PhotoLec1

合集下载

图像测量软件 iSolution Lite 使用手册说明书

Features included in iSolution LiteInclude:Live Measurement and Overlay SettingsUsers can perform measurements on the live preview image, using the crosshair or grid masks to center and count. The grid masks include calibration data. Calibration marker (scale bar) can be placed on the live preview image. The marker (scale bar) can also be burned on each captured image automatically. Any standard file format image can be chosen to see it above live preview image.Calibration (Auto, Manual)All measurements start with an accurate calibration. Auto, Semi-Auto calibration functions allow the software to calculate the pixels-per-unit value automatically. Only setting the unit for the calibration scale and the distance between the scale marks is needed. This feature greatly improves the accuracy and repetition of measurements. Manual calibrations are easily added and saved for recall from a drop down menu. All calibrations can be saved as files, which let the calibration be retrieved by simply opening the saved files later.Calibration can be protected by password option. Two password options, one in calibration menu itself and the other in camera resolution option, protect calibration by unexpected change. A scale bar can be permanently added to each image. Scale bar properties for color, size and text are simple to optimize for any image background.Z-Axis Extended Focus Imaging (EFI), with displacement compensation for stereo microscopesSamples with curves or of varying heights are difficult to bring into focus under highly magnified conditions. And more a stereomicroscope takes images with tilting due to its own structural characteristics. Thus, each image is out of its supposed position when you move microscope to the Z-axis getting the right focus. Our displacement compensation function allows you to rearrange these images automatically and manually.Software can combine a stack of images sequentially captured at different levels of focus and combine them into a single in-focus image. You can count on our software not to leave any trace of the composites.3D Visualization. . . clearly view complex structuresA Three-dimensional picture can be created from any image. The 3-D presentation is based upon intensity values of the image and can be displayed as a normal or wire frame image. Z axis information can easily be adjusted to optimize the 3-D effect. To better visualize an image in 3-D, software offers full 360 degrees of rotation on X-Y-Z axis. A 3D image can then saved in JPG, TIF or BMP format.Image Stitching. . . create a mosaic of the “Big Picture”With our software, you can create auto and manual composites of continuously captured images in order to minimize the reduction in the field-of-view that typically comes with increased magnification. Combined images are automatically corrected for brightness without leaving any stitching mark. Live Image Comparison. . . for fast inspection and size verificationFor QA testing or quick go/no-go inspections any stored image can be used as a reference image onto which the live preview image is projected.Time Lapse Capture and Movie File Production. . . Import into Power PointSoftware features a Time Lapse Capture function that supports TIF, BMP and JPG file formats. The Time Lapse Capture function also includes an Auto Save feature byyyyy/mm/dd/hour/minute/second. You can save video movie recordings in AVI, MPG, MPEG, and MOV formats.Combine Image Planes - Fluorescence ImagingMerge and pseudo color monochrome images into a single RGB composite.Export Into Excel® - with one mouse clickA single mouse click exports the original image with measurement, calibration, annotation overlay,measurement data, statistics, and chart.Manual Measurement Tools - Including Various Perpendicular DistanceSoftware’s versatile manual measurement features include tools for measuring lengths, areas, and angles and can even auto detect an object's outline and then make specified measurements. The software is equipped with a wide choice of powerful measurement tools including 3-point circle functionality, Npoint circle measurement functionality, parallel line distance measurement, perpendicular distance measurement and object distance measurement. In addition, a zoom-in window can be used to determine the accurate measuring point of an object.Once you've measured a specimen you can easily export all of the images, measurement data and statistics to an Excel® file. With iSolution Lite, comprehensive statistics and data are just one effortless mouse click away.Line ProfilingSingle, multiple, parallel and polyline commands provide Gray/Red/Green/Blue intensity values for specific lines within an image. The profile data of each pixel on the line can be exported to MS Excel. Auto TraceUsing an automatic edge detection algorithm, our software will perform an auto trace measurement function around a closed object. This function greatly increases accuracy and saves time when making measurements of complex shapes.Image ProcessingManual Brightness, Contrast, Gamma, Background Subtraction, Shading Correction, Histogram, Clone, Crop, AOI, Resize, Rotate, Split, Merge Monochrome series into RGB Color, Combine different exposure Images for highlight reduction, Image Mode Change, Grayscale, RGB, HSB, YUV Pseudo Color view, Full range of enhancement and morphology filters 8bit and 16bit per channel Manual MeasurementsPoint Count, Straight Line, Circle by radius, Circle by N points, Circle by diameter, Circle by 3 points, rectangle, polygon, polyline, splice lines from a common point, auto trace, angle parallel lines, perpendicular width, perpendicular from common line, angle between 2 lines, distance, perpendicular distance.Shading CorrectionThe edge parts of captured image by low magnification have background shading frequently, which can be removed by the shading correction function. The color of the original image remains the same though. A standard image is acquired from a blank space on the slide glass, or from an out of focus image in a metallurgical specimen. Such a standard image is used to correct the background shading of all other captured images.AnnotationLine, arrow, polyline, spline, rectangle, ellipse, textRegion of Interest- ROI. . . . with unique add/subtract capabilityRectangle, arbitrary rectangle, circle, arbitrary ellipse, polyline, spline, magic wand ROI itself can be saved to work with other images. The saved ROI can be placed on the exact same location of other images.View and Zoom ImageManual zoom In-Out, User Defined, Fit to Window, 1600% Zoom in Window for Accurate Edge Detect, sizeable context Window to view all open ImagesImage EditingUndo, Redo, Copy, Paste, Paste New, Delete, Delete All, Annotate, Image InformationSave OptionsTXT File Format, image and measurement data together in Proprietary .img File Format for future editing and data collectionSupported Image File Formatsjpg, jpeg, tif, tiff, bmp, gif, pcx, tga, mpg, mpeg, avi, mov, img, rpt, txt and etc.Report GeneratorCreate Report, Insert Image and Data, Insert other OLE ObjectsWindow ViewSplit Horizontal, Split Vertical, Cascade, Tile Horizontal, Tile Vertical, Arrange icons, Dynamic User Interface (UI), Classic, ModernTime Lapse Sequence ControlPlay Forward, Backward, Making Movie File (mpg, avi, mov) with Still Images, Split Single Image from Sequence FilePerfect Focus EnhancementiSolution FL implements a perfect function of focus compensation irrespective of the status of lights and specimen.Reflected Light SubtractioniSolution FL creates clear, evenly illuminated images by removing the bright saturated light from a highly reflective sample.System Requirements• PC with a Pentium-class processor; Pentium 300MMX or higher recommended• Microsoft Windows Win7/Vista/WinXP/2000/ME/Win98SE operating system• 32 MB of RAM or more (128 MB recommended)• 15 MB or more hard-disk space (50 MB recommended)• CD-ROM drive• VGA or higher-resolution monitor; Super VGA recommended (1024 x 768 pixel and 24 bit and more color support video card is recommended)• Microsoft Mouse or compatible pointing device• USB- or LPT-port for hardware key (depends on delivery).Supported imaging devices1. TWAIN Driver2. DirectShow/ WDM (Windows driver mode) driver3. i-Link DevicesAll PixeLINK cameras.Optronics digital cameras- MicroFire- MacroFire- QuantiFire and QuantiFire XI- Microcast- All MPX series cameras- All QPX series camerasJenoptik ProgRes digital cameras- C3 (cooled and non-cooled)- C5 (cooled and non-cooled)- C14- ProgRes CF and CFScan (cooled, non-cooled, and scan)- ProgRes MF (cooled, non-cooled, and scan)-ProgRes all CMOS cameras.Nikon digital cameras- DS-U2 Fi1- DS 5M/2M-U2- DS 5M/2M-U1- DXM 1200C- DXF 1200FPixera digital camera- Penguin series all models- Pro series all modelsScion corporation digital camera-CFW series all modelsMatrix vision-mvBlueFox digital cameraArtray- ARTCAM-500MI- ARTCAM-300MI- ARTCAM-200MI- ARTCAM-130MI (color, mono, and NIR) - ARTCAM-036MI (color, mono, and TWIN) - ARTCAM-500P- ARTCAM-200SH- ARTCAM-150P-II (color and mono)- ARTCAM-098 (color and mono)- ARTCAM-34MCLumenera- Infinity 1 series all models- Infinity 2 series all models- Infinity 3 series all models- Infinity X and Infinity X-21XLi camera- M series cameras- DC series cameras- DX series camerasSpot digital camera- Insight- FlexQimaging digital cameras- MicroPublisher- RetigaAll Leica digital cameras by TWAINCarl Zeiss AxioCam by TWAINFlashBus frame grabber- Spectrim Lite- Spectrim Pro- MV LiteMatrox frame grabber- Meteor IIAvermedia frame grabber- EZMakerConsumer digital camerasIMT i-Solution Inc. 。

Olympus 1X71 用户手册说明书

UCL Institute of Child HealthUser guide Olympus 1X71Dr Bertrand VernayLight Microscopy Facility ManagerWellcome building, Office W2.09Tel Office: 42224TelMobile************Email:***************.ukRevised December 2014Table of contentspage 3 ......... O wnershippage 3 ........ Access Rulespage 3 ......... O lympus Customer Support Contactpage 4 ........ General SpecificationsMicroscopy Techniques AvailableObjectivesFilter CubesCameraFluorescence IlluminationPixels to Microns CalibrationConsumables Listpage 5 ......... Quick User GuidesTransmitted LightEpifluorescenceImage Capturepage 6 ......... Halogen Lamp Operationpage 7 .... Kohler Illuminationpage 8 ........ Adjusting the Objective Correction Collar page 9 ........ Prior Lumen200 Metal Halide Lamp Operation page 10 .. Image Capture with HClmagepage 11 ... Selecting the Right Fluorochrome/Filter Setpage 11 DAPIpage 12 Endow GFP/EGFP Bandpasspage 13 DsRed(TRITC/Cy3)page 14 Cy5page 15 Cy7page 16 ....Prior Lumen200 Spectral Outputpage 17 ... Hamamatsu ORCA-R2 Spectral ResponseOwnershipProf. Jane Sowden, Developmental Biology Unit (Purchased in 2011)Access Rules∙No access without prior training by the Light Microscopy Facility Staff ∙Free of hourly charge for Sowden and Ferretti groups, £1 hourly charge for all other users towards the cost of the consumables is expected ∙Prof. Sowden team has priority over other users.∙Users must always record their activity in the Log book∙Problem(s) with the microscope should be reported as soon as they are noticedOlympus customer support service: /microscopy The system is not covered by a maintenance contractOlympus requires a PO number before sending an engineerGeneral specificationsMicroscopy techniques available∙Brightfield∙Phase contrast∙EpitluorescenceObjectives∙O ly mpu s UP l an FL N 10x Ph1 NA0.3 WD10.0 mm∙Olympus LUCPlanFLN 20x Ph1 NA 0.45 WD 6.6-7.8 with correction collar ∙Olympus LUCPlanFLN 40x Ph2 NA 0.6 WD 3.0-4.2 with correction collar ∙Ze is s o bj ec t ive s c an al s o be use dCamera (see p16)Hamamatsu ORCA R2 CCD Camera with HClmage Capture SoftwareFluorescence illumination (see p16)Prior Lumen 200 Metal Halide Light Source (2000 hours/bulb)Pixels to Microns calibration5x objective binning 1x1 1 pixel = 1.88 um10x objective binning 1x1 1 pixel = 1.03 um20x objective binning 1x1 1 pixel = 0.514 um40x objective binning 1x1 1 pixel = 0.256 umCalibration with a micrometer under transmitted white ligh tConsumables listPrice correct as of November 2013∙Prior Lumen 200 bulb LM375 (£550, Prior Scientific Instruments Ltd)∙Prior Lumen 200 light guide LM587 (£400, Prior Scientific Instruments Ltd)∙Halogen bulb 12V/100W (£1.8, Technical Lamp Supplies UK)Quick user guidesUsers must always record their activity in the Log bookTransmitted light1.Halogen Lamp Power Supply Unit TH4 "ON"2.Light Path selector on "Ocular"3.Kohler illumination adjusted4.Correct phase ring in position (10x & 20x Ph1, 40x Ph2)5.Filter cube on po sition #6EpifluorescenceWarnings:Do not shut the unit down within 30 minutes of powering up the unit.∙After shutting down the unit allow 30 minutes before re-powering up ∙After shutting down the unit allow 30 minutes before changing the bulb. Failure to do so is likely to result in damage to the bulb.1.Prior Lumen 200 module on2.Prior Lumen 200 intensity knob >0%3.Light Path selector lever on "Ocular"4.Correct filter cube in position5.Fluorescence shutter openImage Capture1.Start Camera controller (press until LED turns green)puter on (Login: Jane/ Password: Ja*e)3.HClmage software open4.Light Path selector lever on Camera5.Correct transmitted light/epifluorescence set-up6."L i v e"mo de7.Adjust exposure time accordingly. Make use of the Histogram and the Saturatio noptions8."A b o r t"9."C a p t u r e l"10.S a v e a s in M y D o cu me n ts>U s e r N ame_U n i t>Fi le N am e.t i f11.Shut-down: exit HClmage, log out windows session, camera on stand-by (pressuntil LED turns orange)Halogen lamp operation:Turning on the lamp1.Make sure the light intensity control knob (5) is in the MIN (minimum intensity)position on the microscope frame.2.Make sure the light intensity control knob (1) is in the MIN (minimum intensity)position on the TH4 module.3.Set the main switch (2) to "I" (ON) on the TH4 module.4.On the microscope front, press the transmitted light ON-OFF button (6) so thatthe button is illuminated.5.Adjust the brightness with the light intensity control knob (5).6.To turn OFF, set the transmitted light ON-OFF button (6) to OFFHalogen lamp operation:T urning off the lamp1.Set the light intensity control knob (5) to the MIN (minimum intensity) position onthe microscope frame.2.Set the light intensity control knob (1) to the MIN (minimum intensity) position onthe TH4 module.3.Set the main switch (2) to "0" (OFF) on the TH4 module.Kohler illumination:1.Rotate the turret (1) to the "BF" position. (Any of positions 3,4 or 5, position 1=Ph1, 2 = Ph2)2.Slide the aperture iris diaphragm lever (2) to fully open the diaphragm.3.Slide the field iris diaphragm lever (3) to the fully open position.4.Engage the 10x objective and bring the specimen into focu s.ing the field iris diaphragm lever (3), completly close the field iris diaphragm.6.Rotate the condensor height adjustment knob (4) to bring the field iris diaphragmimage into focus.7.Center the field iris diaphragm (3) using the condenser centering kno bs (5).8.Open the field iris diaphragm (3) until its image reach the limits of the field of view,adjust the centering if necessary.9.Open the field iris diaphragm (3) until not visible.Step 6 Step 7 Step 8 Step 9Adjusting the objective correction collarCorrection is possible according to the vessel bottom thickness.1.When the thickness of the vessel bottom is known, match the scale reading of thecorrection collar to the thickness of the vessel in use.or2.If the thickness of the vessel is unknown or diverge from the manufacturerspecifications, the optimum position for the correction collar can be obtained by judging the image resolution and contrast. When a satisfactory image is not obtain after focusing:1. Rotate the correction collar to the left and right, refocus each time andcompare the images.2 Then rotate the collar in the direction yielding a better image, rotate thecorrection collar to the left and right, refocus each time and compare theimages.3 Repeat this cycle until the position with the optimum image is found.20x Correction Collar 40x Correction CollarCorrection Collar Scale0 mm0.17 mm (glass coverslip #1.5)0.5 mm1 mm (most tissue culture plates)1.5 mm2 mmPrior Lumen200 Metal Halide Lamp Operation:Starting Up the Lumen1.Switch the Lumen power switch on.2.Make sure the ventilation vent on the left hand side is unobstructed or the lampwill overheat resulting in automatic shutdown and damage to the module.3.Allow 1-5 minutes for light to reach 70% of output.4.Allow 30 minutes for the Lumen to reach operational temperature.5.Warning: Do not power down the unit within 30 mins of power up. This may re-duce the effective lifetime of the bulb.Shutting down the LumenThe following warnings apply as damage to the bulb may result if instructions not followed:1.Warning: Do not shut the unit down within 30 minutes of powering up the unit.2.Warning: After shutting down the unit allow 30 minutes before re-powering up orchanging the bulb. Failure to do so is likely to result in damage to the bulb.Warning: the airoutlet for heatventilation mustnot but obstructed[Mono: 1 Channel ⏹ Mono: 1 Channel v•[C10600-100 (O R CA-R 2) S IN: 011316 ⏹C10600-106 (CIRCA-R2) SP!: 011316--- — X CaptureXBinning and SubArray Advanced Camera PropertiesBinning and SubArray Advanced Camera PropertiesusL IP r o c e s s i n gIF! 0uL P r oc es s in gD e p t h16 b itBinning and SubArray Binning [1 Sub-Array ResetPreset Sizes[1344 x 1024 ⏹X 0 0 L i e d a g .:Width 1344 Image Capture with HClmage1. Click the Capture pane.2. Click Live for a live image from the camera3. Camera binning or image sub-array can be set in the Binning SubArray panel.4. In the Camera Control panel, adjust exposure/gain manually or automatically by clicking on Auto Expose; view the intensity distribution in the histogram.5. Check Sat. (saturation) in the histogram of the Image Display to guard against image saturation. Saturated pixel are indicated in Red. Yellow indicates pixels ap -proaching saturation.6. Adjust camera exposure and gain settings as necessary7. Click Abort.8. Click Capture1 to acquire an image.9.Click the Save icon to save the image in My Documents>UserName_Unit>file name.tifC a p t u r eMEMCapturelAbort1Capture1iY 2/ C a m e r a C o n t r o l1 Li n 1,1.A.M.Pi n M.,11Auto ExposeAu to Expos eT e m p e r a t u r e [C ] Current100 Camera ControlTemperature [C]OffsetB4UDefault ⏹DefaultGain Exposure 00.10000(OffsetG a i n E x pos u re 0 ! ;0. 10400C 1Ilkstogursr ;401Lopg:• ItE•4 • a-YO 0Height 1024I lb O..^ • la Coorto0wpo•d • ItI P f o r H O V I. M o o n.. t l e f r a89Selecting the right fluorochrome/filter setPosition #149000 - ET - DAPIExciter 350/50xbeamsplitter 400113Emitter ET460/50m550Wavelength (nm)Position #241017 EndowGFP/EGFP Bandpass Emitter ET470/40xBeamsplitter 495LPEmitter ET 525/50mPosition #349005 - ET - DSRed (TRITC/Cy3) Exciter ET545/30xBeamsplitter T570LPXREmitter ET620/60m100Position #4 49006 - ET - Cy5 emitter ET620/60xBeamsplitter T660LPXR Emitter ET700/75n,Position #549007 - ET - Cy7Exciter ET710/75xBeamsplitter T760LPXREmitter ET810/90m700 750 800 850Wavelength (nm)T7601pxrHClmage Live。

Photoshop里图片的高级处理工具cameraraw

Photoshop里图片的高级处理工具camerarawPhotoshop里图片的高级处理工具camera raw我们拍摄jpeg格式照片时，相机会自动处理这批jpeg文件已改进和压缩图像，单反数码相机一些高端的消费型相机都提供raw原始数据格式的用于处理照。

raw文件与jpeg不同，它包含相机捕获的所有数据。

如果IOS设置快门设置。

光圈值白平衡等。

raw未经处理也未经压缩的格式，因此又称为数字底片。

Camera raw是专门用于处理raw文件程序，他可以解释相机原始数据的文件，是拥有相关详细信息以及图像元素来构建处理色彩图像。

此外，该程序还可以处理这批raw图像和tife图像。

Camera raw作为一种增效工具随Photoshop一起提供，安装时就会自动安装它，camera raw可以调整图片的颜色，包括白平衡色调以及饱和度。

对图像进行锐化处理，减少杂色。

纠正镜头问题以及重新修饰，我们可以将处理的raw文件储存为PSD。

Tiff。

jpeg。

dng 格式。

基本选项相机名称或文件格式:打开raw文件是窗口。

左上角可以显示相机名称打开其他格式的文件时则显示图像的格式。

预览:可在窗口中实时显示对照片儿所有的调整。

切换全屏模式:可以对对话框切换为全屏模式。

Rgb:将光标放在头像上会显示光标下像素的rgb颜色值。

直方图:显示直方图。

Camera raw设置菜单:访问菜单。

缩放级别:放大设置或缩放窗口显示比例。

单机显示工作流程选项:可以从camera raw输出所有文件的指定设置。

工具缩放工具:单击可以放大窗口中图像的显示比例按住alt健可以缩小图像的显示比例。

抓手工具:放大窗口，以后可以用该工具预览窗口中的移动头像，此外，按住空格键可以切换为该工具。

白平衡工具:使用该工具可以在白色和灰色的图像内容上单击可以笑中照片的白平衡。

双击该工具可以将白平衡恢复为照片儿的原来状态。

颜色取样器: 使用该工具图像单机可以建立取样点最多为九个。

PX1-PRO三色激光HOME娱乐房间项目机，支持107%BT.2020色彩说明书

107%BT.2020 colour1 BillionColo u rs•Red + Green + Blue Lasers •107% BT.2020 colour •90 to 130-inch Projection Size• 2200 Lumens Brightness •4K Resolution, 60Hz Refresh •HDR10 High Dynamic Range•30W Dolby Atmos ® Sound •High-Speed HDMI with eARC •Android TVTriple-Laser UST Built for Home Theatr eThe PX1-PRO features the award-winning TriChroma laser engine to achieve full coverage of the BT.2020 colour space for a true-to-life picture. With its Digital Lens Focus the PX1-PRO delivers a razor-sharp 4K image in sizes from 90 to 130-inches . Add to that premium features like eARC for lossless audio, Filmmaker Mode, Auto Low Latency Mode, and smart home integrations and you’ve got yourself an Ultra Short Throw brimming with entertainment potential.Triple Laser LightThePX1-PROusespurered, green, and blue lasers to achieve newlevels of pictureperformance, reaching107% of the BT.2020 colour space - that’scolour you’ve never seen on a displaybefore.4K UHD Image Resolution HDR10High Dynamic Range with HLG90″ ~ 130”Projection Size 2200 Lumens DigitalLens FocusIncredible Clarity and Contrast4K Ultra HD brings over 8 million pixels to create incredibleclarity across an extra-large projection. High DynamicRange expands colour and contrast so you can enjoy astunningly vibrant picture with incredible depth and detail.30WDolby Atmos® SoundHigh-Speed HDMIwith eARC1,000,000:1Dynamic ContrastWith built-in 30W Dolby Atmos® sound, PX1-PRO sounds biggerthan it looks. Get clear speech, crisp highs, and booming lowswithout having to invest in any extra gear. Or use the High-Speed HDMI port with eARC to pass-thru uncompressed audioto your surround sound system.Up to 130”ProjectionImmersive EntertainmentGet ready to make movie night, your next streaming binge,or gaming to a whole new level. With Digital Lens Focus thePX1-PRO can project images from 90 to 130 inches withrazor-sharp focus for maximum viewing immersionAt 2200 Lumens peak brightness, the PX1-PRO shines withbrilliance so that everything you watch hits those sparklinghighlights, voluminous colours, and deep blacks. PX1-PRO isperfect for home theatre, be it your living room, basementor dedicated theatre room.Ports & Connectivity2xHigh-Speed HDMI (1 with eARC)1xDigital Audio Out 1xRF Antenna 1xUSB 3.01xUSB 2.01xLAN EthernetIntegrate Laser Cinema with your wireless multi-channelsurround sound system - the PX1-PRO is WiSA ready.PX1-PRO uses the same DLP projection technology usedin 9 out of 10 movie theatr es to create laser-focused detail.With extreme clarity and depth of colour, everything youwatch looks truly cinematic.With the PX1-PRO’s microsecond-level processorresponse, you never miss a moment of the action.Fast-moving images are buttery smooth and crystalclear - so whether its sports, games, or action ﬁlmsthe PX1-PRO keeps pace.Built-in WiFi, Bluetooth, Google Assistant, Works with Alexa,and Control4 compatible, the PX1-PRO can be integratedwith your smart home ecosystem to create automationsto your heart’s content.The PX1-PRO takes eye safety seriously with its eye protectionfunction that dims the picture when something gets a littletoo close. Got an overprotective pet? Don't worry, you canalways turn off the protection sensor to avoid beingdisturbed.Android TV brings great content to the biggest screen in your home. Install apps from the Google Play Store and login to your favorite streaming services for limitless entertainment. Use Chromecast to mirror your phone or tablet directly to the Laser Theatre.Dial-in image focus from the convenience of your couch. Digital Lens Focus allows you to adjust the projector’s focus mechanism with your remote -no need to mess with a focus wheel.Filmmaker Mode disables any motion processing adjust-ments from the projector settings to ensure you’re seeing content exactly the way the moviemakers intended.No need to manually change picture settings when you’re about to drop in. Auto Low Latency Mode detects when a gaming console is the active source and automatically adjusts projector settings to optimize game performance.X-Fusion™ laser light technology provides up to 25,000 hours of entertainment without any loss in laser performance. And forget LED projectors with their slow warm-up time – the PX1-PRO has instant-on laser light to set the perfect picture immediately.All product, product speciﬁcations, and data are subject to change without notice to improve reliability, function, design or otherwise. Release 011822.All trademarks and logos used herein are the property of their respective owners. Copyright © 2022 Canada , All rights reserved.Tech SpecsPX1-PRO TriChroma Laser Home TheatreDimensionsWeightPackaged Dimensions Packaged Weight Smart TV PlatformApp StoreStreaming Services Voice Assistant Works With Screen MirroringWi-Fi Bluetooth Wired EthernetPower Consumption Standby Consumption Power Supply Audio Output Power Surround Sound Projection Size BrightnessResolution / Refresh RateColour SpaceContrast Ratio HDR Light Source Laser Life Throw Ratio Chipset20.5” x 12.8” x 6.3” (LxWxH)20.3 lbs23.8” x 15.8” x 11.6” (LxWxH)26.5 lbs 30W (Stereo)Dolby Atmos, Dolby Digital 90”-130” 2200 Lumens 4k @ 60Hz107% BT.20201,000,000:1 (dynamic)HDR10Red + Green + Blue Laser 25,000+ Hours 0.25:10.47” DMD P h y s i c a lP i c t u r eA u d ioP o w e rS m a r t F e a t u r e sC o n n e c t i v i t yHDMIHDMI ARC, CEC USBRF Antenna Ethernet (LAN)Digital Audio Output Analog Audio Output Android TV (Google Certiﬁed)Google Play StoreGoogle AssistantHey Google, Amazon Alexa ChromecastYes, 802.11a/b/g/n/ac (Dual-Band)Yes Yes200W <0.5W AC 120V, 60Hz 2x HDMI 2.11x (eARC on HDMI port 2)1x USB 3.0, 1x USB 2.01x 1x 1x Optical 1xChassis colour Gaming Input Lag Parental Controls Closed Caption Sleep Timer Eye Safety MEMCRemote Finder WiSA Ready RemoteQuick Start Guide / Manual Power Cable Cleaning Kit Slate Grey ~30 ms Yes Yes Yes Yes Yes Yes YesYes, voice remote with backlight QSG in box, Manual online Yes Yes Warranty UPC2 Years 888143012704P o r t s O h t e r F e a t u r e sA c c e s s o r i e sDisney+, Apple TV, Spotify, DAZN, Prime Video, YouTube , PLEXHisense Canada Co., Ltd | 2283 Argentia Rd, Suite 16 | Mississauga ON L5N 5Z2 | 1-855-344-7367 | Image Size90”100”110”120”130”L 10 3/4”12 3/4”14 3/4”16 3/4”19 1/3”H 14”15”16”17“18 3/4”Throw Distance ChartSTANDL | Back of projector to wall/screen H | Top of stand to bottom of image。

CompactPCI+a+Specification标准

P r o p e r t y o f M o t o r o l a F orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d PICMG 2.0 R3.0 CompactPCI® Specification October 1, 1999P r o p e r t y o f M o t o r o l aF o r I n t e r n a l U s e O n l y - E x t e r n a l D i s t r i b u t i o n P r o h i b i t e dP r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te dRelease Note for PICMG 2.0 Revision 3.0 CompactPCI ® Specification October 1, 1999P r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d Purpose This Release Note records some issues raised in the course of developing and balloting PICMG 2.0 Revision 3.0, the CompactPCI core specification. 1. System Management Bus pin assignments . This specification reserves pins on J1/P1 of all slots and J2/P2 of the System Slot for definition as I 2C System Management Busses by PICMG 2.9, CompactPCI System Management Specification. These signals have been tentatively assigned by the PICMG 2.9 as indicated in Section 3.2.7.7 and in Tables 13 through 16 with their notes. The IPMB_SDA pin is an I2C data bus connecting all slots in a backplane. The IPMB_SCL pin is the clock associated with that data line, and the IPMB_PWR pin is a power pin for the IPMB node. The data and clock pins providing System Slot access to platform devices from J2/P2 were designated ICMB_SDA and ICMB_SCL in the draft specification reviewed and adopted by the Executive Membership on October 1, 1999. These signal names are misleading, implying the use of an RS-485 UART bus as specified in the Intel IPMI documents. These signals are designated SMB_SDA and SMB_SCL in the released document. A second System Management power pin, designated ICMB_PWR in the executive draft, was also reserved on J2/P2 of the System Slot. As of the approval of PICMG 2.0 Revision 3.0, the PICMG 2.9 subcommittee is in doubt as to whether this pin will actually be used for power, and is considering assigning a different function to this reserved pin. The released specification accord designates this pin as SMB_RSV. 2. System Slot Hot Swap Signals . This specification designates Pin J1/P1 D15 as a short BD_SEL# (Board Select) signal in agreement with PICMG 2.1, CompactPCI Hot Swap Specification, but only on peripheral slots. The pin is shown as a ground on System Slots. Implementers of CompactPCI boards and systems should anticipate that this signal may also be designated as BD_SEL# on System Slots in PICMG 2.13, CompactPCI Redundant System Slot Specification. J1/P1 Pin B4 is designated as the HEALTHY# signal on System and Peripheral Slots in this specification. ###P r o p e r t y o f M o t o r o l a F orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d PICMG 2.0 R3.0CompactPCI® SpecificationOctober 1, 1999P r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d PICMG 2.0 R3.0 10/1/99ii ©Copyright 1995, 1996, 1997, 1998, 1999 PCI Industrial Computers Manufacturers Group (PICMG).The attention of adopters is directed to the possibility that compliance with or adoption of PICMG ® specifications may require use of an invention covered by patent rights.PICMG ® shall not be responsible for identifying patents for which a license may be required by any PICMG ® specification, or for conducting legal inquiries into the legal validity or scope of those patents that are brought to its attention. PICMG ® specifications are prospective and advisory only. Prospective users are responsible for protecting themselves against liability for infringement of patents.NOTICE:The information contained in this document is subject to change without notice. The material in this document details a PICMG ® specification in accordance with the license and notices set forth on this page. This document does not represent a commitment to implement any portion of this specification in any company's products.WHILE THE INFORMATION IN THIS PUBLICATION IS BELIEVED TO BE ACCURATE, PICMG ® MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL INCLUDING, BUT NOT LIMITED TO ANY WARRANTY OF TITLE OR OWNERSHIP, IMPLIED WARRANTY OF MERCHANTABILITY OR WARRANTY OF FITNESS FOR PARTICULAR PURPOSE OR USE.In no event shall PICMG ® be liable for errors contained herein or for indirect, incidental,special, consequential, reliance or cover damages, including loss of profits, revenue, data or use, incurred by any user or any third pliance with this specification does not absolve manufacturers of CompactPCI equipment, from the requirements of safety and regulatory agencies (UL, CSA, FCC,IEC, etc.).PICMG ®, CompactPCI ®, and the PICMG ® and CompactPCI ® logos are registered trademarks of the PCI Industrial Computers Manufacturers Group.All other brand or product names may be trademarks or registered trademarks of their respective holders.P r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d CompactPCI ® Core Specification PICMG 2.0 R3.0 10/1/99iii Contents1OVERVIEW.........................................................................................................................................91.1C OMPACT PCI O BJECTIVES ................................................................................................................91.2B ACKGROUND AND T ERMINOLOGY ....................................................................................................91.3D ESIRED A UDIENCE ...........................................................................................................................91.4C OMPACT PCI F EATURES .................................................................................................................101.5A PPLICABLE D OCUMENTS ................................................................................................................101.6A DMINISTRATION .............................................................................................................................111.7N AME A ND L OGO U SAGE .................................................................................................................112FEATURE SET..................................................................................................................................132.1F ORM F ACTOR .................................................................................................................................132.2C ONNECTOR .....................................................................................................................................152.3M ODULARITY ...................................................................................................................................162.4H OT S WAP C APABILITY ....................................................................................................................163ELECTRICAL REQUIREMENTS..................................................................................................173.1B OARD D ESIGN R ULES .....................................................................................................................173.1.1Decoupling Requirements......................................................................................................173.1.2CompactPCI Signal Additions...............................................................................................183.1.3CompactPCI Stub Termination..............................................................................................183.1.4Peripheral Board Signal Stub Length ...................................................................................183.1.5Characteristic Impedance......................................................................................................193.1.6System Slot Board Signal Stub Length ..................................................................................193.1.7Peripheral Board PCI Clock Signal Length..........................................................................193.1.8Pull-Up Location...................................................................................................................193.1.9Board Connector Shield Requirements.................................................................................203.2B ACKPLANE D ESIGN R ULES .............................................................................................................213.2.1Characteristic Impedance......................................................................................................213.2.2Eight-Slot Backplane Termination........................................................................................213.2.3Signaling Environment..........................................................................................................223.2.4IDSEL Assignment.................................................................................................................223.2.5REQ#/GNT# Assignment.......................................................................................................233.2.6PCI Interrupt Binding............................................................................................................243.2.7CompactPCI Signal Additions...............................................................................................253.2.8Power Distribution................................................................................................................283.2.9Power Decoupling.................................................................................................................293.2.10Healthy (Healthy#)................................................................................................................303.333 MH Z PCI C LOCK D ISTRIBUTION .................................................................................................303.3.1Backplane Clock Routing Design Rules................................................................................313.3.2System Slot Board Clock Routing Design Rules....................................................................313.464-B IT D ESIGN R ULES ......................................................................................................................313.566 MH Z E LECTRICAL R EQUIREMENTS .............................................................................................333.5.166 MHz Board Design Rules.................................................................................................333.5.266 MHz System Board Design Rules.....................................................................................343.5.366MHz Backplane Design Rules...........................................................................................343.5.466MHz PCI Clock Distribution.............................................................................................343.5.566 MHz System Slot Board Clock Routing Design Rules (35)3.5.666 MHz Hot Swap (35)3.6S YSTEM AND B OARD G ROUNDING (36)3.6.1Board Front Panel Grounding Requirements (36)3.6.2Backplane Grounding Requirements (36)3.7C OMPACT PCI B UFFER M ODELS (36)P r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d PICMG 2.0 R3.0 10/1/99iv 4MECHANICAL REQUIREMENTS................................................................................................374.1B OARD R EQUIREMENTS ...................................................................................................................374.1.13U Boards..............................................................................................................................374.1.26U Boards..............................................................................................................................374.1.3Rear-panel I/O Boards..........................................................................................................374.1.4ESD Discharge Strip.............................................................................................................384.1.5ESD Clip................................................................................................................................384.1.6Cross Sectional View.............................................................................................................394.1.7Component Outline and Warpage.........................................................................................394.1.8Solder Side Cover..................................................................................................................394.1.9Front Panels..........................................................................................................................484.1.10System Slot Identification......................................................................................................494.2R EAR -P ANEL I/O B OARD R EQUIREMENTS .......................................................................................524.2.1Mechanicals...........................................................................................................................524.2.2Power.....................................................................................................................................524.2.3Rear Panel Keying.................................................................................................................534.3B ACKPLANE R EQUIREMENTS ...........................................................................................................534.3.1Connector Orientation...........................................................................................................534.3.2Slot Spacing...........................................................................................................................534.3.3Slot Designation....................................................................................................................544.3.4Bus Segments.........................................................................................................................544.3.5Backplane Dimensions..........................................................................................................545CONNECTOR IMPLEMENTATION.............................................................................................585.1O VERVIEW .......................................................................................................................................585.1.1Location.................................................................................................................................585.1.2Housing Types.......................................................................................................................595.1.3Connector Tail Lengths.........................................................................................................595.1.4Backplane / Board Population Options.................................................................................595.2J1 (32-B IT PCI S IGNALS ).................................................................................................................595.3J2 C ONNECTOR ................................................................................................................................605.3.1Peripheral Slot 64-Bit PCI....................................................................................................605.3.2Peripheral Slot Rear-Panel I/O.............................................................................................605.3.3System Slot 64-bit PCI...........................................................................................................605.3.4System Slot Rear-Panel I/O...................................................................................................605.4B USSED R ESERVED P INS ..................................................................................................................605.5N ON -B USSED R ESERVED P INS .........................................................................................................605.6P OWER P INS .....................................................................................................................................605.75V/3.3V PCI K EYING ......................................................................................................................615.8P IN A SSIGNMENTS PACTPCI BUFFER MODELS...............................................................................................69B.CONNECTOR IMPLEMENTATION.............................................................................................73B.1G ENERAL .........................................................................................................................................73B.2C ONNECTORS ...................................................................................................................................73B.3A LIGNMENT .....................................................................................................................................73B.3.1Front Plug-In Board Alignment............................................................................................73B.3.2Rear Panel I/O Board Alignment..........................................................................................74B.3.3Backward Compatibility for Rear Panel I/O Boards. (74)P r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d CompactPCI ® Core Specification PICMG 2.0 R3.0 10/1/99v TablesT ABLE 1. C ODING K EY C OLOR A SSIGNMENTS ..............................................................................................15T ABLE 2. B OARD D ECOUPLING R EQUIREMENTS ...........................................................................................17T ABLE 3. S TUB T ERMINATION R ESISTOR ......................................................................................................18T ABLE 4. B OARD C HARACTERISTICS .............................................................................................................19T ABLE 5. P ULL -UP R ESISTOR V ALUES ...........................................................................................................20T ABLE 6. B ACKPLANE C HARACTERISTICS .....................................................................................................21T ABLE 7. S YSTEM TO L OGICAL S LOT S IGNAL A SSIGNMENTS ........................................................................23T ABLE 8. S YSTEM TO L OGICAL S LOT I NTERRUPT A SSIGNMENTS ..................................................................24T ABLE 9. P HYSICAL S LOT A DDRESSES ..........................................................................................................27T ABLE 10. P OWER S PECIFICATIONS ...............................................................................................................28T ABLE 11. B ACKPLANE D ECOUPLING R ECOMMENDATIONS ..........................................................................30T ABLE 12. C ODING K EY C OLOR A SSIGNMENTS AND P ART N UMBERS ...........................................................61T ABLE 13. C OMPACT PCI P ERIPHERAL S LOT 64-B IT C ONNECTOR P IN A SSIGNMENTS ...................................62T ABLE 14 C OMPACT PCI P ERIPHERAL S LOT R EAR -P ANEL I/O C ONNECTOR P IN A SSIGNMENTS ....................63T ABLE 15. C OMPACT PCI S YSTEM S LOT 64-BIT C ONNECTOR P IN A SSIGNMENT .............................................64T ABLE 16. C OMPACT PCI S YSTEM S LOT R EAR -P ANEL I/O C ONNECTOR P IN A SSIGNMENTS ..........................65T ABLE 17. R EVISION H ISTORY . (67)P r o p e r t y o f M o t o r o l a F o r I n t e r n a l U s e O n l y - E x t e r n a l D i s t r i b u t i o n P r o h i b i t e d PICMG 2.0 R3.0 10/1/99vi This page is left intentionally blank.P r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d CompactPCI ® Core Specification PICMG 2.0 R3.0 10/1/99vii IllustrationsF IGURE 1. 3U 64-B IT C OMPACT PCI F ORM F ACTOR ......................................................................................13F IGURE 2. 3U C OMPACT PCI B ACKPLANE E XAMPLE .....................................................................................14F IGURE 3. PCI S IGNAL T ERMINATION ...........................................................................................................22F IGURE 4. L OCAL 64 B IT I NITIALIZATION ......................................................................................................33F IGURE 5. ESD C LIP L OCATION ....................................................................................................................39F IGURE 6. 3U B OARD ....................................................................................................................................40F IGURE 7. 6U B OARD ....................................................................................................................................41F IGURE 8. F RONT S IDE B OARD ESD D IMENSIONS .........................................................................................42F IGURE 9. 3U R EAR -P ANEL I/O B OARD D IMENSIONS ...................................................................................43F IGURE 10. 6U R EAR P ANEL I/O B OARD D IMENSIONS ..................................................................................44F IGURE 11. R EAR P ANEL I/O ESD D IMENSIONS ...........................................................................................45F IGURE 12. C ROSS S ECTIONAL B OARD , C ONNECTOR , B ACKPLANE AND F RONT P ANEL V IEW ......................46F IGURE 13. C OMPONENT O UTLINE ................................................................................................................47F IGURE 15. C OMPACT PCI C OMPATIBILITY G LYPHS ......................................................................................48F IGURE 16. C OMPACT PCI L OGO ...................................................................................................................48F IGURE 17. 3U EMC F RONT P ANEL ..............................................................................................................50F IGURE 18. 6U EMC F RONT P ANEL ..............................................................................................................51F IGURE 19. 3U B ACKPLANE E XAMPLE - F RONT V IEW ..................................................................................53F IGURE 20. 3U B ACKPLANE D IMENSIONS .....................................................................................................56F IGURE 21. 6U B ACKPLANE D IMENSIONS .....................................................................................................57F IGURE 22. 3U C ONNECTOR I MPLEMENTATION ............................................................................................58F IGURE 23. 6U C ONNECTOR I MPLEMENTATION ............................................................................................58F IGURE 24. 5V S TRONG PCI M ODEL ............................................................................................................69F IGURE 25. 5V W EAK PCI M ODEL ...............................................................................................................70F IGURE 26. 3.3V S TRONG PCI M ODEL .........................................................................................................70F IGURE 27. 3.3V W EAK PCI M ODEL (71)P r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d PICMG 2.0 R3.0 10/1/99viii This page is left intentionally blank.P r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d 1. Overview CompactPCI ® Core Specification PICMG 2.0 R3.0 10/1/99Page 9 of 741 Overview 1.1 CompactPCI Objectives CompactPCI is an adaptation of the Peripheral Component Interconnect (PCI)Specification 2.1 or later for industrial and/or embedded applications requiring a more robust mechanical form factor than desktop PCI. CompactPCI uses industry standard mechanical components and high performance connector technologies to provide an optimized system intended for rugged applications. CompactPCI provides a system that is electrically compatible with the PCI Specification, allowing low cost PCI components to be utilized in a mechanical form factor suited for rugged pactPCI is an open specification supported by the PICMG (PCI Industrial Co m-puter Manufacturers Group), which is a consortium of companies involved in utiliz-ing PCI for embedded applications. PICMG controls this specification.1.2 Background and Terminology Eurocard - A series of mechanical board form factor sizes for rack-based systems as used in VME, Multibus II, and other applications defined by the Institute of Electri-cal and Electronics Engineers (IEEE) and International Electrotechnical Committee (IEC).ISA - Industry Standard Architecture. A specification by which Personal Com puters (PCs) add boards.PCI - Peripheral Component Interconnect. A specification for defining a common in-terconnect between logic components. Typically used for interconnecting high-speed,PC-compatible chipset components. The PCI specification is issued through the PCI Special Interest Group (PCI SIG).This specification utilizes several key words, which are defined below:may : A key word indicating flexibility of choice with no implied preference.shall : A key word indicating a mandatory requirement. Designers shall im-plement such mandatory requirements to ensure interchangeability and to claim conformance with the specification.should: A key word indicating flexibility of choice with a strongly preferred implementation.1.3 Desired AudienceCompactPCI exists to provide a standard form factor for those applications requiring the high performance of PCI as well as the small size and ruggedness of a rack mount system. CompactPCI provides a mechanism for OEM and end users to di-rectly apply PCI components and technology to a new mechanical form factor while。

AXIS P3719-PLE 网络摄像头：15 MP 多方向摄像头，四个矫正焦距的 Quad HD

AXIS P3719-PLE Network Camera15MP multidirectional camera with IR for360°coverageAXIS P3719-PLE Network Camera is a compact15-megapixel camera with four varifocal lenses(4x Quad HD)enabling overview and detailed surveillance.With one IP address and one network cable,the four-cameras-in-one unit provides a flexible,cost-effective solution for multidirectional surveillance.360°IR illumination and WDR provides excellent video quality in any light conditions.Each camera head can be individually positioned(pan,tilt,roll,and twist)along a circular track.Remote zoom and focus makes it easy to install and the clear cover,with no sharp edges,ensures undistorted views in all directions.The camera has an integrated weathershield.>15MP,360°coverage with one IP address>360°IR illumination>Compact,flexible and discreet>Remote zoom and focus>ZipstreamDatasheetAXIS P3719-PLE Network Camera CameraImage sensor4x1/2.5”progressive scan RGB CMOSLens Varifocal,3–6mm,F1.8–2.64x1440p capture mode:Horizontal field of view:101°–49°Vertical field of view:54°–29°Diagonal field of view:116°–58°Motorized focus,motorized zoomDay and night Automatically removable infrared-cut filterMinimum illumination Color:0.20lux at50IRE F1.8B/W:0.04lux at50IRE F1.8,0lux with IR illumination onShutter speed1/66500s to1/5s with50/60HzCamera angleadjustmentPan±90°,tilt+25to+95°,rotation–5to+95°,twist±20°System on chip(SoC)Model S5Memory2048MB RAM,512MB FlashVideoVideo compression H.264(MPEG-4Part10/AVC)Main and High Profiles H.265(MPEG-H Part2)Resolution4x2560x1440(4x Quad HD)to4x640x360Frame rate Up to25/30fps(50/60Hz)Video streaming Multiple,individually configurable streams in H.264and H.265Axis Zipstream technology in H.264and H.265Controllable frame rate and bandwidthVBR/ABR/MBR H.264Image settings Saturation,contrast,brightness,sharpness,WDR,white balance, exposure control,rotation:0°,90°,180°,270°including CorridorFormat,dynamic text and image overlay,polygon privacy mask,compressionAudioAudio input/output Two-way audio connectivity via optional AXIS T61Audio and I/O Interfaces with portcast technologyA30W midspan or higher between AXIS T61Audio and I/O Interfaces and AXIS P3719-PLE is required.NetworkIP address One IP address for all channelsNetwork protocols IPv4,IPv6USGv6,ICMPv4/ICMPv6,HTTP,HTTP/2,HTTPS,TLS,QoS Layer3DiffServ,FTP,CIFS/SMB,SMTP,mDNS(Bonjour),UPnP TM, SNMP v1/v2c/v3(MIB-II),DNS/DNSv6,DDNS,NTP,NTS,RTSP, RTP,SRTP/RTSPS,SFTP,TCP,UDP,IGMPv1/v2/v3,RTCP,ICMP, DHCPv4/v6,ARP,SSH,LLDP,CDP,MQTT v3.1.1,Secure syslog (RFC3164/5424,UDP/TCP/TLS),Link-Local address(ZeroConf)System integrationApplication Programming Interface Open API for software integration,including VAPIX®and AXIS Camera Application Platform;specifications at One-click cloud connectionONVIF®Profile G,ONVIF®Profile M,ONVIF®Profile S and ONVIF®Profile T,specification at Event triggers Detectors,hardware,input signal,storage,system,time,analytics,edge storage eventsMQTT subscribeEvent actions Day/night vision mode,overlay text,record video,send images, send notification,send SNMP trap,send video clip,status LEDFile upload:FTP,HTTP,HTTPS,network share,SFTP and emailNotification:email,HTTP,HTTPS,TCP and SNMP trapMQTT publishData streaming Event dataBuilt-ininstallation aidsPixel counter,remote focus,remote zoomAnalyticsApplications IncludedAXIS Motion Guard,AXIS Fence Guard,AXIS Loitering GuardAXIS Video Motion Detection,active tampering alarmSupport for AXIS Camera Application Platform enablinginstallation of third-party applications,see /acap CybersecurityEdge security Software:Signed firmware,brute force delay protection,digest authentication,password protectionNetwork security IEEE802.1X(EAP-TLS),HTTPS/HSTS,TLS v1.2/v1.3,Network Time Security(NTS),X.509Certificate PKI,IP address filtering Documentation AXIS OS Hardening GuideAxis Vulnerability Management PolicyAxis Security Development ModelAXIS OS Software Bill of Material(SBOM)To download documents,go to /support/cybersecu-rity/resourcesTo read more about Axis cybersecurity support,go to/cybersecurityGeneralCasing IP66-,IP67-,NEMA4X-rated,IK09impact-resistant,aluminium and plastic casing with polycarbonate hard-coated dome,sunshield(PC/ASA)Color:white NCS S1002-BFor repainting instructions of casing and impact on warranty,contact your Axis partner.Mounting Mounting bracket with junction box holes(double gang box,single gang box,4”octagon junction box and4”square junctionbox)½”(M20)conduit side entry¾”(M25)conduit adapter includedSustainability PVC freePower Power over Ethernet(PoE)IEEE802.3at Type2Class4IR illumination on:class4,typical16.3W,max25.5WIR illumination off:class3,typical10.7W,max25.5W Connectors Shielded RJ4510BASE-T/100BASE-TX/1000BASE-T PoEAudio and I/O connectivity via AXIS T61Audio and I/O Interfaceswith portcast technology.IR illumination Four individually controllable IR with power-efficient,long-life850nm IR LEDsRange of reach15m(50ft)or more depending on the scene Storage Support for microSD/microSDHC/microSDXC cardDual SD cardsSupport for SD card encryption(AES-XTS-Plain64256bit)Support for recording to network-attached storage(NAS)For SD card and NAS recommendations see Operatingconditions-30°C to50°C(-22°F to122°F)Humidity10–100%RH(condensing)Maximum temperature according to NEMA TS2(2.2.7):74°C(165°F)Storageconditions-40°C to65°C(-40°F to149°F)Approvals EMCEN55032Class A,EN50121-4,IEC62236-4,EN61000-3-2,EN61000-3-3,EN55024,EN61000-6-1,EN61000-6-2,FCC Part15Subpart B Class A,ICES-003Class A,VCCI Class A,RCM AS/NZS CISPR32Class ASafetyIEC/EN/UL62368-1,IEC/EN/UL60950-22,IS13252,IEC62471EnvironmentIEC60068-2-1,IEC60068-2-2,IEC60068-2-6,IEC60068-2-14,IEC60068-2-27,IEC60068-2-78,IEC/EN60529IP66/67,IEC/EN62262IK09,NEMA250Type4X,NEMA TS2(2.2.7-2.2.9)NetworkNIST SP500-267Dimensions Height:91.5mm(3.6in)ø255mm(10.04in)Weight 2.0kg(4.4lb)IncludedaccessoriesRJ45mounting tool,screw bit TR20,Installation guide,Windows®decoder1-user licenseOptionalaccessoriesAXIS T94N01D Pendant KitAXIS T94N01L Recessed MountAxis mounts and cabinetsFor more accessories,see Video management software AXIS Companion,AXIS Camera Station,video managementsoftware from Axis’Application Development Partners availableon /vmsLanguages English,Simplified Chinese,Traditional Chinese,Dutch,Czech,Swedish,Finnish,Turkish,Thai,Vietnamese,French,German,Italian,Japanese,Korean,Polish,Portuguese,Russian,SpanishWarranty5-year warranty,see /warranty©2018-2023Axis Communications AB.AXIS COMMUNICATIONS,AXIS,ARTPEC and VAPIX are registered trademarks ofAxis AB in various jurisdictions.All other trademarks are the property of their respective owners.We reserve the right tointroduce modifications without notice.T10134016/EN/M31.2/2310。

光电词汇

photomixing 光混频
photomixing device 光源频器
photomixing technique 光混频技术
photomodulator 光调制器
photomontage (1)光片剪辑(2)合成照片
photomosaic 感光镶嵌幕
photomotion 光激活动
photolysis 光解作用
photolyte 光解质
photolytic 光解的
photom 光度学
photomacrogaph 宏观照片
photomagnetic 光磁的
photomagnetic effect 光磁效应
photomagnetoelectric 光磁电的
photomagnetoelectric effect 光磁电效应
photomap 空中摄影地图
photomask 光掩模
photomask materials 光罩材料
photoห้องสมุดไป่ตู้ation 自体摄印相机
photomatrices 光矩阵
photomechanical 光学机械的
photometallic etching 光金属蚀刻
photometallurgical microscope 金相摄影显微镜
photometeor 发光陨星
photometer 光度计
photometer bench 光度计座
photometer head 光度计头
photometers 光度计
photometric 光度的
photometric brightness 光亮度
photometric brightness scale 光亮度标

怎样用photoshop CS制作一寸照片

怎样用photoshop CS制作一寸照片[1寸的是3.5x2.3cm][2寸的是5x3.5cm]我们用一寸相片做例子首先新建一个3.5X2.3厘米的文件分辨率300像素每英寸。

然后将人像拖到该文件中用移动工具（在英文输入法状态下按键盘上的v键。

之后点住人像拖到新建的画布中并调整好位置及大小）。

ctrl+t变换到合适大小（这个小是调整好大小的，注意：人像不能变形，你在放大缩小时按住键盘上的shift键，保持住人像的比例）。

调整好人像颜色用ctrl+m出来一个曲线调板，你点斜线的中间，往上调或往下调，看看图像亮了就好了。

如果图像偏色就点通道中的颜色。

你搞几下就能明白曲线工具的原理了）。

主要用眼看，注意不能太暗了。

人像要求一般比较亮丽一点。

OK调整人像差不多了，就按一下键盘上的c键（在英文输入法状态下）从左上角拉一个框一下到右下角。

然后按回车。

然后新建一个a4纸大小的文件：21X29.7厘米分辩率300像素每英寸。

然后将那个做好的人像拖过来。

然后点视图－－新建辅助线－－数值为2厘米。

然后再新建一个辅助线点横线选项数值也为2厘米。

然后把人像拖到两条辅助线相交的右下角。

然后按键盘上的alt 键不松按住鼠标向右拖，就会变成两张人像。

然后放大一下画布。

ctrl+空格放大后调整好两张人像的距离。

然后再按alt+鼠标拖动，复制出第三个人像。

并调好位置。

按住空格键时是拖动画布。

如果想缩小画布就按ctrl+alt+空格加鼠标点击。

同样你复制出多个人像进行排列打印。

如果想放多个人像，就新建一个一相片大小的文件，然后将人物放到里面。

再拖到这个a4纸里。

全部调整好后就打印吧。

智能修复让瑕疵瞬间消失photoshop的使用技巧

智能修复让瑕疵瞬间消失photoshop的使用技巧智能修复让瑕疵瞬间消失：Photoshop的使用技巧随着科技的不断进步和数字图像处理软件的发展，Photoshop已经成为广大摄影师、设计师和艺术家们必备的工具之一。

它拥有众多强大的功能，其中之一就是智能修复，能够帮助我们迅速、准确地修复照片中的瑕疵。

在本文中，我们将探讨一些Photoshop中智能修复工具的使用技巧，帮助您更好地修复照片中的瑕疵。

1. 克隆修复工具（Clone Stamp Tool）克隆修复工具是Photoshop中最基本的修复工具之一。

它可以复制选定区域的像素，并将其应用于其他区域，从而达到修复瑕疵的目的。

使用克隆修复工具修复瑕疵时，您可以通过调整画笔的大小和硬度来适应不同的修复需求。

在使用克隆修复工具时，您应该选择一个与瑕疵周围颜色和纹理相匹配的区域进行克隆修复，以获得更自然的修复效果。

2. 修复画笔工具（Healing Brush Tool）修复画笔工具是另一个常用的修复工具。

与克隆修复工具不同，修复画笔工具可以根据选定区域的颜色、纹理和亮度等信息，智能地修复瑕疵。

它采用采样点的平均信息来修复选定区域，使修复后的照片更加平滑和自然。

修复画笔工具可以根据您的需要进行细微的调整，例如调整画笔的硬度、采样点的大小和修复的透明度等。

3. 红眼修复工具（Red Eye Tool）红眼是拍摄人物照片时常见的问题之一。

但不用担心，在Photoshop中有一个方便的工具可以帮助您快速修复红眼问题。

红眼修复工具可以智能地识别图像中的红眼，并通过调整颜色和亮度来修复。

使用红眼修复工具时，只需点击红眼区域，Photoshop会自动检测并修复。

4. 光斑修复工具（Spot Healing Brush Tool）光斑修复工具是Photoshop中一种非常便捷的修复工具。

它可以根据选定区域周围的颜色和纹理，自动修复照片中的光斑瑕疵。

光斑修复工具适用于修复小面积的瑕疵和瑕疵区域边缘和背景色彩较为简单的照片。

快速修复瑕疵 Photoshop克隆和修复工具的应用

快速修复瑕疵：Photoshop克隆和修复工具的应用Photoshop是一款功能强大的图像编辑软件，广泛被用于修复和编辑照片。

其中，克隆和修复工具是修复瑕疵的重要利器。

本教程将教您如何利用Photoshop的克隆和修复工具快速修复瑕疵。

一、克隆工具的使用克隆工具能够复制选定区域的样本，并把它应用到目标区域，以达到修复瑕疵的效果。

1. 打开Photoshop软件并载入需要修复的照片。

2. 选择工具栏上的克隆工具（Clone Stamp Tool），或按快捷键“S”来切换到克隆工具。

3. 在选项栏中，调整克隆工具的刷子大小和硬度，以适应修复区域的大小和纹理。

一般来说，对于小面积的修复，选择较小的刷子；对于大面积的修复，选择较大的刷子。

4. 按住“Alt”键，点击鼠标左键来选取一个样本点。

这个样本点将作为修复的来源。

5. 松开“Alt”键，将鼠标移到需要修复的区域，点击鼠标左键开始修复。

克隆工具会根据选取的样本点复制纹理，并将其应用到目标区域。

6. 重复选择样本点和修复的过程，直到完成修复。

二、修复工具的使用修复工具包括修复画笔（Healing Brush）和修补补丁（Patch Tool），能够智能地修复瑕疵，使修复后的效果更加自然。

1. 选择工具栏上的修复画笔（Healing Brush），或按快捷键“J”来切换到修复画笔。

2. 在选项栏中，调整修复画笔的大小和硬度，以适应修复区域的大小和纹理。

3. 按住“Alt”键，点击鼠标左键来选取一个样本点。

这个样本点将作为修复的依据。

4. 松开“Alt”键，将鼠标移到需要修复的区域，点击鼠标左键开始修复。

修复画笔会自动根据选取的样本点进行修复。

5. 对于较难修复的瑕疵，可以使用修补补丁工具（Patch Tool）。

6. 选择工具栏上的修补补丁工具，或按快捷键“J”来切换到修补补丁工具。

7. 拖动鼠标选择瑕疵区域，然后将其拖动到合适的样本区域。

修补补丁工具会智能地将选取的样本区域与瑕疵区域进行匹配，实现修复效果。

SIGMA Photo Pro 说明书

警告 !!
請不要將本產品內附之光碟放在音頻光碟播放器內。如使用本產品內附之光碟放在音樂光碟播放器內，並利用耳筒聆聽，可能令聽力受損。而使用本產品內附之光碟放在音樂光碟播放器內，亦可能令喇叭損壞。
請閣下嚴謹地使用本數碼相機拍攝照片，請勿使用任何方式以觸犯國際及本地版權法例及規條。另外，本產品純供個人拍攝用途。在攝影陳列、論証示範、商業性展覽時，必需遵守其版權及法定權上的守則。
在 SIGMA Photo Pro 以外重新命名 ..............................................................19
5.5 選取圖像
19
選擇單一圖像 ................................................................................................19
iii
目錄
在主視窗內用幻燈片展示觀看圖像。 ........................................................21
6
圖像檢視
22
6.1 檢視視窗
23
開啟檢視視窗 ................................................................................................23
從充電池轉換至 AC 交流電 (SD9/SD10) .....................................................11
當軟件在運行中連接相機 (SD9/SD10).........................................................11

惠普电脑说明书

入门指南HP 产品和服务的所有保修限于这些产品与服务所附带的明确声明。

本文的任何条款都不应视作构成保修声明的附加条款。

HP不对本文的技术性错误、编印错误或冗长负任何责任。

对于在非HP 提供的设备上 HP 软件的使用和可靠性，HP 概不负责。

本文档包含的所有权信息均受版权保护。

未经 HP 事先书面许可，不得将本文档的任何部分影印、复制或翻译成其他语言。

在使用此版权保护技术之前必须得到Macrovision 公司的授权，且只能作为家用和其他受限的观赏用途，除非得到 Macrovision 公司的授权才能另作他用。

禁止反编译。

根据美国专利号 4,631,603、4,577,216、4,819,098 和 4,907,093 的许可要求，与之相关的产品只能作为受限观赏用途。

Microsoft 和 Windows 是 Microsoft Corporation 在美国的注册商标。

Apple、iTunes、FireWire 和 iPod 是 Apple Computer, Inc. 在美国和其他国家/地区的注册商标。

FireWire 徽标是 Apple Computer, Inc. 的商标。

HP 支持科技产品在法律允许范围内的使用，我们不认可、也不鼓励我们的产品被用于著作权法所不允许的目的。

本文档中的内容可随时更改，恕不另行通知。

目录安装电脑 (1)组装电脑 (1)连接到电脑 (2)首次启动您的电脑 (3)建立并连接到您的 Internet 帐户 (4)安装软件和硬件设备 (5)使用 HP 产品 (5)将旧电脑中的信息和文件转移到新电脑中 (5)使用桌面图标 (6)使用 HP Organize 软件 (6)使用键盘 (7)自定义键盘按钮 (9)使用电脑机箱顶部 (11)使用支撑架 (11)设置声音 (15)使用扬声器 (15)设置 3 接口的声音 (16)为 DVD 播放机设置多声道音频输出 (18)设置 6 接口的声音 (18)确定音频配置软件 (20)使用 Sound Effect Manager（6 接口） (20)使用 Sound Effect Manager（6接口）配置扬声器 (20)配置声音以使用 Sound Effect Manager 录音（6接口） (21)使用 Realtek HD Sound Effect Manager（6 接口、多音源音频） (23)配置 Realtek HD Sound Effect Manager（6 接口、多音源音频） (23)使用 Realtek HD Sound Effect Manager（6 接口、多音源音频）配置用于录音的声音设置 (24)目录v使用 Realtek HD Sound Effect Manager（6 接口、多音源音频）重新定义音频接口 (24)配置多音源音频（6 接口、多音源音频） (24)设置多音源音频 (26)使用读卡器 (29)使用读卡器 (29)媒体插入指南 (30)使用安全删除硬件实用程序 (32)将电视用作显示器 (33)确认您可能用到的电缆 (33)连接到电视机 (33)在电视屏幕上观看电脑画面 (34)nView 选项卡 (35)Ge Force 选项卡 (35)显示选项卡 (36)禁用电视选项 (36)nView 选项卡（禁用） (37)Ge Force 选项卡（禁用） (37)显示选项卡（禁用） (37)断开与电视的连接 (38)使用 HP Personal Media Drive (39)连接硬盘驱动器 (39)插入硬盘驱动器 (40)定位硬盘驱动器并为之分配一个盘符 (41)使用硬盘驱动器 (42)断开硬盘驱动器 (43)处理数码图像 (45)处理数码图像 (45)使用 HP Image Zone (45)播放 CD 和 DVD (49)用 iTunes 播放音乐 CD (49)用 Windows Media Player 播放 CD 和 DVD (50)使用 InterVideo WinDVD 播放 DVD 影片 (50)使用国家/地区编码 (52)使用 InterVideo WinDVD 播放 VCD（影碟） (52)使用 Windows Media Player 播放 VCD（影碟） (53)vi入门指南制作音频和数据光盘 (55)刻录前请擦除光盘上的内容 (56)制作音频 CD (56)验证是否音频文件刻录无误 (57)音频 CD 提示 (57)制作音频 CD (58)制作 jukebox 光盘 (58)制作数据 DVD 和 CD (59)验证数据光盘刻录是否无误 (59)数据光盘提示 (60)制作数据光盘 (60)复制 DVD 或 CD (61)将文件归档至 CD 或 DVD (62)处理映像文件 (62)制作映像文件 (63)从映像文件进行烧录 (63)使用 LightScribe 制作光盘标签 (63)Lightscribe 需求 (64)使用 Sonic Express Labeler 烧录 LightScribe 标签 (64)使用 iTunes 烧录后刻录 LightScribe 标签 (65)使用胶粘光盘标签 (66)兼容性信息 (66)光盘特性及兼容性图表 (67)光驱快速参考图表 (68)软件快速参考图表 (69)制作视频光盘和影片 (71)开始捕获影片之前 (71)Sonic MyDVD Video 项目 (72)制作视频项目 (72)添加将文件到视频项目 (73)为视频项目捕获视频 (73)将幻灯片添加到视频项目 (74)将子菜单添加到视频项目 (74)编辑视频项目的样式 (75)编辑影片文件 (75)将视频项目刻录到光盘 (76)使用 Direct-to-Disc 向导制作视频项目 (77)视频质量和光盘尺寸 (78)DVD 刻录时间 (79)目录vii使用 muvee autoProducer 制作影像 (81)制作影像的基本步骤 (81)查找 muvee autoProducer (82)使用 muvee autoProducer (83)入门 (83)从数码视频摄像机截取影像 (84)加入影像 (85)加入图片 (86)加入音乐 (86)选择风格 (87)更改设置 (87)加入开场标题和结束署名 (88)制作影像 (89)保存影像项目 (89)将影像项目刻录到光碟 (90)获取帮助 (91)查找联机指南 (91)从网络上查找指南 (91)使用联机的“帮助和支持中心” (92)使用 HP 更新信息 (92)获取信息 (92)关闭消息 (93)重新激活消息 (93)使用 PC 帮助和工具 (93)索引 (95)viii入门指南安装电脑警告：安装电脑并将其连接到电源之前，请阅读《保修和支持指南》中的“安全信息”。

Photo Editor 01的图像处理实践

Photo Editor 01的图像处理实践随着数字媒体技术的发展，图像处理技术成为了一种热门的技术领域。

图像处理可以将原始图像转化为更加美观、合适的图片，从而达到艺术创作、信息展示和数据分析等多种目的。

而在图像处理领域，Photo Editor 01作为一款优秀的图像处理软件，在其图像处理实践中发挥着重要作用，本文就将从软件背景、功能特点和实际应用三个方面进行介绍和分析。

一、软件背景Photo Editor 01是一款专业的图像处理软件，由日本AIR社开发。

AIR社专注于图像处理领域的技术研究和应用，Photo Editor 01也是该公司倾力打造的一款高端软件。

面向广大用户，该软件被设计为易于上手、操作流畅、功能丰富的图像处理软件。

二、功能特点1.基本调整功能Photo Editor 01提供了诸如“明度”、“对比度”、“饱和度”等基本调整功能，让用户可以快速调整图片的亮度、对比度和饱和度，打造出更优美的图像。

此外，该软件还可以进行色彩管理和纠正颜色偏差。

2.美肤美白另外一个独特的功能是美肤美白，该软件内嵌了丰富的肤色护理功能，可以帮助用户进行肤色平衡调整，淡化黑眼圈和瑕疵，并进行磨皮平滑美白等处理。

3.特效功能Photo Editor 01还提供了多种特效功能，如滤镜、调色板、背景切换，可以让用户轻松制作出独特美观的图片。

4.照片排版编辑用户可以随意调整图片的大小和位置。

软件内置有多款排版模板，可以让用户按需选择不同排版效果，添加字体、图片、贴图等多种元素来制作独具一格的图片。

三、实践应用Photo Editor 01的应用广泛，可以用于多种场合的图片处理，如产品宣传、广告设计、婚庆摄影等。

1.图片宣传营销在产品宣传中，Photo Editor 01可以帮助用户制作具有吸引力的产品图片，让用户的产品在众多竞争对手中脱颖而出，并吸引更多潜在消费者的注意力。

该软件可以快速进行图片的处理和编辑，制作出衣物的模特照、美食的食物照、美容的试用照等，从而提高产品的宣传效果。

photoshape球极投影矫正原理

photoshape球极投影矫正原理
PhotoShape球极投影校正原理基于球极投影的原理。

球极投影是一种将地球表面的经纬度坐标系投影到一个球体上的投影方式，使地球的每个点都映射为球体上的一个点。

球极投影校正原理的基本思想是，通过对球面上的每个点进行逆变换，将球面上的点映射回地球表面的经纬度坐标系。

该逆变换旨在纠正球极投影过程中引入的畸变。

具体来说，球极投影校正分为两个步骤：反投影和重采样。

1. 反投影：对于球极投影图像中的每个像素点，根据其在球面上的位置，计算其对应的经纬度坐标。

这个过程使用球极投影的逆变换公式来实现。

2. 重采样：根据计算得到的经纬度坐标，重新映射回地球表面的经纬度坐标系。

这个过程中可能需要进行插值和滤波等操作，以获取更加平滑和准确的校正结果。

通过球极投影校正原理，可以将球极投影图像校正为地球表面的经纬度坐标系图像，从而消除球极投影引入的畸变，使图像更加符合真实地理位置。

这对于地图制作、遥感图像处理等应用具有重要意义。

使用PhotoPrint制作ICC

使用PhotoPrint制作ICC1、打开MonacoProfiler4.8中文版中文版2、选择“输出”，创建输出设备ICC文件文件3、打印机类型选择CMYK，下面线性化选中勾起，下面线性化选中勾起4、点击下一步，选择测量设备点击下一步，选择测量设备5、媒体（介质）大小选择（A4），步进数量（最佳40步骤），保存为TIFF格式文档格式文档6、打开PhotoPRINT SERVER-PRO7、通过“设置”——“添加设备”来添加打印机通过“设置”——“添加设备”来添加打印机8、打开“设置”——“缺省设置属性”，根据需求进行设置，执行颜色校正前面的勾去掉，根据需求进行设置，执行颜色校正前面的勾去掉9、添加作业，添加作业，找到刚刚在找到刚刚在找到刚刚在（第（第5）MonacoProfiler 里存储的线性化色块，里存储的线性化色块，右键点击发送或者右键点击发送或者点击菜单里的打印机图标，打印输出该色块图点击菜单里的打印机图标，打印输出该色块图10、回到Monacoprofiler 软件里，把打印出来的线性化色块用仪器读取出来软件里，把打印出来的线性化色块用仪器读取出来11、点击下一步，选择介质大小、色块数量、不规则排列，高级选项里，根据实际情况来控制合适的墨量大小，最后存储色块为TIFF文档文档12、在PhotoPRINT SERVER-PRO 里和第9一样的设置情况下，输出该TIFF 文档文档13、再回到Monacoprofiler 软件，软件，把打印好的色块读取出来，把打印好的色块读取出来，把打印好的色块读取出来，最后生成最后生成ICC 文件，文件，记得记得命名！接着把生成的ICC 文件拷贝到PhotoPRINT SERVER-PRO 根目录下的ICCProfile\对应的打印机目录下或者在软件执行色彩校正的下拉菜单里选择添加该ICC 文件即可！14、然后在加载该ICC的情况使用PhotoPRINT SERVER-PRO输出即可！输出即可！。

框胶MSDS

Date prepared: May/05/2008Date revised:M ATERIAL S AFETY D ATA S HEETManufacturerShiga-Minakuchi Plant, Sekisui Chemical Co., Ltd.1259 Izumi, Minakuchi-tyo Koka-City, Shiga Pref.Section in charge: Fine Chemicals Production Dept.Tel.: +81-(0)748-62-7110, Fax: +81-(0)748-62-9618Emergency Contact: Fine Chemicals Production Dept.Tel.: +81-(0)748-62-7110, Fax: +81-(0)748-62-9618Draw up : Shigeru Tanaka Belong : Q.A. Section. Fine Chemicals Production Dept. [Product] Photolec S-WB38(Trial product No. SUR-8D2)Product Description and IdentityNature of Composition: MixtureChemical Designation: Formulated compoundComponents[Composition] [Component Name] [Content] [ CAS No.]A Resin Acryl-Epoxy 60～80% Secret on businessB Hardener Amine 1～5% Secret on businessC Filler Silicate 10～30% Secret on businessD Additive Silane 1～5% Secret on businessAcryl particle 10～15% Secret on businessE Photo Initiator Acetophenone 1～5% Secret on businessTotal 100%Hazard ClassificationClass of hazard: Not applicable to the classification standard.Fire hazard: Combustible but not explosiveHealth hazard: It may cause rash of skin on contact.Environmental Effect: Effect of the product is not known.First AidWhen gets in eye: Immediately and thoroughly wash the eye with flowing waterand consult with an ophthalmologist.When clings to skin: Wash the compound off with water and soap.If inflammation takes place, seek a physician’s counsel.When inhaled: Gargle with water. If a person feels sick, put him/her to freshair and keep him/her in rest.When swallowed:Compel to drink much water and vomit(If necessary, consult a doctor)Fire Fighting ProcedureExtinguishing method: Eliminate the source of fire, and extinguish the fire usingappropriate agents, standing to the windward of fire. Extinguishing agents: Powder, Foam or Carbon Dioxide.Actions for Leak or SpillMethod of removal: Use waste rug and saw dust to remove the spilt product.and incinerate the recovery.Handling and Storage InstructionHandlingTake caution not to inhale. Wear long sleeve protective clothing, gloves(rubber), protective mask and glasses, to prevent contacting with skin or eyes.Provide air ventilation and UV-filtered lighting.StorageSuitable storage conditions:Store the product in good order in the pre-determined place.The product should be kept in a cool, dark place (under -10℃) in tightly closed containers, since it is reactive to light and heat.Mixed prohibition substanceAvoid mixture with strong oxidizer, strong Lewis base, strong inorganic acid, strong inorganic base(especially primary or secondary aliphatic amine).Prevention of Human Exposure to the ProductControl concentration: Not regulated.Permissible concentration: N ot known.Accommodation: Local exhaust devices and UV-filtered lighting for indoorworking space.Protective wears:For breathing: Dust mask .For hands: Gloves( rubber).For eyes: Protective glasses.For skin and body: Long sleeve working clothes (to prevent direct contact).Physical and Chemical PropertiesAppearance: Milky white high viscosity paste.Odor Few pungent smellSpecific gravity: 1.3Melting point: No data.Boiling point: No data.Solubility: No dataFire Hazard InformationFlash point: More than 240o C.Ignition point: Unknown.Explosion limit: Unknown.Ignition nature (self-ignition, Reaction with water): Not observedOxidation stability: StableReactivity: Reactive to heat and light.Health Hazard Information(Effect to human health including immunological effect.)Dermal erosion: Not known.Local effect: Possibly stimulative to eyes and skin when clung. Antigenicity: Not known.Acute toxicity: No dataSubacute toxicity: Not known.Chronic toxicity: Not known.Mutagenicity: (Chromosomal aberration to microbe) Not known. Genotoxicity: Not known.Teratogenicity: Not known.Miscellaneous:Health Hazard Information (for each material)1)Resin Acute toxicity: (Oral LD50/Rat,) >15.38g/Kg(Skin LD50/Rabbit,) >2g/Kg.Stimulation on eyes When it gets eyes, stimulus may continue forseveral days.Stimulation on skin When it adheres to the skin, it may turn red, or maycause to blister. In the most serious case, long timecontact may cause dermal erosion.2)Hardener Acute toxicity: (Oral LD50/Mouse,) >5000mg/KgLocal effect No stimulation for rabbit skin.Antigenicity Maximization test by Guinea pig result is positive.Specific Influence Recovery mutation test by microbe result is negative. 3)Filler Acute toxicity: No dataSpecial notes If it inhales so much for a long period of time, it willaccumulate in lungs. And classified into rank 3 for theUS Monograph (It can’t be classified aboutcarcinogenic)4)Additive Acute toxicity: No data(silane) Stimulative I t has strong stimulative for eyes. A blink becomesintense and tears come out.Contact on skin It is stimulative for skin. It makes unpleasant. It mayredden locally and cause swelling.Special notes When it swallowed, it reacts with gastric juiceintensely and methanol is generated.5)Photo Initiator N o dataEnvironmental Effect InformationCured resin will not be decomposed in water or in soil.Environmental Effect Information (for each material)1)Resin No data2)Hardener Ecological toxicity: 48Hr LC50 value for killifish and carp >1000mg/L3)Filler No data4)Additive Ecological toxicity: toxic for fish5)Photo Initiator No dataPrecaution for Waste DisposalIt can be treated like the earth-and-sand waste after incineration.Precaution for transportationCheck leakage and container damage before the transportation. Place on board in a way to prevent tumbling, dropping, damaging or collapse of load.UN Number: Not applicableUN class : Not applicableApplicable Laws (Japanese domestic Law)Fire Services Act : Not applicable.Labor Safety & Hygiene Law : Not applicable.PRTR Law: N ot applicable.MiscellaneousThe above fire hazard and health hazard information are not necessarily sufficient. However, customers should deal with this product carefully at their own risk, referring to this data sheet and taking careful consideration to the existing circumstances, when storing, handling or using it.The above mentioned physical/chemical property data are not intended for guarantee.。

PHOTO IMPACT全套教程

PHOTO IMPACT全套教程第一章凝胶思考题1.什么是凝胶？有何特征（两个不同）？外界条件(如温度、外力、电解质或化学反应)的变化使体系由溶液或溶胶转变为一种特殊的半固体状态，即凝胶。

（又称冻胶）其一，凝胶与溶胶(或溶液)有很大的不同。

溶胶或溶液中的胶体质点或大分子是独立的运动单位，可以自由行动，因而溶胶具有良好的流动性。

凝胶则不然，分散相质点互相连接，在整个体系内形成结构，液体包在其中，随着凝胶的形成，体系不仅失去流动性，而且显示出固体的力学性质，如具有一定的弹性、强度、屈服值等。

其二，凝胶和真正的固体又不完全一样，它由固液两相组成，属于胶体分散体系，共结构强度往往有限，易于遭受变化。

改变条件，如改变温度、介质成分或外加作用力等，往往能使结构破坏，发生不可逆变形，结果产生流动。

由此可见，凝胶是分散体系的一种特殊形式，共性质介于固体和液体之间。

2.举例说明什么是弹性和非弹性凝胶？由柔性的线性大分子物质，如洋菜吸附水蒸气先为单分子层吸附，然后转变为多分子层吸附，硫化橡胶在苯蒸气中的吸附则是从一开始即为多分子层吸附。

这类凝胶的干胶在水中加热溶解后，在冷却过程中便胶凝成凝胶。

如明胶、纤维素等，在水或水蒸气中都发生吸附。

不同的吸附体系，其吸附等温线的形状不同，弹性凝胶的吸附与解析通常会形成较窄的滞后圈。

由刚性质点（如SiO2、TiO2，V2O5、Fe2O3等）溶胶所形成的凝胶属于非弹性凝胶，亦称刚性凝胶。

大多数的无机凝胶，因质点本身和骨架具有刚性，活动性很小，故凝胶吸收或释出液体时自身体积变化很小，属于非膨胀型。

通常此类凝胶具有多孔性结构，液体只要能润湿，均能被其吸收，即吸收作用无选择。

这类凝胶脱水干燥后再置水中加热一般不形成原来的凝胶，更不能形成产生此凝胶的溶胶，因此这类凝胶也称为不可逆凝胶。

3.试述凝胶形成的基本推荐？①降低溶解度，使被分散的物质从溶液中以“胶体分散状态”析出。

②析出的质点即不沉降，也不能自由行动，而是构成骨架，在整个溶液中形成连续的网状结构。

Aleph Matrix1 RGB Pixel Panel系列产品说明书

ALEPH MATRIX164 R G B P I X E L P A N E L S Y S T E M F O R E F F E C T L I G H T I N G A N D SI G N A G EM A T R I X 1 U S B t r a n s m i t t e r d r i v e rArra y o f f o u r M A T R I X 1 p i x e l p a n e l sBack PanelP L E A S E M A K E S U R E T H E P O W E R P A S S -T H R O U G H C U R R E N T D O E S N O T E X C E E D 10 A M P SFeatures•20 mm pitch RGB stackable panels•Versatile: great variety of possible effects and configurations•Greater flexibility of positioning: can be connected together in any shape to create standard rectangular walls or any other configuration •Lightweight design•Low power consumption (17W) per MATRIX1 pixel panel•High colour definition •Easy to assemble•Up to 100 MATRIX1 pixel panels can be daisy-chained using only one USB interface •Simple to commission •Different diffusers available•Cost effective Control : using a dedicated USB interface and CAT5link,the MATRIX Handlersoftware will accept any Art-Net input sourcefrom all major pixel mappers.Perfect partnerwith•Low maintenance: fan-less, removes the need for regular maintenanceSafety•Do not expose the ALEPH MATRIX1 to weather, moisture environment, doing this will void yourwarranty•Do not spill water or other liquids•Check that the local power outlet matches that of the required voltage (120 → 250V AC)•Make all the connections before you power the unit•Do not open the product under any condition.There are no user serviceable parts inside •Never plug the panels in to a dimmer pack•Do not attempt to operate any unit, if it becomes damaged•Always mount the panels in safe and stable matter•Power-supply cords should be routed so that they are not likely to be walked on or pinched byitems placed upon or against them•Avoid placing the system close to high temperature sourcesSoftwareFor MATRIX1system to operate,the following components will be required:•PC running Windows XP or superior with an available USB 2.0 port•Aleph Matrix Handler software.The application can be downloaded from•Aleph Matrix USB interface connected to the PC via USB 2.0 and to the first MATRIX1 pixel panelthrough a standard straight CAT5 cable•At least one ALEPH MATRIX1pixel panel, powered up through a standard IEC mains lead Once Matrix Handler software has been installed, pleaseopen it and you will see the main window:Select the desired “Panel Link Speed” depending on thenumber of panels, length and quality of the data cables, then plug in the Matrix USB interface and once windowshas finished installing the drivers,please click in “Connect to USB Interface” button. The “Not Connected” text will change to“Connected”and the“Re Sync” button could be used at any time in case there are link problems or the“Panel Link Speed”needs to be changed. The next step will be defining all the DMX and Art-Net settings making sure that they match the configuration and patching of the chosen Art-Net source software as follows:Number of Panels: Please select the desired number ofMATRIX1 pixel panels to be handled. Once you select a number, the Address Grid will fill up automatically with the Panel ID, DMX and Art-Net values.Start Art-Net Listen Universe: Select the first Art-Netuniverse where the handler will start listening to the data.Start DMX Channel (of first Panel): Select the initial DMX address for the first panel (out of two per universe), Notice that two MATRIX1 panels can be fitted in eachDMX512 universe as each one uses 192 DMX channels,so 128 channels will not be used per universe.Channel Offset (between Panels): This parameter inconjunction with the “Start DMX Channel” allows the user to spread 128 available channels as desired through theDMX512 grid on each universe.E.g.handling4xMATRIX1panels,leaving the availablechannels at the end of the DMX grid and starting from universe zero, the settings will be as follows:This configuration will assign DMX range 1-192to the first panel on each universe and 193-384 to the second panel on each universe and 385-512 will be available for other devices if desired.Please refer to the ALEPH MATRIX1Quick Start (document PN: 50346) to find out how to address the individual panels following the“panel id”column generated in the handler software grid.Sync: When the number of MATRIX1 pixel panels starts increasing, data might need to be synchronised so that all the panels will change at the same time after receiving a sync signal, when a complete data buffer is ready. This feature will avoid individual panels to change their output in discordance with others and you can ether deactivate it or use one of the following options:•Madrix Post Sync will use a feature of the particular MADRIX software package where aspecial sync packet is sent once a whole databuffer is ready and can be updated on all thepanels at the same time•Universe Sync will send the sync signal once the system reaches the selected universeOnce all the parameters are set up as desired please click in the“Start”button to begin the data listening (from any active Art-Net source)and transmission through the Aleph Matrix USB interface.Grand Master:The grand master slide bar allows theuser for dimming the master intensity of the light output in all the handled panels when 0% will be a black-out orOFF stage and 100% will set the panels to full power. The feature can be used any time during operation when the user desires to adjust the brightness of the whole system.Black out:The black out button brings all lighting output to zero or OFF.Panel Test: The panel test section will allow the user to select a particular panel by clicking in its ID from the scroll box and turn it on setting the desired colour by clicking in the “Test” button. The colour can be changed eve after you have clicked in the “Test” button and the selected panel is already ON by selecting an option from the “Test Type” group and clicking in the “Test” button again. Navigating through the array of MATRIX1 panels is also easy by using the “Prev” and “Next” buttons.To stop the system from listening, transmitting or change the number or panels the software needs to be closed and restarted.System Typical InstallationA typical ALEPH MATRIX1 installation will involve either control and mains power daisy-chained wiring combined with the mechanical aspect. Please consider the following aspects when installing a MATRIX1 system:•Limitation of 100 panels connected in a daisy-chain row•Maximum of 10 Amps total current load per row, so depending on your local input voltage the maximum could be:◦100 panels for 240V input ◦75 panels for 120V input•No extra mains cables will be required for daisy-chaining if the panels are ad close to each other since a mains in/out cable is inbuilt in each panel•Only ENTTEC authorised CAT5 or CAT6 cables must be used to maintain control signal quality •An ALEPH MATRIX1 Terminator must be used on the last panel of each row to ensure control signal integrity•For mechanical mounting brackets please refer to MATRIX1 Holding Bracket instruction sheet document (document PN: 50376) which can be found in •If using MADRIX software, the MATRIX1 fixture library can be downloaded form the ALEPH LIGTHING website for ease of configuration and patching.SpecificationsItem Pixel Pitch 20mmPixel Quantity 64 RGB LED pixels Panels Mullion 3.5mm W eight (Kg)0.54W eight (Pounds ) 1.2Input Voltage 110 – 250V AC 5V DC (From USB)Input Frequency 50/60Hz Max Input Power 17 W atts1.5 W attsDiffus er Y5 Acrylic Refractor Viewing Angle 150°Control InputAlephM Datalink Art-Net (via s oftware)10 AmpsProtection RateIP20IP20MATRIX1Pixel Panel USB Transmitter InterfaceMax Pas s -through MainsCurrentDue to continuous improvements and innovations of all ENTTEC products, specifications and features are subject to change without notice.DimensionsOrdering InformationENTTEC PTY LTDENTTEC AMERICASHead office: 17/5 Samantha Court 604A Cornerstone Ct.Knoxfield VIC 3180 Australia Hillsborough NC 27278 USA Tel: +61 3 9763 5755 Tel & Fax: (888) 454-5922Fax: +61 3 9763 email: ****************ItemPart Number ALEPH MATRIX1 8x8 LED DISPLAY PACK 70901ALEPH MATRIX 1 USB TRANSMITTER 70902ALEPH MATRIX 1 TERMINATOR70903ALEPH MATRIX 1 - Spare front fros t Acrylic73600ALEPH MATRIX 1 - BACK S UPPORT 10 UNITS73601。

手把手教你自己冲彩色负片C41冲洗工艺

手把手教你自己冲彩色负片C41冲洗工艺手把手教你自己冲彩色负片C41冲洗工艺（转载自flickr杰出影像）说明书, 漂白液, 摄氏度, 温度计, 显影液不知道大家有没有被冲洗店毁胶卷的经历，我经历过很多次，自己快被逼疯了，在杀胶卷冲洗店老板全家和忍住不杀之间徘徊了很久，最终我找到了自己手冲C41这个出路。

药水我是在巴黎19区的器材店买的，牌子是TETENAL COLORTEC C41套药1L装。

在冲洗之前，首先请确定自己已经能够非常熟练的冲洗黑白胶卷了，并且有一个精度在0,2摄氏度的温度计，以及三个容积为1L的可压缩的防氧化罐一，准备按说明书上面标注的配置比例配好显影液（Coulour Developer）,漂白液（Bleach Fix）,以及稳定液（Stabiliser）,并分别装在三个防氧化罐里面水尽量用蒸馏水二，预湿用600毫升蒸馏水加热至38度倒入显影罐中,一分钟后倒出小技巧就是在39度的时候倒入显影罐中,然后罐身会降低一点温度的,综合之后可能就是37,8摄氏度三,显影温度 38正负0.5度时间3分15秒,随着卷数的增加要适当延长显影时间,延长多少请参看说明书显影期间每三十秒摇4次显影罐,像冲洗黑白的时候就可以了,摇的方法请参看讨论区内一文四,漂白温度 38度正负5度时间6分钟每分钟摇4次五,冲洗如果水管的温度出来就是30摄氏度至40摄氏度的温水,直接冲洗3分钟就可以了,如果不是,就在之前将显影液放入加热水池里面的同时放入几个装满水的可乐瓶,这个时候就可以用这个冲洗了我的方法是第二种,然后每次换水后摇晃10下倒出,5次以上就可以了六,稳定倒入稳定液,室温就可以了,一直摇晃1分钟七,除水渍跟洗黑白方法一样注意事项1,将显影液,漂白液,水浴达38度,同时找几个小瓶子灌水,也水浴到30-40度2,冲洗前须先将38度的水加入显影罐中预湿135彩色胶片冲洗彩色负片是非常好的也非常成熟的产品，价格非常的低廉，有着非常卓越的品质。