74HC3G04GD,125,74HC3G04DP,125,74HC3G04DC,125,74HCT3G04DC,125, 规格书,Datasheet 资料

1.General descriptionThe 74HC3G04 and 74HCT3G04 are high-speed Si-gate CMOS devices. They provide three inverting buffers.The HC device has CMOS input switching levels and supply voltage range 2 V to 6 V .The HCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V .2.FeaturesI Wide supply voltage range from 2.0 V to 6.0V I Symmetrical output impedance I High noise immunity I Low power dissipationI Balanced propagation delays I Multiple package options IESD protection:N HBM JESD22-A114E exceeds 2000V N MM JESD22-A115-A exceeds 200VI Specified from −40°C to +85°C and −40°C to +125°C3.Ordering information74HC3G04; 74HCT3G04InverterRev. 03 — 2 July 2008Product data sheetTable 1.Ordering informationType numberPackageTemperature range NameDescriptionVersion 74HC3G04DP −40°C to +125°CTSSOP8plastic thin shrink small outline package; 8 leads;body width 3 mm; lead length 0.5 mmSOT505-274HCT3G04DP 74HC3G04DC −40°C to +125°CVSSOP8plastic very thin shrink small outline package;8leads;body width 2.3 mmSOT765-174HCT3G04DC 74HC3G04GD −40°C to +125°CXSON8Uplastic extremely thin small outline package;no leads;8terminals; UTLP based; body 3× 2× 0.5 mmSOT996-274HCT3G04GD4.Marking5.Functional diagram6.Pinning information6.1PinningTable 2.Marking codesType number Marking code 74HC3G04DP H0474HCT3G04DP T0474HC3G04DC H0474HCT3G04DC T0474HC3G04GD H0474HCT3G04GDT04Fig 1.Logic symbol Fig 2.IEC logic symbol Fig 3.Logic diagram (one gate)mna7201A 1Y 172A 2Y 353A3Y62711153mna721126mna110AYFig 4.Pin configuration SOT505-2 (TSSOP8) and SOT765-1 (VSSOP8)Fig 5.Pin configuration SOT996-2 (XSON8U)74HC3G0474HCT3G041A V CC 3Y 1Y 2A 3A GND2Y001aai25712346587001aai25874HC3G0474HCT3G04Transparent top view876512341A3Y2A GNDV CC 1Y 3A 2Y6.2Pin descriptionTable 3.Pin descriptionSymbol Pin Description1A, 2A, 3A1, 3, 6data inputGND4ground (0 V)1Y, 2Y, 3Y7, 5, 2data outputV CC8supply voltage7.Functional descriptionTable 4.Function table[1]Input OutputnA nYL HH L[1]H = HIGH voltage level; L = LOW voltage level.8.Limiting valuesTable 5.Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Max Unit V CC supply voltage−0.5+7.0VI IK input clamping current V I<−0.5V or V I>V CC+ 0.5V[1]-±20mA I OK output clamping current V O<−0.5V or V O>V CC+ 0.5V[1]-±20mA I O output current V O=−0.5V to(V CC+0.5V)[1]-25mA I CC supply current[1]-50mA I GND ground current[1]−50-mA T stg storage temperature−65+150°C P D dynamic power dissipation T amb =−40°C to+125°C[2]-300mW[1]The input and output voltage ratings may be exceeded if the input and output current ratings are observed.[2]For TSSOP8 package: above 55°C the value of P tot derates linearly with 2.5 mW/K.For VSSOP8 package: above 110°C the value of P tot derates linearly with 8 mW/K.For XSON8 package: above 45°C the value of P tot derates linearly with 2.4 mW/K.9.Recommended operating conditions10.Static characteristicsTable 6.Recommended operating conditions Voltages are referenced to GND (ground = 0 V).Symbol Parameter Conditions74HC3G0474HCT3G04UnitMin Typ Max Min Typ Max V CC supply voltage 2.0 5.0 6.0 4.5 5.0 5.5V V I input voltage 0-V CC 0-V CC V V O output voltage 0-V CC 0-V CC V T amb ambient temperature −40+25+125−40+25+125°C ∆t/∆Vinput transition rise and fall rateV CC = 2.0 V --625---ns/V V CC = 4.5 V - 1.67139- 1.67139ns/V V CC = 6.0 V --83---ns/V Table 7.Static characteristicsVoltages are referenced to GND (ground = 0 V). All typical values are measured at T amb =25°C.Symbol Parameter Conditions25°C −40°C to +85°C −40°C to +125°C Unit MinTypMaxMinMaxMinMax74HC3G04V IHHIGH-level input voltageV CC = 2.0 V 1.5 1.2- 1.5- 1.5-V V CC = 4.5 V 3.15 2.4- 3.15- 3.15-V V CC = 6.0 V4.2 3.2- 4.2- 4.2-V V ILLOW-level input voltageV CC = 2.0 V -0.80.5-0.5-0.5V V CC = 4.5 V - 2.1 1.35- 1.35- 1.35V V CC = 6.0 V- 2.8 1.8- 1.8- 1.8V V OHHIGH-level output voltage V I = V IH or V IL I O =−20µA; V CC =2.0V1.92.0- 1.9- 1.9-V I O =−20µA; V CC =4.5V 4.4 4.5- 4.4- 4.4-V I O =−20µA; V CC =6.0V 5.9 6.0- 5.9- 5.9-V I O =−4.0mA; V CC =4.5V 4.18 4.32- 4.13-3.7-V I O =−5.2mA; V CC =6.0V5.63 5.81- 5.63- 5.2-V V OLLOW-level output voltage V I = V IH or V IL I O = 20µA; V CC =2.0V-00.1-0.1-0.1V I O = 20µA; V CC =4.5V -00.1-0.1-0.1V I O = 20µA; V CC =6.0V -00.1-0.1-0.1V I O = 4.0mA; V CC =4.5V -0.150.26-0.33-0.4V I O = 5.2mA; V CC =6.0V-0.160.26-0.33-0.4V I I input leakage currentV I =V CC or GND; V CC =6.0V--±0.1-±1.0-±1.0µA I CCsupply current per input pin; V CC =6.0V;V I =V CC or GND; I O =0A;-- 1.0-10-20µA11.Dynamic characteristicsC Iinputcapacitance - 1.5-----pF74HCT3G04V IH HIGH-level input voltage V CC = 4.5 V to 5.5 V 2.0 1.6- 2.0- 2.0-V V IL LOW-level input voltageV CC = 4.5 V to 5.5 V - 1.20.8-0.8-0.8VV OHHIGH-level output voltage V I = V IH or V IL I O =−20µA; V CC =4.5V4.4 4.5- 4.4- 4.4-V I O =−4.0mA; V CC =4.5V4.18 4.32- 4.13- 3.7-V V OLLOW-level output voltage V I = V IH or V IL I O = 20µA; V CC =4.5V-00.1-0.1-0.1V I O = 4.0mA; V CC =4.5V-0.150.26-0.33-0.4V I I input leakage currentV I =V CC or GND; V CC =5.5V--±0.1-±1.0-±1.0µA I CC supply current per input pin; V CC =5.5V;V I =V CC or GND; I O =0A;-- 1.0-10-20µA ∆I CCadditional supply current per input;V CC =4.5V to 5.5V;V I =V CC −2.1V; I O =0A --300-375-410µAC Iinputcapacitance- 1.5-----pFTable 7.Static characteristics …continuedVoltages are referenced to GND (ground = 0 V). All typical values are measured at T amb =25°C.Symbol Parameter Conditions25°C −40°C to +85°C −40°C to +125°C Unit Min Typ Max Min Max Min Max Table 8.Dynamic characteristicsVoltages are referenced to GND (ground =0V); all typical values are measured at T amb =25°C; for test circuit see Figure 7.Symbol Parameter Conditions25°C −40°C to +85°C −40°C to +125°C Unit MinTypMaxMinMaxMinMax74HC3G04t pdpropagation delay nA to nY; see Figure 6[1]V CC = 2.0 V-2275-90-110ns V CC = 4.5 V -815-18-22ns V CC = 6.0 V-613-16-20ns t ttransition timesee Figure 6[2]V CC = 2.0 V -1875-95-125ns V CC = 4.5 V -615-19-25ns V CC = 6.0 V-513-16-20ns C PDpower dissipation capacitanceV I =GND to V CC [3]-9-----pF[1]t pd is the same as t PLH and t PHL .[2]t t is the same as t TLH and t THL .[3]C PD is used to determine the dynamic power dissipation (P D in µW).P D = C PD × V CC 2× f i × N +Σ(C L × V CC 2× f o ) where:f i = input frequency in MHz;f o = output frequency in MHz;C L = output load capacitance in pF;V CC = supply voltage in V;N = number of inputs switching;Σ(C L × V CC 2× f o ) = sum of outputs.12.Waveforms74HCT3G04t pd propagation delay nA to nY; see Figure 6[1]V CC = 4.5 V -1018-23-29ns t t transition timeV CC = 4.5 V; see Figure 6[2]-615-19-22ns C PDpower dissipation capacitanceV I =GND to V CC −1.5V [3]-9-----pFTable 8.Dynamic characteristics …continuedVoltages are referenced to GND (ground =0V); all typical values are measured at T amb =25°C; for test circuit see Figure 7.Symbol Parameter Conditions25°C −40°C to +85°C −40°C to +125°C Unit MinTypMaxMinMaxMinMaxMeasurement points are given in Table 9.Logic levels: V OL and V OH are typical output voltage levels that occur with the output load.Fig 6.The data input (nA) to output (nY) propagation delays mna722t PLHt PHLV MV M90 %10 %V M V MnY outputnA inputV IGNDV OHV OLt TLHt THLTable 9.Measurement pointsTypeInput Output V M V M 74HC3G040.5× V CC 0.5× V CC 74HCT3G041.3 V1.3 VTest data is given in T able 10.Definitions for test circuit:R T = Termination resistance should be equal to output impedance Z o of the pulse generator.C L = Load capacitance including jig and probe capacitance.R L = Load resistance.S1 = Test selection switch.Fig 7.Load circuit for measuring switching times V M V Mt Wt W10 %90 %0 VV IV I negative pulsepositive pulse0 VV MV M 90 %10 %t ft r t rt f 001aad983DUTV CCV CCV IV OR TR LS1C LopenGTable 10.Test dataTypeInput Load S1 position V It r , t f C L R L t PHL , t PLH 74HC3G04V CC ≤ 6ns 50 pF 1k Ωopen 74HCT3G043V≤ 6ns50 pF1k Ωopen13.Package outlineFig 8.Package outline SOT505-2 (TSSOP8)UNIT A 1A max.A 2A 3b p L H E L p w y v c e D (1)E (1)Z (1)θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTIONISSUE DATE IECJEDEC JEITAmm0.150.000.950.750.380.220.180.083.12.93.12.90.654.13.90.700.358°0°0.130.10.20.5DIMENSIONS (mm are the original dimensions)Note1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.0.470.33SOT505-2- - -02-01-16w Mb pD Ze0.251485θA 2A 1L p (A 3)detail XALH EE cv M AXAy2.5 5 mm0scaleTSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mmSOT505-21.1pin 1 indexFig 9.Package outline SOT765-1 (VSSOP8)UNIT A 1A max.A 2A 3b p L H E L p w y v c e D (1)E (2)Z (1)θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTIONISSUE DATE IECJEDEC JEITAmm0.150.000.850.600.270.170.230.082.11.92.42.20.53.23.00.40.18°0°0.130.10.20.4DIMENSIONS (mm are the original dimensions)Notes1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.0.400.15Q 0.210.19SOT765-1MO-18702-06-07w Mb pD Ze0.121485θA 2A 1QL p(A 3)detail XALH EE cv M AXAy2.5 5 mm0scaleVSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm SOT765-11pin 1 indexFig 10.Package outline SOT996-2 (XSON8U)REFERENCESOUTLINE VERSION EUROPEAN PROJECTIONISSUE DATE IEC JEDECJEITA SOT996-2- - -- - -SOT996-207-12-1807-12-21UNIT A max mm0.50.050.000.350.153.12.90.51.50.50.30.60.40.10.05A 1DIMENSIONS (mm are the original dimensions)XSON8U: plastic extremely thin small outline package; no leads;8 terminals; UTLP based; body 3 x 2 x 0.5 mm01 2 mmscaleb D 2.11.9E e e 1L L 10.150.05L 2v w 0.05y y 10.1CyCy 1Xb1485e 1e A C B v M CwM L 2L 1Lterminal 1index areaB AD E detail XAA 114.Abbreviations15.Revision historyTable 11.AbbreviationsAcronym DescriptionCMOS Complementary Metal-Oxide Semiconductor DUT Device Under T est ESD ElectroStatic Discharge HBM Human Body Model MM Machine ModelTTLT ransistor-T ransistor LogicTable 12.Revision historyDocument ID Release date Data sheet status Change notice Supersedes 74HC_HCT3G04_320080702Product data sheet-74HC_HCT3G04_2Modifications:•The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors.•Legal texts have been adapted to the new company name where appropriate.•Added type number 74HC3G04GD and 74HCT3G04GD (XSON8U package).74HC_HCT3G04_220031030Product specification -74HC_HCT3G04_174HC_HCT3G04_120020726Product specification--16.Legal information16.1Data sheet status[1]Please consult the most recently issued document before initiating or completing a design.[2]The term ‘short data sheet’ is explained in section “Definitions”.[3]The product status of device(s)described in this document may have changed since this document was published and may differ in case of multiple devices.The latest product status information is available on the Internet at URL .16.2DefinitionsDraft —The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness ofinformation included herein and shall have no liability for the consequences of use of such information.Short data sheet —A short data sheet is an extract from a full data sheet with the same product type number(s)and title.A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.16.3DisclaimersGeneral —Information in this document is believed to be accurate andreliable.However,NXP Semiconductors does not give any representations or warranties,expressed or implied,as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.Right to make changes —NXP Semiconductors reserves the right to make changes to information published in this document, including withoutlimitation specifications and product descriptions, at any time and without notice.This document supersedes and replaces all information supplied prior to the publication hereof.Suitability for use —NXP Semiconductors products are not designed,authorized or warranted to be suitable for use in medical, military, aircraft,space or life support equipment, nor in applications where failure ormalfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmentaldamage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.Applications —Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.Limiting values —Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134)may cause permanent damage to the device.Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in theCharacteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.Terms and conditions of sale —NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale,as published at /profile/terms , including those pertaining to warranty,intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail.No offer to sell or license —Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant,conveyance or implication of any license under any copyrights,patents or other industrial or intellectual property rights.16.4TrademarksNotice:All referenced brands,product names,service names and trademarks are the property of their respective owners.17.Contact informationFor more information, please visit:For sales office addresses, please send an email to:salesaddresses@Document status [1][2]Product status [3]DefinitionObjective [short] data sheet Development This document contains data from the objective specification for product development.Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.Product [short] data sheetProductionThis document contains the product specification.18.Contents1General description. . . . . . . . . . . . . . . . . . . . . . 12Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Ordering information. . . . . . . . . . . . . . . . . . . . . 14Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25Functional diagram . . . . . . . . . . . . . . . . . . . . . . 26Pinning information. . . . . . . . . . . . . . . . . . . . . . 26.1Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26.2Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 37Functional description . . . . . . . . . . . . . . . . . . . 38Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 39Recommended operating conditions. . . . . . . . 410Static characteristics. . . . . . . . . . . . . . . . . . . . . 411Dynamic characteristics . . . . . . . . . . . . . . . . . . 512Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 613Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 814Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 1115Revision history. . . . . . . . . . . . . . . . . . . . . . . . 1116Legal information. . . . . . . . . . . . . . . . . . . . . . . 1216.1Data sheet status . . . . . . . . . . . . . . . . . . . . . . 1216.2Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1216.3Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 1216.4T rademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 1217Contact information. . . . . . . . . . . . . . . . . . . . . 1218Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Please be aware that important notices concerning this document and the product(s)described herein, have been included in section ‘Legal information’.© NXP B.V.2008.All rights reserved.For more information, please visit: For sales office addresses, please send an email to: salesaddresses@Date of release: 2 July 2008。