1N3087R;1N3085;1N3090R;中文规格书,Datasheet资料
NCV8450STT3G;中文规格书,Datasheet资料
NCV8450, NCV8450ASelf-Protected High Side Driver with Temperatureand Current LimitThe NCV8450/A is a fully protected High−Side Smart Discrete device with a typical R DS(on) of 1.0 W and an internal current limit of 0.8 A typical. The device can switch a wide variety of resistive, inductive, and capacitive loads.Features•Short Circuit Protection•Thermal Shutdown with Automatic Restart •Overvoltage Protection•Integrated Clamp for Inductive Switching•Loss of Ground Protection•ESD Protection•Slew Rate Control for Low EMI•Very Low Standby Current•NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable•This is a Pb−Free DeviceTypical Applications•Automotive•IndustrialPRODUCT SUMMARYSymbolCharacteristics Value Unit V IN_CL Overvoltage Protection54V V D(on)Operation Voltage 4.5 − 45V R on On−State Resistance 1.0WMARKINGDIAGRAM1AYWXXXXX GGXXXXX= V8450 or 8450AA= Assembly LocationY= YearW= Work WeekG= Pb−Free Package(Note: Microdot may be in either location)SOT−223(TO−261)CASE 318ESee detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet.ORDERING INFORMATIONFigure 1. Block Diagram V (Pins 2, 4)OUT(Pin 3)IN(Pin 1)PACKAGE PIN DESCRIPTIONPin #Symbol Description1IN Control Input, Active Low2V D Supply Voltage3OUT Output4V D Supply VoltageMAXIMUM RATINGSRatingSymbol ValueUnit Min Max DC Supply Voltage (Note 1)V D −1645V Load Dump Protection(RI = 2 W , t d = 400 ms, V IN = 0, 10 V, I L = 150 mA, V bb = 13.5 V)V Loaddump100V Input CurrentIin −1515mAOutput Current (Note 1)I out Internally Limited A Total Power Dissipation@ T A = 25°C (Note 2)@ T A = 25°C (Note 3)P D1.131.60WElectrostatic Discharge (Note 4)(Human Body Model (HBM) 100 pF/1500 W )Input All other15kVSingle Pulse Inductive Load Switching Energy (Note 4)(V DD = 13.5 V, I = 465 mApk, L = 200 mH, T JStart = 150°C)E AS 29mJ Operating Junction Temperature T J −40+150°C Storage TemperatureT storage−55+150°CStresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.1.Reverse Output current has to be limited by the load to stay within absolute maximum ratings and thermal performance.2.Minimum Pad.3. 1 in square pad size, FR −4, 1 oz Cu.4.Not subjected to production testing.THERMAL RESISTANCE RATINGSParameterSymbol Max Value Unit Thermal Resistance (Note 5)Junction −to −Ambient (Note 2)Junction −to −Ambient (Note 3)R q JA R q JA11078.3K/W5.Not subjected to production testing.Figure 2. Applications Test CircuitELECTRICAL CHARACTERISTICS (6 v V D v 45 V; −40°C <T J < 150°C unless otherwise specified)Rating Symbol ConditionsValueUnit Min Typ MaxOUTPUT CHARACTERISTICSOperating Supply Voltage V SUPPLY 4.5−45VOn Resistance(Pin 1 Connected to GND)R ON T J = 25°C , I OUT = 150 mA, V D = 7 V − 45 VT J = 150°C, I OUT = 150 mA, V D = 7 V − 45 V(Note 6)T J = 25°C , I OUT= 150 mA, V D = 6 V1.01.41.1232.1WStandby Current (Pin 1 Open)I D V D v 20 VV D> 20 V 0.610100m AINPUT CHARACTERISTICSInput Current – Off State I IN_OFF V OUT v 0.1 V, R L = 270 W, T J = 25°CV OUT v 0.1V, R L= 270 W, T J = 150°C (Note 6)−50−40m AInput Current – On State(Pin 1 Grounded)I IN_ON 1.53mA Input Resistance (Note 6)R IN1k W SWITCHING CHARACTERISTICSTurn−On Time (Note 7)(V IN = V D to 0 V) to 90% V OUT t ON R L = 270 W(Note 6)V D = 13.5 V, R L = 270 W, T J = 25°C30125100m sTurn−Off Time (Note 7)(V IN= 0 V to V D) to 10% V OUT t OFF R L = 270 W (Note 6)V D = 13.5 V, R L = 270 W, T J = 25°C60175150m sSlew Rate On (Note 7)(V IN = V D to 0V) 10% to 30% V OUT dV/dt ON R L = 270 W(Note 6)V D = 13.5 V, R L = 270 W, T J = 25°C0.744V/m sSlew Rate Off (Note 7)(V IN= 0 V to V D) 70% to 40% V OUT dV/dt OFF R L = 270 W (Note 6)V D = 13.5 V, R L = 270 W, T J = 25°C0.944V/m sOUTPUT DIODE CHARACTERISTICS (Note 6)Drain−Source Diode Voltage V F I OUT = −0.2 A0.6V Continuous Reverse DrainCurrentI S T J = 25°C0.2A PROTECTION FUNCTIONS (Note 8)Temperature Shutdown (Note 6)T SD150175−°C Temperature ShutdownHysteresis (Note 6)T SD_HYST5°COutput Current Limit I LIM T J = −40°C, V D = 13.5 V, t m = 100 m s (Note 6)T J = 25 °C, V D = 13.5 V, t m = 100 m sT J = 150 °C , V D = 13.5 V, t m = 100 m s (Note 6)0.50.81.5AOutput Clamp Voltage(Inductive Load Switch Off)At V OUT = V D− V CLAMPV CLAMP I OUT = 4 mA4552VOvervoltage Protection V IN_CL I CLAMP = 4 mA5054V6.Not subjected to production testing7.Only valid with high input slew rates8.Protection functions are not designed for continuous repetitive operation and are considered outside normal operating rangeR D S (o n ) (W )TEMPERATURE (°C)Figure 3. R DS(on) vs. TemperatureR D S (o n ) (W )OUTPUT LOAD (A)Figure 4. R DS(on) vs. Output LoadV D (V)Figure 5. R DS(on) vs. V DR D S (o n ) (W )1020304050607080T U R N O N T I M E (m s )TEMPERATURE (°C)Figure 6. Turn On Time vs. TemperatureTEMPERATURE (°C)Figure 7. Turn Off Time vs. TemperatureT U R N O F F T I M E (m s )S L E W R A T E (O N ) (V /m s )TEMPERATURE (°C)Figure 8. Slew Rate (ON) vs. Temperature−40−20020406080100120140−40−20020406080100120140−TEMPERATURE (°C)Figure 9. Slew Rate (OFF) vs. Temperature S L E W R A T E (O F F ) (V /m s )TEMPERATURE (°C)Figure 10. Current Limit vs. TemperatureC U R R E N T L I M I T (A )P E A K S C C U R R E N T (A )V D , VOLTAGE (V)Figure 11. Peak Short Circuit Current vs. V DVoltageTEMPERATURE (°C)Figure 12. V D Leakage Current vs.Temperature Off −StateV D , L E A K A G E C U R R E N T (m A )V D , L E A K A G E C U R R E N T (m A )V D , VOLTAGE (V)Figure 13. V D Leakage Current vs. V D VoltageOff −State TEMPERATURE (°C)Figure 14. On −State Input Current vs.TemperatureI N P U T C U R R E N T (m A )V D , VOLTAGE (V)Figure 15. Output Voltage vs. V D VoltageO U T P U T V O L T A G E (V )V D , VOLTAGE (V)Figure 16. Input Current vs. V D VoltageOn −StateI N P U T C U R R E N T (m A )LOAD INDUCTANCE (mH)Figure 17. Single Pulse Maximum Switch −offCurrent vs. Load InductanceC U R R E N T (m A )V D , VOLTAGE (V)Figure 18. Input Current vs. V D VoltageOff −StateI N P U T C U R R E N T (m A )−S H U T D O W N T I M E (m s )TEMPERATURE (°C)Figure 19. Initial Short −Circuit Shutdown Timevs. TemperaturePULSE TIME (s)R (t ), E F F E C T I V E T R A N S I E N T T H E R M AL R E S P O N S ECOPPER HEAT SPREADER AREA (mm 2)R q J A (°C /W )06080100120140Figure 20. R q JA vs. Copper Area2040Figure 21. Transient Thermal ResponseISO PULSE TEST RESULTSTest PulseTest Level Test ResultsPulse Cycle Time and Generator Impedance1200 V C 500 ms, 10 W 2150 V C 500 ms, 10 W 3a 200 V C 100 ms, 50 W 3b 200 V C 100 ms, 50 W 5175 VE(100 V)400 ms, 2 WORDERING INFORMATIONDevicePackage Shipping †NCV8450STT3G SOT −223(Pb −Free)4000 / Tape & Reel NCV8450ASTT3GSOT −223(Pb −Free)4000 / Tape & Reel†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.PACKAGE DIMENSIONSSOT −223 (TO −261)CASE 318E −04ISSUE MNOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: INCH.DIM A MIN NOM MAX MIN MILLIMETERS1.50 1.63 1.750.060INCHESA10.020.060.100.001b 0.600.750.890.024b1 2.90 3.06 3.200.115c 0.240.290.350.009D 6.30 6.50 6.700.249E 3.30 3.50 3.700.130e 2.20 2.30 2.400.0870.850.94 1.050.0330.0640.0680.0020.0040.0300.0350.1210.1260.0120.0140.2560.2630.1380.1450.0910.0940.0370.041NOM MAX L1 1.50 1.75 2.000.0606.707.007.300.2640.0690.0780.2760.287H E−−e10°10°0°10°q*For additional information on our Pb −Free strategy and solderingdetails, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION分销商库存信息: ONSEMINCV8450STT3G。
DMN601TK-7;中文规格书,Datasheet资料
Features• Low On-Resistance: R DS(ON) • Low Gate Threshold Voltage • Low Input Capacitance • Fast Switching Speed• Low Input/Output Leakage• Lead Free By Design/RoHS Compliant (Note 2) • ESD Protected Up To 2kV • "Green" Device (Note 4)Mechanical Data• Case: SOT-523 • Case Material: Molded Plastic, “Green” MoldingCompound. UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020D • Terminals: Finish ⎯ Matte Tin annealed over Alloy 42leadframe. Solderable per MIL-STD-202, Method 208 • Terminal Connections: See Diagram • Marking Information: See Page 3 • Ordering Information: See Page 3 • Weight: 0.002 grams (approximate)Maximum Ratings @T A = 25°C unless otherwise specifiedCharacteristicSymbol Value Units Drain-Source Voltage V DSS 60 VGate-Source Voltage V GSS±20 V Drain Current (Note 1) ContinuousPulsed (Note 3)I D300800mAThermal Characteristics @T A = 25°C unless otherwise specifiedCharacteristicSymbol Value Units Total Power Dissipation (Note 1)P D 150 mW Thermal Resistance, Junction to Ambient R θJA 833 °C/W Operating and Storage Temperature Range T J , T STG-65 to +150°CElectrical Characteristics @T A = 25°C unless otherwise specifiedCharacteristicSymbol Min Typ Max UnitTest ConditionOFF CHARACTERISTICS (Note 5) Drain-Source Breakdown Voltage BV DSS 60 ⎯ ⎯ V V GS = 0V, I D = 10μA Zero Gate Voltage Drain Current I DSS ⎯ ⎯ 1.0 μA V DS = 60V, V GS = 0V Gate-Source LeakageI GSS ⎯ ⎯ ±10 μA V GS = ±20V, V DS = 0V ON CHARACTERISTICS (Note 5) Gate Threshold VoltageV GS(th) 1.0 1.6 2.5 VV DS = 10V, I D = 1mA Static Drain-Source On-Resistance R DS (ON) ⎯ ⎯ ⎯ 2.0 3.0 ΩV GS = 10V, I D = 0.5A V GS = 5V, I D = 0.05A Forward Transfer Admittance |Y fs | 80 ⎯ ⎯ ms V DS =10V, I D = 0.2A DYNAMIC CHARACTERISTICS Input Capacitance C iss ⎯ ⎯ 50 pF V DS = 25V, V GS = 0V f = 1.0MHz Output CapacitanceC oss ⎯ ⎯ 25 pF Reverse Transfer CapacitanceC rss⎯⎯5.0pFNotes: 1. Device mounted on FR-4 PCB. 2. No purposefully added lead.3. Pulse width ≤10μS, Duty Cycle ≤1%4. Diodes Inc.’s “Green” policy can be found on our website at /products/lead_free/index.php.5. Short duration pulse test used to minimize self-heating effect.SOT-523TOP VIEWPin Out ConfigurationESD Protected up to 2kVEQUIVALENT CIRCUITPlease click here to visit our online spice models database.V , DRAIN-SOURCE VOLTAGE (V)Fig. 1 Typical Output CharacteristicsDS I , D R A I N C U R R E N T (A )DFig. 2 Typical Transfer CharacteristicsGS T , CHANNEL TEMPERATURE (°C)Fig. 3 Gate Threshold Voltage vs. Channel T emperaturech 00.51.5I DRAIN CURRENT (A)Fig. 4 Static Drain-Source On-Resistancevs. Drain CurrentD , R , S T A T I C D R A I N -S O U R CE D S (O N)Fig. 5 Static Drain-Source On-Resistancevs. Drain CurrentDR , S T A T I C D R A I N -S O U R C E D S (O N )V GATE SOURCE VOLTAGE (V)Fig. 6 Static Drain-Source On-Resistancevs. Gate-Source VoltageGS,R , S T A T I C D R A I N -S O U R C E O N -R E S I S T A N C E ()D S (O N )ΩFig. 7 CH Static Drain-Source On-State Resistancevs. Channel T emperatureR , S T A T I C D R A I N -S O U R C E D S (O N )1I , R E V E R S E D R A I N C U R RE N T (A )D R 1I , DRAIN CURRENT (A)D Fig.10 Forward Transfer Admittancevs. Drain CurrentOrdering Information (Note 6)Part Number Case Packaging DMN601TK-7SOT-523 3000/Tape & ReelNotes: 6. For packaging details, go to our website at /datasheets/ap02007.pdf.Marking InformationDate Code KeyYear 2005 2006 2007 2008 2009 2010 2011 2012 Code S T U V W X Y ZMonth Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Code 1 2 3 4 5 6 7 8 9 O N DK7K = Product Type Marking Code YM = Date Code Marking Y = Year (ex: S = 2005) M = Month (ex: 9 = September) K7K YMPackage Outline DimensionsSuggested Pad LayoutIMPORTANT NOTICEDiodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages.LIFE SUPPORTDiodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated.SOT-523Dim Min Max Typ A 0.15 0.30 0.22 B 0.75 0.85 0.80 C 1.45 1.75 1.60 D ⎯ ⎯ 0.50 G 0.90 1.10 1.00 H 1.50 1.70 1.60 J 0.00 0.10 0.05 K 0.60 0.80 0.75 L 0.10 0.30 0.22 M 0.10 0.20 0.12 N 0.45 0.65 0.50α0° 8° ⎯ All Dimensions in mmDimensions Value (in mm)Z1.8 X 0.4 Y 0.51 C 1.3 E 0.7X EYCZ分销商库存信息: DIODESDMN601TK-7。
1N18中文资料
FIG.3-TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS
FIG.4-TYPICAL REVERSE CHARACTERISTICS
IN STAN TANEOUS FORWARD CURRENT( AMPERES)
TJ=125 C
PULSE WIDTH=300 S 1% DUTY CYCLE
Maximum Ratings
• • • • Operating Temperature: -55°C to +125°C Storage Temperature: -55°C to +125°C Typical Thermal Resistance: 50oC/W junction to Ambient For capacitive load. Derate current by 20% Maximum Recurrent Peak Reverse Voltage 20V 30V 40V Maximum DC Blocking Voltage 20V 30V 40V
RESISTIVE OR INDUCTIVE LOAD 0.375" (9.5MM) LEAD LENGTH
PEAK FORWARD SURGE CURRENT(AMPERES)
LEAD TEMPERATURE ( C)
NUMBER OF CYCLES AT 60Hz
JUNCTION CAPACITANCE(pF)
TJ=25 C f=1.0MHZ
Vsig=50mVp-p
2N2905A;中文规格书,Datasheet资料
2N2905A 2N2907ASMALL SIGNAL PNP TRANSISTORSDESCRIPTION The 2N2905A and 2N2907A are silicon Planar Epitaxial PNP transistors in Jedec TO-39 (for 2N2905A) and in Jedec TO-18 (for 2N2907A)metal case. They are designed for high speed saturated switching and general purpose applications.February 2003ABSOLUTE MAXIMUM RATINGS®1/7THERMAL DATAELECTRICAL CHARACTERISTICS (T case = 25 oC unless otherwise specified)** See test circuit2N2905A/2N2907ANormalized DC Current Gain.Collector Emitter Saturation Voltage.Collector Base and Emitter-base capacitances.Switching Characteristics.2N2905A/2N2907A2N2905A/2N2907A.Test Circuit for t on, t r, t d ArrayTest Circuit for t off, t o, t f.2N2905A/2N2907A2N2905A/2N2907AInformation furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.The ST logo is a trademark of STMicroelectronics © 2003 STMicroelectronics – Printed in Italy – All Rights ReservedSTMicroelectronics GROUP OF COMPANIESAustralia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States.2N2905A/2N2907A分销商库存信息: STM2N2905A。
GS100502;GS100701;中文规格书,Datasheet资料
GS1005-GS1007 SpecificationsDescriptionThe GS1005-1007 series gear tooth sensors are Hall Effect devices designed for use in applications where ferrous edge detection or near zero speed sensing (without power uprecognition) is needed. Current sinking output requires the use of a pull up resistor.Features and Benefits∙ Immune to rotational alignment∙ ESD resistant to 4kV (contact discharge) ∙ Mating connector: Delphi 12162280∙ Discrete wire version: 20awg, tin plated polyolefin insulation.Applications∙ Exercise equipment∙ Food processing equipment ∙SpeedometerNote: These sensors require the use of an external pull-up resistor, the value is dependent upon the supply voltage. Pull-up resistor should be connected between output (Black) and Vcc (Brown). See chart on next page for recommendations.Dimensions mmGS100701 GS100502GS100501Mechanical SpecificationsAirgrap Application dependentMaximum Installation Torque 50 in-lbs (for a ¼ - 20 Hex Cap screw)Electrical SpecificationsOperating Voltage Range 5 - 24 VDCSupply Voltage 24 - 30 VDCSupply Current 6 mA maxOutput Saturation Voltage 400 mV maxOutput Current 20 mA maxOperating Temperature-40° to +125°C (GS100502 & GS100701) -40° to +105°C (GS100501)Storage Temperature Range -40° to +125°C (GS100502 & GS100701) -40° to +105°C (GS100501)Output Rise time 5μSOutput Fall time 5μSElectrostatic Discharge Immunity + 3kV indirect contact, + 4kV direct contactElectric Field Radiated Immunity At 10V/m (using 30% amplitude modulation @ 1kHz) from 26Mz to 1000 MHz Electrical Fast Transient Test + 2kV on DC power supplyImmunity to Magnetic Fields SAE J1113-22 (600 microT AC field; 5Hz to 2kHz; .2mT & 1mT DC field) Conducted Immunity Test Injected with 10Vrms from 150kHz to 80 MHzDielectric Withstand Voltage MIL-STD-202F, Method 301 1000V applied for a minimum of one minute. Insulation Resistance MIL-STD-202F, Method 302, Test Condition B 500V applied for one minute.Water Immersion MIL-STD 202F, Method 104, Test Condition ASalt Spray MIL-STD-202F, Method 101, Test Condition BSinusoidal Vibration MIL-STD-202F Method 204, Test Condition C from 55-2000 HzRandom Vibration MIL-STD-20F Method 214, Test Condition ICMechanical Shock 18 shocks at 50g’s 11ms per Mil Std 202FRecommended external pull-up resistor: Open Collector Sinking Block DiagramContactCall, fax or visit our websiteFor more information.ZF Electronics Corporation11200 88th AvenuePleasant Prairie, WI 53158Phone: 262.942.6500Web: E-Mail: cep_sales@Fax: 262.942.6566© 2008 ZF Electronics Corporation Revised 083011 Specifications subject to change without notice.分销商库存信息:CHERRYGS100502GS100701。
1N4735A-A中文资料
1N4728A - 1N4761A1.0W ZENEDIODENote: 1. Valid provided that leads are kept at T L @ 50°C with lead length = 9.5mm (3/8”) from case.2. EC Directive 2002/95/EC (RoHS) revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied where applicable,see EU Directive Annex Notes 5 and 7.Mechanical Data·1.0 Watt Power Dissipation · 3.3V - 75V Nominal Zener Voltage ·Standard V Z Tolerance is 5%·Lead Free Finish, RoHS Compliant (Note 2)·Case: DO-41·Case Material: Glass. UL Flammability Classification Rating 94V-0·Moisture Sensitivity: Level 1 per J-STD-020C ·Terminals: Finish ¾ Sn96.5Ag3.5. Solderable per MIL-STD-202, Method 208·Polarity: Cathode Band ·Marking: Type Number·Weight: 0.35 grams (approximate)FeaturesElectrical Characteristics @ T A = 25°C unless otherwise specifiedNotes: 3. Measured under thermal equilibrium and dc (I ZT) test conditions.4. The Zener impedance is derived from the 60 Hz ac voltage which results when an ac current having an rms value equal to10% of the Zener current (I ZT or I ZK) is superimposed on I ZT or I ZK. Zener impedance is measured at two points to insure asharp knee on the breakdown curve and to eliminate unstable units.Notes: 5. *Add "-A" or "-T" to the appropriate type number in Table 1. Example: 6.2V Zener = 1N4735A-A for ammo pack. 6. For packaging details, visit our website at /datasheets/ap02008.pdf00.20.40.60.81.004080120160200P , T O T A L P O W E R D I S S I P A T I O N (W )d T , AMBIENT TEMPERATURE ( C)A Fig.1 Power Dissipation vs Ambient Temperature0250515202530l, Lead Length (mm)Fig. 2 Typical Thermal Resistance vs. Lead Length10200501001501101001000110100V , ZENER VOLTAGE (V)Z Fig. 4 Typical Zener Impedance vs. Zener Voltage1101001000102030405060C ,D I O DE C A P A C I T A N C E (pF )j V , ZENER VOLTAGE (V)Z Fig.3, Junction Capacitance vs Zener Voltagef = 1MHz T = 25CA V = 0V R V = 2V R V = 5V R V = 20VR V = 30VR Ordering Information(Note 6)IMPORTANT NOTICEDiodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages.LIFE SUPPORTDiodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated.。
0430450428;中文规格书,Datasheet资料
This document was generated on 08/20/2012PLEASE CHECK FOR LATEST PART INFORMATIONPart Number:43045-0428Status:ActiveOverview:Micro-Fit 3.0™ ConnectorsDescription:3.00mm Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Dual Row, Vertical,with PCB Polarizing Peg, 4 Circuits, 0.38µm Gold (Au) Selective Plating, Glow Wire CompatibleDocuments:3D ModelTest Summary TS-43045-002 (PDF)Drawing (PDF)RoHS Certificate of Compliance (PDF)Product Specification PS-43045 (PDF)Product Literature (PDF)Test Summary TS-43045-001 (PDF)Agency CertificationCSA LR19980TUV R72081037ULE29179GeneralProduct Family PCB Headers Series43045Application Power, Wire-to-BoardComments"This Molex product is manufactured from material that has the following ratings, tested by independent agencies:. a) A Glow Wire Ignition Temperature (GWIT)of at least 775 deg C per IEC 60695-2-13.. b) A Glow Wire Flammability Index (GWFI) above 850 deg C per IEC 60695-2-12.and hence complies with therequirements set out in the International Standard IEC 60335-1 5th edition - household and similar electrical appliances - safety, section 30 Resistance to heat and fire. <P><P> The customers using this product must determine its suitability for use in their particular application through testing or other acceptable means as described in end-product glow-wire flammability test standard IEC 60695-2-11 and any applicable product end-use standard(s). <P> If it is determined during the customer’s evaluation of suitability, that higher performance is required, please contact Molex for possible product options."OverviewMicro-Fit 3.0™ Connectors Product Literature Order No 987650-5984Product Name Micro-Fit 3.0™UPC800753813205PhysicalBreakawayNo Circuits (Loaded)4Circuits (maximum)4Color - ResinBlack Durability (mating cycles max)30Flammability94V-0Glow-Wire Compliant Yes Lock to Mating Part YesMated Height 17.27mm Material - MetalBrassSeriesimage - Reference onlyEU RoHSChina RoHSELV and RoHS Compliant REACH SVHCContains SVHC: No Low-Halogen Status Low-HalogenNeed more information on product environmental compliance?Email productcompliance@For a multiple part number RoHS Certificate of Compliance, click herePlease visit the Contact Us section for any non-product compliance questions.Search Parts in this Series 43045Series Mates With 43025Material - Plating Mating GoldMaterial - Plating Termination TinMaterial - Resin High Temperature ThermoplasticNet Weight0.729/gNumber of Rows2Orientation VerticalPC Tail Length 3.18mmPCB Locator YesPCB Retention NonePCB Thickness - Recommended 1.60mmPackaging Type TrayPitch - Mating Interface 3.00mmPlating min - Mating0.381µmPlating min - Termination 2.540µmPolarized to PCB YesShrouded FullyStackable NoSurface Mount Compatible (SMC)YesTemperature Range - Operating-40°C to +105°CTermination Interface: Style Through HoleElectricalCurrent - Maximum per Contact5AVoltage - Maximum250VSolder Process DataDuration at Max. Process Temperature (seconds)30Lead-free Process Capability SMC & Wave Capable (TH only)Max. Cycles at Max. Process Temperature3Process Temperature max. C260Material InfoReference - Drawing NumbersProduct Specification PS-43045, RPS-43045-003, RPS-43045-004Sales Drawing SD-43045-010Test Summary TS-43045-001, TS-43045-002This document was generated on 08/20/2012PLEASE CHECK FOR LATEST PART INFORMATION分销商库存信息: MOLEX 0430450428。
RS485通讯芯片3085 SOP-8规格书
典型值 -
最大值 5.5 5 -
单位 V V V V V V V V uA
Vcc VOD1 VOD2 ∆VOD VOC ∆VOC VIH VIL IIN1
DE,RE ,DI
____
-
0.2 3
40 60
0.2 0.8 ±2 90
2 -
DE,RE ,DI
____
DE,RE ,DI DE=0V, Vcc=5V VIN=5V VIN=0V
输入电流(A,B)
IIN2
uA 100 3 / 10
SN3085.VER.1.2
SN3085
接收器差分输入阈值电 压 接收器输入迟滞 接收器输出高电平 接收器输出低电平 接收器端三态（高阻）输 出电流 接收器输入阻抗
VTH ∆VTH VOH VOL IOZR RIN
-7V ≤VCM≤+12V
-200 -
图6：驱
A/B + 50 0R
VID B
R DIFF
1/2Vcc
t DPHL
DE A
C L2
CL
1/2Vcc
RO
t RLZ VOL+0. 5V
VOL+0. 5V
VOH VOL
0V
t DZL
Vcc
t DLZ
1/2V O
RO
2. 3V
2. 3V
t RZL
输出 一般为 低
输出 一般为 低
A B
图3：驱动器开关特性测试负载
存储温度范围 工作温度范围 最大工作温度范围 8 脚塑封 DIP（+70℃以上） 8 脚塑封 SOP（+70℃以上） 焊锡温度（10 秒）
直流特性（如无特别说明 Vcc=5V±5%，T =25℃）（注 1）：
LY1005_Datasheet
注 4：典型参数值为 25˚C 下测得的参数标准。 注 5：规格书的最小、最大规范范围由测试保证，典型值由设计、测试或统计分析保证。
Strong Link Electronics
LY-DOC1005 REV:1.0 Jun.2012
4/11
Shen Zhen Strong Link Electronics
特点
临界模式工作，无需电感补偿 内置 功率 MOSFET 源极驱动，无需辅助绕组供电 高达±3%的 LED 电流精度 高达 93%以上的系统效率 LED 短路保护 CS 采样电阻短路保护 芯片过温保护
应用
球泡灯 蜡烛灯 玉米灯
T5 T8
典型应用
AC
LY1005
LY-DOC1005 REV:1.0 Jun.2012
2/11
Shen Zhen Strong Link Electronics
非隔离降压型 LED 恒流控制器
极限参数(注 1)
符号 VDS ICC_MAX VLN VSOURCE VCS PDMAX θJA TJ TSTG 参数 内部高压 MOSFET 漏极到源极峰值电压 最大电源电流 线补偿电压 内部高压 MOSFET 的源极电压 电流采样端电压 功耗(注 2) PN 结到环境的热阻 工作结温范围 储存温度范围 ESD (注 3) 参数范围 -0.3~600V 5 -0.3~18 -0.3~18 -0.3~6 0.9 80 -40 to 150 -55 to 150 2 单位 V mA V V V W ℃/W ℃ ℃ KV
非隔离降压型 LED 恒流控制器
效率对负载的变化
内部结构框图
DRAIN
VCC
8V 7V
HER308中文资料
HER308
中文名 HER308 反向峰值电压 1000V 最大RMS电压 700V 最大直流电压 1000V
目录
▪参数
▪特点
基本信息:
高效整流管
封装简单
快速开关效率高
低反向漏电流
高正向浪涌电流承受能力
耐焊接热高
最大平均整流电流：3.0A
正向压降：1.7V
最大直流反向电流：10uA
恢复时间：75ns
工作结温：-55℃ to +150℃
封装：DO-27，DO-214AB(SMC)
特点
1、能持续稳定的工作在高温环境下；
2、高反偏特性（可大于1800V）；
3、优秀且稳定的硬击穿特性；
4、采用先进的真空焊接工艺，保证低接触电阻及优良的导电性能；
5、专有钝化技术提供卓越的PN结保护，确保器件的高可靠性。
CN3085应用电路图
1-4 节镍氢电池充电电路 CN3085 应用电路图
1、 简介
CN3085 是可以对 1-4 节镍氢电池进行充电的充电器电路。该器件内部包括功率晶体管，应用时不 需要外部的电流检测电阻和阻流二极管，因此只需要极少的外围元器件，非常适用于便携式用 的领域。
2、 特点
●可以用 USB 口或交流适配器对 1-4 节镍氢电池充电 ●片内功率晶体管 ●不需要外部阻流二极管和电流检测电阻 ●输出电压精度可达 1% ●在电池电压较低时采用小电流的预充电模式 ●用户可编程的持续充电电流可达 1A ●采用涓流/恒流/定时充电模式 ●电源电压掉电时自动进入低功耗的睡眠模式 ●状态指示输出可驱动 LED 或与单片机接口 ●电池温度监测功能 ●芯片使能输入端 ●封装形式 SOP8 ●产品无铅化
3、 应用
●移动电话 ●电子词典 ●数码相机 ●MP3 播放器 ●蓝牙应用 ●各种充电器
Rev 0
1
如韵电子 CONSONANCE
应用电路 1
单节镍氢电池，1A 充电，定时 1 个小时左右，应用电路图，不使用温度检测功能。
输 入 3.5V电 源 1uF 100k 330
1uF 100k 330
4
VIN
5 BAT
10uF
BAT+ 电池
390k
红
7
CN3085
CHRG
FB 8
33uF
6 RC
TEMP 1 2
ISET
GND 3
1.22k
100k
应用电路 5（适合同时应用 USB 接口和墙上适配器充电）
同时应用 USB 接口和墙上适配器为锂电池充电，当墙上适配器有电时，则使用墙上适配器充电； 当墙上适配器没电时，则使用 USB 接口为锂电池充电。本应用电路只给出输入电源的连接，其它
ats3085技术手册
ats3085技术手册一、简介本技术手册旨在为使用ats3085技术的用户提供详细的技术资料和操作指南。
ats3085是一种常用的电源管理芯片，广泛应用于各种电子设备中，如智能手机、平板电脑、笔记本电脑等。
本手册将介绍ats3085的基本原理、功能特点、应用场景、安装与连接、参数设置、故障排查等方面的问题。
二、基本原理ats3085是一款电源管理芯片，它能够将交流电网电压转换为直流电压，并对电池进行充电。
同时，它还具有多种电源管理功能，如电压调节、电流限制、过充保护、过放保护等。
ats3085采用先进的控制算法和电路设计，能够实现高效、稳定的电源管理，确保电子设备的正常运行。
三、功能特点1.支持多种输入电压范围，适应不同国家和地区电网环境；2.集成度高，体积小，易于集成到各种电子设备中；3.具有良好的电压调节和电流限制功能，确保设备安全稳定运行；4.支持过充、过放、过载等保护功能，延长电池使用寿命；5.智能化控制，可实现动态调整充电电流和电压，提高充电效率。
四、应用场景ats3085适用于各种需要电源管理的电子设备，如智能手机、平板电脑、笔记本电脑等。
在应用中，ats3085可以与电池、充电电路等部件配合使用，实现高效的电源管理。
例如，在手机中，ats3085可以控制充电电路为电池充电，同时保护电池的安全和使用寿命。
五、安装与连接1.确认ats3085的安装位置，确保其散热良好；2.根据设备的要求，选择合适的输入输出接口；3.将ats3085与相关电路连接，按照说明书中的指示进行接线；4.确认连接无误后，进行通电测试，确保设备正常运行。
六、参数设置ats3085具有多种可配置参数，如输入电压范围、充电电流等。
用户可以根据设备的需求和实际使用情况，进行相应的参数设置。
在设置参数时，需要注意安全和使用规范，避免出现意外情况。
七、故障排查在使用ats3085的过程中，可能会出现一些故障问题。
本手册提供了常见的故障现象和排查方法，帮助用户快速定位和解决问题。
744710215;中文规格书,Datasheet资料
5.1 5.0 4.02012-06-272012-05-022009-06-30SStSStRStSStCZWürth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyTel. +49 (0) 79 42 945 - 0A Dimensions: [mm]F Typical Impedance Characteristics:H4: Classification Wave Soldering Profile:H5: Classification Wave ProfileProfile FeaturePreheat- Temperature Min (T smin )- Temperature Typical (T stypical ) - Temperature Max (T smax ) - Time (t s ) from (T smin to T smax )Δ preheat to max Temperature Peak temperature (T p )Time of actual peak temperature (t p )Ramp-down rate - Min - Typical - MaxTime 25°C to 25°C Pb-Free Assembly 100°C 120°C 130°C 70 seconds 150°C max.250°C - 260°C max. 10 secondsmax. 5 second each wave ~ 2 K/s ~ 3.5 K/s ~ 5 K/s 4 minutesSn-Pb Assembly 100°C 120°C 130°C 70 seconds 150°C max.235°C - 260°C max. 10 secondsmax. 5 second each wave ~ 2 K/s ~ 3.5 K/s ~ 5 K/s 4 minutesrefer to EN 61760-1:2006H Soldering Specifications:I Cautions and Warnings:The following conditions apply to all goods within the product series of WE-SDof Würth Elektronik eiSos GmbH & Co. KG:General:All recommendations according to the general technical specifications of the data-sheet have to be complied with.The disposal and operation of the product within ambient conditions which probably alloy or harm the wire isolation has to be avoided.If the product is potted in customer applications, the potting material might shrink during and after hardening. Accordingly to this the product is exposed to the pressure of the potting material with the effect that the core, wire and termination is possibly damaged by this pressure and so the electrical as well as the mechanical characteristics are endanger to be affected. After the potting material is cured, the core, wire and termination of the product have to be checked if any reduced electrical or mechanical functions or destructions have occurred.The responsibility for the applicability of customer specific products and use in a particular customer design is always within the authority of the customer. All technical specifications for standard products do also apply for customer specific products.Washing varnish agent that is used during the production to clean the application might damage or change the characteristics of the wire in-sulation, the marking or the plating. The washing varnish agent could have a negative effect on the long turn function of the product.Direct mechanical impact to the product shall be prevented as the ferrite material of the core could flake or in the worst case it could break. Product specific:Follow all instructions mentioned in the datasheet, especially:•The solder profile has to be complied with according to the technical wave soldering specification, otherwise no warranty will be sustai-ned.•All products are supposed to be used before the end of the period of 12 months based on the product date-code, if not a 100% solderabi-lity can´t be warranted.•Violation of the technical product specifications such as exceeding the nominal rated current will result in the loss of warranty.1. General Customer ResponsibilitySome goods within the product range of Würth Elektronik eiSos GmbH & Co. KG contain statements regarding general suitability for certain application areas. These statements about suitability are based on our knowledge and experience of typical requirements concerning the are-as, serve as general guidance and cannot be estimated as binding statements about the suitability for a customer application. The responsibi-lity for the applicability and use in a particular customer design is always solely within the authority of the customer. Due to this fact it is up to the customer to evaluate, where appropriate to investigate and decide whether the device with the specific product characteristics described in the product specification is valid and suitable for the respective customer application or not.2. Customer Responsibility related to Specific, in particular Safety-Relevant ApplicationsIt has to be clearly pointed out that the possibility of a malfunction of electronic components or failure before the end of the usual lifetime can-not be completely eliminated in the current state of the art, even if the products are operated within the range of the specifications.In certain customer applications requiring a very high level of safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health it must be ensured by most advanced technological aid of suitable design of the customer application that no injury or damage is caused to third parties in the event of malfunction or failure of an electronic component.3. Best Care and AttentionAny product-specific notes, warnings and cautions must be strictly observed.4. Customer Support for Product SpecificationsSome products within the product range may contain substances which are subject to restrictions in certain jurisdictions in order to serve spe-cific technical requirements. Necessary information is available on request. In this case the field sales engineer or the internal sales person in charge should be contacted who will be happy to support in this matter.5. Product R&DDue to constant product improvement product specifications may change from time to time. As a standard reporting procedure of the Product Change Notification (PCN) according to the JEDEC-Standard inform about minor and major changes. In case of further queries regarding the PCN, the field sales engineer or the internal sales person in charge should be contacted. The basic responsibility of the customer as per Secti-on 1 and 2 remains unaffected.6. Product Life CycleDue to technical progress and economical evaluation we also reserve the right to discontinue production and delivery of products. As a stan-dard reporting procedure of the Product Termination Notification (PTN) according to the JEDEC-Standard we will inform at an early stage about inevitable product discontinuance. According to this we cannot guarantee that all products within our product range will always be available. Therefore it needs to be verified with the field sales engineer or the internal sales person in charge about the current product availability ex-pectancy before or when the product for application design-in disposal is considered.The approach named above does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.7. Property RightsAll the rights for contractual products produced by Würth Elektronik eiSos GmbH & Co. KG on the basis of ideas, development contracts as well as models or templates that are subject to copyright, patent or commercial protection supplied to the customer will remain with Würth Elektronik eiSos GmbH & Co. KG.8. General Terms and ConditionsUnless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms and Conditions of Würth Elektronik eiSos Group”, last version available at .J Important Notes:The following conditions apply to all goods within the product range of Würth Elektronik eiSos GmbH & Co. KG:分销商库存信息: WURTH-ELECTRONICS 744710215。
FSQ0465RSWDTU;中文规格书,Datasheet资料
Switch (FPS™)!AN-4141: Troubleshooting and Design Tips for Fairchild Power Switch (FPS™) Flyback Applications !AN-4145: Electromagnetic Compatibility for Power Converters!AN-4147: Design Guidelines for RCD Snubber of DescriptionA Quasi-Resonant Converter (QRC) generally shows lower EMI and higher power conversion efficiency than a conventional hard-switched converter with a fixed switching frequency. The FSQ-series is an integrated Pulse-Width Modulation (PWM) controller and SenseFET specifically designed for quasi-resonant operation and Alternating Valley Switching (AVS). The PWM controller includes an integrated fixed-frequency oscillator, Under-Voltage Lockout (UVLO), Leading-Edge Blanking (LEB), optimized gate driver, internal soft-start, temperature-compensated precise current sources for a loop compensation, and self-protection circuitry. Compared with a discrete MOSFET and PWM controller solution, the FSQ-series can reduce total cost, component count, size, and weight; while simultaneously increasing efficiency, productivity, and system reliability. This device provides a basic platform for cost-effective designs of quasi-resonant switching flyback converters.FSQ0465RS/RB — Green-Mode Farichild Power Switch (FPS™) for Quasi-Resonant Operation Green-Mode Fairchild Power Switch (FPS™) for Quasi-Resonant Operation - Low EMI and High Efficiency Features!Optimized for Quasi-Resonant Converters (QRC)!Low EMI through Variable Frequency Control and AVS (Alternating Valley Switching)!High-Efficiency through Minimum Voltage Switching!Narrow Frequency Variation Range over Wide Load and Input Voltage Variation!Advanced Burst-Mode Operation for Low Standby Power Consumption!Simple Scheme for Sync Voltage Detection!Pulse-by-Pulse Current Limit !Various Protection Functions: Overload Protection (OLP), Over-Voltage Protection (OVP), Abnormal Over-Current Protection (AOCP), Internal Thermal Shutdown (TSD) with Hysteresis, Output Short Protection (OSP) !Under-Voltage Lockout (UVLO) with Hysteresis!Internal Startup Circuit !Internal High-Voltage Sense FET (650V)!Built-in Soft-Start (17.5ms)Applications!Power Supply for LCD TV and Monitor, VCR, SVR, STB, and DVD & DVD Recorder!Adapter Related Resources Visit: /apnotes/ for:!AN-4134: Design Guidelines for Offline Forward Converters Using Fairchild Power Switch (FPS™)!AN-4137: Design Guidelines for Offline Flyback Converters Using Fairchild Power Switch (FPS™)!AN-4140: Transformer Design Consideration for Offline Flyback Converters Using Fairchild PowerV SD V OCP SQQR GNDAOCP(1.1V)TSD2V OSPLPFLPFV CCθJC Junction-to-Case Thermal Resistance 2.8C/W Notes:8.Free-standing with no heat-sink under natural convection.9.Infinite cooling condition - refer to the SEMI G30-88.FSQ0465RS/RB — Green-Mode Farichild Power Switch (FPS™) for Quasi-Resonant Operation Comparison Between FSDM0x65RNB and FSQ-Series Function FSDM0x65RE FSQ-Series FSQ-Series Advantages Operation Method Constant Frequency PWM Quasi-Resonant Operation!Improved efficiency by valley switching!Reduced EMI noise!Reduced components to detect valley point EMI Reduction Frequency Modulation Reduced EMI Noise !Valley Switching!Inherent Frequency Modulation!Alternate Valley Switching Hybrid Control CCM or AVS Based on Load and Input Condition!Improves efficiency by introducing hybrid control Burst-Mode Operation Burst-Mode Operation Advanced Burst-Mode Operation!Improved standby power by advanced burst-mode Strong Protections OLP, OVP OLP, OVP, AOCP, OSP!Improved reliability through precise AOCP!Improved reliability through precise OSP TSD145°C without Hysteresis140°C with 60°C Hysteresis!Stable and reliable TSD operation!Converter temperature range0.20.40.60.20.40.6N0.00.20.40.60.00.20.40.6分销商库存信息: FAIRCHILDFSQ0465RSWDTU。
ORH-YG35A（IF=20mA） 2.0x1.25x0.8mm（0805）标准包装的阿尔加韦伯
PLCC LED Series DatasheetORH-YG35A(IF=20mA)1.Features:⏹Chip material:AlGaInP/GaAs.⏹Emitted Color:Super Yellow Green.⏹Lens Appearance:Water Clear.⏹Mono-color type.⏹ 2.0x1.25x0.8mm(0805)standard package.⏹Suitable for all SMT assembly methods.⏹Compatible with infrared and vapor phase reflow solder process.⏹Compatible with automatic placement equipment.⏹This product doesn’t contain restriction substance,comply ROHS standard.2.Applications:⏹Automotive:Dashboards,stop lamps,turn signals.⏹Backlighting:LCDs,Key pads advertising.⏹Status indicators:Comsumer&industrial electronics.⏹General use.ORH-YG35A 3.Package Dimensions:4.Absolute Maximum Ratings(Ta=25℃)Parameter Symbol Rating Unit Power Dissipation Pd120mW Forward Current I F30mA Peak Forward Current＊1I FP100mA Operating Temperature Topr-25℃~80℃-Storage Temperature Tstg-30℃~85℃-Soldering Temperature Tsol260℃-＊1Condition for I FP is pulse of1/10duty and0.1msec width.5.Electrical and optical characteristics(Ta=25℃)Parameter Symbol Condition Min.Typ.Max.Unit Forward Voltage Vf I F=20mA 1.8- 2.4V Luminous Intensity Iv I F=20mA1840-mcd Peak Wave Lengthλp I F=20mA-570-nm Dominant Wave Lengthλd I F=20mA566-578nm Spectral Line Half-widthΔλI F=20mA-30-nm Veiwing Angle2θ1/2I F=20mA-120-degORH -YG35A6.Typical Electro-Optical Characteristics CurvesFig.5 Relative luminous intensity vs. forward currentR e l a t i v e l u m i n o u s i n t e n s i t y (@20m A )0.51.01.52.0F o r w a r d c u r r e n t (m A )20103040Forward voltage(V)Fig.3 Forward current vs. forward voltageFig.1 Relative intensity vs. wavelengthR e l a t i v e r a d i a n t i n t e n s i t y500.5Wavelength (nm)R e l a t i v e L u m i n o u s i n t e n s i t yAmbient temperature Ta( C)A(N o r m a l i z e d @20m A )0.51.002.02.51.5vs. ambient temperatureAmbient temperature Ta( C)F o r w a r d c u r r e n t (m A )3.0103040206050Fig.2 Forward current derating curveFig.4 Relative luminous intensity vs.ambient temperatureForward current (mA)R E L A T I V E R A D I A N T I N T E N S I T YRADIATION DIAGRAM0.90.70.890807060501.0020104030ORH-YG35A 7.Judgment criteria of failure for the reliabilityMeasuring items Symbol Measuring conditions Judgement criteria for failure Forward voltage V F(V)I F=20mA Over Ux1.2Reverse current I R(uA)V R=5V Over Ux2Luminous intensity Iv(mcd)I F=20mA Below SX0.5Note:1).U means the upper limit of specified characteristics.S means initial value.2).Measurment shall be taken between2hours and after the test pieces have been returned tonormal ambient conditions after completion of each test.8.Bin LimitsIntensity Bin Limits(At20mA)BIN CODE Min.(mcd)Max.(mcd)L1828M2842N4263P6394Tolerance for each Bin limit is±15%.Color Bin Limits(At20mA)BIN CODE Min.(v)Max.(v)4566569556957265725757575578Tolerance for each Bin limit is±1nm.ORH -YG35AV F Bin Limits (At 20mA)BIN CODEMin.(v)Max.(v)B 1.8 2.0C 2.0 2.2D2.22.4Tolerance for each Bin limit is ±0.05V.9.BIN ：x x xV F BI N CO D E Co l o r BI N CO D E In t e n s i t y BI N CO D E10.Tapping and packaging specifications(Units:mm)FIXING TAPE0.3TRAILERLEADER2.26±0.171.0±1±±USER DIRECTION OF FEEDC A T H OD E4.0A N O D E5.3±0.05START1.420.38.0±NOTE: 4000 pcs PER REEL3.52.0±0.054.00.1±0.11.5±0.11.750.1±0.1END±0.05±13.00.5ORH-YG35A 11.Package Method:(unit:mm)12.Package and Label of Products:(1)Package:Products are packed in one bag of3000pcs(one taping reel)and a label is attached oneach bag.(2)Label:ORIENT LOGOPart No.QuantityBINSealing Datex xx xx xxYear Month DayManufacture LocationORH-YG35A 13.Reliability TestClassification Test Item Reference Standard Test Conditions ResultEnduranceTest Operation Life MIL-STD-750:1026MIL-STD-883:1005JIS-C-7021:B-1Connect with a power If=20mATa=Under room temperatureTest time=1,000hrs0/20HighTemperatureHigh HumidityStorageMIL-STD-202:103BJIS-C-7021:B-11Ta=+65℃±5℃RH=90%-95%Test time=240hrs0/20HighTemperatureStorageMIL-STD-883:1008JIS-C-7021:B-10High Ta=+85℃±5℃Test time=1,000hrs0/20LowTemperatureStorageJIS-C-7021:B-12Low Ta=-35℃±5℃Test time=1,000hrs0/20EnvironmentalTest TemperatureCyclingMIL-STD-202:107DMIL-STD-750:1051MIL-STD-883:1010JIS-C-7021:A-4-35℃~+25℃~+85℃~+25℃60min20min60min20minTest Time=5cycle0/20Thermal Shock MIL-STD-202:107DMIL-STD-750:1051MIL-STD-883:1011-35℃±5℃~+85℃±5℃20min20minTest Time=10cycle0/20SolderResistanceMIL-STD-202:201AMIL-STD-750:2031JIS-C-7021:A-1Preheating：140℃-160℃,within2minutes.Operation heating：260℃(Max.),within10seconds.(Max.)0/2014.Soldering:1).Manual Of SolderingThe temperature of the iron tip should not be higher than300℃(572℉)and Soldering within3 seconds per solder-land is to be observed.2).Reflow SolderingPreheating:140℃~160℃±5℃,within2minutes.Operation heating:260℃(Max.)within10seconds.(Max)Gradual Cooling(Avoid quenching).ORH -YG35A3).DIP soldering (Wave Soldering):Preheating :120℃~150℃,within 120~180sec.Operation heating :245℃±5℃within 5sec.260℃(Max)Gradual Cooling (Avoid quenching).15.Handling :Care must be taken not to cause to the epoxy resin portion of ORIENTLEDs while it is exposed to high temperature.Care must be taken not rub the epoxy resin portion of ORIENT LEDs with hard or sharp article such as the sand blast and the metal hook .16.Notes for designing:Care must be taken to provide the current limiting resistor in the circuit so as to drive the ORIENT LEDs within the rated figures.Also,caution should be taken not to overload ORIENT LEDs with instantaneous voltage at the turning ON and OFF of the circuit.When using the pulse drive care must be taken to keep the average current within the rated figures.Also,the circuit should be designed so as be subjected to reverse voltage when turning off the ORIENT LEDs.Temperature TimeOVER 2 MIN.4℃ /SEC. MAX. 4℃ /SEC. MAX.10 SEC. MAX.260℃ MAX.140~160℃TemperatureTime120~180 sec.Preheat 245 ±5℃ within 5 sec.Soldering heat Max. 260 ℃120~150℃ORH-YG35A17.Storage:In order to avoid the absorption of moisture,it is recommended to solder ORIENT LEDs as soon as possible after unpacking the sealed envelope.If the envelope is still packed,to store it in the environment as following:(1)Temperature:5℃-30℃(41℉)Humidity:RH60﹪Max.(2)After this bag is opened,devices that will be applied to infrared reflow,vapor-phase reflow,orequivalent soldering process must be:pleted within24hours.b....Stored at less than30%RH.(3)Devices require baking before mounting,if:(2)a or(2)b is not met.(4)If baking is required,devices must be baked under below conditions:12hours at60℃±3℃.。
SST309中文资料
N-Channel JFET High Frequency Amplifier
CORPORATION
J308 – J310 / SST308 – SST310
FEATURES ABSOLUTE MAXIMUM RATINGS (TA = 25oC unless otherwise specified) Drain-Gate Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -25V Drain-Source Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . -25V Continuous Forward Gate Current . . . . . . . . . . . . . . . . -10mA Storage Temperature Range . . . . . . . . . . . . . -55oC to +150oC Operating Temperature Range . . . . . . . . . . . -55oC to +135oC Lead Temperature (Soldering, 10sec) . . . . . . . . . . . . . +300oC Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 360mW Derate above 25oC . . . . . . . . . . . . . . . . . . . . . . 3.27mW/ oC
NOTE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
er308二极管参数
er308二极管参数好，今天我们来聊聊一个大家可能听过但不太了解的小东西——ER308二极管。
别急，我知道你现在可能一脸茫然，想说：“这玩意儿是什么鬼？”放心，我会慢慢告诉你，带点儿轻松的节奏，你也能理解。
其实，说到这个东西，我脑袋里还真浮现出一个小故事，这个故事和我自己的一次亲身体验有点关系。
你准备好了吗？我们慢慢聊。
那是一个星期天的下午，我和几个朋友在车库里搞DIY项目。
说白了，就是想把一台旧电视改装成一个可以播放视频的复古电视机。
我们这群人虽然喜欢折腾，但其实对一些细节还是挺模糊的。
就拿ER308二极管来说，虽然听起来像是电子技术大牛的专属名词，但其实它就在我们那台电视里发挥着关键作用。
那时候，我们只知道这玩意儿是个保护元件，好像是为了防止电路损坏，反正就是很重要，至于具体作用是什么，我们也没太搞懂。
于是我就开始在网上搜索资料，结果发现，ER308二极管原来是半导体二极管的一种，通常用来作为电源的保护，避免逆向电流的影响。
这种二极管最大的特点就是它的“恢复能力”强，能很快地把电流调节回来，不会让电路因过载或不稳定的电流而损坏。
它的名字其实没什么神秘的，ER就是“有效恢复”（Effective Recovery）的缩写。
当时，我们的目标很明确：搞清楚这二极管的参数，看看它能不能真的保护我们的电路不被烧坏。
于是，我开始盯着一个ER308的技术参数看了好久。
起初，看到上面一堆让人眼花缭乱的数字和单位，我差点直接放弃，想说“算了，反正它能保护电路就行”。
但越看越觉得，这些参数是关键，特别是最大反向电压、正向电流、以及恢复时间这些数值，决定了它在电流过大时是能快速反应，还是慢吞吞地让电路烧掉。
比如，ER308的最大反向电压通常在100V左右，正向电流则能承受到几百毫安，这些都决定了它的耐用性和保护能力。
如果你把它装在一个电路上，万一电流反向，它能迅速“关闭”电路，不让坏电流侵入，让电路免受损害。
说白了，这个小小的二极管，几乎是我们电视重生的关键所在。
SPU0410LR5H-QB, 规格书,Datasheet 资料
"W"
0.612 0.722 (2X) 1 1.224 "AP" 0.610 2 0.562 (2X)
1 "L" 3.330
2.636 2.101 (3X)
2.540
R0.254
0.634 (2X) 0.485
3 1.015 2.031
2.00±0.05 1.75±0.10 12.0±0.3 4.00 8.00±0.10
0.30±0.05 1.30±0.10
A
5.50±0.05 3.40±0.10 4.16±0.10 PIN #1 A
+0.1 1.5 0.0 +0.1 1.5 0.0
COMPONENT ORIENTATION
Note: Dimensions are in milimeters unless otherwise specified.
Revision: C Release Level: ACTIVE Sheet 2 of 11
芯天下--/
SPU0410LR5H-QB
Knowles Acoustics, a division of Knowles Electronics, LLC.
Revision: C Release Level: ACTIVE Sheet 3 of 11
spu0410lr5hqb规格书datasheet资料
SPU0410LR5H-QB
Zero Height "Ultra-Mini" SiSonic Microphone Specification With MaxRF Protection - Halogen Free
1A镍氢电池充电管理IC-CN3085规格书
CONSONANCE
1A 镍氢电池充电管理集成电路
CN3085
概述：
CN3085是一款可以对镍氢电池进行充电管理的芯 片，可以对单节至四节镍氢电池进行充电管理。 该器件内部包括功率晶体管，不需要外部的电流 检测电阻和阻流二极管。CN3085只需要极少的外 围元器件，非常适用于便携式产品。热调制电路 可以在器件的功耗比较大或者环境温度比较高的 时候将芯片温度控制在安全范围内。芯片内部集 成有高精度电压比较器，可以精确设置恒流充电 终止电压。 CN3085充电电流可以通过一个外部电阻设置。当 输入电压掉电时，CN3085自动进入低功耗的睡眠 模式，此时电池的电流消耗小于3微安。其它功能 包括输入电压过低锁存，电池低电压时涓流充电, 自动再充电，恒流充电，维持充电（定时），电 池温度监测以及状态指示等功能。 CN3085采用散热增强型的8管脚小外形封装 (SOP8)。
电池端电压通过 R3 和 R4 构成的电阻分压网络反馈到 FB 管脚， CN3085 根据 FB 管脚的电压决定充电状 态。所以 FB 电压同电池端电压有如下关系：
REV 1.1 7
VBAT＝VFB×(1＋R3／R4)
电池端最高电压
电池端最高电压为在充电过程中电池端可能达到的最高电压，当电池电压达到此电压时，电池电压不再 上升，充电电流逐渐减小，对电池是一种保护机制。电池端最高电压与 FB 最高电压具有对应关系。
REV 1.1 4
电气参数：
(VIN=5V，除非另外注明，TA=－40℃ 到 85℃，典型值在环境温度为25℃时测得) 参数 符号 测试条件 最小 典型 输入电源电压 工作电流 电源电压过低锁存阈 值 电池连接端电流 FB管脚 FB最高电压 FB恒流充电终止电压 FB涓流充电阈值 FB涓流充电阈值迟滞 FB再充电阈值 睡眠模式 睡眠模式阈值 睡眠模式解除阈值 ISET管脚 ISET管脚电压 TEMP管脚 高端阈值 低端阈值 输入电流 管脚 下拉电流 漏电流 ICHRG VCHRG＝0.3V，充电模式 VIN＝0V，VCHRG＝5.5V 10 1 mA uA VHIGH VLOW TEMP管脚电压上升 TEMP管脚电压下降 TEMP到VIN或到地端的电流 77.5 42.5 80 45 82.5 47.5 0.5 %VIN %VIN uA VISET 涓流充电和维持充电状态 恒流充电状态 0.35 1.216 V VSLP VSLPR VIN下降 测量电压差(VIN－VBAT) VIN上升 测量电压差(VIN－VBAT) 10 60 mv mv VMAX VCCT VPRE HPRE VRECH FB管脚电压下降 FB管脚电压上升 FB管脚电压上升 1.203 1.216 1.133 0.843 43 1.053 1.229 V V V mV V VIN IVIN Vuvlo BAT端无负载 VIN上升 RISET＝1.22K，恒流充电模式 IBAT RISET＝1.22K，VFB＝0V VIN=0V，睡眠模式 850 244 1000 288 3.1 200 350 最大 6 500 3.1 1150 332 3 单位 V uA V mA uA