MAX4686EBT-T中文资料

合集下载

MAX4616ESD中文资料

MAX4616ESD中文资料19-1501;Rev0;7/99Low-Voltage,High-Speed,Quad,SPSTCMOSAnalogSwitche____________________________FeatureTheMA某4614/MA某4615/MA某4616quad,low-voltage,oFatSwitchingTimeEachwitchhandleV+toGNDanalogignallevel.Ma某imumoff-leakagecurrentionly1nAatT10ma某(+5Vupply)A=+25°Cand6nAatT20ma 某(+3Vupply)A=+85°C.________________________ApplicationBattery-OperatedEquipmentAudio/VideoSignalRoutingOrderingInformationcontinuedatendofdataheet.PinConfiguration/TruthTableRail-to-RailiaregiteredtrademarkofNipponMotorola,Ltd.____________________________________________________________ ____Ma某imIntegratedProductForfreeample&thelatetliterature:,orphone1-800-998-8800.Formallorder,phone1-800-835-8769.MA某4614/MA某4615/MA某4616Low-Voltage,High-Speed,Quad,SPSTCMOSAnalogSwitcheMA某4614/MA某4615/MA某4616ABSOLUTEMA某IMUMRATINGS(VoltagereferencedtoGND)V+,IN_...................................................... ................-0.3Vto+6VCOM_,NO_,NC_(Note1).........................-0.3Vto(V++0.03V)ContinuouCurrent(anyterminal)................... .................±75mAPeakCurrent(NO_,NC_,COM_)(puledat1m,10%dutycycle).................................±2 00mAContinuouPowerDiipation(TA=+70°C)14-PinTSSOP(derate6.3mW/°Cabove+70°C)..........500mW14-PinNarrowSO(derate8.00mW/°Cabove+70°C)..640mW14-PinPlaticDIP(derate10.00mW/°Cabove+70°C)...800mWOperatingTempe ratureRangeMA某461_C__......................................................0°Cto+70°CMA某461_E__....................................................-40°Cto+85°CStorageTemperatureRange............................ .-65°Cto+150°CLeadTemperature(oldering,10ec).................... .........+300°CNote1:SignalonNO_,NC_,orCOM_e某ceedingV+orGNDareclampedbyinternaldiode.Limitforward-diodecurrenttoma某i-mumcurrentrating.Streebeyondthoelitedunder“AboluteMa某imumRating”maycauepermanentdamagetothedevice.Theearetreratingon ly,andfunctionaloperationofthedeviceattheeoranyotherconditionbey ondthoeindicatedintheoperationalectionofthepecificationinotimpli ed.E某pouretoabolutema某imumratingconditionfore某tendedperiodmayaffectdevicereliability.ELECTRICALCHARACTERISTICS—Single+5VSupply(V+=+5V±10%,VIN_H=2.4V,VIN_L=0.8V,TA=TMINtoTMA某,unleotherwienoted.)(Note2)2___________________________________________________________ ____________________________Low-Voltage,High-Speed,Quad,SPSTCMOSAnalogSwitcheELECTRICALCHARACTERISTICS—Single+5VSupply(continued)(V+=+5V±10%,VIN_H=2.4V,VIN_L=0.8V,TA=TMINtoTMA某,unleotherwienoted.)(Note2)_______________________________________________________________ ________________________3MA某4614/MA某4615/MA某4616Low-Voltage,High-Speed,Quad,SPSTCMOSAnalogSwitcheMA某4614/MA某4615/MA某4616ELECTRICALCHARACTERISTICS—Single+3.3VSupply(V+=+3.3V±10%,VIN_H=2.4V,VIN_L=0.5V,TA=TMINtoTMA某,unleotherwienoted.)(Note2)4___________________________________________________________ ____________________________Low-Voltage,High-Speed,Quad,SPSTCMOSAnalogSwitcheELECTRICALCHARACTERISTICS—Single+2.5VSupply(V+=+2.5V,VINH=0.7VCC,VINL=0.5V,TA=TMINtoTMA某,unleotherwienoted.)(Note2)Note2:Thealgebraicconvention,wherethemotnegativevalueiaminim umandthemotpoitivevalueama某imum,iuedinthidataheet.Note3:Guaranteedbydeign.Note4:RON=RON(ma某)-RON(min).Note5:Flatneidefinedathedifferencebetweenthema某imumandminimumvalueofon-reitanceameauredoverthepecifiedanalogignalrange.Note6:Leakageparameterare100%tetedatma某imum-ratedhottemperatureandguaranteedbycorrelationat+25°C.Note7:Off-Iolation=20log10(VCOM_/VNO_),VCOM_=output,VNO_=inputtooffwitch.N ote8:Betweenanytwowitche._______________________________________________________________ ________________________5MA某4614/MA某4615/MA某4616Low-Voltage,High-Speed,Quad,SPSTCMOSAnalogSwitcheMA某4614/MA某4615/MA某4616__________________________________________TypicalOperatingCh aracteritic(V+=+5V,GND=0,TA=+25°C,unleotherwienoted.)ON-RESISTANCEv.VCOM_ANDTEMPERATUREOFF-LEAKAGEv.TEMPERATURE2565ON-RESISTANCE()4321010010OFF-LEAKAGE(pA)20ON-RESISTANCE()15100.10.015000.51.01.52.02.53.03.54.04.55.0VCOM_(V)00.51.01.52.02.53.03.54.04.55.0VCOM_(V)0.001-40-2020406080100TEMPERATURE(°C)ON-LEAKAGEv.TEMPERATURESUPPLYCURRENTv.TEMPERATUREMA某4614-16toc05CHARGEINJECTIONv.VCOM_16CHARGEINJECTION(pC) 1412108642MA某4614-16toc06 10001001810I+(nA)ON-LEAKAGE(pA)100100.11-40-2020406080100TEMPERATURE(°C)0.01-40-2020406080100TEMPERATURE(°C)00.51.01.52.02.53.03.54.04.55.0VCOM_(V)VIN_HINPUTLOGICHIGHTHRESHOLDv.V+ MA某4614-16toc070-10-20GAIN(dB)-30-40-50-60-70-80-9010k100k1M10M100M1.81018014410872360-36-72PHASE(degree)1.6VIN_H(V)1.41.2500M1.02.02.53.03.5V+(V)4.04.55.0-100FREQUENCY(Hz)6___________________________________________________________ ____________________________Low-Voltage,High-Speed,Quad,SPSTCMOSAnalogSwitche____________________________TypicalOperatingCharacteritic(co ntinued)(V+=+5V,GND=0,TA=+25°C,unleotherwienoted.)TOTALHARMONICDISTORTIONPLUSNOISEv.FREQUENCYSWITCHINGTIMEv.VOLTAGE0.05090.04580.040)70.035n()S6%E(0.030MNIT5+G0.025DNHIHT0.0204CTI0.015WS30.01020.005 004k8k12k16k20k022.533.544.555.5FREQUENCY(Hz)V+(V)PinDecription_______________________________________________________________ ________________________7MA某4614/MA某4615/MA某4616Low-Voltage,High-Speed,Quad,SPSTCMOSAnalogSwitcheMA某4614/MA某4615/MA某4616ApplicationInformationPower-SupplySequencingandOvervoltageProtectionDonote某ceedtheabolutema某imumratingbecauetreebeyondthelitedratingmaycaueperma-nentdamagetothedevice.Figure1.OvervoltageProtectionUingTwoE某ternalBlockingDiode diodedrophigherthantheV+pin,ortoadiodedroplowerthantheGNDpin )ialwayacceptable.ProtectiondiodeD1andD2aloprotectagaintomeovervoltageituation .WithFigure1’circuit,iftheup-plyvoltageibelowtheabolutema某imumrating,andifafaultvoltageuptotheabolutema某imumratingiappliedtoananalogignalpin,nodamagewillreult.______________________________________________TetCircuit/Tim ingDiagramFigure2.SwitchingTime8____________________________________________________________ ___________________________Low-Voltage,High-Speed,Quad,SPSTCMOSAnalogSwitcheFigure3.ChargeInjectionFigure4.Off-Iolation/On-ChannelBandwidthFigure5.Crotalk_______________________________________________________________ ________________________9MA某4614/MA某4615/MA某4616Low-Voltage,High-Speed,Quad,SPSTCMOSAnalogSwitcheMA某4614/MA某4615/MA某4616TetCircuit/TimingDiagramTRANSISTORCOUNT:89Figure6.ChannelOff/On-Capacitance10__________________________________________________________ ____________________________Low-Voltage,High-Speed,Quad,SPSTCMOSAnalogSwitche_______________________________________________________________ _______________________11MA某4614/MA某4615/MA某4616Low-Voltage,High-Speed,Quad,SPSTCMOSAnalogSwitcheMA某4614/MA某4615/MA某4616PackageInformation(continued)12____________________Ma某imIntegratedProduct,120SanGabrielDrive,Sunnyvale,CA94086408-737-7600©1999Ma某imIntegratedProductPrintedUSAiaregiteredtrademarkofMa某imIntegratedProduct.。

XCS468专用芯片数据手册说明书

XCS468专用芯片数据手册一、　概述XCS468是一款高精度智能型锂电池充电芯片，具有集成度高，外部电路简单，调节方便，可靠性好，保护措施齐等特点。

该芯片采用脉宽调制方式充电，有涓流、恒流、恒压三种充电模式，内置高精度采样电路，电压判断精度高，充电饱和度高，具有多种故障保护功能，逆向漏电流小，与不同的外电路配合，可满足大多数锂电池充电要求。

二、　特性·双路LED 输出指示 ·支持双槽式充电器 ·脉冲宽度调制方式·涓流转恒流转恒压充电方式 ·短路、过温、过压保护功能 ·内置高精度采样电路 ·内置振荡发生电路·电压判断精度误差<±1％ ·充电饱和度≥90％ ·逆向漏电流小于0.1mA·电路性能稳定，抗干扰能力强三、　芯片管脚说明：GREEN VP ISOV VDD STDV STDC STDTPULSERED ADJUSTGND VN STDCOXT序号管脚名功能说明1 PULSE 充电PWM脉冲输出端2 RED 红色LED指示输出端3 ADJUST 充电电压微调端4 GND 地5 VN 接电池负极6 STDCO 充饱关断电流的参考标准输入端7 XT 温度输入端，接热敏电阻8 STDT 温度的参考标准输入端9 STDC 恒流充电电流的参考标准输入端10 STDV 恒压充电电压的参考标准输入端11 VDD 电源12 ISOV 恒压充电电压的输入端13 VP 接电池正极14 GREEN 绿色LED指示输出端四、　功能框图五、　芯片电参数芯片绝对最大额定值：限定值单位参数符号最小值典型值最大值电源电压Vdd 3 5 7 V输入口电压V -0.5 - Vdd+0.5 V保存温度Ts -65 - 150 ℃芯片工作参数：限定值单位参数符号最小值典型值最大值电源电压Vdd 4.5 5 5.5 V PULSE电流I pulse- 10 - mA PULSE频率F pulse - 9.4 - kHz 状态转换时间T tran- - 1.0 S六、　芯片功能描述1．上电后GREEN和RED管脚同时输出高电平1秒钟；2．当电池没有装入时GREEN和RED管脚输出低，指示无电池；3．当电池插入且VP管脚电压<2.5V时，进行涓流充电，PULSE 管脚输出小占空比的方波，RED管脚输出频率为1Hz的方波；4．当电池插入，VP管脚电压<2.5V且ISOV管脚电压<STDV 管脚电压时，PULSE输出动态调节的脉宽，进行恒流充电，RED管脚输出高电平，指示正常充电；5．当电池插入且ISOV管脚电压≈STDV管脚电压时，进行恒压充电，PULSE输出的脉宽逐渐减小，RED管脚输出高电平，指示正常充电；6．当电池插入且VN管脚电压<STDCO管脚电压时，停止充电，GREEN管脚输出高电平，指示充饱；7．当电池插入，ISOV管脚电压＞STDV管脚电压时，认为电池过压，停止充电，GREEN管脚输出高电平；8．当VP管脚电压<2.5V时，PULSE输出的脉宽减小，进行短路保护，RED管脚输出频率为1Hz的方波；9．当XT管脚电压<STDT管脚电压时，PULSE输出的脉宽减小，进行过温保护，RED管脚输出频率为1Hz的方波；10．各种状态之间的转换时间小于1秒钟；七、　典型应用电路工作参数限定值参数符号单位最小值典型值最大值外部输入电压V in 5.0 5.2 6.2 V 涓流转恒流电压V min 2.0 2.5 3.0 V 涓流充电电流I pre 20 - 100 mA 恒流充电电流I rpd 250 300 350 mA 恒压充电电压V iso 4.14 4.20 4.24 V 充饱关断电流I co 20 40 60 mA 充电饱和度Rsat 90 - - ％逆向漏电流I leak- - 0.2 mA八、　典型应用电路九、　典型应用电路状态描述1．上电后绿色和红色LED同时点亮，显示橙色1秒钟；2．当电池没有装入充电器时LED灭，指示无电池；3．当电池插入且电池电压小于2.5V时，进行涓流充电，红色LED闪烁；4．当电池插入且电池电压2.5V<V bat<4.2V时，进行恒流充电，红色LED点亮，指示正常充电；5．当电池插入且电池电压V bat≈4.2V时，进行恒压充电，红色LED点亮，指示正常充电；6．当电池插入，电池电压Vbat>4.2V时，绿色LED点亮，停止充电,指示电池充饱；7．当电池插入且充电电流小于充饱电流时，绿色LED点亮，停止充电,指示电池充饱；8．当VP和VN端短路时，红色LED闪烁，指示短路故障；9．当电池温度超过允许值时，红色LED闪烁，指示电池过温；十、　典型应用电路说明1．可调节R4,R5,R6,R7的阻值，得到不同的恒流、过温、充饱关断电流的参考电压；2．可调节R13得到不同的过温输入电压；3．可调节R8,R9得到不同的恒压输入电压；4．可调节R12得到不同的过压电压值；5．可调节R10,R11并决定是否短路k1,k2来精确的得到恒压电压值；6．可以调节R15得到不同的充电电流输入电压；。

ZST6000光伏逆变器综合测试仪入门手册V1.02

ZST6000 入门手册
致远电子
安全须知
本仪器的使用涉及到高压，为防止电击或其它危险造成的人员伤亡，在安装、使用或维修本产品之前，请务必仔细阅读、并完全理解“安全须知”章节的相关内容。为保证您能正确安全地使用本仪器，请务必遵守以下注意事项。如果未遵守本手册指定的方法操作本仪器，可能会损坏本仪器的保护功能。因违反以下注意事项操作仪器所引起的损伤，广州致远电子股份有限公司概不承担责任。
产品入门手册 << I
致远电子
注意搬运安全
ZST6000 入门手册
为避免仪器在搬运过程中滑落，造成仪器面板上的按键、旋钮或接口等部件损坏，请注意搬运安全。
警示标志
注意符号表示存在危险。提示用户对某一过程、操作方法或类似情况进行操作时，如果不能正确执行或遵守规则，则可能对产品造成损坏或者丢失重要数据。在完全阅读和充分理解注意所要求的事项之前，请不要继续操作。警告符号表示存在严重危险。提示用户对某一过程、操作方法或类似情况进行操作时，如果不能正确执行或遵守规则，则可能造成人身伤害甚至死亡。在完全阅读和充分理解警告所要求的事项之前，请务必停止操作。
安全信息
光伏逆变器综合测试仪安全符号如下所示。
小心，危险
CE 认证
地端子
小心，电击危险
请勿将使用过的电池丢入垃圾桶
可回收利用
CAT Ⅱ(1000V)IEC 测量Ⅱ类，输入可连接到归属到Ⅱ类过电压条件下的电源 ( 最大 1000VAC)。一般注意事项针对人身安全与设备保护，列出注意事项如下所述：保护功能有缺陷。在使用仪器之前，请对保护功能进行确认。如发现保护接地或保险丝有缺陷，请勿继续使用本仪器；请勿拆卸仪器的机箱。仪器内部有高压，非常危险。若要对仪器内部进行检查和调试，请咨询广州致远电子股份有限公司；出现异味或冒烟时。出现机体冒烟或散发异味等异常情况时，请直接关闭电源，从插座拔掉电源插头，并切断连接在输入端子的测量回路的电源。发生异常情况时，请咨询致远公司；勿在易燃环境下操作仪器。请勿在含有易燃易爆液体或气体的环境里使用本仪器；请勿损坏电源线。请勿将物品摆放在电源线上，并使电源线远离热源。将电源插头从插座拔出时，请勿拉扯电线，而应手持插头拔出。电源线有破损时，请在确认好零件编号后再向经销商订购；

MKT468中文资料

MKT 467
C-tol = ±5% last 5 digits(1)
.. 05564 .. 05684 .. 05824 .. 05105
2000 Aug 30
6
BCcomponents
Product specification
Metallized polyester film capacitors
100 V 04 05 51 52 06 07 61 62 −
250 V 16 17 53 54 18 19 63 64 −
400 V 28 29 55 56 30 31 65 66 −
630 V 40 41 57 58 42 43 67 68 −
1000 V − − − − − − − − 60
loose in box long leads MKT 468 taped on reel taped on reel (bent back) MKT/MKT loose in box 468 H = 16.0 mm; P0 = 12.7 mm H = 16.0 mm; P0 = 15.0 mm lead length 3.5 mm
BCcomponents
Product specification
Metallized polyester film capacitors
MKT RADIAL EPOXY LACQUERED TYPE
MKT 467/468 MKT/MKT 468
PITCH 10/15/22.5/27.5 mm PITCH 7.5 (bent back leads)
l
b
seating plane (1) α (2)
h
lt
P
(1) Hole ∅1.0 for dt = 0.6 mm. (2) 0 ≤ α < 50°.

MAX4410EBE-T中文资料

Features
o No Bulky DC-Blocking Capacitors Required o Ground-Referenced Outputs Eliminate DC-Bias Voltages on Headphone Ground Pin o No Degradation of Low-Frequency Response Due to Output Capacitors o 80mW Per Channel into 16Ω o Low 0.003% THD + N o High PSRR (90dB at 1kHz) o Integrated Click-and-Pop Suppression o 1.8V to 3.6V Single-Supply Operation o Low Quiescent Current o Independent Left/Right, Low-Power Shutdown Controls o Short-Circuit and Thermal Overload Protection o ±8kV ESD-Protected Amplifier Outputs o Available in Space-Saving Packages 16-Bump UCSP (2mm x 2mm x 0.6mm) 14-Pin TSSOP
Pin Configurations and Typical Application Circuit appear at end of data sheet. 1
________________________________________________________________ Maxim Integrated Products

MAX1645BEEI-T中文资料

General DescriptionThe MAX1645B evaluation kit (EV kit) is an efficient,multichemistry battery charger. It uses the Intel System Management Bus (SMBus™) to control the battery reg-ulation voltage, charger current output, and input cur-rent-limit set point.The MAX1645B EV kit can charge one, two, three, or four series Li+ cells with a current up to 3A.The MAX1645B evaluation system (EV system) consists of a MAX1645B EV kit and the Maxim SMBUSMON board. The MAX1645B EV kit includes Windows ®95-/98/2000-/XP-compatible software to provide a user-friendly interface.Features♦Charges Any Battery Chemistry: Li+, NiCd, NiMH,Lead Acid, etc.♦SMBus-Compatible 2-Wire Serial Interface ♦3A (max) Battery Charge Current ♦Up to 18.4V Battery Voltage ♦Up to +28V Input Voltage ♦Easy-to-Use Software Included ♦Proven PC Board Layout♦Fully Assembled and Tested Surface-Mount BoardEvaluate: MAX1645BMAX1645B Evaluation Kit/Evaluation System________________________________________________________________Maxim Integrated Products119-1596; Rev 2; 3/04EV Kit Component ListOrdering InformationSMBus is a registered trademark of Intel Corp.Windows 95/98 are registered trademarks of Microsoft Corp.For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .Quick StartRecommended Equipment•DC source to supply the input current to the charger.This source must be capable of supplying a voltage greater than the battery-voltage set point and have sufficient current rating.•Voltmeter •Smart battery•Computer running Windows 95, 98, 2000, or XP •9-pin serial extension cable •SMBUSMON boardProcedureThe MAX1645B EV kit is a fully assembled and tested board. Follow the steps below to verify board operation.Do not turn on the power supply until all connec-tions are completed. Observe all precautions on the battery manufacturer’s data sheet.1)Set the VPP jumper on the SMBUSMON board toVCC5.2)Carefully connect the boards by aligning the 20-pinconnector of the MAX1645B EV kit with the 20-pin header of the SMBUSMON board. Gently press them together.3)Connect a cable from the computer’s serial port to theSMBUSMON interface board. Use a straight-through 9-pin female-to-male cable.4)I nstall the software by running the INSTALL.EXEprogram. The install program copies the files and creates icons for them in the Windows 95/98/2000/XP start menu. An uninstall program is included with the software. Click on the UNINSTALL icon to remove the EV kit software from the hard drive.5)Connect power to the SMBUSMON board.6)Connect the input-current supply across theADAPTER_IN and PGND pads.7)Connect a smart battery to connector H2.8)Turn on the power supply.9)Start the MAX1645B EV kit software.10)Verify current is being delivered to the battery.E v a l u a t e : M A X 1645BMAX1645B Evaluation Kit/Evaluation System 2_______________________________________________________________________________________Table 1. Jumper FunctionsEV Kit Component List (cont.)Component SuppliersNote:Please indicate that you are using the MAX1645B when contacting the above component suppliers.Evaluate: MAX1645BMAX1645B Evaluation Kit/Evaluation System_______________________________________________________________________________________3Figure 1. Block Diagram of MAX1645B EV SystemE v a l u a t e : M A X 1645BMAX1645B Evaluation Kit/Evaluation System4_______________________________________________________________________________________Detailed Description of SoftwareThe MAX1645B program provides easy access to the MAX1645B registers. I t is also capable of reading the registers of a smart battery and monitoring SMBus traffic.Upon execution of the program, the software enables the MAX1645B smart-charger command panel (Figure 2),after which any of the allowed SMBus commands can be sent to the MAX1645B. Refer to the MAX1645B data sheet for more information regarding the allowed SMBus commands.Smart-Charger Command PanelChargeVoltage()To issue the ChargeVoltage() command to the MAX1645B, enter the desired voltage, in millivolts, into the Charging Voltage edit field and select the adjacent Write button.ChargeCurrent()To issue the ChargeCurrent() command to the MAX1645B, enter the desired current, in milliamps, into the Charging Current edit field and select the adjacent Write button.Figure 2. MAX1645B Smart-Charger Command PanelEvaluate: MAX1645BMAX1645B Evaluation Kit/Evaluation System_______________________________________________________________________________________5Auto Rewrite CheckboxesThe MAX1645B needs to receive a ChargeVoltage() or ChargeCurrent() command every 175s (typ); otherwise,the MAX1645B times out and terminates ually, a smart battery sends these necessary com-mands. However, when not using a smart battery with the MAX1645B EV kit, select either (or both) of the Auto Rewrite checkboxes located directly under the Charging Current and Charging Voltage edit fields. This generates a ChargeVoltage() or ChargeCurrent() command at the selected time interval located on the Timer panel.ChargerMode()To issue the ChargerMode() command to the MAX1645B, select a combination of checkboxes in the Charger Mode panel of commands. Each checkbox represents a bit in the ChargerMode() command word.Select the checkboxes next to the bits for which the software should write a 1, unselect the checkboxes for a 0. Send the command by selecting the Writebutton.Figure 3. MAX1645B Smart-Charger Command Panel Showing the Pulldown List For Charger Spec Info and Alarm WarningE v a l u a t e : M A X 1645BChargerStatus()Charger status is shown in the Charger Status panel.Each of the bits in the ChargerStatus() command word are shown individually with a short description of the bit.By default, the status is automatically read once every two seconds. Disable this feature by unselecting the Active Read: Charger checkbox located on the Timer panel. Change the refresh time by entering a new value into the Timer I nterval edit box and select the Set Interval button. When Auto Refresh is disabled, issue a ChargerStatus() command by selecting the Read button on the Charger Status panel.ChargerSpecInfo()ChargerSpecI nfo() returns the Charger Specification (0x0009) from the MAX1645B. This command is available through the “Other Bitmapped Charger Registers...”panel. Select Charger Spec I nfo by picking it from the pulldown list located directly under the Other Bitmapped Charger Registers... label. I ssue a ChargerSpecI nfo()command by selecting the Read button. The returned hexadecimal value is shown at the bottom of the panel.AlarmWarning()Alarm Warning is shown on the Other Bitmapped Charger Registers... panel (Figure 3). Select Alarm Warning by picking it from the pulldown list located directly under the Other Bitmapped Charger Registers... label. Each of the bits in the AlarmWarning() command word are shown individually with a short description of the bit and a checkbox. Select the checkboxes next to the bits for which the software should write a 1; unselect the check-boxes for a 0. Send the command to the MAX1645B by selecting the Write button.Smart-Battery Command PanelThe software is capable of reading the registers of a smart battery. The smart battery page of the software is shown in Figure 4. The software only reads the registers selected with checkmarks. By default, the registers are automatically read once every two seconds. Disable this feature by unselecting the Active Read: Battery checkbox located on the Timer panel. Change the refresh time by entering a new value into the Timer Interval edit box and select the Set Interval button. When Auto Refresh is dis-abled, read the battery by selecting the Refresh button.Detailed Descriptionof HardwareInput Current LimitingThe MAX1645B EV kit is configured to regulate the bat-tery current so that the total V IN input current does not exceed 2.5A. I f a load is connected across the LOADand GND pads (another system power supply, for example) that would cause the total current from V IN to exceed 2.5A, the MAX1645B will automatically decrease its charging current to regulate the input cur-rent to 2.5A. Refer to the MAX1645B data sheet for more information regarding input current limiting.Connecting a Smart BatteryThe MAX1645B EV kit includes a five-element terminal block to facilitate connecting the EV kit to a smart battery.Refer to the smart battery specification to identify the type of smart battery connector suited to your application.Make sure that the EV kit power is turned off, and connect the (+), C, D, T, and (-) terminals from the EV kit board to the smart battery connector using no more than 2inches of wire. Remove the JU3 shunt, attach a smart battery to the smart battery connector, and turn the EV kit power back on. See Figure 1 if necessary.Connecting an Electronic LoadIf a smart battery is unavailable, an electronic load can be connected across the BATT and GND pads on the MAX1645B EV kit board. Make sure that the EV kit power is turned off before connecting a load. Make sure that JU3 is shunted, making it appear to the MAX1645B as if a smart battery were connected. After the load is connected, program the load in voltage mode and set the electronic load to clamp at 5V. Turn on the power to the EV kit, and program the MAX1645B with a charging voltage of 12V at the maximum charging current. Verify that the MAX1645B is supplying the maximum current to the load. I ncrease the electronic load clamp voltage in 1V increments, and verify that as the electronic load voltage crosses 12V, the MAX1645B transitions from current regulation to voltage regulation;as the electronic load voltage increases beyond 12V,the BATT voltage should remain fixed at 12V.Layout ConsiderationsThe MAX1645B EV kit layout is optimized for fast switch-ing and high currents. The traces connecting the power components must be able to carry at least 3A. Take care to ensure that C1 and C2 (the input capacitors),D2 and N2 (the synchronous rectifier), and C3 and C4(the output capacitors) are all connected to GND at a common point, and to isolate the power GND from the quiet analog GND.MAX1645B Evaluation Kit/Evaluation System 6_______________________________________________________________________________________Evaluate: MAX1645BMAX1645B Evaluation Kit/Evaluation System_______________________________________________________________________________________7Figure 4. MAX1645B Smart-Battery Command PanelE v a l u a t e : M A X 1645BMAX1645B Evaluation Kit/Evaluation System 8_______________________________________________________________________________________Figure 5. MAX1645B EV Kit SchematicMaxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600______________________9©2004 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.Figure 6. MAX1645B EV Kit Component Placement Guide—Component Side Figure 7. MAX1645B EV Kit Component Placement Guide—Solder SideFigure 8. MAX1645B EV Kit PC Board Layout—ComponentSideFigure 9. MAX1645B EV Kit PC Board Layout—Solder SideMAX1645B Evaluation Kit/Evaluation SystemEvaluate: MAX1645B。

英飞凌单片机选型手册

XC166 40 MHz, Single Cycle
XC164CS Mid-range
XC164CM Low-end
XC167 High-end Motor Ctrl
XC161 High-end
C500 20 MHz, 12 Cycle
C505 44 Pin, CAN
C515 80 Pin, CAN
with 2 Nodes
–
MultiCAN with 2 Nodes
✓
✓
3 + 1-ch
✓
2
✓
✓
✓
PG-TQFP-64
✓
–
✓
✓
3 + 1-ch
✓
2
✓
✓
✓
PG-TQFP-64
✓
MultiCAN with 2 Nodes
✓
✓
3 + 1-ch
✓
2
✓
✓
✓
PG-TQFP-64
32-bit Microcontrollers
8
8-bit Microcontrollers
C505CA
10
C515C
12
C868
14
XC866
16
XC886/888CLM
18
XC886/888LM
20
Starter Kits for 8-bit Microcontrollers
22
16-bit Microcontrollers
C161K/O
24
✓
2
✓
✓
✓
PG-TQFP-48
✓
–
✓
✓
3 + 1-ch

MAX490ESA+T中文资料

For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .General DescriptionThe MAX481, MAX483, MAX485, MAX487–MAX491, and MAX1487 are low-power transceivers for RS-485 and RS-422 communication. Each part contains one driver and one receiver. The MAX483, MAX487, MAX488, and MAX489feature reduced slew-rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables,thus allowing error-free data transmission up to 250kbps.The driver slew rates of the MAX481, MAX485, MAX490,MAX491, and MAX1487 are not limited, allowing them to transmit up to 2.5Mbps.These transceivers draw between 120µA and 500µA of supply current when unloaded or fully loaded with disabled drivers. Additionally, the MAX481, MAX483, and MAX487have a low-current shutdown mode in which they consume only 0.1µA. All parts operate from a single 5V supply.Drivers are short-circuit current limited and are protected against excessive power dissipation by thermal shutdown circuitry that places the driver outputs into a high-imped-ance state. The receiver input has a fail-safe feature that guarantees a logic-high output if the input is open circuit.The MAX487 and MAX1487 feature quarter-unit-load receiver input impedance, allowing up to 128 MAX487/MAX1487 transceivers on the bus. Full-duplex communi-cations are obtained using the MAX488–MAX491, while the MAX481, MAX483, MAX485, MAX487, and MAX1487are designed for half-duplex applications.________________________ApplicationsLow-Power RS-485 Transceivers Low-Power RS-422 Transceivers Level TranslatorsTransceivers for EMI-Sensitive Applications Industrial-Control Local Area Networks__Next Generation Device Features♦For Fault-Tolerant ApplicationsMAX3430: ±80V Fault-Protected, Fail-Safe, 1/4Unit Load, +3.3V, RS-485 TransceiverMAX3440E–MAX3444E: ±15kV ESD-Protected,±60V Fault-Protected, 10Mbps, Fail-Safe, RS-485/J1708 Transceivers♦For Space-Constrained ApplicationsMAX3460–MAX3464: +5V, Fail-Safe, 20Mbps,Profibus RS-485/RS-422 TransceiversMAX3362: +3.3V, High-Speed, RS-485/RS-422Transceiver in a SOT23 PackageMAX3280E–MAX3284E: ±15kV ESD-Protected,52Mbps, +3V to +5.5V, SOT23, RS-485/RS-422,True Fail-Safe ReceiversMAX3293/MAX3294/MAX3295: 20Mbps, +3.3V,SOT23, RS-855/RS-422 Transmitters ♦For Multiple Transceiver ApplicationsMAX3030E–MAX3033E: ±15kV ESD-Protected,+3.3V, Quad RS-422 Transmitters ♦For Fail-Safe ApplicationsMAX3080–MAX3089: Fail-Safe, High-Speed (10Mbps), Slew-Rate-Limited RS-485/RS-422Transceivers♦For Low-Voltage ApplicationsMAX3483E/MAX3485E/MAX3486E/MAX3488E/MAX3490E/MAX3491E: +3.3V Powered, ±15kV ESD-Protected, 12Mbps, Slew-Rate-Limited,True RS-485/RS-422 TransceiversMAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers______________________________________________________________Selection Table19-0122; Rev 8; 10/03Ordering Information appears at end of data sheet.M A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSSupply Voltage (V CC ).............................................................12V Control Input Voltage (RE , DE)...................-0.5V to (V CC + 0.5V)Driver Input Voltage (DI).............................-0.5V to (V CC + 0.5V)Driver Output Voltage (A, B)...................................-8V to +12.5V Receiver Input Voltage (A, B).................................-8V to +12.5V Receiver Output Voltage (RO).....................-0.5V to (V CC +0.5V)Continuous Power Dissipation (T A = +70°C)8-Pin Plastic DIP (derate 9.09mW/°C above +70°C)....727mW 14-Pin Plastic DIP (derate 10.00mW/°C above +70°C)..800mW 8-Pin SO (derate 5.88mW/°C above +70°C).................471mW14-Pin SO (derate 8.33mW/°C above +70°C)...............667mW 8-Pin µMAX (derate 4.1mW/°C above +70°C)..............830mW 8-Pin CERDIP (derate 8.00mW/°C above +70°C).........640mW 14-Pin CERDIP (derate 9.09mW/°C above +70°C).......727mW Operating Temperature RangesMAX4_ _C_ _/MAX1487C_ A...............................0°C to +70°C MAX4__E_ _/MAX1487E_ A.............................-40°C to +85°C MAX4__MJ_/MAX1487MJA...........................-55°C to +125°C Storage Temperature Range.............................-65°C to +160°C Lead Temperature (soldering, 10sec).............................+300°CDC ELECTRICAL CHARACTERISTICS(V CC = 5V ±5%, T A = T MIN to T MAX , unless otherwise noted.) (Notes 1, 2)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.V V IN = -7VV IN = 12V V IN = -7V V IN = 12V Input Current (A, B)I IN2V TH k Ω48-7V ≤V CM ≤12V, MAX487/MAX1487R INReceiver Input Resistance -7V ≤V CM ≤12V, all devices except MAX487/MAX1487R = 27Ω(RS-485), Figure 40.4V ≤V O ≤2.4VR = 50Ω(RS-422)I O = 4mA, V ID = -200mV I O = -4mA, V ID = 200mV V CM = 0V-7V ≤V CM ≤12V DE, DI, RE DE, DI, RE MAX487/MAX1487,DE = 0V, V CC = 0V or 5.25VDE, DI, RE R = 27Ωor 50Ω, Figure 4R = 27Ωor 50Ω, Figure 4R = 27Ωor 50Ω, Figure 4DE = 0V;V CC = 0V or 5.25V,all devices except MAX487/MAX1487CONDITIONSk Ω12µA ±1I OZRThree-State (high impedance)Output Current at ReceiverV 0.4V OL Receiver Output Low Voltage 3.5V OH Receiver Output High Voltage mV 70∆V TH Receiver Input Hysteresis V -0.20.2Receiver Differential Threshold Voltage-0.2mA 0.25mA-0.81.01.55V OD2Differential Driver Output (with load)V 2V 5V OD1Differential Driver Output (no load)µA±2I IN1Input CurrentV 0.8V IL Input Low Voltage V 2.0V IH Input High Voltage V 0.2∆V OD Change in Magnitude of Driver Common-Mode Output Voltage for Complementary Output States V 0.2∆V OD Change in Magnitude of Driver Differential Output Voltage for Complementary Output States V 3V OC Driver Common-Mode Output VoltageUNITS MINTYPMAX SYMBOL PARAMETERMAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers_______________________________________________________________________________________3SWITCHING CHARACTERISTICS—MAX481/MAX485, MAX490/MAX491, MAX1487(V CC = 5V ±5%, T A = T MIN to T MAX , unless otherwise noted.) (Notes 1, 2)DC ELECTRICAL CHARACTERISTICS (continued)(V CC = 5V ±5%, T A = T MIN to T MAX , unless otherwise noted.) (Notes 1, 2)ns 103060t PHLDriver Rise or Fall Time Figures 6 and 8, R DIFF = 54Ω, C L1= C L2= 100pF ns MAX490M, MAX491M MAX490C/E, MAX491C/E2090150MAX481, MAX485, MAX1487MAX490M, MAX491MMAX490C/E, MAX491C/E MAX481, MAX485, MAX1487Figures 6 and 8, R DIFF = 54Ω,C L1= C L2= 100pF MAX481 (Note 5)Figures 5 and 11, C RL = 15pF, S2 closedFigures 5 and 11, C RL = 15pF, S1 closed Figures 5 and 11, C RL = 15pF, S2 closed Figures 5 and 11, C RL = 15pF, S1 closed Figures 6 and 10, R DIFF = 54Ω,C L1= C L2= 100pFFigures 6 and 8,R DIFF = 54Ω,C L1= C L2= 100pF Figures 6 and 10,R DIFF = 54Ω,C L1= C L2= 100pF CONDITIONS ns 510t SKEW ns50200600t SHDNTime to ShutdownMbps 2.5f MAX Maximum Data Rate ns 2050t HZ Receiver Disable Time from High ns 103060t PLH 2050t LZ Receiver Disable Time from Low ns 2050t ZH Driver Input to Output Receiver Enable to Output High ns 2050t ZL Receiver Enable to Output Low 2090200ns ns 134070t HZ t SKD Driver Disable Time from High |t PLH - t PHL |DifferentialReceiver Skewns 4070t LZ Driver Disable Time from Low ns 4070t ZL Driver Enable to Output Low 31540ns51525ns 31540t R , t F 2090200Driver Output Skew to Output t PLH , t PHL Receiver Input to Output4070t ZH Driver Enable to Output High UNITS MIN TYP MAX SYMBOL PARAMETERFigures 7 and 9, C L = 100pF, S2 closed Figures 7 and 9, C L = 100pF, S1 closed Figures 7 and 9, C L = 15pF, S1 closed Figures 7 and 9, C L = 15pF, S2 closedM A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 4_______________________________________________________________________________________SWITCHING CHARACTERISTICS—MAX483, MAX487/MAX488/MAX489(V CC = 5V ±5%, T A = T MIN to T MAX , unless otherwise noted.) (Notes 1, 2)SWITCHING CHARACTERISTICS—MAX481/MAX485, MAX490/MAX491, MAX1487 (continued)(V CC = 5V ±5%, T A = T MIN to T MAX , unless otherwise noted.) (Notes 1, 2)3001000Figures 7 and 9, C L = 100pF, S2 closed Figures 7 and 9, C L = 100pF, S1 closed Figures 5 and 11, C L = 15pF, S2 closed,A - B = 2VCONDITIONSns 40100t ZH(SHDN)Driver Enable from Shutdown toOutput High (MAX481)nsFigures 5 and 11, C L = 15pF, S1 closed,B - A = 2Vt ZL(SHDN)Receiver Enable from Shutdownto Output Low (MAX481)ns 40100t ZL(SHDN)Driver Enable from Shutdown toOutput Low (MAX481)ns 3001000t ZH(SHDN)Receiver Enable from Shutdownto Output High (MAX481)UNITS MINTYP MAX SYMBOLPARAMETERt PLH t SKEW Figures 6 and 8, R DIFF = 54Ω,C L1= C L2= 100pFt PHL Figures 6 and 8, R DIFF = 54Ω,C L1= C L2= 100pFDriver Input to Output Driver Output Skew to Output ns 100800ns ns 2000MAX483/MAX487, Figures 7 and 9,C L = 100pF, S2 closedt ZH(SHDN)Driver Enable from Shutdown to Output High2502000ns2500MAX483/MAX487, Figures 5 and 11,C L = 15pF, S1 closedt ZL(SHDN)Receiver Enable from Shutdown to Output Lowns 2500MAX483/MAX487, Figures 5 and 11,C L = 15pF, S2 closedt ZH(SHDN)Receiver Enable from Shutdown to Output Highns 2000MAX483/MAX487, Figures 7 and 9,C L = 100pF, S1 closedt ZL(SHDN)Driver Enable from Shutdown to Output Lowns 50200600MAX483/MAX487 (Note 5) t SHDN Time to Shutdownt PHL t PLH , t PHL < 50% of data period Figures 5 and 11, C RL = 15pF, S2 closed Figures 5 and 11, C RL = 15pF, S1 closed Figures 5 and 11, C RL = 15pF, S2 closed Figures 5 and 11, C RL = 15pF, S1 closed Figures 7 and 9, C L = 15pF, S2 closed Figures 6 and 10, R DIFF = 54Ω,C L1= C L2= 100pFFigures 7 and 9, C L = 15pF, S1 closed Figures 7 and 9, C L = 100pF, S1 closed Figures 7 and 9, C L = 100pF, S2 closed CONDITIONSkbps 250f MAX 2508002000Maximum Data Rate ns 2050t HZ Receiver Disable Time from High ns 25080020002050t LZ Receiver Disable Time from Low ns 2050t ZH Receiver Enable to Output High ns 2050t ZL Receiver Enable to Output Low ns ns 1003003000t HZ t SKD Driver Disable Time from High I t PLH - t PHL I DifferentialReceiver SkewFigures 6 and 10, R DIFF = 54Ω,C L1= C L2= 100pFns 3003000t LZ Driver Disable Time from Low ns 2502000t ZL Driver Enable to Output Low ns Figures 6 and 8, R DIFF = 54Ω,C L1= C L2= 100pFns 2502000t R , t F 2502000Driver Rise or Fall Time ns t PLH Receiver Input to Output2502000t ZH Driver Enable to Output High UNITS MIN TYP MAX SYMBOL PARAMETERMAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers_______________________________________________________________________________________530002.5OUTPUT CURRENT vs.RECEIVER OUTPUT LOW VOLTAGE525M A X 481-01OUTPUT LOW VOLTAGE (V)O U T P U T C U R R E N T (m A )1.515100.51.02.0203540450.90.1-50-252575RECEIVER OUTPUT LOW VOLTAGE vs.TEMPERATURE0.30.7TEMPERATURE (°C)O U T P U TL O W V O L T A G E (V )500.50.80.20.60.40100125-20-41.5 2.0 3.0 5.0OUTPUT CURRENT vs.RECEIVER OUTPUT HIGH VOLTAGE-8-16M A X 481-02OUTPUT HIGH VOLTAGE (V)O U T P U T C U R R E N T (m A )2.5 4.0-12-18-6-14-10-203.54.5 4.83.2-50-252575RECEIVER OUTPUT HIGH VOLTAGE vs.TEMPERATURE3.64.4TEMPERATURE (°C)O U T P UT H I G H V O L T A G E (V )0504.04.63.44.23.83.01001259000 1.0 3.0 4.5DRIVER OUTPUT CURRENT vs.DIFFERENTIAL OUTPUT VOLTAGE1070M A X 481-05DIFFERENTIAL OUTPUT VOLTAGE (V)O U T P U T C U R R E N T (m A )2.0 4.05030806040200.5 1.5 2.53.5 2.31.5-50-2525125DRIVER DIFFERENTIAL OUTPUT VOLTAGEvs. TEMPERATURE1.72.1TEMPERATURE (°C)D I F FE R E N T I A L O U T P U T V O L T A G E (V )751.92.21.62.01.8100502.4__________________________________________Typical Operating Characteristics(V CC = 5V, T A = +25°C, unless otherwise noted.)NOTES FOR ELECTRICAL/SWITCHING CHARACTERISTICSNote 1:All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to deviceground unless otherwise specified.Note 2:All typical specifications are given for V CC = 5V and T A = +25°C.Note 3:Supply current specification is valid for loaded transmitters when DE = 0V.Note 4:Applies to peak current. See Typical Operating Characteristics.Note 5:The MAX481/MAX483/MAX487 are put into shutdown by bringing RE high and DE low. If the inputs are in this state for lessthan 50ns, the parts are guaranteed not to enter shutdown. If the inputs are in this state for at least 600ns, the parts are guaranteed to have entered shutdown. See Low-Power Shutdown Mode section.M A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 6___________________________________________________________________________________________________________________Typical Operating Characteristics (continued)(V CC = 5V, T A = +25°C, unless otherwise noted.)120008OUTPUT CURRENT vs.DRIVER OUTPUT LOW VOLTAGE20100M A X 481-07OUTPUT LOW VOLTAGE (V)O U T P U T C U R R E N T (m A )6604024801012140-1200-7-5-15OUTPUT CURRENT vs.DRIVER OUTPUT HIGH VOLTAGE-20-80M A X 481-08OUTPUT HIGH VOLTAGE (V)O U T P U T C U R R E N T (m A )-31-603-6-4-2024-100-40100-40-60-2040100120MAX1487SUPPLY CURRENT vs. TEMPERATURE300TEMPERATURE (°C)S U P P L Y C U R R E N T (µA )20608050020060040000140100-50-2550100MAX481/MAX485/MAX490/MAX491SUPPLY CURRENT vs. TEMPERATURE300TEMPERATURE (°C)S U P P L Y C U R R E N T (µA )257550020060040000125100-50-2550100MAX483/MAX487–MAX489SUPPLY CURRENT vs. TEMPERATURE300TEMPERATURE (°C)S U P P L Y C U R R E N T (µA )257550020060040000125MAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers_______________________________________________________________________________________7______________________________________________________________Pin DescriptionFigure 1. MAX481/MAX483/MAX485/MAX487/MAX1487 Pin Configuration and Typical Operating CircuitM A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487__________Applications InformationThe MAX481/MAX483/MAX485/MAX487–MAX491 and MAX1487 are low-power transceivers for RS-485 and RS-422 communications. The MAX481, MAX485, MAX490,MAX491, and MAX1487 can transmit and receive at data rates up to 2.5Mbps, while the MAX483, MAX487,MAX488, and MAX489 are specified for data rates up to 250kbps. The MAX488–MAX491 are full-duplex trans-ceivers while the MAX481, MAX483, MAX485, MAX487,and MAX1487 are half-duplex. In addition, Driver Enable (DE) and Receiver Enable (RE) pins are included on the MAX481, MAX483, MAX485, MAX487, MAX489,MAX491, and MAX1487. When disabled, the driver and receiver outputs are high impedance.MAX487/MAX1487:128 Transceivers on the BusThe 48k Ω, 1/4-unit-load receiver input impedance of the MAX487 and MAX1487 allows up to 128 transceivers on a bus, compared to the 1-unit load (12k Ωinput impedance) of standard RS-485 drivers (32 trans-ceivers maximum). Any combination of MAX487/MAX1487 and other RS-485 transceivers with a total of 32 unit loads or less can be put on the bus. The MAX481/MAX483/MAX485 and MAX488–MAX491 have standard 12k ΩReceiver Input impedance.Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 8_______________________________________________________________________________________Figure 2. MAX488/MAX490 Pin Configuration and Typical Operating CircuitFigure 3. MAX489/MAX491 Pin Configuration and Typical Operating CircuitMAX483/MAX487/MAX488/MAX489:Reduced EMI and ReflectionsThe MAX483 and MAX487–MAX489 are slew-rate limit-ed, minimizing EMI and reducing reflections caused by improperly terminated cables. Figure 12 shows the dri-ver output waveform and its Fourier analysis of a 150kHz signal transmitted by a MAX481, MAX485,MAX490, MAX491, or MAX1487. High-frequency har-monics with large amplitudes are evident. Figure 13shows the same information displayed for a MAX483,MAX487, MAX488, or MAX489 transmitting under the same conditions. Figure 13’s high-frequency harmonics have much lower amplitudes, and the potential for EMI is significantly reduced.MAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers_______________________________________________________________________________________9_________________________________________________________________Test CircuitsFigure 4. Driver DC Test Load Figure 5. Receiver Timing Test LoadFigure 6. Driver/Receiver Timing Test Circuit Figure 7. Driver Timing Test LoadM A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 10_______________________________________________________Switching Waveforms_________________Function Tables (MAX481/MAX483/MAX485/MAX487/MAX1487)Figure 8. Driver Propagation DelaysFigure 9. Driver Enable and Disable Times (except MAX488 and MAX490)Figure 10. Receiver Propagation DelaysFigure 11. Receiver Enable and Disable Times (except MAX488and MAX490)Table 1. TransmittingTable 2. ReceivingLow-Power Shutdown Mode (MAX481/MAX483/MAX487)A low-power shutdown mode is initiated by bringing both RE high and DE low. The devices will not shut down unless both the driver and receiver are disabled.In shutdown, the devices typically draw only 0.1µA of supply current.RE and DE may be driven simultaneously; the parts are guaranteed not to enter shutdown if RE is high and DE is low for less than 50ns. If the inputs are in this state for at least 600ns, the parts are guaranteed to enter shutdown.For the MAX481, MAX483, and MAX487, the t ZH and t ZL enable times assume the part was not in the low-power shutdown state (the MAX485/MAX488–MAX491and MAX1487 can not be shut down). The t ZH(SHDN)and t ZL(SHDN)enable times assume the parts were shut down (see Electrical Characteristics ).It takes the drivers and receivers longer to become enabled from the low-power shutdown state (t ZH(SHDN ), t ZL(SHDN)) than from the operating mode (t ZH , t ZL ). (The parts are in operating mode if the –R —E –,DE inputs equal a logical 0,1 or 1,1 or 0, 0.)Driver Output ProtectionExcessive output current and power dissipation caused by faults or by bus contention are prevented by two mechanisms. A foldback current limit on the output stage provides immediate protection against short cir-cuits over the whole common-mode voltage range (see Typical Operating Characteristics ). In addition, a ther-mal shutdown circuit forces the driver outputs into a high-impedance state if the die temperature rises excessively.Propagation DelayMany digital encoding schemes depend on the differ-ence between the driver and receiver propagation delay times. Typical propagation delays are shown in Figures 15–18 using Figure 14’s test circuit.The difference in receiver delay times, | t PLH - t PHL |, is typically under 13ns for the MAX481, MAX485,MAX490, MAX491, and MAX1487 and is typically less than 100ns for the MAX483 and MAX487–MAX489.The driver skew times are typically 5ns (10ns max) for the MAX481, MAX485, MAX490, MAX491, and MAX1487, and are typically 100ns (800ns max) for the MAX483 and MAX487–MAX489.MAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers______________________________________________________________________________________1110dB/div0Hz5MHz500kHz/div10dB/div0Hz5MHz500kHz/divFigure 12. Driver Output Waveform and FFT Plot of MAX481/MAX485/MAX490/MAX491/MAX1487 Transmitting a 150kHz SignalFigure 13. Driver Output Waveform and FFT Plot of MAX483/MAX487–MAX489 Transmitting a 150kHz SignalM A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 12______________________________________________________________________________________V CC = 5V T A = +25°CV CC = 5V T A = +25°CV CC = 5V T A = +25°CV CC = 5V T A = +25°CFigure 14. Receiver Propagation Delay Test CircuitFigure 15. MAX481/MAX485/MAX490/MAX491/MAX1487Receiver t PHLFigure 16. MAX481/MAX485/MAX490/MAX491/MAX1487Receiver t PLHPHL Figure 18. MAX483, MAX487–MAX489 Receiver t PLHLine Length vs. Data RateThe RS-485/RS-422 standard covers line lengths up to 4000 feet. For line lengths greater than 4000 feet, see Figure 23.Figures 19 and 20 show the system differential voltage for the parts driving 4000 feet of 26AWG twisted-pair wire at 110kHz into 120Ωloads.Typical ApplicationsThe MAX481, MAX483, MAX485, MAX487–MAX491, and MAX1487 transceivers are designed for bidirectional data communications on multipoint bus transmission lines.Figures 21 and 22 show typical network applications circuits. These parts can also be used as line repeaters, with cable lengths longer than 4000 feet, as shown in Figure 23.To minimize reflections, the line should be terminated at both ends in its characteristic impedance, and stub lengths off the main line should be kept as short as possi-ble. The slew-rate-limited MAX483 and MAX487–MAX489are more tolerant of imperfect termination.MAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers______________________________________________________________________________________13DIV Y -V ZRO5V 0V1V0V -1V5V 0V2µs/divFigure 19. MAX481/MAX485/MAX490/MAX491/MAX1487 System Differential Voltage at 110kHz Driving 4000ft of Cable Figure 20. MAX483, MAX487–MAX489 System Differential Voltage at 110kHz Driving 4000ft of CableFigure 21. MAX481/MAX483/MAX485/MAX487/MAX1487 Typical Half-Duplex RS-485 NetworkM A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 14______________________________________________________________________________________Figure 22. MAX488–MAX491 Full-Duplex RS-485 NetworkFigure 23. Line Repeater for MAX488–MAX491Isolated RS-485For isolated RS-485 applications, see the MAX253 and MAX1480 data sheets.MAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers______________________________________________________________________________________15_______________Ordering Information_________________Chip TopographiesMAX481/MAX483/MAX485/MAX487/MAX1487N.C. RO 0.054"(1.372mm)0.080"(2.032mm)DE DIGND B N.C.V CCARE * Contact factory for dice specifications.__Ordering Information (continued)M A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 16______________________________________________________________________________________TRANSISTOR COUNT: 248SUBSTRATE CONNECTED TO GNDMAX488/MAX490B RO 0.054"(1.372mm)0.080"(2.032mm)N.C. DIGND Z A V CCYN.C._____________________________________________Chip Topographies (continued)MAX489/MAX491B RO 0.054"(1.372mm)0.080"(2.032mm)DE DIGND Z A V CCYREMAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers______________________________________________________________________________________17Package Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)S O I C N .E P SM A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 18______________________________________________________________________________________Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)MAX481/MAX483/MAX485/MAX487–MAX491Low-Power, Slew-Rate-Limited RS-485/RS-422 TransceiversMaxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________19©2003 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.M A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487P D I P N .E PSPackage Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)。

MAX6064AEUR-T中文资料

MAX6064AEUR-T中⽂资料General DescriptionThe MAX6061–MAX6068 are precision, low-dropout,micropower voltage references. These three-terminal devices are available with output voltage options of 1.25V, 1.8V, 2.048V, 2.5V, 3V, 4.096V, 4.5V, and 5V.They feature a proprietary curvature-correction circuit and laser-trimmed thin-film resistors that result in a very low temperature coefficient of 20ppm/°C (max) and an initial accuracy of ±0.2% (max). Specifications apply to the extended temperature range (-40°C to +85°C). The MAX6061–MAX6068 typically draw only 90µA of supply current and can source 5mA or sink 2mA of load current. Unlike conventional shunt-mode (two-terminal)references that waste supply current and require an external resistor, these devices offer a supply current that is virtually independent of the supply voltage (8µA/V variation) and do not require an external resis-tor. Additionally, the internally compensated devices do not require an external compensation capacitor.Eliminating the external compensation capacitor saves valuable board area in space-critical applications. Low dropout voltage and supply independent, ultra-low sup-ply current make these devices ideal for battery-operat-ed, high-performance, low-voltage systems.The MAX6061–MAX6068 are available in a 3-pin SOT23package.ApplicationsAnalog-to-Digital Converters (ADCs)Portable Battery-Powered Systems Notebook Computers PDAs, GPSs, DMMs Cellular PhonesPrecision 3V/5V SystemsFeatureso Ultra-Small 3-Pin SOT23 Package o ±0.2% (max) Initial Accuracyo 20ppm/°C (max) Temperature Coefficient o 5mA Source Current o 2mA Sink Currento No Output Capacitor Required o Stable with Capacitive Loads o 90µA (typ) Quiescent Supply Current o 200mV (max) Dropout at 1mA Load Current o Output Voltage Options: 1.25V, 1.8V, 2.048V, 2.5V,3V, 4.096V, 4.5V, 5Vo 13µVp-p Noise 0.1Hz to 10Hz (MAX6061)MAX6061–MAX6068Precision, Micropower, Low-Dropout,High-Output-Current, SOT23 Voltage References________________________________________________________________Maxim Integrated Products119-1659; Rev 1; 4/01Ordering InformationPin ConfigurationSelector GuideNote:There is a minimum order increment of 2500 pieces for SOT23 packages.Typical Operating Circuit appears at end of data sheet.For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at /doc/5d9648470.html.M A X 6061–M A X 6068Precision, Micropower, Low-Dropout,High-Output-Current, SOT23 Voltage References2_______________________________________________________________________________________ ABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICS —MAX6061, V OUT = 1.25VStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.(Voltages Referenced to GND) IN.........................................................................-0.3V to +13.5V OUT .............................................................-0.3V to (V IN +0.3V)Output Short-Circuit Duration to GND or IN (V IN < 6V)...Continuous Output Short-Circuit Duration to GND or IN (V IN ≥6V)................60sContinuous Power Dissipation (T A = +70°C)3-Pin SOT23 (derate 4.0mW/°C above +70°C)............320mW Operating Temperature Range ...........................-40°C to+85°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering,10s).................................+300°CMAX6061–MAX6068Precision, Micropower, Low-Dropout,High-Output-Current, SOT23 Voltage References_______________________________________________________________________________________3 ELECTRICAL CHARACTERISTICS —MAX6068, V OUT = 1.80VM A X 6061–M A X 6068Precision, Micropower, Low-Dropout,High-Output-Current, SOT23 Voltage References4_______________________________________________________________________________________ ELECTRICAL CHARACTERISTICS —MAX6062, V OUT = 2.048V(V IN = +5V, I OUT = 0, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.) (Note 1)MAX6061–MAX6068Precision, Micropower, Low-Dropout,High-Output-Current, SOT23 Voltage References(V IN = +5V, I OUT = 0, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.) (Note 1)M A X 6061–M A X 6068Precision, Micropower, Low-Dropout,High-Output-Current, SOT23 Voltage References6_______________________________________________________________________________________ELECTRICAL CHARACTERISTICS —MAX6063, V OUT = 3.0V(V = +5V, I = 0, T = T to T , unless otherwise noted. Typical values are at T = +25°C.) (Note 1)MAX6061–MAX6068Precision, Micropower, Low-Dropout,High-Output-Current, SOT23 Voltage References_______________________________________________________________________________________7 ELECTRICAL CHARACTERISTICS —MAX6064, V OUT = 4.096V(V IN = +5V, I OUT = 0, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.) (Note 1)M A X 6061–M A X 6068Precision, Micropower, Low-Dropout,High-Output-Current, SOT23 Voltage References8_______________________________________________________________________________________ ELECTRICAL CHARACTERISTICS —MAX6067, V OUT = 4.500V(V IN = +5V, I OUT = 0, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.) (Note 1)MAX6061–MAX6068Precision, Micropower, Low-Dropout,High-Output-Current, SOT23 Voltage References_______________________________________________________________________________________9 ELECTRICAL CHARACTERISTICS —MAX6065, V OUT = 5.000V(V= +5.2V, I = 0, T = T to T , unless otherwise noted. Typical values are at T = +25°C.) (Note 1)Note 1:All devices are 100% production tested at T A = +25°C and are guaranteed by design for T A = T MIN to T MAX , as specified.Note 2:Temperature Coefficient is measured by the “box ” method, i.e., the maximum ?V OUT is divided by the maximum ?T.Note 3:Temperature Hysteresis is defined as the change in +25°C output voltage before and after cycling the device from TM A X 6061–M A X 6068Precision, Micropower, Low-Dropout,High-Output-Current, SOT23 Voltage References10______________________________________________________________________________________ M A X 6061/68 t o c 09FREQUENCY (kHz)P S R R (d B )-10-20-30-40-50-60-70-80-900.0011101000.010.11000MAX6061POWER-SUPPLY REJECTION RATIOvs. FREQUENCYTypical Operating Characteristics(V IN = +5V for MAX6061–MAX6068, V IN = +5.5V for MAX6065, I OUT = 0, T A = +25°C, unless otherwise noted.) (Note 5)2.0462.0472.0492.0482.0502.051-4010-15356085MAX6062OUTPUT VOLTAGE TEMPERATURE DRIFT4.9984.9995.0015.0005.0025.003-4010-15356085MAX6065OUTPUT VOLTAGE TEMPERATURE DRIFT TEMPERATURE (°C)O U T P U T V O L T A G E (V )-300-200-100010020030024681012MAX6061LINE REGULATIONINPUT VOLTAGE (V)O U T P U T V O L T A G E C H A N G E (µV ) -1200-600-800-1000-400-20002005971113MAX6065LINE REGULATIONINPUT VOLTAGE (V)O U T P U T V O L T A G E C H A N G E (µV )24LOAD CURRENT (mA)O U T P U T V O L T A G E C H A N G E (m V)MAX6061LOAD REGULATION-620-2-44861012-6-2-4246LOAD CURRENT (mA)O U T P U T V O L T A G E C H A N G E (m V )MAX6065LOAD REGULATION00.100.050.200.150.250.30021345MAX6066DROPOUT VOLTAGE vs. LOAD CURRENTLOAD CURRENT (mA)D R O P O U T V O L T A GE (V )0.200.2521345LOAD CURRENT (mA)D R O P O U T V O L T A GE (V )MAX6065DROPOUT VOLTAGE vs. LOAD CURRENTMAX6061–MAX6068Precision, Micropower, Low-Dropout,High-Output-Current, SOT23 Voltage References______________________________________________________________________________________11 -70-800.001101000-60-50-40-30-20-100FREQUENCY (kHz)P S R R (d B )0.1MAX6065POWER-SUPPLY REJECTION RATIOvs. FREQUENCYM A X 6061/68 t o c 10708090100110246M A X 6061/68 t o c 11INPUT VOLTAGE (V)S U P P L Y C U R R E N T (µA )MAX6061SUPPLY CURRENT vs. INPUT VOLTAGE808595901051101001155791113INPUT VOLTAGE (V)S U P P L Y C U R R E N T (µA )MAX6065SUPPLY CURRENT vs. INPUT VOLTAGE 708090100110120-4010-15356085TEMPERATURE (°C)S U P P L Y C U R R E N T (µA)MAX6061SUPPLY CURRENT vs. TEMPERATURE8595356085TEMPERATURE (°C)S U P P L Y C U R R E N T (µA )MAX6065SUPPLY CURRENT vs. TEMPERATURE00.00110100040206080100140120160180200220M A X 6061/68 t o c 15FREQUENCY (kHz)O U T P U T I M P E D A N C E (?)0.1MAX6061OUTPUT IMPEDANCE vs. FREQUENCY18000.00110100040206010080120140160M A X 6061/68 t o c 16FREQUENCY (kHz)O U T P U T I M P E D A N C E (?)0.1MAX6065OUTPUT IMPEDANCE vs. FREQUENCYV OUT 10µV/div 1s/div MAX60610.1Hz TO 10Hz OUTPUT NOISEM A X 6061/68 t o c 17Typical Operating Characteristics (continued)(V IN = +5V for MAX6061–MAX6068, V IN = +5.5V for MAX6065, I OUT = 0, T A = +25°C, unless otherwise noted.) (Note 5) V OUT 10µV/divM A X 6061/68 t o c 18M A X 6061–M A X 6068Precision, Micropower, Low-Dropout,High-Output-Current, SOT23 Voltage References12______________________________________________________________________________________Typical Operating Characteristics (continued)(V IN = +5V for MAX6061–MAX6068, V IN = +5.5V for MAX6065, I OUT = 0, T A = +25°C, unless otherwise noted.) (Note 5) I OUT 500µA/divV OUTAC-COUPLED20mV/div400µs/divMAX6065LOAD TRANSIENT(I OUT = ±250µA, C L = 1µF, V IN = 5.5V)+250µA-250µAMAX6061/68 toc24V OUT 500mV/divV IN 5V/div10µs/divMAX6061TURN-ON TRANSIENT(C L = 50pF)M A X 6061/68 t o c 19V OUT 2V/divV IN 5V/div40µs/divMAX6065TURN-ON TRANSIENT(C L = 50pF)M A X 6061/68 t o c 20I OUT 500µA/divV OUTAC-COUPLED 100mV/div 400µs/divI OUT +250µA I OUT -250µAMAX6061/68 toc21I OUT 500µA/divV OUTAC-COUPLED50mV/div400µs/divMAX6065LOAD TRANSIENT(I OUT = ±250µA, C L = 0, V IN = 5.5V)+250µA-250µAMAX6061/68 toc22I OUT 500µA/divV OUTAC-COUPLED10mV/div400µs/divMAX6061LOAD TRANSIENT(I OUT = ±250µA, V IN = 5.0V, C L = 1µF)+250µA -250µAMAX6061/68 toc23MAX6061–MAX6068Precision, Micropower, Low-Dropout,High-Output-Current, SOT23 Voltage References______________________________________________________________________________________13Typical Operating Characteristics (continued)(V IN = +5V for MAX6061–MAX6068, V IN = +5.5V for MAX6065, I OUT = 0, T A = +25°C, unless otherwise noted.) (Note 5) I OUT 5mA/divV OUTAC-COUPLED 100mV/div400µs/div MAX6061LOAD TRANSIENT(V IN = 5.0V, C L = 0, I OUT = ±2mA)+2mA-2mAMAX6061/68 toc25I OUT 5mA/divV OUTAC-COUPLED50mV/div400µs/divMAX6065LOAD TRANSIENT(C L = 0, I OUT = ±2mA, V IN = 5.5V)+2mA -2mAMAX6061/68 toc26I OUT 5mA/divV OUTAC-COUPLED50mV/div 400µs/div MAX6061LOAD TRANSIENT (V IN = 5.0V, C L = 1µF, I OUT = ±2mA)+2mA-2mAMAX6061/68 toc27I OUT 5mA/divV OUTAC-COUPLED20mV/div400µs/divMAX6065LOAD TRANSIENT(C L = 1µF, I OUT = ±2mA, V IN = 5.5V)+2mA -2mAMAX6061/68 toc28I OUT 5mA/divV OUTAC-COUPLED 200mV/div400µs/div MAX6061LOAD TRANSIENT(V IN = 5.0V, C L = 0, I OUT = ±4mA)+4mA-4mAMAX6061/68 toc29I OUT 5mA/divV OUTAC-COUPLED 100mV/div400µs/divMAX6065LOAD TRANSIENT(I OUT = ±5mA, C L = 0, V IN = 5.5V)+5mA-5mAMAX6061/68 toc30M A X 6061–M A X 6068Precision, Micropower, Low-Dropout,High-Output-Current, SOT23 Voltage References 14______________________________________________________________________________________ I OUT 5mA/divV OUTAC-COUPLED50mV/div400µs/divMAX6065LOAD TRANSIENT(I OUT = ±5mA, C L = 1µF, V IN = 5.5V)+5mA-5mAMAX6061/68 toc32V IN500mV/divV OUTAC-COUPLED20mV/div MAX6061LINE TRANSIENT(C L = 0)+0.25-0.25MAX6061/68 toc3340µs/div V IN500mV/divV OUTAC-COUPLED20mV/div40µs/divMAX6065LINE TRANSIENT(C L = 0)+0.25-0.25MAX6061/68 toc34Typical Operating Characteristics (continued)(V IN = +5V for MAX6061–MAX6068, V IN = +5.5V for MAX6065, I OUT = 0, T A = +25°C, unless otherwise noted.) (Note 5) I OUT 5mA/divV OUTAC-COUPLED50mV/div400µs/div MAX6061LOAD TRANSIENT(V IN = 5.0V, C L = 1µF, I OUT = ±4mA)+4mA-4mAMAX6061/68 toc31Note 5:Many of the MAX6061 family Typical Operating Characteristics are extremely similar. The extremes of these characteristicsare found in the MAX6061 (1.25V output) and the MAX6065 (5.0V output). The Typical Operating Characteristics of the remainder of the MAX6061 family, typically lie between these two extremes and can be estimated based on their output voltages.MAX6061–MAX6068Precision, Micropower, Low-Dropout,High-Output-Current, SOT23 Voltage References______________________________________________________________________________________15 Applications InformationInput BypassingFor the best line-transient performance, decouple the input with a 0.1µF ceramic capacitor as shown in the Typical Operating Circuit . Locate the capacitor as close to IN as possible. Where transient performance is less important, no capacitor is necessary.Output/Load CapacitanceDevices in the MAX6061 family do not require an output capacitance for frequency stability.I n applications where the load or the supply can experience step changes, an output capacitor of at least 0.1µF will reduce the amount of overshoot (undershoot) and improve the circuit ’s transient response. Many applica-tions do not require an external capacitor, and the MAX6061 family can offer a significant advantage in these applications when board space is critical.Supply CurrentThe quiescent supply current of the series-mode MAX6061 family is typically 90µA and is virtually inde-pendent of the supply voltage, with only an 8µA/V (max)variation with supply voltage. Unlike series references,shunt-mode references operate with a series resistor connected to the power supply. The quiescent current of a shunt-mode reference is thus a function of theinput voltage. Additionally, shunt-mode references have to be biased at the maximum expected load current, even if the load current is not present at the time. I n the MAX6061 family, the load current is drawn from the input voltage only when required, so supply current is not wasted and efficiency is maximized at all input volt-ages. This improved efficiency reduces power dissipa-tion and extends battery life. When the supply voltage is below the minimum specified input voltage (as during turn-on), the devices can draw up to 400µA beyond the nominal supply current. The input voltage source must be capable of providing this current to ensure reliable turn-on.Output Voltage HysteresisOutput voltage hysteresis is the change of output voltage at T A = +25°C before and after the device is cycled over its entire operating temperature range. Hysteresis is caused by differential package stress appearing across the bandgap core transistors. The typical tem-perature hysteresis value is 130ppm.Turn-On TimeThese devices typically turn on and settle to within 0.1%of their final value in 50µs to 300µs, depending on the device. The turn-on time can increase up to 1.5ms with the device operating at the minimum dropout voltage and the maximum load. Chip InformationTRANSISTOR COUNT: 117PROCESS: BiCMOSOrdering Information (continued)M A X 6061–M A X 6068Precision, Micropower, Low-Dropout,High-Output-Current, SOT23 Voltage ReferencesPackage InformationMaxi m cannot assume responsi bi li ty for use of any ci rcui try other than ci rcui try enti rely embodi ed i n a Maxi m product. No ci rcui t patent li censes are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.16____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600?2001 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.。

MAX1618中文资料

________________General DescriptionThe MAX1618 precise digital thermometer reports the temperature of a remote sensor. The remote sensor is a diode-connected transistor—typically a low-cost, easily mounted 2N3904 NPN type—that replaces conventional thermistors or thermocouples. Remote accuracy is ±3°C for multiple transistor manufacturers, with no calibration needed. The MAX1618 can also measure the die temper-ature of other ICs, such as microprocessors, that contain an on-chip, diode-connected transistor.The 2-wire serial interface accepts standard System Management Bus (SMBus™) Write Byte, Read Byte, Send Byte, and Receive Byte commands to program the alarm thresholds and to read temperature data. The data format is 7 bits plus sign, with each bit corresponding to 1°C, in two’s complement format. Measurements can be done automatically and autonomously, with the 16Hz conversion rate or programmed to operate in a single-shot mode.The thermostat mode configures the ALERT output as an interrupt or as a temperature reset that remains active only while the temperature is above the maximum temperature limit or below the minimum temperature limit. The ALERT output polarity in thermostat mode can be configured for active high or active low. Fan control is implemented using this ALERT output.The MAX1618 is available in a small (1.1mm high) 10-pin µMAX package.________________________ApplicationsDesktop and Notebook Central OfficeComputersTelecom Equipment Smart Battery Packs Test and Measurement LAN ServersMultichip ModulesIndustrial Controls____________________________Featureso Single Channel: Measures Remote CPU Temperature o No Calibration Required o SMBus 2-Wire Serial Interfaceo Programmable Under/Overtemperature Alarms o Overtemperature Output for Fan Control (Thermostat Mode)o Supports SMBus Alert Response Accuracy±3°C (+60°C to +100°C)±5°C (-55°C to +120°C)o 3µA (typ) Standby Supply Currento 900µA (max) Supply Current in Autoconvert Mode o +3V to +5.5V Supply Range o Small 10-Pin µMAX PackageMAX1618†Remote Temperature Sensor with SMBus Serial Interface________________________________________________________________Maxim Integrated Products1___________________Pin ConfigurationTypical Operating Circuit19-1495; Rev 1; 10/99SMBus is a trademark of Intel Corp. †Patents PendingFor free samples & the latest literature: , or phone 1-800-998-8800.For small orders, phone 1-800-835-8769.M A X 1618Remote Temperature Sensor with SMBus Serial Interface ABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICS(V CC = +3.3V, configuration byte register = X8h, T A = 0°C to +85°C , unless otherwise noted.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.V CC to GND..............................................................-0.3V to +6V DXP, ADD_ to GND....................................-0.3V to (V CC + 0.3V)DXN to GND..........................................................-0.3V to +0.8V SMBCLK, SMBDATA, ALERT , STBY to GND...........-0.3V to +6V SMBDATA Current.................................................-1mA to 50mA DXN Current.......................................................................±1mA ESD Protection (all pins, Human Body Model)...............±2000VContinuous Power Dissipation (T A = +70°C)µMAX (derate 5.6mW/°C above +70°C)....................444mW Operating Temperature Range (extended)......-55°C to +125°C Junction Temperature.....................................................+150°C Storage Temperature Range............................-65°C to +150°C Lead Temperature (soldering, 10sec)............................+300°CMAX1618Remote Temperature Sensor with SMBus Serial Interface_______________________________________________________________________________________3ELECTRICAL CHARACTERISTICS (continued)(V CC = +3.3V, configuration byte register = X8h, T A = 0°C to +85°C , unless otherwise noted.)ELECTRICAL CHARACTERISTICS(V CC = +3.3V, configuration byte register = X8h, T A = -55°C to +125°C, unless otherwise noted.) (Note 5)40-401100TEMPERATURE ERROR vs. LEAKAGE RESISTANCE-20-30-100102030LEAKAGE RESISTANCE (M Ω)T E M P E R A T U R E E R R O R (°C )10-8-5-6-7-4-3-2-10120.0050.050.5550TEMPERATURE ERROR vs.POWER-SUPPLY NOISE FREQUENCYPOWER-SUPPLY NOISE FREQUENCY (MHz)T E M P E R A T U R E E R R O R (°C )Typical Operating Characteristics(T A = +25°C, unless otherwise noted.)-1.000.00-0.501.000.502.001.502.50-55-155-3525456585105125TEMPERATURE ERRORvs. REMOTE-DIODE TEMPERATURETEMPERATURE (°C)T E M P E R A T U R E E R R O R (°C )M A X 1618Remote Temperature Sensor with SMBus Serial Interface 4_______________________________________________________________________________________ELECTRICAL CHARACTERISTICS (continued)(V= +3.3V, configuration byte register = X8h, T = -55°C to +125°C, unless otherwise noted.) (Note 5)Note 1:Guaranteed, but not 100% tested.Note 2: A remote diode is any diode-connected transistor from Table 7. T R is the junction temperature of the remote diode. SeeRemote Diode Selection for remote-diode forward voltage requirements. Temperature specification guaranteed for a diode with ideality factor (M TR = 1.013). Additional error = (1.013/m - 1) ·273 + Temp where M = Ideality of remote diode used.Note 3:The SMBus logic block is a static design that works with clock frequencies down to DC. While slow operation is possible, itviolates the 10kHz minimum clock frequency and SMBus specifications and may monopolize the bus.Note 4:Note that a transition must internally provide at least a hold time to bridge the undefined region (300ns max) of SMBCLK’sfalling edge.Note 5:Specifications from -55°C to +125°C are guaranteed by design, not production tested.MAX1618Remote Temperature Sensor with SMBus Serial Interface_______________________________________________________________________________________5101001000TEMPERATURE ERROR MON-MODE NOISE FREQUENCYCOMMON-MODE NOISE FREQUENCY (MHz)T E M P E R A T U R E E R R O R (°C )040208060100120030201040506070809010021345STANDBY SUPPLY CURRENT vs. SUPPLY VOLTAGESUPPLY VOLTAGE (V)S T A N D B Y S U P P L Y C U R R E NT (µA )-20-1080602040100TEMPERATURE ERROR vs. DXP-DXN CAPACITANCEDXP-DXN CAPACITANCE (nF)T E M P E R A T U R E E R R O R (°C )100204030501101001000STANDBY SUPPLY CURRENT vs. CLOCK FREQUENCYCLOCK FREQUENCY (kHz)S T A N D B Y S U P P L Y C U R R E N T (µA)2040307060508090110100120-22468101214161820RESPONSE TO THERMAL SHOCKTIME (sec)T E M P E R A T U R E (°C )____________________________Typical Operating Characteristics (continued)(T A = +25°C, unless otherwise noted.)M A X 1618Remote Temperature Sensor with SMBus Serial Interface 6_______________________________________________________________________________________Pin DescriptionDetailed DescriptionThe MAX1618 is a temperature sensor designed to work in conjunction with an external microcontroller (µC) or other intelligence in thermostatic, process-con-trol, or monitoring applications. The µC is typically a power-management or keyboard controller, generating SMBus serial commands by “bit-banging” general-pur-pose input-output (GPIO) pins or through a dedicated SMBus interface block.Essentially an 8-bit serial analog-to-digital converter (ADC) with a sophisticated front end, the MAX1618contains a switched-current source, a multiplexer, an ADC, an SMBus interface, and the associated control logic (F igure 1). Temperature data from the ADC is loaded into a data register, where it is automatically compared with data previously stored in over/under-temperature alarm threshold registers. The alarm threshold registers can be set for hysteretic fan control.ADC and MultiplexerThe averaging ADC integrates over a 30ms period (typ)with excellent noise rejection. The ADC converts at a rate of 16Hz. The multiplexer automatically steers biascurrents through the remote diode, measures the for-ward voltage, and computes the temperature.The DXN input is biased at 0.65V above ground by an internal diode to set up the analog-to-digital (A/D)inputs for a differential measurement. The worst-case DXP-DXN differential input voltage range is 0.25V to 0.95V.Excess resistance in series with the remote diode causes about +1/2°C error/Ω. A 200µV offset voltage at DXP-DXN causes about +1°C error.A/D Conversion SequenceIf a Start command is written (or generated automatical-ly in the free-running autoconvert mode), the result of the measurement is available after the end of conver-sion. A BUSY status bit in the status byte shows that the device is performing a new conversion. The result of the previous conversion is always available even when the ADC is busy.SMBus Serial-Data Input/Output. Open drain.SMBDATA 9SMBus Alert (Interrupt) Output. Open drain.ALERT10Combined Current Source and A/D Positive Input. Do not leave DXP floating. Place a 2200pF capacitor between DXP and DXN for noise filtering.DXP 5Supply Voltage Input. Bypass to GND with a 0.1µF capacitor.V CC 6Hardware-Standby Input. Temperature and comparison threshold data are retained in standby mode.Low = standby mode. High = operating mode. STBY 7SMBus Serial-Clock InputSMBCLK 8Combined Current Sink and A/D Negative Input. DXN is normally biased to a diode voltage above ground.DXN 4GroundGND 3PIN SMBus Slave Address Select Input. (See Table 6.) ADD0 and ADD1 are sampled upon power-up. Excess capacitance (>50pF) at the address pins when floating may cause address-recognition problems.ADD12SMBus Slave Address Select Input. (See Table 6.) ADD0 and ADD1 are sampled upon power-up. Excess capacitance (>50pF) at the address pins when floating may cause address-recognition problems.ADD01FUNCTIONNAMEMAX1618Remote Temperature Sensor with SMBus Serial Interface_______________________________________________________________________________________7Figure 1. Functional DiagramLow-Power Standby ModeStandby mode disables the ADC and reduces the sup-ply-current drain to 3µA (typ). Enter standby mode by forcing the STBY pin low or via the RUN/STOP bit in the configuration byte register. Hardware and software standby modes behave almost identically; all data is retained in memory, and the SMB interface is alive and listening for reads and writes. The only difference is that in hardware standby mode, the one-shot command does not initiate a conversion.Standby mode is not a shutdown mode. Activity on the SMBus draws extra supply current (see Typical Operating Characteristics ). In software standby mode,the MAX1618 can be forced to perform A/D conversions through the one-shot command, despite the RUN/STOP bit being high.Enter hardware standby mode by forcing the STBY pin low. In a notebook computer, this line may be connect-ed to the system SUSTAT# suspend-state signal. The STBY pin low state overrides any software conver-sion command. If a hardware or software standby com-mand is received while a conversion is in progress, the conversion cycle is truncated, and the data from that conversion is not latched into either temperature read-ing register. The previous data is not changed and remains available.Supply-current drain during the 62ms conversion period is always about 450µA. Between conversions, the instantaneous supply current is about 25µA due to the current consumed by the conversion rate timer. In standby mode, supply current drops to about 3µA. With very low supply voltages (under the power-on reset threshold), the supply current is higher due to the address input bias currents. It can be as high as 160µA,depending on ADD0 and ADD1 settings.SMBus Digital InterfaceFrom a software perspective, the MAX1618 appears as a set of byte-wide registers that contains temperature data,alarm threshold values, or control bits. Use a standard SMBus 2-wire serial interface to read temperature data and write control bits and alarm threshold data.The MAX1618 employs four standard SMBus protocols:Write Byte, Read Byte, Send Byte, and Receive Byte (Figure 2). The two shorter protocols (Receive and Send)allow quicker transfers, provided that the correct data register was previously selected by a Write or Read Byte instruction. Use caution with the shorter protocols in multimaster systems, since a second master could overwrite the command byte without informing the first master.The temperature data format is 7 bits plus sign in two’s complement form for each channel, with each data bit representing +1°C (Table 1), transmitted MSB first.Measurements are offset by +1/2°C to minimize internal rounding errors; for example, +99.6°C is reported as +100°C.Alarm Threshold RegistersTwo registers, a high-temperature (T HIGH ) and a low-temperature (T LOW ) register, store alarm threshold data. If a measured temperature equals or exceeds the corresponding alarm threshold value, an ALERT inter-rupt is asserted.The power-on reset (POR) state of the T HIGH register is full scale (0111 1111 or +127°C). The POR state of the T LOW register is 1100 1001 or -55°C.Thermostat ModeThermostat mode changes the function of the ALERT output from a latched interrupt-type output to a self-clearing thermostat for fan control. This output simply responds to the current temperature (F igure 3). If the current temperature is above T HIGH , ALERT activatesM A X 1618Remote Temperature Sensor with SMBus Serial Interface 8_______________________________________________________________________________________Table 1. Data Format (Two ’s Complement)and does not go inactive until the temperature drops below T LOW .Enable thermostat mode through the configuration reg-ister (Table 4), with one bit to enable the feature and another bit to set the output polarity (active high or active low). The ALERT thermostat comparison is made after each conversion, or at the end of any SMBus transaction. F or example, if the limit is changed while the device is in standby mode, the ALERT output responds correctly according to the last valid A/D result. Upon entering thermostat mode, the ALERT out-put is reset so that if the temperature is in the hysteresis band ALERT initially goes inactive. The power-on reset (POR) state disables thermostat mode.Diode Fault AlarmA continuity fault detector at DXP detects whether the remote diode has an open-circuit condition, short-cir-cuit to GND, or short-circuit DXP-to-DXN condition. At the beginning of each conversion, the diode fault is checked, and the status byte is updated. This fault detector is a simple voltage detector; if DXP risesMAX1618Remote Temperature Sensor with SMBus Serial Interface_______________________________________________________________________________________9Figure 3. Fan Control ApplicationFigure 2. SMBus Protocolsabove V CC - 1V (typ) or below V DXN + 50mv (typ), a fault is detected and ALERT is asserted. ADC reads +127°C. Also, if the ADC has an extremely low differen-tial input voltage, the diode is assumed to be shorted and a fault is detected. Note that the diode fault is not checked until a conversion is initiated, so immediately after power-on reset, the status byte indicates no fault is present even if the diode path is broken.A L E R T InterruptsNormally, the ALERT interrupt output signal is latched and can be cleared only by reading the Alert Response address. Interrupts are generated in response to T HIGH and T LOW comparisons and when the remote diode is faulted. The interrupt does not halt automatic conver-sions; new temperature data continues to be available over the SMBus interface after ALERT is asserted. The interrupt output pin is open-drain so the devices can share a common interrupt line.The interface responds to the SMBus Alert Response address, an interrupt pointer return-address feature (see Alert Response Address section). Before taking corrective action, always check to ensure that an inter-rupt is valid by reading the current temperature.The alert activates only once per crossing of a given temperature threshold to prevent any re-entrant inter-rupts. To enable a new interrupt, rewrite the value of the violated temperature threshold.Alert Response AddressThe SMBus Alert Response interrupt pointer provides quick fault identification for simple slave devices that lack the complex, expensive logic needed to be a bus master. Upon receiving an ALERT interrupt signal, the host master can broadcast a Receive Byte transmission to the Alert Response slave address (0001100). Any slave device that generated an interrupt then attempts to identify itself by putting its own address on the bus (Table 2).The Alert Response can activate several different slave devices simultaneously, similar to the I 2C General Call.If more than one slave attempts to respond, bus arbitra-tion rules apply, and the device with the lower address code wins. The losing device does not generate an acknowledgement and continues to hold the ALERT line low until serviced (implies that the host interrupt input is level sensitive). Successful reading of the alert response address clears the interrupt latch.Command Byte FunctionsThe 8-bit command byte register (Table 3) is the master index that points to the other registers within the MAX1618. The register’s POR state is 0000 0001, so aReceive Byte transmission (a protocol that lacks the command byte) that occurs immediately after POR returns the current remote temperature data.The one-shot command immediately forces a new con-version cycle to begin. A new conversion begins in software standby mode (RUN/STOP bit = high). The device returns to standby mode after the conversion. If a conversion is in progress when a one-shot command is received, the command is ignored. If a one-shot command is received in autoconvert mode (RUN/STOP bit = low) between conversions, a new conversion begins; the conversion rate timer is reset, and the next automatic conversion takes place after a full delay elapses.Configuration Byte FunctionsThe configuration byte register (Table 4) is used to mask (disable) interrupts, to put the device in software standby or thermostat mode, change the polarity of the alert output (thermostat mode only), and to change the diode bias current. The lower three bits are internally driven low (000), making them “don’t care” bits. Write zeros to these bits. The serial interface can read back this register’s contents.Status Byte FunctionsThe status byte register (Table 5) indicates which (if any) temperature thresholds have been exceeded. This byte also indicates whether the ADC is converting and whether there is a fault in the remote diode DXP-DXN path. After POR, the normal state of all the flag bits is zero, assuming none of the alarm conditions is present.The status byte is cleared by any successful read of the status byte. Note that the ALERT interrupt latch is not automatically cleared when the status flag bit is cleared.M A X 1618Remote Temperature Sensor with SMBus Serial Interface 10______________________________________________________________________________________ADD66Provide the current MAX1618slave address that was latched at POR (Table 6)FUNCTIONADD55ADD44ADD33ADD22ADD11ADD77(MSB)ADD00(LSB)Logic 1BIT NAME Table 2. Read Format for Alert Response Address (0001 100)I 2C is a trademark of Philips Corp.MAX1618Remote Temperature Sensor with SMBus Serial Interface______________________________________________________________________________________11Table 4. Configuration-Byte Bit AssignmentsTable 5. Status-Byte Bit Assignments*In ALERT mode, the HIGH and LOW temperature alarm flags stay high until cleared by POR or until the status byte register is read.Slave AddressesThe device address can be set to one of nine different values by pin-strapping ADD0 and ADD1 so more than one MAX1618 can reside on the same bus without address conflicts (Table 6).The address pin states are checked at POR only, and the address data stays latched to reduce quiescent supply current due to the bias current needed for high-impedance (high-Z) state detection.The MAX1618 also responds to the SMBus Alert Response slave address (see the Alert Response Address section).POR and UVLOThe MAX1618 has a volatile memory. To prevent ambigu-ous power-supply conditions from corrupting the data in the memory and causing erratic behavior, a POR voltage detector monitors V CC and clears the memory if V CC falls below 1.7V (typical, see the Electrical Characteristics table). When power is first applied and V CC rises above 1.75V (typ), the logic blocks begin operating, although reads and writes at V CC levels below 3V are not recom-mended. A second V CC comparator, the ADC UVLO com-parator, prevents the ADC from converting until there is sufficient headroom (V CC = 2.8V typ). Power-Up Defaults:•Interrupt latch is cleared.•Address select pins are sampled.•Command byte is set to 01h to facilitate quick remote Receive Byte queries. •T HIGH and T LOW registers are set to max and min limits, respectively.•Device is in normal mode. (ALERT acts as a latched interrupt output.)Applications InformationRemote Diode SelectionTemperature accuracy depends on having a good-quality, diode-connected, small-signal transistor.Accuracy has been experimentally verified for all of the devices listed in Table 7. The MAX1618 can also direct-ly measure the die temperature of CPUs and other inte-grated circuits with on-board temperature sensing diodes, such as the Intel Pentium II ®.The transistor must be a small-signal type with a rela-tively high forward voltage. This ensures that the input voltage is within the A/D input voltage range. The for-ward voltage must be greater than 0.25V at 10µA at the highest expected temperature. The forward voltage must be less than 0.95V at 100µA at the lowest expect-ed temperature. The base resistance has to be less than 100Ω. Tight specification of forward-current gain (+50 to +150, for example) indicates that the manufac-turer has good process controls and that the devices have consistent V BE characteristics. Do not use power transistors.ADC Noise FilteringThe integrating ADC has inherently good noise rejec-tion, especially of low-frequency signals such as 60Hz/120Hz power-supply hum. Micropower operation places constraints on high-frequency noise y out the PCB carefully with proper external noise fil-tering for high-accuracy remote measurements in elec-trically noisy environments.F ilter high-frequency electromagnetic interference (EMI) at DXP and DXN with an external 2200pF capaci-tor connected between the two inputs. This capacitor can be increased to about 3300pF (max), including cable capacitance. A capacitance higher than 3300pFM A X 1618Remote Temperature Sensor with SMBus Serial Interface 12______________________________________________________________________________________Table 7. SOT23 Type Remote-Sensor Transistor ManufacturersPentium II is a registered trademark of Intel Corp.introduces errors due to the rise time of the switched-current source.PC Board Layout1)Place the MAX1618 as close as practical to theremote diode. In a noisy environment, such as a computer motherboard, this distance can be 4 inch-es to 8 inches (typ) or more, as long as the worst noise sources (such as CRTs, clock generators,memory buses, and ISA/PCI buses) are avoided.2)Do not route the DXP–DXN lines next to the deflec-tion coils of a CRT. Also, do not route the traces across a fast memory bus, which can easily introduce +30°C error, even with good filtering.Otherwise, most noise sources are fairly benign.3)Route the DXP and DXN traces parallel and close toeach other, away from any high-voltage traces such as +12V DC . Avoid leakage currents from PC board contamination. A 20M Ωleakage path from DXP to ground causes approximately +1°C error.4)Connect guard traces to GND on either side of theDXP-DXN traces (F igure 5). With guard traces in place, routing near high-voltage traces is no longer an issue.5)Route as few vias and crossunders as possible tominimize copper/solder thermocouple effects.6)When introducing a thermocouple, make sure thatboth the DXP and the DXN paths have matching thermocouples. In general, PC board-induced ther-mocouples are not a serious problem. A copper-MAX1618Remote Temperature Sensor with SMBus Serial Interface______________________________________________________________________________________13Figure 5. SMBus Read Timing DiagramFigure 4. SMBus Write Timing DiagramM A X 1618Remote Temperature Sensor with SMBus Serial Interface 14______________________________________________________________________________________solder thermocouple exhibits 3µV/°C, and it takes approximately 200µV of voltage error at DXP-DXN to cause a +1°C measurement error, so most parasitic thermocouple errors are swamped out.7)Use wide traces. Narrow traces are more inductiveand tend to pick up radiated noise. The 10mil widths and spacings recommended in Figure 5 are not absolutely necessary (as they offer only a minor improvement in leakage and noise), but try to use them where practical.8)Note that copper cannot be used as an EMI shield.Use only ferrous materials such as steel. Placing a copper ground plane between the DXP-DXN traces and traces carrying high-frequency noise signals does not help reduce EMI.Twisted Pair and Shielded CablesFor remote-sensor distances longer than 8 inches, or in particularly noisy environments, a twisted pair is recom-mended. Its practical length is 6 feet to 12 feet (typ)before noise becomes a problem, as tested in a noisy electronics laboratory. F or longer distances, the best solution is a shielded twisted pair like that used for audio microphones. For example, Belden #8451 works well for distances up to 100 feet in a noisy environment. Connect the twisted pair to DXP and DXN and the shield to GND,and leave the shield’s remote end unterminated.Excess capacitance at DX_ limits practical remote-sen-sor distances (see Typical Operating Characteristics ).F or very long cable runs, the cable's parasitic capaci-tance often provides noise filtering, so the recommended 2200pF capacitor can often be removed or reduced in value.Cable resistance also affects remote-sensor accuracy. A 1Ωseries resistance introduces about +1/2°C error.Programming Example:Clock-Throttling Control for CPUsListing 1 gives an untested example of pseudocode for proportional temperature control of Intel mobile CPUs through a power-management microcontroller. This pro-gram consists of two main parts: an initialization routine and an interrupt handler. The initialization routine checks for SMBus communications problems and sets up the MAX1618 configuration. The interrupt handler responds to ALERT signals by reading the current temperature and setting a CPU clock duty factor proportional to that tem-perature. The relationship between clock duty and tem-perature is fixed in a look-up table contained in the microcontroller code.Note:Thermal management decisions should be made based on the latest external temperature obtained from the MAX1618 rather than the value of the Status Byte.The MAX1618 responds very quickly to changes in its environment due to its sensitivity and its small thermal mass. High and low alarm conditions can exist at the same time in the Status Byte, because the MAX1618 is correctly reporting environmental changes around it.Figure 6. Recommended DXP/DXN PC Traces。

LTC4446EMS8E#PBF;LTC4446EMS8E#TRPBF;LTC4446IMS8E#PBF;LTC4446IMS8E#TRPBF;中文规格书,Datasheet资料

14446fTYPICAL APPLICATIONFEATURESAPPLICATIONSDESCRIPTIONLow Side N-ChannelMOSFET DriverThe L TC ®4446 is a high frequency high voltage gate driver that drives two N-channel MOSFETs in a DC/DC converter with supply voltages up to 100V . The powerful driver ca-pability reduces switching losses in MOSFETs with high gate capacitance. The L TC4446’s pull-up for the top gate driver has a peak output current of 2.5A and its pull-down has an output impedance of 1.2Ω. The pull-up for the bot-tom gate driver has a peak output current of 3A and the pull-down has an output impedance of 0.55Ω.The L TC4446 is conﬁ gured for two supply-independent inputs. The high side input logic signal is internally level-shifted to the bootstrapped supply, which may function at up to 114V above ground.The L TC4446 contains undervoltage lockout circuits that disable the external MOSFETs when activated. The L TC4446 is available in the thermally enhanced 8-lead MSOP package.The L TC4446 does not have adaptive shoot-through pro-tection. For similar drivers with adaptive shoot-through protection, please refer to the chart below.PARAMETER L TC4446L TC4444L TC4444-5Shoot-Through Protection No Yes Yes Absolute Max TS 100V 100V 100V MOSFET Gate Drive 7.2V to 13.5V 7.2V to 13.5V 4.5V to 13.5VV CC UV +6.6V 6.6V 4V V CC UV– 6.15V 6.15V 3.55V nBootstrap Supply Voltage Up to 114V n Wide V CCVoltage: 7.2V to 13.5V n 2.5A Peak Top Gate Pull-Up Current n 3A Peak Bottom Gate Pull-Up Current n 1.2Ω Top Gate Driver Pull-Down n 0.55Ω Bottom Gate Driver Pull-Down n 5ns Top Gate Fall Time Driving 1nF Load n 8ns Top Gate Rise Time Driving 1nF Load n 3ns Bottom Gate Fall Time Driving 1nF Load n 6ns Bottom Gate Rise Time Driving 1nF Loadn Drives Both High and Low Side N-Channel MOSFETs n Undervoltage Lockoutn Thermally Enhanced 8-Pin MSOP PackagenDistributed Power Architecturesn Automotive Power Supplies n High Density Power Modules n Telecommunication SystemsT wo Switch Forward ConverterL TC4446 Driving a 1000pF Capacitive LoadL , L T , L TC and L TM are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. Protected by U.S. Patents including 6677210.V BINP 5V/DIVBG 10V/DIV TINP 5V/DIV TG-TS 10V/DIV20ns/DIV4446 TA01b/24446fPIN CONFIGURATIONABSOLUTE MAXIMUM RATINGSSupply VoltageV CC.........................................................–0.3V to 14V BOOST – TS ...........................................–0.3V to 14V TINP Voltage .................................................–2V to 14V BINP Voltage .................................................–2V to 14V BOOST Voltage ........................................–0.3V to 114V TS Voltage ...................................................–5V to 100V Operating Temperature Range (Note 2)....–40°C to 85°C Junction Temperature (Note 3) .............................125°C Storage Temperature Range ...................–65°C to 150°C Lead Temperature (Soldering, 10 sec) ..................300°C(Note 1)1234TINP BINP V CC BG8765TS TG BOOST NCTOP VIEW9MS8E PACKAGE 8-LEAD PLASTIC MSOPT JMAX = 125°C, θJA = 40°C/W , θJC = 10°C/W (NOTE 4)EXPOSED PAD (PIN 9) IS GND, MUST BE SOLDERED TO PCBORDER INFORMATIONELECTRICAL CHARACTERISTICSSYMBOL PARAMETER CONDITIONSMIN TYP MAX UNITS Gate Driver Supply, V CC V CC Operating Voltage7.213.5V I VCCDC Supply Current TINP = BINP = 0V350550μA UVLO Undervoltage Lockout ThresholdV CC Rising V CC Falling Hysteresis l l6.005.606.606.154507.206.70V V mV Bootstrapped Supply (BOOST – TS)I BOOSTDC Supply Current TINP = BINP = 0V 0.12μA Input Signal (TINP , BINP)V IH(BG)BG Turn-On Input Threshold BINP Ramping High l 2.25 2.75 3.25V V IL(BG)BG Turn-Off Input Threshold BINP Ramping Low l 1.85 2.3 2.75V V IH(TG)TG Turn-On Input Threshold TINP Ramping High l 2.25 2.75 3.25V V IL(TG)TG Turn-Off Input Threshold TINP Ramping Lowl 1.852.3 2.75V I TINP(BINP)Input Pin Bias Current ±0.01±2μA High Side Gate Driver Output (TG)V OH(TG)TG High Output Voltage I TG = –10mA, V OH(TG) = V BOOST – V TG 0.7V V OL(TG)TG Low Output Voltage I TG = 100mA, V OL(TG) = V TG –V TSl 120220mV I PU(TG)TG Peak Pull-Up Current l 1.72.5A R DS(TG)TG Pull-Down Resistance l1.22.2ΩThe l denotes the speciﬁ cations which apply over the full operating temperature range, otherwise speciﬁ cations are at T A = 25°C. V CC = V BOOST = 12V , V TS = GND = 0V , unless otherwise noted.LEAD FREE FINISH TAPE AND REEL PART MARKING*PACKAGE DESCRIPTION TEMPERATURE RANGE L TC4446EMS8E#PBF L TC4446EMS8E#TRPBF L TDPZ 8-Lead Plastic MSOP –40°C to 85°C L TC4446IMS8E#PBFL TC4446IMS8E#TRPBFL TDPZ8-Lead Plastic MSOP–40°C to 85°CConsult L TC Marketing for parts speciﬁ ed with wider operating temperature ranges. *The temperature grade is identiﬁ ed by a label on the shipping container .Consult L TC Marketing for information on non-standard lead based ﬁ nish parts.For more information on lead free part marking, go to: http://www.linear .com/leadfree/ For more information on tape and reel speciﬁ cations, go to: http://www.linear .com/tapeandreel//34446fNote 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime.Note 2: The L TC4446E is guaranteed to meet speciﬁ cations from 0°C to 85°C. Speciﬁ cations over the –40°C to 85°C operatingtemperature range are assured by design, characterization and correlationELECTRICAL CHARACTERISTICS The l denotes the speciﬁ cations which apply over the full operatingtemperature range, otherwise speciﬁ cations are at T A = 25°C. V CC = V BOOST = 12V , V TS = GND = 0V , unless otherwise noted.SYMBOL PARAMETERCONDITIONSMINTYP MAXUNITS Low Side Gate Driver Output (BG)V OH(BG)BG High Output Voltage I BG = –10mA, V OH(BG) = V CC – V BG0.7VV OL(BG)BG Low Output Voltage I BG = 100mAl 55110mV I PU(BG)BG Peak Pull-Up Current l 23A R DS(BG)BG Pull-Down Resistance l0.55 1.1ΩSwitching Time (BINP (TINP) is Tied to Ground While TINP (BINP) is Switching. Refer to Timing Diagram)t PLH(TG)TG Low-High (Turn-On) Propagation Delay l 2545ns t PHL(TG)TG High-Low (Turn-Off) Propagation Delay l 2240ns t PLH(BG)BG Low-High (Turn-On) Propagation Delay l 1935ns t PHL(BG)BG High-Low (Turn-Off) Propagation Delay l 1430ns t DM(BGTG)Delay Matching BG Turn-Off and TG Turn-On l –151035ns t DM(TGBG)Delay Matching TG Turn-Off and BG Turn-On l –25–325ns t r(TG)TG Output Rise Time 10% – 90%, C L = 1nF 10% – 90%, C L = 10nF880ns ns t f(TG)TG Output Fall Time 10% – 90%, C L = 1nF 10% – 90%, C L = 10nF550ns ns t r(BG)BG Output Rise Time 10% – 90%, C L = 1nF 10% – 90%, C L = 10nF660ns ns t f(BG)BG Output Fall Time 10% – 90%, C L = 1nF 10% – 90%, C L = 10nF 330ns nswith statistical process controls. The L TC4446I is guaranteed over the full –40°C to 85°C operating temperature range.Note 3: T J is calculated from the ambient temperature T A and power dissipation P D according to the following formula: T J = T A + (P D • θJA °C/W)Note 4: Failure to solder the exposed back side of the MS8E package to the PC board will result in a thermal resistance much higher than 40°C/W .TYPICAL PERFORMANCE CHARACTERISTICSV CC Supply Quiescent Current vs VoltageBOOST-TS Supply Quiescent Current vs VoltageV CC Supply Current vs TemperatureV CC SUPPL Y VOL TAGE (V)00Q U I E S C E N T C U R R E N T (μA )501502002506789101112134504446 G011001234514300350400BOOST SUPPL Y VOL TAGE (V)00Q U I E S C E N T C U R R E N T (μA )501502002506789101112134004446 G021001234514300350TEMPERATURE (°C)V C C S U P P L Y C U R R E N T (μA )3503603704446 G03330300–40–25–105203550658095110125380340320310/44446fTYPICAL PERFORMANCE CHARACTERISTICSBoost Supply Current vs TemperatureOutput Low Voltage (V OL ) vs Supply VoltageOutput High Voltage (V OH ) vs Supply VoltageInput Thresholds (TINP , BINP) vs Supply VoltageInput Thresholds (TINP , BINP) vs TemperatureInput Thresholds (TINP , BINP) Hysteresis vs VoltageInput Thresholds (TINP , BINP) Hysteresis vs TemperatureV CC Undervoltage Lockout Thresholds vs TemperatureRise and Fall Time vs V CC Supply VoltageTEMPERATURE (°C)B O O S T S U P P L YC U R R E N T (μA )2503003504446 G041500–40–25–10520355065809511012540020010050SUPPL Y VOL TAGE (V)7O U T P U T V O L T A G E (m V )140104446 G058040891120016012010060121314SUPPL Y VOL TAGE (V)75T G O R B G O U T P U T V O L T A G E (V )689101512911124446 G0671314118101314SUPPL Y VOL TAGE (V)72.1T G O R B G I N P U T T H R E S H O L D (V )2.22.42.52.63.12.8911124446 G072.32.93.02.78101314TEMPERATURE (°C)–25T G O R B G I N P U T T H R E S H O L D (V )2.62.83.0954446 G082.42.22.52.72.92.32.12.053565–10–40110205080125SUPPL Y VOL TAGE (V)78375T G O R B G I N P U T T H R E S H OL D H Y S T E R E S I S (m V )425500911124446 G09400475450101314TEMPERATURE (°C)–40–25375T G O R B G I N P U T T H R E S H O L D H Y S T E R E S I S(m V )425500–105205065804446 G104004754503511095125TEMPERATURE (°C)–406.0V C C S U P L L Y V O L T A G E (V )6.16.36.46.56.7–2535654446 G116.26.62095125110–1055080SUPPL Y VOL TAGE (V)7R I S E /F A L L T I M E (n s )122830222632911124446 G12820161024618148101314/54446fTYPICAL PERFORMANCE CHARACTERISTICSRise and Fall Time vs Load CapacitancePeak Driver (TG, BG) Pull-Up Current vs TemperatureOutput Driver Pull-Down Resistance vs TemperaturePropagation Delay vs V CC Supply VoltagePropagation Delay vs TemperatureLOAD CAPACITANCE (nF)1R I S E /F A L L T I M E (n s )40506094445 G1330200357210468108070TEMPERATURE (°C)–402.0P U L L -U P C U R R E N T (A )2.22.62.83.03.4–2535654446 G142.43.22095125110–1055080TEMPERATURE (°C)–25O U T P U T D R I V E R P U L L -D O W N R E S I S T A C N E (Ω)1.21.62.0954446 G150.80.41.01.41.80.60.253565–10–40110205080125SUPPL Y VOL TAGE (V)710P R O P A G A T I O N D E L A Y (n s )121618203024911124444 G16142628228101314TEMPERATURE (°C)–402P R O P A G A T I O N D E L A Y (n s )717222737–2535654446 G1712322095125110–1055080Switching Supply Current vs Input FrequencySwitching Supply Current vs Load CapacitanceSWITCHING FREQUENCY (kHz)S U P P L Y C U R R E N T (m A )1.52.02.560010004446 G181.00.502004008003.03.54.0LOAD CAPACITANCE (nF)1S U P P L Y C U R R E N T (m A )1010013450.127896104446 G19/64446fPIN FUNCTIONSBLOCK DIAGRAMTINP (Pin 1): High Side Input Signal. Input referenced to GND. This input controls the high side driver output (TG).BINP (Pin 2): Low Side Input Signal. This input controls the low side driver output (BG).V CC (Pin 3): Supply. This pin powers input buffers, logic and the low side gate driver output directly and the high side gate driver output through an external diode con-nected between this pin and BOOST (Pin 6). A low ESR ceramic bypass capacitor should be tied between this pin and GND (Pin 9).BG (Pin 4): Low Side Gate Driver Output (Bottom Gate). This pin swings between V CC and GND.NC (Pin 5): No Connect. No connection required.BOOST (Pin 6): High Side Bootstrapped Supply. An ex-ternal capacitor should be tied between this pin and TS (Pin 8). Normally, a bootstrap diode is connected between V CC (Pin 3) and this pin. Voltage swing at this pin is from V CC – V D to V IN + V CC – V D , where V D is the forward volt-age drop of the bootstrap diode.TG (Pin 7): High Side Gate Driver Output (Top Gate). This pin swings between TS and BOOST .TS (Pin 8): High Side MOSFET Source Connection (Top Source).Exposed Pad (Pin 9): Ground. Must be soldered to PCB ground for optimal thermal performance.TIMING DIAGRAMTINP (BINP)BG (TG)BINP (TINP)TG (BG)/OPERATIONOverviewThe L TC4446 receives ground-referenced, low voltage digi-tal input signals to drive two N-channel power MOSFETs in a synchronous buck power supply conﬁ guration. The gate of the low side MOSFET is driven either to V CC or GND, depending on the state of the input. Similarly, the gate of the high side MOSFET is driven to either BOOST or TS by a supply bootstrapped off of the switching node (TS). Input StageThe L TC4446 employs CMOS compatible input thresholds that allow a low voltage digital signal to drive standard power MOSF ETs. The LTC4446 contains an internal voltage regulator that biases both input buffers for high side and low side inputs, allowing the input thresholds (V IH = 2.75V, V IL = 2.3V) to be independent of variations inV CC. The 450mV hysteresis between V IH and V IL eliminates false triggering due to noise during switching transitions. However, care should be taken to keep both input pins (TINP and BINP) from any noise pickup, especially in high frequency, high voltage applications. The L TC4446 input buffers have high input impedance and draw negligible input current, simplifying the drive circuitry required for the inputs.Output StageA simpliﬁ ed version of the L TC4446’s output stage is shown in Figure 1. The pull-up devices on the BG and TG outputs are NPN bipolar junction transistors (Q1 and Q2). The BG and TG outputs are pulled up to within an NPN V BE (~0.7V) of their positive rails (V CC and BOOST, respectively). Both BG and TG have N-channel MOSFET pull-down devices (M1 and M2) which pull BG and TG down to their nega-tive rails, GND and TS. The large voltage swing of the BG and TG output pins is important in driving external power MOSFETs, whose R DS(ON) is inversely proportional to the gate overdrive voltage (V GS − V TH).Rise/Fall TimeThe L TC4446’s rise and fall times are determined by the peak current capabilities of Q1 and M1. The predriver that drives Q1 and M1 uses a nonoverlapping transition scheme to minimize cross-conduction currents. M1 is fully turned off before Q1 is turned on and vice versa.Since the power MOSFET generally accounts for the ma-jority of the power loss in a converter, it is important to quickly turn it on or off, thereby minimizing the transition time in its linear region. An additional beneﬁ t of a strong pull-down on the driver outputs is the prevention of cross- conduction current. For example, when BG turns the low side (synchronous) power MOSFET off and TG turns the high side power MOSFET on, the voltage on the TS pin will rise to V IN very rapidly. This high frequency positive voltage transient will couple through the C GD capacitance of the low side power MOSFET to the BG pin. If there is an insufﬁ cient pull-down on the BG pin, the voltage on the BG pin can rise above the threshold voltage of the low side power MOSFET, momentarily turning it back on. With Figure 1. Capacitance Seen by BG and TG During Switching/74446fOPERATIONboth the high side and low side MOSFETs conducting, signiﬁ cant cross-conduction current will ﬂ ow through the MOSFETs from V IN to ground and will cause substantial power loss. A similar effect occurs on TG due to the C GS and C GD capacitances of the high side MOSFET.The powerful output driver of the L TC4446 reduces the switching losses of the power MOSFET, which increase with transition time. The L TC4446’s high side driver is capable of driving a 1nF load with 8ns rise and 5ns fall times using a bootstrapped supply voltage V BOOST-TS of 12V while its low side driver is capable of driving a 1nF Power DissipationTo ensure proper operation and long-term reliability, the L TC4446 must not operate beyond its maximum tem-perature rating. Package junction temperature can be calculated by:T J = T A + P D (θJA)where:T J = Junction temperatureT A = Ambient temperatureP D = Power dissipationθJA = Junction-to-ambient thermal resistance Power dissipation consists of standby and switching power losses:P D = P DC + P AC + P QGwhere:P DC = Quiescent power lossP AC = Internal switching loss at input frequency, f INP QG = Loss due turning on and off the external MOSFET with gate charge QG at frequency f IN load with 6ns rise and 3ns fall times using a supply volt-age V CC of 12V.Undervoltage Lockout (UVLO)The L TC4446 contains an undervoltage lockout detector that monitors V CC supply. When V CC falls below 6.15V, the output pins BG and TG are pulled down to GND and TS, respectively. This turns off both external MOSFETs. When V CC has adequate supply voltage, normal operation will resume.APPLICATIONS INFORMATIONThe L TC4446 consumes very little quiescent current. TheDC power loss at V CC = 12V and V BOOST-TS = 12V is only(350μA)(12V) = 4.2mW.At a particular switching frequency, the internal power lossincreases due to both AC currents required to charge anddischarge internal node capacitances and cross-conduc-tion currents in the internal logic gates. The sum of thequiescent current and internal switching current with noload are shown in the Typical Performance Characteristicsplot of Switching Supply Current vs Input Frequency.The gate charge losses are primarily due to the large ACcurrents required to charge and discharge the capacitanceof the external MOSFETs during switching. For identicalpure capacitive loads C LOAD on TG and BG at switchingfrequency f IN, the load losses would be:P CLOAD = (C LOAD)(f)[(V BOOST-TS)2 + (V CC)2]In a typical synchronous buck conﬁ guration, V BOOST-TSis equal to V CC – V D, where V D is the forward voltagedrop across the diode between V CC and BOOST. If thisdrop is small relative to V CC, the load losses can beapproximated as:P CLOAD = 2(C LOAD)(f IN)(V CC)2/84446fAPPLICATIONS INFORMATIONUnlike a pure capacitive load, a power MOSF ET’s gate capacitance seen by the driver output varies with its V GS voltage level during switching. A MOSFET’s capacitive load power dissipation can be calculated using its gate charge, Q G. The Q G value corresponding to the MOSFET’s V GS value (V CC in this case) can be readily obtained from the manufacturer’s Q G vs V GS curves. For identical MOSFETs on TG and BG:P QG = 2(V CC)(Q G)(f IN)To avoid damage due to power dissipation, the L TC4446 includes a temperature monitor that will pull BG and TG low if the junction temperature rises above 160°C. Normal operation will resume when the junction temperature cools to less than 135°C.Bypassing and GroundingThe LTC4446 requires proper bypassing on the V CC and V BOOST-TS supplies due to its high speed switching (nanoseconds) and large AC currents (Amperes). Careless component placement and PCB trace routing may cause excessive ringing.To obtain the optimum performance from the L TC4446: A. Mount the bypass capacitors as close as possible between the V CC and GND pins and the BOOST and TS pins. The leads should be shortened as much as possible to reduce lead inductance.B. Use a low inductance, low impedance ground plane to reduce any ground drop and stray capacitance. Remember that the L TC4446 switches greater than 3A peak currents and any signiﬁ cant ground drop will degrade signal integrity.C. Plan the power/ground routing carefully. Know where the large load switching current is coming from and going to. Maintain separate ground return paths for the input pin and the output power stage.D. Keep the copper trace between the driver output pin and the load short and wide.E. Be sure to solder the Exposed Pad on the back side of the L TC4446 package to the board. Correctly soldered to a 2500mm2 doublesided 1oz copper board, the L TC4446 has a thermal resistance of approximately 40°C/W for the MS8E package. Failure to make good thermal contact between the exposed back side and the copper board will result in thermal resistances far greater than 40°C/W./94446f104446fTYPICAL APPLICATIONL T C 3722/L T C 4446 420W 36V -72V I N t o 12V /35A I s o l a t e d F u l l -B r i d g e S u p p l yL 1V I –V I 36V T /分销商库存信息:LINEAR-TECHNOLOGYLTC4446EMS8E#PBF LTC4446EMS8E#TRPBF LTC4446IMS8E#PBF LTC4446IMS8E#TRPBF。

SilverStone GEMINI ST46GF 460W + 460W 双重冗余电源说明书

SPECIFICATIONSilverStone GEMINI ST46GFMini Redundant Power SupplyWith Active PFC460W + 460W1. GeneralThis is the specification of Model SST-ST46GF; it is intended to describe the functionsand performance of the subject power supply. This 460 watts Redundant Power Supplywith Active PFC (Power Factor Correction) capability, meets EN61000-3-2 and equipsFull Range Input features.2. AC Input Characteristics2.1 AC Input Voltage, Frequency and Current ( Rating: 100V-240Vac, 47-63Hz, 8-4A )The power supply must operate within all specified limits over the input voltage range in Table 1.Harmonics distortion of up to 10% THD must not cause the power supply to go out of specified limits.Table 1 - AC Input Voltage and Frequency2.2 AC Inrush CurrentThe power supply must meets inrush requirements of any rated AC voltage, during turn on at anyphase of voltage, during a single cycle AC dropout condition, during repetitive On/Off cycling ofAC, and over the specified temperature range. The peak inrush current shall be less than the ratingof its critical components (including input fuse, bulk rectifiers, and surge limiting device).012.3 Input Power Factor Correction ( Active PFC)>_The power factor at full load shall be 0.98 at nominal input voltage.2.4 Input Current HarmonicsWhen the power supply is operated in 90-264Vac of Sec. 2.1, the input harmonic current drawn on the power line shall not exceed the limits set by EN61000-3-2 class “D” standards. The power supply shall incorporate universal power input with active power factor correction.2.5 AC Line DropoutAn AC line dropout of 17mS or less shall not cause any tripping of control signals or protection circuits. If the AC dropout lasts longer than 17mS the power supply should recover and meet all turn on requirements. The power supply shall meet the regulation requirement over all rated AC voltages, frequencies, and output loading conditions. Any dropout of the AC line shall not cause damage to the power supply. An AC line dropout is defined as a drop in AC line to 0VAC at any phase of the AC line for any length of time.023. DC Output Specification3.1 Output Current / LoadingThe following table defines power and current rating. The power supply shall meetboth static and dynamic voltage regulation requirements for minimum load condition.Table 2– Output Loads Range 1:Note 1: Maximum continuous total DC output power should not exceed 460 W.3.2 DC Voltage Regulation, Ripple and NoiseThe power supply output voltages must stay within the following voltage limits whenoperating at steady state and dynamic loading conditions. All outputs are measuredwith reference to the return remote sense (ReturnS) signal. The +5V,+3.3V, +12V,-5V,-12V and +5VSB outputs are measure at the power supply connectors referencesto ReturnS. The +5V and +3.3V is measured at its remote sense signal (+5VS, +3.3VS)located at the signal connector.Table 3 – Regulation, ripple and noiseRipple and Noise shall be measured using the following methods:a) Measurements made differentially to eliminate common-mode noiseb) Ground lead length of oscilloscope probe shall be ? 0.25 inch.c) Measurements made where the cable connectors attach to the load.d) Outputs bypassed at the point of measurement with a parallel combination of10uF tantalum capacitor in parallel with a 0.1uF ceramic capacitors.e) Oscilloscope bandwidth of 0 Hz to 20MHz.f) Measurements measured at locations where remote sense wires are connected.g) Regulation tolerance shall include temperature change, warm up drift and dynamic load. 03These are the timing requirements for the power assembly operation. The output voltages must rise from 10% to within regulation limits (Tvout_rise) within 5 to 70mS. The +5V, +3.3V and +12V output voltages should start to rise at about the same time. All outputs must rise monotonically. The +5V output needs to be greater than the +3.3V output during any point of the voltage rise.The +5V output must never be greater than the +3.3V output by more than 2.25V. Each output voltage shall reach regulation within 50 mS (Tvout_on) of each other during turn on of the power supply. Each output voltage shall fall out of regulation within 400 mS (Tvout_off) of each other during turn off. Figure 1 and figure 2 show the turn On and turn Off timing requirement. In Figure 2, the timing is shown with both AC and PSON# controlling the On/Off of the power supply.Table 4 – Output Voltage TimingFigure 1 : Output Voltage Timing043. DC Output Specification3.1 Output Current / LoadingThe following table defines power and current rating. The power supply shall meetboth static and dynamic voltage regulation requirements for minimum load condition.Table 5 – Turn On/Off TimingFigure 2 : Turn On/Off Timing05The PSON# signal is required to remotely turn on/off the power supply. PSON# is an active low signal that turns on the +5V, +3.3V, +12V,-5V and -12V power rails. When this signal is not pulled low by the system, or left open, the outputs (except the +5VSB and V bias) turn off. This signal is pulled to a standby voltage by a pull-up resistor internal to the power supply.Table 6 – PWOK Signal Characteristic3.5 EfficiencyThe efficiency is 68% at full loading condition to help reduce system power consumption attypical system loading conditions.3.6 +5VSB (Standby)The +5VSB output is always on (+5V Standby) when AC power is applied and power switch is turned on.The +5VSB line is capable of delivering at a maximum of 2A for PC board circuit to operate.4. ProtectionProtection circuits inside the power supply shall cause only the power supply’s main outputs to shutdown. If the power supply latches off due to a protection circuit tripping, either a AC cycle OFF for 15 sec, or PSON# cycle HIGH for 1 sec must be able to restart the power supply.4.1 Over Power ProtectionThe OPP function shall work at 130%~270% of rating of output power (when optional external protect card is not present), then all outputs shut down in a latch off mode.The latch shall be cleared by toggling the PSON# signal or by cycling the AC power.The power supply shall not be damaged from repeated power cycling in this condition.If only one module works inside the power supply, the OPP is at 110%~170% of ratingof power supply.4.2 Over Voltage ProtectionEach hot swap module has respective OVP circuit. Once any power supply module shut down ina latch off mode while the output voltage exceeds the over voltage limit shown in Table 7, the othermodules should deliver the sufficient power to the device continually.06Table 7 –Over Voltage protection4.3 Over Current ProtectionThe power supply should contain the OCP function on each hot swap module.The power supply should be shut down in a latch off mode while the respective output currentexceeds the limit as shown in Table 8. When the latch has been cleared by toggling the PSON# single or cycling the AC input power. The power supply module should not be damaged in this condition.Table 8 –Over Current protection4.4 Short Circuit ProtectionThe power supply shall shut down in a latch off mode when the output voltage is short circuit.5. Environmental Requirements5.1 Temperature076. Agency Requirements6.1 Safety Certification.Table 8 –Safety Certification6.2 AC Input Leakage CurrentInput leakage current from line to ground will be less than 3.5mA rms. Measurement will be made at 240 VAC and 60Hz.7. Redundant Power Supply Function7.1 RedundancyThe redundant power supply is N+1=N (460W+460W=460W) function power supply, each one module is redundancy when any one module was failed. To be redundant each item must be in the Hot swap power supply module.087.2 Hot Swap RequirementsThe redundant power supply modules shall be hot swappable. Hot swapping a power supply is the process of inserting and extracting a power supply from an operating. During this process the output voltage shall remain within the limits specified in Table 7 with the capacitive load specified Table 9. The Sub-system shall not exceed the maximum inrush current as specified in section 2.2. The power supply can be hot swapped by the following methods:7.3 LED IndicatorsThere shell be a single bi-color LED.The GREEN LED shall turn ON to indicate that all the power outputs are available.The Red LED shall turn ON to indicate that the power supply has failed, shutdown due to over current, or shutdown due to component failure.The LED(s) shall be visible on the power supply’s exterior face. The LED location shall meet ESD requirements.LED shall be securely mounted in such a way that incidental pressure on the LED shall not cause it to become displaced.Many variations of the above are possible. Supplies need to be compatible with these different variations depending upon the sub-system construction. In general, a failed (off by internal latch or external control) supply may be removed, then replaced with a good power supply(must use the same model) , however, hot swap needs to work with operational as well as failed power supplies. The newly inserted power supply may get turned on by inserting the supply into the system or by system management recognizing an inserted supply and explicitly turning it on.AC connecting separately to each module. Up to two power supplies may be on a single AC power source.Extraction: The AC power will be disconnected from the power supply first and then thepower supply is extracted from the sub-system. This could occur in standby mode or powered on mode. Insertion: The module is inserted into the cage and then AC power will be connected to the power supply module.●For power modules with AC docking at the same time as DC. Extraction: The module is extracted from the cage and both AC and DC disconnect at the same Time. This could occur in standby or power on mode. No damage or arcing shall occur to the DC or AC contactswhich could cause damage. Insertion: The AC and DC connect at the same time as the module is inserted into the cage. No damage to the connector contacts shall occur. The module may power on or come up into standby mode.●098. Reliability8.1 Mean Time Between Failures (MTBF)The MTBF of the power supply shall be calculated utilizing the Part-Stress Analysis method of MIL217F or Bell core RPP. The calculated MTBF of the power supply shall be greater than100,000 hours under the following conditions:Full rated load120V AC inputGround Benign25°C9. Physical Characteristics Size9.1 Power Supply Dimension: 150 mm(W) x 85 mm(H) x 199 mm(D)10。

MAX34561T+;中文规格书,Datasheet资料

_________________________________________________________________Maxim Integrated Products__1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, MAX3456112V/5V Hot-Plug Switch 19-5621; Rev 1; 1/12General Description The MAX34561 is a dual, self-contained, hot-plug switch intended to be used on +12V and +5V power rails to limit through current and to control the power-up output-volt-age ramp. The device contains two on-board n-channel power MOSFETs that are actively closed-loop controlled to ensure that an adjustable current limit is not exceed-ed. The maximum allowable current through the device is adjusted by external resistors connected between the LOAD and ILIM pins.The device can control the power-up output-voltage ramp. Capacitors connected to the VRAMP pins set the desired voltage-ramp rate. The output voltages are unconditionally clamped to keep input overvoltage stresses from harming the load. The device also contains adjustable power-up timers. Capacitors connected to the TIMER pins determine how long after power-on reset (POR) the device should wait before starting to apply power to the loads. The TIMER pins can be driven with a digital logic output to create a device-enable function. The device contains an on-board temperature sensor with hysteresis. If operating conditions cause the device to exceed an internal thermal limit, the device either unconditionally shuts down and latches off awaiting a POR, or waits until the device has cooled by the hyster-esis amount and then restarts.Applications RAID/Hard DrivesServers/RoutersPCI/PCI Express MInfiniBand TM/SMBase StationsFeatures S Completely_Integrated_Hot-Plug_Functionality_for_ +12V_and_+5V_Power_RailsS Dual_Version_of_the_DS4560S On-Board_Power_MOSFETs_(68m I_and_43m I)S No_High-Power_R SENSE_Resistors_NeededS Adjustable_Current_LimitsS Adjustable_Output-Voltage_Slew_RatesS Adjustable_Power-Up_Enable_TimingS Output_Overvoltage_LimitingS On-Board_Thermal_ProtectionS On-Board_Charge_PumpS User-Selectable_Latchoff_or_Automatic_Retry_ OperationOrdering Information+Denotes a lead(Pb)-free/RoHS compliant package.T = Tape and reel.*EP = Exposed pad.PCI Express is a registered trademark of PCI-SIG Corp. InfiniBand is a trademark and service mark of InfiniBand TradeAssociation.PART TEMP_RANGE PIN-PACKAGE MAX34561T+-40N C to +85N C24 TQFN-EP* MAX34561T+T-40N C to +85N C24 TQFN-EP*M A X 3456112V/5V Hot-Plug Switch 2Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Voltage Range on V CC5 Relative to GND ............-0.3V to +6.5V Voltage Range on V CC12 Relative to GND ...........-0.3V to +18V Voltage Range on ILIM5, VRAMP5,TIMER5, ARD5 Relative to GND .........-0.3V to (V CC5 + 0.3V),not to exceed +6.5VVoltage Range on ILIM12, VRAMP12Relative to GND ................................-0.3V to (V CC12 + 0.3V),not to exceed +18VVoltage Range on TIMER12, ARD12Relative to GND .......................................-0.3V to +5V (V REG )5V Drain CurrentContinuous ............................................................................2A Peak ......................................................................................4A12V Drain CurrentContinuous ............................................................................3A Peak ......................................................................................4A Continuous Power Dissipation (T A = +70N C)TQFN (derate 20.8mW/N C above +70N C) ...............1666.7mW Operating Junction Temperature Range .........-40N C to +135N C Operating Temperature Range ..........................-40N C to +85N C Storage Temperature Range ..........................-55N C to +135N C Lead Temperature (soldering, 10s) ................................+300N C Soldering Temperature (reflow) ......................................+260N CRECOMMENDED_OPERATING_CONDITIONS(T J = -40N C to +135N C)ELECTRICAL_CHARACTERISTICS(V CC5 = +5V, V CC12 = +12V, T J = +25N C, unless otherwise noted.)ABSOLUTE_MAXIMUM_RATINGSPARAMETERSYMBOL CONDITIONSMIN TYP MAX UNITS V CC5 Voltage V CC5(Notes 1, 2) 4.0 5.0 5.5V V CC12 Voltage V CC12(Notes 1, 2)91213.2V R ILIM_ Value R ILIM_20400I C VRAMP_ Value C VRAMP_0.045F F C TIMER_ ValueC TIMER_0.045F F TIMER_ Turn-On Voltage V ON TIMER5 2.1V CC5 + 0.3V TIMER12 2.6 5.0TIMER_ Turn-Off VoltageV OFF-0.3+1.5VPARAMETERSYMBOL CONDITIONSMINTYP MAX UNITS V CC5 Supply Current I CC5(Note 3) 1.52mA V CC12 Supply Current I CC12(Note 3)1.52.25mA 5V UVLO: Rising V UR53.7 3.95V 5V UVLO: Falling V UF5 2.73.2V 5V UVLO: Hysteresis V UH50.5V 12V UVLO: Rising V UR1288.5V 12V UVLO: Falling V UF12 6.57V 12V UVLO: Hysteresis V UH121V 5V On-Resistance R ON54356m I 12V On-ResistanceR ON126888m I 5V Internal Voltage Reference V REF5 1.80V 12V Internal Voltage ReferenceV REF122.35VMAX3456112V/5V Hot-Plug Switch3ELECTRICAL_CHARACTERISTICS_(continued)(V CC5 = +5V, V CC12 = +12V, T J = +25N C, unless otherwise noted.)Note_1: All voltages are referenced to ground. Currents entering the device are specified positive, and currents exiting the deviceare negative.Note_2: This supply range guarantees that the LOAD voltage is not clamped by the overvoltage limit.Note_3: Supply current specified with no load on the LOAD pin.Note_4: Guaranteed by design; not production tested.PARAMETERSYMBOL CONDITIONSMINTYP MAXUNITS 5V MOSFET Output Capacitance C OUT (Note 4)400pF 12V MOSFET Output CapacitanceC OUT(Note 4)400pF5V and 12V Delay Time from Enable to Beginning of Conductiont POND C VRAMP_ = 1F F 8ms5V and 12V Gate-Charging Time from Conduction to 90% of V OUT t GCT C VRAMP_ = 1F F, C LOAD_ = 1000F F 486480ms Shutdown Junction Temperature T SHDN (Note 4)120135150N C Thermal Hysteresis T HYS (Note 4)40N C TIMER_ Charging Current I TIMER 648096F A VRAMP_ Charging Current I VRAMP 648096F A 5V Overvoltage Clamp V OVC5 5.5 6.0 6.5V 12V Overvoltage Clamp V OVC1213.21516.5V 5V Power-On Short-Circuit Current LimitI SCL5R ILIM5 = 47I (Note 5)0.6 1.0 1.5A 12V Power-On Short-Circuit Current LimitI SCL12R ILIM12 = 47I (Note 5)0.6 1.0 1.5A 5V Operating Overload Current LimitI OVL5R ILIM5 = 47I (Notes 4, 6) 1.5 2.5 3.7A 12V Operating Overload Current LimitI OVL12R ILIM12 = 47I (Notes 4, 6) 1.00 1.8 2.6A 5V VRAMP5 Slew Rate SR VRAMP C VRAMP5 = 1F F 0.160.190.23V/ms 12V VRAMP12 Slew Rate SR VRAMP C VRAMP12 = 1F F0.130.150.18V/ms ARD5 Pullup Resistor R PU5100k I ARD12 Pullup ResistorR PU12k IM A X 3456112V/5V Hot-Plug Switch 4Typical Operating Characteristics(T A = +25°C, unless otherwise noted.)ON-RESISTANCE vs. TEMPERATURETEMPERATURE (°C)R O N (m Ω)10012080604020-20102030405060700-40OVERVOLTAGE CLAMP vs. TEMPERATURETEMPERATURE (°C)O V E R V O L T A G E C L A M P (V )10012080604020-2015.015.215.415.615.816.016.214.8-40OVERVOLTAGE CLAMP vs. TEMPERATURETEMPERATURE (°C)O V E R V O L T A G E C L A M P (V )120100608002040-206.106.156.206.256.306.356.406.456.506.556.05-40CURRENT LIMIT vs. TEMPERATURETEMPERATURE (°C)C U R R E N T L I M I T (A )10012080604020-200.51.01.52.02.50-40CURRENT LIMIT vs. TEMPERATURETEMPERATURE (°C)C U R R E N T L I M I T (A )10012080604020-200.51.01.52.02.53.03.50-4012V CURRENT LIMIT vs. ILIM RESISTANCER ILIM (Ω)12V C U R R E N T L I M I T (A )100500.51.01.52.02.501505V CURRENT LIMIT vs. ILIM RESISTANCER ILIM (Ω)5V C U R R E N T L I M I T (A )501000.20.40.60.81.01.21.41.61.82.02.22.42.60150SUPPLY CURRENT vs. TEMPERATURETEMPERATURE (°C)I C C (m A )120100608002040-200.20.40.60.81.01.21.41.61.80-40MAX3456112V/5V Hot-Plug Switch5Typical Operating Characteristics (continued)(T A = +25°C, unless otherwise noted.)THERMAL SHUTDOWN WITH AUTORETRY ENABLEDV CC = 12V, 2Ω RESISTIVE LOADMAX34561 toc16500ms/divV CC12LOAD125V/divLOAD CURRENT500mA/divTHERMAL SHUTDOWN WITH AUTORETRY ENABLEDV CC = 5V, 2Ω RESISTIVE LOADMAX34561 toc151s/div V CC5LOAD52V/divLOAD CURRENT500mA/divTURN-ON WAVEFORMSV CC = 12V, 3300µF CAPACITIVE LOAD10ms/divV CC12LOAD12LOAD CURRENT500mA/div5V/divTURN-ON WAVEFORMSV CC = 5V, 3300µF CAPACITIVE LOAD5ms/div V CC5LOAD5LOAD CURRENT500mA/div2V/divTURN-ON WAVEFORMSV CC = 12V, 20Ω RESISTIVE LOAD5ms/div V CC12LOAD12LOAD CURRENT500mA/div5V/divTURN-ON WAVEFORMS V CC = 5V, 20Ω RESISTIVE LOAD5ms/divTYPICAL MAX34561 TURN-ON WAVEFORMSV CC = 12V, 20Ω RESISTIVE LOAD5ms/div 2V /d i vTYPICAL MAX34561 TURN-ON WAVEFORMSV CC = 5V, 20Ω RESISTIVE LOAD2ms/div 1V /d i vM A X 3456112V/5V Hot-Plug SwitchPin ConfigurationPin DescriptionMAX3456112V/5V Hot-Plug Switch7Detailed DescriptionThe MAX34561 has hot-plug controls for both +12V and +5V power rails. The circuitry for the +12V and +5V con-trols are independent of each other and can be treated as two separate hot-plug switches, even though the GND pin is common between the two switches. The sections that follow are written from the +12V circuit perspective, but also apply for the +5V switch control.The device begins to operate when the supply voltage V CC12 (or V CC5) exceeds its undervoltage lockout level, V UR12 (or V UR5). At this level, the corresponding enable circuit and TIMER12 (TIMER5) become active. Once the device has been enabled, a gate voltage is applied to the corresponding power MOSFET, allowing current to begin flowing from V CC12 (V CC5) to LOAD12 (LOAD5). The speed of the output-voltage ramp is controlled by the capacitance placed at the VRAMP12 (VRAMP5) pin. The load current is continuously monitored during the initial conduction (I SCL12 or I SCL5) and after the cor-responding MOSFET is fully on (I OVL12 or I OVL5). If the current exceeds the current limit that is set by the exter-nal resistance at ILIM12 (ILIM5), the gate voltage of the corresponding power MOSFET is decreased, reducing the output current to the set current limit.Current is limited by the device comparing the volt-age difference between LOAD12 (LOAD5) and ILIM12 (ILIM5) to an internal reference voltage. If the output cur-rent exceeds the limit that is set by the R ILIM12 (R ILIM5) resistor, the gate voltage of the corresponding power MOSFET is decreased, which reduces the output current to the load.When the output power is initially ramping up, the current limit is I SCL12 (I SCL5). Once the corresponding MOSFET is fully on, the current limit is I OVL12 (I OVL5). The I SCL12 (I SCL5) current limit protects the source if there is a dead short on initial power-up.The device acts as a fuse and automatically disables the current flowing to the load when the temperature of the power corresponding MOSFET has exceeded the shut-down junction temperature, T SHDN .Enable/TimerThe voltage level of TIMER12 (TIMER5) is compared to an internal source (see the Functional Diagram ). When the level on the pin exceeds V ON , the comparator out-puts a low level. This then turns on the voltage ramp circuit, enabling the device’s output. TIMER12 (TIMER5) can be configured into one of four different modes of operation as listed in Table 1. TIMER12 (TIMER5) pin was designed to work with most logic families. TIMER12 (TIMER5) has at least 250mV of hysteresis between V ON and V OFF . It is recommended that any logic gate used to drive TIMER12 (TIMER5) be tested to ensure proper operation.Pin Description (continued)Table_1._TIMER__Pin_ModesPINNAMEFUNCTION22ARD55V Autoretry Disable. Connect this pin to GND to disable automatic retry functionality; the device latches off during an overtemperature fault. Leave this pin open to enable automatic retry function. This pin contains a pullup (R PU5) to V CC5. This pin is only sampled on device power-on. If the 5V side is not used, connect this pin to GND.23VRAMP55V Voltage Ramp Control. A capacitor connected to this pin determines the voltage ramp of the LOAD5 output during turn-on according to the equation: dV LOAD5 = 2.3332 x (I VRAMP /C VRAMP5).24TIMER55V Enable Delay Control. A capacitor connected to this pin determines the enable delay according to the equation: Enable Delay = C TIMER5 x (V REF5/I TIMER ).—EPExposed Pad. Connect to ground. The EP must be soldered to ground for proper thermal and elec-trical operation.OPERATION_MODE TIMER_PIN_SETUP Automatic Enable No connection to TIMER12 (TIMER5)Delayed Automatic EnableCapacitor C TIMER_ connected to TIMER12 (TIMER5)Enable/Disable Open-collector device Enable with Delay/DisableOpen-collector device and C TIMER _M A X 3456112V/5V Hot-Plug SwitchFunctional DiagramMAX3456112V/5V Hot-Plug Switch9Once the device has been enabled, there is a delay (t POND ) until conduction begins from V CC12 (V CC5) to LOAD12 (LOAD5). This delay is the time required for the charge pump to bring the gate voltage of the cor-responding power MOSFET above its threshold level. Once the gate is above the threshold level, conduction begins and the output voltage begins ramping.Automatic-Enable ModeWhen V CC12 (V CC5) exceeds V UR12 (V UR5), the gate holding the TIMER12 (TIMER5) node low is released. The internal current source brings the node to a level greater than V ON , enabling the device.Delayed Automatic-Enable ModeWhen V CC12 (V CC5) exceeds V UR12 (V UR5), the gate holding the TIMER12 (TIMER5) node low is released. The internal current source (I TIMER ) then begins charging C TIMER_. When C TIMER_ is charged to a level greater than V REF12 (V REF5), the device turns on. The equation for the delay time is:t DELAY = (C TIMER12 x V REF12)/I TIMER t DELAY = (C TIMER5 x V REF5)/I TIMEREnable/Disable ModeA logic gate or open-collector device can be connected to TIMER12 (TIMER5) to enable or disable the device. When TIMER12 (TIMER5) is held low, the device is dis-abled. When an open-collector device is used to drive TIMER12 (TIMER5), the device is enabled when the open collector is in its high-impedance state by the internal current source bringing the TIMER12 (TIMER5) node high. TIMER12 (TIMER5) is also compatible with most logic families if the output high voltage level of the gate exceeds the V ON level, and the gate can sink the I TIMER current.Enable with Delay/Disable ModeAn open-collector device is connected in parallel with C TIMER_. When the pin is held low, the device is dis-abled. When the open-collector driver is high imped-ance, the internal current source begins to charge C TIMER_ as in the delayed mode.Output-Voltage RampThe voltage ramp circuit uses an operational ampli-fier to control the gate bias of the corresponding n-channel power MOSFET. When the timer/enable circuit is disabled, a FET is used to keep C VRAMP_ discharged, which forces the output voltage to GND. Once the enable/timer circuit has been enabled, aninternal current source, I VRAMP , begins to charge the external capacitor, C VRAMP_, connected to VRAMP12 (VRAMP5). The amplifier controls the gate of the corre-sponding power MOSFET so that the LOAD12 (LOAD5) output voltage divided by two tracks the rising voltage level of C VRAMP_. The output voltage continues to ramp until it reaches either the input V CC12 (V CC5) level or the overvoltage clamp limits. The equation for the output-voltage ramp function is:dV LOAD /dt = 2 x (I VRAMP /C VRAMP12) for +12V circuit dV LOAD /dt = 2.3332 x (I VRAMP /C VRAMP5) for +5V circuitThermal ShutdownThe device enters a thermal shutdown state when the temperature of the corresponding power MOSFET reaches or exceeds T SHDN , approximately +135N C. When T SHDN is exceeded, the thermal-limiting cir-cuitry disables the device using the enable circuitry. Depending on the state of ARD12 (ARD5), the device attempts to autoretry once the device has cooled, or it latches off.AutoretryIf ARD12 (ARD5) is unconnected or connected high, the device continually monitors the temperature once it has entered thermal shutdown. If the junction temperature falls below approximately +95N C (T SHDN - T HYS ), the corresponding power MOSFET is re-enabled. See the Thermal Shutdown with Autoretry Enabled typical operat-ing curves for details.LatchoffIf ARD12 (ARD5) is pulled low and the device has entered thermal shutdown, it does not attempt to turn back on. The only way to turn the device back on is to cycle the power to the device. When power is reapplied to V CC12 (V CC5), the junction temperature needs to be less than T SHDN for the device to be enabled.Overvoltage LimitThe overvoltage-limiting clamp monitors the VRAMP12 (VRAMP5) level compared to an internal voltage ref-erence. When the voltage on VRAMP12 (VRAMP5) exceeds V OVC12/2 (or V OVC5/2.3332), the gate volt-age of the corresponding n-channel power MOSFET is reduced, limiting the voltage on LOAD12 (LOAD5) to V OVC12 (V OVC5) even as V CC12 (V CC5) increases. If the device is in overvoltage for an extended period of time, the device could overheat and enter thermal shutdown. This is caused by the power created by the voltageM A X 3456112V/5V Hot-Plug Switch 10drop across the corresponding power MOSFET and the load current. See the Thermal Shutdown with Autoretry Enabled typical operating curves for details.Applications InformationExposed PadThe exposed pad is also a heatsink for the device. The exposed pad should be connected to a large trace or plane capable of dissipating heat from the device.Decoupling CapacitorsIt is of utmost importance to properly bypass the device's supply pins. A decoupling capacitor absorbs the energy stored in the supply and board parasitic inductance when the FET is turned off, thereby reducing the magni-tude of overshoot at V CC . This can be accomplished by using a high-quality (low ESR, low ESL) ceramic capaci-tor connected directly between the V CC and GND pins. Any series resistance with this bypass capacitor lowers its effectiveness and is not recommended. A minimum 0.5µF ceramic capacitor is required. However, depend-ing on the parasitic inductances present in the end appli-cation, a larger capacitor could be necessary.Unused PinsIf only one side (5V or 12V) of the device is being used, it is required that the unused V CC , AR, CTIMER, and VRAMP pins be connected to GND. Leaving these input pins unconnected can result in interference of the proper operation of the active portion of the device.LOAD and ILIM ConnectionsSmall parasitic resistances in the bond wires of the LOAD pins and in the traces connected to the LOAD pins can result in a voltage offset while current is flowing. Since the voltage drop across RILIM is used to set the I SCL and I OVL limits, this induced offset can increase the value of I SCL and I OVL from the specified values for any given R ILIM . To greatly reduce this offset, it is recommended that one of the LOAD pins have a dedicated connection to ILIM though R ILIM , and not be used to pass the LOAD current (Figure 1). This would leave three LOAD pins to pass I LOAD , which should be sufficient. Because there is only a small amount of current passed from this lone LOAD pin to ILIM, there is a negligible voltage offset applied to the internal comparator. This method is the best way to attain an accurate current limit for I LOAD .Package InformationFor the latest package outline information and land patterns, go to /packages . Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.Figure 1. LOAD and ILIM ConnectionsPACKAGE_TYPE PACKAGE_CODE OUTLINE_ND_PATTERN_NO.24 TQFN-EPT2444+421-013990-0022分销商库存信息: MAXIMMAX34561T+。

玉柴6T系列发电机组技术资料说明书

√直喷式内燃发动机（柴油）√交流同步发电机（单轴承）√众智自启动控制器、电瓶充电器（200kW 含以上）√普通仪表控制器（200kW 以下）√散热器水箱、皮带驱动冷却风扇、风扇安全护罩√塑壳或框架式断路器√免维护蓄电池以及电池连接线√钢结构底座，内置复合减震器√排气弯头、排气波纹管、排气消音器√随机专用工具、随机资料√加厚塑膜包装静音型机组（需选装）400kW/500kVA型号ModelSF-Y400GF常用功率Prime power 千瓦（KW）350备用功率Standby power 千瓦（KW）400常用功率Prime power 千伏安（KVA）437.5备用功率Standby power千伏安（KVA）500型号Model SF-Y400GF额定转速Rated speed转（r/min）1500相数/线数phases/lines/3相4线噪音Noise limit分贝(db)≤102最大输出电流Maximum output current安培（A）630满载燃油消耗率Fuel Consumption at100%升/小时（L/H）≤195机组外型尺寸Gensets Dimensions毫米（MM）3500*1040*1900机组重量Gensets weight千克（KG）3400型号Model YC6T600L-D22发动机品牌Engine brand玉柴机器生产厂家Manufacturer广西玉柴机器股份有限公司额定功率Rated power千瓦（KW）4011h功率1-hour power千瓦（KW）441发动机型式Engine type立式、直列、水冷、四冲程燃油喷射形式Injection Type直喷Direct Injection进气方式Intake way增压中冷Turbocharged Inter-cooled 发动机气缸数No.of Cylinders6缸径行程piston stroke毫米（MM）145*165总排量Displacement升（L）16.35压缩比Compression ratio15:01机油容量Oil capacity升（L）52机油消耗率Oil consumption g/(kw.h)≤0.5排放Emission T2启动方式Starting way24V直流电启动调速方式Governor Type电子调速Electronic适用海拔高度Applicable altitude米(M)≤2500发动机外形尺寸Engine dimension毫米（MM）1836*1060*1600发动机重量Engine Dry Weight千克（KG）1980水箱散热器Water tank radiator铝散热芯、40℃或者50℃环境温度√机油、防冻液、防冷凝加热器、电缆线√分体式日用燃油箱、一体式底座燃油箱√四保护、自启动机组控制屏、ATS双电源转换柜、并机柜√发动机驱动风扇及40℃环境温度散热水箱√固定式静音型机组（箱柜）、移动式静音机组（箱柜拖车）√固定式防雨型机组（箱柜）、移动式防雨机组（箱柜拖车）√集装箱式外罩或静音箱√放冷凝机油加热器和水道加热器型号Model SF400发电机品牌(标配)Generator brand（Standard）昇丰生产厂家Manufacturer扬州市圣丰发电设备厂额定功率Rated power400材质material quality100%铜线绕组轴承数Number of Bearing单轴承防护等级Protection Grade IP23励磁方式Exciter Type无刷、自励调压方式Voltage regulation mode AVR自动调压绝缘等级Insulation Class H电话干扰系数Telephone interference Factor(TIF)≤50电话谐波因数Telephone harmonic factor(THF)≤2%稳态电压调整率Voltage Regulation,Steady State≤±0.5%瞬态电压调整率Transient State Voltage≤+20%～-15%电压波动率Voltage fluctuation rate≤±0.5%稳态频率调整率frequency regulation，Steady State≤±0.5%瞬态频率调整率Transient frequency regulation≤+10%～-7%频率波动率Frequency fluctuation≤±0.5%其它可选品牌Other brands can be selected斯坦福STAMFORD马拉松利莱森玛英格兰电西门子凯捷利恒通领驭等控制系统的监控与保护柜安装于电机或机组底座上。

MAX4665ESE中文资料

PBX, PABX Systems Audio-Signal Routing Avionics
MAX4664CPE MAX4664ESE MAX4664EPE
0°C to +70°C -40°C to +85°C -40°C to +85°C
16 Plastic DIP 16 Narrow SO 16 Plastic DIP
SO/DIP
MAX4665
LOGIC
SWITCH
0
OFF
1
ON
SWITCHES SHOWN FOR LOGIC “0” INPUT
Rail-to-Rail is a registered trademark of Nippon Motorola, Ltd.
IN1 1 COM1 2
NO1 3 V- 4
MAX4664/MAX4665/MAX4666
5Ω, Quad, SPST, CMOS Analog Switches
ABSOLUTE MAXIMUM RATINGS
V+ to GND ..............................................................-0.3V to +44V V- to GND ..............................................................+0.3V to -44V V+ to V-...................................................................-0.3V to +44V VL to GND ........................................(GND - 0.3V) to (V+ + 0.3V) All Other Pins to DGND (Note 1) ......... (V- - 0.3V) to (V+ + 0.3V) Continuous Current (COM_, NO_, NC_) ........................±100mA Peak Current (COM_, NO_, NC_)

MAX3086ECSD-T中文资料

General Description
The MAX3080E–MAX3089E are ±15kV electrostatic discharge (ESD)-protected, high-speed transceivers for RS485/RS-422 communication that contain one driver and one receiver. These devices feature fail-safe circuitry, which guarantees a logic-high receiver output when the receiver inputs are open or shorted. This means that the receiver output will be a logic high if all transmitters on a terminated bus are disabled (high impedance). The MAX3080E/MAX3081E/MAX3082E feature reduced slew-rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables, allowing error-free data transmission up to 115kbps. The MAX3083E/MAX3084E/MAX3085E offer higher driver output slew-rate limits, allowing transmit speeds up to 500kbps. The MAX3086E/MAX3087E/ MAX3088Es’ driver slew rates are not limited, making transmit speeds up to 10Mbps possible. The MAX3089E’s slew rate is selectable between 115kbps, 500kbps, and 10Mbps by driving a selector pin with a single three-state driver. All devices feature enhanced ESD protection. All transmitter outputs and receiver inputs are protected to ±15kV using the Human Body Model. These transceivers typically draw 375µA of supply current when unloaded, or when fully loaded with the drivers disabled. All devices have a 1/8-unit-load receiver input impedance that allows up to 256 transceivers on the bus. The MAX3082E/MAX3085E/MAX3088E are intended for halfduplex communMAX3083E/MAX3084E/MAX3086E/MAX3087E are intended for full-duplex communications. The MAX3089E is selectable between half-duplex and full-duplex operation. It also features independently programmable receiver and transmitter output phase via separate pins.

MAX4866LEUT+T中文资料

Applications
Cell Phones
PDAs and Palmtop Devices
Digital Still Cameras MP3 Players
Features
♦ Overvoltage Protection Up to +28V ♦ Reverse Polarity Protection Down to -28V ♦ Preset Overvoltage (OV) Trip Level (7.4V, 6.35V,
Packages
Ordering Information
PART
PIN -
OV TRIP TOP PKG
PACKAGE LEVEL (V) MARK CODE
MAX4864LEUT-T 6 SOT23-6
MAX4864LELT 6 µDFN
MAX4865LEUT-T 6 SOT23-6
MAX4865LELT 6 µDFN
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
Input Voltage Range
VIN
MAX4864L
1.2
28.0
V
7.0 7.4 7.8
Overvoltage Trip Level
OVLO VIN rising
MAX4865L MAX4866L
5.95 6.35 6.75 V
In addition, a ±15kV ESD protection is provided to the input when bypassed with a 1µF capacitor to ground. All devices are offered in a small 6-pin SOT23 and a 6-pin, 2mm x 2mm µDFN package, and are specified for operation over the -40°C to +85°C temperature range.

MAX490EESA+资料

Supply Control
Voltage (VCC) Input Voltage
.(.–R—..E.–..,..D..E..)........................................-.0....5..V...t.o...(.V..C...C...+...0...152VV)
♦ For Low-Voltage Applications: MAX3483E/MAX3485E/MAX3486E/MAX3488E/ MAX3490E/MAX3491E: +3.3V Powered, ±15kV ESD-Protected, 12Mbps, Slew-Rate-Limited, True RS-485/RS-422 Transceivers
General Description
The MAX481E, MAX483E, MAX485E, MAX487E– MAX491E, and MAX1487E are low-power transceivers for RS-485 and RS-422 communications in harsh environments. Each driver output and receiver input is protected against ±15kV electro-static discharge (ESD) shocks, without latchup. These parts contain one driver and one receiver. The MAX483E, MAX487E, MAX488E, and MAX489E feature reduced slew-rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables, thus allowing error-free data transmission up to 250kbps. The driver slew rates of the MAX481E, MAX485E, MAX490E, MAX491E, and MAX1487E are not limited, allowing them to transmit up to 2.5Mbps.

GR-468-CORE中文版

3. 2 .2. 4. 1 门槛电流的激光输出功率(略) 3.2.2.4.2 LED输出功率………………………………………39 3.2.2.5 激光L-I曲线的线性度…………………………………………………39 3.2.2.5.1 整体线性度…………………………………………………39 3.2.2.5.2 拐点………………………………………………………39 3.2.2.5.3 饱和度(略) 3.2.2.6 激光器的斜效率………………………………………………………40 3.2.2.7 相对强度噪声………………………………………………………40 3.2.2.8 EELED高效发光………………………………………………………40 3.2.2.9 EELED激光发射的门槛值……………………………………………41 3.2.3 激光器的电压－电流曲线…………………………………………………41 3.2.4 调制输出特性………………………………………………………………41 3.2.4.1 调制信号形状………………………………………………………41 3.2.4.1.1眼孔图样……………………………………………………41 3.2.4.1.2 上升和下降时间……………………………………………42 3.2.4.2 消光比和调制深度……………………………………………………44 3.2.4.3 导通延迟………………………………………………………………44 3.2.4.4 截止频率………………………………………………………………45 3.2.5 可调激光器特性……………………………………………………………45 3.2.6 出射光场和元件排列 3.2.6.1 远场图形………………………………………………………………45 3.2.6.2 耦合效率………………………………………………………………46 3.2.6.3 前后向寻迹比值偏差…………………………………………………46 3.2.6.4 前后向寻迹误差………………………………………………………47 3.2.6.5 偏振消光比……………………………………………………………47 3.2.7 调制器的光学和电气特性……………………………………………………47 3.2.7.1 EA调制器特性…………………………………………………………47

3M 468 Series CF Card to PC Card Adapter 数据手册

PhysicalEnvironmentalCompactFlash is a registered trademark of the SanDisk Corporation.FrameMaterial:Glass Reinforced Polyester (PBT)Flammability:UL 94V-0Color:BlackCoverMaterial:Stainless steelTemperature RatingOperating:0°C to +55°C under 95% (non-condensing) RH Storage:-40°C to +70°C under 95% (non-condensing) RHTS-0699-B Sheet 1 of 2•Compatible with Type II, PC Card slot •Rugged stainless steel case•See Regulatory Information Appendix (RIA)for chemical compliance informationDate Modified: May 2, 2007Regulatory Information Appendix3M Electronic Solutions Division/InterconnectEUROPEAppendix E1: European Union RoHSDirective 2002/95/EC, Restriction of the Use of Certain Hazardous Substances in Electrical & Electronic Equipment, as amended by EU Commission Decision 2005/618/EC.This product is RoHS Compliant 2005/95/EC.“RoHS Compliant 2005/95/EC” means that the product or part (“Product”) does not contain any of the substances in excess of the maximum concentration values in EU Directive 2002/95/EC, as amended by Commission Decision 2005/618/ EC, unless the substance is in an application that is exempt under EU RoHS. Unless otherwise stated by 3M in writing, this information represents 3M’s best knowledge and belief based upon information provided by third party suppliers to 3M.In the event any product is proven not to conform with 3M’s Regulatory Information Appendix, then 3M’s entire liability and Buyer’s exclusive remedy will be in accordance with the Warranty stated below.Appendix E2: European Union RoHSDirective 2002/95/EC, Restriction of the Use of Certain Hazardous Substances in Electrical & Electronic Equipment, as amended by EU Commission Decision 2005/618/ECThis product contains lead in the compliant pin area in excess of the maximum concentration value allowed but is compliant by exemption under EU Commission Decision 2005/747/EC.“RoHS Compliant 2005/95/EC” means that the product or part (“Product”) does not contain any of the substances in excess of the maximum concentration values in EU Directive 2002/95/EC, as amended by Commission Decision 2005/618/ EC, unless the substance is in an application that is exempt under EU RoHS. Unless otherwise stated by 3M in writing, this information represents 3M’s best knowledge and belief based upon information provided by third party suppliers to 3M.In the event any product is proven not to conform with 3M’s Regulatory Information Appendix, then 3M’s entire liability and Buyer’s exclusive remedy will be in accordance with the Warranty stated below.Appendix E3: European Union RoHSDirective 2002/95/EC, Restriction of the Use of Certain Hazardous Substances in Electrical & Electronic Equipment as amended by Commission Decision 2005/618/EC.This product contains lead in the solder tail area in excess of the maximum concentration value allowed.Unless otherwise stated by 3M in writing, this information represents 3M’s best knowledge and belief based upon information provided by third party suppliers to 3M.In the event any product is proven not to conform with 3M’s Regulatory Information Appendix, then 3M’s entire liability and Buyer’s exclusive remedy will be in accordance with the Warranty stated below.Appendix E4: European Union RoHSDirective 2002/95/EC, Restriction of the Use of Certain Hazardous Substances in Electrical & Electronic Equipment, as amended by EU Commission Decision 2005/618/EC.This product contains decaBDE in the insulating material in excess of the maximum concentration value allowed but is compliant by exemption under EU Commission Decision 2005/17/EC.“RoHS Compliant 2005/95/EC” means that the product or part (“Product”) does not contain any of the substances in excess of the maximum concentration values in EU Directive 2002/95/EC, as amended by Commission Decision2005/618/EC, unless the substance is in an application that is exempt under EU RoHS. Unless otherwise stated by 3M in writing, this information represents 3M’s best knowledge and belief based upon information provided by third party suppliers to 3M.In the event any product is proven not to conform with 3M’s Regulatory Information Appendix, then 3M’s entire liability and Buyer’s exclusive remedy will be in accordance with the Warranty stated below.CHINAAppendix C1: China RoHSElectronic Industry Standard of the People’s Republic of China, SJ/T11363-2006, Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products.This symbol, per Marking for the Control of Pollution Caused by Electronic Information Products, SJ/T11364-2006, means that the product or part does not contain any of the following substances in excess of the following maximum concentration values in any homogeneous material: (a) 0.1% (by weight) for lead, mercury, hexavalent chromium, polybrominated biphenyls or polybrominated diphenyl ethers; or (b) 0.01% (by weight) for cadmium. Unless otherwise stated by 3M in writing, this information represents 3M’s best knowledge and belief based upon information provided by third party suppliers to 3M.In the event any product is proven not to conform with 3M’s Regulatory Information Appendix, then 3M’s entire liability and Buyer’s exclusive remedy will be in accordance with the Warranty stated below.Electronic Industry Standard of the People’s Republic of China, SJ/T11363-2006, Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products.This symbol, per Marking for the Control of Pollution Caused by Electronic Information Products, SJ/T11364-2006, means that the product or part does contain a substance, as detailed in the chart below, in excess of the following maximum concentration values in any homogeneous material: (a) 0.1% (by weight) for lead, mercury, hexavalent chromium, polybrominated biphenyls or polybrominated diphenyl ethers; or (b) 0.01% (by weight) for cadmium. Unless otherwise stated by 3M in writing, this information represents 3M’s best knowledge and belief based upon information provided by third party suppliers to 3M.The numerical reference in the symbol above should not be construed as a representation regarding the product’s life or an extension of a product warranty. The product warranty is stated below. In the event any product is proven not to conform with 3M’s Regulatory Information Appendix, then 3M’s entire liability and Buyer’s exclusive remedy will be in accordance with the product Warranty stated below.Name and Content of Hazardous Substances or ElementsImportant NoticeAll statements, technical information, and recommendations related to 3M’s products are based on information believed to be reliable, but the accuracy or completeness is not guaranteed. Before using this product, you must evaluate it and determine if it is suitable for your intended application. You assume all risks and liability associated with such use. Any statements related to the product which are not contained in 3M’s current publications, or any contrary statements contained on your purchase order shall have no force or effect unless expressly agreed upon, in writing, by an authorized officer of 3M.Warranty; Limited Remedy; Limited Liability.This product will be free from defects in material and manufacture for a period of one (1) year from the time of purchase. 3M MAKES NO OTHER W ARRANTIES INCLUDING, BUT NOT LIMITED TO, ANY IMPLIED W ARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. If this product is defective within the warranty period stated above, your exclusive remedy shall be, at 3M’s option, to replace or repair the 3M product or refund the purchase price of the 3M product. Except where prohibited by law, 3M will not be liable for any indirect, special, incidental or consequential loss or damage arising from this 3M product, regardless of the legal theory asserted.3Electronic Solutions Division6801 River Place Blvd.。