spc-advanced52-69
常用英文名词解释
序號英文名詞解釋1OMP--Ocean Metal Plastic海洋五金塑膠(深圳)有限公司2IQC--InComing Quality Control進料品質控制3IPQC--In Process Quality Control制程品質控制4FQC--Final Quality Control最終品質控制5OQC--Outgoing Quality Control出貨品質控制6QE--Quality Engineering品質工程7APQP--Advanced Product Quality Planning 产品质量先期策划8PPAP--Production Part Approval Process生产零组件核准程序9SPC--Statistical Process Control統計制程控制10MSA--Measurement Systems Analysis测量系统分析11FMEA--Failure Mode and Effects Analysis失效模式與效果分析12CP--Control Plan控制計划13Process Flow chart過程流程圖14Work instruction作業指導書15CPK-- process capability key performance過程能力指數16KPC--Key process control關鍵過程控制17Special characteristic特殊特性18SLC-- Safe Launch Concept安全量產概念19PSW--Part Submission Warrant零件提交保证书20PPM--part per million百萬分之一21ENG--Engineering Department工程部22MKT--Market Department市場部23PROD--Production Department生產部24PUR--Purchasing Department採購部25QA--Quality Assurance Department品管部26DCC--Document Control Department文控部27HR--Human resource Department人事部28PMC-- production Material Control Departm生產物料控制部29ACC--Accountant Department會計部30Sorting挑選31Rework返工32scrap報廢33UAI--Use as is特采34Concede to accept讓步接受35CAR--Correct Action Report糾正行動報告36Part產品37AC Pin插針38Contact Spring接觸彈簧39Part Number產品編號40Part Name產品名稱41Part Description產品描述42Sample樣品43Supplier供應商44Customer客戶45Organization組織46Quantity數量47Nonconforming不合格品48Remark備注49Reject拒收50Accept允收51AQL--Accept Quality Level品質允收水准52MRB--Material Review board物料評審委員會53Packing包裝54Full Measurement Report全尺寸報告55Salt Spray Report鹽霧測試報告56Assembly Test Report裝配測試報告57Material Certification Report 材質証明報告58Dimension,Datum尺寸,基准59Function功能60Characteristic特性61Lot No.批號62Lot Size批量63Critical Defect嚴重缺失64Major Defect主要缺失65Minor Defect輕微缺失66Result結果67Die & Tooling，Adjust模具,調整或維修68Cavity模穴69SPM--Strike per Minute衝速70RPM- Round per minute每分鈡的轉速71 Punch 沖床72Drawing，Update圖面,更新73Tolerance公差74Measure測量75Radius半徑76Diameter直徑77Angle角度78Scale比例79Detail局部圖80Section斷面圖81Max(maximum)最大82Min(minimum)最小83Straightness直線度84Flatness平面度85Perpendicularity垂直度86Parallelism平行度87True Position正位度88Symmetry對稱度89Circularity(roundness)真圓度90Cylinder圓柱度91Profile of a line線輪廓度92Profile of a surface面輪廓度93Gradient傾斜度94Concentricty同心度95Circular runout圓跳動96Total runout全跳動97Material材料98Bronze(CuZn),aluminium,stainless steel(SUS)青銅，鋁，不銹鋼99Phosphor(CuSn)磷銅100Brass黃銅101SECC鍍鋅鋼板(電解板) 102SPCC光泊(冷扎板)103SPTE白鐵104Hardness硬度105Free of oil除油106Finish表面處理107Plating，painting,silk-screen電鍍，噴油,絲印108Anodize，None-Anodized氧化,無氧化109Passivation鈍化110Galvanization鍍鋅111Color-galvanization鍍彩鋅112Ni-plating鍍鎳113Visual & Appearance外觀114Burr披鋒/毛刺115Dents壓印,凹痕116Deformation變形117Rust生銹118Scratch刮花,刮傷119Missing punch,Missing bending,Missing Weldin漏沖,漏折彎，漏焊接120Twist扭曲121Stain髒污122Crack，shape edge裂紋,成形尖角123Bend，stamping，Riveting彎曲,沖壓,鉚接124Rolling Direction壓延方向125Smooth Side光面126Burr Side披鋒面127Pin Gauge針規128Projector投影机129Micrometer千分尺130Vernier caliper游標卡尺131Height gauge高度規132Angle Gauge角度規133Twist force扭力計134Weight重量135BOM--Bill of Material物料清單136PSO--Process Sign off過程審核1374M1E--Man ,Machine ,Material,Method ,Enviro人員,机器,材料,方法,環境1385W1H--Why ,What ,When ,Where ,Who ,How139PDCA--Plan,Do,Check,Action計劃，實施，檢查，行動。
质量工程师-英语词汇汇总
质量工程师-英语词汇汇总质量工程师英语词汇汇总1.PDCA：Plan、Do、Check、Action 策划、实施、检查、处置2.PPAP：Production PartApproval Process生产件批准程序3.APQP：Advanced ProductQuality Planning产品质量先期策划4.FMEA：Potential FailureMode and Effects Analysis 潜在失效模式及后果分析5.SPC：Statistical ProcessControl统计过程控制6.MSA：Measurement SystemAnalysis 测量系统控制7.CP：Control Plan 控制计划8.QSA：Quality SystemAssessment 质量体系评定9.PPM：Parts Per Million 每百万零件不合格数10.QM：Quality Manua质量手册11.QP：Quality Procedure质量程序文件/Quality Planning质量策划/Quality Plan 质量计划12.CMK：机器能力指数13.CPK：过程能力指数14.CAD：Computer-AidedDesign 计算机辅助能力设计15.OEE：Overall Equipment Effectiveness 设备总效率16.QFD：Quality FunctionDeployment质量功能展开17.FIFO：First in, First out先进先出18.COPS：Customer OrientedProcesses顾客导向过程19.TCQ：Time、Cost、Quality时间、成本、质量20.MPS：Management Processes管理性过程21.SPS：Support Processes支持性过程22.TQM：Total QualityManagement全面质量管理23.PQA：Product QualityAssurance产品质量保证（免检）24.QP-QC-QI：质量三步曲，质量计划－质量控制－质量改进25.QAF：Quality AssuranceFile质量保证文件26.QAP：Quality AssurancePlan质量保证计划27.PFC：Process Flow Chart过程流程图28.QMS：Quality ManagementSystems质量管理体系29.JIT：Just In Time准时（交货）30.ERP：EnterpriseRequirement Planning企业需求计划31.QC：Quality Control 质量控制32.QA：Quality Audit 质量审核/QalityAssurance 质量保证33.IQC：In Come QualityControl 进货质量控制34.IPQC：In Process QualityControl 过程质量控制35.FQC：Final QualityControl 成品质量控制36.OQC：Out Quality Control 出货质量控制37.4M1E：Man、Machine、Material、Method、Environment人、机、料、法、环38.5W1H：Why、What、Who、When、Where、How 为何/做什么/谁做/时间/地点/如何做39.6S：Seiri、Seiton、Seiso、Seiketsu、Shitsuke、Safety 整理、整顿、清扫、清洁、素养、安全40.TRI值：Total Record Injury（三种）可记录工伤值41.SMART：精明原则，SpecificMeasurable Achievable Result Oriented Timed（具体的描述、可以测量的、可以通过努力实现的、有结果导向性的、有时间性的）——————企业常用英文缩写——————1.5S：5S管理2.ABC：作业制成本制度（Activity-BasedCosting）3.ABB：实施作业制预算制度（Activity-BasedBudgeting）4.ABM：作业制成本管理（Activity-BaseManagement）5.APS：先进规画与排程系统（AdvancedPlanning and Scheduling）6.ASP：应用程序服务供货商（ApplicationService Provider）7.ATP：可承诺量（Available ToPromise）8.AVL：认可的供货商清单（ApprovedVendor List）9.BOM：物料清单（Bill OfMaterial）10.BPR：企业流程再造（BusinessProcess Reengineering）11.BSC：平衡记分卡（BalancedScoreCard）12.BTF：计划生产（Build ToForecast）13.BTO：订单生产（Build To Order）14.CPM：要径法（Critical PathMethod）15.CPM：每一百万个使用者会有几次抱怨（Complaintper Million）16.CRM：客户关系管理（CustomerRelationship Management）17.CRP：产能需求规划（CapacityRequirements Planning）18.CTO：客制化生产（ConfigurationTo Order）19.DBR：限制驱导式排程法（Drum-Buffer-Rope）20.DMT：成熟度验证（DesignMaturing Testing）21.DVT：设计验证（DesignVerification Testing）22.DRP：运销资源计划（DistributionResource Planning）23.DSS：决策支持系统（DecisionSupport System）24.EC：设计变更/工程变更（EngineerChange）25.EC：电子商务（ElectronicCommerce）26.ECRN：原件规格更改通知（EngineerChange Request Notice）27.EDI：电子数据交换（ElectronicData Interchange）28.EIS：主管决策系统（ExecutiveInformation System）29.EMC：电磁相容（ElectricMagnetic Capability）30.EOQ：基本经济订购量（EconomicOrder Quantity）31.ERP：企业资源规划（EnterpriseResource Planning）32.FAE：应用工程师（FieldApplication Engineer）33.FCST：预估（Forecast）34.FMS：弹性制造系统（FlexibleManufacture System）35.FQC：成品质量管理（Finish orFinal Quality Control）36.IPQC: 制程质量管理（In-ProcessQuality Control）37.IQC：进料质量管理（IncomingQuality Control）38.ISO：国际标准组织（InternationalOrganization for Standardization）39.ISAR：首批样品认可（InitialSample Approval Request）40.JIT：实时管理（Just In Time）41.KM：知识管理（KnowledgeManagement）42.L4L：逐批订购法（Lot-for-Lot）43.LTC：最小总成本法（Least TotalCost）44.LUC：最小单位成本（Least UnitCost）45.MES：制造执行系统（ManufacturingExecution System）46.MO：制令（Manufacture Order）47.MPS：主生产排程（MasterProduction Schedule）48.MRO：请修（购）单（MaintenanceRepair Operation）49.MRP：物料需求规划（MaterialRequirement Planning）50.MRPII：制造资源计划（ManufacturingResource Planning）51.NFCF：更改预估量的通知Notice forChanging Forecast52.OEM：委托代工（OriginalEquipment Manufacture）53.ODM：委托设计与制造（OriginalDesign & Manufacture）54.OLAP：在线分析处理（On-LineAnalytical Processing）55.OLTP：在线交易处理（On-LineTransaction Processing）56.OPT：最佳生产技术（OptimizedProduction Technology）57.OQC：出货质量管理（Out-goingQuality Control）58.PDCA：PDCA管理循环（Plan-Do-Check-Action）59.PDM：产品数据管理系统（ProductData Management）60.PERT：计划评核术（ProgramEvaluation and Review Technique）61.PO：订单（Purchase Order）62.POH：预估在手量（Product onHand）63.PR：采购申请（PurchaseRequest）64.QA：品质保证（QualityAssurance）65.QC：质量管理（Quality Control）66.QCC：品管圈（Quality ControlCircle）67.QE：品质工程（QualityEngineering）68.RCCP：粗略产能规划（Rough CutCapacity Planning）69.RMA：退货验收（ReturnedMaterial Approval）70.ROP：再订购点（Re-Order Point）71.SCM：供应链管理（Supply ChainManagement）72.SFC：现场控制（Shop FloorControl）73.SIS：策略信息系统（StrategicInformation System）74.SO：订单（Sales Order）75.SOR：特殊订单需求（Special OrderRequest）76.SPC：统计制程管制（StatisticProcess Control）77.TOC：限制理论（Theory ofConstraints）78.TPM：全面生产管理（TotalProduction Management）79.TQC：全面质量管理（Total QualityControl）80.TQM：全面品质管理（Total QualityManagement）81.WIP：在制品（Work In Process）——————部门名称的专有名词——————QS:Quality system品质系统CS:Coutomer Sevice 客户服务QC:Quality control品质管理IQC:Incoming quality control 进料检验LQC:Line Quality Control 生产线品质控制IPQC:In process quality control 制程检验FQC:Final quality control 最终检验OQC:Outgoing quality control 出货检验QA:Quality assurance 品质保证SQA:Source(supplier) Quality Assurance 供应商品质保证(VQA) CQA：Customer Quality Assurance客户质量保证PQA rocess Quality Assurance 制程品质保证QE:Quality engineer 品质工程CE:component engineering零件工程EE:equipment engineering设备工程ME:manufacturing engineering制造工程TE:testing engineering测试工程PPE roduct Engineer 产品工程IE:Industrial engineer 工业工程ADM: Administration Department行政部RMA:客户退回维修CSDI:检修PC:producing control生管MC:mater control物管GAD: General Affairs Dept总务部A/D: Accountant /Finance Dept会计LAB: Laboratory实验室DOE:实验设计HR:人资PMC:企划RD:研发W/H:仓库SI:客验PD: Product Department生产部PA:采购(PUR: Purchaing Dept)SMT:Surface mount technology 表面粘着技术MFG:Manufacturing 制造MIS:Management information system 资迅管理系统DCC:document control center 文件管制中心——————场内作业中的专有名词——————QT:Quality target品质目标QP:Quality policy目标方针QI:Quality improvement品质改善CRITICAL DEFECT:严重缺点（CR）MAJOR DEFECT:主要缺点（MA）MINOR DEFECT:次要缺点（MI）MAX:Maximum最大值MIN:Minimum最小值DIA iameter直径DIM imension尺寸LCL:Lower control limit管制下限UCL:Upper control limit管制上限EMI:电磁干扰ESD:静电防护EPA:静电保护区域ECN:工程变更ECO:Engineering change order工程改动要求（客户）ECR:工程变更需求单CPI:Continuous Process Improvement 连续工序改善Compatibility：兼容性Marking：标记DWG rawing图面Standardization：标准化Consensus：一致Code：代码ZD:Zero defect零缺点Tolerance：公差Subject matter：主要事项Auditor：审核员BOM:Bill of material物料清单Rework：重工ID：identification识别,鉴别,证明PILOT RUN: (试投产)FAI:首件检查FPIR：First Piece Inspection Report首件检查报告FAA:首件确认SPC：统计制程管制CP: capability index（准确度）CPK: capability index of process(制程能力) PMP:制程管理计划（生产管制计划）MPI:制程分析DAS efects Analysis System 缺陷分析系统PPB：十亿分之一Flux：助焊剂P/N:料号L/N：Lot Number批号Version：版本Quantity：数量Valid date：有效日期MIL-STD：Military-Standard军用标准ICT: In Circuit Test (线路测试)ATE：Automatic Test Equipment自动测试设备MO: Manafacture Order生产单T/U: Touch Up (锡面修补)I/N:手插件P/T:初测F/T: Function Test (功能测试-终测)AS 组立P/K:包装TQM:Total quality control全面品质管理MDA:manufacturing defect analysis制程不良分析(ICT) RUN-IN:老化实验HI-pot：高压测试FMI：Frequency Modulation Inspect高频测试DPPM: Defect Part Per Million(不良率的一种表达方式：百万分之一) 1000PPM即为0.1% Corrective Action: (CAR改善对策)ACC：允收REJ:拒收S/S：Sample size抽样检验样本大小SI-SIV：Special I-Special IV特殊抽样水平等级CON：Concession / Waive特采ISO:国际标准化组织ISA：Industry Standard Architecture工业标准体制结构OBA:开箱稽核FIFO:先进先出PDCA:管理循环Plan do check action计划，执行，检查，总结WIP:在制品（半成品）S/O: Sales Order (业务订单)P/O: Purchase Order (采购订单)P/R: Purchase Request (请购单)AQL:acceptable quality level允收品质水准LQL;Limiting quality level最低品质水准QVL:qualified vendor list合格供应商名册AVL ：认可的供货商清单(Approved Vendor List) QCD: Quality cost delivery（品质，交期，成本）MPM:Manufacturing project management制造专案管理KPI:Key performance indicate重要绩效指标MVT:Manufacturing Verification Test制造验证试产Q/R/S：Quality/Reliability/Service质量/可靠度/服务STL:ship to line（料到上线）NTF:No trouble found误判CIP:capacity improvement plan（产能改善计划）MRB:material review board（物料审核小组）MRB:Material reject bill退货单JIT:just in time（即时管理）5S:seiri seiton seiso seiketsu shitsuke（整理，整顿，清扫，清洁，修养）SOP:standard operation process（标准作业程序）SIP:Specification inspection process制程检验规格TOP: Test Operation Process (测试作业流程)WI: working instruction（作业指导书）SMD:surface mounting device（表面粘着原件）FAR:failure aualysis report故障分析报告CAR:Corrective action report改善报告BPR：企业流程再造(Business Process Reengineering)ISAR ：首批样品认可(Initial Sample Approval Request)-JIT：实时管理(Just In Time)QCC ：品管圈(Quality Control Circle)Engineering Department (工程部)TQEM: Total Quality Environment Management(全面品质环境管理)PD: Production Department (制造)LOG: Logistics (后勤支持)Shipping: (进出口)AOQ：Average Output Quality平均出货质量AOQL：Average Output Quality Level平均出货质量水平FMEA：failure model effectiveness analysis失效模式分析CRB: Change Review Board (工程变更会议)CSA：Customer Simulate Analysis客户模拟分析SQMS：Supplier Quality Management System供应商品质管理系统QIT: Quality Improvement Team 品质改善小组QIP：Quality Improvement Plan品质改善计划CIP：Continual Improvement Plan持续改善计划M.Q.F.S: Material Quality Feedback Sheet (来料品质回馈单) SCAR: Supplier Corrective Action Report (供货商改善对策报告)8D Sheet: 8 Disciplines sheet ( 8D单)PDCA：PDCA (Plan-Do-Check-Action) (管理循环)MPQ: Material Packing Quantity (物料最小包装量) DSCN: Delivery Schedule Change Notice (交期变更通知) QAPS: Quality Assurance Process Sheet (品质工程表) DRP ：运销资源计划(Distribution Resource Planning) DSS：决策支持系统(Decision Support System)EC ：电子商务(Electronic Commerce)EDI ：电子资料交换(Electronic Data Interchange)EIS ：主管决策系统(Excutive Information System)ＥＲＰ：企业资源规划(Enterprise Resource Planning) FMS ：弹性制造系统(Flexible Manufacture System)KM ：知识管理(Knowledge Management)4L ：逐批订购法(Lot-for-Lot)LTC ：最小总成本法(Least Total Cost)LUC ：最小单位成本(Least Unit Cost)MES ：制造执行系统(Manufacturing Execution System) MPS ：主生产排程(Master Production Schedule)MRP ：物料需求规划(Material Requirement Planning) MRPⅡ：制造资源计划(Manufacturing Resource Planning) OEM ：委托代工(Original Equipment Manufacture) ODM ：委托设计与制造(Original Design & Manufacture) OLAP：线上分析处理(On-Line Analytical Processing) OLTP：线上交易处理(On-Line Transaction Processing)OPT ：最佳生产技术(Optimized Production Technology) PDCA：PDCA管理循环(Plan-Do-Check-Action) PDM：产品数据管理系统(Product Data Management)) RCCP：粗略产能规划(Rough Cut Capacity Planning) SCM ：供应链管理(Supply Chain Management)SFC ：现场控制(Shop Floor Control)TOC：限制理论(Theory of Constraints)TQC ：全面品质管制(Total Quality Control)FYI/R:for your information/reference仅供参考ASAP:尽快S/T:Standard time标准时间TPM:total production maintenance：全面生产保养ESD Wrist strap：静电环IT:information technology信息技术，资讯科学CEO：Chief Executive Officer执行总裁COO：Chief Operaring Officer首席业务总裁SWOT：Strength,Weakness,Opportunity,Threat优势﹐弱点﹐机会﹐威胁Competence：专业能力Communication：有效沟通Cooperation：统御融合Vibration Testing：振动测试IDP：Individual Development Plan个人发展计划MRP：Material Requirement Planning物料需求计划MAT'S：Material材料LRR：Lot Rejeet Rate批退率ATIN：Attention知会3C：Computer ,Communication , Consumer electronic消费性电子5W1H：When , Where , Who , What , Why , Ho5M: Man , Machine , Material , Method , Measurement人,机器,材料,方法,测量4MIE: Man,Material,Machine,Method,Environment人力,物力,财务,技术,时间(资源)7M1I: Manpower , Machine , Material , Method, Market , Management , Money , Information人力，机器，材料，方法, 市场，管理，资金，资讯Accuracy 准确度Action 行动Activity 活动Analysis Covariance 协方差分析Analysis of Variance 方差分析Approved 承认Attribute 计数值Average 平均数Balance sheet 资产负债对照表Binomial 二项分配Brainstorming Techniques 脑力风暴法Cause and Effect Matrix 因果图(鱼骨图)CL:Center Line 中心线Check Sheets 检查表Complaint 投诉Conformity 合格（符合）Control 控制Control chart 控制(管制)图Correction 纠正Correlation Methods 相关分析法CPI: continuouse Process Improvement 连续工序改善 Cross Tabulation Tables 交叉表CS: Customer Sevice 客（户）服（务）中心DSA: Defects Analysis System 缺陷分析系统Data 数据Description:品名DCC: Document Control Center 文控中心Decision 决策、判定Defects per unit 单位缺点数Description 描述Device 装置Do 执行DOE: Design of Experiments 实验设计Element 元素Engineering recbnology 工程技Environmental 环境Equipment 设备Estimated accumulative frequency 计算估计累计数E Equipment Variation 设备变异External Failure 外部失效,外部缺陷FA: Failure Analysis 失效分析Fact control 事实管理Fatigue 疲劳FMEA: Failure Mode and Effect Analysis失效模式与效果分析 FP First-Pass Yield （第一次通过）合格率FQA: Final Quality Assurance 最终品质保证FQC: Final Quality control 最终品质控制Gauge system 测量系统Grade 等级Histogram 直方图Improvement 改善Initial review 先期审查Inspection 检验Internal Failure 内部失效、内部缺陷IPQC: In Process Quality Control 制程品质控制IQC: Incomming Quality Control 来料品质控制IS International Organization for Standardization 国际标准化组织 LCL: Lower Control limit 管制下限LQC: Line Quality Control 生产线品质控制LSL: Lower Size Limit 规格下限Machine 机械Manage 管理Materials 物料Measurement 测量Median 中位数MSA: Measurement System Analysis 测量系统分析Occurrence 发生率Operation Instruction 作业指导书Organization 组织Parto 柏拉图PPM arts per Million （百万分之）不良率Plan 计划Policy 方针Population 群体PQA: Process Quality Assurance 制程品质保证Practice 实务(践)Prevention 预防Probability 机率Probability density function 机率密度函数Procedure 流程Process 过程Process capability analysis 制程能力分析（图）Process control and Process capability制程管制与制程能力 Product 产品Production 生产Projects 项目QA: Quality Assurance 品质保证QC: Quality Control 品质控制QE: Quality Engineering 品质工程QFD: Quality Function Desgin 品质机能展开(法)Quality 质量Quality manual 品质手册Quality policy 品质政策(质量方针)Random experiment 随机试验Random numbers 随机数R:Range 全距（极差）Reject 拒收Repair 返修Repeatusility 再现性Reproducibility 再生性Requirement 要求Responsibilities 职责Review 评审Reword 返工Rolled yield 直通率RPN: Risk Priority Number 风险系数Sample 抽样,样本Sample space 样本空间Sampling with replacement 放回抽样Sampling without replacement 不放回抽样Scatter diagram 散布图分析Scrap 报废Simple random sampling 简单随机取样Size 规格SL: Size Line 规格中心线Stratified random sampling 分层随机抽样SOP: Standard Operation Procedure 标准作业书SPC: Statistical Process Control 统计制程管制Specification 规范SQA: Source(Supplier) Quality Assurance 供货商品质保证Stage sampling 分段随机抽样Standard Deviation 标准差Sum of squares 平方和Taguchi-method 田口(试验)方法Theory 原理TQC: Total Quality Control 全面品质控制TQM: Total Quality Management 全面品质管理Traceablity 追溯Training 培训UCL: Upper Control Limit 管制（控制）上限USL: Upper Size Limit 规格上限Validation 确认Variable 计量值Verification 验证Version 版本VOC: Voice of Customer 客户需求VOE: Voice of Engineer 工程需求Inventory stock report:庫存清单报告Sales order report:出货报告。
汽车生产缩写名词便查表
解释 0批量 两日试生产 分析/发展/验证 审批体系 实际完成日期 装配线平衡系统 提前采购 产品信息预报 先期产品质量策划 实际单件工时 制造质量 白车身 产品工程样件性能检验认可 设计清单 设备清单 装载清单 原料清单 过程清单 业务计划实施 计算机辅助设计 计算机辅助工程(软件) 用户接受度和审查评估 概念可改变的选择 持续改进 隔间融合为组 完全拆缷 坐标测量仪 单车成本 控制/机器人技术和焊接 合同签订 累积性外伤失调 零件技术规格 整车检验标准 设计/过程失效模式分析 设计分析过程 设计中心 装配设计 试验设计 冲模业务排行 单车缺陷数 设计质量验证 设计发布工程师 直行损失率 直行率 决策支持中心 计划完成日期 工程组经理 电极底漆 工程技术、工程学 最终认可 功能评估
汽车缩写名词便查表
英文原文 NAO Containerization Numerically Controlled Notice of Authorization NAO Strategy Board Organization and Employee Development Occupational Safety & Health Occupational Safety & Health Act Occupational Safety & Health Management SOycsctuepmational Safety & Health Standards OFF TOOL SAMPLE Production Achievement Product Action Authorization Performance Assessment Committee Program Assessment and Control Environment Product Assembly Document Part Readiness Tracking System Problem Communication Production Control and Logistics Process Control Manager Problem Communication Report Portfolio Development Center Product Data Management Product Description System Product Development Team Production Engineering Department Product Evaluation Program Personnel Program Execution Team Program Management People Involement Project Incident Monitoring and Resolution Process Production Launch Process Process Modeling Integration Program Manufacturing Manager Product Manufacturability Requirements Product Management Team Production Order Management System Point of Purchase Push - Pull product part approval procedure Production Part Approval Process
管理常见英文缩写
主管文件分发,管理,保存的部门 一种品质工具 一种记录产品不良缺陷的方法, MOTO要求供应商签署对于某一产品的的要求表示 接受 对某一产品最后出货成品的所有尺寸进行检查的 数据 物料管理的一种方法 产品品质控制的一种方法 一种分析公司测量系统是否能满足需要的方法, 适用天检查人员和所有的生产和测量仪器
项目经理 物料计划 生产件批准程序 百万分之一 品质保证 柏拉图 层别法 查检表 管制图 散布图 特性要因图 直方图 品管圈 品质控制计划 品质异常通知 品质工程师 品质受关注的供应商 品质改善小组 品质经理 品质系统 试生产和生产良率报告 拒收 退料承认书 老化实验 供应商发展工程师 制程检验规格 业务经理 标准作业程序 统计过程控制 供应商品质工程师 优势﹐弱点﹐机会﹐威胁 技术经理 全面品质管理 特采 一种品质管理和模式,强调公司所有的员工都参 与品质管理和控制. 供应商管理的工程师,连接供应商和Moto工厂以 及EMS之间 Moto供应商管理的工程师,连接供应商和Moto之 间 一种退料的程序 一种报告试生产时生产状况和生产良率的文件, 试生产的数量一般在5000片以上. Moto推出一种供应商改善活动. 品质控制的旧七大手法之一 品质控制的旧七大手法之一 品质控制的旧七大手法之一 品质控制的旧七大手法之一 品质控制的旧七大手法之一 品质控制的旧七大手法之一 品质控制的旧七大手法之一 一种品质改善的活动 一种品质控制的文件,是根据FMEA
中文
人,机,料,法,测量.环境 时间,地点,人,事件,原因,如何 8D报告 允收/拒收 特采 先期产品品质规划 允收水准 材料清单 （质量）承诺证明书 精密度指数/过程能力指数 极严重的 客户需求转换到生产过程 产能需求规划 产品审核报告 客户服务 一级控制出货 二级控制出货 关键质量 文控中心 实验设计 单位缺陷数 电子版供应商承诺表格 首件检查数据 先进先出 最终检查 量测系统再现性与重复性 总经理 制程品质控制 进料品质控制 实验室 批退率 主要的
品质专业术语
常用品质术语
序号
97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128
英语简写
LRR LTPD L4L LCL LSL MRO MIS MO MES MRP-II MPS MRP MRB MSDS MS MTBF MSA NG OLAP OLTP OPT ODM OEM OQC PPM PDCA PSO PM PC PR PDM POH
第 1 页，共 6 页
常用品质术语
序号
33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64
英语简写
BPR CPK Ca. Cp. CRP C. OF C. CEO CQC CPM CAD CTO CRC CIF COQ CPM CTQ CAR CRM CR DSS DS/SS DPU DPMO DMADV DMAIC DEPT. DMT DOE DVT DRP DTS DCC
英语全写 Business Process Reengineering Capability Of Process Capability Of Accuraty Capability Of Precesion Capacity Requirement Planning Certificate Of Compliance Chief Excutive Officer Companywide Quality Control Complaint Per Illion Computer Aided Design Configuration To Order Contract Review Committee Cost Inusance And Freight Cost Of Quality Critical Path Method Critical Quality Crrective Action Report Customer Relationship Management Customer's Risk Decision Support System Def.Size/Sample Size Defect Per Unit Defects Per Million Opportunity Define\Measurement\Analysis\Design\Verify Department Design Matuing Testing Design Of Experiment Design Verification Testing Distribution Resource Planning Dock To Stock Document Control Centre
SPC常用术语
SPC常用术语1、高级统计方法（AdvancedStatisticalMethods）-比基本的统计方法更复杂的统计过程分析及控制技术，包括更高级的控制图技术、回归分析、试验设计、先进的解决问题的技术等。
2、计数型数据（AttributesData）可以用来记录和分析的定性数据，例如：要求的标签出现，所有要求的紧固件安装，经费报告中不出现错误等特性量即为计数型数据的例子。
其他的例子如一些本来就可测量（即可以作为计量型数据处理）只是其结果用简单的“是/否”的形式来记录，例如：用通过/不通过量规来检验一根轴的直径的可接受性，或一张图样上任何设计更改的出现。
计数型数据通常以不合格品或不合格的形式收集，它们通过p、np、c和u控制图来分析（参见计量型数据）。
3、均值（Average）（参见平均值Mean）数值的总和被其个数（样本容量）除，在被平均的值的符号上加一横线表示。
例如，在一个子组内的x值的平均值记为X，X（X两横）为子组平均值的平均值，X（X上加一波浪线）为子组中位数的平均值。
R为子组极差的平均值。
4、认知（AwarenesS个人对质量和生产率相互关系的理解，把注意力引导到管理义务的要求和达到持续改进的统计思想上。
5、基本的统计方法（BasicStatisticalMethods）通过使用基本的解决问题的技术和统计过程控制来应用变差理论，包括控制图的绘制和解释（适用于计量型数据和计数型数据）和能力分析。
6、二项分布（BinomialDistribution）应用于合格和不合格的计数型数据的离散型概率分布。
是p和np控制图的基础。
7、因果图（Cause-EffectDiagram）一种用于解决单个或成组问题的简单工具，它对各种过程要素采用图形描述来分析过程可能的变差源。
也被称作鱼刺图（以其形状命名）或石川图（以其发明者命名）。
8、中心线（CentralLine）控制图上的一条线，代表所给数据平均值。
汽车行业英语术语
53 54 55 56 57 58 59 60 61 62 63 64 65
APQP PPAP MSA SPC FMEA X-R图 Cpk ppk Cmk Proto 样件 OTS样件 Pre-Launch
Advanced Product Quality Planning Production part approval process MeasurementSystemAnalysis Statistical Process Control Failure Mode and Effects Analysis
OEM FMEA MSA SPC APQP
Origind Equipment Manufacture Failure Mode and Effects Analysis Measurement System Analysis Statistical Process Control Advanced Product Quality Planning
产品质量先期策划 生产件批准程序 测量系统分析 统计过程控制 潜在失效模式与后果分析 是SPC中的均值-极差图 短期过程能力指数 长期过程能力指数 设备能力指数
原型样件：按照客户供给的原样(proto sample)制作并寄回客户经客 户明确承认的样品主如果明确承认技俩、工艺、尺寸等 off tooling samples 即全工装状态下非节拍生产条件 下制造出来的样件 试生产 Start-Of-Production 即批量生产 标准操作程序 零件提交保证书 国际材料数据系统 包括整车销售、零配件、售后服 务、信息反馈等 原始设备生产商 汽车配件 售后市场 Design Validate Plan&Report 设计验证计划报告
Mellanox QSFP+ 直接附接铜线（DAC）线缆商品介绍说明书
Mellanox ® QSFP+ direct attach copper (DAC) cables provide robust connections for leading edge 56Gb/s InfiniBand or 40GbE Ethernet systems. The cables consist of four lanes each operating at data rates of up to 14.0625Gb/s.Passive copper cables require no additional power to ensure quality connectivity. The cables are compliant with SFF-8685 specifications and provide connectivity between devices using QSFP+ ports. Each QSFP+ port comprises an EEPROM providing product information, which can be read by the host system.This integrated cable solution provides reliable transport for aggregate data rates of up to 56Gb/s Virtual Protocol Interconnect (VPI). Optimizing systems to operate with Mellanox’s 56Gb/s passive copper cables significantly reduces power consumption and EMI emission, eliminating the use of enterprise data center (EDC) hosts.Mellanox’s unique quality passive copper cable solutions provide power-efficient connectivity for short distance interconnects. They enable higher port bandwidth, density and configurability at a low cost and reduced power requirement in the data centers.Rigorous cable production testing ensures best out-of-the-box installation experience, performance and durability.Table 1 - Absolute Maximum RatingsTable 2 - Operational Specifications56Gb/s and 40GbE QSFP + Direct Attach Copper CablesINTERCONNECT PRODUCT BRIEFMC22061xx-00x | MC22071xx-0xx | MC22101xx-00x | MCP170L-F0xx | MCP1700-B0xxx†T able 3 - Electrical SpecificationsT able 4 - Cable Mechanical SpecificationsNote 1. See Figure 1 for the cable length definition.Note 2: *The pulltab color is black, instead of the standard blue pulltab.Note 3: The minimum bending space is the distance from the system panel to the edge of the cable bend with the minimum assembly bending radius. This corresponds to the distance from the switch panel to the rack door.Note 4: The minimum assembly bending radius (close to the connector) is 10x the cable’s outer diameter. The repeated bend (far from the connector) is also 10x the cable’s outer diameter. The single bend (far from the connector) is 5x the cable’s outer diameter.Figure 1. Cable Length DefinitionMechanical Schematics350 Oakmead Parkway, Suite 100, Sunnyvale, CA 94085Tel: 408-970-3400 • Fax: © Copyright 2018. Mellanox Technologies. All rights reserved.Mellanox, Mellanox logo and LinkX are registered trademarks of Mellanox Technologies, Ltd. Warranty InformationMellanox LinkX direct attach copper cables include a 1 year limited hardware warranty, which covers parts repair or replacement.Table 5 - Part Numbers and DescriptionsNote: The standard pulltab color is blue; cables with a black pulltab are indicated accordingly.。
常见质量管理术语英文缩写
【常见质量管理术语英文缩写】1、PDCA:Plan、Do、Check、Action；策划、实施、检查、处置2、PPAP:Production Part Approval Process；生产件批准程序3、APQP：Advanced Product Quality Planning；产品质量先期策划4、FMEA：Potential Failure Mode and Effects Analysis 潜在失效模式及后果分析5、SPC：Statistical Process Control 统计过程控制6、MSA:Measurement System Analysis 测量系统控制7、CP：Control Plan 控制计划8、QSA：Quality System Assessment 质量体系评定9、PPM:Parts Per Million 每百万零件不合格数10、QM：Quality Manua 质量手册11、QP：Quality Procedure 质量程序文件Quality Planning 质量策划Quality Plan 质量计划12、CMK:机器能力指数13、CPK：过程能力指数14、CAD:Computer—Aided Design 计算机辅助能力设计15、OEE:Overall Equipment Effectiveness 设备总效率16、QFD：Quality Function Deployment 质量功能展开17、FIFO：First in， First out 先进先出18、COPS：Customer Oriented Processes 顾客导向过程19、TCQ: Time、Cost、Quality 时间、成本、质量20、MPS：Management Processes 管理性过程21、SPS：Support Processes 支持性过程22、TQM:Total Quality Management 全面质量管理23、PQA：Product Quality Assurance 产品质量保证（免检)24、QP—QC-QI：质量三步曲质量计划－质量控制－质量改进25、QAF：Quality Assurance File 质量保证文件26、QAP:Quality Assurance Plan 质量保证计划27、PFC：Process Flow Chart 过程流程图28、QMS：Quality Management Systems 质量管理体系29、JIT：Just In Time 准时（交货）30、ERP：Enterprise Requirement Planning 企业需求计划31、QC：Quality Control 质量控制32、QA：Quality Audit 质量审核Quality Assurance 质量保证33、IQC：In come Quality Control 进货质量控制34、IPQC:In Process Quality Control 过程质量控制35、FQC：Final Quality Control 成品质量控制36、OQC：Out Quality Control 出货质量控制37、4M1E:Man、Machine、Material、Method、Environment 人、机、料、法、环38、5W1H：Why、What、Who、When、Where、How 为何/做什么/谁做/时间/地点/如何做39、6S：Seiri、Seiton、Seiso、Seiketsu、Shitsuke、Safety 整理、整顿、清扫、清洁、素养、安全40、TRI值:Total Record Injury （三种）可记录工伤值41、SMART精明原则：Specific Measurable Achievable ResultOriented Timed具体的描述、可以测量的、可以通过努力实现的、有结果导向性的、有时间性的【企业常用英文缩写】42、5S : 5S管理43、ABC ：作业制成本制度 (Activity-Based Costing)44、ABB ：实施作业制预算制度 (Activity—Based Budgeting)45、ABM : 作业制成本管理 (Activity—Base Management）46、APS ：先进规画与排程系统 (Advanced Planning and Scheduling）47、ASP : 应用程序服务供货商（Application Service Provider）48、ATP : 可承诺量 (Available To Promise）49、AVL ：认可的供货商清单(Approved Vendor List）49、BOM ：物料清单（Bill Of Material)50、BPR : 企业流程再造（Business Process Reengineering）51、BSC : 平衡记分卡 (Balanced ScoreCard)52、BTF ：计划生产 (Build To Forecast）53、BTO ：订单生产（Build To Order）54、CPM : 要径法（Critical Path Method)55、CPM ：每一百万个使用者会有几次抱怨（Complaint per Million）56、CRM ：客户关系管理 (Customer Relationship Management）57、CRP : 产能需求规划 (Capacity Requirements Planning）58、CTO ：客制化生产（Configuration To Order)59、DBR : 限制驱导式排程法 (Drum-Buffer—Rope)60、DMT : 成熟度验证(Design Maturing Testing）61、DVT : 设计验证（Design Verification Testing)62、DRP ：运销资源计划 (Distribution Resource Planning）63、DSS : 决策支持系统（Decision Support System)64、EC ：设计变更／工程变更（Engineer Change）65、EC ：电子商务 (Electronic Commerce)66、ECRN : 原件规格更改通知(Engineer Change Request Notice)67、EDI ：电子数据交换（Electronic Data Interchange）68、EIS : 主管决策系统（Executive Information System)69、EMC ：电磁相容（Electric Magnetic Capability)70、EOQ : 基本经济订购量 (Economic Order Quantity）71、ERP ：企业资源规划 (Enterprise Resource Planning)72、FAE : 应用工程师（Field Application Engineer)73、FCST ：预估（Forecast）74、FMS : 弹性制造系统（Flexible Manufacture System）75、FQC : 成品质量管理（Finish or Final Quality Control)76、IPQC：制程质量管理 (In-Process Quality Control)77、IQC : 进料质量管理 (Incoming Quality Control)78、ISO ：国际标准组织（International Organization for Standardization）79、ISAR：首批样品认可（Initial Sample Approval Request）80、JIT : 实时管理 (Just In Time)81、KM:知识管理（Knowledge Management)82、 L4L : 逐批订购法（Lot—for—Lot)83、LTC : 最小总成本法（Least Total Cost)84、LUC : 最小单位成本（Least Unit Cost)85、MES : 制造执行系统 (Manufacturing Execution System)86、MO : 制令(Manufacture Order)87、MPS ：主生产排程 (Master Production Schedule)88、MRO : 请修（购)单(Maintenance Repair Operation)89、MRP : 物料需求规划 (Material Requirement Planning)90、MRPII : 制造资源计划（Manufacturing Resource Planning）91、NFCF : 更改预估量的通知Notice for Changing Forecast92、OEM : 委托代工 (Original Equipment Manufacture）93、ODM ：委托设计与制造 (Original Design & Manufacture）94、OLAP ：在线分析处理 (On—Line Analytical Processing)95、OLTP : 在线交易处理（On-Line Transaction Processing)96、OPT ：最佳生产技术 (Optimized Production Technology)97、OQC : 出货质量管理 (Out—going Quality Control)98、PDCA : PDCA管理循环 (Plan-Do—Check—Action）99、PDM : 产品数据管理系统 (Product Data Management)100、PERT : 计划评核术 (Program Evaluation and Review Technique)91、PO ：订单(Purchase Order)92、POH ：预估在手量 (Product on Hand)93、PR ：采购申请Purchase Request94、QA ：品质保证(Quality Assurance)95、QC : 质量管理(Quality Control)96、QCC ：品管圈 (Quality Control Circle）97、QE : 品质工程(Quality Engineering）98、RCCP : 粗略产能规划 (Rough Cut Capacity Planning)99、RMA : 退货验收Returned Material Approval100、ROP ：再订购点（Re-Order Point）101、SCM : 供应链管理（Supply Chain Management）102、SFC ：现场控制（Shop Floor Control）103、SIS : 策略信息系统 (Strategic Information System) 104、SO : 订单（Sales Order）105、SOR : 特殊订单需求(Special Order Request)106、SPC : 统计制程管制（Statistic Process Control）107、TOC ：限制理论（Theory of Constraints)108、TPM : 全面生产管理Total Production Management 109、TQC : 全面质量管理（Total Quality Control）110、TQM ：全面品质管理（Total Quality Management）111、WIP : 在制品 (Work In Process)。
SPC58NH-DISP开发板用户手册说明书
UM2697User manualSPC58NH-DISP discovery boardIntroductionThe SPC58NH-DISP discovery board is a standalone hardware platform to evaluate and develop applications with theSPC58NH92C5, packaged in a FPBGA386 microcontroller at budget price.This document provides information about the hardware architecture and how to configure the jumpers to enable specific functions.SPC58NH-DISP discovery board 1SPC58NH-DISP discovery boardThe SPC58NH-DISP discovery board is based on the microcontroller SPC58NH92C5, a high performancee200z4d triple core 32-bit Power Architecture technology CPU, 200 MHz core frequency with 10496 KB on chipFlash (10240 KB code Flash + 256 KB data Flash) in an FPBGA386 package.The several peripherals such as DSPI, LIN (LIN and UART), FlexRay, CAN-FD, two independent ethernet ports(10/100 Mbps and 1 Gbps), make the SPC58NH-DISP an excellent starter kit for the SW designer to quicklyevaluate the microcontroller as well as to develop and to debug applications.Free ready-to-run application firmware examples are available inside SPC5Studio web page (http//:/spc5studio) to quickly support evaluation and development.The PCB, the components and all HW parts assembled in this board meet the requirements of the applicableRoHS directives.1.1Interfaces and connectors• 1 ethernet port 10/100 Mbps• 1 ethernet port 1 Gbps•eMMC•SD card reader•HyperFlash and HyperRam• 3 CAN FD ports with transceiver DB9 connector•12 CAN port (GPIO level, 2 connectors)• 4 x I²C connector• 1 LIN and 1 K-Line with transceivers• 2 FlexRay channels (a single transceiver is shared with jumpers)• 2 UART channels with a DB9 and connector 4x0.1”•USB to UART (with opto-coupler option)•1xST33xx connector•JTAG (header 2x7 0.1” pin)•RESET push button• 3 user push buttons• 4 user LEDs• 2 trimmers to ADC (fast ADG evaluation)•LCD TFT display (320 x 240) with touch screen (option)•12 V DC power supply (external PSU)•40 MHz and 32.768 KHz crystalsHardware description 2Hardware description2.1Power supplyFigure 1 shows the PSU block diagram.Figure 1. PSU block diagramThe DC input source is 12 V DC: L5963 is used to generate 3.3 V (VDD_HV_xxx), 1.2 V (VDD_LV_xx) and 3.3 Vfor ADC section. A linear regulator is used to generate 5 V for ADC.The LEDs LD2, LD3, LD4, and LD5 are used to check the output of each voltage regulator and 12 V input source.A resettable fuse (F1) protects the application against the overload or short-circuit.2.2Microcontroller2.2.1JTAGA standard JTAG connector 14x0.1” is available for programming and debugging.Figure 2.JTAG2.2.2ResetFigure 3 shows the reset circuit.Figure 3.ResetThe reset signal level is driven to low level when:•VDD_HV is lower than a fixed level. This feature is used to monitor the VDD_HV level and then to resetthe microcontroller when the level is out of specification. This feature allows to set the reset only when the VDD_HV is stable.•the pushbutton is pressed (manual reset); the reset pulse width is fixed.Microcontroller2.3Ethernet 10/100 MbpsSection 2.3 shows the ethernet 10-100 Mbps communication channel.Figure 4.Ethernet 10/100 MbpsJP15 allows configuring the communication in MII or RMII mode.The current absorption of this section can be estimated by removing SB7 then applying a low impedance current meter or a current probe.Ethernet 10/100 Mbps2.4Ethernet 1 GbpsThe ethernet 1 Gbps section is depicted here below.Figure 5.Ethernet 1 GbpsThe resistors from R85 to R84, from R88 to R91, from R95 to R98 and from R100 to R103 are used to configure the device.With SB9 close and SB8 left open, the 1V2_ETH supply voltage is controlled by an integrated LDO and anexternal MOSFET. The user can exclude the LDO regulator and connect the 1V2_ETH to the 1.2 V source form the PSU section setting SB9 open and SB8 close.Ethernet 1 Gbps2.5eMMC and μSDFigure 6 and Figure 7 are showing the eMMC and µSD card reader section respectively.From the microcontroller, the signals Data 0÷3, CMD, CLK and FBCLK are shared among these sections and this means only one section can be active at a time.These signals must be connected to the active section by selecting the jumpers from JP17 to JP22 properly: see Figure 8.Figure 6.eMMC cardFigure 7.μSD cardeMMC and μSDFigure 8.eMMC and μSD jumpers configuration2.6Octal SPIThe OctalSPI section is visible in Section 2.6 . In this application the OctalSPI is connected to a HyperFlash and HyperRAM device.The microcontroller ports PF[4] and PN[12] are used to drive CS1# and CS2#.Figure 9.HyperFlash and HyperRAMOctal SPI2.7LIN and K-LineLIN and K-Line channels with the dedicated transceivers are described in the Figure 10.Figure 10.LIN and K-Line2.8Flex RayFlex Ray section is reported in Section 2.8 ; JP33, JP34 and JP35 allow selecting which channel from the microcontroller is connected to the transceiver.Figure 11.Flex RayLIN and K-Line2.9I²CFour I²C channels are available. A pull-up resistor is connected to each line and a jumper allows disconnecting it.Figure 12.I²C2.10CAN-FDThree CAN-FD channels with fast transceivers are connected to DB9 connectors. Further 6 + 6 channels are connected to 2 connectors without transceivers (GPIO level).Figure 13.CAN-FDI²C2.11UARTTwo UART channels with transceiver are available and connected to a 2x4 connector. The channel T1 (ports PL[0] and PL[1]) is connected to J5 (DB9 connector).Figure 14.UART2.12USB to UARTThis section shows a USB to UART communication channel. An option allows to include opto-couplers in order to have the USB port electrically insulated with respect to all the sections.Figure 15.USB to UARTUART2.13ST33 connectorThe aim of this connector is to allow plugging an evaluation board to evaluate and to demonstrate security features.Figure 16.ST33 connector2.14User interfaceThe user interface section includes 3 pushbuttons, 4 LEDS for user purpose, to simplify the debug and in addition to have a user interface port.Two potentiometers allow the evaluation of the ADC module; each potentiometer is connected to the VDD_HV_ADR supply source, it is the reference level of the ADC converters in the microcontroller.Figure 17.User interfaceST33 connector2.15LCDA display with SPI can be plugged in the board using two male pin arrays (one of them is used only as mechanical support). Figure 18 shows how the signals are connected.Figure 18.LCD moduleLCD3PCB layoutThe PCB layout is reported in Figure 19.Some copper tracks have been placed paying attention to have the same mechanical length and a specificimpedance; in detail the critical paths involve the ethernet 1 Gbps - ethernet 10/100 Mbps sections as well as the eMMC and the Hyper bus signals.Figure 19.PCB layoutPCB layoutRevision historyTable 1. Document revision historyContentsContents1SPC58NH-DISP discovery board (2)1.1Interfaces and connectors (2)2Hardware description (3)2.1Power supply (3)2.2Microcontroller (4)2.2.1JTAG (4)2.2.2Reset (4)2.3Ethernet 10/100 Mbps (5)2.4Ethernet 1 Gbps (6)2.5eMMC and μSD (7)2.6Octal SPI (8)2.7LIN and K-Line (9)2.8Flex Ray (9)2.9I²C (10)2.10CAN-FD (10)2.11UART (11)2.12USB to UART (11)2.13ST33 connector (12)2.14User interface (12)2.15LCD (13)3PCB layout (14)Revision history (15)List of figuresList of figuresFigure 1. PSU block diagram (3)Figure 2. JTAG (4)Figure 3. Reset (4)Figure 4. Ethernet 10/100 Mbps (5)Figure 5. Ethernet 1 Gbps (6)Figure 6. eMMC card (7)Figure 7. μSD card (7)Figure 8. eMMC and μSD jumpers configuration (8)Figure 9. HyperFlash and HyperRAM (8)Figure 10. LIN and K-Line (9)Figure 11. Flex Ray (9)Figure 12. I²C (10)Figure 13. CAN-FD (10)Figure 14. UART (11)Figure 15. USB to UART (11)Figure 16. ST33 connector (12)Figure 17. User interface (12)Figure 18. LCD module (13)Figure 19. PCB layout (14)IMPORTANT NOTICE – PLEASE READ CAREFULLYSTMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products.No license, express or implied, to any intellectual property right is granted by ST herein.Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to /trademarks. All other product or service names are the property of their respective owners.Information in this document supersedes and replaces information previously supplied in any prior versions of this document.© 2021 STMicroelectronics – All rights reserved。
分散型控制系统文字符号
中华人民共和国机械行业标准JB/T 7390—94 分散型控制系统文字符号1 主题内容与适用范围本标准规定了分散型控制系统的主要文字符号。
本标准适用于分散型控制系统的各类技术文件。
2 术语2.1 文字符号用文字书写的方法制成的具有简化特征的视觉形象。
以表达特定的事物或概念。
2.2 分散型控制系统一种控制功能分散、操作显示集中、采用分散结构的智能站网络的控制系统。
3 分散型控制系统文字符号3.1 分散型控制系统文字符号见表1。
3.2分散型控制系统文字符号的英文索引见附录A(参考件)。
表1 分散型控制系统文字符号编号符号中文名称英文名称1 ALP 报警打印Alarm Print2 ALC 报警控制台Alarm Console3 ALI 报警指示器Alarm Indicator4 COS 被控系统Controlled System5 RMC 备用多功能控制器Reserve Multifunction Controller6 RMCD 备用多功能控制器指挥器Reserve Multifunction Controller Director7 RBC 备用基本控制器Reserve Basic Controller8 RBCD 备用基本控制器指挥器Reserve Basic Controller Director9 BPS 比特/秒Bits Per Second10 BER 比特误码率Bit Error Rate11 CODEC 编码解码器Coder/Decoder12 PLT 标图板Plotting Tablet13 UPS 不间断电源Uninterrupted Power Supply14 UAC 不间断控制系统Uninterrupted Automatic Controller机械工业部1994-08-23批准 1995-05-01实施15 UDM 不间断控制系统指挥器模件UAC Director Module16 CDT CRT显示终端CRT Display Terminal17 CT 彩色终端Color Terminal18 SAS 采样开关Sampling Switch19 SAP 采样周期Sampling Period20 MV 操作变量Manipulated Variable21 OPS 操作员站Operator’s Station22 OPC 操作员控制台Operator’s Console23 CCA 插箱Card Case24 DME 差分曼切斯特编码Differential Manchester Encoding25 TL 传输线Transmission Line26 SAL 存贮记录站Storage And Logger27 MTD 磁带机Magnetic Tape Drive28 DOS 磁盘操作系统Disk Operating System29 MBM 磁泡存贮器Magnetic Bubble Memory30 PR 打印机Printer31 SLDC 单回路数字调节器Single loop Digital Controller32 LLPIU 低电平过程接口单元Low Level Process Interface Unit33 LLMAIP 低电平模拟量多路输入处理器Low Level Multiple Analog Input Processor34 LLAIP 低电平模拟量输入处理器Low Level Analog Input Processor35 LLS 低电平信号Low Level Signal36 LFPIU 低能量过程接口单元Low Energy Process Interface Unit37 LSCN 低速通信网络Low Speed Communication network38 PCFA 点插板箱Point Card File Assembly39 MDP 点阵打印机Matrix(Dot) Printer40 EEPROM 电擦除可编程只读存储器Electrical Erasable Programmable ROM41 PS 电源Power Supply42 PSC 电源插箱Power Supply Case43 SCGU 独立控制和图形单元Standalone Control and Graphics Unit44 MC 多功能控制器Multifunction Controller45 MCS 多功能控制站Multifunction Control Station46 MLDC 多回路数字调节器Multi-Loop Digital Controller47 MUX 多路转换器Multiplexer48 LED 发光二极管Light Fmitting Diode49 V 阀门Valve50 VPR 阀门定位器Valve Positioner51 VP 阀位Valve Position52 DPU 分布式处理单元Distributed Processing Unit53 DDB 分布式数据库Distributed Data Base54 DIOB 分布式输入输出总线Distributed I/O Bus55 DCS 分散型控制系统Distributed Control System56 AMC 高级多功能控制器Advanced Multifunction Controller57 HLPIU 高电平过程接口单元High Level Process Interface Unit58 HLAIP 高电平模拟量输入处理器High Level Analog Input Processor59 HLS 高电平信号High Level Signal60 HDLC 高级数据链路控制协议High Level Data Link Control Protocol61 HSOFRN 高速光纤环形网络High Speed Optical Fiber Ring Network62 HSCN 高速通信网络High Speed Communication Network63 HSBN 高速总线网络High Speed Bus Network64 TRC 干线电缆Trunk Cable65 CMR 共模抑制Common Mode Rejection66 CMRR 共模抑制比Common Mode Rejection Ratio67 SHM 共享存储器Shared Memory68 FAI 工厂层自动化接口Factory Floor Automation Interface69 MAP 工厂自动化协议Manufacturing Automation Protocol70 ENOS 工程师操作站Engineer's Operating Station71 ENK 工程师键盘Engineer's Keyboard72 ENC 工程师控制台Engineer's Console73 ICC 工业控制计算机Industry Control Computer74 ICS 工业控制系统Industry Control System75 IPC 工业用可编程控制器Industrial Programmable Controller76 MAL 管理级Management Level77 MAC 管理计算机Management Computer78 MAS 管理站Management Station79 LPD 光笔显示器Light Pen Display80 OET 光端机Optical Electrical Terminal81 FOCA 光缆Fiber Optics Cable82 FO 光纤Fiber Optics83 FOH 光纤公路Fiber Optics Highway84 FOC 光纤通信Fiber Optics Communication85 PV 过程变量Process Variable96 PM 过程管理器Process Manager87 PMM 过程管理器模件Process Manager Module88 PIU 过程接口单元Process Interface Unit89 PCL 过程控制级Process Control Level90 PCS 过程控制站Process Control Station91 PIOC 过程输入输出控制器Process I/O Controller92 PIOCH 过程输入输出通道(装置) Process I/O Channel93 PROWAY 过程数据公路Process Data Highway94 LP 行式打印机Line Printer95 BMOD 后备手操器Backup Manual Operation device96 LMA 回路手动Loop Manual97 PLOT 绘图机Plotter98 BC 基本控制器Basic Controller99 CA 机柜Cabinet100 BALAN 基带局域网Base Band LAN101 LAP 激光打印机Laser Printer102 LOG 记录站Logger103 CAT 计算机辅助测试Computer Aided Test104 CAD 计算机辅助设计Computer Aided Design105 CAM 计算机辅助制造Computer Aided Manufacturing 106 CAF 计算机辅助装备Computer Aided Equipment107 CCM 计算机控制方式Computer Control Mode108 CMB 计算机手动后备Computer Manual Backup109 CNC 计算机数控Computer Numerical Control 110 CGW 计算机网间连接器Computer Gateway111 CAMB 计算机自动手动后备Computer Automatic-Manual Backup 112 CAL 计算站Calculator113 CM 计算模件Computing Module114 SL 监控级Supervision level115 SC 监控计算机Supervision Computer116 SS 监控站Supervision Station117 WDT 监视定时器Watchdog Timer118 MON 监视器Monitor119 SOPS 简易操作站Simple Operator's Station120 ND 节点Node121 IF 接口Interface122 LOS 局部操作站Local Operator's Station123 LEDH 局部电气数据公路Local Electrical Data Highway 124 LCN 局部控制网络Local Control Network125 LBOS 局部批量操作站Local Batch Operator Station 126 LRH 局部冗余数据公路Local Redundant Highway127 LCI 局部通信接口Local Communication Interface 128 LAN 局域网Local Area Network129 OS 开放系统Open System130 OSI 开放系统互连Open System Interconnection 131 PCI 可编程控制器接口Programmable Controller Interface 132 PLC 可编程逻辑控制器Programmable Logic Controller 133 COP 控制处理器Control Processor134 CON 控制台Console135 CNM 控制网络模件Control Network Module136 CS 控制系统Control System137 RACS 快速控制站Rapid Control Station138 BRLAN 宽带局域网Broad Band LAN139 BBC 宽带同轴电缆Broad Band Coaxial Cable140 XG 扩充网间连接器Extension Gateway141 SPR 浪涌保护器Surge Protection142 HDP 历史数据处理器Historical Data Processor143 HMO 历史数据存储模件History Module144 HSRS 历史数据存储与检索站Historical Storage And Retrieval Station 145 HTP 历史数据趋势画面Historical Trend Panel146 STI 灵巧变送器接口Smart Transmitter Interface147 TO 令牌Token148 TOR 令牌环Token Ring149 TOB 令牌总线Token BUS150 RO 路由器Router151 LM 逻辑管理器Logic Manager152 PI 脉冲量输入Pulse Input153 ME 曼切斯特编码Manchester Encoding154 MO 模板Module155 AO 模拟量输出Analog Output156 AOM 模拟量输出模板Analog Output Module157 AI 模拟量输入Analog Input158 AIM 模拟量输入模板Analog Input Module159 A/D 模数转换器Analog/Digital Converter160 PDU 配电单元Power Distribution Unit161 IJP 喷墨打印机Ink Jet Printer162 BPU 批量处理单元Batch Processing Unit163 BAC 批量控制Batch Control164 BCS 批量控制站Batch Control Station165 PCSI PC机串行接口Personal Computer Serial Interface 166 PLCG PLC网间连接器PLC Gateway167 FDM 频分多路转换器Frequency Division Multiplexer168 MTBF 平均无故障工作时间Mean Time Between Failures169 MTTR 平均修复时间Mean Time To Repair170 KBPS 千比特/秒Kilobit Per Second171 FEP 前端处理机Front End Processor172 TC 热电偶Thermocouple173 RTD 热电阻Resistance Temperature Detector174 TP 热敏打印机Thermal Printer175 RCS 冗余计算机系统Redundancy Computer System176 RCM 冗余控制模件Redundancy Control Module177 RDH 冗余数据公路Redundancy Data Highway178 FDD 软盘驱动器Floppy Disk Drive179 SM 软手操Soft Manual180 SP 设定值Set Point181 SPC 设定值控制Set Point Control182 AA 声音报警Audio Alarm183 ACC 声音耦合器Acoustic Coupler184 RTCS 实时控制系统Real Time Control System185 RTTP 实时趋势画面Real Time Trend Panel186 RTNOS 实时网络操作系统Real Time Network Operating System 187 VHCU 视频硬拷贝单元Vedio Hard Copy Unit188 SCA 顺控串级Sequence Cascade189 SMA 顺控手级Sequence Manual190 SAU 顺控自动Sequence Automatic191 SCS 顺序控制站Sequence Control Station192 M 手动Manual193 M/A 手动/自动Manual/Automatic194 IOLIP 输入/输出链路接口处理器I/O Link Interface Processor195 IOM 输入/输出模板I/O Module196 IOC 输入/输出通道I/O Channel197 NC 数控Numerical Control198 D/A 数模转换器Digital/Analog Converter199 DAPU 数据采集及处理单元Data Acquisition and Processing Unit 200 DAS 数据采集站(系统) Data Acquisition Station(System) 201 DP 数据处理Data Processing202 DPS 数据处理系统Data Processing System203 DCE 数据电路(通信)设备Data Circuit(Communication)Equipment 204 DH 数据公路Data Highway205 DHP 数据公路端口Data Highway Port206 HCIM 数据公路电缆接口模件Highway Cable Interface Module 207 HIM 数据公路接口模件Highway Interface Module208 DHC 数据公路控制器Data Highway Controller209 HIC 数据公路内部电缆Highway Internal Cable210 HC 数据公路耦合器Highway Coupler211 HEX 数据公路试验器Highway Exerciser212 HTD 数据公路通信指挥器Highway Traffic Director213 HG 数据公路网间连接器Highway Gateway214 DCO 数据集中分配器Data Concentrator215 DB 数据库Data Base216 DL 数据链路Data Link217 DEP 数据输入盘Data Entry Panel218 DTE 数据终端设备Data Terminal Equipment219 DT 数字化输入板Digitizer Tablet220 DO 数字量输出Digital Output221 DOP 数字量输出处理器Digital Output Processor222 DOD 数字量输出装置Digital Output Device223 DI 数字量输入Digital Input224 DIP 数字量输入处理器Digital Input Processor225 DIO 数字量输入输出Digital I/O226 DIOS 数字量输入输出系统Digital I/O System227 DID 数字量输入装置Digital Input Device228 DPLL 数字锁相环Digital Phase Lock Loop229 DIC 数字调节器Digital Controller230 DD 数字显示器Digital Display231 DPM 双口存储器Dual Port Memory232 DMS 双微机站Duplexed Microprocessor Station 233 RAM 随机存储器Random Access Memory234 CV 调节阀Control Valve235 MODFM 调制解调器Modulator/Demodulator236 CP 通信处理器Communication Processor237 CI 通信接口Communication Interface238 CIS 通信接口站Communication Interface Station 239 CC 通信控制器Communication Controller240 CCH 通信信道Communication Channel241 UWS 通用工作站Universal Work Station242 GPIB 通用接口总线(IFFF488) General Purpose Interface Bus 243 GPCI 通用计算机接口General Purpose Computer Interface 244 UCN 通用控制网络Universal Control Metwork245 GG 通用网间连接器General Gateway246 GRP 图形打印机Graphic Printer247 GRD 图形显示器Graphic Display248 GRT 图形终端Graphic Terminal249 PIA 外部接口适配器Peripheral Interface Adapter 250 WDD 温盘机Winchester Disk Drive251 VR 稳压电源Voltage Regulator252 GW 网间连接器Gateway253 NIM 网络接口模件Network Interface Module254 BR 网桥Bridge255 SG 系统接地端System Ground256 FB 现场总线Field Bus257 FTA 现场端子组件Field Termination Assemblies258 SGC 信号公共端Signal Common259 CRC 循环冗余校验Cyclic Redundancy Check260 LCD 液晶显示器Liquid Crystal Display261 ACIA 异步通信接口适配器Asynchronous Communication Interface Adapter 262 FSK 移频键控Frequency Shift Keying263 HM 硬手操Hard Manual264 PAE 优先存取设备扩展器Preferred Access Expander265 DROP 站Drop266 DTS 诊断测试设备Diagnostic Test Set267 FOS 增强型操作站Enhanced Operator Station268 MBPS 兆比特/秒Megabit Per Second269 BRC 支线电缆Branch Cable270 ACT 执行器Actuator271 DDC 直接数字控制Direct Digital Control272 DDCS 直接数字控制站Direct Digital Control Station273 DNC 直接数值控制Direct Numerical Control274 ROM 只读存储器Read Only Memory275 PMC 主多功能控制器Primary Multifunction Controller276 HOST 主机Host277 MS 主站Master Station278 DFK 专用键盘Dedicated Function Keyboard279 RE 转发器Repeater280 A 自动Automatic281 ACS 自动控制系统Automatic Control System282 STC 自整定调节器Self Tunning Controller283 CHP 字符打印机Character Printer284 CHD 字符显示器Character Display285 CHR 字符阅读器Character Reader286 MSCN 中速通信网络Medium Speed Communication Network287 CPR 中文打印机Chinese Printer288 CPU 中央处理器Central Processing Unit289 T 终端Terminal290 OP 总貌画面Overview Panel291 BUS 总线Bus292 BN 总线型网络Bus Network293 CONF 组态Configuration附录 A分散型控制系统文字符号英文索引(参考件)A A (280)AA (182)ACC (183)ACIA (261)ACS (281)ACT (270)A/D (159)AI (157)AIM (158)ALC (2)ALI (3)ALP (1)AMC (56)AO (155)AOM (156)B BAC (163)BALAN (100)BBC (139)BC (98)BCS (164)BER (10)BMOD (95)BN (292)BPS (9)BPU (162)BR (254)BRC (269)BRLAN (138)BUS (291)C CA (99)CAD (104)CAE (106)CAL (112)CAM (105)CAMB (111)CAT (103)CC (239)CCA (23)CCH (240)CCM (107)CDT (16)CGW (110)CHD (284)CHP (283)CHR (285)CI (237)CIS (238)CM (113)CMB (108)CMR (65)CMRR (66)CNC (109)CNM (135)CODEC (11)CON (134)CONF (293)COP (133)COS (4)CP (236)CPR (287)CPU (288)CRC (259)CS (136)CT (7)CV (234)DD/A (198)DAPU (199)DAS (200)DB (215)DCE (203)DCO (214)DCS (55)DD (230)DDB (53)DDC (271)DDCS (272)DEP (217)DFK (278)DH (204)DHC (208)DHP (205)DI (223)DIC (229)DID (227)DIO (225)DIOB (54)DIOS (226)DIP (224)DL (216)DME (24)DMS (232)DNC (273)DO (220)DOD (222)DOP (221)DOS (28)DP (201)DPLL (228)DPM (231)DPS (202)DPU (52)DROP (265)DT (219)DTE (218)DTS (266)E EEPROM (40)ENC (72)ENK (71)ENOS (70)EOS (267)F FAI (68)FB (256)FDD (178)FDM (167)FEP (171)FO (82)FOC (84)FOCA (81)FOH (83)FSK (262)FTA (257)G GG (245)GPCI (243)GPIB (242)GRD (247)GRP (246)GRT (248)GW (252)H HC (210)HCIM (206)HDP (142)HDLC (60)HEX (211)HG (213)HIC (209)HIM (207)HLAIP (58)HLPIU (57)HLS (59)HM (263)HMO (143)HOST (276)HSBN (63)HSCN (62)HSOFRN (61)HSRS (144)HTD (212)HTP (145)I ICC (73)ICS (74)IF (121)IJP (161)IOC (196)IOLIP (194)IOM (195)IPC (75)K KBPS (170)L LAN (128)LAP (101)LBOS (125)LCD ………………………………………………………………………………………………260 LCI ………………………………………………………………………………………………127 LCN ………………………………………………………………………………………………124 LED…………………………………………………………………………………………………48 LEDH………………………………………………………………………………………………123 LEPIU ……………………………………………………………………………………………36 LLAIP ……………………………………………………………………………………………34 LLMAIP……………………………………………………………………………………………33 LLPIU ……………………………………………………………………………………………32 LLS…………………………………………………………………………………………………35LM (15)1 LMA…………………………………………………………………………………………………96 LOG………………………………………………………………………………………………102 LOS………………………………………………………………………………………………122 LP…………………………………………………………………………………………………94 LPD…………………………………………………………………………………………………79 LRH………………………………………………………………………………………………126 LSCN………………………………………………………………………………………………37MM…………………………………………………………………………………………………192 M/A………………………………………………………………………………………………193 MAC…………………………………………………………………………………………………77 MAL…………………………………………………………………………………………………76 MAP…………………………………………………………………………………………………69 MAS…………………………………………………………………………………………………78MBM ………………………………………………………………………………………………29 MBPS………………………………………………………………………………………………268 MC…………………………………………………………………………………………………44 MCS…………………………………………………………………………………………………45 MDP…………………………………………………………………………………………………39 ME (153)MLDC ………………………………………………………………………………………………46 MO...............................................................................................................154 MODEM (235)MON ………………………………………………………………………………………………118 MS ………………………………………………………………………………………………277 MSCN............................................................................................................286 MTBF (168)MTD ………………………………………………………………………………………………27MTTR ……………………………………………………………………………………………169 MUX ………………………………………………………………………………………………47 MV …………………………………………………………………………………………………20NNC ………………………………………………………………………………………………197 ND ………………………………………………………………………………………………120253OOFT ………………………………………………………………………………………………80OP ………………………………………………………………………………………………290 OPC ………………………………………………………………………………………………22 OPS ………………………………………………………………………………………………21OS ………………………………………………………………………………………………129 OSI ………………………………………………………………………………………………130PPAE ………………………………………………………………………………………………264 PCFA ………………………………………………………………………………………………38 PCI ………………………………………………………………………………………………131 PCL ………………………………………………………………………………………………89 PCS ………………………………………………………………………………………………90PCSI ……………………………………………………………………………………………165 PDU ………………………………………………………………………………………………160 PI ………………………………………………………………………………………………152 PIA ………………………………………………………………………………………………249 PIOC ………………………………………………………………………………………………91 PIOCH ……………………………………………………………………………………………92 PIU ………………………………………………………………………………………………88 PLC ………………………………………………………………………………………………132 PLCG ……………………………………………………………………………………………16697 PLT ………………………………………………………………………………………………12 PM ………………………………………………………………………………………………86 PMC ………………………………………………………………………………………………275 PMM ………………………………………………………………………………………………87 PR …………………………………………………………………………………………………30 PROWAY ……………………………………………………………………………………………93 PS …………………………………………………………………………………………………41 PSC ………………………………………………………………………………………………42 PV …………………………………………………………………………………………………85RRACS ……………………………………………………………………………………………137 RAM ………………………………………………………………………………………………233 RBC …………………………………………………………………………………………………7 RBCD ………………………………………………………………………………………………8 RCM ………………………………………………………………………………………………176 RCS ………………………………………………………………………………………………175 RDH ………………………………………………………………………………………………177 RE ………………………………………………………………………………………………279 RMC …………………………………………………………………………………………………5 RMCD ………………………………………………………………………………………………6 RO…………………………………………………………………………………………………150 ROM………………………………………………………………………………………………274 RTCS………………………………………………………………………………………………184 RTD………………………………………………………………………………………………173 RTNOS……………………………………………………………………………………………186 RTTP………………………………………………………………………………………………185S SAL…………………………………………………………………………………………………26 SAP…………………………………………………………………………………………………19 SAS…………………………………………………………………………………………………18SAU………………………………………………………………………………………………190 SC…………………………………………………………………………………………………115 SCA………………………………………………………………………………………………188 SCGU………………………………………………………………………………………………43SCS………………………………………………………………………………………………191 SG…………………………………………………………………………………………………255 SGC………………………………………………………………………………………………258 SHM…………………………………………………………………………………………………67 SL…………………………………………………………………………………………………114 SLDC………………………………………………………………………………………………31 SM…………………………………………………………………………………………………179 SMA………………………………………………………………………………………………189 SOPS………………………………………………………………………………………………119 SP…………………………………………………………………………………………………180SPC………………………………………………………………………………………………181 SPR………………………………………………………………………………………………141 SS…………………………………………………………………………………………………116 STC………………………………………………………………………………………………282 STI………………………………………………………………………………………………146TT…………………………………………………………………………………………………289 TC…………………………………………………………………………………………………172 TL…………………………………………………………………………………………………25 TO…………………………………………………………………………………………………147 TOB………………………………………………………………………………………………149 TOR………………………………………………………………………………………………148 TP…………………………………………………………………………………………………174 TRC…………………………………………………………………………………………………64U UAC…………………………………………………………………………………………………14UCN………………………………………………………………………………………………244 UDM…………………………………………………………………………………………………15 UPS…………………………………………………………………………………………………13UWS………………………………………………………………………………………………241V V……………………………………………………………………………………………………49 VHCU………………………………………………………………………………………………187 VP…………………………………………………………………………………………………51 VPR…………………………………………………………………………………………………50 VR…………………………………………………………………………………………………251WWDD………………………………………………………………………………………………250 WDT………………………………………………………………………………………………117X XG…………………………………………………………………………………………………140 注：附录A中的各数字是文字符号的编号附加说明:本标准由机械工业部重庆工业自动化仪表研究所提出并归口。
汽车英文缩写
汽车行业常用英文缩写3C Customer(顾客导向)、Competition(竞争导向)、Competence（专长导向）4S Sale, Sparepart零配件, Service, Survey信息反馈5S 整理，整顿，清理，清洁，素养AIAG 美国汽车联合会CART carton 卡片纸C.P.M Certified Purchasing manager 认证采购经理人制度CB- Confirmation Build 确认样车制造CC- Change CutOff 设计变更冻结COD Cash on Delivery 货到付现预付货款(T/T in advance)CP1- Confirmation Prototype 1st 第一次确认样车CP2- Confirmation Prototype 2nd 第二次确认样车Cpk 过程能力指数Cpk=Zmin/3DFA- Design For Assembly 面向装配的设计DOE Design Of Examination试验设计DVP&R Design Validate Plan&Report设计验证计划报告ES Engineering Specification工程规EDI electronic data interchange 电子数据交ESI Early Supplier Involvement 供应商先期参与Ex-Work（工厂交货）、FOB（船上交货）、FAS（船边交货）或CIF（运保费在内交货）FRG- Ford Reliability Guideline 福特可靠性指导FSS- Full service supplier 全服务供应商GD&T- Geometric Dimensioning & Tolerancing 标准公差GR&R Guage Repeatability&reproducibility量具的重复性和再现性HTFB- Hard Tooling Functional Build 工装集成调试与验证LP－Lean Production 精益生产MPV Multi-PurposeVehicle 多用途汽车MTP- Make to print supplier 照图加工供应商NDA Non Disclosure Agreement 保密协定NVH- System Noise, Vibration & Harshness 系统噪音,振动及粗糙性P- First Phase of Production Prove-Out 第一次试生产PAT- Program Attributes Team 产品属性小组PIPC- Percentage of Indexes with Process Capability 能力指数百分比PIST- Percentage of Inspection points Satisfying Tolerance 检测点满意工差百分比PMT- Program Moudle Team 产品模块小组PPAP- Production Part Approval Process 生产件批准程序QFD Quality Funtion Deploy质量功能展开QR- Quality Reject 质量拒收RFQ Request For Quotation询价ROI return on investment 报酬率SDS- System/ Design Specifications 系统/设计说明SOW- state of work 工作申明SREA- Supplier Request for Engineering Approval 供应商工程设计更改申请TCO Total Cost of Ownership 总持有成本TTO-Tool Try Out 工装验证OSM- Outside of MaterialOTC Over The Counter 非处方药，可在柜台上卖的药PA Program Approvalpallet n. 托盘Passenger Vehicle 乘用车PAT- Program Attributes Team 产品属性小组PDL Product Design LetterPH Proportions&HardpointsPIPC- Percentage of Indexes with Process Capability 能力指数百分比PIST- Percentage of Inspection points Satisfying Tolerance 检测点满意工差百分比PMT- Program Moudle Team 产品模块小组PO Purchase OrderPPAP- Production Part Approval Process 生产件批准程序PPSR Production Preparation Status ReportPQA Process Quality AssurancePR Program ReadinessPre-Launch 试生产price-driven costing 价格引导成本Production Preparation-Final Nissan - PT2/Renault - PPProduction Preparation-Initial Nissan - PT1/Renault - PPP3Production Trial Run 试生产Prototype 样件QFD Quality Funtion Deploy质量功能展开QFTT Quality Functional Task TeamQR- Quality Reject 质量拒收QS Quality StandardRAN Release Authorisation Numberreverse 倒车档RFQ Request For Quotation询价RKD Reverse Knock DownRLQ Receiving Lot QuantityROC Rate of ClimbROI return on investment 报酬率ROP Re-Order PointRTO Required To OperateSAIS Supplier Assessment & Improvement SystemSC Strategic Confirmation/signif icant Charac’teristicsSDS- System/ Design Specifications 系统/设计说明second gear 二档SFMEA System FMEAShipping Date 出货日、Invoice Date 发票日或On Board Date 装船日Side Windshield 侧窗玻璃SJ Strategic IntentSNP Standard Number of Parts1PP- First Phase of Production Prove-Out 第一次试生产3C Customer(顾客导向)、Competition(竞争导向)、Competence（专长导向）4S Sale, Sparepart零配件, Service, Survey信息反馈5S 整理，整顿，清理，清洁，素养8D- 8 DisciplineABS Anti-lock Braking SystemAIAG 美国汽车联合会ANPQP Alliance New Product Quality ProcedureApportionment 分配APQP Advanced Product Quality PlanBacklite Windshield 后窗玻璃Benchmark Data 样件资料bloodshot adj.充血的, 有血丝的BMW Bavarian Motor WorksSOW- state of work 工作申明SPC Statistical Process ControlSQA Supplier Quality AssuranceSREA- Supplier Request for Engineering Approval 供应商工程设计更改申请ST Surface TranferSTRS Supplier Test Report SystemSubcontractor 分承包商Sunroof Windshield 天窗玻璃SUV Sports Utility VehicleTAG Test Aptitude GraphiqueTCO Total Cost of Ownership 总持有成本TCRA Total Cost Reduction ActivityTGR Things Gone RightTGW Things Gone WorstTM Techinical ManualTPM Total Preventive MaintenanceTTO-Tool Try Out 工装验证UOM Unit Of MeasureVES Vehicle uation SystemVO- Vehicle Operation 主机厂VPP- Vehicle Program Plan 整车项目计划VQA Vehicle Quality AssuranceVTTO- Vendor Tool Try-Out 供应商工装验证WERS- World Wide Engineering Release SystemWVTA Whole Vehicle Type Approval凹坑concave车床lathe抽查试验spot check test出厂试验delivery test次品defective product调幅amplitude modulation (AM)调频Frequency Modulation断差offset对讲机interphone法平面normal plane翻车rollover返工re-doing防滑地板no-skid floor仿真emulation副作用side effect改装厂refitting factory隔热板heat shield后围侧板rear wall side cover划痕scratchC.P.M Certified Purchasing manger 认证采购经理人制度CB- Confirmation Build 确认样车制造CC- Change CutOff 设计变更冻结CCSC- critical/significant characteristicCCR Concern & Countermeasure RequestCCT Cross Company TeamCharacteristics Matrix 特性矩阵图COD Cash on Delivery 货到付现预付货款(T/T in advance) CP1- Confirmation Prototype 1st 第一次确认样车CP2- Confirmation Prototype 2nd 第二次确认样车Cpk 过程能力指数Cpk=Zmin/3CPO Complementary Parts OrderCraftsmanship 精致工艺Cross-functional teams跨功能小组CUV Car-Based Ultility VehicleD1：信息收集；8DD2：建立8D小组；D3：制定临时的围堵行动措施，避免不良品流出；D4：定义和证实根本原因，避免再发；D5：根据基本原因制定永久措施；D6：执行和确认永久措施；D7：预防再发，实施永久措施；D8：认可团队和个人的贡献。
Vaisala WMT700系列风速传感器用户指南说明书
Order Form Valid from2022-02-11MASTERDOC221319-WChecked: AMPN / 2021-12-17Accepted: JGL / 2022-02-11Vaisala Ultrasonic Wind SensorWMT700WMT 7 01Measurement range40 m/s WMT701165 m/s WMT702275 m/s WMT703390 m/s WMT704440 m/s + Accredited Wind Calibration (WMT701)A65 m/s + Accredited Wind Calibration (WMT702)B75 m/s + Accredited Wind Calibration (WMT703)C90 m/s + Accredited Wind Calibration (WMT704)D2Temperature range-10...+60 C A-40...+60 C B-55...+70 C C3HeatingNon-heated version1Heated transducers2Heated transducers and arms3Heated transducers, arms and body44Digital communication interfaceRS-485 isolated ARS-422 isolated BRS-232 isolated CSDI-12 isolated D5Digital communication profileWMT70 - poll mode (default)9600b, 8, N, 1 Polled0WS425 - ASCII 2400b, 8, N, 1 Polled1WS425 - NMEA Extended(v 0183)9600b, 8, N, 1 Auto send 1/s2WS425 - SDI-12 (v 1.3)1200b, 7, E, 1 Polled3WS425 - ASOS 2400b, 8, N, 1 Polled4ROSA - MES12 9600b, 8, N, 1 Polled5US AWOS - NMEA Standard2400b, 8, N, 1 Autosend 5/s6FAA - Federal9600b, 8, N, 1 Polled7AWS520 - NMEA Extended(v 0183)4800b, 8, N, 1 Auto send 1/s8Low power mode for AWS3109600b, 8, N, 1 Polled9MARINE 1 - NMEA Extended(v 0183)4800b, 8, N, 1 Auto send 1/s AMARINE 2 - NMEA Standard(v 0183)4800b, 8, N, 1 Auto send 1/s B6Digital communication unitsm/s Aknots Bmph Ckm/h D7Analog output signals for wind speed channelDisabled0Voltage output100 mV/m/s1Current output 4...20 mA(0...Range m/s)3Current output0.2 mA/m/s4Push-Pull frequency output10 Hz/m/s6WS425 - voltage output8 mV/mph7WS425 - frequency output (Push-Pull) 5 Hz/mph8Pull up frequency output (PNP)10 Hz/m/s APull down frequency output (NPN)10 Hz/m/s B8Analog output signals for wind direction channelDisabled0Voltage output20 mV/Deg ACurrent output50 uA/Deg DCurrent output 4...20 mA44.444 uA/Deg EPotentiometer output (WS425)0...Vref (Vref = external reference voltage from system)F9CableNone1Cable 2 m, cable connector, open leads on one end WMT70Cable12Cable 10 m, cable connector, open leads on one end WMT70Cable23MAWS cable 10 m WMT70Cable34RS485 Cable 2 m, cable connector, open leads on one end WMT70Cable88RS485 Cable 10 m, cable connector, open leads on one end WMT70Cable99Junction Box with Cable 2meters WMT70Cable12DCable 15 m, cable connector, open leads on one end WMT70Cable13ECable 26 m, cable connector, open leads on one end WMT70Cable14FHybrid cable 2 m, cable connector, open leads on one end WMT70Cable15GHybrid cable 10 m, cable connector, open leads on one end WMT70Cable16HHybrid cable 15 m, cable connector, open leads on one end WMT70Cable17JHybrid cable 26 m, cable connector, open leads on one end WMT70Cable18K 10Mounting adapterAdapter 228869 only Standard adapter, no fix AAdapter 228869 with WMT70FIX70Standard adapter with general purpose fix BAdapter 228869 with WMT700FIX60-MARINE Marine adapter with stainless steel fix for 60 mm pole CAdapter 228869 with WMT700FIX60-RST Standard adapter with stainless steel fix for 60 mm pole DAdapter 228777 only (used for old WS425 FIX30/60)WS425 compatible adapter, no fix EAdapter 228777 with WS425FIX60WS425 compatible adapter with WS425FIX60FAdapter 228869 with ASM212140 (suitable for 4258057 mounting)ASOS mounting adapter GAdapter 228777 with WAC425 (suitable for inverted mounting)Adapter with sensor arm for 60mm pole HAdapter 228869 with ASM214411Standard adapter with stainless steel fix for 50 mm pole J 11Power - Reserved for furture purposesNone1 12AccessoriesNone ABird cage WMT70BirdKit B 13ManualNone1English2Japanese3Chinese4Russian5DEIF6French7Spanish8For freezing conditions select appropriate combination of heating and temperature ranges.AccessoriesTool Verifier WMT70VerifierBird Bird cage WMT70BirdKitBird perch WS425BirdPerchCable Cable 2 m, cable connector, open leads on one end227567SP Cable 10 m, cable connector, open leads on one end227568SPCable 15 m, cable connector, open leads on one end237890SPCable 26 m, cable connector, open leads on one end237889SPRS485 Cable 2 m, cable connector, open leads on one end228259SPRS485 Cable 10 m, cable connector, open leads on one end228260SPMAWS cable 10 m227565SPROSA analog cable 10 m, cable connector, open leads on one end231425SPAdapter cable for WS425 serial227569SPAdapter cable for WS425 analog frequency output227570SPJunction Box with Cable 2meters ASM210719SPWMT700 USB service cable240855Universal USB service cable with screw terminal for RS485 or RS232240884Hybrid cable 2 m, cable connector, open leads on one end CBL210706-2MSPHybrid cable 10 m, cable connector, open leads on one end CBL210706-10MSPHybrid cable 15 m, cable connector, open leads on one end CBL210706-15MSPHybrid cable 26 m, cable connector, open leads on one end CBL210706-26MSP Mounting WMT700 Mounting Accessories:Adapter for FIX70228869Fix70 (suitable also for inverted mounting)WMT70FixSPMounting adapter 60mm POM WMT700FIX60-POMSP Mounting adapter 60mm RST WMT700FIX60-RSTSP Cross-arm (40x40x850mm)WMT70CROSSARMMounting adapter between 228869 and 4258057ASM212140Mounting adapter 50mm RST ASM214411WS425 Mounting Accessories:Adapter for old WS425 FIX30/60228777FIX30WS425Fix30FIX60WS425Fix60Sensor support arm for 60mm pole (655mm with integrated fix for item 228777)WAC425Power Outdoor AC (mains) power supply for arm heated and fully heated WMT700PJB480Display Wind display XDi-N 144 (5’’ display) for ship navigation252307 Wind display XDi-N 192 (7’ display) for ship navigation252321。
整车制造过程部分英文缩写简介
40BOM生产制造用的物料清单Bill Of Material41EBOM设计物料清单Engineering Bill Of Material42PBOM规划物料清单Process Bill Of Material43MBOM生产物料清单Manufacturing Bill Of Material44SKD半散件组装Semi-knocked Down45CKD全散件组装Complete Knocked Down46KD散件组装Knocked Down47ERP企业资源计划Enterprise Resources Plan48SAP企业物料管理Systems Applications and Products49TQM全面质量管理Total Quality Management50SPC统计过程控制Statistical Process Control51DRR直行率Direct Run Rate52PPM百万分之一Parts per Million53DTS尺寸技术说明Dimensional Technical Specification54APQP 先期产品质量策划Advanced Product Quality Planning55 BIW 白车身Body In White56CPV单车成本Cost per Vehicle57DPV单车缺陷数Defect per Vehicle58 GA Shop总装车间General Assembly Shop59\涂装车间Paint Shop60\车身车间Body Shop61\冲压车间Press Shop62IE工业工程Industrial Engineering63JIT准时制Just in Time64KCC关键控制特性Key Control Characteristics65KPC 关键产品特性Key Product Characteristic66MTS 生产技术规范Manufacturing Technical Specification67QE 质量工程师Quality Engineer 68QS 质量体系Quality System69SPC 统计过程控制Statistical Process Control70HPV单车制造工时Hour per Vehich71 STD 标准化Standardization编制：技术质量科总装工艺室。
电子行业专业词汇术语(专业超全)
电子行业专业词汇术语(专业超全)————————————————————————————————作者：————————————————————————————————日期：电子行业专业词汇术语GRR Gauge Repeatability Reproducibility 量测的再现性与再生性FPI First Piece Inspection 首件检查Sampling without replacement 不放回抽样SQA: Source(Supplier) Quality Audit 供货商品质审核1. QC : quality control 质量管理2. IQC : incoming quality control 进料质量管理3. OQC : output quality control 出货质量管理4. PQC : process quality control 制程质量管理也称IPQC : in process quality control .5. AQL : acceptable quality level 允收标准6. CQA: customer quality assurance 客户品质保证7. MA : major defeat 主要缺点8. MI : minor defeat 次要缺点9. CR :critical defeat 关键缺点10. SMT : surface mounting technology表面粘贴技术11. SMD :surface mounting device 表面粘贴程序SMC : surface mounting component 表面粘贴组件12.ECN : engineering change notice 工程变更通知13.DCN : design change notice 设计变更通知14.PCB : printed circuit board 印刷电路板15.PCBA : printed circuit board assembly装配印刷电路板16. BOM : bill of material 材料清单17. BIOS : basically input and output system基本输入输出系统18. MIL-STD-105E : 美国陆军标准,也称单次抽样计划.19. ISO : international standard organization 国际标准化组织20. DRAM: 内存条21. Polarity : 电性22. Icicles : 锡尖23. Non-wetting : 空焊24. Short circuit : 短路25. Missing component : 缺件26. Wrong component :错件27 . Excess component :多件28. Insufficient solder : 锡少29 . Excessive solder :锡多30. Solder residue: 锡渣31. Solder ball : 锡球32. Tombstone : 墓碑33 . Sideward：侧立34. Component damage :零件破损35. Gold finger:金手指36. SOP : standard operation process 标准操作流程37. SIP : standard inspection process 标准检验流程38 .The good and not good segregation :良品和不良品区分39. OBW : on board writer 熸录BIOS40 . Simple random sampling : 简单随机抽样41. Histogram : 直方图42 . Standard deviation : 标准差43. CIP : Continuous improvement program 持续改善计划44. SPC : Statistical process control 制程统制45 . Sub-contractors : 分包商46. SQE: Supplier quality engineering 47. Sampling sample :抽样计划48. Loader : 治具49. QTS: Quality tracking system 质量追查系统50. Debug : 调试51. Spare parts: 备用品52. Inventory report for : 库存表53. Manpower/Tact estimation 工时预算54. Calibration : 校验55. S/N :serial number 序号56. Corrugated pad : 波纹垫57.Takeout tray: 内包装盒58. Outer box : 外包装箱59. Vericode : 检验码60. Sum of square : 平方和61. Range : 全距62. Conductive bag : 保护袋63. Preventive maintenance :预防性维护64. Base unit : 基体65. Fixture : 制具66. Probe : 探针67. Host probe : 主探针68. Golden card : 样本卡69. Diagnostics program : 诊断程序70. Frame : 屏面71. Lint-free gloves : 静电手套72 .Wrist wrap : 静电手环73. Target value : 目标值74. Related department : 相关部门75. lifted solder 浮焊76.plug hole孔塞77. Wrong direction 极性反ponent damage or broken 零件破损79.Unmelted solder熔锡不良80.flux residue松香未拭81.wrong label or upside down label贴反82. mixed parts机种混装83. poor solder mask绿漆不良84. oxidize 零件氧化85.stand off height浮高86. IC reverse IC反向87.supervisor课长88. Forman组长89. WI=work instruction作业指导90. B.P. 非擦除状态91. Internal notification: 内部联络单92. QP :Quality policy质量政策93. QT: Quality target 品质目标94. Trend:推移图95.Paret柏拉图96. UCL: Upper control limit管制上限97.LCL:Lower control limit管制下限98. CL: Center line中心线99.R.T. Rolled throughout yield直通率100. PPM: Parts per million 不良率101.DPU: Defects per unit 单位不良率102.Resistor: 电阻103.Capacitor:电容104. Resistor array : 排阻105. Capacitor array: 排容106. DIODE: 二极管107.SOT: 三极管108. Crystal:震荡器109.Fuse:保险丝110.Bead: 电感inductance 111.Connector:联结器112.ADM: Administration Department行政单位113. CE: Component Engineering零件工程114. CSD :Customer Service Department客户服务部115. ID: Industrial Design工业设计116.IE: Industrial Engineering工业工程117. IR: Industrial Relationship工业关系118. ME: Mechanical Engineering机构工程119. MIS :Management Information System信息部120. MM: Material Management资材121. PCC: Project Coordination/Control专案协调控制122. PD: Production Department生产部123. PE: Product Engineering产品工程124. PM: Product Manager产品经理125. PMC: Production Material Control生产物料管理126. PSC: Project Support & Control产品协调127. Magnesium Alloy:镁合金128. Metal Shearing:裁剪129.CEM:Contract Electronics Manufacturing电子制造服务企业EMS: Electronics Manufacturing Services130. ERP: Enterprise Resource Planning 企业资源规划SCM+CRM+ERP+EAI=Network direct TM links procurement, production, Logistics and sales采购,生产,后勤管理及市场营销的融合EAI: Enterprise application Integration 企业应用系统整合CRM: Customer Relationship Planning 客户服务规划SCM : Supply chain management 供应链管理131. OJT: On job training 在职培训132.Access Time: 光盘搜寻时间133. B2CEC:Business to consumer electronic commerce 企业对消费者的电子商务B2BEC:Business to business electronic Commerce 企业间的电子商务L:Copper Clad Laminate 铜箔基板135. Intranet: 企业内部通讯网路136. ISP: Internet Service Provider网络服务提供者ICP: Internet Content Provider网络内容提供者137. GSM: Global System for Mobile Communication 泛欧数字式行动电话系统GPS: 全球卫星定位系统138. Home Page: 网络首页139.Video Clip:影像文件140. HTML:超文标记语言141.Domainname: 网域名称142. IP: 网络网域通讯协议地址143.Notebook:笔记型计算机144. VR: Virtual Reality虚拟实境145. WAP: Wireless Application Protocol无线应用软件协议146. LAN : Local area network局域网络WW World Wide Web世域网W AN: Wide Area Network 广域网络147. 3C: Computer, Communication, Consumer electronic 计算机, 通讯, 消费性电子三大产品的整合rmation Supplier Highway:信息高速公路149.UPS:Uninterrupted power system不断电系统150.Processed material: 流程性材料151.Entity/Item:实体152.Quality loop:质量环153.Quality losses: 质量损失154.Corrective action:纠正措施155. Preventive action:预防措施156.PDCAlan/Do/Check/Action计划/实施/检查/处理157. Integrated circuits(IC):集成电路158.Application program: 应用程序159.Utilities:实用程序160.Auxiliary storage/Second storage:;辅助存储器161.Silicon chip:硅片162Diskette drive:软驱163.Display screen/Monitor:显示器164.Foreground:前面165.Montherboard:母板166.Mermory board: 内存板167.Slot:插槽168.Busata-bus/address-bus/Control bus: 总线/数据总线/地址总线/控制总线169.Plotter:绘图170.MPC:Multimedia personal computer多媒体171.Oscillator:振荡器172.Automatic teller terminal:自动终端(出纳)机173.Joystick port:控制端口174.VGA: Video Graphics Array显示卡175.Resolution:分辨率176.Register:寄存器177.ISA: Industry Standard Architecture 工业标准结构178.EISA: Extended Industry Architecture 扩展工业标准结构179.Adapter: 适配器180.Peripheral:外部设备181.Faxmodem:调制解调器181.NIC:Network interface card网络接口卡182. SCSI: Small computer system interface 183.VESA: Video Electronic Standards Association184. SIMM: Single in-line memory module 单排座存储器模块(内存条) 185.Casing:外箱186.Aluminum:铝质187.Ceramic: 陶瓷的188.Platter:圆盘片189.Actuator:调节器190.Spindle:轴心191.Actuation arm: 存取臂192.Default code: 缺省代码193.Auxiliary port:辅助端口194.Carriage return : 回车195.Linefeed:换行197.Video analog: 视频模拟196.ASCII: American Standard Code for Information Interchange美国信息互换标准代码198.TTL: Transistor- Transistor logic晶体管-晶体管逻辑电路199.Three-prong plug:三芯电插头200.Female connector:连接插座201.Floppy disk:软盘202.Output level: 输出电平203.V ertical/Horizontal synchronization: 场/行同步204.H(Horizontal)-Phase:行相位patible:兼容机206.Hardware Expansion Card: 硬件扩充卡207.Buffer:缓冲208.CRM:Customer relationship Management 客户关系管理209.WIP: Work in process半成品210.Waiver:特别采用211.CXO系列—CEO: Chief Executive Office 首席执政官；执行总裁COO: Chief Operating OfficeCFO: Chief Finance OfficerCBO: Chief Business OfficerCTO: Chief Technology OfficerCIO: Chief Information OfficerCGO: Chief Government Officer212. NASDAQ: 纳斯达克证券市场NASDAQ Automated Quotation system213.VC: Venture Capital 风险投资214. PDA: Personal Date Assistant个人数字助理PLA: Personal Information Assistant个人信息助理215. PPAP: Advanced Product Quality Planning and Control Plan 生产性零组件核准程序216. FMEA: Potential Failure Mode and Effects Analysis 失效模式与效应分析217. MSA: Measurement Systems Analysis 量测系统分析218. QAS: Quality System Assessment 质量系统评鉴219. Cusum: 累计总合图220. Overall Equipment Effectiveness设备移动率221. Benchmarking: 竞争标杆Analysis of motion/Ergonomics动作分析/人体工程学222. Roka Yoke 防错法MCR: machine capability ratio 机器利用率223. Mistake Proofing 防呆法Taguchi methods田口式方法224, Vertical integration垂直整合Surveillance定期追踪审查225. EMS: Electronics Manufacturing Supply-chain226. Cause & Effects charts特性要因图227. Scatter: 散布图Fool-Proof System 防呆系统228. VE: Value Engineering 价值工程QFD: Quality Function Development 质量机能展开229. Arrow Chart 箭头图法Affiliate Chart亲和图法230. PDPC: Process Decision Program Chart System Chart系统图法231. Relation Chart 关边图法Matrix Chart矩阵图法232. Matrix Data Analysis 矩阵数据分析法234. Brain-storm 脑风暴法JIT: Just In Time:及时性生产模拟235. Deming Prize: 戴明奖Prototype技术试作236. BPM: Business Process Management 业务流程管MBO目标管理237. MBP:方针管理FTA:故障树分析QSC 服务质量238. IPPB: Information 情况planning策划Programming规划Budget预算239. EQ: Emotion Quotient:情商IQ: Intelligence Quotient:智商240. Implied Needs:隐含要求Specified Requirement:规定要求241. Probation:观察期Incoming Product released for urgent production 紧急放行242.Advanced quality planning 先进的质量策划243. AOQ: Average Outgoing Quality 平均检出质量AOQL: Average Outgoing Quality Limit 平均检出质量界限244.Approved Supplier List 经核准认可的供应商名单245.Attribute date 特征Benchmarking 基准点Calibration 校准246.Capable process工序能力Capability Index序能力指数Capability ratio工序能力率247.CHANG CYCLE TIME 修改的时间周期Continuous improvement 持续改进248. Control plans控制策划Cost of quality 质量成本249. Cycle time reduction减少周期时间250. Design of experiments 实验设计Deviation / Substitution偏差/置换251. ESD: Electrostatic discharge静电释放252. EH&S: Environmental, Health, and Safely 环境,健康.安全253. ESS: Environmental Stress Screening 环境应力筛选254. FMEA: Failure Mode Effect Analysis 失误模式效应分析255. First Article approval 产品的首次论证256. First pass yield 一次性通过的成品率257. First sample inspection第一次样品检验258. FMECA: Failure mode effect and critically analysis 失误模式,效应及后果分析259. Gauge control 测量仪器控制260. GR&R: Gauge repeatability and reproducibility 测量仪器重复性和再现性261. HALT: Highly Accelerated Life Test 高加速寿命试验262. HAST: Highly Accelerated Stress Test 高加速应力试验263. IN-CONTROL PROCESS 受控制工序264. INDUSTRIAL AVERAGE 工业平均数265. JIT (just in time) manufacturing (实时)制程266. Key characteristic关健特征267. Key component关健构件268. Life Testing寿命试验269. Lot traceability 批量可追溯性270. Material review board原材料审查部门MCR: machine capability ratio机械能力率271. NONCONFORMANCE不符合272. OUT-OF-CONTROL PROCESS失控工序273. Pilot Application试产(试用) 274. PPM: Parts per million百万分之一275. Preventive VS detection预防与探测Preventive maintenance预防维护276. Process capability index工序能力指277. Process control工序控制278. Process improvement工序改进279. Process simplification 过程简化280. Quality Clinic Process Chart (QCPC)质量诊断过程图281. Quality information system质量资料体系282. Quality manual质量手册283. Quality plan质量计划284. Quality planning质量策划285. Quality policy质量方针286. Quality system质量体系287. Reliability可靠性RUN Chart趋势表288. Skill Matrix技能表289. Statistical quality control (SQC)统计质量控制290. Teamwork 团队工作291. Total quality management全面质量管理292. Variable data变量数据293. Variation影响变量294. Value Analysis值分析295. Visual Factory形象化工厂296. Survey Instructions调查指引297. Profile 概况298. Improvement Plan改进计划299. Evaluation评估300. implementation实施301. Compliance符合302. Supplier Audit Report供方审核报告303. Site Audit现场审核304. Typical agenda典型的议事日程305. Internal and external failure costs内部和外部的失误成本306. Failure rate percentage 失误百分率307. Productivity (output / input)生产率(产出/投入) 308. Customer complaints 客户投诉309. Customer satisfaction indices 客户满意度指数310. Root cause analysis of failures失误根原分析品管中英文名词对照表Accuracy准确度Active主动Action评价.处理Activity活动Add加Addition rule加法运算规则Analysis Covariance协方差分析Analysis of Variance方差分析Appraisal Variation评价变差Approved承认ASQC美国质量学会Attribute计数值Audit审核Automatic database recovery数据库错误自动回复Average平均数balance平衡Balance sheet资产负债对照表Binomial二项分配Body机构Brainstorming Techniques脑力风暴法Business Systems Planning企业系统规划Cable电缆Capability能力Cause and Effect matrix因果图.鱼骨图Center line中心线check检查Check Sheets 检查表Chi-square Distribution 卡方分布Clutch spring 离合器弹簧Coining 压印加工Common cause 共同原因Complaint 投诉Compound factor 调合因素Concept 新概念Condenser 聚光镜Conformity 合格Connection 关联Consumer’s risk 消费者之风险Control 控制Control characteristic 管制特性Control chart 管制图Control plan 管制计划Correction 纠正Correlation Methods 相关分析法Cost down 降低成本CPI: continuouse Process Improvement 连续工序改善Creep 渐变Cross Tabulation Tables 交*表CS: customer Sevice 客户中心Cushion 缓冲Customer 顾客DSA: Defects Analysis System 缺陷分析系统Data 数据Data Collection 数据收集Data concentrator 资料集中缓存器DCC: Document Control Center 文控中心Decision 决策.判定Defects per unit 单位缺点数Description 描述Detection 难检度Device 装置Digital 数字Do 执行DOE: Design of Experiments 实验设计Element 元素Else 否则Engineering recbnology 工程技术Entropy 函数Environmental 环境Equipment 设备Estimated accumulative frequency 计算估计累计数E Equipment Variation 设备变异Event 事件External Failure 外部失效,外部缺陷FA: Failure Analysis 坏品分析Fact control 事实管理Fatique 疲劳FMEA: Failure Mode and Effect analysis 失效模式与效果分析FPY 合格率FQA: Final Quality Assurance 最终品质保证FQC: Final Quality control 最终品质控制Full-steer完全转向function职能Gauge system量测系统Grade等级Gum-roll橡皮滚筒Health meter体重计Heat press冲压粘着Histogram直方图Hi-tech高科技hypergeometric超几何分配hysteresis磁滞现象Improvement改善Inductance电感Information信息Initial review先期审查Inspection检验Internal Failure内部失效,内部缺陷IPQC: In Process Quality Control制程品质控制IQC: Incomming Quality Control来料品质控制IS International Organization for Standardization国际标准组织Law of large number大数法则Link连接LCL: Lower Control limit管制下限LQC: Line Quality Control生产线品质控制LSL: Lower Size Limit规格下限Machine机械Manage管理Materials物料Measurement量测Median中位数Miss feed漏送Module,sub-system,sub-unit单位Momentum原动力Monte garlo method原子核分裂热运动法MSA: Measurement System Analysis量测系统分析Multiplication rule乘法运算规则NIST 美国:标准技术院Normal常态分布Occurrence发生率On.off system开,关系统Operation Instruction作业指导书Organization组织Parameter参数Parto柏拉图Parts零件Parts per million不良率Passive消极的,被动的Plan计划Pulse 脉冲Policy 方针Population 群体Power 力量,能源PQA: Process Quality Assurance 制程品质保证Practice 实务Precision 精密度preemptive 先占式多任务Pressure 压缩Prevention 预防Probability 机率Probability density function 机率密度函数Procedure 流程Process 过程Process capability analysis制程能力分析图Process control and process capability制程管制与制程能力Producer’s risk生产者之风险Product产品Production生产Program方案Projects项目QA: Quality Assurance品质保证QC: Quality Control品质控制QE: Quality Engineering品质工程QFD: Quality Function Desgin品质机能展开Quality质量Quality manual品质手册Quality policy品质政策Random experiment随机试验Random numbers随机数Range全距Record记录Reflow回流Reject拒收Repair返修Repeatusility再现性Reproducibility再生性Requirement要求Residual误差Response响应Responsibilities职责Review评审Reword返工Robustness稳健性Rolled yield直通率RPN: Risk Priority Number风险系数sample抽样,样本Sample space样本空间Sampling with replacement放回抽样Sampling without peplacement不放回抽样Scatter diagram散布图分析Scrap报废Screw螺旋Severity严重度Shot-peening微粒冲击平面法Simple random sampling简单随机取样Size规格SL: Size Line规格中心线Slip滑动Stratified random sampling分层随机抽样SOP: Standard Operation Procedure标准作业书SPC: Statistical Process Control统计制程管制Special cause特殊原因Specification规范SQA: Source(Supplier) Quality Assurance供货商品质保证Stage sampling分段随机抽样Standard Deviation标准差Sum of squares统计表supplier平方和System供方systematic sampling系统,体系Statistical tables系统抽样Taguchi-method田口方法Technical committees技术委员会Test piece测试片Theory原理Time stamp时间戳印Time-lag延迟Title 题Torque转矩Total求和TQC: Total Quality Control全面品质控制TQM: Total Quality Management全面品质管理Traceablity追溯Training培训Transaction processing and logging交易处理Trouble困扰Up and down上和下UCL: Upper Control Limit管制上限USL: Upper Size Limit规格上限V alidation确认Variable计量值Variance变异和Vector向量Verification验证Version版本VOC: voice of Customer客户需求VOE: V oice of Engineer工程需[转帖]电子行业相关的英语词汇-1 backplane 背板2 Band gap voltage reference 带隙电压参考3 benchtop supply 工作台电源4 Block Diagram 方块图5 Bode Plot 波特图6 Bootstrap 自举7 Bottom FET Bottom FET 8 bucket capcitor 桶形电容9 chassis 机架10 Combi-sense Combi-sense11 constant current source 恒流源12 Core Sataration 铁芯饱和13 crossover frequency 交叉频率14 current ripple 纹波电流15 Cycle by Cycle 逐周期16 cycle skipping 周期跳步17 Dead Time 死区时间18 DIE Temperature 核心温度19 Disable 非使能，无效，禁用，关断20 dominant pole 主极点21 Enable 使能，有效，启用22 ESD Rating ESD额定值23 Evaluation Board 评估板24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. 超过下面的规格使用可能引起永久的设备损害或设备故障。
质量体系英文缩写
1.PDCA：Plan、Do、Check、Action 策划、实施、检查、处置2.PPAP：Production PartApproval Process生产件批准程序3.APQP：Advanced ProductQuality Planning产品质量先期策划4.FMEA：Potential FailureMode and Effects Analysis 潜在失效模式及后果分析5.SPC：Statistical ProcessControl统计过程控制6.MSA：Measurement SystemAnalysis 测量系统控制7.CP：Control Plan 控制计划8.QSA：Quality SystemAssessment 质量体系评定9.PPM：Parts Per Million 每百万零件不合格数10.QM：Quality Manua质量手册11.QP：Quality Procedure质量程序文件/Quality Planning质量策划/Quality Plan 质量计划12.CMK：机器能力指数13.CPK：过程能力指数14.CAD：Computer-AidedDesign 计算机辅助能力设计15.OEE：Overall Equipment Effectiveness 设备总效率16.QFD：Quality FunctionDeployment质量功能展开17.FIFO：First in, First out先进先出18.COPS：Customer OrientedProcesses顾客导向过程19.TCQ：Time、Cost、Quality时间、成本、质量20.MPS：Management Processes管理性过程21.SPS：Support Processes支持性过程22.TQM：Total QualityManagement全面质量管理23.PQA：Product QualityAssurance产品质量保证（免检）24.QP-QC-QI：质量三步曲，质量计划－质量控制－质量改进25.QAF：Quality AssuranceFile质量保证文件26.QAP：Quality AssurancePlan质量保证计划27.PFC：Process Flow Chart过程流程图28.QMS：Quality ManagementSystems质量管理体系29.JIT：Just In Time准时（交货）30.ERP：EnterpriseRequirement Planning企业需求计划31.QC：Quality Control 质量控制32.QA：Quality Audit 质量审核/QalityAssurance 质量保证33.IQC：In Come QualityControl 进货质量控制34.IPQC：In Process QualityControl 过程质量控制35.FQC：Final QualityControl 成品质量控制36.OQC：Out Quality Control 出货质量控制37.4M1E：Man、Machine、Material、Method、Environment人、机、料、法、环38.5W1H：Why、What、Who、When、Where、How 为何/做什么/谁做/时间/地点/如何做39.6S：Seiri、Seiton、Seiso、Seiketsu、Shitsuke、Safety 整理、整顿、清扫、清洁、素养、安全40.TRI值：Total Record Injury（三种）可记录工伤值41.SMART：精明原则，SpecificMeasurable Achievable Result Oriented Timed（具体的描述、可以测量的、可以通过努力实现的、有结果导向性的、有时间性的）——————企业常用英文缩写——————1.5S：5S管理2.ABC：作业制成本制度（Activity-BasedCosting）3.ABB：实施作业制预算制度（Activity-BasedBudgeting）4.ABM：作业制成本管理（Activity-BaseManagement）5.APS：先进规画与排程系统（AdvancedPlanning and Scheduling）6.ASP：应用程序服务供货商（ApplicationService Provider）7.ATP：可承诺量（Available ToPromise）8.AVL：认可的供货商清单（ApprovedVendor List）9.BOM：物料清单（Bill OfMaterial）10.BPR：企业流程再造（BusinessProcess Reengineering）11.BSC：平衡记分卡（BalancedScoreCard）12.BTF：计划生产（Build ToForecast）13.BTO：订单生产（Build To Order）14.CPM：要径法（Critical PathMethod）15.CPM：每一百万个使用者会有几次抱怨（Complaintper Million）16.CRM：客户关系管理（CustomerRelationship Management）17.CRP：产能需求规划（CapacityRequirements Planning）18.CTO：客制化生产（ConfigurationTo Order）19.DBR：限制驱导式排程法（Drum-Buffer-Rope）20.DMT：成熟度验证（DesignMaturing Testing）21.DVT：设计验证（DesignVerification Testing）22.DRP：运销资源计划（DistributionResource Planning）23.DSS：决策支持系统（DecisionSupport System）24.EC：设计变更/工程变更（EngineerChange）25.EC：电子商务（ElectronicCommerce）26.ECRN：原件规格更改通知（EngineerChange Request Notice）27.EDI：电子数据交换（ElectronicData Interchange）28.EIS：主管决策系统（ExecutiveInformation System）29.EMC：电磁相容（ElectricMagnetic Capability）30.EOQ：基本经济订购量（EconomicOrder Quantity）31.ERP：企业资源规划（EnterpriseResource Planning）32.FAE：应用工程师（FieldApplication Engineer）33.FCST：预估（Forecast）34.FMS：弹性制造系统（FlexibleManufacture System）35.FQC：成品质量管理（Finish orFinal Quality Control）36.IPQC: 制程质量管理（In-ProcessQuality Control）37.IQC：进料质量管理（IncomingQuality Control）38.ISO：国际标准组织（InternationalOrganization for Standardization）39.ISAR：首批样品认可（InitialSample Approval Request）40.JIT：实时管理（Just In Time）41.KM：知识管理（KnowledgeManagement）42.L4L：逐批订购法（Lot-for-Lot）43.LTC：最小总成本法（Least TotalCost）44.LUC：最小单位成本（Least UnitCost）45.MES：制造执行系统（ManufacturingExecution System）46.MO：制令（Manufacture Order）47.MPS：主生产排程（MasterProduction Schedule）48.MRO：请修（购）单（MaintenanceRepair Operation）49.MRP：物料需求规划（MaterialRequirement Planning）50.MRPII：制造资源计划（ManufacturingResource Planning）51.NFCF：更改预估量的通知Notice forChanging Forecast52.OEM：委托代工（OriginalEquipment Manufacture）53.ODM：委托设计与制造（OriginalDesign & Manufacture）54.OLAP：在线分析处理（On-LineAnalytical Processing）55.OLTP：在线交易处理（On-LineTransaction Processing）56.OPT：最佳生产技术（OptimizedProduction Technology）57.OQC：出货质量管理（Out-goingQuality Control）58.PDCA：PDCA管理循环（Plan-Do-Check-Action）59.PDM：产品数据管理系统（ProductData Management）60.PERT：计划评核术（ProgramEvaluation and Review Technique）61.PO：订单（Purchase Order）62.POH：预估在手量（Product onHand）63.PR：采购申请（PurchaseRequest）64.QA：品质保证（QualityAssurance）65.QC：质量管理（Quality Control）66.QCC：品管圈（Quality ControlCircle）67.QE：品质工程（QualityEngineering）68.RCCP：粗略产能规划（Rough CutCapacity Planning）69.RMA：退货验收（ReturnedMaterial Approval）70.ROP：再订购点（Re-Order Point）71.SCM：供应链管理（Supply ChainManagement）72.SFC：现场控制（Shop FloorControl）73.SIS：策略信息系统（StrategicInformation System）74.SO：订单（Sales Order）75.SOR：特殊订单需求（Special OrderRequest）76.SPC：统计制程管制（StatisticProcess Control）77.TOC：限制理论（Theory ofConstraints）78.TPM：全面生产管理（TotalProduction Management）79.TQC：全面质量管理（Total QualityControl）80.TQM：全面品质管理（Total QualityManagement）81.WIP：在制品（Work In Process）——————部门名称的专有名词——————QS:Quality system品质系统CS:Coutomer Sevice 客户服务QC:Quality control品质管理IQC:Incoming quality control 进料检验LQC:Line Quality Control 生产线品质控制IPQC:In process quality control 制程检验FQC:Final quality control 最终检验OQC:Outgoing quality control 出货检验QA:Quality assurance 品质保证SQA:Source(supplier) Quality Assurance 供应商品质保证(VQA) CQA：Customer Quality Assurance客户质量保证PQA rocess Quality Assurance 制程品质保证QE:Quality engineer 品质工程CE:component engineering零件工程EE:equipment engineering设备工程ME:manufacturing engineering制造工程TE:testing engineering测试工程PPE roduct Engineer 产品工程IE:Industrial engineer 工业工程ADM: Administration Department行政部RMA:客户退回维修CSDI:检修PC:producing control生管MC:mater control物管GAD: General Affairs Dept总务部A/D: Accountant /Finance Dept会计LAB: Laboratory实验室DOE:实验设计HR:人资PMC:企划RD:研发W/H:仓库SI:客验PD: Product Department生产部PA:采购(PUR: Purchaing Dept)SMT:Surface mount technology 表面粘着技术MFG:Manufacturing 制造MIS:Management information system 资迅管理系统DCC:document control center 文件管制中心——————场内作业中的专有名词——————QT:Quality target品质目标QP:Quality policy目标方针QI:Quality improvement品质改善CRITICAL DEFECT:严重缺点（CR）MAJOR DEFECT:主要缺点（MA）MINOR DEFECT:次要缺点（MI）MAX:Maximum最大值MIN:Minimum最小值DIA iameter直径DIM imension尺寸LCL:Lower control limit管制下限UCL:Upper control limit管制上限EMI:电磁干扰ESD:静电防护EPA:静电保护区域ECN:工程变更ECO:Engineering change order工程改动要求（客户）ECR:工程变更需求单CPI:Continuous Process Improvement 连续工序改善Compatibility：兼容性Marking：标记DWG rawing图面Standardization：标准化Consensus：一致Code：代码ZD:Zero defect零缺点Tolerance：公差Subject matter：主要事项Auditor：审核员BOM:Bill of material物料清单Rework：重工ID：identification识别,鉴别,证明PILOT RUN: (试投产)FAI:首件检查FPIR：First Piece Inspection Report首件检查报告FAA:首件确认SPC：统计制程管制CP: capability index（准确度）CPK: capability index of process(制程能力)PMP:制程管理计划（生产管制计划）MPI:制程分析DAS efects Analysis System 缺陷分析系统PPB：十亿分之一Flux：助焊剂P/N:料号L/N：Lot Number批号Version：版本Quantity：数量Valid date：有效日期MIL-STD：Military-Standard军用标准ICT: In Circuit Test (线路测试)ATE：Automatic Test Equipment自动测试设备MO: Manafacture Order生产单T/U: Touch Up (锡面修补)I/N:手插件P/T:初测F/T: Function Test (功能测试-终测)AS 组立P/K:包装TQM:Total quality control全面品质管理MDA:manufacturing defect analysis制程不良分析(ICT) RUN-IN:老化实验HI-pot：高压测试FMI：Frequency Modulation Inspect高频测试DPPM: Defect Part Per Million(不良率的一种表达方式：百万分之一) 1000PPM即为0.1% Corrective Action: (CAR改善对策)ACC：允收REJ:拒收S/S：Sample size抽样检验样本大小SI-SIV：Special I-Special IV特殊抽样水平等级CON：Concession / Waive特采ISO:国际标准化组织ISA：Industry Standard Architecture工业标准体制结构OBA:开箱稽核FIFO:先进先出PDCA:管理循环Plan do check action计划，执行，检查，总结WIP:在制品（半成品）S/O: Sales Order (业务订单)P/O: Purchase Order (采购订单)P/R: Purchase Request (请购单)AQL:acceptable quality level允收品质水准LQL;Limiting quality level最低品质水准QVL:qualified vendor list合格供应商名册AVL ：认可的供货商清单(Approved Vendor List) QCD: Quality cost delivery（品质，交期，成本）MPM:Manufacturing project management制造专案管理KPI:Key performance indicate重要绩效指标MVT:Manufacturing Verification Test制造验证试产Q/R/S：Quality/Reliability/Service质量/可靠度/服务STL:ship to line（料到上线）NTF:No trouble found误判CIP:capacity improvement plan（产能改善计划）MRB:material review board（物料审核小组）MRB:Material reject bill退货单JIT:just in time（即时管理）5S:seiri seiton seiso seiketsu shitsuke（整理，整顿，清扫，清洁，修养）SOP:standard operation process（标准作业程序）SIP:Specification inspection process制程检验规格TOP: Test Operation Process (测试作业流程)WI: working instruction（作业指导书）SMD:surface mounting device（表面粘着原件）FAR:failure aualysis report故障分析报告CAR:Corrective action report改善报告BPR：企业流程再造 (Business Process Reengineering)ISAR ：首批样品认可(Initial Sample Approval Request)-JIT：实时管理 (Just In Time)QCC ：品管圈 (Quality Control Circle)Engineering Department (工程部)TQEM: Total Quality Environment Management(全面品质环境管理)PD: Production Department (制造)LOG: Logistics (后勤支持)Shipping: (进出口)AOQ：Average Output Quality平均出货质量AOQL：Average Output Quality Level平均出货质量水平FMEA：failure model effectiveness analysis失效模式分析CRB: Change Review Board (工程变更会议)CSA：Customer Simulate Analysis客户模拟分析SQMS：Supplier Quality Management System供应商品质管理系统QIT: Quality Improvement Team 品质改善小组QIP：Quality Improvement Plan品质改善计划CIP：Continual Improvement Plan持续改善计划M.Q.F.S: Material Quality Feedback Sheet (来料品质回馈单) SCAR: Supplier Corrective Action Report (供货商改善对策报告) 8D Sheet: 8 Disciplines sheet ( 8D单)PDCA：PDCA (Plan-Do-Check-Action) (管理循环)MPQ: Material Packing Quantity (物料最小包装量)DSCN: Delivery Schedule Change Notice (交期变更通知) QAPS: Quality Assurance Process Sheet (品质工程表)DRP ：运销资源计划 (Distribution Resource Planning)DSS：决策支持系统 (Decision Support System)EC ：电子商务 (Electronic Commerce)EDI ：电子资料交换 (Electronic Data Interchange)EIS ：主管决策系统 (Excutive Information System)ＥＲＰ：企业资源规划 (Enterprise Resource Planning)FMS ：弹性制造系统 (Flexible Manufacture System)KM ：知识管理 (Knowledge Management)4L ：逐批订购法 (Lot-for-Lot)LTC ：最小总成本法 (Least Total Cost)LUC ：最小单位成本 (Least Unit Cost)MES ：制造执行系统 (Manufacturing Execution System)MPS ：主生产排程 (Master Production Schedule)MRP ：物料需求规划 (Material Requirement Planning)MRPⅡ：制造资源计划 (Manufacturing Resource Planning)OEM ：委托代工 (Original Equipment Manufacture)ODM ：委托设计与制造 (Original Design & Manufacture) OLAP：线上分析处理 (On-Line Analytical Processing)OLTP：线上交易处理 (On-Line Transaction Processing)OPT ：最佳生产技术 (Optimized Production Technology)PDCA：PDCA管理循环 (Plan-Do-Check-Action)PDM：产品数据管理系统 (Product Data Management))RCCP：粗略产能规划 (Rough Cut Capacity Planning)SCM ：供应链管理 (Supply Chain Management)SFC ：现场控制 (Shop Floor Control)TOC：限制理论 (Theory of Constraints)TQC ：全面品质管制 (Total Quality Control)FYI/R:for your information/reference仅供参考ASAP:尽快S/T:Standard time标准时间TPM:total production maintenance：全面生产保养ESD Wrist strap：静电环IT:information technology信息技术，资讯科学CEO：Chief Executive Officer执行总裁COO：Chief Operaring Officer首席业务总裁SWOT：Strength,Weakness,Opportunity,Threat优势﹐弱点﹐机会﹐威胁Competence：专业能力Communication：有效沟通Cooperation：统御融合Vibration Testing：振动测试IDP：Individual Development Plan个人发展计划MRP：Material Requirement Planning物料需求计划MAT'S：Material材料LRR：Lot Rejeet Rate批退率ATIN：Attention知会3C：Computer ,Communication , Consumer electronic消费性电子5W1H：When , Where , Who , What , Why , Ho5M: Man , Machine , Material , Method , Measurement人,机器,材料,方法,测量4MIE: Man,Material,Machine,Method,Environment人力,物力,财务,技术,时间(资源)7M1I: Manpower , Machine , Material , Method, Market , Management , Money , Information人力，机器，材料，方法, 市场，管理，资金，资讯Accuracy 准确度Action 行动Activity 活动Analysis Covariance 协方差分析Analysis of Variance 方差分析Approved 承认Attribute 计数值Average 平均数Balance sheet 资产负债对照表Binomial 二项分配Brainstorming Techniques 脑力风暴法Cause and Effect Matrix 因果图(鱼骨图)CL:Center Line 中心线Check Sheets 检查表Complaint 投诉Conformity 合格（符合）Control 控制Control chart 控制(管制)图Correction 纠正Correlation Methods 相关分析法CPI: continuouse Process Improvement 连续工序改善Cross Tabulation Tables 交叉表CS: Customer Sevice 客（户）服（务）中心DSA: Defects Analysis System 缺陷分析系统Data 数据 Description:品名DCC: Document Control Center 文控中心Decision 决策、判定Defects per unit 单位缺点数Description 描述Device 装置Do 执行DOE: Design of Experiments 实验设计Element 元素Engineering recbnology 工程技Environmental 环境Equipment 设备Estimated accumulative frequency 计算估计累计数E Equipment Variation 设备变异External Failure 外部失效,外部缺陷FA: Failure Analysis 失效分析Fact control 事实管理Fatigue 疲劳FMEA: Failure Mode and Effect Analysis失效模式与效果分析 FP First-Pass Yield （第一次通过）合格率FQA: Final Quality Assurance 最终品质保证FQC: Final Quality control 最终品质控制Gauge system 测量系统Grade 等级Histogram 直方图Improvement 改善Initial review 先期审查Inspection 检验Internal Failure 内部失效、内部缺陷IPQC: In Process Quality Control 制程品质控制IQC: Incomming Quality Control 来料品质控制IS International Organization for Standardization 国际标准化组织 LCL: Lower Control limit 管制下限LQC: Line Quality Control 生产线品质控制LSL: Lower Size Limit 规格下限Machine 机械Manage 管理Materials 物料Measurement 测量Median 中位数MSA: Measurement System Analysis 测量系统分析Occurrence 发生率Operation Instruction 作业指导书Organization 组织Parto 柏拉图PPM arts per Million （百万分之）不良率Plan 计划Policy 方针Population 群体PQA: Process Quality Assurance 制程品质保证Practice 实务(践)Prevention 预防Probability 机率Probability density function 机率密度函数Procedure 流程Process 过程Process capability analysis 制程能力分析（图）Process control and Process capability制程管制与制程能力Product 产品Production 生产Projects 项目QA: Quality Assurance 品质保证QC: Quality Control 品质控制QE: Quality Engineering 品质工程QFD: Quality Function Desgin 品质机能展开(法)Quality 质量Quality manual 品质手册Quality policy 品质政策(质量方针)Random experiment 随机试验Random numbers 随机数R:Range 全距（极差）Reject 拒收Repair 返修Repeatusility 再现性Reproducibility 再生性Requirement 要求Responsibilities 职责Review 评审Reword 返工Rolled yield 直通率RPN: Risk Priority Number 风险系数Sample 抽样,样本Sample space 样本空间Sampling with replacement 放回抽样Sampling without replacement 不放回抽样Scatter diagram 散布图分析Scrap 报废Simple random sampling 简单随机取样Size 规格SL: Size Line 规格中心线Stratified random sampling 分层随机抽样SOP: Standard Operation Procedure 标准作业书SPC: Statistical Process Control 统计制程管制Specification 规范SQA: Source(Supplier) Quality Assurance 供货商品质保证Stage sampling 分段随机抽样Standard Deviation 标准差Sum of squares 平方和Taguchi-method 田口(试验)方法Theory 原理TQC: Total Quality Control 全面品质控制TQM: Total Quality Management 全面品质管理Traceablity 追溯Training 培训UCL: Upper Control Limit 管制（控制）上限USL: Upper Size Limit 规格上限Validation 确认Variable 计量值Verification 验证Version 版本VOC: Voice of Customer 客户需求VOE: Voice of Engineer 工程需求Inventory stock report:庫存清单报告Sales order report:出货报告。
质量体系英文缩写
1。
PDCA：Plan、Do、Check、Action 策划、实施、检查、处置2.PPAP：Production PartApproval Process生产件批准程序3。
APQP:Advanced ProductQuality Planning产品质量先期策划4。
FMEA：Potential FailureMode and Effects Analysis 潜在失效模式及后果分析5。
SPC:Statistical ProcessControl统计过程控制6.MSA：Measurement SystemAnalysis 测量系统控制7.CP：Control Plan 控制计划8.QSA：Quality SystemAssessment 质量体系评定9。
PPM：Parts Per Million 每百万零件不合格数10.QM：Quality Manua质量手册11。
QP：Quality Procedure质量程序文件/Quality Planning质量策划/Quality Plan 质量计划12.CMK：机器能力指数13。
CPK：过程能力指数14.CAD:Computer—AidedDesign 计算机辅助能力设计15。
OEE：Overall Equipment Effectiveness 设备总效率16.QFD:Quality FunctionDeployment质量功能展开17。
FIFO：First in，First out先进先出18.COPS：Customer OrientedProcesses顾客导向过程19。
TCQ：Time、Cost、Quality时间、成本、质量20。
MPS：Management Processes管理性过程21.SPS:Support Processes支持性过程22.TQM：Total QualityManagement全面质量管理23。
PQA：Product QualityAssurance产品质量保证（免检）24。
封装专业术语集锦
一常用文件、表单、报表中英文名称中文名称 英文名称notice清除通知单 PurgeRequest)Change工程变更申请 ECR(Engineeringplan)improvement持续改善计划 CIP(continuousProject戴尔专案 Dell收据 Receiptsheet数据表 Data核对表 Checklistchecklist文件清单 Documentation设备清单 Equipmentchecklist调查表，问卷 Questionnaireform报名表 Entry追踪记录表 Trackinglogreport日报表 Dailyreport周报表 Weeklyreport月报表 Monthlyreport年报表 Yearlyreport年度报表 Annualreport财务报表 Financialreport品质报表 Qualityreport生产报表 Production不良分析报表FAR(Failure analysis report)首件检查报告First article inspection report初步报告（或预备报告） Preliminaryreport一份更新报告An undated report一份总结报告 A final report纠正与改善措施报告(异常报告单) CAR (Corrective Action Report)出货检验报告Outgoing Inspection ReportofCompliance)符合性报告（材质一致性证明） COC(Certificatereport稽核报告 Audit品质稽核报告Quality audit reportreportaudit制程稽核报告 Process5S稽核报告5S audit report客户稽核报告Customer audit reportreportaudit供应商稽核报告 Supplier年度稽核报告Annual audit reportreportaudit内部稽核报告 Internal外部稽核报告External audit reportcontrolprocessSPC报表(统计制程管制) Statistical工序能力指数(Cpk) Process capability indexlimit（规格)上限 Upperlimit（规格）下限 Lower规格上限Upper Specification Limit(USL)规格下限Lower Specification Limit(LSL)上控制限（或管制上限）Upper Control Limit(UCL)下控制限（或管制下限）Lower Control Limit(LCL)最大值 Maximumvaluevalue平均值 Averagevalue 最小值 Minimum临界值Threshold value / critical valueMRB单(生产异常通知报告) Material Review Board ReportDiagramFlow工艺流程图 Process物料清单（产品结构表/用料结构表）BOM (Bill of Materials )合格供应商名录A VL (Approved Vendor List)异常报告单 CAR工程规范报告通知单（工程变更通知）ECNTECN临时工程规范报告通知单(临时工程变更通知）自主点检表Self Check List随件单（流程卡）Traveling Card (Run Card)压焊图Bonding diagram晶圆管制卡Wafer inspection card晶圆进料品质异常反馈单Feedback Report for Wafer Incoming QualityProblems订购单PO(Purchase Order)出货通知单Advanced Ship Notice送货单/交货单DO(Delivery Order)询价单RFQ(Request for quotation)可靠性实验报告Reliability Monitor Report产品报废单PSB特采控制表CRB退货单返工单PRB委工单委托封装加工确认单异常处理行动措施 OCAP工序关键词中英文对照序号 关键词 英文 备注1 进料检验IQC/IQA (Incoming QC Inspection)2 高倍显微镜 Highpowermicroscope减薄Grinding1 减薄Wafer grind Back grind2 裂纹 Wafercrack3 墨点Ink die / Ink dot4 胶膜(晶圆蓝胶带) Mounting tape / Blue tape5 晶圆 Wafer8 晶圆尺寸 Wafersize9 晶圆厚度Wafer thickness16 开始高度 StartPosition17 粗磨结束高度 Roughspeed细磨高度 Rough/fine18 细磨结束高度 FineSpeed19 清磨时间 SparkOut20 晶圆上胶带 Wafertapping21 晶圆上胶带机Wafer tapping M/C22 晶圆下胶带 Detapping23 晶圆下胶带机 WaferdetappingM/C24 晶圆减薄机 GrindingM/C25 磨头 Grindstone26 晶圆贴片 Wafermount27 晶圆贴片机 Wafermounter28 晶圆传递盒 Wafermagazine29 晶圆装载盒 Wafercassette 30 晶圆管制卡 Waferinspectioncard划片 Sawing1 划片 Wafersaw2 划片机Wafer saw M/C3 贴膜机/绷膜机 TapingM/C4 绷膜环Film Frame (铁环)cleaner5 清洗机 Waferclean6 晶圆清洗 Wafer7 干燥箱 Ovenhandler8 传递框(提篮) Cassettestreet9 划道 Scribe10 划道宽度 Scribewidthstreetblade11 划片刀 Saw12 进刀速Cut speedspeed13 主轴转速 Spindle14 晶粒尺寸 Diesizewater15 冷却水 Coolingwater16 切割水 DI18 刀痕宽度Kerf width & chippingdie20 背崩、缺角 Chipdie21 裂纹、裂片 Crackdie22 掉芯、掉片 MissingWidthStreet29 划道宽度 Saw32 晶粒、芯片 Diesize33 芯片尺寸 Die34 晶圆铁环Wafer film framebubbles35 薄膜气泡 Tape36 划片后目检 PSI 第二次目检上芯 Die Attach / Die Bondbond 装片Die Attach1 上芯 Diebonder2 上芯机 Die3 粘片胶Die attach material epoxy4 导电胶 Epoxy Conducting resin;Conductive adhesive 5 绝缘胶 Non-conductiveepoxy6 点胶头 Dispensernozzle7 吸嘴Rubber tip / Die pick-up toolpin ?8 顶针 Ejector9 墨点片Ink dotted dietape10 兰膜 BlueMagazine11 框架盒 L/Fframe12 引线框架 Lead13 固化 Curing14 干燥箱 Ovenscrap15 晶粒刮伤 Die16 压伤 Dented 凹损Lift-off17 晶粒脱落 Die18 粘偏(上芯歪斜) Skewdiemisorientation19 粘反(上芯反向) Die20 防氧化 OSP Anti-oxidationsqueezedel22 写胶前气压延时 Predelsqueeze写胶后气压延时 Postdelayup23 顶针延迟 Ejectheightup24 顶针高度 Ejectlevel25 粘片高度 Bond26 拣拾芯片高度 Picklevel27 粘接头拾取延迟Head pick delay28 粘接头粘接延时Head bond delay29 捡拾芯片延时 Pickdelaydelay30 粘接芯片延时 Bond31 布进夹转换延时Index clamp delay32 框架步进延时 Indexdelay33 推晶试验Die shear test34 导电胶厚度和覆盖率Epoxy thickness & coverageorientation35 芯片方向 Dievoid36 导电胶空洞 Epoxydamage37 芯片损伤 Chip38 芯片背面损伤Chip backside damagedie39 芯片装斜 Tilted40 芯片粘胶Epoxy on die41 芯片裂缝/晶粒裂痕 Crackdiedie42 翘芯片 Lifteddie43 误置芯片 Misplaced44 空粘No die on L/Fepoxy45 导电胶不足 Insufficientcrack46 多胶 Epoxydiameter47 线径 Wirecuring48 银浆烘烤 Epoxy49 边沿芯片Edge die / Partial diedie50 镜子芯片 Mirrordie51 掉片 Missing52 墨溅Ink splash / splatter53 上芯图 Diediagrambonding54 推片试验Die shear testTester55 推片试验机 Dieshear56 推片头Die shear toolcorrosion57 晶粒腐蚀 Metal58 芯片分级系统 Wafersystemmapping压焊 Wiring Bondingbond)焊丝、打线、球焊(Wire1 压焊 W/Bwire2 金丝 Gold3 焊点、铝垫Bond pad Soldered points4 第一焊点1st Bondsize5 焊点尺寸 Pad6 劈刀（钢嘴） Capillarypitch7 间距 Pad8 延展性 elongationload9 破断力 Breaking10 (焊丝)拉力Wire pull/ ball pull11 (焊丝)推力Wire shear/ ball shear12 超声功率Ultrasonic power13 压力Bonding forcetime14 时间 Bondingtemperature15 温度 Bonding16 超声波压焊Ultrasonic wire bonding17 打火烧球 EFOheight18 弧高 Loop120 第一脚 PIN21 球拉力试验Ball pull test22 球推力试验Ball shear testheight23 球高 Balldiameter24 球径 Ball25 弹坑（KOH腐蚀试验）Cratering (KOH etching test)26 剪切力 Shear(ThermalCompression 27 热压焊 TCBBond)28 助焊剂 Fluxdiagram布线图29 压焊图 Bondingbonding30 布线错误 Wrongsize31 焊点尺寸、铝垫尺寸 Pad32 焊点间距、铝垫间距 Padpitch33 焊不牢 Incompletebondbonding34 无焊 No35 氮气柜N2 box36 实时过程控制 RTPCTray37 产品盘 Handling38 压焊后目检 FBI39 压焊检验机FBI Insp. M/C40 低倍显微镜Low Power Microscope41 前站推车 ASS’YCart42 拉力试验(Wire) pull test43 拉力试验机Wire pull tester44 线钩Wire pull hook45 推球试验Ball shear test46 推球试验机Ball shear tester47 推球头Ball shear tool48 压焊腐蚀试验Bond cratering testdiscolor49 铝条变色 Metaldiscolor50 铝垫变色 BD.Padoxidepad51 铝垫氧化 Bond52 铝垫不粘Nonstick bond on padpeeling53 铝垫脱落 Bondpadpadcratering54 铝垫弹坑 Bond55 超过返工数Over rework limit56 剔球刮伤BD remove & scratch57 金球脱落Ball bond non-stick58 金球过大（小）Ball to large (small)59 金球短路Ball bond short60 引脚脱落Non-stick on lead61 压焊打偏Misplaced bond on LDbroken62 断线 Wirewire63 漏打 Missingconnection64 错打 Wronglooping65 弧度不良 Defectivesagging66 弧度下陷 Looploop67 弧度太低 Lowloop68 弧度太高 Highshort69 弧度短路 Loop70 跨越引线框架Wire overhang on LDresidue71 残线 Wiredistortion72 L/F框架变形 L/Fmismatch73 数量不符 Quantity74 空粘未报废Empty M. not scrap75 金丝受损Gold wire scratch塑封 molding1 塑封 Molding2 塑封料 Moldingcompound5 塑封机Molding M/C ; mold press6 预热机 Pre-heater7 塑封模具 Molddie/chase8 单缸模具Mold9 MGP多缸模具 MGPmold10 自动包封机 Auto11 自动排片机Auto L/F loader12 冲浇口机?13 抓手（机械手） Handler14 点温计 Digimite15 料饼预热温度 Pre-heatTemperature 16 热电偶temperature17 模温 Mold18 预热台 Pre-heaterpressure19 合模压强 Clamppressure20 注塑压强 Transfertime21 固化时间 Curingtemperature22 固化温度 CuringTime23 （料饼）预热时间 Pre-heatspeed24 注塑速度 Transfertime25 注塑时间 Transfer26 后固化时间PMC time (Post Mold Cure Time)28 上料/下料 Load/unloadsweep29 冲丝 Wire30 开路 Open31 短路 Shortunderfilled32 胶体未灌满 Bodymold33 未封满 Incomplete34 崩角Chip package / body chip-out35 胶体麻点 PorosityBody/Blister36 表面气泡 Bubble37 粘污 Smearsurface38 不均匀（表面） Rough39 分层 DelaminatingV oid40 胶体空洞 PKGdeepscratch41 胶体刮痕 Body42 塑封体尺寸Mold PKG Dimension43 X-ray(冲丝和塌丝) X-ray(Wire Sweep & Sagging)44 背面宽/长BTM width / length45 正面宽/长Top width / lengththick46 塑封体厚度 PKG47 包封偏差(胶体错位) Mold Mismatch / PKG mismatch48 偏心(Mold) Offset / PKG misalignment49 后固化PMC(post mold cure)50 模次 Shotstripmolded51 空封 Dummyflash52 废胶 Mold53 注浇口、进浇口Gate (Mold gate) Injection gate54 小脚 GateremainAging 回温过程55 料饼醒料 Compoundblock56 定位块 Locatorpin57 顶针 EjectorDepth58 顶针深度 E-pin59 冷藏库\料饼存放库Cold room/Compound storagegun60 气枪 Air61 芯片涂胶 Diecoating62 芯片涂胶机Auto die coating M/C63 覆晶胶Die coating material64 后站推车ASS’Y B CartTabletLoader65 自动排胶粒机 AutoPreheater66 高频预热机 Compound67 上料架Load / Unload FixtureMagazine68 胶粒盒 Tablet69 塑封料饼 CompoundTablets70 洗模饼Mold Cleaning CompoundMisorientation71 胶体压反 PKG72 塑封溢胶Mold flash on leadcrack73 胶体裂痕 Mold切筋Trim-FormDambarcut 1 切筋 Trimmingdie2 切筋模 Trimdie3 成形模 Form4 分离模singulate5 冲废 De-junk外观检6 检测 InspectionDie7 再成型机模具 Reformsystem8 再成型机 Reformtray9 料盘 Plasticdambar10 连筋 Uncut11 毛刺 burr14 溢料 Junk15 裂纹 Crack16 离层（分层） Delaminating17 管脚反翘 Leadbendtipuncut18 筋未切 Dam-bar19 筋凸出 Dam-barprotrusion20 筋切入Dam-bar cut in打印Marking1 打印 Marking2 印章Marking layout3 激光打印 Lasermarkingmarking(UV)4 油墨打印 Ink5 正印Top side mark6 背印Back side mark7 镜头 Lens8 打印不良\模糊 Illegiblemarkingmarking9 漏打 No10 断字 Brokencharactercharacter11 缺字 Missingmarking12 印字倾斜 Slantmarking13 印记错误 Wrong14 重印 Remark15 印字模糊（褪色） Fademark16 印字粘污 Smear19 电流 current 21 字体（字形） Fontpin22 定位针 Locationprinter23 胶皮打印机 Pad24 激光打印机Laser Marking M/C25 后固化PMC(Post Mold Cure)26 后固化烤箱 PMCOvenstain27 打印污斑 Markingshift28 印记移位 Marking电镀Plating1 电镀 Plating2 来料 Incoming3 冲废 Dejunk4 热煮软化槽 SockingTank7 检验 Inspection外观检8 烘烤 CuringBaking150℃; 60-90ms/9 出料 Unload10 高速线电镀High-speed Plating Line11 统计过程控制 SPC12 搭锡 Solderbridge13 锡丝、锡须Solder flick / Whiskerdefects14 镀层不良 Plating15 发黄 Yellowish16 发黑 Blacken17 变色 Discolor18 露底材（露铜） Exposecopper19 粘污 Smear7-20um 20 镀层厚度 Platingthickness电镀成分, Sn21 镀层成分 Platingcomposition22 外观 Outgoingability23 易焊性 Solder24 无铅化Pb-free / lead freeforce25 结合力 Adhesive26 可靠性 Reliabilitydeflash27 电解 Electrolyticwater28 清洗（自来水） City29 高压清洗High pressure rinse30 脱脂 Descalewater31 清洗（纯水） DI32 活化（合金） Activation33 预镀、预浸 Pre-dip34 电镀 Plating35 吹风 Airblow36 中和 Neutralization37 褪镀 Stripper38 拖出 Dragout39 上料机 Loader40 下料机 Unloader41 纯锡 Tinwater42 纯水(去离子水) DIpressure43 水压 Water44 理化分析Physical and chemical analysisThicknessMeter45 测厚仪 Plating/ Electroplated CoatingThickness Test46 离子污染度测试仪Ion Contamination Tester Contamino CT100Tester47 C含量测试仪 Carbon51 去氧化 HSCUDescale52 预浸 Pre-dip53 电镀电流 Current54 镀液温度 Temperature 电镀液platingsolution电镀槽 plating tank56 中和 Neutralization59 烘干 Curingball60 锡球 Solder61 锡厚度和成分Sn thickness & composition62 冲废 De-junk 去胶渣63 去溢料 Degate 冲塑，冲胶64 去飞边 Deflash 去胶(塑封工序)65 锡铅电镀Tin lead plating66 无铅电镀Lead free plating; Pure tinplatingbump67 镀层起泡 Solder68 镀层剥落Solder peel off69 镀层偏厚或偏薄Thick or Thin Platingremove70 退锡 Solder71 电镀报废 Platingscrappeeling72 锡渣 Solderbump73 电镀锡块 Solderbridge74 电镀桥接 PlatingDiscoloration75 电镀变色 SPContamination76 电镀污染 SP77 电镀锡攀爬 SPadhere78 电解除油 Electro-degreasing测试Testing1 测试 Testingmark2 打印 Laser3 编带机Tape & Reel Machine4 编带 Reel5 测试机 TesterHandlerTest6 分选机 Tray11 振动盘Bowl ？vision12 Vision检测 Direction15 划伤 Scratchmark16 打错 Wrongcharacter17 断字 Broken18 漏字 Nomarkingmark19 模糊 Fadelength20 脚长 Leadwidth21 脚宽 Leadup22 站立度 Standpitch23 脚间距 Lead24 共面性 Coplanarityspace25 跨度 Row27 电性能测试 Electricaltesttube28 塑料管 Plastic/Tape29 编带 Reel30 托盘，盘装 TrayScan/Inspection31 扫描测脚 Leadsscanner 32 扫描测脚机 LeadsProjector33 投影仪 Profile切筋Trimming1 切筋 Trimmingdie2 切筋模 Trimdie3 成形入管模 Form4 定位 Location6 封塞（软塞） Plug8 支持棒 Suspensionbarbar/Fishtail/Tiepress10 切筋打弯机 TrimLoader11 上料匣 Framepress12 压模机 Mold14 共面性不良Poor LDS Coplanarity15 缺损/缺角 Crackformingorientation16 反切 Wrong17 擦伤/划伤 Scratchlead18 弯脚 Bentlead19 长短脚 Unevenflash20 废胶 Mold21 切偏dambar22 连筋 Uncut23 分离 Singulationscratches24 管脚刮伤 Leadpackage25 裂缝、胶体破裂 Crackcrack26 微裂缝 Micro27切割 Sawing1 切割 Sawing2 切割分离系统Sawing & Placement System/ Singulation3 磨边 Perimeter4 偏差 Offset5 划伤 Scratch6 划痕 Residuecharactermark7 打错位 Wrongposition8 毛刺 Burr9 崩角、缺角Chip package / Chipping10 共面性不良Poor LDS Coplanaritytype11 冲压式 Punch12 切割式Saw type / Singulation Type13 刀片高度 Heightspeed15 进刀速度 Feedpressure16 清洗水压力 Cleantime17 清洗时间 Clean18 纯水电阻率DI water resistivitytemperature19 烘干温度 Curingtime 20 烘干时间 Curingtemperature21 切割水温度 Sawingwaterflowmeter22 去离子水流量 DI。
质量英文词汇
1. PDCA : Plan、Do、Check、Action 策划、实施、检查、处置2. PPAP : Production PartApproval Process 生产件批准程序3. APQP : Advanced ProductQuality Planning 产品质量先期策划4. FMEA : Potential FailureMode and Effects Analysis 潜在失效模式及后果分析5.SPC: Statistical ProcessControl 统计过程控制6. MSA : Measurement SystemAnalysis 测量系统控制7. CP: Control Plan 控制计划8. QSA : Quality SystemAssessment 质量体系评定9. PPM : Parts Per Million 每百万零件不合格数10. QM : Quality Manua 质量手册11. QP : Quality Procedure 质量程序文件/Quality Planning 质量策划/Quality Plan 质量计划12. CMK :机器能力指数13. CPK :过程能力指数14. CAD : Computer-AidedDesign 计算机辅助能力设计15.OEE : Overall Equipment Effectiveness 设备总效率16. QFD : Quality FunctionDeployment 质量功能展开17. FIFO : First in, First out 先进先出18. COPS : Customer OrientedProcesses 顾客导向过程19. TCQ : Time、Cost、Quality 时间、成本、质量20. MPS : Management Processes 管理性过程21.SPS : Support Processes 支持性过程22. TQM : Total QualityManagement 全面质量管理23. PQA : Product QualityAssurance 产品质量保证（免检）24. QP-QC-QI :质量三步曲，质量计划—质量控制—质量改进25. QAF : Quality AssuranceFile 质量保证文件26. QAP : Quality AssurancePlan 质量保证计划27. PFC : Process Flow Chart 过程流程图28. QMS : Quality ManagementSystems 质量管理体系29. JIT : Just In Time 准时（交货）30. ERP : EnterpriseRequirement Planning 企业需求计划31. QC : Quality Control 质量控制32. QA : Quality Audit 质量审核/QalityAssurance 质量保证33.IQC : In Come QualityControl 进货质量控制34.IPQC : In Process QualityControl 过程质量控制35.FQC : Final QualityControl 成品质量控制36.OQC : Out Quality Control 出货质量控制37.4M1E : Man、Machine、Material、Method、Environment 人、机、料、法、环38.5W1H : Why、What、Who、When、Where、How 为何/做什么/谁做/时间/地点/如何做39.6S : Seiri、Seiton、Seiso、Seiketsu、Shitsuke、Safety 整理、整顿、清扫、清洁、素养、安全40. TRI值：Total Record Injury （三种）可记录工伤值41.SMART :精明原则，SpecificMeasurable Achievable Result Oriented Timed (具体的描述、可以测量的、可以通过努力实现的、有结果导向性的、有时间性的)企业常用英文缩写I. 5S: 5S 管理2. ABC :作业制成本制度(Activity-BasedCosting )3. ABB :实施作业制预算制度(Activity-BasedBudgeting )4. ABM :作业制成本管理(Activity-BaseManagement )5. APS :先进规画与排程系统(AdvancedPlanning and Scheduling )6. ASP :应用程序服务供货商(ApplicationService Provider )7. ATP :可承诺量(Available ToPromise )8. AVL :认可的供货商清单(ApprovedVendor List )9. BOM :物料清单(Bill OfMaterial )10. BPR :企业流程再造(BusinessProcess Reengineering )II. BSC :平衡记分卡(BalancedScoreCard )12. BTF :计划生产(Build ToForecast )13. BTO :订单生产(Build To Order )14. CPM :要径法(Critical PathMethod )15. CPM :每一百万个使用者会有几次抱怨(Complaintper Million )16. CRM :客户关系管理(CustomerRelationship Management )17. CRP :产能需求规划(CapacityRequirements Planning )18. CTO :客制化生产(ConfigurationTo Order )19. DBR :限制驱导式排程法(Drum-Buffer-Rope )20. DMT :成熟度验证(DesignMaturing Testing )21. DVT :设计验证(DesignVerification Testing )22. DRP :运销资源计划(DistributionResource Planning )23. DSS :决策支持系统(DecisionSupport System )24. EC :设计变更/工程变更(EngineerChange )25. EC :电子商务(ElectronicCommerce )26. ECRN :原件规格更改通知(EngineerChange Request Notice )27. EDI :电子数据交换(ElectronicData Interchange )28. EIS :主管决策系统(ExecutiveInformation System )29. EMC :电磁相容(ElectricMagnetic Capability )30. EOQ :基本经济订购量(EconomicOrder Quantity )31. ERP :企业资源规划(EnterpriseResource Planning )32. FAE :应用工程师(FieldApplication Engineer )33. FCST :预估(Forecast)34. FMS :弹性制造系统(FlexibleManufacture System )35. FQC :成品质量管理(Finish orFinal Quality Control )36.IPQC:制程质量管理(In-ProcessQuality Control )37.IQC :进料质量管理(IncomingQuality Control )38.ISO :国际标准组织(InternationalOrganization for Standardization )39.ISAR :首批样品认可(InitialSample Approval Request )40. JIT :实时管理(Just In Time)41. KM :知识管理(KnowledgeManagement )42. L4L :逐批订购法(Lot-for-Lot )43. LTC :最小总成本法(Least TotalCost )44. LUC :最小单位成本(Least UnitCost )45. MES :制造执行系统(ManufacturingExecution System )46. MO :制令(Manufacture Order )47. MPS :主生产排程(MasterProduction Schedule )48. MRO :请修(购)单(MaintenanceRepair Operation )49. MRP :物料需求规划(MaterialRequirement Planning )50. MRPII :制造资源计划(ManufacturingResource Planning )51. NFCF :更改预估量的通知Notice forChanging Forecast52.OEM :委托代工(OriginalEquipment Manufacture )53.ODM :委托设计与制造(OriginalDesign & Manufacture )54.OLAP :在线分析处理(On-LineAnalytical Processing )55.OLTP :在线交易处理(On-LineTransaction Processing )56.OPT :最佳生产技术(OptimizedProduction Technology )57.OQC :出货质量管理(Out-goingQuality Control )58. PDCA : PDCA 管理循环(Plan-Do-Check-Action )59. PDM :产品数据管理系统(ProductData Management )60. PERT :计划评核术(ProgramEvaluation and Review Technique )61. PO :订单(Purchase Order )62. POH :预估在手量(Product onHand )63. PR :采购申请(PurchaseRequest )64. QA :品质保证(QualityAssurance )65. QC :质量管理(Quality Control )66. QCC :品管圈(Quality ControlCircle )67. QE :品质工程(QualityEngineering )68. RCCP :粗略产能规划(Rough CutCapacity Planning )69. RMA :退货验收(ReturnedMaterial Approval )70. ROP :再订购点(Re-Order Point )71.SCM :供应链管理(Supply ChainManagement )72.SFC :现场控制(Shop FloorControl )73.SIS :策略信息系统(Strategiclnformation System )74.SO :订单(Sales Order )75.SOR :特殊订单需求(Special OrderRequest )76.SPC :统计制程管制(StatisticProcess Control )77. TOC :限制理论(Theory ofConstraints )78. TPM :全面生产管理(TotalProduction Management )79. TQC :全面质量管理(Total QualityControl )80. TQM :全面品质管理(Total QualityManagement )81. WIP :在制品(Work In Process )部门名称的专有名词QS:Quality system 品质系统CS:Coutomer Sevice 客户服务QC:Quality control 品质管理IQC:lncoming quality control 进料检验LQC:L ine Quality Control 生产线品质控制IPQC:In process quality control 制程检验FQC:Final quality control 最终检验OQC:Outgoing quality control 出货检验QA:Quality assurance 品质保证SQA:Source(supplier) Quality Assurance 供应商品质保证(VQA)CQA : Customer Quality Assurance 客户质量保证PQA rocess Quality Assurance 制程品质保证QE:Quality engineer 品质工程CE:component engineering 零件工程EE:equipment engineering 设备工程ME:manufacturing engineering 制造工程TE:testing engineering 测试工程PPE roduct Engineer 产品工程IE:Industrial engineer 工业工程ADM: Administration Department 行政部RMA:客户退回维修CSDI:检修PC:producing control 生管MC:mater control 物管GAD: General Affairs Dept 总务部A/D: Accountant /Finance Dept 会计LAB: Laboratory 实验室DOE:实验设计HR:人资PMC:企划RD:研发W/H:仓库SI客验PD: Product Department 生产部PA:采购（PUR: Purchaing Dept）SMT:Surface mount technology 表面粘着技术MFG:Manufacturing 制造Mismanagement information system 资迅管理系统DCC:document control center 文件管制中心厂内作业中的专有名词QT:Quality target 品质目标QP:Quality policy 目标方针QI:Quality improvement 品质改善CRITICAL DEFECT:严重缺点（CR）MAJOR DEFECT:主要缺点（MA）MINOR DEFECT:次要缺点（MI）MAX:Maximum 最大值MIN:Minimum 最小值DIA iameter 直径DIM imension 尺寸LCL:Lower control limit 管制下限UCL:Upper control limit 管制上限EMI:电磁干扰ESD:静电防护EPA:静电保护区域ECN:工程变更ECO:Engineering change order 工程改动要求（客户）ECR:工程变更需求单CPI:Continuous Process Improvement 连续工序改善Compatibility :兼容性Marking :标记DWG rawing 图面Standardization :标准化Consensus :一致Code :代码ZD:Zero defect 零缺点Tolerance :公差Subject matter :主要事项Auditor :审核员BOM:Bill of material 物料清单Rework :重工ID : identification 识别，鉴别证明PILOT RUN:（试投产）FAI:首件检查FPIR: First Piece Inspection Report 首件检查报告FAA:首件确认SPC:统计制程管制CP: capability index （准确度）CPK: capability index of process（制程能力）PMP:制程管理计划（生产管制计划）MPI:制程分析DAS efects Analysis System 缺陷分析系统PPB:十亿分之一Flux :助焊剂P/N:料号L/N : Lot Number 批号Version :版本Quantity :数量Valid date :有效日期MIL-STD : Military-Standard 军用标准ICT: In Circuit Test （线路测试）ATE: Automatic Test Equipment 自动测试设备MO: Manafacture Order 生产单T/U: Touch Up （锡面修补）I/N:手插件P/T:初测F/T: Function Test （功能测试-终测）AS组立P/K:包装TQM:Total quality control 全面品质管理MDA:manufacturing defect analysis 制程不良分析（ICT）RUN-IN:老化实验HI-pot :高压测试FMI : Frequency Modulation Inspect 高频测试DPPM: Defect Part Per Million（不良率的一种表达方式：百万分之一）1000PPM即为0.1% Corrective Action: （CAR 改善对策）ACC :允收REJ拒收S/S : Sample size抽样检验样本大小SI-SIV : Special I-Special IV 特殊抽样水平等级CON : Concession / Waive 特采ISO:国际标准化组织ISA : Industry Standard Architecture 工业标准体制结构OBA:开箱稽核FIFO:先进先出PDCA:管理循环Plan do check action 计划，执行，检查，总结WIP:在制品（半成品）S/O: Sales Order （业务订单）P/O: Purchase Order （采购订单）P/R: Purchase Request （请购单）AQL:acceptable quality level 允收品质水准LQL;Limiting quality level 最低品质水准QVL:qualified vendor list 合格供应商名册AVL :认可的供货商清单（Approved Vendor List）QCD: Quality cost delivery （品质，交期，成本）MPM:Manufacturing project management 制造专案管理KPI:Key performance indicate 重要绩效指标MVT:Manufacturing Verification Test 制造验证试产Q/R/S : Quality/Reliability/Service 质量/可靠度/服务STL:ship to line （料到上线）NTF:No trouble found 误判CIP:capacity improvement plan （产能改善计戈U）MRB:material review board （物料审核小组）MRB:Material reject bill 退货单JIT:just in time （即时管理）5S:seiri seiton seiso seiketsu shitsuke（整理，整顿，清扫，清洁，修养）SOP:standard operation process （标准作业程序）SIP:Specification inspection process 制程检验规格TOP: Test Operation Process （测试作业流程）WI: working instruction （作业指导书）SMD:surface mounting device （表面粘着原件）FAR:failure aualysis report 故障分析报告CAR:Corrective action report 改善报告BPR: 企业流程再造（Business Process Reengineering）ISAR :首批样品认可（Initial Sample Approval Request）-JIT:实时管理（Just In Time）QCC :品管圈（Quality Control Circle）Engineering Department （工程部）TQEM: Total Quality Environment Management（全面品质环境管理）PD: Production Department （制造）LOG: Logistics （后勤支持）Shipping:（进出口）AOQ : Average Output Quality 平均出货质量AOQL : Average Output Quality Level 平均出货质量水平FMEA : failure model effectiveness analysis 失效模式分析CRB: Change Review Board （工程变更会议）CSA: Customer Simulate Analysis 客户模拟分析SQMS : Supplier Quality Management System 供应商品质管理系统QIT: Quality Improvement Team 品质改善小组QIP : Quality Improvement Plan 品质改善计划CIP : Continual Improvement Plan 持续改善计划M.Q.F.S: Material Quality Feedback Sheet （来料品质回馈单）SCAR: Supplier Corrective Action Report （供货商改善对策报告）8D Sheet: 8 Disciplines sheet （ 8D 单）PDCA : PDCA （Plan-Do-Check-Action）（管理循环）MPQ: Material Packing Quantity ( 物料最小包装量)DSCN: Delivery Schedule Change Notice ( 交期变更通知) QAPS: Quality Assurance Process Sheet ( 品质工程表)DRP :运销资源计划(Distribution Resource Planning) DSS:决策支持系统(Decision Support System) EC :电子商务(Electronic Commerce) EDI :电子资料交换(Electronic Data Interchange) EIS :主管决策系统(Excutive Information System) ERP :企业资源规划(Enterprise Resource Planning) FMS :弹性制造系统(Flexible Manufacture System) KM :知识管理(Knowledge Management) 4L :逐批订购法(Lot-for-Lot)LTC :最小总成本法(Least Total Cost) LUC :最小单位成本(Least Unit Cost) MES :制造执行系统(Manufacturing Execution System) MPS :主生产排程(Master Production Schedule) MRP :物料需求规划(Material Requirement Planning) MRP 制造资源计划(Manufacturing Resource Planning) OEM :委托代工(Original Equipment Manufacture) ODM :委托设计与制造(Original Design & Manufacture) OLAP :线上分析处理(On-Line Analytical Processing) OLTP :线上交易处理(On-Line Transaction Processing) OPT :最佳生产技术(Optimized Production Technology) PDCA : PDCA 管理循环(Plan-Do-Check-Action) PDM :产品数据管理系统(Product Data Management)) RCCP:粗略产能规划(Rough Cut Capacity Planning) SCM :供应链管理(Supply Chain Management) SFC :现场控制(Shop Floor Control) TOC :限制理论(Theory of Constraints) TQC :全面品质管制(Total Quality Control) FYI/R:for your information/reference 仅供参考ASAP:尽快S/T:Standard time 标准时间TPM:total production maintenance : 全面生产保养ESD Wrist strap :静电环IT:information technology 信息技术，资讯科学CEO: Chief Executive Officer 执行总裁COO : Chief Operaring Officer 首席业务总裁SWOT : Strength,Weakness,Opportunity,Threat 优势，弱点，机会，威胁Competence :专业能力Communication :有效沟通Cooperation :统御融合Vibration Testing :振动测试IDP : Individual Development Plan 个人发展计划MRP : Material Requirement Planning 物料需求计划MAT'S : Material 材料LRR: Lot Rejeet Rate 批退率ATIN : Attention 知会3C : Computer ‘Communication , Consumer electronic消费性电子5W1H : When , Where , Who , What , Why , Ho5M: Man , Machine , Material , Method , Measurement人机器材料方法，测量4MIE: Man,Material,Machine,Method,Environment人力，物力财务，技术，时间（资源）7M1I: Manpower , Machine , Material , Method, Market , Management , Money , Information人力，机器，材料，方法，市场，管理，资金，资讯Accuracy 准确度Action 行动Activity 活动Analysis Covariance 协方差分析Analysis of Variance 方差分析Approved 承认Attribute 计数值Average 平均数Balance sheet 资产负债对照表Binomial 二项分配Brainstorming Techniques 脑力风暴法Cause and Effect Matrix 因果图（鱼骨图）CL:Center Line 中心线Check Sheets 检查表Complaint 投诉Conformity 合格（符合）Control 控制Control chart 控制（管制）图Correction 纟耳正Correlation Methods 相关分析法CPI: continuouse Process Improvement 连续工序改善Cross Tabulation Tables 交叉表CS: Customer Sevice 客（户）服（务）中心DSA: Defects Analysis System 缺陷分析系统Data 数据Description:品名DCC: Document Control Center 文控中心Decision 决策、判定Defects per unit 单位缺点数Description 描述Device 装置Do执行DOE: Design of Experiments 实验设计Element 元素Engineering recbnology 工程技Environmental 环境Equipment 设备Estimated accumulative frequency 计算估计累计数E Equipment Variation 设备变异External Failure 外部失效，外部缺陷FA: Failure Analysis 失效分析Fact control 事实管理Fatigue 疲劳FMEA: Failure Mode and Effect Analysis 失效模式与效果分析FP First-Pass Yield （第一次通过）合格率FQA: Final Quality Assurance 最终品质保证FQC: Final Quality control 最终品质控制Gauge system 测量系统Grade等级Histogram 直方图Improvement 改善Initial review 先期审查Inspection 检验Internal Failure 内部失效、内部缺陷IPQC: In Process Quality Control 制程品质控制IQC: Incomming Quality Control 来料品质控制IS International Organization for Standardization 国际标准化组织LCL: Lower Control limit 管制下限LQC: Line Quality Control 生产线品质控制LSL: Lower Size Limit 规格下限Machine 机械Manage 管理Materials 物料Measurement 测量Median 中位数MSA: Measurement System Analysis 测量系统分析Occurrence 发生率Operation Instruction 作业指导书Organization 组织Parto柏拉图PPM arts per Million （百万分之）不良率Plan计划Policy方针Population 群体PQA: Process Quality Assurance 制程品质保证Practice 实务（践）Prevention 预防Probability 机率Probability density function 机率密度函数Procedure 流程Process 过程Process capability analysis 制程能力分析（图）Process control and Process capability 制程管制与制程能力Product 产品Production 生产Projects 项目QA: Quality Assurance 品质保证QC: Quality Control 品质控制QE: Quality Engineering 品质工程QFD: Quality Function Desgin 品质机能展开（法）Quality 质量Quality manual 品质手册Quality policy 品质政策（质量方针）Random experiment 随机试验Random numbers 随机数R:Range全距（极差）Reject拒收Repair返修Repeatusility 再现性Reproducibility 再生性Requirement 要求Responsibilities 职责Review 评审Reword 返工Rolled yield 直通率RPN: Risk Priority Number 风险系数Sample抽样祥本Sample space 样本空间Sampling with replacement 放回抽样Sampling without replacement 不放回抽样Scatter diagram 散布图分析Scrap报废Simple random sampling 简单随机取样Size规格SL: Size Line 规格中心线Stratified random sampling 分层随机抽样SOP: Standard Operation Procedure 标准作业书SPC: Statistical Process Control 统计制程管制Specification 规范SQA: Source（Supplier） Quality Assurance 供货商品质保证Stage sampling 分段随机抽样Standard Deviation 标准差Sum of squares 平方和Taguchi-method 田口（试验）方法Theory 原理TQC: Total Quality Control 全面品质控制TQM: Total Quality Management 全面品质管理Traceablity 追溯Training 培训UCL: Upper Control Limit 管制（控制）上限USL: Upper Size Limit 规格上限Validation 确认Variable 计量值Verification 验证Version 版本VOC: Voice of Customer 客户需求VOE: Voice of Engineer 工程需求Inventory stock report: 庫存清单报告Sales order report: 出货报告质量人员名称类QC quality control 品质管理人员FQC final quality control 终点质量管理人员IPQC in process quality control 制程中的质量管理人员OQC output quality control 最终出货质量管理人员IQC incoming quality control 进料质量管理人员TQC total quality control 全面质量管理POC passage quality control 段检人员QA quality assurance 质量保证人员OQA output quality assurance 出货质量保证人员QE quality engineering 质量工程人员质量保证类FAI first article inspection 新品首件检查FAA first article assurance 首件确认CP capability index 能力指数CPK capability process index 模具制程能力参数SSQA standardized supplier quality audit 合格供货商质量评估FMEA failure model effectiveness analysis 失效模式分析FQC运作类AQL Acceptable Quality Level 运作类允收质量水平S/S Sample size 抽样检验样本大小ACC Accept 允收REE Reject 拒收CR Critical极严重的MAJ Major 主要的SPEC Specification 规格DWG Drawing 图面 系统文件类ES Engineering Standard 工程标准CGOO China General PCE 龙华厂文件MIN Minor 轻微的 Q/R/S Quality/Reliability/Service 质量 / 可靠度 / 服务 P/N Part Number 料号 L/N Lot Number 批号AOD Accept On Deviation 特采 UAI Use As It 特采FPIR First Piece Inspection Report 首件检查报告 PPM Percent Per Million 百万分之一制程统计品管专类 SPC Statistical Process Control 统计制程管制 SQC Statistical Quality Control 统计质量管理 GRR Gauge Reproductiveness & Repeatability 量具之再制性及重测性判断量可靠与否 DIM Dimension 尺寸 DIA Diameter 直径N Number 样品数 其它质量术语类 QIT Quality Improvement Team 质量改善小组 ZD Zero Defect 零缺点QI Quality Improvement 质量改善 QP Quality Policy 目标方针TQM Total Quality Management 全面质量管理 RMA Return Material Audit 退料认可 7QCTools 7 Quality Control Tools 品管七大手法通用之件类ECN Engineering Change Notice 工程变更通知（供货商） ECO Engineering Change Order 工程改动要求（客户） PCN Process Change Notice 工序改动通知 PMP Product Management Plan 生产管制计划 SIP Standard Inspection Procedure 制程检验标准程序 SOP Standard Operation Procedure 制造作业规范 IS Inspection Specification 成品检验规范BOM Bill Of Material 物料清单PS Package Specification包装规范IWS International Workman Standard 工艺标准ISO International Standard Organization 国际标准化组织GS General Specification 一般规格部类PMC Production & Material Control 生产和物料控制PCC Product control center 生产管制中心PPC Production Plan Control 生产计划控制MC Material Control 物料控制DC Document Center 资料中心QE Quality Engineering 质量工程（部）QA Quality Assurance 质量保证（处）QC Quality Control 质量管理（课）PD Product Department 生产部LAB Laboratory 实验室IE Industrial Engineering 工业工程R&D Research & Design 设计开发部生产类PCs Pieces个（根，块等）PRS Pairs 双（对等）CTN Carton 卡通箱PAL Pallet/skid 栈板PO Purchasing Order 采购订单MO Manufacture Order 生产单D/C Date Code 生产日期码ID/C Identification Code （供货商）识别码SWR Special Work Request 特殊工作需求L/N Lot Number 批号P/N Part Number 料号OEM Original Equipment Manufacture 原设备制造PC Personal Computer 个人计算机CPU Central Processing Unit 中央处理器A.S.A.P As Soon As Possible 尽可能快的E-MAIL Electrical-Mail 电子邮件N/A Not Applicable 不适用QTY Quantity 数量I/O input/output 输入/ 输出NG Not Good 不行,不合格C=0 Critical=0 极严重不允许APP Approve 核准，认可，承认CHK Check 确认ASS'Y Assembly 装配，组装T/P True Position 真位度5WIH When, Where, Who, What, Why, How to6M Man, Machine, Material, Method, Measurement, Message4MTH Man, Material, Money, Method, Time, How 人力，物力，财务，技术，时间（资源）SQA Strategy Quality Assurance 策略质量保证DQA Design Quality Assurance 设计质量保证MQA Manufacture Quality Assurance 制造质量保证SSQA Sales and service Quality Assurance 销售及服务质量保证LRR Lot Reject Rate 批退率SPS Switching power supply 电源箱DT Desk Top 卧式（机箱）MT Mini-Tower 立式（机箱）DVD Digital Video DiskVCD Video Compact DiskLCD Liquid Crystal DisplayCAD Computer Aided DesignCAM Computer Aided ManufacturingCAE Computer Aided EngineeringPCB Printed Circuit Board 印刷电路板CAR Correction Action Report 改善报告NG Not Good 不良WDR Weekly Delivery Requirement 周出货要求PPM Percent Per Million 百万分之一TPM Total Production Maintenance 全面生产保养MRP Material Requirement Planning 物料需计划OS Operation System 操作系统TBA To Be Assured 待定,定缺D/C Drawing ChangeP/P Plans & ProcedureEMI Electrical-Music Industry 电子音乐工业Electrical Magnetic Interference 电子干扰RFI Read Frequency Input 读频输入MMC Maximum Material ConditionMMS Maximum Material SizeLMC Least Material ConditionLMS Least Material SizeLED lighting-emitting diode 发光二极管。