8L Mini oven quotation sheet
【精品】国际贸易 商务函电 英语版unit 8(可编辑
Contents
▪ Part One
Basic Knowledge Concerned
▪ Part Two
Letter-writing Guide
Other Commonly Used Expressions and Sentences ▪ Part Three
2.Indicating your decision: do or do not accept the packing requirements
We are ready to accept your packing requirements. 我们打算接受贵方的包装要求｡ We feel regretful to inform you that... 遗憾地告诉贵方……
Thanks for your packing guidance, but regret our inability to meet your request of the special packing material. 谢谢贵方的包装指示,不过遗憾的是我们没有能力满足贵方 对使用这种特殊包装材料的要求｡
a packing list to confirm the detailed information of the shipment of cargo exported. From the packing list, the buyer and the carrier can determine in how many packages the whole lot is packed and the particular items in each package. We can also regard a packing list as a more specific version of a commercial invoice without price information.
顾客需求确认书(中英文)
需求确认书/ Demand Confirmation 需求列表编号/ Demand Confirmation No.: 填写日期/ Date:顾客信息Customer information 名称/Name:编号/ No.:邮箱/Email:国家/Countries:地址/Address:电话/Phone:需求数量/ Quantity:_______________ □确认/Confirm □其他/Others:_____________ 价格区间/ Price:__________________ □确认/Confirm □其他/Others:_____________外观要求Appearance requirement □确认/Confirm □其他/Others :基本参数Basic Parameters 输入（应用）/ Input (Application):__________________________________□确认/Confirm□其他/Others:___________________________ 输出/ Output:__________________________________□确认/Confirm□其他/Others:___________________________ 电源/ Power Supply:__________________________________□确认/Confirm□其他/Others:___________________________ 功率/ Power:__________________________________□确认/Confirm□其他/Others:___________________________性能要求Performance □确认/Confirm □其他/Others :功能要求Function □确认/Confirm □其他/Others :技术评估Technical Evaluation 硬件/Hardware:_____________________软件/Software:______________________结构/Structure.:_____________________系统/System:_______________________其他/Other:________________________评估人/Evaluator:日期/Date:销售预测SalesForecast频次/Frequency time:__________数量/Quantity:________________金额/Price:___________________其他/Other:__________________评估人/Evaluator:日期/Date:总经理意见General Manager Evaluation □同意确认/ Agree to Confirm□其他/ Others：签名/Signationr : ___________日期/Date : ___________顾客意见CustomerEvaluation□同意确认/ Agree to Confirm□其他/ Others：签名/Signationr : ___________日期/Date : ___________'.'.。
封装专用英语词汇
封装专用英语词汇-CAL-FENGHAI.-(YICAI)-Company One1常见封装形式简介DIP = Dual Inline Package = 双列直插封装HDIP = Dual Inline Package with Heat Sink = 带散热片的双列直插封装SDIP = Shrink Dual Inline Package = 紧缩型双列直插封装SIP = Single Inline Package = 单列直插封装HSIP = Single Inline Package with Heat Sink = 带散热片的单列直插封装SOP = Small Outline Package = 小外形封装HSOP = Small Outline Package with Heat Sink = 带散热片的小外形封装eSOP = Small Outline Package with exposed thermal pad = 载体外露于塑封体的小外形封装SSOP = Shrink Small Outline Package = 紧缩型小外形封装TSSOP = Thin Shrink Small Outline Package = 薄体紧缩型小外形封装TQPF = Thin Profile Quad Flat Package = 薄型四边引脚扁平封装PQFP = Plastic Quad Flat Package = 方形扁平封装LQPF = Low Profile Quad Package = 薄型方形扁平封装eLQPF = Low Profile Quad Flat Package with exposed thermal pad = 载体外露于塑封体的薄型方形扁平封装DFN = Dual Flat Non-leaded Package = 双面无引脚扁平封装QFN = Quad Flat Non-leaded Package = 双面无引脚扁平封装TO = Transistor package = 晶体管封装SOT = Small Outline of Transistor = 小外形晶体管BGA = Ball Grid Array = 球栅阵列封装BQFP = Quad Flat Package With Bumper = 带缓冲垫的四边引脚扁平封装CAD = Computer Aided Design = 计算机辅助设计CBGA = Ceramic Ball Grid Array = 陶瓷焊球阵列CCGA = Ceramic Column Grid Array = 陶瓷焊柱阵列CSP = Chip Size Package = 芯片尺寸封装DFP = Dual Flat Package = 双侧引脚扁平封装DSO = Dual Small Outline = 双侧引脚小外形封装3D = Three-Dimensional = 三维2D = Two-Dimensional = 二维FCB = Flip Chip Bonding = 倒装焊IC = Integrated Circuit = 集成电路I/O = Input/Output = 输入/输出LSI = Large Scale Integrated Circuit = 大规模集成电路MBGA = Metal BGA = 金属基板BGAMCM = Multichip Module = 多芯片组件MCP = Multichip Package =多芯片封装MEMS = Microelectro Mechanical System = 微电子机械系统MFP = Mini Flat Package = 微型扁平封装MSI = Medium Scale Integration = 中规模集成电路OLB = Outer Lead Bonding = 外引脚焊接PBGA = Plastic BGA = 塑封BGAPC = Personal Computer = 个人计算机PGA = Pin Grid Array = 针栅阵列SIP = System In a Package = 系统级封装SOIC = Small Outline Integrated Circuit = 小外形封装集成电路SOJ = Small Outline J-Lead Package = 小外形J形引脚封装SOP = Small Outline Package = 小外形封装SOP = System On a Package = 系统级封装WB = Wire Bonding = 引线健合WLP = Wafer Level Package = 晶圆片级封装常用文件、表单、报表中英文名称清除通知单Purge notice工程变更申请 ECR(Engineering Change Request)持续改善计划CIP(continuous improvement plan)戴尔专案 Dell Projec t收据Receipt数据表Data sheet核对表Check list文件清单Documentation checklist设备清单 Equipment checklist调查表，问卷Questionnaire报名表Entry form追踪记录表 Tracking log日报表Daily report周报表Weekly report月报表Monthly report年报表 Yearly report年度报表 Annual report财务报表 Financial report品质报表 Quality report生产报表Production report不良分析报表FAR(Failure analysis report)首件检查报告 First article inspection report初步报告（或预备报告）Preliminary report一份更新报告 An undated report一份总结报告 A final report纠正与改善措施报告(异常报告单) CAR (Corrective Action Report)出货检验报告Outgoing Inspection Report符合性报告（材质一致性证明） COC(Certificate of Compliance)稽核报告 Audit report品质稽核报告 Quality audit report制程稽核报告Process audit report5S 稽核报告 5S audit report客户稽核报告Customer audit report供应商稽核报告Supplier audit report年度稽核报告 Annual audit report内部稽核报告 Internal audit report外部稽核报告External audit reportSPC 报表(统计制程管制) Statistical process control工序能力指数(Cpk) Process capability index（规格)上限Upper limit（规格）下限 Lower limit规格上限Upper Specification Limit(USL)规格下限 Lower Specification Limit(LSL)上控制限（或管制上限） Upper Control Limit(UCL)下控制限（或管制下限）Lower Control Limit(LCL)最大值 Maximum value平均值Average value最小值Minimum value临界值 Threshold value / critical valueMRB 单(生产异常通知报告) Material Review Board Report工艺流程图Process Flow Diagram物料清单（产品结构表/用料结构表） BOM (Bill of Materials )合格供应商名录AVL (Approved Vendor List)异常报告单 CAR工程规范报告通知单（工程变更通知）ECNTECN自主点检表Self Check List随件单（流程卡） Traveling Card (Run Card)压焊图Bonding diagram晶圆管制卡 Wafer inspection card晶圆进料品质异常反馈单Feedback Report for Wafer Incoming Quality Problems订购单PO(Purchase Order)出货通知单Advanced Ship Notice送货单/交货单DO(Delivery Order)询价单RFQ(Request for quotation)可靠性实验报告Reliability Monitor Report产品报废单PSB特采控制表CRB返工单PRB异常处理行动措施OCAP减薄：Wafer [‘weifə] n .威化饼干、电子晶片（晶圆薄片）Grind [ɡraind ]vt. & vi. 磨碎;嚼碎n .磨,碾Crack [kræk] vt. & vi. (使…)开裂, 破裂n. 裂缝, 缝隙Ink [iŋk]n. 墨水, 油墨Die [dai] vt. & vi. 死亡（芯片）Dot [dɔt] n . 点, 小圆点Mounting [‘mauntiŋ]n. 装备,衬托纸Tape [teip] n. 带子；录音磁带; 录像带Size [saiz] n. 大小, 尺寸，尺码Thick [θik]adj. 厚的，厚重的Thickness [‘θiknis]n. 厚(度), 深(度)宽 (度)Position [pə‘ziʃən]n. 方位，位置Rough [rʌf] adj . 粗糙的; 不平的Fine [fain]adj. 美好的, 优秀的, 优良的, 杰出的Speed [spi:d]n. 速度, 速率Spark[spɑ:k]n. 火花; 火星Out [aut]adv. 离开某地, 不在里面；(火或灯)熄灭Grindstone [‘ɡraindstəun]n. 磨石、砂轮Mount[maunt]vt. & vi. 装上、配有Mounter装配工;安装工;镶嵌工Mounting [‘mauntiŋ]n. 装备,衬托纸Magazine [,mæɡə‘zi:n] n. 杂志, 期刊，弹药库（传递料盒）Cassette [kə‘set] n. 盒式录音带；盒式录像带Inspect [in‘spekt] vt. 检查，检验，视察Inspection [in‘spekʃən] n. 检查，视察Card [kɑ:d]n. 卡, 卡片, 名片划片：Saw [sɔ:] n. 锯vt. & vi. 锯，往复运动Sawing ['sɔ:iŋ]n. 锯,锯切,锯开Film [film] n. 影片, 电影（薄膜，蓝膜）Frame [freim] n. 框架，骨架，构架Clean [kli:n]adj. 清洁的, 干净的；纯净的Cleaner [‘kli:nə]n. 作清洁工作的人或物Oven [‘ʌvən] n . 烤箱, 炉Cassette [kə‘set]n. 盒式录音带；盒式录像带Handler[‘hændlə]n. (物品、商品)的操作者Scribe [skraib] n . 抄写员, 抄书吏Street n. 大街, 街道Blade [bleid] n. 刀口, 刀刃,刀片Cut [kʌt] vt. & vi. 切, 剪, 割, 削Speed[spi:d]n. 速度, 速率Spindle [‘spindl]n. 主轴， (机器的)轴Size [saiz]n. 大小, 尺寸 ,尺码Cooling ['ku:liŋ]adj. 冷却(的)Kerf [kə:f]n. 锯痕,截口,切口Width [widθ]n . 宽度, 阔度, 广度Chip [tʃip] n. 碎片、缺口Chipping[‘tʃipiŋ]n. 碎屑,破片Crack[kræk]vt . (使…)开裂,破裂n . 裂缝, 缝隙Missing [‘misiŋ] adj. 失掉的,失踪的,找不到的Die [dai]vt. & vi. 死亡（芯片）Saw [sɔ:] n. 锯vt. & vi. 锯，往复运动Street [stri:t]n. 大街, 街道Film [film]n. 影片, 电影（薄膜，蓝膜）Frame [freim] n. 框架，骨架，构架Tape [teip]n. 带子；录音磁带; 录像带Bubble ['bʌbl] n. 泡, 水泡, 气泡mount---贴wafer---晶圆 frame---框架blade---刀片tape---膜 cassette---盒子completion---完成loader---上料un-loader---出料initial---初始化 open---打开air---空气pressure---压力 failure---失败vacuum---真空alignment---校准ink---黑点die---芯片 error---错误limit---限制cover---盖子 device---产品 data---数据 saw---切割water---水elevator---升降机spindle---主轴sensor---感应器wheel---轮子setup---测高 rotary---旋转check---检查feed---进给 cutter---切割 speed---速度height---高度new---新shift---轮班 pause---暂停 clean---清洗center---中心 chip---崩边 change---变换enter---确认Off center---偏离中心 broken---破的 alarm---报警上芯：Attach [ə‘tætʃ]vt. & vi. 贴上; 系; 附上Bond [bɔnd]n. 连接, 接合, 结合vt. 使粘结, 使结合Bonder [‘bɔndə]n. 联接器,接合器,粘合器Die attach material epoxy粘片胶Epoxy [e‘pɔksi] n. 环氧树脂（导电胶）Material [mə‘tiəriəl]n. 材料, 原料Non-conductive epoxy绝缘胶Conductive [kən‘dʌktiv] adj. 传导的Dispenser [di s‘pensə]n. 配药师, 药剂师Nozzle [‘nɔzl]n. 管嘴, 喷嘴Rubber [‘rʌbə]n. (合成)橡胶，橡皮Tip [tip] n. 尖端, 末端Die pick-up tool 吸嘴Tool [tu:l]n. 工具, 用具Collect [kə‘lekt]vt. 收集, 采集（吸嘴）Ejector [i‘dʒektə]n. 驱逐者,放出器,排出器Pin [pin]n. 针,大头针, 别针Lead Frame引线框架Lead [li:d]vt. & vi. 带路, 领路, 指引Frame [freim]n. 框架，骨架，构架Magazine [,mæɡə‘zi:n]n. 杂志, 期刊（料盒）Curing [‘kjuəriŋ]n. 塑化, 固化, 硫化, 硬化Oven [‘ʌvən]n. 烤箱, 炉Scrap [skræp] n. 小片, 碎片, 碎屑Dent [dent] n. 凹痕, 凹坑Die Lift-off 晶粒脱落（芯片脱落，掉芯）Skew [skju:] adj. 歪, 偏, 斜Misorientation [mis,ɔ:rien‘teiʃən] n. 定向误差,取向误差Pre squeeze del写胶前气压延时Post squeeze del 写胶后气压延时Squeeze [skwi:z] vt. 榨取, 挤出n. 挤, 榨, 捏Eject [i‘dʒekt]vt. & vi . 弹出, 喷出, 排出Delay [di'lei]n. 延迟Height [hait] n. 高度, 身高Level [‘levl]n. 水平线, 水平面; 水平高度Head [hed]n. 头部，领导, 首脑Eject up delay 顶针延迟Eject up heigh t 顶针高度Bond level粘片高度Pick Level 捡拾芯片高度Head pick delay 粘接头拾取延迟Head bond delay 粘接头粘接延时Pick delay捡拾芯片延时Bond delay 粘接芯片延时Index [‘indeks]n. 索引;标志, 象征; 量度Clamp [klæmp]vt. & vi. 夹紧; 夹住n. 夹具Index clamp delay 步进夹转换延时Index delay 框架步进延时Shear [ʃiə] vt. 剪羊毛, 剪n. 大剪刀Test [test] n. 测验,化验,试验, 检验Die shear test 推晶试验Thickness ['θiknis]n. 厚(度), 粗Coverage [‘kʌvəridʒ] n. 覆盖范围Epoxy thickness & coverage 导电胶厚度和覆盖率Orientation[,ɔ:rien‘teiʃən] n. 方向, 目标Die Orientation 芯片方向Void [vɔid] adj. 空的, 空虚的n. 太空, 宇宙空间;空隙, 空处; 空虚感, 失落感Epoxy void 导电胶空洞Chip [tʃip] n. 碎片Damage[‘dæmidʒ] vt. & vi. 损害, 毁坏, 加害于n. 损失, 损害, 损毁Chip damage芯片损伤Backside [‘bæksaid]n. 臀部, 屁股，背面Chip backside damage 芯片背面损伤Tilt [tilt] vt. & vi. (使)倾斜Tilted die 芯片歪斜Epoxy on die 芯片粘胶Crack [kræk] vt. & vi. (使…)开裂, 破裂n. 裂缝, 缝隙Crack die 芯片裂缝/芯片裂痕Lift [lift]vt. & vi. 举起, 抬起n. 抬, 举Lifted die翘芯片Misplace [,mis‘pleis]vt. 把…放错位置Misplaced die 设置芯片NO die on L/F 空粘Insufficient [,ɪnsə‘fiʃənt] adj. 不足的, 不够的Insufficient epoxy 导电胶不足Epoxy crack 导电胶多胶Epoxy curing银浆烘烤Edge [edʒ] n. 边, 棱, 边缘Partial [‘pɑ:ʃəl]adj. 部分的, 不完全的Mirror [‘mirə] n. 镜子Missing [‘misiŋ]adj. 失掉的,失踪的,找不到的Edge die / partial die边缘片 / 边沿芯片Mirror die光片 / 镜子芯片Missing die 掉芯 / 漏芯 / 掉片Splash [splæʃ]vt. 使(液体)溅起vi.(液体)溅落Splatter [‘splætə] vt. & vi. (使某物)溅泼Diagram [‘daiəɡræm] n. 图解, 简图, 图表Ink splash / ink splatter墨溅Die bonding diagram 上芯图Die shesr test 推片实验/推晶试验Die shear tester 推片试验机Die shesr tool 推片头Metal corrosion晶粒腐蚀/芯片腐蚀Wafer mapping system 芯片分级系统System ['sistəm] n. 系统; 体系wafer---晶圆die---芯片 attach---粘贴 glue---银胶substrate---基板 magazine---盒子inspection---检查parameter---参数manual---操作手册 reset---重设 enter---确定 error---错误input---输入speed---速度stop---停止 pressure---压力vacuum---真空 sensor---传感器 back side---背面 pin---针statistics---统计 calibration---校正 bond---贴片conversion---改机thickness---厚度 tilt---倾斜度 shape---形状 adjust---调整contact---接触 cover---覆盖 device---产品 chip---崩边pause---暂停elevator---升降机 initial---初始化 alignment---校准cassette---盒子tape---膜 frame---框架 ring---铁圈temperature---温度rubber tip---吸嘴frame type---框架型号nozzle---点胶头 writer---划胶头压焊：Wire [‘waiə] n. 金属丝, 金属线;电线, 导线Bond [bɔnd] n. 接合, 结合vt. 使粘结, 使结合Wire bond / Wiring bonding 压焊/焊丝/球焊Gold wire金丝Pad [pæd] vt. 给…装衬垫, 加垫子n.垫,护垫Bond pad 焊点、铝垫1st bond第一焊点Pad size焊点尺寸 / 铝垫尺寸Capillary [kə‘piləri] n.毛细管;毛细血管（劈刀）Pitch [pitʃ] 程度; 强度; 高度Pad pitch铝垫间距 / 焊点间距Elongation [i:lɔŋ‘ɡeiʃən] n.延长;延长线;延伸率Breaking [‘breikiŋ]n. 破坏,阻断Load [ləud] n. 负荷; 负担;工作量, 负荷量Breaking Load 破断力Pull [pul]vt. & vi.拉, 扯, 拔Shear [ʃiə] vt. 剪羊毛, 剪n. 大剪刀Wire pull / ball pull（焊丝）拉力Wire shear / ball shear（焊丝）推力Ultrasonic [,ʌltrə‘sɔnik] adj. (声波)超声的Power [‘pauə]n. 功力, 动力, 功率Force [fɔ:s]n. 力; 力量; 力气Ultrasonic power超声功率Bonding force压力Bonding time时间Temperature [‘tempəritʃə] n. 温度, 气温Bonding temperature 温度Ultrasonic wire bonding 超声波压焊EFO打火烧球loop [lu:p]n. 圈, 环, 环状物Loop height 孤高Wire pull test 拉力试验Ball shear test 金球推力试验PIN 1 第一脚Ball height 球高Ball diameter球径Cratering [‘kreitəriŋ]n. 缩孔;陷穴（弹坑）KOH etching test KOH腐蚀试验Bond Cratering test 压焊腐蚀试验(弹坑试验) Thermal [‘θə:məl] adj. 热的，热量的Compression [kəm‘preʃən] n. 挤压, 压缩TCB（ Thermal Compression Bond）热压焊Bonding Diagram 压焊图 / 布线图Wrong Bonding 布线错误Incomplete[,ɪnkəm‘pli:t]adj.不完全的,未完成的Incomplete bond 焊不牢No bonding 无焊N2 BOX 氮气柜RTPC 实时过程监控Tray [trei] n. 盘子, 托盘Handing Tray 产品盘FBI 压焊后目检FBI insp-M/C 压焊检验机Microscope [‘maikrəskəup] n. 显微镜Low Power Microscope 低倍显微镜Flux [flʌks] n. 熔剂、焊剂；助熔剂，助焊剂Hook [huk] vt. & vi. 钩住, 吊住, 挂住Wire pull hook线钩（测拉力）Ball shear tool 推球头（测推力）Metal [‘metl]n. 金属Discolor [dis‘kʌlə]v.使脱色;(使)变色,(使)褪色Oxide [‘ɔksaid]n. 氧化物Metal Discolor铝条变色Bond Pad Discolor 铝垫变色Bond Pad Oxide铝垫氧化Stick [stik] vt. & vi. 粘贴, 张贴Peeling [‘pi:liŋ] n. 剥皮,剥下的皮Cratering [‘kreitəriŋ]n. 缩孔;陷穴（弹坑）Nonstick bond on pad 铝垫不粘Bond pad peeling 铝垫脱落Bond pad cratering铝垫弹坑Limit [‘limit]vt. 限制; 限定Scratch [skrætʃ] vt. & vi. 抓, 搔，刮伤Over rework limit超过返工数Bond remove / scratch 剔球划伤Ball bond non-stick金球脱落Ball to large （small）金球过大（小）Ball bond short 金球短路Non-stick on lead 引脚脱落（鱼尾脱落）misplace [,mis‘pleis]vt. 把…放错位置connection [kə‘nekʃən]n. 连接, 联结Misplaced bond on LD压焊打偏Wire broken断线Missing wire漏打Wrong connection 错打defective [di‘fektiv]adj. 有缺陷的，欠缺的Defective looping弧度不良Sagging [‘sæɡiŋ]n. 下垂[沉,陷],松垂,垂度Loop sagging 弧度下陷Low loop 弧度太低High loop弧度太高Loop short 弧度短路Overhang [,əuvə‘hæŋ]vt. 伸出; 悬挂于…之上Residue [‘rezidju:]n. 剩余, 余渣Distortion [dis‘tɔ:ʃən] n. 歪曲,曲解Wire overhang on LD 跨越引线框架Wire residue 残丝LF distortion 引线框架变形Quantity [‘kwɔntiti]n. 数目, 数量Mismatch [‘mis’mætʃ] vt. 使配错,使配合不当Scrap [skræp] n. 废料vt. 废弃, 丢弃Scratch [skrætʃ] vt. 刮伤Quantity Mismatch 数量不符Empty M. not scrap空粘未报废Gold Wire Scratch 金丝受损Parameter---参数Statistics---统计Utility---应用Teach---教习Bond tip offset—焊线点纠偏 Contact search---接触测高Zoom off center---放大倍数偏心校准Calibration---校准BQM---焊接质量控制PR—patterrecognition—图像识别Alignment tolerance—对点偏差PR indexing—图像控制下的步进Capillary---焊线劈刀 Wire spool—送线卷轴Window clamp—窗口夹板Transducer—功率换能器FTN---功能键Wire threading—送线器EFO ---电子打火Linear power ---线性马达Vacuum sensor---真空感应器 Step driver—步进驱动Post bond inspection—焊接后检查 Wire pull—拉线Ball shape—推球 Ball size—焊球大小Ball thickness—焊球高度 Loop height—线弧高度Loop shape—线弧形状Neck crack—线颈折损 Fine adjust–精确调整Conversion–换产品 1st bond non stick—第一点不粘2nd bond non stick—第二点不粘 peeling---拔铝垫（扯皮）Bond off---脱焊Ball deformation—焊球变形 servo motor—伺服电机 weld off---管脚脱焊 crater---裂缝 gold wire---金线missing ball---球未烧好 weak bond---虚焊塑封：Mold [məuld] n. 模子,铸型vt. 浇铸,塑造Molding [‘məuldiŋ]n. 成型（塑封）Compound [‘kɔmpaund] n.复合物, 化合物Moiding M/C；Mold Press塑封机Press [pres] n. 印刷机Heater [‘hi:tə] n. 加热器; 炉子Pre-heater 预热机Chase [tʃeis]n.追捕, 追猎Mold die / Mold chase 塑封模具MGP mold MGP多缸模具Auto mold 自动包封机load [ləud]vt. & vi. 1 把…装上车[船] 2 装…loader ['ləudə] n. 装货的人,装货设备,装弹机Auto L / F loader自动排片机handler [‘hændlə] n. (动物)驯化者（抓手）temperature [‘tempəritʃə]n. 温度, 气温Pre-heat Temperature 料饼预热温度Mold Temperature 模具温度Clamp [klæmp] vt. & vi. 夹紧; 夹住n. 夹具Pressure [‘preʃə] n. 压(力), 压强Clamp Pressure 合模压强Transfer pressure 注塑压强Transfer [træns‘fə:]vt. & vi. 转移; 迁移n. 转移Curing [‘kjuəriŋ]n. 塑化, 固化, 硫化, 硬化Curing time 固化时间Curing temperature 固化温度Pre-heat Time （料饼）预热时间Transfer speed注塑速度Transfer time注塑时间PMC time (Post Mold Cure Time)后固化时间Load / unload上料/下料Sweep [swi:p] vt. & vi. 扫, 打扫, 拂去Wire Sweep 冲丝Open 开路Short 短路Fill [fil] vt. & vi. (使)充满, (使)装满, 填满Underfill ['ʌndəfil] n. (孔型)未充满Body underfilled胶体未灌满Incomplete [,ɪnkəm‘pli:t] adj. 不完全的, 未完成的Incomplete mold 未封满Chip [tʃip] n. 碎片，缺口Chip package / body chip-out崩角Porosity [pɔ:‘rɔsiti] n. 多孔性,有孔性Porosity Body 胶体麻点Bubble [‘bʌbl] n.泡, 水泡, 气泡Blister [‘blistə] n. 气泡vt. & vi. (使)起水泡Smear [smiə] vt.弄脏, 弄污n. 污迹, 污斑Surface [‘sə:fis] n. 面, 表面Roough surface 不均匀（表面）Delaminate [di:‘læməneit] v. 将…分层,分成细层Delaminating 分层Void [vɔid]adj. 空的, 空虚的PKG Void 胶体空洞Deep [di:p] adj. 深的Scratch [skrætʃ] vt. 刮伤Body deep scratch胶体刮痕Dimension [di‘menʃən] n.尺寸, 度量Mold PKG dimension 塑封体尺寸BTM width / length 背面宽 / 长Top width / length 正面宽 / 长PKG thick 塑封体厚度Mismatch [‘mis’mætʃ] vt. 使配错,使配合不当Mold mismatch / PKG mismatch 包封偏差(胶体错位) Of fset [‘ɔfset] vt. 抵消, 补偿Misalignment [‘misəlainmənt] n. 未对准Mold offset / PKG misalignment偏心PMC（post mold cure）后固化Dummy [‘dʌmi] n. 人体模型Strip [strip] vt.剥去, 剥夺, 夺走Dummy molded strip空封Mold flash 废胶Gate [ɡeit]n.门, 栅栏门Mold gate 注浇口、进浇口Remain [ri‘mein]n. 剩余物; 残余Gate remain 小脚Compound [‘kɔmpaund] n.复合物, 化合物Aging [‘eidʒiŋ]n. 老化,成熟的过程Compound Aging 料饼醒料（回温过程）Locator [ləu‘keitə]n. 表示位置之物,土地Block [blɔk] n.大块(木料、石料、金属、冰等) Locator Block 定位块Ejector [i‘dʒektə] n. 驱逐者,放出器Pin [pin]n. 大头针, 别针，针Depth [depθ]n.深, 深度Ejector Pin 顶针E-pin Depth顶针深度Storage [‘stɔ:ridʒ] n.储藏处, 仓库Cold room / compound storage冷藏库/料饼存放库Air [ɛə] n. 空气Gun [ɡʌn]n. 枪, 炮Coating [‘kəutiŋ]n. 涂层, 覆盖层Material [mə‘tiəriəl]n. 材料, 原料,素材, 资料Air Gun气枪Die Coating芯片涂胶Auto die coating M/C 芯片涂胶机Die Coating Material覆晶胶Cart [kɑ:t]n. 手推车ASS’YB Cart 后站推车Tablet [‘tæblit]n. 药片、胶囊Loader [‘ləudə] n. 装货的人,装货设备,装弹机Preheater [‘pri:’hi:tə] n. 预热器Fixture [‘fikstʃə] n. (房屋等的)固定装置Auto Tablet Loader 自动排胶粒机Compoud Preheater 高频预热机Load /Unload Fixture 上料/下料架Tablet Magazine 胶粒盒Compoud Tablets 塑封料饼Molding Cleaning Compoud 洗模饼misorientation [mis,ɔ:rien‘teiʃən]n. 定向误差,取向误差PKG Misorientation胶体压反Mold flash on lead 塑封溢胶Mold crack 胶体裂痕Semiconductor---半导体Molding–模封Onload---上料Offload–出料Belt—皮带Preheater turntable –预热转盘Transfer---传送Safety Door---安全门Pick and place–机械手Motor---马达 Station–模腔Cleaning brush—清洁刷Cylinder---气缸 Sensor---传感器Solenoid---电磁阀Turn over –翻转器 Degate–切料口 Bearing---轴承Picker---爪子 Pusher–推动器 Cull bin –垃圾箱Pin---针Vacuum pump—真空泵 Mornitor–显示器Cable–导线 Profile---温度曲线 Alarm---报警Error---错误 Driver---驱动 Sensor–感应器Inspection---检查Parameter---参数 Manual---手动,手册Reset---复位 Initialing---初始化 Guide–导轨Substrate---基板 Device---产品种类 Lot Traveller---随工单Magazine---盒子 Cylinder –汽缸 Bearing–轴承Stop---停止Emergency Stop---紧急停止 Gripper --夹子Heat–加热器Pipe–管子Temperature---温度Hopper–漏斗Compress air–压缩空气Over flow—反面漏胶Semiconductor---半导体 Molding –模封Operation–操作Flange–法兰盘 Pump–泵Chamber–腔体Vent–气孔Value–值Alarm---报警Error---错误 Inspection---检查 Parameter---参数 Manual---手动,手册Reset---复位Initialing---初始化Incomplete fill模封不全inching ---扭曲Overflow---漏胶Misalignment---模封错位 Package mismatch---模封错位Resin Hole / Void ---气孔Foreign materials ---外来物Wire sweep---线弯曲Rough surface---表面粗糙Wrong Orientation---模封方向反Eng. Sample---工程师样品Stain/Dirty on package---表面脏污Resin burr---树脂有毛刺Resin flashes---毛刺Damage frameFRAME--- 损坏Scratch on package---树脂表面划伤Evaluation----评估Crack package---树脂开裂 SPC sample ---SPC样品切筋 Trim-Form1 切筋Trimming Dambar cut2 切筋模 Trim die3 成形模Form die4 分离模singulate5 冲废De-junk6 检测Inspection 外观检测7 再成型机模具Reform Die8 再成型机 Reform system9 料盘 Plastic tray10 连筋 Uncut dambar11 毛刺burr14 溢料Junk15 裂纹Crack16 离层（分层） Delaminating17 管脚反翘 Lead tip bend18 筋未切 Dam-bar uncut19 筋凸出 Dam-bar protrusion20 筋切入Dam-bar cut in打印 Marking1 打印Marking2 印章 Marking layout3 激光打印 Laser marking4 油墨打印 Ink (UV) marking5 正印 Top side mark6 背印 Back side mark7 镜头 Lens8 打印不良\模糊 Illegible marking9 漏打 No marking10 断字 Broken character11 缺字 Missing character12 印字倾斜 Slant marking13 印记错误 Wrong marking14 重印 Remark15 印字模糊（褪色）Fade mark16 印字粘污 Smear19 电流current21 字体（字形） Font22 定位针 Location pin23 胶皮打印机 Pad printer24 激光打印机 Laser Marking M/C25 后固化 PMC(Post Mold Cure)26 后固化烤箱 PMC Oven27 打印污斑 Marking stain28 印记移位Marking shift电镀 Plating1 电镀 Plating2 来料Incoming3 冲废 Dejunk4 热煮软化槽 Socking Tank7 检验 Inspection 外观检测8 烘烤 Curing / Baking 150℃; 60-90ms9 出料 Unload10 高速线电镀 High-speed Plating Line11 统计过程控制 SPC12 搭锡 Solder bridge13 锡丝、锡须Solder flick / Whisker14 镀层不良 Plating defects15 发黄 Yellowish16 发黑 Blacken17 变色 Discolor18 露底材（露铜） Expose copper19 粘污 Smear20 镀层厚度 Plating thickness 7-20um21 镀层成分 Plating composition 电镀成分, Sn22 外观 Outgoing23 易焊性Solder ability24 无铅化 Pb-free / lead free25 结合力 Adhesive force26 可靠性Reliability27 电解Electrolytic deflash28 清洗（自来水）City water29 高压清洗 High pressure rinse30 脱脂 Descale31 清洗（纯水） DI water32 活化（合金） Activation33 预镀、预浸 Pre-dip34 电镀Plating35 吹风 Air blow36 中和Neutralization37 褪镀Stripper38 拖出 Drag out39 上料机 Loader40 下料机 Unloader41 纯锡Tin42 纯水(去离子水) DI water43 水压Water pressure44 理化分析Physical and chemical analysis45 测厚仪Plating Thickness Meter / Electroplated CoatingThickness Test46 离子污染度测试仪 Ion Contamination Tester Contamino CT10047 C含量测试仪Carbon Tester51 去氧化HSCU Descale52 预浸 Pre-dip53 电镀电流 Current54 镀液温度 Temperature电镀液 plating solution55 电镀槽 plating tank56 中和Neutralization59 烘干 Curing60 锡球 Solder ball61 锡厚度和成分 Sn thickness & composition62 冲废De-junk去胶渣63 去溢料 Degate 冲塑，冲胶64 去飞边 Deflash 去胶(塑封工序)65 锡铅电镀 Tin lead plating66 无铅电镀 Lead free plating; Pure tin plating67 镀层起泡Solder bump68 镀层剥落 Solder peel off69 镀层偏厚或偏薄 Thick or Thin Plating70 退锡 Solder remove71 电镀报废Plating scrap72 锡渣 Solder peeling73 电镀锡块Solder bump74 电镀桥接Plating bridge75 电镀变色SP Discoloration76 电镀污染 SP Contamination77 电镀锡攀爬SP adhere 78 电解除油Electro-degreasing 测试 Testing1 测试 Testing2 打印 Laser mark3 编带机 Tape & Reel Machine4 编带 Reel5 测试机 Tester6 分选机 Tray Test Handler7 Vision检测 Direction vision8 划伤 Scratch9 打错 Wrong mark10 断字 Broken character11 漏字No marking12 模糊 Fade mark13 脚长Lead length14 脚宽 Lead width15 站立度 Stand up16 脚间距 Lead pitch17 共面性 Coplanarity18 跨度 Row space19 电性能测试 Electrical test20 塑料管 Plastic tube21 编带 Reel / Tape22 托盘，盘装 Tray23 扫描测脚 Leads Scan/Inspection24 扫描测脚机Leads scanner25 投影仪 Profile Projector测试 TestingLaser 激光Lamp 灯管Lamp current 灯管电流Marking layout打印内容Power supply 电源Frequency 频率On-loader 上料部分Off-loader 下料部分Marking box 打印区域Track 轨道Location pin 定位针Scanner 扫描器Beam 光束Beam path 光路Bar code 条形码Sensor 传感器Motor 马达Driver 驱动器Index 步进Tool 模具Press 模具Punch 刀具Jam 卡料Forming 成型Cylinder气缸Laser head 光头Magazine 盒子Tube 管子Tray 板子Arm 机械臂Safety door 安全门Reset 复位Lamp 灯管Keyboard 键盘Alarm 报警Error 错误Open/Short(O/S) 开路／短路Function Reject 功能失效Parameter Reject参数失效Retention Reject保持力失效Icc Reject 电流失效Test Program 测试程序Cold test冷测Retest 重新测试Rework 返工Sample 抽样Resample 重新抽样Black box盛放未测试产品的黑盒子Testing area 测试区域Test chuck 测试平台Device Interface Board(DIB) 芯片测试接口板DUT 正在测试芯片A/D (analog-to-digital) converter 模/数转换模块EOT 测试结束信号SOT测试开始信号BIN signal 分BIN 信号Socket 测试座JIG/Test Head 测试盒/测试头Interface Card 接口通讯卡Interface Cable 接口通讯线Coaxial Cable 同轴线Test parameter 测试参数Tester Computer 测试机主机Test limit 测试结果的上下限AC Multiplexer 多路交流信号板Digital Driver and Detector 数字输入/输出装置Dual Voltage/Current Source双路电压/电流源Station Monitor显示测试结果的窗口Checker 检测程序High-Speed Digital (HSD) Instrument 高速数字测试设备High-Current-Voltage-Source 高电流电压源Finger 金手指Contactor 金手指动作模块Convey motor 变送马达Contact side 测试位置General Control Panel 总控制面板Ionizer 离子风扇Capacitor box 电容盒。
外贸英语函电之咨询、旬盘及回复(英文版)PPT(共33页)
full range of sample sample book
全套样品
样品册
注意：在表示“……的样品”时，常接介词of或for
2.price 1）n.价格
a. Business is possible if you can raise(lift, improve) the price by 5%. 如你方出价能提高5%，可能成交。
If you cannot arrange entire quantity, please offer us at least half.
如果你方办不到全数，请至少报给我们半数
关于数量的表述：
1.追加数量
2.相应的数量
additional quantity corresponding quantity
2）discount v. 贴现，打折扣 Bills can be easily discounted in London.
汇票在伦敦贴现毫无困难。
If you can discount your price by 10%, we are ready to take 300 bales. 如果你方价格能予以九折处理，我方乐于接受300包。
4) 分期付款 instalment payment
5.(a) under separate cover =by separate post =by separate mail 另封，另邮寄
We are mailing you, under separate cover, photographs of the ordered goods. 我们另寄你所订货的照片。 (b) under cover=herewith 随函
Could you accept delivery in July or September? May I draw your attention to item 14?
英文询价信的写法及参考用语
A Letter of Enquiry (询价信)⼀般询价信写四或五段，1) Source of information 2) Reason for Enquiry 3) Asking for price, list, and catalogue 4) Giving references 5) Further Business1) Opening SentencesWe were given your name by....You have been recommended to us by....Your articles have been recommended to us by.......has been kind enough to give us your address.As we have learned from..., your are manufactures of ....We saw your ad in the current issue of....We have heard that you have put a new ...on the market.We visited your stand at the ...exhibition.We refer to your special offer of....We have seen your ad in ...and we are interested in....Your firm has been recommended to us by ....,with whom we have done business for many years.2) Reasons for EnquiryWe are a subsidiary of....We are a pany based in....We are interested in....We need /are in the market for....We have received many enquiries from our customers for....Our stocks of ...are running low.We would like to expand our range of....We have a considerable demand here for....3) Asking for PriceI should be grateful if you send me....Please send your current/latest catalogue/price list/brochure.We would like you to send us some samples/patterns.Please send us full details about your products.Please quote your prices for these articles/goods/products.Kindly quote us your lowest prices for....Please quote your best/most competitive/lowest price.Please quote your price gross/net/FOB(离岸价).We would like to know if you are prepared to grant discounts.We are desirous of having your lowest price for....Please let us know the minimum quantity for a trial/order.We should appreciate further details/information about your....We shall be glad to receive an offer from you on....Please send further details/information abut your....Please include information about packing and shipping.We should like to know your earliest date of delivery.What would be your earliest delivery date?Please let us know on what term you can give us some discount.Will you let us know what discount you give for large quantities?4) Giving ReferencesInformation about our company can be got from...For information about our company please refer to/contact....Should you wish to make any enquiries about us, please write to ....We shall be pleased to provide the usual trade references.Please let us know your terms of business.Please let us know if you can supply from stack.Please offer quantities which can be supplied from stock.Will you please let us have a list of items imported by you?In order to make us familiarized with your products, we shall appreciate your giving us the technical details of them.5) Further BusinessIf the goods come up to our expectations, we would expect to be place regular order.If the samples meet with our approval we intend to place substantial orders.If your prices are competitive and your goods up to standard, we shall order on a regular basis.If you can let us have a competitive quotation, we trust business will result...。
询价函英文模板
询价函英文模板以下是一份通用的询价函英文模板，您可以根据具体情况进行修改和定制。
[Your Company Name][Your Address][City, State, Zip Code][Email Address][Phone Number][Date][Recipient's Name][Recipient's Title][Recipient's Company Name][Recipient's Address][City, State, Zip Code]Dear [Recipient's Name],Subject: Inquiry Regarding [Product/Service Name]I hope this letter finds you well. We are interested in obtaining more information about the [Product/Service Name] offered by [Recipient's Company Name]. After researching the market, we are impressed by your company's reputation for providing high-quality [Product/Service Type].We would appreciate it if you could provide us with the following information:1. Detailed product specifications, including sizes, colors, and materials used.2. Pricing information for different quantities or packages.3. Delivery lead times and shipping options.4. Minimum order quantities (if applicable).5. Any available customization options.6. Terms of payment and payment methods accepted.7. Warranty or guarantee details, if applicable.8. Any relevant certifications or quality assurance standards.9. References or case studies showcasing your product's performance.Kindly send us a formal quotation for the above-mentioned details at your earliest convenience. If you have a product catalog or brochure, we would greatly appreciate receiving a copy for our review.Please address the quotation to [Your Name] at [Your Email Address], and feel free to contact us if you require any further clarification or additional information.Thank you for your prompt attention to this matter. We are looking forward to the possibility of establishing a mutually beneficial business relationship with your esteemed company.Sincerely,[Your Name][Your Title][Your Company Name][Email Address][Phone Number]请注意，上述模板仅供参考。
1X0068 服装 加工指示书
TO（致）:安徽怡蔓服饰有限公司FROM（自）: 上海纽圣ATTN（收件人）: 陆总/小叶DATE（日期）: 11年3月29日加工指示书(210-1X0068) 1）品名: 人棉印花裙，100%RAYON2）识别代码：（洗标和价格牌上）702217743）件数：3385件4）溢短装：美国订单+5%；小国家严格按照数量5）配比：S/M/L=2/2/16）缝制要求：1英寸13针.7）单耗：1.45 M/件，8）尺寸及推挡表：见后附.9）辅料的装订方法：见后附10）包装方法：见后附..11）交期：进舱时间2011年4月20日12）测试样：一个颜色一件，另一个颜色两件，M码，请于4月8出13）船样：每色S码各三件，M码各两件，.请于4月8前寄出（请将面料水洗柔软后再做）13) 检验:大货预约检验时,必须保证所有大货已装好纸箱.尺寸推档表特别注意：1）抽橡筋线的时候要注意针距和注意针的型号，千万不要产生针孔破洞和抽丝2）抽橡筋线一定要注意抽好的尺寸，必须做好整烫缩率测试，做好毛样板和净样板，把所有抽好橡筋的裁片修好片再装腰；千万要避免乱码3）抽橡筋要用配色橡筋线，每条橡筋线之间的间距均匀，要用专车做4）下摆均卷边0.6CM，要均匀圆顺，不要有宽窄，不要拉大了5）针距1英寸13针，底面线要松紧适度，不能起皱，能用进口9号针最好6）所有缝1CM，三线拷边，拷边要细密均匀7）裙子下摆要平直，注意侧缝不要拉得太长了8）注意袖笼的尺寸千万不要拉大了，左右必须对称9）成衣包装前，请注意调好前中的皱量，前中上衣高7”,肩带处11”10）正确的前领圈形状11)腰部带子要打好蝴蝶结，一周为18”;领圈也要打好蝴蝶结包装:一. 纸箱上下各垫一个三层的硬纸板,尺寸要同纸箱.(纸箱要求用三棱七层的硬纸板制成，无钉)二. 纸箱的上下及四周要用封箱袋封口,然后在正面用三条平行的打包袋封箱.三. 整箱的用黑色胶带封箱，不是整箱的用绿色胶带封箱， QC检验后必须用原来的正确胶带颜色重新封箱，不能用透明胶带四. 纸箱前后均要印刷主唛头，两侧印刷侧唛，所有面均要印刷”HANDLE WITH CARE”主唛：参考内容美国代码 0006 用黑色封箱带中国代码0006 用黑色封箱带日本代码 0016 用紫色封箱带加拿大代码 0017 用粉色封箱带HANDLE WITH CARE0006CARTON# : OFP.O. : 10072881小国家（10072882）ITEMCODE : 70221774STYLE : 210-1X0068COLOR: BLACK/RUST MAGENTA/PURPLESIZE : S M LCOUNT : 2 2 1TOTAL PACK#TOTAL Q'TY PCSMADE IN CHINA纸箱的正面，侧面，和上面五个面必须印上数字混色混码印2000独色混码印3000请在侧唛毛净重和“HANDLE WITH CARE”之间留出15CM高X 10CM宽的位置贴条形码小贴纸，我们会做好寄到工厂顶上必须印上Q’TY_______M.B.______B.B.______L.______INSPECTED BY:______两个侧面必须印上净重，毛重和箱子尺寸NET WT.:GROSS WT.:CARTON DIMENSION :小塑料袋:正面:需要刷制STYLE#.: 210-1X0068SIZE:反面:需要刷制”警告标语”,内容如下:WARNING!!KEEP THIS BAG AWAY FROM BABIES AND CHILDREN, DO NOT USE IN CRIBS, CARRIAGES, OR PLAY PENS. THE THIN FILM MA Y CLING TO MOUTH AND NOSE AND PREVENT BREATHING.THIS BAG IS NOT A TOY!中胶袋：正面需要印制但是颜色应该为BLACK/RUST和MAGENTA/PURPLE E配比为2 2 1反面需要印警告语同上大胶袋:正面需要印制但是颜色应该为BLACK/RUST和MAGENTA/PURPLE配比为2 2 1反面需要印警告语同上防水袋上也需要警告语。
Samples_of_commercial_letters_
Offer （报盘）
Counter offer（还盘）
Stock Phrases for Counter Offer
我们的条件是10日内付款为2％的折扣，30日内 付款无折扣。 Our terms are 2% discount ten days, thirty days net. 我公司仅限于对从发票开出之日起10日内付现金 者给予折扣优待。 We only allow a cash discount on payments made within ten days of date of invoice.
请告知以现金支付的优惠条款和折扣比例。 Please state your best terms and discount for cash. 由于打折扣，请告知最好的装货条件。 Please put us on your very best shipping terms as regards discount.
驻贵地的中国领事向我们介绍，你公司 是……生产……（商品）的大出口商。 Your name has been recommended to us by the Chinese Consul stationed in your city as large exporters of …goods produced in….
Inquiring （询盘）
Stock Phrases for Inquiring
敬请将贵公司的进口商品目录寄来为荷。 Will you please let us have a list of items that are imported by you. 惠寄报价单和样品可否？请酌。 Would you care to send us some sample with the quotations?