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ICX285_ICX205_ICX414_ICX424 demokit-V5.1简介(20141204)

ICX285_ICX205_ICX414_ICX424 demokit-V5.1简介(20141204)

ICX285/ICX205/ICX414/ICX424 DemoKit-V5.1公司: 版权:作者:喀秋莎 QQ :261717211 时间:2014-12-04博客:/itrumimaging目录目录 (2)1. 概述: (3)2. 特性参数: (3)3. 通电测试步骤: (5)4. 功能介绍: (6)5. 设计思想描述: (7)6. 硬件结构特点: (8)7. 设计优点: (8)1. 概述:ICX285/ICX205/ICX414/ICX424 DemoKit-V5.1 CCD成像组件可实现对ICX285、ICX205、ICX414和ICX424四款(八型)CCD的驱动并成像。

该成像组件具有结构紧凑,性能可靠,功能扩展性好及升级改造空间大的诸多优点。

其最少只需一根USB2.0专用电缆,即可实现电源供电、图像数据传输、参数设置等诸多功能。

成像组件的曝光时间、增益、钳位等参数可通过开放性的用户端软件进行手动设置。

CCD驱动方案采用通用的FPGA/CPLD 产生驱动时序的方法,非常适合对CCD驱动电路的学习、科学研究型相机的设计、公司相关项目前期设计参考等等。

2. 特性参数:3. 通电测试步骤:(1). 正确安装USB驱动ezusb.sys;驱动安装方法可参考配套的驱动安装指导。

(2). 选择成像组件的电源供电方式;可以采用USB电缆供电,也可以选择外部独立5V供电。

选择方法是:将电路板上的跳线P1跳至靠近USB接口一端时,是选择的USB电缆供电。

将电路板上的跳线P1跳至靠近外部独立供电接口时,是选择的外部独立5V供电。

(3). 如果选择USB电缆供电方式,则跳过本步骤,执行步骤(4)。

如果选择外部独立5V供电,则应首先使用USB2.0专用电缆,连接成像组件至PC机。

然后接通外部独立5V供电。

(4). 如果选择USB电缆供电方式,请使用USB2.0专用电缆,连接成像组件至PC 机。

(5). 此时电路通电,程序启动,设备开始工作,PC机将识别成像组件设备。

HB0923 核心10GBaseR_PHY v2.0 手册说明书

HB0923 核心10GBaseR_PHY v2.0 手册说明书

HB0923Handbook Core10GBaseR_PHY v2.0Microsemi HeadquartersOne Enterprise, Aliso Viejo,CA 92656 USAWithin the USA: +1 (800) 713-4113 Outside the USA: +1 (949) 380-6100 Sales: +1 (949) 380-6136Fax: +1 (949) 215-4996Email: *************************** ©2020 Microsemi, a wholly owned subsidiary of Microchip Technology Inc. All rights reserved. Microsemi and the Microsemi logo are registered trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners. Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer’s responsibility to independently determine suitability of any products and to test and verify the same. The information provided by Microsemi hereunder is provided “as is, where is” and with all faults, and the entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP rights, whether with regard to such information itself or anything described by such information. Information provided in this document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document or to any products and services at any time without notice.About MicrosemiMicrosemi, a wholly owned subsidiary of Microchip T echnology Inc. (Nasdaq: MCHP), offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs andmidspans; as well as custom design capabilities and services. Learn more at .Contents1Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11.1Revision 1.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 3Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33.1Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33.2Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33.3Core Version . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33.4Supported Families . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33.5Device Utilization and Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44.1Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65.1Clocks and Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65.2Gearbox Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65.3Gearbox Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65.4Transmit FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75.5Elastic Buffer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75.6Read and Write Control Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .86.1Rx Gearbox interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86.2Tx Gearbox Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7Tool Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .97.1License . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97.2Using core in Libero SmartDesign . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97.3Synthesis in Libero . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97.4Place-and-Route in Libero . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 8Testbench . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 9System Integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11FiguresFigure 1Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 2Timing diagram for Rx Gearbox Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 3Timing diagram for Tx Gearbox Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 4Core Instance Full I/O View in SmartDesign . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 5Block Diagram of 10G BaseR System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 6SmartDesign representation of 10G BaseR System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11TablesTable 1Device Utilization and Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Table 2Input and Output Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4Revision History1Revision HistoryThe revision history describes the changes that were implemented in the document. The changes arelisted by revision, starting with the most current publication.1.1Revision 1.0Revision 1.0 is the first publication of this document. Created for Core10GBaseR_PHY v2.0.2ReferencesThis section lists documents that provide more information about concepts and features covered in thisuser guide.•UG0686 - Microsemi PolarFire FPGA User Guide•UG0677 - PolarFire FPGA Transceiver User Guide3Introduction3.1OverviewCore10GBaseR_PHY is an IP that converts the transceiver gearbox signals into the XGMII format. This IP is needed to interface the Transceiver with the XGMII compliant MAC.3.2FeaturesThe IP core has the following features:•64-bit XGMII interface (MAC side)•64-bit gearbox mode (Transceiver side)•Supported for only 64B66B PCS encoding in the transceiver•Converts the gearbox signals to the XGMII signals on the transmit interface•Receives the gearbox signals and adds/deletes skip characters to absorb the +/-100 ppm variation and converts to XGMII format towards the MAC side3.3Core VersionThis handbook is for Core10GBaseR_PHY version 2.0.3.4Supported Families•PolarFire ® SoC •PolarFire ®3.5Device Utilization and PerformanceDevice utilization and performance data is provided in T able 1 for the supported device families. The data listed in this table is indicative only. The overall device utilization and performance of the core is system dependent.Note:The data in this table is achieved using typical synthesis and layout settings. Frequency (in MHz) was setto 100 and speed grade was -1.Table 1 •Device Utilization and PerformanceFamily Utilization (Logic Elements)Performance (MHz)DeviceSequential Combinational uSRAM(1K)T otal %I_TX_CLK I_RX_CLK I_XGMII_T XCLK I_XGMII_RXCLK PolarFire Soc 2657168412 1.0230210420216PolarFire27381641121.02502305002504Interface4.1PortsAll the input and output ports of the core are listed in the following table.Table 2 • Input and Output SignalsPort name Width Direction DescriptionClock and ResetI_TX_CLK1Input Transmit clock of 161.133 MHz provided by thetransceiver.I_RX_CLK1Input Recovered clock of 161.133 MHz provided by thetransceiver.I_TXCLK_RESETN1Input Active low asynchronous reset input to reset transmitlogic. This reset is internally synchronized withI_TX_CLK.I_RXCLK_RESETN1Input Active low asynchronous reset input to reset receivelogic. This reset is internally synchronized withI_RX_CLK.Transceiver Rx Gearbox InterfaceI_PMA49_RX_GRBX_LOCK1Input PMA Rx gearbox lock signal.I_PMA49_RX_GRBX_SOS1Input Start-of-sequence pulse.Sequence is the span of clock beats over whichuniquely different parts of block symbols are transferredacross the interface on each of the clock beats. Lengthof a sequence varies with block size and active width ofinterface.Note:For 66-bit blocks and a 64-bit interface thesequence length is 33 clock beats.I_PMA49_RX_GRBX_HDR_EN1Input Enable for header. WhenI_PMA49_RX_GRBX_HDR_EN =1 for a clock beat,then valid sync header bits are transferred.I_PMA49_RX_GRBX_DATA_EN1Input Data enable is 1 for a clock beat when data is presenton I_PMA49_RX_GRBX_DATA. Over a sequence thereare clock beats which convey no data. For 66-bit blocksand a 64-bit interface there is one dead cycle on beat32.I_PMA49_RX_GRBX_HDR4Input Sync header corresponding to different encoding types.Note:Bits [1:0] contain header in 64B66B mode.The upper bits [3:2] are driven withLogic'0'.I_PMA49_RX_GRBX_DATA64Input Data received from PMA in gearbox mode.Transceiver Tx Gearbox InterfaceO_PMA49_TX_GRBX_SOS1Output Start-of-sequence pulse.Length of a sequence varies with block size and activewidth of interface.Note:For 66-bit blocks and a 64-bit interface thesequence length is 33 clock beats.O_PMA49_TX_GRBX_HDR_EN1OutputEnable for header. WhenO_PMA49_TX_GRBX_HDR_EN =1 for a clock beat, then valid sync header bits are transferred.O_PMA49_TX_GRBX_HDR 4OutputSync header corresponding to different encoding types.Note:Bits [1:0] contain header in 64B66B mode.The upper bits [3:2] are driven with Logic'0'.In the transmit direction, the 64-bit transmit block is sent with the sync headers. For control blocks it carries value [1:0] = 'b10Else [1:0] = 'b01.O_PMA49_TX_GRBX_DATA_EN 1OutputData enable is 1 for a clock beat when data is present on O_PMA49_TX_GRBX_HDR_EN. Over a sequence there are clock beats which convey no data.O_PMA49_RX_GRBX_DATA 64Output 64-bit transmit data to PMA XGMII SignalsI_XGMII_RXD 64Input XGMII RX data I_XGMII_RXC 8Input XGMII RX control O_XGMII_TXD 64Output XGMII TX data O_XGMII_TXC 8Output XGMII TX controlXGMII ClocksI_XGMII_TXCLK 1Input XGMII TX clock of 156.25 MHz I_XGMII_RXCLK1InputXGMII Rx clock of 156.25 MHzTable 2 • Input and Output Signals Port nameWidth Direction DescriptionClock and Reset5Functional DescriptionCore10GBaseR_PHY is used to interface the transceiver to the XGMII compliant MAC. This IP hasgearbox functionality to convert the transceiver transmit and receive gearbox signals to the XGMIIformat. It also performs the frequency/rate matching of the transceiver side clocks to the XGMII clocks.The functional block diagram of the core is shown in Figure1. Each of the functional blocks and theclocks/resets of the core is described as follows.Figure 1 • Functional Block DiagramThe Core10GBaseR_PHY IP operates in two frequency domains, one at the transceiver side and theother at the MAC side.The transceiver transmit logic operates with the I_TX_CLK and the receive logic with I_RX_CLK. Thetransmit side of the MAC operates with the XGMII TX clock and receive side with XGMII RX clock.The module has two reset signals as specified in the Reset section of T able2, page4 and both the resetsare synchronized internally in the IP with the respective clocks.5.2Gearbox InterfaceThis module interfaces the gearbox's transmit and receive module with the Microchip's transceiver. 5.3Gearbox ModuleThis module interfaces the gearbox interface logic to the transmit FIFO on the transmit path and with theelastic buffer on the receive path.The gearbox module rate matches the transceiver's transmit clock with the transmit FIFO. This isachieved by inserting dead cycle every 32nd cycle in the transmit sequence.In the dead cycle there is no read performed. The transmit interface timing diagram is shown in Figure3.Similarly, the gearbox module rate matches the transceiver's receive clock with the elastic buffer. It isachieved by inserting the dead cycle every 32nd clock cycle. The dead cycle is where the write is notperformed. The receive timing diagrams are shown in Figure2.5.4Transmit FIFOIt is a simple asynchronous FIFO of size 64x72 and used to interface the gearbox module with the MACin the transmit path. The write logic of the transmit FIFO operates with the XGMII Tx clock and the readlogic operates with the transceiver clock (I_TX_CLK).5.5Elastic BufferIn the receive path, the elastic buffer interfaces between the gearbox and MAC. The elastic buffer hastwo functions:•The elastic buffer performs write on transceiver's receive clock (I_RX_CLK) and reads on the XGMII clock (I_XGMII_RXCLK).•The elastic buffer handles the ppm variation upto +/- 100PPM between the XGMII receive side MAC clock and the transceiver's receive clock.5.6Read and Write Control LogicThe read and write control logic controls the read and write into the elastic buffer module. This logic addsor deletes the idle characters depending upon the transceiver receive clock frequency.If the receive clock frequency (I_RX_CLK) is more than the XGMII MAC receive clock, the idles areremoved, which means it is not written into the elastic buffer. If the receive clock frequency is less thanthe MAC receive clock, the idles are added after reading from the elastic buffer.Timing Diagrams6Timing Diagrams6.1Rx Gearbox interfaceThe following figure shows the timing diagram for Rx gearbox interface.Figure 2 •Timing diagram for Rx Gearbox Interface6.2Tx Gearbox InterfaceThe following figure shows the timing diagram for Tx gearbox interface.Figure 3 •Timing diagram for Tx Gearbox Interfaceabcdef gihj1001011001paa deadcycleI_RX_CLKI_PMA49_RX_GRBX_SOSI_PMA49_RX_GRBX_HDR I_PMA49_RX_GRBX_DATAI_PMA49_RX_GRBX_HDR_ENI_PMA49_RX_GRBX_DATA_ENabcdef gihj1001011001paa dead cycleI_TX_CLKO_PMA49_TX_GRBX_SOSO_PMA49_TX_GRBX_HDR O_PMA49_TX_GRBX_DATA7Tool Flow7.1LicenseCore is available as obfuscated.The obfuscated version is license locked and will be available only with Libero Gold and PlatinumLicenses.7.2Using core in Libero SmartDesignCore is pre-installed in the SmartDesign IP deployment design environment or can be downloaded fromthe online repository.An example of the core instantiated in Libero SmartDesign is shown in Figure4.Figure 4 • Core Instance Full I/O View in SmartDesignFor more information about using the SmartDesign to instantiate and generate cores, see UsingDirectCore in Libero® SoC User Guide.7.3Synthesis in LiberoT o run synthesis on the core, set the design root to the IP component instance and run the Synthesistool from the Libero Design Flow pane.7.4Place-and-Route in LiberoAfter the design is synthesized, run the Place-And-Route tool from the Libero Design Flow pane.A user testbench is not provided with the core.System Integration9System IntegrationThis section provides hints to ease the integration of the core. The block diagram Core10GBaseR_PHYIP connected to the 10G MAC over the XGMII interface is shown in Figure5. The Libero SmartDesign isshown in Figure6.Figure 5 • Block Diagram of 10G BaseR SystemFigure 6 • SmartDesign representation of 10G BaseR System。

ch00-绪论

ch00-绪论

3、可实现模拟 各种处理和算法具有直接
设备无法实现的 的可实现性,而且还可实
变换
现最佳化。
不少处理和算法无 法简单实现(或不 能实现)
DSP 已是一门独立发展、遥遥领先的崭新学科
四、DSP发展概况
信号处理
在50年代前 在50年代后
模拟处理阶段 计算机技术
数字处理阶段 离线处理 LSI技术
在线处理
1965 Cooley & Tukey 发现离散傅立叶变换(DFT)的高速计算 法(FFT),极大的促进了数字信号处理的进程。
五、课程任务
1、时域离散信号与系统时域、频域、Z域的分析 (1,2章) 复习 2、数字频谱计算的原理、设计与实现 (3,4章) 重点 3、数字滤波的原理、设计与实现 (5,6,7章) 重”两个 电平,不致误判 ⇒系统稳定性极 好 数字部件高度规 范性,便于大规 模集成和批量生 产⇒提高系统可靠 性。
环境温度、噪声、电磁 干扰影响大
2、极其灵活
DSP
ASP
可充分利用计算机特长实现:
多工处理、时分复用、自适应等
仿真模拟(调整系统特性、 估价质量指标、最优化等)
绪论
一、数字信号处理(DSP)的基本概念
序列 通过计算机 或专用的芯 片/设备
以达到预期目的:
二、DSP的基本组成
可见:《数字信号处 理》仍然是研究:
信号 通过 系统
时间离散信号 时间离散系统
确定信号
线性系统
(本课程重点)
三、DSP的特点
1、精确、稳定、 一致性
DSP
ASP
如系统17位字长, 网络元器件精度只能达

CH_00_GB

CH_00_GB

LITHOSTAR LP82ULTRAAbout this manualLITHOSTAR LP82ULTRA0 Sep. 20003 FCC Compliance Statement This equipment LITHOSTAR LP82ULTRA has been tested and found to comply with the limitsfor a Class A digital device, pursuant to part 15 of the FCC rules. These limits are designed toprovide reasonable protection against harmful interference when the equipment is operated in acommercial environment. This equipment generates, uses and can radiate radio frequency ener-gy and if not installed and used in accordance with the instruction manual, may cause harmful in-terference to radio communications. Operation of this equipment in a residential area is likely tocause harmful interference, in which case the user will be required to correct the interference athis own expense.LITHOSTAR LP 82ULTRA0Oct. 200041Ordering Information and Copyright NoticeUser SectionParts 1 through 3 of this manual can be obtained in a multilingual version (English, Ger-man, French, Dutch, Spanish and Italian) on CD-ROM:Spare Parts List Part 4, i.e. the Spare Parts List, of this manual can be ordered completely, using no.:Manual This manual can be ordered completely with cover, using no.:Copyright info This manual is subject to alterations at any time without prior notice.Agfa and the Agfa-Rhombus are trademarks of Agfa-Gevaert AG, Germany.LITHOSTAR is a trademark of Agfa-Gevaert N.V., Belgium.Printed in Belgium.Published by Agfa-Gevaert N.V., Septestraat 27, B-2640 Mortsel, Belgium.Oct. 2000 (first edition)No.Part Name Language A327800.0LITHOSTAR LP 82ULTRA User section GB, D, F, NL, ES, IT No.Part Name Language A327801.0LITHOSTAR LP 82ULTRA Spare Parts List GBNo.Part Name Language A326737.0LITHOSTAR LP 82ULTRA User Manual GBLITHOSTAR LP 82ULTRA0Sep. 200052Manual Contents and AudienceFor whom is this manual intendedThis manual is intended for:•end-users and technicians responsible for the day-to-day operation and maintenance of the LITHOSTAR LP 82ULTRA •Agfa service technicians.How to find information The table below will direct you straight to the information you are looking for:Overviews and referencesAt the beginning of each chapter, you will find:•an overview of the information in that chapter •references to other parts of the manual.If you need more information If you are not able to solve a problem yourself, or if you need more information, pleasefeel free to contact your local Agfa representative.If you …Go to …look for technical data‘Technical Specifications’ on page 3.want to start processing rightaway‘General Safety Measures’ on page 4 and then ‘Operating the Processor’ on page 33 in the Instruction manual.received an error message‘Troubleshooting’ on page 133 in the Instruc-tion Manual.require generic information onthe LITHOSTAR LP 82ULTRA‘LITHOSTAR Basics’ on page 13 in the Instruction Manual.require generic information onthis manualthis chapter.want to do maintenance‘Maintenance’ on page 83 in the Instruction Manual.need information on a specifictopicthe ‘Index’ on page 162 at the end of the Instruction Manual.look for installation data‘Pre-installation Instructions’ on page 5 in the Instruction Manual.look for a spare part or anexploded view ‘Section Overview’ on page 4 of the Spare Parts List.LITHOSTAR LP82ULTRASep. 2000 63Notation ConventionsPresenting information in a consistent way A number of fixed notation conventions is used throughout this manual on the LITHOSTAR LP82ULTRA. They will help you to retrieve the information you need quickly and accurately.Icons Icons are used to attract your attention to specific information. The meaning of eachicon is described in the table below:Procedures Procedures are broken down into numbered steps. Carry out a procedure byperforming the steps in the same order as described.Front, rear, left, right side The illustration below indicates the front, rear, left and right side of the processor:LeftLITHOSTAR LP82ULTRA0 Oct. 20007Edition The table below lists all pages of Technical Specifications with their edition:Page Edition Page Edition1Sep. 20006Sep. 20002Sep. 20007Oct. 20003Sep. 20008Sep. 20004Oct. 20005Sep. 2000LITHOSTAR LP82ULTRA8Sep. 2000。

CH0导读

CH0导读

2020/1/27
8
第6章 網路交換技術
主要介紹
電路交換(Circuit Switching) 訊息交換(Message Switching) 分封交換(Packet Switching)
2020/1/27
9
第7章 網路上的通訊設備
主要介紹
中繼器(Repeater) 集線器(Hub) 橋接器(Bridge) 交換器(Switch) 路由器(Route0/1/27
4
第3章 網路基本概念
主要介紹
網路的模式 網路作業系統 傳輸媒體(Media) 網路的拓樸 網路管理 網域名稱系統 與網路相關常用的指令
2020/1/27
5
第4章 通信協定(1/2)
主要介紹
OSI模型 網際控制訊息協定(ICMP) 位址解析協定ARP與RARP 點對點連線協定(PPP)及串列線路網際協定(SLIP) 檔案傳遞協定(FTP) 簡易郵件傳遞協定(SMTP) 簡單的網路管理協定(SNMP) 網路檔案系統 網域名稱服務(DNS)
網路基礎
導讀
2020/1/27
1
Outline
共分為9章
第1章 資料通信原理 第2章 標準組織 第3章 網路基本概念 第4章 通信協定 第5章 區域網路 第6章 網路交換技術 第7章 網路上的通訊設備 第8章 網際網路 第9章 寬頻網路
2020/1/27
2
第1章 資料通信原理
2020/1/27
10
第8章 網際網路
網際網路八大功能
全球資訊網(WWW) 搜尋引擎(Search Engine) 電子佈告欄(BBS) 檔案傳輸協定(FTP) 電子郵箱(E-MAIL) 資詢檢索系統(Archie) 資料查詢系統(Gopher) 新聞(NEWS)

网路管理- Ch01 Introducing Networks

网路管理- Ch01 Introducing Networks
(ISO, International Standard Organization) } ¨t¤s (OSI, Open System Interconnection) A§ [c ¨é¤¨ ¤C-h AM wq¨C-h \à P C
Understanding the OSI Model (cont.) ISO/ OSI (ò )

Understanding the OSI Model (cont.)
(Simplex) G u ¤ W ° T u à° V°e A p s P q (Half Duplex)G¨ ¤°eP±°T A LkP i Ap Luq¤± C (Full Duplex)Gu¤W ¨ iPi°eP±°T A pq P ADSLC
Chapter 1 Introducing Networks
Contents Introducing Networks (skip) Understanding the OSI Model CSMA/CD Protocol MAC Frame Review Questions
Understanding the OSI Model ISO/ OSI
MAC Frame (cont.)
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Contents Introducing Networks (skip) Understanding the OSI Model CSMA/CD Protocol MAC Frame Review Questions

MTO Series Front Bumper 2021 FORD BRONCO FBBR-01 安

MTO Series Front Bumper 2021 FORD BRONCO FBBR-01 安

6400 SYCAMORE CANYON BLVD.RIVERSIDE, CALIFORNIA 92507855-680-9595PRODUCTINSTALLATION MANUALMTO Series Front Bumper2021 FORD BRONCOFBBR-01TOOLS REQUIRED SKILL LEVELTIME REQUIRED- 13mm, 15mm, 18mm & 21mm sockets- 10mm, 15mm, 18mm & 21 mm wrenches- Pushpin Puller or Flathead Screwdriver- T40 Torx Bit- #4 Allen Head- Snips/Scissors- Zip Ties- Novice/Intermediate- 2 peopleIntermediate skill level required.Additional help will be neededwhen removing factory bumper.- Approximately 3.5 HoursTime to install this shouldtake about 3.5 hoursSTEP 1REMOVAL OF FACTORY STEEL BUMPER STEP 2Begin by removing the front plastic d-ring guards. Using a screwdriver or push pin remover, remove the (2) pins on the bottom and (2) near the top of the d-ring mount.Using a 15mm socket, loosen the (3) bolts on each side.Note: When you do this, the bumper can become free from the vehicle and can fall. Ensure you have another person holding it, or the bumper secure to prevent fallingand injury.Pull the top half away from the Bronco and set to the side. Repeat for theother side.STEP 3Once all bolts are loose, remove the plug for the fog lights and front sensors if equipped. This is located at the back end of the grill on the driver side. STEP 4Once unplugged, remove all (6) bumper bolts and d-rings mounts.Set bumper face down off to the side.STEP 5STEP 7Remove the rubber/plastic shroud under the grill by pulling the tabs on the shroud away (up/down) from vehicle while pulling the shroud from the vehicle.Reach behind each bumper mount on the frame rail and remove the factorynut plate.STEP 6If you do not have adaptive cruise control, remove the plastic cover by pushing the clip on the top down while pulling away from Bronco, and set off to the side.Note: If you have adaptive cruise control, you will need to relocate the module using our ABBR-01 to retain the functionality (Adaptive Cruise Control RelocationBracket).STEP 8If equipped with sensors, removethe main bumper brackets fromthe backside of the bumper usinga 13mm socket, remove the (4) hex head bolts.STEP 9Next, using a T40 torx bit, remove the (6) bolts securing the mount in place. Once remove, gently separate mount from bumper, and set off to the side.STEP 10STEP 12To remove the wire harness, using a flat head screwdriver or pin puller, remove all the retaining clips securing the harness to the bumper.Lastly, gently squeeze the same two tabs on the sensor bezel and push the backside of the sensor to remove the bezel. Continue the same steps on theremaining sensors.STEP 11To remove the sensors, spread the two tabs on the sensor bezel and gently pull up on the sensor. Make sure that the rubber ring around the sensorhead remains on the sensor.STEP 1STEP 3Next, lay out both wings and install the provided foam gasket on the wings.Note: Use care when applying, since any edges that go past the front face will bevisible when installed on the truck.STEP 2Place the center section of thebumper face down on a soft surface to prevent any damage to the coating.INSTALLATION OF DV8 BUMPER Begin by unpacking all items and inspecting for missing pieces or damage. If you have any concerns, please contact the company the product was purchased from.(8) M14x35mm Bolts (8) M14 Lock Nuts (16) M14 Flat Washers (6) M12x50mm Bolts (6) M12 Split Washers(12) M12 Flat Washers (4) M6x20mm Bolts (4) M6 Lock Washers (8) M6 Flat WashersHardware Included :STEP 4STEP 5Using the provided shorter M12 bolts, attach the wings to the center section of the bumper.If your vehicle is equipped with factory sensors, install the factory sensor bezels.Note: Our bumpers are designed to accept both factory metal bumper and plastic bumper sensor bezels. All cutouts are cut differently to ensure each bezel is placed into the correct hole. They should easilypop into place.Line up the front and top face of the wings with the center section and tighten all wing hardware using a 21mm socket and wrench.STEP 6STEP 8Feed the wiring harness into the bumper though the interior wing cutouts so that each sensor is aligned with their bezel.Note: The large plug needs to be on the driver side of the bumper.Install 3” cube lights into the wings.(Lights are not included with the bumper)STEP 7While holding the front of the sensor bezel, push the sensor into the bezel, until the sensor clicks into place. Repeat for all sensors.STEP 9After the lights and sensors (if equipped) are installed, using standard zip ties, secure the wiring to our zip tie tabs.STEP 10If you will be running a winch, install this into the bumper at this time. Note: If you do not intend to run a winch, we provide a mount for a 20” singlerow light bar. Using the provided M5 hardware, with the light attached tothe bracket, install the bracket into the bumper centered behind the screen with the DV8 logo.STEP 11STEP 13Ensure there is no wiring hanging down from the bumper since it can make the install of the bumper onto the Bronco more difficult.Prior to tightening the bumper down, using assistance, align the bumper to ensure the best fit, then tighten down all the hardware to 70 ft lbs. using a18mm socket and wrench.STEP 12Using assistance, hold the bumper up to the vehicle. Using the provided M12 bolts and hardware, secure the bumper to the Bronco but do not tighten until the next step. The bolts should be inserted into the bumper and then through the mounting plate on the frame with the threads of the bolt pointing towards the rear of the vehicle.STEP 14Lastly connect the senor plug to the connector located on the back driver side of the grill.STEP 15Double check all hardware and connect lights and winch to power supplies.You are now done with the install of your new DV8 MTO Series Front Bumper。

XC6000芯片手册-中文(Ver 1.0)

XC6000芯片手册-中文(Ver 1.0)
8. 电气特性...............................................................................................................................15
9. 详细描述...............................................................................................................................18 9.1 低噪声放大器(LNA) ................................................................................................................ 18 9.2 接收混频器 .................................................................................................................................. 18 9.3 接收可编程复合滤波器 ................................................................................................................ 18 9.4 接收限幅器 .................................................................................................................................. 19 9.5 接收信号强度指示(RSSI)........................................................................................................19 9.6 频率合成器 .................................................................................................................................. 19 9.7 压控振荡器(VCO) ................................................................................................................... 19 9.8 发送功率放大器(PA) ............................................................................................................... 19 9.9 晶体振荡器 .................................................................................................................................. 20 9.10 速率和信道选择.........................................................................................................................20

TB1,TB2,SB00-D,SB1-D,SB2-D,SB4-S,SB2,C10M20, 规格书,Datasheet 资料

TB1,TB2,SB00-D,SB1-D,SB2-D,SB4-S,SB2,C10M20, 规格书,Datasheet 资料

IEC and British Standard FusesApplication Data for BS Low Voltage FusesMax.Fuse Rating (amps)Cable Size (mm2)K = 115K = 143116161,52025*2.532*32*450*50*663*63*10100*125*16125*160*25200*250*35315*355*50400*50070560630957108001208001000* Extended Motor Circuit dual ratings can be used.Protection Against Electrical ShockFor a TN System, a disconnecting time not exceeding 5s is permitted for a distribution circuit. The maximum values of earth fault loop impedance (Zs) of 240V for Cooper Bussmann gG fuses to BS 88: Parts 2 and 6 are:Rating (A)Zs (Ohms)Rating (A)Zs (Ohms) Rating (A)Zs (Ohms) 61450 1.12500.16 107.7630.863150.1316 4.3800.604000.09620 3.01000.445000.07325 2.41250.356300.05432 1.91600.278000.04440 1.42000.20Ambient TemperatureThe derating, in terms of current, of 0.5% per °C above an ambient of 35°C is recommended.Interrupting RatingThe standardized interrupting rating values are 80kA for voltages of 415Vac and above, and 40kA for DC applications. The 240Vac designs have an interrupting rating of 50kA.Coordination RatioAll fuses to BS 88 Parts 2 and 6 will give a coordination ratio of 2:1; and for most practical situations a ratio of 1.6:1 (two steps in the R10 series). Example: an upstream fuse rated at 160A will coordinate with a downstream fuse rated at 100A. Current and Energy LimitationThe range of fuses have pre-arcing I2t values towards the bottom limits of BS 88 Parts 2 and 6. This ensures excellent current and energy limitation. They also have lower power losses at rated current. This assists in the appropriate interchangeability with other makes of fuses.TransformersWhen fuses are used on the primary side of transformers, the normal fuse current rating should be at least twice the nominal transformer primary current.Fluorescent LightingThe normal fuse current rating should be at least twice the normal full load current of the maximum number of lights to be simultaneously switched.Capacitor CircuitsFor power factor correction in capacitor circuits, the fuse should be chosen with a current rating greater than 1.5 times the rated capacitor current. This takes into account the high inrush current, circuit harmonics and capacitor tolerances. Motor CircuitsIn motor circuits, the fuse has to withstand the motor's starting current and often requires a higher rating than the motor's full load current. Coordination recommendations are made by the manufacturers of motor starters in accordance with IEC 60947-4-1. To get Type 2 coordination with fuses, tests are performed with the latest gG or gM fuses to BS 88 or IEC 60269 that have pre-arcing I2t values towards the bottom of specified limits. This means that Cooper Bussmann fuses are suitable to provide Type 2 coordination. Extended dual ratings of motor circuit protection fuses with gM characteristics are available in most popular fuse sizes to extend the use of associated equipment with appropriate economies. In the majority of applications, gG fuses are used. It is not essential to use gM fuses for motor circuit protection, they simply extend the utilization of standard equipment.Below is a table of recommended fuses at 415V. In most applications, the run-up time is less than 5 seconds and duty is infrequent - no more than twice per hour. The next larger rating should be used for more demanding applications.Direct On-line Asst.StartStandard Motor Circuit Standard Rating Motor(gG)(gM)(gG)kW A A A A0.250.84-20.37 1.14-20.55 1.56-40.75 2.06-41.1 3 010-61.5 3.616-0 12.2 5.016-0 13.0 6.520- 6 14.08.420- 6 15.511.02520M25 2 207.515.04032M402511.020.05032M503215.027.06332M634018.533.08063M805022.038.08063M805030.054.010063M1008037.066.0125100M1258045.079.0160100M160100 55.098.0160100M160100 75.0135.0250200M250160 90.0155.0250200M250160 110.0185.0315200M315200 132.0220.0355315M400250 150.0250.0355315M400315 185.0310.0450400M500355 200.0335.0500 4 00M500400 225.0375.0560-400 250.0415.0560-450 280.0460.0630-500 335.0562.0710-630 355.0596.0800-710CSA Type P and Type D FusesCatalog NumbersBasic Catalog Dimensions in (mm)Number Amp A B Max C Min D Min EFand VoltsRatings Overall Diameter Blade Length Barrel Length Blade ThicknessBlade Width 1-30 2.0 (50.8)0.56 (14.3)————35-60 3.0 (76.2)0.81 (20.6)————CDN/PON 250Vac70-100 5.88 (149.4)— 1.0 (25.4)—0.13 (3.2)0.75 (19.1)110-2007.3 (185.4)— 1.38 (34.9) 4.13 (104.8)0.19 (4.8) 1.13 (28.6)225-4008.63 (219.2)— 1.88 (47.6) 4.63 (117.5)0.25 (6.4) 1.63 (41.3)450-60010.38 (263.7)—2.25 (57.2) 5.19 (131.8)0.25 (6.4) 2 (50.8)1-30 5.0 (127.0)0.81 (20.6)————35-60 5.5 (139.7) 1.06 (27.0)————CDS 600Vac70-1007.88 (200.2)— 1.0 (25.4)—0.13 (3.2)0.75 (19.1)110-2009.63 (244.6)— 1.38 (34.9) 6.13 (115.6)0.19 (4.8) 1.13 (28.6)225-40011.63 (295.4)— 1.88 (47.6)7.13 (118.1)0.25 (6.4) 1.63 (41.3)450-60013.38 (339.9)—2.25 (57.2)8.19 (208.0)0.25 (6.4)2 (50.8)To OrderTo order, specify Basic Catalog Number and amp rating. Example: CDN-30Data Sheet:4126CDS,CDN & PON Type P & DSpecificationsDescription:CSA time-delay Type D & P fuses.Dimensions:See Catalog Numbers table and Dimensions illustration.Ratings:Volts:— 250Vac (CDN & PON)— 600Vac (CDS)Amps:— 10-600AIR:— 10kA minimumAgency Information:CE, CSA Certified to C22.2 No. 59.1.Features and Benefits• Economical fuse in a variety of ratings for applications not requiring time-delay.Typical Applications• Lighting, heating and other circuits not subject to temporary surges and where available short-circuit current are relatively low.Basic Catalog NumbersTime-Delay CSA Type “D”FusesCatalog Amp NumbersVoltsRatingsBelow 10A use FRN-R 10, 12, 15, 20, 25, 30,35, 40, 45, 50, 60, 70, 80, 90, 100CDN 250Vac110, 125, 150, 175, 200, 225, 250, 300, 350, 400,450, 500, 600Below 10A use FRS-R 10, 12, 15, 20, 25, 30,35, 40, 45, 50, 60CDS 600Vac70, 80, 90, 100, 110, 125, 150, 175, 200,225, 250, 300, 350, 400, 450, 500, 600One-Time CSA Type “P”FusesCatalog Amp Number Volts RatingsPON250Vac15, 20, 25, 30, 35, 40, 45, 50, 60Tron®HRC Form II Class C FusesDimensionsData Sheet:4125HRCI Industrial Ceramic Body FusesData Sheet:4128Data Sheet:4127Features and Benefits• Close sizing to loads allows using smaller and less costly switches• Provides a higher degree of short-circuit protection • Helps protect motors against burnout from overloads Typical Applications• For use in circuits subject to surge currents such as those caused by motors, transformers and other inductive loads Dimensions - in (mm)CJ HRCI-JSpecificationsDescription:HRCI-J fast-actingfuses are industrial duty fuses with the excellent current-limitingcharacteristics of fast-acting HRCI-J fuses to limit damage to equipment and installations by the thermal and magnetic energy associated with a large short-circuit fault current.Overload characteristics limit cable damage due to low overload currents.Dimensions:See Catalog Numbers table and Dimensions illustrations.Construction:Ceramic body fuse.Ratings:Volts:— 600Vac (or less), 250Vdc Amps:— 1-600AIR:— 200kAAgency Information:CSAC22.2 No. 106 M92; Designed to BS 88:2, IEC 60269-2.HRCI-J Fast-acting FusesData Sheet:4129DimensionsHRCI - Miscellaneous Type K FusesIEC &British FusesCIH,CIK & CIL HRCI-MISCSpecificationsDescription:HRI fuses provide both overload and short-circuit protection, featuring offset blades for bolt down mounting.Dimensions:See Catalog Numbers table and Dimensions illustration.Construction:Ceramic body.Ratings:Volts:— 600V Amps:— 1-100AIR:— 200kA@600VAgency Information:CE, CSA C22.2 No.106 M92.HRC Form II Current-limiting FusesBS 88 British Standard Low Voltage Fuses — 240-550Vac (See Catalog Numbers table)complying with general purpose gG (See Catalog Numbers table for details)AC,AD,BC,BD,CD,DD,ED,EFS BS 88SpecificationsDescription:Low voltage fuses that comply with general purpose gGcharacteristics and available up to 400A with two hole mount and up to 1250A with four hole mount.Construction:Ceramic body.Ratings:Volts:— 415/550Vac, 250Vdc (SeeCatalog Numbers table)Amps:— 2-400A (See Catalog Numbers table)—63M80-400M500A Motor Starter ratings (See Catalog Numbers table)IR:— See Catalog Numbers tableAgency Information:CE, Meets the requirements of BS 88 Parts 1 and 2 and IEC 60269-1.Mounting:Center bolted blades, two-hole mount.Basic Catalog NumbersBasic Interrupting Max Voltage Catalog Amp Ratings Ratings BS 88Numbers RatingsAC DC AC DC Ref.AC 2, 4, 6, 10, 16, 20, 25, 3280kA 40kA 550250—AD 2, 4, 6, 10, 16, 20, 25, 3280kA 40kA 550250—BC 40, 50, 6380kA 40kA 550250—63M80*, 63M100*80kA —550——BD 40, 50, 6380kA 40kA 550250—CD 80, 100, 100M125*, 100M160*,80kA —415—B1100M200*, 100M200*DD 125, 160, 200,80kA —415—B2200M250*, 200M315*ED 250, 315, 355, 400, 315M400*80kA —415—B3400M500*80kA —550—B4EFS125, 160, 200, 250, 31580kA415——*“M” indicates motor starter ratings.To OrderTo order, specify Basic Catalog Number and amp rating. Example: BC-40Recommended Fuse Blocks & HolderBasic FuseBlock/HolderCatalog Numbers Catalog NumbersAC BH-0111 Modular fuse block AD 200DF Fuse holderBC BH-0111 Modular fuse block BD 200DF Fuse holder CD 200DF Fuse holder DD 200DF Fuse holderEDBH-1131 Modular fuse blockBS 88 British Standard Low Voltage FusesData Sheets 4110 (AC),4111 (AD),4113 (BC),4114 (BD),4116 (CD),4118 (DD),4119 (ED) and 4121 (EFS)Data Sheets 4120 (EF),4102 (FF),4122 (FG),4103 (GF),4104(GG) and 4108 (GH)See Catalog Numbers table andD16,D27,D33,D125 Type DSpecificationsDescription:DIN style Type Dlow voltage fuses.Dimensions:See CatalogNumbers table and Dimensionsillustrations.Construction:Ceramic body.Ratings:Volts:— 500VacAmps:— 2-100AIR:— 100kAAgency Information:CE, “D” type fuses complying withDIN 49360 Part 2 and DIN 49515, operating class gL.Catalog NumbersCatalog Amp Dimension Color FigureNumbers Ratings“D”(mm)Code Number2D1626Pink4D1646Brown6D1666Green10D16108Red116D161610Grey20D162012Blue25D162514Yellow2D2726Pink4D2746Brown6D2766Green10D27108Red216D271610Grey20D272012Blue25D272514Yellow35D333516Black50D335018White363D336320Copper80D125805Silver4100D1251007RedAdditional Fuselinks: Quick acting fuselinks in body sized D16, D27, D33 andD125 rated 2-100A. Reference number suffixed Q, i.e. 10D27Q. Voltage rating 500V.Gauge rings and keys can also be supplied.Dimensions (mm)For product data sheets,visit /datasheets/ulcsa227 DIN Style Type D and Neozed Low Voltage FusesData Sheet:4124Data Sheet:4124For detailed information,visit the Electrical IEC section at www 228NH HRC Fuses___NHG___BSpecifications Class:gG/gLDescription:DIN square bodied, dual indication industrial fuses.Construction:Steatite insulator, corrosion-proof (aluminum) metal parts with full-contact,silver-plated copper blades.Sizes:DIN 000 to 4.Selectivity Ratio:1:1.6 up to 500Vac.Dimensions (mm)Fuse a 2b c 1c 2De 1e 2e 3e 4f Size a 1(max)a 3a 4(nom)(±8)(nom)(nom)(max)(max)(max)(nom)(max)00078.5 ±1.55445 ±1.549 ±1.5153510 2 ±0.5412116680078.5 ±1.55445 ±1.549 ±1.51535117.0 ±0.54830256150125 ±2.56862 +3/-1.568 +1.5/-3153511 2.5 ±0.548302561501135 ±2.57562 ±2.568 ±2.5154011 2.5 ±0.54830256151135 ±2.57562 ±2.568 ±2.5204011 2.5 ±0.553522561502150 ±2.57562 ±2.568 ±2.5204811 2.5 ±0.55352256152150 ±2.57562 ±2.568 ±2.5254811 2.5 ±0.561602561503150 ±37562 ±2.568 ±2.5256011 2.5 ±0.56160256153150 ±37562 ±2.568 ±2.5326011 3.0 ±0.57570256184200848090508511312087—830Data Sheet 4173NH HRC FusesIEC&British FusesRated gG/gL Dual IndicatorCurrent Voltage Conducting Carton500Vac / 250Vdc Size(Amps)Metal Gripping Lugs Quantity22NHG000B344NHG000B31010NHG000B31616NHG000B32020NHG000B32525NHG000B30003535NHG000B34040NHG000B35050NHG000B36363NHG000B3100100NHG000B300125 125NHG00B3160160NHG00B31010NHG0B32020NHG0B32525NHG0B33232NHG0B33535NHG0B35050NHG0B36363NHG0B38080NHG0B3100100NHG0B3160160NHG0B31010NHG01B31616NHG01B32020NHG01B33232NHG01B33535NHG01B3014040NHG01B35050NHG01B38080NHG01B3100100NHG01B3125125NHG01B3160160NHG01B31224224NHG1B3250250NHG1B33535NHG02B34040NHG02B36363NHG02B38080NHG02B302100100NHG02B3125125NHG02B3200200NHG02B3224224NHG02B3250250NHG02B3315315NHG2B32400400NHG2B3250250NHG03B3315315NHG03B303355355NHG03B33500500NHG3B3630630NHG3B3500500NHG4G14630630NHG4G1Single IndicatorSlotted End10001000NHG4G1Tags12501250NHG4G1For detailed information,visit the Electrical IEC section at 229For detailed information,visit the Electrical IEC section at www 230NH HRC FusesRated gG/gL Dual IndicatorCurrent Voltage Conducting Carton 690Vac / 250Vdc Size(Amps)Metal Gripping Lugs Quantity22NHG000B-690366NHG000B-69031010NHG000B-69030001616NHG000B-69032020NHG000B-69033232NHG000B-69033535NHG000B-69034040NHG000B-69035050NHG00B-6903008080NHG00B-6903100100NHG00B-690366NHG0B-69031010NHG0B-69032020NHG0B-69032525NHG0B-690303232NHG0B-69033535NHG0B-69035050NHG0B-69036363NHG0B-69038080NHG0B-6903100100NHG0B-69036363NHG1B-69038080NHG1B-69031100100NHG1B-6903125125NHG1B-6903200200NHG1B-69036363NHG2B-69038080NHG2B-6903100100NHG2B-69032160160NHG2B-6903200200NHG2B-6903224224NHG2B-6903250250NHG2B-6903250250NHG3B-6903315315NHG3B-69033355355NHG3B-6903400400NHG3B-6903500500NHG3B-6903For detailed information,visit the Electrical IEC section at www 231NH Fuse BasesIEC &British FusesSB*-D,SB*-SUp to 690V / 160 - 1250A Sizes 00,0,1,2,3,4Description:NH fuse bases with thermoplasticbodies. DIN rail and screw mounting (size 4 screw fix). Range of protection accesories for live parts in order to obtain IP20 protection standard. Ratings:• Voltage: up to 690Vac • Amps: 2 to 1250AApplications:Protection of industrial circuits and electrical apparatusStandards and Approvals:I EC 60269, DIN 43620Part NumbersNeutralFuse extraction handleProtection accessoriesIP Protection KitsMicroswitch- 400 Volts gG/gL- 500 Volts gG/gL and aM - 690 Volts gG/gL and aM* For single pole onlyFor detailed information,visit the Electrical IEC section at www 232Class gG/gL IEC 60269 Industrial Ferrule Fuses8 x 31mm : 400Vac, 0.5 - 25A10 x 38mm : 500Vac, 0.5 - 32A14 x 51mm : 400Vac - 500Vac - 690Vac, 1 - 50A22 x 58mm : 400Vac - 500Vac - 690Vac, 2 - 125AFor detailed information,visit the Electrical IEC section at www233Class aM IEC Industrial Ferrule Fuses - Class aM IEC60269IEC &BritishFuses8 x 31mm : 400Vac, 1 - 8A10 x 38mm : 400Vac - 550Vac, 0.16 - 25A14 x 51mm : 690Vac - 500Vac, 0.25 - 50A22 x 58mm : 400Vac - 500Vac - 690Vac, 2 - 125ANeutral LinksClass aM & gG/gL IEC Industrial Ferrule Fuses with StrikerClass aM with Striker14 X 5122 X 5814 X 5122 X 58For detailed information,visit the Electrical IEC section at 234For product data sheets,visit /datasheets/ulcsa235IEC &British FusesSAFElocSpecifications Catalog Symbol:See table below.Description:The SAFEloc HRC fuse holders (for use with HRCI-CB fuses) provides a positive, stress-free fuse fittingand locks it in position to ensure safe insertion andwithdrawal from the base. Base contacts are fully shrouded to help protect against electric shock. Shrouds utilize simple slide/snap action allowing access to the contact terminal screws.Ratings:Volts:— 600VAmps:— 30-60A (See Catalog Number table for details)Agency Information:CE, Designed to accommodate the compact range of offset blade fuse to CSA C22.2 No. 106,HRCI-CB.Mounting:35mm DIN rail or single screw mounting.Catalog Numbers*Catalog Amp FuseNumbers Ratings Connection Accepted C30F Front _CIF06C30BS 30Back C30FBS Front-Back C60F Front EK-AmpC60BS 60Back C60FBS Front-Back CAMasterSpecifications Catalog Symbol:See table below.Description:TheCAMaster HRC fuse holder features a uniquecam-action for easy fuse removal while allowing significantly improved contact pressure between fuse carrier and base contact that enhanceselectrical performance. A range of lockable safety carriers for the fuse holder (catalog reference: LSC), are available.Ratings:Volts:— 690VAmps:— 30-100A (See Catalog Number table for details)Agency Information:CE, CSA C22.2 No. 39; IEC 269AND BS 88.Mounting:35mm DIN-rail or single screw mounting.Catalog NumbersCatalog Amp FuseNumbers Ratings Details For:Accepted CM20CF 30HRCI-CA Applications _CIF21CM30CF 30_H07C CM60CF 60HRCII Applications_K07C CM100CF100_K07CRAccessory Catalog Numbers for CAMaster UnitsCatalog Amp Fuse Holder Numbers Ratings Details Accepted 20BS 30CM20CF 32BS 30Back StudCM30CF 60/100BS 60/100CM60/100CF GLP All Ganging Link Kit 3-Pole NIAll 660V Neon Indicator —20LSC 30CM20CF 30LSC 30Security Carrier with ClipCM30CF 60/100LSC60/100ACM60/100CFHRC Fuse HoldersData Sheet:4132Data Sheet:4133236。

c语言编程规范

c语言编程规范

DKBA 华为技术有限公司内部技术规范DKBA 2826-2011.5C语言编程规范2011年5月9日发布 2011年5月9日实施华为技术有限公司Huawei Technologies Co., Ltd.版权所有侵权必究All rights reserved修订声明Revision declaration 本规范拟制与解释部门:本规范的相关系列规范或文件:相关国际规范或文件一致性:替代或作废的其它规范或文件:相关规范或文件的相互关系:目录Table of Contents0规范制订说明 (5)0.1前言 (5)0.2代码总体原则 (5)0.3规范实施、解释 (6)0.4术语定义 (6)1头文件 (6)2函数 (12)3标识符命名与定义 (21)3.1通用命名规则 (21)3.2文件命名规则 (23)3.3变量命名规则 (23)3.4函数命名规则 (24)3.5宏的命名规则 (24)4变量 (24)5宏、常量 (28)6质量保证 (31)7程序效率 (36)8注释 (39)9排版与格式 (43)10表达式 (46)11代码编辑、编译 (49)12可测性 (50)13安全性 (51)13.1字符串操作安全 (51)13.2整数安全 (52)13.3格式化输出安全 (55)13.4文件I/O安全 (57)13.5其它 (59)14单元测试 (59)15可移植性 (60)16业界编程规范 (60)C语言编程规范范围:本规范适用于公司内使用C语言编码的所有软件。

本规范自发布之日起生效,以后新编写的和修改的代码应遵守本规范。

简介:本规范制定了编写C语言程序的基本原则、规则和建议。

从代码的清晰、简洁、可测试、安全、程序效率、可移植各个方面对C语言编程作出了具体指导。

0 规范制订说明0.1 前言为提高产品代码质量,指导广大软件开发人员编写出简洁、可维护、可靠、可测试、高效、可移植的代码,编程规范修订工作组分析、总结了我司的各种典型编码问题,并参考了业界编程规范近年来的成果,重新对我司1999年版编程规范进行了梳理、优化、刷新,编写了本规范。

Chirp Microsystems CH101 微型超声时间的光速测距传感器说明书

Chirp Microsystems CH101 微型超声时间的光速测距传感器说明书

CH101-00ABR CH101-02ABRCH101 Ultra-low Power Integrated Ultrasonic Time-of-Flight Range SensorChirp Microsystems reserves the right to change specifications and information herein without notice.Chirp Microsystems2560 Ninth Street, Ste 200, Berkeley, CA 94710 U.S.A+1(510) 640–8155Document Number: DS-000331Revision: 1.3Release Date: 09/22/2020CH101 HIGHLIGHTSThe CH101 is a miniature, ultra-low-power ultrasonic Time-of-Flight (ToF) range sensor. Based on Chirp’s patented MEMS technology, the CH101 is a system-in-package that integrates a PMUT (Piezoelectric Micromachined Ultrasonic Transducer) together with an ultra-low-power SoC (system on chip) in a miniature, reflowable package. The SoC runs Chirp’s advanced ultrasonic DSP algorithms and includes an integrated microcontroller that provides digital range readings via I2C.Complementing Chirp’s long-range CH201 ultrasonic ToF sensor product, the CH101 provides accurate range measurements to targets at distances up to 1.2m. Using ultrasonic measurements, the sensor works in any lighting condition, including full sunlight to complete darkness, and provides millimeter-accurate range measurements independent of the target’s color and optical transparency. The sensor’s Field-of-View (FoV) can be customized and enables simultaneous range measurements to multiple objects in the FoV. Many algorithms can further process the range information for a variety of usage cases in a wide range of applications.The CH101-00ABR is a Pulse-Echo product intended for range finding and presence applications using a single sensor for transmit and receive of ultrasonic pulses. The CH101-02ABR is a frequency matched Pitch-Catch product intended for applications using one sensor for transmit and a second sensor for receiving the frequency matched ultrasonic pulse.DEVICE INFORMATIONPART NUMBER OPERATION PACKAGECH101-00ABR Pulse-Echo 3.5 x 3.5 x 1.26mm LGA CH101-02ABR Pitch-Catch 3.5 x 3.5 x 1.26mm LGA RoHS and Green-Compliant Package APPLICATIONS•Augmented and Virtual Reality•Robotics•Obstacle avoidance•Mobile and Computing Devices•Proximity/Presence sensing•Ultra-low power remote presence-sensing nodes •Home/Building automation FEATURES•Fast, accurate range-finding•Operating range from 4 cm to 1.2m•Sample rate up to 100 samples/sec• 1.0 mm RMS range noise at 30 cm range•Programmable modes optimized for medium and short-range sensing applications•Customizable field of view (FoV) up to 180°•Multi-object detection•Works in any lighting condition, including full sunlight to complete darkness•Insensitive to object color, detects opticallytransparent surfaces (glass, clear plastics, etc.) •Easy to integrate•Single sensor for receive and transmit•Single 1.8V supply•I2C Fast-Mode compatible interface, data rates up to 400 kbps•Dedicated programmable range interrupt pin•Platform-independent software driver enables turnkey range-finding•Miniature integrated module• 3.5 mmx 3.5 mm x 1.26 mm, 8-pin LGA package•Compatible with standard SMD reflow•Low-power SoC running advanced ultrasound firmware•Operating temperature range: -40°C to 85°C •Ultra-low supply current• 1 sample/s:o13 µA (10 cm max range)o15 µA (1.0 m max range)•30 samples/s:o20 µA (10 cm max range)o50 µA (1.0 m max range)CH101 Table of ContentsCH101 Highlights (1)Device Information (1)Applications (1)Features (1)Simplified Block Diagram (3)Absolute Maximum Ratings (4)Package Information (5)8-Pin LGA (5)Pin Configuration (5)Pin Descriptions (6)Package Dimensions (6)Electrical Characteristics (7)Electrical Characteristics (Cont’d) (8)Typical Operating Characteristics (9)Detailed Description (10)Theory of Operation (10)Device Configuration (10)Applications (11)Chirp CH101 Driver (11)Object Detection (11)Interfacing to the CH101 Ultrasonic Sensor (11)Device Modes of Operation: (12)Layout Recommendations: (13)PCB Reflow Recommendations: (14)Use of Level Shifters (14)Typical Operating Circuits (15)Ordering Information (16)Part Number Designation (16)Package Marking (17)Tape & Reel Specification (17)Shipping Label (17)Revision History (19)CH101 SIMPLIFIED BLOCK DIAGRAMFigure 1. Simplified Block DiagramCH101ABSOLUTE MAXIMUM RATINGSPARAMETER MIN. TYP. MAX. UNIT AVDD to VSS -0.3 2.2 V VDD to VSS -0.3 2.2 V SDA, SCL, PROG, RST_N to VSS -0.3 2.2 V Electrostatic Discharge (ESD)Human Body Model (HBM)(1)Charge Device Model (CDM)(2)-2-5002500kVV Latchup -100 100 mA Temperature, Operating -40 85 °C Relative Humidity, Storage 90 %RH Continuous Input Current (Any Pin) -20 20 mA Soldering Temperature (reflow) 260 °CTable 1. Absolute Maximum RatingsNotes:1.HBM Tests conducted in compliance with ANSI/ESDA/JEDEC JS-001-2014 Or JESD22-A114E2.CDM Tests conducted in compliance with JESD22-C101CH101 PACKAGE INFORMATION8-PIN LGADESCRIPTION DOCUMENT NUMBER CH101 Mechanical Integration Guide AN-000158CH101 and CH201 Ultrasonic Transceiver Handling andAssembly Guidelines AN-000159Table 2. 8-Pin LGAPIN CONFIGURATIONTop ViewFigure 2. Pin Configuration (Top View)CH101 PIN DESCRIPTIONSPIN NAME DESCRIPTION1 INT Interrupt output. Can be switched to input for triggering and calibration functions2 SCL SCL Input. I2C clock input. This pin must be pulled up externally.3 SDA SDA Input/Output. I2C data I/O. This pin must be pulled up externally.4 PROG Program Enable. Cannot be floating.5 VSS Power return.6 VDD Digital Logic Supply. Connect to externally regulated 1.8V supply. Suggest commonconnection to AVDD. If not connected locally to AVDD, b ypass with a 0.1μF capacitor asclose as possible to VDD I/O pad.7 AVDD Analog Power Supply. Connect to externally re gulated supply. Bypass with a 0.1μFcapacitor as close as possible to AVDD I/O pad.8 RESET_N Active-low reset. Cannot be floating.Table 3. Pin DescriptionsPACKAGE DIMENSIONSFigure 3. Package DimensionsCH101ELECTRICAL CHARACTERISTICSAVDD = VDD = 1.8VDC, VSS = 0V, T A = +25°C, min/max are from T A = -40°C to +85°C, unless otherwise specified.PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITSPOWER SUPPLYAnalog Power Supply AVDD 1.62 1.8 1.98 V Digital Power Supply VDD 1.62 1.8 1.98 VULTRASONIC TRANSMIT CHANNELOperating Frequency 175 kHzTXRX OPERATION (GPR FIRMWARE USED UNLESS OTHERWISE SPECIFIED)Maximum Range Max Range Wall Target58 mm Diameter Post1.2(1)0.7mm Minimum Range Min Range Short-Range F/W used 4(2)cm Measuring Rate (Sample/sec) SR 100 S/s Field of View FoV Configurable up to 180º deg Current Consumption (AVDD +VDD) I SSR=1S/s, Range=10 cmSR=1S/s, Range=1.0mSR=30S/s, Range=10 cmSR=30S/s, Range=1.0m13152050μAμAμAμA Range Noise N R Target range = 30 cm 1.0 mm, rms Measurement Time 1m max range 18 ms Programming Time 60 msTable 4. Electrical CharacteristicsNotes:1.Tested with a stationary target.2.For non-stationary objects. While objects closer than 4cm can be detected, the range measurement is not ensured.CH101ELECTRICAL CHARACTERISTICS (CONT’D)AVDD = VDD = 1.8VDC, VSS = 0V, T A = +25°C, unless otherwise specified.PARAMETERSYMBOL CONDITIONS MINTYP MAX UNITS DIGITAL I/O CHARACTERISTICS Output Low Voltage V OL SDA, INT,0.4 V Output High Voltage V OH INT 0.9*V VDD V I 2C Input Voltage Low V IL_I2C SDA, SCL 0.3*V VDDV I 2C Input Voltage High V IH_I2C SDA, SCL 0.7*V VDD V Pin Leakage Current I L SDA,SCL, INT(Inactive), T A =25°C±1μA DIGITAL/I 2C TIMING CHARACTERISTICSSCL Clock Frequencyf SCLI 2C Fast Mode400kHzTable 5. Electrical Characteristics (Cont’d)CH101 TYPICAL OPERATING CHARACTERISTICSAVDD = VDD = 1.8VDC, VSS = 0V, T A = +25°C, unless otherwise specified.Typical Beam Pattern – MOD_CH101-03-01 Omnidirectional FoV module(Measured with a 1m2 flat plate target at a 30 cm range)Figure 4. Beam pattern measurements of CH101 moduleDETAILED DESCRIPTIONTHEORY OF OPERATIONThe CH101 is an autonomous, digital output ultrasonic rangefinder. The Simplified Block Diagram, previously shown, details the main components at the package-level. Inside the package are a piezoelectric micro-machined ultrasonic transducer (PMUT) and system-on-chip (SoC). The SoC controls the PMUT to produce pulses of ultrasound that reflect off targets in the sensor’s Field of View (FoV). The reflections are received by the same PMUT after a short time delay, amplified by sensitive electronics, digitized, and further processed to produce the range to the primary target. Many algorithms can further process the range information for a variety of usage cases in a wide range of applications.The time it takes the ultrasound pulse to propagate from the PMUT to the target and back is called the time-of-flight (ToF). The distance to the target is found by multiplying the time-of-flight by the speed of sound and dividing by two (to account for the round-trip). The speed of sound in air is approximately 343 m/s. The speed of sound is not a constant but is generally stable enough to give measurement accuracies within a few percent error.DEVICE CONFIGURATIONA CH101 program file must be loaded into the on-chip memory at initial power-on. The program, or firmware, is loaded through a special I2C interface. Chirp provides a default general-purpose rangefinder (GPR) firmware that is suitable for a wide range of applications. This firmware enables autonomous range finding operation of the CH101. It also supports hardware-triggering of the CH101 for applications requiring multiple transceivers. Program files can also be tailored to the customer’s application. Contact Chirp for more information.CH101 has several features that allow for low power operation. An ultra-low-power, on-chip real-time clock (RTC) sets the sample rate and provides the reference for the time-of-flight measurement. The host processor does not need to provide any stimulus to the CH101 during normal operation, allowing the host processor to be shut down into its lowest power mode until the CH101 generates a wake-up interrupt. There is also a general-purpose input/output (INT) pin that is optimized to be used as a system wake-up source. The interrupt pin can be configured to trigger on motion or proximity.APPLICATIONSCHIRP CH101 DRIVERChirp provides a compiler and microcontroller-independent C driver for the CH101 which greatly simplifies integration. The CH101 driver implements high-level control of one or more CH101s attached to one or more I2C ports on the host processor. The CH101 driver allows the user to program, configure, trigger, and readout data from the CH101 through use of C function calls without direct interaction with the CH101 I2C registers. The CH101 driver only requires the customer to implement an I/O layer which communicates with the host processor’s I2C hardware and GPIO hardware. Chirp highly recommends that all designs use the CH101 driver.OBJECT DETECTIONDetecting the presence of objects or people can be optimized via software, by setting the sensor’s full-scale range (FSR), and via hardware, using an acoustic housing to narrow or widen the sensor’s field-of-view. The former means that the user may set the maximum distance at which the sensor will detect an object. FSR values refer to the one-way distance to a detected object.In practice, the FSR setting controls the amount of time that the sensor spends in the listening (receiving) period during a measurement cycle. Therefore, the FSR setting affects the time required to complete a measurement. Longer full-scale range values will require more time for a measurement to complete.Ultrasonic signal processing using the CH101’s General Purpose Rangefinder (GPR) Firmware will detect echoes that bounce off the first target in the Field-of-View. The size, position, and material composition of the target will affect the maximum range at which the sensor can detect the target. Large targets, such as walls, are much easier to detect than smaller targets. Thus, the associated operating range for smaller targets will be shorter. The range to detect people will be affected by a variety of factors such as a person’s size, clothing, orientation to the sensor and the sensor’s field-of-view. In general, given these factors, people can be detected at a maximum distance of 0.7m from the CH101 sensor.For additional guidance on the detection of people/objects using the NEMA standard, AN-000214 Presence Detection Application Note discusses the analysis of presence detection using the Long-Range CH201 Ultrasonic sensor.INTERFACING TO THE CH101 ULTRASONIC SENSORThe CH101 communicates with a host processor over the 2-wire I2C protocol. The CH101 operates as an I2C slave and responds to commands issued by the I2C master.The CH101 contains two separate I2C interfaces, running on two separate slave addresses. The first is for loading firmware into the on-chip program memory, and the second is for in-application communication with the CH101. The 7-bit programming address is0x45, and the 7-bit application address default is 0x29. The application address can be reprogrammed to any valid 7-bit I2C address. The CH101 uses clock stretching to allow for enough time to respond to the I2C master. The CH101 clock stretches before the acknowledge (ACK) bit on both transmit and receive. For example, when the CH101 transmits, it will hold SCL low after it transmits the 8th bit from the current byte while it loads the next byte into its internal transmit buffer. When the next byte is ready, it releases the SCL line, reads the master’s ACK bit, and proceeds accordingly. When the CH101 is receiving, it holds the SCL line low after it receives the 8th bit in a byte. The CH101 then chooses whether to ACK or NACK depending on the received data and releases the SCL line.The figure below shows an overview of the I2C slave interface. In the diagram, ‘S’ indicates I2C start, ‘R/W’ is the read/write bit, ‘Sr’ is a repeated start, ‘A’ is acknowledge, and ‘P’ is the stop condition. Grey boxes indicate the I2C master actions; white boxes indicate the I2C slave actions.Figure 5. CH101 I2C Slave Interface DiagramDEVICE MODES OF OPERATION:FREE-RUNNING MODEIn the free-running measurement mode, the CH101 runs autonomously at a user specified sample rate. In this mode, the INT pin is configured as an output. The CH101 pulses the INT pin high when a new range sample is available. At this point, the host processor may read the sample data from the CH101 over the I2C interface.HARDWARE-TRIGGERED MODEIn the hardware triggered mode, the INT pin is used bi-directionally. The CH101 remains in an idle condition until triggered by pulsing the INT pin. The measurement will start with deterministic latency relative to the rising edge on INT. This mode is most useful for synchronizing several CH101 transceivers. The host controller can use the individual INT pins of several transceivers to coordinate the exact timing.CH101 BEAM PATTERNSThe acoustic Field of View is easily customizable for the CH101 and is achieved by adding an acoustic housing to the transceiver that is profiled to realize the desired beam pattern. Symmetric, asymmetric, and omnidirectional (180° FoV) beam patterns are realizable. An example beam pattern is shown in the Typical Operating Characteristics section of this document and several acoustic housing designs for various FoV’s are available from Chirp.LAYOUT RECOMMENDATIONS:RECOMMENDED PCB FOOTPRINTDimensions in mmFigure 6. Recommended PCB FootprintPCB REFLOW RECOMMENDATIONS:See App Note AN-000159, CH101 and CH201 Ultrasonic Transceiver Handling and Assembly Guidelines.USE OF LEVEL SHIFTERSWhile the use of autosense level shifters for all the digital I/O signal signals is acceptable, special handling of the INT line while using a level shifter is required to ensure proper resetting of this line. As the circuit stage is neither a push-pull nor open-drain configuration (see representative circuit below), it is recommended that level shifter with a manual direction control line be used. The TI SN74LVC2T45 Bus Transceiver is a recommended device for level shifting of the INT signal line.Figure 7. INT Line I/O Circuit StageTYPICAL OPERATING CIRCUITSFigure 8. Single Transceiver OperationFigure 9. Multi- Transceiver OperationORDERING INFORMATIONPART NUMBER DESIGNATIONFigure 10. Part Number DesignationThis datasheet specifies the following part numbersPART NUMBER OPERATION PACKAGE BODY QUANTITY PACKAGING CH101-00ABR Pulse-Echo 3.5 mm x 3.5 mm x 1.26 mmLGA-8L 1,000 7” Tape and ReelCH101-02ABR Pitch-Catch 3.5 mm x 3.5 mm x 1.26 mmLGA-8L 1,000 7” Tape and ReelTable 6. Part Number DesignationCH101-xxABxProduct FamilyProduct Variant Shipping CarrierR = Tape & Reel 00AB = Pulse-Echo Product Variant02AB = Pitch-Catch Product VariantCH101 = Ultrasonic ToF SensorPACKAGE MARKINGFigure 11. Package MarkingTAPE & REEL SPECIFICATIONFigure 12. Tape & Reel SpecificationSHIPPING LABELA Shipping Label will be attached to the reel, bag and box. The information provided on the label is as follows:•Device: This is the full part number•Lot Number: Chirp manufacturing lot number•Date Code: Date the lot was sealed in the moisture proof bag•Quantity: Number of components on the reel•2D Barcode: Contains Lot No., quantity and reel/bag/box numberDimensions in mmDEVICE: CH101-XXXXX-XLOT NO: XXXXXXXXDATE CODE: XXXXQTY: XXXXFigure 13. Shipping LabelREVISION HISTORY09/30/2019 1.0 Initial Release10/22/2019 1.1 Changed CH-101 to CH101. Updated figure 7 to current markings.07/17/2020 1.2 Format Update. Incorporated “Maximum Ratings Table” and “Use of LevelShifters” section.09/22/2020 1.3 Fixed minor typosCH101Document Number: DS-000331 Page 20 of 20Revision: 1.3This information furnished by Chirp Microsystems, Inc. (“Chirp Microsystems”) is believed to be accurate and reliable. However, no responsibility is assumed by Chirp Microsystems for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. Chirp Microsystems reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. Chirp Microsystems makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. Chirp Microsystems assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.Certain intellectual property owned by Chirp Microsystems and described in this document is patent protected. No license is granted by implication or otherwise under any patent or patent rights of Chirp Microsystems. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are the property of their respective companies. Chirp Microsystems sensors should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment.©2020 Chirp Microsystems. All rights reserved. Chirp Microsystems and the Chirp Microsystems logo are trademarks of Chirp Microsystems, Inc. The TDK logo is a trademark of TDK Corporation. Other company and product names may be trademarks of the respective companies with which they are associated.©2020 Chirp Microsystems. All rights reserved.CH101-00ABR CH101-02ABR。

OncQ Vibration Switch VBS020701 产品说明书

OncQ Vibration Switch VBS020701 产品说明书

SENSOR SWITCH●FUNCTIONS1. Centrifugal Force Detecting2. Single Axis Vibration Detecting●APPLICATIONS1. Step counters2. Tire Pressure Monitoring System (TPMS)3. Laser marker4. Toys●FEATURES1. Suitable for horizontal and vertical PCB.2. Switch State: Normal Open.3. Tiny size, suitable for small space.4. Gold-plated ball and terminals, low possibility of oxidization.5. Use of high quality springs, vibration sensitivity is good.6. Using the technology of insert molding to withstand the force between the baseand the terminal.7. All plastic materials subject to industrial purpose, resist high temperature and meetfireproof function.8. Simple ON and OFF signals, easy for design.9. Suitable for IC trigger for signal.10. RoHS compliance, an ideal substitute for mercury switch.11. All made in Taiwan and examined before shipment.SENSOR SWITCH●PATENTS1. U.S.A. Patent No. US 6,555,772 B12. U.S.A. Patent No. US 7,332,685 B1●DIMENSIONS / OPERATION / P.C.B. LAYOUT (Unit: mm, Tolerance: ±0.25mm)Fig. 1SENSOR SWITCH●Current/Voltage SuggestedInput Current (mA) Operating Voltage (V) Condition1.0 5 --●ELECTRICAL CHARACTERISTICS1. Contact Rating 10 mA,5 VDC2. Contact Resistance 10 Ω max.3. Angle Tolerance Refer to Fig. 14. Insulation Resistance 1000 MΩ min.,100 VDC5. Dielectric Strength 500 VDC min.,1 minute6. Capacitance 5 pF max.SENSOR SWITCH●RELIABLE TEST ITEMSTest Item Standard Contents IR Reflow -- --Operating Temperature MIL-STD-202G,TEST METHOD 107G, TEST A-25°C~85°CStorage Temperature MIL-STD-202G,TEST METHOD 107G, TEST A-40℃~85℃Humidity MIL-STD-202G,TEST METHOD 103B40℃/95%RHMechanical Life -- 2Hz, horizontal 1,000,000 timesElectrical Life -- 100,000 times●SOLDERING CONDITIONFollowing soldering conditions are for reference only, please use soldering information that solder paste manufacturer recommends.SENSOR SWITCH< Table of classification Reflow profile > Item Pb processPb free processPre-heat and SoakTemperature min.(Tsmin)Temperature max.(Tsmax)Time (Tsmin to Tsmax)(ts)100 °C150 °C60-120 seconds150 °C200 °C60-120 seconds Average Rate of temperature rising up(Tsmax to Tp) 3 °C/second max. 3 °C/second max. Liquidous Temperature (TL)Time at Liquidous (tL)183 °C60-150 seconds217 °C60-150 seconds Peak package body Temperature(Tp)*230 °C ~235 °C * 255 °C ~260 °C * Classification temperature(Tc) 235 °C 260 °CTime(tp)** within 5 °C of thespecified classification temperature(Tc)20** seconds 30** secondsAverage ram-down Rate(Tp toTsmax)6 °C/second max. 6 °C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max.* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.SENSOR SWITCHFig. 2SENSOR SWITCH●PACKAGEPart Number Package Quantity Total Q’tyPacking Dimension 1. VBS020701PE bag 1,000 pcs1,000 pcs 12.7 x 17.8 (cm)Inner box 10 PE bags 10,000 pcs 36 x 20 x 9 (cm)Carton 3 Boxes 30,000 pcs 36 x 28 x 23 (cm) ※Package shown as below for reference.PE bag Inner box CartonSENSOR SWITCH●NOTE1. Suggestion for usage:For vibration usage or application,we suggest to addhysteresis for IC; if vibration is heavy,optical type of sensor switch is recommended.2. For the continued product improvement as one of the company policy,specifications may change or update without notice. The latest information can be obtained through our sales offices. Normally, all products are supplied under our standard conditions.3. If buyer’s products will stay in power supply for a long time which needs very highstability, optical sensor switch is strongly recommended.●PRECAUTIONS FOR USE1. If the products is intended to be used for other endurance equipment requiringhigher safety and reliability such as life support system, space and aviation devices, disaster and safety system, it’s necessary to make verification of conformity or contact us for the details before using.2. Do not try to clean the switch with a solvent or similar substance after the solderingprocess.3. Use water-soluble flux may damage the switch.4. If soldering temperature exceeds our specification, sensor switch could get apart.5. Do not use switch in the environment of high humidity,because such anenvironment may cause the leakage current between the terminals.6. More than the rated load may cause fire, so do not use more than the load.7. In the circuit,switch should not be near or directly connected with the magneticcomponent solder joints (for example: relays, transformers, etc.).。

合泰HT66F002_HT66F0025_HT66F003_HT66F004

合泰HT66F002_HT66F0025_HT66F003_HT66F004
概述 .................................................................................................................................7 选型表 .............................................................................................................................7 方框图 .............................................................................................................................8 引脚图 .............................................................................................................................8 引脚说明 .......................................................................................................................10 极限参数 .......................................................................................................................16 直流电气特性 ...............................................................................................................16 交流电气特性 ...............................................................................................................18 ADC 电气特性..............................................................................................................19 运算放大器电气特性 ...................................................................................................19 LVR 电气特性 ..............................................................................................................20 LCD 电气特性 – HT66F004........................................................................................20 上电复位特性 ...............................................................................................................20 系统结构 .......................................................................................................................21

龙芯2H开发板技术规格书

龙芯2H开发板技术规格书

1.7
音频子系统 ...................................................................................................... 12
1.7.1
音频子系统组成....................................................................................... 12
1.5
龙芯 2H 芯片 .................................................................................................... 11
1.5.1
直接媒体接口(DMI)............................................................................. 11
1.5.2
显示器接口............................................................................................... 11
1.5.3 USB .................................................................................................................... 11
2.7
环境因素 .......................................................................................................... 19
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《市场营销言

本教材《市场营销学教程》旨在提供一本以案例 教学和实践应用为导向,突出本土企业营销管理 实践,尽量吸取国外营销领域诸多专著与教材之 精华,侧重营销基础理论,反映营销新理念新趋 势的市场营销学教科书。
1.本教材的定位

本教程针对的目标读者主要是高等院校的本科大 学生,以及MBA学员。 本教程的价值定位 以案例教学为导向,突出本土企业营销实践, 理论体系合理完善,便利师生的教与学,侧重 实践应用能力的培养。
5.致谢
感谢河南省教育主管部门给予《河南省高等院校省 级精品课程<市场营销学>建设项目》的经费支持。 《市场营销学教程》在出版过程中,得到了河南财 经政法大学工商管理学院、MBA教育中心的全力 支持和经费资助,在此表示诚挚的感谢! 吴涛 二〇〇九年六月十九日


第6章的重点是行业环境和竞争环境的分析; 第7章重点讨论营销管理的核心概念——STP战略,详 细阐述了细分、选定目标和定位的概念与分析方法。
3.本教材的结构


第4篇谋划营销方案:包括第8章~第12章。 第8章重点介绍产品策略和新产品开发策略; 第9章集中阐述了定价策略; 第10章讨论了分销策略; 第11章阐述了基于IMC理念的营销沟通策略; 第12章阐述了人员推销技术和销售队伍管理问题。 第5篇管理营销努力: 第13章营销管理,选择一个中型企业,遵循营销管理 流程,最终完成一个较为系统全面的年度营销计划。
4.本教材的编著


本教材《市场营销学教程》由吴涛教授撰写了全部十三章 书稿,并完成了本教程全部的编著定稿工作。 本教材的第一版于2005年1月出版,书名为《市场营销管 理》。出版后,获得了许多教师的好评,特别是本教材的 定位得到了认同;也取得了良好的市场反应。 本书第二版(修订版)由吴涛教授重写了定价策略一章。 本教材一直在本校营销和非营销专业本科生、MBA、企 业管理方向硕士研究生的营销课程教学中使用。 和原书相比,本教程重写了第2章、第5章、第6章;有6 章做了重点修订并重写了某些小节;其余4章做了程度不 等的修订。
4.本教材的编著


作者参阅了大量引进版著作,以期能够更多地反映国外众 多著名营销学者的精辟论述、学术观点和研究成果,进而 拓宽我们的视野。各章参考文献便于读者“按图索骥”。 期盼同行教师、广大同学和读者朋友,对本教程提出您的 珍贵批评和建议,以激励笔者将本教材能够做得更好。 可以通过邮箱marketingfazhan619@与笔者联 系沟通。笔者保证有信必应。 作者为本教材制作了配合教学的PPT,同行教师、读者朋 友如有需要,可以向中国发展出版社读者服务部门索取。 也可以通过浏览本校精品课程网站市场营销学网页下载 /jingpin/C28/kcms-2.htm
2.本教材的特点



以案例教学为导向 突出本土企业营销实践 理论体系合理完善 便利师生的教与学 侧重实践应用能力的培养
3.本教材的结构

本教程共13章,分五篇。

第1篇建立营销概念:包括第1章和第2章。 第1章阐述了市场与市场营销的基本概念,重点建立交 易营销概念体系,了解关系营销新理念新发展; 第2章阐述了公司战略、业务战略和营销职能战略的概 念,重点建立战略管理和营销管理严谨的分析框架。
3.本教材的结构


第2篇分析营销机会:包括第3章~第5章。 第3章意在建立营销环境的分析框架; 第4章阐述了实用价值很高的营销调研技术,重点放在 调研计划制定、调查问卷设计方面; 第5章阐述消费者购买行为的概念和分析方法。 第3篇开发营销战略:包括第6章和第7章。

分别讨论了竞争导向和市场导向的营销策略。
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