三星Exynos 4 Quad (Exynos 4412) RISC微处理器用户手册

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Samsung Exynos 4 Quad
(Exynos 4412)
RISC Microprocessor
Revision 1.00
October 2012 U s e r's M a n u a l
2012 Samsung Electronics Co., Ltd. All rights reserved.
Important Notice
Samsung Electronics Co. Ltd. (“Samsung”) reserves the right to make changes to the information in this publication at any time without prior notice. All information provided is for reference purpose only. Samsung assumes no responsibility for possible errors or omissions, or for any consequences resulting from the use of the information contained herein.
This publication on its own does not convey any license, either express or implied, relating to any Samsung and/or third-party products, under the intellectual property rights of Samsung and/or any third parties.
Samsung makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Samsung assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability, including without limitation any consequential or incidental damages.
Customers are responsible for their own products and applications. "Typical" parameters can and do vary in different applications. All operating parameters, including "Typicals" must be validated for each customer application by the customer's technical experts.
Samsung products are not designed, intended, or authorized for use in applications intended to support or sustain life, or for any other application in which the failure of the Samsung product could reasonably be expected to create a situation where personal injury or death may occur. Customers acknowledge and agree that they are solely responsible to meet all other legal and regulatory requirements regarding their applications using Samsung products notwithstanding any information provided in this publication. Customer shall indemnify and hold Samsung and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, expenses, and reasonable attorney fees arising out of, either directly or indirectly, any claim (including but not limited to personal injury or death) that
may be associated with such unintended, unauthorized
and/or illegal use.
WARNING No part of this publication may be reproduced, stored in a retrieval system, or transmitted in any form or by any means, electric or mechanical, by photocopying, recording, or otherwise, without the prior written consent of Samsung. This publication is intended for use by designated recipients only. This publication contains confidential information (including trade secrets) of Samsung protected
by Competition Law, Trade Secrets Protection Act and other related laws, and therefore may not be, in part or in whole, directly or indirectly publicized, distributed, photocopied or used (including in a posting on the Internet where unspecified access is possible) by any unauthorized third party. Samsung reserves its right to take any and all measures both in equity and law available to it and claim full damages against any party that misappropriates Samsung’s trade secrets and/or confidential information.
警告本文件仅向经韩国三星电子株式会社授权的人员提供,其内容含有商业秘密保护相关法规规定并受其保护的三星电
子株式会社商业秘密,任何直接或间接非法向第三人披露、
传播、复制或允许第三人使用该文件全部或部分内容的行为(包括在互联网等公开媒介刊登该商业秘密而可能导致不特
定第三人获取相关信息的行为)皆为法律严格禁止。

此等违
法行为一经发现,三星电子株式会社有权根据相关法规对其
采取法律措施,包括但不限于提出损害赔偿请求。

Copyright 2012 Samsung Electronics Co., Ltd.
Samsung Electronics Co., Ltd.
San #24 Nongseo-Dong, Giheung-Gu
Yongin-City, Gyeonggi-Do, Korea 446-711 Contact Us: bach1004@
Home Page:
Trademarks
All brand names, trademarks and registered trademarks belong to their respective owners.
∙Exynos, Exynos4412, FlexOneNAND, and OneNAND are trademarks of Samsung Electronics.
∙ARM, Jazelle, TrustZone, and Thumb are registered trademarks of ARM Limited.
∙Cortex, ETM, ETB, Coresight, ISA, and Neon are trademarks of ARM Limited.
∙Java is a trademark of Sun Microsystems, Inc.
∙SD is a registered trademark of Toshiba Corporation.
∙MMC and eMMC are trademarks of MultiMediaCard Association.
∙JTAG is a registered trademark of JTAG Technologies, Inc.
∙Synopsys is a registered trademark of Synopsys, Inc.
∙I2S is a trademark of Phillips Electronics.
∙I2C is a trademark of Phillips Semiconductor Corp.
∙MIPI and Slimbus are registered trademarks of the Mobile Industry Processor Interface (MIPI) Alliance. All other trademarks used in this publication are the property of their respective owners.
Chip Handling Guide
Precaution against Electrostatic Discharge
When using semiconductor devices, ensure that the environment is protected against static electricity:
1. Wear antistatic clothes and use earth band.
2. All objects that are in direct contact with devices must be made up of materials that do not produce static
electricity.
3. Ensure that the equipment and work table are earthed.
4. Use ionizer to remove electron charge.
Contamination
Do not use semiconductor products in an environment exposed to dust or dirt adhesion.
Temperature/Humidity
Semiconductor devices are sensitive to:
∙Environment
∙Temperature
∙Humidity
High temperature or humidity deteriorates the characteristics of semiconductor devices. Therefore, do not store or use semiconductor devices in such conditions.
Mechanical Shock
Do not to apply excessive mechanical shock or force on semiconductor devices.
Chemical
Do not expose semiconductor devices to chemicals because exposure to chemicals leads to reactions that deteriorate the characteristics of the devices.
Light Protection
In non- Epoxy Molding Compound (EMC) package, do not expose semiconductor IC to bright light. Exposure to bright light causes malfunctioning of the devices. However, a few special products that utilize light or with security functions are exempted from this guide.
Radioactive, Cosmic and X-ray
Radioactive substances, cosmic ray, or X-ray may influence semiconductor devices. These substances or rays may cause a soft error during a device operation. Therefore, ensure to shield the semiconductor devices under environment that may be exposed to radioactive substances, cosmic ray, or X-ray.
EMS (Electromagnetic Susceptibility)
Strong electromagnetic wave or magnetic field may affect the characteristic of semiconductor devices during the operation under insufficient PCB circuit design for Electromagnetic Susceptibility (EMS).
Revision History
Revision Descriptions for Revision 1.00
Table of Contents
1 PRODUCT OVERVIEW ................................................................................. 1-1
1.1 Introduction .............................................................................................................................................. 1-1
1.2 Features ................................................................................................................................................... 1-2
1.2.1 Multi-Core Processing Unit ............................................................................................................... 1-4
1.2.2 Memory Subsystem .......................................................................................................................... 1-5
1.2.3 Multimedia ........................................................................................................................................ 1-6
1.2.4 Audio Subsystem .............................................................................................................................. 1-8
1.2.5 Image Signal Processing Subsystem ............................................................................................... 1-8
1.2.6 Connectivity ...................................................................................................................................... 1-9
1.2.7 System Peripheral .......................................................................................................................... 1-11
1.3 Conventions ........................................................................................................................................... 1-13
1.3.1 Register RW Conventions .............................................................................................................. 1-13
1.3.2 Register Value Conventions ........................................................................................................... 1-13
2 MEMORY MAP .............................................................................................. 2-1
2.1 Overview .................................................................................................................................................. 2-1
2.2 SFR Base Address .................................................................................................................................. 2-2
3 CHIP ID .......................................................................................................... 3-1
3.1 Overview .................................................................................................................................................. 3-1
3.2 Register Description ................................................................................................................................. 3-2
3.2.1 Register Map Summary .................................................................................................................... 3-2
4 GENERAL PURPOSE INPUT/OUTPUT (GPIO) CONTROL ......................... 4-1
4.1 Overview .................................................................................................................................................. 4-1
4.2 Features ................................................................................................................................................... 4-3
4.2.1 Input/Output Description ................................................................................................................... 4-3
4.3 Register Description ................................................................................................................................. 4-5
4.3.1 Registers Summary .......................................................................................................................... 4-5
4.3.2 Part 1 .............................................................................................................................................. 4-20
4.3.3 Part 2 ............................................................................................................................................ 4-124
4.3.4 Part 3 ............................................................................................................................................ 4-289
4.3.5 Part 4 ............................................................................................................................................ 4-298
5 CLOCK MANAGEMENT UNIT ...................................................................... 5-1
5.1 Overview .................................................................................................................................................. 5-1
5.2 Clock Domains ......................................................................................................................................... 5-1
5.3 Clock Declaration ..................................................................................................................................... 5-3
5.3.1 Clocks from Clock Pads ................................................................................................................... 5-3
5.3.2 Clocks from CMU .............................................................................................................................. 5-4
5.4 Clock Relationship ................................................................................................................................... 5-5
5.4.1 Recommended PLL PMS Value for APLL and MPLL ...................................................................... 5-7
5.4.2 Recommended PLL PMS Value for EPLL ........................................................................................ 5-8
5.4.3 Recommended PLL PMS Value for VPLL ........................................................................................ 5-9
5.5 Clock Generation ................................................................................................................................... 5-10
5.6 Clock Configuration Procedure .............................................................................................................. 5-15
5.6.1 Clock Gating ................................................................................................................................... 5-16
5.6.2 Clock Diving .................................................................................................................................... 5-16
5.7 Special Clock Description ...................................................................................................................... 5-17
5.7.1 Special Clock Table ........................................................................................................................ 5-17
5.8 CLKOUT ................................................................................................................................................. 5-20
5.9 I/O Description ....................................................................................................................................... 5-23
5.10 Register Description ............................................................................................................................. 5-24
5.10.1 Register Map Summary ................................................................................................................ 5-26
6 INTERRUPT CONTROLLER ......................................................................... 6-1
6.1 Overview .................................................................................................................................................. 6-1
6.2 Features ................................................................................................................................................... 6-2
6.2.1 Security Extensions Support ............................................................................................................ 6-2
6.2.2 Implementation-Specific Configurable Features .............................................................................. 6-3
6.3 Interrupt Source ....................................................................................................................................... 6-4
6.3.1 Interrupt Sources Connection ........................................................................................................... 6-4
6.3.2 GIC Interrupt Table ........................................................................................................................... 6-5
6.4 Functional Overview .............................................................................................................................. 6-13
6.5 Register Description ............................................................................................................................... 6-14
6.5.1 Register Map Summary .................................................................................................................. 6-14
7 INTERRUPT COMBINER .............................................................................. 7-1
7.1 Overview .................................................................................................................................................. 7-1
7.2 Features ................................................................................................................................................... 7-1
7.3 Functional Description ............................................................................................................................. 7-2
7.3.1 Block Diagram .................................................................................................................................. 7-2
7.4 Interrupt Sources...................................................................................................................................... 7-3
7.4.1 Interrupt Combiner ............................................................................................................................ 7-3
7.5 Functional Description ............................................................................................................................. 7-8
7.6 Register Description ................................................................................................................................. 7-9
7.6.1 Register Map Summary .................................................................................................................... 7-9
7.6.2 Interrupt Combiner .......................................................................................................................... 7-10
8 DIRECT MEMORY ACCESS CONTROLLER (DMAC) ................................. 8-1
8.1 Overview .................................................................................................................................................. 8-1
8.2 Features ................................................................................................................................................... 8-2
8.3 Register Description ................................................................................................................................. 8-5
8.3.1 Register Map Summary .................................................................................................................... 8-5
8.4 Instruction ............................................................................................................................................... 8-14
9 SROM CONTROLLER ................................................................................... 9-1
9.1 Overview .................................................................................................................................................. 9-1
9.2 Features ................................................................................................................................................... 9-1
9.3 Block Diagram .......................................................................................................................................... 9-1
9.4 Functional Description ............................................................................................................................. 9-2
9.4.1 nWAIT Pin Operation ........................................................................................................................ 9-2
9.4.2 Programmable Access Cycle ........................................................................................................... 9-3
9.5 I/O Description ......................................................................................................................................... 9-4
9.6 Register Description ................................................................................................................................. 9-5
9.6.1 Register Map Summary .................................................................................................................... 9-5
10 NAND FLASH CONTROLLER .................................................................. 10-1
10.1 Overview .............................................................................................................................................. 10-1
10.2 Features ............................................................................................................................................... 10-1
10.3 Functional Description ......................................................................................................................... 10-2
10.3.1 Block Diagram .............................................................................................................................. 10-2
10.3.2 NAND Flash Memory Timing ........................................................................................................ 10-3
10.4 Software Mode ..................................................................................................................................... 10-4
10.4.1 Data Register Configuration ......................................................................................................... 10-4
10.4.2 1/4/8/12/16-bit ECC ...................................................................................................................... 10-5
10.4.3 2048 Byte 1-bit ECC Parity Code Assignment Table ................................................................... 10-6
10.4.4 32 Byte 1-bit ECC Parity Code Assignment Table ....................................................................... 10-6
10.4.5 1-bit ECC Module Features .......................................................................................................... 10-6
10.4.6 1-bit ECC Programming Guide ..................................................................................................... 10-7
10.4.7 4-bit ECC Programming Guide (ENCODING) .............................................................................. 10-8
10.4.8 4-bit ECC Programming Guide (DECODING) .............................................................................. 10-9
10.4.9 8/12/16-bit ECC Programming Guide (ENCODING) .................................................................. 10-10
10.4.10 8/12/16-bit ECC Programming Guide (DECODING) ................................................................ 10-11
10.4.11 ECC Parity Conversion Code Guide for 8/12/16-bit ECC ........................................................ 10-12
10.4.12 Lock Scheme for Data Protection ............................................................................................. 10-13
10.5 Programming Constraints .................................................................................................................. 10-14
10.6 I/O Description ................................................................................................................................... 10-14
10.7 Register Description ........................................................................................................................... 10-15
10.7.1 Register Map Summary .............................................................................................................. 10-15
10.7.2 NAND Flash Interface and 1/4-bit ECC Registers ...................................................................... 10-17
10.7.3 ECC Registers for 8, 12 and 16-bit ECC .................................................................................... 10-29
11 PULSE WIDTH MODULATION TIMER ..................................................... 11-1
11.1 Overview .............................................................................................................................................. 11-1
11.2 Features ............................................................................................................................................... 11-4
11.3 PWM Operation.................................................................................................................................... 11-5
11.3.1 Prescaler and Divider ................................................................................................................... 11-5
11.3.2 Basic Timer Operation .................................................................................................................. 11-6
11.3.3 Auto-Reload and Double Buffering ............................................................................................... 11-8
11.3.4 Timer Operation Example ............................................................................................................. 11-9
11.3.5 Initialize Timer (Setting Manual-Up Data and Inverter) .............................................................. 11-10
11.3.6 PWM ........................................................................................................................................... 11-10
11.3.7 During Current ISR. (Interrupt Service Routine) Output Level Control ...................................... 11-11
11.3.8 Dead Zone Generator ................................................................................................................. 11-12
11.4 I/O Description ................................................................................................................................... 11-13
11.5 Register Description ........................................................................................................................... 11-14
11.5.1 Register Map Summary .............................................................................................................. 11-14
12 WATCHDOG TIMER .................................................................................. 12-1
12.1 Overview .............................................................................................................................................. 12-1
12.2 Features ............................................................................................................................................... 12-1
12.3 Functional Description ......................................................................................................................... 12-2
12.3.1 WDT Operation ............................................................................................................................. 12-2
12.3.2 WTDAT and WTCNT .................................................................................................................... 12-3
12.3.3 WDT Start ..................................................................................................................................... 12-3
12.3.4 Consideration of Debugging Environment .................................................................................... 12-3
12.4 Register Description ............................................................................................................................. 12-4
12.4.1 Register Map Summary ................................................................................................................ 12-4
13 UNIVERSAL ASYNCHRONOUS RECEIVER AND TRANSMITTER ......... 13-1
13.1 Overview .............................................................................................................................................. 13-1
13.2 Features ............................................................................................................................................... 13-0
13.3 UART Description ................................................................................................................................ 13-1
13.3.1 Data Transmission ........................................................................................................................ 13-2
13.3.2 Data Reception ............................................................................................................................. 13-2
13.3.3 AFC ............................................................................................................................................... 13-3
13.3.4 Example of Non AFC (Controlling nRTS and nCTS by Software) ............................................... 13-4
13.3.5 Trigger Level of Tx/Rx FIFO and DMA Burst Size in DMA Mode ................................................ 13-4
13.3.6 RS-232C Interface ........................................................................................................................ 13-4
13.3.7 Interrupt/DMA Request Generation .............................................................................................. 13-5
13.3.8 UART Error Status FIFO .............................................................................................................. 13-7
13.4 UART Input Clock Description ........................................................................................................... 13-10
13.5 I/O Description ................................................................................................................................... 13-11
13.6 Register Description ........................................................................................................................... 13-12
13.6.1 Register Map Summary .............................................................................................................. 13-12
14 INTER-INTEGRATED CIRCUIT ................................................................. 14-1
14.1 Overview .............................................................................................................................................. 14-1
14.2 Features ............................................................................................................................................... 14-2
14.3 Functional Description ......................................................................................................................... 14-2
14.3.1 Block Diagram .............................................................................................................................. 14-2
14.4 I2C-Bus Interface Operation ................................................................................................................ 14-3
14.4.1 Start and Stop Conditions ............................................................................................................. 14-4
14.4.2 Data Transfer Format ................................................................................................................... 14-5
14.4.3 ACK Signal Transmission ............................................................................................................. 14-6
14.4.4 Read-Write Operation ................................................................................................................... 14-7
14.4.5 Bus Arbitration Procedures ........................................................................................................... 14-7
14.4.6 Abort Conditions ........................................................................................................................... 14-7
14.4.7 Configuring I2C-Bus ..................................................................................................................... 14-7
14.4.8 Flowcharts of Operations in Each Mode ...................................................................................... 14-8
14.5 I/O Description ................................................................................................................................... 14-12
14.6 Register Description ........................................................................................................................... 14-13
14.6.1 Register Map Summary .............................................................................................................. 14-13
15 SERIAL PERIPHERAL INTERFACE ......................................................... 15-1
15.1 Overview .............................................................................................................................................. 15-1
15.2 Features ............................................................................................................................................... 15-1
15.2.1 Operation of SPI ........................................................................................................................... 15-2
15.3 SPI Input Clock Description ................................................................................................................. 15-5
15.4 IO Description ...................................................................................................................................... 15-6
15.5 Register Description ............................................................................................................................. 15-7
15.5.1 Register Map Summary ................................................................................................................ 15-7
16 DISPLAY CONTROLLER .......................................................................... 16-1
16.1 Overview .............................................................................................................................................. 16-1
16.2 Features ............................................................................................................................................... 16-2
16.3 Functional Description ......................................................................................................................... 16-4
16.3.1 Brief Description ........................................................................................................................... 16-4。

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