CZRB2020中文资料
CZRB2082中文资料
Voltage: 11 - 100 V olts Power: 2.0 WattCZRB2011ThruFeatures- For surf ace mounted applications in order to optimize board space - Low profile package - Built-in strain relief- Glass passivated junction - Low inductance- Excellent clamping capability- Typical I less than 1uA above 11V D - High temperature soldering 260°C /10seconds at terminals- Plastic package has underwriters laboratory flammability classification 94V-OMechanical data- Case: JEDEC DO-214AA,Molded plastic over passivated junction- Terminals: Solder plated, solderable per MIL-STD-750, method 2026- Polarity: Color band denotes positive end (cathode) except Bidirectional- Standard Packaging: 12mm tape (EIA-481) - Weight: 0.002 ounce, 0.064 gramMaximum Ratings and Electrical CharactericsRatings at 25°C ambient temperature unless otherwise specified.Rating and Characteristic Curevs (CZRB2011 Thru CZRB2100) ELECTRICAL CHARACTERISTICS(T A=25°C unless otherwise noted) (V F=1.2Volts Max, I F=500mA for all types.)Rating and Characteristic Curves (CZRB2011Thru CZRB2100)Fig.2-TYPICAL THERMAL RESPONSE L,P.W.PULSE WIDTH (ms)0.10.050.030.020.010.0050.0030.0020.0010.00050.00030.00020.0001NOMINAL VZ (VOLTS)Fig.3-MAXIMUM SURGE POWERFig.4-TYPICAL REVERSE LEAKAGEVZ,ZENER VOLTAGE @IZT (VOLTS)VZ,ZENER VOLTAGE @IZT (VOLTS)Fig.5-UNITS TO 12VOLTS Fig.6-UNITS 10TO 100VOLTSRating and Characteristic Curves (CZRB2011Thru CZRB2100)VZ,ZENER VOLTAGE (VOLTS)VZ,ZENER VOLTAGE (VOLTS)L,LEAD LENGTH TO HEAT SINK (INCH)Fig.9-TYPICALTHERMAL RESISTANCEAPPLICATION NOTE:Since the actual voltage available from a given zener diode is temperature dependent, it is necessary to determine junction temperature under any set of operating conditions in order to calculate its value. The following procedure is recommended:Lead Temperature, T L, should be determined from:T L = șLA P D + T AșLA is the lead-to-ambient thermal resistance (°C/W)and PD is the power dissipation. The value forșLA willvary and depends on the device mounting method.șLA is generally 30-40 °C/W for the various chips andtie points in common use and for printed circuit boardwiring.The temperature of the lead can also be measured using a thermocouple placed on the lead as close as possible to the tie point. The thermal mass connected to the tie point is normally large enough so that it will not significantly respond to heat surges generated in the diode as a result of pulsed operation once steady-state conditions are achieved. Using the measured value of T L, the junction temperature may be determined by:T J = T L + ¨T JL ¨T JL is the increase in junction temperature above the lead temperature and may be found from Figure 2 for a train of power pulses or from Figure 10 for dc power.¨T JL = șLA P DFor worst-case design, using expected limits of Iz, limits of PD and the extremes of TJ (¨T JL ) may be estimated. Changes in voltage, Vz, can then be found from:¨V = șVZ¨T JșVZ , the zener voltage temperature coefficient, isfound from Figures 5 and 6.Under high power-pulse operation, the zener voltagewill vary with time and may also be affected significantly be the zener resistance. For best regulation, keep current excursions as low as possible.Data of Figure 2 should not be used to compute surge capability. Surge limitations are given in Figure 3. They are lower than would be expected by considering only junction temperature, as current crowding effects cause temperatures to be extremely high in small spots resulting in device degradation should the limits of Figure 3 beexceeded.COMCHIPSurface Mount Zener Diode。
无机化合物列表
无机化合物列表维基百科，自由的百科全书无机化合物列表中，无机化合物名称遵循IUPAC無機化合物中文命名法。
按照阳离子，带正电元素或基团的拼音顺序排列。
溶剂合物列在相应的盐欄目之下。
酸纳入氢欄目下，而酸式盐则被纳入相应正盐欄目之下。
配位化合物通常列在外界正电元素之下。
内容列表：锕氨铵钯钡铋铂钚氮氘锝镝碲碘铥氡锇铒钒钆钙锆镉铬汞钴硅铪钬镓钾金肼锎钪氪铼镧铑镭锂钌磷硫镥铝氯镁锰钼镎钠铌镍钕硼硼烷铍钋钷镤镨铅氢氰铷铯钐砷铈锶铊钛钽碳铽锑铁铜钍钨硒锡氙锌溴氧铱钇镱铟银铀铕锗锕∙溴化锕 - AcBr3∙氧化锕 - Ac2O3氨∙氨 - NH3∙氨水 - NH3·H2O／NH4OH铵∙氨基磺酸铵 - NH4NH2SO3∙氨基甲酸铵 - NH4COONH2∙苯甲酸铵 - NH4C7H5O2∙草酸铵 - (NH4)2C2O4·H2O∙草酸氢铵 - NH4HC2O4·H2O∙重铬酸铵 - (NH4)2Cr2O7∙重铀酸铵 - (NH4)2U2O7∙次磷酸铵 - NH4PH2O2∙次磷酸二氢铵 - NH4H2PO2∙次氯酸銨 - NH4ClO∙碘化铵 - NH4I∙碘酸铵 - NH4IO3∙二草酸根合氧钛酸铵 - (NH4)2TiO(C2O4)2∙氟化氢铵 - NH4HF2∙二硫代氨基甲酸铵 - NH4S(C=S)NH2∙钒酸铵 - NH4VO3∙氟化铵 - NH4F∙高氯酸铵 - NH4ClO4∙氯酸銨 - NH4ClO3∙高锰酸铵 - NH4MnO4∙铬酸铵 - (NH4)2CrO4∙过硫酸铵 - (NH4)2S2O8∙甲酸铵 - NH4OOCH∙酒石酸铵 - (NH4)2C4H4O6∙酒石酸氢铵 - NH4HC4H4O6∙苦味酸铵 - NH4C6H2N3O7∙賴納克氏鹽，四硫氰酸根二氨合铬(III)酸铵 - NH4[Cr(SCN)4(NH3)2] ∙磷酸二氢铵 - NH4H2PO4∙磷酸氢铵，磷酸一氢铵，磷酸氢二铵 - (NH4)2HPO4∙磷酸铵 - (NH4)3PO4∙硫代硫酸铵 - (NH4)2S2O3∙硫化铵 - (NH4)2S∙硫化氢铵，硫氢化铵 - NH4HS∙硫氰酸铵 - NH4SCN∙硫酸铵 - (NH4)2SO4∙硫酸铬(III)铵，硫酸铬铵 - NH4Cr(SO4)2·12H2O∙硫酸钴(II)铵，硫酸钴铵 - (NH4)2Co(SO4)2·6H2O∙硫酸镍(II)铵，硫酸镍铵 - (NH4)2Ni(SO4)2·6H2O∙硫酸氢铵 - NH4HSO4∙硫酸铁(III)铵，硫酸铁铵 - NH4Fe(SO4)2·12H2O∙硫酸铁(II)铵，硫酸亚铁铵 - (NH4)2Fe(SO4)2·6H2O∙六氟硅酸铵，氟硅酸铵 - (NH4)2[SiF6]∙六氟镓酸铵，氟镓酸铵 - (NH4)3GaF6∙六氟磷酸铵，氟磷酸铵 - NH4[PF6]∙六氟铝酸铵 - (NH4)3[AlF6]∙六氟锗酸铵，六氟锗酸铵 - (NH4)2GeF6∙六氯合钯(IV)酸铵，六氯钯酸铵 - (NH4)2[PdCl6]∙六氯合铂(IV)酸铵，六氯铂酸铵 - (NH4)2[PtCl6]∙六硝酸根合铈(IV)铵，硝酸铈铵 - (NH4)2[Ce(NO3)6]∙氯化铵 - NH4Cl∙锰酸铵 - (NH4)2MnO4∙钼酸铵 - (NH4)2MoO4∙柠檬酸氢铵 - (NH4)2HC6H5O7∙柠檬酸铵 - (NH4)2C6H8O7∙氢氧化铵，一水合氨 - NH3·H2O∙氰化铵 - NH4CN∙乳酸铵 - NH4C3H5O3∙软脂酸铵 - NH4OOC(CH2)14CH3∙砷酸二氢铵 - NH4H2AsO4∙砷酸钙铵 - NH4CaAsO4·6H2O∙砷酸镁铵 - NH4MgAsO4·6H2O∙十二三氧化钼磷酸铵，磷钼酸铵 - (NH4)3PO4·12MoO3·H2O∙十八酸铵 - NH4OOC(CH2)16CH3∙四硼酸铵 - (NH4)2B4O7·4H2O∙四氟硼酸铵，氟硼酸铵 - NH4[BF4]∙四氯合钯(II)酸铵，六氯钯酸铵 - (NH4)2[PdCl4]∙四氯合铂(II)酸铵，六氯铂酸铵 - (NH4)2[PtCl4]∙四氯合铝酸铵，氯铝酸铵 - NH4AlCl4∙四氯合铜(II)酸铵，氯铜酸铵 - (NH4)2CuCl4·2H2O∙四氯合锌酸铵，氯锌酸铵 - (NH4)2[ZnCl4]∙碳酸氢铵 - NH4HCO3∙碳酸铵 - (NH4)2CO3·H2O∙硒酸铵 - (NH4)2SeO4∙硝酸铵 - NH4NO3∙辛酸铵 - NH4OOC(CH2)6CH3∙溴化铵 - NH4Br∙溴酸銨 - NH4BrO3∙亚硫酸铵 - (NH4)2SO3·H2O∙亚硫酸氢铵 - NH4HSO3∙亞氯酸銨 - NH4ClO2∙乙酸铵 - NH4C2H3O2∙硬脂酸铵 - NH4C18H35O2∙仲钼酸铵 - (NH4)2Mo7O24·4H2O钯∙氯化钯 - PdCl2∙氯化烯丙基钯二聚物，氯化烯丙基钯二聚体，氯化烯丙基钯(II)二聚体 - (η3-C3H5)2Pd2Cl2∙硝酸钯 - Pd(NO3)2∙氧化钯 - PdO∙乙酸钯 - Pd(C2H3O2)2钡∙苯磺酸钡 - Ba(O3SC6H5)2∙草酸钡 - BaC2O4∙碘化钡 - BaI2∙碘酸钡 - Ba(IO3)2∙钒酸钡 - Ba3(VO4)2∙氟化钡 - BaF2∙高氯酸钡 - Ba(ClO4)2∙高锰酸钡 - Ba(MnO4)2∙锆酸钡 - BaZrO3∙铬酸钡 - BaCrO4∙过氧化钡 - BaO2∙磷酸鋇 - Ba3(PO4)2∙磷酸氢钡 - BaHPO4∙硫代硫酸钡 - BaS2O3·H2O∙硫化钡 - BaS∙硫氰酸钡 - Ba(SCN)2·2H2O∙硫酸钡 - BaSO4∙六氟硅酸钡 - BaSiF6∙氯化钡 - BaCl2∙氯酸钡 - Ba(ClO3)2·H2O∙锰酸钡 - BaMnO4∙钼酸钡 - BaMoO4∙铌酸钡 - Ba(NbO3)2∙氰化钡 - Ba(CN)2∙氢氧化钡 - Ba(OH)2·8H2O∙四氰合铂(II)酸钡，四氰铂酸钡 - Ba[Pt(CN)4]·4H2O ∙钛酸钡 - BaTiO3∙碳酸钡 - BaCO3∙碳酸氫鋇 - Ba(HCO)32∙硒化钡 - BaSe∙硝酸钡 - Ba(NO3)2∙溴化钡 - BaBr2∙溴酸钡 - Ba(BrO3)2·H2O∙亚硫酸钡 - BaSO3∙亚硝酸钡 - Ba(NO2)2·H2O∙氧化钡 - BaO∙乙酸钡 - Ba(C2H3O2)2·H2O∙硬脂酸钡 - Ba(C18H35O2)2铋∙碲化铋 - Bi2Te3∙碘化铋 - BiI3∙碘氧化铋 - BiIO∙氟化铋，三氟化铋 - BiF3∙氟化铋(V)，五氟化铋 - BiF5∙磷酸铋 - BiPO4∙硫化铋 - Bi2S3∙硫酸铋 - Bi2(SO4)3∙氯化铋 - BiCl3∙氯氧化铋 - BiClO∙氢化铋 - BiH3∙氢氧化铋 - Bi(OH)3∙水杨酸铋 - C7H5BiO4∙五水合硝酸铋，硝酸铋 - Bi(NO3)3·5H2O ∙硒化铋 - Bi2Se3∙溴化铋 - BiBr3∙溴氧化铋 - BiBrO∙氧化铋，三氧化二铋 - Bi2O3∙氧化铋(V)，五氧化二铋 - Bi2O5]铂∙氟化铂(VI)，六氟化铂 - PtF6∙卡铂，碳铂 - C6H12N2O4Pt∙硫化铂(IV)，二硫化铂 - PtS2∙氯化铂(II)，二氯化铂 - PtCl2∙氯化铂(IV)，四氯化铂 - PtCl4∙顺铂 - PtCl2·2NH3∙氧化铂(II)，一氧化铂 - PtO∙氧化铂(IV)，二氧化铂 - PtO2]钚∙氟化钚(III)，三氟化钚 - PuF3∙氟化钚(IV)，四氟化钚 - PuF4∙氟化钚(VI)，六氟化钚 - PuF6∙硫化钚(III)，三硫化二钚 - Pu2S3∙氯化钚(III)，三氯化钚 - PuCl3∙氢化钚(II)，二氢化钚 - PuH2∙氢化钚(III)，三氢化钚 - PuH3∙溴化钚(III)，三溴化钚 - PuBr3∙氧化钚(II)，一氧化钚 - PuO∙氧化钚(III)，三氧化二钚 - Pu2O3∙氧化钚(IV)，二氧化钚 - PuO2氮∙氟硼酸亚硝酰 - NO[BF4]∙三氟化氮 - NF3∙三氯化氮 - NCl3∙三碘化氮 - NI3∙亚硝酰氟 - NOF∙亚硝酰氯 - NOCl∙亚硝酰硫酸，亚硝基硫酸 - NOHSO4∙硝酰氟 - NO2F∙硝酰氯 - NO2Cl∙硝酸氟，氟硝酸 - FONO2∙氧化氮(I)，一氧化二氮 - N2O∙氧化氮(II)，一氧化氮 - NO∙氧化氮(III)，三氧化二氮 - N2O3∙氧化氮(IV)，二氧化氮 - NO2∙氧化氮(IV)，四氧化二氮 - N2O4∙氧化氮(V)，五氧化二氮 - N2O5氘∙氧化氘，重水 - D2O锝∙氟化锝(VI)，六氟化锝 - TcF6∙氧化锝(IV)，二氧化锝 - TcO2∙氧化锝(VII)，七氧化二锝 - Tc2O7镝∙氟化镝 - DyF3∙氯化镝 - DyCl3∙溴化镝 - DyBr3∙氧化镝 - Dy2O3碲∙碘化碲(IV)，四碘化碲 - TeI4∙氟化碲(IV)，四氟化碲 - TeF4∙氟化碲(VI)，六氟化碲 - TeF6∙氯化碲(II)，二氯化碲 - TeCl2∙氯化碲(IV)，四氯化碲 - TeCl4∙氧化碲(IV)，二氧化碲 - TeO2∙溴化碲(IV)，四溴化碲 - TeBr4碘∙氯化碘，一氯化碘 - ICl∙七氟化碘 - IF7∙三氯化碘 - ICl3∙五氟化碘 - IF5∙五氧化二碘 - I2O5∙溴化碘，一溴化碘 - IBr铥∙氟化铥 - TmF3∙氯化铥 - TmCl3氡∙二氟化氡 - RnF2锇∙六氟化锇 - OsF6∙四氯化锇 - OsCl4∙四氧化锇 - OsO4铒∙硫酸铒 - Er2(SO4)3·8H2O∙氯化铒 - ErCl3∙氧化铒 - Er2O3钒∙二氯二茂钒 - (C5H5)VCl2∙二氯氧化钒 - VCl2O∙氟化钒(III)，三氟化钒 - VF3∙氟化钒(IV)，四氟化钒 - VF4∙氟化钒(V)，五氟化钒 - VF5∙硫化钒(III)，三硫化二钒 - V2S3∙硫酸钒(III)，硫酸钒 - V2(SO4)3∙硫酸氧钒(IV)，硫酸氧钒 - VOSO4∙氯化钒(II)，二氯化钒 - VCl2∙氯化钒(III)，三氯化钒 - VCl3∙氯化钒(IV)，四氯化钒 - VCl4∙三氯氧化钒 - VOCl3∙双乙酰丙酮氧钒 - VO(acac)2∙碳化钒 - VC∙溴化钒(III)，三溴化钒 - VBr3∙氧化钒(II)，一氧化钒 - VO∙氧化钒(III)，三氧化二钒 - V2O3∙氧化钒(IV)，二氧化钒 - VO2∙氧化钒(V)，五氧化二钒 - V2O5鍅∙氫氧化鍅FrOH∙氫化鍅FrH∙高氯酸鍅FrClO4钆∙氟化钆 - GdF3∙硫酸钆 - Gd2(SO4)3·8H2O∙氯化钆 - GdCl3∙硝酸钆 - Gd(NO3)3·6H2O∙氧化钆 - Gd2O3钙∙泛酸钙 - [HOCH2CH(CH3)2CHOHCONH(CH2)2COO]2Ca ∙葡萄糖酸钙 - [HOCH2(CHOH)4COO]2Ca∙苯氧基钙 - Ca(OC6H5)2∙丙酸钙 - Ca(OOCC2H5)2∙草酸钙 - CaC2O4·H2O∙次磷酸钙 - Ca(PH2O2)2∙次氯酸钙 - Ca(OCl)2∙氮化钙 - Ca3N2∙碲化钙 - CaTe∙碘化钙 - CaI2∙碘酸钙 - Ca(IO3)2∙碳化钙 - CaC2∙氟化钙 - CaF2∙高氯酸钙 - Ca(ClO4)2∙高锰酸钙 - Ca(MnO4)2·5H2O∙铬酸钙 - CaCrO4∙硅酸钙 - Ca2SiO4∙过氧化钙 - CaO2∙琥珀酸钙 - CaC4H6O4·3H2O∙甲酸钙 - Ca(CHO2)2∙焦磷酸钙 - Ca2P2O7∙酒石酸钙 - CaC4H4O6·4H2O∙苦味酸钙 - CaC6H6O7·4H2O∙磷化钙 - Ca3P2∙磷酸钙 - Ca3(PO4)2∙磷酸二氢钙 - Ca(H2PO4)2·H2O∙磷酸氢钙 - CaHPO4·2H2O∙磷酸甘油钙，甘油磷酸钙 - Ca[C3H5(OH)3]PO4∙硫代硫酸钙 - CaS2O3·6H2O∙硫代乙醇酸钙 - Ca(-OOCCH2S-)·3H2O∙硫化钙 - CaS∙硫氰酸钙 - Ca(SCN)2·3H2O∙硫酸钙 - CaSO4∙硫酸氫鈣 - Ca(HSO4)2∙六氟硅酸钙，氟硅酸钙 - CaSiF6∙氯化钙 - CaCl2∙氯酸钙 - Ca(ClO3)2·2H2O∙钼酸钙 - CaMoO4∙氢化钙 - CaH2∙氢氧化钙 - Ca(OH)2∙氰氨化钙 - CaCN2∙氰化钙 - Ca(CN)2∙乳酸钙 - Ca(C3H5O3)2·5H2O∙砷酸钙 - Ca3(AsO4)2∙水杨酸钙 - Ca(C7H5O3)2·2H2O∙四硼酸钙 - CaB4O7∙四氢铝钙，氢化铝钙 - Ca[AlH4]2∙钛酸钙 - CaTiO3∙碳化钙 - CaC2∙碳酸钙 - CaCO3∙碳酸镁钙 - Ca[Mg(CO3)2]∙碳酸氫鈣 - Ca(HCO3)2∙钨酸钙 - CaWO4∙硒化钙 - CaSe∙硒酸钙 - CaSeO4·2H2O∙硝酸钙 - Ca(NO3)2∙溴化钙 - CaBr2∙亚硫酸钙 - CaSO3·2H2O∙亞硫酸氫鈣 - Ca(HSO3)2∙亚氯酸钙 - Ca(ClO2)2∙亚硝酸钙 - Ca(NO2)2·4H2O∙氧化钙 - CaO∙乙酸钙 - Ca(C2H3O2)2∙硬脂酸钙 - Ca(C18H35O2)2∙油酸钙 - Ca(C18H33O2)2∙鉻酸鈣 - CaCrO4∙重铬酸钙 - CaCr2O7∙棕榈酸钙 - Ca(C16H31O2)2锆∙二氧化鋯 - ZrO2∙氮化锆 - ZrN∙碘化锆(IV)，四碘化锆，碘化锆 - ZrI4∙二氯氧化锆，氯氧化锆，氧氯化锆 - ZrCl2O·8H2O ∙二硼化锆 - ZrB2∙二氢化锆 - ZrH2∙氟化锆(IV)，四氟化锆，氟化锆 - ZrF4∙硅酸锆(IV)，硅酸锆 - ZrSiO4∙硫酸锆(IV)，硫酸锆 - Zr(SO4)2·4H2O∙氯化锆(II)，二氯化锆 - ZrCl2∙氯化锆(IV)，四氯化锆，氯化锆 - ZrCl4∙氢氧化锆(IV)，氢氧化锆 - Zr(OH)4∙碳化锆 - ZrC2 / ZrC∙硝酸锆(IV)，硝酸锆 - Zr(NO3)4·5H2O∙溴化锆(IV)，四溴化锆，溴化锆 - ZnBr4∙氧化锆(IV)，二氧化锆，氧化锆 - ZrO2镉∙碲化镉 - CdTe∙碘化镉 - CdI2∙氟化镉 - CdF2∙磷化镉 - Cd3P2∙硫化镉 - CdS∙硫酸镉 - 3CdSO4·8H2O∙氯化镉 - CdCl2∙氢氧化镉 - Cd(OH)2∙氰化镉 - Cd(CN)2∙砷化镉 - Cd3As2∙碳酸镉 - CdCO3∙钨酸镉 - CdWO4∙硒化镉 - CdSe∙硝酸镉 - Cd(NO3)2·4H2O∙溴化镉 - CdBr2∙氧化镉 - CdO∙乙酸镉 - Cd(C2H3O2)2铬∙氟化铬(II)，氟化亚铬 - CrF2∙氟化铬(III)，氟化铬 - CrF3∙铬酰氟 - CrO2F2∙铬酰氯，氧化铬氯 - CrO2Cl2∙甲酸铬 - Cr(CHO2)3·6H2O∙磷酸铬(III)，磷酸铬 - CrPO4∙硫酸铬(III)，硫酸铬 - Cr2(SO4)3·18H2O∙硫酸铬(III)钾，硫酸铬钾 - CrK(SO4)2·12H2O ∙硫酸铬(II)，硫酸亚铬 - CrSO4·7H2O∙六羰基铬 - Cr(CO)6∙氯化铬(II)，氯化亚铬 - CrCl2∙氯化铬(III)，氯化铬 - CrCl3∙氢氧化铬(III)，氢氧化铬 - Cr(OH)3∙硝酸铬(III)，硝酸铬 - Cr(NO3)3·9H2O∙溴化铬(II)，溴化亚铬 - CrBr2∙溴化铬(III)，溴化铬 - CrBr3∙氧化铬(III)，三氧化二铬 - Cr2O3∙氧化铬(IV)，二氧化铬 - CrO2∙氧化铬(VI)，三氧化铬 - CrO3∙乙酸铬(II)，乙酸亚铬 - Cr(C2H3O2)2∙乙酸铬(III)，乙酸铬 - Cr(C2H3O2)3汞∙苯甲酸汞(II)，苯甲酸汞 - Hg(C7H5O2)2∙醋酸苯汞，苯醋酸汞 - C8H8HgO2∙碲化汞(II)，碲化汞 - HgTe∙二甲基汞 - CH3HgCH3∙氟化汞(I)，氟化亚汞 - Hg2F2∙氟化汞(II)，氟化汞 - HgF2∙甲基汞 - CH3Hg+∙雷酸汞(II)，雷酸汞，雷汞 - Hg(ONC)2∙硫化汞(II)，硫化汞 - HgS∙硫氰酸汞(II)，硫氰酸汞 - Hg(SCN)2∙硫酸汞(I)，硫酸亚汞 - Hg2SO4∙硫酸汞(II)，硫酸汞 - HgSO4∙氯化汞(I)，氯化亚汞 - Hg2Cl2∙氯化汞(II)，氯化汞 - HgCl2∙纳氏试剂，奈斯勒试剂∙羟基甲基汞，甲基氢氧化汞 - (CH3)HgOH∙氰化汞(II)，氰化汞 - Hg(CN)2∙硒化汞(II)，硒化汞 - HgSe∙硝酸汞(II)，硝酸汞 - Hg(NO3)2∙溴化汞(I)，溴化亚汞 - Hg2Br2∙溴化汞(II)，溴化汞 - HgBr2∙氧化汞(I)，氧化亚汞 - Hg2O∙氧化汞(II)，氧化汞 - HgO∙乙酸汞(II)，乙酸汞 - Hg(C2H3O2)2钴∙草酸钴(II)，草酸钴 - CoC2O4∙碘化钴(II)，碘化钴 - CoI2∙氟化钴(II)，氟化钴 - CoF2∙氟化钴(III)，氟化高钴 - CoF3∙铬酸钴(II)，铬酸钴 - CoCrO4∙钴胺素，维生素B12 - C63H88CoN14O14P∙甲酸钴(II)，甲酸钴 - Co(CHO2)2·2H2O∙磷酸钴(II)，磷酸钴 - Co3(PO4)2·8H2O∙硫化钴(II)，硫化钴 - CoS∙硫氰酸钴(II)，硫氰酸钴 - Co(SCN)2·4H2O ∙硫酸钴(II)，硫酸钴 - CoSO4·7H2O∙氯化钴(II)，氯化钴 - CoCl2∙氢氧化钴(II)，氢氧化钴 - Co(OH)2∙氢氧化钴(III)，氢氧化高钴 - Co(OH)3∙氰化钴(II)，氰化钴 - Co(CN)2∙碳酸钴(II)，碳酸钴 - CoCO3∙硝酸钴(II)，硝酸钴 - Co(NO3)2·6H2O∙溴化钴(II)，溴化钴 - CoBr2∙氧化钴(II)，氧化钴 - CoO∙氧化钴(II，III)，四氧化三钴 - Co3O4∙乙酸钴(III)，乙酸高钴 - Co(C2H3O2)3∙乙酸钴(II)，乙酸钴 - Co(C2H3O2)2·4H2O硅∙二硫化硅 - SiS2∙二氯硅烷 - SiH2Cl2∙二氧化硅 - SiO2∙硅钨酸 - SiO2·12WO3·26H2O ∙四氮化三硅，氮化硅 - Si3N4∙四碘化硅 - SiI4∙四氟化硅 - SiF4∙四氯化硅 - SiCl4∙四溴化硅 - SiBr4∙碳化硅 - SiC∙硅酸 - [SiO x(OH)4-2x]n∙硅烷 - SiH4∙三氯硅烷 - SiHCl3∙一碘硅烷 - SiH3I∙乙硅烷 - Si2H6∙一氯硅烷 - SiH3Cl∙原硅酸 - H4SiO4铪∙四氯化铪，氯化铪 - HfCl4∙二氧化铪，氧化铪 - HfO2钬∙溴化钬 - HoBr3∙氯化钬 - HoCl3镓∙氮化鎵 - GaN∙氟化镓 - GaF3∙磷化镓 - GaP∙氯化镓 - GaCl3∙三甲基镓 - Ga(CH3)3∙三乙基镓 - Ga(C2H5)3∙砷化镓 - GaAs∙锑化镓 - GaSb∙硒化镓 - Ga2Se3钾∙苯酚磺酸钾 - KC6H4(OH)SO3·H2O∙草酸钾 - K2C2O4·H2O∙超氧化钾 - KO2∙重铬酸钾 - K2Cr2O7∙碲(IV)酸钾，亚碲酸钾 - K2TeO3∙碘化钾 - KI∙碘酸钾 - KIO3∙二草酸三氢钾 - KH3(C2O4)2·2H2O∙二磷(V)酸钾，焦磷酸钾 - K4P2O7·3H2O∙二水二草酸氧合钛(IV)酸钾 - K2[TiO(C2O4)2(H2O)2] ∙二氰合银酸钾，氰化银钾 - K[Ag(CN)2]∙钒酸钾 KVO3∙氟化钾 - KF∙氟氢化钾，氟化氢钾 - KHF2∙高碘酸钾 - KIO4∙高氯酸钾 - KClO4∙高锰酸钾 - KMnO4∙铬酸钾 - K2CrO4∙偏硅酸钾 - K2SiO3∙过铼酸钾，高铼酸钾 - KReO4∙过二硫酸钾，过硫酸钾 - K2S2O8∙过氧化钾 - K2O2∙过氧重碳酸钾 - K2C2O6·H2O∙过一硫酸氢钾，过硫酸氢钾 - KHSO5∙甲酸钾 - HCOOK∙焦硫(IV)酸钾，焦亚硫酸钾 - K2S2O5∙焦硫(VI)酸钾，焦硫酸钾 - K2S2O7∙酒石酸钾 - K2C4H4O6·0.5H2O∙酒石酸钠钾 - KNaC4H4O6·4H2O∙酒石酸氢钾 - KHC4H4O6∙邻苯二甲酸氢钾 - KHC8H4O4∙磷酸二氢钾 - KH2PO4∙磷酸钾 - K3PO4∙磷酸氢钾，磷酸氢二钾，磷酸一氢钾 - K2HPO4∙磷酸氧钛钾，磷酸钛氧钾，钛氧磷酸钾 - KTiOPO4∙硫代硫酸钾 - K2S2O3∙硫代碳酸钾 - K2CS3∙硫化钾 - K2S∙硫氢化钾 - KHS∙硫酸钾 - K2SO4∙硫酸氢钾 - KHSO4∙六氟合锆酸钾，氟锆酸钾 - K2[ZrF6]∙六氟合硅酸钾，氟硅酸钾 - K2[SiF6]∙六氯合铂(IV)酸钾，氯铂酸钾 - K2[PtCl6]∙六氰合铁(III)酸钾，铁氰化钾 - K3[Fe(CN)6]∙六氰合铁(II)酸钾，亚铁氰化钾 - K4[Fe(CN)6]·3H2O∙六亚硝酸根合钴(III)酸钾，亚硝酸钴钾 - K3[Co(NO2)6]·1.5H2O∙六亚硝酸根合钴(III)酸钠二钾，亚硝酸钴钠钾 - K2Na[Co(NO2)6]·H2O ∙氯化钾 - KCl∙氯酸钾 - KClO3∙锰酸钾 - K2MnO4∙钼酸钾 - K2MoO4∙檸檬酸鉀 - K3C6H5O7·H2O∙硼氢化钾 - KBH4∙偏硼酸钾 - KBO2∙葡萄糖酸钾 - KC6H11O7∙七碘合铋酸钾 - K4[BiI7]∙氢化钾 - KH∙氢氧化钾 - KOH∙氰化钾 - KCN∙氰酸钾 - KOCN∙三草酸合锑(III)酸钾，草酸锑钾 - K3[Sb(C2O4)3]∙山梨酸钾 - KC6H7O2∙砷酸二氢钾 - KH2AsO4∙砷酸钾 - K3AsO4∙四碘合镉酸钾 - K2[CdI4]·2H2O∙四碘合汞(II)酸钾，碘化汞钾 - K2[HgI4]∙四氟硼酸钾，氟硼酸钾 - KBF4∙四氯合金(III)酸钾，氯金酸钾 - K[AuCl4]∙碳酸钾 - K2CO3∙碳酸氢钾 - KHCO3∙硒氰酸钾 - KSeCN∙锡酸钾 - K2SnO3·3H2O∙硝酸钾 - KNO3∙溴化钾 - KBr∙溴酸钾 - KBrO3∙亚硫酸钾 - K2SO3·2H2O∙亚硝酸钾 - KNO2∙氧化钾 - K2O∙乙基二硫代碳酸钾 - KOCSSC2H5∙乙酸钾 - KC2H3O2∙乙酸双氧铀(VI)酰钾，醋酸铀酰钾 - K(UO2)(C2H3O2)2·H2O∙硬脂酸钾 - KOOCC17H35金∙碘化金(III)，三碘化金 - AuI3∙碘化金(I)，一碘化金 - AuI∙二锑化金 - AuSb2∙氟化金(III)，三氟化金 - AuF3∙氟化金(V)，五氟化金 - AuF5∙氯化金(I，III)，八氯化四金 - Au4Cl8∙氯化金(III)，三氯化金 - AuCl3∙氯化金(I)，一氯化金 - AuCl∙硫代硫酸金(I)钠，硫代硫酸金钠 - AuNa3(S2O3)2·2H2O ∙硫化金(III)，三硫化二金 - Au2S3∙硫化金(I)，一硫化二金，硫化二金 - Au2S∙氰化金(I) - AuCN∙氰化金(III) - Au(CN)3·3H2O∙氢氧化金(III)，氢氧化金 - Au2O3·xH2O∙五碲化三金 - Au3Te5∙锡化金 - AuSn∙硒化金(III)，三硒化二金 - Au2Se3∙溴化金(III)，三溴化金 - AuBr3∙溴化金(I)，一溴化金 - AuBr∙氧化金(III)，三氧化二金 - Au2O3肼∙肼，联氨 - H2N-NH2∙碘化肼 - N2H5I∙高氯酸肼 - N2H5ClO4∙酒石酸肼 - (N2H5)2C4H4O6∙盐酸肼∙氯化肼(1+) - N2H5Cl∙氯化肼(2+) - N2H6Cl2∙硫酸肼 - N2H6SO4∙水合肼 - N2H4·H2O∙四氟肼 - N2F4锎∙氯化锎 - CfCl3∙氟化钪 - ScF3∙硫酸钪 - Sc2(SO4)3·5H2O∙氯化钪 - ScCl3∙三氟甲磺酸钪 - Sc(OSO2CF3)3∙硝酸钪 - Sc(NO3)3∙氧化钪 - Sc2O3氪∙二氟化氪 - KrF2铼∙氟化铼(IV)，四氟化铼 - ReF4∙氟化铼(VI)，六氟化铼 - ReF6∙氟化铼(VII)，七氟化铼 - ReF7∙硫化铼(VII)，七硫化二铼 - Re2S7∙四氯氧化铼(VII)，氯氧化铼 - ReCl4O ∙氧化铼(VI)，三氧化铼 - ReO3∙氧化铼(VII)，七氧化二铼 - Re2O7∙一氯三氧化铼 - ReClO3镧∙氟化镧 - LaF3∙硫酸镧 - La2(SO4)3∙氯化镧 - LaCl3∙碳酸镧 - La2(CO3)3∙硝酸镧 - La(NO3)3·6H2O∙氧化镧 - La2O3铑∙二氯四羰基铑 - Rh2(CO)4Cl2∙氟化铑(III)，三氟化铑 - RhF3∙氯化铑(III)，三氯化铑 - RhCl3∙氧化铑(III)，三氧化二铑 - Rh2O3∙氯化镭 - RaCl2∙溴化镭 - RaBr2锂∙磷化鋰 - Li3P∙磷酸鋰 - Li3PO4∙氨基锂 - LiNH2∙苯基锂 - C6H5Li∙苯甲酸锂 - LiC7H5O2∙氮化锂 - Li3N∙氘化锂-d - Li2H or LiD∙碘化锂 - LiI∙碘酸锂 - LiIO3∙丁基锂 - C4H9Li∙二异丙基氨基锂，LDA - [(CH3)2CH]2NLi ∙氟化锂 - LiF∙高氯酸锂 - LiClO4∙重铬酸锂 - Li2Cr2O7∙铬酸锂 - Li2CrO4∙亞铬酸锂 - Li2CrO2∙过氧化锂 - Li2O2∙硫酸锂 - Li2SO4∙六氟磷酸锂，氟磷酸锂 - LiPF6∙六氟铝酸锂，氟铝酸锂 - Li3[AlF6]∙氯化锂 - LiCl∙柠檬酸锂 - Li3C6H5O7·4H2O∙硼氢化锂 - LiBH4∙偏铝酸锂 - LiAlO2∙偏硼酸锂 - LiBO2∙氢化锂 - LiH∙氢化铝锂 - LiAlH4∙氢氧化锂 - LiOH∙叔丁基锂 - (CH3)3CLi∙四硼酸锂 - Li2B4O7∙碳酸锂 - Li2CO3∙硝酸锂 - LiNO3∙溴化锂 - LiBr∙溴酸锂 - LiBrO3∙亚硫酸锂 - Li2SO3∙氧化锂 - Li2O∙乙酸锂 - LiC2H3O2·2H2O∙正丁基锂 - n-C4H9Li∙仲丁基锂 - Sec-C4H9Li钌∙氟化钌(V)，五氟化钌 - RuF5∙氯化钌(III)，三氯化钌 - RuCl3∙氧化钌(IV)，二氧化钌 - RuO2∙氧化钌(VIII)，四氧化钌 - RuO4磷∙苯基膦 - C6H5PH2∙碘化鏻 - PH4I∙膦，磷化氢 - PH3∙磷酰二氯一氟 - POCl2F∙磷酰氯，三氯氧磷 - POCl3∙磷酰溴，三溴氧磷 - POBr3∙磷酰一氯二氟 - POClF2∙硫代磷酰氯 - PSCl3∙六氧化四磷，三氧化二磷 - P4O6∙三碘化磷 - PI3∙三氟化磷 - PF3∙三氟硫化磷 - PSF3∙三硫化四磷 - P4S3∙三氯化磷 - PCl3∙三氯硫化磷 - PSCl3∙三硒化四磷 - P4Se3∙三溴化磷 - PBr3∙三溴硫化磷 - PSBr3∙十氧化四磷，五氧化二磷 - P4O10∙五氟化磷 - PF5∙五硫化二磷 - P2S5∙五氯化磷 - PCl5∙五溴化磷 - PBr5硫∙二氯化二硫 - S2Cl2∙二氯化硫 - SCl2∙二氧化硫 - SO2∙磺酰胺，硫酰胺 - SO2(NH2)2∙磺酰氟，硫酰氟 - SO2F2∙磺酰氯，硫酰氯 - SO2Cl2∙硫代亚磺酰氟，二氟化二硫 - S2F2∙六氟化硫 - SF6∙三氟甲磺酸 - CF3SO3H∙三氧化硫 - SO3∙十氟化二硫 - S2F10∙四氮化四硫 - N4S4∙四氟化硫 - SF4∙亚硫酰氟 - SOF2∙亚硫酰氯，氯化亚砜 - SOCl2∙亚硫酰溴 - SOBr2镥∙硫酸镥 - Lu2(SO4)3·8H2O∙氯化镥 - LuCl3铝∙苯氧基铝 - Al(C6H5O)3∙丙醇铝 - Al(C3H7O)3∙次磷酸铝 - Al(H2PO2)3∙氮化铝 - AlN∙單硬脂酸鋁 - Al(OH)2C18H35O2∙碘化铝 - AlI3∙氟化铝 - AlF3∙高氯酸铝 - Al(ClO4)3·6H2O∙甲醇铝 - Al(CH3O)3∙磷化铝 - AlP∙磷酸铝 - AlPO4∙硫化铝 - Al2S3∙硫酸铝 - Al2(SO4)3·18H2O∙硫酸铝铵 - AlNH4(SO4)2·12H2O∙硫酸铝钾 - AlK(SO4)2·12H2O∙硫酸铝钠 - AlNa(SO4)2·12H2O∙氯化铝 - AlCl3∙氯酸铝 - Al(ClO3)3∙硼氢化铝 - Al(BH4)3∙硼酸铝(2/1)，硼酸铝 - 2Al2O3·B2O3∙氢氧化铝 - Al(OH)3∙三乙基铝 - (C2H5)3Al∙三(乙酰丙酮合)铝 - Al(C5H7O2)3∙砷化铝 - AlAs∙叔丁醇铝 - Al(C4H9O)3∙双(乙酰水杨酸)铝 - Al(OOCC6H4OCOCH3)2OH ∙碳化铝(4/3)，碳化铝 - Al4C3∙锑化铝 - AlSb∙硒化铝 - Al2Se3∙硝酸铝 - Al(NO3)3·9H2O，Al(NO3)3∙溴化铝 - AlBr3∙氧化硅铝(1/1) - Al2O3·SiO2∙氧化铝，三氧化二铝 - Al2O3∙乙醇铝 - Al(C2H5O)3∙异丙醇铝 - Al(C3H7O)3∙硬脂酸铝 - Al(C18H35O2)3∙仲丁醇铝 - Al(C4H9O)3氯∙二氧化氯 - ClO2∙一氟化氯 - ClF∙高氯酸氟，过氯酰氟 - FOClO3∙七氧化二氯 - Cl2O7∙三氟化氯 - ClF3∙三氧化氯 - (ClO3)2∙五氟化氯 - ClF5∙一氧化二氯 - Cl2O镁∙氨基镁 - Mg(NH2)2∙氮化镁 - Mg3N2∙碘化镁 - MgI2∙二铝酸(2-)镁 - MgAl2O4∙氟化镁 - MgF2∙高氯酸镁 - Mg(ClO4)2∙高锰酸镁 - Mg(MnO4)2∙硅化镁 - Mg2Si∙硅酸镁 - Mg2SiO4∙过硼酸镁 - Mg(BO3)2·7H2O∙过氧化镁 - MgO2∙磷酸氢镁 - MgHPO4·3H2O∙磷酸镁 - Mg3(PO4)2·5H2O∙六氟硅酸镁，氟硅酸镁 - Mg[SiF6]·6H2O∙硫酸镁 - MgSO4·7H2O∙氯化镁 - MgCl2∙偏硼酸镁 - Mg(BO2)2·8H2O∙偏硅酸镁 - MgSiO3∙偏桃酸镁 - MgC16H14O6∙氢化镁 - MgH2∙氢氧化镁 - Mg(OH)2∙乳酸镁 - MgC6H10O6·3H2O∙碳酸镁 - MgCO3∙钨酸镁 - MgWO4∙锡化镁 - Mg2Sn∙硝酸镁 - Mg(NO3)2·6H2O∙溴化镁 - MgBr2∙亚硫酸镁 - MgSO3·6H2O∙氧化镁 - MgO∙乙酸镁 - Mg(C2H3O2)2∙油酸镁 - Mg(C18H33O2)2∙锗化镁 - Mg2Ge锰∙次磷酸锰 - Mn(PH2O2)2·H2O∙碘化锰 - MnI2∙氟化锰(II)，氟化锰 - MnF2∙氟化锰(III)，三氟化锰 - MnF3∙氟化锰(IV)，四氟化锰 - MnF4∙甲基环戊二烯三羰基锰，MMT - (CH3C5H4)Mn(CO)3∙焦磷酸锰 - Mn2P2O7∙磷酸锰 - Mn3(PO4)2∙硫化锰 - MnS∙硫酸锰 - MnSO4·7H2O∙氯化锰(II)，氯化锰 - MnCl2∙氯化锰(III)，三氯化锰 - MnCl3∙偏硅酸锰 - MnSiO3∙氢氧化锰 - Mn(OH)2∙十羰基二锰 - Mn2(CO)10∙钛酸锰 - Mn2TiO4∙碳化三锰，碳化锰 - Mn3C∙碳酸锰 - MnCO3∙硝酸锰 - Mn(NO3)2·6H2O∙溴化锰 - MnBr2∙氧化锰(II)，一氧化锰 - MnO∙氧化锰(II，IV)，四氧化三锰 - Mn3O4∙氧化锰(III)，三氧化二锰 - Mn2O3∙氧化锰(IV)，二氧化锰 - MnO2∙氧化锰(VII)，七氧化二锰 - Mn2O7∙乙酸锰 - Mn(C2H3O2)2·4H2O钼∙氟化钼(VI)，六氟化钼 - MoF6∙磷钼酸 - H3PO4·12MoO3·30H20∙硫化钼(III)，三硫化二钼 - Mo2S3∙硫化钼(IV)，二硫化钼 - MoS2∙六羰基钼 - Mo(CO)6∙氯化钼(IV)，四氯化钼 - MoCl4∙氯化钼(V)，五氯化钼 - MoCl5∙钼铬橙，钼铬红∙溴化钼(III)，三溴化钼 - MoBr3∙氧化钼(IV)，二氧化钼 - MoO2∙氧化钼(VI)，三氧化钼 - MoO3镎∙氧化镎(IV)，二氧化镎 - NpO2钠∙氨基钠 - NaNH2∙苯甲酸钠 - NaO2C7H5∙铋酸钠 - NaBiO3∙铋化钠 - Na3Bi∙丙酸钠 - NaOOCC2H5∙草酸钠 - Na2C2O4∙超氧化钠 - NaO2∙重铬酸钠 - Na2Cr2O7·2H2O∙次磷酸钠 - NaPH2O2·H2O∙次氯酸钠 - NaClO·5H2O∙单氟磷酸钠(MFP)- Na2PFO3∙氮化钠 - NaN3∙碘化钠 - NaI∙碘酸钠 - NaIO3∙二甲基胂酸钠，卡可酸钠 - NaO2As(CH3)2∙二磷酸二氢钠，焦磷酸二氢钠 - Na2H2P2O7∙二乙二硫代氨基甲酸钠 - NaS2CN(C2H5)2·3H2O∙二铀酸钠，重铀酸钠 - Na2U2O7∙钒酸钠 - NaVO3∙氟化氢钠 - NaHF2∙氟化钠 - NaF∙甘油磷酸钠 - Na2C3H5(OH)2PO4∙高碘酸钠 - NaIO4∙高铼酸钠 - NaReO4∙高氯酸钠 - NaClO4∙铬酸钠 - Na2CrO4∙硅酸钠 - Na4SiO4∙过硫酸钠，过二硫酸钠 - Na2S2O8∙过硼酸钠 - NaBO3·4H2O∙过碳酸钠 - 2Na2CO3·3H2O2∙过氧化钠 - Na2O2∙甲醇钠 - NaOCH3∙甲酸钠 - NaHCO2∙焦磷酸钠 - Na4P2O7∙酒石酸钠 - Na2C4H4O6·2H2O∙抗坏血酸钠 - NaC6H7O6∙连二硫(V)酸钠，连二硫酸钠 - Na2S2O6·2H2O∙连二硫(III)酸钠，连二亚硫酸钠 - Na2S2O4∙磷酸二氢钠 - NaH2PO4·2H2O∙磷酸钠 - Na3PO4·12H2O∙磷酸氢二钠，磷酸氢钠，磷酸一氢钠 - Na2HPO4·7H2O ∙磷酸氢钠铵，磷酸氢铵钠 - NaNH4HPO4·4H2O∙硫代硫酸钠 - Na2S2O3·5H2O∙硫化钠 - Na2S·9H2O∙硫氢化钠 - NaHS∙硫氰酸钠 - NaSCN∙硫酸钠 - Na2SO4·10H2O∙硫酸氢钠 - NaHSO4∙六氟铝酸钠，氟铝酸钠 - Na3[AlF6]∙六氯合铂(IV)酸钠，六氯铂酸钠 - Na2[PtCl6]·6H2O∙六氰合铁(III)酸钠，铁氰化钠 - Na3[Fe(CN)6]·H2O∙六氰合铁(II)酸钠，亚铁氰化钠 - Na4[Fe(CN)6]·10H2O ∙六亚硝根合钴(III)酸钠，亚硝酸钴钠 - Na3[Co(NO2)6] ∙氯酸钠 - NaClO3∙氯化钠 - NaCl∙钼酸钠 - Na2MoO4·2H2O∙柠檬酸钠 - Na3C6H5O7·2H2O∙硼氢化钠 - NaBH4∙偏硅酸钠 - Na2SiO3·5H2O∙偏铝酸钠 - NaAlO2∙偏亚砷酸钠 - NaAsO2∙葡萄糖酸钠 - NaC6H11O7∙羟甲基磺酸钠 - Na[HOCH2SO2]·2H2O∙氢化钠 - NaH∙氢氧化钠 - NaOH∙氰化钠 - NaCN∙氰基硼氢化钠 - Na[BH3CN]∙氰酸钠 - NaOCN∙乳酸钠 - NaOOCCHOHCH3∙三聚磷酸钠，偏磷酸钠 - (NaPO3)3·6H2O∙砷酸二氢钠 - NaH2AsO4·H2O∙砷(V)酸氢钠，砷酸一氢钠 - Na2HAsO4·7H2O∙十二烷基苯磺酸钠 - NaO3SC6H4C12H25∙十二烷基硫酸钠 - NaO3SOC12H25∙水杨酸钠 - NaOOCC6H4OH∙四氟磺酸钠，氟硼酸钠 - Na[BF4]∙四氯合铝酸钠，氯铝酸钠 - Na[AlCl4]∙四硼酸钠 - Na2B4O7·10H2O∙碳酸钠 - Na2CO3·10H2O∙碳酸钠-碳酸氢钠-水(1/1/2) - Na2CO3·NaHCO3·2H2O∙碳酸氢钠 - NaHCO3∙钨酸钠 - Na2WO4·2H2O∙硒酸钠 - Na2SeO4∙锡(IV)酸钠，锡酸钠 - Na2SnO3·3H2O∙硝酸钠 - NaNO3∙溴化钠 - NaBr∙溴酸钠 - NaBrO3∙亚碲酸钠 - Na2TeO3∙亚氯酸钠 - NaClO2∙亚硫酸钠 - Na2SO3∙亚硫酸氢钠 - NaHSO3∙亚硝基五氰合铁(III)酸钠 - Na2[Fe(CN)5NO]·2H2O∙亚硝酸钠 - NaNO2∙氧化钠 - Na2O∙乙醇钠 - NaOC2H5∙乙二胺四乙酸钠，EDTA四钠 - (NaOOCCH2)2NC2H4N(CH2COONa)2∙乙基磺酸钠 - NaO3SOC2H5∙乙酸钠 - NaC2H3O2·3H2O∙硬脂酸钠 - NaOOCC17H35铌∙氟化铌(V)，五氟化铌 - NbF5∙氯化铌(V)，五氯化铌 - NbCl5∙氧化铌(V)，五氧化二铌 - Nb2O5镍∙苯甲酸镍 - Ni(C7H5O2)2∙丁二酮肟镍 - Ni(HC2H6N2O2)2∙二硫化三镍 - Ni3S2∙二茂镍 - (C5H5)2Ni∙氟化镍 - NiF2∙甲酸镍 - Ni(CHO2)2·2H2O∙硫化镍 - NiS∙硫酸镍 - NiSO4·6H2O∙氯化镍 - NiCl2·6H2O∙氰化镍 - Ni(CN)2·4H2O∙氢氧化镍 - Ni(OH)2∙四羰基镍 - Ni(CO)4∙碳酸镍 - NiCO3∙碳酸镍-氢氧化镍(1/2) - NiCO3·2Ni(OH)2∙硝酸镍 - Ni(NO3)2·6H2O∙溴化镍 - NiBr2∙氧化镍(II)，氧化镍 - NiO∙氧化镍(III)，三氧化二镍 - Ni2O3∙乙酸镍 - Ni(C2H3O2)2钕∙硫酸钕 - Nd2(SO4)3·8H2O∙氯化钕，三氯化钕 - NdCl3∙氧化钕 - Nd2O3硼∙氮化硼 - BN∙三氟化硼，氟化硼 - BF3∙三氯化硼，氯化硼 - BCl3∙三(五氟苯基)硼 - (C6F5)3B∙三溴化硼，溴化硼 - BBr3∙碳化硼 - B4C∙氧化硼，三氧化二硼 - B2O3∙一甲醇合三氟化硼 - BF3·HOCH3∙一乙醚合三氟化硼 - BF3·O(C2H5)2硼烷∙丁硼烷(10) - B4H10∙环硼氮烷 - B3H6N3∙己硼烷(10) - B6H10∙癸硼烷(14) - B10H14∙戊硼烷(9) - B5H9∙戊硼烷(11) - B5H11∙乙硼烷(6) - B2H6铍∙氮化铍 - Be3N2∙碘化铍 - BeI2∙氟化铍 - BeF2∙硅酸铍 - Be2SiO4∙硫酸铍 - BeSO4·4H2O∙硫化铍 - BeS∙氯化铍 - BeCl2∙氢化铍 - BeH2∙氢氧化铍 - Be(OH)2∙碳化铍 - Be2C∙硒酸铍 - BeSeO4·4H2O∙硝酸铍 - Be(NO3)2·3H2O∙溴化铍 - BeBr2∙氧化铍 - BeO钋∙氯化钋(IV)，四氯化钋 - PoCl4∙氧化钋(IV)，二氧化钋 - PoO2钷-147∙氯化钷 - PmCl3∙溴化钷 - PmBr3镤∙氯化镤(IV)，四氯化镤 - PaCl4∙氯化镤(V)，五氯化镤 - PaCl5镨∙氯化镨 - PrCl3∙氧化镨(III) - Pr2O3∙氧化镨(IV) - PrO2铅∙草酸铅(II)，草酸铅 - PbC2O4∙碲化铅(II)，碲化铅 - PbTe∙碘化铅(II)，碘化铅 - PbI2∙叠氮化铅(II)，叠氮化铅 - Pb(N3)2∙二溴化铅(II)，溴化铅 - PbBr2∙氟化铅(II)，氟化铅 - PbF2∙氟化铅(IV)，氟化高铅 - PbF4∙氟氯化铅(II)，氟氯化铅 - PbClF∙锆钛酸铅 - Pb[Ti x Zr y O3] (x = 0.52)∙铬酸铅(II)，铬酸铅 - PbCrO4∙硅酸铅(II)，硅酸铅 - Pb2SiO4∙甲酸铅(II)，甲酸铅 - Pb(CHO2)2∙磷酸铅(II)，磷酸铅 - Pb3(PO4)2∙硫化铅(II)，硫化铅 - PbS∙硫氰酸铅(II)，硫氰酸铅 - Pb(SCN)2∙硫酸铅(II)，硫酸铅 - PbSO4∙氯化铅(II)，氯化铅 - PbCl2∙氯酸铅(II)，氯酸铅 - Pb(ClO3)2∙钼酸铅(II)，钼酸铅 - PbMoO3∙偏硅酸铅(II)，偏硅酸铅 - PbSiO3∙偏硼酸铅(II)，偏硼酸铅 - Pb(BO2)2·H2O∙氢氧化铅(II)，氢氧化铅 - Pb(OH)2∙砷酸氢铅(II)，砷酸氢铅 - PbHAsO4∙四甲基铅 - Pb(CH3)4∙四乙基铅 - Pb(C2H5)4∙碳酸铅(II)，碳酸铅 - PbCO3∙硒化铅(II)，硒化铅 - PbSe∙硝酸铅(II)，硝酸铅 - Pb(NO3)2∙氧化铅(II)，氧化铅 - PbO∙氧化铅(II，IV)，四氧化三铅 - Pb3O4∙氧化铅(IV)，二氧化铅 - PbO2∙乙酸铅(IV)，乙酸高铅，四乙酸铅 - Pb(C2H3O2)4∙乙酸铅(II)，乙酸铅 - Pb(C2H3O2)2·3H2O∙硬脂酸铅(II)，硬脂酸铅 - Pb(C18H35O2)2∙油酸铅(II)，油酸铅 - Pb(C18H33O2)2氢∙氨基磺酸 - H2NSO3H∙次磷酸 - H3PO2∙次氯酸 - HClO∙氘化氢 - 1H2H or HD∙碲酸 - H6TeO6∙碲化氢 - H2Te∙碘化氢，氢碘酸 - HI∙碘酸 - HIO3∙叠氮化氢，叠氮酸 - HN3∙二磷(IV)酸 - (HO)2OP-PO(OH)2∙发烟硫酸 - H2SO4·xSO3∙氟磷酸 - H2PO3F∙氟磺酸，氟代硫酸 - HOSO2F∙氟硅酸 - H2[SiF6]·2H2O∙氟化氢，氢氟酸 - HF∙高碘酸 - H5IO6∙高氯酸 - HClO4·2H2O∙铬酸 - H2CrO4∙过二硫酸 - HO3S-O-O-SO3H∙过一硫酸 - H2SO5∙过氧化氢，双氧水 - H2O2∙焦磷酸 - H4P2O7∙磷酸 - H3PO4∙硫化氢，氢硫酸 - H2S∙硫酸 - H2SO4∙硫酸羟胺 - (HONH3)2SO4∙氯代亚硫酸，氯磺酸 - HSO3Cl∙氯化羟胺，盐酸羟胺 - HONH3Cl∙氯化氢，盐酸 - HCl∙氯金酸 - HAuCl4∙氯酸 - HClO3∙钼酸 - H2MoO4·2H2O∙硼酸 - H3BO3∙偏硼酸 - HBO2∙偏高碘酸 - HIO4∙偏磷酸 - HPO3∙羟胺 - HONH2∙氰化氢，氢氰酸 - HCN∙氰酸 - HOCN∙三硫代碳酸 - (HS)2CS∙三氧化二氢 - H2O3∙水 - H2O∙四氟硼酸，氟硼酸 - HBF4∙钨酸 - H2WO4∙硒化氢 - H2Se∙硒酸 - H2SeO4∙硝酸 - HNO3∙溴化氢，氢溴酸 - HBr∙溴磺酸 - HOSO2Br∙亚碲酸 - H2TeO3∙亚磷酸，膦酸 - H3PO3∙亚硫酸 - H2SO3∙亚硒酸 - H2SeO3氰∙氰 - NC-CN∙叠氮化氰 - NC-N3∙氟化氰 - NCF∙氯化氰 - NCCl∙氰尿酰氯，三聚氰氯 - C3N3Cl3∙溴化氰 - NCBr[编辑]铷∙碲化铷 - Rb2Te∙碘化铷 - RbI∙氟化铷 - RbF∙磷酸二氢铷 - RbH2PO4∙六氯合铂(IV)酸铷，六氯铂酸铷 - Rb2[PtCl6] ∙硫酸铷 - Rb2SO4∙氯化铷 - RbCl∙氯酸铷 - RbClO3∙檸檬酸銣 - Rb3C6H5O7∙氢氧化铷 - RbOH∙碳酸铷 - Rb2CO3∙硝酸铷 - RbNO3∙溴化铷 - RbBr∙氧化铷 - Rb2O∙乙酸铷 - RbC2H3O2铯∙碘化铯 - CsI∙碘酸铯 - CsIO3∙氟化铯 - CsF∙高氯酸铯 - CsClO4∙铬酸铯 - Cs2CrO4∙硫酸铯 - Cs2SO4∙氯化铯 - CsCl∙檸檬酸銫 - Cs3C6H5O7∙氢氧化铯 - CsOH∙碳酸氢铯 - CsHCO3∙碳酸铯 - Cs2CO3∙硒酸铯 - Cs2SeO4∙硝酸铯 - CsNO3∙溴化铯 - CsBr∙氧化铯 - Cs2O钐∙碘化钐(II)，二碘化钐 - SmI2∙氟化钐(III)，氟化钐 - SmF3∙硫酸钐(III)，硫酸钐 - Sm2(SO4)3·8H2O ∙氯化钐(II) - SmCl2∙氯化钐(III)，氯化钐 - SmCl3∙氧化钐(III)，氧化钐 - Sm2O3砷∙苯砷氧，氧化苯砷 - C6H5AsO∙碘化砷(III)，三碘化砷 - AsI3∙二甲胂酸 - (CH3)2AsO2H∙二硫化二砷，四硫化四砷 - As2S2∙氟化砷(III)，三氟化砷 - AsF3∙氟化砷(V)，五氟化砷 - AsF5∙硫化砷(III)，三硫化二砷 - As2S3∙硫化砷(V)，五硫化二砷 - As2S5∙氯化砷(III)，三氯化砷 - AsCl3∙氢化砷(III)，氢化砷，胂 - AsH3∙碲化砷(III)，三碲化二砷 - As2Te3∙硒化砷(III)，三硒化二砷 - As2Se3∙溴化砷(III)，三溴化砷 - AsBr3∙氧化砷(III)，三氧化二砷 - As2O3∙氧化砷(V)，五氧化二砷 - As2O5铈∙碘化铈(III)，碘化铈 - CeI3∙氟化铈(III)，氟化铈 - CeF3∙氟化铈(IV)，氟化高铈 - CeF4∙硫酸铈(III)，硫酸铈 - Ce2(SO4)3∙硫酸铈(IV)，硫酸高铈 - Ce(SO4)2∙氯化铈(III)，氯化铈 - CeCl3∙硝酸铈(III)，硝酸铈 - Ce(NO3)3·3H2O ∙溴化铈(III)，溴化铈 - CeBr3∙氧化铈(IV)，二氧化铈，氧化高铈 - CeO2锶∙碘化锶 - SrI2∙碘酸锶 - Sr(IO3)2∙氟化锶 - SrF2∙高氯酸锶 - Sr(ClO4)2∙铬酸锶 - SrCrO4∙过氧化锶 - SrO2∙磷酸氢锶 - SrHPO4∙硫化锶 - SrS∙硫酸锶 - SrSO4∙氯化锶 - SrCl2∙氯酸锶 - Sr(ClO3)2∙氢氧化锶 - Sr(OH)2∙乳酸锶 - Sr(OOCCHOHCH3)2·3H2O∙钛酸锶 - SrTiO3∙碳酸锶 - SrCO3∙硝酸锶 - Sr(NO3)2∙溴化锶 - SrBr2∙氧化锶 - SrO铊∙碘化铊(I)，碘化亚铊 - TlI∙氟化铊(I)，氟化亚铊 - TlF∙氟化铊(III)，氟化铊 - TlF3∙硫化铊(I)，硫化亚铊 - Tl2S∙硫酸铊(I)，硫酸亚铊 - Tl2SO4∙硫酸铊(III)，硫酸铊 - Tl2(SO4)3∙氯化铊(I)，氯化亚铊 - TlCl∙氰化铊(I)，氰化亚铊 - TlCN∙硒化铊(I)，硒化亚铊 - Tl2Se∙硒酸铊(I)，硒酸亚铊 - Tl2SeO4∙碳酸铊(I)，碳酸亚铊 - Tl2CO3∙硝酸铊(I)，硝酸亚铊 - TlNO3∙溴化铊(I)，溴化亚铊 - TlBr∙氧化铊(I)，氧化亚铊 - Tl2O∙氧化铊(III)，三氧化二铊 - Tl2O3∙乙醇铊(I)，乙醇亚铊 - TlOC2H5钛∙Petasis试剂 - (C5H5)2Ti(CH3)2∙氮化钛 - TiN∙碘化钛(IV)，四碘化钛 - TiI4∙二氯二茂钛 - (C5H5)2TiCl2∙二氢化钛 - TiH2∙氟化钛(IV)，四氟化钛 - TiF4∙硫酸钛(III) - Ti2(SO4)3∙硫酸氧钛 - TiOSO4∙氯化钛(II)，二氯化钛 - TiCl2∙氯化钛(III)，三氯化钛 - TiCl3∙氯化钛(IV)，四氯化钛 - TiCl4∙硼化钛 - TiB2∙碳化钛 - TiC∙氧化钛(II)，一氧化钛 - TiO∙氧化钛(III)，三氧化二钛 - Ti2O3∙氧化钛(IV)，二氧化钛 - TiO2∙溴化钛(III)，三溴化钛 - TiBr3∙溴化钛(IV)，四溴化钛 - TiBr4∙异丙醇钛(IV)，异丙醇钛 - Ti[OCH(CH3)2]4钽∙氮化钽 - TaN∙碘化钽(V)，五碘化钽 - TaI5∙二硼化钽 - TaB2∙氟化钽(V)，五氟化钽 - TaF5∙氯化钽(V)，五氯化钽 - TaCl5∙碳化钽 - TaC∙碳化二钽 - Ta2C∙溴化钽(V)，五溴化钽 - TaBr5∙氧化钽(V)，五氧化二钽， - Ta2O5碳∙二硫化碳 - CS2∙二硒化碳 - CSe2∙二氧化三碳 - C3O2∙二氧化碳 - CO2∙硫代碳酰氯 - CSCl2∙硫氰 - (SCN)2∙四碘化碳 - CI4∙四氟化碳 - CF4∙四氯化碳 - CCl4∙四溴化碳 - CBr4∙碳酸 - H2CO3∙碳酰氟 - COF2∙碳酰氯 - COCl2∙碳酰溴 - COBr2∙氧硫化碳，硫化羰 - COS∙一氧化碳 - CO铽∙氯化铽 - TbCl3∙硝酸铽 - Tb(NO3)3·6H2O锑∙碲化锑(III)，三碲化二锑 - Sb2Te3∙碘化锑(III)，三碘化锑 - SbI3∙氟化锑(III)，三氟化锑 - SbF3∙氟化锑(V)，五氟化锑 - SbF5∙硫化锑(III)，三硫化二锑 - Sb2S3∙硫化锑(V)，五硫化二锑 - Sb2S5∙硫酸锑(III)，硫酸锑 - Sb2(SO4)3∙氯化锑(III)，三氯化锑 - SbCl3∙氯化锑(V)，五氯化锑 - SbCl5∙氢化锑(III)，锑化氢 - SbH3∙三苯基锑 - (C6H5)3Sb∙三甲基锑 - Sb(CH3)3∙三乙基锑 - Sb(C2H5)3∙砷化锑 - SbAs∙硒化锑(III)，三硒化二锑 - Sb2Se3∙溴化锑(III)，三溴化锑 - SbBr3∙氧化锑(III)，三氧化二锑 - Sb2O3∙氧化锑(V)，五氧化二锑 - Sb2O5∙乙酸锑(III)，乙酸锑 - (CH3COO)3Sb铁∙苯甲酰基二羰基(η5-2,4-环戊二烯-1-基)铁 - C14H10Fe2O4∙草酸铁(II)，草酸亚铁 - FeC2O4·2H2O∙氮化二铁 - Fe2N∙碘化铁(II)，碘化亚铁 - FeI2∙二硫化铁，二硫化亚铁 - FeS2∙二茂铁 - (C5H5)2Fe∙氟化铁(II)，氟化亚铁 - FeF2∙氟化铁(III)，氟化铁 - FeF3∙硅酸亚铁 - Fe2SiO4∙磷化二铁 - Fe2P∙硫化铁(II)，硫化亚铁 - FeS∙硫化铁(III)，硫化铁 - Fe2S3∙硫氰酸铁(III)，硫氰酸铁 - Fe(SCN)3∙硫酸铁(III)，硫酸铁 - Fe2(SO4)3∙硫酸铁(II)，硫酸亚铁 - FeSO4·7H2O∙六氰合铁(II)酸铁(III)，亚铁氰化铁，普鲁士蓝，滕氏蓝 - Fe4[Fe(CN)6]3∙氯化铁(II)，氯化亚铁 - FeCl2∙氯化铁(III)，氯化铁 - FeCl3·6H2O∙磷酸铁(II)，磷酸亚铁 - Fe3(PO4)2·8H2O∙偏硅酸亚铁 - FeSiO3∙氢氧化铁(II)，氢氧化亚铁 - Fe(OH)2∙氢氧化氧铁(III) - FeO(OH)∙砷酸铁(III)，砷酸铁 - FeAsO4·2H2O∙水合氧化铁(III)，水合氧化铁，氢氧化铁 - Fe(OH)3∙碳化三铁 - Fe3C∙碳酸铁(II)，碳酸亚铁 - FeCO3∙铁硫簇∙五羰基铁 - Fe(CO)5∙硒化铁(II)，硒化亚铁 - FeSe∙硝酸铁(III)，硝酸铁 - Fe(NO3)3·9H2O∙溴化铁(II)，溴化亚铁 - FeBr2∙溴化铁(III)，溴化铁 - FeBr3∙氧化铁(II)，氧化亚铁 - FeO。
R-REC-BT.2020-2-201510-I!!PDF-E
Keywords UHDTV, image system parameters, wide field of view, television system, international programme exchange The ITU Radiocommunication Assembly, considering a) that digital terrestrial television broadcasting (DTTB) service has been introduced by some administrations since 1997 and can provide high quality television programmes through HDTV systems; b) that viewers expect future TV systems beyond HDTV to provide improved characteristics compared with the current HDTV systems in terms of a more realistic sensation, greater transparency to the real world, and more accurate visual information; c) that ultra-high definition television (UHDTV) is expected to become available in the near future with, inter alia, larger screens, higher spatial/temporal resolution, wider colour gamut, wider dynamic range, etc. taking into account developments of display technology; d) that ITU-R has been studying extremely high-resolution imagery (EHRI) and an expanded hierarchy of large screen digital imagery (LSDI) image formats and has established ITU-R Recommendations: Recommendation ITU-R BT.1201-1 providing the guidelines of image characteristics for extremely high-resolution imagery, and Recommendation ITU-R BT.1769 offering the parameter values for an expanded hierarchy of LSDI image formats; e) that LSDI is a system providing a display on a very large screen, typically for public viewing. This can be used in a wide variety of applications including programme presentations such as dramas, plays, sporting events, concerts, etc.; f) that EHRI is a system offering higher resolution than HDTV and can be used for both broadcasting and non-broadcasting applications (e.g. computer graphics, printing and medical applications); g) that UHDTV provides viewers with an enhanced visual experience primarily by a wider field of view that covers a considerable part of the human natural visual field with appropriate screen sizes relevant to usage at home and in public places; h) that signal formats contributing to increasing the compression efficiency are desirable for UHDTV systems since they have a larger number of pixels than HDTV systems,
SC-49920中文资料
SANTA CRUZ BIOTECHNOLOGY, INC.The Power to QuestionCHMP5 (Y-19): sc-49920Santa Cruz Biotechnology, Inc. 1.800.457.3801 831.457.3800 fax 831.457.3801 Europe +00800 4573 8000 49 6221 4503 0 BACKGROUNDThe charged multivesicular body proteins, commonly designated CHMPs,belong to the vacuolar sorting protein family and function as chromatin-modifying proteins. CHMP1-6 are all components of ESCRT (endosomal sorting complex required for transport) I, II or III complexes. These complexes are crucial for sorting endosomal articles into multivesicular bodies (MVBs)and are required for the formation of these bodies. During HIV-1 infection,the virus uses the ESCRT-III complex to mediate budding and exocytosis of viral proteins. CHMP5 interacts directly with LIP5, a protein required for HIV release. Depletion of LIP5 will reduce HIV-1 budding, whereas a depletion of CHMP5 will increase HIV-1 release. Subsequently, overexpression of CHMP5 will reduce HIV-1 budding. CHMP5 also regulates late endosomal development downstream of MVB formation and a loss of CHMP5 will result in increased signal transduction due to a decrease in lysosomal degradation function.REFERENCES1. von Schwedler, U.K., Stuchell, M., Müller, B., Ward, D.M., Chung, H.Y.,Morita, E., Wang, H.E., Davis, T., He, G.P ., Cimbora, D.M., Scott, A.,Kräusslich, H.G., Kaplan, J., Morham, S.G. and Sundquist, W.I. 2003. The protein network of HIV budding. Cell 114: 701-713.2. Ward, D.M., Vaughn, M.B., Shiflett, S.L., White, P .L., Pollock, A.L., Hill, J.,Schnegelberger, R., Sundquist, W.I. and Kaplan, J. 2005. The role of LIP5and CHMP5 in multivesicular body formation and HIV-1 budding in mam-malian cells. J. Biol. Chem. 280: 10548-10555.3. Shim, J.H., Xiao, C., Hayden, M.S., Lee, K.Y., Trombetta, E.S., Pypaert,M.,Nara, A., Yoshimori, T., Wilm, B., Erdjument-Bromage, H., Tempst, P .,Hogan, B.L., Mellman, I. and Ghosh, S. 2006. CHMP5 is essential for late endosome function and downregulation of receptor signaling during mouse embryogenesis. J. Cell Biol. 172: 1045-1056.CHROMOSOMAL LOCATIONGenetic locus: CHMP5 (human) mapping to 9p13.3; Chmp5 (mouse) mapping to 4 A5.SOURCECHMP5 (Y-19) is an affinity purified goat polyclonal antibody raised against a peptide mapping near the N-terminus of CHMP5 of human origin.PRODUCTEach vial contains 200 µg IgG in 1.0 ml of PBS with < 0.1% sodium azide and 0.1% gelatin.Blocking peptide available for competition studies, sc-49920 P , (100 µg peptide in 0.5 ml PBS containing < 0.1% sodium azide and 0.2% BSA).STORAGEStore at 4° C, **DO NOT FREEZE**. Stable for one year from the date of shipment. Non-hazardous. No MSDS required.APPLICATIONSCHMP5 (Y-19) is recommended for detection of CHMP5 of mouse, rat and human origin by Western Blotting (starting dilution 1:200, dilution range 1:100-1:1000), immunoprecipitation [1-2 µg per 100-500 µg of total protein (1 ml of cell lysate)], immunofluorescence (starting dilution 1:50, dilution range 1:50-1:500) and solid phase ELISA (starting dilution 1:30, dilution range 1:30-1:3000).Suitable for use as control antibody for CHMP5 siRNA (h): sc-60374,CHMP5 siRNA (m): sc-60375, CHMP5 shRNA Plasmid (h): sc-60374-SH,CHMP5 shRNA Plasmid (m): sc-60375-SH, CHMP5 shRNA (h) Lentiviral Particles: sc-60374-V and CHMP5 shRNA (m) Lentiviral Particles: sc-60375-V.Molecular Weight of CHMP5: 32 kDa.RECOMMENDED SECONDARY REAGENTSTo ensure optimal results, the following support (secondary) reagents are recommended: 1) Western Blotting: use donkey anti-goat IgG-HRP: sc-2020(dilution range: 1:2000-1:100,000) or Cruz Marker™ compatible donkey anti-goat IgG-HRP: sc-2033 (dilution range: 1:2000-1:5000), Cruz Marker™Molecular Weight Standards: sc-2035, TBS Blotto A Blocking Reagent: sc-2333 and Western Blotting Luminol Reagent: sc-2048. 2) Immunoprecip-itation: use Protein A/G PLUS-Agarose: sc-2003 (0.5 ml agarose/2.0 ml). 3) Immunofluorescence: use donkey anti-goat IgG-FITC: sc-2024 (dilution range: 1:100-1:400) or donkey anti-goat IgG-TR: sc-2783 (dilution range:1:100-1:400) with UltraCruz™ Mounting Medium: sc-24941.DATARESEARCH USEFor research use only, not for use in diagnostic procedures.PROTOCOLSSee our web site at or our catalog for detailed protocols and support products.CHMP5 (Y-19): sc-49920. Western blot analysis of CHMP5expression in non-transfected: sc-117752 (A )and mouse CHMP5 transfected: sc-125133 (B ) 293T whole cell lysates.132 K –90 K –55 K –43 K –34 K –23 K –<CHMP5A B元器件交易网。
MBRB20200CT中文资料
ELECTRICAL CHARACTERISTICS (PER LEG)
Maximum Instantaneous Forward Voltage (1) 0.9 0.8 1.0 0.9 1.0 50 Volts
Maximum Instantaneous Reverse Current (1) (Rated dc Voltage, TC = 25°C) (Rated dc Voltage, TC = 125°C)
Amps Amps Amps Amp °C °C V/µs °C/W
THERMAL CHARACTERISTICS (PER LEG)
Thermal Resistance — Junction to Case RθJC (IF = 10 Amps, TC = 25°C) (IF = 10 Amps, TC = 125°C) (IF = 20 Amps, TC = 25°C) (IF = 20 Amps, TC = 125°C) VF 2.0
150
160
Figure 3. Forward Power Dissipation
IF(AV), AVERAGE FORWARD CURRENT (AMPS) 20 500
Figure 4. Current Derating, Case
RθJA = 16°C/W RATED VOLTAGE C, CAPACITANCE (pF)
Figure 2. Typical Reverse Current (Per Leg)
SQUARE WAVE
RATED VOLTAGE RθJC = 2°C/W
20
15 SQUARE WAVE 10 dc
5
0
90
掺杂改性C_C复合材料研究进展
第30卷第11期2011年11月中国材料进展MATERIALS CHINAVol.30No.11Nov.2011特约专栏收稿日期:2011－09－24通信作者:崔红，女，1969年生，研究员，博士生导师掺杂改性C /C 复合材料研究进展崔红，闫联生，刘勇琼，张强，孟祥利(西安航天复合材料研究所，陕西西安710025)摘要:陶瓷掺杂改性碳/碳(C /C )复合材料在保持C /C 复合材料原有优异高温力学性能及尺寸稳定性等特性的前提下，显著提高了C /C 复合材料的高温抗氧化、抗烧蚀性能，且其具有可设计性和良好的抗热震性能等优势，是新型高超声速飞行器和新一代高性能发动机热防护部件的理想候选材料。
综述了国内外在SiC 陶瓷掺杂改性C /C 复合材料，ZrC ，ZrB 2超高温陶瓷掺杂改性C /C 复合材料以及TaC ，HfC 超高温陶瓷掺杂改性C /C 复合材料等方面的最新研究进展和应用情况，并分析了陶瓷掺杂改性C /C 复合材料目前研究及应用中存在的主要问题和今后潜在的研究发展方向。
关键词:高温材料;C /C 复合材料;掺杂改性;抗氧化中图分类号:TB333文献标识码:A 文章编号:1674－3962(2011)11－0013－05Advances on Ceramic Hybird ModifiedCarbon /Carbon CompositesCUI Hong ，YAN Liansheng ，LIU Yongqiong ，ZHANG Qiang ，MENG Xiangli(Xi'an Aerospace Composite Material Institute ，Xi'an 710025，China )Abstract :Being the ideal candidate material for thermal protection parts in supersonic flight and the high performancerocket engine ，carbon /carbon composites modified by ceramic hybrid have good oxidation and ablation resistance ，design-ability ，good thermal shock resistance as well as the inherent unique comprehensive properties ，such as excellent mechani-cal properties and dimensional stability at high temperature．The present status of research and application of carbon /car-bon composites modified by the SiC ceramics and ZrC ，ZrB 2，TaC ，HfC ultrahigh temperature ceramics were summarized．The existing problems and the potential development direction on the investigation of the ceramic hybrid modification C /C composites were also proposed．Key words :high temperature materials ;carbon /carbon composites ;hybird modification ;anti-oxidation1前言碳/碳(C /C )复合材料即碳纤维增强碳基体复合材料，是一种特别具有性能可设计性和抗热震性的先进复合材料，它以优异抗烧蚀性能、高比强度、高比模量、及高温下极好的力学性能和尺寸稳定性等一系列突出的特点，特别适合于需要材料具有较高物理性能和化学稳定性的高温环境下使用，已成功地在航空航天领域得到广泛应用，如航天器鼻锥、机翼前缘、固体火箭发动机(SRM )喉衬及扩张段和飞机刹车片等，C /C 复合材料是应航空航天领域的需要而开发的最成功的材料之一［1－2］。
TCMBR20200CT中文资料
Tak Cheong reserves the right to make changes without further notice to any products herein to further improve reliability, function or design, cost and productivity.
TAK CHEONG ® and
are registered trademarks of Tak Cheong Electronics (Holdings) Co., Ltd.
May 2008 Release, Revision C
Page 2
Although information in this datasheet has been carefully checked, no responsibility for the inaccuracies can be assumed by Tak Cheong. Please consult your nearest Tak Cheong’s sales office for further assistance.
1.
Reverse Current Forward Voltage
@ rated VR IF = 10A IF = 20A
Tested under pulse condition of 300µS.
---
200
---
200
0.800
0.850
---
---
0.900
0.950
TCMBR20200CT
Min
and can withstand to 260°C Wave Soldering or per MIL-STD-750, Method 2026.
阻燃电缆的表示
阻燃电缆与普通电缆价格差C级阻燃电缆比普通电缆要高3~6%；表示为ZRC或ZRB级阻燃电缆比普通电缆要高10~20%；表示为ZRBA级阻燃电缆比普通电缆要高2~3倍。
表示为ZRA或GZR如何辨别阻燃电缆与耐火电缆防火电线电缆是具有防火性能电线电缆的总称，重庆泰山电缆指出通常分为阻燃电线电缆和耐火电线电缆两种。
1、阻燃电线电缆阻燃是指阻滞、延缓火焰沿着电线电缆的蔓延，使火灾不扩展，该类型电缆着火后具有自熄性能。
阻燃电缆按国度实验规范（GB12666-99）可分为三个等级：ZRA、ZRB、ZRC。
在普通产品命名中，ZRA通常用GZR表示，属称高阻燃电缆或隔氧层电缆或高阻燃隔氧层电缆。
ZRC在普通阻燃产品中表示ZR。
阻燃电缆是坚持普通电缆的电性能和理化性能的同时，具有自熄性，即不易熄灭，或当电缆因故本身着火或是外火源引燃着火时，在着火熄灭后电缆不再继续熄灭，或熄灭时间很短（60分钟以内），或延燃长度很短。
无卤阻燃电缆相关于含卤阻燃电缆有低毒、低烟、无卤的优点。
阻燃级别不高，根本上是C类。
其缘由是卤素自在基的吞氧灭火能效要大于非卤化物阻燃剂降解温的能效。
隔氧层阻燃技术主要是在电缆绝缘线芯与电缆外护套之间充填一层无机金属水化物，它是无毒、无嗅、不含卤素的白色胶状物。
隔氧层阻燃电缆在不改动电缆构造，资料原始参数的状况下，可适用于低、中、高压电力电缆、控制电缆及通讯电缆，并使电缆阻燃A类化。
2、耐火电线电缆耐火指在火焰熄灭状况下能坚持一定时间的运转，即坚持电路的完好性，泰山电缆该类型电缆在火焰中具有一定时间的供电才能。
耐火电缆按国度实验规范（GB12666-99）可分为二个等级：NHA、NHB；在普通产品命名中，NHA通常用GNH表示，属称高耐火电缆。
NHB在普通耐火产品中表示为NH。
耐火电缆在火灾发作时能持续工作（传送电流和信号），其自身延燃与否不在考核之列。
阻燃电缆在火灾发作时很快中止工作，其功用在于难燃和不涉及能自熄。
Cf／ZrC—ZrB2-SiC—C超高温陶瓷复合材料的显微结构表征
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NCL(11-2020)版中文版和区分表修改内容-2020 国家商标局
NCL(11-2020)版中文版和《类似商品和服务区分表》修改内容类位置修改内容1 0102第（六）部分：注2改为“本部分与第九版及以前版本0104第（十九）部分非医用酒石乳剂，非食用藻酸盐（胶化和加压剂）交叉检索”。
第（六）部分：删除注3第（七）部分：注2改为“本部分与第十版及以前版本0401混合二甲苯，二甲苯，苯，粗制苯交叉检索”。
第（十五）部分：010029“琼脂”改为“工业用琼脂”第（十六）部分：注2改为“工业用淀粉，工业用土豆粉与0104第（十九）部分工业用面粉类似”。
第（十六）部分：增加注3“本部分与第十一版及以前版本0104第（十九）部分工业用土豆粉交叉检索”。
0104第四部分：注1改为“陶瓷釉与0205瓷釉（漆），瓷漆，釉料（漆、亮面漆）类似，与第十一版及以前版本0205釉料（漆、清漆）交叉检索”。
第六部分：注改为“本部分与第十一版及以前版本0108第（一）部分过滤材料（未加工塑料）交叉检索”。
第十部分：注改为“清漆溶剂与0205油漆稀释剂，亮面漆用稀释剂，松节油（涂料稀释剂），稀料，松香水，天那水，信那水，0302去漆剂类似，与第十一版及以前版本0205漆稀释剂交叉检索”。
第十四部分：注改为“本部分与第八版及以前版本0205墙纸清除剂交叉检索”。
0107 注2改为“本类似群与第十版及以前版本0102第（十五）部分蛋白纸交叉检索”。
0108 注4改为“第（一）部分与第十一版及以前版本0115聚氨酯交叉检索”。
0110 注改为“本类似群与第十版及以前版本0104第（三）部分阻燃剂交叉检索”。
0113010374“化学用牛奶发酵剂”改为“化学用奶发酵剂”，010675“食品工业用牛奶发酵剂”改为“食品工业用奶发酵剂”，010676“工业用牛奶发酵剂”改为“工业用奶发酵剂”注3改为“本类似群与第十一版及以前版本0104第（十九）部分制药工业用保存剂交叉检索”。
0114 注2改为“本类似群与第十版及以前版本0104第（一）部分上浆料（化学制剂）交叉检索”。
Convotherm C2020 Roll-In Rack 配件保温柜说明书
Models: H137WSRRC2020 SERIES for use with Convotherm C2020 Roll-In Rack (not included).Cabinet model number:Cabinet serial number: Authorized Service Agency:Ph:Fax:Keep this manual for future reference.OPERATING and MAINTENANCE INSTRUCTIONSModels: H137WSRR-C Series Companion Holding CabinetFL-2330Rev. 0 (2/07)5925 Heisley Road • Mentor, OH 44060-1833SUBJECT PAGEINSTALLATION INSTRUCTIONS..............................................................................................2 Illustration (Leg Adjustment), Figure 1. (2)Illustration (Drain Valve), Figure 2 (2)OPERATING INSTRUCTIONS (3)Illustration (Control Panel), Figure 3 (3)MAINTENANCE INSTRUCTIONS How to Clean the Unit...................................................................................4 Trouble Shooting Guide.................................................................................5 Replacement Parts (Cabinet)..............................................................................6 Illustration (Cabinet Parts)...................................................................................................7 Replacement Parts (Power Unit)..........................................................................................8 Wiring Diagram. (9)How to Reverse the Door Opening (10)TABLE OF CONTENTSFL-2330Rev. 0 (2/07)5925 Heisley Road • Mentor, OH 44060-1833IDENTIFYING YOUR CABINET:Look for this label on the back of your cabinet. This information is needed when calling for questions or service.OPERATING and MAINTENANCE INSTRUCTIONSModels: H137WSRR-C Series Companion Holding CabinetCompanion Holding CabinetFL-2330Rev. 0 (2/07)Page 1 of 10ELECTRICAL SPECIFICATIONS:Model No.VoltsWattsAmpsHertzPhaseNEMAHCWH2020120192016.06015-20P HCWH2020208208200010.06016-15P HCWH202024024020008.66016-15PNote: The above model numbers are basic models. They may be followed by letters: L, M, 2M, D, or ending with S.5925 Heisley Road • Mentor, OH 44060-1833HOW TO INSTALL UNIT:Remove all paper and packing material from inside of cabinet.Remove protective paper and vinyl material from outside surfaces of cabinet.Place the cabinet in a well-ventilated area.Place cabinet on level fl oor. (For cabinets with legs, adjust the legs of the cabinet to ensure proper fi t of rack into cabinet. See Fig. 1)Plug cord end into proper wall outlet.Fill water pan with 4 gallons (15 liters) of water.Make sure green drain valve is closed. See Figure 2.1.2.3.4.5.6.7. Push POWER switch to “ON.” Yellow POWER LIGHT will come on.8. Push the “SET” button on the TEMPERATURE CONTROL. The TEMPERATURE DISPLAY will show “SP1” (set point 1).9. Press “SET” again and the current set point temperature will be displayed.10. Press the ADJUST buttons to adjust to 200°F(93°C).11. Run the unit for one hour.NOTE: DO NOT PUT FOOD IN CABINET!This step is to burn off manufacturing oils and excess adhesive.Air is VERY HOT when door is opened.12. Let the cabinet cool and wipe inside clean withdetergent and hot water before fi rst use.Use of treated or soft water may be required for properoperation and to maintain warranty.OPERATING and MAINTENANCE INSTRUCTIONSModels: H137WSRR-C Series Companion Holding CabinetCompanion Holding Cabinet FL-2330Rev. 0 (2/07)Page 2 of 10Figure 1 Leg AdjustmentFigure 2 Drain Valve5925 Heisley Road • Mentor, OH 44060-1833HOW TO HOLD:No water is needed in pan.Push POWER switch to “ON.” Yellow POWER LIGHT will come on.Push the “SET” button on the TEMPERATURE CONTROL. The TEMPERATURE DISPLAY will show “SP1” (set point 1).Press “SET” again and the current set point temperature will be displayed.Press the ADJUST buttons to adjust to the desired temperature.Press “SET” to save the temperature setting.Preheat cabinet for 45 minutes.Put product into cabinet.1.2.3.4.5.6.7.8.HOLD WITH HUMIDITY:Fill water pan with HOT water.Push POWER switch to “ON.” Yellow POWER Light will come on.Push the “SET” button on the TEMPERATURE CONTROL. The TEMPERATURE DISPLAY will show “SP1” (set point 1).Press “SET” again and the current set point temperature will be displayed.Press the ADJUST buttons to adjust to the desired temperature.Press “SET” to save the temperature setting.Turn the “HUMIDITY” thermostat to No. 9.Preheat for 45 minutes.Turn “AIR” thermostat to desired temperature. (See thermostat settings below.10. Put product into cabinet1.2.3.4.5.6.7.8.9.Air is VERY HOT when door is opened.NOTES: Proper food holding temperature is 140°F/60°C or higher.SOME TYPICAL THERMOSTAT SETTINGS:Thermostat Setting ResultThermostat Setting ResultAir Humidity Cab. Temp.Humidity Air Humidity Cab. Temp Humidity 150° F Off 150° F N/A 160°F Med 160°F 50%175°F Off 175° F N/A 160°F High 160°F 95%200°F Off 200° F N/A 170°F Low 170°F 15%170°F Med 170°F 35%100°F 3½100°F 98%170°F High 170°F 85%170°F Max 170°F 90%150°F Low 115° F 98%200°F Low 200°F 7%150°F Med 150° F 95%200°F Med 200°F 15%150°F High 150° F 95%200°F High200°F 40%160°FLow160° F30%Note: These settings are based on laboratory conditions and may differ from conditions at point of use. Experiment withthe settings to determine what is best for your application.OPERATING and MAINTENANCE INSTRUCTIONSModels: H137WSRR-C Series Companion Holding CabinetCompanion Holding CabinetFL-2330Rev. 0 (2/07)Page 3 of 10Figure 35925 Heisley Road • Mentor, OH 44060-1833MAINTENANCE: WATER PAN Drain, wipe and fi ll water pan daily. (Clear vinyl drain hose is provided.)Push hose onto drain nozzle under the base.Turn knob to open the drain.1.2.MAINTENANCE: CABINETWipe the inside of cabinet after daily use. Leave doors slightly open to fully dry interior.1.2.BEFORE cleaning the cabinet: Unplug cord from wall.Do NOT hose cabinet with water.Do NOT get water on controls.Do NOT use abrasives or harsh chemicals.Cleaning hints:Wipe up spills as soon as possible.Clean cabinet regularly to avoid heavy dirt build-up.Make a test spot with cleaner.Follow manufacturer’s directions on cleaner.Do not mix cleaners.Avoid drips and splashes 1.2.3.4.5.6.HOW TO CLEAN THE UNIT:SoilCleanerMethodCABINET Inside and Outside (Stainless Steel)ROUTINE CLEANINGSoap, Ammonia, or mild *detergent and water. 1. Sponge on with cloth.2. Rinse with water.3. Wipe dry.STUBBORN SPOTS AND STAINSMild abrasive made for stainless steel.1. Apply with damp sponge or cloth.2. Rub lightly.BURNT-ON FOODS OR GREASEChemical oven cleaner for stainless steel.Follow oven cleaner manufacturer’s directions.HARD WATER SPOTS and SCALEVinegar1. Swab or wipe with cloth.2. Rinse and dry.*Mild detergents include soaps and non-abrasive cleaners.Delime or descalewater pan parts asrequired, to prevent damaging build-up. WARRANTY COVERAGE MAY BE AFFECTEDWITHOUT PROPER CLEANING.OPERATING and MAINTENANCE INSTRUCTIONSModels: H137WSRR-C Series Companion Holding CabinetCompanion Holding Cabinet FL-2330Rev. 0 (2/07)Page 4 of 105925 Heisley Road • Mentor, OH 44060-1833TROUBLE-SHOOTING CHART:FAILUREPOSSIBLE CAUSE1. Yellow light at switch does NOT light.1a. Switch is “OFF”.1b. Cord unplugged from wall outlet.1c. Circuit breaker/fuse to wall outlet blown.2. Unit does not heat.2a. Temperature Control set too low.2b. Switch is “OFF”.3. No humidity in cabinet.3a. Humidity Thermostat set too low.3b. No water in water pan.4. Unit gets too hot or won’t shut off. 4a. Defective electrical parts. UNPLUG UNIT FROM WALL OUTLET.5. Blower does not work or makes noise.5a. Defective blower.6. GFCI device trips.6a. The insulation inside the heating elements may have absorbed some moisture. This may have occurred if the cabinet has not been used for a long period of time or during shipping and storage of the cabinet. Drain the water pan if needed. Plug the cabinet into a non-GFCI outlet and set the Temperature Control to 200° (93°C). Let the cabinet run for about 1 hour to dry out the heating elements from any moisture may have been absorbed. If the circuit breaker trips, turn off cabinet, remove cord from power source, and call the Factory Authorized Service Agent. After drying the heating elements, plug cabinet into the GFCI receptacle; the cabinet should run properly. If the GFCI trips, call the factory Authorized service agent.GFCI (ground-fault circuit interrupter): A GFCI receptacle is a device that de-energizes a circuit when it detects an unsafe fl ow of current to ground. The intention of a GFCI device is to minimize the potential for an electrical shockIf cause is none of the above, refer to our list of Authorized Service Agencies.OPERATING and MAINTENANCE INSTRUCTIONSModels: H137WSRR-C Series Companion Holding CabinetCompanion Holding CabinetFL-2330Rev. 0 (2/07)Page 5 of 105925 Heisley Road • Mentor, OH 44060-1833CABINET REPLACEMENT PARTS:ITEM DESCRIPTION120V208V240V1Heater Kit, Air, 1000 Watts each 0811-*******-074-020811-074-012High Limit 0848-0600848-0600848-0603Power Cord0810-065-100810-039-020810-039-024Heater Kit, Water, 2000 Watts 0811-*******-2710811-2715Drain Valve0898-*******-0150898-0156Thermostat Probe Kit (probe only)0848-008-3-ACK0848-008-3-ACK0848-008-3-ACK7Power Unit (See Page 8)0675-0690675-0700675-0708Door - full, solid 1221-557-K -full, w/window1221-558-K -half, solid, top LH, bottom, RH 1221-560-K -half, solid, bottom LH, top, RH 1221-559-K -half, window, top LH, bottom, RH 1221-561-K -half, window, bottom LH, top, RH1221-562-K 9Gasket Kit, Body0861-17510Gasket Kit, Door 0861-26511Hinge Kit 0519-074-K 12Latch Kit 1006-122-01-K 13Tunnel0546-14114Cover, Water Pan 0761-02015Handle, Drain Valve 0911-09516Leg, Adjustable 1206-07017Handle, Pull0911-102OPERATING and MAINTENANCE INSTRUCTIONSModels: H137WSRR-C Series Companion Holding CabinetCompanion Holding Cabinet FL-2330Rev. 0 (2/07)Page 6 of 105925 Heisley Road • Mentor, OH 44060-1833OPERATING and MAINTENANCE INSTRUCTIONSModels: H137WSRR-C Series Companion Holding CabinetCompanion Holding CabinetFL-2330Rev. 0 (2/07)Page 7 of 10CABINET REPLACEMENT PARTS:5925 Heisley Road • Mentor, OH 44060-1833REPLACEMENT PARTS:ITEM DESCRIPTION120V208V240V Power Unit0675-0690675-0700675-07018Power Light 0766-*******-0950766-09519Power Switch0808-1160808-1160808-11620Thermostats, (with probe)0848-008-ACK0848-008-ACK0848-008-ACK 21Knob0595-*******-0610595-06122Terminal Block0852-*******-0930852-09323Relay0857-*******-1020857-10224Blower Kit0769-180-01-SSK0769-182-01-SSK0769-182-01-SSK 25Vent Fan0769-*******-1740769-17426Thermometer (Analog)Thermometer (Digital)5238-030-K5238-034-K5238-030-K5238-034-K5238-030-K5238-034-K27Transformer (used with digital ther-mometer)0769-*******-1590769-159 OPERATING and MAINTENANCE INSTRUCTIONS Models: H137WSRR-C Series Companion Holding CabinetCompanionHolding CabinetFL-2330Rev. 0 (2/07)Page 8 of 10REPLACEMENT PARTS FOR THE POWER UNIT:5925 Heisley Road • Mentor, OH 44060-1833WIRING DIAGRAMOPERATING and MAINTENANCE INSTRUCTIONSModels: H137WSRR-C Series Companion Holding CabinetCompanionHolding Cabinet FL-2330Rev. 0 (2/07)Page 9 of 105925 Heisley Road • Mentor, OH 44060-1833* For 208V and 240V connect wires 13 and 15 to thermostat wire 10.NOTE:To remove power unit for thermostat, blower, or thermometer maintenance, removethe outer top 7 screws and 4 front panel screws.OPERATING and MAINTENANCE INSTRUCTIONS Models: H137WSRR-C Series Companion Holding CabinetCompanionHolding CabinetFL-2330Rev. 0 (2/07)Page 10 of 10The doors are shipped with the hinges on the right side of the cabinet as standard. The doors on the cabinet are large and may require additional help when changing the hinge direction. Allow the cabinet to cool if the cabinet has been in use.Remove handle bracket and strike plates from cabinet and set aside.Remove hinge covers and set aside.Remove hex screws from door gasket bracket assembly and door cover and set aside.Remove door(s) from cabinet, rotate door(s) 180° and install onto other side of cabinet. Fordutch doors, install the bottom door onto the top position and install the top door onto the bottomposition on the other side of the cabinet.Remove screws on bottom of (lower) door and install onto top of (upper) door.Install door gasket assembly and door cover onto bottom of (lower) door.For single door, remove latch and rotate 180° and install onto holes on upper half of door. Fordutch doors, it is not necessary to change latches.Install handle bracket and strike plates onto other side of cabinet.Adjust hinges, latch(es) and door gasket bracket assembly for proper door seal.Install hinge covers.1.2.3.4.5.6.7.8.9.10.HOW TO REVERSE THE DOOR OPENING (Left hinged door shown):5925 Heisley Road • Mentor, OH 44060-1833。
抗氧化涂层的研究1
C/C复合材料MoSi2/ZrB2抗氧化涂层的研究项目论证1、项目的理论与研究背景碳／碳复合材料(C/C)是以碳纤维为增强相的碳基复合材料，具有一系列优良的性能，如低密度、高强度模性、高热稳定性，低热膨胀系数、高导热导电能力、耐烧蚀、耐腐蚀、摩擦系数稳定等。
更特别的是C／C复合材料随温度的升高强度反而升高，在2000℃时仍能保持较优良的力学性能。
它既可以作为功能材料，又可以作为高温结构材料使用，是目前可用于1800℃高温的复合材料。
迄今为止，碳碳复合材料在航空、航天、核能及许多民用工业领域受到极大瞩目，显示出巨大的技术和经济优势[1]。
但这些应用不可避免地要在高温和氧化的环境条件下工作。
然而，碳碳复合材料的起始氧化温度为370℃，随着温度的升高迅速氧化，降低了材料的强度及其他性能，甚至引发事故，从而限制了其作为高温结构材料在氧化气氛下的广泛应用[2]。
为了克服上述缺陷，国内外学者进行了大量的研究探索，采取了如制备表面涂层等方法提高碳碳复合材料的抗氧化能力。
C／C复合材料防氧化技术有两种：(1)基体处理技术，包括基体浸渍技术和添加阻燃陶瓷颗粒。
前者就是浸渍氧化抑制剂，如硼酸盐、磷酸盐和卤化物等；后者就是在基质中复合添加耐火材料颗粒，如B2O3、B、SiC和B4C等；(2)涂层技术。
前种方法如果不与涂层技术结合使用，C／C防氧化的能力是有限的，一般只能在1000℃以下，而且会因为基体中引入盐类或陶瓷颗粒使C ／C的力学性能和热学性能下降。
为实现高于1000℃的抗氧化保护，涂层技术是合理的选择。
本文对碳／碳复合材料MoSi2、ZrB2抗氧化涂层研究作一综述。
2、国内外碳碳复合材料抗氧化涂层体系的研究新进展在碳碳复合材料抗氧化涂层研究初期，大多数采用单一的涂层，如SiC、Si3n4、WC和B4C等涂层。
随着研究的深入，研究水平和研究手段的提高以及涂层理论的不断完善，制备的涂层也由单一涂层向多层涂层和复合涂层和方向快速发展，使用的材料也由金属、合金、玻璃等向高温陶瓷材料方向发展。
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Voltage: 11 - 100 V olts Power: 2.0 Watt
CZRB2011Thru
Features
- For surf ace mounted applications in order to optimize board space - Low profile package - Built-in strain relief
- Glass passivated junction - Low inductance
- Excellent clamping capability
- Typical I less than 1uA above 11V D - High temperature soldering 260°C /10seconds at terminals
- Plastic package has underwriters laboratory flammability classification 94V-O
Mechanical data
- Case: JEDEC DO-214AA,Molded plastic over passivated junction
- Terminals: Solder plated, solderable per MIL-STD-750, method 2026
- Polarity: Color band denotes positive end (cathode) except Bidirectional
- Standard Packaging: 12mm tape (EIA-481) - Weight: 0.002 ounce, 0.064 gram
Maximum Ratings and Electrical Characterics
Ratings at 25°C ambient temperature unless otherwise specified.
Rating and Characteristic Curevs (CZRB2011 Thru CZRB2100) ELECTRICAL CHARACTERISTICS
(T A=25°C unless otherwise noted) (V F=1.2Volts Max, I F=500mA for all types.)
Rating and Characteristic Curves (CZRB2011Thru CZRB2100)
Fig.2-TYPICAL THERMAL RESPONSE L,
P.W.PULSE WIDTH (ms)
0.10.050.030.020.010.0050.0030.0020.0010.00050.00030.00020.0001
NOMINAL VZ (VOLTS)
Fig.3-MAXIMUM SURGE POWER
Fig.4-TYPICAL REVERSE LEAKAGE
VZ,ZENER VOLTAGE @IZT (VOLTS)
VZ,ZENER VOLTAGE @IZT (VOLTS)
Fig.5-UNITS TO 12VOLTS Fig.6-UNITS 10TO 100VOLTS
Rating and Characteristic Curves (CZRB2011Thru CZRB2100)
VZ,ZENER VOLTAGE (VOLTS)
VZ,ZENER VOLTAGE (VOLTS)
L,LEAD LENGTH TO HEAT SINK (INCH)
Fig.9-TYPICAL
THERMAL RESISTANCE
APPLICATION NOTE:
Since the actual voltage available from a given zener diode is temperature dependent, it is necessary to determine junction temperature under any set of operating conditions in order to calculate its value. The following procedure is recommended:
Lead Temperature, T L, should be determined from:
T L = șLA P D + T A
șLA is the lead-to-ambient thermal resistance (°C/W)
and PD is the power dissipation. The value forșLA will
vary and depends on the device mounting method.
șLA is generally 30-40 °C/W for the various chips and
tie points in common use and for printed circuit board
wiring.
The temperature of the lead can also be measured using a thermocouple placed on the lead as close as possible to the tie point. The thermal mass connected to the tie point is normally large enough so that it will not significantly respond to heat surges generated in the diode as a result of pulsed operation once steady-state conditions are achieved. Using the measured value of T L, the junction temperature may be determined by:
T J = T L + ¨T JL ¨T JL is the increase in junction temperature above the lead temperature and may be found from Figure 2 for a train of power pulses or from Figure 10 for dc power.
¨T JL = șLA P D
For worst-case design, using expected limits of Iz, limits of PD and the extremes of TJ (¨T JL ) may be estimated. Changes in voltage, Vz, can then be found from:
¨V = șVZ¨T J
șVZ , the zener voltage temperature coefficient, is
found from Figures 5 and 6.
Under high power-pulse operation, the zener voltage
will vary with time and may also be affected significantly be the zener resistance. For best regulation, keep current excursions as low as possible.
Data of Figure 2 should not be used to compute surge capability. Surge limitations are given in Figure 3. They are lower than would be expected by considering only junction temperature, as current crowding effects cause temperatures to be extremely high in small spots resulting in device degradation should the limits of Figure 3 be
exceeded.
COMCHIP
Surface Mount Zener Diode。