可靠性介绍Reliability Introduction

FSSZ Reliability Monitoring Program
HTRB HTGB HTSL Q"ty 77*3
Read Point @168 hrs
TMCL
HAST THBT PRCL
Room TMCL Aging
E/T
ACLV
Ambient
Read Point Read Point Read Point Read Point Read Point Read Point Read Point Read Point @500hrs @100 cycs
@48hrs @ 168hrs
@ 1k cycs
@1K hours
@500 cycs @ 1K hours
E/T
E/T
E/T
E/T
E/T
SEM
SEM
SEM
Read Point Read Point Read Point Read Point Read Point Read Point Read Point Read Point @1000hrs
@ 500 cycs
@ 96 cycs
@ 500 hrs
@ 5k cycs
@4K hours
@1.5K cycs
@ 4K hours
E/T
E/T
E/T
E/T
E/T
SEM
SEM
SEM
Read Point Read Point @1000 hrs
@10K/8572
cycs E/T
E/T
Samples Pulling
Preconditioning
Q'ty: 77*5
Whisker Q'ty: 18*3
V/I
V/I
SMD
FSSZ Reliability Lab Capabilities -1
Autoclave (ACLV)高温高湿高压蒸煮试验
Test Description (JESD22-A102)
*No bias is applied to the devices during this test. *121 ℃, 100%RH,15PSIG (JESD22-A102)
Purpose
*Evaluate the moisture resistance integrity of no hermetic packaged solid state devices using moisture condensing or moisture saturated steam environments.
*Identify failure mechanisms internal to the package and is destructive.
Effects
*Corroded device terminals/leads or the formation of conducting matter between the terminals.
Temperature Cycle (TMCL)高低温循环试验
Test Description (JESD22-A104)
*No bias is applied to the devices during this test. *-65℃~ 150℃-55℃~ 150℃or -40℃~ 125℃
Purpose
*Evaluate the thermo-mechanical properties of the complex IC package.
*Detecting stress relief failures from the mismatch in thermal coefficients of expansion for the die/package structure.Effects
*Plastic deformation, crack propagation, cracked passivation, thin film crack
*Interlayer dielectric voids or cracks, displaced metallization,stress-induced metallization voids, broken or sheared bond wires and bonds, bond pad cratering, die attach separation or failure,
Air to Air
Liquid to Liquid
FSSZ Reliability Lab Capabilities-2
High Temperature Reverse Bias
Test (HTRB)高温反偏压试验
Test Description (JESD22-A108)
*Use test boards
*HTRB test is configured to reverse bias major power handling
junctions of the device samples.
*150℃175 ℃or 125 ℃Multi-biased and intelligent leakage
monitoring
Purpose
*Devices are characteristically operated in a static operating
mode at or near, 80% of maximum-rated breakdown voltage
and/or current levels to determine the effects of bias conditions
and temperature on solid state devices over time.
Effects
*Silicon Defects, oxide defects, manufacturing defects, dielectric
Breakdown.
*Ionic contamination, mobile charges, including surface inversion.
electro migration (under high current density conditions)
High Temperature Gate Bias (HTGB)
高温栅极偏压试验(JESD22-A108)
Test Description
*HTGB test biases gate or other oxides of the devices samples.
*150℃or 175 ℃, Biased and intelligent leakage monitoring
Purpose
*Device are normally operated in a static mode at, or near, 100%
of maximum-rated oxide breakdown voltage levels. The particular
bias conditions should be determined to bias the maximum
number of gate in the device.
Effects
*Silicon Defects, oxide defects, manufacturing defects, dielectric
Breakdown.
*Ionic contamination, mobile charges, including surface inversion.
electro migration (under high current density conditions)
FSSZ Reliability Lab Capabilities-3
Temperature Humidity Bias (THBT)
恒温恒湿偏压试验
Test Description (JESD22-A101)
*Use Test boards
*85℃/85%RH,Biased
Purpose
*Evaluate the integrity of plastic packages to moisture ingress to
the die surface.Under conditions of high humidity and
temperature, moisture can permeate the molding compound or
travel up leads.
Effects
*Corrosion sites at or near bond pads, exposed metal at defects
in passivation, Anodic-halides, Cathodic-phosphorus levels in
glass, open metallization
*Shorting across metallic conductors through insulators and
Gold, copper, silver dendrites.
*Mobile charges and top surface charge.
High Temperature Storage Life test
(HTSL)高温储存试验
Test Description (JESD22-A103)
*150℃or 175 ℃
Purpose
*Detect instability mechanisms associated with shelf life
(storage).
*Determining the effects of storing devices at elevated
temperatures without electrical applied.
Effects
*Intermetallic growth at bonds of dissimilar metals -Gold wire
bonded devices.
*Chemical reactions -Molding compound or die attach impurities
released. Charge Loss in programmable products due to defects
in oxides
FSSZ Reliability Lab Capabilities-4 Preconditioning
预处理试验
Tester Description(JESD22-A113)
*Acoustic Microscopy Inspections -> C-SCAN->T/C(5Cycles) ->
Bake(24hrs 125C) -> Soak -> IR Reflow (3cycles) ->flux
application and Acoustic Microscopy Inspections->C-SCAN
Soak time in hours
Level TEMP.(℃)RH(%)Time(hrs)Packing Condition
I8585168Non Dry Packing
II8565168Dry Packing
II-a6060120Dry Packing
III3060192Dry Packing Purpose
*Simulate stresses encountered by surface mounted packages
from the time products are shipped to customers through the
assembly process onto PC boards.
Effects
*Popcorn, external / Internal package cracking, die surface
delamination, die paddle or die attach delamination, electrical
failure due to ball bond lifts or bond wire shear, cracked Die.
FSSZ Reliability Lab Capabilities-5 Power cycle (PRCL)
功率循环试验
Test Description (MIL STD 750-1037)
*Use Test boards
Purpose
* The power cycle test is performed to determine the effects
on solid state devices of thousands of power-on/power-off
operations such as would be encountered in an automobile or
a TV set.
Effects
*The repetitive heating/cooling effect caused by multiple
on/off cycles can lead to fatigue cracks and other degrading
thermal and/or electrical changes in the die attachment
system of those devices which generate significant internal
thermal heating under maximum load conditions
High Accelerate Stress Test
(HAST)高速老化应力试验
Test Description (JESD22-A110)
*Ta=130c,RH=85%,19.5psig Vr=80% of rated BV
Purpose
* It employs severe conditions of pressure, humidity and
temperature not typical of actual operating environments
that accelerate the penetration of moisture through the
external protective material (encapsulant or seal) or along
the interface between the external protective material and
the metallic conductors passing through it.
Effects
* When moisture reaches the surface of the die, reactive
agents cause leakage paths on the surface of the die and
corrode the die metallization, affecting DC parameters and
eventually catastrophic failure. Other die-related failure
mechanisms are activated by this method including mobile
ionic contamination and various temperature and moisture
related phenomena.
FSSZ Reliability Lab Capabilities-6 Wet High Temperature Storage
(WHTS)恒温恒湿储存试验
Test Description (JESD22-A101)
*85℃and 85%RH
Purpose
*It is performed for the purpose of evaluating the reliability
of non-hermetic packaged solid-state devices in humid
environments.
Effects
*The test employs conditions of temperature and humidity
which accelerate the penetration of moisture through the
external protective material (encapsulant or seal) or along the
interface between the external protective material and the
metallic conductors which pass through it.
Operation Life (OPL)
使用寿命试验
Test Description (JESD22-A108)
*Use board and test condition as per customer
requirements
Purpose
* This test is used to determine the effects of bias
conditions and temperature on solid state devices over
time. It simulates the devices’operating condition in an
accelerated way.
Effects
*Silicon Defects, oxide defects, manufacturing defects,
dielectric Breakdown.
*Ionic contamination, mobile charges, including surface
inversion. electro migration (under high current density
conditions)
FSSZ Reliability Lab Capabilities -7
Solderability Testing (SOLD)可焊性测试
Test Description (JESD22-B102)
*Steam Aging(93 ℃) -> Bake(175 ℃) ->Flux Dipping -> Solder Dipping -> After cooling clean sample -> Inspection Purpose
*The purpose of this test is to provide a means of determining the solderability of device package terminations that are intended to be joined to another surface using lead (Pb) containing or Pb-free solder for the attachment.
5 ±0.5
5 ±0.5
Sec Dipping time
---Sn/Ag/Cu : 245
215 ±5Sn/Pb : 2150C
Temperature ---95.5/3.9 /0.6Sn/Ag/Cu
63/37 or 60/40
63/37 or 60/40Sn/Pb Solder composition Sn/Pb product Pure Tin product
Solder Dipping Condition
Adobe Acrobat Document
FSSZ Reliability Service and Job Flow
START PARTS PULLED ASSIGN TESTS SERIALIZE PARTS
PRE-STRESS ELECTRICAL TEST
RELIABILITY TEST
POST-STRESS ELECTRICAL TEST
VALID FAILURE/S?
ENTER RESULT TO DATABASE REPORT RESULT
DATABASE FLOW
VERIFY FAILURE/S
WITHIN ACTION LIMIT?
YES
NO
FAILURE REPEATED FOR LAST 2 PULL
SAMPLES?
RESAMPLE AFFECTED LOT
INITIATE ALERT TO AFFECTED PARTY
FAILED STILL?
PROBLEM FIX?
AFFECTED PARTY TO EXECUTE C/A THROUGH 8D
AFFECTED PARTY TO INSTITUTE
PARTS DISPOSITION
(1) LIMIT FAILURE YES
(2) LIMIT FAILURES (3) OR GREATER LIMIT FAILURES
YES
NO
NO
RETURN TO NORMAL FLOW
END
SUBMIT VERIFIED FAILURES TO F/A
FAILURE ANALYSIS FLOW F/A REPORTS RESULT TO REL AUDIT ADMINISTRATOR
Report
F/A FLOW END
LAST Timepoint?
YES
NO
NO
8D REQUIRED
YES。