HSL285中文资料
8-组合仪表J285解析
SAGITAR AB075
组合仪表
VW◆Service Training
组合仪表
SAGITAR AB075
LED警报灯 数字显示
组合仪表根据装备不同,有三种版本: ● Lowline version 初级装备
零件号:1K0 920 852 A ● Midline version 中级装备
零件号:1K0 920 862 A ● Highline version 高级装备
VW◆Service Training
组合仪表
SAGITAR AB075
燃油油位报警
机油油位报警 安全带未系报警 ABS警报灯
VW◆Service Training
ASR或ESP
手刹车、制动液位、制动 系统 定速巡航 电动助力转向
柴油车颗粒净化器报警灯 油箱盖开启报警灯 远光灯
后雾灯指示灯
安全气囊或燃爆式安全带故 障指示灯 制动踏板 发动机仓盖未关指示灯
-10km/h
以-10km/h为步长降低报警车速。
Back
关闭Winter Tyres菜单,打开上一层菜单。
VW◆Service Training
组合仪表
SAGITAR AB075
例如:辅助加热
显示器显示
功能
Auxiliary heating Activation
Preset time 1 Preset time 2
返回Settings主菜单。
VW◆Service Training
组合仪表
SAGITAR AB075
例如:冬季轮胎 显示器显示 功能
Winter Tyres 菜单名称
Xkm/h或 ――― ON/OFF
258 Encoders 金属杆壳型绝对类型 EC18A 水抗性强、重力扭矩强 18mm 尺寸 金属
259EncodersMetal ShaftInsulatedShaftThroughShaft TypeRing TypeStandard Codes 1. The ●marks shows the ON position.2. The ●marks : Connections between terminals and the 5 (COM) are ON.Waterproof PropertyImmersion of encoder, not in operation, in water at depth of 1m at normal temperature for 30 minutes.EC18AGAPosition No.123456789101112Rotation angle (° )3060901201501802102402703003301●●●●●●2●●●●3●●●●●●4●●●●5(COM )●●●●●●●●●●●●T E R M I N A L N O .EC18AGB20401Position No.12345678910111213141516Rotation angle (° )22.54567.590112.5135157.5180202.5225247.5270292.5315337.51●●●●●●●●2●●●●●●●●3●●●●●●●●4●●●●●●●●5(COM )●●●●●●●●●●●●●●●●T E R M I N A L N O .EC18AGB20407Position No.123456789101112131415Rotation angle (° )244872961201441681922162402642883123361●●●●●●●●2●●●●●●●●3●●●●●●●●4●●●●●●●●5(COM )●●●●●●●●●●●●●●●T E R M I N A L N O .EC18A /18mm Size Insulated Shaft Type(Two phase A and B )275EncodersMetal ShaftInsulated Shaft Through Shaft TypeRing Type1. When using an infrared reflow oven, solder may sometimes not be applied. Be sure to use a hot air reflow oven or a type that uses infrared rays in combination with hot air.2. The temperatures given above are the maximum temperatures at the terminals of the encoder when employing a hot air reflow method. The temperature of the PC board and the surface temperature of the encoder may vary greatly depending on the PC board material, its size and thickness. Ensure that the surface temperature of the encoder does not rise to 250℃ or greater.3. Conditions vary to some extent depending on the type of reflow bath used. Be sure to give due consideration to this prior to use.NotesEC05E EC21CEC28C, EC35CH250℃ min.230℃ to 245℃260℃230℃ min.220℃ 230℃180℃200℃180℃150℃150℃150℃60s to 120s 60s to 120s 2 min. min.ーー3s30s to 40s 25s to 60s40sー300s max.230s max.2 times max.1 time max.1 time max.Soldering surfacetemperatureSoldering temperatureHeating timeSoldering timeNo. of soldersEC09E, EC111, EC11E, EC11M, EC11N, EC18A,EC21A, EC28A, EC35A, EC35AH, EC50A Series100℃ max.260±5℃2 min. max.5±1s 2 times max.PreheatingDip solderingReference for Dip SolderingExample of Reflow Soldering ConditionReference for Manual SolderingEC10E, EC12D, EC12E EM11BEC40A100℃ max.100℃ max.110℃ max.260±5℃260℃ max.260℃ max.1 min. max.1 min. max.1 min. max.3±1s 3s max.10s max.2 times max.2 times max.1 timeTemperature profile300200100A BC Time (s)G max.F max.H max.E max.RoomtemperatureT e m p e r a t u r e (˚C )Pre-heating DEncoders / Soldering ConditionsEC05E, EC09E, EC10E, EC111, EC11E, EC11M, EC11N, EC12D, EC12E, EC18A, EC21A, EC28A, EC35A, EC35AH, EC40A, EC50A, EM11B, EC21C, EC28C, EC35CHSeries350℃ max.3s max. 1 timeTip temperatureSoldering timeNo. of soldersSeries ABCDEFGHNo. of reflows。
A928A928M
cation. The inch-pound units shall apply unless the M designation of the specification is specified in the order.
2. Referenced Documents
2.1 ASTM Standards: 2 A 240/A 240M Specification for Chromium and
Current edition approved September 1, 2005. Published September 2005. Originally approved in 1994. Last previous edition approved in 2004 as A 928/ A 928M – 04.
*A Summary of Changes section appears at the end of this standard.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
福莱格霍莫尔产品手册说明书
福莱格霍莫尔产品手册德国福莱格霍莫尔紧固件集团福莱格霍莫尔公司于1946在德国斯图加特成立。
在国际化进程中,公司分别在美国,中国台湾,中国天津,法国,俄罗斯,波兰,墨西哥,和泰国设有子公司与合资公司。
集团拥有员工890名。
2015年总销售额超过20亿人民币。
几十年以来福莱格霍莫尔公司专注于紧固技术和连接技术的研发与生产。
公司拥有的大量国际专利技术,其中国际专利产品FS-全钢防松自锁螺母系列在轨道交通,汽车制造,风能发电,机械制造,矿山及工程机械,建筑桥梁,船舶制造和航空航天等制造行业中,为国际知名客户的产品提供了优质的安全保障。
目录FS -全钢防松自锁螺母DIN980 / ISO 7042 -------------------------------------------------------------------------------------------------2 FS-全钢防松自锁螺母细牙DIN EN ISO 10513-------------------------------------------------------------------------------------------3 FS-全钢防松自锁法兰螺母DIN ISO 7044 / DIN EN 1664-------------------------------------------------------------------------------4 FS -全钢防松自锁螺母(特型螺母)----------------------------------------------------------------------------------------------------------5 FS -全钢防松自锁螺母DIN 267 –2 / ISO 4759 –1 --------------------------------------------------------------------------------------6 FH -尼龙嵌件防松螺母DIN 985 (薄型)-----------------------------------------------------------------------------------------------------7 FH -尼龙嵌件防松螺母DIN 982 (厚型) -----------------------------------------------------------------------------------------------------8 FH -尼龙嵌件防松法兰螺母DIN EN 1663-------------------------------------------------------------------------------------------------9 FH –CNC 高精密机加工件-------------------------------------------------------------------------------------------------------------------10 FH -冷镦压件-------------------------------------------------------------------------------------------------------------------------------11/12 FH -油堵螺丝-----------------------------------------------------------------------------------------------------------------------------------13FS-全钢防松自锁螺母DIN980 / ISO 7042d h s e min.M5588.79M661011.05M881314.38M10101718.9M12121921.1M14142224.49M16162426.75M18182729.56M20203032.95M22223235.72M24243639.55M27274145.63M30304650.85M36365560.79M39396066.44M42426572.61M48487583.91M56568595.07M646495106.37编号材料强度级别表面处理FS 8011碳钢8镀白锌FS 8012碳钢8镀黄锌FS 8013碳钢8DAC 达克罗FS 8014碳钢8Geomet 交美特FS 8121碳钢10镀白锌FS 8122碳钢10镀黄锌FS 8123碳钢10DAC 达克罗FS 8124碳钢10Geomet 交美特FS 8231碳钢12镀白锌FS 8232碳钢12镀黄锌FS 8233碳钢12DAC 达克罗FS 8234碳钢12Geomet 交美特FS 7012不锈钢A28-FS 7013不锈钢A48-FS 7014不锈钢A28带涂层FS 7015不锈钢A48带涂层FS 9016耐高温材料8-FS 201铜--FS-全钢防松自锁螺母细牙DIN EN ISO 10513编号材料强度级别表面处理FS 1011碳钢8镀白锌FS 1012碳钢8镀黄锌FS 1013碳钢8DAC 达克罗FS 1014碳钢8Geomet 交美特FS 1121碳钢10镀白锌FS 1122碳钢10镀黄锌FS 1123碳钢10DAC 达克罗FS 1124碳钢10Geomet交美特FS 1231碳钢12镀白锌FS 1232碳钢12镀黄锌FS 1233碳钢12DAC 达克罗FS 1234碳钢12Geomet 交美特FS 7022不锈钢A28-FS 7023不锈钢A48-FS 7024不锈钢A28带涂层FS 7025不锈钢A48带涂层FS 9060耐高温材料8-FS 2015铜--d h se min.M5588.79 M661011.05 M8 x 181314.38 M10 x 1.25101718.9 M12 x 1.5121921.1 M14 x 1.5142224.49 M16 x 1.5162426.75 M18 x 1.5182729.56 M20 x 1.5203032.95 M22 x 2223235.72 M24 x 2243639.55 M27 x 2274145.63 M30 x 2304650.85 M36 x 2365560.79FS-全钢防松自锁法兰螺母DIN ISO 7044 / DIN EN 1664编号材料强度级别表面处理FS 3011碳钢8镀白锌FS 3012碳钢8镀黄锌FS 3013碳钢8DAC 达克罗FS 3014碳钢8Geomet 交美特FS 3121碳钢10镀白锌FS 3122碳钢10镀黄锌FS 3123碳钢10DAC 达克罗FS 3124碳钢10Geomet 交美特FS 3201碳钢12镀白锌FS 3202碳钢12镀黄锌FS 3203碳钢12DAC 达克罗FS 3204碳钢12Geomet 交美特FS 7112不锈钢A28-FS 7113不锈钢A48-FS 7114不锈钢A28带涂层FS 7115不锈钢A48带涂层FS 9120耐高温材料8-FS 218铜--d h s me M5 5.7811.88.78 M6 6.81014.211.05 M88.741317.914.38 M1010.341521.817.77 M1212.57182620.03 M1414.82129.923.36 M1617.22434.526.75 M2020.33042.832.95FS-全钢防松自锁螺母特型螺母特型防松螺母按客户要求定制!编号材料强度级别表面处理FH X011碳钢8镀白锌FH X012碳钢8镀黄锌FH X013碳钢8DAC 达克罗FH X014碳钢8Geomet 交美特FH X021碳钢10镀白锌FH X022碳钢10镀黄锌FH X023碳钢10DAC 达克罗FH X024碳钢10Geomet 交美特FH X201碳钢12镀白锌FH X202碳钢12镀黄锌FH X203碳钢12DAC 达克罗FH X204碳钢12Geomet 交美特FH X402不锈钢A28-FH X403不锈钢A48-FH X404不锈钢A28带涂层FH X405不锈钢A48带涂层FH X08铜--FS-全钢防松自锁螺母DIN 267 –2 / ISO 4759 -1编号材料强度级别表面处理FS 2301碳钢8镀白锌FS 2302碳钢8镀黄锌FS 2303碳钢8DAC 达克罗FS 3204碳钢8Geomet 交美特FS 2314碳钢10镀白锌FS 2315碳钢10镀黄锌FS 2316碳钢10DAC 达克罗FS 2317碳钢10Geomet交美特FS 2328碳钢12镀白锌FS 2329碳钢12镀黄锌FS 2323碳钢12DAC 达克罗FS 2324碳钢12Geomet交美特FH 7512不锈钢A28-FH 7513不锈钢A48-FH 7514不锈钢A28带涂层FH 7515不锈钢A48带涂层FH 3080铜-磷化发黑d h h1h2d1s M162620101621FH-尼龙嵌件防松螺母DIN 985 (薄型)编号材料强度级别表面处理FH 4011碳钢8镀白锌FH 4012碳钢8镀黄锌FH 4013碳钢8DAC 达克罗FH 4014碳钢8Geomet 交美特FH 4121碳钢10镀白锌FH 4122碳钢10镀黄锌FH 4123碳钢10DAC 达克罗FH 4124碳钢10Geomet 交美特FH 4201碳钢12镀白锌FH 4202碳钢12镀黄锌FH 4203碳钢12DAC 达克罗FH 4204碳钢12Geomet 交美特FH 7212不锈钢A28-FH 7213不锈钢A48-FH 7214不锈钢A28带涂层FH 7215不锈钢A48带涂层FH 220铜--d h max s e min.m M4577.66 3.2 M5588.79 3.5 M661011.05 4.5 M881314.386 M10101617.777 M12121820.039 M14142123.3610 M16162426.7511 M1818.52729.5614 M202203032.9515 M22223235.0316 M24243639.5516 M27274145.219 M30304650.8523 M36365560.7928 M39396066.9630 M42426572.6133 M45457078.2635 M48487583.9138FH-尼龙嵌件防松螺母DIN 982 (厚型)编号材料强度级别表面处理FH 6011碳钢8镀白锌FH 6012碳钢8镀黄锌FH 6013碳钢8DAC 达克罗FH 6014碳钢8Geomet 交美特FH 6121碳钢10镀白锌FH 6122碳钢10镀黄锌FH 6123碳钢10DAC 达克罗FH 6124碳钢10Geomet 交美特FH 6201碳钢12镀白锌FH 6202碳钢12镀黄锌FH 6203碳钢12DAC 达克罗FH 6204碳钢12Geomet 交美特FH 7312不锈钢A28-FH 7313不锈钢A48-FH 7314不锈钢A28带涂层FH 7315不锈钢A48带涂层FH 221铜--d h max.s e min.mM5 6.388.79 4.4 M681011.05 4.9 M89.51314.38 6.44 M1011.51718.98.04 M12141921.110.37 M14162224.4912.1 M16182426.7514.1 M18202729.5615.1 M20223032.9516.9 M22253235.0318.1 M24283639.5520.2 M27314145.222.5 M3032.64650.8524.3 M3638.95560.7929.4FH-尼龙嵌件防松法兰螺母DIN EN 1663编号材料强度级别表面处理FH 9011碳钢8镀白锌FH 9012碳钢8镀黄锌FH 9013碳钢8DAC 达克罗FH 9014碳钢8Geomet 交美特FH 9121碳钢10镀白锌FH 9122碳钢10镀黄锌FH 9123碳钢10DAC 达克罗FH 9124碳钢10Geomet 交美特FH 9201碳钢12镀白锌FH 9202碳钢12镀黄锌FH 9203碳钢12DAC 达克罗FH 9204碳钢12Geomet 交美特FH 7412不锈钢A28-FH 7413不锈钢A48-FH 7414不锈钢A28带涂层FH 7415不锈钢A48带涂层FH 231铜--d h s me M57.18 4.78.79 M69.110 5.711.05 M811.1137.614.38 M1013.5169.617.77 M1216.11811.620.03 M1418.22113.323.36 M1620.32415.326.75 M2024.83018.732.95FH -CNC 高精密机加工件福莱格霍莫尔公司拥有五轴,六轴数控机床加工园。
ICX285AQ中文资料
Between input clock pins
Voltage difference between vertical clock input pins Hφ1 – Hφ2 Hφ1, Hφ2 – Vφ4
Storage temperature
Guaranteed temperature of performance
∗3 Do not apply a DC bias to the substrate clock and reset gate clock pins, because a DC bias is generated within the CCD.
HSMS-285C中文资料
Surface Mount Zero Bias Schottky Detector Diodes Technical DataHSMS-285x SeriesSOT-23/SOT-143 Package Lead Code Identification (top view)DescriptionAgilent’s HSMS-285x family of zero bias Schottky detector diodes has been designed and optimized for use in small signal (P in <-20 dBm) applications at frequencies below 1.5GHz. They are ideal for RF/ID and RF Tag applications where primary (DC bias) power is not available.Important Note: For detector applications with input power levels greater than –20 dBm, use the HSMS-282x series at frequen-cies below 4.0 GHz, and theHSMS-286x series at frequencies above 4.0GHz. The HSMS-285x series IS NOT RECOMMENDED for these higher power level applications.Available in various package configurations, these detector diodes provide low cost solutions to a wide variety of design prob-lems. Agilent’s manufacturing techniques assure that when two diodes are mounted into a single package, they are taken from adjacent sites on the wafer,assuring the highest possible degree of match.SOT-323 Package LeadCode Identification (top view)Features•Surface Mount SOT-23/SOT-143 Packages •Miniature SOT-323 and SOT-363 Packages •High Detection Sensitivity:up to 50 mV/µW at 915 MHz •Low Flicker Noise:-162 dBV/Hz at 100 Hz •Low FIT (Failure in Time)Rate*•Tape and Reel Options Available •Matched Diodes forConsistent Performance •Better ThermalConductivity for Higher Power Dissipation •Lead-free Option Available* For more information see the Surface Mount Schottky Reliability Data Sheet.SOT-363 Package Lead Code Identification (top view)SERIES SINGLESERIESSINGLE BRIDGE QUADPUNCONNECTEDTRIOLPin Connections and Package MarkingNotes:1.Package marking provides orienta-tion and identification.2.See “Electrical Specifications” for appropriate package marking.123654SOT-23/SOT-143 DC Electrical Specifications, T C = +25°C, Single Diode Part Package Maximum Typical Number Marking Lead Forward Voltage Capacitance HSMS-Code[1]Code Configuration V F (mV)C T (pF)2850P00Single1502500.302852P22Series Pair[2,3]2855P55Unconnected Pair[2,3]Test I F = 0.1 mA I F = 1.0 mA V R = –0.5V to –1.0V Conditions f = 1 MHz Notes:1. Package marking code is in white.2. ∆V F for diodes in pairs is 15.0 mV maximum at 1.0 mA.3. ∆C T for diodes in pairs is 0.05 pF maximum at –0.5V.SOT-323/SOT-363 DC Electrical Specifications, T C = +25°C, Single Diode Part Package Maximum Typical Number Marking Lead Forward Voltage Capacitance HSMS-Code[1]Code Configuration V F (mV)C T (pF)285B P0B Single[2]1502500.30285C P2C Series Pair[2,3]285L PL L Unconnected Trio285P PP P Bridge QuadTest I F = 0.1 mA I F = 1.0 mA V R = 0.5V to –1.0V Conditions f = 1 MHz Notes:1. Package marking code is laser marked.2. ∆V F for diodes in pairs is 15.0 mV maximum at 1.0 mA.3. ∆C T for diodes in pairs is 0.05 pF maximum at –0.5V.RF Electrical Specifications, T C = +25°C, Single DiodePart Number Typical Tangential Sensitivity Typical Voltage Sensitivity Typical Video HSMS-TSS (dBm) @ f = 915 MHzγ (mV/µW) @ f = 915 MHz Resistance RV (KΩ) 2850–57408.028522855285B285C285L285PTest Video Bandwidth = 2 MHz Power in = –40 dBmConditions Zero Bias R L = 100 KΩ, Zero Bias Zero BiasEquivalent Linear Circuit ModelHSMS-285x chipSPICE ParametersParameterUnits HSMS-285xB V V 3.8C J0pF 0.18E G eV 0.69I BV A 3E -4I SA 3 E-6N 1.06R S Ω25PB (V J )V0.35P T (XTI)2M0.5Absolute Maximum Ratings, T C = +25°C, Single DiodeSymbol Parameter Unit Absolute Maximum [1]SOT-23/143SOT-323/363P IV Peak Inverse Voltage V2.0 2.0T J Junction Temperature °C 150150T STG Storage Temperature °C -65 to 150-65 to 150T OP Operating Temperature °C -65 to 150-65 to 150θjcThermal Resistance [2]°C/W500150Notes:1. Operation in excess of any one of these conditions may result in permanent damage to the device.2. T C = +25°C, where T C is defined to be the temperature at the package pins where contact is made to the circuit board.ESD WARNING:Handling PrecautionsShould Be Taken To Avoid Static Discharge.C jR j =8.33 X 10-5 nT I b + I swhereI b = externally applied bias current in ampsI s = saturation current (see table of SPICE parameters)T = temperature, °Kn = ideality factor (see table of SPICE parameters)Note:To effectively model the packaged HSMS-285x product, please refer to Application Note AN1124.R S = series resistance (see Table of SPICE parameters)C j = junction capacitance (see Table of SPICE parameters)Typical Parameters, Single DiodeFigure 1. Typical Forward Current vs. Forward Voltage.Figure 2. +25°C Output Voltage vs. Input Power at Zero Bias.Figure 3. +25°C Expanded Output Voltage vs. Input Power. See Figure 2.Figure 4. Output Voltage vs. Temperature.I F – F O R W A R D C U R R E N T (m A )00.01V F – FORWARD VOLTAGE (V)0.8 1.010010.10.2 1.8101.40.40.6 1.2 1.6V O L T A G E O U T (m V )POWER IN (dBm)V O L T A G E OU T (m V )0.3POWER IN (dBm)10130O U T P U T V O L T A G E (m V )TEMPERATURE (°C)Applications Information IntroductionAgilent’s HSMS-285x family of Schottky detector diodes has been developed specifically for low cost, high volume designs in small signal (P in < -20dBm) applica-tions at frequencies below1.5GHz. At higher frequencies, the DC biased HSMS-286x family should be considered.In large signal power or gain con-trol applications (P in>-20dBm), the HSMS-282x and HSMS-286x products should be used. The HSMS-285x zero bias diode is not designed for large signal designs. Schottky Barrier Diode CharacteristicsStripped of its package, a Schottky barrier diode chip consists of a metal-semiconductor barrier formed by deposition of a metal layer on a semiconductor. The most common of several different types, the passivated diode, is shown in Figure 5, along with its equivalent circuit.Figure 5. Schottky Diode Chip.R S is the parasitic series resistance of the diode, the sum of the bondwire and leadframe resistance, the resistance of the bulk layer of silicon, etc. RF energy coupled into R S is lost as heat—it does not contribute to the rectified output of the diode.C J is parasitic junction capaci-tance of the diode, controlled bythe thickness of the epitaxial layerand the diameter of the Schottkycontact. R j is the junctionresistance of the diode, a functionof the total current flowingthrough it.8.33 X 10-5n TR j = –––––––––––– = R V – R sI S + I b0.026= ––––– at 25°CI S + I bwheren = ideality factor (see table ofSPICE parameters)T = temperature in °KI S = saturation current (seetable of SPICE parameters)I b = externally applied biascurrent in ampsI S is a function of diode barrierheight, and can range frompicoamps for high barrier diodesto as much as 5 µA for very lowbarrier diodes.The Height of the SchottkyBarrierThe current-voltage characteristicof a Schottky barrier diode atroom temperature is described bythe following equation:V - IR SI = I S (exp (––––––) - 1)0.026On a semi-log plot (as shown inthe Agilent catalog) the currentgraph will be a straight line withinverse slope 2.3 X 0.026 = 0.060volts per cycle (until the effect ofR S is seen in a curve that droopsat high current). All Schottkydiode curves have the same slope,but not necessarily the same valueof current for a given voltage. Thisis determined by the saturationcurrent, I S, and is related to thebarrier height of the diode.Through the choice of p-type orn-type silicon, and the selection ofmetal, one can tailor the charac-teristics of a Schottky diode.Barrier height will be altered, andat the same time C J and R S will bechanged. In general, very lowbarrier height diodes (with highvalues of I S, suitable for zero biasapplications) are realized onp-type silicon. Such diodes sufferfrom higher values of R S than dothe n-type. Thus, p-type diodes aregenerally reserved for small signaldetector applications (where veryhigh values of R V swamp out highR S) and n-type diodes are used formixer applications (where highL.O. drive levels keep R V low).Measuring Diode ParametersThe measurement of the fiveelements which make up the lowfrequency equivalent circuit for apackaged Schottky diode (seeFigure 6) is a complex task.Various techniques are used foreach element. The task beginswith the elements of the diodechip itself.FOR THE HSMS-285x SERIESC P = 0.08 pFL P = 2 nHC j = 0.18 pFR S = 25 ΩR V = 9 KΩFigure 6. Equivalent Circuit of aSchottky Diode.jCROSS-SECTION OF SCHOTTKYBARRIER DIODE CHIP CIRCUITR S is perhaps the easiest tomeasure accurately. The V-I curve is measured for the diode under forward bias, and the slope of the curve is taken at some relatively high value of current (such as 5mA). This slope is converted into a resistance R d .0.026R S = R d – ––––––I fR V and C J are very difficult tomeasure. Consider the impedance of C J = 0.16 pF when measured at 1 MHz — it is approximately 1M Ω. For a well designed zero bias Schottky, R V is in the range of 5 to 25 K Ω, and it shorts out the junction capacitance. Moving up to a higher frequency enables the measurement of the capacitance,but it then shorts out the video resistance. The best measurement technique is to mount the diode in series in a 50 Ω microstrip test circuit and measure its insertion loss at low power levels (around -20 dBm) using an HP8753C network analyzer. The resulting display will appear as shown in Figure 7.I N S E R T I O N L O S S (d B )FREQUENCY (MHz)Figure 7. Measuring C J and R V .At frequencies below 10 MHz, the video resistance dominates the loss and can easily be calculated from it. At frequencies above300MHz, the junction capacitancesets the loss, which plots out as a straight line when frequency is plotted on a log scale. Again,calculation is straightforward.L P and C P are best measured on the HP8753C, with the diode terminating a 50 Ω line on the input port. The resulting tabula-tion of S 11 can be put into a microwave linear analysisprogram having the five element equivalent circuit with R V , C J and R S fixed. The optimizer can then adjust the values of L P and C P until the calculated S 11 matches the measured values. Note that extreme care must be taken to de-embed the parasitics of the 50Ω test fixture.Detector CircuitsWhen DC bias is available,Schottky diode detector circuits can be used to create low cost RF and microwave receivers with a sensitivity of -55 dBm to-57dBm.[1] These circuits can take a variety of forms, but in the mostsimple case they appear as shown in Figure 8. This is the basic detector circuit used with theHSMS-285x family of diodes.In the design of such detector circuits, the starting point is the equivalent circuit of the diode, as shown in Figure 6.Of interest in the design of the video portion of the circuit is the diode’s video impedance —the other four elements of the equiv-alent circuit disappear at all reasonable video frequencies. In general, the lower the diode’s video impedance, the better the design.RF IN The situation is somewhat more complicated in the design of the RF impedance matching network,which includes the package inductance and capacitance (which can be tuned out), the series resistance, the junction capacitance and the videoresistance. Of these five elements of the diode’s equivalent circuit,the four parasitics are constants and the video resistance is a function of the current flowing through the diode.26,000R V ≈ ––––––I S + I bwhereI S = diode saturation currentin µAI b = bias current in µA Saturation current is a function of the diode’s design,[2] and it is a constant at a given temperature.For the HSMS-285x series, it is typically 3 to 5 µA at 25°C.Saturation current sets the detec-tion sensitivity, video resistance and input RF impedance of the zero bias Schottky detector diode.[1] Agilent Application Note 923, Schottky Barrier Diode Video Detectors.[2] Agilent Application Note 969, An Optimum Zero Bias Schottky Detector Diode.Since no external bias is used with the HSMS-285x series, a single transfer curve at any given frequency is obtained, as shown in Figure2.The most difficult part of the design of a detector circuit is the input impedance matching network. For very broadband detectors, a shunt 60 Ω resistor will give good input match, but at the expense of detection sensitivity.When maximum sensitivity is required over a narrow band of frequencies, a reactive matching network is optimum. Such net-works can be realized in either lumped or distributed elements, depending upon frequency, size constraints and cost limitations, but certain general design principals exist for all types.[3] Design work begins with the RF impedance of the HSMS-285x series, which is given in Figure 9.Figure 9. RF Impedance of theHSMS-285x Series at -40dBm.915 MHz Detector Circuit Figure 10 illustrates a simple impedance matching network for a 915 MHz detector.VIDEOOUTDIMENSIONS ARE FORMICROSTRIP ON0.032" THICK FR-4.Figure 10. 915MHz MatchingNetwork for the HSMS-285x Seriesat Zero Bias.A 65 nH inductor rotates theimpedance of the diode to a pointon the Smith Chart where a shuntinductor can pull it up to thecenter. The short length of 0.065"wide microstrip line is used tomount the lead of the diode’sSOT-323 package. A shorted shuntstub of length <λ/4 provides thenecessary shunt inductance andsimultaneously provides thereturn circuit for the current gen-erated in the diode. The imped-ance of this circuit is given inFigure11.FREQUENCY (GHz): 0.9-0.93Figure 11. Input Impedance.The input match, expressed interms of return loss, is given inFigure 12.RETURNLOSS(dB)0.9-20FREQUENCY (GHz)0.915-10-150.93-5Figure 12. Input Return Loss.As can be seen, the band overwhich a good match is achieved ismore than adequate for 915 MHzRFID applications.Voltage DoublersTo this point, we have restrictedour discussion to single diodedetectors. A glance at Figure 8,however, will lead to the sugges-tion that the two types of singlediode detectors be combined intoa two diode voltage doubler[4](known also as a full wave recti-fier). Such a detector is shown inFigure 13.VIDEO OUTRF INFigure 13. Voltage Doubler Circuit.Such a circuit offers severaladvantages. First the voltageoutputs of two diodes are addedin series, increasing the overallvalue of voltage sensitivity for thenetwork (compared to a singlediode detector). Second, the RFimpedances of the two diodes areadded in parallel, making the jobof reactive matching a bit easier.[3] Agilent Application Note 963, Impedance Matching Techniques for Mixers and Detectors.[4] Agilent Application Note 956-4, Schottky Diode Voltage Doubler.[5] Agilent Application Note 965-3, Flicker Noise in Schottky Diodes.Such a circuit can easily be realized using the two series di-odes in the HSMS-285C.Flicker NoiseReference to Figure 5 will show that there is a junction of metal,silicon, and passivation around the rim of the Schottky contact. It is in this three-way junction that flicker noise [5] is generated. This noise can severely reduce the sensitivity of a crystal video receiver utilizing a Schottky detector circuit if the video frequency is below the noise corner. Flicker noise can be substantially reduced by the elimination of passivation, but such diodes cannot be mounted in non-hermetic packages. p-type silicon Schottky diodes have the least flicker noise at a given value of external bias (compared to n-type silicon or GaAs). At zero bias, such diodes can have extremely low values of flicker noise. For the HSMS-285x series,the noise temperature ratio is given in Figure 14.N O I S E T E M P E R A T U R E R A T I O (d B )FREQUENCY (Hz)Figure 14. Typical Noise Temperature Ratio.Noise temperature ratio is the quotient of the diode’s noise power (expressed in dBV/Hz) di-vided by the noise power of an ideal resistor of resistance R =R V .For an ideal resistor R, at 300°K,the noise voltage can be com-puted fromv = 1.287 X 10-10 √R volts/Hz which can be expressed as20 log 10 vdBV/HzThus, for a diode with R V = 9K Ω,the noise voltage is 12.2 nV/Hz or -158 dBV/Hz. On the graph of Figure 14, -158 dBV/Hz would replace the zero on the vertical scale to convert the chart to one of absolute noise voltage vs.frequency.Diode BurnoutAny Schottky junction, be it an RF diode or the gate of a MESFET, is relatively delicate and can be burned out with excessive RF power. Many crystal video receiv-ers used in RFID (tag) applica-tions find themselves in poorly controlled environments where high power sources may bepresent. Examples are the areas around airport and FAA radars,nearby ham radio operators, the vicinity of a broadcast band trans-mitter, etc. In such environments,the Schottky diodes of thereceiver can be protected by a de-vice known as a limiter diode.[6]Formerly available only in radar warning receivers and other high cost electronic warfare applica-tions, these diodes have been adapted to commercial and consumer circuits.Agilent offers a complete line of surface mountable PIN limiter diodes. Most notably, ourHSMP-4820 (SOT-23) can act as a very fast (nanosecond) power-sensitive switch when placedbetween the antenna and the Schottky diode, shorting out the RF circuit temporarily andreflecting the excessive RF energy back out the antenna.Assembly InstructionsSOT-323 PCB FootprintA recommended PCB pad layout for the miniature SOT-323 (SC-70)package is shown in Figure 15(dimensions are in inches). This layout provides ample allowance for package placement by auto-mated assembly equipment without adding parasitics that could impair the performance.Figure 16 shows the pad layout for the six-lead SOT-363.Figure 15. PCB Pad Layout (dimensions in inches).Figure 16. PCB Pad Layout (dimensions in inches).[6] Agilent Application Note 1050, Low Cost, Surface Mount Power Limiters.SMT AssemblyReliable assembly of surface mount components is a complex process that involves manymaterial, process, and equipment factors, including: method of heating (e.g., IR or vapor phase reflow, wave soldering, etc.)circuit board material, conductor thickness and pattern, type of solder alloy, and the thermalconductivity and thermal mass of components. Components with a low mass, such as the SOT packages, will reach solderreflow temperatures faster than those with a greater mass.Agilent’s diodes have beenqualified to the time-temperature profile shown in Figure 17. This profile is representative of an IR reflow type of surface mount assembly process.TIME (seconds)T E M P E R A T U R E (°C )05010015020025060120180240300Figure 17. Surface Mount Assembly Profile.After ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste)passes through one or morepreheat zones. The preheat zones increase the temperature of the board and components to prevent thermal shock and begin evapo-rating solvents from the solder paste. The reflow zone briefly elevates the temperature suffi-ciently to produce a reflow of the solder.The rates of change of tempera-ture for the ramp-up and cool-down zones are chosen to be low enough to not cause deformation of the board or damage to compo-nents due to thermal shock. The maximum temperature in the reflow zone (T MAX ) should not exceed 235°C.These parameters are typical for a surface mount assembly process for Agilent diodes. As a general guideline, the circuit board and components should be exposed only to the minimum temperatures and times necessary to achieve a uniform reflow of solder.Part Number Ordering InformationNo. of Part Number Devices Container HSMS-285x-TR2*1000013" Reel HSMS-285x-TR1*30007" Reel HSMS-285x-BLK *100antistatic bagwhere x = 0, 2, 5, B, C, L and P for HSMS-285x.For lead-free option, the part number will have the character "G" at the end, eg. HSMS-285x-TR2G for a 10,000 lead-free reel.Package DimensionsOutline 23 (SOT-23)Outline 143 (SOT-143)SIDE VIEWEND VIEWDIMENSIONS ARE IN MILLIMETERS (INCHES)DIMENSIONS ARE IN MILLIMETERS (INCHES)PACKAGE MARKING CODE (XX)Outline SOT-363 (SC-70 6 Lead)Outline SOT-323 (SC-70 3 Lead)0.25 (0.010)0.15 (0.006)0.30 (0.012)0.10 (0.004)0.425 (0.017)DIMENSIONS ARE IN MILLIMETERS (INCHES)0.30 (0.012)0.10 (0.004)0.425 (0.017)DIMENSIONS ARE IN MILLIMETERS (INCHES)Device OrientationUSER FEEDFor Outline SOT-143Note: "AB" represents package marking code. "C" represents date code.END VIEWTOP VIEW For Outlines SOT-23, -323Note: "AB" represents package marking code. "C" represents date code.END VIEWTOP VIEW END VIEWTOP VIEW Note: "AB" represents package marking code. "C" represents date code.For Outline SOT-363Tape Dimensions and Product OrientationFor Outline SOT-23DESCRIPTIONSYMBOL SIZE (mm)SIZE (INCHES)LENGTH WIDTH DEPTH PITCHBOTTOM HOLE DIAMETER A 0B 0K 0P D 1 3.15 ± 0.102.77 ± 0.101.22 ± 0.104.00 ± 0.101.00 + 0.050.124 ± 0.0040.109 ± 0.0040.048 ± 0.0040.157 ± 0.0040.039 ± 0.002CAVITYDIAMETER PITCH POSITION D P 0E 1.50 + 0.104.00 ± 0.101.75 ± 0.100.059 + 0.0040.157 ± 0.0040.069 ± 0.004PERFORATIONWIDTH THICKNESSW t18.00 + 0.30 – 0.100.229 ± 0.0130.315 + 0.012 – 0.0040.009 ± 0.0005CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION)CAVITY TO PERFORATION (LENGTH DIRECTION)F P 23.50 ± 0.052.00 ± 0.050.138 ± 0.0020.079 ± 0.002DISTANCE BETWEEN CENTERLINEFor Outline SOT-1431DESCRIPTIONSYMBOL SIZE (mm)SIZE (INCHES)LENGTH WIDTH DEPTH PITCHBOTTOM HOLE DIAMETER A 0B 0K 0P D 1 3.19 ± 0.102.80 ± 0.101.31 ± 0.104.00 ± 0.101.00 + 0.250.126 ± 0.0040.110 ± 0.0040.052 ± 0.0040.157 ± 0.0040.039 + 0.010CAVITYDIAMETER PITCH POSITION D P 0E 1.50 + 0.104.00 ± 0.101.75 ± 0.100.059 + 0.0040.157 ± 0.0040.069 ± 0.004PERFORATIONWIDTH THICKNESSW t18.00 + 0.30 – 0.100.254 ± 0.0130.315+ 0.012 – 0.0040.0100 ± 0.0005CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION)CAVITY TO PERFORATION (LENGTH DIRECTION)F P 23.50 ± 0.052.00 ± 0.050.138 ± 0.0020.079 ± 0.002DISTANCE/semiconductorsFor product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (65) 6756 2394India, Australia, New Zealand: (65) 6755 1939Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only)Korea: (65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines,Indonesia: (65) 6755 2044Taiwan: (65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc.Obsoletes 5968-7457E March 24, 20045989-0479ENTape Dimensions and Product OrientationFor Outlines SOT-323, -363(CARRIER TAPE THICKNESS)(COVER TAPE THICKNESS)DESCRIPTIONSYMBOL SIZE (mm)SIZE (INCHES)LENGTH WIDTH DEPTH PITCHBOTTOM HOLE DIAMETER A 0B 0K 0P D 1 2.40 ± 0.102.40 ± 0.101.20 ± 0.104.00 ± 0.101.00 + 0.250.094 ± 0.0040.094 ± 0.0040.047 ± 0.0040.157 ± 0.0040.039 + 0.010CAVITYDIAMETER PITCH POSITION D P 0E 1.55 ± 0.054.00 ± 0.101.75 ± 0.100.061 ± 0.0020.157 ± 0.0040.069 ± 0.004PERFORATIONWIDTH THICKNESS W t 18.00 ± 0.300.254 ± 0.020.315 ± 0.0120.0100 ± 0.0008CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION)CAVITY TO PERFORATION (LENGTH DIRECTION)F P 2 3.50 ± 0.052.00 ± 0.050.138 ± 0.0020.079 ± 0.002DISTANCEFOR SOT-323 (SC70-3 LEAD)An8°C MAX FOR SOT-363 (SC70-6 LEAD)10°C MAXANGLEWIDTHTAPE THICKNESS C T t 5.4 ± 0.100.062 ± 0.0010.205 ± 0.0040.0025 ± 0.00004COVER TAPE。
2855中文资料
Zoom® ComStar TM 56KSpeakerPhone/FaxModemA Complete CommunicationsCenter For Your Computer!The Zoom ComStar 56K Model 2818 for PC-compatible computers combines a full-featured V.34modem capable of 56,000 Kbps Internet and centralsite downloads with a powerful voice mail system,digital answering machine, 14,400 bps fax, convenientspeed dialer, and a synchronous interface supportingthe ITU H.324 videophone technology standard. It isPlug and Play compatible for easy installation underMicrosoft® Windows® 95 and is also softwareconfigurable.The Zoom ComStar 56K comes complete with a high-quality external microphone and speaker. It comeswith Cheyenne® BitWare® Fax/Voice/Data forWindows; ZOOM/LINK® CD-ROM with modem-enabled games, conferencing software, supportinformation, and more.About the Zoom ComStar 56KZoom ComStar 56K Speakerphone/FaxModem transforms your ordinary computer into anextraordinary telecommunications tool. ComStar 56K (internal) Model 2818 for PC-compatible computers is a high-speed V.34 faxmodem that can download data from compatible sites atspeeds up to 56,000 bps and at higher speeds with compression for fast Internet and LAN access.It combines a full-featured K56flex TM faxmodem, 14,400 bps fax, and full-duplex speakerphone over conventional telephone lines and features flash memory and reprogrammable DSP fordownloading feature enhancements and upgrades to future standards with simple softwarecommands. Other advanced features include a synchronous interface supporting the ITU H.324 videophone technology standard,* digital answering machine, voice mail, convenient speeddialer, and Plug-and-Play compatibility for easy installation. The Zoom ComStar 56K comescomplete with a high-quality external microphone and speaker, and all necessary software. ComStar 56K is built in the U.S.A. by Zoom Telephonics, Inc., a leading supplier of telecommunications equipment since 1977 and is backed by Zoom's outstanding 7-year warranty. Featuresr K56flex technology for 56,000 bps data downloads from compatible sitesr33,600 bps V.34 data transmission speedr14,400 bps Group 3, Class 1 and 2 faxr V.42bis and MNP 5 compression for data speeds up to 230,400 bpsr Reprogrammable Digital Signal Processor (DSP) enables easy software upgradeability to assure superior interoperability and overall performance and easy upgrades to futurestandards.r Flash memory for easy firmware upgradesr56K Faxmodem: Connect to the Internet, World Wide Web and on-line services, anddownload files fast and error-free at up to 56,000 bps with K56flex, the joint development of Rockwell and Lucent Technologies. Send "printer-quality" faxes direct from your PC, plus faxback and fax-on-demand.r Speakerphone: For "hands-free" communications and conference calls. True full-duplex speakerphone lets callers on both ends talk at the same time for natural conversation.r Videophone-Ready: Supports the ITU H.324 video technology standard and H.324compliant software from Intel, PictureTel, VDONet, Smith Micro, and others.*r Digital Answering Machine: An easy-to-use personal answering machine with high-quality recording and playback, pager notification, and other advanced features.r Voice Mail: A full-featured, configurable voice mail system for home or office withmultiple mailboxes, fax-on-demand, and remote retrieval of messages.r Other Features: Plug-and-Play with Windows 95 computers (software configurable also), VoiceView® compatibility, Directory Dialing, Distinctive Ring,** Caller ID,** andZoomGuard lightning protection.Technical SpecificationsData Speeds:r300 to 33,600 bps full-duplex with international standardsr Up to 56,000 bps receive/33,600 bps send with K56flexFax Speeds:r 300 to 14,400 bpsr Group 3, Class 1 and Class 2Standards Supported:r Data: K56flex, V34, V.32bis, V.32, V.22bis, V.22 A/B, V.22, V.23, V.21, Bell 103/212Ar Fax: V.33, V.29, V.17, V.27ter, V.21 channel 2Compression: V.42bis, MNP 5r Error Control: V.42, MNP 2 - 4, MNP 10 and MNP 10ECr Plug and Playr AT and extended AT command set compatibleCommand Set:Hayes AT-Command compatible, with extended MNP 5, MNP 10, and V.42bis commandsVoice Encoding:Enhanced ADPCM, programmable at 2 or 4 bits per sampleSpeakerphone:Full-duplex with microphone and speaker included; headset capability; software volume controlInterface:Plug and Play; COM1 - COM8, IRQ, 3, 4, 5, 7, 9, 10, 12, 15 supports TAPIVideoconferencing enabled:Synchronous interface supports ITU H.324 standard for videoconferencing applications.*Hardware Features:r Dual RJ-11 telephone jacks one for phone line, one for optional phoner Output jack for external 8 ohm audio speaker (8 ohm external speaker included)r Input jack for external microphone (microphone included)r Jumper-selectable electret microphone biasr Telephone cable with RJ-11 connectorsr Buffered 16550 UART to reduce PC interrupts and boost performancer Handset record and playbackDimensions and Power Requirements:r Dimensions: standard IBM PC board 2.7 in. W by 5.4 in. L by 0.75 in. H (fits 16-bit PC-compatible slot)r Power consumption: 1.5W typicalSystem Requirements:r486 or faster PC compatible computer with 1 available 16-bit ISA slotr8 MB RAMr 3.5 in. floppy driver Hard drive with a minimum of 5 MB available r Microsoft Windows 3.1 or higherr Mouse recommendedRegulatory Approvals:rFCC Parts 15B and 68 r UL, C-ULr Industry CanadaWarranty:Warranted against defects in material andworkmanship for a period of seven years from the date of original retail purchase* Requires video camera and video capture support, sound card with microphone input, ITU H.324-compliant videoconferencing application, and appropriate computer and operating system to run the application.** Requires Distinctive Ring or Caller ID support from local telephone company.Zoom Telephonics, Inc.207 South Street Boston, MA 02111617 423-1072800 631-3116Fax: 617 423-3923Web Site: BBS: 617 423-3733Nasdaq: ZOOMZoom is a registered trademark and ComStar, Zoom/FaxModem, ZoomGuard are trademarks of Zoom Telephonics, Inc. K56flex is a trademark of Rockwell International Corporation and Lucent Technologies, Inc. Windows is a registered trademark of Microsoft. MNP is a registered trademark and MNP 10EC is a trademark of Microcom Inc. All other registered trademarks and trademarks are the property of their respective owners.Made in the U.S.A.©2000 Zoom Telephonics, Inc.1777。
hardox的hs编码
hardox的hs编码Hardox是由瑞典SSAB公司开发和生产的一种高强度耐磨钢板。
HS 编码(Harmonized Commodity Description and Coding System)是全球通用的商品编码系统,由国际货物贸易领域的组织和专家共同制定,旨在为国际商品贸易提供一个统一的商品编码标准。
Hardox的HS编码是如何确定的呢?HS编码是根据商品的特征、用途、材料、加工方式等一系列因素来确定的。
Hardox是一种高强度耐磨钢板,根据其特性和用途,可以归类为钢材和金属制品的一种。
根据我了解,Hardox的HS编码应该是72109000。
7210代表了钢铁及其制品,90代表了其他。
这个编码可以用来区分其他类型的钢板,并且更具体地描述了Hardox的特性。
简单来说,这个编码告诉我们Hardox是一种具有特殊特性的钢板。
Hardox钢板具有很多优点,因此在许多行业中得到了广泛的应用。
首先,Hardox钢板具有出色的耐磨性能。
它具有非常高的硬度,可以抵抗重物刮擦和磨损,能够承受恶劣的工作环境。
其次,Hardox钢板具有良好的强度,具有高抗拉强度和高弯曲强度,能够承受高负荷和冲击力。
此外,Hardox钢板还具有良好的冷弯和焊接性能,可以根据不同的需求进行加工和制造。
因为Hardox钢板具有这些优异的性能,它在许多领域得到了广泛的应用。
在采矿行业中,Hardox钢板可以用于挖掘机、装载机、运输车等装备的磨损部位,延长设备的使用寿命。
在建筑和工程领域,Hardox钢板可以用于制造混凝土搅拌机的搅拌叶片和耐磨板,耐用而且具有良好的搅拌效果。
在港口和船舶行业,Hardox钢板可以用于制造装卸设备的耐磨部件,提高装卸效率和设备的寿命。
在冶金和钢铁行业,Hardox钢板可以用于制造高温环境下的耐磨件,如渣车和炼钢设备的内衬板。
此外,Hardox钢板还可以用于制造石料破碎机的锤头,提高破碎效率和破碎机的寿命。
FR28中文资料
Data Sheet
2.0 Amp FAST RECOVERY PLASTIC RECTIFIERS
Mechanical Dimensions
JEDEC D0-15
.104 .140 .230 .300 1.00 Min.
FR20 . . . 210 Series
Non-Repetitive Peak Forward Surge Current Peak Forward Surge Current (A) 100
Forward Current Derating Curve 2 Average Forward Current (A) 1.5
1 .5 0
10
1
1
NOTES: 1. Measured @ 1 MHz and applied reverse voltage of 4.0V. 2. Thermal Resistance Junction to Ambient, Jedec Method.
Page 4-11
FR20 . . . 210 Series
Description
.031 typ.
Features
n FAST SWITCHING FOR HIGH EFFICIENCY n HIGH SURGE CAPABILITY n 2.0 AMP OPERATION @ TA = 55°C, WITH NO THERMAL RUNAWAY n MEETS UL SPECIFICATION 94V-0
TJ = 25°C
Typical Junction Capacitance 100 50
10
Junction Capacitance (pF)
10
ICX285AL中文资料
Item
VDD, VOUT, φRG – φSUB
Vφ2A, Vφ2B – φSUB
Against φSUB
Vφ1, Vφ3, Vφ4, VL – φSUB
Hφ1, Hφ2, GND – φSUB
CSUB – φSUB
VDD, VOUT, φRG, CSUB – GND
Against GND
Vφ1, Vφ2A, Vφ2B, Vφ3, Vφ4 – GND
• High horizontal and vertical resolution (both approximately 1024 TV-lines) still images without a mechanical
shutter
• Supports high frame rate readout mode (effective 256 lines output, 60 frame/s)
Sony reserves the right to change products and specifications without prior notice. This information does not convery any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
HSMS-2850中文资料
SIDE VIEW
0.69 (0.027) 0.45 (0.018)
END VIEW
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Outline 143 (SOT-143)
0.92 (0.036) 0.78 (0.031)
PACKAGE MARKING CODE
E
C
XX
TOP Operating Temperature -65°C to 150°C -65°C to 150°C
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage to the device. 2. CW Power Dissipation at TLEAD = +25°C. Derate linearly to zero at
元器件交易网
元器件交易网
元器件交易网
3
Absolute Maximum Ratings, Ta = +25°C, Single Diode
Symbol
Parameter
Absolute Maximum[1]
HSMS-285x HSMS-286x
Device Orientation
REEL
Alloy 42 Tin-Lead 85/15% 260°C for 5 sec.
2 pounds pull 2 nH (opposite leads) 0.08 pF (opposite leads)
USER FEED DIRECTION
CARRIER TAPE
0.15 (0.006) 0.09 (0.003)
海风差速锁产品型号及应用车型
温岭市海风差速器有限公司弹簧NissanVehicle/ Model AxleLoc'n Year Description ShaftDiameterShaftSplineRatio OFF-ROADPart No.Nissan Y60,Y61Front升高3英寸弹簧HF412 Rear 升高3英寸弹簧HF415Final reduction gear盆骨齿Vehicle/ Model AxleLoc'n Year Description ShaftDiameterShaftSplineRatio OFF-ROADPart No.Suzuki Front Final reduction gear(盆骨齿)10 bolt RG4.625 HFCS837-10-leftFront Final reduction gear(盆骨齿)8 bolt RG4.625 HFCS837-8-leftRear Final reduction gear(盆骨齿)10 bolt RG4.625 HFCS837-10-right海风差速锁产品型号及应用车型Mitsubishi(三菱)Nissan(日产)HoldenISUZU(五十铃)Suzuki(铃木)SantanaDodge(道奇)SsangYong(双龙)Ford(福特)Land Rover(路虎)Mazda(马自达)Hyundai(现代)UAZ国产切诺基牧马人三菱陆霸中兴长城系列郑州日产Roewe(荣威)Hyundai(现代)KIAChrysler or Jeep(克莱斯勒、北京JEEP)黄海福田曙光(黄海)双环华泰奇瑞角斗士Mitsubishi(三菱)APPLICATIONS BY PART NUMBERARB Part No. Description Splines Ratio Superseded Part #(s) RD01(RD132) Toyota8”,45mm carrier bearing 30 AllRD02(RD142) Toyota8 7/8”,45mm carrier bearing 30 AllRD03(RD127) Land Rover,10 SPL,Banjo 10 3.54RD04(RD134) Nissan,H233,31 SPL(thrust block) 31 AllRD05 Mitsubishi 8",RR,28 SPL 28 All RD210RD06(RD116) Dana 44,30 SPL,3.92&UP 30 3.92&UPRD07(RD117) Dana 44,30 SPL,3.73&DN 30 3.73&DNRD08(RD153) Toyota8 7/8”,C-clip 30 AllRD09(RD136) Nissan,H233B,31 SPL 31 AllRD17(RD135) Nissan,H233B,33 SPL,disc brake 33 AllRD20(RD161) Land Rover,Salisbury,3.54:1 24 3.54RD21(RD162) Dana 60,30 SPL,4.56 & UP 30 4.56 & UPRD22(RD163) Dana 60,30 SPL,4.10 & DN 30 4.10 & DNRD23(RD132) Toyota8”,50mm carrier bearing 30 AllRD24(RD135) Nissan,H233B,33 SPL,drum brake 33 AllRD25(RD46) Mitsubishi Montero,RR(large),dics brake 28 AllRD27(RD107) Nissan C200,29 SPL 29 AllRD32(RD160) Land Rover,Salisbury,4.70:1 24 4.7RD33(RD142) Toyota8 7/8”,50mm carrier bearing 30 AllRD35(RD166) Dana 60HD,35 SPL,4.56&UP 35 4.56&UPRD36(RD167) Dana 60HD,35 SPL,4.10&DN 35 4.10&DNRD42(RD168) Dana 60HD,C-clip,35 SPL,4.56 & UP 35 4.56 & UPRD43(RD163) Dana 60HD,C-clip,35 SPL,4.10 & DN 35 4.10 & DNRD44 Isuzu,RR,26SPL 26 All RD213RD46 Mitsubishi 9",RR,28 SPL 28 All RD212RD56(RD128) Land Rover,24 SPL,Banjo 24 AllRD57(RD138) Land Rover,24 SPL,Banjo,T/C 24 AllRD72(RD208) Suzuki 26 SPL,10 bolt RG 26 AllRD74(RD204) Suzuki Sidekick,RR,26 SPL,10bolt RG 26 AllRD75 Suzuki Sidekick,FR,22 SPL 22 All RD205RD78A(RD136) Nissan,H233B,FR,31 SPL 31 AllRD79(RD209) Suzuki Vitara,RR,26 SPL,12 bolt RG 26 AllRD87(RD207) Suzuki Jimny, FR,22 SPL 22 AllRD88(RD208) Suzuki Sidekick,FR,26 SPL 26 AllRD90 Toyota 7.5" IFS 27 AllRD93 Chrysler 8.25",29 SPL 29 AllRD95(RD164) Dana 60,32 SPL,4.56 &UP 32 4.56 &UPRD96(RD165) Dana 60,32 SPL,4.10 &DN 32 4.10 &DNRD100 Dana 30,27 SPL,3.73 & UP 27 3.73& UP RD30RD100-1 Roewe W5,27 SPL,3.73 & UP 27 3.73& UPRD101 Dana 30,27 SPL,3.54 & DN 27 3.54&DN RD31RD102 Dana 35,27 SPL,3.54 & UP 27 3.54& UP RD49,RD59,RD69 RD103 Dana 35,27 SPL,3.31 & DN 27 3.31&DN RD48,RD58,RD68 RD104 Dana 30,30SPL,3.73 & UP 30 3.73 & UPRD105 Dana 35,30 SPL,3.54 & UP 30 3.54 & UPRD107 Nissan C200/R200A,29 SPL 29 AllRD109 Dana 44,35SPL,3.92& UP 35 3.92& UPRD110 Mitsubishi IFS,28 SPL 28 AllRD111 Toyota 8” IFS,53mm BRNG 30 3.91 & UPRD112 Chrysler 8.25”,27 SPL 27 AllRD116 Dana 44,30 SPL,3.92 & UP 30 3.92& UP RD06RD117 Dana 44,30 SPL,3.73 & DN 30 3.73&DN RD07RD117-1 Roewe W5,30 SPL,3.73 & DN 30 3.73&DNRD118(RD206) Suzuki Jimny, FR,22 SPL,10 bolt RG 22 AllRD119 Ford 9”,31 SPL 31 AllRD121 Toyota 8" IFS,53mm BRNG 30 3.73&DNRD124(RD153) Toyota 8.9”,C-clip,50mm BRNG 30 AllRD128 Land Rover,24 SPL,Banjo 24 All RD56RD132 Toyota 8",50mm BRNG 30 All RD01,RD23RD134 Nissan H233,31 SPL 31 All RD04RD135 Nissan H233B,33 SPL 33 All RD17,RD24RD136 Nissan H233B,31 SPL 31 All RD09,RD78,RD78A RD138 Land Rover,24 SPL,Banjo,P38A 24 All RD57RD142 Toyota 8.9",50mm BRNG 30 All RD02,RD33RD143 Dana 44,32SPL,3.73&DN 32 3.73&DNRD147 Dana 44,35SPL,3.73&DN 35 3.73&DNRD152 Toyota 9.5”,32SPL 32 AllRD153 Toyota 8.9",C-clip,50mm BRNG 30 All RD08,RD124RD154 Mitsubishi 9.5",31 SPL,LIVE AXLE 31 AllRD155 Mitsubishi 9.5",33 SPL,IRS 33 AllRD156 Hyundai 9.5",34 SPL,LIVE AXLE 34 AllRD160 Land Rover,Salisbury,4.70:1 24 4.7 RD32RD161 Land Rover,Salisbury,3.54:1 24 3.54 RD20RD162 Dana 60,30SPL,4.56&UP 30 4.56&UP RD21RD163 Dana 60,30SPL,4.10&DN 30 4.10&DN RD22RD164 Dana 60,32SPL,4.56&UP 32 4.56&UP RD95RD165 Dana 60,32SPL,4.10&DN 32 4.10&DN RD96RD166 Dana 60HD,35 SPL,4.56 & UP 35 4.56& UP RD35RD167 Dana 60HD,35 SPL,4.10 & DN 35 4.10&DN RD36RD168 Dana 60HD,C-clip,35 SPL,4.56 & UP 35 4.56& UP RD42RD169 Dana 60HD,C-clip,35 SPL,4.10 & DN 35 4.10&DN RD43RD193 Toyota 8.25" RR,12 Bolt RG,shim adjusted 30 AllRD201 Nissan C200,31 SPL 31 All Rd106RD202 Nissan C200/R200A,29 SPL 29 All RD27,RD107 RD203 Isuzu IFS,17 SPL 17 All RD94RD204 Suzuki Vitara,RR,26 SPL,10 bolt RG 26 All RD74RD205 Suzuki,FR,22 SPL,10 bolt RG 22 All RD73,RD75 RD206 Suzuki Jimny,FR,22 SPL,10 bolt RG 22 All RD118RD207 Suzuki Jimny,FR,22 SPL,8 bolt RG 22 All RD77,RD87 RD208 Suzuki,26 SPL,10 bolt RG 26 All RD72,RD88 RD209 Suzuki Vitara,RR,26 SPL,12 bolt RG 26 All RD79RD210 Mitsubishi 8",RR,28 SPL 28 All RD05RD212 Mitsubishi 9",RR,28 SPL 28 All RD46RD213 Isuzu,RR,26 SPL 26 All RD44Wenling Hai FengGENERAL NOTES:While every effort has been made to ensure TBD ' refers to information that is still yet 'To Be Determined' at the time this list was last updated.that this list is accurate, Wenling Hai Feng Corporation Ltd. & UP' following the ratio means that the Air Locker is suitable for thestated ratio and thosecannot possibly guarantee its accuracy or which are numerically higher.completeness given the large number of vehicle & DN ' following the ratio means that the Air Locker is suitable for the stated ratio and t hosemakes, models, and option variations, and which are numerically lower.therefore it is the client's responsibility to RG' refers to the 'Ring Gear' or 'crown wheel' of the vehicle.establish the correct model Air Locker dia RG' refers to the outside diameter taken over the outside of the ring gear teeth.for their application. SPL' refers to the spline count of the axle shaft.FR' refers to front axle application.While ARB supplies Air Lockers for the front of RR' refers to rear axle application.many vehicles, they should only be engaged IFS' refers to independent front suspension.for off-highway use only. BRNG' refers to carrier bearing inside diameter.LSD' refers to vehicles originally equipped with a 'Limited Slip Differential'.Year xxxx on' refers to model years up to the revision date of this printing of the chart.。
hsla 钢种介绍
hsla 钢种介绍摘要:一、HSLA 钢的概述1.1 HSLA 钢的定义1.2 HSLA 钢的特点1.3 HSLA 钢的合金元素及含量二、HSLA 钢的生产工艺2.1 热轧2.2 冷轧2.3 热处理2.4 焊接三、HSLA 钢的应用领域3.1 桥梁建设3.2 压力容器3.3 重型机械3.4 船舶3.5 建筑正文:一、HSLA 钢的概述HSLA 钢,即高强度低合金钢,是一种具有优秀性能的钢材。
它的强度、韧性、耐磨性和焊接性能都得到了广泛认可,使得它在各种领域都有着广泛的应用。
HSLA 钢的主要合金元素包括碳、锰、钼、铬和镍。
碳的含量一般在0.10% 至0.25% 之间,锰的含量在1.0% 至1.5% 之间,钼和铬的含量分别为0.4% 至0.6% 和0.3% 至0.5%,镍的含量则根据不同的HSLA 钢种而有所不同。
这些元素的比例和配比,都对HSLA 钢的性能起着至关重要的作用。
二、HSLA 钢的生产工艺HSLA 钢的生产工艺主要包括热轧、冷轧、热处理和焊接等。
热轧和冷轧是生产HSLA 钢的主要方式,通过轧制,可以改变钢材的形状和尺寸。
热处理工艺对HSLA 钢的性能起着至关重要的作用。
通常采用淬火+ 回火的热处理工艺,以获得最佳的强度和韧性。
焊接则是HSLA 钢在实际应用中必不可少的环节,通过焊接,可以使HSLA 钢形成各种复杂的结构和形状。
三、HSLA 钢的应用领域HSLA 钢的应用领域广泛,其中桥梁建设是其最重要的应用之一。
由于HSLA 钢具有高强度、良好的韧性和耐磨性,因此在桥梁的建造中可以大大减轻结构重量,提高桥梁的抗风能力和使用寿命。
hsla80h密度
hsla80h密度全文共四篇示例,供读者参考第一篇示例:HSLA80H密度是指高强度低合金(High Strength Low Alloy,简称HSLA)80级的钢材密度,是一种重要的金属材料。
它具有优异的力学性能和耐腐蚀性能,广泛应用于工程领域,如建筑结构、船舶制造、汽车制造等。
本文将从HSLA80H密度的定义、性能特点、应用领域和未来发展方向等方面进行探讨。
一、HSLA80H密度的定义HSLA80H是指含有一定比例的合金元素(低合金)的高强度钢材,其材质为HSLA级别的80级。
在HSLA80H钢材中,主要合金元素通常包括硼、钒、钼、铬等,通过这些合金元素的添加,使得钢材在保持一定的强度的具有较高的韧性和变形性,从而提高了其加工可塑性和抗疲劳性能。
HSLA80H密度一般介于7.85~7.87g/cm³之间,具有适中的密度,可以有效降低结构的自重,提高整体的强度和稳定性,是一种理想的工程结构材料。
1. 高强度:HSLA80H钢材具有优异的抗拉强度和屈服强度,通常能够达到800MPa以上的抗拉强度,因此可以在极端的工作环境下保持结构的稳定性和安全性。
2. 良好的可加工性:由于含有合金元素的添加,HSLA80H钢材具有较高的可塑性和冷变形性,可以通过各种加工工艺进行成型,满足不同结构设计的需求。
3. 耐腐蚀性:HSLA80H钢材具有良好的抗腐蚀性能,能够抵抗大气、水、化学腐蚀等多种环境侵蚀,适用于各种恶劣工作条件下的使用。
4. 焊接性好:HSLA80H钢材具有良好的焊接性,可以通过常规的焊接工艺进行连接,保证结构的连接牢固性和可靠性。
5. 环保节能:HSLA80H钢材采用低合金设计,减少了对资源的浪费,同时也符合环保要求,是一种绿色的材料选择。
1. 建筑结构:HSLA80H钢材在大型建筑工程中广泛应用,如高层建筑、桥梁、钢结构厂房等,能够满足对结构强度和稳定性的要求。
2. 船舶制造:HSLA80H钢材具有良好的耐海水腐蚀性能,适用于船舶的各类结构部件,如船体、船舱等。
hslas grade55参数
恰如其名,“HSLA”代表高强度低合金钢,它们的力量和成形性远远超出了一般的碳钢。
其中HSLA Grade 55是其中一种类型。
HSLA钢的参数对于钢铁工业来说至关重要,因为它决定了钢材的性能、用途和成本,同时也在工程领域扮演着至关重要的角色。
本文将深入探讨HSLA Grade 55参数的含义、应用以及对工程领域的影响。
1. HSLA Grade 55参数的含义HSLA Grade 55指的是一种具有55ksi(约380MPa)抗拉强度的高强度低合金钢。
除了抗拉强度之外,HSLA Grade 55的参数还包括屈服强度、延伸率和冲击韧性等。
这些参数决定了钢材在不同条件下的表现,对于工程设计和制造来说至关重要。
2. 应用领域HSLA Grade 55广泛应用于建筑工程、汽车制造、桥梁建设、输送管道等多个领域。
由于其优异的强度和成形性能,HSLA Grade 55能够减少材料用量、降低工程成本、提高结构稳定性,因此备受工程师和设计师的青睐。
3. 对工程领域的影响HSLA Grade 55的参数对工程领域有着深远的影响。
它可以改变工程设计的方式,使得结构更加紧凑轻量,同时又不牺牲强度和稳定性。
HSLA Grade 55的参数还影响着工程制造和施工的方法,因为它要求更高的成形技术和焊接工艺,这对各个环节的工程师都提出了更高的总结:HSLA Grade 55参数代表了一种高强度低合金钢的性能和特点,它在工程领域有着广泛的应用,对工程设计、制造和施工都有着深远的影响。
了解和掌握HSLA Grade 55的参数对于工程领域的专业人士来说至关重要,因为它关乎到工程的质量、成本和可持续发展。
希望本文能够帮助读者更加全面、深刻并且灵活地理解HSLA Grade 55参数的重要性和价值。
个人观点:作为一名工程师,我深知HSLA Grade 55参数对于工程的重要性。
它不仅代表了材料本身的性能,更是工程设计创新和成本控制的关键。
世界各大测井集团仪器编码表
世界各大测井集团仪器编码表BAKER ATLAS WIRELINE (贝克休斯公司-电缆测井)3DEX 3D Induction Logging Service (三维感应)AC BHC Acoustilog (井眼补偿声波)CAL Caliper (井径)CBIL Circumferential Borehole Imaging Log (井周成像测井)CDL Compensated Density Log (补偿密度测井)CN Compensated Neutron Log (补偿中子测井)DAC Digital Array Acoustilog (数字阵列声波测井)DAL Digital Acoustilog (数字声波测井)DEL2 Dielectric Log - 200 Mhz (介电测井-200兆赫)DEL4 Dielectric Log - 47 Mhz (介电测井-47兆赫)DIFL Dual Induction Focused Log (双感应聚聚测井)DIP High Resolution 4-Arm Diplog (高分辨率4臂地层倾角)DLL Dual Laterolog (双侧向测井)DPIL Dual Phase Induction Log (双相位感应测井)EI Earth Imager (地层成像仪)FMT Formation Multi-Tester (地层多功能测试器)GR Gamma Ray (伽马仪)HDIL_BA High-Definition Induction Log (高分辨率感应测井)HDIP Hexagonol Diplog (六臂倾角测井)HDLL High-Definition Lateral Log (高分辨率侧向测井)ICAL Imaging Caliper (井径成像仪)IEL Induction Electrolog (感应-电测井)ISSB Isolation Sub - Spontaneous Potential (自然电位隔离短节)MAC Multipole Array Acoustilog (多极子阵列声波测井)MAC2 Multipole Array Acoustilog (多极子阵列声波测井2)MFC Multi-Finger Caliper (多臂井径仪)ML Minilog (微电极测井仪)MLL Micro Laterolog (微侧向)MREX Magnetic Resonance Explorer Imaging Log (核磁共振探测成像测井)MRIL Magnetic Resonance Imaging Log (核磁共振成像测井)MSL Micro Spherical Laterolog (微球侧向测井)ORIT Directional Survey (井斜方位测井仪)PDK PDK-100PROX Proximity Log (邻近侧向测井仪)RCI Reservoir Characterization Instrument (储层特征描述仪)RCOR Rotary Sidewall Coring Tool (钻进式井壁取心器)RPM Reservoir Performance Monitor (油藏动态监测仪)SBT Segmented Bond Tool (分区水泥胶结测井仪)SL Spectralog (能谱仪)SP Spontaneous Potential (自然电位)STAR Simultaneous Acoustic and Resistivity Imager (声波电阻联合成像仪) SWC Sidewall Coregun (井壁取心器)SYST Surface System (地面系统)TBRT Thin-Bed Resistivity (薄层电阻率)TTRM Temperature/Tension/Mud Resistivity Sub (温度张力泥浆电阻率短节)VS Velocity Survey (速度测量仪)VSP Vertical Seismic Profile (垂直地震剖面)WTS ECLIPS WTS Downhole Common Remote (ECLIPS 井下通用遥传)XMAC Cross-Multipole Array Acoustilog (交叉多极子阵列声波)XMAC-E XMAC Elite (Next generation XMAC) (特种交叉多极子声波)ZDL Compensated Z-Densilog (补偿Z-密度)BAKER INTEQ(贝克休斯INTEQ公司.-随钻测井)AP Annular Pressure (环空压力仪)APX Accoustic Porosity Explorer (声波孔隙度探测仪)CCN Caliper Corrected Neutron (井径校正中子)DIR Directional (定向仪)DPRT Deep Propagation Resistivity (深传播电阻率)FMT Formation Multi-Tester (地层多功能测试器)GR Gamma Ray (伽马仪)MPR Multiple Propogation Resistivity (多传播电阻率)MRT Magnetic Resonance (核磁共振)ORD Compensated Bulk Density(补偿体积密度)RIT Resistivity Imaging (电阻率成像仪)VSS Vibration and Stick Slip (振动蠕动仪)COMPUTALOG 公司AZD Azimuthal Density (方位密度)BCS Borehole Compensated Sonic (井眼补偿声波)CAL Caliper (井径)CDT Compensated Density (补偿密度)CNT Compensated Neutron (补偿中子)DAR Digital Acoustic Tool (数字声波)DLL Dual Laterolog (双侧向测井)DTD Tension Compression (张/压力计)FED Four Electrode Dipmeter (四电极倾角)GR Gamma Ray (伽马仪)GRN Gamma Ray Neutron (伽马中子)HADR High Temperature Azimuthal Gamma Ray (高温方位伽马)HBC High Resolution Borehole Sonic 高分辨率井眼声波)HMI High Resolution Micro Imager (高分辨率微成像)IEL Induction Electric Log (感应测井)MAN Multi Array Neutron (阵列中子)MDA Monopole Dipole Acoustic (单偶极子声波)MEL Micro Electric Log (微电极测井)MFR Multi Frequency Resistivity (多频电阻率测井)MRT400 Micro Resistivity Tool (微电阻率测井仪)MSC Multi Sensor Caliper (多探头井径)MSFL Micro Spherically Focused Log (微球型聚焦测井)NMRT Nuclear Magnetic Resonance Tool (核磁共振测井)NTT Single Detector Neutron (单探头中子)PND Pulsed Neutron Decay (脉冲中子衰变)(中子寿命)RSCT Rotary Sidewall Coring Tool (钻进式井壁取心器)SAGR Spectral Azimuthal Gamma Ray (方位能谱伽马)SED Six Electrode Dipmeter (六电极倾角)SFT Selective Formation Tester (选择性地层测试器)SGR Spectral Gamma Ray (能谱伽马)SP Spontaneous Potential (自然电位)SPeD Spectral Pe Density (能谱Pe密度)STI Simultaneous Triple Induction (联合三感应)TEN Tension (张力计)TNP Thermal Neutron Porosity (热中子孔隙度)HALLIBURTON(哈里伯顿公司.电缆测井)BCS Borehole Compensated Sonic (井眼补偿声波)BHPT Borehole Properties Tool (井眼特性仪器)CAST Circumferential Acoustic Scanning(环形声波扫描仪)CDL Compensated Density Log (补偿密度测井)CSNG Compensated Spectral Natural Gamma Ray (补偿能谱中子伽马) DIL Dual Induction Log (双感应测井)DLLT Dual Laterolog (双侧向测井)DSN Dual Spaced Neutron (双源距中子仪)EMI Electrical Micro Imaging (微电成像)FIAC Four Independent Arm Caliper (四独立臂井径)FWS Full Wave Sonic (全波列声波)GR Gamma Ray (伽马仪)HDIL_HAL Hostile Dual Induction (无敌双感应)HDTD Hostile Downhole Tension (无敌井下张力仪)HFDT High Frequency Dielectric (高频介电测井仪)HRI High Resolution Induction (includes HRAI) (高分辨率感应) HSN Hostile Short Normal (无敌短电位测井仪)LSS Laterolog 3 (三侧向) Long Spaced Sonic (长源距声波)MACT Multi-Arm Caliper Tool (多臂井径仪)MICLOG Microlog (微电极测井仪)MRIL Magnetic Resonance Imaging Log (核磁共振成像测井)MSFL Micro-Spherically Focused Log (微球型聚焦测井仪)NGRT Gamma Ray Tool (伽马仪)RDT Reservoir Description Tool (油藏描述测井仪)RSCT Rotary Sidewall Coring (钻进井臂取心器)SDL Spectral Density Log (能谱密度侧井)SED Six Arm Dipmeter (六臂倾角)SFT Sequential Formation Tester (连续地层测试器)SGR Spectral Gamma Ray (能谱伽马)SP Spontaneous Potential (自然电位)Thermal Multigate Decay-Lithology (热中子多选通衰变岩性测井仪) TMD-LWSD WaveSonic Dipole (偶极子声波)XYC XY Caliper Log (XY井径仪)HALLIBURTON SPERRY SUN(哈里伯顿-随钻测井)ACAL AcoustiCaliper (声波井径)AGR Azimuthal Gamma Ray (方位伽马)ALD Azimuthal Litho Density (方位岩性密度)ASLD Azimuthal Stabilized Litho Density (方位稳定岩性密度)BAT Bi-Modal Acoustic Tool (Bi模声波仪)CNP Compensated Neutron Porosity (补偿中子孔隙度)CTNCompensatedThermalNeu;DDSDrillingDynamicsSenso;DGRDualGammaRay(双伽马仪);DIRDirectional(定向仪);EWP4EWR-Phase4(电磁波电阻率-相4;EWR-M5EWR-M5Resistivity(;EWR-P4EWR-Phase4Resisiti;EWR-P4DEWR-PhCTN Compensated Thermal Neutron (补偿热中子)DDS Drilling Dynamics Sensor (钻进动态探测仪)DGR Dual Gamma Ray (双伽马仪)DIR Directional (定向仪)EWP4 EWR - Phase 4 (电磁波电阻率-相4)EWR-M5 EWR-M5 Resistivity (电磁波电阻率-M5)EWR-P4 EWR-Phase 4 Resisitivity (电磁波电阻率-P4)EWR-P4D EWR-Phase 4D Resistivity (电磁波电阻率-P4D)EWRS Electromagnetic Wave Resistivity (Shielded) (屏蔽电磁波电阻率测井仪) GeoTapGM GeoTap Formation Tester (GeoTa地层测试仪) Gamma Module (伽马探测单元)GPGR Geo-Pilot Azimuthal Gamma Ray (Geo-Pilot方位伽马)IVSS Insert Vibration Severity Sensor (嵌入式振动硬度探测仪)MRIL-WD Magnetic Resonance Image Logging (随钻核磁共振成像仪) NGP Natural Gamma Probe (自然伽马探测仪)NUCP Smoothed Neutron Porosity(平滑中子孔隙度)PCG Pressure Case GammaPPFG Pore Pressure/Fracture Gradient (孔隙压力与破裂梯度)PWD Pressure While Drilling (随钻压力探测仪)SFD Simultaneous Formation Density (同行地层密度)SLD Stabilized Litho Density (稳定岩性密度)SSEWR-P4 SuperSlim EWR-Phase 4 (超小井眼电磁波电阻率-P4)SVSS Sonde Vibration Severty Sensor (探头式振动强度探测仪)PATHFINDER LOGGING(导航测井公司)AWR Array Wave Resistivity/Gamma Ray(波列电阻率与伽马)CLSSM Compensated Long Spaced Sonic MultiLink (多连接补偿长源距声波) CWRGM Compensated Wave Resistivity Gamma MultiLink(多连接补偿波列电阻率伽马)DFT Dynamic Formation Tester (动态地层电阻率测试器)DIR Directional (定向仪)DNSCM Density Neutron Standoff Caliper MultiLink (多连接密度中子支撑井径)DPM Dynamic Pressure Module (动态压力单元)GAM Gamma Ray Sonde (伽马探头)GyroHDS1 Gyro High-Speed Directional Survey (旋转高速定向仪) HDS1LHDS1R High-Speed Directional Survey(高速定向仪1L) High-Speed Directional Survey Retrievable (高速定向仪1R) HDSM High-Speed Directional Survey MultiLink (多连接高速定向仪) PWD Pressure While Drilling (随钻压力探测仪)PZIG At-Bit Inclination and Gamma Ray (钻头倾斜于伽马)QPM Survivor Dynamic Pressure Module (动压探测单元)SAWR Slim Array Wave Resistivity/Gamma Ray (小井眼波列电阻率与伽马) SCLSS Slim Compensated Long Spaced Sonic (小井眼补偿长源距声波) SCWR Slim Compensated Wave Resistivity (小井眼补偿波列电阻率)SDNSC Slim Density Neutron Standoff Caliper (小井眼密度中子支撑井径) PRECISION ENERGY (精准能源)AZD Azimuthal Density (方位密度)BAP Bore/Annular Pressure (井眼环空压力)BCS Borehole Compensated Sonic (井眼补偿声波)CALI General Caliper (通用井径仪)CNS Compensated Neutron Service (补偿中子测井)CNT Compensated Neutron Tool (补偿中子仪)DLL Dual Laterolog (双侧向测井)ESM Environmental Severity Measurement (环境硬度测试仪)FCAL Single Axis Caliper (单轴井径仪)GR Flow Rate Tester (泵量测试仪) Gamma Ray (伽马仪)HAGR High Temperature Azimuthal Gamma Ray (高温方位伽马)HBC High Resolution Borehole Sonic (高分辨率井眼声波)HMI High Resolution Micro Imager (高分辨率微成像)IDS Integrated Directional Sonde (综合定向仪)MCG Compact Gamma (嵌入式伽马)MDA Monopole Dipole Array (单偶极子阵列声波)MDN Compact Dual Neutron Sonde (嵌入式双源距中子仪)MFR Multi-Frequency Resistivity (多频电阻率)MFT Compact Repeat Formation Pressure Tester (嵌入式反复式地层压力测试器)MGS Auxiliary Gamma Sub (辅助伽马短节)MPD Compact PhotoDensity Sonde (嵌入式光密度仪)MRT Micro Resistivity Tool (微电阻率测井仪)MSFL Micro Spherically Focused Log (微球型聚焦测井)NMRT Nuclear Magnetic Resonance Tool (核磁共振测井)RSCT Rotary Sidewall Coring Tool (钻进式井壁取心器)SED Six Electrode Dipmeter (六电极倾角)SFT Selective Formation Tester (选择性地层测试器)SGR Spectral Gamma Ray (能谱伽马)SGS-C Spectral Gamma Sonde (能谱伽马探头)SPeD Spectral Pe Density (能谱Pe密度)STI Simultaneous Triple Induction (联合三感应)SWC Sidewall Coring Gun (井壁取心器)TNP Thermal Neutron Porosity (热中子孔隙度)UGR Universal Gamma Ray (多功能伽马仪)VSP Vertical Seismic Profile (垂直地震剖面)PROTECHNICS公司SpectraS SpectraScan - spectral gamma ray (能谱伽马)REEVES WIRELINE 公司MAI Compact Array Induction (嵌入式阵列感应)MBN Compact Borehole Navigator (嵌入式井眼定向仪)MDL_R Compact Dual Laterolog Sonde (嵌入式双侧向)MDN Compact Dual Neutron (嵌入式双源距中子)MFE High Resolution Shallow Focused Electric (高分辨率浅聚焦电法仪) MFT Compact Repeat Formation Pressure Tester (嵌入式重复地层压力测试器) MGS Auxilary Gamma Sub (辅助伽马短节)MML Compact Microlog (嵌入式微电极)MMR Compact Microlaterolog (嵌入式微侧向)MPD Compact PhotoDensity (嵌入式光密度仪)MSS Compact Sonic Sonde (嵌入式声波)MTC Compact Two Arm Caliper (嵌入式两臂井径仪)MCG Compact Gamma (嵌入式伽马)SCHLUMBERGER(斯伦贝谢)AACT Aluminium Activation Clay Tool (铝活化粘土仪)ACT Geochemical Logging Tool (地球化学测井仪)ADN Azimuthal Density Neutron (方位密度中子)AGS Aluminium Gamma Ray Spectroscopy Sonde (铝伽马能谱仪) AIT Array Induction Imager (阵列感应)ALAT Azimuthal Laterolog (方位侧向)AMS Auxiliary Measurement Sonde (辅助测量仪)APS Accelerator Porosity Sonde (加速器型孔隙度探测仪)APWD Annular Pressure While Drilling (随钻环空压力)ARC Array Compensated Resistivity (阵列补偿电阻率)BHTV Borehole Televiewer (井下电视)BSP Bridle Spontaneous Potential (加长电缆自然电位)CALI Generalized Caliper (通用井径仪)CBTT Combinable Borehole Televiewer Tool (组合式井下电视)CDN Compensated Density Neutron (补偿密度中子)CDR Compensated Dual Resistivity (补偿双电阻率)CHFR Cased Hole Formation Resistivity (套管井地层电阻率) CHFT Cased Hole Dynamics Tester (套管井动态测试仪)CMR Combinable Magnetic Resonance (组合式核磁共振) CNL Compensated Neutron Log (补偿中子测井)CNT Compensated Neutron Tool (补偿中子仪)CNTS Slim Compensated Neutron Tool (小井眼补偿中子仪)CST Core Sample Taker; Chronological Sample Taker (井壁取心器) DGR Dual Gamma Ray (双伽马仪)DIT Directional (定向仪) Dual Induction (双感应)DLT Dual Laterolog (双侧向测井)DPT Deep Propagation Tool (深探测电磁波传播测井仪) DSI Dipole Shear Sonic Imager (双极子横波成像仪)DSLT Digitizing Sonic Logging (数字声波)DSST Dipole Shear Sonic Imager (双极子横波成像仪)DST Dual Laterolog with SRT (双侧向微球型聚焦仪)DWST Digital Waterform Sonic (数字波列)ECO Ecoscope (电子耦合仪)ECS Elemental Capture Spectroscopy Sonde (自然俘获能谱仪) EDTC Telemetry Cartridge (遥测短节)EMS Environmental Measurement Sonde (环测仪)EPT Electromagnetic Propagation (ADEPT) (电磁波传播仪) ES Electrical Survey Tool (电法测井仪)FBST Fullbore Formation Micro Imager (全井眼地层微成像仪) FGT Formation Gamma Gamma (地层伽马)FMI Fullbore Formation Micro Imager (全井眼地层微成像仪) FMS Formation Micro Scanner (地层微扫描仪)FPWD Formation Pressure While Drilling (随钻地层压力)GFAFormationTesterGammaR;GNTGammaNeutronTool(伽马中子;GPITGeneralPurposeInclin;GRGammaRay(伽马仪);GRAGeochemicalReservoirA;GRSTGammaRaySpectrometry;GRTGammaRayTool(伽马仪);GSTGeo-SteeringTooGFA Formation Tester Gamma Ray Detector (地层测试伽马探测器) GFT Formation Tester Gamma Ray (地层测试伽马探测器)GNT Gamma Neutron Tool (伽马中子)GPIT General Purpose Inclinometry Tool (通用测斜仪)GR Gamma Ray (伽马仪)GRA Geochemical Reservoir Analyzer (地球化学储层分析器)GRST Gamma Ray Spectrometry Tool (伽马能谱仪)GRT Gamma Ray Tool (伽马仪)GST Geo-Steering Tool (地质导向仪)HALS High Resolution Azimuthal Laterlog Sonde (高分辨率方位侧向)HAPS HPHT Accelator Porosity Sonde (aka XAPS) (HPHT加速度型孔隙度) HDT High Resolution Dipmeter (高分辨率倾角)HGNS HILT Gamma Ray Neutron Sonde (高集成伽马中子仪)HILT High Integrated Logging Tool 9(高集成测井仪)HIT Hostile Array Induction Tool (aka XAIT) (无敌阵列感应)HLDS Hostile Litho-Density Sonde (无敌岩性密度)HLDT Hostile Environment Litho-Density(无敌自然岩性密度)HNGS Hostile Gamma Ray Neutron Sonde (无敌伽马中子仪)HNGT Hostile Natural Gamma Ray Spectrometry (无敌中子伽马能谱) HRCC High Resolution Control Cartridge (高分辨率控制短节)HRDD HILT High Resolution Density Device (高集成高分辨率密度仪)HRGD HILT High Resolution Resitivity Gamma Ray Density Device (高集成高分辨率电阻率伽马密度仪)HRLT High-Resolution Laterolog Array Tool (高分辨率阵列侧向)HRMS High Resolution Measurement Sonde (高分辨率测试仪)HSGT Hostile Environment Gamma Ray (无敌自然伽马仪)HSLT HPHT Digial Sonic Logging Tool (aka XSLT) (高温高压数字声波) IMPA IMPulse Array Compensated Resistivity (脉冲阵列补偿电阻率) IPL Integrated Porosity Lithology (集成孔隙度岩性仪)IRT Induction Resistivity Tool (感应电阻率测井仪)LWD Sonic (随钻声波) ISONICLDS Litho Density Sonde (岩性密度测井仪)LDT Litho Density (岩性密度)LSS Long Spaced Sonic (长源距声波)MCFL Micro-Cylindrically Focused Log (微柱型聚焦测井)MDLT Medium Dual Laterolog (介质双侧向仪)MDT Modular Formation Dynamics Tester (模块式地层动态测试器) MLT Microlog (微电极测井仪)MRPS Modular Formation Dynamics Tester Single-Probe (模块式地层动态测试器单探头)MRSC Modular Formation Dynamics Tester Sample Chamber (模块式地层动态测试器取样筒)MRWD Magnetic Resonanace While Drilling (随钻核磁共振)MSCT Mechanical Sidewall Coring Tool (机械式井壁取心器)MSIP Modular Sonic Imaging Platform (模块式声波成像平台)MWD Measurement While Drilling (多功能随钻测量)NGS Natural Gamma Ray Sonde (自然伽马)NGT Natural Gamma Ray Spectrometry (自然伽马能谱)NMT Nuclear Magnetism (核磁共振仪)NPLC Nuclear Porosity Lithology (核孔隙度岩性仪)NPLT Nuclear Porosity Lithology (核孔隙度岩性仪)OBDT Oil Base Mud Dipmeter (油基泥浆地层倾角)OBMI Oil Base Micro Imager (油基泥浆微成像仪)OBMT Oil Base Mud Formation Imager (油基泥浆地层成像仪)PERI Periscope (潜望镜)PGT Compensated Density (补偿密度)PMIT PS Platform Multifinger Imaging Tool (PS平台多指成像仪) PNT Sidewall Neutron Tool (井壁中子仪)QAIT Slim Hostile Array Inducation Tool (小井眼阵列感应)QCNT Slim Hot Compensated Neutron Tool (小井眼高温补偿中子) QLDT Slim XtremeLitho-Density Tool (小井眼特种岩性密度)QSCS Slimhole Power Caliper Sonde (小井眼电动井径仪)QSLT Slim Xtreme Sonic Logging Tool (小井眼特种声波)QTGC SlimXtreme Telemetry and Gamma Ray (小井眼特种遥测伽马)RAB Resisitivity at Bit;Azimuthal Laterolog - Gamma Ray (aka GVR) (钻头位电阻率方位侧向伽马)RFT Repeat Formation Tester (重复式地层测试器)RST Reservoir Saturation Tool (储层饱和度测井)SAIT Slimhole Array Induction (小井眼阵列感应)SDT Sonic Digital (数字声波)SGT Scintillation Gamma Ray (闪烁伽马)SHARP Slim Hole Retrievable MWD Tool (SHDT Stratigraphic High Resolution Dipmeter Tool (地层高分辨率倾角) SLDT Slimhole Litho-Density (小井眼岩性密度)SLIM1 Slim Hole Retrievable MWD Tool (小井眼可起出随钻测井仪) SLT Borehole Compensated Sonic Logging Tool (井眼补偿声波)SMRT Slim Micro Resistivity Tool (小井眼微电阻率测井仪)SNPD Sidewall Neutron Tool (井壁中子仪)SONVIS SonicVISION (声波成像)SP Spontaneous Potential (自然电位)SPE SP Extender (自然电位增强仪)SPULSE Slim Pulse MWD Directional (小井眼脉冲随钻定向仪)SRT Microspherically Focused Resistivity (微球型聚焦电阻率测井仪) SSLT Slim Array Sonic Logging Tool (小井眼阵列声波)STETHO Stethoscope (金属探伤仪)SVWD Seismic Vision While Drilling (随钻地震成像)TDT Thermal Decay Time (热中子衰变时间)TELE Telescope (望远镜)TLD Three-Detector Lithology Density (三维岩性密度)UBI Ultrasonic Borehole Imager (超声井壁成像)USIT Ultrasonic Imager Tool (超声成像仪)VIPER VIPER Slimhole Coiled Tubing MWD Tool (VIPER小井眼随钻挠性管) VISP Vertical Incident Seismic Profile (垂直入射地震剖面)VSI Borehole Seismic Acquisition Tool (井眼地震剖面采集仪)VSP Vertical Seismic Profile (垂直地震剖面)WAVSP Walk Away Vertical Seismic Profile (偏离垂直地震剖面) XPT Pressure Express (快速压力探测仪)WEATHERFORD(威德福公司)AZD Azimuthal Density (方位密度)BAP Bore/Annular Pressure (井眼环空压力)BCS Borehole Compensated Sonic (井眼补偿声波)CAL Caliper (井径)CALI Generalized Caliper (通用井径仪)CDT Compensated Density (补偿密度)CNS Compensated Neutron Service (补偿中子测井)CNT Compensated Neutron Tool (补偿中子仪)DAR Digital Acoustic Tool (数字声波)DIR Directional Survey (井斜方位测井仪)DLL Dual Laterolog Log (双侧向测井仪)DTD Tension Compression (张/压力计)ESM Environmental Severity Measurement (环境硬度测试仪)FCAL Single Axis Caliper (单轴井径仪)FED Four Electrode Dipmeter (四电极倾角)GR Flow Rate Tool (泵量测试仪) Gamma Ray (伽马仪)GRN Gamma Ray Neutron (伽马中子)HAGR High Temperature Azimuthal Gamma Ray (高温方位伽马)HBC High Resolution Borehole Compensated Sonic Log (高分辨率井眼补偿声波)HMI High Resolution Micro Imager (高分辨率微成像)IEL Integrated Directional Sonde (综合定向仪) Induction Electrolog (感应-电测井)MAI Compact Array Induction (嵌入式阵列感应)MAN Multi Array Neutron (阵列中子)MBN Compact Borehole Navigation (嵌入式井眼定位仪)MCG Compact Gamma (嵌入式伽马)MDA Monopole Dipole Acoustic (单偶极子声波)MDL_R Compact Dual Laterolog Sonde (嵌入式双侧向)MDN Compact Dual Neutron (嵌入式双源距中子)MEL Micro Electric Log (微电极测井)MFE High Resolution Shallow Focused Electric (高分辨率浅聚焦电法仪) MFR Multi Frequency Resistivity (多频电阻率测井)MFT Compact Repeat Formation Pressure Tester (嵌入式反复式地层压力测试器)MGS Auxilary Gamma Sub (辅助伽马短节)MMR Compact Microlaterolog (嵌入式微侧向)MPD Compact PhotoDensity (嵌入式光密度仪)MRT400 Micro Resistivity Tool (微电阻率测井仪)MRT-P Micro Resistivity Tool (微电阻率测井仪)MSFL Micro-Spherically Focused Log (微球型聚焦测井仪)MSS Compact Sonic Sonde (嵌入式声波)MTC Compact Two Arm Caliper (嵌入式两臂井径仪)NMRT Nuclear Magnetic Resonance Tool (核磁共振测井)NTT Single Detector Neutron (单探头中子)RSCT Rotary Sidewall Coring (HRSCT) (钻进式井壁取心器)SAGRSpectralAzimuthalGam;SFTSequentialFormationTe;SGS-CSpectralGammaSonde(;SPEDSpectralPeDensity(能谱;SST;STIShockWaveSonicTool(冲击;TENTension(张力计);TNPThermalNeutronPorosit;SAGR Spectral Azimuthal Gamma Ray (方位能谱伽马) SEDSix Arm Dipmeter Survey (六臂倾角)SFT Sequential Formation Tester (连续地层测试器) SGR Spectral Gamma Ray (能谱伽马)SGS-C Spectral Gamma Sonde (能谱伽马探头) SP Spontaneous Potential (自然电位)SPED Spectral Pe Density (能谱Pe密度)STI Shock Wave Sonic Tool (冲击波声波仪) Simultaneous Triple Induction (联合三感应) SWC Sidewall Coregun (井壁取心器)TEN Tension (张力计)TNP Thermal Neutron Porosity (热中子孔隙度) UGR Universal Gamma Ray (多功能伽马仪) VSP Vertical Seismic Profile (垂直地震剖面)。
IKONICS Chroma Stencil Remover 285 用户指南说明书
An IKONICS Company | ISO 9001 Certifi ed | NASDAQ Listed: IKNX www.chromaline .com(800) 328-4261Follow us! WARNING: This product can expose you to chemicals including methanol, which is known in the State of California to cause birth defects or other reproductive harm. For more information go to C H R O M A L I N E S C RE E N C H E M I C A LCHOMA/STENCIL REMOVER™ 285Chroma/Stencil Remover™ 285 is a super concentratedliquid product formulated for the removal of all photosensi-tized emulsions. Especially suitable for automatic systems.APPLICATION Chroma/Stencil Remover 285 should be diluted with clean water, at a ratio of 1 part product to 20-40 parts water. Chroma/Stencil Remover 285 contains additives to aid in the complete removal of photosensitized emulsions from all types of screen mesh. CHARACTERISTICS Chroma/Stencil Remover 285 is a water-soluble colorlessliquid with no flash point. Product contains some acidsolutions and therefore is classified as corrosive. Chroma/Stencil Remover 285 quickly and easily dissolves allphotosensitized emulsions and rinses away completely.USEAGE INSTRUCTIONS For manual application, apply the Chroma/Stencil Remover285 solution to both sides of the wet screen. Allowsolution to dissolve the emulsion. Scrub the stencil area onboth sides to aid in a more complete removal of thestencil. Rinse with high pressure water. No degreasingusually required, except when applying capillary films.To ensure the safe and proper use of Chroma/Screen Chemical products, always refer to the products of SDS before use.180731FOR TECHNICAL SERVICE Call Toll Free: 1-800-328-4261Email: *******************(Outside North America Call +1-218-628-2217)。
hsla80h密度
hsla80h密度
HSLA 80 通常指的是高强度低合金钢(High Strength Low-Alloy Steel),其数字“80”可能指的是钢的屈服强度,单位可能是 Ksi (千磅每平方英寸)。
HSLA 钢是一类特殊设计的钢材,通过添加少量的合金元素(如铜、铬、镍、钼、钒、钛等)来提高钢材的机械性能,如强度、韧性、耐磨性、耐腐蚀性等,同时保持较低的碳含量以维持良好的焊接性能。
HSLA 钢在多个行业中有广泛应用,如建筑、桥梁、船舶、石油天然气管道、汽车和重型机械等。
这些钢材通常用于需要更高强度和更低重量的场合,以提高结构效率和节省材料成本。
然而,HSLA 钢的“密度”通常与纯铁相近,大约是 7.87 g/cm ³。
合金元素的添加通常不会对钢的密度产生显著影响。
因此,HSLA 80 的密度应该接近这个值。
请注意,HSLA 钢的具体成分和性能可能会根据制造标准和应用需求而有所不同。
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Ordering Information
Type No. HSL285 Laser Mark 1 Package Name EFP Package Code PXSF0002ZA-A
Pin Arrangement
Cathode mark Mark 1
1 −
2 1. Cathode 2. Anode
Rev.2.00 May 17, 2006 page 1 of 4
10–4
Ta = 25°C
10–5
10–5
10–6
0
0.1
0.2
0.3
0.4
0.5
10–6
0
1
2
34ຫໍສະໝຸດ 5Forward voltage VF (V) Fig.1 Forward current vs. Forward voltage
Reverse voltage VR (V) Fig.2 Reverse current vs. Reverse voltage
Dimension in Millimeters
Pattern of terminal position areas
A b c D E HE φb e1
Min 0.44 0.25 0.08 0.55 0.75 0.95
Nom 0.47 0.30 0.13 0.60 0.80 1.00 0.40 1.00
元器件交易网
HSL285
Absolute Maximum Ratings
(Ta = 25°C)
Item Reverse voltage Average rectified current Junction temperature Storage temperature Symbol VR IO Tj Tstg Value 2 5 125 −55 to +125 Unit V mA °C °C
元器件交易网
HSL285
Silicon Schottky Barrier Diode for Detector
REJ03G0527-0200 Rev.2.00 May 17, 2006
Features
• Low forward voltage, Low capacitance and High detection sensitivity. • Extremely small Flat Lead Package (EFP) is suitable for surface mount design.
Max 0.50 0.35 0.18 0.65 0.85 1.05
Rev.2.00 May 17, 2006 page 4 of 4
元器件交易网
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.