半导体制程PPT

光阻区 (PR)
ADI_CD
ADI_CD
光阻 区 (PR)
ETCH (蚀刻) Module
Process Procedures (制程步骤): (a) Dry Etching (气相蚀刻) 化学反响后成气体去除 (b) WET_PR_stripping (光阻去除, 硫酸槽) (c) CD measurement (蚀刻后量測) 简称AEI_CD (d) After Etch Inspection (蚀刻后检查) 简称 AEI
半导体 Semiconductor
分别式电路 Discrete Circuit
ITANIUM MICROPROCESSOR ( 1.72 Billion Transistors 90nm 595 mm2)
To make wafers, polycrystalline silicon is melted. The melted silicon is used to grow silicon crystals (or ingots) that are sliced into wafers. 首先溶化多晶硅，生成晶柱，然后切割成晶圆。
Building an IC Chip
Tape-out (used to be a lot of information—put on tape) Like a blueprint for wafer production
Hierarchy of IC Chip
Multilevel Metallization
芯片分类
DRAM 动态随机存储器
MPUs 微处理器
Computer 电脑
ASIC 特定用途集成电路
DSPs 数字信号处理器
Consumer 消费
Flash 闪存存储器
EEPROMs 电可擦除只读存储器
Communi- cation 通讯
Electronic Package
First level package (Single-chip module)
连接线
晶圆芯片制作概述 Wafer Manufacturing Overview
晶柱 Silicon Ingot
芯片 Wafer
光罩制作/光刻
离子植入
切割、封装
电镀
(Die,晶粒)
(Chip,晶芯)
蚀刻
Mask Making/ Photolithography
Ion Implantation
Assembly&Testing
1958.9.12 J. Kilby 研制成功第一个半导体集成电路 ---“Solid Circuit”
J. Kilby的制造－“固体电路”
Kilby和他1958,7,24的设计
Migration of Electronics Manufacturing
From inception, electronic manufacturing has migrated geographically from the West to the East: from the US and Europe, over to Japan, through the Taiwan area, Korea, arriving in the East: China and India. The shift in wafer production typically lags behind the rest of the supply chain, but China and India are now at the forefront of IC production!
2
3
1
2
3
2023 WW IC Market
China
6% WW Market
Others $57.80
Japan $37.80
$57.90
$9.80
21% WW Market
2023 WW IC Market
$40.80
Others $82.10
$36.50
Japan $33.00
Semiconductor Glossary 半导体术语表
Die 晶粒
Assembled semiconductor electronic component. 切割封装好的半导体电子元件。
Chip 晶片、芯片
A small, thin, circular slice of a semiconductor material, such as Silicon, on which repeated integrated circuits can be formed. 半导体物质(如纯硅)小薄圆片，在上面可以形成一个个完整电路
China Becomes World’s Largest IC Market
A Leading Foundry In The World
SMIC Beijing
SMIC Shanghai
SMIC Tianjin
Tianjin
Beijing
Shanghai
Wuhan
Chengdu
Shenzhen
SMIC Assembly & Testing (Chengdu)
Clock frequency of more than 3GHz.
Cutoff frequency of 350 GHz for SiGe bipolar.
Mass production ≧90nm Advanced manufacturing ~65nm Manufacturing development ~45nm Process and device R&D ≦32nm.
M1
Contact
Via 1
M2
Via 2
M3
Via 3
M4
IMD3
ILD
IMD1
IMD2
Backend process
Frontend
Active Area
Diffusion Barrier/ Adhesion Promoter
Plug
电晶体 (晶体管) MOSFET: Metal-Oxide-Semiconductor Field-Effect Transistor
SMIC Beijing
Wuhan Xinxin
*
Chengdu Cension
*
供给微米的制程技术
IC Industry Business Unit
一条龙的集成代工效劳 Dedicated Full Service Provider
Design Services
Mask Making
Wafer 晶圆
Silicon Technology 矽(硅)技术
6 吋 (15.24cm)
8 吋 (20.32cm)
12 吋 (30.48cm)
1.78 倍
2.25 倍
(A) Production Capability (生产力量)
(B) Design Capability (设计力量)
元件縮小
First level package (Multi-chip module)
Second level package (PCB or card)
Third level package (Mother board)
Outline
Introduction Integrated Circuit and Its Application How is IC made?
Smallest transistor realized---5nmMOSFET
Outline
Introduction Integrated Circuit and Its Application How is IC made?
导体 半导体 绝缘体 半导体材料特性: 经掺杂后，可藉由电场(电压)、光、温度、压力、磁场等转变或掌握其导电特性。 最广为应用的集成电路芯片材料： 硅 (Silicon, Si)。 纯硅导电特性差， 可藉掺杂(Doping, 将杂质参加硅片中) 转变或掌握其导电特性。 如何掺杂及掌握杂质在硅片中分 布是半导体重要制程技术之一 。
Raw Material for Wafers
A slice of semiconductor material, processed to have specified electrical characteristics, especially before it is developed into an electronic component or integrated circuit. 晶圆上的小颗粒，经过处理后具有特殊电性用途。
PR: Photo Resist (光 阻) (化学物品) CD: Critical Dimension (重要尺寸)
Mask (光罩)
特殊光线
曝光区
光 阻
光 阻
光 阻
(1) 大小或宽度是否OK ? (ADI_CD) (2) 光阻是否曝开 ? (ADI)
PHOTO (黄光) Module
0.18 um (微米)
0.13 um (微米)
1 um (微米) = 百万分之一米〔m) = 头发万
芯片分类及应用 Types of ICs & Applications
应用领域
Applications
应用领域
应用领域
Some types of ICs
Wafer Manufacturing
Wafer Probing
Assembly & Final Test
Wafer Bumping
SOP
PLCC
TSOP
QFP
BGA
µBGA
Flip Chip
CSP
2023-IC 技术现状
Integration of 108 – 1010 transistors in a chip.
China
2023 WW IC Market
26% WW Market
Others $87.44
$46.56
$62.35
Japan $57.05
China
US$billion
Source: IC insights January 2023
In 2023, China’s IC consumption reached USD$40.8 billion, overtaking the top spot as the world’s largest regional IC market for the first time. By 2023, China’s IC market is estimated to reach USD$124 billion in terms of overall consumption.
Electroplating
Etching
沉积
Deposition
PHOTO (黃光) Module
Process Procedures (制程步骤): (a) PR_coating (上光 阻) 光阻见白光即反响 用黄光 (b) Photo_mask & exposure (上光罩及曝光) (c) CD measurement (曝光后量测) 简称 ADI_CD (d) After Develop Inspection (曝光后检查 ) 简称 ADI
光 阻
光 阻
Etching gas (蚀刻气体)
光阻去除 (WET)
大小或宽度是否OK ??? (AEI_CD)
光阻同时会被吃掉一些
Thin-Film (薄膜) Module
Process Procedures (制程步骤): (a) Thin film deposition (薄膜沉积, 单片) (b) Thickness measurement (沉积厚度量測) (c) Film types (薄膜种类): (i) 非导体: oxide (氧化物), nitride (氮化硅) (ii) 导体: metal (金属: W, Ti, TiN, Al)
Outline
Introduction Integrated Circuit and Its Application How is IC made?
一种相移振荡器 〔1.3 MHz) Ge 衬底，晶体管及电阻、电容全部由Ge制成 (面积约2) 集中工艺形成晶体管 黑蜡掩蔽腐蚀形成Tr台面构造 用细导线互连 证明半导体材料不仅可用于制造分 立器件，而且可以制造整个电子电 路