP test
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BL-S56X-11■ Features:Ø 14.20mm (0.56”) Single digit numeric display series. Ø Low current operation.Ø Excellent character appearance.Ø Easy mounting on P.C. Boards or sockets. Ø I.C. Compatible. Ø ROHS Compliance.Super BrightElectrical-optical characteristics: (Ta=25)℃ (Test Condition: IF=20mA)Part NoChipVF Unit:VCommon CathodeCommon AnodeEmitted ColorMaterialλP (nm)Typ Max IvTYP.(mcd) BL-S56C-11S-XX BL-S56D-11S-XX Hi Red GaAlAs/GaAs,SH 660 1.85 2.20 30 BL-S56C-11D-XX BL-S56D-11D-XX Super Red GaAlAs/GaAs,DH 660 1.85 2.20 45 BL-S56C-11UR-XX BL-S56D-11UR-XX Ultra Red GaAlAs/GaAs,DDH660 1.85 2.20 50 BL-S56C-11E-XX BL-S56D-11E-XX Orange GaAsP/GaP 635 2.10 2.50 35 BL-S56C-11Y-XX BL-S56D-11Y-XX Yellow GaAsP/GaP 585 2.10 2.50 35 BL-S56C-11G-XXBL-S56D-11G-XXGreenGaP/GaP5702.202.5035Ultra BrightElectrical-optical characteristics: (Ta=25℃) (Test Condition: IF=20mA)Part NoChipVF Unit:V Common Cathode Common Anode Emitted Color Material λP (nm) Typ Max IvTYP.(mcd)BL-S56C-11UHR-XX BL-S56D-11UHR-XX Ultra Red AlGaInP 645 2.10 2.50 50 BL-S56C-11UE-XX BL-S56D-11UE-XX Ultra Orange AlGaInP 630 2.10 2.5038 BL-S56C-11YO-XX BL-S56D-11YO-XX Ultra Amber AlGaInP 619 2.10 2.50 38 BL-S56C-11UY-XX BL-S56D-11UY-XX Ultra Yellow AlGaInP 590 2.10 2.50 38 BL-S56C-11UG-XX BL-S56D-11UG-XX Ultra Green AlGaInP 574 2.20 2.50 45 BL-S56C-11PG-XX BL-S56D-11PG-XX Ultra Pure Green InGaN 525 3.80 4.50 60 BL-S56C-11B-XX BL-S56D-11B-XX Ultra Blue InGaN 470 2.70 4.20 58 BL-S56C-11W-XXBL-S56D-11W-XXUltra WhiteInGaN/2.704.2065n-XX: Surface / Lens color ：Number1 2 3 4 5 Ref Surface Color White Black Gray Red Green Epoxy Color WaterclearWhite diffusedRed DiffusedGreen DiffusedYellow DiffusedBL-S56X-11Absolute maximum ratings (Ta=25)℃Parameter S D UR E Y G Unit Forward Current I F25 25 2525 25 30 mA Power Dissipation P d60 60 60 60 60 65 mW Reverse Voltage V R 5 5 5 5 5 5 V Peak Forward Current I PF(Duty 1/10 @1KHZ)150 150 150 150 150 150 mA Operation Temperature T OPR-40 to +80 ℃Storage Temperature T STG-40 to +85 ℃Lead Soldering Temperature T SOLMax.260±5 for 3 sec Max.℃(1.6mm from the base of the epoxy bulb)℃n Absolute maximum ratings (Ta=25°C)Parameter UHR UE YO UY UG PG UB UW Unit Forward Current I F30 30 30 30 30 30 30 30 mA Power Dissipation P d75 65 65 65 75 110 120 120 mW Reverse Voltage V R 5 5 5 5 5 5 5 5 V Peak Forward Current I PF(Duty 1/10 @1KHZ)150 150 150 150 150 150 100 100 mA Operation Temperature T OPR-40 to +80 ℃Storage Temperature T STG-40 to +85 ℃Lead Soldering TemperatureT SOLMax.260±5 for 3 sec Max.℃(1.6mm from the base of the epoxy bulb)℃BL-S56X-11■ Package configuration & Internal circuit diagramNotes:1. All dimensions are in millimeters (inches)2. Tolerance is ±0.25(0.01")unless otherwise noted.3. Specifications are subject to change without notice.BL-S56X-11■ Typical electrical-optical characteristics curves:1.00.503504004505005506006507007508008509009501000(A)(B)(C)(D)(2)(3)(8)(4)(1)(6)(5)(9)(10)Wavelength(nm)RELATIVE INTENSITY Vs WAVELENGTH()λp (1) - GaAsP/GaAs 655nm/Red (2) - GaP 570nm/Yellow Green (3) - GaAsP/GaP 585nm/Yellow(4) - GaAsp/GaP 635nm/Orange & Hi-Eff Red (5) - GaP 700nm/Bright Red(6) - GaAlAs/GaAs 660nm/Super Red (8) - GaAsP/GaP 610nm/Super Red(9) - GaAlAs 880nm(10) - GaAs/GaAs & GaAlAs/GaAs 940nm (A) - GaN/SiC 430nm/Blue (B) - InGaN/SiC 470nm/Blue(C) - (D) -InGaN/SiC 505nm/Ultra Green InGaAl/SiC 525nm/Ultra Green504030201001.21.62.0 2.4 2.63.016345285040302010020406080100162,4,8,A 353210.50.20.1-30-20-1010203040506070154231098765432110KHz 3KHz 1KHz 300KHz 100KHz F-REFRESH RATE 100KHz 30KHz 10KHz 3KHz 1KHz 300Hz 100Hz 10987654321110100100010,000FORWARD VOLTAGE (Vf)FORWARD CURRENT VS.FORWARD VOLTAGERELATIVE LUMINOUSINTENSITY VS. FORWARD CURRENTAMBIENT TEMPERATURE Ta()℃FORWARD CURRENT VS. AMBIENT TEMPERATUREtp-PULSE DURATION uS (1,2,3,4,6,8,B.D.J.K)NOTE:25free air temperature unless otherwise specified℃tp-PULSE DURATION uSFORWARD CURRENT(mA)FORWARD CURRENT (mA)RELATIVE LUMINOUS INTENSITYFORWARD CURRENT(mA)REL ATIVE LUMINOUS INTENSITYAMBIENT TEMPERATURE Ta()℃(5)Ipeak MAX.IDC MAX.Ipeak M AX.IDC MAX.。