KEXIN-PP-PrdGR-TM
Keithley 36,00 Series SCPI 可编程直流电源说明书
36, 00 series SCPIProgrammable DC Power Supply© Copyright 2004 All Rights Reserved Ver2.0 /Sep 2005/DirectoryAbout your safety (3)Certification and Warranty (3)Chapter 1 Remote Operation Mode (5)Chapter 2 SCPI Order List (5)2.1 IEEE488.2 Common Order (5)2.2 SCPI Essential Order (5)2.3 Calibration Order (6)2.4 Output Order (6)2.5 Output Measure Order (6)Chapter 3 SCPI Condition Register (6)Chapter 4 SCPI Order Description (9)4.1 IEEE488.2 Common Order (9)4.2 SCPI Essential Order (10)4.3 Output Order (12)4.4 Input measurement order (13)About your safetyPease review the following safety precautions before operating our equipment.General informationThe following safety precautions should be observed before using this product and any associated instrumentations. Although some instruments and accessories would be used with non-hazardous voltages, there are situations where hazardous conditions may be present.This product is intended for use by qualified personnel who recognize shock hazards and are familiar with the safety precautions required to avoid possible injury. Read and follow all installation, operation, and maintenance information carefully before using the product. Refer to this manual for complete product specifications.If the product is used in a manner not specified, the protection provided by the product may be impaired.Before performing any maintenance, disconnect the line cord and all test cables.Protection from electric shockOperators of this instrument must be protected from electric shock at all times. The responsible body must ensure that operators are prevented access and/or insulated from every connection point. In some cases, connections must be exposed to potential human contact. Product operators in these circumstances must be trained to protect themselves from the risk of electric shock. If the circuit is capable of operating at or above 1000 volts, no conductive part of the circuit may be exposed.Definition of usersResponsible body is the individual or group responsible for the use and maintenance of equipment is operated within its specifications and operating limits, and for ensuring that operators are adequately trained.Operators use the product for its intended function. They must be trained in electrical safety procedures and proper use of the instrument. They must be protected from electric shock and contact with hazardous live circuits.Service is only to be performed by qualified service personnel.Safety symbols and termsConnect it to safety earth ground using the wire recommended in the usermanual.The symbol on an instrument indicates that the user should refer to the operatinginstructions located in the manual.High voltage dangerCertification and WarrantyCertificationWe certify that this product met its published specifications at time of shipment from the factory.WarrantyThis instrument product is warranted against defects in material and workmanship for a period of one year from date of delivery. During the warranty period we will, at its option, either repair or replace products which prove to be defective. For warranty service, with the exception of warranty options, this product must be returned to a service facility designated by us. Customer shall prepay shipping charges by (and shall pay all duty and taxes) for products returned to the supplier for warranty service. Except for products returned to customer from another country, supplier shall pay for return of products to customer.Limitation of WarrantyThe foregoing warranty shall not apply to defects resulting from improper or inadequate maintenance by the Customer, Customer-supplied software or interfacing, unauthorized modification or misuse, operation outside of the environmental specifications for the product, or improper site preparation and maintenance.Chapter 1 Remote Operation ModeE133 GPIB Communication CableThe DB9 interface connector on the rear panel of power supply is TTL voltage level; you can use the GPIB communication cable (E133) to connect the DB9 interface connector of the power supply, and then connect the GPIB interface of the E133 and computer with GPIB/IEEE 488 lineChapter 2 SCPI &RPPDQG List2.1 IEEE488.2 Common &RPPDQGV"*CLS""*ESE""*ESE?""*ESR?","*IDN?","*SRE","*SRE?","*STB?",2.2 SCPI Essential &RPPDQGVSYSTem:ERRor[:NEXT]?:VERSion?STATus:QUEStionable[:EVENt]?:CONDition?:ENABle <VALUE>:ENABle?2.3 Calibration &RPPDQGV CALibration :SECure [:STATe] {<ON|OFF>,<quoted code>} ]:STATe]? :VOLTage :LEVel {<level> } [:DATA] {<numeric value>} :CURRent :LEVel {<level> } [:DATA] {<numeric value>} :SAVe :INITital 2.4 Output &RPPDQGV OUTPut [:STATe] <b> [:STATe]? [SOURce:] VOLTage [:LEVel][:IMMediate][:AMPLitude] [:A MPLitude]? :PROTection[:LEVel] [:LEVel]? CURRent [:LEVel][:IMMediate][:AMPLitude] [:A MPLitude]?2.5 Output Measure &RPPDQGV MEASure [:SCALar] :VOLTage[:DC]? :CURRent[:DC]? :POWer[:DC]? Chapter 3 SCPI Condition RegisterYou can get the condition of power supply and read parameter from the operation register. The power supply can get the different state by 4 condition registers. These registers are status byte register, standard event register, quest condition register and operation status register. The status byte register stores the information of 3 other register. You can get each register’s meaning from the following table:B IT Signal Meaning 0 CV 23(5ation status register. The power supply is in constant voltage condition.1 CC The power supply is in constant current condition.0 1 OTUNRQuest condition registerOvertemperatureThe output of power supply is unregulated.0 2 34 57 OPCQYEDDEEXECMEPONStandard event status registerOperation of power supply is completed.Query error. Data of output array is missing.Device-dependent error. Data stored in register is missing or error occursin preliminary checkout.Execution error. Order parameter overflows or the condition is not right.Command error. Syntax or semantic error occurs when receivinginformation.Power on. It is 1when power supply is reset.3 4 5 6 7 QUESMAVESBMSSRQSOPERStatus byte registerIf a quest enable condition changes, QUES is 1.If the output array buffer storage is not empty, MAV is 1.If a standard event status enable register changes, ESB is 1.If a operation event enable register changes, OPER is 1.Structure of condition register V LV as following:Chapter 4 SCPI Order Description4.1 IEEE488.2 Common Commands*CLSThis order can clean the register as follows:：Standard event status registerQuest condition registerOperation event registerStatus byte registerError codeOrder syntax：*CLSParameter：None*ESEThis order can set the parameter of standard event enable register. Setting parameter can determine which bit value of standard event register is 1 and the byte will enable ESB of status byte register is 1.Order syntax：*ESE <NRf>Parameter：0~255Reset value：Consult *PSC orderExample：*ESE 128Quest syntax：*ESE？Return parameter：<NR1>Reference order：*ESR？ *PSC *STB？Bit determination of standard event enable registerBit position 7 6 5 4 3 2 1 0Bit Name PON Not used CME EXE DDE QYE Not used OPC Bit Weight 128 32 16 8 4PON Power-onCME Command error EXE Execution error DDE Device-dependent error QYE Query errorOPC Operation complete*ESR?This order can read the value of standard event status register. After executing this order, standard event status register is reset. Bit definition of standard event status register is as the same as the standard event status enable registerQuest syntax：*ESR？Parameter：NoneReturn parameter：<NR1>Reference order：*CLS *E SE *ESE？*OPC*IDN?This order can read information about power supply. The parameter it returns contains 4 segments divided by comma.Quest syntax：*IDN？Parameter：NoneReturn parameter：<AARD> segment descriptionITECH manufacturerXXXX product modeXXXXXX product serial numberVX．XX software version numberFor example：ITECH, IT6822, 6970001004, V1.54*SREThis order can set the parameter of status byte enable register. Setting parameter can determine which byte value of status byte register is 1 and the byte will enable RQS of status byte register is 1. Bit definition of status byte enable register is as the same as the status byte register.Order syntax：*SRE <NRf>Parameter：0~255Reset value：Consult *PSC orderExample：*SRE 128Quest syntax: *SRE？Return parameter：<NR1>Reference Order：*ESE *ESR？ *PS C *STB？*STB?This order can read the data from status byte register. After executing this order, status byte register is reset.Quest syntax：*STB？Parameter：NoneReturn parameter：<NR1>Reference order：*CLS *ESE *ESRBit determination of standard event status enable register7 6 54 3 2 1 0PositionBitBit Name OPER RQS ESB no use QUES no use no use no use32864128BitValue4.2 SCPI Essential CommandsSYSTem:ERRor[:NEXT]?This order can get the error code and error information of the power supply.(0) No error(1) Too many numeric suffices in Command Spec(10) No Input Command to parse(14) Numeric suffix is invalid value(16) Invalid value in numeric or channel list, e.g. out of range(17) Invalid number of dimensions in a channel list(20) Parameter of type Numeric Value overflowed its storage(30) Wrong units for parameter(40) Wrong type of parameter(s)(50) Wrong number of parameters(60) Unmatched quotation mark (single/double) in parameters(65) Unmatched bracket(70) Command keywords were not recognized(80) No entry in list to retrieve (number list or channel list)(90) Too many dimensions in entry to be returned in parameters(101) Command Execution error(100) Too many command(110) Rxd error Parity(200) Error EEPROM data,Out Initial.(201) Error Calibration dataOrder syntax：SYST:ERR?Parameter：NoneReturn parameter：〈NR1〉，〈SRD〉SYSTem:VERSion?This order can query the software version.Order syntax：SYST:VERS?Parameter：NoneReturn parameter：<NR2>STATus:QUEStionable[:EVENt]?This order can read the parameter from quest event register. After executing , quest event register is reset.Quest syntax：STATus:QUEStionable[:EVENt]?Parameter：NoneReturn parameter：<NR1>Reference order：STATus:QUEStionable:ENABleBit determination of quest event registerBit Position 15 1413 12 11109 8 7 6 5 4 3 2 1 0 Bit name n.u n.u n.u n.u n.u n.u n.u n.u n.u n.u n.u n.u n.u n.u Un OT Bit Value 2 1STATus:QUEStionable:CONDition?This order can read the parameter from quest condition register. When a bit of quest condition changes, the bit value corresponding in quest event register is 1.Quest syntax：STATus:QUEStionable: CONDition?Parameter：NoneReturn parameter：<NR1>STATus:QUEStionable:ENABleThis order can set the parameter of quest event enable register. Setting parameter can determine which bit value of quest event register is 1 and the bit will enable QUES of status byte register is 1.Order syntax：STATus:QUEStionable:ENABle <NRf>Parameter：0~255Reset value：Consult *PSC orderExample：STATus:QUEStionable:ENABle 128Quest syntax：STATus:QUEStionable:ENABle？Return parameter：<NR1>Reference order：*PSCSTATus:OPERation:EVENt]?This order can read the parameter from operation event register. After executing this order, operation event register is reset.Quest syntax：STATus: OPERation [:EVENt]?Parameter：NoneReturn parameter：<NR1>Reference order：STATus: OPERation:ENABleBit determination of operation event enable registerBit Position 7 6 5 4 3 2 1 0Bit Name no use no use no use no use no use no use CC CVBit value 2 1 STATus:OPERation:CONDition?This order can read the parameter from the operation condition. When the parameter of operation condition register changes, the bit corresponding in operation event register is 1. Quest syntax：STATus: OPERation: CONDition?Parameter：NoneReturn parameter：<NR1>STATus:OPERation:ENABleThis order can set the parameter of operation even enable register. Setting parameter can determine which bit value of operation event register is 1 and the bit will enable OPER of status byte register is 1.Order syntax：STATus: OPERation:ENABle <NRf>Parameter：0~255Reset value：Consult *PSC orderExample：STATus: OPERation:ENABle 128Quest syntax：STATus: OPERation:ENABle？Return parameter：<NR1>Reference order：*PSC4.3 Output CommandsONPut[:STATe]This order can set power supply output on or off..Order syntax：ONPut[:STATe] <bool>Parameter：0|1|ON|OFF*RST value：OFFQuest syntax：ONPut:STATe?Return parameter：0|1[SOURce:]CURRent [:LEVel]This order can set current value of power supply.Order syntax：[SOURce:]CURRent [:LEVel] <NRf>Parameter：MIN TO MAX|MIN|MAXUnit：A mA*RST value: MINExample：CURR 3A，CURR 30mA，CURR MAX，CURR MIN Quest syntax：[SOURce:]CURRent [:LEVel]？Parameter：[MIN|MAX]Example：CURR？, CURR？ MAX, CURR？MINReturn parameter：<NR2>[SOURce:]VOLTage[:LEVel]This order can set voltage value of power supply.Order syntax：[SOURce:]VOLTage[:LEVel] <NRf>Parameter：MIN TO MAX|MIN|MAXUnit：V mV kV*RST value：MAXQuest syntax：[SOURce:]VOLTage[:LEVel]？Parameter：[MIN|MAX]Return parameter：<NR2>[SOURce:]VOLTage:PROTection[:LEVel]This order can set voltage protection maximum level.Order syntax：[SOURce:] VOLTage:PROTection[:LEVel] <NR f> Parameter：MIN TO MAX|MIN|MAXUnit：V mV*RST value：MAXExample：VOLT:PROT 30V, VO LT PROT MAXQuest syntax：[SOURce:] VOLTage:PROTection[:LEVel]？Parameter：[MIN|MAX]Example：VOLT:PROT？, VO LT PROT？ MAXReturn parameter：<NR2>4.4 Input measurement commands MEASure[:SCALar]:VOLTage[:DC]?This order can get the input voltage of power supply.Order syntax：MEASure[:SCALar]:VOLTage[:DC]?Parameter：NoneReturn parameter：〈NR2〉Return parameter unit：VExample：MEAS:VOLT？MEASure[:SCALar]:CURRent[:DC]?This order can get the input current of power supply.Order syntax：MEASure[:SCALar]:CURRent[:DC]?Parameter：NoneReturn parameter：〈NR2〉Return parameter unit：AExample：MEAS:CURR？MEASure[:SCALar]:POWer[:DC]?This order can get the input power of the power supply.Order syntax：MEASure[:SCALar]:POWer?Parameter：NoneReturn parameter：〈NR2〉Return parameter unit：WExample：MEAS:POW?Calibration orderCALibration:SECure:[STATe]Set protection mode enable or disable when calibrating the power supply.Order syntax：CALibration:SECure:[STATe ]{ON|OFF>,[<password>]}Parameter：0|1|ON|OFF, ‘5811Example：CAL:SEC 1, ‘5811; CAL:SEC OFFQuest syntax：CALibration:SECure:STATe？Parameter：NoneCALibration:VOLTage:LEVelThis order can set voltage calibration point. P1、P2、P3、P4 must be calibrated orderly. Order syntax：CALibration:VOLTage:LEVel <point>Parameter：P1|P2CALibration:VOLTage [:DATA] {<numeric value>}Return actual output voltage value of calibration point.Order syntax：CALibration:VOLTage [:DATA] <NRf>Parameter：<NRf>Example：CAL:VOLT 30.0002VCALibration:CURRent:LEVelThis order can set current calibration point. P1、P2、P3、P4 must be calibrated orderly. Order syntax：CALibration:CURRent:LEVel <point>Parameter：P1|P2CALibration:CURRent [:DATA] {<numeric value>}Return actual output current value to calibration point.Order syntax：CALibration:CURRent [:DATA] <NRf>Parameter：<NRf>Example：CAL:VOLT 3.0002A。
219405539_PCL-g-MAH反应性增容对PP
结构与性能CHINA SYNTHETIC RESIN AND PLASTICS合 成 树 脂 及 塑 料 ， 2022， 39（6）： 60DOI：10.19825/j.issn.1002-1396.2022.06.14聚丙烯（PP）复合材料需要在保留PP热稳定性高、结晶度可调范围大等优点的同时，改善其韧性和模量较低的缺点。
PP复合材料分为无机填料填充型、天然纤维增强型和玻璃纤维（简称玻纤）增强型［1-2］。
反应性增容剂可将无机填料或玻纤与PP复合，改善填料与基体的相容性并且增强材料与基体的表面黏结性［3］。
马来酸酐接枝聚己内酯（PCL）（PCL-g-MAH）是一种常见的反应性增容剂，可作为接枝载体对PP、聚乙烯、苯乙烯-丁二烯-苯乙烯共聚物等进行反应性增容［4］。
冀玲芳［5］研究了PCL-g-MAH对苯乙烯类热塑性弹性体/PCL复合材料力学性能、耐水性能的影响，结果表明，共混物的拉伸强度和断裂伸长率提PCL-g-MAH反应性增容对PP/EPDM/CNT复合材料性能与结构的影响王 欣（荆州职业技术学院，湖北 荆州 434020）摘要：以聚丙烯（PP）/三元乙丙橡胶（EPDM）为基体，加入碳纳米管（CNT）制备了PP/EPDM/CNT复合材料。
以马来酸酐接枝聚己内酯（PCL-g-MAH）为增容剂，对复合材料进行反应性增容。
对反应性增容后的复合材料进行了表征，并分析了PCL-g-MAH对复合材料力学性能、加工流变性能、动态力学性能、熔体流动性能的影响。
结果表明：PCL-g-MAH可以提高PP/EPDM基体与CNT的相容性，增强两者的界面黏结力，使CNT带来的力学增强效果更加显著，力学性能和熔体流动性更佳。
关键词：聚丙烯 碳纳米管 马来酸酐接枝聚己内酯 反应性增容中文分类号：TQ 325.1+4 文献标志码：B 文章编号：1002-1396（2022）06-0060-04Effect of PCL-g-MAH reactive compatibility on properties andstructure of PP/EPDM/CNT ternary compositesWang Xin（Jingzhou Institute of Technology，Jingzhou 434020，China）Abstract：Polypropylene（PP）/ethylene-propylene diene monomer（EPDM） compounds were used as matrix and carbon nano tubes（CNT） were added to prepare PP/EPDM/CNT ternary composites. Polycarprolactone grafted maleic anhydride（PCL-g-MAH） was used to reactively compatibilize the composites. The composites were characterized and the effects of PCL-g-MAH on mechanical properties，processing rheological properties，dynamic mechanical properties and melt fluidity were discussed. The results show that PCL-g-MAH can be used to improve the compatibility and interfacial bonding force between PP/EPDM matrix and CNT，and mechanical properties of the composites are enhanced by CNT more significantly，so that the materials perform better in mechanical properties and melt fluidity.Keywords：polypropylene； carbon nanotube； polycaprolactone-g-maleic anhydride； reactive compatibilization收稿日期：2022-05-27；修回日期：2022-08-26。
普洛麦格RT-PCR系统TB手册说明书
TB本手册是产品K1002S，K1003S和K1005S的使用说明。
请废除以往版本。
所有技术文件均可在上浏览到。
请访问该网站以确定您所使用的是该技术公告的最新版本。
Ⅰ. 描述 (1)Ⅱ. 产品组分和保存条件 (2)Ⅲ. 优化RT-PCR反应 (3)A. RNA模板 (3)B. 对照反应 (3)C. 核酸污染的避免 (4)D. Mg2+的浓度 (4)E. 引物设计 (4)F. 温度 (4)G. 孵育时间和循环数 (4)Ⅳ. 应用RT-PCR系统合成和分析RT-PCR产物 (5)A. 操作指南 (5)B. 结果分析 (6)C. 对照引物序列 (6)Ⅴ. 常见问题处理 (8)Ⅵ. 参考文献 (9)熟练用户的操作指南 (11)Ⅰ. 描述RT-PCR系统基于本公司生产的M-MLV RTase H-（Point Mutant）及Taq DNA Polymerase，对两者的缓冲液系统进行优化并相应调整酶量使之互相兼容，适用于各种RNA如total RNA、poly(A)+mRNA或转录合成的RNA及相应反转录引物（随机引物、oligo(dT)和专一序列引物）。
通过RT-PCR反应，本试剂盒可对低至1pg的RNA*进行扩增，如果靶序列在total RNA中含量极少或片段较长(>8kb)，则可能需要多至1ug的RNA 作为模板。
*RT-PCR的灵敏度受多种因素影响，如模板RNA的含量、纯度及完整性，所用引物不同等。
对total RNA和poly(A)+mRNA而言，起始RNA范围为1pg-1ug；对特定目标的RNA模板，起始范围为102-1010拷贝分子。
0871-622-5599 0851-859-9189配制合成cDNA反应组分M-MLV RTase H-和5X RT Buffer反应缓冲液，dNTP混合物，特异的上游引物，RNasin，RNA模板合成第1条cDNA链 42℃，60分钟配置PCR反应液第1条cDNA链和Taq酶，10X PCR反应液，dNTP混合物，特异的上下游引物，变性模板94℃，2分钟合成第2条链和扩增DNA25循环图1. RT-PCR系统操作概述Ⅱ产品组分产品名称目录号RT-PCR 系统 K1002S供实验室使用。
气动定位器PPL PPR系列Power-Genex 说明书
Instruction and OperatingManualPneumatic-Pneumatic PositionerPPL / PPR SeriesPower-Genex Ltd.1. Manual Overview1.1 Common ArticlesThis Manual Includes Precautions that needs to be followed to prevent Facilities or Individuals and/ or to provide additional information on aspects that may not be readily apparent. Especially, Regarding Individual Safety precautions and Product Settings Guide and precautions that require more attention are highlighted with Safety Signs ()1.2 Common Safety InstructionThis Product was produced with Strict Quality test and was produced without Fault.To maintain this Quality and use it safely, All Instruction in the manual must be acknowledged and all safety info and signs must be followed accordingly.1.3 Correct Operation Methods① This product may only be used for Purposes mentioned in the manual. Unless described inthe Manual clearly, Modifications or reforming of this product is solely user’s responsibility.② This product is a Devise Operated through air input signal pressure. Air pressure input mustbe clean compressed air free from oil, moisture, water or any Impurities③ Be aware of installation order for other valve accessories (Air volume booster, Solenoid valve)1.4 Operator’s limits and responsibilities① Operator must wear Safety Gears and work according to safety precautions of the field② Operator must be Educated with Electric circuit works that involves many hazardous systemsand must be Entrusted or Instructed.③ Operator Must be Educated or instructed according to Safety precautions to operateappropriate safe Installation and Maintenance.④ Operator with skills and experiences with the product must be able to sense and Identifypotential Threats.1.5 Transport and StorageStore with correct packing to prevent damages while transporting or in storage. Products or parts must be placed in original packing to be returned. In case when original Packing is damaged, Pack the Product properly so that product will be protected while transport2. Product View246122461214133. Product SpecificationPPL PPR Input Signal 3 ~ 15 psi *Acting Stroke / Angle Linear Type: 10 - 80mm(Max. up to 150mm) Rotary Type: 60 - 100° **Air Supplier Pressure Max 7.0 bar (20 - 100 psi) Output pressure Range 0 - 100% of Input Air Pressure Output Property LinearityPressure Gauge Stainless Steel Air Flux 80LPM (Sup = 1.4 bar) Air Consumption 5LPM (Sup = 1.4 ~ 6 bar)Operation PropertiesType Single Double Single Double Linear 1.0% F.S 1.5% F.S 1.0% F.S 1.5% F.S Sensitivity 0.2% F.S 0.5% F.S 0.5% F.SHistery 1.0% F.SRepeatability 0.5% F.SValve Operation Direct acting (DA) / Reverse Acting (RA) Operating Temperature -20 ~ +70℃ (-4 ~ +158℉)Air pressure connection Rc 1/4 OR NPT 1/4Electrical connection G 1/2, NPT 1/2 OR M20 X 1.5 Body Material / Painting Aluminum DI-CAST / Fission Painting Weight 2.1 kg 2.5 kg * Input 3~9psi / Input 9~15psi enables 1/2 Split ControlBeyond 3 ~ 15psi Input Signal, Please ask Us** PPR Operating Angle can be adjusted from 0~60° Or 0~100°*** For High Temperature -20 ~ 120℃ (Without Feed Back Option) / -20 ~ 85℃ (With Feed Back Option) Enable with option.4. How to Create Product Code (How to Create Purchase order Code)PP x-x x x x x x x xActuator Operation Linear Type L Rotary Type RFeedback lever Linear Type 10 ~ 40mm Stroke A10 ~ 80mm Stroke BUp to 150mm Stroke C Rotary type NAMUR shaft NFork lever M6 x 40L AFork lever other size on request BGauge 6 bar (90psi) 1 10 bar (150psi) 2Pilot Valve Orifice Standard(When Actuator’ Volume is above 180) S Small Orifice ( 1.0 or 0.7) M (When Actuator’ Volume is above 90~180 )Position Feedback (only Rotary type) Not Included N Position Transmitter (4~20mA Output Signal) O 2 x SPDT L 2 x P&F (NJ2-V3-N) P O + L M O + P QAir Pressure – Electrical Connection Rc 1/4 - G 1/2 (Standard) 3 NPT 1/4 - NPT 1/2 4 Rc1/4 - M20 x 1.5 5Dome Indicator Standard(Flat Indicator) N (Only PPR) Dome Indicator DFor High Temperature 70℃ (Standard) T 120℃ (Without Feedback Option)H 85℃ (With Feedback Option)Bracket Not Included N DIN / IEC 534 (PPL Exclusive) L DIN VDI/VDE 3845 (PPR-NAMUR Exclusive) R DHCT bracket 80x30 (PPR-Fork Lever Exclusive) F Multi-size NAMUR bracket for fork lever type(130 x 30 x 50 bracket on request)E5. Installation Guide5.1 Installing Linear Actuator5.1.1 Installing Bracket and Feedback Lever① Remove all Input Signals and Air pressure from Valve and other surrounding Equipment② Remove by-pass Valve and Block Valve to Prevent Valve from affecting the Entire System and other Accessories that may affect the Control Valve.。
IXYS CORPORATION H82N120C3 高速 IGBT 数据手册说明书
CES I C110= 82A V CE(sat) ≤ 3.20V t fi(typ)= 93nsG = Gate C = Collector E = Emitter Tab = CollectorTO-247High-Speed IGBTfor 20-50 kHz SwitchingFeatures●Optimized for Low Switching Losses ●Square RBSOA ●Positive Thermal Coefficient of Vce(sat)●High Current Handling Capability ●International Standard PackageAdvantages●High Power Density●Low Gate Drive RequirementApplications●High Frequency Power Inverters ●UPS●Motor Drives ●SMPS●PFC Circuits ●Battery Chargers ●Welding Machines ●Lamp BallastsSymbol Test Conditions Characteristic Values (T J = 25︒C, Unless Otherwise Specified) Min. Typ. Max.BV CES I C = 250μA, V GE = 0V 1200 V V GE(th)I C= 250μA, V CE = V GE3.05.0VI CES V CE = V CES , V GE = 0V25μA T J = 150︒C 500 μA I GES V CE = 0V, V GE = ±20V±100 nAV CE(sat)I C = 82A, V GE = 15V, Note 12.753.20 V T J = 150︒C3.76 VSymbol Test ConditionsMaximum Ratings V CES T J = 25°C to 175°C1200V V CGR T J = 25°C to 175°C, R GE = 1M Ω 1200V V GES Continuous ±20V V GEM Transient±30VI C25T C = 25°C (Chip Capability) 200A I LRMS Lead Current Limit 160 A I C110T C = 110°C 82A I CMT C = 25°C, 1ms 380ASSOA V GE = 15V, T VJ = 150°C, R G = 2Ω I CM = 164A (RBSOA) Clamped Inductive Load @V CE ≤ V CES P C T C = 25°C1250W T J -55 ... +175°CT JM 175°C T stg -55 ... +175°CT LMaximum Lead Temperature for Soldering 300°CT SOLD 1.6 mm (0.062in.) from Case for 10s 260 °C M d Mounting Torque 1.13/10Nm/lb.in.Weight6g1200V XPT TM IGBT GenX3TMIXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.Notes:1. Pulse test, t ≤ 300μs, duty cycle, d ≤ 2%.2. Switching times & energy losses may increase for higher V CE (clamp), T J or R G .Symbol Test Conditions (T J = 25°C Unless Otherwise Specified)fs I C = 60A, V CE = 10V, Note 1 30 50C ie sC oes V CE = 25V, V GE C resQ g(on)Q ge I C = 82A, V GE = 15V, V Q gc d(on)Fig. 1. Output Characteristics @ T 6080100120140160I C - A m p e r e sIXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.Fig. 7. Transconductance304050607080g f s - S i e m e n sFig. 12. Inductive Switching Energy Loss vs.Gate Resistance345678E o f f - M i l l i J o u l e sE off E on T J = 125oC , V GE = 15V V CE = 600VIXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.Fig. 18. Inductive Turn-on Switching Times vs.Gate Resistance6080100120140160 r i - N a n o s e c o n d st r i t d(on)T J = 125oC, V GE = 15V V CE = 600VI C = 80ATO-247 (IXYH) Outline1 - Gate2,4 - Collector3 -EmitterDisclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at /disclaimer-electronics. IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.。
Omega产品说明书
Where Do I Find Everything I Need for Process Measurement and Control?OMEGA…Of Course!Shop online at SMTEMPERATUREM U Thermocouple, RTD & Thermistor Probes, Connectors, Panels & AssembliesM U Wire: Thermocouple, RTD & ThermistorM U Calibrators & Ice Point ReferencesM U Recorders, Controllers & Process MonitorsM U Infrared PyrometersPRESSURE, STRAIN AND FORCEM U Transducers & Strain GagesM U Load Cells & Pressure GagesM U Displacement TransducersM U Instrumentation & AccessoriesFLOW/LEVELM U Rotameters, Gas Mass Flowmeters & Flow ComputersM U Air Velocity IndicatorsM U Turbine/Paddlewheel SystemsM U Totalizers & Batch ControllerspH/CONDUCTIVITYM U pH Electrodes, Testers & AccessoriesM U Benchtop/Laboratory MetersM U Controllers, Calibrators, Simulators & PumpsM U Industrial pH & Conductivity EquipmentDATA ACQUISITIONM U Communications-Based Acquisition SystemsM U Data Logging SystemsM U Wireless Sensors, Transmitters, & ReceiversM U Signal ConditionersM U Data Acquisition SoftwareHEATERSM U Heating CableM U Cartridge & Strip HeatersM U Immersion & Band HeatersM U Flexible HeatersM U Laboratory HeatersENVIRONMENTALMONITORING AND CONTROLM U Metering & Control InstrumentationM U RefractometersM U Pumps & TubingM U Air, Soil & Water MonitorsM U Industrial Water & Wastewater TreatmentM U pH, Conductivity & Dissolved Oxygen InstrumentsM0200/0117AC05-B, AC15-B,DC05-B, DC15-BSolid State Switch Modules and SSS-PC-B Series Backplanes e-mail:**************For latest product manuals: Shop online at SMUser’s G ui d eDI S C O N T I N U E D***********************Servicing North America:U.S.A. Omega Engineering, Inc.Headquarters: Toll-Free: 1-800-826-6342 (USA & Canada only)Customer Service: 1-800-622-2378 (USA & Canada only)Engineering Service: 1-800-872-9436 (USA & Canada only)Tel: (203) 359-1660 Fax: (203) 359-7700e-mail:**************For Other Locations Visit /worldwideThe information contained in this document is believed to be correct, but OMEGA accepts no liability for any errors it contains, and reserves the right to alter specifications without notice.WARRANTY/DISCLAIMEROMEGA ENGINEERING, INC. warrants this unit to be free of defects in materials and workmanship for a period of 13 months from date of purchase. OMEGA’s WARRANTY adds an additional one (1) month grace period to the normal one (1) year product warranty to cover handling and shipping time. T his ensures that OMEGA’s customers receive maximum coverage on each product.If the unit malfunctions, it must be returned to the factory for evaluation. OMEGA’s Customer Service Department will issue an Authorized Return (AR) number immediately upon phone or written request. Upon examination by OMEGA, if the unit is found to be defective, it will be repaired or replaced at no charge. OMEGA’s WARRANT Y does not apply to defects resulting from any action of the purchaser, including but not limited to mishandling, improper interfacing, operation outside of design limits, improper repair, or unauthorized modification. This WARRANTY is VOID if the unit shows evidence of having been tampered with or shows evidence of having been damaged as a result of excessive corrosion; or current, heat, moisture or vibration; improper specification; misapplication; misuse or other operating conditions outside of OMEGA’s control. Components in which wear is not warranted, include but are not limited to contact points, fuses, and triacs.OMEGA is pleased to offer suggestions on the use of its various products. However, OMEGA neither assumes responsibility for any omissions or errors nor assumes liability for any damages that result from the use of its products in accordance with information provided by OMEGA, either verbal or written. OMEGA warrants only that the parts manufactured by the company will be as specified and free of defects. OMEGA MAKES NO OTHER WARRANTIES OR REPRESENTATIONS OF ANY KIND W HATSOEVER, EXPRESSED OR IMPLIED, EXCEPT THAT OF TITLE, AND ALL IMPLIED W ARRANTIES INCLUDING ANY W ARRANTY OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE ARE HEREBY DISCLAIMED. LIMITATION OF LIABILITY: The remedies of purchaser set forth herein are exclusive, and the total liability of OMEGA with respect to this order, whether based on contract, warranty, negligence, indemnification, strict liability or otherwise, shall not exceed the purchase price of the component upon which liability is based. In no event shall OMEGA be liable for consequential, incidental or special damages.CONDITIONS: Equipment sold by OMEGA is not intended to be used, nor shall it be used: (1) as a “Basic Component” under 10 CFR 21 (NRC), used in or with any nuclear installation or activity; or (2) in medical applications or used on humans. Should any Product(s) be used in or with any nuclear installation or activity, medical application, used on humans, or misused in any way, OMEGA assumes no responsibility as set forth in our basic WARRANTY / DISCLAIMER language, and, additionally, purchaser will indemnify OMEGA and hold OMEGA harmless from any liability or damage whatsoever arising out of the use of the Product(s) in such a manner.RETURN REQUESTS/INQUIRIESDirect all warranty and repair requests/inquiries to the OMEGA Customer Service Department. BEFORE RET URNING ANY PRODUCT (S) T O OMEGA, PURCHASER MUST OBT AIN AN AUT HORIZED RET URN (AR) NUMBER FROM OMEGA’S CUST OMER SERVICE DEPART MENT (IN ORDER T O AVOID PROCESSING DELAYS). T he assigned AR number should then be marked on the outside of the return package and on any correspondence.The purchaser is responsible for shipping charges, freight, insurance and proper packaging to prevent breakage in transit.OMEGA’s policy is to make running changes, not model changes, whenever an improvement is possible. This affords our customers the latest in technology and engineering.OMEGA is a registered trademark of OMEGA ENGINEERING, INC.© Copyright 2017 OMEGA ENGINEERING, INC. All rights reserved. This document may not be copied, photocopied, reproduced, translated, or reduced to any electronic medium or machine-readable form, in whole or in part, without the prior written consent of OMEGA ENGINEERING, INC.FOR WARRANTY RETURNS, please have the following information available BEFORE contacting OMEGA:1. Purchase Order number under which the product was PURCHASED,2. M odel and serial number of the product under warranty, and3. R epair instructions and/or specific problems relative to the product.FOR NON-WARRANTY REPAIRS, consult OMEGA for current repair charges. Have the following information available BEFORE contacting OMEGA:1. P urchase Order number to cover the COST of the repair,2. Model and serial number of the product, and 3. Repair instructions and/or specific problemsrelative to the product.。
Richtek RT9026 DDR Termination Regulator 说明书
1DS9026-07 September 2011Ordering InformationNote :Richtek products are :} RoHS compliant and compatible with the current require-ments of IPC/JEDEC J-STD-020.} Suitable for use in SnPb or Pb-free soldering processes.DDR Termination RegulatorGeneral DescriptionRT9026 is a 3A sink/source tracking termination regulator.It is specifically designed for low-cost and low-external component count systems. The RT9026 possesses a high speed operating amplifier that provides fast load transient response and only requires 20µF of ceramic output capacitance. The RT9026 supports remote sensing functions and all features required to power the DDRI/II/III and low-power DDRIII/DDRIV VTT bus termination according to the JEDEC specification. In addition, the RT9026 includes integrated sleep-state controls placing VTT in High-Z in S3 (suspend to RAM) and soft-off for VTT and VTTREF in S5 (shutdown). The RT9026 is available in the thermal efficient package SOP-8 (Exposed Pad),MSOP-10 (Exposed Pad) and WDFN-10L 3x3.FeatureslSupport DDRI, DDRII, DDRIII, Low-Power DDRIII and DDRIV Requirement} Source/Sink 3A for DDRI and DDRII } Source/Sink 2A for DDRIII} Source/Sink 1.5A for Low-Power DDRIII } Source/Sink 1.2A for Low-Power DDRIV l Input Voltage Range : 3.15V to 5.5V l VLDOIN Voltage Range : 1.2V to 3.3Vl Requires Only 20µF Ceramic Output Capacitance l Supports High-Z in S3 and Soft-Off in S5lIntegrated Divider Tracks 1/2 VDDQSNS for Both VTT and VTTREFl Remote Sensing (VTTSNS)l ±20mV Accuracy for VTT and VTTREFl10mA Buffered Reference (Sourcing/Sinking)(VTTREF)l Built-In Soft-Startl Over Current Protectionl Thermal Shutdown ProtectionlSOP-8 (Exposed Pad), MSOP-10 (Exposed Pad) and 10-Lead WDFN PackagelRoHS Compliant and Halogen FreeApplicationslDDRI/II/III and Low-Power DDRIII/DDRIV Memory T ermination l SSTL-2, SSTL-18lHSTL TerminationPin Configurations(TOP VIEW)MSOP-10 (Exposed Pad)SOP-8 (Exposed Pad)WDFN-10L 3x3VIN S3VDDQSNSPGND VTT S5GND VTTSNSVTTREFVLDOINGND S3VTTSNS VTTREFVTT VLDOIN VDDQSNSVINVDDQSNS PGND VTT VTTSNSVLDOINVIN S3S5GND VTTREFPackage TypeSP : SOP-8 (Exposed Pad-Option 1)FP : MSOP-10 (Exposed Pad)QW : WDFN-10L 3x3 (W-Type)RT9026Lead Plating System P : Pb FreeG : Green (Halogen Free and Pb Free)2DS9026-07 September 2011Figure 1. For SOP-8 (Exposed Pad) PackageFigure 2. For MSOP-10 (Exposed Pad) / WDFN-10L 3x3PackageTypical Application CircuitRT9026VTTREF Marking InformationRT9026PSP : Product CodeYMDNN : Date CodeRT9026PSPRT9026GSP : Product CodeYMDNN : Date CodeRT9026GSPA0- : Product CodeYMDNN : Date CodeRT9026PFPA0= : Product CodeYMDNN : Date CodeRT9026GFPE6- : Product CodeYMDNN : Date CodeRT9026PQWE6= : Product CodeYMDNN : Date CodeRT9026GQWTo be ContinuedFunction Block DiagramTable 1. S3 and S5 Control TableDS9026-07 September 34DS9026-07 September 2011 Electrical Characteristics(V IN = 5V, VLDOIN = VDDQSNS = 2.5V, C1=10µF, C2=1µF, C3=0.1µF, C4=10µFx2, T A = 25°C, S5 function only for RT9026PFPAbsolute Maximum Ratings (Note 1)l Supply Input Voltage, VIN ----------------------------------------------------------------------------------------------6V l Supply Input Voltage, VLDOIN, VDDQSNS ------------------------------------------------------------------------3.6V lPower Dissipation, P D @ T A = 25°CSOP-8 (Exposed Pad)--------------------------------------------------------------------------------------------------1.333W MSOP-10 (Exposed Pad)----------------------------------------------------------------------------------------------1.163W WDFN-10L 3x3-----------------------------------------------------------------------------------------------------------1.429WlPackage Thermal Resistance (Note 2)SOP-8 (Exposed Pad), θJA --------------------------------------------------------------------------------------------75°C/W SOP-8 (Exposed Pad), θJC --------------------------------------------------------------------------------------------28°C/W MSOP-10 (Exposed Pad), θJA ----------------------------------------------------------------------------------------86°C/W MSOP-10 (Exposed Pad), θJC ----------------------------------------------------------------------------------------30°C/W WDFN-10L 3x3, θJA ------------------------------------------------------------------------------------------------------70°C/WWDFN-10L 3x3, θJC -----------------------------------------------------------------------------------------------------8.2°C/W l Lead T emperature (Soldering, 10 sec.)------------------------------------------------------------------------------260°Cl Junction Temperature ---------------------------------------------------------------------------------------------------150°Cl Storage Temperature Range -------------------------------------------------------------------------------------------−65°C to 150°C lESD Susceptibility (Note 3)HBM (Human Body Mode)---------------------------------------------------------------------------------------------2kV MM (Machine Mode)----------------------------------------------------------------------------------------------------200VRecommended Operating Conditions (Note 4)l Supply Input Voltage, VIN ----------------------------------------------------------------------------------------------3.15V to 5.5V l Supply Input Voltage, VLDOIN, VDDQSNS ------------------------------------------------------------------------1.2V to 3.3V l Junction T emperature Range ------------------------------------------------------------------------------------------−40°C to 125°C lAmbient Temperature Range ------------------------------------------------------------------------------------------−40°C to 85°CTo be ContinuedNote 1. Stresses listed as the above“Absolute Maximum Ratings” may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability.Note 2. θJA is measured in the natural convection at T A = 25°C on a high effective four-layers thermal conductivity test board of JEDEC 51-7 thermal measurement standard. The case point of θJC is on the exposed pad for SOP-8 (Exposed Pad) , MSOP-10 (Exposed Pad) and WDFN-10L 3x3 package.Note 3. Devices are ESD sensitive. Handling precaution is recommended.Note 4. The device is not guaranteed to function outside its operating conditions.DS9026-07 September 56DS9026-07 September 2011 Typical Operating CharacteristicsV DDQSNS = V LDOIN , C1 = 10μF , C2 = 1μF , C3 = 0.1μF , C4 = 10μF x 2 unless otherwise specified.0.75V TT Output Voltage vs. Temperature0.700.710.720.730.740.750.760.770.780.790.80-50-25255075100125Temperature (°C)O u t p u t V o l t a g e (V )0.675V TT Output Voltage vs. Temperature0.6250.6350.6450.6550.6650.6750.6850.6950.7050.7150.725-50-25255075100125Temperature (°C)O u t p u t V o l t a g e (V)0.6V TT Output Voltage vs. Temperature0.550.560.570.580.590.600.610.620.630.640.65-50-25255075100125Temperature (°C)O u t p u t V o l t a g e (V )1.25V TT Output Voltage vs. Temperature1.201.221.241.261.281.30-50-25255075100125Temperature (°C)O u t p u t V o l t a g e (V)0.9V TT Output Voltage vs. Temperature0.850.860.870.880.890.900.910.920.930.940.95-50-25255075100125Temperature (°C)O u t p u t V o l t a g e (V )V IN Supply Current vs. Temperature6006507007508008509009501000-50-25255075100125Temperature (°C)V I N S u p p l y C u r r e n t (µA )7Source(20mV/Div)VTT (2A/Div)V IN = 5V, V LDOIN = 1.8VSource(20mV/Div)VTT (1A/Div)V IN = 5V, V LDOIN = 1.35V8DS9026-07 September 2011 1.25V TT @ 3A Transient ResponseV TT(20mV/Div)I VTT (2A/Div)V IN = 5V, V LDOIN = 2.5VSinkTime (500μs/Div)0.9V TT @ 3A Transient ResponseSinkV TT(20mV/Div)I VTT (2A/Div)V IN = 5V, V LDOIN = 1.8VTime (500μs/Div)0.75V TT @ 2A Transient ResponseSinkV TT(20mV/Div)I VTT (1A/Div)V IN = 5V, V LDOIN = 1.5VTime (500μs/Div)0.675V TT @ 1.5A Transient ResponseSinkV TT(20mV/Div)I VTT (1A/Div)V IN = 5V, V LDOIN = 1.35VTime (400μs/Div)0.6V TTREF @ 1.2A Transient ResponseSinkV IN = 5V, V LDOIN = 1.2VTime (400μs/Div)V TT(20mV/Div)I VTT (1A/Div)0.9V TTREF @ 10mA Transient ResponseSourceV TTREF (10mV/Div)I VTTREF (10mA/Div)V IN = 5V, V LDOIN = 1.8VTime (1ms/Div)9DS9026-07 September 2011TTREF (1V/Div)(1V/Div)S3 = 0V, C3 = 1μF, S5 : Low to HighTime (10μs/Div)(5V/Div)(5V/Div)SinkTTREF (10mV/Div)VTTREF (10mA/Div)V IN = 5V, V LDOIN = 1.8VPower OffTime (1ms/Div)TTREF (1V/Div)(1V/Div)S3 = 0V, C3 = 0.1μF, S3 and S5 : High to Low(5V/Div)(5V/Div)S5S3V TTV TTREF10DS9026-07 September 2011 Application InformationRT9026 is a 3A sink/source tracking termination regulator.It is specifically designed for low-cost and low-external component count system such as notebook PC applications. The RT9026 possesses a high speed operating amplifier that provides fast load transient response and only requires a 10μF ceramic input capacitor and two 10μF ceramic output capacitor.VTTREF RegulatorVTTREF is a reference output voltage with source/sink current capability up to 10mA. To ensure stable operation 0.1μF ceramic capacitor between VTTREF and GND is recommended.S3, S5 Logic ControlThe S3 and S5 terminals should be connected to SLP_S3and SLP_S5 signals respectively. Both VTTREF and VTT are turned on at normal state (S3 = High, S5 = High). In standby state (S3 = Low, S5 = High) VTTREF is kept alive while VTT is turned off and left high impedance. Both VTT and VTTREF outputs are turned off and discharged to ground through internal MOSFETs during shutdown state (S5 = low).Capacitor SelectionGood bypassing is recommended from VLDOIN to GND to help improve AC performance. A 10μF or greater input capacitor located as close as possible to the IC is recommended. The input capacitor must be located at a distance of less than 0.5 inches from the VLDOIN pin of the IC.Adding a ceramic capacitor 1μF close to the VIN pin and it should be kept away from any parasitic impedance from the supply power.Thermal ConsiderationsFor continuous operation, do not exceed absolute maximum operation junction temperature. The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surroundings airflow and temperature difference between junction to ambient.The maximum power dissipation can be calculated by following formula :P D(MAX) = ( T J(MAX) − T A ) / θJAWhere T J(MAX) is the maximum operation junction temperature, T A is the ambient temperature and the θJA is the junction to ambient thermal resistance.For recommended operating conditions specification of the RT9026, the maximum junction temperature is 125°C.The junction to ambient thermal resistance θJA is layout dependent. The thermal resistance θJA for WDFN-10L 3x3is 70°C/W, for SOP-8 (Exposed Pad) is 75°C/W and for MSOP-10 (Exposed Pad) is 86°C/W on the standard JEDEC 51-7 four layers thermal test board. The maximum power dissipation at T A = 25°C can be calculated by following formula :P D(MAX) = (125°C − 25°C) / (70°C/W) = 1.429W for WDFN-10L 3x3 packagesP D(MAX) = (125°C − 25°C) / (75°C/W) = 1.333W for SOP-8 (Exposed Pad) packagesP D(MAX) = (125°C − 25°C) / (86°C/W) = 1.163W for MSOP-10 (Exposed Pad) packagesThe maximum power dissipation depends on operating ambient temperature for fixed T J(MAX) and thermal resistance θJA . For RT9026 packages, the Figure 3 of derating curves allows the designer to see the effect of rising ambient temperature on the maximum power allowed.Table 2. S3 and S5 ControlFor stable operatio n, the total capacitance of the cerarnic capcitor at the VTT output terminal must not be larger than 30μF. The RT9026 is designed sp ecifically to work with low ESR ceramic output capacitor in space saving and performance consideration. Larger output capacitance can reduce the noise and improve load transient response,stability and PSRR. The output capacitor should be located near the VTT output terminal pin as close as possible.Outline DimensionHM(Bottom of Package)8-Lead SOP (Exposed Pad) Plastic PackageInformation that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.Richtek Technology CorporationHeadquarter5F, No. 20, Taiyuen Street, Chupei City Hsinchu, Taiwan, R.O.C.Tel: (8863)5526789 Fax: (8863)5526611Richtek Technology CorporationTaipei Office (Marketing)5F, No. 95, Minchiuan Road, Hsintien City Taipei County, Taiwan, R.O.C.Tel: (8862)86672399 Fax: (8862)86672377Email:*********************W-Type 10L DFN 3x3 Package。
QCell-Pro One-Step qRT-PCR SuperMix Kit 使用说明书
QCell-Pro One-Step qRT-PCR SuperMix KitUser’s Manual and InstructionsProduct: QCell-Pro One-Step qRT-PCR SuperMix KitCatalog Number: K5055200, K5055400IntroductionqRT-PCR is a highly sensitive technique that is widely used for detection and quantification of RNA in tissues and cultured cells. Traditionally, quantitative PCR is performed in two steps: a first-strand cDNA synthesis step using reverse transcriptase, followed by a PCR step using a thermostable DNA polymerase. This Kit combines Reverse Transcriptase (MMLV-RTase) and RNase Inhibitor in a single mixture, with hotstart Taq DNA polymerase in a separate 2x reaction mix optimized for probe based qRT-PCR. Both cDNA synthesis and PCR are performed in a single tube using gene-specific primers and either cell lysate or RNA. A cell lysis buffer is provided in the kit to make cell lysates in less than 5 minutes at room temperature. The cell lysate can be used directly for qRT-PCR, bypassing RNA isolation procedure. The passive reference dye ROX is included in a separate tube to make the QCell-Pro One-Step qRT-PCR SuperMix adaptable for many real-time QPCR platforms.BioChain’s QRT-PCR SuperMix contains BioChain’s Taq polymerase with hot start capability. BioChain’s hot-start Taq polymerase improves PCR amplification reactions by decreasing non-specific amplification and preventing primer-dimer formation. This enzyme is activated after an initial 10 minutes heating at 95°C. And the real-time RT-PCR buffer is specially formulated to provide superior specificity and increase reverse transcription and amplification efficiency.216, 36, 6, 1Y=-3.304Log(x)+31.88, R2=0.999, Efficiency=100.8%Initial Quantity, Cell numberFigure 1. BioChain’s QCell-Pro One-Step QRT-PCR SuperMix provides sensitive detection down to a single cell. K562 cells were lysed according to the cell lysis protocol. 6-fold serial dilution of cell lsyate were prepared from 216 cells to 1 cell. GAPDH gene expression was detected using BioChain’s QCell-Pro qRT-PCR kit on Stratagene’s Mx3005P instrument. Efficiency as measured from standard curve was 100.8%, with a R2 value of 0.999.Features•Flexible and convenient – quantitating gene expression in cells (without isolating RNA) or RNA in one-step format•Save time – quick cell lysis procedure, and ready-to-use supermix reducing setup time and liquid handling steps•High Sensitivity – qRT-PCR from as low as 1 cell or 1 pg total RNA.• Versatile – compatible with a wide variety of cell linesApplications• Real-Time RT-PCR• Gene expression profiling• Gene knockdown verification• Array ValidationDescriptionComponents in this kit are prepared with pure chemicals according to our proprietary technology.QCell-Pro One-Step qRT-PCR SuperMix Kit provides a one-step, simple, robust, inexpensiveassay for detection and quantitative analysis of gene expression directly from cells or RNA withprobe based format.Quality Control1 kit of this lot has been tested for quantitating human GAPDH gene expression in a serial dilutionof cell lysate from 216 cells to 1 cell using Stratagene’s Mx3005P as a real time PCR instrument.Good linearity and great PCR efficiency is observed and consistent with the previous lot.ComponentsCatalog Number: K5055200: Reagents are sufficient for 200 assaysNo. Item AmountPart1. Cell Lysis Buffer 20 ml K5055200-11.25 ml x 2 K5055200-22. Pro qRT-PCR Reaction Mixture, 2x (containingHotstart Taq DNA polymerase)3. Reverse Transcriptase / RNase Inhibitor Mixture 100 µl K5055200-34. ROX Reference Dye 50 µl x 2 K5055200-45. Nuclease-Free PCR Grade Water 3 ml K5055200-5Catalog Number: K5055400: Reagents are sufficient for 400 assaysPartNo. Item Amount1. Cell Lysis Buffer 40 ml K5055400-11.25 ml x 4 K5055400-22. Pro qRT-PCR Reaction Mixture, 2x (containingHotstart Taq DNA Polymerase)3. Reverse Transcriptase / RNase Inhibitor Mixture 100 µl x 2 K5055400-34. ROX Reference Dye 50 µl x 4 K5055400-45. Nuclease-Free PCR Grade Water 3 ml x 2 K5055400-5Reagents and Equipments Required but not Supplied in this Kit:1. PBS (Ca2+, Mg2+ free)2. Spectrofluorometric thermal cyclerStorage and StabilityUpon receipt, store all components at -20 ºC in a constant temperature freezer. Avoid repeated freeze/thaw cycles. When stored under these conditions the supermix is stable for one year after ship date. The ROX reference dye is light sensitive and should be kept away from light whenever possible.ProtocolPrimer and Probe DesignDesign QPCR primers to generate amplicons of ≤150 bp. Since the cell lysate contains genomic DNA, the primers and probe should be designed to amplify cDNA but minimize amplification of genomic DNA. It is useful to choose primers or probe that span an exon-exon boundary in the target mRNA, or choose primers that flank a large intron. If possible, design primers and probe to avoid regions of secondary structure in the mRNA. Since reverse transcription and PCR are performed in one-step, we recommend to use the reverse PCR primer as the gene specific primer for reverse transcription.Recommended Control ReactionsNo Template Control (NTC): no-template control reactions are recommended in each experiment to screen for contamination of reagents or false amplification.No-RT Control: no-RT control reactions are recommended for each experimental sample by omitting reverse transcriptase from the reaction. The no-RT control should generate no signal if the primers are specific for the cDNA and does not amplify genomic DNA.Use of the ROX Reference DyeROX reference dye is included in this kit and may be added to compensate for non-PCR related variations in fluorescence. Addition of the reference dye is optional. Optimizing the ROX dye concentration within the qPCR reaction is an important aspect of setup. Too much ROX in the qPCR reaction will reduce background but also makes a low target signal difficult to distinguish from background. Conversely, too little ROX can increase background, meaning that low or weak target signals can be lost. For instruments that allow excitation at ~584 nm (such as Stratagene’s Mx instrument and ABI 7500), firstly 1:10 dilute the ROX reference dye provided in the kit, then begin optimization using 0.5 µl diluted ROX reference dye in 25 µl qRT-PCR reaction. For instruments that do not allow excitation near 584 nm (such as ABI PRISM®/GENEAmp® 5700 instruments), begin optimization using 0.5 µl undiluted ROX reference dye in 25 µl qRT-PCR reaction.Reagent Preparation and StorageThaw the tube containing 2x qRT-PCR Reaction Mixture on ice and store it on ice while setting up the reactions.1. If the ROX reference dye will be included in the reaction, keep all solutions containing theROX protected from light.2. Due to the sensitivity of quantitative PCR, results can be easily affected by pipettingerrors. Always prepare a master mix of qRT-PCR supermix containing the primers andthe reference dye (if reference dye is used). Individual pipetting of replicate samples isnot recommended.Cell Lysis ProcedureThe lysis buffer can be used to prepare lysates from a variety of mammalian culture cells.Lysates may be prepared with the maximum cell density (104 cells /µl). When used for qRT-PCR,the lysate may be diluted in the cell lysis buffer prior to adding to the qRT-PCR reaction. Highconcentration of either cellular materials or lysis buffer may inhibit qRT-PCR reaction, so the totalamount of cell lysate added to the qRT-PCR reaction should not exceed 1/10 volume of thereaction. And the number of cells added to the 25 µl qRT-PCR reaction should be <= 2,000. Thisis a general guideline. For some cells lines, 2,000 cells may inhibit the qRT-PCR reaction. Prior tothe experiment, perform a pilot standard curve to determine the maximum number of the cellsthat may be added to the qRT-PCR reaction, and determine the cell number range that give linearamplification of the specific target under your specific reaction conditions.1. Harvest cells using the method appropriate to the properties of the cell line. For adherentcells, trypsinize the cells using standard techniques. Count the cell.2. Pelleting the cells by centrifuging at 200 – 300x g for 5 min. Carefully remove thesupernatant by aspiration.3. Wash the pellet once with ice-cold PBS. Pelleting the cells by centrifuging at 200 – 300xg for 5 min. Carefully remove the supernatant by aspiration. Keep the pellet on ice.4. Add appropriate volume of Cell Lysis Buffer to the cell pellet. Vortexing for 1 minute tolyse the cells.5. Analyze the lysate by qRT-PCR. RNAs in the lysate are stable at 4°C for up to 4 hr.QRT-PCR setup and cycling1. Prepare the following RT-PCR reaction mixture. (First make the master mix without thetemplate. After making the master mix, gently mix the reaction without creating bubbles,aliquot and then add 1 – 2.5 µl of template to each experimental reaction)per reaction: 25 µlConcentrationFinal Regents VolumePro QRT-PCR Reaction Mixture (2x) 12.5 µl 1xReverse Transcriptase / RNase0.5 µlInhibitor MixturePCR forward primer X µl 150 – 200 nMPCR reverse primer X µl 150 – 200 nMProbe X µl 150 – 500 nMROX Reference Dye a 0.5 µlTemplate (cell lysate or RNA)b 1 – 2.5 µlNuclease-free PCR grade water Add up to 25 µla See page 4: Use of the ROX Reference Dyeb If cell lysate is used as the template, the volume of cell lysate should not exceed 1/10volume of the qRT-PCR reaction. If RNA is used as the template, it is recommended touse RNA template in less than 1 µg.2. Gently mix the reactions without creating bubbles since bubbles interfere withfluorescence detection. Then centrifuge the reactions briefly.3. Place the reactions in the instrument and run the appropriate RT-PCR program. Try thefollowing protocol first, and optimize the reaction conditions if needed.PCR program for RT-PCR:Cycles Temperature Time Detection Remarkmin OFF1 42°C 151 95°C 10 min. OFF This step inactivates thereverse transcriptase andactivates the hotstart Taq DNApolymerase. 10 minutesincubation is required to fullyactivate hotstart Taq DNApolymerase.sec OFF4095°C 15sec ON50-60°C a 15sec OFF72°C 30a. Set an appropriate annealing temperature for the primer set used.4. Dissociation Program for all PCR productsFollow manufacturer’s guidelines for setting up dissociation depending on theinstrument’s software version.Related ProductsQCell-Eva One-Step qRT-PCR SuperMix Kit (Cat# K5054200, K5054400), Eva QPCR SuperMix (Cat# K5052200, K5052400), Pro QPCR SuperMix (Cat# K5053200, K5053400), dNTP set for PCR (Cat# K6011100), PCR mix (Cat# 5051100), PCR Optimization Kit (K5051100), Taq Polymerase (Cat#7051200), RNA, PCR ready cDNA, and PCR ready genomic DNA.References1. Higuchi R, Dollinger G, Walsh P S and Griffith R (1992): Simultaneous amplification anddetection of specific DNA sequences. BioTechnology 10:413-417.2. Higuchi R, Fockler C, Dollinger G and Watson R (1993): Kinetic PCR analysis: real-timemonitoring of DNA amplification reactions. BioTechnology 11:1026-10303. Bustin, S A (2000): Absolute quantification of mRNA using real-time reverse transcriptionpolymerase chain reaction assays. Journal of Molecular Endocrinology 25:169-193.。
PNOZ s30 24-240VACDC 2 n o 2 n c 750330说明书
CE;cULus Listed;EAC (Eurasian);TÜV;CCC Supervisión de revoluciones;Supervisión de parada monocanal;Rearme automático;bicanal;Rearme manual;Rearme manual con superv. EN 1088;EN 60204-1;EN 62061;EN ISO 10218-1;EN ISO 13849-1;VDI 2854 24,0 - 240,0 AC/DC Borne de tornillo 4.0 A 45.0 mm 98.0 mm 120.0 mm 425 g 405 g -20 - 55 °C
PNOZ msi1Ap Adapter Si/Ha 25/25 2,5m PNOZ msi1Bp Adapter Si/Ha 25/25 2,5m PNOZ msi3Ap Adapter Si/Ha 15/15 2,5m PNOZ msi3Bp Adapter Si/Ha 15/15 2,5m PNOZ msi1AP Adapter Si/Ha 25/25 5m PNOZ msi b4 Box PNOZ msi10p Adapter Cable 2,5m PNOZ msi11p Adapter Cable 1,5m PNOZ msi 9p adapter cable 5m
Accesorios opcionales
773839
PNOZ msi1 Bp Adapter Si/Ha 25/25 5m
Pilz GmbH & Co. KG, Felix-Wankel-Strasse 2, 73760 Ostfildern, Germany
Página 1/7
辅酶Q制剂在改善心肌缺血再灌注损伤中的作用
辅酶Q制剂在改善心肌缺血再灌注损伤中的作用心肌缺血再灌注损伤是指由于心肌缺血引起的心肌细胞损伤，并在血液重新灌注后进一步恶化的病理过程。
这种损伤常见于冠心病、心肌梗死等心血管疾病的治疗过程中，严重影响患者的生活质量和预后。
辅酶Q制剂是一种在临床上应用广泛的抗氧化剂，它被认为具有改善心肌缺血再灌注损伤的潜力。
本文将探讨辅酶Q 制剂在改善心肌缺血再灌注损伤中的作用以及其可能的机制。
心肌缺血再灌注损伤的机制涉及多种复杂的病理生理过程，包括氧自由基的生成、线粒体功能的改变、炎症反应的激活以及细胞凋亡等。
辅酶Q制剂具有抗氧化、抗炎、抗凋亡等多种作用，因此被认为可能能够通过调节这些病理生理过程来改善心肌缺血再灌注损伤。
首先，辅酶Q制剂作为一种抗氧化剂，可以减少氧自由基的生成，维持氧化还原平衡。
在心肌缺血再灌注损伤过程中，缺血期间心肌细胞代谢发生紊乱，大量氧自由基被产生，导致脂质过氧化反应的发生，继而引发细胞膜的破坏和细胞内酶的失活。
辅酶Q制剂可以捕捉氧自由基，减轻脂质过氧化反应的程度，保护细胞膜的完整性，从而减少细胞损伤。
其次，辅酶Q制剂可以调节线粒体功能，改善心肌能量代谢。
在心肌缺血再灌注损伤中，线粒体的功能明显受损，导致三磷酸腺苷（ATP）的合成减少，进而引起心肌细胞的能量耗竭。
辅酶Q制剂可以提高线粒体色素氧化酶活性，促进氧化磷酸化反应的进行，增加ATP的合成量，从而增加心肌细胞的抵抗力，减轻再灌注损伤。
此外，辅酶Q制剂还具有抗炎作用，可以抑制炎症反应的激活，减少炎症介质的释放。
在心肌缺血再灌注损伤过程中，缺血期间心肌细胞发生坏死和凋亡，释放了一系列炎症介质，进而引发炎症反应的激活，加重细胞损伤。
辅酶Q制剂通过抑制炎症介质的产生和释放，可以降低炎症反应的强度，减轻心肌损伤。
最后，辅酶Q制剂还能抑制心肌细胞的凋亡，保护心肌细胞的存活。
心肌缺血再灌注损伤过程中，缺血引起的氧自由基生成和线粒体功能的改变会导致细胞内一系列信号通路的异常激活，进而引发细胞凋亡。
辅酶Q制剂对克山病的保护作用
辅酶Q制剂对克山病的保护作用克山病是一种常见的急性高山病，主要发生在高海拔地区的人群中。
由于气候寒冷、氧气稀薄和环境恶劣，高海拔地区的居民容易患上这种疾病。
克山病主要特征包括胸闷、气促、心慌、乏力、恶心、呕吐等症状，严重时还会引起呼吸困难、脑水肿甚至死亡。
因此，寻找一种有效的保护措施对于高海拔地区人群来说至关重要。
辅酶Q是一种存在于人体细胞中的一种化合物，它在能量代谢、抗氧化和细胞信号传导等方面发挥着重要作用。
辅酶Q由酪氨酸通过酶的催化作用合成而成，主要存在于线粒体内。
辅酶Q在高海拔地区的居民中的水平通常较低，这可能是克山病易发生的一个原因。
因此，使用辅酶Q制剂来增加体内辅酶Q的水平，可能会对克山病的保护产生积极的影响。
研究表明，辅酶Q制剂具有多种保护克山病的作用。
首先，辅酶Q能够提高线粒体的功能。
线粒体是细胞的“能量中心”，在高海拔地区的居民中常常受到损伤，使得细胞无法产生足够的能量来维持正常的生理功能。
辅酶Q可以改善线粒体的结构和功能，促进细胞能量代谢的正常进行，从而减轻克山病的症状。
其次，辅酶Q具有抗氧化作用。
在高海拔地区，由于缺氧和寒冷的环境，细胞内氧化应激的程度较高。
氧化应激会导致细胞内的氧自由基生成过多，从而对细胞结构和功能产生损害。
辅酶Q具有抗氧化作用，可以中和自由基，减轻氧化应激带来的细胞损伤，降低克山病的发生率。
此外，辅酶Q还可以提高免疫系统的功能。
免疫系统在抵御病毒和细菌侵袭中起着重要作用，然而在高海拔地区，由于缺氧和低温的影响，免疫系统的功能常常受到抑制。
辅酶Q可以提高免疫细胞的活性，增强免疫系统的功能，从而增加人体对克山病的抵抗力。
除了上述作用，辅酶Q还具有抗炎、改善血液循环、调节血压等多种保护作用。
这些作用都对克山病的发生和发展有重要意义。
因此，使用辅酶Q制剂可能是一种有效的保护克山病的措施。
然而，需要注意的是，辅酶Q制剂并非万能药物，它也有一些副作用和限制。
辅酶Q制剂的副作用包括胃肠道不适、头痛、疲劳等，尤其在高剂量使用时更为明显。
KiCqStart One-Step Probe RT-qPCR ReadyMix技术手册说明书
KiCqStart™One-Step Probe RT-qPCR ReadyMix™Catalog Number KCQS07, KCQS08, KCQS09Storage Temperature −20 °CTECHNICAL BULLETINProduct DescriptionKiCqStart One-Step Probe RT-qPCR ReadyMix is a ready-to-use, highly sensitive master mix for reverse transcription quantitative PCR (RT-qPCR) of RNA templates using hybridization probe detection chemistries such as TaqMan®5’-hydrolysis probes on real-time PCR systems. Please refer to instrument compatibility section to select the appropriate reagent for your machine. First-strand cDNA synthesis and PCR amplification are carried out in the same tube without opening between procedures. It is ideal for highly sensitive quantification of RNA viruses or low abundance RNA targets as well as high throughput gene-expression studies. The system has been optimized to deliver maximum RT-PCR efficiency, sensitivity, and specificity in reduced reaction volumes and fast cycle times.KiCqStart One-Step Probe RT-qPCR ReadyMix contains all required components for RT-qPCR except RNA template and probe. It is compatible with all dual-labeled probe chemistries. The reverse transcriptase is an engineeredM-MLV with reduced RNase H activity and improved activity and stability at higher temperatures. The use of higher temperatures (50-55°C) for the first-strand step of one-step RT-qPCR provides higher specificity for primer annealing and disruption of RNA secondary structure that can interfere with cDNA synthesis.KiCqStart One-Step Probe RT-qPCR ReadyMix is highly resistant to PCR inhibitors. A key component of the ReadyMix is an ultra-pure, highly processive, thermostable DNA polymerase that is combined with high avidity monoclonal antibodies. This provides an extremely stringent automatic hot-start that minimizes the potential for primer-dimer and other non-specific PCR artifacts. The light blue color of the inert dye simplifies reaction assembly in white, or clear, plates and helps to minimize pipetting or mixing errors. The dye does not interfere with qPCR performance or affect the stability of the product.Reagents2X reaction buffer containing dATP, dCTP, dGTP, TTP, magnesium chloride, reverse transcriptase, RNase inhibitor protein, hot-start DNA polymerase,ROX reference dye (if applicable),inert blue qPCR dye, and stabilizers**Reaction number based upon a 20µL final reaction volumePrecautions and DisclaimerThis product is for R&D use only, not for drug,household, or other uses. Please consult the Material Safety Data Sheet for information regarding hazards and safe handling practices.Storage/StabilityKiCqStart One-Step Probe RT-qPCR ReadyMix is stable for one year when stored in a constant temperature freezer at -20ºC,protected from light. Repeated freezing and thawing does not affect RT-qPCR performance.Instrument CompatibilityDifferent real-time PCR systems employ different strategies for the normalization of fluorescent signals and correction of well-to-well optical variations. It is critical to match the appropriate qPCR reagent to your specific instrument. Please consult the following table, or visit our web site at /pcrselection to find the optimal kit for your instrument platform.Supplies• KiCqStart™ One-Step Probe RT-qPCR ReadyMix™(KCQS07,KCQS08 or KCQS09–select appropriate reagent based upon qPCR instrument used)• Forward and reverse primers diluted to working concentration (10µM working stocks are sufficient for most assays)o Custom oligos can be designed using OligoArchitect(visit /oligos)• Probes diluted to working concentration (10µM working stocks are sufficient for most assays) o Custom probes can be designed using OligoArchitect (visit /probes)• Sterile filter pipette tips• Sterile 1.5 mL screw-top microcentrifuge tubes, such as Cat. No. CLS430909)• PCR tubes, select tubes to match desired format:o Individual thin-walled 200 µL PCR tubes, Cat. No. Z374873or P3114o Plates§ 96 well plates, Cat. No.Z374903§ 384 well plates, Cat. No.Z374911o Plate seals§ ThermalSeal RTS™ Sealing Films, Cat. No.Z734438§ ThermalSeal RT2RR™ film, Cat. No.Z722553• PCR grade water, Cat. No.W1754Usage Guidelines• Primer and Probe Designo The design of highly specific primers and probes is a critical parameter for successful one-step RT-qPCR. Use of Sigma’s OligoArchitect TM program is encouraged in order to minimize the potential forinternal secondary structure and complementation at 3’-ends within each primer, the primer pair, andprimer/probe combinations. (visit /probedesignonline)o Regions of strong RNA secondary structure should be avoided as this can interfere with primer hybridization and/or impede procession of the reverse transcriptase.o For best results, amplicon size should be between 70 and 150 bp. Optimal results may require titration of primer concentration between 300 and 900 nM. A final concentration of 450 nM eachprimer and 150 nM probe is effective for most applications.o The efficacy and efficiency of any primer/probe set should be validated under fast cycling and/or rapid ramp rate protocols before use in qPCR studies.• If frozen, thaw KiCqStart One-Step Probe RT-qPCR ReadyMix on ice. Thoroughly mix by gently vortexing, and then centrifuge to collect contents to the bottom of the tube. Keep on ice prior to use.• To maximize specificity, reactions should be assembled on ice. The hot-start DNA polymerase is inactive prior to high temperature activation; however, the reverse transcriptase is active at lower temperatures.• First-strand synthesis can be carried out between 42°C and 55°C. Optimal results are generally obtained with a 5 to 10-minute incubation at 48-50°C. Longer incubation times for first-strand synthesis (up to 20 min) may be used.• We recommend a minimum of 30s incubation at 95°C to inactivate the RT and activate the hot-start polymerase prior to PCR cycling.• The kit is compatible with either fast or standard qPCR cycling protocols. Annealing and or extension temperatures may need to be optimized for a given primer/probe design or fluorogenic probe chemistry. Use the suggested protocol as a starting point. Multiplexed RT-qPCR may benefit from a slightly longer extension time (45-60s).• Preparation of a reaction cocktail is recommended to reduce pipetting errors and maximize assay precision.Assemble the reaction cocktail with all required components except RNA template and dispense equalaliquots into each reaction tube. Add RNA to each reaction as the final step. Addition of sample as 2 to 5-μL volumes will improve assay precision.• Suggested input quantities of template are: 1 pg to 100 ng total RNA; 10 fg to 10 ng poly A(+) RNA; 10 to 1x108copies viral RNA.• After sealing each reaction, vortex gently to mix contents. Centrifuge briefly to collect components at the bottom of the reaction tube.Reaction AssemblyFinal reaction volume may vary from 10 to 50 μL, scale all components proportionally.After sealing each reaction, vortex gently to mix contents. Centrifuge briefly to collect components at the bottom of the reaction tube..RT-qPCR Cycling Protocol:Quality ControlKit components are free of contaminating DNase and RNase. KiCqStart™ One-Step Probe RT-qPCR ReadyMix™ is functionally tested in RT-qPCR. Kinetic analysis must demonstrate linear resolution over six orders of dynamic range (r2> 0.995) and a PCR efficiency > 90%.Limited Label LicensesThe use of certain types of fluorogenic probes with 5' nuclease assays may be covered by one or more of the following US patents and corresponding patent claims outside the US: U.S. Patent No. 5,538,848, owned by Life Technologies, Corporation. Purchase of this product does not convey rights to practice the methods claimed in U.S. Patent No. 5,538,848, and a license to practice those methods must be obtained from Life Technologies, 850 Lincoln Center Drive, Forest City, California 94404, or by purchase of fluorogenic probes from an authorized source. No right under any other patent claim and no right to perform commercial services of any kind, including without limitation reporting the results of purchaser's activities for a fee or other commercial consideration, is conveyed expressly, by implication, or by estoppel. This product is for research use only. Diagnostic uses under Roche patents require a separate license from Roche. Further information on purchasing licenses may be obtained by contacting the Director of Licensing, Applied Biosystems, 850 Lincoln Centre Drive, Foster City, California 94404, USA.Use of other hybridization probes may be covered by other patents and specific licenses may be required for each technology which is not conveyed by purchase of this product. Consult your probe provider for patent and license information related to each probe chemistry and their use.Applicable only to products containing Passive Reference The purchase of this product includes a limited, non-transferable right to use the purchased amount of the product to perform Applied Biosystems’ patented Passive Reference Method for the purchaser’s own internal research. No right under any other patent claim and no right to perform commercial services of any kind, including without limitation reporting the results of purchaser’s activities for a fee or other commercial consideration, is conveyed expressly, by implication, or by estoppel. This product is for research use only. For information about these rights or on obtaining additional rights,****************************************************,LifeTechnologies,5791VanAllenWay,Carlsbad,California92008.ReadyMix is a trademark of Sigma-Aldrich Co. LLC, KiCqStart is a trademark of Quanta BioSciences, TaqMan is a registered trademark of Roche Molecular Systems, Inc. LightCycler is a registered Trademark of Roche. Applied Biosystems, StepOne, StepOnePlus, ViiA, and ROX are trademarks Life Technologies Corporation. Stratagene, MX3000P, MX3005P and MX4000 are trademarks of Agilent Technologies, Inc. Mastercycler is a trademark of Eppendorf. Rotor-Gene is a registered trademark of Qiagen GmbH. SmartCycler is a trademark of Cepheid. CFX96, CFX384, iCycler iQ, iQ5, MyiQ, Opticon, MiniOpticon and Chromo4 are trademarks of Bio-Rad Laboratories.GAR,PHC02/14-1©2014Sigma-Aldrich Co. LLC. All rights reserved. SIGMA-ALDRICH is a trademark of Sigma-Aldrich Co. LLC, registered in the US and other countries. Sigma brand products are sold through Sigma-Aldrich, Inc. Purchaser must determine the suitability of the product(s) for their particular use. Additional terms and conditions may apply. Please see product information on the Sigma-Aldrich websiteat and/or on the reverse side of the invoice or packing slip.。
铵-111处理指南说明书
Physical dataPrincipal radiation emissions (1) Gammas: 0.171 MeV (90%) 0.245 MeV (94%)K a x-ray: 0.023 MeV (68%) K b x-ray: 0.026 MeV (15%)K internal conversion electrons: 0.145 MeV (8%) 0.219 MeV (5%)K auger electron: 0.019 MeV (16%) L auger electron: 0.003 MeV (100%)Unshielded exposure rate at 1 cm from a 1 mCi point source: 3.2 R/h (2)Unshielded exposure rate at 1 m from a 1 MBq point source: 2.2 nC/kg/hHalf-value layer for lead shielding: 0.22 mm (0.01 in)(2)Occupational limits (3)Annual limit on intake: 4 mCi (150 MBq) for oral ingestion and 6 mCi (220 MBq) for inhalationDerived air concentration: 3 x 10-6 mCi/ml (110 kBq/m 3)Dosimetry111In presents an external radiation exposure hazard. It may be assumed that 30%, 20%, 7%, 2% and 41% of 111In uptakes in the transfer compartment are translocated to red bone marrow, liver, kidneys, spleen and all other organs and tissues respectively (4). Indium is assumed to be retained indefinitely, however the committed dose is significantly reduced due to the short physical half-life of 111In (4).Decay tablePhysical half-life: 2.83 days (1).To use the decay table, find the number of days in the left hand column and the number of hours along the top of the chart, then find the corresponding decay factor. To obtain a pre-calibration number, divide by the decay factor. For a postcalibration number, multiply by the decay factor. Visit /toolkit to use our online Radioactive Decay Calculator.Hours0 2 4 6 8 10 12 14 16 18 20 22 0 1.000 0.980 0.960 0.941 0.922 0.903 0.885 0.867 0.849 0.832 0.815 0.799 1 0.783 0.767 0.751 0.736 0.721 0.707 0.693 0.679 0.665 0.651 0.638 0.625 2 0.613 0.600 0.588 0.576 0.565 0.553 0.542 0.531 0.520 0.510 0.500 0.490 3 0.480 0.470 0.461 0.451 0.442 0.433 0.424 0.416 0.407 0.399 0.391 0.383 4 0.375 0.368 0.360 0.353 0.346 0.339 0.332 0.326 0.319 0.312 0.306 0.300 5 0.294 0.288 0.282 0.276 0.271 0.265 0.260 0.255 0.250 0.245 0.240 0.235 60.2300.2250.2210.2160.2120.2080.2040.2000.1950.1910.1880.184D a y sFor a complete listing of our global offices, visit /ContactUsCopyright ©2007-2010, PerkinElmer, Inc. All rights reserved. PerkinElmer ® is a registered trademark of PerkinElmer, Inc. All other trademarks are the property of their respective owners.007032B_01 Jul. 2010PerkinElmer, Inc. 940 Winter StreetWaltham, MA 02451 USA P: (800) 762-4000 or (+1) 203-925-4602General handling precautions for Indium-1111. D esignate area for handling 111In and clearly label all containers.2. Store 111In behind 6-mm (0.25-in) thick lead shields.3. W ear extremity and whole body dosimeters while handlingmCi (37 MBq) quantities.4. U se lead shielding and syringe shields to minimize expo-sure.5. Use tools to indirectly handle unshielded sources andpotentially contaminated vessels.6. Practice routine operations to improve dexterity and speedbefore using 111In.7. Prohibit eating, drinking, smoking and mouth pipetting inroom where 111In is handled.8. Use transfer pipets, spill trays and absorbent coverings toconfine contamination.9. Handle potentially volatile chemical forms in ventilatedenclosures.10. S ample exhausted effluent and room air by continuouslydrawing a known volume through membrane filters.11. W ear lab coat, wrist guards and disposable gloves forsecondary protection.12. M aintain contamination and exposure control by regularlymonitoring and promptly decontaminating gloves and surfaces.13. Use end-window Geiger-Mueller detectors, NaI(Tl) detectoror liquid scintillation counter to detect 111In.14. S ubmit urine samples for bioassay after handling 111In toindicate uptake.15. Isolate waste in clearly labeled, shielded containers andhold for decay.16. Establish surface contamination, air concentration andurinalysis action levels below regulatory limits. Investigate and correct any conditions that may cause these levels to be exceeded.17. On completing an operation, secure all 111In, monitor andremove protective coverings; monitor and decontaminate self and surfaces; wash hands and monitor them again.References1. K ocher, David C., Radioactive Decay Data Tables,Springfield: National Technical Information Service, 1981 DOE/TIC-11026.2. C alculated with computer code “Gamma” utilizing decayscheme data from Kocher (1) and mass attenuation coefficient for lead and mass energy absorption coefficients for air from the Radiological Health Handbook, Washington: Bureau of Radiological Health, 1970. The HVL reported here is the initial HVL for narrow beam geometry.3. U .S. Nuclear Regulatory Commission. 10 CFR 20 AppendixB – Standards for Protection Against Radiation, 1994.4. I CRP Publication 30, Part 2, Limits for Intakes of Radionuclidesby Workers. Pergamon Press, Oxford, 1980.PerkinElmer has developed the following suggestions for handling Indium-111 after years of experience working with this gamma, x-ray and electron emitter.。
PP-R增韧剂功能及应用
PP-R增韧剂功能及应用PP-R增韧剂功能及应用无规共聚：无规共聚所得的产物称为无规共聚物。
由两种(或两种以上)单体单元规则排列连接形成。
两种单体羊元序列长度分布各自均无规分布。
组成不均一的混合物。
无规共聚物都具有很好的性能。
抗蠕变性：材料在恒载下（外界载荷不变）的情况下，变形程度随时间增加的现象，蠕变不仅出现在塑料（高分子材料中），还出现在金属材料中．蠕变反映的是材料在载荷下的流变性质，即受载后的流动；对于塑料和其他高分子材料而言反映了其内在的粘弹性．蠕变性还反映了塑料在温度变化下，自身的稳定情况温度梯度：是自然界中气温、水温或土壤温度随陆地高度或水域及土壤深度变化而出现的阶梯式递增或递减的现象。
通常把温度增加的方向作为正方向。
结晶取向：聚合物以结晶态存在，取向为化学结构的取向排布温度是塑料结晶过程中最敏感的因素，温度相差1℃，则结晶的速度可相差几倍。
塑料熔体从Tm以上冷却到Tg以下，这一过程的速度称为冷却速度，它是晶核存在或生长的决定性条件。
PP-R存在的问题1、PPR材料天然缺陷：低温（0℃以下）韧性不好即会产生低温脆裂，特别是在北方低温水管会脆裂，施工的过程中还要轻拿轻放。
2、产生一定的废品率（20-40%）：管材在加工过程中管拉出来后会冷却，管材冷却即为结晶的过程，要求结晶取向、结晶粒越多越小，晶粒之间有许多连接点，表现为良好的韧性、抗压强度高且抗蠕变开裂，要求管材加工企业需要有严格的加工条件，精确的施工工艺控制和冷却定型温度梯度场值（受到环境、天气、温度、湿度、工艺等因素的影响）。
这对于绝大多数企业来说是一个难以逾越的挑战。
产生的废品需要破碎回炉。
3、PPR冷水管目前主要采用POE或EPDM等软性材料进行增韧处理，）这种增韧方法除了导致成本上升，另使管材使用寿命大幅下降（PPR 管材设计寿命为50年，此种增韧方式降到5年）这些增韧剂无法用在热水管，耐压强度不过关，因为这些增韧剂热变形温度在50℃，PPR热水管要求长期使用温度为70℃，短期使用温度为90℃。
keap1分子量
keap1分子量Keap1分子量是指Keap1蛋白的分子量。
Keap1蛋白是一种重要的调控蛋白，参与细胞氧化应激反应，对维持细胞内氧化还原平衡起着重要的作用。
本文将从Keap1蛋白的结构、功能以及与疾病相关的研究等方面进行介绍。
Keap1蛋白的分子量约为69 kDa。
它是一种由624个氨基酸组成的蛋白，属于Cullin-3依赖的底物适配器。
Keap1蛋白含有多个结构域，包括Broad-complex, Tramtrack, and Bric à brac (BTB)结构域、Kelch结构域和细胞粘附分子(C-Terminal)结构域。
这些结构域的存在使得Keap1蛋白能够与其他蛋白相互作用，并调控细胞内的信号传导通路。
Keap1蛋白的主要功能是通过调控转录因子Nrf2的稳定性来调节细胞内的氧化应激反应。
当细胞处于正常状态时，Keap1蛋白与Nrf2蛋白结合，使其降解，从而维持细胞内氧化还原平衡。
然而，当细胞受到氧化应激的刺激时，Keap1蛋白与Nrf2蛋白的结合被破坏，Nrf2蛋白得以逃脱降解，进入细胞核启动一系列抗氧化应激基因的转录，从而增强细胞的抗氧化能力。
近年来，越来越多的研究表明Keap1蛋白与多种疾病的发生发展密切相关。
例如，许多肿瘤细胞中Keap1蛋白的功能异常，导致Nrf2蛋白过度激活，增强了肿瘤细胞的抗氧化能力和耐药性。
因此，Keap1蛋白成为了肿瘤治疗的潜在靶点。
此外，Keap1蛋白在神经退行性疾病、心血管疾病以及糖尿病等疾病的发生中也发挥着重要作用。
为了更好地了解Keap1蛋白的结构和功能，许多研究人员进行了大量的实验和研究。
通过生化实验和结构生物学方法，人们揭示了Keap1蛋白与Nrf2蛋白结合的机制，以及Keap1蛋白的结构与功能之间的关系。
此外，还有研究发现Keap1蛋白的突变与一些疾病的发生有关，这为进一步研究Keap1蛋白的功能和疾病机制提供了新的线索。
Keap1蛋白作为一种重要的调控蛋白，在细胞氧化应激反应中起着关键的作用。
- 1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。
简介
成品或半成品生产完成后，做入库动作，会增加库存数量，假使入库数量等于生产单数量，工单的系统状态自动设为完全入库(DLV)。
生产入库包含正常产品入库以及副产品入库；
操作目录如下：
生产单正常入库 (2)
生产单副产品入库 (4)
生产单正常入库
菜单路径及事务代码
操作画面及说明
从菜单目录中一级一级找到MB31，或直接输入MB31
初始画面：
栏位说明：
下一画面：按[ENTER]，继续下一步。
检查无误后，点击保存，出现
,表示操作成功
生产单副产品入库
菜单路径及事务代码
输入后回车。