DT-2RV22-A7;中文规格书,Datasheet资料
TMDSDCDCLEDKIT;中文规格书,Datasheet资料
Quick Start GuideSPRUGV0–May2010 TMS320C2000™DC/DC LED Lighting Developer's KitQuick Start GuideThis document provides instructions to run a GUI that controls the DC/DC LED Lighting Developer’s Kit board using the Piccolo F28035microcontroller.Contents of the DC/DC LED Lighting Developer’s Kit include:•DC/DC LED Lighting power board•Piccolo F28035controlCARD.•LED panel•12V power adapter•Banana Plug Cable•USB Cable•USB drive with GUI executable•CCS4Installation CDFeatures of the DC/DC LED Lighting Developer’s Kit include:•Independent closed-loop brightness control of eight LED strings(six strings included with kit)with PWM dimming•Closed-loop voltage control of the LED bus using a shared SEPIC stage•On-board isolated JTAG emulation•Over-current and over-voltage protection for the SEPIC stage using the F28x trip-zone(TZ)submodule •UART communication available for host-control•Hardware Developer’s Package is available and includes schematics,bill of materials,Gerber files,etc. 1OverviewThe DC/DC LED Lighting Developer’s Kit uses a12to36V DC input.This voltage is then regulated to a different level by a SEPIC converter.SEPIC,as a buck-boost topology,is able to increase or decrease the input voltage.For our application,we will be setting the SEPIC output voltage to approximately20V,independent of the board input.The SEPIC output is then connected to each of the LED strings.To1 SPRUGV0–May2010TMS320C2000™DC/DC LED Lighting Developer's Kit Quick Start GuideDC12-Overview perform independent LED string dimming,a MOSFET is placed in series with each string,and the on-time of this string’s MOSFET will control the average current through an LED string.Since the brightness of an LED is roughly proportional to the LED current,we use the duty cycle of each string’s PWM to control the average current drawn.The figure below illustrates the hardware that is present on the DC/DC LEDLighting Developer’s Kit.A typical power conversion board is made up of several power stages.On the Lighting_DCDC board,each of these power stages takes the form of a macro section.Each of these macro sections is bounded by its own silkscreen area.Below is a list of all the macro blocks’names and a short description of theirfunctions.Refer to the image on the next page for placement of macro areas.Lighting_DCDC Main Board -Consists of a controlCARD socket,a few communications jumpers,[Main]and the routing of signals between the controlCARD and the macroblocks.This section includes all of the area outside of the macroblocks.DC-PwrEntry Macro –[M1]Generates the 15V,5V,and 3.3V DC rails from a 12V supplyincluded with the kit or an external DC power supply.Isolated-USB-to-JTAG Macro –Provides on-board isolated JTAG connection through USB to the[M2]host.It is also used to provide isolated SCI (UART)communicationfor connection with the GUI.SEPIC-LV Macro –[M3]A SEPIC DC/DC conversion stage,used to increase or decrease theinput voltage to the voltage needed by the LED strings.LED-dimming Macro –[M4]-[M7]Stages used to individually dim an LED string.Each macro consistsof the components needed to control two strings.In this guide,each component is named first with its macro number,followed by the reference name.For example,[M2]-J1would refer to the jumper J1located in the macro M2,and [Main]-J1would refer to theJ1located on the board outside of the other defined macro blocks.2TMS320C2000™DC/DC LED Lighting Developer's Kit Quick Start GuideSPRUGV0–May 2010[Main]-J6EmulationEnable/DisableJumper [Main]-BS2Sepic Out Connector[M1]-JP1 12V Input Connector[M1]-J1JP1=DcBusEnable/Disable [M1]-TB1External DCSupply (not used)[M1]-SW1Main PowerSwitch [M2]-JP1 USBEmulatorConnector [Main]-BS3LED Bus ConnectorM7M6M5M4M2 Quick Start GUI 2Quick Start GUIThis kit comes with a GUI which provides a convenient way to evaluate the functionality of this kit and the F28035device,without having to learn and configure the underlying project software or install CodeComposer Studio™.The interactive interface using sliders,buttons,and text boxes,allows LED lighting with the C2000device to be demonstrated quickly and easily.2.1Hardware SetupListed below are some of the major connectors and features of the DC/DC LED Lighting board.Step 1.On the Piccolo F28035controlCARD,check the following switches:•SW1,make sure this switch is in the “OFF”(down)position •SW2,make sure position 1and 2are both in the “ON”(up)position Step 2.Put a F28035control card into the socket on the LED Lighting board,and connect a cablefrom the USB connector on the board to the computer.[M2]-LD1,near the LED Lightingboard’s USB connector,should turn on.3SPRUGV0–May 2010TMS320C2000™DC/DC LED Lighting Developer's Kit Quick Start GuideQuick Start GUI On the next screen select“Install from specific location”Click next and the drivers will be installed.The driver install screen will appearthree times,repeat this procedure each time.Step3.Connect the LED panel to the LED Lighting board via[Main]-TB1to TB8.Step4.Connect of verify the following:•Connect a jumper on[M1]-J1•Connect a jumper on[M2]-J4•Remove any jumpers placed on[Main]-J6Step5.Connect the banana-to-banana plug wire that came with the kit between the SEPIC-out Connector(BS2)and the LED Bus connector(BS3).Step6.Place[M1]-SW2into the"OFF"position.This switch will not be used in this demonstration.Step7.Connect a12V power supply to power up to[M1]-JP1of the board.Turn[M1]-SW1to the "ON"position.When on,[M1]-LD1and[M1]-LD2should turn on.2.2Software SetupThe GUI used to conveniently evaluate the kit can be found on the USB drive that is included with this kit.It is named Lighting_DCDC.exe.This.exe contains all the software necessary to do a quick evaluation of this kit.To explore deeper,the underlying reference software can be found as a Code Composer Studio project within controlSUITE.NOTE:The GUI requires framework3.0to run.Please ensure that this software isinstalled prior to running this program.•To install the CCS4project built to run with this kit,use the most up-to-date software,and find all reference software for the C2000MCU.Please install controlSUITE which can be downloaded at:/controlSUITE•Once controlSUITE is installed,the GUI mentioned in this guide can be found at the following location:c controlSUITE/development_kits/Lighting_DCDC_vX.X/~GUI/Lighting_DCDC.exe4TMS320C2000™DC/DC LED Lighting Developer's Kit Quick Start Guide SPRUGV0–May2010 Quick Start GUI •The source code for this GUI was written in C#using Microsoft Visual and can be found at:controlSUITE/development_kits/Lighting_DCDC_vX.X/~GUI/~Source/•The kit ships with a F28035controlCARD that has been pre-flashed with the code that enables it to run with the GUI that comes with this kit.If for any reason,the software needs to be reflashed so that itworks with the GUI again,this flash image can be found at:controlSUITE/development_kits/Lighting_DCDC_vX.X/~GUI/Lighting_DCDC-FlashImage_v1.0.out •The underlying Code Composer Studio4project documentation and how to run guide can be found at: controlSUITE/development_kits/Lighting_DCDC_vX.X/Lighting_DCDC/~Docs/Lighting_DCDC.pdf2.3Running the GUIThe following steps will allow you to run the GUI:1.Browse to and double-click on Lighting_DCDC.exe.If this is the first time that the GUI is run,the GUIwill ask the user to read a license agreement.Assuming that the license is accepted,the image belowwill be seen:2.Click“Setup Connection”on the GUI and ensure the Baud Rate is set to57600and that the“Boot onConnect”box is unchecked.3.Next you will need to select your serial comport.This can be found by going to:Control Panel->System->Hardware tab->Device Manager->Ports(COM&LPT)Look for the comport that is named“USB Serial Port”or similar,then select this comport in the“SetupConnection”window.4.Click“OK.”This will close the“Setup Connection”window.5.Turn on the board by switching[M1]-SW1to the“ON”position.6.On the Main Window,click“Connect.”When connected,the status bar at the bottom left of the GUIshould say“Connected.”5 SPRUGV0–May2010TMS320C2000™DC/DC LED Lighting Developer's Kit Quick Start GuideReferences 7.Move the“Sepic Output”slider to approximately20V.This sets the reference to which the controllerwill try to regulate the output of the Sepic.8.Change the value of LED string1’s target current to0.04A.Note that the“LED String1Current”rampsuntil it reaches approximately0.04A.9.Edit the other strings’target currents as desired.Note that the average LED current draw isproportional to LED lumen output for most high brightness LEDs.Therefore,in this program,thebrightness of the LEDs is being controlled.NOTE:Near the bottom of the GUI there is a checkbox control named“Merge LED controls.”Thiscontrol enables/disables individual control of each LED string and has the controller try andoutput the same current for each string.This reference is set by a slider.NOTE:There will be some variation from LED to LED from0.0to approximately0.02A.This isbecause the LEDs used are not guaranteed,from the manufacturer,to be identical until theLED current is greater than0.05A.10.When finished,set the“Sepic Output”to0V then click“Disconnect.”11.Power off the board by switching[M1]-SW1to the"OFF"position.3ReferencesFor more information,please see the following guides:•Lighting_DCDC–provides detailed information on the CCS4Lighting_DCDC project within an easy to use lab-style format.C:\TI\controlSUITE\development_kits\Lighting_DCDC_vX.X\Lighting_DCDC\~Docs\Lighting_DCDC.pdf •Lighting_DCDC-HWdevPkg–a folder containing various files related to the hardware on the Motor Control and PFC Developer’s Kit board(schematics,bill of materials,Gerber files,PCB layout,etc).C:\TI\controlSUITE\development_kits\Lighting_DCDC_vX.X\~Lighting_DCDC-HwdevPkg\•Lighting_DCDC-HWGuide–presents full documentation on the hardware found on the Lighting_DCDC board.C:\TI\controlSUITE\development_kits\Lighting_DCDC_vX.X\~Docs\Lighting_DCDC-HWGuide.pdf6TMS320C2000™DC/DC LED Lighting Developer's Kit Quick Start Guide SPRUGV0–May2010IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDLP®Products Communications and /communicationsTelecomDSP Computers and /computersPeripheralsClocks and Timers /clocks Consumer Electronics /consumer-appsInterface Energy /energyLogic Industrial /industrialPower Mgmt Medical /medicalMicrocontrollers Security /securityRFID Space,Avionics&/space-avionics-defenseDefenseRF/IF and ZigBee®Solutions /lprf Video and Imaging /videoWireless /wireless-appsMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2010,Texas Instruments Incorporated分销商库存信息: TI TMDSDCDCLEDKIT。
RE22R2AMR产品数据手册说明书
RE22R2AMR.T h e i n f o r m a t i o n p r o v i d e d i n t h i s d o c u m e n t a t i o n c o n t a i n s g e n e r a l d e s c r i p t i o n s a n d /o r t e c h n i c a l c h a r a c t e r i s t i c s o f t h e p e r f o r m a n c e o f t h e p r o d u c t s c o n t a i n e d h e r e i n .T h i s d o c u m e n t a t i o n i s n o t i n t e n d e d a s a s u b s t i t u t e f o r a n d i s n o t t o b e u s e d f o r d e t e r m i n i n g s u i t a b i l i t y o r r e l i a b i l i t y o f t h e s e p r o d u c t s f o r s p e c i f i c u s e r a p p l i c a t i o n s .I t i s t h e d u t y o f a n y s u c h u s e r o r i n t e g r a t o r t o p e r f o r m t h e a p p r o p r i a t e a n d c o m p l e t e r i s k a n a l y s i s , e v a l u a t i o n a n d t e s t i n g o f t h e p r o d u c t s w i t h r e s p e c t t o t h e r e l e v a n t s p e c i f i c a p p l i c a t i o n o r u s e t h e r e o f .N e i t h e r S c h n e i d e r E l e c t r i c I n d u s t r i e s S A S n o r a n y o f i t s a f f i l i a t e s o r s u b s i d i a r i e s s h a l l b e r e s p o n s i b l e o r l i a b l e f o r m i s u s e o f t h e i n f o r m a t i o n c o n t a i n e d h e r e i n .Product data sheetCharacteristicsRE22R2AMROn-delay Timing Relay - 0.05s…300h - 24…240V AC/DC - 2C/OMainRange of product Zelio TimeProduct or component typeModular timing relay Discrete output type Relay Device short name RE22Nominal output current8 AComplementaryContacts type and composition 1 C/O timed or instantaneous contact, cadmium free 1 C/O timed contact, cadmium free Time delay type A AwTime delay range0.3...3 s 1...10 s 0.05...1 s 3...30 s 10...100 s 30...300 s 3...30 min 30...300 min 3...30 h 30...300 hControl typeExternal potentiometer Diagnostic button Rotary knob[Us] rated supply voltage 24...240 V AC/DC at 50/60 Hz Release input voltage <= 2.4 V Voltage range 0.85...1.1 Us Supply frequency 50...60 Hz (+/- 5 %)Connections - terminalsScrew terminals : 2 x 0.2...2 x 1.5 mm², AWG 24...AWG 16 flexible cable with ca-ble endScrew terminals : 1 x 0.2...1 x 2.5 mm², AWG 24...AWG 14 flexible cable with ca-ble endScrew terminals : 2 x 0.5...2 x 2.5 mm², AWG 20...AWG 14 solid cable without cable endScrew terminals : 1 x 0.5...1 x 3.3 mm², AWG 20...AWG 12 solid cable without cable endTightening torque 0.6...1 N.m conforming to IEC 60947-1Housing material Self-extinguishingRepeat accuracy +/- 0.5 % conforming to IEC 61812-1Temperature drift +/- 0.05 %/°C Voltage drift+/- 0.2 %/VSetting accuracy of time delay +/- 10 % of full scale at 25 °C conforming to IEC 61812-1Control signal pulse width 30 ms100 ms (with load in parallel)Insulation resistance 100 MOhm at 500 V DC conforming to IEC 60664-1Recovery time120 ms (on de-energisation)Immunity to microbreaks <= 10 ms Power consumption in VA3 VA at 240 V ACPower consumption in W 1.5 W at 240 V DCSwitching capacity in VA2000 VAMinimum switching current10 mA 5 V DCMaximum switching current8 AMaximum switching voltage250 V ACElectrical durability100000 cycles for 2 A at 24 V DC-1100000 cycles for 8 A at 250 V AC-1Mechanical durability10000000 cyclesRated impulse withstand voltage 5 kV for 1.2...50 µs conforming to IEC 60664-1Power on delay< 100 msCreepage distance 4 kV/3 conforming to IEC 60664-1Overvoltage category III conforming to IEC 60664-1Mounting position Any positionMounting support35 mm DIN rail conforming to EN/IEC 60715Status LED Yellow LED (slow flashing) for timing in progress and output relay energisedYellow LED (fast flashing) for timing in progress and output relay de-energisedYellow LED (steady) for output relay energisedGreen LED backlight (steady) for dial pointer indicationProduct weight0.105 kgEnvironmentDielectric strength 2.5 kV for 1 mA/1 minute at 50 Hz between relay output and power supply withbasic insulation conforming to IEC 61812-1Standards IEC 61812-1UL 508Directives2004/108/EC - electromagnetic compatibility2006/95/EC - low voltage directiveProduct certifications CCCCECSAGLULRCMEACChina RoHSAmbient air temperature for operation-20...60 °CAmbient air temperature for storage-40...70 °CIP degree of protection IP50 (front panel) conforming to IEC 60529IP20 (terminals) conforming to IEC 60529IP40 (housing) conforming to IEC 60529Pollution degree 3 conforming to IEC 60664-1Vibration resistance20 m/s² (f = 10...150 Hz) conforming to IEC 60068-2-6Shock resistance 5 gn (in operation) (duration = 11 ms) conforming to IEC 60068-2-2715 gn (not operating) (duration = 11 ms) conforming to IEC 60068-2-27 Relative humidity95 % at 25...55 °CElectromagnetic compatibility Immunity to microbreaks and voltage drops (test level: 100 % - 20 ms) conform-ing to IEC 61000-4-11Immunity to microbreaks and voltage drops (test level: 30 % - 500 ms) conform-ing to IEC 61000-4-11Fast transient bursts (test level: 2 kV, level 3 - direct contact) conforming to IEC61000-4-4Conducted RF disturbances (test level: 10 V, level 3 - 0.15...80 MHz) conformingto IEC 61000-4-6Radiated radio-frequency electromagnetic field immunity test (test level: 10 V/m,level 3 - 80 MHz...1 GHz) conforming to IEC 61000-4-3Electrostatic discharge (test level: 8 kV, level 3 - air discharge) conforming to IEC61000-4-2Electrostatic discharge (test level: 6 kV, level 3 - contact discharge) conforming toIEC 61000-4-2Surge immunity test (test level: 2 kV, level 3 - common mode) conforming to IEC61000-4-5Surge immunity test (test level: 1 kV, level 3 - differential mode) conforming toIEC 61000-4-5Fast transients immunity test (test level: 1 kV, level 3 - capacitive connecting clip)conforming to IEC 61000-4-4Product data sheetRE22R2AMR Dimensions DrawingsDimensionsProduct data sheetRE22R2AMR Connections and SchemaWiring DiagramProduct data sheetRE22R2AMRTechnical DescriptionFunction A: Power On-DelayDescriptionOn energisation of power supply, the timing period T starts. After timing, the output(s) R close(s).The second output (R2) can be either timed (when set to "TIMED") or instantaneous (when set to "INST").Function: 1 OutputFunction: 2 OutputsFunction Aw : Power On-Delay With Retrigger / Restart ControlDescriptionOn energisation of power supply, the timing period T starts.At the end of the timing period T, the output(s) R close(s).Energization of Y1 makes the output(s) R open(s).Deenergization of Y1 restarts timing period T.At the end of timing period T, the output(s) R close(s).The second output (R2) can be either timed (when set to "TIMED") or instantaneous (when set to "INST")Function: 1 OutputFunction: 2 OutputsLegendRelay de-energisedRelay energisedOutput openOutput closedUSupply-TTiming period-R1/2 timed outputsR2-R2The second output is instantaneous if the right position is selected inst.-Retrigger / Restart controlY1-RE22R2AMR.。
AM-22A(降低成本,直接替换VIPER22A)规格书
四川德阳恒大五金机电城24幢1-3号 邵先生：+8613981083365 周先生：+8613568225578 电话：+86(838) 2802321
AM-22A 高性能小功率离线式开关电源控制芯片
◆电气参数
项目 电源电压 Vcc 启动电压 关闭电压 电源电流 启动时间 Collector 保护电压 功率管耐压 功率管最大电流 峰值电流保护 掁荡频率 变频频率 抖频步进频率 温度保护 PWM 占空比 控制电压 Fb
计中设为 100V)
2.7、计算原边电感量 Lp
Lp
= Vs ×Ton Ip
= 110× 7.7 720
≈ 1.2mH
Lp …………………………..原边电感量
I p …………………………..原边峰值电流(芯片设定最大峰值电流 720mA)
四川德阳恒大五金机电城24幢1-3号 邵先生：+8613981083365 周先生：+8613568225578 电话：+86(838) 2802321
数量 1 1 4 1 1 1 1 1 1 1 1 1 1 1 1 1 1
备注
⒉ 变压器设计 (只作参考) 2.1、参数确定 变压器设计时，需要先确定一些参数如下： (1) 输入电压范围： AC85V~265V (2) 输出电压及电流：DC12V/1A (3) 开关频率：Freq=65Khz (4) 最大占空比：D=0.5 2.2、磁心的选择
AM-22A 高性能小功率离线式开关电源控制芯片
◆包装信息
1、芯片采用防静电管包装：
2、包装数量：
代 最小值 额定值 最大值
号
(mm)
(mm)
(mm)
A
FMB2222A;中文规格书,Datasheet资料
Thermal Characteristics
Symbol
PD RθJA
TA = 25°C unless otherwise noted
Characteristic
Total Device Dissipation Derate above 25°C Thermal Resistance, Junction to Ambient Effective 4 Die Each Die FFB2222A 300 2.4 415
*Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%
Spice Model
NPN (Is=14.34f Xti=3 Eg=1.11 Vaf=74.03 Bf=255.9 Ne=1.307 Ise=14.34f Ikf=.2847 Xtb=1.5 Br=6.092 Nc=2 Isc=0 Ikr=0 Rc=1 Cjc=7.306p Mjc=.3416 Vjc=.75 Fc=.5 Cje=22.01p Mje=.377 Vje=.75 Tr=46.91n Tf=411.1p Itf=.6 Vtf=1.7 Xtf=3 Rb=10)
300
VCE(sat) VBE(sat)
Collector-Emitter Saturation Voltage* Base-Emitter Saturation Voltage*
0.3 1.0 1.2 2.0
V V V V
SMALL SIGNAL CHARACTERISTICS
fT Cobo Cibo NF Current Gain - Bandwidth Product Output Capacitance Input Capacitance Noise Figure IC = 20 mA, VCE = 20 V, f = 100 MHz VCB = 10 V, IE = 0, f = 100 kHz VEB = 0.5 V, IC = 0, f = 100 kHz IC = 100 µA, VCE = 10 V, RS = 1.0 kΩ, f = 1.0 kHz 300 4.0 20 2.0 MHz pF pF dB
高温电子2导线22AWG（7x30）锡胶绞绞线FEP隔离综合规格说明书
Mechanical Characteristics
Temperature Operating
-70°C to +200°C
Bend Radius Stationary Min. Installation Min. 1.2 in (30 mm) 1.2 in (30 mm)
Max. Pull Tension: Bulk Cable Weight:
Product: 88761 Electronic, 2 C #22 Str TC, FEP Ins, OS, FEP Jkt, CMP
MMBT2222A;中文规格书,Datasheet资料
MMBT2222ASMALL SIGNAL NPN TRANSISTORPRELIMINARY DATAsSILICON EPITAXIAL PLANAR NPNTRANSISTORs MINIATURE SOT-23 PLASTIC PACKAGE FOR SURFACE MOUNTING CIRCUITS s TAPE & REEL PACKINGsTHE PNP COMPLEMENTARY TYPE IS MMBT2907AAPPLICATIONS s WELL SUITABLE FOR PORTABLE EQUIPMENTs SMALL LOAD SWITCH TRANSISTOR WITH HIGH GAIN AND LOW SATURATION VOLTAGEFebruary 2003ABSOLUTE MAXIMUM RATINGS®1/5e t e P r o d u c t (s ) - O b s o l e t e P r o d u c t (s ) -MMBT2222ATHERMAL DATAELECTRICAL CHARACTERISTICS (T case = 25 o C unless otherwise specified)Ob s o l e t e P r o d uc t (s ) - O b s o l e t e P r od u c t (s ) ELECTRICAL CHARACTERISTICS(Continued)MMBT2222AO b s o l e t e P r o d u c t (s ) - O b s o l e t e P r o d u c t (s )MMBT2222AOb s o l e t e P r o d uc t (s ) - O b s o l e t e P r od u c t (s ) Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.The ST logo is a trademark of STMicroelectronics© 2003 STMicroelectronics – Printed in Italy – All Rights ReservedSTMicroelectronics GROUP OF COMPANIESAustralia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States.MMBT2222AO b s o l e t e P r o d u c t (s ) - O b s o l e t e P r o d u c t (s )分销商库存信息: STMMMBT2222A。
74HC245DTR2G, 规格书,Datasheet 资料
74HC245Octal 3−State Noninverting Bus TransceiverHigh −Performance Silicon −Gate CMOSThe 74HC245 is identical in pinout to the LS245. The device inputs are compatible with standard CMOS outputs; with pull −up resistors,they are compatible with LSTTL outputs.The HC245 is a 3−state noninverting transceiver that is used for 2−way asynchronous communication between data buses. The device has an active −low Output Enable pin, which is used to place the I/O ports into high −impedance states. The Direction control determines whether data flows from A to B or from B to A.Features•Output Drive Capability: 15 LSTTL Loads•Outputs Directly Interface to CMOS, NMOS, and TTL •Operating V oltage Range: 2.0 to 6.0 V •Low Input Current: 1.0 m A•High Noise Immunity Characteristic of CMOS Devices•In Compliance with the Requirements Defined by JEDEC Standard No. 7A•ESD Performance: HBM > 2000 V; Machine Model > 200 V•Chip Complexity: 308 FETs or 77 Equivalent Gates •This is a Pb −Free Device120MARKING DIAGRAMSHC 245ALYW GGTSSOP −20DT SUFFIX CASE 948ESee detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.ORDERING INFORMATIONHC245= Device CodeA = Assembly Location L = Wafer Lot Y = YearW = Work WeekG = Pb −Free Package(Note: Microdot may be in either location)Figure 1. Pin Assignment A5A3A2A1DIRECTIONGNDA8A7A6A4B3B2B1OUTPUT ENABLE V CCB8B7B6B5B4A DATA PORTA8A7A6A5A3A4A2A1DIRECTION OUTPUT ENABLEPIN 10 = GND PIN 20 = V CCB1B2B3B4B5B6B7B8B DATA PORTFigure 2. Logic DiagramFUNCTION TABLEControl Inputs OperationOutput Enable DirectionL L Data Transmitted from Bus B to Bus A L H Data Transmitted from Bus A to Bus B H XBuses Isolated (High −Impedance State)X = don’t careORDERING INFORMATIONDevicePackage Shipping †74HC245DTR2GTSSOP −20*2500 / Tape & Reel†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.*This package is inherently Pb −Free.MAXIMUM RATINGS (Note 1)Symbol Parameter Value Unit V CC DC Supply Voltage*0.5 to )7.0V V IN DC Input Voltage*0.5 to V CC)0.5V V OUT DC Output Voltage(Note 2)*0.5 to V CC)0.5VI IK DC Input Diode Current$20mAI OK DC Output Diode Current$35mA I OUT DC Output Sink Current$35mAI CC DC Supply Current per Supply Pin$75mA I GND DC Ground Current per Ground Pin$75mA T STG Storage Temperature Range*65 to )150_C T L Lead Temperature, 1 mm from Case for 10 Seconds260_C T J Junction Temperature Under Bias)150_C q JA Thermal Resistance TSSOP128_C/W P D Power Dissipation in Still Air at 85_C TSSOP450mW MSL Moisture Sensitivity Level 1F R Flammability Rating Oxygen Index: 30% to 35%UL 94 V−0 @ 0.125 inV ESD ESD Withstand Voltage Human Body Model (Note 3)Machine Model (Note 4)u2000u200VI LATCHUP Latchup Performance Above V CC and Below GND at 85_C (Note 5)$300mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above theRecommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.1.Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 20 ounce copper trace with no air flow.2.I O absolute maximum rating must observed.3.Tested to EIA/JESD22−A114−A.4.Tested to EIA/JESD22−A115−A.5.Tested to EIA/JESD78.RECOMMENDED OPERATING CONDITIONSSymbol Parameter Min Max Unit V CC DC Supply Voltage (Referenced to GND) 2.0 6.0VV in, V out DC Input Voltage, Output Voltage (Referenced to GND)0V CC V T A Operating Temperature, All Package Types–55+125_Ct r, t f Input Rise and Fall Time V CC = 2.0 V (Figure 3)V CC = 4.5 VV CC = 6.0 V 01000500400nsDC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)Guaranteed LimitSymbol Parameter Test Conditions V CCV–55 to25_C v 85_C v 125_C UnitV IH Minimum High−Level Input Voltage V out = V CC – 0.1 V|I out| v 20 m A 2.03.04.56.01.52.13.154.21.52.13.154.21.52.13.154.2VV IL Maximum Low−Level Input Voltage V out = 0.1 V|I out| v 20 m A 2.03.04.56.00.50.91.351.80.50.91.351.80.50.91.351.8VV OH Minimum High−Level Output Voltage V in = V IH|I out| v 20 m A2.04.56.01.94.45.91.94.45.91.94.45.9VV in = V IH|I out| v 2.4 mA|I out| v 6.0 mA|I out| v 7.8 mA3.04.56.02.483.985.482.343.845.342.23.75.2V OL Maximum Low−Level Output Voltage V in = V IL|I out| v 20 m A2.04.56.00.10.10.10.10.10.10.10.10.1VV in = V IL|I out| v 2.4 mA|I out| v 6.0 mA|I out| v 7.8 mA3.04.56.00.260.260.260.330.330.330.40.40.4I in Maximum Input Leakage Current V in = V CC or GND 6.0±0.1±1.0±1.0m AI OZ Maximum Three−State LeakageCurrent Output in High−Impedance StateV in = V IL or V IHV out = V CC or GND6.0±0.5±5.0±10m AI CC Maximum Quiescent SupplyCurrent (per Package)V in = V CC or GNDI out = 0 m A6.0 4.04040m Armation on typical parametric values and high frequency or heavy load considerations can be found in the ON SemiconductorHigh−Speed CMOS Data Book (DL129/D).AC ELECTRICAL CHARACTERISTICS (C L = 50 pF, Input t r = t f = 6 ns)Symbol Parameter V CCVGuaranteed LimitUnit –55 to25_C v85_C v 125_Ct PLH, t PHL Maximum Propagation Delay,A to B,B to A(Figures 1 and 3)2.03.04.56.07555151395701916110802219nst PLZ, t PHZ Maximum Propagation Delay,Direction or Output Enable to A or B(Figures 2 and 4)2.03.04.56.011090221914011028241651303328nst PZL, t PZH Maximum Propagation Delay,Output Enable to A or B(Figures 2 and 4)2.03.04.56.011090221914011028241651303328nst TLH, t THL Maximum Output Transition Time,Any Output(Figures 1 and 3)2.03.04.56.0602312107527151390321815nsC in Maximum Input Capacitance (Pin 1 or Pin 19)−101010pFC out Maximum Three−State I/O Capacitance(I/O in High−Impedance State)−151515pF7.For propagation delays with loads other than 50 pF, and information on typical parametric values, see the ON Semiconductor High−SpeedCMOS Data Book (DL129/D).C PD Power Dissipation Capacitance (Per Transceiver Channel) (Note 8)Typical @ 25°C, V CC = 5.0 VpF40ed to determine the no−load dynamic power consumption: P D = C PD V CC f + I CC V CC. For load considerations, see the ONSemiconductor High−Speed CMOS Data Book (DL129/D).V CCGNDFigure 3. Switching Waveform OUTPUT ENABLE A OR B A OR BV CCGNDHIGHIMPEDANCEV OLV OHHIGHIMPEDANCEV CCGNDFigure 4. Switching WaveformDIRECTION*Includes all probe and jig capacitanceC L*TEST POINTFigure 5. Test Circuit*Includes all probe and jig capacitanceTEST POINTFigure 6. Test CircuitCONNECT TO V CC WHENTESTING t PLZ AND t PZL.CONNECT TO GND WHENTESTING t PHZ AND t PZH.A DATA PORTBDATAPORTB1B2B3B4B5B6B7B8Figure 7. Expanded Logic DiagramPACKAGE DIMENSIONSTSSOP −20CASE 948E −02ISSUE CDIM A MIN MAX MIN MAX INCHES 6.600.260MILLIMETERS B 4.30 4.500.1690.177C 1.200.047D 0.050.150.0020.006F 0.500.750.0200.030G 0.65 BSC 0.026 BSC H 0.270.370.0110.015J 0.090.200.0040.008J10.090.160.0040.006K 0.190.300.0070.012K10.190.250.0070.010L 6.40 BSC 0.252 BSCM0 8 0 8 ____NOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION:MILLIMETER.3.DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.4.DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.INTERLEAD FLASH OR PROTRUSIONSHALL NOT EXCEED 0.25 (0.010) PER SIDE.5.DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08(0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION.6.TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY .7.DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W −.6.400.252−−−−−−16X0.360.65PITCHSOLDERING FOOTPRINT**For additional information on our Pb −Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION。
T-BERD 2207用户指南说明书
198150-15217-01Rev. DT-BERD 2207USER’S GUIDEThis manual applies to all T-BERD 2207 software incorporating software level 3.x.JANUARY 2000Copyright ©1998 TTC®USA 1-800-638-2049 • +1-301-353-1550 • FAX +1-301-353-0234Canada 1-888-689-2165 • +1-905-507-4117 • FAX +1-905-507-4126SECTION 9 - SpecificationsGeneral SpecificationsSECTION 9 SPECIFICATIONS9.1GENERAL SPECIFICATIONS9.1.1Physical Characteristics:Height:7.5" (19 cm)Width:11.5" (29.2 cm)Depth: 2.25" (5.7 cm)Weight: 4.25 lb. (1.93 kg.)9.1.2Environmental Characteristics:Temperature:Operating:32°F to 122°F (0°C to +50°C)Non-Operating:-40°F to 167°F (-40°C to +75°C)Humidity:10% to 90% Relative Humidity, non-condensing9.1.3Electrical Characteristics:Battery Type:10.8 V Nickel-Metal Hydride (NiMH)Operating Time:Typically, up to three hours of continuous operation on a full chargeRecharging Period:Maximum of two hours from full dischargeAC Adaptor:120VAC to 18 VDC 1.2A9.2DS1 SPECIFICATIONS9.2.1Input Specifications9.2.1.1RX JackConnector Type:Bantam jackFrequency:1,544,000 Hz ±5000 HzUser’s Guide T-BERD 22079-1SECTION 9 - SpecificationsDS1 SpecificationsImpedanceBRIDGE:1000 ohms minimumTERM:100 ohms ±5%DSX-MON:100 ohms ±5%RangeBRIDGE:+6 to -35.0 dBdsxTERM:+6 to -35.0 dBdsxDSX-MON:+6 to -24.0 dBdsx of resistive los9.2.1.2Loop Codes Detection CriteriaIn-Band:At least 177 error-free bits of the selected repetitive pattern must be received(loop up or loop down).Out-of-Band:Datalink monitored every 125 ms for loop codes (loop up and loop down).9.2.1.3Pattern Synchronization Detection CriteriaFixed Patterns:30 consecutive error-free bitsPseudo-random:30 + n consecutive error-free bits for a pattern length of 2^n-19.2.2Output Specifications9.2.2.1TX JackConnector Type:Bantam jackLBO Level:Line build-out of 0, -7.5, -15.0, and -22.5 dB of cable loss at 772 HzLBO Tolerance:±2 dB at 772 kHzTiming:±7 ppm internal or recoveredLine Codes:AMI or B8ZSError Insert Type:Logic, BP V, or FramePulse Shape:With output terminated in 100 ohms resistive load and 0 dB line build-outselected, the T-BERD 2207 meets ITU-T Recommendation G.703; AT&TPublications CB113, CB119, CB132, CB143, and PUB62508; and AT&TPUB62411 pulse shape specifications.9-2T-BERD 2207User’s GuideSECTION 9 - SpecificationsDS1 Specifications 9.2.2.2Transmitted Loop CodesIn-BandCSU:Loop-up: 10000; Loop-down: 100Facility 1:Loop-up: 1100; Loop-down: 1110Facility 2:Loop-up: 11000; Loop-down: 11100Facility 3:Loop-up: 100000; Loop-down: 100Out-of-BandLine:Loop up: 1111 1111 0111 0000Loop down: 1111 1111 0001 1100Payload:Loop up: 1111 1111 0010 1000Loop down: 1111 1111 0100 1100Network:Loop up: 1111 1111 0100 1000Loop down: 1111 1111 0010 01009.2.3Measurement SpecificationsFrequencyRange:1,544,000 ±5000 HzAccuracy:± 7 ppmResolution: 1 HzReceived LevelRange:+6 dBdsx to -40 dBdsxAccuracy:±1.0 dB between +6 and -10 dBdsx±2.0 dB between -10 and -20 dBdsx±3.0 dB between -20 and -40 dBdsxResolution:0.1 dBVp-p Range:60 mV to 12.0 VVp-p Resolution:0.05 VSimplex CurrentRange:10 mA to 180 mAccuracy:±5%Resolution: 1 mASimplex path:13.2 ohms (nominal)User’s Guide T-BERD 22079-3SECTION 9 - SpecificationsDS1 Specifications9.2.4Alarm CriteriaSignal Loss:175 ±75 consecutive zerosFrame LossD4: 2 out of 5 Ft bits in errorESF: 2 out of 5 frame bits in errorSLC-96: 2 out of 5 Ft bits in errorPattern Loss:100 errors detected in 1000 or fewer bitsOnes DensityQRSS:Alarm is suppressed.Other Patterns:Received data contains less than n ones in 8(n+1) bits, where n=1 to 23.Excess ZeroAMI:16 or more consecutive zerosB8ZS:8 or more consecutive zerosYellow AlarmD4:Bit 2 is a 0 for 255 consecutive channels.ESF:256 bits ±16 bits of a repetitive (1111 1111 0000 0000) pattern received inthe 4 kb/s datalink.SLC-96:Bit 2 is a 0 for 255 consecutive channels.AIS:Unframed T1 signal has 2048 consecutive ones.Low Battery:Battery has less than 25% energy remaining.9-4T-BERD 2207User’s GuideSECTION 9 - Specifications DS3 Option SpecificationsUser’s Guide T-BERD 22079-59.3DS3 OPTION SPECIFICATIONS9.3.1DS3 Specifications9.3.1.1Framing Formats9.3.1.2Patterns9.3.1.3Line Coding•B3ZS9.3.1.4Connectors•WECO 560A jack9.3.1.5Receiver (Single)Frequency:44,736 Mb/s ±300ppmLevel:HIGH: Accepts Nominal 1.2 Vp, 0 ft. of cable from High sourceDSX: Accepts Nominal 0.6 Vp, 450 ft. of c able from High source or monitor LOW: Accepts Nominal 0.3 Vp, 900 ft. of cable from High source9.3.1.6Transmitter (Single)Frequency:44,736 Mb/s ±20ppmPulse:HIGH: Nominal 1.2 Vp (Signal meets ANSI specification T1.102-1993 and ITU-TG.703 when subjected to 450 feet of cable loss.)•Auto• Muxed M13•Unframed • C-bit•M13• Muxed C-bit•1111• 215-1•1100 (Idle)• 220-1•1010 (AIS)• 223-1•1010• User (3 to 24 bit programmable)SECTION 9 - SpecificationsDS3 Option SpecificationsDSX: Nominal 0.91 Vp (Signal meets ANSI specification T1.102-1993 andITU-TG.703.)LOW: Nominal 0.31 VpTiming:Internal ClockRecovered Clock9.3.2DS3 Measurements9.3.2.1Summary•Bit Errors•Frame Errors•Bipolar Violations•Receive Frequenc•Parity Errors•FEAC Messages•C-bit Errors•DS2 Frame Errors•FEBE•Pattern Slip9.3.2.2Logic•Bit Errors•Pattern Slips•Bit Error Rate•Pattern Loss Seconds•Bit Errored Seconds•Error Free Seconds•Pattern Losses•% Error Free Seconds9.3.2.3Bipolar Violations•BPV•BPV Rate•BPV Errored Seconds9-6T-BERD 2207User’s GuideSECTION 9 - SpecificationsDS3 Option Specifications 9.3.2.4Frame Errors•Frame Error Rate•FEBE Rate•Frame Error Seconds•DS2 Frame Errors•Out of Frame Seconds•DS2 Frame Error Rate•C-bit Errors•Received X-bit•C-bit Error Rate•Transmit X-bit•FEBE•Frame Loss Count9.3.2.5Parity•Parity Errors•Parity Error Rate•Parity Error Seconds9.3.2.6Signal•Signal Loss•Signal Loss Seconds•Receive Frequency•Receive Signal Level•Transmit FrequencyUser’s Guide T-BERD 22079-7。
RC7222-A2
V1.1
2005-09-20
V1.20
2005-12-22
V1.21
2007-09-19
注意：V2.00 以上版本适用于 RC7222-A1 芯片 V2.00 V2.01 V2.02 2009-06-01 2009-06-18 EL: +86-10-80106100
RC7222-A2 用户手册 V2.11
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3.修改通过 I2C 接口访问 PHY 的指令 2 芯片 注意：V2.10 以上版本适用于 RC7222-A RC7222-A2 V2.10 V2.11 2010-07-01 2010-07-20 1.增加 SSI 接口描述； 2.增加 GFP 封装描述； 1. 章节整理，文字错误整理；
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版本记录
版本编号 V1.0 日期 2005-01-30 更改说明 文档创建。本文档适用于 RC7222 1、原文档的 23 页，删除表 3.2.2。 2、原文档中管脚 119，名称由 STBUS_PLUSO，改为 STBUS_PULSEO。 3、原文档的37页，4.6.3节中“和网管寄存器04H 的bit1-0 bit3-1”。 4、 原文档的 37 页“建议 ADDR_FILTI 与以太网 PHY 芯片的全 /半双工指示管脚连接”描述不全面，改为“建议使用 PHY 芯片输 出的固定电平的信号（半双工指示或 10M 速率指示）连接 RC7222 的 ADDR_FILTI 管脚”。 5、 原文档 46 页， 4.13.1 节修改对 TEST3_LEDO、 TEST4_LEDO 的功能描述。 6、原文档 49 页，表 5.1.2.3，对指令类型的描述“00H02H：查 询 RC7222”。 7、原文档 49 页，表 5.1.2.3，对配置数据的描述“如果配置 RC7222 内部寄存器，只有字节 98 有效；配置 PHY 的 MDIO 寄存器，字节 9、118、10 有效，其中 9 8 为高字节”。 8、原文档表5.4.1中04H的bit2，将名称MAC_FULL改为 DUPLEX_MOD。 9、原文档60页，表5.4.6对53H-56H的带宽对应顺序描述颠倒 了，“对07H 至0AH 的配置，53H 对应07H，56H 对应0AH” 改为“对0AH至07H的配置，53H对应0AH，56H对应07H”。 10、增加了与 SDRAM 兼容型号的提示。 1、 网管寄存器 06H 改为不允许被配置。 要求不写入 52H 和 59H。 2、 更改了 Uart 查询和设置指令帧格式， 将表 5.1.2.1 和表 5.1.2.3 中 REGAddr 的排列顺序进行了颠倒。 3、更改 P121 UART_DO/SDA 管脚属性，该管脚不是三态。 4、将表 5.4.1 中“从 REG07 最高比特 7 至 REG10 最低比特 0” 的描述改称为“从 07H 最高比特 7 至 0AH 最低比特 0”。 5、将 State_Alarm0、State_Alarm1、State_Alarm2、 State_Alarm3 命名改为 Status_Alarm0、Status_Alarm1、 Status_Alarm2、Status_Alarm3。 6、在 4.5.1 节增加了对 sdram 型号支持的说明。 1.更新管脚排列图 2.修改 5.6 章节和 5.7 章节的内容 文档创建。本文档适用于 RC7222-A1 增加 RJ017 帧格式描述 1.修改书签显示错误； 2.将各图中环回方向进行精确描述
BAV99BRW-7-F;中文规格书,Datasheet资料
QUAD SURFACE MOUNT SWITCHING DIODE ARRAYFeatures• Fast Switching Speed• Low Forward Voltage: Maximum of 0.715V at 1mA • Fast Reverse Recovery: Maximum of 4ns • Low Capacitance: Maximum of 2pF • Small Surface Mount Package• For General Purpose Switching Applications • Two “BAV99” Circuits In One Package • Easily Connected As Full-Wave Bridge• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Note 3)Mechanical Data• Case: SOT-363 • Case Material: Molded Plastic, “Green” Molding Compound. ULFlammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020D • Terminals: Solderable per MIL-STD-202, Method 208 • Lead Free Plating (Matte Tin Finish annealed over Alloy 42leadframe).• Polarity: See Diagram •Weight: 0.006 grams (approximate)Ordering Information (Note 4)Part Number Case Packaging BAV99BRW-7-FSOT-363 3000/Tape & ReelNotes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.2. See for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.4. For packaging details, go to our website at /datasheets/ap02007.pdf.Marking InformationDate Code KeyYear 2001 2002 2003 ….. ….. 2012 2013 2014 2015 2016 2017 2018 CodeM N P ….. ….. Z A B C D E FMonth JanFebMarAprMayJunJulAugSepOctNovDecCode1 2 3 4 5 6 7 8 9 O N De3TOP VIEWSOT-363TOP VIEW Internal SchematicAC 1AC2C 1A 1C 2A 2KGJ = Product Type Marking Code YM = Date Code Marking Y = Year ex: Z = 2012M = Month ex: 9 = SeptemberKGJY MMaximum Ratings(@T A = +25°C, unless otherwise specified.)Characteristic Symbol Value Unit Non-Repetitive Peak Reverse Voltage V RM100 VPeak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage V RRMV RWMV R75 VRMS Reverse Voltage V R(RMS)53 V Forward Continuous Current (Note 5) I FM300 mA Average Rectified Output Current (Note 5) I O150 mANon-Repetitive Peak Forward Surge Current @ t = 1.0µs@ t = 1.0s I FSM2.01.0AThermal CharacteristicsCharacteristic Symbol Value Unit Power Dissipation (Note 5) P D200 mW Thermal Resistance Junction to Ambient Air (Note 5) RθJA625 °C/W Operating and Storage Temperature Range T J , T STG-65 to +150 °CElectrical Characteristics(@T A = +25°C, unless otherwise specified.)Characteristic Symbol Min Max Unit Test Condition Reverse Breakdown Voltage (Note 6) V(BR)R75 ⎯V I R = 2.5µAForward Voltage V F⎯0.7150.8551.01.25VI F = 1.0mAI F = 10mAI F = 50mAI F = 150mAReverse Current (Note 6) I R⎯2.5503025µAµAµAnAV R = 75VV R = 75V, T J = +150°CV R = 25V, T J = +150°CV R = 20VTotal Capacitance C T⎯ 2.0 pF V R = 0, f = 1.0MHzReverse Recovery Time t rr⎯ 4.0 ns I F = I R = 10mA,I rr = 0.1 x I R, R L = 100ΩNotes: 5. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at /datasheets/ap02001.pdf.6. Short duration pulse test used to minimize self-heating effect.501001502002502505075100125150P , P O W E R D I S S I P A T I O N (m W )D T , AMBIENT TEMPERATURE (°C)A Figure 1 Power Derating Curve, Total Package300Note 50.10.01I , I N S T A N T A N E O U S F O R W A R D C U R R E N T (A )F V , INSTANTANEOUS FORWARD VOLTAGE (V)Figure 2 Typical Forward Characteristics, Per Element F1001,00010,000V , INSTANTANEOUS REVERSE VOLTAGE (V)Figure 3 Typical Reverse Characteristics, Per ElementR I , I N S T A N T A N E O U S R E V E R S E C U R R E N T (n A )R 0.00.20.40.60.81.81.61.41.21.02.020C , T O T A L C A P A C I T A N C E (p F )T V , DC REVERSE VOLTAGE (V)Figure 4 Total Capacitance vs. Reverse Voltage, Per ElementRPackage Outline DimensionsSuggested Pad LayoutSOT363Dim Min Max Typ A 0.100.30 0.25 B 1.15 1.35 1.30 C 2.00 2.20 2.10 D 0.65 TypF 0.400.45 0.425 H 1.80 2.20 2.15 J 0 0.10 0.05 K 0.90 1.00 1.00 L 0.250.40 0.30 M 0.100.22 0.11α0° 8° -All Dimensions in mmDimensions Value (in mm)Z 2.5 G 1.3 X 0.42 Y 0.6 C1 1.9 C2 0.65XZYC1C2C2GIMPORTANT NOTICEDIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.LIFE SUPPORTDiodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:A. Life support devices or systems are devices or systems which:1. are intended to implant into the body, or2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in thelabeling can be reasonably expected to result in significant injury to the user.B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause thefailure of the life support device or to affect its safety or effectiveness.Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.Copyright © 2012, Diodes Incorporated分销商库存信息: DIODESBAV99BRW-7-F。
2211(X7R)贴片陶瓷电容器规格书说明书
2 倍额定电压
电压 250V＜V＜1KV 1.5 倍额定电压
1KV≤V
1.2 倍额定电压
在常温常湿下放置 48±4 小时后再测试.
注：NO3，11，12，13 电容的初值测定：先放在 150℃预热 1 小时,再常温常压放置48 小时测试。
第 5 页 共 14 页
No 项 目
规格
测试方法
使用混合焊锡将电容器焊接在图1 的夹具(玻璃 环氧树脂)上,然后再图 2 所释放向加力. 焊接应 用回流焊进行,避免焊接不均及热冲击等不良 现象.
第 8 页 共 14 页
第 9 页 共 14 页
第 10 页 共 14 页
第 11 页 共 14 页
第 12 页 共 14 页
第 13 页 共 14 页
第 14 页 共 14 页
6
耐电压
无介质被击穿或损伤
Ur=450/500/630V,1.5倍额定电压
（DC）
1KV≤Ur≤2KV,........ 1.2倍额定电压
2KV＜Ur,............... 1.1 倍额定电压 升压时间为：1～3S 保压时间为：5S
7
可焊性
■上锡率应大于 95% ■外观无可见损伤
将电容器在 80-120℃预热 10-30 秒,无铅焊料,使用 助焊剂；焊锡温度：245±5℃
测试电压:额定电压测
试时间:60±5 秒测试
5
绝缘电阻
IR≥4*109Ω,C≤25nF
湿度:≤75% 测试
IR*Cr≥100*1012Ω,C＞25nF 温度:25±5℃
测试充放电电流:≤50mA
Ur=100V,............. 2.5 倍额定电压
Ur=200V/250V,.... 2.0 倍额定电压
FDS8949;中文规格书,Datasheet资料
tmOctober 2006FDS8949 Dual N-Channel Logic Level PowerTrench®MOSFET FDS8949Dual N-Channel Logic Level PowerTrench® MOSFET40V, 6A, 29mΩFeaturesMax r DS(on)= 29mΩ at V GS = 10VMax r DS(on)= 36mΩ at V GS = 4.5VLow gate chargeHigh performance trench technology for extremely lowr DS(on)High power and current handling capabilityRoHS compliantGeneral DescriptionThese N-Channel Logic Level MOSFETs are producedusing Fairchild Semiconductor’s advancedPowerTrench® process that has been especially tailoredto minimize the on-state resistance and yet maintainsuperior switching performance.These devices are well suited for low voltage andbattery powered applications where low in-line powerloss and fast switching are required.ApplicationsInverterPower suppliersMOSFET Maximum Ratings TA = 25°C unless otherwise notedThermal CharacteristicsPackage Marking and Ordering InformationSymbol Parameter Ratings UnitsV DS Drain to Source Voltage40VV GS Gate to Source Voltage±20VI DDrain Current -Continuous (Note 1a)6A -Pulsed 20E AS Drain-Source Avalanche Energy (Note 3)26mJP DPower Dissipation for Dual Operation 2W Power Dissipation for Single Operation (Note 1a)(Note 1b)1.60.9T J, T STG Operating and Storage Junction Temperature Range-55 to 150°CRθJA Thermal Resistance-Single operation, Junction to Ambient (Note 1a)81°C/WRθJA Thermal Resistance-Single operation, Junction to Ambient (Note 1b)135RθJC Thermal Resistance, Junction to Case (Note 1)40Device Marking Device Reel Size Tape Width Quantity FDS8949FDS894913’’12mm2500 unitsPin 1SO-8D1D1D2D2S2S1G1G2FDS8949 Dual N-Channel Logic Level PowerTrench ® MOSFETElectrical Characteristics TJ = 25°C unless otherwise notedSymbolParameterTest ConditionsMinTypMaxUnitsOff Characteristics BV DSS Drain to Source Breakdown Voltage I D = 250µA, V GS = 0V 40 V ∆BV DSS ∆T J Breakdown Voltage Temperature CoefficientI D = 250µA, referenced to 25°C33mV/°C I DSS Zero Gate Voltage Drain Current V DS = 32V, V GS = 0V1µA T J = 55°C10µA I GSSGate to Source Leakage CurrentV GS = ±20V,V DS = 0V±100nAOn Characteristics V GS(th)Gate to Source Threshold Voltage V GS = V DS , I D = 250µA 1 1.93V ∆V GS(th) ∆T J Gate to Source Threshold Voltage Temperature Coefficient I D = 250µA, referenced to 25°C -4.6 mV/°Cr DS(on)Drain to Source On Resistance V GS = 10V, I D = 6A2129m ΩV GS = 4.5V, I D = 4.5A 2636V GS = 10V, I D = 6A,T J = 125°C 2943g FSForward TransconductanceV DS = 10V,I D = 6A22S (Note 2)Dynamic CharacteristicsC iss Input Capacitance V DS = 20V, V GS = 0V,f = 1MHz 715955pF C oss Output Capacitance105140pF C rss Reverse Transfer Capacitance6090pF R gGate Resistancef = 1MHz1.1ΩSwitching Characteristicst d(on)Turn-On Delay Time V DD = 20V, I D = 1A V GS = 10V, R GEN = 6Ω918ns t r Rise Time510ns t d(off)Turn-Off Delay Time 2337ns t f Fall Time36ns Q g Total Gate ChargeV DS = 20V, I D = 6A,V GS = 5V 7.711nC Q gs Gate to Source Gate Charge 2.4nC Q gdGate to Drain “Miller”Charge2.8nCDrain-Source Diode Characteristics V SD Source to Drain Diode Forward Voltage V GS = 0V, I S = 6A (note 2) 0.8 1.2V t rr Reverse Recovery Time (note 3)I F = 6A, d iF /d t = 100A/µs1726ns Q rrReverse Recovery Charge711nCand Maximum RatingsNotes:1: R θJA is the sum of the junction-to-case and case-to- ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R θJC is guaranteed by design while R θJA is determined by the user’s board design.2: Pulse Test: Pulse Width < 300 us, Duty Cycle < 2.0%.3: Starting T J = 25°C, L = 1mH, I AS = 7.3A, V DD = 40V, V GS = 10V.Scale 1:1 on letter size papera) 81°C/W when mounted on a 1in 2 pad of 2 oz copperb) 135°C/W when mounted on a minimum pad .MOSFETMOSFETMOSFETFDS8949 Rev. 6FDS8949 Dual N-Channel Logic Level PowerTrench ® MOSFETTRADEMARKSThe following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.DISCLAIMERFAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.As used herein:1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.PRODUCT STATUS DEFINITIONS Definition of TermsACEx™ActiveArray™Bottomless™Build it Now™CoolFET™CROSSVOLT ™DOME™EcoSPARK™E 2CMOS™EnSigna™FACT™FAST ®FASTr™FPS™FRFET™FACT Quiet Series™ GlobalOptoisolator™GTO™HiSeC™I 2C™i-Lo ™ImpliedDisconnect ™IntelliMAX™ISOPLANAR™LittleFET™MICROCOUPLER™MicroFET™MicroPak™MICROWIRE™MSX ™MSXPro ™OCX ™OCXPro ™OPTOLOGIC ®OPTOPLANAR™PACMAN™POP™Power247™PowerEdge™PowerSaver™PowerTrench ®QFET ®QS™QT Optoelectronics™Quiet Series™RapidConfigure ™RapidConnect ™µSerDes ™ScalarPump ™SILENT SWITCHER ®SMART START™SPM™Stealth™SuperFET™SuperSOT™-3SuperSOT™-6SuperSOT™-8SyncFET™TCM™TinyBoost™TinyBuck™TinyPWM™TinyPower™TinyLogic ®TINYOPTO™TruTranslation™UHC™UniFET™UltraFET ®VCX™Wire™Across the board. Around the world.™The Power Franchise ®Programmable Active Droop™Datasheet Identification Product Status DefinitionAdvance InformationFormative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.PreliminaryFirst ProductionThis datasheet contains preliminary data, andsupplementary data will be published at a later date.Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.No Identification Needed Full ProductionThis datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In ProductionThis datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor.The datasheet is printed for reference information only.Rev. I20分销商库存信息: FAIRCHILDFDS8949。
Z-15EW22R中文资料(omron)中文数据手册「EasyDatasheet - 矽搜」
Z-@55-M@@@M
(1) (2)(3) (4)
（ 1）防滴型 （ 2）铅奥特莱斯
01 15 H2 H G E None S D K K3 Q3 Q Q8 Q22 Q21 L L2 W21 W W3 W32 W4 W44 W78 W52 W22 W2 W25 W49 W54 W2277 M M22 M2 NJ NJS None 55 A55
H (0.25 mm) Model
Z-15H Z-15H-B Z-15HS Z-15HS-B Z-15HD Z-15HD-B
H2 (0.20 mm) Model
Z-15H2 Z-15H2-B
E (1.8 mm) Model
Z-15E Z-15E-B
H (0.25 mm) Model
Z-01H Z-01H-B Z-01HS Z-01HS-B Z-01HD Z-01HD-B
（ 5）终端
: 15 A
：0.20（超高灵敏度） 0.25毫米（高感光度, 微负载） ：0.5毫米（标准） 1.8毫米（高容量）
（ 2）触点间隙
None 19
: VSF : VCT L型 D型 R型
（ 3）四通八达 奥特莱斯（见下 图 .）
（ 3）执行器
: : : : : : : : : : : : : : : : : : : : : : : : : : : : : : :
--------------------Z-01HW2255 Z-01HW2255-B
面板安装柱塞 面板安装滚轮 柱塞 面板安装交叉 滚轮柱塞 钢板弹簧 辊钢板弹簧 短铰链杆 长铰链杆 铰链杆 短铰链滚轮摇臂
--Z-15GQA55-B5V
--Z-15GQ22A55-B5V
HR22-12WTJA-20PC(73);HR22-12WTPA-20SC(73);HR22-12TJD-20S(73);中文规格书,Datasheet资料
1High-Performance Compact Circular ConnectorsHR22 Series2011.5■Features1. Availavle in waterproof and non-waterproof types.Engaged waterproof type connectors are free from water penetration for 48 hours at a depth of 1.8 meters.2. Anti-loosening locking mechanism.The locking mechanism has an anti-loosening spring in a screw coupling.3. Two types of terminationAvailable in two wiring styles for wider selection:Crimp type and soldering.4. Easy receptacle mountingA receptacle may be mounted quickly on a panel by tightening a nut.5. Available with wire protectionThis type of connector has a shell with a cordbushing for increased cable curvature and protection against wire breakage when bending the wire.6. High-density designThe maximum plug dia. is 21mm for higher density of a 20-pin type connector.■OverviewThe HR22 Series are 20-pin compact circular connectors developed as an interface between machine tool motors and operation panels, with a screw coupling type locking machanism to prevent unlocking due to motor vibration, and are available in either waterproof or non-waterproof types.The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information./2HR22 Series ●High-Performance Compact Circular Connectors■Materials■Ordering informationPlease determine the specific product. If listed needed, please select and order the product No.HR22−12W T P A −20SC (**)1234567895Shell type P: Plug J:JackR:Receptacle6 Shell shapeE ach time aleternation is made to the shell shape, the symbol changes such as A,B,C,D,E and so forth.Characters C,J,P and R are not used to avoid misunderstanding.1 Series name: HR222 Shell size:T his number indicates the outer dia. of the shell of the plug mating part.3 W:W aterproof Blank: Non-waterproof 4 Locking mechanismT:Screw coupling type7 Number of pins 8 Pin style P:Male pin PC: Crimp type male pinS:Female pin SC: Crimp type female pin 9O ther specifications: 2 numerical digits will be added when there is a specifications change other than shown 1 to 8BPanel mounting dimensions B Pin allocation and major functionsPin allocationNumber of pins 20Withstand voltage AC300V for 1 minuteCurrent capacity 2AInsulation resistance 1000Mø or more at DC100VContact resistance 20mø or lessSolder pot inner dia.Ø0.8Notes:1. T he above figure shows the pin allocation viewed from the engagement side.2.The above withstand voltage shows the test voltage.3.The above current capacity shows value per pin.4.The above contact resistance shows value measured at 1A DC.Panel thickness t : 1 to 3mmThe product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information./3HR22 Series ●High-Performance Compact Circular Connectors■Plug (Crimp type)■Jack (Crimp type)HRS No.Part No.122-0010-0-73HR22-12TPD-20SC(73)122-0018-1-73HR22-12TPD-20PC(73)HRS No.Part No.122-0019-4-73HR22-12TJD-20PC(73)HR22-12TPD-20SC(73)(A p p l i c a b l e c a b l e d i a .)(An example in shape)(An example in shape)(A p p l i c a b l e c a b l e d i a .)HR22-12TJD-20PC(73)The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information./4HR22 Series ●High-Performance Compact Circular Connectors■Plug (Solder type)■Jack (Solder type)HRS No.Part No.122-0011-2-73HR22-12TPD-20S(73)122-0012-5-73HR22-12TPD-20P(73)HRS No.Part No.122-0022-9-73HR22-12TJD-20P(73)122-0023-1-73HR22-12TJD-20S(73)(A p p l i c a b l e c a b l e d i a .)(An example in shape)(An example in shape)(A p p l i c a b l e c a b l e d i a .)HR22-12TPD-20S(73)HR22-12TJD-20P(73)The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information./5HR22 Series ●High-Performance Compact Circular ConnectorsWaterproof type■Plug (Crimp type)■Receptacle (Crimp type)■Jack (Crimp type)HRS No.Part No.122-0004-7-73HR22-12WTPA-20SC(73)HRS No.Part No.122-0005-0-73HR22-12WTRA-20PC(73)122-0021-6-73HR22-12WTRA-20SC(73)HRS No.Part No.122-0006-2-73HR22-12WTJA-20PC(73)(A p p l i c a b l e c a b l e d i a .)(An example in shape)(An example in shape)(An example in shape)(A p p l i c a b l e c a b l e d i a .)HR22-12WTPA-20SC(73)HR22-12WTRA-20PC(73)HR22-12WTJA-20PC(73)The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information./6HR22 Series ●High-Performance Compact Circular Connectors■Plug (Solder type)■Receptacle (Solder type)Unit : mmHRS No.Part No.ØA122-0015-3-73HR22-12WTPA-20S(73)Ø10122-0026-0-73HR22-12WTPE-20S(73)Ø9.2Unit : mmHRS No.Part No.A122-0013-8-73HR22-12WTRA-20P(73)25.5122-0014-0-73HR22-12WTRA-20S(73)24(A p p l i c a b l e c a b l e d i a .)(An example in shape)(An example in shape)HR22-12WTPA-20S(73)HR22-12WTRA-20P(73)The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information./7HR22 Series ●High-Performance Compact Circular Connectors■Right angle plug (Solder type)■Cable clamp●Screw tightening type●Without screw typeHRS No.Part No.Weight122-0054-5-73HR22-12WTLP-20P(73)55gUnit : mmHRS No.Part No.AWeight114-2045-0-72JR13WCC-4(72)429g 114-2046-3-72JR13WCC-5(72)527g 114-2047-6-72JR13WCC-6(72)626gUnit : mmHRS No.Part No.AWeight114-2069-9-72JR13WCCA-4(72)410g 114-2070-8-72JR13WCCA-5(72)510g 114-2071-0-72JR13WCCA-6(72)610gHRS No.Part No.AWeight114-2048-9-72JR13WCC-7(72)724g 114-2049-1-72JR13WCC-8(72)823g 114-2050-0-72JR13WCC-9(72)921g 114-2051-3-72JR13WCC-10(72)1020gHRS No.Part No.AWeight114-2072-3-72JR13WCCA-7(72)79g 114-2073-6-72JR13WCCA-8(72)89g 114-2074-9-72JR13WCCA-9(72)98g 114-2075-1-72JR13WCCA-10(72)108gUnit : mmUnit : mmShown one typeShown one typeWrench application spacedimention of 17mmWrench application spacedimention of 17mmØ19HR22-12WTLP-20P(73)JR13WCC-10(72)JR13WCC-10(72)The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information./8HR22 Series ●High-Performance Compact Circular Connectors■Applicable toolsB Precautions1.Switch off the power of the circuit before disconnecting or plugging-in the connectors.e connectors with socket contacts at the power side of the circuit.3.Make sure that the coupling is in completely cocked position.4.The cable pull and twisting strength and other characteristics may differ, depending on the cable structure. Please confirm before the use.TypeItemHRS No.Part No.Applicable terminalApplicable wireManualManual crimping tool 150-0200-4-00HR22-TA2428HCHR22-PC-122HR22-SC-122AWG#24~28AoutomaticAutomatic crimping machine body901-0005-4CM-105 Applicator901-2023-7AP105-HR22-2HR22-PC-122HR22-SC-122AWG#24~28Cable crimping tool150-0058-5-00HR10A-TC-04 Ø8.5(Note)Extractor150-0039-0-00RP6-SC-TPNote: Cable crimping tools are not used for connecting waterproof connectors.■Wiring toolHRS No.Part No.PackagingApplicable cable122-0017-9-00HR22-PC-122100 pcs. per bagAWG#24 ~ 28122-0009-0-00HR22-PC-22210,000 pcs. per reel AWG#24 ~ 28HRS No.Part No.PackagingApplicable cable122-0016-6-00HR22-SC-122100 pcs. per bagAWG#24 ~ 28122-0008-8-00HR22-SC-22210,000 pcs. per reel AWG#24 ~ 28HRS No.Part No.Applicable connector150-0075-4-00HR22-12P-T01HR22-12WTPAHR22-12TPDNotes 1: Use a cable having a insulator outer dia.of 1.15 mm or less.A connector may be assembled and disassembled easily using the assembly toolshown left .Manual crimping tool Cable crimping toolPull-out toolAutomatic crimping machine CM-105Unit : mmA-A cross sectionA-A cross sectionHR22-12P-T01■Contact(Male pin)(Female pin)The contents of this catalog are current as of date of 5/2011. Contents are subject to change without notice for the purpose of improvements.The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information./分销商库存信息:HIROSEHR22-12WTJA-20PC(73)HR22-12WTPA-20SC(73)HR22-12TJD-20S(73)HR22-12TPD-20S(73)HR22-12WTPA-20S(73)HR22-12WTPE-20S(73) HR22-12WTLP-20P(73)HR22-12WTRA-20SC(73)HR22-12WTRA-20PC(73) HR22-12WTRA-20P(73)HR22-12TJD-20PC(73)HR22-12TJD-20P(73)HR22-12TPD-20P(73)HR22-12WTRA-20S(73)HR22-12TJD-20PHR22-12TJD-20PC HR22-12TJD-20S HR22-12TPD-20PHR22-12TPD-20S HR22-12WTPE-20S HR22-SC-122HR22-PC-122HR22-12TPD-20SC(73)HR22-12TPD-20PC(73) HR22-12TPD-20SC HR22-12TPD-20PC HR22-12P-T01。
ATDH2227A;ATDH2221;ATDH2223;ATDH2222;ATDH2228;中文规格书,Datasheet资料
1FeaturesHardware•Supports Programming of all AT17LV , AT17N, and AT17F Series Devices •Connection to Allow In-System Programming (ISP) •Runs off Portable 9V DC Power Supply •5.0V and 3.3V SupplySoftware•CPS – Configurator Programming System •GUI-based Interface•Supports Windows ® 98/2000/XP and Windows NT ®•Online Help•Supports Programming Reset Polarity•Verification Routines to Validate Programming•Accepts HEX, MCS, POF, RBF and BST File FormatsSystem Contents•ATDH2200 Programming Board •ATDH2222 20-pin PLCC Adapter •ATDH2200E Datasheet•ATDH2200E Programming Kit User Guide •10-pin Ribbon Cable for ISP•9V DC, 500 mA, 2.1 mm Center Positive/Negative Power Supply (for US customers only)•Sample AT17LV DevicesDescriptionThe ATDH2200E allows designers to quickly and economically program Atmel’s family of AT17 series FPGA Configuration Memories. The system also provides support for new devices in the AT17 series Configurator prior to Third Party Programmer support being available. This is a truly portable solution that allows engineers to work from their lab bench or office./2ATDH2200E0642G–CNFG–3/09Figure 1. ATDH2200E Configurator Programming BoardIn-System Programming ConnectorFigure 2. In-System Programming HeaderNotes:1.Pin 10 activates SER_EN on target board.2.NC stands for no connection.The ATDH2200E programming board has a 10 pin header (0.1" spacing) to facilitate in-system programming (Figure 2) of the AT17 parts. The control signals generated by the software are fed to the header, as well as to socket U3 on the board. By placing a similar socket on the target system and connecting the programming board to that target system, the programming algorithms written by Atmel can be used to program anAT17 device in-system./3ATDH2200E0642G–CNFG–3/09Related Documents•ATDH2200E Programming Kit User Guide •AT17 Series datasheet•Programming Specification for Atmel’s FPGA Configuration memories •In-System Programming Cascaded Configurators •AT17A Series datasheetAdapters Available for the ATDH2200E•ATDH2222 – 20-lead PLCC adapter (supplied with kit)•ATDH2221 – 20-lead SOIC adapter •ATDH2223 – 8-lead SOIC adapter •ATDH2224 – 44-lead TQFP •ATDH2226 – 32-lead TQFP•ATDH2227 – 44-lead PLCC (non-A parts only)•ATDH2227A – 44-lead PLCC (A parts only)•ATDH2228 – 8-lead LAP/4ATDH2200E0642G–CNFG–3/09SchematicsProgramming Connections/5ATDH2200E0642G–CNFG–3/09Power Supply Generation/HeadquartersInternationalAtmel Corporation 2325 Orchard Parkway San Jose, CA 95131USATel: 1(408) 441-0311Fax: 1(408) 487-2600Atmel AsiaUnit 1-5 & 16, 19/FBEA Tower, Millennium City 5418 Kwun Tong Road Kwun Tong, Kowloon Hong KongTel: (852) 2245-6100Fax: (852) 2722-1369Atmel Europe Le Krebs8, Rue Jean-Pierre Timbaud BP 30978054 Saint-Quentin-en-Yvelines Cedex FranceTel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11Atmel Japan9F, Tonetsu Shinkawa Bldg.1-24-8 ShinkawaChuo-ku, Tokyo 104-0033JapanTel: (81) 3-3523-3551Fax: (81) 3-3523-7581Product ContactWeb SiteTechnical Supportconfigurator@Sales Contact/contactsLiterature Requests /literatureDisclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise,to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL ’S TERMS AND CONDI-TIONS OF SALE LOCATED ON ATMEL ’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDEN-TAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE O R INABILITY TO USE THIS DO CUMENT, EVEN IF ATMEL HAS BEEN ADVISED O F THE PO SSIBILITY O F SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life.0642G–CNFG–3/09© 2009 Atmel Corporation. All rights reserved. Atmel ®, Atmel logo and combinations thereof, and others are registered trademarks or trade-marks of Atmel Corporation or its subsidiaries. Microsoft ®, Windows ® and Windows NT ® are the registered trademarks of Microsoft Corporation.Other terms and product names may be trademarks of others./分销商库存信息:ATMELATDH2227A ATDH2221ATDH2223 ATDH2222ATDH2228ATDH2221-ATDH2222-ATDH2223-ATDH2200E-。
IRMCK311TR;中文规格书,Datasheet资料
Data Sheet No. PD60338IRMCK311 Dual Channel Sensorless Motor Control IC forAppliancesFeaturesMCE TM (Motion Control Engine) - Hardware based computation engine for high efficiency sinusoidal sensorless control of permanent magnet AC motor Integrated Power Factor Correction controlSupports both interior and surface permanent magnet motorsBuilt-in hardware peripheral for single shunt current feedback reconstructionNo external current or voltage sensing operational amplifier requiredDual channel three/two-phase Space Vector PWM Three-channel analog output (PWM)Embedded 8-bit high speed microcontroller (8051) for flexible I/O and man-machine controlJTAG programming port for emulation/debugger Two serial communication interface (UART)I2C/SPI serial interfaceWatchdog timer with independent analog clockThree general purpose timers/countersTwo special timers: periodic timer, capture timer Internal ‘One-Time Programmable’ (OTP) memory and internal RAM for final production usagePin compatible with IRMCF311 RAM version1.8V/3.3V CMOS Product SummaryMaximum crystal frequency 60 MHz Maximum internal clock (SYSCLK) frequency 128 MHz Maximum 8051 clock frequency 33 MHz Sensorless control computation time 11 μsec typ MCE TM computation data range 16 bit signed 8051 OTP Program memory 56K bytes MCE program and Data RAM 8K bytes GateKill latency (digital filtered) 2 μsec PWM carrier frequency counter 16 bits/ SYSCLK A/D input channels 6 A/D converter resolution 12 bits A/D converter conversion speed 2 μsec 8051 instruction execution speed 2 SYSCLK Analog output (PWM) resolution 8 bits UART baud rate (typ) 57.6K bps Number of I/O (max) 14 Package (lead-free) QFP64 Operating temperature -40°C ~ 85°CDescriptionIRMCK311 is a high performance OTP based motion control IC designed primarily for appliance applications. IRMCK311 is designed to achieve low cost and high performance control solutions for advanced inverterized appliance motor control. IRMCK311 contains two computation engines. One is Motion Control Engine (MCE TM) for sensorless control of permanent magnet motors; the other is an 8-bit high-speed microcontroller (8051). Both computation engines are integrated into one monolithic chip. The MCE TM contains a collection of control elements such as Proportional plus Integral, Vector rotator, Angle estimator, Multiply/Divide, Low loss SVPWM, Single Shunt IFB. The user can program a motion control algorithm by connecting these control elements using a graphic compiler. Key components of the sensorless control algorithms, such as the Angle Estimator, are provided as complete pre-defined control blocks implemented in hardware. A unique analog/digital circuit and algorithm to fully support single shunt current reconstruction is also provided. The 8051 microcontroller performs 2-cycle instruction execution (16MIPS at 33MHz). The MCE and 8051 microcontroller are connected via dual port RAM to process signal monitoring and command input. An advanced graphic compiler for the MCE TM is seamlessly integrated into the MATLAB/Simulink environment, while third party JTAG based emulator tools are supported for 8051 developments. IRMCK311 comes with a small QFP64 pin lead-free package.TABLE OF CONTENTS1 Overview (5)2 IRMCK311 Block Diagram and Main Functions (6)3 Pinout (8)4 Input/Output of IRMCK311 (9)4.1 8051 Peripheral Interface Group (10)4.2 Motion Peripheral Interface Group (10)4.3 Analog Interface Group (11)4.4 Power Interface Group (11)4.5 Test Interface (12)5 Application Connections (13)6 DC Characteristics (14)6.1 Absolute Maximum Ratings (14)6.2 System Clock Frequency and Power Consumption (14)6.3 Digital I/O DC Characteristics (15)6.4 PLL and Oscillator DC Characteristics (15)6.5 Analog I/O DC Characteristics (16)6.6 Under Voltage Lockout DC Characteristics (17)6.7 AREF Characteristics (17)7 AC Characteristics (18)7.1 PLL AC Characteristics (18)7.2 Analog to Digital Converter AC Characteristics (19)7.3 Op Amp AC Characteristics (19)7.4 SYNC to SVPWM and A/D Conversion AC Timing (20)7.5 GATEKILL to SVPWM AC Timing (21)7.6 Interrupt AC Timing (21)7.7 I2C AC Timing (22)7.8 SPI AC Timing (23)7.8.1 SPI Write AC timing (23)7.8.2 SPI Read AC Timing (24)7.9 UART AC Timing (25)7.10 CAPTURE Input AC Timing (26)7.11 JTAG AC Timing (27)7.12 OTP Programming Timing (28)8 I/O Structure (29)9 Pin List (32)Dimensions (35)10 Package11 Part Marking Information (36)Information (36)12 OrderingTABLE OF FIGURESFigure 1. Typical Application Block Diagram Using IRMCK311 (5)Figure 2. IRMCK311 Internal Block Diagram (6)Figure 3. IRMCK311 Pin Configuration (8)Figure 4. Input/Output of IRMCK311 (9)Figure 5. Application Connection of IRMCK311 (13)Figure 6. Clock Frequency vs. Power Consumption (14)Figure 7 Crystal oscillator circuit (18)Figure 8 Voltage droop of sample and hold (19)Figure 9 SYNC to SVPWM and A/D conversion AC Timing (20)Figure 10 GATEKILL to SVPWM AC Timing (21)Figure 11 Interrupt AC Timing (21)Figure 12 I2C AC Timing (22)Figure 13 SPI AC Timing (23)Figure 14 SPI Read AC Timing (24)Figure 15 UART AC Timing (25)Figure 16 CAPTURE Input AC Timing (26)Figure 17 JTAG AC Timing (27)Figure 18 OTP Programming Timing (28)Figure 19 All digital I/O except motor PWM output (29)Figure 20 RESET, GATEKILL I/O (29)Figure 21 Analog input (30)Figure 22 Analog operational amplifier output and AREF I/O structure (30)Figure 23 VPP programming pin I/O structure (30)Figure 24 VSS and AVSS pin structure (31)Figure 25 VDD1 and VDDCAP pin structure (31)Figure 26 XTAL0/XTAL1 pins structure (31)TABLE OF TABLESTable 1. Absolute Maximum Ratings (14)Table 2. System Clock Frequency (14)Table 3. Digital I/O DC Characteristics (15)Table 4. PLL DC Characteristics (15)Table 5. Analog I/O DC Characteristics (16)Table 6. UVcc DC Characteristics (17)Table 7. AREF DC Characteristics (17)Table 8. PLL AC Characteristics (18)Table 9. A/D Converter AC Characteristics (19)Table 10. Current Sensing OP Amp AC Characteristics (19)Table 11. SYNC AC Characteristics (20)Table 12. GATEKILL to SVPWM AC Timing (21)Table 13. Interrupt AC Timing (21)Table 14. I2C AC Timing (22)Table 15. SPI Write AC Timing (23)Table 16. SPI Read AC Timing (24)Table 17. UART AC Timing (25)Table 18. CAPTURE AC Timing (26)Table 19. JTAG AC Timing (27)Table 20. OTP Programming Timing (28)Table 21. Pin List (32)1 OverviewIRMCK311 is a new International Rectifier integrated circuit device primarily designed as a one-chip solution for complete inverter controlled appliance dual motor control applications. Unlike a traditional microcontroller or DSP, the IRMCK311 provides a built-in closed loop sensorless control algorithm using the unique Motion Control Engine (MCE TM) for permanent magnet motors. The MCE TM consists of a collection of control elements, motion peripherals, a dedicated motion control sequencer and dual port RAM to map internal signal nodes. IRMCK311 also employs a unique single shunt current reconstruction circuit to eliminate additional analog/digital circuitry and enables a direct shunt resistor interface to the IC. The sensorless control is the same for both motors with a single shunt current sensing capability. Motion control programming is achieved using a dedicated graphical compiler integrated into the MATLAB/Simulink TM development environment. Sequencing, user interface, host communication, and upper layer control tasks can be implemented in the 8051 high-speed 8-bit microcontroller. The 8051 microcontroller is equipped with a JTAG port to facilitate emulation and debugging tools. Figure 1 shows a typical application schematic using IRMCK311.IRMCK311 is intended for volume production purpose and contains 64K bytes of OTP (One Time Programming) ROM, which can be programmed through a JTAG port. For a development purpose use, IRMCF311 contains a 48k byte of RAM in place of program OTP to facilitate an application development work. Both IRMCF311 and IRMCK311 come in the same 64-pin QFP package with identical pin configuration to facilitate PC board layout and transition to mass productionFigure 1. Typical Application Block Diagram Using IRMCK3112 IRMCK311 Block Diagram and Main FunctionsM o t i o n C o n t r o l B u sFigure 2. IRMCK311 Internal Block DiagramIRMCK311 contains the following functions for sensorless AC motor control applications:• Motion Control Engine (MCE TM )o Proportional plus Integral block o Low pass filtero Differentiator and lag (high pass filter) o Ramp o Limito Angle estimate (sensorless control) o Inverse Clark transformation o Vector rotator o Bit latch o Peak detect o Transitiono Multiply-divide (signed and unsigned)o Divide (signed and unsigned)o Addero Subtractoro Comparatoro Countero Accumulatoro Switcho Shifto ATAN (arc tangent)o Function block (any curve fitting, nonlinear function)o16-bit wide Logic operations (AND, OR, XOR, NOT, NEGATE)o MCE TM program and data memory (6K byte). Note 1o MCE TM control sequencer• 8051 microcontrollero Three 16-bit timer/counterso16-bit periodic timero16-bit analog watchdog timero16-bit capture timero Up to 36 discrete I/Oso Eleven-channel 12-bit A/DFive buffered channels (0 – 1.2V input)One unbuffered channel (0 – 1.2V input)o JTAG port (4 pins)o Up to three channels of analog output (8-bit PWM)o Two UARTo I2C/SPI porto 64K byte Note 1program One-Time Programmable memoryo2K byte data RAM. Note 2Note 1: Total size of OTP memory is 64K byte, however MCE program occupiesmaximum 8K byte which will be loaded into internal RAM at a powerup/bootprocess. Therefore only 56K byte OTP memory area is usable for 8051microcontroller.Note 2: Total size of RAM is 8K byte including MCE program, MCE data, and 8051data. Different sizes can be allocated depending on applications.3 PinoutXTAL0XTAL1P1.1/RXD P1.2/TXDVDD1VSS VDD2P1.3/SYNC/SCKP1.4/CAPP 3.6/R X D 1P 3.7/T X D 1FPWMVL FPWMUL V S SV D D 2A V D DA V S SA I N 0A R E FP 2.7/A O P W M 1P 2.6/A O P W M 0CPWMUH CPWMVH CPWMWH CPWMUL CPWMVL CPWMWL CGATEKILL VDD1VSS I F B C OI F B C +I F B C -P L L V S SP L L V D DR E S E TN CT C KP 5.3/T D IP 5.2/T D OP 5.1/T M SS D A /C S 0S C L /S O -S I /V P PP 5.0/P F C G K I L LP F C P W M V S SFGATEKILL FPWMWL VAC-VAC+VACO IPFCO IPFC+IPFC-I F B F OI F B F +I F B F -P3.0/INT2/CS1C M E X TFPWMVH FPWMUHFPWMWH A I N 1P 3.2/I N T 0Figure 3. IRMCK311 Pin Configuration4 Input/Output of IRMCK311All I/O signals of IRMCK311 are shown in Figure 4. All I/O pins are 3.3V logic interface except A/D interface pins.Figure 4. Input/Output of IRMCK3114.1 8051 Peripheral Interface GroupUART InterfaceP1.1/RXD Input, Receive data to IRMCK311, can be configured as P1.1P1.2/TXD Output, Transmit data from IRMCK311, can be configured as P1.22nd channel Receive data to IRMCK311, can be configured as P3.6 P3.6/RXD1 Input,P3.7/TXD1 Output,2nd channel Transmit data from IRMCK311, can be configured as P3.7Discrete I/O InterfaceP1.3/SYNC/SCK Input/output port 1.3, can be configured as SYNC output or SPI clock P1.4/CAP Input/output port 1.4, can be configured as Capture Timer inputP3.0/INT2/CS1 Input/output port 3.0, can be configured as external interrupt 2 or SPIchip select 1P3.2/INT0 Input/output port 3.2, can be configured as external interrupt 0Analog Output InterfaceP2.6/AOPWM0 Input/output, can be configured as 8-bit PWM output 0 withprogrammable carrier frequencyP2.7/AOPWM1 Input/output, can be configured as 8-bit PWM output 1 withprogrammable carrier frequencyCrystal InterfaceXTAL0 Input, connected to crystalXTAL1 Output, connected to crystalReset InterfaceRESET Inout, system reset, needs to be pulled up to VDD1 but doesn’t requireexternal RC time constantI2C/SPI InterfaceSCL/SO-SI/VPP Output, I2C clock output, SPI SO-SII2C Data line, Chip Select 0 of SPISDA/CS0 Input/output,P3.0/INT2/CS1 Input/output port 3.0, can be configured as external interrupt 2 or SPIchip select 1P1.3/SYNC/SCK Input/output port 1.3, can be configured as SYNC output or SPI clock 4.2 Motion Peripheral Interface GroupPWMCPWMUH Output, motor 1 PWM phase U high side gate signalCPWMUL Output, motor 1 PWM phase U low side gate signalCPWMVH Output, motor 1 PWM phase V high side gate signalCPWMVL Output, motor 1 PWM phase V low side gate signalCPWMWH Output, motor 1 PWM phase W high side gate signalCPWMWL Output, motor 1 PWM phase W low side gate signalFPWMUH Output, motor 2 PWM phase U high side gate signalFPWMUL Output, motor 2 PWM phase U low side gate signal分销商库存信息: IRIRMCK311TR。
传感技术公司产品说明书：DR22系列电源控制电压强电流转换器
DR22 SERIES | DC OUTPUTDIN RAIL MOUNT SOLID STATE RELAYSFeatures• Output ratings up to 30 Amps at 200 VDC • I ntegral heat sink eliminates the need for complex thermalcalculations• DBC substrate for superior thermal performance • LED input status indicator • IP20 touch-safe housing• 1kHz Maximum PWM Frequency • 3750 VAC optical isolation • C-UL-US approvedPRODUCT SELECTIONSPECIFICATIONSOutput (1)Input (1)General (1)INPUT CURRENT INFORMATIONSURGE CURRENT INFORMATIONTHERMAL DERATE INFORMATION4-32 VDC InputDR2220D20UDR2220D30UDR2220D20UDR2220D30UEQUIVALENT CIRCUIT BLOCK DIAGRAMS/WIRING DIAGRAM*Tolerances: ±0.02 in / 0.5 mm All dimensions are in: inches [millimeters]Load can be wired in position A or B inductive loads must be diode suppressed. MECHANICAL SPECIFICATIONSORDERING OPTIONSDR2220D20UGENERAL NOTES(1)All parameters at 25°C unless otherwise specified.(2)Low current loads and high ambient temperature can affect turn-on time.(3) 8 VDC Minimum control voltage. Resistive loads only. Consider switching losses; at maximum frequency reduce to 75% output current. Recommended suppressor diode connected at load side, see wiring diagram.(4)Increase minimum voltage by 1 V for operations from -20 to -40°C.(5)Minimum spacing to obtain max. current is 22.5mm between adjacent units.ACCESSORIESPage 6CONTACT USAmericas+1 (877) 502 5500************************Europe, Middle East & Africa +44 (1202) 416170***********************Asia Pacific*************************.com China +86 (21) 2306 1500Japan +81 (45) 277 7117Korea +82 (31) 601 2004India +91 (80) 67920890Rest of Asia +886 (2) 27602006 ext 2808Sensata Technologies, Inc. (“Sensata”) data sheets are solely intended to assist designers (“Buyers”) who are developing systems that incorporate Sensata products (also referred to herein as “components”). Buyer understands and agrees that Buyer remains responsible for using its independent analysis, evaluation and judgment in designing Buyer’s systems and products. Sensata data sheets have been created using standard laboratory conditions and engineering practices. Sensata has not conducted any testing other than that specifically described in the published documentation for a particular data sheet. Sensata may make corrections, enhancements, improvements and other changes to its data sheets or components without notice.Buyers are authorized to use Sensata data sheets with the Sensata component(s) identified in each particular data sheet. HOWEVER, NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER SENSATA INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY THIRD PARTY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT, IS GRANTED HEREIN. SENSATA DATA SHEETS ARE PROVIDED “AS IS”. SENSATA MAKES NO WARRANTIES OR REPRESENTATIONS WITH REGARD TO THE DATA SHEETS OR USE OF THE DATA SHEETS, EXPRESS, IMPLIED OR STATUTORY, INCLUDING ACCURACY OR COMPLETENESS. SENSATA DISCLAIMS ANY WARRANTY OF TITLE AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, QUIET ENJOYMENT, QUIET POSSESSION, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS WITH REGARD TO SENSATA DATA SHEETS OR USE THEREOF.All products are sold subject to Sensata’s terms and conditions of sale supplied at SENSATA ASSUMES NO LIABILITY FOR APPLICATIONS ASSISTANCE OR THE DESIGN OF BUYERS’ PRODUCTS. BUYER ACKNOWLEDGES AND AGREES THAT IT IS SOLELY RESPONSIBLE FOR COMPLIANCE WITH ALL LEGAL, REGULATORY AND SAFETY-RELATED REQUIREMENTS CONCERNING ITS PRODUCTS, WARNINGSAGENCY APPROVALS & CERTIFICATIONSCertification in accordance with:United States Standard for Industrial Control Equipment - UL 508 andCanadian Standard Association for Industrial Control Equipment – C22.2 No. 14.RISK OF MATERIAL DAMAGE AND HOT ENCLOSURE• The product’s side panels may be hot, allow the product to cool before touching • Follow proper mounting instructions including torque values • Do not allow liquids or foreign objects to enter this productFailure to follow these instructions can result in serious injury, or equipment damage.HAZARD OF ELECTRIC SHOCK, EXPLOSION OR ARC FLASH• Disconnect all power before installing or working with this equipment • Verify all connections and replace all covers before turning on powerFailure to follow these instructions will result in death or serious injury.。
VIPer22A应用中文资料
AN2097应用说明VIPower:采用VIPer22A的10W空调开关电源1. 摘要新的空调机采用两个主低压输出给内部电子设备供电。
这两个主输出的低压分别是+12V和+5V。
低输出电压是由一个内部开关电源产生。
这个开关电源需要以下多个重要特性：效率高，重量轻，尺寸小，待机功耗低等。
设计人员利用VIPerX2系列产品可以开发出一个含有所有这些重要功能的电源，因此，该系列产品是开发空调应用的最理想的解决方案,特别是下文介绍的电路板是为改进图1所示的特性而专门开发的，本文在表1列举的技术规格方面讨论了空调开关电源应用。
表1：电气规格图1:电路板布局1. VIPERX2A 描述VIPerX2A 是一个单封装的产品，在同一颗芯片上整合了一个专用电流式PWM控制器和一个高压功率场效应MOS晶体管。
这种方法可以减少组件数量，降低系统成本，简化电路板设计。
因此，这个产品家族广泛用于离线开关式电源。
此外，该系列产品还采用微型的SMD封装 (SO-8)。
VIPer 系列的待机功耗（小于1W）符合蓝天使和能源之星等节能标准。
1.1. 一般特性VIPerx2A 产品采用ST的VIPower M0-3 高压专利技术，M0-3 高压技术利用一个P型掩埋层的方法，允许在同一颗芯片上集成低压系统（PWM）和电流垂直流动的功率级，如图2所示。
VIPerX2A 产品有以下一般特性:-自动热关断-高压启动电流源输入交流电压范围85-265Vac输出112V输出25V/400mA(连接输出1的线性稳压器)纹波电流<50mA连续电流输出电流（12V和5V）600mA峰值电流，小于5分钟待机功耗<1W-防止输出短路导致击穿故障的打嗝（HICCUP）模式-保证低负载条件下低功耗的突发模式而且，VIPower M0-3技术还可用于开发最小击穿电压为730V 的功率场效应MOS 晶体管。
表2说明了该产品在不同的封装和工作条件下的功率处理能力。
USB2227-AHZS-XX资料
SMSC USB2227/USB2228DATASHEETRevision 1.91 (10-13-06)DatasheetPRODUCT FEATURESUSB2227/USB22284th Generation USB2.0 Flash Media Controller with Integrated Card Power FETsComplete System Solution for interfacing SmartMedia TM (SM) or xD Picture Card TM (xD)1, Memory Stick TM (MS), High Speed Memory Stick (HSMS), Memory Stick PRO (MSPRO), MS Duo TM , Secure Digital (SD), Mini-Secure Digital (Mini-SD), TransFlash (SD), MultiMediaCard TM (MMC), Reduced Size MultiMediaCard (RS-MMC), NAND Flash, Compact Flash TM (CF) and CF Ultra TM I & II, and CF form-factor ATA hard drives to USB2.0 bus—Supports USB Bulk Only Mass Storage CompliantBootable BIOSSupport for simultaneous operation of all above devices. (only one at a time of each of the following groupssupported: CF or ATA drive, SM or XD or NAND, SD or MMC)On-Chip 4-Bit High Speed Memory Stick and MS PRO Hardware CircuitryOn-Chip firmware reads and writes High Speed Memory Stick and MS PRO1-bit ECC correction performed in hardware for maximum efficiencyHardware support for SD Security Command Extensions On-chip power FETs for supplying flash media card power with minimum board components USB Bus Power Certified3.3 Volt I/O with 5V input tolerance on VBUS/GPIO3Complete USB Specification 2.0 Compatibility for Bus Powered Operation—Includes USB2.0 Transceiver— A Bi-directional Control and a Bi-directional BulkEndpoint are provided.8051 8 bit microprocessor—Provides low speed control functions—30 Mhz execution speed at 4 cycles per instructionaverage—12K Bytes of internal SRAM for general purposescratchpad—768 Bytes of internal SRAM for general purposescratchpad or program execution while re-flashing external ROMDouble Buffered Bulk Endpoint—Bi-directional 512 Byte Buffer for Bulk Endpoint —64 Byte RX Control Endpoint Buffer —64 Byte TX Control Endpoint BufferInternal or External Program Memory Interface—64K Byte Internal Code Space or Optional 64K ByteExternal Code Space using Flash, SRAM or EPROM memory.On Board 24Mhz Crystal Driver Circuit Can be clocked by 48MHz external sourceOn-Chip 1.8V Regulator for Low Power Core Operation Internal PLL for 480Mhz USB2.0 Sampling, Configurable MCU clockSupports firmware upgrade via USB bus if “boot block” Flash program memory is used15 GPIOs for special function use: LED indicators, button inputs, power control to memory devices, etc.—Inputs capable of generating interrupts with either edgesensitivity—Attribute bit controlled features:—Activity LED polarity/operation/blink rate —Full or Partial Card compliance checking —Bus or Self Powered—LUN configuration and assignment —Write Protect Polarity—SmartDetach™ Detach from USB when no CardInserted for Notebook apps—Cover Switch operation for xD compliance —Inquiry Command operation —SD Write Protect operation —Older CF card support —Force USB 1.1 reporting—Internal or External Power FET operationCompatible with Microsoft WinXP , WinME, Win2K SP3, Apple OS10, Softconnex, and Linux Multi-LUN Mass Storage Class DriversWin2K, Win98/98SE and Apple OS8.6 and OS9 Multi-LUN Mass Storage Class Drivers available from SMSC 128 Pin VTQFP Lead-free RoHS Compliant Package (1.0mm height, 14mm x14mm footprint)124 Pin DQFN Lead-free RoHS Compliant Package (0.8mm height, 10mm x10mm footprint)1.xD Picture Card not applicable to USB2227ORDER NUMBERS:USB2227/USB2228-NU-05 FOR 128 PIN, VTQFP LEAD-FREE ROHS COMPLIANT PACKAGE USB2227/USB2228-AHZS-XX FOR 124 PIN, DQFN LEAD-FREE ROHS COMPLIANT PACKAGE80 Arkay DriveHauppauge, NY 11788 (631) 435-6000 FAX (631) 273-3123Copyright © 2006 SMSC or its subsidiaries. All rights reserved.Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently, complete information sufficient for construction purposes is not necessarily given. Although the information has been checked and is believed to be accurate, no responsibility is assumed for inaccuracies. SMSC reserves the right to make changes to specifications and product descriptions at any time without notice. Contact your local SMSC sales office to obtain the latest specifications before placing your product order. The provision of this information does not convey to the purchaser of the described semiconductor devices any licenses under any patent rights or other intellectual property rights of SMSC or others. All sales are expressly conditional on your agreement to the terms and conditions of the most recently dated version of SMSC's standard Terms of Sale Agreement dated before the date of your order (the "Terms of Sale Agreement"). The product may contain design defects or errors known as anomalies which may cause the product's functions to deviate from published specifications. Anomaly sheets are available upon request. SMSC products are not designed, intended, authorized or warranted for use in any life support or other application where product failure could cause or contribute to personal injury or severe property damage. Any and all such uses without prior written approval of an Officer of SMSC and further testing and/or modification will be fully at the risk of the customer. Copies of this document or other SMSC literature, as well as the Terms of Sale Agreement, may be obtained by visiting SMSC’s website at . SMSC is a registered trademark of Standard Microsystems Corporation (“SMSC”). Product names and company names are the trademarks of their respective holders.SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES, INCLUDING WITHOUT LIMITATION ANY AND ALL IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, TITLE, AND AGAINST INFRINGEMENT AND THE LIKE,AND ANY AND ALL WARRANTIES ARISING FROM ANY COURSE OF DEALING OR USAGE OF TRADE. IN NO EVENT SHALL SMSC BE LIABLE FOR ANY DIRECT, INCIDENTAL, INDIRECT, SPECIAL, PUNITIVE, OR CONSEQUENTIAL DAMAGES; OR FOR LOST DATA,PROFITS, SAVINGS OR REVENUES OF ANY KIND; REGARDLESS OF THE FORM OF ACTION, WHETHER BASED ON CONTRACT;TORT; NEGLIGENCE OF SMSC OR OTHERS; STRICT LIABILITY; BREACH OF WARRANTY; OR OTHERWISE; WHETHER OR NOT ANY REMEDY OF BUYER IS HELD TO HAVE FAILED OF ITS ESSENTIAL PURPOSE, AND WHETHER OR NOT SMSC HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.4th Generation USB2.0 Flash Media Controller with Integrated Card Power FETsDatasheetRevision 1.91 (10-13-06)2SMSC USB2227/USB2228DATASHEET4th Generation USB2.0 Flash Media Controller with Integrated Card Power FETs DatasheetSMSC USB2227/USB22283Revision 1.91 (10-13-06)DATASHEETTable of ContentsChapter 1General Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Chapter 2Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Chapter 3Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Chapter 4Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Chapter 5Pin Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115.1PIN Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115.2Buffer Type Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20Chapter 6DC Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216.1Maximum Guaranteed Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216.2Recommended Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226.3Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24Chapter 7Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25Chapter 8GPIO Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274th Generation USB2.0 Flash Media Controller with Integrated Card Power FETsDatasheetRevision 1.91 (10-13-06)4SMSC USB2227/USB2228DATASHEETList of TablesTable 5.1USB2227/USB2228 Buffer Type Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20Table 6.1DC Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22Table 7.1USB2227/USB2228 128-Pin VTQFP Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 25Table 7.2USB2227/USB2228 124-Pin DQFN Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . 26Table 8.1GPIO Usage (ROM Rev 0x00) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274th Generation USB2.0 Flash Media Controller with Integrated Card Power FETs DatasheetSMSC USB2227/USB22285Revision 1.91 (10-13-06)DATASHEETList of FiguresFigure 3.1USB2227/USB2228 128-Pin VTQFP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Figure 3.2USB2227/USB2228 124-Pin DQFN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Figure 4.1USB2227/USB2228 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Figure 7.1USB2227/USB2228 128-Pin VTQFP Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25Figure 7.2USB2227/USB2228 124-Pin DQFN Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 264th Generation USB2.0 Flash Media Controller with Integrated Card Power FETsDatasheetRevision 1.91 (10-13-06)6SMSC USB2227/USB2228DATASHEETChapter 1 General DescriptionThe USB2227/USB2228 is a USB2.0 Bulk Only Mass Storage Class Peripheral Controller intended for supporting CompactFlash (CF and CF Ultra I/II) in True IDE Mode only, SmartMedia (SM) and XD cards, Memory Stick (MS), Memory Stick DUO (MSDUO) and Memory Stick Pro (MSPRO), Secure Digital (SD), and MultiMediaCard (MMC) flash memory devices. It provides a single chip solution for the most popular flash memory cards in the market.The device consists of a USB2.0 PHY and SIE, buffers, Fast 8051 microprocessor with expanded scratchpad, and program SRAM, and CF, MS, SM and SD controllers. The SD controller supports both SD and MMC devices. SM controller supports both SM and xD cards.Provisions for external Flash Memory up to 64K bytes for program storage is provided.12K bytes of scratchpad SRAM and 768 Bytes of program SRAM are also provided.Fifteen GPIO pins are provided for indicators, external serial EEPROM for OEM id and system configuration information, and other special functions.Internal power FETs are provided to directly supply power to the xD/SM, MMC/SD and MS/MSPro cards.The internal ROM program is capable of implementing any combination of single or multi-LUN CF/SD/MMC/SM/MS reader functions with individual card power control and activity indication. SMSC also provides licenses** for Win98 and Win2K drivers and setup utilities. Note: Please check with SMSC for precise features and capabilities for the current ROM code release.*Note: In order to develop, make, use, or sell readers and/or other products using or incorporating any of the SMSC devices made the subject of this document or to use related SMSC software programs, technical information and licenses under patent and other intellectual property rights from or through various persons or entities, including without limitation media standard companies,forums, and associations, and other patent holders may be required. These media standard companies, forums, and associations include without limitation the following: Sony Corporation (Memory Stick, Memory Stick Pro); SD3 LLC (Secure Digital); MultiMedia Card Association (MultiMediaCard); the SSFDC Forum (SmartMedia); the Compact Flash Association (Compact Flash); and Fuji Photo Film Co., Ltd., Olympus Optical Co., Ltd., and Toshiba Corporation (xD-Picture Card). SMSC does not make such licenses or technical information available; does not promise or represent that any such licenses or technical information will actually be obtainable from or through the various persons or entities (including the media standard companies, forums, and associations), or with respect to the terms under which they may be made available; and is not responsible for the accuracy or sufficiency of, or otherwise with respect to, any such technical information.SMSC's obligations (if any) under the Terms of Sale Agreement, or any other agreement with any customer, or otherwise, with respect to infringement, including without limitation any obligations to defend or settle claims, to reimburse for costs, or to pay damages, shall not apply to any of the devices made the subject of this document or any software programs related to any of such devices, or to any combinations involving any of them, with respect to infringement or claimed infringement of any existing or future patents related to solid state disk or other flash memory technology or applications ("Solid State Disk Patents"). By making any purchase of any of the devices made the subject of this document, the customer represents, warrants, and agrees that it has obtained all necessary licenses under then-existing Solid State Disk Patents for the manufacture, use and sale of solid state disk and other flash memory products and that the customer will timely obtain at no cost or expense to SMSC all necessary licenses under Solid State Disk Patents; that the manufacture and testing by or for SMSC of the units of any of the devices made the subject of this document which may be sold to the customer, and any sale by SMSC of such units to the customer, are valid exercises of the customer's rights and licenses under such Solid State Disk Patents; that SMSC shall have no obligation for royalties or otherwise under any Solid State Disk Patents by reason of any such manufacture, use, or sale of such units; and that SMSC shall have no obligation for any costs or expenses related to the customer's obtaining or having obtained rights or licenses under any Solid State Disk Patents.SMSC MAKES NO WARRANTIES, EXPRESS, IMPLIED, OR STATUTORY, IN REGARD TO INFRINGEMENT OR OTHER VIOLATION OF INTELLECTUAL PROPERTY RIGHTS. SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES AGAINST INFRINGEMENT AND THE LIKE.No license is granted by SMSC expressly, by implication, by estoppel or otherwise, under any patent, trademark, copyright, mask work right, trade secret, or other intellectual property right.**To obtain this software program the appropriate SMSC Software License Agreement must be executed and in effect. Forms of these Software License Agreements may be obtained by contacting SMSC.4th Generation USB2.0 Flash Media Controller with Integrated Card Power FETs DatasheetSMSC USB2227/USB22287Revision 1.91 (10-13-06)DATASHEETChapter 2 AcronymsSM: SmartMediaSMC: SmartMedia Controller FM: Flash MediaFMC: Flash Media Controller CF: Compact FlashCFC: CompactFlash Controller SD: Secure DigitalSDC: Secure Digital Controller MMC: MultiMediaCard MS : Memory StickMSC : Memory Stick Controller TPC: Transport Protocol Code. ECC: Error Checking and Correcting CRC: Cyclic Redundancy Checking4th Generation USB2.0 Flash Media Controller with Integrated Card Power FETsDatasheetRevision 1.91 (10-13-06)8SMSC USB2227/USB2228DATASHEETChapter 3 Pin ConfigurationFigure 3.1 USB2227/USB2228 128-Pin VTQFP4th Generation USB2.0 Flash Media Controller with Integrated Card Power FETs DatasheetSMSC USB2227/USB22289Revision 1.91 (10-13-06)DATASHEETFigure 3.2 USB2227/USB2228 124-Pin DQFNChapter5 Pin DescriptionsThis section provides a detailed description of each signal. The signals are arranged in functionalgroups according to their associated interface.The “n” symbol in the signal name indicates that the active, or asserted state occurs when the signalis at a low voltage level. When “n” is not present before the signal name, the signal is asserted whenat the high voltage level.The terms assertion and negation are used exclusively. This is done to avoid confusion when workingwith a mixture of “active low” and “active high” signal. The term assert, or assertion indicates that asignal is active, independent of whether that level is represented by a high or low voltage. The termnegate, or negation indicates that a signal is inactive.5.1 PIN DescriptionsSYMBOL 128-PINVTQFP124-PINDQFNBUFFERTYPE DESCRIPTION CompactFlash (In True IDE mode) INTERFACECF_nCS161A31O8PU CF Chip Select 1:This pin is the active low chip select 1 signal for the CFATA device.CF_nCS060B28O8PU CF Chip Select 0:This pin is the active low chip select 0 signal for the taskfile registers of CF ATA device in the True IDE mode. CF_SA264B30O8CF Register Address 2:This pin is the register select address bit 2 for the CFATA device.CF_SA163A32O8CF Register Address 1:This pin is the register select address bit 1 for the CFATA device.CF_SA062B29O8CF Register Address 0:This pin is the register select address bit 0 for the CFATA device.CF_IRQ55B26IPD CF Interrupt:This is the active high interrupt request signal from theCF device.CF_D[15:8]5251504846454140A26B24A25A24B22A23A21A20I/O8PD CF Data 15-8:The bi-directional data signals CF_D15-CF_D8 in TrueIDE mode data transfer.In the True IDE Mode, all of task file register operationoccur on the CF_D[7:0], while the data transfer is onCF_D[15:0].The bi-directional data signal has an internal weak pull-down resistor.CF_D[7:0]3938373635343332B19A19B18A18B17A17B16B15I/O8PD CF Data 7-0:The bi-directional data signals CF_D7-CF_D0 in theTrue IDE mode data transfer.In the True IDE Mode, all of task file register operationoccur on the CF_D[7:0], while the data transfer is onCF_D[15:0].The bi-directional data signal has an internal weak pull-down resistor.CF_IORDY56A28IPU IO Ready:This pin is active high input signal.This pin has an internally controlled weak pull-upresistor.CF_nCD254A27IPU CF Card Detection2:This card detection pin is connected to the ground onthe CF device, when the CF device is inserted.This pin has an internally controlled weak pull-upresistor.CF_nCD153B25IPU CF Card Detection1:This card detection pin is connected to ground on theCF device, when the CF device is inserted.This pin has an internally controlled weak pull-upresistor.CF_nRESET59A30O8CF Hardware Reset:This pin is an active low hardware reset signal to CFdevice.CF_nIOR57A29O8CF IO Read:This pin is an active low read strobe signal for CFdevice.CF_nIOW58B27O8CF IO Write Strobe:This pin is an active low write strobe signal for CFdevice.SmartMedia INTERFACESM_nWP74B35O8PD SM Write Protect:This pin is an active low write protect signal for the SMdevice.This pin has a weak pull-down resistor that ispermanently enabled.SM_ALE73A37O8PD SM Address Strobe:This pin is an active high Address Latch Enable signalfor the SM device.This pin has a weak pull-down resistor that ispermanently enabled.SYMBOL VTQFP DQFN TYPE DESCRIPTIONSM_CLE75A38O8PD SM Command Strobe:This pin is an active high Command Latch Enable signalfor the SM device.This pin has a weak pull-down resistor that ispermanently enabled.SM_D[7:0]7271706968676665B34A36A35B33A34B32A33B31I/O8PD SM Data 7-0:These pins are the bi-directional data signal SM_D7-SM_D0.The bi-directional data signal has an internal weak pull-down resistor.SM_nRE81A4108PU SM Read Enable:This pin is an active low read strobe signal for SMdevice.When using the internal FET, this pin has an internalweak pull-up resistor that is tied to the output of theinternal Power FET.08If an external FET is used (Internal FET is disabled),then the internal pull-up is not available (external pull-ups must be used, and should be connected to theapplicable Card Power Supply).SM_nWE82B39O8PU SM Write Enable:This pin is an active low write strobe signal for SMdevice.When using the internal FET, this pin has an internalweak pull-up resistor that is tied to the output of theinternal Power FET.08If an external FET is used (Internal FET is disabled),then the internal pull-up is not available (external pull-ups must be used, and should be connected to theapplicable Card Power Supply).SM_nWPS76B36IPU SM Write Protect Switch:A write-protect seal is detected, when this pin is low.This pin has an internally controlled weak pull-upresistor.SM_nB/R77A39I SM Busy or Data Ready:This pin is connected to the BSY/RDY pin of the SMdevice.An external pull-up resistor is required on this signal.The pull-up resistor must be pulled up to the samepower source that powers the SM/NAND flash device. SYMBOL VTQFP DQFN TYPE DESCRIPTIONSM_nCE83A42O8PU SM Chip Enable:This pin is the active low chip enable signal to the SMdevice.When using the internal FET, this pin has an internalweak pull-up resistor that is tied to the output of theinternal Power FET.08If an external FET is used (Internal FET is disabled),then the internal pull-up is not available (external pull-ups must be used, and should be connected to theapplicable Card Power Supply).SM_nCD78B37IPU SM Card Detection:This is the card detection signal from SM device toindicate if the device is inserted.This pin has an internally controlled weak pull-upresistor.MEMORY STICK INTERFACEMS_BS24A12O8MS Bus State:This pin is connected to the BS pin of the MS device.It is used to control the Bus States 0, 1, 2 and 3 (BS0,BS1, BS2 and BS3) of the MS device.MS_SDIO/MS_D019B9I/O8PD MS System Data In/Out:This pin is a bi-directional data signal for the MS device.Most significant bit (MSB) of each byte is transmittedfirst by either MSC or MS device.The bi-directional data signal has an internal weak pull-down resistor.MS_D120A10I/O8PD MS System Data In/Out:This pin is a bi-directional data signal for the MS device.This pin has internally controlled weak pull-up and pull-down resistors for various operational modes.MS_D[3:2]2221A11B10I/O8PD MS System Data In/Out:This pin is a bi-directional data signal for the MS device.The bi-directional data signal has an internal weak pull-down resistor.MS_INS18A9IPU MS Card Insertion:This pin is the card detection signal from the MS deviceto indicate, if the device is inserted.This pin has an internally controlled weak pull-upresistor.SYMBOL VTQFP DQFN TYPE DESCRIPTIONMS_SCLK23B11O8MS System CLK:This pin is an output clock signal to the MS device.The clock frequency is software configurable.SD INTERFACESD_DAT[3:0]29282726A15B13A14B12I/O8PU SD Data 3-0:These are bi-directional data signals.These pins have internally controlled weak pull-upresistors.SD_CLK31A16O8SD Clock:This is an output clock signal to SD/MMC device.The clock frequency is software configurable.SD_CMD30B14I/O8PU SD Command:This is a bi-directional signal that connects to the CMDsignal of SD/MMC device.This pin has an internally controlled weak pull-upresistor.SD_nWP25A13IPD SD Write Protected:This pin is an input signal with an internal weak pull-down.This pin has an internally controlled weak pull-downresistor.USB INTERFACEUSBDM USBDP 8788A44B41IO-U USB Bus Data:These pins connect to the USB bus data signals.RBIAS98A49I USB Transceiver Bias:A 12.0kΩ, ± 1.0% resistor is attached from VSSA to thispin, in order to set the transceiver’s internal biascurrents.ATEST99B47AIO Analog Test:This signal is used for testing the analog section of thechip and should be connected to VDDA33 for normaloperation.VDD18PLL101B48 1.8v Power for the PLLVSSPLL104A52PLL Ground Reference:Ground Reference for 1.8v PLL powerVDDA3389A45 3.3v Analog PowerVSSA86A43Analog Ground Reference:Analog Ground Reference for 3.3v Analog Power. SYMBOL VTQFP DQFN TYPE DESCRIPTIONXTAL1/ CLKIN 102A51ICLKx Crystal Input/External Clock Input:24Mhz Crystal or external clock input.This pin can be connected to one terminal of the crystalor can be connected to an external 24Mhz clock whena crystal is not used.Note:The ‘MA[2:0] pins will be sampled whilenRESET is asserted, and the value will belatched upon nRESET negation. This willdetermine the clock source and value.XTAL2103B49OCLKx Crystal Output:24Mhz CrystalThis is the other terminal of the crystal, or left open whenan external clock source is used to drive XTAL1/CLKIN.It may not be used to drive any external circuitry otherthan the crystal circuit.MEMORY/IO INTERFACEMD[7:0]12111098765B6A6B5A5A4B4A3B3I/O8PU Memory Data Bus:When ROMEN bit of GPIO_IN1 register = 0, thesesignals are used to transfer data between the internalCPU and the external program memory.These pins have internally controlled weak pull-upresistors.MA[15:3]421128127126125124123122121120119A2A1B1B60A64B59A63B58A62B57A61A60B56O8Memory Address Bus:These signals address memory locations within theexternal memory.SYMBOL VTQFP DQFN TYPE DESCRIPTIONMA2/ SEL_CLKDRV 118A59I/O8PD Memory Address Bus:MA2 Addresses memory locations within the externalmemory.SEL_CLKDRV. During nRESET assertion, this pins willselect the operating clock mode (crystal or externallydriven clock source), and a weak pull-down resistor isenabled. When nRESET is negated, the value will beinternally latched and this pin will revert to MA2functionality, the internal pull-down will be disabled.‘0’ = Crystal operation (24MHz only)‘1’ = Externally driven clock source (24MHz or 48MHz)Note:If the latched value is ‘1’, then the MA2 pin istri-stated when the following conditions aretrue:1.IDLE bit (PCON.0) is 1.2.INT2 is negated3.SLEEP bit of CLOCK_SEL is 1.If the latched value is ‘0’, then the MA2 pin will functionidentically to the MA[15:3] pins at all times (other thanduring nRESET assertion).MA[1:0]/CLK_ SEL[1:0]117116B55A58I/O8PD Memory Address Bus:MA[1:0], These signals address memory locations withinthe external memory.SEL[1:0]. During nRESET assertion, these pins willselect the operating frequency of the external clock, andthe corresponding weak pull-down resistors are enabled.When nRESET is negated, the value on these pins willbe internal latched and these pins will revert to MA[1:0]functionality, the internal pull-downs will be disabled.SEL[1:0] = ‘00’. 24MHzSEL[1:0] = ‘01’. RESERVEDSEL[1:0] = ‘10’. RESERVEDSEL[1:0] = ‘11’. 48MHzNote:If the latched value is ‘1’, then thecorresponding MA pin is tri-stated when thefollowing conditions are true:1.IDLE bit (PCON.0) is 1.2.INT2 is negated3.SLEEP bit of CLOCK_SEL is 1.If the latched value is ‘0’, then the corresponding MA pinwill function identically to the MA[15:3] pins at all times(other than during nRESET assertion).nMWR14B7O8Memory Write Strobe:Program Memory Write; active low nMRD13A7O8Memory Read Strobe:Program Memory Read; active low SYMBOL VTQFP DQFN TYPE DESCRIPTION。
DT220技术规范
DT220全数字电力线载波机技术规范一、工作环境1. 工作条件：符合IEC721-3-3，3K5级环境温度：0℃～＋45℃保证指标－10℃～＋55℃保证工作相对湿度： 5～95％海拔高度：＜5000米2. 储存条件：符合IEC721-3-2, 1K5级温度－20～＋60℃3. 运输条件：符合IEC721-3-2, 2K5级温度－20～＋60℃二、工作电源1. 交流AC220V，50Hz，电源波动±20％保证指标直流DC－48V 电源波动±20％保证指标两种供电方式并能自动无损伤切换。
2. 功耗设备工作功耗≤120W三、系统部分1. 基本载波频带：4KHz2. 载波频带范围：40~500KHz频率软件设置，全频段现场可调3. 通道容量：在4KHz带宽内可同时传输4路（2路话音2路数据），模块化结构。
4. 线路传输速率： 4.8、7.2、9.6、12.0……33.6Kbps（可编程设置）5. 标称线路衰耗：40dB最大允许衰耗：70dB6. 标称载波功率：5W/10W/20W/40W/60W（可选）7. 标称载波输出阻抗：75Ω（不平衡式）8. 高频调制方式：全数字一次调制（OQPSK，交错四相相移键控调制）调制码型：HDB3(三阶高密度双极性码)9. 线路均衡：40～500KHz每隔200Hz自动测试数字均衡10. 载波频率间隔：本机收发：间隔≥0B同相并机：发发≥3B发收≥2B收收≥2B邻相并机：发发≥0B发收≥0B收收≥0B11. 回波损耗：≥16dB12. 并机分流损耗：≤0.8dB13. 带内平坦度：4KHz带内抖动＜0.01dB14. 机内噪声(dBmop)：四线收：≤－80dBmop15. 对地平衡度：四线发：≥60dB四线收：≥60dB16. 通路幅度特性：＜0.1dB17. 自动增益控制容差范围（衰减变化：－15dB～＋27dB）：≤0.1 dB18. 外型尺寸：482mm×355mm×355mm（宽×高×深）四、语音、传真通道1. 语音带宽：300～3400Hz2. 语音接口：Bell五种类型4WE/M接口FXS （2W电话用户）FXO (交换机用户)阻抗600Ω，平衡式3. 语音编码速率：4800，6400bps（可选）4. 传真速率：2400、4800 bps（可选）五、数据通道1. 传输速率：300、600、1200、2400、4800、9600、19200bps可选2. 接口类型：RS-232异步数据（V.24、V.28）连接方式，DB9,RS485；模拟四线、二线远动接口（内置调制解调器）3. 数据通道时延：≤180ms4. 采用校验方式自动识别技术，可自动适应数据的传输；5. 具有长帧数据发送端分拆和接收端重新封装功能，分拆和重新封装帧数为0～100帧。