microSMD075_rev_D
Raytech Micro Junior 2 10 Amp微抗值计说明书
Portable Products: Contact ResistanceMicro Junior 2: Battery-Operated, Fully Automatic, 10 Amp Micro Ohm MeterFeaturesMicro Junior 2Response time less than 2 secondsLCD display screen with backlight5-Year standard warrantyAccuracyAccuracy Resolution10 A F/R* 0.00 µΩ … 40 mΩ ± 0.1% Rdg ± 0.01 µΩ 5 Digits or 0.01 µΩ5 Digits or 0.1 µΩ1 A F/R* 0.0 µΩ … 1 Ω ± 0.1% Rdg ± 1 µΩ 5 Digits or 0.1 µΩ1 A 0.000 mΩ … 1 Ω ± 0.1% Rdg ± 10 µΩ 5 Digits or 0.001 mΩ0.1 A 0.00 mΩ … 10 Ω ± 0.1% Rdg ± 0.1 mΩ 5 Digits or 0.01 mΩ10 mA 0.0 mΩ … 400 Ω ± 0.1% Rdg ± 1 mΩ 5 Digits or 0.1 mΩ1 mA 0.0 Ω … 40 kΩ ± 0.1% Rdg ± 0.1 Ω 5 Digits or 0.1 Ω1 mA 40 kΩ … 400 kΩ ± 0.1% Rdg 5 Digits*F/R = automatic Forward / Reverse current measurementsSpecsSize:L:410 mm (16.1”)W:337 mm (13.3”) H:178 mm (7”) Resistance Range: 0.00µΩ to 400kΩWeight: 5.9 kg (13 lbs.) Test Current: User selectable: 10, 1, 0.1, 0.01, 0.001A DC Power: Lithium-Ion battery, 14.4V / 6.5 Ah Front Panel: Sealed, anodized with a multi-actuation rotary knob Panel Display: LCD graphic with backlight Memory Storage: Internally stores up to 2,000 test results Interface: 9 Pin RS-232 serialTemperature: Operating:–10°C to 60°C (14°F to 140°F); Storage:–20°C to 70°C (-4°F to 158°F)See Instruction Manual for more parameters. Specifications subject to improvements at any time.Standard Accessories IncludedCurrent and Potential Lead Set, Positive and Negative – 5m (16 ft.) Cable Bag with Shoulder StrapLithium-Ion Battery Charger with power cord Paper Refill for Printer –5 rollsGround Lead – 5m (16 ft.) Instruction ManualRS-232 Cable – 3m (10 ft.) Certificate of AccuracyOptional Items Available2020N-26002: Temperature Probe – 10m (32 ft.) 2020N-33005: Kelvin Spike Probes –5m (16 ft.)2020N-33001: Kelvin Spike Probes – 4m (13 ft.) 2020N-15001: Annual Warranty Extension188****3779•Raytech is a world leader in the design and production of precision electronicmeasuring instruments and systems. The unique design approach of the engineering team at Raytech has resulted in the development of highly regarded measuring instruments,which have set new standards in the electrical testing industry.Our exceptional reputation for support and service is unmatched.Raytech products are designed for many years of trouble-free use, which is why we can offer a standard 5-year warranty – guaranteeing the highest quality instrumentation available.Raytech USA118 S. 2nd StreetPerkasie, PA 18944Tel: +267 404 2676Email:********************** Raytech GmbH Oberebenestrasse 115620 Bremgarten, Switzerland Tel: +41 56 648 60 10Email:******************www.Raytech.ch。
全自动微波消解仪技术参数
全自动微波消解仪技术参数1.用途：主要用于实验室中木器涂料、建筑用墙面涂料和汽车涂料等样品前处理，为原子吸收（AA）、等离子发射光谱（ICP）等制备样品。
同时，也能够完成样品的萃取工作，为气相（GC）或液相色谱（LC/HPLC）制备样品。
2.技术要求：电源：220V-230V 50Hz，环境温度：5-40℃，相对温度：10-85% 3.技术指标要求* 仪器总体要求：制造厂商可提供微波仪器设计制造的ISO9001证书，仪器一体化设计，无需外接控制终端，能够快速地同批次处理24个样品等（330℃/2200psi）样品，同时非接触地控制24个反应罐的温度和压力安全，操作简单，无需连接传感器，高压消解罐无易耗品。
3.1 专业磁控管设计，输出功率1800W（符合IEC705methods），微波能量垂直双向波导，三维输出，保证微波能量场均匀。
终身免费保修保换。
3.2 微波腔体：5层防腐涂层，最高耐温≥350℃，防酸防腐蚀，五年质保。
3.3 操作系统：采用开放式linux操作平台，实现一键式消解；3.4 控温系统：控温范围：0-400℃，3.5控温方式：底部双红外全罐温度控制系统，非接触等距离红外测量（红外探头与消解罐距离小于2cm），显示和控制所有反应罐的温度，控温精度±1℃，可以程序升温及设定升温速率。
3.6 压力控制系统：24个压力罐内的压力，任何压力罐压力达到设定值，自动给出安全警告，并停止微波发射。
3.7控压方式：压力控制系统自动独立工作，消解罐无任何金属材质及连接。
3.8 灯光识别系统，可通过灯光信号变化反馈反应状况，也可以判断整机密封情况，防止微波泄露。
3.9 冷却系统：风冷时间少于15min3.10 同批消解数量：24个样品/批3.11 反应内管：耐压≥2200psi；耐温≥330℃；体积≥110ml；材质TFM反应罐转子：连续同向360度旋转。
3.12 保护外套：耐温≥600℃，耐压10000psi，终身免费保修保换。
金属化聚丙烯抗干扰电容器（X2型）产品规格承认书说明书
产品规格承认书Product Spec Certification客户名：品名：金属化聚丙烯抗干扰电容（X2）型号：客户料号：日期：批准审核拟制金属化聚丙烯膜抗干扰电容器（X2型）产品外形尺寸客户料号容量（μF）容量误差（%）额定电压（VAC）1KDF(%)尺寸加工方式制造商料号W±0.5MMH±0.5MMT±0.5MMP±0.5MML±0.3MMd∮±0.050.01102750.11211510220.6A MPX-103K275VAC-B-C2 0.047102750.11811515250.8A MPX-473K275VAC-C-D1 0.068102750.1101157.5220.6A MPX-683K275VAC-A-B40.1102750.11312610250.6A MPX-104K275VAC-B-C30.1102750.11812615250.8A MPX-104K275VAC-C-D20.1102750.1101157.5220.6A MPX-104K275VAC-A-B40.15102750.11312610250.6A MPX-154K275VAC-B-C30.22102750.1101267.5220.6A MPX-224K275VAC-A-B50.22102750.11312610250.6A MPX-224K275VAC-B-C30.22102750.11812615250.8A MPX-224K275VAC-C-D20.22102750.11314810220.6A MPX-224K275VAC-B-C50.22102750.11814.58.515250.8A MPX-224K275VAC-C-D40.22102750.11813.57.515250.8A MPX-224K275VAC-C-D30.33102750.11314810220.6A MPX-334K275VAC-B-C50.33102750.11813.57.515250.8A MPX-334K275VAC-C-D30.33102750.11814.58.515250.8A MPX-334K275VAC-C-D40.33102750.11815.59.515250.8A MPX-334K275VAC-C-D50.33102750.126.5178.522.5250.8A MPX-334K275VAC-E-E30.47102750.11814.58.515250.8A MPX-474K275VAC-C-D40.47102750.11815.59.515250.8A MPX-474K275VAC-C-D50.47102750.1181910.815250.8A MPX-474K275VAC-C-D70.47102750.126.5191022.5250.8A MPX-474K275VAC-E-E40.68102750.11815.59.515250.8A MPX-684K275VAC-C-D50.68102750.1181910.815250.8A MPX-684K275VAC-C-D70.68102750.126.5191022.5250.8A MPX-684K275VAC-E-E41.0102750.126.5191022.5250.8A MPX-105K275VAC-E-E41.0102750.11815.59.515250.8A MPX-105K275VAC-C-D5芯通电子科技有限公司拟定审核批准金属化聚丙烯膜抗干扰电容器（X2型）编码规则MPX 0.22μF K 275VAC 13*12*6mm P=10mm1、电容器型别2、电容量代码表示方法用电容单位法拉表达，前面两位代表容量大小，第三位数要制定跟随以下101=0.0001μF 104=0.1μF 102=0.001μF 105=1.0μF 103=0.01μF 106=10.0μF 3、电容量偏差4、额定电压代码025002750300030506301000120016002000类型250V275V 300V 305V 630V 1000V 1200V 1600V 2000V5、额定电压别代码PEI-MPX-CBB22-CBB21-CL21-CL22-CBB81-类型PEIMPXCBB22CBB21CL21CL22CBB81代码G J K M 电容量偏差±2.5%±5%±10%±20%MPX -224K 275V AC .-B -C312345676、脚距(mm)7、内部识别码外壳型号金属化聚丙烯膜抗干扰电容器TYPE:MPX产生说明书Rev.11、应用本规范涵盖了金属化聚丙烯介质固定的要求。
微积电Microsemi MMIC选择指南说明书
MMIC Selection GuideDC–65 GHz Broadband Amplifiers and ModulesLow-Noise AmplifiersPower Amplifiers Prescalers and Frequency DetectorsSwitchesAttenuatorsMicrosemi’s portfolio of MMIC products targets a broad range of applications including electronic warfare, radars, instrumentation (test and measurement), and microwave communications. The portfolio is comprised of broadband amplifiers (both power and low-noise), amplifier modules, prescalers, attenuators, and switches spanning DC to 65 GHz based on high-performance process technologies. Microsemi offers a large number of distributed amplifier products, including industry-leading MMICs. Microsemi’s prescalers combine higher frequency operation, the flexibility to divide by a large number of ratios, and very good residual phase noise.Broadband AmplifiersPrescalers and Frequency DetectorsSwitchesVoltage Variable AttenuatorsUXN40M7K/1 to /127 40 GHzProgrammable Integer DividerUA0L65VMDC–65 GHz Wideband Amplifier ModulePFD1K8 GHz Phase Frequency Detector with Dual 40 GHz PrescalersMMA040AADC–28 GHz Distributed LNAMMA053PP5DC–8 GHz Distributed Power AmplifierMMA044PP36 GHz–18 GHz Wideband LNAUA2V50HM2 GHz–50 GHz High-Gain Power Amplifier ModuleMMA043PP40.5 GHz–12 GHz Wideband LNA©2017 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are registered trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners.Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer’s responsibility to independently determine suitability of any products and to test and verify the same. The information provided by Microsemi hereunder is provided “as is, where is” and with all faults, and the entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP rights, whether with regard to such information itself or anything described by such information. Information provided in this document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document or to any products and services at any time without notice.Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; R F solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, California and has approximately 4,800 employees globally. Learn more at .Microsemi Corporate Headquarters One Enterprise, Aliso Viejo, CA 92656 USA Within the USA: +1 (800) 713-4113 Outside the USA: +1 (949) 380-6100 Fax: +1 (949) 215-4996Email:***************************MMIC 05/17UA0L30VM UA0L65VMUA2V50HM UA0U50HM UA2V50LMNote: Contact sales for additional connector options and bias board information.。
SMD电子元件介绍 - V1.0
TTE-KS制造部
课堂纪律： 请将手机关机或调为震动模式 若需接听电话或打电话请到室外
PCB（电路板）：
1.PCB依层数分：单面板 双面板 四层板 六层板… 2. PCB依PAD加工方式分：喷锡板 化金板….. 3.PCB应注意防潮 防氧化…… 4.PCB保存时间管制.
电阻器（R）：
2. IN400（1 2 3 4 5 6 7）。 3. 耐压值： 1：50V 2：100V 3：200V 4.有方向性：灰色端为负端。 4：400V 5：600V 6：800V 7：1000V
二极管（DIODE）：
1. SMD型二极管（DIODE）.
2. 双二极管型.
LED（发光二极管）：
1. SMD型LED. 2. 有极性.
中周变压器：
1. SMD型中周变压器. 2. 本组件掉落品是禁止使用,生产过程中应防止掉落. 3. 材料摆放应防止挤压变形.
电感器：
1. SMD型电感器.
二极管（DIODE）：
1. SMD型二极管- IN 4148. 2. 编号:IN4148 3. 极性:黑圈端:负端
二极管（DIODE）：
1. IN400＊系列SMD型二极管。
集成电路（IC）：
1. SOP I.C. 2.制造厂家:MICROSOFT RCA 3. IC型号
PHILIP…
集成电路（IC）：
1. SMD型I.C. 2. 左边为稳压I.C . 3. 右边為QFPIC包装.
PCBA（SMT半成品）
三极管（TRANSISTOR）：
1.SMD型三极管. 2.三极管编号:2SA＊＊＊＊ 2SB＊＊＊＊ 3.SMD型三极管以代码表示编号.
晶振【石英振荡器】：
腾达微电子TDP系列差分活动探头说明书
Differential ProbesTDP1500, TDP3500 and TDP4000 DatasheetDifferential active probes provide truer signal reproduction and fidelity for high-frequency measurements. With ultra-low input capacitance andversatile device-under-test connection capabilities, the TDP1500, TDP3500and TDP4000 Differential-ended Active probes provide excellent high-speed electrical and mechanical performance required for today's digital system designs.Key performance specifications4 GHz (TDP4000), 3.5 GHz (TDP3500) and 1.5 GHz (TDP1500) probebandwidth≤1 pF (TDP1500) and ≤0.3 pF (TDP3500/TDP4000) differential inputcapacitance200 kΩ (TDP1500) and 100 kΩ (TDP3500/TDP4000) differential inputresistance±25 V (TDP1500) and ±15 V (TDP3500/TDP4000) DC + pk AC inputvoltage (non-destruct)>60 dB at 1 MHz and >25 dB at 1 GHz CMRRKey featuresOutstanding electrical performance4 GHz, 3.5 GHz and 1.5 GHz bandwidth models - accuratemeasurements for serial and digital applicationsExcellent common mode rejection – reduces measurement errorsin higher common environmentsLow capacitive and resistive loading – maintains signal fidelity andreduces DC biasing interactionsVersatile mechanical performanceCompact probe head size for probing small geometry circuitelementsDUT attachment accessories enable connection to fine-spacedSMDsRobust design for reliabilityEasy to useConnects directly to oscilloscopes with the TekVPI ™ probeinterfaceProvides automatic units scaling and readout on the oscilloscopesdisplayEasy access to probe comp box controls or oscilloscope probe menu display for probe status, setup control, and diagnosticinformationIntegrated Scope/Probe systemDirect connection to and powered from the TekVPI ™ oscilloscope interface (Connects directly to TekVPI scopes without the need ofan external power supply, like many competitors require)Single-button oscilloscope probe menu accessSetup and control from probe comp box or oscilloscope userinterfaceAutoZero - zeros out output offsetRemote GPIB/USB probe control through the oscilloscopeApplicationsDesign, validation, debugging, and characterization of common high-speed serial bus designs:I 2CCAN/LINSPISerial ATAEthernet (GbE)USB 2.0FIreWire (1394b)Signal integrity, jitter, and timing analysisManufacturing, engineering, and testA better measurement toolSpecifically designed for use and direct connection to oscilloscopes with the TekVPI ™ probe interface, the TDP1500, TDP3500 and TDP4000Differential probes achieve high-speed signal acquisition and measurementfidelity by solving three traditional problems:DUT loading effects - Are reduced by lower input capacitance and highinput resistanceDUT connectivity - A variety of accessories exist for attaching to smallSMDs, some come standard or recommendedMaximizing of system (oscilloscope and probe) bandwidth - Probing solutions for all measurements for TekVPI interface oscilloscope models up to 4 GHzFor the best probe support, download and install the latest version of the oscilloscope software from /software/downloads .DatasheetTDP1500, TDP3500 and TDP4000 Differential probesSpecificationsAll specifications are guaranteed unless noted otherwise. All specifications apply to all models unless noted otherwise.Warranted characteristicsBandwidth (probe only)TDP1500≥1.5 GHz warrantedRise time (probe only)TDP3500≤140 psAttenuationTDP15001X, 10XTDP35005XCMRR>60 dB at 1 MHz, >25 dB at 1 GHzMaximum input voltage(nondestruct)TDP1500±25 V (DC + pk AC)TDP3500±15 V (DC + pk AC)TDP4000±15 V (DC + pk AC)Typical characteristicsBandwidth (probe only)TDP3500≥3.5 GHzTDP4000≥4 GHzRise time (probe only)TDP1500≤265 psTDP4000≤125 psDifferential input capacitanceTDP1500≤1 pFTDP3500≤0.3 pFTDP4000≤0.3 pFDifferential input resistanceTDP1500200 kΩTDP3500100 kΩTDP4000100 kΩNoise levelTDP1500<≈≈Propagation delay 5.4 nsCommon mode input rangeTDP1500±7 V (1X)±7 V (10X)TDP3500+5 V to -4 V TDP4000+5 V to -4 V Input offset rangeTDP1500±7 V (10X or 1X)TDP3500±1 V displayed TDP4000±1 V displayed Differential input dynamic rangeTDP1500±8.5 V (10X)±850 mV (1X)TDP3500±2 V TDP4000±2 VNominal characteristicsRecommended oscilloscope interfaceTekVPI ™ ProbePower requirementsPower requirementsPowered directly by oscilloscopes with the TekVPI probe interface.Physical characteristicsDimensionsWeight1Typical for TDP1500.2Typical for TDP1500.DatasheetTypical characteristicsTDP1500, TDP3500 and TDP4000 Differential probes Ordering informationModelsTDP1500 1.5 GHz Differential Probe with TekVPI™ Probe Interface, Certificate of Traceable Calibration Standard.TDP3500 3.5 GHz Differential Probe with TekVPI™ Probe Interface, Certificate of Traceable Calibration Standard.TDP4000 4 GHz Differential Probe with TekVPI™ Probe Interface, Certificate of Traceable Calibration Standard.OptionsLanguage optionsOpt. L0English manualOpt. L5Japanese manualOpt. L7Simplified Chinese manualService optionsOpt. C3Calibration Service 3 YearsOpt. C5Calibration Service 5 YearsOpt. D1Calibration Data ReportOpt. D3Calibration Data Report 3 Years (with Opt. C3)Opt. D5Calibration Data Report 5 Years (with Opt. C5)Opt. R3Repair Service 3 Years (including warranty)Opt. R5Repair Service 5 Years (including warranty)Opt. SILV900Standard warranty extended to 5 yearsAccessoriesTDP1500 standard accessoriesDatasheetTDP3500 and TDP4000 standard accessoriesRecommended accessoriesTektronix is registered to ISO 9001 and ISO 14001 by SRI Quality System Registrar.Product(s) complies with IEEE Standard 488.1-1987, RS-232-C, and with Tektronix Standard Codes and Formats.TDP1500, TDP3500 and TDP4000 Differential probesDatasheetASEAN / Australasia (65) 6356 3900 Austria 00800 2255 4835*Balkans, Israel, South Africa and other ISE Countries +41 52 675 3777 Belgium 00800 2255 4835*Brazil +55 (11) 3759 7627 Canada180****9200Central East Europe and the Baltics +41 52 675 3777 Central Europe & Greece +41 52 675 3777 Denmark +45 80 88 1401Finland +41 52 675 3777 France 00800 2255 4835*Germany 00800 2255 4835*Hong Kong 400 820 5835 India 000 800 650 1835 Italy 00800 2255 4835*Japan 81 (3) 6714 3086 Luxembourg +41 52 675 3777 Mexico, Central/South America & Caribbean 52 (55) 56 04 50 90Middle East, Asia, and North Africa +41 52 675 3777 The Netherlands 00800 2255 4835*Norway 800 16098People's Republic of China 400 820 5835 Poland +41 52 675 3777 Portugal 80 08 12370Republic of Korea +822 6917 5084, 822 6917 5080 Russia & CIS +7 (495) 6647564 South Africa +41 52 675 3777Spain 00800 2255 4835*Sweden 00800 2255 4835*Switzerland 00800 2255 4835*Taiwan 886 (2) 2656 6688 United Kingdom & Ireland 00800 2255 4835*USA180****9200* European toll-free number. If not accessible, call: +41 52 675 3777For Further Information. Tektronix maintains a comprehensive, constantly expanding collection of application notes, technical briefs and other resources to help engineers working on the cutting edge of technology. Please visit . Copyright © Tektronix, Inc. All rights reserved. Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supersedes that in all previously published material. Specification andprice change privileges reserved. TEKTRONIX and TEK are registered trademarks of Tektronix, Inc. All other trade names referenced are the service marks, trademarks, or registered trademarks of their respective companies.16 Jul 2018 51W-20565-8 。
0515 4.7uh 小体积电感封装尺寸
0515 4.7uh 小体积电感封装尺寸1.概述小体积电感作为一种重要的电子元器件，广泛应用于各种电子设备中。
其中，0515 4.7uh 小体积电感封装尺寸作为一种常见的型号，其封装尺寸对于电子设备的性能有着重要的影响。
本文将就0515 4.7uh 小体积电感封装尺寸进行详细的介绍，希望能对相关领域的从业人员和电子爱好者有所帮助。
2. 0515 4.7uh 小体积电感封装概述0515 4.7uh 小体积电感封装尺寸指的是其封装的物理尺寸和尺寸参数。
小体积电感封装一般采用SMD封装形式，具有体积小、重量轻、功率损耗小等特点，适合用于各种小型电子设备中。
0515表示其封装尺寸为0.05英寸×0.15英寸，4.7uh表示其电感值为4.7微亨，是一种常见的规格型号。
3. 05154.7uh 小体积电感封装尺寸参数0515 4.7uh 小体积电感封装尺寸参数包括外形尺寸、引线间距、工作温度等，具体如下：外形尺寸：0.05英寸×0.15英寸引线间距：0.1mm工作温度：-40°C ～+125°C额定电流：200mA驻波比：≤1.1绝缘电阻：≥100MΩ端子电压：50V包装形式：330mm磁带包装4. 0515 4.7uh 小体积电感封装尺寸应用领域0515 4.7uh 小体积电感封装尺寸适用于各种小型电子设备和电路中，常见应用领域包括但不限于：- 手持设备：如智能手机、平板电脑等电子产品中，用于滤波、降噪等电路。
- 无线通信：如WiFi模块、蓝牙模块等无线通信设备中，用于射频前端和功率放大器的匹配电路。
- 汽车电子：如汽车音响、车载导航等汽车电子产品中，用于电源管理和EMI滤波。
5. 0515 4.7uh 小体积电感封装尺寸优势0515 4.7uh 小体积电感封装尺寸具有以下优势：- 封装小巧，适合于小型电子设备的应用，能够节省空间；- 额定电流较大，适合于一些对电流要求较高的场合；- 工作温度范围广，适应性强，可以在恶劣的环境条件下稳定工作。
微电子商品说明书
Features•16-pin, 4x4 mm QFN Package•Low Power Operation•Class AB Operation•Enable/Disable Control•Capable of Driving Line Impedance Between12 Ω to 100 Ω•Operations to 86 MHz•RoHS CompliantApplications•Power Line Communications•Home Networking•HPNA•G.HNDescriptionThe Le87501 is a single channel line driver designed to work in Home Plug Alliance HPAV2 systems.When enabled, the operating level can be set to Full, 90% or 80% power. The Le87501 delivers superior performance and can drive a line impedance of 100 Ωdown to 12 Ω through a proper transformer.In addition, the Le87501 features a Standby state which forces the driver into a long-term sleep mode.Document ID# PD-000246513Version 3August 2018Ordering InformationLe87501NQC16-pin QFN Green Pkg.TrayThe green package is Halogen free and meets RoHS 2 Directive 2011/65/EU of the European Council to minimize the environmental impact of electrical equipment.Le87501 PLC Single Channel Line DriverLine Driver BD870 SeriesPreliminary Data SheetFigure 1 - Block DiagramFeatures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pin Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Package Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Device Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Test Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Operation States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Input Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Output Driving Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Power Supplies and Component Placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 16-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11Pin DiagramFigure 2 - Pin DiagramNote 1:Pin 1 is marked for orientation.Note 2:The device incorporates an exposed die pad on the underside of its package. The pad acts as a heat sink and must beconnected to a copper plane through thermal vias for proper heat dissipation. It is electrically isolated and may be connected to GND.Pin DescriptionTable 1 - Pin DescriptionsPin #Pin Name Type Description1IREF Input Device Internal Reference Current. Connect a resistor to GND.2VINA Input Amplifier A input 3VINB Input Amplifier B input 4, 10GND Ground Low noise analog ground5, 16C1, C0Inputs Control inputs, sets operation state when channel enabled 6VOUTB Output Amplifier B output 7EN Input Enable/Disable control8, 9, 12, 13, 14NC No connects, no internal connection 11VS Power Power supply 15VOUTAOutputAmplifier A outputAbsolute Maximum RatingsStresses above the values listed under Absolute Maximum Ratings can cause permanent device failure. Functionality at or above these limits is not implied. Exposure to absolute maximum ratings for extended periods can affect device reliability.Storage Temperature−65°C ≤ T A≤ +150°COperating Junction Temperature−40°C ≤ T J≤ +150°C1VS to GND−0.3 V to +16.0 VDriver inputs VINA/B VS to GNDControl inputs C0/1, EN−0.3 V to +4.0 VContinuous Driver Output Current200 mA RMSESD Immunity (Human Body Model)JESD22 Class 2 compliantESD Immunity (Charge Device Model)JESD22 Class IV compliantNote 1:Continuous operation above +145°C junction temperature may degrade device long term reliability.Table 2 - Absolute Maximum RatingsThermal ResistanceThe thermal performance of a thermally enhanced package is assured through optimized printed circuit board layout. Specified performance requires that the exposed thermal pad be soldered to an equally sized exposed copper surface, which, in turn, conducts heat through multiple vias to larger internal copper planes. Package AssemblyThe green package devices are assembled with enhanced, environmental compatible lead-free, halogen-free, and antimony-free materials. The leads possess a matte-tin plating which is compatible with conventional board assembly processes or newer lead-free board assembly processes.Refer to IPC/JEDEC J-Std-020 for recommended peak soldering temperature and solder reflow temperature profile. Operating RangesMicrosemi guarantees the performance of this device over the 0°C to +85°C temperature range by conducting electrical characterization and a single insertion production test coupled with periodic sampling. These procedures comply with the Telcordia GR-357-CORE Generic Requirements for Assuring the Reliability of Components Used in Telecommunications Equipment.Ambient temperature0°C to +85°CVS with respect to GND+10 to +15 VTable 3 - Operation RangesDevice SpecificationsVS = +12V. Device in Enable Full Power state using the Basic Test Circuit (Figure 3), unless otherwise specified.Typical Conditions: T A= 25°C.Min/Max Parameters: T A = 0°C to +85°CSymbol Parameter Condition Min.Typ.Max.Unit Notes PowerI VS Quiescent Supply Current VINA/B floatingEnable Full Power State426070mAEnable 90% Power State405263mAEnable 80% Power State374556mADisable State0.6 1.0 1.2mAStandby State0.30.65 1.0mA Control Input (C0/1, EN) Characteristics1 V IH Input High Voltage 1.2 3.6VV IL Input Low Voltage-0.3+0.6VI IH Input High Current075100µAI IL Input Low Current01015µAChannel Input (VINA/B) CharacteristicsV IH Input Offset Voltage035mVZ I Differential Input Impedance VINA − VINB at 2MHz121518kΩ2 Channel Output (VOUTA/B) CharacteristicsV O Output Voltage9.512VI O Output Current RLoad = 10 Ω600mAZ O Disabled Output Impedance Differential1400ΩChannel Dynamic CharacteristicsVoltage Gain VOUT/VIN at 1 MHz 6.0 6.57.0V/VBandwidth-3 dB170MHz Noise Input Referred Noise Differential8nV/ MTPR Multi Tone Power Ratio PLoad = 40 mW0.5 - 30 MHz-62dBc30 - 86 MHz-32dBcEnable Time Between Disable and anyPower-up state 500nsDisable Time500ns TSD Thermal Shutdown Temperature170°C Notes:1. Internal 50kΩ pull-down on all control inputs2. Guaranteed by design and device characterization.Table 4 - Electrical SpecificationsHzFigure 3 - Basic Test CircuitOperation StatesOperation state control is depicted in Table 5.For active operation, the driver will either be in Enable state (Power-up mode) or Disable state (Power-down mode).A Standby state (long-term Sleep mode) is also provided.EN controls the driver’s power mode as follows:•EN = 0, channel A/B in Power-down mode; EN = 1, channel A/B in Power-up modeC0 and C1 control state selection. A setting of C0 = C1 = 0 overrides EN and places the driver in Standby state. Standby is the default state when power is initially supplied.X = Don’t care.EN C1C0Device State Mode 111Enable Full PowerPower-up 101Enable 90% Power110Enable 80% PowerX00Standby Sleep 011Disable Power-down 010001Table 5 - Operation State ControlTypical Performance CharacteristicsSome typical performance characteristics are shown in Figure 4, Figure 5 and Figure 6.Figure 4 - Differential GainFigure 5 - Disabled Output ImpedanceFigure 6 - Supply Power Versus Load PowerApplicationsThe Le87501 integrates a high-power line driver amplifier designed for low distortion for signals up to 86 MHz.Figure 7 - Typical Application CircuitThe amplifiers have identical positive gain connections with common-mode rejection. Any DC input errors are duplicated and create common-mode rather than differential line errors.Input ConsiderationsThe driving source impedance should be less than 100 nH to avoid any ringing or oscillation.Output Driving ConsiderationsThe internal metallization is designed to drive 200 mA RMS sinusoidal current and there is no current limit mechanism. Driving lines without a series resistor is not recommended.If a DC current path exists between the two outputs, a DC current can flow through the outputs. To avoid DC current flow, the most effective solution is to place DC blocking capacitors in series with the output as shown in Figure 7. Power Supplies and Component PlacementThe power supply should be well bypassed with decoupling placed close to the Le87501.Le87501Preliminary Data Sheet11Microsemi Corporation Confidential and ProprietaryPhysical DimensionsNote:Packages may have mold tooling markings on the surface. These markings have no impact on the form, fit or function of the de-vice. Markings will vary with the mold tool used in manufacturing.Information relating to products and services furnished herein by Microsemi Corporation or its subsidiaries (collectively “Microsemi”) is believed to be reliable. However, Microsemi assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Microsemi or licensed from third parties by Microsemi, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in combination with Microsemi, or non-Microsemi furnished goods or services may infringe patents or other intellectual property rights owned by Microsemi.This publication is issued to provide information only and (unless agreed by Microsemi in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other information appearing in this publication are subject to change by Microsemi without notice. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical and other products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Microsemi’s conditions of sale which are available on request.For more information about all Microsemi productsvisit our website atTECHNICAL DOCUMENTATION – NOT FOR RESALE © 2018 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners.Microsemi Corporation (NASDAQ: MSCC) offers a comprehensive portfolio of semiconductorsolutions for: aerospace, defense and security; enterprise and communications; and industrialand alternative energy markets. Products include mixed-signal ICs, SoCs, and ASICs;programmable logic solutions; power management products; timing and voice processingdevices; RF solutions; discrete components; and systems. Microsemi is headquartered in AlisoViejo, Calif. Learn more at .Microsemi Corporate HeadquartersOne Enterprise, Aliso Viejo CA 92656 USAWithin the USA: +1 (949) 380-6100Sales: +1 (949) 380-6136。
微观傅氏转换红外线光谱仪(MICRO-FTIR)标准制程
微觀傅氏轉換紅外線光譜儀(MICRO-FTIR)標準製程★V70_MIR_MCT.XPM（FTIR測量中紅波段）Resolution：4 cm-1Sample scan time：6 ScansBackground scan time：6 ScansSave data from：7500 cm-1 to 600 cm-1★V70_MIR_DTGS.XPM（FTIR測量中紅波段）Resolution：4 cm-1Sample scan time：32 ScansBackground scan time：32 ScansSave data from：7500 cm-1 to 400 cm-1★V70_NIR_TRA+KG2.XPM（FTIR測量近紅波段）Resolution：8 cm-1Sample scan time：10 ScansBackground scan time：10 ScansSave data from：15000 cm-1 to 4000 cm-1★V70_VIS_TRA+KG1.XPM（FTIR測量可見光波段）Resolution：8 cm-1Sample scan time：32 ScansBackground scan time：32 ScansSave data from：24500 cm-1 to 9000 cm-1★H2K_MIR_MCT.XPM（Micro-FTIR測量中紅波段）Resolution：4 cm-1Sample scan time：32 ScansBackground scan time：32 ScansSave data from：7500 cm-1 to 400 cm-1★H2K_NIR_15X_REFL.XPM（Micro-FTIR測量近紅反射波段）Resolution：8 cm-1Sample scan time：32 ScansBackground scan time：32 ScansSave data from：15000 cm-1 to 4000 cm-1★H2K_NIR_15X_TRA.XPM（Micro-FTIR測量近紅穿透波段） Resolution：8 cm-1Sample scan time：32 ScansBackground scan time：32 ScansSave data from：15000 cm-1 to 4000 cm-1★H2K_VIS_VIS Filter.XPM（Micro-FTIR測量可見光波段） Resolution：8 cm-1Sample scan time：100 ScansBackground scan time：100 ScansSave data from：25000 cm-1 to 6000 cm-1。