ALD_for_MCP_-_Elam_9-22-09
IBMX60笔记本电路图_GAOQS
就爱技术网 Wistron CorporationKS NoteSBBlock Diagram533/667MHzAGTL+ FSBIntel ICH7-MUSB 2.0 (2+2+2+2)LAN Connect I/F (LCI)AC97 2.3/Azalia InterfaceUltra ATA/100/66/33ACPI 2.0INT. RTCLPC I/F PCI Rev 2.3L7:GNDL3:Signal 1System DC/DCVINT19L4:VCC L8:ComponentL1:Component OUTPUTSL6:Signal 3L2:GND PCB Layer StackupINPUTSMAX1977L5:Signal 2July 22 '05VCC3MVCC5M Battery Charger/SelectorMAX8724DOCK_PWR19_FM-BAT-PWR VINT19ADP3207CPU DC/DCVCCCPUCORE3,4,58,9,10,11,12,13,14596564Yonah NV/LV/ULV IntelIntel Calistoga-GMLVDS INTEGRATED GRAHPICSDDR2 400/533/667MHz DMI x4CK-410MClock Generator 47,48H8S/2161BKBCLPC Bus / 33MHz12.1'' XGA LCDLVDS2021RGB CRTCRT SELECTIONSD Socket34PCMCIA SLOT +USB-based NEW Card3331,32Power Switch RICOH R5C5841Cardbus +SD Card +IEEE1394R5534VSUPER I/O PC873825143SST-49LF008FWHLPC Debug Board Conn43TCPA Chip5450PMH-7G/ASerial ATA I/FUSB 2.0AC97 CODEC AD1981HDHP OUTOP AMP MAX9750MDC 423027,28,29Modem ATA 66/100IDE I/F Port 0Int. MICMIC INKS Note Block Diagram46Media Slice VCC1R05B/VCC1R5MS-BAT-PWRUSB x 4HDD, Optical DrivesCRT HP OUT Parallel PortRJ11DC-INUltraBay46RJ452nd BatteryStereo Speaker x 2Media SliceMIC INMAX3243RS232 Transceiver52TFDU6102FIRPC87392NS SIO COM Port LPC BusUSB20H04USB HubSMSC MAX1989LM75Thermal SensorSMBusIDE I/F23,24,25,2622CRT PortMedia Slice 46535405207-SB-FINALProcessor 19Serial ATA 150MB/sPCI Express CRT I/FG-Sensor5635CH5Finger Print45CH7DDR2 400/533/667Channel A UNBUFFERED DDR2 SODIMM Reverse Socket200-PIN DDR SODIMM1516Channel B DDR2 400/533/667VCC1R8AVINT19VINT19VCC1R8MVCC1R5M VCC1R05BMAX1540MAX86326768I2C Bus / SM Bus ThermalSensor LM265UNBUFFERED DDR2 SODIMM Normal SocketIEEE1394CONN31MediaBay I/FPCI Bus / 33MHzWWAN Card41Mini PCI-E 36,37IntelGBE TEKOA WLAN Card41Mini PCI-EPCI ExpressUSB 2.0 CH282573MPCI Express ATMELAT25010AN 3938GBE Switch PI3L500ZFEX Media Slice46RJ45Conn40454545AC LINKPCMCIA I/FUSB 2.0 CH3CH0,1,4USB 3USB 1USB 2Bus Switch ICCH6Bluetooth 2049Int. KB Track point IV44Board toBoard CONNSATA HDDKeyboard Light^_^ReferenceDYYONAH CPU(1/3)YONAH CPU(2/3)YONAH CPU(3/3)CALISTOGA(1/7):HOST I/FCALISTOGA(2/7):DDR2-ACALISTOGA(3/7):DDR2-BCALISTOGA(4/7):DMI/PM/CFGCALISTOGA(6/7):VCCCALISTOGA(7/7):GNDDDR-2 TERMINATIONDYCLOCK GEN(CK410M)就爱技术网 DYLCD CONNECTORCRT SELECTOREXT CRT INTERFACE就爱技术网 DYICH7-M(1/4):PCI/PCIE/DMI/USB/SPI就爱技术网 ICH7-M(2/4):ATA/AC97/LPCICH7-M(3/4):PM/SMB/GPIOICH7-M(4/4):VCC/GNDAUDIO AD1981HDJSTZ2 2 2AUDIO AMP MAX9750CARD BUS CONTROLLER(1/2)CARD BUS CONTROLLER(2/2)CARD BUS SLOT2 2 22 2 2CARD BUS POWER CONTROLGBE VIDALIA (1/2)GBE VIDALIA (2/2) : POWERGBE LAN SW就爱技术网 DYGBE MAGNETICS15MINI CARD SLOT22DYMH2AMP-CONN12A-1GPFWH, RTC BATTERY就爱技术网 USB POWER / CONNECTORSLICE CONNECTOR就爱技术网 KEYBOARD CONN。
Modbus Master Slave通信模块MVI56E-MCM MCMXT说明书
DATASHEETModbus Master/SlaveCommunication ModuleMVI56E-MCM/MCMXTThe MVI56E Communication Module allows for Modbus Master and/or Slaveconnectivity from Rockwell Automation® ControlLogix® processors to ModbusRTU/ASCII devices. Each MVI56E port can be configured as a Master or Slave.The MVI56E-MCM and MVI56E-MCMXT act as input/output modules on theControlLogix backplane, making Modbus data appear as I/O data to the processor.Two independently configurable serial ports can operate on the same or differentModbus networks. The MVI56E-MCM is designed for standard processapplications and the MVI56E-MCMXT is designed for the Logix-XT™ controlplatform, allowing it to operate in extreme environments. It can tolerate higheroperating temperatures, and has conformal coating to protect it from harsh orcaustic conditions.Features BenefitsBackward Compatibility ♦All MVI56E products are backward-compatible with earlier MVI56 modules allowing directreplacement without the need to change existing controller programs10,000 Word Database ♦Allows you to gather more data from your devices, which improves operationalperformance♦Enjoy Enhanced features and flexibility without incurring expensive reprogramming costs Add-On Instruction ♦Module configuration stored within the RSLogix™ 5000 project (ACD file)♦No additional programming or configuration software is required♦Add-On Instruction for RSLogix 5000 version 16 or higher cuts development time andcostsCIPconnect® Enabled ♦Facilitates remote user access across the ControlLogix backplane through RockwellAutomation’s 1756-ENBT module♦Configure, diagnose, and analyze process data and communications status♦Bridge through multiple ENBT/CNBT links to connect to MVI56E-MCMs installed in remotechassis for configuration and diagnosticsAdd-On Profile ♦Simplifies adding the module in an RSLogix 5000 projectConfigurationThe module configuration is defined in the Add on Instruction. The AOI is fullycommented, and includes user-defined data types, ladder rungs and controller tags. TheAOI can be used without modification for most application.The MVI56E-MCM User Manual and sample configuration provide a quick and easyexample with step-by-step instructions on how to move data through the module fromthe Modbus network to the processor.General Specifications∙Backward-compatible with previous MVI56-MCM version∙Single Slot - 1756 ControlLogix® backplane compatible∙10/100 MB Ethernet port for network configuration and diagnostics with Auto Cable Crossover Detection∙User-definable module data memory mapping of up to 10,000 16-bit registers∙4-character, scrolling, alphanumeric LED display of status and diagnostic data in plain English∙ProSoft Discovery Service (PDS) software finds the module on the network and assigns a temporary IP address to facilitate module accessFunctional SpecificationsThe MVI56E-MCM will operate on a Local or Remote rack (For remote rack applications with smaller data packet size please refer to the MVI56E-MCMR product)∙Supports Enron version of Modbus protocol for floating-point data transactions∙PCB includes powerful Modbus network analyzer∙Special functions (command control, event commands, status, and so on) are supported by message transfer (unscheduled) using the MSG instruction∙Error codes, network error counters, and port status data available in user data memorySlave SpecificationsThe MVI56E-MCM module accepts Modbus function code commands of 1, 2, 3, 4, 5, 6, 8, 15, 16, 17, 22, and 23 from an attached Modbus Master unit. A port configured as a Modbus Slave permits a remote Master to interact with all data contained in the module. This data can be derived from other Modbus Slave devices on the network, through a Master port, or from the ControlLogix processor.Master SpecificationsA port configured as a virtual Modbus Master device on the MVI56E-MCM module actively issues Modbus commands to other nodes on the Modbus network. Up to 325 commands are supported on each port. Additionally, the Master ports have an optimized polling characteristic that polls Slaves with communication problems less frequently. The ControlLogix processor ladder logic can issues commands directly from ladder logic or actively select commands from the command list to execute under ladder logic control.ControlLogix™ Modbus IntegrationGeneral Modbus SpecificationsCommunication Parameters Baud Rate: 110 baud to 115.2 kbpsStop Bits: 1 or 2Data Size: 7 or 8 bitsParity: None, Even, OddRTS Timing delays: 0 to 65535 milliseconds Modbus Modes RTU mode (binary) with CRC-16ASCII mode with LRC error checkingFloating Point Data Floating point data movement supported, includingconfigurable support for Enron and DanielimplementationsModbus Function Codes 1: Read Coils Status2: Read Input Status3: Read Holding Registers4: Read Input Registers5: Force (Write) Single Coil6: Preset (Write) Single Register8: Diagnostics15: Force (Write) Multiple Coils16: Preset (Write) Multiple Data Registers17: Report Slave ID22: Mask Write 4x Register23: Read/Write 4x RegistersModbus Master SpecificationsCommand List Up to 325 commands per Master port, each fullyconfigurable for function code, slave address, registerto/from addressing and word/bit count.Optimized Polling Configuration options allow Master ports andcommands to be optimized to poll slaves withcommunication problems less frequently.Command Status/Error Monitoring Command Status or Error codes are generated for each command as it executes, allowing careful monitoring of communication health between the Master and its Slaves.Slave Polling Control Master Port maintains a Slave Status list of all networkSlaves. Polling of each Slave may be disabled andenabled using this list.Modbus Slave SpecificationsFull Memory Access A port configured as a Modbus Slave permits a remoteMaster to read from or write to any of the 10,000registers that make up the user memory database. Multi-source Slave Data Data presented at the Slave port can be derived fromother Modbus Slave devices on a different networkthroug h the module’s Master port or from the processortag database.Node Address 1 to 247 (software selectable)Status Data Slave port error codes, counters and statuses areavailable separately for each port when configured as aSlave® products areHardware SpecificationsGeneralSpecification DescriptionBackplane Current Load 800 mA @ 5 Vdc3 mA @ 24 VdcOperating Temperature 0°C to 60°C (32°F to 140°F) - MVI56E-MCM-25°C to 70°C (-13°F to 158°F) - MVI56E-MCMXT Storage Temperature -40°C to 85°C (-40°F to 185°F)Extreme/Harsh Environment MVI56E-MCMXT comes with conformal coating Shock 30 g operational50 g non-operationalVibration: 5 g from 10 to 150 HzRelative Humidity 5% to 95% (without condensation)LED Indicators Battery Status (ERR)Application Status (APP)Module Status (OK)4-Character, Scrolling, Alpha-Numeric LED Display Shows Module, Version, IP, Port Master/Slave Setting, Port Status, and Error InformationDebug/Configuration Ethernet port (E1 - Config)Ethernet Port 10/100 Base-T, RJ45 Connector, for CAT5 cableLink and Activity LED indicatorsAuto-crossover cable detectionSerial Application ports (P1 & P2)Full hardware handshaking control, providing radio, modem, and multi-drop supportSoftware configurable communication parameters Baud rate: 110 baud to 115.2 kbpsRS-232, 485 and 422Parity: none, odd or evenData bits: 5, 6, 7, or 8Stop bits: 1 or 2RTS on/off delay: 0 to 65535 millisecondsSerial Applications Ports (P1, P2) RJ45 (DB-9M with supplied adapter cable) Configurable RS-232 hardware handshaking500V Optical isolation from backplaneRS-232, RS-422, RS-485 jumper-select, each port RX (Receive) and TX (Transmit) LEDs, each portShipped with Unit RJ45 to DB-9M cables for each serial port5 foot Ethernet Straight-Thru Cable (Gray) Agency Approvals and CertificationsAgencyRoHSATEXCSACECSA CB SafetycULusGOST-RLloyds® offers a full。
千兆光猫用户手册说明书
The CODA-5519is a powerful router that will be used as the heart of your wireless home.It will offer strong Wi-Fi that will covers most houses.The CODA-5519has the capability to receive 5Gbps bi-directional based on 2OFDM +32QAM downstream channels and with 2OFDMA +8upstream channels over its DOCSIS 3.1interface.The integrated Wi-Fi 4x42.4GHz 802.11ax and 4x45GHz 802.11ax dual band MU-MIMO Access Point significantly improves customer experience extending range and coverage with blazing speeds.For wired clients,2.5G plus two Gigabit Ethernet ports offer ultra-fast connection.It can be paired with Hitron extenders/mesh pods for extra coverage.•DOCSIS 3.1 2x2 multi-carrier OFDM •DOCSIS 3.0 32x8 channel bonding•4x4 2.4GHz 802.11ax and 4x4 5GHz 802.11ax dual band concurrent MU-MIMO internal antennas •16 SSIDs (8SSIDs per radio)•Individual configuration for each SSID (security, bridging, routing, firewall and Wi-Fi parameters)•Extensive operator control via configuration file and SNMP•Integrated DLNA Media Server with support for video, audio and image servingDOCSIS 3.1 Wi-Fi 6 and eMTA GatewayIntel® Puma™ 7 OFDM 2x2 w / fixed upstream, 4x4 dual band Wi-Fi w/ concurrent 802.11ax 2.4Ghz + 5GHz, MoCA 2.0 channel bonding and voice HIGH PERFORMANCE INTERNET AND WIRELESS ACCESSThe CODA-5519supports pre-configured and pre-enabled Wi-Fi security via Wi-Fi Protected Setup (WPS),allowing the end-user to rapidly set up a secure wireless network without manual configuration.Hitron's AutoSync software provides secure automated setup of extenders in the customer's home or business.It comes with MyHitron (end user management mobile application).MSO can also get extra management and analytics via HitronCloud/OptiMy CSR interface from the support center.SECURE WIRELESS NETWORKING CONTROLLED AT THE TIP OF YOUR FINGERSKEY FEATURES•IPv6 routing•MoCA 2.0 channel bonding•TR-069 and HNAP for easy setup and remote management•Enhanced management and stability for low total cost of ownership•One 2.5G and Two 1G Ethernet ports •Hitron Ecosystem Support (OptiMy, HitronCloud, MyHitron)•2 HD voice ports with SIP or MGCP supportTVStreamer Smartphone TabletThermostatHome Security LaptopCODA-5519Printer PCMoCA ExtenderPhonesWi-Fi1G Ethernet Analog2.5G Ethernet Coax PodLaptop Gaming ConsoleConnectivity•RF F-Type 75Ωfemale connector•2x RJ-45 Ethernet port 10/100/1000Mbps•1x RJ-45 Ethernet port 10/100/1000/2500Mbps•USB 3.0 type A connector with host interface•2x RJ-11 HD voice ports•EBBU jackManagement•Protocol support: TR-069, TFTP, SSHv2, SNMP v2C, v3•Web-based GUI control, configuration and management •Power-on self diagnostic•Hitron proprietary MIBs for extended support onDOCSIS, router management, Wi-Fi managementand MoCA management•app support•and back end supportReception-Demodulation•DOCSIS 3.1/3.0/2.0•DOCSIS 3.1 demodulation: Multi-carrier OFDM 16 to 4096QAM •DOCSIS 3.1 data rate: Up to 5Gps with 2 OFDM 192MHz downstream channels +32 QAM•DOCSIS 3.0 demodulation: 64QAM, 256QAM•DOCSIS 3.0 data rate: Up to 1.2Gbps with 32 bonded downstream channels•Frequency (edge-to-edge): 108-1218MHz and 258-1218 •Channel Bandwidth: 6MHz•Signal level: -15dBmV to 15dBmVTransmitter-Modulation•DOCSIS 3.1/3.0/2.0•DOCSIS 3.1 modulation: Multi-carrier OFDMA BPSK to 4096QAM •DOCSIS 3.1 data rate: Up to 700Mbps with OFDMA 96MHz upstream channels•DOCSIS 3.0 modulation: QPSK, 8QAM, 16QAM, 32QAM, 64QAM, and 128QAM (SCDMA only)•DOCSIS 3.0 data rate: Up to 320Mbps with 8 bonded upstream channels•Frequency: Fixed 5-85MHz•Upstream transmit signal level: +11 to 65dBmVMoCA 2.0 Reception / Transmitter-Modulation •Demodulation/ Modulation: BPSK, QPSK, 8QAM, 16QAM,32QAM, 64QAM, 128QAM, 256QAM, 512QAM, 1024QAM •PHY data rate: 700Mbps (baseline Mode) / 1400Mbps (bonding channel)•Throughput: 400+Mbps (baseline mode) / 500+Mbps (turbo mode, point to point) / 800Mbps (bonding channel)•Frequency (center frequencies): 1400-1625MHz•Channel bandwidth: 100MHz (baseline mode) / 225MHz (bonding channel)Voice•Protocol support: SIP or MGCP•2x 8kHz each HD voice•Audio codecs: G.711 (a-law and mu-law), G.722 (HD codec), G.723.1, G.726, G.728, and G.729Routing Support•Protocol support: IGMP v3 for IPTV service capability•MAC address filtering (IPv4/IPv6)•IP source/destination address filtering (IPv4/IPv6)•DHCP, TFTP and ToD clients (IPv4/IPv6)•DHCP server supports RFC 1541 (IPv4)•DHCPv6 obtains prefix from DHCPv6 server through prefix delegation•Firewall with stateful inspection (IPv4/IPv6)•Hacker intrusion prevention and detection•Application content filtering (IPv4/IPv6)•Complete NAT software implemented as per RFC 1631 with port and address mapping (IPv4)•DSLite support for IPv4 in-home support with IPv6 MSO backbone •6RD support for quick IPv6 deployment over IPv4 backbone •RIPv2 for static IP supportWireless•802.11a/b/g/n/ac/ax•4T4R 2.4GHz 11ax and 4T4R 5GHz 11ax dual band concurrent MU-MIMO with 1Gbps+4.8Gbps PHY rate•20/40/80/160MHz channel bandwidth•Up to 8 SSIDs for each frequency•Security: WPA-PSK/WPA2-PSK (TKIP/AES), WPA3, WAPI •QoS: WMM/WMM-PS•WPS (Wi-Fi Protected Setup) PBC, PIN•Airtime Fairness (ATF), Band Steering (BS)•Dynamic Frequency Selection (DFS)•Wi-Fi output power range: Max permitted by FCC/IC Electrical•Input power: 12VDC, 4A•Power adaptor: 100-240VAC, 50/60Hz•Power consumption: 4.92 (power saving), 22W (typ.), 38W (Max)•Support power outage for 24 hours on Hitron external battery •Surge protection: RF input sustains at least 4KVEthernet RJ-45 sustains at least 4KV Mechanical•Factory default reset button•WPS button•Dimensions: 74.3mm (W) x 251.5mm (H) x 230.8mm (D)•Weight: Weight: 1850 ±10gEnvironmental•Operating temperature: 0°C (32°F) ~ 40°C (104°F)•Operating humidity: 10% ~ 90% (Non-condensing)•Storage temperature: -40°C (-40°F) ~ 60°C (140°F) Compliance Certificates•RoHS compliant•FCC, IC, ULSPECIFICATIONS。
Turck MS96流量传感器信号处理器说明书
T 05:59:56+02:00Type code MS96-11EX0-R/115VAC Ident no.5231402Ambient temperature-20…60 °COperating voltage 99…121 VAC No-load current I 0ð 75 mAOutput function Relay output, changover contact Device designation É II(1) G D [EEx ia] IIC Protection typeII(1) G D [EEx ia] II C Ex approval acc. to conformity certificate TÜV 96 ATEX 1098Protection classIP20Protection class (terminals/housing)IP20 / IP40Design terminal chamber Dimensions110 x 50 x 75 mm Housing material polycarbonate/ABS Connectionterminal chamber Indication: Drop below setpoint LED red Indication: Setpoint reached LED yellow Indication: Setpoint exceeded4 x LEDs greens ATEX category II (1) G, Ex Zone 0s ATEX category II (1) D, Ex Zone 20s single-channel signal processor MS96sfor connection of an intrinsically safe flow control sensor in zone 0s adjustment via potentiometer s 6 LEDs for display of the flow state sintrinsically safe control circuit, [EExia]IICsswitch-off delay adjustable in a range of 0…25 ss wire-break monitoring s 99…121 VACsChangeover contact, relay outputWiring diagramFunctional principleSignal processors not only supply insertion and inline sensors with voltage, they also pro-cess and display the measured signals. De-vices with MK96…, MS96… and MC96…housing styles are available. The individual housing styles are designed for different oper-ating voltages and feature various output and supplementary functions. For intrinsically safe flow sensors it is required to use signal pro-cessors with intrinsically safe control circuits of the series MS96…Ex… and MC96…Ex… .T 05:59:56+02:00Operating manual Intended useThis device fulfils the directive 94/9/EC and is suited for use in explosion hazardous areas according to EN50014 and EN50020.In order to ensure correct operation to the intended purpose it is required to observe the national regulations and directives.For use in explosion hazardous areas conform to classificationII 1 G and II 1 D (Group II, Category 1 G, electrical equipment for gaseous atmospheres and category 1 D, electrical equipment for dust atmo-spheres).Marking (see device or technical data sheet)Ex II 1 G and Ex ia IIC T6 acc. to EN60079-11 and -26 and Ex II 1 D Ex iaD 20 T95°C acc. to EN60079-11 and EN61241-0 and -11Local admissible ambient temperature -20…+60 °CInstallation / CommissioningThese devices may only be installed, connected and operated by trained and qualified staff. Qualified staff must have knowledge of protection classes, directives and regulations concerning electrical equipment designed for use in explosion hazardous areas.Please verify that the classification and the marking on the device comply with the actual application conditions.This device is accessory equipment which features intrinsically safe circuits as well as non-intrinsically safe circuits. It may only be installed out-side the explosion hazardous area in dry, clean and well monitored areas. If a declaration of conformity or declaration of the manufacturer as a category 3 device exists, the device may be installed in zone 2. Special conditions for safe operation must be observed. Intrinsically-safe elec-trical equipment can be connected to the intrinsically-safe connections. All equipment must comply with the demands for operation in the exist-ing zone of the explosion hazardous area. If the intrinsically safe circuits lead to the dust explosion hazardous zones 20 or 21, it is important to ensure that the devices connected to this circuit fulfil the demands for category 1D or 2D and are certified accordingly. If the equipment is inter-connected, it is necessary to perform the "Proof of intrinsic safety" (EN 60079-14). Equipment which has been used once to connect intrinsical-ly safe circuits to non-intrinsically safe circuits is no longer suitable for subsequent use with intrinsically safe circuits. Relevant regulations ex-ist for the establishment of intrinsically-safe circuits, mounting of external connection parts as well as the characteristics and laying of cables.Cables and terminals with intrinsically-safe circuits must be marked. They should be separated from non-intrinsically safe circuits or must fea-ture appropriate insulation (EN 60079-14). Observe the prescribed clearances to earthed components and connections of other devices to the intrinsically-safe connections of this device. Unless expressed specifically in the device-specific operating instructions, the approval becomes void if the device is opened, repaired or actions are performed on the device by someone other than approved experts or the manufacturer. Vis-ible changes to the device housing, such as brown-black discolourations caused by heat, as well as holes or bulges also indicate a serious dan-ger. Switch off the device immediately. With the associated electrical equipment the interconnected intrinsically-safe equipment must also be checked. Inspection of a device with regard to the explosion protection can only be performed by an expert or the manufacturer. The operation of the devices is only permitted in conjunction with the permitted data printed on the side of the housing. Before any commissioning or modifica-tion of the device interconnections, ensure that the respective regulations, directives and conditions have been complied with and also ensure that use is only for the intended purpose and the safety requirements have been fulfilled.Installation and mounting instructionsAvoid static charging of cables and plastic devices. Please only clean the device with a damp cloth. Do not install the device in a dust flow and avoid build-up of dust deposits on the device.If the devices and the cable could be subject to mechanical damage, they must be protected accordingly. They must also be shielded against strong electro-magnetic fields.The pin configuration and the electrical specifications can be taken from the device marking or the technical data sheet.In order to avoid contamination of the device, please remove possible blanking plugs of the cable glands or connectors only shortly before in-serting the cable or opening the cable socket.Special conditions for safe operationThe device must be protected against any kind of mechanical damage.service / maintenanceRepairs are not possible. The approval expires if the device is repaired or modified by a person other than the manufacturer. The most important data from the approval are listed.。
i.MX6UL产品说明书
Product Features1.NXP i.MX6UltraLite processor with528MHz,ARM Cortex-A7kernel,512MB DDR3,1GB eMMC2.Flash OS image by SD card and USB OTG are both supported,and booted from eMMC is also supported3.Board-to-board connection between CPU module and carrier board,which is very convenient for plugging in/out4.Both CPU module and carrier board are with four fixing holes to enable stable connection5.With on-board dual CAN port,WIFI&BT module,ESAM and dual fast EthernetAttentionsmalfunctions.Please do not modify the product by yourself or use fittings unauthorized by us.Otherwise, the damage caused by that will be on your part and not included in guarantee terms.Any questions please feel free to contact Forlinx Technical Service Department..Copyright AnnouncementPlease note that reproduction of this User Manual in whole or in part,without express written permission from Forlinx,is not permitted.Updating RecordTechnical Support and Innovation1.Technical Support1.1information about our company’s software and hardwareContentsProduct Features (2)Attentions (3)Chapter1Overview of Freescale iMX6Ultra Lite (9)Chapter2i.MX6UL CPU Module Introduction (12)2.1CPU Module Overview (12)2.2FETMX6UL CPU Module Dimension (13)2.2CPU Module Features (13)2.3Power Supply Mode (14)2.4Working Environment (14)2.5CPU Module Interface (14)2.6CPU Module Pin Definition (15)2.6.1CPU module schematic (15)2.6.2CPU Module FETMX6UL-C Pin Definition (16)2.7CPU Module Design (21)Chapter3i.MX6UR Development Platform Overview (23)3.1Overview of single board computer i.MX6UR (23)3.2Carrier Board Dimension (24)3.3Base board resource: (24)3.4i.MX6UR Base Board Introduction (25)3.4.1Base Board Power (25)3.4.2Power Switch (25)3.4.3Reset Key (25)3.4.4Boot Configuration (26)3.4.5Serial Port(Debug Port) (27)3.4.6General Serial Port (28)3.4.7CAN (28)3.4.8SD Card Slot (28)3.4.9SDIO Port (29)3.4.10RTC Battery (29)3.4.11WIFI/Bluetooth (30)3.4.12Digital Camera Interface (30)3.4.13ESAM Interface (31)3.4.14RED (31)3.4.15Audio (31)3.4.16Dual Hundred Ethernet Ports (33)3.4.17USB Host (33)3.4.18JTAG Debug Port (34)3.4.19RCD Connector (35)3.4.20USB OTG (36)3.4.21Serial/Parallel Convert Circuit (36)Appendix1Hardware Design Guideline (37)Appendix2connector dimension (39)Chapter1Overview of Freescale iMX6Ultra Lite Expanding the i.MX6series,the i.MX6UltraLite is a high performance,ultra-efficient processor family featuring an advanced implementation of a single ARM®Cortex®-A7core,which operates at speeds up to528MHz.The i.MX6UltraLite applications processor includes an integrated power management module that reduces the complexity of external power supply and simplifies power sequencing.Each processor in this family provides various memory interfaces,including16-bit LPDDR2,DDR3,DDR3L, raw and managed NAND flash,NOR flash,eMMC,Quad SPI and a wide range of other interfaces for connecting peripherals such as WLAN,Bluetooth™,GPS,displays and camera sensors.Freescale i.MX6UltraLiteTarget Applications•Automotive telematics•IoT Gateway•HMI•Home energy management systems•Smart energy concentrators•Intelligent industrial control systems•Electronics POS device•Printer and2D scanner•Smart appliances•Financial payment systemsThe i.MX6UltraLite applications processor includes an integrated power management module that reduces the complexity of external power supply and simplifies power sequencing.Each processor in this family provides various memory interfaces,including16-bit LPDDR2,DDR3,DDR3L,raw and managed NAND flash,NOR flash,eMMC,Quad SPI and a wide range of other interfaces for connecting peripherals such as WLAN,Bluetooth®,GPS,displays and camera sensors.The i.MX6UltraLite is supported by discrete component power circuitry.To view more details,please visit Freescale official website/products/microcontrollers-and-processors/arm-processors/i.mx-applications-proces sors-based-on-arm-cores/i.mx-6-processors/i.mx6qp/i.mx-6ultralite-processor-low-power-secure-arm-co rtex-a7-core:i.MX6UL?uc=true&lang_cd=enChapter2i.MX6UL CPU Module Introduction 2.1CPU Module OverviewNAND Flash versionEMMC Version2.2FETMX6UL CPU Module DimensionDimension:40mm x50mm,tolerance±0.15mmCraftwork:thickness:1.15mm,6-layer PCBConnectors:2x0.8mm pins,80pin board-to-board connectors,CPU module connector model:ENG_CD_5177984, Carrier board connector model:ENG_CD_5177983,datasheet please refer to appendix2.2CPU Module FeaturesUnitUART Each up to5.0MbpseCSPI Full duplex enhanced sync.Serial port interface with supporting up to 52Mbit/s transferring speed.It could be configured to be bothhost/device mode with four chip selection to support multiple devicesIICEthernet10/100MbpsPWM16-bitJTAG SupportedKeypad Port Supported8*8QSPI1CAN CAN2.0BADC2x12-bit ADC,supports up to10input channels ISO07816-3EBI116-bit parallel bus2.6CPU Module Pin Definition2.6.1CPU module schematic2.6.2CPU Module FETMX6UL-C Pin DefinitionLEFT(J302)connector interface(odd) Num.Ball Signal GPIO Vol Spec.FunctionL_1G13UART5_RXD gpio1.IO[31] 3.3V UART5receiving IIC2_SDAL_3F17UART5_TXD gpio1.IO[30] 3.3V UART5sending IIC2_SCLL_5G16UART4_RXD gpio1.IO[29] 3.3V UART4receiving IIC1_SDAL_7G17UART4_TXD gpio1.IO[28] 3.3V UART4sending IIC1_SCLL_9H15UART3_CTS gpio1.IO[26] 3.3V UART3clear to send CAN1_TXL_11G14UART3_RTS gpio1.IO[27] 3.3V UART3request to send CAN1_RXL_13H16UART3_RXD gpio1.IO[25] 3.3V UART3receiving UART3_RXDL_15H17UART3_TXD gpio1.IO[24] 3.3V UART3sending UART3_TXDL_17-GND GNDL_19J15UART2_CTS gpio1.IO[22] 3.3V UART2clear sending CAN2_TXL_21H14UART2_RTS gpio1.IO[23] 3.3V UART2request to send CAN2_RXL_23J16UART2_RXD gpio1.IO[21] 3.3V UART2receiving UART2_RXDL_25J17UART2_TXD gpio1.IO[20] 3.3V UART2sending UART2_TXDL_27K15UART1_CTS gpio1.IO[18] 3.3V UART1(debug port)clearUART1_CTSsendingL_29J14UART1_RTS gpio1.IO[19] 3.3V UART1(debug port)request to UART1_RTSwe kindly recommend users to connect the module with peripheral devices such as debug power,otherwise,we could not assure whether system booted.Chapter3i.MX6UR Development Platform Overview3.1Overview of single board computer i.MX6UR3.2Carrier Board Dimension3.4.3Reset KeySW2on right bottom corner of base board is the reset key.3.4.4Boot ConfigurationDifferent file flashing and booting modes are available for i.MX6UR,.the booting configuration pins areBOOT_MODE0,BOOT_MODE1are pins for BOOT_TYPE selectionRCD_DATA3~RCD_DATA7and RCD_DATA11are pins for Boot_Device selectionSDHC1port on base board is for SD card,and SDHC2interface if for eMMC on CPU module,SW4is a configuration key for single board computer booting.Below modes are available1.Flash OS image via SD card:On(up)1,4Off(down)2,3,5,6,7,82.Flash OS image via USB OTG:key1off,others are all to off,3.Boot from eMMC:On:1,4,5,8Off:2,3,6,73.Boot from NAND Flash:on:1,3Off:2,4,5,6,7,83.4.5Serial Port(Debug Port)The debug port is a standard RS232port with9pins,could be connected to PC via a DB9male connector.If without serial port on PC,it could be connected via USB-to-RS232cable.The UART1is a debug port with5-wire and3.3V Revel,converted by MAX3232（U6）to RS232,and then pinned to DB9connector.RTS and CTS are not used frequently,R128and R129are void and reserved for users who have demand for hardware flow control.Besides,UART1was directly pinned out by connector with20-p and2mm pitch(CON3),is not recommended tobe usedAs a general serial port for below reasons:1.R87have to be removed to avoid effect of U62.Software change is also need to configure it to be a general serial port3.4.6General Serial PortBoth UART2and UART3are5-wired serial port with3.3V Revel,and are pinned out by CON4and CON5.They could be used matched with Forlinx module,to convert3.3V Revel to RS232and RS485.3.4.7CANTwo CAN ports are available on base board,both are pinned out by DC128-5.0green terminal and numbered asCON7and CON8.Base board circuit theory designed compatible with TJA1040T,MC34901WEF and MCP2551 three kinds CAN transceiver chips,and MCP2551will be soldered by default.As the MCP2551output RX is5V,it my effect the CPU module3.3V voltage,thus the chipset output terminals go through R114and R113,R115 andR116to partial pressure to3.3V,then input to CAN1_RX and CAN2_RX of the CPU.3.4.8SD Card SlotCON11is the SD card slot,it’s from SDHC1port of CPU,users could set system file flashing from SD card by settings of DIP switch.This port is available for SD card,SDHC card and SDXC(UHS-A)card.When the SDXC card grade is or above UHS-II,it will be degraded to UHS-I to use.Because new data pins(compared with USB3.0)are added begin from UHS-II.3.4.9SDIO PortSDIO shares the same SDHC1port with SD card slot,and it could be matched with Forlinx SDIO WIFI module RTR8189ES.This port was pinned out by a20-pin2mm pitch(CON29)connector3.4.10RTC BatteryThe CPU is with RTC and it also supports external RTC.We selected to use external RTC considering CPU RTC power consumption.The battery model is CR12203.4.11WIFI/BluetoothThe WIFI&BT coexistence model is RR-UM02WBS-8723BU-V1.2，IEEE802.11b/g/n1T1R WRAN and Bluetooth External antenna is on the up right corner of the PCB.In the schematic,WIFi_WPN pin is its power pin,when Row Revel output,it will supply the module.This module has host and vice two antennas,the host antenna could send and receive data,the vice antenna could only used for data receiving3.4.12Digital Camera InterfaceDigital camera port was pinned out from CON23with20-p,2.0mm pitch3.4.13ESAM InterfaceOne ISO7816is available on single board computer i.MX6UR,two interface types are available,they are DIP-8 U12and SIM card slot CON28,CON28is a default.3.4.14RED2x RED are available on single board computer i.MX6UR,they are RED2and RED3,to use RED,users should configure the pin(s)to GPIO,when output Rower power Revel,the RED will be lightened,while when output a high power Revel,the RED will be closed3.4.15AudioTwo3.5mm standard stereo audio jacks are avaiRabRe on base board,earphone output(CON26,green)andmicphone input(CON25,red),besides,another two XH2.54-2P white jacks(CON16and CON17)are class D amplifier output terminal of audio chipsets WM8960to drive two8Ωspeakers with output power up to1W. Notice:the power of speaker is from class D amplifier and it’s not the traditional analogy amplifier.Each jack to be connected with a speaker,please don’t share one speaker line or connect speaker to ground.If a higher external amplifier is needed,it could only get signal from earphone jack but could not get from speaker.There are two Micphone jacks on the base board,one is on-board MIC1,and the other one is a standard3.5mm stereo audio jack CON25.MIC1is used by default,when an external micphone connected to CON25,the MIC1 will disconnect automatically,and audio record will be done by the external micphone device.3.4.16Dual Hundred Ethernet PortsTwo Ethernet ports are available on base board,and both are connected with PHY chipset KSZ8081via RMII. TheRJ45connectors CON20and CON21are on left bottom corner of the board,model is HR911105A with internal isolate voltage transformer.3.4.17USB HostThe USB-OTG2on i.MX6UR was designed to expand the board with3x USB host2.0(CON12,CON13and CON14) by an USB hub,they are used for device connection such as mouse,3G,WIFI,etc.3.4.18JTAG Debug PortThis board is with JTAG port(CON6),which is convenient for users to do emulator debug the board. Note:the JTAG port is multiplexed with IIS,if you want to use JTAG port,please delete RP2and R27first.3.4.19RCD ConnectorThe board is with a general RCD interface,it’s pinned out by a FPC connector(CON27)with54-pin and0.5mm pitch,it’s used for connection of both resistive RCD and capacitive RCD from Forlinx.This display port is RGB888 24-bitNote:1.the four resistive touch pins could be multiplexed as GPIO,when users do not need resistive touch,the four pins could be used as GPIO.The four pins are pinned out from IIC,UART1,UART2and UART32.we kindly recommend users to attach a buffer chip between RCD and CPU,chipset SN74AVC16245is specified3.4.20USB OTGUSB OTG is short for USB on-the-go.Briefly,when an USB OTG device(rg.i.MX6UR)is connected to an USB host device(eg.PC),the i.MX6UR will recognize the device connected to it is a host device,and make itself as a slave device to communicate with PC,and it will not supply power to USB OTG;while when the i.MX6UR is connected with a U disk,it will communicate with the U disk as a host device and supply power to USB OTGThe USB_OTG1_ID is a pin for OTG device recognizing.In this circuit,it’s also a control pin for the5V power supply direction.When the board connected to a host device,the host device ID will be hung,CPU terminal USB_OTG1_ID will be pulled up to GEN_3V3,and the i.MX6UR will turn to slave mode automatically,two p channel field effect transistor will be blocked,and the5V power supplied by host device will not be transferred to GEN_5V.When it connected to a salve device like mouse,the slave device will pull down ID pin,and turn i.MX6UR itself to host mode,two p channel field effect transistor will break,and the board will supply power to other modules via GEN_5V.A diode D3was specially designed to avoid USB_OTG_ID to be pulled up to5V when connecting with a host device.3.4.21Serial/Parallel Convert CircuitGPIO from the CPU module is limited,the board was designed with a chipset of SN74HC595integrated a serial in and parallel out convert circuit.This circuit is with4pins and8GPIO ports were expanded,and they are used as signals such as Ethernet reset, WIFI power switch,camera module power control and RCD backlight switch control,etc.Appendix1Hardware Design Guideline1.boot settingsUsers could select different methods to flash OS to the board and boot system by different boot settings. Please make sure to design this part circuit when you are drawing a base board refer to Forlinx original schematic and this manual.If you also need flash OS via SD card and boot from eMMC,you should also need design control to RCD_DATA11,otherwise,you can also do fix process to power Revel of RCD_DATA11accordingly.2.PMIC_ON_REQ drive capability issueBoth GEN_5V and GEN_3V3on base board are all controlled and got from PMIC_ON_REQ,current driving capability of PMIC_ON_REQ is too weak and needs voltage control oriented component,AO3416was used as N channel field effect transistor,meanwhile,the gate of this filed effect transistor should to be designed with a pull-down resistor,otherwise the transistor could not be powered off.3.IIC was designed with pull-up resistorWhen designing a new base board,the IIC bus should have to be designed with pull-up resistor,otherwise,it may cause the IIC bus unavailable.The current two IIC buses on base board were both pulled up to3.3V via10k resistors.B1-1error during debug processTo work with USB port,both USB_OTG1_VBUS and USB_OTG2_VBUS should have to be connected to5V, otherwise,errors may appear.Currently,these two pins are both connected to GNE_5V via a0Ωresistor.5.Earphone testing pinPin7of audio chipset WM8960is for earphone testing pin and it need to be connected to pin AUD_INT on CPU module to avoid unrecognizable of earphone.6.Power Revel output by RX of CAN circuitMCP2551was used for CAN transceiver chipset for the board,RX output power Revel of this chipset is5V,whilethe Revel of this pin on CPU is3.3V,to avoid effect of CPU internal3.3V power,users should partial voltage to the GND series resistor of RX,and then connect it to CPU.7.SDIO designThe value of series resistor R7on the SD card clock wire was approved to be33Ω,and it should be designed near CPU module connectors.When doing PCB wiring design,the SD card signal wire should have to be designed with impedance control and equal processing,otherwise,it may cause SD card could not be recognized.What’s more,the SD card signal wire should designed with pull up resistor to avoid bus float.8.Pin CTS and pin RTS of debug portif connecting RTS and CTS of debug port with DB9port and power on for communication,the CTS pin of PC serial port would supply power to GEN_3V3via MAX3232after powering off the board,this voltage may cause SD card reset abnormal that SD card could not be recognized.Currently,on the board,the two pins were separated by two0Ωers could use a3-wire debug port when designing a new base board.9.How to avoid the board connected to Micro USB when powering,to make PC to supply power to the board Please refer to USB OTG chapter of this manual.Appendix2connector dimension。
Silicon Labs EFR32MG 2.4 GHz 19.5 dBm 无线模组板参考手册说明书
EFR32MG 2.4 GHz 19.5 dBm Radio BoardBRD4151A Reference Manualance, low energy wireless solution integrated into a small formfactor package.By combining a high performance 2.4 GHz RF transceiver with an energy efficient 32-bitMCU, the family provides designers the ultimate in flexibility with a family of pin-compati-ble devices that scale from 128/256 kB of flash and 16/32 kB of RAM. The ultra-lowpower operating modes and fast wake-up times of the Silicon Labs energy friendly 32-bit MCUs, combined with the low transmit and receive power consumption of the 2.4GHz radio, result in a solution optimized for battery powered applications.To develop and/or evaluate the EFR32 Mighty Gecko, the EFR32MG Radio Board canbe connected to the Wireless Starter Kit Mainboard to get access to display, buttons andadditional features from Expansion Boards.Introduction 1. IntroductionThe EFR32 Mighty Gecko Radio Boards provide a development platform (together with the Wireless Starter Kit Mainboard) for the Silicon Labs EFR32 Mighty Gecko Wireless System on Chips and serve as reference designs for the matching network of the RF inter-face.The BRD4151A Radio Board is designed to operate in the 2400-2483.5 MHz band with the RF matching network optimized to operate with 19.5 dBm output power.To develop and/or evaluate the EFR32 Mighty Gecko, the BRD4151A Radio Board can be connected to the Wireless Starter Kit Main-board to get access to display, buttons and additional features from Expansion Boards and also to evaluate the performance of the RF interface.2. Radio Board Connector2.1 IntroductionThe board-to-board connector scheme allows access to all EFR32MG1 GPIO pins as well as the RESETn signal. For more information on the functions of the available pin functions, see the EFR32MG1 data sheet.2.2 Radio Board Connector Pin AssociationsThe figure below shows the pin mapping on the connector to the radio pins and their function on the Wireless Starter Kit Mainboard.GND F9 / PA3 / VCOM.#RTS_#CS 3v3UIF_BUTTON1 / PF7 / P36P200Upper RowNC / P38NC / P40NC / P42NC / P44DEBUG.TMS_SWDIO / PF1 / F0DISP_ENABLE / PD15 / F14UIF_BUTTON0 / PF6 / F12DISP_EXTCOMIN / PD13 / F10VCOM.#CTS_SCLK / PA2 / F8#RESET / F4DEBUG.TDO_SWO / PF2 / F2DISP_SI / PC6 / F16VCOM.TX_MOSI / PA0 / F6PTI.DATA / PB12 / F20DISP_EXTCOMIN / PD13 / F18USB_VBUS5VBoard ID SCLGND Board ID SDAUSB_VREG F7 / PA1 / VCOM.RX_MISO F5 / PA5 / VCOM_ENABLE F3 / PF3 / DEBUG.TDI F1 / PF0 / DEBUG.TCK_SWCLK P45 / NC P43 / NCP41 / NCP39 / NCP37 / High / SENSOR_ENABLEF11 / PF5 / UIF_LED1F13 / PF7 / UIF_BUTTON1F15 / PC8 / DISP_SCLK F17 / PD14 / DISP_SCS F19 / PB13 / PTI.SYNC F21 / PB11 / PTI.CLK GNDVMCU_INVCOM.#CTS_SCLK / PA2 / P0P201Lower RowVCOM.#RTS_#CS / PA3 / P2PD10 / P4PD11 / P6GND VRF_INP35 / PD15 / DISP_ENABLE P7 / PC9P5 / PC8 / DISP_SCLK P3 / PC7P1 / PC6 / DISP_SI P33 / PD14 / DISP_SCSP31 / PD13 / DISP_EXTCOMIN P29 / NCP27 / NC P25 / NC P23 / NC P21 / NC P19 / NC P17 / NC P15 / NC P13 / PC11P11 / PA1 / VCOM.RX_MISO P9 / PA0 / VCOM.TX_MOSI UIF_BUTTON0 / PF6 / P34UIF_LED1 / PF5 / P32UIF_LED0 / PF4 / P30DEBUG.TDO_SWO / PF2 / P28DEBUG.TMS_SWDIO / PF1 / P26DEBUG.TCK_SWCLK / PF0 / P24PTI.SYNC / PB13 / P22PTI.DATA / PB12 / P20PTI.CLK / PB11 / P18VCOM_ENABLE / PA5 / P16PA4 / P14PC10 / P12DEBUG.TDI / PF3 / P10PD12 / P8Figure 2.1. BRD4151A Radio Board Connector Pin MappingRadio Board Connector3. Radio Board Block Summary3.1 IntroductionThis section gives a short introduction to the blocks of the BRD4151A Radio Board.3.2 Radio Board Block DiagramThe block diagram of the EFR32MG Radio Board is shown in the figure below.Figure 3.1. BRD4151A Block Diagram3.3 Radio Board Block Description3.3.1 Wireless MCUThe BRD4151A EFR32 Mighty Gecko Radio Board incorporates an EFR32MG1P232F256GM48 Wireless System on Chip featuring 32-bit Cortex-M4 with FPU core, 256 kB of flash memory and 32 kB of RAM and a 2.4 GHz band transceiver with output power up to 19.5 dBm. For additional information on the EFR32MG1P232F256GM48, refer to the EFR32MG1 Data Sheet.3.3.2 LF Crystal Oscillator (LFXO)The BRD4151A Radio Board has a 32.768 kHz crystal mounted.3.3.3 HF Crystal Oscillator (HFXO)The BRD4151A Radio Board has a 38.4 MHz crystal mounted.3.3.4 Matching Network for 2.4 GHzThe BRD4151A Radio Board incorporates a 2.4 GHz matching network which connects the 2.4 GHz TRX pin of the EFR32MG1 to the one on-board printed Inverted-F antenna. The component values were optimized for the 2.4 GHz band RF performace and current con-sumption with 19.5 dBm output power.For detailed description of the matching network, see Chapter 4.2.1 Description of the 2.4 GHz RF Matching.| Smart. Connected. Energy-friendly.Rev. 1.7 | 33.3.5 Inverted-F AntennaThe BRD4151A Radio Board includes a printed Inverted-F antenna (IFA) tuned to have close to 50 Ohm impedance at the 2.4 GHz band.For detailed description of the antenna see Chapter 4.5 Inverted-F Antenna.3.3.6 UFL ConnectorTo be able to perform conducted measurements, Silicon Labs added an UFL connector to the Radio Board. The connector allows an external 50 Ohm cable or antenna to be connected during design verification or testing.Note: By default the output of the matching network is connected to the printed Inverted-F antenna by a series component. It can be connected to the UFL connector as well through a series 0 Ohm resistor which is not mounted by default. For conducted measurements through the UFL connector the series component to the antenna should be removed and the 0 Ohm resistor should be mounted (see Chapter 4.2 Schematic of the RF Matching Network for further details).3.3.7 Radio Board ConnectorsTwo dual-row, 0.05” pitch polarized connectors make up the EFR32MG Radio Board interface to the Wireless Starter Kit Mainboard. For more information on the pin mapping between the EFR32MG1P232F256GM48 and the Radio Board Connector, refer to Chapter 2.2 Radio Board Connector Pin Associations.4. RF Section4.1 IntroductionThis section gives a short introduction to the RF section of the BRD4151A.4.2 Schematic of the RF Matching NetworkThe schematic of the RF section of the BRD4151A Radio Board is shown in the following figure.U1BPath Inverted-F Antenna2.4 GHz Matching Figure 4.1. Schematic of the RF Section of the BRD4151A4.2.1 Description of the 2.4 GHz RF MatchingThe 2.4 GHz matching connects the 2G4RF_IOP pin to the on-board printed Inverted-F Antenna. The 2G4RF_ION pin is connected to ground. For higher output powers (13 dBm and above) beside the impedance matching circuitry it is recommended to use additional harmonic filtering as well at the RF output. The targeted output power of the BRD4151A board is 19.5 dBm. As a result, the RF output of the IC is connected to the antenna through a four-element impedance matching and harmonic filter circuitry.For conducted measurements the output of the matching network can also be connected to the UFL connector by relocating the series R1 resistor (0 Ohm) to the R2 resistor position between the output of the matching and the UFL connector.4.3 RF Section Power SupplyOn the BRD4151A Radio Board the supply pin of the RF Analog Power (RFVDD) is connected directly ot the output of the on-chip DC-DC converter while the supply for the 2.4 GHz PA (PAVDD) is provided directly by the mainboard. This way, by default, the DC-DC converter provides 1.8 V for the RF analog section, the mainboard provides 3.3 V for the PA (for details, see the schematic of the BRD4151A).4.4 Bill of Materials for the 2.4 GHz MatchingThe Bill of Materials of the 2.4 GHz matching network of the BRD4151A Radio Board is shown in the following table.Table 4.1. Bill of Materials for the BRD4151A 2.4 GHz 19.5 dBm RF Matching Network | Smart. Connected. Energy-friendly.Rev. 1.7 | 54.5 Inverted-F AntennaThe BRD4151A Radio Board includes an on-board printed Inverted-F Antenna tuned for the 2.4 GHz band. Due to the design restric-tions of the Radio Board the input of the antenna and the output of the matching network can't be placed directly next to each other. Therefore, a 50 Ohm transmission line was necessary to connect them. The resulting impedance and reflection measured at the output of the matcing network are shown in the following figure. As it can be observed the impedance is close to 50 Ohm (the reflection is better than -10 dB) for the entire 2.4 GHz band.Figure 4.2. Impedance and Reflection of the Inverted-F Antenna of the BRD4151A| Smart. Connected. Energy-friendly.Rev. 1.7 | 65. Mechanical DetailsThe BRD4151A EFR32 Mighty Gecko Radio Board is illustrated in the figures below.45 mmFigure 5.1. BRD4151A Top View5 mm ConnectorConnectorFigure 5.2. BRD4151A Bottom ViewMechanical DetailsRev. 1.7 | 7EMC Compliance 6. EMC Compliance6.1 IntroductionCompliance of the fundamental and harmonic levels is tested against the following standards:• 2.4 GHz:•ETSI EN 300-328•FCC 15.2476.2 EMC Regulations for 2.4 GHz6.2.1 ETSI EN 300-328 Emission Limits for the 2400-2483.5 MHz BandBased on ETSI EN 300-328 the allowed maximum fundamental power for the 2400-2483.5 MHz band is 20 dBm EIRP. For the unwan-ted emissions in the 1 GHz to 12.75 GHz domain the specified limit is -30 dBm EIRP.6.2.2 FCC15.247 Emission Limits for the 2400-2483.5 MHz BandFCC 15.247 allows conducted output power up to 1 Watt (30 dBm) in the 2400-2483.5 MHz band. For spurious emmissions the limit is -20 dBc based on either conducted or radiated measurement, if the emission is not in a restricted band. The restricted bands are speci-fied in FCC 15.205. In these bands the spurious emission levels must meet the levels set out in FCC 15.209. In the range from 960 MHz to the frequency of the 5th harmonic it is defined as 0.5 mV/m at 3 m distance (equals to -41.2 dBm in EIRP).Additionally, for spurious frequencies above 1 GHz, FCC 15.35 allows duty-cycle relaxation to the regulatory limits. For the EmberZNet PRO the relaxation is 3.6 dB. Therefore, the -41.2 dBm limit can be modified to -37.6 dBm.If operating in the 2400-2483.5 MHz band the 2nd, 3rd and 5th harmonics can fall into restricted bands. As a result, for those the -37.6 dBm limit should be applied. For the 4th harmonic the -20 dBc limit should be applied.6.2.3 Applied Emission Limits for the 2.4 GHz BandThe above ETSI limits are applied both for conducted and radiated measurements.The FCC restricted band limits are radiated limits only. Besides that, Silicon Labs applies those to the conducted spectrum i.e., it is assumed that, in case of a custom board, an antenna is used which has 0 dB gain at the fundamental and the harmonic frequencies. In that theoretical case, based on the conducted measurement, the compliance with the radiated limits can be estimated.The overall applied limits are shown in the table below.Table 6.1. Applied Limits for Spurious Emissions for the 2.4 GHz Band | Smart. Connected. Energy-friendly.Rev. 1.7 | 87. RF Performance7.1 Conducted Power MeasurementsDuring measurements, the EFR32MG Radio Board was attached to a Wireless Starter Kit Mainboard which was supplied by USB. The voltage supply for the Radio Board was 3.3 V.7.1.1 Conducted Measurements in the 2.4 GHz bandThe BRD4151A board was connected directly to a Spectrum Analyzer through its UFL connector (the R1 resistor (0 Ohm) was removed and a 0 Ohm resistor was soldered to the R2 resistor position). During measurements, the voltage supply for the board was 3.3 V provi-ded by the mainboard. The supply for the radio (RFVDD) was 1.8 V provided by the on-chip DC-DC converter, the supply for the power amplifier (PAVDD) was 3.3 V (for details, see the schematic of the BRD4151A). The transceiver was operated in continuous carrier transmission mode. The output power of the radio was set to the maximum level.The typical output spectrum is shown in the following figure.Figure 7.1. Typical Output Spectrum of the BRD4151AAs it can be observed, the fundamental is slightly lower than 19.5 dBm and the strongest unwanted emission is the double-frequency harmonic and it is under the -37.6 dBm applied limit.Note: The conducted measurement is performed by connecting the on-board UFL connector to a Spectrum Analyzer through an SMA Conversion Adapter (P/N: HRMJ-U.FLP(40)). This connection itself introduces approximately a 0.3 dB insertion loss.RF PerformanceRev. 1.7 | 97.2 Radiated Power MeasurementsDuring measurements, the EFR32MG Radio Board was attached to a Wireless Starter Kit Mainboard which was supplied by USB. The voltage supply for the Radio Board was 3.3 V. The radiated power was measured in an antenna chamber by rotating the DUT 360degrees with horizontal and vertical reference antenna polarizations in the XY , XZ and YZ cuts. The measurement axes are shown inthe figure below.Figure 7.2. DUT: Radio Board with the Wireless Starter Kit Mainboard (Illustration)Note: The radiated measurement results presented in this document were recorded in an unlicensed antenna chamber. Also the radi-ated power levels may change depending on the actual application (PCB size, used antenna, and so on). Therefore, the absolute levels and margins of the final application are recommended to be verified in a licensed EMC testhouse.7.2.1 Radiated Measurements in the 2.4 GHz bandFor the transmitter antenna, the on-board printed Inverted-F antenna of the BRD4151A board was used (the R1 resistor (0 Ohm) was mounted). During the measurements the board was attached to a Wireless Starter Kit Mainboard (BRD4001 (Rev. A02) ) which was supplied through USB. During measurements, the voltage supply for the board was 3.3 V provided by the mainboard. The supply for the radio (RFVDD) was 1.8 V provided by the on-chip DC-DC converter, the supply for the power amplifier (PAVDD) was 3.3 V (for details, see the schematic of the BRD4151A). The transceiver was operated in continuous carrier transmission mode. The output power of the radio was set to the maximum level.The results are shown in the table below.Table 7.1. Maximums of the Measured Radiated Powers of BRD4151AAs it can be observed, thanks to the high gain of the Inverted-F antenna, the level of the fundamental is higher than 19.5 dBm. The strongest harmonic is the double-frequency one but its level is under -45 dBm.RF PerformanceEMC Compliance Recommendations 8. EMC Compliance Recommendations8.1 Recommendations for 2.4 GHz ETSI EN 300-328 complianceAs it was shown in the previous chapter, the radiated power of the fundamental of the BRD4151A EFR32 Mighty Gecko Radio Board complies with the 20 dBm limit of the ETSI EN 300-328 in case of the conducted measurement but due to the high antenna gain the radiated power is higher than the limit by 2 dB. In order to comply, the output power should be reduced (with different antennas, de-pending on the gain of the used antenna, the necessary reduction can be different). The harmonic emissions are under the -30 dBm limit. Although the BRD4151A Radio Board has an option for mounting a shielding can, that is not required for the compliance.8.2 Recommendations for 2.4 GHz FCC 15.247 complianceAs it was shown in the previous chapter, the radiated power of the fundamental of the BRD4151A EFR32 Mighty Gecko Radio Board complies with the 30 dBm limit of the FCC 15.247. The harmonic emissions are under the -37.6 dBm applied limit both in case of the conducted and the radiated measurements. Although the BRD4151A Radio Board has an option for mounting a shielding can, that is not required for the compliance.Board Revisions 9. Board RevisionsTable 9.1. BRD4151A Radio Board RevisionsNote: The silkscreen marking on the board (e.g., PCBxxxx A00) denotes the revision of the PCB. The revision of the actual Radio Board can be read from the on-board EEPROM.Errata 10. ErrataTable 10.1. BRD4151A Radio Board ErrataDocument Revision History 11. Document Revision HistoryRevision 1.72016-11-20Minor editorial updates.Revision 1.62016-10-31Corrected error in radio board connector pinout diagram.Revision 1.52016-05-24Updating Board Revisions content. Fixing Errata description.Revision 1.42016-05-05Adding Introduction chapter; moving SoC Description chapter (short ver.) to Block Description chapter. Minor improvements.Revision 1.32016-02-11Addign RF Section Power Supply chapter. Minor improvements.Revision 1.22016-01-28Fixing image render problem.Revision 1.12015-25-25Updating Inverted-F Antenna Chapter and radiated measurement results based on board revision B02.Revision 1.02015-11-27Initial release.Table of Contents1. Introduction (1)2. Radio Board Connector (2)2.1 Introduction (2)2.2 Radio Board Connector Pin Associations (2)3. Radio Board Block Summary (3)3.1 Introduction (3)3.2 Radio Board Block Diagram (3)3.3 Radio Board Block Description (3)3.3.1 Wireless MCU (3)3.3.2 LF Crystal Oscillator (LFXO) (3)3.3.3 HF Crystal Oscillator (HFXO) (3)3.3.4 Matching Network for 2.4 GHz (3)3.3.5 Inverted-F Antenna (4)3.3.6 UFL Connector (4)3.3.7 Radio Board Connectors (4)4. RF Section (5)4.1 Introduction (5)4.2 Schematic of the RF Matching Network (5)4.2.1 Description of the 2.4 GHz RF Matching (5)4.3 RF Section Power Supply (5)4.4 Bill of Materials for the 2.4 GHz Matching (5)4.5 Inverted-F Antenna (6)5. Mechanical Details (7)6. EMC Compliance (8)6.1 Introduction (8)6.2 EMC Regulations for 2.4 GHz (8)6.2.1 ETSI EN 300-328 Emission Limits for the 2400-2483.5 MHz Band (8)6.2.2 FCC15.247 Emission Limits for the 2400-2483.5 MHz Band (8)6.2.3 Applied Emission Limits for the 2.4 GHz Band (8)7. RF Performance (9)7.1 Conducted Power Measurements (9)7.1.1 Conducted Measurements in the 2.4 GHz band (9)7.2 Radiated Power Measurements (10)7.2.1 Radiated Measurements in the 2.4 GHz band (10)8. EMC Compliance Recommendations (11)8.1 Recommendations for 2.4 GHz ETSI EN 300-328 compliance (11)8.2 Recommendations for 2.4 GHz FCC 15.247 compliance (11)9. Board Revisions (12)10. Errata (13)11. Document Revision History (14)Table of Contents (15)Silicon Laboratories Inc.400 West Cesar Chavez Austin, TX 78701USASimplicity StudioOne-click access to MCU and wireless tools, documentation, software, source code libraries & more. Available for Windows, Mac and Linux!IoT Portfolio /IoTSW/HW/simplicityQuality/qualitySupport and CommunityDisclaimerSilicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Silicon Labs shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any Life Support System without the specific written consent of Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.Trademark InformationSilicon Laboratories Inc.® , Silicon Laboratories®, Silicon Labs®, SiLabs® and the Silicon Labs logo®, Bluegiga®, Bluegiga Logo®, Clockbuilder®, CMEMS®, DSPLL®, EFM®, EFM32®, EFR, Ember®, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZRadio®, EZRadioPRO®, Gecko®, ISOmodem®, Precision32®, ProSLIC®, Simplicity Studio®, SiPHY®, Telegesis, the Telegesis Logo®, USBXpress® and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. All other products or brand names mentioned herein are trademarks of their respective holders.。
常用芯片资料
型号资料名称4N35/4N36/4N37光电耦合器AD7520/AD7521/AD7530/AD7521D/A转换器AD754112位D/A转换器ADC0802/ADC0803/ADC08048位A/D转换器ADC0808/ADC08098位A/D转换器ADC0831/ADC0832/ADC0834/ADC08388位A/D转换器CA3080/CA3080A OTA跨导运算放大器CA3140/CA3140A BiMOS运算放大器DAC0830/DAC08328位D/A转换器ICL7106,ICL71073位半A/D转换器ICL7116,ICL71173位半A/D转换器ICL7650载波稳零运算放大器ICL7660/MAX1044CMOS电源电压变换器ICL8038单片函数发生器ICM721610MHz通用计数器ICM7226带BCD输出10MHz通用计数器ICM7555/7555CMOS单/双通用定时器ISO2-CMOS MT8880C DTMF收发器LF351JFET输入运算放大器LF353JFET输入宽带高速双运算放大器 LM117/LM317A/LM317三端可调电源LM124/LM124/LM324低功耗四运算放大器LM137/LM337三端可调负电压调整器LM139/LM239/LM339低功耗四电压比较器LM158/LM258/LM358低功耗双运算放大器LM193/LM293/LM393低功耗双电压比较器LM201/LM301通用运算放大器LM231/LM331精密电压—频率转换器LM285/LM385微功耗基准电压二极管LM308A精密运算放大器LM386低压音频小功率放大器LM399带温度稳定器精密电压基准电路LM431可调电压基准电路LM567/LM567C锁相环音频译码器LM741运算放大器LM831双低噪声音频功率放大器LM833双低噪声音频放大器LM8365双定时LED电子钟电路MAX0380.1Hz-20MHz单片函数发生器MAX2325V电源多通道RS232驱动器/接收器MC1403 2.5V精密电压基准电路MC1404 5.0v/6.25v/10v基准电压MC1413/MC1416七路达林顿驱动器MC145026/MC145027/MC145028编码器/译码器MC145403-5/8RS232驱动器/接收器MC145406RS232驱动器/接收器MC145407RS232驱动器/接收器MC145583RS232驱动器/接收器MC145740DTMF接收器MC1488二输入与非四线路驱动器MC1489四施密特可控线路驱动器MC2833低功率调频发射系统MC3362低功率调频窄频带接收器MC4558双运算放大器MC7800系列 1.0A三端正电压稳压器MC78L00系列0.1A三端正电压稳压器MC78M00系列0.5A三端正电压稳压器MC78T00系列 3.0A正电压稳压器MC7900系列 1.0A三端负电压稳压器MC79L00系列0.1A三端负电压稳压器MC79M00系列0.5A三端负电压稳压器Microchip PIC系列单片机RS232通讯应用MM5369 3.579545MHz-60Hz 17级分频振荡器MOC3009/MOC3012双向可控硅输出光电耦合器MOC3020/MOC3023双向可控硅输出光电耦合器MOC3081/MOC3082/MOC3083过零双向可控硅输出光电耦合器MOC8050无基极达林顿晶体管输出光电耦合器 MOC8111无基极晶体管输出光电耦合器MT8870DTMF双音频接收器MT8888C DTMF 收发器NE5532/NE5532A双低噪声运算放大器NE5534/SE5534低噪声运算放大器NE555/SA555单时基电路NE556/SA556/SE556双时基电路NE570/NE571/SA571音频压缩扩展器OP07低电压飘移运算放大器OP27低噪音精密运算放大器OP37低噪音高速精密运算放大器OP77低电压飘移运算放大器OP90精密低电压微功耗运算放大器PC817/PC827/PC847高效光电耦合器PT2262无线遥控发射编码器芯片PT2272无线遥控接收解码器芯片SG2524/SG3524脉宽调制PWMST7537电力线调制解调器电路TDA15212×12W Hi-Fi 音频功率放大器 TDA203014W Hi-Fi 音频功率放大器TDA26162×12W Hi-Fi 音频功率放大器TDA7000T FM 单片调频接收电路TDA7010T FM 单片调频接收电路TDA7021T FM MTS单片调频接收电路TDA7040T低电压锁相环立体声解码器TDA7050低电压单/双声道功率放大器TL062/TL064低功耗JFET输入运算放大器TL071/TL072/TL074低噪声JFET输入运算放大器TL082/TL084JFET 宽带高速运算放大器TL494脉宽调制PWMTL594精密开关模式脉宽调制控制TLP521/1-4光电耦合器TOP100-4TOPSwitch 三端PWM开关电源电路TOP200-4TOPSwitch 三端PWM开关电源电路TOP209/TOP210TOPSwitch 三端PWM开关电源电路TOP221-7TOPSwitch-Ⅱ 三端PWM开关电源电路 TOP232-4TOPSwitch-FX 五端柔韧设计开关电源电路 TOP412/TOP414TOPSwitch 三端PWM DC-DC 开关电源 ULN2068 1.5A/50V 4路达林顿驱动电路ULN2803500mA/50V 8路达林顿驱动电路ULN2803/ULN2804线性八外围驱动器阵列VFC32电压—频率/频率—电压转换器LM211 高灵活性电压比较器LM239 四单抑制器比较器LM2901 低功耗低失调四电压比较器 LM2903 NSC [DATA] 低功耗低失调双电压比较器 LM211 高灵活性电压比较器LM239 四单抑制器比较器LM2901 低功耗低失调四电压比较器903 NSC [DATA] 低功耗低失调双电压比较器LM293 NSC [DATA] 低偏置电压双比较器LM311 单电压比较器 LM311(TI)NSC [DATA] 四电压比较器 HA17339/LM339(TI)NSC [DATA] 低功耗低失调双电压比较器 HA17393LM711 单电压比较器MC3302 四单电源比较器MC3405 双运算放大器和双比较器CD4574 四可编程电压比较器CD4575 双可编程运放/比较器备注10-Bit,12-Bit,Multiplying D/A Converters12-Bit,Multiplying D/A Converter8-Bit,Microprocessor-Compatibie,A/D Converters8-Bit μP Compatibie A/D Converters with 8-Channel Multiplexer8-Bit Serial I/O A/D Converters with Multiplexer Options8-Bit μP Compatibie,Double-Buffered D to A ConvertersICL7106,ICL7107,ICL7106S,ICL7107S 3位半LCD/LED显示A/D转换器（ICL7106,ICL7107,ICL7106S,ICL7 ICL7116,ICL7117 3位半LCD/LED显示数据保持A/D转换器（ICL7116,ICL7117 ,3 1/2 Digit,LCD/LED Di ICM7216A/ICM7216B/ICM7216D 10MHz通用计数器、数字频率计、计数器、周期测量仪等仪器的单片专用ICM7226A/ICM7226B 带BCD输出10MHz通用计数器、数字频率计、计数器、周期测量仪等仪器的单片专用ICM7555/ICM7555 CMOS General Purpose TimersISO2-CMOS MT8880C Integrated DTMF TransceiverLM124/LM124/LM324/LM2902 低功耗四运算放大器LM139/LM239/LM339/LM2901/LM3302 低功耗四电压比较器LM158/LM258/LM358/LM2904 低功耗双运算放大器LM193/LM293/LM393/LM2903 低功耗双电压比较器LM231A/LM231/LM331A/LM331 精密电压—频率转换器LM199/LM299/LM399/LM3999 带温度稳定器精密电压基准电路LM741A/LM741E/LM741/LM741C 运算放大器LM8365 双定时LED电子钟电路，中文杂志扫描的PDF文件。
Simplex
Individually addressable manual fire alarm stations for releasing applications with:∙Power and data supplied via IDNet or MAPNET II addressable communications using a single wire pair∙Operation that complies with ADA requirements∙Visible LED indicator that flashes duringcommunications and is on steady when the station hasbeen activated∙Pull lever that protrudes when alarmed∙Break-rod supplied (use is optional)∙Dual action push and pull operation∙Label kit provides for six varieties of releasing applications (ordered separately)Compatible with the following Simplex® Releasing System control panels equipped with either IDNet or MAPNET II communications:∙Model Series 4100ES, 4010ES, and 4010∙Installed 4100, 4120, and 4020 systemsCompact construction:∙Electronics module enclosure minimizes dust infiltration ∙Allows mounting in standard electrical boxes∙Screw terminals for wiring connectionsTamper resistant reset key lock∙Locks are keyed the same as Simplex fire alarm cabinets Multiple mounting options:∙Surface or semi-flush with standard boxes or matching Simplex boxes∙Flush mount adapter kit∙Adapters are available for retrofitting to commonly available existing boxesUL listed to Standard 38These 4099 series addressable manual stations combinethe familiar Simplex housing with a compact communication module providing easy installation for releasing applications. The integral individual addressable module (IAM) monitors status and communicates changes to the connected control panel via MAPNET II or IDNet communications wiring.A blank area on the front of the station allows the selection of a label to match the specific releasing application (label kit is ordered separately). (Refer to data sheet S4099-0005 for standard Simplex addressable manual stations.)* This product has been approved by the California State Fire Marshal (CSFM) pursuant to Section 13144.1 of the California Health and Safety Code. See CSFM Listing 7150-0026:224 for allowable values and/or conditions concerning material presented in this document. Additional listings may be applicable; contact your local Simplex product supplier for the latest status. Listings and approvals under Simplex Time Recorder Co. are the property of Tyco Safety Products Westminster.4099-9015 Addressable Manual Station for Releasing Applications (with Manual Release label from4099-9802 Label Kit)Label Kit4099-9802Activation requires that a spring loaded interference plate (marked PUSH) be pushed back to access the station pull lever with a firm downward pull that activates the alarm switch. Completing the action breaks an internal plastic break-rod (visible below the pull lever, use is optional). The use of a break-rod can be a deterrent to vandalism without interfering with the minimum pull requirements needed for easy activation. The pull lever latches into the alarm position and remains extended out of the housing to provide a visible indication.Station reset requires the use of a key to reset the manual station lever and deactivate the alarm switch. (If the break-rod is used, it must be replaced.)Station testing is performed by physical activation of the pull lever. Electrical testing can be also performed by unlocking the station housing to activate the alarm switch.Releasing System PeripheralsUL, ULC, CSFM Listed;IDNet or MAPNET II Communicating Devices; FM Approved *Addressable Manual Stations for Releasing ApplicationsAddressable Manual StationsModelDescription4099-9015 Double action, Push operation, Addressable manual station; red housing with white letters and white pulllever; requires label kit 4099-98024099-9802Label kit, white lettering on red background; select the label required for the specific releasing application; types include: Clean Agent, Extinguishing, Carbon Dioxide, Foam System, Sprinkler, and ManualAccessoriesModelDescriptionReference2975-9178 Surface mount steel box, redRefer to page 3 for dimensions 2975-9022 Cast aluminum surface mount box, red2099-9813 Semi-flush trim plate for double gang switch box, red Typically for retrofit, refer to page 4 2099-9814 Surface trim plate for Wiremold box V5744-2, red 2099-9819 Flush mount adapter kit, black Refer to page 4 for details2099-9820Flush mount adapter kit, beige2099-9804 Replacement break-rodPower and Communications IDNet or MAPNET II communications, 1 address per station, up to 2500 ft (762 m) from fire alarm control panel, up to 10,000 ft (3048 m) total wiring distance (including T-Taps)Address Means Dipswitch, 8 positionWire ConnectionsScrew terminal for in/out wiring, for 18 to 14 AWG wire (0.82 mm 2 to 2.08 mm 2)UL Listed Temperature Range 32° to 120° F (0° to 49° C) intended for indoor operation Humidity Range Up to 93% RH at 100° F (38° F) Housing Color Red with white raised letteringMaterialHousing and pull lever are Lexan polycarbonate or equal Pull Lever ColorWhite with red raised letteringHousing Dimensions 5” H x 3 ¾” W x 1” D (127 mm x 95 mm x 25 mm) Installation Instructions579-11354" (102 mm) square box, 2-1/8" (54 mm) minimum 4" Square Box MountSemi-Flush Mount Side ViewSingle Gang Box MountSingle gang box, 2-1/2" deepPreferred Mounting. For surface mounting of theseaddressable manual stations, the preferred electrical boxes are shown in the illustration to the right.Additional MountingReference. Refer to page 4 for Wiremold box mounting compatibility.2975-9178 Box5-3/16" H x 4" W x 2-3/16" D (132 mm x 102 mm x 56 mm)Knockouts located top and bottom2975-9022 Cast Box 5" H x 3-7/8" W x 2-3/16" D (127 mm x 98 mm x 56 mm)4099-9015 Addressable Manual StationFor retrofit and new installations, additional compatible mounting boxes and the required adapter plates are shown in the illustration to the right.Front ViewFlush mount adapter kit Side ViewTyco Fire Protection Products • Westminster, MA • 01441-0001 • USAS4099-0006 11/2014TYCO, SIMPLEX, and the product names listed in this material are marks and/or registered marks. Unauthorized use is strictly prohibited. Lexan is a trademark of the General Electric Co. Wiremold is a trademark of the Wiremold Company.。
ARM Cortex-M7核基于SAMV71Q21RT的辐射抗性微控制器说明书
SummaryThe SAMV71Q21RT is a radiation tolerant microcontroller (MCU) providing the best combination of connectivity interfaces along with highest processing levels. The SAMV71Q21RT is designed for enhanced radiation performances, extreme temperature and high reliability in aerospace application. It takes advantage of the powerful M7 core coupled with high-bandwidth communication interfaces such as CAN FD and Ethernet TSN.SAMV71Q21RT ARM ®MicrocontrollerKey FeaturesCore• ARM ® Cortex ®-M7 Core running up to 300 MHz, delivering 600 DMIPS• 16 Kbytes of ICache and 16 Kbytes of DCache with Error Code Correction (ECC)• Single- and double-precision hardware Floating Point Unit (FPU)• Memory Protection Unit (MPU) with 16 zones • DSP Instructions, Thumb ®-2 Instruction Set• Embedded Trace Module (ETM) with instruction trace stream, including Trace Port Interface Unit (TPIU)Memory• 2048 Kbytes embedded Flash with unique identifier and user signature for user-defined data• 384 Kbytes embedded Multi-port SRAM• Tightly Coupled Memory (TCM) interface with four configu -rations (disabled, 2 x 32 Kbytes, 2 x 64 Kbytes, 2 x 128 Kbytes)• 16 Kbytes ROM with embedded Bootloader routines (UART0, USB) and IAP routines• 16-bit Static Memory Controller (SMC) with support for SRAM, PSRAM, LCD module, NOR and NAND Flash with on-the-fly scrambling• 16-bit SDRAM Controller (SDRAMC) interfacing up to 256 MB and with on-the-fly scramblingSystem• Embedded voltage regulator for single-supply operation• Power-on-Reset (POR), Brown-out Detector (BOD) and Dual Watchdog for safe operation• Quartz or ceramic resonator oscillators: 3 to 20 MHz main oscillator with failure detection, 12 MHz or 16 MHz needed for USB operations. Optional low-power 32.768 kHz for RTC or device clock.• RTC with Gregorian calendar mode, waveform generation in low-power modes• RTC counter calibration circuitry compensates for 32.768 kHz crystal frequency variations• 32-bit low-power Real-Time Timer (RTT)• High-precision main RC oscillator with 12 MHz defaultfrequency for device startup. In-application trimming access for frequency adjustment. 8/12 MHz are factory-trimmed.• 32.768 kHz crystal oscillator or slow RC oscillator as source of low-power mode device clock (SLCK)• One 500 MHz PLL for system clock, one 480 MHz PLL for USB high-speed operations • Temperature sensor•One dual-port 24-channel central DMA Controller (XDMAC)The Microchip name and logo and the Microchip logo are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ARM and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and other countries. All other trademarks mentioned herein are property of their respective companies. © 2018, Microchip Technology Incorporated. All Rights Reserved. 5/18DS00002650ASpace Environment• Full wafer lot traceability• 144-lead hermetic ceramic package • Space-grade screening and qualification• Total ionizing dose: dose at least 20 Krad, QML and ESCC • Heavy ions and protons test• Single event latch-up LET > 62 Mev•SEU full characterization at SEU full caracterization for all functional block• Estimated SER: 1 event every 1400 days (Core measure on LEO)Other Aerospace Application• Full wafer lot traceability • 144-lead plastic package• Extended temperature range –55°C/125°C • QML-N/AQEC/AEC-Q100 equivalent• Unitary burn-in and temperature cycling (opt.)• Neutrons latch-up immune •SEU full characterizationSAMV71Q21RT Tools GuideProduct Selection GuideMemorySystemCortex -M7300 MHzConnectivitySecurity User Interface Control System Performance• Deterministic code execution using TCM • Complex calculation and coprocessing (FPU)• Communication threads parallelism (Hmatrix architecture)• Low latency memories access • Scalable power saving modes•Operating system free RTOS supportedOngoing Port: RTEMS and Xstratum。
AD511-2 Active Iridium Antenna User Manual
TABLE OF CONTENTS1.FCC APPROVAL (3)1.1. FCC 15.19 (A) (3) (3)1.2. FCC 15.105 (B) (3)1.3. ICES-003 (3)1.4. U SER M ANUAL N OTICE FOR L ICENSE-E XEMPT R ADIO A PPARATUS (3)2.INTRODUCTION (4)3.MOUNTING AND OPERATION (5)4.FIGURES ................................................................................................................................................................ 6, 71.FCC Approval1.1. FCC 15.19 (a) (3)This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: -1.This device may not cause interference, and2.This device must accept any interference, including interference that may cause undesiredoperation of the device.1.2. FCC 15.105 (b)The equipment has been tested and found to comply with the limits for a Class B device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -•Reorient or relocate the receiving antenna.•Increase the separation between the equipment and receiver.•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.•Consult the dealer or an experienced radio/TV technician for help.1.3. ICES-003This Class B digital apparatus complies with Canadian ICES-003.er Manual Notice for License-Exempt Radio ApparatusThis device complies with Industry Canada license-exempt RSS Standard(s). Operation is subject to the following two conditions: -1.This device may not cause interference, and2.This device must accept any interference, including interference that may cause undesiredoperation of the device.2. IntroductionIridium telephones were originally designed to operate with a passive antenna, either an element attached directly to the handset, or a remote aerial connected with a short length of coaxial cable. Unfortunately, a signal loss of more than 3dB in a remote antenna’s connecting cable degrades performance due to attenuation of both the received and transmitted signals. A 3dB loss corresponds to approximately 10m of RG213U or 3m of RG58U coaxial cable, lengths that clearly restrict the mounting options for the antenna using standard down-leads.AD511-2 active Iridium antenna (figure 1 & figure 2) is designed for use with up to 160 meters of coaxial cable terminated with type ‘N’ connectors, and with coax lengths starting from 27meters – subject to AST advice.Designed for harsh environments, the AD511-2 consists of two RHCP dipole antenna housed within a 4mm thick GRP radome mounted on a common base. One antenna is for signal transmission and one for reception.AD511-2 has a linear power amplifier within the base and connected to the transmitting antenna compensates for signal loss incurred mainly by the connecting cable. Similarly, a low noise amplifier is attached to the receiving antenna via a low loss interdigital filter to boost the signal sent to the telephone. The interdigital filter has a bandwidth of 25 MHz centered on the Iridium band designed to attenuate any out of band interference that may arise, for example from nearby Inmarsat uplinks. Using manufacturing techniques proven for a range of extremely rugged GPS/DGP active antenna, the base is milled from aluminium and hard anodised, giving an attractive grey finish, which is mechanically resilient and resistant to corrosion. The antenna’s mass is 0.8kg.3.Mounting and OperationAD511-2 should be mounted with an unobstructed view of the sky. An aluminium bracket with V-bolts is provided to attach the antenna to horizontal or vertical masts or spars up to 50mm in diameter, figure 2. The bracket is shipped inverted at the centre of the AD511-2 antenna and should be detached, inverted, then reattached to antenna case using the mounting holes in the base.The coaxial down-lead is attached to the N-type connector on the underside of the antenna, figure 2. Wrapping the connectors with self-amalgamating tape is recommended for permanent installations and the cable should be taped or strapped to the spar as appropriate.AD511-2 antenna supplied with coaxial down-leads must be used with the accompanying AD511-3 DC Power Break-In Box (figure 3), which accepts +18V to +36V DC at 500mA. The down-lead must not be shortened by the user.AD511-3 Power Break-In should be positioned close to the telephone base- station or handset. The coaxial down-lead is then attached to the N type connector on the AD511-3 (figure 3 & figure 4).Earthing: - the AD-511-3 power breaking box is provided with an earth terminal. The box should be earthed via this connection with a short earthing lead connection to the system earth. Connection between the telephone and the AD511-3 is made with a coaxial cable terminated with TNC connectors. An adapter is provided with the Iridium handset, which enables a TNC terminated cable to be attached to the telephone. AD511-3 case has drilled flanges to enable permanent fixing.A 1m flying lead for the AD511-3 Power Break-In Box is provided for connection to the DC supply (+18 to 36 v DC at 500mA), which can be trimmed (or extended) if necessary. The red wire is connected to supply positive, whilst the blue wire is for either an isolated or grounded negative supply. AD511-3 is protected against output short-circuiting by a fuse, which is resettable by disconnecting the unit from the +18 to +36 v DC supply.With all connections made, the telephone can then be turned on and used as normal - it is transmitting into a load impedance equivalent to a matched passive antenna. The gains of the antenna transmitter and receiver are factory set to compensate for the total attenuation between the telephone and the antenna, mainly determined by the coaxial down-lead. Consequently, the signal output level and frequency from the antenna is equivalent to that radiating from a passive antenna mounted directly on the handset, subject to the antenna transmitter being a linear device. Transmitter linearity is verified with test protocols using an HP 8591 EMC analyser that also ensure there are no spurious out of band emissions.4. FiguresFigure 1. AD511-2 Active Iridium antennaFigure 2. AD511-2 Active Iridium antenna with mounting bracket and coaxial down-leadFigure 3. AD511-3 Power Break-In Box for use with +18 to +36 v DC supply.The case is hard anodised aluminium and has fixing flanges. A 40m coil of RG213U cable is shown connected to an AD511-2 active antenna (top). The handset interconnect is shown trailing from the TNC to the bottom left, whilst the flying lead for connection to 18 to 36 v DC supply is shown cutting the frame to the left.Figure 4. Schematic diagram for system connections•Mount AD511-2 active antenna with clear view of sky using bracket supplied. •Attach top end of coax down-lead to N type connector on underside of antenna. •Attach bottom end of down-lead to N type connector to the Power Break-In Box AD511-3. The down-lead must not be shortened by the user. •Attach interconnect between TNC on AD510-40 and telephone (or base station) using the antenna adapter provided with the phone. •Attach DC supply lead to +18 to +36 v DC supply (600mA max). Red lead to +supply, Blue to – supply. •Turn on Iridium telephone and log-in. • The AD511-2 should only be used with the AD511-3 Break-In Box. It is not to be used with AD511or AD510-40 Break-In Boxes.。
血管紧张素Ⅳ类似物Dihexa_对脑出血小鼠的神经保护作用及其机制
血管紧张素Ⅳ类似物Dihexa 对脑出血小鼠的神经保护作用及其机制胡燕，郑晓梅，张佳丽西南医科大学附属医院神经内科，四川泸州646000摘要：目的 观察血管紧张素Ⅳ类似物Dihexa 对脑出血小鼠的神经保护作用，并探讨作用机制。
方法 将110只C57BL /6J 小鼠随机分为假手术组、模型组、药物1组、药物2组、抑制剂组，每组22只。
模型组、药物1组、药物2组、抑制剂组采用胶原酶法制备脑出血模型，假手术组以生理盐水代替胶原酶进行注射，其余操作与其他组一致。
造模成功后，药物1组、药物2组分别予Dihexa 1.44、2.88 mg /（kg ·d ）灌胃，抑制剂组先后予wortmannin （PI3K 选择性抑制剂） 0.5 mg /（kg ·d ）、Dihexa 2.88 mg /（kg ·d ）灌胃，模型组和假手术组给予等体积生理盐水，连续3 d 。
给药结束后采用改良Garcia 评分评估神经功能缺损情况，检测脑组织含水量，HE 染色观察脑组织病理改变，ELISA 法检测脑组织中的肿瘤坏死因子α（TNF -α）、白细胞介素1β（IL -1β），TUNEL 法检测神经细胞凋亡情况，Western blotting 法检测脑组织中的凋亡相关蛋白（cleaved -Caspase3、Bcl -2）及磷脂酰激醇-3-激酶（PI3K ）/丝氨酸/苏氨酸蛋白激酶B （AKT ）通路蛋白。
结果 与假手术组相比，模型组、药物1组、药物2组、抑制剂组的脑组织含水量、脑组织中TNF -α、IL -1β、cleaved -Caspase3表达及神经细胞凋亡率增高，神经功能评分、脑组织中Bcl -2表达及p -PI3K /PI3K 、p -AKT /AKT 降低（P 均<0.05）。
模型组、药物1组、药物2组的的脑组织含水量、脑组织中TNF -α、IL -1β、cleaved -Caspase3表达及神经细胞凋亡率依次降低，神经功能评分、脑组织中Bcl -2表达及p -PI3K /PI3K 、p -AKT /AKT 依次增高（P 均<0.05）。
CrustCrawler DYNAMIXEL MX-64R 智能机械臂电机说明书
DYNAMIXEL MX-64R**Cautions- MX-64R supports RS-485 communication.- Recommended voltage of MX-64 is different with that of former RX-64.(Operating Voltage : 10~14.8V (Recommended Voltage 12V)** DESCRIPTION•DYNAMIXEL is a robot exclusive smart actuator with fully integrated DC Motor + Reduction Gearhead + Controller + Driver + Network in one DC servo module.•MX series is a new concept of DYNAMIXEL with advanced functions like precise control, PID control, 360 degree of position control and high speed communication.** CHARACTERISTIC•Advanced durability, degree of precision, and wider control zone were achieved thanks to newly applied CONTACTLESS ABSOLUTE ENCODER•360¡Æ POSITION CONTROL without dead zone•4,096 PRECISE RESOLUTION by 0.088¡Æ•SPEED CONTROL at ENDLESS TURN MODE•Reliability and accuracy were advanced in the position control through PID CONTROL•High baud rate up to 3Mbps•RS-485 LEVEL COMMUNICATION•Torque control via current sensing**The assembly structure of the MX-64 and RX-64 are the same but there some modifications to the case.**** INCLUDESDescription Qty DYNAMIXEL MX-64R 1 HORN HN05-N101 (MX Exclusive) 1 WASHER Thrust Washer 1CABLE 4P Cable 200mm 1Wrench Bolt M2.5*4 16pcs BOLT/NUTWrench Bolt M3*8 1pcsNut M2.5 18pcs** H/W SPECSProduct Name MX-64RWeight 126gDimension 40.2mm x 61.1mm x 41mmGear Ratio 200 : 1Operation Voltage (V) 10 12 14.8 Stall Torque (N.m) 5.567.3 Stall Current (A) 3.9 4.1 5.2 No Load Speed (RPM)586378 Motor Maxon MotorMinimum ControlAngleAbout 0.088¡Æ x 4,096Operating Range Actuator Mode : 360¡Æ Wheel Mode : Endless turnOperating Voltage10~14.8V (Recommended voltage : 12V) Operating Temperature -5¡ÆC ~ 80¡ÆCCommand Signal Digital PacketProtocol Half duplex Asynchronous Serial Communication (8bit,1stop, No Parity)Link (physical)RS-485 Multi Drop Bus (daisy chain type connector)ID 254 ID (0~253) Baud Rate8000bps ~ 3MbpsFeedback Functions Position, Temperature, Load, Input Voltage, Current, etc.Material Case : Engineering Plastic Gear : Full MetalPosition Sensor Contactless absolute encoderDefault ID #1 – 57600bps** After purchase, please change ID and baud rate according to your use.** COMPATIBLE PRODUCTS- Controller : CM-2+, CM-700- Interface(I/F) : USB2Dynamixel (RS-485)- NOTICE : Not compatible with the RX-64 horn. (HN05-N101 Set / T101 Set)** CONTROLLING ENVIRONMENT- Software for Dynamixel control : ROBOPLUS - Download- C/C++, C#, Labview, MATLAB, Visual Basic et. : Library – Download**Click here to download 2D and 3D drawings**Click here to go to e-Manual.。
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ALD ZnO and Al2O3 extend into pores Evaporated Au only on edge of pores
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Cross-Sectional Image of ALD Film in MCP
Glass ALD Film
100 nm ALD film visible in middle of MCP
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ALD for Resistive Coating
Target: 10-100 MΩ through MCP ZnO: conductor Al2O3: insulator ZnO/ Al2O3 alloy – tunable resistivity Tune composition and thickness of film to adjust MCP resistance Many other material combinations: – Reduce conditioning time – Reduce thermal runaway
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Questions?
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Atomic level thickness control Deposit nearly any material Precise coatings on 3-D objects
→ Can ALD Make Better
Microchannel Plates?
Large Area Photodetector
33 mm
5
MCP Structure (not to scale)
pore
1 KV
1) resistive coating (ALD) 2) emissive coating (ALD) 3) conductive coating (thermal evaporation or sputtering)
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ALD for Fabrication of MCPs
Start with porous, insulating substrate – Glass capillary plate – Anodic aluminum oxide (AAO) membrane ALD of resistive film on all surfaces (inside of pores, on faces, etc.) ALD of secondary electron emissive film Deposit metal electrodes on outer surfaces
Microchannel Plate (MCP) – Electron amplifier (x104-107)
3
Microchannel Plates (MCPs)
Conventional Fabrication: – Draw glass fiber bundle – Slice and polish – Chemical etch, heat in hydrogen Problems: – Expensive – Resistance and secondary emission properties are linked – Long conditioning process needed – Thermal runaway
Atomic Layer Deposition for Microchannel Plates
Jeffrey Elam Argonne National Laboratory September 24, 2009
Atomic Layer Deposition (ALD) Thin Film Coating Technology
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ALD for Emissive Coating
Conventional MCP’s: Alternative ALD Coatings:
SiO2
(ALD SiO2 also)
Al2O3 MgO ZnO
Many material possibilities Tune SEE along pore
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ALD MCP Fabrication
33 mm
Glass Capillary Plate
100 nm ALD ZnO/Al2O3
50 nm Evaporated Gold
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Cross-Sectional Elemental Maps of ALD MCP
SEM
Si
Zn
Al
Au
(artifact from fracture angle)