SOCAY贴片压敏电阻SC0805ML系列产品型号
Socay PPT (公司介绍)
硕凯集团
Socay Group Profile
c 目录 ontent
01
关于硕凯
About Socay
02 产品系列
Products Series
03 认证与资质
Certification & Awards
04
生产与市场
Produce & Markets
05 企业文化
Corproate Cultrue
PART 01
关于硕凯 About SOCAY
集团包含与硕凯关联的制造工厂、销售公司、设计公司、办事处等。
组织构架
Organization Chart
HK
Taiwan Shen zhen UNION Guoneng
Shanghaii Hangzhou KunShan Beijing Lab Center Wuhan Chengdu
集团历史
Devole of Socay Group
2008
河北GDT厂 Hebei FTY
2009
2011
2013
昆山硕凯
深圳实验室
上海硕凯
Kunshan SC SZ EMC Lab SH Socay
2016
北京实验室 Beijing Lab
集团历史
History of Socay Group
2016
场A栋1906
实验室地址 EMC Lab Address
深圳：中国.深圳市龙华区民清路和 恒兴科技园4楼401室
北京：中国.北京经开发区宏达中路 16号宏达三鼎一楼115室
杭州：中国.浙江省杭州市拱墅区莫 干山路1418号-60新业大厦东-202
PART 02
SOCAY静电二极管SO-08封装SLVU2.8-4产品详情
SOCAY静电二极管SO-08封裝SLVU2.8-4产品详情
硕凯电子（Sylvia）
一、ESD产品说明
ESD是代表英文Electrostatic Discharge即“靜電放電”的意思。
ESD是本世紀中期以來形成的以研究靜電的產生與衰減、靜電放電模型、靜電放電效應如電流熱（火花）效應（如靜電引起的著火與爆炸）和電磁效應（如電磁幹擾）等的學科。
近年來隨著科學技術的飛速發展、微電子技術的廣泛應用及電磁環境越來越複雜，對靜電放電的電磁場效應如電磁幹擾（EMI）及電磁兼容性（EMC）問題越來越重視。
我司ESD保護器件主要是由TVS ARRAY組成，經不同封裝而成的器件。
其優點是體積小，結電容低，反應速度快等。
二、产品图
三、产品电路图
四、产品参数
五、产品特性
1、依据(tp=8/20μs)线路，峰值脉冲功率为400W
2、保护两对线（四线）
3、低电容
4、符合RoHS
5、IEC61000-4-2(ESD)±15kV(空气),±8kV(接触)
6、IEC61000-4-4(EFT)40A(5/50ηs)
7、IEC61000-4-5(Lightning)24A(8/20μs)。
贴片压敏电阻0805封装参数型号规格书大全
UN Semiconductor Co., Ltd.
Revision December 18, 2013
3/5
@ UN Semiconductor Co., Ltd. 2013
MULTILAYER CHIP VARISTORS
UN0805-XXXH Series
Packaging Specification
hours, the change of varistor voltage shall be within 10%.
Damp Heat Load/ Humidity Load
The specimen should be subjected to 40℃,90 to 95%RH environment, and the maximum allowable voltage applied for 1000 hours, then stored at room temperature and humidity for one or two hours. The change of varistor voltage shall be within 10%.
machine. And a normal paper tape shall be connected in the head of taping for the operator handle.
type
0402 0603 0805 1206 1210 1812 2220 3220
A0 ±0.10
1.08
B0
K0
±0.10 ±0.10
1.88 1.04
T ±0.05 0.22
T2
D0
±0.05 +0.10
航洋压敏电阻(型号很全)
53
6.0
5.0
1000
14K330 33
30-36
20
26
65
7.5
6.0
1000
14K390 39
35-43
25
31
77
8.6
7.0
1000
高
14K470 47
42-52
30
38
93
10.
8.5
1000
能
14K560 56
50-62
35
45
110
11.
10
1000
I
14K680 68
61-75
40
100
200
20
14.5
3500
高
10K151 150 135-165 95 125
250
25
18
3500
能
II
10K181 180 162-198 115 150
300
31
21
3500
10K201 200 185-225 130 170
340
35
25
3500
型
10K221 220 198-242 140 180
航洋电子 压敏电阻器
普
通 浙江黄岩航洋电子有限公司
型 Zhejiang Huangyan Hangyang Electronics Co.,Ltd.
高 MYG 型氧化锌压敏电阻器
能 I 型
功能
相关标准
高
●过电压保护、防雷、抑制浪涌电流、高压灭 ●IEC61051
能
弧、消噪等
II
●UL1449 ●VDE CECC42000
socay硕凯瞬态电压抑制二极管smdj50a型号
SOCAY硕凯瞬态电压抑制二极管SMDJ5.0A型号硕凯电子（Sylvia）一、产品图二、最大额定值Notes:1.Non-repetitive current pulse,per Fig.3and derated above TA=25°C per Fig.2.2.Mounted on5.0mm x5.0mm(0.03mm thick)Copper Pads to each terminal.3.8.3ms single half sine-wave,or equivalent square wave,Duty cycle=4pulses per minutes maximum.4.VF<3.5V for VBR<200V and VF<6.5V for VBR>201V.三、功能原理图四、UL证书编号五、应用英文TVS devices are ideal for the protection of I/O interfaces,VCC bus and other vulnerable circuits used in Telecom,Computer,Industrial and Consumer electronic applications.六、产品特性1、为表面安装应用优化电路板空间2、低泄漏3、单向单元4、玻璃钝化结5、低电感6、优良的钳位能力7、3000W的峰值功率能力在10×1000μ波形重复率（占空比）：0.01%8、快速响应时间：从0伏特到最小击穿电压通常小于1.0ps9、典型的，在电压高于12V时，反向漏电流小于5μA10、高温焊接：终端260°C/40秒11、典型的最大温度系数△Vbr=0.1%x Vbr@25°C x△T12、塑料包装有保险商实验室可燃性94V-013、无铅镀雾锡14、无卤化，符合RoHS15、典型失效模式是在指定的电压或电流下出现16、晶须测试是基于JEDEC JESD201A每个表4a及4c进行的17、IEC-61000-4-2ESD15kV(空气)，8kV(接触)18、数据线的ESD保护符合IEC61000-4-2(IEC801-2)19、数据线的EFT保护符合IEC61000-4-4(IEC801-4)七、曲线特性图八、应用中文TVS器件非常适合保护I/O接口，Vcc总线和其他应用于电信、计算机、工业和消费电子应用的易损电路。
SOCAY硕凯SC1210ML系列片式压敏电阻型号
SOCAY硕凯SC1210ML系列片式压敏电阻型号预览说明:预览图片所展示的格式为文档的源格式展示,下载源文件没有水印,内容可编辑和复制SOCAY硕凯SC1210ML係列片式压敏电阻型号硕凯电子（Sylvia）一、产品图二、产品特性英文版+中文版◆Rectangle,sizes serialization for hybrid integrated circuit or printed circuitsurface mount components◆There are many side electrode lead-out material,particularly suitable forsurface mount technology for solderability and resistance to soldering heat of the stringent requirements◆Fast response(<1ns)◆L ow leakage current,low clamping voltage◆Suitable for reflow,wave soldering and hot air hand soldering1、矩形大小的係列化適合於混合集成電路或印製電路板表麵貼裝組件2、有許多側電極管線材料，特別適合嚴格要求的可焊性和抗焊錫熱表麵貼裝技術3、快速反應（＜1ns）4、低漏電流，低鉗位電壓5、適合流回，波焊錫和熱空氣的手焊錫三、产品型号SC1210ML180K，SC1210ML240K，SC1210ML270K，SC1210ML330K，SC1210ML390K，SC1210ML470K，SC1210ML560K，SC1210ML680K，SC1210ML101K。
四、产品应用1、應用於主板，筆記本電腦，手機，掌上電腦，手持設備，DSC，DV，掃描儀以及機頂盒等。
0805贴片抗脉冲电阻_防浪涌电阻常用型号查询表
深圳市捷比信科技有限公司 > 资讯中心 > 综合资讯 > 正文 深圳市捷比信将VIKING抗脉冲/防浪涌电阻常用型号整理如下：PWR05FTFW0010PWR05FTFW0020PWR05FTFW0030PWR05FTFW5R10PWR05FTFW6R20PWR05FTFW7R50PWR05FTFW8R20PWR05FTFW0100PWR05FTFW0120PWR05FTFW0150PWR05FTFW0180PWR05FTFW0200PWR05FTFW0220PWR05FTFW0240PWR05FTFW0270PWR05FTFW0300PWR05FTFW0330PWR05FTFW0390PWR05FTFW49R9PWR05FTFW0510PWR05FTFW0750PWR05FTFW0560PWR05FTFW1000PWR05FTFW1100PWR05FTFW1200PWR05FTFW1500PWR05FTFW1300PWR05FTFW2000PWR05FTFW2400PWR05FTFW2700PWR05FTFW3000PWR05ETEW5100PWR05ETEW5600PWR05ETEW6200PWR05ETEW7500PWR05ETEW8200PWR05ETEW1001PWR05ETEW1201PWR05ETEW1501PWR05ETEW2001PWR05ETEW2201PWR05ETEW3001PWR05ETEW5101PWR05ETEW5601PWR05ETEW1002PWR05ETEW2002PWR05ETEW1502PWR05ETEW2202PWR05ETEW2402PWR05ETEW2802PWR05ETEW3002PWR05ETEW4992热门全系列精密电阻 功率电慢速熔断保险丝与快速0603 1%精密电阻丝印与高稳定高精度 精密贴片贴片精密采样电阻选用精密电阻标准阻值及精精密低温漂电阻选型方2W贴片电阻 大功率贴片台湾VIKING高频贴片电台湾升华钨钢探针及TO最新0805贴片抗脉冲电阻/防AEC-Q200汽车级电阻测金属膜柱状贴片电阻产防硫化电阻/抗硫化电阻光颉LRC05系列0805贴片车用防硫化电阻在新能大毅汽车级防硫化电阻防硫化电阻产品特性ALPS SDDHA10100开关符大毅贴片保险丝CPS系列0805贴片抗脉冲电阻/防浪涌电阻常用型号查询表精密电阻 合金电阻 毫欧电阻搜索搜索走进捷比信台湾大毅台湾光颉泰艺晶振产品中心公司资讯技术资料投资者关系战略合作TA-i产品合作Viking 产品合作泰艺产品合作品牌合作(招募)PWR05ETEW5102PWR05ETEW5602PWR05ETEW1003PWR05ETEW2003PWR05ETEW1503PWR05ETEW1203PWR05ETEW2403PWR05ETEW3003PWR05ETEW3603PWR05ETEW5103PWR05ETEW5603PWR05ETEW1004PWR05ETEW2004PWR05ETEW3004PWR05ETEW3604PWR05ETEW4994PWR05ETEW5104PWR05ETEW5604PWR05ETEW1005PWR05ETEW2005抗脉冲电阻，防浪涌电阻查货，索样请来电洽询深圳市捷比信实业有限公司。
SFI0805ML330C-LF
Customer InformationCustomer :Part Name : Part No. : Model No. :COMPANY PURCHASE R&DAPPROVAL SHEETVendor InformationName: SFI ELECTRONICS TECHNOLOGY INC. Part Name Chip TVSPart No. SFI0805ML330C-LFLot No.SFI ELECTRONICS TECHNOLOGY INC.ADDRESS ：No.6, Lane 340, Shan-Ying Road , Guishan,Tao Yuan Taiwan TEL: 886-3-3506998 FAX: 886-3-3507689 E-mail: sfi@ Quality ControlDocument ControlBusiness IssueREV ：HPrepared CheckISO 9001:2000 ISO 14001:2004PART NO. SFI0805ML330C-LF1.1 Technology Data Symbol Value UnitVMaximum allowable continuous AC voltage at 50-60 Hz V RMS 20Maximum allowable continuous DC voltage V DC26 VVaristor voltage measured Vv 33(29.7~36.3) VMaximum clamping voltage V CLAMP< 54 VMaximum Peak Current I Peak 100A1.2 Reference DataMaximum Energy Absorption＊4 E > 0.3 JTypical capacitance value measured at 1K Hz C 220 pFResponse time T rise< 1 nsLeakage current at Vv × 80% I v v< 50 uALeakage current at Vv ×80% (After reality Test) I v v A< 200 uAOperation ambient temperature -50～ +85 ℃Storage temperature -50～+125 ℃1.3 Other DataBodyZnO End termination Ag/Ni/SnReel PackagingComplies with Standard IEC61000-4-5Complies with RoHs Standard YesLead Content ＜1000 ppmMarkingNone Notes：＊ 1 The varistor voltage was measured at 1 mA current.＊ 2 The Clamping voltage was measured at 8*20 us standard current.＊ 3 The Leakage current was measured working voltage.＊ 4 The Energy only for customer reference.＊ 5 The components shall be employed within 1 year, in the nitrogen condition.3. Surge Wave Form IEC61000-4-5 Standards SEVERITY LEVELT1 T21 8 µs 20 µs210 µs 1000 µs 4. Environment Reliability Test Characteristic Test method and description High TemperatureStorage The specimen shall be subjected to 125 ± 2℃ for 1000 ± 12 hours in a thermostaticbath without load and then stored at room temperature and normal humidity for 1 to2 hours. The change of varistor voltage shall be within 10 ﹪. Step Temperature Period1 -40±3℃ 30Min±32 Room Temperature 1 hour3 125±3℃ 30Min±3 Temperature Cycle The temperature cycle of specified temperature shall be repeated five timesand then stored at room temperature andnormal humidity for one or two hours. Thechange of varistor voltage shall be within 10﹪and mechanical damage shall beexamined.4 Room Temperature 1 hour High TemperatureLoadAfter being continuously applied the maximum allowable voltage at 85 ± 2℃ for 1000± 2 hours, the specimen shall be stored at room temperature and normalhumidity for one or two hours, the change of varistor voltage shall be within 10﹪.Damp Heat Load/ Humidity Load The specimen should be subjected to 40 ± 2℃, 90 to 95 ﹪RH environment, and the maximum allowable voltage applied for 1000 hours, then stored at room temperatureand normal humidity for one or two hours. The change of varistor voltage shall be within 10﹪Low TemperatureStorageThe specimen should be subjected to -40 ± 2℃, without load for 500 hours and then stored at room temperature for one or two hours. The change of varistor voltage shall be within 10 ﹪8/20μs waveform current （A ） 2.S ize 3.Surge Wave FormModel 0402(1005) 0603(1608) 0805(2012) 1206(3216) 1210(3225) 1812(4532) 2220(5750) Length(L) 1.00 ±0.10 1.60±0.15 2.00±0.20 3.20±0.20 3.20±0.20 4.50±0.20 5.70±0.20Width(W) 0.50 ±0.10 0.80±0.10 1.25±0.15 1.60±0.15 2.50±0.20 3.20±0.20 5.00±0.20Thickness(T) 0.60 max 0.90 max 1.20 max1.50 max 1.50 max2.00 max 2.50 max Termination(a) 0.25±0.1 0.3±0.1 0.4±0.2 0.5±0.2 0.5±0.2 0.5+0.3/-0.1 0.5+0.3/-0.1☆ IR reflow Pb Free Process suggestion profile(1) The solder recommend is Sn96.5/Ag 3.5 of 120 to 150μm(2) Ramp-up rate (217℃ to Peak) + 3℃/second max (3) Temp. maintain at 175 +/-25℃ 180 seconds max (4) Temp. maintain above 217 ℃ 60-150 seconds 5. Soldering Recommendations 5.1 Recommended solder pad layout（Unit ：mm ）ABCD0402 0.4~0.6 1.4~1.8 0.5~0.6 0.6~1.20603 0.9~1.2 2.7~3.2 0.7~1.0 0.9~1.20805 1.0~1.5 2.6~3.2 1.2~1.5 1.1~1.81206 1.8~2.5 4.2~5.2 1.2~1.8 1.2~1.81210 1.8~2.5 4.2~5.2 2.2~3.0 1.3~2.01812 2.5~3.3 5.5~6.7 2.8~3.6 1.3~2.22220 3.8~4.6 6.6~7.8 4.8~5.5 1.3~2.25.2 The SIR test of the solder paste shall be done （Based on JIS-Z-3284） 5.3 Steel plate and foot distance printing Foot distance printing (mm)Steel Plate thickness (mm)> 0.65mm0.18mm0.65mm~0.5mm 0.15mm 0.50mm~0.40mm 0.12mm >=0.40 mm0.10mm5.4The IR reflow and temperature of Soldering for Pb FreeSFI Electronics TechnologySMD Transient Voltage Suppressors(5) Peak temperature range 245℃ +20℃/ -10 ℃ time within 5 ℃ of actually peak temperature (tp) 10~20 seconds(6) Ramp down rate +6 ℃/second max.5.5 Resistance to soldering heat-High Temperature Resistance:260℃,10sec-3times.5.6 Hand SolderingIn hand soldering of the Varistors. Large temperature gradient between preheated the Varistors and the tip of soldering iron may cause electrical failures and mechanical damages such ascrackings or breakings of the devices. The soldering shall be carefully controlled and carried out so that the temperature gradient is kept minimum with following recommended conditions for hand soldering.5.6.1 Recommended Soldering Condition 1（1） Solder ：0.12~0.18mm Thread solder (Sn96.5:Ag3.5) with soldering flux in the core. Rosin-based and non-activated flux is recommended. （2） PreheatingThe Varistors shall be preheated so that Temperature Gradient between the devices and the tip of soldering iron is 150℃ or below. （3）Soldering IronRated Power of 20w max with 3mm soldering tip in diameter.Temperature of soldering iron tip 380℃max,3-5sec ( The required amount of solder shall be melted in advance on the soldering tip.) （4）CoolingAfter soldering. The Varistors shall be cooled gradually at room ambient temperature.5.6.2 Recommended Soldering Condition 2（Without preheating ）（1）Solder iron tip shall not directly touch to ceramic dielectrics.（2）Solder iron tip shall be fully preheated before soldering while soldering iron tip to the external electrode of Varistors.5.7 Post Soldering Cleaning5.7.1 Residues of corrosive soldering fluxes on the PC board after cleaning may greatly haveinfluences on the electrical characteristic and the reliability (such as humidity resistance)of the Varistors which have been mounted on the board. It shall be confirmed that the characteristic and the reliability of the devices are not affected by the applied cleaning conditions.5.7.2. When an ultrasonic cleaning is applied to the mounted Varistors on PC Boards. Followingconditions are recommended for preventing failures or damages of the devices due to the large vibration energy and the resonance caused by the ultrasonic waves. （1）Frequency 29MHz max（2）Radiated Power 20w/lithr max （3）Period 5minuets max※Perform adequate test in advance as the reflow temperature profile will vary according to the conditions of the manufacturing process, and the specification of the reflow furnace.6. Packaging Specification6.1 Carrier tape and transparent cover tape should be heat-sealed to carry the products, and the reel should beA0P1D1B0P0P2EWFDirection of unreeling7.Reel DimensionW1WD E W W113.0±0.2 21.0±0.2 2.0±0.5 9.0±0.50 1.5±0.1513.0±0.2 21.0±0.2 2.0±0.5 9.0±0.50 1.5±0.1513.0±0.2 21.0±0.2 2.0±0.5 9.0±0.50 1.5±0.1513.0±0.2 21.0±0.2 2.0±0.5 9.0±0.50 1.5±0.1513.0±0.2 21.0±0.2 2.0±0.5 9.0±0.50 1.5±0.15。
0805高阻值贴片电阻
0805高阻值贴片电阻
其尺寸为2.0mm某1.25mm某0.50mm，又称为0805型贴片电阻。
在
市场上，它常见的规格有1KΩ、10KΩ、100KΩ等不同电阻值。
在实际应
用中，它通常与其他电子元件一起使用，如电容、电感、晶体管、二极管、集成电路等。
常见应用场景是在电源电路、放大电路、测试仪器、自动控制等领域。
在这些场景中，0805高阻值贴片电阻常用于限流、限压、分压等功能。
同时，它还具有干扰抑制、滤波、降噪等作用。
它在电子工程领域中，扮
演着不可或缺的角色。
在实际应用中，0805高阻值贴片电阻的电阻值的变化范围很小，这
是由其质量和制造工艺所决定的。
同时，它的功率耐受能力较强，工作稳
定可靠。
在工艺生产上，其制造技术和标准化管理也得到了广泛的应用。
这使得0805高阻值贴片电阻无论是在性能还是在品质上都有着稳定的表现。
在电子行业的迅猛发展背景下，0805高阻值贴片电阻得到了广泛的
推广和应用。
在工业生产领域中，它的应用范围从消费电子、汽车、医疗、航空航天、通信网络、铁路交通等领域延伸到更多的产业领域，越来越成
为重要的一个组件。
它的发展和应用，对于推动电子行业发展和提高产品
质量，具有重要的意义。
总之，0805高阻值贴片电阻是一种重要的电子元器件。
它在现代电
子设备、通讯、控制、感应、检测等领域中，起到了重要的作用。
随着电
子科技的不断发展，未来0805高阻值贴片电阻的应用范围将会越来越广泛。
硕凯电子SOCAY瞬态二极管SMAJ400CA型号特征说明
硕凯电子SOCAY瞬态二极管SMAJ400CA型号特征说明
硕凯电子（Sylvia）
一、产品图
1、为表面安装应用优化电路板空间
2、低泄漏
3、双向单元
4、玻璃钝化结
5、低电感
6、优良的钳位能力
7、400W的峰值功率能力在10×1000μ波形重复率（占空比）：0.01%
8、快速响应时间：从0伏特到最小击穿电压通常小于1.0ps
9、典型的，在电压高于12V时，反向漏电流小于5μA
10、高温焊接：终端260°C/40秒
11、典型的最大温度系数△Vbr=0.1%x Vbr@25°C x△T
12、塑料包装有保险商实验室可燃性94V-0
13、无铅镀雾锡
14、无卤化，符合RoHS
15、典型失效模式是在指定的电压或电流下出现
16、晶须测试是基于JEDEC JESD201A每个表4a及4c进行的
17、IEC-61000-4-2ESD15kV(空气)，8kV(接触)
18、数据线的ESD保护符合IEC61000-4-2(IEC801-2)
19、数据线的EFT保护符合IEC61000-4-4(IEC801-4)
三、应用范围
TVS器件非常适合保护I/O接口，Vcc总线和其他应用于电信、计算机、工业和消费电子应用的易损电路。
五、特性曲线
六、产品尺寸
七、命名方式。
PRC0805中文资料
= =
±50 ±25
PPM/°C PPM/°C TC2 = ±2
TC10 TC5 PPM/°C *
= =
±10 ±5
PPM/°C PPM/°C
Resistance Ranges
Refer to Capability Sheet for available ranges Contact factory for custom values
元器件交易网
TYPICAL RELIABILITY TEST DATA AND SPECIFICATIONS
Characteristic
MOISTURE LOAD LIFE
Test Conditions 60°C 95%RH Rated voltage for 1½ hours ON, ½ hour OFF. 1000 hours -55°C~RT~ +155°C~RT 30 min. ON 3 min. OFF 5 cycles 175°C No load 1000 hours 10~50Hz 3 directions each 2 hours Acceleration 50G Axis 11 msec. x 3 Total 18 cycles Solder temperature 275°C for 20 sec. ±1sec. Solder temperature 230°C ±5°C for 3 sec. ±1 sec. 2.5 times to rated voltage for 5 seconds 60°C, 95%RH No load 1000Hour 70°C Rated voltage for 1½ hours ON, ½ hour OFF. 1000 hours
75V
热敏电阻型号
代号
02 03 05 06
型号
0402 0603 0805 1206
电阻值代号
三位数（E-24 系列）： 前两位表示有效 数字，第三位表 示有效数字后零 的个数
例如： 103=10KΩ（E-24）
B值
只显示 前三 位数字值，且不包 括第四位数字 例如:
350=3500K
B 值误差精度代号
代号 误差精度
■ 参考标准 GB/T 5729-2003 GB/T 9546-1995 JIS C 5223-1995 JIS C 5201-1998 JIS C 5202-1990 SS-00259 the 4rd edition 详见 SGS 报告
5 / 19
热敏电阻采购 /
Flexture strength pressure shall be maintained for 5 sec。
No Mechanical damage；
Zero-power resistance at 25 deg(℃) Change
within ±3%
振动 Vibration
没机械损伤； R25 阻值变化率在±3%以内； B 值（B25/85）变化不超过±2%。 No Mechanical damage； R25 Change within ±2%； B-CONSTANT(B25/85) change within ±2%。
P T2 - T1
表示在环境温度为 25 ℃时，热敏电阻通过自加热温度升高至规定温度时所需的电功率。
可以使热敏电阻的升温保持在 1℃以下。
2 / 19
热敏电阻采购 /
■ 用法
■ 产品命名表示方法 XRN0 3 1 0 3 J 3 5 0 HT
电子保护器件贴片压敏电阻型号大全
电子保护器件贴片压敏电阻型号大全电子保护器件贴片压敏电阻型号大全硕凯电子（Sylvia）1、贴片压敏电阻产品简述压敏电阻是一种用得最多的限压器件。
压敏电阻有碳化硅压敏电阻和氧化锌压敏电阻。
常用的是氧化锌（ZnO）压敏电阻，它主要是以氧化锌为原料，添加多种微量金属氧化物，经混合成型，烧结装配而成的一种过压保护器件，它的外面包封环氧树脂(可添加颜料)。
压敏电阻分为贴片压敏电阻和插件压敏电阻，现在我们介绍的主要是用于防静电的贴片压敏电阻。
2、贴片压敏电阻型号大全（1）名称：0402封装封装：0402产品系列：0402封装规格：SC0402ML080M、SC0402ML120M、SC0402ML180K、SC0402ML240K、SC0402ML330K、SC0402ML390K（2）名称：0603封装封装：0603产品系列：0603封装规格：SC0603ML080M、SC0603ML120M、SC0603ML180K、SC0603ML240K、SC0603ML330K、SC0603ML390K（3）名称：0402低容系列封装：0402产品系列：0402低容系列规格：SC0402E005M18、SC0402E010M18、SC0402E030M18、SC0402E050M05、SC0402E050M09、SC0402E100M05、SC0402E220M05（4）名称：0603低容系列封装：0603产品系列：0603低容系列规格：SC0603E005M18、SC0603E010M18、SC0603E030M18、SC0603E050M05、SC0603E050M09、SC0603E100M05、SC0603E220M05（5）名称：ESD0402，ESD0603超低容0.2PF封装：0603产品系列：ESD0402，ESD0603超低容0.2PF系列规格：ESD0402E002M05、ESD0603E002M05（6）名称：SC0805排阻低容系列封装：0805产品系列：SC0805排阻低容系列规格：SC0805E100M05、SC0805E330M05、SC0805E500M05、SC0805E150K18（7）名称：0805封装封装：0805产品系列：0805封装规格：SC0805ML080M、SC0805ML120M、SC0805ML180K、SC0805ML240K、SC0805ML330K、SC0805ML390K（8）名称：1206封装封装：1206产品系列：1206封装规格：SC1206ML080M、SC1206ML120M、SC1206ML180K、SC1206ML240K、SC1206ML330K、SC1206ML390K、SC 1206ML470K、SC1206ML560K（9）名称：1210封装封装：1210产品系列：1210封装规格：SC1210ML180K、SC1210ML240K、SC1210ML330K、SC1210ML390K、SC1210ML470K、SC1210ML560K、SC 1210ML680K（10）名称：1812封装封装：1812产品系列：1812封装规格：SC1812ML180K、SC1812ML240K、SC1812ML330K、SC1812ML390K、SC1812ML470K、SC1812ML560K、SC 1812ML680K（11）名称：2220封装封装：2220产品系列：2220封装规格：SC2220ML180K、SC2220ML240K、SC2220ML330K、SC2220ML390K、SC2220ML470K、SC2220ML560K、SC2220ML680K3、小结有关硕凯贴片压敏电阻的各种型号主要是以上这些系列，后期有新产品另作更新！谢谢您的查阅！。
自恢复保险丝SMD0805封装参数型号规格书大全
The SMD0805Series PTC provides surface mount over-current protection for applications where space is at a premium and reset table protection is desired.◆RoHS compliant,Lead-Free and Halogen-Free ◆Fast time-to-trip◆Compact design saves board space ◆Agency recognition:UL ◆Low-profileAlmost anywhere there is a low voltage power supply,up to 16V and a load to be protected,including:◆Computer mother board,B hub ◆PDAs &Charger,Analog &digital line card ◆Digital cameras,Disk drivers,CD-ROMs ◆USB peripherals ◆Power ports◆General electronicsPartNumberIhold (A)I trip (A)V max (Vdc)I max (A)P dtyp.(W)Maximum TimeTo Trip ResistanceCurrent (A)Time (Sec.)R min (Ω)R max (Ω)SMD0805-0100.100.30151000.500.50 1.50 1.000 6.000SMD0805-0200.200.5091000.508.000.020.650 3.500SMD0805-0350.350.7561000.508.000.100.250 1.200SMD0805-0500.50 1.0061000.508.000.100.1500.085SMD0805-0750.75 1.506400.608.000.200.0900.385SMD0805-1001.01.9561000.608.000.300.0600.230I hold =Hold current:maximum current device will pass without tripping in 25°C still air.I trip =Trip current:minimum current at which the device will trip in 25°C still air.V max =Maximum voltage device can withstand without damage at rated current (I max )I max =Maximum fault current device can withstand without damage at rated voltage (V max )P dtyp.=Power dissipated from device when in the tripped state at 25°C still air.R min =Minimum resistance of device in initial (un-soldered)state.R max =Maximum resistance of device in initial (un-soldered)state.R 1max =Maximum resistance of device at 25°C measured one hour after tripping.Caution:Operation beyond the specified rating may result in damage and possible arcing and flame.Part NumberAmbient Operation Temperature-40°C-20°C0°C25°C40°C 50°C 60°C 70°C 85°CHold Current (A)SMD0805-0100.140.120.110.10.80.70.60.50.3SMD0805-0200.280.250.230.200.170.140.120.100.07SMD0805-0350.470.440.390.350.300.270.240.200.14SMD0805-0500.680.620.550.500.400.370.330.290.23SMD0805-075 1.000.900.790.750.630.570.530.410.34SMD0805-1001.351.251.151.000.820.740.650.550.42A=SMD0805-010B=SMD0805-020C=SMD0805-035D=SMD0805-050E=SMD0805-075F=SMD0805-100Part MarkingXPart Identification1Example1= SMD0805-010 2= SMD0805-020 3= SMD0805-035 5= SMD0805-050 7= SMD0805-075 0= SMD0805-100Profile FeaturePb-Free Assembly Average Ramp-Up Rate (T S max to T P ) 3°C/second max. Preheat :Temperature Min (T S min) Temperature Max (T S max) Time (T S min to T S max) 150°C 200°C60-180 seconds Time maintained above: Temperature(TL) Time (tL)217°C60-150 seconds Peak/Classification Temperature(T P ): 260°C Time within 5°C of actual peak: Temperature20-40 seconds Ramp-down Rate:6°C/ second max. Time 25°C to Peak Temperature8 minutes max.Note: All temperatures refer to of the package, measured on the package body surface.Solder reflowDue to “Lead Free ” nature, Temperature and Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components.1.Recommended max past thickness > 0.25mm.2.Devices can be cleaned using standard methods and aqueous solvent.3.Rework use standard industry practices.4.Storage Environment : < 30℃/ 60%RHCaution:1.If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.2.Devices are not designed to be wave soldered to the bottom side of the board.Soldering ParametersRamp-downPreheatCritical Zone T L to T PTime to peak temperature(t 25℃ to peak)T PT L T S(max)T S(min)25T e m p e r a t u r eRamp-upTimeA B C DeviceNominalNominal Nominal 0805 Series1.201.001.50The dimension in the table below provide the recommended pad layout for each SMD0805 devicePart Numbering Pa c k ag ingPad Layouts Unit: mmTerminal pad material Pure TinSoldering CharacteristicsMeets EIA specification RS 186-9E, ANSI/J-std-002 Category 3Material Specifications010SMD0805Product nameSMD ：surface mount deviceHold Current 0.10ATape & Reel Quantity5,000 pcs/reelABCDEPart NumberMin.Max. Min. Max. Min. Max. Min. Max. Min. Max. SMD0805-010 2.00 2.20 1.20 1.50 0.50 1.00 0.20 0.60 0.10 0.45 SMD0805-020 2.00 2.20 1.20 1.50 0.45 1.00 0.20 0.60 0.10 0.45 SMD0805-035 2.00 2.20 1.20 1.50 0.45 1.00 0.20 0.60 0.10 0.45 SMD0805-050 2.00 2.20 1.20 1.50 0.30 0.60 0.20 0.60 0.10 0.45 SMD0805-075 2.00 2.20 1.20 1.50 0.40 1.00 0.20 0.60 0.10 0.45 SMD0805-1002.002.201.201.500.501.100.200.600.100.45Dimensions Unit: mmu Operation beyond the specified maximum ratings or improper use may result in damage and possible electrical arcing and/or flame.u PPTC device are intended for occasional over-current protection. Application for repeated over-current condition and/or prolonged trip are not anticipated.uAvoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device performance.WarningTape and Reel SpecificationsDirection of Feed0.33 (8.4)0.512(13.0)Arbor Hole Diameter7.0 (177.8)0.212 (5.4)0.157 (4.0) 0.059(1.5)Diameter Cover tape0.314 (8.0)0.157 (4.0)Dimensions are in inches(and millimeters)。
贴片LED灯珠-0805蓝光贴片LED-0805LED灯珠规格书
C ustomer:·Technical Data Sheet PN:XGS-PB2012UB-02 For:IF=20mAContents1.Features2.Applications3.Package dimensions4.Absolute maximum rating5.Electrical optical characteristics6.BIN range7.Package label8.Soldering pad dimensions9.Soldering conditions10.Package tape specifications11.T ypical electro-optical characteristics curves12.Reliability test items and conditions13.Cautions14.Note◆F eatures:Compatible with automatic placement equipmentCompatible with reflow solder processLow power consumption and wide viewing angleThis product doesn’t contain restriction Substance, comply ROHS standard.◆A pplications:Automotive and TelecommunicationFlat backlight for LCD ,switch and symbol in telephone and faxGeneral use for indicators◆P ackage Dimensions:Unit:mmTolerenc e±0.1Electrodes: Ag Plating◆A bsolute Maximum Rating （Ta=25℃）* I FP condition: pulse width ≤1ms ,duty cycle ≤1/10◆E lectrical Optical Characteristics（Ta=25℃）Notes: 1.Tolerance of Luminous Intensity ±10%2.Tolerance of Dominant Wavelength ±2nm3.Tolerance of Forward Voltage ±0.05V4.Luminous Intensity is measured by XGSLED’s equipment on bare chips◆ Soldering Pad Dimensions:◆ S oldering Conditions (Maximum allowable soldering conditions)Reflow soldering profile<Pb-free solder>Time• Reflow soldering should not be done more than two times. • Do not stress its resin while soldering.• After soldering,do not warp the circuit board.T e m p e r a t u r e◆ P ackage Tape Specifications: (3000 pcs/Reel)Reel Lead Min.60mm No LEDs5 Reels in one Box10 Boxes in one Carton◆ T ypical Electro-Optical Characteristics Curves ：Forward Current Vs Ambient Temperature5040302010100250Forward Current Vs Relative Luminosity204060801001020304050Ambient Temperature Ta (° C)Forward Current (mA)200 15010050 Relative Luminosity VsAmbient TemperatureIf=15mA-50° -60°-70°-80°-90°-40°-30°-20°-10°0°10°20°30°40°50°60°70°80°90° 0 0204060801001.00.50.5Radiation Angle1.0Ambient Temperature Ta (° C)R e l a t i v e L u m i n o s i t y (%)F o r w a r d C u r r e n t (m A )R e l a t i v e L u m i n o s i t y (%)◆Reliability(1)Test Items and Conditions(2)C riteria of judging the damage◆C autions1、PackageWhen moisture is absorbed into the package it may vaporize and expand during soldering. There is apossibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. So the moisture proof package is used to keep moisture to a minimum in the package.2、StorageBefore opening the package: The LEDs should be kept at 5~30°C and 60%RH or less. The LEDs should be used within a year.After opening the package: The LED must be used within 24 hours, else should be kept at 5~30℃and 30% RH or less. The LEDs should be used within 7days after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again.If the LEDs have exceeded the storage time, baking treatment should be performed more than 24hours at 60±5°C.3、Soldering IronEach terminal is to the tip of soldering iron temperature less than 300℃ for 3 seconds within once inless than the soldering iron capacity 25 W.Leave two seconds and more internals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder.4、RepairingRepairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.5、The LED electrode sections are comprised of a gold plated. The gold surface may be affected by environments which contain corrosive gases and so on. Please avoid conditions which may cause the LED to corrode or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the User use the LEDs as soon as possible.6、Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur.◆Notes:1、Above specification may be changed without notice. We will reserve authority on material change for above specification.2 、When using this product, please observe the absolute maximum ratings and the instructions for the specification sheets. We assume no responsibility for any damage resulting from use of the product which does not comply with the instructions included in the specification sheets.。
0805led限流电阻
0805led限流电阻摘要：1.概述0805LED 限流电阻2.0805LED 限流电阻的特性3.0805LED 限流电阻的选用与安装4.0805LED 限流电阻的注意事项正文：【概述0805LED 限流电阻】0805LED 限流电阻，是一种用于LED（发光二极管）电路中的限流元件，主要作用是保护LED 灯珠，防止电流过大而导致的过热、烧坏等问题。
0805LED 限流电阻具有体积小、性能稳定、耐压能力强等优点，广泛应用于各类LED 产品中。
【0805LED 限流电阻的特性】0805LED 限流电阻具有以下特性：1.体积小：0805 封装尺寸，便于安装在各种小型化的LED 产品中。
2.稳定性：采用专业的设计和材料，能够在高温等恶劣环境下保持稳定性能。
3.耐压能力强：能够承受较高的电压，有效保护LED 灯珠。
4.限流性能：通过电阻值设定，可精确控制LED 的电流，避免过流损坏。
【0805LED 限流电阻的选用与安装】在选用0805LED 限流电阻时，需根据LED 的电压、电流等参数选择合适的电阻值。
安装时，将电阻器焊接在LED 电路的正负极之间，使电流通过电阻器后，达到限制电流的目的。
注意在安装过程中，要避免电阻器受到机械损伤，以免影响其性能。
【0805LED 限流电阻的注意事项】使用0805LED 限流电阻时，需注意以下几点：1.选用合适的电阻值，以保证LED 正常工作，并避免过流损坏。
2.焊接时，注意焊接温度和时间，避免过高温度导致电阻器性能下降。
3.安装过程中，避免电阻器受到机械损伤，以免影响其性能。
4.在使用过程中，注意LED 产品的散热问题，以保证LED 灯珠的使用寿命。
总之，0805LED 限流电阻作为LED 电路中的重要组成部分，具有保护LED 灯珠、限制电流的作用。
mkb0805原理
mkb0805原理
mkb0805是一种电阻器件，其原理基于电阻的特性。
电阻是一种用于控制电流流动的元件，阻碍电流通过的程度取决于电阻的阻值。
当电流通过电阻时，会产生电阻的压降，即电压降。
根据欧姆定律，电流通过电阻的大小与电压降成正比，与电阻阻值成反比。
mkb0805是一种SMD封装的电阻器件，尺寸为0805，表示其尺寸为0.08英寸×0.05英寸。
它由一片陶瓷基板上的薄膜层组成，该薄膜层具有规定的电阻值。
当电流通过mkb0805时，根据其电阻值和欧姆定律，会产生相应的电压降。
mkb0805常用于电子电路中，用于限制电流、分压、匹配电阻等功能。
其原理是利用电阻的特性，通过控制电阻的阻值来实现对电流和电压的控制和调节。